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<tw-patent-applications total-count="2518">
  <tw-patent-application no="1" publication-number="202632043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113127827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於邏輯和記憶體的鉬金屬化及填充技術</chinese-title>
        <english-title>MOLYBDENUM METALLIZATION AND FILL TECHNIQUES FOR LOGIC AND MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">C23C16/06</main-classification>
        <further-classification edition="200601120250328B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比馬拉塞提　戈皮納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHIMARASETTI, GOPINATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯尼華森　伊斯華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, EASWAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡那卡沙巴怕希　希瓦難陀　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKASABAPATHY, SIVANANDA KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德馬科　尼可拉斯　弗朗西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMARCO, NICHOLAS FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾頓　安德魯　蓋爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELTON, ANDREW GEIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謙德拉瑟哈蘭　拉密許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASEKHARAN, RAMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德彬　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DURBIN, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迦利　費德里科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLI, FEDERICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里格斯比　丹妮拉　安若斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGSBY, DANIELA ANJOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處提供用於在特徵部中沉積鉬的方法和相關設備。根據各種實施例，在一些實施例中，該些方法包括單腔室金屬化製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods and related apparatus for deposition of a molybdenum in a feature. According to various embodiments, in some embodiments, the methods include single chamber metallization processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">602:導電底部材料</p>
        <p type="p">604:介電側壁</p>
        <p type="p">606:Mo</p>
        <p type="p">608:保形Mo襯墊</p>
        <p type="p">612:塊體Mo膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2" publication-number="202631518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113138532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體流中氨和過氧化物之處理</chinese-title>
        <english-title>PROCESSING OF AMMONIA AND PEROXIDE IN LIQUID STREAMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260430B">C02F1/44</main-classification>
        <further-classification edition="202301120260430B">C02F1/66</further-classification>
        <further-classification edition="202301120260430B">C02F1/70</further-classification>
        <further-classification edition="200601320260430B">C02F101/10</further-classification>
        <further-classification edition="200601320260430B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格雷迪安特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRADIANT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔　席法　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, SIVA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那塔拉真　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATARAJAN, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達倫　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, NICHOLAS TENG LOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, JOANNE YAN TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蘭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於處理含氨和過氧化氫的流之方法和相關系統。一些實施方式關於使含有氨和過氧化氫兩者的第一流中的至少一些過氧化氫分解。可以處理所得流（例如，使用汽提器和洗滌器子系統）以使氨富集，同時，在一些情況下，使用該氨來至少部分地中和含有硫酸和過氧化氫的第二流。該第一和/或第二流可以含有和/或源自半導體處理廢水。所得中和流可以具有用於進一步過氧化氫分解的足夠高的pH。該等方法和系統可以進一步生產硫酸銨，其可以進一步被濃縮（例如，以形成固體硫酸銨鹽）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and related systems for treating ammonia- and hydrogen peroxide-containing streams are provided. Some embodiments relate to decomposing at least some hydrogen peroxide in a first stream that contains both ammonia and hydrogen peroxide. The resulting stream may be treated (e.g., using a stripper and scrubber subsystem) to enrich the ammonia while, in some instances, using the ammonia to at least partially neutralize a second stream that contains sulfuric acid and hydrogen peroxide. The first and/or second stream may contain and/or be derived from semiconductor processing wastewater. The resulting neutralized stream may have a sufficiently high pH for further hydrogen peroxide decomposition. The methods and systems may further produce ammonium sulfate, which may be further concentrated (e.g., to form a solid ammonium sulfate salt).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:含氨水性輸入流</p>
        <p type="p">102:流</p>
        <p type="p">103:流</p>
        <p type="p">104:過氧化物減少的含氨流</p>
        <p type="p">105:含硫酸水性輸入流</p>
        <p type="p">106:中和水性流</p>
        <p type="p">107:流</p>
        <p type="p">108:過氧化物減少的中和水性流</p>
        <p type="p">200:氨-酸暴露子系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="3" publication-number="202631428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>露營折疊式推拉車</chinese-title>
        <english-title>COLLAPSIBLE CART FOR CAMPING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B62B3/02</main-classification>
        <further-classification edition="200601120260422B">B62B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁曉軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁曉軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種可折疊的推車，涉及露營推車技術領域。包括推車主體，推車主體包括中框、端板、折疊式側板、蓋板以及底板，中框以及端板的底部均設置有腳輪，中框的兩側均通過端板連接折疊式側板。折疊式側板的設置，使得推車主體整體折疊後會大幅縮小佔用空間，通過卡扣配合卡槽，保證了推車主體折疊狀態後的穩定性，底板翻轉後通過定位卡扣鎖定，利於後續折疊操作的進行，中框頂杆通過按鈕卡扣可拆卸安裝於中框頂部，將中框頂杆取下後，使得推車主體的內部空間不被分隔，可以放置體積更大的物品，金屬加強杆的設置，保證了中框頂杆的結構強度，更加穩定的支撐中框，保證了推車主體的整體結構強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:推車主體</p>
        <p type="p">11:中框</p>
        <p type="p">12:端板</p>
        <p type="p">13:折疊式側板</p>
        <p type="p">14:蓋板</p>
        <p type="p">18:腳輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="4" publication-number="202632757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用乾式一次燒結製程製造包覆有陶瓷顆粒的正極顆粒之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">H01M4/505</main-classification>
        <further-classification edition="201001120260504B">H01M4/525</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用乾式一次燒結製程製造包覆有陶瓷顆粒的正極顆粒之方法，包含下列步驟：將鎳鈷錳前驅物、鋰源及LLZO(鋰鑭鋯氧化合物)前驅物置入一混合機進行混合以形成前驅混合物；然後將該前驅混合物置於一燒結爐中進行有氧燒結以得到多個正極顆粒所形成的燒結粉末；其中該鋰源在該有氧燒結中會先融化並分解成鋰氧化物，該鋰氧化物與該鎳鈷錳前驅物及該LLZO前驅物產生反應，形成多個NCM(鎳鈷錳酸鋰)顆粒及多個LLZO顆粒；該多個LLZO顆粒包覆在各該NCM顆粒外表面，整體形成該多個正極顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="5" publication-number="202632758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用濕式一次燒結製程製造包覆有玻璃相連續層的正極顆粒之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">H01M4/505</main-classification>
        <further-classification edition="201001120260504B">H01M4/525</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用濕式一次燒結製程製造包覆有玻璃相連續層的正極顆粒之方法，包含下列步驟：將鋰源、玻璃相前驅物及分散液置入一混合機中進行混合研磨，以形成第一前驅物漿料，將鎳鈷錳前驅物置入該第一前驅物漿料中並充分攪拌混合，形成第二前驅物漿料；將該第二前驅物漿料充分攪拌混合後進行乾燥，以得到前驅物粉末；將該前驅物粉末進行有氧燒結，其中該鋰源會先融化與各該鎳鈷錳前驅物產生反應分別形成多個NCM(鎳鈷錳酸鋰)顆粒；該玻璃相前驅物會形成一玻璃相層包覆在各該NCM顆粒外表面，整體形成該多個正極顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="6" publication-number="202632759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由前驅物直接製造具有陶瓷顆粒及玻璃相連續層的正極顆粒之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">H01M4/505</main-classification>
        <further-classification edition="201001120260504B">H01M4/525</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳同興達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TXD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由前驅物直接製造具有陶瓷顆粒及玻璃相連續層的正極顆粒之方法，該方法包含下列步驟：將鎳源、錳源、鈷源及分散液研磨形成鎳鈷錳混合漿料；然後將該鎳鈷錳混合漿料進行噴霧乾燥及燒結形成鎳鈷錳前驅物；再將鋰源、玻璃相前驅物、LLZO前驅物及分散液混合研磨形成第一前驅物漿料；接著將該鎳鈷錳前驅物及該分散液混合並與該第一前驅物漿料混合形成第三前驅物漿料；然後將該第三前驅物漿料進行乾燥以得到前驅物粉末；再將該前驅物粉末進行有氧燒結，形成多個鎳鈷錳顆粒及多個LLZO顆粒，其中該玻璃相前驅物會形成一玻璃相層包覆在各鎳鈷錳顆粒外表面，而該多個LLZO顆粒會分布在各該玻璃相層之外表面，整體形成該多個正極顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="7" publication-number="202631095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>暖暖包及其製備方法</chinese-title>
        <english-title>WARMER AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61F7/08</main-classification>
        <further-classification edition="201801120260429B">F24V30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孟聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三原有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITY COLLECTIVE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孟聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖時雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種暖暖包，其包括：袋體、密封件與緩發熱塊，袋體具有容置空間與開口，容置空間與開口連通；密封件用以於起始劑自開口置入容置空間後，密封開口；由第一發熱粉體與緩釋材料混合製成的緩發熱塊設置於容置空間；第一發熱粉體用以於起始劑置入容置空間後，與起始劑發生放熱反應；緩釋材料用以延緩第一發熱粉體與起始劑發生放熱反應；緩釋材料與第一發熱粉體的重量比為0.05至0.65。因此，藉由緩釋材料與第一發熱粉體混合製成緩發熱塊，有效減緩第一發熱粉體的熱量釋放速度，以控制熱量的產生，並避免暖暖包灼傷使用者的皮膚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a warmer, which includes a bag, a sealing component and a slow heating block. The bag is provided with an accommodation space and an opening, and the accommodation space communicates with the opening. The sealing component is configured to seal the opening after an initiator is placed into the accommodation space from the opening. The slow heating block made by mixing first heating powder and a sustained-release material is disposed in the accommodating space. The first heating powder is configured to react with the initiator to generate an exothermic reaction after the initiator is placed in the accommodation space. The sustained-release material is configured to delay the exothermic reaction between the first heating powder and the initiator. A weight ratio of the sustained-release material to the first heating powder is in the range from 0.05 to 0.65. Therefore, by mixing the sustained-release material with the first heating powder to form the slow heating block, the heat release rate of the first heating powder can be effectively slowed down to control the heat generation and prevent the warmer from burning the user’s skin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:暖暖包</p>
        <p type="p">110:袋體</p>
        <p type="p">112:容置空間</p>
        <p type="p">114:開口</p>
        <p type="p">120:密封件</p>
        <p type="p">130:緩發熱塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="8" publication-number="202632168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸液管之改良及其製造方法</chinese-title>
        <english-title>IMPROVED INFUSION TUBE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">F16L11/12</main-classification>
        <further-classification edition="200601120260429B">G01M3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嵩慶欣業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAKO TECH. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭哲廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHE-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸液管之改良，包含一內管及一外管，外管包覆於內管外部，並在內管外表面纏繞有一感測單元。該感測單元包含二平行設置的金屬導線，當內管發生液體洩漏時，洩漏的液體將使該二金屬導線的歐姆值產生變化。同時，於該外管的開口端設置吸水墊片，當液體洩漏發生在外管的開口端時，吸水墊片吸附洩漏的液體，使二金屬導線的歐姆值產生變化。其中感測單元與監控裝置連接，當液體洩漏發生時，監控裝置會根據歐姆值變化發出警報，幫助使用者即時檢測和處理洩漏問題，避免設備損壞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An improved infusion tube comprises an inner tube and an outer tube, with the outer tube covering the outer surface of the inner tube. A sensing unit is wound around the outer surface of the inner tube. The sensing unit consists of two parallel metal wires. When liquid leakage occurs in the inner tube, the leaked liquid causes a change in the resistance ohms between the two metal wires. Additionally, a water-absorbing pad is installed at the open end of the outer tube to absorb leaked liquid at that location, further causing a change in the ohmic value of the metal wires. The sensing unit is connected to a monitoring device. When liquid leakage occurs, the monitoring device triggers an alert based on the change in resistance, allowing users to detect and address the leakage promptly, thereby preventing equipment damage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:內管</p>
        <p type="p">13:金屬導線</p>
        <p type="p">15:夾紗補強網</p>
        <p type="p">21:外管</p>
        <p type="p">22:管套</p>
        <p type="p">23:吸水墊片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="9" publication-number="202633435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W20/42</main-classification>
        <further-classification edition="202601120260424B">H10W80/00</further-classification>
        <further-classification edition="202601120260424B">H10W72/20</further-classification>
        <further-classification edition="201101120260424B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能有效率且高產率製造的具有BSPDN構造的層積型的半導體裝置(1)。半導體裝置(1)，第1半導體晶片(5)、TSV晶片(90)、及第2半導體晶片(110)依序層積；將從第1半導體晶片(5)向TSV晶片(90)的方向作為第1方向(1011)，將與第1方向(1011)相反的方向作為第2方向(1012)時，在第1半導體晶片(5)中的第1方向(1011)側形成表面配線層(34)；在第1半導體晶片(5)中的第2方向(1012)側形成裏面電源配線層(70)；在TSV晶片(90)形成矽貫通導孔(91)；表面配線層(34)與第2半導體晶片(110)經由矽貫通導孔(91)連接；第2半導體晶片(110)具有記憶體或邏輯機能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">3:裏面電源供應配線層</p>
        <p type="p">3T:裏面電源供應配線層厚度</p>
        <p type="p">5:第1半導體晶片</p>
        <p type="p">5F:第1半導體晶片表面</p>
        <p type="p">14:晶圓層</p>
        <p type="p">14B:晶圓層裏面</p>
        <p type="p">14F:晶圓層表面</p>
        <p type="p">20:表面絕緣層</p>
        <p type="p">20F:表面絕緣層表面</p>
        <p type="p">22:表面矽層</p>
        <p type="p">24:凹槽分離部</p>
        <p type="p">26:電源配線</p>
        <p type="p">32:表面元件層</p>
        <p type="p">32T:表面元件層厚度</p>
        <p type="p">34:表面配線層</p>
        <p type="p">34F:表面配線層表面</p>
        <p type="p">34T:表面配線層厚度</p>
        <p type="p">40:TSV晶片接合層</p>
        <p type="p">60:裏面絕緣體層</p>
        <p type="p">60B:裏面絕緣體層裏面</p>
        <p type="p">64:奈米矽貫通導孔</p>
        <p type="p">64R:奈米矽貫通導孔直徑</p>
        <p type="p">70:裏面金屬層積層</p>
        <p type="p">70T:裏面金屬層積層厚度</p>
        <p type="p">90:TSV晶片</p>
        <p type="p">90B:TSV晶片裏面</p>
        <p type="p">90F:TSV晶片表面</p>
        <p type="p">90T:TSV晶片厚度</p>
        <p type="p">91:矽貫通導孔</p>
        <p type="p">92:矽基板</p>
        <p type="p">98:電容</p>
        <p type="p">110:第2半導體晶片</p>
        <p type="p">110B:第2半導體晶片裏面</p>
        <p type="p">110F:第2半導體晶片表面</p>
        <p type="p">110S:第2半導體晶片側面</p>
        <p type="p">114:模具部</p>
        <p type="p">118:第2半導體晶片接合層</p>
        <p type="p">120:焊接凸塊</p>
        <p type="p">200:實裝基板</p>
        <p type="p">300:半導體單元</p>
        <p type="p">1003:第3方向</p>
        <p type="p">1010:層積方向</p>
        <p type="p">1011:第1方向</p>
        <p type="p">1011:表面側</p>
        <p type="p">1012:第2方向</p>
        <p type="p">1012:裏面側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="10" publication-number="202633512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器封裝結構及其製造方法</chinese-title>
        <english-title>SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/136</main-classification>
        <further-classification edition="202601120260302B">H10W76/18</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐瑞鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JUI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種感測器封裝結構及其製造方法。所述感測器封裝結構包含一陶瓷基板、安裝且電性耦接於所述陶瓷基板的一感測晶片、形成於所述感測晶片的一環形支撐層、設置於所述環形支撐層的一透光片、及形成於所述陶瓷基板的一封裝體。其中，所述陶瓷基板、所述感測晶片、所述環形支撐層、及所述透光片埋置於所述封裝體之內。所述陶瓷基板的底面及所述透光片的至少部分外表面裸露於所述封裝體之外，並且所述封裝體的底緣切齊於所述陶瓷基板的所述底面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sensor package structure and a manufacturing method thereof. The sensor package structure includes a ceramic substrate, a sensor chip mounted on and electrically coupled to the ceramic substrate, a ring-shaped supporting layer formed on the sensor chip, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulant that is formed on the ceramic substrate. The ceramic substrate, the sensor chip, the ring-shaped supporting layer, and the light-permeable sheet are embedded in the encapsulant. A bottom surface of the ceramic substrate and at least part of outer surface of the light-permeable sheet are exposed from the encapsulant, and a bottom side of the encapsulant is flush with the bottom surface of the ceramic substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測器封裝結構</p>
        <p type="p">1:陶瓷基板</p>
        <p type="p">11:第一板面</p>
        <p type="p">111:晶片固定區</p>
        <p type="p">112:接合墊</p>
        <p type="p">12:第二板面</p>
        <p type="p">13:環側面</p>
        <p type="p">2:感測晶片</p>
        <p type="p">21:頂面</p>
        <p type="p">211:感測區域</p>
        <p type="p">212:承載區域</p>
        <p type="p">213:連接墊</p>
        <p type="p">22:底面</p>
        <p type="p">3:金屬線</p>
        <p type="p">4:環形支撐層</p>
        <p type="p">5:透光片</p>
        <p type="p">51:外表面</p>
        <p type="p">6:封裝體</p>
        <p type="p">61:頂緣區域</p>
        <p type="p">62:底緣</p>
        <p type="p">E:封閉空間</p>
        <p type="p">M:感測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="11" publication-number="202632847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蓄電池電源電動發電機電源供應系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H02K7/18</main-classification>
        <further-classification edition="200601120250401B">H02K47/04</further-classification>
        <further-classification edition="200601120250401B">H02P1/16</further-classification>
        <further-classification edition="201601120250401B">H02J7/02</further-classification>
        <further-classification edition="200601120250401B">H02P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅慶和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅子傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅慶和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蓄電池電源電動發電機電源供應系統，係一驅動/控制器電性連接一儲電組輸出驅動電力給一直流無刷馬達，帶動一組動能儲存裝置，並由一出力軸驅動一發電機發電，輸出電力經由一電流管控器管制電流，再由一電源分配器輸出電力給一電源供應器；且該電源分配器另一電力輸出端，電性連接一逆變器相接該儲電組補充電力，及以另一電力輸出端電性相接一充電器，將多餘電力回充該儲電組；當該電源供應器接出電源使用，該電源分配器的用電調配，藉由該電流管控器的該發電機輸出電流管制，俾使該發電機能長時處於最佳化發電狀態下，被該直流無刷馬達低能耗、低熱損維持發電運轉，增進該儲電組電源利用效益。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:儲電組</p>
        <p type="p">11:外部電能</p>
        <p type="p">12:充電器</p>
        <p type="p">13:充放電控制器</p>
        <p type="p">14:第一蓄電池組</p>
        <p type="p">15:第二蓄電池組</p>
        <p type="p">16:第三蓄電池組</p>
        <p type="p">17:電能處理器</p>
        <p type="p">20:驅動/控制器</p>
        <p type="p">21:電容器</p>
        <p type="p">22:設定器</p>
        <p type="p">30:直流無刷馬達</p>
        <p type="p">40:動能儲存裝置</p>
        <p type="p">41:主動重力圓轉體</p>
        <p type="p">410:凹形槽</p>
        <p type="p">411:配重部</p>
        <p type="p">42:傳動機構</p>
        <p type="p">420:主動皮帶輪</p>
        <p type="p">421:皮帶</p>
        <p type="p">422:被動皮帶輪</p>
        <p type="p">43:被動重力圓轉體</p>
        <p type="p">430:凹形槽</p>
        <p type="p">431:配重部</p>
        <p type="p">44:軸承座</p>
        <p type="p">50:出力軸</p>
        <p type="p">60:發電機</p>
        <p type="p">61:電流管控器</p>
        <p type="p">70:電源分配器</p>
        <p type="p">71:逆變器</p>
        <p type="p">72:顯示器</p>
        <p type="p">80:電源供應器</p>
        <p type="p">90A、90B:外部電器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="12" publication-number="202631473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移載裝置</chinese-title>
        <english-title>TRANSFERRING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">B65G47/74</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迅得機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMTEK AUTOMATION ASIA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝忠明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯富騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, FU-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳榮偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許堯鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種移載裝置，包括兩移載組，兩移載組可並列設置，兩移載組各包括一對接機構、一平移機構及一校正機構。對接機構設置於一出入口處，能用以銜接搬運裝置(如AGV)運送來的載具，且能提供暫存功能。對接機構包含第一升降機構，能用以升降載具。平移機構設置於對接機構及校正機構之間，平移機構能用以平移載具，使載具能在對接機構及校正機構之間移動。校正機構能用以升降載具，並能將載具推移至定位(拍板定位)，讓載具能準確的取放。由此，可同時進行放板及取板的作業，以不間斷方式取放載具及板件等被承載物，使其能不間斷生產，而具有較佳的稼動率，以提升產能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transferring device includes two transferring assemblies, which can be arranged side by side. Each of the two transferring assemblies includes a docking mechanism, a translation mechanism and a correction mechanism. The docking mechanism is installed at an entrance, and can be used to connect a vehicle transported by a transport device (such as AGV), and can provide a temporary storage function. The docking mechanism includes a first lifting mechanism, which can lift the vehicle. The translation mechanism is arranged between the docking mechanism and the correction mechanism. The translation mechanism can be used to translate the vehicle so that the vehicle can move between the docking mechanism and the correction mechanism. The correction mechanism can be used to lift and lower the vehicle, and can push the vehicle to a determined position (clapper position) so that the vehicle can be picked and placed accurately. As a result, the transferring device can perform plate placing and taking operations at the same time, picking up and placing carriers, plates and other carried objects in an uninterrupted manner, enabling uninterrupted production and better utilization rates, so as to increase production capacity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:對接機構</p>
        <p type="p">11:第一升降機構</p>
        <p type="p">111:第一動力源</p>
        <p type="p">112:第一升降件</p>
        <p type="p">1121:第一連接板</p>
        <p type="p">12:承接件</p>
        <p type="p">2:平移機構</p>
        <p type="p">24:承載座</p>
        <p type="p">3:校正機構</p>
        <p type="p">31:第二升降機構</p>
        <p type="p">311:第三動力源</p>
        <p type="p">312:第二升降件</p>
        <p type="p">3121:第二連接板</p>
        <p type="p">32:定位件</p>
        <p type="p">33:校正單元</p>
        <p type="p">331:第四動力源</p>
        <p type="p">332:第一推移件</p>
        <p type="p">333:第五動力源</p>
        <p type="p">334:第二推移件</p>
        <p type="p">100:移載組</p>
        <p type="p">C:輸送方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="13" publication-number="202632461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能夠安裝電池以運作的電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE CAPABLE OF OPERATING WITH BATTERY INSTALLED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F1/16</main-classification>
        <further-classification edition="200601120250401B">H05K1/09</further-classification>
        <further-classification edition="200601120250401B">H05K7/02</further-classification>
        <further-classification edition="200601120250401B">H01Q1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘文燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WEN-TSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能夠安裝一電池以運作的電子裝置，該電子裝置包括一基板、一天線、一系統接地部、一電池接地部及一電感元件。該天線設置於該基板；該系統接地部設置於該基板；該電池接地部經配置以耦接該電池的一負極；其中該電池接地部與該系統接地部彼此分離，且該電感元件耦接於該電池接地部與該系統接地部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device capable of operating with a battery installed, the electronic device comprising a substrate, an antenna, a system ground portion, a battery ground portion, and an inductor element. The antenna is disposed on the substrate; the system ground portion is disposed on the substrate; the battery ground portion is configured to be coupled to a negative terminal of the battery; wherein the battery ground portion and the system ground portion are separated from each other, and the inductor element is coupled between the battery ground portion and the system ground portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:饋入部</p>
        <p type="p">202:基板</p>
        <p type="p">204:天線</p>
        <p type="p">205:天線接地部</p>
        <p type="p">206:天線淨空區</p>
        <p type="p">300:電子裝置</p>
        <p type="p">302:電池容納區</p>
        <p type="p">310:正極觸件</p>
        <p type="p">312:負極觸件</p>
        <p type="p">314:電池接地部</p>
        <p type="p">315:天線接地部</p>
        <p type="p">316:電感元件</p>
        <p type="p">317:延伸接地部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="14" publication-number="202631034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鞋子、繩帶扣具組件、及單體式調整扣</chinese-title>
        <english-title>SHOE, ROPE BUCKLE ASSEMBLY, AND SINGLE ADJUSTMENT BUCKLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250125B">A43C11/00</main-classification>
        <further-classification edition="200601120250125B">A43C11/20</further-classification>
        <further-classification edition="200601120250125B">A44B11/16</further-classification>
        <further-classification edition="200601120250125B">A44B11/00</further-classification>
        <further-classification edition="200601120250125B">A43B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣扣具工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIFCO TAIWAN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪駿維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種鞋子、繩帶扣具組件、及單體式調整扣。所述單體式調整扣包含兩個板體、一入繩端、與一出繩端。所述單體式調整扣的內部形成有至少一個穿繩通道，其具有一容置槽、及位於所述出繩端並連通於所述容置槽的一定位槽。所述容置槽具有位於所述入繩端的一入繩口、及凹設於一個所述板體且鄰近於所述出繩端的一出繩口。所述定位槽的槽口連通於所述出繩口，並且所述定位槽的槽寬自所述槽口朝向所述槽底的一固繩方向呈漸縮狀。所述入繩口與所述定位槽之間定義有一入繩方向，其與所述固繩方向相夾有介於100度～170度之間的一夾角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a shoe, a rope buckle assembly, and a single adjustment buckle. The single adjustment buckle includes two plates, a rope entrance end, and a rope exit end. The single adjustment buckle has at least one rope channel therein. The at least one rope channel has an accommodating slot and a positioning slot that is located at the rope exit end and that is in spatial communication with the accommodating slot. The accommodating slot has an entrance located at the rope entrance end and an exit that is recessed in one of the two plates and that is arranged adjacent to the rope exit end. An opening of the positioning slot is in spatial communication with the exit, and a width of the positioning slot gradually decreases in a rope fixing direction from the opening toward a bottom of the positioning slot. A rope entering direction is defined between the entrance and positioning slot, and an angle between the rope entering direction and the rope fixing direction is within a range from 100 degrees to 170 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:單體式調整扣</p>
        <p type="p">1:第一板體</p>
        <p type="p">2:第二板體</p>
        <p type="p">4:分隔壁</p>
        <p type="p">5:入繩端</p>
        <p type="p">6:出繩端</p>
        <p type="p">61:導引壁</p>
        <p type="p">611:轉向區段</p>
        <p type="p">612:引導區段</p>
        <p type="p">7:穿繩通道</p>
        <p type="p">71:容置槽</p>
        <p type="p">711:入繩口</p>
        <p type="p">712:出繩口</p>
        <p type="p">72:定位槽</p>
        <p type="p">721:槽口</p>
        <p type="p">722:槽底</p>
        <p type="p">723:定位壁</p>
        <p type="p">724:傾斜壁</p>
        <p type="p">D1:入繩方向</p>
        <p type="p">D2:固繩方向</p>
        <p type="p">σ:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="15" publication-number="202632836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓補償系統及不斷電系統</chinese-title>
        <english-title>VOLTAGE COMPENSATION SYSTEM AND UNINTERRUPTIBLE POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02J7/34</main-classification>
        <further-classification edition="200601120250602B">H02J9/04</further-classification>
        <further-classification edition="200701120250602B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鴻杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃弘宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝奕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秋豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案關於一種電壓補償系統，第一切換裝置用以切換第一交流輸入源及第二交流輸入源，電壓轉換裝置經由第一切換裝置，選擇性地接收第一交流輸入源或第二交流輸入源，且轉換為直流電壓，直流匯流排用以傳送直流電壓。能量緩衝裝置包含雙向電壓轉換裝置及能量槽，雙向電壓轉換裝置的一端連接於直流匯流排，能量槽連接於雙向電壓轉換裝置的另一端，於第一切換裝置切換第一交流輸入源及第二交流輸入源的停滯期間，操作雙向電壓轉換裝置，讓能量槽補償直流匯流排的直流電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a voltage compensation system. The first AC input source and the second AC input source are switched by the first switching device. The voltage conversion device selectively receives the first AC input source or the second AC input source to a DC voltage through the first switching device. The DC bus transmits the DC voltage. The energy buffering device includes a bidirectional voltage conversion device and an energy tank. One side of the bidirectional voltage conversion device is connected with the DC bus. The other side of the bidirectional voltage conversion device is connected with the energy tank. During the transition period when the first AC input source and the second AC input source are switched through the first switching device switches, the bidirectional voltage conversion device is operated to compensate the DC voltage of the DC bus by the energy tank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電壓補償系統</p>
        <p type="p">AC1:第一交流輸入源</p>
        <p type="p">AC2:第二交流輸入源</p>
        <p type="p">2:第一切換裝置</p>
        <p type="p">21:第一切換元件</p>
        <p type="p">22:第二切換元件</p>
        <p type="p">3:電壓轉換裝置</p>
        <p type="p">4:直流匯流排</p>
        <p type="p">V1:直流電壓</p>
        <p type="p">5:直流/直流轉換電路</p>
        <p type="p">6:備援裝置</p>
        <p type="p">61:直流/直流轉換器</p>
        <p type="p">62:電池模組</p>
        <p type="p">63:第二切換裝置</p>
        <p type="p">8:能量緩衝裝置</p>
        <p type="p">81:能量槽</p>
        <p type="p">V2:充電電壓</p>
        <p type="p">82:雙向電壓轉換裝置</p>
        <p type="p">9:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="16" publication-number="202632964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低環境光強度的主動補光影像擷取裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">H04N23/70</main-classification>
        <further-classification edition="202301120250401B">H04N23/56</further-classification>
        <further-classification edition="202001120250401B">G01S17/02</further-classification>
        <further-classification edition="202001120250401B">G01S17/89</further-classification>
        <further-classification edition="202401120250401B">G06T5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>承奕科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊之逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明低環境光強度的主動補光影像擷取裝置，供在雜物干擾的低環境光強度環境擷取預定距離內之目標物體影像，包括：高頻脈衝光源，所發光束可供照射至預定距離；光學影像擷取器，具有光接收器、及頻率高於1/15秒複數倍數的電子快門，藉此控制曝光時段，並輸出一畫面幀的影像資料訊號；影像處理器，供接收影像資料訊號；驅動訊號產生器，用以控制發光時段，並同步輸出控制信號至影像處理器；以及影像處理器依據控制信號計算發光時段，並且加計一雜物排除時段，用以在所接收的畫面幀中，排除對應於發光時段和雜物排除時段的畫面幀而進行疊加。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:高頻脈衝光源</p>
        <p type="p">2:光學影像擷取器</p>
        <p type="p">20:光接收器</p>
        <p type="p">22:電子快門</p>
        <p type="p">3:驅動訊號產生器</p>
        <p type="p">4:影像處理器</p>
        <p type="p">40:比較器</p>
        <p type="p">50:影像資料訊號</p>
        <p type="p">56:畫面資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="17" publication-number="202632010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵錠及其製造方法</chinese-title>
        <english-title>IRON INGOTS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">C22B1/242</main-classification>
        <further-classification edition="200601120250124B">C22B1/248</further-classification>
        <further-classification edition="200601120250124B">B22D7/00</further-classification>
        <further-classification edition="202201120250124B">B09B3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中仁有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHONG REN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鐘仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵錠，其成份、包含：一第一鐵原料、一第二鐵原料及一膠結材，其中，該第一鐵原料重量百分比為83~95%，該第二鐵料重量百分比為1.9~8%，該膠結材重量百分比為1~8%。一種鐵錠製造方法，包含：一混拌步驟，將一第一鐵原料及一第二鐵原料進行混拌，使其均勻混合，且該第一鐵原料及該第二鐵原料之粒徑介於0.01~5mm；一膠結步驟，將該混拌步驟之原料與一膠結材在溫度40~100度C進行膠結黏著；一造塊步驟，利用造塊機進行擠壓造塊形成一鐵錠；及一乾燥步驟，將該鐵錠至於在一乾燥溫度及一乾燥時間進行除濕乾燥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An iron ingot and the method manufacturing iron ingots are disclosed. The iron ingot includes: a first iron raw material, a second iron raw material and a cementing material, wherein the weight percentage of the first iron raw material is 83~95%, and the weight percentage of the second iron material is 1.9 ~ 8%, the weight percentage of the cementing material is 1~8%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S0):混拌步驟</p>
        <p type="p">(S1):膠結步驟</p>
        <p type="p">(S2):造塊步驟</p>
        <p type="p">(S3):乾燥步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="18" publication-number="202632479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控顯示驅動方法以及觸控顯示驅動電路</chinese-title>
        <english-title>TOUCH DISPLAY DRIVING METHOD AND TOUCH DISPLAY DRIVING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">G06F3/041</main-classification>
        <further-classification edition="200601120250124B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭哲尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHE TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李乃誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NAI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪家裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇文弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宥盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOU SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出觸控顯示驅動方法以及觸控顯示驅動電路。觸控顯示驅動方法包括以下步驟：根據控制訊號決定驅動觸控顯示面板的多個閘極線的多個顯示驅動期間；根據控制訊號選擇在多個顯示驅動期間之間的多個非顯示驅動期間中的一部份執行多個觸控掃描；以及判斷在觸控顯示面板中被掃描的多個觸控電極的至少其中之一是否與分別在多個顯示驅動期間中驅動轉為停止驅動的多個閘極線的其中之一在觸控顯示面板上重疊，以調整多個觸控掃描的至少其中之一至多個非顯示驅動期間的其他部份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch display driving method and a touch display driving circuit. The touch display driving method includes the following steps: determining a plurality of display driving periods for driving a plurality of gate lines of a touch display panel according to a control signal; selecting a part of a plurality of non-display driving periods between the plurality of display driving periods to perform a plurality of touch scans according to the control signal; and determining whether at least one of a plurality of touch electrodes scanned in the touch display panel overlaps with one of a plurality of gate lines on the touch display panel whose driving is switched to stop driving during the plurality of display driving periods, so as to adjust at least one of the plurality of touch scans to other parts of the plurality of non-display driving periods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸控顯示驅動電路</p>
        <p type="p">110:顯示驅動單元</p>
        <p type="p">120:觸控驅動單元</p>
        <p type="p">200:觸控顯示面板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="19" publication-number="202632462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>箱體鉸鏈及顯示器</chinese-title>
        <english-title>CASING HINGE AND DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G06F1/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優派國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIEWSONIC INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡家欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIA-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈崇賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種箱體鉸鏈，包含二支架及二連桿。每一個連桿均與該二支架連接，形成連桿機構。該二支架經由該二連桿在一參考平面上作動使該二支架的二箱體固定面相對旋轉。該二箱體固定面垂直於該參考平面。一種顯示器，包含二箱體、二顯示模組及前述箱體鉸鏈。該箱體鉸鏈連接該二箱體。該二顯示模組分別組裝至該二箱體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A casing hinge includes two brackets and two links. Each link is connected to the two brackets, forming a linkage mechanism. The two brackets move on a reference plane through the two links so that two casing fixing surfaces of the two brackets relatively rotate. The two casing fixing surfaces are perpendicular to the reference plane. A display includes two casings, two display modules, and the above casing hinge. The casing hinge connects the two casings. The two display modules are assembled to the two casings respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">42:第一箱體</p>
        <p type="p">422:支柱</p>
        <p type="p">44:第二箱體</p>
        <p type="p">442:支柱</p>
        <p type="p">46:箱體鉸鏈</p>
        <p type="p">462:第一支架</p>
        <p type="p">464:第二支架</p>
        <p type="p">466:第一連桿</p>
        <p type="p">468:第二連桿</p>
        <p type="p">470:第一軸件</p>
        <p type="p">472:第二軸件</p>
        <p type="p">474:第一凸輪件</p>
        <p type="p">476:第二凸輪件</p>
        <p type="p">478:彈力件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="20" publication-number="202633513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器封裝結構</chinese-title>
        <english-title>SENSOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/136</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭展銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種感測器封裝結構，其包含一基板、安裝於所述基板的一感測晶片、連接所述基板與所述感測晶片的多條金屬線、形成於所述基板且圍繞於所述感測晶片與多條所述金屬線的外側的一模製封裝體、形成於所述模製封裝體的頂平面的一環形支撐層、設置於所述環形支撐層的一透光片、及以點膠方式成形於所述模製封裝體的點膠斜面的一封裝膠體。所述點膠斜面與所述基板之間形成有小於90度的夾角。所述封裝膠體呈環形且包覆於所述環形支撐層的外側與所述透光片的外側，所述封裝膠體的環側緣共平面於所述模製封裝體的外側緣與所述基板的環側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sensor package structure, which includes a substrate, a sensor chip mounted on the substrate, a plurality of metal wires connected to the substrate and the sensor chip, a molding compound formed on the substrate and surrounding the sensor chip and the metal wires, a ring-shaped supporting layer formed on a flat top surface of the molding compound, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulating adhesive that is formed on a slanting surface of the molding compound in a dispensing manner. The slanting surface and the substrate have an angle therebetween that is less than 90 degrees. The encapsulating adhesive is ring-shaped and covers an outer side of the ring-shaped supporting layer and an outer side of the light-permeable sheet, and a surrounding lateral side of the encapsulating adhesive is coplanar with an outer lateral side of the molding compound and a surrounding lateral surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測器封裝結構</p>
        <p type="p">1:基板</p>
        <p type="p">11:第一板面</p>
        <p type="p">111:晶片固定區</p>
        <p type="p">112:接合墊</p>
        <p type="p">12:第二板面</p>
        <p type="p">13:環側面</p>
        <p type="p">2:感測晶片</p>
        <p type="p">21:頂面</p>
        <p type="p">211:感測區域</p>
        <p type="p">212:承載區域</p>
        <p type="p">213:連接墊</p>
        <p type="p">22:底面</p>
        <p type="p">3:金屬線</p>
        <p type="p">4:模製封裝體</p>
        <p type="p">41:內側緣</p>
        <p type="p">42:外側緣</p>
        <p type="p">43:頂平面</p>
        <p type="p">44:點膠斜面</p>
        <p type="p">5:環形支撐層</p>
        <p type="p">6:透光片</p>
        <p type="p">7:封裝膠體</p>
        <p type="p">71:第一接合段</p>
        <p type="p">72:第二接合段</p>
        <p type="p">73:第三接合段</p>
        <p type="p">731:頂緣</p>
        <p type="p">74:環側緣</p>
        <p type="p">E:封閉空間</p>
        <p type="p">S:環形凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="21" publication-number="202632025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙傾角大面積準直鍍膜設備以及載物模組</chinese-title>
        <english-title>TILTED LARGE AREA MANIPULATOR FOR COLLIMATED DEPOSITION AND CARRY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/04</main-classification>
        <further-classification edition="200601120260302B">C23C14/22</further-classification>
        <further-classification edition="200601120260302B">C23C14/50</further-classification>
        <further-classification edition="200601120260302B">C23C14/54</further-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎧柏科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADNANOTEK CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種雙傾角大面積準直鍍膜設備以及載物模組。雙傾角大面積準直鍍膜設備包括一基座模組、一轉動模組以及一載物模組。轉動模組能活動地設置於該基座模組。載物模組包括一模組主體、一載物組件、一第一驅動組件以及一第二驅動組件。模組主體連接於該轉動模組，該模組主體具有一容置空間、一第一開口以及多個遮擋元件，該容置空間與該第一開口連通，該多個遮擋元件被配置成用於開啟或遮蔽該第一開口。該載物組件被配置成用於固持一物件。該至少一第一驅動組件被配置成用於帶動該載物組件朝一第一方向或一第二方向進行往復式位移。該第二驅動組件被配置成用於帶動該載物組件以一第一軸向為中心進行轉動。藉此，本發明之雙傾角大面積準直鍍膜設備以及載物模組可使物件於傾角鍍膜時所鍍之膜厚能更加均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tilted large area manipulator for collimated deposition and carry module are provided. The dual-tilt large-area collimated coating apparatus includes a base module, a rotation module, and a carry module. The rotation module is movably disposed on the base module. The carry module includes a module body, a carrier component, a first driving component, and a second driving component. The module body is connected to the rotation module and has a receiving space, a first opening, and a plurality of shielding elements. The receiving space communicates with the first opening, and the plurality of shielding elements are configured to open or shield the first opening. The carrier component is configured to hold an object. The first driving component is configured to drive the carrier component to perform reciprocating displacement in a first direction or a second direction. The second driving component is configured to drive the carrier component to rotate about a first axis. By utilizing the above design, the dual-tilt large-area collimated coating apparatus and the carry module enable a more uniform film thickness during tilted-angle coating processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:雙傾角大面積準直鍍膜設備</p>
        <p type="p">1:基座模組</p>
        <p type="p">10:底座組件</p>
        <p type="p">11:阻隔組件</p>
        <p type="p">2:轉動模組</p>
        <p type="p">20:動力組件</p>
        <p type="p">21:連動組件</p>
        <p type="p">D1:模組主體</p>
        <p type="p">D10:容置空間</p>
        <p type="p">D13:第二開口</p>
        <p type="p">D2:載物組件</p>
        <p type="p">D3:第一驅動組件</p>
        <p type="p">D4:第二驅動組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="22" publication-number="202632178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑動掛架</chinese-title>
        <english-title>SLIDING RACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">F16M11/04</main-classification>
        <further-classification edition="200601120250603B">F16M11/18</further-classification>
        <further-classification edition="200601120250603B">F16M13/02</further-classification>
        <further-classification edition="200601120250603B">G09F9/302</further-classification>
        <further-classification edition="200601120250603B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓沛辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, PEICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑動掛架，適用於拼接多個顯示模組，並用於掛設在橫桿。滑動掛架包括第一物件、第一調整組件、第二調整組件、第二物件以及滑動組件。第一物件連接顯示模組。第一調整組件及第二調整組件的一端連接於第一物件。第二物件沿第一方向可移動地連接於第一調整組件的另一端，並沿第二方向可移動地連接於第二調整組件的另一端。第二方向相異於第一方向。滑動組件連接於第二物件。第一調整組件與橫桿之間具有間隙。滑動組件適於滑動接觸橫桿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sliding rack is adapted to splicing multiple display modules and hanging on a crossbar. The sliding rack includes a first object, a first adjustment component, a second adjustment component, a second object and a sliding component. The first object is connected to the display module. One ends of the first adjustment component and the second adjustment component are connected to the first object. The second object is movably connected to other end of the first adjustment component along a first direction, and is movably connected to other end of the second adjustment component along a second direction. The second direction is different from the first direction. The sliding component is connected to the second object. A gap is provided between the first adjustment component and the crossbar. The sliding component is adapted to slide into contact with the crossbar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:顯示模組</p>
        <p type="p">60:橫桿</p>
        <p type="p">100:滑動掛架</p>
        <p type="p">110:第一物件</p>
        <p type="p">111:第一立壁</p>
        <p type="p">112:第一橫壁</p>
        <p type="p">120:第一調整組件</p>
        <p type="p">121:第一螺栓</p>
        <p type="p">121a:第一螺紋部</p>
        <p type="p">121b:第一調整部</p>
        <p type="p">122:第一螺帽</p>
        <p type="p">123:第二螺帽</p>
        <p type="p">124:第三螺帽</p>
        <p type="p">130:第二調整組件</p>
        <p type="p">131:第二螺栓</p>
        <p type="p">131a:第二螺紋部</p>
        <p type="p">131b:第二調整部</p>
        <p type="p">132:第四螺帽</p>
        <p type="p">133:第五螺帽</p>
        <p type="p">134:第六螺帽</p>
        <p type="p">140:第二物件</p>
        <p type="p">141:第二立壁</p>
        <p type="p">142:第二橫壁</p>
        <p type="p">150:滑動組件</p>
        <p type="p">151:基座</p>
        <p type="p">153:滑動件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="23" publication-number="202632864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於電壓轉換器的功率級控制電路</chinese-title>
        <english-title>POWER STAGE CONTROL CIRCUIT APPLIED TO VOLTAGE CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/156</main-classification>
        <further-classification edition="200601120250602B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶豪科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊曜瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於一電壓轉換器的功率級控制電路包含有電流感測電路、控制電路以及驅動電路，其中電壓轉換器包含有第一開關與第二開關。電流感測電流用以感測與第一開關相關的電流，並將該電流轉換為感測電壓。控制電路根據感測電壓、第二開關驅動訊號、零交越偵測電壓、補償電壓以及參考電壓來進行多個第一邏輯操作以產生調變訊號以及決定訊號，以供分別控制第一開關與第二開關的開啟與關閉以及動態地設置一電感的電感峰值電流。驅動電路根據調變訊號與決定訊號進行多個第二邏輯操作以產生一第一開關驅動訊號與第二開關驅動訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power stage control circuit applied to a voltage converter includes a current sensing circuit, a control circuit, and a driving circuit, wherein the voltage converter includes a first switch and a second switch. The current sensing circuit senses a current associated with the first switch, and converts current into a sensing voltage. The control circuit performs multiple first logical operations according to the sensing voltage, a second switch driving signal, a zero crossing detection voltage, a compensation voltage, and a reference voltage, in order to generate a modulation signal and a determination signal, for controlling turn-on and turn-off of the first switch and the second switch and dynamically setting an inductor peak current of an inductor, respectively. The driving circuit performs multiple second logical operations according to the modulation signal and the determination signal in order to generate a first switch driving signal and the second switch driving signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:功率級</p>
        <p type="p">100:功率級控制電路</p>
        <p type="p">102:高側電流感測電路</p>
        <p type="p">104:錯誤放大器</p>
        <p type="p">106:斜率補償電路</p>
        <p type="p">108:減法電路</p>
        <p type="p">110:控制電路</p>
        <p type="p">112:驅動電路</p>
        <p type="p">V&lt;sub&gt;FB&lt;/sub&gt;:回授電壓</p>
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;,V&lt;sub&gt;PKmin_ref&lt;/sub&gt;:參考電壓</p>
        <p type="p">V&lt;sub&gt;EA&lt;/sub&gt;:錯誤放大器電壓</p>
        <p type="p">V&lt;sub&gt;SC&lt;/sub&gt;:斜率補償電壓</p>
        <p type="p">V&lt;sub&gt;CP&lt;/sub&gt;:補償電壓</p>
        <p type="p">V&lt;sub&gt;LSG&lt;/sub&gt;:低側開關驅動訊號</p>
        <p type="p">V&lt;sub&gt;ZCD&lt;/sub&gt;:零交越偵測電壓</p>
        <p type="p">V&lt;sub&gt;HSEN&lt;/sub&gt;:高側感測電壓</p>
        <p type="p">V&lt;sub&gt;MOD&lt;/sub&gt;:調變訊號</p>
        <p type="p">V&lt;sub&gt;PKmin_Det&lt;/sub&gt;:決定訊號</p>
        <p type="p">V&lt;sub&gt;HSG&lt;/sub&gt;:高側開關驅動訊號</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓</p>
        <p type="p">SW&lt;sub&gt;HS&lt;/sub&gt;:高側開關</p>
        <p type="p">SW&lt;sub&gt;LS&lt;/sub&gt;:低側開關</p>
        <p type="p">V&lt;sub&gt;SW&lt;/sub&gt;:電壓</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">N1:節點</p>
        <p type="p">L:電感</p>
        <p type="p">I&lt;sub&gt;L&lt;/sub&gt;:電感電流</p>
        <p type="p">C&lt;sub&gt;O&lt;/sub&gt;:輸出電容</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;,R&lt;sub&gt;2&lt;/sub&gt;:電阻</p>
        <p type="p">NF:回授節點</p>
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓</p>
        <p type="p">I&lt;sub&gt;LOAD&lt;/sub&gt;:負載電流</p>
        <p type="p">R&lt;sub&gt;LOAD&lt;/sub&gt;:負載電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="24" publication-number="202632301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針承載組件之製程</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G01R3/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勤輝科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢國鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種探針承載組件之製程，其係利用模塑成型設備執行並包含承載基部成型步驟及定位框部成型步驟，承載基部成型步驟係於模塑成型設備以基部模具模塑成型平板狀的承載基部，該承載基部上具有陣列排列的多數探針孔，而定位框部成型步驟係將承載基部置入框部模具，透過模塑成形設備於承載基部的外圍模塑成型定位框部，藉由承載基部成型步驟先成型出厚度差異較小之承載基部，以提高所述承載基部的探針孔之尺寸精度，再透過進行定位框部成型步驟成型定位框部，藉此能在承載基部的探針孔具備有一定尺寸精度下，確實降低所述探針承載組件的製造成本及製造時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="25" publication-number="202633429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅仕瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宗彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZUNG-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露提供一種半導體結構及其形成方法。半導體結構包括導電結構。導電結構貫穿內連線結構以及其上設置有內連線結構的基底。導電結構包括貫穿導電通孔以及環狀導電通孔。貫穿導電通孔在垂直方向上貫穿內連線結構以及基底。環狀導電通孔設置在內連線結構中且環繞貫穿導電通孔。內連線結構包括配置在環狀導電通孔上且與環狀導電通孔的頂面直接接觸的導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor structure and a method for forming the same. The semiconductor structure includes a conductive structure penetrating an interconnection structure and a substrate where the interconnection structure is disposed thereon. The conductive structure includes a through-conductive via penetrating the interconnection structure and the substrate in a vertical direction and a ring-type conductive via disposed in the interconnection structure and surrounding the through-conductive via. The interconnection structure includes a conductive layer configured on the ring-type conductive via and being directly in contact with a top surface of the ring-type conductive via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">112a:第一介電材料層</p>
        <p type="p">122b:第一介電材料層</p>
        <p type="p">132:第一介電材料層</p>
        <p type="p">122c2:第二部分</p>
        <p type="p">124a:第二介電材料層</p>
        <p type="p">134:第二介電材料層</p>
        <p type="p">124b2:第二部分</p>
        <p type="p">150:絕緣層</p>
        <p type="p">CL1:導電層</p>
        <p type="p">ICS1:內連線結構</p>
        <p type="p">RV1:環狀導電通孔</p>
        <p type="p">TSV1:貫穿導電通孔</p>
        <p type="p">TSV1a:上部分</p>
        <p type="p">TSV1b:下部分</p>
        <p type="p">Wa、Wb:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="26" publication-number="202631238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濾網裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">B01D29/01</main-classification>
        <further-classification edition="200601120250124B">B01D29/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅為有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU WEI TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡臨君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種濾網裝置，包含一架體、一過濾單元與至少一中間物；該架體具有相對設置的二支撐架；該過濾單元包括一框體及一濾材，該框體架設於該二支撐架之間，該濾材設置於該框體中；該至少一中間物設置於該架體之其中一該支撐架與該框體之間，其中該至少一中間物與一該支撐架之間以一熱塑性材料為黏結，該至少一中間物與該框體之間以一膠狀材料為黏結；當需要分離該過濾單元與該支撐架時，對該熱塑材料加熱，使該框體與一該支撐架之間形成滑動接觸，即可抽取出該至少一中間物使該過濾單元與該架體順利分離，從而實現對該過濾單元進行拆卸或回收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:濾網裝置</p>
        <p type="p">10:架體</p>
        <p type="p">11:支撐架</p>
        <p type="p">12:扣槽</p>
        <p type="p">12a:第一接合面</p>
        <p type="p">20:過濾單元</p>
        <p type="p">21:框體</p>
        <p type="p">21a:第二接合面</p>
        <p type="p">22:濾材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="27" publication-number="202631419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>汽車座椅的通風裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">B60N2/56</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元山科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉賢文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳展易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種汽車座椅的通風裝置，該汽車座椅界定出一安裝空間並具有多個連通於該安裝空間的通風孔。該汽車座椅的通風裝置包含一適用於設置在該安裝空間的第一風扇，及至少一適用於設置在該安裝空間且資訊連接該第一風扇的第二風扇。該第一風扇包括一運作本體，及一連接該運作本體且用以產生一驅動該運作本體運轉而對所述通風孔導入氣流之驅動訊號的控制模組。該第二風扇包括一用以運轉而對所述通風孔導入氣流的運轉模組，及一連接於該運轉模組與該控制模組間，且用以將該驅動訊號傳遞至該運轉模組，使得該運轉模組與該運作本體同步轉動的連接線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一風扇</p>
        <p type="p">11:運作本體</p>
        <p type="p">12:控制模組</p>
        <p type="p">2:第二風扇</p>
        <p type="p">21:運轉模組</p>
        <p type="p">22:連接線</p>
        <p type="p">9:汽車座椅</p>
        <p type="p">90:安裝空間</p>
        <p type="p">91:座墊</p>
        <p type="p">910:通風孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="28" publication-number="202633045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容置模組及包含其之電子裝置</chinese-title>
        <english-title>ACCOMMODATION MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">H05K5/02</main-classification>
        <further-classification edition="202501120250603B">H05K5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNER ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游彥尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YEN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種容置模組，用於整合在一電子裝置的一機箱內。在高階機型的應用中，本發明之容置模組包括一下層容置單元以及一上層容置單元，其中該下層容置單元和該上層容置單元皆可容置N個抽取式電子模組。另一方面，在低階機型的應用中，可以變更(減少)該上層容置單元的容置空間，使得該上層容置單元僅可容置R個(R＜N)抽取式電子模組。進一步地，在其它應用中，還可以變更該上層容置單元的容置空間，使得該上層容置單元可以容置至少一個PCIE擴充卡及/或至少一個抽取式電子模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an accommodation module for being integrated in a housing case of an electronic device. In an application of high-level device, the accommodation module comprises a lower layer unit and an upper layer unit, in which the two units are all able to receive N numbers of removable electronic modules. On the other hand, in an application of low-level device, a total number of the upper layer unit’s accommodation spaces can be changed (reduced), thereby limiting the upper layer unit capable of merely receiving R (R＜N) numbers of removable electronic modules. Further, in other applications, the accommodation spaces of the upper layer unit can also be rearranged, such hat the upper layer unit is able to receive at least one PCIE expansion card and/or at least one removable electronic module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容置模組</p>
        <p type="p">11:第一分隔板</p>
        <p type="p">12:第二分隔板</p>
        <p type="p">13:第一板件</p>
        <p type="p">14:第二板件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="29" publication-number="202631734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂、樹脂組成物、硬化層以及蝕刻方法</chinese-title>
        <english-title>RESIN, RESIN COMPOSITION, CURED LAYER AND ETCHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08F8/02</main-classification>
        <further-classification edition="200601120250402B">C08F12/24</further-classification>
        <further-classification edition="200601120250402B">C08L25/18</further-classification>
        <further-classification edition="200601120250402B">C08K5/06</further-classification>
        <further-classification edition="200601120250402B">C08K5/101</further-classification>
        <further-classification edition="200601120250402B">C09D125/18</further-classification>
        <further-classification edition="201801120250402B">C09D7/45</further-classification>
        <further-classification edition="200601120250402B">C09D5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新應材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED ECHEM MATERIALS COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱于真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許庭睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TING-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣昀儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YUN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許翔林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁巍鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, WEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂、樹脂組成物、硬化層以及蝕刻方法。樹脂包括由下述式（A）表示的結構單元。在樹脂中，丙炔基的含量不為0。在R        &lt;sup&gt;1&lt;/sup&gt;及R        &lt;sup&gt;2&lt;/sup&gt;表示的氫及丙炔基中，氫與丙炔基的莫耳比為90:10至55:45。        &lt;br/&gt;&lt;img align="absmiddle" height="151px" width="205px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式（A）中，R        &lt;sup&gt;1&lt;/sup&gt;及R        &lt;sup&gt;2&lt;/sup&gt;各自表示氫或丙炔基，*表示鍵結位置。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin, a resin composition, a cured layer and an etching method are provided. The resin includes a structural unit represented by the following Formula (A). In the resin, an amount of the propynyl group is not zero. Among the hydrogen and the propynyl group represented by R        &lt;sup&gt;1&lt;/sup&gt;and R        &lt;sup&gt;2&lt;/sup&gt;, a molar ratio of the hydrogen and the propynyl group is 90:10 to 55:45.        &lt;br/&gt;&lt;img align="absmiddle" height="169px" width="245px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;In Formula (A), R        &lt;sup&gt;1&lt;/sup&gt;and R        &lt;sup&gt;2&lt;/sup&gt;each represent hydrogen or propynyl group, and * represents a bonding position.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="30" publication-number="202632774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電芯及無框架電池</chinese-title>
        <english-title>BATTERY CELL AND FRAMELESS BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250124B">H01M50/102</main-classification>
        <further-classification edition="202101120250124B">H01M50/264</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫俊義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHUN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇鈺修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳英堉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YING-YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電芯，包括一硬質殼體、一極捲(捲繞或堆疊方式)以及多個固定結構。極捲設置於硬質殼體內。多個固定結構分離於彼此地設置於硬質殼體且凸出於硬質殼體的至少一表面。一種無框架電池亦被提及。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery cell includes a hard casing, a jelly roll (winding or stacking type) and multiple fixing structures. The jelly roll is disposed inside the hard casing. The multiple fixing structures which are separated from each other are disposed on the hard casing and are protruded from the at least one surface of the hard casing. A frameless battery is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無框架電池</p>
        <p type="p">110:電芯</p>
        <p type="p">111:硬質殼體</p>
        <p type="p">113:極捲</p>
        <p type="p">115:固定結構</p>
        <p type="p">1111:表面</p>
        <p type="p">1151:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="31" publication-number="202632845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙轉子馬達結構</chinese-title>
        <english-title>DUAL-ROTOR MOTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02K1/22</main-classification>
        <further-classification edition="200601120250602B">H02K5/16</further-classification>
        <further-classification edition="200601120250602B">H02K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昱勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, JIA-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種雙轉子馬達結構。雙轉子馬達結構包括第一轉子、第二轉子以及多個組合式定子。第二轉子與第一轉子徑向設置。此些組合式定子徑向設置於第一轉子與第二轉子之間，且此些組合式定子兩兩沿切線方向相接。各組合式定子包含內定子、中定子以及外定子。中定子連接於內定子與外定子之間且連接於相鄰的另二中定子之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-rotor motor structure is provided. The dual-rotor motor structure includes a first rotor, a second rotor and a plurality of combined stators. The second rotor is arranged radially to the first rotor. The combined stators are radially arranged between the first rotor and the second rotor, and the combined stators are connected in pairs along tangential direction. Each combined stator includes an inner stator, a middle stator and an outer stator. The middle stator is connected between the inner stator and the outer stator, and is connected between another two adjacent middle stators.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙轉子馬達</p>
        <p type="p">110:第一轉子</p>
        <p type="p">120:第二轉子</p>
        <p type="p">130:組合式定子</p>
        <p type="p">131:內定子</p>
        <p type="p">132:中定子</p>
        <p type="p">133:外定子</p>
        <p type="p">141:第一磁性件</p>
        <p type="p">142:第二磁性件</p>
        <p type="p">d1:距離</p>
        <p type="p">d2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="32" publication-number="202632600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像降噪方法及影像處理裝置</chinese-title>
        <english-title>IMAGE NOISE REDUCTION METHOD AND IMAGE PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250401B">G06T5/70</main-classification>
        <further-classification edition="202401120250401B">G06T5/73</further-classification>
        <further-classification edition="201701120250401B">G06T7/20</further-classification>
        <further-classification edition="201401220250401B">H04N19/117</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酷博樂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUPOLA360 INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種影像降噪方法及影像處理裝置。方法包括：取得第t個輸入影像及第t個參考影像；基於第t個輸入影像及第t個參考影像判定第一權重圖；以第t個輸入影像作為導引影像以對第一權重圖執行導引濾波操作，以產生第二權重圖；以及基於第二權重圖對第t個輸入影像及第t個參考影像執行時域濾波操作，以產生第t個輸出影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the disclosure provide an image noise reduction method and an image processing device. The method includes: obtaining a t-th input image and a t-th reference image; determining a first weight map based on the t-th input image and the t-th reference image; using the t-th input image as a guiding image to perform a guided filtering operation on the first weight map to generate a second weight map; and performing a temporal filtering operation on the t-th input image and the t-th reference image based on the second weight map to generate a t-th output image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="33" publication-number="202632965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其白平衡調整方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND WHITE BALANCE ADJUSTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">H04N23/88</main-classification>
        <further-classification edition="202301120250401B">H04N23/70</further-classification>
        <further-classification edition="201701120250401B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊惠琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HUI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慈珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TZU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電子裝置與其白平衡調整方法。所述方法包括下列步驟。利用閃光燈裝置發出預閃光並擷取預閃光影像。根據預閃光影像決定第一白平衡決策點。關閉閃光燈裝置並透過影像感測器擷取環境光影像。根據環境光影像決定第二白平衡決策點。根據閃光燈裝置的主閃光對應的第三白平衡決策點、第一白平衡決策點及第二白平衡決策點，決定一最終白平衡決策點。利用閃光燈裝置發出主閃光並擷取目標影像，並應用最終白平衡決策點對目標影像進行白平衡調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a white balance adjusting method thereof are provided. The method includes the following steps. The flashlight device is used to emit a pre-flash and a pre-flash image is captured. A first white balance decision point is determined based on the pre-flash image. The flashlight device is turned off, and an ambient light image is captured using the image sensor. A second white balance decision point is determined based on the ambient light image. A final white balance decision point is determined based on a third white balance decision point corresponding to the main flash of the flashlight device, the first white balance decision point, and the second white balance decision point. A target image is capture using the flashlight device emitting the main flash, and the final white balance decision point is applied to adjust the white balance of the target image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="34" publication-number="202633087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵電單元製程及其結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250204B">H10B51/00</main-classification>
        <further-classification edition="200601120250204B">G06N3/02</further-classification>
        <further-classification edition="200601120250204B">G11C11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐英瓚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YING-TSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖滄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-TSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具自我學習能力並提升字元辨識長度之鐵電神經網路單元製程及其結構，所提鐵電神經網路單元是基於鐵電場效電晶體（Ferroelectric field-effect transistor, FeFET）的內容可定址記憶體（Content addressable memory, CAM）結構（簡稱FeCAM），該FeCAM係採取一N型鐵電場效電晶體（N-type FeFET）及一P型鐵電場效電晶體（P-type FeFET）所組成的1N1P-FeCAM。藉此，本發明可減少元件數量以最小化單元面積，每個單元由2個互補的FeFET構建，可比三態內容可定址記憶體（Ternary CAM, TCAM）密度高出33%；並且透過氫電漿的處理，可以更好提升ION1與ION2的對稱性，這可增加不匹配單元數（Max HD, MHD）。對於用於圖形辨識有極大的幫助且可推廣於人工智慧的各項領域當中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:N型鐵電場效電晶體</p>
        <p type="p">11:第一矽基板</p>
        <p type="p">12:第一閘極堆疊</p>
        <p type="p">121:介面層</p>
        <p type="p">122:第一HZO結構</p>
        <p type="p">123:第一TiN層</p>
        <p type="p">13:第一源極/汲極區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="35" publication-number="202633114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10D30/60</main-classification>
        <further-classification edition="202501120250204B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張兆易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含基板與磊晶層。磊晶層在基板上，其中磊晶層分為元件區、過渡區與邊緣終端區，邊緣終端區圍繞過渡區，過渡區圍繞元件區，其中磊晶層包含漂移區、過渡摻雜區與終端摻雜區。漂移區在元件區、過渡區與邊緣終端區中，並具有第一導體型。過渡摻雜區在過渡區中，過渡摻雜區具有第二導體型，第二導體型與第一導體型不同，其中過渡摻雜區在上視圖上具有圓角，且圓角的圓角半徑大於磊晶層的厚度的至少5倍。終端摻雜區在邊緣終端區中並接觸過渡摻雜區，終端摻雜區具有第二導體型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate and an epitaxial layer over the substrate. The epitaxial layer is divided into an active region, a transition region surrounding the active region, and an edge termination region surrounding the transition region. The epitaxial region includes drift region, a transition doped region, and a termination doped region. The drift region is in the active region, the transition region, and the edge termination region, and has a first conductivity type. The transition doped region is in the transition region, and has a second conductivity type different from the first conductivity type. The transition doped region has a rounded corner, and the corner radius of the rounded corner is at least 5 times larger than the thickness of the epitaxial layer. The termination doped region is in the edge termination region and is in contact with the transition doped region. The termination doped region has the second conductivity type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:磊晶層</p>
        <p type="p">121:漂移區</p>
        <p type="p">122:過渡摻雜區</p>
        <p type="p">122E、123E、127E:邊緣</p>
        <p type="p">123、127、128、1281、1282、1283、128n:終端摻雜區</p>
        <p type="p">124:井區</p>
        <p type="p">125:源極區</p>
        <p type="p">126:體接觸區</p>
        <p type="p">130:閘極結構</p>
        <p type="p">132:閘極介電層</p>
        <p type="p">134:閘極</p>
        <p type="p">140:絕緣層</p>
        <p type="p">150:源極電極</p>
        <p type="p">160:汲極電極</p>
        <p type="p">AR:元件區</p>
        <p type="p">D1、D2:方向</p>
        <p type="p">ER:邊緣終端區</p>
        <p type="p">P:電晶體</p>
        <p type="p">S1、S2:距離</p>
        <p type="p">TR:過渡區</p>
        <p type="p">T1:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="36" publication-number="202631865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環保墊體製造用組成物、環保墊體的製造方法及環保墊體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250501B">C08L23/0853</main-classification>
        <further-classification edition="200601120250501B">C08L71/00</further-classification>
        <further-classification edition="200601120250501B">C08L75/04</further-classification>
        <further-classification edition="200601120250501B">C08K7/02</further-classification>
        <further-classification edition="200601120250501B">B29B17/00</further-classification>
        <further-classification edition="200601120250501B">B29B17/04</further-classification>
        <further-classification edition="200601120250501B">A43B17/00</further-classification>
        <further-classification edition="200601120250501B">A43B17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大昇化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒臺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張訓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">環保墊體製造用組成物，包含有回收聚合物碎料、回收纖維碎料及聚醚型黏著劑；回收聚合物碎料及回收纖維料的平均粒徑為0.3 mm至5 mm，回收聚合物碎料的材質是熱塑性聚胺酯及／或乙烯－醋酸乙烯酯共聚物，且來源於回收鞋墊的墊體、熱塑性聚胺酯及／或乙烯－醋酸乙烯酯共聚物製造過程中產生的廢料、製造鞋墊的墊體時產生的邊角料；回收纖維碎料的材質是植物纖維、動物纖維及／或人造纖維，且來源於貼附在回收鞋墊的墊體上的布料；基於聚醚型膠黏劑100重量份，回收聚合物碎料的含量為260至340重量份，回收纖維碎料的含量為10至100重量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="37" publication-number="202632374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學瞄準裝置</chinese-title>
        <english-title>OPTICAL SIGHTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">G02B23/00</main-classification>
        <further-classification edition="200601120250603B">G02B23/02</further-classification>
        <further-classification edition="200601120250603B">G02B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永沁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學瞄準裝置，其包括一光源模組、一底座以及一反射鏡。光源模組包括一光源和設置該光源的一基材。底座包括相對設置一第一端部和一第二端部，光源模組設置於底座，且光源模組的光源朝向第一端部反射鏡設置於第一端部，反射鏡具有一第一光軸，光源發出的照射光線在一照射角度範圍內對應於反射鏡，照射角度範圍內的照射光線由反射鏡反射而形成一反射光線。底座更包括一出光結構，出光結構包括一通孔，照射光線未被反射鏡反射之一部分照射光線朝向通孔，部分照射光線經由通孔離開底座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical sighting device includes a light source module, a base and a reflector. The light source module includes a light source and a substrate on which the light source is disposed. The base includes a first end and a second end. The light source module is disposed at the base, and the light source of the light source module faces the first end. The reflector is disposed at the first end. The illumination light emitted by the light source corresponds to the reflector within an illumination angle range, and the illumination light within the illumination angle range is reflected by the reflector to form a reflected light. The base further includes a light emitting structure. The portion of the irradiation light outside the irradiation angle range is directed toward the light emitting structure. The base further includes a light outgoing structure having a through hole. The irradiation light not reflected by the reflector propagates towards the through hole, and a portion of the irradiation light travels away from the base via the through hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學瞄準裝置</p>
        <p type="p">10:光源模組</p>
        <p type="p">11:光源</p>
        <p type="p">12:基材</p>
        <p type="p">20:底座</p>
        <p type="p">21:第一端部</p>
        <p type="p">22:第二端部</p>
        <p type="p">23:光學空間</p>
        <p type="p">24:頂壁</p>
        <p type="p">25:底壁</p>
        <p type="p">28:第一光線反射抑制結構</p>
        <p type="p">30:反射鏡</p>
        <p type="p">40:光學鏡片</p>
        <p type="p">281:出光結構</p>
        <p type="p">282:第一光吸收結構</p>
        <p type="p">O1:第一光軸</p>
        <p type="p">O2:第二光軸</p>
        <p type="p">θ:第一光軸與第二光軸之間的夾角</p>
        <p type="p">φ1:光束角度</p>
        <p type="p">φ2:照射角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="38" publication-number="202632035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基板表面形成碳膜的方法</chinese-title>
        <english-title>METHOD FOR FORMING CARBON FILM ON SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C23C16/02</main-classification>
        <further-classification edition="200601120250801B">H01J37/30</further-classification>
        <further-classification edition="200601120250801B">C23C16/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天虹科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭耀璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YAO-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易錦良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, CHING-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱永豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種在基板表面形成碳膜的方法，包括對一基板進行離子注入製程，以在基板上形成一離子注入區。對基板進行加熱，並對基板進行一電漿預清潔製程。在基板的至少一表面上形成一碳膜，而後對基板進行高溫回火。經過加熱及電漿預處理後，可去除基板上的水氣及懸鍵，並有利於在基板上形成結構緊密且平整的碳膜，以提高碳膜對基板的保護效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a method for forming a carbon film on a substrate, comprising: performing an ion implantation process on a substrate to form an ion-implanted region on the substrate; heating the substrate and performing a plasma pre-cleaning process on the substrate; forming a carbon film on at least one surface of the substrate; and then annealing the substrate at a high temperature. After heating and plasma pre-treatment, moisture and dangling bonds on the substrate can be removed, which is conducive to forming a dense and smooth carbon film on the substrate to improve the protective effect of the carbon film on the substrate.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="39" publication-number="202632145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇裝置及導流件</chinese-title>
        <english-title>FAN DEVICE AND GUIDING COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">F04D25/06</main-classification>
        <further-classification edition="200601120250313B">F04D25/08</further-classification>
        <further-classification edition="200601120250313B">F04D29/58</further-classification>
        <further-classification edition="200601120250313B">F04D19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訊凱國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOLER MASTER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, JIA-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇裝置，包含一扇框、一扇葉、一驅動件以及一導流件。扇葉包含一輪轂部以及多個第一葉片部。輪轂部可轉動地設置於扇框，並具有一缺口。這些第一葉片部連接於輪轂部。驅動件設置於扇框，並連接於輪轂部。驅動件用以驅動輪轂部相對扇框轉動。導流件固定於輪轂部，並包含一蓋部以及至少一導流部。蓋部具有至少一開孔。至少一開孔與缺口相連通。驅動件位於蓋部遠離缺口之一側。至少一導流部連接於蓋部，並位於至少一開孔。至少一導流部用以導引一散熱氣流自缺口以及至少一開孔流向驅動件，以對驅動件散熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan device includes a fan frame, a fan blade, a driving component and a guiding component. The fan blade includes a hub portion and a plurality of first blade portions. The hub portion is rotatably disposed on the fan frame, and has an opening. The first blade portions are connected to the hub portion. The driving component is disposed on the fan frame, and is connected to the hub portion. The driving component is configured to drive the hub portion to rotate relative to the fan frame. The guiding component is fixed to the hub portion, and includes a cover portion and at least one guiding portion. The cover portion has at least one hole. The at least one hole is in fluid communication with the opening. The driving component is located on a side of the cover portion farthest away from the opening. The at least one guiding portion is connected to the cover portion, and is located at the at least one hole. The at least one guiding portion is configured to guide a heat dissipation airflow to flow from the opening and the at least one hole to the driving component so ad to dissipate heat from the driving component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:風扇裝置</p>
        <p type="p">11:扇框</p>
        <p type="p">12:扇葉</p>
        <p type="p">121:輪轂部</p>
        <p type="p">1211:缺口</p>
        <p type="p">122:第一葉片部</p>
        <p type="p">123:第二葉片部</p>
        <p type="p">13:驅動件</p>
        <p type="p">14:導流件</p>
        <p type="p">141:蓋部</p>
        <p type="p">1411:開孔</p>
        <p type="p">142:側環部</p>
        <p type="p">143:導流部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="40" publication-number="202631220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>婦女產道整復儀</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">A61N1/02</main-classification>
        <further-classification edition="200601120250206B">A61N1/05</further-classification>
        <further-classification edition="200601120250206B">A61N1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑邁醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳舒偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇容嬋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種婦女產道整復儀，包含一桿體，及一電療模組。該桿體沿一軸線延伸且適用於伸置於一產道，並包括一伸入件、一頂抵件，及一握持件。該伸入件具有一第一銜接部、一接合部，及一第二銜接部。該電療模組包括二分別鑲嵌於該第一銜接部的第一導電片，及二分別與該等第一導電片沿該軸線彼此間隔的第二導電片。透過該等第一導電片與該等第二導電片反覆刺激而讓陰道肌、尿道括約肌，以及骨盆相關肌群收縮，能精準地治療因生產導致產道鬆弛，使陰道肌肉彈性恢復緊實，及治療如應力性、急迫性(如膀胱過動)及混合性等等尿失禁的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:桿體</p>
        <p type="p">11:伸入件</p>
        <p type="p">111:第一銜接部</p>
        <p type="p">112:接合部</p>
        <p type="p">113:第二銜接部</p>
        <p type="p">12:頂抵件</p>
        <p type="p">13:握持件</p>
        <p type="p">130:凹槽</p>
        <p type="p">2:電療模組</p>
        <p type="p">21:第一導電片</p>
        <p type="p">22:第二導電片</p>
        <p type="p">Z:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="41" publication-number="202632973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄型多磁式減振揚聲器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250204B">H04R5/02</main-classification>
        <further-classification edition="200601120250204B">H04R7/02</further-classification>
        <further-classification edition="200601120250204B">H04R31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富祐鴻科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTUNE GRAND TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉彧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佩融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪德武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DE-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊德祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DE XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄型多磁式減振揚聲器，包含喇叭座、磁迴組件、第一彈性件及振動組件。藉此，本發明之薄型多磁式減振揚聲器可提供更多之磁能，以提升薄型多磁式減振揚聲器運作時之音量，且可降低喇叭座之振動，以減少共振並提升薄型多磁式減振揚聲器運作時之穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:薄型多磁式減振揚聲器</p>
        <p type="p">11:喇叭座</p>
        <p type="p">111:喇叭座支架</p>
        <p type="p">112:金屬支架</p>
        <p type="p">1121:短邊部</p>
        <p type="p">1122:長邊部</p>
        <p type="p">1123:第一焊接部</p>
        <p type="p">12:磁迴組件</p>
        <p type="p">121:導磁板</p>
        <p type="p">1211:第一組接槽</p>
        <p type="p">122:主導磁單元</p>
        <p type="p">1221:主磁鐵</p>
        <p type="p">1222:主導磁板</p>
        <p type="p">123:第一副導磁單元</p>
        <p type="p">1231:第一副磁鐵</p>
        <p type="p">1232:第一副導磁板</p>
        <p type="p">124:第二副導磁單元</p>
        <p type="p">1241:第二副磁鐵</p>
        <p type="p">1242:第二副導磁板</p>
        <p type="p">125:第一凹陷部</p>
        <p type="p">126:第二凹陷部</p>
        <p type="p">13:第一彈性件</p>
        <p type="p">131:第一外側固定部</p>
        <p type="p">132:第一內側固定部</p>
        <p type="p">133:第一彈性部</p>
        <p type="p">134:第一通孔</p>
        <p type="p">14:振動組件</p>
        <p type="p">141:振膜</p>
        <p type="p">142:音圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="42" publication-number="202633494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以在絕緣基板之高深寬比通孔壁上形成附著緩衝層之方法</chinese-title>
        <english-title>A METHOD FOR FORMING AN ADHESION BUFFER LAYER ON THE WALLS OF HIGH ASPECT RATIO THROUGH-HOLES OF AN INSULATING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W72/50</main-classification>
        <further-classification edition="200601120260504B">C23C14/14</further-classification>
        <further-classification edition="200601120260504B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張奇龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以在絕緣基板之高深寬比通孔壁上形成附著緩衝層之方法，主要是先製備一高功率脈衝磁控濺鍍系統，然後將複數個金屬靶材設置在一濺鍍腔室中；接著是將開設有複數個高深寬比通孔之一絕緣基板於濺鍍腔室內以一旋轉式固定治具加以固定，其中高深寬比通孔之深寬比大於4；之後是對該濺鍍腔室進行抽氣，使濺鍍腔室形成一類真空環境；再來是將一氬氣通入濺鍍腔室中；最後是利用一高功率脈衝磁控濺鍍製程在高深寬比通孔之內壁沉積形成一附著緩衝層，以供進行一後續填孔製程以將一導電金屬填滿高深寬比通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate, mainly comprises first preparing a high-power impulse magnetron sputtering system, and then arranging a plurality of metal targets in a sputtering chamber. Subsequently, an insulating substrate with a plurality of high aspect ratio through-holes is fixed in the sputtering chamber by a rotary fixture, wherein the aspect ratio of the high aspect ratio through-holes is greater than 4. Afterwards, the sputtering chamber is evacuated to form a vacuum-like environment in the sputtering chamber. Then, an argon gas is introduced into the sputtering chamber. Finally, an adhesion buffer layer is deposited on the inner walls of the high aspect ratio through-holes by a high-power pulsed magnetron sputtering process for a subsequent filling process to fill the high aspect ratio through-holes with a conductive metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="43" publication-number="202632877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁能調變壓控振盪裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H03B5/12</main-classification>
        <further-classification edition="200601120250512B">H03F7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁能調變壓控振盪裝置，包含電能供應端、振盪訊號輸出端組、包括第一、二振盪輸出端並輸出振盪訊號的調諧電感模組，及電連接第一、二振盪輸出端的電容模組及交錯耦合電路。調諧電感模組的第一調諧電感單元包括電連接第一振盪輸出端與電能供應端的初級線圈、與初級線圈產生互感的次級線圈，及電連接第一振盪輸出端與次級線圈的放大電路。放大電路依第一振盪輸出端的電壓產生第一輸出電流給次級線圈，第一輸出電流對第一振盪輸出端的電壓之比值是可調的。利用上述設計不需抽換電感零件即可調整電感值，並增加壓控振盪器的應用廣度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電能供應端</p>
        <p type="p">2:振盪訊號輸出端組</p>
        <p type="p">21:第一振盪輸出端</p>
        <p type="p">22:第二振盪輸出端</p>
        <p type="p">3:調諧電感模組</p>
        <p type="p">4:電容模組</p>
        <p type="p">41:電容</p>
        <p type="p">5:交錯耦合電路</p>
        <p type="p">6:緩衝電路</p>
        <p type="p">61:電晶體</p>
        <p type="p">62:電感</p>
        <p type="p">63:電容</p>
        <p type="p">64:阻抗匹配</p>
        <p type="p">7:第一調諧電感單元</p>
        <p type="p">71、71’:初級線圈</p>
        <p type="p">72、72’:次級線圈</p>
        <p type="p">721:第一端</p>
        <p type="p">722:第二端</p>
        <p type="p">73、73’:放大電路</p>
        <p type="p">731、731’:控制電晶體</p>
        <p type="p">732、732’:電流鏡</p>
        <p type="p">733、733’:電流選擇器</p>
        <p type="p">734、734’:主控電晶體</p>
        <p type="p">735、735’:鏡射電晶體</p>
        <p type="p">74、74’:切換器</p>
        <p type="p">741:第一開關</p>
        <p type="p">742:第二開關</p>
        <p type="p">7’:第二調階電感單元</p>
        <p type="p">T1:第一交錯耦合電晶體</p>
        <p type="p">T11:第一汲極端</p>
        <p type="p">T12:第一閘極端</p>
        <p type="p">T13:第一源極端</p>
        <p type="p">T2:第二交錯耦合電晶體</p>
        <p type="p">T21:第二汲極端</p>
        <p type="p">T22:第二閘極端</p>
        <p type="p">T23:第二源極端</p>
        <p type="p">Vdd:電壓源</p>
        <p type="p">Vt:控制電壓</p>
        <p type="p">Vs:工作電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="44" publication-number="202632880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用累增式可變電容改善放大器線性度的功率放大裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F1/32</main-classification>
        <further-classification edition="200601120250303B">H03F3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種功率放大裝置，用於放大一輸入訊號，並包含相互電連接的一第一級放大電路、一第二級放大電路，及一累增式可變電容器。第一級放大電路將輸入訊號放大為一放大訊號後輸出。第二級放大電路將放大訊號放大為一輸出訊號後輸出，並具有一隨著電壓振幅而變化的輸入電容值。累增式可變電容器具有一隨著電壓振幅而變化的補償電容值，且補償電容值的變化量與輸入電容值的變化量為互補。藉由在電連接的第一級放大電路和第二級放大電路之間加入累增式可變電容器，輸入電容值加上補償電容值得以維持在穩定範圍內，進而提高放大器線性度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一級放大電路</p>
        <p type="p">1A:第一輸入端</p>
        <p type="p">1B:第一輸出端</p>
        <p type="p">12:第一級共閘極放大器</p>
        <p type="p">M11:第一級輸入電晶體</p>
        <p type="p">M11a:控制端</p>
        <p type="p">M11b:第一端</p>
        <p type="p">M11c:第二端</p>
        <p type="p">M12:第一級輸出電晶體</p>
        <p type="p">M12a:控制端</p>
        <p type="p">M12b:第一端</p>
        <p type="p">M12c:第二端</p>
        <p type="p">R1:第一級電阻器</p>
        <p type="p">C1:第一級電容器</p>
        <p type="p">2:第二級放大電路</p>
        <p type="p">2A:第二輸入端</p>
        <p type="p">2B:第二輸出端</p>
        <p type="p">22:第二級共閘極放大器</p>
        <p type="p">M21:第二級輸入電晶體</p>
        <p type="p">M21a:控制端</p>
        <p type="p">M21b:第一端</p>
        <p type="p">M21c:第二端</p>
        <p type="p">M22:第二級輸出電晶體</p>
        <p type="p">M22a:控制端</p>
        <p type="p">M22b:第一端</p>
        <p type="p">M22c:第二端</p>
        <p type="p">R2:第二級電阻器</p>
        <p type="p">C2:第二級電容器</p>
        <p type="p">3:累增式可變電容器</p>
        <p type="p">5:匹配電路</p>
        <p type="p">VDD:工作電壓值</p>
        <p type="p">Vin:輸入訊號</p>
        <p type="p">Vout:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="45" publication-number="202632878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓控振盪裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03B5/12</main-classification>
        <further-classification edition="200601120250303B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓控振盪裝置，包含可自第一、二輸出端輸出振盪訊號的振盪器電路、交錯耦合電路及輔助電位調整電路。交錯耦合電路包括第一、二交錯耦合電晶體。第一交錯耦合電晶體的汲極電連接第一輸出端，閘極電連接第二輸出端。第二交錯耦合電晶體的汲極電連接第二輸出端、閘極電連接第一輸出端。輔助電位調整電路包括第一、二源極追隨器。第一源極追隨器接收振盪訊號並電連接第一交錯耦合電晶體的基極。第二源極追隨器接收所述振盪訊號並電連接第二交錯耦合電晶體的基極。利用上述設計，能動態調整電晶體的臨界電壓，提升電晶體導通速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:振盪器電路</p>
        <p type="p">11:輸入端</p>
        <p type="p">12:第一輸出端</p>
        <p type="p">13:第二輸出端</p>
        <p type="p">14:電感模組</p>
        <p type="p">141:第一電感</p>
        <p type="p">142:第二電感</p>
        <p type="p">15:電容模組</p>
        <p type="p">151:第一電容</p>
        <p type="p">152:第二電容</p>
        <p type="p">2:交錯耦合電路</p>
        <p type="p">21:第一交錯耦合電晶體</p>
        <p type="p">22:第二交錯耦合電晶體</p>
        <p type="p">3:輔助電位調整電路</p>
        <p type="p">31:第一源極追隨器</p>
        <p type="p">311:第一追隨器輸出端</p>
        <p type="p">312:第一電位調整電晶體</p>
        <p type="p">32:第二源極追隨器</p>
        <p type="p">321:第二追隨器輸出端</p>
        <p type="p">322:第二電位調整電晶體</p>
        <p type="p">33:第一負載</p>
        <p type="p">34:第二負載</p>
        <p type="p">Vdd:輸入電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="46" publication-number="202632061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CVD設備與其加熱系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C23C16/458</main-classification>
        <further-classification edition="200601220250501B">H05B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章詠湟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳元宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種CVD設備與其加熱系統，該加熱系統包含多個沿石英爐管周緣分布設置的燈座機構、多個安裝在該等燈座機構且分布在石英爐管周圍的加熱器，及一電連接該等燈座機構的控制裝置。該控制裝置包括多個沿石英爐管周緣間隔分布的溫度感測模組，並可供針對每一溫度感測模組設定一預定溫度。控制裝置能調控驅動該等加熱器的電能，以使每一溫度感測模組測得之溫度值趨近被設定之預定溫度。透過上述設計，能各別調控該等加熱器的發熱溫度，使各個溫度感測模組測得之溫度值調控趨近於對應之預定溫度，而達到精準控制該石英爐管周緣各部位溫度的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:石英爐管</p>
        <p type="p">6:燈座機構</p>
        <p type="p">61:座體</p>
        <p type="p">611:相向面</p>
        <p type="p">612:內周面</p>
        <p type="p">613:卡嵌槽</p>
        <p type="p">63:限位模組</p>
        <p type="p">7:加熱器</p>
        <p type="p">71:導電部</p>
        <p type="p">72:加熱部</p>
        <p type="p">82:溫度感測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="47" publication-number="202631981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低耗能發酵系統及發酵方法</chinese-title>
        <english-title>LOW ENERGY CONSUMPTION FERMENTATION SYSTEM AND FERMENTATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C12M1/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>承德油脂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANT OIL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭亭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順娘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN-NIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂詠哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GUAN-CHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種低耗能發酵系統及發酵方法。低耗能發酵系統包括發酵槽、進料槽、增氧裝置、攪拌軸、發酵液進料槽、至少一添加槽以及自動控制裝置。進料槽耦接發酵槽。增氧裝置設置於發酵槽中的底部。攪拌軸直立穿設於發酵槽中，攪拌軸上設置有多個攪拌片。發酵液進料槽耦接發酵槽。至少一添加槽耦接發酵槽。自動控制裝置耦接進料槽、增氧裝置、攪拌軸、發酵液進料槽和至少一添加槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a low energy consumption fermentation system and a fermentation method. The low energy consumption fermentation system includes a fermentation tank, a feeding tank, an aeration device, a stirring shaft, a fermentation broth feeding tank, at least one adding tank and an automatic control device. The feeding tank is coupled to the fermentation tank. The aeration device is disposed at a bottom of the fermentation tank. The stirring shaft is installed upright in the fermentation tank, and a plurality of stirring blades is disposed on the stirring shaft. The fermentation broth feeding tank is coupled to the fermentation tank. The addition tank is coupled to the fermentation tank. The automatic control device is coupled to the feeding tank, the aeration device, the stirring shaft, the fermentation broth feeding tank, and at least one adding tank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:低耗能發酵系統</p>
        <p type="p">110:發酵槽</p>
        <p type="p">120:進料槽</p>
        <p type="p">130:增氧裝置</p>
        <p type="p">140:攪拌軸</p>
        <p type="p">142:攪拌片</p>
        <p type="p">143:距離</p>
        <p type="p">150:發酵液進料槽</p>
        <p type="p">162:添加槽</p>
        <p type="p">164:添加槽</p>
        <p type="p">166:添加槽</p>
        <p type="p">170:自動控制裝置</p>
        <p type="p">180:滅菌蒸氣管道</p>
        <p type="p">190:排氣管道</p>
        <p type="p">210:保溫組件</p>
        <p type="p">220:氣流計</p>
        <p type="p">230:氣體過濾器</p>
        <p type="p">240:氣體壓縮機</p>
        <p type="p">250:泵浦</p>
        <p type="p">260:泵浦</p>
        <p type="p">270:泵浦</p>
        <p type="p">280:泵浦</p>
        <p type="p">290:排出口</p>
        <p type="p">310:閥門</p>
        <p type="p">320:閥門</p>
        <p type="p">330:閥門</p>
        <p type="p">340:閥門</p>
        <p type="p">350:閥門</p>
        <p type="p">360:閥門</p>
        <p type="p">370:閥門</p>
        <p type="p">380:閥門</p>
        <p type="p">410:溶氧感測器</p>
        <p type="p">420:溫度感測器</p>
        <p type="p">430:酸鹼值感測器</p>
        <p type="p">D:直徑</p>
        <p type="p">H:液面高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="48" publication-number="202631261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>便於調節水流之噴水槍</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">B05B7/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山市慶誼金屬制品企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋偉業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍崑廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李述龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤棠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種便於調節水流之噴水槍，具有一本體，本體具有一手柄及一管體，該手柄內貫設一延伸至管體前端之水道，管體之頂部樞設一定位扣，一閥桿伸設於管體內並以其末端穿伸至管體外，手柄之後側樞設一操控桿，操控桿與閥桿相組接，操控桿對應定位扣設有複數定位槽，管體之前端還組設一噴頭組件，閥桿之前端設有沿其軸向向閥桿前端漸擴之導流孔，導流孔受噴頭組件遮蔽。由操控桿帶動閥桿移動，改變導流孔被遮蔽的位置，從而達到調節水流之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:手柄</p>
        <p type="p">2:管體</p>
        <p type="p">21:通孔</p>
        <p type="p">3:定位扣</p>
        <p type="p">31:支腳</p>
        <p type="p">32:卡齒</p>
        <p type="p">4:操控桿</p>
        <p type="p">41:結合部</p>
        <p type="p">42:安裝孔</p>
        <p type="p">43:耳部</p>
        <p type="p">44:封蓋</p>
        <p type="p">5:噴頭組件</p>
        <p type="p">511:進水端</p>
        <p type="p">6:閥桿</p>
        <p type="p">601:前端</p>
        <p type="p">602:末端</p>
        <p type="p">62:導流孔</p>
        <p type="p">63:止水環</p>
        <p type="p">64:導塊</p>
        <p type="p">641:間隙</p>
        <p type="p">65:復位彈簧</p>
        <p type="p">66:限位環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="49" publication-number="202632298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>確認晶圓升降裝置的上升參數的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R1/14</main-classification>
        <further-classification edition="200601120260302B">G01R1/073</further-classification>
        <further-classification edition="202001120260302B">G01R31/26</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣銓科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種確認晶圓測試上升參數的控制方法，包含：從一出發位置上升一試驗晶圓，直到偵測到一最長探針的接觸信號，並將當下對應的位置資訊定義為一參考高度；判斷是否偵測到一最短探針的接觸信號；若否，根據一步階移動參數上升該試驗晶圓，若是，根據該步階移動參數將該試驗晶圓下降一距離；判斷是否偵測到該最短探針的接觸信號；若否，根據一最小移動參數上升該試驗晶圓，該步階移動參數大於該最小移動參數，若是，根據當下對應的位置資訊定義為一最終高度，並根據該最終高度與該參考高度的一高度差定義及儲存一最佳化上升參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S01,S02,S03,S04,S05,S06,S07:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="50" publication-number="202631977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰離子電池矽基負極材料的氮化方法及其產物</chinese-title>
        <english-title>NITRIDATION METHOD OF SILICON-BASED ANODE MATERIALS FOR LITHIUM-ION BATTERIES AND PRODUCTS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">C11D11/02</main-classification>
        <further-classification edition="202301120250325B">C22C1/053</further-classification>
        <further-classification edition="202201120250325B">B01F27/00</further-classification>
        <further-classification edition="200601120250325B">D21D1/28</further-classification>
        <further-classification edition="201001120250325B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡霈文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仍奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JENG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種鋰離子電池矽基負極材料的氮化方法，包括：(a)將一固態含氮前驅物與一矽基負極材料直接進行固態混合成一混合物；以及(b)將該混合物以一預定持溫溫度加熱一預定時間，得到一氮化矽複合負極材料。本揭露內容還提供一種以該氮化方法製備出的氮化矽複合負極材料，以及使用該氮化矽複合負極材料製備的鋰離子電池的負極與鋰離子電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a nitridation method for silicon-based anode materials for lithium-ion batteries, comprising: (a) directly mixing a solid nitrogen-containing precursor with a silicon-based anode material to form a mixture; and (b) heating the mixture at a predetermined temperature for a predetermined time to obtain a nitrided silicon composite anode material. The present disclosure also provides a nitrided silicon composite anode material produced by using the nitridation method, an anode for a lithium-ion battery and a lithium-ion battery manufactured using the nitrided silicon composite anode material.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="51" publication-number="202631024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用可可果莢殼培養食用菇類方法及其材料</chinese-title>
        <english-title>FOOD MUSHROOM CULTURING METHOD AND MATERIAL THEREOF USING COCOA POD SHELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250330B">A23L35/00</main-classification>
        <further-classification edition="201601120250330B">A23L5/20</further-classification>
        <further-classification edition="200601120250330B">A61K36/898</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張珮君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周映孜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, YING-TZY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用可可果莢殼培養食用菇類方法包含：將至少一可可果莢殼體進行破碎處理，以獲得數個可可果莢殼碎塊；將數個該可可果莢殼碎塊進行殺菌處理，以獲得數個已殺菌果莢殼碎塊；將數個該已殺菌果莢殼碎塊以至少一配方材料進行混合調配處理，以獲得數個已調配果莢殼碎塊；及將數個該已調配果莢殼碎塊用以培養至少一菌絲處理，以獲得進行培養至少一食用菇類。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A food mushroom culturing method includes: crushing at least one cocoa pod shell to obtain a plurality of crushed shell fragments; sterilizing the plurality of crushed shell fragments to obtain a plurality of sterilized shell fragments; mixing the plurality of sterilized shell fragments with a formula material to obtain a plurality of blended shell fragments; and processing the plurality of blended shell fragments with at least one hyphae to culture at least one food mushroom.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:破碎處理單元</p>
        <p type="p">1b:混合調整單元</p>
        <p type="p">10:可可果莢殼碎塊</p>
        <p type="p">11:已調配果莢殼碎塊</p>
        <p type="p">100:計算機單元</p>
        <p type="p">20:配方材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="52" publication-number="202631001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用可可果莢殼製成植生基材容器構造及其製造方法</chinese-title>
        <english-title>PLANT-GROWING CONTAINER STRUCTURE AND MANUFACTURING METHOD THEREOF USING COCOA POD SHELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250205B">A01G9/02</main-classification>
        <further-classification edition="200601120250205B">A01G27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周映孜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, YING-TZY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張珮君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用可可果莢殼製成植生基材容器之製造方法包含：將至少一可可果莢殼體進行切割處理，以獲得數個果莢殼切塊；將數個該果莢殼切塊進行前處理，以獲得數個已處理果莢殼切塊；將數個該已處理果莢殼切塊以至少一土壤配方材料進行混合調配處理，以獲得一已調配果莢殼切塊材料；及將數個該已調配果莢殼切塊材料用以填充於至少一容器裝置，以獲得一保水植生基材容器構造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method includes: cutting at least one cocoa pod shell to obtain a plurality of cocoa pod shell fragments; pre-processing the plurality of cocoa pod shell fragments to obtain a plurality of processed cocoa pod shell fragments; mixing the plurality of processed cocoa pod shell fragments with a soil material to obtain a plurality of blended cocoa pod shell fragments; and filling container device with the plurality of blended cocoa pod shell fragments to obtain a water-retaining container structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可可果莢殼體</p>
        <p type="p">10:已處理果莢殼切塊</p>
        <p type="p">100:容器裝置</p>
        <p type="p">101:保水植生基材容器構造</p>
        <p type="p">20:土壤配方材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="53" publication-number="202631335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛懸吊彈簧支柱張緊器裝置</chinese-title>
        <english-title>VEHICLE SUSPENSION SPRING STRUT TENSIONER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">B25B27/30</main-classification>
        <further-classification edition="200601120250318B">B60G3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＫＳ器具工具機械有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KS TOOLS WERKZEUGE-MASCHINEN GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾罕　阿爾廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORHAN, ALTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴奇均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種車輛懸吊彈簧支柱張緊器裝置，其包含有一彈簧張緊器，該彈簧張緊器具有一外管螺接一內管，內管下端套接部下端連接一固定件，該固定件係裝設於本體上方所設的支撐座上，該內管下端套筒下端設定一位部，其係旋入固定件上端所設之螺桿後，以一Ｕ型限位片嵌入該定位部後限位固定，該定位部圓周係開設有一相對平行的切面，兩切面間之間距為一寬度，該Ｕ型限位片的Ｕ型開口具有一略大於定位部圓周開設的兩切面寬度，使其Ｕ型開口可選擇性的嵌入或位移離開定位部圓周開設的兩切面外圍，而Ｕ型限位片的Ｕ型開口兩側片體上各開設有一滑槽螺接於該固定件上固定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle suspension spring strut tensioner device includes a spring tensioner having an outer tube threadedly connected to an inner tube, a lower end of a sleeve portion at the lower end of the inner tube being connected to a fixing member, and the fixing member is Installed on the support seat above the main body, the lower end of the sleeve at the lower end of the inner tube is set with a position part, which is screwed into the screw rod set at the upper end of the fixing part, and then a U-shaped limit piece is embedded in the positioning part. The positioning part is fixed, and the circumference of the positioning part is provided with a relatively parallel section, and the distance between the two sections is a width. The U-shaped opening of the U-shaped limiting piece has a width slightly larger than the width of the two sections provided on the circumference of the positioning part, so that The U-shaped opening can be selectively embedded in or displaced from the outer peripheries of the two cut surfaces opened on the circumference of the positioning portion, and a sliding groove is respectively opened on the two side sheets of the U-shaped opening of the U-shaped limiting sheet and is screwed and fixed on the fixing piece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:固定件</p>
        <p type="p">20:張緊器</p>
        <p type="p">21:外管</p>
        <p type="p">211:旋鈕</p>
        <p type="p">212:彈簧支架</p>
        <p type="p">22:內管</p>
        <p type="p">23:套筒</p>
        <p type="p">231:定位部</p>
        <p type="p">30:本體</p>
        <p type="p">31:底座</p>
        <p type="p">32:支撐桿</p>
        <p type="p">33:支撐座</p>
        <p type="p">331:定位片</p>
        <p type="p">332:定位孔</p>
        <p type="p">333:螺絲</p>
        <p type="p">334:滑道</p>
        <p type="p">34:夾持器</p>
        <p type="p">35:懸吊支柱支架</p>
        <p type="p">351:框架</p>
        <p type="p">40:頂板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="54" publication-number="202632693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率電感封裝結構及其製作方法</chinese-title>
        <english-title>POWER INDUCTOR PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">H01F27/28</main-classification>
        <further-classification edition="200601120250603B">H01F27/30</further-classification>
        <further-classification edition="200601120250603B">H01F27/32</further-classification>
        <further-classification edition="200601120250603B">H01F41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, BO SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鈺霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YU LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種功率電感封裝結構及其製作方法。功率電感封裝結構包括磁芯結構、線圈結構、封裝結構、頂端導電結構、側端導電結構、頂端絕緣結構、底端絕緣結構以及側端絕緣結構。封裝結構被配置以用於包覆磁芯結構以及線圈結構。頂端導電結構包括設置在封裝結構的頂端上的一第一頂端電極層以及一第二頂端電極層。側端導電結構包括分別設置在封裝結構的第一側端以及第二側端上的一第一側端導電層以及一第二側端導電層。頂端絕緣結構包括設置在封裝結構的頂端上的一頂端絕緣層。底端絕緣結構包括設置在封裝結構的底端上的一底端絕緣層。側端絕緣結構包括分別設置在封裝結構的第三側端以及第四側端上的一第一側端絕緣層以及一第二側端絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a power inductor packaging structure and a method of manufacturing the same. The power inductor packaging structure includes a magnetic core structure, a coil structure, a packaging structure, a top conductive structure, a side conductive structure, a top insulating structure, a bottom insulating structure and a side insulating structure. The packaging structure is configured to encapsulate the magnetic core structure and the coil structure. The top conductive structure includes a first top electrode layer and a second top electrode layer which are arranged on the top of the packaging structure. The side conductive structure includes a first side conductive layer and a second side conductive layer respectively arranged on the first side and the second side of the packaging structure. The top insulating structure includes a top insulating layer disposed on the top of the packaging structure. The bottom insulating structure includes a bottom insulating layer disposed on the bottom of the packaging structure. The side insulation structure includes a first side insulation layer and a second side insulation layer respectively arranged on the third side and the fourth side of the packaging structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S:功率電感封裝結構</p>
        <p type="p">202:第二末端部</p>
        <p type="p">2020:第二切割面</p>
        <p type="p">3:封裝結構</p>
        <p type="p">3000:頂端</p>
        <p type="p">3001:第一側端</p>
        <p type="p">3002:第二側端</p>
        <p type="p">3003:第三側端</p>
        <p type="p">3004:第四側端</p>
        <p type="p">3005:底端</p>
        <p type="p">31:頂端堆疊印刷層</p>
        <p type="p">32:中間堆疊印刷層</p>
        <p type="p">33:底端堆疊印刷層</p>
        <p type="p">4:頂端導電結構</p>
        <p type="p">41:第一頂端電極層</p>
        <p type="p">42:第二頂端電極層</p>
        <p type="p">5:側端導電結構</p>
        <p type="p">51:第一側端導電層</p>
        <p type="p">52:第二側端導電層</p>
        <p type="p">6:頂端絕緣結構</p>
        <p type="p">60:頂端絕緣層</p>
        <p type="p">7:底端絕緣結構</p>
        <p type="p">70:底端絕緣層</p>
        <p type="p">8:側端絕緣結構</p>
        <p type="p">81:第一側端絕緣層</p>
        <p type="p">82:第二側端絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="55" publication-number="202632469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應裝置、熱調節方法及電源供應系統</chinese-title>
        <english-title>POWER SUPPLY DEVICE, HEAT REGULATION METHOD AND POWER SUPPLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F1/26</main-classification>
        <further-classification edition="200601120250401B">G06F1/28</further-classification>
        <further-classification edition="200601120250401B">G06F1/30</further-classification>
        <further-classification edition="201901120250401B">G06F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宗偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏鼎宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, DING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭岳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YUEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源供應裝置，包括一功率開關，用來根據一控制訊號，將一第一電源訊號轉換為一第二電源訊號；一第一電流源，用來提供一電流訊號至一第一節點；一控制電路，用來將該電流訊號轉換為該控制訊號；以及一溫控電流汲取電路，包含有至少一溫度感測元件，設置於該功率開關上的至少一位置，用來產生至少一電壓訊號，該至少一電壓訊號分別相關於該至少一位置之溫度；一誤差放大器，用來根據該至少一電壓訊號與一參考電壓，以產生一調節訊號；以及一調節開關，用來根據該調節訊號，於該第一節點處由該電流訊號汲取一調節電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply device includes a power switch, configured to convert a first power signal into a second power signal according to a control signal; a first current source, configured to provide a current signal to a first node; a control circuit, configured to convert the current signal into the control signal; and a temperature-controlled current sink circuit, including at least one temperature sensing element, disposed at at least one location on the power switch, configured to generate at least one voltage signal, wherein the at least one voltage signal is respectively related to a temperature of the at least one location; an error amplifier, configured to generate a regulation signal according to the at least one voltage signal and a reference voltage; and a regulation switch, configured to sink a regulation current from the current signal at the first node according to the regulation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電源供應裝置</p>
        <p type="p">P1:第一電源訊號</p>
        <p type="p">P2:第二電源訊號</p>
        <p type="p">I1:電流訊號</p>
        <p type="p">N1:第一節點</p>
        <p type="p">CTRL:控制訊號</p>
        <p type="p">Ireg:調節電流</p>
        <p type="p">Sreg:調節訊號</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">Vt_1~Vt_n:電壓訊號</p>
        <p type="p">100:功率開關</p>
        <p type="p">110:第一電流源</p>
        <p type="p">120:控制電路</p>
        <p type="p">130:溫控電流汲取電路</p>
        <p type="p">TS_1~TS_n:溫度感測元件</p>
        <p type="p">132:誤差放大器</p>
        <p type="p">134:調節開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="56" publication-number="202632151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減震型低噪音加壓泵</chinese-title>
        <english-title>SHOCK-ABSORBING LOW-NOISE PRESSURE PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F04D29/66</main-classification>
        <further-classification edition="200601120250224B">F04B53/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣櫻花股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SAKURA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種減震型低噪音加壓泵，包括一加壓泵主體及一消音裝置，加壓泵主體靠近出水口處設有一容置室，消音裝置包含一減震筒及一減震墊，減震筒設置於加壓泵主體的容置室內，減震筒為一中空柱體，減震筒上設有多個穿孔，使減震筒形成多孔性結構。減震墊使用彈性材料製成，減震墊設置於減震筒內。本發明消音裝置採用流體力學優化，可通過減震筒多孔性結構的內部流體通道設計，可減少流體流動時的湍流和噪音。本發明使用彈性材料製成的減震墊，能更進一步減少震動傳導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A shock-absorbing low-noise pressure pump includes a pump main body and a silencer device. The pump main body includes a receiving chamber near a water outlet. The silencer device includes a shock-absorbing tube and a shock-absorbing pad. The shock-absorbing tube is arranged in the receiving chamber of the pump main body. The shock-absorbing tube is a hollow cylinder, and the shock-absorbing tube has a plurality of through holes, so that the shock-absorbing tube forms a porous structure. The shock-absorbing pad is made of elastic material and is arranged in the shock-absorbing tube. The silencer device of the present invention adopts fluid mechanics optimization and can reduce turbulence and noise during fluid flow through the design of an internal fluid channel of the porous structure of the shock absorbing tube. The present invention provides the shock-absorbing pad made of elastic materials, which can further reduce vibration transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:加壓泵主體</p>
        <p type="p">11:馬達</p>
        <p type="p">12:進水口</p>
        <p type="p">13:出水口</p>
        <p type="p">15:容置室</p>
        <p type="p">2:消音裝置</p>
        <p type="p">21:減震筒</p>
        <p type="p">212:外表面</p>
        <p type="p">213:穿孔</p>
        <p type="p">22:減震墊</p>
        <p type="p">221:圓弧片體</p>
        <p type="p">222:平片體</p>
        <p type="p">23:蓋體</p>
        <p type="p">24:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="57" publication-number="202631404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種標籤偵錯列印方法</chinese-title>
        <english-title>METHOD FOR INSPECTING AND PRINTING LABELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">B41J29/46</main-classification>
        <further-classification edition="200601120250401B">B41J29/38</further-classification>
        <further-classification edition="200601120250401B">B41J3/407</further-classification>
        <further-classification edition="200601120250401B">B65C9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科誠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODEX INTERNATIONAL CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴奉義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, FENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛元佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚耘帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種標籤偵錯列印方法，包含：利用一列印裝置列印一標籤；以及利用一檢測裝置判讀此標籤，其中此標籤有錯誤的內容時，此列印裝置不回拉此標籤，續印一警示錯誤說明標籤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a method for inspecting and printing labels. The method includes: using a printer to print a label; and using an inspector to read the label, wherein the printer does not pull back the label but prints a warning mark on the next label when the label has wrong content and read out by the inspector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:本發明之一較佳實施例之方法流程圖</p>
        <p type="p">210,220,222,230:執行步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="58" publication-number="202632828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>逆向電流保護電路</chinese-title>
        <english-title>REVERSE CURRENT PROTECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H02H7/10</main-classification>
        <further-classification edition="200601120250303B">H02H3/26</further-classification>
        <further-classification edition="200601120250303B">H02H7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏世忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, SHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種逆向電流保護電路。所述逆向電流保護電路適用於上橋開關以及下橋開關。上橋開關的第一端耦接輸入電壓。下橋開關的第一端連接上橋開關的第二端。逆向電流保護電路偵測上橋開關的第一端接收的輸入電壓以及下橋開關的第二端的輸出電壓，據以控制下橋開關。在大於一逆電流門檻值的逆向電流從下橋開關的第二端的輸出電壓依序流經下橋開關以及上橋開關至輸入電壓之前，逆向電流保護電路關閉下橋開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reverse current protection circuit is provided. The reverse current protection circuit is applicable to a high-side switch and a low-side switch. A first terminal of the high-side switch is coupled to an input voltage. A first terminal of the low-side switch is connected to a second terminal of the high-side switch. The reverse current protection circuit detects the input voltage received by the first terminal of the high-side switch and an output voltage of a second terminal of the low-side switch, and accordingly controls the low-side switch. Before a reverse current being larger than a reverse current threshold flows from the output voltage of the second terminal of the low-side switch sequentially through the low-side switch and the high-side switch to the input voltage, the reverse current protection circuit turns off the low-side switch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">HS:上橋開關</p>
        <p type="p">VCH:上橋充電電壓</p>
        <p type="p">LS:下橋開關</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">100:主逆向電流保護電路</p>
        <p type="p">VPL:下橋主控訊號</p>
        <p type="p">VCP:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="59" publication-number="202633115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10D30/60</main-classification>
        <further-classification edition="202501120250204B">H10D30/87</further-classification>
        <further-classification edition="202501120250204B">H10D62/85</further-classification>
        <further-classification edition="202501120250204B">H10D64/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何羽軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱玠錞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIE-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括第一元件、第一及第二介電層、第一及第二金屬層及功能部分，且第一元件包括閘極、源極與汲極電極。第一介電層設置於第一元件上。第一金屬層設置於第一介電層上，電性連接第一元件，且包括第一導電部分。第一導電部分電性連接第一元件的源極電極。第二介電層設置於第一金屬層上。第二金屬層設置於第二介電層上，且包括對應於第一導電部分的第二導電部分。功能部分位於第一導電部分及第二導電部分之間。第一導電部分、第二導電部分及功能部分共同作為第二元件，且第二元件電性連接第一元件的源極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a first element, first and second dielectric layers, first and second metal layers, and a functional portion, and the first element includes gate, source, and drain electrodes. The first dielectric layer is disposed on the first element. The first metal layer is disposed on the first dielectric layer, is electrically connected to the first element, and includes a first conductive portion. The first conductive portion is electrically connected to the source electrode of the first element. The second dielectric layer is disposed on the first metal layer. The second metal layer is disposed on the second dielectric layer and includes a second conductive portion corresponding to the first conductive portion. The functional portion is located between the first conductive portion and the second conductive portion. The first conductive portion, the second conductive portion, and the functional portion together serve as a second element, and the second element is electrically connected to the source electrode of the first element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:第一元件</p>
        <p type="p">21:第二元件</p>
        <p type="p">100:基板</p>
        <p type="p">102:通道層</p>
        <p type="p">104:阻障層</p>
        <p type="p">111:化合物半導體層</p>
        <p type="p">112:閘極電極</p>
        <p type="p">114:源極電極</p>
        <p type="p">116:汲極電極</p>
        <p type="p">200:第一介電層</p>
        <p type="p">202:第一閘極導孔</p>
        <p type="p">204,205:第一源極導孔</p>
        <p type="p">206:第一汲極導孔</p>
        <p type="p">210:第一金屬層</p>
        <p type="p">212:第一閘極接觸物</p>
        <p type="p">214:第一源極接觸物</p>
        <p type="p">215:第一導電部分</p>
        <p type="p">216:第一汲極接觸物</p>
        <p type="p">300:第二介電層</p>
        <p type="p">302:第二閘極導孔</p>
        <p type="p">304:第二源極導孔</p>
        <p type="p">306:第二汲極導孔</p>
        <p type="p">310:第二金屬層</p>
        <p type="p">312:第二閘極接觸物</p>
        <p type="p">314:第二源極接觸物</p>
        <p type="p">315:第二導電部分</p>
        <p type="p">316:第二汲極接觸物</p>
        <p type="p">401:功能部分</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">RDLS:重佈線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="60" publication-number="202632387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學超表面結構以及其製作方法</chinese-title>
        <english-title>OPTICAL METASURFACE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G02F1/01</main-classification>
        <further-classification edition="200601120250512B">G02F1/13</further-classification>
        <further-classification edition="200601120250512B">C09K19/02</further-classification>
        <further-classification edition="200601120250512B">G02B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭致瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾譯葦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炫旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUAN-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱崇益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學超表面(metasurface)結構包括基底、第一金屬軌道結構、第二金屬軌道結構、擴散阻障層、高介電常數介電層以及液晶材料。第一金屬軌道結構與第二金屬軌道結構設置在基底之上。擴散阻障層設置在第一金屬軌道結構與第二金屬軌道結構上。高介電常數介電層設置在擴散阻障層上。液晶材料設置在基底之上，且液晶材料的至少一部分在一水平方向上位於第一金屬軌道結構與第二金屬軌道結構之間。擴散阻障層具有第一厚度，高介電常數介電層的一部分具有第二厚度，且第一厚度大於第二厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical metasurface structure includes a substrate, a first metal rail structure, a second metal rail structure, a diffusion barrier layer, a high dielectric constant dielectric layer, and a liquid crystal material. The first metal rail structure and the second metal rail structure are disposed above the substrate. The diffusion barrier layer is disposed on the first metal rail structure and the second metal rail structure. The high dielectric constant dielectric layer is disposed on the diffusion barrier layer. The liquid crystal material is disposed above the substrate and at least a part of the liquid crystal material is located between the first metal rail structure and the second metal rail structure in a horizontal direction. The diffusion barrier layer has a first thickness, a portion of the high dielectric constant dielectric layer has a second thickness, and the first thickness is greater than the second thickness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:基底</p>
        <p type="p">24:介電層</p>
        <p type="p">26:蝕刻停止層</p>
        <p type="p">28:介電層</p>
        <p type="p">30:阻障層</p>
        <p type="p">32:導電材料</p>
        <p type="p">34:蝕刻停止層</p>
        <p type="p">36:介電層</p>
        <p type="p">38:蝕刻停止層</p>
        <p type="p">40:阻障層</p>
        <p type="p">42:導電材料</p>
        <p type="p">46:阻障材料</p>
        <p type="p">46A:阻障層</p>
        <p type="p">46B:阻障層</p>
        <p type="p">48:金屬材料</p>
        <p type="p">48A:金屬層</p>
        <p type="p">48B:金屬層</p>
        <p type="p">50:擴散阻障層</p>
        <p type="p">52:高介電常數介電層</p>
        <p type="p">54:液晶材料</p>
        <p type="p">101:光學超表面結構</p>
        <p type="p">BS:底表面</p>
        <p type="p">BS1:底表面</p>
        <p type="p">BS2:底表面</p>
        <p type="p">CS:連接結構</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">D2:水平方向</p>
        <p type="p">M1:導線</p>
        <p type="p">P11:第一部分</p>
        <p type="p">P12:第二部分</p>
        <p type="p">P21:第一部分</p>
        <p type="p">P22:第二部分</p>
        <p type="p">RS:金屬軌道結構</p>
        <p type="p">RS1:金屬軌道結構</p>
        <p type="p">RS2:金屬軌道結構</p>
        <p type="p">SW1:側壁</p>
        <p type="p">SW2:側壁</p>
        <p type="p">TK1:厚度</p>
        <p type="p">TK2:厚度</p>
        <p type="p">TS1:上表面</p>
        <p type="p">TS2:上表面</p>
        <p type="p">V1:通孔導體</p>
        <p type="p">W11:寬度</p>
        <p type="p">W12:寬度</p>
        <p type="p">W21:寬度</p>
        <p type="p">W22:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="61" publication-number="202631325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動力棘輪工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">B25B13/46</main-classification>
        <further-classification edition="200601120250423B">B25B23/00</further-classification>
        <further-classification edition="200601120250423B">B25B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨動力氣動股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江旭環</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作包括連接件、曲柄軸、軸承和棘輪工作組件。連接件包括有連接管，以及一體形成於連接管的棘輪柄；棘輪柄包括有相間隔的兩限制臂，以及連接設於兩限制臂之周緣的橋接段；曲柄軸能轉動地穿置於連接管內；軸承套置於該曲柄軸、位於連接管內而緊抵於連接管與曲柄軸；棘輪工作組件與棘輪軛相連結且設有工作頭。本創作一體連接連接管和棘輪柄、以橋接段連接兩限制臂，加強了本創作的結構強度，能夠解決現有動力棘輪工具無法提供足夠長度且兼顧結構強度的問題，提供一種能深入狹小安裝空間且足以承受高扭力的動力棘輪工具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接件</p>
        <p type="p">11:連接管</p>
        <p type="p">12:棘輪柄</p>
        <p type="p">122:橋接段</p>
        <p type="p">50:棘輪軛</p>
        <p type="p">60:棘輪工作組件</p>
        <p type="p">61:工作頭</p>
        <p type="p">70:連接螺帽</p>
        <p type="p">80:行星齒輪組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="62" publication-number="202632664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其控制方法</chinese-title>
        <english-title>MEMORY DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G11C16/24</main-classification>
        <further-classification edition="200601120250602B">G11C16/06</further-classification>
        <further-classification edition="200601120250602B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周佑亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YOU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂君章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種記憶體裝置及其控制方法。記憶體裝置可為具備高容量及高性能的三維NAND快閃記憶體。記憶體裝置包括記憶體陣列以及記憶體控制器。記憶體陣包括多個記憶體頁面。記憶體控制器耦接記憶體陣列，並且用以控制記憶體陣列。在當前記憶體頁面的寫入操作中，記憶體控制器透過前一條字元線施加多個補償電壓至前一記憶體頁面的閾值電壓分布的多個狀態的多個低閾值部分，並且記憶體控制器還透過前一條字元線以及當前條字元線施加通過電壓前一記憶體頁面的閾值電壓分布的另多個狀態及當前記憶體頁面的對應的多個狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and a control method thereof are provided. The memory device may be a three-dimensional NAND flash memory with high capacity and high performance. The memory device includes a memory array and a memory controller. The memory array includes a plurality of memory pages. The memory controller is coupled to the memory array, and configured to control the memory array. In a program operation of a current memory page, the memory controller applies a plurality of compensation voltages to a plurality of low threshold parts of a plurality of states of a threshold voltage distribution of a previous memory page through a previous word line, and memory controller further applies a pass voltage to another plurality of states of the threshold voltage distribution of the previous memory page and a plurality of corresponding states of a threshold voltage distribution of the current memory page through the previous word line and a current word line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:記憶體控制器</p>
        <p type="p">120:記憶體陣列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="63" publication-number="202633223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250604B">H10H20/855</main-classification>
        <further-classification edition="202501120250604B">H10H20/856</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家毫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JIA HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭有斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仲訊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光裝置，包括：電路基板、發光元件、散射層以及微凸塊。發光元件位於電路基板上，且電性連接電路基板。散射層位於電路基板上，且圍繞發光元件。微凸塊位於發光元件之上，且重疊發光元件。微凸塊具有底面及位於其側邊的斜面，底面與斜面之間夾有夾角θ，微凸塊的全反射角為θc，且θc ≤θ ≤ (θc +10°)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device includes a circuit substrate, a light-emitting element, a scattering layer and a micro-bump. The light-emitting element is disposed on the circuit substrate and electrically connected to the circuit substrate. The scattering layer is disposed on the circuit substrate and surrounds the light-emitting element. The micro-bump is disposed over and overlapped with the light-emitting element. The micro-bump has a bottom surface and a inclined surface at its side, and an angle θ is included between the bottom surface and the inclined surface. The micro-bump has a total reflection angle θc, and θ ranges from θc to (θc +10°).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光裝置</p>
        <p type="p">110:電路基板</p>
        <p type="p">112:底板</p>
        <p type="p">114:電路層</p>
        <p type="p">120:發光元件</p>
        <p type="p">130:散射層</p>
        <p type="p">140:平坦層</p>
        <p type="p">150:微凸塊</p>
        <p type="p">160:遮光層</p>
        <p type="p">170:封裝層</p>
        <p type="p">180:蓋板</p>
        <p type="p">I:區域</p>
        <p type="p">OP:開口</p>
        <p type="p">PA,PB:接墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="64" publication-number="202632934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>公雲服務的異常偵測系統和異常偵測方法</chinese-title>
        <english-title>ABNORMAL DETECTION SYSTEM AND ABNORMAL DETECTION METHOD OF PUBLIC CLOUD SERVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">H04L43/04</main-classification>
        <further-classification edition="202201120250401B">H04L43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖尉辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種公雲服務的異常偵測系統和異常偵測方法。方法包含：對機器學習模型執行增強學習演算法以決定機器學習模型的超參數，並且根據超參數更新機器學習模型；從公共雲端伺服器接收歷史雲端服務帳務明細，並且對歷史雲端服務帳務明細執行預處理以取得歷史帳務資料；將歷史帳務資料輸入至更新的機器學習模型以產生估計雲端服務費用；判斷雲端服務費用是否超過估計雲端服務費用；以及響應於雲端服務費用超過估計雲端服務費用而輸出告警訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An abnormal detection system and an abnormal detection method of public cloud service are provided. The method includes: performing reinforcement learning algorithm on a machine learning model to determine a hyperparameter of the machine learning model, and updating the machine learning model according to the hyperparameter; receiving historical cloud service billing details from a public cloud server, and performing pre-processing to the historical cloud service billing details to obtain historical billing data; inputting the historical billing data to the updated machine learning model to generate estimated cloud service fees; determining whether cloud service fees exceeds the estimated cloud service fees; and outputting an alarm message in response to the cloud service fees exceeding the historical cloud service fees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301,S302,S303,S304,S305:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="65" publication-number="202632662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其程式化方法</chinese-title>
        <english-title>MEMORY DEVICE AND PROGRAMMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G11C16/06</main-classification>
        <further-classification edition="201601120250501B">G06F12/0866</further-classification>
        <further-classification edition="200601120250501B">G06F11/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHAO-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置及其程式化方法被提出。記憶體裝置例如為三維反及式快閃記憶體，且提供高性能以及高容量的儲存媒介。程式化方法包括：在記憶體裝置的多個記憶平面的第一程式化動作後，對記憶體裝置的各記憶平面執行程式化驗證動作；對記憶體裝置的各記憶平面執行第二程式化動作，並伴隨第二程式化動作執行錯誤位元數檢測動作，以判斷出記憶平面中的至少一已通過驗證記憶平面；以及，關閉至少一已通過記憶平面的存取操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and a programming method thereof are provided. The memory device is, for example a three dimensional NAND flash memory circuit, and provides a storage media with high-performance and high-capacity. The programming method includes: after a first program operation on a plurality of memory planes of the memory device, performing a program verify operation on each of the memory planes; performing a second program operation on each of the memory planes of the memory device, and performing an error bit count detection operation accompanying the second program operation to determine at least one verified plane of the memory planes; and disabling accessing operation on the at least one verified plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="66" publication-number="202631485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101756</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負壓吸取裝置</chinese-title>
        <english-title>NEGATIVE PRESSURE SUCTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250224B">B67D7/02</main-classification>
        <further-classification edition="201001120250224B">B67D7/36</further-classification>
        <further-classification edition="200601120250224B">B60S5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程岱有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSDA MANUFACTURING COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉來誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種負壓吸取裝置，包括：一本體、一閥組件及一負壓產生單元。該本體包含有一閥道、一第一通道、一第二通道與一吸取通道，該閥道於橫向其延伸方向上開設有呈不同軸配置之二通口，該第一通道供氣體進入，一該通口連通該第一通道，另一該通口連通該第二通道，該吸取通道連通該第二通道；該閥組件包含有一閥體與一第一氣密件，該閥體可移動於一連通位置與一阻斷位置地設於該閥道，該閥體與該閥道共同界定有一連通空間，該第一氣密件設於該閥體，當該閥組件位於該連通位置時，該連通空間分別連通該二通口，當該閥組件位於該阻斷位置時，該第一氣密件介於該連通空間與至少一該通口之間用以阻斷兩者連通；該負壓產生單元設於該第二通道以承接來自該閥道之氣體，進而產生負壓吸力以令該吸取通道之流體朝向該第二通道流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a negative pressure suction device, comprising: a main body, a valve assembly, and a negative pressure generating unit. The main body includes a valve passage, a first channel, a second channel, and a suction channel. The valve passage is provided with two ports arranged in different axial configurations along its transverse extension direction. The first channel allows gas to enter, one of the ports communicates with the first channel, and the other port communicates with the second channel. The suction channel is connected to the second channel. The valve assembly includes a valve body and a first sealing member. The valve body is movable between a connection position and a blocking position within the valve passage. The valve body and the valve passage together define a connection space. The first sealing member is disposed on the valve body. When the valve assembly is in the connection position, the connection space communicates with both ports. When the valve assembly is in the blocking position, the first sealing member is located between the connection space and at least one of the ports to block their communication. The negative pressure generating unit is arranged in the second channel to receive gas from the valve passage, thereby generating negative pressure suction to cause the fluid in the suction channel to flow toward the second channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">21:閥體</p>
        <p type="p">51:進氣接頭</p>
        <p type="p">6:真空式水箱水更換器</p>
        <p type="p">61:更換總成</p>
        <p type="p">62:壓力錶</p>
        <p type="p">63:連通主體</p>
        <p type="p">64:氣閥組</p>
        <p type="p">65:水箱閥組</p>
        <p type="p">66:輸送組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="67" publication-number="202632961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨社群媒體直播銷售方法及系统</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250401B">H04N21/2668</main-classification>
        <further-classification edition="201101120250401B">H04N7/173</further-classification>
        <further-classification edition="202301120250401B">G06Q30/06</further-classification>
        <further-classification edition="201201120250401B">G06Q20/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸意志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬維爾京群島商創意點子數位股份有限公司(Ｂ　Ｖ　Ｉ)</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAVO IDEAS DIGITAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸意志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跨社群媒體直播銷售方法及系统，包含一伺服裝置，及一通過該伺服裝置與數個社群媒體相互通訊且能夠被一直播主操作的直播裝置。該直播裝置能夠獲取一用於生成一商品圖像的圖像數據、一相關於該商品圖像的交易網址、一用於生成一第一動態影像的第一影音數據，及能夠接收數個由該伺服裝置所獲取且來自不同的社群媒體的交流數據。每一該交流數據用於生成一觀眾留言。該直播裝置能夠呈現該等社群媒體的所有觀眾留言，且能夠傳送構成一流媒體的數據給該伺服裝置，再通過該伺服裝置傳送該流媒體給所有的社群媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:社群媒體</p>
        <p type="p">5:電子裝置</p>
        <p type="p">6:伺服裝置</p>
        <p type="p">7:直播裝置</p>
        <p type="p">72:觸控屏</p>
        <p type="p">8:控制介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="68" publication-number="202631321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾頭接桿</chinese-title>
        <english-title>ANGLED TOOL CONNECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">B25B13/06</main-classification>
        <further-classification edition="200601120250224B">B25B23/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薪螢企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN YING ENTPR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種夾頭接桿，包括：一殼體，包括一身部及一橫向連接於該身部之頭部；一軸桿，可轉動地插設於該身部，包括相對之一第一端部及一第二端部，該第一端部供與一第一工具組接；及一套接組件，包括一可轉動地插設於該頭部之驅動套件、以及一可脫離地套設於該驅動套件之外套件，該驅動套件與該第二端部同轉動地相連接，該驅動套件供一第二工具插接，該外套件位於遠離該驅動套件之一側設有至少一第一磁件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An angled tool connecting device includes: a housing including a body portion and a head portion transversely connected to the body portion; a shaft rotatably inserted in the body portion and including a first end portion for connecting with a first tool assembly and a second end portion; a socket assembly including a drive sleeve rotatably inserted in the head portion, and an outer sleeve removably disposed around the drive sleeve, the drive sleeve being rotatably connected to and rotatable with the second end portion of the shaft and being configured to receive a second tool, the second tool being configured to receive a driven workpiece, the outer sleeve including at least one magnetic member disposed on a side thereof remote from the drive sleeve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:夾頭接桿</p>
        <p type="p">10:殼體</p>
        <p type="p">11:身部</p>
        <p type="p">12:頭部</p>
        <p type="p">20:軸桿</p>
        <p type="p">30:套接組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="69" publication-number="202632498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子系統及電子系統執行方法</chinese-title>
        <english-title>ELECTRONIC SYSTEM AND ELECTRONIC SYSTEM EXECUTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F11/07</main-classification>
        <further-classification edition="201801120250401B">G06F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾彥綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YEN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴祈財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHI-TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子系統執行方法，藉由一電子系統來實施，該電子系統包含一基板管理控制器及一可程式化邏輯單元，該可程式化邏輯單元可依一第一位址執行一第一工作模式及可依一第二位址執行一第二工作模式，並包含：(A)　該基板管理控制器傳送一低準位訊號或一高準位訊號至該可程式化邏輯單元；(B) 該可程式化邏輯單元判定是否接收到該高準位訊號；(C) 當判定為否時，該可程式化邏輯單元將該第一位址作為一待執行位址；(D) 當判定為是時，該可程式化邏輯單元將該第二位址作為該待執行位址。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic system execution method is implemented by an electronic system. The electronic system includes a BMC and a CPLD. The CPLD execute a first task mode according to a first address. The CPLD execute a second task mode according to a second address, and includes: (A) The BMC sends a low-level signal or a high-level signal to the CPLD; (B) The CPLD determines whether the high-level signal is received; (C) When the CPLD detects the low-level signal, the CPLD uses the first address as an address to be executed; (D) When the CPLD detects the high-level signal, the CPLD uses the second address as the address to be executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="70" publication-number="202633232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>漸層式混合微型發光二極體晶片之顯示器</chinese-title>
        <english-title>DISPLAY HAVING GRADUALLY MIXED MICRO LED CHIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250508B">H10H29/30</main-classification>
        <further-classification edition="202501120250508B">H10H29/37</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞利光智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYLEIGH VISION INTELLIGENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種漸層式混合微型發光二極體晶片之顯示器。該顯示器包含一基板及複數個微型發光二極體晶片。該基板包含至少一個主要區域，其中該主要區域包含沿一第一方向排列之複數次要區域，各該次要區域係沿與該第一方向垂直之一第二方向延伸。該複數個微型發光二極體晶片依照一光學特性上複數個等級分別歸屬於複數個晶片群， 該複數個晶片群根據該複數個等級之順序分別設置於該複數次要區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display having gradually mixed micro LED chips is provided. The display comprises a substrate and a plurality of micro LED chips. The substrate comprises at least one main region, wherein the at least one main region comprises a plurality of sub regions which are arranged along a first direction. Each of the sub regions extends along a second direction perpendicular to the first direction. The plurality of micro LED chips respectively attributed to a plurality of groups according to a plurality of grades in an optical characteristic. The plurality of chip groups are respectively disposed within the plurality of sub regions based on the sequence of the plurality of grades.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示器</p>
        <p type="p">11:基板</p>
        <p type="p">13:微型發光二極體晶片</p>
        <p type="p">11A:主要區域</p>
        <p type="p">111~119:次要區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="71" publication-number="202631851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含熱塑性聚胺酯及氧化石墨烯的複合材料、其用途及製造方法</chinese-title>
        <english-title>COMPOSITE MATERIAL CONTAINING THERMOPLASTIC POLYURETHANE AND GRAPHENE OXIDE, USE AND MANUFACTRING MEYHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C08K3/04</main-classification>
        <further-classification edition="200601120250501B">C08L75/04</further-classification>
        <further-classification edition="200601120250501B">C08J3/20</further-classification>
        <further-classification edition="200601120250501B">H01B7/02</further-classification>
        <further-classification edition="200601120250501B">H01B7/18</further-classification>
        <further-classification edition="200601120250501B">H01B7/42</further-classification>
        <further-classification edition="200601120250501B">H01B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太平洋電線電纜股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PACIFIC ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃修騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳守傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHOU JEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含熱塑性聚胺酯及氧化石墨烯的複合材料及其用於製造電纜的用途，藉由於熱塑性聚胺酯中添加氧化石墨烯來達到同時具有優異的機械性質及散熱性的優點，並且以其製造的電纜具有良好的安全性及長壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a composite material containing thermoplastic polyurethane and graphene oxide having excellent mechanical properties and heat dissipation at the same time by adding graphene oxide into thermoplastic polyurethane and a use thereof, and a cable made from the composite material can have good safety and long lifespan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="72" publication-number="202632829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護電路及嵌入式多晶片系統</chinese-title>
        <english-title>PROTECTION CIRCUIT AND EMBEDDED MULTI-CHIP SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02H7/20</main-classification>
        <further-classification edition="200601120250602B">H02H7/10</further-classification>
        <further-classification edition="200601120250602B">H02H3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏奕惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李思翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種保護電路，包含第一電晶體以及第一比較器。第一電晶體具有第一端、第二端及控制端，用於從第一端接收一輸入訊號，且在一導通狀態下透過第二端輸出一輸出訊號。第一比較器的一輸入端耦接於所述第一電晶體的第一端，另一輸入端用於接收一參考訊號，輸出端耦接於第一電晶體的控制端。第一比較器用於根據所述參考訊號與輸入訊號的比較結果輸出一第一比較訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit includes a first transistor and a first comparator. The first transistor has a first terminal, a second terminal and a control terminal, and is configured to receive an input signal from the first terminal, and output an output signal through the second terminal in a turn-on state. One input terminal of the first comparator is coupled to the first terminal of the first transistor, the other input terminal is configured to receive a reference signal, and the output terminal is coupled to the control terminal of the first transistor. The first comparator is configured to output a first comparison signal according to a comparison result between the reference signal and the input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:保護電路</p>
        <p type="p">11:第一電晶體</p>
        <p type="p">111:第一端</p>
        <p type="p">112:第二端</p>
        <p type="p">113:控制端</p>
        <p type="p">13:第一比較器</p>
        <p type="p">131,132:輸入端</p>
        <p type="p">133:輸出端</p>
        <p type="p">N1,N2,N3:節點</p>
        <p type="p">Vin:輸入訊號</p>
        <p type="p">Vout:輸出訊號</p>
        <p type="p">Vr1:參考訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="73" publication-number="202632943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像監控系統及其影像檢測方法</chinese-title>
        <english-title>IMAGE MONITORING SYSTEM AND IMAGE DETECTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04N7/18</main-classification>
        <further-classification edition="202201120250401B">G06V20/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹鎮毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像監控系統及其影像檢測方法。依據輸出的輸出影像信號提供第一資料校驗碼數值。將第一資料校驗碼數值與驅動電路依據接收到的輸出影像信號提供的第二資料校驗碼數值進行比較，以確認驅動電路所接收到的輸出影像信號的正確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image monitoring system and an image detecting method thereof are provided. A first data check code value is provided according to an output image signal that is output. The first data check code value is compared with a second data check code value provided by a driver circuit according to an output image signal that is received to confirm correctness of the output image signal that is received by the driver circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像監控系統</p>
        <p type="p">102:處理電路</p>
        <p type="p">104:驅動電路</p>
        <p type="p">106:顯示裝置</p>
        <p type="p">108:控制電路</p>
        <p type="p">Sin:輸入影像信號</p>
        <p type="p">Sout:輸出影像信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="74" publication-number="202631186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101776</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＣＬ７拮抗劑或抑制劑用於治療腎臟病或症狀之用途</chinese-title>
        <english-title>USE OF CCL7 ANTAGONIST OR INHIBITOR IN TREATING RENAL DISEASE OR CONDITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">A61K39/395</main-classification>
        <further-classification edition="200601120250801B">C07K16/18</further-classification>
        <further-classification edition="200601120250801B">A61K31/7088</further-classification>
        <further-classification edition="200601120250801B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛生福利部桃園醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAOYUAN GENERAL HOSPITAL, MINISTRY OF HEALTH AND WELFARE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳肇文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JAW-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣智宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種CCL7拮抗劑或抑制劑之用途，其係用於製備治療或預防腎臟病或症狀的醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a use of CCL7 antagonist or inhibitor for manufacture of a pharmaceutical composition for treating or preventing a renal disease or condition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="75" publication-number="202632128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平面窗框軌道</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">E06B3/42</main-classification>
        <further-classification edition="200601120250423B">E06B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是關於一種平面窗框軌道。窗扇能於平面窗框軌道中移動，且具有一導桿。平面窗框軌道具有一窗框、一蓋體及一連動裝置。窗扇的導桿能於窗框中移動。蓋體可上下移動地設置於窗框內。連動裝置設置於窗框中，且具有一底座及一作動板。底座設置於窗框中，且蓋體設置於底座上。作動板樞設於底座上，並具有二推動桿及一連動桿。推動桿分別設置於作動板的兩側。連動桿設置於作動板上，且連接於蓋體，並隨著作動板的樞轉而上下帶動蓋體。藉由，設計有可與窗扇開關一起作動的蓋體，當窗扇開啟時，蓋體可向上移動填補窗框中的導軌的凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:導桿</p>
        <p type="p">10:窗框</p>
        <p type="p">11:第一導軌</p>
        <p type="p">12:第二導軌</p>
        <p type="p">20:蓋體</p>
        <p type="p">30:連動裝置</p>
        <p type="p">33:連動板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="76" publication-number="202631336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能降噪的天篷釘</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">B25C1/10</main-classification>
        <further-classification edition="200601120250418B">B25C1/12</further-classification>
        <further-classification edition="200601120250418B">B25C1/16</further-classification>
        <further-classification edition="200601120250418B">B25C9/00</further-classification>
        <further-classification edition="200601120250418B">B25C11/00</further-classification>
        <further-classification edition="200601120250418B">F16B19/14</further-classification>
        <further-classification edition="200601120250418B">F16B15/00</further-classification>
        <further-classification edition="200601120250418B">G10K11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭新政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭泓成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭新政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭泓成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種能降噪的天篷釘，其能裝設於一火藥槍中並與一火藥撞擊。天篷釘具有一釘體、一阻擋件及一緩衝件。釘體具有一尖端、一尾端及一中段。尖端及尾端為相對兩端，中段位於尖端及尾端之間。尖端的直徑小於中段的直徑，中段的直徑小於尾端的直徑。阻擋件套設於釘體，並位於釘體的尖端及中段之間。緩衝件為抗燃材料。緩衝件套設於釘體的中段，並抵靠於尾端，且緩衝件位於釘體的尾端及阻擋件之間。緩衝件具有複數凸部。凸部間隔形成於彼此，並分別環繞於釘體。凸部使緩衝件的表面凹凸不平，藉此當火藥炸裂時，緩衝件能達到降噪效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:釘體</p>
        <p type="p">11:尖端</p>
        <p type="p">12:尾端</p>
        <p type="p">20:阻擋件</p>
        <p type="p">30:緩衝件</p>
        <p type="p">34:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="77" publication-number="202632590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化粧品成分評估方法、系統及其平台</chinese-title>
        <english-title>EVALUATION METHOD OF COSMETICS, EVALUATION SYSTEM AND EVALUATION PLATFORM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250401B">G06Q50/00</main-classification>
        <further-classification edition="202301120250401B">G06Q10/06</further-classification>
        <further-classification edition="202301120250401B">G06Q30/02</further-classification>
        <further-classification edition="202301120250401B">G06Q30/018</further-classification>
        <further-classification edition="202001120250401B">G06F40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺鹽實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYEN BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪雅萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PO-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張平煇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇永霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種化粧品成分評估方法、系統及其平台，其中，該方法步驟包含: 獲取一產品之一產品資訊及一類別資訊；根據該產品資訊獲取對應之一成分資訊，以該成分資訊進行運算，產生一評估數據；比對該評估數據是否為異常，當該評估數據為異常時，運算該評估數據及該類別資訊，以產生對應之一調整結果；及以該評估數據及該調整結果產生一評估報告。並以評估系統執行該評估方法，使用者可經由評估平台快速獲取對應產品之評估報告，以此得到精準且客觀之評估報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an evaluation method of cosmetics, an evaluation system and an evaluation platform thereof. The evaluation method comprises: retrieving a product information and a category information of a product; obtaining an ingredient information corresponding to the product information, and computing the ingredient information so as to generate a evaluation data; analyzing the evaluation data to determine whether the evaluation data is abnormal, and generating an adjustment result by computing the evaluation data and the category information if the evaluation data is abnormal; and generating a evaluation report according to the evaluation data and the adjustment result. The evaluation system, by executing the evaluation method, enables the user to obtain a precise and objective evaluation report corresponding to the product through the evaluation platform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
        <p type="p">S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="78" publication-number="202632841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有自適應電流增強功能之穩壓整流器及其操作方法</chinese-title>
        <english-title>REGULATING RECTIFIER WITH ADAPTIVE CURRENT BOOSTING AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250304B">H02J50/20</main-classification>
        <further-classification edition="201601120250304B">H02J50/10</further-classification>
        <further-classification edition="200601120250304B">H02M1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉子寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TZU-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾益安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AI, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉季瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種穩壓整流器及其操作方法。穩壓整流器包括輸出開關電路、儲能開關電路、儲能電容以及交叉開關電路。在充電模式，輸出開關電路與交叉開關電路共同形成整流電路，以將無線充電感應線圈所接收的無線電能轉換為輸出電能。在電流增強模式，輸出開關電路、儲能開關電路與交叉開關電路共同執行迭代操作（包括直流直流轉換與交流直流轉換）。直流直流轉換利用儲能電容的電能對無線充電感應線圈進行電流增強。交流直流轉換將無線充電感應線圈的無線電能轉換為輸出電能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a regulating rectifier and an operating method thereof. The regulating rectifier includes an output switch circuit, an energy storage switch circuit, an energy storage capacitor and a crossbar switch circuit. In a charging mode, the output switch circuit and the crossbar switch circuit together form a rectifier circuit to convert the wireless power received by a wireless charging induction coil into output power. In a current boosting mode, the output switch circuit, the energy storage switch circuit and the crossbar switch circuit jointly perform iterative operations (including DC-DC conversion and AC-DC conversion). The DC-DC conversion uses the electric energy of the energy storage capacitor to enhance the current of the wireless charging induction coil. The AC-DC conversion converts the wireless power of the wireless charging induction coil into the output power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="79" publication-number="202632610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於人臉特徵的影像生成系統及方法</chinese-title>
        <english-title>IMAGE GENERATION SYSTEM AND METHOD BASED ON FACIAL FEATURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V40/16</main-classification>
        <further-classification edition="202201120250401B">G06V10/20</further-classification>
        <further-classification edition="202201120250401B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江庭輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於人臉特徵的影像生成系統及方法。所述方法包括以下步驟：利用第一人臉關鍵點座標集合以及音訊特徵來獲得第二人臉關鍵點座標集合，其中第二人臉關鍵點座標集合對應於時間序列；利用第二人臉關鍵點座標集合來獲得第三人臉關鍵點座標集合，其中第三人臉關鍵點座標集合包括缺失人臉關鍵點座標；利用人臉圖像以及第三人臉關鍵點座標集合來獲得渲染後人臉圖像序列；利用渲染後人臉圖像序列以及驅動音訊來獲得生成影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image generation system and method based on a facial feature are provided. The method includes following steps: using a first face key point coordinate set and an audio feature to obtain a second face key point coordinate set, wherein the second face key point coordinate set corresponds to a time series; using the second face key point coordinate set to obtain a third face key point coordinate set, wherein the third face key point coordinate set includes a missing face key point coordinate; using a face image and the third face key point coordinate set to obtain a rendered face image sequence; and using the rendered face image sequence and a driver audio to obtain a generated image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21、S22、S23、S24、S25、S26:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="80" publication-number="202631166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提升睡眠品質之組合物以及用途</chinese-title>
        <english-title>COMPOSITION FOR IMPROVING SLEEP QUALITY AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250801B">A61K35/745</main-classification>
        <further-classification edition="201501120250801B">A61K35/747</further-classification>
        <further-classification edition="200601120250801B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益佳元生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PBMED BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PEI SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡顥騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HAO TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭仲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUNG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王笠荏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周定立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, DING LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭丞恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHENG EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YAO TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱敏熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MIN HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡蕙芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HUI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於提升睡眠品質之組合物包含乳酸菌菌株以及載劑。乳酸菌菌株包含經分離之短雙歧桿菌 (        &lt;i&gt;Bifidobacterium breve&lt;/i&gt;) BBr-28菌株、動物雙歧桿菌乳亞種 (        &lt;i&gt;Bifidobacterium animalis&lt;/i&gt;subsp.        &lt;i&gt;lactis&lt;/i&gt;) PS23菌株、長雙歧桿菌嬰兒亞種 (        &lt;i&gt;Bifidobacterium longum&lt;/i&gt;subsp.        &lt;i&gt;infantis&lt;/i&gt;) BR631菌株、兩歧雙歧桿菌 (        &lt;i&gt;Bifidobacterium bifidum&lt;/i&gt;) BD-188菌株以及植物乳植桿菌 (        &lt;i&gt;Lactiplantibacillus plantarum&lt;/i&gt;) PQQ-1菌株，上述菌株均寄存於財團法人食品工業發展研究所。同時亦揭露一種乳酸菌菌株在製備用於提升睡眠品質之組合物之用途。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition for improving sleep quality includes lactic acid bacteria strains and a carrier. The lactic acid bacteria strains include isolated        &lt;i&gt;Bifidobacterium breve&lt;/i&gt;BBr-28,        &lt;i&gt;Bifidobacterium animalis&lt;/i&gt;subsp.        &lt;i&gt;lactis&lt;/i&gt;PS23,        &lt;i&gt;Bifidobacterium longum&lt;/i&gt;subsp.        &lt;i&gt;infantis&lt;/i&gt;BR631,        &lt;i&gt;Bifidobacterium bifidum&lt;/i&gt;BD-188 and        &lt;i&gt;Lactiplantibacillus plantarum&lt;/i&gt;PQQ-1, all of which are deposited at the Food Industry Research and Development Institute. A use of a lactic acid bacteria strain in preparing a composition for improving sleep quality is also disclosed.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="81" publication-number="202631167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提升睡眠品質之組合物以及用途</chinese-title>
        <english-title>COMPOSITION FOR IMPROVING SLEEP QUALITY AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250801B">A61K35/745</main-classification>
        <further-classification edition="201501120250801B">A61K35/747</further-classification>
        <further-classification edition="200601120250801B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益佳元生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PBMED BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PEI SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡顥騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HAO TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭仲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUNG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王笠荏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周定立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, DING LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭丞恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHENG EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YAO TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱敏熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MIN HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡蕙芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HUI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於提升睡眠品質之組合物包含乳酸菌菌株以及載劑。乳酸菌菌株包含經分離之短雙歧桿菌 (        &lt;i&gt;Bifidobacterium breve&lt;/i&gt;) BBr-28菌株、動物雙歧桿菌乳亞種 (        &lt;i&gt;Bifidobacterium animalis&lt;/i&gt;subsp.        &lt;i&gt;lactis&lt;/i&gt;) PS23菌株、長雙歧桿菌嬰兒亞種 (        &lt;i&gt;Bifidobacterium longum&lt;/i&gt;subsp.        &lt;i&gt;infantis&lt;/i&gt;) BR631菌株以及副乾酪乳酪桿菌 (        &lt;i&gt;Lacticaseibacillus paracasei&lt;/i&gt;) BR176菌株，上述菌株均寄存於財團法人食品工業發展研究所。同時亦揭露一種乳酸菌菌株在製備用於提升睡眠品質之組合物之用途。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition for improving sleep quality includes lactic acid bacteria strains and a carrier. The lactic acid bacteria strains include isolated        &lt;i&gt;Bifidobacterium breve&lt;/i&gt;BBr-28,        &lt;i&gt;Bifidobacterium animalis&lt;/i&gt;subsp.        &lt;i&gt;lactis&lt;/i&gt;PS23,        &lt;i&gt;Bifidobacterium longum&lt;/i&gt;subsp.        &lt;i&gt;infantis&lt;/i&gt;BR631 and        &lt;i&gt;Lacticaseibacillus paracasei&lt;/i&gt;BR176, all of which are deposited at the Food Industry Research and Development Institute. A use of a lactic acid bacteria strain in preparing a composition for improving sleep quality is also disclosed.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="82" publication-number="202632573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自助點餐推薦系統及其方法</chinese-title>
        <english-title>SELF-SERVICE ORDERING RECOMMENDATION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q30/0203</main-classification>
        <further-classification edition="201201120250401B">G06Q50/12</further-classification>
        <further-classification edition="202301120250401B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正修學校財團法人正修科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG SHIU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李迦恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種自助點餐推薦系統，包含：一餐廳搜尋模組、一評論文字擷取模組、一自然語言處理模組、一評分計算模組、一餐點推薦模組及一系統整合模組，其中評分計算模組根據對應到的正向關鍵字的分數或負向關鍵字的分數對每個食用心得關鍵字進行給分，並且將複數個食用心得關鍵字的分數進行統計，以獲得餐廳之複數個餐點的評分結果，並且自複數個餐點的評分結果中產生一餐點正向評分列表，以供使用者餐點選擇的參考。本發明還公開了一種自助點餐推薦方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A self-service ordering recommendation system is disclosed by the present disclosure. The self-service ordering recommendation system comprises a restaurant search module, a review text acquisition module, a natural language processing module, a scoring calculation module, a meal recommendation module and a system integration module. A score is assigned to each one of dining experience keywords by the scoring calculation module according to a score of a corresponding positive keyword or a score of a negative keyword, and the scores of the dining experience keywords are calculated, thereby generating a scoring result of a plurality of meals of a restaurant, so as to obtain a meal positive scoring list from the scoring result of the plurality of meals as a reference for a user for a selection of a meal. A self-service meal ordering recommendation method is further provided by the present disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:餐廳搜尋模組</p>
        <p type="p">20:評論文字擷取模組</p>
        <p type="p">30:自然語言處理模組</p>
        <p type="p">40:評分計算模組評分計算模組</p>
        <p type="p">50:餐點推薦模組</p>
        <p type="p">60:系統整合模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="83" publication-number="202632691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速組裝共模濾波器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250604B">H01F17/04</main-classification>
        <further-classification edition="200601120250604B">H01F27/30</further-classification>
        <further-classification edition="200601120250604B">H03H7/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西北臺慶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申寶琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒勵志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪振雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快速組裝共模濾波器，其包含：一基板；複數個板體，該複數個板體包含一中隔板及複數個分隔板，該中隔板設於該基板的中央，該複數個分隔板相對於該中隔板間隔設置或鄰近設置，共同圍繞出一第一容置區及一第二容置區；以及複數個電感，該複數個電感分別設於該第一容置區及該第二容置區。藉由該中隔板及複數個分隔板共同圍繞出該第一容置區及該第二容置區，以確定該複數個電感設置在該基板上的正確位置，使該複數個電感在組裝時，能快速且精確地定位於該基板，達到最佳性能和製造效率，又因為能精確地定位於該基板，所以形成自動化設備作業達到方便、迅速、省時、省工之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">11:第一容置區</p>
        <p type="p">12:第二容置區</p>
        <p type="p">2:板體</p>
        <p type="p">21:中隔板</p>
        <p type="p">22:第一子分隔板</p>
        <p type="p">3:電感</p>
        <p type="p">D:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="84" publication-number="202632032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濺鍍之遮罩移除方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C14/22</main-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>典泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANTAI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱文慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林松柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種濺鍍之遮罩移除方法：先將帶有一次性遮罩的基板傳輸到預先設定位置；然後，貼膠模組下壓，以膠帶黏著單顆遮罩；真空吸附膠帶；接著，貼膠模組上抬，遮罩附著膠帶，離開基板；再將無遮罩的基板輸送到下一個位置。如此，本方法能克服一次性遮罩的移除所遭遇的難題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:「將帶有一次性遮罩的基板傳輸到預先設定位置」</p>
        <p type="p">11:「貼膠模組下壓，以膠帶黏著單顆遮罩」</p>
        <p type="p">12:「貼膠模組上抬，遮罩附著膠帶，離開基板」</p>
        <p type="p">13:「檢測基板是否殘留遮罩」</p>
        <p type="p">14:「基板移到排除位置，殘留遮罩被下料夾爪模組移除」</p>
        <p type="p">15:「將無遮罩的基板輸送到下一個位置」</p>
        <p type="p">18:「真空吸附膠帶」</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="85" publication-number="202631025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>果粒剝殼裝置</chinese-title>
        <english-title>FRUIT SHELLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250531B">A23N4/02</main-classification>
        <further-classification edition="200601120250531B">A23N7/08</further-classification>
        <further-classification edition="200601120250531B">A23N5/00</further-classification>
        <further-classification edition="200601120250531B">A23N15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立宜蘭大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ILAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁辰瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHEN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃晨崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種果粒剝殼裝置，主要包括：一座體、一輸送機構以及一推壓機構所構成；該座體具有底座及頂座；該輸送機構係設置於該底座上，用以驅動輸送帶輸送果粒，且該輸送帶下方設有下支撐體；該推壓機構係固定於該頂座上，包含保持裝置與活動裝置，該活動裝置相對該保持裝置底端可滑動，並由彈性組件對該活動裝置施加彈性推力，該活動裝置底側設有上支撐體，並在該上支撐體與該下支撐體之間形成加工通道，該上支撐體的底面設有刀刃，該加工通道允許該果粒通過並受到彈性抵壓，使該刀刃對果粒殼體進行切割，而該下支撐體則在彈力作用下壓碎已切割的果粒殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fruit shelling device primarily comprises a base structure, a conveying mechanism, and a pressing mechanism. The base structure includes a bottom base and a top base. The conveying mechanism is mounted on the bottom base to drive a conveyor belt for transporting fruit grains, and a lower support body is positioned beneath the conveyor belt. The pressing mechanism is fixed on the top base and consists of a holding device and a movable device. The movable device can slide relative to the bottom end of the holding device and is subjected to elastic pushing force by an elastic component. The bottom side of the movable device is equipped with an upper support body, forming a processing channel between the upper support body and the lower support body. The bottom surface of the upper support body is fitted with a blade. The processing channel allows fruit grains to pass through and be elastically pressed, enabling the blade to cut the fruit shells. The lower support body, under elastic force, crushes the cut fruit shells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:座體</p>
        <p type="p">11:底座</p>
        <p type="p">12:頂座</p>
        <p type="p">13:第一軸支撐座</p>
        <p type="p">14:第一調節槽</p>
        <p type="p">2:輸送機構</p>
        <p type="p">211:主動滾筒</p>
        <p type="p">212:從動滾筒</p>
        <p type="p">22:輸送帶</p>
        <p type="p">23:下支撐體</p>
        <p type="p">3:推壓機構</p>
        <p type="p">31:保持裝置</p>
        <p type="p">311:固定板</p>
        <p type="p">32:活動裝置</p>
        <p type="p">321:滑軌</p>
        <p type="p">322:滑塊</p>
        <p type="p">33:彈性組件</p>
        <p type="p">331:延伸桿</p>
        <p type="p">332:彈簧</p>
        <p type="p">333:調整件</p>
        <p type="p">34:上支撐體</p>
        <p type="p">36:第二調節槽</p>
        <p type="p">37:限位元件</p>
        <p type="p">38:下極限元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="86" publication-number="202632138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>臥式水輪機</chinese-title>
        <english-title>HORIZONTAL TURBINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">F03B17/06</main-classification>
        <further-classification edition="200601120250423B">F03B3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊懋聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊懋聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種臥式水輪機，具有一主體設於一基座上，該主體的直徑方向與一水面平行，一阻擋結構設置於該基座，該阻擋結構的二端側義為一收槳部及一下槳部，當輪葉結構的葉片轉動接觸到該收槳部時，葉片會沿著該收槳部向上收折至一第一位置；當葉片轉動到該下槳部時，葉片離開該阻擋結構並向下展開至一第二位置，本發明藉由使葉片於第一位置及第二位置之間變化，確保在不同的水流條件下均能最大化水流的動能利用，能有效減少水流阻力並增強動能轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A horizontal water turbine includes a main body mounted on a base, with its diameter direction parallel to a water surface. A blocking structure is positioned on the base, with two sides defined as a blade-receiving section and a blade-releasing section. When the blade of the turbine structure rotates into contact with the blade-receiving section, the blade folds upward into a first position. As it rotates to the blade-releasing section, the blade leaves the blocking structure and unfolds downward into a second position. This design allows the blade to shift between the first and second positions, ensuring optimal utilization of water flow kinetic energy under varying flow conditions, effectively reducing water resistance and enhancing energy conversion efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主體</p>
        <p type="p">111:轉動軸</p>
        <p type="p">112:定位座</p>
        <p type="p">12:輪葉結構</p>
        <p type="p">15:連接組件</p>
        <p type="p">20:基座</p>
        <p type="p">201:定位部</p>
        <p type="p">202:輪葉容納部</p>
        <p type="p">21:阻擋結構</p>
        <p type="p">W:水面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="87" publication-number="202631424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AI電子後視鏡</chinese-title>
        <english-title>AI ELECTRONIC REARVIEW MIRROR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250325B">B60W30/08</main-classification>
        <further-classification edition="200601120250325B">B60W30/14</further-classification>
        <further-classification edition="201201120250325B">B60W40/08</further-classification>
        <further-classification edition="202001120250325B">B60W50/08</further-classification>
        <further-classification edition="200601120250325B">B60R1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝捷光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANJET TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佶鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有邊緣運算裝置之AI電子後視鏡，其中邊緣運算裝置至少包含神經處理單元及AI模型耦合至神經處理單元，透過神經處理單元與AI模型提供邊緣運算輔助智能駕駛，其中AI模型包含人工智慧駕駛輔助模型，以利提高駕駛安全性。上述人工智慧駕駛模型包含先進駕駛輔助系統、駕駛管理系統、乘客管理系統之一或其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an AI Dashcam including an edge computing device, wherein the edge computing device includes an NPU and an AI model coupled to the NPU. The AI model and the NPU provide the edge computing for intelligence driving assistance, wherein the AI model includes an artificial intelligence driving assistance model for improving driving safety. The artificial intelligence driving assistance includes ADAS, DMS, OMS or the combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1040:記憶體</p>
        <p type="p">1041:處理器</p>
        <p type="p">1042:感應器</p>
        <p type="p">1043:G-感應器</p>
        <p type="p">1045:通訊模組</p>
        <p type="p">1046:AI模型</p>
        <p type="p">1047:輸入單元</p>
        <p type="p">1048:輸出單元</p>
        <p type="p">1049:GPS模組</p>
        <p type="p">1050:邊緣運算裝置</p>
        <p type="p">1052:AI加速電路</p>
        <p type="p">1053:記憶體</p>
        <p type="p">1054:神經處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="88" publication-number="202632139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立式水輪機</chinese-title>
        <english-title>VERTICAL TURBINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F03B17/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊懋聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊懋聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種立式水輪機，其主體的直立方向與水面垂直，包含轉動軸與多組輪葉結構。每組輪葉結構透過支撐架連接於轉動軸，並在水流推動下帶動轉動軸旋轉。輪葉結構包含兩個固定葉片與一個活動葉片，該活動葉片具有寬度較厚的連接部及寬度較窄的導流部設計，以減少末端與水流的接觸面積，從而降低水流阻力及渦流生成。本發明不僅提升水輪機的能量產出效率，亦降低運行能耗，實現高效的能源轉換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vertical water turbine with its upright direction perpendicular to the water surface, comprising a rotating shaft and multiple blade assemblies. Each blade assembly is connected to the rotating shaft through a support frame, enabling the shaft to rotate under water flow. Each assembly includes two fixed blades and one movable blade. The movable blade features a thick connection section and a narrower flow-directing section, reducing the end contact area with water, thereby minimizing water resistance and vortex formation. The present application enhances energy output efficiency, reduces operational energy consumption, and achieves efficient energy conversion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主體</p>
        <p type="p">13:轉動軸</p>
        <p type="p">152:輪葉轉軸</p>
        <p type="p">153:固定葉片</p>
        <p type="p">154:活動葉片</p>
        <p type="p">17:輸出齒輪組</p>
        <p type="p">21:固定架</p>
        <p type="p">W:水面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="89" publication-number="202632411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>地面型攝像機構</chinese-title>
        <english-title>GROUND CAMERA MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250801B">G03B17/08</main-classification>
        <further-classification edition="200601120250801B">G08G1/017</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼采實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIETZSCHE ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIH-MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地面型攝像機構，係用以對靠近地面之被攝物進行攝像，該地面型攝像機構係具有主體部、容置槽以及頂罩部，該容置槽係容置該主體部，該頂罩部係將該主體部的頂部覆蓋，且該主體部係具備內筒部、內蓋部，該內蓋部係用以將該內筒部的頂部覆蓋，該內筒部係具有：往上方開口的上凹槽，該上凹槽係形成容置攝像模組之容置空間的至少一部分；以及第一筒身部，係沿一方向延伸並形成該上凹槽；該主體部還具有：第二筒身部，係電池盒，用以對該地面型攝像機構供應電力，且係以可拆裝的方式裝設於該內筒部，其中，該第一筒身部的底部係設有止擋件，該止擋件係橫向延伸，以托承該第二筒身部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ground-type camera mechanism is used to photograph objects close to the ground. The ground-type camera mechanism has a main body, a receptacle and a roof cover. The receptacle accommodates the main body. The roof cover covers the top of the main body, and the main body is provided with an inner barrel and an inner cover. The inner cover is used to cover the top of the inner barrel. The inner barrel has: An upper recess with an upper opening, the upper recess forms at least a part of the accommodation space for accommodating the camera module; and a first barrel portion extends in one direction and forms the upper recess; the main body portion also It has: a second barrel portion, which is a battery box, used to supply power to the ground-type camera mechanism, and is detachably installed on the inner barrel, wherein the bottom of the first barrel portion is provided with a stopper, and the stopper extends laterally to support the second barrel portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主體部</p>
        <p type="p">14:內蓋部</p>
        <p type="p">16:提把部</p>
        <p type="p">20:內筒部</p>
        <p type="p">20b:第一筒身部</p>
        <p type="p">20h:頭部</p>
        <p type="p">20LR:下凹槽</p>
        <p type="p">20UR:上凹槽</p>
        <p type="p">22:支架</p>
        <p type="p">22w:翼片</p>
        <p type="p">34:第二筒身部</p>
        <p type="p">321:止擋部</p>
        <p type="p">CM:攝像模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="90" publication-number="202631330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立式棘輪工具結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">B25B15/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商浙江斐凌工具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHEJIANG FEILING TOOLS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種立式棘輪工具結構，其包括一制動座、一制動組件、一旋轉軸以及一切控件，該制動容室之內環壁係交錯凸設有二相對稱之擋部、一第一卡抵部以及一第二卡抵部，該第一卡抵部與該第二卡抵部非對稱具有一偏差角度，且二該擋部與該第一、第二卡抵部間界定出四制動空間以供該制動組件安裝，利用該制動座之第一卡抵部與第二卡抵部之偏差角度設計，使得兩兩對稱之二該制齒件間具有半齒的差距，俾能擇一瞬間與該棘輪形成齒合帶動狀態，有助於提升所述制齒件的作動準確度，從而達到小角度快速齒合驅動之目的，同時具有收納、攜帶方便以及使用輕量化之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:制動座</p>
        <p type="p">11:制動容室</p>
        <p type="p">111:第一定位槽</p>
        <p type="p">112:第二定位槽</p>
        <p type="p">113:第三定位槽</p>
        <p type="p">12:組合部</p>
        <p type="p">121:通槽</p>
        <p type="p">14:擋部</p>
        <p type="p">15:第一卡抵部</p>
        <p type="p">16:第二卡抵部</p>
        <p type="p">17:制動空間</p>
        <p type="p">20:制動組件</p>
        <p type="p">21:制齒件</p>
        <p type="p">211:制齒部</p>
        <p type="p">212:靠接部</p>
        <p type="p">22:彈性件</p>
        <p type="p">30:旋轉軸</p>
        <p type="p">31:軸部</p>
        <p type="p">311:工具孔</p>
        <p type="p">312:中心軸柱</p>
        <p type="p">313:第一環槽</p>
        <p type="p">314:C形扣</p>
        <p type="p">315:第二環槽</p>
        <p type="p">316:C形扣</p>
        <p type="p">32:棘輪</p>
        <p type="p">321:棘齒</p>
        <p type="p">40:切控件</p>
        <p type="p">401:大徑段</p>
        <p type="p">402:小徑段</p>
        <p type="p">41:中心軸孔</p>
        <p type="p">42:第一阻擋塊</p>
        <p type="p">43:第二阻擋塊</p>
        <p type="p">44:穿孔</p>
        <p type="p">45:彈性件</p>
        <p type="p">46:定位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="91" publication-number="202633054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋動式固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">F16B21/02</main-classification>
        <further-classification edition="200601120250414B">F16B5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種旋動式固定裝置，係於基座之組裝空間一側設有容置空間，以供組裝空間與容置空間呈層疊狀，並於容置空間內設有開關鍵，且開關鍵之按壓側露出容置空間外部，而開關鍵處設有定位件可縱向活動進出組裝空間，再於組裝空間處組裝把手之扣持件，則於扣持件處活動組裝輔助鉤件，扣持件一側連接之柄部為延伸至基座外部，可透過操作基座的開關鍵解除限位後，再扳動把手的柄部帶動輔助鉤件及扣持件位於基座的組裝空間處活動位移，達到方便操作固定裝置的鎖固或解鎖之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">10:組裝空間</p>
        <p type="p">101:限位槽</p>
        <p type="p">102:止擋凸塊</p>
        <p type="p">1021:止擋凹槽</p>
        <p type="p">100:容置空間</p>
        <p type="p">1001:蓋板</p>
        <p type="p">1002:鎖固螺釘</p>
        <p type="p">1003:槽口</p>
        <p type="p">1004:壁板</p>
        <p type="p">1005:定位通孔</p>
        <p type="p">11:開關鍵</p>
        <p type="p">110:滑槽</p>
        <p type="p">1101:通道</p>
        <p type="p">111:按壓側</p>
        <p type="p">113:復位彈性件</p>
        <p type="p">12:定位件</p>
        <p type="p">120:卡制孔</p>
        <p type="p">121:彈性抵持件</p>
        <p type="p">122:滑動桿</p>
        <p type="p">123:定位桿體</p>
        <p type="p">13:軸桿</p>
        <p type="p">131:彈性件</p>
        <p type="p">1311:鉤部</p>
        <p type="p">1312:抵持桿</p>
        <p type="p">132:歸位彈性件</p>
        <p type="p">1321:第一卡鉤</p>
        <p type="p">1322:第二卡鉤</p>
        <p type="p">133:螺釘</p>
        <p type="p">2:把手</p>
        <p type="p">21:扣持件</p>
        <p type="p">210:第一軸孔</p>
        <p type="p">211:卡槽</p>
        <p type="p">22:柄部</p>
        <p type="p">23:輔助鉤件</p>
        <p type="p">230:第二軸孔</p>
        <p type="p">231:卡扣孔</p>
        <p type="p">232:鉤體</p>
        <p type="p">24:蓋體</p>
        <p type="p">241:導槽</p>
        <p type="p">2421:聚集部</p>
        <p type="p">243:固定件</p>
        <p type="p">244:限位卡孔</p>
        <p type="p">25:擺動件</p>
        <p type="p">251:滑移桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="92" publication-number="202632130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防水門窗框</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">E06B7/14</main-classification>
        <further-classification edition="200601120250423B">E06B3/96</further-classification>
        <further-classification edition="200601120250423B">E06B3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種防水門窗框，其具有一外框、一卡扣及一內框。外框具有一連接邊。連接邊具有一主板、一第一密封板、一第一密封件及一安裝槽。第一密封板自主板向外框的內側延伸，第一密封件設置於第一密封板遠離主板的一端。安裝槽形成於第一密封板上，並位於主板及第一密封槽之間。卡扣固設於安裝槽中。內框可轉動地設置於連接邊的內側並具有一樞軸部及一外板。樞軸部穿設於卡扣。內框能以樞軸部為軸心相對於外框轉動。外板的一端連接於樞軸部。當門板或窗戶關閉時，外板貼合第一密封件，樞軸部、卡扣及安裝槽能避免水流入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外框</p>
        <p type="p">20:連接邊</p>
        <p type="p">21:主板</p>
        <p type="p">22:第一密封板</p>
        <p type="p">24:第一密封件</p>
        <p type="p">25:安裝槽</p>
        <p type="p">26:第二密封板</p>
        <p type="p">27:第二密封槽</p>
        <p type="p">28:第二密封件</p>
        <p type="p">29:支撐部</p>
        <p type="p">40:內框</p>
        <p type="p">42:外板</p>
        <p type="p">43:內板</p>
        <p type="p">44:門窗本體連接板</p>
        <p type="p">45:門窗本體夾設槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="93" publication-number="202632137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>引擎熄火方法</chinese-title>
        <english-title>ENGINE FLAMEOUT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">F02D41/04</main-classification>
        <further-classification edition="200601120250317B">B60W10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, GUAN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂育廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TO, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種引擎熄火方法，係使用於一機車上，該機車包括有一具有一曲軸之引擎、一電池、一啟動兼發電系統以及引擎控制單元，啟動兼發電系統包括有一驅動控制裝置、一啟動兼發電裝置以及一角度感測裝置，驅動控制裝置電連接電池並可接收角度感測裝置之訊號，啟動兼發電裝置係與曲軸同軸設置，電池與驅動控制裝置之間更電連接一鑰匙開關、一驅動與發電電源開關、一電源自保持開關以及引擎控制單元。其中，透過本發明之引擎熄火方法，使每次引擎在熄火時，最終引擎的曲軸角度可停在相同位置，且於下次駕駛者將鑰匙開關打開準備啟動引擎時，驅動控制裝置可直接控制啟動兼發電裝置正轉，直接於最佳的啟動角度發動引擎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an engine flameout method, which is used on a motorcycle. The motorcycle includes an engine with a crankshaft, a battery, an integrated starter and generator system, and an engine control unit. The integrated starter and generator system includes a driving control device, an integrated starter and generator device and an angle sensing device, the driving control device is electrically connected to the battery and can receive the signal of the angle sensing device, the integrated starter and generator device is coaxially arranged with the crankshaft, and the battery and the driving control device are further electrically connected to a key switch, a driving and generating power switch, a power self-holding switch and an engine control unit. Wherein, through the engine flameout method of the present invention, each time the engine is flameout, the engine crankshaft angle can be stopped at the same position, and the next time the driver turns on the key switch to start the engine, the driving control device can directly control the integrated starter and generator device to rotate forward to start the engine directly at the optimal starting angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A-L:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="94" publication-number="202632226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多軸磁力感測結構</chinese-title>
        <english-title>MULTI-AXIAL MAGNETIC SENSING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01D5/14</main-classification>
        <further-classification edition="200601120250401B">G01C19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴慶瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多軸磁力感測結構，其結構包含：外框，其包含：第一電源輸入端，第二電源輸入端，第一電源輸出端，第二電源輸出端；第一連接組件，其包含：第一撓性件，第二撓性件，第一電容，第二電容；第一軸向運動模組；第二連接組件，其包含：第三電容，第四電容，第三撓性件，第四撓性件；第二軸向運動模組。藉由輸入第一電流並環繞第二軸向運動模組，輸入端輸入第二電流並環繞第一軸向運動模組，使第一軸向運動模組以及第二軸向運動模組能夠依據外部磁場運動，以此便能依據電容值變化取得位移，進而取得磁場強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a multi-axial magnetic sensing structure comprising: a frame comprising: a first power input, a second power input, a first power output, a second power output; a first connection component comprising: a first flexible unit, a second flexible unit, a first capacitor, a second capacitor; a first axial motion module; a second connection component comprising: a third capacitor, a fourth capacitor, a third flexible unit, a fourth flexible unit; a second axial motion module. By inputting a first current and winding around the second axial motion module, and inputting a second current and wrapping around the first axial motion module, the first axial motion module and the second axial motion module are able to move according to the external magnetic field, so as to obtain the displacement according to the change of the value of capacitance, and thus obtain the strength of the magnetic field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二軸磁力感測結構</p>
        <p type="p">10:外框</p>
        <p type="p">12:第一電源輸入端</p>
        <p type="p">14:第二電源輸入端</p>
        <p type="p">16:第一電源輸出端</p>
        <p type="p">17:第二電源輸出端</p>
        <p type="p">20:第一連接組件</p>
        <p type="p">21:第一撓性件</p>
        <p type="p">22:第二撓性件</p>
        <p type="p">23:第一差分電容</p>
        <p type="p">26:第二差分電容</p>
        <p type="p">30:第一軸向運動模組</p>
        <p type="p">40:第二連接組件</p>
        <p type="p">42:第三差分電容</p>
        <p type="p">44:第四差分電容</p>
        <p type="p">46:第三撓性件</p>
        <p type="p">48:第四撓性件</p>
        <p type="p">50:第二軸向運動模組</p>
        <p type="p">S1:第一內側</p>
        <p type="p">S2:第二內側</p>
        <p type="p">S3:第三內側</p>
        <p type="p">S4:第四內側</p>
        <p type="p">S5:第五內側</p>
        <p type="p">S6:第六內側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="95" publication-number="202633481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其基板結構</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/20</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇文偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEN WE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種電子封裝件及其基板結構。該基板結構包含有絕緣層、佈線層、導電盲孔及絕緣保護層，且該導電盲孔之位置係未疊合於該絕緣保護層之開口之邊緣上，以避免於進行探針測試時該絕緣保護層發生應力集中之情況，避免該絕緣保護層發生碎裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an electronic package and substrate structure thereof. The substrate includes an insulating layer, a circuit layers, conductive vias and an insulating protective layer. The conductive via is free from being overlapped with the edge of an opening of the insulating protective layer to avoid stress concentration on the insulating protective layer during probe testing. Therefore, the insulation protective layer does not crack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板結構</p>
        <p type="p">202:導電盲孔</p>
        <p type="p">203:電性接觸墊</p>
        <p type="p">27:絕緣保護層</p>
        <p type="p">270:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="96" publication-number="202632084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鍍掛架之導電線佈線構造及方法</chinese-title>
        <english-title>LEAD WIRE ARRANGEMENT STRUCTURE AND METHOD FOR ELECTROPLATING RACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C25D17/00</main-classification>
        <further-classification edition="200601120250501B">C25D17/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴宓珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, MI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴宓珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, MI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電鍍掛架之導電線佈線構造及方法，該構造包含一主架體，具有絕緣性，並且具有耐蝕性，該主架體凸設至少一支桿；至少一鉤部結合於該支桿，該鉤部上吊掛有一被鍍物；至少一導電線對應連結至該鉤部或該被鍍物。該方法包含至少一導電線連接至電源的一負極；該導電線以並聯的方式連接至該被鍍物；該電源的一正極輸出一電流，該電流通過一電解液，對該被鍍物進行電鍍，該電流通過該導電線，構成一電鍍迴路。藉由該主架體係為絕緣材料所製成，具有耐蝕性，可延長使用壽命，以大幅節省汰換電鍍掛架的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主架體</p>
        <p type="p">11:支桿</p>
        <p type="p">2:鉤部</p>
        <p type="p">3:導電線</p>
        <p type="p">31:夾具</p>
        <p type="p">F:被鍍物</p>
        <p type="p">G:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="97" publication-number="202631094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>約束監控裝置</chinese-title>
        <english-title>RESTRAINT MONITORING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">A61F5/37</main-classification>
        <further-classification edition="200601120250423B">A61B5/22</further-classification>
        <further-classification edition="200601120250423B">G08B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慈濟學校財團法人慈濟大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZU CHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祝君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZU CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游子毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TZU YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIA HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種約束監控裝置，包含一束帶設有第一端及第二端；一第一扣結單元束緊該第一端及該第二端，使該束帶產生一壓力值；一壓力偵測單元偵測該壓力值低於設定值時，發出壓力警示訊號；一位置偵測單元偵測該第一扣結單元之斷開或位移狀態，以發出扣結警示訊號；一控制單元可拆的設置於該束帶，該控制單元訊號連接至該壓力偵測單元及該位置偵測單元，藉以接收該壓力警示訊號及該扣結警示訊號，以發出一警示通知，並傳送到一遠端裝置。藉以可快速包覆於四肢上進行監控。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:束帶</p>
        <p type="p">11:第一端</p>
        <p type="p">12:第二端</p>
        <p type="p">13:墊體</p>
        <p type="p">14:固定帶</p>
        <p type="p">141:公扣具</p>
        <p type="p">142:母扣具</p>
        <p type="p">2:第一扣結單元</p>
        <p type="p">21:黏扣帶</p>
        <p type="p">22:固定環</p>
        <p type="p">3:第二扣結單元</p>
        <p type="p">31:公扣件</p>
        <p type="p">32:母扣件</p>
        <p type="p">33:調整環</p>
        <p type="p">4:壓力偵測單元</p>
        <p type="p">5:位置偵測單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="98" publication-number="202631979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改良菌體培養裝置</chinese-title>
        <english-title>IMPROVED MICROBIAL CULTURE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">C12M1/22</main-classification>
        <further-classification edition="200601120250303B">C12M1/18</further-classification>
        <further-classification edition="202001120250303B">C05F17/20</further-classification>
        <further-classification edition="200601120250303B">B01J20/08</further-classification>
        <further-classification edition="200601120250303B">B01J20/10</further-classification>
        <further-classification edition="200601120250303B">B01J20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種改良菌體培養裝置及其相關製備方法，旨在解決傳統培養裝置操作繁瑣及感染風險高的問題。該裝置包含上蓋、多孔載體、補充管及底座，其中上蓋設有氣孔、植菌孔及補液孔，並配備空氣過濾器及可拆式封閉件，多孔載體披覆營養層且設有補充孔，補充管連接補液孔與補充孔，整體結構便於補充操作且減少污染風險。本揭露還提供牛樟樹發酵肥液的製備方法，通過發酵牛樟樹枝葉與醣類生成液態肥；以及多孔載體的燒製方法，利用特定材料與工藝生成高孔隙率結構，提升載體性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an improved microbial culture device and related preparation methods, aiming to address the issues of complex operation and high infection risk in traditional culture devices. The device comprises a top cover, a porous carrier, a supplement tube, and a base. The top cover includes air vents, inoculation ports, and liquid supplement ports, equipped with an air filter and a detachable sealing component. The porous carrier is coated with a nutrient layer and features supplement holes, while the supplement tube connects the liquid supplement ports to the supplement holes. This integrated structure facilitates supplementation operations and reduces contamination risks. This invention also provides a method for preparing liquid fertilizer from Cinnamomum kanehirae fermentation, wherein branches and leaves of Cinnamomum kanehirae are fermented with saccharides to produce liquid fertilizer. Additionally, a method for manufacturing porous carriers is disclosed, which employs specific materials and techniques to create a high-porosity structure, enhancing the performance of the carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:菌體培養裝置</p>
        <p type="p">10:上蓋</p>
        <p type="p">14:扣片</p>
        <p type="p">30:補充管</p>
        <p type="p">40:底座</p>
        <p type="p">42:定位片</p>
        <p type="p">50:空氣過濾器</p>
        <p type="p">51:第一封閉件</p>
        <p type="p">52:第二封閉件</p>
        <p type="p">54:第一固定塞件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="99" publication-number="202631420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AI行車紀錄器</chinese-title>
        <english-title>AI DASHCAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">B60R1/20</main-classification>
        <further-classification edition="200601120250401B">H04N7/18</further-classification>
        <further-classification edition="200601120250401B">G07C5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝捷光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANJET TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佶鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有邊緣運算裝置之AI行車紀錄器，其中邊緣運算裝置至少包含神經處理單元及AI模型耦合至神經處理單元，透過神經處理單元與AI模型提供邊緣運算輔助智能駕駛，其中AI模型包含人工智慧駕駛輔助模型，以利提高駕駛安全性。上述人工智慧駕駛模型包含先進駕駛輔助系統、駕駛管理系統、乘客管理系統之一或其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an AI Dashcam including an edge computing device, wherein the edge computing device includes an NPU and an AI model coupled to the NPU. The AI model and the NPU provide the edge computing for intelligence driving assistance, wherein the AI model includes an artificial intelligence driving assistance model for improving driving safety. The artificial intelligence driving assistance includes ADAS, DMS, OMS or the combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1040:記憶體</p>
        <p type="p">1041:處理器</p>
        <p type="p">1042:感應器</p>
        <p type="p">1043:G-感應器</p>
        <p type="p">1045:通訊模組</p>
        <p type="p">1046:AI模型</p>
        <p type="p">1047:輸入單元</p>
        <p type="p">1048:輸出單元</p>
        <p type="p">1049:GPS模組</p>
        <p type="p">1050:邊緣運算裝置</p>
        <p type="p">1052:AI加速電路</p>
        <p type="p">1053:記憶體</p>
        <p type="p">1054:神經處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="100" publication-number="202632690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">H01F7/02</main-classification>
        <further-classification edition="202301120250418B">C02F1/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王人傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王人傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐曉華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性裝置，主要係包含一內管體及外管體，以及置於該內管體之第一磁性體及第二磁性體。其中，該內管體係設有一金屬材質之管身，於管身兩端分別設有套蓋；該第一磁性體及第二磁性體係包含由複數的金屬層、絕緣層、濾布層、吸光體層依序層疊所組合而成之內疊層，以及包覆內疊層整體之絕緣包覆層；該第一磁性體係以捲軸狀容置於該內管體，該第二磁性體係以單片狀並與該第一磁性體呈相互垂直方向容置於該內管體；該外管體係包覆在該內管體外部；從而構成一磁性裝置。俾使有別於傳統磁力線僅侷限N、S極方向性及範圍，而具有得與各種物質或大地形成放射狀之磁性力場作用之磁性體，進而將該磁性體設置為具有水平及垂直方向作用之磁性力場的磁性裝置，並且藉由外管體之密封效果，得以將該磁性裝置直接置入於水中或其他液體中進行磁性力場之磁化作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:內管體</p>
        <p type="p">11:管身</p>
        <p type="p">12:套蓋</p>
        <p type="p">2:外管體</p>
        <p type="p">21:筒身</p>
        <p type="p">22:蓋體</p>
        <p type="p">221:嵌置部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="101" publication-number="202632317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使相移最小化的多層塗層結構</chinese-title>
        <english-title>MULTI-LAYER COATING STRUCTURE TO MINIMIZE PHASE SHIFTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250805B">G02B1/10</main-classification>
        <further-classification edition="201501120250805B">G02B1/115</further-classification>
        <further-classification edition="200601120250805B">G02B6/27</further-classification>
        <further-classification edition="200601120250805B">G02B6/24</further-classification>
        <further-classification edition="200601120250805B">G02B27/09</further-classification>
        <further-classification edition="200601120250805B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切里基　羅寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRIKI, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾林　埃拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARLIN, ELAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了使相移最小化的多層塗層結構。一種裝置，包括波導和嵌入在波導內部的一個或更多個部分反射表面，其中，一個或更多個部分反射表面中的每一個包括多層塗層結構，其中，多層塗層結構的第一部分引起傳播通過多層塗層結構的第一部分的光的總相移，並且其中，選擇多層塗層結構的第二部分來減小總相移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a waveguide and one or more partially reflective surfaces embedded inside the waveguide, wherein each of the one or more partially reflective surfaces includes a multi-layer coating structure, wherein a first portion of the multi-layer coating structure induces an overall phase shift of light propagating through the first portion of the multi-layer coating structure and wherein a second portion of the multi-layer coating structure is selected to decrease the overall phase shift.</p>
      </isu-abst>
      <representative-img>
        <p type="p">
        &lt;i&gt;n&lt;/i&gt;
        &lt;sub&gt;0&lt;/sub&gt;,&lt;i&gt;n&lt;/i&gt;&lt;sub&gt;&lt;i&gt;11&lt;/i&gt;&lt;/sub&gt;,&lt;i&gt;n&lt;/i&gt;&lt;sub&gt;&lt;i&gt;12&lt;/i&gt;&lt;/sub&gt;,&lt;i&gt;n&lt;/i&gt;&lt;sub&gt;&lt;i&gt;21&lt;/i&gt;&lt;/sub&gt;,&lt;i&gt;n&lt;/i&gt;&lt;sub&gt;&lt;i&gt;22&lt;/i&gt;&lt;/sub&gt;,&lt;i&gt;n&lt;/i&gt;&lt;sub&gt;&lt;i&gt;23&lt;/i&gt;&lt;/sub&gt;:折射率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="102" publication-number="202631334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子零件的拆卸裝置</chinese-title>
        <english-title>DISASSEMBLY DEVICE FOR ELECTRONIC PARTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">B25B27/02</main-classification>
        <further-classification edition="200601120250512B">B25B27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>撼訊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳劍威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子零件的拆卸裝置，包括桿體、第一端部及一第二端部。桿體呈矩形。第一端部設置於桿體的一端，其延伸方向平行於桿體的長度方向，其厚度往遠離桿體的方向逐漸變薄，桿體的第一表面連接於第一端部的第一表面並互相平行，桿體的第二表面連接於第一端部的第二表面且彼此之間形成第一夾角，第一夾角的角度大於90度且小於180度。第二端部設置於桿體的另一端。藉此，矩形桿體易於伸入狹窄空間中，且第一端部能夠精準地將下壓式卡榫往下壓並可被用來拆卸被下壓式卡榫固定的電子零件。再者，手部容易對矩形桿體施力，不會造成電子零件的毀損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disassembly device for electronic parts includes a rod body, a first end part and a second end part. The rod body is rectangular. The first end part is provided at one end of the rod body, its extending direction is parallel to the length direction of the rod body, and its thickness gradually becomes thinner in the direction away from the rod body. The first surface of the rod body is connected to the first surface of the first end and is parallel to each other. The second surface of the rod body is connected to the second surface of the first end and forms a first included angle with each other. The first included angle is greater than 90 degrees and less than 180 degrees. The second end is provided at the other end of the rod body. Such that, the rectangular rod body can easily extend into a narrow space, and the first end part can accurately press down the push-down latch and can be used to remove electronic parts fixed by the push-down latch. Furthermore, it is easy for the hand to apply force on the rectangular rod body, which will not cause damage to the electronic parts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:桿體</p>
        <p type="p">11:第一表面</p>
        <p type="p">13:第一側面</p>
        <p type="p">20:第一端部</p>
        <p type="p">21:第一表面</p>
        <p type="p">23:第一側面</p>
        <p type="p">30:第二端部</p>
        <p type="p">31:第一側面</p>
        <p type="p">40:倒角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="103" publication-number="202631002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虹吸式植栽裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250205B">A01G9/02</main-classification>
        <further-classification edition="200601120250205B">A01G27/00</further-classification>
        <further-classification edition="200601120250205B">A01G27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳麗卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳麗卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種虹吸式植栽裝置，該虹吸式植栽裝置至少包含有栽培盆體、虹吸元件及儲水盆體。該栽培盆體用以盛裝栽培土種植植物，係卡掣於儲水盆體之頂部；其底部之容置槽設有虹吸元件；該虹吸元件係為一內部裝有吸水棉塊、一壓縮不織布塊之盒體；該儲水盆體係用以儲放營養液或水。組裝時，將虹吸元件裝設於栽培盆體之容置槽中，然後將該栽培盆體置入儲水盆體中，藉由該栽培盆體底部之虹吸元件其吸水棉塊及壓縮不織布塊將營養液或水分向上虹吸至栽培盆體內之栽培土，使植物的根部不間斷的吸收，免除每日澆水之困擾，具有相當的進步性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:虹吸式植栽裝置</p>
        <p type="p">10:栽培盆體</p>
        <p type="p">100:內部空間</p>
        <p type="p">101:卡掣端緣</p>
        <p type="p">102:容置槽</p>
        <p type="p">103:透水不織布</p>
        <p type="p">11:虹吸元件</p>
        <p type="p">110:盒體</p>
        <p type="p">111:吸水棉塊</p>
        <p type="p">112:壓縮不織布塊</p>
        <p type="p">113:透水不織布</p>
        <p type="p">12:儲水盆體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="104" publication-number="202631439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101909</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子控制之座管結構</chinese-title>
        <english-title>ELECTRONICALLY SEAT TUBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">B62J1/10</main-classification>
        <further-classification edition="200601120250205B">B62J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩克科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIND SHOCK HI-TECH CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許榮裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧永和</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子控制之座管結構，是在伸縮桿體內安裝氣壓桿，氣壓桿下方有驅動桿，透過驅動裝置的凸輪頂起觸發件，使得氣壓桿帶動伸縮桿體上升，接著使用者可靠著臀部重量壓著座墊即可調整伸縮桿體的高度位置，而令使用者能不費力且不用離開座墊的情況下就能調整座管的高低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The Electronically seat tube, it’s a gas pressure rod is installed in the telescopic rod body, and a driving rod is arranged under the gas pressure rod. The trigger part is lifted by the cam of the driving device, so that the gas pressure rod drives the telescopic rod body to rise. Then the user can adjust the telescopic position by pressing the seat cushion with the weight of the hips. The height of the rod body allows the user to adjust the height of the seat tube effortlessly without leaving the saddle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:伸縮桿體</p>
        <p type="p">11:內管</p>
        <p type="p">12:外管</p>
        <p type="p">21:開閥推桿</p>
        <p type="p">22:驅動桿</p>
        <p type="p">31:馬達</p>
        <p type="p">314:排線</p>
        <p type="p">32:凸輪</p>
        <p type="p">33:觸發件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="105" publication-number="202632589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製品之稅則號別的生成系統及生成方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR GENERATING CCC CODE FOR PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250204B">G06Q40/10</main-classification>
        <further-classification edition="202301120250204B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康博為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製品之稅則號別的生成系統，其包括分類模組、稅則號別設定模組以及稅則號別生成模組。分類模組配置為根據目標製品的製品資訊從分類清單所包括的多個類型中確定出目標製品所屬的目標類型。稅則號別設定模組配置為根據目標製品的目標類型選擇出多個稅則號別判定清單中的一個對應者。稅則號別生成模組配置為根據目標製品的製品資訊與多個邏輯條件從該等稅則號別判定清單中的對應者中生成目標製品的稅則號別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for generating a CCC code for a product includes a classification module, a CCC code setting module, and a CCC code generation module. The classification module is configured to determine a target type to which a target product belongs from multiple types included in a classification list based on a product information of the target product. The CCC code setting module is configured to select a corresponding one of multiple CCC code determination lists based on the target type of the target product. The CCC code generation module is configured to generate the CCC code of the target product from the corresponding one of multiple CCC code determination lists based on the product information of the target product and multiple logical conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製品之稅則號別的生成系統</p>
        <p type="p">110:分類模組</p>
        <p type="p">130:稅則號別設定模組</p>
        <p type="p">150:稅則號別生成模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="106" publication-number="202631058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動床之防夾裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">A47C19/02</main-classification>
        <further-classification edition="200601120250313B">A47C19/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施權航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施權航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊育其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯克里奇　勞勃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESKRIDGE, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳邦禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電動床之防夾裝置，包含有一床架、至少一致動器、多數紅外線感應器、以及一控制單元；床架包含有一底座、至少一固定單元設於底座上方、以及至少一活動單元與固定單元樞接且位於底座上方；致動器其一端設於固定單元或底座，另一端設於活動單元，可驅動活動單元相對固定單元旋擺或移動；紅外線感應器設於固定單元、底座或活動單元且感應區域包含活動單元下方，多數紅外線感應器互相串聯在一起；控制單元與致動器、些紅外線感應器電性連接，當任一紅外線感應器感應到人或動物的體溫時，控制單元控制致動器停止或反向動作，使活動單元停止動作或向上旋擺或向上移動。藉此，本發明之防夾裝置可有效避免電動床操作時夾傷人員或其他動物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防夾裝置</p>
        <p type="p">10:床架</p>
        <p type="p">12:前架</p>
        <p type="p">13:後架</p>
        <p type="p">14:固定單元</p>
        <p type="p">18:活動單元</p>
        <p type="p">24:致動器</p>
        <p type="p">26:紅外線感應器</p>
        <p type="p">28:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="107" publication-number="202631808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ｍｉｃｒｏ－ＬＥＤ巨量轉移用臨時鍵結膠、Ｍｉｃｒｏ－ＬＥＤ巨量轉移結構以及方法</chinese-title>
        <english-title>A METHOD FOR MICRO-LED MASS TRANSFER USING TEMPORARY BONDING ADHESIVE, AND THE RELATED MICRO-LED MASS TRANSFER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/10</main-classification>
        <further-classification edition="200601120260302B">C09J163/00</further-classification>
        <further-classification edition="200601120260302B">C09J179/08</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202501120260302B">H10H20/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩摩亞商亮通國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHT STONE INTERNATIONAL LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>WS</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施俊仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧治中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種Micro-LED巨量轉移用臨時鍵結膠、Micro-LED巨量轉移結構以及方法，在巨量轉移的過程中，臨時鍵結膠作為保護層對Micro-LED晶片起到保護的作用，減少破片，提高良品率，且其具有特定波長高吸收值，具有高接著黏合作用，通過更低能量激光的照射，使得Micro-LED晶片可順暢從基板上釋放實現轉移，耗能低，利於降低成本。臨時鍵結膠的主要成分為以聚醯亞胺共聚物和環氧樹脂，其中聚醯亞胺共聚物中具有的芳香族結構且具有分子內與分子間的電荷轉移作用，使得其對於激光的吸收度較高，如此可降低激光能量，實現節能，並且藉由環氧樹脂實現高接著黏合的作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a temporary bonding adhesive for Micro-LED mass transfer, a Micro-LED mass transfer structure, and a method. During the mass transfer process, the temporary bonding adhesive serves as a protective layer for Micro-LED chips, reducing breakage and improving yield rates. It features a high absorption value at specific wavelengths and exhibits strong adhesion properties. By utilizing lower-energy laser irradiation, the Micro-LED chips can be smoothly released from the substrate for transfer, resulting in lower energy consumption and cost efficiency.        &lt;br/&gt;The main components of the temporary bonding adhesive are a polyimide copolymer and epoxy resin. The polyimide copolymer contains aromatic structures and exhibits intramolecular and intermolecular charge transfer effects, leading to high laser absorption. This enables energy reduction and promotes energy efficiency. The epoxy resin further enhances adhesion, providing robust bonding performance.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:第二基板</p>
        <p type="p">B:Micro-LED巨量轉移用臨時鍵結膠</p>
        <p type="p">C:Micro-LED晶片</p>
        <p type="p">D:第一基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="108" publication-number="202631016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>柿子快速脫澀方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">A23B7/10</main-classification>
        <further-classification edition="200601120250401B">A23B7/157</further-classification>
        <further-classification edition="200601120250401B">A23B7/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉義縣番路鄉農會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡芸芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種柿子快速脫澀方法及其裝置，主要係設有一盛裝單元，該盛裝單元包括一盛裝有溶液的容器，該溶液係以適量比例之碳酸氫鈉、檸檬酸及水調配出溶液，將該溶液置於一容器中備用；俾將摘取之新鮮柿子置於該容器中，使柿子完全浸泡於此溶液中，並排出容器內空氣後密封保存，於室內或室外溫度中，以預設之時間靜置，利用碳酸氫鈉與檸檬酸進行酸鹼反應，釋放二氧化碳進行脫澀。從而可在不影響柿子自然風味和脆度的前提下，快速完成脫澀處理，以符合消費者對新鮮、天然農產品的需求，降低處理時間及損耗及提升產能，進而增強市場的競爭力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:溶液</p>
        <p type="p">5:盛裝單元</p>
        <p type="p">51:容器</p>
        <p type="p">511:開口</p>
        <p type="p">512:夾鏈</p>
        <p type="p">6:柿子</p>
        <p type="p">7:容置箱</p>
        <p type="p">71:上蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="109" publication-number="202631040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能保健按摩除臭殺菌梳子</chinese-title>
        <english-title>A MULTIFUNCTIONAL HEALTH CARE MASSAGE DEODORIZING AND STERILIZING COMB</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A45D24/00</main-classification>
        <further-classification edition="202601120260302B">A61L2/10</further-classification>
        <further-classification edition="202601120260302B">A61L2/20</further-classification>
        <further-classification edition="200601120260302B">A61N1/36</further-classification>
        <further-classification edition="200601120260302B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊豐澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENG ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊豐澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENG ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭朋深</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種多功能保健按摩除臭殺菌梳子，係由梳針主體與梳柄組合        &lt;br/&gt;，其中梳針主體底部裝設有臭氧產生器，梳柄內裝設控制板、電池及充電口，梳針主體表面裝設UVA、遠紅光(FIR,Far Infrared)LED及梳針，此種結構是寵物用梳子。其中梳針主體底部裝設有負離子(Anion-)產生器、EMS微電流，梳柄內裝設控制板、電池及充電口，梳針主體表面裝設負離子出口、遠紅光(FIR,Far Infrared)LED及梳針，此種結構是人體用梳子。本發明適用寵物除臭、殺菌及遠紅外線照射促進寵物血液循環增加抵抗力，本發明適用人體除了利用遠紅外線促進血液循環配合脈衝微電流按摩輔助，更有負離子作用附著於頭髮上消除異味。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a multifunctional health care massage deodorizing and sterilizing comb, which is composed of a comb needle body and a comb handle.        &lt;br/&gt;The bottom of the combing needle body is equipped with an ozone generator, the comb handle is equipped with a control panel, battery and charging port, and the surface of the combing needle body is equipped with UVA, far infrared (FIR, Far Infrared) LED and combing needles. It is a pet comb. The bottom of the combing needle is equipped with a negative ion generator and EMS microcurrent, the comb handle is equipped with a control panel, battery and charging port, and the surface of the combing needle is equipped with a negative ion outlet and far infrared (FIR) LED and comb needle, this structure is a comb for human body. The present invention is applicable to pets for deodorization, sterilization and far infrared irradiation to promote pets' blood circulation and increase resistance. The present invention is applicable to humans for promoting blood circulation by far infrared ray with pulse microcurrent massage assistance and also for attaching negative ions to hair to eliminate odor.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:梳針主體</p>
        <p type="p">11:臭氧產生器</p>
        <p type="p">12:LED電路板</p>
        <p type="p">13:梳針</p>
        <p type="p">14:控制板</p>
        <p type="p">15:電池</p>
        <p type="p">16:充電口</p>
        <p type="p">P:寵物型梳子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="110" publication-number="202632684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>評估個體罹患冠心症之風險的方法、其分析器及其套組</chinese-title>
        <english-title>METHOD FOR ESTIMATING A RISK FOR A SUBJECT SUFFERING FROM CORONARY ARTERY DISEASE, ANALYZER AND KIT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250401B">G16H50/30</main-classification>
        <further-classification edition="201901120250401B">G16B40/20</further-classification>
        <further-classification edition="201801120250401B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬念涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, NIAN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林楨桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種評估個體罹患冠心症之風險的方法，包含：測量個體的標記含量：總膽固醇、三酸甘油酯、低密度脂蛋白、高密度脂蛋白、miR-21、miR-22、miR-142、miR-146b、miR-222、miR-425、miR-484、或其組合；以及經邏輯斯回歸運算負對照組與樣本相同的標記含量，當標記含量於個體大於或小於負對照組，則個體被評估為具有罹患冠心症之風險。另提供一種套組，包含至少一試劑用於辨識個體中的標記含量如前所述，以準確評估風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for estimating a risk for a subject suffering from coronary artery disease is provided, including measuring biomarker content: cholesterol, triglycerides, LDL, HDL, miR-21, miR-22, miR-142, miR-146b, miR-222, miR-425, miR-484, or a combination thereof from the subject; and calculating the same biomarker content from a negative control and the sample by logistic regression, the subject is estimated having the risk of coronary artery disease when the biomarker content of the subject is higher or lower than that of the negative control. A kit of estimating a risk for a subject suffering from coronary artery disease is also provided, including at least one agent for identifying the biomarker content as above mentioned from the subject, thereby accurately assessing risk.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102、104、106、108、110、112:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="111" publication-number="202631423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接車用防盜系統的啟動開關結構</chinese-title>
        <english-title>A START SWITCH STRUCTURE CONNECTED TO A VEHICLE ANTI-THEFT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250416B">B60R25/04</main-classification>
        <further-classification edition="201301120250416B">B60R25/10</further-classification>
        <further-classification edition="201301120250416B">B60R25/20</further-classification>
        <further-classification edition="201301120250416B">B60R25/24</further-classification>
        <further-classification edition="200601120250416B">B60R16/023</further-classification>
        <further-classification edition="200601120250416B">H01Q1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以勤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICM INCORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴格林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, GELIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接車用防盜系統的啟動開關結構，係適用於具有車輛防盜系統的車輛，並用以驅動汽車啟動，包括：本體，具有接合部，接合部沿著軸延伸，以連接本體於車輛上；啟動開關模組，可滑動地設置在本體前端；軸環，軸環沿著軸向啟動開關模組另側延伸，軸環的外表面環繞形成有容置面；天線單元，為薄片體並貼附於容置面，天線單元用以進行無線通訊；以及控制電路模組；當啟動啟動開關模組時，透過控制電路模組使鎖止主機發出指令啟動天線單元，並驅動天線單元發出能量至汽車鑰匙，於汽車鑰匙取得能量後，回傳汽車鑰匙的識別碼至天線單元，再將識別碼回饋至車輛防盜系統的鎖止主機以檢測識別碼，用以決定是否啟動車輛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A start switch structure connected to a vehicle anti-theft system is designed for vehicles equipped with such systems and serves to activate the vehicle's ignition. It comprises a main body with a coupling section extending along an axis for attaching the main body to the vehicle. A button section is slidably installed at the front end of the main body, and a shaft ring extends axially from the opposite side of the button section. The outer surface of the shaft ring is surrounded by a receiving surface. An antenna unit, formed as a thin sheet, is attached to the receiving surface and is used for wireless communication. The structure also includes a control circuit module. When the button section is pressed, the control circuit module prompts the locking host to issue a command that activates the antenna unit. The antenna unit then emits energy to detect the identification code of the car key, which is fed back to the locking host to determine whether to start the vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:本體</p>
        <p type="p">311:接合部</p>
        <p type="p">32:啟動開關模組</p>
        <p type="p">33:軸環</p>
        <p type="p">34:天線單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="112" publication-number="202632397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">G02F1/1335</main-classification>
        <further-classification edition="201901120250124B">G02F1/165</further-classification>
        <further-classification edition="201901120250124B">G02F1/167</further-classification>
        <further-classification edition="200601120250124B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宸美（廈門）光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK ADVANCED SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勝發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林順龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHUN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周藝端</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YI-DUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靚蕙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包含蓋板、光學模組以及彩色電泳式顯示模組。光學模組位於蓋板下，並包含導光板、第一光學層、第二光學層以及光源。導光板具有相對的第一主面以及第二主面。第一主面面向蓋板，並設置具有非漸變形狀的複數個凹型微結構。第一光學層位於該第一主面。第二光學層位於第二主面。光源設置於導光板的側邊。彩色電泳式顯示模組位於光學模組下。第二光學層的折射率小於導光板的折射率且大於第一光學層的折射率。第一光學層及該第一主面之間的理想介面反射率與第二光學層及第二主面之間的理想介面反射率的比值為約3至約13。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a cover plate, an optical module, and a color electrophoresis display module. The optical module is located under the cover plate and includes a light guide plate, a first optical layer, a second optical layer, and a light source. The light guide plate has a first main surface and a second main surface opposite to each other. The first main surface faces the cover plate and is provided with a plurality of concave microstructures having non-gradient shapes. The first optical layer is located on the first main surface. The second optical layer is located on the second main surface. The light source is disposed on a lateral side of the light guide plate. The color electrophoretic display module is located under the optical module. A refractive index of the second optical layer is smaller than a refractive index of the light guide plate and larger than a refractive index of the first optical layer. A ratio of an ideal interface reflectivity between the first optical layer and the first main surface to an ideal interface reflectivity between the second optical layer and the second main surface is about 3 to about 13.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:蓋板</p>
        <p type="p">120:光學模組</p>
        <p type="p">121:導光板</p>
        <p type="p">121a:第一主面</p>
        <p type="p">121b:第二主面</p>
        <p type="p">121c:凹型微結構</p>
        <p type="p">122:第一光學層</p>
        <p type="p">123:第二光學層</p>
        <p type="p">124:光源</p>
        <p type="p">130:彩色電泳式顯示模組</p>
        <p type="p">131:微膠囊電泳顯示器</p>
        <p type="p">132:彩色畫素陣列</p>
        <p type="p">140:光學膠層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="113" publication-number="202631910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滲透結晶之矽酸質防水液及其施工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C09D1/00</main-classification>
        <further-classification edition="200601120250501B">C09D5/02</further-classification>
        <further-classification edition="200601120250501B">C09D5/16</further-classification>
        <further-classification edition="200601120250501B">E04B1/64</further-classification>
        <further-classification edition="200601120250501B">E04F13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晁成誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晁成誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種滲透結晶之矽酸質防水液及其施工方法，該滲透結晶之矽酸質防水液係利用矽酸質原液與水以一定比例將其攪拌混合後成一種適用於牆面或是地板之水溶性防水液。該滲透結晶之矽酸質防水液可以再與水調配後直接噴塗於施工壁(地)面，待其乾燥後，藉由水使其矽酸質滲入混凝土後形成結晶體，以達到防水之效果；其施工方法係將該滲透結晶之矽酸質防水液依照不同的施工對象，如牆面油漆施工、牆面防水施工或壁癌處理施工時，再配合不同的對應比例之水再進行調和後，即可使用噴塗方式將該滲透結晶之矽酸質防水液噴佈在施工壁(地)面上，待其乾燥結晶後，達到使牆面或地面防水及阻絕壁癌之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滲透結晶之矽酸質防水液</p>
        <p type="p">10:矽酸質原液</p>
        <p type="p">11:水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="114" publication-number="202632446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時間至數位轉換器以及用來對輸入訊號進行時間至數位轉換的校正方法</chinese-title>
        <english-title>TIME-TO-DIGITAL CONVERTER AND CALIBRATION METHOD FOR PERFORMING TIME-TO-DIGITAL CONVERSION ON INPUT SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G04F10/00</main-classification>
        <further-classification edition="200601120250401B">G04F10/04</further-classification>
        <further-classification edition="200601120250401B">G04F10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高有德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>繆俊偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAW, JIUNN-WAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種時間至數位轉換器以及用來對一輸入訊號進行時間至數位轉換的校正方法。該時間至數位轉換器包含一時間計數器、一校正電路以及一加法器。該時間計數器因應該輸入訊號的第一邊緣開始計數並且因應該輸入訊號的第二邊緣結束計數，以產生初步計數值。該校正電路依據該輸入訊號的第一邊緣以及一時脈訊號的第一邊緣產生一第一判斷位元，依據該輸入訊號的第二邊緣以及該時脈訊號的第二邊緣產生一第二判斷位元，以及依據該第一判斷位元以及該第二判斷位元產生一校正值。另外，該加法器將該初步計數值加上該校正值以產生最終計數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A time-to-digital converter and a calibration method for performing time-to-digital conversion on an input signal are provided. The time-to-digital converter includes a time counter, a calibration circuit and an adder. The time counter start counting in response to a first edge of the input signal and stop counting in response to a second edge of the input signal, to generate a preliminary counting value. The calibration generates a first determination bit according to the first edge of the input signal and a first edge of the clock signal, generates a second determination bit according to the second edge of the input signal and a second edge of the clock signal, and generate a calibration value according to the first determination bit and the second determination bit. In addition, the adder adds the calibration value to the preliminary counting value to generate a final counting value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:時間至數位轉換器</p>
        <p type="p">101:觸發訊號產生器</p>
        <p type="p">102:時間計數器</p>
        <p type="p">103:校正電路</p>
        <p type="p">104:加法器</p>
        <p type="p">110:同步電路</p>
        <p type="p">120:除頻多工器</p>
        <p type="p">130:除頻器</p>
        <p type="p">140:輸出緩衝器</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">CLK&lt;sub&gt;DIV&lt;/sub&gt;:除頻後的時脈訊號</p>
        <p type="p">RO&lt;sub&gt;MEAS&lt;/sub&gt;:振盪訊號</p>
        <p type="p">RO&lt;sub&gt;SYNC&lt;/sub&gt;:同步振盪訊號</p>
        <p type="p">RO&lt;sub&gt;DIV&lt;/sub&gt;:輸入訊號</p>
        <p type="p">RO&lt;sub&gt;S&lt;/sub&gt;,RO&lt;sub&gt;E&lt;/sub&gt;:觸發訊號</p>
        <p type="p">SEL&lt;sub&gt;DUTY&lt;/sub&gt;:選擇訊號</p>
        <p type="p">CNT&lt;sub&gt;SEL&lt;/sub&gt;:選擇訊號</p>
        <p type="p">N&lt;sub&gt;CNT&lt;/sub&gt;:初步計數值</p>
        <p type="p">N&lt;sub&gt;CAL&lt;/sub&gt;:校正值</p>
        <p type="p">N&lt;sub&gt;FINAL&lt;/sub&gt;:最終計數值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="115" publication-number="202632480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101948</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控按鍵感應偵錯導正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精元電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNREX TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聖林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控按鍵感應偵錯導正方法，由一觸控面板於感應到一觸碰行為發生後，產生複數依時間依序排列的觸碰資訊集合，每一觸碰資訊集合包括一觸碰面積值、一左側座標、一右側座標、一頂側座標及一底側座標，該觸控面板於該等觸碰資訊集合中，判斷對應的觸碰面積值為最大的一者後，以對應的該觸碰資訊集合中的該觸碰面積值、該左側座標、該右側座標、該頂側座標及該底側座標進行計算，以得出一幾何中心座標，該觸控面板以該幾何中心座標作為該觸碰行為的觸碰位置，進而避免錯誤的發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31~34:觸控按鍵感應偵錯導正方法的步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="116" publication-number="202632481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控按鍵感應偵錯導正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精元電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNREX TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚志憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控按鍵感應偵錯導正方法，由一觸控面板顯示一鍵盤介面，該鍵盤介面具有複數鍵位區域，每一鍵位區域具有複數權重區域，每一權重區域具有一權重值，該觸控面板於感應到一觸碰行為發生後產生複數觸碰資訊集合，每一觸碰資訊集合包括一對應當時的受觸碰區域的觸碰面積值，及一對應當時的受觸碰區域的感應區域資訊，該觸控面板於該等觸碰資訊集合中判斷對應的該觸碰面積值為最大的一者後，計算出每一被涵蓋的鍵位區域的一權重累計值，該觸控面板以所有被涵蓋的鍵位區域中的權重累計值最大的一者作為該觸碰行為的選定輸入鍵位，進而避免錯誤的發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31~34:觸控按鍵感應偵錯導正方法的步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="117" publication-number="202632121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建築模板單元</chinese-title>
        <english-title>FORMWORK UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">E04G9/02</main-classification>
        <further-classification edition="200601120250502B">E04G17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潤弘精密工程事業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUENTEX ENGINEERING &amp; CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹衍樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐坤榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉牧宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種建築模板單元，其中包括相對設置的第一模板和第二模板。第一模板及第二模板之側邊緣上分別包括至少一個第一定位孔及至少一個第二定位孔。建築模板單元進一步包括一連接元件。連接元件包括一第一接合片，其包括經構形以與第一模板之第一定位孔可分離地接合之一第一接孔及一第二接孔；一第二接合片，其包括經構形以與第二模板之第二定位孔可分離地接合之一第三接孔；以及一中間元件，連接於第一接合片與第二接合片之間。當第一模板與第二模板在一第一狀態時，第一接合片藉由第一接孔連接第一定位孔，使第一模板與第二模板間具有一第一間距，且其中當第一模板與第二模板在一第二狀態時，第一接合片藉由第二接孔連接第一定位孔，第一模板與第二模板間具有不同於第一間距之一第二間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The instant disclosure provides a formwork unit, including a first formwork and a second formwork opposing to the first formwork. The sides of the first formwork and the second formwork respectively include at least one first positioning hole and at least one second positioning hole. The formwork unit further includes a connecting element. The connecting element comprises a first connecting member, which includes a first connecting hole and a second connecting hole configured to detachably engage with the first positioning hole of the first formwork; a second connecting member, which includes a third connecting hole configured to detachably engage with the second positioning hole of the second formwork; and an intermediate element, connected between the first connecting member and the second connecting member. When the first formwork and the second formwork are in a first state, the first connecting member is connected to the first positioning hole via the first connecting hole, providing a first spacing between the first formwork and the second formwork, and when the first formwork and the second formwork are in a second state, the first connecting member is connected to the first positioning hole via the second connecting hole, providing a second spacing different from the first spacing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:建築模板單元</p>
        <p type="p">10:第一模板/鋁模板</p>
        <p type="p">11:第一內側表面</p>
        <p type="p">12:第一側緣</p>
        <p type="p">15:第一定位孔</p>
        <p type="p">20:第二模板</p>
        <p type="p">21:第二內側表面</p>
        <p type="p">22:第二側緣</p>
        <p type="p">25:第二定位孔</p>
        <p type="p">30:連接元件</p>
        <p type="p">40:繫件</p>
        <p type="p">50:混凝土結構</p>
        <p type="p">60:中間元件</p>
        <p type="p">310:第一接合片</p>
        <p type="p">311:第一接孔</p>
        <p type="p">312:第二接孔</p>
        <p type="p">318:外側端</p>
        <p type="p">319:內側端</p>
        <p type="p">320:第二接合片</p>
        <p type="p">321:第三接孔</p>
        <p type="p">328:外側端</p>
        <p type="p">329:內側端</p>
        <p type="p">G:寬度</p>
        <p type="p">W1:第一間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="118" publication-number="202632194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調式冰鎮保冷器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">F25D3/00</main-classification>
        <further-classification edition="200601120250313B">A47G23/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽鑫科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅大行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種可調式冰鎮保冷器，包括：開口桶、開口蓋、掛架、轉盤、至少一滑車以及至少一冷卻組，開口蓋可拆卸地結合於開口桶上，具有限位槽；掛架可拆卸地結合於開口蓋，具有滑槽；轉盤設置於該開口蓋與該掛架之間，具有撥桿及導溝，撥桿凸出於限位槽；滑車包括：扣座、滑軌及導桿，滑軌設置於扣座上且嵌入滑槽，導桿設置於滑軌上且嵌入導溝；冷卻組包括：載板、蓄冷包及插件，蓄冷包及插件分別設置於載板之相對二側，插件可拆卸地連接扣座；以撥桿旋轉轉盤使導溝帶動滑車及冷卻組沿滑槽移動，從而可調整開口桶內之容置空間大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可調式冰鎮保冷器</p>
        <p type="p">10:開口桶</p>
        <p type="p">11:開口蓋</p>
        <p type="p">12:掛架</p>
        <p type="p">13:轉盤</p>
        <p type="p">14:滑車</p>
        <p type="p">15:冷卻組</p>
        <p type="p">111:限位槽</p>
        <p type="p">121:滑槽</p>
        <p type="p">131:撥桿</p>
        <p type="p">132:導溝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="119" publication-number="202633510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造封裝結構之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF MANUFACTURING PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/01</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔繁宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, FAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勁勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一實施例係關於一種製造封裝結構之方法，包括提供一基板於一成型機台中及以不接觸該基板的一方式對該基板進行預熱。本揭露之另一實施例包括一種製造封裝結構之系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present disclosure relates to a method of manufacturing a package structure, which includes providing a substrate in a molding machine and preheating the substrate in a non-contact manner. Another embodiment of the present disclosure includes a system for manufacturing a packaging structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">10:下模具</p>
        <p type="p">10a:平台</p>
        <p type="p">10a1:表面</p>
        <p type="p">10b:凸出部</p>
        <p type="p">10w:側壁</p>
        <p type="p">11:上模具</p>
        <p type="p">11a:平台</p>
        <p type="p">11a1:表面</p>
        <p type="p">11b:凸出部</p>
        <p type="p">11w:側壁</p>
        <p type="p">12:治具</p>
        <p type="p">13:基板</p>
        <p type="p">131:表面</p>
        <p type="p">132:表面</p>
        <p type="p">14:控制器</p>
        <p type="p">g1:間距</p>
        <p type="p">g2:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="120" publication-number="202632127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改良式閘門結構</chinese-title>
        <english-title>IMPROVED GATE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">E06B3/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李馨怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李馨怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明改良式閘門結構係裝設於一建築物之出入口處，其包括至少二框架體、複數閘門片、一內部形成有一儲放空間之儲藏部、及至少一驅動部；該儲藏部裝設於該出入口處以鄰接於該等框架體，該驅動部包含一驅動組件，裝設於該儲放空間及該等框架體內之至少二輸送單元，以及設於該等輸送單元側邊之至少二夾持組件；主要藉由該驅動組件來驅動該等夾持組件、輸送單元以產生夾持該等閘門片、輸送該等閘門片之作動，以便搬運該等閘門片至該等框架體之間以呈堆疊，或運送該等閘門片至該儲放空間內儲放，故達該等閘門片之快速堆疊或儲放，使用更方便。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An improved gate structure is disposed at the entrance and exit of a building and includes at least two frame bodies, a plurality of gate members, a storing portion whose interior forms a storage space, and at least one driving portion. At the entrance and exit is disposed the storing portion which is adjacent to the frame bodies. The driving portion includes a driving assembly, at least two conveyor units installed in the storage space and in the frame bodies, and at least two clamping assemblies, each of which is disposed on one side of each conveyor unit. The operations of the clamping assemblies and the conveyor units are actuated by operating the driving portion, thereby clamping and conveying the gate members. When the gate members are conveyed to a space between the frame bodies, the conveying operation stacks the gate members between the frame bodies. Alternatively, when the gate members are conveyed to the storage space, the conveying operation causes the gate members to be stored in the storage space. Accordingly, the gate members are quickly stacked or stored, thereby attaining a convenient use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:改良式閘門結構</p>
        <p type="p">31:框架體</p>
        <p type="p">32:閘門片</p>
        <p type="p">33:儲藏部</p>
        <p type="p">34:驅動部</p>
        <p type="p">35:操控部</p>
        <p type="p">311:導槽</p>
        <p type="p">331:導座</p>
        <p type="p">341:輸送單元</p>
        <p type="p">342:驅動組件</p>
        <p type="p">343:夾持組件</p>
        <p type="p">3421:傳動桿</p>
        <p type="p">3422:傳動件</p>
        <p type="p">3423:驅動件</p>
        <p type="p">3431:夾持件</p>
        <p type="p">32a:閘門片之二側</p>
        <p type="p">S1:置放空間</p>
        <p type="p">S2:儲放空間</p>
        <p type="p">S3:輸送軌道</p>
        <p type="p">E:出入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="121" publication-number="202631603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>奈米彎曲套索[1]輪烷控制二色發光體及其在溫度和黏度感測器之應用</chinese-title>
        <english-title>RATIOMETRIC FLUORESCENCE EMITTERS IN TIGHTENED/LOOSENED LASSOS (NANO-LOOPS) OF [1]ROTAXANES AND THEIR APPLICATIONS ON TEMPERATURE AND VISCOSITY SENSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C07D405/14</main-classification>
        <further-classification edition="200601120250402B">C09K11/06</further-classification>
        <further-classification edition="200601120250402B">G01K11/00</further-classification>
        <further-classification edition="200601120250402B">G01N11/00</further-classification>
        <further-classification edition="200601120250402B">G01N21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-CHEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　清忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, THANH-TRUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱軍豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種奈米彎曲套索[1]輪烷控制的二色發光體，包括具有彎曲套索結構的[1]輪烷。[1]輪烷由多個部分組成，包括：大環部分，包括環狀多醚結構；二色發光體部分，與大環部分鍵結，具有放出青光之彎曲構形和放出橙光之扭曲構形；第一站點部分，與二色發光體部分鍵結，在鹼性環境下進入大環部分並與之形成氫鍵，讓二色發光體部分處於彎曲構形；線形部分，與第一站點部分鍵結並穿過大環部分；第二站點部分，在酸性環境下進入大環部分並與之形成氫鍵，讓二色發光體部分處於彎曲和扭曲構形的振動平衡狀態；以及封端部分，位於大環部分另一側，與第二站點鍵結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ratiometric fluorescence emitter based on nano-loops of tightened/loosened lassos of [1]rotaxane is provided. The emitter includes a [1]rotaxane with a bent lasso structure, which has the following moieties. A macrocyclic moiety has a cyclic polyether structure. A ratiometric fluorophore moiety is covalently bonded to the macrocyclic moiety. This fluorophore exhibits a bent conformation that emits cyan light and a twisted conformation that emits orange light. A first station moiety is bonded to the ratiometric fluorophore moiety. The first station moiety enters the macrocyclic moiety in an alkaline environment and forms multiple hydrogen bonds to stabilize the bent conformation. A linear moiety is connected to the first station moiety and is threaded through the macrocyclic moiety. A second station moiety is bonded to the linear moiety. The second station moiety enters the macrocyclic moiety in an acidic environment and forms multiple hydrogen bonds, inducing a vibration equilibrium between the bent and twisted conformation of the fluorophore. A stopper moiety is positioned on the opposite side of the macrocyclic moiety and is bonded to the second station moiety.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:大環部分</p>
        <p type="p">120:二色發光體部分</p>
        <p type="p">130:第一站點部分</p>
        <p type="p">140:線形部分</p>
        <p type="p">150:第二站點部分</p>
        <p type="p">160:封端部分</p>
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:第一連接部分</p>
        <p type="p">L&lt;sub&gt;2&lt;/sub&gt;:第二連接部分</p>
        <p type="p">L&lt;sub&gt;3&lt;/sub&gt;:第三連接部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="122" publication-number="202632081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具(110)晶面取向之奈米雙晶銅及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C25D3/38</main-classification>
        <further-classification edition="200601120250402B">C25D5/00</further-classification>
        <further-classification edition="201101120250402B">B82Y30/00</further-classification>
        <further-classification edition="201101120250402B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若永科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具(110)晶面取向之奈米雙晶銅，其包含相互連接的複數第一晶粒和複數第二晶粒；其中，各第一晶粒包含沿(110)晶軸方向為優選方向相互堆疊的複數第一奈米雙晶結構，且該等第一奈米雙晶結構之間形成有複數第一奈米雙晶界面，該等第一奈米雙晶界面與該具(110)晶面取向之奈米雙晶銅的厚度方向的夾角為30度至90度；各第二晶粒包含沿(111)晶軸方向相互堆疊的複數第二奈米雙晶結構。所述具(110)晶面取向之奈米雙晶銅具有較佳的蝕刻速率，進而可降低對其進行蝕刻製程的整體成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具(110)晶面取向之奈米雙晶銅</p>
        <p type="p">S:基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="123" publication-number="202631465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運用動樑式輸送帶之多綁帶包裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250829B">B65D85/04</main-classification>
        <further-classification edition="200601120250829B">B65D85/66</further-classification>
        <further-classification edition="200601120250829B">B65B13/00</further-classification>
        <further-classification edition="200601120250829B">B65G65/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾信原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張臣洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運用動樑式輸送帶之多綁帶包裝方法，其係使用受控的多綁帶包裝設備來執行，多綁帶包裝設備包括動樑式輸送帶以及綁帶繞設包裝機，其步驟係將重型物件輸送至動樑式輸送帶之輸入站區，其次，由動樑式輸送帶受控以步階式站區間移動方式將重型物件移送至工作站區處，及由綁帶機能對重型物件執行第一次綁帶繞設包裝，再由動樑式輸送帶於工作站區帶動重型物件至少一次綁帶間距步幅移動及綁帶機接續對重型物件再執行綁帶繞設包裝；之後，由動樑式輸送帶以步階式站區間移動方式將完成綁帶包裝的重型物件從工作站區處輸送至輸出站區，藉此，使重型物件執行多綁帶作業更有效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:動樑式輸送帶</p>
        <p type="p">11:動樑</p>
        <p type="p">100:物件移動路徑</p>
        <p type="p">101A:第一站區</p>
        <p type="p">102A:第二站區</p>
        <p type="p">1021:綁帶站點</p>
        <p type="p">1022:綁帶站點</p>
        <p type="p">1023:綁帶站點</p>
        <p type="p">103A:第三站區</p>
        <p type="p">20:重型物件</p>
        <p type="p">30:綁帶機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="124" publication-number="202632848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用於高頻信號之單相匯流排及使用其之馬達系統</chinese-title>
        <english-title>SINGLE-PHASE BUSBAR SUITABLE FOR HIGH-FREQUENCY SIGNALS AND MOTOR SYSTEM USE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250401B">H02K11/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭彰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宗祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZONG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUAN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於高頻信號之單相匯流排及馬達系統。該單相匯流排包含：多層從輸入端延伸至輸出端的導體層以及多層絕緣層。其中，任兩相鄰導體層之間至少設置一層絕緣層。該多層導體層與該多層絕緣層交錯層疊設置且該多層導體層至少在該輸入端彼此電性連接且在該輸出端彼此電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single-phase busbar suitable for high-frequency signals and motor system. The single-phase busbar includes multiple conductive layers and multiple insulative layers extending from input end to output end. At least one insulative layer is provided between any two adjacent conductive layers. The conductive layers and the insulative layers are alternately stacked, and the conductive layers are electrically connected to each other at least at the input end and are electrically connected to each other at the output end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:單相匯流排</p>
        <p type="p">32:導體層</p>
        <p type="p">33:絕緣層</p>
        <p type="p">34:電性連接部</p>
        <p type="p">IE:輸入端</p>
        <p type="p">OE:輸出端</p>
        <p type="p">X,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="125" publication-number="202633116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橫向擴散金屬氧化物半導體結構及其製造方法</chinese-title>
        <english-title>LDMOS STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250320B">H10D30/60</main-classification>
        <further-classification edition="202501120250320B">H10D62/60</further-classification>
        <further-classification edition="202501120250320B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐懋騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MAO-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張日謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIH-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種橫向擴散金屬氧化物半導體結構包括基底、閘極、閘極介電層、井區、至少一第一輕摻雜汲極（LDD）區、至少一第二LDD區與源極/汲極區。閘極形成於基底的表面上，閘極介電層設置於閘極與基底之間。井區設置於基底的表面內。至少一第一LDD區設置於閘極的一側的井區內，至少一第二LDD區則設置於第一LDD區的外側的井區內。源極/汲極區形成於第二LDD區內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laterally diffused metal oxide semiconductor (LDMOS) structure includes a substrate, a gate, a gate dielectric layer, a well region, at least one first lightly doped drain (LDD) region, at least one second LDD region, and a source/drain region. The gate is formed on a surface of the substrate, and the gate dielectric layer is disposed between the gate and the substrate. The well region is disposed within the surface of the substrate. The at least one first LDD region is disposed in the well region at one side of the gate, and the at least one second LDD region is disposed in the well region outside the first LDD region. The source/drain region is formed in the second LDD region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">100s:表面</p>
        <p type="p">102:井區</p>
        <p type="p">d1:界面深度</p>
        <p type="p">d2:最大深度</p>
        <p type="p">G1:閘極</p>
        <p type="p">O1:閘極介電層</p>
        <p type="p">LDD1:第一對LDD區</p>
        <p type="p">LDD2:第二對LDD區</p>
        <p type="p">S/D:源極/汲極區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="126" publication-number="202633052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種散熱器快拆扣具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250411B">H05K7/12</main-classification>
        <further-classification edition="200601120250411B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市永邦電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓日榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊延壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種散熱器快拆扣具，包括有配合固定散熱器兩端的第一鎖緊裝置和第二鎖緊裝置，第一鎖緊裝置包括有安裝於主機板上的卡位件及設置於散熱器一端並能夠與卡位件匹配扣接的扣接件，通過將扣接件抵扣到卡位件上實現散熱器固定一端與主機板的連接。採用將固定散熱器一端的第一鎖緊裝置設置為卡位元件和鎖扣件，並分別將卡位件和鎖扣件分別固定到主機板和散熱器上，在安裝散熱器時，通過將鎖扣件對接到卡位件，再將散熱器另一端擺動到與主機板對接，並通過第二鎖緊裝置固定到主機板，實現散熱器的安裝固定，以替代傳統採用螺釘固定的方式，從而提高散熱器的安裝效率，並能夠方便將散熱器安裝在緊湊狹小的空間內，提升散熱器的使用範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱器</p>
        <p type="p">11:定位凹槽</p>
        <p type="p">2:第一鎖緊裝置</p>
        <p type="p">21:卡位件</p>
        <p type="p">211:鉤柱部</p>
        <p type="p">22:扣接件</p>
        <p type="p">222:定位凸條部</p>
        <p type="p">3:第二鎖緊裝置</p>
        <p type="p">4:主機板</p>
        <p type="p">41:螺母座</p>
        <p type="p">5:電連接器</p>
        <p type="p">6:電子元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="127" publication-number="202632398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及顯示裝置</chinese-title>
        <english-title>BACKLIGHT MODULE AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250509B">G02F1/1335</main-classification>
        <further-classification edition="200601120250509B">F21V21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADIANT OPTO-ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃定璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DING-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭博懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PO-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王頌平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯珮棻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, PEI-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組，具有出光方向，且包含背框、導光板及緩衝件。背框包含底板及連接底板的側牆，側牆具有至少一第一限位斜面，第一限位斜面與底板之間形成第一斜角空間。導光板設置於底板上。緩衝件設置於側牆與導光板之間，緩衝件具有至少一第二限位斜面，第二限位斜面與底板之間形成第二斜角空間。緩衝件的至少一部分位於第一斜角空間且被第一限位斜面觸抵，而導光板的至少一部分位於第二斜角空間且被第二限位斜面觸抵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module has a light emitting direction and includes a back frame, a light guide plate and a buffer element. The back frame includes a base and a sidewall connected to the base. The sidewall has at least one first position limiting inclined plane, where a first bevel space is formed between the first position limiting inclined plane and the base. The light guide plate is disposed on the base. The buffer element is disposed between the sidewall and the light guide plate. The buffer element has at least one second position limiting inclined plane, where a second bevel space is formed between the second position limiting inclined plane and the base. At least a portion of the buffer element is located in the first bevel space and contacts against the first position limiting inclined plane, and at least a portion of the light guide plate is located in the second bevel space and contacts against the second position limiting inclined plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:背框</p>
        <p type="p">100p:底板</p>
        <p type="p">100w:側牆</p>
        <p type="p">102:導光板</p>
        <p type="p">104:緩衝件</p>
        <p type="p">B1:第一斜角空間</p>
        <p type="p">B2:第二斜角空間</p>
        <p type="p">C:角隅</p>
        <p type="p">da、db:深度</p>
        <p type="p">Pa、Pb:凸塊</p>
        <p type="p">R1:第一凹槽</p>
        <p type="p">R2:第二凹槽</p>
        <p type="p">S1、S5、S9:第一限位斜面</p>
        <p type="p">S2、S6、S10:第二限位斜面</p>
        <p type="p">S4、S8、S12:第二對應斜面</p>
        <p type="p">ta、tb:厚度</p>
        <p type="p">wa、wb、wc、wd:寬度</p>
        <p type="p">θ1、θ2:銳角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="128" publication-number="202631236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置、其遊戲輔助方法與人工智慧模組之訓練方法</chinese-title>
        <english-title>ELECTRONIC DEVICE, GAME ASSISTING METHOD THEREOF AND TRAINING METHOD FOR ARTIFICIAL INTELLIGENCE MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250501B">A63F13/533</main-classification>
        <further-classification edition="201401120250501B">A63F13/40</further-classification>
        <further-classification edition="200601120250501B">G06T1/40</further-classification>
        <further-classification edition="201301120250501B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置、其遊戲輔助方法與人工智慧模組之訓練方法。電子裝置之遊戲輔助方法包括以下步驟。選擇中央處理器、集成圖形處理器及離散圖形處理器之其中之一作為一指定運算單元。擷取電子裝置之一螢幕截圖。指定運算單元以一人工智慧模組之一第一辨識模型對螢幕截圖進行一第一辨識程序，以辨識螢幕截圖是否具有一遊戲畫面，並辨識螢幕截圖是否具有一遊戲提示。若螢幕截圖具有遊戲提示，則指定運算單元以人工智慧模組之一第二辨識模型對螢幕截圖進行一第二辨識程序，以辨識出遊戲提示於螢幕截圖之一顯示位置與對應之一輸入動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device, a game assisting method thereof and a training method for an artificial intelligence module are provided. The game assisting method of the electronic device includes the following steps. One of a central processing unit, an integrated graphics processor and a discrete graphics processor is selected as a designated computing unit. A screenshot of the electronic device is captured. A designated computing unit performs a first recognition process on the screenshot using a first recognition model of an artificial intelligence module to recognize whether the screenshot contains a game frame and whether the screenshot has a game prompt. If the screenshot has the game prompt, the designated computing unit performs a second recognition process on the screenshot using a second recognition model of the artificial intelligence module to recognize a display location of the game prompt and an input action.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S120,S140,S151,S152,S160,S170,S180,S181,S190:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="129" publication-number="202632517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蟲害防治方法及其裝置</chinese-title>
        <english-title>PEST CONTROL METHOD AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250206B">G06F18/00</main-classification>
        <further-classification edition="200601120250206B">A01M1/02</further-classification>
        <further-classification edition="200601120250206B">A01M1/20</further-classification>
        <further-classification edition="200601120250206B">A01M5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正修學校財團法人正修科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG SHIU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李迦恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林代列</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DAI-LIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘佳鈴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊婕琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, JIE-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃致維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種蟲害防治方法。該方法包含害蟲偵測步驟、害蟲認出統計步驟、生物體密度統計步驟、藥劑投放決定步驟、藥劑投放步驟、及訊息發送步驟，其中在藥劑投放決定步驟中，使藥劑投放模組根據當該聚集密度值達到該較低密度門檻值，並且對應於該較低密度門檻值的該較低密度門檻值的持續時間達到一密度持續時間門檻值的情況來對目標區域進行藥劑的投放。本發明還提供了一種蟲害防治裝置。透過本發明的蟲害防治方法及其裝置，能避免因無法達到較高密度門檻值久不投放藥劑進而演變成持續餵食害蟲而未予以撲殺的情況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pest control method is disclosed by the present disclosure. The method comprises a pest detection step, a pest recognition statistical step, an organism density statistical step, a chemical agent administering decision step, a chemical agent administering step, and a message sending step. In the chemical agent administering decision step, administration of a chemical agent in a target area by a chemical agent administering module is according to a situation that when an aggregated density value reaches a lower density threshold value and a duration of the lower density threshold value corresponding to the lower density threshold value reaches a density duration time threshold value. A pest control device is further disclosed by the present disclosure. A situation can be prevented by the method and device for trapping pest that a chemical agent fails to administer to the pests since a higher density threshold cannot be reached, resulting in a situation where pests are continuously fed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01至S60:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="130" publication-number="202632324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦光裝置</chinese-title>
        <english-title>LIGHT COUPLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">G02B5/18</main-classification>
        <further-classification edition="200601120250328B">G02B6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾佳欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIA-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銘瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江彥俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瑜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俐瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LI YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耦光裝置包括波導、液晶光柵及添加層。波導的折射率為        &lt;img align="absmiddle" height="30px" width="38px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。液晶光柵設置於波導上。液晶光柵具有等效折射率        &lt;img align="absmiddle" height="33px" width="90px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。添加層設置於波導與液晶光柵之間。添加層的折射率為        &lt;img align="absmiddle" height="26px" width="28px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。        &lt;img align="absmiddle" height="35px" width="178px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light coupling device includes a waveguide, a liquid crystal grating and an additional layer. A refractive index of the waveguide is        &lt;img align="absmiddle" height="31px" width="40px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The liquid crystal grating is disposed on the waveguide. The liquid crystal grating has an effective refractive index        &lt;img align="absmiddle" height="34px" width="79px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The additional layer is disposed between the waveguide and the liquid crystal grating. A refractive index of the additional layer is        &lt;img align="absmiddle" height="27px" width="25px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.        &lt;img align="absmiddle" height="35px" width="172px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:耦光裝置</p>
        <p type="p">110:波導</p>
        <p type="p">120:液晶光柵</p>
        <p type="p">122:液晶分子</p>
        <p type="p">130:添加層</p>
        <p type="p">140:配向層</p>
        <p type="p">L:光束</p>
        <p type="p">P&lt;sub&gt;x&lt;/sub&gt;:水平間距</p>
        <p type="p">P&lt;sub&gt;y&lt;/sub&gt;垂直間距</p>
        <p type="p">
        &lt;i&gt;T&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;LC&lt;/i&gt;
        &lt;/sub&gt;、&lt;i&gt;T&lt;/i&gt;&lt;sub&gt;&lt;i&gt;sl&lt;/i&gt;&lt;/sub&gt;:厚度</p>
        <p type="p">θ:液晶角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="131" publication-number="202632546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大型語言模型工作流程設計之系統</chinese-title>
        <english-title>SYSTEM FOR DESIGNING LARGE LANGUAGE MODEL APPLICATION WORKFLOWS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q10/06</main-classification>
        <further-classification edition="202301120250401B">G06Q10/10</further-classification>
        <further-classification edition="201801120250401B">G06F8/10</further-classification>
        <further-classification edition="200601120250401B">G06N3/02</further-classification>
        <further-classification edition="202301120250401B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳添福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TIEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝翔丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種大型語言模型工作流程設計之系統，包括一流程分析模組、一組件映射模組及一串接模組，其中，流程分析模組利用預定義之複數系統提示詞對使用者輸入的一提問訊息進行偵測、分析與拆解，以將提問訊息拆解成複數組件內容；組件映射模組理解每一組件內容之功能或目標後，基於功能或目標將組件內容分別映射至預定義的相關功能模組；串接模組將被映射的功能模組進行配對及串接，以生成一結構化工作流程。藉由本發明之系統，使用者只需輸入提問內容，系統拆解成意圖或提示詞，即可為使用者生產出一套其需要的LLM應用工作流程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for designing large language model application workflows, including a process analysis module, a component mapping module and a concatenation module. The process analysis module uses a plurality of predefined system prompts to detect, analysis and disassemble a question message input by a user, to decompose the question message into multiple component contents. After the component mapping module understands the function or goal of each component content, it maps the component content to predefined related function modules based on the function or goal. The concatenation module pairs and concatenates the mapped function modules to generate a structured workflow. Through the system of the present invention, the user only needs to input the question content, and the system can break it down into intentions or prompt words to produce a set of LLM application workflow for the user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:大型語言模型工作流程設計之系統</p>
        <p type="p">12:流程分析模組</p>
        <p type="p">14:組件映射模組</p>
        <p type="p">16:串接模組</p>
        <p type="p">22:預定義的系統提示詞</p>
        <p type="p">30:提問訊息</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="132" publication-number="202633057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷通道機構及具有其之滑軌總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250529B">H05K7/18</main-classification>
        <further-classification edition="200601120250529B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有冷通道機構之滑軌總成，其包括外框、中框、左擋件、右擋件、彈性件、內框、冷通道操作件、第一復位彈性件、冷通道鎖件、第二復位彈性件與解鎖操作件。如果要進入至開啟冷通道狀態，則透過外力來將冷通道操作件往外側移動且使得冷通道鎖件之一前端抵靠於第一止擋部以讓該冷通道操作件進入至鎖閉狀態。如果要返回至關閉冷通道狀態，則透過外力來將解鎖操作件往外側撥動，以使得解鎖突出部來連動該冷通道鎖件之前端往上翹且透過第一復位彈性件以讓冷通道操作件往內側移動而回復至解鎖狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:具有冷通道機構之滑軌總成</p>
        <p type="p">101:外框</p>
        <p type="p">101A:限位件</p>
        <p type="p">102:中框</p>
        <p type="p">103:左擋件</p>
        <p type="p">104:右擋件</p>
        <p type="p">1034A:限位特徵</p>
        <p type="p">105:彈性件</p>
        <p type="p">106:內框</p>
        <p type="p">107:冷通道操作件</p>
        <p type="p">1071:限位槽</p>
        <p type="p">1071A:第一止擋部</p>
        <p type="p">1072:第二止擋部</p>
        <p type="p">108:第一復位彈性件</p>
        <p type="p">109:冷通道鎖件</p>
        <p type="p">109A:頂部</p>
        <p type="p">109B:前端</p>
        <p type="p">110:第二復位彈性件</p>
        <p type="p">111:解鎖操作件</p>
        <p type="p">111A:解鎖突出部</p>
        <p type="p">FT:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="133" publication-number="202631115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種奈米纖維載體及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">A61K9/70</main-classification>
        <further-classification edition="200601120250210B">A61K47/00</further-classification>
        <further-classification edition="200601120250210B">D01D1/02</further-classification>
        <further-classification edition="200601120250210B">D01D5/08</further-classification>
        <further-classification edition="201101120250210B">B82Y30/00</further-classification>
        <further-classification edition="201101120250210B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恆昇國際投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JASONS EVERBIO COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　玨丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴宗成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHUN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種奈米纖維載體，係包含生物相容性高分子、無機鹽及生物活性藥劑，並以靜電紡絲形成具有立體結構、動態穩定性、可依時間軸控制的奈米纖維載體，其中，奈米纖維載體具有生物活性且能在均勻分布的同時實現迅速、穩定和可控的釋放。本發明之奈米纖維載體可廣泛的被應用於藥物運輸、生物分子運輸、基因調控運輸、細胞運輸及奈米顆粒釋放等多個領域，不僅適用於藥物疾病治療、組織修復與再生工程、傷口處理，還能應用於高端化妝品和美容護理。此外，本發明應用於工業領域也相當具有潛力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101-S111:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="134" publication-number="202632764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於可攜式電子裝置之供電系統</chinese-title>
        <english-title>POWER SUPPLY FOR PORTABLE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260302B">H01M10/052</main-classification>
        <further-classification edition="200601120260302B">H01M10/44</further-classification>
        <further-classification edition="202601120260302B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王士銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂世凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, SHI-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種供電系統，適用於一可攜式電子裝置，其具有一電腦系統，且適於電性連接於一適配器以取得一輸出電力。供電系統包含一電力輸入端、一供電端、一第一開關元件、一電池、一第二開關元件、一超級電容以及一控制單元。電力輸入端適於電性連接於適配器以獲取輸出電力，供電端電性連接於電力輸入端適於供電至電腦系統。電池係透過第一開關元件電性連接於供電端。超級電容係透過第二開關元件電性連接於供電端。控制單元適於在電腦系統之系統負載高於適配器之最大供電瓦數時，使第一開關元件處於中斷狀態並使第二開關元件處於導通狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply for a portable electronic device having a computer system is provided. The power supply has a power input end, a power supply end, a first switching element, a battery, a second switching element, a super capacitor, and a control unit. The power input end is for electrically connecting an adaptor to receive an output power. The power supply end is electrically connected to the power input end for supplying power to the computer system. The battery is electrically connected to the power supply end through the first switching element. The super capacitor is electrically connected to the power supply end through the second switching element. The control unit is utilized for having the first switching element in the off state and the second switching element in the on state when system load of the computer system is higher than a maximum power of the adaptor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:供電系統</p>
        <p type="p">10:可攜式電子裝置</p>
        <p type="p">12:電腦系統</p>
        <p type="p">AD:適配器</p>
        <p type="p">V0:輸出電力</p>
        <p type="p">P1:電力輸入端</p>
        <p type="p">P2:供電端</p>
        <p type="p">SW1:第一開關元件</p>
        <p type="p">SW2:第二開關元件</p>
        <p type="p">BA:電池</p>
        <p type="p">SC:超級電容</p>
        <p type="p">120:控制單元</p>
        <p type="p">122:電池充電電路</p>
        <p type="p">124:超級電容充電電路</p>
        <p type="p">VB:電池電壓</p>
        <p type="p">VC:電容電壓</p>
        <p type="p">VS:系統電壓</p>
        <p type="p">IC:電容放電電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="135" publication-number="202632493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能編碼輔助機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250401B">G06F8/33</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭曜嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭鎧齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種智能編碼輔助機器人，包含一圖形化對話介面、一安全防護模組、一標籤建置模組及一處理模組並至少電連接設有一生成式預訓練模型之至少一雲端或地端伺服器，該安全防護模組供設定複數個資料特徵、複數個存取權限及複數個使用限制。當接收由外部輸入之一第一程式碼時，該標籤建置模組解析獲取複數個片段及其對應之複數個識別標籤，且該處理模組利用該等資料隱私過濾形成一第二程式碼，以與一需求對話一併傳送予該雲端或地端伺服器而獲得一回應資料，供該處理模組再利用該等存取權限及該等使用限制運算而生成一修編數據後，利用該等識別標籤比對而截取出對應之至少一該片段，據此生成具複數個修編動作選項之一互動回饋，供點選而修編對應的程式碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:第一程式碼</p>
        <p type="p">1:智能編碼輔助機器人</p>
        <p type="p">10:圖形化對話介面</p>
        <p type="p">101:需求對話</p>
        <p type="p">12:安全防護模組</p>
        <p type="p">120:資料特徵</p>
        <p type="p">121:存取權限</p>
        <p type="p">122:使用限制</p>
        <p type="p">13:標籤建置模組</p>
        <p type="p">130:片段</p>
        <p type="p">131:識別標籤</p>
        <p type="p">14:處理模組</p>
        <p type="p">141:互動回饋</p>
        <p type="p">1410:修編動作選項</p>
        <p type="p">2:雲端或地端伺服器</p>
        <p type="p">20:回應資料</p>
        <p type="p">3:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="136" publication-number="202631834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>染色用助劑及其製造方法與所應用之染色製程</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C08H1/06</main-classification>
        <further-classification edition="200601120250501B">D06P1/46</further-classification>
        <further-classification edition="200601120250501B">D06P3/24</further-classification>
        <further-classification edition="200601120250501B">D06B3/10</further-classification>
        <further-classification edition="200601120250501B">D06B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃茂全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃克灶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種染色用助劑及其製造方法與所應用之染色製程，利用明膠、檸檬酸、環氧氯丙烷及亞硫酸氫鈉為原料，經反應合成水解明膠衍生物之界面活性劑，利用助劑的凝集特性將染整廢水中染料抓住並帶入纖維素織物之中        &lt;br/&gt;，以期能在染色製程中使布料的染色率上升並且低後續所產生廢水的染料殘留率。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="137" publication-number="202631835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>染色用助劑及其製造方法與所應用之染色製程</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C08H1/06</main-classification>
        <further-classification edition="200601120250501B">D06P1/46</further-classification>
        <further-classification edition="200601120250501B">D06P3/24</further-classification>
        <further-classification edition="200601120250501B">D06B3/10</further-classification>
        <further-classification edition="200601120250501B">D06B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃茂全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃克灶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種染色用助劑及其製造方法與所應用之染色製程，利用動物膠、酒石酸、環氧氯丙烷及亞硫酸氫鈉為原料，經反應合成水解動物膠衍生物之界面活性劑，利用助劑的凝集特性將染整廢水中染料抓住並帶入纖維素織物之中，以期能在染色製程中使布料的染色率上升並且低後續所產生廢水的染料殘留率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="138" publication-number="202633298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學研磨與拋光系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260223B">H10P52/00</main-classification>
        <further-classification edition="201201120260223B">B24B37/04</further-classification>
        <further-classification edition="202601120260223B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴言侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴言侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化學研磨與拋光系統，包含一基座單元、一研磨單元、一移動單元、一修整單元及一工作單元，該研磨單元包括一轉盤，及一設置於該轉盤上的研磨墊，該修整單元包括一設置於該移動單元的調整台、一設置於該調整台的修整模組，及一設置於該修整模組的修整輪，該修整輪具有一修整表面，及一連接該修整表面的修整環面，該修整模組及該修整輪可於一第一狀態及一第二狀態之間調整，於該第一狀態時，該修整模組及該修整輪調整位置至使該修整表面朝向該研磨墊，於該第二狀態時，該修整模組及該修整輪調整位置至使該修整環面朝向該研磨墊，進而對該研磨墊研磨以提高加工精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基座單元</p>
        <p type="p">3:研磨單元</p>
        <p type="p">31:轉盤</p>
        <p type="p">32:研磨墊</p>
        <p type="p">4:移動單元</p>
        <p type="p">41:水平移動模組</p>
        <p type="p">42:轉動模組</p>
        <p type="p">43:上下移動模組</p>
        <p type="p">5:修整單元</p>
        <p type="p">51:調整台</p>
        <p type="p">52:修整模組</p>
        <p type="p">53:修整輪</p>
        <p type="p">6:工作單元</p>
        <p type="p">61:第一移動模組</p>
        <p type="p">62:安裝管</p>
        <p type="p">63:第二移動模組</p>
        <p type="p">65:承盤組</p>
        <p type="p">9:晶圓</p>
        <p type="p">L1:第一軸線</p>
        <p type="p">L2:第二軸線</p>
        <p type="p">L3:第三軸線</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="139" publication-number="202632404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250223B">G02F1/1343</main-classification>
        <further-classification edition="201601120250223B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖淑雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高望碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, WANG-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余悌魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TI-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，具有第一顯示區及第二顯示區，且包括第一基板、第二基板、顯示介質層、發光元件、透明電極層以及畫素電極。第二基板重疊第一基板。顯示介質層位於第一基板與第二基板之間。發光元件位於第一顯示區，且位於第一基板與顯示介質層之間。透明電極層位於第一顯示區，且位於第二基板與顯示介質層之間，且包括間隔排列的多個透明電極圖案。畫素電極位於第二顯示區，且位於第一基板與顯示介質層之間或第二基板與顯示介質層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device has a first display area and a second display area, and includes a first substrate, a second substrate, a display medium layer, a light-emitting element, a transparent electrode layer and a pixel electrode. The second substrate is overlapped with the first substrate. The display medium layer is disposed between the first substrate and the second substrate. The light-emitting element is disposed between the first substrate and the display medium layer in the first display area. The transparent electrode layer is disposed between the second substrate and the display medium layer in the first display area and includes a plurality of transparent electrode patterns arranged at intervals. The pixel electrode is disposed either between the first substrate and the display medium layer or between the second substrate and the display medium layer in the second display area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110,120:基板</p>
        <p type="p">130:顯示介質層</p>
        <p type="p">140:發光元件</p>
        <p type="p">141,142:電極</p>
        <p type="p">143,144:導電件</p>
        <p type="p">146,148:導線</p>
        <p type="p">150:透明電極層</p>
        <p type="p">152:透明電極圖案</p>
        <p type="p">160:畫素電極</p>
        <p type="p">170:透明面電極</p>
        <p type="p">175:透明電極</p>
        <p type="p">177:導線</p>
        <p type="p">180:背光模組</p>
        <p type="p">A1,A2:顯示區</p>
        <p type="p">C1:通道</p>
        <p type="p">D1,D2:汲極</p>
        <p type="p">DM:顯示介質分子</p>
        <p type="p">I1,I2,I3:絕緣層</p>
        <p type="p">PS:訊號源</p>
        <p type="p">PXc,PXd:子畫素</p>
        <p type="p">G1:閘極</p>
        <p type="p">S1:源極</p>
        <p type="p">ST1,ST2:狹縫</p>
        <p type="p">T1,T2:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="140" publication-number="202633038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連續性真空壓合機之冷卻裝置</chinese-title>
        <english-title>COOLING DEVICE FOR CONTINUOUS VACUUM PRESS MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">H05K3/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頂瑞機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP RANGE MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周進德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連續性真空壓合機之冷卻裝置，用以解決習知連續性真空壓合機過熱的問題。係包含：一上熱壓板，具有一上壓合部，及該上熱壓板於入口端係具有一結合部；一下熱壓板，具有一下壓合部，及該下熱壓板於入口端係具有一結合部，該下熱壓板用以與該上熱壓板作接近的閉合或成分開的開啓；及至少一冷卻模組，係具有至少一流道，該流道係各具有一入口及一出口，該入口與該出口相連通，該至少一冷卻模組結合在該上熱壓板或/及該下熱壓板的該結合部。如此，係可以使該上熱壓板或/及該下熱壓板的入口端維持在一較低溫度狀態效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling device for a continuous vacuum press machine is used to solve the overheating problem of the conventional continuous vacuum press machine. The cooling device comprises: a upper hot press plate with a upper pressing portion and a coupling portion at an input end thereof; a lower hot press plate with a lower pressing portion and a coupling portion at an input end thereof. The lower hot press plate can move toward the upper hot press plate to close a gap between the lower hot press plate and the upper hot press plate and move away from the upper hot press plate to form the gap. The cooling device further comprises at least one cooling module with at least one channel. Each of the at least one channel has an inlet and an outlet intercommunicating with the inlet. The at least one cooling module couples to the coupling portion of the upper hot press plate and/or the coupling portion of the lower hot press plate. As such, the input end of the upper hot press plate and/or the input end of the lower hot press plate can be maintained at a lower temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:上熱壓板</p>
        <p type="p">2:下熱壓板</p>
        <p type="p">3:冷卻模組</p>
        <p type="p">C:動作缸</p>
        <p type="p">M:連續真空壓合機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="141" publication-number="202632569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電信客戶服務與使用資源整合系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR INTEGRATING TELECOMMUNICATIONS CUSTOMER SERVICES AND THEIR UTILIZATION RESOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250509B">G06Q30/01</main-classification>
        <further-classification edition="202401120250509B">G06Q50/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳名耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志員</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電信客戶服務與使用資源整合系統與方法，旨在建構一個資料綜整、共享的生態系統，以實現多個系統間的資料交換和業務協同。本發明藉由垂直與水平互聯的生態結構和系統間的協作與交互，提供營維作業功能的自動化及資訊化，以實現服務資訊和資源的全面管理，使得系統能快速響應客戶需求，提高服務品質和營運效率，並促進整個生態系統的永續發展。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for integrating telecommunications customer services and their utilization resources are provided, which are intended for constructing an ecosystem for data integration and sharing to realize data exchange and operation synergy among multiple systems. By means of vertical and horizontal interconnected ecological structure and inter-system collaboration and interaction, the present invention provides automation and informatization of operation and maintenance functions to achieve comprehensive management of service information and resources, thus enabling the system to respond quickly to customer requirements, improve service quality and operational efficiency, and facilitate the sustainable development of the entire ecosystem.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電信客戶服務與使用資源整合系統</p>
        <p type="p">2:服務受理系統</p>
        <p type="p">3:服務資源供裝系統</p>
        <p type="p">4:人</p>
        <p type="p">5:企客關係管理系統</p>
        <p type="p">11:服務資源管理模組</p>
        <p type="p">12:流程管理模組</p>
        <p type="p">13:人員管理模組</p>
        <p type="p">14:網頁功能模組</p>
        <p type="p">15:售後服務應用模組</p>
        <p type="p">16:服務主檔資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="142" publication-number="202631510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PCB低含銅廢水聯合處理回收硫酸銅的方法</chinese-title>
        <english-title>METHOD OF RECOVERING COPPER SULFATE BY JOINT TREATMENT FROM LOW COPPER CONTAINING WASTEWATER OF PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C01G3/10</main-classification>
        <further-classification edition="202301120250501B">C02F9/00</further-classification>
        <further-classification edition="202301120250501B">C02F1/00</further-classification>
        <further-classification edition="202301120250501B">C02F1/04</further-classification>
        <further-classification edition="202301120250501B">C02F1/42</further-classification>
        <further-classification edition="202301120250501B">C02F1/58</further-classification>
        <further-classification edition="202301120250501B">C02F1/66</further-classification>
        <further-classification edition="200601320250501B">C02F101/20</further-classification>
        <further-classification edition="200601320250501B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商鑫鋒有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIN FOENG CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊倉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TSANG HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宥瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了PCB低含銅廢水聯合處理回收硫酸銅的方法，具體包括以下步驟：（1）將清洗廢水調節體系pH值為2.8~3.2；（2）經三柱陽離子交換樹脂吸附銅離子；（3）當樹脂柱飽和時，用硫酸溶液解析；（4）將解析液和SPS微蝕廢液混合；（5）加入氧化銅，攪拌，並控制終點pH值為4~5；（6）過濾，蒸發結晶，烘乾，得到五水硫酸銅。本發明方法能夠對低濃度含銅廢水進行合理的處理和資源回收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="143" publication-number="202632612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種基於動作數據的即時動作判斷系統及其方法</chinese-title>
        <english-title>A REAL-TIME MOTION DETERMINATION SYSTEM BASED ON A MOTION DATA AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V40/20</main-classification>
        <further-classification edition="202201120250401B">G06V40/30</further-classification>
        <further-classification edition="201701120250401B">G06T7/20</further-classification>
        <further-classification edition="202301120250401B">H04N23/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商米吶有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　子駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUI, TZE-TSUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒純忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於動作數據的即時動作判斷系統，其包括攝像模組、動作捕捉模組以及比對模組，該攝像模組用於捕捉使用者的動作數據，該動作捕捉模組執行特徵分析程序以獲取複數個使用者關鍵點，並根據各該使用者關鍵點設定該動作數據以生成動作特徵，該比對模組則基於基準數據中與該動作特徵於同一時序的基準動作特徵比對該動作特徵，且根據比對結果生成判斷數據。藉此實現即時捕捉使用者動作並據以比對基準動作，以精準並即時判斷使用者動作是否符合基準動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a real-time motion determination system based on a motion data, which includes a camera, a motion capture module, and a comparison module. The camera is configured to capture a motion data of a user. The motion capture module executes a characteristics analysis program to obtain a plurality of user key points and set the motion data according to each of the user key points to generate a motion feature. The comparison module compares the motion feature based on a benchmark motion feature at the same time sequence with the motion feature in the benchmark data, and a determination data is generated based on a comparison results. The accurate and real-time determination of whether the motion of the user conforms with the benchmark motion can be fulfilled, due to enable the real-time capture of the motion of the user and comparison with the benchmark motion thereby.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:攝像模組</p>
        <p type="p">10:動作數據</p>
        <p type="p">101:預設動作數據</p>
        <p type="p">102:比對動作數據</p>
        <p type="p">200:動作捕捉模組</p>
        <p type="p">20:使用者關鍵點</p>
        <p type="p">21:動作特徵</p>
        <p type="p">23:修正數據</p>
        <p type="p">300:比對模組</p>
        <p type="p">30:判斷數據</p>
        <p type="p">400:選擇模組</p>
        <p type="p">40:基準數據</p>
        <p type="p">401:基準動作特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="144" publication-number="202631657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>體外擴增記憶型T幹細胞的組合物及方法</chinese-title>
        <english-title>COMPOSITION AND METHOD FOR EX VIVO EXPANSION OF STEM CELL MEMORY T CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">C07K14/705</main-classification>
        <further-classification edition="200601120250502B">C07K14/54</further-classification>
        <further-classification edition="201001120250502B">C12N5/0783</further-classification>
        <further-classification edition="200601120250502B">A61K38/20</further-classification>
        <further-classification edition="200601120250502B">A61K38/16</further-classification>
        <further-classification edition="200601120250502B">A61P35/00</further-classification>
        <further-classification edition="200601120250502B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路迦生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUKAS BIOMEDICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亭勻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱瑋華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WEI HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種體外擴增記憶型T幹細胞的組合物，包含：第一組合物，包含CD3、CD28、介白素2、介白素7及介白素15；以及第二組合物，包含介白素2、介白素7及介白素15。本發明同時提供一種體外擴增記憶型T幹細胞的方法，包含：使用含有第一組合物的培養基培養單核球細胞，獲得活化T細胞；使用含有第二組合物的培養基培養活化T細胞，獲得第一細胞族群；以及使用含有第三組合物的培養基培養第一細胞族群，獲得第二細胞族群。藉此，本發明的體外擴增記憶型T幹細胞的組合物及方法可應用於免疫治療等相關的臨床領域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a composition for ex vivo expansion of memory T stem cells, comprising: a first composition, which includes CD3, CD28, interleukin-2, interleukin-7, and interleukin-15; and a second composition, which includes interleukin-2, interleukin-7, and interleukin-15. The present invention also provides a method for ex vivo expansion of memory T stem cells, comprising: culturing mononuclear cells with a medium containing the first composition to obtain activated T cells; culturing the activated T cells with a medium containing the second composition to obtain a first cell population; and culturing the obtained first cell population with a medium containing a third composition to obtain a second cell population. Therefore, the composition and method for ex vivo expansion of memory T stem cells provided by the present invention can be applied in clinical fields related to immunotherapy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="145" publication-number="202632291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102110</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針整列方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G01R1/06</main-classification>
        <further-classification edition="202001120250501B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創新服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種探針整列方法，係應用在一探針整列系統中，該探針整列系統具有一控制電路、一工作平台、一第一針盤、一第二針盤及與該控制電路電氣耦接之一第一取針裝置和一第二取針裝置，該工作平台具有一工作區以承載一探針卡，該探針卡具有多個容置孔，該工作區之兩側分別承載該第一針盤及該第二針盤，該第一針盤及該第二針盤均容置有複數根探針，所述探針具有一頭部、一尾部及位於該頭部和該尾部間之一單側止擋部，該第一針盤中之該些探針之該頭部及該單側止擋部均對應指向一第一軸向及一第一徑向，該第二針盤中之該些探針之該頭部及該單側止擋部均對應指向一第二軸向及一第二徑向，該第一軸向係和該第二軸向反向，該第一徑向係和該第二徑向反向，該第一取針裝置具有一對第一手爪，該第二取針裝置具有一第二手爪，該控制電路係用以執行一程式以實現該探針整列方法，且該探針整列方法包括以下步驟：執行一第一植針操作，其包括：驅使該對第一手爪之其一夾取該第一針盤中之該些探針中之一第一標的探針之該尾部；驅使該對第一手爪之該其一進行一翻轉操作以使該第一標的探針之該頭部指向該第二軸向並使該第一標的探針之該單側止擋部指向該第二徑向；及驅使該對第一手爪之另一手爪夾取該第一標的探針之該頭部，並將該第一標的探針以該尾部朝下且該單側止擋部指向該第二徑向的方式植入該探針卡之該些容置孔中之一第一標的容置孔中；以及執行一第二植針操作，其包括：驅使該第二手爪夾取該第二針盤中之該些探針中之一第二標的探針之該頭部，並將該第二標的探針以該尾部朝下且該單側止擋部指向該第二徑向的方式植入該探針卡之該些容置孔中之一第二標的容置孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:探針卡</p>
        <p type="p">100:探針整列系統</p>
        <p type="p">110:控制電路</p>
        <p type="p">120:工作平台</p>
        <p type="p">121:工作區</p>
        <p type="p">130:第一針盤</p>
        <p type="p">140:第二針盤</p>
        <p type="p">150:第一取針裝置</p>
        <p type="p">160:第二取針裝置</p>
        <p type="p">170:影像感測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="146" publication-number="202632830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102112</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下垂係數動態估測方法與使用其之微電網</chinese-title>
        <english-title>DROOP COEFFICIENT DYNAMIC ESTIMATION METHOD AND MICROGRID USE THE SAMET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/18</main-classification>
        <further-classification edition="202601120260302B">H02J3/16</further-classification>
        <further-classification edition="202601120260302B">H02J3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FAA-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>談光雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, KUANG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁祥瑀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, XIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白大尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案發明關於一種下垂係數動態估測方法，包含：透過處理器執行：接收實功率變化量，並據此計算當前下垂係數；當該當前下垂係數不等於初始值，且該實功率變化量為正時，將該當前下垂係數減去調節量後設定為該下垂係數；以及當該當前下垂係數不等於該初始值，且該實功率變化量為負時，將該當前下垂係數加上該調節量後設定為該下垂係數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a droop coefficient dynamic estimation method. The method includes steps of executing by a processor: receiving an active power variation and computing a current droop coefficient based thereon; when the current droop coefficient is not equal to the initial value and the active power variation is positive, setting said droop coefficient by subtracting an adjustment amount from the current droop coefficient; and when the current droop coefficient is not equal to the initial value and the active power variation is negative, setting said droop coefficient by adding the adjustment amount to the current droop coefficient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微電網系統</p>
        <p type="p">110:儲能系統</p>
        <p type="p">120:再生能源系統</p>
        <p type="p">130:負載</p>
        <p type="p">140:處理器</p>
        <p type="p">141:功率與鎖相迴路計算邏輯區塊</p>
        <p type="p">142:&lt;i&gt;abc/dq&lt;/i&gt;座標軸變換邏輯區塊</p>
        <p type="p">143:&lt;i&gt;abc/dq&lt;/i&gt;反座標軸變換邏輯區塊</p>
        <p type="p">144:正弦脈波寬度調變邏輯區塊</p>
        <p type="p">145:比例積分邏輯區塊</p>
        <p type="p">146:下垂係數動態估測邏輯區塊</p>
        <p type="p">151:第一感測器</p>
        <p type="p">152:第二感測器</p>
        <p type="p">153:第三感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="147" publication-number="202632124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱藏式連動結構之門窗把手組合及使用其之門窗件和門窗總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">E05B5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞細亞氣密隔音窗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林順芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種隱藏式連動結構之門窗把手組合，包含有一框組，具有一裝座孔及一擺轉室；一擺頂件，具有一樞擺座可擺轉樞接於框組之擺轉室，一抵輪接於樞擺座；一裝設座，容設於框組之裝座孔，固定於框組；一轉接件，設於框組與裝設座之間，樞接裝設座；一連軸，插接樞擺座與轉接件使同步轉動；一轉把，連接轉接件，可操作擺轉地連動轉接件轉動，使擺頂件之抵輪凸出頂抵一門窗座。藉由將連動結構裝設於門窗件的框組內，結構更為穩固，操作省力，作動更順暢，並可更減少碰撞損壞，從而解決已知門窗把手組合的問題。本發明還提供使用所述門窗把手組合之門窗件和門窗總成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:框條</p>
        <p type="p">11:第一片</p>
        <p type="p">12:端片</p>
        <p type="p">13:第二片</p>
        <p type="p">20:內盒</p>
        <p type="p">40:擺頂件</p>
        <p type="p">80:外蓋</p>
        <p type="p">90:轉把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="148" publication-number="202632868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力轉換器及其控制方法</chinese-title>
        <english-title>POWER CONVERTER AND ITS CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/335</main-classification>
        <further-classification edition="200601120250602B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊上凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHANG-KAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡勝男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHENG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電力轉換器及其控制方法，包括二變壓器的初級側串接形成初級串接組，輸入開關組運作於全橋模式或半橋模式，在第一配置，初級串接組與一電容器串接於輸入開關組的二節點之間，控制模組電連接輸入開關組；或者，在第二配置，輸入開關組的節點經由背對背開關組電連接二輸入電容器串接形成的節點，控制模組電連接輸入開關組及背對背開關組；在半橋或全橋模式，控制模組控制第一配置的輸入開關組或第二配置的輸入開關組及背對背開關組形成半橋或全橋架構，在全橋模式，二開關的控制訊號存在相移量。藉此，改善變壓器二次側電壓應力較大情況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter and its control method include primary sides of two transformers being connected in series to form a primary series assembly. An input switch assembly operating in a full-bridge mode or a half-bridge mode. In a first configuration, the primary series assembly and a capacitor are connected in series between two nodes of the input switch assembly, and a control module is electrically connected to the input switch assembly. Alternatively, in the second configuration, a node of the input switch assembly is electrically connected to a node formed in a series connection of two input capacitors through a back-to-back switch assembly, and the control module is electrically connected to the input switch assembly and the back-to-back switch assembly. In the half-bridge or full-bridge mode, the control module controls the input switch assembly in the first configuration or the input switch assembly in the second configuration and the back-to-back switch assembly to form a half-bridge or full-bridge architecture. In the full-bridge mode, there is a phase shift value between control signals of two switches. In this way, the situation of large voltage stress on the secondary side of the transformer is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電力轉換器</p>
        <p type="p">21:變壓模組</p>
        <p type="p">22:輸入開關組</p>
        <p type="p">23:輸出開關組</p>
        <p type="p">2C:控制模組</p>
        <p type="p">Cp:輸入電容器</p>
        <p type="p">Cout:輸出電容器</p>
        <p type="p">Q1:第一開關</p>
        <p type="p">Q2:第二開關</p>
        <p type="p">Q3:第三開關</p>
        <p type="p">Q4:第四開關</p>
        <p type="p">QR1:第五開關</p>
        <p type="p">QR2:第六開關</p>
        <p type="p">SC1、SC2、SC3、SC4、SR1、SR2:控制訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">T1、T2:變壓器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="149" publication-number="202632131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣密門組</chinese-title>
        <english-title>AIRTIGHT DOOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">E06B7/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂迦再生科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOCUS CELL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恆宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氣密門組，包含第一側門框、第二側門框、門檻、第一卡扣結構以及門檻氣密條，門檻可拆卸地設置於第一側門框以及第二側門框之間，門檻具有上表面以及第一端，第一卡扣結構設置於第一端用以將門檻卡固於第一側門框，門檻氣密條設置於門檻之上表面並覆蓋第一卡扣結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an airtight door assembly comprising a first side door frame, a second side door frame, a threshold, a first buckle structure, and a threshold airtight strip. The threshold is detachably disposed between the first door frameand the second side door frame. The threshold has an upper surface and a first end. The first buckle structure is positioned at the first end and configured to fix the threshold to the first side door frame. The threshold airtight strip is disposed on the upper surface of the threshold and covers the first buckle structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:門檻</p>
        <p type="p">10:門檻氣密條</p>
        <p type="p">11:主體氣密條</p>
        <p type="p">12:第一端氣密條</p>
        <p type="p">13:第二端氣密條</p>
        <p type="p">14:第三氣密條</p>
        <p type="p">18:上表面</p>
        <p type="p">191:第一卡扣結構</p>
        <p type="p">193:第二卡扣結構</p>
        <p type="p">A:第一端</p>
        <p type="p">B:第二端</p>
        <p type="p">61:第一側表面</p>
        <p type="p">2:門體</p>
        <p type="p">21:門扇</p>
        <p type="p">22:第一側門框</p>
        <p type="p">23:第二側門框</p>
        <p type="p">24:第一氣密條</p>
        <p type="p">25:第二氣密條</p>
        <p type="p">26:鉸鏈</p>
        <p type="p">X:水平方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="150" publication-number="202631009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調控變向投餌設備及其操作方法</chinese-title>
        <english-title>ADJUSTABLE CHANGING DIRECTION FEEDING EQUIPMENT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250303B">A01K61/80</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣海洋大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN OCEAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭智湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欽圳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉繁華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡鄴方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜健瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李常愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊文宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳如贄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅振庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, ZHEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊竣翔</last-name>
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                <last-name>YANG, CHUN-XIANG</last-name>
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                <last-name>LI, CHUN-HSIEN</last-name>
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                <first-name></first-name>
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                <last-name>WANG, NING-HSUAN</last-name>
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                <last-name>LIN, CHI-HSIANG</last-name>
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                <last-name>廖于嫺</last-name>
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                <last-name>LIAO, YU-XIAN</last-name>
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                <first-name></first-name>
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                <last-name>傅俊瑋</last-name>
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                <last-name>FU, CHUN-WEI</last-name>
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                <last-name>李奇韋</last-name>
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                <last-name>LEE, CHI-WEI</last-name>
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                <last-name>蔡承宏</last-name>
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                <last-name>TSAI, CHENG-HUNG</last-name>
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                <last-name>陳冠予</last-name>
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                <last-name>CHEN, KUAN-YU</last-name>
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                <last-name>彭欣瑜</last-name>
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                <last-name>PENG, HSIN-YU</last-name>
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                <last-name>劉銘源</last-name>
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                <last-name>LIU, MING-YUAN</last-name>
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                <last-name>汪俊逸</last-name>
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                <last-name>WANG, JUN-YI</last-name>
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                <first-name></first-name>
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              <chinese-name name-type="organization">
                <last-name>周靖筌</last-name>
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                <last-name>CHOU, CHING-CHUAN</last-name>
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                <first-name></first-name>
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        <agents>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可調控變向投餌設備可將養殖飼料投放至養殖場域，且包括飼料儲存槽、輸料裝置以及可變向出料裝置。飼料儲存槽儲存養殖飼料。輸料裝置輸送養殖飼料至可變向出料裝置。可變向出料裝置具有第一風管件以及第二風管件。第一風管件具有輸送管以及第一齒輪轉盤。第二風管件具有投放管以及第二齒輪轉盤。第一齒輪轉盤與第二齒輪轉盤相互咬合，投放管包括水平部以及彎折部，水平部的延伸線與彎折部之間具有投放角度，當第一齒輪轉盤被驅動而轉動時，第一齒輪轉盤帶動第二齒輪轉盤轉動，以改變第二風管件的投放管投放養殖飼料的方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可調控變向投餌設備</p>
        <p type="p">110:飼料儲存槽</p>
        <p type="p">120:輸料裝置</p>
        <p type="p">130:可變向出料裝置</p>
        <p type="p">132:第一風管件</p>
        <p type="p">134:第二風管件</p>
        <p type="p">136:排風機</p>
        <p type="p">137:遠端風量控制器</p>
        <p type="p">200:養殖飼料</p>
        <p type="p">1322:輸送管</p>
        <p type="p">1324:第一齒輪轉盤</p>
        <p type="p">1326:入料端</p>
        <p type="p">1328:驅動模組</p>
        <p type="p">1342:投放管</p>
        <p type="p">1344:第二齒輪轉盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="151" publication-number="202631010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調控進料投餌設備及其操作方法</chinese-title>
        <english-title>ADJUSTABLE FEEDING EQUIPMENT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250205B">A01K61/80</main-classification>
      </classification-ipc>
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                <last-name>國立臺灣海洋大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN OCEAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>鄭智湧</last-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>張欽圳</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHANG, CHIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>冉繁華</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>胡鄴方</last-name>
                <first-name></first-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>杜健瑋</last-name>
                <first-name></first-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>楊大正</last-name>
                <first-name></first-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>李常愷</last-name>
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              <english-name name-type="organization">
                <last-name>LEE, CHANG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <chinese-name name-type="organization">
                <last-name>莊文宗</last-name>
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                <last-name>CHUANG, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>陳如贄</last-name>
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              <english-name name-type="organization">
                <last-name>CHEN, JU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>羅振庭</last-name>
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              <english-name name-type="organization">
                <last-name>LUO, ZHEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>林彥辰</last-name>
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              <english-name name-type="organization">
                <last-name>LIN, YAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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                <last-name>楊竣翔</last-name>
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                <last-name>YANG, CHUN-XIANG</last-name>
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                <first-name></first-name>
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              <english-country>TW</english-country>
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                <last-name>李俊賢</last-name>
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                <last-name>LI, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
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                <last-name>王甯玄</last-name>
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                <last-name>WANG, NING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>馮柏鈺</last-name>
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              <english-name name-type="organization">
                <last-name>FENG, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>江允含</last-name>
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                <last-name>CHIANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>TW</english-country>
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                <last-name>陳若昀</last-name>
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                <last-name>CHEN, ROU-YUN</last-name>
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                <first-name></first-name>
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                <last-name>林啟翔</last-name>
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                <last-name>LIN, CHI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>廖于嫺</last-name>
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                <last-name>LIAO, YU-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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                <last-name>傅俊瑋</last-name>
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                <last-name>FU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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              <chinese-name name-type="organization">
                <last-name>李奇韋</last-name>
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              <english-name name-type="organization">
                <last-name>LEE, CHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="22">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="23">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠予</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="24">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭欣瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="25">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉銘源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="26">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪俊逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="27">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周靖筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可調控進料投餌設備可將養殖飼料投放至養殖場域，且包括飼料儲存槽、可調控進料裝置以及可變向出料裝置。飼料儲存槽儲存養殖飼料。可調控進料裝置具有頂蓋、轉盤、固定座件以及調控馬達。頂蓋設置於轉盤上方，轉盤連接調控馬達，頂蓋的進料孔的直徑距離小於轉盤的直徑距離，轉盤的直徑距離小於固定座件的環狀壁的直徑距離，當養殖飼料經由頂蓋的進料孔掉落至轉盤上方時，調控馬達帶動轉盤轉動，使養殖飼料藉由轉盤轉動所產生的離心力被轉移至環狀壁與調控馬達之間的鏤空區。出料裝置的排風機將養殖飼料投放至養殖場域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">120:可調控進料裝置</p>
        <p type="p">121:接料件</p>
        <p type="p">122:頂蓋</p>
        <p type="p">123:卡扣部</p>
        <p type="p">124:轉盤</p>
        <p type="p">125:抗迴風件</p>
        <p type="p">126:固定座件</p>
        <p type="p">127:環狀壁</p>
        <p type="p">128:調控馬達</p>
        <p type="p">129:轉動部</p>
        <p type="p">A:鏤空區</p>
        <p type="p">B1:固定部</p>
        <p type="p">B2:連接部</p>
        <p type="p">C:側向抗風部</p>
        <p type="p">D:環狀部</p>
        <p type="p">E:遠端控制器</p>
        <p type="p">H1:進料孔</p>
        <p type="p">O:側向開口</p>
        <p type="p">R1:第一直徑距離</p>
        <p type="p">R2:第二直徑距離</p>
        <p type="p">R3:第三直徑距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="152" publication-number="202632120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剪力牆裝置</chinese-title>
        <english-title>SHEAR WALL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">E04B2/56</main-classification>
        <further-classification edition="200601120250423B">E04B2/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜怡萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BING-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古雯瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, WEN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種剪力牆裝置，適用於固定於一建築物，並包含一鋼架單元、一側板單元，及一第一定位單元。該鋼架單元包括固定於該建築物的一底梁與一頂梁，及數個上下延伸且左右間隔排列地設置於該底梁與該頂梁之間的立柱組。該側板單元包括至少一設置於該鋼架單元的板件。該至少一板件的厚度至少30毫米且為木製。該第一定位單元用以將該側板單元與該鋼架單元相固定，並包括數個固定穿設於該側板單元與該鋼架單元的第一定位件。藉由該鋼架單元與該側板單元相配合，相較於已知的鋼筋混凝土剪力牆裝置有輕量化、可回收、易於施作等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A shear wall device for fixing to a building including a steel frame unit, a side plate unit and a first positioning unit. The steel frame unit includes a bottom beam and a top beam fixed to the building, and a plurality of upright column units extending in the top - bottom direction and spaced apart from each other in a left - right direction and arranged between the bottom beam and the top beam. The side plate unit includes at least one plate member disposed on the steel frame unit. The at least one plate member has a thickness of at least 30 mm and is wooden. The first positioning unit is used for fixing the side plate unit with the steel frame unit, and includes a plurality of first positioning members fixedly extending through the side plate unit and the steel frame unit. Through the cooperation of the steel frame unit and the side plate unit, the advantages of being lightweight, recyclable, easy to assemble compared with conventional reinforced concrete shear wall devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鋼架單元</p>
        <p type="p">21:底梁</p>
        <p type="p">22:頂梁</p>
        <p type="p">23:立柱組</p>
        <p type="p">231:立柱</p>
        <p type="p">24:鋼架定位件</p>
        <p type="p">3:側板單元</p>
        <p type="p">31:板件</p>
        <p type="p">4:第一定位單元</p>
        <p type="p">41:第一定位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="153" publication-number="202631953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻液</chinese-title>
        <english-title>COOLANT SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C09K5/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠東新世紀股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAR EASTERN NEW CENTURY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣適多博股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN STOBA ELECTRODES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘金平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JING-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁金水</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIN-SHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝國忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIEN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宗田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TSUNG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉弘麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作關於一種冷卻液，其包含二元醇、水及添加劑，該添加劑相對於該二元醇和水的總量之佔比為0.1 wt%至20 wt%，且該添加劑包含馬來醯亞胺類化合物、巴比妥類化合物、由前述二化合物聚合而成之自身終止高分歧聚合物（STOBA）、或其組合。藉由摻混前述添加劑，本創作之改良型冷卻液能具有較高的比熱容，該冷卻液能兼顧優異的冷卻散熱效率和耐腐蝕性，具體提升液冷散熱效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a coolant solution, comprising glycol, water, and an additive. The additive is in an amount of 0.1 wt% to 20 wt% relative to the total amount of glycol and water, and it includes maleimide-based compound, barbital-based compound, and self-terminated oligomer with hyper-branched architecture (STOBA) synthesized through the polymerization of the previous compounds, and any combinations thereof. By incorporating the additive, the coolant solution of improved specific heat capacity exhibits excellent cooling efficiency and corrosion resistance, thereby significantly enhancing the liquid cooling performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="154" publication-number="202632399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示模組、半穿反顯示裝置及顯示模組的製造方法</chinese-title>
        <english-title>DISPLAY MODULE, TRANSFLECTIVE DISPLAY DEVICE AND MANUFACTURING METHOD OF DISPLAY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">G02F1/1335</main-classification>
        <further-classification edition="200601120251017B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳殿榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TIEN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫宗翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TSUNG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示模組包含第一電極、第二電極、液晶層及補償組件。第一電極的一面具有配向。第二電極位於第一電極上方，其中第二電極朝向第一電極的一面具有與第一電極同方向的配向。液晶層位於第一電極與第二電極之間，其中液晶層配置以產生朝第一方向扭轉180度的第一排列狀態，第一電極與第二電極配置以施加第一電壓，以使液晶層自第一排列狀態改變排列至朝第二方向扭轉180度的第二排列狀態，第二方向與第一方向相反。補償組件位於第二電極上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display module includes a first electrode, a second electrode, a liquid crystal layer and a compensating assembly. A surface of the first electrode has an alignment. The second electrode is located above the first electrode, and a surface of the second electrode facing toward the first electrode has the same alignment as the first electrode. The liquid crystal layer is located between the first electrode and the second electrode, in which the liquid crystal layer is configured to produce a first alignment state twisted toward a first direction for 180 degree. The first electrode and the second electrode are configured to apply a first voltage such that the liquid crystal layer is changed from the first alignment state to a second alignment state twisted toward a second direction for 180 degree. The second direction is opposite to the first direction. The compensating assembly is located on the second electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140a:補償組件</p>
        <p type="p">150:第一偏振片</p>
        <p type="p">160:第二偏振片</p>
        <p type="p">170:顯示面板</p>
        <p type="p">200:半穿反顯示裝置</p>
        <p type="p">250:半穿反片</p>
        <p type="p">252:理想反射區</p>
        <p type="p">254:理想穿透區</p>
        <p type="p">260:第一四分之一波長板</p>
        <p type="p">270:第一二分之一波長板</p>
        <p type="p">280:第二四分之一波長板</p>
        <p type="p">290:第二二分之一波長板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="155" publication-number="202631468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>倉儲式自動給板裝置及多層板預疊合機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">B65G1/04</main-classification>
        <further-classification edition="200601120250424B">B65G47/92</further-classification>
        <further-classification edition="200601120250424B">B65G43/08</further-classification>
        <further-classification edition="200601120250424B">H05K13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶翔精密有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚福來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種倉儲式自動給板裝置包括有：機架，兩側設有直立導桿；倉儲盒，藉由直線軸承設置於直立導桿，倉儲盒具有數個抽屜，抽屜的兩側設有齒排；倉儲盒升降驅動單元，設置倉儲盒驅動螺桿於機架的兩側，及設置倉儲盒驅動動力組於機架，倉儲盒驅動螺桿搭配有倉儲盒驅動螺套，倉儲盒驅動螺套固定於倉儲盒，倉儲盒驅動螺桿與倉儲盒驅動動力組動力連接；抽屜開合驅動單元，設置進退動力源於機架的兩側，及設置抽屜驅動動力組於進退動力源，藉由進退動力源控制抽屜驅動動力組與齒排的動力連接態樣；以及人機介面，設置於機架，輸入及控制倉儲盒升降驅動單元及抽屜開合驅動單元的作動程序。藉此，用以解決先前技術人工拾取板材易發生錯誤之問題，而具有自動且正確給板之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機架</p>
        <p type="p">11:直立導桿</p>
        <p type="p">20:倉儲盒</p>
        <p type="p">21:直線軸承</p>
        <p type="p">22:抽屜</p>
        <p type="p">23:輸送平台</p>
        <p type="p">31:倉儲盒驅動螺桿</p>
        <p type="p">311:倉儲盒驅動螺套</p>
        <p type="p">32:倉儲盒驅動動力組</p>
        <p type="p">321:傳動輪</p>
        <p type="p">322:倉儲盒升降馬達</p>
        <p type="p">323:惰輪</p>
        <p type="p">324:驅動輪</p>
        <p type="p">325:傳動皮帶</p>
        <p type="p">40:抽屜開合驅動單元</p>
        <p type="p">60:抽屜鎖定單元</p>
        <p type="p">71:輸送平台驅動螺桿</p>
        <p type="p">711:輸送平台驅動螺套</p>
        <p type="p">72:輸送平台驅動動力組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="156" publication-number="202631235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運動評估裝置與系統</chinese-title>
        <english-title>ATHLETIC ASSESSMENT DEVICE AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250930B">A63B71/06</main-classification>
        <further-classification edition="200601120250930B">A63B24/00</further-classification>
        <further-classification edition="200601120250930B">A63B69/00</further-classification>
        <further-classification edition="200601120250930B">A63B21/00</further-classification>
        <further-classification edition="200601120250930B">A61B5/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽漣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABBONI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温瓌岸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, KUEI ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">運動評估裝置與系統配備體適能計算裝置（physical fitness measurement device 或sports fitness measurement device），包含多數體適能計算器，個別計算下列體適能元素（the components of physical fitness）中至少一種的數值：平衡性 （balance）、敏捷度（agility）、爆發力（power）、速度（speed）、柔軟度（flexibility）。該運算裝置的輸出資料包括該體適能元素中的至少一種的數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Athletic assessment device and system comprising a physical fitness measurement device or sports fitness measurement device equipped with at least one physical fitness component calculator, each calculates one of balance, agility, power, speed and flexibility relating to an athletic activity. The output data of the athletic assessment device and system includes data relating to one of said physical fitness components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:運動評估裝置</p>
        <p type="p">110:通信線</p>
        <p type="p">111:運動感測裝置</p>
        <p type="p">111a，111b，111c:運動感測器</p>
        <p type="p">111d:無線通信模組</p>
        <p type="p">111e:控制器</p>
        <p type="p">112:運算裝置</p>
        <p type="p">112b:輸出介面</p>
        <p type="p">112c:有線通信模組</p>
        <p type="p">112d:無線通信模組</p>
        <p type="p">113:體適能計算裝置</p>
        <p type="p">113a，113b，113c，113d，113e:計算器</p>
        <p type="p">114:輸出入資料控制器</p>
        <p type="p">115:顯示器</p>
        <p type="p">116:運動評估裝置</p>
        <p type="p">116a:儲存裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="157" publication-number="202631246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過濾系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250505B">B01D61/08</main-classification>
        <further-classification edition="200601120250505B">B01D45/12</further-classification>
        <further-classification edition="200601120250505B">B01D35/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加昌國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERINN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種負壓逆滲透式過濾裝置，包含一筒件、一銜接蓋、一端蓋單元，及一逆滲透過濾件。該筒件包括二相反設置的端部。該銜接蓋設置於其中一該端部，並包括二蓋口。該端蓋單元設置於另一該端部，並具有一內環錐面。該逆滲透過濾件穿置於該筒件內，並抵靠該銜接蓋及該端蓋單元，該逆滲透過濾件界定出一管道，並包括一抵靠於該內環錐面的外環錐面，該逆滲透過濾件與該筒件界定出一腔室，該腔室與其中一該蓋口界定出一第一流道，該管道與另一該蓋口界定出一第二流道，該第一流道及該第二流道其中一者形成負壓狀態，以驅動水分子通過該逆滲透過濾件。藉由該逆滲透過濾件來過濾流體，達到提高流體潔淨度的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:筒件</p>
        <p type="p">21:端部</p>
        <p type="p">3:銜接蓋</p>
        <p type="p">31:孔道</p>
        <p type="p">32:管體部</p>
        <p type="p">33:環道</p>
        <p type="p">34:本體部</p>
        <p type="p">35:環緣</p>
        <p type="p">36:蓋口</p>
        <p type="p">4:端蓋單元</p>
        <p type="p">41:端蓋</p>
        <p type="p">411:端口</p>
        <p type="p">412:內環錐面</p>
        <p type="p">42:封蓋</p>
        <p type="p">43:隔水件</p>
        <p type="p">44:固定組</p>
        <p type="p">5:逆滲透過濾件</p>
        <p type="p">51:內管面</p>
        <p type="p">511:管道</p>
        <p type="p">52:外管面</p>
        <p type="p">53:第一環接面</p>
        <p type="p">531:嵌設槽</p>
        <p type="p">54:第二環接面</p>
        <p type="p">55:外環錐面</p>
        <p type="p">L:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="158" publication-number="202632205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋風型熱交換裝置及過濾系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">F28F5/04</main-classification>
        <further-classification edition="200601120250318B">F28F13/06</further-classification>
        <further-classification edition="200601120250318B">F04B35/02</further-classification>
        <further-classification edition="200601120250318B">B01D45/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加昌國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERINN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種旋風型熱交換裝置，包含一筒件、一端蓋單元、一管件單元、一旋風環件，及一連動單元。該端蓋單元包括二設置於該筒件的端蓋。該管件單元穿置於該筒件內，並包括二中空管件，及一螺接於其中一該中空管件的調整管件。另一該中空管件與該調整管件相隔一間隙。該連動單元穿設於其中一該端蓋，包括一可轉動的轉動桿，及一沿該軸線的徑向延伸且連接於該轉動桿及該調整管件間的連動桿，該轉動桿能被操作而以該軸線為軸心轉動，進而帶動該調整管件相對該第一管件轉動，用以放大或縮小該間隙，藉此達到便於使用的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:筒件</p>
        <p type="p">21:端部</p>
        <p type="p">3:端蓋單元</p>
        <p type="p">31:端蓋</p>
        <p type="p">311:孔道</p>
        <p type="p">312:管體部</p>
        <p type="p">313:環道</p>
        <p type="p">314:本體部</p>
        <p type="p">315:環緣</p>
        <p type="p">316:開口</p>
        <p type="p">4:管件單元</p>
        <p type="p">41:第一中空管件</p>
        <p type="p">411:管道</p>
        <p type="p">42:第二中空管件</p>
        <p type="p">43:調整管件</p>
        <p type="p">5:旋風環件</p>
        <p type="p">51:環本體</p>
        <p type="p">52:葉片</p>
        <p type="p">6:連動單元</p>
        <p type="p">61:轉動桿</p>
        <p type="p">62:連動桿</p>
        <p type="p">63:操作件</p>
        <p type="p">7:冷凝單元</p>
        <p type="p">71:致冷晶片模組</p>
        <p type="p">711:吸熱面板</p>
        <p type="p">712:放熱面板</p>
        <p type="p">713:致冷晶片</p>
        <p type="p">72:放熱模組</p>
        <p type="p">721:基壁</p>
        <p type="p">722:外圍壁</p>
        <p type="p">723:內圍壁</p>
        <p type="p">724:導流壁</p>
        <p type="p">729:缺口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="159" publication-number="202632094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種終止缺陷暴露的非晶質表面形成方法</chinese-title>
        <english-title>A METHOD FOR FORMING AMORPHOUS SURFACE TO TERMINATE DEFECT EXPOSURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C30B35/00</main-classification>
        <further-classification edition="200601120260302B">C30B29/36</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力拓半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEAP SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭凱起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, KAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃孝惇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種終止缺陷暴露的非晶質表面形成方法，亦即一種於碳化矽晶圓表面形成非晶質層的方法，本發明首先提供碳化矽晶圓，經清潔碳化矽晶圓後，以物理性的微粒化，形成碳化矽晶圓表面非晶質層，並終止缺陷的暴露以及延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for forming an amorphous surface to terminate defect exposure, that is a method for forming an amorphous layer on the surface of silicon carbide wafer, firstly the present invention provides the silicon carbide wafer, and then cleans the silicon carbide wafer, finally forms an amorphous layer on the surface of silicon carbide wafer to terminate exposure defects and extension through the physically top-down methods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電漿源</p>
        <p type="p">102:碳化矽晶圓</p>
        <p type="p">103:非晶質層結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="160" publication-number="202631440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動摩托車的電池固定總成</chinese-title>
        <english-title>BATTERY FIXING ASSEMBLY FOR AN ELECTRIC MOTORCYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250328B">B62J43/20</main-classification>
        <further-classification edition="202101120250328B">H01M50/242</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉育帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃勇堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YONG-JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明電動摩托車的電池固定總成，包含：電池、電池安裝座、可動擋件與推抵機構，電池能選擇性組卸於電池安裝座，可動擋件能靠近於電池，則推抵機構設置在可動擋件，並在可動擋件靠近於電池時能抵觸於電池，另外，推抵機構主要具有滑動件、推抵彈簧與緩衝件，滑動件能在可動擋件的容置部內進行移動，而推抵彈簧位於可動擋件與滑動件之間，並能推動滑動件，則緩衝件連接於滑動件，並位於容置部的外部，使得緩衝件能直接接觸於電池而產生形變，同時，推抵彈簧受到滑動件與可動擋件擠壓而形變，藉此，推抵機構透過推抵彈簧與緩衝件能避免過度壓迫電池以提高電池安裝於電池安裝座的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a battery fixing assembly for an electric motorcycle comprising a battery, a battery base, a movable cover, and a pushing mechanism. The battery is detachably attached to the battery base, and the pushing mechanism is assembled with the movable cover. When the movable cover is close to the battery, the pushing mechanism generates deformation to push the battery. Wherein, the pushing mechanism comprises a sliding member, a spring, and a buffer member. The sliding member can be moved in an accommodating portion of the movable cover. The spring is positioned between the movable cover and the sliding member for moving the sliding member. The buffer member connects the sliding member and positions outside the accommodating portion. Therefore, the buffer member can directly touch the battery to generate a first deform, and the spring can be pushed by the sliding member and the movable cover to generate a second deform. Thus, the pushing mechanism can generate two kinds of deform to absorb unnecessary force pressing the battery, so that the battery can be attached to the battery base in the best condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電動摩托車的電池固定總成</p>
        <p type="p">10:電池</p>
        <p type="p">20:電池安裝座</p>
        <p type="p">30:置物箱</p>
        <p type="p">40:合棉本體</p>
        <p type="p">50:可動擋件</p>
        <p type="p">51:容置部</p>
        <p type="p">60:推抵機構</p>
        <p type="p">P2:靠近位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="161" publication-number="202633053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樞紐器與使用其的電子裝置</chinese-title>
        <english-title>HINGE AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">H05K7/12</main-classification>
        <further-classification edition="200601120251017B">F16M11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新日興股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN ZU SHING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐貴新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樞紐器，包括基座、兩第一支架、連動機構、兩支撐板與兩固定座。基座設有相對的兩第一弧形滑接部。各第一支架設有第二和第三弧形滑接部與限位滑槽，第二和第一弧形滑接部滑動連接。連動機構包括兩第二支架可轉動地連接於連動模組，各第二支架設有第一直線形滑接部與驅動滑槽。各支撐板包括限位塊、驅動塊與彈性件，限位塊滑動連接於限位滑槽，驅動塊滑動連接於驅動滑槽。各固定座設有第四弧形滑接部與第二直線形滑接部，第四和第三弧形滑接部滑動連接，第二和第一直線形滑接部滑動連接。各彈性件的兩端分別連接於支撐板與固定座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hinge includes a main base, two first brackets, a linkage structure, two support plates, and two fixing bases. The main base is provided with two opposite first arc-shaped sliding connection portions. Each first bracket is provided with a second and a third arc-shaped sliding connection portions, and a limiting sliding groove, where the second and the first arc-shaped sliding connection portions are slidably connected. The linkage structure includes two second brackets rotatably connected to a linkage module, where each second bracket is provided with a first linear sliding connection portion and a driving sliding groove. Each support plate includes a limiting block, a driving block, and an elastic member, where the limiting block is slidably connected to the limiting sliding groove, and the driving block is slidably connected to the driving sliding groove. Each fixing base is provided with a fourth arc-shaped sliding connection portion and a second linear sliding connection portion, where the fourth and the third arc-shaped sliding connection portions are slidably connected, and the second and the first linear sliding connection portions are slidably connected. Both ends of each elastic member are respectively connected to the support plate and the fixing base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樞紐器</p>
        <p type="p">10:基座</p>
        <p type="p">20:第一支架</p>
        <p type="p">30:連動機構</p>
        <p type="p">40:連動模組</p>
        <p type="p">50:第二支架</p>
        <p type="p">60:扭力產生模組</p>
        <p type="p">70:支撐板</p>
        <p type="p">74:彈性件</p>
        <p type="p">80:固定座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="162" publication-number="202632279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於掃描穿隧顯微鏡的樣品固定器與進行原位橫截面掃描穿隧顯微鏡測量的方法</chinese-title>
        <english-title>SAMPLE HOLDER FOR SCANNING TUNNELING MICROSCOPY AND METHOD FOR IN SITU CROSS-SECTIONAL SCANNING TUNNELING MICROSCOPY MEASUREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250307B">G01Q60/10</main-classification>
        <further-classification edition="201001120250307B">G01Q90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱雅萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種多功能的樣品固定器，用於在超高真空下進行原位橫截面掃描穿隧顯微鏡測量。該樣品固定器設計適用於超高真空和低溫操作，具有由真空相容性聚合物（例如PCTFE）製成的絕緣板和由高導電性金屬（例如鍍金鉍銅）製成的導電板。樣品固定子組件確保樣品在原位劈裂時穩定且直立地定位，從而暴露出新鮮的橫截面以進行原子尺度的成像。樣品固定器包括用於偏壓應用和電流注入的電接觸元件，且在樣品固定器上或內部設置有加熱元件、溫度感測器或磁場元件的功能元件。這些特徵允許在受控的電壓、溫度和磁場條件下同時進行橫截面掃描穿隧顯微鏡測量，使得能夠對半導體器件及其他先進材料在原子級別上進行全面分析。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a multifunctional sample holder for in situ cross-sectional scanning tunneling microscopy (STM) measurements under ultra-high vacuum (UHV) conditions. The sample holder is designed for UHV and cryogenic operation, featuring insulating plates made of vacuum-compatible polymers (e.g., PCTFE) and conductive plates made of high-conductivity metals (e.g., gold-plated beryllium copper). The sample-securing subassembly ensures that the sample is stably and uprightly positioned during in situ cleavage, thereby exposing a fresh cross-section for atomic-scale imaging. The sample holder includes electrical contact elements for bias application and current injection, and functional components such as heating elements, temperature sensors, or magnetic field elements are disposed on or within the sample holder. These features allow simultaneous cross-sectional STM measurements under controlled voltage, temperature, and magnetic field conditions, enabling comprehensive atomic-level analysis of semiconductor devices and other advanced materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:樣品固定器</p>
        <p type="p">10:樣品</p>
        <p type="p">12:電極</p>
        <p type="p">12a:源極</p>
        <p type="p">12b:漏極</p>
        <p type="p">16:預刻痕</p>
        <p type="p">110:基座模組</p>
        <p type="p">112:導電板</p>
        <p type="p">1122:螺孔</p>
        <p type="p">1124:拉環</p>
        <p type="p">114:絕緣板</p>
        <p type="p">1142:螺孔</p>
        <p type="p">120:樣品固定子組件</p>
        <p type="p">122:夾持元件</p>
        <p type="p">124:緊固件</p>
        <p type="p">126:夾持空間</p>
        <p type="p">132:螺絲</p>
        <p type="p">134:導電路徑</p>
        <p type="p">136、136a、136b、136c:導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="163" publication-number="202633010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路回饋系統</chinese-title>
        <english-title>CIRCUIT FEEDBACK SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H05B45/50</main-classification>
        <further-classification edition="202001120250303B">H05B45/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億光電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERLIGHT ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳若慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JO-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘詩樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SHIH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路回饋系統，包括控制器，用以判斷燈管裝置中的燈板是否故障以產生第一電壓信號，並用以判斷燈管裝置中的電源電路是否故障以產生第二電壓信號；以及驅動器，用以依據第一電壓信號對燈板供電，並用以依據第二電壓信號對電源電路供電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit feedback system, comprising a controller configured to determine whether a light panel of a light tube device is malfunction and generate a first voltage signal, and configured to determine whether a power source circuit of the light tube device is malfunction and generate a second voltage signal; and a driver configured to provide power to the light panel according to the first voltage signal, and configured to provide power to the power source circuit according to the second voltage signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路回饋系統</p>
        <p type="p">101、102:開關</p>
        <p type="p">110:驅動器</p>
        <p type="p">120:驅動晶片</p>
        <p type="p">130:燈管裝置</p>
        <p type="p">131:燈板</p>
        <p type="p">132:電源電路</p>
        <p type="p">140:控制器</p>
        <p type="p">VDriver、VLed:電壓信號</p>
        <p type="p">V_D、V_L:回饋電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="164" publication-number="202633011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>ILLUMINATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250423B">H05B45/50</main-classification>
        <further-classification edition="202001120250423B">H05B45/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億光電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERLIGHT ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳若慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JO-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘詩樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SHIH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光裝置，包括第一燈管裝置，用以依據第一節點的電壓準位發光；第一驅動器，耦接於第一節點，並用以對第一燈管裝置進行供電；第一回饋電路，用以測量第一節點的第一節點信號，並依據第一節點信號產生第一回饋信號；以及控制器，用以依據第一回饋信號判斷第一燈管裝置是否發生故障。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A illuminating device comprising: a first light tube device configured to illuminate according to a voltage level of a first node; a first driver coupled to the first node, configured to provide power to the first light tube device; a first feedback circuit configured to measure a first node signal of the first node, and generating a first feedback signal according to the first node signal; and a controller configured to determine whether the first light tube device is malfunction according to the first feedback signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">101:回饋電路</p>
        <p type="p">110:驅動器</p>
        <p type="p">120:燈管裝置</p>
        <p type="p">130:控制器</p>
        <p type="p">VDD:輸入電壓</p>
        <p type="p">VA:節點信號</p>
        <p type="p">V_FAULT:回饋信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="165" publication-number="202632913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適應性調整天線功率之電子裝置及方法</chinese-title>
        <english-title>ELECTRONIC DEVICE FOR ADAPTIVELY ADJUSTING ANTENNA POWER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04B1/04</main-classification>
        <further-classification edition="201501120250401B">H04B17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅偉誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖國助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUO-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種適應性調整天線功率之電子裝置及方法。在電子裝置中，複數組諧調器分別電性連接天線，使每一組諧調器分別對應一天線。數據機電性連接複數組諧調器，以控制諧調器，並取得複數組諧調器各自的一狀態資訊。處理裝置電性連接數據機，並根據狀態資訊之變化來判斷複數組諧調器之作動，當複數組諧調器中只有一組作動或鄰近組別同時作動時，處理裝置將數據機之一輸出功率設定為一肢體特定吸收率模式；當複數組諧調器中全部組別都在作動或相對長邊組別同時作動時，處理裝置將數據機之輸出功率設定為一全身特定吸收率模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an electronic device for adaptively adjusting antenna power and a method thereof. In the electronic device, a plurality of groups of tuners is electrically connected to antennas respectively, so that each group of tuners corresponds to an antenna. The modem is electrically connected to the plurality of tuners to control the tuners and obtain status information of each of the plurality of tuners. A processing device is electrically connected to the modem and determines the operation of the plurality of tuners according to changes of the status information. When only one group of the tuners acts or adjacent groups act simultaneously, the processing device sets an output power of the modem to a limb specific absorption rate mode. When all groups of the tuners act or relatively long side groups act at the same time, the processing device sets the output power of the modem to a body specific absorption rate mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S30~S42:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="166" publication-number="202631501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨銅電線之製備方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING GRAPHITE COPPER WIRE FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250602B">C01B32/205</main-classification>
        <further-classification edition="201701120250602B">C01B32/21</further-classification>
        <further-classification edition="202301120250602B">C22C1/05</further-classification>
        <further-classification edition="200601120250602B">C22C9/00</further-classification>
        <further-classification edition="200601120250602B">H01B1/02</further-classification>
        <further-classification edition="200601120250602B">H01B5/02</further-classification>
        <further-classification edition="200601120250602B">H01B13/00</further-classification>
        <further-classification edition="200601120250602B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
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          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韵涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做石墨銅電線之製備方法，是將廢棄鋰系列電池經過物理分解後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過調整人工石墨含量，使用一定的比例，如0.5wt%～5wt%比例加入到銅金屬內，來形成一個具有負溫度係數、高抗拉強度、高導電率複合性材料的電纜線導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing graphite copper wire from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the internal anode materials are obtained through processes of washing, dehydration, drying, and sieving. These anode materials are generally carbon powder, primarily consisting of artificial graphite with a carbon content exceeding 99%. By adjusting the artificial graphite content, a certain proportion, such as 0.5wt% to 5wt%, is added to copper metal to form a cable conductor with negative temperature coefficient, high tensile strength, and high conductivity composite material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負極極捲(片)</p>
        <p type="p">2:碳粉</p>
        <p type="p">3:人工石墨</p>
        <p type="p">4:人工石墨溶液</p>
        <p type="p">5:高含水量的石墨</p>
        <p type="p">6:特殊石墨</p>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">S10:步驟十</p>
        <p type="p">S11:步驟十一</p>
        <p type="p">S12:步驟十二</p>
        <p type="p">S13:步驟十三</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="167" publication-number="202631502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨鋁電線之製備方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING GRAPHITE ALUMINUM WIRE FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/205</main-classification>
        <further-classification edition="201701120250501B">C01B32/21</further-classification>
        <further-classification edition="202301120250501B">C22C1/10</further-classification>
        <further-classification edition="200601120250501B">C22C21/00</further-classification>
        <further-classification edition="200601120250501B">C22F1/04</further-classification>
        <further-classification edition="200601120250501B">H01B1/02</further-classification>
        <further-classification edition="200601120250501B">H01B1/04</further-classification>
        <further-classification edition="200601120250501B">H01B5/02</further-classification>
        <further-classification edition="200601120250501B">H01B13/00</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韵涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做石墨鋁電線之製備方法，是將廢棄鋰系列電池經過物理分解後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過調整人工石墨含量，使用一定的比例，如0.5wt%～5wt%比例加入到鋁金屬內，來形成一個具有負溫度係數、高抗拉強度、高導電率複合性材料的電纜線導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing graphite aluminum wire from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the internal anode materials are obtained through processes of washing, dehydration, drying, and sieving. These anode materials are generally carbon powder, primarily consisting of artificial graphite with a carbon content exceeding 99%. By adjusting the artificial graphite content, a certain proportion, such as 0.5wt% to 5wt%, is added to aluminum metal to form a cable conductor with negative temperature coefficient, high tensile strength, and high conductivity composite material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負極極捲(片)</p>
        <p type="p">2:碳粉</p>
        <p type="p">3:人工石墨</p>
        <p type="p">4:人工石墨溶液</p>
        <p type="p">5:高含水量的石墨</p>
        <p type="p">6:特殊石墨</p>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">S10:步驟十</p>
        <p type="p">S11:步驟十一</p>
        <p type="p">S12:步驟十二</p>
        <p type="p">S13:步驟十三</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="168" publication-number="202631494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102184</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做液態及乾燥石墨烯之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING LIQUID AND DRY GRAPHENE FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="200601120250501B">C04B33/132</further-classification>
        <further-classification edition="200601120250501B">C04B33/24</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做液態及乾燥石墨烯之方法，是將廢棄鋰系列電池經過物理分解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、脫水、乾燥等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層石墨烯產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing liquid and dry graphene from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the materials are either manually or mechanically crushed. The internal anode materials are then obtained through processes of washing, dehydration, drying, and sieving. These anode materials are generally carbon powder, primarily consisting of artificial graphite with a carbon content exceeding 99%. Through processes such as sintering, NMP ultrasonic cleaning, wet grinding, dehydration, and drying, single-layer graphene products can be obtained without consuming a large amount of energy compared to traditional methods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負極極捲(片)</p>
        <p type="p">2:碳粉</p>
        <p type="p">3:人工石墨</p>
        <p type="p">4:單層石墨烯液體產品</p>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">S10:步驟十</p>
        <p type="p">S11:步驟十一</p>
        <p type="p">S12:步驟十二</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="169" publication-number="202631505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做活性碳之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING ACTIVATED CARBON FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250923B">C01B32/30</main-classification>
        <further-classification edition="202201120250923B">B09B3/35</further-classification>
        <further-classification edition="201001120250923B">H01M4/133</further-classification>
        <further-classification edition="202201320250923B">B09B101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韵涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做活性碳之方法，是將廢棄鋰系列電池經過物理分解後，從負極極捲(片)分離出碳粉，接著將碳粉進行水洗、脫水、乾燥、物理性加熱後，即可獲得活性碳，據此，本發明製造過程並不需要耗費大量能源就可以取的優良的碳粉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing activated carbon from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the carbon powder is separated from the anode roll (sheet). The carbon powder is then washed, dehydrated, dried, and physically heated to obtain activated carbon. This process, as per the invention, does not require a large amount of energy to produce high-quality carbon powder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="170" publication-number="202631908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做碳黑原生粒子之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING CARBON BLACK PRIMARY PARTICLES FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C09C1/48</main-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韵涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做碳黑原生粒子之方法，是將廢棄鋰系列電池經過物理分解後，從負極極捲(片)分離出碳粉，接著將碳粉進行水洗、脫水、乾燥、過篩、缺氧燃燒後後，即可獲得粒徑為50-100nm的碳黑原生粒子，據此，本發明製造過程與傳統相比較並不需要耗費大量能源就可以取的優良的碳黑原生粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing carbon black primary particles from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the carbon powder is separated from the anode roll (sheet). The carbon powder is then washed, dehydrated, dried, sieved, and subjected to oxygen-deficient combustion to obtain carbon black primary particles with a particle size of 50-100 nm. This process, compared to traditional methods, does not require a large amount of energy to produce high-quality carbon black primary particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">3:碳黑原生粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="171" publication-number="202632771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做碳黑之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING CARBON BLACK FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250708B">H01M10/54</main-classification>
        <further-classification edition="200601120250708B">C09C1/48</further-classification>
        <further-classification edition="202201120250708B">B09B3/30</further-classification>
        <further-classification edition="202201320250708B">B09B101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韵涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭奕嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, I-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做碳黑之方法，是將廢棄鋰系列電池經過物理分解後，從負極極捲(片)分離出碳粉，接著將碳粉進行篩選、乾燥、物理性燃燒、濕式研磨、噴霧乾燥後，即可獲得粒徑為1nm-5nm的碳黑粒子，據此，本發明製造過程與傳統相比較並不需要耗費大量能源就可以取的優良的碳黑粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing carbon black from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, carbon powder is separated from the anode roll (sheet). The carbon powder is then subjected to screening, drying, physical combustion, wet grinding, and spray drying to obtain carbon black particles with a particle size of 1 nm to 5 nm. This process, compared to traditional methods, does not require a large amount of energy to produce high-quality carbon black particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">S10:步驟十</p>
        <p type="p">3:碳黑粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="172" publication-number="202631503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨陶瓷之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING GRAPHITE CERAMICS FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/205</main-classification>
        <further-classification edition="201701120250501B">C01B32/21</further-classification>
        <further-classification edition="200601120250501B">C04B33/132</further-classification>
        <further-classification edition="200601120250501B">C04B33/24</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做石墨陶瓷之方法，是將廢棄鋰系列電池經過物理分解後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過調整人工石墨含量，使用一定的比例，如0.5%～5%比例加入到陶土、瓷土內混合使用，並捏製成不同的陶器，如杯、盤、碗、瓢、盆、鍋、甕、甑、調羹等生活食用瓷器，然後進行燒製成瓷器或陶器產品使用，燒製方法可以採用高溫氧化燒製或是高溫還原燒製，可以選擇電窯、瓦斯窯、柴燒窯、微波爐窯燒製方式來進行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing graphite ceramics from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the internal anode materials are obtained through washing, dehydration, drying, and sieving. These anode materials are generally carbon powder, primarily consisting of artificial graphite with a carbon content exceeding 99%. By adjusting the artificial graphite content and mixing it in a proportion of 0.5% to 5% with ceramic clay and porcelain clay, the mixture is then shaped into various ceramic items such as cups, plates, bowls, ladles, basins, pots, urns, steaming vessels, and spoons. These items are then fired to produce ceramic or pottery products. The firing method can be high-temperature oxidation firing or high-temperature reduction firing, using electric kilns, gas kilns, wood kilns, or microwave kilns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="173" publication-number="202631504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨混凝土之方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREPARING GRAPHITE CONCRETE FROM RECYCLED ANODE MATERIALS OF WASTE LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/205</main-classification>
        <further-classification edition="201701120250501B">C01B32/21</further-classification>
        <further-classification edition="200601120250501B">C04B18/04</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料轉做石墨混凝土之方法，是將廢棄鋰系列電池經過物理分解後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並將這些材料進行研磨得到微細分子，並將此細小分子充分混合入混凝土內，來製成石墨混凝土產品；所完成的石墨混凝土產品將具有減少水泥的使用量、提高拉伸強度和抗折強度、硬度及降低成本及整體使用量等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for preparing graphite concrete from recycled anode materials of waste lithium series batteries involves the following steps: After physically decomposing the waste lithium series batteries, the internal anode materials are obtained through washing, dehydration, drying, and sieving. These anode materials are generally carbon powder, primarily consisting of artificial graphite with a carbon content exceeding 99%. The materials are then ground into fine particles and thoroughly mixed into the concrete to produce graphite concrete products. The resulting graphite concrete products will have reduced cement usage, increased tensile strength and flexural strength, enhanced hardness, and lower costs and overall usage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">1:負極極捲(片)</p>
        <p type="p">2:碳粉</p>
        <p type="p">3:人工石墨</p>
        <p type="p">4:石墨混凝土產品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="174" publication-number="202631836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料及添加氧化銅轉做功能性石墨烯母粒之方法</chinese-title>
        <english-title>METHOD FOR RECOVERING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM BATTERIES AND ADDING COPPER OXIDE TO MAKE FUNCTIONAL GRAPHENE MASTERBATCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250211B">C08J3/22</main-classification>
        <further-classification edition="201701120250211B">C01B32/184</further-classification>
        <further-classification edition="201701120250211B">C01B32/192</further-classification>
        <further-classification edition="200601120250211B">B29B11/10</further-classification>
        <further-classification edition="200601120250211B">H01M6/52</further-classification>
        <further-classification edition="201701120250211B">C01B32/182</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料及添加氧化銅轉做功能性石墨烯母粒之方法，是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、脫水、乾燥等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，並運用熔融混合方式與高塑膠分子及添加1um(單微米)~0.01um(奈米)的氧化銅結合在一起，使用此法並不需要加官能基作為連接鍵。這有異於其他加入一些官能基、碳黑、樹酯等類的石墨烯母粒，本技術只單純運用單微米-奈米粒徑大小，就可以充分熔融混合、均勻分散於高塑膠分子當中，確保有一致性的勻散性來達到行成功能性石墨烯母粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for recycling negative electrode materials from waste lithium batteries and adding copper oxide to make functional graphene masterbatch, which is to disassemble the waste lithium batteries, remove them by manual or mechanical crushing, and then wash, dehydrate, The internal negative electrode materials are obtained by drying and sieving. These negative electrode materials are general carbon powders, most of which are artificial graphite, with a carbon content of more than 99%. They are then sintered, NMP ultrasonic cleaned, wet ground, dehydrated, Drying and other processes, this process does not require a lot of energy compared to the traditional single-layer and multi-layer graphene products, this process will make the graphene particle size to 1um (single micron) )~0.01 um (nanometer), and use melt mixing to combine with high plastic molecules and add 1um (single micron)~0.01um (nanometer) copper oxide. This method does not require the addition of functional groups. as a connection key. This is different from other graphene masterbatches that have functional groups, carbon black, resins, etc. This technology only uses single micron-nanometer particle size to fully melt mix and evenly disperse in high plastic molecules. , ensuring consistent dispersion to achieve the formation of functional graphene masterbatch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟1</p>
        <p type="p">S2:步驟2</p>
        <p type="p">S3:步驟3</p>
        <p type="p">S4:步驟4</p>
        <p type="p">S5:步驟5</p>
        <p type="p">S6:步驟6</p>
        <p type="p">S7:步驟7</p>
        <p type="p">S8:步驟8</p>
        <p type="p">S9:步驟9</p>
        <p type="p">S10:步驟10</p>
        <p type="p">S11:步驟11</p>
        <p type="p">S12:步驟12</p>
        <p type="p">S13:步驟13</p>
        <p type="p">S14:步驟14</p>
        <p type="p">S15:步驟15</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="175" publication-number="202631495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨烯線材製造方法及其應用方式</chinese-title>
        <english-title>METHOD FOR MANUFACTURING GRAPHENE WIRE BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES AND ITS APPLICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="200601120250501B">D01D5/06</further-classification>
        <further-classification edition="200601120250501B">D01F1/10</further-classification>
        <further-classification edition="200601120250501B">A01K75/00</further-classification>
        <further-classification edition="200601120250501B">A01K91/00</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、脫水、乾燥等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，並運用溶液混合方式與高塑膠分子結合在一起，使用此法並不需要加官能基作為連接鍵。這有異於其他加入一些官能基、碳黑、樹酯等類的石墨烯母粒，本技術只單純運用單微米~奈米粒徑大小，就可以充分混合、均勻分散於高塑膠分子當中，確保有一致性的勻散性來達到形成石墨烯線材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to disassemble the waste lithium battery, remove the artificial or mechanical crushing, and then wash, dehydrate, dry and sieve to obtain the internal negative electrode material. These negative electrode materials are general carbon powder, which is mostly Artificial graphite, with a carbon content of more than 99%, is then sintered, NMP ultrasonic cleaned, wet ground, dehydrated, dried, etc. This process does not require a lot of energy compared to traditional methods to obtain a single layer of Multi-layer graphene products, this process will make the graphene particles size between 1um (single micron) and 0.01um (nanometer), and use solution mixing to combine with high plastic molecules This method does not require the addition of a functional group as a connecting bond. This is different from other graphene masterbatches that have functional groups, carbon black, resins, etc. This technology only uses single-micron to nanometer particle sizes to fully mix and evenly disperse in high plastic molecules. Ensure consistent dispersion to achieve the formation of graphene wires.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):步驟1</p>
        <p type="p">(S2):步驟2</p>
        <p type="p">(S3):步驟3</p>
        <p type="p">(S4):步驟4</p>
        <p type="p">(S5):步驟5</p>
        <p type="p">(S6):步驟6</p>
        <p type="p">(S7):步驟7</p>
        <p type="p">(S8):步驟8</p>
        <p type="p">(S9):步驟9</p>
        <p type="p">(S10):步驟10</p>
        <p type="p">(S11):步驟11</p>
        <p type="p">(S12):步驟12</p>
        <p type="p">(S13):步驟13</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="176" publication-number="202631496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料製作石墨烯母粒之方法</chinese-title>
        <english-title>METHOD FOR PREPARING GRAPHENE MASTERBATCH BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="200601120250501B">C08K3/04</further-classification>
        <further-classification edition="200601120250501B">C08L101/00</further-classification>
        <further-classification edition="200601120250501B">C08J3/12</further-classification>
        <further-classification edition="200601120250501B">C08J3/22</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由廢棄鋰系列電池回收負極材料製作石墨烯母粒之方法，是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、脫水、乾燥等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層或多層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，並運用熔融混合方式與高塑膠分子結合在一起，使用此法並不需要加官能基作為連接鍵。這有異於其他加入一些官能基、碳黑、樹酯等類的石墨烯母粒，本技術只單純運用單微米-奈米粒徑大小，就可以充分熔融混合、均勻分散於高塑膠分子當中，確保有一致性的勻散性來達到行成功能性石墨烯母粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for recycling negative electrode materials from waste lithium batteries to produce graphene masterbatch is to disassemble the waste lithium batteries, remove artificial or mechanical crushing, and then wash, dehydrate, dry and sieve to obtain the internal Negative electrode materials are common carbon powders, which are mostly artificial graphite with a carbon content of more than 99%. They are then sintered, cleaned with NMP ultrasonic waves, wet ground, dehydrated, and dried. Compared with traditional methods, single-layer or multi-layer graphene products do not require a lot of energy to be obtained. This processing process will make the particle size of the graphene to 1um (single micron) ~ 0.01um (nano) and combined with high plastic molecules by melt mixing. This method does not require the addition of functional groups as connecting bonds. This is different from other graphene masterbatches that have functional groups, carbon black, resins, etc. This technology only uses single micron-nanometer particle size to fully melt mix and evenly disperse in high plastic molecules. , ensuring consistent dispersion to achieve the formation of functional graphene masterbatch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟1</p>
        <p type="p">S2:步驟2</p>
        <p type="p">S3:步驟3</p>
        <p type="p">S4:步驟4</p>
        <p type="p">S5:步驟5</p>
        <p type="p">S6:步驟6</p>
        <p type="p">S7:步驟7</p>
        <p type="p">S8:步驟8</p>
        <p type="p">S9:步驟9</p>
        <p type="p">S10:步驟10</p>
        <p type="p">S11:步驟11</p>
        <p type="p">S12:步驟12</p>
        <p type="p">S13:步驟13</p>
        <p type="p">S14:步驟14</p>
        <p type="p">S15:步驟15</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="177" publication-number="202631497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨烯油墨製造方法及其應用方式</chinese-title>
        <english-title>MANUFACTURING METHOD AND APPLICATION OF GRAPHENEINK BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="201401120250501B">C09D11/037</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、脫水、乾燥等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，並運用溶液混合方式與分散劑結合成石墨烯分散劑，接著與油墨調和，進而形成具有不親水性的石墨烯油墨。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to disassemble the waste lithium battery, remove the artificial or mechanical crushing, and then wash, dehydrate, dry and sieve to obtain the internal negative electrode material. These negative electrode materials are general carbon powder, which is mostly Artificial graphite, with a carbon content of more than 99%, is then sintered, NMP ultrasonic cleaned, wet ground, dehydrated, dried, etc. This process does not require a lot of energy compared to traditional methods to obtain a single layer of Multilayer graphene products, this process will make the graphene particles size between 1um (single micron) and 0.01um (nanometer), and use solution mixing method to combine with dispersant to form graphene The dispersant is then mixed with the ink to form a graphene ink having non-hydrophilic properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):步驟1</p>
        <p type="p">(S2):步驟2</p>
        <p type="p">(S3):步驟3</p>
        <p type="p">(S4):步驟4</p>
        <p type="p">(S5):步驟5</p>
        <p type="p">(S6):步驟6</p>
        <p type="p">(S7):步驟7</p>
        <p type="p">(S8):步驟8</p>
        <p type="p">(S9):步驟9</p>
        <p type="p">(S10):步驟10</p>
        <p type="p">(S11):步驟11</p>
        <p type="p">(S12):步驟12</p>
        <p type="p">(S13):步驟13</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="178" publication-number="202631498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨烯混漿紙張製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING GRAPHENE MIXED PULP PAPER BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="200601120250501B">D21H17/01</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、以及與油墨調和等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，後續將石墨稀加入分散介質、紙漿混合濃度與黏度，來完成石墨烯混漿紙張。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to disassemble the waste lithium battery, remove the artificial or mechanical crushing, and then wash, dehydrate, dry and sieve to obtain the internal negative electrode material. These negative electrode materials are general carbon powder, which is mostly Artificial graphite, with a carbon content of more than 99%, is then sintered, NMP ultrasonic cleaned, wet ground, and blended with ink. Compared with traditional processes, this process does not require a lot of energy to obtain a single layer. This process will reduce the particle size of graphene to between 1um (single micron) and 0.01um (nanometer). Then, graphene is added to the dispersion medium and the pulp mixture to a certain concentration. And viscosity, to complete the graphene mixed paper.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):步驟1</p>
        <p type="p">(S2):步驟2</p>
        <p type="p">(S3):步驟3</p>
        <p type="p">(S4):步驟4</p>
        <p type="p">(S5):步驟5</p>
        <p type="p">(S6):步驟6</p>
        <p type="p">(S7):步驟7</p>
        <p type="p">(S8):步驟8</p>
        <p type="p">(S9):步驟9</p>
        <p type="p">(S10):步驟10</p>
        <p type="p">(S11):步驟11</p>
        <p type="p">(S12):步驟12</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="179" publication-number="202631499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做石墨烯混漿製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING GRAPHENE SLURRY BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是從廢棄鋰電池中回收碳粉，大部分廢棄鋰電池的碳粉為人工石墨，其含碳量大於99%以上。本技術係將處理廢棄鋰電池拆解後，去掉電池外殼等，所得到的人工石墨，經過物理製程得到單層石墨烯產品，並將這石墨烯製成漿料，石墨烯漿料可以用噴塗、印刷在塗層、複合材料等使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention recycles carbon powder from waste lithium batteries. Most of the carbon powder from waste lithium batteries is artificial graphite, and its carbon content is more than 99%. This technology is to disassemble the waste lithium battery, remove the battery shell, etc., and obtain the artificial graphite. After physical processing, a single-layer graphene product is obtained, and the graphene is made into slurry. The graphene slurry can be sprayed , printing and use in coatings, composite materials, etc.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):步驟1</p>
        <p type="p">(S2):步驟2</p>
        <p type="p">(S3):步驟3</p>
        <p type="p">(S4):步驟4</p>
        <p type="p">(S5):步驟5</p>
        <p type="p">(S6):步驟6</p>
        <p type="p">(S7):步驟7</p>
        <p type="p">(S8):步驟8</p>
        <p type="p">(S9):步驟9</p>
        <p type="p">(S10):步驟10</p>
        <p type="p">(S11):步驟11</p>
        <p type="p">(S12):步驟12</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="180" publication-number="202631500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由廢棄鋰系列電池回收負極材料轉做液態石墨烯油墨製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING LIQUID GRAPHENE INK BY RECYCLING NEGATIVE ELECTRODE MATERIALS FROM DISCARDED LITHIUM SERIES BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/184</main-classification>
        <further-classification edition="201701120250501B">C01B32/194</further-classification>
        <further-classification edition="201401120250501B">C09D11/037</further-classification>
        <further-classification edition="200601120250501B">H01M10/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是將廢棄鋰電池處理處理拆解後，經脫人工或機械破碎後，透過水洗、脫水、乾燥、過篩方式取得內部負極材料，這些負極材料就是一般的碳粉，其本質大都為人工石墨，含碳比率高達99%以上，並再透過燒結、NMP超音波清洗、濕式研磨、以及與油墨調和等過程，這一個過程與傳統比較並不需要耗費大量能源就可以取的單層及多層石墨烯產品，這一個處理過程，會將本石墨烯的粒徑大小製成到1um(單微米)~0.01um(奈米)之間，形成具有親水性的石墨烯油墨，而製作的產品用於印刷如塑膠袋等網版印刷產品使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to disassemble the waste lithium battery, remove the artificial or mechanical crushing, and then wash, dehydrate, dry and sieve to obtain the internal negative electrode material. These negative electrode materials are general carbon powder, which is mostly Artificial graphite, with a carbon content of more than 99%, is then sintered, NMP ultrasonic cleaned, wet ground, and blended with ink. Compared with traditional processes, this process does not require a lot of energy to obtain a single layer. This process will reduce the particle size of graphene to between 1um (single micron) and 0.01um (nanometer), forming a hydrophilic graphene ink. The products produced are used for printing screen printing products such as plastic bags.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):步驟1</p>
        <p type="p">(S2):步驟2</p>
        <p type="p">(S3):步驟3</p>
        <p type="p">(S4):步驟4</p>
        <p type="p">(S5):步驟5</p>
        <p type="p">(S6):步驟6</p>
        <p type="p">(S7):步驟7</p>
        <p type="p">(S8):步驟8</p>
        <p type="p">(S9):步驟9</p>
        <p type="p">(S10):步驟10</p>
        <p type="p">(S11):步驟11</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="181" publication-number="202631425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動調整駕駛輔助措施的載具安全輔助系統及方法</chinese-title>
        <english-title>VEHICLE SAFETY ASSISTANCE SYSTEM AND METHOD FOR AUTOMATICALLY ADJUSTING DRIVING ASSISTANCE BEHAVIOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250401B">B60W30/08</main-classification>
        <further-classification edition="200601120250401B">B60W30/00</further-classification>
        <further-classification edition="202001120250401B">B60W50/08</further-classification>
        <further-classification edition="200601120250401B">B60W50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAOCHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動調整駕駛輔助措施的載具安全輔助系統及方法，此方法利用環境辨認裝置根據載具環境以產生辨認結果，利用處理裝置取得辨認結果以據此從多個安全性參數組中擇一作為載具設定參數組。最終，處理裝置根據載具設定參數組來設定駕駛輔助程序的運作參數以使駕駛輔助程序依此產生並提供輔助措施。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle safety assistance system and method for automatically adjusting driving assistance behavior is provided. In this method, a circumstance recognizer is applied to generate a recognition result in accordance with surroundings of the vehicle, a processor is applied to receive the recognition result and select one of several safety parameter sets as a vehicle setting parameter set in accordance with the received recognition result. Finally, the driving assistance behavior is generated and provided by a driving assistance procedure which is set in accordance with the vehicle setting parameter set by the processor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200~S240:本發明一實施例的施行步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="182" publication-number="202632832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>循環電力儲存電路</chinese-title>
        <english-title>CYCLE POWER STORAGE CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/46</main-classification>
        <further-classification edition="202601120260302B">H02J3/30</further-classification>
        <further-classification edition="202601120260302B">H02J3/32</further-classification>
        <further-classification edition="200601120260302B">H02J7/10</further-classification>
        <further-classification edition="200601120260302B">H02J7/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃保生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃保生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種循環電力儲存電路，其包含一雙電源切換電路、一逆變器電路、一回授電路、一整流電路、一充電電路與一智能控制電路。本發明可通過一啟動馬達將一第一交流電力轉換為耦接的一儲能裝置的位能或動能，並通過與該儲能裝置耦接的一發電馬達而獲得由位能或動能轉換的一第二交流電力。本發明利用上述結構將能量循環儲存於儲能裝置與其外部環境中，取代了昂貴且需要常常維護的電池或化學儲能系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cycle power storage circuit is disclosed. It includes a dual power switching circuit, an inverter circuit, a feedback circuit, a rectifier circuit, a charging circuit and an intelligent control circuit. The present invention can convert a first AC power into potential energy or kinetic energy of a coupled energy storage device through a starter motor, and obtain the energy converted from the potential energy or kinetic energy through a generator motor coupled to the energy storage device as a second AC power. The present invention utilizes the above structure to store energy in an energy storage device and its external environment in a cycle, replacing expensive batteries or chemical energy storage systems that require frequent maintenance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:循環電力儲存電路</p>
        <p type="p">2:電儲存系統</p>
        <p type="p">2A:啟動馬達</p>
        <p type="p">2B:儲能裝置</p>
        <p type="p">2C:發電馬達</p>
        <p type="p">3:二次電池模組</p>
        <p type="p">10:雙電源切換電路</p>
        <p type="p">11:第一二極體</p>
        <p type="p">12:第二二極體</p>
        <p type="p">20:逆變器電路</p>
        <p type="p">30:回授電路</p>
        <p type="p">40:整流電路</p>
        <p type="p">50:充電電路</p>
        <p type="p">60:智能控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="183" publication-number="202631076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學感測模組及手持式光學檢測裝置</chinese-title>
        <english-title>OPTICAL SENSING MODULE AND HANDHELD OPTICAL INSPECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">A61B1/227</main-classification>
        <further-classification edition="200601120250502B">A61B1/05</further-classification>
        <further-classification edition="200601120250502B">A61B1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣州立景創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃澄富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學感測模組，包括分光鏡、光源組件、第一影像感測器、第一濾光片、第二影像感測器及第二濾光片。分光鏡包括第一面與第二面。光源組件朝向第一面，且包括可見光光源及短波紅外線光源。第一、第二影像感測器分別朝向第一、第二面。第一濾光片位於第一面與第一影像感測器之間。第二濾光片位於第二面與第二影像感測器之間。光源組件的光線射向分光鏡，部分的光線被分光鏡反射而射向物件。射向物件的光線被物件反射回分光鏡，被反射回分光鏡的光線被分光鏡反射及透射，通過第一濾光片、第二濾光片，進入第一影像感測器、第二影像感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical sensing module includes an optical beamsplitter, a light source assembly, a first image sensor, a first optical filter, a second image sensor and a second optical filter. The spectroscope includes a first surface and a second surface. The light source assembly faces the first surface and includes a visible light source and a short-wave infrared light source. The first and second image sensors face the first and second surfaces, respectively. The first optical filter is located between the first surface and the first image sensor. The second optical filter is located between the second surface and the second image sensor. Light from the light source assembly is emitted to the beamsplitter, and a part of the light is reflected by the beamsplitter and emitted to the object. The light emitted to the object is reflected back to the beamsplitter by the object, and the light reflected back to the beamsplitter is split to two parts by the beamsplitter, passes through the first optical filter and the second optical filter, and enters the first image sensor and the second image sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:手持式光學檢測裝置</p>
        <p type="p">20:手把</p>
        <p type="p">24:第二按鈕</p>
        <p type="p">30:主機</p>
        <p type="p">40:鏡頭集成</p>
        <p type="p">50:漏斗狀外罩</p>
        <p type="p">52:開口</p>
        <p type="p">100:光學感測模組</p>
        <p type="p">110:分光鏡</p>
        <p type="p">112:第一面</p>
        <p type="p">114:第二面</p>
        <p type="p">120:光源組件</p>
        <p type="p">130:第一影像感測器</p>
        <p type="p">132:第一濾光片</p>
        <p type="p">134:第一聚焦透鏡</p>
        <p type="p">140:第二影像感測器</p>
        <p type="p">142:第二濾光片</p>
        <p type="p">144:第二聚焦透鏡</p>
        <p type="p">160:透鏡組件</p>
        <p type="p">170:第一支撐件</p>
        <p type="p">172:第二支撐件</p>
        <p type="p">174:第三支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="184" publication-number="202632502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>更新電力傳輸晶片的韌體的電子裝置和方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF UPDATING FIRMWARE OF POWER DELIVERY CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G06F11/30</main-classification>
        <further-classification edition="200601120250501B">G06F11/22</further-classification>
        <further-classification edition="201801120250501B">G06F8/65</further-classification>
        <further-classification edition="201801120250501B">G06F9/445</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種更新電力傳輸晶片的韌體的電子裝置和方法。電子裝置包括依序耦接的一基本輸入輸出系統唯讀記憶體、一平台路徑控制器、一嵌入式控制器及一電力傳輸晶片。方法包含：由平台路徑控制器從基本輸入輸出系統唯讀記憶體讀取一韌體更新檔案；由電力傳輸晶片使用電力傳輸晶片中的第一韌體及第二韌體的其中之一輸出電力；以及由嵌入式控制器根據韌體更新檔案更新第一韌體及第二韌體的其中另一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a method of updating firmware of a power delivery chip are provided. The electronic device includes a basic input/output system read-only memory, a platform controller hub, an embedded controller, and a power delivery chip connected in sequence. The method includes: reading a firmware update file from the basic input/output system read-only memory by the platform controller hub; outputting, by the power delivery chip, power by using one of a first firmware and a second firmware in the power delivery chip; and updating the other one of the first firmware and the second firmware according to the firmware update file by the embedded controller.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201,S202,S203:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="185" publication-number="202632191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電器的控制系統及控制方法</chinese-title>
        <english-title>CONTROL SYSTEM AND CONTROL METHOD OF ELECTRICAL APPLIANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">F24F11/30</main-classification>
        <further-classification edition="201801120250303B">F24F11/70</further-classification>
        <further-classification edition="201801120250303B">F24F11/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣櫻花股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SAKURA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田仁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, JEN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電器的控制系統及控制方法，控制系統包括控制單元、排風單元及LED單元。控制單元耦接排風單元及LED單元。控制單元判斷電器的操作電流大於第一電流預設值時，排風單元以高速轉動及LED單元發出第一提示訊號。操作電流小於第二電流預設值，及電器處於保溫狀態或關機後第一預設時間時，LED單元發出第二提示訊號。操作電流小於第二電流預設值，及電器處於保溫狀態或關機後第二預設時間時，排風單元以低速轉動。操作電流小於第二電流預設值，及電器處於保溫狀態或關機後第三預設時間時，排風單元停止轉動及LED單元發出第三提示訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control system and control method of electrical appliance is provided, the control system includes a control unit, an exhaust unit and a LED unit. The control unit is coupled to the exhaust unit and the LED unit. When the control unit determines an operating current of an electrical appliance is greater than a first preset current value, the exhaust unit rotates at high speed and the LED unit sends out a first prompt signal. When the operating current is less than a second preset current value and the electrical appliance is in a heat preservation state or is shut down for a first preset time, the LED unit emits a second prompt signal. When the operating current is less than the second preset current value and the electrical appliance is in the heat preservation state or is shut down for a second preset time, the exhaust unit rotates at a low speed. When the operating current is less than the second preset current value and the electrical appliance is in the heat preservation state or is turned off for a third preset time, the exhaust unit stops rotating and the LED unit emits a third prompt signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制系統</p>
        <p type="p">110:控制單元</p>
        <p type="p">120:排風單元</p>
        <p type="p">130:LED單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="186" publication-number="202633338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共軌式搬運設備</chinese-title>
        <english-title>COMMON RAIL HANDLING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
        <further-classification edition="200601120260302B">B25J11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三和技研股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANWA ENGINEERING CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林書玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳令坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LING-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭擎宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種共軌式搬運設備，包括線性驅動軌道、平台、升降驅動組件、活動臂以及旋轉驅動組件。線性驅動軌道包括供電控制模組、軌道、第一滑件、第二滑件、第三滑件與第四滑件。軌道包括線性排列的多個電磁線圈，分別電性連接供電控制模組。第一滑件、第二滑件、第三滑件與第四滑件分別具固定磁性且依序可動地耦接於軌道，其中供電控制模組供電至電磁線圈而產生對應磁場以控制第一滑件、第二滑件、第三滑件與第四滑件分別在軌道滑動。升降驅動組件連接第二滑件、第四滑件與平台。旋轉驅動組件設置於第一滑件、第三滑件與平台以連接活動臂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A common rail handling system including a linear guide, a platform, a lifting assembly, movable arms, and rotation assembly is provided. The linear guide includes a power and control module, a rail having a plurality of electric-magnetic coils arranged linearly, a first slider, a second slider, a third slider, and a fourth slider. The first, the second, the third, and the fourth sliders with fixed magnetism respectively movably coupled to the rail sequentially. The electric-magnetic coils electrically connected to the power and control module are powered to generate corresponding magnetic fields so as to drive the first, the second, the third, and the fourth sliders to move on the rail respectively. The lifting assembly is connected to the second slider, the fourth slider, and the platform. The rotation assembly is disposed to the first slider, the third slider, and the platform to connect the movable arms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:共軌式搬運設備</p>
        <p type="p">110:軌道</p>
        <p type="p">120:活動臂</p>
        <p type="p">130:平台</p>
        <p type="p">140:旋轉驅動組件</p>
        <p type="p">150:升降驅動組件</p>
        <p type="p">220、230:側板</p>
        <p type="p">P1、P2:處理站</p>
        <p type="p">SL1:第一滑件</p>
        <p type="p">SL2:第二滑件</p>
        <p type="p">SL3:第三滑件</p>
        <p type="p">SL4:第四滑件</p>
        <p type="p">X-Y-Z:直角座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="187" publication-number="202633514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/42</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="200601120260302B">B23K26/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括電路基板以及第一填充層。電路基板包括基底以及配置在基底上的第一接墊以及第二接墊。第一填充層包括位於第一接墊與第二接墊之間的第一部分。第一接墊以及第二接墊適於分別連接一第一電子元件的兩個電極。第一填充層對於200 nm至355 nm範圍內的光具備大於80%的吸收率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a circuit substrate and a first filling layer is provided. The circuit substrate includes a base and a first pad and a second pad disposed on the base. The first filling layer includes a first portion located between the first pad and the second pad. The first pad and the second pad are suitable for connecting two electrodes of a first electronic component, respectively. The first filling layer has an absorption rate greater than 80% for light in the range of 200 nm to 355 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">10:電路基板</p>
        <p type="p">100:基底</p>
        <p type="p">101:接墊</p>
        <p type="p">102:接墊</p>
        <p type="p">103:接墊</p>
        <p type="p">104:接墊</p>
        <p type="p">201:電子元件</p>
        <p type="p">201A:電極</p>
        <p type="p">201B:電極</p>
        <p type="p">202:電子元件</p>
        <p type="p">202A:電極</p>
        <p type="p">202B:電極</p>
        <p type="p">SA1:填充層</p>
        <p type="p">SA11:第一部分</p>
        <p type="p">SA12:第二部分</p>
        <p type="p">SA13:第三部分</p>
        <p type="p">TP1:頂面</p>
        <p type="p">TP2:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="188" publication-number="202633068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體積體電路及其製造方法</chinese-title>
        <english-title>MEMORY INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W46/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亞螢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YA-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種記憶體積體電路及其製造方法。記憶體積體電路包括：位於半導體晶圓的多個晶片區中的多個記憶體陣列；以及位於半導體晶圓的切割道區中的多個測試結構。多個記憶體陣列與多個測試結構分別包括沿相同方向延伸的多條字元線與多個絕緣結構。在各記憶體陣列中多個絕緣結構經配置以定義出多個電容接觸結構。各記憶體陣列中的多個絕緣結構以第一節距排列，且各測試結構中的多個絕緣結構以大於第一節距的第二節距排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory integrated circuit and a manufacturing method thereof are provided. The memory integrated circuit includes memory arrays in chip regions of a semiconductor wafer; and test structures in a scribe line region of the semiconductor wafer. The memory arrays and the test structures respectively include word lines and insulating structures extending along the same direction. The insulating structures in each memory array are configured to define locations of capacitor contact structures. The insulating structures in each memory array are arranged with a first pitch, and the insulating structures in each test structure are arranged with a second pitch greater than the first pitch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106、106a:絕緣結構</p>
        <p type="p">300:半導體晶圓</p>
        <p type="p">302:晶片區</p>
        <p type="p">304:切割道區</p>
        <p type="p">306:測試結構</p>
        <p type="p">D1、D2、D3:方向</p>
        <p type="p">F1、F2:遠邊</p>
        <p type="p">N1、N2:近邊</p>
        <p type="p">P1、P2:節距</p>
        <p type="p">WL、WL1、WL2:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="189" publication-number="202633245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>OLED顯示器結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250207B">H10K59/10</main-classification>
        <further-classification edition="202301120250207B">H10K59/80</further-classification>
        <further-classification edition="202301120250207B">H10K99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華凌光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曜凌光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之OLED顯示器結構包含有：一基板，於基板上依序堆疊設置一電極層(ITO)、一電洞注入層(HIL)、一電洞傳輸層(HTL)、一發光層(EML)、一電子傳輸層(ETL)、一電子注入層(EIL)以及一陰極層(cathode)。一吸溼層，設置在陰極層上，吸溼層設置的面積大於等於陰極層上方表面面積的百分之50。一上蓋，蓋合在基板上並且該上蓋與電極層交接觸設有密封膠。一吸溼劑(Getter)，設置在上蓋的內表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:發光單元</p>
        <p type="p">30:吸溼層</p>
        <p type="p">40:上蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="190" publication-number="202632114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橋梁梁底狹小空間檢測設備</chinese-title>
        <english-title>DETECTION APPARATUS FOR DETECTING NARROW SPACE UNDER THE BOTTOM OF BRIDGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250609B">E01D19/10</main-classification>
        <further-classification edition="200601120250609B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>交通部運輸研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF TRANSPORTATION, MOTC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡立宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴瑞應</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, JUI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭登鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TENG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡啟文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉佳榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種橋梁梁底狹小空間檢測設備，包含滑軌桿件、四連桿組、第一伸縮桿組、第二伸縮桿組、檢測裝置與承載上述各構件的承載裝置；滑軌桿件具有滑軌；四連桿組由第一連桿、第二連桿、第三連桿與第四連桿構成，第四連桿可分離且可樞轉地連接於滑軌桿件且可於滑軌上滑移；第一伸縮桿組由複數套管相互套接組成具有相對之第一端與第二端，第一端可分離地連接於第三連桿；第二伸縮桿組可分離且可樞轉地設置於第二端，包括可相對移動的第一桿體與二桿體；檢測裝置包括三軸穩定器與影像擷取裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection apparatus for detecting narrow space under the bottom of bridge, which comprise guideway rod with guideway, four-bar linkage, first dilatation rod assembly, second dilatation rod assembly, detecting device and carrier for carrying the above each assembly. The four-bar linkage has a first link lever, a second link lever, a third link lever and a fourth link lever. The fourth link lever detachably and pivotally connecting the guideway rod and could slide on the guideway. The first dilatation rod assembly is formed by a plurality of sleeves and has opposite first end and second end. The first end detachably connecting with the third link lever. The second dilatation rod assembly detachably and pivotally connecting the second end and has a first rod which moves relatively to a second rod. The detecting device has a three-axis stabilizer and an image capture device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:橋梁梁底狹小空間檢測設備</p>
        <p type="p">10:滑軌桿件</p>
        <p type="p">11:滑軌</p>
        <p type="p">20:四連桿組</p>
        <p type="p">21:第一連桿</p>
        <p type="p">22:第二連桿</p>
        <p type="p">23:第三連桿</p>
        <p type="p">24:第四連桿</p>
        <p type="p">241:滑座</p>
        <p type="p">30:第一伸縮桿組</p>
        <p type="p">31:第一端</p>
        <p type="p">32:第二端</p>
        <p type="p">33:第一驅動組</p>
        <p type="p">40:第二伸縮桿組</p>
        <p type="p">41:第一桿體</p>
        <p type="p">42:第二桿體</p>
        <p type="p">60:承載裝置</p>
        <p type="p">61:承載台</p>
        <p type="p">62:電池組</p>
        <p type="p">63:把手</p>
        <p type="p">64,65:滑輪</p>
        <p type="p">70:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="191" publication-number="202633183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>差動對結構</chinese-title>
        <english-title>DIFFERENTIAL PAIR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250501B">H10D89/10</main-classification>
        <further-classification edition="200601120250501B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祥碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMEDIA TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何杰睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIEH-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">差動對結構包含第一井區、第一電極、第二電極、第一電晶體對以及第二電晶體對。第一電極及第二電極設置在第一井區中。第一電晶體具有以對稱第一電極的方式沿第一方向設置在第一井區中的多個子電晶體。第二電晶體具有以對稱第二電極的方式，沿第一方向設置在第一井區中的多個子電晶體。第一電極以及第二電極分別接收第一偏壓以及第二偏壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A differential pair structure includes a first well, a first electrode, a second electrode, a first transistor pair and a second transistor pair. The first electrode and the second electrode are arranged in the first well. The first transistor has a plurality of sub-transistors arranged in the first well symmetrically with respect to the first electrode along a first direction. The second transistor has a plurality of sub-transistors arranged in the well symmetrically with respect to the second electrode along the first direction. The first electrode and the second electrode receive the first bias and the second bias, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電晶體結構</p>
        <p type="p">ED1~ED2:電極</p>
        <p type="p">M1~M2:電晶體對</p>
        <p type="p">M1_1~M1_2:電晶體</p>
        <p type="p">M2_1~M2_2:電晶體</p>
        <p type="p">WL_1:井區</p>
        <p type="p">x、y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="192" publication-number="202633181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維半導體裝置</chinese-title>
        <english-title>THREE-DIMENSION SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D88/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鯨鏈科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHALECHIP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>台北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亞東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YA-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種三維半導體裝置，其包括第一電路層及第二電路層。第一電路層包括第一電路區塊。第二電路層設置於第一電路層上，並包括第二電路區塊，第一電路區塊及第二電路區塊透過連接柱建立電性連接關係。本申請透過增加布線的走線維度，讓原本僅以二維方向建立電性連接的第一電路區塊及第二電路區塊可透過第三維度建立電性連接關係，減少訊號傳輸路徑長度，達到減少布線的走線長度及訊號延遲的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a three-dimension semiconductor device comprising a first circuit layer and a second circuit layer. The first circuit layer comprises a first circuit block. The second circuit layer is disposed on the first circuit layer and comprises a second circuit block. The first circuit block and the second circuit block establish an electrical connection relationship through connecting pillars. By increasing the wiring dimension of the wiring, the present disclosure allows the first circuit block and the second circuit block, which were originally only electrically connected in two dimensions, to establish electrical connections through the third dimension. Therefore, the length of a signal transmission path is reduced. The purpose of reducing wiring length and signal delay is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:三維半導體裝置</p>
        <p type="p">210:第一電路層</p>
        <p type="p">211:第一電路區塊</p>
        <p type="p">212:第一連接區</p>
        <p type="p">213、213a:第一開關區塊</p>
        <p type="p">220:第二電路層</p>
        <p type="p">221:第二電路區塊</p>
        <p type="p">222:第二連接區</p>
        <p type="p">223、223a:第二開關區塊</p>
        <p type="p">230:連接柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="193" publication-number="202632835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有串並聯架構切換功能的複合儲能管理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">H02J7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施武陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAN, WU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江益賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YI-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合儲能管理設備包含第一開關、第二開關、第三開關、第四開關、電感、電容、輔助儲能裝置與主要儲能裝置。電容電連接負載與第一開關的第二端之間。電感電連接第二共同端與第三共同端之間。主要儲能裝置電連接該負載與第一共同端間。輔助儲能裝置電連接第二共同端與第一開關的第二端間。當第一開關不導通且第二開關導通且第三開關是去能狀態且第四關是去能狀態時，主要儲能裝置與輔助儲能裝置呈現串聯，當第一開關導通且第二開關不導通且第三開關是致能狀態且第四開關是致能狀態時，主要儲能裝置與輔助儲能裝置呈現並聯，達到兼顧能量密度與功率密度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負載</p>
        <p type="p">2:主要儲能裝置</p>
        <p type="p">3:輔助儲能裝置</p>
        <p type="p">4:第一三態邏輯閘</p>
        <p type="p">5:第二三態邏輯閘</p>
        <p type="p">6:控制裝置</p>
        <p type="p">CH1:第一共同端</p>
        <p type="p">CH2:第二共同端</p>
        <p type="p">CH3:第三共同端</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">S3:第三開關</p>
        <p type="p">S4:第四開關</p>
        <p type="p">C:電容</p>
        <p type="p">L:電感</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="194" publication-number="202632570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>關係戶管理系統</chinese-title>
        <english-title>RELATIONSHIP ACCOUNT MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q30/01</main-classification>
        <further-classification edition="202301120250401B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元大商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUANTA COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張珮卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏立均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚淑娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, SHU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種關係戶管理系統包含一處理裝置，及電連接該處理裝置的一通訊裝置、一儲存裝置、與一顯示裝置。該儲存裝置儲存多筆對應於多個客戶的帳戶資料及多筆分別對應於該等帳戶資料的關係資料。該處理裝置透過該通訊裝置自一財管系統接收多筆分別對應於多個帳戶資料的手續費資料並判斷任一該手續費資料的一手續費是處於一優惠狀態，且判斷該關係資料的一關係人名單中所對應的任一該手續費不處於該優惠狀態時，藉由該顯示裝置顯示該帳戶資料，及對應該的該關係資料的該關係人名單之其中每一該手續費不處於該優惠狀態者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A relationship account management system includes a processing device, a communication device, a storage device, and a display device. The storage device stores a plurality of account data corresponding to a plurality of clients and a plurality of relationship data corresponding to a plurality of account data. The processing device is connected to the communication device, the storage device, and the display device and receives a plurality of payment data corresponding to a plurality of account data from a financial system through the communication device and determines that a payment fee of any of the payment data is in a offer state. When the processing device determines any one of the payment fee corresponding to a relational person list of the relationship data is not in the offer state, displaying account data and each payment fee of relational person list corresponding to relational data not to be in the offer state by the display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:關係戶管理系統</p>
        <p type="p">1:通訊裝置</p>
        <p type="p">2:儲存裝置</p>
        <p type="p">3:顯示裝置</p>
        <p type="p">4:處理裝置</p>
        <p type="p">5:輸入裝置</p>
        <p type="p">6:財管系統</p>
        <p type="p">7:客戶金流系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="195" publication-number="202632587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>個人化保險商品推薦方法及裝置、電腦可讀取的記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q40/08</main-classification>
        <further-classification edition="202301120250303B">G06Q30/0251</further-classification>
        <further-classification edition="202301120250303B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊淑儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喬敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭直夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嘉桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高詩涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀志翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種個人化保險商品推薦方法，包括由個人化保險商品推薦裝置中的商品偏好模型根據一客戶特徵資料及多種保障項目的多個現售保險商品的商品特徵資料，計算該等現售保險商品的推薦分數，並由個人化保險商品推薦裝置中的條件組合模型根據一客戶基本資料、一客戶保障需求、該等現售保險商品及其對應的推薦分數以及一商品組合條件，產生多種商品組合，並計算各種商品組合的一組合分數，各該商品組合包含該至少一保障項目包含的至少一現售保險商品，且條件組合模型從該等商品組合中挑選具有較高的該組合分數的至少一商品組合做為至少一推薦商品組合並輸出該至少一推薦商品組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="196" publication-number="202631176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於增強皮膚屏障、美白及抗皺的蘭花外泌體組合物、其用途、冷凍乾燥晶粒結構及護膚品套組結構</chinese-title>
        <english-title>ORCHID EXOSOME COMPOSITION FOR ENHANCING SKIN BARRIER, PROMOTING SKIN WHITENING AND ANTI-WRINKLE, USE THEREOF, FREEZE-DRIED CRYSTAL STRUCTURE, AND KIT STRUCTURE OF CARE PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">A61K36/898</main-classification>
        <further-classification edition="201701120250801B">A61K8/9789</further-classification>
        <further-classification edition="200601120250801B">A61P17/00</further-classification>
        <further-classification edition="200601120250801B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶碩光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGAVISION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美彤生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FACIAL BEAU INTERNATIONAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘一紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, I-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊凱安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, KAI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚心然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, HSIN-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沛吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奎璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUEI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於增強皮膚屏障、美白及抗皺的組合物，包含一分離自蘭花的外泌體作為活性成分。另提供一種外泌體用於製備增強皮膚屏障及抗皺的組合物的用途，其中該外泌體係分離自蘭花。另提供一種冷凍乾燥晶粒結構，包含由賦形劑所組成的本體以及如上所述之外泌體。另提供一種護膚品套組結構包含前述冷凍乾燥晶粒結構，達成增強皮膚屏障、美白及抗皺的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a composition for enhancing skin barrier and anti-wrinkle, including an exosome isolated from orchid as an active ingredient. Also provided is a use of exosomes for preparing a skin barrier-enhancing, promoting skin whitening and anti-wrinkle composition, in which the exosome is isolated from orchid. Also provided is a freeze-dried crystal structure, including a main body composed of an excipient and the exosome as above mentioned. Also provided is a kit structure of care product including the freeze-dried crystal structure to achieve enhancing skin barrier and anti-wrinkle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="197" publication-number="202631005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種具有滑槽底蓋的貓砂鏟</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">A01K1/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江俊逵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江俊逵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃孝惇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一種具有滑槽底蓋的貓砂鏟，其主要係由柄部，柄部把手， 裝砂槽，多數個篩孔，砂礫檔板，前鏟斜坡，控制鈕，以及滑槽底蓋所組成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:柄部把手</p>
        <p type="p">20:裝砂槽</p>
        <p type="p">30:多數個篩孔</p>
        <p type="p">31:砂礫檔板</p>
        <p type="p">40:控制鈕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="198" publication-number="202632603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像測量方法及影像處理裝置</chinese-title>
        <english-title>IMAGE MEASUREMENT METHOD AND IMAGE PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250801B">G06T7/60</main-classification>
        <further-classification edition="201701120250801B">G06T7/168</further-classification>
        <further-classification edition="200601120250801B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閎康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATERIALS ANALYSIS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祐緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張佑瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG,YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻慧玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, HUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種影像測量方法及影像處理裝置。所述方法包括：取得輸入影像及輸入影像中的多個參考線段；將輸入影像編碼為序列向量，並將序列向量與位置編碼向量整合為第一輸入向量；利用變換器編碼器基於第一輸入向量產生第二輸入向量；利用變換器解碼器基於第二輸入向量及查詢資訊產生對應於各待測線段的預測偏移結果；以及基於各待測線段的預測偏移結果產生各待測線段的測量結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the disclosure provide an image measurement method and an image processing device. The method comprises: obtaining an input image and a plurality of reference line segments in the input image; encoding the input image into a sequence vector, and integrating the sequence vector and a positional encoding vector into a first input vector; using a transformer encoder to generate a second input vector based on the first input; using a transformer decoder to generate a predicted offset result corresponding to each of a plurality of to-be-measured line segments based on the second input vector and query information; and generating a measurement result of each to-be-measured line segment based on the predicted offset result of each to-be-measured line segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="199" publication-number="202632591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算產品自搖籃（Ｃｒａｄｌｅ）至大門（Ｇａｔｅ）之製造碳排放值的管理系統</chinese-title>
        <english-title>MANAGEMENT SYSTEM FOR CALCULATING THE MANUFACTURING CARBON EMISSIONS OF PRODUCT FROM CRADLE TO GATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250205B">G06Q50/04</main-classification>
        <further-classification edition="202301120250205B">G06Q10/06</further-classification>
        <further-classification edition="202301120250205B">G06Q30/018</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許恩睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, EN-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許恩睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, EN-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種計算產品自搖籃(Cradle)至大門(Gate)之製造碳排放值的管理系統，包含：第一產生單元、第二產生單元、供應商資料庫、廠內加工機械設備資料庫及碳排放計算單元所組成，藉由該第一產生單元所產生的原物料清單(BOM)以及該第二產生單元所產生的生產流程順序清單(BOP)的設計，搭配該供應商資料庫、廠內加工機械設備資料庫所選配出的原物料投料組合、加工機械設備生產組合與內建的碳排放係數，使得該碳排放計算單元得以產生該產品自搖籃至大門之複數個製造組合，並計算出各該製造組合的碳排放總值，藉以精確計算該產品製造過程中的碳排放值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A management system for calculating the manufacturing carbon emissions of product from cradle to gate, which includes a first generation unit, a second generation unit, a supplier database, a factory processing machinery and equipment database and a carbon emission calculation unit, by cooperating the design of the bill of materials (BOM) generated by the first generation unit and the bill of process (BOP) produced by the second generation unit with the supplier database, the raw material feeding combination selected in the factory processing machinery and equipment database, and the production combination of processing machinery and equipment and the in-built carbon emission coefficient, the carbon emission calculation unit will produce a plurality of manufacturing combinations of the product from cradle to gate and calculate the total carbon emissions of each manufacturing combination, so as to accurately calculate the carbon emissions in the manufacturing process of the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一產生單元</p>
        <p type="p">20:第二產生單元</p>
        <p type="p">30:供應商資料庫</p>
        <p type="p">40:廠內加工機械設備資料庫</p>
        <p type="p">50:碳排放計算單元</p>
        <p type="p">60:委外託工資料庫</p>
        <p type="p">70:選定單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="200" publication-number="202632482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控裝置</chinese-title>
        <english-title>TOUCH DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">G06F3/041</main-classification>
        <further-classification edition="200601120250203B">G06F3/044</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義隆電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳有錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅傳岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHUAN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭庭軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控裝置，包括多行電極以及多條走線。每一行電極包括相鄰的一第一電極與一第二電極。該第一電極具有n個相互連接的第一圖案沿著列的方向排列，該第二電極具有n 個相互連接的第二圖案沿著該列的方向排列，該第一圖案與第二圖案具有相同的形狀與結構，每一該第一圖案的上部包括一第一子圖案。每一該第二圖案的下部包括一第二子圖案。該第一子圖案包括多個空隙以容納該第二子圖案，使得每一該第一圖案的上部與該第二圖案的下部的區域互相重疊。該多條走線分別連接該多行電極中的每一該第一電極與每一該第二電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch device that includes a plurality of column electrodes and a plurality of traces. Each column electrode includes a first electrode and a second electrode, wherein the first electrode is adjacent to the second electrode. The first electrode has n first patterns which are interconnected and arranged in a row direction, and the second electrode has n second patterns which are interconnected and arranged in the row direction. The first patterns and the second patterns have the same shape and structure. An upper part of each of the first patterns includes a first sub-pattern. A lower part of each of the second patterns includes a second sub-pattern. The first sub-pattern has a plurality of gaps to accommodate the second sub-pattern such that the area of the upper part of each first pattern overlaps the area of the lower part of the second pattern. The plurality of traces connect each of the first electrodes and each of the second electrodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:觸控裝置</p>
        <p type="p">11:行電極</p>
        <p type="p">111~114:電極</p>
        <p type="p">13~16:走線</p>
        <p type="p">21:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="201" publication-number="202631044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌總成</chinese-title>
        <english-title>SLIDE RAIL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250210B">A47B88/40</main-classification>
        <further-classification edition="201701120250210B">A47B88/493</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉至欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌總成包含一第一軌、一第二軌、一第三軌、一擋件、一輔助件以及一阻尼裝置。該第一軌、該第二軌、該第三軌可相對彼此縱向地位移；該第三軌位於該第一軌與該第二軌之間；該輔助件安排至該第二軌；該阻尼裝置安排至該第三軌；當該第二軌從一延伸位置往一收合方向位移的過程中，透過該擋件被帶動，該輔助件才能推抵該阻尼裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A slide rail assembly includes a first rail, a second rail, a third rail, a blocking member, an auxiliary member and a damping device. The first, second and third rails are displaceable with respect to one another. The third rail is located between the first rail and the second rail. The auxiliary member is arranged at the second rail. The damping device is arranged at the third rail. When the second rail is displaced from an extending position toward a retracting direction, the damping device cannot be activated by the auxiliary member until the blocking member is moved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:滑軌總成</p>
        <p type="p">22:第一軌</p>
        <p type="p">22a,24a,26a,28a,30a:第一端</p>
        <p type="p">22b,24b,26b,28b,30b:第二端</p>
        <p type="p">24:第二軌</p>
        <p type="p">26:第三軌</p>
        <p type="p">28:第四軌</p>
        <p type="p">30:第五軌</p>
        <p type="p">32:釋放件</p>
        <p type="p">34:輔助件</p>
        <p type="p">36:擋件</p>
        <p type="p">40:軸</p>
        <p type="p">42:彈性件</p>
        <p type="p">46:第二軌部</p>
        <p type="p">54a:第一牆</p>
        <p type="p">54b:第二牆</p>
        <p type="p">56:縱向牆</p>
        <p type="p">82:第一支撐特徵</p>
        <p type="p">84:第二支撐特徵</p>
        <p type="p">86:導引部</p>
        <p type="p">G1:第一間隙</p>
        <p type="p">G2:第二間隙</p>
        <p type="p">S1:第一狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="202" publication-number="202631004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能自動灑水設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">A01G25/16</main-classification>
        <further-classification edition="200601120250331B">A01G27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山市慶誼金屬制品企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李述龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍崑廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤棠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能自動灑水設備，包含一自走設備及一供自走設備停靠之工作基座，自走設備受一控制單元驅動執行一灑水模式及一回充模式。於灑水模式下，自走設備以掃描模組偵測周圍物體距離資訊規劃出一行駛路徑，使自走設備沿行駛路徑移動並啓動灑水。於回充模式，自走設備以訊號接收單元接收引導訊號而移動停靠於工作基座進行補水及/或充電，實現自動精準澆灌植被，節約水資源，降低維護成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自走設備</p>
        <p type="p">101:前部</p>
        <p type="p">102:後部</p>
        <p type="p">104:頂蓋</p>
        <p type="p">1:驅動輪組</p>
        <p type="p">11:前輪組</p>
        <p type="p">12:後輪組</p>
        <p type="p">2:水箱</p>
        <p type="p">4:掃描模組</p>
        <p type="p">200:工作基座</p>
        <p type="p">201:立座</p>
        <p type="p">202:底座</p>
        <p type="p">203:收容空間</p>
        <p type="p">211:電線</p>
        <p type="p">212:自來水管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="203" publication-number="202632619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人員狀況偵測系統</chinese-title>
        <english-title>PERSONNEL CONDITION DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250606B">G08B21/02</main-classification>
        <further-classification edition="200601120250606B">G08B25/00</further-classification>
        <further-classification edition="200601120250606B">G01S13/88</further-classification>
        <further-classification edition="202201120250606B">G06V40/10</further-classification>
        <further-classification edition="202201120250606B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝其昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林禮獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENG, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張采如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, CAI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晏鈴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林其宥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游杰儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, JIE-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝昀庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人員狀況偵測系統包含：標籤識別裝置，掃描待偵測者所持有的載有個人資訊的識別標籤，以識別並輸出個人資訊；毫米波雷達，根據偵測起始指令對目標區域的至少一待偵測人員進行移動速度及高度的偵測，以取得分別相關於至少一待偵測人員的至少一偵測信號；管控裝置，接收並儲存個人資訊，且根據個人資訊產生偵測起始指令並傳輸至毫米波雷達，且接收來自毫米波雷達的至少一偵測信號，並根據至少一偵測信號判斷至少一待偵測人員中的任一者是否處於跌倒姿勢，且於判斷結果為是時，產生警示信號；及通信裝置，接收警示信號並傳送至遠端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A personnel condition detection system comprises a tag identification device, a millimeter wave radar, a control device and a communication device. The tag identification device scans an identification tag carrying personal information held by a person to be detected to identify and output the personal information. The millimeter wave radar detects the movement speed and height of at least one person to be detected in a target area according to a detection initiation command to obtain at least one detection signal associated with the at least one person to be detected, respectively. The control device receives and stores the personal information, generates and transmits the detection initiation command to the millimeter wave radar based on the personal information, receives the at least one detection signal from the millimeter wave radar, determines whether any one of the at least one person to be detected is in a falling posture based on the at least one detection signal, and generates a warning signal when the determination result is yes. The communication device receives the warning signal and transmits it to a remote device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:人員狀況偵測系統</p>
        <p type="p">11:標籤識別裝置</p>
        <p type="p">12:毫米波雷達</p>
        <p type="p">13:管控裝置</p>
        <p type="p">14:通信裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="204" publication-number="202632639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢幕控制方法及螢幕控制裝置</chinese-title>
        <english-title>DISPLAY CONTROL METHOD AND DISPLAY CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">G09G5/10</main-classification>
        <further-classification edition="200601120250424B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊立琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種螢幕控制方法，適用於一電子裝置。電子裝置具有一螢幕以及一環境光偵測器，螢幕適於顯示一原始畫面，環境光偵測器適於偵測環境亮度以產生環境亮度資料。電子裝置並耦接一指標裝置，據以在原始畫面上呈現指標。此螢幕控制方法包含以下步驟。首先，獲取照明設定資料。隨後，獲取指標之位置資料，並依據位置資料產生照明區域資料。接下來，依據照明設定資料、環境亮度資料以及照明區域資料轉換原始畫面而產生照明調整畫面，照明調整畫面具有一照明區域對應於指標。然後，將照明調整畫面呈現於螢幕。本案並提供一種螢幕控制裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display control method adapted to an electronic device having a display and an environmental brightness sensor is provided. The display is utilized for showing an original picture. The environmental brightness sensor is utilized for detecting environmental brightness to generate environmental brightness data accordingly. The electronic device is also adapted to couple a pointing device for showing an indicator on the original picture. The display control method comprises the following steps. Firstly, lighting setting data is set. Then, position data of the indicator is acquired, and lighting area data is generated based on the position data. Thereafter, the original picture is converted into a lighting adjusted picture based on the environmental brightness data, the lighting setting data, and lighting area data, wherein the lighting adjusted picture has a lighting area corresponding to the indicator. Then the lighting adjusted picture is shown on the display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">12:螢幕</p>
        <p type="p">14:環境光偵測器</p>
        <p type="p">20:指標裝置</p>
        <p type="p">100:螢幕控制裝置</p>
        <p type="p">120:照明設定單元</p>
        <p type="p">140:照明位置獲取單元</p>
        <p type="p">160:畫面調整單元</p>
        <p type="p">A1:原始畫面</p>
        <p type="p">A2:照明調整畫面</p>
        <p type="p">A3:亮度調整畫面</p>
        <p type="p">B1:照明區域</p>
        <p type="p">D1:環境亮度資料</p>
        <p type="p">D2:照明設定資料</p>
        <p type="p">D3:照明區域資料</p>
        <p type="p">UI:使用者介面</p>
        <p type="p">S1:使用者輸入訊號</p>
        <p type="p">F1:亮度調整演算法</p>
        <p type="p">F2:照明調整演算法</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="205" publication-number="202632471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦及其鍵盤控制方法</chinese-title>
        <english-title>LAPTOP COMPUTER AND KEYBOARD CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/01</main-classification>
        <further-classification edition="200601120250401B">H01H13/83</further-classification>
        <further-classification edition="200601120250401B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃資翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZIH-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林亮仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIANG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏榤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祐生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種筆記型電腦適於執行一開機程序以及一會議程式。此筆記型電腦包含一鍵盤模組、複數發光單元以及一發光控制單元。鍵盤模組包含相鄰排列且對應於會議程式之複數功能鍵。複數發光單元對應於這些功能鍵進行設置。發光控制單元適於因應一第一觸發事件控制複數發光單元產生一第一光效。發光控制單元並適於因應一第二觸發事件控制複數發光單元產生一第二光效，且第二光效不同於第一光效。第一觸發事件係對應於筆記型電腦執行開機程序，第二觸發事件係對應於筆記型電腦啟動會議程式。本案並提供適用於此筆記型電腦之一種鍵盤控制方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laptop computer adapted to execute a boot process and a conference program is provided. The laptop computer comprises a keyboard module, a plurality of lighting elements, and a control unit is provided. The keyboard module comprises a plurality of function keys corresponding to the conference program. The light elements are arranged in correspondence with the function keys. The control unit is for controlling the plurality of the lighting elements to generate a first light effect in responsive to a first trigger event, and is for controlling the plurality of the lighting elements to generate a second light effect, which is different from the first light effect, in responsive to a second trigger event. The first trigger event is to start up the boot process and the second trigger event is to execute the conference program. A keyboard control method for the laptop computer is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:筆記型電腦</p>
        <p type="p">120:鍵盤模組</p>
        <p type="p">122:功能鍵</p>
        <p type="p">122a:揚聲器靜音鍵</p>
        <p type="p">122b:音量降低鍵</p>
        <p type="p">122c:音量增加鍵</p>
        <p type="p">122d:麥克風靜音控制鍵</p>
        <p type="p">140:發光單元</p>
        <p type="p">160:發光控制單元</p>
        <p type="p">170:鍵盤控制單元</p>
        <p type="p">180:處理器</p>
        <p type="p">TE1:第一觸發事件</p>
        <p type="p">TE2:第二觸發事件</p>
        <p type="p">CA:會議程式</p>
        <p type="p">S1,S2:按鍵訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="206" publication-number="202631285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可交換刀頭結構之切削刀具</chinese-title>
        <english-title>CUTTING TOOLS WITH INTERCHANGEABLE HEAD STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">B23B51/00</main-classification>
        <further-classification edition="200601120250422B">B23B31/02</further-classification>
        <further-classification edition="200601120250422B">B23B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張新添</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張新添</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種可交換刀頭結構之切削刀具，包含一刀頭及一刀桿，並由一螺絲鎖固，所述之刀桿端面朝內設有一多角面形狀之定位孔，包含底部設為一對稱形狀且呈V形之定位槽，具有快速定位之功能，所述之刀頭一端設有一定位軸，所述之定位軸係設成多角面之形狀，包含底部設為一對稱形狀且呈V形之定位座；本發明刀桿之定位孔以及刀頭之定位軸外觀設成多角面之形狀，藉由多角形狀使得所述刀頭與所述刀桿之旋轉自由度受到拘限，除此之外該多角形狀具有較佳之抗扭曲應力及抗剪應力之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:刀桿</p>
        <p type="p">11:定位孔</p>
        <p type="p">111:定位槽</p>
        <p type="p">112:直立邊</p>
        <p type="p">113:上平直邊</p>
        <p type="p">114:下平直邊</p>
        <p type="p">115:螺孔</p>
        <p type="p">20:刀頭</p>
        <p type="p">21:刀片</p>
        <p type="p">22:定位軸</p>
        <p type="p">222:直立面</p>
        <p type="p">223:受力面</p>
        <p type="p">225:錐孔</p>
        <p type="p">23:抗彎軸</p>
        <p type="p">30:螺絲</p>
        <p type="p">31:圓錐頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="207" publication-number="202631224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有複數種運動行程之運動墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250604B">A63B6/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡單綠能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMPLE GREEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高上傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHANG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴永彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運動墊，包含一墊體，該墊體為具有至少五邊的多邊形墊體，該墊體上表面內部係相應該墊體周邊形狀設一內多邊滑行區，該內多邊滑行區外周環設一外多邊止滑區，據此透過該墊體之多邊形設計，使該內多邊滑行區提供多種直線運動行程，從而提供使用者多樣化的運動選擇，並可調整運動強度以適應不同需求，有助於增進運動使用之變化性，又該墊體的外周邊可用於對齊拼接，令複數個墊體可快速且整齊的拼接靠合形成一大片地墊，並透過各該墊體確實界定出每個人的訓練運動空間，提升結構使用之實用性及便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:墊體</p>
        <p type="p">11:內多邊滑行區</p>
        <p type="p">111:界限內邊</p>
        <p type="p">112:界限內角</p>
        <p type="p">12:外多邊止滑區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="208" publication-number="202632592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱處理的製程管理方法</chinese-title>
        <english-title>METHOD FOR MANAGING HEAT TREATMENT MANUFACTURING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250512B">G06Q50/04</main-classification>
        <further-classification edition="201901120250512B">G06F16/24</further-classification>
        <further-classification edition="200601120250512B">G05B19/418</further-classification>
        <further-classification edition="200601120250512B">F28D19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義守大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I SHOU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝名家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏仲崑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHUNG KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種熱處理的製程管理方法，步驟包含：將一熱處理資料庫與一經驗值資料庫納入一熱處理大數據之中；設置一電腦，連接該熱處理大數據與一伺服器，該伺服器連接至少一熱處理爐；該電腦根據一訂單訊息中的複數條件，執行一篩選；該篩選的結果為唯一值時，該電腦輸出既存的一量產製程並傳遞至該伺服器；該篩選的結果為零或大於二時，該電腦由該熱處理大數據中搜尋與所述複數條件相匹配的訊息，據以輸出一試樣製程並傳遞至該伺服器；該伺服器根據該量產製程或該試樣製程，控制所述熱處理爐進行熱處理，藉此獲得一量產成品或一試樣成品；當該試樣成品符合該訂單訊息時，該電腦將該試樣製程儲存為新的另一量產製程；該伺服器將所述熱處理爐的一操作訊息與熱處理結果輸入該熱處理大數據之中；藉此，能根據訂單訊息的內容選擇使用量產製程或試樣製程，能降低因熱處理失敗而導致須再次進行熱處理的機率，提高熱處理成功的效益，而能有效改善高耗能及高碳排的缺失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:熱處理大數據</p>
        <p type="p">3:伺服器</p>
        <p type="p">4:熱處理爐</p>
        <p type="p">P1:量產製程</p>
        <p type="p">P2:試樣製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="209" publication-number="202632547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供應鏈的可視化進度追蹤方法</chinese-title>
        <english-title>VISUALIZED PROGRESS TRACKING METHOD FOR SUPPLY CHAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250508B">G06Q10/06</main-classification>
        <further-classification edition="202301120250508B">G06Q10/0631</further-classification>
        <further-classification edition="202301120250508B">G06Q10/0633</further-classification>
        <further-classification edition="202301120250508B">G06Q10/0875</further-classification>
        <further-classification edition="201201120250508B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義守大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I SHOU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝名家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏仲崑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHUNG KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種供應鏈的可視化進度追蹤方法，包含客戶端透過訂單系統輸入訂單訊息至生產端；透過訂單介面將該訂單訊息轉換成為訂單數據圖，並獲得製造流程傳遞至製程系統；以電子裝置掃描工令單條碼，產生電子報工單；透過生產介面輸入報工訊息；並轉換成為生產數據圖；庫存介面將該報工訊息轉換成為庫存數據圖；雲端伺服器輸出該訂單數據圖、該生產數據圖及該庫存數據圖。藉以將各項數據資訊透過圖表呈現，使資訊實現可視化，以方便管理者觀看。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="210" publication-number="202631101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸住再繃緊肌肉震動按摩器</chinese-title>
        <english-title>A VIBRATING MASSAGER THAT SUCKS AND TIGHTENS MUSCLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">A61H7/00</main-classification>
        <further-classification edition="200601120250228B">A61H23/02</further-classification>
        <further-classification edition="200601120250228B">A61H39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪肇榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHAO JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪肇榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHAO JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸住再繃緊肌肉震動按摩器，包括一震動按摩器本體，其設一震動輸出端，並結合有一吸力體；通過以吸力體將肌肉拉起並繃緊，可連帶牽引周邊較大範圍肌肉，隨著震動並輔以搖晃產生多向拉扯，進一步擴大震動按摩之效力範圍及程度，有效提高震動按摩之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vibrating massager that sucks and tightens muscles, that comprises a vibration massager body, which is provided with a vibration output end and is combined with a suction body; by pulling up and tightening the muscle with the suction body, the surrounding larger The muscles in a certain range will be pulled in multiple directions with the vibration and shaking, which will further expand the effective range and degree of vibration massage and effectively improve the effect of vibration massage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:震動按摩器本體</p>
        <p type="p">11:震動輸出端</p>
        <p type="p">2:吸力體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="211" publication-number="202631461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複數長條物捲收包裝裝置</chinese-title>
        <english-title>ROLLING AND PACKAGING DEVICE FOR MULTIPLE LONG OBJECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">B65D25/04</main-classification>
        <further-classification edition="200601120250325B">B65D35/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭鈺文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭鈺文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複數長條物捲收包裝裝置，用以解決習知複數長條物包裝不易的問題。係包含：一機台座具有一置物槽，該置物槽的一端邊具有一操作空間，該操作空間具一上板及一上延伸板，該上延伸板與一下延伸板保持一間距；一第一動力元件用以帶動二推板進入該操作空間及朝一出口方向移動；至少一第二動力元件用以使一門片對該出口作開閉；一第三動力元件結合在該機台座的底部用以帶動一轉盤旋轉，及使二柱桿相對於該轉盤升降；及一第四動力元件用以帶動一蓋板樞轉遮蓋該操作空間上方的一部份或開啟。如此，係可以使複數長條物被容易包裝的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rolling and packaging device for multiple long objects is provided to solve the problem of difficulty in packaging multiple long objects. The device includes a machine base with a storage slot. One end of the storage slot has an operating space. The operating space has an upper plate and an upper extension plate. The upper extension plate and a lower extension plate maintain a distance. A first power component is used to drive two push plates to enter the operating space and move toward the direction of an exit. At least one second power component is used to open and close a door to the exit. A third power component is combined with the bottom of the machine base to drive a turntable to rotate and make two poles rise and fall relative to the turntable. A fourth power component is used to pivot to cover a portion of the upper part of the operating space or to open. The rolling and packaging device provides the effect of making it easy to pack multiple long objects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機台座</p>
        <p type="p">11:置物槽</p>
        <p type="p">11a,11b:側壁</p>
        <p type="p">11c:端邊</p>
        <p type="p">12:止牆</p>
        <p type="p">13:上板</p>
        <p type="p">14:上延伸板</p>
        <p type="p">15:下延伸板</p>
        <p type="p">2:第一動力元件</p>
        <p type="p">21:推板</p>
        <p type="p">3:第二動力元件</p>
        <p type="p">31:樞轉軸</p>
        <p type="p">32:門片</p>
        <p type="p">4:第三動力元件</p>
        <p type="p">41:轉盤</p>
        <p type="p">42:柱桿</p>
        <p type="p">5:第四動力元件</p>
        <p type="p">51:蓋板</p>
        <p type="p">S:操作空間</p>
        <p type="p">S1:推送口</p>
        <p type="p">S2:出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="212" publication-number="202632122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網格組合板乾式軌道施工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250606B">E04G21/00</main-classification>
        <further-classification edition="200601120250606B">E04G21/16</further-classification>
        <further-classification edition="200601120250606B">E04G21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛文佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛文佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種網格組合板乾式軌道施工方法，包含以下步驟：於一地坪上設置有一防水層及於該防水層上設置有至少一不織布層；將至少一網格組合板及至少一網格固定板組合並設置於該不織布層上；於該網格固定板上之至少一組槽內設置有至少二斜面調整座及於該斜面調整座上設置有一軸件，且於該軸件上架設有一軌道，由該軸件與該斜面調整座間之相對設置位置調整該軌道與該網格固定板之相對斜度；利用所述軌道之斜度鋪設一乾沙，使乾沙通過所述網格組合板與網格固定板並佈設於該不織布層上，再透過所述軌道來整平所述乾沙；及將不織布層反折且披覆於所述乾沙表面上，並於不織布層上鋪設有複數透水磚，藉此達到可模組化組裝施作且機械化程度高，並藉以提升施工便利性並降低施工成本外，更可達到高排水性之防水隔熱保護效果，及方便修漏且可避免廢料產生之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="213" publication-number="202632391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用顯示器及其背光模組</chinese-title>
        <english-title>AUTOMOTIVE DISPLAY AND BACKLIGHT MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">G02F1/1333</main-classification>
        <further-classification edition="200601120250328B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志桂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭閔鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MIN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組包含殼體、擴散板、光源及彈性限位件。殼體包含背板及側壁，側壁具有凹槽。擴散板設置在殼體中，並包含主體及突出結構，突出結構設置在主體的外緣，並對應於側壁的凹槽。光源設置在殼體中。彈性限位件套設在擴散板的突出結構上，並具有溝槽，溝槽與側壁的凹槽的內緣嵌合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a housing, a diffuser plate, a light source and an elastic retainer. The housing includes a backplate and a sidewall having a recess. The diffuser plate is disposed in the housing. The diffuser plate includes a main body and a projection structure located at a periphery of the main body and positioned corresponding to the recess of the sidewall. The light source is disposed in the housing. The elastic retainer is fit over the projection structure of the diffuser plate and has a groove mating with an inner edge of the recess of the sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:殼體</p>
        <p type="p">21:背板</p>
        <p type="p">22:側壁</p>
        <p type="p">23:凹部</p>
        <p type="p">24:外壁面</p>
        <p type="p">26:前緣</p>
        <p type="p">27:凹槽</p>
        <p type="p">271:第一區段</p>
        <p type="p">272:第二區段</p>
        <p type="p">30:擴散板</p>
        <p type="p">35:主體</p>
        <p type="p">37:突出結構</p>
        <p type="p">40:光源</p>
        <p type="p">50:彈性限位件</p>
        <p type="p">57:溝槽</p>
        <p type="p">80:支撐件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="214" publication-number="202632403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用顯示器及其背光模組</chinese-title>
        <english-title>AUTOMOTIVE DISPLAY AND BACKLIGHT MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">G02F1/13357</main-classification>
        <further-classification edition="200601120250326B">G02F1/29</further-classification>
        <further-classification edition="202401120250326B">B60K35/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志桂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭閔鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MIN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒昱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, YU HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組包含殼體、導光板、光源及彈性限位件。殼體包含背板及側壁，側壁包含第一壁部。導光板設置在殼體中，並具有第一側邊及凹槽。第一側邊對應於側壁的第一壁部，凹槽具有位於第一側邊的側開口。光源設置在殼體中，並面向導光板。彈性限位件設置在導光板的凹槽中，並經由凹槽的側開口突伸出導光板的第一側邊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a housing, a light guide plate, a light source and an elastic retainer. The housing includes a backplate and a sidewall having a first wall portion. The light guide plate is disposed in the housing and has a first lateral edge and a recess. The first lateral edge corresponds to the first wall portion of the sidewall. The recess has a side opening at the first lateral edge. The light source is disposed in the housing and faces the light guide plate. The elastic retainer is disposed in the recess of the light guide plate and projects from the first lateral edge of the light guide plate via the side opening of the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:側壁</p>
        <p type="p">221:第一壁部</p>
        <p type="p">222:第二壁部</p>
        <p type="p">223:第三壁部</p>
        <p type="p">30:導光板</p>
        <p type="p">31:第一側邊</p>
        <p type="p">32:第二側邊</p>
        <p type="p">33:第三側邊</p>
        <p type="p">36:第一側開口</p>
        <p type="p">40:光源</p>
        <p type="p">47:電路板</p>
        <p type="p">48:發光元件</p>
        <p type="p">50P:第一彈性限位件</p>
        <p type="p">50Q:第二彈性限位件</p>
        <p type="p">50R:第三彈性限位件</p>
        <p type="p">51:第一延伸部</p>
        <p type="p">52:第二延伸部</p>
        <p type="p">53:斜面</p>
        <p type="p">56:第一端</p>
        <p type="p">57:第二端</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="215" publication-number="202632251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面電漿共振裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">G01N21/63</main-classification>
        <further-classification edition="200601120250206B">G01N33/569</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光稜科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AFFINITY SENSING TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林于淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面電漿共振裝置，具有：一檢測平台，具有一檢測區及貼附於該檢測區之頂面之一光學元件，該光學元件具有相對之一入光側及一出光側以接收一入射光及提供一輸出光，其中，該底面與該入射光及該輸出光大致平行；一光源，用以產生該入射光；以及一光偵測器，用以接收該輸出光；其中，該光學元件具有一入射光導引結構及一反射光導引結構，該入射光導引結構具有一第一面鏡組合以將該入射光導引至該檢測區之一斜向入射路徑，且該反射光導引結構具有一第二面鏡組合以導引該檢測區之一反射光而產生該輸出光；其中，該檢測區具有一插槽及可插拔於該插槽中之一檢測模組，該插槽具有一透光頂面，該檢測模組由上至下具有一稜鏡、一表面電漿激發層及一流道檢測晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:表面電漿共振裝置</p>
        <p type="p">110:檢測平台</p>
        <p type="p">111:檢測區</p>
        <p type="p">111a:頂面</p>
        <p type="p">111b:稜鏡</p>
        <p type="p">111c:表面電漿激發層</p>
        <p type="p">111d:流道檢測晶片</p>
        <p type="p">112:光學元件</p>
        <p type="p">120:光源</p>
        <p type="p">130:光偵測器</p>
        <p type="p">140:處理器</p>
        <p type="p">S:插槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="216" publication-number="202632901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔離式積體電路及其共模瞬態偵測電路</chinese-title>
        <english-title>ISOLATION INTEGRATED CIRCUIT AND COMMON MODE TRANSIENT DETECTION CIRCUIT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">H03K17/16</main-classification>
        <further-classification edition="200601120250613B">H03K17/14</further-classification>
        <further-classification edition="200601120250613B">H03K5/1252</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供隔離式積體電路及共模瞬態偵測電路。隔離式積體電路的接收器電路包含共模瞬態偵測電路。接收器電路依據其輸入節點的輸入電壓產生輸出電壓。共模瞬態偵測電路包含電流產生電路、偏壓電路、警示電路及控制電路。偏壓電路耦接於輸入節點及電流產生電路，並響應於輸入電壓因為共模瞬態事件的變化，致能電流產生電路，以產生偵測電流。警示電路耦接於偏壓電路，並依據偵測電流產生警示訊號。控制電路耦接於警示電路，並依據警示訊號的電壓位準選擇性地遮蔽輸出電壓，以在接收器電路的輸出節點產生接收器輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an isolation integrated circuit and a common mode transient detection circuit. A receiver circuit of the isolation integrated circuit includes the common mode transient (CMT) detection circuit. The receiver circuit generates an output voltage according to an input voltage at its input node. The common mode transient detection circuit includes a current generation circuit, a bias circuit, an alert circuit and a control circuit. The bias circuit is coupled to the input node and the current generation circuit, and enables the current generation circuit in response to a change of the input voltage due to a CMT event, to generate detection current. The alert circuit is coupled to the bias circuit, and generates an alert signal according to the detection current. The control circuit is coupled to the alert circuit, and selectively masks the output voltage according to a voltage level of the alert signal, to generate a receiver output signal at an output node of the receiver circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:發射器電路</p>
        <p type="p">13:隔離電路</p>
        <p type="p">15:接收器電路</p>
        <p type="p">100:隔離式積體電路</p>
        <p type="p">151:訊號處理電路</p>
        <p type="p">200:共模瞬態偵測電路</p>
        <p type="p">NIN:輸入節點</p>
        <p type="p">NOUT:輸出節點</p>
        <p type="p">VDD1,VDD2:電源電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VSS1,VSS2:接地電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="217" publication-number="202632146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇燈</chinese-title>
        <english-title>FAN LAMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">F04D25/08</main-classification>
        <further-classification edition="200601120250414B">F21V33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億光電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERLIGHT ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張益瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭鍾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUNG WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇燈，包含發光模組、支架、風扇模組及紫外光抑菌淨化模組。支架包含底座及多個連接臂。底座包含第一表面、高於第一表面的第二表面以及連接於之間的連接面。支架是透過連接臂以連接發光模組。風扇模組位於發光模組及支架之間。紫外光抑菌淨化模組位於風扇模組與支架之間。紫外光抑菌淨化模組包含本體及連接器。支架包含位於第一表面且沿著第一表面的部份外緣的第一擋牆，以及分別自第一擋牆的二端延伸並連接至連接面的第二擋牆及第三擋牆。第一擋牆、第二擋牆、第三擋牆及連接面形成凹槽。紫外光抑菌淨化模組的連接器位於凹槽中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan lamp includes a lighting module, a bracket, a fan module, and a UV sterilization and purification module. The bracket includes a base and several connecting arms. The base includes a first surface, a second surface higher than the first surface, and a connecting surface connected there. The bracket is connected to the lighting module through the connecting arms. The fan module is located between the lighting module and the bracket. The UV sterilization and purification module is located between the fan module and the bracket. The UV sterilization and purification module includes a main body and a connector. The bracket includes a first retaining wall located on the first surface and along part of its outer edge, as well as a second retaining wall and a third retaining wall respectively extending from both ends of the first retaining wall and connecting to the connecting surface. The first retaining wall, second retaining wall, third retaining wall, and connecting surface form a recess. The connector of the UV sterilization and purification module is located within the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:支架</p>
        <p type="p">121:底座</p>
        <p type="p">1210:第一表面</p>
        <p type="p">1212:第二表面</p>
        <p type="p">1214:連接面</p>
        <p type="p">122:連接臂</p>
        <p type="p">1220:連接件</p>
        <p type="p">1231:第一擋牆</p>
        <p type="p">1232:第二擋牆</p>
        <p type="p">1233:第三擋牆</p>
        <p type="p">124:凹槽</p>
        <p type="p">1251:第一限位結構</p>
        <p type="p">1252:第二限位結構</p>
        <p type="p">126:通孔</p>
        <p type="p">x:第一軸向</p>
        <p type="p">y:第二軸向</p>
        <p type="p">z:第三軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="218" publication-number="202631445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煞車握把結構</chinese-title>
        <english-title>BRAKE HANDLE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">B62L3/02</main-classification>
        <further-classification edition="200601120250331B">B62K23/02</further-classification>
        <further-classification edition="200601120250331B">B60T7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭金清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO,JIN CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭金清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO,JIN CING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO,JIA YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家妘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO,JIA YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種煞車握把結構，包含有；一握把，其設置有一中空容室，該握把之外環周設置有一開口，該開口與該容室相連通；一按壓件，設置於該握把之開口上，略凸出於該握把，並且可產生一靠近或遠離該握把之動作；一煞車單元，於該握把之容室內設置有一觸發件，該觸發件可被驅動而帶動該煞車單元進行煞車；一轉換單元，設置於該容室內，一端與該按壓件相接，另一端與該觸發件相接，當該按壓件驅動該轉換單元時，該轉換單元可帶動該觸發件，使該煞車單元進行煞車動作。使用者握持於握把上時即可進行煞車動作，可避免長時間張手的疲勞並可即時進行煞車動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brake handle structure comprising; a handle provided with a hollow chamber, an opening in the outer circumference of the handle, the opening being connected to the chamber; a pressure member provided on the opening of the handle, projecting slightly from the handle and capable of generating an action close to or far away from the handle; a brake unit provided with a trigger inside the chamber of the handle, which can be driven to actuate the brake unit; a conversion unit provided in the chamber, one end of which is connected to the pressure member, the other end of which is connected to the trigger, when the pressure member is driven, the brake unit is braked. The user can perform the braking action when holding on the handle, which can avoid the fatigue of holding the hand for a long time and can perform the braking action immediately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:握把</p>
        <p type="p">11:容室</p>
        <p type="p">12:開口</p>
        <p type="p">13:外套部</p>
        <p type="p">20:煞車單元</p>
        <p type="p">21:觸發件</p>
        <p type="p">211:端部</p>
        <p type="p">22:繩索</p>
        <p type="p">30:轉換單元</p>
        <p type="p">31:旋轉桿</p>
        <p type="p">311:樞軸</p>
        <p type="p">312:按壓件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="219" publication-number="202631154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金雀異黃酮或其磷酸酯衍生物用於治療或/及預防脂肪相關代謝疾病之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">A61K31/665</main-classification>
        <further-classification edition="200601120250401B">A61K31/352</further-classification>
        <further-classification edition="200601120250401B">A61P3/04</further-classification>
        <further-classification edition="200601120250401B">A61P3/06</further-classification>
        <further-classification edition="201601120250401B">A23L33/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東海大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇南維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏子堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏　飛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAYAL, VIPUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝長奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雍凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種金雀異黃酮或其磷酸酯衍生物用於治療或/及改善代謝性疾病之第二用途。具體來說，透過投予一有效量之金雀異黃酮或其磷酸酯衍生物至一個體，係能夠抑制脂肪累積於該個體體內或是內臟部位，以達到治療或/及預防與脂肪代謝異常相關疾病之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="220" publication-number="202631038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吹風機之握把結構</chinese-title>
        <english-title>HANDLE STRUCTURE OF HAIR DRYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">A45D20/12</main-classification>
        <further-classification edition="200601120250502B">A45D20/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊文章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐國容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣佰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, PAI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吹風機之握把結構包括本體、握把以及轉動模組。握把相對於本體樞轉於收合位置及展開位置。轉動模組連接本體及握把，轉動模組包括第一齒輪、第二齒輪、第三齒輪以及搖桿。第一齒輪固設於本體，第二齒輪固設於握把，第三齒輪同時嚙合於第一齒輪及第二齒輪。搖桿具有相對之第一端及第二端，第一端樞接於第一齒輪並與第一齒輪共軸心，第二端樞接於第二齒輪並與第二齒輪共軸心，且第三齒輪樞設於搖桿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handle structure of a hair dryer includes a main body, a handle, and a rotation module. The handle pivots relative to the main body between a folded position and an unfolded position. The rotation module connects the main body and the handle and includes a first gear, a second gear, a third gear, and a rocker arm. The first gear is fixedly mounted on the main body, while the second gear is fixedly mounted on the handle. The third gear simultaneously meshes with the first gear and the second gear. The rocker arm has a first end and a second end. The first end is pivotally connected to and coaxial with the first gear, while the second end is pivotally connected to and coaxial with the second gear. Additionally, the third gear is pivotally mounted on the rocker arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:凹槽</p>
        <p type="p">12:開口</p>
        <p type="p">20:握把</p>
        <p type="p">30:轉動模組</p>
        <p type="p">31:第一齒輪</p>
        <p type="p">32:第二齒輪</p>
        <p type="p">33:第三齒輪</p>
        <p type="p">34:搖桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="221" publication-number="202633050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251017B">H05K5/10</main-classification>
        <further-classification edition="200601120251017B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紹彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHAO-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電子裝置，包括一第一殼體、一電子單元以及一第二殼體。第一殼體具有一容置空間。電子單元可拆卸地設置於容置空間，並包括一本體及樞接於本體的一槓桿結構，槓桿結構的一端包括一第一卡合部。第二殼體適於相對第一殼體在一釋放位置與一固定位置間滑動，第二殼體在固定位置時與第一殼體固定連接以覆蓋容置空間，並包括與第一卡合部對應設置的一第二卡合部；其中，當第二殼體相對第一殼體由釋放位置滑動至固定位置時，第二卡合部推動槓桿結構的另一端並使該槓桿結構由一水平狀態轉動至一傾斜狀態；當槓桿結構位於傾斜狀態且第二殼體由固定位置滑動至釋放位置時，第二卡合部卡合第一卡合部，使第二殼體能夠脫離第一殼體而一併帶動電子單元脫離容置空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electronic device, which includes an first shell, an electronic unit, and a second shell. The first shell has an accommodation space. The electronic unit is detachably disposed in the accommodation space and includes a body and a lever structure pivotally connected to the body. One end of the lever structure includes a first engaging portion. The second shell is adapted to slide relative to the first shell between a release position and a fixed position. The second shell is fixedly connected to the first shell to cover the accommodation space at the fixed position, and includes a second engaging portion corresponding to the first engaging portion; wherein, when the second shell slides from the release position to the fixed position relative to the first shell, the second engaging portion pushes the other end of the lever structure to rotate the lever structure from a horizontal state to a tilted state; when the lever structure is in the tilted state and the second shell slides from the fixed position to the release position, the second engaging portion engages with the first engaging portion, so that the second shell can be separated from the first shell and drive the electronic unit to separate from of the accommodation space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一殼體</p>
        <p type="p">111:第一固定結構</p>
        <p type="p">12:電子單元</p>
        <p type="p">121:本體</p>
        <p type="p">1211:電子元件</p>
        <p type="p">122:槓桿結構</p>
        <p type="p">1221:第一卡合部</p>
        <p type="p">123:固定軸</p>
        <p type="p">124:凸柱</p>
        <p type="p">1241:頂部</p>
        <p type="p">13:第二殼體</p>
        <p type="p">131:第二固定結構</p>
        <p type="p">132:第二卡合部</p>
        <p type="p">B:主機殼體</p>
        <p type="p">D1:方向</p>
        <p type="p">G1:第一凹槽</p>
        <p type="p">G2:第二凹槽</p>
        <p type="p">H1:第一斜面</p>
        <p type="p">H2:第二斜面</p>
        <p type="p">S1:容置空間</p>
        <p type="p">P2:固定位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="222" publication-number="202633128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力感測結構及其製造方法</chinese-title>
        <english-title>PRESSURE SENSOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250609B">H10D48/50</main-classification>
        <further-classification edition="202501120250609B">H10D1/40</further-classification>
        <further-classification edition="200601120250609B">G01L1/20</further-classification>
        <further-classification edition="202501120250609B">H10D48/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓力感測結構，包含半導體基板、複合薄膜、空腔、半導體電阻器以及蓋板。半導體基板具有相反側的第一表面和第二表面，複合薄膜埋置於半導體基板內，位於第一表面。空腔設置於半導體基板內，從第二表面延伸到複合薄膜。半導體電阻器設置於複合薄膜上，位於空腔的正上方。蓋板鍵合至半導體基板，以密封空腔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pressure sensor structure includes a semiconductor substrate, a composite membrane, a cavity, a semiconductor resistor and a cap plate. The semiconductor substrate has a first surface opposite to a second surface. The composite membrane is embedded in the semiconductor substrate and located at the first surface. The cavity is disposed in the semiconductor substrate and extended from the second surface to the composite membrane. The semiconductor resistor is disposed on the composite membrane and located directly above the cavity. The cap plate is bonded to the semiconductor substrate to seal the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓力感測結構</p>
        <p type="p">101:半導體基板</p>
        <p type="p">101F:第一表面</p>
        <p type="p">101B:第二表面</p>
        <p type="p">104:半導體填充層</p>
        <p type="p">105:絕緣層</p>
        <p type="p">106:複合薄膜</p>
        <p type="p">108:介電層</p>
        <p type="p">110:半導體電阻器</p>
        <p type="p">111:第一電阻</p>
        <p type="p">112:第二電阻</p>
        <p type="p">121:介電層</p>
        <p type="p">122:導通孔</p>
        <p type="p">123:導線層</p>
        <p type="p">125:保護層</p>
        <p type="p">127:空腔</p>
        <p type="p">129:鍵合層</p>
        <p type="p">130:蓋板</p>
        <p type="p">155:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="223" publication-number="202632797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置工作系統、插件設備、拔件設備、串接件、及料匣</chinese-title>
        <english-title>PROCESSING SYSTEM FOR ELECTRONIC DEVICE, INSERTION APPARATUS, PULL-OUT APPARATUS, CONNECTION MEMBER, AND CASSETTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250421B">H01R13/02</main-classification>
        <further-classification edition="201801120250421B">H01R4/2404</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王伯瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李銘展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴明安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電子裝置工作系統、插件設備、拔件設備、串接件、及料匣。所述電子裝置工作系統包含一插件設備、一工作站、及一拔件設備。所述插件設備包含相鄰設置的一輸送裝置與一插入裝置，並且所述輸送裝置用於承接一電子裝置，而所述插入裝置用於將一串接件插設於所述電子裝置，以構成一電子模組。所述工作站能用來承接所述電子模組、並對其進行一預定作業。所述拔件設備包含相鄰設置的一承載台及一拔出裝置。所述承載台用於承接與定位完成所述預定作業的所述電子模組，並且所述拔出裝置用以將所述串接件自所述電子裝置拔除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a processing system for an electronic device, an insertion apparatus, a pull-out apparatus, a connection member, and a cassette. The processing system includes an insertion apparatus, a processing station, and a pull-out apparatus. The insertion apparatus includes a transportation device and an insertion device that is arranged adjacent to the transportation device. The transportation device is configured to carry an electronic device, and the insertion device is configured to push and insert a connection member into the electronic device to form an electronic module. The processing station is configured to receive the electronic module and implement a predetermined process to the electronic module. The pull-out apparatus includes a carrying platform and a pull-out device that is arranged adjacent to the carrying platform. The carrying platform is configured to carry and hold the electronic module after the predetermined process, and the pull-out device is configured to pull-out the connection member from the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置工作系統</p>
        <p type="p">1:插件設備</p>
        <p type="p">11:輸送裝置</p>
        <p type="p">12:插入裝置</p>
        <p type="p">2:工作站</p>
        <p type="p">3:拔件設備</p>
        <p type="p">31:承載台</p>
        <p type="p">32:拔出裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="224" publication-number="202631947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自黏型塗膜組成物、自黏型塗膜電磁鋼片、其製造方法及積層鐵芯的製造方法</chinese-title>
        <english-title>SELF-BONDING COATING COMPOSITION, SELF-BONDING COATED ELECTRICAL STEEL SHEET, METHOD OF FORMING THE SAME, AND METHOD OF PRODUCING LAMINATED CORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">G11B5/147</main-classification>
        <further-classification edition="200601120250213B">F15B13/044</further-classification>
        <further-classification edition="200601120250213B">C09D163/06</further-classification>
        <further-classification edition="200601120250213B">C09J163/06</further-classification>
        <further-classification edition="200601120250213B">C09D183/04</further-classification>
        <further-classification edition="200601120250213B">C09D183/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭敬國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHING-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林新惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種自黏型塗膜組成物、自黏型塗膜電磁鋼片、其製造方法及積層鐵芯的製造方法。自黏型塗膜組成物包含水性羥基環氧樹脂(A)、水性硬化劑(B)、環氧基矽氧烷化合物(C)及矽氧烷化合物(D)。藉由塗佈具有特定組成含量的自黏型塗膜組成物在電磁鋼片上，以形成具有較佳耐蝕性、絕緣性、抗高溫黃化性及黏著強度的自黏型塗膜電磁鋼片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A self-bonding coating composition, a self-bonding coated electrical steel sheet, a method of forming the same, and a method of producing a laminated core are provided. The self-bonding coating composition includes an aqueous hydroxyl-containing epoxy resin (A), an aqueous curing agent (B), an epoxy siloxane compound (C) and a siloxane compound (D). The self-bonding coated electrical steel sheet with improved corrosion resistance, insulation, high-temperature yellowness resistance and adhesive strength can be obtained by coating the self-bonding coating composition with specific composition content on the electrical steel sheet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="225" publication-number="202632562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化履歷分類系統及其方法</chinese-title>
        <english-title>AUTOMATED RESUME CLASSIFICATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250206B">G06Q10/1053</main-classification>
        <further-classification edition="202301120250206B">G06Q10/105</further-classification>
        <further-classification edition="202301120250206B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富邦人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUBON LIFE INSURANCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉承齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG-CHI, YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐浩軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅雷蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種自動化履歷分類系統及其方法，此系統及其方法包括從履歷來源平台爬取複數個爬取資料，並將複數個爬取資料重複爬取資料去除，且根據不重複的爬取資料獲取篩選資料，對所有的篩選資料進行資料萃取與前處理，用以取得篩選資料的非個資履歷資訊，將每一個非個資履歷資訊生成向量化履歷資訊，以及將每一個求才職缺的招募資訊生成向量化招募資訊，對每一個向量化履歷資訊與每一個向量化招募資訊進行比對，從而生成匹配每一個求才職缺的求職履歷名單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an automated resume classification system and method. This system and method comprise crawling a plurality of crawled data from resume source platforms and removing duplicate data of the same job applicant among the plurality of crawled data to form a plurality of filtered data. The plurality of filtered data undergoes data extraction and preprocessing to obtain non-personal resume information. Each non-personal resume information is converted into vectorized resume information, and each recruitment information for job openings is converted into vectorized recruitment information. The vectorized resume information is compared with the vectorized recruitment information to generate a resume list that matches each job opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:爬取模組</p>
        <p type="p">10:爬取資料庫</p>
        <p type="p">2:篩選模組</p>
        <p type="p">20:篩選資料庫</p>
        <p type="p">3:解析模組</p>
        <p type="p">30:解析資料庫</p>
        <p type="p">4:求才模組</p>
        <p type="p">5:向量化模組</p>
        <p type="p">50:向量資料庫</p>
        <p type="p">6:比對模組</p>
        <p type="p">60:比對資料庫</p>
        <p type="p">7:推薦模組</p>
        <p type="p">70:推薦資料庫</p>
        <p type="p">8:履歷來源平台</p>
        <p type="p">9:求才平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="226" publication-number="202632192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空調系統</chinese-title>
        <english-title>AIR CONDITIONING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250502B">F24F11/30</main-classification>
        <further-classification edition="201801120250502B">F24F11/58</further-classification>
        <further-classification edition="201801120250502B">F24F11/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯陽半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITE TECH. INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">空調系統包括室內機、第一無線模組、至少一溫度感測器、至少一第二無線模組及處理器。室內機設置於室內空間中，第一無線模組設置於室內機內，至少一溫度感測器設置於室內空間中室內機之外的位置，用以感測至少一感測溫度，至少一第二無線模組，耦接於至少一溫度感測器，用以傳輸至少一感測溫度至第一無線模組，處理器耦接於第一無線模組，用以根據至少一感測溫度及目標溫度來調節室內機的輸出功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air conditioning system includes an indoor unit, a first wireless module, at least one thermostat sensor, at least one second wireless module and a processor. The indoor unit is disposed within an indoor space. The first wireless module is disposed inside the indoor unit. At least one thermostat sensor is disposed in the indoor space outside the indoor unit to sense at least one sensing temperature. The at least one second wireless module is coupled to the at least one thermostat sensor for transmitting the at least one sensing temperature to the first wireless module. The processor is coupled to the first wireless module to adjust the output power of the indoor unit according to the at least one sensing temperature and a target temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:空調系統</p>
        <p type="p">102:室內空間</p>
        <p type="p">104:室內機</p>
        <p type="p">106:處理器</p>
        <p type="p">108:第一無線模組</p>
        <p type="p">110:溫度感測器</p>
        <p type="p">112:第二無線模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="227" publication-number="202631210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼科產品及眼科液態組合物</chinese-title>
        <english-title>OPHTHALMIC PRODUCT AND OPHTHALMIC LIQUID COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">A61L12/14</main-classification>
        <further-classification edition="200601120250206B">C08B37/02</further-classification>
        <further-classification edition="200601120250206B">G02C7/04</further-classification>
        <further-classification edition="200601120250206B">G02C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶碩光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGAVISION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳君涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃汶嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉力豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種眼科產品及眼科液態組合物。眼科液態組合物至少包含β-葡聚醣，並選擇性包含：親水性高分子、表面活性劑及緩衝劑的至少其中之一。β-葡聚醣為源自於蕈菇類的萃取物，並且具有β-1,3/1,6-D-葡聚糖的聚合螺旋式結構。基於眼科液態組合物總重為100重量%，β-葡聚醣的含量介於0.003至3重量%。當眼科液態組合物浸泡一隱形眼鏡鏡片，β-葡聚醣於隱形眼鏡鏡片表面形成一高分子基體薄膜，減緩所述鏡片表面的水分蒸發。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an ophthalmic product and an ophthalmic liquid composition. The ophthalmic liquid composition comprises at least β-glucan, and optionally comprises at least one of a hydrophilic polymer, a surfactant, and a buffering agent. The β-glucan is an extract derived from mushrooms and has a β-1,3/1,6-D-d-Glucan helical polymeric structure. Based on a total weight of 100% of the ophthalmic liquid composition, the content of β-glucan ranges from 0.003 to 3% by weight. When the ophthalmic liquid composition soaks a contact lens, the β-glucan forms a polymeric matrix film on the surface of the contact lens, which reduces moisture evaporation from the lens surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="228" publication-number="202631233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具沙灘運動效果之跑步包及操作跑步包進行跑步運動之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250930B">A63B69/00</main-classification>
        <further-classification edition="200601120250930B">A63B22/06</further-classification>
        <further-classification edition="200601120250930B">A63B71/06</further-classification>
        <further-classification edition="200601120250930B">A63B26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡單綠能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMPLE GREEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雅娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YA-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高上傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHANG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具沙灘運動效果之跑步包及操作跑步包進行跑步運動之方法，包含有一袋體、複數顆粒及一手持件，各該顆粒係容納於袋體內部且未充滿袋體，該手持件係設置於袋體一端；藉此，手抓該手持件將袋體之一端拉高時，各該顆粒可移動而積聚於袋體之另一端，使用者可手抓該手持件並踩踏於袋體積聚各顆粒之一端表面，同步進行手臂及跑步等運動。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:跑步包</p>
        <p type="p">12:袋體</p>
        <p type="p">14:顆粒</p>
        <p type="p">16:手持件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="229" publication-number="202632916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單端雙向傳輸電路之高線性度混合電路及其入站訊號擷取方法</chinese-title>
        <english-title>HYBRID CIRCUIT WITH HIGH LINEARITY FOR SINGLE-ENDED AND BI-DIRECTIONAL TRANSCEIVER AND EXTRACTING METHOD OF INBOUND SIGNAL THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04B3/03</main-classification>
        <further-classification edition="201501120250401B">H04B1/38</further-classification>
        <further-classification edition="200601120250401B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范銘彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, MING-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉曜嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAO-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銘勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種單端雙向傳輸電路之高線性度混合電路及其入站訊號擷取方法，該混合電路係一隔離電阻係串接在該單端傳輸路徑上，以於其二端分別產生同相的第一及第二混合訊號；再以一分壓比例調整電路調整該第一及第二混合訊號的電壓擺幅後，再對應輸出同相但電壓擺幅不同的第三及四混合訊號至一比較電路，並直接比較該第三及第四混合訊號後輸出一電壓訊號，該電壓訊號即匹配混合訊號中的入站訊號；如此，本發明不採用以主動元件構成的訊號相加或相減電路，具更佳的線性度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a hybrid circuit with high linearity for single-ended and bi-directional transceiver and extracting method of inbound signal thereof. The hybrid circuit employs an isolation resistor to be connected to a single-ended transmission path in serial and a first hybrid signal and a second hybrid signal are generated at two ends of the isolation resistor. A voltage division ratio adjustment circuit adjusts two voltage swings of the first and second hybrid signals and then outputs a third and fourth hybrid signals with the same phase and different voltage swings to a comparator. The comparator directly compares the third and fourth hybrid signals and then outputs a voltage signal. The voltage signal matches an inbound signal of a hybrid signal. Therefore, the present invention does not employ an adder or a subtractor consisted of a plurality of active components and the linearity of the hybrid circuit is greatly increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單端雙向傳輸電路</p>
        <p type="p">100:單端傳輸路徑</p>
        <p type="p">10:高線性度混合電路</p>
        <p type="p">11:隔離電阻</p>
        <p type="p">111:第一端</p>
        <p type="p">112:第二端</p>
        <p type="p">20:分壓比例調整電路</p>
        <p type="p">21:第一分壓電路</p>
        <p type="p">22:第二分壓電路</p>
        <p type="p">30:比較電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="230" publication-number="202632755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽碳複合負極材料及其製備方法以及二次電池</chinese-title>
        <english-title>SILICON-CARBON COMPOSITE NEGATIVE ELECTRODE MATERIAL, PREPARATION METHOD THEREOF AND SECONDARY BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260302B">H01M4/133</main-classification>
        <further-classification edition="201001120260302B">H01M10/0525</further-classification>
        <further-classification edition="201001120260302B">H01M10/0562</further-classification>
        <further-classification edition="201701120260302B">C01B32/20</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯量科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳懋松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MAO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳葦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種矽碳複合負極材料，矽碳複合負極材料為一核殼結構，包括內核層的奈米矽以及包覆奈米矽的含氮石墨層，所述奈米矽與所述含氮石墨層以非共價鍵鍵合，其中所述核殼結構的尺寸介於5微米至10微米，而所述含氮石墨層的含氮量為10%以下。另外，本發明提供一種矽碳複合負極材料的製備方法以及二次電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a silicon-carbon composite negative electrode material. The silicon-carbon composite negative electrode material has a core-shell structure, including a nano-silicon core and a nitrogen-containing graphite layer covering the nano-silicon core. The nano-silicon core and the nitrogen-containing graphite layer are bonded by non-covalent bonds, a size of the core-shell structure is between 5 microns and 10 microns, and the nitrogen content of the nitrogen-containing graphite layer is less than 10%. In addition, the present invention provides a preparation method of the silicon-carbon composite negative electrode material and a secondary battery.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="231" publication-number="202631472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙層錯開換箱設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">B65G13/02</main-classification>
        <further-classification edition="200601120250326B">B65G13/11</further-classification>
        <further-classification edition="200601120250326B">B65G11/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逢霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逢霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙層錯開換箱設備，係一本體機台的一端配置一第一傳料台，以及在該本體機台的另一端配置一第二傳料台，且該第一傳料台與第二傳料台分別由獨立之昇降機構驅動上下，其中該第一傳料台包含一個以上之傳遞通道，該第二傳料台係具有上層輸送台及下層輸送台以昇降機構同步調整高度；主要運用第二傳料台之上、下層輸送台，提供料桶及空桶形成高低錯開輸送，縮短待運時間，藉此達到省時及提高生產效率的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:本體機台</p>
        <p type="p">2:第一傳料台</p>
        <p type="p">20:昇降機構</p>
        <p type="p">21:傳遞通道</p>
        <p type="p">210:擋桿</p>
        <p type="p">22:滾柱組</p>
        <p type="p">220:滾柱</p>
        <p type="p">221:齒盤</p>
        <p type="p">222:鏈條</p>
        <p type="p">23:角鐵</p>
        <p type="p">230:限位輪組</p>
        <p type="p">231:架板</p>
        <p type="p">232:限位輪</p>
        <p type="p">233:導引塊</p>
        <p type="p">3:第二傳料台</p>
        <p type="p">30:第二昇降機構</p>
        <p type="p">31:上層輸送台</p>
        <p type="p">310:上層傳遞通道</p>
        <p type="p">311:滾柱組</p>
        <p type="p">312:滾柱</p>
        <p type="p">313:齒盤</p>
        <p type="p">314:鏈條</p>
        <p type="p">33:角鐵</p>
        <p type="p">330:限位輪組</p>
        <p type="p">331:架板</p>
        <p type="p">332:限位輪</p>
        <p type="p">333:導引塊</p>
        <p type="p">334:擋桿</p>
        <p type="p">335:氣壓缸</p>
        <p type="p">336:固定支點</p>
        <p type="p">337:擋止裝置</p>
        <p type="p">34:下層輸送台</p>
        <p type="p">340:下層傳遞通道</p>
        <p type="p">341:滾柱組</p>
        <p type="p">342:滾柱</p>
        <p type="p">343:齒盤</p>
        <p type="p">344:鏈條</p>
        <p type="p">35:擋柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="232" publication-number="202633339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直式倉儲設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B65G1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟賦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIFF TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王元論</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUAN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鶴憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐國祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種垂直式倉儲設備能儲放物品，並包含殼座、二設置於該殼座中的傳動機構、驅轉模組及多個儲放物品且連接傳動機構的儲物機構。每一傳動機構包括傳動單元。傳動單元包括二在直立方向間隔的鏈齒輪，及套設於鏈齒輪且在傳動方向運行的傳動鏈條。驅轉模組連接於傳動機構，並帶動傳動鏈條運行。儲物機構被所述傳動機構帶動而在傳動方向移動。利用傳動機構的傳動鏈條與儲物機構能被帶動移動的設計，人員不需要爬高取物，作業安全性能顯著提升，且能增加置物空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼座</p>
        <p type="p">11:主殼體</p>
        <p type="p">111:內側面</p>
        <p type="p">112:設置空間</p>
        <p type="p">113:開口</p>
        <p type="p">12:門片</p>
        <p type="p">2:傳動機構</p>
        <p type="p">22:傳動單元</p>
        <p type="p">221:鏈齒輪</p>
        <p type="p">222:傳動鏈條</p>
        <p type="p">223:第一軌跡</p>
        <p type="p">224:第二軌跡</p>
        <p type="p">23:第一限位單元</p>
        <p type="p">231:限位桿</p>
        <p type="p">232:第一限位組</p>
        <p type="p">235:固定片</p>
        <p type="p">236:導向輪</p>
        <p type="p">24:第二限位單元</p>
        <p type="p">241:第一限位軌道</p>
        <p type="p">242:第二限位軌道</p>
        <p type="p">3:連動軸</p>
        <p type="p">5:儲物機構</p>
        <p type="p">51:儲物架</p>
        <p type="p">512:側部</p>
        <p type="p">513:置物空間</p>
        <p type="p">514:取物口</p>
        <p type="p">53:限位組</p>
        <p type="p">531:第一限位塊</p>
        <p type="p">90:物品</p>
        <p type="p">T:直立方向</p>
        <p type="p">X2:第二方向</p>
        <p type="p">A:傳動方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="233" publication-number="202632578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>票券兌換系統、裝置、方法及程式產品</chinese-title>
        <english-title>TICKET EXCHANGE SYSTEM, DEVICE, METHOD AND PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q30/06</main-classification>
        <further-classification edition="200601120250401B">G07B1/00</further-classification>
        <further-classification edition="201201120250401B">G06Q20/38</further-classification>
        <further-classification edition="201201120250401B">G06Q20/08</further-classification>
        <further-classification edition="201201120250401B">G06Q20/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>悠遊卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EASYCARD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">票券兌換系統100，包含至少一伺服端裝置102以及至少一票券兌換裝置101；伺服端裝置102，係包含一兌換用票券資訊資料庫1021；兌換用票券資訊資料庫1021儲存至少一兌換用票券資訊103；票券兌換裝置101，係藉由第一傳輸介面連接伺服端裝置102以取得兌換用票券資訊103；兌換用票券資訊103各自與電子票證的識別資料附加對應；票券兌換裝置101於藉由第一傳輸介面接收電子票證的識別資料後，依據與識別資料附加對應的兌換用票券資訊103，藉由第二傳輸介面提供至少一兌換用票券。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The ticket exchange system 100 includes at least one server device 102 and at least one ticket exchange device 101. The server device 102 includes an exchange ticket information database 1021. The exchange ticket information database 1021 stores at least one piece of exchange ticket information 103. The ticket exchange device 101 connects to the server device 102 through a first transmission interface to obtain the exchange ticket information 103. Each piece of the exchange ticket information 103 is associated with the identification data of an electronic ticket. After receiving the identification data of the electronic ticket through the first transmission interface, the ticket exchange device 101 provides at least one exchange ticket through a second transmission interface based on the exchange ticket information 103 associated with the identification data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:票券兌換系統</p>
        <p type="p">101:票券兌換裝置</p>
        <p type="p">102:伺服端裝置</p>
        <p type="p">103:兌換用票券資訊</p>
        <p type="p">1021:兌換用票券資訊資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="234" publication-number="202632545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速搜尋量子線路</chinese-title>
        <english-title>QUANTUM CIRCUIT WITH QUICK SEARCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06N10/40</main-classification>
        <further-classification edition="202201120250401B">G06N10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江振瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JEHN-RUEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快速搜尋量子線路包括：一個迪克態單元、一個第一暫存器、一個神諭、一個第二暫存器、以及一個第三暫存器。第一暫存器具有n個量子位元，該第一暫存器的n個量子位元應用於該迪克態單元，其中，n為大於0之整數。神諭用以標記搜尋問題的解答，其中，該迪克態單元的輸出應用於該神諭。第二暫存器具有一個量子位元用作該神諭的輸出。第三暫存器具有n個量子位元，用來反映該神諭所標記搜尋問題解答的疊加態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quantum circuit with quick search includes: a Dicke state unit, a first register, an oracle, a second register, and a third register. The first register has n qubits, and the n qubits of the first register are applied to the Dicke state unit, wherein n is an integer greater than 0. The oracle is used to mark a solution to the search problem, wherein the output of the Dicke state unit is applied to the oracle. The second register has a qubit that serves as the output of the oracle. The third register has n qubits and is used to reflect the superposition of the solutions to the search problem marked by the oracle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:神諭</p>
        <p type="p">21:迪克態單元</p>
        <p type="p">25:多控非閘</p>
        <p type="p">27:量測程序單元</p>
        <p type="p">251:控制位元</p>
        <p type="p">253:目標位元</p>
        <p type="p">REG-x:第一暫存器</p>
        <p type="p">REG-y:第二暫存器</p>
        <p type="p">REG-x':第三暫存器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="235" publication-number="202631289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102485</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以焊接電子元件之裝置</chinese-title>
        <english-title>APPARATUS CONFIGURED TO BOND AN ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B23K26/03</main-classification>
        <further-classification edition="201401120260302B">B23K26/21</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥科先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRAFT SYSTEM PLUS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHINGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以焊接電子元件之裝置，包括焊接機構、承載座、確認影像擷取機構、定位影像擷取機構、能量產生機構及控制單元。焊接機構包括焊接頭，其有參考標記和定位標記。焊接頭可抓取欲焊接電子元件，並將其置於欲焊接位置以進行焊接。承載座用以承載欲被焊接基板。承載座和焊接頭相對設置。確認影像擷取機構擷取參考標記和電子元件間之影像。定位影像擷取機構透過定位標記擷取部份基板的影像。能量產生機構提供能量於焊接頭以進行焊接。控制單元依據來自於確認影像擷取機構之資訊指示焊接頭及/或承載座作動並完成焊接之作動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus configured to bond an electronic component including a bonding mechanism, a carrying platform, a confirming-image capturing mechanism, a positioning-image capturing mechanism, an energy-generating mechanism and a control unit is provided. The bonding mechanism includes a bonding head with a reference mark and a positioning mark. The bonding head could grab an electronic component to be bonded and place it at a desired bonding position for bonding. The carrying platform is used to carry a substrate to be bonded. The carrying platform and the bonding head are arranged oppositely. The confirming-image capturing mechanism captures an image between the reference mark and the electronic component. The positioning-image capturing mechanism captures an image of part of the substrate through the positioning mark. The energy-generating mechanism provides energy to the bonding head to perform bonding. The control unit instructs the bonding head and/or the carrying platform to operate based on an information from the confirming-image capture mechanism and completes the bonding operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用以焊接電子元件之裝置</p>
        <p type="p">100:承載座</p>
        <p type="p">110:控制單元</p>
        <p type="p">110A,110B:訊號線</p>
        <p type="p">120:焊接機構</p>
        <p type="p">BS:欲被焊接基板</p>
        <p type="p">P1:欲焊接位置</p>
        <p type="p">BH:焊接頭</p>
        <p type="p">C1:確認影像擷取機構</p>
        <p type="p">C2:定位影像擷取機構</p>
        <p type="p">ED:欲焊接電子元件</p>
        <p type="p">TR:光可透過之區域</p>
        <p type="p">SP:定位標記</p>
        <p type="p">RP:參考標記</p>
        <p type="p">EG:能量產生機構</p>
        <p type="p">X,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="236" publication-number="202632269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>禽蛋鮮度檢測方法及其檢測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G01N33/08</main-classification>
        <further-classification edition="202201120250207B">G06V10/40</further-classification>
        <further-classification edition="202201120250207B">G06V10/70</further-classification>
        <further-classification edition="202201120250207B">G06V10/778</further-classification>
        <further-classification edition="202401120250207B">G06Q50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福記冷凍食品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉晉嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭云維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜昭文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐治民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種禽蛋鮮度檢測方法，包含有：掃描待檢測禽蛋批號之批號確認步驟；將禽蛋進行秤重之禽蛋重量檢測；剝開禽蛋得待檢測禽蛋蛋液之開蛋步驟；針對蛋液進行秤重之蛋液重量量測步驟；針對蛋液進行掃描以取得蛋液影像資料之影像掃描步驟；將蛋液影像資料進行轉換為三維點雲圖並記錄轉換相關空間座標及結構資訊為純文字檔案之資料處理辨識步驟；利用演算法識別及辨識建構出蛋液中蛋黃、濃蛋白及稀蛋白結構的空間邊界與體積比例之數值化分析步驟；利用蛋黃、濃蛋白及稀蛋白結構體積比例進行分析，以建立標準化鮮度評級系統之建立鮮度評級系統步驟；將經數值化分析步驟分析後之禽蛋蛋液依據鮮度評級系統辨識鮮度等級之鮮度分級步驟；將鮮度分級結果顯示供人員確認之結果顯示步驟；及將鮮度分級結果紀錄儲存之資料儲存步驟；藉此，俾提供一種可自動化、快速、準確對禽蛋蛋液進行檢測分析，進而達到禽蛋鮮度自動化分級之檢測方法及其檢測系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="237" publication-number="202632937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其應用程式的異常網路流量偵測方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR DETECTING ABNORMAL NETWORK TRAFFIC OF APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">H04L47/20</main-classification>
        <further-classification edition="202201120250401B">H04L43/08</further-classification>
        <further-classification edition="202201120250401B">H04L43/02</further-classification>
        <further-classification edition="202201120250401B">H04L43/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖世傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張津豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奕男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種電子裝置及其應用程式的異常網路流量偵測方法。所述方法包括下列步驟。接收多個行動電子裝置的行動網路流量資料。各個行動電子裝置的行動網路流量資料包括一應用程式的應用程式網路流量。針對應用程式對多個行動電子裝置的應用程式網路流量進行統計分析處理，以獲取應用程式關聯於目標單位時段的單位時間流量平均值。判斷目標單位時段的單位時間流量平均值是否滿足流量異常條件。當目標單位時段的單位時間流量平均值滿足流量異常條件，根據目標單位時段的單位時間流量平均值識別應用程式的流量異常版本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a method for detecting abnormal network traffic of application thereof. The method includes the following steps. Mobile network traffic data of a plurality of mobile electronic devices is received. The mobile network traffic data of each mobile electronic device includes application network traffic of an application. A statistical analysis processing is performed on the application network traffic of the mobile electronic devices for the application, to obtain an average traffic per unit time of associated with a target unit period for the application. Whether the average traffic per unit time of the target unit period meets a traffic abnormality condition is determined. When the average traffic per unit time of the target unit period meets the traffic abnormal condition, a traffic abnormal version of the application is identified based on the average traffic per unit time of the target unit period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="238" publication-number="202631322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萬向套筒</chinese-title>
        <english-title>UNIVERSAL SOCKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">B25B13/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許雅斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YA FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪盈盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許雅斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YA FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪盈盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種萬向套筒，其包括：一筒座、一轉動件及複數擋止件。該筒座包含有一本體與一第一連接部，該第一連接部設於該本體，該本體定義有一軸向與一徑向，該本體圍構有相連通之一內部空間與一開口，該本體之一內側壁面沿該徑向凹設有二組接槽，各該組接槽沿該軸向延伸；該轉動件包含有一插接部、二凸部與一第二連接部，該插接部可活動地容設於該內部空間，該二凸部凸出於該插接部而可移動地插設於該二組接槽，該第二連接部連接該插接部地凸伸出該開口；該複數擋止件凸設於該內側壁面而於該軸向上與該插接部呈干涉配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a universal socket, comprising: a barrel seat, a rotating member, and a plurality of stopper elements. The barrel seat includes a main body and a first connecting portion, with the first connecting portion disposed on the main body. The main body defines an axial direction and a radial direction, and encloses an interconnected internal space and an opening. The inner wall surface of the main body is recessed along the radial direction to form two sets of engaging grooves, with each set of engaging grooves extending along the axial direction. The rotating member comprises an insertion portion, two protrusions, and a second connecting portion. The insertion portion is movably accommodated within the internal space, and the two protrusions extend outwardly from the insertion portion and are movably inserted into the two sets of engaging grooves. The second connecting portion is connected to the insertion portion and extends outwardly through the opening. The plurality of stopper elements are protrudingly disposed on the inner wall surface and configured to interfere with the insertion portion along the axial direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:本體</p>
        <p type="p">22:開口</p>
        <p type="p">25:組接槽</p>
        <p type="p">26:環槽</p>
        <p type="p">3:轉動件</p>
        <p type="p">31:主體</p>
        <p type="p">32:插接部</p>
        <p type="p">33:第二連接部</p>
        <p type="p">34:銷件</p>
        <p type="p">37:止滑結構</p>
        <p type="p">4:擋止件</p>
        <p type="p">6:彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="239" publication-number="202631326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪扳手</chinese-title>
        <english-title>RATCHET WRENCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">B25B13/46</main-classification>
        <further-classification edition="200601120250502B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特典工具股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAM TOOLS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江水來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, SHUI-LAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種棘輪扳手，包括：一桿體，包括一工作頭部及一握柄，該工作頭部包括一腔室；一棘輪件，可轉動地容設於該腔室，具有一供與一驅動件組接之組接部；一卡掣組件，容設於該腔室，包括至少一第一卡掣件、至少一第二卡掣件及至少一彈頂於該至少一第一卡掣件與該至少一第二卡掣件之間的彈性件；及一切換件，包括一身部及一撥鈕，該身部樞接於該工作頭部且可繞一軸線轉動，該身部包括一繞該軸線延伸之致動面，該撥鈕位於該工作頭部之外側且可切換而位於一第一位置或一第二位置；其中，當該撥鈕朝該第一位置移動時，該致動面抵推該至少一第一卡掣件脫離該棘輪件，且該彈性件彈頂該至少一第二卡掣件以嚙合該棘輪件；其中，當該撥鈕朝該第二位置移動時，該致動面抵推該至少一第二卡掣件脫離該棘輪件，且該彈性件彈頂該至少一第一卡掣件以嚙合該棘輪件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ratchet wrench is provided, including: a rod body including a working head and a handle, the working head including a chamber; a ratchet member rotatably received in the chamber, having an assembling portion configured to be assembled with a driving member assembly; a detent assembly received in the chamber, including at least one first detent member, at least one second detent member and at least one elastic member between the at least one first detent member and the at least one second detent member; and a switching member including a body portion and a dial, the body portion being pivotally connected to the working head and rotatable about an axis, the body portion including an actuating surface extending about the axis, the dial being located outside the working head and switchable to be located in a first position or in a second position; wherein when the dial moves toward the first position, the actuating surface pushes the at least one first detent member to disengage from the ratchet member, and the elastic member urges the at least one second detent member to engage with the ratchet member; wherein when the dial moves toward the second position, the actuating surface pushes the at least one second detent member to disengage from the ratchet member, and the elastic member urges the at least one first detent member to engage with the ratchet member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:棘輪扳手</p>
        <p type="p">10:桿體</p>
        <p type="p">11:工作頭部</p>
        <p type="p">12:握柄</p>
        <p type="p">20:棘輪件</p>
        <p type="p">40:切換件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="240" publication-number="202633095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250206B">H10D1/60</main-classification>
        <further-classification edition="202501120250206B">H10D1/68</further-classification>
        <further-classification edition="202301120250206B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范博智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, PO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳金能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIN-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包括基底、第一電極、第一支撐層、高介電常數介電層、低介電常數介電層與第二電極。第一電極位於基底上。第一電極為柱狀。第一支撐層位於第一電極的側壁上。高介電常數介電層位於第一電極與第一支撐層上。低介電常數介電層位於第一支撐層與高介電常數介電層之間以及第一電極與高介電常數介電層之間。第二電極位於高介電常數介電層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure including a substrate, a first electrode, a first support layer, a high dielectric constant (high-k) dielectric layer, a low dielectric constant (low-k) dielectric layer, and a second electrode is provided. The first electrode is located on the substrate. The first electrode is pillar-shaped. The first support layer is located on the sidewall of the first electrode. The high-k dielectric layer is located on the first electrode and the first support layer. The low-k dielectric layer is located between the first support layer and the high-k dielectric layer and between the first electrode and the high-k dielectric layer. The second electrode is located on the high-k dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">102,112:電極</p>
        <p type="p">104,106:支撐層</p>
        <p type="p">108:低介電常數介電層</p>
        <p type="p">110:高介電常數介電層</p>
        <p type="p">114,116,118,124:導電層</p>
        <p type="p">120,126,126a,126b:介電層</p>
        <p type="p">122:內連線結構</p>
        <p type="p">C1:電容器</p>
        <p type="p">SW1:側壁</p>
        <p type="p">T1,T2,T3:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="241" publication-number="202631046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎖裝置及其滑軌總成以及該滑軌總成之操作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250224B">A47B88/407</main-classification>
        <further-classification edition="201701120250224B">A47B88/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-ZHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張富田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鎖裝置及其滑軌總成以及該滑軌總成之操作方法，包含：一鎖裝置，包括：一座體；一活動件，該活動件活動連接於該座體上；一鎖件，該鎖件設在該活動件上，當該活動件在該座體調整一第一縱向位置與一第二縱向位置之間進行縱向位移，則該鎖件隨著該活動件在該第一縱向位置來定於一鎖定位置，或則該鎖件隨著該活動件在該第二縱向位置來定於一非鎖定位置；以及一第一軌，該第一軌具有一第一側面及一第二側面，且該座體設在該第一軌上，當該鎖件定於該鎖定位置，則該鎖件位在該第一側面之側邊，或當該鎖件定於該非鎖定位置，則該鎖件位在該第二側面之側邊。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:鎖裝置</p>
        <p type="p">11:座體</p>
        <p type="p">112:定位部</p>
        <p type="p">12:活動件</p>
        <p type="p">121:作動部</p>
        <p type="p">122:旋轉部</p>
        <p type="p">123:樞接件</p>
        <p type="p">13:鎖件</p>
        <p type="p">20:滑軌總成</p>
        <p type="p">21:第一軌</p>
        <p type="p">211:第一側面</p>
        <p type="p">212:第二側面</p>
        <p type="p">22:第二軌</p>
        <p type="p">221:第一端面</p>
        <p type="p">222:第二端面</p>
        <p type="p">223:中框</p>
        <p type="p">224:外框</p>
        <p type="p">23:鎖座</p>
        <p type="p">231:鎖孔</p>
        <p type="p">A:定位特徵</p>
        <p type="p">B:旋轉特徵</p>
        <p type="p">K1:鎖定位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="242" publication-number="202632206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兩相式冷卻系統及其導流器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">F28F13/04</main-classification>
        <further-classification edition="200601120250318B">F28F9/22</further-classification>
        <further-classification edition="200601120250318B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家崎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WE SOLUTIONS TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俊慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳坤達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUN-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兩相式冷卻系統，包含：一密閉槽；一冷凝模組，具有數個冷凝管，該數個冷凝管位於該密閉槽內部的上方並呈縱向間隔排列；及數個導流器，各該導流器具有至少一傾斜板及至少一結合部，該結合部連接該傾斜板，該結合部結合任一冷凝管或該密閉槽，該傾斜板穿伸於相鄰的二冷凝管之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:冷凝模組</p>
        <p type="p">21:冷凝管</p>
        <p type="p">3A:導流器</p>
        <p type="p">31:傾斜板</p>
        <p type="p">311:液體導出端緣</p>
        <p type="p">32:結合部</p>
        <p type="p">321:連接片</p>
        <p type="p">322:勾體</p>
        <p type="p">323:抵接片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="243" publication-number="202631782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水性環氧樹脂乳化劑以及水性環氧樹脂組成物</chinese-title>
        <english-title>WATERBORNE EPOXY RESIN EMULSIFIER AND WATERBORNE EPOXY RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">C08G59/06</main-classification>
        <further-classification edition="200601120250205B">C08G59/16</further-classification>
        <further-classification edition="200601120250205B">C08L63/02</further-classification>
        <further-classification edition="202201120250205B">C09K23/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何奇律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHYI-LIUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JANN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEN-HEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏巨倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JYU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤崇翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅可軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, KE-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何柏賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, PO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林江珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIANG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水性環氧樹脂乳化劑，其分子結構係包含：衍生自一第一化合物之結構；以及衍生自一環氧樹脂之結構，其中，該第一化合物之分子結構係包含苯環及二元羧基，其中，該環氧樹脂之分子結構係包含二個以上的環氧基，其中，該水性環氧樹脂乳化劑係由該第一化合物與該環氧樹脂經反應後所製得，其中，該第一化合物係將含有苯環結構的二酯化物與聚乙二醇進行酯化反應後，再與可形成二元羧基之酸酐化合物反應所製得。本發明之水性環氧樹脂乳化劑適合用於將油性環氧樹脂乳化至水相。本發明亦關於一種水性環氧樹脂組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waterborne epoxy resin emulsifier, the molecular structure thereof comprises: a structure derived from a first compound; and a structure derived from an epoxy resin, wherein the molecular structure of the first compound comprises a benzene ring and a dibasic carboxyl group, wherein the molecular structure of the epoxy resin comprises two or more epoxy groups, wherein the waterborne epoxy resin emulsifier is prepared by reacting the first compound with the epoxy resin, wherein the first compound is prepared by subjecting a diester containing a benzene ring structure to an esterification reaction with polyethylene glycol, and then reacting with an acid anhydride compound capable of forming a dibasic carboxyl group. The waterborne epoxy resin emulsifier of the present invention is suitable for emulsifying oil-based epoxy resin into a water phase. The present invention also relates to a waterborne epoxy resin composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="244" publication-number="202633088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250204B">H10B51/00</main-classification>
        <further-classification edition="202301120250204B">H10B51/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇雍琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱彥承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪唯晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包括第一電極、第二電極、鐵電材料層與第一介電層。第二電極位在第一電極上。鐵電材料層與第一介電層位在第一電極與第二電極之間。第一介電層直接接觸鐵電材料層。鐵電材料層的材料為氧化鉿鋯。第一介電層的材料為鈦酸鋇或鈦酸鍶鋇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure including a first electrode, a second electrode, a ferroelectric material layer, and a first dielectric layer is provided. The second electrode is located on the first electrode. The ferroelectric material layer and the first dielectric layer are located between the first electrode and the second electrode. The first dielectric layer is in direct contact with the ferroelectric material layer. The material of the ferroelectric material layer is hafnium zirconium oxide. The material of the first dielectric layer is barium titanate or barium strontium titanate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100,102:電極</p>
        <p type="p">104:鐵電材料層</p>
        <p type="p">106:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="245" publication-number="202632369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像鏡頭（八十五）</chinese-title>
        <english-title>LENS ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250609B">G02B11/34</main-classification>
        <further-classification edition="202101120250609B">G02B7/02</further-classification>
        <further-classification edition="200601120250609B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭包括一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡、一第六透鏡、一第七透鏡及一第八透鏡。第一透鏡為彎月型透鏡具有屈光力。第二透鏡為彎月型透鏡具有正屈光力，且包括一凸面朝向一物側及一凹面朝向一像側。第三透鏡具有屈光力。第四透鏡具有正屈光力，且包括一凸面朝向像側。第五透鏡具有屈光力。第六透鏡具有正屈光力。第七透鏡具有屈光力。第八透鏡具有屈光力。第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡及第八透鏡沿著一光軸從物側至像側依序排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens assembly includes a first lens, a second lens, a third lens, a fourth, a fifth lens, a sixth lens, a seventh lens, and an eighth lens. The first lens is a meniscus lens with refractive power. The second lens is a meniscus lens with positive refractive power and includes a convex surface facing an object side and a concave surface facing an image side. The third lens is with refractive power. The fourth lens is with positive refractive power and includes a convex surface facing the image side. The fifth lens is with refractive power. The sixth lens is with positive refractive power. The seventh lens is with refractive power. The eighth lens is with refractive power. The first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, the seventh lens, and the eighth lens are arranged in order from the object side to the image side along an optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成像鏡頭</p>
        <p type="p">L11:第一透鏡</p>
        <p type="p">L12:第二透鏡</p>
        <p type="p">L13:第三透鏡</p>
        <p type="p">L14:第四透鏡</p>
        <p type="p">L15:第五透鏡</p>
        <p type="p">L16:第六透鏡</p>
        <p type="p">L17:第七透鏡</p>
        <p type="p">L18:第八透鏡</p>
        <p type="p">ST1:光圈</p>
        <p type="p">OF1:濾光片</p>
        <p type="p">CG1:保護玻璃</p>
        <p type="p">IMA1:成像面</p>
        <p type="p">OA1:光軸</p>
        <p type="p">S11:第一透鏡物側面</p>
        <p type="p">S12:第一透鏡像側面</p>
        <p type="p">S13:第二透鏡物側面</p>
        <p type="p">S14:第二透鏡像側面</p>
        <p type="p">S15:第三透鏡物側面</p>
        <p type="p">S16:第三透鏡像側面</p>
        <p type="p">S17:第四透鏡物側面</p>
        <p type="p">S18:第四透鏡像側面</p>
        <p type="p">S110:第五透鏡物側面</p>
        <p type="p">S111:第五透鏡像側面</p>
        <p type="p">S112:第六透鏡物側面</p>
        <p type="p">S113:第六透鏡像側面</p>
        <p type="p">S114:第七透鏡物側面</p>
        <p type="p">S115:第七透鏡像側面</p>
        <p type="p">S116:第八透鏡物側面</p>
        <p type="p">S117:第八透鏡像側面</p>
        <p type="p">S118:濾光片物側面</p>
        <p type="p">S119:濾光片像側面</p>
        <p type="p">S120:保護玻璃物側面</p>
        <p type="p">S121:保護玻璃像側面</p>
        <p type="p">S19:光圈面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="246" publication-number="202632372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成像鏡頭（八十六）</chinese-title>
        <english-title>LENS ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">G02B13/18</main-classification>
        <further-classification edition="200601120250328B">G02B11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳元琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭包括一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡、一第六透鏡及一第七透鏡。第一透鏡為彎月型透鏡具有負屈光力，第一透鏡包括一凸面朝向一物側及一凹面朝向一像側。第二透鏡為彎月型透鏡具有負屈光力，第二透鏡包括一凸面朝向物側及一凹面朝向像側。第三透鏡具有屈光力。第四透鏡具有正屈光力。第五透鏡具有正屈光力。第六透鏡具有負屈光力。第七透鏡為雙凸透鏡具有正屈光力，且包括一凸面朝向物側及另一凸面朝向像側。第一、第二、第三、第四、第五、第六以及第七透鏡沿著一光軸從物側至該側依序排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens. The first lens is a meniscus lens with negative refractive power and includes a convex surface facing an object side and a concave surface facing an image side. The second lens is a meniscus lens with negative refractive power and includes a convex surface facing the object side and a concave surface facing the image side. The third lens is with refractive power. The fourth lens is with positive refractive power. The fifth lens is with positive refractive power. The sixth lens is with negative refractive power. The seventh lens is a biconvex lens with positive refractive power and includes a convex surface facing the object side and another convex surface facing the image side. The first lens, the second lens, the third lens, the fourth lens, the fifth lens, the sixth lens, and the seventh lens are arranged in order from the object side to the image side along an optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成像鏡頭</p>
        <p type="p">L11:第一透鏡</p>
        <p type="p">L12:第二透鏡</p>
        <p type="p">L13:第三透鏡</p>
        <p type="p">L14:第四透鏡</p>
        <p type="p">L15:第五透鏡</p>
        <p type="p">L16:第六透鏡</p>
        <p type="p">L17:第七透鏡</p>
        <p type="p">ST1:光圈</p>
        <p type="p">OF1:濾光片</p>
        <p type="p">IMA1:成像面</p>
        <p type="p">OA1:光軸</p>
        <p type="p">S11:第一透鏡物側面</p>
        <p type="p">S12:第一透鏡像側面</p>
        <p type="p">S13:第二透鏡物側面</p>
        <p type="p">S14:第二透鏡像側面</p>
        <p type="p">S15:第三透鏡物側面</p>
        <p type="p">S16:第三透鏡像側面</p>
        <p type="p">S17:第四透鏡物側面</p>
        <p type="p">S18:第四透鏡像側面</p>
        <p type="p">S110:第五透鏡物側面</p>
        <p type="p">S111:第五透鏡像側面</p>
        <p type="p">S111:第六透鏡物側面</p>
        <p type="p">S112:第六透鏡像側面</p>
        <p type="p">S113:第七透鏡物側面</p>
        <p type="p">S114:第七透鏡像側面</p>
        <p type="p">S115:濾光片物側面</p>
        <p type="p">S116:濾光片像側面</p>
        <p type="p">S19:光圈面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="247" publication-number="202631430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>煞車輪結構</chinese-title>
        <english-title>BRAKE WHEEL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250330B">B62B5/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王麒閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王麒閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種煞車輪結構，包含一對車輪、腳輪轉軸、拉桿、連動件、踏板、以及安裝殼體用以安裝前述構件。拉桿穿設於腳輪轉軸、以及連動件的套筒，拉桿另外穿設彈簧，並使彈簧抵頂於腳輪轉軸與套筒之間。連動件具有一煞車齒部被該車輪的齒輪環繞，連動件還具有頂桿，該頂桿的一部分形成頂桿穿孔並且裸露在安裝殼體的外部。踏板轉軸穿過該頂桿穿孔，將踏板安裝於安裝殼體。如此一來，拉桿與踏板都能透過連動件，控制煞車齒部與該車輪的齒輪之間的嚙合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brake wheel structure comprises a pair of wheels, a caster pivot, a rod, a linkage member, a pedal, and a mounting housing for installing the aforementioned components. The rod is inserted through the caster pivot and the sleeve of the linkage member, with a spring fitted around the rod and positioned between the caster pivot and the sleeve. The linkage member has a brake tooth that is surrounded by the gear ring of the wheel, and includes a vertical rod with a portion forming a rod hole that is exposed outside the mounting housing. A pedal shaft passes through the rod hole to mount the pedal to the mounting housing. As a result, both the rod and pedal can control the engagement between the brake tooth and the gear ring of wheel through the linkage member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:安裝殼體</p>
        <p type="p">11:底蓋</p>
        <p type="p">111:第一容室</p>
        <p type="p">112:第二容室</p>
        <p type="p">12A:側牆</p>
        <p type="p">172:底面</p>
        <p type="p">173:穿孔</p>
        <p type="p">18:煞車齒部軌道</p>
        <p type="p">20:車輪</p>
        <p type="p">21:齒輪</p>
        <p type="p">23:車輪軸心</p>
        <p type="p">30:腳輪轉軸</p>
        <p type="p">40:拉桿</p>
        <p type="p">41:墊片</p>
        <p type="p">42:彈簧</p>
        <p type="p">51:套筒</p>
        <p type="p">512:套筒底面</p>
        <p type="p">513:底面穿孔</p>
        <p type="p">52:延伸部分</p>
        <p type="p">53:頂桿</p>
        <p type="p">531:頂桿穿孔</p>
        <p type="p">60:踏板</p>
        <p type="p">611:第一接觸邊緣</p>
        <p type="p">612:第二接觸邊緣</p>
        <p type="p">62:踏板轉軸</p>
        <p type="p">70:C型扣</p>
        <p type="p">71:轉向轉軸</p>
        <p type="p">72:承軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="248" publication-number="202631013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>苯并咪唑衍生物</chinese-title>
        <english-title>BENZIMIDAZOLE DERIVATIVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">A01N43/52</main-classification>
        <further-classification edition="200601120250801B">A01N43/647</further-classification>
        <further-classification edition="200601120250801B">A01N43/56</further-classification>
        <further-classification edition="200601120250801B">A01N43/54</further-classification>
        <further-classification edition="200601120250801B">A01N43/60</further-classification>
        <further-classification edition="200601120250801B">A01P1/00</further-classification>
        <further-classification edition="200601120250801B">A01P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商先正達農作物保護股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保利奧　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POULIOT, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯卡伯勒　克里斯托佛　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCARBOROUGH, CHRISTOPHER CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷爾曼　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERMAIN, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬克拜納　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINKBEINER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於：具有式 (I) 的化合物，        &lt;br/&gt;&lt;img align="absmiddle" height="235px" width="200px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中取代基係如在請求項1中所定義的；用於製備具有式 (I) 的化合物的製程和方法；包含如請求項1中所定義的具有式 (I) 的化合物的農用化學組成物；該等組成物的製備以及該等化合物或組成物在農業或園藝中用於對抗、預防或控制植物、收穫的糧食作物、種子或非生命材料被植物病原性微生物、特別是真菌侵染之用途。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The current invention relates to compounds of the formula (I)        &lt;br/&gt;&lt;img align="absmiddle" height="247px" width="198px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein the substituents are as defined in claim 1, to processes and methods for preparing compounds of formula (I), to agrochemical compositions comprising compounds of formula (I) as defined in claim 1, to preparation of these compositions and to the use of the compounds or compositions in agriculture or horticulture for combating, preventing or controlling infestation of plants, harvested food crops, seeds or non-living materials by phytopathogenic microorganisms, in particular fungi.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="249" publication-number="202632824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子風產生裝置</chinese-title>
        <english-title>ION-WIND GENERATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">H01T23/00</main-classification>
        <further-classification edition="200601120250502B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州安敏瑞電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU ANMINRUI ELECTRONIC TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐倪明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, NI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪守智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, SHOU-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江浩勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐貴新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離子風產生裝置，包括絕緣框架、發射極與集電極。絕緣框架包括頂壁、底壁與相對的兩側壁，頂壁、底壁與兩側壁形成容置空間。容置空間具有進風口與出風口。兩側壁的內壁面形成有由進風口往出風口方向向內傾斜的傾斜面，絕緣框架還包括承架，承架位於進風口旁且兩端分別連接於兩側壁。發射極包括連接部與連接於連接部的導電刷，導電刷由密集排列的導電纖維所組成，連接部設置於承架上。集電極包括至少一導電桿件，各導電桿件位於出風口旁且兩端分別連接於兩側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion-wind generating device includes an insulating frame, an emitter electrode, and a collector electrode. The insulating frame includes a top wall, a bottom wall, and two opposite side walls, forming an accommodating space. The accommodating space has an air inlet and an air outlet. Inner surfaces of the two side walls form inclined surfaces that slope inward from the air inlet toward the air outlet. The insulating frame further includes a support frame positioned near the air inlet, with its two ends respectively connected to the two side walls. The emitter electrode includes a connecting portion and a conductive brush connected to the connecting portion. The conductive brush consists of densely arranged conductive fibers. The connecting portion is disposed on the support frame. The collector electrode includes at least one conductive rod, with each conductive rod positioned near the air outlet and its two ends respectively connected to the two side walls.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:離子風產生裝置</p>
        <p type="p">10:絕緣框架</p>
        <p type="p">11:頂壁</p>
        <p type="p">111、112:輔助進風口</p>
        <p type="p">12:底壁</p>
        <p type="p">13:側壁</p>
        <p type="p">131:第一順向面</p>
        <p type="p">132:傾斜面</p>
        <p type="p">133:第二順向面</p>
        <p type="p">134:凸面</p>
        <p type="p">15:承架</p>
        <p type="p">151:水平承板</p>
        <p type="p">152:垂直承板</p>
        <p type="p">16:連接孔</p>
        <p type="p">20:發射極</p>
        <p type="p">21:連接部</p>
        <p type="p">22:導電刷</p>
        <p type="p">23:導電纖維</p>
        <p type="p">30:集電極</p>
        <p type="p">31:導電桿件</p>
        <p type="p">32:輔助導電桿件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="250" publication-number="202632463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子組件的散熱系統</chinese-title>
        <english-title>HEAT DISSIPATION SYSTEM FOR ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G06F1/16</main-classification>
        <further-classification edition="200601120250207B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州安敏瑞電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU ANMINRUI ELECTRONIC TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐倪明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, NI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪守智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, SHOU-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江浩勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐貴新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱系統，包括至少一離子風產生單元與至少一臭氧清除單元。離子風產生單元與臭氧清除單元均具有相同結構，包括絕緣框架、發射極與集電極，其中絕緣框架的內壁面形成有傾斜面與凸面，發射極位於絕緣框架的中間位置並包括連接部與由密集排列的導電纖維所組成導電刷，集電極包括導電桿件。離子風產生單元與臭氧清除單元分別設置於電子組件的相對兩側邊，離子風產生單元操作於高電勢差而會產生離子風與臭氧並吹向電子組件幫助散熱，臭氧清除單元操作於低電勢差而會分解臭氧；因此，散熱系統可產生離子風幫助電子組件散熱並可自清除臭氧。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation system includes at least one ion-wind generating unit and at least one ozone removing unit. The ion-wind generating unit and the ozone removing unit each has the same structure including an insulating frame, an emitter electrode, and a collector electrode. Inner surfaces of the insulating frame form inclined surfaces and convex surfaces. The emitter electrode positioned at the center of the insulating frame includes a connecting portion and a conductive brush consisting of densely arranged conductive fibers. The collector electrode includes a conductive rod. The ion-wind generating unit and the ozone removing unit are respectively disposed on two opposite sides of an electronic component. The ion-wind generating unit operates at a high potential difference to generate ion wind and ozone that are directed toward the electronic component to enhance heat dissipation. The ozone removing unit operates at a low potential difference to decompose ozone. Thus, the heat dissipation system may generate ion wind to enhance heat dissipation for the electronic component while simultaneously removing ozone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:離子風產生單元或臭氧清除單元</p>
        <p type="p">1a:離子風產生單元</p>
        <p type="p">1b:臭氧清除單元</p>
        <p type="p">10:絕緣框架</p>
        <p type="p">141:進風口</p>
        <p type="p">142:出風口</p>
        <p type="p">20:發射極</p>
        <p type="p">21:連接部</p>
        <p type="p">22:導電刷</p>
        <p type="p">30:集電極</p>
        <p type="p">31:導電桿件</p>
        <p type="p">2:電子組件</p>
        <p type="p">x、y、z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="251" publication-number="202632155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定元件</chinese-title>
        <english-title>FIXED ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">F16B13/06</main-classification>
        <further-classification edition="200601120250317B">B65D19/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固定元件，是包含：第一部件、第二部件、固定元件所構成，該第一部件與第二部件的相應銜接範圍是形成通孔，以允許前述固定元件的引入，該第一部件保留的通孔周邊是凹入相應二剖溝、及交錯二相應方位凹入陷入段，以配合前述固定元件一端外延伸的二抵制段沿著該二剖溝引入並推至第二部件的通孔，前述第二部件保留的通孔周邊是延伸二相應阻擋段，以允許被推入的固定元件在撥轉一角度後可受到前述阻擋段的方位限制，一併該固定元件另端外延伸的二彈性段則被推入第一部件相應凹入的陷入段，使彼此欲銜接的第一、第二部件獲有確切的方位抵制，及日後輕易拆開作分解。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fixing element consists of: a first component, a second component, and a fixing component. The corresponding connecting range of the first component and the second component forms a through hole to allow the introduction of the aforementioned fixing component. The first component The periphery of the remaining through hole is concave with two corresponding sectional grooves and two staggered recessed sections with corresponding orientations, so as to cooperate with the two resistance sections extending from one end of the aforementioned fixing element to be introduced along the two sectional grooves and pushed to the passage of the second component. hole, the periphery of the through hole retained by the aforementioned second component is extended by two corresponding blocking sections to allow the pushed-in fixing element to be restricted by the orientation of the aforementioned blocking section after being rotated at an angle, and the other end of the fixing element extends outward The two elastic sections are pushed into the corresponding concave recessed section of the first component, so that the first and second components that are to be connected to each other are provided with precise positional resistance, and can be easily disassembled for disassembly in the future.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一部件</p>
        <p type="p">11、21:通孔</p>
        <p type="p">12:平置區域</p>
        <p type="p">13、24:剖溝</p>
        <p type="p">14:陷入段</p>
        <p type="p">15:突部</p>
        <p type="p">16:倒角</p>
        <p type="p">17:導緣凸部</p>
        <p type="p">2:第二部件</p>
        <p type="p">22:阻擋段</p>
        <p type="p">221:弧部</p>
        <p type="p">23:導緣凹部</p>
        <p type="p">24:間距</p>
        <p type="p">3:固定元件</p>
        <p type="p">31:抵制段</p>
        <p type="p">32:彈性段</p>
        <p type="p">33:跨置段</p>
        <p type="p">34:間隙</p>
        <p type="p">35:頸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="252" publication-number="202631458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塑膠棧板組成</chinese-title>
        <english-title>PLASTIC PALLET COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250609B">B65D19/38</main-classification>
        <further-classification edition="200601120250609B">B65D19/32</further-classification>
        <further-classification edition="200601120250609B">B65D19/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塑膠棧板組成，是包含：複數道的面板、一支架、至少二相應或以上的底座、複數道的固定元件所構成，該面板在相應銜接範圍是形成多道的通孔，以允許前述固定元件的引入；另、位於面板反面則設數道扣設段，以利支架之跨置段的引入並受限；且、該支架相應底座的一側各延伸出一截限制段(在此以兩側作為實施方式)；該每一底座在相應銜接範圍是形成多道的通孔，以允許貫穿入前述面板的固定元件一端可被引入並受限，在沿著底座的一側是凹入一容納空間、及在該容納空間延伸出數道的扣設段，以利前述支架一端的限制段引入並受限；該固定元件一端是突伸出至少二抵制段以對應引入前述面板及底座的通孔，及沿著固定元件另端是形成至少二彈性段、以利在通過前述底座的通孔後可受到相應周邊突伸出的每一阻擋段形成方位限制；使快速組成一棧板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plastic pallet consists of: a plurality of panels, a bracket, at least two corresponding or more bases, and a plurality of fixing elements. The panel forms multiple through holes in the corresponding connection range to allow The aforementioned fixing elements are introduced; in addition, several buckle sections are provided on the reverse side of the panel to facilitate the introduction and restriction of the straddling sections of the bracket; and a restriction section extends from one side of the corresponding base of the bracket (in This uses both sides as an embodiment); each base is formed with multiple through holes in the corresponding connection range to allow one end of the fixing element that penetrates the aforementioned panel to be introduced and restricted, and one side along the base is An accommodating space is recessed, and several fastening sections extend from the accommodating space to facilitate the introduction and restriction of the restriction section at one end of the bracket; one end of the fixing element protrudes at least two resistance sections to correspondingly introduce the aforementioned panel and the through hole of the base, and at least two elastic segments are formed along the other end of the fixing element, so that after passing through the through hole of the base, each blocking segment can be constrained by the corresponding peripheral protrusion to form an azimuth limit; so as to quickly form a Pallets.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:面板</p>
        <p type="p">11、31:通孔</p>
        <p type="p">2:支架</p>
        <p type="p">21:限制段</p>
        <p type="p">22:跨置段</p>
        <p type="p">3:底座</p>
        <p type="p">32:容納空間</p>
        <p type="p">4:固定元件</p>
        <p type="p">5:棧板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="253" publication-number="202631097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防漏輔助褲</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">A61F13/49</main-classification>
        <further-classification edition="200601120250228B">A61F13/491</further-classification>
        <further-classification edition="200601120250228B">A61F13/496</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防漏輔助褲，包含一褲體、一吸水片及一容室。該褲體用於穿著於人體上，並包括一位於底部的底襠部。該吸水片設置於該底襠部上方，並包括一用於吸收液體的吸收部，及一位於該吸收部周緣且局部結合在該底襠部上的外圍部。該容室由該底襠部與該吸水片所界定出。該容室包括至少一形成在該底襠部與該外圍部之間的開口。該褲體藉由該至少一開口，可防止液體從該吸水片與該底襠部結合的部分洩漏出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:褲體</p>
        <p type="p">11:前側部</p>
        <p type="p">12:後側部</p>
        <p type="p">13:底襠部</p>
        <p type="p">14:腰圍繞部</p>
        <p type="p">15:腿圍繞部</p>
        <p type="p">2:吸水片</p>
        <p type="p">21:吸收部</p>
        <p type="p">211:親膚層</p>
        <p type="p">22:外圍部</p>
        <p type="p">221:縱向外圍段</p>
        <p type="p">222:橫向外圍段</p>
        <p type="p">3:容室</p>
        <p type="p">31:開口</p>
        <p type="p">4:墊體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="254" publication-number="202631093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>術後胸型輔具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">A61F5/03</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種術後胸型輔具包含一穿著單元及二支撐單元。該穿著單元包括二穿著於人體前側且用於包覆胸部的罩部，每一該罩部具有一罩部容室。每一該支撐單元包括一位於各別的該罩部下方且用於支撐該罩部的支撐片。藉由該等支撐單元的支撐設計，達到防止該等罩部下垂的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:穿著單元</p>
        <p type="p">11:罩部</p>
        <p type="p">111:罩部容室</p>
        <p type="p">12:前連接部</p>
        <p type="p">13:土台部</p>
        <p type="p">14:背帶部</p>
        <p type="p">15:肩帶部</p>
        <p type="p">151:肩帶連接扣</p>
        <p type="p">16:下緣收縮部</p>
        <p type="p">17:提拉帶部</p>
        <p type="p">2:支撐單元</p>
        <p type="p">21:支撐片</p>
        <p type="p">22:側支撐片</p>
        <p type="p">3:墊體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="255" publication-number="202633498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其基板結構</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈宗龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, TSUNG LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電子封裝件及其基板結構，其中，該基板結構包含有基板本體及表層線路，該基板本體具有相對之第一側與第二側，該第一側定義有一置晶區及一鄰接該置晶區之外圍區，相對地，該第二側定義有一投影置晶區及一鄰接該投影置晶區之投影外圍區，該投影外圍區中對應該投影置晶區之角落復定義有應力集中區，且於該應力集中區進一步界定有應力延伸線，以令形成於該基板本體之第二側上的該表層線路之佈設方向未與該應力延伸線重疊，避免該表層線路發生破損問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an electronic package and its substrate structure, wherein the substrate structure includes a substrate body and a surface circuit. The substrate body has a first side and a second side opposite to each other. The first side defines a die placement area and a peripheral area adjacent to the die placement area, the second side defines a projected die placement area and a projection peripheral area adjacent to the projected die placement area, the corner of the projected die placement area corresponding to the projected die placement area is defined with stress concentration area, and a stress extension line is further defined in the stress concentration area, so that the layout direction of the surface circuit formed on the second side of the substrate body does not overlap with the stress extension line, so as to avoid damage to the surface circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:基板結構</p>
        <p type="p">20:基板本體</p>
        <p type="p">20b:第二側</p>
        <p type="p">21:表層線路</p>
        <p type="p">211:電性連接墊</p>
        <p type="p">212:導電跡線</p>
        <p type="p">A’:投影置晶區</p>
        <p type="p">C:應力集中區</p>
        <p type="p">L:應力延伸線</p>
        <p type="p">X,Y:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="256" publication-number="202631479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗膜轉印具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">B65H35/07</main-classification>
        <further-classification edition="200601120250310B">B65H37/04</further-classification>
        <further-classification edition="200601120250310B">B43L19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台生企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴世丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種塗膜轉印具，其具有一轉印組件、一殼體以及一彎折段。轉印組件用以轉印塗膜。殼體具有一第一包覆件。轉印組件設置於第一包覆件中，且具有一第一端以及一第二端。轉印組件能突出於第一包覆件的第一端，第二端為第一包覆件相對於第一端的另一端。彎折段可彎折地連接於第一包覆件的第二端，且能使彎折段相對於第一包覆件的第一端彎折。使用者能在不移動前臂拉動塗膜轉印具的情形下，藉由彎折段相對於第一包覆件的第一端彎折，提高塗膜轉印具的移動距離，並減少使用者的使用疲勞且較易操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:轉印組件</p>
        <p type="p">20:殼體</p>
        <p type="p">21:第一包覆件</p>
        <p type="p">22:第二包覆件</p>
        <p type="p">30:彎折段</p>
        <p type="p">40:片體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="257" publication-number="202631171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102558</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>TSYI-PA102用於改善退化性關節炎之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">A61K36/068</main-classification>
        <further-classification edition="200601120250206B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎赫生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYI BIOTECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連秀屘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, HSIU-MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種北蟲草(        &lt;i&gt;Cordyceps militaris&lt;/i&gt;)菌株TSYI-PA102用於改善退化性關節炎的用途，該北蟲草TSYI-PA102的寄存編號為BCRC 930232；通過施用北蟲草TSYI-PA102可以改善退化性關節炎。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="258" publication-number="202632203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可增加熱接觸面積的散熱模組及其散熱鰭片與製作方法</chinese-title>
        <english-title>MODULE WITH ENLARGED THERMAL CONTACT AREA, HEAT DISSIPATION FIN AND HEAT DISSIPATION FIN MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">F28F3/02</main-classification>
        <further-classification edition="200601120250502B">B23P15/26</further-classification>
        <further-classification edition="200601120250502B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智惠創富股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JWS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖邦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PANG HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪仕明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種可增加熱接觸面積的散熱模組及其散熱鰭片與製作方法，用於焊料，此散熱模組包括散熱鰭片組及熱管，散熱鰭片組包含間隔並列的複數散熱鰭片，每一散熱鰭片具有片狀本體，每一片狀本體在其正面設有貫穿孔及連通貫穿孔的一或複數盲孔，每一盲孔內部具有連續封閉底壁、一體成型在連續封閉底壁內周緣的半環形周壁及形成在半環形周壁一側且連通該貫穿孔的連通口；熱管穿接於各貫穿孔；其中，焊料能夠放置於各盲孔且經由各連通口填設在熱管與各貫穿孔的內周緣之間。藉此，以達到本發明散熱模組及散熱鰭片具有熱傳導優異之特點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is directed to a heat dissipation module with enlarged thermal contact area, a heat dissipation fin thereof and a manufacturing method thereof which are applied to solder. The heat dissipation module has a heat dissipation fin group and heat pipes. The heat dissipation fin group has multiple heat dissipation fins arranged in parallel and at intervals, each heat dissipation fin has a plate body, and each plate body has a through hole and one or more blind holes connected to the through hole defined on a front side thereof. Each blind hole is provided with a continuously closed bottom wall, a semi-circular wall integrally formed on an inner edge of the continuously closed bottom wall and a communication opening defined on one side of the semi-circular wall and connected to the through hole. The heat pipes are respectively inserted in the through holes. In each blind hole is disposed with a solder, and the solder is filled into a space between the heat pipe and the inner edge of the through hole via the communication opening. Accordingly, an excellent heat conduction is performed by the heat dissipation module and the heat dissipation fins of this disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:焊料</p>
        <p type="p">10:散熱模組</p>
        <p type="p">1:散熱鰭片組</p>
        <p type="p">11:散熱鰭片</p>
        <p type="p">12:片狀本體</p>
        <p type="p">121:貫穿孔</p>
        <p type="p">13:盲孔</p>
        <p type="p">131:連續封閉底壁</p>
        <p type="p">132:半環形周壁</p>
        <p type="p">133:連通口</p>
        <p type="p">14:第一盲孔</p>
        <p type="p">15:第二盲孔</p>
        <p type="p">2:熱管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="259" publication-number="202632148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇防洩壓結構</chinese-title>
        <english-title>ANTI-PRESSURE-RELIEF STRUCTURE FOR FAN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">F04D29/32</main-classification>
        <further-classification edition="200601120250502B">F04D29/52</further-classification>
        <further-classification edition="200601120250502B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇鋐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林顯洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜緻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周初憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇防洩壓結構，係包含：一風扇轉子、一風扇框；該風扇轉子具有一輪轂並垂設一軸心，該輪轂延伸複數扇葉，並該等扇葉末端連接一外環體；該風扇框內垂設一軸筒，該風扇轉子透過該軸心與該軸筒樞設，該風扇轉子之外環體與該風扇框內部係間隔設置，並在兩者相對應的表面以非平面設置有對應凹凸交錯結構以構形成一防洩壓區，當氣流流經該防洩壓區時會產生渦流造成流動阻礙，進而達到防洩壓之效果者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:風扇防洩壓結構</p>
        <p type="p">21:風扇轉子</p>
        <p type="p">22:風扇框</p>
        <p type="p">211:輪轂</p>
        <p type="p">212:軸心</p>
        <p type="p">213:磁性元件</p>
        <p type="p">214:扇葉</p>
        <p type="p">215:外環體</p>
        <p type="p">221:入風側</p>
        <p type="p">222:出風側</p>
        <p type="p">223:通道</p>
        <p type="p">224:軸筒</p>
        <p type="p">225:連接體</p>
        <p type="p">226:定子組</p>
        <p type="p">227:軸承</p>
        <p type="p">228:間隙流道</p>
        <p type="p">220:防洩壓區</p>
        <p type="p">220A:凹部</p>
        <p type="p">220B:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="260" publication-number="202631650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>昆蟲胜肽蛋白質製造方法及其產物的用途</chinese-title>
        <english-title>METHOD FOR MANUFACTURING INSECT PEPTIDE PROTEIN AND USE OF THE PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C07K14/00</main-classification>
        <further-classification edition="200601120250801B">C07K14/435</further-classification>
        <further-classification edition="200601120250801B">C07K1/14</further-classification>
        <further-classification edition="202001120250801B">A01N63/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孟昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孟昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種昆蟲胜肽蛋白質製造方法，包含：冷凍步驟，係將昆蟲幼蟲進行冷凍而使其失去活性；研磨步驟，係將冷凍後的昆蟲幼蟲與純水以進行混合，研磨成蟲漿；酶解步驟：係將蟲漿加入蛋白酶混合後進行酶解而獲得水解度為70%至80%的昆蟲胜肽蛋白質；過濾步驟，係將酶解後的蟲漿除去雜質以及蟲漿中之油脂；失活步驟，係將酶解後的蟲漿加熱使蟲漿中的蛋白酶失活。昆蟲胜肽蛋白質具有高營養利用率，酶解後的昆蟲胜肽蛋白質富含胺基酸和小分子蛋白質，容易被動物及植物吸收，可以應用於多種產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:冷凍步驟</p>
        <p type="p">S2:研磨步驟</p>
        <p type="p">S3:酶解步驟</p>
        <p type="p">S4:過濾步驟</p>
        <p type="p">S5:失活步驟</p>
        <p type="p">S6:蒸發步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="261" publication-number="202631056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>椅背升降結構</chinese-title>
        <english-title>CHAIR BACKREST HEIGHT ADJUSTMENT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">A47C7/40</main-classification>
        <further-classification edition="200601120250502B">A47C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宣禹實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMFORDY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳玉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種椅背升降結構，係主要於椅背的後面設有一定位座，另於椅背支架的前面組設有一導引板，以與該定位座所設軌道滑動銜接，又於該椅背支架與導引板間所形成夾層空間中設有一連動件及一驅動件，藉此，當欲調整椅背高度時，係施力按掣該驅動件之按壓部，以驅使連動件上端往前位移，另使連動件下端所設定位塊往後位移，而使定位塊所設卡榫脫離對椅背後面所設定位座之卡孔的卡掣狀態，當將椅背調整至所需高度後，係釋放對驅動件其按壓部的按掣，以使定位塊所設卡榫與椅背後面定位座之卡孔重新卡掣定位，據此，俾達到簡便調整椅背高度效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a chair backrest height adjustment structure, primarily featuring a positioning seat located on the back of the backrest and a guide plate installed on a front of a backrest frame, which is slidably engaged with a track on the positioning seat. Additionally, an interlocking component and a driving component are placed within an interlayer space formed between the backrest frame and the guide plate. When adjusting the backrest height, a pressing portion of the driving component is pressed to move an upper end of the interlocking component forward, causing a positioning block at a lower end of the interlocking component to move backward. This action disengages a latch of the positioning block from an engagement hole on the positioning seat at the back of the backrest. After the backrest is adjusted to the desired height, releasing the pressing portion of the driving component allows the latch of the positioning block to re-engage with the engagement hole on the positioning seat, thereby achieving secure positioning. This mechanism enables a simple and convenient adjustment of the backrest height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:椅背</p>
        <p type="p">11:組立部</p>
        <p type="p">2:椅背支架</p>
        <p type="p">21:椅座組立部</p>
        <p type="p">22:鏤空孔</p>
        <p type="p">23:第四樞部</p>
        <p type="p">3:定位座</p>
        <p type="p">31:軌道</p>
        <p type="p">32:卡孔</p>
        <p type="p">33:鎖固件</p>
        <p type="p">4:導引板</p>
        <p type="p">42:組立槽</p>
        <p type="p">421:第一樞部</p>
        <p type="p">43:透孔</p>
        <p type="p">44:鎖固件</p>
        <p type="p">5:連動件</p>
        <p type="p">51:第二樞部</p>
        <p type="p">52:定位塊</p>
        <p type="p">522:卡榫</p>
        <p type="p">6:驅動件</p>
        <p type="p">61:第三樞部</p>
        <p type="p">62:按壓部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="262" publication-number="202633299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶棒加工設備及其加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260203B">H10P52/00</main-classification>
        <further-classification edition="202601120260203B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國砂輪企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINIK COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張紘睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何嘉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶棒加工設備，包括一夾持單元、一或多個第一加工裝置、一第二加工裝置及一移動機構。該夾持單元用於夾持一晶棒且使該晶棒橫向地設置。該第一加工裝置對該晶棒進行一第一加工及一第二加工，該第一加工為移除該晶棒的一周面部分，該第二加工為移除該晶棒的一外環面在一環向上的一第一部分。該第二加工裝置用於移除該晶棒的該外環面在一徑向上的一第二部分而作為一標記區域。該晶棒在進行該第一加工時，該晶棒的一軸向與該加工件相對該晶棒的一加工方向傾斜一角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶棒加工設備</p>
        <p type="p">10:架體</p>
        <p type="p">11:工作平台</p>
        <p type="p">12:側壁</p>
        <p type="p">13:工作空間</p>
        <p type="p">20:夾持單元</p>
        <p type="p">21:第一夾持頭</p>
        <p type="p">22:第二夾持頭</p>
        <p type="p">30:定位裝置</p>
        <p type="p">31:移動件</p>
        <p type="p">40:第一加工裝置</p>
        <p type="p">41:第一加工件</p>
        <p type="p">42:第二加工件</p>
        <p type="p">50:第二加工裝置</p>
        <p type="p">51:標記加工件</p>
        <p type="p">60:移動機構</p>
        <p type="p">61、61a、61b:第一移動模組</p>
        <p type="p">62:第二移動模組</p>
        <p type="p">63:第三移動模組</p>
        <p type="p">631:驅動單元</p>
        <p type="p">632:滑軌</p>
        <p type="p">70:非接觸式偵測單元</p>
        <p type="p">C:晶棒</p>
        <p type="p">C0:外環面</p>
        <p type="p">C1:第一端</p>
        <p type="p">C2:第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="263" publication-number="202631253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產氫光觸媒基板及其製造方法</chinese-title>
        <english-title>HYDROGEN-PRODUCING PHOTOCATALYST SUBSTRATE AND METHODS OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01J23/42</main-classification>
        <further-classification edition="202401120260302B">B01J35/39</further-classification>
        <further-classification edition="200601120260302B">B01J37/02</further-classification>
        <further-classification edition="200601120260302B">B01J37/08</further-classification>
        <further-classification edition="200601120260302B">B01J37/34</further-classification>
        <further-classification edition="202601120260302B">C01B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明基材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENQ MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑋皜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊　姆朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, IMRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種製造產氫光觸媒基板之方法以及以此方法所製得之產氫光觸媒基板。本揭示之製造產氫光觸媒基板之方法包括提供基板，混合多孔黏合劑和光觸媒，以形成光觸媒溶液，將光觸媒溶液塗佈於基板上以在基板上形成平板化光觸媒，製備金屬助催化劑溶液施用於平板化光觸媒上，執行光沉積處理以形成產氫光觸媒基板，純化產氫光觸媒基板。在執行光沉積處理之後，金屬助催化劑溶液中的金屬會附著在光觸媒的表面，且金屬的濃度分布自平板化光觸媒的頂表面向下減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a method of manufacturing a hydrogen-producing photocatalyst substrate and a hydrogen-producing photocatalyst substrate manufactured by the same. The method of manufacturing a hydrogen-producing photocatalyst substrate including providing a substrate, mixing a porous binding agent and a photocatalyst to form a photocatalyst solution, coating the photocatalyst solution on the substrate to form a panelized photocatalyst, preparing and applying a metal cocatalyst solution on the panelized photocatalyst, performing a photodeposition treatment to form a hydrogen-producing photocatalyst substrate, and purifying the hydrogen-producing photocatalyst substrate. After performing the photodeposition treatment, the metals of the metal cocatalyst solution are adhered to a surface of the photocatalyst. The concentration distribution of the metal is decreasing from a top surface downward of the panelized photocatalyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
        <p type="p">110:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="264" publication-number="202632162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無段變速驅動器之結構裝置改良</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">F16H35/02</main-classification>
        <further-classification edition="200601120250414B">F16B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無段變速驅動器之結構裝置改良，主要係包含一固定盤、一軸桿、一滑動襯套和一滑動盤所構成，其特徵在於：該固定盤中心部位具有一順向螺紋部，以及滑動盤中心部位具有一逆向螺紋部，使得該固定盤可藉由一端同樣具有相對應而可螺固之相對應螺紋部的軸桿，以及滑動盤可藉由一端同樣具有相對應而可螺固之相對應螺紋部的滑動襯套的相同配合下，當該固定盤和滑動盤結合後而由皮帶帶動而使滑動盤向外旋轉移動的同時，則該固定盤和滑動盤均會朝前轉動後，則此時固定盤因具有順向螺紋部的設計，再搭配滑動盤具有逆向螺紋部的設計，進而使固定盤和滑動盤均會朝前轉動後會分別愈轉愈緊而不會發生脫落，而增強其整體結構之穩定性者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">6:固定盤</p>
        <p type="p">601:順向螺紋部</p>
        <p type="p">7:滑動盤</p>
        <p type="p">701:逆向螺紋部</p>
        <p type="p">8:軸桿</p>
        <p type="p">801:相對應螺紋部</p>
        <p type="p">802:螺紋部</p>
        <p type="p">803:定位孔部</p>
        <p type="p">9:滑動襯套</p>
        <p type="p">901:相對應螺紋部</p>
        <p type="p">902:滑動導引槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="265" publication-number="202631300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工裝置及其模組化的智慧刀把</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">B23Q3/12</main-classification>
        <further-classification edition="200601120250422B">B23Q17/09</further-classification>
        <further-classification edition="200601120250422B">B23Q17/00</further-classification>
        <further-classification edition="200601120250422B">B23Q3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JENQ-SHYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利柏正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO-JHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯全武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHUAN-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王浩唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAO-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加工裝置，適用於連接一刀具，包含一主軸單元，及一連接於該主軸單元的智慧刀把。該智慧刀把包括一界定一腔室的刀把單元、一可卸離地穿置在該腔室的感測單元，及一可脫離地被限位在該刀把單元的功能單元。該感測單元具有二相互對合的固定座，及一被定位在該等固定座間的感測模組。該功能單元具有二相互對合且界定一安裝空間的限位座，及一穿置在該安裝空間且電連接於該感測模組的電控模組。藉此，通過該感測單元、該功能單元模組化的設計，不但能夠簡化拆、裝步驟、縮短拆、裝時間，且能夠提升定位的準確性，及易於維護、替換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:刀具</p>
        <p type="p">3:主軸單元</p>
        <p type="p">31:軸座</p>
        <p type="p">32:轉軸</p>
        <p type="p">321:第一孔道</p>
        <p type="p">4:刀把單元</p>
        <p type="p">40:腔室</p>
        <p type="p">41:刀柄</p>
        <p type="p">411:第二孔道</p>
        <p type="p">42:刀桿</p>
        <p type="p">425:傳輸通道</p>
        <p type="p">5:感測單元</p>
        <p type="p">51:固定座</p>
        <p type="p">513:安裝通道</p>
        <p type="p">53:感測傳輸線</p>
        <p type="p">6:功能單元</p>
        <p type="p">601:安裝空間</p>
        <p type="p">61:限位座</p>
        <p type="p">62:電控模組</p>
        <p type="p">7:通訊單元</p>
        <p type="p">71:無線通訊模組</p>
        <p type="p">72:電控傳輸線</p>
        <p type="p">8:電能傳輸單元</p>
        <p type="p">81:第一傳輸模組</p>
        <p type="p">82:第二傳輸模組</p>
        <p type="p">83:第三傳輸模組</p>
        <p type="p">831:第一導電接點</p>
        <p type="p">832:第一電接線</p>
        <p type="p">833:第二導電接點</p>
        <p type="p">834:第二電接線</p>
        <p type="p">X:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="266" publication-number="202631003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靈芝咖啡豆製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING GANODERMA COFFEE BEANS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250328B">A01G18/20</main-classification>
        <further-classification edition="201801120250328B">A01G18/64</further-classification>
        <further-classification edition="200601120250328B">A01G31/02</further-classification>
        <further-classification edition="200601120250328B">A23F5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHINN YEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁唯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHINN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉惇娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TUN CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓬努薩米　庫碼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONNUSAMY, VINOTH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭竣亦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHI YIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰嘉　欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEGANATHAN, CHINNADURAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁宇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, YU HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHINN YEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳沁唯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHINN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉睿勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種靈芝咖啡豆製造方法，係主要於培養容器內容置有咖啡豆、靈芝孢子及培養基材，並定時定量注水培養，以於培養基材與咖啡豆上生長有靈芝菌絲體，再將該生長有靈芝菌絲體的咖啡豆乾燥後，以獲得靈芝咖啡豆，藉此，當消費者購買時，係可觀看到靈芝咖啡豆上之靈芝菌絲體及其咖啡豆的狀態，而從外觀直接辨識其咖啡豆及靈芝成分的新鮮度與品質，以提高食用衛生安全性，又由於本發明係以咖啡豆型態保存，故可大幅延長保存時間，避免受潮變質損壞情形，另可供消費者自行烘焙研磨，以達到更提高靈芝咖啡飲用美味效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a method for producing Ganoderma coffee beans. The process primarily involves placing coffee beans, Ganoderma spores, and a cultivation substrate into a cultivation container, followed by periodic and measured water injection for cultivation. As a result, Ganoderma mycelium grows on both the cultivation substrate and the coffee beans. The coffee beans with the Ganoderma mycelium are then dried to produce Ganoderma coffee beans. When consumers purchase the product, they can visually observe the Ganoderma mycelium and the condition of the coffee beans, allowing them to directly assess the freshness and quality of the coffee bean and Ganoderma components from their appearance. This ensures enhanced food safety. Additionally, since the invention preserves the product in the form of coffee beans, it significantly extends shelf life and prevents moisture-induced deterioration. Consumers can roast and grind the beans themselves, further enhancing the flavor and enjoyment of Ganoderma coffee.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:培養容器</p>
        <p type="p">2:咖啡豆</p>
        <p type="p">3:靈芝孢子</p>
        <p type="p">4:培養基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="267" publication-number="202632454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能避障方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF INTELLIGENT OBSTACLE AVOIDANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250430B">G05D1/622</main-classification>
        <further-classification edition="202401120250430B">G05D1/644</further-classification>
        <further-classification edition="202401120250430B">G05D1/242</further-classification>
        <further-classification edition="202401320250430B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾正利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHENG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛聖銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIUE, SHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許芸融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能避障方法，適用於一移動載具，利用一運算裝置來執行以下步驟：獲得多筆障礙物感測資料及一載具感測資料；根據該等障礙物感測資料及該載具感測資料，獲得一障礙物判定結果；根據該障礙物判定結果，判定該等障礙物是否影響該移動載具欲行經的一全域路徑；當判定出該等障礙物影響該全域路徑時，根據該障礙物判定結果，利用一行為樹，產生一局部避障策略；根據該局部避障策略，利用一路徑規劃演算法更新該全域路徑；及根據該局部避障策略及更新後的該全域路徑，利用一運動控制算法，產生一避障移動指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a method of intelligent obstacle avoidance, which is used for a vehicle, a computing device is configured to perform the steps of: obtaining multiple sets of obstacle sensing data and a vehicle sensing data; obtaining an obstacle determination result according to the obstacle sensing data and the vehicle sensing data; determining whether the obstacles affect a global path that the vehicle intends to travel according to the obstacle determination result; using a behavior tree to generate a local obstacle avoidance strategy based on the obstacle determination result when it is determined that the obstacles affect the global path; using a path planning algorithm to update the global path according to the local obstacle avoidance strategy; and using a motion control algorithm to generate an obstacle avoidance movement instruction based on the local obstacle avoidance strategy and the updated global path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S9:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="268" publication-number="202632921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於共軛疊加軌道角動量光束與深度學習的光學相機通訊系統</chinese-title>
        <english-title>OPTICAL CAMERA COMMUNICATION SYSTEM BASED ON ORBITAL ANGULAR MOMENTUM BEAMS COMBINED WITH DEEP LEARNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04J14/00</main-classification>
        <further-classification edition="201301120250401B">H04B10/50</further-classification>
        <further-classification edition="201301120250401B">H04B10/11</further-classification>
        <further-classification edition="200601220250401B">G01J9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭旭志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓明宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宥陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂學諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XUE-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於共軛疊加軌道角動量光束與深度學習的光學相機通訊系統，包含：一發訊端機構及一收訊端機構，該發訊端機構利用拓樸荷及徑向指數進行資料編碼並產生具有對應的花形模態的拉蓋爾─高斯光束而予以發送，該收訊端機構光路連接於該發訊端機構，藉由對該拉蓋爾─高斯光束的花形模態圖像進行圖像辨識並對應解碼而取得相當於通訊用資料的解碼資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an optical camera communication system based on orbital angular momentum beams combined with deep learning, comprising: a transmitting-end device and a receiving-end device. The transmitting-end device encodes communication data using topological charges and radial indices to generate and transmit a Laguerre-Gaussian beam with a corresponding flower-shaped mode. The receiving-end device, optically connected to the transmitting-end device, performs image recognition on a flower-shaped mode pattern of the Laguerre-Gaussian beam and correspondingly decodes it to obtain decoded data equivalent to the communication data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學相機通訊系統</p>
        <p type="p">1:發訊端機構</p>
        <p type="p">10:前置編碼裝置</p>
        <p type="p">11:資料編碼裝置</p>
        <p type="p">12:空間光調製裝置</p>
        <p type="p">13:光源</p>
        <p type="p">2:收訊端機構</p>
        <p type="p">21:光學相機裝置</p>
        <p type="p">22:深度學習解調裝置</p>
        <p type="p">B:單束軌道角動量光束</p>
        <p type="p">B0:光束</p>
        <p type="p">D:通訊用資料</p>
        <p type="p">D’:解碼資料</p>
        <p type="p">D0:原始資料</p>
        <p type="p">I:花形特徵資訊</p>
        <p type="p">P:花形模態圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="269" publication-number="202632153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高度調整機構及水平調整裝置</chinese-title>
        <english-title>HEIGHT ADJUSTMENT MECHANISM AND LEVELING ADJUSTMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">F16B5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張元譯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高度調整機構及水平調整裝置。高度調整機構適用於安裝在固定板與承載板之間，用於調整固定板與承載板之間的距離。所述高度調整機構包括螺桿、墊片和固定件。螺桿的一端螺設於承載板的螺孔中，另一端往固定板延伸並具有一弧面。墊片設置在螺桿與固定板之間。墊片朝向螺桿的表面與弧面抵接形成面接觸。固定件穿過螺桿與墊片並固定於固定板上。透過本發明的高度調整機構及水平調整裝置，能夠實現精確且穩定的調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a height adjustment mechanism and a leveling adjustment device. The height adjustment mechanism is suitable to be installed between a fixed plate and a carrying plate and is used to adjust a distance between the fixed plate and the carrying plate. The height adjustment mechanism includes a screw, a gasket, and a fixing member. One end of the screw is threaded into a screw hole of the carrying plate, and the other end extends towards the fixed plate and has a curved surface. The gasket is positioned between the screw and the fixed plate, with its surface facing the screw and making contact with the curved surface. The fixing member passes through the screw and the gasket and is secured to the fixed plate. The height adjustment mechanism and leveling adjustment device of the present invention enable precise and stable adjustments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:水平調整裝置</p>
        <p type="p">21:固定板</p>
        <p type="p">22:承載板</p>
        <p type="p">23:高度調整機構</p>
        <p type="p">24:夾緊機構</p>
        <p type="p">A-A:剖切線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="270" publication-number="202632214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校正治具、水平校正裝置及水平校正方法</chinese-title>
        <english-title>CALIBRATION JIG, LEVELING CALIBRATION DEVICE, AND LEVELING ADJUSTMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250519B">G01B5/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張元譯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種校正治具、水平校正裝置及水平校正方法。校正治具適用於安裝在水平校正裝置上。所述校正治具包括基準平台、複數個延長桿以及複數個深度規。基準平台具有複數個穿過其頂面的穿孔。延長桿的數量對應穿孔數量，每個延長桿可移動地穿設在對應的穿孔中，並延伸超出基準平台底面。深度規的數量及位置對應穿孔數量及位置，每個深度規具有探針，且每個探針與對應的延長桿頂面抵接。透過本發明的水平校正方法與裝置，能夠實現快速且精準的平行校正或水平校正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a calibration jig, a leveling calibration device, and a leveling adjustment method. The calibration jig is suitable to be mounted on the leveling calibration device. The calibration jig includes a reference platform, plural extension rods, and plural depth gauges. The reference platform has plural through-holes on its top surface, with the number of extension rods corresponding to the number of through-holes. Each extension rod is movably inserted into a corresponding through-hole, extending below a bottom surface of the reference platform. The number and positions of the depth gauges correspond to the number and positions of the through-holes. Each depth gauge includes a probe, and each probe makes contact with a top surface of the corresponding extension rod. The leveling calibration method and device of the present invention enable fast and precise parallel calibration or leveling calibration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:校正治具</p>
        <p type="p">41:基準平台</p>
        <p type="p">41b:凹陷結構</p>
        <p type="p">42:延長桿</p>
        <p type="p">43:深度規</p>
        <p type="p">B-B:剖切線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="271" publication-number="202631462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塑膠袋捲及塑膠袋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">B65D33/06</main-classification>
        <further-classification edition="200601120250210B">B65D33/16</further-classification>
        <further-classification edition="200601120250210B">B65D30/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟瑞國際企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭家瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塑膠袋捲及塑膠袋，該塑膠袋包含袋體單元、兩個綁帶，及兩個第一直封段。該袋體單元包括兩個撕斷線。該袋體包括兩個分別供該等綁帶容納的袋口部。每一袋口部包括兩個端段。每一該撕斷線鄰近於其中一端段，且可被操作而將對應之該袋口部撕離成束封部位與具有該其中一端段的提取部位。每一第一直封段將每一該袋口部之對應側的該端段與每一綁帶之對應側的該端部固定在一起。透過上述設計，能避免先前技術之該等左端部滑落而需要二次提取的情形，也能避免每一左端部縮入該袋口部而需要設法推出該缺口的情形，有助於提高使用的順暢度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:塑膠袋</p>
        <p type="p">4:袋體單元</p>
        <p type="p">401:袋口</p>
        <p type="p">41:袋體</p>
        <p type="p">42:撕斷線</p>
        <p type="p">43:橫封合線</p>
        <p type="p">45:袋主體部</p>
        <p type="p">451:主體部位</p>
        <p type="p">46:袋口部</p>
        <p type="p">463:端段</p>
        <p type="p">466:提取部位</p>
        <p type="p">467:束封部位</p>
        <p type="p">5:綁帶</p>
        <p type="p">51:端部</p>
        <p type="p">6:直封合線</p>
        <p type="p">61:第一直封段</p>
        <p type="p">62:第二直封段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="272" publication-number="202633039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">H05K3/46</main-classification>
        <further-classification edition="200601120250430B">H05K3/40</further-classification>
        <further-classification edition="200601120250430B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪佳慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板組件包含電路板、設置於電路板中的電子部件堆疊結構、第一及第二導電柱。電路板包含第一連接線路層及設置於第一連接線路層上的第二連接線路層。電子部件堆疊結構具有側壁並包含第一電子部件及設置於第一電子部件上的第二電子部件。第一及第二導電柱設置於側壁上並朝遠離側壁的第一方向延伸，第一導電柱電連接第一電子部件及第一連接線路層，第二導電柱位於第一導電柱上並電連接第二電子部件及第二連接線路層。於第一方向上，第一連接線路層與側壁的距離小於第二連接線路層與側壁的距離，第一導電柱的長度小於第二導電柱的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly includes a circuit board, an electronic component stack structure disposed in the circuit board, a first conductive pillar and a second conductive pillar. The circuit board includes a first connection wiring layer and a second connection wiring layer disposed on the first connection wiring layer. The electronic component stack structure has a sidewall and includes a first electronic component and a second electronic component disposed on the first electronic component. The first conductive pillar and the second conductive pillar are disposed on the sidewall and extend in a first direction away from the sidewall. The first conductive pillar is electrically connected to the first electronic component and the first connection wiring layer. The second conductive pillar is located on the first conductive pillar and is electrically connected to the second electronic component and the second connection wiring layer. In the first direction, the distance between the first connection wiring layer and the sidewall is smaller than the distance between the second connection wiring layer and the sidewall, and the length of the first conductive pillar is shorter than the length of the second conductive pillar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電路板組件</p>
        <p type="p">100:電路板</p>
        <p type="p">102、102’:第一連接線路層</p>
        <p type="p">104、104’:第二連接線路層</p>
        <p type="p">200:電子部件堆疊結構</p>
        <p type="p">202:第一電子部件</p>
        <p type="p">204:第二電子部件</p>
        <p type="p">206:第三電子部件</p>
        <p type="p">300、300’:第一導電柱</p>
        <p type="p">400、400’:第二導電柱</p>
        <p type="p">500、500’:增層結構</p>
        <p type="p">CV:導電通孔</p>
        <p type="p">d:間距</p>
        <p type="p">D1、D1’:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">L1、L2:長度</p>
        <p type="p">M1、M2:直徑</p>
        <p type="p">P1、P1’:第一接墊</p>
        <p type="p">P2、P2’:第二接墊</p>
        <p type="p">P3:第三接墊</p>
        <p type="p">R1、R2:距離</p>
        <p type="p">SW、SW’:側壁</p>
        <p type="p">US:上表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="273" publication-number="202631341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具盒堆疊構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">B25H3/02</main-classification>
        <further-classification edition="200601120250502B">B65D21/028</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱偉鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱偉鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作至少包括：一基底盒、疊置於該基盒處的中層盒或擴充盒、疊置於該中層盒處的頂蓋、以及分別組設於該基底盒處和該頂蓋處的長度調整扣組；該基底盒包括有容凹區、定位基部、以及固定部；該中層盒包括有容凹區、定位基部、以及固接部；該頂蓋包括有固接部、扣接部、以及握把；該擴充盒包括有空間區、定位基部、以及固接部；該長度調整扣組包括一組設於該基底盒之固定部處的定位件、組合於該定位件處的撓性帶、以及能於該撓性帶滑動限位用的扣具組；該扣具組包括有基扣座、一軸桿、一按壓件、以及彈簧；藉由上述構造，利用該長度調整扣組之定位件及該扣具組分別組設於該基底盒之固定部處及該頂蓋之扣接部處，而能確實將一個或一個以上的該中層盒或擴充盒夾置於該基底盒至該頂蓋之間，以致使複數個堆疊後的安裝固定或拆卸是具有快速便利性之操作，同時，亦能改進習用堆疊工具盒所需的扣具總數量是堆疊工具盒數量的雙倍，以大大地降低堆疊時所需扣具的總數量及成本者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:基底盒</p>
        <p type="p">10:容凹區</p>
        <p type="p">11:定位基部</p>
        <p type="p">12:固定部</p>
        <p type="p">121:凸塊</p>
        <p type="p">2:中層盒</p>
        <p type="p">20:容凹區</p>
        <p type="p">21:定位基部</p>
        <p type="p">23:固接部</p>
        <p type="p">24:扣接部</p>
        <p type="p">3:頂蓋</p>
        <p type="p">34:扣接部</p>
        <p type="p">35:握把</p>
        <p type="p">4:定位件</p>
        <p type="p">5:撓性帶</p>
        <p type="p">50:拉把部</p>
        <p type="p">6:扣具組</p>
        <p type="p">60:基扣座</p>
        <p type="p">601:鏤空區</p>
        <p type="p">602:卡扣部</p>
        <p type="p">603:抵止部</p>
        <p type="p">61:軸桿</p>
        <p type="p">62:按壓件</p>
        <p type="p">620:按壓部</p>
        <p type="p">70:魔術帶</p>
        <p type="p">71:魔術帶</p>
        <p type="p">A:長度調整扣組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="274" publication-number="202633421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有導接疊孔的基板及其製造方法</chinese-title>
        <english-title>SUBSTRATE HAVING STACK VIA AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頎邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPBOND TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, LUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUNG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俊廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有導接疊孔的基板，其包含一第一介電層、一第一導接層、一第一導電材、一第二介電層、一第二導接層及一第二導電材，藉由形成於該第一介電層中的該第一導接層、該第一導電材及形成於該第二介電層中的該第二導接層及該第二導電材構成一導接疊孔，其可在製造過程中避免形成該第一介電層及該第二介電層的介電材料殘留在該導接疊孔中，以避免該第二導接層無法電性連接該第一導電材，且使該第一導電材與該第一導接層的接觸面積、該第二導接層及該第二導電材的接觸面積可符合電性傳輸的規格要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate having stack via includes a first dielectric layer, a first conductive layer, a first conductive material, a second dielectric layer, a second conductive layer and a second conductive material. The first conductive layer and the first conductive material formed in the first dielectric layer, and the second conductive layer and the second conductive material formed in the second dielectric layer are formed of a stack via. Dielectric material used to form the first and second dielectric layers will not remain in the stack via during manufacturing. Thus, the second conductive layer can be electrically connected to the first conductive material, the contact area between the first conductive layer and the first conductive material and the contact area between the second conductive layer and the second conductive material can satisfy specification requirements for electrical transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">110:導接層</p>
        <p type="p">120:線路層</p>
        <p type="p">130:第一介電層</p>
        <p type="p">140:第一導接層</p>
        <p type="p">150:第一導電材</p>
        <p type="p">160:第二介電層</p>
        <p type="p">170:第二導接層</p>
        <p type="p">180:第二導電材</p>
        <p type="p">SV:導接疊孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="275" publication-number="202631481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動脫勾吊裝設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">B66C1/12</main-classification>
        <further-classification edition="200601120250324B">B66C1/14</further-classification>
        <further-classification edition="200601120250324B">B66C1/22</further-classification>
        <further-classification edition="200601120250324B">B66C1/34</further-classification>
        <further-classification edition="200601120250324B">B66C1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義力營造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EARTH POWER CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉進輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范綱政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坤旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係指一種自動脫勾吊裝設備，其包含有一吊鉤、一吊鏈及一拉索，該吊鉤具有一鉤體及一止擋扣板，且該鉤體具有一鉤嘴，再者該止擋扣板係樞設於該鉤體上可選擇性封閉該鉤嘴，又該止擋扣板於異於鉤嘴一側設有一包覆該下方勾狀部件外側之拉引導板，藉此，能讓作業人員於上方透過拉動該拉引導板來同步帶動該止擋扣板，以開啟位於下方吊鉤之鉤嘴，並進一步使得該吊鉤可以自動鬆開吊掛物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吊鉤</p>
        <p type="p">11:鉤體</p>
        <p type="p">12:上方連接部件</p>
        <p type="p">13:下方勾狀部件</p>
        <p type="p">24:勾掛空間</p>
        <p type="p">25:鉤嘴</p>
        <p type="p">26:耦接件</p>
        <p type="p">20:止擋扣板</p>
        <p type="p">21:樞軸</p>
        <p type="p">22:彈力儲存件</p>
        <p type="p">23:拉引導板</p>
        <p type="p">24:伸片</p>
        <p type="p">25:掛孔凸耳</p>
        <p type="p">30:吊鏈</p>
        <p type="p">31:掛接件</p>
        <p type="p">32:掛環體</p>
        <p type="p">35:導索片</p>
        <p type="p">36:掛耳</p>
        <p type="p">40:拉索</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="276" publication-number="202632780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬背腔式天線裝置</chinese-title>
        <english-title>METAL BACK-CAVITY ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H01Q1/36</main-classification>
        <further-classification edition="200601120250401B">H01Q13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏暘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MIN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種金屬背腔式天線裝置，其係設置於一金屬殼體上，此金屬背腔式天線裝置包含一下地金屬板、一金屬輻射蓋板、一金屬連接側板以及一天線模組。在金屬背腔式天線裝置中，下地金屬板設置於金屬殼體上且接觸金屬殼體。金屬輻射蓋板位於下地金屬板上方，且金屬輻射蓋板上開設有一槽孔。金屬連接側板連接下地金屬板之一長側邊及金屬輻射蓋板同側之一第一長側邊，使下地金屬板、金屬連接側板及金屬輻射蓋板共同形成一金屬腔體。天線模組位於金屬腔體內，且安裝在金屬輻射蓋板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a metal back-cavity antenna device, which is installed on a metal case. The metal back-cavity antenna device includes a ground metal plate, a metal radiation cover, a metal connecting side plate and an antenna module. In the metal cavity-backed antenna device, the ground metal plate is disposed on the metal case and contacts the metal case. The metal radiation cover is located above the ground metal plate, and a slot is provided on the metal radiation cover. The metal connecting side plate connects one long side of the ground metal plate and a first long side on the same side of the metal radiation cover, so that the ground metal plate, the metal connecting side plate and the metal radiation cover jointly form a metal cavity. The antenna module is located in the metal cavity and installed on the metal radiation cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:金屬背腔式天線裝置</p>
        <p type="p">12:金屬殼體</p>
        <p type="p">14:下地金屬板</p>
        <p type="p">16:金屬輻射蓋板</p>
        <p type="p">161:槽孔</p>
        <p type="p">162:第一長側邊</p>
        <p type="p">163:第二長側邊</p>
        <p type="p">164:第一短側邊</p>
        <p type="p">165:第二短側邊</p>
        <p type="p">18:金屬連接側板</p>
        <p type="p">20:第一金屬側翼</p>
        <p type="p">22:第二金屬側翼</p>
        <p type="p">24:天線模組</p>
        <p type="p">26:金屬腔體</p>
        <p type="p">28:第一鎖固元件</p>
        <p type="p">30:第二鎖固元件</p>
        <p type="p">42:下地金屬片</p>
        <p type="p">44:傳輸線</p>
        <p type="p">46:支撐部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="277" publication-number="202631275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板的分離回收方法</chinese-title>
        <english-title>METHOD FOR SEPARATION AND RECYCLING OF SOLAR PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250219B">B09B3/30</main-classification>
        <further-classification edition="202201120250219B">B09B3/35</further-classification>
        <further-classification edition="202201320250219B">B09B101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東海大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNGHAI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏玉麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種太陽能板的分離回收方法，包含提供太陽能板、進行破碎步驟、進行第一篩分步驟、進行碎化步驟以及進行第二篩分步驟，即可將太陽能板分離為粗粒第一產物、第一產物和第二產物，其中粗粒第一產物和第一產物的主要成分為玻璃，第二產物的主要成分為金屬和塑膠。藉此，可以僅藉由物理的分離方式達到分離回收太陽能板中複合材質的功效，以進行再利用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for separation and recycling of solar panel includes steps providing a solar panel, performing a crushing step, performing a first screening step, performing a fragmenting step, and performing a second screening step, so that the solar panel can be separated into a coarse first product, a first product and a second product. The main component of the coarse first product and the first product is glass, and the main component of the second product includes metal and plastic. Therefore, the composite materials in the solar panel can be separated and recycled for reuse only through physical separation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:太陽能板的分離回收方法</p>
        <p type="p">110,120,130,140,150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="278" publication-number="202632412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像裝置</chinese-title>
        <english-title>CAMERA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250609B">G03B17/12</main-classification>
        <further-classification edition="202101120250609B">G03B17/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡禮行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張津愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JIN-KAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝像裝置包括電路板、固定膠層、間隔件及鏡頭模組。電路板具有組裝面與感光元件，固定膠層設置於電路板之組裝面，且固定膠層與感光元件彼此間隔設置。間隔件接著於固定膠層上。鏡頭模組可拆卸地組接於間隔件，使鏡頭模組不接觸固定膠層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera device includes a circuit board, a fixed adhesive layer, a spacer and a lens module. The circuit board has an assembly surface and a photosensitive element. The fixed adhesive layer is disposed on the assembly surface of the circuit board, and the fixed adhesive layer and the photosensitive element are disposed at intervals from each other. The spacer is adhered to the fixed adhesive layer. The lens module is detachably assembled on the spacer so that the lens module does not contact the fixed adhesive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:攝像裝置</p>
        <p type="p">10:電路板</p>
        <p type="p">11:組裝面</p>
        <p type="p">12:固定膠層</p>
        <p type="p">15:感光元件</p>
        <p type="p">16:鏤空部</p>
        <p type="p">20:間隔件</p>
        <p type="p">201:中央通孔</p>
        <p type="p">21:第一表面</p>
        <p type="p">22:第二表面</p>
        <p type="p">23:內凹槽</p>
        <p type="p">24:導光斜面</p>
        <p type="p">25:第一組裝部</p>
        <p type="p">27:環狀凹槽</p>
        <p type="p">30:鏡頭模組</p>
        <p type="p">31:第二組裝部</p>
        <p type="p">40:密封環圈</p>
        <p type="p">41:環狀本體</p>
        <p type="p">45:彈性圈</p>
        <p type="p">50:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="279" publication-number="202632409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像裝置</chinese-title>
        <english-title>CAMERA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250609B">G03B17/02</main-classification>
        <further-classification edition="202101120250609B">G03B17/26</further-classification>
        <further-classification edition="202101120250609B">G02B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康維訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WEI-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝像裝置包括電路板、間隔件、鏡頭模組及密封環圈。電路板具有組裝面與感光元件。間隔件設置於組裝面上。鏡頭模組設置於間隔件上。密封環圈包括環狀本體與彈性圈，環狀本體連接於間隔件，彈性圈環繞於感光元件周圍，彈性圈具有根部與端部，根部連接於環狀本體，端部接觸於組裝面，彈性圈不垂直於電路板之組裝面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera device includes a circuit board, a spacer, a lens module, and a sealing ring. The circuit board has an assembly surface and a photosensitive element. The spacer is disposed on the assembly surface. The lens module is disposed on the spacer. The sealing ring includes an annular body and an elastic ring. The annular body is connected to the spacer. The elastic ring surrounds the photosensitive element. The elastic ring has a root portion and an end portion. The root portion is connected to the annular body. The end portion contacts the assembly surface. The elastic ring is not perpendicular to the assembly surface of the circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:攝像裝置</p>
        <p type="p">10:電路板</p>
        <p type="p">11:組裝面</p>
        <p type="p">12:固定膠層</p>
        <p type="p">15:感光元件</p>
        <p type="p">16:鏤空部</p>
        <p type="p">20:間隔件</p>
        <p type="p">201:中央通孔</p>
        <p type="p">21:第一表面</p>
        <p type="p">22:第二表面</p>
        <p type="p">23:內凹槽</p>
        <p type="p">24:導光斜面</p>
        <p type="p">25:第一組裝部</p>
        <p type="p">27:環狀凹槽</p>
        <p type="p">30:鏡頭模組</p>
        <p type="p">31:第二組裝部</p>
        <p type="p">40:密封環圈</p>
        <p type="p">41:環狀本體</p>
        <p type="p">45:彈性圈</p>
        <p type="p">50:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="280" publication-number="202632705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>斷路器之電動結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">H01H33/36</main-classification>
        <further-classification edition="200601120250325B">H01H71/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>士林電機廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂世豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李叔穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇騰鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種斷路器之電動結構，包括有一操作模組及至少一斷路器，該操作模組內包含有一電路板，該電路板上裝設有一微型馬達及受該微型馬達驅動的一齒輪組，該齒輪組包含有一蝸桿、一蝸輪、一第一傳動齒輪、一第二傳動齒輪、一第一連動齒輪、一第二連動齒輪、一第一扇形齒輪、一第二扇形齒輪，其中該第二連動齒輪的其中一側設有一圓柱，該第二連動齒輪的另外一側裝設有一磁鐵，該操作模組內裝設有一跳脫推桿與該圓柱接觸，該斷路器裝設於該操作模組的其中一側，該斷路器的上端面裝設有一開關把手，該斷路器內裝設有一快投結構及一復歸桿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:操作模組</p>
        <p type="p">11:電路板</p>
        <p type="p">12:微型馬達</p>
        <p type="p">13:蝸桿</p>
        <p type="p">14:蝸輪</p>
        <p type="p">16:第一傳動齒輪</p>
        <p type="p">18:第二傳動齒輪</p>
        <p type="p">20:第一連動齒輪</p>
        <p type="p">22:第二連動齒輪</p>
        <p type="p">221:圓柱</p>
        <p type="p">24:第一扇形齒輪</p>
        <p type="p">26:第二扇形齒輪</p>
        <p type="p">28:跳脫推桿</p>
        <p type="p">32:開關把手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="281" publication-number="202632881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電流電壓轉換電路</chinese-title>
        <english-title>CURRENT-VOLTAGE CONVERTING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H03F1/34</main-classification>
        <further-classification edition="200601120250501B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王朝欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳均維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JYUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電流電壓轉換電路包含一轉阻放大器、一回授電路、一可調式電壓增益單元及一緩衝器，該轉阻放大器接收一第一輸入電壓及一第二輸入電壓並輸出一第一輸出電壓及一第二輸出電壓，該回授電路接收該第一輸出電壓及該第二輸出電壓並輸出該回授電壓至該轉阻放大器，該可調式電壓增益單元接收該第一輸出電壓及該第二輸出電壓並輸出一第一放大輸出電壓及一第二放大輸出電壓，該緩衝器該第一放大輸出電壓及該第二放大輸出電壓並輸出一第一差動輸出電壓及一第二差動輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A current-to-voltage converting circuit comprises a transimpedance amplifier, a feedback circuit, an adjustable voltage gain unit, and a buffer. The transimpedance amplifier receives a first input voltage and a second input voltage and outputs a first output voltage and a second output voltage. The feedback circuit receives the first output voltage and the second output voltage and outputs a feedback voltage to the transimpedance amplifier. The adjustable voltage gain unit receives the first output voltage and the second output voltage and outputs a first amplified output voltage and a second amplified output voltage. The buffer processes the first amplified output voltage and the second amplified output voltage and outputs a first differential output voltage and a second differential output voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電流電壓轉換電路</p>
        <p type="p">110:轉阻放大器</p>
        <p type="p">120:回授電路</p>
        <p type="p">130:可調式電壓增益單元</p>
        <p type="p">131:電壓控制增益放大器</p>
        <p type="p">140:緩衝器</p>
        <p type="p">R&lt;sub&gt;L1&lt;/sub&gt;:負載電阻</p>
        <p type="p">PD:光學感測器</p>
        <p type="p">R&lt;sub&gt;L2&lt;/sub&gt;:負載電阻</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:第一輸入電壓</p>
        <p type="p">V&lt;sub&gt;IP&lt;/sub&gt;:第二輸入電壓</p>
        <p type="p">i1:第一差動輸入端</p>
        <p type="p">i2:第二差動輸入端</p>
        <p type="p">o1:第一差動輸出端</p>
        <p type="p">o2:第二差動輸出端</p>
        <p type="p">V&lt;sub&gt;O1&lt;/sub&gt;:第一輸出電壓</p>
        <p type="p">V&lt;sub&gt;O2&lt;/sub&gt;:第二輸出電壓</p>
        <p type="p">V&lt;sub&gt;FB&lt;/sub&gt;:回授電壓</p>
        <p type="p">V&lt;sub&gt;AN&lt;/sub&gt;:第一放大輸出電壓</p>
        <p type="p">V&lt;sub&gt;AP&lt;/sub&gt;:第二放大輸出電壓</p>
        <p type="p">V&lt;sub&gt;ON&lt;/sub&gt;:第一差動輸出電壓</p>
        <p type="p">V&lt;sub&gt;OP&lt;/sub&gt;:第二差動輸出電壓</p>
        <p type="p">V&lt;sub&gt;REF1&lt;/sub&gt;、V&lt;sub&gt;REF2&lt;/sub&gt;:參考電壓</p>
        <p type="p">V&lt;sub&gt;C1&lt;/sub&gt;:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="282" publication-number="202632618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用人工智慧偵測二氧化氮氣體及通報系統及其操作方法</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE NITROGEN DIOXIDE GAS DETECTING AND REPORTING SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G08B17/12</main-classification>
        <further-classification edition="200601120250401B">G08B17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泓泰環保科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG TAI ENVIRONMENTAL TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許凱捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許庭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡鴻源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用人工智慧偵測二氧化氮氣體及通報系統用以偵測煙道口排出的二氧化氮黃色氣體且包括影像收集器以及運算分析伺服器。影像收集器的監視器鏡頭設置於煙道口，而影像收集器的監視器主機獲取監視器鏡頭拍攝煙道口所生成的實時排煙影像。運算分析伺服器接收實時排煙影像且具有人工智慧影像分析模組。人工智慧影像分析模組根據物件偵測模型對實時排煙影像進行偵測以產生分析資訊並根據軌跡追蹤模型對分析資訊進行軌跡追蹤以產生煙霧辨識結果，人工智慧影像分析模組更根據影像分析模型對煙霧辨識結果進行分析以產生二氧化氮氣體濃度資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S21:步驟</p>
        <p type="p">S22:步驟</p>
        <p type="p">S23:步驟</p>
        <p type="p">S24:步驟</p>
        <p type="p">S25:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="283" publication-number="202632942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號管理系統以及投影機</chinese-title>
        <english-title>SIGNAL MANAGEMENT SYSTEN AND PROJECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04N5/74</main-classification>
        <further-classification edition="200601120250401B">H04N9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中強光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂品柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PIN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖允在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YUN-TZAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">訊號管理系統包含訊號輸入輸出模組及控制單元。當控制單元判定訊號輸入輸出模組的訊號轉換單元為閒置狀態時，控制訊號輸入輸出模組被操作在低功耗模式，反之則控制訊號輸入輸出模組操作在正常工作模式。訊號轉換單元在低功耗模式時的第一功耗值小於在正常工作模式時的第二功耗值，從而改進在閒置狀態的訊號轉換單元持續消耗電能的問題，提升能源利用效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal management system includes a signal input/ output module and a control unit. When the control unit determines that a signal conversion unit of the signal input/output module is in an idle state, the signal input/output module is controlled to operate in a low power consumption mode, otherwise, the signal input/output module is controlled to operate in a normal working mode. A first power consumption value of the signal conversion unit in the low power consumption mode is less than a second power consumption value in the normal working mode, thereby improving the problem of continuous power consumption of the signal conversion unit in the idle state and improving energy utilization efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:運作流程</p>
        <p type="p">S210A、S220A、S230A:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="284" publication-number="202632553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產線風險評估及管理系統</chinese-title>
        <english-title>RISK ASSESSMENT AND MANAGEMENT SYSTEM FOR PRODUCTION LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250207B">G06Q10/0635</main-classification>
        <further-classification edition="201201120250207B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華城電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTUNE ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許邦福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, BANG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉玳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種生產線風險評估及管理系統，運作於一電腦主機內，其包括一資料儲存模組、至少一分級模組、至少一檢核模組、及至少一比對模組。資料儲存模組經配置以存有與生產線相關的複數個檢核項目。至少一分級模組與資料儲存模組之間具有訊號連接，並經配置以根據檢核項目的內容將檢核項目分成複數個不同的風險等級。至少一檢核模組經配置以接收針對檢核項目之每一者進行檢核的檢核資料。至少一比對模組與資料儲存模組、至少一分級模組、及至少一檢核模組之間分別具有訊號連接，並經配置以定期比對檢核資料及資料儲存模組中的檢核項目的內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a risk assessment and management system for production line used in a computer host, comprising a data storage module, at least one grading module, at least one check module, and at least one comparison module. The data storage module is stored with a plurality of check items relevant to the production line. The at least one grading module is in signal communication with the data storage module, and is configured to grade the check items to a plurality of different risk grades according to contents of the check items. The at least one check module is configured to receive check information for each of the check items. The at least one comparison module is correspondingly in signal communication with the data storage module, the at least one grading module, and the at least one check module, and is configured to periodically compare the check information with the contents of the check items in the data storage module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資料儲存模組</p>
        <p type="p">2:分級模組</p>
        <p type="p">3:檢核模組</p>
        <p type="p">4:比對模組</p>
        <p type="p">Z:生產線風險評估及管理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="285" publication-number="202632189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能消除熱水器重複開關水時產生溫度落差的方法及熱水器</chinese-title>
        <english-title>METHOD OF ELIMINATING TEMPERATURE DROP CAUSED BY REPEATEDLY TURNING ON AND OFF WATER HEATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F24D19/10</main-classification>
        <further-classification edition="202201120250224B">F24D17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣櫻花股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SAKURA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維浚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-GIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能消除熱水器重複開關水時產生溫度落差的方法，主要在熱水器的冷水管設置一水流檢知器，水流檢知器及熱交換器之間設置一加壓泵，加壓泵與水流檢知器之間設置一連接管，連接管連接冷水管與熱水管，熱水管與連接管以三通管連接，三通管內設置一導流器，導流器的管徑由一端漸縮至頸部再遞增，導流器一側設有一側壁開孔，側壁開孔設於頸部，側壁開孔與連接管相對應。當熱水器關水時，熱水管、三通管由側壁開孔經連接管與冷水管導通形成一水迴路，加壓泵持續開啟能將熱交換器內的熱水經由三通管、側壁開孔導流回冷水管。本發明可使熱交換器內的水強制流動，而使管內的水均勻加熱，水溫均勻提升，可削減三明治效應。當熱水器開水時，熱水管、三通管由側壁開孔與連接管及冷水管導通，使冷水經連接管流向熱水管進行混和，並持續正常供應熱水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of eliminating a temperature drop caused by repeatedly turning on and off a water heater is provided. A water flow detector is installed in a cold water pipe of the water heater, and a pressure pump is arranged between the water flow detector and a heat exchanger. A connecting pipe is disposed between the pressure pump and the water flow detector. The connecting pipe connects the cold water pipe and a hot water pipe. The hot water pipe and the connecting pipe are connected with a tee pipe. A flow guide is disposed inside the tee pipe. The diameter of the flow guide is tapered from one end to a neck portion, and then increasing. One side of the flow guide is provided with a side wall opening, and the side wall opening is located at the neck portion corresponding to the connecting pipe. When the water heater is turned off, the hot water pipe and the tee pipe are connected to the cold water pipe through the side wall opening by the connecting pipe to form a water circuit. The continuous turning-on of the pressure pump can guide the hot water in the heat exchanger back to the cold water pipe through the tee pipe and the side wall opening. The present invention can force the water in the heat exchanger to flow, so that the water in the pipes can be evenly heated, the water temperature can be evenly increased, and the sandwich effect can be reduced. When the water heater is turned on, the hot water pipe and tee pipe are fluidly connected to the connecting pipe and cold water pipe through the side wall opening, so that the cold water flows through the connecting pipe to the hot water pipe for mixing, and continues to supply hot water normally.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱水器</p>
        <p type="p">11:風機</p>
        <p type="p">12:燃燒器</p>
        <p type="p">13:熱交換器</p>
        <p type="p">14:冷水管</p>
        <p type="p">15:熱水管</p>
        <p type="p">16:水流檢知器</p>
        <p type="p">17:加壓泵</p>
        <p type="p">18:連接管</p>
        <p type="p">19:三通管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="286" publication-number="202632521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防詐騙系統</chinese-title>
        <english-title>SYSTEM FOR FRAUD PREVENTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250401B">G06F21/50</main-classification>
        <further-classification edition="201201120250401B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙志祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防詐騙系統，是以擷取使用者的行為資訊與建立於詐騙行為資料庫的詐騙行為模型進行分析比對，進而判斷使用者之行為構成被詐騙風險的層級，以對使用者提出詐騙風險示警，即在詐騙集團尚未取得使用者信任前便可以持續對使用者提出受詐騙的風險警示，以達到防止詐騙的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for fraud prevention, the please invention extracts user behavior information and analyzes and compares it with the fraud behavior model established in the fraud behavior database, and then determines the level of risk of fraud in the user's behavior, and proposes a fraud prevention plan to the user. Fraud risk warning means that even before the fraud group has gained the user's trust, the user can continue to be warned of the risk of being deceived, so as to prevent fraud.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="287" publication-number="202631411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援隨插即充機制的電動車充電系統及電動車充電方法</chinese-title>
        <english-title>ELECTRIC VEHICLE CHARGING SYSTEM AND ELECTRIC VEHICLE CHARGING METHOD SUPPORTING PLUG-AND-AUTOCHARGE MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250401B">B60L53/10</main-classification>
        <further-classification edition="201901120250401B">B60L53/30</further-classification>
        <further-classification edition="201901120250401B">B60L53/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納智捷汽車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXGEN MOTOR CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周明弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-PAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪士峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳怡寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種支援隨插即充機制的電動車充電系統及電動車充電方法，方法包括：配置車廠端主機通訊連接於認證伺服器，以更新認證伺服器儲存的車輛清單；將連接充電站主機的充電樁連接於待充電車輛；配置充電站主機取得待充電車輛的車輛待辨識資訊，並向認證伺服器傳送認證請求；認證伺服器確認車輛辨識資訊並判斷回覆充電站主機是否通過充電樁對該待充電車輛進行充電，並對應產生充電指示訊號並回傳至充電站主機；以及響應於充電指示訊號指示允許對待充電車輛充電，配置充電站主機依據充電指示訊號對待充電車輛進行充電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric vehicle charging system and an electric vehicle charging method supporting a plug-and-autocharge mechanism are provided. The method includes: configuring a vehicle manufacturer host to connect to an authentication server to update a vehicle list stored in the authentication server; connecting a charging pile connected to a charging host to a vehicle to be charged; configuring the charging host to obtain vehicle identification information of the vehicle to be charged, and send an authentication request to the authentication server; configuring the authentication server to confirm the vehicle identification information and determine whether the charging station host charges the vehicle through the charging pile, so as to generate a charging instruction signal accordingly and send it back to the charging host; and in response to the charging instruction signal indicating that the vehicle to be charged is allowed to be charged, configuring the charging host to charge the vehicle to be charged according to the charging instruction signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電動車充電系統</p>
        <p type="p">10:認證伺服器</p>
        <p type="p">CL:車輛清單</p>
        <p type="p">12:充電站</p>
        <p type="p">120:充電站主機</p>
        <p type="p">122:充電器</p>
        <p type="p">14:車廠端主機</p>
        <p type="p">16:網路</p>
        <p type="p">EV:待充電車輛</p>
        <p type="p">D1:車輛出廠資料</p>
        <p type="p">D2:車輛維修資料</p>
        <p type="p">18:使用者設備</p>
        <p type="p">17:款項業務伺服器</p>
        <p type="p">DB:授權資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="288" publication-number="202632348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖晶片耦合配置以及光纖裝置</chinese-title>
        <english-title>OPTICAL FIBER APPARATUS AND FIBER-CHIP COUPLING ARRANGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251027B">G02B6/26</main-classification>
        <further-classification edition="200601120251027B">G02B6/36</further-classification>
        <further-classification edition="200601120251027B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進微晶圓私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO FOUNDRY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　佑善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, YOU SIAN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是有關於一種積體光子器件，特別是一種高效光纖晶片耦合結構或配置，在所述高效光纖晶片耦合結構或配置中，光纖具有至少兩個小面切口，所述至少兩個小面切口被製造或配置成高效地自光學晶片/向光學晶片傳送光學場。高效光纖晶片耦合配置可為例如光學晶圓級測試應用中所使用的光學耦合機構的一部分。光纖可可選地包括附加小面切口，所述附加小面切口被製造或配置成在與光學晶片或其他元件對準期間提供光纖的光學對準邊緣的改善的可視性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an integrated photonic device, specifically an efficient fiber-chip coupling structure or arrangement in which an optical fiber has at least two facet cuts that are made or configured to efficiently transmit an optical field from/to an optical chip. The efficient fiber-chip coupling arrangement may be part of an optical coupling setup used in, for example, optical wafer level testing applications. The optical fiber may optionally include an additional facet cut that is made or configured to provide improved visualisation of an optical alignment edge of the optical fiber during alignment with the optical chip or other elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光纖晶片耦合結構或配置</p>
        <p type="p">110:光纖</p>
        <p type="p">120:光學耦合結構</p>
        <p type="p">121:晶片上耦合器</p>
        <p type="p">122:光學組件</p>
        <p type="p">130:光學晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="289" publication-number="202631254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>合金催化劑及其製備方法</chinese-title>
        <english-title>ALLOY CATALYST AND METHOD FOR PREPARING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">B01J23/80</main-classification>
        <further-classification edition="200601120250501B">B01J23/89</further-classification>
        <further-classification edition="200601120250501B">B01J37/04</further-classification>
        <further-classification edition="200601120250501B">B01J37/08</further-classification>
        <further-classification edition="200601120250501B">B01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, JYH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種合金催化劑，該合金催化劑包含0.01wt%至30.0wt%之Zn、50.0wt%至99.9wt%之其餘金屬、及0.0wt%至20.0wt%之貴金屬，該其餘金屬包含選自Ni、Fe、Mo及Co所成群中之至少一種金屬；該合金催化劑具有藉由去合金化所形成之多孔結構。本發明之合金催化劑具有低過電位、低 Tafel 斜率及高穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An alloy catalyst, comprising 0.01 wt% to 30.0 wt% of Zn, 50.0 wt% to 99.9 wt% of other metals, and 0.0 wt% to 20.0 wt% of noble metals, wherein the other metals are at least one selected from a group consisting of Ni, Fe, Mo, and Co. The alloy catalyst features a porous structure formed through dealloying. The alloy catalyst of the present disclosure exhibits low overpotential, low Tafel slope, and high stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="290" publication-number="202632530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其虛擬助理操作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR OPERATING VIRTUAL ASSISTANT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250401B">G06F40/30</main-classification>
        <further-classification edition="202001120250401B">G06F40/40</further-classification>
        <further-classification edition="202001120250401B">G06F40/20</further-classification>
        <further-classification edition="200601120250401B">G06F3/01</further-classification>
        <further-classification edition="202501120250401B">G06F16/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奕男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖世傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張津豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案為一種電子裝置與其虛擬助理操作方法。此方法適用於包括輸入裝置與輸出裝置的電子裝置，並包括下列步驟。透過輸入裝置經由虛擬助理接收一使用者命令。透過利用一語言嵌入模型根據使用者命令於記錄多個功能描述文本的一資料庫進行一語意搜尋，從而獲取一語意搜尋結果。根據語意搜尋結果，產生包括多個功能描述文本中的一目標文本或使用者命令的一目標提示指令。將目標提示指令輸入至一生成式自然語言模型，並透過輸出裝置輸出生成式自然語言模型的模型回覆文本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a method for operating virtual assistant thereof are provided. The method is adapted to the electronic device including an input device and an output device and includes the following steps. A user command is received via a virtual assistant through the input device. A semantic search result is obtained by using a language embedding model to perform a semantic search in a database that records a plurality of function description texts according to the user command. According to the semantic search result, a target prompt instruction including a target text among the function description texts or the user command is generated. The target prompt command is input into a generative natural language model, and a model reply text of the generative natural language model is output through the output device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="291" publication-number="202633205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器</chinese-title>
        <english-title>IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250401B">H10F39/18</main-classification>
        <further-classification edition="202501120250401B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種影像感測器，其包括基底、轉移閘極結構、介電層以及光反射層。基底包括光電轉換區和浮動擴散區。轉移閘極結構設置在基底上且包括在第一方向上彼此相對的第一側以及第二側，其中第一側覆蓋光電轉換區的一部分，且第二側覆蓋浮動擴散區的一部分。介電層設置在基底上且覆蓋轉移閘極結構，其中介電層包括設置在浮動擴散區和轉移閘極結構上方的第一溝渠。光反射層設置在第一溝渠的表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an image sensor including a substrate including a photoelectric conversion region and a floating diffusion region, a transfer gate structure disposed on the substrate and including a first side and a second side opposite to each other in a first direction in which the first side covers a portion of the photoelectric conversion region, and a second side covers a portion of the floating diffusion region, a dielectric layer disposed on the substrate and covering the transfer gate structure in which the dielectric layer includes a first trench disposed above the floating diffusion region and the transfer gate structure, and a light reflective layer disposed on a surface of the first trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像感測器</p>
        <p type="p">100:基底</p>
        <p type="p">102:隔離結構</p>
        <p type="p">110:介電層</p>
        <p type="p">110a:第一溝渠</p>
        <p type="p">120:光反射層</p>
        <p type="p">130:導電接觸件</p>
        <p type="p">140:內連線層</p>
        <p type="p">142:層間介電層</p>
        <p type="p">144:內連線</p>
        <p type="p">150:彩色濾光片</p>
        <p type="p">160:微透鏡</p>
        <p type="p">FD:浮動擴散區</p>
        <p type="p">L1:光線</p>
        <p type="p">PD:光電轉換區</p>
        <p type="p">TG:轉移閘極結構</p>
        <p type="p">Y、Z:方向</p>
        <p type="p">θ:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="292" publication-number="202633058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組</chinese-title>
        <english-title>HEAT DISSIPATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">H05K7/20</main-classification>
        <further-classification edition="200601120250418B">F28F13/06</further-classification>
        <further-classification edition="200601120250418B">F28D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正文科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEMTEK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉隆興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, LONG-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱模組，包括一外殼、一散熱器、一電路板以及一風扇組件。散熱器設置在外殼內。電路板設置在散熱器內，並具有一熱源，其中散熱器接觸熱源。風扇組件具有一支架與一風扇模組，其中風扇模組固定於支架上。支架固定於外殼上，其中風扇模組產生一氣流以對散熱器進行散熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation module includes a housing, a heat dissipation device, a circuit board and a fan assembly. The heat dissipation device is disposed in the housing. The circuit board is disposed in the heat dissipation device and includes a heat source, wherein the heat dissipation device contacts the heat source. The fan assembly includes a bracket and a fan module, wherein the fan module is fixed on the bracket. The bracket is fixed on the housing, wherein the fan module generates an airflow to dissipate the heat from the heat dissipation device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱模組</p>
        <p type="p">110:外殼</p>
        <p type="p">111:進風口</p>
        <p type="p">112:出風口</p>
        <p type="p">120:散熱器</p>
        <p type="p">120a:表面</p>
        <p type="p">121:卡合結構</p>
        <p type="p">122:擋板</p>
        <p type="p">130:電路板</p>
        <p type="p">140:風扇組件</p>
        <p type="p">141:支架</p>
        <p type="p">141a:本體</p>
        <p type="p">141b:底座</p>
        <p type="p">142:風扇模組</p>
        <p type="p">143:鎖固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="293" publication-number="202632641">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蟲蛀音波檢測系統及其方法</chinese-title>
        <english-title>INSECT SOUND DETECTING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250711B">G10L15/02</main-classification>
        <further-classification edition="201301120250711B">G10L15/24</further-classification>
        <further-classification edition="201301120250711B">G10L17/26</further-classification>
        <further-classification edition="201301120250711B">G10L21/0208</further-classification>
        <further-classification edition="201301120250711B">G10L25/00</further-classification>
        <further-classification edition="200601120250711B">G01N29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傳育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余梵農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, FAN-NONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種蟲蛀音波檢測系統，包含收音裝置、儲存裝置及處理裝置。收音裝置用以對物件進行收音，以產生聲音訊號。儲存裝置儲存聲音訊號。處理裝置接收聲音訊號，處理裝置包含特徵提取模組及人工智慧模組。特徵提取模組自聲音訊號提取複數特徵資訊。人工智慧模組訊號連接特徵提取模組，將此些特徵資訊輸入至第一辨識模型以產生第一辨識結果，並將特徵資訊輸入至第二辨識模型以產生第二辨識結果。第一辨識結果包含物件中是否有蛀蟲，第二辨識結果包含蛀蟲的類別。藉此，對木製物品進行蟲蛀監測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An insect sound detecting system is proposed. The insect sound detecting system includes a sound receiving device, a storing device and a processing device. The sound receiving device is configured to receive a voice from an object to generate a sound signal. The storing device stores the sound signal. The processing device receives the sound signal, and includes a feature extracting module and an artificial intelligent module. The feature extracting module extracts a plurality of feature information from the sound signal. The artificial intelligent module is signally connected to the feature extracting module, inputs the feature information into a first detecting model to generate a first detecting result, and inputs the feature information into a second detecting model to generate a second detecting result. The first detecting result includes whether there is an insect in the object. The second detecting result includes a species of the insect. Thus, the insect sound detecting system of the present disclosure can monitor there is any insect on wood products.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蟲蛀音波檢測系統</p>
        <p type="p">110:收音裝置</p>
        <p type="p">120:儲存裝置</p>
        <p type="p">130:處理裝置</p>
        <p type="p">131:特徵提取模組</p>
        <p type="p">132:人工智慧模組</p>
        <p type="p">M1:第一辨識模型</p>
        <p type="p">M2:第二辨識模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="294" publication-number="202632161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧波減速機</chinese-title>
        <english-title>HARMONIC REDUCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250505B">F16H3/54</main-classification>
        <further-classification edition="200601120250505B">F16H3/70</further-classification>
        <further-classification edition="200601120250505B">F16H55/17</further-classification>
        <further-classification edition="201201120250505B">F16H57/032</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟英科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAIN DRIVE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝昆儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHI-GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏有泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YOU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種諧波減速機包含：波產生器、柔輪、軸承內環複合剛輪、後蓋、前蓋及軸承外環。波產生器的傳動軸包含傳動軸主體及傳動軸披覆結構，傳動軸披覆結構批覆於傳動軸主體的外側，傳動軸主體的材料密度低於傳動軸披覆結構的材料密度，且傳動軸主體的單位材料重量小於傳動軸披覆結構的單位材料重量。軸承外環與軸承內環複合剛輪共同形成有滾子軸承槽。軸承外環具有注油通道，注油通道與滾子軸承槽連通。軸承內環複合剛輪具有洩壓通道，洩壓通道與滾子軸承槽連通，洩壓通道的一端與嚙合空間相互連通。柔輪的齒部與軸承內環複合剛輪齒部於嚙合空間中嚙合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a harmonic drive comprising a wave generator, a flexspline, a composite rigid wheel, a rear cover, a front cover, and an outer bearing ring. The transmission shaft of the wave generator comprises a transmission shaft body and a transmission shaft cladding structure. The transmission shaft cladding structure is clad on the outer side of the transmission shaft body. The material density of the transmission shaft body is lower than that of the transmission shaft cladding structure, and the unit weight of the material used for the transmission shaft body is less than that of the transmission shaft cladding structure. The outer bearing ring and the composite rigid wheel with the composite rigid wheel collectively form a roller bearing groove. The outer bearing ring comprises an oil injection channel, which communicates with the roller bearing groove. The composite rigid wheel with the composite rigid wheel comprises a pressure relief channel, which also communicates with the roller bearing groove. One end of the pressure relief channel is in communication with the meshing space. The teeth of the flexspline engage with the teeth of the composite rigid wheel with the composite rigid wheel in this meshing space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:諧波減速機</p>
        <p type="p">100A:第一油封構件</p>
        <p type="p">100B:第二油封構件</p>
        <p type="p">1:波產生器</p>
        <p type="p">11:傳動軸</p>
        <p type="p">111:傳動軸主體</p>
        <p type="p">112:傳動軸披覆結構</p>
        <p type="p">12:柔性軸承</p>
        <p type="p">2:前蓋</p>
        <p type="p">3:第一軸承</p>
        <p type="p">4:柔輪</p>
        <p type="p">41:柔輪外齒狀結構</p>
        <p type="p">5:軸承內環複合剛輪</p>
        <p type="p">50:環狀凹槽</p>
        <p type="p">51:內齒狀結構</p>
        <p type="p">53:剛輪主體</p>
        <p type="p">54:剛輪披覆結構</p>
        <p type="p">55:洩壓通道</p>
        <p type="p">55D:內徑</p>
        <p type="p">5A:內間隙</p>
        <p type="p">5B:外間隙</p>
        <p type="p">6:滾子</p>
        <p type="p">7:軸承外環</p>
        <p type="p">71:軸承外環主體</p>
        <p type="p">72:軸承槽披覆結構</p>
        <p type="p">73:注油通道</p>
        <p type="p">731:注油孔</p>
        <p type="p">74:卡合槽</p>
        <p type="p">75:油封件</p>
        <p type="p">8:後蓋</p>
        <p type="p">9:第二軸承</p>
        <p type="p">10:密封件</p>
        <p type="p">A:滾子軸承槽</p>
        <p type="p">B:嚙合空間</p>
        <p type="p">D:徑向方向</p>
        <p type="p">E:第一油路</p>
        <p type="p">E1:內徑</p>
        <p type="p">F:第二油路</p>
        <p type="p">F1:內徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="295" publication-number="202632678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化遠端醫療控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">G16H40/67</main-classification>
        <further-classification edition="201801120250303B">G16H20/30</further-classification>
        <further-classification edition="201801120250303B">G16H20/40</further-classification>
        <further-classification edition="200601120250303B">B25J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雲弼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫思瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏廣炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化遠端醫療控制系統，其係包含至少一雲端伺服器、複數診療平台及複數機器人，該雲端伺服器包括一接收拋轉單元、一資料單元、一處理單元及一獎勵單元，該接收拋轉單元用以接收各該診療平台所拋轉之病歷資料，該資料單元具有一標準資料庫及一治療師資料庫，該處理單元係將該病歷資料進行運算後，與該標準資料庫及該治療師資料庫進行分析比對，而產生至少一標準治療方案，並經由該接收拋轉單元回傳至各該診療平台，以驅使該等機器人對病患執行對應的治療操作，同時治療師可自行開發新的治療方案或修改方案，藉以提升治療的精準度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:雲端伺服器</p>
        <p type="p">11:接收拋轉單元</p>
        <p type="p">12:資料單元</p>
        <p type="p">121:標準資料庫</p>
        <p type="p">122:治療師資料庫</p>
        <p type="p">13:處理單元</p>
        <p type="p">131:編碼器</p>
        <p type="p">14:獎勵單元</p>
        <p type="p">20:診療平台</p>
        <p type="p">21:儲存模組</p>
        <p type="p">22:接收拋轉模組</p>
        <p type="p">23:處理模組</p>
        <p type="p">231:解碼器</p>
        <p type="p">30:機器人</p>
        <p type="p">31:控制模組</p>
        <p type="p">32:機械手臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="296" publication-number="202631168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>唾液乳桿菌GKS9之組合物及其降低尿酸之用途</chinese-title>
        <english-title>COMPOSITION OF LACTOBACILLUS SALIVARIUS GKS9 AND ITS USE FOR REDUCING URIC ACID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250801B">A61K35/747</main-classification>
        <further-classification edition="200601120250801B">A61P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葡萄王生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAPE KING BIO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CI-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯毓欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石仰慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳姿和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZI-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種唾液乳桿菌（        &lt;i&gt;Lactobacillus salivarius&lt;/i&gt;）GKS9用於製備降低尿酸之組合物的用途， 其中該組合物包含一有效劑量之唾液乳桿菌GKS9作為活性物質。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A use of        &lt;i&gt;Lactobacillus salivarius&lt;/i&gt;GKS9 is provided. The strain can be used for the preparation of a composition for reducing uric acid, wherein the composition comprises an effective amount of        &lt;i&gt;Lactobacillus salivarius&lt;/i&gt;GKS9 as the active substance.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="297" publication-number="202631333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型彎折手工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">B25B23/16</main-classification>
        <further-classification edition="200601120250502B">B25G1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡厚飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡賢智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種微型彎折手工具，其包含：短桿、長桿及附加件，短桿沿著第一軸線設有接設部，接設部設有孔徑為1/4吋之第一工具孔，長桿沿著第二軸線設有驅動部，驅動部設有孔徑為4毫米之第二工具孔及能組接扳手的聯結外周緣長；短桿與長桿相互樞接，使長桿與短桿於第一工作位置及第二工作位置之間變換，於第一工作位置時，第一軸線與第二軸線為共軸；於第二工作位置時，第一軸線與第二軸線相交以形成高扭力工作角度；附加件能銜接於第一工具孔或第二工具孔；藉以根據不同用途需求，選擇合適的工作端進行操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:短桿</p>
        <p type="p">11:接設部</p>
        <p type="p">112:第一弧形槽</p>
        <p type="p">12:第一連接部</p>
        <p type="p">121:限位面</p>
        <p type="p">122:第一樞接孔</p>
        <p type="p">123:定位槽</p>
        <p type="p">20:長桿</p>
        <p type="p">21:驅動部</p>
        <p type="p">211:第二工具孔</p>
        <p type="p">214:聯結外周緣</p>
        <p type="p">22:第二連接部</p>
        <p type="p">221:樞轉槽</p>
        <p type="p">222:槽內面</p>
        <p type="p">223:第二樞接孔</p>
        <p type="p">23:中段部</p>
        <p type="p">231:第二弧形槽</p>
        <p type="p">30:樞接銷</p>
        <p type="p">40:定位組件</p>
        <p type="p">41:彈性件</p>
        <p type="p">42:定位掣子</p>
        <p type="p">50:附加件</p>
        <p type="p">51:主體</p>
        <p type="p">52:銜接部</p>
        <p type="p">521:大徑段</p>
        <p type="p">522:小徑段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="298" publication-number="202632140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>追日式蒸汽發電系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250529B">F03G6/06</main-classification>
        <further-classification edition="200601120250529B">F01K21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳光輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾曉夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳光輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾曉夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種追日式蒸汽發電系統包括有太陽能收集組件、動力裝置以及發電機，該太陽能收集組件包含機架、菲捏爾透鏡、連接件、連桿組件、第一驅動器、第二驅動器及蒸氣管，該第一驅動器設置於該機架並與該連接件連接以驅動該連接件繞第一擺動軸線擺動，該第二驅動器設置於該連接件並與該連桿組件連接以驅動該連桿組件繞第二擺動軸線擺動；該菲捏爾透鏡聚焦光線至該蒸氣管以加熱該蒸氣管中之水，進而生成蒸氣自該蒸氣管之輸出端輸出以帶動該動力裝置作動，使得該動力裝置帶動該發電機作動以生成電能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:太陽能收集組件</p>
        <p type="p">11:機架</p>
        <p type="p">12:菲捏爾透鏡</p>
        <p type="p">12a:收光面</p>
        <p type="p">13:連接件</p>
        <p type="p">14:連桿組件</p>
        <p type="p">141:第一連桿</p>
        <p type="p">142:第二連桿</p>
        <p type="p">143:第三連桿架</p>
        <p type="p">15:第一驅動器</p>
        <p type="p">16:第二驅動器</p>
        <p type="p">17:蒸氣管</p>
        <p type="p">17a:輸出端</p>
        <p type="p">20:動力裝置</p>
        <p type="p">21:活塞</p>
        <p type="p">22:汽缸</p>
        <p type="p">22a:排水孔</p>
        <p type="p">23:飛輪組件</p>
        <p type="p">30:發電機</p>
        <p type="p">40:集水槽</p>
        <p type="p">42:洩氣閥</p>
        <p type="p">44:回水馬達</p>
        <p type="p">50:蓄水槽</p>
        <p type="p">52:逆止閥</p>
        <p type="p">60:輸水管線</p>
        <p type="p">A1:第一擺動軸線</p>
        <p type="p">A2:第二擺動軸線</p>
        <p type="p">d:最小距離</p>
        <p type="p">h:高度</p>
        <p type="p">P1:第一位置</p>
        <p type="p">S1:縱向參考面</p>
        <p type="p">S2:水平參考面</p>
        <p type="p">W:外部水源</p>
        <p type="p">w:寬度</p>
        <p type="p">θ1:第一夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="299" publication-number="202633251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P30/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力拓半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEAP SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭凱起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, KAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李亞澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YA-ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體晶片的製備方法，包含步驟(a)準備一主基板及一承載基板；步驟(b)於該承載基板的一頂面沉積一鍵合層；步驟(c)自該主基板的頂面向下進行離子佈植，以形成一剝離區；步驟(d)將該主基板的頂面與該鍵合層進行熱接合，形成一第一中間物；步驟(e)將該第一中間物沿該剝離區進行熱分離，得到包含該承載基板、該鍵合層及一減薄型主基板層的一第二中間物；步驟(f)將該減薄型主基板層進行平坦化處理，得到一磊晶用基板；步驟(g)在該磊晶用基板上進行磊晶及半導體元件製程，得到一第三中間物；步驟(h)將第三中間物進行雷射熱裂解，得到一半導體晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:承載基板</p>
        <p type="p">31:鍵合層</p>
        <p type="p">51:減薄型主基板層</p>
        <p type="p">61:半導體元件層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="300" publication-number="202632285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非彈簧式之封裝測試座</chinese-title>
        <english-title>NON-SPRING TYPE PACKAGE SOCKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G01R1/04</main-classification>
        <further-classification edition="200601120250207B">G01R1/067</further-classification>
        <further-classification edition="202001120250207B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳崨科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JG TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉柏榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡正榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHENG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭智元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種非彈簧式之封裝測試座，包括：底部插座，凹設有底部插槽，該底部插槽設有複數單動探針；測試機台，對應該底部插槽設有頂部插座且內部鄰靠該頂部插座設有雙倍資料速率記憶體；複數金屬導件，設於該頂部插座內部且一端具有與該雙倍資料速率記憶體電性連接之導電膠，而另一端具有探測頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a non-spring type package socket, comprising: a bottom socket, a bottom slot is recessed, and the bottom slot is provided with a plurality of single-action probes; a test machine, a top portion is provided corresponding to the bottom slot; The socket is provided with a double data rate memory adjacent to the top socket; a plurality of metal conductors are provided inside the top socket and have a conductive glue electrically connected to the double data rate memory at one end and a conductive glue electrically connected to the double data rate memory at the other end. Detection head.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底部插座</p>
        <p type="p">10:底部插槽</p>
        <p type="p">11:單動探針</p>
        <p type="p">2:測試機台</p>
        <p type="p">20:頂部插座</p>
        <p type="p">21:雙倍資料速率記憶體</p>
        <p type="p">3:金屬導件</p>
        <p type="p">4:導電膠</p>
        <p type="p">5:晶片</p>
        <p type="p">6:負載板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="301" publication-number="202632918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備外部觸發功能的光纜監測系統及其方法</chinese-title>
        <english-title>OPTICAL CABLE MONITORING WITH EXTERNAL TRIGGER FUNCTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250602B">H04B10/25</main-classification>
        <further-classification edition="201301120250602B">H04B10/07</further-classification>
        <further-classification edition="200601120250602B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍正平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑞陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, RUEI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭斐華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, FEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備外部觸發功能的光纜監測系統及其方法，該方法包括：依據設定的週期對各監測心線進行輪詢掃描；判斷是否接收到傳輸系統網管發送的障礙光纜訊息；對障礙光纜中的監測心線進行OTDR量測及障礙圖資定位分析；判斷障礙光纜中的監測心線是否量測到障礙；於未量測到障礙時回報傳輸系統網管OTDR量測無障礙；以及於量測到障礙時發送告警至傳輸系統網管、網路維運系統以及訊息發送系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical cable monitoring with external trigger function system and method thereof are provided, the method includes performing polling scans on each monitoring core wire according to a set period; determining whether an optical cable fault message sent by a transmission system network management is received; conducting OTDR measurement and locate the faults based on the analysis of the measurement results with GIS map on the monitoring core wires in a fault cable; determining whether the monitoring core wires in the fault cable detects a fault; reporting to the transmission system network management that the OTDR measures no fault when no fault is measured; and sending alarms to the transmission system network management, network maintenance system and message sending system when the fault is measured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S810、S820、S830、S840、S850、S860:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="302" publication-number="202631229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腿部訓練機</chinese-title>
        <english-title>LEG-TRAINING EXERCISER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">A63B23/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖賴淑瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO LAI, SHU-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖賴淑瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO LAI, SHU-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種腿部訓練機，其包含有一底座、一扶手部、兩作動桿、一平衡連動裝置以及兩阻尼器，該扶手部係固定於底座之一端以供使用者的手部扶靠於其上，該兩作動桿分別樞設連接於底座上，於兩作動桿異於與底座相樞接之一端分別設置有一踏板，該平衡連動裝置係設置於兩作動桿之間，使兩作動桿得反向相對底座呈擺盪運動，該兩阻尼器係設置於兩作動桿與底座之間，各阻尼器之兩端係分別樞設連接於底座與一相對的作動桿上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a leg-training exerciser having a base, a handle assembly, two swinging arms, a balance linkage assembly, and two dampers. The handle assembly is secured on an end of the base for a user holding the handle assembly. The two swinging arms are pivotally connected with the base, and each swinging arm has a pedal mounted on an end of the swinging arm opposite the base. The balance linkage assembly is arranged between the swinging arms to allow the two swinging to swing relative to the base in reverse directions respectively. The dampers are arranged between the two swinging arms and the base. Each damper has two end pivotally connected to the base and a corresponding one of the swinging arms respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:底座</p>
        <p type="p">12:底桿</p>
        <p type="p">13:橫桿</p>
        <p type="p">14:支撐桿</p>
        <p type="p">142:座椅</p>
        <p type="p">16:扶手撐桿</p>
        <p type="p">17:斜撐桿</p>
        <p type="p">18:連接片</p>
        <p type="p">20:扶手部</p>
        <p type="p">22:扶手桿</p>
        <p type="p">30:作動桿</p>
        <p type="p">32:踏板</p>
        <p type="p">40:平衡連動裝置</p>
        <p type="p">50:阻尼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="303" publication-number="202632485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置與其視覺介面色彩設定方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND VISUAL INTERFACE COLOR SETTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250602B">G06F3/048</main-classification>
        <further-classification edition="200601120250602B">G09G5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RUEI-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉孟寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, MENG-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種電子裝置與其視覺介面色彩設定方法。視覺介面色彩設定方法適用於包括顯示器的電子裝置。顯示器用以顯示一視覺操作介面，所述方法包括下列步驟。接收一使用者輸入資訊。透過一文本嵌入模型根據使用者輸入資訊產生一搜尋語意向量。根據搜尋語意向量與多個預設色彩各自的色彩語意向量，從多個預設色彩中挑選出至少一主題色彩。根據至少一主題色彩，執行視覺操作介面的一介面色彩設定功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a visual interface color setting method thereof are provided. The method is adapted to the electronic device including a display. The display is configured to display a visual operation interface, and the method includes the following steps. User input information is received. A search semantic vector is generated based on the user input information using a text embedding model. Based on the search semantic vector and respective color semantic vectors of multiple predetermined colors, at least one theme color is selected from the predetermined colors. Based on the at least one theme color, an interface color setting function of the visual operation interface is executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="304" publication-number="202632607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於物件追蹤的電子裝置、方法及電腦程式產品</chinese-title>
        <english-title>ELECTRONIC DEVICE, METHOD AND COMPUTER PROGRAM PRODUCT FOR OBJECT TRACKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V10/62</main-classification>
        <further-classification edition="202201120250401B">G06V10/82</further-classification>
        <further-classification edition="202201120250401B">G06V10/80</further-classification>
        <further-classification edition="202301120250401B">G06N3/045</further-classification>
        <further-classification edition="202301120250401B">G06N3/0455</further-classification>
        <further-classification edition="202301120250401B">G06N3/0464</further-classification>
        <further-classification edition="201701120250401B">G06T7/50</further-classification>
        <further-classification edition="201701120250401B">G06T7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹誠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於物件追蹤的電子裝置、方法及電腦程式產品被揭露於此。該電子裝置建構並運行物件追蹤網路，藉此在區域影像中確認目標物件的位置資訊。該物件追蹤網路包含特徵提取骨幹網路、特徵融合網路以及預測網路。該特徵提取骨幹網路包含共享權重的兩個特徵提取器。該特徵融合網路包含複數個交叉注意力層以及一通道注意力模組，各交叉注意力層包含並行的兩個交叉注意力轉換器模組。該物件追蹤網路為融合了卷積神經網路和Transformer架構的混合模型。透過引入基於Transformer的交叉注意力機制和通道注意力機制，增強了特徵融合的效率與準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device, method, and computer program product for object tracking are disclosed herein. The electronic device constructs and runs an object tracking network to confirm the location information of the target object in the area image. The object tracking network includes a feature extraction backbone network, a feature fusion network, and a prediction network. The feature extraction backbone network consists of two feature extractors with shared weights. The feature fusion network includes a plurality of cross-attention layers and a channel attention module, and each cross-attention layer includes two parallel cross-attention converter modules. The object tracking network is a hybrid model that combines convolutional neural networks and Transformer architecture. By introducing the Transformer-based cross-attention mechanism and channel attention mechanism, the efficiency and accuracy of feature fusion are enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">107:區域影像</p>
        <p type="p">108:目標影像</p>
        <p type="p">112:物件追蹤網路</p>
        <p type="p">113:深度估測網路</p>
        <p type="p">201:特徵提取骨幹網路</p>
        <p type="p">202:特徵融合網路</p>
        <p type="p">203:預測網路</p>
        <p type="p">204,205:特徵提取器</p>
        <p type="p">206,212:區域特徵圖</p>
        <p type="p">207,213:目標特徵圖</p>
        <p type="p">208:交叉注意力層</p>
        <p type="p">209:通道注意力模組</p>
        <p type="p">210,211:交叉注意力轉換器模組</p>
        <p type="p">214,218:響應圖</p>
        <p type="p">217:通道注意力向量</p>
        <p type="p">219:分類分支</p>
        <p type="p">220:回歸分支</p>
        <p type="p">221:分類向量</p>
        <p type="p">222:回歸向量</p>
        <p type="p">223:追蹤結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="305" publication-number="202632486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙區編輯詳細資訊之裝置、方法與電腦程式產品</chinese-title>
        <english-title>DEVICE, METHOD, AND COMPUTER PROGRAM PRODUCT FOR DUAL-BLOCK EDITING OF DETAILS FUNCTIONS OF A STOCK QUOTING SOFTWARE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250401B">G06F3/048</main-classification>
        <further-classification edition="202201120250401B">G06F3/0481</further-classification>
        <further-classification edition="202301120250401B">G06Q40/02</further-classification>
        <further-classification edition="201201120250401B">G06Q40/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三竹資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAKE INFORMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUNG CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙區編輯詳細資訊之裝置、方法與電腦程式產品。該裝置包含：記憶體、觸控螢幕及一或多個處理器，記憶體儲存應用程式，應用程式包含：雙區編輯功能模組，產生雙區編輯功能視圖包含第一設定區塊、第二設定區塊以及複數個詳細資訊標籤，詳細資訊標籤代表複數個詳細資訊，接收關聯於詳細資訊標籤之新增指令，接收關聯於詳細資訊標籤之變更從屬區塊指令，接收關聯於詳細資訊標籤之刪除指令，及，依據指令執行後之異動結果產生詳細資訊組合設定；詳細資訊視圖模組，依據詳細資訊組合設定產生詳細資訊視圖包含第一資訊區塊、第二資訊區塊以及各自所對應的詳細資訊，第一設定區塊係對應第一資訊區塊，第二設定區塊係對應第二資訊區塊。透過本發明雙區編輯功能視圖讓使用者可自訂詳細資訊視圖，以隱藏不需要的詳細資訊，使得詳細資訊視圖看起來較簡潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is related to a device, method, and computer program product for dual-block editing of details functions of stock quoting software, the device includes a memory, a touch-screen, and one or more processors; the memory stores an application program; the application program includes a dual-block function editing module, which allows user to edit a customized stock-details-view; the customized stock-details-view can hide functions that the user does not need, making the screen appear more streamlined.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:應用程式</p>
        <p type="p">22:登入驗證模組</p>
        <p type="p">24:雙區編輯功能模組</p>
        <p type="p">26:詳細資訊模組</p>
        <p type="p">28:詳細資訊視圖模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="306" publication-number="202631029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>服裝防滑腰墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">A41D27/00</main-classification>
        <further-classification edition="200601120250228B">A41D27/12</further-classification>
        <further-classification edition="200601120250228B">A41D27/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林麗君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳邦禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種服裝防滑墊，包含有一墊體與一止滑層，該墊體係呈彎曲片狀，具有一外凸面以及一內凹面，該外凸面具有一面向斜上方的朝上部、以及一面向斜下方的朝下部，該內凹面係相背於該外凸面，用以貼附於人體；該止滑層設於該外凸面之朝上部之至少局部，用以黏附於服裝。藉此，該服裝防滑墊可將服裝固定於人體而避免滑落，且使用時不會外露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:服裝防滑墊</p>
        <p type="p">10:墊體</p>
        <p type="p">11:外凸面</p>
        <p type="p">13:朝上部</p>
        <p type="p">14:朝下部</p>
        <p type="p">15:頂緣</p>
        <p type="p">16:底緣</p>
        <p type="p">20:止滑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="307" publication-number="202631327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扳手及其製造方法</chinese-title>
        <english-title>SPANNER AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">B25B13/46</main-classification>
        <further-classification edition="200601120250502B">B21K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英發企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFAR INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扳手的製造方法適於對具有該扳手的雛形的一待加工品進行一去毛刺作業，該待加工品包含一上端面、相對於該上端面的一下端面及從該上端面延伸至該下端面的一衝壓孔，該衝壓孔與該上端面或該下端面的交界有毛刺，且該製造方法包含：以一固持治具，固定該待加工品；以及以一研磨元件的平坦研磨面，磨除該毛刺。藉此，達到在不需元件對位的情況下就能快速去除毛刺的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of spanners is applicable to perform a burr removing task onto an object to be processed that has an embryonic form of the spanner and includes an upper end surface, a lower end surface opposite to the upper end surface, a stamped hole extending from the upper end surface to the lower end surface, and burrs on the boundary between the stamped hole and the upper or lower end surface, and includes: holding the object to be processed by a holding tool; and grinding away the burrs by a flat grinding surface of a grinding element. Therefore, it becomes possible to fast remove burrs without any alignment of elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:扳手</p>
        <p type="p">21:扳手主體</p>
        <p type="p">22:握柄</p>
        <p type="p">23:頭部</p>
        <p type="p">231:第一端面</p>
        <p type="p">232:第二端面</p>
        <p type="p">233:套接孔</p>
        <p type="p">234:內環面</p>
        <p type="p">235:第一周緣</p>
        <p type="p">236:第二周緣</p>
        <p type="p">237:邊緣</p>
        <p type="p">238:內邊緣</p>
        <p type="p">239:內邊緣</p>
        <p type="p">30:待加工品</p>
        <p type="p">31:上端面</p>
        <p type="p">32:下端面</p>
        <p type="p">33:衝壓孔</p>
        <p type="p">34:毛刺</p>
        <p type="p">40:固持治具</p>
        <p type="p">50:研磨元件</p>
        <p type="p">51:平坦研磨面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="308" publication-number="202632464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源系統及電源模組</chinese-title>
        <english-title>POWER SYSTEM AND POWER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F1/16</main-classification>
        <further-classification edition="200601120250602B">H02B1/26</further-classification>
        <further-classification edition="202501120250602B">H05K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源系統包含機櫃、絕緣延伸臂、導電排、固定件以及電源線。機櫃具有內部空間以及位於內部空間內的支架。絕緣延伸臂位於內部空間內，並固定至支架。導電排位於內部空間內。固定件穿過導電排且連接絕緣延伸臂，並允許導電排朝向與遠離絕緣延伸臂移動。電源線的一端電性耦接至導電排。電源模組配置以插入電源系統的內部空間中。電源模組包含殼體以及電路板。電路板固定至殼體內，並包含電連接器。電連接器具有接口。接口配置以供電源系統的導電排插接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power system includes a cabinet, an insulating extension arm, a conductive bar, a fixing member, and a power cord. The cabinet has an interior space and a bracket located in the interior space. The insulating extension arm is located in the interior space and fixed to the bracket. The conductive bar is located in the interior space. The fixing member passes through the conductive bar and is connected to the insulating extension arm, and allows the conductive bar to move toward and away from the insulating extension arm. One end of the power cord is electrically coupled to the conductive bar. The power module is configured to be inserted into the interior space of the power system. The power module includes a housing and a circuit board. The circuit board is fixed to the housing and includes an electrical connector. The electrical connector has a connection port. The connection port is configured to plug into the conductive bar of the power system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:絕緣延伸臂</p>
        <p type="p">120a:表面</p>
        <p type="p">130:導電排</p>
        <p type="p">131:第一固定部</p>
        <p type="p">132:第二固定部</p>
        <p type="p">140,141:固定件</p>
        <p type="p">140a:貫穿部</p>
        <p type="p">140b:頭部</p>
        <p type="p">140c:鎖固部</p>
        <p type="p">160:絕緣件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="309" publication-number="202632154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作動裝置及其作動方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">F16B21/06</main-classification>
        <further-classification edition="200601120250418B">F16B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍隆國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種作動裝置及其作動方法，該作動裝置包含作動部、身部及連接部，作動部與連接部連接，並使連接部設於身部，其中作動部設有接合部，連接部設有對接部，接合部與對接部內作動或對接。藉此，可利用身部組設於物體，並以作動部帶動連接部與另一物體連接或分離，以完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:作動裝置</p>
        <p type="p">101:作動部</p>
        <p type="p">102:身部</p>
        <p type="p">103:連接部</p>
        <p type="p">104:組接部</p>
        <p type="p">105:接合部</p>
        <p type="p">106:對接部</p>
        <p type="p">107:通過部</p>
        <p type="p">108:組設部</p>
        <p type="p">109:彈性元件</p>
        <p type="p">110:限制部</p>
        <p type="p">111:扣部</p>
        <p type="p">117:穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="310" publication-number="202632515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於二維條碼的健身運動器材資訊系統</chinese-title>
        <english-title>GYM EQUIPMENT INFORMATION SYSTEM BASED ON TWO-DIMENSIONAL BARCODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250328B">G06F16/95</main-classification>
        <further-classification edition="200601120250328B">A63B24/00</further-classification>
        <further-classification edition="201201120250328B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐壬國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VONRANG INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳濬亦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉祖維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WAYNE TSU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉珏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUE-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於二維條碼的健身運動器材資訊系統，包含：複數個健身運動器材、複數個二維條碼標籤及網頁伺服器。網頁伺服器建置有複數個健身運動器材資訊網頁，分別儲存有健身運動器材的健身運動器材資訊，且健身運動器材資訊網頁分別資訊連結於二維條碼標籤，而供使用者透過行動裝置掃描健身運動器材上的二維條碼標籤而連結至對應的健身運動器材的健身運動器材資訊網頁，使得使用者能夠便利地取得健身運動器材的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">What is disclosed is a gym equipment information system based on two-dimensional barcodes, comprises: multiple pieces of gym equipment, a plurality of two-dimensional barcode labels, and a web server. The web server hosts a plurality of gym equipment information web pages, each storing information about the gym equipment. The web pages are linked to the corresponding two-dimensional barcode labels. Users can scan the two-dimensional barcode labels on the gym equipment using a mobile device to access the corresponding gym equipment information web page, allowing them to conveniently obtain information about the gym equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於二維條碼的健身運動器材資訊系統</p>
        <p type="p">1:健身運動器材</p>
        <p type="p">2:二維條碼標籤</p>
        <p type="p">3:網頁伺服器</p>
        <p type="p">31:運動器材資訊網頁</p>
        <p type="p">M:行動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="311" publication-number="202631370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種自行車部件製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250612B">B29C70/30</main-classification>
        <further-classification edition="200601120250612B">B29C70/40</further-classification>
        <further-classification edition="200601120250612B">B29C70/54</further-classification>
        <further-classification edition="200601120250612B">B62K19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白光立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅妃容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白光立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅妃容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種自行車部件製作方法，其係一種以特殊塗層尼龍離膜布應用於碳纖維自行車部件之製作方法，值得一提的是，本發明之尼龍離膜布係添加有氟素脫模劑，使其之後附著於碳纖維層表面，能在吹氣成形、加熱、加壓硬化成型後，具有較佳的脫模、離膜效果，並且有效抑制碳纖維部件其氣泡與缺陷的產生。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S01:製作發泡材芯軸</p>
        <p type="p">S02:碳纖維布設置</p>
        <p type="p">S03:內層尼龍離膜布設置</p>
        <p type="p">S04:外層尼龍離膜布設置</p>
        <p type="p">S05:加溫加壓成型</p>
        <p type="p">S06:取出碳纖維中空組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="312" publication-number="202631669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102784</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ANP依賴性抗體</chinese-title>
        <english-title>ANP-DEPENDENT ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">C07K16/28</main-classification>
        <further-classification edition="200601120251001B">C07K16/30</further-classification>
        <further-classification edition="200601120251001B">C07K16/44</further-classification>
        <further-classification edition="200601120251001B">A61K39/395</further-classification>
        <further-classification edition="200601120251001B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商禮新醫藥科技（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANOVA MEDICINES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潤生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUNSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦　瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, YING QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠以腺嘌呤核苷酸依賴性方式結合抗原之抗體。腺嘌呤核苷酸之實例包括ATP、ADP及AMP，其以比在正常組織中高得多的濃度頻繁地存在於腫瘤微環境中。此類抗體若設計成靶向腫瘤相關抗原或免疫檢查點分子，則可比習知抗體更具特異性地靶向腫瘤組織且因此具有改良之治療指數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are antibodies capable of binding an antigen in an adenine nucleotide-dependent manner. Examples of adenine nucleotides include ATP, ADP and AMP, which are frequently present in tumor microenvironment at much higher concentrations in normal tissues. Such antibodies, if designed to target a tumor associated antigen or immune checkpoint molecule, can target tumor tissues more specifically than conventionally antibodies and thus have improved therapeutic index.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="313" publication-number="202631041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彩妝容器及其篩蓋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">A45D33/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉦維塑膠工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張廖貴森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳洲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彩妝容器及其篩蓋，該彩妝容器係具有一容器本體，該容器本體之開口係可設有一篩蓋，該篩蓋之外側係蓋設有一封蓋，其中，該篩蓋係具有一第一蓋體與一第二蓋體，該第一蓋體係設有一第一平面與一第一環面，該第一平面與該第二平面具有高度差，該第一平面係設有複數個穿孔，而該第二蓋體係對應設置有一第二平面與第二環面，當該第二蓋體蓋設於該第一蓋體時，該第二平面係壓抵於該第一平面，該第二環面係壓抵於該第一環面，藉以形成雙重密封結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:容器本體</p>
        <p type="p">11:容器底壁</p>
        <p type="p">12:容器環壁</p>
        <p type="p">13:儲存空間</p>
        <p type="p">131:開口</p>
        <p type="p">14:受壓部</p>
        <p type="p">20:篩蓋</p>
        <p type="p">21:第一蓋體</p>
        <p type="p">211:第一底壁</p>
        <p type="p">212:第一環壁</p>
        <p type="p">213:第一容槽</p>
        <p type="p">214:第一凸緣</p>
        <p type="p">215:凹部</p>
        <p type="p">216:穿孔</p>
        <p type="p">22:第二蓋體</p>
        <p type="p">221:第二底壁</p>
        <p type="p">222:第二環壁</p>
        <p type="p">223:第二容槽</p>
        <p type="p">224:第二凸緣</p>
        <p type="p">225:凸部</p>
        <p type="p">30:封蓋</p>
        <p type="p">31:加壓部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="314" publication-number="202632679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以機器學習評估腎臟手術風險及預後之方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250401B">G16H50/20</main-classification>
        <further-classification edition="201901120250401B">G06N20/00</further-classification>
        <further-classification edition="200601120250401B">A61B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺中榮民總醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAICHUNG VETERANS GENERAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種以機器學習評估腎臟手術風險及預後之方法及系統，其係藉由提供一腎臟手術風險及預後預測模組分析一患者之關鍵特徵後，輸出至少一預測項目，而能供醫護人員、患者或/及其相關人員作為手術決策之參考，以達到提升手術成功率及預後之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:用於以機器學習評估腎臟手術風險及預後之系統</p>
        <p type="p">10:資料庫</p>
        <p type="p">20:處理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="315" publication-number="202632156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎖合件</chinese-title>
        <english-title>FASTENER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">F16B25/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錠樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DIN-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錠樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DIN-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明鎖合件，其主要在於桿體上環設有一與螺牙段呈交錯設置的輔助單元，同時該輔助單元具有複數位於該螺牙段之任二螺牙間的尖錐塊，以及形成於任二該尖錐塊間之通道設置，是以，藉由該等尖錐塊、該等通道等配合，以便該鎖合件進行旋鎖時，可輔助斬切鎖合物上之木纖維，進而輔助該等螺牙產生多重切削效果外，並再通過該等通道增加切屑排出與部分切屑的容置，最後再利用該等尖錐塊可與該鎖合物間呈多點嵌掣效果，有利提升鎖合緊固力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastener mainly includes a shank on which an auxiliary unit alternates with a threaded section. The auxiliary unit includes a plurality of tapering members located between any two threads of the threaded section and a channel formed between any two tapering members. The tapering members and the channels cooperate to sever wood fibers of a workpiece when a drilling operation of the fastener is executed, thereby assisting the threads in attaining a multi-cutting effect. The existence of the channels enhances the effect of removing cut chips and accommodating remaining cut chips. The tapering members can provide the multi-point engagement with the workpiece to attain a better fastening effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(本發明)</p>
        <p type="p">3:鎖合件</p>
        <p type="p">31:桿體</p>
        <p type="p">31a:周緣面</p>
        <p type="p">32:頭部</p>
        <p type="p">33:尾部</p>
        <p type="p">331:鑽尖</p>
        <p type="p">34:螺牙段</p>
        <p type="p">341:螺牙</p>
        <p type="p">35:輔助單元</p>
        <p type="p">351:尖錐塊</p>
        <p type="p">351a:尖錐點</p>
        <p type="p">352:通道</p>
        <p type="p">R:基準線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="316" publication-number="202632933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於EPIRB的智能AI網路效能之監測系統及其監測方法</chinese-title>
        <english-title>MONITORING SYSTEM AND METHOD FOR INTELLIGENT AI NETWORK PERFORMANCE BASED ON EPIRB</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250602B">H04L41/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-PIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金譚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-TAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋文財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, WEN-TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宗道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSUNG-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃育賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YUH-SHYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種基於EPIRB的智能AI網路效能之監測系統及其監測方法，透過收集多種來源之網路數據，並利用人工智慧技術進行分析與預測，以優化網路運營維護。評估系統包括數據收集模組、分析模組、通知模組及使用者介面。數據收集模組用於收集環境數據及網路數據；分析模組與數據收集模組連接，用於對網路運營維護過程中所需的數據和操作進行分析與優化，生成多個分析結果。通知模組則根據分析結果與分析模組進行通訊，並發送相應的通知或維修指令於使用者介面。藉此，本發明利用生成式AI模型及機器學習，持續提升在障礙處理中的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a monitoring system and method for intelligent AI network performance based on EPIRB. It collects network data from various sources and utilizes artificial intelligence (AI) technology for analysis and prediction to optimize network operation and maintenance. The monitoring system includes a data collection module, an analysis module, a notification module, and a user interface. The data collection module is used to gather environmental and network data. The analysis module is connected to the data collection module and is designed to analyze and optimize the data and operations required for network operation and maintenance, generating multiple analysis results. The notification module communicates with the analysis module based on the analysis results and sends corresponding notifications or maintenance instructions to the user interface. By leveraging generative AI models and machine learning, the invention continuously enhances the accuracy in handling network issues.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:評估系統</p>
        <p type="p">10:數據收集模組</p>
        <p type="p">101:EPIRB設備</p>
        <p type="p">102:電信業者管理網站</p>
        <p type="p">103:資料庫</p>
        <p type="p">11:感測器</p>
        <p type="p">12:資料擷取單元</p>
        <p type="p">20:AI機器分析模組</p>
        <p type="p">21:預處理單元</p>
        <p type="p">22:特徵提取單元</p>
        <p type="p">23:機器學習單元</p>
        <p type="p">30:通知模組</p>
        <p type="p">40:使用者介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="317" publication-number="202632011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高回收料比例的中強度7xxx系列再生鋁合金件及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">C22B7/00</main-classification>
        <further-classification edition="200601120251103B">C22C1/02</further-classification>
        <further-classification edition="200601120251103B">C22C21/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣穗高科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN HODAKA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊春欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUNG, CHUNE-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江俊憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白登洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, TENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高回收料比例的中強度7xxx系列再生鋁合金件，包含至少75wt%的回收鋁料，該回收鋁料包括至少兩種不同且來自5xxx系列及6xxx系列鋁合金的其中至少一者的回收鋁料，且該高回收料比例的中強度7xxx系列再生鋁合金件於T6熱處理的條件下，其抗拉強度介於350-550MPa、降服強度介於300-500MPa，且伸長率大於10%。此外，本發明還提供該高回收料比例的中強度7xxx系列再生鋁合金件的製備方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:原料選擇與組成設計步驟</p>
        <p type="p">22:純化精煉步驟</p>
        <p type="p">23:熔融步驟</p>
        <p type="p">24:合金成份調質步驟</p>
        <p type="p">25:澆鑄步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="318" publication-number="202632897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有動態調整臨界電壓功能的高速比較器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03K3/023</main-classification>
        <further-classification edition="200601120250303B">H03M1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐延諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有動態調整臨界電壓功能的高速比較器，其技術是臨界電壓調整電路根據第一輸出信號與第二輸出信號分別產生第一回授電壓與第二回授電壓。第一差動輸入級的每一電晶體的基極接收該第二回授電壓，用以調整每一電晶體的第一臨界電壓。第二差動輸入級的每一電晶體的基極接收第一回授電壓，用以調整該第二差動輸入級的每一電晶體的第二臨界電壓，達到的功效是動態調整金氧半電晶體之臨界電壓的設計方式，透過調整輸入對電晶體的基板電極腳位，來加速比較器，不會影響原先電路架構，並且在改善訊號處理時間上有顯著提升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一差動輸入級</p>
        <p type="p">2:第二差動輸入級</p>
        <p type="p">3:輸出級</p>
        <p type="p">CM1:第一共同端</p>
        <p type="p">CM2:第二共同端</p>
        <p type="p">CM3:第三共同端</p>
        <p type="p">4:臨界電壓調整電路</p>
        <p type="p">VIN+:正相輸入端</p>
        <p type="p">VIN-:反相輸入端</p>
        <p type="p">X:第一輸出端</p>
        <p type="p">Y:第二輸出端</p>
        <p type="p">VDD:工作電壓</p>
        <p type="p">X’:第一回授電壓</p>
        <p type="p">Y’:第二回授電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="319" publication-number="202631057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動床之震動裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250611B">A47C17/86</main-classification>
        <further-classification edition="200601120250611B">A47C21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施權航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施權航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊育其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳邦禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種電動床之震動裝置，包含有一床板、一基座、至少三支撐件以及一震動器；該床板具有一鏤空部，該基座包含有一本體設於該床板、一穿槽設於該本體且與該鏤空部連通、以及至少三懸臂由該本體延伸至該穿槽內，其中各該懸臂具有一連接該本體之第一端、以及一位於該穿槽內之第二端相對於該第一端；各該支撐件具有一基部設於該基座之本體或其中一該懸臂之第一端、以及一延伸部由該基部延伸而出且貼抵於另一該懸臂之第二端；該震動器係位於該鏤空部內且與該些懸臂之第二端連接。藉此，該電動床之震動裝置不僅結構穩固耐用且能傳遞適中的震動力道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電動床之震動裝置</p>
        <p type="p">20:基座</p>
        <p type="p">21:本體</p>
        <p type="p">22:穿槽</p>
        <p type="p">24:懸臂</p>
        <p type="p">25:第一端</p>
        <p type="p">26:第二端</p>
        <p type="p">27:內環</p>
        <p type="p">28:限位部</p>
        <p type="p">29:凸緣</p>
        <p type="p">30:支撐件</p>
        <p type="p">40:震動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="320" publication-number="202631081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學式生理訊號的評價系統和方法以及相關的穿戴式裝置</chinese-title>
        <english-title>EVALUATION SYSTEM AND METHOD FOR OPTICAL PHYSIOLOGICAL SIGNAL AND RELATED WEARABLE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">A61B5/02</main-classification>
        <further-classification edition="200601120250602B">A61B5/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣州印芯半導體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGZHOU TYRAFOS SEMICONDUCTOR TECHNOLOGIES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅旭文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, HSU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴成展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李念齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, NIEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡欣宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇奕安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學式生理訊號的評價方法。所述方法包含以下步驟：擷取數據的步驟；轉換數據的步驟；運算訊號品質指數的步驟；平滑化數據的步驟；運算雜訊比率指數的步驟；以及分析數據的步驟。使用者可藉由本發明輕易檢查其所穿戴用於檢測光學式生理訊號的穿戴裝置是否穿戴正常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An evaluation method for optical physiological signal is provided. The method comprises: a data acquisition step; a signal quality index computation step; a data smoothing step; a noise ratio index computation step; and a data analysis step. A user can easily check if a wearable device he or she wears for detecting optical physiological signal is worn normally.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學式生理訊號評價系統</p>
        <p type="p">110:發光單元</p>
        <p type="p">120:感光單元</p>
        <p type="p">130:訊號處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="321" publication-number="202631756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防偽用複合粒的製法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">C08F257/02</main-classification>
        <further-classification edition="202001120250901B">C08J7/04</further-classification>
        <further-classification edition="200601120250901B">C08J7/12</further-classification>
        <further-classification edition="200601120250901B">C23C18/20</further-classification>
        <further-classification edition="200601120250901B">C23C18/52</further-classification>
        <further-classification edition="200601120250901B">C08F2/44</further-classification>
        <further-classification edition="200601120250901B">C08F212/08</further-classification>
        <further-classification edition="200601120250901B">C08F212/36</further-classification>
        <further-classification edition="200601120250901B">C08J3/12</further-classification>
        <further-classification edition="200601120250901B">C08K9/02</further-classification>
        <further-classification edition="200601120250901B">C08L25/08</further-classification>
        <further-classification edition="201401120250901B">B42D25/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正修學校財團法人正修科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李益成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張簡國平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭惟隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟　克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVAAS, MASIMUKKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防偽用複合粒的製法，包含如下步驟：(a)將多顆核殼型複合粒與處理液進行接枝處理以得到多顆金屬修飾複合粒；及(b)將包含金屬修飾複合粒、第一單體及第二單體的第一混合液與第一起始劑水溶液進行第一聚合處理以製得多顆防偽用複合粒。透過(a)，使每一金屬修飾複合粒具有可供識別的識別特徵；再透過(b)，使每一防偽用複合粒除了具有該識別特徵外還具有穩定的多重核殼結構，因此將防偽用複合粒添加於如繪畫顏料、畫紙、木料、陶瓷、黏著劑等藝術媒材中並進行藝術作品的創作，防偽用複合粒不會與藝術媒材互相影響，且讓藝術作品具備防偽功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="322" publication-number="202633198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背照式影像感測器的製造方法</chinese-title>
        <english-title>MANUFACTURATING METHOD OF BACK SIDE ILLUMINATION IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260223B">H10F39/12</main-classification>
        <further-classification edition="202601120260223B">H10W10/10</further-classification>
        <further-classification edition="202601120260223B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, E JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴郁元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種背照式影像感測器的製造方法，其包括以下步驟。首先，在基底的第一表面上形成第一隔離結構，其包括以下步驟。在基底的第一表面上形成第一開口；對基底的第一開口進行第一蝕刻製程，以形成第一凹陷；以及在基底的第一凹陷中填入第一填充層，且在基底的第一開口中填入第一介電層。接著，在基底的第二表面上形成第二隔離結構，其包括以下步驟。在基底的第二表面上形成第二開口；對基底的第二開口進行第二蝕刻製程，以形成第二凹陷；以及在基底的第二凹陷以及第二開口中填入第二填充層。在本揭露的背照式影像感測器中，第二凹陷的尖端與基板的第一表面之間的最短距離小於第一凹陷的尖端與所述基板的第一表面之間的最短距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a back side illumination image sensor including following steps is provided. Firstly, a first isolation structure is formed on a first surface of a substrate, which includes following steps. Forming a first opening on the first surface of the substrate; performing a first etching process on the first opening of the substrate to form a first recess; and filling a first filling layer in the first recess of the substrate, and filling a first dielectric layer in the first opening of the substrate. Secondly, a second isolation structure is formed on a second surface of the substrate, which includes following steps. Forming a second opening on the second surface of the substrate; performing a second etching process on the second opening of the substrate to form a second recess; and filling a second filling layer in the second recess and the second opening of the substrate. In the back side illumination image sensor, a shortest distance between a tip of the second recess and the first surface of the substrate is smaller than a shortest distance between a tip of the first recess and the first surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:背照式影像感測器</p>
        <p type="p">D1、D2:距離</p>
        <p type="p">FL1:第一填充層</p>
        <p type="p">FL2:第二填充層</p>
        <p type="p">IL1、IL2、IL3:介電層</p>
        <p type="p">IP1:第一凹陷</p>
        <p type="p">IP2:第二凹陷</p>
        <p type="p">IS1、IS2:隔離結構</p>
        <p type="p">OP1、OP2:開口</p>
        <p type="p">PL:保護層</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">SB:基底</p>
        <p type="p">Tr1、Tr2:溝渠</p>
        <p type="p">Z:方向</p>
        <p type="p">t1、t2:尖端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="323" publication-number="202633422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W20/00</main-classification>
        <further-classification edition="202301120260504B">H10B12/00</further-classification>
        <further-classification edition="202601120260504B">H10B80/00</further-classification>
        <further-classification edition="202501120260504B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高孟緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, MENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李書銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構的製造方法，包括以下步驟。提供基底。在基底上形成多個堆疊結構。多個堆疊結構彼此分離。在多個堆疊結構的側壁上形成多個第一間隙壁。在多個第一間隙壁上形成多個第二間隙壁。在多個第二間隙壁上形成多個間隙壁層。在多個間隙壁層上形成多個第一介電層。移除多個第二間隙壁的一部分與多個第一介電層的一部分，而在多個第二間隙壁的上方形成多個第一開口且在多個第一介電層的上方形成多個第二開口。形成多個頂蓋層。多個頂蓋層填入多個第一開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor structure including the following steps is provided. A substrate is provided. Stack structures are formed on the substrate. The stacked structures are separated from each other. First spacers are formed on sidewalls of the stack structures. Second spacers are formed on the first spacers. Spacer layers are formed on the second spacers. First dielectric layers are formed on the spacer layers. A portion of the second spacers and a portion of the first dielectric layers are removed to form first openings above the second spacers and to form second openings above the first dielectric layers. Cap layers are formed. The cap layers fill the first openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基底</p>
        <p type="p">102:隔離結構</p>
        <p type="p">104:堆疊結構</p>
        <p type="p">106,146:導電層</p>
        <p type="p">108:位元線</p>
        <p type="p">110:硬罩幕層</p>
        <p type="p">112,148:阻障層</p>
        <p type="p">114,122,124:介電層</p>
        <p type="p">128,130,132b:間隙壁</p>
        <p type="p">140a:頂蓋層</p>
        <p type="p">142:接觸窗</p>
        <p type="p">144:著陸墊</p>
        <p type="p">OP1,OP2,OP3:開口</p>
        <p type="p">S1:頂面</p>
        <p type="p">SL:狹縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="324" publication-number="202633094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓可調式多晶矽電阻器及其操作方法</chinese-title>
        <english-title>VOLTAGE-TUNABLE POLYSILICON RESISTOR AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250602B">H10D1/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昭龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電壓可調式多晶矽電阻器，包括半導體基板、元件隔離結構、至少一多晶矽電阻結構、多晶矽控制層以及介電層，其中元件隔離結構設置於半導體基板內，以定義出主動區。多晶矽電阻結構設置於主動區上。多晶矽控制層設置於多晶矽電阻結構上，且多晶矽控制層耦合至一控制電壓源，以調變所述多晶矽電阻結構的電阻值。介電層則是設置於多晶矽控制層與多晶矽電阻結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage-tunable polysilicon resistor includes a semiconductor substrate, a device isolation structure, at least one polysilicon resistor structure, a polysilicon control layer and a dielectric layer, wherein the device isolation structure is disposed in the semiconductor substrate to define an active area. The polysilicon resistor structure is disposed on the active area. The polysilicon control layer is disposed on the polysilicon resistor structure, and the polysilicon control layer is coupled to a control voltage source to modulate the resistance value of the polysilicon resistor structure. The dielectric layer is disposed between the polysilicon control layer and the polysilicon resistor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:元件隔離結構</p>
        <p type="p">104:多晶矽電阻結構</p>
        <p type="p">106:多晶矽控制層</p>
        <p type="p">AA:主動區</p>
        <p type="p">c1:第一接觸窗</p>
        <p type="p">c2:第二接觸窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="325" publication-number="202633051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路佈局方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H05K7/02</main-classification>
        <further-classification edition="200601120250401B">H05K3/00</further-classification>
        <further-classification edition="202001120250401B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江柏叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖胤棨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路佈局方法，經由一運算裝置來實施，適用於一包含一未佈線之待佈線印刷電路板的電路板影像及一包含一用於參考佈線之參考印刷電路板的參考電路板影像，該待佈線印刷電路板包含多個用於以導線彼此連接的待配線配對連接組，每一待配線配對連接組包含一起始連接點及對應該起始連接點的一終點連接點，該運算裝置包含一處理模組，對於該待佈線印刷電路板，該處理模組根據一對應該待配線配對連接組的當前佈局狀態獲得一對應該當前布局狀態的當前調整狀態，以獲得一作為完成電路佈線的目標印刷電路板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21~26:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="326" publication-number="202632494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料管理裝置及資料管理方法</chinese-title>
        <english-title>DATA MANAGEMENT DEVICE AND DATA MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250602B">G06F8/70</main-classification>
        <further-classification edition="201801120250602B">G06F9/44</further-classification>
        <further-classification edition="200601120250602B">G06F13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祥碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMEDIA TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資料管理方法包括：提供外部版本資訊至第一控制器，其中外部版本資訊對應於本機裝置的儲存電路所儲存的資料部分，且資料部分對應於本機版本資訊；以及由第一控制器根據外部版本資訊與本機版本資訊來產生更新觸發訊號，藉由更新觸發訊號以觸發應用程式更新資料部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data management method includes: providing external version information to a first controller, in which the external corresponds to a data part stored by a storage circuit in a host device and the data part corresponds to the host version information; and generating, by the first controller, an update trigger signal according to the external version information and the host version information, triggering an application program to update the data part by the update trigger signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="327" publication-number="202631547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高導熱抗靜電陶瓷材料及其成型工件的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C04B35/78</main-classification>
        <further-classification edition="200601120250501B">C04B35/622</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金佳美精密陶瓷有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種高導熱抗靜電陶瓷材料及其成型工件的方法，高導熱抗靜電陶瓷材料包括陶瓷基材、第一導熱增強相、第二導熱增強相、體積電阻率微調相和輔助穩定相，第一導熱增強相為石墨烯或其衍生材料，第二導熱增強相為鑽石粉，體積電阻率微調相為非金屬碳化物、非金屬氮化物、金屬氧化物或其組合，輔助穩定相為矽酸鹽、氧化物陶瓷材料、氮化物陶瓷材料或其組合。藉此，高導熱抗靜電陶瓷材料具備優異的熱傳導性能和穩定的抗靜電性能，且其成型的陶瓷工件可在高溫、高濕等極端環境下展現出卓越的環境穩定性和機械強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20、S30、S40、S50:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="328" publication-number="202632377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼鏡裝置</chinese-title>
        <english-title>EYEGLASS DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">G02B27/01</main-classification>
        <further-classification edition="200601120250207B">H01Q1/22</further-classification>
        <further-classification edition="200601120250207B">H01Q1/44</further-classification>
        <further-classification edition="200601120250207B">G02C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃自豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, PO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張效峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧秉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種眼鏡裝置，包括一鏡框、一第一鏡腿、一電路板及一軟性電路板。鏡框包括一第一金屬部分、一第二金屬部分及連接第一金屬部分與第二金屬部分之間的一絕緣組件，第二金屬部分透過絕緣組件絕緣於第一金屬部分，第一金屬部分與第二金屬部分共同形成鏡框的外觀面的至少一部分。第一鏡腿樞接於鏡框。電路板設置於第一鏡腿內。軟性電路板設置於鏡框與第一鏡腿，且導通於第二金屬部分與電路板，軟性電路板包括一天線匹配電路。第二金屬部分作為一天線，天線搭配天線匹配電路，激發出一第一頻段與一第二頻段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An eyeglass device includes a frame, a first temple, a circuit board and a flexible circuit board. The frame includes a first metal part, a second metal part and an insulating component connecting the first metal part and the second metal part. The second metal part is insulated from the first metal part by the insulating component. At least a part of an appearance of the frame is formed by the first metal part and the second metal part together. The first temple is pivotally connected to the frame. The circuit board is arranged in the first temple. The flexible circuit board is disposed on the frame and the first temple and is electrically connected to the second metal part and the circuit board. The flexible circuit board includes an antenna matching circuit. The second metal part serves as an antenna, and the antenna with the antenna matching circuit is excited at a first frequency band and a second frequency band.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:鏡框</p>
        <p type="p">111:第一金屬部分</p>
        <p type="p">112:第二金屬部分</p>
        <p type="p">113:天線</p>
        <p type="p">114:絕緣組件</p>
        <p type="p">116:鼻樑部</p>
        <p type="p">130:電路板</p>
        <p type="p">140:軟性電路板</p>
        <p type="p">142:天線匹配電路</p>
        <p type="p">144:電感</p>
        <p type="p">146:電容</p>
        <p type="p">150:金屬固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="329" publication-number="202632575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網站導購方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250422B">G06Q30/0214</main-classification>
        <further-classification edition="202301120250422B">G06Q30/0217</further-classification>
        <further-classification edition="202301120250422B">G06Q30/0601</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供是一種網站導購系統，其包括有一用戶管理裝置，用來管理用戶註冊、登入、身份、用戶、帳戶、購物歷史相關資訊；一簡訊和信箱功能裝置，對於用戶註冊、登入時進行安全驗證的簡訊或寄信功能；一商家管理裝置，建立與編輯商家的標示與網站連結；一抽獎回饋裝置，設定共同的抽獎回饋模式，對於交易成功的用戶開放抽獎回饋功能，並在通過審核後將獎勵撥給用戶；以及一導購管理裝置，連結用戶管理裝置、簡訊和信箱功能裝置、商家管理裝置、抽獎回饋裝置以整合管理所有功能。首先用戶登入購物網站，在購物網站找到適合商品，點擊連結以轉頁到商家網站，並夾帶用戶參數進行購買；交易完成後，商家以購物網站提供的API，將所需資訊正確帶回購物網站，購物網站根據預設的抽獎回饋模式，對於交易成功的用戶開放抽獎回饋功能，並在通過審核後將獎勵撥給用戶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用戶管理裝置</p>
        <p type="p">110:簡訊和信箱功能裝置</p>
        <p type="p">120:商家管理裝置</p>
        <p type="p">130:抽獎回饋裝置</p>
        <p type="p">140:導購管理裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="330" publication-number="202632617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合生理感測及火災感測的監控系統</chinese-title>
        <english-title>MONITORING SYSTEM THAT COMBINES PHYSIOLOGICAL SENSING AND FIRE SENSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G08B17/00</main-classification>
        <further-classification edition="200601120250401B">G01S13/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>空軍航空技術學院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIR FORCE INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JHENG LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JHENG LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種結合生理感測及火災感測的監控系統，包含至少一第一偵測單元及一整合單元，該第一偵測單元包括一第一偵測控制模組、一第一雷達偵測模組、一第一火災偵測模組及一第一偵測傳輸模組，該整合單元包括一資料整合模組、一場域地圖模組及一整合輸出模組，該第一雷達偵測模組可以穿透煙霧偵測生物體，當火災發生但沒有人員受困時輸出第一級警報，當火災發生且偵測到人員受困時輸出第二級警報，該第一偵測控制模組將警報資訊傳輸至該資料整合模組，該資料整合模組將警報資訊整合於該場域地圖模組中，並顯示於該整合輸出模組上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A monitoring system that combines physiological sensing and fire sensing includes at least a first detection unit and an integration unit. The first detection unit includes a first detection control module, a first radar detection module, a first fire detection module and a first detection transmission module. The integration unit includes a data integration module, a field map module and an integration output module. The first radar detection module can detect living organisms through smoke. The first level alarm is output when a fire occurs but no one is trapped. When a fire occurs and a person is trapped, a second level alarm is output. The first detection control module transmits alarm information to the data integration module. The data integration module integrates alarm information into the field map module and displays it on the integrated output module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:第一偵測單元</p>
        <p type="p">31:第一偵測控制模組</p>
        <p type="p">34:第一偵測傳輸模組</p>
        <p type="p">4:整合單元</p>
        <p type="p">41:資料整合模組</p>
        <p type="p">42:場域地圖模組</p>
        <p type="p">43:整合輸出模組</p>
        <p type="p">431:同步輸出組件</p>
        <p type="p">44:第二定位模組</p>
        <p type="p">45:立體顯示模組</p>
        <p type="p">5:第二偵測單元</p>
        <p type="p">51:第二資訊匯合模組</p>
        <p type="p">52:第二偵測控制模組</p>
        <p type="p">55:第二偵測傳輸模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="331" publication-number="202632548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安養服務管理系統</chinese-title>
        <english-title>NURSING MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q10/06</main-classification>
        <further-classification edition="202301120250401B">G06Q10/105</further-classification>
        <further-classification edition="202401120250401B">G06Q50/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>軒陽科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORN SUN TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張萬子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WAN-ZEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種安養機構管理系統及方法，係包含一時間銀行管理機制，將照護工作內容依類別、所需專業技術、體力、性質、…等細分，並給予編碼，如此僅部分編碼對應的照護工作需聘用專業人員，其餘可採用非專業人員。鑑定住民(含外部住民)的服務需求及提供服務能力的種類，並授予對應的編碼，如此使用者(住民)可以同時具有服務提供及(或)服務需求的身分，住民可成為主要照護人力來源。在安養院或社區住民群居地區，可拓展成為”串連服務鏈”模式，進一步降低照護人力需求。時間銀行的媒合機制簡化為工作排程(排班)，沒有媒合/兌領困難的問題。降低機構外聘人力需求，因而可降低收費，住民同理心的互相服務可提高品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Nursing management system and method , includes a time-banking , whereby nursing work is subdivided according to type, professional skills required, physical strength, characteristic, ...etc., and assigned a code, so that only part of the nursing work corresponding to the code requires the employment of professional staff, while the rest can use non-professional people. Identify the service needs and service provision capacity of residents (including external residents) and assign corresponding codes, so that users (residents) can have both service provision and/or service need status, and residents can become the main source of nursing manpower. In nursing homes or areas with a large number of residents in the community, it can be developed into a ‘chain of service’ model to further reduce the demand for nursing manpower. The Time Bank's matching mechanism simplifies work scheduling, eliminating the problem of matchmaking/cash-out difficulties. Reducing the need for external manpower in organizations reduces fees, and empathetic mutual service between residents improves quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:安養管理平台</p>
        <p type="p">11:院務管理次系統</p>
        <p type="p">12:醫療照護次系統</p>
        <p type="p">20:使用者管理次系統</p>
        <p type="p">30:工作分類次系統</p>
        <p type="p">40:服務能力次系統</p>
        <p type="p">50:服務需求次系統</p>
        <p type="p">60:時間排序次系統</p>
        <p type="p">61:時間銀行子系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="332" publication-number="202632009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用高溫乾式培燒回收鋁鎳渣中有價金屬之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR RECOVERING VALUABLE METALS FROM BLUE SLUDGE THROUGH HIGH-TEMPERATURE DRY ROASTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">C22B1/02</main-classification>
        <further-classification edition="200601120250213B">C22B7/00</further-classification>
        <further-classification edition="200601120250213B">C22B9/02</further-classification>
        <further-classification edition="200601120250213B">G01N31/02</further-classification>
        <further-classification edition="200601120250213B">G01N31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉禎淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHEN SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種利用高溫乾式培燒回收鋁鎳渣中有價金屬之系統及方法，該系統係包含：混合裝置、高溫乾式培燒裝置、水解裝置、離心過濾裝置及沉澱裝置。本發明藉由先於鹼環境下進行高溫乾式培燒反應、水解反應，並進行離心過濾程序分離出含鋁離子之鹼溶出液及含鎳殘渣，含鋁離子之鹼溶出液再進行沉澱反應得到氫氧化鋁產物。含鎳殘渣再進行酸浸出反應及沉澱反應得到氫氧化鎳產物，而可有效溶出並分離鋁鎳渣當中的鋁離子、鎳離子，提升鋁鎳渣的金屬回收率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and method for recovering valuable metals from blue sludge through high-temperature dry roasting. The system comprises a mixing device, a high-temperature dry roasting device, a hydrolysis device, a centrifugal filtration device, and precipitation devices. The present invention involves performing a high-temperature dry roasting reaction and a hydrolysis reaction in an alkaline environment, followed by a centrifugation and filtration process to separate the alkaline leachate containing aluminum ions and the nickel-containing residue. The alkaline leachate containing aluminum ions is then subjected to a precipitation reaction to obtain an aluminum hydroxide product. The nickel-containing residue is subsequently subjected to an acid leaching reaction and a precipitation reaction to obtain a nickel hydroxide product. This method performs effectively dissolves and separates aluminum ions and nickel ions from blue sludge, thereby enhancing the recovery rate of metals from the blue sludge.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="333" publication-number="202631249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用高壓釜反應回收鋁鎳渣中有價金屬之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR RECOVERING VALUABLE METALS FROM BLUE SLUDGE THROUGH AUTOCLAVE REACTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">B01J3/04</main-classification>
        <further-classification edition="202201120250213B">C01F7/02</further-classification>
        <further-classification edition="202501120250213B">C01G53/05</further-classification>
        <further-classification edition="200601120250213B">C01G53/10</further-classification>
        <further-classification edition="200601120250213B">C22B9/02</further-classification>
        <further-classification edition="200601120250213B">G01N31/02</further-classification>
        <further-classification edition="200601120250213B">G01N31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉禎淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHEN SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種利用高壓釜反應回收鋁鎳渣中有價金屬之系統及方法，該系統係包含：高壓釜、離心過濾裝置及沉澱裝置。本發明藉由先在高壓釜中進行鹼溶出反應，並進行離心過濾程序分離出含鋁離子之鹼溶出液及含鎳殘渣，含鋁離子之鹼溶出液再進行沉澱反應得到氫氧化鋁產物。含鎳殘渣再進行酸浸出反應及沉澱反應得到氫氧化鎳產物，據此可在無需將鋁鎳渣進行前處理的情況下，仍能快速有效分離鋁鎳渣當中的鋁離子、鎳離子，提升鋁鎳渣的金屬回收率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and method for recovering valuable metals from blue sludge through an autoclave reaction. The system comprises an autoclave, a centrifugal filtration device, and precipitation devices. The present invention involves first performing an alkaline leaching reaction in the autoclave, followed by a centrifugation and filtration process to separate the alkaline leachate containing aluminum ions and the nickel-containing residue. The alkaline leachate containing aluminum ions is then subjected to a precipitation reaction to obtain an aluminum hydroxide product. The nickel-containing residue is subsequently subjected to an acid leaching reaction and a precipitation reaction to obtain a nickel hydroxide product. This method allows for the rapid and efficient separation of aluminum ions and nickel ions from blue sludge without the need for pretreatment, thereby improving the recovery rate of metals from the blue sludge.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="334" publication-number="202632310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改善訊號解析度的波形調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01S7/292</main-classification>
        <further-classification edition="200601120250401B">G01S7/32</further-classification>
        <further-classification edition="200601120250401B">G01S13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐育溙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, YU-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種改善訊號解析度的波形調整方法，適用於對一接收信號所對應的一待調整波形進行波形調整，對於該待調整波形的每一待調整點，包含以下步驟：(A)當該待調整點為一目標點時，將該目標點的波值調整為對應有最大波值的待調整點之波值並將其作為一調整後波形的最高點，其中該目標點為自該對應有最大波值的待調整點與至少一鄰近該對應有最大波值之待調整點的鄰近待調整點所選出；及(B)當該待調整點不為該目標點時，調整該待調整點，以使該調整後波形之上升部分與下降部分的夾角小於該待調整波形之上升部分與下降部分的夾角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51~53:步驟</p>
        <p type="p">531~532:子步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="335" publication-number="202633008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250314B">H05B45/30</main-classification>
        <further-classification edition="202001120250314B">H05B45/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祥碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMEDIA TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光裝置。發光裝置包括控制電路以及發光元件串。控制電路輸出驅動電源。發光元件串包括多個發光元件、電源線、第一接收埠以及第二接收埠。電源線連接於所述多個發光元件。電源線的第一端連接於第一級發光元件。電源線的第二端連接於最後一級發光元件。第一接收埠將驅動電源提供至電源線的第一端。第二接收埠將驅動電源提供至電源線的第二端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting device is provided. The light emitting device includes a control circuit and a light emitting element string. The control circuit outputs a driving power. The light emitting element string includes light emitting elements, a power line, a first receiving port and a second receiving port. The power line is connected to the light emitting elements. A first terminal of the power line is connected to the first-stage light-emitting element. The second terminal of the power line is connected to the last-stage light-emitting element. The first receiving port provides the driving power to the first terminal of the power line. The second receiving port provides the driving power to the second terminal of the power line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">110:控制電路</p>
        <p type="p">120:發光元件串</p>
        <p type="p">121:電源線</p>
        <p type="p">122_1、122_2:接收埠</p>
        <p type="p">PDR:驅動電源</p>
        <p type="p">LD1~LDn:發光元件</p>
        <p type="p">TPR1、TPR2:電源接收端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="336" publication-number="202632525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線路配置裝置及方法</chinese-title>
        <english-title>CIRCUIT CONFIGURATION DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250401B">G06F30/00</main-classification>
        <further-classification edition="202001120250401B">G06F30/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許溪河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSI-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪祥睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIANG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾偉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WEI-GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林存森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉裕凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡長在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHANG-TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜禹萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, YU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, BO-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種線路配置裝置及方法。所述方法適用於降壓線路，包括下列步驟：根據降壓線路的設計規範，評估適合於降壓線路的電感量範圍；根據設計規範及電感量範圍，測試出分別與在電感量範圍中的多個電感量相對應的多個效率曲線；分析效率曲線，以獲得一或多個效率曲線交叉點；以及根據電感量範圍及效率曲線交叉點，規劃配置於降壓線路上的電感區域。電感區域包括一或多個電感組。每個電感組由多個電感元件串聯之後封裝形成。電感區域所形成的線路電感量隨著降壓線路的狀態而變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit configuration device and a circuit configuration method are provided. The method is applicable to a buck circuit and comprising the following steps: evaluating an inductance range suitable for the buck circuit according to a design specification of the buck circuit; testing a plurality of efficiency curves respectively corresponding to a plurality of inductance values within the inductance range according to the design specification and the inductance range; analyzing the efficiency curves to obtain one or more efficiency curve intersection points; planning an inductor region to be configured on the buck circuit based on the inductance range and the efficiency curve intersection point. The inductor region comprises one or more inductor groups. Each inductor group is formed by packaging a plurality of inductor elements connected in series. The circuit inductance formed by the inductor region varies with a state of the buck circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S400~S406:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="337" publication-number="202632680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳癌評估以人工智慧輔助進行診斷效果分析系統及其方法</chinese-title>
        <english-title>AI-ASSISTED DIAGNOSIS-EFFECT ANALYZING SYSTEM AND METHOD THEREOF FOR BREAST CANCER ASSESSMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250328B">G16H50/20</main-classification>
        <further-classification edition="201801120250328B">G16H30/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乳癌評估以人工智慧輔助進行診斷效果分析方法包含：於數個乳癌掃描個案影像偵測一乳房異常囊腫，以便取得一乳房異常囊腫區域；於該乳房異常囊腫區域進行一異常囊腫評估作業，以便獲得一已評估乳房異常囊腫個案資料；提供一待評估乳房異常囊腫資料；將該已評估乳房異常囊腫個案資料對應於該待評估乳房異常囊腫資料；將該已評估乳房異常囊腫資料及待評估乳房異常囊腫資料結合數個乳癌特徵參數以數個人工智慧運算工具進行人工智慧運算，以便獲得數個乳房囊腫診斷評估結果資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AI-assisted diagnosis-effect analyzing method includes: detecting an abnormal breast cyst in a breast-cancer scan image to obtain a breast cyst region; processing a breast-cancer assessment procedure to the breast cyst region to obtain a case-assessed breast-cancer data; providing an abnormal breast cyst data; correspondingly connecting the abnormal breast cyst data with the case-assessed breast-cancer data; operating an AI computing tool the abnormal breast cyst data and the case-assessed breast-cancer data which are combined with a plurality of breast-cancer feature data to obtain a plurality of result and analysis data of diagnosis assessment data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸入單元</p>
        <p type="p">10:待評估乳房異常囊腫資料</p>
        <p type="p">2:AI計算單元</p>
        <p type="p">20:人工智慧運算工具</p>
        <p type="p">21:乳癌掃描個案影像資料庫</p>
        <p type="p">22:已評估乳房異常囊腫資料庫</p>
        <p type="p">3:輸出單元</p>
        <p type="p">30:乳房囊腫診斷評估結果資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="338" publication-number="202633020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250505B">H05K1/02</main-classification>
        <further-classification edition="200601120250505B">H05K3/00</further-classification>
        <further-classification edition="200601120250505B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板包含第一外部結構、第二外部結構、內部結構以及複合材料層。第一外部結構包含設置於第一外部結構中的第一外部增強層。第二外部結構包含設置於第二外部結構中的第二外部增強層。內部結構設置於第一外部結構與第二外部結構之間，其中內部結構中具有沿著第一方向延伸的空腔，空腔是貫穿內部結構而形成，第一外部增強層位於空腔的頂部，空腔暴露出一部分的第一外部增強層，且第二外部增強層位於空腔的底部，空腔暴露出一部分的第二外部增強層。複合材料層圍繞空腔、第一外部結構以及第二外部結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board includes a first exterior structure, a second exterior structure, an interior structure, and a composite material layer. The first exterior structure includes a first exterior reinforcement layer disposed in the first exterior structure. The second exterior structure includes a second exterior reinforcement layer disposed in the second exterior structure. The interior structure is disposed between the first exterior structure and the second exterior structure, wherein the interior structure has a cavity extending along a first direction, the cavity is formed through the interior structure, the first exterior reinforcement layer is located on a top of the cavity , the cavity exposes a portion of the first exterior reinforcement layer, the second exterior reinforcement layer is located at a bottom of the cavity, and the cavity exposes a portion of the second exterior reinforcement layer. The composite material layer surrounds the cavity, the first exterior structure, and the second exterior structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板</p>
        <p type="p">110:第一外部結構</p>
        <p type="p">112:第一外部增強層</p>
        <p type="p">113:第一外部絕緣層</p>
        <p type="p">114:第二外部絕緣層</p>
        <p type="p">115:第一外部黏合層</p>
        <p type="p">116:線路層</p>
        <p type="p">117:第一外部線路層</p>
        <p type="p">120:第二外部結構</p>
        <p type="p">122:第二外部增強層</p>
        <p type="p">123:第三外部絕緣層</p>
        <p type="p">124:第四外部絕緣層</p>
        <p type="p">125:第二外部黏合層</p>
        <p type="p">126:線路層</p>
        <p type="p">127:第二外部線路層</p>
        <p type="p">130:內部結構</p>
        <p type="p">134:內部絕緣層</p>
        <p type="p">135:線路層</p>
        <p type="p">136:線路層</p>
        <p type="p">137:第一內部黏合層</p>
        <p type="p">138:第二內部黏合層</p>
        <p type="p">140:複合材料層</p>
        <p type="p">152,154:介電層</p>
        <p type="p">162,164:覆蓋層</p>
        <p type="p">172,174:防焊層</p>
        <p type="p">182,184:化金層</p>
        <p type="p">192,194:錫膏</p>
        <p type="p">CA:空腔</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">EC1,EC2:電子零件</p>
        <p type="p">s1,s2,s3,s4,s5:側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="339" publication-number="202632133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降門系統及其門機裝置</chinese-title>
        <english-title>GARAGE DOOR SYSTEM AND DOOR MACHINE DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">E06B9/56</main-classification>
        <further-classification edition="200601120250228B">E06B7/096</further-classification>
        <further-classification edition="200601120250228B">E06B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝仲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝仲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種升降門系統包含門片、傳動組件、鋼索捲筒、鋼索及門機裝置。門機裝置包含馬達組件、致動組件、棘輪保持裝置及控制器。馬達組件具有轉軸，動力連接於軸桿。致動組件具有棘輪及齒輪系。齒輪系動力連接於轉軸，棘輪動力連接於齒輪系。響應於馬達組件驅動轉軸轉動，而棘輪對應地產生扭矩。棘輪保持裝置用以對棘輪產生定位保持力。控制器用以依據偵測訊號和調整參數產生控制訊號，以驅使定位保持力依據控制訊號進行調整。調整參數保持定位保持力大於或等於扭矩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A garage door system includes a door panel, a transmission assembly, a cable drum, a cable, and a door machine device. The door machine device includes a motor assembly, an actuation assembly, a ratchet retention device and a controller. The motor assembly has a rotating shaft, which is power-connected to the shaft. The actuation assembly includes a ratchet and a gear train. The gear train is power-connected to the rotating shaft, and the ratchet power-connected to the gear train. In response to the motor assembly drives the shaft to rotate, the ratchet correspondingly generates a torque. The ratchet retention device provides a positioning retention force to the ratchet. The controller is configured to generate a control signal according to a detection signal and an adjustment parameter to adjust the positioning retention force by a control signal. The adjustment parameters ensure that the positioning retention force is greater than or equal to the torque.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:升降門系統</p>
        <p type="p">102:門片</p>
        <p type="p">104:傳動組件</p>
        <p type="p">106:鋼索捲筒</p>
        <p type="p">108:鋼索</p>
        <p type="p">110:門機裝置</p>
        <p type="p">112:軸桿</p>
        <p type="p">122:轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="340" publication-number="202632248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用雷射測試含矽元件之方法</chinese-title>
        <english-title>METHOD OF TESTING SILICON CONTAINING COMPONENTS USING LASERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G01N21/39</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種使用雷射測試含矽元件之方法，其係藉由一訊號產生器使一參考電路產生一第一訊號，且使用一雷射光線掃描該電路，當該雷射光線掃描至該參考電路之一含矽元件並產生一電流時使該參考電路產生一第二訊號，一控制單元依據該第一訊號以及該第二訊號得到一錯誤率，且當該錯誤率大於一門檻值時該控制單元使一警示單元傳送一警示訊號，本發明透過提供該使用雷射測試含矽元件之方法解決習知電路在進行抗輻射測試時因須使用粒子加速器而導致測試成本昂貴、測試環境危險以及難以針對小區域電路進行檢測之問題，並藉由錯誤率及不同用途之門檻值比較達到快速檢測電路之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method of testing silicon-containing components using lasers. The method uses a signal generator to make a reference circuit generate a first signal, and uses a laser beam to scan the circuit. When the laser beam scan a silicon-containing element of the reference circuit and generates a current, the reference circuit generates a second signal. A control unit obtains an error rate according to the first signal and the second signal, and when the error rate is greater than a threshold value The control unit causes an alarm unit to transmit an alarm signal. The present invention provides a method for testing silicon-containing components using lasers to solve the problems of expensive testing costs, dangerous testing environments, and difficulty in testing small-area circuits due to the need to use a particle accelerator when performing radiation resistance testing on conventional circuits. By comparing the error rate and threshold values for different purposes, the circuit can be quickly tested.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S60:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="341" publication-number="202633034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K3/10</main-classification>
        <further-classification edition="202601120260504B">H05K1/18</further-classification>
        <further-classification edition="200601120260504B">H05K3/46</further-classification>
        <further-classification edition="200601120260504B">H01F7/06</further-classification>
        <further-classification edition="200601120260504B">H01F5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板包含第一外部結構、第二外部結構以及設置於第一外部結構與第二外部結構之間的內部結構。內部結構的第一內部線路層包含位於第一外側區域的第一線圈迴路，其中第一線圈迴路電性連接至第一外部結構。內部結構的可拉伸導電層設置於第一外部結構與第二外部結構之間，並包含位於中心區域的兩個中心金屬單元，其中兩個中心金屬單元彼此分開。內部結構的第二內部線路層包含位於第一外側區域的第二線圈迴路，其中第二線圈迴路電性連接至第二外部結構，且第一線圈迴路相對於第二線圈迴路而設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board includes a first exterior structure, a second exterior structure, and an interior structure disposed between the first exterior structure and the exterior external structure. A first inner circuit layer of the interior structure includes a first coil circuit located in a first peripheral region, in which the first coil circuit is electrically connected to the first exterior structure. A stretchable conductive layer of the interior structure is disposed between the first exterior structure and the second exterior structure, and includes two central metal units located in a central region, in which the two central metal units are separated from each other. A second inner circuit layer of the interior structure includes a second coil circuit located in the first peripheral region, in which the second coil circuit is electrically connected to the second exterior structure, and the first coil circuit is disposed relative to the second coil circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電路板</p>
        <p type="p">210:第一外部結構</p>
        <p type="p">212:外部絕緣層</p>
        <p type="p">214:線路層</p>
        <p type="p">220:第二外部結構</p>
        <p type="p">222:外部絕緣層</p>
        <p type="p">224:線路層</p>
        <p type="p">230:內部結構</p>
        <p type="p">232:內部絕緣層</p>
        <p type="p">234:第一內部線路層</p>
        <p type="p">236:可拉伸導電層</p>
        <p type="p">238:第二內部線路層</p>
        <p type="p">240:防焊層</p>
        <p type="p">250:黏合層</p>
        <p type="p">C1:第一線圈迴路</p>
        <p type="p">C2:第二線圈迴路</p>
        <p type="p">C3:第三線圈迴路</p>
        <p type="p">C4:第四線圈迴路</p>
        <p type="p">CA1:第一空腔</p>
        <p type="p">CA2:第二空腔</p>
        <p type="p">CA3:第三空腔</p>
        <p type="p">CR:中心區域</p>
        <p type="p">CU1,CU2:中心金屬單元</p>
        <p type="p">D1:第一主動元件</p>
        <p type="p">D2:第二主動元件</p>
        <p type="p">D3:第三主動元件</p>
        <p type="p">D4:第四主動元件</p>
        <p type="p">GND1,GND2:接地層</p>
        <p type="p">LU1:第一外側金屬單元</p>
        <p type="p">LU2:第二外側金屬單元</p>
        <p type="p">PR1:第一外側區域</p>
        <p type="p">PR2:第二外側區域</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">T3:第三厚度</p>
        <p type="p">TL:傳輸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="342" publication-number="202632595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>健康餐廳之服務方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250401B">G06Q50/12</main-classification>
        <further-classification edition="202301120250401B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>壹便利餐飲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯尊中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種健康餐廳之服務方法及系統，健康餐廳之服務方法係包含提供可蒸烤之食物容器、蒸烤用餐食物、提供用餐食物之熱量及用餐時間提示，該健康餐廳之服務系統包含一取餐電子裝置、一結帳電子裝置，該結帳電子裝置包含有相互資訊連接之一第二顯示單元、一第二讀取單元、一第二處理單元、一列印單元。藉由採用可蒸烤之食物容器來蒸烤用餐食物，避免微波加熱食物有害健康之缺點，讓用餐者可享用到原汁、原味、營養成分不流失之美食，增進飲食之營養、健康，並於結帳時提供給用餐者選用之用餐食物之熱量資料及用餐時間，讓用餐者有效地知道進而可控制每日應該攝取之正確食物熱量，做好飲食控制，避免肥胖並促進身體健康，並使餐廳服務達到美味、健康、公平之目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:提供可蒸烤之食物容器</p>
        <p type="p">S2:蒸烤用餐食物</p>
        <p type="p">S3:提供用餐食物之熱量及用餐時間提示</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="343" publication-number="202631299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>精密加工設備的低膨脹係數量測支架</chinese-title>
        <english-title>LOW THERMAL EXPANSION SUSPENSION FRAME OF PRECISION MACHINING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250610B">B23Q1/74</main-classification>
        <further-classification edition="200601120250610B">B23Q1/76</further-classification>
        <further-classification edition="200601120250610B">B23Q17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中正大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG CHENG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊鎮瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, ZHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉德騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DE-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種精密加工設備的低膨脹係數量測支架，該精密加工設備具有一底座、一立柱、一主軸頭、一主軸以及該量測支架，該立柱可移動地設置在該底座上，該主軸頭可移動地連接該立柱，該主軸設置在該主軸頭的底端，該量測支架可拆卸地連接該底座並鄰近該主軸，其中該量測支架包括：二固定板，相互間隔地固定在該底座以及在該主軸下方；二橫架，架設在該二固定板上，該二橫架相互間隔設置且大致與該二固定板垂直；以及一工作台，設置在該二橫架上；其中該二固定板、該二橫架與該工作台具有一低膨脹係數結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low thermal expansion suspension frame of precision machining apparatus is disclosed. The precision machining apparatus has a base, a column, a spindle head, a main spindle and the suspension frame. The column is movably arranged on the base. The spindle head is movably connected to the column. The main spindle is arranged at the bottom of the spindle head. The suspension frame is detachably connected to the base and adjacent to the spindle. The suspension frame includes: two fixed plates, spaced apart each other, fixed on the base and located below the main spindle; and two horizontal stands, arranged on the two fixed plates, the two horizontal stands are spaced apart from each other and are roughly perpendicular to the two fixed plates, and the worktable is arranged on the two horizontal stands; wherein the two fixed plates, the two horizontal stands and the worktable have a low expansion coefficient structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:工作台</p>
        <p type="p">200:量測支架</p>
        <p type="p">210:固定板</p>
        <p type="p">220:橫架</p>
        <p type="p">300:立架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="344" publication-number="202632309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層陶瓷電容瑕疵預測裝置</chinese-title>
        <english-title>A MULTILAYER CERAMIC CAPACITOR DEFECT PREDICTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250501B">G01R31/64</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲鈜科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMHOLD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慶章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING, CHANG CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃屏瓚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING-TZAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層陶瓷電容瑕疵預測裝置，包括：加熱溫控單元，加熱溫控單元上形成有加熱區，用以對複數批待檢驗積層陶瓷電容進行溫度變化循環；檢測單元，用以取得複數批待檢驗積層陶瓷電容相對應的電氣數值；模型取得單元，用以收集電氣數值；數值擬合模組，依據電氣數值透過峰鑑別演算法，用以產生模型擬合曲線後，再透過回歸標準差計算，產生閥值；耐用性預測模組，依據閥值透過雙向異質聯想記憶模型，進行電氣數值對應的積層陶瓷電容的瑕疵等級分類；以及處理單元，依據瑕疵等級分類，預測積層陶瓷電容的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multilayer ceramic capacitor defect prediction device comprises a heating temperature control unit, a detection unit, a model acquisition unit, a data fitting module, a durability prediction module, and a processing unit. The heating temperature control unit is formed with a heating zone to perform temperature variation cycles on multiple batches of multilayer ceramic capacitors to be inspected. The detection unit is used to obtain the corresponding electrical values of the capacitors. The model acquisition unit collects these electrical values, and the data fitting module generates a model fitting curve based on the electrical values using a peak identification algorithm. It then calculates a threshold through regression standard deviation. The durability prediction module uses the threshold and employs a bidirectional hetero-associative memory (BHAM) model to classify the defect levels corresponding to the electrical values of the multilayer ceramic capacitors. Finally, the processing unit predicts the service life of the capacitors based on their defect level classification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:加熱溫控單元</p>
        <p type="p">12:檢測單元</p>
        <p type="p">13:模型取得單元</p>
        <p type="p">14:數值擬合模組</p>
        <p type="p">15:耐用性預測模組</p>
        <p type="p">16:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="345" publication-number="202633040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層電路板及其製作方法</chinese-title>
        <english-title>MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">H05K3/46</main-classification>
        <further-classification edition="200601120250318B">H05K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何明展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MING-JAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張豐繹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多層電路板及其製作方法。多層電路板包括線路結構層、黏著層與導電柱。線路結構層彼此堆疊，且各自包括線路層、至少一個第一凹槽與至少一個第二凹槽。第一凹槽與第二凹槽從線路層朝向遠離線路層的方向而延伸，而第一凹槽與第二凹槽的寬度從線路層朝向遠離線路層的方向而遞增，其中相鄰兩個的線路結構層的第一凹槽與第二凹槽彼此連通與形成空腔，增加輕薄度，有助於符合高頻應用的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multilayer circuit board and a method of manufacturing multilayer circuit board are provided. The multilayer circuit board includes a plurality of circuit structure layers, adhesive layers, and conductor pillars. The circuit structure layers are stacked each other, and each includes a line layer, at least one first recess, and at least one second recess. The first recesses and the second recesses extend in a direction from the line layer toward away from the line layer, and a width of the first recesses and the second recesses increases in a direction from the line layer toward away from the line layer, in which the first recesses and the second recesses of two adjacent circuit structure layers are connected to the other and formed cavities that increase lightness and help meet the demands of high-frequency applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多層電路板</p>
        <p type="p">210、220、230、240、250:線路結構層</p>
        <p type="p">112、113、115、117、119:線路層</p>
        <p type="p">114:第一凹槽</p>
        <p type="p">116:第二凹槽</p>
        <p type="p">120:黏著層</p>
        <p type="p">126:導電柱</p>
        <p type="p">130:第一絕緣層</p>
        <p type="p">140:第二絕緣層</p>
        <p type="p">142:第三凹槽</p>
        <p type="p">144:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="346" publication-number="202633024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K1/03</main-classification>
        <further-classification edition="200601120260504B">H05K3/46</further-classification>
        <further-classification edition="202601120260504B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子(淮安)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何明展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MING-JAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張豐繹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含第一外層線路層、第二外層線路層、內層線路層、兩個接地膜、導電結構和電子元件。內層線路層位於第一外層線路層和第二外層線路層之間，且具有傳輸線。第一外層線路層、第二外層線路層和內層線路層之間存在兩個空腔。傳輸線分隔兩個空腔。兩個接地膜分別設置在第一外層線路層和第二外層線路層上，且覆蓋兩個空腔。導電結構位於第一外層線路層和內層線路層之間，且電性連接第一外層線路層和內層線路層。電子元件設置在第一外層線路層上，且經由導電結構電性連接內層線路層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a first outer wiring layer, a second outer wiring layer, an inner wiring layer, two ground films, a conductive structure, and an electronic element. The inner wiring layer is located between the first outer wiring layer and the second outer wiring layer, and has a transmission line. There are two cavities between the first outer wiring layer, the second outer wiring layer, and the inner wiring layer. The transmission line divides the two cavities. The two ground films are respectively disposed on the first outer wiring layer and the second outer wiring layer, and cover the two cavities. The conductive structure is located between and is electrically connected to the first outer wiring layer and the inner wiring layer. The electronic element is disposed on the first outer wiring layer and is electrically connected to the inner wiring layer via the conductive structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">111,112:外層線路層</p>
        <p type="p">113:內層線路層</p>
        <p type="p">113a:傳輸線</p>
        <p type="p">113b:接地部</p>
        <p type="p">114,115:空腔</p>
        <p type="p">121,122:介電層</p>
        <p type="p">130:黏合層</p>
        <p type="p">141,142:表面處理層</p>
        <p type="p">151,152:接地膜</p>
        <p type="p">161,162:保護層</p>
        <p type="p">170:導電結構</p>
        <p type="p">180:接地柱</p>
        <p type="p">190:電子元件</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="347" publication-number="202632560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102901</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據展示與編輯系統及其實施方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DATA DISPLAY AND EDITING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06Q10/10</main-classification>
        <further-classification edition="201801120250701B">G06F9/451</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>數據立諮詢顧問有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATA-DI SOLUTIONS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種數據展示與編輯系統及其實施方法，可先於一數據展示平台中建立至少一模版，再於模版中新增複數個卡片組件，每一卡片組件皆能以拖曳操作之方式調整尺寸與位置，並自動適應網格以完成編排佈局；又，各卡片組件係可進一步透過一參數配置模組設定屬性與標籤，再根據所選的卡片類型進行內容渲染，使一佈局更新模組可監聽佈局及參數變化對佈局對象進行相應的更新回調，並保存至接口，如此，使用者可基於自身瀏覽權限，於一瀏覽模組中切換至不同的模版，以完整重現模版的頁面佈局與展示內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:數據展示與編輯系統</p>
        <p type="p">11:伺服器</p>
        <p type="p">12:數據展示平台</p>
        <p type="p">111:中央處理器</p>
        <p type="p">121:模版建立模組</p>
        <p type="p">112:權限管理模組</p>
        <p type="p">1211:模版</p>
        <p type="p">113:軌跡紀錄模組</p>
        <p type="p">122:卡片建立模組</p>
        <p type="p">114:模版資料庫</p>
        <p type="p">1221:卡片組件</p>
        <p type="p">115:帳號資料庫</p>
        <p type="p">123:拖曳編輯模組</p>
        <p type="p">116:軌跡資料庫</p>
        <p type="p">124:參數配置模組</p>
        <p type="p">125:佈局更新模組</p>
        <p type="p">126:瀏覽模組</p>
        <p type="p">13:使用者端資訊裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="348" publication-number="202632177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備防震裝置</chinese-title>
        <english-title>EQUIPMENT SEISMIC PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250728B">F16B37/00</main-classification>
        <further-classification edition="200601120250728B">F16F13/00</further-classification>
        <further-classification edition="200601120250728B">F16B43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>協崑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH KUN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何成偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種設備防震裝置，用以組設於一設備支撐腳，其包含組合式螺帽與固定座，所述組合式螺帽係藉由複數組合件將鎖片與螺牙片相互組設，螺牙片內側成型有螺紋部，使其可與設備支撐腳螺桿螺合，而固定座係透過複數固定件與組合式螺帽形成組設連接，並鎖固於地面，以限制設備支撐腳在水平與垂直方向的活動，有效防止地震或外力造成的晃動與位移，確保機台設備的運行穩定性及安全性，且在空間狹窄的環境中，也能透過將組合式螺帽拆分後安裝至設備支撐腳，而無須將機台設備卸下後再將其旋入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:組合式螺帽</p>
        <p type="p">111:鎖片</p>
        <p type="p">112:螺牙片</p>
        <p type="p">113:螺牙孔</p>
        <p type="p">2:設備支撐腳</p>
        <p type="p">21:螺桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="349" publication-number="202633046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機箱裝置</chinese-title>
        <english-title>CHASSIS DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250618B">H05K5/02</main-classification>
        <further-classification edition="200601120250618B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉烜廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡燕輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, YAN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱紹舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHAO-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種機箱裝置包括容納空間、機箱單元、滑動組件、定位組件和手把組件。滑動組件沿第一方向設置於容納空間和機箱單元之間，允許機箱單元沿第一方向相對容納空間滑動。定位組件設置於容納空間內。機箱單元包括導引溝沿第一方向設置且於空間上相對於定位組件。機箱單元沿第一方向置入或移出容納空間時，定位組件限位於導引溝內。手把組件樞設於機箱單元，且包括卡勾端於空間上相對定位組件和導引溝，握持端突伸出前端。手把組件於第一位置，卡勾端的弧形嚙合溝對位至導引溝和定位組件，允許與定位組件嚙合帶動手把組件轉動至第二位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chassis device is disclosed and includes an accommodation space, a chassis unit, a sliding component, a positioning component and a handle component. The sliding component is disposed between the accommodation space and the chassis unit along the first direction, allowing the chassis unit to slide relative to the accommodation space along the first direction. The positioning component is arranged in the accommodation space. The chassis unit includes a guiding groove arranged along the first direction and spatially corresponding to the positioning component. When the chassis unit is placed into or moved out of the accommodation space along the first direction, the positioning component is limited to the guiding groove. The handle component is pivotally mounted on the chassis unit and includes a hook end spatially corresponding to the positioning component the guiding groove, and a grip end protruding from the front end. When the handle component is in the first position, an arc-shaped engagement groove of the hook end is aligned with the guiding groove and the positioning component, allowing the hook end engaging the positioning component and driving the handle component to rotate to the second position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機箱單元</p>
        <p type="p">10a:前端</p>
        <p type="p">10c:頂部</p>
        <p type="p">10d:底部</p>
        <p type="p">11:導引溝</p>
        <p type="p">110:尾端</p>
        <p type="p">12:前端開口</p>
        <p type="p">3:定位組件</p>
        <p type="p">4:手把組件</p>
        <p type="p">41:卡勾端</p>
        <p type="p">42:握持端</p>
        <p type="p">43:樞接件</p>
        <p type="p">8:容納空間</p>
        <p type="p">80:開口</p>
        <p type="p">80a:頂部</p>
        <p type="p">80b:底部</p>
        <p type="p">9:機箱裝置</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="350" publication-number="202632385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形眼鏡</chinese-title>
        <english-title>CONTACT LENSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250515B">G02C7/04</main-classification>
        <further-classification edition="200601120250515B">G02C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>視陽光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISCO VISION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭閔元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉盈顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YING-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃馨儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種隱形眼鏡，其具有第一區、第二區及圖樣。於隱形眼鏡的俯視圖中，圖樣於預設軸線的兩側為非鏡像對稱，預設軸線通過隱形眼鏡的中心。隱形眼鏡在不同方位角的截平面中，第一區對應的第一截面積，與第二區對應的第二截面積的總和為截面積總和，第二截面積與截面積總和的比值，隨方位角變化而不同，以使隱形眼鏡被配戴時，圖樣靠近使用者的眼睛的預期位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a contact lens comprising a first region, a second region, and a pattern. In a top view of the contact lens, the pattern is non-mirror-symmetrical on both sides of a predetermined axis passing through the center of the contact lens. In cross-sectional planes of the contact lens at different azimuthal angles, the sum of the first cross-sectional area corresponding to the first region, and the second cross-sectional region corresponding to the second region is defined as the sum of cross-sectional areas, and the ratio of the second cross-sectional area to the sum of the cross-sectional areas varies with the azimuthal angle, ensuring that, when the contact lens is worn, the pattern aligns with the intended position relative to the user's eye.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複曲面鏡片體</p>
        <p type="p">11:第一區</p>
        <p type="p">12:第二區</p>
        <p type="p">CX:中心軸</p>
        <p type="p">D:寬度</p>
        <p type="p">P1:0度截平面</p>
        <p type="p">P2:180度截平面</p>
        <p type="p">Z:基準線</p>
        <p type="p">θ:方位角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="351" publication-number="202632873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建築整合型太陽能模組</chinese-title>
        <english-title>BUILDING-INTEGRATED SOLAR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250401B">H02S20/22</main-classification>
        <further-classification edition="201401120250401B">H02S30/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>承錡鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG CHI STEEL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅昕鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYU SIN STEEL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂福元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, FU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯如娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JU CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂盈瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂建輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIEN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡梅花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, MEI HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂家彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種建築整合型太陽能模組，包含有：一鋼構件，在該鋼構件上設有多個卡扣固定座，該等卡扣固定座提供搭接板搭接，前述的搭接板的凹面部提供太陽能模組安裝，據此，太陽能模組與搭接板嵌合更精進，可以預先在工廠施作組裝，或是在現場施作，大幅增進施工的便利性，簡而言之直接將太陽能模組整合成建築物的建材，達到施工方便之特點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A building-integrated solar module comprises a steel member, which is provided with a plurality of snap fixing seats on the steel member, the said snap fixing seats provides lap plate to overlap, the concave part of the lap plate is connected to provide solar module installation.        &lt;br/&gt;Therefore, the chimera can be improved about the solar module with lap plat, the lap plate can be assembled in the factory in advance or on site, which can greatly improve the convenience of construction, in short, it can directly integrate the solar module into the building materials to achieve the characteristics of convenient construction.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鋼構件</p>
        <p type="p">20:卡扣固定座</p>
        <p type="p">30:搭接板</p>
        <p type="p">31:搭接部</p>
        <p type="p">32:接合座</p>
        <p type="p">33:凹面部</p>
        <p type="p">40:太陽能模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="352" publication-number="202632643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供個人化語音對話服務的方法、系統以及交易系統</chinese-title>
        <english-title>METHOD, SYSTEM FOR PROVIDING PERSONALIZED SPEECH DIALOGUE SERVICE AND TRADING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G10L15/22</main-classification>
        <further-classification edition="201301120250502B">G10L25/63</further-classification>
        <further-classification edition="202001120250502B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開曼群島商沛嘻科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAYSEE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雨暹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提供個人化語音對話服務的方法與系統，以及提供個人化模型製作的交易系統。雲端伺服器連線使用者裝置，通過對話介面提供使用者個人化語音對話服務，以及由處理器執行提供使用者個人化語音對話服務的方法。其中，雲端伺服器接收使用者即時語音產生的語音數據，並可包括影像數據，取得當下的語音特徵與影像特徵，以據此學習使用者當下的情緒，再以自然語言處理模型識別語音特徵中的語意，根據語意與當下的環境資訊，對應生成基於當下使用者情緒的語音對話，之後通過顯示於使用者裝置的擬真物件發出語音對話。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, a system for providing personalized speech dialogue service and a trading system are provided. A cloud server is provided for connecting with user devices, providing users a personalized speech dialogue service via a dialogue interface, performing the method by processors. The cloud server is configured to receive speech data generated by a user’s real-time voice, or also receive image data, and then extract current speech features and image features. The speech features and the image features are referred to for learning the user’s current mood. A natural language processing model is used to identify semantic meaning in the speech features. A speech dialogue based on the user’s current mood can be generated according to the semantic meaning and current environmental information. A simulated object displayed on a user device can speak the speech dialogue.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:使用者語音/影像</p>
        <p type="p">303:人機介面</p>
        <p type="p">305:對話介面</p>
        <p type="p">307:語音/影像模型</p>
        <p type="p">309:特徵學習演算法</p>
        <p type="p">311:使用者語音/影像特徵</p>
        <p type="p">313:環境資訊</p>
        <p type="p">315:使用者資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="353" publication-number="202632634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其驅動方法</chinese-title>
        <english-title>DISPLAY DEVICE AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250619B">G09G3/36</main-classification>
        <further-classification edition="200601120250619B">G09G5/10</further-classification>
        <further-classification edition="202501120250619B">H10F19/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種顯示裝置，包含一顯示面板、一電池模組、一檢測模組以及一處理器。顯示面板包含複數畫素矩陣層。電池模組具有一蓄電量。檢測模組用以檢測一環境照度及蓄電量。處理器依據環境照度及蓄電量，判斷是否輸出一穿透態控制訊號，以將畫素矩陣層分隔為複數矩陣區域，並控制此些矩陣區域中的複數目標畫素全部或部分由反射態轉為穿透態。藉此，確保顯示裝置的顯示效果及發電效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is proposed. The display device includes a display panel, a battery module, a detection module and a processor. The display panel includes a plurality of pixel layers. The battery module has a battery level. The detection module is configured to detect an ambient illumination and the battery level. The processor determines whether to output a focal conic state control signal based on the ambient illumination and the battery level to divide the pixel matrix layers into a plurality of matrix areas and control full or partial of a plurality of target pixel in the matrix areas to change from planar state to focal conic state. Thus, the display device of the present disclosure can ensure its display effect and power generation effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">111:畫素矩陣層</p>
        <p type="p">120:檢測模組</p>
        <p type="p">121:蓄電量檢測單元</p>
        <p type="p">122:環境光檢測單元</p>
        <p type="p">130:處理器</p>
        <p type="p">140:電池模組</p>
        <p type="p">150:太陽能模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="354" publication-number="202632635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可消除烙印之膽固醇液晶電子紙裝置</chinese-title>
        <english-title>CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE FOR REMOVING IMAGE STICKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G09G3/36</main-classification>
        <further-classification edition="200601120250526B">G02F1/133</further-classification>
        <further-classification edition="200601120250526B">G02F1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇瞻科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACER TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許隨釋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SUI-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種可消除烙印之膽固醇液晶電子紙裝置，其包含一顯示單元、一控制單元、一加熱單元以及一驅動單元。顯示單元可用以輸出一顯示畫面。控制單元可用以發出一控制指令及一加熱指令。加熱單元係電性連接此控制單元並貼附於顯示單元之一表面，加熱單元可接收所述加熱指令並用以加熱激活顯示單元中之液晶分子。驅動單元係電性連接顯示單元及控制單元，驅動單元可接收該控制指令以控制顯示單元輸出所述顯示畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a cholesteric LCD device for removing image sticking, which comprises a display unit, a control unit, a heating unit, and a driving unit. The display unit may output an image, and the control unit may submit a control command and a heating command. The heating unit is electrically connected to the control unit and attached to one surface of the display unit. The heating unit may receive the heating command and be used to heat and activate liquid crystal molecules in the display unit. The driving unit is electrically connected to the display unit and the control unit, and it receives the control command to control the display unit to output the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可消除烙印之膽固醇液晶電子紙裝置</p>
        <p type="p">10:顯示單元</p>
        <p type="p">11:顯示畫面</p>
        <p type="p">20:控制單元</p>
        <p type="p">21:控制指令</p>
        <p type="p">22:加熱指令</p>
        <p type="p">30:加熱單元</p>
        <p type="p">40:驅動單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="355" publication-number="202631265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能清潔裝置</chinese-title>
        <english-title>MULTIFUNCTIONAL CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250414B">B08B1/16</main-classification>
        <further-classification edition="200601120250414B">A47L13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能采股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYPER SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEI LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴勝裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SHENG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多功能清潔裝置，包括一第一板體、一第二板體、一刮片座及一刮片。第一板體、第二板體及刮片座能以板金、鋁擠型或塑膠射出等方式製成，第一板體能結合於一基座，使其與桿體結合，第一板體能設置一拖把布，用以進行拖地。第二板體設置於第一板體的一側，第二板體能設置一吸水布，用以增進吸水效果。刮片座設置於第一板體及第二板體之間，刮片能設置於刮片座的固定槽，並能以多個螺絲或彈片緊固，且刮片伸出刮片座一預定長度，能用以進行刮水。由此，可提供多功能的清潔效果，保持地面乾燥及整潔，且能提高使用的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multifunctional cleaning device includes a first plate body, a second plate body, a squeegee holder, and a squeegee. The first plate body, the second plate body, and the squeegee holder can be manufactured by processes such as sheet metal, aluminum extrusion, or plastic injection. The first plate body can be coupled to a base, so as to be assembled with a rod. A mop cloth can be disposed on the first plate body for mopping. The second plate body is disposed on one side of the first plate body and can be equipped with a water-absorbing cloth to enhance water absorption. The squeegee holder is disposed between the first plate body and the second plate body. The squeegee can be disposed in a fixing groove of the squeegee holder and fastened with a plurality of screws or elastic pieces. The squeegee extends a predetermined length from the squeegee holder for performing squeegeeing. Therefore, the present invention can provide multifunctional cleaning effects, maintain the floor dry and clean, and improve usability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一板體</p>
        <p type="p">11:第一頂面</p>
        <p type="p">12:第一底面</p>
        <p type="p">2:第二板體</p>
        <p type="p">21:第二頂面</p>
        <p type="p">22:第二底面</p>
        <p type="p">3:刮片座</p>
        <p type="p">31:固定槽</p>
        <p type="p">32:螺絲</p>
        <p type="p">4:刮片</p>
        <p type="p">5:基座</p>
        <p type="p">6:桿體</p>
        <p type="p">7:拖把布</p>
        <p type="p">8:吸水布</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">L3:長度</p>
        <p type="p">L4:預定長度</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="356" publication-number="202632871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>交流-直流轉換電路及其運作方法</chinese-title>
        <english-title>AC-DC CONVERSION CIRCUIT AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H02M7/217</main-classification>
        <further-classification edition="200601120250501B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃登群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DENG-CYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古進德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHIN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温偉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉熊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-HSIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種交流-直流轉換電路，包含一功率量測電路、一控制電路以及三個橋臂電路；每一該橋臂電路分別包含複數之開關；該功率量測電路用以量測一輸入功率及一輸出功率的至少其中之一以產生一功率量測值。當該功率量測值小於一功率閾值，該控制電路控制該三個橋臂電路的該些開關以設置該三個橋臂電路運作於一輕載模式；當該功率量測值大於該功率閾值，該控制電路控制該三個橋臂電路的該些開關以設置該三個橋臂電路運作於一重載模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AC-DC conversion circuit includes a power measurement circuit, a control circuit, and three bridge arm circuits. Each bridge arm circuit includes a plurality of switches. The power measurement circuit is used to measure at least one of an input power and an output power to generate a power measurement value. When the power measurement value is less than a power threshold value, the control circuit controls the switches of the three bridge arm circuits to set the three bridge arm circuits to operate in a light load mode. When the power measurement value is greater than the power threshold value, the control circuit controls the switches of the three bridge arm circuits to set the three bridge arm circuits to operate in a heavy load mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:交流-直流轉換電路</p>
        <p type="p">20:三相交流輸入電源</p>
        <p type="p">22:直流輸出電壓</p>
        <p type="p">102:功率量測電路</p>
        <p type="p">104:控制電路</p>
        <p type="p">108:第一輸出端</p>
        <p type="p">1022:功率計算電路</p>
        <p type="p">1023:功率閾值判斷電路</p>
        <p type="p">1024:控制信號產生電路</p>
        <p type="p">1026:電流感測器</p>
        <p type="p">1028:電壓感測器</p>
        <p type="p">1062:第一橋臂電路</p>
        <p type="p">1064:第二橋臂電路</p>
        <p type="p">1066:第三橋臂電路</p>
        <p type="p">AC1:第一單相交流電源</p>
        <p type="p">AC2:第二單相交流電源</p>
        <p type="p">AC3:第三單相交流電源</p>
        <p type="p">C1:第一電容</p>
        <p type="p">C2:第二電容</p>
        <p type="p">L1:第一輸入電感</p>
        <p type="p">L2:第二輸入電感</p>
        <p type="p">L3:第三輸入電感</p>
        <p type="p">Q0:控制信號</p>
        <p type="p">Q1:第一控制信號</p>
        <p type="p">Q2:第二控制信號</p>
        <p type="p">Q3:第三控制信號</p>
        <p type="p">Q4:第四控制信號</p>
        <p type="p">Q5:第五控制信號</p>
        <p type="p">Q6:第六控制信號</p>
        <p type="p">S1:第一開關</p>
        <p type="p">S2:第二開關</p>
        <p type="p">S3:第三開關</p>
        <p type="p">S4:第四開關</p>
        <p type="p">S5:第五開關</p>
        <p type="p">S6:第六開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="357" publication-number="202632588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>職業代碼推薦系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR RECOMMENDING OCCUPATIONAL CODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250401B">G06Q40/08</main-classification>
        <further-classification edition="202301120250401B">G06Q10/06</further-classification>
        <further-classification edition="201901120250401B">G06F16/9535</further-classification>
        <further-classification edition="200601120250401B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富邦人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUBON LIFE INSURANCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐浩軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周琦雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHI-YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慶琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CING-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種職業代碼推薦系統及其方法。本系統包括資料庫建立裝置與執行處理裝置。資料庫建立裝置將多個職業描述文本編碼為職業嵌入向量並存儲於向量資料庫中；執行處理裝置根據核保資料提取用戶職業敘述，並將其編碼為用戶嵌入向量，再透過向量相似度演算法計算用戶嵌入向量與每個職業嵌入向量的向量相似度，最後提供最高的職業嵌入向量對應的職業代碼或是提供具有相似度排序的職業代碼推薦列表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and method for recommending occupational codes. The system includes a database creation device and an execution processing device. The database creation device encodes multiple occupational description texts into occupational embedding vectors and stores them in a vector database. The execution processing device extracts user occupational descriptions from underwriting data, encodes them into user embedding vectors, calculates the vector similarity between the user embedding vector and each occupational embedding vector using a vector similarity algorithm, and finally provides the occupational code corresponding to the highest occupational embedding vector or a recommendation list of occupational codes ranked by similarity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:職業代碼推薦系統</p>
        <p type="p">120:資料庫建立裝置</p>
        <p type="p">121:文本處理模組</p>
        <p type="p">122:資料庫編碼模組</p>
        <p type="p">123:儲存模組</p>
        <p type="p">140:執行處理裝置</p>
        <p type="p">141:資料提取模組</p>
        <p type="p">142:用戶職業編碼模組</p>
        <p type="p">143:相似度比對模組</p>
        <p type="p">144:推薦模組</p>
        <p type="p">200:使用者裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="358" publication-number="202631317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑽石修整器的製造設備以及鑽石修整器的製造方法</chinese-title>
        <english-title>DIAMOND CONDITIONER MANUFACTURING EQUIPMENT AND DIAMOND CONDITIONER MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">B24B53/12</main-classification>
        <further-classification edition="200601120250303B">B24B53/047</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日鐵精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ALLOY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炳旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BING-JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鑽石修整器的製造設備包含有一工作腔以及一基座。基座設置於工作腔之中，基座包含有一振盪器以及一加熱器，且基座用以固定一鑽石研磨碟，並在低於一預定的壓力下，以及在一預定的溫度以及一預定的振盪頻率之下，塗佈一保護層在鑽石研磨碟之上。此外，一種鑽石修整器的製造方法亦在此揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A diamond conditioner manufacturing equipment includes a working chamber and a supporting base. The supporting base is arranged in the working chamber, the supporting base includes an oscillator and a heater, and the supporting base is utilized to fix a diamond disc. In addition, a protective layer is coated on the diamond disc at a predetermined temperature and a predetermined oscillation frequency and below a predetermined pressure. In addition, a diamond conditioner manufacturing method is also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鑽石修整器的製造設備</p>
        <p type="p">102:鑽石修整器</p>
        <p type="p">110:基座</p>
        <p type="p">112:振盪器</p>
        <p type="p">114:加熱器</p>
        <p type="p">120:工作腔</p>
        <p type="p">130:鑽石研磨碟</p>
        <p type="p">132:基板</p>
        <p type="p">134:接合層</p>
        <p type="p">136:鑽石顆粒</p>
        <p type="p">140:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="359" publication-number="202632613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於影像分析的簽名驗證系統與簽名驗證方法</chinese-title>
        <english-title>SIGNATURE VERIFICATION SYSTEM AND METHOD BASED ON IMAGE ANALYSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V40/20</main-classification>
        <further-classification edition="202201120250401B">G06V30/19</further-classification>
        <further-classification edition="202201120250401B">G06V10/10</further-classification>
        <further-classification edition="201301120250401B">G06F21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優派國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIEWSONIC INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭金德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於影像分析的簽名驗證方法，包含利用一簽名擷取裝置擷取一簽署者在進行一簽名過程中的一字跡資料；利用一影像擷取裝置擷取該簽署者在進行該簽名過程中的一影像資料；由該影像資料取得至少一特徵資訊；將該字跡資料及該至少一特徵資訊，與至少一認證參考資料進行比對，以產生一比對結果；以及根據該比對結果，判斷該簽署者之該簽名過程的真實性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signature verification method based on image analysis, includes capturing handwriting data of a signatory during a signature process using a signature capture device, capturing image data of the signatory during the signing process using an image capturing device; obtaining at least one feature information from the image data; comparing the handwriting data and the at least one feature information with at least one authentication reference data to generate a comparison result; and determining authenticity of the signing process performed by the signatory based on the comparison result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:簽名驗證系統</p>
        <p type="p">100:影像擷取裝置</p>
        <p type="p">101:簽名擷取裝置</p>
        <p type="p">102:處理單元</p>
        <p type="p">104:儲存單元</p>
        <p type="p">106:程式碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="360" publication-number="202631367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜材纖維化的方法、製得的纖維產品以及包含纖維產品的建築材料</chinese-title>
        <english-title>METHOD FOR FIBERIZING MEMBRANE, RESULTING FIBER PRODUCTS, AND BUILDING MATERIALS CONTAINING FIBER PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">B29C59/04</main-classification>
        <further-classification edition="200601120250704B">C08L29/04</further-classification>
        <further-classification edition="200601120250704B">C08J7/12</further-classification>
        <further-classification edition="200601120250704B">C08J7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住華科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIKA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃呈加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾念臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, NIEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐姿漣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種膜材纖維化的方法，包括提供一膜材；對此膜材進行圖案化，以下凹此膜材而形成複數個凹部，此些凹部在第一方向上分隔設置；以及施加一外力使此膜材破裂，以形成具有一預定尺寸的複數個纖維件，其中此些凹部提供此膜材破裂時的斷點區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for fiberizing membrane. The method includes providing a membrane; patterning the membrane by recessing it to form several recesses, wherein these recesses are arranged separately in a first direction; and applying an external force to fracture the patterned membrane, thereby forming several fibers with a predetermined size. These recesses provide breakpoint areas when the membrane fractures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11、12、13、14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="361" publication-number="202632264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體感測晶片、其製備方法以及氣體感測裝置</chinese-title>
        <english-title>GAS SENSING CHIP, MANUFACTURING METHOD THEREOF AND GAS SENSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N27/12</main-classification>
        <further-classification edition="202601120260302B">H10P14/69</further-classification>
        <further-classification edition="200601120260302B">C25D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕郁倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瞿瑞宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYU, RUEI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭姿妏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TZU WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種製備氣體感測晶片的方法，其包含下列步驟。提供一二維半導體。使一增強氣體選擇性化合物披覆於二維半導體的一表面。增強氣體選擇性化合物包含六方氮化硼、沸石咪唑酯骨架與銅酞青中的至少一者。藉此，通過在二維半導體上披覆增強氣體選擇性化合物，可提升氣體感測晶片的靈敏度、選擇性與穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present disclosure, a manufacturing method of a gas sensing chip includes the following steps. A two-dimensional semiconductor is provided. A gas selectivity-enhancing compound is coated on a surface of the two-dimensional semiconductor. The gas selectivity-enhancing compound includes at least one of hexagonal boron nitride, zeolitic imidazolate framework and copper phthalocyanine. Therefore, by coating the gas selectivity-enhancing compound on the two-dimensional semiconductor, the sensitivity, selectivity and stability of the gas sensing chip can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製備氣體感測晶片的方法</p>
        <p type="p">110,120:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="362" publication-number="202632229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有三維電感器之光偵測器組合</chinese-title>
        <english-title>PHOTODETECTOR ASSEMBLY HAVING THREE-DIMENSIONAL INDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G01J1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進微晶圓私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO FOUNDRY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　海洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HAIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅賢樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, XIANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光偵測器組合包括：堆疊結構，具有包覆層、埋入式氧化層、及半導體基板，其中所述包覆層包括第一側及相對的第二側，所述第二側鄰接所述埋入式氧化層的第一側，其中所述半導體基板包括第一側及相對的第二側，所述第一側鄰接所述埋入式氧化層的相對的第二側；光偵測器裝置，嵌入所述堆疊結構中；電感器，可操作地耦合到所述光偵測器裝置，其中所述電感器排列在所述包覆結構的所述第一側上，並至少部分穿越所述堆疊結構；信號電極，通過使用所述電感器可操作地耦合到所述光偵測器裝置；以及至少一個接地電極，可操作地耦合到所述光偵測器裝置，其中所述信號電極及所述接地電極排列在所述包覆層的所述第一側上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photodetector assembly comprises: a stacked structure having a cladding layer, a buried oxide layer, a semiconductor substrate, wherein the cladding layer includes a first side and a second opposed side which abuts a first side of the buried oxide layer, wherein the semiconductor substrate includes a first side which abuts a second opposed side of the buried oxide layer and further includes a second opposed side; a photodetector device embedded in the stacked structure; an inductor operably coupled to the photodetector device, wherein the inductor is arranged on the first side of the cladding structure and at least partially traverses the stacked structure; a signal electrode operably coupled to the photodetector device by using the inductor; and at least one ground electrode operably coupled to the photodetector device, wherein the signal electrode and the ground electrode are arranged on the first side of the cladding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:包覆層</p>
        <p type="p">120、220、320、420、520、620、800:電感器</p>
        <p type="p">w:寬度</p>
        <p type="p">l:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="363" publication-number="202633505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND PACKAGE STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260327B">H10W74/10</main-classification>
        <further-classification edition="202601120260327B">H10W70/60</further-classification>
        <further-classification edition="202601120260327B">H10W46/00</further-classification>
        <further-classification edition="202601120260327B">H10P54/94</further-classification>
        <further-classification edition="202601120260327B">H10P72/70</further-classification>
        <further-classification edition="202501120260327B">H10H29/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭長泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHANG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭政偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包含第一表面、第二表面、半導體部以及貫穿部，第一表面和第二表面彼此相對，貫穿部貫穿半導體部，並具有位於第一表面的第一開口和位於第二表面的第二開口，貫穿部容許環境介質經由第一開口和第二開口流過半導體部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a first surface, a second surface, a semiconductor portion and a penetrating portion. The second surface is opposite to the first surface. The penetrating portion passes through the semiconductor portion, and has a first opening located on the first surface and a second opening located on the second surface. The penetrating portion allows an ambient medium to pass through the semiconductor portion through the first opening and the second opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">110A:半導體元件</p>
        <p type="p">122:半導體部</p>
        <p type="p">124:金屬部</p>
        <p type="p">126-1:第一貫穿部</p>
        <p type="p">126-2:第二貫穿部</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">S3:第三表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="364" publication-number="202633126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250214B">H10D30/65</main-classification>
        <further-classification edition="202501120250214B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一個態樣涉及一種半導體裝置。所述半導體裝置包括：基底；第一井區以及第二井區，相鄰併置於基底中且具有相反的摻雜型態；閘極結構，跨置第一井區以及第二井區上；源極結構，設置於第一井區中；汲極結構，設置於第二井區中；以及歐姆接觸層，設置於第二井區上並與第二井區形成歐姆接觸，其中歐姆接觸層設置於閘極結構與汲極結構之間。本揭露更提供一種半導體裝置的形成方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One aspect of the present pertains to a semiconductor device including a substrate, a first well and a second well adjacently disposed in the substrate and having opposite doping types, a gate structure spanning the first well and the second well, a source structure disposed in the first well, a drain structure disposed in the second well, and an ohmic contact layer disposed on the second well to form an ohmic contact with the second well. The ohmic contact layer is disposed between the gate structure and the drain structure. A method for forming the semiconductor device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基底</p>
        <p type="p">112:第一井區</p>
        <p type="p">114:第二井區</p>
        <p type="p">120:閘極結構</p>
        <p type="p">120a:閘極介電層</p>
        <p type="p">120b:閘極電極</p>
        <p type="p">121:側壁間隔物</p>
        <p type="p">122:汲極結構</p>
        <p type="p">124:源極結構</p>
        <p type="p">124a:第一摻雜區</p>
        <p type="p">124b:第二摻雜區</p>
        <p type="p">130:阻隔保護氧化層</p>
        <p type="p">131:開口</p>
        <p type="p">132:歐姆接觸層</p>
        <p type="p">132a:矽化物層</p>
        <p type="p">132b:金屬層</p>
        <p type="p">134:自對準金屬矽化物</p>
        <p type="p">140:層間介電層</p>
        <p type="p">142:汲極接觸件</p>
        <p type="p">144:源極接觸件</p>
        <p type="p">144a:第一源極接觸件</p>
        <p type="p">144b:第二源極接觸件</p>
        <p type="p">D1、D2:最短距離</p>
        <p type="p">W:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="365" publication-number="202632158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉸鏈</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">F16C11/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商歐柏股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPPO MEDICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彪仕醫技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLUS MEDITECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江岳樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YUEH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席勒　雷內　溫佛里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHILLER, RENE WINFRIED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦格納　赫爾穆特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, HELMUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鉸鏈，包含一外殼、一下支架、一上支架及一止動件。該外殼形成有一鎖定槽。該下支架鉸接於該外殼並能繞一下軸線相對於該外殼旋轉。該上支架鉸接於該外殼並能繞一上軸線相對於該外殼旋轉，該上支架能轉動地連接於該下支架並能同步且反向地相對於該外殼旋轉。該止動件包括一止動塊、連接於該止動塊的一彈臂，及凸設於該彈臂相反於該止動塊的一側的一鎖扣塊。該止動塊用以限制該下支架及該上支架的旋轉角度。該鎖扣塊可解鎖地鎖扣於該鎖定槽以將該止動件固定於該外殼。該鎖扣塊可被操作而帶動該彈臂彎折變形進而脫離該鎖定槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:殼體</p>
        <p type="p">111:內側板</p>
        <p type="p">114:外板面</p>
        <p type="p">121:通孔</p>
        <p type="p">122:鎖定槽</p>
        <p type="p">123:開放槽</p>
        <p type="p">124:扣槽部</p>
        <p type="p">125:外端緣</p>
        <p type="p">126:下擋止面</p>
        <p type="p">127:上擋止面</p>
        <p type="p">13:蓋板</p>
        <p type="p">131:內板面</p>
        <p type="p">133:卡孔</p>
        <p type="p">135:定位槽</p>
        <p type="p">135’:定位槽</p>
        <p type="p">136:擋止面</p>
        <p type="p">136’:擋止面</p>
        <p type="p">14:塞柱</p>
        <p type="p">2:下支架</p>
        <p type="p">21:樞接孔</p>
        <p type="p">22:內環形導引面</p>
        <p type="p">23:齒環</p>
        <p type="p">24:後抵止面</p>
        <p type="p">25:前抵止面</p>
        <p type="p">3:上支架</p>
        <p type="p">31:樞接孔</p>
        <p type="p">32:內環形導引面</p>
        <p type="p">33:齒環</p>
        <p type="p">34:後抵止面</p>
        <p type="p">35:前抵止面</p>
        <p type="p">5:止動件</p>
        <p type="p">5’:止動件</p>
        <p type="p">51:止動塊</p>
        <p type="p">510:抵止面</p>
        <p type="p">511:下止動面</p>
        <p type="p">512:上止動面</p>
        <p type="p">513:側立面</p>
        <p type="p">514:連接立面</p>
        <p type="p">52:彈臂</p>
        <p type="p">521:第一臂體</p>
        <p type="p">522:第二臂體</p>
        <p type="p">523:間隙</p>
        <p type="p">53:鎖扣塊</p>
        <p type="p">531:鎖扣凸部</p>
        <p type="p">532:傾斜面</p>
        <p type="p">533:鎖扣面</p>
        <p type="p">54:解鎖塊</p>
        <p type="p">X:前後方向</p>
        <p type="p">Y:左右方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="366" publication-number="202633221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子點發光元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250512B">H10H20/852</main-classification>
        <further-classification edition="202501120250512B">H10H20/812</further-classification>
        <further-classification edition="202501120250512B">H10H20/813</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商冠捷投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種量子點發光元件，包含一基座、一發光單元，及一阻氣單元。該基座包括一底板及自該底板向上形成的一反射件，該反射件與該底板形成一容裝空間。該發光單元電連接於該底板並位於該容裝空間，包括一藍光發光層、一紅光發光層、一第一透光阻隔層，及一綠光發光層。該阻氣單元包括一至少覆蓋該發光單元及該反射件相反於該底板的表面的第一無機保護層、一覆蓋於該第一無機保護層表面的第一有機保護層，及一覆蓋於該第一有機保護層表面的第二無機保護層。藉由該阻氣單元的結構設計，可有效地將水氣阻隔在外界，進而達到保護發光單元的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基座</p>
        <p type="p">21:底板</p>
        <p type="p">22:反射件</p>
        <p type="p">3:發光單元</p>
        <p type="p">31:藍光發光層</p>
        <p type="p">32:紅光發光層</p>
        <p type="p">33:第一透光阻隔層</p>
        <p type="p">34:綠光發光層</p>
        <p type="p">35:第二透光阻隔層</p>
        <p type="p">4:阻氣單元</p>
        <p type="p">41:第一無機保護層</p>
        <p type="p">42:第一改質層</p>
        <p type="p">43:第一有機保護層</p>
        <p type="p">44:第二無機保護層</p>
        <p type="p">45:第二改質層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="367" publication-number="202633495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合方法</chinese-title>
        <english-title>BONDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇英陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種接合方法，包括：提供元件陣列，元件陣列包含陣列基板及電子元件，其中，電子元件位於陣列基板上並包含導電凸塊；形成第一膠體以覆蓋電子元件並裸露導電凸塊的一部份；提供電路基板，其中，電路基板具有電極；以及接合導電凸塊與電極，其中，第一膠體於接合導電凸塊與電極之過程中呈現未完全固化狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding method is provided. The bonding method includes following steps. A component array including an array substrate and an electronic component is provided. The electronic component is located on the array substrate and includes a conductive bump. A first glue is formed to cover the electronic component and a portion of the conductive bump is exposed. A circuit substrate having an electrode is provided. The conductive bump is bonded with the electrode. The first glue is not fully cured during the process of bonding the conductive bump and the electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:元件陣列</p>
        <p type="p">12:陣列基板</p>
        <p type="p">14:電子元件</p>
        <p type="p">16:導電凸塊</p>
        <p type="p">18:第一膠體</p>
        <p type="p">20:蝕刻製程</p>
        <p type="p">22:電路基板</p>
        <p type="p">24:電極</p>
        <p type="p">26:接合製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="368" publication-number="202632563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧媒合求職及客服設備之雲端系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250314B">G06Q10/1053</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全球華人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉政宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏碩均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾侑辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種智慧媒合求職及客服設備之雲端系統，係透過大型語言模型人工智能(AI)程式從網際網路收集的資料進行訓練，其特色在於將LLM技術與企業內部人資資料庫進行有效整合，其建立在機器學習基礎上的辨識學習亦是人工智慧的一部分，由指向程式提供大量資料以訓練程式在無需人工干預的情況下識別資料特徵的做法並實現精準的職缺查詢及智慧客服功能，該裝置模組通過客製化的提示詞工程、上下文管理資料整合機制及安全防護連結LLM大型語言模型內部特定神經網路Transformer模型，確保回應的準確性、相關性及安全性；俾提供使用者能將安全的機密資料上傳到其中，以提高自己的工作效率，透過本裝置模組設備使用它們收到的內容來進一步訓練它們的模型，而且被設計為安全的保存於資料庫中；且它們可能會公開機密資料以回應其他使用者的查詢。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10A:個人電腦端</p>
        <p type="p">10B:行動平板</p>
        <p type="p">10C:行動手機</p>
        <p type="p">10D:電子介質媒體裝置</p>
        <p type="p">100:安全防護模組</p>
        <p type="p">100A:病毒庫單元</p>
        <p type="p">100B:防機器人程式單元</p>
        <p type="p">100C:防火牆隔離單元</p>
        <p type="p">200:資料整合模組</p>
        <p type="p">200A:人力銀行資料庫</p>
        <p type="p">200B:搜尋鍵位單元</p>
        <p type="p">300:LLM整合模組</p>
        <p type="p">300A:GPU處理單元</p>
        <p type="p">300B:上下文管理單元</p>
        <p type="p">300C:提示語管理單元</p>
        <p type="p">400:推論引擎模組</p>
        <p type="p">400A:R2資料庫</p>
        <p type="p">400B:KV快取單元</p>
        <p type="p">500:雲端AI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="369" publication-number="202632147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102997</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇驅動裝置及其方法</chinese-title>
        <english-title>FAN DRIVING DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">F04D27/00</main-classification>
        <further-classification edition="200601120250526B">F04D29/00</further-classification>
        <further-classification edition="201901120250526B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯保辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, PAO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇驅動裝置及其方法，用以驅動一風扇旋轉以對一資料處理系統進行散熱。風扇驅動裝置包含一風扇驅動模組以及一機器學習模組。風扇驅動模組，用以輸出一驅動電壓以驅動風扇旋轉。機器學習模組用以根據資料處理系統所執行或即將執行指令之指令數量或指令類型預測資料處理系統於一預設時間後之溫度，並根據溫度決定驅動電壓。機器學習模組使用資料處理系統所執行指令之指令數量、指令類型、一驅動電壓與風扇轉速關係表、以及一風扇轉速與溫度關係表進行訓練。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan driving device and method thereof for cooling a data processing system are provided. The fan driving device includes a fan driving module and a machine learning module. The fan driving module outputs a driving voltage to rotate the fan. The machine learning module predicts a temperature of the data processing system after a preset time based on the number and type of instructions executed or to be executed by the data processing system, and determines the driving voltage based on the temperature. The machine learning module is trained using the number and types of instructions executed by the data processing system, a driving voltage and fan speed relationship table, and a fan speed and temperature relationship table.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:資料處理系統</p>
        <p type="p">11:風扇驅動模組</p>
        <p type="p">112:驅動電壓</p>
        <p type="p">12:機器學習模組</p>
        <p type="p">121:指令數量</p>
        <p type="p">122:指令類型</p>
        <p type="p">123:驅動電壓與風扇轉速關係表</p>
        <p type="p">124:風扇轉速與溫度關係表</p>
        <p type="p">13:風扇</p>
        <p type="p">131:風扇轉速</p>
        <p type="p">142:記憶體</p>
        <p type="p">143:加解密晶片</p>
        <p type="p">144:周邊晶片</p>
        <p type="p">145:匯流排介面</p>
        <p type="p">146:記憶體介面</p>
        <p type="p">15:更新模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="370" publication-number="202632939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去中心化仲裁的交叉網路</chinese-title>
        <english-title>DECENTRALIZED ARBITRATION CROSSBAR NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">H04L49/10</main-classification>
        <further-classification edition="200601120250401B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金麗科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RDC SEMICONDUCTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鈞澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUN-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝侑村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴文駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, WEN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種去中心化仲裁的交叉網路(decentralized arbitration crossbar network)。在本發明的交叉網路中，不設計仲裁單元來配置電路之間的資料路徑。在本發明的交叉網路中，二個電路之間進行三次握手(three-way handshake)後即可建立資料路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A decentralized arbitration crossbar network is provided. In the crossbar network of the present invention, no arbitrating unit is designed to allocate the data path between circuits. In the crossbar network of the present invention, a data path is successfully established between two circuits after three-way handshake.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:第一電路</p>
        <p type="p">312,322,332,342:多工元件</p>
        <p type="p">314,324,334,344:連結配置元件</p>
        <p type="p">316,326,336,346:連結偵測元件</p>
        <p type="p">320:第二電路</p>
        <p type="p">330:第三電路</p>
        <p type="p">340:第四電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="371" publication-number="202631806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寡聚物、寡聚物的製備方法以及寡聚物之固化物的製備方法</chinese-title>
        <english-title>OLIGOMER, METHOD FOR PREPARING OLIGOMER, AND METHOD FOR PREPARING CURED PRODUCT OF OLIGOMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08G65/48</main-classification>
        <further-classification edition="200601120250402B">C08L71/12</further-classification>
        <further-classification edition="200601120250402B">C08K5/14</further-classification>
        <further-classification edition="200601120250402B">C08J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聖德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENG-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MENG-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃麟強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高瑞富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, JUI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銘郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JANN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種寡聚物，其係具有如式(I)所示的結構：        &lt;img align="absmiddle" height="159px" width="552px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;br/&gt;其中，X為        &lt;img align="absmiddle" height="81px" width="134px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;結構，        &lt;br/&gt;Y各自獨立為氫、鹵素、        &lt;img align="absmiddle" height="65px" width="73px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="82px" width="73px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="76px" width="131px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或        &lt;img align="absmiddle" height="53px" width="78px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;之一結構，R        &lt;sub&gt;0&lt;/sub&gt;、R        &lt;sub&gt;1&lt;/sub&gt;各自獨立為氫、C        &lt;sub&gt;1&lt;/sub&gt;~C        &lt;sub&gt;6&lt;/sub&gt;的烷基、苯基或        &lt;img align="absmiddle" height="43px" width="70px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，n與m各自獨立為0至300的整數。本發明之寡聚物適合用於形成可作為低介電樹脂材料的固化物。本發明亦關於一種寡聚物的製備方法以及一種寡聚物之固化物的製備方法。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oligomer having a structure as shown in Formula (I):        &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="586px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;br/&gt;wherein, X is a structure of        &lt;img align="absmiddle" height="76px" width="134px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;br/&gt;Y are each independently a structure of hydrogen, halogen,        &lt;img align="absmiddle" height="73px" width="73px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="89px" width="80px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="77px" width="127px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;or        &lt;img align="absmiddle" height="66px" width="72px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, R        &lt;sub&gt;0&lt;/sub&gt;and R        &lt;sub&gt;1&lt;/sub&gt;are each independently a structure of hydrogen, C        &lt;sub&gt;1&lt;/sub&gt;-C        &lt;sub&gt;6&lt;/sub&gt;alkyl, phenyl or        &lt;img align="absmiddle" height="44px" width="71px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, and n and m are each independently an integer from 0 to 300. The oligomer of the present invention is suitable for forming a cured product which can be used as a low dielectric resin material. The present invention also relates to a method for preparing an oligomer and a method for preparing a cured product of the oligomer.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="372" publication-number="202632626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像自動定址方法、系統及紀錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250502B">G09G3/32</main-classification>
        <further-classification edition="202001120250502B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雨潭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雨潭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像自動定址方法，適於在一電子裝置上執行，該影像自動定址方法包含：接收一影像資訊，該影像資訊包括至少一像素資訊；接收一待定目標數量資訊，該待定目標數量資訊指示該影像資訊中所表示之至少一待定目標之數量；決定該至少一待定目標於該影像資訊中之邊界，並獲得指示該邊界之一邊界位置資訊；以及根據該待定目標數量資訊及該邊界位置資訊，決定該至少一待定目標與該至少一像素資訊之對應關係，以作為自動定位待定目標之像素位置之用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101-S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="373" publication-number="202631474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提取單元、堆疊模組與堆疊系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G47/90</main-classification>
        <further-classification edition="200601120260302B">B65G1/04</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">B65G61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻績工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISETECH MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶漳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提取單元，包括一提取平台、至少一抬升件以及一提取模組。抬升件可動地連接於提取平台；提取模組可動地連接於提取平台且包括一提取本體以及二固持件，其中固持件可動地連接於提取本體且彼此相對配置。這些固持件分別包括至少一固持部，且各固持部包括一延伸段以及一提取段，其中提取段連接於延伸段且相對於延伸段偏折。此外，本發明還提供一種適於與上述提取單元協同作用的堆疊模組以及一種包括上述提取單元的堆疊系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:框體</p>
        <p type="p">100:提取平台</p>
        <p type="p">110:支撐件</p>
        <p type="p">120:限位件</p>
        <p type="p">130:調整件</p>
        <p type="p">140:相位感測器</p>
        <p type="p">200:抬升件</p>
        <p type="p">210:主抬升件</p>
        <p type="p">220:周緣抬升件</p>
        <p type="p">300:提取模組</p>
        <p type="p">310:提取本體</p>
        <p type="p">320:固持件</p>
        <p type="p">322:固持部</p>
        <p type="p">322a:延伸段</p>
        <p type="p">322b:提取段</p>
        <p type="p">322c:限位段</p>
        <p type="p">330:止擋件</p>
        <p type="p">340:提取物感測器</p>
        <p type="p">400:暫存平台</p>
        <p type="p">410:輥件</p>
        <p type="p">A:調整方向</p>
        <p type="p">R:收合方向</p>
        <p type="p">T:提取方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="374" publication-number="202633236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體測試結構</chinese-title>
        <english-title>SEMICONDUCTOR TESTING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H29/85</main-classification>
        <further-classification edition="202501120260302B">H10H29/03</further-classification>
        <further-classification edition="202601120260302B">H10W46/00</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瑋珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WEI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭景太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHING-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體測試結構，包含載體、導電層、黏著部以及半導體元件。導電層位於載體上且包含連續表面，連續表面包含第一區和第二區。第一黏著部和第二黏著部位於導電層上，並覆蓋第一區且暴露第二區。第一半導體元件和第二半導體元件分別位於第一黏著部和第二黏著部上，其中第一半導體元件包含第一下電極、第一半導體疊層與第一上電極，在剖視圖中，第一下電極面向第一黏著部，第一上電極背向第一黏著部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor testing structure includes a carrier, a conductive layer, adhesive portions and semiconductor devices. The conductive layer is located on the carrier and includes a continuous surface. The continuous surface includes a first area and a second area. A first adhesive portion and a second adhesive portion are located on the conductive layer, cover the first area and expose the second area. A first semiconductor device and a second semiconductor device are respectively located on the first adhesive portion and the second adhesive portion. The first semiconductor device includes a first lower electrode, a first semiconductor stack and a first upper electrode. In a cross-sectional view, the first lower electrode faces the first adhesive portion, and the first upper electrode faces away from the first adhesive portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:半導體測試結構</p>
        <p type="p">101:載體</p>
        <p type="p">103:導電層</p>
        <p type="p">103S:連續表面</p>
        <p type="p">110:半導體元件</p>
        <p type="p">110-1:第一半導體元件</p>
        <p type="p">110-2:第二半導體元件</p>
        <p type="p">111:半導體疊層</p>
        <p type="p">113:上電極</p>
        <p type="p">115:下電極</p>
        <p type="p">117:導電突塊</p>
        <p type="p">201:第一探針</p>
        <p type="p">202:第二探針</p>
        <p type="p">203:黏著部</p>
        <p type="p">203-1:第一黏著部</p>
        <p type="p">203-2:第二黏著部</p>
        <p type="p">A1:第一區</p>
        <p type="p">A2:第二區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="375" publication-number="202631082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有測量生理資訊功能的智慧戒指</chinese-title>
        <english-title>SMART RING CAPABLE OF MEASURING PHYSIOLOGIC INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">A61B5/02</main-classification>
        <further-classification edition="200601120250205B">A61B5/1455</further-classification>
        <further-classification edition="201801120250205B">G16H50/20</further-classification>
        <further-classification edition="200601120250205B">A44C9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恆達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGH DISTINCTION OPTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妤涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有測量生理資訊功能的智慧戒指，包含有一戒指本體；以及一生理資訊偵測裝置，設置於該戒指本體之預定位置，包含有：一電路板，設置於該戒指本體中，其上設置有一偵測單元與一處理器。該偵測單元包含有一光源模組與一感測器。該光源模組產生複數個偵測光照射一使用者特定位置的皮膚，令該等偵測光會到達皮膚下方組織的不同位置後被反射；該感測器偵測該等偵測光的反射光據以產生偵測訊號。該處理器接收該等偵測訊號並透過一方程式將其轉換為一生理資訊預估值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart ring capable of measuring physiologic information includes a ring member and a physiologic sensing device. The physiologic sensing device has a circuit board provided in the ring member, to which a sensing unit and a processor are connected. The sensing unit has a light module and a sensor. The light module projects detecting lights to a subject who wears the ring member, and the detecting lights are reflected at different portions of subcutaneous tissue. The sensor senses reflections of the detecting lights to generate detecting signals accordingly. The processor receives the detecting signals from the sensor and coverts them into a physiologic value via a predetermined equation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:內環</p>
        <p type="p">28:電路板</p>
        <p type="p">30:偵測單元</p>
        <p type="p">38:基板</p>
        <p type="p">40:光源模組</p>
        <p type="p">42:感測器</p>
        <p type="p">44:隔牆</p>
        <p type="p">46:封裝件</p>
        <p type="p">48:樹脂層</p>
        <p type="p">50:蓋板</p>
        <p type="p">52:光學膜</p>
        <p type="p">54:外牆</p>
        <p type="p">56:第一光源</p>
        <p type="p">58:第二光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="376" publication-number="202632695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變壓器及屏蔽結構</chinese-title>
        <english-title>TRANSFORMER AND SHIELDING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">H01F27/36</main-classification>
        <further-classification edition="200601120250325B">H01F27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡辛衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴育駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉永盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變壓器及屏蔽結構，變壓器包含一初級導電單元、一次級導電單元、一鐵芯組及一屏蔽結構，其中次級導電單元與初級導電單元交錯設置，屏蔽結構的至少一屏蔽部設置在初級導電單元的至少一主繞組及次級導電單元之間。將彎折的屏蔽結構設置在初級導電單元及次級導電單元之間，能夠形成屏蔽而降低電磁干擾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transformer and a shielding structure are provided. The transformer comprises a primary conductive unit, a secondary conductive unit, a core set, and a shielding structure, wherein the secondary conductive unit is electromagnetically coupled to the primary conductive unit. At least one shielding portion of the shielding structure is disposed between at least one main winding of the primary conductive unit and the secondary conductive unit. Arranging the bent shielding structure between the primary conductive unit and the secondary conductive unit forms a shield and reduce electromagnetic interference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:初級導電單元</p>
        <p type="p">3:次級導電單元</p>
        <p type="p">31、32:金屬片</p>
        <p type="p">4:鐵芯組</p>
        <p type="p">41:第一鐵芯</p>
        <p type="p">42:第二鐵芯</p>
        <p type="p">5:屏蔽結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="377" publication-number="202631324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開口扳手結構</chinese-title>
        <english-title>OPEN-END WRENCH STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250506B">B25B13/08</main-classification>
        <further-classification edition="200601120250506B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭議璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YI HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭議璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YI HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種開口扳手結構，包含有：一本體，具有一柄部及一驅動部；該驅動部設於該柄部之一端，具有一驅動槽；該驅動槽之底部具有相連接之一第一抵面及一第二抵面；其中該第一抵面與該第二抵面之間夾一預定角度；以及一活動件，樞設於該驅動槽內，並可於一第一角度與一第二角度間轉動；當該活動件轉動至該第一角度時，該活動件抵靠於該第一抵面；當該活動件轉動至該第二角度時，該活動件抵靠於該第二抵面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An open-end wrench structure comprises a body having a handle portion and a driving portion, with the driving portion located at one end of the handle portion and including a driving slot. The bottom of the driving slot is provided with a first abutting surface and a second abutting surface connected to each other, forming a predetermined angle. A movable member is pivotally disposed within the driving slot and is rotatable between a first angle and a second angle. When the movable member rotates to the first angle, it abuts against the first abutting surface, and when it rotates to the second angle, it abuts against the second abutting surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:開口扳手結構</p>
        <p type="p">10:本體</p>
        <p type="p">11:柄部</p>
        <p type="p">12:驅動部</p>
        <p type="p">122:驅動槽</p>
        <p type="p">13:第二驅動部</p>
        <p type="p">132:第二驅動槽</p>
        <p type="p">14:第三驅動部</p>
        <p type="p">140:第一梅花孔</p>
        <p type="p">15:第四驅動部</p>
        <p type="p">150:第二梅花孔</p>
        <p type="p">16:第五驅動部</p>
        <p type="p">160:插孔</p>
        <p type="p">20:活動件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="378" publication-number="202633199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器的形成方法</chinese-title>
        <english-title>METHOD FOR FORMING IMAGE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250205B">H10F39/12</main-classification>
        <further-classification edition="202501120250205B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴郁元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, E JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成影像感測器的方法，其包括以下步驟。提供基底。基底包括彼此相對的第一表面和第二表面。於基底中形成自第一表面延伸至其中的第一隔離結構。於基底的第二表面上形成罩幕圖案。自基底的第二表面移除基底的被罩幕圖案所暴露之部分，以於其中形成界定畫素區域的溝渠圖案。溝渠圖案包括在第一方向或第二方向具有第一寬度的第一部分以及在相對於第一方向和第二方向的對角方向上具有第二寬度的第二部分。於罩幕圖案上形成填滿溝渠圖案的第一部分且形成於溝渠圖案的第二部分的底面和側面上的第一材料層。於第一材料層上形成第二材料層，其中第二材料層於溝渠圖案的第二部分中界定第一開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for forming an image sensor, which includes following steps. A substrate including a first surface and a second surface opposite to each other. A first isolation structure extending from the first surface into the substrate is formed. A mask pattern is formed on the second surface of the substrate. A portion of the substrate exposed by the mask pattern is removed from the second surface of the substrate to form a trench pattern defining the pixel regions in the substrate. The trench pattern includes a first portion having a first width in a first or a second direction, and a second portion having a second width in a diagonal direction with respect to the first and second direction. A first material layer on the mask pattern is formed to fill up the first portion of the trench pattern and to form on a bottom surface and a side surface of the second portion of the trench pattern. A second material layer is formed on the first material layer, wherein the second material layer defines a first opening in the second portion of the trench pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">102:第一隔離結構</p>
        <p type="p">104a:第一部分</p>
        <p type="p">104b:第二部分</p>
        <p type="p">110:罩幕圖案</p>
        <p type="p">120:第一材料層</p>
        <p type="p">130:第二材料層</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">PX:畫素區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="379" publication-number="202631089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>植牙結構之改良</chinese-title>
        <english-title>IMPROVED DENTAL IMPLANT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">A61C13/007</main-classification>
        <further-classification edition="200601120250205B">A61C13/08</further-classification>
        <further-classification edition="200601120250205B">A61C8/00</further-classification>
        <further-classification edition="200601120250205B">A61C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林良信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIANG SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林良信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIANG SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種植牙結構之改良，包含有：一植體，一端具有一定位部； 一外冠，套設於該植體；該外冠相鄰於該定位部之軸向一端具有一定位孔，用以供該植體之該定位部插入；以及一牙冠，一端具有一結合孔，用以供該外冠遠離該植體之一端插入固定；其中該植體之該定位部之外徑朝接近該外冠的方向漸縮，使該定位部之外周緣與該植體之軸向之間夾一預定角度；其中該定位孔之內徑朝遠離該植體的方向漸縮，使該定位孔之內周緣與該外冠之軸向之間夾該預定角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An improved dental implant structure comprises an implant, an outer crown, and a dental crown. The implant has a positioning portion at one end. The outer crown is sleeved onto the implant, with an axial end adjacent to the positioning portion having a positioning hole for the insertion of the implant's positioning portion. The dental crown has a coupling hole at one end for the insertion and fixation of the end of the outer crown distal from the implant. The outer diameter of the implant's positioning portion tapers in the direction toward the outer crown, forming a predetermined angle between the peripheral surface of the positioning portion and the axial direction of the implant. Similarly, the inner diameter of the positioning hole tapers in the direction away from the implant, forming the same predetermined angle between the inner peripheral surface of the positioning hole and the axial direction of the outer crown.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:植體</p>
        <p type="p">11:螺紋部</p>
        <p type="p">110:外螺紋</p>
        <p type="p">12:定位部</p>
        <p type="p">120:長槽</p>
        <p type="p">13:帽部</p>
        <p type="p">20:外冠</p>
        <p type="p">21:上層</p>
        <p type="p">22:下層</p>
        <p type="p">23:凹槽部</p>
        <p type="p">24:倒角部</p>
        <p type="p">25:定位孔</p>
        <p type="p">30:牙冠</p>
        <p type="p">31:結合孔</p>
        <p type="p">100:齒槽骨</p>
        <p type="p">200:牙齦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="380" publication-number="202631237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子遊戲之類比圖像的數位偵測方法及應用其之電子裝置</chinese-title>
        <english-title>DIGITAL DETECTION METHOD FOR ANALOG IMAGE IN ELECTRONIC GAME AND ELECTRIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250326B">A63F13/533</main-classification>
        <further-classification edition="201401120250326B">A63F13/58</further-classification>
        <further-classification edition="201401120250326B">A63F13/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子遊戲之類比圖像的數位偵測方法及應用其之電子裝置。電子遊戲之類比圖像的數位偵測方法包括以下步驟。擷取一螢幕畫面。以一圖像搜尋模型，於螢幕畫面辨識出一類比圖像。以一百分比辨識模型，辨識類比圖像之一數位百分比資訊。依據數位百分比資訊，提供一提示訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital detection method for an analog image in an electric game and an electronic device using the same are provided. The digital detection method for the analog image in the electronic game includes the following steps. A screen frame is captured. An image search model is used to recognize an analog image on the screen frame. A percentage recognition model is used to recognize a digital percentage information of the analog image. A prompt message is provided according to the digital percentage information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S120,S130,S140,S150,S151:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="381" publication-number="202631065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具快速製冷保鮮之智能鮮乳供應站</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250618B">A47J31/40</main-classification>
        <further-classification edition="200601120250618B">A47J31/44</further-classification>
        <further-classification edition="200601120250618B">A47J31/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淑禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHU-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淑禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHU-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要係有關一種具快速製冷保鮮之智能鮮乳供應站，主要係當鮮乳在進行補充時，在60秒內能令鮮乳溫度由4℃進入至2℃，以使鮮乳達到快速製冷保鮮的效果，藉由導冷立管內部的液態氮及該乙二醇冷卻劑透過壓縮機管路的製冷施加於該液態氮及該乙二醇冷卻劑後產生加乘製冷作用，及擴冷鰭片的擴張製冷以進一步將製冷效果傳導至冷藏室的內部中央的縱深位置及周圍區域，讓鮮乳能確實在每一空間位置都能達到保鮮保冷效果，以維持鮮乳原料的新鮮度及食品衛生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器</p>
        <p type="p">11:廣告面板</p>
        <p type="p">12:販售交易人機介面</p>
        <p type="p">14:投幣孔</p>
        <p type="p">15:語音系統</p>
        <p type="p">17:信用卡交易感應介面</p>
        <p type="p">30:製冷保鮮模組</p>
        <p type="p">A1:全脂配給室</p>
        <p type="p">A2:密封門板</p>
        <p type="p">A3:手把</p>
        <p type="p">B1:脫脂鮮乳配給室</p>
        <p type="p">B2:密封門板</p>
        <p type="p">B3:手把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="382" publication-number="202632302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線量測治具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G01R29/10</main-classification>
        <further-classification edition="200601120250303B">G01R1/04</further-classification>
        <further-classification edition="200601120250303B">G01R1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JYH LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊超舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方奕閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種天線量測治具，包含：底座，用於提供穩固天線量測治具的基底，其具有：底部螺孔，用於將天線量測治具固定於量測設備上；中央柱體，由底座之中心垂直向上延伸，其具有：中空線槽，提供多種纜線之繞線方式；底部通孔，用於將纜線直接連接至天線；頂部開孔，用於卡固天線，避免天線移動或轉動而產生量測偏差；以及天線載台，用於定位天線之放置位置，其具有：天線載槽柱體，其中間係具有載槽，用於卡固天線。本發明可提供在進行毫米波OTA測試時，提升量測時天線之固定穩定性及纜線管理能力，據此獲得更佳可靠且精確的量測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底座</p>
        <p type="p">11:底部螺孔</p>
        <p type="p">12:滑軌</p>
        <p type="p">13:底凸線區</p>
        <p type="p">2:中央柱體</p>
        <p type="p">21:中空線槽</p>
        <p type="p">22:底部通孔</p>
        <p type="p">23:頂部開孔</p>
        <p type="p">24:側部開孔</p>
        <p type="p">3:天線載台</p>
        <p type="p">31:天線載槽柱體</p>
        <p type="p">32:固定天線螺絲孔</p>
        <p type="p">33:載槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="383" publication-number="202632925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以求入端中心化ＧＳＩＤ（Ｇｌｏｂａｌ　Ｓｅｃｕｒｉｔｙ　Ｉｄｅｎｔｉｔｙ）識別之認證方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H04L9/32</main-classification>
        <further-classification edition="202201120250602B">H04L9/40</further-classification>
        <further-classification edition="201301120250602B">G06F21/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石繼志</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種以求入端中心化GSID(Global Security Identity)識別之認證方法，步驟至少包括設置一管理平台，該管理平台與一第一信賴憑證者網站(Relying Party)間與一第二信賴憑證者網站(Relying Party)分別形成網路聯繫，且該管理平台與該第一、第二信賴憑證者網站(Relying Party)間各形成提供一求入端許可與授權之協定，該協定以求入端初始向管理平台申請資訊，並以國際安全驗證(GSID，Global Security Identity)之規格作為中心化與通用識別協定，所形成之應用識別編碼(AI碼)，且該應用識別編碼(AI碼)係以求入端之分別資訊接續並為串列，且該第一、第二信賴憑證者網站(Relying Party)分別提供一共同相容於該應用識別編碼(AI碼)之欄位作為共通編碼，並作為識別。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(1):管理平台</p>
        <p type="p">(2):第一信賴憑證者網站(Relying Party)</p>
        <p type="p">(3):第二信賴憑證者網站(Relying Party)</p>
        <p type="p">(4):求入端</p>
        <p type="p">(5):應用識別編碼(AI碼)</p>
        <p type="p">(6):網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="384" publication-number="202632927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網路影音認證系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250602B">H04L9/40</main-classification>
        <further-classification edition="200601120250602B">H04L9/32</further-classification>
        <further-classification edition="201301120250602B">G06F21/00</further-classification>
        <further-classification edition="201301120250602B">G06F21/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石繼志</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種網路影音認證系統，包括一平台，該平台電性連接一驗證伺服單元(Auth-Service)與一使用者伺服單元(User-Service)，該使用者伺服單元(User-Service)與一影音發表端間以個人數位鏈(PDL，Person Digital Link)為連繫，該影音發表端與該個人數位鏈間設有一條碼核發單元，藉以提供由該影音發表端所傳送影音檔案之外部型態呈現一反映網址之防偽條碼，以供一第三方閱聽端之閱聽者掃描該後，形成網路聯繫並可閱聽該影音，以確保該影音發表端所發表之影音與該第三方閱聽端之閱聽影音檔案內容相符，進而可避免所發表之影音遭惡意變造或竄改，而形成防偽認證機制。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(1):平台</p>
        <p type="p">(11):驗證伺服單元(Auth-Service)</p>
        <p type="p">(12):使用者伺服單元(User-Service)</p>
        <p type="p">(13):影音發表端</p>
        <p type="p">(14):個人數位鏈(PDL，Person Digital Link)</p>
        <p type="p">(15):第三方閱聽端</p>
        <p type="p">(16):網路</p>
        <p type="p">(17):條碼核發單元</p>
        <p type="p">(18):影音檔案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="385" publication-number="202632270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>布料剛性預測方法</chinese-title>
        <english-title>FABRIC RIGIDITY PREDICTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G01N33/36</main-classification>
        <further-classification edition="201201120250418B">G06Q50/04</further-classification>
        <further-classification edition="202301120250418B">G06F18/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈培德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, PEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HON-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜芝儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIH-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱伃仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, YU-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">布料剛性預測方法包含:藉由一布料分析儀測量參考布料組中的第一參考布料組，以產生第一參考布料組的第一參考彎曲剛性參數組及第一參考拉伸剛性參數組；依據第一參考彎曲剛性參數組及第一參考布料組的第一參考輸入特徵參數組，產生第一彎曲剛性斜率組；依據第一參考拉伸剛性參數組及第一參考輸入特徵參數組，產生第一拉伸剛性斜率組；以及依據待測布料的待測輸入特徵參數組及第一彎曲剛性斜率組預測待測布料的預測彎曲剛性參數，並依據待測輸入特徵參數組及第一拉伸剛性斜率組預測待測布料的預測拉伸剛性參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fabric rigidity prediction method includes: measuring a first reference fabric group in the reference fabric groups by a fabric analyzing device, to generate a first reference bending rigidity parameter group and a first reference stretching rigidity parameter group of the first reference fabric group; generating a first bending rigidity slope group according to the first reference bending rigidity parameter group and a first reference input feature parameter group of the first reference fabric group; generating a first stretching rigidity slope group according to the first reference stretching rigidity parameter group and the first reference input feature parameter group; and predicting a predicted bending rigidity parameter of a measured fabric according to a measured input feature parameter group of the measured fabric and the first bending rigidity slope group, and predicting a predicted stretching rigidity parameter of the measured fabric according to the measured input feature parameter group and the first stretching rigidity slope group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:布料剛性預測方法</p>
        <p type="p">OP31~OP36:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="386" publication-number="202632765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋰電池放電添加劑及其應用</chinese-title>
        <english-title>LITHIUM BATTERY DISCHARGE ADDITIVE AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250602B">H01M10/052</main-classification>
        <further-classification edition="201001120250602B">H01M10/0567</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優勝奈米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UWIN NANOTECH. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許景翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何享穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HSIANG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周韋伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種鋰電池放電添加劑，包括30-50wt%的硫酸鹽、30-50wt%的硝酸鹽以及10-20wt%的碳酸鹽，且不包括鹵素。其中硫酸鹽係選自硫酸鈉、硫酸鉀、硫酸鎂及其組合；硝酸鹽係選自硝酸鉀、硝酸銨、硝酸鈣及其組合；碳酸鹽係選自碳酸鈉、碳酸鉀、碳酸銨及其組合。該鋰電池放電添加劑與水混合形成鋰電池放電液。本發明更提供一種使用該鋰電池放電液對電池放電的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lithium battery discharge additive is provided. The additive comprises 30-50 wt% of sulfates, 30-50 wt% of nitrates, and 10-20 wt% of carbonates, and excludes halogens. The sulfates are selected from sodium sulfate, potassium sulfate, magnesium sulfate, and combinations thereof. The nitrates are selected from potassium nitrate, ammonium nitrate, calcium nitrate, and combinations thereof. The carbonates are selected from sodium carbonate, potassium carbonate, ammonium carbonate, and combinations thereof. The lithium battery discharge additive is mixed with water to form a lithium battery discharge solution. Furthermore, a method for discharging lithium battery using the lithium battery discharge solution is provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="387" publication-number="202632308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於充電樁的檢測裝置以及檢測方法</chinese-title>
        <english-title>DETECTION DEVICE AND DETECTION METHOD FOR CHARGING PILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250303B">G01R31/36</main-classification>
        <further-classification edition="201901120250303B">B60L53/60</further-classification>
        <further-classification edition="201901120250303B">B60L58/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TSUNG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於充電樁的檢測裝置以及檢測方法。充電樁包括第一電源線、第二電源線、第一輸出端、第二輸出端以及繼電器。第二輸出端連接於第二電源線。繼電器連接於第一電源線與第一輸出端之間。檢測裝置包括虛擬負載電路、檢測電路以及控制器。控制器導通繼電器並控制虛擬負載電路形成虛擬負載路徑，控制檢測電路產生測試電流，並計時測試電流被產生的時間長度。控制器依據測試電流斷開繼電器以停止產生測試電流並產生計時值，並依據計時值判斷繼電器的老化狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection device and a detection method for a charging pile are provided. The charging pile includes a first power line, a second power line, a first output terminal, a second output terminal and a relay. The second output terminal is connected to the second power line. The relay is connected between the first power line and the first output terminal. The detection device includes a virtual load circuit, a detection circuit and a controller. The controller turns on the relay and controls the virtual load circuit to form a virtual load path, controls the detection circuit to generate a test leakage current, and times a length of time when the test leakage current is generated. The controller turns off the relay according to the test leakage current and generates a timing value, and determines the aging condition of the relay based on the timing value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:充電樁</p>
        <p type="p">100:檢測裝置</p>
        <p type="p">110:虛擬負載電路</p>
        <p type="p">120:檢測電路</p>
        <p type="p">130:控制器</p>
        <p type="p">CV:計時值</p>
        <p type="p">ILT:測試電流</p>
        <p type="p">L1:第一電源線</p>
        <p type="p">L2:第二電源線</p>
        <p type="p">P1:第一輸出端</p>
        <p type="p">P2:第二輸出端</p>
        <p type="p">PL:虛擬負載路徑</p>
        <p type="p">RL1、RL2:繼電器</p>
        <p type="p">SC1、SC2、SC3、SC4:控制訊號</p>
        <p type="p">SV:設定值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="388" publication-number="202632577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雲端服務的帳務處理系統和帳務處理方法</chinese-title>
        <english-title>BILLING PROCESSING SYSTEM AND BILLING PROCESSING METHOD OF CLOUD SERVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250527B">G06Q30/04</main-classification>
        <further-classification edition="201201120250527B">G06Q20/08</further-classification>
        <further-classification edition="201801120250527B">G06F9/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許馨譽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIU, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種雲端服務的帳務處理系統和帳務處理方法。方法包含：接收基於領域語言撰寫的帳務批價命令；解析帳務批價命令以取得程式碼，並且封裝程式碼以產生批價檔案；傳送批價檔案至平行化引擎以產生批價結果；以及根據批價結果產生帳單，並且輸出帳單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A billing processing system and a billing processing method of cloud service are provided. The method includes: receiving a billing pricing command written in a domain language; analyzing the billing pricing command to obtain a pricing file; transmitting the pricing file to a parallelization engine to generate a pricing result; and generating a bill according to the pricing result and outputting the bill.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301,S302,S303,S304:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="389" publication-number="202632311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防手震測距型光學裝置</chinese-title>
        <english-title>OPTICAL RANGING DEVICE WITH OPTICAL IMAGE STABILIZATION FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G01S7/481</main-classification>
        <further-classification edition="200601120250602B">G01S17/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬芳麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, FANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉華唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUA-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉江林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳月葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUE-YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許庭榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TING-RUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防手震測距型光學裝置，其包括一發射組件、一接收組件、一第一防手震模組、一限位機構以及一控制模組。發射組件發射一偵測光束，偵測光束照射至待測物且由待測物反射而形成一反射光束。反射光束由接收組件接收。第一防手震模組對應於發射組件，第一防手震模組包括一第一鏡片以及一第一補償組件，第一鏡片具有一第一光軸，偵測光束穿過第一鏡片，第一補償組件使第一鏡片與發射組件相對移動使偵測光束保持照射至待測物。限位機構結合於第一補償組件，限位機構限制第一鏡片的移動行程。控制模組電性連接於第一補償組件，使得第一鏡片的第一光軸在限位機構所限制的移動行程內移動或置中固定；其中第一補償組件包括一驅動件以及一限位件，驅動件驅動限位件由限位機構限制而於一鎖扣解鎖行程內移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical ranging device includes a transmitting component, a receiving component, a first OIS module, a limiting mechanism and a control module. The emitting component emits a detection beam travel toward an object to be measured and is reflected by the object to form a reflected beam. The reflected beam is received by the receiving component. The first OIS module corresponds to the transmitting component and includes a first lens having a first optical axis and a first compensation component. As the detection beam passes through the first lens, the first compensation component moves the first lens relative to the emitting component, whereby the detection beam is maintained to reach the object to be measured. As the reflected light beam passes through the second lens, the second compensation components move the second lens relative to the receiving component, whereby the reflected light beam is maintained to be received by the receiving component. The limiting mechanism is joined to the first OIS module and to limit the stroke of the first lens. The control module is electrically connected to the first compensation component, and controls the first compensation component to move the first optical axis of the first lens. The first OIS module includes a driving member and a limiting member. The driving member drives the limiting member to move in a locking-unlocking stroke.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防手震測距型光學裝置</p>
        <p type="p">10:發射組件</p>
        <p type="p">11:光源件</p>
        <p type="p">12:反射鏡</p>
        <p type="p">20:接收組件</p>
        <p type="p">21:接收件</p>
        <p type="p">22:收光件</p>
        <p type="p">30:第一防手震模組</p>
        <p type="p">31:第一鏡片</p>
        <p type="p">32:第一補償組件</p>
        <p type="p">40:第二防手震模組</p>
        <p type="p">41:第二鏡片</p>
        <p type="p">42:第二補償組件</p>
        <p type="p">50:控制模組</p>
        <p type="p">60:望遠模組</p>
        <p type="p">61:透鏡組</p>
        <p type="p">62:稜鏡</p>
        <p type="p">311:第一光軸</p>
        <p type="p">411:第二光軸</p>
        <p type="p">611:物鏡端</p>
        <p type="p">612:目鏡端</p>
        <p type="p">613:望遠光軸</p>
        <p type="p">P1:第一截面</p>
        <p type="p">P2:第二截面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="390" publication-number="202631169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳酸菌組合物用以製備治療或預防酒精性胃損傷的醫藥組合物的用途</chinese-title>
        <english-title>USE OF LACTIC ACID BACTERIA COMPOSITION FOR PREPARING PHARMACEUTICAL COMPOSITION FOR TREATING OR PREVENTING ALCOHOLIC GASTRIC DAMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250502B">A61K35/747</main-classification>
        <further-classification edition="201501120250502B">A61K35/744</further-classification>
        <further-classification edition="200601120250502B">A61P1/04</further-classification>
        <further-classification edition="200601120250502B">A61P1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葡萄王生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAPE KING BIO LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯毓欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CI-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石仰慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳姿和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZI-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乳酸菌組合物的用途，所述乳酸菌組合物具有治療或預防酒精性胃損傷的效果。藉此，乳酸菌組合物可用於製備治療或預防酒精性胃損傷的醫藥組合物，並有相關市場的應用潛力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a use of lactic acid bacteria composition, and the lactic acid bacteria composition has a capability to treat or prevent the alcoholic gastric damage. Therefore, the lactic acid bacteria composition can be used to prepare a pharmaceutical composition for treating or preventing the alcoholic gastric damage and has application potential in the relevant market.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:乳酸菌組合物的製備方法</p>
        <p type="p">110,120,130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="391" publication-number="202631306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對位平台</chinese-title>
        <english-title>ALIGNMENT PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">B23Q16/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種對位平台，其包括：一基座；一載台；及一調整模組，設於該基座且可帶動該載台移動，該調整模組包括至少一高度調整模組、至少一XY調整模組及至少一第一驅動機構，各該高度調整模組包括一活動座及一承載部，該承載部設於該活動座且可相對斜向滑動，該至少一第一驅動機構可帶動至少一該活動座移動，各該XY調整模組包括一X軸移動平台及一Y軸移動平台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A alignment platform is provided, including: a base; a stage; and an adjustment module disposed on the base and configured to drive the stage to move. The adjustment module includes at least one height adjustment module, at least one XY adjustment module, and at least one first driving mechanism. Each height adjustment module includes a movable seat and a support portion, wherein the support portion is disposed on the movable seat and can slide obliquely relative thereto. The at least one first driving mechanism can drive at least one of the movable seats to move. Each XY adjustment module includes an X-axis moving platform and a Y-axis moving platform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:對位平台</p>
        <p type="p">5:中心軸線</p>
        <p type="p">6:調整模組</p>
        <p type="p">10:基座</p>
        <p type="p">20:載台</p>
        <p type="p">30:高度調整模組</p>
        <p type="p">31:活動座</p>
        <p type="p">32:承載部</p>
        <p type="p">50,50a,50b:XY調整模組</p>
        <p type="p">53:弧凸部</p>
        <p type="p">60:第一驅動機構</p>
        <p type="p">70:第三驅動機構</p>
        <p type="p">80:第二驅動機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="392" publication-number="202631301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水平調整平台</chinese-title>
        <english-title>LEVELING PLATFORM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">B23Q3/154</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種水平調整平台，其包括：一基座；至少三水平調整模組，該至少三水平調整模組設於該基座，各該水平調整模組包括一活動座及一承載部，該承載部之一第一傾斜部可斜向滑動地設於該活動座之一第二傾斜部；至少一驅動機構，該至少一驅動機構包括一驅動馬達及一剎車機構，該驅動馬達可帶動該活動座相對該承載部滑動；及一平台，設置於該至少三水平調整模組上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A leveling platform is provided, including: a base; at least three leveling adjustment modules arranged on the base, each of the leveling adjustment modules comprising a movable seat and a supporting portion, wherein a first inclined section of the supporting portion is disposed in an inclined and slidable manner on a second inclined section of the movable seat; at least one drive mechanism, including a driving motor and a braking mechanism, the driving motor being configured to drive the movable seat to slide relative to the supporting portion; and a platform disposed on the at least three leveling adjustment modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水平調整平台</p>
        <p type="p">10:基座</p>
        <p type="p">20:水平調整模組</p>
        <p type="p">40:平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="393" publication-number="202632869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸入控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02M3/335</main-classification>
        <further-classification edition="200601120251103B">H02M3/04</further-classification>
        <further-classification edition="200601120251103B">H02M7/217</further-classification>
        <further-classification edition="200601120251103B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商明緯（廣州）電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL (GUANGZHOU) ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明緯企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王士昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝其翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種輸入控制方法，其設定能源回收系統之輸入電壓與輸出電壓之最大值。接著，輸入等於最大值之輸入電壓至能源回收系統，並控制輸入功率從0開始以固定量逐次上升，以計算在輸出電壓等於最大值時，輸入功率對應之主控制訊號的第一最大責任週期。再來，控制輸入功率從0開始以固定量逐次上升，且輸入電壓從最大值開始以固定量逐次下降，以計算在輸出電壓等於最大值時，輸入功率與輸入電壓對應之主控制訊號的第二最大責任週期。最後，根據計算結果製作對應不同輸入電壓之多條責任週期與輸入功率曲線，並據此控制能源回收系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S12、S14、S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="394" publication-number="202631477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銦片加工方法與銦片加工機台</chinese-title>
        <english-title>PROCESSING METHOD OF INDIUM FOIL AND PROCESSING MACHINE OF INDIUM FOIL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">B65G59/04</main-classification>
        <further-classification edition="200601120250602B">B65G69/20</further-classification>
        <further-classification edition="200601120250602B">B25J19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種銦片加工方法。在此方法中，將未運載任何銦片之植片頭移動至雷射測距感測器之上方，以利用雷射測距感測器進行第一量測操作，而取得未運載任何銦片之植片頭之基準高度。利用植片頭進行銦片吸取操作。於銦片吸取操作後，將植片頭移動至雷射測距感測器之上方，以利用該雷射測距感測器進行第二量測操作，以取得植片頭之檢測高度。利用控制器基於基準高度與檢測高度之差值，判斷植片頭於銦片吸取操作之銦片吸取量是否異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing method of indium foil is disclosed. In this method, a placement head without carrying any indium foils is moved to a top of the laser distance sensor to use a laser distance sensor to perform a first measuring operation to obtain a reference height of the placement head without carrying any indium foils. The placement head is used to perform an indium foil suction operation. After the indium foil suction operation is completed, the placement head is moved to the top of the laser distance sensor and the laser distance sensor is used to perform a second measuring operation to obtain a detecting height of the placement head. A controller is used to determine whether an amount of indium foils picked up by the placement head during the indium foil suction operation is abnormal based on a difference between the reference height and the detecting height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:銦片加工機台</p>
        <p type="p">110:平台</p>
        <p type="p">112:作業區</p>
        <p type="p">114:供料區</p>
        <p type="p">116:回收區</p>
        <p type="p">120:供料裝置</p>
        <p type="p">130:運載裝置</p>
        <p type="p">140:植片頭</p>
        <p type="p">150:雷射測距感測器</p>
        <p type="p">170:上偵測裝置</p>
        <p type="p">180:下偵測裝置</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="395" publication-number="202632325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濾光膜</chinese-title>
        <english-title>FILTER FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G02B5/22</main-classification>
        <further-classification edition="200601120250502B">G02F1/13357</further-classification>
        <further-classification edition="202301120250502B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芥菜種創意股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSTARD SEED DESIGN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許展榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAN JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請在於提供一種濾光膜，濾光膜是於一透明基板上形成由多個染料混合的光吸收層，光吸收層包括一第一吸光染料與一第二吸光染料。第一吸光染料吸收介於435nm至460nm的藍光。第二吸光染料吸收平均吸收率大於15%介於580至620nm的橘紅光。因此，本申請透過橘紅光波段吸收來直接補償濾除藍光波段後的色溫，讓濾光膜除具有高藍光危害阻絕效果又能維持顯示的雙重效果外，亦可以通用在LCD與OLED背光模組的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical filter film. The filter film comprises a light absorption layer formed on a transparent substrate, where the light absorption layer consists of a mixture of multiple dyes, including a first light-absorbing dye and a second light-absorbing dye. The first light-absorbing dye absorbs blue light between 435nm and 440nm. The second light-absorbing dye has an average absorption rate of more than 15% for orange-red light between 580nm and 620nm. Therefore, the present disclosure directly compensates the color temperature after filtering the blue light wavelength by absorbing orange-red light. This allows the filter film to not only achieve the dual effects of high blue light hazard blocking while maintaining display performance but also makes it universally applicable for both LCD and OLED backlight module applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,12:波形</p>
        <p type="p">20:藍光波段</p>
        <p type="p">22:橘紅光波段</p>
        <p type="p">24:藍紫光波段</p>
        <p type="p">26:綠光波段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="396" publication-number="202631225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手持運動設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">A63B21/02</main-classification>
        <further-classification edition="200601120250526B">A63B23/12</further-classification>
        <further-classification edition="200601120250526B">A61H1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>炘起企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴鼎睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之手持運動設備包括一彈力帶及二握把。二握把用以供彈力帶纏繞連接，且位在彈力帶的二端。二握把的每一者包括一手持本體及一結合本體。結合本體連接手持本體，且用以固定彈力帶。結合本體包括一基座、一頸、一定位座及一夾臂。基座連接手持本體。頸連接基座及定位座，以供彈力帶纏繞，夾臂設置於定位座，且用以透過定位座夾持固定彈力帶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手持運動設備</p>
        <p type="p">10:彈力帶</p>
        <p type="p">30:第一握把</p>
        <p type="p">31:手持本體</p>
        <p type="p">311:結合座</p>
        <p type="p">313:握持部</p>
        <p type="p">315:延伸部</p>
        <p type="p">317:穿口</p>
        <p type="p">35:結合本體</p>
        <p type="p">357:夾臂</p>
        <p type="p">37:電子裝置</p>
        <p type="p">375:顯示暨輸入模組</p>
        <p type="p">40:第二握把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="397" publication-number="202631226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子式的手持運動設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">A63B21/02</main-classification>
        <further-classification edition="200601120250526B">A63B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>炘起企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴鼎睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的手持運動裝置運動設備包括一彈力帶、一第一握把及一第二握把。第一握把及第二握把分別供彈力帶纏繞固定，且位在彈力帶的二端。第一握把包括一手持本體、一結合本體、一力感測器及一電子裝置。結合本體連接手持本體，且用以固定彈力帶。力感測器連接手持本體。在彈力帶被拉伸時，力感測器被觸發，以產生對應的一拉力信號。電子裝置設置於手持本體，且具有對應一重力的一拉力目標，以在拉力信號符合拉力目標時計數一次。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手持運動設備</p>
        <p type="p">10:彈力帶</p>
        <p type="p">30:第一握把</p>
        <p type="p">31:手持本體</p>
        <p type="p">311:結合座</p>
        <p type="p">313:握持部</p>
        <p type="p">315:延伸部</p>
        <p type="p">317:穿口</p>
        <p type="p">35:結合本體</p>
        <p type="p">357:夾臂</p>
        <p type="p">37:電子裝置</p>
        <p type="p">375:顯示暨輸入模組</p>
        <p type="p">40:第二握把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="398" publication-number="202632015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高強度之Ａｌ－Ｚｎ－Ｍｇ－Ｃｕ－Ａｇ合金</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C22C21/10</main-classification>
        <further-classification edition="200601120250801B">C22F1/053</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾有志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李勝隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHENG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林沛筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳詩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡毅龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種高強度之Al-Zn-Mg-Cu-Ag合金，其成分包括：9.0~9.7重量百分比的鋅、1.5~1.7重量百分比的鎂、1.2~1.6重量百分比的銅、0.05~0.1重量百分比的鋯、0.05~0.1重量百分比的銀以及86.8~88.2重量百分比的鋁，本發明合金強度提升至720MPa，且延性可達10%。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="399" publication-number="202631055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>座椅背桿及底盤組合結構</chinese-title>
        <english-title>SEATBACK ROD AND CHASSIS ASSEMBLY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250618B">A47C7/34</main-classification>
        <further-classification edition="200601120250618B">A47C7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>及樺實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OASYSCHAIR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冬春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張以彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種座椅背桿及底盤組合結構，包括一底盤、一背桿、一彈性裝置、一組接桿，該底盤具頂面、底面，又具一組接槽孔，又該底面設置一左、右方向之凹槽。又該背桿底部前端設置一接合座，該接合座具二左右相對之側壁，該側壁前側上方設置一可嵌入該凹槽內之嵌接柱，又於對應該組接槽孔位置設置一第一透孔。又該彈性裝置具彈性並與該接合座底面抵靠。又該組接桿具一直徑大於該組接槽孔寬度之端部，該端部下方穿插該組接槽孔、該第一透孔、該彈性裝置組合；藉此本發明可具較佳作動穩定及躺靠舒適性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a seatback rod and chassis assembly structure, comprising a chassis, a seatback rod, an elastic device, and a connecting rod set. The chassis has a top surface and a bottom surface, along with a set of connecting slot holes. Additionally, the bottom surface is provided with grooves extending in the left and right directions. The front end of the bottom portion of the seatback rod is provided with a coupling base, which has two laterally opposed side walls. An engaging post, which can be embedded into the grooves, is arranged on the upper front side of the side walls. Furthermore, a first through hole is provided at a position corresponding to the set of connecting slot holes. The elastic device possesses elasticity and is positioned to abut against the bottom surface of the coupling base. The connecting rod set includes an end portion with a diameter larger than the width of the connecting slot holes. The lower part of this end portion passes through the set of connecting slot holes, the first through hole, and the elastic device for assembly. By this configuration, the present invention provides improved operational stability and enhanced reclining comfort.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底盤</p>
        <p type="p">12:底面</p>
        <p type="p">13:組接槽孔</p>
        <p type="p">131:側壁</p>
        <p type="p">132:開口</p>
        <p type="p">14:接合孔</p>
        <p type="p">15:凹槽</p>
        <p type="p">16:擋片</p>
        <p type="p">2:背桿</p>
        <p type="p">21:接合座</p>
        <p type="p">22:側壁</p>
        <p type="p">23:嵌接柱</p>
        <p type="p">24:後靠緣</p>
        <p type="p">25:上靠緣</p>
        <p type="p">26:第一透孔</p>
        <p type="p">3:彈性裝置</p>
        <p type="p">31:彈簧</p>
        <p type="p">32:抵壓座</p>
        <p type="p">322:環壁</p>
        <p type="p">323:第一套合槽</p>
        <p type="p">33:套接座</p>
        <p type="p">331:底壁</p>
        <p type="p">332:環壁</p>
        <p type="p">334:組接孔</p>
        <p type="p">4:組接桿</p>
        <p type="p">41:端部</p>
        <p type="p">411:底面</p>
        <p type="p">42:貼靠部</p>
        <p type="p">43:組合部</p>
        <p type="p">5:限位塊</p>
        <p type="p">51:彈性部</p>
        <p type="p">52:勾部</p>
        <p type="p">521:導斜面</p>
        <p type="p">53:套合槽</p>
        <p type="p">54:接合孔</p>
        <p type="p">55:接合元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="400" publication-number="202631054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>座椅背桿及底盤組合構造</chinese-title>
        <english-title>SEATBACK ROD AND CHASSIS ASSEMBLY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">A47C7/00</main-classification>
        <further-classification edition="200601120250430B">A47C7/40</further-classification>
        <further-classification edition="200601120250430B">A47C1/024</further-classification>
        <further-classification edition="200601120250430B">A47C3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>及樺實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OASYSCHAIR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘冬春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張以彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種座椅背桿及底盤組合構造，包括一底盤、一背桿、一彈性裝置、一組接桿、一限位塊。該底盤具頂面、底面，又具一組接槽孔，該組接槽孔具二側壁，後方具開口。又該背桿底部前端設置一接合座，該接合座具二左右相對之側壁，又於對應該組接槽孔位置設置一第一透孔、又該彈性裝置具彈性並與該接合座底面抵靠；又該組接桿具一直徑大於該組接槽孔寬度之端部，該端部下方穿插該組接槽孔、該第一透孔該彈性裝置組合。又該限位塊設於該底盤上對應該組接槽孔位置；藉此本發明可具較佳組裝便利功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a seatback rod and chassis assembly structure, comprising a chassis, a seatback rod, an elastic device, a connecting rod set, and a limiting block. The chassis has a top surface and a bottom surface, along with a set of connecting slot holes. These slot holes have two side walls and an opening at the rear. The front end of the bottom portion of the seatback rod is provided with a coupling base, which has two laterally opposed side walls. Additionally, a first through hole is provided at a position corresponding to the set of connecting slot holes. The elastic device possesses elasticity and is positioned to abut against the bottom surface of the coupling base. The connecting rod set includes an end portion with a diameter larger than the width of the connecting slot holes. The lower part of this end portion passes through the set of connecting slot holes, the first through hole, and the elastic device for assembly. Furthermore, the limiting block is arranged on the chassis at a position corresponding to the set of connecting slot holes. By this configuration, the present invention provides improved assembly convenience and efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底盤</p>
        <p type="p">12:底面</p>
        <p type="p">13:組接槽孔</p>
        <p type="p">131:側壁</p>
        <p type="p">132:開口</p>
        <p type="p">14:接合孔</p>
        <p type="p">15:凹槽</p>
        <p type="p">16:擋片</p>
        <p type="p">2:背桿</p>
        <p type="p">21:接合座</p>
        <p type="p">22:側壁</p>
        <p type="p">23:嵌接柱</p>
        <p type="p">24:後靠緣</p>
        <p type="p">25:上靠緣</p>
        <p type="p">26:第一透孔</p>
        <p type="p">3:彈性裝置</p>
        <p type="p">31:彈簧</p>
        <p type="p">32:抵壓座</p>
        <p type="p">322:環壁</p>
        <p type="p">323:第一套合槽</p>
        <p type="p">33:套接座</p>
        <p type="p">331:底壁</p>
        <p type="p">332:環壁</p>
        <p type="p">334:組接孔</p>
        <p type="p">4:組接桿</p>
        <p type="p">41:端部</p>
        <p type="p">411:底面</p>
        <p type="p">42:貼靠部</p>
        <p type="p">43:組合部</p>
        <p type="p">5:限位塊</p>
        <p type="p">51:彈性部</p>
        <p type="p">52:勾部</p>
        <p type="p">521:導斜面</p>
        <p type="p">53:套合槽</p>
        <p type="p">54:接合孔</p>
        <p type="p">55:接合元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="401" publication-number="202632585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金融產品推薦與確認系統及方法</chinese-title>
        <english-title>FINANCIAL PRODUCT RECOMMENDATION AND VERIFICATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250206B">G06Q40/04</main-classification>
        <further-classification edition="202301120250206B">G06Q30/01</further-classification>
        <further-classification edition="200601120250206B">G10L15/02</further-classification>
        <further-classification edition="200601120250206B">G10L15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華南商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA NAN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖琪貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種金融產品推薦與確認系統及方法，所述方法分為推薦階段與確認階段。推薦階段通過錄音檔進行聲紋辨識，提取第一聲紋特徵值，並執行語音處理程序取得第一金融服務名稱及第一金額。依據上述資料進行雜湊運算生成第一雜湊值，錄音檔存於指定位置，同時產生關聯的驗證碼。確認階段透過影像擷取程序從簽署文件影像檔提取第二金融服務名稱、第二金額及驗證碼，並根據驗證碼取得待測錄音檔。對待測錄音檔執行聲紋辨識提取第二聲紋特徵值，再進行雜湊運算生成第二雜湊值。系統比對兩雜湊值，若不一致則發出警示訊息，若一致則核准操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A financial product recommendation and verification system and method are provided, comprising two stages: the recommendation stage and the verification stage. In the recommendation stage, voiceprint recognition is performed on an audio recording to extract the first voiceprint feature value. A speech processing procedure is then executed to obtain the first financial service name and the first amount. A hash operation is performed based on the extracted data to generate the first hash value, and the audio recording is stored in a designated location, with an associated verification code generated simultaneously. In the verification stage, an image extraction procedure retrieves the second financial service name, the second amount, and the verification code from the signed document's image file. The verification code is used to locate the corresponding test audio recording. Voiceprint recognition is applied to the test recording to extract the second voiceprint feature value, and a hash operation generates the second hash value. The system compares the two hash values: a mismatch triggers an alert, while a match approves the operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">1:錄音裝置</p>
        <p type="p">3:掃描裝置</p>
        <p type="p">5:運算裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="402" publication-number="202632857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓轉換裝置及其方法</chinese-title>
        <english-title>VOLTAGE CONVERSION DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/04</main-classification>
        <further-classification edition="200601120250602B">G05F3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可根據輸入電壓調整電壓轉換率之電壓轉換裝置及其方法。電壓轉換裝置包含一電荷汞電路、一操作電壓產生模組、以及一處理模組。電荷汞電路根據一操作電壓以及一時脈訊號將一輸入電壓轉換成一輸出電壓，電荷汞電路之一電壓轉換率係可動態調整。操作電壓產生模組連接輸出電壓，且包含一稽納二極體，並根據稽納二極體之一導通狀態產生操作電壓。處理模組連接操作電壓產生模組，用以偵測流經稽納二極體之一第一電流，並根據第一電流調整電荷汞電路之電壓轉換率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage conversion device and a method capable of adjusting a voltage conversion rate based on an input voltage are provided. The voltage conversion device includes a charge pump circuit, an operating voltage generation module, and a processing module. The charge pump circuit converts the input voltage into an output voltage based on an operating voltage and a clock signal, and the voltage conversion rate of the charge pump circuit is dynamically adjustable. The operating voltage generation module is connected to the output voltage, and includes a Zener diode, and generates the operating voltage based on a conduction state of the Zener diode. The processing module is connected to the operating voltage generation module, detects a first current flowing through the Zener diode, and adjusts the voltage conversion rate of the charge pump circuit based on the first current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電壓轉換裝置</p>
        <p type="p">11:電壓轉換電路</p>
        <p type="p">111:電壓轉換率</p>
        <p type="p">112:輸出電壓</p>
        <p type="p">12:操作電壓產生模組</p>
        <p type="p">121:稽納二極體</p>
        <p type="p">13:處理模組</p>
        <p type="p">140:操作電壓</p>
        <p type="p">141:輸入電壓</p>
        <p type="p">142:時脈訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="403" publication-number="202632677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>病床排程系統及方法</chinese-title>
        <english-title>HOSPITAL BED SCHEDULING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250206B">G16H40/00</main-classification>
        <further-classification edition="201801120250206B">G16H40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣基督長老教會馬偕醫療財團法人馬偕紀念醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACKAY MEMORIAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秋萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QIOU-PIENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡美容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, MEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOR-SHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁立人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, LI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林美惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容是關於一種具有儲存裝置及病床排程引擎的病床排程系統及病床排程方法。病床排程系統運行病床排程方法，以執行：分配多個預約病人第一優先次序，以根據第一優先次序產生第一排序結果；根據第一排序結果，將第一優先次序相同的預約病人依據第二權重進行排序，以產生第二排序結果；以及依據病人的基本與偏好資訊，依照第二排序結果的順序將預約病人分配至病床，以產生病床分配建議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a hospital bed scheduling system having a storage device and a hospital bed scheduling engine. The bed scheduling system execute the bed scheduling method to perform the following: assigning a first priority to a plurality of scheduled patients to generate a first sorting result based on the first priority; sorting scheduled patients with the same first priority according to a second weight to produce a second sorting result; and allocating scheduled patients to hospital beds based on their basic and preference information according to the second sorting result, to generate bed allocation suggestions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用戶端</p>
        <p type="p">20:醫療管理系統</p>
        <p type="p">100:病床排程系統</p>
        <p type="p">110:儲存裝置</p>
        <p type="p">120:病床排程引擎</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="404" publication-number="202631900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱導電性之蠶絲蛋白複合物及其製備方法與應用</chinese-title>
        <english-title>THERMALLY AND ELECTRICALLY CONDUCTIVE SILK FIBROIN COMPOSITE, ITS PREPARATION METHOD, AND APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">C08L89/00</main-classification>
        <further-classification edition="200601120250401B">A61L27/22</further-classification>
        <further-classification edition="200601120250401B">A61L27/52</further-classification>
        <further-classification edition="200601120250401B">A61L27/60</further-classification>
        <further-classification edition="200601120250401B">A61K38/17</further-classification>
        <further-classification edition="200601120250401B">A61P17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾次文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZE, WEN CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃意真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宇潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斌宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有導電及導熱性之蠶絲蛋白複合物以及其製備方法。另外經實驗證實其可以促進細胞活性，刺激細胞再生達到加速傷口癒合之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a silk fibroin composite with thermal and electrical conductivity, along with its method of preparation. Experimental results confirm that it can enhance cellular activity, stimulate cell regeneration, and accelerate wound healing.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="405" publication-number="202632373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有變焦投影鏡頭之延展實境眼鏡系統</chinese-title>
        <english-title>EXTENDED REALITY GLASSES SYSTEM WITH ZOOM PROJECTION LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">G02B13/18</main-classification>
        <further-classification edition="200601120250331B">G02B11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫文信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淮智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUAI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫慶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHING-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世穆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有變焦投影鏡頭之延展實境眼鏡系統，其包括：導光元件，其具有第一光耦合部、第二光耦合部、第三光耦合部、第四光耦合部；第一體積全像元件，其光耦合的設置於第一光耦合部之對應處；第二體積全像元件，其光耦合的設置於第二光耦合部之對應處；以及變焦投影鏡頭，其光耦合的設置於第三光耦合部之對應處。藉由本發明之實施，可以不用準備多顆定焦鏡頭即可改變焦距，進而達到影像縮放並不影響影像品質的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an extended reality glasses system with zoom projection lens, which comprises: a light guide element having a first light coupling portion, a second light coupling portion, a third light coupling portion, and a fourth light coupling portion; a first volume holographic element optically coupling to the first light coupling portion , a second volume holographic element optically coupling to the second optical coupling portion; and a zoom projection lens optical coupling to third optical coupling portion. By implementing the present invention, the focal length can be changed without preparing multiple fixed-focus lenses, thereby achieving the effect of image zooming without affecting the image quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有變焦投影鏡頭之延展實境眼鏡系統</p>
        <p type="p">10:導光元件</p>
        <p type="p">110:第一光耦合部</p>
        <p type="p">120:第二光耦合部</p>
        <p type="p">130:第三光耦合部</p>
        <p type="p">140:第四光耦合部</p>
        <p type="p">21:第一體積全像元件</p>
        <p type="p">22:第二體積全像元件</p>
        <p type="p">30:變焦投影鏡頭</p>
        <p type="p">40:顯示器</p>
        <p type="p">50:人眼或其他取像裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="406" publication-number="202631809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103110</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明聚醯亞胺膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">C08G73/10</main-classification>
        <further-classification edition="200601120250210B">C08J5/18</further-classification>
        <further-classification edition="200601120250210B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達邁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIMIDE TECHNOLOGY INCOPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊詠竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YUNG-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TING TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種透明聚醯亞胺膜，其係由二胺及二酸酐聚合形成聚醯胺酸後經由化學環化而得，其中，該二胺包括有4,4'-二氨基-2,2'-二甲基聯苯(m-TB)，及3,3'-二氨基二苯碸(33DDS)或4,4'-二氨基二苯碸(44DDS)或雙[4-(3-氨基苯氧基)苯基]碸(m-BAPS)或雙[4-(4-氨基苯氧基)苯基]碸p-BAPS之其中一種或其組合，該4,4'-二氨基-2,2'-二甲基聯苯(m-TB)佔總二胺莫爾數40~60mol%；該二酸酐包括1,2,3,4-環丁四羧二酐(CBDA)，及3,3',4,4'-聯苯四羧酸二酐(BPDA)或4,4'-(4,4'-異丙基二苯氧基)二酞酸酐(BPADA)或1,2,4,5-環己烷四甲酸二酐(H-PMDA)之其中一種或其組合，該1,2,3,4-環丁四羧二酐(CBDA)佔總二酸酐莫爾數65~85mol%；使該透明聚醯亞胺膜之楊氏模量大於4GPa，黃色指數(Yellow index,YI)值小於5。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="407" publication-number="202632549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103112</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機巧機構之品質機能展開及品質屋應用於產業方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250526B">G06Q10/06</main-classification>
        <further-classification edition="201201120250526B">G06Q50/04</further-classification>
        <further-classification edition="200601120250526B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修平學校財團法⼈修平科技⼤學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種機巧機構之品質機能展開及品質屋應用於產業方法，包含以下步驟：(a)顧客需求建立、(b)顧客需求權重評估、(c)工程需求確定、(d)關係矩陣建立、(e)相關性評估、(f)工程需求排序，藉以透過整合AI技術及大數據分析，提升產品設計的品質與效率，並有效轉化顧客需求為具體產品設計，同時實現節能、綠能及減少碳排放等多重效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:顧客需求建立</p>
        <p type="p">S102:顧客需求權重評估</p>
        <p type="p">S103:工程需求確定</p>
        <p type="p">S104:關係矩陣建立</p>
        <p type="p">S105:相關性評估</p>
        <p type="p">S106:工程需求排序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="408" publication-number="202631444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>前叉避震器及其油壓調整裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">B62K25/08</main-classification>
        <further-classification edition="200601120250526B">F16F9/10</further-classification>
        <further-classification edition="200601120250526B">F16F9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>均輝企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃安德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種前叉避震器，其具有一前叉彈簧及一油壓調整裝置。前叉彈簧的一端連接油壓調整裝置。油壓調整裝置具有一預載調整機構、一連接管、一油壓調整機構及一工作流體。預載調整機構具有一預載調整件。預載調整件可移動地設置於預載調整機構內，且連接於前叉彈簧的一端。連接管連通預載調整機構。油壓調整機構設置於連接管的另一端，且具有一油壓調整件。油壓調整件設置於油壓調整機構內。工作流體可流動地填充於預載調整機構、連接管及油壓調整機構中，藉此使用者無需拆卸車殼便可透過調整油壓調整件讓工作流體推動預載調整件壓縮前叉彈簧。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外管</p>
        <p type="p">20:內管</p>
        <p type="p">30:前叉彈簧</p>
        <p type="p">41:預載調整機構</p>
        <p type="p">411:預載調整殼體</p>
        <p type="p">42:連接管</p>
        <p type="p">43:油壓調整機構</p>
        <p type="p">44:工作流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="409" publication-number="202632165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兩進水兩出水之精密陶瓷閥</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">F16K11/02</main-classification>
        <further-classification edition="200601120250318B">F16K3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰優企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAIN YO ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兩進水兩出水之精密陶瓷閥，該精密陶瓷閥是在一閥殼內組設有一旋轉座，所述旋轉座下方在所述閥殼內部設有依序相疊的一滑塊、一擋板、一活動閥片與一固定閥片，所述旋轉座中樞組有一往上穿出所述閥殼的閥桿，以該閥桿底端的撥動部與所述滑塊相嵌，再以所述滑塊、所述旋轉座分別連結所述擋板、所述活動閥片，便能透過所述閥桿的操作經所述滑塊帶動所述擋板平移，或平移後再經由所述旋轉座帶動所述活動閥片旋轉，在所述閥殼下方則結合有一底座，及該底座設有一進水室，所述進水室中安裝有一平衡閥。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):閥殼</p>
        <p type="p">(11):容室</p>
        <p type="p">(12):縮徑環壁</p>
        <p type="p">(13):上端口</p>
        <p type="p">(14):限位塊</p>
        <p type="p">(20):旋轉座</p>
        <p type="p">(201):頸部</p>
        <p type="p">(202):齒緣</p>
        <p type="p">(203):槽道</p>
        <p type="p">(21):閥桿</p>
        <p type="p">(211):撥動部</p>
        <p type="p">(22):齒環</p>
        <p type="p">(23):彈簧</p>
        <p type="p">(24):定位銷</p>
        <p type="p">(30):滑塊</p>
        <p type="p">(31):擋板</p>
        <p type="p">(311):凹槽</p>
        <p type="p">(40):活動閥片</p>
        <p type="p">(41):第一孔</p>
        <p type="p">(411):外擴部</p>
        <p type="p">(42):第二孔</p>
        <p type="p">(421):外擴部</p>
        <p type="p">(50):固定閥片</p>
        <p type="p">(51):冷水流通孔</p>
        <p type="p">(52):熱水流通孔</p>
        <p type="p">(521):流道</p>
        <p type="p">(53):第一出水通孔</p>
        <p type="p">(54):第二出水通孔</p>
        <p type="p">(60):底座</p>
        <p type="p">(601):上座</p>
        <p type="p">(602):下座</p>
        <p type="p">(61):冷水進水口</p>
        <p type="p">(62):熱水進水口</p>
        <p type="p">(63):第一出水口</p>
        <p type="p">(64):第二出水口</p>
        <p type="p">(65):進水室</p>
        <p type="p">(70):平衡閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="410" publication-number="202632623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子光飾板</chinese-title>
        <english-title>QUANTUM DOT LIGHT DECORATIVE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G09F13/22</main-classification>
        <further-classification edition="202501120250512B">H10D62/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碁石國際智權顧問股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEYSTONES INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種量子光飾板，包含基板、至少一裝飾層、至少一圖樣、至少一量子點材料以及一光源。其中，該光源照射該至少一量子點材料，使該至少一量子點材料與該基板、該至少一裝飾層或該至少一圖樣中的任意一者及其組合共同呈現有別於該量子光飾板原始視覺效果的一裝飾圖樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a light decorative substrate which comprises a substrate, at least one decorative layer, at least one figure, at least one quantum dot material, and a light source. The light source illuminates the at least one quantum dot material, and the at least one quantum dot material and any one and combination of the substrate, the at least one decorative layer or the at least one figure jointly present a decorative pattern with a visual effect which is different form the original quantum dot light decorative substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:量子光飾板</p>
        <p type="p">100:基板</p>
        <p type="p">200a:裝飾層</p>
        <p type="p">200b:裝飾層</p>
        <p type="p">300a:圖樣</p>
        <p type="p">300b:圖樣</p>
        <p type="p">400a:量子點材料</p>
        <p type="p">400b:量子點材料</p>
        <p type="p">500:光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="411" publication-number="202631332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高精密度的數顯式扭力扳手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250515B">B25B23/14</main-classification>
        <further-classification edition="200601120250515B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡厚飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡厚飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種高精密度的數顯式扭力扳手，其包括本體、扳動裝置、扭力解除裝置、彈力件、扭力調控裝置、微調裝置及扭力感測裝置。扳動裝置樞擺設置於本體，扭力解除裝置樞設於本體內且選擇性抵接於扳動裝置，彈力件一端固設於扭力解除裝置，扭力調控裝置的滑動座能夠沿著平行於本體之軸線方向滑動，微調裝置設置於滑動座，微調裝置包括一供彈力件另一端抵靠的承靠件及一微調件，微調件能夠微動調整地支撐承靠件，用以微調扭力解除裝置抵靠於扳動裝置之力道；扭力感測裝置依據滑動座的位移變化而顯示出扭力設定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:數顯式扭力扳手</p>
        <p type="p">1:本體</p>
        <p type="p">1a:頂側</p>
        <p type="p">1b:底側</p>
        <p type="p">101:保護蓋</p>
        <p type="p">102:握持件</p>
        <p type="p">10:第一端</p>
        <p type="p">13:第一樞孔</p>
        <p type="p">14:第二樞孔</p>
        <p type="p">15:第三樞孔</p>
        <p type="p">16:感測孔</p>
        <p type="p">17:止擋件</p>
        <p type="p">2:扳動裝置</p>
        <p type="p">2a:扳動端</p>
        <p type="p">20:扳動件</p>
        <p type="p">201:第四樞孔</p>
        <p type="p">202:尾端</p>
        <p type="p">203:第一面</p>
        <p type="p">204:第二面</p>
        <p type="p">205:接觸件</p>
        <p type="p">206:彈性件</p>
        <p type="p">207:穿孔</p>
        <p type="p">21:連桿</p>
        <p type="p">211:第一連結孔</p>
        <p type="p">212:第二連結孔</p>
        <p type="p">213:固定銷</p>
        <p type="p">214:固定銷</p>
        <p type="p">22:作動件</p>
        <p type="p">220:穿孔</p>
        <p type="p">221:第五樞孔</p>
        <p type="p">222:止擋壁</p>
        <p type="p">223:穿孔</p>
        <p type="p">23:抵壓件</p>
        <p type="p">231:穿孔</p>
        <p type="p">232:固定銷</p>
        <p type="p">233:第一抵接部</p>
        <p type="p">24:第一銷件</p>
        <p type="p">241:第一襯套</p>
        <p type="p">25:第二銷件</p>
        <p type="p">251:第二襯套</p>
        <p type="p">26:復位件</p>
        <p type="p">27:第一鋼環</p>
        <p type="p">28:第二鋼環</p>
        <p type="p">29:第三鋼環</p>
        <p type="p">3:扭力解除裝置</p>
        <p type="p">30:解除件</p>
        <p type="p">31:第六樞孔</p>
        <p type="p">32:第三銷件</p>
        <p type="p">321:第三襯套</p>
        <p type="p">33:固定孔</p>
        <p type="p">34:第二抵接部</p>
        <p type="p">4:彈力件</p>
        <p type="p">41:固定端</p>
        <p type="p">42:接觸段</p>
        <p type="p">421:第一曲線接觸位置</p>
        <p type="p">422:第二曲線接觸位置</p>
        <p type="p">43:抗力套件</p>
        <p type="p">5:扭力調控裝置</p>
        <p type="p">50:滑動座</p>
        <p type="p">501:第一齒部</p>
        <p type="p">502:插孔</p>
        <p type="p">51:第一傳力件</p>
        <p type="p">6:微調裝置</p>
        <p type="p">60:承靠件</p>
        <p type="p">601:弧形抵接面</p>
        <p type="p">602:平面</p>
        <p type="p">61:微調件</p>
        <p type="p">611:螺紋部</p>
        <p type="p">62:固定座</p>
        <p type="p">622:滑槽</p>
        <p type="p">7:鎖定裝置</p>
        <p type="p">8:扭力感測裝置</p>
        <p type="p">81:顯示器</p>
        <p type="p">9:偏壓簧片</p>
        <p type="p">S1:彈簧</p>
        <p type="p">S2:螺栓</p>
        <p type="p">L1:軸線</p>
        <p type="p">L2:旋轉軸線</p>
        <p type="p">L3:操作軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="412" publication-number="202632784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H01Q1/44</main-classification>
        <further-classification edition="201501120250401B">H04B17/00</further-classification>
        <further-classification edition="202201120250401B">G06V20/52</further-classification>
        <further-classification edition="202201120250401B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神基科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周泊亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, PO-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包含天線、射頻傳輸模組、照相機、一或多個記憶體及一或多個處理電路。射頻傳輸模組透過天線傳輸在發射功率水平的射頻訊號。處理電路存取儲存在記憶體中的資料及少一指令以執行下列步驟。對至少一影像進行場景偵測，以獲取場景資訊。根據場景資訊，判斷是否將運作模式切換至手持模式，且在手持模式中，執行下列步驟。對該至少一影像進行人體偵測，以獲取人體偵測資訊。根據人體偵測資訊，估計至少一手持位置。判斷至少一手持位置是否相鄰於天線。若手持位置相鄰於天線，將發射功率水平降低至低於第一水平的第二水平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes an antenna, a radio frequency transmission module, a camera, one or more memory and one or more processing circuit. The radio frequency transmission module transmits a radio signal at a transmission power level through the antenna. The one or more processing circuit is configured to access data and at least one instruction stored in the memory to execute the following steps. Scene detection is performed on at least one image to obtain scene information. Whether an operation mode is switched to a handheld mode is determined according to the scene information, and the following step is executed in a handheld mode. Human body detection is performed on the at least one image to obtain human body detection information. At least one handheld position is estimated according to the human body detection information. Whether the at least one handheld position is adjacent to the antenna is determined. If the at least one handheld position is adjacent to the antenna, the transmission power level is reduced to a second level, which is lower than the first level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">101:機殼</p>
        <p type="p">111,112,113:天線</p>
        <p type="p">114:照相機</p>
        <p type="p">115:掃描器</p>
        <p type="p">116,117,118:天線</p>
        <p type="p">119:顯示器</p>
        <p type="p">120:直通介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="413" publication-number="202632625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板與顯示驅動器</chinese-title>
        <english-title>DISPLAY PANEL AND DISPLAY DRIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">G09G3/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包含顯示電路、傳導電路、多個感應電路及顯示驅動器。傳輸電路用以供電至顯示電路。感應電路設置於顯示面板中對應於顯示電路的位置，且與傳輸電路係由同一材料所形成。顯示驅動器耦接於顯示電路、傳導電路及感應電路，且用以偵測該些感應電路的複數個感應阻抗，以產生複數個補償訊號。顯示驅動器用以根據該些補償訊號控制顯示電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes a display circuit, a conductive circuit, multiple sensing circuits and a display driver. The conductive circuit isconfigured to provide power to the display circuit. The sensing circuits are arranged in the display panel at a position corresponding to the display circuit, and the sensing circuits and the conductive circuit are formed of the same material. The display driver is coupled to the display circuit, the conductive circuit and the sensing circuits, and is configured to detect multiple sensing impedances of the sensing circuits to generate multiple compensation signals. The display driver is configured to control the display circuit according to the compensation signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">110:顯示電路</p>
        <p type="p">120:傳輸電路</p>
        <p type="p">130:顯示驅動器</p>
        <p type="p">140A:感應電路</p>
        <p type="p">140B:感應電路</p>
        <p type="p">140C:感應電路</p>
        <p type="p">140D:感應電路</p>
        <p type="p">PX:畫素單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="414" publication-number="202632174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液冷浮動接頭</chinese-title>
        <english-title>LIQUID COOLING FLOATING CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">F16L37/107</main-classification>
        <further-classification edition="201601120250324B">F16J15/32</further-classification>
        <further-classification edition="201601120250324B">F16J15/3212</further-classification>
        <further-classification edition="200601120250324B">F16L21/02</further-classification>
        <further-classification edition="200601120250324B">H05K7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟銘電子科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENMING MOLD IND. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕仲輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, CHUNG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種液冷浮動接頭，其包含承載座、轉接件、卡扣件及第一耐磨件。承載座具有相對的第一端及第二端。二端之間具有容置空間。容置空間於第一端具有通孔，於第二端具有開放口。轉接件設置於容置空間中。轉接件具有相對的第一轉接端和第二轉接端及連通二轉接端的流道。第一轉接端穿出通孔而顯露於承載座外。第二轉接端經由開放口而顯露於承載座外。卡扣件設置於第一轉接端。第一耐磨件套設於第一轉接端，且位於卡扣件與第一端之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a liquid cooling floating connector comprising a bearing seat, an adapter, a locking component, and a wear-resistant component. The bearing seat has a first end and a second end, with a receiving space in between. The receiving space features a through hole at the first end and an opening at the second end. The adapter is located within the receiving space, with a first connecting end extending through the through hole and a second connecting end exposed through the opening. The locking component is installed on the first connecting end, while the wear-resistant component fits onto the first connecting end between the locking component and the first end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C:液冷浮動接頭</p>
        <p type="p">1:承載座</p>
        <p type="p">11:第一端</p>
        <p type="p">12:第二端</p>
        <p type="p">13:容置空間</p>
        <p type="p">14:通孔</p>
        <p type="p">2:轉接件</p>
        <p type="p">21:第一轉接端</p>
        <p type="p">211:階梯部</p>
        <p type="p">212a:環狀槽</p>
        <p type="p">22:第二轉接端</p>
        <p type="p">3:卡扣件</p>
        <p type="p">4:第一耐磨件</p>
        <p type="p">51:彈性件</p>
        <p type="p">52:第二耐磨件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="415" publication-number="202632550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>賦能資源分配指派系統及其方法</chinese-title>
        <english-title>EMPOWERMENT RESOURCE ALLOCATION AND ASSIGNMENT SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q10/06</main-classification>
        <further-classification edition="202301120250401B">G06Q30/01</further-classification>
        <further-classification edition="201201120250401B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>獨角獸俱樂部股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICORN CLUB CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹昀融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭淳甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭淇淞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種賦能資源分配指派系統，其包含會員模組、賦能獲取模組、互助升級模組及資源分配指派模組。會員模組提供使用者成為會員並賦予會員等級；賦能獲取模組提供賦能資源給會員；互助升級模組用以提升會員等級；資源分配指派模組計算賦能分配次數，若賦能分配次數不高於第一標準次數，資源分配指派模組將賦能資源給互助升級模組，若賦能分配次數高於第一標準次數且不高於第二標準次數，則當賦能分配次數為奇數時，資源分配指派模組將賦能資源給會員使用，而當賦能分配次數為偶數時，資源分配指派模組將賦能資源給互助升級模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An empowerment resource allocation and assignment system, which includes a member module, an empowerment acquisition module, a mutual assistance upgrade module, and a resource allocation and assignment module.The member module enables users to become members and assigns membership levels. The empowerment acquisition module provides empowerment resources to members. The mutual assistance upgrade module is used to elevate membership levels. The resource allocation and assignment module calculates the number of empowerment allocations.If the number of allocations does not exceed the first standard threshold, the resource allocation and assignment module allocates empowerment resources to the mutual assistance upgrade module. If the number of allocations exceeds the first standard threshold but does not exceed the second standard threshold, the allocation differs based on whether the number of allocations is odd or even. When it is odd, the resource allocation and assignment module allocates empowerment resources for member usage. When it is even, the resources are allocated to the mutual assistance upgrade module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:賦能資源分配指派系統</p>
        <p type="p">10:會員模組</p>
        <p type="p">20:賦能獲取模組</p>
        <p type="p">30:互助升級模組</p>
        <p type="p">40:資源分配指派模組</p>
        <p type="p">41:次數計算單元</p>
        <p type="p">42:分配單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="416" publication-number="202633423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及其形成方法，其中所述方法包括以下步驟。提供第一晶粒，其中第一晶粒包括形成於基底的第一區域上的第一內連線結構。提供第二晶粒，其中第二晶粒包括形成於基底的第二區域上的第二內連線結構，第二區域不同於第一區域，且第二內連線結構以及第一內連線結構被形成於基底上的第一介電層所覆蓋。分別於第一內連線結構和第二內連線結構上形成電性連接至第一內連線結構的第一測試結構以及電性連接至第二內連線結構的第二測試結構，其中第一測試結構包括第一測試墊以及與第一測試墊電性連接的第一連接墊，且第二測試結構包括第二測試墊以及與第二測試墊電性連接的第二連接墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor device and a method for forming the same. A first die including a first interconnection structure formed on a first region of a substrate is provided. A second die including a second interconnection structure formed on a second region, different from the first region, of the substrate is provided, wherein the first interconnection structure and the second interconnection structure are covered by a first dielectric layer formed on the substrate. A first test structure electrically connecting to the first interconnection structure and a second test structure electrically connecting to the second interconnection structure are formed on the first interconnection structure and the second interconnection structure, respectively. The first test structure includes a first test pad and a first connection pad electrically connected to the first test pad. The second test structure includes a second test pad and a second connection pad electrically connected to the second test pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">110:第一介電層</p>
        <p type="p">CL1、CL2、CL3:導線</p>
        <p type="p">D1、D2、D3:晶粒</p>
        <p type="p">ICS1、ICS2、ICS3:內連線結構</p>
        <p type="p">R1、R2、R3:區域</p>
        <p type="p">SC1、SC2、SC3:被動元件</p>
        <p type="p">SP1、SP2、SP3’:連接墊</p>
        <p type="p">TP1’、TP2’、TP3’:測試墊</p>
        <p type="p">TPB:測試探針</p>
        <p type="p">TS1、TS2、TS3:測試結構</p>
        <p type="p">via1、via2、via3:導電通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="417" publication-number="202632183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高光強之光學組件</chinese-title>
        <english-title>OPTICAL ASSEMBLY WITH HIGH LIGHT INTENSITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">F21V7/10</main-classification>
        <further-classification edition="200601120250416B">F21V7/04</further-classification>
        <further-classification edition="200601120250416B">F21V13/04</further-classification>
        <further-classification edition="201501120250416B">F21V3/00</further-classification>
        <further-classification edition="201801120250416B">F21S41/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨輪興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULUEN ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅元璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YUAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種光學組件，其包含有一基板、至少一反光元件、至少一全反射元件以及至少一發光元件，該至少一反光元件設置於該基板，該至少一反光元件包含有鄰近於該基板的一近端以及遠離於該基板的一遠端，該至少一全反射元件係設置於該基板，該至少一發光元件係設置於該基板且沿一第一方向位於該至少一反光元件的該近端與該至少一全反射元件之間，該至少一發光元件包含有一發光面，該發光面的一法線方向平行於一第二方向，且該第二方向垂直於該第一方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical assembly is provided and includes a substrate, at least one light reflecting component, at least one total internal reflecting component and at least one light emitting component. The at least one light reflecting component is disposed on the substrate. The at least one light reflecting component includes a proximal end adjacent to the substrate and a distal end away from the substrate. The at least one total internal reflecting component is disposed on the substrate. The at least one light emitting component is disposed on the substrate and located between the proximal end of the at least one light reflecting component and the at least one total internal reflecting component along a first direction. The light emitting component includes a light emitting surface. A normal direction of the light emitting surface is parallel to a second direction. The second direction is perpendicular to the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學組件</p>
        <p type="p">11:基板</p>
        <p type="p">12:反光元件</p>
        <p type="p">121:近端</p>
        <p type="p">122:遠端</p>
        <p type="p">13:全反射元件</p>
        <p type="p">131:入光結構</p>
        <p type="p">1311:第一入光部</p>
        <p type="p">1312:第二入光部</p>
        <p type="p">132:出光結構</p>
        <p type="p">1321:出光凸部</p>
        <p type="p">1322:出光平面部</p>
        <p type="p">133:反射結構</p>
        <p type="p">14:發光元件</p>
        <p type="p">141:發光面</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">F:焦距</p>
        <p type="p">L1,L3:最遠距離</p>
        <p type="p">L2:距離</p>
        <p type="p">ND:法線方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="418" publication-number="202632551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供應鏈的資訊整合方法</chinese-title>
        <english-title>METHOD FOR INTEGRATING INFORMATION OF SUPPLY CHAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250508B">G06Q10/06</main-classification>
        <further-classification edition="202301120250508B">G06Q10/0631</further-classification>
        <further-classification edition="202301120250508B">G06Q10/0633</further-classification>
        <further-classification edition="202301120250508B">G06Q10/0875</further-classification>
        <further-classification edition="201201120250508B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義守大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I SHOU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝名家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種供應鏈的資訊整合方法，包含選用一套裝軟體，並執行該套裝軟體的必用系統，以及可選擇性的執行選用系統，該必用系統包含基本管理系統，該選用系統包含訂單管理系統及採購管理系統；執行該基本管理系統，係顯示有基本管理介面、生產管理介面及報表管理介面；執行該訂單管理系統，係顯示有即時顯示介面、資料分析介面及線上回覆介面；執行該採購管理系統，係顯示有製程委外下單介面、品質檢驗資料蒐集介面及碳排數據資料蒐集介面；連線至雲端伺服器，該雲端伺服器則顯示執行後所獲得的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="419" publication-number="202631489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負極異質摻雜碳材、其製備方法及電池負極</chinese-title>
        <english-title>NEGATIVE ELECTRODE HETEROATOM-DOPED CARBON MATERIAL, METHOD OF MANUFACTURING AND BATTERY NEGATIVE ELECTRODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250501B">C01B32/05</main-classification>
        <further-classification edition="201001120250501B">H01M4/133</further-classification>
        <further-classification edition="201001120250501B">H01M4/587</further-classification>
        <further-classification edition="201001120250501B">H01M10/0525</further-classification>
        <further-classification edition="201301120250501B">H01G11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯量科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋兆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王品涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一些實施例提供一種負極異質摻雜碳材。負極異質摻雜碳材包含碳元素、氮元素及氧元素。負極異質摻雜碳材的總重量以100%計，碳元素的重量百分比為77%至81%，氮元素的重量百分比為8%至12%，且氧元素的重量百分比為4%至6.5%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide a negative electrode heteroatom-doped carbon material. The negative electrode heteroatom-doped carbon material includes carbon element, nitrogen element, and oxygen element. A percentage of the carbon element is in a range from 77% to 81% by weight, a percentage of the nitrogen element is in a range from 8% to 12% by weight, and a percentage of the oxygen element is in a range from 4% to 6.5% by weight, based on 100% by weight of the total negative electrode heteroatom-doped carbon material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105,S107:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="420" publication-number="202632640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樂器、校音器、等化器及其樂器音階產生方法</chinese-title>
        <english-title>MUSICAL INSTRUMENT, TUNER, EQUALIZER AND METHOD OF MUSICAL INSTRUMENT SCALE GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G10H1/18</main-classification>
        <further-classification edition="200601120250502B">G10H1/44</further-classification>
        <further-classification edition="200601120250502B">G10G1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅漢全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, HAN-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅漢全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, HAN-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於各種音樂產生器（及與其對應之校音儀器）之再發明。本發明提出一個全新的律制，該律制於本發明稱為太平律。依太平律，本發明不只重新發明校音儀器音名指示之頻率位置，也對各種樂器（包含能發聲之五線譜軟體）之音名頻率，及對應之音名指示標記（或音名品格面板之格位，或音名出氣孔之孔位）物理位置重新設計發明之。按太平律發明製作之樂器，能在二倍頻率音程中，具體出現五、六、七、八、九、十倍頻頻率關係，應合六腑血脈壓力波振動頻率關係，增益音樂動蕩血脈調和情志之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a reinvention of various music generators and corresponding tuning instruments thereof. The present disclosure proposes a completely novel temperament, called Taiping Temperament in the present disclosure. Based on the Taiping Temperament, the present disclosure can not only reinvent a frequency position of a note name indication of the tuning instrument including music notation software that can produce sound, but also redesign and invent a note name frequency of various musical instruments and a physical position of a note name indication mark or a position of a note name fret panel, or a position of a note name vent hole. The musical instrument made based on the Taiping Temperament can produce the fifth, sixth, seventh, eighth, ninth and tenth frequency relationships in the double frequency interval, which can correspond to a vibration frequency relationship of the pressure waves of six internal organs and blood vessels, thereby enhancing the effect of music in stirring the blood vessels and harmonizing emotions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:方法</p>
        <p type="p">S11,S13,S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="421" publication-number="202632902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔離式閘極驅動器</chinese-title>
        <english-title>ISOLATION GATE DRIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250612B">H03K17/16</main-classification>
        <further-classification edition="200601120250612B">H03K17/567</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪若瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供隔離式積體電路及其補償電路。隔離式積體電路包含隔離電容以及訊號處理電路。補償電路耦接於隔離電容以及訊號處理電路。補償電路包含補償電阻以及補償電容。補償電阻與隔離電容耦接於第一節點，並耦接於接地端。補償電容與隔離電容和補償電阻耦接於第一節點，並耦接於訊號處理電路，其中補償電容與隔離電容共用一金屬板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an isolation integrated circuit and a compensation circuit thereof. The isolation integrated circuit includes an isolation capacitor and a signal processing circuit. The compensation circuit is coupled to the isolation capacitor and the signal processing circuit. The compensation circuit includes a compensation resistor and a compensation capacitor. The compensation resistor is coupled to the isolation capacitor at a first node, and is coupled to a ground terminal. The compensation capacitor is coupled to the isolation capacitor and the compensation resistor at the first node, and is coupled to the signal processing circuit, wherein the compensation capacitor and the isolation capacitor share a metal plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:隔離電容</p>
        <p type="p">13:訊號處理電路</p>
        <p type="p">40:寄生電容</p>
        <p type="p">100:補償電路</p>
        <p type="p">102:補償電阻</p>
        <p type="p">104:補償電容</p>
        <p type="p">IO1,IO2,IO3,IO4:輸出入端</p>
        <p type="p">M1,M2,M3:金屬板</p>
        <p type="p">NA,NB:節點</p>
        <p type="p">T1:第一端</p>
        <p type="p">T2:第二端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="422" publication-number="202633117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及製造半導體元件的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250219B">H10D30/60</main-classification>
        <further-classification edition="202501120250219B">H10D30/01</further-classification>
        <further-classification edition="202501120250219B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>如　是</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIDDIQUI, IRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIA CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件包括磊晶層、閘極結構、井區以及源極。磊晶層具有第一導電型。閘極結構與井區位於磊晶層中。井區具有不同於第一導電型的第二導電型。井區具有相連的第一底面與第二底面。第一底面相鄰於閘極結構。第二底面位於第一底面遠離閘極結構的一側。第二底面的深度大於第一底面的深度。源極位於磊晶層上方並電性連接至井區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an epitaxial layer, a gate structure, a well, and a source. The epitaxial layer has a first conductivity type. The gate structure is disposed in the epitaxial layer. The well is disposed in the epitaxial layer. The well has a second conductivity type that is different from the first conductivity type. The well has a first bottom surface and a second bottom surface that are connected to each other. The first bottom surface is adjacent to the gate structure. The second bottom surface is disposed on a side of the first bottom surface that is away from the gate structure. A depth of the second bottom surface is greater than a depth of the first bottom surface. The source is disposed above the epitaxial layer and electrically connected to the well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體元件</p>
        <p type="p">100:基材</p>
        <p type="p">110:磊晶層</p>
        <p type="p">110a:頂面</p>
        <p type="p">120:井區</p>
        <p type="p">122:第一部位</p>
        <p type="p">122a:第一底面</p>
        <p type="p">124:第二部位</p>
        <p type="p">124a:第二底面</p>
        <p type="p">130:源極摻雜區</p>
        <p type="p">140:重摻雜區</p>
        <p type="p">150:閘極結構</p>
        <p type="p">150a:底面</p>
        <p type="p">150b:側壁</p>
        <p type="p">152,156:介電層</p>
        <p type="p">154:閘極電極</p>
        <p type="p">160:源極</p>
        <p type="p">170:汲極</p>
        <p type="p">D1,D2,D3:深度</p>
        <p type="p">T1:厚度</p>
        <p type="p">W1,W2,W3:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="423" publication-number="202632990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊裝置及差異化服務品質提供方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE AND DIFFERENTIATED QUALITY OF SERVICE PROVIDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250502B">H04W28/02</main-classification>
        <further-classification edition="202301120250502B">H04W72/12</further-classification>
        <further-classification edition="202301120250502B">H04W72/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇立恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LI-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傳寅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃眉茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳凱瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KAI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種無線通訊裝置，其經配置以實施差異化服務品質提供方法。此方法包含：執行無線網路偵測模組以分析複數網路對談之複數網路封包而將此些網路對談分類為複數優先權等級；執行無線網路偵測模組以偵測無線網路而取得網路狀態資訊，且根據擁塞偵測演算法計算網路狀態資訊而產生擁塞百分比；及執行無線網路配置模組以基於此些優先權等級建立差異化優先權列表，且根據擁塞百分比配置差異化優先權列表中之複數存取參數組。無線通訊裝置根據存取參數組轉發網路對談，以對網路對談提供服務品質。藉此可增加優先權等級間的差異化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication device is proposed, and configured to implement a differentiated quality of service providing method. The method includes executing a wireless network detecting module to analyze a plurality of network packets of a plurality of network sessions and classify the network sessions into a plurality of priority levels; executing the wireless network detecting module to detect a wireless network to obtain a network status information, and calculate the network status information according to a congestion detection algorithm to generate a congestion percentage; and executing a wireless network configuring module to establish a differentiated priority list based on the priority levels and configure a plurality of access parameter groups in the differentiated priority list based on the congestion percentage. The wireless communication device forwards the network sessions according to the access parameter groups to provide a quality of service for the network sessions. Thus, the differentiation among the priority levels can be added.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通訊裝置</p>
        <p type="p">111:封包流控制模組</p>
        <p type="p">112:無線網路偵測模組</p>
        <p type="p">113:無線網路配置模組</p>
        <p type="p">120:處理器</p>
        <p type="p">121:優先權等級</p>
        <p type="p">122:擁塞百分比</p>
        <p type="p">123:差異化優先權列表</p>
        <p type="p">140:接收器</p>
        <p type="p">150:發射器</p>
        <p type="p">200,300:無線網路</p>
        <p type="p">210:網路對談</p>
        <p type="p">211:第一封包群</p>
        <p type="p">220:網路封包</p>
        <p type="p">FE1,FE2:前端設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="424" publication-number="202632360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體光學元件及其組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250401B">G02B7/02</main-classification>
        <further-classification edition="200601120250401B">B23K3/08</further-classification>
        <further-classification edition="200601120250401B">G02B6/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-PIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏諴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑋鉑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-PIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏諴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑋鉑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於接收一光訊號的積體光學元件，包括一載板、一半導體光學裝置、至少一光學元件陣列及一焊接固定材料。該載板具有一上表面。該半導體光學裝置設置於該上表面。該光學元件陣列在該上表面上方沿該平面方向陣列排列在該半導體光學裝置之前且在一光軸方向上對準該該半導體光學裝置。該焊接固定材料設置於該上表面且承載該光學元件陣列。在該焊接固定材料將該光學元件陣列固定於該載板之前，該光學元件陣列為透過多個暫時支撐結構在一空間中排列而與該上表面相隔一距離，且在該焊接固定材料固定於該上表面且固化之後移除該支撐結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積體光學元件</p>
        <p type="p">10:載板</p>
        <p type="p">12:上表面</p>
        <p type="p">12a:第一側</p>
        <p type="p">12b:第二側</p>
        <p type="p">20:發光裝置</p>
        <p type="p">30:半導體光學裝置</p>
        <p type="p">40:光學元件陣列</p>
        <p type="p">41:光學元件</p>
        <p type="p">2:高速電路載板</p>
        <p type="p">3:光訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="425" publication-number="202633249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10N10/81</main-classification>
        <further-classification edition="202601120260302B">H10N19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>睿光科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOLARGUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳丕晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PI-FUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘明吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAN, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括一半導體模組、一均溫導熱元件及一熱電轉換元件，該半導體模組運作時作為一熱源，該均溫導熱元件熱接觸該半導體模組，且從該熱源接收一熱能，該熱電轉換元件熱接觸該均溫導熱元件並耦接該熱電轉換元件，該熱電轉換元件能夠將該熱能轉換成一電能，該電能被用來提供給含有該半導體模組的一系統或直接回供給該半導體模組，藉此降低外部而來的用電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:半導體模組</p>
        <p type="p">11:頂面</p>
        <p type="p">12:底面</p>
        <p type="p">20:均溫導熱元件</p>
        <p type="p">30:熱電轉換元件</p>
        <p type="p">40:電能儲存元件</p>
        <p type="p">2:載板</p>
        <p type="p">2a:錫球</p>
        <p type="p">H:熱點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="426" publication-number="202632328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光偏振元件</chinese-title>
        <english-title>OPTICAL POLARIZATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">G02B5/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴朝義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHAO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾仲鎧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHUNG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光偏振元件包含基底以及多個奈米柱。奈米柱設置於基底並突出於基底的表面上，其中奈米柱的長度方向平行於基底的表面的法線方向，且奈米柱依照費波那契數列規則排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical polarization device includes a base and multiple nanorods. The nanorods are disposed on the base and protrude from a surface of the base. A lengthwise direction of the nanorods is parallel with a normal direction of the surface of the base. The nanorods are arranged following Fibonacci Sequence rule.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光偏振元件</p>
        <p type="p">GP1:第一組對</p>
        <p type="p">GP2:第二組對</p>
        <p type="p">GP3:第三組對</p>
        <p type="p">G1:第一群組</p>
        <p type="p">G2:第二群組</p>
        <p type="p">G3:第三群組</p>
        <p type="p">G4:第四群組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="427" publication-number="202631239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芬頓空氣清淨系統</chinese-title>
        <english-title>FENTON AIR PURIFICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">B01D35/01</main-classification>
        <further-classification edition="200601120250324B">A61L9/015</further-classification>
        <further-classification edition="202101120250324B">F24F3/16</further-classification>
        <further-classification edition="202301120250324B">C02F1/32</further-classification>
        <further-classification edition="202301120250324B">C02F1/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東倉科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYTO SCIENCE &amp; TECHNOLOGY COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　清山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHING-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種芬頓空氣清淨系統，包含：一殼體、一反應槽、一第一光源、一儲存槽和一第一通氣裝置；其中，所述殼體圍繞所述反應槽、所述第一光源和所述第一通氣裝置，且所述殼體具有一入氣孔和一出氣孔；所述反應槽容置有一鐵反應物固體；所述第一光源照射所述鐵反應物固體，且所述第一光源提供紫外光C；以及所述儲存槽連接所述反應槽，所述儲存槽容置一過氧化氫溶液以供應其至所述反應槽。本發明利用芬頓反應製造氫氧自由基並釋放至空氣中，透過氫氧自由基進行氧化反應來清除空氣中之揮發性有機物等有害物質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a Fenton air purification system, which comprises a shell, a reaction tank, a first light source, a storage tank and a ventilation device; wherein the shell surrounds the reaction tank, the first light source and the ventilation device, and the shell has an inlet hole and an outlet hole; the reaction tank accommodates an iron reactant solid; the first light source illuminates the iron reactant solid, and the first light source provides ultraviolet light C; and the storage tank connects to the reaction tank and accommodates a hydrogen peroxide solution, which is supplied to the reaction tank. The invention utilizes the Fenton reaction to produce hydroxyl radicals, which are released into the air and can be harnessed to remove harmful substances such as volatile organic compounds in the air through hydroxyl radical- mediated oxidation reactions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:芬頓空氣清淨系統</p>
        <p type="p">10:殼體</p>
        <p type="p">11:反應槽</p>
        <p type="p">12:第一光源</p>
        <p type="p">13:儲存槽</p>
        <p type="p">14:第一通氣裝置</p>
        <p type="p">101:入氣孔</p>
        <p type="p">102:出氣孔</p>
        <p type="p">110:頂部</p>
        <p type="p">111:通氣管</p>
        <p type="p">1110:開孔</p>
        <p type="p">103:內壁面</p>
        <p type="p">104:外壁面</p>
        <p type="p">112:外周壁面</p>
        <p type="p">1030:二氧化鈦塗層</p>
        <p type="p">15:第二光源</p>
        <p type="p">2:鐵反應物固體</p>
        <p type="p">F:氣流方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="428" publication-number="202633021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板組件</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05K1/02</main-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
        <further-classification edition="200601120260302B">H05K3/42</further-classification>
        <further-classification edition="200601120260302B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬朔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板組件包括絕緣材料、處理器晶粒、至少一記憶體晶粒、磁性材料以及多個導電層。絕緣材料具有上表面以及下表面。處理器晶粒設置於絕緣材料內部。記憶體晶粒沿垂直方向設置於處理器晶粒的上方。磁性材料設置於絕緣材料中，其中磁性材料具有第一部分以及沿垂直方向堆疊於第一部分上的第二部分，磁性材料圍繞處理器晶粒以及記憶體晶粒周圍設置。導電層設置於絕緣材料的上表面、下表面以及絕緣材料中，其中導電層電性連接至記憶體晶粒以及處理器晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly includes an insulating material, a processor die, at least one memory die, a magnetic material and plural conductive layers. The insulating material has a top surface and a bottom surface. The processor die is disposed inside the insulating material. The memory die is disposed above the processor die along a vertical direction. The magnetic material is disposed in the insulating material, in which the magnetic material has a first portion and a second portion stacked on the first portion along the vertical direction, and the magnetic material is disposed around the processor die and the memory die. The conductive layers are disposed on the top and bottom surfaces of the insulating material and in the insulating material, in which the conductive layers are electrically connected to the processor die and the memory die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">110:絕緣材料</p>
        <p type="p">120:磁性材料</p>
        <p type="p">122A:側邊</p>
        <p type="p">122、124:部分</p>
        <p type="p">130:導電層</p>
        <p type="p">132、134:線路</p>
        <p type="p">132P:突起部分</p>
        <p type="p">140:處理器晶粒</p>
        <p type="p">150:金屬柱</p>
        <p type="p">160、162、164、166:記憶體晶粒</p>
        <p type="p">110A、110B、140A、160A、160B、160C:表面</p>
        <p type="p">170:矽穿孔</p>
        <p type="p">172:微凸塊</p>
        <p type="p">174:導電材料</p>
        <p type="p">180:凸塊</p>
        <p type="p">SP1:空隙</p>
        <p type="p">TH1、TH2:厚度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="429" publication-number="202631170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>促進毛髮生長的組合物、其用途及包含其的可食用組合物</chinese-title>
        <english-title>A COMPOSITION FOR PROMOTING HAIR GROWTH, ITS USES, AND AN EDIBLE COMPOSITION CONTAINING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250801B">A61K35/747</main-classification>
        <further-classification edition="200601120250801B">A61P17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葡萄王生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAPE KING BIO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CI-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯毓欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石仰慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳姿和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZI-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種促進毛髮生長的組合物，其包含植物乳桿菌GKM3、植物乳桿菌GKD7、以及植物乳桿菌GKK1的活性物質。該組合物可以提升毛髮生長速率及毛髮分布率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a composition for promoting hair growth, comprising active substances from        &lt;i&gt;Lactobacillus plantarum&lt;/i&gt;GKM3,        &lt;i&gt;Lactobacillus plantarum&lt;/i&gt;GKD7, and        &lt;i&gt;Lactobacillus plantarum&lt;/i&gt;GKK1. The composition can enhance hair growth rate and hair distribution.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="430" publication-number="202632885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寬頻輸入／輸出電路的可調式T型線圈裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H03H7/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立雲林科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAI-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐仕諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種T型線圈裝置，包含相互電連接的一電容單元、一第一電感單元及一第二電感單元。該電容單元電連接於一第一節點與一第二節點之間。該第一電感單元電連接於該第一節點與一第三節點之間，並包括一第一電感器，及一用於改變該第一電感器之電感值的第一調變電路。該第二電感單元電連接於該第二節點與該第三節點之間。該第三節點電連接一負載電路。藉由改變該電容單元的電容值，以及該第一電感單元與該第二電感單元的電感值，即可因應不同的該負載電路的寄生電容值，彈性調整本發明T型線圈裝置的電容值和電感值，以獲得最有效的電容補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:T型線圈裝置</p>
        <p type="p">1:第一電感單元</p>
        <p type="p">L11:第一電感器</p>
        <p type="p">11:第一調變電路</p>
        <p type="p">L12:第一調變電感器</p>
        <p type="p">12:第一電流源</p>
        <p type="p">121:第一電流鏡</p>
        <p type="p">122:第一開關</p>
        <p type="p">123:第一輸入電晶體</p>
        <p type="p">2:第二電感單元</p>
        <p type="p">L21:第二電感器</p>
        <p type="p">21:第二調變電路</p>
        <p type="p">L22:第二調變電感器</p>
        <p type="p">22:第二電流源</p>
        <p type="p">221:第二電流鏡</p>
        <p type="p">222:第二開關</p>
        <p type="p">223:第二輸入電晶體</p>
        <p type="p">3:電容單元</p>
        <p type="p">C1:電容器</p>
        <p type="p">C2:可變電容器</p>
        <p type="p">93:負載電路</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">N3:第三節點</p>
        <p type="p">N4:第四節點</p>
        <p type="p">VDD:工作電壓值</p>
        <p type="p">GND:接地電壓值</p>
        <p type="p">Vin:輸入訊號</p>
        <p type="p">Vout:輸出訊號</p>
        <p type="p">Von:開啟電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="431" publication-number="202632418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生光罩圖案數據的方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250501B">G03F1/70</main-classification>
        <further-classification edition="202001120250501B">G06F30/398</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普思半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROSEMI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產生光罩圖案數據的方法，包含一檢測資料建立步驟、一線路圖案資料取得步驟，及一光罩圖案產生步驟。透過預先建立由多組來自相同的光學鄰近效應修正模型，或是來自相同的圖案化製程的目標資料與光罩圖案資料所組成的圖案對組，並由該等圖案對組建立一預定關係式，再將一預設線路圖案資料與該預定關係式進行比對運算，並據此產生相應的一光罩圖案數據資料，該方法無須進行複雜的光學及數學運算即可產生近似經光學補償的該光罩圖案數據資料，而可簡化該光罩圖案數據資料的產生過程。此外，本發明還提供一用於執行該方法的系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S21:檢測資料建立步驟</p>
        <p type="p">S22:線路圖案資料取得步驟</p>
        <p type="p">S23:光罩圖案產生步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="432" publication-number="202631293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管體加工方法及管體結構</chinese-title>
        <english-title>TUBE PROCESSING METHOD AND TUBE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250325B">B23K26/08</main-classification>
        <further-classification edition="201401120250325B">B23K26/55</further-classification>
        <further-classification edition="200601120250325B">B21D17/00</further-classification>
        <further-classification edition="200601120250325B">B62J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立盟金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIMOTEC METAL INDUSTRY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓子見</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSO, TZU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊堯欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種管體加工方法，其包含步驟如下。藉由一雷射光束聚焦於一管體的一表面上。驅動雷射光束與管體彼此相對移動，使管體的表面形成複數雷射加工區域。藉此，提升加工的高精度與準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a tube processing method, which includes the steps as follows. A laser beam is focused on a surface of a tube. The laser beam and the tube are driven to move relative to each other, so that a plurality of laser processed regions are formed on the surface of the tube. Thus, the precision and accuracy of the processing can be enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:管體加工方法</p>
        <p type="p">S11,S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="433" publication-number="202632910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>序列器及解序列器</chinese-title>
        <english-title>A SERIALIZER AND A DESERIALIZER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03M9/00</main-classification>
        <further-classification edition="202201120250401B">H04L69/30</further-classification>
        <further-classification edition="200601120250401B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃漢城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種序列器及解序列器。該序列器包括一序列模組以及一資料升頻處理模組。該資料升頻處理模組基於輸出操作頻率接收來自媒體存取控制區塊的資料封包序列，並基於序列操作頻率輸出資料封包序列。該解序列器包括一解序列模組以及多個資料降頻處理模組。該解序列器基於解序列操作頻率產生資料操作頻率，且基於該資料操作頻率輸出復原資料封包序列。本發明實施例可配合媒體存取控制區塊的操作頻率來傳送或接收資料，並以符合實體層的傳輸規格需求的傳輸頻率來交換資料，達到提升序列器及解序列器應用上的便利性的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a serializer and a deserializer. The serializer includes a serializing module and a data up-conversion processing module. The data up-conversion processing module receives a data packet sequence from a media access control block based on an output operating frequency and outputs the data packet sequence based on a serialization operation frequency. The deserializer includes a desequence module and a plurality of data down-conversion processing modules. The deserializer generates a data operating frequency based on the desequence operating frequency, and outputs a restored data packet sequence based on the data operating frequency. The present disclosure transmits or receives data in accordance with the operating frequency of the media access control block, and the data is exchanged at a transmission frequency that meets the transmission specification requirements of the physical layer. Thus, the purpose of improving the convenience of using a serializer and a deserializer is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a、100b:電子裝置</p>
        <p type="p">210a、210b:序列器</p>
        <p type="p">220a、220b:解序列器</p>
        <p type="p">300a、300b:媒體存取控制區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="434" publication-number="202633047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>限位裝置</chinese-title>
        <english-title>LIMITING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴冠鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, GUAN-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀志衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種限位裝置，適於將一定位柱限位於一機架的一固定孔。固定孔具有相連通的一安裝孔區與一限位孔區。限位裝置包括一基座與一滑動件。基座對應固定孔固定於機架。基座包括一主體部與可動地連接於主體部的一彈性限位部，且彈性限位部對位於固定孔。滑動件可滑動地設置於主體部。滑動件接觸彈性限位部，且包括對應限位孔區設置的一從動部。當定位柱穿過安裝孔區並往限位孔區移動時，定位柱接觸從動部並帶動滑動件從一解鎖位置滑動至一鎖定位置，使滑動件推抵彈性限位部，致彈性限位部產生彈性變形並扣合定位柱於限位孔區中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A limiting device suitable for limiting a positioning post in a securing hole of a chassis is provided. The securing hole has a mounting hole area and a limiting hole area. The limiting device includes a base secured to the chassis in correspondence with the securing hole and a sliding member. The base includes a main portion and an elastic limiting portion movably connected to the main portion, and the elastic limiting portion is aligned with the securing hole. The sliding member is slidably disposed on the main portion. The sliding member is in contact with the elastic limiting portion and includes a driven portion disposed to correspond with the limiting hole. When the positioning post passes through the mounting hole area and moves toward the limiting hole area, the positioning post contacts the driven portion and drives the sliding member to slide from an unlocking position to a locking position, causing the sliding member to push the elastic limiting portion to undergo elastic deformation and engage with the positioning post, thereby securing the positioning post in the limiting hole area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機架</p>
        <p type="p">10a:第一側</p>
        <p type="p">10b:第二側</p>
        <p type="p">11:固定孔</p>
        <p type="p">11a:安裝孔區</p>
        <p type="p">11b:限位孔區</p>
        <p type="p">100:限位裝置</p>
        <p type="p">110:基座</p>
        <p type="p">111:主體部</p>
        <p type="p">112:彈性限位部</p>
        <p type="p">112a:彈臂</p>
        <p type="p">112b:卡勾</p>
        <p type="p">113:第一定位部</p>
        <p type="p">114:第二定位部</p>
        <p type="p">115:卡合部</p>
        <p type="p">116:卡抵部</p>
        <p type="p">117:卡槽</p>
        <p type="p">120:滑動件</p>
        <p type="p">121:從動部</p>
        <p type="p">121a:定位彈臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="435" publication-number="202632232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉曼光譜特徵資料庫的建立方法及成分的判別方法與系統</chinese-title>
        <english-title>ESTABLISHING METHOD FOR RAMAN SPECTRUM FEATURE DATABASE AND COMPOSITION DETERMINING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">G01J3/44</main-classification>
        <further-classification edition="200601120250314B">G01N21/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐信科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTRUSTECH CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種拉曼光譜特徵資料庫的建立方法，包括：取得至少一樣本的拉曼光譜；根據樣本的拉曼光譜產生一樣本數位特徵碼，其中樣本數位特徵碼所含有的資訊包括樣本的拉曼光譜的一母峰的資訊，母峰的資訊包括母峰的拉曼位移及母峰的強度；以及儲存樣本數位特徵碼。一種成分的判別方法及一種成分的判別系統亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An establishing method for a Raman spectrum feature database includes: obtaining a Raman spectrum of at least one sample; generating a sample digital feature code according to the Raman spectrum of the sample, wherein information contained by the sample digital feature code includes information of a main peak of the Raman spectrum of the sample, and the information of the main peak includes a Raman shift of the main peak and intensity of the main peak; and storing the sample digital feature code. A composition determining method and a composition determining system are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110、S120、S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="436" publication-number="202631323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭力套筒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250506B">B25B13/06</main-classification>
        <further-classification edition="200601120250506B">B25B23/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭家輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭家輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種扭力套筒，包含有：一外筒，其一端軸向往內形成有一套接孔，另一端軸向往內形成有一組接孔，該組接孔與該套接孔間形成有一階部，該外筒之內壁形成有一容置孔，該外筒之外周面上具有多數沿著環狀排列之扭力值數字；一內筒，其一端係穿入於該外筒之組接孔中，另一端軸向往內形成有一驅動孔，該內筒之外周面上具有一指示標線；一彈簧，係置於該外筒之組接孔內，以一端抵接於該階部上，另一端抵接於該內筒上；一線性位移單元，具有一螺旋槽及一珠體，該螺旋槽係以圓弧槽呈螺旋狀延伸形成於該內筒之外周面上，該珠體係置於該螺旋槽與該容置孔之間；當該外筒或內筒中至少一受外力作用而旋轉時，該珠體能沿著該螺旋槽進行滑動，而使該內筒於該組接孔內進行上下之直線位移，進而壓縮彈簧與鬆放彈簧，以達到調整扭力值及零件少、組裝容易、構造簡單、成本低廉及具市場競爭力等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:扭力套筒</p>
        <p type="p">10:外筒</p>
        <p type="p">11:外筒本體</p>
        <p type="p">111:套接孔</p>
        <p type="p">112:組接孔</p>
        <p type="p">113:容置孔</p>
        <p type="p">12:限位環</p>
        <p type="p">13:扭力值數字組</p>
        <p type="p">131:扭力值數字</p>
        <p type="p">20:內筒</p>
        <p type="p">21:圓孔</p>
        <p type="p">22:驅動孔</p>
        <p type="p">23:指示標線</p>
        <p type="p">30:彈簧</p>
        <p type="p">40:線性位移單元</p>
        <p type="p">41:螺旋槽</p>
        <p type="p">42:珠體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="437" publication-number="202632447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測方法、對位平台及檢測系統</chinese-title>
        <english-title>DETECTION METHOD, ALIGNMENT PLATFORM, AND DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">G05B19/19</main-classification>
        <further-classification edition="200601120250311B">G05B19/402</further-classification>
        <further-classification edition="200601120250311B">B23Q1/66</further-classification>
        <further-classification edition="200601120250311B">B23Q1/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種檢測方法，包括下列步驟：啟動一伺服馬達；以該伺服馬達帶動一平台移動至一預定位置；啟動一剎車機構及解除該伺服馬達之激磁狀態；及檢測放置於該平台上之一待檢測物。本發明另關於一種對位平台，包括：一基座，其具有一軌道；一平台，可滑動地設於該軌道；一驅動機構，包括一伺服馬達，可藉由該伺服馬達帶動該平台相對該軌道滑動；及一剎車機構，設於該基座及該平台其中一者，包括一剎車單元及一剎車片，該剎車單元對應該剎車片。本發明再關於一種檢測系統，包括：一對位平台；一檢測單元；及一控制單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection method is provided, including the following steps: activating a servo motor; using the servo motor to drive a platform to a predetermined position; activating a braking mechanism and disabling an excitation state of the servo motor; and detecting an object to be detected that is placed on the platform. An alignment platform is further provided, including: a base having a rail; a platform slidably disposed on the rail; a driving mechanism including a servo motor, capable of driving the platform to slide relative to the rail via the servo motor; and a braking mechanism disposed on either the base or the platform, which includes a brake unit and a brake pad, wherein the brake unit corresponds to the brake pad. A detection system is provided, including: an alignment platform; a detection unit; and a control unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:對位平台</p>
        <p type="p">10:基座</p>
        <p type="p">11:軌道</p>
        <p type="p">20:平台</p>
        <p type="p">21:軌部</p>
        <p type="p">30:驅動機構</p>
        <p type="p">40:剎車機構</p>
        <p type="p">50:剎車部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="438" publication-number="202632906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號取樣裝置與訊號取樣方法</chinese-title>
        <english-title>SIGNAL SAMPLING DEVICE AND SIGNAL SAMPLING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H03M1/12</main-classification>
        <further-classification edition="200601120250501B">H03M1/06</further-classification>
        <further-classification edition="200601120250501B">G11C27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">訊號取樣裝置包含第一緩衝器電路、第二緩衝器電路以及第一靴帶式開關電路。第一緩衝器電路用以根據一輸入訊號產生一第一緩衝訊號。第二緩衝器電路用以根據該輸入訊號產生一第二緩衝訊號，其中該第二緩衝器電路的規格要求低於該第一緩衝器電路的規格要求。第一靴帶式開關電路用以根據該第二緩衝訊號產生一控制電壓，並根據該控制電壓取樣該第一緩衝訊號以產生一第一取樣訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal sampling device includes a first buffer circuit, a second buffer circuit, and a first bootstrap switch circuit. The first buffer circuit is configured to generate a first buffer signal according to an input signal. A second buffer circuit is configured to generate a second buffer signal according to the input signal, in which a specification requirement of the second buffer circuit is lower than that of the first buffer circuit. The first bootstrap switch circuit is configured to generate a control voltage according to the second buffer signal and to sample the first buffer signal according to the control voltage to generate a first sample signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號取樣裝置</p>
        <p type="p">110:緩衝器電路</p>
        <p type="p">120:緩衝器電路</p>
        <p type="p">130:靴帶式開關電路</p>
        <p type="p">132:靴帶式電容電路</p>
        <p type="p">134:取樣電路</p>
        <p type="p">C:電容</p>
        <p type="p">SW:開關</p>
        <p type="p">VB1:緩衝訊號</p>
        <p type="p">VB2:緩衝訊號</p>
        <p type="p">VC1:控制電壓</p>
        <p type="p">VIN:輸入訊號</p>
        <p type="p">VS1:取樣訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="439" publication-number="202632532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>循環杯無線識別之杯身電子標籤隱藏結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250618B">G06K19/07</main-classification>
        <further-classification edition="200601120250618B">B65D85/00</further-classification>
        <further-classification edition="202401120250618B">H04B5/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐泰科技企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種循環杯無線識別之杯身電子標籤隱藏結構，係一循環杯，包括：一標籤座，為絕緣圓框形座體，內框面形成一電波感應空間，外框面設一標籤設置部；一無線射頻識別標籤，係貼設在該標籤設置部上，其由一絕緣基材薄片的一表面設金屬薄膜天線，具有一口形主天線兩側延伸一對擴展天線及開設一溝槽，並由該溝槽兩邊作為迴路焊盤電性連接一超高頻無線射頻識別晶片；一杯本體，以一塑膠射出模具射出成型一杯體，並由該杯體的杯身包覆該標籤座及該無線射頻識別標籤，且該杯身內面並與該標籤座的該內框面共同形成一盛液杯室；整體循環杯結構，能使該無線射頻識別標籤的使用，除不存在有抗化學性、脫落與外力破壞的問題外，且批量識別時，還增進有長距離讀取的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:循環杯</p>
        <p type="p">20:標籤座</p>
        <p type="p">21:內框面</p>
        <p type="p">22:電波感應空間</p>
        <p type="p">30:無線射頻識別標籤</p>
        <p type="p">40:超高頻無線射頻識別晶片</p>
        <p type="p">50:杯本體</p>
        <p type="p">51:杯身</p>
        <p type="p">510:肉壁內面</p>
        <p type="p">52:杯底部</p>
        <p type="p">53:盛液杯室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="440" publication-number="202633055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋動式輔助定位把手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">F16B5/02</main-classification>
        <further-classification edition="200601120250210B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種旋動式輔助定位把手，係於機架設有二相鄰之組裝空間及延伸側，而組裝空間的側邊設有卡扣部，可供輔助架體組裝於機架的延伸側處，以供輔助架體沿著該延伸側呈往復位移，並於供輔助架體一側邊之鉤扣件露出延伸側外部，再以驅動把手組裝於機架的組裝空間處，且驅動把手一側之扣持件為露出組裝空間外部、另側之鎖扣件即位於卡扣部處活動位移，透過扳啟驅動把手後再旋轉擺動，達到帶動機架及輔助架體旋動位移之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機架</p>
        <p type="p">10:組裝空間</p>
        <p type="p">101:卡扣部</p>
        <p type="p">102:滑移空間</p>
        <p type="p">103:轉軸孔</p>
        <p type="p">104:軸桿</p>
        <p type="p">11:延伸側</p>
        <p type="p">110:扳動空間</p>
        <p type="p">111:結合件</p>
        <p type="p">112:蓋板</p>
        <p type="p">12:樞接孔</p>
        <p type="p">121:樞接件</p>
        <p type="p">2:輔助架體</p>
        <p type="p">20:滑槽</p>
        <p type="p">21:鉤扣件</p>
        <p type="p">211:限位桿</p>
        <p type="p">22:翼板</p>
        <p type="p">220:滑移槽</p>
        <p type="p">221:銜接件</p>
        <p type="p">23:限位翼部</p>
        <p type="p">230:限位槽道</p>
        <p type="p">3:驅動把手</p>
        <p type="p">30:推移空間</p>
        <p type="p">300:卡制槽道</p>
        <p type="p">31:扣持件</p>
        <p type="p">310:軸孔</p>
        <p type="p">311:缺槽</p>
        <p type="p">32:鎖扣件</p>
        <p type="p">321:側邊板</p>
        <p type="p">33:臂板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="441" publication-number="202631061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環保循環杯之電子標籤隱藏杯身結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">A47G19/22</main-classification>
        <further-classification edition="200601120250326B">B65D23/00</further-classification>
        <further-classification edition="200601120250326B">G06K19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐泰科技企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環保循環杯之電子標籤隱藏杯身結構，係一循環杯，包括：一杯本體，為絕緣杯體，其杯身外部一外表面設一標籤設置部，內部一內表面和一杯底部共同形成一盛液杯室，對應該標籤設置部作為一電波感應空間；一無線射頻識別標籤，係貼設在該標籤設置部上，其金屬薄膜天線的口形主天線兩側延伸一對擴展天線及開設一溝槽作為迴路焊盤電性連接一超高頻無線射頻識別晶片；一護框，為一塑膠射出成型的框體，由該框體包覆該標籤設置部，隱藏埋設該無線射頻識別標籤；整體結構，能使該循環杯使用該無線射頻識別標籤，除不存在抗化學性、脫落或外力破壞的問題外，且批量識別時，還增進長距離讀取的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:循環杯</p>
        <p type="p">20:杯本體</p>
        <p type="p">21:杯身</p>
        <p type="p">210:外表面</p>
        <p type="p">211:內表面</p>
        <p type="p">22:標籤設置部</p>
        <p type="p">24:盛液杯室</p>
        <p type="p">240:杯口</p>
        <p type="p">25:電波感應空間</p>
        <p type="p">30:無線射頻識別標籤</p>
        <p type="p">50:護框</p>
        <p type="p">51:框體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="442" publication-number="202631084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跑走型態評分輔助裝置</chinese-title>
        <english-title>SENSOR-BASED ASSISTIVE WALK-RUN GAIT SCORING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250618B">A61B5/11</main-classification>
        <further-classification edition="200601120250618B">A63B23/04</further-classification>
        <further-classification edition="201801120250618B">G16H80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林儀佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林季樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跑走型態評分輔助裝置，係包括一人體偵測模組，係設置於受試者身上；一評分偵測模組，包含但不限於雷達波感測器、超音波感測器、與雷射感測器；以及一嵌入式電腦，訊號連接該人體偵測模組與該評分偵測模組。本發明係一種用於跑走型態評分輔助裝置的裝置，透過多種感應器與元件，能夠準確地追蹤受試者的頭部旋轉姿態與走路移動狀況。該裝置能夠記錄受試者頭部的旋轉、身體的移動、步數以及元件之間的相對距離等資訊，進而提供客觀的步態評估數據。這種自動化的輔助評分裝置可以幫助醫療專業人員更準確地評估患者的步態功能，並提供更有效的康復治療方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensor-based assistive walk-run gait scoring system, which comprises a human body detection module and is arranged on the subject; A score detection module, including but not limited to radar wave sensors, ultrasonic sensors, and laser sensors; and an embedded computer with a signal connecting the human body detection module to the score detection module. The present invention is a device for automatic sensor-based assistive walk-run gait scoring system, through a variety of sensors and components, can accurately track the subject's head rotation posture and walking movement status. The device is able to record information such as the rotation of the subject's head, the movement of the body, the number of steps, and the relative distance between the components, thereby providing objective gait assessment data. This automated assisted scoring device can help medical professionals assess a patient's gait function more accurately and provide more effective walk-run gait scoring which will be further beneficial for rehabilitation or plan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:人體偵測模組</p>
        <p type="p">11:足部偵測單元</p>
        <p type="p">12:骨盆偵測單元</p>
        <p type="p">13:頭部偵測單元</p>
        <p type="p">14:第一信號發射單元</p>
        <p type="p">2:評分偵測模組</p>
        <p type="p">222:第一雷達波感測器</p>
        <p type="p">223:發射端</p>
        <p type="p">232:第二雷達波感測器</p>
        <p type="p">233:接收端</p>
        <p type="p">234:超音波感測器</p>
        <p type="p">2341:發射部</p>
        <p type="p">2342:接收部</p>
        <p type="p">236:第二信號發射器</p>
        <p type="p">3:嵌入式電腦</p>
        <p type="p">31:數據接收介面</p>
        <p type="p">32:評分軟體單元</p>
        <p type="p">321:數據處理模組</p>
        <p type="p">322:評分算法庫</p>
        <p type="p">323:人工智慧推論模組</p>
        <p type="p">324:數據存儲模組</p>
        <p type="p">325:訓練模組</p>
        <p type="p">326:計時器</p>
        <p type="p">33:總分介面</p>
        <p type="p">34:結果顯示視覺化介面</p>
        <p type="p">35:用戶交互介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="443" publication-number="202632533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>循環杯無線識別之電子標籤隱藏杯底結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G06K19/07</main-classification>
        <further-classification edition="200601120250526B">B65D85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐泰科技企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種循環杯無線識別之電子標籤隱藏杯底結構，係一循環杯，包括：一杯本體，為絕緣杯體，其盛液杯室外部的一杯底部下方，由一杯身延伸一底框形成一框室；一框蓋件的蓋體結合該底框將該框室封閉，具有一蓋面部在該框室中形成一電波感應空間；一無線射頻識別標籤，係設在該電波感應空間內，其金屬薄膜天線的主天線一側延伸一對擴展天線及開設一溝槽作為迴路焊盤電性連接一超高頻無線射頻識別晶片；整體結構，能使該循環杯使用該無線射頻識別標籤，除不存在抗化學性、脫落或外力破壞的問題外，批量識別時，還增進長距離(遠場)讀取的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:循環杯</p>
        <p type="p">10:杯本體</p>
        <p type="p">11:杯體</p>
        <p type="p">110:杯身</p>
        <p type="p">111:杯底部</p>
        <p type="p">112:底框</p>
        <p type="p">113:結合端面</p>
        <p type="p">12:盛液杯室</p>
        <p type="p">13:框室</p>
        <p type="p">20:框蓋件</p>
        <p type="p">21:蓋體</p>
        <p type="p">210:蓋面部</p>
        <p type="p">211:填塞部</p>
        <p type="p">212:結合周邊部</p>
        <p type="p">22:電波感應空間</p>
        <p type="p">30:無線射頻識別標籤</p>
        <p type="p">40:超高頻無線射頻識別晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="444" publication-number="202632534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>循環杯之杯底邊框電子標籤隱藏結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G06K19/07</main-classification>
        <further-classification edition="202401120250526B">H04B5/43</further-classification>
        <further-classification edition="202401120250526B">H04B5/70</further-classification>
        <further-classification edition="200601120250526B">B65D85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐泰科技企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種循環杯之杯底邊框電子標籤隱藏結構，係一循環杯，包括：一杯本體，為絕緣杯體，其盛液杯室外部的一杯底部下方，由一杯身延伸一杯底邊框形成一框室及從端部軸向深入開設一標籤納置槽；一框蓋件的蓋體結合該杯底邊框端部，將該標籤納置槽封閉；一無線射頻識別標籤，係置設在該標籤納置槽內，其金屬薄膜天線的口形主天線兩側延伸一對擴展天線及開設一溝槽作為迴路焊盤電性連接一超高頻無線射頻識別晶片；整體結構，能使該循環杯使用該無線射頻識別標籤，除不存在抗化學性、脫落或外力破壞的問題外，批量識別時，還增進長距離(遠場)讀取的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:循環杯</p>
        <p type="p">10:杯本體</p>
        <p type="p">11:杯體</p>
        <p type="p">110:杯身</p>
        <p type="p">111:杯底部</p>
        <p type="p">112:杯底邊框</p>
        <p type="p">113:結合端面</p>
        <p type="p">12:盛液杯室</p>
        <p type="p">13:框室</p>
        <p type="p">14:標籤納置槽</p>
        <p type="p">15:電波感應空間</p>
        <p type="p">20:框蓋件</p>
        <p type="p">21:蓋體</p>
        <p type="p">210:結合周邊部</p>
        <p type="p">212:填塞凸條</p>
        <p type="p">213:準位校正框</p>
        <p type="p">214:隔間蓋面部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="445" publication-number="202632109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動裁布機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">D06H7/02</main-classification>
        <further-classification edition="200601120250310B">D06H7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻寶興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張守綜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動裁布機，包括布料張緊裝置、電動刀具組及展布裝置。布料張緊裝置包含一張緊器和一加壓器。張緊器由張緊架及兩側對稱的張緊件組成，用於支撐布料。加壓器具有兩個對稱的加壓件，由致動器驅動，壓制布料以實現張緊。電動刀具組(如電動圓刀機)安裝於刀具往復位移裝置內。展布裝置包含布卷軸、糾偏單元及驅動輪組，用於釋放布料並穩定不偏移的輸送至張緊裝置。該自動裁布機整體裝置通過多組結構配合，確保布料繃緊且裁切精準，適用於自動化裁布作業，提高裁切效率與精度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:展布裝置</p>
        <p type="p">11:展布機架</p>
        <p type="p">12:布卷軸</p>
        <p type="p">121:卷狀布料</p>
        <p type="p">13:糾偏單元</p>
        <p type="p">143:輪軸壓缸</p>
        <p type="p">20:裁布裝置</p>
        <p type="p">21:裁布機架</p>
        <p type="p">22:刀具往復位移裝置</p>
        <p type="p">40:布料張緊裝置</p>
        <p type="p">50:加壓器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="446" publication-number="202631438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車座桿結構</chinese-title>
        <english-title>BICYCLE SEAT POST STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250506B">B62J1/08</main-classification>
        <further-classification edition="200601120250506B">B62J1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立盟金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIMOTEC METAL INDUSTRY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白敏郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, MIN LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭啟昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓子見</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSO, TZU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種自行車座桿結構。自行車座桿結構包含一下管、一上管以及一調整機構。上管可移動地插設於下管。調整機構包含一升降模組及一推動模組。升降模組包含一卡匣管及一作動桿。作動桿插設於卡匣管，且具有一第一軸線。推動模組包含一馬達及一推動塊。馬達具有一第二軸線。作動桿的第一軸線平行於馬達的第二軸線，第一軸線及第二軸線之間具有一間距。藉此，最大化利用自行車座桿之空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle seat post structure is proposed. The bicycle seat post structure includes a lower tube, an upper tube and an adjusting mechanism. The upper tube is movably inserted in the lower tube. The adjusting mechanism includes a lifting module and a pushing module. The lifting module includes a cartridge tube and an actuating rod. The actuating rod is inserted in the cartridge tube and has a first axis. The pushing module includes a motor and a driving block. The motor has a second axis. The first axis of the actuating rod is parallel to the second axis of the motor, and there is a distance between the first axis and the second axis. Thus, the bicycle seat post structure of the present disclosure can maximize the space utilization of the bicycle seat post.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:下管</p>
        <p type="p">110:殼體</p>
        <p type="p">120:底蓋</p>
        <p type="p">200:上管</p>
        <p type="p">300:調整機構</p>
        <p type="p">310:升降模組</p>
        <p type="p">311:卡匣管</p>
        <p type="p">312:作動桿</p>
        <p type="p">320:推動模組</p>
        <p type="p">321:馬達</p>
        <p type="p">3211:輸出端</p>
        <p type="p">322:推動塊</p>
        <p type="p">323:控制板</p>
        <p type="p">324:微動開關</p>
        <p type="p">325:座體</p>
        <p type="p">330:防水模組</p>
        <p type="p">331:內管</p>
        <p type="p">332:防水蓋</p>
        <p type="p">333:上蓋防水環</p>
        <p type="p">3331:插入孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="447" publication-number="202631459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環保循環杯無線識別杯底邊框結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B65D25/02</main-classification>
        <further-classification edition="200601120250317B">G06K19/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐泰科技企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環保循環杯無線識別杯底邊框結構，係一循環杯，包括：一杯本體，為絕緣杯體，其盛液杯室外部的一杯底部下方，由一杯身延伸一杯底邊框形成一框室；一框蓋件的蓋體結合該杯底邊框將該框室封閉，具有一框圈體在該框室中形成一電波感應空間；一無線射頻識別標籤，係置設在該電波感應空間周邊，其金屬薄膜天線的口形主天線兩側延伸一對擴展天線及開設一溝槽作為迴路焊盤電性連接一超高頻無線射頻識別晶片；整體結構，能使該循環杯使用該無線射頻識別標籤，除不存在抗化學性、脫落或外力破壞的問題外，批量識別時，還增進長距離(遠場)讀取的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:循環杯</p>
        <p type="p">10:杯本體</p>
        <p type="p">11:杯體</p>
        <p type="p">110:杯身</p>
        <p type="p">111:杯底部</p>
        <p type="p">112:杯底邊框</p>
        <p type="p">113:結合端面</p>
        <p type="p">12:盛液杯室</p>
        <p type="p">13:框室</p>
        <p type="p">20:框蓋件</p>
        <p type="p">21:蓋體</p>
        <p type="p">210:框圈體</p>
        <p type="p">212:結合周邊部</p>
        <p type="p">214:蓋面部</p>
        <p type="p">22:電波感應空間</p>
        <p type="p">24:空隙</p>
        <p type="p">30:無線射頻識別標籤</p>
        <p type="p">40:超高頻無線射頻識別晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="448" publication-number="202632907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>前端電路系統與訊號轉換方法</chinese-title>
        <english-title>FRONT-END CIRCUITRY AND SIGNAL CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H03M1/12</main-classification>
        <further-classification edition="200601120250501B">H03M1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">前端電路系統包含第一緩衝器電路、第一開關、類比數位轉換器電路、數位類比轉換器電路、第二開關以及減法器電路。第一緩衝器電路用以根據一輸入訊號產生一第一緩衝訊號。第一開關用以根據一控制訊號導通，以將該第一緩衝訊號輸出為一第一訊號。類比數位轉換器電路用以根據該第一訊號產生一數位碼。數位類比轉換器電路用以根據該數位碼產生一回授訊號。第二開關用以根據該控制訊號導通，以根據該輸入訊號輸出一第二訊號。減法器電路用以自該第二訊號減去該回授訊號以產生一輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A front-end circuitry includes a first buffer circuit, a first switch, an analog-to-digital converter circuit, a digital-to-analog converter circuit, a second switch, and a subtractor circuit. The first buffer circuit is configured to generate a first buffer signal according to an input signal. The first switch is configured to be turned on according to a control signal to output the first buffer signal as a first signal. The analog-to-digital converter circuit is configured to generate a digital code according to the first signal. The digital-to-analog converter circuit is configured to generate a feedback signal according to the digital code. The second switch is configured to be turned on according to the control signal to output a second signal according to the input signal. The subtractor circuit is configured to subtract the feedback signal from the second signal to generate an output signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:前端電路系統</p>
        <p type="p">110:緩衝器電路</p>
        <p type="p">120:類比數位轉換器電路</p>
        <p type="p">130:數位類比轉換器電路</p>
        <p type="p">140:減法器電路</p>
        <p type="p">FB:回授訊號</p>
        <p type="p">S1:訊號</p>
        <p type="p">S2:訊號</p>
        <p type="p">SD:數位碼</p>
        <p type="p">VIN:輸入訊號</p>
        <p type="p">SO:輸出訊號</p>
        <p type="p">SW1:開關</p>
        <p type="p">SW2:開關</p>
        <p type="p">VB1:緩衝訊號</p>
        <p type="p">VC:控制訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="449" publication-number="202632620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跌倒風險預測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250212B">G08B21/04</main-classification>
        <further-classification edition="200601120250212B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚微科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清長</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勝榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬　米山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILZAM, WAFI AZHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跌倒風險預測系統，其包括：一跌倒風險預測伺服器，係包括：一人工智能運算模組、一智能模組晶片、一特徵資料傳輸單元、一特徵資料庫及一雲端儲存模組；一閘道器，係訊號連接該跌倒風險預測伺服器；一資料儲存系統，係訊號連接該閘道器；一行動裝置，係訊號連接該閘道器，透過該行動裝置監測使用者的步行狀態，以判斷預測使用者跌倒的風險高或低；以及一跌倒風險顯示裝置，係訊號連接該閘道器及該行動裝置，當該跌倒風險預測伺服器判斷預測使用者跌倒的風險高或低時，透過該跌倒風險顯示裝置以顯示使用者跌倒風險的高或低之狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:跌倒風險預測伺服器</p>
        <p type="p">101:人工智能運算模組</p>
        <p type="p">102:智能模組晶片</p>
        <p type="p">103:特徵資料傳輸單元</p>
        <p type="p">104:特徵資料庫</p>
        <p type="p">105:雲端儲存模組</p>
        <p type="p">106:訓練資料庫</p>
        <p type="p">107:驗證資料庫</p>
        <p type="p">108:預測風險標籤資料庫</p>
        <p type="p">20:閘道器</p>
        <p type="p">30:資料儲存系統</p>
        <p type="p">40:行動裝置</p>
        <p type="p">401:跌倒風險顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="450" publication-number="202632709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有單一光學裝置之離子顯微鏡及聚焦離子束系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">H01J27/02</main-classification>
        <further-classification edition="200601120250206B">H01J37/08</further-classification>
        <further-classification edition="200601120250206B">H01J37/30</further-classification>
        <further-classification edition="200601120250206B">H01J37/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾思科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林君岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴韋僑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗于</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭靜瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有單一光學裝置之離子顯微鏡及聚焦離子束系統包含真空腔體、發射極、氣體壓力控制裝置、光學裝置、電壓控制模組及訊號控制模組。其中，發射極、光學裝置與樣品設置於真空腔體的內部空間內。氣體壓力控制裝置儲存有氣體，且連接真空腔體的腔體壁面。電壓控制模組電連接發射極及光學裝置，產生汲取電壓至發射極上並產生偏壓電壓至光學裝置上。訊號控制模組連接氣體壓力控制裝置及電壓控制模組，產生導入氣體控制訊號，使氣體壓力控制裝置導入氣體至內部空間中，且訊號控制模組調整輸出偏壓與汲取電壓，使發射極產生重離子束及輕離子束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具有單一光學裝置之離子顯微鏡及聚焦離子束系統</p>
        <p type="p">11:真空腔體</p>
        <p type="p">12:發射極</p>
        <p type="p">13:氣體壓力控制裝置</p>
        <p type="p">131:氣體容器</p>
        <p type="p">132:氣體調節閥</p>
        <p type="p">133:真空幫浦</p>
        <p type="p">14:光學裝置</p>
        <p type="p">141:聚焦透鏡模組</p>
        <p type="p">142:掃描偏轉模組</p>
        <p type="p">143:質量篩選模組</p>
        <p type="p">15:電壓控制模組</p>
        <p type="p">16:訊號控制模組</p>
        <p type="p">17:訊號偵測器</p>
        <p type="p">S:樣品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="451" publication-number="202632349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陣列光源與陣列光纖耦合之光引擎</chinese-title>
        <english-title>LIGHT ENGINE FOR COUPLING ARRAY LIGHT SOURCES WITH ARRAY OPTICAL FIBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">G02B6/26</main-classification>
        <further-classification edition="200601120250314B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英群企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEHAVIOR TECH COMPUTER CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂孝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, SHIAO WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂孝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, SHIAO WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光引擎主要提供一孔片配置於陣列光纖與陣列光源之間，利用計算方式設定陣列光源與孔片之間距，使陣列光源之光發散角得以涵蓋陣列光纖之纖芯直徑，不僅提高被動耦光效率，亦可提高組裝之便利性與效率；且藉由陣列光源之發光面上覆蓋有高折射封裝膠，藉以調整陣列光源的光發散角更集中於進入陣列光纖之纖芯直徑範圍，以降低陣列光源的光反射減少雜訊，並降低耦光損耗，可提升光通訊效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The light engine of this invention primarily provides an aperture plate positioned between the array light sources and the array optical fibers. By calculating and setting the distance between the array light sources and the aperture plate, the divergence angle of the array light sources can cover the core diameter of the array optical fibers. This design not only improves passive coupling efficiency but also enhances assembly convenience and efficiency. Additionally, the emission surface of the array light sources is covered with a high-refractive-index encapsulant to adjust the divergence angle of the light, concentrating it within the core diameter range of the array optical fibers. This reduces light reflection from the array light sources, minimizes noise, lowers coupling loss, and enhances optical communication performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">H:間距</p>
        <p type="p">10:陣列光源</p>
        <p type="p">11:第一載板</p>
        <p type="p">12:點光源</p>
        <p type="p">13:高反射封裝膠</p>
        <p type="p">20:陣列光纖</p>
        <p type="p">21:纖芯</p>
        <p type="p">22:光纖束接頭</p>
        <p type="p">30:孔片</p>
        <p type="p">31:本體</p>
        <p type="p">32:穿孔</p>
        <p type="p">41:膠體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="452" publication-number="202631697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>澱粉降解的方法、防油複合層及其製作方法</chinese-title>
        <english-title>METHOD OF STARCH DEGRADATION, GREASEPROOF COMPOSITE LAYER, AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">C08B30/12</main-classification>
        <further-classification edition="200601120250430B">C09D103/06</further-classification>
        <further-classification edition="200601120250430B">C09K3/18</further-classification>
        <further-classification edition="200601120250430B">D21H19/12</further-classification>
        <further-classification edition="200601120250430B">D21H21/14</further-classification>
        <further-classification edition="200601120250430B">D21H27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種澱粉降解的方法包括以下操作。混合乙醯化己二酸二澱粉、酸及極性溶劑，形成澱粉懸浮液。調整澱粉懸浮液的溫度為-23°C至47°C，進行降解反應，形成第一降解澱粉溶液。加入鹼使第一降解澱粉溶液的pH值上升，得到第二降解澱粉溶液。一種製作防油複合層的方法包括以下操作。混合具有3.00×10        &lt;sup&gt;6&lt;/sup&gt;至5.50×10        &lt;sup&gt;7&lt;/sup&gt;的重均分子量的乙醯化己二酸二澱粉及極性溶劑，以得到澱粉液。將澱粉液糊化，以形成糊化澱粉液。使糊化澱粉液附著於基材上和進行乾燥製程，以形成防油複合層。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of starch degradation includes the following operations. Acetylated distarch adipate, acid, and a polar solvent are mixed to form a starch suspension. The starch suspension is adjusted to a temperature between -23 °C to 47 °C, and a degradation reaction is carried out to form a first degraded starch solution. The pH value of the first degraded starch solution is increased by adding alkali to obtain a second degraded starch solution. A method of manufacturing a greaseproof composite layer includes the following operations. Acetylated distarch adipate with a weight-average molecular weight of 3.00×10        &lt;sup&gt;6&lt;/sup&gt;to 5.50×10        &lt;sup&gt;7&lt;/sup&gt;and a polar solvent are mixed to obtain a starch solution. The starch solution is gelatinized to form a gelatinized starch solution. The gelatinized starch solution is adhered on a substrate, and a drying process is performed to form a greaseproof composite layer.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:防油複合層</p>
        <p type="p">310:基材</p>
        <p type="p">320:乙醯化己二酸二澱粉層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="453" publication-number="202632870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103236</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換器與控制電源轉換器的方法及控制器</chinese-title>
        <english-title>POWER CONVERTOR AND CONTROLLING METHOD THEREOF AND CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/335</main-classification>
        <further-classification edition="200601120250602B">H02M7/217</further-classification>
        <further-classification edition="200601120250602B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換器，包括變壓器、諧振電路、開關電路以及輔助電路。變壓器包括設置於變壓器之初級側的初級側繞組、並聯初級側繞組的激磁電感和設置於變壓器的次級側且耦合初級側繞組的次級側繞組。諧振電路耦合初級側繞組。開關電路包括第一開關與串接第一開關的第二開關。諧振電路耦合於第一開關以及第二開關之間。設置於初級側的輔助電路包括輔助繞組、耦合輔助繞組的輔助開關以及串聯輔助開關的輔助電容。輔助開關斷開以及激磁電感放電以對輔助電容充電。輔助開關導通使輔助電容對激磁電感充電產生激磁電流，激磁電流使第一開關的寄生二極體導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter includes a transformer, a resonant circuit, a switching circuit, and an auxiliary circuit. The transformer includes a primary side winding disposed on a primary side of the transformer, a magnetic inductor coupled to the primary side winding, and a secondary side winding that is disposed on a secondary side of the transformer and coupled to the primary side winding. The resonant circuit couples to the primary side winding. The switching circuit includes a first switch and a second switch coupled in series with the first switch. The resonant circuit is coupled between the first switch and the second switch. The auxiliary circuit at the primary side includes an auxiliary winding, an auxiliary switch coupled to the auxiliary winding, and an auxiliary capacitor connected in series with the auxiliary switch. The auxiliary switch is switched off and the magnetic inductor is discharged so that the auxiliary capacitor is charged. The auxiliary switch is switched on so that the auxiliary capacitor charges the magnetic inductor to generate a magnetic inductor current, and the magnetic inductor current switches on a parasitic diode of the first switch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源轉換器</p>
        <p type="p">110:開關電路</p>
        <p type="p">120:諧振電路</p>
        <p type="p">130:輔助電路</p>
        <p type="p">140:初級側</p>
        <p type="p">150:次級側</p>
        <p type="p">160:控制器</p>
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;:寄生電容</p>
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;:寄生電容</p>
        <p type="p">C&lt;sub&gt;a&lt;/sub&gt;:輔助寄生電容</p>
        <p type="p">C&lt;sub&gt;b&lt;/sub&gt;:輔助電容</p>
        <p type="p">C&lt;sub&gt;O&lt;/sub&gt;:電容</p>
        <p type="p">C&lt;sub&gt;r&lt;/sub&gt;:電容</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:寄生二極體</p>
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:寄生二極體</p>
        <p type="p">D&lt;sub&gt;a&lt;/sub&gt;:寄生二極體</p>
        <p type="p">D&lt;sub&gt;O&lt;/sub&gt;:二極體</p>
        <p type="p">L&lt;sub&gt;m&lt;/sub&gt;:激磁電感</p>
        <p type="p">L&lt;sub&gt;r&lt;/sub&gt;:電感</p>
        <p type="p">N&lt;sub&gt;1&lt;/sub&gt;:初級側繞組</p>
        <p type="p">N&lt;sub&gt;2&lt;/sub&gt;:次級側繞組</p>
        <p type="p">N&lt;sub&gt;a&lt;/sub&gt;:輔助繞組</p>
        <p type="p">n&lt;sub&gt;1&lt;/sub&gt;:節點</p>
        <p type="p">R&lt;sub&gt;L&lt;/sub&gt;:負載</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;:開關</p>
        <p type="p">S&lt;sub&gt;2&lt;/sub&gt;:開關</p>
        <p type="p">S&lt;sub&gt;a&lt;/sub&gt;:輔助開關</p>
        <p type="p">TX:變壓器</p>
        <p type="p">V&lt;sub&gt;a&lt;/sub&gt;:電壓</p>
        <p type="p">V&lt;sub&gt;gs_HS&lt;/sub&gt;:信號</p>
        <p type="p">V&lt;sub&gt;gs_LS&lt;/sub&gt;:信號</p>
        <p type="p">V&lt;sub&gt;gs_Sa&lt;/sub&gt;:信號</p>
        <p type="p">V&lt;sub&gt;HB&lt;/sub&gt;:電壓</p>
        <p type="p">V&lt;sub&gt;O&lt;/sub&gt;:輸出電壓</p>
        <p type="p">V&lt;sub&gt;PFC&lt;/sub&gt;:輸入電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="454" publication-number="202632449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產線邊緣即時人工智慧系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G05B19/418</main-classification>
        <further-classification edition="200601120250401B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>御諾資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昆勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種產線邊緣即時人工智慧系統，其包含一資料收集系統、一統計分析系統、一人工智慧建模系統及一自動調校系統。資料收集系統用以進行一資料的預處理與清理。統計分析系統將預處理與清理後的資料進行分析以生成可用的一資料集。人工智慧建模系統用以將資料集進行多模型運行和評估，以完成一AI模型的創建與部署。最後，當AI模型部署於一產線後，自動調校系統用以依據產線的最新資料自動調校AI模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:產線邊緣即時人工智慧系統</p>
        <p type="p">200:資料收集系統</p>
        <p type="p">210:資料前處理模組</p>
        <p type="p">220:資料虛擬化模組</p>
        <p type="p">230:資料轉換模組</p>
        <p type="p">300:統計分析系統</p>
        <p type="p">310:特徵抓取模組</p>
        <p type="p">320:嚮導功能模組</p>
        <p type="p">400:人工智慧建模系統</p>
        <p type="p">410:建模效率最佳化模組</p>
        <p type="p">500:自動調校系統</p>
        <p type="p">510:模型漂移檢測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="455" publication-number="202632378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分離式虛擬實境裝置</chinese-title>
        <english-title>DETACHED VIRTUAL REALITY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">G02B27/01</main-classification>
        <further-classification edition="200601220250328B">G01R33/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種分離式虛擬實境裝置，其係供一使用者配戴，且使用者身上係具有一第一位置。分離式虛擬實境裝置包含一分離式頭盔以及一分離式主機。分離式頭盔係配戴在一使用者之頭部，且於分離式頭盔上設有一第二位置。分離式主機電性連接分離式頭盔，分離式主機根據分離式主機位於第一位置或第二位置而選擇對應之一第一功率表或一第二功率表，以根據第一功率表或第二功率表來收發一射頻訊號。因此，本案可以根據分離式主機所在位置，選擇不同的功率表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides discloses a detached virtual reality device, which is worn by a user and has a first position on the user's body. The detached virtual reality device includes a detached headset and a detached host. The detached headset is worn on the user's head and has a second position on the detached headset. The detached host is electrically connected to the detached headset. The detached host selects a corresponding first power table or a second power table according to whether the detached host is located at the first position or the second position, so as to transmit and receive a radio frequency signal according to the first power table or the second power table. Therefore, in the disclosure, different power tables can be selected according to the location of the detached host.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:分離式虛擬實境裝置</p>
        <p type="p">22:分離式頭盔</p>
        <p type="p">221:影像擷取元件</p>
        <p type="p">222:第一射頻模組</p>
        <p type="p">24:分離式主機</p>
        <p type="p">241:處理裝置</p>
        <p type="p">242:霍爾感測器</p>
        <p type="p">243:第二射頻模組</p>
        <p type="p">32:傳輸纜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="456" publication-number="202631426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異常物件檢測警告系統、異常物件檢測方法及電子裝置</chinese-title>
        <english-title>ABNORMAL OBJECT DETECTION ALERT SYSTEM, METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">B61L23/04</main-classification>
        <further-classification edition="200601120250502B">B61L15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲渝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHE YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHAO YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種異常物件檢測警告系統，可應用於無人載具執行軌道巡檢任務，包含：儲存模組、檢測模組以及通知模組。一種異常物件檢測方法，包含：儲存無人載具拍攝之影像資料；檢測影像資料，以從影像資料中識別出具有異常特徵之影像資料以及傳送具有異常特徵之影像資料到使用者的行動裝置。一種電子裝置，具有包含異常物件檢測警告系統的系統軟體，該系統軟體可以線上更新。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An abnormal object detection warning system applicable to an unmanned vehicle performing track inspection tasks includes a storage module, a processing module, and a notification module. An abnormal object detection method, including: storing image data captured by unmanned vehicles; processing the image data to identify image data with abnormal characteristics from the image data; and transmitting image data with abnormal characteristics to the user's mobile device. An electronic device has system software including an abnormal object detection system, and the system software can be updated online.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:異常物件檢測警告系統</p>
        <p type="p">101:照片</p>
        <p type="p">102:伺服器</p>
        <p type="p">103:I影像辨識服務</p>
        <p type="p">104:工作人員</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="457" publication-number="202632936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟體定義無線感測器網路的負載平衡系統及其方法</chinese-title>
        <english-title>A SYSTEM AND METHOD FOR LOAD BALANCING IN A SOFTWARE-DEFINED WIRELESS SENSOR NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250502B">H04L47/125</main-classification>
        <further-classification edition="200901120250502B">H04W28/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高正豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZHENG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴振唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, JHEN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種軟體定義無線感測器網路的負載平衡系統及其方法，包括第一控制器偵測閘道與複數節點的複數傳輸路徑的負載。當過負載的複數傳輸路徑的比率超過比率閥值時，第一控制器發出過載警示訊息給第二控制器。接著，第二控制器將第一控制器加入觀察清單，並停止轉移新閘道給觀察清單中的第一控制器管理。本發明可有效平衡控制器的負載狀況，且能避免節點失效所引起的突發性大量路徑改變時，造成控制器過負載的問題，提升網路的穩定度和可靠度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for load balancing in a software-defined wireless sensor network, comprising a first controller detects the load of multiple transmission paths between a gateway and multiple nodes. The first controller sends an overload warning message to a second controller, when the ratio of overloaded transmission paths exceeds a threshold value. Then the second controller adds the first controller to an observation list and stops assigning new gateways to the first controller in the observation list. This invention can effectively balance the load of the controllers and prevent overload issues caused by sudden large-scale path changes due to node failures, thereby improving the stability and reliability of the network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負載平衡系統</p>
        <p type="p">10:控制域</p>
        <p type="p">10’:控制域</p>
        <p type="p">12:節點</p>
        <p type="p">12’:節點</p>
        <p type="p">14:閘道</p>
        <p type="p">14’:閘道</p>
        <p type="p">16:第一控制器</p>
        <p type="p">16’:第一控制器</p>
        <p type="p">20:第二控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="458" publication-number="202631318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定型拋光墊修整器</chinese-title>
        <english-title>STABLE POLISHING PAD CONDITIONER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B24B53/12</main-classification>
        <further-classification edition="201201120260504B">B24B53/017</further-classification>
        <further-classification edition="202601120260504B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日鐵精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ALLOY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炳旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BING-JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穩定型拋光墊修整器包含有一基板以及複數個修整凸起物。複數個修整凸起物固定於基板，且每一修整凸起物包含有一修整平面，且修整平面的修整平面法線方向與基板的修整器基準面的垂直線形成一夾角，且夾角小於30度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stable polishing pad conditioner includes a substrate and a plurality of conditioning protrusions. A plurality of conditioning protrusions are fixed on the substrate, each of the condition protrusions includes a conditioning surface, a conditioning surface normal direction of the conditioning surface forms an angle with a vertical line of a conditioner base plane of the substrate, and the angle is less than 30 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:穩定型拋光墊修整器</p>
        <p type="p">101:修整平面法線方向</p>
        <p type="p">110:基板</p>
        <p type="p">112:修整器基準面</p>
        <p type="p">120:修整凸起物</p>
        <p type="p">122:修整平面</p>
        <p type="p">130:接合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="459" publication-number="202631316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑽石拋光墊修整器及其製造方法</chinese-title>
        <english-title>DIAMOND POLISHING PAD CONDITIONER AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250304B">B24B53/017</main-classification>
        <further-classification edition="200601120250304B">B24B53/12</further-classification>
        <further-classification edition="200601120250304B">B24D18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日鐵精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ALLOY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炳旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PING-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BING-JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鑽石拋光墊修整器的製造方法包含有下列步驟，提供一基材，提供複數個鑽石顆粒，並將鑽石顆粒固定於基材之上，以及形成一預定厚度之選擇性包覆保護層於基材之上，並自動露出鑽石顆粒。此外，一種鑽石拋光墊修整器亦在此揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A diamond polishing pad conditioner manufacturing method includes the following steps of providing a substrate, providing a plurality of diamond particles, fixing the diamond particles on the substrate, and forming a selective covering protective layer with a predetermined thickness. A selective covering protective layer is formed on the substrate, and the diamond particles are automatically exposed. In addition, a diamond polishing pad conditioner is also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鑽石拋光墊修整器</p>
        <p type="p">110:基材</p>
        <p type="p">120:鑽石顆粒</p>
        <p type="p">130:接合層</p>
        <p type="p">140:選擇性包覆保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="460" publication-number="202632593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用水控制方法及裝置、電腦設備及存儲介質</chinese-title>
        <english-title>WATER CONTROL METHOD AND DEVICE, COMPUTER DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250502B">G06Q50/06</main-classification>
        <further-classification edition="200601120250502B">E03B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭錦斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧志德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TSUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種用水控制方法及裝置、電腦設備及存儲介質，方法包括：採集目標場景對應之即時用水資訊；確定所述目標場景對應之歷史用水模式；基於所述即時用水資訊與所述歷史用水模式，確定所述目標場景對應之用水狀態；於所述用水狀態指示用水異常時，確定所述目標場景對應之目標環境資訊；基於所述目標環境資訊，確定所述目標場景對應之用水策略。利用本申請，能夠避免水資源浪費。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a water control method and a device, a computer device, and a storage medium. The method includes: collecting real-time water usage information corresponding to a target scene; determining historical water usage modes corresponding to the target scene; based on the real-time water usage information and the historical water usage modes, determining a water usage status corresponding to the target scene; when the water usage status indicates that water usage is abnormal, determining target environmental information corresponding to the target scene; based on the target environmental information, determining a water use strategy corresponding to the target scene. By utilizing this application, wasting of water resource can be avoided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11-S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="461" publication-number="202632509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻率調整裝置及頻率調整方法</chinese-title>
        <english-title>FREQUENCY ADJUSTMENT DEVICE AND FREQUENCY ADJUSTMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F13/14</main-classification>
        <further-classification edition="200601120250602B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李京軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頻率調整裝置包含微處理器及緩衝器。微處理器用以接收記憶體存取信號。緩衝器設置於微處理器的內部，且緩衝器用以接收並根據記憶體存取信號、輸入指標信號及輸出指標信號以輸出輸入指標信號及輸出指標信號。頻率調整電路接收並根據輸入指標信號及輸出指標信號以輸出第一當前閾值。頻率調整電路根據設定閾值信號及第一當前閾值以輸出閾值修整信號至時間暫存器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A frequency adjustment device includes a microprocessor and a buffer. The microprocessor is configured to receive a memory access signal. The buffer is located inside the microprocessor, and the buffer is configured to output an input indicator signal and an output indicator signal according to the memory access signal, the input indicator signal, and the output indicator signal. The frequency adjustment circuit is configured to output a first current threshold according to the input indicator signal and the output indicator signal. The frequency adjustment circuit outputs a threshold trimming signal to a time register according to a setting threshold signal and the first current threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頻率調整裝置</p>
        <p type="p">900:第一介面/介面</p>
        <p type="p">10:微處理器</p>
        <p type="p">20:頻率調整電路</p>
        <p type="p">30:信號接收區塊</p>
        <p type="p">310:緩衝器</p>
        <p type="p">210:第一選擇器/第一減法器/減法器</p>
        <p type="p">220:第二選擇器/第二減法器/減法器</p>
        <p type="p">230:第三選擇器/選擇器</p>
        <p type="p">110:時間暫存器</p>
        <p type="p">910:第二介面</p>
        <p type="p">Rx:接收信號/輸入信號</p>
        <p type="p">Tx:輸出信號</p>
        <p type="p">SPR:輸入記憶體存取信號/記憶體存取信號</p>
        <p type="p">SOP:輸出指標信號</p>
        <p type="p">SIP:輸入指標信號</p>
        <p type="p">SCT:當前閾值/當前閾值信號</p>
        <p type="p">SST:設定閾值信號</p>
        <p type="p">STT:閾值修整信號</p>
        <p type="p">SSI:設定間隔信號</p>
        <p type="p">SIT:間隔修整信號</p>
        <p type="p">SC:時鐘信號/時序信號</p>
        <p type="p">SPT:輸出記憶體存取信號/記憶體存取信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="462" publication-number="202633305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P70/00</main-classification>
        <further-classification edition="202601120260504B">H10P14/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山太士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLIANCE MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳學宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSUEH CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欽楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝詩柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, SHI-ROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宣佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XUAN YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠羣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置的製造方法，包括形成解離材料層於第一離型層上；執行第一加熱製程，使得解離材料層由液態轉變為固態，以構成第一膜狀結構；形成黏著層於第二離型層上，以構成第二膜狀結構；將第一膜狀結構與第二膜狀結構組裝成膜狀組件；將膜狀組件貼附至製程元件上；對膜狀組件執行第二加熱製程；以及執行雷射製程，以移除解離材料層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device includes forming a dissociation material layer on a first release layer; performing a first heating process to convert the dissociation material layer from a liquid state to a solid state to form a first film-like structure; forming an adhesive layer on the second release layer to form a second film-like structure; assemble the first film-like structure and the second film-like structure into a film-like component; attach the film-like component to the process component; performing a second heating process on the film-like component; and performing a laser process to remove the dissociation material layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一離型層</p>
        <p type="p">12:解離材料層</p>
        <p type="p">21:第二離型層</p>
        <p type="p">22:黏著層</p>
        <p type="p">100:膜狀組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="463" publication-number="202632876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有太陽能板的電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE WITH SOLAR PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250401B">H02S40/30</main-classification>
        <further-classification edition="201401120250401B">H02S40/20</further-classification>
        <further-classification edition="201401120250401B">H02S30/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金寶電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINPO ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許欽朝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIN CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭崚峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, LING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有太陽能板的電子裝置包括透光蓋板與太陽能板。透光蓋板具有彼此相對的受光面與背光面以及自背光面凹陷的容置凹槽。太陽能板設置在透光蓋板的容置凹槽內，且具有感光面。受光面與背光面沿著感光面的法線方向具有第一間距。受光面與感光面沿著感光面的法線方向具有第二間距。第二間距小於第一間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device with a solar panel including a light-transmitting cover and a solar panel is provided. The light-transmitting cover has a light-receiving surface and a shady surface opposite to each other and an accommodation groove recessed from the shady surface. The solar panel is disposed in the accommodation groove of the light-transmitting cover and has a photosensitive surface. The light-receiving surface and the shady surface have a first spacing along a normal direction of the photosensitive surface. The light-receiving surface and the photosensitive surface have a second spacing along the normal direction of the photosensitive surface. The second spacing is less than the first spacing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:具有太陽能板的電子裝置</p>
        <p type="p">100:透光蓋板</p>
        <p type="p">100bs:背光面</p>
        <p type="p">100rs:受光面</p>
        <p type="p">150:遮光圖案層</p>
        <p type="p">150op:開口</p>
        <p type="p">150p:邊緣部分</p>
        <p type="p">200:太陽能板</p>
        <p type="p">200p:板緣部分</p>
        <p type="p">200ss:感光面</p>
        <p type="p">AG:容置凹槽</p>
        <p type="p">L:環境光</p>
        <p type="p">S1、S2:間距</p>
        <p type="p">SA:感光區</p>
        <p type="p">WA1:弱光區</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="464" publication-number="202631011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酪胺製劑及其用途</chinese-title>
        <english-title>PREPARATION CONTAINING TYRAMINE AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">A01N33/02</main-classification>
        <further-classification edition="200601120250801B">A01N31/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE &amp; TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEN-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭信威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江和諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種酪胺製劑，用以解決習知酪胺的作用時效不足的問題。該酪胺製劑係包含：以重量百分比計為12.5～25.0%的酪胺及75.0～87.5%的聚乙二醇。藉此可以延長酪胺的作用時效，達成降低酪胺的投予頻率及降低水產養殖之成本等功效。本發明另關於該酪胺製劑的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A preparation containing tyramine is used to solve the problem that tyramine has a relative short duration of action. The preparation comprises 12.5-25.0 wt% of tyramine and 75.0-87.5 wt% of polyethylene glycol (PEG). Accordingly, the duration of action of tyramine can be extended, the application frequency of tyramine can be decreased, and thus, the cost in aquaculture can be reduced. The use of the preparation containing tyramine is also disclosed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="465" publication-number="202632252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>未知缺陷之異常偵測裝置</chinese-title>
        <english-title>ANOMALY DETECTION DEVICE FOR UNKNOWN DEFECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">G01N21/88</main-classification>
        <further-classification edition="201701120251017B">G06T7/10</further-classification>
        <further-classification edition="201901120251017B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游菘淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, SONG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高嘉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種未知缺陷之異常偵測裝置，包括:一異常偵測模組，對一樣品進行圖像檢測，且依據一瑕疵門檻來得到判斷該樣品為不良品的一第一檢測結果或為似良品的一第二檢測結果；一圖像處理模組，依據一尺寸門檻，對該第二檢測結果進行尺寸瑕疵的檢測；一圖像分割處理模組，對該第二檢測結果進行圖像分割以辨識出該樣品中的瑕疵物件；一後處理模組，對已辨識出的該瑕疵物件進行一後處理；以及，一判定模組，對經過後處理模組處理的瑕疵物件進行一物理量判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anomaly detection device for unknown defects includes: an anomaly detection module performing image inspection on a sample, based on a defect threshold, to obtain a first detection result determining that the sample is a defective product or a second result determining that the sample is a quasi-good product; an image processing module detecting a dimensional defects on the second detection result based on a size threshold; an image segmentation processing module performing image segmentation on the second detection result to recognize a defective object on the sample; a post-processing module performing a post-processing to the recognized defective object; and a judgement module performing a physical quantity determination on the defective object which has been processed by the post-processing module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:未知缺陷之異常偵測裝置</p>
        <p type="p">201:異常偵測模組</p>
        <p type="p">202:圖像處理模組</p>
        <p type="p">203:圖像分割模組</p>
        <p type="p">204:後處理模組</p>
        <p type="p">205:判定模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="466" publication-number="202631340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具收納裝置</chinese-title>
        <english-title>TOOL STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">B25H3/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久年塑膠有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN NIEN PLASTIC LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張基財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種工具收納裝置，其包括：一座體，其包括一軌槽，該軌槽朝一延伸方向延伸，該座體的相對二側朝彼此的方向凸伸二檔部，各該檔部包括複數間距設置之凸部及複數凹口，該複數凸部及該複數凹口沿該延伸方向交替設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tool storage device is provided, including: a base body having a rail slot that extends in an extension direction. Two opposite sides of the base body protrude toward each other to form two blocking portions. Each blocking portion includes a plurality of spaced-apart protrusions and a plurality of recesses, with the protrusions and the recesses being alternately arranged along the extension direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具收納裝置</p>
        <p type="p">10:座體</p>
        <p type="p">11:底部</p>
        <p type="p">12:貫孔</p>
        <p type="p">13:側部</p>
        <p type="p">30:檔部</p>
        <p type="p">40:蓋件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="467" publication-number="202632574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>會員消費回饋方法及系統</chinese-title>
        <english-title>MEMBER CONSUMPTION FEEDBACK METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250206B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250206B">G06Q30/0208</further-classification>
        <further-classification edition="202301120250206B">G06Q30/0214</further-classification>
        <further-classification edition="202301120250206B">G06Q30/0217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡軒洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSUAN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡軒洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSUAN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種會員消費回饋方法，其包含有：一消費者依據一商品金額及一預定消費金額成為一第一階段會員。第一階段會員招募至少一第一新會員，第一階段會員即晉升為一第二階段會員。一主要消費群組的第一新會員招募至少一第二新會員，第一新會員晉升為一子分支消費群組的第二階段會員，子分支消費群組的第二階段會員由子分支消費群組獲取一第二獎金，主要消費群組的第二階段會員由主消費群組獲取一第一獎金、由子分支消費群組獲取一子分支獎金。藉此，達到便於計算獎金之目的。進一步地，協助會員建立出一龐大的銷售體系。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A member consumption feedback method, which includes: a consumer becomes a first stage member based on the amount of a product and a predetermined consumption amount. The first stage member recruits at least one first new member and the first stage member is promoted to a second stage member. The first new member of the main consumer group recruits at least one second new member, the first new member is promoted to the second stage member of a sub-branch consumer group, the second stage member of the sub-branch consumer group receives the bonus from the sub-branch consumer group, and the second stage member of the main consumer group receives the bonus from the main consumer group and the sub-branch consumer group. Thus, it is convenient to calculate the bonus. Further, assist members to establish a huge sales system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:會員消費回饋方法</p>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="468" publication-number="202633230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10H29/24</main-classification>
        <further-classification edition="202501120260302B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇英陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種發光裝置，包括：基底、第一表面電極、第二表面電極、第一發光元件、第二發光元件、以及第一導電連接件。第一表面電極以及第二表面電極位於基底上。第一發光元件設置於基底上且電性連接第一表面電極，並具有第一最高表面。第二發光元件設置於基底上且電性連接第二表面電極，並具有第二最高表面。第一導電連接件包括金屬疊層及第三最高表面，並電性連接該第一表面電極與該第一發光元件。第一導電連接件的第三最高表面不低於第二發光元件的第二最高表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device is provided. The light-emitting device includes a substrate, a first surface electrode, a second surface electrode, a first light-emitting element, a second light-emitting element, and a first conductive connector. The first surface electrode and the second surface electrode are arranged on the substrate. The first light-emitting element is disposed on the substrate and electrically connected to the first surface electrode, and has a first topmost surface. The second light-emitting element is disposed on the substrate and electrically connected to the second surface electrode, and has a second topmost surface. A first conductive connector has a metal stack and a third topmost surface, and electrically connect the first surface electrode and the first light-emitting element. The third topmost surface of the first conductive connector is not lower than the second topmost surface of the second light-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">102:基底</p>
        <p type="p">104-1:背面電極</p>
        <p type="p">104-2:背面電極</p>
        <p type="p">106-1:發光元件</p>
        <p type="p">106-2:發光元件</p>
        <p type="p">106-3:發光元件</p>
        <p type="p">108-1:表面電極</p>
        <p type="p">108-2:表面電極</p>
        <p type="p">108-3:表面電極</p>
        <p type="p">110-1:下凸塊</p>
        <p type="p">110-2:下凸塊</p>
        <p type="p">110-3:下凸塊</p>
        <p type="p">112-1:下電極</p>
        <p type="p">112-2:下電極</p>
        <p type="p">112-3:下電極</p>
        <p type="p">114:金屬疊層</p>
        <p type="p">116:上電極</p>
        <p type="p">118:下電極</p>
        <p type="p">120:凸塊</p>
        <p type="p">122:封裝材料</p>
        <p type="p">HS1:最高表面</p>
        <p type="p">HS2:最高表面</p>
        <p type="p">HS3:最高表面</p>
        <p type="p">HS4:最高表面</p>
        <p type="p">LS1:最低表面</p>
        <p type="p">LS4:最低表面</p>
        <p type="p">G1:部分</p>
        <p type="p">G2:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="469" publication-number="202632681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乳癌術後評估以人工智慧輔助進行治療或復原效果分析系統及其方法</chinese-title>
        <english-title>AI-ASSISTED THERAPY/RECOVERY-EFFECT ANALYZING SYSTEM AND METHOD THEREOF FOR BREAST CANCER POST-SURGERY ASSESSMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250228B">G16H50/20</main-classification>
        <further-classification edition="201801120250228B">G16H50/70</further-classification>
        <further-classification edition="201801120250228B">G16H30/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乳癌術後評估以人工智慧輔助進行治療或復原效果分析方法包含：於數個乳癌術前掃描個案影像及數個乳癌術後掃描個案影像偵測一乳癌手術區，以便取得一乳癌術後追蹤區域；於該乳癌術後追蹤區域進行一復發或轉移評估作業，以便獲得一已評估乳癌術後個案資料；提供至少一待評估乳癌術後資料；將該已評估乳癌術後個案資料對應於該待評估乳癌術後資料；及將該已評估乳癌術後資料及待評估乳癌術後資料結合數個乳癌指數參數以數個人工智慧運算工具進行人工智慧運算，以便獲得數個乳癌術後評估結果資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An AI-assisted therapy/recovery-effect analyzing method includes: detecting a surgery region in breast-cancer scan pre-surgery images and breast cancer post-surgery images to obtain a post-surgery tracking region; processing a recurrence or transfer assessment procedure to the post-surgery tracking region to obtain a case-assessed post-surgery data; providing an unknown breast-cancer post-surgery data; correspondingly connecting the unknown breast-cancer post-surgery data with the case-assessed post-surgery data; operating an AI computing tool the unknown breast-cancer post-surgery data and the case-assessed post-surgery data which are combined with a plurality of breast-cancer feature data to obtain a plurality of result and analysis data of breast-cancer post-surgery assessment data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸入單元</p>
        <p type="p">10:待評估乳癌術後資料</p>
        <p type="p">2:AI計算單元</p>
        <p type="p">20:人工智慧運算工具</p>
        <p type="p">21:乳癌術前掃描個案影像資料庫</p>
        <p type="p">22:乳癌術後掃描個案影像資料庫</p>
        <p type="p">23:已評估乳癌術後個案資料庫</p>
        <p type="p">3:輸出單元</p>
        <p type="p">30:乳癌術後評估結果資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="470" publication-number="202633231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊傳輸系統</chinese-title>
        <english-title>INFORMATION TRANSMISSION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10H29/24</main-classification>
        <further-classification edition="202501120260302B">H10H29/851</further-classification>
        <further-classification edition="201301120260302B">H04B10/25</further-classification>
        <further-classification edition="200601120260302B">G02B6/293</further-classification>
        <further-classification edition="200601120260302B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資訊傳輸系統包含一或多個發光結構，發光結構包含多個發光單元並發出具有不同的峰值波長的複數光訊號。資訊傳輸系統更包含導光結構，導光結構具有入口及出口。入口與多個發光單元耦合。資訊傳輸系統更包含一或多個收光結構，收光結構包含多個收光單元並與出口耦合以分別接收複數光訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An information transmission system includes one or more light-emitting structures including multiple light-emitting units that emit multiple photo signals with different peak wavelengths. The information transmission system further includes a light-guiding structure that has an entrance and an exit. The entrance is coupled to the multiple light-emitting units. The information transmission system further includes one or more light-receiving structures including multiple light-receiving units coupled to the exit to respectively receive the multiple photo signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊傳輸系統</p>
        <p type="p">11:第一承載結構</p>
        <p type="p">12:第二承載結構</p>
        <p type="p">20S:發光結構</p>
        <p type="p">30:導光結構</p>
        <p type="p">30I:入口</p>
        <p type="p">30O:出口</p>
        <p type="p">40S:收光結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="471" publication-number="202633069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊峻昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏宏諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置及其形成方法。半導體裝置包括基板、接觸墊、第一導電層、介電層、第二導電層、第一接觸物及隔離件。基板包括記憶體陣列區及相鄰於記憶體陣列區的周邊區。接觸墊設置在基板上。第一導電層設置在接觸墊上，且設置於記憶體陣列區中。介電層設置在第一導電層上，且設置於記憶體陣列區及周邊區中。第二導電層設置在介電層上，且設置於記憶體陣列區及周邊區中。第一接觸物設置於周邊區中，且與在周邊區中的接觸墊電性連接。隔離件設置於周邊區中，且設置於第二導電層及第一接觸物之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a formation method thereof are provided. The semiconductor device includes a substrate, a contact pad, a first conductive layer, a dielectric layer, a second conductive layer, a first contact, and isolation element. The substrate includes a memory cell array area and a peripheral area adjacent to the memory cell array area. The contact pad is disposed on the substrate. The first conductive layer is disposed on the contact pad and in the memory cell array area. The dielectric layer is disposed on the first conductive layer and in the memory cell array area and the peripheral area. The second conductive layer is disposed on the dielectric layer and in the memory cell array area and the peripheral area. The first contact is disposed in the peripheral area and is electrically connected to the contact pad in the peripheral area. The isolation element is disposed in the peripheral area and disposed between the second conductive layer and the first contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:基板</p>
        <p type="p">12:接觸墊</p>
        <p type="p">14:絕緣層</p>
        <p type="p">20,24:導電層</p>
        <p type="p">22:介電層</p>
        <p type="p">30:平坦化層</p>
        <p type="p">40:隔離件</p>
        <p type="p">50:第一接觸物</p>
        <p type="p">52,72:襯層</p>
        <p type="p">54,74:導電柱</p>
        <p type="p">70:第二接觸物</p>
        <p type="p">CA:記憶體陣列區</p>
        <p type="p">CS:電容器結構</p>
        <p type="p">PA:周邊區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="472" publication-number="202632211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高架地板之地板單元的改良型測量裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250619B">G01B5/02</main-classification>
        <further-classification edition="200601120250619B">E04F15/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠亞工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERO VERIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-TEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳善杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAN HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敬恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃長發</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高架地板之地板單元的改良型測量裝置及方法，該裝置包括：一第一平台；一夾持機構，設於第一平台上，將一地板單元夾持在第一平台上；夾持機構具有一前側定位結構及一左側定位結構以界定相互垂直的一前基準線及一左基準線；第一邊長測量器至第六邊長測量器，位於同一平面，並佈設在地板單元的左側、後側及右側；一邊長測量手段及一正方度測量手段，可分別透過夾持機構以不同的夾持方式測量地板單元的邊長及正方度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:高架地板之地板單元的改良型測量裝置</p>
        <p type="p">1:第一平台</p>
        <p type="p">2:夾持機構</p>
        <p type="p">211:前側固定滾輪座</p>
        <p type="p">221:左側固定滾輪座</p>
        <p type="p">23:後側推動機構</p>
        <p type="p">231:後側滑動滾輪座</p>
        <p type="p">24:右側推動機構</p>
        <p type="p">241:右側滑動滾輪座</p>
        <p type="p">31:第一邊長測量器</p>
        <p type="p">32:第二邊長測量器</p>
        <p type="p">33:第三邊長測量器</p>
        <p type="p">34:第四邊長測量器</p>
        <p type="p">35:第五邊長測量器</p>
        <p type="p">36:第六邊長測量器</p>
        <p type="p">101:地板單元</p>
        <p type="p">1011:前側邊緣</p>
        <p type="p">1012:左側邊緣</p>
        <p type="p">1013:後側邊緣</p>
        <p type="p">1014:右側邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="473" publication-number="202632213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高架地板之地板單元的邊長測量裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">G01B5/04</main-classification>
        <further-classification edition="200601120250314B">E04F15/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠亞工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERO VERIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-TEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳善杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAN HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敬恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃長發</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高架地板之地板單元的邊長測量裝置及方法，該裝置包括：一第一平台；一夾持機構，設於第一平台上，將一地板單元夾持在第一平台上；夾持機構具有一前側定位結構及一左側定位結構以界定相互垂直的一前基準線及一左基準線；第三邊長測量器至第六邊長測量器，位於同一平面，並佈設在地板單元的後側及右側；一邊長測量手段，依據該第三邊長測量器至第六邊長測量器的測量結果取得該地板單元的前側邊緣、左側邊緣、後側邊緣及右側邊緣的長度，可更精確的測量地板單元的邊長。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:高架地板之地板單元的邊長測量裝置</p>
        <p type="p">1:第一平台</p>
        <p type="p">2:夾持機構</p>
        <p type="p">211:前側固定滾輪座</p>
        <p type="p">221:左側固定滾輪座</p>
        <p type="p">23:後側推動機構</p>
        <p type="p">231:後側滑動滾輪座</p>
        <p type="p">24:右側推動機構</p>
        <p type="p">241:右側滑動滾輪座</p>
        <p type="p">33:第三邊長測量器</p>
        <p type="p">34:第四邊長測量器</p>
        <p type="p">35:第五邊長測量器</p>
        <p type="p">36:第六邊長測量器</p>
        <p type="p">101:地板單元</p>
        <p type="p">1011:前側邊緣</p>
        <p type="p">1012:左側邊緣</p>
        <p type="p">1013:後側邊緣</p>
        <p type="p">1014:右側邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="474" publication-number="202632212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高架地板之地板單元的四腳高測量裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">G01B5/02</main-classification>
        <further-classification edition="200601120250331B">E04F15/024</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠亞工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERO VERIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-TEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳善杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAN HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敬恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃長發</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高架地板之地板單元的四腳高測量裝置及方法，該裝置包括：一第一平台；四腳高測量器，設置於該第一平台的四角落的上方，測量該地板單元的四角落的腳高，以取得四腳高測量數值；一腳高測量手段，依據該四腳高測量器的測量結果取得該地板單元的四角落的腳高。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:高架地板之地板單元的四腳高測量裝置</p>
        <p type="p">1:第一平台</p>
        <p type="p">41:腳高測量器</p>
        <p type="p">44:擺動氣壓缸</p>
        <p type="p">101:地板單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="475" publication-number="202631484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採樣管自動開關蓋設備</chinese-title>
        <english-title>AUTOMATIC CAPPING AND DECAPPING EQUIPMENT FOR SAMPLING TUBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">B67B7/14</main-classification>
        <further-classification edition="200601120250324B">B67B7/18</further-classification>
        <further-classification edition="200601120250324B">B67B3/20</further-classification>
        <further-classification edition="200601120250324B">B25J19/02</further-classification>
        <further-classification edition="200601120250324B">G01N1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林洺樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種採樣管自動開關蓋設備包含基座、複數個夾件及至少一驅動裝置。複數個夾件平行於基座的縱軸，且環繞縱軸對稱設置於基座下方，每一複數個夾件包含上下設置的第一夾部及第二夾部。驅動裝置控制基座及複數個夾件的移動，其中複數個夾件的複數個第一夾部架構為共同環繞夾持第一採樣管之第一管蓋，以進行第一管蓋與第一採樣管之第一管身的分離與結合，且複數個夾件的複數個第二夾部架構為共同環繞夾持第二採樣管之第二管蓋，以進行第二管蓋與第二採樣管之第二管身的分離與結合。且第一管蓋與第二管蓋具有不同的高度及/或硬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic capping and decapping equipment for sampling tube includes a base, plural clipping elements and at least one driving device. Plural clapping elements are parallel to a longitudinal axis of the base and symmetrically arranged around the longitudinal axis and under the base. Each clipping element includes an upper first clipping portion and a second lower clipping portion. The driving device controls movements of the base and plural clipping elements. Plural first clipping portions collectively clip a first cap of a first sampling tube for performing capping and decapping procedures of the first sampling tube. Plural second clipping portions collectively clip a second cap of a second sampling tube for performing capping and decapping procedures of the second sampling tube. The first cap and the second cap have different heights and/or hardness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基座</p>
        <p type="p">111:擋板</p>
        <p type="p">12:複數個夾件</p>
        <p type="p">121:第一夾部</p>
        <p type="p">1211:接觸面</p>
        <p type="p">122:第二夾部</p>
        <p type="p">123:段差</p>
        <p type="p">1221:接觸面</p>
        <p type="p">1222:凸出部</p>
        <p type="p">1223:緣部</p>
        <p type="p">1224:凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="476" publication-number="202631257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>採樣管架</chinese-title>
        <english-title>SAMPLING TUBE RACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">B01L9/06</main-classification>
        <further-classification edition="200601120250602B">B01L3/00</further-classification>
        <further-classification edition="200601120250602B">G01N1/02</further-classification>
        <further-classification edition="200601120250602B">G01N35/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種採樣管架，包含採樣管支撐座、採樣管定位座及採樣管固定墊。採樣管定位座設置於採樣管支撐座上，具有複數個第一穿孔及由複數個第一穿孔的周緣向上延伸的複數個環繞凸部，當複數個採樣管穿設於複數個第一穿孔而放置於採樣管架上時，複數個採樣管之複數個管蓋的下緣抵頂於複數個環繞凸部的頂面。採樣管固定墊設置於採樣管定位座與採樣管支撐座之間，具有分別對應於複數個第一穿孔的複數個第二穿孔，且每一第二穿孔的直徑小於每一第一穿孔的直徑，其中每一第二穿孔的外圍設有複數個干涉件，以容設不同直徑的複數個採樣管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sampling tube rack includes a sampling tube supporting seat, a sampling tube positioning seat, and a sampling tube fixing pad. The sampling tube positioning seat is disposed on the sampling tube supporting seat and includes a plurality of first through holes and a plurality of surrounding protrusions extended upwardly from peripherals of the plurality of first through holes. When a plurality of sampling tubes are penetrated through the plurality of first through holes and placed on the sampling tube rack, lower edges of a plurality of caps of the plurality of sampling tubes abut on top surfaces of the plurality of surrounding protrusions. The sampling tube fixing pad is disposed between the sampling tube positioning seat and the sampling tube supporting seat, and includes a plurality of second through holes corresponding to the plurality of first through holes. A diameter of each of the second through holes is smaller than a diameter of each of the first through holes. A plurality of interference pieces are provided on the periphery of each of the second through hole to accommodate the plurality of sampling tubes with different diameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:採樣管架</p>
        <p type="p">30a、30b、30c:採樣管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="477" publication-number="202633237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其製造方法</chinese-title>
        <english-title>DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H29/851</main-classification>
        <further-classification edition="202601120260302B">H10H29/24</further-classification>
        <further-classification edition="202501120260302B">H10H20/814</further-classification>
        <further-classification edition="202501120260302B">H10H20/831</further-classification>
        <further-classification edition="202501120260302B">H10H20/822</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, ZHEN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭夏情</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮輝慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, HUI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任益華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENN, YIH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種顯示裝置及其製造方法。顯示裝置包括波長轉換模組及發光模組。波長轉換模組包括第一波長轉換層、第二波長轉換層及導電結構。第一波長轉換層具有第一下表面。導電結構具有相連的第一部份及第二部份，第一部份位於第一波長轉換層與第二波長轉換層之間。第一部份具有第二下表面，且第一下表面與第二下表面共平面。發光模組位於波長轉換模組上並暴露第二部份，其中發光模組包括第一半導體層、第一發光層及第二發光層。第一發光層及第二發光層位於第一半導體層上並分別覆蓋第一波長轉換層及第二波長轉換層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and a manufacturing method thereof are provided. The display device includes a wavelength-conversion module and a light-emitting module. The wavelength-conversion module includes a first wavelength-conversion layer, a second wavelength-conversion layer, and a conductive structure. The first wavelength-conversion layer has a first lower surface. The conductive structure has a first part and a second part connected to each other, and the first part is arranged between the first wavelength-conversion layer and the second wavelength-conversion layer. The first part has a second lower surface, and the first lower surface and the second lower surface are coplanar. The light-emitting module is placed on the wavelength-conversion module and exposes the second part. The light-emitting module includes a first semiconductor layer, a first light-emitting layer, and a second light-emitting layer. The first light-emitting layer and the second light-emitting layer are arranged on the first semiconductor layer, and cover the first wavelength-conversion layer and the second wavelength-conversion layer, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:顯示裝置</p>
        <p type="p">10:波長轉換模組</p>
        <p type="p">100:第一波長轉換層</p>
        <p type="p">100B:第一下表面</p>
        <p type="p">101:第二波長轉換層</p>
        <p type="p">102:第三波長轉換層</p>
        <p type="p">1031:第一部份</p>
        <p type="p">1031B:第二下表面</p>
        <p type="p">104:封裝層</p>
        <p type="p">105:第一透光層</p>
        <p type="p">106:透光基板</p>
        <p type="p">11:發光模組</p>
        <p type="p">110:第一半導體層</p>
        <p type="p">111:第一發光層</p>
        <p type="p">112:第二發光層</p>
        <p type="p">113:第三發光層</p>
        <p type="p">114:第二半導體層</p>
        <p type="p">115:第一電極</p>
        <p type="p">116:第二透光層</p>
        <p type="p">117:絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="478" publication-number="202632134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動窗簾、電動窗簾系統與窗簾對齊方法</chinese-title>
        <english-title>ELECTRIC WINDOW COVERING, ELECTRIC WINDOW COVERING SYSTEM AND WINDOW COVERING ALIGNMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">E06B9/68</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億豐綜合工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEN MADE ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祐毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YOU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐士為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種第一電動窗簾。第一電動窗簾包括上梁、下梁、下梁驅動總成、控制裝置以及電力供應單元。下梁設置在上梁的下方，且可受下梁驅動總成的驅動以相對於上梁以及於下梁上限位及下梁下限位之間移動。第一電動窗簾的控制裝置收到特定遠端控制指令後，發送第一對齊封包給第二電動窗簾，且接收第二電動窗簾的第二對齊封包，並根據第一對齊封包與第二對齊封包控制下梁驅動總成以對下梁進行對齊，其中第一對齊封包至少包括第一電動窗簾的下梁停止時的下梁目前位置之資訊，以及該二對齊封包至少包括第二電動窗簾的下梁停止時的下梁目前位置之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first electric window covering is disclosed. The first electric window covering includes an upper beam, a lower beam, a lower beam drive assembly, a control device and a power supply unit. The lower beam is arranged below the upper beam and can be driven by the lower beam driving assembly to move relative to the upper beam and between a lower beam upper limit position and a lower beam lower limit position. After receiving a specific remote control command, the control device of the first electric window covering will send the a alignment packet to a second electric window covering, receive a second alignment packet of the second electric window covering, and control a lower beam drive assembly to align the lower beam according to the first alignment packet and the second alignment packet, wherein the first alignment packet at least includes information of a current lower beam position when the lower beam of the first electric window covering is stopped or still, and the second alignment packet at least includes information of a current lower beam position when a lower beam of the second electric window covering is stopped or still.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:第一電動窗簾</p>
        <p type="p">1B:第二電動窗簾</p>
        <p type="p">10A、10B:上梁</p>
        <p type="p">11A、11B:簾體</p>
        <p type="p">12、12A、12B:下梁</p>
        <p type="p">Y1、Y2、Y3:位置</p>
        <p type="p">P1:下梁上限位的高度位置</p>
        <p type="p">P2:下梁下限位的高度位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="479" publication-number="202632358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光傳輸組件及光模組</chinese-title>
        <english-title>OPTICAL TRANSMISSION ASSEMBLY AND OPTICAL MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02B6/44</main-classification>
        <further-classification edition="200601120250801B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬維京群島商祥茂光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIME WORLD INTERNATIONAL HOLDINGS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>VG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉哲守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHE-SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔令安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, LING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴明佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, MING-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐璿宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIU, HSUAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光傳輸組件及光模組。所述光模組包含殼體、基座、光有源件、光纖連接器、光纖以及密封件。基座位於殼體內。光有源件耦接於基座。光纖連接器耦接於殼體。光纖包含一第一端部以及一第二端部。第一端部光耦接於光有源件。第二端部耦接於光纖連接器。密封件位於殼體內。光纖的第二端部密封於密封件內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical transmission assembly and an optical module. The optical module includes a housing, a baseplate, an optical active device, an optical fiber connector, an optical fiber, and a sealing component. The baseplate is disposed in the housing. The optical active device is coupled to the baseplate. The optical fiber connector is coupled to the housing. The optical fiber includes a first end portion and a second end portion. The first end portion is optically coupled to the optical active device. The second end portion is coupled to the optical fiber connector. The sealing component is disposed in the housing. The second end portion of the optical fiber is sealed in the sealing component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光模組</p>
        <p type="p">110:殼體</p>
        <p type="p">110a:上殼件</p>
        <p type="p">110b:下殼件</p>
        <p type="p">120:光傳輸組件</p>
        <p type="p">121:基座</p>
        <p type="p">122:光有源件</p>
        <p type="p">123:光纖連接器</p>
        <p type="p">124:光纖</p>
        <p type="p">125:密封件</p>
        <p type="p">125a:上蓋</p>
        <p type="p">125b:下蓋</p>
        <p type="p">D1:縱向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="480" publication-number="202631087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具冷卻裝置之質子束能量調整降能器</chinese-title>
        <english-title>PROTON BEAM ENERGY ADJUSTMENT DEGRADER WITH COOLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250418B">A61B6/58</main-classification>
        <further-classification edition="202401120250418B">A61B6/40</further-classification>
        <further-classification edition="200601120250418B">A61N5/10</further-classification>
        <further-classification edition="200601120250418B">A61N5/01</further-classification>
        <further-classification edition="200601120250418B">G21K1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許怡儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聰得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO-SIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具冷卻裝置之質子束能量調整降能器，其包含轉動驅動部、基座、冷卻裝置部、冷卻液循環機以及降能驅動部。基座包含本體、第一傳動件及第二傳動件，第一傳動件連接於第一馬達件，第二傳動件連接於第二馬達件。冷卻裝置部包含旋轉輸入接頭、第一轉動件、冷卻板、架體及旋轉輸出接頭，第一轉動件連接第一傳動件且穿設於旋轉輸入接頭，冷卻板的一端連接第一轉動件，冷卻板的另一端穿設於旋轉輸出接頭。冷卻液通過輸入管道輸入冷卻板並由輸出管道輸出。降能薄膜件捲繞設置於冷卻板以形成質子穿透部，將質子束由第一能量降低為第二能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A proton beam energy adjustment degrader with cooling device is disclosed, which includes a rotation drive part, a base, a cooling part, a coolant circulation machine and a de-energizing driving part. The base includes a body, a first transmission component and a second transmission component. The first transmission component is connected to the first motor component and the second transmission component is connected to the second motor component. The cooling part includes a rotary input joint, a first rotary part, a cooling plate, a frame and a rotary output joint. The first rotary part is connected to the first transmission component and penetrates the rotary input joint. One end of the cooling plate is connected to the first rotary member. The other end of the cooling plate is disposed through the rotary output joint. The coolant is fed into the cooling plate through an inlet pipe and output through an outlet pipe. The de-energizing film is wound around the cooling plate to form a proton penetration portion to reduce the proton beam from the first energy to the second energy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具冷卻裝置之質子束能量調整降能器</p>
        <p type="p">10:轉動驅動部</p>
        <p type="p">12:第一馬達件</p>
        <p type="p">14:第二馬達件</p>
        <p type="p">20:基座</p>
        <p type="p">21:本體</p>
        <p type="p">22:第一傳動件</p>
        <p type="p">24:第二傳動件</p>
        <p type="p">30:冷卻裝置部</p>
        <p type="p">31:旋轉輸入接頭</p>
        <p type="p">32:第一轉動件</p>
        <p type="p">33:冷卻板</p>
        <p type="p">331:框體</p>
        <p type="p">332:貫穿開口</p>
        <p type="p">34:架體</p>
        <p type="p">35:旋轉輸出接頭</p>
        <p type="p">40:冷卻液循環機</p>
        <p type="p">41:輸入管道</p>
        <p type="p">42:輸出管道</p>
        <p type="p">50:降能驅動部</p>
        <p type="p">51:第二轉動件</p>
        <p type="p">52:降能薄膜件</p>
        <p type="p">53:輔助桿件</p>
        <p type="p">90:質子束發射器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="481" publication-number="202632674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>注意力不足過動症評估系統</chinese-title>
        <english-title>ATTENTION DEFICIT HYPERACTIVITY DISORDER ASSESSMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">G16H10/60</main-classification>
        <further-classification edition="201801120250303B">G16H50/30</further-classification>
        <further-classification edition="200601120250303B">A61B5/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義守大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I-SHOU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳榮慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, RONG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林龍昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LUNG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽振森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUYANG, CHEN-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊瑞成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, REI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種注意力不足過動症評估系統，用以解決習知注意力不足過動症診斷方法容易誤判及操作困難的問題。係包含：一紅外線感測單元，由上往正下方擷取一受測者之一熱影像，並記錄該熱影像之像素點的數個測量值；及一處理模組，耦合連接該紅外線感測單元，以接收多次偵測的數個該熱影像及其數個測量值，該處理模組在各該熱影像中辨識該受測者，並依據該受測者位置在各該熱影像選取數個區塊，再將各該區塊內的數個該測量值平均為一區塊溫度，該處理模組依據連續多次偵測的數個該區塊溫度計算一總變化量。藉此可以達成輔助診斷及提升準確率的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An attention deficit hyperactivity disorder assessment system is provided to solve the problems of misdiagnosis and difficulty in operation of conventional ADHD diagnostic method. The assessment system includes an infrared sensing component that captures a thermal image of a patient from top to bottom, and a processing module coupled to the infrared sensing component. The infrared sensing component records a plurality of measurement values of the pixels of the thermal image. The processing module receives a plurality of thermal images and their measurement values detected multiple times. The processing module identifies the patient in each thermal image and selects a plurality of blocks in each thermal image according to the position of the patient, and then averages the plurality of measurement valus in each block into a block temperature. The processing module calculates a total cariation according to the plurality of block temperatures detected continuously for multiple times. The assessment system provides the effect of assisting diagnosis and improving accuracy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紅外線感測單元</p>
        <p type="p">2:處理模組</p>
        <p type="p">C:測量值</p>
        <p type="p">T:熱影像</p>
        <p type="p">P:受測者</p>
        <p type="p">V:總變化量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="482" publication-number="202631328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方便操作的棘輪扳手</chinese-title>
        <english-title>EASY OPERATION RATCHET WRENCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250527B">B25B13/46</main-classification>
        <further-classification edition="200601120250527B">B25B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻安國際興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG ANN TOOL INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇政維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明方便操作的棘輪扳手包括有一個本體、一個棘輪頭及一個操作桿，本體的一端沿虛擬的一個轉軸軸向設置有一個容置槽且另一端設置有一個連接部，棘輪頭能夠以轉軸為中心轉動地設置於容置槽內，操作桿連接於連接部，操作桿貫穿地設置有一個操作孔，操作孔沿其徑向的寬度形成一個操作寬度，操作寬度大於1釐米，使操作孔可供手指穿過，棘輪扳手透過上述結構能夠供使用者方便操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention, an easy operation ratchet wrench, includes a body, a ratchet head, and an operating lever. One end of the body is provided with a receiving groove along the axial direction of a virtual rotating shaft, and the other end is provided with a connecting portion. The ratchet head is rotatably disposed within the receiving groove with the rotating shaft as its center. The operating lever is connected to the connecting portion and is provided with an operating hole extending through it. The operating hole has an operating width formed along its radial direction, where the operating width is greater than 1 cm, allowing a finger to pass through the operating hole. With the aforementioned structure, the ratchet wrench enables convenient operation for a user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:棘輪扳手</p>
        <p type="p">20:本體</p>
        <p type="p">30:棘輪頭</p>
        <p type="p">40:操作桿</p>
        <p type="p">41:操作孔</p>
        <p type="p">42:凸耳</p>
        <p type="p">43:插銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="483" publication-number="202631520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高熵電極材料及使用其降解氨的方法</chinese-title>
        <english-title>HIGH ENTROPY ELECTRODE MATERIAL AND METHOD FOR DEGRADING AMMONIA USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250501B">C02F1/461</main-classification>
        <further-classification edition="202101120250501B">C25B11/052</further-classification>
        <further-classification edition="202101120250501B">C25B11/091</further-classification>
        <further-classification edition="201101120250501B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪緯璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余美齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電極材料及使用其降解氨的方法，其中，電極材料包含：一基板；以及一塗層，設置於該基板上，其中，該塗層包含一高熵陶瓷奈米材料，且該高熵陶瓷奈米材料包含Fe、Co、Ni、Cu及Mn之金屬的氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode material and a method for degrading ammonia using the same are provided. The electrode material comprises: a substrate; and a coating layer disposed on the substrate, wherein the coating layer comprises a high-entropy nanomaterial, and the high-entropy nanomaterial is a metal oxide comprises Fe, Co, Ni, Cu and Mn.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="484" publication-number="202632789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>插座連接器與插頭連接器及電連接裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250314B">H01R12/72</main-classification>
        <further-classification edition="200601120250314B">H01R13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　英康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOH, ENG-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　正佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHEN-YEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種插座連接器與插頭連接器及電連接裝置。該插座連接器包含一個金屬殼、一個絕緣座，以及一個插座端子總成。該絕緣座設置在該金屬殼中，呈環狀並包括一個插座口。該插座端子總成設置在該絕緣座中，並包括兩個端子座、一個設置在該兩個端子座間的防護座，以及兩個分別裝設在該兩個端子座的插座端子組。該防護座與該兩個插座端子組彼此間隔。每一該插座端子組朝該插座口延伸但不突出該防護座。該插座連接器具有可避免該兩個插座端子組因被撞擊而損壞的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:插座連接器</p>
        <p type="p">131:金屬殼</p>
        <p type="p">132:絕緣座</p>
        <p type="p">14:插座端子總成</p>
        <p type="p">2:端子座</p>
        <p type="p">3:防護座</p>
        <p type="p">31:座腳部</p>
        <p type="p">32:基座部</p>
        <p type="p">322:底面</p>
        <p type="p">321:斜面</p>
        <p type="p">33:突緣部</p>
        <p type="p">331:側座面</p>
        <p type="p">332:曲面</p>
        <p type="p">332a:曲面緣</p>
        <p type="p">5:插座端子組</p>
        <p type="p">51:固定部</p>
        <p type="p">52:接觸部</p>
        <p type="p">521:末端</p>
        <p type="p">53:焊接部</p>
        <p type="p">9:電路板</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">O1:插座口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="485" publication-number="202632798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250212B">H01R13/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊喆元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHE-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器裝置，設置於一基板，供一可插拔組件插接。該連接器裝置包含一插座組件及一散熱組件。該插座組件包括多個籠殼，及多個連接器。該散熱組件包括一液冷板，該液冷板包括一設置於該基板的主體部，及與該主體部一體製成的多個懸臂部，該多個懸臂部的底部分別伸入該等籠殼的頂部開口。其中一種該液冷板還包括設置在該多個懸臂部的一液冷管，該液冷管接觸插入該插座組件之該可插拔組件的頂面。其中另一種該液冷板的該主體部內形成供冷卻液流通的多個通道，該多個懸臂部為實心的散熱板片，該懸臂部的該底部接觸插入該插座組件之該可插拔組件的頂面。藉由上述散熱組件的結構設計，確可具有較佳導熱及防冷卻液洩漏的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱組件</p>
        <p type="p">2:液冷板</p>
        <p type="p">21:主體部</p>
        <p type="p">22:懸臂部</p>
        <p type="p">3:液冷管</p>
        <p type="p">31:主管部</p>
        <p type="p">311:彎管段</p>
        <p type="p">312:連接管段</p>
        <p type="p">32:入口端</p>
        <p type="p">33:出口端</p>
        <p type="p">4:插座組件</p>
        <p type="p">41:插槽</p>
        <p type="p">411:槽口</p>
        <p type="p">42:籠殼</p>
        <p type="p">7:基板</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="486" publication-number="202632803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器框體集合裝置、連接器總成及連接器框體集合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250212B">H01R13/502</main-classification>
        <further-classification edition="200601120250212B">H01R13/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊喆元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHE-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器框體集合裝置，包含一片形金屬沖壓後折成的一集合外框，以及多個金屬隔片。該集合外框的一頂壁與一底壁分別設有多排且每排多個在垂直方向同一平面的定位部。每一該金屬隔片的兩相對外側沖壓形成對應所述定位部的多個固定件，該多個金屬隔片一一插置於該集合外框的該頂壁與該底壁之間，使每一該金屬隔片的固定件分別與該頂壁與該底壁的各排該定位部干涉定位，該集合外框與該多個金屬隔片圍成多個插接框體空間。其中，每一該插接框體空間上的該頂壁處各自設有一散熱口、對應於該散熱口的該底壁處設有排列對稱的多個彈性部，及沿一插接方向設有連通該插接框體空間的一插接口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器框體集合裝置</p>
        <p type="p">11:集合外框</p>
        <p type="p">111:第一接合部</p>
        <p type="p">111a:鳩尾凹部</p>
        <p type="p">112:第一側壁</p>
        <p type="p">113:頂壁</p>
        <p type="p">113a:定位部</p>
        <p type="p">113b:散熱口</p>
        <p type="p">114:第二側壁</p>
        <p type="p">115:底壁</p>
        <p type="p">115a:定位部</p>
        <p type="p">115b:彈性單元</p>
        <p type="p">115c:彈性部</p>
        <p type="p">116:第二接合部</p>
        <p type="p">116a:鳩尾凸部</p>
        <p type="p">118:第三接合部</p>
        <p type="p">118a:鳩尾凹部</p>
        <p type="p">119:第四接合部</p>
        <p type="p">119a:鳩尾凸部</p>
        <p type="p">12:金屬隔片</p>
        <p type="p">121:固定件</p>
        <p type="p">13:接地屏蔽件</p>
        <p type="p">131:前連接部</p>
        <p type="p">132:接地彈性指部</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="487" publication-number="202632816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250212B">H01R13/6583</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許坤霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接裝置，包含可壓縮變形的導熱墊、連接器組件及保護結構。連接器組件包括屏蔽罩。屏蔽罩界定出第一插接通道並具有底壁及壓抵結構。第一插接通道具有供可插拔模組插入的第一通道開口。底壁形成供導熱墊穿入至第一插接通道的底部開孔。保護結構包括設置於底壁且位於第一通道開口與底部開孔之間的第一彈性保護件。在可插拔模組插入第一插接通道的過程中，可插拔模組受到第一彈性保護件支撐使可插拔模組的發熱面與導熱墊保持間隙，接著可插拔模組的背表面受到壓抵結構壓抵而使第一彈性保護件彈性變形，並使發熱面靠向至貼合導熱墊，藉此，能讓導熱墊的表面與可插拔模組的發熱面無間隙地貼合，進而達到散熱性提升的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:機殼</p>
        <p type="p">101:凹槽</p>
        <p type="p">200:可插拔模組</p>
        <p type="p">203:發熱面</p>
        <p type="p">204:背表面</p>
        <p type="p">300:導熱墊</p>
        <p type="p">400:電路板</p>
        <p type="p">401:板開孔</p>
        <p type="p">500:連接器組件</p>
        <p type="p">1:插座連接器</p>
        <p type="p">11:上部插座</p>
        <p type="p">12:下部插座</p>
        <p type="p">2:屏蔽罩</p>
        <p type="p">21:底壁</p>
        <p type="p">211:底部開孔</p>
        <p type="p">22:側壁</p>
        <p type="p">23:後壁</p>
        <p type="p">24:頂壁</p>
        <p type="p">3:接地件</p>
        <p type="p">4:壓抵單元</p>
        <p type="p">41:壓抵結構</p>
        <p type="p">41a:彈性結構</p>
        <p type="p">411a:板件</p>
        <p type="p">412a:彈性壓抵件</p>
        <p type="p">41b:抬升面結構</p>
        <p type="p">414:散熱空間</p>
        <p type="p">42:通風座</p>
        <p type="p">421:透氣孔</p>
        <p type="p">5:第一插接通道</p>
        <p type="p">51:第一通道開口</p>
        <p type="p">6:第二插接通道</p>
        <p type="p">61:第二通道開口</p>
        <p type="p">600:保護結構</p>
        <p type="p">601:第一彈性保護件</p>
        <p type="p">602:第二彈性保護件</p>
        <p type="p">X:前後方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="488" publication-number="202631888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板</chinese-title>
        <english-title>CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L79/08</main-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">G06F3/044</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
        <further-classification edition="202301120260302B">H10K77/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義隆電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦維良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, WEI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板，用於提供一觸控控制器與一電容式觸控感應器之間的信號傳輸路徑，該電容式觸控感應器包括N個第一電極依序沿著第一方向排列，以及M個第二電極依序沿著第二方向排列，該電路板包括一第一導體層、一第二導體層及一第三導體層。該第一導體層包括平行且等距排列的N條第一走線，該N條第一走線用於分別耦接該N個第一電極。該第二導體層包括平行且等距排列的M條第二走線，該M條第二走線用於分別耦接該M個第二電極。該第三導體層接地且位在該第一導體層與第二導體層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board is used for providing a signal transmission path between a touch controller and a capacitive touch sensor. The capacitive touch sensor includes N first electrodes which are arranged sequentially along the first direction and M second electrodes which are arranged sequentially along the second direction. The circuit board includes a first conductor layer, a second conductor layer and a third conductor layer. The first conductor layer includes N first traces arranged in parallel and equidistant directions, and the N first traces are coupled to the N first electrodes. The second conductor layer includes M second traces arranged in parallel and equidistant directions, and the M second traces are coupled to the M second electrodes. The third conductor layer is grounded and located between the first conductor layer and the second conductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電路板</p>
        <p type="p">2002:導體層</p>
        <p type="p">2004:介電層</p>
        <p type="p">2006:導體層</p>
        <p type="p">2008:介電層</p>
        <p type="p">2010:導體層</p>
        <p type="p">2012:介電層</p>
        <p type="p">2014:導體層</p>
        <p type="p">2016:介電層</p>
        <p type="p">2018:導體層</p>
        <p type="p">2202:走線</p>
        <p type="p">2204:走線</p>
        <p type="p">24:導線</p>
        <p type="p">26:導線</p>
        <p type="p">S:間距</p>
        <p type="p">W:線寬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="489" publication-number="202632874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板固定結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250328B">H02S30/10</main-classification>
        <further-classification edition="201401120250328B">H02S20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹運鋼鐵有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RMSC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃茂華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪銘憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種太陽能板固定結構，係包含：一型鋼，係由一底板及兩相對應的側板所構成，且該兩側板上方分別朝中間各延伸出一水平板，兩該水平板間形成一進水口，且兩該水平板朝該底板方向各延伸出一彎折片；一位於該型鋼內的連結座，係由兩支撐片及一連接在兩該支撐片上方間的支撐板所構成，該支撐板具有一通孔，且其兩端上分別朝該進水口方向各延伸出一擋片；一鎖固塊，具有一螺孔，該鎖固塊放置在支撐板上方，並位於兩該擋片之間；複數個太陽能板，係置於該水平板上，且每兩相對應的該太陽能板間具有間隙；一壓板，具有一通孔，該壓板置於該太陽能板的間隙上方；以及一鎖合件，依序穿置該壓板之通孔後與該鎖固塊之螺孔螺合固定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:型鋼</p>
        <p type="p">11:底板</p>
        <p type="p">12:側板</p>
        <p type="p">13:容槽</p>
        <p type="p">14:水平板</p>
        <p type="p">16:彎折片</p>
        <p type="p">2:連結座</p>
        <p type="p">21:支撐片</p>
        <p type="p">22:支撐板</p>
        <p type="p">23:通孔</p>
        <p type="p">24:擋片</p>
        <p type="p">3:鎖固塊</p>
        <p type="p">31:螺孔</p>
        <p type="p">32:溝槽</p>
        <p type="p">4:太陽能板</p>
        <p type="p">41:間隙</p>
        <p type="p">5:壓板</p>
        <p type="p">51:通孔</p>
        <p type="p">6:鎖合件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="490" publication-number="202632366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影光學鏡片組、取像裝置及電子裝置</chinese-title>
        <english-title>PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250527B">G02B11/06</main-classification>
        <further-classification edition="202101120250527B">G02B7/02</further-classification>
        <further-classification edition="200601120250527B">G02B3/00</further-classification>
        <further-classification edition="202101120250527B">G03B17/28</further-classification>
        <further-classification edition="202101120250527B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯郁淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝影光學鏡片組，包含三片透鏡。三片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡以及第三透鏡。三片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第一透鏡具有正屈折力，第一透鏡物側表面於近光軸處為凸面，且第一透鏡像側表面於近光軸處為凹面。第三透鏡具有負屈折力，第三透鏡像側表面於近光軸處為凹面，且第三透鏡像側表面具有至少一反曲點。當滿足特定條件時，攝影光學鏡片組能同時滿足微型化和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photographing optical lens assembly includes three lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element and a third lens element. Each of the three lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has positive refractive power, the object-side surface of the first lens element is convex in a paraxial region thereof, and the image-side surface of the first lens element is concave in a paraxial region thereof. The third lens element has negative refractive power, the image-side surface of the third lens element is concave in a paraxial region thereof, and the image-side surface of the third lens element has at least one inflection point. When specific conditions are satisfied, the requirements of compatctness and high image quality can be met by the photographing optical lens assembly, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1:光闌</p>
        <p type="p">S2:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="491" publication-number="202632243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監測裝置及具監測裝置的排煙風管</chinese-title>
        <english-title>MONITORING DEVICE AND SMOKE EXTRACTION DUCT WITH MONITORING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250401B">G01N15/0205</main-classification>
        <further-classification edition="200601120250401B">G01N21/63</further-classification>
        <further-classification edition="200601120250401B">G01N29/02</further-classification>
        <further-classification edition="200601120250401B">F23J13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曠信科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOWLEDGE CREATION INNOVATION HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴崧銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, SUNG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏震奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHEN CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監測裝置，用於結合於一排煙風管， 該監測裝置為局部透光的板塊狀模組，其包含一視窗，該視窗的一內表面定位於一排煙氣體之流動路徑，該排煙氣體具有一流動方向。一探測模組設置於該視窗，該探測模組由該視窗朝該排煙氣體發出一偵測波，並接收通過該排煙氣體的一接收波，該接收波藉由一傳送速度偵測該氣體的一氣體濃度以及一氣體狀態，以避免該排煙氣體中的汙漬堆積或是腐蝕該視窗，進一步提供維護人員及時判斷該排煙氣體之當前狀態亦或是預測潛在問題，從而提高該排煙風管的安全性以及穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A monitoring device is designed to be integrated into a smoke extraction duct. The device is a partially transparent panel-shaped module, which includes a window. The inner surface of the window is positioned within a flue gas stream that has a flow direction. A detection module is placed on the window, emitting a detection wave toward the flue gas stream and receiving a reception wave passing through the flue gas. The reception wave, through a transmission speed, detects the gas concentration and the gas state, in order to prevent the accumulation of deposits or corrosion of the window by the flue gas. This provides maintenance personnel with timely information to assess the current status of the flue gas or predict potential issues, thus enhancing the safety and stability of the smoke extraction duct.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:風管</p>
        <p type="p">11:內部空間</p>
        <p type="p">12:外壁</p>
        <p type="p">121:穿孔</p>
        <p type="p">21:視窗</p>
        <p type="p">213:正壓機構</p>
        <p type="p">216:出氣孔</p>
        <p type="p">221:發射元件</p>
        <p type="p">2213:超音波雷達</p>
        <p type="p">222:接收元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="492" publication-number="202632208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玩具槍之槍托感應結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">F41B7/08</main-classification>
        <further-classification edition="201301120250326B">F41B11/89</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>怪怪貿易股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAY GUAY TRADING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖英熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YIN-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種玩具槍之槍托感應結構，結構包括有一包含有一槍托部之玩具槍本體、一槍托蓋體、一抵觸部、一觸發結構、一電路導通部、一供電元件、一訊號傳輸件、及一控制裝置，且該控制裝置上設有一訊號接收部及一警示元件。藉上述結構，射擊學員在握持玩具槍本體時，只要將槍托部確實抵壓於肩窩，便會因為槍托蓋體的抵觸部，使觸發結構向槍托部內位移而與電路導通部連接導通，以完成供電元件的供電迴路，並令訊號傳輸件傳訊給控制裝置，讓訊號接收部在收到觸發訊號的第一時間，便由警示元件發出聲光警示，提示學員已完成槍托抵頂肩窩的射擊要領，進而提高射擊的穩定性、準確度和連續射擊的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:槍托部</p>
        <p type="p">111:對接部</p>
        <p type="p">2:槍托蓋體</p>
        <p type="p">22:限位部</p>
        <p type="p">31:觸發結構</p>
        <p type="p">32:電路導通部</p>
        <p type="p">4:供電元件</p>
        <p type="p">5:訊號傳輸件</p>
        <p type="p">6:電路基板</p>
        <p type="p">7:控制裝置</p>
        <p type="p">71:訊號接收部</p>
        <p type="p">72:警示元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="493" publication-number="202632129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防火門之組合結構及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">E06B5/16</main-classification>
        <further-classification edition="200601120250430B">E06B7/16</further-classification>
        <further-classification edition="200601120250430B">E06B9/00</further-classification>
        <further-classification edition="200601120250430B">E05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毅欣金屬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱谷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種防火門之組合結構及其方法，組合時乃先於門扇預定處設置一門框結構，並分別將一上門軸座及一下門軸座垂直對應的設置於門框結構之上方處及下方處，而藉由下門軸座上的基準面定義一門扇本體之設置高度，接著透過複數對接結構將一蓋板件與一底板件進行插接組合，以利用對接結構的第一翻折部與第二翻折部增加強度，及利用卡勾部與對接部形成固定而完成門扇本體，最後將一上鉸鏈及一下鉸鏈設置於門扇本體上，並與上門軸座及下門軸座結合，如此即簡單快速的完成防火門之製作與組裝，大幅簡化施作工序、避免重新丈量的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:蓋板件</p>
        <p type="p">12:底板件</p>
        <p type="p">13:對接結構</p>
        <p type="p">131:卡勾部</p>
        <p type="p">132:第一翻折部</p>
        <p type="p">133:第二翻折部</p>
        <p type="p">134:對接部</p>
        <p type="p">135:封口件</p>
        <p type="p">2:上鉸鏈</p>
        <p type="p">3:下鉸鏈</p>
        <p type="p">4:門框結構</p>
        <p type="p">41:側壁部</p>
        <p type="p">411:固定口</p>
        <p type="p">42:固定部</p>
        <p type="p">5:上門軸座</p>
        <p type="p">6:下門軸座</p>
        <p type="p">61:基準面</p>
        <p type="p">62:結合部</p>
        <p type="p">63:彎折部</p>
        <p type="p">64:軸孔部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="494" publication-number="202632524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>供遠端資料管理的資料存儲方法與系統</chinese-title>
        <english-title>A DATA STORAGE METHOD AND A DATA STORAGE SYSTEM FOR REMOTE DATA MANAGEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250602B">G06F21/78</main-classification>
        <further-classification edition="200601120250602B">G06F13/14</further-classification>
        <further-classification edition="200601120250602B">G06F15/173</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英柏得科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMBESTOR TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張中禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傳生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種遠端資料管理的資料存儲裝置，其包括：資料存儲區、控制器、第一界面模組與第二界面模組。本發明提供一種遠端資料管理的資料存儲方法，其包括：步驟A與步驟B。於該步驟A中，以遠端控制系統經由設於資料存儲裝置、獨立於與主機系統連接的第一界面模組的第二界面模組對該資料存儲裝置發送遠端控制命令。於該步驟B中，該資料存儲裝置經由設於其中的控制器對設於該資料存儲裝置的資料存儲區執行該遠端控制命令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a data storage device for remote data managements, which includes: a data storage area, a controller, a first interface module and a second interface module. The present invention provides a data storage method for remote data managements, which includes: a step A and a step B. In the step A, a remote control system sends a remote control command to the data storage device via the second interface module provided in the data storage device and independent of the first interface module connected with a host system. In the step B, the data storage device executes the remote control command on the data storage area of ​​the data storage device via the controller provided therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資料存儲區</p>
        <p type="p">2:控制器</p>
        <p type="p">3:第一界面模組</p>
        <p type="p">4:第二界面模組</p>
        <p type="p">6:主機系統</p>
        <p type="p">11:隱藏資料區</p>
        <p type="p">21:緩衝記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="495" publication-number="202631767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鈦酚醛樹脂及其製造方法</chinese-title>
        <english-title>TITANIUM MODIFIED PHENOLIC RESIN AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">C08G8/28</main-classification>
        <further-classification edition="200601120250207B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵靖衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, CHING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林泰甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TAI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭如忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, RU-JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童世煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, SHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝忠達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUNG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘建男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIEN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳芝螢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種鈦酚醛樹脂及其製造方法。此方法利用溶膠-凝膠法以一鍋法進行兩步驟合成，其包含混合苯酚與鈦改質劑，以獲得中間體混合物；以及使中間體混合物與多聚甲醛進行反應，以製得鈦酚醛樹脂。上述方法可提升鈦酚醛樹脂的均質性、穩定性以及熱機械性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Titanium modified phenolic resin and a method of forming the same are provided. The method uses a one-pot sol-gel method with two-step synthesis, which includes following steps: phenol and titanium modifier are mixed to obtain an intermediate mixture; and the intermediate mixture reacts with polyoxymethylene to obtain the titanium modified phenolic resin. Homogeneity and stability, as well as thermomechanical property of the titanium modified phenolic resin, can be increased by the aforementioned method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:傅立葉轉換紅外光譜圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="496" publication-number="202633267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P14/40</main-classification>
        <further-classification edition="202601120260504B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構的製造方法，其包括以下步驟。於矽基底上形成閘極結構。於閘極結構兩側的矽基底中形成摻雜區。於矽基底上形成介電層，以覆蓋閘極結構與摻雜區。於介電層中形成開孔，以暴露出摻雜區，其中開孔的下部區域位於摻雜區中。於開孔的下部區域中形成未經摻雜的矽層，其中未經摻雜的矽層的矽晶粒尺寸小於矽基底的矽晶粒尺寸。於未經摻雜的矽層上形成金屬層。進行熱處理，以使金屬層與未經摻雜的矽層轉變為金屬矽化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of semiconductor structure of this invention is provided, the manufacturing method includes the following steps. A gate structure is formed on a silicon substrate. Doped regions are formed in the silicon substrate on two sides of the gate structure. A dielectric layer is formed on the silicon substrate to cover the gate structure and the doped regions. Holes are formed in the dielectric layer to expose the doped regions, wherein a lower region of the hole is located in the doped region. An undoped silicon layer is formed in the lower region of the hole, wherein a size of silicon grains of the undoped silicon layer is smaller than a size of silicon grains of the silicon substrate. A metal layer is formed on the undoped silicon layer. A heat treatment is performed to transform the metal layer and the undoped silicon layer into a metal silicide layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:矽基底</p>
        <p type="p">102:閘介電層</p>
        <p type="p">104:閘極</p>
        <p type="p">106:覆蓋層</p>
        <p type="p">108:間隙壁</p>
        <p type="p">110:摻雜區</p>
        <p type="p">112:介電層</p>
        <p type="p">114:未經摻雜的矽材料層</p>
        <p type="p">114a:未經摻雜的矽層</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">H:開孔</p>
        <p type="p">R:下部區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="497" publication-number="202632207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合弓之弓臂結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250619B">F41B5/10</main-classification>
        <further-classification edition="200601120250619B">F41B5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>經緯度企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張助偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種複合弓之弓臂結構，係由多個弓臂組成，這些弓臂以預定的夾角分別安裝在弓臂座的兩側，並且配備多個旋轉構件以對稱方式連接，用於繞接弓弦。每根弓臂具有特定的長度和寬度，呈片狀外形，並在延伸方向的兩端具有一組接截面和一自由截面。其特徵在於組接截面與旋轉構件之樞軸間的距離，被定義為應力長度，而每根弓臂的寬度則介於應力長度的26%至30%之間。這樣的設計使得弓臂相比傳統弓臂擁有更大的表面積，同時延長了使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:弓臂</p>
        <p type="p">102:自由截面</p>
        <p type="p">121:第一弓臂</p>
        <p type="p">122:第二弓臂</p>
        <p type="p">123:間隙</p>
        <p type="p">20:弓臂座</p>
        <p type="p">30:旋轉構件</p>
        <p type="p">31:樞軸</p>
        <p type="p">40:弓弦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="498" publication-number="202633215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓性電子裝置</chinese-title>
        <english-title>FLEXIBLE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250512B">H10H20/819</main-classification>
        <further-classification edition="202501120250512B">H10H20/841</further-classification>
        <further-classification edition="202501120250512B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭烱傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宗煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峰鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭媖綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開一種可撓性電子裝置，包含第一可撓層、電子元件層、偏光層、抗反射層、支撐層、第一黏著層及第二黏著層。電子元件層設置於第一可撓層上；偏光層設置於電子元件層遠離第一可撓層的一側；抗反射層設置於偏光層遠離電子元件層的一側；支撐層設置於第一可撓層遠離電子元件層的一側；第一黏著層設置於第一可撓層與支撐層之間；第二黏著層設置於抗反射層與偏光層之間；其中第一黏著層的厚度大於第二黏著層的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a flexible electronic device including a first flexible layer, an electronic element layer, a polarization layer, an anti-reflective layer, a support layer, a first adhesive layer and a second adhesive layer. The electronic element layer is disposed on the first flexible layer. The polarization layer is disposed at one side of the electronic element layer away from the first flexible layer. The anti-reflective layer is disposed at one side of the polarization layer away from the electronic element layer. The support layer is disposed at one side of the first flexible layer away from the electronic element layer. The first adhesive layer is disposed between the first flexible layer and the support layer, and the second adhesive layer is disposed between the anti-reflective layer and the polarization layer. The thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:可撓性電子裝置</p>
        <p type="p">11:第一可撓層</p>
        <p type="p">12:電子元件層</p>
        <p type="p">13:偏光層</p>
        <p type="p">14:抗反射層</p>
        <p type="p">15:支撐層</p>
        <p type="p">16:第一黏著層</p>
        <p type="p">17:第二黏著層</p>
        <p type="p">18:第三黏著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="499" publication-number="202631278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利於鑄造及整型之不鏽鋼材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">B21D53/78</main-classification>
        <further-classification edition="200601120250214B">C21D1/00</further-classification>
        <further-classification edition="200601120250214B">C22C38/00</further-classification>
        <further-classification edition="200601120250214B">C22C38/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>般若科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林允進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晏徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炳煇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種不鏽鋼材料，其包含有14.6-16.1 wt%的鉻（Cr）、5.4-6.2 wt%的鎳（Ni），1.5-2.2 wt%的矽（Si）、0.001-0.05 wt%的碳（C）、0.3-0.8 wt%的錳（Mn）、2.5-3.2 wt%的銅（Cu）、1.2-2.0 wt%的鈷（Co）以及0.2-0.3 wt%的鈮（Nb），其餘部分包含有鐵（Fe）及不可避免之雜質。此不鏽鋼材料在鑄造時，能提供較佳的流動性，有助於薄鑄件的成形，並依需求調降降伏強度（Yielding Strength），讓整型變的容易，同時維持高抗拉強度（Tensile Strength）及抗衝擊強度。相對於傳統的雙相鋼（Dual Phase Stainless Steel）材料，其斷裂強度明顯提高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="500" publication-number="202631104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>齒科填充材料糊劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250801B">A61K6/76</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名冠生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳秋敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林燕慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂冠緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪璟瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周治雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯　利雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫安正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, AN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種齒科填充材料糊劑，其包括一主劑，其為矽酸三鈣或矽酸二鈣的粉末，矽酸三鈣與矽酸二鈣可同時添加並以任意比例混合；一副劑，其為鋁酸三鈣、三鈣氧化鹽、氧化矽酸鹽、鐵鋁酸四鈣、澎潤土或高嶺土，鋁酸三鈣、三鈣氧化鹽、氧化矽酸鹽、澎潤土與高嶺土可同時添加並以任意比例混合；一顯影劑；一親水性分散劑；及一增稠劑，主劑之重量百分比為整體的1~70wt%，副劑之重量百分比為整體的1~70wt%，顯影劑之重量百分比為整體的1~70wt%，親水性分散劑之重量百分比為整體的1~70wt%，增稠劑重量百分比為整體的1~50wt%，本發明不含水。本發明的性能達到了ISO6876的測試標準，並為鹼性，且具有良好抗壓強度及低生物毒性，能夠滿足臨床使用的標準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="501" publication-number="202632468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置及其製造方法</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F1/20</main-classification>
        <further-classification edition="200601120260302B">H05K7/20</further-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰緯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUTEC OPTO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勝傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱裝置之製造方法，包含：提供一散熱器，其包含一立體結構，且該立體結構包含一立體表面，其中該立體表面上設有至少一元件區域；形成一絕緣保護膜於該散熱器的該立體表面上；利用非遮罩式圖案加工去除局部該絕緣保護膜，以露出該散熱器上的該元件區域；披覆一導熱層於該散熱器上的該元件區域；以及去除該絕緣保護膜。藉由非遮罩式圖案加工製程的設計，故不需要使用遮蔽罩，就能讓散熱器上形成多個元件區域，如此製造步驟較少且結構較為簡單，可有效達到縮短工時、提高生產效率之目的，進而有助於降低成本並增加市場競爭力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱裝置</p>
        <p type="p">11:散熱器</p>
        <p type="p">12:立體結構</p>
        <p type="p">13:立體表面</p>
        <p type="p">131:底表面</p>
        <p type="p">132:頂表面</p>
        <p type="p">133:側表面</p>
        <p type="p">134:元件區域</p>
        <p type="p">1341:第一元件區</p>
        <p type="p">1342:第二元件區</p>
        <p type="p">14:導熱層</p>
        <p type="p">141:頂表面導熱層</p>
        <p type="p">142:側表面導熱層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="502" publication-number="202632005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寵物之目標腸道菌的系統化評估方法</chinese-title>
        <english-title>SYSTEMIC EVALUATION METHOD FOR ESTIMATING TARGET GUT MICROBES IN PETS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250605B">C12Q1/6888</main-classification>
        <further-classification edition="201801120250605B">G16H50/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全銘生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANTING ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳秉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BING-JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒永豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YUNG HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一寵物目標腸道菌的系統化評估方法，包含：(S1) 提供一寵物糞便檢體；(S2) 萃取檢體的DNA樣本；(S3) 進行第一即時定量聚合酶連鎖反應，得出16S循環數閥值；(S4) 進行第二即時定量聚合酶連鎖反應，得出目標腸道菌之循環數閥值；(S5) 以前述16S及循環數閾值算出目標腸道菌的菌量測量比例值；(S6) 以菌量測量比例值與菌量標準值算出相對誤差距離；(S7) 以相對誤差距離算出R值；(S8) 以目標腸道菌之R值對寵物的亞健康風險進行第一階段評估。前述方法可進一步包含：(S9) 將R值換算為風險指數；(S10) 以目標腸道菌之風險指數對寵物的亞健康風險進行第二階段評估。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a systematic evaluation method for target gut microbes in pets, comprising: (S1) providing a pet fecal sample; (S2) extracting a DNA sample of the fecal sample; (S3) performing a first real time quantitative polymerase chain reaction (PCR) to obtain a 16S cycle threshold; (S4) performing a second real-time quantitative PCR to obtain a cycle threshold of the target gut microbe; (S5) calculating the measured relative abundance ratio of the target gut microbe using 16S cycle threshold and the cycle threshold of the target gut microbe; (S6) determining the relative error distance between the measured relative abundance ratio and standard abundance ratio of the target microbe; (S7) calculating the R value of the target microbe based on the relative error distance; (S8) performing a first-stage evaluation of the subhealth risk of the pet based on the R value. The systematic evaluation method may further comprises: (S9) converting the R-value into a risk index, and (S10) performing a second-stage evaluation of the subhealth risk of the pet based on the risk index.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="503" publication-number="202632511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生成式ＡＩ機器人</chinese-title>
        <english-title>GENERATIVE AI ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250930B">G06F16/33</main-classification>
        <further-classification edition="201901120250930B">G06F16/28</further-classification>
        <further-classification edition="201901120250930B">G06F16/338</further-classification>
        <further-classification edition="201901120250930B">G06F16/901</further-classification>
        <further-classification edition="202501120250930B">G06F16/3329</further-classification>
        <further-classification edition="200601120250930B">G10L15/26</further-classification>
        <further-classification edition="201301120250930B">G10L15/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美泰萬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAONE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種生成式AI機器人，包含生成式語音助理儲存於機器人，其中透過語音輸入指令至生成式語音助理；邊緣運算裝置包含生成式AI模型，配置於機器人提供邊緣運算，其中機器人包含安全機制，選自含防火牆、防毒軟體、安全晶片之一或以上任意組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a generative AI robot including a generative voice assistant, in which instruction is input to the generative voice assistant through vocal. An edge computing device is configured in the robot to provide edge computing, wherein the edge computing device includes a generative AI model. The robot includes a security mechanism selected form a firewall, an anti-virus software, a security chip or any combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:生成式AI機器人</p>
        <p type="p">104:生成式雲端裝置</p>
        <p type="p">106:生成式資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="504" publication-number="202632484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用霍爾陣列形成的磁性觸控面板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G06F3/046</main-classification>
        <further-classification edition="201301120250801B">G06F3/0354</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商泓宇星私人有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUXLNK PTE. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊　建明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用霍爾陣列形成的磁性觸控面板，包含：一基板；多個霍爾電阻以陣列的方式排列在該基板上方；各該霍爾電阻包含一電流輸入端、一電流輸出端、一第一電壓端及一第二電壓端；當一具有磁性的觸控筆接觸一霍爾電阻，由該第一電壓端及該第二電壓端之間產生的電壓差的大小即可知道該觸控筆是否近接該霍爾電阻；多個電流線通過霍爾電阻陣列中同一列的該霍爾電阻；各該電流線上配置一電性調節器用於控制所屬之該電流線；該電源為電流源或電壓源；一控制單元連接各該電性調節器；多個第一行電壓線，各第一行電壓線並聯同一行之該霍爾電阻的該第一電壓端；多個第二行電壓線，各第二行電壓線並聯同一行之該霍爾電阻的該第二電壓端；一電壓感測器感測該第一行電壓線及該第二行電壓線之間的電壓差以形成一電壓向量；一處理單元接收來自該電壓向量及該時控訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:霍爾電阻</p>
        <p type="p">30:霍爾電阻陣列</p>
        <p type="p">34:電源</p>
        <p type="p">35:電流線</p>
        <p type="p">36:控制單元</p>
        <p type="p">40:電流串列</p>
        <p type="p">50:第一行電壓線</p>
        <p type="p">51:處理單元</p>
        <p type="p">52:第二行電壓線</p>
        <p type="p">55:電壓感測器</p>
        <p type="p">351:電性調節器</p>
        <p type="p">551:電壓向量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="505" publication-number="202632875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能板固定結構(一)</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250219B">H02S30/10</main-classification>
        <further-classification edition="201401120250219B">H02S20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹運鋼鐵有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RMSC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃茂華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪銘憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種太陽能板固定結構(一)，係包含︰一型鋼，及一位於該型鋼內容的連結座，該連結座係由兩支撐片及一連接在兩該支撐片上方間的支撐板所構成的ㄇ形體，該支撐板具有一通孔及至少兩個長槽孔；一結合板，該結合板是結合在該支撐板的下表面，該結合板沖壓出一限位部，該限位部是對應於該支撐板通孔下方； 一鎖固塊，該鎖固塊具有一螺孔，該鎖固塊位於限位部內，且該螺孔與該支撐板的通孔相對應設置；複數個太陽能板，該些太陽能板置於該水平板上，且每兩相對應的該太陽能板間具有間隙；一壓板，該壓板具有一通孔，該壓板置於該太陽能板的間隙上方；以及一鎖合件，依序穿置該壓板之通孔後與該鎖固塊之螺孔螺合固定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:型鋼</p>
        <p type="p">11:底板</p>
        <p type="p">12:側板</p>
        <p type="p">121:鎖孔</p>
        <p type="p">13:水平板</p>
        <p type="p">14:進水口</p>
        <p type="p">15:容槽</p>
        <p type="p">2:連結座</p>
        <p type="p">21:支撐片</p>
        <p type="p">211:鎖固孔</p>
        <p type="p">22:支撐板</p>
        <p type="p">221:通孔</p>
        <p type="p">222:長槽孔</p>
        <p type="p">3:結合板</p>
        <p type="p">31:限位部</p>
        <p type="p">311:限位片</p>
        <p type="p">312:平板</p>
        <p type="p">313:容置空間</p>
        <p type="p">314:擋片</p>
        <p type="p">32:穿孔</p>
        <p type="p">33:固定槽道</p>
        <p type="p">331:槽孔</p>
        <p type="p">34:螺栓</p>
        <p type="p">341:頭部</p>
        <p type="p">342:螺紋部</p>
        <p type="p">35:螺母</p>
        <p type="p">4:鎖固塊</p>
        <p type="p">41:螺孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="506" publication-number="202632126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保險設備的安全裝置與系統</chinese-title>
        <english-title>SECURITY DEVICES AND SYSTEM FOR SECURITY EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">E05G1/10</main-classification>
        <further-classification edition="200601120250401B">E05B45/06</further-classification>
        <further-classification edition="200601120250401B">G08B13/18</further-classification>
        <further-classification edition="200601120250401B">G08B13/14</further-classification>
        <further-classification edition="201301120250401B">G06F21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中興保全科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于浩文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江聰明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓佳豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宣吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSUAN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作的保險設備的安全裝置與系統，結合熱源感測器、門開關感測器、攝像機及重量感測器，透過保全主機進行資料整合，並將啟動訊號、環境影像與重量變化資訊傳送至伺服器，由伺服器進行儲存及處理，最終產生保全狀況訊息並通知行動裝置。換言之，可以在有人靠近保險箱單元即時監控、異常預警及數據管理功能，也可以管理保險箱內容物重量變化資訊，提升保險箱的安全性與管理效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The security device and system of the insurance equipment in this creation combines a heat source sensor, door switch sensor, camera, and weight sensor. It integrates data through the security main unit and transmits activation signals, environmental images, and weight change information to a server, where it is stored and processed. The server then generates security status messages and notifies mobile devices. In other words, the system enables real-time monitoring, anomaly alerts, and data management when someone approaches the safe unit. It also allows for the management of weight change information of the contents within the safe, enhancing both the security and management efficiency of the safe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:保全主機</p>
        <p type="p">2:保險箱單元</p>
        <p type="p">3:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="507" publication-number="202632271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化表面含水率量測儀及應用其之批次自動化表面含水率量測系統</chinese-title>
        <english-title>AUTOMATIC SURFACE MOISTURE MEASURING INSTRUMENT AND BATCH AUTOMATIC SURFACE MOISTURE MEASURING SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N33/38</main-classification>
        <further-classification edition="200601120250512B">G01G13/20</further-classification>
        <further-classification edition="200601120250512B">G01G13/18</further-classification>
        <further-classification edition="200601120250512B">G01G13/16</further-classification>
        <further-classification edition="202201120250512B">G01F23/296</further-classification>
        <further-classification edition="200601120250512B">G01F23/292</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國產建材實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDSUN BUILDING MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李銘智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHICH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化表面含水率量測儀，包含量測筒體、重量感測器、液位感測器及計算單元。量測筒體包含進料開口及複數個固定部。進料開口位於量測筒體的一端，用以分批注入砂料及水，其中進料開口的直徑與量測筒體的高度比為1/7至1/2。固定部位於量測筒體的外表面。重量感測器裝設固定部之一上，用以量測量測筒體中的重量，並輸出複數個重量資訊。液位感測器感測量測筒體中的水是否達到預定液位高度。計算單元電性連接重量感測器，接收重量資訊，並根據重量資訊及對應預定液位高度的體積計算出砂料的表面含水率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic surface moisture measuring instrument includes a measuring cylinder, a weight sensor, a liquid level sensor and a calculation unit. The measuring cylinder includes a feeding opening and a plurality of fixed parts. The feeding opening is at one end of the measuring cylinder for inputting sand material and water in batches. The ratio of the diameter of the feed opening to the height of the measuring cylinder is 1/7 to 1/2. The fixed parts are on the outer surface of the measuring cylinder. The weight sensor is installed on one of the fixed parts to measure the weight in the measuring cylinder and output a plurality of weight information. The liquid level sensor senses whether the water in the cylinder reaches a predetermined liquid level. The calculation unit is electrically connected to the weight sensor, receives the weight information, and calculates the surface moisture of the sanding material based on the weight information and the and the volume corresponding to the predetermined liquid level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:自動化表面含水率量測儀</p>
        <p type="p">10:量測筒體</p>
        <p type="p">11:進料開口</p>
        <p type="p">111:輪緣</p>
        <p type="p">12:第二固定部</p>
        <p type="p">13:固定部</p>
        <p type="p">14:氣壓組件</p>
        <p type="p">15:出料開口</p>
        <p type="p">151:輪緣</p>
        <p type="p">17:底板</p>
        <p type="p">19:排水組件</p>
        <p type="p">20:重量感測器</p>
        <p type="p">30:液位感測器</p>
        <p type="p">40:計算單元</p>
        <p type="p">41:顯示面板</p>
        <p type="p">500:懸吊件</p>
        <p type="p">D:進料開口的直徑</p>
        <p type="p">H:量測筒體的高度</p>
        <p type="p">L:預定液位高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="508" publication-number="202631409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合車機影像的資訊處理系統與方法</chinese-title>
        <english-title>IMAGE AND INFORMATION INTEGRATION SYSTEM AND METHOD FOR VEHICLE-MOUNTED DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250502B">B60K35/20</main-classification>
        <further-classification edition="202401120250502B">B60K35/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中興保全科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧耀奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, YAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳之軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高世璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江聰明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范介寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHIEH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合車機影像的資訊處理系統與方法，包括行車記錄設備與中控設備。行車記錄設備具有攝像單元、顯示單元、第一傳輸介面、第二傳輸介面與第一處理單元，第一處理單元連接於攝像單元、顯示單元、第一傳輸介面與第二傳輸介面；中控設備具有第三傳輸介面、第四傳輸介面與第二處理單元，第二處理單元連接於定位單元、第三傳輸介面與第四傳輸介面，第三傳輸介面連接於第一傳輸介面，第四傳輸介面連接於擴充設備，第二處理單元接收擴充設備的外部資訊，第二處理單元傳送外部資訊至行車記錄設備；第一處理單元將外部資訊層疊於行車影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image and information integration system and method for vehicle-mounted devices are provided. The system comprises a driving recorder device and a central control device. The driving recorder device includes an imaging unit, a display unit, a first transmission interface, a second transmission interface, and a first processing unit. The first processing unit is connected to the imaging unit, the display unit, the first transmission interface, and the second transmission interface. The central control device includes a third transmission interface, a fourth transmission interface, and a second processing unit. The second processing unit is connected to a positioning unit, the third transmission interface, and the fourth transmission interface. The third transmission interface is connected to the first transmission interface, while the fourth transmission interface is connected to an expansion device. The second processing unit receives external information from the expansion device and transmits the external information to the driving recorder device. The first processing unit overlays the external information onto the driving images, thereby integrating the external information with the captured driving footage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">110:行車記錄設備</p>
        <p type="p">111:攝像單元</p>
        <p type="p">112:顯示單元</p>
        <p type="p">113:第一傳輸介面</p>
        <p type="p">114:第二傳輸介面</p>
        <p type="p">115:第一處理單元</p>
        <p type="p">120:中控設備</p>
        <p type="p">121:第三傳輸介面</p>
        <p type="p">122:第四傳輸介面</p>
        <p type="p">123:第二處理單元</p>
        <p type="p">130:擴充設備</p>
        <p type="p">140:車輛載具</p>
        <p type="p">151:行車影像</p>
        <p type="p">152:合成影像</p>
        <p type="p">153:外部資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="509" publication-number="202632554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監控車載貨物溫度的處理系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MONITORING THE TEMPERATURE OF IN-VEHICLE CARGO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250207B">G06Q10/08</main-classification>
        <further-classification edition="202301120250207B">G06Q10/0832</further-classification>
        <further-classification edition="202401120250207B">G06Q50/40</further-classification>
        <further-classification edition="200601120250207B">B60P3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中興保全科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高世璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江聰明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TSUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范介寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHIEH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林廷凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳健全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監控車載貨物溫度的處理系統與方法，具有測溫設備、顯示設備及車用主機。顯示設備具有第一傳輸介面、顯示單元、暫存單元與第一處理單元，第一處理單元依寫檔策略將當前溫度存入暫存單元。車用主機具有第二傳輸介面、通訊單元與第二處理單元，第二傳輸介面連接第一傳輸介面，向顯示設備發送索資要求，透過通訊單元連接雲端伺服器。測溫設備設置於待測設備中，具有偵溫單元與第三傳輸介面。偵測當前溫度後，透過第三傳輸介面傳送至顯示設備。顯示設備根據索資要求，將多組溫度封裝為溫度集合。由車用主機將溫度集合傳送雲端伺服器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for monitoring the temperature of in-vehicle cargo comprises a temperature measurement device, a display device, and an in-vehicle host. The display device includes a first transmission interface, a display unit, a buffer unit, and a first processing unit, wherein the first processing unit stores the current temperature into the buffer unit based on a file-writing strategy. The in-vehicle host includes a second transmission interface, a communication unit, and a second processing unit, wherein the second transmission interface is connected to the first transmission interface to send data requests to the display device and is further connected to a cloud server via the communication unit. The temperature measurement device is installed in the equipment to be measured and includes a temperature sensing unit and a third transmission interface. After detecting the current temperature, the temperature measurement device transmits the data to the display device via the third transmission interface. The display device, in response to the data request, encapsulates multiple temperature data points into a temperature set, which is then transmitted to the cloud server via the in-vehicle host.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">110:顯示設備</p>
        <p type="p">111:第一傳輸介面</p>
        <p type="p">112:顯示單元</p>
        <p type="p">113:暫存單元</p>
        <p type="p">114:寫檔策略</p>
        <p type="p">115:第一處理單元</p>
        <p type="p">120:車用主機</p>
        <p type="p">121:第二傳輸介面</p>
        <p type="p">122:通訊單元</p>
        <p type="p">123:第二處理單元</p>
        <p type="p">130:測溫設備</p>
        <p type="p">131:第三傳輸介面</p>
        <p type="p">132:偵溫單元</p>
        <p type="p">141:雲端伺服器</p>
        <p type="p">142:待測設備</p>
        <p type="p">143:通訊設備</p>
        <p type="p">152:警示訊號</p>
        <p type="p">153:警示通知</p>
        <p type="p">161:當前溫度</p>
        <p type="p">162:溫度集合</p>
        <p type="p">400:資料結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="510" publication-number="202631212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸液袋的輸液扣件</chinese-title>
        <english-title>FASTENING PIECE FOR INFUSION OF INFUSION BAG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250531B">A61M5/14</main-classification>
        <further-classification edition="200601120250531B">A61J1/10</further-classification>
        <further-classification edition="202301120250531B">A61J1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慈濟學校財團法人慈濟大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZU CHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祝君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZU CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昀淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YUN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃佳敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張美琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MEI LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱玉湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸液袋的輸液及加藥扣件，包含：扣件本體，具有：二片體、樞接部，以及二卡扣部；透過樞接部樞轉開啟片體，將彼此連接的袋口與輸液管置入片體之間的容置空間，再透過樞接部樞轉閉合片體，將卡扣部彼此扣合，使袋口最寬之處位於第一凹入部，二凸緣分別位於袋口最寬之處的上方及下方，袋口自頂部開口伸出，導氣部由導氣透孔伸出，輸液管自底部開口伸出，進而使扣件本體連接於輸液管及輸液袋，另輸液管選擇式地結合加藥管而連接至袋口，加藥管的加藥部則由扣件本體的加藥透孔伸出，片體並進一步分別設有卡合孔，卡合孔可供輸液管的二凸出部分別由容置空間穿出片體的外部而形成卡合，藉此可適用於多種公規輸液管並確實防止輸液管自輸液袋上脫落及安全加藥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扣件本體</p>
        <p type="p">23:加藥部</p>
        <p type="p">A:輸液管</p>
        <p type="p">B:輸液袋</p>
        <p type="p">B1:袋口</p>
        <p type="p">C:加藥針筒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="511" publication-number="202632565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛擬貨幣交易異常管控系統及虛擬貨幣交易異常管控方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250207B">G06Q20/06</main-classification>
        <further-classification edition="201201120250207B">G06Q40/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾亞數位科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA BIT DIGITAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭云嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張庭綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林逸騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉香君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種虛擬貨幣交易異常管控系統，包含一儲存單元及一處理單元。該處理單元電連接於該儲存單元。該處理單元接收相關於一用戶的一交易的一交易請求。對於多個交易異常條件的每一者，該處理單元判斷該交易是否符合該交易異常條件。當該處理單元判斷該交易符合該交易異常條件，該處理單元執行對應於該交易異常條件的一交易異常處置程序。藉此防止詐騙或洗錢的行徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S22:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="512" publication-number="202632568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線上快速認證交易卡驗證系統</chinese-title>
        <english-title>FAST IDENTITY ONLINE TRADING CARD VERIFICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250401B">G06Q20/40</main-classification>
        <further-classification edition="201301120250401B">G06F21/30</further-classification>
        <further-classification edition="201301120250401B">G06F21/31</further-classification>
        <further-classification edition="200601120250401B">H04L9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永豐商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANK SINOPAC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, KUO JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈珮騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, PEI CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林定儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DING RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芝涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種線上快速認證(FIDO)交易卡驗證系統，包括：服務方伺服器，驗證伺服器通訊地連接服務方伺服器，使用者裝置，通訊地連接服務方伺服器與驗證伺服器。線上快速認證交易卡，完成註冊開卡後產生公鑰與私鑰，私鑰產生後直接儲存於卡片安全區，公鑰則傳到後台驗證服務器存放。FIDO交易卡為非接觸式交易卡，透過輸入一FIDO密碼並以無線感應方式耦合使用者裝置，將私鑰與公鑰配對驗證。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention disclosed a system for Fast Identity Online (FIDO) transaction card verification, which includes a relying party server, a verification server communicatively connected to the relying party server, and a user device communicatively connected to the relying party server and the verification server. The FIDO trading card generates a public key and a private key after completing the registration and activating the card. The private key is written into the FIDO trading card through the user device, and the public key is stored in the verification server. The FIDO transaction card is a contactless transaction card, through entering a FIDO password and wirelessly coupling with the user device, the private key and the public key are paired and verified.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統架構</p>
        <p type="p">102:使用者裝置</p>
        <p type="p">104:非接觸式交易卡</p>
        <p type="p">106:服務方伺服器</p>
        <p type="p">108:驗證伺服器</p>
        <p type="p">110:雲端數據庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="513" publication-number="202632132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>推開門裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">E06B7/20</main-classification>
        <further-classification edition="200601120250317B">E06B1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種推開門裝置，其具有一門框、一門扇、一蓋體及一連動裝置。門框具有一凹槽，其設置於門框的底側邊。門扇可樞轉的設置於門框，且能相對門框上下移動。蓋體可上下移動地設置於門框的凹槽中。連動裝置設置於門框的底側邊。連動裝置具有一樞軸、一引導件及一作動板。樞軸設置於門框的底側邊，且門扇樞設於樞軸上。引導件一端設置於樞軸上，且能隨樞軸轉動而移動。作動板設置於引導件相對於樞軸的另一端，且能隨引導件移動而轉動。藉由連動裝置帶動蓋體能向上移動至蓋體的頂面能與門框凹槽的頂面齊平，使門框不會造成使用者絆倒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:門框</p>
        <p type="p">20:門扇</p>
        <p type="p">30:蓋體</p>
        <p type="p">40:連動裝置</p>
        <p type="p">41:樞軸</p>
        <p type="p">42:引導件</p>
        <p type="p">43:作動板</p>
        <p type="p">44:連動板</p>
        <p type="p">50:推動裝置</p>
        <p type="p">51:把手</p>
        <p type="p">52:推動桿</p>
        <p type="p">53:轉角器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="514" publication-number="202632179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於壓縮氣體的氣瓶及其接頭</chinese-title>
        <english-title>GAS CYLINDER FOR COMPRESSED GAS AND ITS CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">F17C1/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦查工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANZA STAMPING INDUSTRY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種用於壓縮氣體的氣瓶，其具有塑膠內膽、套設於內膽之瓶口外的接頭、以及包覆於內膽外及接頭外的強化層，接頭之環裙部係貼靠於內膽，閥件穿設於接頭及內膽之瓶口中，藉由強度較高的強化層及接頭來承受氣體壓力，使得內膽得以塑膠材質所製而達到輕量化的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a gas cylinder for compressed gas, comprising a plastic liner, a connector fitted over the neck of the liner, and a reinforcement layer that envelops both the exterior of the liner and the connector. The flange portion of the connector is positioned against the liner, and a valve is installed through the neck of both the connector and the liner. The use of a high-strength reinforcement layer and connector allows the cylinder to withstand gas pressure, enabling the liner to be made from lightweight plastic materials, achieving a reduced overall weight.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內膽</p>
        <p type="p">11:瓶口</p>
        <p type="p">12:外壁面</p>
        <p type="p">20:接頭</p>
        <p type="p">21:環裙部</p>
        <p type="p">23:內環槽</p>
        <p type="p">24:端環槽</p>
        <p type="p">25:第二螺紋部</p>
        <p type="p">30:強化層</p>
        <p type="p">40:閥件</p>
        <p type="p">41:氣體通道</p>
        <p type="p">42:外環槽</p>
        <p type="p">50:主氣密環</p>
        <p type="p">51:輔助氣密環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="515" publication-number="202631015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容易清潔的食物煙燻裝置</chinese-title>
        <english-title>EASY-TO-CLEAN FOOD SMOKING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">A23B4/044</main-classification>
        <further-classification edition="200601120250228B">A23B4/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種食物煙燻裝置，其本體之頂面連接燃燒器，與頂面相鄰之第一側面與第二側面分別連接進氣管及排氣管，本體中的入煙通道由頂面成型而對應燃燒器，本體中的出煙通道對應貫穿第一側面與第二側面以連接進氣管及排氣管，進氣管連接氣源，排氣管延伸入食物容器中，入煙通道與出煙通道交會相通，當木柴於燃燒器中燃燒時，氣源對進氣管吹送氣體以產生氣流，則將木柴所產生的煙霧帶入出煙通道中並導入排氣管中，以灌入食物容器中產生煙燻效果，因此，木柴所產生的煙霧將不會通過氣源，使得氣源中不會有煙垢殘留，以維持氣源的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is a food smoking device. The top surface of its main body is connected to a burner, while an air intake pipe and an exhaust pipe are connected to the first and second side surfaces adjacent to the top surface, respectively. The smoke inlet channel within the main body is formed on the top surface to align with the burner, and the smoke outlet channel within the main body extends through the first and second side surfaces to connect the air intake pipe and the exhaust pipe. The air intake pipe is connected to an air source, and the exhaust pipe extends into a food container. The smoke inlet channel intersects and communicates with the smoke outlet channel. When wood burns in the burner, the air source supplies air through the intake pipe to generate airflow, which carries the smoke produced by the burning wood into the smoke outlet channel and directs it into the exhaust pipe, subsequently introducing it into the food container to create a smoking effect. As a result, the smoke generated by the wood does not pass through the air source, ensuring that no smoke residue remains in the air source, thereby maintaining the longevity of the air source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">101:頂面</p>
        <p type="p">102:第一側面</p>
        <p type="p">20:燃燒器</p>
        <p type="p">30:進氣管</p>
        <p type="p">40:排氣管</p>
        <p type="p">50:氣源</p>
        <p type="p">51:出氣端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="516" publication-number="202632175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高強度流體連接器</chinese-title>
        <english-title>HIGH STRENGTH FLUID CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">F16L37/28</main-classification>
        <further-classification edition="200601120250414B">F16L37/35</further-classification>
        <further-classification edition="200601120250414B">F16L37/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭榮勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, RONG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滕昌和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, CHANG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種高強度流體連接器，係於一管本體由前至後內設有一活動閥、彈簧及一支撐套環，該支撐套環係以一彈性卡合件卡合固定在該管本體之一後開口內，故不必使用彈性支撐件；又因本發明的彈性卡合件位在該支撐套環的外側，故透過該支撐套環與該管本體的流體管道隔開，故該彈性卡合件不會長時間浸泡在流體內，而縮短其使用壽命，相較使用彈性支撐件的流體連接器，具有較長的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a high strength fluid connector and has a tube body in which a moveable valve, a spring and a supporting ring are mounted from front to rear. The supporting ring is securely mounted in a rear opening of the tube body by an elastic engaging member so the present invention does not require an elastic supporting ring. Since the elastic engaging member is outside the supporting ring, the elastic engaging member is separated from a fluid passage of the tube body through the supporting ring. Therefore, the elastic engaging member is not immersed in the fluid for a long time, and its service life is extended. Compared with a fluid connector using the elastic supporting ring, the present invention with the elastic engaging member has a longer service life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:管本體</p>
        <p type="p">20:支撐套環</p>
        <p type="p">21:套環本體</p>
        <p type="p">22:第二彈臂</p>
        <p type="p">221:支撐部</p>
        <p type="p">23:第一彈臂</p>
        <p type="p">231:卡合部</p>
        <p type="p">30:活動閥</p>
        <p type="p">31:頭部</p>
        <p type="p">32:本體</p>
        <p type="p">33:尾部</p>
        <p type="p">34:第一密封環</p>
        <p type="p">40:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="517" publication-number="202631466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可移動式櫃體系統及儲能設備</chinese-title>
        <english-title>MOVABLE CABINET SYSTEM AND ENERGY STORAGE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250422B">B65D90/02</main-classification>
        <further-classification edition="200601120250422B">B65D85/88</further-classification>
        <further-classification edition="200601120250422B">B65D88/12</further-classification>
        <further-classification edition="200601120250422B">B65D90/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣水泥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TCC GROUP HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信菖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種可移動式櫃體系統及儲能設備。可移動式櫃體系統包括一櫃體單元以及一承載結構。櫃體單元包括頂板、底板和複數個側板，以形成一容置空間。櫃體單元設置在承載結構上，且承載結構包括基座和支撐組件。櫃體單元的底板配置在基座的頂面上。支撐組件配置在基座的底面上，並在基座的底面下方形成至少一通道。其中，櫃體單元的底板和側板至少其中一者與承載結構組裝和接合，以至少限制櫃體單元在通道的延伸方向上位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A movable cabinet system and an energy storage apparatus are provided in the present disclosure. The movable cabinet system includes a cabinet unit and a supporting structure. The cabinet unit includes a top plate, a bottom plate, and multiple side walls, forming an accommodating space. The cabinet unit is disposed on the supporting structure, which includes a base and supporting components. The bottom plate of the cabinet unit is positioned on the top surface of the base. The supporting components are arranged on the bottom surface of the base, thereby forming at least one channel beneath the bottom surface of the base. At least one of the bottom plate and side walls of the cabinet unit is assembled and joined with the supporting structure to restrict the displacement of the cabinet unit in the extension direction of the channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1,5,5':可移動式櫃體系統</p>
        <p type="p">10:櫃體單元</p>
        <p type="p">11:側板</p>
        <p type="p">12:頂板</p>
        <p type="p">13:底板</p>
        <p type="p">13H:開孔</p>
        <p type="p">30:承載結構</p>
        <p type="p">131:底面</p>
        <p type="p">132:頂面</p>
        <p type="p">L1,L2:長度</p>
        <p type="p">S1:容置空間</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="518" publication-number="202631102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙柄式調理筋膜刀結構</chinese-title>
        <english-title>DOUBLE-HANDLED FASCIA CONDITIONING KNIFE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">A61H7/00</main-classification>
        <further-classification edition="200601120250310B">A61H23/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡金芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡金芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是提供一種雙柄式調理筋膜刀結構，主要係藉由雙手握持該雙握柄並操作該筋膜刀時，可使該兩第一凸部順著人體面積較大的區域，如背闊肌、斜方肌、豎脊肌作推進，能更省力地達到人體筋肉表面放鬆，藉由該非金屬的雙握柄可穩固地與人體手部緊密貼觸固定，達到人手與握柄在握持上的協調一致性，能更加穩定地操作使用刀體推進按摩，以及更加省力的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a double-handled fascial knife structure. Mainly by holding the double handles with both hands and operating the fascial knife, the two first convex parts can be made to follow the larger area of the human body. , such as the latissimus dorsi, trapezius, and erector spinae muscles, can achieve the relaxation of the human body's muscle surface with less effort. The non-metallic double grip can be firmly fixed in close contact with the human hand, so that the human hand can be in contact with the human body. The coordination of the handle allows for more stable operation and massage using the blade body, as well as the advantage of being more labor-saving.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:刀體</p>
        <p type="p">11:第一邊刃</p>
        <p type="p">12:第一凸部</p>
        <p type="p">13:第一凹部</p>
        <p type="p">14:刀面</p>
        <p type="p">15:側端部</p>
        <p type="p">16:第二邊刃</p>
        <p type="p">17:第二凸部</p>
        <p type="p">18:第二凹部</p>
        <p type="p">20:組合端</p>
        <p type="p">21:第一端</p>
        <p type="p">22:第二端</p>
        <p type="p">23:組孔</p>
        <p type="p">30:握柄</p>
        <p type="p">31:頭端</p>
        <p type="p">32:組室</p>
        <p type="p">33:開口</p>
        <p type="p">34:貫穿部</p>
        <p type="p">35:止滑壓紋</p>
        <p type="p">36:螺栓</p>
        <p type="p">37:墊片</p>
        <p type="p">38:穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="519" publication-number="202631228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>迴旋式背部運動裝置</chinese-title>
        <english-title>SWIVEL BACK EXERCISE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">A63B23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>政華科技展業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIROTECH INNOVATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高福懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, FU-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳修閘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種迴旋式背部運動裝置，包括底座、臀部段、腿部段、腹胸段、頭部段及迴旋擺動機構。底座具升降柱，其頂部的轉接部連接臀部段，中段設有軸接座；迴旋擺動機構包含迴旋擺動座、固定座、與支撐座及往復迴旋伸縮缸及左右往復伸縮缸，前述迴旋擺動座軸設於軸接座，並於底部設具扇型齒片，且固定座連接升降柱，內部套設齒條並與扇型齒片嚙合，該固定座的往復迴旋伸縮缸具伸縮桿而連接齒條；支撐座一端軸接連接板，另一端延伸並連接腹胸段與頭部段的相連接處；往復迴旋伸縮缸驅動伸縮桿位移，帶動齒條移動，促使扇型齒片驅動擺動座以軸接座為圓軸心擺動，且支撐座受迴旋擺動座及往復迴旋伸縮缸帶動，達成腹胸段、頭部段連動可多角度擺動的結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A swivel back exercise device , includes a base, a hip section, a leg section, an abdominal and chest section, a head section and a rotary swing mechanism. The base has a lifting column, the adapter part at the top is connected to the hip section, and the middle section is provided with a shaft connection seat; the swing mechanism includes a swing base, a fixed base, a support base, a reciprocating swing telescopic cylinder, and a left and right reciprocating telescopic cylinder. The seat shaft is located on the shaft joint seat, and is equipped with a sector-shaped gear plate at the bottom, and the aforementioned fixed seat is connected to the lifting column, and a rack is set inside and meshes with the sector-shaped gear plate. The reciprocating rotary telescopic cylinder of the fixed seat has a telescopic rod. And connect the rack. One end of the support seat is axially connected to the connecting plate, and the other end extends and connects the connection between the abdominal and thoracic segments and the head segment; the reciprocating rotary telescopic cylinder drives the telescopic rod to move, driving the rack to move, prompting the fan-shaped gear plate to drive the swing seat to axially connect The seat swings on a circular axis, and the support seat is driven by the rotating swing seat and the reciprocating rotating telescopic cylinder to achieve a structure in which the abdominal, thoracic and head segments can swing at multiple angles in conjunction with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底座</p>
        <p type="p">2:臀部段</p>
        <p type="p">4:腹胸段</p>
        <p type="p">5:頭部段</p>
        <p type="p">6:迴旋擺動機構</p>
        <p type="p">11:升降柱</p>
        <p type="p">12:轉接部</p>
        <p type="p">13:軸接座</p>
        <p type="p">14:耳部</p>
        <p type="p">61:迴旋擺動座</p>
        <p type="p">611:軸孔</p>
        <p type="p">6111:緩衝墊圈</p>
        <p type="p">6112:定位板</p>
        <p type="p">612:連接板</p>
        <p type="p">613:側桿</p>
        <p type="p">6131:螺栓</p>
        <p type="p">614:扇型齒片</p>
        <p type="p">62:固定座</p>
        <p type="p">621:齒條</p>
        <p type="p">622:第一軸動部</p>
        <p type="p">623:往復迴旋伸縮缸</p>
        <p type="p">624:伸縮桿</p>
        <p type="p">63:支撐座</p>
        <p type="p">631:側翼板</p>
        <p type="p">632:軸接板</p>
        <p type="p">6321:螺栓</p>
        <p type="p">633:左右往復伸縮缸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="520" publication-number="202632941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網路封包處理方法及設備</chinese-title>
        <english-title>NETWORK PACKET PROCESSING METHOD AND DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250502B">H04L61/251</main-classification>
        <further-classification edition="202201120250502B">H04L61/2514</further-classification>
        <further-classification edition="202201120250502B">H04L61/10</further-classification>
        <further-classification edition="200601120250502B">H04L12/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神準科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENAO NETWORKS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許銘仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GUAN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於網路封包處理的方法及設備。網路封包處理方法包含：接收一個或多個封包，分別包含一來源位址、一目的位址或兩者；以及執行封包處理決策，其包含：判定一個或多個來源位址、一個或多個目的位址或兩者是否在位址轉譯排除列表之內；以及回應於判定一個或多個來源位址、一個或多個目的位址或兩者在位址轉譯排除列表之內，基於穿隧協定處置一個或多個封包。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and device for network packet processing are provided. The network packet processing method comprises: receiving one or more packets respectively comprising a source address, a destination address, or both; and performing a packet processing decision comprising: determining whether the one or more source addresses, the one or more destination addresses, or both are within an address translation exclusion list; and in response to determining that the one or more source addresses, the one or more destination addresses, or both are within the address translation exclusion list, handling the one or more packets based on a tunneling protocol.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:網路</p>
        <p type="p">10a、10b:專用網路</p>
        <p type="p">11a、11b:路由器</p>
        <p type="p">11a-1、11b-1:處理器</p>
        <p type="p">11a-2、11b-2:記憶體</p>
        <p type="p">11a-3、11b-3:網路介面</p>
        <p type="p">12a、12b:伺服器</p>
        <p type="p">13a、13b、13c:用戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="521" publication-number="202631045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌卡掣裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250326B">A47B88/403</main-classification>
        <further-classification edition="201701120250326B">A47B88/423</further-classification>
        <further-classification edition="201701120250326B">A47B88/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇家弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昶毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌卡掣裝置，設置在一滑軌，滑軌包括一外軌及一內軌。滑軌卡掣裝置包含一基座單元及一卡掣單元。基座單元包括一固接外軌的外框架、一適用於固接內軌的基座及一固接於基座的內支架，外框架具有一固接外軌的外連接部及一自外連接部遠離外軌延伸的卡合部，卡合部具有一上板段及多個卡合段。卡掣單元包括一樞設於基座的卡掣件及一連接卡掣件且可活動地容置於活動槽的驅動件，卡掣件具有一可卡掣於卡合段其中一者的卡掣部，驅動件可驅動卡掣件樞轉使卡掣部解除與卡合部的卡掣關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滑軌卡掣裝置</p>
        <p type="p">100:滑軌</p>
        <p type="p">101:外軌</p>
        <p type="p">102:中軌</p>
        <p type="p">103:內軌</p>
        <p type="p">1:基座單元</p>
        <p type="p">11:外框架</p>
        <p type="p">111:外連接部</p>
        <p type="p">12:基座</p>
        <p type="p">123:內接合部</p>
        <p type="p">13:內支架</p>
        <p type="p">131:蓋體部</p>
        <p type="p">132:活動部</p>
        <p type="p">2:卡掣單元</p>
        <p type="p">22:驅動件</p>
        <p type="p">221:操作部</p>
        <p type="p">221a:操作面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="522" publication-number="202631048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌卡掣裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250223B">A47B88/49</main-classification>
        <further-classification edition="201701120250223B">A47B88/477</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富世達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSITEK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇家弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昶毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌卡掣裝置，設置在一滑軌，滑軌包括一外軌及一內軌。滑軌卡掣裝置包含一基座單元及一卡掣單元。基座單元包括一固接外軌的外框架、一適用於固接內軌的基座及一固接於基座的內支架，外框架具有一固接外軌的外連接部、一自外連接部遠離外軌延伸的卡合部及一連接外連接部及卡合部上緣的簷部，簷部形成一鎖定槽。卡掣單元包括一卡掣件、一驅動件、一鎖定件及一鎖定彈性件。卡掣件具有一可卡掣於卡合部的卡掣部，驅動件可驅動卡掣件樞轉使卡掣部解除與卡合部的卡掣關係。當內軌、基座及內支架相對於外軌移動至使鎖定部位於鎖定槽下方時，鎖定彈性件將向上推抵鎖定件使鎖定部卡掣於鎖定槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滑軌卡掣裝置</p>
        <p type="p">100:滑軌</p>
        <p type="p">101:外軌</p>
        <p type="p">102:中軌</p>
        <p type="p">103:內軌</p>
        <p type="p">1:基座單元</p>
        <p type="p">11:外框架</p>
        <p type="p">111:外連接部</p>
        <p type="p">12:基座</p>
        <p type="p">123:內接合部</p>
        <p type="p">13:內支架</p>
        <p type="p">131:蓋體部</p>
        <p type="p">132:活動部</p>
        <p type="p">2:卡掣單元</p>
        <p type="p">22:驅動件</p>
        <p type="p">221:操作部</p>
        <p type="p">221a:操作面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="523" publication-number="202633070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體結構的方法</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, JYUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李書銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種形成半導體結構的方法，包括以下步驟。於基底中形成多個位元線結構，其中各位元線結構包括位元線以及形成於位元線上且突出基底頂面上方的頂蓋層。於各位元線結構相對兩側壁上形成第一間隙壁。於各位元線結構相對兩側壁上形成覆蓋第一間隙壁及頂蓋層頂面的第二間隙壁層。於基底頂面上各位元線結構相對兩側壁上形成覆蓋第二間隙壁層的第三間隙壁。於基底頂面上形成覆蓋多個位元線結構、第三間隙壁、第二間隙壁層以及第一間隙壁的導電接墊層。圖案化導電接墊層，以形成多個導電接墊結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for forming a semiconductor structure, which includes following steps. Bit line structures are formed in the substrate. Each bit line structure includes a bit line and a capping layer formed thereon and protruding over a top surface of the substrate. First spacers are formed on opposite sidewalls of each bit line structure. A second spacer layer covering the first spacers and a top surface of the capping layer is formed on the opposite sidewalls of each bit line structure. Third spacers covering the second spacer layer are formed on the opposite sidewalls of each bit line structure on the top surface of the substrate. A conductive pad layer covering the bit line structures, the third spacers, the second spacer layer and the first spacers is formed on the top surface of the substrate. The conductive pad layer is patterned to form conductive pad structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">103:圖案層</p>
        <p type="p">110a:位元線結構</p>
        <p type="p">112:導電接觸件</p>
        <p type="p">114:障壁圖案</p>
        <p type="p">116:位元線</p>
        <p type="p">118a:頂蓋層</p>
        <p type="p">120a、120b:第一間隙壁</p>
        <p type="p">122、122a:第一材料層</p>
        <p type="p">124、124a:第二材料層</p>
        <p type="p">124ar、132ar:凹陷</p>
        <p type="p">126a、126b:第二間隙壁</p>
        <p type="p">132a、132b:第三間隙壁</p>
        <p type="p">142:障壁圖案</p>
        <p type="p">152:導電圖案</p>
        <p type="p">152o:開口</p>
        <p type="p">160:絕緣圖案</p>
        <p type="p">SP1:第一間隙壁結構</p>
        <p type="p">SP2:第二間隙壁結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="524" publication-number="202633233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250303B">H10H29/30</main-classification>
        <further-classification edition="202501120250303B">H10H29/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭漢浤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HAN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板包括基板、接合墊、發光元件、第一導電圖案、主動元件與導熱圖案。接合墊設置在基板上。發光元件設置在基板上且電性接合該接合墊。第一導電圖案設置在基板上且電性連接接合墊。主動元件設置在基板上且電性連接第一導電圖案。導熱圖案覆蓋並接觸第一導電圖案。導熱圖案在基板上的正投影部分重疊發光元件在基板上的正投影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a substrate, a bonding pad, a light-emitting device, a first conductive pattern, an active device and a thermally conductive pattern is provided. The bonding pad is disposed on the substrate. The light-emitting device is disposed on the substrate and is electrically connected to the bonding pad. The first conductive pattern is disposed on the substrate and is electrically connected to the bonding pad. The active device is disposed on the substrate and is electrically connected to the first conductive pattern. The thermally conductive pattern covers and contacts the first conductive pattern. An orthographic projection of the thermally conductive pattern on the substrate partially overlaps an orthographic projection of the light-emitting device on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">100:基板</p>
        <p type="p">100s:基板表面</p>
        <p type="p">105:遮光圖案</p>
        <p type="p">110:緩衝層</p>
        <p type="p">120:閘絕緣層</p>
        <p type="p">130:層間絕緣層</p>
        <p type="p">141、142:平坦層</p>
        <p type="p">151、152、153、154:鈍化層</p>
        <p type="p">154op:開口</p>
        <p type="p">180:導熱圖案</p>
        <p type="p">180e、CP1e、CP2e:邊緣</p>
        <p type="p">200:發光元件</p>
        <p type="p">210:磊晶結構層</p>
        <p type="p">221:第一電極</p>
        <p type="p">222:第二電極</p>
        <p type="p">250:焊錫</p>
        <p type="p">BP1:第一接合墊</p>
        <p type="p">BP2:第二接合墊</p>
        <p type="p">CH:通道區</p>
        <p type="p">CP1a、CP1b:第一導電圖案</p>
        <p type="p">CP2a、CP2b:第二導電圖案</p>
        <p type="p">d、d”:距離</p>
        <p type="p">DE:汲極</p>
        <p type="p">DR:汲極區</p>
        <p type="p">GE:閘極</p>
        <p type="p">LDR:輕摻雜汲極區</p>
        <p type="p">LSR:輕摻雜源極區</p>
        <p type="p">SC:半導體圖案</p>
        <p type="p">SE:源極</p>
        <p type="p">SR:源極區</p>
        <p type="p">T:主動元件</p>
        <p type="p">X、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="525" publication-number="202631988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>萃取外泌體的方法以及保護外泌體的方法</chinese-title>
        <english-title>METHOD OF EXTRACTING EXOSOME AND METHOD OF PROTECTING EXOSOME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250206B">C12N5/078</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶齡富錦生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANION &amp; BF BIOTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGAWA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏溥陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, PU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容的一些實施方式提供一種萃取外泌體的方法，包含：自離體血液中分離出富含血小板血漿，其中富含血小板血漿包含血漿以及懸浮於血漿中的血小板；將富含血小板血漿的血漿置換為包含殼聚醣的緩衝液，使得殼聚醣結合上血小板，獲得血小板緩衝液；以及將血小板緩衝液以超聲波震盪處理，使得外泌體自血小板中釋放，獲得包含外泌體的血小板裂解液。本揭示內容的另一些實施方式提供一種保護外泌體的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of extracting an exosome is provided in some embodiments, including: isolating a platelet-rich plasma from an ex-vivo blood, in which the platelet-rich plasma includes a blood plasma and a platelet suspended in the blood plasma; replacing the blood plasma of the platelet-rich plasma with a buffer solution including chitosan to allow chitosan to bind to a platelet to obtain a platelet buffer solution; and sonicating the platelet buffer solution to make an exosome release from the platelet to obtain a platelet lysate including the exosome. A method of protecting an exosome is provided in some embodiments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">S110、S120、S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="526" publication-number="202632912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>驅動器</chinese-title>
        <english-title>DRIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H04B1/02</main-classification>
        <further-classification edition="200601120250512B">H04L25/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智原科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARADAY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪裕程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高金泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱楓翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, FENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種驅動器。驅動器包含：切換信號產生電路、比較電路、驅動電路與埠控制模組。切換信號產生電路產生上拉路徑正相切換信號、上拉路徑反相切換信號、下拉路徑正相切換信號以及下拉路徑反相切換信號。比較電路的正相比較器輸入端電連接於驅動器輸出端點。比較電路的反相比較器輸出端電連接於上拉電晶體閘控端點。驅動電路包含：上拉電路與下拉電路。上拉電路與下拉電路根據上拉電晶體閘控端點和下拉電晶體閘控端點的電壓而選擇性調整驅動器輸出端點的電壓。埠控制模組設定上拉電晶體閘控端點和下拉電晶體閘控端點的電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver is provided. The driver includes a switch-signal generation circuit, a comparison circuit, a driving circuit, and a port control module. The switch-signal generation circuit generates an upper-path non-inverting phase switch signal, an upper-path inverting-phase switch signal, a lower-path non-inverting phase switch signal, and a lower-path inverting-phase switch signal. A non-inverting phase comparator input node of the comparison circuit is electrically connected to a driving output node. An inverting-phase comparator input node is electrically connected to an upper transistor gating node. The driving circuit includes a pull-up circuit and a pull-down circuit. The pull-up circuit and the pull-down circuit selectively adjust the voltage of the driving output node according to the upper transistor gating node and the lower transistor gating node. The port control module sets the voltage of the upper transistor gating node and the voltage of the lower transistor gating node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">portDRV:驅動器</p>
        <p type="p">inDAT:驅動器輸入信號</p>
        <p type="p">EN:驅動器致能信號</p>
        <p type="p">portCltrMDL:埠控制模組</p>
        <p type="p">cfCKT:比較電路</p>
        <p type="p">swGenCKT:切換信號產生電路</p>
        <p type="p">SW_P:上拉路徑正相切換信號</p>
        <p type="p">SWB_P:上拉路徑反相切換信號</p>
        <p type="p">SW_N:下拉路徑正相切換信號</p>
        <p type="p">SWB_N:下拉路徑反相切換信號</p>
        <p type="p">cfin+:正相比較器輸入端</p>
        <p type="p">cfin-:反相比較器輸入端</p>
        <p type="p">cfout+:正相比較器輸出端</p>
        <p type="p">cfout-:反相比較器輸出端</p>
        <p type="p">outSIG:驅動器輸出信號</p>
        <p type="p">Vcc:供應電壓(端點)</p>
        <p type="p">Gnd:接地電壓(端點)</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">DRV:驅動電路</p>
        <p type="p">ND&lt;sub&gt;out&lt;/sub&gt;:驅動器輸出端點</p>
        <p type="p">ND&lt;sub&gt;NG18&lt;/sub&gt;:下拉電晶體閘控端點</p>
        <p type="p">ND&lt;sub&gt;PG18&lt;/sub&gt;:上拉電晶體閘控端點</p>
        <p type="p">compCKT:補償電路</p>
        <p type="p">addEnCKT:附加電流啟用電路</p>
        <p type="p">IQ_extEN:附加電流路徑外部致能信號</p>
        <p type="p">IQ_EN:附加電流路徑致能信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="527" publication-number="202633211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測裝置製作方法</chinese-title>
        <english-title>IMAGE SENSING DEVICE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250401B">H10F77/40</main-classification>
        <further-classification edition="202501120250401B">H10F71/00</further-classification>
        <further-classification edition="202501120250401B">H10F39/12</further-classification>
        <further-classification edition="202501120250401B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冠晶光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GCSOL TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JYUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品屹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鈺淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像感測裝置，影像感測裝置包含影像感測結構、圍堤層、第一光學多層膜結構以及蓋板玻璃。影像感測結構包含基板及像素陣列。第一光學多層膜結構包含第一保護層及第一光學膜。第一保護層設置於圍堤層的一側且遮擋像素陣列，第一保護層適於抵抗化學蝕刻。第一光學膜疊設於第一保護層遠離圍堤層的一側。蓋板玻璃設置於第一光學多層膜結構。光線穿越蓋板玻璃及第一光學多層膜結構並照射像素陣列，像素陣列將光線轉換為電訊號。藉此，透過設置第一保護層抵抗化學蝕刻，可解決化學蝕刻導致光學損失的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an image sensing device. The image sensing device includes an image sensing structure, a die attaching material layer, a first optical multilayer structure and a covering glass. The image sensing structure includes a substrate and a pixel array. The first optical multilayer structure includes a first protecting layer and a first optical layer. The first protecting layer is disposed at one side of the die attaching material layer and covers the pixel array. The first protecting layer is suitable for resisting the chemical etching. The first optical layer is disposed at one side of the first protecting layer which is away from the die attaching material layer. The covering glass is disposed at the first optical multilayer structure. A light passes through the covering glass and the first optical multilayer structure, and the light irradiates the pixel array. The pixel array transforms the light into an electrical signal. Therefore, a problem that the chemical etching results in optical loss can be solved by disposing the first protecting layer to resist the chemical etching.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像感測裝置</p>
        <p type="p">110:影像感測結構</p>
        <p type="p">111:基板</p>
        <p type="p">1111:感測區</p>
        <p type="p">1112:非感測區</p>
        <p type="p">112:像素陣列</p>
        <p type="p">120:圍堤層</p>
        <p type="p">130:第一光學多層膜結構</p>
        <p type="p">131:第一光學膜</p>
        <p type="p">132:第一保護層</p>
        <p type="p">150:蓋板玻璃</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="528" publication-number="202633096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊式電容器裝置及其製造方法</chinese-title>
        <english-title>STACKED CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D1/68</main-classification>
        <further-classification edition="202301120260302B">H10N97/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳金能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIN-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張碩哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHUO-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種堆疊式電容器裝置，包括至少一第一晶粒、至少一第二晶粒以及多個穿孔結構。第一晶粒的第一表面設置有第一電容元件，第二晶粒的第一表面設置有第二電容元件，且第二晶粒的第一表面朝向第一晶粒的第一表面。多個穿孔結構自第二晶粒的第二表面延伸穿過第二晶粒，並分別耦接至第一電容元件與第二電容元件。第一晶粒的數量為一個或多個。第二晶粒的數量為一個或多個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stacked capacitor device of this invention is provided, the stacked capacitor includes at least one first die, at least one second die, and a plurality of through via structures. A first capacitor element is disposed on a first surface of the first die, a second capacitor element is disposed on a first surface of the second die, and the first surface of the second die faces towards the first surface of the first die. The through via structures extend from a second surface of the second die through the second die and are respectively coupled to the first capacitor element and the second capacitor element. The number of the first dies is one or more. The number of the second dies is one or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:堆疊式電容器裝置</p>
        <p type="p">ss1、ss2:半導體基底</p>
        <p type="p">102a、102b、106a、106b:氧化層</p>
        <p type="p">V1、V2:穿孔結構</p>
        <p type="p">104a、104b:BEOL絕緣層</p>
        <p type="p">W1、W2:內連線層</p>
        <p type="p">108:硬罩幕層</p>
        <p type="p">110:襯墊層</p>
        <p type="p">112:重佈線絕緣層</p>
        <p type="p">114:導電線</p>
        <p type="p">116:重佈線通孔</p>
        <p type="p">118:接墊</p>
        <p type="p">BS:接合面</p>
        <p type="p">C1:第一電容元件</p>
        <p type="p">C2:第二電容元件</p>
        <p type="p">RDL:重佈線層</p>
        <p type="p">S1:第一晶粒</p>
        <p type="p">S2:第二晶粒</p>
        <p type="p">S1&lt;sub&gt;1&lt;/sub&gt;、S2&lt;sub&gt;1&lt;/sub&gt;:第一表面</p>
        <p type="p">S2&lt;sub&gt;2&lt;/sub&gt;:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="529" publication-number="202633103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/01</main-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202601120260302B">H10P30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱玉蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置的製造方法，包括：在一基板中形成一井區，其中基板具有一接面場效電晶體區相鄰於井區；在井區中形成一源極區；執行一植入製程，以井區位於源極區以及接面場效電晶體區之間的一部份形成一表面摻雜區；沿著表面摻雜區的一上表面和接面場效電晶體區的一上表面形成一介電層；以及在介電層上形成一閘極結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating a semiconductor device, including: forming a well region in a substrate, in which the substrate has a junction field effect transistor region adjacent to the well region; forming a source region in the well region; performing an implantation process to form a surface doped region in a portion of the well region between the source region and the junction field effect transistor region; forming a dielectric layer along an upper surface of the surface doped region and an upper surface of the junction field effect transistor region; and forming a gate structure on the dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">105:基板區</p>
        <p type="p">110:飄移區</p>
        <p type="p">115:JFET區</p>
        <p type="p">120:井區</p>
        <p type="p">121:表面摻雜區</p>
        <p type="p">130:第一摻雜區</p>
        <p type="p">140:第二摻雜區</p>
        <p type="p">160:介電層</p>
        <p type="p">200:閘極結構</p>
        <p type="p">300:源極電極</p>
        <p type="p">400:汲極電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="530" publication-number="202632826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子保險絲電路及重置電路</chinese-title>
        <english-title>ELECTRONIC FUSE CIRCUIT AND RESET CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">H02H3/08</main-classification>
        <further-classification edition="200601120250613B">H02H3/093</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王國任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUO-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃溫仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供的電子保險絲電路與負載裝置耦接於輸出節點，並包含保險絲開關、電荷汞電路、電流轉電壓電路及重置電路。保險絲開關接收輸入電壓以在輸出節點產生輸出電壓，並產生輸出電流至輸出節點。電荷汞電路耦接於第一節點，並依據在第一節點的節點電壓控制保險絲開關以控制輸出電壓。電流轉電壓電路耦接於保險絲開關及第二節點，並轉換輸出電流以在第二節點產生電流相依電壓。重置電路耦接於第一節點及第二節點，並響應於超過電流閾值的輸出電流，在經過與電流閾值匹配的反應時間之後，控制節點電壓以觸發電荷汞電路關斷保險絲開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic fuse circuit coupled to a load device at an output node and including a fuse switch, a charge pump circuit, a current to voltage circuit and a reset circuit. The fuse switch receives an input voltage to generate an output voltage at the output node, and generates an output current to the output node. The charge pump circuit is coupled to a first node, and controls the fuse switch according to a node voltage at the first node to control the output voltage. The current to voltage circuit is coupled to the fuse switch and a second node, and converts the output current to generate a current dependent voltage at the second node. The reset circuit is coupled to the first node and the second node, and in response to the output current exceeding a current threshold, controls the node voltage to trigger the charge pump circuit to turn off the fuse switch after a reaction time matching the current threshold passes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:負載裝置</p>
        <p type="p">100:電子保險絲電路</p>
        <p type="p">101:保險絲開關</p>
        <p type="p">102:電荷汞電路</p>
        <p type="p">103:電流轉電壓電路</p>
        <p type="p">104:重置電路</p>
        <p type="p">141:過電流響應電路</p>
        <p type="p">142:反應時間產生電路</p>
        <p type="p">143:禁能電路</p>
        <p type="p">IL:輸出電流</p>
        <p type="p">NA,NC:節點</p>
        <p type="p">NIN:輸入節點</p>
        <p type="p">NOUT:輸出節點</p>
        <p type="p">S1,S2:指示訊號</p>
        <p type="p">VA:電流相依電壓</p>
        <p type="p">VC:節點電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="531" publication-number="202632779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線結構和電子裝置</chinese-title>
        <english-title>ANTENNA DEVICE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250331B">H01Q1/22</main-classification>
        <further-classification edition="200601120250331B">H01Q1/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朝堉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官尚儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, SHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種天線結構及電子裝置。天線結構包含基板、天線結構層、饋電線和接地層。基板具有表面。天線結構層設置在表面上，且具有邊緣。饋電線設置在基板，且電性連接天線結構層。饋電線具有饋入端。接地層設置在表面上，且具有內邊緣。內邊緣環繞至少部分的天線結構層。內邊緣與邊緣之間具有最短距離，且最短距離介於1至15倍的饋電線的寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna structure and an electronic device are provided. The antenna structure includes a substrate, an antenna structure layer, a feed line and a ground layer. The substrate has a surface. The antenna structure layer is disposed on the surface and has an edge. The feed line is disposed on the substrate and connected to the antenna structure layer. The feed line has a feed point. The ground layer is disposed on the surface and has an inner edge. At least part of the antenna structure layer is surrounded by the inner edge. There is a shortest distance between the inner edge and the edge, and the shortest distance is between one and fifteen times the width of the feed line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:天線結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:天線結構層</p>
        <p type="p">120E:邊緣</p>
        <p type="p">121:輻射部</p>
        <p type="p">121a,121b,121c,121d:外邊線</p>
        <p type="p">130:饋電線</p>
        <p type="p">131:饋入端</p>
        <p type="p">140:第一接地層</p>
        <p type="p">141:內邊緣</p>
        <p type="p">141a:第一邊長</p>
        <p type="p">141b:第二邊長</p>
        <p type="p">141c:第三邊長</p>
        <p type="p">141d:第四邊長</p>
        <p type="p">142:外邊緣</p>
        <p type="p">143:條狀空隙</p>
        <p type="p">144:接地條</p>
        <p type="p">144a:缺口</p>
        <p type="p">160:導電體</p>
        <p type="p">D1,D2,D3,D4:距離</p>
        <p type="p">P1,P2:間距</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="532" publication-number="202632778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路傳輸結構及電路板</chinese-title>
        <english-title>CIRCUIT TRANSMISSION STRUCTURE AND CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01P3/08</main-classification>
        <further-classification edition="200601120250303B">H05K1/09</further-classification>
        <further-classification edition="200601120250303B">H05K7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星系科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉程陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪冬華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, DONG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周國冰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, GUO-BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種電路傳輸結構，包含：第一微帶線以及一低頻或直流信號源。該第一微帶線設置在兩條用以傳送高頻信號的信號線之間，其中該第一微帶線的邊緣具有亞波長週期結構。該低頻或直流信號源連接至該第一微帶線的一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a circuit transmission structure, including: a first microstrip line and a low-frequency or direct current signal source. The first microstrip line is arranged between two signal lines for transmitting high-frequency signals, wherein the edge of the first microstrip line has a sub-wavelength periodic structure. The low frequency or direct current signal source is connected to one end of the first microstrip line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1、2、3、4:端口</p>
        <p type="p">10:第一微帶線</p>
        <p type="p">101:電路傳輸結構</p>
        <p type="p">H:高頻信號</p>
        <p type="p">H1、H2:信號線</p>
        <p type="p">L1:第一低頻或直流信號源</p>
        <p type="p">SPM:亞波長週期結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="533" publication-number="202631155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療p53基因突變或缺陷陰性癌症、腫瘤患者</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">A61K31/675</main-classification>
        <further-classification edition="200601120250401B">A61K31/496</further-classification>
        <further-classification edition="200601120250401B">A61K31/664</further-classification>
        <further-classification edition="200601120250401B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳艾欣達偉醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCENTAWITS PHARMACEUTICALS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段建新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, JIANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊天陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, TIANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟　繁英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, FANYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王易之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供含有DNA烷化劑前藥化合物的藥物單藥或聯用其他藥物治療p53基因突變或缺陷陰性癌症、腫瘤患者的方法，以及製藥用途。特別地，DNA烷化劑前藥化合物選自乏氧活化的DNA烷化劑前藥化合物、AKR1C3活化的DNA烷化劑前藥化合物、β-葡萄糖苷酶（β-D-Glucosidase）或者β-半乳糖苷酶（β-galactosidase）啟動的DNA烷化劑前藥化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="534" publication-number="202632962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像串流傳輸系統及其具有動態影像編碼機制的影像串流傳輸裝置與方法</chinese-title>
        <english-title>VIDEO STREAM TRANSMISSION SYSTEM, APPARATUS AND METHOD HAVING DYNAMIC VIDEO ENCODING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250502B">H04N21/47</main-classification>
        <further-classification edition="201101120250502B">H04N21/234</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周開祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有動態影像編碼機制的影像串流傳輸裝置，包含：影像編碼電路、通訊電路以及控制電路。控制電路配置以：在環境測試階段控制影像編碼電路產生具有複數不同測試位元速率的複數測試影像畫面；控制通訊電路將測試影像畫面透過網路傳送至遠端裝置進行解碼，並自遠端裝置透過網路接收複數操作訊號；對測試影像畫面的傳送以及操作訊號的接收計算複數測試往返時間；以及控制影像編碼電路根據測試往返時間中的最小測試往返時間以及遠端裝置的解碼能力決定影像編碼策略，在遊戲進行階段產生與傳送複數遊戲影像畫面至該遠端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video stream transmission apparatus having a dynamic video encoding mechanism is provided that includes a video encoding circuit, a communication circuit and a control circuit configured to perform steps outlined below. The video encoding circuit is controlled to generate test image frames having different test bit rates in an environment test stage. The communication circuit is controlled to transmit the test image frames to a remote apparatus through a network to be decoded and receive operation signals from the remote apparatus through the network. Round-trip times are calculated according to the transmission of the test image frames and the receiving of the operation signals. The video encoding circuit is controlled to determine an encoding strategy according to a smallest round-trip time and a decoding ability of the remote apparatus to generate and transmit game image frames to the remote apparatus in a game performing stage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像串流傳輸系統</p>
        <p type="p">110:遠端裝置</p>
        <p type="p">115:通訊電路</p>
        <p type="p">120:影像解碼電路</p>
        <p type="p">130:顯示設備</p>
        <p type="p">140:遊戲操作設備</p>
        <p type="p">150:影像串流傳輸裝置</p>
        <p type="p">160:影像編碼電路</p>
        <p type="p">170:通訊電路</p>
        <p type="p">180:控制電路</p>
        <p type="p">190:網路</p>
        <p type="p">GIF:遊戲影像畫面</p>
        <p type="p">GRT:遊戲往返時間</p>
        <p type="p">OPS:操作訊號</p>
        <p type="p">TIF:測試影像畫面</p>
        <p type="p">TRT:測試往返時間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="535" publication-number="202632465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦之開合檢測方法及筆記型電腦</chinese-title>
        <english-title>LAPTOP OPENING AND CLOSING DETECTION METHODS AND LAPTOP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250805B">G06F1/16</main-classification>
        <further-classification edition="200601120250805B">H05K13/00</further-classification>
        <further-classification edition="200601120250805B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商敦泰電子（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOCALTECH ELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯衛京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, WEI-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳箭霧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種筆記型電腦之開合檢測方法及筆記型電腦，所述筆記型電腦包括導電接地件及觸控屏，所述導電接地件設置於所述筆記型電腦之底座，所述開合檢測方法包括：從所述觸控屏中劃分出至少一開合檢測區域，並驅動所述開合檢測區域內觸控電極，所述開合檢測區域包括至少一所述觸控電極；獲取所述開合檢測區域之各個觸控電極與所述導電接地件之間之電容感應量；根據所述電容感應量獲得所述筆記型電腦之開合角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laptop opening and closing detection methods and laptop. a laptop computer includes an electrically conductive grounding member and a touch screen, the electrically conductive grounding member being provided in a base of the laptop computer. opening and closing detection methods includes: dividing at least one opening and closing detection region from the touch screen, and actuating the touch electrodes in the opening and closing detection region, the opening and closing detection region comprising at least one of the said touch electrodes; obtaining the capacitance inductance between each touch electrode in the opening and closing detection region and the conductive ground member; Obtaining the opening and closing angle of a laptop based on capacitive inductance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31~S33:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="536" publication-number="202632202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流道結構</chinese-title>
        <english-title>FLOW CHANNEL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">F28F1/02</main-classification>
        <further-classification edition="200601120250214B">F28F9/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林培仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊馥綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳煥晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流道結構，包括基板，基板上設有流體通道和隔熱腔；其中，流體通道供導熱介質流動，且流體通道的數量設為至少兩個，至少兩個流體通道中任意相鄰兩個流體通道間隔設置，且至少兩個流體通道中任意相鄰兩個流體通道之間均設有隔熱腔；隔熱腔內設有隔熱介質，隔熱介質被配置為阻止其所在隔熱腔的相鄰兩個流體通道內的導熱介質熱交換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a flow channel structure. The flow channel structure comprises a substrate, the substrate is provided with a fluid passage and a heat insulating cavity. The fluid passage is provided for the flow of the heat insulating medium, and the number of the fluid passages is set to at least two, the interval between any two adjacent fluid passages in at least two fluid passages is set, and the heat insulating cavity is provided between any adjacent two fluid passages in at least two fluid passages. A heat insulating medium is provided in the heat insulating cavity and is configured to prevent the heat exchange of the heat insulating medium in two adjacent fluid passages of the heat insulating cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流道結構</p>
        <p type="p">X:第一方向</p>
        <p type="p">Z:第二方向</p>
        <p type="p">Y:第三方向</p>
        <p type="p">10:基板</p>
        <p type="p">11:第一區部</p>
        <p type="p">12:第二區部</p>
        <p type="p">13:開口</p>
        <p type="p">14:連接部</p>
        <p type="p">15:卡接槽</p>
        <p type="p">20:流體通道</p>
        <p type="p">21:第一流道</p>
        <p type="p">22:第二流道</p>
        <p type="p">30:隔熱腔</p>
        <p type="p">40:預留部</p>
        <p type="p">41:第三流道</p>
        <p type="p">42:進出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="537" publication-number="202632492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>程式間通訊方法、電子設備及存儲介質</chinese-title>
        <english-title>COMMUNICATION METHOD BETWEEN APPLICATIONS, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250602B">G06F8/30</main-classification>
        <further-classification edition="201801120250602B">G06F8/00</further-classification>
        <further-classification edition="200601120250602B">G06F9/06</further-classification>
        <further-classification edition="202301120250602B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉世威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供一種程式間通訊方法、電子設備及存儲介質，所述方法包括：基於元件庫和應用程式介面，創建應用程式的前端程式；基於工具箱和業務流程，創建所述應用程式的後端程式；基於user32系統視窗通訊原理，所述後端程式將資料發送至所述前端程式；所述前端程式接收並顯示所述後端程式發送的所述資料。本申請實施例可以基於user32系統視窗通訊原理實現應用程式的前端程式和後端程式之間的資料通訊，使得前端開發和後端開發可以獨立進行，無需高級開發工程師同時負責前端開發和後端開發，有效減少了軟體發展所需的人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a communication method between applications, an electronic device, and a storage medium. The method includes: creating front-end programs for an application based on a component library and an application interface; creating back-end programs for the application based on a toolbox and business processes; the back-end program transmitting data to the front-end program, based on a user32 system window communication principle; the front-end program receiving and displaying the data transmitted by the back-end program. The present application can realize data communication between the front end programs and the back end programs of the application based on the windows communication principle of the user32 system, so that the front end development and the back end development can be carried out independently, without requirement for senior development engineers to be responsible for the front end development and the back end development at the same time, thereby effectively reducing labor cost required for software development.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101-S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="538" publication-number="202632675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共享藥局系統及其實施方法</chinese-title>
        <english-title>SHARED PHARMACY SYSTEM AND METHOD FOR USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251027B">G16H10/60</main-classification>
        <further-classification edition="201801120251027B">G16H20/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲景醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONGJING MEDICINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇超麒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHAO CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑩瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種共享藥局系統及其實施方法，可由多家中醫診所分別藉由一診所端平台，針對病患的就診狀況開立一電子處方箋，上傳至一雲端伺服器，以統一將各診所開立的電子處方箋發送至一煎藥平台中的一接單模組，使煎藥人員可依據處方內容進行審方計價、同時將藥材內容記錄於一調劑模組，從而完成一藥品成品的製作，如此，可進一步將費用訊息傳送至中醫診所，同時，基於一配送模組所記錄的藥物配送方式，供病患自行前往診所領藥、或安排醫療人員將藥物配送到府。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:共享藥局系統</p>
        <p type="p">11:雲端伺服器</p>
        <p type="p">111:中央處理模組</p>
        <p type="p">112:權限管理模組</p>
        <p type="p">113:用藥分析模組</p>
        <p type="p">114:處方箋資料庫</p>
        <p type="p">115:藥材資料庫</p>
        <p type="p">116:病歷資料庫</p>
        <p type="p">12:診所端平台</p>
        <p type="p">121:預約模組</p>
        <p type="p">122:病歷紀錄模組</p>
        <p type="p">123:處方箋開立模組</p>
        <p type="p">124:庫存管理模組</p>
        <p type="p">13:煎藥平台</p>
        <p type="p">131:接單模組</p>
        <p type="p">132:計價模組</p>
        <p type="p">133:調劑模組</p>
        <p type="p">134:配送模組</p>
        <p type="p">14:使用者端裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="539" publication-number="202631273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物料盒之門片的濕清洗方法</chinese-title>
        <english-title>WET CLEANING METHOD OF DOOR OF FOUP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B9/093</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科嶠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA NEO TECH INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉步章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭朝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈維揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物料盒之門片的濕清洗方法，包括水平置放該門片，使該門片具有環狀氣密膠圈的一內表面朝上顯露，並使該門片具有多個機能槽孔的一外表面朝下顯露，並且供應清洗液由上往下沖洗該門片的所述內表面及所述氣密膠圈，其中該清洗液的沖洗路徑排除通過所述外表面及所述機能槽孔，避免清洗液流入該門片的一內艙成為不易去除的積水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wet cleaning method of door of foup, including placing the door horizontally, so that a inner surface of the door with an annular rubber ring is exposed upwards, and an outer surface of the door with a plurality of functional slots is exposed downwards, and the inner surface of the door and the rubber ring are flushed from top to bottom by supplying cleaning liquid, wherein the flushing path of the cleaning liquid is excluded through the outer surface and the functional slots, so as to avoid the cleaning liquid flowing into one of the inner compartments of the door and become stagnant water that is not easy to remove.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="540" publication-number="202631036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傘柄結構</chinese-title>
        <english-title>HANDLE STRUCTURE FOR UMBRELLA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250527B">A45B25/00</main-classification>
        <further-classification edition="200601120250527B">A45B25/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡文修</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種傘柄結構，適用於一傘具上，傘柄結構包括：一套筒及一連接於傘具的滑動件。套筒具有一第一限位部及一第一卡合部，滑動件具有一止擋部及一第二卡合部，並且可在一使用位置及一收納位置之間位移。當傘具位於套筒外，滑動件位移至使用位置，並且止擋部抵頂於第一限位部，第一卡合部與第二卡合部相互卡合，以及當傘具收納於套筒內，滑動件位移至收納位置，並且止擋部與第一限位部分離，第二卡合部脫離第一卡合部。因此，本發明兼具操作簡單及收納方便等優點及功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a handle structure for an umbrella, which is applicable to an umbrella and comprises a sleeve and a sliding member connected to the umbrella. The sleeve includes a first limiting portion and a first engaging portion. The sliding member includes a stopping portion and a second engaging portion and is capable of moving between a usage position and a storage position. When the umbrella is outside the sleeve, the sliding member moves to the usage position, and the stopping portion abuts against the first limiting portion. The first engaging portion and the second engaging portion interlock with each other. When the umbrella is stored inside the sleeve, the sliding member moves to the storage position, and the stopping portion disengages from the first limiting portion while the second engaging portion separates from the first engaging portion. Therefore, the present invention provides the advantages and benefits of simple operation and convenient storage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:傘具</p>
        <p type="p">10:套筒</p>
        <p type="p">11:第一限位部</p>
        <p type="p">12:第一卡合部</p>
        <p type="p">20:滑動件</p>
        <p type="p">2011:組裝孔</p>
        <p type="p">21:止擋部</p>
        <p type="p">222:滾珠</p>
        <p type="p">223:彈性元件</p>
        <p type="p">B:限位端</p>
        <p type="p">Z:軸向</p>
        <p type="p">O:墊圈</p>
        <p type="p">P1:使用位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="541" publication-number="202632682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫療模型構建方法、系統及其儲存媒體</chinese-title>
        <english-title>A METHOD FOR CONSTRUCTING A MEDICAL MODEL, SYSTEM AND STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251001B">G16H50/20</main-classification>
        <further-classification edition="201801120251001B">G16H10/60</further-classification>
        <further-classification edition="202301120251001B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張詠淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃婷韵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏均宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於構建醫療模型的方法以及醫療模型被公開。醫療模型被配置為根據目標患者的資訊預測診斷結果，方法包括：獲取醫療機構的一第一數據集，其中該第一數據集包括一第一結構化數據和一第一非結構化數據，第一結構化數據和第一非結構化數據的表現形式均為文字形式；將該第一數據集預處理為一第二數據集，其中該第二數據集包括一第二結構化數據和一第二非結構化數據；基於該第二結構化數據得到一第一類數據，利用一雙向長短期記憶網路處理該第二非結構化數據，得到一第二類數據，並對該第二非結構化數據進行語言特徵提取，得到一第三類數據；將該第一類數據、該第二類數據和該第三類數據融合成一融合結果，並利用一歸一化指數函數處理該融合結果，得到該診斷結果。該醫療模型可以預測患者的病情來識別潛在的重症患者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for constructing a medical model and a medical model are disclosed. The medical model is configured to predict a diagnosis result based on information of target patients, and the method comprising: acquiring a first data set of a medical institution, wherein the first data set comprises a first structured data and a first unstructured data, and the first structured data and the first unstructured data are both in text form; preprocessing the first data set into a second data set, the second data set comprises a second structured data and a second unstructured data; obtaining a first type of data based on the second structured data, and processing the second unstructured data by a bidirectional long short-term memory network to obtain a second type of data, and extracting language features from the second unstructured data to obtain a third type of data; fusing the first type of data, the second type of data, and the third type of data, and processing the fused result using a softmax to obtain the diagnosis result. The medical model can predict patients' outcomes to identify potential critical patients.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="542" publication-number="202631049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>把手的開關切換機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250324B">A47B88/90</main-classification>
        <further-classification edition="200601120250324B">A47B95/02</further-classification>
        <further-classification edition="200601120250324B">H05K7/18</further-classification>
        <further-classification edition="200601120250324B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種把手的開關切換機構尤指適用於安裝至第一軌，第一軌活動安裝於第二軌，第二軌具有第一通孔，把手的開關切換機構包括：把手、作動件、弧形導引件與耳鎖，把手具有突出部，作動件活動安裝於第一軌內側，作動件開設鏤空部，鏤空部相對二側分別彎折延伸具有側牆，弧形導引件一端連接作動件前端，弧形導引件另一端抵持突出部，其具有第一狀態與第二狀態，耳鎖後端樞接第一軌，耳鎖前端活動設置於側牆，藉此當第一狀態時，而耳鎖位於第一通孔，耳鎖抵持側牆，使第一軌與第二軌彼此處於鎖定狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">110:把手</p>
        <p type="p">114:傳動軸</p>
        <p type="p">116:突出部</p>
        <p type="p">120:第一彈性件</p>
        <p type="p">130:作動件</p>
        <p type="p">130F:作動件前端</p>
        <p type="p">134:側牆</p>
        <p type="p">134V:頂端</p>
        <p type="p">136:第一延伸段</p>
        <p type="p">137:弧形導引件</p>
        <p type="p">140:耳鎖</p>
        <p type="p">140B:耳鎖後端</p>
        <p type="p">140F:耳鎖前端</p>
        <p type="p">142:卡合部</p>
        <p type="p">160:第二彈性件</p>
        <p type="p">170:操作件</p>
        <p type="p">170B:後端</p>
        <p type="p">170F:前端</p>
        <p type="p">180:安全鎖</p>
        <p type="p">200:第一軌</p>
        <p type="p">300:第三軌</p>
        <p type="p">400:第二軌</p>
        <p type="p">410:第二通孔</p>
        <p type="p">FT:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="543" publication-number="202632944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影影像融合校正的方法、投影影像融合校正系統與非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>SYSTEM, METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM FOR PROJECTION IMAGE FUSION CORRECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H04N9/31</main-classification>
        <further-classification edition="200601120250602B">H04N9/12</further-classification>
        <further-classification edition="202401120250602B">G06T3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昆山揚皓光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC PROJECTION (KUNSHAN) CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭嘉恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIAHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">投影影像融合校正的方法、投影影像融合校正系統與非暫態電腦可讀取記錄媒體。所述方法包括：在電子裝置與多個投影機通訊連接之後，控制各投影機投影，以在投影面上成多個校正影像；透過影像擷取器產生包括對應多個校正影像的成像區域的擷取影像；傳送包括擷取影像的融合資訊至人工智慧演算模組進行識別分析處理，而產生調整資訊；根據調整資訊以及投影機資訊，產生調整指令；傳送調整指令至對應的投影機來進行投影參數的調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, a method and a non-transitory computer readable storage medium for projection image fusion are provided. The method includes: after the electronic apparatus communicates with multiple projectors, controlling each projector to project to form multiple corrected images on a projection surface; using an image capturer to generate a captured image including an imaging area corresponding to the corrected images; transmitting fusion information including the captured image to an artificial intelligence calculation module for recognition analysis and processing to generate adjustment information; generating an adjustment command based on the adjustment information and projector information; and transmitting the adjustment command to the corresponding projector to adjust projection parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S205~S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="544" publication-number="202631926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加熱接合用片材及附切割帶之加熱接合用片材</chinese-title>
        <english-title>THERMAL BONDING SHEET, AND DICING TAPE EQUIPPED THERMAL BONDING SHEET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">C09J7/30</main-classification>
        <further-classification edition="200601120260504B">B23K35/02</further-classification>
        <further-classification edition="200601120260504B">B23K35/36</further-classification>
        <further-classification edition="202601120260504B">H10P72/70</further-classification>
        <further-classification edition="202601120260504B">H10W40/25</further-classification>
        <further-classification edition="202601120260504B">H10W72/00</further-classification>
        <further-classification edition="202601120260504B">H10W72/30</further-classification>
        <further-classification edition="202601120260504B">H10W72/50</further-classification>
        <further-classification edition="202601120260504B">H10W74/00</further-classification>
        <further-classification edition="202601120260504B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三田亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤麻由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種加熱接合用片材，其具備有機黏合劑之分散性良好之密接層。&lt;br/&gt;本發明提供一種加熱接合用片材，其具備包含燒結性粒子之燒結前驅物層、及重疊於該燒結前驅物層之一個面上之密接層，上述密接層包含有機黏合劑與燒結性粒子，上述密接層中之上述燒結性粒子之含有率為5體積%以上且40體積%以下，對上述密接層中包含之上述燒結性粒子進行粒度分佈測定時之粒度分佈具有至少2個峰頂點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a thermal bonding sheet including a close adhesion layer with good dispersibility of an organic binder.&lt;br/&gt;Provided is a thermal bonding sheet including: a sinter precursor layer including sinterable particles; and a close adhesion layer superposed on one surface of the sinter precursor layer. The close adhesion layer includes an organic binder and the sinterable particles, a content percentage of the sinterable particles in the close adhesion layer is 5 volume % or more and 40 volume % or less, and a particle size distribution measured for the sinterable particles included in the close adhesion layer has at least two peaks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:密接層</p>
        <p type="p">2:燒結前驅物層</p>
        <p type="p">3:成分遷移防止層</p>
        <p type="p">10:加熱接合用片材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="545" publication-number="202631754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於表面處理之製劑</chinese-title>
        <english-title>PREPARATIONS FOR THE TREATMENT OF SURFACES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F220/20</main-classification>
        <further-classification edition="200601120260504B">C08F224/00</further-classification>
        <further-classification edition="200601120260504B">C08G18/62</further-classification>
        <further-classification edition="200601120260504B">C08G18/71</further-classification>
        <further-classification edition="200601120260504B">C08G18/73</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C08G18/79</further-classification>
        <further-classification edition="200601120260504B">C08G18/80</further-classification>
        <further-classification edition="200601120260504B">C09D175/04</further-classification>
        <further-classification edition="200601120260504B">C09D201/06</further-classification>
        <further-classification edition="200601120260504B">D06M15/263</further-classification>
        <further-classification edition="200601120260504B">D06M15/273</further-classification>
        <further-classification edition="200601120260504B">D06M15/285</further-classification>
        <further-classification edition="200601120260504B">D06M15/356</further-classification>
        <further-classification edition="200601120260504B">D06M15/564</further-classification>
        <further-classification edition="200601120260504B">B27K3/15</further-classification>
        <further-classification edition="200601120260504B">C04B41/00</further-classification>
        <further-classification edition="200601120260504B">C04B41/48</further-classification>
        <further-classification edition="200601120260504B">C04B41/63</further-classification>
        <further-classification edition="200601120260504B">C04B41/83</further-classification>
        <further-classification edition="200601120260504B">D21H17/57</further-classification>
        <further-classification edition="200601120260504B">D21H19/30</further-classification>
        <further-classification edition="200601120260504B">D21H21/16</further-classification>
        <further-classification edition="200601320260504B">C04B111/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商魯道夫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUDOLF GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勒曼　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIELEMANN, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德霍特　安雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDHORST, ANJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀皮　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEPP, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海葛瑞特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEIMGREITER, JOHANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及含有聚胺酯及/或聚脲和共聚物的製劑，以及其作為表面處理用之無水劑的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="546" publication-number="202632392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及光學模組</chinese-title>
        <english-title>DISPLAY DEVICE AND OPTICAL MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02F1/1333</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙汝銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, RUMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JUNJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊曜誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAOCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含一機殼、一光學模組及一顯示面板。機殼包括由一邊框圍繞而成的一視窗口。光學模組設置於機殼內且包含一光學組件、一反射片及一接收器組件。反射片較光學組件遠離視窗口。反射片設有多個透光孔，這些透光孔位於視窗口投影至反射片上的一可視區域內。接收器組件位於反射片遠離光學組件的一側，且接收器組件對應於這些透光孔設置。顯示面板設置於機殼內且較光學組件靠近視窗口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a casing assembly, an optical module and a display panel. The casing assembly includes a viewing window formed by a bezel. The optical module is disposed in the casing assembly and includes an optical assembly, a reflection sheet and a receiver assembly. The reflection sheet is located farther away from the viewing window than the optical assembly. The reflection sheet is provided with a plurality of light penetration holes. The light penetration holes are located in a visible area on the reflection sheet where the viewing window is projected. The receiver assembly is located at one side of the reflection sheet located farther away from the optical assembly. The receiver assembly corresponds to the light penetration holes. The display panel is located in the casing assembly and is located closer to the viewing window than the optical assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機殼</p>
        <p type="p">11:外殼</p>
        <p type="p">111:背蓋</p>
        <p type="p">112:邊框</p>
        <p type="p">12:支撐架</p>
        <p type="p">20:光學模組</p>
        <p type="p">21:光學組件</p>
        <p type="p">22:反射片</p>
        <p type="p">221:主體部</p>
        <p type="p">23:接收器組件</p>
        <p type="p">24:組裝架</p>
        <p type="p">30:顯示面板</p>
        <p type="p">W:視窗口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="547" publication-number="202632340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導結構及顯示裝置</chinese-title>
        <english-title>OPTICAL WAVEGUIDE STRUCTURE AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250606B">G02B6/122</main-classification>
        <further-classification edition="200601120250606B">G02B6/34</further-classification>
        <further-classification edition="200601120250606B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業桓科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芸霈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊覲懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, JIN-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庭輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種光波導結構，包括：光波導及位於所述光波導同一表面且間隔設置的耦入光柵及耦出光柵；所述光波導包括相互拼接的第一導光部及第二導光部，所述第一導光部的折射率小於所述第二導光部的折射率，所述耦入光柵及所述耦出光柵在所述光波導上的正投影位於所述第一導光部上；所述耦入光柵用於將圖像光耦入所述光波導，使所述圖像光依次經過所述第一導光部、所述第二導光部、所述第一導光部後從所述耦出光柵耦出所述光波導。本申請還提供一種顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical waveguide structure including an optical waveguide, a coupling-in grating, and a coupling-out grating, the coupling-in grating and the coupling-out grating are on a same surface of the optical waveguide and are spaced apart from each other. The optical waveguide includes a first light-guiding portion and a second light-guiding portion spliced with each other. A refractive index of the first light-guiding portion is less than a refractive index of the second light-guiding portion. Orthographic projections of the coupling-in grating and the coupling-out grating on the optical waveguide are on the first light-guiding portion. The coupling-in grating is used to couple an image light into the optical waveguide, so that the image light passes through the first light-guiding portion, the second light-guiding portion and the first light-guiding portion in sequence and coupled out of the optical waveguide through the coupling-out grating. The present disclosure also provides a display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光波導結構</p>
        <p type="p">10:光波導</p>
        <p type="p">101:第一表面</p>
        <p type="p">102:第二表面</p>
        <p type="p">11:第一導光部</p>
        <p type="p">111:第一部分</p>
        <p type="p">112:第二部分</p>
        <p type="p">12:第二導光部</p>
        <p type="p">20:耦入光柵</p>
        <p type="p">30:耦出光柵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="548" publication-number="202632555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>任務資訊提供方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PROVIDING MISSION INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250502B">G06Q10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭秀京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SU GYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, YULE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關於一種任務資訊提供方法及其系統。根據本揭露一實施例的任務資訊提供方法可以包括如下步驟：獲取與使用者終端的使用者相關的第一任務的資訊；使用該第一任務的有效時間的資訊和當前時間的資訊，判斷該第一任務的狀態；基於判斷的該第一任務的狀態，確定表示該第一任務的資訊的至少一個介面元素的顯示形式；以及向該使用者終端提供包括確定的該顯示形式的至少一個介面元素的第一畫面，其中，第一任務的資訊包括第一條件的資訊，該第一條件要求從該有效時間的開始時間起的預設時間內發生預設事件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method and system for providing mission information. The method for providing mission information may include obtaining information on a first mission associated with a user of a user terminal, deciding a state of the first mission using information on a valid time of the first mission and information on a current time, determining a display form of at least one interface element indicating the information on the first mission based on the decided state of the first mission, and providing a first screen including the at least one interface element of the determined display form to the user terminal, wherein the information on the first mission may include information on a first condition requesting occurrence of a preset event within a preset time from a start point in time of the valid time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11、S12、S13、S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="549" publication-number="202632627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250917B">G09G3/32</main-classification>
        <further-classification edition="200601120250917B">G09G3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種電子裝置。電子裝置包括第一電晶體、第二電晶體、第三電晶體、第四電晶體、第一電容、第二電容以及可調元件。第二電晶體耦接第一電晶體的控制端。第一電容耦接在第一電晶體的第一端以及第二電晶體之間。第二電容耦接在第一電晶體的控制端以及第二電晶體之間。第一電容以及第二電容串聯連接在第一電晶體的第一端與控制端之間。第三電晶體耦接第二電容以及第一電晶體控制端之間的第一節點，並且用以接收第一電壓。第四電晶體耦接第二電容以及第二電晶體之間的第二節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is proposed. The electronic device includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor, a second capacitor, and a tunable component. The second transistor is coupled to the control terminal of the first transistor. The first capacitor is coupled between the first terminal of the first transistor and the second transistor. The second capacitor is coupled between the control terminal of the first transistor and the second transistor. The first capacitor and the second capacitor are connected in series between the first terminal and the control terminal of the first transistor. The third transistor is coupled to a first node between the second capacitor and the control terminal of the first transistor, and configured to receive a first voltage. The fourth transistor is coupled to a second node between the second capacitor and the second transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">P(1,1)~P(M,N):像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="550" publication-number="202632359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光引擎結構及光引擎結構的組裝方法</chinese-title>
        <english-title>OPTICAL ENGINE STRUCTURE AND ASSEMBLY METHOD OF OPTICAL ENGINE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250617B">G02B7/00</main-classification>
        <further-classification edition="202101120250617B">G02B7/02</further-classification>
        <further-classification edition="200601120250617B">G02B27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何鴻隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, HUNG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種光引擎結構，包括顯示器、合光組件、鏡頭組件、安裝框體及第一連接結構；顯示器用於發射圖像光；合光組件用於接收並透射圖像光，以改變圖像光的光路；鏡頭組件位於合光組件的出光面一側，用於調製來自出光面的圖像光後出射；安裝框體形成有一安裝空間，且開設有與安裝空間連通的出光口及入光口；合光組件位於安裝空間內；第一連接結構固定連接於安裝框體的出光口，第一連接結構具有連通出光口的第一開口，第一連接結構與鏡頭組件卡合連接，使鏡頭組件的光軸與合光組件的光軸重合。本申請還提供一種光引擎結構的組裝方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical engine structure including a display, a light-combining element, a lens assembly, a mounting frame and a first connection structure. The display is used to emit image light. The light-combining element is used to receive and transmit the image light to change an optical path of the image light. The lens assembly is on one side of the light-emitting surface of the light-combining element and is used to modulate the image light from the light-emitting surface. The mounting frame is provided with a mounting space, and a light outlet and a light inlet are provided in communication with the installation space. The light-combining element is in the mounting space. The first connection structure is fixed and connected to the light outlet of the mounting frame. The first connection structure has a first opening connecting the light outlet, and the first connection structure relates to the lens assembly, so that an optical axis of the lens assembly and an optical axis of the light-combining element coincide. The present disclosure also provides an assembly method for an optical engine structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示器</p>
        <p type="p">11:顯示部</p>
        <p type="p">12:電路板</p>
        <p type="p">13:連接器部</p>
        <p type="p">20:合光組件</p>
        <p type="p">201:出光面</p>
        <p type="p">202:入光面</p>
        <p type="p">30:鏡頭組件</p>
        <p type="p">31:卡槽</p>
        <p type="p">40:安裝框體</p>
        <p type="p">41:出光口</p>
        <p type="p">42:入光口</p>
        <p type="p">43:安裝口</p>
        <p type="p">50:第一連接結構</p>
        <p type="p">60:第二連接結構</p>
        <p type="p">61:第二開口</p>
        <p type="p">O:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="551" publication-number="202632843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線充電接收端模組及無線受電裝置</chinese-title>
        <english-title>WIRELESS CHARGING RECEIVER MODULE AND WIRELESS POWER RECEIVING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250502B">H02J50/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王盛才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-CAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無線充電接收端模組，其包括蓋體、電路板、一組第一電性連接件、導電線圈及第一磁遮罩層。蓋體的上蓋部具有多個第一貫孔。電路板位於蓋體內。該組第一電性連接件具有多個第一導電端部自電路板的上表面露出並且分別自該些第一貫孔露出。導電線圈位於蓋體內，並且設置在電路板下方。第一磁遮罩層位於蓋體內，並且設置在電路板與導電線圈之間。本發明還提供一種無線受電裝置，其能夠容置並且電性連接上述之無線充電接收端模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a wireless charging receiver module, which includes a cover body, a circuit board, a set of first electrical connecting parts, a conductive coil and a first magnetic shielding layer. An upper cover portion of the cover body has a plurality of first through holes. The circuit board is located in the cover body. The set of first electrical connecting parts have a plurality of first conductive ends exposed from an upper surface of the circuit board and respectively exposed from the first through holes. The conductive coil is located in the cover body and is disposed beneath the circuit board. The first magnetic shielding layer is located in the cover body and is disposed between the circuit board and the conductive coil. The present invention also provides a wireless power receiving device, which can accommodate and electrically connect to the above-mentioned wireless charging receiver module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:蓋體</p>
        <p type="p">112:上蓋部</p>
        <p type="p">112a:第一貫孔</p>
        <p type="p">114:下蓋部</p>
        <p type="p">120:電路板</p>
        <p type="p">130:一組第一電性連接件</p>
        <p type="p">131、132、133、134:第一導電端部</p>
        <p type="p">140:導電線圈</p>
        <p type="p">150:第一磁遮罩層</p>
        <p type="p">160:一組第二電性連接件</p>
        <p type="p">161、162、163、164:第二導電端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="552" publication-number="202633048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防拆鎖固機構及其操作方法</chinese-title>
        <english-title>ANTI-TAMPER SECURING MECHANISM AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">H05K5/02</main-classification>
        <further-classification edition="200601120250910B">F16B21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防拆鎖固機構及其操作方法，其中防拆鎖固機構包括螺栓、旋動蓋、連接件、以及主彈性元件。螺栓包括鎖固本體；間隔件，固定於鎖固本體內；以及橋接件，固定於鎖固本體內。旋動蓋可轉動地設置於鎖固本體。連接件可移動及轉動地設置於鎖固本體內，且連接於旋動蓋。主彈性元件設置於連接件以及間隔件之間。當橋接件固定於間隔件時，連接件接觸於橋接件，且藉由旋轉旋動蓋以使連接件、橋接件、以及鎖固本體跟隨旋動蓋旋轉。當鎖固本體鎖固於物件時，藉由旋轉旋動蓋使連接件相對於鎖固本體旋轉，進而使橋接件從間隔件斷開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-tamper securing mechanism and an operation method thereof are provided. The anti-tamper securing mechanism includes a screw bolt, a rotation cover, a connection element, and a main elastic element. The screw bolt includes a fastening body; a partition element affixed within the fastening body; and a temporary element, affixed to the partition element. The rotation cover is rotatably disposed in the fastening body. The connection element is movably and rotatably disposed in the fastening body, and connected to the rotation cover. The main elastic element is between the connection element and the partition element. When the temporary element is attached to the partition element, the connection element contacts the temporary element, and the connection element, the temporary element, and the fastening body are rotatable with the rotation cover. When the fastening body is fastened on an object, the temporary element is broken off from the partition element by further rotating the rotation cover relative to the fastening body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防拆鎖固機構</p>
        <p type="p">10:螺栓</p>
        <p type="p">11:鎖固本體</p>
        <p type="p">111:頭部</p>
        <p type="p">112:螺桿</p>
        <p type="p">12:間隔件</p>
        <p type="p">13:橋接件</p>
        <p type="p">131:嵌合塊</p>
        <p type="p">14:卡合塊</p>
        <p type="p">15:限位件</p>
        <p type="p">20:旋動蓋</p>
        <p type="p">21:蓋體</p>
        <p type="p">211:工具槽</p>
        <p type="p">22:連接柱</p>
        <p type="p">23:限制肋</p>
        <p type="p">24:通氣柱</p>
        <p type="p">241:通氣開口</p>
        <p type="p">242:阻擋壁</p>
        <p type="p">25:限位槽</p>
        <p type="p">30:連接件</p>
        <p type="p">32:軸部</p>
        <p type="p">33:驅動結構</p>
        <p type="p">331:齒部</p>
        <p type="p">34:止擋結構</p>
        <p type="p">341:桿部</p>
        <p type="p">342:止擋塊</p>
        <p type="p">40:內彈性元件</p>
        <p type="p">50:主彈性元件</p>
        <p type="p">AX1:虛擬中央軸</p>
        <p type="p">D1:縱向</p>
        <p type="p">W1:物件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="553" publication-number="202632571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>服務資訊提供方法及其裝置</chinese-title>
        <english-title>METHOD FOR PROVIDING SERVICE INFORMATION AND APPARATUS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250509B">G06Q30/02</main-classification>
        <further-classification edition="202301120250509B">G06Q30/0241</further-classification>
        <further-classification edition="202301120250509B">G06Q30/0242</further-classification>
        <further-classification edition="202301120250509B">G06Q30/0601</further-classification>
        <further-classification edition="201201120250509B">G06Q50/10</further-classification>
        <further-classification edition="202201120250509B">G06F3/04842</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露系有關於服務資訊提供方法及其裝置。根據本揭露的一實施例的服務資訊提供方法可包括：在與第1服務相關的第1畫面的一個區域顯示第1對象的步驟，以及響應於檢測到用戶輸入上述第1對象的情況，提供以覆蓋的方式顯示在上述第1畫面的一部分區域的用戶介面，上述用戶介面包括可以轉到與上述第1服務不同的第2服務相關的第2畫面的進入按鍵的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for providing service information, and an apparatus thereof. The method for providing service information may include displaying a first object on one area of a first screen associated with a first service, and providing a user interface displayed in an overlay manner on a partial area of the first screen when a user input for the first object is sensed, the user interface including an entry button for moving to a second screen associated with a second service different from the first service.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="554" publication-number="202632579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢索商品之方法、裝置及記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR SEARCHING PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250704B">G06Q30/06</main-classification>
        <further-classification edition="202401120250704B">G06Q10/08</further-classification>
        <further-classification edition="200601120250704B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓基永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, KIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昭英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種檢索商品之方法。本發明之方法可包括如下步驟：自用戶終端接收與商品檢索問詢對應之檢索請求圖像；基於上述檢索請求圖像而產生圖像屬性或文字屬性中之至少一者；基於上述圖像屬性或上述文字屬性中之至少一者而檢索商品；及將上述商品檢索之結果傳輸至上述用戶終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">600:商品檢索結果畫面</p>
        <p type="p">601:檢索請求圖像</p>
        <p type="p">602,603,604,605:識別UI</p>
        <p type="p">606:選擇區域</p>
        <p type="p">607:圖像拍攝UI</p>
        <p type="p">608:商品檢索項目10</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="555" publication-number="202633031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板結構及其製法</chinese-title>
        <english-title>SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">H05K1/11</main-classification>
        <further-classification edition="200601120250328B">H05K3/46</further-classification>
        <further-classification edition="200601120250328B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商芯愛科技（南京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AALTOSEMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板結構，包括：核心層，具有複數導電結構；第一增層結構，設於該核心層上，並具有複數第一導電柱；以及第二增層結構，設於該第一增層結構上，並具有複數第二導電柱；其中，該第一導電柱與該導電結構彼此錯位，且該第二導電柱對應對準該導電結構並與該第一導電柱彼此錯位。本揭露更提供一種該基板結構之製法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate structure is provided, the substrate structure comprises: a core layer having a plurality of conductive structures; a first build-up structure provided on the core layer and having a plurality of first conductive pillars; and a second build-up structure provided on the first build-up structure and having a plurality of second conductive pillars; wherein the first conductive pillar and the conductive structure areoffset from each other, and the second conductive pillar is aligned with the conductive structure and is offset from the first conductive pillar. The present disclosure further provides a manufacturing method of the substrate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板結構</p>
        <p type="p">20:核心層</p>
        <p type="p">20a:第一表面</p>
        <p type="p">20b:第二表面</p>
        <p type="p">200:通孔</p>
        <p type="p">21:線路層</p>
        <p type="p">22:導電結構</p>
        <p type="p">23:第一增層結構</p>
        <p type="p">230:第一介電層</p>
        <p type="p">231:第一通孔</p>
        <p type="p">232:第一導電柱</p>
        <p type="p">233:第一線路層</p>
        <p type="p">24:第二增層結構</p>
        <p type="p">240:第二介電層</p>
        <p type="p">241:第二通孔</p>
        <p type="p">242:第二導電柱</p>
        <p type="p">243:第二線路層</p>
        <p type="p">25:第三增層結構</p>
        <p type="p">250:第三介電層</p>
        <p type="p">251:第三通孔</p>
        <p type="p">252:第三導電柱</p>
        <p type="p">253:第三線路層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="556" publication-number="202632572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生事件頁面之方法、裝置及記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR GENERATING EVENT PAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06Q30/02</main-classification>
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>
        <further-classification edition="201901120250701B">G06F16/958</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董培建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, PEIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔詩薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, SHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種用以產生事件頁面之技術。本發明之一態樣之藉由電子裝置而實行之產生事件頁面之方法可包括如下步驟：獲得第1資料及第2資料，該第1資料係指示事件類型者，該第2資料係指示第1事件頁面之顯示於用戶介面中之文本者；基於上述第1資料，確定上述第1事件頁面之頁面構成資料，上述頁面構成資料包括指示上述第1事件頁面之模板之第1構成資料、及與上述第1事件頁面之設定檔案對應之第2構成資料；及基於上述頁面構成資料及上述第2資料，產生上述第1事件頁面；且確定上述第1事件頁面之頁面構成資料之步驟可包括如下步驟：獲得上述事件類型之事件頁面歷史，上述事件頁面歷史包括與上述事件類型相對應之一個以上之先前事件頁面各者之頁面構成資料之資訊；及基於上述事件頁面歷史來確定上述第1事件頁面之頁面構成資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="557" publication-number="202632150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>風扇與電子裝置</chinese-title>
        <english-title>FANS AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250915B">F04D29/60</main-classification>
        <further-classification edition="200601120250915B">F04D29/00</further-classification>
        <further-classification edition="200601120250915B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻準精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬小廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, XIAO-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及散熱技術領域，尤其涉及一種風扇與電子裝置。包括扇框、導線、端子板與限位件；扇框包括設有第一限位件、第一及第二安裝板的安裝區域，第一與第二安裝板沿第二方向相對設置；第一限位件設有沿第一方向貫通的第一限位孔，第一與第二安裝板設有沿第二方向貫通的安裝槽；端子板活動插接於安裝槽，且開設有第二限位孔與排線孔，第一、第二限位孔沿第一方向的軸線重合，排線孔連接導線；限位件連接第一、第二限位孔，使端子板與安裝槽浮動連接。本申請的風扇，減少震動對接頭與端子板連接穩定性影響，增加電子裝置的散熱空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the technical field of heat dissipation, in particular to a fan and an electronic device. The fan includes a fan frame, a wire, a terminal plate and a limit; The fan frame includes an installation area provided with a first limit member, a first and a second mounting plate, and the first and second mounting plates are arranged opposite to each other in the second direction; The first limit member is provided with a first limit hole through in the first direction, and the first and second mounting plates are provided with an installation slot through in the second direction; The terminal board is movable inserted into the installation slot, and is provided with a second limit hole and a wiring hole. The first and second limit holes coincide with the axis of the first direction, and the wiring hole is connected with the conductor; The limit is connected to the first and second limit holes so that the terminal board is floating connected to the installation slot. The fan can reduce the influence of vibration on the stability of the connection between the connector and the terminal board, and increase the heat dissipation space of the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:風扇</p>
        <p type="p">1:扇框</p>
        <p type="p">11:安裝區域</p>
        <p type="p">12:第二限位件</p>
        <p type="p">121:第三限位孔</p>
        <p type="p">13:第一限位件</p>
        <p type="p">131:第一限位孔</p>
        <p type="p">1311:第一孔段</p>
        <p type="p">1312:第二孔段</p>
        <p type="p">14:第一安裝板</p>
        <p type="p">141:安裝槽</p>
        <p type="p">15:第二安裝板</p>
        <p type="p">2:導線</p>
        <p type="p">3:端子板</p>
        <p type="p">31:第二限位孔</p>
        <p type="p">32:排線孔</p>
        <p type="p">41:膨脹件</p>
        <p type="p">411:膨脹孔</p>
        <p type="p">412:膨脹主體</p>
        <p type="p">413:第二限位部</p>
        <p type="p">42:第一定位銷釘</p>
        <p type="p">421:第一限位部</p>
        <p type="p">422:銷釘主體</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
        <p type="p">100:接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="558" publication-number="202633006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置</chinese-title>
        <english-title>COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250602B">H04W88/08</main-classification>
        <further-classification edition="200901120250602B">H04W88/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴逸翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, MING-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括處理器和收發器，其中該通訊裝置是通訊系統中的第一裝置，該通訊系統包括多個基本服務集（BSS），且該收發器配置為：透過該多個BSS中的第一BSS與該通訊系統中的第二裝置進行第一通訊，並同時透過該多個BSS中的第二BSS與該通訊系統中的第三裝置進行第二通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device comprising a processor and a transceiver, wherein the communication device is a first device in a communication system comprising a plurality of basic-service-sets (BSSs), and the transceiver of the communication device is configured to: perform a first communication with a second device in the communication system through a first BSS of the plurality of BSSs and concurrently perform a second communication with a third device in the communication system through a second BSS of the plurality of BSSs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">B1,B2:基本服務集</p>
        <p type="p">200:網絡</p>
        <p type="p">101,102:AP裝置</p>
        <p type="p">11,21,31:STA裝置</p>
        <p type="p">1000:通訊系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="559" publication-number="202632361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏡頭模組以及終端裝置</chinese-title>
        <english-title>LENS MODULE AND TERMINAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250502B">G02B7/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIAN-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡頭模組，包括基座、遮擋件、光源發射器、接收鏡頭以及感光晶片。遮擋件和基座共同形成第一空間和第二空間，遮擋件具有第三空間並開設有通道，通道連通第一空間和第三空間；光源發射器位於第一空間並用於發射第一光線和第二光線；接收鏡頭位於第二空間；感光晶片包括第一感光區和第二感光區，遮擋件覆蓋第一感光區，第一感光區位於第三空間，第二感光區位於第二空間；第一光線穿過通道至第一感光區；第二光線穿過第一空間並經反射後穿過接收鏡頭進入第二空間至第二感光區。本申請還提供一種終端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens module includes a base, a shielding member, a light emitter, a receiving lens, and a photosensitive chip. The shielding member and the base jointly form a first space and a second space. The shielding member includes a third space and a channel. The channel communicates with the first space and the third space. The light emitter is located in the first space and can emit a first light and a second light. The receiving lens is located in the second space. The photosensitive chip includes a first photosensitive area and a second photosensitive area. The shielding member covers the first photosensitive area. The first photosensitive area is located in the third space, and the second photosensitive area is located in the second space. The first light extends through the channel to the first photosensitive area. The second light extends through the first space and enters the second space through the receiving lens after reflection to reach the second photosensitive area. The present disclosure further provides a terminal device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡頭模組</p>
        <p type="p">10:基座</p>
        <p type="p">11:頂板</p>
        <p type="p">112:出光孔</p>
        <p type="p">13:側板</p>
        <p type="p">15:延伸板</p>
        <p type="p">17:收容空間</p>
        <p type="p">172:第一空間</p>
        <p type="p">174:第二空間</p>
        <p type="p">20:電路板</p>
        <p type="p">30:接收鏡頭</p>
        <p type="p">40:感光晶片</p>
        <p type="p">41:第一感光區</p>
        <p type="p">43:第二感光區</p>
        <p type="p">60:遮擋件</p>
        <p type="p">61:蓋板</p>
        <p type="p">632:通道</p>
        <p type="p">65:第二擋板</p>
        <p type="p">652:第一間隙</p>
        <p type="p">654:斜面</p>
        <p type="p">68:第三空間</p>
        <p type="p">90:發射鏡頭</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="560" publication-number="202633182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子堆疊結構及其製造方法</chinese-title>
        <english-title>ELECTRONIC STACKED STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D88/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/49</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/44</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜序</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子堆疊結構，其包括第一裝置、絕緣塊和第二裝置。第一裝置包括第一電路層和配置在第一電路層上的通孔。通孔包括功能通孔和虛設通孔。絕緣塊直接覆蓋並接觸虛設通孔。第二裝置包括第二電路層。第一電路層通過功能通孔電性連接至第二電路層。亦提供一種電子堆疊結構的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an electronic stacked structure including a first device, an insulating block, and a second device. The first device includes a first circuit layer and through vias disposed on the first circuit layer. The through vias comprise a functional through via and a dummy through via. The insulating block is directly covering and contacting the dummy through via. The second device includes a second circuit layer. The first circuit layer is electrically connected to the second circuit layer through the functional through via. A manufacturing method of an electronic stacked structure is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外部端子</p>
        <p type="p">12:連接件</p>
        <p type="p">12D:虛設連接件</p>
        <p type="p">12F:功能連接件</p>
        <p type="p">100、200:裝置</p>
        <p type="p">110、210:半導體層</p>
        <p type="p">120、220:記憶胞</p>
        <p type="p">130、230:隔離層</p>
        <p type="p">140、240:互連結構</p>
        <p type="p">141、241:連接線</p>
        <p type="p">142、242:連接通孔</p>
        <p type="p">143、151、243、251:介電層</p>
        <p type="p">150、250:接合結構</p>
        <p type="p">152、252:接合墊</p>
        <p type="p">152t:頂面</p>
        <p type="p">160、260:保護層</p>
        <p type="p">170:絕緣塊</p>
        <p type="p">CL1、CL2:電路層</p>
        <p type="p">FTV:功能通孔</p>
        <p type="p">DTV:虛設通孔</p>
        <p type="p">TV:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="561" publication-number="202632580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化服務提供方法、系統及計算機可讀記錄介質</chinese-title>
        <english-title>METHOD, SYSTEM AND COMPUTER-READABLE RECORDING MEDIUM FOR PROVIDING AUTOMATION SERVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>
        <further-classification edition="201301120250801B">G06F3/048</further-classification>
        <further-classification edition="200601120250801B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李藝賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EOK HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG RYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及自動化服務提供方法、電子裝置及計算機可讀記錄介質。自動化服務提供方法包括如下步驟：通過向用戶終端提供的應用程序，獲取與自動化進程相關的指定條件及指定工作；判斷是否滿足指定條件；以及響應於判斷為滿足指定條件，向所述用戶終端傳輸用於執行指定工作的指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for providing an automation service associated with an application provided to a user terminal, the method being performed by at least one processor, is disclosed. The method includes acquiring a designated condition and a designated operation, associated with an automation process through the application provided to the user terminal, determining whether the designated condition is satisfied, and in response to determining that the designated condition is satisfied, transmitting a command to the user terminal to perform the designated operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用戶</p>
        <p type="p">110:用戶終端</p>
        <p type="p">120:畫面</p>
        <p type="p">130:消息</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="562" publication-number="202631794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯樹脂、以及含有其之黏接劑組成物、黏接片、及疊層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G63/127</main-classification>
        <further-classification edition="200601120260420B">C09J167/00</further-classification>
        <further-classification edition="201801120260420B">C09J7/30</further-classification>
        <further-classification edition="200601120260420B">B32B27/36</further-classification>
        <further-classification edition="200601120260420B">H05K1/03</further-classification>
        <further-classification edition="200601120260420B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO MC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供保存穩定性優異，具有高還原黏度，同時可形成高交聯密度的聚酯樹脂。&lt;br/&gt;一種聚酯樹脂，其在100mol%的全部多羧酸成分中，含有2.0mol%以上的三羧酸成分，聚酯樹脂的還原黏度為0.50dl/g以上，聚酯樹脂的酸值(AV)為150eq/t以上，藉由傅立葉轉換紅外線吸收光譜法(FTIR)來測定之在1715cm&lt;sup&gt;-1&lt;/sup&gt;之吸光度的波峰強度I(1715)與在1785cm&lt;sup&gt;-1&lt;/sup&gt;之吸光度的波峰強度I(1785)的比率I(1785)/I(1715)為0.030以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="563" publication-number="202632556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>優化訂單履行程序</chinese-title>
        <english-title>OPTIMIZING ORDER FULFILLMENT PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251103B">G06Q10/08</main-classification>
        <further-classification edition="202301120251103B">G06Q10/04</further-classification>
        <further-classification edition="201201120251103B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱秀芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIUFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全　艾薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, ISSAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾　烏米什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　承孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在一履行中心處之訂單履行之方法包含：自一履行中心處之未履行訂單之一清單識別與該履行中心中之訂單物品相關聯之複數個物品提取路線，其中各物品提取路線表示用於經組態以收集對應一或多個訂單物品之一收集裝置之一路線，且係基於與該收集裝置相關聯之資訊來判定；基於收集容器之一數目及所指派之物品提取路線之一數目來判定該收集裝置之一剩餘容量；基於該剩餘容量及未履行訂單之該清單來判定一組候選儲存區域，各候選儲存區域包含可自其收集該等未履行訂單之至少一子集之物品提取路線；判定各區域之一距離度量；及基於該等距離度量向該特定收集裝置指派該等候選儲存區域之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of order fulfillment at a fulfillment center includes: identifying, from a list of unfulfilled orders at a fulfillment center, a plurality of item retrieval routes associated with order-items in the fulfillment center, where each item retrieval route represents a route for a collection device configured to collect corresponding one or more order-items and is determined based on information associated with the collection device; determining, based on a number of collection containers and a number of assigned item retrieval routes assigned, a remaining capacity of the collection device; determining, based on the remaining capacity and the list of unfulfilled orders, a set of candidate storage areas each including item retrieval routes from which at least a subset of the unfulfilled orders may be collected; determining a distance metric for each area; and assigning, to the particular collection device, one of the candidate storage areas based on the distance metrics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:程序</p>
        <p type="p">310:步驟</p>
        <p type="p">320:步驟</p>
        <p type="p">330:步驟/程序</p>
        <p type="p">340:步驟</p>
        <p type="p">350:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="564" publication-number="202632558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>優化訂單履行程序</chinese-title>
        <english-title>OPTIMIZING ORDER FULFILLMENT PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">G06Q10/087</main-classification>
        <further-classification edition="202401120250901B">G06Q10/08</further-classification>
        <further-classification edition="201201120250901B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成濟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, JEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, AHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全　艾薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, ISSAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電腦實施方法包括：在與一收集裝置相關聯之一顯示器上提供用以獲得與複數個收集容器之各者相關聯之識別符資訊的一請求；接收該識別符資訊；在該顯示器上用與該複數個收集容器之各者相關聯之該識別符資訊更新一對應圖形元素；提取未履行訂單之一清單上之一特定物品之位置資訊且提供該位置資訊以在該顯示器上呈現；接收指示該收集裝置處於對應於該位置資訊之一位置之資訊；向該收集裝置傳輸關於該物品及待分配至各收集容器之該物品之一數量之資訊以在該顯示器上呈現；向該收集裝置傳輸一控制項以在該顯示器上呈現，該控制項經組態以指示分配於各收集容器中之該特定物品之一數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer-implemented method comprising: providing, on a display associated with a collection device, a request to obtain identifier information associated with each of a plurality of collection containers; receiving the identifier information; updating, on the display, a corresponding graphical element with the identifier information associated with each of the plurality of collection containers; retrieving location information for a particular item on a list of unfulfilled orders and providing the location information for presentation on the display; receiving information indicative of the collection device being at a location corresponding to the location information; transmitting, to the collection device for presentation on the display, information regarding the item and a quantity of the item to be allocated to each collection container; transmitting, to the collection device for presentation on the display, a control configured to indicate a quantity of the particular item allocated in each collection container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:程序</p>
        <p type="p">310:步驟</p>
        <p type="p">320:步驟</p>
        <p type="p">330:步驟/程序</p>
        <p type="p">340:步驟</p>
        <p type="p">350:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="565" publication-number="202632559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>優化訂單履行程序</chinese-title>
        <english-title>OPTIMIZING ORDER FULFILLMENT PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">G06Q10/087</main-classification>
        <further-classification edition="202401120250901B">G06Q10/08</further-classification>
        <further-classification edition="201201120250901B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　承孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全　艾薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, ISSAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾　烏米什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL UMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在一履行中心處之訂單履行之方法包含：自一履行中心(FC)處之未履行訂單之一清單識別與該FC中之訂單物品相關聯之複數個物品提取路線，其中各物品提取路線表示用於經組態以收集對應一或多個訂單物品之收集裝置之一路線，且係基於與該收集裝置相關聯之資訊來判定；及基於該收集裝置之位置資訊及該資訊，在該複數個物品提取路線當中識別待指派至該收集裝置用於一履行程序之物品提取路線之一子集，使得與物品提取路線之該子集相關聯之一效率度量滿足一臨限條件，該履行程序包含(i)收集物品提取路線之該子集內之訂單物品及(ii)將所收集之訂單物品遞送至各物品提取路線之一對應目的地。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of order fulfillment at a fulfillment center includes: identifying, from a list of unfulfilled orders at a fulfillment center (FC), a plurality of item retrieval routes associated with order-items in the FC, where each item retrieval route represents a route for the collection device configured to collect corresponding one or more order-items and is determined based on information associated with the collection device; and identifying, based on location information of the collection device and the information, a subset of item retrieval routes, among the plurality of item retrieval routes, to be assigned to the collection device for a fulfillment process such that an efficiency metric associated with the subset of item retrieval routes satisfies a threshold condition, the fulfillment process including (i) collecting order-items within the subset of item retrieval routes and (ii) delivering collected order-items to a corresponding destination of each item retrieval route.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:程序</p>
        <p type="p">310:步驟</p>
        <p type="p">320:步驟</p>
        <p type="p">330:步驟/程序</p>
        <p type="p">340:步驟</p>
        <p type="p">350:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="566" publication-number="202633141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溝槽式功率半導體元件及其製造方法</chinese-title>
        <english-title>TRENCH POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250424B">H10D64/20</main-classification>
        <further-classification edition="202501120250424B">H10D64/23</further-classification>
        <further-classification edition="202501120250424B">H10D64/01</further-classification>
        <further-classification edition="202501120250424B">H10D62/10</further-classification>
        <further-classification edition="202501120250424B">H10D30/60</further-classification>
        <further-classification edition="202501120250424B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯順祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, SHUEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳皇男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種溝槽式功率半導體元件，其包括基底以及埋入式閘極結構。基底包括基體區、形成於基體區上的基體接觸區以及形成於基體區上且位於基體接觸區旁的源極區。源極區與基體接觸區具有不同的導電型。埋入式閘極結構形成於基體區中，且位於基體接觸區與源極區的一側。基底具有形成於源極區上的凹槽，使得位於凹槽的底部的源極區的表面低於基體接觸區的頂表面。本揭露另提供一種半導體元件溝槽式功率半導體元件的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A trench power semiconductor device including a substrate and a buried gate structure is provided. The substrate includes a body region, a body contact region formed on the body region, and a source region aside the body contact region and formed on the body region, wherein conductivity type of the source region is different from the conductivity type or the doping concentration of the body contact region. The buried gate structure formed in the body region and at a side of the source region and the body contact region, wherein the substrate has a recess formed on the source region, such that the surface of the source region located at the bottom of the recess is lower than the top surface of the body contact region. A manufacturing method of a semiconductor device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:溝槽式功率半導體元件</p>
        <p type="p">100:基底</p>
        <p type="p">102:外延層</p>
        <p type="p">104:基體區</p>
        <p type="p">106:基體接觸區</p>
        <p type="p">106T:基體接觸區的頂表面</p>
        <p type="p">108:源極區</p>
        <p type="p">108T:源極區的頂表面</p>
        <p type="p">200:埋入式閘極結構</p>
        <p type="p">202:閘絕緣層</p>
        <p type="p">204:埋入式閘極電極</p>
        <p type="p">206:絕緣蓋層</p>
        <p type="p">206T:絕緣蓋層的頂表面</p>
        <p type="p">A-A’、B-B’、C-C’:剖線</p>
        <p type="p">GT:閘極溝槽</p>
        <p type="p">Re:凹槽</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="567" publication-number="202631795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯樹脂、以及含有其之黏接劑組成物、黏接片、及疊層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G63/127</main-classification>
        <further-classification edition="200601120260420B">C09J167/00</further-classification>
        <further-classification edition="201801120260420B">C09J7/30</further-classification>
        <further-classification edition="200601120260420B">B32B27/36</further-classification>
        <further-classification edition="200601120260420B">H05K1/03</further-classification>
        <further-classification edition="200601120260420B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO MC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡島裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木津本博俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIZUMOTO, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三上忠彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKAMI, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供熱穩定性優異，具有高還原黏度，同時可形成高交聯密度的聚酯樹脂。&lt;br/&gt;一種聚酯樹脂，其在100mol%的全部多羧酸成分中，含有2.0mol%以上的三羧酸成分，聚酯樹脂的還原黏度為0.50dl/g以上，聚酯樹脂的酸值(AV)為150eq/t以上，滿足下述(i)及/或(ii)。&lt;br/&gt;(i)屬於構成聚酯的主鏈之二羧酸成分之羧基的酸值(AV&lt;sub&gt;d&lt;/sub&gt;)為50eq/t以上&lt;br/&gt;(ii)羥值(OHV)為80eq/t以下</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="568" publication-number="202631796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯樹脂、以及含有其之黏接劑組成物、黏接片、及疊層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G63/127</main-classification>
        <further-classification edition="200601120260420B">C09J167/00</further-classification>
        <further-classification edition="201801120260420B">C09J7/30</further-classification>
        <further-classification edition="200601120260420B">B32B27/36</further-classification>
        <further-classification edition="200601120260420B">H05K1/03</further-classification>
        <further-classification edition="200601120260420B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡ＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO MC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡島裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木津本博俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIZUMOTO, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五嶋英人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSHIMA, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三上忠彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKAMI, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供具有高還原黏度或者高Mw，同時可形成高交聯密度的聚酯樹脂。&lt;br/&gt;一種聚酯樹脂，其在100mol%的全部多羧酸成分中，含有0.5~10.0mol%的3價以上的多羧酸成分，聚酯樹脂的酸值(AV)為100eq/t以上，滿足下述(i)及/或(ii)。&lt;br/&gt;(i)聚酯樹脂的還原黏度為0.50dl/g以上&lt;br/&gt;(ii)聚酯樹脂的重量平均分子量(Mw)為79,000以上</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="569" publication-number="202632237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體溫度場層析視覺化探測裝置</chinese-title>
        <english-title>FLUID TEMPERATURE FIELD TOMOGRAPHY VISUALIZATION DETECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250502B">G01K11/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳顯力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范守善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, SHOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種流體溫度場層析視覺化探測裝置，包括：一平面測溫元件，該平面測溫元件用於探測流體截面的溫度，其包括一懸空設置的奈米碳管層；一紅外熱像儀，該紅外熱像儀與該平面測溫元件間隔設置，該紅外熱像儀用於探測懸空部分奈米碳管層的紅外信號，並根據所述奈米碳管層的紅外信號成像，從而獲得流體溫度場的截面溫度分佈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a fluid temperature field tomography visualization detection device comprises a planar temperature measuring element and an infrared thermal imager. The planar temperature measuring element is configured to detect a temperature of a fluid cross section, the planar temperature measuring element includes a suspended carbon nanotube layer. The infrared thermal imager is spaced apart from the planar temperature measuring element, and is configured to detect infrared signals of the suspended carbon nanotube layer, and to form an image based on the infrared signals of the carbon nanotube layer, so as to obtain the cross-sectional temperature distribution of the fluid temperature field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:流體溫度場層析視覺化探測裝置</p>
        <p type="p">100:平面測溫元件</p>
        <p type="p">104:紅外熱像儀</p>
        <p type="p">102:奈米碳管層</p>
        <p type="p">106:第一電極</p>
        <p type="p">108:第二電極</p>
        <p type="p">110:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="570" publication-number="202632332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">G02B6/12</main-classification>
        <further-classification edition="200601120250423B">G02B6/122</further-classification>
        <further-classification edition="200601120250423B">G02B6/42</further-classification>
        <further-classification edition="200601120250423B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李胜高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENGGAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包括基底和形成在基底上的波導層。波導層包括複數個波導。半導體結構更包括在波導層上以陣列配置的複數個處理晶粒，以及在波導層上配置在陣列周緣並與複數個處理晶粒電性耦接的複數個電子積體電路晶粒。配置在陣列相對邊緣的複數個電子積體電路晶粒中的至少兩者透過複數個波導中的相應波導彼此光學耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided, which includes a substrate and a waveguide layer formed on the substrate. The waveguide layer includes a plurality of waveguides. The semiconductor structure further includes a plurality of processing dies arranged in an array on the waveguide layer, and a plurality of electric integrated circuit (EIC) dies arranged at a periphery of the array on the waveguide layer and electrically coupled with the plurality of processing dies. At least two of the plurality of EIC dies arranged at opposite edges of the array are coupled to each other through a corresponding waveguide of the plurality of waveguides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">101:處理晶粒</p>
        <p type="p">101a:第一邊緣處理晶粒</p>
        <p type="p">101b:處理晶粒</p>
        <p type="p">101c:第二邊緣處理晶粒</p>
        <p type="p">103:電子積體電路晶粒(EIC晶粒)</p>
        <p type="p">103a:第一電子積體電路晶粒</p>
        <p type="p">103b:第二電子積體電路晶粒</p>
        <p type="p">110:基底</p>
        <p type="p">111:波導層</p>
        <p type="p">112:重分佈層</p>
        <p type="p">114:光電積體電路晶粒(PIC晶粒)</p>
        <p type="p">114a:第一光電積體電路晶粒</p>
        <p type="p">114b:第二光電積體電路晶粒</p>
        <p type="p">116:外部光電積體電路晶粒</p>
        <p type="p">118:第一波導</p>
        <p type="p">120:第二波導</p>
        <p type="p">122:導線</p>
        <p type="p">130:透鏡</p>
        <p type="p">131:光纖對位器</p>
        <p type="p">132:光纖</p>
        <p type="p">150:陣列</p>
        <p type="p">160:周緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="571" publication-number="202632581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以提供物品資訊之電子裝置及其動作方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS FOR PROVIDING ITEM INFORMATION AND ITS OPERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>
        <further-classification edition="201901120250801B">G06F16/9535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙承妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簾明悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門弘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOMOON, HONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之於電子裝置中提供物品資訊之方法之特徵在於包括如下步驟：基於用戶之服務利用歷史來確認至少一個物品；確認包括與至少一個物品對應之關鍵字之第1關鍵字清單；向用戶之終端提供包括第1關鍵字清單之第1頁面；確認對第1關鍵字清單中之一個目標關鍵字進行之選擇輸入；及向用戶之終端提供包括基於目標關鍵字而檢索到之物品清單之第2頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S250:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="572" publication-number="202631331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106351</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定位作業機構及鎖付螺絲機構</chinese-title>
        <english-title>POSITIONING OPERATING MECHANISM AND LOCKING SCREW MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250521B">B25B23/08</main-classification>
        <further-classification edition="200601120250521B">B25B21/00</further-classification>
        <further-classification edition="200601120250521B">B25B5/02</further-classification>
        <further-classification edition="200601120250521B">B23Q3/06</further-classification>
        <further-classification edition="200601120250521B">B23P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬佶為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, JI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李曉斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAO-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王君豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱俊峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JUN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及自動化作業技術領域，提供一種定位作業機構及鎖付螺絲機構。定位作業機構包括安裝座、第一固定件、第二固定件、同步組件與驅動件。第一固定件用於與一個終端作業機構連接，第二固定件用於與另一個終端作業機構連接。同步組件設於安裝座。第一固定件與第二固定件均固定設於同步組件。同步組件用於帶動第一固定件與第二固定件沿第一方向相反運動。驅動件與同步組件連接以驅動同步組件。本申請之有益效果是藉由一個動力源帶動兩個終端作業機構，能夠有效降低能耗，簡化了加工設備終端之系統複雜程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to the technical field of automated operation and provides a positioning operating mechanism and a locking screw mechanism. The positioning operating mechanism comprises a mount, a first fixing piece, a second fixing piece, a synchronous assembly, and a drive piece. The first fixing piece is for connecting with a terminal operating mechanism, and the second fixing piece is for connecting with another terminal operating mechanism. The synchronous assembly is disposed on the mount. The first fixing piece and the second fixing piece are both fixed to the synchronous assembly. The synchronous assembly is used to drive the first fixing piece and the second fixing piece to move in opposite directions along a first direction. The drive piece is connected to the synchronous assembly to drive the synchronous assembly. The beneficial effect of the application is that by driving two terminal operating mechanisms with a single power source, energy consumption can be effectively reduced and the system complexity of the processing equipment terminals can be simplified.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:定位作業機構</p>
        <p type="p">1:安裝座</p>
        <p type="p">101:第一區域</p>
        <p type="p">102:第二區域</p>
        <p type="p">103:第三區域</p>
        <p type="p">104:第四區域</p>
        <p type="p">21:第一固定件</p>
        <p type="p">211:第一嚙合件</p>
        <p type="p">212:第一安裝件</p>
        <p type="p">22:第二固定件</p>
        <p type="p">221:第二嚙合件</p>
        <p type="p">222:第二安裝件</p>
        <p type="p">3:同步組件</p>
        <p type="p">31:第一同步輪</p>
        <p type="p">32:第二同步輪</p>
        <p type="p">33:同步帶</p>
        <p type="p">331:第一連接位</p>
        <p type="p">332:第二連接位</p>
        <p type="p">61:第一感應件</p>
        <p type="p">62:第二感應件</p>
        <p type="p">Z:第一方向</p>
        <p type="p">X:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="573" publication-number="202633376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及其工作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/76</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹星進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴範俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BUM JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛捧浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUL, BONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅俊永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, JUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全轃標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JIN PYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種對半導體基板執行加熱製程和冷卻製程的基板處理裝置及其工作方法，基板處理裝置可包括：支撐卡盤，包括至少一個光吸收部，板，包括至少一個雷射器和冷卻線，以及支撐架，貫穿在板的中央部形成的通孔，支撐架的一側容納於形成在支撐卡盤的中央部的槽；當對配置在支撐卡盤的半導體基板執行用於溫度升高的第一製程時，支撐卡盤和板可以隨著支撐架的升高而隔開，並且至少一個雷射器將雷射照射到至少一個光吸收部；當對半導體基板執行用於溫度降低的第二製程時，支撐卡盤和板可以隨著支撐架的降低而接觸，藉由冷卻線供應冷卻劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理系統</p>
        <p type="p">110:基板處理裝置</p>
        <p type="p">120:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="574" publication-number="202632606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像自動檢測系統及其方法</chinese-title>
        <english-title>IMAGE AUTOMATIC DETECTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V10/24</main-classification>
        <further-classification edition="202201120250401B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宸展光電（廈門）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TES TOUCH EMBEDDED SOLUTIONS (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳桂華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瓊琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, QIONG-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種圖像自動檢測系統，包含攝影機及處理器。攝影機配置以拍攝多個正常影像、多個異常影像與待檢測影像。處理器包含輸入模組、影像剪輯模組、訓練模組以及檢測模組。影像剪輯模組配置以將這些正常影像與這些異常影像調整居中並調整角度一致，以減少圖像雜訊。訓練模組配置以將調整後的這些正常影像與這些異常影像以異常檢測演算法訓練，獲得圖像自動檢測模型。檢測模組配置以將待檢測影像以圖像自動檢測模型進行分析，以辨別出待檢測影像為正常或異常的結果，達成能夠模糊檢測且識別率高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an image automatic detection system, including a camera and a processor. The camera is configured to capture multiple normal images, multiple abnormal images and images to be detected. The processor includes an input module, an image editing module, a training module and a detection module. The image editing module is configured to center and adjust the angles of the normal images and the abnormal images to be consistent to reduce image noise. The training module is configured to train the adjusted normal images and the adjusted abnormal images with an abnormality detection algorithm to obtain an image automatic detection model. The detection module is configured to analyze the image to be detected using an image automatic detection model to identify whether the image to be detected is normal or abnormal, achieving blur detection and high recognition rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:圖像自動檢測系統</p>
        <p type="p">110:攝影機</p>
        <p type="p">120:處理器</p>
        <p type="p">121:輸入模組</p>
        <p type="p">122:影像剪輯模組</p>
        <p type="p">123:訓練模組</p>
        <p type="p">124:檢測模組</p>
        <p type="p">125:輸出模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="575" publication-number="202632905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其操作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H03L7/085</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創意電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL UNICHIP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾卡諾維奇　毅格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELKANOVICH, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　玟瓏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, WEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范姜朝馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN JIANG, CHAO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置及其操作方法，以在不同晶粒之間傳輸資料訊號與時脈訊號。半導體裝置包括第一晶粒以及第二晶粒。第二晶粒包括第一可控延遲線、時脈樹電路、第二可控延遲線與資料通道。第一可控延遲線通過時脈內連線接收第一晶粒的源時脈訊號。時脈樹電路的輸入端接收第一可控延遲線的第一經延遲時脈訊號。時脈樹電路提供經增益時脈訊號給第二可控延遲線以及資料通道。第二可控延遲線提供第二經延遲時脈訊號給資料通道。資料通道通過資料內連線接收第一晶粒的資料訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a semiconductor device and an operation method thereof to transmit data signals and clock signals between different dies. The semiconductor device includes a first die and a second die. The second die includes a first controllable delay line, a clock tree circuit, a second controllable delay line, and a data channel. The first controllable delay line receives a source clock signal of the first die through a clock interconnection. An input terminal of the clock tree circuit receives a first delayed clock signal of the first controllable delay line. The clock tree circuit provides a gain clock signal to the second controllable delay line and the data channel. The second controllable delay line provides a second delayed clock signal to the data channel. The data channel receives the data signal of the first die through a data interconnection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:半導體裝置</p>
        <p type="p">410、420:晶粒</p>
        <p type="p">430:封裝內連線部</p>
        <p type="p">CONN41、CONN44:資料內連線</p>
        <p type="p">CONN42、CONN43:時脈內連線</p>
        <p type="p">CORE41、CORE42:核心電路</p>
        <p type="p">IF41、IF42:介面裝置</p>
        <p type="p">RX1_CH41、RX2_CH41、TX1_CH41、TX2_CH41:資料通道</p>
        <p type="p">RX1_CK43、RX2_CK44、TX1_CK43、TX2_CK44:經增益時脈訊號</p>
        <p type="p">RX1_CK44、RX2_CK45:經延遲時脈訊號</p>
        <p type="p">RX1_CT41、RX2_CT41、TX1_CT41、TX2_CT41:時脈樹電路</p>
        <p type="p">RX1_DI41、RX1_DO41、RX1_DO42、RX2_DI41、RX2_DO41、RX2_DO42、TX1_DI41、TX1_DI42、TX1_DO41、TX2_DI41、TX2_DI42、TX2_DO41:資料訊號</p>
        <p type="p">RX1_DL41、RX2_DL42:可控延遲線</p>
        <p type="p">RX2_DL41、TX1_DL41:可控延遲線</p>
        <p type="p">RX2_FF41、RX2_FF42:正反器</p>
        <p type="p">RX2_PD41:相位偵測器</p>
        <p type="p">TX1_CK41、TX1_CK42:源時脈訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="576" publication-number="202632368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學攝像鏡片系統、取像裝置及電子裝置</chinese-title>
        <english-title>OPTICAL PHOTOGRAPHY LENS SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250424B">G02B11/32</main-classification>
        <further-classification edition="200601120250424B">G02B11/34</further-classification>
        <further-classification edition="202101120250424B">G02B7/02</further-classification>
        <further-classification edition="200601120250424B">G02B3/00</further-classification>
        <further-classification edition="202101120250424B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯郁淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施語函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學攝像鏡片系統，包含一鏡筒以及多片透鏡。這些透鏡設置於鏡筒內。這些透鏡的透鏡總數為六片、七片或八片。這些透鏡分別具有朝向物側的物側表面與朝向像側的像側表面。光學攝像鏡片系統中至少一片透鏡其物側表面與其像側表面中至少一者具有至少一反曲點。光學攝像鏡片系統更包含一遮光元件，且遮光元件位於鏡筒內並位於第一透鏡的物側。鏡筒具有一鏡筒最小開孔，且鏡筒最小開孔位於遮光元件之最小開孔的物側。當滿足特定條件時，光學攝像鏡片系統能同時滿足高生產品質和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical photography lens system includes a lens barrel and a plurality of lens elements disposed in the lens barrel. The total number of the plurality of lens elements is six, seven or eight. Each of the plurality of lens elements has an object-side surface facing toward an object side and an image-side surface facing toward an image side. At least one of the object-side surface and the image-side surface of at least one lens element of the optical photography lens system has an inflection point. The optical photography lens system further includes a light-blocking element located in the lens barrel and located on an object side of the first lens element. The lens barrel has a lens-barrel-minimum opening located on an object side of a minimum opening of the light-blocking element. When specific conditions are satisfied, the requirements of high manufacturing quality and high image quality can be met by the optical photography lens system, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">LS:鏡筒</p>
        <p type="p">OP:鏡筒最小開孔</p>
        <p type="p">SF:最物端點</p>
        <p type="p">S0、S2:遮光元件</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="577" publication-number="202633482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板及其製法</chinese-title>
        <english-title>PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="201901120260302B">B32B7/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商芯愛科技（南京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AALTOSEMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張垂弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, ANDREW C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝基板，係包括核心板體及形成於該核心板體之相對二表面上之介電層，該介電層係作為表面覆蓋層以避免基板破裂。該封裝基板復包括貫穿該核心板體及介電層之複數通孔、形成於該複數通孔內壁上之阻障層及形成於該複數通孔內壁之阻障層上的晶種層，以利該核心板體相對二表面上之線路部及線路結構電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a package substrate, which includes a core board and dielectric layers formed on the opposite surfaces of the core board, wherein the dielectric layers serve as a cover layer to prevent the substrate from cracking. The package substrate further includes a plurality of through holes penetrating through the core board and the dielectric layers, a barrier layer formed on the inner walls of the through holes, and a seed layer formed on the barrier layer on the inner walls of the through holes to ensure the electrical connection of the circuit portions and circuit structures on the opposite surfaces of the core board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝基板</p>
        <p type="p">10:核心板體</p>
        <p type="p">10a:第一表面</p>
        <p type="p">10b:第二表面</p>
        <p type="p">100:通孔</p>
        <p type="p">11:第一介電層</p>
        <p type="p">12:阻障層</p>
        <p type="p">13:晶種層</p>
        <p type="p">14:線路部</p>
        <p type="p">15:線路結構</p>
        <p type="p">151:第二介電層</p>
        <p type="p">1510:開孔</p>
        <p type="p">152:線路層</p>
        <p type="p">153:導電盲孔</p>
        <p type="p">16:防焊層</p>
        <p type="p">154:電性連接墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="578" publication-number="202632911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解碼器、解碼方法、記憶體控制器及記憶體系統</chinese-title>
        <english-title>DECODER, DECODING METHOD, MEMORY CONTROLLER AND MEMORY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03M13/11</main-classification>
        <further-classification edition="200601120250401B">H03M13/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, ZHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種解碼器，包括：第一記憶體和消息更新電路。第一記憶體被配置為存儲後驗機率消息。消息更新電路被配置為按照第一讀取順序從第一記憶體中依次讀取當前層的各非零子矩陣對應的後驗機率消息，第一讀取順序是根據當前層的各非零子矩陣的位置確定的；基於當前迭代中當前層的各非零子矩陣對應的後驗機率消息，得到更新的當前層的各非零子矩陣對應的後驗機率消息；以及，按照第一寫入順序將更新的當前層的各非零子矩陣對應的後驗機率消息依次寫入第一記憶體，第一寫入順序是根據第一讀取順序確定的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A decoder is provided, which includes a first memory and a message updating circuit. The first memory is configured to store posteriori probability messages. The message updating circuit is configured to: sequentially read posteriori probability messages corresponding to respective non-zero sub-matrices of a current layer from the first memory in accordance with a first reading order, the first reading order being determined based on positions of the respective non-zero sub-matrices of the current layer; obtain updated posteriori probability messages corresponding to the respective non-zero sub-matrices of the current layer based on posteriori probability messages corresponding to the respective non-zero sub-matrices of the current layer in a current iteration; and sequentially write the updated posteriori probability messages corresponding to the respective non-zero sub-matrices of the current layer into the first memory in accordance with a first writing order, the first writing order being determined based on the first reading order.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1001~S1003:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="579" publication-number="202632671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通道模型實現電路及通道模型實現方法、記憶體控制器、電子設備、記憶體系統</chinese-title>
        <english-title>CHANNEL MODEL IMPLEMENTATION CIRCUIT AND CHANNEL MODEL IMPLEMENTATION METHOD, MEMORY CONTROLLER, ELECTRONIC DEVICE AND MEMORY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G11C29/08</main-classification>
        <further-classification edition="200601120250502B">G11C29/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔錫奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種通道模型實現電路及通道模型實現方法、記憶體控制器、電子設備、記憶體系統，通道模型實現電路包括至少一個通道模型實現子電路；通道模型實現子電路包括：亂數產生電路，被配置為：生成亂數；通道輸出資訊確定電路，被配置為：接收通道輸入資訊的一個子資料；基於亂數、亂數區間組資訊以及子資料，確定子資料對應的通道輸出資訊；其中，子資料包括至少兩個資料狀態，亂數區間組資訊包括不同資料狀態下多個亂數區間與多個通道輸出資訊的映射關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a channel model implementation circuit, a channel model implementation method, a memory controller, an electronic device and a memory system. The channel model implementation circuit includes at least one channel model implementation sub-circuit. The channel model implementation sub-circuit includes: a random number generation circuit configured to generate random numbers; and a channel output information determination circuit configured to receive a sub-data of channel input information; and determine channel output information corresponding to the sub-data based on a random number, random number interval group information and the sub-data. The sub-data includes at least two data states, and the random number interval group information includes a mapping relationship between a plurality of random number intervals and a plurality of pieces of channel output information under different data states.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:通道模型實現電路</p>
        <p type="p">501:通道模型實現子電路</p>
        <p type="p">502:存儲部件</p>
        <p type="p">510:亂數產生電路</p>
        <p type="p">520:通道輸出資訊確定電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="580" publication-number="202632790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器組件及其組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250505B">H01R12/72</main-classification>
        <further-classification edition="200601120250505B">H01R13/46</further-classification>
        <further-classification edition="200601120250505B">H01R43/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀興強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XING-QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種電連接器組件及其組裝方法。電連接器組件包括一連接器模組、一電路板、一固定殼體及一線纜模組。連接器模組包括第一殼體和固定在殼體內的多個第一導電端子，第一導電端子焊接到電路板。固定殼體包括主體及設於主體兩側的鎖固部，主體上開設有收容腔和第二對接腔，連接器模組收容於收容腔中。線纜模組包括第二導電端子及線纜，第二導電端子收容於主體的第二對接腔內，鎖固部將連接器模組及線纜模組鎖固於電路板。上述電連接器組件及其組裝方法能夠避免線纜模組遭受焊接時的高溫，並可以使連接器模組、線纜模組通過固定殼體更穩定地固定到電路板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電連接器組件</p>
        <p type="p">11:連接器模組</p>
        <p type="p">111:第一殼體</p>
        <p type="p">112:第一導電端子</p>
        <p type="p">1122:第一焊接尾部</p>
        <p type="p">12:電路板</p>
        <p type="p">120:焊接墊</p>
        <p type="p">13:固定殼體</p>
        <p type="p">132:鎖固部</p>
        <p type="p">1323:插槽</p>
        <p type="p">14:線纜模組</p>
        <p type="p">142:線纜</p>
        <p type="p">20:外接電路板</p>
        <p type="p">21:插入部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="581" publication-number="202632609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安全設備的偵測方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR SAFETY EQUIPMENT DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V20/59</main-classification>
        <further-classification edition="202201120250401B">G06V10/42</further-classification>
        <further-classification edition="202201120250401B">G06V40/20</further-classification>
        <further-classification edition="201201120250401B">B60W40/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡曉霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, XIAOXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種安全設備的偵測方法，其包含取得含有駕乘人員的輸入圖像、將輸入圖像輸入預先訓練的實例分割模型以取得該實例分割模型輸出的實例分割結果、基於實例分割結果計算關聯於安全設備的屬性數據，以及基於屬性數據判斷駕乘人員是否配備安全設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for safety equipment detection is provided. The method includes obtaining an input image containing an occupant, inputting the input image into a pre-trained instance segmentation model to obtain instance segmentation result output by the instance segmentation model, calculating attribute data associated with a safety equipment based on the instance segmentation result, and determining whether the occupant is equipped with the safety equipment based on the attribute data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">S101-S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="582" publication-number="202632806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H01R13/629</main-classification>
        <further-classification edition="200601120250401B">H01R13/639</further-classification>
        <further-classification edition="201101120250401B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀興強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XING-QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種電連接器組件，包括一絕緣外殼及固定到絕緣外殼的端子模組。絕緣外殼包括一主體及設置在該主體兩側的兩鎖固部，兩鎖固部用於將主體鎖固於一基板上。主體的前端形成有一收容腔，收容腔沿所述主體的縱向延伸。端子模組設於收容腔的後方，端子模組包括多個導電端子及用於固定導電端子的模組殼體。導電端子向前突伸至收容腔內且呈兩排上下排列。主體的收容腔的中部沿著橫向延伸有一擋止部，擋止部的兩端分別連接在收容腔的兩側壁。擋止部位於上下兩排導電端子之間，其中擋止部相對於端子模組的模組殼體是向前突出的，從而可對應擋止插入收容腔的一對接板。上述電連接器組件能夠保持端子模組穩固連接，保持電連接器組件正常工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電連接器組件</p>
        <p type="p">11:絕緣外殼</p>
        <p type="p">112:鎖固部</p>
        <p type="p">113:收容腔</p>
        <p type="p">115:緊固件</p>
        <p type="p">117:沉槽</p>
        <p type="p">13:固定殼</p>
        <p type="p">20:對接板</p>
        <p type="p">21:導電墊片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="583" publication-number="202633424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機佈線基板及有機佈線基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木優美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可兼顧佈線的高密度化和串擾的抑制的有機佈線基板(1)。一種有機佈線基板(1)，具備：積層的複數的絕緣樹脂膜(40)以及形成於絕緣樹脂膜(40)的通孔，該有機佈線基板(1)，在以積層絕緣樹脂膜(40)的方向作為積層方向(1020)的情況下，絕緣樹脂膜(40)的積層方向(1020)的厚度，大於在通孔(20)的積層方向(1020)之中央位置的與積層方向(1020)正交的剖面之圓當量直徑，絕緣樹脂膜(40)的厚度未滿10μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:通孔</p>
        <p type="p">30:佈線層</p>
        <p type="p">40:絕緣樹脂膜</p>
        <p type="p">70:重佈線層</p>
        <p type="p">72:方框包圍</p>
        <p type="p">1010:平面方向</p>
        <p type="p">1020:積層方向</p>
        <p type="p">1021:表面方向</p>
        <p type="p">1022:背面方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="584" publication-number="202633499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創意電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL UNICHIP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊昇帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡文逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, WEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾卡諾維奇　毅格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELKANOVICH, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電子裝置包括半導體晶粒、中介層和被動元件。半導體晶粒藉由晶粒間隙區域在側向上彼此間隔開。半導體晶粒接合到中介層第一表面上，其中中介層在晶粒間隙區域中提供間隙電傳輸路徑，間隙電傳輸路徑從中介層第一表面延伸到中介層第二表面，第二表面與第一表面相對。被動元件接合到中介層第二表面上，並位於晶粒間隙區域中，其中被動元件通過間隙電傳輸路徑與半導體晶粒電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes semiconductor dies, an interposer, and a passive component. The semiconductor dies are laterally spaced from each other by a die gap region. The semiconductor dies are bonded onto a first surface of the interposer, wherein the interposer provides a gap electric transmission pathway in the die gap region, the gap electric transmission pathway extends from the first surface of the interposer to a second surface of the interposer, and the second surface is opposite to the first surface. The passive component is bonded onto the second surface of the interposer, and located in the die gap region, wherein the passive component is electrically connected to the semiconductor dies through the gap electric transmission pathway.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110A、110B:半導體晶粒</p>
        <p type="p">120:中介層</p>
        <p type="p">122:間隙電傳輸路徑</p>
        <p type="p">122A:第一間隙電傳輸路徑</p>
        <p type="p">122B:第二間隙電傳輸路徑</p>
        <p type="p">124、126:下方電傳輸路徑</p>
        <p type="p">124A、126A:第一下方電傳輸路徑</p>
        <p type="p">124B、126B:第二下方電傳輸路徑</p>
        <p type="p">128:橫向信號傳輸路徑</p>
        <p type="p">130:被動元件</p>
        <p type="p">132A:第一接合墊</p>
        <p type="p">132B:第二接合墊</p>
        <p type="p">B120:第二表面</p>
        <p type="p">T120:第一表面</p>
        <p type="p">RG:晶粒間隙區域</p>
        <p type="p">X、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="585" publication-number="202632582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供頁面之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING A PAGE AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250801B">G06Q30/0251</further-classification>
        <further-classification edition="202301120250801B">G06Q30/01</further-classification>
        <further-classification edition="201901120250801B">G06F16/9535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙承妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簾明悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門弘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOMOON, HONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示一種藉由電子裝置而提供頁面之方法，其包括如下步驟：於上述電子裝置提供之服務中，確認與用戶之活動歷史對應之一個以上之物品類別；獲得上述用戶用以於上述服務中實行物品檢索之第1輸入；及對應於上述第1輸入，提供包括上述一個以上之物品類別之資訊之檢索實行頁面；且上述活動歷史包括上述用戶於上述服務中查詢物品之詳細頁面之歷史。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">301:動作</p>
        <p type="p">303:動作</p>
        <p type="p">305:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="586" publication-number="202632704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵結構</chinese-title>
        <english-title>KEY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">H01H13/705</main-classification>
        <further-classification edition="200601120260326B">H01H13/7065</further-classification>
        <further-classification edition="200601120260326B">H01H13/20</further-classification>
        <further-classification edition="200601120260326B">H01H13/52</further-classification>
        <further-classification edition="200601120260326B">H01H13/85</further-classification>
        <further-classification edition="200601120260326B">H01H3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按鍵結構，其包含一底座、一鍵帽、一回復力機構及一開關。鍵帽設置於底座之上。回復力機構設置於底座及鍵帽之間。回復力機構包括一彈簧以及一矽膠圓凸，彈簧設置於矽膠圓凸周圍。開關固定設置於底座及矽膠圓凸之間。其中，當鍵帽位於一初始位置時，鍵帽與彈簧分開，且鍵帽與矽膠圓凸接觸。當鍵帽承受一按壓力時，鍵帽自初始位置朝向底座移動至一轉換位置時，鍵帽與彈簧接觸。當鍵帽朝向底座移動超過一觸發位置之後，矽膠圓凸觸發開關以產生一觸發訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A key structure includes a base, a key cap, a restoring force mechanism and a switch. The key cap is arranged on the base. The restoring force mechanism is arranged between the base and the key cap. The restoring force mechanism includes a spring and a rubber dome, wherein the spring is arranged around the silicone convex portion. The switch is fixedly arranged between the base and the rubber dome. When the key cap is located at an initial position, the key cap is separated from the spring, and the key cap is in contact with the rubber dome. When the key cap is subjected to a pressing force, the key cap moves from the initial position toward the base to a conversion position, and the key cap contacts the spring. When the key cap moves toward the base and exceeds a trigger position, the rubber dome triggers the switch to generate a trigger signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:按鍵結構</p>
        <p type="p">110:底座</p>
        <p type="p">120:鍵帽</p>
        <p type="p">124:支撐結構</p>
        <p type="p">125,126:剪刀腳</p>
        <p type="p">130:回復力機構</p>
        <p type="p">131:彈簧</p>
        <p type="p">132:矽膠圓凸</p>
        <p type="p">133:環狀基部單元</p>
        <p type="p">134:凸頂單元</p>
        <p type="p">135:圓柱形單元</p>
        <p type="p">136:下壓突出件</p>
        <p type="p">137:容納空間</p>
        <p type="p">140:開關</p>
        <p type="p">A1:初始位置</p>
        <p type="p">A2:轉換位置</p>
        <p type="p">A3:觸發位置</p>
        <p type="p">H1:高度差</p>
        <p type="p">H2:距離</p>
        <p type="p">D1:外徑</p>
        <p type="p">D2:內徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="587" publication-number="202632791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及電連接器組合</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250310B">H01R12/72</main-classification>
        <further-classification edition="200601120250310B">H01R13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王治強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHI-QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器及電連接器組合，該電連接器包括：一連接器本體、附接於連接器本體的多個端子以及附接於連接器本體的兩端的兩個加強件；其中，每個加強件包括：一端壁覆蓋部，附接於連接器本體的一端壁；一對側壁覆蓋部，附接於連接器本體的兩個側壁，每個側壁覆蓋部分別通過一連接部與端壁覆蓋部連接；每個端壁覆蓋部包括一側板部、連接於側板部的上部的上覆蓋部以及連接於部分上覆蓋部的延伸部，上覆蓋部至少部分地覆蓋連接器本體的側壁上部，延伸部至少部分地完全埋沒在連接器本體的側壁內。本發明通過將加強件的延伸部至少部分地埋入連接器本體內，提高了加強件與連接器本體的結合強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一電連接器</p>
        <p type="p">10:第一連接器本體</p>
        <p type="p">101:側壁</p>
        <p type="p">102:端壁</p>
        <p type="p">104:第一凸部</p>
        <p type="p">109:第一端部</p>
        <p type="p">20:第一端子</p>
        <p type="p">201:第一電源端子</p>
        <p type="p">202:第一信號端子</p>
        <p type="p">30:第一加強件</p>
        <p type="p">302:側壁覆蓋部</p>
        <p type="p">600:第二電連接器</p>
        <p type="p">60:第二連接器本體</p>
        <p type="p">603:頂板</p>
        <p type="p">609:第二端部</p>
        <p type="p">70:第二端子</p>
        <p type="p">701:第二電源端子</p>
        <p type="p">702:第二信號端子</p>
        <p type="p">80:第二加強件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="588" publication-number="202631066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咖啡機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">A47J31/42</main-classification>
        <further-classification edition="200601120260423B">A47J42/20</further-classification>
        <further-classification edition="200601120260423B">A47J42/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大都娛樂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAITO ENTERTAINMENT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤俊雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織田精司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具備研磨咖啡豆之上刃與下刃的咖啡機，且提供一種可縮短磨豆時間的咖啡機。&lt;br/&gt;本發明之咖啡機GM、CM具備：上刃531，其於貫通孔5310之周圍將第一刃531b形成為向下；下刃541，其與上刃531對向配置，將第二刃541b形成為向上；及驅動部540M，其使下刃541向規定之旋轉方向旋轉驅動；且於第一刃531b與第二刃541b之間研磨自貫通孔5310投入而落下至下刃541之咖啡豆；且下刃541於自貫通孔5310投入之咖啡豆落下之位置具備具有複數片葉片70B之葉輪70；葉輪70藉由向與下刃541之規定之旋轉方向相同之正旋轉方向旋轉，而將落下至下刃541之咖啡豆誘導至第二刃541b。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">53:固定刃單元</p>
        <p type="p">53L:落豆路徑</p>
        <p type="p">54:旋轉刃單元</p>
        <p type="p">55:安裝臂</p>
        <p type="p">70:葉輪</p>
        <p type="p">530:固定刃箱體</p>
        <p type="p">530n:合體用內螺紋部</p>
        <p type="p">531:固定刃(上刃)</p>
        <p type="p">531b:刃面(第一刃)</p>
        <p type="p">532:蝸輪</p>
        <p type="p">533:連結撥盤</p>
        <p type="p">539:料槽</p>
        <p type="p">540:旋轉刃箱體</p>
        <p type="p">540n:合體用外螺紋部</p>
        <p type="p">540w:齒輪嚙合窗</p>
        <p type="p">541:旋轉刃(下刃)</p>
        <p type="p">541b:刃面(第二刃)</p>
        <p type="p">542:驅動齒輪</p>
        <p type="p">543:旋轉底座</p>
        <p type="p">544:螺栓</p>
        <p type="p">5310:貫通孔</p>
        <p type="p">5311:頭部</p>
        <p type="p">5411:頭部</p>
        <p type="p">5431:槳葉</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="589" publication-number="202632948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼器及相關的編碼方法</chinese-title>
        <english-title>ENCODER AND ASSOCIATED ENCODING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250401B">H04N19/10</main-classification>
        <further-classification edition="201401120250401B">H04N19/169</further-classification>
        <further-classification edition="200601120250401B">G06T9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾逸晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾偉民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, CHI-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伍軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WUJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種編碼器，其包含有M個核心電路。該M個核心電路用來對一影像圖框之第一列超級區塊至第M列超級區塊進行編碼，並在每一個超級區塊進行編碼的過程中相應地更新一CDF表，其中M為大於1的正整數；以及該M個核心電路分別對該影像圖框之第(M+1)列超級區塊至第(2*M)列超級區塊進行編碼，並在每一個超級區塊進行編碼的過程中相應地更新該CDF表，其中該M個核心電路的第一個核心電路使用該第一列超級區塊之最後一個超級區塊在編碼過程中所產生之該CDF表，以對該第(M+1)列超級區塊的第一個超級區塊進行編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an encoder, which includes M core circuits. The M core circuits are configured to encode a first row of super blocks to a Mth row of super blocks of an image frame, and update a CDF table correspondingly during the encoding process of each super block, where M is a positive integer greater than 1; and the M core circuits respectively encode a (M+1)-th row of super blocks to a (2*M)-th row of super blocks of the image frame, and in the encoding process of each super block, and update the CDF table correspondingly during the encoding process of each super block, wherein a first core circuit of the M core circuits uses the CDF table generated during the encoding process of a last super block of the first row of super blocks to encode a first super block of the (M+1)th row of super blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600~604:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="590" publication-number="202632949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼器及相關的編碼方法</chinese-title>
        <english-title>ENCODER AND ASSOCIATED ENCODING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250401B">H04N19/10</main-classification>
        <further-classification edition="201401120250401B">H04N19/169</further-classification>
        <further-classification edition="201401120250401B">H04N19/124</further-classification>
        <further-classification edition="200601120250401B">G06T9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾逸晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾偉民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, WEIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, CHI-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伍軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WUJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種編碼方法，其包含有以下步驟：決定一影像圖框之一第一超級區塊的一第一量化參數；決定出該第一超級區塊的一二元碼；判斷該第一超級區塊的二元碼資訊是否大於一第一臨界值；以及若是該第一超級區塊的該二元碼資訊大於該第一臨界值，提升一第二超級區塊的一第二量化參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an encoding method, which includes the following steps: determining a first quantization parameter of a first super block of an image frame; determining a binary code of the first super block; determining whether binary code information of the first super block is greater than a first threshold value; and if the binary code information of the first super block is greater than the first threshold value, increasing a second quantization parameter of a second super block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">SB1~SB6:超級區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="591" publication-number="202631723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含抗黏連劑之光可固化組成物</chinese-title>
        <english-title>PHOTOCURABLE COMPOSITION COMPRISING ANTI-BLOCKING AGENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08F2/48</main-classification>
        <further-classification edition="200601120260422B">C08F2/50</further-classification>
        <further-classification edition="200601120260422B">C08F212/34</further-classification>
        <further-classification edition="200601120260422B">C08L25/02</further-classification>
        <further-classification edition="200601120260422B">C08L71/02</further-classification>
        <further-classification edition="200601120260422B">C08K5/00</further-classification>
        <further-classification edition="200601120260422B">C08K5/06</further-classification>
        <further-classification edition="200601120260422B">C09D4/00</further-classification>
        <further-classification edition="201801120260422B">C09D7/40</further-classification>
        <further-classification edition="201401120260422B">C09D11/101</further-classification>
        <further-classification edition="200601120260422B">B05D5/08</further-classification>
        <further-classification edition="200601120260422B">G03F7/004</further-classification>
        <further-classification edition="200601120260422B">G03F7/027</further-classification>
        <further-classification edition="200601120260422B">G03F7/031</further-classification>
        <further-classification edition="200601120260422B">G03F7/038</further-classification>
        <further-classification edition="200601120260422B">G03F7/16</further-classification>
        <further-classification edition="200601120260422B">G03F7/20</further-classification>
        <further-classification edition="202601120260422B">H10P14/68</further-classification>
        <further-classification edition="202601120260422B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥奎斯蒂　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCUISTION, CAROLINE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉衛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可包含可聚合材料、抗黏連劑、及光起始劑之光可固化組成物，其中該可聚合材料基本上可由至少一種多官能性芳族乙烯基單體組成；該抗黏連劑可具有式(1)或式(2)之結構：&lt;br/&gt;&lt;img align="absmiddle" height="78px" width="243px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；或&lt;img align="absmiddle" height="75px" width="193px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中m係8至15，n係7至15，o係8至20；X係芳基或CH&lt;sub&gt;2&lt;/sub&gt;，及R&lt;sub&gt;1&lt;/sub&gt;係H或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt;烷基；且該光可固化組成物的黏度在23℃下不大於50 mPa·s。該光可固化組成物與矽基材可具有不大於25度的低接觸角；且在使該光可固化組成物進行光固化之後，可需要低的離型力來移除覆板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photocurable composition can comprise a polymerizable material, an anti-blocking agent, and a photoinitiator, wherein the polymerizable material can consist essentially of at least one multi-functional aromatic vinyl monomer; the anti-blocking agent may have a structure of formula (1) or formula (2):&lt;br/&gt;&lt;img align="absmiddle" height="67px" width="237px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;; or&lt;img align="absmiddle" height="77px" width="219px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, wherein m is 8-15, n is 7-15, o is 8-20; X is aryl or CH&lt;sub&gt;2&lt;/sub&gt;, and R&lt;sub&gt;1&lt;/sub&gt;is H or C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt;- alkyl; and a viscosity of the photocurable composition is not greater than 50 mPa·s at 23°C. The photocurable composition can have a low contact angle to a silicon substrate of not greater than 25 degrees; and a low release force may be required to remove a superstrate after subjecting the photocurable composition to photo-curing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="592" publication-number="202631961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種化合物、包含該化合物的液晶組合物及液晶顯示元件、液晶顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">C09K19/34</main-classification>
        <further-classification edition="200601120250602B">C09K19/30</further-classification>
        <further-classification edition="200601120250602B">C09K19/12</further-classification>
        <further-classification edition="200601120250602B">C09K19/14</further-classification>
        <further-classification edition="200601120250602B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商石家莊誠志永華顯示材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIJIAZHUANG CHENGZHI YONGHUA DISPLAY MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張虎波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HU-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑永鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, YONG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨鵬瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, PENG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, REN-ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種化合物、包含該化合物的液晶組合物及液晶顯示元件、液晶顯示器。所述化合物選自式I所示的化合物，其中，c、d各自獨立地表示1或2，且c+d表示3；Z        &lt;sub&gt;1&lt;/sub&gt;、Z        &lt;sub&gt;2&lt;/sub&gt;表示碳原子數為1-15的直鏈或支鏈烷基，其中至少一個-CH        &lt;sub&gt;2&lt;/sub&gt;-被-O-取代；Z表示單鍵、碳原子數為1-15的直鏈或支鏈烷基，其中一個或多個不相鄰的-CH        &lt;sub&gt;2&lt;/sub&gt;-被-O-取代。包含該化合物的液晶組合物具有改善的對紫外線的穩定性和對熱的穩定性，尤其是具有對高溫高濕信賴性的穩定性且同時可以保證-40℃的低溫環境下正常使用。包含該液晶組合物的液晶顯示元件、液晶顯示器同樣具有如前所述的性能。        &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="141px" width="378px" file="ed10228.JPG" alt="ed10228.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="593" publication-number="202632472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>追蹤資訊對齊方法、追蹤系統及電腦可讀儲存媒體</chinese-title>
        <english-title>TRACKING INFORMATION ALIGNMENT METHOD, TRACKING SYSTEM AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁祥逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, SHANG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種追蹤資訊對齊方法、追蹤系統及電腦可讀儲存媒體。所述方法包括：由第一追蹤裝置透過對外顯示器顯示資訊圖樣；由第二追蹤裝置擷取資訊圖樣，並據以判定第一及第二追蹤裝置之間的參考相對姿態，以及取得第一追蹤裝置的裝置資訊；在第一及第二追蹤裝置依據裝置資訊建立連線之後，由第一追蹤裝置透過連線將第一追蹤裝置的第一裝置姿態發送至第二追蹤裝置；以及由第二追蹤裝置基於參考相對姿態及所接收的第一裝置姿態判定座標轉換關係，並據以將所接收的第一裝置姿態轉換為第一參考裝置姿態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure provide a tracking information alignment method, a tracking system and a computer-readable storage medium. The method includes: displaying, by a first tracking device, an information pattern through an outward display; capturing, by a second tracking device, the information pattern, and accordingly determining a reference relative pose between the first and second tracking devices, and obtaining device information of the first tracking device; after the first and second tracking devices establish a connection based on the device information, sending, by the first tracking device, a first device pose of the first tracking device to the second tracking device through the connection; and determining, by the second tracking device, a coordinate conversion relationship based on the reference relative pose and the received first device pose, and accordingly converting the received first device pose into a first reference device pose.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210,S220,S230,S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="594" publication-number="202631346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備標定方法、自動化設備及存儲介質</chinese-title>
        <english-title>METHOD FOR CALIBRATING EQUIPMENT, AUTOMATED EQUIPMENT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">B25J9/10</main-classification>
        <further-classification edition="200601120250704B">B25J9/16</further-classification>
        <further-classification edition="200601120250704B">G05B19/401</further-classification>
        <further-classification edition="200601120250704B">G05B19/19</further-classification>
        <further-classification edition="202401120250704B">G06T3/147</further-classification>
        <further-classification edition="202201120250704B">G06V10/46</further-classification>
        <further-classification edition="201701120250704B">G06T7/70</further-classification>
        <further-classification edition="201801120250704B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雅鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YA-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡子琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TZYY-CHYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代中義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, ZHONG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱慶樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, QING-LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種設備標定方法、自動化設備及存儲介質，所述方法包括：基於預設的控制參數，控制機械手抓取標定塊在預設區域內多次移動；記錄機械手在每次移動後到達的點位，並獲取機械手移動到每個點位元時預設區域對應的區域圖像；若區域圖像與預設的參考圖像匹配，獲取區域圖像中的標定塊的圖元座標，以及基於自動化設備對應的設備座標系，獲取機械手移動到每個點位時標定塊的位置座標；基於圖元座標變換至位置座標的映射關係，完成對自動化設備的標定並生成仿射矩陣。上述方法能夠提高設備標定的準確度與效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for calibrating equipment, automated equipment, and a storage medium. The method includes: controlling a robotic arm to grasp a calibration block and move the calibration block for multiple times within a preset area based on preset control parameters; recording positions that the robotic arm reaches after each movement and obtaining corresponding area images of the preset area when the robotic arm moves to each position; in response that the area images match preset reference images, obtaining pixel coordinates of the calibration block in the area images, and based on a device coordinate system corresponding to the automated equipment, obtaining position coordinates of the calibration block when the robotic arm moves to each position; based on a mapping relationship between the pixel coordinates and the position coordinates, completing the calibration of the automated equipment and generating an affine matrix. The method for calibrating equipment can improve the accuracy and efficiency of equipment calibration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="595" publication-number="202632451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載具管控方法、用戶端、伺服器及存儲介質</chinese-title>
        <english-title>METHOD FOR CONTROLLING LOADING EQUIPMENT, USER EQUIPMENT, SERVER AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G05B23/02</main-classification>
        <further-classification edition="200601120250602B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文俊凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, JUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及生產管控技術領域，提供一種載具管控方法、用戶端、伺服器及存儲介質。該方法包括：在載具承載產品進入工站時，若根據載具的載具碼確定載具的使用狀態為禁用狀態，對載具和產品作拋料處理；若載具的使用狀態為可用狀態，控制工站的生產設備對產品進行加工，並獲取加工後的產品的測試結果；若產品的測試結果表徵加工後的產品沒有通過測試，對載具和加工後的產品作拋料處理；及生成載具的負標籤，並向伺服器發送載具的負標籤。本發明能夠對載具進行有效管控，避免使用不良載具影響生產。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a technical field of production control, and provides a method for controlling loading equipment, user equipment, a server and a storage medium. The method includes: when the loading equipment carrying a product enters a work station, a use state of the loading equipment is determined to be a disabled state according to a code of the loading equipment, discarding the loading equipment and the product; if the use state of the loading equipment is a usable state, controlling processing equipment of the work station to process the product and obtaining a test result of the processed product; if the test result indicates that the processed product fails to pass a test, discarding the loading equipment and the processed product; generating a negative tag of the loading equipment and sending the negative tag of the loading equipment to a server. The present application can effectively control the loading equipment and avoid invalid loading equipment affecting production.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~207:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="596" publication-number="202633188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251204B">H10D89/60</main-classification>
        <further-classification edition="202501120251204B">H10D62/10</further-classification>
        <further-classification edition="202501120251204B">H10D62/60</further-classification>
        <further-classification edition="202501120251204B">H10D62/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃麟淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括靜電放電（ESD）保護裝置，該ESD保護裝置包括多個非連續植入部分，這些非連續植入部分在半導體裝置基底中的各個井區之間間隔開。非連續植入部分之間的空間在基底中提供區域，摻雜劑可從非連續植入部分擴散到這些區域。因此，摻雜劑可擴散到基底中比包括連續植入部分的源極/汲極區更大的基底區域。結果，來自植入部分的摻雜劑濃度可在基底中降低。這減少了靠近閘極結構的摻雜劑堆積和濃度，從而降低了靠近閘極結構的電場強度。靠近閘極結構的電場強度降低減輕了多次ESD事件對ESD保護裝置造成的損害。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an electrostatic discharge (ESD) protection device that includes a plurality of non-contiguous implant portions that are spaced apart with respective well regions between the non-contiguous implant portions in a substrate of the semiconductor device. The space between the non-contiguous implant portions provides areas in the substrate in which dopants from the non-contiguous implant portions may diffuse. Thus, the dopants can diffuse into the substrate across a greater area of the substrate than in a source/drain region including continuous implant portions. As a result, the dopant concentration from the implant portions may be reduced in the substrate. This reduces the build-up and concentration of dopants near a gate structure, which reduces the strength of the electric field near the gate structure. The reduced strength of the electric field near the gate structure lessens the damage caused to the ESD protection device across multiple ESD events.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:ESD保護裝置</p>
        <p type="p">104:基底</p>
        <p type="p">106、108:源極/汲極區</p>
        <p type="p">110:閘極結構</p>
        <p type="p">112、114:輕摻雜植入區</p>
        <p type="p">116、120:源極/汲極接觸件</p>
        <p type="p">118、122:源極/汲極互連件</p>
        <p type="p">124:閘極接觸件</p>
        <p type="p">126:閘極互連件</p>
        <p type="p">128:STI區域</p>
        <p type="p">130:井區</p>
        <p type="p">132:通道區</p>
        <p type="p">134:擴散區</p>
        <p type="p">136:矽化物層</p>
        <p type="p">138:層間介電層/ILD層</p>
        <p type="p">140:蝕刻停止層/ESL</p>
        <p type="p">142:互連層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="597" publication-number="202632195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物品保管裝置及物品保管方法</chinese-title>
        <english-title>ITEM STORAGE DEVICE AND ITEM STORAGE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">F25D11/00</main-classification>
        <further-classification edition="200601120260127B">F25D23/00</further-classification>
        <further-classification edition="200601120260127B">B65G1/06</further-classification>
        <further-classification edition="200601120260127B">B65G1/137</further-classification>
        <further-classification edition="202401120260127B">G06Q50/00</further-classification>
        <further-classification edition="200601120260127B">B65D88/74</further-classification>
        <further-classification edition="202101120260127B">G03B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基肖爾　阿布舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHORE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可提供一種物品保管裝置，其包括：埠，其供入庫及出庫之物品放置；第1腔室，其與上述埠連接，並藉由上述埠與上述第1腔室之間具備之第1門而與上述物品保管裝置外部屏蔽；第2腔室，其與上述第1腔室連接，並藉由上述第1腔室與上述第2腔室之間具備之第2門而與上述第1腔室屏蔽；及處理器，其以於上述物品自埠入庫至上述第2腔室或自上述第2腔室出庫至埠時使上述埠不與上述第2腔室連通之方式控制上述第1門及上述第2門。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:埠</p>
        <p type="p">220:第1腔室</p>
        <p type="p">230:第2腔室</p>
        <p type="p">231:第1上下線</p>
        <p type="p">233:移動式物品保管線</p>
        <p type="p">235:第2上下線</p>
        <p type="p">240:第1門</p>
        <p type="p">250:第2門</p>
        <p type="p">260:第1空氣移動裝置</p>
        <p type="p">270:第2空氣移動裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="598" publication-number="202632350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G02B6/26</main-classification>
        <further-classification edition="200601120251204B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂聯威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, LIAN WEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張澤恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSE-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了半導體裝置。半導體裝置包括第一板以及鄰近第一板的第二板。第一板的第一厚度大於第二板的第二厚度。半導體裝置還包括在第一板上的至少一個第一波導以及在與至少一個第一波導耦合的第一板和第二板上的多模干涉器。第一板和第二板之間的介面在多模干涉器下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a first slab, and a second slab adjacent to the first slab. A first thickness of the first slab is larger than a second thickness of the second slab. The semiconductor device further includes at least one first waveguide on the first slab and a multi-mode interferometer on the first slab and the second slab coupled with the at least one first waveguide. An interface between the first slab and the second slab is below the multi-mode interferometer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:第一板</p>
        <p type="p">104:第二板</p>
        <p type="p">106:第一波導</p>
        <p type="p">108:多模干涉器</p>
        <p type="p">110:第二波導</p>
        <p type="p">112:介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="599" publication-number="202632333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置以及光子積體電路的形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING PHOTONIC INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G02B6/12</main-classification>
        <further-classification edition="200601120260424B">G02B6/136</further-classification>
        <further-classification edition="200601120260424B">G02B6/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳季汎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘韋程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻中一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宗霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TSUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置的光子積體電路包括在邊緣耦合器波導和光子積體電路的另一光子組件的波導之間具有可變厚度的耦合波導。特別地，耦合波導在面向邊緣耦合器波導的第一端的厚度小於耦合波導在面向其他光子組件的波導的第二端的厚度。耦合波導的厚度可以在第一端和第二端之間以近似線性方式（例如，耦合波導在第一端和第二端之間為錐形）、以彎曲方式（例如，耦合波導可以在第一端和第二端之間具有非線性過渡）、和/或以其他方式過渡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photonic integrated circuit of a semiconductor device includes a coupling waveguide that has a variable thickness between an edge coupler waveguide and a waveguide of another photonic component of the photonic integrated circuit. In particular, a thickness of the coupling waveguide at the first end of the coupling waveguide facing the edge coupler waveguide is less than a thickness of the coupling waveguide at a second end of the coupling waveguide facing the waveguide of the other photonic component. The thickness of the coupling waveguide may transition between the first end and the second end in an approximately linear manner (e.g., the coupling waveguide is tapered between the first end and the second end), in a curved manner (e.g., the coupling waveguide may have a non-linear transition between the first end and the second end), and/or in another manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:例子</p>
        <p type="p">102:光子積體電路</p>
        <p type="p">104:邊緣耦合器波導</p>
        <p type="p">106:波導</p>
        <p type="p">108:耦合波導</p>
        <p type="p">142、144:耦合區</p>
        <p type="p">146:斜坡段</p>
        <p type="p">D1、D2、D3、D4:尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="600" publication-number="202632583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250901B">G06Q30/06</further-classification>
        <further-classification edition="202301120250901B">G06Q30/0201</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙承妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簾明悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門弘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOMOON, HONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種與應用程式有關之電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：基於用戶之輸入，獲得對包括第1類型之第1物品之一個以上之物品的結算頁面請求；隨著確認到上述第1物品之價格未達第1臨界值，確認滿足所設定之條件之上述第1類型之複數個物品；基於與上述用戶之上述應用程式使用歷史有關之資訊、與上述複數個物品之價格有關之資訊、及和上述第1物品之價格與上述第1臨界值間之差異有關之資訊中的至少一者，確定上述複數個物品之顯示順序；及提供按照上述所確定之顯示順序顯示有上述複數個物品之頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">200:用戶終端</p>
        <p type="p">S205:步驟</p>
        <p type="p">S210:步驟</p>
        <p type="p">S215:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S225:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S235:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S245:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S255:步驟</p>
        <p type="p">S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="601" publication-number="202632938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器及其流量處理方法</chinese-title>
        <english-title>SERVER AND TRAFFIC HANDLING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250801B">H04L47/22</main-classification>
        <further-classification edition="202201120250801B">H04L47/20</further-classification>
        <further-classification edition="202301120250801B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾　齊亞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIR, ZIYAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃曼　里昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARMAN, LEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪納坦　桑卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMANATHAN, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高爾　阿米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAUR, AMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡戴爾　普拉卡敘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADEL, PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷奇　喬爾　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEITCH, JOEL WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>軋格　馬尼什　庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARG, MANISH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金民均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN KYUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜智秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種伺服器之流量處理方法，其包括如下步驟：確認與服務相關之第1請求；確認上述第1請求之等級資訊；及基於與按照請求之流量等級進行處理相關之第1流量規則及上述第1請求之等級資訊來處理上述第1請求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="602" publication-number="202633059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦系統以及可拆卸風扇模組</chinese-title>
        <english-title>COMPUTER SYSTEM AND RELEASABLE FAN MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">H05K7/20</main-classification>
        <further-classification edition="200601120250328B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSORNG, YAW-TZORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游文瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WEN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於一電腦系統的一可拆卸風扇模組。電腦系統包括一機箱，具有一底面板以及複數側壁。一頂蓋與側壁接合以覆蓋機箱。一可拆卸風扇模組，位於底面板上，靠近頂蓋的一邊緣。可拆卸風扇模組包括一提把，可位於一縮回位置以及一延伸位置之間，允許一使用者將可拆卸風扇模組從機箱中移除。組件包括一栓鎖機構，位於頂蓋的該邊緣。栓鎖機構與提把嵌合，以保持提把處於縮回位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A releasable fan module assembly for a computer system is disclosed. The computer system includes a chassis having a bottom panel and side walls. A top cover is joined to the side walls to cover the chassis. A releasable fan module is located on the bottom panel in proximity to one edge of the top cover. The releasable fan module includes a handle that may be positioned between a retracted position and an extended position to allow a user to remove the releasable fan module from the chassis. The assembly includes a latch mechanism on the edge of the top cover. The latch mechanism engages the handle to keep the handle in the retracted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:伺服器</p>
        <p type="p">110:機箱</p>
        <p type="p">112、114:側牆</p>
        <p type="p">116:前頂蓋面板/頂蓋面板</p>
        <p type="p">118:後頂蓋面板/頂蓋面板</p>
        <p type="p">120:前端</p>
        <p type="p">122:後端</p>
        <p type="p">130:風扇組件</p>
        <p type="p">140:風扇模組</p>
        <p type="p">142:蓋子</p>
        <p type="p">144:提把</p>
        <p type="p">146:後框架</p>
        <p type="p">148:前框架</p>
        <p type="p">150:邊框邊緣</p>
        <p type="p">152:栓鎖</p>
        <p type="p">154:插槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="603" publication-number="202633434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/40</main-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴季暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳揚哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YANG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸湘台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSIANG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林偉睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括第一晶粒和第二晶粒。第一晶粒包括第一基底、第一內連線層、第一電感圖案以及第一接合層。第一內連線層配置在第一基底上。第一電感圖案配置在第一內連線層上。第一接合層包括第一接合墊。第二晶粒接合到第一晶粒，並包括第二基底、第二內連線層、第二電感圖案以及第二接合層。第二內連線層配置在第二基底上。第二電感圖案配置在第二內連線層上。第二接合層包括第二接合墊，其中第二接合墊與第一接合墊結合，並且其中第一電感圖案通過第一和第二接合層電性連接至第二電感圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a first die and a second die. The first die includes a first substrate, a first interconnection layer, a first inductor pattern and a first bonding layer. The first interconnection layer is disposed on the first substrate. The first inductor pattern is disposed on the first interconnection layer. The first bonding layer includes first bonding pads. The second die is bonded to the first die, and includes a second substrate, a second interconnection layer, a second inductor pattern and a second bonding layer. The second interconnection layer is disposed on the second substrate. The second inductor pattern is disposed on the second interconnection layer. The second bonding layer includes second bonding pads, wherein the second bonding pads are joined with the first bonding pads, and wherein the first inductor pattern is electrically connected to the second inductor pattern through the first and second bonding layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第一基底</p>
        <p type="p">104:第一內連線層</p>
        <p type="p">104A、106B、204A:介電層</p>
        <p type="p">104-MX、204-MX:導電層</p>
        <p type="p">104-M1、204-M1:第一導電層</p>
        <p type="p">104-M13:第十三導電層</p>
        <p type="p">104-M14:第十四導電層</p>
        <p type="p">104-M15:第十五導電層</p>
        <p type="p">104-M16:第十六導電層</p>
        <p type="p">104-M17:第十七導電層</p>
        <p type="p">106A:導電墊</p>
        <p type="p">108:第一接合層</p>
        <p type="p">108A:第一接合墊</p>
        <p type="p">108B:的第一接合膜</p>
        <p type="p">202S1:第一表面</p>
        <p type="p">202S2:第二表面</p>
        <p type="p">202TX:基底穿孔</p>
        <p type="p">204:第二內連線層</p>
        <p type="p">204-M2:第二導電層</p>
        <p type="p">204-M3:第三導電層</p>
        <p type="p">208:第二接合層</p>
        <p type="p">208A:第二接合墊</p>
        <p type="p">208B:第二接合膜</p>
        <p type="p">302A:導電柱</p>
        <p type="p">302B:導電端子</p>
        <p type="p">400:電路基板</p>
        <p type="p">410、420:接觸墊</p>
        <p type="p">430:金屬化層</p>
        <p type="p">440:導電球</p>
        <p type="p">CV1、CV3:導電通孔</p>
        <p type="p">D100:第一晶粒</p>
        <p type="p">D200:第二晶粒</p>
        <p type="p">IP1:第一電感圖案</p>
        <p type="p">IP2:第二電感圖案</p>
        <p type="p">KO1:第一禁入區</p>
        <p type="p">KO2:第二禁入區</p>
        <p type="p">PDX:被動元件</p>
        <p type="p">PK1:半導體封裝</p>
        <p type="p">SM10:半導體結構</p>
        <p type="p">UX1:底部填充結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="604" publication-number="202632362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鏡筒</chinese-title>
        <english-title>LENS BARREL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251127B">G02B7/02</main-classification>
        <further-classification edition="200601120251127B">G02B1/12</further-classification>
        <further-classification edition="202101120251127B">G03B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今弘國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN HONG INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖名揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MING YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡筒，包括一鏡筒本體、多層干涉薄膜及一防污抗刮保護層。多層干涉薄膜配置於鏡筒本體的外表面上，其中多層干涉薄膜包括交替堆疊的高折射率膜與低折射率膜。防污抗刮保護層配置於多層干涉薄膜上，其中多層干涉薄膜配置於鏡筒本體與防污抗刮保護層之間。防污抗刮保護層與多層干涉薄膜的折射率與厚度的搭配所形成的鏡筒的外表面的反射率小於或等於0.2%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens barrel including a lens barrel body, a multilayer interference film, and an anti-fouling and scratch-resistant protective layer is provided. The multilayer interference film is disposed on an outer surface of the lens barrel body. The multilayer interference film includes high refractive index films and low refractive index films which are alternately stacked. The anti-fouling and scratch-resistant protective layer is disposed on the multilayer interference film. The multilayer interference film is disposed between the lens barrel body and the anti-fouling and scratch-resistant protective layer. The reflectivity of an outer surface of the lens barrel formed by the combination of refractive indexes and thicknesses of the anti-fouling and scratch-resistant protective layer and the multilayer interference film is less than or equal to 0.2%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡筒</p>
        <p type="p">102、112:外表面</p>
        <p type="p">110:鏡筒本體</p>
        <p type="p">120:多層干涉薄膜</p>
        <p type="p">122:高折射率膜</p>
        <p type="p">124:低折射率膜</p>
        <p type="p">130:防污抗刮保護層</p>
        <p type="p">T1、T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="605" publication-number="202632487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生測試案例之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD, ELECTRONIC APPARATUS AND RECORDING MEDIUM FOR GENERATING TEST CASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250901B">G06F3/048</main-classification>
        <further-classification edition="202501120250901B">G06F11/36</further-classification>
        <further-classification edition="200601120250901B">G06F11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑩瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YINGYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄔耀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, QUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李科慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KEQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置產生測試案例之方法包括如下步驟：向用戶之終端提供UI設計；自用戶之終端獲得用以測試UI設計之至少一個操作及UI設計上待實行至少一個操作之至少一個節點的資訊；及基於至少一個操作及至少一個節點，產生與UI設計相關聯之測試案例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="606" publication-number="202632584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供物品資訊之方法、裝置及儲存有用以實行方法之電腦程式之非暫時性電腦可讀記錄媒體</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING INFORMATION ON ITEM, AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM STORING COMPUTER PROGRAM FOR PERFORMING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250801B">G06Q30/0251</further-classification>
        <further-classification edition="202301120250801B">G06Q30/01</further-classification>
        <further-classification edition="201901120250801B">G06F16/903</further-classification>
        <further-classification edition="201901120250801B">G06F16/9035</further-classification>
        <further-classification edition="201901120250801B">G06F16/9038</further-classification>
        <further-classification edition="201901120250801B">G06F16/904</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙承妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金素珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置提供物品資訊之方法可包括如下步驟：將包括第1物品清單之第1頁面提供至用戶之終端，該第1物品清單係與關鍵字之檢索結果對應者；自用戶之終端獲得與第1頁面中之第1物件對應的用戶之輸入；及響應於用戶之輸入，將包括第2物品清單之第2頁面提供至用戶之終端，該第2物品清單包括由用戶查詢之一個以上之物品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:順序圖</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="607" publication-number="202633340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110239</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧型倉儲系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260203B">H10P72/30</main-classification>
        <further-classification edition="200601120260203B">B65G1/137</further-classification>
        <further-classification edition="200601120260203B">B65G1/04</further-classification>
        <further-classification edition="200601120260203B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟賦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIFF TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王元論</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUAN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鶴憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王懋竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧型倉儲系統，適用於多個物品，並包含至少一適用於儲存所述物品垂直式倉儲設備，及一運輸設備。該運輸設備包括一取放裝置，及一訊號連接於該取放裝置的運輸控制模組。該取放裝置適用於被控制時啟動，而將所述物品置入或搬離該至少一垂直式倉儲設備，該運輸控制模組用於控制該取放裝置啟動。利用該至少一垂直式倉儲設備與所述運輸設備的設計，可自動搬運物品，進而有效節省人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:垂直式倉儲設備</p>
        <p type="p">200:運輸設備</p>
        <p type="p">300:置料架</p>
        <p type="p">8:運送裝置</p>
        <p type="p">81:第一輸送單元</p>
        <p type="p">811:第一限位軌道</p>
        <p type="p">812:第一安裝座</p>
        <p type="p">82:第二輸送單元</p>
        <p type="p">821:第二限位軌道</p>
        <p type="p">823:第二傳動組</p>
        <p type="p">90:物品</p>
        <p type="p">9:取放裝置</p>
        <p type="p">97:置料空間</p>
        <p type="p">X1:第一方向</p>
        <p type="p">X2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="608" publication-number="202632473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體裝置及其形成方法</chinese-title>
        <english-title>INTEGRATED DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G06F3/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林璟暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例涉及一種積體裝置，包括：第一彈性隔室所包含的低可壓縮性流體的第一儲存槽；第二彈性隔室所包圍的低可壓縮性流體的第二儲存槽；第一微泵結構，包括：第一空腔；襯在所述第一空腔的第一側的第一壓電泵；將所述第一儲存槽耦合至所述第一空腔的第一靜電閥；以及將所述第二儲存槽耦合至所述第一空腔的第二靜電閥；以及耦合至所述第一壓電泵、所述第一靜電閥和所述第二靜電閥的高電壓電源；以及耦合至所述高電壓電源的控制電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments relate to an integrated device, including: a first reservoir of low compressibility fluid contained by a first elastic compartment; a second reservoir of low compressibility fluid surrounded by a second elastic compartment; a first micropump structure including: a first cavity; a first piezoelectric pump lining a first side of the first cavity; a first electrostatic valve coupling the first reservoir to the first cavity; and a second electrostatic valve coupling the second reservoir to the first cavity; and a high voltage power source coupled to the first piezoelectric pump, the first electrostatic valve, and the second electrostatic valve; and control circuitry coupled to the high voltage power source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:斜視圖</p>
        <p type="p">101:觸覺回饋裝置</p>
        <p type="p">102:裝置陣列固定裝置</p>
        <p type="p">104:微泵結構</p>
        <p type="p">106:第一彈性隔室</p>
        <p type="p">108:第二彈性隔室</p>
        <p type="p">110:高電壓電源</p>
        <p type="p">112:導電線</p>
        <p type="p">114:控制電路</p>
        <p type="p">116:帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="609" publication-number="202633071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202301120260302B">H10B53/20</further-classification>
        <further-classification edition="202301120260302B">H10B61/00</further-classification>
        <further-classification edition="202301120260302B">H10B63/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣國璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳介方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEH-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜慧如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KATHERINE H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體陣列的記憶胞結構使用與已在半導體裝置上形成的互補式金屬氧化物半導體（CMOS）積體電路相容的材料和製程形成。特別是，記憶胞結構的電晶體結構形成為包括氧化物半導體通道層而非半導體通道層。氧化物半導體通道層可通過相對於半導體通道層（例如，磊晶生長）較低溫度製程（例如，化學氣相沉積（CVD））形成。因此，氧化物半導體通道層的形成較不可能劣化和/或損壞半導體裝置的CMOS積體電路的層和/或結構。以此方式，半導體裝置可以單片地形成，意味著記憶體陣列可形成在已形成CMOS積體電路的半導體裝置的裝置層之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Memory cell structures of a memory array are formed using materials and processes that are compatible with complementary metal-oxide-semiconductor (CMOS) integrated circuits that have been formed on a semiconductor device. In particular, the transistor structures of the memory cell structures are formed to include oxide-semiconductor channel layers as opposed to semiconductor channel layers. The oxide-semiconductor channel layers may be formed by lower-temperature processes (e.g., chemical vapor deposition (CVD)) relative to semiconductor channel layers (e.g., epitaxial growth). Thus, the formation of the oxide-semiconductor channel layers is less likely to degrade and/or damage the layers and/or structures of the CMOS integrated circuits of the semiconductor device. In this way, the semiconductor device may be formed monolithically, meaning the memory array may be formed above the device layer of the semiconductor device in which the CMOS integrated circuits were formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:裝置層</p>
        <p type="p">104:互連層</p>
        <p type="p">106:基底</p>
        <p type="p">108:積體電路裝置</p>
        <p type="p">110:介電層</p>
        <p type="p">112:接觸件</p>
        <p type="p">114:層間介電層</p>
        <p type="p">116:蝕刻停止層</p>
        <p type="p">118:金屬內連線結構</p>
        <p type="p">120:互連結構</p>
        <p type="p">122:記憶體陣列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="610" publication-number="202632598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貨物衝擊防止裝置、該裝置之動作方法、及記錄有用以於電腦中執行其動作方法之程式之非暫時性電腦可讀記錄媒體</chinese-title>
        <english-title>CARGO IMPACT PREVENTION APPARATUS, OPERATION METHOD THEREOF, AND NON-TRANSITORY COMPUTER READABLE RECORDING MEDIUM IN WHICH A COMPUTER PROGRAM FOR PERFORMING THE METHOD IS RECORDED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251231B">G06Q50/40</main-classification>
        <further-classification edition="202301120251231B">G06Q10/06</further-classification>
        <further-classification edition="202401120251231B">G06Q10/08</further-classification>
        <further-classification edition="202301120251231B">G06Q30/06</further-classification>
        <further-classification edition="200601120251231B">B65G69/16</further-classification>
        <further-classification edition="200601120251231B">B65G69/00</further-classification>
        <further-classification edition="200601120251231B">B65G53/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基肖爾　阿布舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHORE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦什尼　拉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARSHNEY, RAJAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本文所揭示之實施例，貨物衝擊防止裝置可包括：衝擊防止本體，其配置於自移動貨物之運送機中分支之滑槽之兩側面中之至少一側面，且於內部包括氣體收容空間；吸入部，其形成於上述衝擊防止本體之第1表面上，且以將氣體供給至上述氣體收容空間之方式構成；排出部，其包括於上述衝擊防止本體之至少一面上形成之至少一個排出口，且以排出上述氣體收容空間內部之氣體之方式構成；及控制部，其控制上述吸入部以便調節向上述氣體收容空間之氣體供給程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:運送機</p>
        <p type="p">20:滑槽</p>
        <p type="p">30:壓電感測器</p>
        <p type="p">40:引導結構</p>
        <p type="p">100:貨物衝擊防止裝置</p>
        <p type="p">B1:貨物</p>
        <p type="p">B2:貨物</p>
        <p type="p">L1:側面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="611" publication-number="202631291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置、遮罩管理裝置以及遮罩管理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250728B">B23K26/066</main-classification>
        <further-classification edition="200601120250728B">B23K26/073</further-classification>
        <further-classification edition="201401120250728B">B23K26/351</further-classification>
        <further-classification edition="200601120250728B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山部耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林弘武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIROMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 在雷射加工裝置中，在適當管理遮罩的同時進行雷射加工。  &lt;br/&gt;[解決手段] 雷射加工裝置100包括資訊管理裝置200，遮罩管理部220管理收納在遮罩收納部70的各遮罩的使用狀況等。在進行雷射加工時，所選擇的遮罩被虛擬地網格分割，並且基於掃描範圍決定與照射到各網格的線狀雷射束LB的照射能量等效的雷射束的脈衝數。然後，將決定的脈衝數加到至此為止的總脈衝數，並且記錄累積的脈衝數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光源</p>
        <p type="p">15:裝置主體</p>
        <p type="p">20:照明光學單元</p>
        <p type="p">30:投影光學系統</p>
        <p type="p">40:遮罩台</p>
        <p type="p">50:加工台</p>
        <p type="p">60:掃描機構</p>
        <p type="p">70:遮罩收納部</p>
        <p type="p">80:控制器</p>
        <p type="p">100:雷射加工裝置</p>
        <p type="p">200:資訊管理裝置</p>
        <p type="p">210:配方管理部</p>
        <p type="p">220:遮罩管理部</p>
        <p type="p">300:顯示部</p>
        <p type="p">M:遮罩</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="612" publication-number="202631313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體工具以及研磨半導體晶圓的方法</chinese-title>
        <english-title>SEMICONDUCTOR TOOL AND METHOD OF GRINDING SEMICONDUCTOR WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251001B">B24B37/27</main-classification>
        <further-classification edition="201201120251001B">B24B37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉郁欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何治圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳胤全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭佩菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, PEI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體工具包括配置為圍繞第一軸旋轉的研磨輪、配置為圍繞與第一軸偏移的第二軸旋轉的卡盤台、以及配置在卡盤台周邊部分的多個調整軸。卡盤台包括研磨輪邊緣投影到卡盤台上的邊緣輪廓，以及研磨輪中心投影到卡盤台上的輪中心。多個調整軸配置為調整卡盤台的傾斜度，其中多個調整軸中的每個都配置在從輪中心延伸到邊緣輪廓上點的延伸線上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor tool includes a grinding wheel configured to rotate around a first axis, a chuck table configured to rotate around a second axis offset from the first axis, and a plurality of adjustment shafts disposed at a peripheral portion of the chuck table. The chuck table includes an edge contour where an edge of the grinding wheel is projected onto the chuck table, and a wheel center where a center of the grinding wheel is projected onto the chuck table. The plurality of adjustment shafts are configured to adjust an inclination of the chuck table, wherein each of the plurality of adjustment shafts are disposed on an extending line extending from the wheel center toward a point on the edge contour.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體工具</p>
        <p type="p">100:研磨輪</p>
        <p type="p">112:基盤</p>
        <p type="p">114:研磨齒</p>
        <p type="p">200:卡盤台</p>
        <p type="p">FS:前表面</p>
        <p type="p">210:卡盤</p>
        <p type="p">212:多孔層</p>
        <p type="p">220:基座</p>
        <p type="p">230,232,234,236:調整軸</p>
        <p type="p">232:第一調整軸</p>
        <p type="p">234:第二調整軸</p>
        <p type="p">236:第三調整軸</p>
        <p type="p">240:旋轉軸</p>
        <p type="p">300:晶圓</p>
        <p type="p">301:保護膜</p>
        <p type="p">400:控制器</p>
        <p type="p">A1,A2:軸</p>
        <p type="p">BS:背面</p>
        <p type="p">O1,O2:中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="613" publication-number="202633097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成包括四方晶系鉿鋯氧化物節點介電層的電容結構的方法</chinese-title>
        <english-title>METHODS OF FORMING CAPACITOR INCLUDING A TETRAGONAL HAFNIUM ZIRCONIUM OXIDE NODE DIELECTRIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250506B">H10D1/68</main-classification>
        <further-classification edition="202301120250506B">H10B53/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡敏瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李杰容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIEH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">裝置結構可以透過以下方式形成：在基板之上沉積第一金屬電極層；在第一金屬電極層之上沉積包含非晶鉿鋯氧化物層的節點介電層，非晶鉿鋯氧化物層具有Hf        &lt;sub&gt;(1-a)&lt;/sub&gt;Zr        &lt;sub&gt;a&lt;/sub&gt;O        &lt;sub&gt;2&lt;/sub&gt;的材料成分，其中a值在0.50到0.90的範圍內；在節點介電層之上沉積第二金屬電極層；以及將非晶鉿鋯氧化物層退火成晶態鉿鋯氧化物層。晶態鉿鋯氧化物層中四方晶系鉿鋯氧化物的分數和正交晶系鉿鋯氧化物的分數之總和可能大於0.40。第一金屬電極層、節點介電層和第二金屬電極層的組合包括電容結構，其可提供高電容和增強的可靠性。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be formed by depositing a first metallic electrode layer over a substrate; depositing a node dielectric layer comprising an amorphous hafnium zirconium oxide layer having a material composition of Hf        &lt;sub&gt;(1-a)&lt;/sub&gt;Zr        &lt;sub&gt;a&lt;/sub&gt;O        &lt;sub&gt;2&lt;/sub&gt;over the first metallic electrode layer, wherein a value of a is in a range from 0.50 to 0.90; depositing a second metallic electrode layer over the node dielectric layer; and annealing the amorphous hafnium zirconium oxide layer into a crystalline hafnium zirconium oxide layer. A sum of a fraction of hafnium zirconium oxide in a tetragonal phase and a fraction of hafnium zirconium oxide in an orthorhombic phase for the crystalline hafnium zirconium oxide layer may be greater than 0.40. A combination of the first metallic electrode layer, the node dielectric layer, and the second metallic electrode layer comprises a capacitor structure, which may provide high capacitance and enhanced reliability.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一金屬電極層</p>
        <p type="p">15:節點介電層</p>
        <p type="p">20:第二金屬電極層</p>
        <p type="p">151:鉿鋯氧化物層</p>
        <p type="p">155:高能隙介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="614" publication-number="202633261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器裝置及藉由直接原子層處理製造感測器裝置之方法</chinese-title>
        <english-title>SENSOR DEVICE AND METHOD OF PRODUCING A SENSOR DEVICE BY DIRECT ATOMIC LAYER PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/24</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="201701120260302B">B29C64/209</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商亞特蘭特3Ｄ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATLANT 3D</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博里　班傑明　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORIE, BENJAMIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆德拉塔　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNDRATA, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑圖奇　西蒙尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTUCCI, SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種感測器裝置及用於製造一感測器裝置之方法，該感測器裝置包含一基體及用於與一環境相互作用之感測元件之一陣列，其中各感測元件包括該基體上之一材料薄膜沉積物，以便提供具有相互不同的敏感度性質的該等感測元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a sensor device and method for producing a sensor device, comprising a substrate and an array of sensing elements for interacting with an environment, wherein each sensing element includes a thin-film deposit of material on the substrate so as to provide the sensing elements with mutually different sensitivity properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基體</p>
        <p type="p">2a,2b,2c,2d,2e,2f,2g,2h,2i,2j,2k,2l,2m,2n,2o:感測元件</p>
        <p type="p">10:感測器裝置，氣體感測器裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="615" publication-number="202633496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造縱橫式裝置及/或多板裝置之系統及方法</chinese-title>
        <english-title>A SYSTEM AND METHOD FOR MANUFACTURING A CROSS BAR DEVICE AND/OR A MULTI SLAB DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">G02B6/132</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商亞特蘭特3Ｄ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATLANT 3D</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博里　班傑明　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORIE, BENJAMIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉凱特　米拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARAKET, MIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉霍特努克　馬克西姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAKHOTNYUK, MAKSYM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆德拉塔　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNDRATA, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種縱橫式陣列裝置及一種用於製造一縱橫式陣列裝置之方法。該方法包含提供第一桿之一第一陣列。該方法包含提供第二桿之一第二陣列，該第二陣列與第一桿之該第一陣列交叉且接觸。該第一陣列係藉由原子層沉積提供，使得該等第一桿中之一或多者在至少一個性質上不同於該等第一桿中之一或多個其他者，及/或使得該等第一桿中之一或多者的至少一個性質沿著該(等)各別桿之一縱向方向變化；及/或該第二陣列係藉由原子層沉積提供，使得該等第二桿中之一或多者在至少一個性質上不同於該等第二桿中之一或多個其他者，及/或使得該等第二桿中之一或多者的至少一個性質沿著該(等)各別桿之一縱向方向變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A crossbar array device and a method for manufacturing a crossbar array device. The method comprises providing a first array of first bars. The method comprises providing a second array of second bars crossing and in contact with the first array of first bars. The first array is provided by atomic layer deposition, such that one or more of the first bars differs in at least one property from one or more other of the first bars and/or such that of one or more of the first bars at least one property varies along a longitudinal direction of the respective bar(s); and/or the second array is provided by atomic layer deposition, such that one or more of the second bars differs in at least one property from one or more other of the second bars and/or such that of one or more of the second bars at least one property varies along a longitudinal direction of the respective bar(s).</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:縱橫式陣列裝置</p>
        <p type="p">22:第一桿，導電第一桿</p>
        <p type="p">22A,22B,22C:第一桿</p>
        <p type="p">24:第二桿，導電第二桿</p>
        <p type="p">24A,24B,24C:第二桿</p>
        <p type="p">25:交叉點</p>
        <p type="p">26:第一陣列</p>
        <p type="p">28:第二陣列</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="616" publication-number="202631471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於履行中心中搬運物品容器之電子搬運裝置及利用電子搬運裝置搬運物品容器之方法</chinese-title>
        <english-title>ELECTRONIC TRANSPORT DEVICE FOR CARRYING ITEM CONTAINER IN FULFILLMENT CENTER AND METHOD FOR TRANSPORTING ITEM CONTAINER USING ELECTRONIC TRANSPORT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">B65G1/137</main-classification>
        <further-classification edition="200601120250910B">B66C1/04</further-classification>
        <further-classification edition="200601120250910B">B65D90/18</further-classification>
        <further-classification edition="200601120250910B">G06K7/10</further-classification>
        <further-classification edition="202401120250910B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全正宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基肖爾　阿布舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHORE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦什尼　拉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARSHNEY, RAJAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，可提供一種電子搬運裝置，其係於履行中心中搬運物品容器者，其包括：驅動部；電源供應模組；至少一個電磁鐵，其配置於電子搬運裝置之上部面並附接至物品容器；收發器；複數個掃描器，其以掃描代碼符號(code symbology)之方式構成；及處理器；且處理器控制驅動部、電源供應模組、至少一個電磁鐵、收發器及複數個掃描器，使得電子搬運裝置如下：若藉由收發器而自伺服器接收到電子搬運裝置之搬運請求信號，則移動至與搬運請求信號中包括之第1位置資訊對應之第1位置；利用至少一個電磁鐵，結合至位於第1位置之物品容器之下部面；移動至上述物品容器需搬運到之第2位置。根據又一實施例，亦可提供一種電子搬運裝置於履行中心中搬運物品容器之方法。根據再一實施例，亦可提供一種藉由電子搬運裝置而搬運之物品容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子搬運裝置</p>
        <p type="p">110:驅動部</p>
        <p type="p">120:電源供應模組</p>
        <p type="p">130:至少一個電磁鐵</p>
        <p type="p">140:收發器</p>
        <p type="p">150:複數個掃描器</p>
        <p type="p">160:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="617" publication-number="202632445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對準裝置、圖案形成裝置以及對準方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G03F9/00</main-classification>
        <further-classification edition="200601120260424B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正田雄樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASADA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中本裕見</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMOTO, YUKEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是在曝光裝置等圖案形成裝置中執行的對準中，有效地檢測對準標記。其解決手段為曝光裝置10，包括載置有矽晶圓即基板W的工作台45、以及對準量測裝置60，對於工作台45的基板載置面45S設置有複數個開口部AT。開口部AT具有開口尺寸，容納在基板W上排列成網格狀的圖案區域（晶粒）PT以及對準標記AR。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">45:工作台</p>
        <p type="p">45S:基板載置面</p>
        <p type="p">AR:對準標記</p>
        <p type="p">AT:開口部</p>
        <p type="p">PT:晶粒(圖案區域)</p>
        <p type="p">SB:劃線線段</p>
        <p type="p">W:基板</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">W3:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="618" publication-number="202632477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑鼠</chinese-title>
        <english-title>MOUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250604B">G06F3/0346</main-classification>
        <further-classification edition="201301120250604B">G06F3/0354</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXIN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧賀隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HO-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡東吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉奕辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種滑鼠，其包含殼體、兩個開關模組及底座。殼體的一側具有多個固定結構。各個開關模組包含底板、微動開關、螺絲及彈性緩衝調整件。各個底板通過螺絲固定於殼體的內側。各個微動開關面對設置於殼體的活動鍵設置。彈性緩衝調整件設置於底板與殼體之間。組裝人員能通過調整其中一個螺絲，以改變微動開關及與其相鄰的按壓結構的之間的間距。在組裝人員通過調整螺絲，以改變間距的過程中，彈性緩衝調整件將受壓而彈性變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a mouse comprising a housing, two switch modules, and a base. One side of the housing is provided with multiple fixing structures. Each switch module comprises a base plate, a micro switch, screws, and an elastic buffer adjustment member. Each base plate is secured to the inner side of the housing via screws. Each micro switch is disposed facing a movable key arranged on the housing. The elastic buffer adjustment member is positioned between the base plate and the housing. An assembler can adjust one of the screws to change the distance between the micro switch and an adjacent pressing structure. During the adjustment process, as the assembler modifies the distance by adjusting the screw, the elastic buffer adjustment member is compressed and elastically deformed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:滾輪</p>
        <p type="p">100:殼體</p>
        <p type="p">11211:鎖孔</p>
        <p type="p">12:活動鍵</p>
        <p type="p">121:按壓結構</p>
        <p type="p">200:開關模組</p>
        <p type="p">20:底板</p>
        <p type="p">201A:調整孔</p>
        <p type="p">201B:固定孔</p>
        <p type="p">21:微動開關</p>
        <p type="p">211:開關件</p>
        <p type="p">22:螺絲</p>
        <p type="p">23:彈性緩衝調整件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="619" publication-number="202633135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D64/01</main-classification>
        <further-classification edition="202501120251103B">H10D30/01</further-classification>
        <further-classification edition="202501120251103B">H10D64/68</further-classification>
        <further-classification edition="202501120251103B">H10D64/27</further-classification>
        <further-classification edition="202501120251103B">H10D62/17</further-classification>
        <further-classification edition="202501120251103B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林忠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張長昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成積體電路的方法，包括形成電晶體的複數堆疊通道以及形成各自與通道之一者接觸的複數界面介電結構。方法包括形成與通道交錯的複數內部間隔物。方法包括形成圍繞通道的閘極金屬。在形成閘極金屬之後，每一個內部間隔物與位在內部間隔物和通道中的相鄰通道之間的相應界面介電結構接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming an integrated circuit includes forming a plurality of stacked channels of a transistor and forming a plurality of interfacial dielectric structures each in contact with one of the channels. The method includes forming a plurality of inner spacers interleaved with the channels. The method includes forming a gate metal wrapped around the channels. After forming the gate metal, each inner spacer is in contact with a respective interfacial dielectric structure positioned between the inner spacer and an adjacent channel of the plurality of channels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">102:基板</p>
        <p type="p">105:通道</p>
        <p type="p">118:介電層、閘極間隔物層</p>
        <p type="p">120:介電層、閘極間隔物層</p>
        <p type="p">136:內部間隔物</p>
        <p type="p">138:底部半導體層</p>
        <p type="p">139:底部介電結構</p>
        <p type="p">140:界面介電結構</p>
        <p type="p">146:源極/汲極區</p>
        <p type="p">147:半導體層</p>
        <p type="p">148:第二半導體層</p>
        <p type="p">149:矽化物</p>
        <p type="p">101:電晶體</p>
        <p type="p">150:界面閘極介電層、閘極介電層</p>
        <p type="p">152:高K閘極介電層、閘極介電層</p>
        <p type="p">155:閘極電極</p>
        <p type="p">156:閘極金屬</p>
        <p type="p">158:閘極金屬</p>
        <p type="p">160:閘極金屬</p>
        <p type="p">162:閘極金屬</p>
        <p type="p">172:源極/汲極接點</p>
        <p type="p">176:介電層</p>
        <p type="p">178:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="620" publication-number="202631292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250826B">B23K26/073</main-classification>
        <further-classification edition="201401120250826B">B23K26/351</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山部耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅倉潤也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKURA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林弘武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIROMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是提供雷射加工方法，可在雷射加工裝置中自由地形成加工圖案。雷射加工裝置100包括：照明光學單元20、遮罩平台40、加工平台50。在照明光學單元20的角度切換鏡之切換和藉由遮光單元25遮蔽的同時，驅動控制掃描機構60、加工平台50兩者或一者，執行各個遮罩圖案的掃描開始位置和依據製程參數而定的基板W之加工形成分區的加工開始位置之位置調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">M:遮罩</p>
        <p type="p">MP1,MP2,MP3:遮罩圖案</p>
        <p type="p">P1:位置</p>
        <p type="p">P2:位置</p>
        <p type="p">P3:位置</p>
        <p type="p">S1:掃描開始位置</p>
        <p type="p">S2:掃描結束位置</p>
        <p type="p">W:工件(基板)</p>
        <p type="p">WP:加工圖案</p>
        <p type="p">WP1,WP2,WP3,WP4,WP5:加工圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="621" publication-number="202632665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重讀操作處理方法、裝置及電腦可讀取儲存媒體</chinese-title>
        <english-title>RETRY READ OPERATION PROCESSING METHOD, DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G11C16/26</main-classification>
        <further-classification edition="200601120250502B">G11C16/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李法豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種重讀操作處理方法，包括下列步驟：利用多個電壓組，通過多個解碼單元對記憶體的資料區段中的多個大塊進行多個輪次的解碼操作；根據每輪次解碼操作的結果，記錄該輪次的操作訊息以及所有成功解碼的累計次數；基於操作訊息，計算關於曾經成功解碼的權重值；以及根據計算的權重值及記錄的操作訊息生成動態電壓組。其中生成動態電壓組的參數關聯於成功解碼的解碼單元數量、成功解碼的解碼單元中的最大錯誤位元數、曾經成功解碼的次數、權重值以及電壓組。並且本發明還公開一種重讀操作處理裝置以及一種電腦可讀取儲存媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A retry read operation processing method, comprising the following steps: performing a plurality of rounds of decoding operations on a plurality of chunks in data segment of a memory through a plurality of decoding units using a plurality of voltage sets; recording operation information of each round of decoding operation and the accumulated number of all successful decodings based on a result of each round of decoding operation; calculating a plurality of weight values related to previously successful decodings based on the operation information; and generating a dynamic voltage set according to the calculated weight values and the recorded operation information. Wherein the parameters for generating the dynamic voltage set are related to a number of decoding units that successfully decoded, a maximum number of error bits in the decoding units that successfully decoded, a number of previously successful decodings, the weight values, and the voltage sets. Furthermore, the present invention also discloses a retry read operation processing device and a computer-readable storage medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="622" publication-number="202632544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧問答方法、電子設備及儲存介質</chinese-title>
        <english-title>INTELLIGENT QUESTION-ANSWERING METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06N5/02</main-classification>
        <further-classification edition="202301120250701B">G06N5/04</further-classification>
        <further-classification edition="202001120250701B">G06F40/30</further-classification>
        <further-classification edition="201901120250701B">G06F16/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黨芳娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANG, FANG-E</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, REN-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉栩江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XU-JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種智慧問答方法、電子設備及儲存介質。所述方法包括：獲取用戶輸入的問題文本；基於所述問題文本，從預設的問題庫中確定匹配的目標問題；依據所述目標問題的類別，在預設的工業知識庫中檢索與所述問題文本匹配的工業知識；依據所述工業知識及所述問題文本，生成提示上下文；利用工業大語言模型對所述提示上下文進行推理，生成所述問題文本對應的答案文本。利用上述方法，本申請能夠顯著提升問答效率，降低人力成本，以及增強答案的準確性與實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides an intelligent question-answering method, an electronic device, and a storage medium. The method includes: obtaining a question text input by a user, determining a matched target question from a predefined question database based on the question text, retrieving industrial knowledge matching the question text from a predefined industrial knowledge base according to a category of the target question, generating a prompt context based on the industrial knowledge and the question text, generating an answer text corresponding to the question text through an inference of the prompt context by an industrial large language model. By utilizing the present application, the present application can significantly improve question-answering efficiency, reduce labor costs, and enhance the accuracy and practicality of answers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="623" publication-number="202632365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像頭模組和電子設備</chinese-title>
        <english-title>CAMERA MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250606B">G02B7/09</main-classification>
        <further-classification edition="202101120250606B">G03B13/36</further-classification>
        <further-classification edition="202101120250606B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁盛傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, SHENG-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓竹成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, ZHU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳滿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝像頭模組和電子設備。攝像頭模組包括圖像感測組件、鏡頭組件、對焦組件以及切換組件。圖像感測組件包括圖像感測器；鏡頭組件包括多個鏡頭；對焦組件包括第一驅動件，第一驅動件用於沿第一方向驅動鏡頭組件，以實現每一鏡頭對焦於圖像感測器。切換組件包括第二驅動件，第二驅動件用於沿第二方向驅動鏡頭組件，以實現不同的鏡頭成像於圖像感測器，第一方向不同於第二方向。本申請提供的攝像頭模組具有減低成本的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module and an electronic device. The camera module includes an image sensing assembly, a lens assembly, a focusing assembly, and a switching assembly. The image sensing assembly comprises an image sensor; the lens assembly includes multiple lenses; the focusing assembly includes a first driving member configured to drive the lens assembly along a first direction to focus each lens onto the image sensor. The switching assembly includes a second driving member configured to drive the lens assembly along a second direction to enable different lenses to image onto the image sensor, where the first direction differs from the second direction. The camera module provided in this application offers the advantage of reduced cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:攝像頭模組</p>
        <p type="p">10:鏡頭組件</p>
        <p type="p">11:主攝像頭</p>
        <p type="p">12:長焦鏡頭</p>
        <p type="p">13:廣角鏡頭</p>
        <p type="p">20:圖像感測組件</p>
        <p type="p">50:基座</p>
        <p type="p">80:蓋體</p>
        <p type="p">A:第一方向</p>
        <p type="p">B:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="624" publication-number="202632499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態調整重讀流程的重讀操作處理方法、裝置及電腦可讀取儲存媒體</chinese-title>
        <english-title>RETRY READ OPERATION PROCESSING METHOD, DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM FOR DYNAMICALLY ADJUSTING RETRY READ PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F11/07</main-classification>
        <further-classification edition="202601120260302B">G06F11/14</further-classification>
        <further-classification edition="200601120260302B">G11C29/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李法豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種動態調整重讀流程的重讀操作處理方法，用於對記憶體中的資料區段進行解碼操作。該方法包括以下步驟：首先，監控重讀流程中的多個解碼環節，記錄每個環節的成功和失敗次數，並計算其成功率。當某個環節的成功率低於預設的重排序閾值時，根據成功率的高低重新排序各環節的次序。然後，將排序後的環節次序轉換爲數值，並根據資料區段的內容更新重讀次序對照表。此外，本發明還公開了一種相應的重讀操作處理裝置及電腦可讀取儲存媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a retry read operation processing method for dynamically adjusting a retry read process, used for decoding a data segment in a memory. The method includes the following steps: First, monitoring multiple decoding stages in the retry read process, recording the number of successes and failures of each stage, and calculating their success rates. When the success rate of a certain stage is lower than a preset reordering threshold, the order of each stage is reordered according to the success rates. Then, the reordered stage sequence is converted into numerical values, and the retry order lookup table is updated according to the content of the data segment. Furthermore, the present invention also discloses a corresponding retry read operation processing device and a computer-readable storage medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S7:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="625" publication-number="202633189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護裝置</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250501B">H10D89/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶焱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳子平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃歆蘋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SIN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電放電保護裝置，其包含觸發式雙極性接面電晶體與矽控整流器，其耦接於第一導電接墊與第二導電接墊之間。觸發式雙極性接面電晶體具有第一寄生基射電阻。矽控整流器包含第一寄生雙極性接面電晶體與第二寄生雙極性接面電晶體。第二寄生雙極性接面電晶體之射極與基極分別耦接觸發式雙極性接面電晶體之射極與基極。第二寄生雙極性接面電晶體具有小於第一寄生基射電阻之第二寄生基射電阻。觸發式雙極性接面電晶體之集極以第一重摻雜區實現，第一寄生雙極性接面電晶體之基極以第一摻雜區域實現，第一摻雜區域與第一重摻雜區分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge protection device includes a triggering bipolar junction transistor and a silicon-controlled rectifier coupled between a first conduction pad and a second conduction pad. The triggering bipolar junction transistor has a first parasitic base-emitter resistance. The silicon-controlled rectifier includes a first parasitic bipolar junction transistor and a second parasitic bipolar junction transistor. The emitter and the base of the second parasitic bipolar junction transistor are respectively coupled to the emitter and the base of the triggering bipolar junction transistor. The second parasitic bipolar junction transistor has a second parasitic base-emitter resistance less than the first parasitic base-emitter resistance. The collector of the triggering bipolar junction transistor is implemented with a first heavily doped area. The base of the first parasitic bipolar junction transistor is implemented with a first doped region that separates from the first heavily doped area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:靜電放電保護裝置</p>
        <p type="p">20:觸發式雙極性接面電晶體</p>
        <p type="p">200:第一寄生基射電阻</p>
        <p type="p">21:矽控整流器</p>
        <p type="p">210:第一寄生雙極性接面電晶體</p>
        <p type="p">211:第二寄生雙極性接面電晶體</p>
        <p type="p">2110:第二寄生基射電阻</p>
        <p type="p">22:第一導電接墊</p>
        <p type="p">23:第二導電接墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="626" publication-number="202633284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、基板處理方法及電腦記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P50/20</main-classification>
        <further-classification edition="200601120260420B">B23K26/03</further-classification>
        <further-classification edition="201401120260420B">B23K26/36</further-classification>
        <further-classification edition="201401120260420B">B23K26/53</further-classification>
        <further-classification edition="202601120260420B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栄紘太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAE, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔光恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, KWANGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸田嵩裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHDA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於基板處理系統、基板處理方法及電腦記錄媒體，適當地施行對基板之雷射處理。本發明的處理基板之基板處理系統，具備：雷射照射部，從該基板之上方將雷射光照射至該基板；影像取得部，從該基板之側方取得該基板的投影影像；以及控制部；該控制部實行如下控制：在以該雷射照射部將該雷射光照射至該基板前，以該影像取得部取得該投影影像；以及依據照射該雷射光前的該投影影像，決定該基板中之該雷射光的照射位置或該雷射光的輸出之至少任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="627" publication-number="202631407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輪胎檢測裝置、系統、方法、車輛及電腦可讀存儲介質</chinese-title>
        <english-title>TIRE DETECTION DEVICE, SYSTEM, METHOD, VEHICLE AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251118B">B60C23/06</main-classification>
        <further-classification edition="202301120251118B">G06F18/21</further-classification>
        <further-classification edition="200601120251118B">G01M17/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林廷蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例涉及車輛檢測技術領域，並提供一種輪胎檢測裝置、系統、方法、車輛及電腦可讀存儲介質。其中，該輪胎檢測裝置包括成像單元、處理單元以及通信單元。所述成像單元用於以面向車輛的輪胎的方式安裝於車輛的車體上，並被配置為拍攝所述輪胎的三維圖像。處理單元與所述成像單元連接，所述處理單元被配置為根據所述輪胎的三維圖像，確定所述輪胎的檢測結果。通信單元被配置為使所述處理單元與伺服器通信，以實現所述處理單元向所述伺服器發送所述輪胎的三維圖像及所述輪胎的檢測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to the field of vehicle detection technology and provide a tire detection device, a system, a method, a vehicle, and a computer-readable storage medium. The tire detection device includes an imaging unit, a processing unit, and a communication unit. The imaging unit is installed on a vehicle body of a vehicle in a manner facing the vehicle's tires and is configured to capture three-dimensional images of the tires. The processing unit is connected to the imaging unit and configured to determine detection results of the tires based on the three-dimensional images of the tires. The communication unit is configured to enable the processing unit to communicate with a server, so as to enable the processing unit to send the three-dimensional images of the tires and the detection results of the tires to the server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:輪胎檢測系統</p>
        <p type="p">210:輪胎檢測裝置</p>
        <p type="p">211:成像單元</p>
        <p type="p">212:控制單元</p>
        <p type="p">212a:存儲單元</p>
        <p type="p">212b:處理單元</p>
        <p type="p">212c:通信單元</p>
        <p type="p">213:殼體</p>
        <p type="p">214:驅動機構</p>
        <p type="p">215:用戶介面</p>
        <p type="p">220:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="628" publication-number="202633012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車間照明系統之控制方法及車間照明系統</chinese-title>
        <english-title>METHOD OF CONTROLLING WORKSHOP LIGHTING SYSTEM AND WORKSHOP LIGHTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250619B">H05B47/155</main-classification>
        <further-classification edition="202001120250619B">H05B47/165</further-classification>
        <further-classification edition="202001120250619B">H05B47/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逯俊嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JUN-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王學端</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XUE-DUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種車間照明系統之控制方法及車間照明系統，車間照明系統包括n個照明設備，n為大於或等於1之正整數，每個照明設備設置於車間之其中一機器設備上，照明設備包括照明燈、第一感測雷達與第二感測雷達；控制方法包括：獲取第一感測雷達之第一感測資訊，以及第二感測雷達之第二感測資訊；確定第一感測資訊與預設第一資訊一致，且第二感測資訊與預設第二資訊一致時，控制對應之照明燈開啟；控制照明控制介面中對應之照明燈之虛擬按鍵中顯示開啟資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of controlling workshop lighting system and workshop lighting system. the workshop lighting system consists of n lighting fixtures, n being a positive integer greater than or equal to 1, each lighting device is provided on one of the machines and equipment of the workshop, the lighting device comprising a light, a first sensing radar and a second sensing radar. The method of controlling workshop lighting system includes: obtaining a first sensing information of the first sensing radar, and a second sensing information of the second sensing radar; determining that the first sensing information is consistent with a predetermined first information and the second sensing information is consistent with a predetermined second information, controlling the corresponding light to turn on; controlling the display of turn-on information in virtual buttons of the corresponding light in a lighting control interface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S23:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="629" publication-number="202632280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可對位的光纖陣列及其對位方法</chinese-title>
        <english-title>OPTICAL FIBER ARRAY CAPABLE OF ALIGNMENT AND ALIGNMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251211B">G01R1/02</main-classification>
        <further-classification edition="202001120251211B">G01R31/26</further-classification>
        <further-classification edition="200601120251211B">G02B6/38</further-classification>
        <further-classification edition="200601120251211B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢民測試系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMES TESTING SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可對位的光纖陣列，用於矽光晶圓測試系統。光纖陣列包括基板、蓋體、多個光纖與多個印記。基板具有第一端面及多個溝槽，光纖配置於溝槽，且各溝槽的其中一側向開口位於第一端面。蓋體疊置於基板上，覆蓋溝槽與光纖位在溝槽的局部以露出側向開口。蓋體具有第二端面。基板的第一端面、光纖的出光/收光面與蓋體的第二端面彼此共平面。印記分別配置於第一端面與第二端面，且在平面上，印記位在光纖所在範圍之外。另揭露一種光纖陣列的對位方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical fiber array capable of alignment for a silicon photonic wafer testing system including a base, a lid, a plurality of fiber optics, and a plurality marks is provided. The base has a first endface and a plurality of grooves, and one lateral opening of each grooves is located on the first endface. The lid has a second endface and is stacked onto the base to cover the grooves and portions of the fiber optics in the grooves and expose the lateral opening. The first endface, light emitting/receiving surfaces of the fiber optics, and the second endface are located on a same plane. The marks are located on the first endface and the second endface and outside a range where the fiber optics located. A fiber optics array alignment method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:矽光晶圓測試系統</p>
        <p type="p">20:光纖陣列</p>
        <p type="p">30:矽光晶圓</p>
        <p type="p">31:耦合器</p>
        <p type="p">32:接墊</p>
        <p type="p">100:晶圓針測機</p>
        <p type="p">110:載台</p>
        <p type="p">120:上照式鏡頭</p>
        <p type="p">140:探針卡</p>
        <p type="p">141:探針</p>
        <p type="p">150:晶圓傳送器</p>
        <p type="p">160:針測平台</p>
        <p type="p">200:耦光制動裝置</p>
        <p type="p">210:光纖承載座</p>
        <p type="p">300:光測儀器</p>
        <p type="p">400:整合控制模組</p>
        <p type="p">500:測距儀</p>
        <p type="p">600:自動測試機</p>
        <p type="p">X-Y-Z:直角座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="630" publication-number="202632450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備管控方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title>DEVICE CONTROL METHOD, DEVICE, ELECTRONIC APPARATUS AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G05B19/418</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏聚波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, JU-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種設備管控方法、裝置、電子設備及存儲介質。設備管控方法包括：獲取清洗設備的作業資訊；根據所述作業資訊判斷所述清洗設備是否滿足預設的清洗條件；若所述清洗設備不滿足所述清洗條件，發出提示資訊，並控制所述清洗設備停機。本申請實現了清洗設備的自動防呆管控。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a device control method, a device, an electronic apparatus and a storage medium. The device control method includes: obtaining operation information of a cleaning device; determining whether the cleaning device meets preset cleaning conditions based on the operation information; in response that the cleaning device does not meet the cleaning conditions, outputting a prompt message and controlling the cleaning device to stop operation. The application can realize automatic error-proof control of the cleaning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S12:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="631" publication-number="202632244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦光驗證方法</chinese-title>
        <english-title>OPTICAL COUPLING VERIFICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G01N21/15</main-classification>
        <further-classification edition="200601120260129B">G01N21/01</further-classification>
        <further-classification edition="200601120260129B">G01M11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢民測試系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMES TESTING SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耦光驗證方法，用於矽光晶圓測試系統。矽光晶圓測試系統包括晶圓針測機、耦光制動裝置、光測儀器與整合控制模組。整合控制模組電性連接晶圓針測機、耦光制動裝置與光測儀器，光纖陣列設置於耦光制動裝置且位在光測儀器的光路上。耦光驗證方法包括：將驗證套件裝載於晶圓針測機內；以整合控制模組驅動晶圓針測機的上照式鏡頭對位光纖陣列。以整合控制模組驅動晶圓針測機的下照式鏡頭對位驗證套件。整合控制模組取得光纖陣列與驗證套件在晶圓針測機內的對應位置關係後進行耦光驗證以獲取光路的光線特性變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical coupling verification method used in a silicon photonic wafer testing system is provided. The silicon photonic wafer testing system includes a wafer prober, coupling actuator device, an optic inspection device, and an integrated control module electrically connected to the wafer prober, the coupling actuator device, and the optic inspection device. A fiber optics array is disposed on the coupling actuator device and located on an optical path generated by the optic inspection device. The optical coupling verification method comprises: receiving a verification kit into the wafer prober. The integrated control module drives an upward camera to align the fiber optics array and drives a downward camera to align the verification kit to obtain a relative position relation of the fiber optics array and the verification, and then performs coupling verification to obtain a characteristics variation of light on the optical path.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="632" publication-number="202632295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽光子晶圓測試系統及其測試方法</chinese-title>
        <english-title>SILICON PHOTONIC WAFER TESTING SYSTEM AND TESTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">G01R1/073</main-classification>
        <further-classification edition="200601120260223B">G01R31/265</further-classification>
        <further-classification edition="200601120260223B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢民測試系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMES TESTING SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種矽光子晶圓測試系統，包括晶圓針測機、耦光制動裝置、光測儀器以及整合控制模組。晶圓針測機包括上照式鏡頭、下照式鏡頭與探針卡。矽光子晶圓適於承載在晶圓針測機的載台上。探針卡設置在載台的上方。至少一光纖陣列適於承載於該耦光制動裝置的光纖承載座上。光纖陣列位在光測儀器的光測路徑上。整合控制模組電性連接晶圓針測機、耦光制動裝置與光測儀器。另提供一種矽光子晶圓測試方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A silicon photonic wafer testing system including a wafer prober, an optical coupling actuator, an optical meter, and an integrated control module is provided. The wafer prober includes an upward camera, a downward camera, and a probe card. A silicon photonic wafer is carried on a stage member of the wafer prober. The probe card is disposed above the stage member. At least one optical fiber array is carried on a holder of the optical coupling actuator, and the optical fiber array is located on an optical path generated by the optical meter. The integrated control module is electrically connected to the wafer prober, the optical coupling actuator, and the optical meter. A silicon photonic water testing method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:矽光子晶圓測試系統</p>
        <p type="p">20:光纖陣列</p>
        <p type="p">30A:矽光子晶圓</p>
        <p type="p">31:耦合器</p>
        <p type="p">100:晶圓針測機</p>
        <p type="p">110:載台</p>
        <p type="p">120:上照式鏡頭</p>
        <p type="p">130:下照式鏡頭</p>
        <p type="p">150:晶圓傳送器</p>
        <p type="p">160:針測平台</p>
        <p type="p">200:耦光制動裝置</p>
        <p type="p">210:耦光機構</p>
        <p type="p">211:光纖承載座</p>
        <p type="p">220:耦光控制模組</p>
        <p type="p">300:光測儀器</p>
        <p type="p">400:整合控制模組</p>
        <p type="p">500:測距裝置</p>
        <p type="p">510:測距儀</p>
        <p type="p">520:測距控制模組</p>
        <p type="p">X-Y-Z:直角座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="633" publication-number="202633144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10D84/01</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="202501120260424B">H10D84/83</further-classification>
        <further-classification edition="202601120260424B">H10W42/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口敏光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TOSHIMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯克　彼得　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKE, PETER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製造半導體裝置的方法包括提供一半導體材料區域，該半導體材料區域包括一頂側、一邊緣區域、位於該邊緣區域內的一多屏蔽導體接觸區、一主動區、及一上屏蔽接觸區。該方法包括提供一主動溝槽。該主動溝槽包括一下屏蔽導體、隔離該下屏蔽導體與該半導體材料區域的一第一屏蔽介電質、一上屏蔽導體、及在該主動區內隔離該下屏蔽導體與該上屏蔽導體的一第二屏蔽介電質。該下屏蔽導體及該上屏蔽導體在該多屏蔽導體接觸區中耦接在一起。該方法包括在該上屏蔽接觸區中提供一屏蔽接觸件，該屏蔽接觸件耦接至該主動溝槽中的該上屏蔽導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes providing a region of semiconductor material including a top side, an edge region, a multiple shield conductor contact area within the edge region, an active area, and an upper shield contact area. The method includes providing an active trench. The active trench includes a lower shield conductor, a first shield dielectric isolating the lower shield conductor from the region of semiconductor material, an upper shield conductor, and a second shield dielectric isolating the lower shield conductor from the upper shield conductor within the active area. The lower shield conductor and the upper shield conductor are coupled together in the multiple shield conductor contact area. The method includes providing a shield contact in the upper shield contact area coupled to the upper shield conductor in the active trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">11:半導體材料本體</p>
        <p type="p">12:基材</p>
        <p type="p">14:半導體區域</p>
        <p type="p">18:頂側</p>
        <p type="p">19:下側</p>
        <p type="p">21A:下屏蔽導體</p>
        <p type="p">21B:上屏蔽導體</p>
        <p type="p">21’:屏蔽電極</p>
        <p type="p">21”:屏蔽電極</p>
        <p type="p">22A:主動溝槽</p>
        <p type="p">22B:終止溝槽</p>
        <p type="p">24:屏蔽介電質</p>
        <p type="p">27:電極間介電質；層間介電質</p>
        <p type="p">28:閘極電極</p>
        <p type="p">41:層間介電質</p>
        <p type="p">44A,44B:導體</p>
        <p type="p">46:導體</p>
        <p type="p">101:邊緣區域</p>
        <p type="p">102:雙屏蔽導體接觸區</p>
        <p type="p">103:主動區</p>
        <p type="p">104:上屏蔽接觸區</p>
        <p type="p">210A:屏蔽接觸件</p>
        <p type="p">212:凹陷接觸區域</p>
        <p type="p">220:尖端區域</p>
        <p type="p">240:屏蔽介電質</p>
        <p type="p">280:閘極接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="634" publication-number="202632935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用來驗證非同步介面電路的訊號產生器以及方法</chinese-title>
        <english-title>SIGNAL GENERATOR AND METHOD FOR VERIFYING ASYNCHRONOUS INTERFACE CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250502B">H04L43/0817</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈祥華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, XIANGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王子晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮豔梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, YANMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何家希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JIAXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用來驗證一非同步介面電路的訊號產生器以及方法，其中該訊號產生器包含一幀調變器、一時脈產生器、一介面選擇器以及一檢查模組。該幀調變器依據一幀控制參數產生一調變訊號，以及該時脈產生器依據一時脈控制參數產生一時脈訊號。該介面選擇器依據一介面控制參數、該調變訊號以及該時脈訊號產生一接收測試訊號，其中該訊號產生器利用一參考模型依據該接收測試訊號產生一參考訊號，以及該非同步介面電路依據該接收測試訊號產生一傳送測試訊號。另外，該檢查模組依據該參考訊號以及該傳送測試訊號產生至少一驗證結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal generator and a method for verifying an asynchronous interface circuit are provided, where the signal generator includes a frame modulator, a clock generator, an interface selector and a checking module. The frame modulator generates a modulated signal according to a frame control parameter, and the clock generator generates a clock signal according to a clock control parameter. The interface selector generate a receiving test signal according to an interface control parameter, the modulated signal and the clock signal, where the signal generator utilize a reference model to generate a reference signal according to the receiving test signal, and the asynchronous interface circuit generates a transmitting test signal according to the receiving test signal. In addition, the checking module generates at least one verification result according to the reference signal and the transmitting test signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:非同步介面電路</p>
        <p type="p">500:訊號產生器</p>
        <p type="p">510:非標準幀調變器</p>
        <p type="p">520:加擾器</p>
        <p type="p">530:時脈產生器</p>
        <p type="p">540:介面選擇器</p>
        <p type="p">550:監測器</p>
        <p type="p">560:參考模型</p>
        <p type="p">570:監測器</p>
        <p type="p">580:檢查模組</p>
        <p type="p">581:比較模組</p>
        <p type="p">582:分析器</p>
        <p type="p">P1,P2,P3:控制參數</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">F0:標準幀</p>
        <p type="p">F1:調變訊號</p>
        <p type="p">F2:加擾訊號</p>
        <p type="p">FRX:接收測試訊號</p>
        <p type="p">FTX:傳送測試訊號</p>
        <p type="p">DREF:接收監測訊號</p>
        <p type="p">D0:參考訊號</p>
        <p type="p">D1:傳送監測訊號</p>
        <p type="p">D2:傳送監測訊號</p>
        <p type="p">R1:比較結果</p>
        <p type="p">R2:分析結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="635" publication-number="202632648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置以及其讀取方法</chinese-title>
        <english-title>MEMORY DEVICE AND READING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C7/00</main-classification>
        <further-classification edition="200601120251201B">G11C11/40</further-classification>
        <further-classification edition="200601120251201B">G11C8/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭文敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪碩男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHUO-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置以及其讀取方法被提出。記憶體裝置例如為三維反及式快閃記憶體，且提供高性能以及高容量的儲存媒介。讀取方法包括：在設定期間，設定多個字元線信號為設定電壓值，其中各字元線信號為記憶體子區塊所共同接收；在多個讀取期間，設定字元線信號中的選中字元線信號為選中電壓值，設定字元線信號中的至少一未選中字元線信號為未選中電壓值；以及，在各讀取期間，選擇各記憶體子區塊以執行讀取操作，其中，讀取期間為在設定期間之後的連續的多個時間區間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and a reading method thereof are provided. The memory device is, for example a three dimensional NAND flash memory circuit, and provides a storage media with high-performance and high-capacity. The reading method includes: during a setting period, setting a plurality of word line signals to a setting voltage, wherein each of the word line signals are commonly received by a plurality of memory sub-blocks; during a plurality of reading periods, setting a selected word line of the word line signals to a selected voltage value, and setting at least one deselected word line signal of the word line signals to a deselected voltage value; and, during each of the reading periods, selecting each of the memory sub-blocks to perform a reading operation. Wherein, the reading periods are a plurality of time period after the setting period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S710~S730:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="636" publication-number="202632125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁力釋放鎖總成</chinese-title>
        <english-title>MAGNETICALLY RELEASED LOCK ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">E05B47/00</main-classification>
        <further-classification edition="200601120251201B">E05B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商永德公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONDR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾柏戴爾馬雷克　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABDELMALEK, ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHI-SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊岦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種鎖總成，其包括一上部主體、一下部主體、一柱、柱軸承、一軸承殼體及/或一軸承導引件。該柱經構形以在鎖定狀態下將該上部主體耦合至該下部主體。該下部主體容置一軸承導引件、軸承殼體及柱軸承，其中該等軸承定位在該軸承殼體內側。該軸承導引件包含一錐形內表面，控制該等柱軸承之橫向運動。一軸承殼體彈簧迫使軸承殼體抵靠該軸承導向件之該頂部內表面，在鎖定時接合該柱頸部。該上體部主體包含一上蓋框架及一柱殼體，該柱殼體導引該柱之垂直運動。磁力控制該柱之接合及脫離，容許藉由向下牽引該軸承殼體來解鎖該鎖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is directed to a lock assembly comprising an upper body, a lower body, a post, post bearings, a bearing housing, and/or a bearing guide. The post is configured to couple the upper body to the lower body in a locked state. The lower body houses a bearing guide, bearing housing, and post bearings, with the bearings positioned inside the bearing housing. The bearing guide includes a tapered inner surface, controlling the lateral movement of the post bearings. A bearing housing spring forces the bearing housing against the top inner surface of the bearing guide, engaging the post neck when locked. The upper body includes an upper cover frame and a post housing, which guides the vertical motion of the post. Magnetic forces control engagement and disengagement of the post, allowing the lock to be unlocked by drawing the bearing housing downward.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:柱殼體</p>
        <p type="p">501:上蓋</p>
        <p type="p">901:上部主體</p>
        <p type="p">1201:柱</p>
        <p type="p">1204:柱尖端</p>
        <p type="p">1301:柱軸承</p>
        <p type="p">1401:柱殼體彈簧</p>
        <p type="p">1402:軸承殼體</p>
        <p type="p">1403:軸承殼體彈簧</p>
        <p type="p">1601:軸承導引錐形件</p>
        <p type="p">1701:下部主體</p>
        <p type="p">1702:下部殼體</p>
        <p type="p">2000:鎖總成</p>
        <p type="p">2001:釋放磁體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="637" publication-number="202632281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽光晶圓測試系統的清潔方法</chinese-title>
        <english-title>CLEANING METHOD OF SILICON PHOTONIC WAFER TESTING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01R1/02</main-classification>
        <further-classification edition="202401120260102B">B08B1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢民測試系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMES TESTING SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種矽光晶圓測試系統的清潔方法，包括：以整合控制模組驅動晶圓針測機的上照式鏡頭以對位光纖陣列；以整合控制模組驅動晶圓針測機的下照式鏡頭以對位清潔套件；以及以整合控制模組驅動清潔套件清潔光纖陣列。矽光晶圓測試系統包括晶圓針測機、耦光制動裝置與整合控制模組，光纖陣列裝載於耦光制動裝置。整合控制模組電性連接晶圓針測機與耦光制動裝置。晶圓針測機包括針測平台與設置其內的清潔套件、上照式鏡頭與下照式鏡頭。耦光制動裝置設置在針測平台上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning method of silicon photonic wafer testing system is provided. The silicon photonic wafer testing system includes a wafer prober, an optical coupling device, and an integrated control module. The cleaning method comprises: aligning a fiber optics array via an integrated control module driving an upward camera of the wafer prober; aligning a cleaning kit via the integrated control module driving a downward camera of the wafer prober; and the integrated control module drives the cleaning kit to clean the fiber optics array. The silicone photonic wafer testing system includes the wafer prober having a probe stage and the cleaning kit, the upward camera, and the downward camera disposed in the probe stage, an optical coupling device disposed on the probe stage, and the integrated control module electrically connected to the wafer prober and the optical coupling device. The fiber optics array is load onto the optical coupling device.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="638" publication-number="202631733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物部件、流體導引裝置及流體導引裝置之用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08F8/00</main-classification>
        <further-classification edition="200601120260422B">C08F8/42</further-classification>
        <further-classification edition="200601120260422B">C08K5/098</further-classification>
        <further-classification edition="200601120260422B">C08K5/42</further-classification>
        <further-classification edition="202501120260422B">C08L23/26</further-classification>
        <further-classification edition="200601120260422B">A61M1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商蓋米工業設備有限兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEMUE GEBR. MUELLER APPARATEBAU GMBH &amp; CO. KOMMANDITGESELLSCHAFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊姆特　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEMT, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊扎迪　奧米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZADI, OMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於流體導引裝置中的接觸流體用途之聚合物部件(18)。該聚合物部件(18)包括接觸介質的區段(22)，該區段至少局部地由可交聯聚合物材料(48)製成。該可交聯聚合物材料包括至少一種用矽烷(52)官能基化之聚烯烴(50)及至少一種矽烷醇縮合催化劑(62)，其中該等矽烷中的至少一些為非交聯矽烷。本發明還有關於一種流體導引裝置(10)以及流體導引裝置之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">48:可交聯聚合物材料</p>
        <p type="p">50:聚烯烴</p>
        <p type="p">52:矽烷</p>
        <p type="p">60:矽氧烷鍵</p>
        <p type="p">64:缺陷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="639" publication-number="202632176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制流體裝置及其設置方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250429B">F16L41/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科斯摩工機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSMO KOKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可長期地維持成為設置對象之流體管的結構強度之控制流體裝置及其設置方法。&lt;br/&gt;控制流體裝置1以不斷流狀態設置於構成管路之既設的流體管2，具備：保護管20，呈密封狀地外嵌前述流體管2的外周面；殼體3，呈密封狀地外嵌保護管20的至少一部分；作為密封材的圓形橡膠26，涵蓋全周夾設於流體管2和保護管20的周面間之比流體管2的切斷端面35、35還外側的特定處TP；及填充材24，填充於形成在特定處TP除外的流體管2和保護管20的周面間5之空間S內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:流體管</p>
        <p type="p">3a:上部殼體</p>
        <p type="p">6:側身部</p>
        <p type="p">8:側環</p>
        <p type="p">20B:分割管(第1分割管)</p>
        <p type="p">20C:分割管</p>
        <p type="p">21:第1筒狀部</p>
        <p type="p">21a:大徑部</p>
        <p type="p">21b:小徑部</p>
        <p type="p">22:第2筒狀部</p>
        <p type="p">22c:凸緣</p>
        <p type="p">22d:凸緣</p>
        <p type="p">23:注入口</p>
        <p type="p">24:填充材</p>
        <p type="p">25:導引部</p>
        <p type="p">26:圓形橡膠</p>
        <p type="p">27:補土</p>
        <p type="p">28:圓形橡膠</p>
        <p type="p">30:壓環</p>
        <p type="p">35:切斷端面</p>
        <p type="p">41:筒狀部</p>
        <p type="p">42:連接筒部</p>
        <p type="p">N2:螺栓螺帽</p>
        <p type="p">N3:螺栓螺帽</p>
        <p type="p">S:空間</p>
        <p type="p">TP:特定處</p>
        <p type="p">W:熔接</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="640" publication-number="202632917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備測試裝置、方法、電子設備及電腦可讀記錄媒體</chinese-title>
        <english-title>DEVICE TESTING APPARATUS, METHOD, ELECTRONIC DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250502B">H04B5/00</main-classification>
        <further-classification edition="201501120250502B">H04B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造（浙江）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE ITECH(ZHEJIANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出的一種設備測試裝置、方法、電子設備及電腦可讀記錄媒體，設備測試裝置包括處理模組、流水線模組以及NFC檢測模組；目標設備放置於流水線模組上，處理模組分別與NFC檢測模組、目標設備連接，NFC檢測模組與流水線模組相對設置。通過相對流水線模組設置NFC檢測模組，使得目標設備能夠直接在流水線上進行NFC模組的測試，而無需進行移動，節省了測試時間；同時，設置NFC檢測模組與處理模組能夠實現NFC模組的自動化測試，進一步降低了對於人工的依賴，節省了人工成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes a device testing apparatus, method, electronic device, and computer-readable storage medium. The device testing apparatus comprises a processing module, a conveyor module, and an NFC detection module. The target device is placed on the conveyor module, while the processing module is respectively connected to the NFC detection module and the target device. The NFC detection module is arranged opposite the conveyor module. By configuring the NFC detection module opposite the conveyor module, the target device can undergo NFC module testing directly on the production line without requiring additional movement, thereby reducing testing time. Additionally, the integration of the NFC detection module with the processing module enables automated NFC module testing, further minimizing reliance on manual labor and reducing labor costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理模組</p>
        <p type="p">200:流水線模組</p>
        <p type="p">300:NFC檢測模組</p>
        <p type="p">400:目標設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="641" publication-number="202632516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供頁面之方法、用於該方法之電子裝置及記錄有用以於電腦中執行該方法之程式之非暫時性電腦可讀記錄媒體</chinese-title>
        <english-title>METHOD FOR PROVIDING PAGE, ELECTRONIC DEVICE THEREOF AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM IN WHICH PROGRAM FOR EXECUTING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251001B">G06F16/9535</main-classification>
        <further-classification edition="202301120251001B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙承妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉霖善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, LAM SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簾明悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種於電子裝置中提供頁面之方法。具體而言，於電子裝置中提供頁面之方法可包括如下步驟：自用戶之終端接收對與輸入檢索詞相關之頁面之請求；確認用戶於設定之期間內查詢之至少一個第1物品中之用戶未購買的至少一個第2物品；及提供包括至少一個第2物品之資訊之頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="642" publication-number="202633134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兩步氧化物溝槽碳化矽MOSFET</chinese-title>
        <english-title>TWO-STEP OXIDE TRENCH SILICON CARBIDE MOSFET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10D62/832</main-classification>
        <further-classification edition="202501120260421B">H10D62/10</further-classification>
        <further-classification edition="202501120260421B">H10D64/27</further-classification>
        <further-classification edition="202501120260421B">H10D30/66</further-classification>
        <further-classification edition="202501120260421B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利斯巴德　迪利普　馬達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RISBUD, DILIP MADHAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了兩步氧化物溝槽碳化矽MOSFET。半導體裝置可以包括形成在碳化矽基板上的漂移區域。半導體裝置可以包括穿透源極區域和通道並且到達漂移區域的溝槽。半導體裝置可以包括加襯於溝槽中的氧化物區域。氧化物區域可以包括底部部分、下側部分和上側部分。底部部分的厚度和下側部分的厚度可以大於上側部分的厚度。半導體裝置可以包括形成在襯有氧化物區域的溝槽中的閘極電極。半導體裝置可以包括與溝槽的底部部分接觸的遮蔽區域。半導體區域的寬度可以小於或等於溝槽的寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and processes for manufacturing semiconductors are described. A semiconductor device can include a drift region formed on a Silicon Carbide substrate. The semiconductor device can include a trench that penetrates through a source region and a channel and reaches the drift region. The semiconductor device can include an oxide region lining the trench. The oxide region can include a bottom portion, a lower side portion and an upper side portion. A thickness of the bottom portion and a thickness of the lower side portion can be greater than a thickness of the upper side portion. The semiconductor device can include a gate electrode formed in the trench lined with the oxide region. The semiconductor device can include a shield region in contact with a bottom portion of the trench. A width of the semiconductor region can be less than or equal to a width of the trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:溝槽</p>
        <p type="p">102:閘極</p>
        <p type="p">103:基板</p>
        <p type="p">104:源極</p>
        <p type="p">106:汲極</p>
        <p type="p">108:鈍化氧化物</p>
        <p type="p">109:通道</p>
        <p type="p">110:漂移區域</p>
        <p type="p">112:JFET區域</p>
        <p type="p">114:第一摻雜區域</p>
        <p type="p">116:第二摻雜區域</p>
        <p type="p">118:基極</p>
        <p type="p">120:氧化物區域</p>
        <p type="p">130:遮蔽區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="643" publication-number="202632865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>GaN驅動功率開關電源系統及其控制電路</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H02M3/156</main-classification>
        <further-classification edition="200601120250602B">H02M1/08</further-classification>
        <further-classification edition="200601120250602B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱力強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方烈義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用在GaN驅動功率開關電源系統中的控制電路，被配置為：在GaN驅動功率開關電源系統處於輕載模式的情況下，控制第一供電通路控制開關處於關斷狀態，並且基於供電電容上的供電電壓和用於控制GaN功率開關的導通與關斷的第一功率開關控制信號生成用於控制第二供電通路控制開關的導通與關斷的第二通路開關控制信號和用於控制功率驅動開關的導通與關斷的第二功率開關控制信號；或者在GaN驅動功率開關電源系統處於非輕載模式的情況下，控制第二供電通路控制開關處於關斷狀態，並且基於供電電容上的供電電壓和第一功率開關控制信號生成用於控制第一供電通路控制開關的導通與關斷的第一通路開關控制信號和第二功率開關控制信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:功率開關控制信號</p>
        <p type="p">102,103:供電通路控制信號</p>
        <p type="p">104:供電通路關斷信號</p>
        <p type="p">106:供電電壓指示信號</p>
        <p type="p">C3:供電電容</p>
        <p type="p">CS:電流感測電壓</p>
        <p type="p">D101:二極體</p>
        <p type="p">ILp:一次側電感電流</p>
        <p type="p">K102,K103,K104:開關</p>
        <p type="p">M1:GaN功率開關</p>
        <p type="p">M2:功率驅動開關</p>
        <p type="p">PWM:脈寬調變</p>
        <p type="p">R2:電流檢測電阻</p>
        <p type="p">SW:開關控制腳</p>
        <p type="p">U200:開關電源控制單元</p>
        <p type="p">U201:脈寬調變(PWM)控制模組</p>
        <p type="p">U202:供電模組</p>
        <p type="p">U2021:電流設置子模組</p>
        <p type="p">U2022:供電電壓偵測子模組</p>
        <p type="p">U203:驅動控制模組</p>
        <p type="p">U204:驅動模組</p>
        <p type="p">VDD:供電電壓</p>
        <p type="p">VIN:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="644" publication-number="202633037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法、半導體裝置及印刷電路板</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND PRINTED CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H05K3/341</main-classification>
        <further-classification edition="202601120260427B">H05K1/181</further-classification>
        <further-classification edition="202601120260427B">H10W70/40</further-classification>
        <further-classification edition="202601120260427B">H10W76/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀松芳樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIMATSU, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂東謙親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDO, YORICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一項實施例，一種半導體裝置之製造方法包含：提供一印刷電路板，該印刷電路板具有上面形成有一第一阻銲劑之一第一表面以及與該第一表面相對且上面形成有一第二阻銲劑之一第二表面，該第二阻銲劑具有一第一區域及一第二區域，其中在垂直於該第二表面之一第一方向上，該第一區域中之該第二阻銲劑之一厚度大於該第二區域中之該第二阻銲劑之一厚度；將一半導體晶片放置在該印刷電路板之該第一阻銲劑上；將該半導體晶片密封在該印刷電路板上；及移除該第二阻銲劑在該第一區域中之一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment, a method of manufacturing a semiconductor device includes: providing a printed circuit board that has a first surface on which a first solder resist is formed and a second surface opposite to the first surface and on which a second solder resist having a first region and a second region is formed, wherein a thickness of the second solder resist in the first region is greater than a thickness of the second solder resist in the second region in a first direction perpendicular to the second surface; placing a semiconductor chip on the first solder resist of the printed circuit board; sealing the semiconductor chip on the printed circuit board; and removing a part of the second solder resist in the first region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:印刷電路板</p>
        <p type="p">1a:第一表面</p>
        <p type="p">1b:第二表面</p>
        <p type="p">2:黏合劑</p>
        <p type="p">3:半導體晶片</p>
        <p type="p">4:導電連接部件/連接部件</p>
        <p type="p">5:密封樹脂</p>
        <p type="p">6:金屬凸塊</p>
        <p type="p">11:芯部件</p>
        <p type="p">11a:第三表面</p>
        <p type="p">11b:第四表面</p>
        <p type="p">12a:第一預浸料/預浸料</p>
        <p type="p">12b:第二預浸料</p>
        <p type="p">12b3:第三區域/預浸料</p>
        <p type="p">12b4:第四區域/預浸料</p>
        <p type="p">13a:互連層</p>
        <p type="p">13b:互連層</p>
        <p type="p">14:通孔</p>
        <p type="p">15a:第一阻銲劑/阻銲劑</p>
        <p type="p">15b1:第一區域</p>
        <p type="p">15b2:第二區域</p>
        <p type="p">15c:第二阻銲劑/阻銲劑</p>
        <p type="p">16:墊</p>
        <p type="p">17:電極</p>
        <p type="p">21:墊</p>
        <p type="p">100:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="645" publication-number="202632850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擺角導針繞線系統及其擺動模組</chinese-title>
        <english-title>SWING-ANGLE GUIDING-NEEDLE WINDING SYSTEM AND SWING MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">H02K15/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昶志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡尚廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHANG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSIU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種擺角導針繞線系統及其擺動模組。擺動模組是組配連接導針而將線體繞設於電極，其中擺動模組包括傳動電機以及連接桿。傳動電機設置於基座，其中導針樞接設置於基座的底端，且具有彼此相反的入線端以出線端。連接桿包括彼此相反的第一端和第二端，其中第一端連接傳動電機，且受傳動電機驅動使連接桿相對基座於縱向上位移，第二端連接導針的入線端，其中當連接桿於縱向上位移時第二端帶動導針的出線端相對縱向擺動角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a swing-angle guiding-needle winding system and a swing module thereof. The swing module is configured to connect a guiding needle to wind a wire around an electrode. The swing module includes a transmission motor and a connection rod. The transmission motor is disposed on a base. The guiding needle is pivotally connected to a bottom end of the base and has a wire input end and a wire output end opposite to each other. The connection rod includes a first end and a second end opposite to each other. The first end is connected to the transmission motor and driven by the transmission motor to displace the connection rod longitudinally relative to the base. Moreover, the second end is connected to the wire input end of the guiding needle. When the connection rod is displaced longitudinally, the second end drives the wire output end of the guiding needle to swing at an angle relative to the longitudinal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:擺角導針繞線系統</p>
        <p type="p">2:擺動模組</p>
        <p type="p">10:基座</p>
        <p type="p">11:固定支撐架</p>
        <p type="p">20:導針</p>
        <p type="p">21:入線端</p>
        <p type="p">22:出線端</p>
        <p type="p">23:導線噴嘴</p>
        <p type="p">24:中空部</p>
        <p type="p">30:傳動電機</p>
        <p type="p">40:連接桿</p>
        <p type="p">41:第一端</p>
        <p type="p">42:第二端</p>
        <p type="p">43、44:轉軸</p>
        <p type="p">50:滾珠螺桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="646" publication-number="202631738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固性聚烯烴樹脂</chinese-title>
        <english-title>THERMAL SET POLYOLEFIN RESIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C08F212/08</main-classification>
        <further-classification edition="200601120260401B">C08F212/12</further-classification>
        <further-classification edition="200601120260401B">C08F212/14</further-classification>
        <further-classification edition="200601120260401B">C08F216/34</further-classification>
        <further-classification edition="200601120260401B">C08F232/08</further-classification>
        <further-classification edition="200601120260401B">C08F8/00</further-classification>
        <further-classification edition="201801120260401B">C08K3/013</further-classification>
        <further-classification edition="200601120260401B">C08L25/08</further-classification>
        <further-classification edition="200601120260401B">C08L25/18</further-classification>
        <further-classification edition="200601120260401B">C08L25/16</further-classification>
        <further-classification edition="200601120260401B">C08L29/14</further-classification>
        <further-classification edition="200601120260401B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藍立方知識產權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLUE CUBE IP LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪慶慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉思宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JOURNEY LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了可固化多官能烯烴樹脂，例如式I和式Ia化合物，其可用於製備適用於下一代AI伺服器應用的電氣層壓板。本文還提供了製造可固化多官能烯烴樹脂和相關中間體化合物的方法。本文還提供了可固化組合物，所述可固化組合物包括可固化多官能烯烴樹脂，其任選地與一種或多種其它可固化分子或樹脂和/或一種或多種填料或其它任選成分組合。本文還提供了電氣層壓板以及併入此類層壓板的產品(例如印刷電路板)，其藉由固化本文所述的可固化多官能烯烴樹脂來製備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are curable multifunctional olefin resins, for example compounds of Formula I and Formula Ia, that can be used to prepare electrical laminates suitable for use in next-generation AI server applications. Also provided herein are processes for making the curable multifunctional olefin resins and related intermediate compounds. Also provided herein are curable compositions comprising a curable multifunctional olefin resin, optionally in combination with one or more other curable molecules or resins and/or one or more fillers or other optional components. Also provided herein are electrical laminates, and products that incorporate such laminates (e.g., printed circuit boards), that are prepared by curing a curable multifunctional olefin resin as described herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="647" publication-number="202632170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管座及耦合組件</chinese-title>
        <english-title>SOCKET AND COUPLING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250605B">F16L37/04</main-classification>
        <further-classification edition="200601120250605B">F16L37/086</further-classification>
        <further-classification edition="200601120250605B">F16L37/098</further-classification>
        <further-classification edition="200601120250605B">F16L37/12</further-classification>
        <further-classification edition="200601120250605B">F16L37/248</further-classification>
        <further-classification edition="200601120250605B">F16L47/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健策精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭善雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHAN YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虞晉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴于淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煒棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡逸辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐妤婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管座包含管座主體以及桿件。管座主體具有空腔以及位於空腔之相反兩端之前開口以及後開口。管座主體進一步具有貫穿管座主體之穿槽。桿件設置於空腔中。桿件包含桿體、桿頭、數個弧狀支撐骨以及承靠底部。桿頭設置於桿體之一端。數個弧狀支撐骨自桿體之另一端延伸。數個弧狀支撐骨中之每一者於管座主體之軸向以及徑向上遠離桿體延伸。承靠底部連接數個弧狀支撐骨。數個弧狀支撐骨中之每兩者與承靠底部共同定義流道開口。數個弧狀支撐骨於遠離桿體之一側形成穹面。穹面位於桿體與承靠底部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A socket includes a socket main body and a stem. The socket main body has a cavity and a front opening and a rear opening located on two opposite ends of the cavity. The socket main body further has a through slot runs through the socket main body. The stem includes a stem body, a stem head, a plurality of arc-shaped supporting bones, and an abutting bottom portion. The stem head is disposed at an end of the stem body. The arc-shaped supporting bones extend from the other end of the stem body. Each of the arc-shaped supporting bones extends away from the stem body in an axial direction and a radial direction of the socket main body. The abutting bottom portion is connected to the arc-shaped supporting bones. Every two of the arc-shaped supporting bones and the abutting bottom portion jointly define a fluid passageway opening. A domed surface is formed at a side of the arc-shaped supporting bones away from the stem body. The domed surface is located between the stem body and the abutting bottom portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管座</p>
        <p type="p">110:管座主體</p>
        <p type="p">110pf:水平面</p>
        <p type="p">110si:內表面</p>
        <p type="p">110so:外表面</p>
        <p type="p">111:前端面</p>
        <p type="p">113:扣環凹槽</p>
        <p type="p">113A:貫穿部</p>
        <p type="p">114:穿槽</p>
        <p type="p">115:簷部</p>
        <p type="p">116:內溝</p>
        <p type="p">117:前容置槽</p>
        <p type="p">118:後容置槽</p>
        <p type="p">119:外容置槽</p>
        <p type="p">120:管座後端子</p>
        <p type="p">122:多角形結構</p>
        <p type="p">123:漸縮部</p>
        <p type="p">124:內縮環狀表面</p>
        <p type="p">130:按壓件</p>
        <p type="p">130fg:弧面</p>
        <p type="p">132:按壓本體</p>
        <p type="p">133:舌部</p>
        <p type="p">133b:底面</p>
        <p type="p">134:卡榫</p>
        <p type="p">140:扣環</p>
        <p type="p">142:彈性部</p>
        <p type="p">144:上內嵌環部</p>
        <p type="p">146:卡合環部</p>
        <p type="p">148:下內嵌環部</p>
        <p type="p">150:標籤環</p>
        <p type="p">152:凸部</p>
        <p type="p">160:套筒</p>
        <p type="p">160b:抵靠面</p>
        <p type="p">170:桿件</p>
        <p type="p">172:桿體</p>
        <p type="p">173:桿頭</p>
        <p type="p">173a,176a:前表面</p>
        <p type="p">174:桿頭凹槽</p>
        <p type="p">175:弧狀支撐骨</p>
        <p type="p">176:承靠底部</p>
        <p type="p">176b:後表面</p>
        <p type="p">180:彈簧</p>
        <p type="p">RG1:第一膠圈</p>
        <p type="p">RG2:第二膠圈</p>
        <p type="p">RG3:第三膠圈</p>
        <p type="p">RG4:第四膠圈</p>
        <p type="p">RG5:第五膠圈</p>
        <p type="p">SIL:前開口</p>
        <p type="p">SOL:後開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="648" publication-number="202632171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管塞及耦合組件</chinese-title>
        <english-title>PLUG AND COUPLING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250605B">F16L37/04</main-classification>
        <further-classification edition="200601120250605B">F16L37/086</further-classification>
        <further-classification edition="200601120250605B">F16L37/098</further-classification>
        <further-classification edition="200601120250605B">F16L37/12</further-classification>
        <further-classification edition="200601120250605B">F16L37/248</further-classification>
        <further-classification edition="200601120250605B">F16L47/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健策精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭善雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHAN YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虞晉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴于淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煒棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡逸辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐妤婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管塞具有空腔以及位於空腔之相反兩端之前開口以及後開口。管塞包含管塞主體、管塞後端子以及活塞。管塞主體包含自管塞主體之外表面凸起之環狀卡鈎。前開口定義管塞主體之前端面。管塞後端子連接管塞主體。後開口位於管塞後端子之遠離管塞主體之一端。活塞設置於空腔中。活塞包含活塞主體、塞頭以及兩延伸部。活塞主體具有錐面。塞頭設置於活塞主體上。兩延伸部設置於活塞主體之相反兩側。兩延伸部自活塞主體之錐面遠離塞頭延伸。兩延伸部之間定義缺口位於活塞主體之遠離塞頭之一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plug has a cavity and a front opening and a rear opening located at two opposite ends of the cavity. The plug includes a plug main body, a plug rear terminal, and a piston. The plug main body includes a circumferential hook raised from an outer surface of the plug main body. The front opening defines a front end surface of the plug main body. The plug rear terminal is connected to the plug main body. The rear opening is located at an end of the plug rear terminal away from the plug main body. The piston is disposed in the cavity. The piston includes a piston main body, a piston head, and two extending portions. The piston main body has a cone surface. The piston head is disposed on the piston main body. The two extending portions are disposed at two opposite sides of the piston main body. The two extending portions extend away from the piston head from the cone surface of the piston main body. A notch is defined between the two extending portions and is located at a side of the piston main body away from the piston head.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管塞</p>
        <p type="p">110:管塞主體</p>
        <p type="p">110si:內表面</p>
        <p type="p">110so:外表面</p>
        <p type="p">111:前端面</p>
        <p type="p">112:環狀卡鈎</p>
        <p type="p">112a:卡合面</p>
        <p type="p">112s:斜面</p>
        <p type="p">113:環狀卡合槽</p>
        <p type="p">115:簷部</p>
        <p type="p">116:內溝</p>
        <p type="p">117:外容置槽</p>
        <p type="p">120:管塞後端子</p>
        <p type="p">120bs,146a:抵靠面</p>
        <p type="p">122:後端子主體</p>
        <p type="p">123:漸縮部</p>
        <p type="p">124:內縮環狀表面</p>
        <p type="p">125:銜接部</p>
        <p type="p">130:標籤環</p>
        <p type="p">132:凸部</p>
        <p type="p">140:活塞</p>
        <p type="p">142:活塞主體</p>
        <p type="p">143:塞頭</p>
        <p type="p">143a:前表面</p>
        <p type="p">144:活塞凹槽</p>
        <p type="p">146:延伸部</p>
        <p type="p">146r:穹面</p>
        <p type="p">147:缺口</p>
        <p type="p">150:彈簧</p>
        <p type="p">D&lt;sub&gt;110&lt;/sub&gt;,D&lt;sub&gt;113&lt;/sub&gt;:直徑</p>
        <p type="p">SL1,SL2:膠圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="649" publication-number="202633399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理設備及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P95/00</main-classification>
        <further-classification edition="202601120260424B">H10P95/90</further-classification>
        <further-classification edition="200601120260424B">G03F7/20</further-classification>
        <further-classification edition="202601120260424B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商盛美半導體設備韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH KOREA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商清芯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEANCHIP TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANG-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RENZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種基板處理設備及方法。該基板處理設備，包括沿第一水準方向依次排布的設備前端模組、製程站以及介面站。製程站包括：塗覆單元、顯影單元和熱處理單元，熱處理單元用於對基板進行熱處理，包括若干熱處理模組和若干移動傳輸部；其中，至少一個移動傳輸部與熱處理模組在豎直方向上堆疊設置，且至少一個移動傳輸部被構造為沿第一水準方向傳輸基板。本申請實現了提高設備的整體運行效率的技術效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理設備</p>
        <p type="p">100:設備前端模組</p>
        <p type="p">200:製程站</p>
        <p type="p">210:塗覆單元</p>
        <p type="p">211:塗覆模組</p>
        <p type="p">212:塗覆機械手</p>
        <p type="p">220:顯影單元</p>
        <p type="p">221:顯影模組</p>
        <p type="p">222:顯影機械手</p>
        <p type="p">230:熱處理單元</p>
        <p type="p">231:熱處理模組</p>
        <p type="p">2321:移動傳輸部</p>
        <p type="p">2311:首列熱處理模組</p>
        <p type="p">2312:尾列熱處理模組</p>
        <p type="p">241:第一側面機械手</p>
        <p type="p">242:第二側面機械手</p>
        <p type="p">243:第三側面機械手</p>
        <p type="p">244:第四側面機械手</p>
        <p type="p">245:第五側面機械手</p>
        <p type="p">251:第一緩存部</p>
        <p type="p">252:第二緩存部</p>
        <p type="p">261:第一輔助處理模組</p>
        <p type="p">262:第二輔助處理模組</p>
        <p type="p">300:介面站</p>
        <p type="p">c-c:線</p>
        <p type="p">x、y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="650" publication-number="202631476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理晶圓的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR PROCESSING WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G49/07</main-classification>
        <further-classification edition="200601120260302B">G01S17/08</further-classification>
        <further-classification edition="200601120260302B">B25J19/02</further-classification>
        <further-classification edition="200601120260302B">B25J9/18</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台積電（中國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱宏華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬龍龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LONGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭利生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANG, LISHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：在一腔室中垂直地移動一隔板；使用一距離感測器來量測該隔板的一垂直位置；判定該隔板之一目標載物台的一垂直位置是否係在一可接受範圍內；及回應於該目標載物台之該垂直位置係在一可接受範圍內，移動一晶圓至該目標載物台上或移動該晶圓遠離該目標載物台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes vertically moving a shelf in a chamber; using a distance sensor, measuring a vertical position of the shelf; determining whether a vertical position of a target stage of the shelf is within an acceptable range; and in response to the vertical position of the target stage is within an acceptable range, moving a wafer onto or away from the target stage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100W:壁</p>
        <p type="p">210:蓋子</p>
        <p type="p">220:隔板</p>
        <p type="p">222T:最頂載物台</p>
        <p type="p">222:載物台</p>
        <p type="p">310:距離感測器</p>
        <p type="p">312L:雷射射束</p>
        <p type="p">320:固定元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="651" publication-number="202632858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115796</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具零電壓與零電流切換控制之切換電容轉換器與控制方法</chinese-title>
        <english-title>SWITCHED-CAPACITOR CONVERTER WITH ZERO-VOLTAGE AND ZERO-CURRENT SWITCHING CONTROL AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">H02M3/04</main-classification>
        <further-classification edition="200601120250910B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅業興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YE-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林水木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHUI-MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浚彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIUN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許麗美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種切換電容轉換器，其包含N個飛馳電容器（其中N≥1）及複數個開關，用於於複數切換相位間進行週期性切換，以將一第一電壓轉換為一第二電壓或反向轉換。當進入其中一第一切換相位時，本發明控制該N個飛馳電容器中至少一者之第一端較第二端先行導通，以電連接至該切換相位所對應之節點，形成所需之耦接關係，並使其第二端可在逐步接近零電壓條件下再導通。藉此可實現關鍵開關之零電壓切換，有效降低切換損耗並提升整體轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a switched capacitor converter comprising N flying capacitors (where N ≥ 1) and a plurality of switches configured to perform periodic switching between a plurality of switching phases to convert a first voltage into a second voltage, or vice versa. Upon entering one of the switching phases, referred to as the first switching phase, the first terminal of at least one of the flying capacitors is turned on earlier than its second terminal to electrically connect to a node corresponding to the first switching phase, thereby forming a required coupling relation for the phase. This configuration allows the second terminal to gradually approach a zero-voltage switching (ZVS) before being subsequently turned on, which enables the corresponding switch to operate under ZVS condition. As a result, switching loss is reduced and power conversion efficiency is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4:開關控制訊號</p>
        <p type="p">Td:預設延遲時間</p>
        <p type="p">Tsw:切換週期</p>
        <p type="p">VQ1,VQ3:開關跨壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">t0~t6:時點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="652" publication-number="202632265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115797</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造用於感測目標生物材料之半導體裝置的方法、生物敏感半導體裝置及生物感測器場效電晶體二維陣列</chinese-title>
        <english-title>METHOD OF FABRICATING SEMICONDUCTOR DEVICE FOR SENSING TARGET BIOLOGICAL MATERIAL, BIOLOGICALLY SENSITIVE SEMICONDUCTOR DEVICE, AND BIOSENSOR FIELD-EFFECT TRANSISTOR 2-DIMENSIONAL ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N27/327</main-classification>
        <further-classification edition="202601120260504B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮政鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUAN, CHENG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李品賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PIN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜玶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一半導體生物敏感半導體裝置製造方法及結構係包括：一生物感測器微井或井電晶體及一參考電極電晶體；一生物感測器微井或井，一生物材料可選擇性地引入至其中，以及一參考電極空腔，一參考材料可選擇性地引入至其中；一生物敏感層，其在該生物感測器微井或井內，其對該生物材料具有反應性；以及其中該參考電極空腔位設成相近於該生物感測器微井或井。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor biologically sensitive semiconductor device fabrication method and structure includes a biosensor microwell or well transistor and a reference electrode transistor; a biosensor microwell or well into which a biological material may be selectively introduced and a reference electrode cavity into which a reference material may be selectively introduced; a biologically sensitive layer within the biosensor microwell or well that is reactive to the biological material; and wherein the reference electrode cavity is located proximate to the biosensor microwell or well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:生物材料感測半導體裝置，生物敏感半導體裝置，感測器裝置，生物感測器，感測裝置，裝置</p>
        <p type="p">133A:微井底杯底表面，底表面，底面</p>
        <p type="p">133B:微井頂杯底延伸部/突起部，底表面</p>
        <p type="p">134:環繞側壁或表面，側壁</p>
        <p type="p">135:微井頂井杯側邊，環繞側壁或表面，側壁或表面，側邊</p>
        <p type="p">200:參考電極半導體結構，多邊形參考電極，浮動參考電極，參考電極</p>
        <p type="p">232:參考材料接收空腔，參考電極空腔，開放式空腔，空腔部分，空腔</p>
        <p type="p">235:表面，側邊</p>
        <p type="p">1001A:生物敏感半導體裝置</p>
        <p type="p">A-A:截面線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="653" publication-number="202633321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有排氣擋板的設備</chinese-title>
        <english-title>APPARATUS WITH EXHAUST BAFFLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁硯翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅翊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種設備。該設備包括一或多個腔室壁，其界定一處理腔室。該設備包括由一或多個入口埠壁界定的一氣體入口埠，其組配來將一處理氣體引導至該處理腔室中。設備包括由一或多個排氣埠壁界定的一排氣埠，處理氣體透過其從處理腔室移開。該設備包括一排氣擋板，其具有由一或多個排氣擋板壁界定的一卵形開口。一流動路徑穿過該卵形開口，當處理氣體從處理腔室移開時，處理氣體沿著該流動路徑流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus is provided. The apparatus includes one or more chamber walls defining a processing chamber. The apparatus includes a gas inlet port defined by one or more inlet port walls configured to conduct a process gas into the processing chamber. The apparatus includes an exhaust port defined by one or more exhaust port walls through which the process gas is removed from the processing chamber. The apparatus includes an exhaust baffle having an oval-shaped opening defined by one or more exhaust baffle walls. A flow path, along which the process gas flows as the process gas is removed from the processing chamber, passes through the oval-shaped opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">102:方向</p>
        <p type="p">104:直徑</p>
        <p type="p">106:第一氣體入口埠</p>
        <p type="p">107:第一氣體入口埠壁</p>
        <p type="p">108:第一半導體晶圓</p>
        <p type="p">110:第一晶圓支撐結構</p>
        <p type="p">116a:第一銷固持器</p>
        <p type="p">116b:第二銷固持器</p>
        <p type="p">116c:第三銷固持器</p>
        <p type="p">120:第一物件</p>
        <p type="p">122:第一台座基座</p>
        <p type="p">124:排氣埠</p>
        <p type="p">125:排氣埠壁</p>
        <p type="p">126:第一排氣擋板</p>
        <p type="p">132:第一處理腔室</p>
        <p type="p">140:第一卵形開口</p>
        <p type="p">151:第一周邊壁</p>
        <p type="p">153:第一頂板</p>
        <p type="p">155:第一底板</p>
        <p type="p">192:元件</p>
        <p type="p">194:元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="654" publication-number="202633091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260421B">H10B63/00</main-classification>
        <further-classification edition="202301120260421B">H10N70/00</further-classification>
        <further-classification edition="202301120260421B">H10N70/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊　學理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HARRY-HAKLAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鈺文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱文定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俠威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使一電阻式隨機存取記憶體(RRAM)胞元之操作速度不受底電極厚度支配的問題係藉由在該RRAM胞元上形成一層間介電質期間合併保護該底電極免於氧引發之損壞的一非氧化物介電層來解決。該非氧化物介電層可充當置位在環繞頂電極之一第一間隔件上的一第二間隔件。該第一間隔件可在底電極之側壁與頂電極之側壁之間提供一側向偏離。在該電阻式切換結構對源自底電極之氧侵入敏感之實施例中，該非氧化物介電層係特別有利的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The problem of making the operating speed of a resistive random access memory (RRAM) cell independent of bottom electrode thickness is solved by incorporating a non-oxide dielectric layer that protects the bottom electrode from oxygen-induced damage during the formation of an inter-layer dielectric over the RRAM cell. The non-oxide dielectric layer may serve as a second spacer positioned over a first spacer that surrounds the top electrode. The first spacer may provide a lateral offset between the sidewall of the bottom electrode and the sidewall of the top electrode. The non-oxide dielectric layer is particularly beneficial in embodiments where the resistive switching structure is sensitive to oxygen encroachment originating from the bottom electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路裝置</p>
        <p type="p">101,133:擴散阻障層</p>
        <p type="p">103,135:傳導跡線</p>
        <p type="p">105:通孔</p>
        <p type="p">107:層間介電質</p>
        <p type="p">109,127:介面層</p>
        <p type="p">111:非氧化物介電層</p>
        <p type="p">113:硬遮罩</p>
        <p type="p">115:頂電極金屬層，頂電極</p>
        <p type="p">117:側壁間隔件</p>
        <p type="p">119:覆蓋結構</p>
        <p type="p">121:電阻式切換結構</p>
        <p type="p">122,139,140:側壁</p>
        <p type="p">123:底電極金屬層</p>
        <p type="p">125:阻障層</p>
        <p type="p">129:下層間介電質，層間介電質</p>
        <p type="p">131:底電極</p>
        <p type="p">137:頂電極</p>
        <p type="p">138:垂直軸線</p>
        <p type="p">141:轉角</p>
        <p type="p">143:電阻式隨機存取記憶體胞元，RRAM胞元</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;,θ&lt;sub&gt;2&lt;/sub&gt;,θ&lt;sub&gt;3&lt;/sub&gt;:角度</p>
        <p type="p">M&lt;sub&gt;X&lt;/sub&gt;:第一金屬化層</p>
        <p type="p">M&lt;sub&gt;X+1&lt;/sub&gt;:第二金屬化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="655" publication-number="202633150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10D84/83</main-classification>
        <further-classification edition="202501120260422B">H10D30/00</further-classification>
        <further-classification edition="202501120260422B">H10D30/01</further-classification>
        <further-classification edition="202501120260422B">H10D30/43</further-classification>
        <further-classification edition="202501120260422B">H10D62/10</further-classification>
        <further-classification edition="202501120260422B">H10D62/13</further-classification>
        <further-classification edition="202501120260422B">H10D64/01</further-classification>
        <further-classification edition="202601120260422B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温孟潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, MENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何彩蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, TSAI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之實施例提供一種包括一源極/汲極觸點與一閘極結構之間的一空氣間隔物的半導體裝置及形成該半導體裝置的方法。該形成該空氣間隔物包括：在一暴露之源極/汲極表面上形成一蝕刻終止層，在該蝕刻終止層上形成一犧牲層，沈積一隔離層於該矽層上，在該蝕刻終止層保護該源極/汲極區同時對該犧牲層執行一各向異性蝕刻以形成該空氣間隔物，及藉由在該閘極結構上方佈植一層間介電層質來密封該空氣間隔物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a semiconductor device including an air spacer between a source/drain contact and a gate structure and the method of forming the same. The formation of the air spacer includes forming an etch stop layer on an exposed source/drain surface, forming a sacrificial layer on the etch stop layer, depositing an isolation layer on the silicon layer, performing an anisotropic etching on the sacrificial layer while the etch stop layer protects the source/drain region to form the air spacer, and sealing the air spacer by implanting an interlayer dielectric layer above the gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體裝置</p>
        <p type="p">204a:p型摻雜區或p型井</p>
        <p type="p">208a:第二半導體層</p>
        <p type="p">216a:內部層</p>
        <p type="p">216b:外部層</p>
        <p type="p">232:內部間隔物</p>
        <p type="p">238:磊晶源極/汲極區</p>
        <p type="p">238t:頂表面</p>
        <p type="p">244:閘極介電層</p>
        <p type="p">246:閘極電極層</p>
        <p type="p">254:蝕刻終止層(ESL)</p>
        <p type="p">256:層間介電質(ILD)層</p>
        <p type="p">256t:頂表面</p>
        <p type="p">260yz:側壁</p>
        <p type="p">264:蝕刻終止層</p>
        <p type="p">268:觸點隔離層</p>
        <p type="p">270:矽化物層</p>
        <p type="p">272:觸點阻障層</p>
        <p type="p">274:源極/汲極觸點特徵</p>
        <p type="p">276:空氣間隔物</p>
        <p type="p">278:覆蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="656" publication-number="202632413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件之製造方法</chinese-title>
        <english-title>METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260421B">G03F1/24</main-classification>
        <further-classification edition="200601120260421B">G03F7/00</further-classification>
        <further-classification edition="201701120260421B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡上傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHANG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張漢龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亦鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體元件的方法，包含：調節極紫外光光罩的反射表面、擷取調節後反射表面的影像、使用光罩執行微影製程、在微影製程之後擷取反射表面的另一影像以及比較反射表面的影像。一種極紫外光微影系統，包含：調節單元、檢查工具、極紫外光曝光裝置以及計算系統編程以控制調節單元、檢查工具以及極紫外光曝光裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes conditioning a reflective surface of an extreme ultraviolet (EUV) mask, capturing an image of the conditioned reflective surface, performing a photolithography process using the mask, capturing another image of the reflective surface after the photolithography process, and comparing the images of the reflective surface. A system for EUV photolithography includes a conditioning unit, an inspection tool, an EUV exposure device, and a computing system programmed to control the conditioning unit, the inspection tool, and the EUV exposure device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2001,2002,2003,2004,2005,2006,2007:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="657" publication-number="202633250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用量子自旋孔效應的自旋電流方程以及利用其的量子元器件</chinese-title>
        <english-title>SPIN CURRENT EQUATION USING QUANTUM SPIN HALL EFFECT AND QUANTUM DEVICE USING IT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260225B">H10N50/20</main-classification>
        <further-classification edition="202301120260225B">H10N52/01</further-classification>
        <further-classification edition="202301120260225B">H10N50/01</further-classification>
        <further-classification edition="202501120260225B">H10D30/40</further-classification>
        <further-classification edition="202201120260225B">G06N10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商拓撲的諾貝爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TINOBEL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳代萊莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, TERESA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種利用量子自旋孔效應的自旋電流方程以及利用其的量子元器件，其包括：&lt;br/&gt;  基板100；&lt;br/&gt;  配置在所述基板100上的非晶SiOC薄膜200；&lt;br/&gt;  配置在所述非晶SiOC薄膜200上的源極301；&lt;br/&gt;  配置在所述非晶SiOC薄膜200上的漏極302；以及&lt;br/&gt;  配置在所述基板100下部的柵極303。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="658" publication-number="202633124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D30/62</main-classification>
        <further-classification edition="202501120260427B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王貽泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔暉軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, HUI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳榮佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUNG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的一些實施例揭示一種半導體結構，包括位於基板中的源極區及汲極區；設置於基板中的第一通道區之上且位於源極區與汲極區之間的第一閘極結構，其中第一閘極結構包括設置於第一通道區之上的第一閘極介電質及設置於第一閘極介電質之上的第一閘極電極；及設置於基板中的第二通道區之上且位於第一閘極結構與汲極區之間的第二閘極結構，其中第一閘極結構設置得更靠近源極區，第二閘極結構設置得更靠近汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is disclosed that includes: a source region and a drain region in a substrate; a first gate structure disposed above a first channel region in the substrate and between the source region and the drain region wherein the first gate structure includes a first gate dielectric disposed above the first channel region and a first gate electrode disposed above the first gate dielectric; and a second gate structure disposed above a second channel region in the substrate and between the first gate structure and the drain region, wherein the first gate structure is disposed closer to the source region and the second gate structure is disposed closer to the drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:高電壓裝置</p>
        <p type="p">104:源極區</p>
        <p type="p">106:汲極區</p>
        <p type="p">108:鰭片</p>
        <p type="p">110:控制閘極</p>
        <p type="p">112:調變閘極</p>
        <p type="p">114:源極端子</p>
        <p type="p">116:汲極端子</p>
        <p type="p">118:控制閘極端子</p>
        <p type="p">120:調變閘極端子</p>
        <p type="p">132:淺溝槽隔離特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="659" publication-number="202633060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計算裝置</chinese-title>
        <english-title>COMPUTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250522B">H05K7/20</main-classification>
        <further-classification edition="200601120250522B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSORNG, YAW-TZORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭進和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高偉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防回流裝置，用於防止氣體從一或多個風扇模組回流，防回流裝置包含第一壁、第二壁以及擋板。第二壁相對且大致平行於第一壁，使得開口界定於第一壁與第二壁之間。擋板定位於第一壁與第二壁之間界定的開口內，並可移動以調整開口的尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-reflow device for preventing air reflow from one or more fan modules includes a first wall, a second wall, and a screen. The second wall is positioned opposite and generally parallel to the first wall such that an opening is defined between the first wall and the second wall. The screen is positioned within the opening defined between the first wall and the second wall and is movable to adjust a size of the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防回流裝置</p>
        <p type="p">101:開口</p>
        <p type="p">102:第一壁</p>
        <p type="p">103A,109A:第一端</p>
        <p type="p">103B,109B:第二端</p>
        <p type="p">104,110:齒</p>
        <p type="p">106,112:開槽</p>
        <p type="p">108:第二壁</p>
        <p type="p">114:頂板</p>
        <p type="p">116:底板</p>
        <p type="p">118A,118B:突出部</p>
        <p type="p">120:擋板</p>
        <p type="p">130:第一擋板件</p>
        <p type="p">140:第二擋板件</p>
        <p type="p">150:第三擋板件</p>
        <p type="p">152A,152B:銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="660" publication-number="202631106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、基材、芳香療法產品及菸草產品</chinese-title>
        <english-title>COMPOSITION, SUBSTRATE, AROMATHERAPY PRODUCT, AND TOBACCO PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">A61K8/24</main-classification>
        <further-classification edition="200601120260428B">A61K8/36</further-classification>
        <further-classification edition="200601120260428B">A61K8/365</further-classification>
        <further-classification edition="200601120260428B">A61K8/60</further-classification>
        <further-classification edition="200601120260428B">A61K8/67</further-classification>
        <further-classification edition="200601120260428B">A61L9/01</further-classification>
        <further-classification edition="200601120260428B">A61L9/02</further-classification>
        <further-classification edition="200601120260428B">A61Q13/00</further-classification>
        <further-classification edition="200601120260428B">C11B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋基将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, MOTOMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物、基材、芳香療法產品及菸草產品，其包含香料配糖體及相對於上述香料配糖體的總量為0.1質量%以上的弱鹼性化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="661" publication-number="202633104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構和其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D30/01</main-classification>
        <further-classification edition="202501120260424B">H10D30/62</further-classification>
        <further-classification edition="202601120260424B">H10P95/90</further-classification>
        <further-classification edition="202601120260424B">H10P50/00</further-classification>
        <further-classification edition="202601120260424B">H10W10/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宜偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, I-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古淑瑗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, SHU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RYAN CHIA-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的一些實施例的一種方法包括以下步驟：提供基板包括第一極性類型的複數個第一鰭片、第二極性類型的複數個第二鰭片及延伸於第一鰭片和第二鰭片中的各者上方的連續閘極結構；及藉由共同蝕刻操作形成連續閘極結構中的第一開口和第二開口，第一開口包括第一極性類型的第一對鰭片之間的第一切口，第二開口包括第二極性類型的第二對鰭片之間的第二切口，其中執行共同蝕刻操作包括形成具有第一中間臨界尺寸的第一開口和具有第二中間臨界尺寸的第二開口，第一中間臨界尺寸大於第二中間臨界尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes: providing a substrate containing a first plurality of fins of a first polarity type, a second plurality of fins of a second polarity type, and a contiguous gate structure that extends over each of the first plurality of fins and second plurality of fins; and forming a first opening in the contiguous gate structure with a first cut between the first pair of fins of the first polarity type and a second opening in the contiguous gate structure with a second cut between the second pair of fins of the second polarity type via common etching operations; wherein performing the common etching operations includes forming the first opening with a first middle critical dimension (MCD) and the second opening with a second MCD, wherein the first MCD is larger than the second MCD.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102N,102P:鰭片</p>
        <p type="p">104:多晶矽閘極結構</p>
        <p type="p">106N,106P:隔離切口</p>
        <p type="p">110,112:中間臨界尺寸</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="662" publication-number="202631871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造半導體裝置的方法及用於塗佈圖案化光阻的組成物</chinese-title>
        <english-title>METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND COMPOSITIONS FOR COATING PATTERNED PHOTORESIST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L33/10</main-classification>
        <further-classification edition="200601120260302B">C08L67/04</further-classification>
        <further-classification edition="200601120260302B">C09D133/10</further-classification>
        <further-classification edition="200601120260302B">C09D167/04</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏嘉林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張莉琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LILIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雅如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YAHRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體裝置的方法包括沉積塗佈組成物在光阻層的圖案化表面上並固化圖案化光阻層的塗佈組成物。塗佈組成物包括嵌段共聚物，嵌段共聚物包括第一部分與第二部分，第一部分配置以與圖案化光阻層的圖案化表面化學鍵結，且第二部分包括液晶原基團。液晶原基團配置以在固化塗佈組成物後表現出液晶特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes depositing a coating composition on a patterned surface of a photoresist layer and curing the coating composition on the patterned photoresist layer. The coating composition includes a block copolymer including a first moiety configured to chemically bond with the patterned surface of the patterned photoresist layer and a second moiety including a mesogenic structure. The mesogenic structure is configured to exhibit liquid crystal properties upon curing the coating composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:光阻層</p>
        <p type="p">17:酯基</p>
        <p type="p">19:光阻反應單元</p>
        <p type="p">21:液晶單元</p>
        <p type="p">23、25:區域</p>
        <p type="p">72:嵌段共聚物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="663" publication-number="202633151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10D84/83</main-classification>
        <further-classification edition="202601120260422B">H10D84/01</further-classification>
        <further-classification edition="202501120260422B">H10D30/62</further-classification>
        <further-classification edition="202501120260422B">H10D62/10</further-classification>
        <further-classification edition="202501120260422B">H10D64/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之實施例提供半導體裝置及形成該些半導體裝置的方法。本揭露之一種例示性半導體裝置包括：一第一通道區，其設置於一半導體基板上方；一閘極結構，其設置於該第一通道區上方；一第一源極/汲極區，其設置於該第一通道區的一第一側處；一第二源極/汲極區，其設置於該第一通道區的一第二側處；一層間介電層，其設置於該第一通道區、該第一源極/汲極區及該第二源極/汲極區上方；一第一觸點，其設置於該層間介電層中且電耦接至該第一源極/汲極區；及一第二觸點，其設置於該半導體基板中且電耦接至該第二源極/汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide semiconductor devices and methods of forming the same. An exemplary semiconductor device of the present disclosure includes a first channel region disposed over a semiconductor substrate; a gate structure disposed over the first channel region; a first source/drain region disposed at a first side of the first channel region; a second source/drain region disposed at a second side of the first channel region; an interlayer dielectric layer disposed over the first channel region, the first source/drain region, and the second source/drain region; a first contact disposed in the interlayer dielectric layer and electrically coupled to the first source/drain region; and a second contact disposed in the semiconductor substrate and electrically coupled to the second source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:基板</p>
        <p type="p">110:第一奈米結構</p>
        <p type="p">138:閘極間隔物</p>
        <p type="p">150:內部間隔物</p>
        <p type="p">154:介電層</p>
        <p type="p">158:源極/汲極區</p>
        <p type="p">162:第一介電(ILD)層</p>
        <p type="p">172:閘極結構</p>
        <p type="p">174:第二介電(ILD)層</p>
        <p type="p">176:觸點蝕刻終止層(CESL)</p>
        <p type="p">178:觸點</p>
        <p type="p">182:矽化物區</p>
        <p type="p">183:前側互連結構</p>
        <p type="p">184:導電特徵</p>
        <p type="p">186:介電層</p>
        <p type="p">188:載體基板</p>
        <p type="p">190:接合層</p>
        <p type="p">192:背側觸點</p>
        <p type="p">194:矽化物區</p>
        <p type="p">195:背側互連結構</p>
        <p type="p">196:導電特徵</p>
        <p type="p">198:介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="664" publication-number="202633105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D30/01</main-classification>
        <further-classification edition="202501120260424B">H10D30/62</further-classification>
        <further-classification edition="202601120260424B">H10W10/17</further-classification>
        <further-classification edition="202601120260424B">H10P95/90</further-classification>
        <further-classification edition="202601120260424B">H10P50/00</further-classification>
        <further-classification edition="201101120260424B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體元件和用於製造這種元件的方法。方法包含在半導體材料上方形成複數個奈米片通道層；在每個奈米片通道層上形成保護襯墊；由該些奈米片通道層和半導體材料的一部分形成複數個鰭結構；在半導體材料上方形成犧牲閘極；當該些保護襯墊位於該些奈米片通道層上時執行熱退火製程；去除所選鰭結構的至少一部分及位於所選鰭結構的部分上方的犧牲閘極的覆蓋部分以形成一溝槽；在溝槽中形成絕緣結構；去除犧牲閘極的剩餘部分以形成閘極腔，其中閘極腔部分地由絕緣結構的端壁界定；從奈米片通道層去除保護襯墊；以及在閘極腔中形成金屬閘極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are semiconductor devices and methods for fabricating such devices. A method includes forming nanosheet channel layers over a semiconductor material; forming a protective liner on each of the nanosheet channel layers; forming fin structures from the nanosheet channel layers and from a portion of the semiconductor material; forming a sacrificial gate over the semiconductor material; performing a thermal anneal process while the protective liners are located on the nanosheet channel layers; removing a portion of a selected fin structure and an overlying portion of the sacrificial gate located over the portion of the selected fin structure to form a trench; forming an insulation structure in the trench; removing a remaining portion of the sacrificial gate to form a gate cavity partially defined by an end wall of the insulation structure; removing the protective liners from the nanosheet channel layers; and forming a metal gate in the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">15:奈米片通道層(奈米片層)</p>
        <p type="p">100:元件</p>
        <p type="p">320:空洞</p>
        <p type="p">350:源極/汲極特徵</p>
        <p type="p">X:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="665" publication-number="202633072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250508B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHIH MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種半導體結構。半導體結構包括位於基板上方的電容器、位於電容器上方的導電單元、位於導電單元上方的垂直電晶體、環繞垂直電晶體的下部的第一氧化層、環繞垂直電晶體的中部的第一導電層、及環繞垂直電晶體的上部的第二氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide a semiconductor structure. The semiconductor structure includes a capacitor over a substrate, a conductive cell on the capacitor, a vertical transistor on the conductive cell, a first oxide layer surrounding a lower portion of the vertical transistor, a first conductive layer surrounding a middle portion of the vertical transistor, and a second oxide layer surrounding an upper portion of the vertical transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">104:主動裝置層</p>
        <p type="p">110:第一絕緣層</p>
        <p type="p">120:第二絕緣層</p>
        <p type="p">132:底部電容器板</p>
        <p type="p">134:電容器氧化物層</p>
        <p type="p">136:電容器介電層</p>
        <p type="p">138:頂部電容器板</p>
        <p type="p">142:氧化物層</p>
        <p type="p">152P:第一犧牲柱</p>
        <p type="p">162:第一導電層</p>
        <p type="p">CC:導電單元</p>
        <p type="p">CP:電容器</p>
        <p type="p">PH2:高度</p>
        <p type="p">SP1:第一間隔件/第二氧化物層</p>
        <p type="p">SP2:第二間隔件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="666" publication-number="202632440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平坦化半導體晶圓基板的層的方法和用於平坦化相關半導體晶圓基板的平坦化工具以及平坦化相關半導體晶圓基板的頂層的方法</chinese-title>
        <english-title>A METHOD FOR PLANARIZING A LAYER OF A SEMICONDUCTOR WAFER SUBSTRATE, A PLANARIZATION TOOL FOR PLANARIZING AN ASSOCIATED SEMICONDUCTING WAFER SUBSTRATE AND A METHOD FOR PLANARIZING A TOP LAYER OF A SEMICONDUCTING WAFER SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/22</main-classification>
        <further-classification edition="202601120260302B">H10P14/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宣瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSUAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧宇倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, YU-LUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於平坦化半導體晶圓基板的層的方法、系統和工具。測量在層上的場域的表面形貌，其中場域的表面積遠小於基板的表面積。接著確定用於獲得平坦或平面表面的沉積圖案。使用沉積圖案將可固化材料沉積在場域上。用場域尺寸覆板壓印可固化材料以形成平坦或平面表面。固化可固化材料，例如透過使用輻射源。將場域尺寸覆板從固化材料上提起以獲得平坦化層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and tools for planarizing a layer of a semiconducting wafer substrate are disclosed. The topography of a field on the layer is measured, wherein the field has a surface area that is much smaller than the surface area of the substrate. A deposition pattern for obtaining a flat or planar surface is then determined. A curable material is deposited upon the field using the deposition pattern. The curable material is then imprinted with a field-sized superstrate to create a flat or planar surface. The curable material is then cured, for example by using a radiation source. The field-sized superstrate is then lifted off the cured material to obtain the planarized layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:材料層</p>
        <p type="p">160:固化材料層</p>
        <p type="p">200:覆板</p>
        <p type="p">240:輻射源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="667" publication-number="202633458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/05</main-classification>
        <further-classification edition="202601120260427B">H10W70/62</further-classification>
        <further-classification edition="202601120260427B">H10W10/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置結構可藉由以下步驟形成。形成第一含銅金屬互連結構在第一介電材料層內。形成第二介電材料層在第一含銅金屬互連結構與第一介電材料層的上方。形成空腔穿過第二介電材料層，使得第一含銅金屬互連結構的表面片段暴露在空腔之下。將第一含銅金屬互連結構的表面部分轉變為銅基隧道阻障層。形成第二含銅金屬互連結構在銅基隧道阻障層上的空腔內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device structure may be manufactured by forming a first copper-containing metal interconnect structure embedded in a first dielectric material layer; forming a second dielectric material layer over the first copper-containing metal interconnect structure and the first dielectric material layer; forming a cavity through the second dielectric material layer such that a surface segment of the first copper-containing metal interconnect structure is exposed underneath the cavity; converting a surface portion of the first copper-containing metal interconnect structure into a copper-based tunneling barrier layer; and forming a second copper-containing metal interconnect structure in the cavity on the copper-based tunneling barrier layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">309:半導體基板</p>
        <p type="p">312:淺溝槽隔離結構</p>
        <p type="p">320:半導體裝置</p>
        <p type="p">330:互連級介電材料層</p>
        <p type="p">340:金屬互連結構</p>
        <p type="p">344:邊緣密封環結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="668" publication-number="202633508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體晶粒的封裝體、結構、與方法</chinese-title>
        <english-title>PACKAGE FOR SEMICONDUCTOR DIE, STRUCTURE, AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W74/40</main-classification>
        <further-classification edition="202601120260428B">H10W72/50</further-classification>
        <further-classification edition="202601120260428B">H10W74/01</further-classification>
        <further-classification edition="202601120260428B">H10W72/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANGBIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置可包括一基材。一種裝置可包括該封裝體的一金屬部分，其係耦接至該基材，該金屬部分係設置以作為與該半導體晶粒的一電性連接。一種裝置可包括一晶粒區域，其係位在該基材上。一種裝置可包括一障壁，其包圍該晶粒區域的至少一部分。一種裝置可包括一可撓性材料，其位在該晶粒區域與該障壁之間。一種裝置可包括一封裝材料，其包圍該基材及該封裝體的該金屬部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device may include a substrate. A device may include a metal portion of the package coupled to the substrate, the metal portion configured to function as an electrical connection from the semiconductor die. A device may include a dies area on the substrate. A device may include a barrier surrounding at least a portion of the die area. A device may include a flexible material disposed between the die area and the barrier. A device may include an encapsulant surrounding the substrate and the metal portion of the package.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率模組</p>
        <p type="p">102:晶片總成/晶粒</p>
        <p type="p">104:晶粒附接墊</p>
        <p type="p">106:塗層</p>
        <p type="p">108:通道</p>
        <p type="p">110:定錨總成</p>
        <p type="p">112:障壁</p>
        <p type="p">200:導線架</p>
        <p type="p">g:間隙</p>
        <p type="p">H1:塗層高度</p>
        <p type="p">H2:障壁高度</p>
        <p type="p">H3:通道深度</p>
        <p type="p">wb:障壁寬度</p>
        <p type="p">W1:塗層寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="669" publication-number="202631277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓延生產線的自動化指數提示系統</chinese-title>
        <english-title>AUTOMATION INDEX PRESENTATION SYSTEM FOR ROLLING LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B21B37/00</main-classification>
        <further-classification edition="200601120260302B">G05B23/02</further-classification>
        <further-classification edition="202301120260302B">G06Q10/0639</further-classification>
        <further-classification edition="202601120260302B">G06T11/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙樂樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化指數提示系統，係提示成為壓延生產線的操作自動化率的指標的自動化指數，該自動化指數提示系統係具備處理手動介入的實績資料的資料處理裝置。資料處理裝置係取得依每個製品分類而預先制定的介入操作基準時間，依每個製品分類計算顯示介入操作時間相對於介入操作基準時間之偏差率的偏差係數，依每個製品分類且依每個介入操作模式累算偏差係數，將每個製品分類且每個介入操作模式的偏差係數的累算值除以介入次數，藉此依每個製品分類且依每個介入操作模式分別計算第一自動化指數。資料處理裝置係取得依每個介入操作模式而預先制定的加權係數，將每個製品分類且每個介入操作模式的加權係數與第一自動化指數的乘算值進行累算，藉此依每個製品分類計算第二自動化指數，並將第一自動化指數及第二自動化指數顯示於顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automation index presentation system that presents an automation index indicative which is an index of operation automation rate of rolling line operations, includes a data processing device that processes actual performance data of manual intervention. The data processing device acquires a predetermined intervention operation reference time for each product category; calculates a deviation coefficient representing a deviation rate of an intervention operation time from the intervention operation reference time for each product category; integrates the deviation coefficient for each product category and each intervention operation pattern; and calculates a first automation index for each product category and each intervention operation pattern by dividing the integrated value of the deviation coefficient for each product category and each intervention operation pattern by the number of interventions. The data processing device acquires a predetermined weighting coefficient for each intervention operation pattern; calculates a second automation index for each product category by integrating the multiplied values of the weighting coefficient and the first automation index for each product category and intervention operation pattern; and displays the first automation index and the second automation index on a display device.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="670" publication-number="202633152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260325B">H10D84/83</main-classification>
        <further-classification edition="202601120260325B">H10D84/01</further-classification>
        <further-classification edition="202501120260325B">H10D62/60</further-classification>
        <further-classification edition="201101120260325B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, AMANDA AMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙皇麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, HUANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斌彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PINYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置及其形成方法。例示性方法包括：在基板上方形成複數個奈米結構；形成耦合至此些奈米結構中的最底部奈米結構的第一源極/汲極特徵；形成耦合至此些奈米結構中的最頂部奈米結構的第二源極/汲極特徵；形成環繞最底部奈米結構的第一閘極結構；及形成環繞最頂部奈米結構的第二閘極結構，其中第二閘極結構包含含鋁的n型功函數層，第一閘極結構包含第一p型功函數層、第二p型功函數層及設置在第一p型功函數層與第二p型功函數層之間的擴散阻障層，其中第一p型功函數層的鋁濃度小於第二p型功函數層的鋁濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a plurality of nanostructures over a substrate, forming a first source/drain feature coupled to a bottommost nanostructure of the plurality of nanostructures, forming a second source/drain feature coupled to a topmost nanostructure of the plurality of nanostructures, forming a first gate structure wrapping around the bottommost nanostructure, and forming a second gate structure wrapping around the topmost nanostructure, where the second gate structure comprises an aluminum-containing n-type work function layer, the first gate structure comprises a first p-type work function layer, a second p-type work function layer, and a diffusion barrier layer disposed between the first p-type work function layer and the second p-type work function layer, wherein an aluminum concentration of the first p-type work function layer is less than an aluminum concentration of the second p-type work function layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:中間結構/半導體裝置</p>
        <p type="p">202t:突起/臺面/基鰭</p>
        <p type="p">212:隔離特徵</p>
        <p type="p">226M:中間介電層</p>
        <p type="p">254a:底部閘極介電層/閘極介電層</p>
        <p type="p">254B:底部閘極結構</p>
        <p type="p">254b:頂部閘極介電層/閘極介電層</p>
        <p type="p">254c:底部閘電極</p>
        <p type="p">254d:頂部閘電極</p>
        <p type="p">254e:金屬填充物</p>
        <p type="p">254m:擴散阻障層</p>
        <p type="p">254T:頂部閘極結構</p>
        <p type="p">254WFN:n型功函數結構</p>
        <p type="p">254WFP:p型功函數結構</p>
        <p type="p">2080L1、2080L2:底部通道構件/環繞通道構件</p>
        <p type="p">2080N1、2080N2:奈米結構</p>
        <p type="p">2080U1、2080U2:頂部通道構件/環繞通道構件</p>
        <p type="p">2541:第一p型功函數層</p>
        <p type="p">2542:第二p型功函數層</p>
        <p type="p">X、Y、Z:方向</p>
        <p type="p">IL+HK:高K介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="671" publication-number="202631309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>執行化學機械研磨的方法</chinese-title>
        <english-title>METHOD FOR PERFORMING CHEMICAL MECHANICAL POLISHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260422B">B24B37/04</main-classification>
        <further-classification edition="201201120260422B">B24B37/32</further-classification>
        <further-classification edition="200601120260422B">B24B57/00</further-classification>
        <further-classification edition="202601120260422B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白睿宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, JUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張棠貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TANG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勛豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種用於研磨基板的方法及設備，包括原位預先加熱研磨漿料。具體地，研磨漿料藉由附接至保持環的加熱元件或藉由相對於經處理的基板旋轉保持環來預先加熱。在研磨墊上預先加熱漿料藉由防止基板的邊緣由新鮮漿料無意中冷卻來提高基板上的研磨均勻性。本揭露的實施例進一步包括具有錐形漿料通道的保持環，這會減少保持環磨損時流動面積的減小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a method and apparatus for polishing a substrate including pre-heating the polishing slurry in-situ. Particularly, the polishing slurry is preheated by a heating element attached to the retaining ring or by rotating the retaining ring relative to the substrate being processed. Pre-heating the slurry on the polishing pad improves polishing uniformity across the substrate by preventing the edge of the substrate being inadvertently cooled by the fresh slurry. Embodiments of the present disclosure further include a retaining ring with a tapered slurry channel, which reduces the decrease of flow area as the retaining ring worn down.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:CMP工具</p>
        <p type="p">102:載體頭</p>
        <p type="p">104:基板</p>
        <p type="p">106:研磨墊</p>
        <p type="p">106a:研磨表面</p>
        <p type="p">114:保持環</p>
        <p type="p">130:台板</p>
        <p type="p">140:加熱元件</p>
        <p type="p">142:漿料通道</p>
        <p type="p">150:漿料分配器</p>
        <p type="p">152:漿料</p>
        <p type="p">160:控制器</p>
        <p type="p">162:溫度感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="672" publication-number="202632386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對比評價方法、眼鏡鏡片的設計方法及對比評價裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G02C13/00</main-classification>
        <further-classification edition="200601120260424B">G02C7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康依視路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON-ESSILOR CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙成鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的眼鏡鏡片的對比評價方法具有：獲取基於眼鏡鏡片的處方製成的眼球模型以及表示由雙眼視覺識別出的對比的對比雙眼相加模型；獲取以眼球模型的左眼的角膜頂點與右眼的角膜頂點的中心點為基準的三維空間內所設定的多個指標點的座標資訊；基於眼球模型以及指標點的座標資訊，並藉由自指標點經由眼鏡鏡片到達眼球模型的視網膜的光線追蹤，針對每個指標點算出左眼對比值及右眼對比值；以及基於所算出的左眼對比值及右眼對比值與對比雙眼相加模型，算出針對每個指標點的雙眼相加對比值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼鏡鏡片製造系統</p>
        <p type="p">10:眼鏡鏡片評價裝置</p>
        <p type="p">20:儲存裝置</p>
        <p type="p">30:加工機控制裝置</p>
        <p type="p">40:眼鏡鏡片加工機</p>
        <p type="p">100:運算部</p>
        <p type="p">110:眼鏡鏡片設計部</p>
        <p type="p">120:對比評價部</p>
        <p type="p">121:模型獲取部</p>
        <p type="p">122:座標資訊獲取部</p>
        <p type="p">123:單眼對比值算出部</p>
        <p type="p">124:雙眼相加對比值算出部</p>
        <p type="p">130:輸入部</p>
        <p type="p">140:顯示部</p>
        <p type="p">150:儲存部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="673" publication-number="202633136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250902B">H10D64/01</main-classification>
        <further-classification edition="202501120250902B">H10D64/27</further-classification>
        <further-classification edition="202501120250902B">H10D62/17</further-classification>
        <further-classification edition="202501120250902B">H10D84/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉德夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TEFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪若珺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例揭露一種半導體裝置及其製造方法。該方法包括在鰭部或片狀基部上形成第一組奈米結構化通道層及第二組奈米結構化通道層，形成環繞第一組及第二組奈米結構化通道層的閘極開口，在第一組及第二組奈米結構化通道層及閘極開口的鰭部或片狀基部的暴露表面上形成氧化層，在閘極開口上形成高k介電層，在第一組奈米結構化通道層的閘極開口中形成虛擬層，在閘極開口中沉積功函數層，自環繞第一組奈米結構化通道層的閘極開口中去除功函數層及虛擬層，及在閘極開口中沉積閘極金屬填充層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of a semiconductor device and a method of fabricating the semiconductor device are disclosed. The method includes forming a first set of nanostructured channel layers and a second set of nanostructured channel layers on a fin or sheet base, forming gate openings surrounding the first and second sets of nanostructured channel layers, forming oxide layers on exposed surfaces of the first and second sets of nanostructured channel layers and the fin or sheet base in the gate openings, forming a high-k dielectric layer on in the gate openings, forming a dummy layer in gate openings of the first set of nanostructured channel layers, depositing a work function layer in the gate openings, removing the work function layer and dummy layer from gate openings surrounding the first set of nanostructured channel layers, and depositing a gate metal fill layer in the gate openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">104:基板</p>
        <p type="p">106N,106P:鰭部/片狀基部/鰭基部</p>
        <p type="p">116:STI區/隔離區</p>
        <p type="p">120N,120P:奈米結構化通道層</p>
        <p type="p">124N,124P:IL層/界面層</p>
        <p type="p">126N,126P:介電層</p>
        <p type="p">128P:WFM層</p>
        <p type="p">1206N:氣隙</p>
        <p type="p">1604N:虛擬層</p>
        <p type="p">1702N,1702P:閘極開口</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="674" publication-number="202632478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑鼠</chinese-title>
        <english-title>MOUSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250901B">G06F3/0354</main-classification>
        <further-classification edition="201301120250901B">G06F3/033</further-classification>
        <further-classification edition="200601120250901B">H01H13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXIN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧賀隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HO-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅若男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JO-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江三慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, SAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉奕辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種滑鼠，包含外殼、輔助按鍵、開關模組及底座。輔助按鍵設置於外殼，輔助按鍵的內側具有按壓結構。開關模組包含支撐結構、調整組件、底板及微動開關。支撐結構設置於外殼的內側。調整組件包含操作件，操作件可活動地與支撐結構連接。底板與支撐結構連接。微動開關設置於底板，微動開關的開關件面向按壓結構設置。操作件能被操作，以相對於支撐結構活動，並連動底板，而改變開關件與按壓結構之間的間距。底座設置有主電路板、移動偵測模組及處理器，微動開關能通過軟性排線或電線與處理器電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a mouse comprising a housing, an auxiliary button, a switch module, and a base. The auxiliary button is disposed on the housing, and a pressing structure is formed on the inner side of the auxiliary button. The switch module comprises a support structure, an adjustment assembly, a base plate, and a micro switch. The support structure is disposed on the inner side of the housing. The adjustment assembly comprise an operating member, which is movably connected to the support structure. The base plate is connected to the support structure. The micro switch is disposed on the base plate, with its switch member arranged to face the pressing structure. The operating member is operable to move relative to the support structure and drive the base plate correspondingly, thereby changing the distance between the switch member and the pressing structure. The base is provided with a main circuit board, a movement detection module, and a processor, wherein the micro switch is electrically connected to the processor via a flexible flat cable or an electric wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:外殼</p>
        <p type="p">A3:輔助按鍵</p>
        <p type="p">A31:按壓結構</p>
        <p type="p">100:開關模組</p>
        <p type="p">1:支撐結構</p>
        <p type="p">11:支撐臂</p>
        <p type="p">111:鎖孔</p>
        <p type="p">2:調整組件</p>
        <p type="p">21:操作件</p>
        <p type="p">3:底板</p>
        <p type="p">31:本體</p>
        <p type="p">32:彈性板體</p>
        <p type="p">4:微動開關</p>
        <p type="p">41:開關件</p>
        <p type="p">G:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="675" publication-number="202633176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10D84/85</main-classification>
        <further-classification edition="202501120260428B">H10D30/00</further-classification>
        <further-classification edition="202501120260428B">H10D30/01</further-classification>
        <further-classification edition="202501120260428B">H10D30/43</further-classification>
        <further-classification edition="202501120260428B">H10D62/10</further-classification>
        <further-classification edition="202501120260428B">H10D62/13</further-classification>
        <further-classification edition="202501120260428B">H10D64/01</further-classification>
        <further-classification edition="202501120260428B">H10D64/23</further-classification>
        <further-classification edition="202601120260428B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何士融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SHIH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIN YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RUI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由以下步驟在互補場效電晶體裝置中形成源極/汲極(S/D)接觸栓塞：形成延伸穿過上部S/D區、穿過插入在上部與下部S/D區之間的介電栓塞、並進入下部S/D區中的S/D開口，接著用導電材料填充S/D開口。介電栓塞由接觸蝕刻終止層(CESL)圍繞。CESL確保對S/D開口的預清洗製程僅移除由CESL界定的區域內沉積的介電材料，從而限制S/D開口中的加寬量。這有助於防止在S/D開口之加寬部分中形成空隙(如，空間)，從而降低S/D接觸栓塞之電阻，並防止S/D接觸栓塞與相鄰導電特徵之間的電短路或洩漏電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A source/drain (S/D) contact plug is formed in a complementary FET (CFET) device by: forming an S/D opening that extends through the upper S/D region, through a dielectric plug interposed between the upper and lower S/D regions, and into the lower S/D region, then filling the S/D opening with an electrically conductive material. The dielectric plug is surrounded by a contact etch stop layer (CESL). The CESL ensures that a pre-cleaning process for the S/D opening only removes dielectric material(s) disposed within an area defined by the CESL, thereby limiting the amount of widening in the S/D opening. This helps to prevent void (e.g., empty space) from being formed in the widened portion of the S/D opening, thus reducing the electrical resistance of the S/D contact plug, and preventing electrical short or leakage current between the S/D contact plug and an adjacent conductive feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">62:鰭片</p>
        <p type="p">70:隔離區</p>
        <p type="p">90F:鰭片間隔物</p>
        <p type="p">92:導電特徵</p>
        <p type="p">99:矽化物區</p>
        <p type="p">100A:半導體裝置</p>
        <p type="p">104:蝕刻終止層</p>
        <p type="p">106:第三層間介電質</p>
        <p type="p">108L:下部磊晶源極/汲極區</p>
        <p type="p">108U:上部磊晶源極/汲極區</p>
        <p type="p">112:第一接觸蝕刻終止層</p>
        <p type="p">113:第二接觸蝕刻終止層</p>
        <p type="p">114:第一層間介電質</p>
        <p type="p">114":介電材料</p>
        <p type="p">116:介電層</p>
        <p type="p">119:源極/汲極接觸栓塞</p>
        <p type="p">119A,119C:源極/汲極接觸栓塞</p>
        <p type="p">119P1:右側突出部分</p>
        <p type="p">119P2:左側突出部分</p>
        <p type="p">120:前側互連結構</p>
        <p type="p">122:第三接觸蝕刻終止層</p>
        <p type="p">124:第二層間介電質</p>
        <p type="p">142:裝置層</p>
        <p type="p">155:介電層</p>
        <p type="p">157:通孔</p>
        <p type="p">159:阻障層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="676" publication-number="202632282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓測試設備及其探針台和對位方法</chinese-title>
        <english-title>WAFER TESTING EQUIPMENT, PROBE STATION AND ALIGNMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250520B">G01R1/02</main-classification>
        <further-classification edition="200601120250520B">G01R1/04</further-classification>
        <further-classification edition="200601120250520B">G01R1/06</further-classification>
        <further-classification edition="202001120250520B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州伊歐陸系統集成有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZHOU EOULU SYSTEM INTEGRATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, WENBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張海洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了晶圓測試設備及其探針台和對位方法，圖像採集機構位於探針卡和載片臺上下相對區域的外側，能夠有效解決圖像採集機構的安裝受限問題，圖像採集機構不受探針卡的遮擋。將相對於圖像採集機構具有較小尺寸的光反射結構設置於探針卡面向載片台的下方內側，光反射結構負責採集下方的待測晶圓圖像，並向外側反射給圖像採集機構，從而實現對待測晶圓圖像的有效採集。使用本實施方式的探針台，圖像採集機構與光反射結構相互配合，能夠做到對待測晶圓圖像的自動採集，並根據待測晶圓圖像對待測晶圓與探針卡進行自動對位控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a wafer testing equipment, probe station and alignment method thereof. The image acquisition mechanism is located outside the relative areas of the probe card and the wafer carrier, which can effectively solve the problem of limited installation of the image acquisition mechanism, and the image acquisition mechanism is not blocked by the probe card. A light reflection structure with a smaller size relative to the image acquisition mechanism is arranged on the lower inner side of the probe card facing the wafer carrier, and the light reflection structure is responsible for collecting the image of the wafer to be tested below, and reflecting it to the image acquisition mechanism to the outside, thereby realizing effective collection of the image of the wafer to be tested. Using the probe station of this embodiment, the image acquisition mechanism and the light reflection structure cooperate with each other, and can achieve automatic collection of the image of the wafer to be tested, and automatically align the wafer to be tested and the probe card according to the image of the wafer to be tested.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載片台</p>
        <p type="p">3:圖像採集機構</p>
        <p type="p">30:顯微鏡</p>
        <p type="p">31:驅動機構</p>
        <p type="p">10a:測試腔室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="677" publication-number="202632672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錯誤訂正裝置、錯誤訂正方法及記憶體系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C29/42</main-classification>
        <further-classification edition="200601120251204B">G06F11/16</further-classification>
        <further-classification edition="200601120251204B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">更高精度地執行錯誤訂正。  &lt;br/&gt;　　錯誤訂正裝置，係具備控制器。控制器，係使用將收訊碼字中所含之複數個讀出值與複數個概度資訊建立對應的第1對應資訊，而將身為解碼之對象的第1收訊碼字所對應之概度資訊亦即第1概度資訊，予以求出。控制器，係執行反復處理，其係重複進行使用第1概度資訊的軟判定解碼，直到結束條件為止。控制器，係在結束條件被滿足，且軟判定解碼為失敗的情況下，執行將第1對應資訊更新成第2對應資訊的更新處理。控制器，係將第1對應資訊與第2對應資訊之差分越大值就越大的評價值，予以算出。控制器，係隨應於前記評價值，而執行將反復處理中所使用的第1參數、及更新處理中所使用的第2參數之中至少一方予以變更的變更處理；在變更處理執行後，再執行反復處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="678" publication-number="202633451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/60</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202301120260302B">H10B10/10</further-classification>
        <further-classification edition="202301120260302B">H10B53/30</further-classification>
        <further-classification edition="202301120260302B">H10B61/00</further-classification>
        <further-classification edition="202301120260302B">H10B63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余科京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KEJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭茹雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, RU-SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構，包含：互連結構，其包含形成在基板上方的互連層以及儲存結構，位於互連結構中。儲存結構包含第一電極、第二電極，以及設置在第一電極與第二電極之間的第一儲存層。儲存結構包含在第一互連層中的第一部分以及在第二互連層中的第二部分。該半導體結構還包含屏蔽結構，設置在互連結構的第一互連層與第二互連層中，其中屏蔽結構圍繞儲存結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes: an interconnect structure including a plurality of interconnect layers formed over a substrate and a storage structure in the interconnect structure. The storage structure includes a first electrode, a second electrode, and a first storage layer disposed between the first electrode and the second electrode. The storage structure includes a first portion in a first interconnect layer and a second portion in a second interconnect layer. The semiconductor structure further includes a shield structure disposed in the first interconnect layer and the second interconnect layer of the interconnect structure, wherein the shield structure surrounds the storage structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:基板</p>
        <p type="p">304:電晶體元件</p>
        <p type="p">306:儲存元件</p>
        <p type="p">312:閘極間隔物</p>
        <p type="p">314:源極/汲極區域</p>
        <p type="p">316:源極/汲極區域</p>
        <p type="p">318:第一矽化物區域</p>
        <p type="p">320:第二矽化物區域</p>
        <p type="p">322:第一層間介電層(ILD0層)</p>
        <p type="p">324:第二層間介電層(ILD1層)</p>
        <p type="p">326:互連金屬線</p>
        <p type="p">328:VIA</p>
        <p type="p">330:絕緣材料層</p>
        <p type="p">332:CBM層</p>
        <p type="p">334:CTM層</p>
        <p type="p">336:儲存層</p>
        <p type="p">338:蝕刻停止層</p>
        <p type="p">344:保護層</p>
        <p type="p">350:半導體結構</p>
        <p type="p">352:儲存元件</p>
        <p type="p">353:強制部分</p>
        <p type="p">354:屏蔽環</p>
        <p type="p">355:可選部分</p>
        <p type="p">356:金屬線</p>
        <p type="p">357:著陸結構</p>
        <p type="p">358:壁單元</p>
        <p type="p">360:背側電軌區域</p>
        <p type="p">362:CBM層</p>
        <p type="p">364:CTM層</p>
        <p type="p">366:儲存層</p>
        <p type="p">368:覆蓋層</p>
        <p type="p">370:第一金屬間介電層(第一IMD層)</p>
        <p type="p">372:第二IMD層</p>
        <p type="p">BEOL:後段製程</p>
        <p type="p">FEOL:前段製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="679" publication-number="202633092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置、半導體記憶裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10B80/00</main-classification>
        <further-classification edition="202501120260302B">H10D1/68</further-classification>
        <further-classification edition="202301120260302B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横溝仁道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOMIZO, MASAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木大悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, DAIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山快之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施形態提供一種可降低加工技術或加工精度的要求水準的半導體記憶裝置及半導體記憶裝置的製造方法。一實施形態的半導體記憶裝置包括：基板；半導體記憶體，設置於所述基板；以及電子零件，包含具有中心軸線的外形的本體及自所述本體延伸的引線，所述引線與所述基板的連接部連接。所述電子零件配置成所述本體的中心軸線於所述基板的厚度方向上處於所述基板的厚度內。於在所述引線的自所述本體延伸的延伸方向上使所述引線的延伸前端與所述連接部相向的狀態下，所述引線固定於所述連接部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:基板</p>
        <p type="p">21a:第一面</p>
        <p type="p">21b:第二面</p>
        <p type="p">21c:第三面</p>
        <p type="p">26:電容器(蓄電零件)</p>
        <p type="p">30:零件本體(本體)</p>
        <p type="p">31:第一引線(引線)</p>
        <p type="p">31a、32a:延伸前端(前端面)</p>
        <p type="p">32:第二引線(引線)</p>
        <p type="p">41:第一凹陷部(凹陷部)</p>
        <p type="p">41a、42a:圓弧部</p>
        <p type="p">41b、42b:直線部</p>
        <p type="p">42:第二凹陷部(凹陷部)</p>
        <p type="p">43:第一導電部(連接部、端面通孔)</p>
        <p type="p">44:第二導電部(連接部、端面通孔)</p>
        <p type="p">51:第一接合部</p>
        <p type="p">52:第二接合部</p>
        <p type="p">CL:中心軸線</p>
        <p type="p">Da:直徑</p>
        <p type="p">T:厚度方向</p>
        <p type="p">T1:基板的厚度(厚度)</p>
        <p type="p">T2:厚度方向中心面(中心面)</p>
        <p type="p">+X、-X、+Y、-Y、+Z、-Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="680" publication-number="202632867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧振式轉換器</chinese-title>
        <english-title>A RESONANT CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">H02M3/325</main-classification>
        <further-classification edition="200601120250603B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, BO-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種諧振式轉換器。諧振式轉換器包括一次側開關電路、諧振電路、變壓器電路、二次側開關電路。該諧振電路的複數個諧振槽以星型接法耦接一次側開關電路的複數個輸出節點。變壓器電路的複數個變壓器的每一個包括一次側繞組及二次側繞組。該等一次側繞組以三角形接法耦接複數個諧振槽。二次側開關電路的複數個輸入節點以星型接法耦接變壓器電路的該等二次側繞組。本申請透過複數個諧振槽的配置降低磁通密度，進而降低磁芯損耗，並具有良好的電流平衡效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a resonant converter. The resonant converter includes a primary-side switching circuit, a resonant circuit, a transformer circuit, and a secondary-side switching circuit. The plurality of resonant tanks of the resonant circuit are coupled to the plurality of output nodes of the primary-side switch circuit in a wye connection. Each of a plurality of transformers of the transformer circuit includes a primary winding and a secondary winding. The primary windings are coupled to a plurality of resonant tanks in a delta connection. A plurality of input nodes of the secondary-side switching circuit are coupled to the secondary windings of the transformer circuit in a wye connection. The present disclosure reduces the magnetic flux density through the configuration of the plurality of resonant tanks, thereby reducing the magnetic core loss and having a good current balancing effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:諧振式轉換器</p>
        <p type="p">100:輸入電路</p>
        <p type="p">200:一次側開關電路</p>
        <p type="p">210:第一橋臂</p>
        <p type="p">220:第二橋臂</p>
        <p type="p">230:第三橋臂</p>
        <p type="p">300:諧振電路</p>
        <p type="p">310:第一諧振槽</p>
        <p type="p">320:第二諧振槽</p>
        <p type="p">330:第三諧振槽</p>
        <p type="p">400:變壓器電路</p>
        <p type="p">500:二次側開關電路</p>
        <p type="p">510:第一整流單元</p>
        <p type="p">520:第二整流單元</p>
        <p type="p">530:第三整流單元</p>
        <p type="p">600:輸出電路</p>
        <p type="p">A:第一輸出節點</p>
        <p type="p">B:第二輸出節點</p>
        <p type="p">C:第三輸出節點</p>
        <p type="p">Cin:輸入電容</p>
        <p type="p">Cr1:第一諧振電容</p>
        <p type="p">Cr2:第二諧振電容</p>
        <p type="p">Cr3:第三諧振電容</p>
        <p type="p">Co:輸出電容</p>
        <p type="p">D:第一輸入節點</p>
        <p type="p">E:第二輸入節點</p>
        <p type="p">F:第三輸入節點</p>
        <p type="p">G1、G2、G3:節點</p>
        <p type="p">I1、I2、I3:輸入電流</p>
        <p type="p">Lr1:第一諧振電感</p>
        <p type="p">Lr2:第二諧振電感</p>
        <p type="p">Lr3:第三諧振電感</p>
        <p type="p">Lm1、Lm2、Lm3:激磁電感</p>
        <p type="p">Np1、Np2、Np3:一次側繞組</p>
        <p type="p">Ns1、Ns2、Ns3:二次側繞組</p>
        <p type="p">Ro:輸出電阻</p>
        <p type="p">S1~S12:控制訊號</p>
        <p type="p">SW1:第一開關單元</p>
        <p type="p">SW2:第二開關單元</p>
        <p type="p">SW3:第三開關單元</p>
        <p type="p">SW4:第四開關單元</p>
        <p type="p">SW5:第五開關單元</p>
        <p type="p">SW6:第六開關單元</p>
        <p type="p">SW7:第七開關單元</p>
        <p type="p">SW8:第八開關單元</p>
        <p type="p">SW9:第九開關單元</p>
        <p type="p">SW10:第十開關單元</p>
        <p type="p">SW11:第十一開關單元</p>
        <p type="p">SW12:第十二開關單元</p>
        <p type="p">T1:第一變壓器</p>
        <p type="p">T2:第二變壓器</p>
        <p type="p">T3:第三變壓器</p>
        <p type="p">Vs:電壓源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="681" publication-number="202632528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>標準單元庫、布局設計系統、布局設計方法及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120251001B">G06F30/392</main-classification>
        <further-classification edition="202501120251001B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石本信二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIMOTO, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, JIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可削減工時之標準單元庫、布局設計系統、布局設計方法及程式產品。本實施形態之標準單元庫包含用於設計配置標準單元構成半導體積體電路之標準單元方式之複數種標準單元。複數種標準單元所包含之第1標準單元具有：複數個邏輯電路部，其等配置邏輯電路；及1個以上之配線部，其等配置將1個邏輯電路之輸出與其他邏輯電路之輸入電性連接之配線。配線部中，可重疊配置第2標準單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:標準單元</p>
        <p type="p">11:邏輯電路部</p>
        <p type="p">11a:第1邏輯電路部</p>
        <p type="p">11b:第2邏輯電路部</p>
        <p type="p">12:配線部</p>
        <p type="p">20:標準單元</p>
        <p type="p">21:邏輯電路部</p>
        <p type="p">30_1:配線</p>
        <p type="p">30_2:配線</p>
        <p type="p">111:邏輯電路</p>
        <p type="p">121:配線</p>
        <p type="p">211:邏輯電路</p>
        <p type="p">X:第2方向</p>
        <p type="p">Y:第1方向</p>
        <p type="p">Z:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="682" publication-number="202633177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>互補場效電晶體結構、半導體裝置結構及其形成方法</chinese-title>
        <english-title>CFET STRUCTURE, SEMICONDUCTOR DEVICE STRUCTURE, AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/85</main-classification>
        <further-classification edition="202501120260302B">H10D62/854</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡逸凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, I FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊愷潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供了CFET結構及其形成方法。結構包括第一電晶體，第一電晶體包括第一閘極結構，第一閘極結構包括第一數量的介電層和第一導電類型偶極摻雜劑，且第一導電類型偶極子摻雜劑的峰值濃度位於第一界面層和第一數量的介電層的第一閘極介電層之間的界面處。該結構還包括設置在第一電晶體上方的第二電晶體，並且第二電晶體包括第二閘極結構，第二閘極結構包括第二數量的介電層和與第一導電類型相反的第二導電類型偶極摻雜劑，第二數量不同於第一數量，且第二導電型偶極摻雜劑的峰值濃度位於第二數量的介電層的偶極子層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide CFET structures and methods of forming the same. The structure includes a first transistor including a first gate structure including a first number of dielectric layers and a first conductivity type dipole dopant, and a peak concentration of the first conductivity type dipole dopant is located at an interface between a first interfacial layer and a first gate dielectric layer of the first number of dielectric layers. The structure further includes a second transistor disposed over the first transistor, and the second transistor includes a second gate structure including a second number of dielectric layers and a second conductivity type dipole dopant opposite the first conductivity type, the second number is different from the first number, and a peak concentration of the second conductivity type dipole dopant is located in a dipole layer of the second number of dielectric layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基板</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">108:第二半導體層</p>
        <p type="p">116:基板部分</p>
        <p type="p">118:絕緣材料</p>
        <p type="p">120:隔離區</p>
        <p type="p">130:閘極結構</p>
        <p type="p">132:閘極介電層</p>
        <p type="p">134:犧牲閘極層</p>
        <p type="p">136:遮罩層</p>
        <p type="p">138:閘極間隔物</p>
        <p type="p">A-A:線</p>
        <p type="p">B-B:線</p>
        <p type="p">C-C:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="683" publication-number="202633425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路、其製造的方法及唯讀記憶體電晶體陣列在積體電路的金屬化疊層上的製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT, FABRICATING METHOD THEREOF, AND FABRICATING METHOD OF READ-ONLY MEMORY TRANSISTOR ARRAY ON METALLIZATION STACK OF INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202601120260302B">H10P30/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202301120260302B">H10B20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, TZU JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江文智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在製造積體電路的方法中，在半導體基板中及/或上形成複數個邏輯電路裝置。在半導體基板上形成金屬化疊層。金屬化疊層包括嵌入介電材料中的複數個圖案化金屬層和複數個通孔。在金屬化疊層上形成唯讀記憶體（read-only memory, ROM）電晶體陣列。ROM電晶體陣列與金屬化疊層的通孔電連接。ROM電晶體陣列可以包括複數個電晶體通道和複數個源極線和複數個汲極線，電晶體通道和源極線和汲極線由450&lt;sup&gt;o&lt;/sup&gt;C或更低的溫度下沉積的非晶矽層形成。在沉積非晶矽層之後，執行的ROM電晶體陣列製造步驟也可在450&lt;sup&gt;o&lt;/sup&gt;C或更低的溫度下執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a method for fabricating an integrated circuit, logic circuitry devices are formed in and/or on a semiconductor substrate. A metallization stack is formed on the semiconductor substrate. The metallization stack includes patterned metal layers and vias embedded in a dielectric material. A read-only memory (ROM) transistor array is formed on the metallization stack. The ROM transistor array is electrically connected with vias of the metallization stack. The ROM transistor array may include transistor channels and source and drain lines formed from an amorphous silicon layer that is deposited at a temperature of 450&lt;sup&gt;o&lt;/sup&gt;C or lower. ROM transistor array fabrication steps performed after depositing the amorphous silicon layer may also be performed at a temperature of 450&lt;sup&gt;o&lt;/sup&gt;C or lower.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:邏輯電路裝置</p>
        <p type="p">32:半導體基板</p>
        <p type="p">34:金屬化疊層</p>
        <p type="p">36:圖案化金屬層</p>
        <p type="p">38:通孔</p>
        <p type="p">40:介電材料</p>
        <p type="p">44:ROM電晶體陣列</p>
        <p type="p">S:源極線</p>
        <p type="p">D:汲極線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="684" publication-number="202631886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title>RESIN COMPOSITION AND PRODUCT OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">C08L79/04</main-classification>
        <further-classification edition="200601120250801B">C08K5/5399</further-classification>
        <further-classification edition="200601120250801B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山台光電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HEZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種樹脂組合物，包括100重量份的馬來醯亞胺樹脂和10重量份至100重量份的式(1)化合物。其中，n為3~6的整數，X、Y各自獨立為芳基環丁烯氧基或芳氧基，芳基環丁烯氧基的數量大於或等於3個，芳氧基上含有或不含有碳原子數為1~4的烯烴或（甲基）丙烯酸酯基。還公開了該樹脂組合物在製備製品中的用途、以及至少一部分由該樹脂組合物製成的製品，該製品包括半固化片、樹脂膜、積層板印刷電路板或固化絕緣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a resin composition, comprising 100 parts by weight of a maleimide resin and 10 to 100 parts by weight of a compound of formula (1). Wherein, n is an integer of 3 to 6, X and Y are each independently an arylcyclobuteneoxy group or an aryloxy group, the number of arylcyclobuteneoxy groups is greater than or equal to 3, and the aryloxy group contains or does not contain an olefin group or a (meth)acrylate group having 1 to 4 carbon atoms. Also disclosed are the use of the resin composition in preparing a product, and a product at least partly made of the resin composition, wherein the product includes a prepreg, a resin film, a laminated printed circuit board or a cured insulator.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="685" publication-number="202631887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title>RESIN COMPOSITION AND PRODUCT OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250905B">C08L79/04</main-classification>
        <further-classification edition="200601120250905B">C08L63/02</further-classification>
        <further-classification edition="200601120250905B">C07F9/12</further-classification>
        <further-classification edition="200601120250905B">C08L71/00</further-classification>
        <further-classification edition="200601120250905B">C08L25/10</further-classification>
        <further-classification edition="200601120250905B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山台光電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李湘南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIANGNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭紅霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HONGXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種樹脂組合物，包括100重量份的含乙烯基聚苯醚樹脂以及10重量份至160重量份的式(1)化合物。其中，n為3~6的整數，X、Y各自獨立為芳基環丁烯氧基或芳氧基，芳基環丁烯氧基的數量大於或等於3個，芳氧基上含有或不含有碳原子數為1~4的烯烴或（甲基）丙烯酸酯基。還公開了該樹脂組合物在製備製品中的用途、以及至少一部分由該樹脂組合物製成的製品，該製品包括半固化片、樹脂膜、積層板印刷電路板或固化絕緣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a resin composition, comprising 100 parts by weight of a vinyl-containing polyphenylene ether resin and 10 to 160 parts by weight of a compound of formula (1). Wherein, n is an integer of 3 to 6, X and Y are each independently an arylcyclobuteneoxy group or an aryloxy group, the number of arylcyclobuteneoxy groups is greater than or equal to 3, and the aryloxy group contains or does not contain an olefin group or a (meth)acrylate group having 1 to 4 carbon atoms. Also disclosed are the use of the resin composition in preparing a product, and a product at least partly made of the resin composition, wherein the product includes a prepreg, a resin film, a laminated printed circuit board or a cured insulator.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="686" publication-number="202631868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title>RESIN COMPOSITION AND PRODUCT OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">C08L25/02</main-classification>
        <further-classification edition="200601120250701B">C08L25/08</further-classification>
        <further-classification edition="200601120250701B">C08L25/10</further-classification>
        <further-classification edition="200601120250701B">C08L47/00</further-classification>
        <further-classification edition="200601120250701B">C08K5/5399</further-classification>
        <further-classification edition="200601120250701B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中山台光電子材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡志龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZHILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭廣智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, GUANGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HEZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李穆森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MUSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種樹脂組合物，包括100重量份聚烯烴樹脂以及20重量份至100重量份的式(1)化合物。其中，n為3~6的整數，X、Y各自獨立為芳基環丁烯氧基或芳氧基，芳基環丁烯氧基的數量大於或等於3個，芳氧基上含有或不含有碳原子數為1~4的烯烴或（甲基）丙烯酸酯基。還公開了該樹脂組合物在製備製品中的用途、以及至少一部分由該樹脂組合物製成的製品，該製品包括半固化片、樹脂膜、積層板印刷電路板或固化絕緣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a resin composition, comprising 100 parts by weight of a polyolefin resin and 20 to 100 parts by weight of a compound of formula (1). Wherein, n is an integer of 3 to 6, X and Y are each independently an arylcyclobuteneoxy group or an aryloxy group, the number of arylcyclobuteneoxy groups is greater than or equal to 3, and the aryloxy group contains or does not contain an olefin group or a (meth)acrylate group having 1 to 4 carbon atoms. Also disclosed are the use of the resin composition in preparing a product, and a product at least partly made of the resin composition, wherein the product includes a prepreg, a resin film, a laminated printed circuit board or a cured insulator.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="687" publication-number="202631251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於吸附之產品</chinese-title>
        <english-title>PRODUCT FOR ADSORPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B01J20/12</main-classification>
        <further-classification edition="200601120260422B">B01J20/18</further-classification>
        <further-classification edition="200601120260422B">B01J20/28</further-classification>
        <further-classification edition="200601120260422B">B01J20/30</further-classification>
        <further-classification edition="200601120260422B">B01J20/32</further-classification>
        <further-classification edition="202301120260422B">C02F1/28</further-classification>
        <further-classification edition="200601320260422B">C02F101/10</further-classification>
        <further-classification edition="200601320260422B">C02F101/20</further-classification>
        <further-classification edition="200601320260422B">C02F103/10</further-classification>
        <further-classification edition="200601320260422B">C02F103/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾狄希礦業國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACTIVE MINERALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯茲　內斯特　艾利瑞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRUZ, NESTOR ALIRIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普利格　泰勒　錢亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULLIG, TYLER CHANTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安瓦爾　黎安　麥琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANWAR, LYANNE MYLENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKER, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於吸附包括砷及/或硒之重金屬的產品。該產品可包含已用表面處理劑進行表面官能化之黏土。該表面處理劑可包括（a）一或多個砷親和官能基，及/或（b）一或多個硒親和官能基。該產品之組分以重量百分比計可包括：70-99 wt.%黏土及1-30 wt.%表面處理劑。該產品之60-95%呈如下顆粒形式，該等顆粒的大小為穿過10目篩且截留在100目或60目篩上，或大小在小於2000微米至149或250微米範圍內。該黏土包括綠坡縷石及/或海泡石。亦揭示一種生產該產品的方法及一種使用該產品吸附液體中之重金屬的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A product for adsorbing a heavy metal that includes arsenic and/or selenium. The product may comprise clay that has been surface functionalized with a surface treating agent. The surface treating agent may include (a) one or more arsenic affinity functional groups, and/or (b) one or more selenium affinity functional groups. The weight percentage of components of the product may include: 70 - 99 wt. % clay and 1 - 30 wt. % surface treating agent. 60 - 95 % of the product is in the form of granules sized to pass through a 10 mesh sieve and to be retained on a 100 mesh or 60 mesh sieve, or sized in the range of less than 2000 microns to 149 or 250 microns. The clay includes attapulgite and/or sepiolite. Also disclosed is a method of producing the product and a method of adsorbing the heavy metal in a liquid using the product.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="688" publication-number="202633153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體形成方法</chinese-title>
        <english-title>METHODS OF FORMING SEMICONDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260325B">H10D84/83</main-classification>
        <further-classification edition="202601120260325B">H10D84/01</further-classification>
        <further-classification edition="202601120260325B">H10P50/20</further-classification>
        <further-classification edition="202601120260325B">H10P14/20</further-classification>
        <further-classification edition="202601120260325B">H10P14/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張容浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, I-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃憲中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斌彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PINYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一方法包括形成環繞通道層堆疊的金屬閘極結構、形成將金屬閘極結構切割成兩個隔離段的溝槽、以及在溝槽中形成閘極隔離結構。形成溝槽包括對金屬閘極結構進行等離子蝕刻工藝，等離子蝕刻製程包括第一步以及第一步之後的第二步。第一步具有第一源功率和第一偏壓功率，第二步具有第二源功率和第二偏壓功率。第一源功率與第二源功率的比例為約1:1至約5:1，且第一偏壓功率小於第二偏壓功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a metal gate structure wrapping around a stack of channel layers, forming a trench cutting the metal gate structure into two isolated segments, and forming a gate isolation structure in the trench. Forming the trench includes performing a plasma etching process to the metal gate structure, the plasma etching process includes a first step and a second step after the first step. The first step has a first source power and a first bias power, the second step has a second source power and a second bias power. A ratio of the first source power to the second source power is about 1:1 to about 5:1, and the first bias power is less than the second bias power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:結構/裝置</p>
        <p type="p">250:閘極結構</p>
        <p type="p">284:介電層/閘極隔離結構</p>
        <p type="p">286:導電層/導電部件</p>
        <p type="p">292:絕緣結構</p>
        <p type="p">294-1:源極/汲極接觸</p>
        <p type="p">296:源極/汲極接觸件</p>
        <p type="p">A-A’:線</p>
        <p type="p">B-B’:線</p>
        <p type="p">C-C’:線</p>
        <p type="p">D-D’:線</p>
        <p type="p">E-E’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="689" publication-number="202633268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260325B">H10P14/40</main-classification>
        <further-classification edition="202601120260325B">H10P50/00</further-classification>
        <further-classification edition="202601120260325B">H10P76/00</further-classification>
        <further-classification edition="202601120260325B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱建智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構及其製造方法。方法包括在基板上形成導電通孔；在導電通孔和基板上方形成介電層；在介電層上圖案化遮罩；執行蝕刻製程以透過遮罩蝕刻介電層以在導電通孔上方形成溝槽，其中溝槽延伸至由介電層形成的溝槽底部，且其中溝槽底部與導電通孔相交；以及在溝槽中形成導電結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are semiconductor structures and methods for fabricating such structures. A method includes forming a conductive via over a substrate; forming a dielectric layer over the conductive via and the substrate; patterning a mask over the dielectric layer; performing an etch process to etch the dielectric layer through the mask to form a trench over the conductive via, wherein the trench extends to a trench bottom formed by the dielectric layer, and wherein the trench bottom intersects the conductive via; and forming a conductive structure in the trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">101:上表面</p>
        <p type="p">110:導電溝槽</p>
        <p type="p">10:基板</p>
        <p type="p">20:介電層</p>
        <p type="p">30:導電結構</p>
        <p type="p">40:蝕刻停止層</p>
        <p type="p">41:第一蝕刻停止層</p>
        <p type="p">42:第二蝕刻停止層</p>
        <p type="p">50:介電層</p>
        <p type="p">70:導電通孔</p>
        <p type="p">73:上表面</p>
        <p type="p">76:側表面</p>
        <p type="p">80:介電層</p>
        <p type="p">88:溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="690" publication-number="202633080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">H10B41/20</main-classification>
        <further-classification edition="202301120250701B">H10B43/20</further-classification>
        <further-classification edition="200601120250701B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可更適當地形成積層結構的半導體記憶裝置及其製造方法。根據本實施方式的半導體記憶裝置包括第一導電層與第一絕緣層交替地在第一方向上積層而成的積層體。積層體具有第一柱狀部、第二柱狀部、以及分離部。第一柱狀部設置於積層體的第一區域，且包含在積層體內沿第一方向延伸的第一半導體部。第二柱狀部設置於積層體的第二區域，在積層體內沿第一方向延伸，且包含絕緣體。分離部在積層體內沿第一方向及與第一方向交叉的第二方向延伸，將第一區域分離並且將第二區域分離。第一柱狀部的階層數與第二柱狀部及分離部的階層數互不相同。更包括設置於相鄰的階層的分離部的接頭部的第一交聯部。第一交聯部的第一方向上的位置為第一柱狀部的上端部與下端部之間的中間部的第一方向上的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2、41、42、43:積層體</p>
        <p type="p">50:絕緣層</p>
        <p type="p">421:下層</p>
        <p type="p">422:上層</p>
        <p type="p">CL:柱狀部</p>
        <p type="p">LMH、MH、MMH、UMH:記憶體孔</p>
        <p type="p">LSTB、STB、USTB:交聯部</p>
        <p type="p">LST、ST、UST:狹縫</p>
        <p type="p">Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="691" publication-number="202633391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測繪半導體基板之表面拓樸之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR MAPPING SURFACE TOPOGRAPHY OF SEMICONDUCTOR SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260425B">H10P74/20</main-classification>
        <further-classification edition="200601120260425B">G01B11/26</further-classification>
        <further-classification edition="200601120260425B">G01B11/24</further-classification>
        <further-classification edition="200601120260425B">G02B26/10</further-classification>
        <further-classification edition="202101120260425B">G02B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫伊　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOOY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙加　查爾斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONJAK, CHARLES A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於半導體裝置製造中採用之基板之表面拓樸之高處理量及高解析度測量之方法及系統。一光束轉向裝置使一照明光束沿著入射於一基板表面上之一光束掃描路徑掃描。另外，一樣品定位系統使該基板相對於該照明光束移動。在一些實施例中，該光束轉向裝置與該基板之間之照明光束路徑中之一超心聚焦透鏡消除對在受測量表面與反射光束之光學路徑中之一位置敏感偵測器之間之光學路徑中之一光學元件之需要。一運算系統基於該偵測器處之該反射光束之所偵測位置產生晶圓傾斜之一圖。在一進一步態樣中，基於所測量之表面傾斜圖產生一高解析度表面高度圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for high throughput and high resolution measurement of surface topography of substrates employed in semiconductor device manufacturing are described herein. A beam steering device scans an illumination beam along a beam scan path incident on a substrate surface. In addition, a specimen positioning system moves the substrate with respect to the illumination beam. In some embodiments, a hypercentric focusing lens in the illumination beam path between the beam steering device and the substrate eliminates the need for an optical element in the optical path between the surface under measurement and a position sensitive detector in the optical path of the reflected beam. A computing system generates a map of wafer tilt based on the detected position of the reflected beam at the detector. In a further aspect, a high resolution surface height map is generated based on the measured surface tilt map.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:表面拓樸測量系統</p>
        <p type="p">101:照明源</p>
        <p type="p">102:照明光束</p>
        <p type="p">103:空間濾波器</p>
        <p type="p">104:準直光學器件</p>
        <p type="p">105:線性偏振器元件</p>
        <p type="p">106:光束轉向裝置</p>
        <p type="p">107:柱面透鏡</p>
        <p type="p">108:線性偏振器</p>
        <p type="p">109:四分之一波板</p>
        <p type="p">110:超心光學總成</p>
        <p type="p">110A:超心聚焦光學元件/透鏡元件/透鏡</p>
        <p type="p">110B:光束擴張透鏡</p>
        <p type="p">111:光束分裂器</p>
        <p type="p">112:晶圓卡盤</p>
        <p type="p">113:晶圓</p>
        <p type="p">114:晶圓掃描軌道</p>
        <p type="p">115:有效測量區域</p>
        <p type="p">116:電容探針</p>
        <p type="p">117A:測量光點</p>
        <p type="p">117B:測量光點</p>
        <p type="p">118:反射光束</p>
        <p type="p">119:主動表面</p>
        <p type="p">120:位置敏感偵測器</p>
        <p type="p">121:旋轉載台</p>
        <p type="p">122:平移載台</p>
        <p type="p">123:運動控制器</p>
        <p type="p">125:晶圓定位系統</p>
        <p type="p">126:光束掃描路徑</p>
        <p type="p">130:表面拓樸測量子系統</p>
        <p type="p">131:信號</p>
        <p type="p">132:晶圓傾斜之一圖/表面傾斜之一圖/傾斜圖</p>
        <p type="p">133:信號/所測量距離</p>
        <p type="p">134:命令信號</p>
        <p type="p">135:信號/命令信號</p>
        <p type="p">136:信號</p>
        <p type="p">137:高度圖</p>
        <p type="p">140:運算系統</p>
        <p type="p">141:處理器</p>
        <p type="p">142:電腦可讀記憶體</p>
        <p type="p">143:匯流排</p>
        <p type="p">144:記憶體</p>
        <p type="p">TRACK&lt;sub&gt;i&lt;/sub&gt;:晶圓掃描軌道114之一部分</p>
        <p type="p">V&lt;sub&gt;T&lt;/sub&gt;:速度</p>
        <p type="p">ω:角速度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="692" publication-number="202632241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119281</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於二個感測器之六自由度精確對準設定</chinese-title>
        <english-title>6DOF PRECISE ALIGNMENT SETUP FOR TWO SENSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01M11/02</main-classification>
        <further-classification edition="202301120260422B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商奧寶科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORBOTECH LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈伊克赫曼　塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOICHMAN, TAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴波　摩德查　海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABABO, MORDECHAI HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿哈加尼　艾許坎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGHAJANI, ASHKAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種集光系統，其可包含具有透過一光束分束器對準之光軸之感測器。該等感測器可貼附至印刷電路板，該等印刷電路板繼而可貼附至攝影機基座。該等攝影機基座可透過膠水層及墊塊(block)貼附至靜態基座。該等靜態基座可自該底板正交延伸且可貼附至該底板。因此，該等感測器之該對準可由該底板透過該等印刷電路板、該等攝影機基座、該等膠水層、該等墊塊及該等靜態基座來維持。該等膠水層亦可在黏附該等膠水層之前的該對準期間提供六自由度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A collection system may include sensors with optical axes which are aligned through a beamsplitter. The sensors may be affixed to printed circuit boards which may in turn be affixed to camera bases. The camera bases may be affixed to static bases through glue layers and blocks. The static bases may extend orthogonally from and may be affixed to the baseplate. Thus, the alignment of the sensors may be maintained by the baseplate through the printed circuit boards, the camera bases, the glue layers, the blocks, and the static bases. The glue layers may also provide six degrees-of-freedom during the alignment before the glue layers are adhered.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:集光系統</p>
        <p type="p">102:底板</p>
        <p type="p">104a:第一攝影機</p>
        <p type="p">104b:第二攝影機</p>
        <p type="p">106:光束分束器</p>
        <p type="p">108a:第一偏振器</p>
        <p type="p">108b:第二偏振器</p>
        <p type="p">110a:第一四分之一波板</p>
        <p type="p">110b:第二四分之一波板</p>
        <p type="p">112:墊塊</p>
        <p type="p">114a:第一靜態基座</p>
        <p type="p">114b:第二靜態基座</p>
        <p type="p">116a:第一攝影機基座</p>
        <p type="p">116b:第二攝影機基座</p>
        <p type="p">122a:第一感測器</p>
        <p type="p">122b:第二感測器</p>
        <p type="p">124a:第一印刷電路板</p>
        <p type="p">124b:第二印刷電路板</p>
        <p type="p">130a:第一鐵磁體</p>
        <p type="p">130b:第二鐵磁體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="693" publication-number="202632379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式顯示器和聲音錄製的方法</chinese-title>
        <english-title>HEAD-MOUNTED DISPLAY AND METHOD OF SOUND RECORDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">G02B27/01</main-classification>
        <further-classification edition="200601120260316B">H04R3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種頭戴式顯示器和聲音錄製的方法。方法包含：在頭戴式顯示器上設置麥克風陣列，並將麥克風陣列的第一麥克風和麥克風陣列的第二麥克風沿第一方向對齊，其中頭戴式顯示器通過相機捕捉圖像；控制第一麥克風和第二麥克風形成第一聲束；以及根據第一聲束捕捉對應於圖像的第一聲音訊號，並輸出與第一聲音訊號相關的經處理聲音訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted display and a method of sound recording are provided. The method includes: disposing a microphone array on a head-mounted display and aligning a first microphone of the microphone array and a second microphone of the microphone array along a first direction, wherein the head-mounted display captures an image through a camera; controlling the first microphone and the second microphone to form a first acoustic beam; and capturing a first sound signal corresponding to the image according to the first acoustic beam, and outputting a processed sound signal associated with the first sound signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601,S602,S603:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="694" publication-number="202633149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250703B">H10D84/82</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, SHIH MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體結構。半導體結構包括基底、第一半導體薄膜、第二半導體薄膜、第一閘極結構和第二閘極結構。基底包括N型半導體區域和P型半導體區域。第一半導體薄膜形成在P型半導體區域的平坦頂表面上。第二半導體薄膜形成在N型半導體區域的粗糙頂表面上。第一半導體薄膜和第二半導體薄膜包含不同材料。第一閘極結構配置在第一半導體薄膜上。第二閘極結構配置在第二半導體薄膜上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate, a first semiconductor film, a second semiconductor film, a first gate structure and a second gate structure. The substrate includes an N-type semiconductor region and a P-type semiconductor region. The first semiconductor film is formed on a flat top surface of the P-type semiconductor region. The second semiconductor film is formed on a rough top surface of the N-type semiconductor region. The first semiconductor film and the second semiconductor film comprise different materials. The first gate structure is disposed on the first semiconductor film. The second gate structure is disposed on the second semiconductor film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">100N:N型半導體區域</p>
        <p type="p">100P:P型半導體區域</p>
        <p type="p">102N,102P,165,175:頂表面</p>
        <p type="p">110’:第一半導體膜</p>
        <p type="p">120:淺溝槽隔離結構/STI結構</p>
        <p type="p">140:第二半導體薄膜</p>
        <p type="p">160:第一閘極結構</p>
        <p type="p">162:第一閘極絕緣層</p>
        <p type="p">164:第一金屬閘極</p>
        <p type="p">167:側壁</p>
        <p type="p">170:第二閘極結構</p>
        <p type="p">172:第二閘極絕緣層</p>
        <p type="p">174:第二金屬閘極</p>
        <p type="p">182,184:第一源極/汲極區</p>
        <p type="p">192,194:第二源極/汲極區</p>
        <p type="p">D:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="695" publication-number="202632256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有全晶圓涵蓋能力並配備步進與穩定平台之超高靈敏度混合檢測</chinese-title>
        <english-title>ULTRA-HIGH SENSITIVITY HYBRID INSPECTION WITH FULL WAFER COVERAGE CAPABILITY WITH STEP AND SETTLE STAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N21/956</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛林　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERLING, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆雷　勞倫斯　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAY, LAWRENCE P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琛努里　納加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENNURI, NAGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種混合檢測系統。該混合檢測系統包含一光學檢測工具，其經組態以藉由用光將一照明束導引至一樣本且回應於該照明束而自該樣本收集散射光來識別該樣本上之候選缺陷。該混合檢測系統包含一多柱檢測工具以自該等候選缺陷識別所關注缺陷，其中該多柱檢測工具包括：兩個或更多個柱，其等用於使兩個或更多個測量區同時在該樣本上成像；及一平移平台，其經組態以相對於該兩個或更多個柱固定及定位該樣本，其中該平移平台經組態以使用一步進與穩定取樣計畫來使該等候選缺陷之至少一部分成像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid inspection system is disclosed. The hybrid inspection system includes an optical inspection tool configured to identify candidate defects on a sample by directing an illumination beam to the sample with light and collecting scattered light from the sample in response to the illumination beam. The hybrid inspection system includes a multi-column inspection tool to identify defects of interest from the candidate defects, wherein the multi-column inspection tool comprises: two or more columns to simultaneously image two or more measurement regions on the sample and a translation stage configured to secure and position the sample with respect to the two or more columns, wherein the translation stage is configured to image at least a portion of the candidate defects using a step-and-settle sampling plan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:混合檢測系統</p>
        <p type="p">102:光學檢測工具</p>
        <p type="p">104:多柱檢測工具</p>
        <p type="p">106:柱</p>
        <p type="p">108:樣本</p>
        <p type="p">110:光學檢測平台</p>
        <p type="p">112:照明光束</p>
        <p type="p">114:樣本光</p>
        <p type="p">116:平移平台</p>
        <p type="p">118:電子束</p>
        <p type="p">120:散射電子</p>
        <p type="p">122:控制器</p>
        <p type="p">124:處理器</p>
        <p type="p">126:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="696" publication-number="202632660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及半導體記憶裝置之資料儲存方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">G11C16/02</main-classification>
        <further-classification edition="200601120251110B">G11C16/34</further-classification>
        <further-classification edition="200601120251110B">G11C16/26</further-classification>
        <further-classification edition="200601120251110B">G11C16/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小倉達朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種儲存資料所需之時間較短之半導體記憶裝置及半導體記憶裝置之資料儲存方法。半導體記憶裝置所具備之電路使第1複數個記憶胞中之第2複數個記憶胞各者之閾值電壓變移相同量。然後，電路特定出第2複數個記憶胞各者之閾值電壓落於由1個以上讀取位準分隔出之2個以上電壓範圍中之哪一者。電路針對第2複數個記憶胞中之第3複數個記憶胞，以共用2個以上電壓範圍中之閾值電壓所在之電壓範圍的記憶胞為一個組，對每個組執行選擇1個組中包含之複數個記憶胞並對第1字元線施加符合與1個組對應之電壓範圍之電壓之1次編程脈衝的動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">“Af”:狀態</p>
        <p type="p">D_init:分佈</p>
        <p type="p">“Er”:狀態</p>
        <p type="p">Gr1:副組</p>
        <p type="p">Gr2:副組</p>
        <p type="p">Gr3:副組</p>
        <p type="p">Vgr1:電壓</p>
        <p type="p">Vgr2:電壓</p>
        <p type="p">Vpgm_init:電壓</p>
        <p type="p">Vpgm_Gr1:電壓</p>
        <p type="p">Vpgm_Gr2:電壓</p>
        <p type="p">Vpgm_Gr3:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="697" publication-number="202631469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取放貨裝置、機器人、倉儲系統及取放貨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B65G1/04</main-classification>
        <further-classification edition="200601120260422B">B65G1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAI ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹慶鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種取放貨裝置、機器人、倉儲系統及取放貨方法，其中，取放貨裝置用於取放物料箱，該取放貨裝置包括裝置主體、伸縮機構和勾手機構，伸縮機構與裝置主體移動連接，勾手機構與伸縮機構移動連接，勾手機構包括安裝座、第一驅動單元和勾手件，第一驅動單元設置於安裝座，勾手件與安裝座轉動連接，第一驅動單元被配置為驅動勾手件相對於安裝座轉動，以使勾手件與物料箱對接或者分離，裝置主體包括承載面，承載面用於承載物料箱，勾手件與物料箱的對接槽對接時，勾手件的高度高於承載面，勾手件與物料箱的對接槽分離時，勾手件的高度低於所述承載面，從而可以實現物料箱的取放操作，簡化了取放貨裝置的結構，降低了成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:取放貨裝置</p>
        <p type="p">100:裝置主體</p>
        <p type="p">101:承載面</p>
        <p type="p">300:勾手機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="698" publication-number="202631548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陶瓷—金屬接合體的製造方法及接合體</chinese-title>
        <english-title>MANUFACTURING METHOD OF CERAMICS-METAL BONDED BODY AND BONDED BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C04B41/87</main-classification>
        <further-classification edition="200601120260422B">C04B41/88</further-classification>
        <further-classification edition="201401120260422B">B23K26/342</further-classification>
        <further-classification edition="201601120260422B">C23C4/01</further-classification>
        <further-classification edition="201601120260422B">C23C4/123</further-classification>
        <further-classification edition="200601120260422B">C23C28/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商同和控股（集團）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWA HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人大阪大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島津製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADZU CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林幸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山内英世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSANAI, HIDEYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤雄二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徳本潤平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUMOTO, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中啓輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAKA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚本雅裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡尚規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東條公資</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOJO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇野進吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山蔭康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAGE, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諏訪雅也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUWA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石垣直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIGAKI, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的為，藉由可在陶瓷基材上使金屬之層以細線形狀進行接合之技術，獲得兼具防止陶瓷基材之損傷、及實現高的接合強度之陶瓷-金屬接合體。  &lt;br/&gt;本發明之陶瓷-金屬接合體之製造方法係包含下列步驟：  &lt;br/&gt;準備具有無機物質之被覆層的陶瓷基材之步驟；一邊朝向前述被覆層連續地輸送供給固體金屬材料，一邊對輸送供給中之前述固體金屬材料照射雷射束，而形成由前述固體金屬材料熔融而成熔融金屬的步驟；一邊將前述熔融金屬供給至前述被覆層之表面上，一邊使對前述表面上之供給位置連續地移動，藉此，在陶瓷基材上連續地被覆前述熔融金屬之步驟；及，使被覆於陶瓷基材上之前述熔融金屬在前述陶瓷基材上連續地凝固之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A purpose of the present invention is to obtain a ceramic-metal bonded body that prevents damage to the ceramic substrate while achieving high bonding strength by using a technology that enables a metal layer to be bonded in the form of thin wires onto a ceramic substrate. &lt;br/&gt; Provided in the present invention is a manufacturing method of ceramics-metal bonded body, which includes the steps of: preparing a ceramic substrate having a coating layer of an inorganic substance; continuously providing a solid metal material to the coating layer while irradiating the solid metal material being provided with a laser beam, to form a molten metal obtained by melting the solid metal material; providing the molten metal on a surface of the coating layer while continuously moving the providing position on the surface, thereby continuously coating the molten metal on the ceramics subatrate; and continuously solidifying on the ceramic substrate the molten metal which has been coated on the ceramic substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:陶瓷基材</p>
        <p type="p">2:被覆層</p>
        <p type="p">3:金屬層</p>
        <p type="p">10:加工頭</p>
        <p type="p">20:粉體供給裝置</p>
        <p type="p">21:粉體供給管</p>
        <p type="p">22:粉體輸送供給噴嘴</p>
        <p type="p">30a,30b:雷射產生裝置</p>
        <p type="p">31a,31b:光纖</p>
        <p type="p">200:金屬粉體</p>
        <p type="p">300a,300b:雷射束</p>
        <p type="p">310:熔融金屬供給區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="699" publication-number="202631085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以監測生理訊號的電子裝置、健康照護系統以及相關方法</chinese-title>
        <english-title>ELECTRONIC DEVICE FOR MONITORING PHYSIOLOGICAL SIGNALS, HEALTHCARE SYSTEM, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260424B">A61B5/318</main-classification>
        <further-classification edition="202101120260424B">A61B5/282</further-classification>
        <further-classification edition="200601120260424B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生奕科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOPRO SCIENTIFIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡辰翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHEN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃新權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏廷耘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置，其包括感測電極、參考電極和放大器。所述感測電極用以得到第一生理訊號以及與第一生理訊號不同的第二生理訊號。所述參考電極用以得到第一參考訊號以及與第一參考訊號不同的第二參考訊號。所述放大器耦接至該些感測電極與該些參考電極，且用以：從第一生理訊號減去第一參考訊號，以產生第一資料訊號；從第一生理訊號減去第二參考訊號，以產生第二資料訊號；從第二生理訊號減去第一參考訊號，以產生第三資料訊號；以及從第二生理訊號減去第二參考訊號，以產生第四資料訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided. The electronic device includes sensing electrodes, reference electrodes, and amplifiers. The sensing electrodes are configured to obtain a first physiological signal and a second physiological signal different from the first physiological signal. The reference electrodes are configured to obtain a first reference signal and a second reference signal different from the first reference signal. The amplifiers are coupled to the plurality of sensing electrodes and the plurality of reference electrodes, and are configured to: subtract the first reference signal from the first physiological signal to generate a first data signal; subtract the second reference signal from the first physiological signal to generate a second data signal; subtract the first reference signal from the second physiological signal to generate a third data signal; and subtract the second reference signal from the second physiological signal to generate a fourth data signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號處理電路</p>
        <p type="p">103_1,103_2:感測電極</p>
        <p type="p">105_1,105_2:參考電極</p>
        <p type="p">107A,107B:電阻</p>
        <p type="p">AM1,AM2,AM3,AM4:放大器</p>
        <p type="p">D1,D2,D3,D4:資料訊號</p>
        <p type="p">E1,E2:生理訊號</p>
        <p type="p">R1,R2:參考訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="700" publication-number="202632004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療X連鎖視網膜劈裂的方法</chinese-title>
        <english-title>METHOD FOR TREATING X-LINKED RETINOSCHISIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">C12Q1/6809</main-classification>
        <further-classification edition="201801120260504B">C12Q1/6841</further-classification>
        <further-classification edition="201001120260504B">C12N5/071</further-classification>
        <further-classification edition="200601120260504B">C12N15/86</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/47</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北榮民總醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI VETERANS GENERAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱士華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, SHIH-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃德光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DE-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHIH-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林泰祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多體學方法，該方法整合單細胞RNA定序(scRNA-seq)及時空轉錄體學(ST)，為涉及生物分子病理機制的轉錄網絡剖析及細胞之間相互作用呈現提供潛力。本發明亦提供一種結合高通量scRNA-seq及ST的多模式方法，以闡明具有視網膜分裂表型的兩個類XLRS模型的XLRS特異性轉錄體學特徵，該模型包括基因工程化(&lt;i&gt;Rs1&lt;/i&gt;emR209C)小鼠及患者衍生的帶有相同的患者特定p.R209C突變的視網膜類器官。通過多體學轉錄體學分析，確定內質網(ER)壓力/eIF2傳訊、mTOR路徑以及eIF4與p70S6K路徑的調節為兩個類XLRS模型之間慢性富集化且高度保留的疾病路徑。西方墨點法及蛋白質體學分析驗證了未摺疊蛋白反應、慢性eIF2α傳訊活化及慢性ER壓力誘導的細胞凋亡的發生。此外，慢性ER壓力/eIF2α路徑活化的靶向治療可協同性地增強AAV介導的&lt;i&gt;RS1&lt;/i&gt;基因遞輸的功效，最終改進雙極細胞完整性、突觸後傳遞、視網膜結構紊亂及電生理反應。總之，使用多體學方法從&lt;i&gt;Rs1&lt;/i&gt;emR209C小鼠及患者衍生的視網膜類器官中獲得的複雜轉錄體學特徵為無法治癒的視網膜疾病（諸如XLRS）的潛在治療標靶提供了機會。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a multiomics approach, which integrate single-cell RNA-sequencing (scRNA-seq) and spatiotemporal transcriptomics (ST) offering potential for dissecting transcriptional networks and revealing cell-cell interactions involved in biomolecular pathomechanisms. The present invention also provides a multimodal approach combining high-throughput scRNA-seq and ST to elucidate XLRS-specific transcriptomic signatures in two XLRS-like models with retinal splitting phenotypes, including genetically engineered (&lt;i&gt;Rs1&lt;/i&gt;emR209C) mice and patient-derived retinal organoids harboring the same patient-specific p.R209C mutation. Through multiomics transcriptomic analysis, the endoplasmic reticulum (ER) stress/eIF2 signaling, mTOR pathway, and the regulation of eIF4 and p70S6K pathways as chronically enriched and highly conserved disease pathways between two XLRS-like models are identified. Western blots and proteomics analysis validated the occurrence of unfolded protein responses, chronic eIF2α signaling activation, and chronic ER stress-induced apoptosis. Furthermore, therapeutic targeting of the chronic ER stress/eIF2α pathway activation synergistically enhanced the efficacy of AAVmediated &lt;i&gt;RS1&lt;/i&gt;gene delivery, ultimately improving bipolar cell integrity, postsynaptic transmission, disorganized retinal architecture and electrophysiological responses. Collectively, the complex transcriptomic signatures obtained from &lt;i&gt;Rs1&lt;/i&gt;emR209C mice and patient-derived retinal organoids using the multiomics approach provide opportunities to unravel potential therapeutic targets for incurable retinal diseases, such as XLRS.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="701" publication-number="202633472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌入式半導體裝置封裝及製造方法</chinese-title>
        <english-title>EMBEDDED SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/63</main-classification>
        <further-classification edition="202601120260427B">H10W70/01</further-classification>
        <further-classification edition="202601120260427B">H10W72/90</further-classification>
        <further-classification edition="202601120260427B">H10W40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　安吉特　布山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, ANKIT BHUSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊斯昌　奧拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZSCHIESCHANG, OLAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一大致態樣中，一種方法包括：形成一面板，該面板包括設置在一非導電材料中的一散熱器。該散熱器係暴露在該面板的兩相對側。該方法進一步包括：利用一導電接合材料將一半導體晶粒耦接至該散熱器的一表面；及施加一底部填充材料以囊封該導電接合材料。該方法亦包括：電鍍該半導體晶粒的一接觸墊；將該半導體晶粒及該底部填充材料嵌入一層壓材料中；及將一金屬層設置在該層壓材料上。該方法進一步包括：形成穿過該金屬層及該層壓材料的一開口，以暴露該接觸墊的該鍍層的至少一部分；及在該開口中形成一導電通孔。該導電通孔將該金屬層與該接觸墊的該鍍層電耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a general aspect, a method includes forming a panel including a heat spreader disposed in a non-conductive material. The heat spreader is exposed on opposite sides of the panel. The method further includes coupling a semiconductor die to a surface of the heat spreader with a conductive bonding material, and applying an underfill material to encapsulate the conductive bonding material. The method also includes plating a contact pad of the semiconductor die, embedding the semiconductor die and the underfill material in a lamination material, and disposing a metal layer on the lamination material. The method further includes forming an opening through the metal layer and the lamination material to expose at least a portion of the plating of the contact pad, and forming a conductive via in the opening. The conductive via electrically couples the metal layer with the plating of the contact pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置封裝體</p>
        <p type="p">105:基材</p>
        <p type="p">105a:非導電材料</p>
        <p type="p">105b:散熱器</p>
        <p type="p">110:半導體晶粒</p>
        <p type="p">110a:頂側金屬化層</p>
        <p type="p">110b:底側金屬化層</p>
        <p type="p">110c:側壁</p>
        <p type="p">115:導電接合材料</p>
        <p type="p">120:底部填充材料</p>
        <p type="p">125:金屬化層</p>
        <p type="p">125a:第一部分</p>
        <p type="p">125b:第二部分</p>
        <p type="p">130:層壓材料</p>
        <p type="p">135a:開口</p>
        <p type="p">135b:開口</p>
        <p type="p">135c:開口</p>
        <p type="p">140a:導電通孔</p>
        <p type="p">140b:導電通孔</p>
        <p type="p">140c:導電通孔</p>
        <p type="p">145:金屬層</p>
        <p type="p">145a:第一部分</p>
        <p type="p">145b:第二部分</p>
        <p type="p">145c:第三部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="702" publication-number="202632863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相切換電容轉換器與控制方法</chinese-title>
        <english-title>MULTI-PHASE SWITCHED-CAPACITOR CONVERTER AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">H02M3/06</main-classification>
        <further-classification edition="200601120250701B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅業興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YE-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林水木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHUI-MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佘憲治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHE, HSIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許麗美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種多相切換電容轉換器，用於將第一電壓轉換為第二電壓或進行反向轉換。該轉換器包含兩組子轉換器，並聯連接於輸入與輸出電壓間，每一子轉換器包含一飛馳電容器與複數開關，藉由週期性切換飛馳電容器與電壓源之間的電連接，於第一與第二切換相位間進行電源轉換。兩組子轉換器週期性於第一與第二系統狀態間交替切換，並於第一與第二系統狀態轉換期間引入重疊系統狀態，使兩子轉換器同時處於第一切換相位，藉此確保電流不中斷以降低突波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiphase switched capacitor converter is disclosed for converting a first voltage to a second voltage or vice versa. The multiphase switched capacitor converter includes two parallel-connected sub-converters, each including a flying capacitor and plural switches that periodically control electrical connections between the capacitors and voltage sources in first and second switching phases. The multiphase switched capacitor converter alternates between a first and a second system state, with a transitional overlapping state where both sub-converters are in the first switching phase, ensuring uninterrupted input current for reducing voltage spikes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210A,210B:第一、第二子轉換器</p>
        <p type="p">CFA,CFB:飛馳電容器</p>
        <p type="p">PH1A,PH1B:第一切換相位</p>
        <p type="p">Q1A,Q2A,Q1B,Q2B:對應第一切換相位之導通開關</p>
        <p type="p">SOlp:重疊系統狀態</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">I1:第一電流</p>
        <p type="p">I2:第二電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="703" publication-number="202632718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用深度學習影像分割在基於設計的缺陷檢測過程中將影像與設計對齊</chinese-title>
        <english-title>ALIGNING IMAGES TO A DESIGN DURING DESIGN-BASED DEFECT DETECTION USING DEEP LEARNING IMAGE SEGMENTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/26</main-classification>
        <further-classification edition="201701120260421B">G06T7/00</further-classification>
        <further-classification edition="202301120260421B">G06N3/08</further-classification>
        <further-classification edition="202601120260421B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙代爾　蘇拉吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONDAL, SURAJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉加什　拉霍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAKASH, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用一監督式深度學習影像分割模型自一掃描電子束影像判定一個二元經分割影像。該二元經分割影像被演現為二元的且被分割成僅包含影像之某些特徵。將該二元經分割影像與一設計影像之一區域匹配。使用該設計影像之該區域在該影像中執行缺陷檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A binary segmented image is determined from a scanning electron beam image using a supervised deep learning image segmentation model. The binary segmented image is rendered to be binary and is segmented to include only some features of the image. The binary segmented image is matched to a region of a design image. Defect detection is performed in the image using the region of the design image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:步驟</p>
        <p type="p">102:步驟</p>
        <p type="p">103:步驟</p>
        <p type="p">104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="704" publication-number="202631378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體及光學積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260417B">B32B7/023</main-classification>
        <further-classification edition="200601120260417B">B32B7/12</further-classification>
        <further-classification edition="200601120260417B">C09J133/00</further-classification>
        <further-classification edition="200601120260417B">C09J11/04</further-classification>
        <further-classification edition="200601120260417B">C09J11/06</further-classification>
        <further-classification edition="200601120260417B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原情菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, MOTONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案課題提供一種干涉不均之發生獲得充分抑制之光學積層體。&lt;br/&gt;  作為其解決手段，一種光學積層體，特徵在於：其係透過接著劑層而至少積層有第1光學層及第2光學層者；第1光學層係液晶系相位差層；接著劑層係接著劑組成物的硬化物層，且前述接著劑組成物至少含有陽離子聚合性成分、陽離子聚合引發劑及金屬氧化物粒子；且，第1光學層之與前述接著劑層側之面相反之表面具備以下所示表面凹凸性；&lt;br/&gt;  (表面凹凸性)&lt;br/&gt;  對第1光學層之與前述接著劑層側之面相反之表面的表面凹凸進行線測定後得平均線，相對於所得平均線，以最高凸部之頂點之高度D1與分別鄰接最高凸部之2個凹部中較低凹部之深度D2的和(D1+D2)所示起伏之大小為100nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1光學層</p>
        <p type="p">B:對第1光學層之與接著劑層側之面相反之表面的表面凹凸進行線測定後所得平均線</p>
        <p type="p">D1:最高凸部之頂點之高度</p>
        <p type="p">D2:分別鄰接最高凸部之2個凹部中最較低凹部之深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="705" publication-number="202632420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造工具、用於該工具之裝載埠及操作該工具的方法</chinese-title>
        <english-title>SEMICONDUCTOR FABRICATION TOOL, LOAD PORT FOR AND METHOD OF OPERATING SUCH A TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G03F7/00</main-classification>
        <further-classification edition="202601120260422B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施韋茨　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWETZ, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬納　伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENNER, YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於處理一半導體製造物品，尤其一倍縮光罩之半導體製造工具(100)，尤其一儲料器，該工具包含至少一個裝載埠(151、152、153、154)、一物品處置器(112、114)及一物品處理單元(120)，其中該裝載埠(151、152、153、154)組配來自該工具(100)外部接納固持該物品之一輸送容器(200)，打開該輸送容器(200)，並為該物品處置器(112、114)提供對該輸送容器(200)內之該物品的接近，其中該物品處理單元(120)組配來處理一預定數目個物品，其中處理一物品尤其包含將該物品儲存於一個別儲存位置中，其中該物品處置器(112、114)組配來自該物品處理單元(120)擷取一物品及/或自打開之輸送容器(200)擷取該物品，並在該輸送容器(200)與該物品處理單元(120)之間轉移該物品，該工具(100)進一步包含一容器儲存單元(220)及一容器處置器(212)，該容器處置器用於在該容器儲存單元(220)與該裝載埠(151、152、153、154)之間轉移該輸送容器(200)。此外，提供一種用於此類工具(100)之裝載埠(151、152、153、154)及一種用於操作此類工具(100)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a semiconductor fabrication tool, particularly a stocker, (100) for processing a semiconductor fabrication article, particularly a reticle, the tool comprising at least one load port (151, 152, 153, 154), an article handler (112, 114), and an article processing unit (120), wherein the load port (151, 152, 153, 154) is configured to accept, from outside the tool (100), a transport container (200) holding the article, to open the transport container (200), and to provide the article handler (112, 114) with access to the article within the transport container (200), wherein the article processing unit (120) is configured to process a predetermined number of articles, wherein processing an article particularly comprises storing the article in a respective storage position, wherein the article handler (112, 114) is configured to retrieve an article from the article processing unit (120) and/or to retrieve the article from the opened transport container (200) and to transfer the article between the transport container (200) and the article processing unit (120), the tool (100) further comprising a container storage unit (220) and a container handler (212) for transferring the transport container (200) between the container storage unit (220) and the load port (151, 152, 153, 154). Further, a load port (151, 152, 153, 154) for such a tool (100) and a method for operating such a tool (100) are provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:儲料器，半導體製造工具，工具</p>
        <p type="p">101:外壁</p>
        <p type="p">102:內壁</p>
        <p type="p">110:豎直軌道</p>
        <p type="p">112:物品處置器，處置器，第一物品處置器</p>
        <p type="p">120:物品儲存單元，機動儲存單元</p>
        <p type="p">130:物品轉移介面，第一內部介面，內部介面</p>
        <p type="p">151:裝載埠</p>
        <p type="p">200:輸送容器</p>
        <p type="p">210:豎直軌道</p>
        <p type="p">212:容器處置器</p>
        <p type="p">220:容器儲存單元，儲存單元</p>
        <p type="p">230:容器介面，第二內部介面，內部介面</p>
        <p type="p">240:裸物品，內包裝，內保護盒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="706" publication-number="202633154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="201101120260424B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔宇現</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WOOHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴奎南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種積體電路裝置，其包括：一基體；一第一絕緣柱，其在與該基體之一表面相交的一第一方向上延伸；一第一通道結構，其包括一第一片及一第二片，該第一片及該第二片在與該第一方向相交之一第二方向上間隔開，其中該第一絕緣柱在該第二方向上插入於該第一片與該第二片之間；一第二絕緣柱，其在該基體上在該第二方向上與該第一絕緣柱間隔開；以及一第二通道結構，其包括一第三片及一第四片，該第三片及該第四片在該第二方向上間隔開，其中該第二絕緣柱在該第二方向上插入於該第三片與該第四片之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an integrated circuit device including a substrate, a first insulating pillar extending in a first direction intersecting a surface of the substrate, a first channel structure including a first sheet and a second sheet, the first sheet and the second sheet spaced apart in a second direction intersecting the first direction with the first insulating pillar interposed between the first sheet and the second sheet in the second direction, a second insulating pillar spaced apart from the first insulating pillar in the second direction on the substrate, and a second channel structure including a third sheet and a fourth sheet, the third sheet and the fourth sheet spaced apart in the second direction with the second insulating pillar interposed between the third sheet and the fourth sheet in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路裝置</p>
        <p type="p">105:第一場絕緣膜</p>
        <p type="p">106:第二場絕緣膜</p>
        <p type="p">107:第三場絕緣膜</p>
        <p type="p">110:第一絕緣柱</p>
        <p type="p">161:第一閘極線</p>
        <p type="p">162:第二閘極線</p>
        <p type="p">210:第二絕緣柱</p>
        <p type="p">261:第三閘極線</p>
        <p type="p">262:第四閘極線</p>
        <p type="p">A1-A1',A2-A2',B-B':線</p>
        <p type="p">CA1:第一源極/汲極接點</p>
        <p type="p">CA2:第二源極/汲極接點</p>
        <p type="p">CA3:第三源極/汲極接點</p>
        <p type="p">CA4:第四源極/汲極接點</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GC1:第一閘極切口</p>
        <p type="p">GC2:第二閘極切口</p>
        <p type="p">GC3:第三閘極切口</p>
        <p type="p">NSS1:第一奈米片堆疊</p>
        <p type="p">NSS2:第二奈米片堆疊</p>
        <p type="p">NSS3:第三奈米片堆疊</p>
        <p type="p">NSS4:第四奈米片堆疊</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
        <p type="p">W3:第三寬度</p>
        <p type="p">W3_H:寬度</p>
        <p type="p">W4:第四寬度</p>
        <p type="p">W5:第五寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="707" publication-number="202633381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合晶圓之計量</chinese-title>
        <english-title>BONDED WAFER METROLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P74/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎弗蘭妮　阿布納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAFRANI, AVNER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　安卓　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILL, ANDREW V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈列里克　迪米特里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORELIK, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于齊耶爾　約拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZIEL, YORAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈蘭　約錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLAN, YOSSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹德曼　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENDELMAN, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊什　薩隆　亞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISH SHALOM,AVIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種計量系統，其可包含：一光源，其提供照明；一單一物鏡，其用於將該照明導引至具有一頂部基板特徵及一底部基板特徵之一疊對目標且收集來自該疊對目標之樣本光；一可調照明孔徑光闌，其用於調整一照明數值孔徑；一偵測器，其經組態以基於該樣本光使該樣本成像，其中該頂部基板特徵及該底部基板特徵在一視場內；及一可調集光孔徑光闌，其經組態以調整一成像NA。該系統可包含一控制器，其用於接收該頂部基板之一厚度，產生界定提供一期望對比度之成像參數之該計量配方之至少一部分，基於該計量配方接收該疊對目標之一影像，及基於該影像產生該頂部基板與該底部基板之間的一疊對量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metrology system may include a light source providing illumination, a single objective lens to direct the illumination to an overlay target with a top-substrate feature and a bottom-substrate feature and collect sample light from the overlay target, an adjustable illumination aperture stop to adjust an illumination numerical aperture, a detector configured to image the sample based on the sample light with both the top-substrate feature and the bottom-substrate feature within a field of view, and an adjustable collection aperture stop configured to adjust an imaging NA. The system may include a controller to receive a thickness of the top substrate, generate at least a portion of the metrology recipe defining imaging parameters providing a desired contrast, receive an image of the overlay target based on the metrology recipe, and generate an overlay measurement between the top substrate and the bottom substrate based on the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:疊對計量系統</p>
        <p type="p">102:照明源</p>
        <p type="p">104:照明</p>
        <p type="p">106:物鏡</p>
        <p type="p">108:疊對目標</p>
        <p type="p">110:樣本</p>
        <p type="p">112:樣本光</p>
        <p type="p">114:偵測器</p>
        <p type="p">116:照明通道</p>
        <p type="p">118:可調照明孔徑光闌</p>
        <p type="p">120:集光通道</p>
        <p type="p">122:可調集光孔徑光闌</p>
        <p type="p">124:控制器</p>
        <p type="p">126:處理器</p>
        <p type="p">128:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="708" publication-number="202632341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121390</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/122</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何信穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, HSIN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置。該電子裝置包括：一載體；一中介層，其安置於該載體上方；一光收發器，其安置於該中介層上方；及一電子組件，其支撐該光收發器且由該中介層支撐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device. The electronic device includes a carrier, an interposer disposed over the carrier, an optical transceiver disposed over the interposer, and an electronic component supporting the optical transceiver and supported by the interposer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:電子裝置</p>
        <p type="p">1c:電子裝置之一部分</p>
        <p type="p">10:載體</p>
        <p type="p">10e:電接點</p>
        <p type="p">10p:導電襯墊</p>
        <p type="p">11:載體</p>
        <p type="p">11d:介電質</p>
        <p type="p">11e:電接點</p>
        <p type="p">11m:金屬</p>
        <p type="p">11r:樹脂</p>
        <p type="p">12:電子組件</p>
        <p type="p">12e:電接點</p>
        <p type="p">13:載體</p>
        <p type="p">13d:介電質</p>
        <p type="p">13e:電接點</p>
        <p type="p">13m:金屬</p>
        <p type="p">13r:樹脂</p>
        <p type="p">14:光學組件</p>
        <p type="p">14b:光阻擋層</p>
        <p type="p">14e:電接點</p>
        <p type="p">14g:黏著層</p>
        <p type="p">14n:光學元件</p>
        <p type="p">14p:分隔件</p>
        <p type="p">14r:接收器</p>
        <p type="p">14t:發射器</p>
        <p type="p">15:電子組件</p>
        <p type="p">101:表面</p>
        <p type="p">102:表面</p>
        <p type="p">121:表面</p>
        <p type="p">122:表面</p>
        <p type="p">133:側向表面</p>
        <p type="p">L1:光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="709" publication-number="202632527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人開發系統及方法</chinese-title>
        <english-title>ROBOT DEVELOPMENT SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250703B">G06F30/27</main-classification>
        <further-classification edition="202301120250703B">G06N3/0464</further-classification>
        <further-classification edition="202301120250703B">G06N3/08</further-classification>
        <further-classification edition="200601120250703B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘啟聞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯昶甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHANG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種機器人開發系統，包含一小腦控制器、一虛擬零組件模組、一虛擬建置模組、一虛擬測試模組、一編譯模組及一實體建置模組。虛擬零組件模組儲存複數虛擬零組件及每一虛擬零組件對應之至少一物理模型。虛擬建置模組使用小腦控制器及選定的虛擬零組件對應的物理模型，建置出一虛擬機器人。虛擬測試模組在虛擬環境中訓練虛擬機器人，以優化小腦控制器針對虛擬零組件的控制。編譯模組將已訓練之虛擬機器人的小腦控制器編譯成一韌體。實體建置模組根據已訓練之虛擬機器人使用的虛擬零組件建置一實體機器人，以及將韌體佈署至實體機器人。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robot development system is provided. The system includes a cerebellum controller, a virtual component module, a virtual building module, a virtual testing module, a compile module, and physical building module. The virtual component module stores a plurality of virtual components and at least one physical model corresponding to each virtual component. The virtual building module uses the cerebellum controller and the physical models of the chosen virtual components to build a virtual robot. The virtual testing module trains the virtual robot in a virtual environment to optimize the cerebellum controller’s control toward the virtual robot’s virtual components. The compile module compiles the trained virtual robot’s cerebellum controller into a firmware. The physical building module builds a physical robot according to the virtual components used by the trained virtual robot, and deploys the firmware to the physical robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:虛擬零組件模組</p>
        <p type="p">12:虛擬建置模組</p>
        <p type="p">13:虛擬測試模組</p>
        <p type="p">14:小腦控制器</p>
        <p type="p">15:編譯模組</p>
        <p type="p">16:實體建置模組</p>
        <p type="p">20:機器人開發方法</p>
        <p type="p">201-205:步驟</p>
        <p type="p">21:虛擬零組件</p>
        <p type="p">22:虛擬機器人</p>
        <p type="p">23:韌體</p>
        <p type="p">24:實體機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="710" publication-number="202633083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及其控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B43/20</main-classification>
        <further-classification edition="202301120260302B">H10B43/40</further-classification>
        <further-classification edition="200601120260302B">G11C16/02</further-classification>
        <further-classification edition="200601120260302B">G11C7/06</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小倉達朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種適當動作之半導體記憶裝置。半導體記憶裝置具備：複數個半導體層，其等沿積層方向積層，且於第1方向上延伸；複數個導電層，其等在第2方向上延伸，且連接於複數個半導體層之第1方向之端部；複數個通孔電極，其等沿著複數個半導體層之第2方向之側面排列於第1方向上，且直徑從積層方向之第1位置至第2位置增大；及複數個電荷蓄積層，其等設置於複數個半導體層與複數個通孔電極之間。又，於編程動作之第1時點，對設置於從積層方向之第1位置至第3位置為止之範圍內之複數個第1導電層，供給第1電壓或較第1電壓大之第2電壓，對設置於從積層方向之第2位置至第4位置為止之範圍內之複數個第2導電層，供給較第1電壓大且較第2電壓小之第3電壓、或較第3電壓大之第4電壓，於該狀態下，對一個通孔電極供給編程電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL:位元線</p>
        <p type="p">ML&lt;sub&gt;L&lt;/sub&gt;:記憶體層</p>
        <p type="p">ML&lt;sub&gt;H&lt;/sub&gt;:記憶體層</p>
        <p type="p">t101~t104:時點</p>
        <p type="p">t111~t115:時點</p>
        <p type="p">V&lt;sub&gt;VFYA&lt;/sub&gt;:驗證電壓</p>
        <p type="p">V&lt;sub&gt;VFYB&lt;/sub&gt;:驗證電壓</p>
        <p type="p">V&lt;sub&gt;VFYC&lt;/sub&gt;:驗證電壓</p>
        <p type="p">V&lt;sub&gt;VFYD&lt;/sub&gt;:驗證電壓</p>
        <p type="p">V&lt;sub&gt;PGM&lt;/sub&gt;:編程電壓</p>
        <p type="p">V&lt;sub&gt;SRC0&lt;/sub&gt;:電壓</p>
        <p type="p">V&lt;sub&gt;SRC1&lt;/sub&gt;:電壓</p>
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:電壓</p>
        <p type="p">WL&lt;sub&gt;S&lt;/sub&gt;:選擇字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="711" publication-number="202631343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抓握設備</chinese-title>
        <english-title>GRIPPING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250624B">B25J5/02</main-classification>
        <further-classification edition="200601120250624B">B25J15/08</further-classification>
        <further-classification edition="200601120250624B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘啟明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周廣宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KUANG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊政勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENG-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抓握設備包含移動模組、抓握模組以及驅動裝置。移動模組包含移動本體、第一充電部以及電源。移動本體配置以沿軌道移動。第一充電部設置於移動本體。電源設置於移動本體，並電性連接第一充電部。抓握模組包含抓握本體、可充電電池以及第二充電部。抓握本體配置以抓握物件。可充電電池設置於抓握本體。第二充電部設置於抓握本體，並電性連接可充電電池，第二充電部對齊第一充電部。驅動裝置設置於移動本體，並連接抓握本體。驅動裝置配置以相對移動模組移動抓握模組，使得第二充電部移動以電性連接或離開第一充電部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gripping equipment includes a moving module, a gripping module and a driving device. The moving module includes a moving body, a first charging portion and a power supply. The first charging portion and the power supply are disposed on the moving body configured to move along a rail. The power supply electrically connects with the first charging portion. The gripping module includes a gripping body, a rechargeable battery and a second charging portion. The rechargeable battery and the second charging portion are disposed on the gripping body configured to grip an object. The second charging portion electrically connects with the rechargeable battery and aligns with the first charging portion. The driving device is configured to move the gripping module relative to the moving module, such that the second charging portion is moved to electrically connect with or away from the first charging portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:抓握設備</p>
        <p type="p">110:移動模組</p>
        <p type="p">111:移動本體</p>
        <p type="p">112:第一充電部</p>
        <p type="p">113:電源</p>
        <p type="p">120:抓握模組</p>
        <p type="p">121:抓握本體</p>
        <p type="p">1211:支撐件</p>
        <p type="p">1212:可延伸件</p>
        <p type="p">122:可充電電池</p>
        <p type="p">123:第二充電部</p>
        <p type="p">130:驅動裝置</p>
        <p type="p">131:捲揚器</p>
        <p type="p">1311:捲揚器本體</p>
        <p type="p">1312:皮帶</p>
        <p type="p">A-A,B-B:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="712" publication-number="202632666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C16/26</main-classification>
        <further-classification edition="200601120251103B">G11C16/06</further-classification>
        <further-classification edition="202301120251103B">H10B41/35</further-classification>
        <further-classification edition="202301120251103B">H10B43/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於在不使感測放大器模組高電壓化的情況下向寫入對象外的記憶體胞元施加高電壓。實施方式的半導體記憶裝置包括：積層體，是多個第一絕緣層與多個第二絕緣層交替地積層而成；多個通道層，分別設置於多個第一絕緣層中，沿著多個第一絕緣層且沿第一方向延伸；字元線，沿積層體的積層方向在積層體內延伸，與多個通道層交叉；多條位元線，分別連接於多個通道層；以及升壓電路，分別設置於多個第一絕緣層中，與多條位元線各者連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL、LBIstr、LBIx、LBIy:位元線</p>
        <p type="p">BST:升壓電路</p>
        <p type="p">CC:觸點</p>
        <p type="p">CN:通道層</p>
        <p type="p">WL:字元線</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="713" publication-number="202631035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉鏈鏈帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">A44B19/36</main-classification>
        <further-classification edition="200601120260423B">A44B19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本祥仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YOSHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志鷹潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHITAKA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種拉鏈鏈帶。一個鏈齒(70、80)之主體部(71、81)具有從第一上下面(71C、81C)之第一正背面(71B、81A)側朝向相鄰之鏈齒(70、80)延伸設置之第一凸部(72、82)，相鄰之鏈齒(70、80)之主體部(71、81)具有從第二上下面(71D、81D)之第二正背面(71A、81B)側朝向一個鏈齒(70、80)延伸設置之第二凸部(76、86)，第一凸部(72、82)與第二凸部(76、86)在從正背方向觀察時重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:上滑件</p>
        <p type="p">10B:下滑件</p>
        <p type="p">11a,11b:滑件本體</p>
        <p type="p">14a,14b:背翼板</p>
        <p type="p">15a,15b:引導柱</p>
        <p type="p">17a,17b:鏈齒引導路</p>
        <p type="p">18a,18b:嚙合口</p>
        <p type="p">19a,19b:導入口</p>
        <p type="p">21a,21b:背翼板凸緣部</p>
        <p type="p">21c,21d:直線凸緣部</p>
        <p type="p">21e,21f:傾斜凸緣部</p>
        <p type="p">40:插銷</p>
        <p type="p">43:嚙合突起</p>
        <p type="p">45:插銷突起</p>
        <p type="p">52:第一凹部</p>
        <p type="p">61:卡止凸部</p>
        <p type="p">65:筒銷突起</p>
        <p type="p">66:第一凸部</p>
        <p type="p">70:鏈齒</p>
        <p type="p">73:嚙合頭部</p>
        <p type="p">74:第一凹部</p>
        <p type="p">76:第二凸部</p>
        <p type="p">80:鏈齒</p>
        <p type="p">82:第一凸部</p>
        <p type="p">83:嚙合頭部</p>
        <p type="p">88:第二凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="714" publication-number="202633155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10D88/00</further-classification>
        <further-classification edition="202601120260424B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭晩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴宰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴柱勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹鎭燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JINCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括：一突出區，其在一下部絕緣層之一第一表面上在一第一方向上延伸；一裝置分離層，其設置於一突出區之一側，且包括第一絕緣層及位於該第一絕緣層之一側表面上的第二絕緣層；一下部通道圖案及一下部源極/汲極圖案，其沿著該第一方向交替地設置於該下部絕緣層上方；一上部通道圖案，其位於該下部通道圖案上方；一上部源極/汲極圖案，其位於該下部源極/汲極圖案上方；閘極圖案，其沿著該第一方向間隔開；一閘極切割圖案，其在該第一方向上延伸，在一第二方向上位於該等閘極圖案之間；以及一穿孔，其穿透該閘極切割圖案且在該第一方向及一第三方向上在該閘極切割圖案上延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a protruding region that extends in a first direction on a first surface of a lower insulating layer; a device separation layer that is provided at a side of a protruding region, and includes first and second insulating layers on a side surface of the first insulating layer; a lower channel pattern and a lower source/drain pattern that are alternately provided along the first direction above the lower insulating layer; an upper channel pattern above the lower channel pattern; an upper source/drain pattern above the lower source/drain pattern; gate patterns that are spaced apart along the first direction; a gate cutting pattern that extends in the first direction between the gate patterns in a second direction; and a through-via that penetrates the gate cutting pattern and extends on the gate cutting pattern in the first direction and a third direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:突出區</p>
        <p type="p">110:第一層間絕緣層</p>
        <p type="p">410:下部絕緣層</p>
        <p type="p">420:下部佈線層</p>
        <p type="p">500:分離圖案</p>
        <p type="p">620:間隙填充絕緣層</p>
        <p type="p">650:穿孔</p>
        <p type="p">A-A',D-D':線</p>
        <p type="p">aCA:上部源極/汲極接點</p>
        <p type="p">AR1:第一主動區</p>
        <p type="p">AR2:第二主動區</p>
        <p type="p">bCA:下部源極/汲極接點</p>
        <p type="p">CM:連接部分</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DSP:中間絕緣結構</p>
        <p type="p">ESL1:第一蝕刻終止層</p>
        <p type="p">ESL2:第二蝕刻終止層</p>
        <p type="p">GE:閘極圖案</p>
        <p type="p">GI:閘極絕緣層</p>
        <p type="p">GP:閘極罩蓋圖案</p>
        <p type="p">GS:閘極間隔體</p>
        <p type="p">LCH:下部通道圖案</p>
        <p type="p">LGE:下部閘極圖案</p>
        <p type="p">LSD:下部源極/汲極圖案</p>
        <p type="p">M1b:下部佈線結構</p>
        <p type="p">PO1:第一閘極部分</p>
        <p type="p">PO2:第二閘極部分</p>
        <p type="p">PO3:第三閘極部分</p>
        <p type="p">PO4:第四閘極部分</p>
        <p type="p">PO5:第五閘極部分</p>
        <p type="p">PO6:第六閘極部分</p>
        <p type="p">SDL:虛設通道圖案</p>
        <p type="p">SP1:第一半導體圖案</p>
        <p type="p">SP2:第二半導體圖案</p>
        <p type="p">SP3:第三半導體圖案</p>
        <p type="p">SP4:第四半導體圖案</p>
        <p type="p">UCH:上部通道圖案</p>
        <p type="p">UGE:上部閘極圖案</p>
        <p type="p">USD:上部源極/汲極圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="715" publication-number="202632003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於溫度敏感反應的樣品托盤</chinese-title>
        <english-title>SAMPLE TRAY FOR TEMPERATURE-SENTITIVE REACTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250627B">C12Q1/6806</main-classification>
        <further-classification edition="201801120250627B">C12Q1/686</further-classification>
        <further-classification edition="200601120250627B">C12M1/02</further-classification>
        <further-classification edition="200601120250627B">C12M1/34</further-classification>
        <further-classification edition="200601120250627B">C12M1/38</further-classification>
        <further-classification edition="200601120250627B">G01N27/447</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光鼎生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOPTIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡守冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHOU KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於溫度敏感反應的樣品托盤包括：複數個樣品槽以及邊框。其中該複數個樣品槽在該邊框的長度方向上彼此獨立，每個該樣品槽在該邊框的寬度方向透過位於該樣品槽兩側的兩個浮動肋與該邊框連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sample tray for temperature-sensitive reactions includes wells and a frame. The wells are disconnected one another in a length direction of the frame, and each well is connected to the frame in a width direction of the frame through two floating ribs on both sides of the well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">B:基座</p>
        <p type="p">C:卡匣</p>
        <p type="p">E1:第一熱電模組</p>
        <p type="p">E2:第二熱電模組</p>
        <p type="p">4:試劑托盤</p>
        <p type="p">5:第一加熱柱</p>
        <p type="p">6:樣品托盤</p>
        <p type="p">7:第二加熱柱</p>
        <p type="p">10:毛細管柱</p>
        <p type="p">45:試劑槽</p>
        <p type="p">61:邊框</p>
        <p type="p">100:PCR-CE系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="716" publication-number="202631952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括共沸的及其他近沸點的熱管理流體之再生程序</chinese-title>
        <english-title>RECLAMATION PROCESSES INCLUDING AZEOTROPIC AND OTHER CLOSE-BOILING THERMAL MANAGEMENT FLUIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C09K5/04</main-classification>
        <further-classification edition="200601120260428B">F25B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔西奧　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STASIO, ANTHONY F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了一種熱管理流體再生之程序。該程序包括收集至少一種經回收的熱管理流體，該至少一種經回收的熱管理流體至少包括第一冷媒化合物及第二冷媒化合物，以形成經收集的熱管理流體；以及在沒有蒸餾或實質上沒有蒸餾之情況下，由該經收集的熱管理流體形成摻合物成分。該摻合物成分係共沸、類共沸、或近沸點。該摻合物成分經組態為與(i)一或多種冷媒化合物、及/或(ii)包含二或更多種冷媒化合物的一或多種摻合物合併，以用於形成熱管理流體產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process of thermal management fluid reclamation is provided. The process includes collecting at least one recovered thermal management fluid including at least a first refrigerant compound and a second refrigerant compound to form a collected thermal management fluid; and forming a blend constituent from the collected thermal management fluid in the absence of distillation or substantially in the absence of distillation. The blend constituent is azeotropic, azeotrope-like, or close-boiling. The blend constituent is configured to be combined with (i) one or more refrigerant compounds, and/or (ii) one or more blends comprising two or more refrigerant compounds, for formation of a thermal management fluid product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="717" publication-number="202632519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料保護方法、穿戴式裝置及非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>DATA PROTECTION METHOD, WEARABLE DEVICE AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250701B">G06F21/31</main-classification>
        <further-classification edition="201301120250701B">G06F21/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝政翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宏倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUNG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種資料保護方法及穿戴式裝置。資料保護方法適用於包含處理器和顯示面板的穿戴式裝置，且包含：透過處理器，鎖定由顯示面板提供的沉浸式環境中的資料物件；透過處理器，獲得候選物件的第一特徵資料；以及當第一特徵資料符合預定標準時，透過處理器，根據候選物件的第一特徵資料產生錨點資訊，其中錨點資訊是用以解鎖被鎖定的資料物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a data protection method and a wearable device. The data protection method is applicable to the wearable device including a processor and a display panel, and includes: by the processor, locking a data object in an immersive environment provided by the display panel; by the processor, obtaining a first feature data of a candidate object; and in response to the first feature data satisfying a predetermined standard, by the processor, generating an anchor information according to the first feature data of the candidate object, wherein the anchor information is configured to be used to unlocking the data object being locked.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:資料保護方法</p>
        <p type="p">S201~S204:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="718" publication-number="202632663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C16/10</main-classification>
        <further-classification edition="200601120251201B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提昇記憶體裝置之性能。實施方式之記憶體裝置包含第1位元線、第1選擇電晶體、第2位元線、串、字元線、感測放大器、驅動電路。第1選擇電晶體之一端連接於第1位元線。第2位元線連接於第1選擇電晶體之另一端。串包含連接於第2位元線之第2選擇電晶體、及記憶胞電晶體。字元線連接於記憶胞電晶體。感測放大器連接於第1位元線。驅動電路連接於第1位元線或第2位元線。於寫入動作中記憶胞電晶體被設定為禁止編程之情形時，感測放大器對第1位元線施加第1電壓，驅動電路對第2位元線施加高於第1電壓之第2電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">24:半導體層</p>
        <p type="p">28:絕緣構件</p>
        <p type="p">30:柱</p>
        <p type="p">31:絕緣膜</p>
        <p type="p">32:導電膜</p>
        <p type="p">33:絕緣膜</p>
        <p type="p">70:絕緣體層</p>
        <p type="p">CH:通道</p>
        <p type="p">MT:記憶胞電晶體</p>
        <p type="p">WL:字元線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="719" publication-number="202633086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260424B">H10B43/35</main-classification>
        <further-classification edition="200601120260424B">G11C8/04</further-classification>
        <further-classification edition="200601120260424B">G11C8/08</further-classification>
        <further-classification edition="200601120260424B">G11C8/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福岡諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUOKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下城義朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOJO, YOSHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明使記憶體裝置之積體度提高。  &lt;br/&gt;一實施方式之記憶體裝置具備：第1導電柱及第2導電柱，其等各自沿第1方向延伸，且沿與第1方向相交之第2方向排列；第1半導體層及第2半導體層，其等各自於第1方向上之第1位置，沿第2方向延伸，且兩者之間於與第1方向及第2方向相交之第3方向上隔著第1導電柱及上述第2導電柱；第1絕緣體膜，其於第1位置，設置於第1半導體層與第2半導體層之間且第1導電柱與第2導電柱之間，且於與第1半導體層及第2半導體層之對向面上，具有沿著以第1導電柱為中心之圓之第1部分；第1電荷儲存膜，其於第1位置，設置於第1導電柱與第1半導體層之間；及第2電荷儲存膜，其於第1位置，設置於第1導電柱與第2半導體層之間，且與第1電荷儲存膜分隔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL:位元線</p>
        <p type="p">CH:通道構造</p>
        <p type="p">INS:絕緣體</p>
        <p type="p">LU:層面單元</p>
        <p type="p">MS:記憶體構造</p>
        <p type="p">MT0~MT7:記憶單元電晶體</p>
        <p type="p">NS:NAND串</p>
        <p type="p">SL:源極線</p>
        <p type="p">SU0~SU3:串單元</p>
        <p type="p">TP,WP:導電柱</p>
        <p type="p">TT0~TT7:傳輸電晶體</p>
        <p type="p">TWL0~TWL7,WL0~WL7:字元線</p>
        <p type="p">V1,V2:接點</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="720" publication-number="202632489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123091</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器配置提示裝置及感測器配置提示方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250704B">G06F3/04815</main-classification>
        <further-classification edition="200601120250704B">G02B27/01</further-classification>
        <further-classification edition="202201120250704B">G06V20/20</further-classification>
        <further-classification edition="201701120250704B">G06T7/20</further-classification>
        <further-classification edition="201801120250704B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中道拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMICHI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沼田崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUMATA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊昂城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種根據欲計測之作業內容、作業環境、作業者等的變化來提示最佳的感測器配置之技術。具備：記憶部，存儲感測器資訊、和計測必要性分數；感測器配置候選生成部，根據感測器資訊生成感測器配置候選；可視性分數算出部，對每個感測器配置候選算出可視性分數；計測分數算出部，從計測必要性分數和可視性分數算出計測分數；配置決定部，基於計測分數，從感測器配置候選之中決定推薦感測器配置；以及配置提示部，將藉由配置決定部決定之推薦感測器配置提示給使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感測器配置提示裝置(感測器配置提示系統)</p>
        <p type="p">2:分析裝置</p>
        <p type="p">10:記憶部</p>
        <p type="p">11:模擬部</p>
        <p type="p">12:配置內容生成部</p>
        <p type="p">13:配置提示部</p>
        <p type="p">14:配置輸出部</p>
        <p type="p">101:作業資訊</p>
        <p type="p">102:感測器資訊</p>
        <p type="p">103:計測必要性分數</p>
        <p type="p">104:作業者資訊</p>
        <p type="p">105:作業環境資訊</p>
        <p type="p">106:過去作業者動作資訊</p>
        <p type="p">111:作業者動作再現部</p>
        <p type="p">112:裝置狀態再現部</p>
        <p type="p">113:感測器配置候選生成部</p>
        <p type="p">114:可視性分數算出部</p>
        <p type="p">115:計測分數算出部</p>
        <p type="p">116:配置決定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="721" publication-number="202632304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓測試系統及其操作方法</chinese-title>
        <english-title>WAFER TESTING SYSTEM AND OPERATING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260302B">G01R31/26</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妍臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林武震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝協宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIEH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶圓測試系統，包括一第一電路、一轉換器段路以及一測試系統。第一電路被配置為產生一射頻訊號，射頻訊號具有一第一振盪頻率。轉換器電路耦接至第一電路，被配置為接收射頻訊號，並將射頻訊號轉換為代表第一振盪頻率之一數值的第一電壓。第一電壓為一直流電壓。測試系統耦接至轉換器電路，被配置為接收第一電壓，並因應於第一電壓，對第一振盪頻率執行一晶圓接受測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer testing system includes a first circuit, a converter circuit and a testing system. The first circuit is configured to generate a radio frequency (RF) signal, the RF signal having a first oscillation frequency. The converter circuit is coupled to the first circuit, configured to receive the RF signal, and to convert the RF signal into a first voltage representative of a value of the first oscillation frequency. The first voltage is a direct current voltage. The testing system is coupled to the converter circuit, and configured to receive the first voltage, and to perform a wafer acceptance test (WAT) on the first oscillation frequency in response to the first voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:半導體晶圓/晶圓</p>
        <p type="p">102:測試結構</p>
        <p type="p">104:測試線組</p>
        <p type="p">110:焊墊</p>
        <p type="p">FO1:射頻訊號</p>
        <p type="p">VBIST:電壓</p>
        <p type="p">112:測試系統</p>
        <p type="p">120:測試裝置</p>
        <p type="p">122:探針卡</p>
        <p type="p">130:探針組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="722" publication-number="202631358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著帶切斷方法及黏著帶切斷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B26D5/00</main-classification>
        <further-classification edition="200601120260430B">B26D1/12</further-classification>
        <further-classification edition="202601120260430B">H10P54/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉越久倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIGOE, HISAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供不易在切割用黏著帶之切斷時產生鬍鬚狀殘渣。  &lt;br/&gt;沿著環形框架20之表面設定黏著帶62之切斷線CL。此切斷方法，包含：接刃步驟，其使旋轉刃40，接刃於在切斷線CL上從使旋轉刃40接刃之位置C0偏移既定距離後之接刃位置Cp；移動步驟，其以使旋轉刃40從接刃位置Cp朝向切斷線CL上之方式，使旋轉刃40與環形框架20相對移動；以及切斷步驟，其使旋轉刃40從切斷線CL上之起始點C0沿著切斷線CL繞行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:桌台</p>
        <p type="p">20:環形框架</p>
        <p type="p">40:切刀</p>
        <p type="p">62:黏著帶</p>
        <p type="p">C0:起始點</p>
        <p type="p">CL:切斷線</p>
        <p type="p">Cn:終點</p>
        <p type="p">Cp:接刃位置</p>
        <p type="p">L:軸線</p>
        <p type="p">Lc:切入長</p>
        <p type="p">Nc:切口</p>
        <p type="p">O:中心</p>
        <p type="p">Po:最低點</p>
        <p type="p">X0:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="723" publication-number="202633400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P95/00</main-classification>
        <further-classification edition="202601120260422B">H10P72/00</further-classification>
        <further-classification edition="202601120260422B">H10P50/60</further-classification>
        <further-classification edition="200601120260422B">G05B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永松辰也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMATSU, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示之一態樣的基板處理系統，具備將複數片基板整批處理的分批處理部、將上述基板一片一片處理的單片處理部、將上述基板從上述分批處理部收授至上述單片處理部的介面部、以及確認處理配方(recipe)的控制電路，上述介面部具有保持上述基板的基板保持部、以及向被保持在上述基板保持部上的上述基板之上面供給抑制上述上面之乾燥的處理液的處理液供給部，上述處理配方包含親液疏液設定部，和處理液設定部，上述親液疏液設定部具有對親液性的基板進行處理的親液設定，和對疏液性的基板進行處理的疏液設定作為設定項目，上述處理液設定部具有供給上述處理液的供給設定，和不供給上述處理液的非供給設定作為設定項目，上述控制電路確認上述親液疏液設定部的設定和上述處理液設定部的設定的一致性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理系統</p>
        <p type="p">2:搬入搬出部</p>
        <p type="p">3:第1介面部</p>
        <p type="p">4:分批處理部</p>
        <p type="p">5:第2介面部</p>
        <p type="p">6:單片處理部</p>
        <p type="p">9:控制電路</p>
        <p type="p">21:裝載埠</p>
        <p type="p">22:儲存器</p>
        <p type="p">23:裝載器</p>
        <p type="p">24:卡匣搬運裝置</p>
        <p type="p">31:基板移載裝置</p>
        <p type="p">31a:基板保持臂</p>
        <p type="p">32:批量形成部</p>
        <p type="p">33:第1收授台</p>
        <p type="p">41:藥液槽</p>
        <p type="p">42:沖洗液槽</p>
        <p type="p">43:第1搬運裝置</p>
        <p type="p">43a:導軌</p>
        <p type="p">43b:第1搬運臂</p>
        <p type="p">44:處理具</p>
        <p type="p">45:驅動裝置</p>
        <p type="p">51:浸漬槽</p>
        <p type="p">52:第2搬運裝置</p>
        <p type="p">52a:Y軸驅動裝置</p>
        <p type="p">52b:Z軸驅動裝置</p>
        <p type="p">52c:第2搬運臂</p>
        <p type="p">53:第3搬運裝置</p>
        <p type="p">53a:第3搬運臂</p>
        <p type="p">53b:攝像部</p>
        <p type="p">54:第2收授台</p>
        <p type="p">61:第4搬運裝置</p>
        <p type="p">61a:導軌</p>
        <p type="p">61b:第4搬運臂</p>
        <p type="p">61c:攝像部</p>
        <p type="p">62:液處理裝置</p>
        <p type="p">63:乾燥裝置</p>
        <p type="p">91:運算部</p>
        <p type="p">92:記憶部</p>
        <p type="p">W:基板</p>
        <p type="p">C:卡匣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="724" publication-number="202632344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光子裝置及其形成方法</chinese-title>
        <english-title>OPTICAL DEVICES AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G02B6/13</main-classification>
        <further-classification edition="200601120260130B">G02B6/124</further-classification>
        <further-classification edition="200601120260130B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒家翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIA-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括：形成光子積體電路，所述光子積體電路包括：第一波導；第二波導，在第一波導上方，其中第二波導光學耦合到第一波導；第一外部耦合器，光學耦合到第二波導；以及第一互連結構；將電子晶粒附著到光子積體電路的第一側；將第一光子晶粒直接接合到光子積體電路的第二側，其中第一光子晶粒在直接接合後光學耦合到第一波導；以及在第一光子晶粒和光子積體電路上方形成第二互連結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a photonic integrated circuit including: a first waveguide; a second waveguide over the first waveguide, wherein the second waveguide is optically coupled to the first waveguide; a first external coupler that is optically coupled to the second waveguide; and a first interconnect structure; attaching an electronic die to a first side of the photonic integrated circuit; direct bonding a first photonic die to a second side of the photonic integrated circuit, wherein the first photonic die is optically coupled to the first waveguide after the direct bonding; and forming a second interconnect structure over the first photonic die and the photonic integrated circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15、42:波導</p>
        <p type="p">16:光柵耦合器</p>
        <p type="p">18、44:介電層</p>
        <p type="p">20、60:互連結構</p>
        <p type="p">26:光子組件</p>
        <p type="p">30:電子晶粒</p>
        <p type="p">34、62:介電材料</p>
        <p type="p">36:支撐件</p>
        <p type="p">38:透鏡</p>
        <p type="p">40:光子積體電路</p>
        <p type="p">50:光偵測器晶粒</p>
        <p type="p">64:導通孔</p>
        <p type="p">65:導電特徵</p>
        <p type="p">66:導電連接件</p>
        <p type="p">100:光學引擎</p>
        <p type="p">101:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="725" publication-number="202633156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10D84/83</main-classification>
        <further-classification edition="202501120260428B">H10D64/23</further-classification>
        <further-classification edition="202501120260428B">H10D64/27</further-classification>
        <further-classification edition="202501120260428B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋映錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YOUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋昇炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雅煐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, AHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴容喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YONGHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金必光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, PILKWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芝洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔道永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, DOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置包括：第一奈米片材堆疊；第一源極/汲極，連接至第一奈米片材堆疊；第一接觸件，位於第一源極/汲極上；第二奈米片材堆疊；第二源極/汲極，連接至第二奈米片材堆疊；第二接觸件，位於第二源極/汲極上；以及絕緣層，位於第一奈米片材堆疊與第二奈米片材堆疊之間，其中第一接觸件包括在第一方向上延伸的第一接觸件本體以及自第一接觸件本體突出的第一接觸件突出部，第二接觸件包括在第一方向上延伸的第二接觸件本體及自第二接觸件本體突出的第二接觸件突出部，且第一接觸件突出部與第二接觸件突出部藉由位於第一接觸件突出部與第二接觸件突出部之間的絕緣層而在第一方向上彼此間隔開，且第一接觸件突出部及第二接觸件突出部中的每一者在第一方向上具有不對稱的形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device comprises: a first nanosheet stack; a first source/drain connected to the first nanosheet stack; a first contact on the first source/drain; a second nanosheet stack; a second source/drain connected to the second nanosheet stack; a second contact on the second source/drain; and an insulating layer between the first and second nanosheet stacks, wherein the first contact comprises a first contact body extending in a first direction and a first contact protrusion protruding from the first contact body, the second contact comprises a second contact body extending in the first direction and a second contact protrusion protruding from the second contact body, and the first contact protrusion and the second contact protrusion are spaced apart from each other with the insulating layer therebetween in the first direction and each of the first contact protrusion and the second contact protrusion has an asymmetrical shape in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路裝置</p>
        <p type="p">11:第一標準單元</p>
        <p type="p">12:第二標準單元</p>
        <p type="p">110:接觸件/第一接觸件</p>
        <p type="p">120:接觸件/第二接觸件</p>
        <p type="p">130:絕緣層/絕緣壁</p>
        <p type="p">130a、130b:絕緣壁</p>
        <p type="p">BD:邊界</p>
        <p type="p">CA:接觸件</p>
        <p type="p">CBD:單元邊界</p>
        <p type="p">GT:閘極電極</p>
        <p type="p">GT1:第一閘極電極</p>
        <p type="p">GT2:第二閘極電極</p>
        <p type="p">HM1:第一罩幕圖案</p>
        <p type="p">M1:金屬層/第一金屬層</p>
        <p type="p">M1a、M1b、M1c、M1d:第一金屬線</p>
        <p type="p">M1e、M1f、M1g、M1h:第二金屬線</p>
        <p type="p">NSS:奈米片材堆疊</p>
        <p type="p">VA:通孔</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">X1-X1'、X2-X2':線</p>
        <p type="p">Z:方向/垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="726" publication-number="202631396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B32B27/20</main-classification>
        <further-classification edition="200601120260423B">B32B9/00</further-classification>
        <further-classification edition="201901120260423B">B29C48/465</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸本武久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIMOTO, TAKEHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波元大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIMOTO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村潤一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, JUN-ICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的為提供一種不設置平坦化層而耐光性優異之積層體，及可效率佳地製造上述積層體之製造方法。本發明係關於一種積層體，其具有：含有色素之樹脂層、及位於該含有色素之樹脂層的兩面上的無機化合物層，該含有色素之樹脂層的兩面以原子力顯微鏡所測得之算術平均粗糙度Ra1皆為2.5nm以下，或2層該無機化合物層之表面以原子力顯微鏡所測得之算術平均粗糙度Ra2皆為2.3nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="727" publication-number="202633157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202501120260302B">H10D84/90</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周君易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例提供了半導體裝置結構及其形成方法。所述結構包括源極/汲極區、設置在源極/汲極區上方的接觸蝕刻停止層、設置在接觸蝕刻停止層上方的第一層間介電（interlayer dielectric, ILD）層、設置在接觸蝕刻停止層和第一層間介電層上方的蝕刻停止層、設置在蝕刻停止層上方的第二個層間介電層、設置在源極/汲極區下方的基板部分、以及設置相鄰於基板部分的隔離區。隔離區包括第一介電層，其包含第一介電材料和設置於第一介電層上的第二介電層。第二介電層包括不同於第一介電材料的第二介電材料。隔離區更包括設置在第一和第二介電層上的硬遮罩結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes a source/drain region, a contact etch stop layer disposed over the source/drain region, a first interlayer dielectric (ILD) layer disposed over the contact etch stop layer, an etch stop layer disposed over the contact etch stop layer and the first ILD layer, a second ILD layer disposed over the etch stop layer, a substrate portion disposed below the source/drain region, and an isolation region disposed adjacent the substrate portion. The isolation region includes a first dielectric layer including a first dielectric material and a second dielectric layer disposed on the first dielectric layer. The second dielectric layer includes a second dielectric material different from the first dielectric material. The isolation region further includes a hard mask structure disposed on the first and second dielectric layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基板</p>
        <p type="p">106:半導體層</p>
        <p type="p">138:間隔物</p>
        <p type="p">144:介電間隔物</p>
        <p type="p">146:源極/汲極區</p>
        <p type="p">150:半導體層</p>
        <p type="p">152:介電層</p>
        <p type="p">153,154:磊晶層</p>
        <p type="p">162:接觸蝕刻停止層</p>
        <p type="p">163,206,226:層間介電層</p>
        <p type="p">168:界面層</p>
        <p type="p">170:閘極介電層</p>
        <p type="p">172:閘極電極層</p>
        <p type="p">182:矽化物層</p>
        <p type="p">222,224:蝕刻停止層</p>
        <p type="p">228:導電部件</p>
        <p type="p">X,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="728" publication-number="202631099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61F13/514</main-classification>
        <further-classification edition="200601120260504B">A61F13/515</further-classification>
        <further-classification edition="200601120260504B">A61F13/539</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>與那霸獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONAHA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東莉菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田芽依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種吸收性物品，具有不透液性的背片、及被配置於前述背片的肌膚側之肌膚側構造部；前述肌膚側構造部，包含被直接配置於前述背片的肌膚側之吸收體部、及被配置於前述吸收體部的肌膚側之透液性的頂片；具有由前述背片與前述肌膚側構造部沒有固定而成的非固定區域；在前述非固定區域中的前述背片與前述肌膚側構造部可相對滑動；在前述背片與前述肌膚側構造部在寬度方向上相對移動了的情況，前述背片具有至少自肌膚側觀看的可識別為變形、出現或消失的標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸收性物品</p>
        <p type="p">3:頂片</p>
        <p type="p">4:吸收體部</p>
        <p type="p">7:側片</p>
        <p type="p">8:固定區域</p>
        <p type="p">9:非固定區域</p>
        <p type="p">bd:吸收體部本體(本體)</p>
        <p type="p">k:橫方向的長度(長度)</p>
        <p type="p">Q:體液排出口對向部</p>
        <p type="p">W:翼</p>
        <p type="p">CL:前後方向中心線(中心線)</p>
        <p type="p">D1:前後方向(長邊方向)</p>
        <p type="p">D2:寬度方向(橫方向)</p>
        <p type="p">E1:前方區域</p>
        <p type="p">C:中央區域</p>
        <p type="p">E2:後方區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="729" publication-number="202632604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123895</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物件動態偵測裝置、方法及非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>OBJECT MOVEMENT DETECTION APPARATUS, METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250801B">G06T7/70</main-classification>
        <further-classification edition="201701120250801B">G06T7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許友惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件動態偵測裝置、方法及非暫態電腦可讀取儲存媒體。計算一目標物件的一偵測目標姿態以及一參考物件的一偵測參考姿態之間的一偵測相對姿態，其中該偵測目標姿態以及該偵測參考姿態係在該目標物件處於一偵測狀態時所量測；以及響應於該偵測相對姿態和一初始相對姿態之間的一第一差異大於一第一閾值，判斷該目標物件被拿取並將該目標物件設定為一拿取狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object movement detection apparatus, method, and non-transitory computer readable storage medium are provided. The apparatus calculates a detected reference pose corresponding to the target object and the reference object when the target object is in a detecting state. In response to a difference between the detected reference pose and an initial reference pose being greater than a threshold, the apparatus determines that the target object is held.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P101,P103,P105,P107,P109:運作</p>
        <p type="p">A,B,C:節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="730" publication-number="202632217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學檢查裝置及其控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01B11/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, TOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島野健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川大路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, HIROMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供即使是在對試料的照射光和對參照鏡的照射光的空間上的強度分布存在差異的情況下，仍可正確求取包覆試料的膜之膜厚的光學檢査裝置和其控制方法。一種光學檢査裝置，具備：光源，將光射出；分束器，將從前述光源射出的光分歧成朝向試料的第一照射光和朝向參照鏡的第二照射光；干涉光測量部，測量前述第一照射光在前述試料的反射光亦即物體光和前述第二照射光在前述參照鏡的反射光亦即參照光所致之干涉光；以及控制部，對各部進行控制，其特徵為：該光學檢査裝置，進一步具備：物體光測量部，僅測量前述物體光的強度；以及記憶部，儲存藉由前述物體光測量部所事先測量的基準試料之前述物體光的強度，前述控制部，根據前述基準試料的前述物體光的強度；以及藉由前述物體光測量部所測量的觀察試料的前述物體光的強度，求取包覆前述觀察試料之膜的膜厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學檢查裝置</p>
        <p type="p">101:光源</p>
        <p type="p">102:擴束器</p>
        <p type="p">103:分束器</p>
        <p type="p">104:物鏡</p>
        <p type="p">105:試料</p>
        <p type="p">106:參照鏡</p>
        <p type="p">107:鏡驅動部</p>
        <p type="p">108:成像透鏡</p>
        <p type="p">109:干涉光測量部</p>
        <p type="p">110:半鏡</p>
        <p type="p">111:光測量部</p>
        <p type="p">120:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="731" publication-number="202633145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202501120260302B">H10D84/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛敬涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, CHING HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昭郡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JAU-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石健學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHIEN-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種半導體裝置及其形成方法。在半導體裝置的互連層中的互連結構的最底層之上形成導電材料的層，並且蝕刻導電材料的層以從導電材料的層限定金屬化結構的最底層。為了降低互連層中互連結構的最底層和金屬化結構的最底層之間的接觸電阻，可以以選擇性方式形成黏合層，使得黏合層僅形成在下面的電介質層上，而不形成在互連結構的最底層上。可以使用選擇性地形成在互連結構的最底層上的阻擋層來實現黏合層的選擇性沉積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A layer of conductive material is formed above a bottom-most layer of interconnect structures in an interconnect layer of a semiconductor device, and the layer of conductive material is etched to define the bottom-most layer of metallization structures from the layer of conductive material. To reduce contact resistance between the bottom-most layer of interconnect structures and the bottom-most layer of metallization structures in the interconnect layer, an adhesion layer may be formed in a selective manner so that the adhesion layer is formed only on an underlying dielectric layer and not on the bottom-most layer of interconnect structures. Selective deposition of the adhesion layer may be achieved using a blocking layer that is selectively formed on the bottom-most layer of interconnect structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:裝置層</p>
        <p type="p">104:互連層</p>
        <p type="p">106:基板層</p>
        <p type="p">108:電介質層</p>
        <p type="p">110:積體電路裝置</p>
        <p type="p">112:源極/汲極區域</p>
        <p type="p">114:閘極電介質層</p>
        <p type="p">116:閘極結構</p>
        <p type="p">118:通道層</p>
        <p type="p">120a:側壁間隔件</p>
        <p type="p">120b:內部間隔件</p>
        <p type="p">122:源極/汲極接觸件結構</p>
        <p type="p">124:襯裡層</p>
        <p type="p">126:ILD層</p>
        <p type="p">128:ESL</p>
        <p type="p">130a~130e:層</p>
        <p type="p">132a~132e:層</p>
        <p type="p">134:源極/汲極互連結構</p>
        <p type="p">136:閘極互連結構</p>
        <p type="p">138:黏合層</p>
        <p type="p">140:金屬層</p>
        <p type="p">142:隔離區域</p>
        <p type="p">144:金屬化結構</p>
        <p type="p">146:空氣間隔件</p>
        <p type="p">148:電介質插塞</p>
        <p type="p">150:支撐層/支撐層</p>
        <p type="p">152:襯裡</p>
        <p type="p">154:互連結構</p>
        <p type="p">156:金屬化結構</p>
        <p type="p">158:襯裡層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="732" publication-number="202631455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貼紙卷承載架</chinese-title>
        <english-title>STICKER ROLL CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">B65C9/00</main-classification>
        <further-classification edition="200601120260129B">B65C9/04</further-classification>
        <further-classification edition="200601120260129B">B65C9/18</further-classification>
        <further-classification edition="200601120260129B">B65C9/26</further-classification>
        <further-classification edition="200601120260129B">B65C9/30</further-classification>
        <further-classification edition="200601120260129B">B65C9/34</further-classification>
        <further-classification edition="200601120260129B">B65C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市小慣科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN SMALL HABIT TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王天龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIAN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳紹良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種貼紙卷承載架，用以承載具一中部定位孔的一貼紙卷，可以快拆安裝於一貼紙分發機的內部；該貼紙卷承載架，包括一承載架下蓋板、一承載架上蓋板以及一套接柱，該套接柱用以提供該中部定位孔套設安裝；該套接柱和該貼紙卷位於該承載架下蓋板和該承載架上蓋板之間，該貼紙卷包括可捲繞的一襯紙和可剝離地粘貼在該襯紙上的該貼紙，該襯紙和該貼紙由該襯紙的一端沿該中部定位孔捲繞成該貼紙卷，其中該貼紙位在該貼紙卷外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sticker roll carrier is used to carry a sticker roll with a central positioning hole, and can be quickly disassembled and installed inside a sticker dispensing machine; the sticker roll carrier comprises a carrier lower cover plate, a carrier upper cover plate and a sleeve column, the sleeve column is used to provide the central positioning hole for sleeve installation; the sleeve column and the sticker roll are located between the carrier lower cover plate and the carrier upper cover plate, the sticker roll comprises a rollable backing paper and the sticker peelable attached to the backing paper, the backing paper and the sticker are rolled up into the sticker roll by one end of the backing paper along the central positioning hole, wherein the sticker is located outside the sticker roll.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:殼體</p>
        <p type="p">311:插接定位部</p>
        <p type="p">312:卡接固定部</p>
        <p type="p">32:上蓋</p>
        <p type="p">322:彈性卡扣部</p>
        <p type="p">342:定位柱</p>
        <p type="p">81:貼紙卷</p>
        <p type="p">9:貼紙卷承載架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="733" publication-number="202633454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W70/01</main-classification>
        <further-classification edition="202601120260424B">H10W70/63</further-classification>
        <further-classification edition="202601120260424B">H10W72/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茹立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許博雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PO-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃進明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高克毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, KER-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置包括基板、接合元件、第一電子單元、導電元件、電路結構以及連接元件。基板包括在第一方向上彼此相對的第一表面和第二表面，其中基板包括凹槽以及貫穿第一表面和第二表面的穿孔。接合元件設置在凹槽中。第一電子單元設置在凹槽中且通過接合元件接合至基板上。導電元件設置在穿孔中且電性連接至第一電子單元。電路結構設置在基板的第一表面上且電性連接第一電子單元和導電元件。連接元件設置在導電元件上，其中接合元件的再流焊溫度高於連接元件的再流焊溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction, a cavity, and a through-hole penetrating the first and second surfaces, a bonding element disposed in the cavity, a first electronic unit disposed in the cavity and bonded onto the substrate through the bonding element, a conductive element disposed in the through-hole and electrically connected to the first electronic unit, a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element, and a connection element disposed on the conductive element, wherein a reflow temperature of the bonding element is higher than a reflow temperature of the connection element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:基板</p>
        <p type="p">100c、100d:凹槽</p>
        <p type="p">100m:標記</p>
        <p type="p">100s1:第一表面</p>
        <p type="p">100s2:第二表面</p>
        <p type="p">100tv:穿孔</p>
        <p type="p">110:導電元件</p>
        <p type="p">110a:晶種層</p>
        <p type="p">110b:導電層</p>
        <p type="p">120:接合墊</p>
        <p type="p">130:基礎層</p>
        <p type="p">130p:接合墊</p>
        <p type="p">140:第二電子元件</p>
        <p type="p">140p:連接墊</p>
        <p type="p">BE1、BE1’:接合元件</p>
        <p type="p">CE1:連接元件</p>
        <p type="p">CS1:電路結構</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <p type="p">EU1:第一電子單元</p>
        <p type="p">EU2:第二電子單元</p>
        <p type="p">IL1:絕緣層</p>
        <p type="p">ML1:封裝層</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">WS1:配線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="734" publication-number="202632235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓處理裝置及晶圓處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260302B">G01J5/00</main-classification>
        <further-classification edition="200601120260302B">G01K11/00</further-classification>
        <further-classification edition="202601120260302B">H10P34/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋永啓佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKINAGA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高妻豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUZUMA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武居亜紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEI, AKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏瑋璘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, WEILIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的，係在於提供一種「在藉由電磁波所致之加熱進行晶圓的處理之晶圓處理裝置中，可對多種膜種類的晶圓有效率且精度良好地實施溫度測定，並可實現產品品質良好的處理」之技術。&lt;br/&gt;因此，本發明之晶圓處理裝置，係具備有：處理室，被配置於真空容器內部；晶圓平台，被配置於處理室內，處理對象的晶圓被載置於其上面；燈，被配置於晶圓平台上方，將電磁波放射至包含晶圓平台的處理室內部；電磁波透過體，被配置為能夠在晶圓平台的內部移動，使電磁波透過；及檢測器，接收已透過晶圓及電磁波透過體之電磁波，從接收光譜檢測晶圓的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">103:晶圓</p>
        <p type="p">104:晶圓平台</p>
        <p type="p">132-1:銷</p>
        <p type="p">132-2:銷</p>
        <p type="p">133:驅動軸</p>
        <p type="p">134:驅動機構</p>
        <p type="p">135:受光器</p>
        <p type="p">136:光纖</p>
        <p type="p">137:分光器</p>
        <p type="p">138:光檢測器</p>
        <p type="p">139:控制器</p>
        <p type="p">140:溫度檢測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="735" publication-number="202632785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相位陣列天線裝置及其天線單元</chinese-title>
        <english-title>PHASE ARRAY ANTENNA DEVICE AND ANTENNA UNIT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">H01Q15/02</main-classification>
        <further-classification edition="200601120251001B">H01Q21/06</further-classification>
        <further-classification edition="200601120251001B">H01Q3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星相科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHASETRUM INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡作敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, ZUO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡忠旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUNG-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種相位陣列天線裝置及其天線單元。天線單元包括一天線輻射件以及一極化選擇電路。該極化選擇電路經組態以將輸入信號轉換為第一輸出信號及/或第二輸出信號並饋送至該天線輻射件，以產生線極化或圓極化電磁波而由該天線輻射件向外輻射。其中該第一輸出信號與該第二輸出信號的相位差為90°。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phase array antenna device and a plurality of antennas thereof are disclosed. Each of the antennas includes an antenna radiation element and a polarization selection circuit. The polarization selection circuit is configured to convert an input signal to a first output signal and/or a second output signal. The first output signal and/or the second output signal is fed to the antenna radiation element so as to generate linearly polarized electromagnetic waves or circularly polarized electromagnetic waves which are radiated out by the antenna radiation element. The phase difference between the first output signal and the second output signal is 90°</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:極化選擇電路</p>
        <p type="p">15:天線輻射件</p>
        <p type="p">141、142:可變增益放大器</p>
        <p type="p">143:耦合器</p>
        <p type="p">144、145:功率放大器</p>
        <p type="p">S1:輸入信號</p>
        <p type="p">S2、S3:第一中間信號</p>
        <p type="p">S4、S5:第二中間信號</p>
        <p type="p">S6:第一輸出信號</p>
        <p type="p">S7:第二輸出信號</p>
        <p type="p">P1、P2:輸入埠</p>
        <p type="p">P3、P4:輸出埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="736" publication-number="202631589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>HDAC抑制劑之多晶型及其製造方法及應用</chinese-title>
        <english-title>POLYMORPHISM OF HDAC INHIBITOR AND MANUFACTURING METHOD AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D239/91</main-classification>
        <further-classification edition="200601120260504B">A61K31/517</further-classification>
        <further-classification edition="200601120260504B">A61P25/02</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安基生技新藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANNJI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴信羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SHIN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李展榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAN JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大體上關於組蛋白去乙醯酶(histone deacetylase；HDAC)抑制劑之固態形式及包含該等固態結晶形式及醫藥學上可接受之賦形劑的醫藥組合物，以及用於製備及使用該等固態形式及其醫藥組合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to solid state forms of an histone deacetylases (HDACs) inhibitor and pharmaceutical compositions comprising the solid state crystalline forms and pharmaceutically acceptable excipients, and methods for preparing and using the solid state forms and the pharmaceutical compositions thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="737" publication-number="202631943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性接著劑組合物、感光性接著劑乾式膜、圖案形成方法、及積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C09J163/00</main-classification>
        <further-classification edition="200601120260422B">B32B27/00</further-classification>
        <further-classification edition="200601120260422B">B32B27/30</further-classification>
        <further-classification edition="200601120260422B">C09J133/00</further-classification>
        <further-classification edition="200601120260422B">G03F7/004</further-classification>
        <further-classification edition="200601120260422B">G03F7/32</further-classification>
        <further-classification edition="200601120260422B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤遥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明採用一種感光性接著劑組合物，其含有丙烯酸系樹脂、含環氧基化合物(其中，相當於丙烯酸系樹脂者除外)、及光陽離子聚合起始劑。丙烯酸系樹脂具有自包含與羧基(-COOH)反應之官能基之丙烯酸系單體衍生之結構單元，玻璃轉移溫度為0℃以下，且重量平均分子量為20萬以上。藉由該感光性接著劑組合物，能夠將透明基板與其他基板貼合，貼附時不易引起透明基板之白化，且於形成圖案時可實現良好之解像性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="738" publication-number="202633118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及形成其之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/60</main-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUEH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游家齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭威慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WEI-QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝瑞夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUI FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳臆仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">說明了一半導體裝置結構及形成其之方法。該方法包括：在一基體上方形成一鰭片結構；在該鰭片結構之一部分上形成一犧牲閘極結構；以及使該鰭片結構之一暴露部分凹入以形成一源極/汲極凹部。該鰭片結構之該暴露部分係藉由一循環蝕刻程序凹入，該循環蝕刻程序包括施行複數個循環，且每一循環包括一電漿形成階段、一蝕刻階段及一清除階段。該源極/汲極凹部之一形狀係藉由調整該清除階段之一持續時間對該等電漿形成及蝕刻階段之一持續時間的一比率來控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device structure and methods of forming the same are described. The method includes forming a fin structure over a substrate, forming a sacrificial gate structure on a portion of the fin structure, and recessing an exposed portion of the fin structure to form a source/drain recess. The exposed portion of the fin structure is recessed by a cyclic etching process, the cyclic etching process includes performing a plurality of cycles, and each cycle includes a plasma formation stage, an etch stage, and a purge stage. A shape of the source/drain recess is controlled by adjusting a ratio of a time duration of the purge stage to a time duration of the plasma formation and etch stages.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構，半導體裝置</p>
        <p type="p">101:基體</p>
        <p type="p">106:第一半導體層，半導體層</p>
        <p type="p">108:第二半導體層，半導體層</p>
        <p type="p">112:鰭片結構</p>
        <p type="p">116:基體部分</p>
        <p type="p">118:絕緣材料</p>
        <p type="p">120:隔離區</p>
        <p type="p">130:犧牲閘極結構</p>
        <p type="p">132:犧牲閘極介電層</p>
        <p type="p">134:犧牲閘極電極層</p>
        <p type="p">136:遮罩層</p>
        <p type="p">A-A,B-B:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="739" publication-number="202633158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D30/62</further-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="202601120260424B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴雨錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WOO SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具齊亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, JE HYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍煕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一下部圖案，其包括一第一側壁及一第二側壁，一通道分開結構，其包括一核心分開圖案及一襯裡分開圖案，該襯裡分開圖案沿著該核心分開圖案之側壁延伸；一場絕緣膜，其接觸該下部圖案之該第二側壁，一通道圖案，其安置於該下部圖案上，以及一源極/汲極圖案，其接觸該通道圖案及該通道分開結構。該核心分開圖案包括一第一部分、一第二部分及一連接部分，該核心分開圖案之該連接部分安置於該核心分開圖案之該第一部分與該第二部分之間，且該核心分開圖案之該側壁在該連接部分處之一斜率小於該側壁在該第一部分處之一斜率及在該第二部分處之一斜率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a lower pattern including a first sidewall and a second sidewall, a channel separation structure including a core separation pattern and a liner separation pattern, the liner separation pattern extending along sidewalls of the core separation pattern, a field insulating film contacting the second sidewall of the lower pattern, a channel pattern disposed on the lower pattern, and a source/drain pattern contacting the channel pattern and the channel separation structure. The core separation pattern includes a first portion, a second portion, and a connection portion, the connection portion of the core separation pattern is disposed between the first and second portions of the core separation pattern, and a slope of the sidewall of the core separation pattern at the connection portion is smaller than a slope at the first portion and a slope of the sidewall at the second portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一基體</p>
        <p type="p">100BS:第二表面</p>
        <p type="p">100US:第一表面</p>
        <p type="p">105:場絕緣膜</p>
        <p type="p">105BS:底部表面</p>
        <p type="p">105US,BP1_US,BP2_US,BP3_US,BP4_US,CCW1_US,CCW2_US(161_US),GCS_US:上表面</p>
        <p type="p">120:第一閘極電極</p>
        <p type="p">130:第一閘極絕緣膜</p>
        <p type="p">145:第一閘極覆蓋圖案</p>
        <p type="p">161:第一核心分開圖案</p>
        <p type="p">161_SW:側壁</p>
        <p type="p">163:襯裡分開圖案</p>
        <p type="p">220:第二閘極電極</p>
        <p type="p">230:第二閘極絕緣膜</p>
        <p type="p">320:第三閘極電極</p>
        <p type="p">330:第三閘極絕緣膜</p>
        <p type="p">345:第二閘極覆蓋圖案</p>
        <p type="p">420:第四閘極電極</p>
        <p type="p">430:第四閘極絕緣膜</p>
        <p type="p">BP1:第一下部圖案</p>
        <p type="p">BP1_SW1:第一側壁</p>
        <p type="p">BP1_SW2:第二側壁</p>
        <p type="p">BP2:第二下部圖案</p>
        <p type="p">BP3:第三下部圖案</p>
        <p type="p">BP4:第四下部圖案</p>
        <p type="p">C-C:線</p>
        <p type="p">CCW1:第一通道分開結構</p>
        <p type="p">CCW2:第二通道分開結構</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">CH1:第一通道圖案、通道圖案</p>
        <p type="p">CH2:第二通道圖案、通道圖案</p>
        <p type="p">CH3:第三通道圖案、通道圖案</p>
        <p type="p">CH4:第四通道圖案、通道圖案</p>
        <p type="p">FT:鰭式溝槽</p>
        <p type="p">GCS:閘極分開結構</p>
        <p type="p">GS1:第一閘極結構</p>
        <p type="p">GS2:第二閘極結構</p>
        <p type="p">GS3:第三閘極結構</p>
        <p type="p">GS4:第四閘極結構</p>
        <p type="p">H11,H12,H13:深度</p>
        <p type="p">H14:高度</p>
        <p type="p">NS1:第一片材圖案</p>
        <p type="p">NS2:第二片材圖案</p>
        <p type="p">NS3:第三片材圖案</p>
        <p type="p">NS4:第四片材圖案</p>
        <p type="p">Q:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="740" publication-number="202633159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10D84/01</further-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="201101120260424B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯部康裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼木悠丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONIKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，其特徵為：  &lt;br/&gt;　　具有多個全周閘極電晶體，該等電晶體具備：  &lt;br/&gt;　　奈米片層疊體，其層疊由半導體材料構成的多個奈米片層；  &lt;br/&gt;　　源極/汲極，其在前述奈米片層疊體的兩側連接於前述奈米片層而設置；及  &lt;br/&gt;　　閘極電極，其隔著閘極絕緣膜來覆蓋前述奈米片層的全周，  &lt;br/&gt;　　前述多個全周閘極電晶體是包含前述源極/汲極之間的閘極長不同的多種類，  &lt;br/&gt;　　前述各全周電晶體的前述奈米片層是具有按照閘極長而不同的片膜厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:全周閘極電晶體</p>
        <p type="p">11:第一全周閘極電晶體</p>
        <p type="p">12:第二全周閘極電晶體</p>
        <p type="p">13:第三全周閘極電晶體</p>
        <p type="p">100:半導體基板</p>
        <p type="p">100a:元件分離</p>
        <p type="p">102:奈米片層</p>
        <p type="p">102sd:源極/汲極</p>
        <p type="p">103:奈米片層疊體</p>
        <p type="p">200:閘極絕緣膜</p>
        <p type="p">201:閘極電極</p>
        <p type="p">L,L1~L3:閘極長</p>
        <p type="p">T,T1~T3:片膜厚</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="741" publication-number="202632458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓產生電路、電壓參考電路及其操作方法</chinese-title>
        <english-title>VOLTAGE GENERATING CIRCUIT, VOLTAGE REFERENCE CIRCUIT, AND METHOD FOR OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G05F3/16</main-classification>
        <further-classification edition="200601120251001B">G05F1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張清河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏楚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIA, CHU-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任慶霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN, CHING LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭永州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YUNG-CHOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種電壓參考電路，其包含一第一電壓源及一第二電壓源。該第一電壓源經組態以產生隨該電壓參考電路之一絕對溫度單調減小之一第一電壓。該第二電壓源經組態以產生隨該電壓參考電路之該絕對溫度單調增大之一第二電壓。該第二電壓用該第一電壓補償以產生一參考電壓。該第一電壓源包含一第一溫度敏感裝置及一第二溫度敏感裝置。該第一溫度敏感裝置屬於一第一類型且該第二溫度敏感裝置屬於一第二類型。此等裝置配置成一疊接結構。該第一電壓源之一輸出端子處之該第一電壓等於跨該第一溫度敏感裝置之一第三電壓加上跨該第二溫度敏感裝置之一第四電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage reference circuit is provided, which includes a first voltage source and a second voltage source. The first voltage source is configured to generate a first voltage which monotonically decreases with an absolute temperature of the voltage reference circuit. The second voltage source is configured to generate a second voltage, which monotonically increases with the absolute temperature of the voltage reference circuit. The second voltage is compensated with the first voltage to generate a reference voltage. The first voltage source includes a first temperature-sensitive device and a second temperature-sensitive device. The first temperature-sensitive device is of a first type, and the second temperature-sensitive device is of a second type. These devices are arranged in a cascode structure. The first voltage at an output terminal of the first voltage source equals to a third voltage across the first temperature-sensitive device plus a fourth voltage across the second temperature-sensitive device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300A:電壓源</p>
        <p type="p">Ibias:偏置電流</p>
        <p type="p">MN1:電晶體</p>
        <p type="p">MP1:電晶體</p>
        <p type="p">N1:節點</p>
        <p type="p">N2:節點</p>
        <p type="p">N3:節點</p>
        <p type="p">V1:電壓</p>
        <p type="p">VCTATN:電壓</p>
        <p type="p">VCTATP:電壓</p>
        <p type="p">VSS:參考電壓/接地電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="742" publication-number="202632622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲繞體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G09F9/30</main-classification>
        <further-classification edition="200601120260422B">G02F1/1333</further-classification>
        <further-classification edition="200601120260422B">G02F1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名田敬之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠抑制光學積層體於捲繞軸之端部貼附的光學積層體之捲繞體。  &lt;br/&gt;本發明之捲繞體係將光學積層體捲繞而成之捲繞體。光學積層體具有基材層、形成於基材層之硬化性組合物之硬化物層、及形成於基材層之與硬化物層側相反之側之光吸收各向異性層。光吸收各向異性層含有聚合性液晶化合物之聚合物及二色性色素，且於相對於光吸收各向異性層之平面垂直之方向具有光吸收軸。於與光學積層體之捲繞方向正交之剖面，將基材層之寬度設為A，將硬化物層之寬度設為B，將光吸收各向異性層之寬度設為C時，滿足下述式(1)～(3)之關係。  &lt;br/&gt;0.90≤B/C≤1.10       (1)  &lt;br/&gt;0.90≤B/A＜1.00     (2)  &lt;br/&gt;0.88≤C/A＜1.00     (3)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學積層體</p>
        <p type="p">11:基材層</p>
        <p type="p">12:硬化物層</p>
        <p type="p">15:光吸收各向異性層</p>
        <p type="p">A:寬度</p>
        <p type="p">B:寬度</p>
        <p type="p">C:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="743" publication-number="202633129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125248</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路與其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周君易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮家馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNG, KA-HING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路包括基板，其具有第一主動區、第二主動區、與第三主動區延伸於第一方向中。第一主動區與第二主動區的距離小於第二主動區與第三主動區的距離。第一隔離結構位於第一主動區與第二主動區之間並沿著第一主動區與第二主動區的側部延伸。第二隔離結構位於第二主動區與第三主動區之間並沿著第二主動區與第三主動區的側部延伸。第一隔離結構與第二隔離結構的組成不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit includes a substrate having first, second, and third active regions extending in a first direction. The first and second active regions are closer together than are the second and third active regions. A first isolation structure is between and extends alongside the first active region and the second active region. A second isolation structure is between and extends alongside the second active region and the third active region. The first and second isolation structures have different compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">102:基板</p>
        <p type="p">105:通道</p>
        <p type="p">118,120,122,128,130:介電層</p>
        <p type="p">124a,124b:隔離結構</p>
        <p type="p">156:界面閘極介電層</p>
        <p type="p">158:閘極介電層</p>
        <p type="p">160:閘極金屬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="744" publication-number="202631475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動搬送設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">B65G47/90</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井澤彰太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZAWA, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島明男
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASHIMA, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">自動搬送設備(11)具備：  &lt;br/&gt;　　拆包裝置(12)，其用以拆開收納於容器(3)中的包裝體(2)；  &lt;br/&gt;　　包裝裝置(13)，其用以包裝貨物(4)而將包裝體(2)收納於容器(3)中；  &lt;br/&gt;　　第一共有路徑(31)，其作為將容器(3)和包裝體(2)搬入至拆包裝置(12)之中的第一路徑(21)與將容器(3)和包裝體(2)搬出至包裝裝置(13)之外的第二路徑(22)的共有部分；  &lt;br/&gt;　　第二共有路徑(32)，其作為第一路徑(21)與從拆包裝置(12)搬出容器(3)的第三路徑(23)的共有部分；及  &lt;br/&gt;　　第三共有路徑(33)，其作為第二路徑I(22)與將容器(3)搬入至包裝裝置(13)的第四路徑(24)的共有部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:搬送物</p>
        <p type="p">3:通箱(容器)</p>
        <p type="p">4:FOSB(貨物)</p>
        <p type="p">11:自動搬送設備</p>
        <p type="p">12:拆包裝置</p>
        <p type="p">12a:搬入出口</p>
        <p type="p">13:包裝裝置</p>
        <p type="p">13a:搬入出口</p>
        <p type="p">14:空通箱儲架</p>
        <p type="p">15:第一輸送帶裝置</p>
        <p type="p">16:第二輸送帶裝置</p>
        <p type="p">17:連接部</p>
        <p type="p">18:第一穿梭裝置</p>
        <p type="p">19:第二穿梭裝置</p>
        <p type="p">20:搬送裝置</p>
        <p type="p">21:第一路徑</p>
        <p type="p">22:第二路徑</p>
        <p type="p">23:第三路徑</p>
        <p type="p">24:第四路徑</p>
        <p type="p">31:第一共有路徑</p>
        <p type="p">32:第二共有路徑</p>
        <p type="p">33:第三共有路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="745" publication-number="202632825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣開閉裝置</chinese-title>
        <english-title>INSULATED SWITCHGEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250715B">H02B13/025</main-classification>
        <further-classification edition="200601120250715B">H02B13/035</further-classification>
        <further-classification edition="200601120250715B">H02B13/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上直明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NAOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西園寺嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIONJI, REI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">絕緣開閉裝置(100)係在導電性的密封容器內(10、11)配設有構成具有開閉器(4A、4B、4C、5)之主電路的導體部(7A、7B、7C、8)；密封容器(10、11)係構成為：將絕緣構件(20)設置於會在該密封容器(10、11)內產生且從導體部(7A、7B、7C、8)朝向構成該密封容器(10、11)之壁部放電的電弧之放電方向的壁部中所設定之第一區域(R1)的內壁側，且將電弧誘導至未設置有絕緣構件(20)之壁部的第二區域(R2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An insulated switchgear (100) has conductor parts (7A, 7B, 7C, 8) disposed in conductive sealed containers (10, 11), with the conductor parts (7A, 7B, 7C, 8) constituting a main circuit having switches (4A, 4B, 4C, 5). The sealed containers (10, 11) are configured such that an insulating member (20) is provided on the inner wall side of a first region (R1) set in a wall portion in a discharge direction of an arc that occurs inside the sealed containers (10, 11) and discharges from the conductor parts (7A, 7B, 7C, 8) toward the wall portion constituting the sealed containers (10, 11), and the arc is guided to a second region (R2) of the wall portion where the insulating member (20) is not provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:斷路器用密封容器(密封容器)</p>
        <p type="p">4:斷路器接地開閉器(開閉器)</p>
        <p type="p">6:絕緣套管</p>
        <p type="p">7:纜線</p>
        <p type="p">8:母線(導體部)</p>
        <p type="p">20:絕緣板(絕緣構件)</p>
        <p type="p">100:氣體絕緣開閉裝置(絕緣開閉裝置)</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="746" publication-number="202632345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125531</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/136</main-classification>
        <further-classification edition="200601120260302B">G02B6/122</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭禮賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, LEE-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾國方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KUO-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施啟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, YINGKIT FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一些實施例，一種形成一半導體結構之方法包含：對一基板執行一第一蝕刻，其中該基板包含沿著一第一方向依序配置以界定五個區帶之六個剖面，其中該第一蝕刻形成自該第一區帶延伸至該第五區帶之一第一突部區及在該第一突部區之兩側上之兩個第一連接區；對該兩個第一連接區執行一第二蝕刻以沿著第六剖面形成一條形波導；對該兩個第一連接區執行一第三蝕刻以沿著第三剖面形成一肋形波導；及對該兩個第一連接區執行一第四蝕刻以沿著第一剖面形成一深肋形波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor structure includes: performing a first etch on a substrate, wherein the substrate includes six cross sections arranged in sequence to define five zones along a first direction, wherein the first etch forms a first protrusion region extending from the first to fifth zones and two first connecting regions on two sides of the first protrusion region; performing a second etch on the two first connecting regions to form a strip waveguide along the sixth cross section; performing a third etch on the two first connecting regions to form a rib waveguide along the third cross section; and performing a fourth etch on the two first connecting regions to form a deep-rib waveguide along the first cross section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體波導裝置</p>
        <p type="p">102:介電質層</p>
        <p type="p">104:矽層</p>
        <p type="p">106:硬遮罩層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="747" publication-number="202633252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃于芹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡佑丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志壕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製程在層間介電層中形成交替的第一金屬線及第二金屬線。第一微影及蝕刻製程在圖案化層中形成溝槽。複數介電間隔物形成於溝槽的側壁上。第二微影及蝕刻製程基於介電間隔物在層間介電層與圖案化層之間的硬遮罩層中形成第一金屬線的圖案。第三微影及蝕刻製程基於介電間隔物在硬遮罩層中形成第二金屬線的圖案。然後藉由蝕刻製程將第一金屬線及第二金屬線的圖案作為層間介電層中的溝槽轉印至層間介電層。然後藉由在層間介電層中的溝槽中沉積金屬材料來同時形成第一組金屬線及第二組金屬線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process forms alternating first and second metal lines in an interlevel dielectric layer. A first photolithography and etching process forms trenches in a patterning layer. A plurality of dielectric spacers are formed on sidewalls of the trenches. A second photolithography and etching process forms a pattern of the first metal lines in a hard mask layer between the interlevel dielectric layer and the patterning layer based on the dielectric spacers. A third photolithography and etching process forms a pattern of a second metal lines in the hard mask layer based on the dielectric spacers. The patterns of the first and second metal lines are then transferred by an etching process to the interlevel dielectric layer as trenches in the interlevel dielectric layer. The first and second groups of the metal lines are then formed simultaneously by depositing a metal material in the trenches in the interlevel dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">102:層間介電層</p>
        <p type="p">150:第一金屬線/金屬線</p>
        <p type="p">151:第二金屬線/金屬線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="748" publication-number="202633073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體結構</chinese-title>
        <english-title>MEMORY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251127B">H10B12/00</main-classification>
        <further-classification edition="202501120251127B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振印</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亭昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括靜態隨機存取記憶體(static random-access memory, SRAM)單元，此單元進一步包括第一互補式場效電晶體及電連接到第一互補式場效電晶體的第二互補式場效電晶體。第一互補式場效電晶體包括第一上拉電晶體及在第一儲存節點電連接到第一上拉電晶體的第一下拉電晶體。第二互補式場效電晶體包括第二上拉電晶體及在第二儲存節點電連接到第二上拉電晶體的第二下拉電晶體。SRAM單元進一步包括上覆於第一互補式場效電晶體及第二互補式場效電晶體上的通過閘電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a static random-access memory (SRAM) cell that further includes a first complementary field-effect transistor and a second complementary field-effect transistor electrically connecting to the first complementary field-effect transistor. The first complementary field-effect transistor includes a first pull-up transistor, and a first pull-down transistor electrically connected to the first pull-up transistor at a first storage node. The second complementary field-effect transistor includes a second pull-up transistor, and a second pull-down transistor electrically connected to the second pull-up transistor at a second storage node. The SRAM cell further includes a pass-gate transistor overlying the first complementary field-effect transistor and the second complementary field-effect transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:SRAM單元</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLB:位元線反相線</p>
        <p type="p">PD1:下拉電晶體</p>
        <p type="p">PD2:下拉電晶體</p>
        <p type="p">PG1:通過閘電晶體</p>
        <p type="p">PG2:通過閘電晶體</p>
        <p type="p">PU1:上拉電晶體</p>
        <p type="p">PU2:上拉電晶體</p>
        <p type="p">Q:儲存節點</p>
        <p type="p">QB:儲存節點</p>
        <p type="p">VDD:電源電壓</p>
        <p type="p">VSS:電源電壓</p>
        <p type="p">WL:字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="749" publication-number="202632730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理裝置及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/32</main-classification>
        <further-classification edition="202601120260422B">H10P50/28</further-classification>
        <further-classification edition="202601120260422B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上博紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠兼顧降低熱預算與提昇處理氣體的反應性的技術。  &lt;br/&gt;  本揭露一態樣之處理裝置，係具備：處理容器，係形成供對多片基板進行處理之處理空間；電漿生成部，係形成與該處理空間連通且供生成電漿之電漿生成空間；第1氣體噴嘴，係對該處理空間供給第1處理氣體；以及第2氣體噴嘴，係對該電漿生成空間供給第2處理氣體；該第2氣體噴嘴係具有會在該第2氣體噴嘴內加熱該第2處理氣體的氣體加熱部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理容器</p>
        <p type="p">2:頂板</p>
        <p type="p">3:歧管</p>
        <p type="p">4:密封構件</p>
        <p type="p">5:晶舟</p>
        <p type="p">6:支柱</p>
        <p type="p">7:保溫筒</p>
        <p type="p">8:旋轉台</p>
        <p type="p">9:蓋體</p>
        <p type="p">10:旋轉軸</p>
        <p type="p">11:磁性流體密封件</p>
        <p type="p">12:密封構件</p>
        <p type="p">13:臂</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體噴嘴</p>
        <p type="p">21a:氣孔</p>
        <p type="p">22:氣體噴嘴</p>
        <p type="p">22a:氣孔</p>
        <p type="p">23:氣體噴嘴</p>
        <p type="p">30:電漿生成部</p>
        <p type="p">31:開口</p>
        <p type="p">32:電漿劃分壁</p>
        <p type="p">33:電漿電極</p>
        <p type="p">34:供電線</p>
        <p type="p">35:RF電源</p>
        <p type="p">36:絕緣保護蓋</p>
        <p type="p">40:排氣部</p>
        <p type="p">41:排氣口</p>
        <p type="p">42:蓋構件</p>
        <p type="p">43:排氣配管</p>
        <p type="p">44:壓力調整閥</p>
        <p type="p">45:真空泵</p>
        <p type="p">50:容器加熱部</p>
        <p type="p">51:加熱器</p>
        <p type="p">90:控制部</p>
        <p type="p">100:處理裝置</p>
        <p type="p">F1:質流控制器</p>
        <p type="p">F2:質流控制器</p>
        <p type="p">G1:供給源</p>
        <p type="p">G2:供給源</p>
        <p type="p">G3:供給源</p>
        <p type="p">L1:供給路徑</p>
        <p type="p">L2:供給路徑</p>
        <p type="p">V1:開閉閥</p>
        <p type="p">V2:開閉閥</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="750" publication-number="202633262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法，半導體裝置的製造方法，程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P14/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANE, YOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石橋清久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIBASHI, KIYOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野原慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOHARA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">執行：  &lt;br/&gt;　　(a)對配置於處理室內的基板供給成膜劑之工序；  &lt;br/&gt;　　(b)在第1壓力下淨化前述處理室內之工序；及  &lt;br/&gt;　　(c)在高於前述第1壓力的第2壓力下淨化前述處理室內之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">115:晶舟升降機</p>
        <p type="p">115s:擋板開閉機構</p>
        <p type="p">121:控制器</p>
        <p type="p">200:晶圓</p>
        <p type="p">201:處理室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:反應管</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:歧管</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:隔熱板</p>
        <p type="p">219:密封蓋</p>
        <p type="p">219s:擋板</p>
        <p type="p">220a~220c:O型環</p>
        <p type="p">231:排氣管</p>
        <p type="p">231a:排氣口</p>
        <p type="p">232a~232d:氣體供給管</p>
        <p type="p">240a:儲存部</p>
        <p type="p">241a~241d:MFC</p>
        <p type="p">242a,243a~243d:閥</p>
        <p type="p">244:APC閥</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">246:真空泵</p>
        <p type="p">248:集聚型供給系統</p>
        <p type="p">249a,249b:噴嘴</p>
        <p type="p">250a,250b:氣體供給孔</p>
        <p type="p">255:旋轉軸</p>
        <p type="p">263:溫度感測器</p>
        <p type="p">267:旋轉機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="751" publication-number="202633160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="202501120260424B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋昇珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SEUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括包括主動圖案的基底、通道圖案位於主動圖案上並包括彼此垂直間隔開的多個半導體圖案、源極/汲極圖案連接至多個半導體圖案、閘極電極位於多個半導體圖案上並包括內電極和外電極，內電極插入在彼此相鄰的一對半導體圖案之間，以及外電極位於多個半導體圖案中最上方半導體圖案上，以及內部間隔件插入在內電極和源極/汲極圖案之間，其中源極/汲極圖案包括與多個半導體圖案接觸的第一半導體層、位於第一半導體層上的第二半導體層、以及位於第二半導體層上的第三半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate including an active pattern, a channel pattern being on the active pattern and including a plurality of semiconductor patterns vertically spaced apart from each other, a source/drain pattern connected to the plurality of semiconductor patterns, a gate electrode on the plurality of semiconductor patterns and including an inner electrode and an outer electrode, the inner electrode interposed between a pair of semiconductor patterns that are adjacent to each other, and an outer electrode on an uppermost semiconductor pattern among the plurality of semiconductor patterns, and an inner spacer interposed between the inner electrode and the source/drain pattern, wherein the source/drain pattern includes a first semiconductor layer in contact with the plurality of semiconductor patterns, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">AC:主動接觸件</p>
        <p type="p">AP2:第二主動圖案</p>
        <p type="p">BM:阻擋圖案</p>
        <p type="p">CH2:第二通道圖案</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">FM:導電圖案</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">GI:閘極絕緣層</p>
        <p type="p">GS:閘極間隔件</p>
        <p type="p">ISP2:第二內部間隔件</p>
        <p type="p">LI1:第一長度</p>
        <p type="p">LI2:第二長度</p>
        <p type="p">LI3:第三長度</p>
        <p type="p">LI4:第四長度</p>
        <p type="p">M:區域</p>
        <p type="p">PO2:第二內電極</p>
        <p type="p">PO3:第三內電極</p>
        <p type="p">PO4:外電極</p>
        <p type="p">RS2:第二凹槽</p>
        <p type="p">SC:金屬半導體化合物層</p>
        <p type="p">SD2:源極/汲極圖案</p>
        <p type="p">SEL1:第一半導體層</p>
        <p type="p">SEL2:第二半導體層</p>
        <p type="p">SEL3:第三半導體層</p>
        <p type="p">SP1:第一半導體圖案</p>
        <p type="p">SP2:第二半導體圖案</p>
        <p type="p">SP3:第三半導體圖案</p>
        <p type="p">TP:尖端</p>
        <p type="p">WD1:第一水平寬度</p>
        <p type="p">WD2:第二水平寬度</p>
        <p type="p">WI1:第一尖端長度</p>
        <p type="p">WI2:第二尖端長度</p>
        <p type="p">WI3:第三尖端長度</p>
        <p type="p">WI4:第四尖端長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="752" publication-number="202632653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體電路及操作記憶體電路的方法</chinese-title>
        <english-title>MEMORY CIRCUIT AND METHOD FOR OPERATING THE MEMORY CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C7/18</main-classification>
        <further-classification edition="200601120251204B">G11C7/12</further-classification>
        <further-classification edition="200601120251204B">G11C8/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原英弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫曉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XIAOYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森陽紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIH, YU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　琮永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JONATHAN TSUNG-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體電路包括複數個記憶體單元，其排列在複數個行及複數個列之上，其中複數個記憶體單元中的每一者用以儲存複數個第一資料元件中的對應一者，其中行中的每一者包括複數條存取線；以及複數個計算元件，其中複數個計算元件中的每一者用以產生乘累加(MAC)值，此MAC值基於(i)由安置在列的不同者中及行的對應一者中的一對記憶體單元分別儲存的一對第一資料元件，以及(ii)一對複數個第二資料元件而形成。此對第一資料元件透過對應行的複數條存取線來存取。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory circuit includes a plurality of memory cells arranged over a plurality of columns and a plurality of rows, wherein each of the plurality of memory cells is configured to store a corresponding one of a plurality of first data elements, wherein each of the columns includes a plural number of access lines; and a plurality of computation elements, wherein each of the plurality of computation elements is configured to generate a multiply-accumulate (MAC) value, the MAC value being formed based on (i) a pair of the first data elements respectively stored by a pair of the memory cells disposed in different ones of the rows and in a corresponding one of the columns and (ii) a pair of a plurality of second data elements. The pair of the first data elements are accessed through the plural access lines of the corresponding column.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:記憶體庫</p>
        <p type="p">310:記憶體陣列</p>
        <p type="p">312&lt;sub&gt;0_0&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;0_1&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;1_0&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;1_1&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;2_0&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;2_1&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;3_0&lt;/sub&gt;:記憶體單元</p>
        <p type="p">312&lt;sub&gt;3_1&lt;/sub&gt;:記憶體單元</p>
        <p type="p">350:CIM電路</p>
        <p type="p">352:計算元件</p>
        <p type="p">354:計算元件</p>
        <p type="p">356:計算元件</p>
        <p type="p">358:計算元件</p>
        <p type="p">360:額外加法器</p>
        <p type="p">362:額外加法器</p>
        <p type="p">364:乘法器</p>
        <p type="p">366:乘法器</p>
        <p type="p">368:加法器</p>
        <p type="p">374:乘法器</p>
        <p type="p">376:乘法器</p>
        <p type="p">378:加法器</p>
        <p type="p">BL&lt;sub&gt;0_A&lt;/sub&gt;:位元線</p>
        <p type="p">BL&lt;sub&gt;0_B&lt;/sub&gt;:位元線</p>
        <p type="p">BL&lt;sub&gt;1_A&lt;/sub&gt;:位元線</p>
        <p type="p">BL&lt;sub&gt;1_B&lt;/sub&gt;:位元線</p>
        <p type="p">D&lt;sub&gt;0_A&lt;/sub&gt;:資料元件</p>
        <p type="p">D&lt;sub&gt;0_B&lt;/sub&gt;:資料元件</p>
        <p type="p">D&lt;sub&gt;1_A&lt;/sub&gt;:資料元件</p>
        <p type="p">D&lt;sub&gt;1_B&lt;/sub&gt;:資料元件</p>
        <p type="p">Q&lt;sub&gt;0&lt;/sub&gt;:輸出</p>
        <p type="p">W&lt;sub&gt;0_0&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;0_1&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;1_0&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;1_1&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;2_0&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;2_1&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;3_0&lt;/sub&gt;:權重資料元件</p>
        <p type="p">W&lt;sub&gt;3_1&lt;/sub&gt;:權重資料元件</p>
        <p type="p">XIN&lt;sub&gt;0&lt;/sub&gt;:輸入資料元件</p>
        <p type="p">XIN&lt;sub&gt;1&lt;/sub&gt;:輸入資料元件</p>
        <p type="p">XIN&lt;sub&gt;2&lt;/sub&gt;:輸入資料元件</p>
        <p type="p">XIN&lt;sub&gt;3&lt;/sub&gt;:輸入資料元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="753" publication-number="202633283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P50/00</main-classification>
        <further-classification edition="202601120260424B">H10P50/20</further-classification>
        <further-classification edition="202601120260424B">H10P50/60</further-classification>
        <further-classification edition="200601120260424B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤方淳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKATA, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係抑制電漿之影響及於基板中央部，及對基板邊緣部適切進行電漿處理。本發明之基板處理裝置係具備：將1片或複數片基板以豎立狀態收容之處理室；對前述處理室內供給液體之液體供給管線；是連接至前述處理室之上部的真空泵浦，且以前述基板之一部分從液面露出的方式於前述處理室內具有液體狀態下，在比前述液面上方之前述處理室內的空間形成真空之真空泵浦；是配置於前述處理室之上部的電漿產生器，並對從前述液面露出之前述基板的前述一部分進行電漿處理之電漿產生器；及控制前述基板處理裝置之各部的控制模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿處理裝置</p>
        <p type="p">101:處理室</p>
        <p type="p">104:排氣口</p>
        <p type="p">110:波導管</p>
        <p type="p">111:波導部</p>
        <p type="p">111a:波導路本體/波導管本體</p>
        <p type="p">112:天線</p>
        <p type="p">113:電漿區域</p>
        <p type="p">115:微波產生器</p>
        <p type="p">125:液體</p>
        <p type="p">126:液面</p>
        <p type="p">130:真空泵浦</p>
        <p type="p">140:滾子</p>
        <p type="p">141:馬達</p>
        <p type="p">151:液體供給口</p>
        <p type="p">152:液體供給管線</p>
        <p type="p">153:閥門</p>
        <p type="p">154:液體排出口</p>
        <p type="p">155:液體排出管線</p>
        <p type="p">156:閥門</p>
        <p type="p">200:邊緣部</p>
        <p type="p">800:控制模組</p>
        <p type="p">Wf:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="754" publication-number="202633184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可變導體佈置的積體電路裝置以及利用該裝置產生佈局的方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE WITH VARIED CONDUCTOR ARRANGEMENT, AND METHOD OF GENERATING A LAYOUT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251031B">H10D89/10</main-classification>
        <further-classification edition="202001120251031B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊惠中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, HUI-ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JIANN-TYNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置，包括在第一方向上間隔開並在第二方向上延伸的第一和第二絕緣結構；位在第一導電層的第一周邊軌上的第一導電段；位在第一導電層的第二軌上的第二導電段；在第一導電段的一端處的第一導電層中的第一間隙；在第二導電段的一端處的第一導電層中的第二間隙；以及在第一絕緣結構和第二絕緣結構之間、與第二間隙相鄰的閘極結構。所述第二間隙位於第一間隙和閘極結構之間。所述第一絕緣結構位於第一間隙和閘極結構之間。所述第一導電段遠離閘極結構延伸，以突出於所述第二間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a first and second insulating structures spaced apart in a first direction and extending in a second direction; a first conductive segment on a first peripheral track of a first conductive layer; a second conductive segment on a second track of the first conductive layer; a first gap in the first conductive layer at an end of the first conductive segment; a second gap in the first conductive layer at an end of the second conductive segment; and a gate structure between the first insulating structure and the second insulating structure, adjacent the second gap. The second gap is between the first gap and the gate structure. The first insulating structure is between the first gap and the gate structure. The first conductive segment extends away from the gate structure to protrude beyond the second gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">101:單元</p>
        <p type="p">101h1:第一水平邊界</p>
        <p type="p">101h2:第二水平邊界</p>
        <p type="p">101h3:第三水平邊界</p>
        <p type="p">101v1:第一垂直邊界</p>
        <p type="p">101v2:第二垂直邊界</p>
        <p type="p">101v3:第三垂直邊界</p>
        <p type="p">110A:第一M0導體段</p>
        <p type="p">110A1、110B1、111A1、112A1、113A1、114A1、115A1:第一端</p>
        <p type="p">110A2、110B2、111A2、112A2、113A2、114A2、115A2:第二端</p>
        <p type="p">110B:第二導體段</p>
        <p type="p">110P:突出部</p>
        <p type="p">111A:第三導體段</p>
        <p type="p">112A:第四導體段</p>
        <p type="p">113A:第五導體段</p>
        <p type="p">114A:第六導體段</p>
        <p type="p">115A:第七導體段</p>
        <p type="p">116A:第一M0間隙</p>
        <p type="p">116B:第二M0間隙</p>
        <p type="p">116C:第三M0間隙</p>
        <p type="p">116D:第四M0間隙</p>
        <p type="p">116E:第五M0間隙</p>
        <p type="p">119:輸入引腳</p>
        <p type="p">120:輸出引腳</p>
        <p type="p">122A、122B、122C、122D:閘極結構</p>
        <p type="p">124A、124B、124C、124D、124E:MD結構</p>
        <p type="p">126A:電晶體</p>
        <p type="p">128A:第一絕緣結構</p>
        <p type="p">128B:第二絕緣結構</p>
        <p type="p">V01:第一電源軌</p>
        <p type="p">V02:第二電源軌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="755" publication-number="202633401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於處理腔室建模的顆粒缺陷預測與校正</chinese-title>
        <english-title>PARTICLE DEFECT PREDICTION AND CORRECTION BASED ON PROCESS CHAMBER MODELING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P95/00</main-classification>
        <further-classification edition="200601120260422B">G05B15/02</further-classification>
        <further-classification edition="200601120260422B">G05B19/02</further-classification>
        <further-classification edition="201901120260422B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維拉潘　戴維拉格哈维</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEERAPPAN, DEVI RAGHAVEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹車正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, CHEZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包括向與處理腔室相關的模型提供初步的製程條件的方法。該方法進一步包括向模型提供對處理腔室進行一或多個調整的指示，以產生最終的製程條件。該方法進一步包括從模型中獲取第一氣體回流至處理腔室的基板支撐件的指示。該方法進一步包括產生對處理腔室的更新後的一或多個調整。該方法進一步包括向模型提供更新後的一或多個調整的指示。該方法進一步包括從模型中獲取第二氣體回流至基板支撐件的指示。該方法進一步包括根據更新後的一或多個調整執行校正動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes providing initial process conditions to a model associated with a process chamber. The method further includes providing an indication of one or more adjustments to the process chamber resulting in final process conditions to the model. The method further includes obtaining an indication of first gas backflow to a substrate support of the process chamber from the model. The method further includes generating updated one or more adjustments to the process chamber. The method further includes providing an indication of the updated one or more adjustments to the model. The method further includes obtaining from the model an indication of second gas backflow to the substrate support. The method further includes performing a corrective action based on the updated one or more adjustments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400E:方法</p>
        <p type="p">460:方框</p>
        <p type="p">462:方框</p>
        <p type="p">464:方框</p>
        <p type="p">466:方框</p>
        <p type="p">468:方框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="756" publication-number="202633033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬化陶瓷電路板及其製造方法</chinese-title>
        <english-title>METALLIZED CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250919B">H05K3/06</main-classification>
        <further-classification edition="200601120250919B">H05K3/04</further-classification>
        <further-classification edition="200601120250919B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳思翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, JIAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種金屬化陶瓷電路板及其製造方法。所述金屬化陶瓷電路板包含一陶瓷基板、形成於所述陶瓷基板的一個種子層、及形成於所述種子層的一圖案化線路。所述陶瓷基板具有一第一板面、位於所述第一板面相反側的一第二板面、凹設於所述第一板面的多個第一盲孔、及凹設於所述第二板面的多個第二盲孔。每個所述第二盲孔連通於一個所述第一盲孔而共同構成一貫穿孔，並且朝彼此靠近的方向呈截錐狀。所述種子層覆蓋於每個所述貫穿孔的孔壁，所述圖案化線路以直接鍍銅方式形成於所述種子層且填滿多個所述貫穿孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a metallized ceramic circuit board and a manufacturing method thereof. The metallized ceramic circuit board includes a ceramic substrate, a seed layer formed on the ceramic substrate, and a patterned circuit that is formed on the seed layer. The ceramic substrate has a first surface, a second surface being opposite to the first surface, a plurality of first blind vias recessed in the first surface, and a plurality of second blind vias that are recessed in the second surface. Each of the second blind vias is in spatial communication with one of the first blind vias so as to be jointly defined as a thru-hole, and each of the second blind vias and the corresponding first blind via respectively have in two truncated cone shapes that are tapered along a direction approaching each other. The seed layer covers walls of the thru-holes, and the patterned circuit is formed on the seed layer and fully filled in the thru-holes in a direct plated copper (DPC) manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬化陶瓷電路板</p>
        <p type="p">1:陶瓷基板</p>
        <p type="p">11:第一板面</p>
        <p type="p">12:第二板面</p>
        <p type="p">13:第一盲孔</p>
        <p type="p">14:第二盲孔</p>
        <p type="p">15:貫穿孔</p>
        <p type="p">2:種子層</p>
        <p type="p">21:銅合金層</p>
        <p type="p">22:銅層</p>
        <p type="p">3:圖案化線路</p>
        <p type="p">31:第一導電層</p>
        <p type="p">32:第二導電層</p>
        <p type="p">H:深度</p>
        <p type="p">W:寬度</p>
        <p type="p">D:孔徑</p>
        <p type="p">S160:移除步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="757" publication-number="202633418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、電腦程式及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P95/90</main-classification>
        <further-classification edition="200601120260422B">G05B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種資訊處理方法、電腦程式及資訊處理裝置，該資訊處理方法期待能夠支援基板處理裝置之控制等所用之模型之資訊管理。  &lt;br/&gt;本實施方式之資訊處理方法係資訊處理裝置將與模型相關之模型資訊記憶於記憶部中的資訊處理方法，該模型進行基板處理裝置所進行之基板處理所涉及之運算，上述資訊處理裝置更新上述模型之參數，且將包含作為基準之模型之參數的基準資訊和包含與更新後之參數相關之資訊的一個或複數個更新資訊建立關聯，並作為上述模型資訊記憶於上述記憶部中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置(電腦)</p>
        <p type="p">3,3A,3B:基板處理裝置</p>
        <p type="p">5:模型DB</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="758" publication-number="202631912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去除異物用之塗佈膜形成組成物及半導體基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C09D133/04</main-classification>
        <further-classification edition="202601120260416B">H10P70/00</further-classification>
        <further-classification edition="200601120260416B">B08B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上林哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIBAYASHI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種去除異物用之塗佈膜形成組成物，其包含聚合物及溶劑，且可形成藉由去除液而可去除的塗佈膜，  &lt;br/&gt;　　前述聚合物係包含具有-O-C(=O)-(O)&lt;sub&gt;m&lt;/sub&gt;-基(m表示0或1)之環結構的結構單元(A)之聚合物的組成物。  &lt;br/&gt;　　此外，前述結構單元(A)係下述式(A-1)所表示之結構單元的組成物。  &lt;br/&gt;&lt;img align="absmiddle" height="226px" width="264px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(A-1)中，R¹表示氫原子或碳原子數1~3之烷基；X¹表示酯基或醯胺基；Y¹表示單鍵、或碳原子數1~6之伸烷基；Q為包含內酯環或碳酸酯環之可經取代之碳原子數3~10之環結構(r)；環結構(r)亦可為多環]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:半導體基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="759" publication-number="202633137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置的形成方法</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250901B">H10D64/01</main-classification>
        <further-classification edition="202501120250901B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮家馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNG, KA-HING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威養</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包含形成第一及第二多層堆疊物，第一多層堆疊物包括交替堆疊的第一複數個犧牲層及第一複數個半導體奈米結構，第二多層堆疊物包括交替堆疊的第二複數個犧牲層及第二複數個半導體奈米結構，分別以第三及第四複數個犧牲層取代第一及第二複數個犧牲層，在不同製程中進行取代製程；移除第三複數個犧牲層，以形成複數個第一凹口，在複數個第一凹口中形成第一閘極堆疊物，移除第四複數個犧牲層，以形成複數個第二凹口，以及在複數個第二凹口中形成第二閘極堆疊物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a first multilayer stack and a second multilayer stack. The first multilayer stack comprises a first plurality of sacrificial layers and a first plurality of semiconductor nanostructures located alternatingly. The second multilayer stack comprises a second plurality of sacrificial layers and a second plurality of semiconductor nanostructures located alternatingly. The first plurality of sacrificial layers and the second plurality of sacrificial layers are replaced with a third plurality of sacrificial layers and a fourth plurality of sacrificial layers, respectively. The third plurality of sacrificial layers and the fourth plurality of sacrificial layers are replaced in different processes. Removing the third plurality of sacrificial layers to form first recesses, forming a first gate stack in the first recesses, removing the fourth plurality of sacrificial layers to form second recesses, and forming a second gate stack in the second recesses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:製程流程</p>
        <p type="p">202,204,206,208,210,212,214,216,218,220,222,224,226,228,230,232,234,236,238,240,242,244:製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="760" publication-number="202633382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體用探針卡用之清潔片貼合裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01R1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｍｉｐｏｘ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIPOX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商淀川惠德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YODOGAWA HU-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商淀川美科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YODOGAWA MEDEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上谷宗久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UETANI, MUNEHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡島啓洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題係在於提供一種可抑制清潔性能變動之半導體用探針卡用之清潔片貼合裝置。用以解決課題之手段為，一種半導體用探針卡用之清潔片貼合裝置，其具備：第1載置台，其能夠真空吸附具有可撓性之半導體探針卡用清潔片之與黏著面亦即第1面相反側的第2面；第2載置台，其能夠真空吸附被黏貼構件之第3面相反側的第4面；驅動機構，其將前述第1載置台及第2載置台相對移動；吸引機構，其能夠將前述第1載置台及第2載置台各自切換為吸附狀態或吸附解除狀態；控制裝置，其係控制前述驅動機構與前述吸引機構，前述控制裝置控制前述驅動機構及吸引機構，使前述第1載置台及第2載置台在前述吸附狀態下，依序移行至前述第1面與前述第3面相對的對向狀態、將前述第1面黏貼於前述第3面的貼附狀態、以及前述第1載置台在前述吸附解除狀態下，前述第1載置台從前述清潔片迴避的迴避狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體用探針卡用之清潔片貼合裝置(貼合裝置)</p>
        <p type="p">5:基台</p>
        <p type="p">10:載置台(第1載置台)</p>
        <p type="p">11:吸附面</p>
        <p type="p">14:按壓滾子</p>
        <p type="p">20:支承構件</p>
        <p type="p">24:致動器群組</p>
        <p type="p">30:載置台(第2載置台)</p>
        <p type="p">31:吸附面</p>
        <p type="p">34:旋轉軸</p>
        <p type="p">40:支承構件(驅動機構)</p>
        <p type="p">44:致動器群組</p>
        <p type="p">51:照相機</p>
        <p type="p">52:照相機</p>
        <p type="p">60:真空泵浦(吸引機構)</p>
        <p type="p">70:吸引管(吸引機構)</p>
        <p type="p">71:匯合部</p>
        <p type="p">72:分歧部</p>
        <p type="p">73:分歧部</p>
        <p type="p">82,83:電磁閥(吸引機構)</p>
        <p type="p">90:控制器(控制裝置)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="761" publication-number="202633161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, IN HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寧歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, YOUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MYUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭銀國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, EUN GUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUN HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺煜鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, WOOK HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許琇行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, SU HAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包括一背側電力遞送網路(BSPDN)之半導體裝置及一種用於製造該半導體裝置之方法。該半導體裝置包括：一半導體基體，其包括一第一側及一第二側，該第二側位於該半導體基體之與該第一側相對的一側上；一主動圖案，其位於該第一側上；一閘極結構，其與該主動圖案相交；一源極/汲極區，其在該閘極結構之一側面上連接至該主動圖案；一正面佈線結構，其在該第一側上連接至該閘極結構或該源極/汲極區中之至少一者；一背面佈線結構，其位於該第二側上；以及一接觸圖案，其位於該半導體基體中，其中該接觸圖案連接至該背面佈線結構，其中該接觸圖案在與該第一側相交之一豎直方向上的一高度小於該半導體基體在該豎直方向上的一厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a backside power delivery network (BSPDN) and a method for fabricating the same are provided. The semiconductor device includes a semiconductor substrate including a first side and a second side that is on an opposite side of the semiconductor substrate from the first side, an active pattern on the first side, a gate structure that intersects the active pattern, a source/drain region connected to the active pattern, on a side face of the gate structure, a front wiring structure connected to at least one of the gate structure or the source/drain region, on the first side, a back wiring structure on the second side, and a contact pattern in the semiconductor substrate, wherein the contact pattern is connected to the back wiring structure, wherein a height of the contact pattern in a vertical direction intersecting the first side is smaller than a thickness of the semiconductor substrate in the vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體基體</p>
        <p type="p">100a:第一側</p>
        <p type="p">100b:第二側</p>
        <p type="p">105:場絕緣膜</p>
        <p type="p">111,112,113:橋接圖案</p>
        <p type="p">120:閘極介電膜</p>
        <p type="p">130:閘極電極</p>
        <p type="p">140:閘極間隔體</p>
        <p type="p">145:內部間隔體</p>
        <p type="p">150:閘極罩蓋膜</p>
        <p type="p">190:第一層間絕緣膜</p>
        <p type="p">192:第二層間絕緣膜</p>
        <p type="p">194:第三層間絕緣膜</p>
        <p type="p">195:第一通孔接點</p>
        <p type="p">210:正面佈線間絕緣膜</p>
        <p type="p">221:第一正面佈線圖案，第一前側佈線圖案</p>
        <p type="p">300:背面絕緣膜</p>
        <p type="p">305:第二通孔接點</p>
        <p type="p">310:背面佈線間絕緣膜</p>
        <p type="p">321:第一背面佈線圖案</p>
        <p type="p">322:第二背面佈線圖案</p>
        <p type="p">323:第三背面佈線圖案</p>
        <p type="p">390:連接端子</p>
        <p type="p">AP1:第一主動圖案</p>
        <p type="p">AP2:第二主動圖案</p>
        <p type="p">B1,B2,B3:背面佈線圖案</p>
        <p type="p">BCA:背面源極/汲極接點</p>
        <p type="p">BCB:背面閘極接點</p>
        <p type="p">BV:背面通孔圖案</p>
        <p type="p">BW:背面佈線結構</p>
        <p type="p">CP1:第一接觸圖案</p>
        <p type="p">D11:第一高度</p>
        <p type="p">D12:第三高度</p>
        <p type="p">F1,F2,F3:正面佈線圖案</p>
        <p type="p">FCA1:第一源極/汲極接點</p>
        <p type="p">FCA2:第二源極/汲極接點</p>
        <p type="p">FCB1:第一閘極接點</p>
        <p type="p">FCB2:第二閘極接點</p>
        <p type="p">FV:正面通孔圖案</p>
        <p type="p">FW:正面佈線結構</p>
        <p type="p">GS1:第一閘極結構</p>
        <p type="p">GS2:第二閘極結構</p>
        <p type="p">H1:第一距離</p>
        <p type="p">H2:元件</p>
        <p type="p">I:第一區</p>
        <p type="p">II:第二區</p>
        <p type="p">SD1:第一源極/汲極區</p>
        <p type="p">SD2:第二源極/汲極區</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">TV:通孔</p>
        <p type="p">X1:第一方向</p>
        <p type="p">X2:第二方向</p>
        <p type="p">Y1:第三方向</p>
        <p type="p">Y2:第四方向</p>
        <p type="p">Z:豎直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="762" publication-number="202633263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/24</main-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/46</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇賢燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SO, HYEON SEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪政秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JEONG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張源準</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, WON JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金進玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN OK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及基板處理方法及基板處理裝置，更詳細地說，涉及用於改善基板的薄膜特性的基板處理方法及基板處理裝置。本發明提供一種基板處理方法，包括以下步驟：加壓步驟(S100)，向處理空間(S)供給加壓氣體而將製程壓力從第一壓力(P1)加壓到第二壓力(P2)；熱處理步驟(S200)，在所述第二壓力(P2)氣氛，將基板(1)的溫度加熱到第二溫度(T2)以執行熱處理；溫度下降步驟(S300)，在所述熱處理步驟(S200)之後，將所述基板(1)的溫度從所述第二溫度(T2)下降到第三溫度(T3)；減壓步驟(S400)，在所述溫度下降步驟(S300)之後，將所述製程壓力從第二壓力(P2)減壓到第三壓力(P3)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:加壓步驟</p>
        <p type="p">S200:熱處理步驟</p>
        <p type="p">S300:溫度下降步驟</p>
        <p type="p">S400:減壓步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="763" publication-number="202632181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紫外線照射裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260302B">F21S2/00</main-classification>
        <further-classification edition="202601120260302B">A61L2/10</further-classification>
        <further-classification edition="200601120260302B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東芝照明技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSHIBA LIGHTING &amp; TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤剛雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川幸信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, YUKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使在設置多個照射模組的情況下，也可進行紫外線照度的適當檢測的紫外線照射裝置。實施形態的紫外線照射裝置是向物件物照射紫外線的紫外線照射裝置。所述紫外線照射裝置包括：第一照射模組，沿第一方向延伸且具有照射所述紫外線的第一發光元件；第二照射模組，在與所述第一方向交叉的第二方向上排列設置在所述第一照射模組的其中一側，且具有照射所述紫外線的第二發光元件；第三照射模組，在所述第二方向上排列設置在所述第一照射模組的另一側，且具有照射所述紫外線的第三發光元件；以及檢測部，沿相對於所述第一發光元件的光軸傾斜的方向延伸，在內部設置有將入射的所述紫外線轉換為可見光的受光部。所述檢測部的設置有所述受光部的部分位於所述第一照射模組的所述紫外線的照射範圍內且所述第二照射模組的所述紫外線的照射範圍外的區域、或所述第三照射模組的所述紫外線的照射範圍外的區域。所述檢測部向隨著遠離所述第一發光元件而接近所述第一發光元件的所述光軸的方向傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:照射模組</p>
        <p type="p">31:光源</p>
        <p type="p">31a:基板</p>
        <p type="p">31b:發光元件</p>
        <p type="p">32:基座</p>
        <p type="p">40:檢測部</p>
        <p type="p">40a:受光部</p>
        <p type="p">41:光電轉換部</p>
        <p type="p">X、Y、Z:方向/箭頭</p>
        <p type="p">α:角度</p>
        <p type="p">β:內角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="764" publication-number="202632849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導針繞線裝置</chinese-title>
        <english-title>GUIDING-NEEDLE WINDING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250801B">H02K15/026</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昶志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSIU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種導針繞線裝置，組配將線體繞設於電極，導針繞線裝置包括導針模組、基座、轉動模組和引導模組。導針模組的導針本體部沿第一軸向設置，且包括彼此相反的前端和後端。轉動模組樞接設置於基座與導針模組的導針轉動部之間，組配驅動導針模組以第二軸向為中心相對基座於縱向上下擺動一角度，其中第二軸向垂直第一軸向。引導模組連接導針本體部的後端，組配驅動導針本體部於第一軸向上滑動，其中轉動模組驅動導針模組擺動角度時，引導模組帶動導針本體部的前端沿第一軸向相對第二軸向滑動位移距離，並使前端維持於固定的橫向位移量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a guiding-needle winding device configured to wind a wire around an electrode. The guiding-needle winding device includes a guiding-needle module, a base, a rotating module and a guiding module. A guiding-needle main body of the guiding-needle module is arranged along a first axial direction and includes a front end and a rear end opposite to each other. The rotating module is pivotally disposed between the base and a guiding-needle rotating part of the guiding-needle module, and configured to drive the guiding-needle module to swing vertically at an angle relative to the base in the longitudinal direction with a second axial direction as the center, wherein the second axial direction is perpendicular to the first axial direction. The guiding module is connected to the rear end of the guiding-needle main body, and configured to drive the guiding-needle main body to slide in the first axial direction. When the rotating module drives the guiding-needle module to swing, the guiding module drives the front end of the guiding-needle body to slide a displacement distance along the first axial direction relative to the second axial direction, and maintains the front end at a fixed lateral displacement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:導針繞線裝置</p>
        <p type="p">10:基座</p>
        <p type="p">20:導針模組</p>
        <p type="p">22:導針本體部</p>
        <p type="p">30:轉動模組</p>
        <p type="p">32:驅動電機</p>
        <p type="p">40:導引模組</p>
        <p type="p">41:凸輪引導組件</p>
        <p type="p">42:導引溝</p>
        <p type="p">43:凸輪軸承組</p>
        <p type="p">9:定子</p>
        <p type="p">C1:第一軸向</p>
        <p type="p">C2:第二軸向</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="765" publication-number="202633469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合電路疊層</chinese-title>
        <english-title>COMPOSITE CIRCUIT STACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W70/62</main-classification>
        <further-classification edition="202601120260428B">H10W72/20</further-classification>
        <further-classification edition="200601120260428B">H05K1/14</further-classification>
        <further-classification edition="200601120260428B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓心半導體異質整合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, HO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳書賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余思燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SZU-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱景裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合電路疊層，包括第一重布線層以及第二重布線層。第一重布線層包括至少一第一接墊與至少一第二接墊。第二重布線層與第一重布線層相對設置。第二重布線層包括至少一第三接墊。當至少一第一接墊接合至至少一第三接墊時，至少一第一接墊電性連接至少一第三接墊而傳遞電訊號。至少一第二接墊具有功能性材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite circuit stack includes a first redistribution layer and a second redistribution layer. The first redistribution layer includes at least one first pad and at least one second pad. The second redistribution layer is disposed opposite to the first redistribution layer. The second redistribution layer includes at least one third pad. When the at least one first pad is bonded to the at least one third pad, the at least one first pad is electrically connected to the at least one third pad to transmit an electrical signal. The at least one second pad has a functional material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:複合電路疊層</p>
        <p type="p">110:第一重布線層</p>
        <p type="p">111:第一接墊</p>
        <p type="p">112:第二接墊</p>
        <p type="p">120:第二重布線層</p>
        <p type="p">121:第三接墊</p>
        <p type="p">C1:第一線路層</p>
        <p type="p">C2:第二線路層</p>
        <p type="p">C3:第三線路層</p>
        <p type="p">C4:第四線路層</p>
        <p type="p">C5:第五線路層</p>
        <p type="p">C6:第六線路層</p>
        <p type="p">FP1、FP2、P1、P2:接墊</p>
        <p type="p">IL1、IL2、IL3、IL4、IL5、IL6、IL7、IL8:絕緣層</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="766" publication-number="202632483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容式感測旋鈕或滑鈕裝置與其觸控處理裝置和觸控系統</chinese-title>
        <english-title>CAPACITIVE SENSING KNOB OR SLIDER APPARATUS AND TOUCH SENSITIVE APPARATUS THEREOF AND TOUCH SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F3/044</main-classification>
        <further-classification edition="200601120251103B">G06F3/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾瑞亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGALAX_EMPIA TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張欽富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉尚泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHANG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯慶辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸入裝置的偵測方法，其中該輸入裝置包含互不接觸的一輸入電極、一驅動電極與多個感測電極，其中該多個感測電極中的每一個感測電極與該驅動電極的距離都相同，該輸入電極的一特定部分同時覆蓋於該驅動電極與該多個感測電極中的一或兩個感測電極，該輸入裝置的偵測方法包含：自該驅動電極發出驅動信號；同時偵測該多個感測電極所感應的驅動信號的多個信號強度；以及根據該多個信號強度，判斷該特定部分與該多個感測電極之間的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detecting method of an input apparatus, wherein the input apparatus including an input electrode, a driving electrode, and multiple sensing electrodes which are not in contact with others, a part of the input electrode simultaneously covering the driving electrode and one or two sensing electrodes, wherein the detecting method comprising: transmitting driving signals from the driving electrode; simultaneously sensing the induced driving signals via the sensing electrodes to get multiple signal strength values, respectively; and determining a position of the part with respect to the multiple sensing electrodes according to the signal strength values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:旋鈕電極區</p>
        <p type="p">300:旋鈕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="767" publication-number="202632844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高效能之電動機定子總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02K1/12</main-classification>
        <further-classification edition="200601120251103B">H02K3/04</further-classification>
        <further-classification edition="202501120251103B">H02K15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動機定子總成，包含有一定子鐵芯，一佈置於其上的定子繞組單元。該定子繞組單元包含有一第一繞組及一第二繞組，該第一繞組包含一斷面呈矩形或方形的第一導體以及一第一額定輸出功率，該第二繞組包含一斷面呈圓形的第二導體以及一等於或小於該第一額定輸出功率的第二額定輸出功率。在電動機於啟動階段時，將該第一繞組與該第二繞組同時連接至電源，藉此結合兩者的額定輸出功率作為馬達啟動所需之總輸出功率。當電動機達到正常運轉條件後，僅將該第一繞組與電源的連接，使該電動機以該第一繞組之輸出功率進行運轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:定子總成</p>
        <p type="p">12:轉子</p>
        <p type="p">20:定子鐵心</p>
        <p type="p">23:外周邊表面</p>
        <p type="p">24:內周邊表面</p>
        <p type="p">25:貫穿孔</p>
        <p type="p">26:溝槽</p>
        <p type="p">30:定子繞組單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="768" publication-number="202632439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於相互相干的照明計量之焦點偵測系統</chinese-title>
        <english-title>FOCUS DETECTION SYSTEM FOR MUTUALLY-COHERENT ILLUMINATION METROLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G03F7/207</main-classification>
        <further-classification edition="200601120260423B">G03F7/20</further-classification>
        <further-classification edition="202101120260423B">G02B7/28</further-classification>
        <further-classification edition="200601120260423B">G02B21/18</further-classification>
        <further-classification edition="200601120260423B">G02B21/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科普里維卡　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOPRIVICA, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　尼瑞卡珊納　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, NIREEKSHAN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朗維司基　維拉得摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVINSKI, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法琪妮　優娜塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAKNIN, YONATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　安卓　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILL, ANDREW V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃夫曼　亞隆　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLFMAN, ALON ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種焦點偵測系統，其可包含具有可將一第一照明光束及一第二照明光束以相反方位角引導至一樣本之一或多個照明透鏡之一照明系統。該系統可包含具有可將該樣本成像至一或多個偵測器上之一或多個集光透鏡之一成像系統。具有一或多個處理器之一控制器可經組態以執行程式指令，該等程式指令可引起該等處理器判定藉由該等第一及第二照明光束之不同組合成像之該樣本上之特徵之位置之間之一橫向移位。該等指令可進一步引起該等處理器基於該橫向移位產生該樣本之一焦點位置之一量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A focus detection system may include an illumination system with one or more illumination lenses that may direct a first illumination beam and a second illumination beam to a sample at opposing azimuth angles. The system may include an imaging system with one or more collection lenses that may image the sample onto one or more detectors. A controller with one or more processors may be configured to execute program instructions that may cause the processors to determine a lateral shift between locations of features on the sample imaged by different combinations of the first and second illumination beams. The instructions may further cause the processors to generate a measurement of a focal position of the sample based on the lateral shift.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:第一影像</p>
        <p type="p">212:經成像特徵</p>
        <p type="p">214:第二影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="769" publication-number="202633392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片組件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DIE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260325B">H10P74/20</main-classification>
        <further-classification edition="202601120260325B">H10P14/20</further-classification>
        <further-classification edition="202601120260325B">H10P50/00</further-classification>
        <further-classification edition="202601120260325B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張聿騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭新立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇淑慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SHU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧立峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, LI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, YINGKIT FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種半導體晶片組件及其製造方法。該方法包含以下步驟：接收一第一晶圓，該第一晶圓包括一第一半導體裝置及放置於該第一半導體裝置之上且耦合至該第一半導體裝置之一第一互連結構；使一阻障襯層形成於該第一互連結構之一部分上；使一測試墊形成於該阻障襯層上；透過該測試墊對該第一半導體裝置執行一第一測試；使一第一接合結構形成於該第一互連結構之上；接收一第二晶圓，該第二晶圓包括一第二半導體裝置及位於該第二半導體裝置之上且耦合至該第二半導體裝置之一第二互連結構；使一第二接合結構形成於該第二互連結構之上；藉由連接該第一及第二接合結構來將該第一晶圓接合至該第二晶圓以形成一晶圓組件；及對該晶圓組件執行一第二測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor die assembly and method of manufacturing the same are provided. The method includes steps of receiving a first wafer comprising a first semiconductor device and a first interconnect structure disposed over and coupled to the first semiconductor device; forming a barrier liner on a portion of the first interconnect structure; forming a test pad on the barrier liner; performing a first test on the first semiconductor device through the test pad; forming a first bonding structure over the first interconnect structure; receiving a second wafer comprising a second semiconductor device and a second interconnect structure over and coupled to the second semiconductor device; forming a second bonding structure over the second interconnect structure; bonding the first wafer to the second wafer by connecting the first and second bonding structures to form a wafer assembly; and performing a second test on the wafer assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體晶片組件</p>
        <p type="p">200:第一半導體晶片</p>
        <p type="p">206:第一互連結構</p>
        <p type="p">210:鈍化層</p>
        <p type="p">212:底層</p>
        <p type="p">214:頂層</p>
        <p type="p">222:阻障襯層</p>
        <p type="p">232:測試墊</p>
        <p type="p">240:覆蓋層</p>
        <p type="p">242:蝕刻停止層</p>
        <p type="p">250:第一接合結構</p>
        <p type="p">252:接合介電層</p>
        <p type="p">254:接合互連結構</p>
        <p type="p">256:擴散阻障襯層/擴散阻障層</p>
        <p type="p">400:第二半導體晶片</p>
        <p type="p">402:基板</p>
        <p type="p">404:半導體裝置</p>
        <p type="p">406:第二互連結構</p>
        <p type="p">410:鈍化層</p>
        <p type="p">412:底層</p>
        <p type="p">414:頂層</p>
        <p type="p">420:蝕刻停止層</p>
        <p type="p">430:第二接合結構</p>
        <p type="p">432:接合介電層</p>
        <p type="p">434:接合互連結構</p>
        <p type="p">4062T:最上導線</p>
        <p type="p">DS:晶片堆疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="770" publication-number="202633185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置以及形成半導體裝置的第一胞元區域的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING A FIRST CELL REGION OF A SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D89/10</main-classification>
        <further-classification edition="202001120251201B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑諠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YO-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張光慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUANG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡維欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊榮展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUNG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑋玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鉦祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括第一胞元區域，包括：相鄰的第一以及第二主動區；閘極段，包括第一以及第二閘極段；以及第一金屬化（M_1st）層中的區段，包括相鄰的第一、第二以及第三M_1st電源網格（PG）段，相應地被設置成用於第一以及第二參考電壓，第一和第二參考電壓為不同的，第一金屬化電源網格段對齊阿爾法軌道的相應的幾個；第一胞元區域的頂部邊界和底部邊界對齊阿爾法軌道的相應的幾個；第一第一金屬化電源網格段實質上不對稱地重疊於第一主動區；第二第一金屬化電源網格段重疊於底部邊界，與第二主動區相鄰並實質上不重疊於第一和第二主動區；以及頂部邊界位於第一主動區和第三第一金屬化電源網格段之間，並實質上不重疊於第一主動區和第三第一金屬化電源網格段的每一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first cell region including: adjacent first and second active regions; gate segments including first and second gate segments; and segments in a first metallization (M_1st) layer including adjacent first, second and third M_1st power grid (PG) segments correspondingly configured for first and second reference voltages, the first and second reference voltages being different, the M_1st PG segments aligning to corresponding ones of alpha tracks; top and bottom boundaries of the first cell region aligning to corresponding ones of alpha tracks; the first M_1st PG segment substantially asymmetrically overlapping the first active region; the second M_1st PG segment overlapping the bottom boundary, being adjacent to the second active region and substantially free from overlapping the first and second active regions; and the top boundary being between, and substantially free from overlapping each of the first active region and the third M_1st PG segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100C:裝置</p>
        <p type="p">101C:巨集區域</p>
        <p type="p">102(1)、102(2):胞元區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="771" publication-number="202632353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>零角度偏移帶通濾光器</chinese-title>
        <english-title>ZERO ANGLE SHIFT BANDPASS FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">G02B6/293</main-classification>
        <further-classification edition="200601120260420B">G02B5/28</further-classification>
        <further-classification edition="200601120260420B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商菲爾薇解析公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIAVI SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西卡布寇　安迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHKABKO, ANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧肯福斯　喬治　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCKENFUSS, GEORG J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施方式中，光學濾光器組合件包括設置在基板的第一側上的光學濾光器，其中光學濾光器具有大於第一臨限值的厚度，並且其中光學濾光器被配置為對於特定的工作中心波長和從0度到至少第三臨限值的入射角範圍經歷小於第二臨限值的中心波長偏移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some implementations, an optical filter assembly includes an optical filter disposed on a first side of a substrate, wherein the optical filter has a thickness greater than a first threshold value, and wherein the optical filter is configured to experience a center wavelength shift of less than a second threshold value for a particular operating center wavelength and for a range of angles of incidence from 0 degrees to at least a third threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:示例實施方式</p>
        <p type="p">110:光學系統</p>
        <p type="p">120:光學濾光器組合件</p>
        <p type="p">130:基板</p>
        <p type="p">140:光學濾光器</p>
        <p type="p">150-1:輸入光信號</p>
        <p type="p">150-2:輸入光信號</p>
        <p type="p">160:光學傳感器</p>
        <p type="p">170:標記</p>
        <p type="p">180:標記</p>
        <p type="p">185:標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="772" publication-number="202632021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅合金及電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C22F1/08</main-classification>
        <further-classification edition="200601120260309B">H01B1/02</further-classification>
        <further-classification edition="200601120260309B">C22C9/06</further-classification>
        <further-classification edition="200601120260309B">C21D1/673</further-classification>
        <further-classification edition="200601120260309B">C21D1/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬大規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKASE, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種銅合金，其含有1.5質量%以上且4.6質量%以下之Ni、0.10質量%以上且0.80質量%以下之Co、0.10質量%以上且1.3質量%以下之Si，且剩餘部分由Cu及不可避免雜質所構成，藉由對該銅合金表面之X射線繞射測定所得之（200）面之峰之積分強度I（200）相對於藉由對純銅標準粉末之X射線繞射測定所得之（200）面之峰之積分強度I&lt;sub&gt;0&lt;/sub&gt;（200）的比（I（200）/I&lt;sub&gt;0&lt;/sub&gt;（200））為3.0以上且10.0以下，上述銅合金之於與壓延方向平行之方向之拉伸強度為850 MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="773" publication-number="202633146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及形成其之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佩珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁聖勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, SHENG-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之實施例提供半導體裝置結構及其形成方法。該方法包括形成一鰭片結構，且該鰭片結構包括安置於一基體部分上方的一第一半導體層。該方法進一步包括：移除該第一半導體層之一部分以暴露該基體部分之一頂表面、該基體部分之一側表面及該第一半導體之一側表面；在該基體部分之暴露頂表面上形成一第一氧化物層、在該基體部分之暴露側表面上形成一第二氧化物層以及在該第一半導體層之暴露側表面上形成一第三氧化物層；以及施行一高壓循環蝕刻程序來移除該第一氧化物層。該方法進一步包括在該基體部分之該頂表面上形成一第二半導體層以及移除該第三氧化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The method includes forming a fin structure, and the fin structure includes a first semiconductor layer disposed over a substrate portion. The method further includes removing a portion of the first semiconductor layer to expose a top surface of the substrate portion, a side surface of the substrate portion, and a side surface of the first semiconductor, forming a first oxide layer on the exposed top surface of the substrate portion, a second oxide layer on the exposed side surface of the substrate portion, and a third oxide layer on the exposed side surface of the first semiconductor layer, and performing a high-pressure cyclic etching process to remove the first oxide layer. The method further includes forming a second semiconductor layer on the top surface of the substrate portion and removing the third oxide layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基體</p>
        <p type="p">104:半導體層堆疊</p>
        <p type="p">106:第一半導體層，半導體層</p>
        <p type="p">108:第二半導體層，半導體層</p>
        <p type="p">110:氧化物層</p>
        <p type="p">111:氮化物層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="774" publication-number="202632719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>為改善計量擁有成本之基於局部感興趣區域的影像抓取</chinese-title>
        <english-title>LOCALIZED REGION OF INTEREST BASED IMAGE GRABS FOR IMPROVED METROLOGY COST OF OWNERSHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01J37/26</main-classification>
        <further-classification edition="200601120260423B">H01J37/21</further-classification>
        <further-classification edition="202201120260423B">G06V10/25</further-classification>
        <further-classification edition="201701120260423B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維庫瑪　莫妮加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVIKUMAR, MONICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑪南　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORMANNAN, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑亞瑞曼　席如普瑞桑德瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAYARAMAN, THIRUPURASUNDARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕薩吉　哈利　席拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATHANGI, HARI SRIRAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統及方法達成了將一束局部化至複數個感興趣區域以建立一經合成拼接影像。程序包含：建立一目標之至少一第一感興趣區域及該目標之至少一第二感興趣區域，該目標之該第一區域以及該第二感興趣區域中之每一者由針對多邊形尺寸之一或多個先前所確立規則來定義。接下來，發生對該目標執行一第一次掃描以擷取該第一感興趣區域之至少一個第一影像且對該目標執行一第二次掃描以擷取該第二感興趣區域之至少一個第二影像。然後將該等經擷取影像拼接在一起以建立該目標之一經拼接最終影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods provide for localizing a beam to a plurality of regions of interest for creating a synthetically stitched image. The process includes creating at least a first region of interest of a target and at least a second region of interest of the target, each of the first region of the target and the second region of interest defined by one or more previously established rules for polygonal dimensions. Next, performing a first scan of the target to capture at least one first image of the first region of interest and performing a second scan of the target to capture at least one second image of the second region of interest occurs. The captured images are then stitched together to create a stitched final image of the target.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502:步驟</p>
        <p type="p">504:步驟</p>
        <p type="p">506:步驟</p>
        <p type="p">508:步驟</p>
        <p type="p">510:步驟</p>
        <p type="p">512:步驟</p>
        <p type="p">514:步驟</p>
        <p type="p">516:步驟</p>
        <p type="p">518:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="775" publication-number="202633285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理方法，半導體裝置的製造方法，處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P50/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本&amp;#55395;&amp;#56979;治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理方法，包含藉由進行預定次數下列工序來蝕刻基板的表面之工序，  &lt;br/&gt;　　(a)藉由進行預定次數，對處於減壓下的前述基板供給以氣體狀態充填於第1儲存部內的物質M，使前述物質M吸附於前述基板之工序；  &lt;br/&gt;　　(b)藉由進行淨化氣體對前述基板的供給及前述基板所在的空間的排氣的其中至少任一者，使吸附於前述基板的前述物質M的一部分殘留，同時使前述物質M的其他的一部分脫離之工序；  &lt;br/&gt;　　(c)藉由對前述基板供給蝕刻劑，使吸附並殘留於前述基板的前述物質M與前述蝕刻劑反應，而使蝕刻物質生成之工序；及  &lt;br/&gt;　　(d)進行前述空間的淨化及排氣的其中至少任一者之工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="776" publication-number="202631008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧家禽養殖場性能監控和資料獲取系統</chinese-title>
        <english-title>INTELLIGENT POULTRY FARM PERFORMANCE MONITORING AND DATA COLLECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A01K29/00</main-classification>
        <further-classification edition="200601120260102B">A01K45/00</further-classification>
        <further-classification edition="202201120260102B">G06V20/52</further-classification>
        <further-classification edition="202201120260102B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國商百應股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALYX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　秉軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, BENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖家成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIA-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張庭碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種智慧家禽養殖場監控系統，包括至少一個屋端電子設備、至少一個相機、至少一個IMU設備、至少一個ToF設備、至少一個稱重設備和至少一個使用者端電子設備。通過使用該智慧家禽養殖場監控系統，可以即時採集在雞舍中飼養的家禽的各種監控資料，至少包括重量、活動量、飼料消耗量、飲水量以及儀器和/或設備的運行狀況。此外，通過處理和/或分析監測資料，該系統能夠進行家禽健康預測和/或家禽生長預測。此外，該系統還能夠通過分析和/或處理監測資料，為家禽飼養者生成優化的飼養管理策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent poultry farm monitoring system is disclosed, and comprises at least one house-end electronic device, at least one camera, at least one IMU device, at least one ToF device, at least one weighing device, and at least one user-end electronic device. By using the intelligent poultry farm monitoring system, a variety of monitoring data of the poultry farmed in a poultry house can be collected real time, at least including weight, activity, feed consumption, drinking water consumption, and operation condition of apparatus and/or devices. Moreover, by processing and/or analyzing the monitoring data, the system is able to conduct a poultry health prediction and/or a poultry growth prediction. Furthermore, the system is also able to generate, by analyzing and/or processing the monitoring data, an optimized feeding management policy for the poultry farmer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:性能監測和數據收集系統</p>
        <p type="p">3:使用者端電子設備</p>
        <p type="p">11:第一電子設備/平台</p>
        <p type="p">11M:第一存儲模組</p>
        <p type="p">11P:第一處理器</p>
        <p type="p">13:IMU設備</p>
        <p type="p">14:ToF設備</p>
        <p type="p">15:稱重設備</p>
        <p type="p">151:稱重感測器</p>
        <p type="p">152:數位儀錶</p>
        <p type="p">16:PoE分離器</p>
        <p type="p">17:PoE注入器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="777" publication-number="202631256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸送配管構造</chinese-title>
        <english-title>DELIVERY PIPE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260422B">B01J47/10</main-classification>
        <further-classification edition="201701120260422B">B01J49/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本浩一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南本敏宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMIMOTO, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係用於除去混入的離子交換樹脂。  &lt;br/&gt;輸送配管構造1A具備將分離塔51所容納的陰離子交換樹脂9a排出之第一輸送配管11。第一輸送配管11，包含：第一導出配管部111，與分離塔51連接；第一連接配管部112，與第一導出配管部111的端部連接，並朝向沿著第一配管軸線A112之第一輸送方向從第一導出配管部111的端部延伸；第一連結配管部113，與第一連接配管部112的端部連接，且沿著第一導出軸線A111延伸，並將陰離子交換樹脂9a排出；以及第一捕捉配管部115，與第一導出配管部111的端部連接，且朝向包含相對於第一輸送方向之相反方向的分量之第一捕捉方向，而從第一導出配管部111的端部延伸，並捕捉陽離子交換樹脂9c。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To remove mixed-in ion exchange resins. &lt;br/&gt;A delivery pipe structure 1A comprises a first delivery pipe 11, which discharges anion exchange resins 9a contained in a separation tower 51. The first delivery pipe 11 includes: a first lead-out pipe section 111, which is connected to the separation tower 51; a first connecting pipe section 112, which is connected to the end of the first lead-out pipe section 111, and extends in a first delivery direction parallel to a first pipe axis A112 from the end of the first lead-out pipe section 111; a first linking pipe section 113, which is connected to the end of the first connecting pipe section 112, extends parallel to a first lead-out axis A111, and discharges anion exchange resins 9a; and a first trapping pipe section 115, which is connected to the end of the first lead-out pipe section 111, extends from the end of the first lead-out pipe section 111 in a first trapping direction containing a directional component opposite to the first delivery direction, and traps cation exchange resin 9c.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:輸送配管構造</p>
        <p type="p">11:第一輸送配管</p>
        <p type="p">12:第二輸送配管</p>
        <p type="p">51:分離塔</p>
        <p type="p">51a:分離塔上側開口</p>
        <p type="p">51c:分離塔下側開口</p>
        <p type="p">52:陰離子塔</p>
        <p type="p">53:陽離子塔</p>
        <p type="p">54:空氣源</p>
        <p type="p">100A:分離設備</p>
        <p type="p">111:第一導出配管部</p>
        <p type="p">112:第一連接配管部</p>
        <p type="p">113:第一連結配管部</p>
        <p type="p">114:第一排出配管部</p>
        <p type="p">115:第一捕捉配管部</p>
        <p type="p">116:第一蓋部</p>
        <p type="p">121:第二導出配管部</p>
        <p type="p">122:第二連接配管部</p>
        <p type="p">123:第二連結配管部</p>
        <p type="p">124:第二捕捉配管部</p>
        <p type="p">126:第二蓋部</p>
        <p type="p">511:分離塔底面部</p>
        <p type="p">512:分離塔周壁面部</p>
        <p type="p">A111:第一導出軸線</p>
        <p type="p">A112:第一配管軸線</p>
        <p type="p">A113:第一追加導出軸線</p>
        <p type="p">A121:第二導出軸線</p>
        <p type="p">A122:第二配管軸線</p>
        <p type="p">A123:第二排出軸線</p>
        <p type="p">A51:分離塔軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="778" publication-number="202633106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率半導體裝置及功率半導體裝置的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10D30/01</main-classification>
        <further-classification edition="202501120260428B">H10D30/65</further-classification>
        <further-classification edition="202501120260428B">H10D62/13</further-classification>
        <further-classification edition="202501120260428B">H10D64/00</further-classification>
        <further-classification edition="202501120260428B">H10D64/20</further-classification>
        <further-classification edition="202501120260428B">H10D64/27</further-classification>
        <further-classification edition="202501120260428B">H10D30/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及半導體裝置技術領域，尤其涉及一種功率半導體裝置及功率半導體裝置的製備方法。該功率半導體裝置包括：襯底，襯底具有有源區，有源區包括源極區和汲極區，源極區和汲極區之間形成有閘極溝槽，閘極溝槽從襯底上表面向有源區凹陷；主閘極，位於閘極溝槽中，主閘極從閘極溝槽上表面向下延伸；絕緣層，絕緣層填充在閘極溝槽的內壁和主閘極之間。源極區和汲極區之間漂移區的長度從源極區和汲極區之間的橫向尺寸轉變為閘極溝槽的周長，在保證BV的同時可以縮小功率半導體裝置的橫向尺寸，同時減小功率半導體裝置的比導通電阻(Rsp)，減小功率半導體裝置的尺寸的同時實現最佳的BV/Rsp折中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:襯底</p>
        <p type="p">110:有源區</p>
        <p type="p">111:源極區</p>
        <p type="p">112:汲極區</p>
        <p type="p">113:閘極溝槽</p>
        <p type="p">117:體區</p>
        <p type="p">118:體接觸區</p>
        <p type="p">210:主閘極</p>
        <p type="p">230:絕緣層</p>
        <p type="p">300:源極</p>
        <p type="p">400:汲極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="779" publication-number="202632668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127759</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統、記憶體裝置及控制記憶體裝置之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260226B">G11C16/34</main-classification>
        <further-classification edition="200601120260226B">G11C16/06</further-classification>
        <further-classification edition="201601120260226B">G06F12/0866</further-classification>
        <further-classification edition="200601120260226B">G06F11/30</further-classification>
        <further-classification edition="200601120260226B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上條友輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIJO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝澤和孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天木健彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAKI, TAKEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井川原俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGAHARA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明抑制記憶體系統之可靠性下降，且提高動作速度。  &lt;br/&gt;一實施方式之記憶體系統具備記憶體裝置及記憶體控制器，上述記憶體裝置包含複數個記憶胞，上述記憶體控制器構成為於追蹤動作中，使記憶體裝置執行使用以相等間隔設定之複數個讀取位準之複數次讀出動作。使用基於以相等間隔設定之複數個讀取位準的複數次讀出動作各者中之導通胞數，計算複數個第1位元計數，使用複數個第1位元計數，計算包含於第3電壓範圍中且具有互不相同之電壓寬度之第4電壓範圍及第5電壓範圍各自所對應之第2位元計數及第3位元計數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST2:處理</p>
        <p type="p">ST201~ST209:處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="780" publication-number="202633383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻形狀評估系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202201120260302B">G06V10/764</further-classification>
        <further-classification edition="202201120260302B">G06V10/82</further-classification>
        <further-classification edition="201801120260302B">G01N23/2251</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田敏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的為提供一種技術提高蝕刻形狀評估時的精度與效率。  &lt;br/&gt;　　一種蝕刻形狀評估系統，具有包含了處理部與資料記憶部的電腦裝置；資料記憶部，保存基本模型圖像；處理部，取得掃描型電子顯微鏡所拍攝到的一個或複數製作用剖面觀察圖像；製作用剖面觀察圖像上應用網格狀範本；各深度位置對應的網格狀範本的區域中剖面輪廓線的尺寸寬度為取得素材圖像被界定；擷取素材圖像，接合他們製作蒙太奇圖像；資料記憶部，將蒙太奇圖像作為基本模型圖像保存。處理部取得一個或複數評價用剖面觀察圖像，並判斷基本模型圖像與評價用剖面觀察圖像的相似性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="781" publication-number="202633162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括應力源層的半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES INCLUDING STRESSOR LAYERS AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10D84/83</main-classification>
        <further-classification edition="202601120260421B">H10D84/01</further-classification>
        <further-classification edition="202601120260421B">H10D86/01</further-classification>
        <further-classification edition="202501120260421B">H10D86/00</further-classification>
        <further-classification edition="202501120260421B">H10D62/10</further-classification>
        <further-classification edition="202501120260421B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WONKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYOUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：基板；源極/汲極區，位於基板上；通道結構，位於基板上且電性連接至源極/汲極區；閘極結構，位於基板上且至少部分地環繞通道結構；以及應力源層，與源極/汲極區的上表面接觸且被配置成向源極/汲極區施加壓縮應力或拉伸應力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a source/drain region on the substrate, a channel structure on the substrate and electrically connected to the source/drain region, a gate structure on the substrate and at least partially surrounding the channel structure, and a stressor layer in contact with an upper surface of the source/drain region and configured to apply compressive stress or tensile stress to the source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:基板</p>
        <p type="p">102:閘極結構</p>
        <p type="p">104:通道結構</p>
        <p type="p">104U:上表面</p>
        <p type="p">106:背側接觸結構</p>
        <p type="p">108:源極/汲極區</p>
        <p type="p">110:通道區</p>
        <p type="p">112:閘極電極</p>
        <p type="p">114:閘極絕緣體</p>
        <p type="p">116:閘極頂蓋層</p>
        <p type="p">118:上部閘極絕緣間隔件</p>
        <p type="p">120:下部閘極絕緣間隔件</p>
        <p type="p">122:第一間層</p>
        <p type="p">124:導電層</p>
        <p type="p">134:應力源層</p>
        <p type="p">136:第二間層</p>
        <p type="p">138:上部結構</p>
        <p type="p">140:背側電力分配網路(BSPDN)結構</p>
        <p type="p">142:背側絕緣體</p>
        <p type="p">144:背側電源軌</p>
        <p type="p">A-A':線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">S1:上表面</p>
        <p type="p">S2:下表面</p>
        <p type="p">TS:電晶體結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="782" publication-number="202633253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P10/00</main-classification>
        <further-classification edition="202601120260422B">H10P54/20</further-classification>
        <further-classification edition="202601120260422B">H10P95/40</further-classification>
        <further-classification edition="201401120260422B">B23K26/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒川亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKAWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;在以第1基板與第2基板接合成的重合基板中，適當地除去作為除去對象之第1基板的周緣部。  &lt;br/&gt;[解決手段]  &lt;br/&gt;控制部執行以下控制：在第1基板中之作為除去對象的周緣部的內周之更徑向外側或沿著周緣部，對於在第1基板的厚度方向上排列的複數個點進行雷射照射，以形成包含經改質的第1改質部、以及自該第1改質部延伸的第1龜裂之第1改質區域；使第1龜裂不到達第1基板中與第2基板相反側的背面；在第1改質區域的更徑向內側，對於在第1基板的厚度方向上排列的複數個點進行雷射照射，以形成包含經改質的第2改質部、以及自該第2改質部延伸的第2龜裂之第2改質區域；以及使第2龜裂到達第1基板的背面，且與第1改質區域連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">B:刀片</p>
        <p type="p">C1:第1龜裂</p>
        <p type="p">C2:第2龜裂</p>
        <p type="p">Ds:裝置層</p>
        <p type="p">Dw:裝置層</p>
        <p type="p">Fs:接合用膜</p>
        <p type="p">Fw:接合用膜</p>
        <p type="p">L1:第1雷射光</p>
        <p type="p">L2:第2雷射光</p>
        <p type="p">M1:第1改質部</p>
        <p type="p">M2:第2改質部</p>
        <p type="p">M3:第3改質部</p>
        <p type="p">N1:第1改質區域</p>
        <p type="p">N2:第2改質區域</p>
        <p type="p">N21:底面改質區域</p>
        <p type="p">N22:側面改質區域</p>
        <p type="p">N3:第3改質區域</p>
        <p type="p">P:剝離區域</p>
        <p type="p">S:第2晶圓</p>
        <p type="p">Sa:表面</p>
        <p type="p">W:第1晶圓</p>
        <p type="p">Wa:表面</p>
        <p type="p">Wc:中央部</p>
        <p type="p">We:周緣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="783" publication-number="202632380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>互動方法、頭戴式顯示裝置以及非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>INTERACTION METHOD, HEAD-MOUNTED DISPLAY DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250910B">G02B27/01</main-classification>
        <further-classification edition="202201120250910B">G06F3/0488</further-classification>
        <further-classification edition="201401120250910B">A63F13/212</further-classification>
        <further-classification edition="201401120250910B">A63F13/213</further-classification>
        <further-classification edition="201401120250910B">A63F13/40</further-classification>
        <further-classification edition="201401120250910B">A63F13/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種互動方法包含下列步驟。追蹤頭部移動軌跡以及身體移動軌跡。根據頭部移動軌跡以及身體移動軌跡之間的相對移動，識別實體動作。判定實體動作的姿態分類。根據姿態分類，調整對應於實體動作的虛擬移動量。根據調整後的虛擬移動量，渲染虛擬環境與真實環境之間的互動效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interaction method includes following steps. A head movement trajectory and a body movement trajectory are tracked. A physical action is recognized according to a relative movement between the head movement trajectory and the body movement trajectory. A posture classification of the physical action is identified. A virtual magnitude corresponding to the physical action is adjusted according to the posture classification. Interaction effects between a virtual environment and a real environment are rendered according to the virtual magnitude after adjustment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:互動方法</p>
        <p type="p">P1:第一姿態</p>
        <p type="p">P2:第二姿態</p>
        <p type="p">P3:第三姿態</p>
        <p type="p">P4:第四姿態</p>
        <p type="p">S210、S212、S220、S230、S232、S240:步驟</p>
        <p type="p">S241、S242、S250、S251、S252、S260:步驟</p>
        <p type="p">S270:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="784" publication-number="202632669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251110B">G11C16/34</main-classification>
        <further-classification edition="200601120251110B">G11C16/26</further-classification>
        <further-classification edition="200601120251110B">G11C16/10</further-classification>
        <further-classification edition="200601120251110B">G11C16/08</further-classification>
        <further-classification edition="200601120251110B">G11C16/12</further-classification>
        <further-classification edition="200601120251110B">G11C16/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早稲田隆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WASEDA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王暁清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提高保存在半導體記憶裝置中的資料的安全性。半導體記憶裝置包含控制電路、第一字元線及記憶體陣列，所述記憶體陣列包含可保存n比特的第一記憶胞元，所述控制電路構成為，相對於來自外部的記憶體控制器的第一寫入指示及第二寫入指示執行第一寫入動作及第二寫入動作，相對於第一讀出指示及第二讀出指示執行第一讀出動作及第二讀出動作，且構成為，藉由執行所述第一寫入動作或第二寫入動作，將所述第一記憶胞元的臨限值電壓控制為包含依照電壓由低至高的順序排列的第一分布與第二分布的2&lt;sup&gt;n&lt;/sup&gt;個分布或包含第三分布與第四分布的2&lt;sup&gt;n&lt;/sup&gt;個分布中的任一個，所述第三分布的至少一部分存在於所述第一分布與所述第二分布之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A2:第二分布</p>
        <p type="p">A4:第四分布</p>
        <p type="p">AR1、AR2、Vread:讀出電壓</p>
        <p type="p">AV1、AV2、ErV2:校驗電壓</p>
        <p type="p">Er1:第一分布</p>
        <p type="p">Er3:第三分布</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="785" publication-number="202632488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧眼鏡裝置、物件啟動功能執行方法及其非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>SMART GLASSES DEVICE, OBJECT ACTIVATION FUNCTION EXECUTING METHOD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250902B">G06F3/0481</main-classification>
        <further-classification edition="202201120250902B">G06F3/04886</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋長華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHANG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧眼鏡裝置、物件啟動功能執行方法及其非暫態電腦可讀取記錄媒體。該裝置儲存一影像身分清單，該影像身分清單包含複數個物件及對應該等物件各者之一物件啟動功能。該裝置擷取一即時影像。該裝置判斷該即時影是否出現一目標物件，其中該目標物件為該等物件其中之一。該裝置響應於該即時影像出現該目標物件，基於對應一使用者之一使用者輸入及該影像身分清單，執行對應該目標物件之該物件啟動功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart glasses device, object activation function executing method, and non-transitory computer readable storage medium thereof are provided. The device stores an image identity list, and the image identity list includes a plurality of objects and an object activation function corresponding to each of the objects. The device captures a real-time image. The device determines whether a target object appears in the real-time image, and the target object is one of the objects. In response to the target object appearing in the real-time image, the device executes the object activation function corresponding to the target object based on a user input corresponding to a user and the image identity list.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:物件啟動功能執行方法</p>
        <p type="p">S1001、S1003:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="786" publication-number="202633360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿處理裝置之結構體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/70</main-classification>
        <further-classification edition="202601120260420B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永関一也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASEKI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤道茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MICHISHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於電漿處理裝置之結構體，係具備第一構件、第二構件、複數個支撐構件、複數個調整構件及筒狀構件。第一構件具有第一面。第二構件具有面對第一面的第二面。複數個支撐構件及複數個調整構件係設置於第一面與第二面之間。筒狀構件係貫通第一面與第二面之間的空間。複數個支撐構件係以不同的密度配置在第一面中的第一單位區域下方的第一空間內，該第一空間內未配置筒狀構件，以及第一面中的第二單位區域下方的第二空間內，該第二空間內配置有筒狀構件，且具有與第一空間相同的體積。複數個調整構件在第一空間內和第二空間內係以不同的密度配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基台</p>
        <p type="p">50b:流路</p>
        <p type="p">501:中間構件</p>
        <p type="p">501a:上表面</p>
        <p type="p">502:支撐構件</p>
        <p type="p">503:調整構件</p>
        <p type="p">504:配管</p>
        <p type="p">51:開口部</p>
        <p type="p">52:間隙</p>
        <p type="p">R1,R2:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="787" publication-number="202633074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維半導體裝置</chinese-title>
        <english-title>THREE-DIMENSIONAL SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260424B">H10B12/00</main-classification>
        <further-classification edition="202501120260424B">H10D30/60</further-classification>
        <further-classification edition="202601120260424B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁乙芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, EULJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金碩壎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUKHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧孝貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, HYOJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳成男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, SUNGNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁民友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓栽勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JAEHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維半導體裝置包括：一半導體圖案，其與一基體間隔開且在平行於該基體之一底部表面之一第一方向上延伸；一字元線，其至少部分地封圍該半導體圖案且在一第二方向上延伸，該第二方向平行於該基體之該底部表面且正交於該第一方向；以及一位元線，其在該半導體圖案之一第一側表面上、在垂直於該基體之該底部表面之一第三方向上延伸。該字元線包括至少部分地封圍該半導體圖案之一閘極介電層及在該閘極介電層上之一閘極電極，且該閘極電極可包括一金屬襯裡圖案及在該金屬襯裡圖案之一側表面上之一閘極電極圖案。該金屬襯裡圖案可具有一U形結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional semiconductor device includes a semiconductor pattern spaced apart from a substrate that extends in a first direction parallel to a bottom surface of the substrate, a word line that at least partially encloses the semiconductor pattern and extends in a second direction, which is parallel to the bottom surface of the substrate and is orthogonal to the first direction, and a bit line on a first side surface of the semiconductor pattern that extends in a third direction perpendicular to the bottom surface of the substrate. The word line includes a gate dielectric layer that at least partially encloses the semiconductor pattern and a gate electrode on the gate dielectric layer, and the gate electrode may include a metal liner pattern and a gate electrode pattern on a side surface of the metal liner pattern. The metal liner pattern may have a U-shaped structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">110:間隙填充絕緣圖案</p>
        <p type="p">A-A':線</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLa:第一位元線</p>
        <p type="p">BLb:第二位元線</p>
        <p type="p">CH:通道區</p>
        <p type="p">CIL:電容器介電層</p>
        <p type="p">CP:覆蓋圖案</p>
        <p type="p">CP1:第一覆蓋圖案</p>
        <p type="p">CP2:第二覆蓋圖案</p>
        <p type="p">CS:胞元陣列結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向、方向</p>
        <p type="p">DSP:資料儲存圖案</p>
        <p type="p">EA1:第一邊緣部分</p>
        <p type="p">EA2:第二邊緣部分</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">GEPa:第一閘極電極圖案</p>
        <p type="p">GEPb:第二閘極電極圖案</p>
        <p type="p">Gox:閘極介電層</p>
        <p type="p">INR1:第一內區</p>
        <p type="p">INR2:第二內區</p>
        <p type="p">P1:部分</p>
        <p type="p">PE:板電極</p>
        <p type="p">PL:保護層</p>
        <p type="p">S1:第一側表面</p>
        <p type="p">S2:第二側表面</p>
        <p type="p">SE:儲存電極</p>
        <p type="p">SMLa:第一金屬襯裡圖案、金屬襯裡圖案</p>
        <p type="p">SMLb:第二金屬襯裡圖案、金屬襯裡圖案</p>
        <p type="p">SP:半導體圖案</p>
        <p type="p">SPa:第一半導體圖案</p>
        <p type="p">SPb:第二半導體圖案</p>
        <p type="p">ST1:第一堆疊</p>
        <p type="p">ST2:第二堆疊</p>
        <p type="p">WL:字元線</p>
        <p type="p">WLa:第一字元線</p>
        <p type="p">WLb:第二字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="788" publication-number="202632163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制閥構造、基板處理裝置及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">F16K1/52</main-classification>
        <further-classification edition="200601120260504B">F16K1/54</further-classification>
        <further-classification edition="200601120260504B">F16K1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田雅和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄司拓人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, TAKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋良輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種控制閥構造之技術，該控制閥構造係包含複數個閥者，且前述複數個閥設置於排出處理室之氣氛之排氣管；且前述複數個閥各者之流路剖面積，構成為小於前述排氣管之流路剖面積；前述複數個閥之流路剖面積之總和，構成為大於前述排氣管之流路剖面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">52A:配管/排氣管</p>
        <p type="p">56:開閉閥(閥)</p>
        <p type="p">58:開閉閥(閥)</p>
        <p type="p">75A,75B:伸縮構件</p>
        <p type="p">76:閥箱/閥箱部</p>
        <p type="p">76A,76B:閥開口</p>
        <p type="p">76C,76D:閥座部</p>
        <p type="p">76EN:入口部</p>
        <p type="p">76EX:出口部</p>
        <p type="p">76IN:上游空間</p>
        <p type="p">76OUT:下游空間</p>
        <p type="p">76T,77T:錐形部</p>
        <p type="p">77A,77B:板部(閥體)</p>
        <p type="p">78A,78B:桿</p>
        <p type="p">79:蓋構件</p>
        <p type="p">80A,80B:致動器</p>
        <p type="p">82A,82B:密封環</p>
        <p type="p">α:配管之口徑/配管之內徑/配管之流路剖面積/配管之剖面積</p>
        <p type="p">β,γ:閥開口之口徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="789" publication-number="202632474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128351</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>查詢影像產生裝置、方法及其非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>QUERY IMAGE GENERATING DEVICE, METHOD , AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">G06F3/01</main-classification>
        <further-classification edition="201901120250901B">G06F16/583</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋長華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHANG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種查詢影像產生裝置、方法及其非暫態電腦可讀取記錄媒體。該裝置判斷對應一使用者之一感興趣區域是否位於複數個候選物件中之一目標物件。該裝置擷取一即時影像。響應於該感興趣區域位於該目標物件，該裝置判斷該目標物件是否屬於一連線電子裝置類別。響應於該目標物件屬於該連線電子裝置類別，該裝置自該目標物件取得一顯示內容，且設定該顯示內容作為一查詢影像。響應於該目標物件不屬於該連線電子裝置類別，該裝置擷取一即時影像，且設定該即時影像作為該查詢影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A query image generating device, method, and non-transitory computer readable storage medium thereof are provided. The device determines whether a region of interest corresponding to a user is located at a target object among candidate objects. In response to the region of interest being located at the target object, the device determines whether the target object belongs to a connected electronic device category. In response to the target object belonging to the connected electronic device category, the device obtains a display content from the target object and sets the display content as a query image. In response to the target object not belonging to the connected electronic device category, the device captures a real-time image, and sets the real-time image as the query image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:查詢影像產生方法</p>
        <p type="p">S801、S803、S805、S807:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="790" publication-number="202632652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C7/12</main-classification>
        <further-classification edition="200601120260302B">G11C7/18</further-classification>
        <further-classification edition="200601120260302B">G11C8/08</further-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/40</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANG-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金允宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOONJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍我</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昇煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　珍優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪成彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SEONGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種半導體裝置，其包括：基體；半導體圖案，其安置於該基體上且在平行於該基體之上表面的第一方向上延伸；字元線，其安置於該半導體圖案上且在第二方向上延伸，該第二方向平行於該基體之該上表面且與該第一方向相交；位元線，其連接於該半導體圖案之一端且在垂直於該基體之該上表面的第三方向上延伸；下部電極，其包含覆蓋該半導體圖案之另一端且安置於該半導體圖案之另一側的第一下部電極層及安置於該第一下部電極層上的第二下部電極層；上部電極，其安置於該下部電極上；以及介電層，其安置於該下部電極與該上部電極之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a semiconductor pattern positioned on the substrate and extending in a first direction parallel to an upper surface of the substrate, a word line positioned on the semiconductor pattern and extending in a second direction, which is parallel to the upper surface of the substrate and intersects the first direction, a bit line connected to one end of the semiconductor pattern and extending in a third direction perpendicular to the upper surface of the substrate, a lower electrode comprising a first lower electrode layer covering the other end of the semiconductor pattern and positioned on the other side of the semiconductor pattern, and a second lower electrode layer positioned on the first lower electrode layer, an upper electrode positioned on the lower electrode, and a dielectric layer positioned between the lower electrode and the upper electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">210:第一絕緣層</p>
        <p type="p">220:閘極絕緣圖案</p>
        <p type="p">230:第二絕緣層</p>
        <p type="p">242:第一間隔體</p>
        <p type="p">244:第二間隔體</p>
        <p type="p">310:下部電極</p>
        <p type="p">320:介電層</p>
        <p type="p">330:上部電極</p>
        <p type="p">BL:位元線</p>
        <p type="p">DS:資料儲存元件</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">SP:半導體圖案</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="791" publication-number="202632788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝設備、功率電路、及形成半導體封裝之方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE APPARATUS, POWER CIRCUIT, AND METHOD OF FORMING SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260302B">H01R12/57</main-classification>
        <further-classification edition="200601120260302B">H01R13/08</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉賈可莫爾　阿塔波爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAJUCKAMOL, ATAPOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　志雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEW, CHEE HIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括一基底、一尖端、及設置在此基底與此尖端之間的一本體區域。此設備更包括：一凸緣，其設置在一移動組件的一頂部；及一偏置組件，其耦接至此移動組件。此移動組件配置以在此本體區域上滑動，且此偏置組件配置以將此凸緣向上偏置靠在一表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a base, a tip, and a body region disposed between the base and the tip. The apparatus further includes a flange disposed on a top of a moving component and a biasing component coupled to the moving component. The moving component is configured to slide on the body region, and the biasing component is configured to bias the flange upward against a surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:本體區域</p>
        <p type="p">102A:尖端區域</p>
        <p type="p">104:基底</p>
        <p type="p">107:凸緣</p>
        <p type="p">108:移動組件</p>
        <p type="p">109:偏置組件</p>
        <p type="p">120:直接覆金屬基板</p>
        <p type="p">122:焊料層</p>
        <p type="p">200:模具腔或槽</p>
        <p type="p">210:底部模穴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="792" publication-number="202633274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法及微波電漿裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MICROWAVE PLASMA APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P14/60</main-classification>
        <further-classification edition="202601120260422B">H10P14/694</further-classification>
        <further-classification edition="200601120260422B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今中雅士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMANAKA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎和良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>軍司勲男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNJI, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種在凹部填埋膜的基板處理方法、半導體裝置之製造方法及微波電漿裝置。&lt;br/&gt;  本發明之基板處理方法包含以下步驟：準備具有凹凸構造之基板的步驟；在該凹凸構造形成至少包含矽及氮之介電膜，並在該凹凸構造之凹部內形成具有不均一部之該介電膜的步驟；及曝露於包含氧氣的第一電漿，而在該介電膜的表面形成保護膜，並且使該凹凸構造的該不均一部之上側結合，以形成包含將該不均一部堵住之罩蓋層之保護膜的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="793" publication-number="202633417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電系統、容器及充電方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P95/80</main-classification>
        <further-classification edition="202601120260420B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山公宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, KIMIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤俊人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, SHUNTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明旨在提供一種技術，藉由在適當的時間點充電，可使基板型感測器穩定地動作。  &lt;br/&gt;[解決手段]一種充電系統，包含：複數之基板處理系統、容器、搬送系統、作業站、及控制部。容器具有：可偵測能否對該基板處理系統搬送該基板型感測器相關之資訊的感測器。容器在偵測到不能搬送基板型感測器時，從蓄電池對基板型感測器充電，並在偵測到能搬送基板型感測器時，停止從蓄電池對基板型感測器充電。控制部在判定要進行蓄電池的更換或充電時，將搬送系統加以控制，而將容器搬送至作業站，並在判定不進行蓄電池的更換或充電時，將搬送系統加以控制，而將容器搬送至複數之基板處理系統中任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">10:基板處理系統</p>
        <p type="p">11:處理模組</p>
        <p type="p">111:處理容器</p>
        <p type="p">112:平台</p>
        <p type="p">12:真空搬送模組</p>
        <p type="p">121:真空搬送容器</p>
        <p type="p">122:真空搬送裝置</p>
        <p type="p">13:加載鎖模組</p>
        <p type="p">14:大氣搬送模組</p>
        <p type="p">141:大氣搬送容器</p>
        <p type="p">142:大氣搬送裝置</p>
        <p type="p">15:載入埠</p>
        <p type="p">16:對準模組</p>
        <p type="p">20:搬送系統</p>
        <p type="p">21:軌道</p>
        <p type="p">22:作業站</p>
        <p type="p">23:分岔軌道</p>
        <p type="p">29:控制部</p>
        <p type="p">30:基板型感測器</p>
        <p type="p">40:容器</p>
        <p type="p">C:容器</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="794" publication-number="202633064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B10/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓珍優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李基碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KISEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玟秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種半導體裝置，其包括：一第一層，其包括連接至位元線及字線之記憶體胞元，其中該等記憶體胞元中之各者包括一胞元電晶體及一胞元電容器，一第二層，其位於該第一層上且包括連接至該等字線之一列解碼器、連接至該等位元線之一感測放大器電路以及經組配以判定該等位元線當中的一選擇位元線之一行解碼器；以及一第三層，其位於該第二層上，該第三層包括：一邏輯電路，其經組配以控制該列解碼器、該感測放大器電路以及該行解碼器；以及一輸入/輸出介面，其經組配以將一信號傳輸至一外部裝置及自該外部裝置接收一信號，其中該第二層包括一計算電路，該計算電路經組配以基於由該輸入/輸出介面接收之輸入資料及自該等記憶體胞元讀取之讀取資料中之至少一者執行至少一個計算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first layer including memory cells connected to bitlines and wordlines, where each of the memory cells includes a cell transistor and a cell capacitor, a second layer on the first layer and including a row decoder connected to the wordlines, a sense amplifier circuit connected to the bitlines, and a column decoder configured to determine a select bitline among the bitlines, and a third layer on the second layer, the third layer including a logic circuit configured to control the row decoder, the sense amplifier circuit, and the column decoder and an input/output interface configured to transmit a signal to and receive a signal from an external device, where the second layer includes a computation circuit configured to execute at least one computation based on at least one of input data received by the input/output interface and read data read from the memory cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:半導體裝置</p>
        <p type="p">60:胞元區</p>
        <p type="p">70:核心區</p>
        <p type="p">71:列解碼器</p>
        <p type="p">72:子字線解碼器</p>
        <p type="p">73:位元線感測放大器</p>
        <p type="p">74:第一記憶體中處理(PIM)區塊</p>
        <p type="p">75:行解碼器</p>
        <p type="p">80:周邊電路區</p>
        <p type="p">81:第二PIM區塊</p>
        <p type="p">82:邏輯電路</p>
        <p type="p">83:輸入/輸出介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="795" publication-number="202633483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉印印模材、感溫性黏著材組成物、微轉印印刷裝置及轉印印刷方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W72/00</main-classification>
        <further-classification edition="200601120260422B">C08J5/18</further-classification>
        <further-classification edition="200601120260422B">C08L83/04</further-classification>
        <further-classification edition="200601120260422B">C08L101/02</further-classification>
        <further-classification edition="202601120260422B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶應義塾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEIO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安池伸夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUIKE, NOBUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村達哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田泰友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, YASUTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤星颯麻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAHOSHI, SOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤拓未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成可加快元件的拾取速度及釋放速度且可於元件轉印後抑制由殘留物引起的污染產生的轉印印模的轉印印模材。採用一種轉印印模材，其含有聚合物（A），所述聚合物（A）於側鏈具有為選自由碳數10以上的烷基及碳數10以上的烷基中的亞甲基的一部分經取代為-O-、-S-、-CO-、-COO-、-OCO-、-NR&lt;sup&gt;1A&lt;/sup&gt;-、-CO-NR&lt;sup&gt;1A&lt;/sup&gt;-、-NR&lt;sup&gt;1A&lt;/sup&gt;-CO-、-NR&lt;sup&gt;1A&lt;/sup&gt;-CO-NR&lt;sup&gt;1B&lt;/sup&gt;-、-NR&lt;sup&gt;1A&lt;/sup&gt;-CO-O-、-O-CO-NR&lt;sup&gt;1A&lt;/sup&gt;-而成的基（其中，R&lt;sup&gt;1A&lt;/sup&gt;及R&lt;sup&gt;1B&lt;/sup&gt;相互獨立地為氫原子或碳數1～3的烷基）所組成的群組中的至少一種的特定基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:微轉印印刷裝置</p>
        <p type="p">11:轉印印模</p>
        <p type="p">12:控制部</p>
        <p type="p">13:支撐部</p>
        <p type="p">14:印模部</p>
        <p type="p">14A:固定部</p>
        <p type="p">14B:黏著材部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="796" publication-number="202633441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有金屬化特徵之接合層</chinese-title>
        <english-title>BONDING LAYER WITH METALLIZATION FEATURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W40/20</main-classification>
        <further-classification edition="202601120260423B">H10W40/25</further-classification>
        <further-classification edition="202601120260423B">H10W70/01</further-classification>
        <further-classification edition="202601120260423B">H10W80/00</further-classification>
        <further-classification edition="202601120260423B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　裕燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YOOCHARN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">涉及使用具有嵌入金屬化特徵的氮化鋁接合層的接合晶圓的方法和結構。在一些實施例中，該方法可能包括在第一晶圓上形成接合層，其中該接合層由磊晶生長的氮化鋁形成，並且其中該第一晶圓為基於矽的材料，並在該第一晶圓上的接合層中形成一或多個金屬特徵。該第一晶圓可與具有一或多個第二金屬特徵的第二晶圓或晶片混合接合，該等第二金屬特徵周圍有擴散阻障層。該第二晶圓或晶片的該一或多個第二金屬特徵與該第一晶圓的該一或多個金屬特徵接合。該第二晶圓或晶片的該擴散阻障層至少與該第一晶圓的該接合層接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and structures relating to bonding wafers using an aluminum nitride bonding layer with embedded metallization features. In some embodiments, the method may comprise forming a bonding layer on a first wafer where the bonding layer is formed of epitaxially grown aluminum nitride and where the first wafer is a silicon-based material and forming one or more metal features into the bonding layer on the first wafer. The first wafer may be hybrid bonded to a second wafer or die with one or more second metal features surrounded by a diffusion barrier layer. The one or more second metal features of the second wafer or die bonds to the one or more metal features of the first wafer. The diffusion barrier layer of the second wafer or die bonds, at least, to the bonding layer of the first wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:晶圓</p>
        <p type="p">302:接合層</p>
        <p type="p">308:接合表面</p>
        <p type="p">502:第一擴散阻障層</p>
        <p type="p">602:金屬材料</p>
        <p type="p">710:特徵</p>
        <p type="p">802:元件晶圓/晶片</p>
        <p type="p">804:最上表面</p>
        <p type="p">812:元件</p>
        <p type="p">902:材料</p>
        <p type="p">906:堆疊</p>
        <p type="p">908:金屬化層</p>
        <p type="p">910:金屬化層</p>
        <p type="p">912:通孔</p>
        <p type="p">916:特徵</p>
        <p type="p">1002:阻障層</p>
        <p type="p">1004:最上表面</p>
        <p type="p">1200:視圖</p>
        <p type="p">1202:接合晶圓</p>
        <p type="p">1204:熱量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="797" publication-number="202632051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128669</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C23C16/42</main-classification>
        <further-classification edition="200601120260420B">C23C16/455</further-classification>
        <further-classification edition="200601120260420B">C23C16/52</further-classification>
        <further-classification edition="202501120260420B">H10D64/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石坂忠大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKA, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">降低在基板之凹部內形成在含矽的半導體層上之導電膜與該半導體層之間的接觸電阻。  &lt;br/&gt;  本揭露之基板處理方法，係具備下述工序：對具備凹部的基板供給含有鋯的第1處理氣體以形成構成該凹部的底壁之鋯矽化物層，該凹部係會使含矽的半導體層在底面露出且藉由絕緣體膜形成側壁；對該基板供給第2處理氣體以去除殘留在該凹部的側壁之鋯；以及成膜工序，係對進行去除該鋯之工序後之該基板供給成膜氣體以使導電膜成膜在該凹部內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:晶圓</p>
        <p type="p">11:矽(Si)層</p>
        <p type="p">12:氧化矽(SiO&lt;sub&gt;2&lt;/sub&gt;)層</p>
        <p type="p">13:氮化矽(SiN)膜</p>
        <p type="p">14:凹部</p>
        <p type="p">21:ZrSi層</p>
        <p type="p">22:Zr膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="798" publication-number="202631903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、修飾基板之製造方法、積層體之製造方法、電子器件之製造方法、化合物</chinese-title>
        <english-title>COMPOSITION, METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L101/06</main-classification>
        <further-classification edition="200601120260504B">C08L25/18</further-classification>
        <further-classification edition="200601120260504B">C08L45/00</further-classification>
        <further-classification edition="200601120260504B">C08L61/14</further-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="202601120260504B">H10P14/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下重直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOJU, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤宏一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物、修飾基板之製造方法、積層體之製造方法、電子器件之製造方法、及化合物，所述組成物能夠在基板中含矽原子及氮原子的區域上形成可抑制因原子層沉積處理而成膜的被膜，所述組成物能夠在基板中含矽原子及鍺原子的區域上形成可抑制因原子層沉積處理而成膜的被膜。本發明的組成物係一種用於在具有含矽原子及氮原子之區域的基板的上述區域上形成抑制因原子層沉積處理而成膜的被膜的組成物，該組成物包含具有含酸性官能基之重複單元的化合物。又，本發明的組成物係一種用於在具有含矽原子及鍺原子之區域的基板的上述區域上形成抑制因原子層沉積處理而成膜的被膜的組成物，該組成物包含具有含酸性官能基之重複單元的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="799" publication-number="202633448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、其製造方法、與其操作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10W40/47</main-classification>
        <further-classification edition="202601120260420B">H10W76/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商科林堤斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORINTIS SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法爾尼　馬利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAHRNI, MALIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　俄普　雷姆科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ERP, REMCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明考量半導體裝置(100)，其包括基板(12)；晶粒配置(10)，包括至少一半導體晶粒(66)，且晶粒配置(10)具有面向基板(12)的下側(14)與背向基板(12)的上側(16)；框架組件(20)，以框架狀的形式延伸於晶粒配置(10)周圍；蓋組件(26)，以流體密封的形式連接至框架組件(20)，且蓋組件的一部分面向晶粒配置(10)的上側(16)；以及空洞(30)，容納冷卻劑於其中以冷卻晶粒配置(10)。本發明亦考量設置半導體裝置(100)所用的框架組件(20)，以及製造與操作半導體裝置(100)的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a semiconductor device (100), comprising: a substrate (12); a die arrangement (10) comprising at least one semiconductor die (66), the die arrangement (10) having an underside (14) facing the substrate (12) and an upper side (16) facing away from the substrate (12); a frame member (20) extending around the die arrangement (10) in a frame-like manner; a lid member (26) that is connected to the frame member (20) in a fluid-tight manner and a section of which faces towards the upper side (16) of the die arrangement (10); and a cavity (30) in which a coolant is receivable to cool the die arrangement (10). The invention also concerns a frame member (20) for configuring such a semiconductor device (100) as well as methods manufacturing and operating such a semiconductor device (100).</p>
      </isu-abst>
      <representative-img>
        <p type="p">H:高度軸</p>
        <p type="p">10:晶粒配置</p>
        <p type="p">12:基板</p>
        <p type="p">14:下側</p>
        <p type="p">16:上側</p>
        <p type="p">18:外周面</p>
        <p type="p">20:框架組件</p>
        <p type="p">21:空間</p>
        <p type="p">22:密封劑</p>
        <p type="p">26:蓋組件</p>
        <p type="p">28:流體密封連接</p>
        <p type="p">30:空洞</p>
        <p type="p">31:入口</p>
        <p type="p">33:出口</p>
        <p type="p">35:容納空間</p>
        <p type="p">100:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="800" publication-number="202633286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P50/20</main-classification>
        <further-classification edition="202601120260422B">H10P50/28</further-classification>
        <further-classification edition="200601120260422B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李暁竜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕杜布羅斯卡雅　哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADDUBROUSKAYA, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕切科羅通達羅　安東尼奧路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PACHECO ROTONDARO, ANTONIO LUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井洋之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, TAMOTSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口賢治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　提供一種對矽化合物膜選擇性地進行蝕刻的基板處理方法及基板處理裝置。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　基板處理方法，具有：準備基板，該基板具有：基底膜、形成於上述基底膜上的第1矽化合物膜、及形成於上述第1矽化合物膜上，並具有開口的圖案的光阻膜的工程；形成覆蓋上述光阻膜的開口的底部及上述光阻膜的氧化鋁膜的工程；對上述基板供應含氟氣體或含氟混合氣體，將形成於上述光阻膜的開口的底部的上述氧化鋁膜作為鋁化合物的觸媒，用化學氣相蝕刻在上述第1矽化合物膜形成開口的圖案的工程；及去除覆蓋上述光阻膜的上述氧化鋁膜及上述第1矽化合物膜的開口內的上述鋁化合物的工程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S112:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="801" publication-number="202633322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/00</main-classification>
        <further-classification edition="202601120260420B">H10P72/30</further-classification>
        <further-classification edition="202601120260420B">H10P72/78</further-classification>
        <further-classification edition="200601120260420B">F03G7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤徹治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可於基板處理系統中提高電力效率之技術。基板處理系統具備：撓曲構件，其構成為因壓力變動而撓曲；及發電元件，其安裝於撓曲構件，且構成為藉由撓曲構件之撓曲而發電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:撓曲構件</p>
        <p type="p">301:發電元件</p>
        <p type="p">400:腔室</p>
        <p type="p">400a:側壁部</p>
        <p type="p">400b,400c:搬送口</p>
        <p type="p">401:基板支持部</p>
        <p type="p">402:升降部</p>
        <p type="p">403:排氣部</p>
        <p type="p">404:供氣部</p>
        <p type="p">GS:發電系統</p>
        <p type="p">LL1,LL2:裝載閉鎖模組</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="802" publication-number="202631320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能化研磨液補液系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">B24B57/02</main-classification>
        <further-classification edition="201201120251030B">B24B37/34</further-classification>
        <further-classification edition="200601120251030B">G05D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全營科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銘傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亮潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能化研磨液補液系統，包括混液設備、供給槽及控制單元，混液設備負責混合調製出所需的研磨液量，並設有輸液管輸出研磨液；供給槽設有液位感測器，該輸液管輸出研磨液至供給槽內，液位感測器負責測量供給槽內的液位，並輸出百分比的液位資訊，供給槽還設有輸出管以輸出研磨液；控制單元電性連接液位感測器以接收液位資訊，並根據消耗液量與所需時間的變化值控制混液設備調製出研磨液量；藉此依據供給槽使用量，適量補充研磨液，除了能維持研磨液的供液品質，满足研磨需求，且能避免研磨液浪費，大幅節省生產成本，為一種智能化補液的創新設計。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:混液設備</p>
        <p type="p">31:輸液管</p>
        <p type="p">40:供給槽</p>
        <p type="p">41:液位感測器</p>
        <p type="p">42:輸出管</p>
        <p type="p">43:排放管</p>
        <p type="p">50:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="803" publication-number="202633138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/01</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商台積電亞利桑那公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC ARIZONA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭成毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　作宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭琮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, TSUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括形成電晶體作為晶圓的一部分。電晶體包括一半導體通道、包含位於半導體通道上方的閘極介電質及位於閘極介電質上方的閘電極之一閘極堆疊、及位於半導體通道一端旁並與此端接合的一源極/汲極區域。方法進一步包含在源極/汲極區域上方形成源極/汲極接觸插塞並與源極/汲極區域電性耦合，以及從晶圓後側執行蝕刻製程以形成閘極接觸開口。閘極介電質被蝕穿，且閘電極暴露於閘極接觸開口。在閘極接觸開口中形成後側閘極接觸插塞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a transistor as a part of a wafer. The transistor includes a semiconductor channel, a gate stack comprising a gate dielectric over the semiconductor channel and a gate electrode over the gate dielectric, and a source/drain region aside of, and joined to, an end of the semiconductor channel. The method further comprises forming a source/drain contact plug over and electrically coupling to the source/drain region, and performing an etching process from a backside of the wafer to form a gate contact opening. The gate dielectric is etched-through, and the gate electrode is exposed to the gate contact opening. A backside gate contact plug is formed in the gate contact opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:晶圓</p>
        <p type="p">20:基板</p>
        <p type="p">22:STI區域</p>
        <p type="p">23N:半導體鰭</p>
        <p type="p">23P:半導體鰭</p>
        <p type="p">24N:n型FinFET/n型電晶體</p>
        <p type="p">24P:p型FinFET/p型電晶體</p>
        <p type="p">32:界面層</p>
        <p type="p">34:高介電常數介電層</p>
        <p type="p">36:閘極介電質</p>
        <p type="p">40N:閘電極/閘電極層</p>
        <p type="p">40P:閘電極/閘電極層</p>
        <p type="p">42N:閘極堆疊</p>
        <p type="p">42P:閘極堆疊</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">46:CESL</p>
        <p type="p">48:ILD</p>
        <p type="p">58:ESL</p>
        <p type="p">60:ILD</p>
        <p type="p">64:互連結構</p>
        <p type="p">75:虛線</p>
        <p type="p">76:介電隔離層</p>
        <p type="p">78:後側接觸插塞</p>
        <p type="p">78-1:部分</p>
        <p type="p">78-2:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="804" publication-number="202632296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針卡</chinese-title>
        <english-title>PROBE CARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G01R1/073</main-classification>
        <further-classification edition="202001120251001B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電子材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN ELECTRONIC MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中翔大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田尻泰望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJIRI, TAIBOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於檢查半導體器件等的探針卡包括：探針單元，其具有探針和所述探針的支承器；保持架，其具有固定面，通過將所述支承器螺釘緊固於所述固定面上以保持所述探針單元；以及止動器，其設置於所述保持架上，可以切換為：第二狀態，在所述螺釘緊固時通過按壓所述支承器以阻止所述探針單元在所述固定面的面內方向上的位移；以及第一狀態，停止對所述支承器的按壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針卡</p>
        <p type="p">2:探針單元</p>
        <p type="p">3:保持架</p>
        <p type="p">4:佈線基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="805" publication-number="202632731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/32</main-classification>
        <further-classification edition="202601120260422B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東雲秀司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUMO, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林元輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]抑制基板的損傷同時有效率地生成自由基。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　一個例示的實施形態的基板處理裝置，具備：畫定內部空間的處理容器；對第1空間供應第1氣體的第1氣體供應部；在第1空間生成第1氣體的電漿的電漿生成部；對第2空間供應第2氣體的第2氣體供應部；設置於第3空間的基板支持體；配置於第1空間與第2空間之間的網目構件；配置於第2空間與第3空間之間的集電板；在網目構件與集電板之間施加脈衝電壓對第2空間內的電子供應能量的能量供應部；脈衝電壓，將在第1電壓等級與第2電壓等級之間週期性變動，第1電壓等級為比離子化電壓還低的電壓等級，第2電壓等級為比離子化電壓還高的電壓等級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:處理容器</p>
        <p type="p">10A:容器上部</p>
        <p type="p">10B:容器下部</p>
        <p type="p">10g:閘閥</p>
        <p type="p">10p:通路</p>
        <p type="p">10s:內部空間</p>
        <p type="p">11:電漿生成部</p>
        <p type="p">12:基板支持體</p>
        <p type="p">13:第1氣體供應部</p>
        <p type="p">14:第2氣體供應部</p>
        <p type="p">15:網目構件</p>
        <p type="p">15h,16h:貫通孔</p>
        <p type="p">16:集電板</p>
        <p type="p">16a:氣體擴散室</p>
        <p type="p">16b:氣體通路</p>
        <p type="p">16c:氣體吐出孔</p>
        <p type="p">17:能量供應部</p>
        <p type="p">18:絕緣構件</p>
        <p type="p">20:天線</p>
        <p type="p">21:中央氣體注入部</p>
        <p type="p">21a:氣體供應口</p>
        <p type="p">21b:氣體流路</p>
        <p type="p">21c:氣體導入口</p>
        <p type="p">25:閥</p>
        <p type="p">26:流量控制器</p>
        <p type="p">27:氣源</p>
        <p type="p">30:電源</p>
        <p type="p">31:匹配器</p>
        <p type="p">41:下部電極</p>
        <p type="p">41f:直流電源</p>
        <p type="p">42:靜電吸盤</p>
        <p type="p">43:排氣管</p>
        <p type="p">44:排氣裝置</p>
        <p type="p">45:電源單元</p>
        <p type="p">46:低通濾波器</p>
        <p type="p">50:可變直流電源</p>
        <p type="p">63:氣體導入埠</p>
        <p type="p">64:氣體供給管</p>
        <p type="p">65:閥</p>
        <p type="p">66:流量控制器</p>
        <p type="p">67:氣源</p>
        <p type="p">101:介電體窗</p>
        <p type="p">102:側壁</p>
        <p type="p">AX:軸線</p>
        <p type="p">FR:對焦環</p>
        <p type="p">G1:第1氣體</p>
        <p type="p">G2:第2氣體</p>
        <p type="p">MC:控制部</p>
        <p type="p">PL:電漿</p>
        <p type="p">S1:電漿生成空間(第1空間)</p>
        <p type="p">S2:電子抽取空間(第2空間)</p>
        <p type="p">S3:處理空間(第3空間)</p>
        <p type="p">Vp:脈衝電壓</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="806" publication-number="202633465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129226</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、製造半導體裝置的方法及電子系統</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260416B">H10W70/60</main-classification>
        <further-classification edition="202601120260416B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　伍邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOOPOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭祥楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SANGNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置，包括包含貫通穿孔的基底、基底的第一表面上的第一重分佈層、基底的與第一表面相對的第二表面上的第二重分佈層、第二重分佈層的第二表面上的半導體晶片、以及包含在基底、第一重分佈層、以及第二重分佈層中的至少一個中的一或多個電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device including a substrate including a through via, a first redistribution layer on a first surface of the substrate, a second redistribution layer on a second surface, opposite to the first surface, of the substrate, a semiconductor chip on a second surface of the second redistribution layer, and one or more capacitors included in at least one of the substrates, the first redistribution layer, and the second redistribution layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:半導體晶片</p>
        <p type="p">11:連接構件</p>
        <p type="p">12:底部填充層</p>
        <p type="p">14:電容器</p>
        <p type="p">15:配線</p>
        <p type="p">19:晶片上電容器</p>
        <p type="p">20:穩壓模組/VRM</p>
        <p type="p">50:整合式堆疊電容器/ISC</p>
        <p type="p">100:第一重分佈層</p>
        <p type="p">110:第一重分佈絕緣層</p>
        <p type="p">120:第一配線圖案</p>
        <p type="p">130:第一通孔</p>
        <p type="p">140:鈍化層</p>
        <p type="p">150:球下金屬層/UBM層</p>
        <p type="p">160:導電層</p>
        <p type="p">170:外部連接端子</p>
        <p type="p">200:矽中介層</p>
        <p type="p">210:矽基底</p>
        <p type="p">220:矽穿孔</p>
        <p type="p">300:第二重分佈層</p>
        <p type="p">310:第二重分佈絕緣層</p>
        <p type="p">320:第二配線圖案</p>
        <p type="p">330:第二通孔</p>
        <p type="p">1000:封裝基底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="807" publication-number="202632703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤模組</chinese-title>
        <english-title>KEYBOARD MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01H13/70</main-classification>
        <further-classification edition="200601120251201B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳義文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鍵盤模組，包括一基板組件及一按鍵組件。基板組件包括一基板、一導光板及多個發光元件。導光板包括多個開口，這些發光元件位於對應的這些開口內。基板包括一線路層及一基板反光層。發光元件包括多個接墊，這些接墊連接於線路層，且部分的基板反光層位於這些接墊中相鄰的兩者之間。按鍵組件連接於基板組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyboard module including a base plate assembly and a key assembly is provided. The base plate assembly includes a base plate, a light guide plate and a plurality of light-emitting elements. The light guide plate includes a plurality of openings, and the light-emitting elements are located in the corresponding openings. The base plate includes a circuit layer and a base plate reflective layer. The light-emitting element includes a plurality of pads, the pads are connected to the circuit layer, and a part of the base plate reflective layer is located between the two adjacent pads. The key assembly is connected to the base plate assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鍵盤模組</p>
        <p type="p">100:基板組件</p>
        <p type="p">110:基板</p>
        <p type="p">111:線路層</p>
        <p type="p">112:基板反光層</p>
        <p type="p">113:基板遮光層</p>
        <p type="p">120:導光板</p>
        <p type="p">121:開口</p>
        <p type="p">130:發光元件</p>
        <p type="p">131:接墊</p>
        <p type="p">140:背板</p>
        <p type="p">141:延伸部</p>
        <p type="p">142:避讓孔</p>
        <p type="p">143:背板主體</p>
        <p type="p">150:蓋板</p>
        <p type="p">200:按鍵組件</p>
        <p type="p">201:按鍵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="808" publication-number="202633032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路元件、電子封裝元件及電路板組件</chinese-title>
        <english-title>CIRCUIT ELEMENT, ELECTRONIC PACKAGING ELEMENT AND CIRCUIT BOARD ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05K1/11</main-classification>
        <further-classification edition="200601120260302B">H05K1/16</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENG-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHONG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路元件，包含一第一電極、一第一連接線、一第四連接線、一第一負載、一第二電極及一第三連接線。第一連接線電性連接第一電極。第四連接線電性連接第一電極。第一連接線至第四連接線電性連接形成一第一路徑。第二電極分離並耦合於第一電極。第三連接線電性連接第二電極，第三連接線為一第二路徑的至少一部分。第一連接線及第三連接線用以分別供一信號輸入及輸出電路元件，第一路徑的至少一線段及第二路徑的至少一線段不互相垂直。藉此，可降低饋通信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit element includes a first electrode, a first connection line, a fourth connection line, a first load, a second electrode and a third connection line. The first connection line is electrically connected to the first electrode. The fourth connection line is electrically connected to the first electrode. The first connection line to the fourth connection line are electrically connected to form a first path. The second electrode is separated and coupled to the first electrode. The third connection line is electrically connected to the second electrode, and the third connection line is at least a part of a second path. The first connection line and the third connection line are configured to respectively input a signal to the circuit element and output the signal therefrom, and at least one line segment of the first path and at least one line segment of the second path are not perpendicular to each other. Therefore, the feedthrough signal can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路元件</p>
        <p type="p">121:第一連接線</p>
        <p type="p">122:第二連接線</p>
        <p type="p">123:第三連接線</p>
        <p type="p">124:第四連接線</p>
        <p type="p">141:第一電極</p>
        <p type="p">142:第二電極</p>
        <p type="p">151:第一路徑</p>
        <p type="p">152:第二路徑</p>
        <p type="p">171:第一負載</p>
        <p type="p">172:第二負載</p>
        <p type="p">D1:第一方向</p>
        <p type="p">P1:輸入埠</p>
        <p type="p">P3:輸出埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="809" publication-number="202633148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260327B">H10D84/80</main-classification>
        <further-classification edition="202501120260327B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜相敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, SANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珉容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, MINYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高在康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOH, JAEKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權義熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, UIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬振源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, JINWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括基底，包括主動圖案、在主動圖案上彼此垂直間隔開的第一和第二半導體圖案、在第一和第二半導體圖案之間的閘極電極、環繞閘極電極的閘極絕緣圖案、以及在閘極電極中的薄層結構，其中薄層結構由閘極電極環繞，並且薄層結構與閘極絕緣圖案間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate including an active pattern, first and second semiconductor patterns vertically spaced apart from each other on the active pattern, a gate electrode between the first and second semiconductor patterns, a gate insulating pattern surrounding the gate electrode, and a thin layer structure in the gate electrode, wherein the thin layer structure is surrounded by the gate electrode, and the thin layer structure is spaced apart from the gate insulating pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">AR1:第一主動區</p>
        <p type="p">AR2:第二主動區</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">HE1:第一高度</p>
        <p type="p">M1_R1:第一電源線</p>
        <p type="p">M1_R2:第二電源線</p>
        <p type="p">SHC:單高度胞元</p>
        <p type="p">WI1:第一寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="810" publication-number="202631858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、發泡性樹脂組成物及擠出發泡成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08K5/5317</main-classification>
        <further-classification edition="200601120260424B">C08L25/06</further-classification>
        <further-classification edition="200601120260424B">C08K5/00</further-classification>
        <further-classification edition="200601120260424B">C08J9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山晃一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種可對各種熱塑性樹脂提高阻燃性、可賦予優異的耐熱性的樹脂組成物、以及適於獲得阻燃性高、耐熱性亦優異的擠出發泡成形體的發泡性樹脂組成物。本發明的樹脂組成物含有熱塑性樹脂、溴系阻燃劑、以及有機膦酸。本發明的發泡性樹脂組成物含有所述樹脂組成物、以及發泡劑。本發明的發泡性樹脂組成物可獲得阻燃性優異的擠出發泡成形體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="811" publication-number="202632230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速變化現象的基於事件的偵測</chinese-title>
        <english-title>EVENT-BASED DETECTION OF RAPIDLY CHANGING PHENOMENA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G01J1/10</main-classification>
        <further-classification edition="200601120260421B">G01J1/16</further-classification>
        <further-classification edition="201701120260421B">G06T7/20</further-classification>
        <further-classification edition="200601120260421B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦拉尼　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWLANI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭森　保羅　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANZEN, PAUL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉斯　布萊恩　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMS, BRIAN JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉比　拉福商</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABBI, RAFSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於監控處理設備以及偵測快速變化現象的基於事件的偵測之方法及設備。在一些實施例中，用於偵測快速變化現象的技術可以包含：回應於一現象的發生，判定由光學感測器獲得的多個光學信號的一或多個強度變化；偵測與光學信號的強度的一或多個變化相關聯的一或多個電壓變化；以及基於一或多個電壓變化維持高於一閾值來產生多個影像，該等影像代表該現象並包含在該等影像的對應像素處發生的光學信號的一或多個強度變化的多個指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for monitoring a processing apparatus and event-based detection of detecting rapidly changing phenomena are provided. In some embodiments, techniques for detecting rapidly changing phenomena may include: responsive to an occurrence of a phenomenon, determining one or more changes in an intensity of optical signals, the optical signals obtained by an optical sensor; detecting one or more changes in voltage correlating to the one or more changes in intensity of optical signals; and based on the one or more changes in voltage staying above a threshold, generating images representative of the phenomenon and comprising indications of the one or more changes in intensity of the optical signals occurring at corresponding pixels of the images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">t1、t2:時間</p>
        <p type="p">y、y'、y":時間段、時間長度</p>
        <p type="p">300:時間線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="812" publication-number="202631397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾膜及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">B32B27/20</main-classification>
        <further-classification edition="200601120260417B">B32B27/38</further-classification>
        <further-classification edition="201801120260417B">C08K3/013</further-classification>
        <further-classification edition="200601120260417B">C08L63/00</further-classification>
        <further-classification edition="200601120260417B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野息吹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, IBUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲田和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田一善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乾膜，係高填充有填料，且積層保護膜時不易產生凹痕。本發明的一形態係一種乾膜，係具備：第一膜；及樹脂層，係積層於前述第一膜之上。前述樹脂層係由含環氧樹脂、硬化劑、無機填料以及彈性體之樹脂組成物所形成。以前述樹脂組成物的固形分總量為基準，前述無機填料的含量為60.0~90.0質量%，前述彈性體的含量為1.0~20.0質量%。製作前述樹脂層的熔融黏度曲線時，熔融黏度曲線的極小點會存在於50~120℃的範圍內，前述極小點的熔融黏度(A2)為100Pa．s以上，50℃的熔融黏度(A1)與120℃的熔融黏度(A3)的比率(A3/A1)為1.0以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="813" publication-number="202632443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G03F7/26</main-classification>
        <further-classification edition="200601120260423B">G03F7/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]適當地去除被形成於基板的含有金屬之被膜的周邊部。  &lt;br/&gt;　　[解決手段]一種處理基板的處理裝置，具備：基板保持部，其係保持並旋轉形成有金屬含有光阻塗佈膜的基板；第1處理液供給部，其係對上述基板的表面供給第1處理液；第2處理液供給部，其係對上述基板的表面供給第2處理液；第3處理液供給部，其係對上述基板的表面供給第3處理液；第4處理液供給部，其係對上述基板的背面供給第4處理液；第5處理液供給部，其係對上述基板的背面供給第5處理液；第6處理液供給部，其係對上述基板的背面供給第6處理液；以及控制部；上述控制部被構成為執行以下步驟：第1步驟，其係在使上述基板旋轉的狀態下，從上述第1處理液供給部供給第1處理液，以去除從上述基板端部起具有特定寬度之區域的上述塗佈膜，在上述第1步驟時，從上述第4處理液供給部對上述基板的背面供給第4處理液；第2步驟，其係在上述第1步驟之後，在使上述基板旋轉的狀態下，使上述第2處理液供給部一面從上述基板的端部朝基板中心方向移動，一面對上述基板端部之已被去除塗佈膜的部分供給第2處理液，在上述第2步驟時，從上述第5處理液供給部對上述基板的背面供給第5處理液；第3步驟，其係在上述第2步驟之後，在使上述基板旋轉的狀態下，使上述第2處理液供給部一面從上述中心方向朝基板端部移動，一面供給第2處理液，在上述第3步驟時，從上述第5處理液供給部對上述基板的背面供給第5處理液；以及第4步驟，其係在上述第3步驟之後，在使上述基板旋轉的狀態下，從上述第3處理液供給部對上述基板端部起具有特定寬度之區域吐出第3處理液，在上述第4步驟時，從上述第6處理液供給部對上述基板的背面供給上述第6處理液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:塗佈膜形成裝置</p>
        <p type="p">2:處理容器</p>
        <p type="p">11:旋轉夾具</p>
        <p type="p">12:軸部</p>
        <p type="p">13:旋轉驅動機構</p>
        <p type="p">14:圓形板</p>
        <p type="p">15:貫穿孔</p>
        <p type="p">16:升降銷</p>
        <p type="p">17:升降板</p>
        <p type="p">18:升降機構</p>
        <p type="p">20:杯體</p>
        <p type="p">21:山型導引部</p>
        <p type="p">22:垂直壁</p>
        <p type="p">23:筒狀部</p>
        <p type="p">23a:傾斜體</p>
        <p type="p">24:上側導引部</p>
        <p type="p">25:開口部</p>
        <p type="p">26:液承接部</p>
        <p type="p">27:排液路</p>
        <p type="p">28:排氣管</p>
        <p type="p">32:光阻液供給噴嘴</p>
        <p type="p">33:光阻液供給源</p>
        <p type="p">34:供給路</p>
        <p type="p">42:處理液供給噴嘴</p>
        <p type="p">43:處理液供給噴嘴</p>
        <p type="p">44:供給源</p>
        <p type="p">45:供給路</p>
        <p type="p">46:酸性稀釋劑供給源</p>
        <p type="p">47:供給路</p>
        <p type="p">51:第1背面噴嘴</p>
        <p type="p">52:第2背面噴嘴</p>
        <p type="p">100:控制部</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="814" publication-number="202633430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅內連接結構及其製造方法</chinese-title>
        <english-title>COPPER INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W20/20</main-classification>
        <further-classification edition="202601120260427B">H10W72/40</further-classification>
        <further-classification edition="202601120260427B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭繼燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚　澤強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZEQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了一種易於與大尺寸金屬絲形成良好電連線效能焊點的用於積體電路晶片中的銅內連接結構。該銅內連接結構包括銅表面，金屬阻擋層和可焊接金屬層。所述銅內連接結構包括在所述金屬阻擋層上形成的厚度範圍在0.03微米至0.05微米之間的可焊接金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A copper interconnect structure for an integrated circuit die is provided for forming a good electrical solder connection with large-sized metal wires easily. The copper interconnect structure includes a copper surface, a metal barrier layer, and a weldable metal layer. The weldable metal layer is formed with a thickness ranging from 0.03 micrometer to 0.05 micrometer over the metal barrier layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:銅內連接結構</p>
        <p type="p">101:銅焊墊</p>
        <p type="p">102:銅表面</p>
        <p type="p">103:半導體基板</p>
        <p type="p">104:金屬阻擋層</p>
        <p type="p">105:可焊接金屬層</p>
        <p type="p">106:保護材料</p>
        <p type="p">A:金屬絲/鋁金屬絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="815" publication-number="202632466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉸鏈模組及電子裝置</chinese-title>
        <english-title>HINGE MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260225B">G06F1/16</main-classification>
        <further-classification edition="200601120260225B">E05D3/18</further-classification>
        <further-classification edition="200601120260225B">E05D11/10</further-classification>
        <further-classification edition="200601120260225B">F16H19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱哲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHE-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鉸鏈模組，包括第一/第二轉軸、限位組件以及第一切換組件。限位組件包括限位件、第一/第二滑動件以及齒輪。限位件包括第一限位部，第一/第二轉軸穿設於限位件。第一滑動件滑設於第一轉軸且包括第一齒條部及第二限位部。齒輪可轉動地設置於限位件且具有相對的第一/第二側，第一側可動地連接於第一齒條部。第二滑動件滑設於第二轉軸且包括可動地連接於第二側的第二齒條部。第一切換組件包括滑動架、驅動件以及彈性件。滑動架連接於第二滑動件且可相對於第二轉軸滑動。驅動件可動地連接於滑動架及第二轉軸。一種電子裝置亦被提及。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hinge module includes a first shaft, a second shaft, a limiting assembly and a first switching assembly. The limiting assembly includes a limiting member, a first sliding member, a second sliding member and a gear. The limiting member includes a first limiting part. The first shaft and the second shaft are disposed inside the limiting member. The first sliding member is slidably disposed on the first shaft and includes a first rack part and a second limiting part. The gear is rotatably disposed on the limiting member and has a first side and a second side which are relative to each other. The first side is movably connected to the first rack part. The second sliding member is slidably disposed on the second shaft and includes a second rack part which is movably connected to the second side. The first switching module includes a sliding rack, a driving member, and an elastic member. The sliding rack is connected to the second sliding member and slides relative to the second shaft. The driving member is movably connected to the sliding rack and the second shaft. An electronic device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鉸鏈模組</p>
        <p type="p">110:第一轉軸</p>
        <p type="p">120:第二轉軸</p>
        <p type="p">130:限位組件</p>
        <p type="p">131:限位件</p>
        <p type="p">1311:第一限位部</p>
        <p type="p">132:第一滑動件</p>
        <p type="p">1321:第一齒條部</p>
        <p type="p">1322:第二限位部</p>
        <p type="p">133:齒輪</p>
        <p type="p">134:第二滑動件</p>
        <p type="p">1341:第二齒條部</p>
        <p type="p">140:第一切換組件</p>
        <p type="p">141:滑動架</p>
        <p type="p">1411:第一滑槽</p>
        <p type="p">142:驅動件</p>
        <p type="p">1421:緊固件</p>
        <p type="p">143:彈性件</p>
        <p type="p">150:第二切換組件</p>
        <p type="p">151:支架</p>
        <p type="p">152:固定塊</p>
        <p type="p">153:第一凸輪</p>
        <p type="p">154:第二凸輪</p>
        <p type="p">155:滑塊</p>
        <p type="p">160:扭力件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">F1:緊固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="816" publication-number="202633075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶體裝置、其操作方法及包含該裝置的電子系統</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY DEVICE, METHOD OF OPERATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251219B">H10B12/00</main-classification>
        <further-classification edition="202301120251219B">H10B99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴哲權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHULKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜奎彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KYU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昊錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HOSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體記憶體裝置包括第一半導體晶粒和第二半導體晶粒。第二半導體晶粒在垂直方向上堆疊在第一半導體晶粒上。第一半導體晶粒包括第一連接墊、第二連接墊、第一字元線、和第二字元線。第一字元線電連接到第一連接墊。第二字元線電連接到第二連接墊。第二半導體晶粒包括第一子字元線驅動器和第二子字元線驅動器。第一子字元線驅動器在垂直方向上與第一連接墊間隔開。第二子字元線驅動器在垂直方向上與第二連接墊間隔開並通過第一連接墊驅動第一字元線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor memory device includes a first semiconductor die and a second semiconductor die. The second semiconductor die is stacked on the first semiconductor die in a vertical direction. The first semiconductor die includes a first connection pad, a second connection pad, a first wordline, and a second wordline. The first wordline is electrically connected to the first connection pad. The second wordline is electrically connected to the second connection pad. The second semiconductor die includes a first sub-wordline driver and a second sub-wordline driver. The first sub-wordline driver is spaced apart from the first connection pad in the vertical direction. The second sub-wordline driver is spaced apart from the second connection pad in the vertical direction and drives the first wordline through the first connection pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11、CPa:第一連接墊</p>
        <p type="p">13:垂直連接結構</p>
        <p type="p">15:端部</p>
        <p type="p">100:半導體記憶體裝置</p>
        <p type="p">100-1:第一半導體晶粒</p>
        <p type="p">100-2:第二半導體晶粒</p>
        <p type="p">CPb:第二連接墊</p>
        <p type="p">HD1、HD2:水平方向</p>
        <p type="p">SWDa:第一子字元線驅動器</p>
        <p type="p">SWDb:第二子字元線驅動器</p>
        <p type="p">VD:垂直方向</p>
        <p type="p">WLa:第一字元線</p>
        <p type="p">WLb:第二字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="817" publication-number="202631487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>六方氮化硼粉末</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C01B21/064</main-classification>
        <further-classification edition="200601120260420B">C04B35/5833</further-classification>
        <further-classification edition="200601120260420B">C08K3/38</further-classification>
        <further-classification edition="200601120260420B">C09K5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意礦物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE MINERAL &amp; ALLOY COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田尚臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍋島誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NABESHIMA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在用作填料時可進一步提高散熱構件的熱傳導率的h-BN粉末。一種六方氮化硼粉末，包含一次粒子以及所述一次粒子凝聚而成的二次粒子，其中，在以0.3 MPa的壓力噴射所述六方氮化硼粉末後藉由雷射繞射式粒度分佈測定法進行乾式測定的粒度分佈中，粒徑為20 μm以下的粒子的比例R1為0體積%～50體積%，粒徑超過20 μm且為100 μm以下的粒子的比例R2為40體積%～100體積%，粒徑超過100 μm的粒子的比例R3為0體積%～10體積%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="818" publication-number="202632250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面缺陷檢查裝置的管理方法及標準晶圓</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G01N21/47</main-classification>
        <further-classification edition="200601120260423B">G01N21/88</further-classification>
        <further-classification edition="200601120260423B">G01N21/892</further-classification>
        <further-classification edition="200601120260423B">G01N21/93</further-classification>
        <further-classification edition="200601120260423B">G01N21/956</further-classification>
        <further-classification edition="202601120260423B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石引涼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIBIKI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種表面缺陷檢查裝置的管理方法，是搭載有高和低角度散射檢出器之表面缺陷檢查裝置的管理方法，作為標準晶圓，準備一種在最表面上形成有複數個相對於表面之平行方向的尺寸比垂直方向的尺寸更大的凸形狀或凹形狀且座標與尺寸已知的缺陷之半導體矽晶圓，在管理對象的裝置中，利用檢出器檢出來自標準晶圓的缺陷的散射光，從而取得缺陷的座標與尺寸，有關同一座標的缺陷，針對每個檢出器算出標準晶圓中的已知的尺寸與檢出的尺寸的差異也就是檢出尺寸差異，針對每個檢出器取得該最頻值的絕對值，在高角度散射檢出器的檢出尺寸差異的最頻值的絕對值變成比低角度散射檢出器的檢出尺寸差異的最頻值的絕對值更大的情況，實行裝置的光學系統的檢點和校正。&lt;br/&gt;      藉此，可提供一種表面缺陷檢查裝置的管理方法，能夠檢出僅表面缺陷檢查裝置的高角度散射檢出器的異常，並對於檢出了異常之裝置實行校正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="819" publication-number="202631399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切割片用基材薄膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B32B27/32</main-classification>
        <further-classification edition="201801120260421B">C09J7/29</further-classification>
        <further-classification edition="202601120260421B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗薄膜先端加工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED FILM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田崎龍幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASAKI, TATSUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧本樹奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIMOTO, KINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧山太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUYAMA, FUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町田哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIDA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上則英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NORIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種切割片用基材薄膜，其抑制半導體晶圓之切割步驟中的切削碎屑的產生，且抗黏連性優良。一種切割片用基材薄膜，其係依序至少配置有A層、B層、C層之積層薄膜，其特徵為：前述A層係十點平均粗度Rz為1.5μm以上15.0μm以下，前述B層係丙烯系共聚物之含量為85質量%以上99質量%以下，且含有1質量%以上15質量%以下的烯烴系熱塑性彈性體，前述C層具有烯烴系熱塑性彈性體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="820" publication-number="202632650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統及控制非揮發性記憶體的方法</chinese-title>
        <english-title>MEMORY SYSTEM AND METHOD OF CONTROLLING NON-VOLATILE MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C7/10</main-classification>
        <further-classification edition="200601120260102B">G11C7/20</further-classification>
        <further-classification edition="200601120260102B">G11C7/22</further-classification>
        <further-classification edition="200601120260102B">G11C16/10</further-classification>
        <further-classification edition="200601120260102B">G11C16/14</further-classification>
        <further-classification edition="200601120260102B">G11C16/32</further-classification>
        <further-classification edition="200601120260102B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳川新悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGAWA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體系統以及一種控制非揮發性記憶體的方法，該方法能夠靈活地控制對非揮發性記憶體的存取。一種記憶體系統包括一個非揮發性記憶體以及與非揮發性記憶體電性連接的控制電路。控制電路被配置為：在目前寫入操作期間接收到由主機發出的第一讀取請求時，確定第一歷時與第二歷時之間的第一比值，第一歷時是指在最近一次完成的寫入操作完成之後至目前寫入操作完成之前執行的一次或多次讀取操作的累計時間，第二歷時是指目前寫入操作所需的時間；以及確定是否基於該第一比值暫停目前寫入操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present invention intends to provide a memory system and a method of controlling a non-volatile memory that can flexibly control access to a non-volatile memory. &lt;br/&gt;A memory system includes a non-volatile memory and a control circuit electrically connected to the non-volatile memory. The control circuit is configured to, upon reception of a first read request issued from a host during a current write operation, determine a first ratio of a first duration to a second duration, the first duration being an accumulated time of one or more read operations executed subsequent to completion of a most recently completed write operation and prior to completion of the current write operation, the second duration being a required time for the current write operation; and determine whether to suspend the current write operation based on the first ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S82,S84,S86,S88,S90,S92,S94,S96,S98,S100,S102,S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="821" publication-number="202633463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W70/40</main-classification>
        <further-classification edition="202601120260422B">H10W74/01</further-classification>
        <further-classification edition="202601120260422B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　子康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, ZIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種電子裝置包含具有晶粒底座和接觸件的基板。電子組件耦合到所述晶粒底座。導電連接件包含耦合到所述接觸件的支腳部分和耦合到所述電子組件的連接板部分。所述支腳部分包含頂側、底側和向外橫向側。斜面從所述向外橫向側向內延伸，且延伸到所述底側。導電黏合劑將所述支腳部分耦合到接觸件，且覆蓋所述斜面和所述底側。囊封物覆蓋所述電子組件、所述導電連接件和至少部分的所述基板。所述斜面改進所述導電連接件與所述基板之間的接合完整性。本文中還公開了其它實例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, an electronic device include a substrate with a die paddle and a contact. An electronic component is coupled to the die paddle. A conductive connect includes a foot portion coupled to the contact and a connect plate portion coupled to the electronic component. The foot portion includes a top side, a bottom side, and an outward lateral side. A chamfer extends inward from the outward lateral side and extends to the bottom side. A conductive adhesive couples the foot portions to contact and covers the chamfer and the bottom side. An encapsulant covers the electronic component, the conductive connect, and at least portions of the substrate. The chamfer improves the bonding integrity between the conductive connect and the substrate. Other examples and related methods are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21A:第一方向</p>
        <p type="p">21B:第二方向</p>
        <p type="p">32:角度</p>
        <p type="p">113:源極接觸件</p>
        <p type="p">132a:支腳部分</p>
        <p type="p">132b:接腳部分</p>
        <p type="p">135:斜面</p>
        <p type="p">150a:第一導電黏合劑</p>
        <p type="p">151a:向外側</p>
        <p type="p">321:距離</p>
        <p type="p">1321:頂側</p>
        <p type="p">1322:底側</p>
        <p type="p">1323:向外橫向側</p>
        <p type="p">1324:向內橫向側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="822" publication-number="202633163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="201101120260424B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭晩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴宰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴柱勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種積體電路裝置，其包括：複數個第一源極/汲極區域；複數個第二源極/汲極區域，其在一第一方向上與該等複數個第一源極/汲極區域間隔開且在該第一方向上堆疊在該等複數個第一源極/汲極區域上方；一第一接觸件，其在該第一方向上安置在該等複數個第一源極/汲極區域中之各者之一下部表面上；一第二接觸件，其在該第一方向上安置在該等複數個第二源極/汲極區域中之各者之一上部表面上；一傳導軌，其電連接至該第一接觸件或該第二接觸件且在該第一方向上延伸；一第一擴散阻斷結構，其在與該第一方向相交的一第二方向上安置在該傳導軌旁邊；以及一第二擴散阻斷結構，其在該第二方向上與該第一擴散阻斷結構間隔開，其中該傳導軌處於該第二擴散阻斷結構與該第一擴散阻斷結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a plurality of first source/drain areas, a plurality of second source/drain areas spaced apart from the plurality of first source/drain areas in a first direction and stacked above the plurality of first source/drain areas in the first direction, a first contact disposed on a lower surface of each of the plurality of first source/drain areas in the first direction, a second contact disposed on an upper surface of each of the plurality of second source/drain areas in the first direction, a conductive rail electrically connected to the first contact or the second contact and extending in the first direction, a first diffusion breaker disposed beside the conductive rail in a second direction intersecting the first direction, and a second diffusion breaker spaced apart from the first diffusion breaker in the second direction with the conductive rail in between.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路裝置</p>
        <p type="p">150:閘極分離結構</p>
        <p type="p">152:閘極分離襯裡</p>
        <p type="p">154:閘極分離氧化物膜</p>
        <p type="p">210:第一擴散阻斷結構</p>
        <p type="p">220:第二擴散阻斷結構</p>
        <p type="p">A1-A1',A2-A2',B1-B1',B2-B2',B3-B3':線</p>
        <p type="p">CA2:第二接觸件</p>
        <p type="p">CB:閘極接觸件</p>
        <p type="p">CR:胞元</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GL1:第一閘極線</p>
        <p type="p">GL2:第二閘極線</p>
        <p type="p">NS1:下部奈米片</p>
        <p type="p">NS2:上部奈米片</p>
        <p type="p">VL:傳導軌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="823" publication-number="202632800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多組插孔並結構緊湊的轉換插座支架結構</chinese-title>
        <english-title>ADAPTER FRAME STRUCTURE WITH MULTIPLE SETS OF RECEPTACLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">H01R13/46</main-classification>
        <further-classification edition="200601120260128B">H01R27/00</further-classification>
        <further-classification edition="200601120260128B">H01R31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市萬旅通電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN WANLVTONG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林良贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIANGZAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具有多組插孔並結構緊湊的轉換插座支架結構，包括有一支架，所述支架設置呈不同制式的多個主插孔以及第一副插孔；所述支架之上還滑動連接有插腳組件，所述插腳組件包括有沿所述主插孔並排方向相互並排設置的多個插腳單元，每個所述插腳單元均包括有第一伸縮件，所述第一伸縮件之上設置有用以與外界插座插接的端子，與所述第一副插孔相對應的所述插接單元還包括有滑動設置在所述支架之上的第二伸縮件。本發明設置有若干個不同制式的主插孔，第一副插孔設置在主插孔沿既定方向延伸的延長線之上，在使用的過程中能夠供至少兩個電器進行插接，提高使用的性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">111:主插孔</p>
        <p type="p">121:第一副插孔</p>
        <p type="p">131:第二粗插孔</p>
        <p type="p">141:第三副插孔</p>
        <p type="p">200:支架</p>
        <p type="p">300:插腳組件</p>
        <p type="p">310:插腳單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="824" publication-number="202631877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化性組成物及其固化物、光熔融性組成物、結構體之製造方法、半導體裝置之製造方法以及聚硫醇化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L63/00</main-classification>
        <further-classification edition="200601120260504B">C08L81/02</further-classification>
        <further-classification edition="202601120260504B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桃原佳克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOUBARU, YOSHIKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田真幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山木繁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKI, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種熱固化性組成物及其固化物。該熱固化性組成物含有具有二硫鍵，並且具有羥基之聚硫醇化合物、具有聚醚基，並且具有2個以上的環狀醚基之環狀醚化合物、固化促進劑及光自由基發生劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="825" publication-number="202631302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性工作臺及加工設備</chinese-title>
        <english-title>MAGNETIC WORKING PLATFORM AND PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">B23Q3/154</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚華學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, HUAXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍光生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, GUANGSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種磁性工作臺及加工設備，該磁性工作臺包括：支撐座，具有支撐面；磁吸台，設於支撐面，磁吸台包括與支撐面相間隔的第一磁性部；第二磁性組件，活動設於支撐面，並位於第一磁性部下方；以及磁力開關件，活動設於磁吸台，並與第二磁性組件傳動連接；磁力開關件可帶動第二磁性組件往復移動，以在其與第一磁性部相對應時，使磁吸台產生磁吸力；或者，在其與第一磁性部相錯位時，使磁吸台斷開磁吸力。本申請技術手段有效解決了傳統磁性工作臺在其厚度方向上的占用空間大，無法適配該方向行程較小的機床，適用範圍小的技術問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic working platform and a processing equipment are disclosed. The magnetic working platform includes a support base provided with a support surface, a magnetic platform disposed on the support surface and the magnetic platform includes a first magnetic portion spaced apart from the support surface, a second magnetic component movably disposed on the support surface and located under the first magnetic portion, and a magnetic switch movably disposed on the magnetic platform and in transmission connection with the second magnetic component. The second magnetic component is driven by the magnetic switch to move back and forth. When the second magnetic component is corresponded to the first magnetic portion, the magnetic platform generates a magnetic attraction force. Alternatively, when the second magnetic component is misaligned with the first magnetic portion, the magnetic platform loses the magnetic attraction force. The technical solution of the disclosure effectively solves the problems that the traditional magnetic working platform occupies a large space in the thickness direction, cannot be adapted to a machine tool with a small distance in the thickness direction, and has a small range of application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:支撐座</p>
        <p type="p">110:座體</p>
        <p type="p">111:連接缺口</p>
        <p type="p">200:磁吸台</p>
        <p type="p">201:插接孔</p>
        <p type="p">210:第一磁性部</p>
        <p type="p">211:鐵件</p>
        <p type="p">212:銅磁件</p>
        <p type="p">220:連接部</p>
        <p type="p">230:安裝部</p>
        <p type="p">240:隔磁件</p>
        <p type="p">400:磁力開關件</p>
        <p type="p">Y:長度方向</p>
        <p type="p">X:寬度方向</p>
        <p type="p">Z:厚度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="826" publication-number="202631365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成型模具和射出成型方法</chinese-title>
        <english-title>FORMING MOLD AND INJECTION MOLDING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B29C45/26</main-classification>
        <further-classification edition="200601120260422B">B29C45/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫響</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供一種成型模具和射出成型方法，將第一入子和第二入子分設於第一模體部和第二模體部，並將第一定位頭和第二定位柱分別從第一成型區和第二成型區伸出。利用第二定位柱套設嵌件，對嵌件進行預定位，簡化嵌件的預定位操作。在第一成型區和第二成型區對合過程中，第一定位柱下壓第二定位柱，使第二定位柱逐步替換第一定位柱以對嵌件進行定位，保證嵌件定位部與嵌件之間的接觸面積前後幾乎保持不變，提高嵌件在水平方向上的位置精度。當第一定位面與第二成型區夾持住嵌件時，保證嵌件高度方向上精度。同時避免射出材料流動至型腔外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A forming mold and an injection molding method are disclosed. A first core insert and a second core insert are respectively disposed on a first mold body portion and a second mold body portion. A first positioning head and a second positioning post are respectively extended from a first molding area and a second molding area. An insert is sleeved by the second positioning post to pre-position the insert. The operation of pre-positioning the insert is simplified. During an alignment process of the first molding area and the second molding area, a first positioning post presses down the second positioning post, so the second positioning post gradually replaces the first positioning post to position the insert, ensuring that a contact area between an insert positioning portion and the insert is remained almost the same. The positional accuracy of the insert in a horizontal direction is improved. When a first positioning surface and the second molding area clamp the insert, the accuracy of the insert in a height direction is ensured. At the same time, an injection molding material is prevented from flowing to the outside of a mold cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:嵌件定位部</p>
        <p type="p">31:第一入子</p>
        <p type="p">32:第二入子</p>
        <p type="p">33:第二彈性件</p>
        <p type="p">6:限位部</p>
        <p type="p">61:限位體</p>
        <p type="p">62:導向體</p>
        <p type="p">84:澆口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="827" publication-number="202633164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260327B">H10D84/83</main-classification>
        <further-classification edition="202501120260327B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金孝珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴志薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋永秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YOUNG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置可包括：第一主動區，位於基板上；第一通道圖案及第二通道圖案，位於第一主動區上，第一通道圖案及第二通道圖案中的每一者包括多個半導體圖案，多個所述半導體圖案垂直地堆疊以彼此間隔開；第一閘極圖案，與第一通道圖案交叉；第二閘極圖案，與第二通道圖案交叉；以及插入圖案，位於第二通道圖案的多個所述半導體圖案中的最下部半導體圖案與基板之間。第一閘極圖案的內電極的數目可大於第二閘極圖案的內電極的數目，且第二閘極圖案可覆蓋插入圖案的側表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may include a first active region on a substrate, a first channel pattern and a second channel pattern on the first active region, each of the first and second channel patterns including a plurality of semiconductor patterns, which are vertically stacked to be spaced apart from each other, a first gate pattern crossing the first channel pattern, a second gate pattern crossing the second channel pattern, and an insertion pattern between the lowermost one of the semiconductor patterns of the second channel pattern and the substrate. The number of inner electrodes of the first gate pattern may be greater than the number of inner electrodes of the second gate pattern, and the second gate pattern may cover a side surface of the insertion pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">A-A':線</p>
        <p type="p">AP1:第一主動圖案</p>
        <p type="p">AR1:第一主動區</p>
        <p type="p">CA:主動接觸件</p>
        <p type="p">CH:通道圖案</p>
        <p type="p">CH1:第一通道圖案</p>
        <p type="p">CH2:第二通道圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GC:閘極頂蓋圖案</p>
        <p type="p">GE:閘極圖案</p>
        <p type="p">GE1:第一閘極圖案</p>
        <p type="p">GE2:第二閘極圖案</p>
        <p type="p">GI:閘極絕緣圖案</p>
        <p type="p">GT:閘極接觸件</p>
        <p type="p">ILD1:第一層間絕緣層</p>
        <p type="p">ILD2:第二層間絕緣層</p>
        <p type="p">ILD3:第三層間絕緣層</p>
        <p type="p">IN:內電極</p>
        <p type="p">IN1:第一內電極</p>
        <p type="p">IN2:第二內電極</p>
        <p type="p">IN3:第三內電極</p>
        <p type="p">IN4:第四內電極</p>
        <p type="p">IP:插入圖案</p>
        <p type="p">IPa:頂表面</p>
        <p type="p">IPb、T1b、T2b:底表面</p>
        <p type="p">LV1:第一水準</p>
        <p type="p">LV2:第二水準</p>
        <p type="p">MT:金屬圖案</p>
        <p type="p">OGS:閘極間隔件</p>
        <p type="p">OU:外電極</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">RS1:第一凹陷部</p>
        <p type="p">RS2:第二凹陷部</p>
        <p type="p">SD1:第一源極/汲極圖案</p>
        <p type="p">SP1、SP2、SP3、SP4:半導體圖案</p>
        <p type="p">T1:第一圖案</p>
        <p type="p">T2:第二圖案</p>
        <p type="p">UIP:上部絕緣層</p>
        <p type="p">VIA:通孔圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="828" publication-number="202631933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著帶、及黏著帶之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260416B">C09J7/38</main-classification>
        <further-classification edition="200601120260416B">C09J107/00</further-classification>
        <further-classification edition="200601120260416B">C09J109/06</further-classification>
        <further-classification edition="200601120260416B">C09J133/08</further-classification>
        <further-classification edition="200601120260416B">C09J11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田泰則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓮見水貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASUMI, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種長期內不易產生剝落及黏膩且於低溫環境下黏著力較高之黏著帶。  &lt;br/&gt;本發明之一態樣係一種黏著帶，其具備包含聚氯乙烯樹脂之基材層、及設置於上述基材層之至少一面之橡膠系黏著劑層。上述橡膠系黏著劑層含有橡膠成分25～45質量%、(甲基)丙烯酸聚合物5～25質量%、黏著賦予劑40～60質量%。上述橡膠成分係選自由天然橡膠、改性天然橡膠、苯乙烯-丁二烯橡膠所組成之群中之至少1種以上。進而，上述(甲基)丙烯酸聚合物之玻璃轉移溫度為45℃以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="829" publication-number="202633377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P72/76</main-classification>
        <further-classification edition="200601120260424B">B25J9/16</further-classification>
        <further-classification edition="200601120260424B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上柿雅裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIGAKI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋宗大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, MOTOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的目的為提供一種半導體處理裝置，可以同時達到樣品交換的高速化以及晶圓搬運機器人的低振動化。本揭示之半導體處理裝置，係執行：將樣品從平台上卸載的第一操作；將樣品裝載到平台的第二操作；第一操作中至少有一部分與第二操作中至少有一部分係彼此並行執行，第一操作結束前，結束第二操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樣品室</p>
        <p type="p">3:機器人腔室</p>
        <p type="p">11:樣品平台</p>
        <p type="p">31:真空搬運機器人</p>
        <p type="p">W1:晶圓</p>
        <p type="p">W2:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="830" publication-number="202631405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可分離式支撐裝置</chinese-title>
        <english-title>DETACHABLE SUPPORTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">B43K29/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>極山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVIUM TAIWAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁國鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, KUO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可分離式支撐裝置，其包含有一底座、一磁力提供模組以及一目標元件。該底座包含一本體部、一第一延伸部以及一第二延伸部。該磁力提供模組包含三個磁力元件。該第一磁力元件設置在該第一延伸部，其二磁極係分別朝向該本體部之一上表面與一下表面。該第二磁力元件設置在該第二延伸部，其二磁極係分別朝向該本體部之兩側表面。該第三磁力元件設置在該本體部。該目標元件包含一主體、一可磁化單元與一磁力單元。該可磁化單元設置在該主體以觸及該本體部之一定位區。該磁力單元設置在該主體以作用於該第一磁力元件與該第二磁力元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detachable supporting device includes a base, a magnetic force providing module and a target object. The base includes a body portion, a first extending portion and a second extending portion. The magnetic force providing module includes three magnetic components. The first magnetic component is disposed on the first extending portion and has two poles respectively facing an upper surface and a lower surface of the body portion. The second magnetic component is disposed on the second extending portion and has two poles respectively facing two lateral surfaces of the body portion. The third magnetic component is disposed on the body portion. The target object includes a main body, a magnetizable element and a magnetic element. The magnetizable element is disposed on the main body to contact a positioning area of the body portion. The magnetic element is disposed on the main body to function with the two magnetic components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:可分離式支撐裝置</p>
        <p type="p">12:底座</p>
        <p type="p">14:磁力提供模組</p>
        <p type="p">16:目標元件</p>
        <p type="p">18:本體部</p>
        <p type="p">20:第一延伸部</p>
        <p type="p">22:第二延伸部</p>
        <p type="p">24:第一磁力元件</p>
        <p type="p">26:第二磁力元件</p>
        <p type="p">28:第三磁力元件</p>
        <p type="p">30:上表面</p>
        <p type="p">32:下表面</p>
        <p type="p">34:側表面</p>
        <p type="p">36:主體</p>
        <p type="p">38:可磁化單元</p>
        <p type="p">40:磁力單元</p>
        <p type="p">42:定位區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="831" publication-number="202631389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有助黏劑層的層板與製造該層板的方法</chinese-title>
        <english-title>LAMINATE CONTAINING AN ADHESION PROMOTER LAYER AND METHOD OF MAKING THE LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/06</main-classification>
        <further-classification edition="200601120260504B">B32B27/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/16</further-classification>
        <further-classification edition="200601120260504B">B32B27/30</further-classification>
        <further-classification edition="200601120260504B">C09J143/04</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="200601120260504B">C07F7/18</further-classification>
        <further-classification edition="201401120260504B">C09D11/101</further-classification>
        <further-classification edition="201401120260504B">C09D11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉衛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克洛恩　艾米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOHN, AMY R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;一種層板可包含基板、助黏劑層與覆蓋層，其中助黏劑層可包括式(1)之矽烷化合物：X&lt;sub&gt;m&lt;/sub&gt;-Si-Y&lt;sub&gt;n&lt;/sub&gt; (1)，其中X為OR、NR&lt;sub&gt;2&lt;/sub&gt;或SR之至少一者或其組合，並且R為經取代之或未經取代之烷基或芳基；Y為CH=CH&lt;sub&gt;2&lt;/sub&gt;或L-CH=CH&lt;sub&gt;2&lt;/sub&gt;，並且L為苯基或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;5&lt;/sub&gt;烷基；m為1至3，n為1至3，並且m+n=4。助黏劑層可藉由與基板形成共價鍵以及與覆蓋層形成共價鍵提供覆蓋層對基板的強黏著性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laminate can comprise a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include a silane compound of formula (1): X&lt;sub&gt;m&lt;/sub&gt;-Si-Y&lt;sub&gt;n&lt;/sub&gt; (1), wherein X is at least one of OR, NR&lt;sub&gt;2&lt;/sub&gt;, or SR, or a combination thereof, with R being substituted or unsubstituted alkyl or aryl; Y is CH=CH&lt;sub&gt;2&lt;/sub&gt; or L-CH=CH&lt;sub&gt;2&lt;/sub&gt;, with L being phenyl or C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;5&lt;/sub&gt; alkyl; m is 1-3, n is 1-3, with m+n=4. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:層板</p>
        <p type="p">12:基板</p>
        <p type="p">13:助黏劑層</p>
        <p type="p">14:覆蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="832" publication-number="202633084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260327B">H10B43/20</main-classification>
        <further-classification edition="200601120260327B">G11C7/18</further-classification>
        <further-classification edition="200601120260327B">G11C8/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANG-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金允宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOONJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍我</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昇煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　珍優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪成彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SEONGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置，所述半導體裝置包括：位元線，沿第一方向延伸；半導體圖案，在第一方向上彼此間隔開且包括第一材料、以及在第二方向上包括第一端及第二端且連接至位元線的第一半導體圖案；字元線，沿第三方向延伸且定位於半導體圖案在第一方向上的第一側上；資料儲存圖案，包括：第一電極，連接至半導體圖案的第二端；第二電極，與第一電極間隔開；介電層，位於第一電極與第二電極之間；以及蝕刻終止層，位於字元線與第一電極之間且與半導體圖案接觸，並且包括不同於半導體圖案的材料的第二材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is semiconductor device including a bit line extending in a first direction, semiconductor patterns including a first material spaced apart from each other in the first direction, and a first semiconductor pattern including a first end and a second end in a second direction, , connected to the bit line, a word line extending in a third direction and positioned on a first side of the semiconductor pattern in the first direction, a data storage pattern including a first electrode connected to the second end of the semiconductor pattern, a second electrode spaced apart from the first electrode, a dielectric layer between the first and second electrodes, and an etch stop layer between the word line and the first electrode and in contact with the semiconductor pattern, and including a second material different from that of the semiconductor pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">130:蝕刻終止層</p>
        <p type="p">140:間隔件</p>
        <p type="p">145:頂蓋圖案</p>
        <p type="p">146:第一頂蓋部分</p>
        <p type="p">147:第二頂蓋部分</p>
        <p type="p">150:字元線分隔層</p>
        <p type="p">200:半導體圖案</p>
        <p type="p">310:第一電極</p>
        <p type="p">320:介電層</p>
        <p type="p">330:第二電極</p>
        <p type="p">331:內部分</p>
        <p type="p">333:連接部分</p>
        <p type="p">A-A'、B-B':線</p>
        <p type="p">BL:位元線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DS:資料儲存圖案</p>
        <p type="p">Gox:閘極絕緣層</p>
        <p type="p">Gox1:第一閘極絕緣層</p>
        <p type="p">Gox2:第二閘極絕緣層</p>
        <p type="p">WL:字元線</p>
        <p type="p">WL1:第一字元線</p>
        <p type="p">WL2:第二字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="833" publication-number="202632334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、半導體裝置的製造方法以及光學耦合方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF FABRICATING SEMICONDUCTOR DEVICE, AND METHOD OF OPTICAL COUPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B6/12</main-classification>
        <further-classification edition="200601120260102B">G02B6/124</further-classification>
        <further-classification edition="200601120260102B">G02B6/32</further-classification>
        <further-classification edition="200601120260102B">G02B6/34</further-classification>
        <further-classification edition="200601120260102B">G02B6/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豐維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, FENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置的製造方法。所述方法包括提供裝置，所述裝置包括具有光柵耦合器的光子晶粒。所述方法包括圖案化所述裝置的上表面以形成透鏡特徵，所述透鏡特徵配置為從光子晶粒的上表面接收光。所述方法包括形成第一反射鏡，所述第一反射鏡配置為根據光和光柵耦合器之間小於約15度的入射角度將透鏡特徵與光柵耦合器光學耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of semiconductor device fabrication is provided. The method includes providing a device including a photonic die having a grating coupler. The method includes patterning an upper surface of the device to form a lensing feature configured to receive light from an upper surface of the photonic die. The method includes forming a first mirror configured to optically couple the lensing feature with the grating coupler according to an angle of incidence between the light and the grating coupler of less than about 15 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502,504,506:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="834" publication-number="202633107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260328B">H10D30/01</main-classification>
        <further-classification edition="202501120260328B">H10D64/20</further-classification>
        <further-classification edition="202501120260328B">H10D64/68</further-classification>
        <further-classification edition="202501120260328B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭寬豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威養</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, BO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種具有與凸起內間隔物接觸的順應性源極/汲極結構的半導體裝置。所述半導體裝置包括位於基板上的通道結構、包繞通道結構的閘極結構、位於基板上且接觸通道結構的源極/汲極結構、以及位於閘極結構與源極/汲極結構之間的內間隔物。內間隔物具有凸面延伸至源極/汲極結構中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a semiconductor device having conformal source/drain structures in contact with convex inner spacers. The semiconductor device includes a channel structure on a substrate, a gate structure wrapped around the channel structure, a source/drain structure on the substrate and in contact with the channel structure, and an inner spacer between the gate structure and the S/D structure. A portion of the inner spacer extends into the source/drain structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">104:基板</p>
        <p type="p">108:鰭片結構</p>
        <p type="p">110:源極/汲極(S/D)結構</p>
        <p type="p">110-1:磊晶層</p>
        <p type="p">110-2:磊晶層</p>
        <p type="p">112:閘極電極</p>
        <p type="p">114:閘極間隔物</p>
        <p type="p">116:蝕刻停止層(ESL)</p>
        <p type="p">117:底部隔離層</p>
        <p type="p">117t:厚度</p>
        <p type="p">118:層間介電(ILD)層</p>
        <p type="p">120:閘極結構</p>
        <p type="p">120d1:長度</p>
        <p type="p">120d2:長度</p>
        <p type="p">121:內間隔物</p>
        <p type="p">121t:厚度</p>
        <p type="p">122:奈米結構</p>
        <p type="p">122-1:奈米結構</p>
        <p type="p">122-2:奈米結構</p>
        <p type="p">122-3:奈米結構</p>
        <p type="p">122t:厚度</p>
        <p type="p">124:閘極介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="835" publication-number="202633194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260330B">H10F30/225</main-classification>
        <further-classification edition="202501120260330B">H10F77/10</further-classification>
        <further-classification edition="202501120260330B">H10D62/10</further-classification>
        <further-classification edition="202501120260330B">H10D62/60</further-classification>
        <further-classification edition="202501120260330B">H10D62/80</further-classification>
        <further-classification edition="202601120260330B">H10P50/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王子睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZU-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銘杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾積賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHI-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種半導體裝置及其製造方法。本揭露的各個實施例針對裝置。裝置包含基板，基板包含第一材料。吸收結構位於基板的表面上，並且包含具有比第一材料小的能隙的第二材料。吸收結構具有第一摻雜類型的第一摻雜濃度。吸收結構的第一摻雜濃度大於基板的鄰接吸收結構的區域的摻雜濃度。第一阱區域位於基板中並且從吸收結構偏移。第一阱區域具有與第一摻雜類型不同的第二摻雜類型。第二阱區域位於基板中，並且佈置在第一阱區域和吸收結構之間。第二阱區域具有第一摻雜類型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present disclosure are directed towards a device. The device includes a substrate comprising a first material. An absorption structure is on a surface of the substrate and comprises a second material having a smaller bandgap than the first material. The absorption structure has a first doping concentration of a first doping type. The first doping concentration of the absorption structure is greater than a doping concentration of a region of the substrate abutting the absorption structure. A first well region is in the substrate and offset from the absorption structure. The first well region has a second doping type different from the first doping type. A second well region is in the substrate and arranged between the first well region and the absorption structure. The second well region has the first doping type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:截面圖</p>
        <p type="p">102:基板</p>
        <p type="p">102a:第一表面</p>
        <p type="p">102s1、102s2:內側壁</p>
        <p type="p">102us:上表面</p>
        <p type="p">104:光電感測器</p>
        <p type="p">106:凹槽</p>
        <p type="p">108:吸收結構</p>
        <p type="p">110:區域</p>
        <p type="p">112:第一崩潰阱</p>
        <p type="p">114:崩潰區域</p>
        <p type="p">116:第二崩潰阱</p>
        <p type="p">118:PN接面</p>
        <p type="p">122:介面區域</p>
        <p type="p">124:橫向連接區域</p>
        <p type="p">126:垂直連接區域</p>
        <p type="p">128:第一接觸區域</p>
        <p type="p">130:隔離結構</p>
        <p type="p">136、138:線</p>
        <p type="p">d1:第一深度</p>
        <p type="p">t1:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="836" publication-number="202633200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10F39/12</main-classification>
        <further-classification edition="202501120260422B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅谷文孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAYA, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術之目的在於，對於在沿平面方向排列之複數個第1導電型之半導體區域之間形成第2導電型之半導體區域之基板，可不增大電路面積而使電路動作穩定化。  &lt;br/&gt;其解決方法為，於光檢測元件之基板形成沿平面方向排列之複數個N井、形成於N井之間之P井、及將N井與P井分離之FTI。於P井形成將N井彼此電性連接之導通部。本技術例如可應用於將具有SPAD作為受光元件之像素感測器部以列方向及行方向之矩陣狀2維配置之基板、具有讀出電路之基板、以及具有信號處理電路之基板積層而成之光檢測元件等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">52:基板</p>
        <p type="p">71-1:N井</p>
        <p type="p">71-2:N井</p>
        <p type="p">72:P井</p>
        <p type="p">73:FTI</p>
        <p type="p">74:導通部</p>
        <p type="p">75:FTI</p>
        <p type="p">80:P型MOSFET</p>
        <p type="p">81:P型半導體區域</p>
        <p type="p">82:閘極電極</p>
        <p type="p">83:STI</p>
        <p type="p">90:N型MOSFET</p>
        <p type="p">91:N型半導體區域</p>
        <p type="p">92:閘極電極</p>
        <p type="p">93:STI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="837" publication-number="202631230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水中面罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">A63B33/00</main-classification>
        <further-classification edition="200601120260416B">B63C11/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田畑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABATA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡素希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, MOTOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種水中面罩，係具備與面罩本體為不同個體之操作性優異之帶扣。  &lt;br/&gt;　　[解決手段]水中面罩(10)，係具備用以調整頭帶(20)之長度之帶扣(30)。帶扣(30)，係與面罩本體(13)為不同個體，位於在前後方向(Z)上分離處，並具有：卡合爪(74)，係卡合在位於頭帶(20)之外表面(20b)之卡合凹部(25)；以及一對操作部(34)，係於上下方向(Y)對向。穿戴者，藉由使帶扣(30)往後方移動，使卡合爪(74)卡合於頭帶(20)之卡合凹部(25)，而限制頭帶(20)之長度調整，另一方面，藉由按壓操作操作部(34)，使限制受到解除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水中面罩</p>
        <p type="p">11:鏡片</p>
        <p type="p">12:鏡框</p>
        <p type="p">13:面罩本體</p>
        <p type="p">15:裙部</p>
        <p type="p">18:掛繞部</p>
        <p type="p">20:頭帶</p>
        <p type="p">20a:內面</p>
        <p type="p">21:中央部</p>
        <p type="p">22:第1延伸部</p>
        <p type="p">22A:前端部分</p>
        <p type="p">22B:基端部分</p>
        <p type="p">23:第2延伸部</p>
        <p type="p">23A:前端部分</p>
        <p type="p">23B:基端部分</p>
        <p type="p">25:卡合凹部</p>
        <p type="p">30:帶扣</p>
        <p type="p">34:操作部</p>
        <p type="p">X:橫方向</p>
        <p type="p">Y:上下方向</p>
        <p type="p">Z:前後方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="838" publication-number="202631319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131373</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔具有撓曲件的拋光頭</chinese-title>
        <english-title>CLEANING A POLISHING HEAD WITH A FLEXURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B24B55/06</main-classification>
        <further-classification edition="200601120260422B">B24B57/02</further-classification>
        <further-classification edition="201201120260422B">B24B37/30</further-classification>
        <further-classification edition="201201120260422B">B24B37/34</further-classification>
        <further-classification edition="202601120260422B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　永豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, ERIC L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費納多　威拉魯瑪吉拉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERNANDO, WELARUMAGE RAVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米克海琳全柯　伊卡特瑞納Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKHAYLICHENKO, EKATERINA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納根葛斯特　安德魯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGENGAST, ANDREW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JEONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳堃驤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於化學機械拋光系統的清潔方法和系統，包括將該化學機械拋光系統的承載頭移動至化學機械拋光系統的處理站上方；對該承載頭的第一可加壓腔室加壓，該第一可加壓腔室佈置於膜組件與該承載頭的下部承載主體之間，使得佈置於該下部承載主體下方的膜組件從靜止位置位移；並從該處理站的孔口將氣體引導至該承載頭的部件上，以清潔該部件上的拋光副產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for cleaning for a chemical mechanical polishing system, including moving a carrier head of the chemical mechanical polishing system over a treatment station of the chemical mechanical polishing system; pressurizing a first pressurizable chamber of the carrier head, the first pressurizable chamber arranged between a membrane assembly and a lower carrier body of the carrier head, such that a membrane assembly arranged beneath the lower carrier body is displaced from a home position; and directing a gas from an orifice of the treatment station onto a component of the carrier head to clean polishing by-product off the component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">84:保持環</p>
        <p type="p">84a:外表面</p>
        <p type="p">84b:底表面</p>
        <p type="p">84c:內表面</p>
        <p type="p">102:外殼</p>
        <p type="p">104:上部承載主體</p>
        <p type="p">106:下部承載主體</p>
        <p type="p">107:底表面</p>
        <p type="p">108:萬向機構</p>
        <p type="p">111:裝載腔室</p>
        <p type="p">134:上部腔室</p>
        <p type="p">134a:下部部分</p>
        <p type="p">134b:上部部分</p>
        <p type="p">138:膜支撐件</p>
        <p type="p">138a:下部部分</p>
        <p type="p">138b:上部部分</p>
        <p type="p">139:頂表面</p>
        <p type="p">140:承載頭</p>
        <p type="p">141:內表面</p>
        <p type="p">144:膜</p>
        <p type="p">146:下部腔室</p>
        <p type="p">146a:下部腔室</p>
        <p type="p">146b:下部腔室</p>
        <p type="p">146c:下部腔室</p>
        <p type="p">152:驅動軸</p>
        <p type="p">160:撓曲件</p>
        <p type="p">161:底表面</p>
        <p type="p">162:下部撓性密封件</p>
        <p type="p">164:上部撓性密封件</p>
        <p type="p">170:下部部分</p>
        <p type="p">172:襟翼</p>
        <p type="p">174:外表面</p>
        <p type="p">176:內表面</p>
        <p type="p">178:側表面</p>
        <p type="p">186:通道</p>
        <p type="p">189:突起</p>
        <p type="p">190:控制器</p>
        <p type="p">200:蒸汽處理組件</p>
        <p type="p">206:外殼</p>
        <p type="p">206a:地面</p>
        <p type="p">206b:側壁</p>
        <p type="p">208:腔體</p>
        <p type="p">210:軸</p>
        <p type="p">214:感測器</p>
        <p type="p">225:噴嘴</p>
        <p type="p">230:供應線</p>
        <p type="p">235:排水口</p>
        <p type="p">240:致動器</p>
        <p type="p">245:蒸氣</p>
        <p type="p">400:組件</p>
        <p type="p">410:蒸汽發生器</p>
        <p type="p">922:壓力源</p>
        <p type="p">924:壓力源</p>
        <p type="p">926:壓力源</p>
        <p type="p">930:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="839" publication-number="202631944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性接著劑組成物及積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C09J163/00</main-classification>
        <further-classification edition="200601120260416B">C09J179/08</further-classification>
        <further-classification edition="200601120260416B">C09J11/06</further-classification>
        <further-classification edition="200601120260416B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤恭史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDOU, YASUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可在製造耐熱用途之複合構件時縮短製程時間之硬化性接著劑組成物及積層體。本發明之硬化性接著劑組成物包含熱硬化性成分與熱塑性成分，該硬化性接著劑組成物於熱處理前在25~300℃間以DSC測得之放熱量為10mJ/mg以上，於150℃/5min熱處理前後之放熱量比(熱處理後放熱量/熱處理前放熱量)小於1.0，於150℃/5min熱處理後在150℃下以DMA測得之儲存彈性模數為1×10&lt;sup&gt;5&lt;/sup&gt;Pa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="840" publication-number="202633402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、資訊處理裝置及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P95/00</main-classification>
        <further-classification edition="200601120260422B">G05B17/02</further-classification>
        <further-classification edition="200601120260422B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月宏朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上遠野弘希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATONO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野和宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KAZUMUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠更新基板處理裝置所使用之控制模型之資訊處理方法、資訊處理裝置及基板處理系統。  &lt;br/&gt;於本發明之資訊處理方法中，係獲取用於控制基板處理裝置以使其按照製程配方執行基板處理之控制模型，將所獲取之上述控制模型記憶於記憶裝置，將上述控制模型部署至基板處理裝置，將與已部署至基板處理裝置之上述控制模型相關之資訊記憶於上述記憶裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置</p>
        <p type="p">2:基板處理裝置</p>
        <p type="p">3:分發裝置</p>
        <p type="p">21:控制部</p>
        <p type="p">22:處理室</p>
        <p type="p">30:記錄媒體</p>
        <p type="p">100:基板處理系統</p>
        <p type="p">N1,N2:通信網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="841" publication-number="202631629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎化合物、其製造方法及用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D495/04</main-classification>
        <further-classification edition="202501120260504B">H10D30/67</further-classification>
        <further-classification edition="202301120260504B">H10K59/125</further-classification>
        <further-classification edition="202301120260504B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三谷真人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITANI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祢津茂義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETSU, SHIGEYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾形雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種新穎化合物及其製造方法，前述新穎化合物為熱／化學穩定性優異且具有高的載子移動率並對於溶劑具有高溶解性之化合物，特別適合作為有機半導體。一種下述通式（1）所表示之化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="174px" width="550px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（通式（1）中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;係各自獨立地表示氫原子、鹵素原子、全氟烷基磺醯基氧基、烷基、烯基、炔基、芳基或雜芳基，可更具有取代基，亦可具有下述的二價連結基群A，二價連結基群A表示－O－、－S－、－NR&lt;sup&gt;4&lt;/sup&gt;－、－CO－、－SO－及－SO&lt;sub&gt;2&lt;/sub&gt;－中任一個二價連結基或兩個以上的此等二價連結基鍵結而成之二價連結基，R&lt;sup&gt;4&lt;/sup&gt;表示氫原子、烷基、烯基、炔基、芳基或雜芳基）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="842" publication-number="202632831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力系統及其操作方法</chinese-title>
        <english-title>ELECTRIC POWER SYSTEM AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/38</main-classification>
        <further-classification edition="202601120260302B">H02J3/00</further-classification>
        <further-classification edition="202601120260302B">H02J13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯佾寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, YI-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭力銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, LI-QUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林珈敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電力系統，包含:市電網路，連接至第一開關；以及 微電網，經由第一開關連接至市電網路，微電網包含:變流器設備，連接至匯流排；控制器，連接至第一開關以及變流器設備，並用以傳輸第一信號；以及負載，經匯流排連接至變流器裝置，其中，市電網路經由第一開關連接至匯流排，並用以對負載供電，控制器進一步用以偵測連接市電網路及微電網的第一線路，並判斷第一線路是否異常，以及當控制器判斷第一線路異常時，該控制器將第一開關切離，並透過第一信號將變流器設備的第一部份切換為電壓源形式運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric power system, comprising: an electricity network connected to a first switch; and a micro grid connected to the electricity network through the first switch, the micro grid comprising multiple inverter equipment connected to a bus; a controller connected to each of the first switch and the inverter equipment, and configured to transmit multiple first signals; and multiple loads connected to the inverter equipment through the bus, wherein the electricity network is connected to the bus through the first switch, and is configured to provide power to the loads, the controller is further configured to detect a first line connecting the electricity network and the micro grid, and determine whether the first line is abnormal, and when the controller determines the first line is abnormal, the controller cut off the first switch, and switch a first part of the inverter equipment to operate in a voltage source configuration through the first signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:操作方法</p>
        <p type="p">301~312:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="843" publication-number="202631393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>覆蓋帶及包含其之電子零件包裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">B32B27/18</main-classification>
        <further-classification edition="201901120260416B">B32B7/02</further-classification>
        <further-classification edition="200601120260416B">C09K3/16</further-classification>
        <further-classification edition="200601120260416B">B65D85/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名波圭祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NABA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係提供一種抑制抗靜電層脫落之覆蓋帶。&lt;br/&gt;  覆蓋帶具有基材層、熱封層、以及位於該基材層之與該熱封層相反側之面上之抗靜電層，該抗靜電層含有酸改性烯烴樹脂和抗靜電劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="844" publication-number="202632246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光學缺陷檢測之橢圓偏振成像</chinese-title>
        <english-title>ELLIPSOMETRIC IMAGING FOR OPTICAL DEFECT INSPECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N21/21</main-classification>
        <further-classification edition="200601120260504B">G01N21/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維克　酷吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIRK, KULJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽斯金納　阿布都拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEZGINER, ABDURRAHMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施韋恩　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWEYEN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文呈現用於產生指示經設定大小低於光學解析度極限之結構缺陷之明場橢圓偏振影像之方法及系統。在一些實例中，與零條件下之暗場成像相比，明場橢圓偏振成像提供小缺陷信號對有害圖案雜訊信號之一更高訊雜比。採用各種橢圓偏振成像技術以產生一檢測中晶圓或倍縮光罩之影像。該影像提供指示由該橢圓偏振成像系統之成像場中之不同結構之散射回應誘發之相位差之強度對比。在一個態樣中，一橢圓偏振成像系統在照明路徑中採用一偏振器且在成像路徑中採用一分析器及至少一個波板。該橢圓偏振成像系統產生具有自具有相對高訊雜比之有害圖案雜訊差分所關注缺陷之強度差之影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for generating bright-field ellipsometric images indicative of structural defects sized below the optical resolution limit are presented herein. In some examples, bright-field ellipsometric images offer a higher signal to noise ratio of small defect signals to nuisance pattern noise signals compared to dark-field imaging at the null condition. Various ellipsometric imaging techniques are employed to generate images of a wafer or reticle under inspection. The images provide intensity contrast that is indicative of phase differences induced by the scattering response of different structures in the imaging field of the ellipsometric imaging system. In one aspect, an ellipsometric imaging system employs a polarizer in the illumination path and an analyzer and at least one waveplate in the imaging path. The ellipsometric imaging system generates images having intensity differences that differentiate defects of interest from nuisance pattern noise with relatively high signal to noise ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:橢圓偏振成像系統</p>
        <p type="p">101:樣品</p>
        <p type="p">102:樣品定位系統</p>
        <p type="p">103:卡盤</p>
        <p type="p">104:運動控制器</p>
        <p type="p">105:X平移台</p>
        <p type="p">110:照明源</p>
        <p type="p">111:光束成形光學器件</p>
        <p type="p">112:光瞳光闌</p>
        <p type="p">113:偏振組件</p>
        <p type="p">114:視場光闌</p>
        <p type="p">115:透鏡</p>
        <p type="p">116:分束元件</p>
        <p type="p">120:波板</p>
        <p type="p">121:分析器</p>
        <p type="p">123:聚焦光學器件</p>
        <p type="p">124:照明光</p>
        <p type="p">125:照明光束</p>
        <p type="p">126:檢測位置</p>
        <p type="p">127:收集光束</p>
        <p type="p">129:物鏡</p>
        <p type="p">130:計算系統</p>
        <p type="p">131:處理器</p>
        <p type="p">132:記憶體</p>
        <p type="p">133:匯流排</p>
        <p type="p">134:程式指令</p>
        <p type="p">135:記憶體</p>
        <p type="p">140:成像偵測器</p>
        <p type="p">141:信號</p>
        <p type="p">142:控制信號</p>
        <p type="p">143:缺陷位置</p>
        <p type="p">144:命令信號</p>
        <p type="p">145:命令信號</p>
        <p type="p">146:命令信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="845" publication-number="202633384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查測量系統及試料檢查測量方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01R31/305</further-classification>
        <further-classification edition="202001120260302B">G06F30/367</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白崎保宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRASAKI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷內一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YACHI, KAZUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡雅健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YAJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內保美南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIHO, MINAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">取得第1暫態響應波形，是當規定照射條件下之脈衝一次射束，照射於試料上的參考取得位置時，檢測系統所輸出的檢測訊號波形、以及第2暫態響應波形，是當規定照射條件下之脈衝一次射束，照射於試料上的測定點時，檢測系統所輸出的檢測訊號波形；基於第1暫態響應波形來修正第2暫態響應波形，而產生第3暫態響應波形；使用模型，從第3暫態響應波形求出測定點上的試料電位波形；第2暫態響應波形，是對試料電位展現靈敏度之帶電粒子檢測器，或者將檢測條件設定為對試料電位展現靈敏度之帶電粒子檢測器，所輸出的檢測訊號波形；第1暫態響應波形，是對試料電位不具靈敏度之帶電粒子檢測器，或者將檢測條件設定為對試料電位不具靈敏度之帶電粒子檢測器，所輸出的檢測訊號波形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="846" publication-number="202633484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合電路疊層</chinese-title>
        <english-title>COMPOSITE CIRCUIT LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓心半導體異質整合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱景裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古淑芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, SHU-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余思燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SZU-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, HO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種複合電路疊層，其包括第一重布線層、第二重布線層以及核心複合層。第二重布線層與第一重布線層相對地設置。核心複合層位於第一重布線層與第二重布線層之間。核心複合層至少包括第一核心子層、第二核心子層以及第三核心子層。第一核心子層、第二核心子層與第三核心子層的物理特性不相等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite circuit laminate including a first redistribution layer, a second redistribution layer, and a core composite layer is provided. The second redistribution layer is opposite to the first redistribution layer. The core composite layer is located between the first redistribution layer and the second redistribution layer. The core composite layer includes a first core sublayer, a second core sublayer, and a third core sublayer at least. The first core sublayer, the second core sublayer, and the third core sublayer have unequal physical properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:複合電路疊層</p>
        <p type="p">10:載板</p>
        <p type="p">20、22、24、30:重布線層</p>
        <p type="p">100a1:核心複合層</p>
        <p type="p">110、120、130:核心子層</p>
        <p type="p">AW:抗翹曲層</p>
        <p type="p">C1、C2、C3:導電柱</p>
        <p type="p">IL、IL1、IL2、IL3:絕緣層</p>
        <p type="p">M、M1、M2、M3:導電層</p>
        <p type="p">RL:離型層</p>
        <p type="p">Z:方向</p>
        <p type="p">θ1、θ2、θ3:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="847" publication-number="202631854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環氧樹脂組成物、樹脂片、及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08K3/22</main-classification>
        <further-classification edition="201801120260417B">C08K3/105</further-classification>
        <further-classification edition="200601120260417B">C08L63/04</further-classification>
        <further-classification edition="200601120260417B">C08G59/42</further-classification>
        <further-classification edition="200601120260417B">C09K19/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三島祐司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIMA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>定永周治郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADANAGA, SHUUJIROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>脇岡紗香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKIOKA, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大當悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOATARI, YUUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種環氧樹脂組成物，其含有：具有液晶原（mesogen）骨架之環氧樹脂、於25℃呈液狀之液狀硬化劑、及導熱性填料，且上述液狀硬化劑之含量相對於上述環氧樹脂100質量份為5質量份以上30質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="848" publication-number="202631948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固體潤滑劑組成物、潤滑性被膜、構件及固體潤滑劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260408B">C09K3/00</main-classification>
        <further-classification edition="200601120260408B">C10M169/04</further-classification>
        <further-classification edition="200601120260408B">C10M107/50</further-classification>
        <further-classification edition="200601120260408B">C10M115/08</further-classification>
        <further-classification edition="200601120260408B">C10M103/06</further-classification>
        <further-classification edition="200601120260408B">C08K5/098</further-classification>
        <further-classification edition="200601120260408B">C08K3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>也
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIWA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題：提供一種具有優異潤滑性之新穎固體潤滑劑組成物。  &lt;br/&gt;　　解決方式：一種固體潤滑劑組成物，其包含磷酸鈦與分散介質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="849" publication-number="202633165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10W20/20</further-classification>
        <further-classification edition="202601120260424B">H10W10/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文裕智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金菊喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GUKHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛正熊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JEONGWOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, RA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINSEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河承錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SEUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JUNSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括：電晶體、在第一方向上與電晶體間隔開的第一元件、在垂直於第一方向的第二方向上在電晶體和第一元件下方的背側絕緣結構、在第一元件和背側絕緣結構之間的鈍化結構、以及在背側絕緣結構中並連接到鈍化結構的背側導電圖案，其中第一元件包括具有第一導電類型的第一半導體區和具有第二導電類型並與第一半導體區形成PN接面的第二半導體區，鈍化結構包括接觸第一元件的下表面的第一絕緣鈍化層和在第一絕緣鈍化層下方的導電鈍化層，且背側導電圖案連接到導電鈍化層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a transistor, a first element spaced apart from the transistor in a first direction, a backside insulating structure below the transistor and the first element in a second direction that is perpendicular to the first direction, a passivation structure between the first element and the backside insulating structure, and a backside conductive pattern in the backside insulating structure and connected to the passivation structure, where the first element includes a first semiconductor region having a first conductivity type and a second semiconductor region having a second conductivity type and forming a PN junction with the first semiconductor region, the passivation structure includes a first insulating passivation layer contacting a lower surface of the first element and a conductive passivation layer below the first insulating passivation layer, and the backside conductive pattern is connected to the conductive passivation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">5a:第一半導體本體</p>
        <p type="p">5na:第二半導體區</p>
        <p type="p">5pa:第一半導體區</p>
        <p type="p">10na:第二半導體圖案</p>
        <p type="p">10pa:第一半導體圖案</p>
        <p type="p">15a:第一元件</p>
        <p type="p">25:元件隔離層</p>
        <p type="p">28a,28ad:虛設主動結構</p>
        <p type="p">30a,30ad:閘極介電層</p>
        <p type="p">32a,32ad:閘極電極</p>
        <p type="p">35a,35ad:絕緣間隔件</p>
        <p type="p">38a,38ad:絕緣頂蓋圖案</p>
        <p type="p">40a,40ad:閘極結構</p>
        <p type="p">43:第一層間絕緣層</p>
        <p type="p">46a1:第一下部接觸插塞</p>
        <p type="p">46a2:第二下部接觸插塞</p>
        <p type="p">49:第二層間絕緣層</p>
        <p type="p">52a1:第一上部接觸插塞</p>
        <p type="p">52a2:第二上部接觸插塞</p>
        <p type="p">54a:閘極接觸插塞</p>
        <p type="p">55a1:第一互連</p>
        <p type="p">55a2:第二互連</p>
        <p type="p">55a3:閘極互連</p>
        <p type="p">58a:第一前側導電結構</p>
        <p type="p">61:前側絕緣結構</p>
        <p type="p">65:鈍化結構</p>
        <p type="p">65a:第一絕緣鈍化層</p>
        <p type="p">65b:導電鈍化層</p>
        <p type="p">65c:第二絕緣鈍化層</p>
        <p type="p">69:背側導電圖案</p>
        <p type="p">78:第一背側層間絕緣層</p>
        <p type="p">82:第二背側蝕刻停止層</p>
        <p type="p">84:第二背側層間絕緣層</p>
        <p type="p">88:第三背側蝕刻停止層</p>
        <p type="p">90:第三背側層間絕緣層</p>
        <p type="p">92:背側絕緣結構</p>
        <p type="p">96c:第一元件區域背側互連結構</p>
        <p type="p">A:區域</p>
        <p type="p">Ia-Ia':線</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="850" publication-number="202632408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於虹膜模組之線圈模組、虹膜模組及包括虹膜模組之相機裝置</chinese-title>
        <english-title>COIL MODULE FOR IRIS MODULE, IRIS MODULE AND CAMERA DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260422B">G03B5/00</main-classification>
        <further-classification edition="202101120260422B">G03B9/06</further-classification>
        <further-classification edition="202101120260422B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方晶煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, JUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙時瀅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SI HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金敬源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露能夠透過一位置感測器之配置確保來自該位置感測器之輸出之線性度之一虹膜模組、包括該虹膜模組之一透鏡模組及一相機裝置。藉由採用具有一單層精細圖案之一圖案線圈，而非一相對厚的盤繞線圈，減小透鏡模組之厚度，藉此實現該相機裝置之小型化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are an iris module capable of ensuring linearity of output from a position sensor through the arrangement of the position sensor, a lens module including the same, and a camera device. By employing a pattern coil having a single-layer fine pattern, rather than a relatively thick wound coil, the thickness of the lens module is reduced, thereby enabling miniaturization of the camera device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一方向</p>
        <p type="p">2:第二方向</p>
        <p type="p">3:第三方向</p>
        <p type="p">4:第四方向</p>
        <p type="p">100:蓋</p>
        <p type="p">110:頂板</p>
        <p type="p">111:向上突出凹槽</p>
        <p type="p">113:孔</p>
        <p type="p">120:側板</p>
        <p type="p">500:定子</p>
        <p type="p">600:電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="851" publication-number="202633403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對降低能耗的半導體處理平台</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING PLATFORM FOR REDUCED ENERGY CONSUMPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P95/00</main-classification>
        <further-classification edition="202601120260422B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯曼　羅那得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASMAN, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莉婭　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ELIA, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括：一或更多半導體處理腔室；及處理流體供應系統，包括：配置以接收來自第一流體來源之第一流體之輸入部分、流體耦接至該輸入部分並且配置以加熱該第一流體之加熱器、及流體耦接至該加熱器並且配置以輸送包括被該加熱器所加熱之該第一流體之受加熱的處理流體至該一或更多半導體處理腔室之受加熱的流動部分。廢棄物系統係配置以接收來自該受加熱的流動部分、及∕或半導體處理腔室之熱廢棄物流體。熱交換器係包括與該輸入部分為流體連通之供應端流動路徑、及與該廢棄物系統為流體連通之熱輸送端流動路徑。該熱交換器係配置以傳送來自該廢棄物系統之熱能至該輸入部分，以加熱該第一流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid from a first fluid source, a heater fluidly coupled to the input portion and configured to heat the first fluid, and a heated flow portion fluidly coupled to the heater and configured to deliver a heated processing fluid including the first fluid heated by the heater to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or a semiconductor processing chamber. A heat exchanger includes a supply-side flow path in fluid communication with the input portion and a heat delivery-side flow path in fluid communication with the waste system. The heat exchanger is configured to transfer thermal energy from the waste system to the input portion to heat the first fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:半導體處理模組</p>
        <p type="p">103:管線</p>
        <p type="p">106:沖洗管線</p>
        <p type="p">108,110,112,114,116:管線</p>
        <p type="p">118:回流管線</p>
        <p type="p">120:管線</p>
        <p type="p">122:排出管線</p>
        <p type="p">124:公共管線</p>
        <p type="p">C:腔室</p>
        <p type="p">CHE1,CHE2:化學品輸入</p>
        <p type="p">DIW:去離子水</p>
        <p type="p">H1:加熱器</p>
        <p type="p">H2:內嵌加熱器</p>
        <p type="p">HE1:熱交換器</p>
        <p type="p">LMFC1:液體質量流量控制器</p>
        <p type="p">NV1,NV2:針閥</p>
        <p type="p">PMP1:泵</p>
        <p type="p">PV1,PV2:氣動閥</p>
        <p type="p">RT:再循環槽</p>
        <p type="p">PWO:處理廢棄物出口</p>
        <p type="p">RWO:沖洗水出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="852" publication-number="202631556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法、感放射線性酸產生劑及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C25/18</main-classification>
        <further-classification edition="200601120260504B">C07C311/08</further-classification>
        <further-classification edition="200601120260504B">C07C311/11</further-classification>
        <further-classification edition="200601120260504B">C07C311/48</further-classification>
        <further-classification edition="200601120260504B">C07C311/51</further-classification>
        <further-classification edition="200601120260504B">C07C381/12</further-classification>
        <further-classification edition="200601120260504B">C07D275/06</further-classification>
        <further-classification edition="200601120260504B">C07D317/24</further-classification>
        <further-classification edition="200601120260504B">C07D317/70</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八谷明日香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HACHIYA, ASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感放射線性組成物，含有：具有酸解離性基的聚合物、及式（1）所表示的化合物。式（1）中，X&lt;sup&gt;1&lt;/sup&gt;為*&lt;sup&gt;1&lt;/sup&gt;-SO&lt;sub&gt;2&lt;/sub&gt;-NH-或*&lt;sup&gt;1&lt;/sup&gt;-NH-SO&lt;sub&gt;2&lt;/sub&gt;-。*&lt;sup&gt;1&lt;/sup&gt;表示與R&lt;sup&gt;1&lt;/sup&gt;的鍵結鍵。R&lt;sup&gt;1&lt;/sup&gt;及A&lt;sup&gt;1&lt;/sup&gt;中，R&lt;sup&gt;1&lt;/sup&gt;為一價有機基且A&lt;sup&gt;1&lt;/sup&gt;為二價有機基，或者R&lt;sup&gt;1&lt;/sup&gt;及A&lt;sup&gt;1&lt;/sup&gt;相互結合來表示具有於環骨架中包含-SO&lt;sub&gt;2&lt;/sub&gt;-NH-的環結構的基。M&lt;sup&gt;+&lt;/sup&gt;為經取代或未經取代的錪鎓陽離子，或者為具有選自由氟基、溴基、碘基、鹵代烷基、氰基、羰基及磺醯基所組成的群組中的至少一種基的鋶陽離子。其中，於M&lt;sup&gt;+&lt;/sup&gt;為未經取代的錪鎓陽離子的情況下，A&lt;sup&gt;1&lt;/sup&gt;具有芳香環。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="97px" width="277px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="853" publication-number="202633108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132226</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造ＰＭＯＳ電晶體的整合製程及處理系統</chinese-title>
        <english-title>INTEGRATED PROCESS AND PROCESSING SYSTEM FOR MANUFACTURING PMOS TRANSISTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260420B">H10D30/01</main-classification>
        <further-classification edition="202501120260420B">H10D30/43</further-classification>
        <further-classification edition="202501120260420B">H10D30/60</further-classification>
        <further-classification edition="202501120260420B">H10D62/10</further-classification>
        <further-classification edition="202501120260420B">H10D64/01</further-classification>
        <further-classification edition="202601120260420B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>干德可塔　史林尼維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANDIKOTA, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余欣容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HSIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬騰洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, TENGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴賈吉　吉蒂卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJAJ, GEETIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIXIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了製造電子裝置的方法和用於製造電子裝置（例如，P型通道金氧半導體（PMOS）電晶體）的整合處理系統。該等方法包括在基板上位於源極區域與汲極區域之間的通道的頂表面上沉積介面層；在該介面層上沉積高介電常數介電層；在該高介電常數介電層上沉積偶極脫釘層；在該偶極脫釘層上沉積P金屬層；以及在該P金屬層上沉積覆蓋層。該方法是在整合處理系統中原位執行的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of manufacturing electronic devices and integrated processing systems for manufacturing electronic devices (e.g., P-channel metal-oxide-semiconductor (PMOS) transistors) are described. The methods include depositing an interfacial layer on a top surface of a channel located between a source region and a drain region on a substrate; depositing a high-ĸ dielectric layer on the interfacial layer; depositing a dipole depinning layer on the high-ĸ dielectric layer; depositing a P-metal layer on the dipole depinning layer; and depositing a capping layer on the P-metal layer. The method is performed in situ in an integrated processing system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110:操作</p>
        <p type="p">120:操作</p>
        <p type="p">130:操作</p>
        <p type="p">140:操作</p>
        <p type="p">150:操作</p>
        <p type="p">160:操作</p>
        <p type="p">170:操作</p>
        <p type="p">180:操作</p>
        <p type="p">190:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="854" publication-number="202631896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有單甲醇添加劑之導熱複合物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE COMPOSITE WITH MONOCARBINOL ADDITIVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L83/07</main-classification>
        <further-classification edition="201801120260420B">C08K3/013</further-classification>
        <further-classification edition="200601120260420B">C08K3/22</further-classification>
        <further-classification edition="200601120260420B">C08G77/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃焱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費古森　德溫Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERGUSON, DEVIN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹忠偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, ZHONGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種組成物，以該組成物之重量計，其包含a)導熱填料；b)經至少二個烯系不飽和基團官能化之聚有機矽氧烷；及c)經二個末端甲醇基團官能化之聚有機矽氧烷。本發明之組成物提供一種導熱聚有機矽氧烷複合物，其具有極佳的觸變特性與相應的流動性平衡，且可減少填料沉降。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a composition comprising, based on the weight of the composition, a) a thermally conductive filler; b) a polyorganosiloxane functionalized with at least two ethylenically unsaturated groups; and c) a polyorganosiloxane functionalized with two terminal carbinol groups. The composition of the present invention provides a thermally conductive polyorganosiloxane composite with an excellent balance of thixotropic properties and concomitant flowability, with reduced filler settling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="855" publication-number="202633302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法及半導體裝置之製造系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P54/00</main-classification>
        <further-classification edition="202601120260422B">H10P54/20</further-classification>
        <further-classification edition="202601120260422B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置之製造方法，包含：斜角填充，對具有雷射吸收層及第一接合層之第一基板、與具有第二接合層之第二基板中該第一接合層與該第二接合層接合而得之重合基板的未貼合區域，充填填充材料至：與該第一接合層之第一外周位置對應而預先決定的第二外周位置為止；雷射照射，在該雷射吸收層照射雷射光；及分離處理，從該重合基板中之該第二基板分離該第一基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟St1~步驟St15:步驟</p>
        <p type="p">步驟St20，步驟St21:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="856" publication-number="202633076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="200601120260302B">G11C7/06</further-classification>
        <further-classification edition="200601120260302B">G11C7/12</further-classification>
        <further-classification edition="200601120260302B">G11C7/18</further-classification>
        <further-classification edition="200601120260302B">G11C8/08</further-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炅桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYOUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金康仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KANGIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亨駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安相彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SANGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鎔敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, YONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺永丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YOUNGSEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置包括：一基體，其包括一胞元陣列區、一核心區以及該胞元陣列區與該核心區之間的一介面區；一介面裝置隔離膜，其配置在該介面區中且界定該胞元陣列區；複數個虛設作用區，其在該介面區中彼此間隔開，每一虛設作用區由該介面裝置隔離膜環繞；以及複數個位元線，其從該胞元陣列區延伸到該介面區，其中該等複數個位元線中之每一者包括位於該介面區中之一位元線延伸部，且該位元線延伸部延伸至該等複數個虛設作用區中之一選定者上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a substrate including a cell array region, a core region, and an interface region between the cell array region and the core region, an interface device isolation film arranged in the interface region and defining the cell array region, a plurality of dummy active regions spaced apart from each other in the interface region, each dummy active region being surrounded by the interface device isolation film, and a plurality of bit lines extending from the cell array region to the interface region, wherein each of the plurality of bit lines includes a bit line extension located in the interface region, and the bit line extension extends onto a selected one of the plurality of dummy active regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路(IC)裝置、IC裝置</p>
        <p type="p">112:裝置隔離膜</p>
        <p type="p">112A:介面裝置隔離膜</p>
        <p type="p">A1:胞元作用區</p>
        <p type="p">BCP:接觸插塞</p>
        <p type="p">BL:位元線</p>
        <p type="p">BLE:位元線延伸部</p>
        <p type="p">CELL:胞元陣列區</p>
        <p type="p">DAC:虛設作用區</p>
        <p type="p">EX2:部分區</p>
        <p type="p">IF2:第二介面區</p>
        <p type="p">LY1:第一最短距離</p>
        <p type="p">LY2:第二最短距離</p>
        <p type="p">WL:字線</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">X3-X3',X4-X4',Y1-Y1',Y2-Y2':線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="857" publication-number="202632322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、窗戶薄膜及外光利用型顯示體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G02B5/02</main-classification>
        <further-classification edition="201501120260422B">G02B1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉本達己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOTO, TATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野弘気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐麦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, BAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層體(窗戶薄膜2)，包括：在薄膜內具有在折射率相對較低的區域中具備折射率相對較高的複數個區域的內部結構的光擴散控制薄膜1，以及位於比光擴散控制薄膜1更靠近外光入射側的紫外線吸收層(加入紫外線吸收劑的黏著劑層22a、22b)，其中光擴散控制薄膜1是由含有高折射率成分、以及具有比上述高折射率成分更低的折射率的低折射率成分的組合物所得到之物，其中低折射率成分是具有源自於下述通式(I)所示的含羥基丙烯酸單體的結構的胺基甲酸乙酯丙烯酸酯。上述積層體是可以抑制液狀化之物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="220px" width="403px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R為氫原子，n為1以上的整數。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11A:管柱結構</p>
        <p type="p">111:折射率相對較高的柱狀物</p>
        <p type="p">112:折射率相對較低的區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="858" publication-number="202633178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D84/85</main-classification>
        <further-classification edition="202501120251103B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭晩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴星一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴宰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴柱勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種半導體裝置，其包括：一基體；多個下部通道圖案，其定位於該基體上；多個上部通道圖案，其定位於該等複數個下部通道圖案上；一下部閘極電極，其環繞該等複數個下部通道圖案；一上部閘極電極，其環繞該等複數個上部通道圖案；一下部源極/汲極圖案，其定位於該等複數個下部通道圖案之相對側上；一上部源極/汲極圖案，其定位於該下部源極/汲極圖案以及該等複數個上部通道圖案之相對側上；以及一障壁結構，其包括定位於該等複數個下部通道圖案上且具有與該下部源極/汲極圖案不同的傳導性類型的一第一障壁圖案，以及定位於該第一障壁圖案與該等複數個上部通道圖案之間且具有與該上部源極/汲極圖案不同的傳導性類型的一第二障壁圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a substrate; multiple lower channel patterns positioned on the substrate; multiple upper channel patterns positioned on the plurality of lower channel patterns; a lower gate electrode surrounding the plurality of lower channel patterns; an upper gate electrode surrounding the plurality of upper channel patterns; a lower source/drain pattern positioned on opposite sides of the plurality of lower channel patterns, an upper source/drain pattern positioned on the lower source/drain pattern and on opposite sides of the plurality of upper channel patterns, and a barrier structure including a first barrier pattern positioned on the plurality of lower channel patterns and having a different conductivity type from the lower source/drain pattern, and a second barrier pattern positioned between the first barrier pattern and the plurality of upper channel patterns and having a different conductivity type from the upper source/drain pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基體</p>
        <p type="p">110:主動圖案</p>
        <p type="p">120:閘極電極</p>
        <p type="p">120A:下部閘極電極</p>
        <p type="p">120B:上部閘極電極</p>
        <p type="p">120M:主閘極電極</p>
        <p type="p">140:通道圖案</p>
        <p type="p">140A:下部通道圖案</p>
        <p type="p">140B:上部通道圖案</p>
        <p type="p">145:罩蓋層</p>
        <p type="p">150:源極/汲極圖案</p>
        <p type="p">150A:下部源極/汲極圖案，下部半導體圖案</p>
        <p type="p">150B:上部源極/汲極圖案</p>
        <p type="p">151A:第一下部源極/汲極層</p>
        <p type="p">152A:第二下部源極/汲極層</p>
        <p type="p">155A:下部源極/汲極凹部</p>
        <p type="p">155B:上部源極/汲極凹部</p>
        <p type="p">161:第一閘極間隔體</p>
        <p type="p">162:第二閘極間隔體</p>
        <p type="p">171:第一襯膜</p>
        <p type="p">172:第二襯膜</p>
        <p type="p">190B:上部層間絕緣層</p>
        <p type="p">300:障壁結構</p>
        <p type="p">310:第一障壁圖案</p>
        <p type="p">320:第二障壁圖案</p>
        <p type="p">A-A':線</p>
        <p type="p">S1:區域</p>
        <p type="p">TR1:第一電晶體</p>
        <p type="p">TR2:第二電晶體</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="859" publication-number="202633166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260327B">H10D84/83</main-classification>
        <further-classification edition="202501120260327B">H10D30/62</further-classification>
        <further-classification edition="202501120260327B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹喆珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, CHEOLJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許大弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, DAIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金茶惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴星一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明概念之一實施例提供一種半導體裝置。該半導體裝置包含：下部通道層；上部通道層；閘極結構；一第一源極/汲極圖案及一第二源極/汲極圖案，其中該等下部通道層安置在該第一源極/汲極圖案與該第二源極/汲極圖案之間；一第三源極/汲極圖案及一第四源極/汲極圖案，其中該等上部通道層安置在該第三源極/汲極圖案與該第四源極/汲極圖案之間；一上部接觸結構；一下部接觸結構；以及一貫穿接觸結構，其電氣連接該第二源極/汲極圖案及該第四源極/汲極圖案，其中該等閘極結構包含一第一閘極結構、一第二閘極結構及一第三閘極結構，且該第二閘極結構與該第三閘極結構之間的一第一間隙大於該第一閘極結構與該第二閘極結構之間的一第二間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present inventive concept provides a semiconductor device. The semiconductor device comprises: lower channel layers; upper channel layers; gate structures; a first source/drain pattern and a second source/drain pattern, wherein the lower channel layers are disposed between the first source/drain pattern and the second source/drain pattern; a third source/drain pattern and a fourth source/drain pattern, wherein the upper channel layers are disposed between the third source/drain pattern and the fourth source/drain pattern; an upper contact structure; a lower contact structure; and a through-contact structure electrically connecting the second source/drain pattern and the fourth source/drain pattern, wherein the gate structures comprise a first gate structure, a second gate structure and a third gate structure, and a first gap between the second gate structure and the third gate structure is greater than a second gap between the first gate structure and the second gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:半導體主體</p>
        <p type="p">140:通道層</p>
        <p type="p">140a:下部通道層</p>
        <p type="p">140b:上部通道層</p>
        <p type="p">150a:第一源極/汲極圖案</p>
        <p type="p">150b:第二源極/汲極圖案</p>
        <p type="p">150c:第三源極/汲極圖案</p>
        <p type="p">150d:第四源極/汲極圖案</p>
        <p type="p">161:閘極間隔體</p>
        <p type="p">162:閘極介電層</p>
        <p type="p">163:閘極電極</p>
        <p type="p">163a:第一閘極電極</p>
        <p type="p">163b:第二閘極電極</p>
        <p type="p">165:中間絕緣圖案</p>
        <p type="p">167:閘極罩蓋層</p>
        <p type="p">170:隔離絕緣層</p>
        <p type="p">180a:下部接觸結構</p>
        <p type="p">180a_1:下部接觸障壁層</p>
        <p type="p">180b:上部接觸結構</p>
        <p type="p">180b_1:上部接觸障壁層</p>
        <p type="p">180c:貫穿接觸結構</p>
        <p type="p">180c_1:貫穿接觸障壁層</p>
        <p type="p">191:第一層間絕緣層</p>
        <p type="p">192:第二層間絕緣層</p>
        <p type="p">193:第三層間絕緣層</p>
        <p type="p">194:第四層間絕緣層</p>
        <p type="p">D1:第一間隙</p>
        <p type="p">D2:第二間隙</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">GS1:第一閘極結構</p>
        <p type="p">GS2:第二閘極結構</p>
        <p type="p">GS3:第三閘極結構</p>
        <p type="p">I-I',III-III':線</p>
        <p type="p">M1a:第一上部金屬互連件</p>
        <p type="p">M1b:第二上部金屬互連件</p>
        <p type="p">M2a:第一下部金屬互連件</p>
        <p type="p">nTR:第二電晶體</p>
        <p type="p">pTR:第一電晶體</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="860" publication-number="202632542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧角色的簡介更新方法、電腦裝置及電腦程式</chinese-title>
        <english-title>METHOD, COMPUTER DEVICE, AND COMPUTER PROGRAM TO UPDATE AI CHARACTER PROFILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">G06N3/08</main-classification>
        <further-classification edition="202301120251201B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商連進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINE NEXT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, HAE CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭釉珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOUJEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安花苑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HWAWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開人工智慧角色的簡介更新方法、電腦裝置及電腦程式。人工智慧角色簡介更新方法可包括：通過用戶和人工智慧角色參與的聊天室收集所述用戶與所述人工智慧角色的對話消息；以及隨著所述對話消息滿足預設基準，基於所述對話消息更新所述人工智慧角色的簡介。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="861" publication-number="202632417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用擴散模型之圖案覆蓋判定及圖案選擇之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PATTERN COVERAGE DETERMINATION AND PATTERN SELECTION USING DIFFUSION MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260421B">G03F1/36</main-classification>
        <further-classification edition="201201120260421B">G03F1/70</further-classification>
        <further-classification edition="200601120260421B">G03F7/20</further-classification>
        <further-classification edition="202001120260421B">G06F30/20</further-classification>
        <further-classification edition="202601120260421B">G06T11/00</further-classification>
        <further-classification edition="202401120260421B">G06T5/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YEN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何威爾　羅福　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOWELL, RAFAEL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述一種用於基於使用一擴散模型而產生之遮罩圖案表示之一方差之圖案覆蓋判定及圖案選擇的方法及系統。藉由將多個雜訊影像輸入至該擴散模型而針對一目標圖案表示來產生多個遮罩圖案表示。使用一方差圖來運算及表示該等遮罩圖案表示之一方差。該方差圖可用於諸如判定該擴散模型之一圖案覆蓋的各種應用，或用於用以選擇一目標圖案表示來進一步訓練該擴散模型以改良該圖案覆蓋之圖案選擇程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein is a method and system for pattern coverage determination and pattern selection based on a variance of mask pattern representations generated using a diffusion model. Multiple mask pattern representations are generated for a target pattern representation by inputting multiple noise images to the diffusion model. A variance of the mask pattern representations is computed and represented using a variance map. The variance map may be used for various applications such as determining a pattern coverage of the diffusion model, or for pattern selection process to select a target pattern representation for further training the diffusion model to improve the pattern coverage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">502:方差圖</p>
        <p type="p">504a:第一位置</p>
        <p type="p">504b:第二位置</p>
        <p type="p">504c:第三位置</p>
        <p type="p">504d:第四位置</p>
        <p type="p">506:第五位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="862" publication-number="202631232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含遠端框架分離的複合運動球拍及方法</chinese-title>
        <english-title>COMPOSITE SPORTS PADDLE INCLUDING DISTAL FRAME SEPARATION AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260429B">A63B60/54</main-classification>
        <further-classification edition="201501120260429B">A63B59/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商吉爾伯斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEARBOX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利匹尼　拉斐爾Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILIPPINI, RAFAEL G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">包含遠端框架分離的複合運動球拍解決了即使球僅擊中一個拍面時，分離前拍面和後拍面結構的性能特徵的需要。其導入面層分離，使其獨立作用，並分離遠端框架，同時保持沿著球拍遠端部分的剛性。藉由著眼於這些獨立的結構，球拍的整體表現得到增強且球拍符合當今球員的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite sports paddle with distal frame separation addresses the need to separate the performance characteristics of the front face and back face structures, even when the ball strikes only one face. It introduces a separation of the face plies to act independently and separates the distal frame while maintaining rigidity along the paddle's distal portion. By focusing on these independent structures, the overall performance of the paddle is enhanced and paddle meets the demands of today's players.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:球拍</p>
        <p type="p">110:遠端框架分離</p>
        <p type="p">120:前拍面結構</p>
        <p type="p">130:後拍面結構</p>
        <p type="p">150:遠端框架</p>
        <p type="p">400:握把</p>
        <p type="p">410:過渡部分</p>
        <p type="p">420:頭部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="863" publication-number="202632286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查裝置、殼構造體、及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01R1/04</main-classification>
        <further-classification edition="200601120260422B">G01R1/067</further-classification>
        <further-classification edition="202001120260422B">G01R31/26</further-classification>
        <further-classification edition="202601120260422B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林將人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠良好地檢查光子元件之技術。  &lt;br/&gt;檢查裝置係以在基板的一面層積有接觸治具的殼構造體的型態來檢查基板。基板係具備在一面具有光耦合器且在與一面相反側的另一面具有電極焊墊的光子元件。接觸治具係具有第1光耦合器及第2光耦合器，且具備光學性地連接第1光耦合器及第2光耦合器之間的光波導。檢查裝置係包含載置接觸治具的台座、具有會接觸電極焊墊的探針的探針卡、及可透過探針卡相對於基板傳送或接收電氣訊號的測試器。台座係具有光學性地連接於第2光耦合器且可輸出或輸入光訊號的台座側光耦合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查裝置</p>
        <p type="p">21:探針卡</p>
        <p type="p">22:探針</p>
        <p type="p">30:台座</p>
        <p type="p">31:載置台</p>
        <p type="p">31a:凹陷部</p>
        <p type="p">31b:溝槽</p>
        <p type="p">33:光耦合器</p>
        <p type="p">33a:光投射用耦合器</p>
        <p type="p">33b:光接收用耦合器</p>
        <p type="p">35:光波導</p>
        <p type="p">36:光波導</p>
        <p type="p">37:光訊號產生器</p>
        <p type="p">38:光訊號測定器</p>
        <p type="p">39:吸附機構</p>
        <p type="p">391:吸引管</p>
        <p type="p">392:吸引路徑</p>
        <p type="p">393:吸引泵</p>
        <p type="p">40:調溫機構</p>
        <p type="p">41:加熱器</p>
        <p type="p">42:冷媒流道</p>
        <p type="p">43:冷媒路徑</p>
        <p type="p">44:冷卻器</p>
        <p type="p">100:殼構造體</p>
        <p type="p">110:接觸治具</p>
        <p type="p">111:治具本體</p>
        <p type="p">111a:外周部</p>
        <p type="p">111s:凹部</p>
        <p type="p">111s1:對向面</p>
        <p type="p">111s2:相反面</p>
        <p type="p">112:第1光耦合器</p>
        <p type="p">112a:光投射用第1耦合器</p>
        <p type="p">112b:光接收用第1耦合器</p>
        <p type="p">113:第2光耦合器</p>
        <p type="p">113a:光接收用第2耦合器</p>
        <p type="p">113b:光投射用第2耦合器</p>
        <p type="p">115:第1光波導</p>
        <p type="p">116:第2光波導</p>
        <p type="p">C:光耦合器</p>
        <p type="p">Ca:光接收用耦合器</p>
        <p type="p">Cb:光投射用耦合器</p>
        <p type="p">PD:電極焊墊</p>
        <p type="p">SP:元件</p>
        <p type="p">W:基板</p>
        <p type="p">Wa:一面</p>
        <p type="p">Wb:另一面</p>
        <p type="p">Wm:基板本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="864" publication-number="202632981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雲端SIM卡提供裝置和終端聯網設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260302B">H04W8/18</main-classification>
        <further-classification edition="200901120260302B">H04W8/02</further-classification>
        <further-classification edition="200901120260302B">H04W52/02</further-classification>
        <further-classification edition="202601120260302B">H02J7/00</further-classification>
        <further-classification edition="201901120260302B">G06F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市優克聯新技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN UCLOUDLINK NETWORK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡震罡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZHENGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於通信技術領域，主要提供了一種雲端SIM卡提供裝置和終端聯網設備，通過通信模組獲取雲端伺服器分配的雲端SIM卡，並將雲端SIM卡放置在雲端SIM卡放置模組，使得終端聯網設備可以讀取雲端SIM卡資訊，進而通過雲端SIM卡進行註冊上網。本發明的雲端SIM卡提供裝置還設置有包括功率調節模組和電池的電源管理模組，實現了從終端聯網設備的SIM卡介面取電，無需額外的外部供電，也無需用戶充電就能夠長期穩定工作，免去了用戶的維護工作，同時，終端聯網設備的SIM卡介面不會因為通信模組的大電流而導致超載掉電，而且本發明的雲端SIM卡提供裝置可以相容不同介面類型的終端聯網設備，具有適用範圍更廣，相容性強的特點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雲端SIM卡提供裝置</p>
        <p type="p">110:通信模組</p>
        <p type="p">120:雲端SIM卡放置模組</p>
        <p type="p">130:電源管理模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="865" publication-number="202632082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在金屬墊上沉積覆蓋層的製程及設備</chinese-title>
        <english-title>PROCESS AND APPARATUS FOR DEPOSITING A CAPPING LAYER ON METAL PADS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C25D5/02</main-classification>
        <further-classification edition="200601120260504B">C25D7/12</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉斯　桑多什庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RATH, SANTOSH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎安東　普拉由帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANTO, PRAYUDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德什潘德　山彌爾Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, SAMEER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴卡姆　斯威塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARKAM, SWETHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括由化學機械拋光（CMP）處理系統對包含設置於基板之上的介電層之上的互連材料的圖案化裝置結構執行CMP製程。該介電層包括內部蝕刻有互連結構，其中互連材料填充互連結構，並設置於互連結構和介電層的場域區域之上。CMP製程移除設置於介電層的場域區域上的互連材料的部分，並暴露出圖案化裝置結構的互連結構內的墊。該方法進一步包括使用覆蓋層沉積製程在圖案化裝置結構的暴露墊之上沉積覆蓋層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes, performing, by a chemical mechanical polishing (CMP) processing system, a CMP process on patterned device structures comprising an interconnect material disposed over a dielectric layer disposed over a substrate. The dielectric layer includes interconnect structures etched therein, wherein the interconnect material fills the interconnect structures, and is disposed over the interconnect structures and a field region of the dielectric layer. The CMP process removes portions of the interconnect material disposed on the field region of the dielectric layer and exposes pads within the interconnect structures of the patterned device structures. The method further includes depositing a capping layer using a capping layer deposition process over the exposed pads of the patterned device structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:圖案化裝置結構</p>
        <p type="p">101:介電層</p>
        <p type="p">102:互連結構</p>
        <p type="p">105:晶粒</p>
        <p type="p">107:場域區域</p>
        <p type="p">109:墊</p>
        <p type="p">112:覆蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="866" publication-number="202631780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑用硬化性組成物、黏著劑及黏著片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08G18/68</main-classification>
        <further-classification edition="200601120260417B">C08G18/72</further-classification>
        <further-classification edition="200601120260417B">C08F2/50</further-classification>
        <further-classification edition="200601120260417B">C08F4/20</further-classification>
        <further-classification edition="200601120260417B">C09J175/04</further-classification>
        <further-classification edition="200601120260417B">C09J133/10</further-classification>
        <further-classification edition="200601120260417B">C09D133/26</further-classification>
        <further-classification edition="200601120260417B">C07C49/14</further-classification>
        <further-classification edition="201901120260417B">B32B7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三洋化成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYO CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井政登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本恭輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之黏著劑用硬化性組成物（S）係含有具有羥基及(甲基)丙烯醯基之胺酯（urethane）預聚物（P）、交聯劑（C）、除胺酯預聚物（P）以外之具有(甲基)丙烯醯基之化合物（D）、光聚合起始劑（E）、及具有活性亞甲基之化合物（F）之黏著劑用硬化性組成物，且上述具有羥基及(甲基)丙烯醯基之胺酯預聚物（P）係使包含羥基(甲基)丙烯酸酯（a1）之含羥基成分（A）與多異氰酸酯成分（B）進行反應而成之胺酯預聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="867" publication-number="202632400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132691</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圓偏光板</chinese-title>
        <english-title>CIRCULAR POLARIZING PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G02F1/1335</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤友樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西上由紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAMI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永安智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYASU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種圓偏光板，即使配備圓偏光板的顯示裝置被置於高溫環境下，又該顯示裝置中的該圓偏光板施行形狀加工或穿孔等的情況下，該顯示裝置仍可穩定運作。  &lt;br/&gt;本發明之解決手段係一種圓偏光板，其係依序含有第一相位差板、偏光板及第二相位差板的圓偏光板，  &lt;br/&gt;前述第一相位差板包含：具有150℃以上的玻璃轉移溫度及3500Mpa以上的拉伸模數的熱塑性樹脂層，  &lt;br/&gt;前述偏光板包含：含有聚合性液晶化合物及二色性色素的聚合性液晶組成物的硬化物層，  &lt;br/&gt;前述第二相位差板包含：含有聚合性液晶化合物的聚合性液晶組成物的硬化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a circular polarizing plate which enables a display device to operate stably, even when the display device equipped with the circular polarizing plate is placed in a high-temperature environment, or when the circular polarizing plate in said display device is subjected to shape processing, perforation, or the like. &lt;br/&gt;The solution of the present invention is a circular polarizing plate, which is a circular polarizing plate sequentially comprising a first retardation plate, a polarizing plate, and a second retardation plate, wherein said first retardation plate comprises: a thermoplastic resin layer having a glass transition temperature of 150°C or higher and a tensile modulus of 3500 MPa or higher, wherein said polarizing plate comprises: a cured layer of a polymerizable liquid crystal composition comprising a polymerizable liquid crystal compound and a dichroic dye, and wherein said second retardation plate comprises: a cured layer of a polymerizable liquid crystal composition comprising a polymerizable liquid crystal compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="868" publication-number="202631540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＶＯ燒結體及其製造方法以及ＶＯ濺鍍靶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C04B35/495</main-classification>
        <further-classification edition="200601120260416B">C23C14/34</further-classification>
        <further-classification edition="200601120260416B">C04B35/622</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村井一貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAI, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈良淳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供高密度之V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;燒結體、高密度之V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;燒結體之製造方法以及高密度之V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;濺鍍靶。本發明之V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;燒結體之相對密度為95%以上。本發明之V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;燒結體之製造方法係將V&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;粉末於真空或非活性環境氣體中以1350～1450℃進行熱壓燒結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="869" publication-number="202632073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電化學電池堆疊互連件之單爐燒結及氧化方法</chinese-title>
        <english-title>ONE FURNACE SINTERING AND OXIDATION METHOD FOR ELECTROCHEMICAL CELL STACK INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260430B">C25B1/04</main-classification>
        <further-classification edition="202101120260430B">C25B9/65</further-classification>
        <further-classification edition="201601120260430B">H01M8/0208</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商博隆能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOOM ENERGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克曼　查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOLKMAN, CHAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含：將互連件放置於爐中；藉由在該爐中在還原氛圍中加熱該互連件來燒結該互連件；藉由在該爐中在氧化氛圍中加熱該互連件來氧化該互連件；及自該爐移除互連件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes placing an interconnect in a furnace, sintering the interconnect by heating the interconnect in a reducing atmosphere in the furnace, oxidizing the interconnect by heating the interconnect in an oxidizing atmosphere in the furnace, and removing interconnect from the furnace.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:步驟</p>
        <p type="p">302:步驟</p>
        <p type="p">304:步驟</p>
        <p type="p">306:步驟</p>
        <p type="p">310:步驟/燒結步驟</p>
        <p type="p">320:步驟/氧化步驟</p>
        <p type="p">322:步驟</p>
        <p type="p">330:步驟</p>
        <p type="p">332:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="870" publication-number="202631855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片狀樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08K3/22</main-classification>
        <further-classification edition="200601120260416B">C08L63/00</further-classification>
        <further-classification edition="200601120260416B">C08J5/18</further-classification>
        <further-classification edition="200601120260416B">B32B27/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤友宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大門滿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIMON, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不易發生由α射線引起的誤動作且密封性良好的片狀樹脂組成物。一種片狀樹脂組成物，包含氧化鋁粒子及環氧樹脂，所述氧化鋁粒子中自體積基準的累計粒度分佈的微粒側起累計50%的粒子徑D50為10 μm以下，厚度為0.13 mm以上且1.00 mm以下，α射線量為0.05 cph/cm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="871" publication-number="202633323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體襯底處理裝置及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P72/00</main-classification>
        <further-classification edition="202601120260422B">H10P50/64</further-classification>
        <further-classification edition="202201120260422B">B01F23/231</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李亞洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈社娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, SHENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林金木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JINMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜旭初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, XUCHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種半導體襯底處理裝置及處理方法，涉及半導體製造設備領域，半導體襯底處理裝置包括：處理槽，用於容納刻蝕溶液；保持機構，用於保持半導體襯底並使半導體襯底浸入所述刻蝕溶液中；鼓泡裝置，用於向所述處理槽中供給氣體；控制器，配置為控制鼓泡裝置向處理槽中提供氣體，以在刻蝕溶液中間歇性地產生多組氣泡，其中，相鄰的兩組氣泡之間具有間歇時長，鼓泡裝置在間歇時長內不產生氣泡，其中，間歇時長的長短被設置為使得所述刻蝕溶液不會倒灌至所述鼓泡裝置。通過間歇性地產生多組氣泡，不但可以提高刻蝕的效率，而且還能夠降低半導體襯底圖形結構內的生成物濃度，避免回粘現象或再沉積現象的產生，有利於提高刻蝕的均一性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:半導體襯底</p>
        <p type="p">210:減壓閥</p>
        <p type="p">220:氣體品質流量控制器</p>
        <p type="p">230:篩檢程式</p>
        <p type="p">240:單向閥</p>
        <p type="p">250:壓力計</p>
        <p type="p">260:開關閥</p>
        <p type="p">270:氣體管路</p>
        <p type="p">280:氣體排出部</p>
        <p type="p">400:處理槽</p>
        <p type="p">500:保持機構</p>
        <p type="p">600:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="872" publication-number="202633241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、光感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260423B">H10K30/60</main-classification>
        <further-classification edition="200601120260423B">C07D209/82</further-classification>
        <further-classification edition="200601120260423B">C07D219/02</further-classification>
        <further-classification edition="200601120260423B">C07D403/06</further-classification>
        <further-classification edition="200601120260423B">C07D409/06</further-classification>
        <further-classification edition="200601120260423B">C07D409/14</further-classification>
        <further-classification edition="200601120260423B">C07D487/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姉帯勇人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANETAI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的第1課題為提供一種在接收到藍色光、綠色光及紅色光中的任一光時響應性及量子效率亦優異的光電轉換元件。又，本發明的第2課題為提供一種與上述光電轉換元件相關之攝像元件及光感測器。本發明的光電轉換元件是依序積層導電性膜、光電轉換膜及透明導電性膜而成，其中，上述光電轉換膜包含第1化合物、第2化合物、第3化合物及n型有機半導體，上述第1化合物、上述第2化合物及上述第3化合物的結構互不相同，上述第1化合物在波長400～550nm處具有極大吸收波長且在極大吸收波長處的吸收係數為1×10&lt;sup&gt;5&lt;/sup&gt;cm&lt;sup&gt;-1&lt;/sup&gt;以上，上述第2化合物在波長500～650nm處具有極大吸收波長且在極大吸收波長處的吸收係數為1×10&lt;sup&gt;5&lt;/sup&gt;cm&lt;sup&gt;-1&lt;/sup&gt;以上，上述第3化合物在波長400～550nm或波長500～650nm處具有極大吸收波長且在極大吸收波長處的吸收係數為1×10&lt;sup&gt;5&lt;/sup&gt;cm&lt;sup&gt;-1&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="873" publication-number="202631798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯共聚物</chinese-title>
        <english-title>POLYESTER COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08G63/183</main-classification>
        <further-classification edition="200601120260416B">C08G63/199</further-classification>
        <further-classification edition="200601120260416B">C08G63/672</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO-KYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亥里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAE-RI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慎鏞埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YONG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種聚酯共聚物，其包含：重複單元A，其衍生自包含對苯二甲酸(TPA)或對苯二甲酸二甲酯(DMT)的第一二羧酸組分；重複單元B，其衍生自包含環己烷二甲酸二甲酯(DMCD)的第二二羧酸組分；及重複單元C，其衍生自包含C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;烷二醇化合物的二醇組分，其中以衍生自整個二羧酸組分的重複單元之總莫耳數計，該重複單元B係以40莫耳%或更低的量使用。該聚酯共聚物對環境友好，同時其可具有極佳機械特性、光學特性及可加工性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a polyester copolymer, which comprises a repeat unit A derived from a first dicarboxylic acid component comprising terephthalic acid (TPA) or dimethyl terephthalate (DMT); a repeat unit B derived from a second dicarboxylic acid component comprising dimethyl cyclohexanedicarboxylate (DMCD); and a repeat unit C derived from a diol component comprising a C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; alkanediol compound, wherein the repeat unit B is employed in an amount of 40% by mole or less based on the total number of moles of the repeat units derived from the entire dicarboxylic acid component. The polyester copolymer is environmentally friendly while it can have excellent mechanical properties, optical properties, and processability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="874" publication-number="202632019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132933</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>淬火回火用圓棒鋼</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C22C38/24</main-classification>
        <further-classification edition="200601120260302B">C21D6/00</further-classification>
        <further-classification edition="202601120260302B">C21D8/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚智樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井原直哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHARA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村勇希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今浪祐太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMANAMI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建山恭寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATEYAMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野智久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一宮克行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMIYA, KATSUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島孝一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種減少製造成本、耐腐蝕性、耐磨損性、熱加工性及韌性優異的淬火回火用鋼。本發明的淬火回火用圓棒鋼的特徵在於，具有規定的成分組成，在所述圓棒鋼的與長邊方向垂直的剖面中，自所述圓棒鋼的表面至從該表面朝向中心方向與所述剖面的直徑的10%的深度相當的位置為止的區域中的C、Si、Mn及Mo的濃度分佈滿足規定的關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="875" publication-number="202632814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其組裝方法</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ASSEMBLING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260225B">H01R13/6581</main-classification>
        <further-classification edition="201101120260225B">H01R13/6585</further-classification>
        <further-classification edition="200601120260225B">H01R13/40</further-classification>
        <further-classification edition="200601120260225B">H01R13/514</further-classification>
        <further-classification edition="200601120260225B">H01R43/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器及其組裝方法，電連接器包括絕緣體及兩排端子，絕緣體包括縱長基部以及自基部向前延伸的舌板，端子包括設置於舌板下側的第一端子以及設置於上側的第二端子，一排第一端子通過絕緣條固定並形成一端子模組；電連接器還包括位於舌板內且固定於端子模組之靠近第二端子的接地件，接地件包括並行設置的前橫條、後橫條以及位於前、後橫條之間且連接前、後橫條的複數遮蔽部；部分遮蔽部設置避讓槽，避讓槽沿上下方向貫穿遮蔽部並向前延伸至貫穿前橫條，絕緣體設有支撐肋，支撐肋凸伸入避讓槽內。支撐肋的設置能夠有效增強舌板的強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector and an assembling method, the electrical connector includes an insulating housing and two rows of terminals, the insulating housing includes a longitudinal base portion and a tongue portion extending forward from the base portion. The terminals comprise a row of first terminals located at the lower face of the tongue portion and a row of second terminals located at the upper face of the tongue portion. The row of the first terminals are fixed together by an insulating bar to form a terminal module. The electrical connector further incudes a grounding member that is embedded in the tongue portion and is located at one side of the terminal module near the second terminals. The grounding member incudes a front longitudinal bar, a rear longitudinal bar parallel to the front longitudinal bar and plural shielding portions between and connecting with the front longitudinal bar and the rear longitudinal bar. At least one of the shielding portions has an avoiding slot which penetrates the corresponding shielding portion along an upper and lower direction. The avoiding slot extends forward and goes across the front longitudinal bar. The insulating housing has plural reinforcing ribs which protrude into the corresponding avoiding slot respectively for strengthening the tongue portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:支撐肋</p>
        <p type="p">50:連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="876" publication-number="202631079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用力感測器校準反壓力</chinese-title>
        <english-title>CALIBRATION OF COUNTERPRESSURES USING FORCE SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">A61B5/00</main-classification>
        <further-classification edition="200601120260421B">A61B5/021</further-classification>
        <further-classification edition="200601120260421B">A61B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤班克斯　塞繆爾　喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUBANKS, SAMUEL JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克斯　艾蜜莉　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS, EMILY KATHRYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史科尼德　約翰　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, JOHN KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷洛夫　艾文　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRELOFF, EVAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾夫　寇特妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFF, COURTNEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, WENHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班差瓦加　赫瑞什科士　維加伊庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANCHAWAGH, HRISHIKESH VIJAYKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥傑維克　史蒂芬　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOJEVIC, STEPHEN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示用於使用一力感測器校準反壓力及/或估計一使用者的一生理參數（諸如血壓）的方法、設備、及系統。在一些實施例中，一使用者裝置可包括：一信號源系統；一感測器系統；一介面部分；一力感測器系統，該力感測器系統經組態以測量由該使用者的接觸期間施加至該介面部分的一外部壓力；及一控制系統，其經組態以：獲得將一或多個外部壓力值與一或多個校準因數值相關聯的校準資料；使用該校準資料，基於由該使用者的該接觸期間施加至該介面部分的該外部壓力判定一校準因數；及基於該校準因數、以及基於由該感測器系統偵測到的該等信號所判定的該使用者的該目標物體的一或多個物理特性，估計一生理參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, apparatus, and systems for calibration of counterpressures using a force sensor and/or estimation of a physiological parameter of a user (such as blood pressure) are disclosed. In some embodiments, a user device may include: a signal source system; a sensor system; an interface portion; a force sensor system, the force sensor system configured to measure an external pressure applied to the interface portion during contact by the user; and a control system configured to: obtain calibration data correlating one or more external pressure values to one or more calibration factor values; determine, using the calibration data, a calibration factor based on the external pressure applied to the interface portion during the contact by the user; and estimate a physiological parameter based on the calibration factor, and one or more physical characteristics of the target object of the user determined based on the signals detected by the sensor system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1300:流程圖</p>
        <p type="p">1302:反壓力</p>
        <p type="p">1303:感測器測量</p>
        <p type="p">1304:校準資料</p>
        <p type="p">1305:物理特性</p>
        <p type="p">1306:校準因數</p>
        <p type="p">1308:生理參數</p>
        <p type="p">1310:感測設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="877" publication-number="202633130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251110B">H10D62/10</main-classification>
        <further-classification edition="202501120251110B">H10D64/20</further-classification>
        <further-classification edition="202501120251110B">H10D86/80</further-classification>
        <further-classification edition="202301120251110B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, TATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽賀健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田圭司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電晶體特性優異的半導體裝置。實施方式的半導體裝置包括：第一電極；第二電極；第一氧化物半導體層，設置於第一電極與第二電極之間；閘極電極，與第一氧化物半導體層相向並沿第一方向延伸；第一閘極絕緣層，設置於閘極電極與第一氧化物半導體層之間，包圍第一氧化物半導體層，且包含選自由矽（Si）與氮（N）的組合、鈦（Ti）與氧（O）的組合、及鋁（Al）與氧（O）的組合所組成的群組中的至少一種元素的組合；以及第一絕緣層，在與連結第一電極和第二電極的第二方向垂直且包含閘極電極的第一剖面中包含第一部分及第二部分，在第一部分與第二部分之間設置有閘極電極，第一部分與第一閘極絕緣層相接，第二部分與閘極電極相接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:下部電極(第一電極)</p>
        <p type="p">14:上部電極(第二電極)</p>
        <p type="p">16:氧化物半導體層</p>
        <p type="p">16a:第一氧化物半導體層</p>
        <p type="p">18:閘極電極</p>
        <p type="p">20:閘極絕緣層</p>
        <p type="p">20a:第一閘極絕緣層</p>
        <p type="p">21:第一配線層</p>
        <p type="p">22:層間絕緣層(第一絕緣層)</p>
        <p type="p">22a:第一部分</p>
        <p type="p">22b:第二部分</p>
        <p type="p">100:電晶體(半導體裝置)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="878" publication-number="202632526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解析支援裝置、解析支援系統、解析支援方法、及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260423B">G06F30/23</main-classification>
        <further-classification edition="202001120260423B">G06F30/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川豊治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, TOYOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林宜弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田和仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KAZUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中江修二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYE, SHOEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>居上晃充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKAMI, TERUMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀谷昌弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMETANI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田谷洋人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITAYA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山﨑龍朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤克哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹內稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲谷雄一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATANI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川嶋光将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, TERUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種解析支援裝置，具備：計算對象空間取得部，取得進行物理現象的模擬之計算對象空間的大小；區塊設定取得部，取得包含代表前述計算對象空間中物體之區塊的位置及大小的幾何設定、以及包含關於前述區塊對前述物理現象影響之功能的設定之區塊設定；以及解析條件設定部，基於前述區塊設定，生成由前述計算對象空間及前述區塊構成的解析對象模型，並設定包含將前述模型分割成複數個網格時的網格大小、以及與前述區塊的外表面接觸之網格的邊界條件的解析條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:解析支援裝置</p>
        <p type="p">11:計算對象空間取得部</p>
        <p type="p">12:區塊設定取得部</p>
        <p type="p">13:解析條件設定部</p>
        <p type="p">14:解析結果取得部</p>
        <p type="p">20:解析裝置</p>
        <p type="p">21:CFD解析部</p>
        <p type="p">22:光學解析部</p>
        <p type="p">23:音響解析部</p>
        <p type="p">30:終端裝置</p>
        <p type="p">100:解析系統</p>
        <p type="p">NW:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="879" publication-number="202632979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133281</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移動體系統及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">H04W4/44</main-classification>
        <further-classification edition="201801120260504B">H04W4/30</further-classification>
        <further-classification edition="202601120260504B">H10P72/10</further-classification>
        <further-classification edition="202601120260504B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木股友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMATA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">移動體系統1具備有：在包含複數個區域AR的系統區域SR內移動的移動體2；及複數個通信裝置3；將相互不干擾之通信頻道被予以分配至在複數個區域AR中彼此相鄰之區域AR；複數個通信裝置3之各者被構成為使用被分配至所配置之區域AR的通信頻道以與通信部2a進行通信；當複數個區域AR之數量較移動體系統1可利用之通信頻道之數量為多且在複數個區域AR中存在有複數個分配有同一個通信頻道的區域AR時，被分配有該同一個通信頻道的區域AR彼此相互地分隔在俯視下之移動體2與通信裝置3之可通信距離以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:通信裝置</p>
        <p type="p">AR:區域</p>
        <p type="p">AR1:第1區域</p>
        <p type="p">AR2:第2區域</p>
        <p type="p">AR3:第3區域</p>
        <p type="p">AR4:第4區域</p>
        <p type="p">G:區域組</p>
        <p type="p">SR:系統區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="880" publication-number="202632523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於可變基數防止旁通攻擊之硬體安全系統</chinese-title>
        <english-title>HARDWARE SECURITY SYSTEM FOR PREVENTING SIDE CHANNEL ATTACKS BASED ON VARIABLE RADIX</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120251201B">G06F21/70</main-classification>
        <further-classification edition="201301120251201B">G06F21/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智能資安科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGENT INFORMATION SECURITY TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方偉騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, WAI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基於可變基數防止旁通攻擊之硬體安全系統，包含安全晶片與模糊橢圓曲線乘法模組。安全晶片透過PUF陣列產生數位指紋作為密鑰根，經穩定模組處理，不穩定單元作為真隨機數熵源，加密模組由頂部控制器管理以支援加解密。模糊橢圓曲線乘法模組包含可變基數處理器、運算序列模組、插入模組及橢圓曲線模組。私鑰經可變基數處理器拆解為符號與基數組合，轉為可變進位系統後，運算序列模組將其轉譯為高位優先的橢圓曲線指令，並結合分配律進行最佳化。插入模組插入混淆操作平衡運算時間，以抵抗時間分析攻擊。橢圓曲線模組依指令執行點倍乘與點加運算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a hardware security system for prevent side channel attacks based on a variable radix. The system comprises a security chip and a key computation unit. The security chip generates a digital fingerprint using a PUF array as the root of the key, which is processed by a stabilization module, while unstable cells serve as a true random number entropy source. An encryption module is managed by a top-level controller to support encryption and decryption operations. The key computation unit includes a variable radix processor, an operation sequence module, an insertion module, and an elliptic curve module. The private key is decomposed by the variable radix processor into symbol-radix pairs and converted into a variable-base system. The operation sequence module translates the result into high-order-first elliptic curve instructions and optimizes the computation using the distributive property. The insertion module inserts dummy operations to balance computation time and resist timing analysis attacks. The elliptic curve module executes point multiplication and point addition operations according to the instructions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:通信介面</p>
        <p type="p">20:模糊橢圓曲線乘法模組</p>
        <p type="p">21:可變基數處理器</p>
        <p type="p">22:運算序列模組</p>
        <p type="p">23:插入模組</p>
        <p type="p">24:橢圓曲線模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="881" publication-number="202633404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、資訊處理方法及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P95/00</main-classification>
        <further-classification edition="200601120260423B">G05B23/02</further-classification>
        <further-classification edition="200601120260423B">G05B13/02</further-classification>
        <further-classification edition="200601120260423B">G05B11/36</further-classification>
        <further-classification edition="200601120260423B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種能夠期待實現複數個單元之協調控制之基板處理裝置、資訊處理方法及電腦程式。  &lt;br/&gt;本實施方式之基板處理裝置係具備上位控制單元及下位控制單元者，且上述下位控制單元於控制相關之參數發生變更之情形時，將變更後之參數向上述上位控制單元發送，上述上位控制單元自上述下位控制單元接收參數，將接收到之上述參數記憶於資料庫中，基於記憶於上述資料庫中之參數產生對上述下位控制單元之控制指令，將所產生之上述控制指令向上述下位控制單元發送。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">3:上位控制單元</p>
        <p type="p">5:下位控制單元</p>
        <p type="p">5a:ESC溫度控制單元(下位控制單元)</p>
        <p type="p">5b:氣體流量控制單元(下位控制單元)</p>
        <p type="p">5c:壓力控制單元(下位控制單元)</p>
        <p type="p">7:控制規格DB</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="882" publication-number="202631274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自石膏廢料分離紙片之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260430B">B09B3/00</main-classification>
        <further-classification edition="200601120260430B">B09B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商吉野石膏股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO GYPSUM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內藤大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬場宏輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMBA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠自包含石膏廢料之漿料將紙片良好地去除的自石膏廢料分離紙片之方法。&lt;br/&gt;  自石膏廢料分離紙片之方法具有如下工序：形成包含石膏廢料及水之漿料；一邊攪拌漿料，一邊將漿料層狀地分離為第1漿料部及第2漿料部，前述第1漿料部係石膏廢料沉積而形成，前述第2漿料部係重疊於第1漿料部之上且包含比重小於石膏廢料之紙片；以及，一邊攪拌漿料，一邊對包含紙片之第2漿料部進行排水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST1,ST2,ST3,ST4,ST5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="883" publication-number="202631702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133360</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生質樹脂複合化物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/10</main-classification>
        <further-classification edition="200601120260504B">C08F2/44</further-classification>
        <further-classification edition="200601120260504B">C08F4/04</further-classification>
        <further-classification edition="200601120260504B">C08F4/30</further-classification>
        <further-classification edition="200601120260504B">C08F12/08</further-classification>
        <further-classification edition="200601120260504B">C08F18/08</further-classification>
        <further-classification edition="200601120260504B">C08F220/14</further-classification>
        <further-classification edition="200601120260504B">C08F212/08</further-classification>
        <further-classification edition="200601120260504B">C08L25/06</further-classification>
        <further-classification edition="200601120260504B">C08L25/14</further-classification>
        <further-classification edition="200601120260504B">C08L31/04</further-classification>
        <further-classification edition="200601120260504B">C08L33/12</further-classification>
        <further-classification edition="200601120260504B">C08K7/02</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C08J3/22</further-classification>
        <further-classification edition="200601120260504B">C08J5/06</further-classification>
        <further-classification edition="201101120260504B">B82Y30/00</further-classification>
        <further-classification edition="201101120260504B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人信州大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINSHU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草木涉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAKI, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田光正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, MITSUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種生質樹脂複合化物，其係未被化學改性之生質奈米纖維分散在至少1種的樹脂之生質樹脂複合化物，作為分散劑，並未包含可溶於前述生質奈米纖維以外之水或者水可溶性醇的分散劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="884" publication-number="202632541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用非線性光學共振器型神經元的非線性全光學機器學習系統及方法</chinese-title>
        <english-title>NONLINEAR ALL-OPTICAL MACHINE LEARNING SYSTEMS AND METHODS USING NONLINEAR OPTICAL RESONATOR-BASED NEURONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G06N3/067</main-classification>
        <further-classification edition="200601120260427B">G02F1/35</further-classification>
        <further-classification edition="200601120260427B">G02F3/00</further-classification>
        <further-classification edition="202301120260427B">G06N3/04</further-classification>
        <further-classification edition="202301120260427B">G06N3/084</further-classification>
        <further-classification edition="202301120260427B">G06N3/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚涌溪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, YONGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, YONGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種非線性全光學機器學習系統（NAOMLS），具有非線性光學共振器型連續波及／或尖峰神經元（NOR）及線性光學元件或層（LOL），經由基於機器學習的直接及／或間接反向設計及／或NOR的最佳化及／或LOL的最佳化後，學習以實現標的任務。經反向設計及／或最佳化的NOR及最佳化的LOL共同定義NAOMLS的輸入光與輸出光之間的可學習映射函數，以滿足標的任務的標的目標。於一些實施例中，NOR間接且反向設計以符合反向設計目標，以與NAOMLS整合，使NAOMLS能正常運作以滿足標的任務的標的目標。於一些實施例中，NOR直接與NAOMLS整合，並與LOL經反向設計及／或最佳化，以直接滿足標的任務的標的目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nonlinear all optical machine learning system (NAOMLS) with nonlinear optical resonator-based continuous wave and/or spiking neurons (NORs) and linear optical components or layers (LOL) learns to implement target tasks after machine learning based direct and/or indirect inverse design and/or optimization of the NORs and/or optimization of the LOL. The inversely designed and/or optimized NORs and the optimized LOL collectively define learnable mapping functions between input lights and output lights of the NAOMLS to meet target objectives for target tasks. In some embodiments, the NORs are indirectly and inversely designed to meet inversely designed objectives in order to be integrated with the NAOMLS so that the NAOMLS can function properly to meet target objectives for target tasks. In some embodiments, the NORs are integrated directly with the NAOMLS and inversely designed and/or optimized with the LOL to directly meet target objectives for target tasks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1210:操作</p>
        <p type="p">1211:操作</p>
        <p type="p">1212:操作</p>
        <p type="p">1213:操作</p>
        <p type="p">1214:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="885" publication-number="202632920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測方法及其檢測設備</chinese-title>
        <english-title>DETECTION METHOD AND DETECTION EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260422B">H04B17/00</main-classification>
        <further-classification edition="201501120260422B">H04B3/46</further-classification>
        <further-classification edition="201301120260422B">H04B10/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傳承光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMERICA OPTOELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉興德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PETER SIN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JOSEPH CHEN-KWO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉泓甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, JACK HUNG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TOM YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JUSTIN CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測方法及其檢測設備，係可在檢測液體中檢測訊號線材的訊號傳輸性能，其中，該檢測設備係可容納該檢測液體，而該訊號線材係可浸入該檢測液體以模擬運行，從而檢測該訊號線材在該檢測液體中的訊號傳輸性能，如此，可以在該訊號線材實際應用前預先檢測該訊號線材在該檢測液體中的訊號傳輸性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection method and its detection equipment are disclosed, which can be used to test the signal transmission performance of a signal wire in a test liquid. The detection equipment is configured to contain the test liquid, while the signal wire can be immersed in the test liquid to simulate operation, thereby detecting the signal transmission performance of the signal wire in the test liquid. In this way, the signal transmission performance of the signal wire in the test liquid can be pre-tested before the signal wire is put into actual application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢測設備</p>
        <p type="p">L:檢測液體</p>
        <p type="p">2:訊號線材</p>
        <p type="p">11:檢測槽</p>
        <p type="p">S111:液體容納空間</p>
        <p type="p">S1111:基板溼區設置子空間</p>
        <p type="p">S1112:非基板溼區設置子空間</p>
        <p type="p">S112:非液體容納空間</p>
        <p type="p">12:檢測模組</p>
        <p type="p">121:檢測基板</p>
        <p type="p">1211:基板檢測單元</p>
        <p type="p">1212:基板對接埠</p>
        <p type="p">122:檢測線材</p>
        <p type="p">L1211:基板對接側</p>
        <p type="p">L1212:基板非對接側</p>
        <p type="p">Z1211:基板乾區</p>
        <p type="p">Z12111:基板對接側子乾區</p>
        <p type="p">Z12112:基板非對接側子乾區</p>
        <p type="p">Z1212:基板溼區</p>
        <p type="p">Z12121:基板對接側子溼區</p>
        <p type="p">Z12122:基板非對接側子溼區</p>
        <p type="p">13:檢測槽止擋組件</p>
        <p type="p">131:檢測槽止擋組件導液結構</p>
        <p type="p">14:基板止擋組件</p>
        <p type="p">141:基板對接側子止擋組件</p>
        <p type="p">142:基板非對接側子止擋組件</p>
        <p type="p">15:檢測槽線材引導組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="886" publication-number="202631400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包裝用積層體</chinese-title>
        <english-title>PACKAGING LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">B32B27/32</main-classification>
        <further-classification edition="201901120260416B">B32B7/028</further-classification>
        <further-classification edition="200601120260416B">B65D65/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.I.TAKIRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原一芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, KAZUFUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森惠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大島滉主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種包裝用積層體（1），其包括延伸膜及密封膜（2），延伸膜至少具有以密度為0.950g／cm&lt;sup&gt;3&lt;/sup&gt;以上的高密度聚乙烯為主要成分的基材層（3），密封膜（2）積層在延伸膜上，並且以聚乙烯為主要成分，延伸方向上的延伸膜在120℃下加熱了10分鐘時的熱收縮率小於5％，將基材層（3）的熔點設為Mp&lt;sub&gt;1&lt;/sub&gt;［℃］、將密封膜（2）的熔點設為Mp&lt;sub&gt;2&lt;/sub&gt;［℃］時，Mp&lt;sub&gt;1&lt;/sub&gt;［℃］－Mp&lt;sub&gt;2&lt;/sub&gt;［℃］＜24.0［℃］的關係成立。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide a packaging laminate (1) comprising a stretched film having at least a base layer (3) primarily composed of high-density polyethylene having a density of 0.950 g/cm&lt;sup&gt;3&lt;/sup&gt; or more, and a sealant film (2) laminated on the stretched film and primarily composed of polyethylene, wherein the heat shrinkage rate of the stretched film in the stretching direction when heated at 120°C for 10 minutes is less than 5%, and the relationship Mp&lt;sub&gt;1&lt;/sub&gt; [°C] - Mp&lt;sub&gt;2&lt;/sub&gt; [°C] ＜ 24.0 [°C] holds, where Mp&lt;sub&gt;1&lt;/sub&gt; [°C] is the melting point of the base layer (3) and Mp&lt;sub&gt;2&lt;/sub&gt; [°C] is the melting point of the sealant film (2).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:包裝用積層體</p>
        <p type="p">2:密封膜</p>
        <p type="p">3:基材層(延伸膜)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="887" publication-number="202633426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳易良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何家齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種電子裝置及其製作方法。製作方法包括提供一載板；於載板上形成離型層；於離型層上提供元件結構，並曝露出離型層的上表面的一部分；於離型層的上表面的所述部分上形成阻擋結構；以及在形成阻擋結構之後，對元件結構進行一表面處理步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device and a manufacturing method thereof. The manufacturing method includes providing a carrier; forming a release layer on the carrier; providing a device structure on the release layer and exposing a portion of a top surface of the release layer; forming a barrier structure on the portion of the top surface of the release layer; and performing a surface treatment step on the device structure after the barrier structure is formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:載板</p>
        <p type="p">12S1,14S1:上表面</p>
        <p type="p">14:離型層</p>
        <p type="p">16:元件結構</p>
        <p type="p">18:阻擋結構</p>
        <p type="p">18a:第一部分</p>
        <p type="p">18b:第二部分</p>
        <p type="p">20:電子單元</p>
        <p type="p">20a:主體部</p>
        <p type="p">20b:絕緣層</p>
        <p type="p">20p:接墊</p>
        <p type="p">20S1,20S2:表面</p>
        <p type="p">22:封裝層</p>
        <p type="p">P1,P2:部分</p>
        <p type="p">PL:保護層</p>
        <p type="p">W1,W3:寬度</p>
        <p type="p">W2:距離</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="888" publication-number="202632720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用電壓對比量測電阻及電容之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR MEASURING RESISTANCE AND CAPACITANCE USING VOLTAGE CONTRAST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/26</main-classification>
        <further-classification edition="201701120260421B">G06T7/00</further-classification>
        <further-classification edition="202601120260421B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬格努斯　艾爾伯圖斯　維克　傑拉杜斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGNUS, ALBERTUS VICTOR GERARDUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高里　貝諾特　赫爾維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAURY, BENOIT HERVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴特瑪司　艾納諾斯堤斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSIATMAS, ANAGNOSTIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於判定一樣本上缺陷的存在之系統及方法。系統及方法可包括：在一第一束電流下，獲得一晶圓之一部分在第一複數個像素時間之第一複數個影像，其中該第一複數個影像中之各者對應於該第一複數個像素時間中之一像素時間；在不同於該第一束電流之一第二束電流下，獲得該晶圓之該部分在第二複數個像素時間之第二複數個影像，其中該第二複數個影像中之各者對應於該第二複數個像素時間中之一像素時間；運用一模型對自該第一複數個影像及該第二複數個影像獲得之資料進行擬合；及使用該擬合資料來分析該晶圓之該部分以判定任何缺陷的該存在。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for determining presence of defects on a sample. Systems and methods may include obtaining a first plurality of images at a first plurality of pixel times of a portion of a wafer at a first beam current, wherein each of the first plurality of images corresponds to a pixel time of the first plurality of pixel times; obtaining a second plurality of images at a second plurality of pixel times of the portion of the wafer at a second beam current that is different from the first beam current, wherein each of the second plurality of images corresponds to a pixel time of the second plurality of pixel times; fitting, with a model, data obtained from the first plurality of images and the second plurality of images; and using the fitted data to analyze the portion of the wafer for determining the presence of any defects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:程序</p>
        <p type="p">502:步驟</p>
        <p type="p">504:步驟</p>
        <p type="p">506:步驟</p>
        <p type="p">508:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="889" publication-number="202632346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光子半導體封裝件及其形成方法以及光子裝置</chinese-title>
        <english-title>PHOTONIC SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME AND PHOTONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">G02B6/24</main-classification>
        <further-classification edition="200601120260326B">G02B6/28</further-classification>
        <further-classification edition="200601120260326B">G02B6/34</further-classification>
        <further-classification edition="200601120260326B">G02B1/00</further-classification>
        <further-classification edition="202601120260326B">H10W74/10</further-classification>
        <further-classification edition="202501120260326B">H10F77/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林裕翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括：光子層，光子層包括波導和光柵耦合器，其中波導光學耦合至光柵耦合器；在光子層上方的內連線結構；接合到內連線結構的電子晶粒；以及在電子晶粒上方的支撐件，其中支撐件包括超穎透鏡，其中超穎透鏡光學耦合至光柵耦合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a photonic layer that includes a waveguide and a grating coupler, wherein the waveguide is optically coupled to the grating coupler; an interconnect structure over the photonic layer; an electronic die bonded to the interconnect structure; and a support over the electronic die, wherein the support includes a metalens, wherein the metalens is optically coupled to the grating coupler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12、16、32、62:介電層</p>
        <p type="p">36:光子構件</p>
        <p type="p">20:光學波導/波導</p>
        <p type="p">22:光柵耦合器</p>
        <p type="p">30、60:內連線結構</p>
        <p type="p">34:導電特徵</p>
        <p type="p">38:導電墊</p>
        <p type="p">40:電子晶粒</p>
        <p type="p">44:介電材料</p>
        <p type="p">46:接合層</p>
        <p type="p">50:支撐件</p>
        <p type="p">52:超穎透鏡</p>
        <p type="p">63:導線/導電特徵</p>
        <p type="p">64:波導</p>
        <p type="p">66:導電通孔/通孔</p>
        <p type="p">68:反射器</p>
        <p type="p">70:鈍化層</p>
        <p type="p">72:凸塊下金屬/UBM</p>
        <p type="p">74:電連接件</p>
        <p type="p">100:光學引擎</p>
        <p type="p">110:光訊號</p>
        <p type="p">110’:聚焦訊號</p>
        <p type="p">150:光纖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="890" publication-number="202633275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於以氟為主的電漿蝕刻中使用蝕刻停止層之製造半導體裝置技術</chinese-title>
        <english-title>MANUFACTURING OF SEMICONDUCTOR DEVICES USING AN ETCH STOP LAYER IN FLUORINE-BASED PLASMA ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P14/60</main-classification>
        <further-classification edition="202601120260504B">H10P50/00</further-classification>
        <further-classification edition="202601120260504B">H10P50/24</further-classification>
        <further-classification edition="202601120260504B">H10P50/28</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
        <further-classification edition="200601120260504B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯塔莫　朱哈納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSTAMO, JUHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種對在半導體裝置中所使用的基材製造出高深寬比率(HAR)形貌體之方法及製造半導體裝置的相關方法。在該方法中，於基材(20)表面上形成氧化釔蝕刻停止層(ESL)(11)，及使用以氟為主的電漿(14)在該基材中蝕刻出HAR形貌體(31)，其中該ESL(11)變成曝露至該以氟為主的電漿。該ESL層的氧化釔之氟化造成在該HAR形貌體的底部處形成一氟化膜(15)，特別是，此膜提供對在較高的基材偏壓下之蝕刻氣體有較好的抗性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure concerns a method of producing high aspect ratio (HAR) features for substrates used in semiconductor devices and related method of manufacturing a semiconductor device. In the method, an yttria etch stop layer (ESL) (11) is formed over a substrate (20) surface, and HAR features (31) are etched in the substrate using a fluorine-based plasma (14), wherein the ESL (11) becomes exposed to the fluorine-based plasma. Fluorination of yttria of the ESL layer results in formation of a fluorinated film (15) at the bottom of HAR features, which film provide better resistance to etching gases, in particular, at higher substrate biases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:蝕刻停止層(ESL),ESL，氧化釔ESL，氧化釔ESL膜，Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;膜</p>
        <p type="p">12:重佈線層(RDL)</p>
        <p type="p">14:反應性物種，氟反應性物種，以氟為主的電漿</p>
        <p type="p">15:氟化層或膜，氟化膜，氟化的氧化釔層/膜，氟化的表面層，膜</p>
        <p type="p">20:基材，基材晶圓，基材主體</p>
        <p type="p">23:遮罩層</p>
        <p type="p">31:蝕刻形貌體，形貌體，HAR形貌體，高深寬比率形貌體，經蝕刻的HAR形貌體</p>
        <p type="p">32:側壁</p>
        <p type="p">51:電漿來源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="891" publication-number="202632245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學式生物計量器及其運作方法</chinese-title>
        <english-title>OPTICAL BIOMETER AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260211B">G01N21/17</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明達醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRYSTALVUE MEDICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張彥仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏頌揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, SUNG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊仲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種光學式生物計量器。於光學式生物計量器中，光耦合模組接收光源模組發出的入射光並發出參考光及感測光。參考臂包括光路切換單元。參考臂分別透過第一及第二馬達的傳動於第一及第二軸向上改變光路切換單元的位置來反射參考光以產生第一反射光。感測臂將感測光傳送至待測眼睛，並傳送待測眼睛反射感測光所產生的第二反射光。光耦合模組對第一及第二反射光進行干涉，以產生光干涉信號。檢測模組根據光干涉信號產生關於待測眼睛的檢測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an optical biometer of the application, an optical coupling module receives an incident-light emitted by a light-source and emits a reference-light and a sensing light. The reference arm includes an optical-path switching unit. The reference arm changes the position of the optical-path switching unit in first and second axes respectively through the drive of first and second motors to reflect the reference-light to generate a first reflected-light. The sensing arm transmits the sensing light to an eye, and transmits a second reflected-light generated by the eye reflecting the sensing light. The optical coupling module interferes the first and second reflected-lights to generate an optical interference signal. The detection module generates a detection result about the eye according to the optical interference signal. The reference arm selectively generates a first or second real-time position signal corresponding to a first or second interface of eye through a switching mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟</p>
        <p type="p">S20:步驟</p>
        <p type="p">S30:步驟</p>
        <p type="p">S40:步驟</p>
        <p type="p">S50:步驟</p>
        <p type="p">S60:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="892" publication-number="202631241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133796</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體吸收單元、氣體分離回收裝置及氣體回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">B01D53/02</main-classification>
        <further-classification edition="200601120260424B">B01D53/04</further-classification>
        <further-classification edition="200601120260424B">B01D53/14</further-classification>
        <further-classification edition="200601120260424B">B01D53/48</further-classification>
        <further-classification edition="200601120260424B">B01D53/50</further-classification>
        <further-classification edition="200601120260424B">B01D53/58</further-classification>
        <further-classification edition="200601120260424B">B01D53/62</further-classification>
        <further-classification edition="200601120260424B">B01D53/72</further-classification>
        <further-classification edition="200601120260424B">B01D53/82</further-classification>
        <further-classification edition="200601120260424B">B01D53/96</further-classification>
        <further-classification edition="200601120260424B">B01J20/28</further-classification>
        <further-classification edition="200601120260424B">B01J20/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商則武股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORITAKE CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川原彰広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山恵梨佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, ERIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金井照昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAI, TERUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本揭示中，提供一種特定成分的分離、回收效率得到提高的氣體吸收單元。此處所揭示的氣體吸收單元包括氣體吸收體20、感應加熱裝置、以及發熱體30。發熱體30以與氣體吸收體20的至少一部分相接的方式配置。另外，在本揭示的另一方面，提供一種可效率良好地自混合氣體中分離並回收特定氣體、且能夠實現小型化的氣體分離回收裝置及氣體回收方法。此處所揭示的氣體分離回收裝置100包括：氣體吸收單元120；感應加熱裝置；真空泵136，對氣體吸收單元120內進行減壓；混合氣體供給部110；以及排出管132，排出處理後的氣體。氣體吸收單元120包括藉由所述感應加熱裝置而發熱的發熱體，所述真空泵136與排出管132連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體分離回收裝置</p>
        <p type="p">110:混合氣體供給部</p>
        <p type="p">111:混合氣體供給源</p>
        <p type="p">112:混合氣體供給管</p>
        <p type="p">114:第一閥</p>
        <p type="p">120:氣體吸收單元</p>
        <p type="p">122g:入口</p>
        <p type="p">122h:出口</p>
        <p type="p">124:壓力計</p>
        <p type="p">126:溫度計</p>
        <p type="p">130:處理後氣體排出部</p>
        <p type="p">132:排出管</p>
        <p type="p">134:第二閥</p>
        <p type="p">136:真空泵</p>
        <p type="p">140:殘留氣體排出部</p>
        <p type="p">142:殘留氣體排出管</p>
        <p type="p">144:第三閥</p>
        <p type="p">146:廢氣筒</p>
        <p type="p">148:第一特定氣體濃度計</p>
        <p type="p">150:特定氣體回收部</p>
        <p type="p">152:特定氣體排出管</p>
        <p type="p">154:第四閥</p>
        <p type="p">156:儲氣罐</p>
        <p type="p">157:特定氣體累計流量計</p>
        <p type="p">158:第二特定氣體濃度計</p>
        <p type="p">G&lt;sub&gt;m&lt;/sub&gt;、G&lt;sub&gt;p&lt;/sub&gt;、G&lt;sub&gt;r&lt;/sub&gt;、G&lt;sub&gt;s&lt;/sub&gt;:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="893" publication-number="202631208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>消毒裝置</chinese-title>
        <english-title>DISINFECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">A61L2/08</main-classification>
        <further-classification edition="200601120260417B">A61L9/18</further-classification>
        <further-classification edition="202301120260417B">C02F1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商奈科斯特森斯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTSENSE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰斯蒂　喬瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESTI, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蒂埃　卡梅羅拉法埃萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARTIERE, CARMELO RAFFAELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦萊斯　羅薩里奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALLES, ROSARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種消毒裝置（10），具有至少一發射單元（23），發射單元（23）包含一組三個主發射器（26A、26B、26C）以及至少一次發射器（27）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disinfecting device (10) having at least one emitter unit (23) comprising a set of three of primary emitters (26A, 26B, 26C) and at least one secondary emitter (27).</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:發射單元</p>
        <p type="p">26A、26B、26C:主發射器</p>
        <p type="p">27:次發射器</p>
        <p type="p">28:電子板</p>
        <p type="p">34:光敏塗層</p>
        <p type="p">D1、D2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="894" publication-number="202631142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預防或治療癌症的方法</chinese-title>
        <english-title>METHOD FOR PREVENTING OR TREATING CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/506</main-classification>
        <further-classification edition="200601120260504B">A61K31/505</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　喬青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUYNH, KIEU THANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏雅鈴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昌芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHANG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　明奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, MIEN-CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種在受試者中藉由抑制人類表皮生長因子受體2的絲胺酸激酶活性用於預防或治療癌症的方法，該受試者呈現增加的人類表皮生長因子受體2所介導的活性。本揭露亦提供一種在有其需要的受試者中預防或治療癌症的醫藥組成物的用途，其中，該醫藥組成物包括對人類表皮生長因子受體2具有絲胺酸激酶抑制活性的藥劑及其醫藥上可接受的載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for preventing or treating cancer in a subject who presents an increased human epidermal growth factor receptor 2 (HER2)-mediated activity, through inhibiting a serine kinase activity of HER2. Also provided is a pharmaceutical composition for use in preventing or treating cancer in a subject in need thereof, wherein the pharmaceutical composition includes an agent having a serine kinase inhibition activity against HER2 and a pharmaceutically acceptable carrier thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="895" publication-number="202633065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構、半導體裝置及形成半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260319B">H10B10/00</main-classification>
        <further-classification edition="202601120260319B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峰銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一半導體結構，包括主動區、閘極線、一第一主動區斷點、一第二主動區斷點，以及一隔離結構。主動區沿著一第一方向設置，並沿著與第一方向垂直的一第二方向延伸。閘極線沿著第二方向設置，並沿著第一方向延伸。第一主動區斷點與主動區中之一第一者相交。第二主動區斷點與主動區中之一第二者相交。隔離結構鄰接第一主動區斷點與第二主動區斷點，並沿著第一方向延伸。隔離結構在第一方向上設置於主動區中之第一者與第二者之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes active regions distributed along a first direction and each extending lengthwise along a second direction perpendicular to the first direction, gate lines distributed along the second direction and each extending lengthwise along the first direction, a first active region break intersecting a first one of the active regions, a second active region break intersecting a second one of the active regions, and an isolation structure abutting the first and second active region breaks and extending lengthwise along the first direction. The isolation structure is disposed between the first and second ones of the active regions along the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">20:記憶體巨集/巨集</p>
        <p type="p">30:區</p>
        <p type="p">32:記憶體單元區塊(MCB)</p>
        <p type="p">34:局部I/O區域(LA)</p>
        <p type="p">36:寫入輔助區域(WA)</p>
        <p type="p">38:局部控制電路(LCNT)</p>
        <p type="p">40:寫入控制電路(WCNT)</p>
        <p type="p">42:字元線驅動電路(WLDV)</p>
        <p type="p">44:I/O區塊</p>
        <p type="p">46:全局控制區塊(GCNT)</p>
        <p type="p">48:遠端驅動器邏輯區塊(Fardrv)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="896" publication-number="202631960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於液晶的光閥</chinese-title>
        <english-title>LIQUID CRYSTAL-BASED LIGHT VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C09K19/04</main-classification>
        <further-classification edition="200601120260422B">C09K19/12</further-classification>
        <further-classification edition="200601120260422B">C09K19/30</further-classification>
        <further-classification edition="200601120260422B">C09K19/34</further-classification>
        <further-classification edition="200601120260422B">C09K19/60</further-classification>
        <further-classification edition="200601120260422B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑貝爾　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEBEL, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯威德　蜜克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUMWIEDE, MEIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑諾特　尼歐斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREINERT, NILS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史普瑞　茱莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPRANG, JULIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜賓　瑞秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUFFIN, RACHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修恩費德　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOENEFELD, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦斯格尼　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSGROENE, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包括LC材料之節能光閥及該光閥在用於處理近眼顯示器中之遮擋之空間光調變器中的用途，該節能光閥可在光學透明狀態與不透明狀態之間切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an energy-efficient light valve comprising an LC material which is switchable between an optically transparent state and an opaque state and to the use of the light valve in spatial light modulators for handling occlusion in near-eye displays.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="897" publication-number="202633089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體積體電路</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260421B">H10B51/00</main-classification>
        <further-classification edition="202301120260421B">H10B41/00</further-classification>
        <further-classification edition="202301120260421B">H10B53/00</further-classification>
        <further-classification edition="202501120260421B">H10D1/68</further-classification>
        <further-classification edition="202501120260421B">H10D30/68</further-classification>
        <further-classification edition="202501120260421B">H10D84/80</further-classification>
        <further-classification edition="202501120260421B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥野潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUNO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米内飛翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONAI, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，在包含非揮發性記憶體之半導體積體電路中，充分提高資訊寫入特性以及資訊抹除特性。  &lt;br/&gt;本發明之半導體積體電路包含：第1絕緣閘極場效電晶體，其具有處於電性浮動狀態之第1浮動閘極電極，且具有第1通道導電型；第2絕緣閘極場效電晶體，其具有與第1浮動閘極電極形成為一體、處於電性浮動狀態之第2浮動閘極電極，且具有與第1通道導電型相反之第2通道導電型；及第1電容元件，其電性串聯耦合於第1浮動閘極電極及第2浮動閘極電極，包含鐵電絕緣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:基板</p>
        <p type="p">4:元件分離區域</p>
        <p type="p">5:閘極絕緣膜</p>
        <p type="p">9:層間絕緣膜</p>
        <p type="p">9H:第1貫通孔</p>
        <p type="p">11:配線</p>
        <p type="p">31:n型井區域</p>
        <p type="p">32:p型井區域</p>
        <p type="p">41:槽</p>
        <p type="p">42:埋設構件</p>
        <p type="p">61:第1浮動閘極電極</p>
        <p type="p">62:第2浮動閘極電極</p>
        <p type="p">101:電極(第1電極)</p>
        <p type="p">102:控制閘極電極(第2電極)</p>
        <p type="p">105:鐵電絕緣體</p>
        <p type="p">C1:第1電容元件</p>
        <p type="p">MC:記憶胞</p>
        <p type="p">Qp:第1IGFET(第1絕緣閘極場效電晶體)</p>
        <p type="p">Qn:第2IGFET</p>
        <p type="p">WL:信號線</p>
        <p type="p">X,Y,Z:箭頭/軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="898" publication-number="202632001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>去除ＬＰＳ之植物發酵萃取物之獲得方法、該去除ＬＰＳ之植物發酵萃取物，及其配合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12P1/04</main-classification>
        <further-classification edition="200601120260504B">A61K36/899</further-classification>
        <further-classification edition="201501120260504B">A61K35/74</further-classification>
        <further-classification edition="200601120260504B">A61P37/04</further-classification>
        <further-classification edition="201701120260504B">A61K8/9794</further-classification>
        <further-classification edition="201701120260504B">A61K8/99</further-classification>
        <further-classification edition="200601120260504B">A61Q19/00</further-classification>
        <further-classification edition="201601120260504B">A23L33/105</further-classification>
        <further-classification edition="201601120260504B">A23K10/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商生物醫學研究集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOMEDICAL RESEARCH GROUP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杣源一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMA, GENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杣源一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMA, GENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲川裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河內千恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHCHI, CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於成功製造出自植物發酵萃取物去除LPS之物質，並發現該物質顯示以往之科學常識所無法說明之生物活性，係以此作為背景，其特徵在於，將來自食用植物之素材專門藉由與植物共生之通性厭氣性革蘭氏陰性菌進行發酵，並同時培養該通性厭氣性革蘭氏陰性菌，而備有自所得到之植物發酵萃取物去除LPS之步驟之去除LPS之植物發酵萃取物之獲得方法、藉由該方法而得到之去除LPS之植物發酵萃取物，以及配合有該去除LPS之植物發酵萃取物之配合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="899" publication-number="202631538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔載體的燒製方法</chinese-title>
        <english-title>SINTERING METHOD FOR POROUS CARRIERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/10</main-classification>
        <further-classification edition="200601120260302B">C12M3/08</further-classification>
        <further-classification edition="202601120260302B">C12N1/14</further-classification>
        <further-classification edition="201801120260302B">A01G18/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種多孔載體的燒製方法，經過配料與漿料製備、製粒、陳化處理、熱處理及冷卻後加工後，通過特定材料與工藝生成高孔隙率的多孔載體結構，提升多孔載體性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a sintering method for porous carriers. The method involves steps including material formulation and slurry preparation, granulation, aging treatment, thermal processing, and post-sintering cooling and finishing. By employing specific materials and processing techniques, a porous carrier structure with high porosity is obtained, thereby enhancing the overall performance of the porous carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1~P5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="900" publication-number="202631980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>牛樟樹發酵肥液的製備方法</chinese-title>
        <english-title>METHOD FOR PREPARING LIQUID FERTILIZER FROM CINNAMOMUM KANEHIRAE FERMENTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260211B">C12M1/22</main-classification>
        <further-classification edition="200601120260211B">C12M1/18</further-classification>
        <further-classification edition="202001120260211B">C05F17/20</further-classification>
        <further-classification edition="200601120260211B">B01J20/08</further-classification>
        <further-classification edition="200601120260211B">B01J20/10</further-classification>
        <further-classification edition="200601120260211B">B01J20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種牛樟樹發酵肥液的製備方法，通過發酵牛樟樹枝葉與醣類生成液態肥，生成高養分且環保的液態肥料，不僅提高原料利用率，更擴展了牛樟樹副產品的應用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for preparing liquid fertilizer from Cinnamomum kanehirae fermentation. In this method, branches and leaves of Cinnamomum kanehirae are fermented with saccharides to produce a liquid fertilizer. The resulting product is a high-nutrient and environmentally friendly fertilizer that not only enhances raw material utilization but also increases the value-added applications of Cinnamomum kanehirae by-products.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="901" publication-number="202631138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有MYT1抑制活性之含氮雜環化合物的製劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4745</main-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61K47/32</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綿貫裕介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANUKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋七保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兼子裕規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真貝太規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINKAI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江寺理紗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDERA, RISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其包含以式(1)表示之化合物或其藥學上可容許之鹽或者前述化合物或鹽的藥學上可容許之溶媒合物、以及溶解輔助劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="201px" width="216px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="902" publication-number="202632057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C23C16/455</main-classification>
        <further-classification edition="200601120260428B">C23C16/08</further-classification>
        <further-classification edition="202601120260428B">H10P14/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川有人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, ARITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供可調整膜特性的技術。  &lt;br/&gt;其具有：a)對基板供給含有第1元素與氯之第1氣體的步驟；b)對基板供給含有碘之第2氣體的步驟；c)對基板供給含有第2元素之第3氣體的步驟；d)將a)c)進行X次，於基板形成含有第1元素之第1膜的步驟；與e)將a)b)c)進行Y次，於基板形成含有第1元素與碘之第2膜的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理裝置</p>
        <p type="p">115:晶舟升降器、BE</p>
        <p type="p">121:控制器</p>
        <p type="p">200:晶圓(基板)</p>
        <p type="p">201:處理室</p>
        <p type="p">201a:預備室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:外管</p>
        <p type="p">204:內管</p>
        <p type="p">204a:排氣孔(排氣口)</p>
        <p type="p">206:排氣路徑</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:歧管、MF</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:隔熱板</p>
        <p type="p">219:密封蓋、SC</p>
        <p type="p">220a,220b:O型環</p>
        <p type="p">231:排氣管</p>
        <p type="p">310,320,330,340,510,520,530,540:氣體供給管</p>
        <p type="p">312,322,332,342,512,522,532,542:質量流量控制器(MFC)</p>
        <p type="p">314,324,334,344,514,524,534,544,:閥</p>
        <p type="p">243:APC閥</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">246:真空泵</p>
        <p type="p">410,420,430,440:噴嘴</p>
        <p type="p">410a,420a,430a,440a:氣體供給孔</p>
        <p type="p">255:旋轉軸</p>
        <p type="p">267:旋轉機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="903" publication-number="202632080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔質輸送層及具備其之固體高分子電解質膜型水電解槽</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260422B">C25B9/60</main-classification>
        <further-classification edition="202101120260422B">C25B1/04</further-classification>
        <further-classification edition="202101120260422B">C25B9/00</further-classification>
        <further-classification edition="202101120260422B">C25B11/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳里多股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLIT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金原傳太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMPARA, DENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永野麻衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANO, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢島文枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAJIMA, FUMIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向畠真一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKOBATA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係藉由多孔質輸送層及具備上述多孔質輸送層之PEM型水電解槽以提供兼具導電性與耐蝕性之長期可靠性優異之低成本的多孔質輸送層及具備上述多孔質輸送層之固體高分子電解質膜(PEM)型水電解槽，其中，該多孔質輸送層係具備有：由導電性材料所構成之多孔質基體；形成於構成上述多孔質基體之導電性材料表面上之包含金屬氧化物的第1被膜；及形成於上述第1被膜上之包含貴金屬或具有導電性之貴金屬氧化物的第2被膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="904" publication-number="202632879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低雜訊放大器電路、射頻系統與使用低雜訊放大器電路放大射頻訊號的方法</chinese-title>
        <english-title>LOW-NOISE AMPLIFIER CIRCUIT, RADIOFREQUENCY SYSTEM, AND METHOD FOR AMPLIFYING A RADIO FREQUENCY SIGNAL USING A LOW-NOISE AMPLIFIER CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H03F1/26</main-classification>
        <further-classification edition="200601120251201B">H03F3/195</further-classification>
        <further-classification edition="200601120251201B">H04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳妍臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬哈賽斯　庫諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHASETH, KUNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝協宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIEH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種放大器電路包含一輸入埠、一核心放大級，包含一第一電晶體和一第二電晶體，用以形成一疊接放大器拓撲。一輸出埠，耦接至第一電晶體的一第一汲極和第二電晶體的一第二汲極。一第一電容器，耦接在輸入埠和一節點之間。一第一電感器，耦接在一閘極偏壓電壓和節點之間，以及一第二電感器，耦接在節點和第一電晶體的一第一閘極之間。一第二電容器，耦接在節點和第二電晶體的一第二閘極之間。一電阻器，耦接在輸出埠和第二電晶體的第二閘極之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An amplifier circuit includes an input port, a first transistor and a second transistor that form a cascode topology. An output port is coupled to a first drain of the first transistor and a second drain of the second transistor. A first capacitor is coupled between the input port and a node. A first inductor is coupled between a gate bias voltage and the node, and a second inductor is coupled between the node and a first gate of the first transistor. A second capacitor is coupled between the node and a second gate of the second transistor. A resistor is coupled between the output port and the second gate of the second transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:差動LNA電路</p>
        <p type="p">304,306:輸入匹配網路</p>
        <p type="p">302:核心放大級</p>
        <p type="p">316,322,324,330:電容器</p>
        <p type="p">318,320,326,328:電感器</p>
        <p type="p">310,314:NMOS電晶體</p>
        <p type="p">308,312:PMOS電晶體</p>
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:電源電壓</p>
        <p type="p">RF&lt;sub&gt;in&lt;/sub&gt;:輸入訊號/射頻輸入訊號/輸入節點</p>
        <p type="p">RF&lt;sub&gt;out&lt;/sub&gt;:輸出/輸出端/差動輸出端</p>
        <p type="p">R1,R2:偏壓電阻器/電阻器</p>
        <p type="p">V&lt;sub&gt;G&lt;/sub&gt;:閘極偏壓電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="905" publication-number="202632732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高功率開關並聯電容架構</chinese-title>
        <english-title>HIGH POWER SWITCHED SHUNT CAPACITOR ARCHITECTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">H01J37/32</main-classification>
        <further-classification edition="200601120260416B">H03H7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐文　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OWEN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫姆　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUMOU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文件中所述的實施例涉及一種設備，包括第一跡線、電氣耦合至第一跡線的電容器，以及電氣耦合至該電容器的平衡變壓器。在一個實施例中，第一電晶體和第一二極體電氣跡線至平衡變壓器的第一電感器，第二電晶體和第二二極體電氣跡線至平衡變壓器的第二電感器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes a first trace, a capacitor electrically coupled to the first trace, and a balanced transformer electrically coupled to the capacitor. In an embodiment, a first transistor and a first diode are electrically coupled to a first inductor of the balanced transformer, and a second transistor and a second diode are electrically coupled to a second inductor of the balanced transformer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">108:接地線</p>
        <p type="p">110:匹配</p>
        <p type="p">112:電路板</p>
        <p type="p">114:輸入</p>
        <p type="p">115:第二階段</p>
        <p type="p">117:第一階段</p>
        <p type="p">118:輸出</p>
        <p type="p">121:LC模組</p>
        <p type="p">122:開關並聯電容器組</p>
        <p type="p">123:開關並聯電容器組</p>
        <p type="p">124:變容器</p>
        <p type="p">125:開關並聯電容器組</p>
        <p type="p">126:開關並聯電容器組</p>
        <p type="p">127:開關並聯電容器組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="906" publication-number="202631670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於條件性活化受體訊息傳導之標的結合分子</chinese-title>
        <english-title>TARGET-BINDING MOLECULES FOR CONDITIONALLY ACTIVATED RECEPTOR SIGNALING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07K16/46</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝呂木暁彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOROKI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　思亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, SEE LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種或多種標的結合分子，每種包括一結合結構域[S1]及一結合結構域[S2]，其各自具有與一支架蛋白結合之能力；一結合結構域[R1]，其具有與一第一受體蛋白結合之能力；以及一結合結構域[R2]，其具有與一第二受體蛋白結合之能力。標的結合分子在與一支架蛋白結合的條件下，具有誘導一受體複合物的受體訊息傳導之能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to one or more target-binding molecules, each comprising a binding domain [S1] and a binding domain [S2] that are each capable of binding to a scaffold protein, a binding domain [R1] that is capable of binding to a first receptor protein, and a binding domain [R2] that is capable of binding to a second receptor protein. The target-binding molecule is capable of inducing receptor signaling of a receptor complex, conditioned upon binding to a scaffold protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="907" publication-number="202633248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱電轉換元件、及配管之斷熱構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260422B">H10N10/17</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝上美香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOKAMI, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木一聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之熱電轉換元件1具備：坯體2，其包含絕緣性材料；第1導電構件3，其包含金屬；及第2導電構件4，其含有碳材料作為導電性材料，且與第1導電構件3電性連接。第1導電構件3於表面具有包含能夠形成氧化覆膜之純金屬之金屬層32、或第1導電構件3包含合金。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱電轉換元件</p>
        <p type="p">2:坯體</p>
        <p type="p">3:第1導電構件</p>
        <p type="p">3A,4A:第1連接部</p>
        <p type="p">3B,4B:第2連接部</p>
        <p type="p">3C,4C:本體部</p>
        <p type="p">4:第2導電構件</p>
        <p type="p">10:接合材料</p>
        <p type="p">S1:坯體之一面</p>
        <p type="p">S2:坯體之另一面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="908" publication-number="202633186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括互連結構之標準胞元</chinese-title>
        <english-title>STANDARD CELL INCLUDING INTERCONNECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">H10D89/10</main-classification>
        <further-classification edition="202001120260102B">G06F30/392</further-classification>
        <further-classification edition="202001320260102B">G06F113/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈正救</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, JEONGGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNGHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林載炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JAEHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金柄成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNGSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千寬永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN, KWANYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種標準胞元及一種製造其之方法。該標準胞元包括至少一前側互連層及至少一背側互連層。每一層可靈活地組配來充當一電力軌或一信號軌。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a standard cell and a manufacturing method thereof. The standard cell includes at least one front side interconnection layer and at least one back side interconnection layer. Each layer can be flexibly configured to act as either a power rail or a signal rail.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:標準胞元</p>
        <p type="p">ACT1:第一主動區</p>
        <p type="p">ACT2:第二主動區</p>
        <p type="p">BML:背側互連層</p>
        <p type="p">CA1:上源極/汲極接點、源極/汲極接點</p>
        <p type="p">CA2:下源極/汲極接點</p>
        <p type="p">CB1:上閘極接點</p>
        <p type="p">CB2:下閘極接點</p>
        <p type="p">DL:虛設閘極線</p>
        <p type="p">FML:前側互連層</p>
        <p type="p">GL:閘極線</p>
        <p type="p">M11:第一前側互連層</p>
        <p type="p">M12:第二前側互連層</p>
        <p type="p">M13:第三前側互連層</p>
        <p type="p">M14:第四前側互連層</p>
        <p type="p">M15:第五前側互連層</p>
        <p type="p">M16:第六前側互連層</p>
        <p type="p">M17:第七前側互連層</p>
        <p type="p">M18:第八前側互連層</p>
        <p type="p">M21:第一背側互連層</p>
        <p type="p">M22:第二背側互連層</p>
        <p type="p">M23:第三背側互連層</p>
        <p type="p">M24:第四背側互連層</p>
        <p type="p">VA1:上通孔</p>
        <p type="p">VA2:下通孔</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="909" publication-number="202632234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測量裝置、測量方法、半導體裝置之製造方法、及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01J3/45</main-classification>
        <further-classification edition="200601120260302B">G01B11/06</further-classification>
        <further-classification edition="202201120260302B">G01J5/0801</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益川和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUKAWA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本隆希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋拓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古林愛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUBAYASHI, AI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可減少利用光學干涉下之厚度或溫度測量之誤差之測量裝置。實施形態之測量裝置包含光源、分光器、記憶裝置及處理器。記憶裝置記憶包含厚度或溫度之測定值與厚度或溫度之真值之第1修正表格、以及包含相位角之測定值與厚度或溫度之真值之第2修正表格。處理器執行由分光器測量出之分光光譜波形之傅裡葉轉換；基於傅裡葉轉換後之波形之振幅峰值位置，算出測量對象物之厚度或溫度作為第1測定值，基於傅裡葉轉換後之波形之振幅峰值位置，算出相位展開前之相位角作為第2測定值；自第1及第2修正表格分別抽選對應於第1及第2測定值之複數個第1及第2真值候補；將基於抽選出之複數個第1及第2真值候補中相同或最接近之第1及第2真值候補之值，作為測量對象物之厚度或溫度而輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST21~ST29:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="910" publication-number="202632658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含讀取連接埠和寫入連接埠的位元單元</chinese-title>
        <english-title>BIT CELL INCLUDING READ PORT AND WRITE PORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260210B">G11C11/419</main-classification>
        <further-classification edition="200601120260210B">G11C11/413</further-classification>
        <further-classification edition="200601120260210B">G11C8/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴智元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敎旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包括讀取埠和寫入埠的位元單元，包括多個主動區域，在第一方向上彼此平行間隔開並在垂直於第一方向的第二方向上延伸；以及多個閘極，在第二方向上彼此平行間隔開，在第一方向上延伸，並設置在多個主動區域中的至少一個以各自形成電晶體。讀取埠包括讀取傳輸電晶體和讀取下拉電晶體。寫入埠包括第一傳輸電晶體、第二傳輸電晶體、第一下拉電晶體、第二下拉電晶體、第一上拉電晶體、以及第二上拉電晶體。讀取傳輸電晶體、讀取下拉電晶體、第一傳輸電晶體、以及第一下拉電晶體共享一個主動區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bit cell including a read port and a write port, comprises a plurality of active regions spaced apart from each other in parallel in a first direction and extending in a second direction perpendicular to the first direction; and a plurality of gates spaced apart from each other in parallel in the second direction, extending in the first direction, and arranged in at least one of the plurality of active regions to each form a transistor. The read port includes a read pass transistor and a read pull-down transistor. The write port includes a first pass transistor, a second pass transistor, a first pull-down transistor, a second pull-down transistor, a first pull-up transistor, and a second pull-up transistor. The read pass transistor, the read pull-down transistor, the first pass transistor, and the first pull-down transistor share one active region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BC:位元單元</p>
        <p type="p">N1:第一節點/第一奈米片</p>
        <p type="p">N2:第二節點/第二奈米片</p>
        <p type="p">PD1:第一下拉電晶體</p>
        <p type="p">PD2:第二下拉電晶體</p>
        <p type="p">PG1:第一傳輸電晶體</p>
        <p type="p">PG2:第二傳輸電晶體</p>
        <p type="p">PU1:第一上拉電晶體</p>
        <p type="p">PU2:第二上拉電晶體</p>
        <p type="p">RBL:讀取位元線</p>
        <p type="p">RBL_CAP:</p>
        <p type="p">RP:讀取埠</p>
        <p type="p">RPD:讀取下拉電晶體</p>
        <p type="p">RPG:讀取傳輸電晶體</p>
        <p type="p">RWL:讀取字元線</p>
        <p type="p">RVSS:接地電壓/讀取接地電壓線</p>
        <p type="p">VDD:電源供應電壓/寫入電源供應電壓線</p>
        <p type="p">VSS:接地電壓/寫入接地電壓線</p>
        <p type="p">WBL、WBLB:位元線</p>
        <p type="p">WP:寫入埠</p>
        <p type="p">WWL:寫入字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="911" publication-number="202633167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括用於側通孔結構的背面接觸塞的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING BACKSIDE CONTACT PLUG FOR SIDE VIA STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10W20/42</further-classification>
        <further-classification edition="202601120260424B">H10W10/17</further-classification>
        <further-classification edition="202501120260424B">H10D30/01</further-classification>
        <further-classification edition="202501120260424B">H10D30/43</further-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="202501120260424B">H10D62/13</further-classification>
        <further-classification edition="202601120260424B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WONKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛宗珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置，包括：第一源極/汲極區；第一源極/汲極區上方的第二源極/汲極區；連接到第二源極/汲極區的側通孔結構；第一源極/汲極區上的第一背面接觸塞；側通孔結構上的第二背面接觸塞；第一背面接觸塞上的第一背面金屬線；第二背面接觸塞上的第二背面金屬線；以及第二背面接觸塞的側表面上的第一深溝槽隔離結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device which includes: a 1&lt;sup&gt;st&lt;/sup&gt; source/drain region; a 2&lt;sup&gt;nd&lt;/sup&gt; source/drain region above the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region; a side via structure connected to the 2&lt;sup&gt;nd&lt;/sup&gt; source/drain region; a 1&lt;sup&gt;st&lt;/sup&gt; backside contact plug on the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region; a 2&lt;sup&gt;nd&lt;/sup&gt; backside contact plug on the side via structure; a 1&lt;sup&gt;st&lt;/sup&gt; backside metal line on the 1&lt;sup&gt;st&lt;/sup&gt; backside contact plug; a 2&lt;sup&gt;nd&lt;/sup&gt; backside metal line on the 2&lt;sup&gt;nd&lt;/sup&gt; backside contact plug; and a 1&lt;sup&gt;st&lt;/sup&gt; deep trench isolation structure on a side surface of the 2&lt;sup&gt;nd&lt;/sup&gt; backside contact plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體胞</p>
        <p type="p">11,12:堆疊半導體裝置</p>
        <p type="p">101:基礎層</p>
        <p type="p">110,120:主動圖案</p>
        <p type="p">113,113',123,123':源極/汲極區</p>
        <p type="p">117:側通孔結構</p>
        <p type="p">150:閘極結構</p>
        <p type="p">I-I',II-II':線</p>
        <p type="p">D1,D2,D3:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="912" publication-number="202631705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕氣硬化性樹脂組成物、電子零件用接著劑、硬化體、電子零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08F2/44</main-classification>
        <further-classification edition="200601120260417B">C08G18/10</further-classification>
        <further-classification edition="200601120260417B">C08G59/06</further-classification>
        <further-classification edition="200601120260417B">C09J175/04</further-classification>
        <further-classification edition="200601120260417B">C08K5/053</further-classification>
        <further-classification edition="200601120260417B">C08K5/103</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河田晋治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWADA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIWARA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之濕氣硬化性樹脂組成物，其係包含濕氣硬化性胺酯樹脂（urethane resin）（A）之濕氣硬化性樹脂組成物，上述濕氣硬化性胺酯樹脂（A）係作為多元醇之至少多元醇A與多元醇B藉由聚異氰酸酯被預聚物化而成，上述多元醇A係線性多元醇，上述多元醇B係具有支鏈之多元醇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="913" publication-number="202633385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置製造方法及半導體裝置</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P74/00</main-classification>
        <further-classification edition="200601120260423B">H03K17/082</further-classification>
        <further-classification edition="202601120260423B">H10P58/00</further-classification>
        <further-classification edition="202601120260423B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田島英幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJIMA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的實施例涉及半導體裝置的製造方法以及半導體裝置。提供了一種能夠提高過電流檢測的精度的半導體裝置的製造方法。該半導體裝置的製造方法包括半導體晶圓測試程序，該半導體晶圓測試程序包括：第一測試程序，用於確定由於在製造半導體晶圓時的製造變化引起的副本電阻器的電阻變化率；以及設定程序，用於基於在第一測試程序中所確定的電阻變化率來確定參考電流的變化值，並且設定電流電路的電流值以減小變化值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device capable of improving the accuracy of overcurrent detection is provided. The manufacturing method of a semiconductor device includes a semiconductor wafer testing process which includes a first testing process to determine the resistance variation rate of the replica resistor due to manufacturing variations when manufacturing the semiconductor wafer, and a setting process to determine the variation value of the reference current based on the resistance variation rate determined in the first testing process and set the current value of the current circuit to reduce the variation value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">ASS:半導體裝置組裝程序</p>
        <p type="p">FTS:最終測試程序</p>
        <p type="p">WPS:半導體晶圓製造程序</p>
        <p type="p">WTS:半導體晶圓測試程序</p>
        <p type="p">WTS1:第一測試程序</p>
        <p type="p">WTS2:第二測試程序</p>
        <p type="p">WTS3:第三測試程序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="914" publication-number="202632840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有超穎透鏡之無線充電裝置</chinese-title>
        <english-title>WIRELESS CHARGING DEVICE WITH META-LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260316B">H02J50/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美泰萬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAONE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江岳峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YUEH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種無線充電裝置，包含第一相位線圈、第二相位線圈及第三相位線圈，其中各個相位線圈具有相位差，其中第一相位線圈、第二相位線圈與第三相位線圈配置於一平面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a wireless charging device including a first phase coil, a second phase coil and a third phase coil, wherein each phase coil has a phase difference, wherein the first phase coil, the second phase coil and the third phase coil are arranged at a plane</p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:第一相位線圈</p>
        <p type="p">P2:第二相位線圈</p>
        <p type="p">P3:第三相位線圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="915" publication-number="202633282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P36/00</main-classification>
        <further-classification edition="202601120260423B">H10P10/00</further-classification>
        <further-classification edition="202601120260423B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中谷公彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATANI, KIMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田翔馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, SHOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濵田啓太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, KEITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供針對基板有形成凹部的表面中，可對所需區域施行選擇性處理的技術。  &lt;br/&gt;本發明之解決手段係包括有：(a)準備具有第1區域與第2區域之基板的步驟，該第1區域係構成凹部外側的表面，且鄰接上述凹部的開口，並由第1封端進行封端，該第2區域係構成上述凹部的內表面，且由上述第1封端進行封端；(b)藉由將上述基板暴露於含有會與上述第1封端產生反應之液體的第1處理液中，依使上述第1區域的上述第1封端密度較小於上述第2區域的上述第1封端密度之方式，除去上述第1區域之上述第1封端的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:晶圓(基板)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="916" publication-number="202633244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置、電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260421B">H10K50/842</main-classification>
        <further-classification edition="202301120260421B">H10K59/10</further-classification>
        <further-classification edition="202301120260421B">H10K71/50</further-classification>
        <further-classification edition="202301120260421B">H10K71/80</further-classification>
        <further-classification edition="202301120260421B">H10K77/10</further-classification>
        <further-classification edition="200601120260421B">G09F9/30</further-classification>
        <further-classification edition="200601120260421B">H05B33/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村肇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種框架區域小的顯示裝置。提供一種顯示裝置，包括：顯示面板；支撐基板；以及相對基板，其中，顯示面板包括第一面及第二面，第一面包括第一區域及第二區域，在第一區域中，支撐基板與顯示面板黏合，在第二區域中，具有與支撐基板相同的材質的基板不與顯示面板黏合，並且，相對基板在第二區域中與顯示面板黏合。在顯示裝置的第二區域中，沒有設置相當於支撐基板的基板。因此，在彎折時，可以減小曲率半徑。由此，可以縮小顯示裝置的框架區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">201:顯示面板</p>
        <p type="p">202:相對基板</p>
        <p type="p">203:支撐基板</p>
        <p type="p">204:端部</p>
        <p type="p">P:端部</p>
        <p type="p">Q:端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="917" publication-number="202632491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、資訊顯示用的方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G06F7/10</main-classification>
        <further-classification edition="201901120260504B">G06N20/00</further-classification>
        <further-classification edition="200601120260504B">B25J9/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>流石凪彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASUGA, NAGISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋祐輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資訊處理裝置具備：檢測部，藉由將關於1個以上的對象物的圖像之資訊輸入至學習模型，來取得關於對象物的1個以上的候選之資訊作為推論結果；條件設定部，設定用以選定1個以上的候選當中要作為顯示對象的候選之條件；及顯示控制部，根據條件與推論結果，來顯示關於滿足條件的候選之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人</p>
        <p type="p">15:手部</p>
        <p type="p">20:圖像處理裝置、資訊處理裝置</p>
        <p type="p">21:處理器</p>
        <p type="p">22:記憶部</p>
        <p type="p">23,43:顯示部</p>
        <p type="p">24:操作部</p>
        <p type="p">40:教示操作盤</p>
        <p type="p">50:機器人控制裝置</p>
        <p type="p">70:視覺感測器</p>
        <p type="p">100:機器人系統</p>
        <p type="p">121:檢測部</p>
        <p type="p">122:檢測判定部</p>
        <p type="p">123:顯示判定部</p>
        <p type="p">124:顯示控制部</p>
        <p type="p">125:檢測條件設定部、條件設定部</p>
        <p type="p">126:顯示條件設定部、條件設定部</p>
        <p type="p">130:學習部</p>
        <p type="p">131:學習模型</p>
        <p type="p">151:動作控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="918" publication-number="202631787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08G59/24</main-classification>
        <further-classification edition="200601120260416B">C08G59/40</further-classification>
        <further-classification edition="200601120260416B">C08L63/00</further-classification>
        <further-classification edition="200601120260416B">C08K5/3445</further-classification>
        <further-classification edition="200601120260416B">C08K9/06</further-classification>
        <further-classification edition="202601120260416B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阪內啓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAUCHI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供可同時達成翹曲抑制、縫隙或電極間的間隙的填充性提高以及密著性提高的樹脂組成物。一種樹脂組成物，其含有(A1)由下述式(a-3)表示的環氧樹脂、(A2)具有芳香族骨架的液狀環氧樹脂、(B)硬化促進劑和(C)無機填充材料，其中(A1)成分相對於(A2)成分的質量比[(A1)成分/(A2)成分]為0.1~3.5。  &lt;br/&gt;&lt;img align="absmiddle" height="91px" width="455px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　式中，  &lt;br/&gt;　　環Ar各自獨立地表示可具有選自碳原子數1~10的烷基和碳原子數1~10的芳基的取代基的碳原子數6~10的芳香族碳環，  &lt;br/&gt;　　X表示碳原子數1~20的伸烷基，  &lt;br/&gt;　　Y各自獨立地表示碳原子數1~10的伸烷基，  &lt;br/&gt;　　m1和m2各自獨立地表示0~20的整數、m1和m2的至少一者為1以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="919" publication-number="202631890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱聚矽氧組成物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE SILICONE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L83/04</main-classification>
        <further-classification edition="200601120260420B">C08L83/07</further-classification>
        <further-classification edition="200601120260420B">C08K3/34</further-classification>
        <further-classification edition="200601120260420B">C08K3/28</further-classification>
        <further-classification edition="200601120260420B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嫣然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郟宇飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, YUFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種導熱組成物，其包含：(A)具有平均式(I)且在25℃下具有20至1000 mPa•s之動態黏度的有機聚矽氧烷；(B1)含有烷氧基矽基之有機聚矽氧烷；(C)以導熱組成物重量計92至97 wt%之導熱填料混合物，其包含：(C1) 30至60 wt%之具有25至50 µm之D50的碳化矽粒子；(C2) 20至40 wt%之具有0.5至5 µm之D50的第二導熱填料，且包含(C2a)具有0.5至5 µm之D50的氮化鋁粒子，(C2a)與(C2)之重量比係0.4至1；及(C3) 10至30 wt%之具有0.1至0.45 µm之D50的氧化鋅粒子。一種電子物品，其包含該導熱組成物。電子物品包含該導熱組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermally conductive composition comprises (A) an organopolysiloxane having an average formula (I) and a dynamic viscosity of 20 to 1000 mPa•s at 25°C; (B1) an organopolysiloxane containing an alkoxysilyl group; (C) 92 to 97 wt%, based on the thermally conductive composition weight, a thermally conductive filler mixture comprising: (C1) 30 to 60 wt% of silicon carbide particles having a D50 of 25 to 50 µm; (C2) 20 to 40 wt% of a second thermally conductive filler having a D50 of 0.5 to 5 µm and comprising (C2a) aluminum nitride particles having a D50 of 0.5 to 5 µm at a weight ratio of (C2a) to (C2) of 0.4 to 1; and (C3) 10 to 30 wt% of zinc oxide particles having a D50 of 0.1 to 0.45 µm. An electronic article comprising the thermally conductive composition. An electronic article comprises the thermally conductive composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="920" publication-number="202631893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱聚矽氧組成物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE SILICONE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L83/05</main-classification>
        <further-classification edition="200601120260420B">C08L83/07</further-classification>
        <further-classification edition="200601120260420B">C08K3/22</further-classification>
        <further-classification edition="200601120260420B">C08K3/34</further-classification>
        <further-classification edition="200601120260420B">C08K7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嫣然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種導熱組成物，其包含：(A)具有平均式(I)且在25℃下具有20至1000 mPa•s之動態黏度的有機聚矽氧烷；(B1)含有烷氧基矽基之有機聚矽氧烷；(C)大於90至96.5 wt%之導熱填料混合物，其包含：(C1) 10至60 wt%之具有70至150 µm之D50的碳化矽粒子；(C2) 20至65 wt%之具有1至50 µm之D50的碳化矽粒子，其包含(C2a)具有1至5 µm之D50的碳化矽粒子，(C2a)與(C2)之重量比係0.3至1；其中(C1)及(C2)之濃度係65 wt%或更高；及(C3) 10至30 wt%之具有0.1至0.5 µm之D50的氧化鋅粒子；所有wt%係以該組成物之重量計。本發明亦關於一種電子物品，其包含該組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermally conductive composition comprises (A) an organopolysiloxane having an average formula (I) and a dynamic viscosity of 20 to 1000 mPa•s at 25°C; (B1) an organopolysiloxane containing an alkoxysilyl group; (C) greater than 90 to 96.5 wt% of a thermally conductive filler mixture comprising: (C1) 10 to 60 wt% of silicon carbide particles having a D50 of 70 to 150 µm; (C2) 20 to 65 wt% of silicon carbide particles having a D50 of 1 to 50 µm and comprising (C2a) silicon carbide particles with a D50 of 1 to 5 µm, at a weight-to-weight ratio of (C2a) to (C2) is 0.3 to 1; where the concentration of (C1) and (C2) is 65 wt% or more; and (C3) 10 to 30 wt% of zinc oxide particles having a D50 of 0.1 to 0.5 µm; wt% all based on the weight of the composition. An electronic article comprises the composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="921" publication-number="202633462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有分離接合層之接合元件與形成方法</chinese-title>
        <english-title>BONDED DEVICE HAVING SPLIT BONDING LAYER AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W70/20</main-classification>
        <further-classification edition="202601120260423B">H10W70/01</further-classification>
        <further-classification edition="202601120260423B">H10W40/25</further-classification>
        <further-classification edition="202601120260423B">H10W40/20</further-classification>
        <further-classification edition="202601120260423B">H10P10/00</further-classification>
        <further-classification edition="202601120260423B">H10P14/22</further-classification>
        <further-classification edition="202601120260423B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里許南　希達司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SIDDARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉克　麥可派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUDZIK, MICHAEL PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成接合元件的方法。該方法可能包括提供載體基板，在載體基板的第一表面上形成用於與元件基板接合的第一接合層，以及在大於600℃的溫度下對第一接合層進行退火。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a bonded device. The method may include providing a carrier substrate, forming, on a first surface of the carrier substrate, a first bonding layer for bonding to a device substrate, and annealing the first bonding layer at a temperature of greater than 600 º C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:元件</p>
        <p type="p">102:載體基板</p>
        <p type="p">104:第一接合層</p>
        <p type="p">106:第二接合層</p>
        <p type="p">108:元件基板/第二接合層</p>
        <p type="p">110:背側區域</p>
        <p type="p">112:半導體元件</p>
        <p type="p">114:絕緣材料</p>
        <p type="p">116:前側區域</p>
        <p type="p">118:佈線</p>
        <p type="p">120:外表面</p>
        <p type="p">122:內表面</p>
        <p type="p">124:下表面</p>
        <p type="p">126:內部介面</p>
        <p type="p">132:熱傳導層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="922" publication-number="202631614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件之製造方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">C07D413/06</further-classification>
        <further-classification edition="200601120260504B">C07D403/06</further-classification>
        <further-classification edition="200601120260504B">C07D495/04</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">C07D209/18</further-classification>
        <further-classification edition="200601120260504B">C07D209/08</further-classification>
        <further-classification edition="202301120260504B">H10K30/30</further-classification>
        <further-classification edition="202601120260504B">H10K39/32</further-classification>
        <further-classification edition="202301120260504B">H10K85/20</further-classification>
        <further-classification edition="202301120260504B">H10K85/60</further-classification>
        <further-classification edition="202501120260504B">H10F39/18</further-classification>
        <further-classification edition="202301120260504B">H10K30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姉帯勇人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANETAI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種在接收到綠紅色光時的量子效率的電場強度依賴性小的光電轉換元件。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含式（1）所表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="261px" width="389px" file="ed10066.JPG" alt="ed10066.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="923" publication-number="202631972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鹼性組成物、其用途及用於清潔包含鈷及銅之基板之方法</chinese-title>
        <english-title>ALKALINE COMPOSITION, ITS USE AND A PROCESS FOR CLEANING SUBSTRATES COMPRISING COBALT AND COPPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C11D7/26</main-classification>
        <further-classification edition="200601120260420B">C11D7/34</further-classification>
        <further-classification edition="200601120260420B">C11D7/32</further-classification>
        <further-classification edition="200601120260420B">C11D7/50</further-classification>
        <further-classification edition="200601120260420B">C11D1/66</further-classification>
        <further-classification edition="200601120260420B">C09G1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　米夏埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUTER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里施胡特　薩賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRISCHHUT, SABINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　民河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢仁海德　伯恩哈德　賽巴斯欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIRENHEIDE, BERNHARD SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙允喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾斯　薩賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRTH, SABINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波依科　芙蘿狄米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYKO, VOLODYMYR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安傑哈德特　納迪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGELHARDT, NADINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里普　安卓亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLIPP, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈美卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, MEI CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明亦關於一種用於清潔包含i）銅或銅合金及ii）鈷或鈷合金之基板之鹼性組成物，該組成物包含：  &lt;br/&gt;a）至少一種選自以下之pH調節劑：二甘醇胺、4,4-二乙氧基-N,N-二甲基-1-丁胺、3-二甲基胺基丙-1-醇、二甲基胺基乙氧基乙醇、N,N-二甲基異丙醇胺、乙基乙醇胺、N-甲基二乙醇胺、2-(2-(甲基胺基)乙氧基)乙醇、3-(甲基胺基)丙烷-1,2-二醇、2-[2-[2-(2-甲氧基乙氧基)乙氧基]乙氧基]乙胺、2-[2-(2-胺基乙氧基)-乙氧基]-乙醇、N-丁基二乙醇胺、二異丙醇胺、N-甲基二異丙醇胺、單乙醇胺、3-二甲基胺基-1,2-丙二醇、2-胺基-1-丁醇、2-(2-(2-(2-胺基乙氧基)乙氧基)乙氧基)乙醇、脯氨醇、1-甲基-2-吡咯烷甲醇、1-甲基-2-吡咯烷甲醇、1-甲基-3-吡咯烷醇、2-胺基-2-甲基-1-丙醇、N,N-二甲基乙醇胺、丁基乙醇胺、二乙基乙醇胺、3-甲氧基丙胺、4-(2-羥乙基)嗎啉、4-(二乙基胺基)環己醇、2-胺基-2-甲基-1,3-丙二醇或二異丙胺；  &lt;br/&gt;b）至少一種錯合劑，其選自具有至少二個磺酸或羧酸基團之C&lt;sub&gt;2&lt;/sub&gt;至C&lt;sub&gt;12&lt;/sub&gt;烴；  &lt;br/&gt;c）至少一種具有≥1000 g/mol之重量平均分子量之聚合物分散劑；及  &lt;br/&gt;d）包含水之溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The presently claimed invention relates to an alkaline composition for cleaning a substrate comprising i) copper or copper alloy and ii) cobalt or cobalt alloy, the composition comprising: &lt;br/&gt;a) at least one pH adjustor selected from diglycolamine, 4,4-diethoxy-N,N-dimethyl-1-butanamine, 3-dimethylaminopropan-1-ol, dimethylaminoethoxyethanol, N,N-dimethylisopropanolamine, ethylethanolamine, N-methyldiethanolamine, 2-(2-(methylamino)ethoxy)ethanol, 3-(methylamino)propane-1,2-diol, 2-[2-[2-(2-methoxy¬ethoxy)ethoxy]ethoxy]ethylamine, 2-[2-(2-aminoethoxy)-ethoxy]-ethanol, N-butyldiethanolamine, diisopropanolamine, N-methyldiisopropanolamine, monoethanolamine, 3-dimethylamino-1,2-propandiol, 2-amino-1-butanol, 2-(2-(2-(2-aminoethoxy)ethoxy)ethoxy)ethanol, prolinol, 1-methyl-2-pyrrolidine¬methanol, 1-methyl-2-pyrrolidinemethanol, 1-methyl-3-pyrrolidinol, 2-amino-2-methyl-1-propanol, N,N-dimethylethanolamine, butylethanolamine, diethylethanolamine, 3-methoxypropylamine, 4-(2-hydroxyethyl)morpholine, 4-(dimethylamino)cyclohexanol, 2-amino-2-methyl-1,3-propanediol, or diisopropylamine; &lt;br/&gt;b) at least one complexing agent selected from C&lt;sub&gt;2&lt;/sub&gt; to C&lt;sub&gt;12&lt;/sub&gt; hydrocarbon having at least two sulfonic acid or carboxylic acid groups; &lt;br/&gt;c) at least one polymeric dispersing agent having a weight average molecular weight ≥ 1000 g/mol; and &lt;br/&gt;d) a solvent comprising water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="924" publication-number="202631077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學式生物計量器及其運作方法</chinese-title>
        <english-title>OPTICAL BIOMETER AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251205B">A61B3/10</main-classification>
        <further-classification edition="200601120251205B">G01N21/45</further-classification>
        <further-classification edition="200601120251205B">G02B6/26</further-classification>
        <further-classification edition="200601120251205B">G02B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明達醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRYSTALVUE MEDICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張彥仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡哲良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHE-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙軒毫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, HSUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊仲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本發明揭示的光學式生物計量器中，光源模組發出入射光；光耦合模組接收入射光並分別發出參考光及感測光；可切換的參考臂反射參考光以產生第一反射光；感測光受待測眼睛的特定界面反射而產生第二反射光；光耦合模組對第一反射光及第二反射光進行干涉，以產生光干涉信號；檢測模組根據光干涉信號產生關於待測眼睛的檢測結果。當射入可切換的參考臂的參考光未落在對應於待測眼睛的特定界面的預設參考臂位置時，參考光的光程藉由執行於光軸方向上的平移機制進行調整，致使參考光能夠落在預設參考臂位置上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an optical biometer of the application, a light source module emits an incident light; an optical coupling module receives the incident light and emits a reference light and a sensing light; a switchable reference-arm reflects the reference light to generate a first reflected-light; the sensing light is reflected by a specific interface of an eye to generate a second reflected-light; the optical coupling module interferes with the first and second reflected-lights to generate an optical interference signal; the detection module generates a detection result related to the eye based on the optical interference signal. When the reference light incident into the switchable reference-arm does not fall on a preset reference-arm position corresponding to the specific interface of eye, an optical path length of reference light is adjusted by a translation mechanism performed along an optical-axis, so that the reference light can fall on the preset reference-arm position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟</p>
        <p type="p">S20:步驟</p>
        <p type="p">S30:步驟</p>
        <p type="p">S40:步驟</p>
        <p type="p">S50:步驟</p>
        <p type="p">S60:步驟</p>
        <p type="p">S70:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="925" publication-number="202631706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F283/04</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">C08F299/02</further-classification>
        <further-classification edition="200601120260504B">C08G65/48</further-classification>
        <further-classification edition="201801120260504B">C08K3/013</further-classification>
        <further-classification edition="200601120260504B">C08K3/36</further-classification>
        <further-classification edition="200601120260504B">C08K5/5399</further-classification>
        <further-classification edition="200601120260504B">C08K9/06</further-classification>
        <further-classification edition="200601120260504B">C08L65/00</further-classification>
        <further-classification edition="200601120260504B">C08L71/10</further-classification>
        <further-classification edition="200601120260504B">C08L79/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/18</further-classification>
        <further-classification edition="200601120260504B">B32B27/20</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蜷川隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINAGAWA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村嘉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種樹脂組成物，其可帶來介電損耗角正切低、與導體層的密合強度優異、良好的機械特性優異的固化物。  &lt;br/&gt;　　[解決手段] 一種樹脂組成物，其包含：(A)含有特定結構單元和特定末端基團的化合物、(B)馬來醯亞胺樹脂、(C)磷系阻燃劑以及(D)無機填充材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="926" publication-number="202632538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括位址產生器的運算系統及用於該運算系統的方法</chinese-title>
        <english-title>COMPUTING SYSTEM INCLUDING ADDRESS GENERATOR AND METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G06N3/06</main-classification>
        <further-classification edition="200601120260202B">G06T1/00</further-classification>
        <further-classification edition="200601120260202B">G06F17/16</further-classification>
        <further-classification edition="200601120260202B">G06F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈什　莫因莫伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, MRINMOY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金孝鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYOJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹　東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統，包括：位址產生器，包括：第一累加器，包括用於儲存第一累加值的累加暫存器；以及被配置為儲存第一步幅值的第一步幅暫存器。位址產生器可被配置為產生第一位址，第一位址的產生包括將第一步幅值加入到第一累加值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes: an address generator including: a first accumulator including an accumulator register for storing a first accumulator value; and a first stride register configured to store a first stride value. The address generator may be configured to generate a first address, the generating of the first address including adding the first stride value to the first accumulator value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:主機</p>
        <p type="p">110:加速器</p>
        <p type="p">115:資料記憶體</p>
        <p type="p">130:控制處理器</p>
        <p type="p">135:位址產生單元</p>
        <p type="p">140:記憶體控制器</p>
        <p type="p">155:乘積累加運算單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="927" publication-number="202631695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於再循環廢棄摻合織物之方法及由其獲得之再循環纖維素</chinese-title>
        <english-title>METHOD FOR RECYCLING WASTE BLENDED TEXTILES AND RECYCLED CELLULOSE OBTAINED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08B16/00</main-classification>
        <further-classification edition="202201120260504B">B09B3/70</further-classification>
        <further-classification edition="200601120260504B">C07C51/09</further-classification>
        <further-classification edition="200601120260504B">C07C63/26</further-classification>
        <further-classification edition="200601120260504B">C07C67/03</further-classification>
        <further-classification edition="200601120260504B">C07C69/82</further-classification>
        <further-classification edition="200601120260504B">C08J11/00</further-classification>
        <further-classification edition="200601120260504B">C08J11/06</further-classification>
        <further-classification edition="200601120260504B">C08J11/08</further-classification>
        <further-classification edition="200601120260504B">C08J11/24</further-classification>
        <further-classification edition="200601120260504B">D21C5/02</further-classification>
        <further-classification edition="200601120260504B">D21H11/14</further-classification>
        <further-classification edition="200601120260504B">D21H13/46</further-classification>
        <further-classification edition="200601120260504B">D21H17/01</further-classification>
        <further-classification edition="200601120260504B">D21H17/63</further-classification>
        <further-classification edition="200601120260504B">D01G11/00</further-classification>
        <further-classification edition="202201320260504B">B09B101/75</further-classification>
        <further-classification edition="202201320260504B">B09B101/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜淍植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴真姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田敏較</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, MINGYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙顯埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HEE-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於再循環廢棄摻合織物之方法及自其獲得之再循環纖維素。該用於再循環廢棄摻合織物之方法包含：用一預處理劑預處理包含棉及聚酯之一廢棄摻合織物；將經預處理之該廢棄摻合織物解聚合以獲得再循環纖維素(r-纖維素)及解聚合產物；以及用一後處理試劑後處理該再循環纖維素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for recycling a waste blended textile and to recycled cellulose obtained therefrom. The process for recycling a waste blended textile comprises pretreating a waste blended textile comprising cotton and polyester with a pretreatment agent; depolymerizing the pretreated waste blended textile to obtain recycled cellulose (r-cellulose) and a depolymerized product; and post-treating the recycled cellulose with a post-treatment agent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="928" publication-number="202633296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理薄膜的方法及製造記憶體裝置的方法</chinese-title>
        <english-title>METHOD OF TREATING THIN FILMS AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P50/28</main-classification>
        <further-classification edition="200601120260422B">C09K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹圭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KYU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玹姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HA NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹賢植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYEON SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韓彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAN BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔雄辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WOONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種處理薄膜之方法，其包含：將一覆蓋前驅物供應至置放有一基體之一腔室中，以將該覆蓋前驅物吸附至該基體上所形成之一薄膜上；沖洗該腔室之內部；將一反應材料供應至該腔室中以形成一覆蓋層；沖洗該腔室之內部；對該基體進行退火；將一蝕刻引發劑供應至該腔室中；沖洗該腔室之內部；將一反應材料供應至該腔室中以活化該蝕刻引發劑；以及沖洗該腔室之內部，其中該覆蓋前驅物具有一金屬作為一中心元素，該金屬可在與該薄膜相同的晶體中生長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of treating thin films, comprising: supplying a capping precursor into a chamber in which a substrate is placed to adsorb the capping precursor onto a thin film formed on the substrate; purging the inside of the chamber; supplying a reaction material into the chamber to form a capping layer; purging the inside of the chamber; annealing the substrate; supplying an etch initiator into the chamber; purging the inside of the chamber; supplying a reaction material into the chamber to activate the etch initiator; and purging the inside of the chamber, wherein the capping precursor has, as a central element, a metal that can grow in the same crystal as the thin film.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="929" publication-number="202632152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶消音器之真空產生單元及其消音器</chinese-title>
        <english-title>VACUUM GENERATOR UNIT WITH SILENCER AND SILENCER THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">F04F5/20</main-classification>
        <further-classification edition="200601120260422B">F16K47/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾﨑光寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, MITSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了提供可減少消音器的排氣阻力而抑制為了產生負壓所需之壓縮空氣的流量之真空產生單元。  &lt;br/&gt;　　真空產生單元(40)設置在歧管塊(11)和切換閥單元(30)之間且藉由通過切換閥單元(30)供應的壓縮空氣來產生負壓，其具有：具備第1供氣埠(42)和抽氣器部(50)和第1負壓輸出埠(43)和排氣埠(44)之殼體(41)、及設置於排氣埠之消音器(70)。消音器具有：具有由消音材(73)所構成的消音流路(72)之消音部(71)、及將藉由消音部消音後的排氣排放到大氣之排氣部(80)，在排氣部的排氣本體內形成有：與消音流路的出口開口連接之排氣空間(82)、連通排氣空間與外部之排氣流路(83)。排氣空間的流路剖面積大於出口開口，排氣空間形成為高度大於寬度之縱長形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:真空產生裝置</p>
        <p type="p">11:歧管塊</p>
        <p type="p">12:基座本體</p>
        <p type="p">12a:前表面</p>
        <p type="p">12b:上端面</p>
        <p type="p">13:供氣孔(供氣流路)</p>
        <p type="p">14:第1排氣孔</p>
        <p type="p">15:第2排氣孔</p>
        <p type="p">16:第1負壓埠</p>
        <p type="p">17:第2負壓埠</p>
        <p type="p">18:第1負壓流路</p>
        <p type="p">19:第2負壓流路</p>
        <p type="p">20:第1負壓輸入埠</p>
        <p type="p">21:第2負壓輸入埠</p>
        <p type="p">22:插塞構件</p>
        <p type="p">23:第1排氣輸入埠</p>
        <p type="p">24:第1供氣輸出埠</p>
        <p type="p">25:第2排氣輸入埠</p>
        <p type="p">30:切換閥單元</p>
        <p type="p">31:嚮導閥</p>
        <p type="p">32:閥本體</p>
        <p type="p">32a:下端面</p>
        <p type="p">33:主本體</p>
        <p type="p">33a:閥孔</p>
        <p type="p">34:閥軸</p>
        <p type="p">36:活塞蓋</p>
        <p type="p">36a:活塞室</p>
        <p type="p">36b:活塞</p>
        <p type="p">37:嚮導閥部</p>
        <p type="p">37a:嚮導流路</p>
        <p type="p">38:端蓋</p>
        <p type="p">40:真空產生單元</p>
        <p type="p">41:殼體</p>
        <p type="p">41a:第1安裝面</p>
        <p type="p">41b:第2安裝面</p>
        <p type="p">41d:凹部</p>
        <p type="p">42:第1供氣埠(供氣埠)</p>
        <p type="p">43:第1負壓輸出埠(輸出埠)</p>
        <p type="p">44:排氣埠</p>
        <p type="p">45:供氣流路</p>
        <p type="p">47:供應流路</p>
        <p type="p">48:第1排氣流路</p>
        <p type="p">49:第2排氣流路</p>
        <p type="p">50:抽氣器部</p>
        <p type="p">51:噴嘴部</p>
        <p type="p">52:擴散器部</p>
        <p type="p">53:第2輸出流路</p>
        <p type="p">54:供氣輸入埠</p>
        <p type="p">55:第2供氣輸出埠</p>
        <p type="p">56:第1排氣流出埠</p>
        <p type="p">57:第1排氣流入埠</p>
        <p type="p">58:第2排氣流出埠</p>
        <p type="p">59:第2排氣流入埠</p>
        <p type="p">60:第2負壓輸出埠(輸出埠)</p>
        <p type="p">61:第2供氣埠</p>
        <p type="p">70:消音器</p>
        <p type="p">72:消音流路</p>
        <p type="p">73:消音材</p>
        <p type="p">74:消音本體</p>
        <p type="p">76:連接部</p>
        <p type="p">83a:上側外排氣口</p>
        <p type="p">A:第1輸出埠</p>
        <p type="p">B:第2輸出埠</p>
        <p type="p">EA:第1排出埠</p>
        <p type="p">EB:第2排出埠</p>
        <p type="p">P:供氣流入埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="930" publication-number="202631696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134360</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再循環摻合織物之方法以及由其獲得之再循環纖維素及再循環鄰苯二甲酸二烷基酯</chinese-title>
        <english-title>METHOD OF RECYCLING BLENDED TEXTILES, AND RECYCLED CELLULOSE AND RECYCLED DIALKYL PHTHALATE OBTAINED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08B16/00</main-classification>
        <further-classification edition="202201120260428B">B09B3/70</further-classification>
        <further-classification edition="200601120260428B">C07C51/09</further-classification>
        <further-classification edition="200601120260428B">C07C63/26</further-classification>
        <further-classification edition="200601120260428B">C07C67/03</further-classification>
        <further-classification edition="200601120260428B">C07C69/82</further-classification>
        <further-classification edition="200601120260428B">C08J11/00</further-classification>
        <further-classification edition="200601120260428B">C08J11/06</further-classification>
        <further-classification edition="200601120260428B">C08J11/08</further-classification>
        <further-classification edition="200601120260428B">C08J11/24</further-classification>
        <further-classification edition="200601120260428B">D01G11/00</further-classification>
        <further-classification edition="200601120260428B">D21C5/02</further-classification>
        <further-classification edition="200601120260428B">D21H11/14</further-classification>
        <further-classification edition="200601120260428B">D21H13/46</further-classification>
        <further-classification edition="200601120260428B">D21H17/01</further-classification>
        <further-classification edition="200601120260428B">D21H17/63</further-classification>
        <further-classification edition="202201320260428B">B09B101/75</further-classification>
        <further-classification edition="202201320260428B">B09B101/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜淍植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴真姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田敏較</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, MINGYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙顯埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HEE-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種再循環摻合織物的方法，該方法包含：使用解聚合溶劑將包含棉花及合成纖維的摻合織物解聚合以產生解聚合產物，過濾該解聚合產物以獲得再循環纖維素(r-纖維素)，及自濾液中獲得鄰苯二甲酸二烷基酯；以及藉由上述方法製備且具有極佳產率、純度及顏色的再循環纖維素及再循環鄰苯二甲酸二烷基酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for recycling a blended textile, which comprises depolymerizing a blended textile comprising cotton and a synthetic fiber with a depolymerization solvent to produce a depolymerization product; filtering the depolymerization product to obtain recycled cellulose (r-cellulose); and obtaining a dialkyl phthalate from the filtrate, and to recycled cellulose and a recycled dialkyl phthalate that are prepared by the above process and have excellent yield, purity, and color.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="931" publication-number="202631568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C57/18</main-classification>
        <further-classification edition="200601120260504B">C07C59/64</further-classification>
        <further-classification edition="200601120260504B">C07C65/28</further-classification>
        <further-classification edition="200601120260504B">C07C69/36</further-classification>
        <further-classification edition="200601120260504B">C07C233/55</further-classification>
        <further-classification edition="200601120260504B">C07C235/06</further-classification>
        <further-classification edition="200601120260504B">C07C309/12</further-classification>
        <further-classification edition="200601120260504B">C07C309/17</further-classification>
        <further-classification edition="200601120260504B">C07C309/42</further-classification>
        <further-classification edition="200601120260504B">C07C381/12</further-classification>
        <further-classification edition="200601120260504B">C07D307/68</further-classification>
        <further-classification edition="200601120260504B">C07D317/70</further-classification>
        <further-classification edition="200601120260504B">C07D333/40</further-classification>
        <further-classification edition="200601120260504B">C07D407/04</further-classification>
        <further-classification edition="200601120260504B">C07D409/04</further-classification>
        <further-classification edition="200601120260504B">C08F212/02</further-classification>
        <further-classification edition="200601120260504B">C08F220/10</further-classification>
        <further-classification edition="200601120260504B">C09K3/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江崎郁哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESAKI, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白谷宗大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATANI, MOTOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種保存穩定性良好、並且於圖案形成時可以與先前同等以上的水準發揮感度、LWR及Min CD的感放射線性組成物等。一種感放射線性組成物，含有：聚合物，包含具有酸解離性基的結構單元（I）；以及溶劑，所述感放射線性組成物中，所述聚合物具有下述式（w1）或式（w2）所表示的部分結構（w），或者所述感放射線性組成物包含具有下述式（w1）或式（w2）所表示的部分結構（w）的鎓鹽化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="176px" width="372px" file="ed10075.JPG" alt="ed10075.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（選自由R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;所組成的群組中的至少一個為碘原子或溴原子。X為碘原子或溴原子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="932" publication-number="202633443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/22</main-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓心半導體異質整合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, HO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡均祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱景裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳書賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，包括散熱件、穿孔、封裝結構、散熱蓋以及連接件。散熱件具有彼此相對的第一表面與第二表面。穿孔貫穿散熱件。封裝結構配置於散熱件的第一表面上，且包括電路結構與電子單元。電路結構包括金屬層，且散熱件的導熱係數不同於金屬層的導熱係數。電子單元配置於電路結構上且與電路結構電性連接。散熱蓋附接至封裝結構上。連接件電性連接封裝結構的電路結構，且穿過散熱件的穿孔而延伸至散熱件的第二表面外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic device, including a heat dissipation component, a through-hole, a package structure, a heat dissipation cover, and a connecting component. The heat dissipation component has a first surface and a second surface opposite to each other. The through-hole extends through the heat dissipation component. The package structure is disposed on the first surface of the heat dissipation component, and includes a circuit structure and an electronic unit. The circuit structure includes a metal layer, and a thermal conductivity of the heat dissipation component is different from a thermal conductivity of the metal layer. The electronic unit is disposed on the circuit structure and is electrically connected to the circuit structure. The heat dissipation cover is attached to the package structure. The connecting component electrically connects the circuit structure of the package structure, and extends through the through-hole of the heat dissipation component beyond the second surface of the heat dissipation component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:電子裝置</p>
        <p type="p">110a:散熱件</p>
        <p type="p">112a:導電部</p>
        <p type="p">114a:絕緣部</p>
        <p type="p">115a:穿孔</p>
        <p type="p">120a:封裝結構</p>
        <p type="p">121a:周圍表面</p>
        <p type="p">130a:散熱蓋</p>
        <p type="p">132a:散熱鰭片部</p>
        <p type="p">134a:側蓋部</p>
        <p type="p">136a:延伸部</p>
        <p type="p">140:連接件</p>
        <p type="p">150、155:熱介面材料</p>
        <p type="p">B:背面</p>
        <p type="p">C:電路結構</p>
        <p type="p">D1:第一介電層</p>
        <p type="p">D2:第二介電層</p>
        <p type="p">E:電子單元</p>
        <p type="p">M:金屬層</p>
        <p type="p">M1:第一金屬層</p>
        <p type="p">M2:第二金屬層</p>
        <p type="p">P:封裝膠體</p>
        <p type="p">S:連接元件</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">T1、T2:厚度</p>
        <p type="p">U:膠層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="933" publication-number="202631542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化鎵之燒結體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C04B35/58</main-classification>
        <further-classification edition="200601120260416B">C23C14/34</further-classification>
        <further-classification edition="200601120260416B">C04B35/645</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納絵梨沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANO, ERISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上岡義弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEOKA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>召田雅実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESUDA, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供氮化鎵之燒結體及其製造方法中至少任一種；前述燒結體儘管含有1.0質量%以上的摻雜元素量，仍具有高抗折強度，並且可使p型氮化鎵膜直接成膜。本發明之氮化鎵之燒結體的特徵在於：含有含選自鈹（Be）、鎂（Mg）、鈣（Ca）、鍶（Sr）、鋇（Ba）、鋅（Zn）及鎘（Cd）所成群中一種以上摻雜元素之合金，且摻雜元素的含量為1.0質量%以上，並且氧含量為0.6atm%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="934" publication-number="202631187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以BCMA抑制劑與CD38抑制劑之組合來治療多發性骨髓瘤之方法</chinese-title>
        <english-title>METHODS OF TREATING MULTIPLE MYELOMA WITH BCMA INHIBITORS IN COMBINATION WITH CD38 INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅格　格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROOG, GLENN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡里亞　肖恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKARIA, SHAWN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供用於治療多發性骨髓瘤之方法。在某些實施例中，本方法包含向有需求之受試者投予BCMA抑制劑(例如，結合至BCMA及CD3之雙特異性抗體或其抗原結合片段)與CD38抑制劑(例如，抗CD38抗體)之組合。在某些實施例中，受試者先前已接受過一或多種抗癌療法的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for treating multiple myeloma. In certain embodiments, the present methods comprise administering to a subject in need thereof a BCMA inhibitor (&lt;i&gt;e.g&lt;/i&gt;., a bispecific antibody or antigen-binding fragment thereof that bind to BCMA and CD3) in combination with a CD38 inhibitor (&lt;i&gt;e.g.&lt;/i&gt;, an anti-CD38 antibody). In certain embodiments, the subject has been previously treated with one or more anti-cancer therapies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="935" publication-number="202631188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以BCMA抑制劑與PD1/PD-L1抑制劑之組合來治療多發性骨髓瘤之方法</chinese-title>
        <english-title>METHODS OF TREATING MULTIPLE MYELOMA WITH BCMA INHIBITORS IN COMBINATION WITH PD1/PD-L1 INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅格　格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROOG, GLENN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡里亞　肖恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKARIA, SHAWN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供用於治療多發性骨髓瘤之方法。在某些實施例中，本發明方法包含向有需求之受試者投予BCMA抑制劑(例如，結合至BCMA及CD3之雙特異性抗體或其抗原結合片段)與PD1抑制劑或PD-L1抑制劑(例如，抗PD1抗體或抗PD-L1抗體)之組合。在某些實施例中，受試者先前已接受過一或多種抗癌療法的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for treating multiple myeloma. In certain embodiments, the present methods comprise administering to a subject in need thereof a BCMA inhibitor (&lt;i&gt;e.g&lt;/i&gt;., a bispecific antibody or antigen-binding fragment thereof that binds to BCMA and CD3) in combination with a PD1 inhibitor or PD-L1 inhibitor (&lt;i&gt;e.g.&lt;/i&gt;, an anti-PD1 antibody or an anti-PD-L1 antibody). In certain embodiments, the subject has been previously treated with one or more anti-cancer therapies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="936" publication-number="202631134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用ＢＣＭＡ抑制劑與免疫調節劑之組合治療多發性骨髓瘤之方法</chinese-title>
        <english-title>METHODS OF TREATING MULTIPLE MYELOMA WITH BCMA INHIBITORS IN COMBINATION WITH AN IMMUNOMODULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/454</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅格　格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROOG, GLENN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡里亞　肖恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKARIA, SHAWN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文內容提供用於治療多發性骨髓瘤之方法。在某些實施例中，本方法包含向有需求之受試者投予BCMA抑制劑(例如，結合至BCMA及CD3之雙特異性抗體或其抗原結合片段)與免疫調節劑之組合。在某些實施例中，免疫調節劑為沙利竇邁之結構或功能類似物(例如，去羰利竇邁胺或沙利竇邁胺)。在某些實施例中，受試者先前已接受過一或多種抗癌療法的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for treating multiple myeloma. In certain embodiments, the present methods comprise administering to a subject in need thereof a BCMA inhibitor (&lt;i&gt;e.g.&lt;/i&gt;, a bispecific antibody or antigen-binding fragment thereof that binds to BCMA and CD3) in combination with an immunomodulator. In certain embodiments, the immunomodulator is a structural or functional analogue of thalidomide (&lt;i&gt;e.g.&lt;/i&gt;, lenalidomide or pomalidomide). In certain embodiments, the subject has been previously treated with one or more anti-cancer therapies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="937" publication-number="202633077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於裝置中堆疊一致性的摻雜多層結構及相關方法與設備</chinese-title>
        <english-title>DOPED MULTI-LAYER STRUCTURES FOR STACK UNIFORMITY IN DEVICES, AND RELATED METHODS AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260421B">H10B12/00</main-classification>
        <further-classification edition="202501120260421B">H10D62/60</further-classification>
        <further-classification edition="202501120260421B">H10D62/83</further-classification>
        <further-classification edition="202601120260421B">H10P14/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕卡拉　瑪亨德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAKALA, MAHENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉　羅亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAGHI, ROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟　鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　相昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例一般與磊晶製程和材料有關，更具體地，涉及用於準備材料、層、堆疊和裝置的磊晶製程。在一或多個實施例中，裝置包括位於基板上的多層結構。該多層結構包括複數個摻雜的矽鍺（SiGe）層。這些摻雜的SiGe層各自包含摻雜物，其濃度範圍約為0.01原子百分比（at%）至約5at%。該多層結構包括複數個矽層，這些矽層以交替排列的方式與摻雜的SiGe層相置放，這樣每個矽層被分別置於第一摻雜SiGe層和第二摻雜SiGe層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to epitaxial processes and materials, and more specifically, epitaxial processes for preparing materials, layers, stacks, and devices. In one or more embodiments, a device includes a multi-layer structure disposed on a substrate. The multi-layer structure includes a plurality of doped silicon-germanium (SiGe) layers. The doped SiGe layers respectively include a dopant having a concentration in a range from about 0.01 atomic percent (at%) to about 5 at%. The multi-layer structure includes a plurality of silicon layers disposed in an alternating arrangement with the doped SiGe layers such that a respective silicon layer is disposed between a respective first doped SiGe layer and a respective second doped SiGe layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">201:操作</p>
        <p type="p">202:操作</p>
        <p type="p">203:操作</p>
        <p type="p">204:操作</p>
        <p type="p">206:操作</p>
        <p type="p">208:操作</p>
        <p type="p">209:操作</p>
        <p type="p">211:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="938" publication-number="202633187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括延伸針腳的積體電路</chinese-title>
        <english-title>INTEGRATED CIRCUIT INCLUDING EXTENDING PINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D89/10</main-classification>
        <further-classification edition="202001120251103B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳志秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JISU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁在完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JAEWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋永羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供者係一積體電路，其可包括：一第一胞元，其置布於在一第一方向上延伸之一第一列中，且包括在一基體上方之一第一針腳；以及置布在該第一列中的一第二胞元，其包括在該基體上方之一第二針腳，其中該第一針腳及該第二針腳被包括在該基體上方之一第一佈線層中的一第一圖案中，該第一圖案沿著在該第一列與相鄰於該第一列之一第二列之間的一邊界在該第一方向上延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an integrated circuit which may include a first cell placed in a first row extending in a first direction and including a first pin above a substrate and a second cell placed in the first row including a second pin above the substrate, wherein the first pin and the second pin are included in a first pattern in a first wiring layer above the substrate, the first pattern extending in the first direction along a boundary between the first row and a second row adjacent to the first row.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40b:布局</p>
        <p type="p">C41:第一胞元</p>
        <p type="p">C42:第二胞元</p>
        <p type="p">M1:第一佈線層</p>
        <p type="p">M2:第二佈線層</p>
        <p type="p">M11:第一圖案</p>
        <p type="p">M12:第二圖案</p>
        <p type="p">M13:第三圖案</p>
        <p type="p">M14:第四圖案</p>
        <p type="p">M15:第五圖案</p>
        <p type="p">R41:第一列</p>
        <p type="p">SEG1:第一區段</p>
        <p type="p">SEG2:第二區段</p>
        <p type="p">SEG3:第三區段</p>
        <p type="p">T41:第一軌道</p>
        <p type="p">T42:第二軌道</p>
        <p type="p">T43:第三軌道</p>
        <p type="p">T44:第四軌道</p>
        <p type="p">V1:第一通孔層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="939" publication-number="202631724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌段共聚物、分散劑、及著色組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08F2/48</main-classification>
        <further-classification edition="200601120260417B">C08L53/00</further-classification>
        <further-classification edition="200601120260417B">C08F293/00</further-classification>
        <further-classification edition="200601120260417B">C08F297/00</further-classification>
        <further-classification edition="200601120260417B">C08F220/56</further-classification>
        <further-classification edition="200601120260417B">C09D133/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種嵌段共聚物，其具有紫外線硬化性，且於用作著色組合物之分散劑時，著色材料之分散性能良好。&lt;br/&gt;  本發明之AB型二嵌段共聚物之特徵在於：A嵌段及B嵌段分別藉由使聚合性組合物（A）、聚合性組合物（B）進行活性自由基聚合而形成，聚合性組合物（A）含有具有含氮官能基之單體，聚合性組合物（B）以規定量含有具有(甲基)丙烯醯基及乙烯性不飽和基之單體（b-1）、以及具有羥基之(甲基)丙烯酸酯（b-2）及/或具有烷氧基之(甲基)丙烯酸酯（b-3），源自上述單體（b-1）且具有除(甲基)丙烯醯基以外之乙烯性不飽和基之結構單元（X）的漢森溶解度參數之氫鍵力項（δ&lt;sub&gt;h&lt;/sub&gt;）為5.00～9.00。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="940" publication-number="202632661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C16/02</main-classification>
        <further-classification edition="200601120260302B">G11C16/06</further-classification>
        <further-classification edition="200601120260302B">G11C5/02</further-classification>
        <further-classification edition="200601120260302B">G11C7/18</further-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="200601120260302B">G11C7/06</further-classification>
        <further-classification edition="200601120260302B">G11C8/10</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小倉達朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高處理能力之半導體記憶裝置。  根據實施方式，半導體記憶裝置包含：複數個記憶體串，其等包含複數個記憶胞，該等複數個記憶胞沿第1方向相間隔地積層，沿第2方向排列配置，且電流路徑串聯連接；字元線，其連接於沿第1方向相間隔地積層之複數個第1記憶胞；及複數個位元線。複數個記憶胞能夠記憶與複數個狀態中之任一個對應之資料。於編程動作中，複數個狀態被分類為複數個組，列解碼器對字元線施加與複數個組分別對應之複數個脈衝電壓。於編程驗證動作中，列解碼器對字元線施加與複數個狀態分別對應之複數個驗證電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL_A,BL_B,BL_C,BL_D:位元線</p>
        <p type="p">PG1:第1次編程動作</p>
        <p type="p">PG2:第2次編程動作</p>
        <p type="p">PG3:第3次編程動作</p>
        <p type="p">PV:編程驗證動作</p>
        <p type="p">t5~t6:時間</p>
        <p type="p">Vp_A,Vp_B,Vp_C,Vp_D:脈衝電壓</p>
        <p type="p">VBL,VSS:電壓</p>
        <p type="p">△Vp:升壓電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="941" publication-number="202631569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含碘化合物、含碘羥基化合物、含碘（共）聚合物、組成物、圖型形成方法及含碘化合物之製造方法</chinese-title>
        <english-title>IODINE-CONTAINING COMPOUND, IODINE-CONTAINING HYDROXYL COMPOUND, IODINE-CONTAINING (CO)POLYMER, COMPOSITION, METHOD FOR FORMING PATTERN, AND METHOD FOR PREPARING IODINE-CONTAINING COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C67/14</main-classification>
        <further-classification edition="200601120260504B">C07C69/757</further-classification>
        <further-classification edition="200601120260504B">C08F20/22</further-classification>
        <further-classification edition="200601120260504B">C08F20/26</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯沼雅崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IINUMA, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋谷香奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, KANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越後雅敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECHIGO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可形成具有高解析度且高感度的膜的含碘化合物、含碘羥基化合物、含碘(共)聚合物、組成物、圖型形成方法及含碘化合物之製造方法。本發明的含碘化合物為式(1)所表示。  &lt;br/&gt;&lt;img align="absmiddle" height="266px" width="211px" file="ed10143.JPG" alt="ed10143.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides iodine-containing compounds, iodine-containing hydroxyl compounds, iodine-containing (co)polymers, compositions, a method for forming patterns, and a method for preparing iodine-containing compounds, capable of forming a film with high resolution and high sensitivity. The iodine-containing compounds are represented by formula (1). &lt;br/&gt;&lt;img align="absmiddle" height="290px" width="209px" file="ed10144.JPG" alt="ed10144.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="942" publication-number="202631570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含碘（甲基）丙烯酸酯化合物及含碘．羥基聚合物之製造方法</chinese-title>
        <english-title>IODINE-CONTAINING (METH)ACRYLATE COMPOUND AND METHOD FOR PREPARING IODINE-CONTAINING HYDROXYL POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C69/653</main-classification>
        <further-classification edition="200601120260504B">C07D309/12</further-classification>
        <further-classification edition="200601120260504B">C08F20/30</further-classification>
        <further-classification edition="200601120260504B">C08F220/30</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原広一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀內淳矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越後雅敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECHIGO, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供能更提升EUV感度及經時安定性、對於光阻劑層形成材料之製造為有用且保存安定性為優異的化合物。該解決手段為式(I)或式(II)所表示的化合物。環A表示芳香環，環B表示非芳香族雜環，R&lt;sup&gt;1&lt;/sup&gt;表示氫或甲基，R&lt;sup&gt;2&lt;/sup&gt;表示取代基，且1以上為碘原子，R&lt;sup&gt;3&lt;/sup&gt;表示取代基，R&lt;sup&gt;4&lt;/sup&gt;表示直鏈或分支鏈的烷基，X表示O或S，a、b及c表示1以上，d表示0或1以上。  &lt;br/&gt;　　&lt;img align="absmiddle" height="251px" width="564px" file="ed10187.JPG" alt="ed10187.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is to provide a compound that can further enhance EUV sensitivity and temporal stability, is useful for the production of photoresist layer forming materials, and has excellent storage stability. The solution is a compound represented by formula (I) or formula (II) (wherein, Ring A represents an aromatic ring; Ring B represents a non-aromatic heterocycle; R&lt;sup&gt;1&lt;/sup&gt; represents hydrogen or a methyl group; R&lt;sup&gt;2&lt;/sup&gt; represents a substituent, one or more of which are iodine atoms; R&lt;sup&gt;3&lt;/sup&gt; represents a substituent; R&lt;sup&gt;4&lt;/sup&gt; represents a linear or branched alkyl group; X represents O or S; a, b, and c represent 1 or more; and d represents 0 or 1 or more.). &lt;br/&gt;&lt;br/&gt;　&lt;img align="absmiddle" height="263px" width="574px" file="ed10188.JPG" alt="ed10188.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="943" publication-number="202633168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10W20/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹鎭燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JINCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴宰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括：第一電晶體結構，包括下部通道圖案、下部源極/汲極圖案、環繞下部通道圖案的下部閘極電極、下部源極/汲極圖案和下部閘極電極上的下部接合絕緣層、以及下部接合絕緣層和下部源極/汲極圖案之間的下部接觸結構。第二電晶體結構包括上部接合絕緣層、上部接合絕緣層上的上部通道圖案、定位在上部接合絕緣層上和上部通道圖案的相對側上的上部源極/汲極圖案、環繞上部通道圖案的上部閘極電極、以及上部接合絕緣層和上部源極/汲極圖案之間的上部接觸結構。連接結構藉由穿透下部接合絕緣層和上部接合絕緣層來電性連接下部接觸結構和上部接觸結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a first transistor structure including lower channel patterns, a lower source/drain pattern, a lower gate electrode surrounding the lower channel patterns, a lower bonding insulating layer on the lower source/drain pattern and the lower gate electrode, and a lower contact structure between the lower bonding insulating layer and the lower source/drain pattern. A second transistor structure includes an upper bonding insulating layer, upper channel patterns on the upper bonding insulating layer, an upper source/drain pattern positioned on the upper bonding insulating layer and on opposite sides of the upper channel patterns, an upper gate electrode surrounding the upper channel patterns, and an upper contact structure between the upper bonding insulating layer and the upper source/drain pattern. The connection structure electrically connects the lower contact structure and the upper contact structure by penetrating the lower bonding insulating layer and the upper bonding insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:下部場絕緣層</p>
        <p type="p">110:下部圖案</p>
        <p type="p">150:下部源極/汲極圖案</p>
        <p type="p">160:下部接觸結構</p>
        <p type="p">160b,260b,295b,300b:第二表面</p>
        <p type="p">161:第一下部接觸電極</p>
        <p type="p">162:第二下部接觸電極</p>
        <p type="p">185:第一蝕刻停止層</p>
        <p type="p">190:下部層間絕緣層</p>
        <p type="p">195:下部接合絕緣層</p>
        <p type="p">195a,300a:第一表面</p>
        <p type="p">205:上部場絕緣層</p>
        <p type="p">210:上部圖案</p>
        <p type="p">250:上部源極/汲極圖案</p>
        <p type="p">260:上部接觸結構</p>
        <p type="p">261:第一上部接觸電極</p>
        <p type="p">262:第二上部接觸電極</p>
        <p type="p">285:第二蝕刻停止層</p>
        <p type="p">290:上部層間絕緣層</p>
        <p type="p">295:上部接合絕緣層</p>
        <p type="p">300:連接結構</p>
        <p type="p">300R:連接凹部</p>
        <p type="p">310:第一連接電極</p>
        <p type="p">320:第二連接電極</p>
        <p type="p">B-B':線</p>
        <p type="p">TR1,TR2:電晶體結構</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="944" publication-number="202631386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離型膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B32B27/00</main-classification>
        <further-classification edition="200601120260423B">B32B27/20</further-classification>
        <further-classification edition="200601120260423B">B32B27/36</further-classification>
        <further-classification edition="200601120260423B">C08J5/18</further-classification>
        <further-classification edition="202001120260423B">C08J7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUMA, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徳尾宏吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUO, KOKICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠葉浩晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUBA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係即使在使陶瓷生胚片進行薄膜化之情況，亦可防止針孔、局部之厚度不均等，並於聚酯膜基材表面層之製造時降低銻化合物之使用量，並抑制突起之生成，且實現會成為基材之聚酯膜的長度方向上之高斷裂強度、穩定之低熱收縮性。&lt;br/&gt;  解決手段為一種離型膜，係具有聚酯膜基材以及離型層，基材之表面層係由含有銻化合物、鹼土金屬化合物及磷化合物之聚酯所構成，表面層之極限黏度為0.55dl/g以上，表面層之銻原子之含量為120ppm以下；離型層表面之表面自由能為15mJ/m&lt;sup&gt;2&lt;/sup&gt;至25mJ/m&lt;sup&gt;2&lt;/sup&gt;；離型層厚度為5nm至1200nm；離型層表面之區域表面平均粗糙度(Sa)為7nm以下，最大突起高度為100nm以下之範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="945" publication-number="202631749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134600</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗靜電塗布劑、固化物以及層疊物</chinese-title>
        <english-title>ANTISTATIC COATING AGENT, CURED PRODUCT AND LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F220/06</main-classification>
        <further-classification edition="200601120260504B">C08F220/14</further-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F220/28</further-classification>
        <further-classification edition="200601120260504B">C09D125/18</further-classification>
        <further-classification edition="200601120260504B">C09D133/06</further-classification>
        <further-classification edition="200601120260504B">C09D165/00</further-classification>
        <further-classification edition="201801120260504B">C09D7/45</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="200601120260504B">C09D5/24</further-classification>
        <further-classification edition="200601120260504B">C09K3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荒川化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKAWA CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤良樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田彩子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, AYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[技術問題]提供抗靜電塗布劑、固化物以及層疊物。[技術手段]一種抗靜電塗布劑，所述抗靜電塗布劑包括：含羧酸鹽陰離子基的(甲基)丙烯酸樹脂以及含雜原子的導電性聚合物，質量比（所述含雜原子的導電性聚合物/所述含羧酸鹽陰離子基的(甲基)丙烯酸樹脂）為0.05～1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="946" publication-number="202631897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱軟化性導熱性矽氧組成物及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08L83/07</main-classification>
        <further-classification edition="200601120260416B">C08L83/05</further-classification>
        <further-classification edition="200601120260416B">C08K5/5419</further-classification>
        <further-classification edition="201801120260416B">C08K3/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村一晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤晃洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤崇則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種熱軟化性導熱性矽氧組成物，其包含：(A)苯基改質有機聚矽氧烷，其一分子中具有2個以上的烯基，25℃時的動黏度為100～100000mm&lt;sup&gt;2&lt;/sup&gt;/s，且不含T單元；(B)有機氫聚矽氧烷，其至少在分子鏈末端具有2個矽氫基；(C)選自具有水解性官能基之有機聚矽氧烷、及由特定式子表示的烷氧基矽烷化合物中的1種以上、(D)選自由金屬、金屬氧化物、金屬氫氧化物、及金屬氮化物所組成之群組中的1種以上的導熱性填充劑、及(E)鉑族金屬觸媒。藉此，提供一種熱軟化性導熱性矽氧組成物及硬化物，其不含具有T單元的熱塑性矽氧樹脂，且熱軟化性優異。進一步提供一種熱軟化性導熱性矽氧組成物的硬化物，其重工性優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="947" publication-number="202632123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製藥領域無塵室的可移動分隔裝置</chinese-title>
        <english-title>MOVABLE PARTITION DEVICE CONFIGURED TO EQUIP A CLEANROOM FOR USE IN A FIELD OF PHARMACEUTICAL MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">E04H5/02</main-classification>
        <further-classification edition="200601120260504B">E04B2/74</further-classification>
        <further-classification edition="200601120260504B">E04H15/20</further-classification>
        <further-classification edition="200601120260504B">B01L1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商艾斯比達公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPIDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲巴斯德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI PASTEUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉門尼斯　傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIMENEZ, GEOFFRAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅西爾　洛伊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCIER, LOIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙福特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUMFORD, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普瑪瑞斯　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POMMARES, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里博　吉勞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBOT, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏魯斯布魯諾　喬瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URRUTH BRUNO, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種用於裝備製藥場所的無塵室(2)的可移動分隔裝置(4)，該裝置包括框架(14)，該框架配置為與無塵室的支撐件(10)機械連接，以及至少一柔性面板(15)，該柔性面板具有工作配置，其中柔性面板處於充氣狀態，處於豎立位置並由輪廓(16)界定，輪廓至少部分容納在框架中，使得無塵室被分隔成複數個區域(3)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a movable partition device (4) configured to equip a cleanroom (2) of a pharmaceutical manufacturing site, comprising a frame (14) configured to be mechanically connected to a support (10) of the cleanroom, and at least one flexible panel (15) having a working configuration in which the flexible panel is inflated, in an erected position and delimited by an outline (16) at least partially housed in the frame, so that the cleanroom is separated between several areas (3).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:無塵室</p>
        <p type="p">3:區域</p>
        <p type="p">4:可移動分隔裝置</p>
        <p type="p">5:位置</p>
        <p type="p">10:支撐件</p>
        <p type="p">11:壁</p>
        <p type="p">12:屋頂</p>
        <p type="p">13:天花板</p>
        <p type="p">14:框架</p>
        <p type="p">15:柔性面板</p>
        <p type="p">16:輪廓</p>
        <p type="p">17:窗</p>
        <p type="p">18:門</p>
        <p type="p">19:傳遞口</p>
        <p type="p">20:撕裂線</p>
        <p type="p">28:壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="948" publication-number="202632036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積可重流聚合物膜的方法</chinese-title>
        <english-title>METHODS OF DEPOSITING REFLOWABLE POLYMER FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C23C16/02</main-classification>
        <further-classification edition="200601120260430B">C23C16/04</further-classification>
        <further-classification edition="200601120260430B">C23C16/44</further-classification>
        <further-classification edition="200601120260430B">C23C16/455</further-classification>
        <further-classification edition="200601120260430B">C23C16/56</further-classification>
        <further-classification edition="202601120260430B">H10P14/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡國立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY OF SINGAPORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特基　魯迪姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOJTECKI, RUDY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃庫　貝可利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WORKU, BEKELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡贊姆　納斯琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZEM, NASRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石唯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙慕葛南森　維寧許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHMUGANATHAN, VICKNESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇迪喬諾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDIJONO, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種在半導體基板上沉積可重流聚合物膜的方法。示範性處理方法可以包含將第一前驅物在半導體基板上流動，以在結構上形成聚合物膜的第一部分。這些方法可以包含從半導體基板移除第一前驅物流出物。然後可以將第二前驅物在半導體基板上流動，以與聚合物膜的第一部分反應。這些方法可以包含從半導體基板移除第二前驅物流出物。這些方法可能包含透過將聚合物膜暴露於熱處理來使聚合物膜重流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing a reflowable polymeric film on a semiconductor substrate are described. Exemplary processing methods may include flowing a first precursor over a semiconductor substrate to form a first portion of polymeric film on the structure. The methods may include removing a first precursor effluent from the semiconductor substrate. A second precursor may then be flowed over the semiconductor substrate to react with the first portion of the polymeric film. The methods may include removing a second precursor effluent from the semiconductor substrate. The methods may include reflowing the polymeric film by exposing the polymeric film to a heat treatment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:剖面視圖</p>
        <p type="p">101:特徵</p>
        <p type="p">102:基板</p>
        <p type="p">104:表面</p>
        <p type="p">106:聚合物膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="949" publication-number="202631914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物、研磨方法及半導體基板的製造方法</chinese-title>
        <english-title>POLISHINGCOMPOSITION,POLISHINGMETHOD,ANDMETHODFORPRODUCINGSEMICONDUCTORSUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09G1/02</main-classification>
        <further-classification edition="200601120260504B">C09K3/14</further-classification>
        <further-classification edition="201201120260504B">B24B37/00</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都築敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部将志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠以高研磨速率對碳膜進行研磨的研磨用組合物。研磨用組合物包含研磨粒及非離子性界面活性劑，且使用於研磨包含碳膜的研磨對象物之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a polishing composition that can polish a carbon film at a high polishing removal rate. A polishing composition containing abrasive grains and a nonionic surfactant, wherein the polishing composition is used for polishing an object to be polished containing a carbon film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="950" publication-number="202631949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物及利用其之研磨方法</chinese-title>
        <english-title>POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K3/14</main-classification>
        <further-classification edition="200601120260504B">C09G1/02</further-classification>
        <further-classification edition="201201120260504B">B24B37/00</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏聖軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, SHENG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨用組合物，其包括：研磨粒，其表面以矽烷偶合劑修飾而具有正的表面電位，平均二次粒徑為45nm以上100nm以下，矽烷醇基密度為大於0.0個/nm&lt;sup&gt;2&lt;/sup&gt;且3.0個/nm&lt;sup&gt;2&lt;/sup&gt;以下；界面活性劑，其為具有碳原子數6至18的烷基磷酸酯；以及水性分散媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a polishing composition including polishing particles whose surface is modified with a silane coupling agent to have a positive surface potential, an average secondary particle size of 45 nm to 100 nm, and a silanol group density of greater than 0.0/nm&lt;sup&gt;2&lt;/sup&gt; and less than 3.0/nm&lt;sup&gt;2&lt;/sup&gt;; a surfactant having alkyl phosphates with carbon atoms from 6 to 18;and an aqueous dispersion medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="951" publication-number="202632886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電振動器件及壓電振動器件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H9/02</main-classification>
        <further-classification edition="200601120260504B">H03H3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大真空股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAISHINKU CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下弘晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今村壮汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAMURA, SOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的晶體諧振器中，第二密封構件具有從第一主面貫穿至第二主面的第一貫穿孔、設置在第一貫穿孔內將該第一貫穿孔堵塞的樹脂構件、及將第一貫穿孔在第二主面側的開口端的至少一部分覆蓋的外部端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶體振動片(壓電振動元件)，晶體振動片</p>
        <p type="p">30:第二密封構件</p>
        <p type="p">31a:鈦金屬層</p>
        <p type="p">31b:金金屬層</p>
        <p type="p">161:第一貫穿孔，貫穿孔</p>
        <p type="p">161a:第一傾斜部</p>
        <p type="p">161b:第二傾斜部</p>
        <p type="p">161c:導通電極</p>
        <p type="p">161c1:鉻金屬層</p>
        <p type="p">161c2:鈦金屬層</p>
        <p type="p">161c3:金金屬層</p>
        <p type="p">161d:樹脂構件</p>
        <p type="p">302:第二主面</p>
        <p type="p">321a:第一外部端子金屬層</p>
        <p type="p">321a1:鉻金屬層</p>
        <p type="p">321a2:鈦金屬層</p>
        <p type="p">321a3:金金屬層</p>
        <p type="p">322a:第二外部端子金屬層</p>
        <p type="p">A:範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="952" publication-number="202632887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電振動器件及壓電振動器件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H9/02</main-classification>
        <further-classification edition="200601120260504B">H03H3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大真空股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAISHINKU CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下弘晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今村壮汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAMURA, SOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的晶體諧振器中，第二密封構件具有從第一主面貫穿至第二主面的第一貫穿孔、設置在第一貫穿孔內並將該第一貫穿孔堵塞的導電性構件、及將第一貫穿孔在第二主面側的開口端的至少一部分覆蓋的外部端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶體振動片(壓電振動元件)，晶體振動片</p>
        <p type="p">30:第二密封構件</p>
        <p type="p">31a:鈦金屬層</p>
        <p type="p">31b:金金屬層</p>
        <p type="p">161:第一貫穿孔，貫穿孔</p>
        <p type="p">161a:第一傾斜部</p>
        <p type="p">161b:第二傾斜部</p>
        <p type="p">161c:導通電極</p>
        <p type="p">161c1:鉻金屬層</p>
        <p type="p">161c2:鈦金屬層</p>
        <p type="p">161c3:金金屬層</p>
        <p type="p">161d:導電性構件</p>
        <p type="p">302:第二主面</p>
        <p type="p">321a:第一外部端子金屬層</p>
        <p type="p">321a1:鉻金屬層</p>
        <p type="p">321a2:鈦金屬層</p>
        <p type="p">321a3:金金屬層</p>
        <p type="p">322a:第二外部端子金屬層</p>
        <p type="p">A:範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="953" publication-number="202631214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>注射監控模組</chinese-title>
        <english-title>INJECTION MONITORING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61M5/31</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商拜爾寇生產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOCORP PRODUCTION S.A.S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬寇茲　阿蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCOZ, ALAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種注射監控模組，其包含：繞著縱向軸線旋轉移動之指示器；感測器，其經配置以非接觸式地偵測該指示器繞著該縱向軸線之旋轉移動；處理器，其連接至該感測器，其中該處理器經配置以接收及處理來自該感測器之訊號；其中，在該注射監控模組之第一軸向位置中，防止該旋轉移動指示器繞著該縱向軸線旋轉移動；且其中，在該注射監控模組之不同於該第一軸向位置的第二軸向位置中，該指示器與注射筆系統之劑量分配組件一起繞著該縱向軸線自由地共旋轉，該注射監控模組已安裝至該注射筆系統上或其中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An injection monitoring module comprises an indicator of rotational movement about a lengthwise axis; a sensor configured to contactlessly detect rotational movement of the indicator about the lengthwise axis; a processor connected to the sensor, wherein the processor is configured to receive and process signals from the sensor; wherein, in a first axial position of the injection monitoring module, the indicator of rotational movement is prevented from rotational movement about the lengthwise axis; and wherein, in a second axial position of the injection monitoring module, distinct from the first axial position, the indicator is free to corotate about the lengthwise axis along with a dose dispensing component of an injection pen system, onto which, or into which, the injection monitoring module has been mounted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:注射監控模組/旋轉移動指示器</p>
        <p type="p">1b:注射監控模組/旋轉移動指示器</p>
        <p type="p">2a:注射筆系統</p>
        <p type="p">2b:注射筆系統</p>
        <p type="p">3:中心縱向軸線</p>
        <p type="p">4:筆主體</p>
        <p type="p">5:內部劑量分配套管</p>
        <p type="p">6:刻度套管</p>
        <p type="p">7:內部輪</p>
        <p type="p">8:劑量設定輪</p>
        <p type="p">9a:注射監控模組主體</p>
        <p type="p">9b:注射監控模組主體</p>
        <p type="p">10:封閉近端</p>
        <p type="p">11:遠端</p>
        <p type="p">12a:周邊壁</p>
        <p type="p">12b:周邊壁</p>
        <p type="p">14:堆疊式電路板配置</p>
        <p type="p">15:電池</p>
        <p type="p">16:旋轉阻斷溝槽</p>
        <p type="p">17:面向內表面</p>
        <p type="p">19:內近側突出輪轂/偏置彈簧</p>
        <p type="p">25:磁體</p>
        <p type="p">26:指示器支架主體/托架</p>
        <p type="p">41:狹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="954" publication-number="202631189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由投予ＩＬ－４Ｒ拮抗劑治療不明原因慢性瘙癢（ＣＰＵＯ）之方法</chinese-title>
        <english-title>METHODS FOR TREATING CHRONIC PRURITUS OF UNKNOWN ORIGIN (CPUO) BY ADMINISTERING AN IL-4R ANTAGONIST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61K31/445</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61P17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲生物技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI BIOTECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜柏斯特　布拉瑪　艾莉安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBOST-BRAMA, ARIANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞斯　伊莉莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAWS, ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班索　阿西什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANSAL, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大田孝幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於治療或預防受試者之不明原因慢性瘙癢（CPUO）之方法。提供了包括向患有CPUO的受試者投予治療組成物之方法，該治療組成物包含介白素-4受體（IL-4R）拮抗劑，例如抗IL-4R抗體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for treating or preventing chronic pruritus of unknown origin (CPUO) in a subject are provided. Methods comprising administering to a subject having CPUO a therapeutic composition comprising an interleukin-4 receptor (IL-4R) antagonist, such as an anti-IL-4R antibody, are provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="955" publication-number="202633169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134760</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10W70/69</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅相喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, SANGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄仁景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, INKYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭玟燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWAK, MINCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河承錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SEUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一基底絕緣層，其包含彼此相對之一上表面及一下表面；一通道結構，其在該基底絕緣層之該上表面上；一閘極結構，其環繞該通道結構；源極/汲極圖案，其在該基底絕緣層之該上表面上且連接至該通道結構；電力軌，其在該基底絕緣層之該下表面上；以及一或多個下接觸電極，其將該等電力軌中之一或多者連接至該等源極/汲極圖案中之一或多者，其中該一或多個下接觸電極之一第一下接觸電極之一下表面位設於比該基底絕緣層之該下表面更高之一層級處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a base insulating layer comprising an upper surface and a lower surface opposing one another, a channel structure on the upper surface of the base insulating layer, a gate structure surrounding the channel structure, source/drain patterns on the upper surface of the base insulating layer and connected to the channel structure, power rails on the lower surface of the base insulating layer, and one or more lower contact electrodes connecting one or more of the power rails to one or more of the source/drain patterns, wherein a lower surface of a first lower contact electrode of the one or more lower contact electrodes is positioned at a level higher than the lower surface of the base insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110a:第一通道圖案、通道圖案</p>
        <p type="p">110b:第二通道圖案、通道圖案</p>
        <p type="p">110c:第三通道圖案、通道圖案</p>
        <p type="p">110d:第四通道圖案、通道圖案</p>
        <p type="p">120M:主閘極電極</p>
        <p type="p">120S:子閘極電極</p>
        <p type="p">130M:主閘極絕緣層</p>
        <p type="p">130S:子閘極絕緣層</p>
        <p type="p">141:覆蓋層</p>
        <p type="p">142:閘極間隔件</p>
        <p type="p">150:源極/汲極圖案</p>
        <p type="p">151:第一源極/汲極圖案、源極/汲極圖案</p>
        <p type="p">151a,152a:襯裡層</p>
        <p type="p">151b,152b:填充層</p>
        <p type="p">152:第二源極/汲極圖案、源極/汲極圖案</p>
        <p type="p">161:障壁層</p>
        <p type="p">163:絕緣襯裡</p>
        <p type="p">171:層間絕緣層</p>
        <p type="p">173:第一下絕緣層</p>
        <p type="p">181:下接觸電極</p>
        <p type="p">183:矽化物層</p>
        <p type="p">200:基底絕緣層</p>
        <p type="p">220:電力軌</p>
        <p type="p">A:區域</p>
        <p type="p">CH:通道結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">I1-I1':線</p>
        <p type="p">M_GS:主閘極結構</p>
        <p type="p">PP:突出圖案</p>
        <p type="p">S_GS:子閘極結構</p>
        <p type="p">SDB:分開結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="956" publication-number="202633170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D64/20</further-classification>
        <further-classification edition="202501120260424B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DEOK HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔韓秉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HAN BYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括：背側配線線的第一側上的第一和第二源極/汲極圖案；第一和第二源極/汲極圖案之間的通道圖案；第一源極/汲極圖案和背側配線線之間的背側源極/汲極接觸件；以及位於第二源極/汲極圖案和背側配線線之間、並與第二源極/汲極圖案接觸的犧牲半導體圖案。從背側配線線的第一側到第一源極/汲極圖案的最下部的高度大於從背側配線線的第一側到第二源極/汲極圖案的最下部的高度。背側源極/汲極接觸件包括連接到第一源極/汲極圖案的第一側、以及連接到背側配線線的第二側。背側源極/汲極接觸件的第一側具有凹形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: first and second source/drain patterns on a first side of a back wiring line; a channel pattern between the first and second source/drain patterns; a back source/drain contact between the first source/drain pattern and the back wiring line; and a sacrificial semiconductor pattern between the second source/drain pattern and the back wiring line, and in contact with the second source/drain pattern. A height from the first side of the back wiring line to a lowermost portion of the first source/drain pattern is greater than a height from the first side of the back wiring line to a lowermost portion of the second source/drain pattern. The back source/drain contact includes a first side connected to the first source/drain pattern, and a second side connected to the back wiring line. The first side of the back source/drain contact has a concave shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:第一背側配線線</p>
        <p type="p">50_S1:第一側</p>
        <p type="p">50_S2:第二側</p>
        <p type="p">120:閘極電極</p>
        <p type="p">130:閘極絕緣膜</p>
        <p type="p">140:閘極間隔件</p>
        <p type="p">145:閘極覆蓋圖案</p>
        <p type="p">150:第一源極/汲極圖案</p>
        <p type="p">151:半導體襯墊膜</p>
        <p type="p">151B:底部</p>
        <p type="p">151ISW:內側面</p>
        <p type="p">151OSW:外側面</p>
        <p type="p">151R:襯墊凹槽</p>
        <p type="p">151S:側壁部</p>
        <p type="p">152:半導體填充膜</p>
        <p type="p">155:背側接觸矽化物膜</p>
        <p type="p">160:第二源極/汲極圖案</p>
        <p type="p">160PH:第一犧牲半導體圖案</p>
        <p type="p">160PH_S1:接觸側</p>
        <p type="p">160PH_S2:底側</p>
        <p type="p">165:第一前側接觸矽化物膜</p>
        <p type="p">170:第一背側源極/汲極接觸件</p>
        <p type="p">170_S1:第一側</p>
        <p type="p">170_S2:第二側</p>
        <p type="p">175:第一前側源極/汲極接觸件</p>
        <p type="p">175_S1:第一側</p>
        <p type="p">175_S2:第二側</p>
        <p type="p">185:源極/汲極蝕刻終止膜</p>
        <p type="p">190:第一層間絕緣膜/第一前側層間絕緣膜</p>
        <p type="p">191:第二前側層間絕緣膜</p>
        <p type="p">195:前側配線結構</p>
        <p type="p">196:插塞</p>
        <p type="p">197:前側配線線</p>
        <p type="p">291:第一背側層間絕緣膜</p>
        <p type="p">A-A:線</p>
        <p type="p">CH1:第一通道圖案</p>
        <p type="p">CH1_US:上側</p>
        <p type="p">CHCT1:第一主動區絕緣圖案</p>
        <p type="p">CHCT1_S1:第一側</p>
        <p type="p">CHCT1_S2:第二側</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">H11、H12、H21、H22、H23、H31、H32:高度</p>
        <p type="p">I_GS:內部閘極結構</p>
        <p type="p">NS1:第一片狀圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="957" publication-number="202631163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含ｉＰＳ細胞或源自ｉＰＳ細胞之分化細胞的培養上清液之醫藥或美容用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260504B">A61K35/545</main-classification>
        <further-classification edition="201501120260504B">A61K35/28</further-classification>
        <further-classification edition="201501120260504B">A61K35/30</further-classification>
        <further-classification edition="201501120260504B">A61K35/407</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61P17/14</further-classification>
        <further-classification edition="200601120260504B">A61K8/98</further-classification>
        <further-classification edition="200601120260504B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科奧利浦思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUORIPS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤芳樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川光一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, KOUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日比野佐和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIBINO, SAWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥田雄一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUDA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤侑希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武村和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEMURA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大瑞希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物及其製造方法，該組成物包含iPS細胞的培養上清液或源自iPS細胞之細胞的培養上清液，且提供一種包含前述培養上清液之醫藥或美容用組成物及其製造方法。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="371px" width="560px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="958" publication-number="202631125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＰＩ３Ｋα突變選擇性抑制劑的用途</chinese-title>
        <english-title>USE OF A PI3Kα MUTATION-SELECTIVE INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4155</main-classification>
        <further-classification edition="200601120260504B">A61K9/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61K31/565</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏遠峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　谷良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, GU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種PI3Kα突變選擇性抑制劑的用途，具體的，為化合物1、其消旋物、立體異構物或其藥學上可接受的鹽在製備預防和/或治療HR陽性/HER2陰性乳腺癌、結腸癌和頭頸癌的藥物中的用途。所述化合物1可以抑制HR陽性/HER2陰性乳腺癌、結腸癌、頭頸部鱗狀細胞癌細胞生長且可與CDK4/6抑制劑或選擇性ER降解劑聯合應用，具有更好的治療效果和良好的安全性。  &lt;br/&gt;&lt;img align="absmiddle" height="165px" width="189px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of a PI3Kα mutation-selective inhibitor. Specifically, it pertains to the use of compound 1, a stereoisomer, or a pharmaceutically acceptable salt thereof in the preparation of a medicament for preventing and/or treating HR-positive/HER2-negative breast cancer, colon cancer, and head and neck cancer. Said compound 1 can inhibit the growth of HR-positive/HER2-negative breast cancer, colon cancer, and head and neck squamous cell carcinoma cells, and can be used in combination with a CDK4/6 inhibitor or a selective ER degrader, offering improved therapeutic efficacy and a favorable safety profile. &lt;br/&gt;&lt;img align="absmiddle" height="171px" width="199px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="959" publication-number="202633324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在半導體處理系統中查找晶圓中心之裝置及方法以及用於在半導體處理系統中準確定位晶圓之方法</chinese-title>
        <english-title>DEVICES AND METHODS FOR FINDING WAFER CENTER IN SEMICONDUCTOR PROCESSING SYSTEM AND METHOD FOR ACCURATELY POSITIONING WAFER IN SEMICONDUCTOR PROCESSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/00</main-classification>
        <further-classification edition="202601120260423B">H10P72/30</further-classification>
        <further-classification edition="202601120260423B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏斯特雷肯　西奧多羅斯　Ｇ　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOSTERLAKEN, THEODORUS G.M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班達爾　里吉　賽義德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAR RIGI, SAEID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科塔里　尼米特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTHARI, NIMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大體上是有關於半導體處理領域，且特別是有關於用於在半導體製造之各階段期間搬運及準確定位晶圓的裝置及方法。本發明進一步是有關於包含該等經特定設計之裝置的半導體處理系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to the field of semiconductor processing, and in particular devices and methods for handling and accurately positioning wafers during various stages of semiconductor manufacturing. The present disclosure further relates to semiconductor processing systems comprising said specifically designed devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">101:光源</p>
        <p type="p">102:偵測器</p>
        <p type="p">103:處理器</p>
        <p type="p">104:支撐件</p>
        <p type="p">105:晶圓</p>
        <p type="p">106:第一支腳</p>
        <p type="p">107:第二支腳</p>
        <p type="p">108:裝置之內部</p>
        <p type="p">109:接地導電板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="960" publication-number="202633361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改質裝置、處理系統及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/70</main-classification>
        <further-classification edition="202601120260423B">H10P95/40</further-classification>
        <further-classification edition="202601120260423B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三根陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINE, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山﨑穣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森泰夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關將膠帶框架所固持的裸晶的表面由電漿改質的改質裝置，具有：處理容器；氣體供給部，對於前述處理容器內供給處理氣體；電漿生成部，構成為在前述處理容器內生成前述處理氣體的電漿；及支撐部，配置在前述處理容器內，並且支撐前述膠帶框架，在前述支撐部所支撐的前述膠帶框架，設置蓋體，其配置成包圍前述膠帶框架所固持的前述裸晶，用於保護前述膠帶框架的框架的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">211:底部電極</p>
        <p type="p">212:静電夾具</p>
        <p type="p">212a:中央部</p>
        <p type="p">212b:周緣部</p>
        <p type="p">213:支撐體</p>
        <p type="p">213a:外周部</p>
        <p type="p">213b:內周部</p>
        <p type="p">217:貫通孔</p>
        <p type="p">218:貫通孔</p>
        <p type="p">220:蓋體</p>
        <p type="p">231:升降器</p>
        <p type="p">241:升降器</p>
        <p type="p">251:升降器</p>
        <p type="p">D:裸晶</p>
        <p type="p">F:框架</p>
        <p type="p">P:膠帶框架</p>
        <p type="p">P1:保管位置</p>
        <p type="p">P2:處理位置</p>
        <p type="p">T:膠帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="961" publication-number="202631894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紫外線硬化型矽酮組成物、矽酮硬化物及光學裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08L83/05</main-classification>
        <further-classification edition="200601120260416B">C08L83/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾愛里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小材利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAI, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種紫外線硬化型矽酮組成物，其包含下述(A)～(D)成分。(A)有機聚矽氧烷樹脂，其具有由下述式(1)表示的單元、R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;3&lt;/sub&gt;SiO&lt;sub&gt;1/2&lt;/sub&gt;單元、R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;SiO&lt;sub&gt;2/2&lt;/sub&gt;單元及SiO&lt;sub&gt;4/2&lt;/sub&gt;單元作為構成單元，且鍵結於矽原子上的一價有機基的總數之中的5%以上為芳基，&lt;br/&gt;&lt;img align="absmiddle" height="166px" width="574px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；&lt;br/&gt;  (B)有機矽化合物，其一分子中具有2個以上鍵結於矽原子上的氫原子，且具有鍵結於矽原子上的丙烯醯氧烷基、甲基丙烯醯氧烷基、丙烯醯氧烷氧基、或甲基丙烯醯氧烷氧基；(C)光活性型鉑錯合物觸媒；(D)光聚合起始劑。藉此，提供一種紫外線硬化型矽酮組成物，其在大氣下能夠在不需要加熱步驟的情形下藉由紫外線照射進行硬化，並且得到接著強度良好的硬化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="962" publication-number="202631467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>倉儲</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B65G1/00</main-classification>
        <further-classification edition="200601120260422B">B65G1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之倉儲具備有：堆高式起重機；第1門，其於關閉狀態下封閉維護區與存放區之間的通路；第2門，其於關閉狀態下禁止作業人員於外部空間與維護區之間移動；第1開閉感測器，其檢測第1門之開閉；第2開閉感測器，其檢測第2門之開閉；及控制部。控制部於藉由第1開閉感測器檢測到第1門的開啟狀態，且藉由第2開閉感測器檢測到第2門的關閉狀態時，控制堆高式起重機以使其於存放區與維護區之間移動，於藉由第1開閉感測器檢測到第1門的開啟狀態之期間，其將第2門上鎖，於藉由第1開閉感測器檢測到第1門的關閉狀態時，將第2門解鎖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:堆高式起重機(起重機)</p>
        <p type="p">22:第2壁體</p>
        <p type="p">24:端壁部</p>
        <p type="p">31:移行軌道</p>
        <p type="p">32:輔助軌道</p>
        <p type="p">41:內部高地板部</p>
        <p type="p">42:上走道</p>
        <p type="p">62:第2門</p>
        <p type="p">A:作業人員</p>
        <p type="p">F:地板面</p>
        <p type="p">FL:內部地板面</p>
        <p type="p">M1:左側維護區</p>
        <p type="p">S:棚架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="963" publication-number="202632231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01J1/44</main-classification>
        <further-classification edition="202501120260504B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井基晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, MOTOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種可謀求不使PDE特性惡化而減少死區時間之光檢測裝置。  &lt;br/&gt;本揭示之一實施形態之光檢測裝置具備雪崩光電二極體、至少1個電阻元件、及切換雪崩光電二極體與電阻元件之電性連接之複數個電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測裝置</p>
        <p type="p">A:陽極端子</p>
        <p type="p">INV:反相器元件</p>
        <p type="p">K:陰極端子</p>
        <p type="p">OUT:輸出端子</p>
        <p type="p">PD:雪崩光電二極體</p>
        <p type="p">R:電阻元件</p>
        <p type="p">SW1:第1信號線</p>
        <p type="p">Tr1:第1電晶體</p>
        <p type="p">Tr2:第2電晶體</p>
        <p type="p">VDD:電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="964" publication-number="202633405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P95/00</main-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中木戸智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAKIDO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村好貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 有效率地進行從罩杯內之排氣。  &lt;br/&gt;　　[解決手段] 本揭示之一態樣的基板處理裝置，係具備有：基板保持部，保持基板並使其旋轉；液供給部，將處理液供給至被保持於前述基板保持部之前述基板的表面；罩杯，包圍被保持於前述基板保持部的前述基板，沿著繞前述基板保持部之旋轉軸線的圓周方向，形成將氣體導引至該基板的背面之下方的流路；及排出導管，經由在前述罩杯內被設置於前述圓周方向的一部分之區域的排出口，排出前述罩杯內的氣體。前述排出口，係被形成為流路隨著遠離被保持於前述基板保持部的前述基板而擴展。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">52:基板保持部</p>
        <p type="p">52a:旋轉驅動部</p>
        <p type="p">52b:軸桿</p>
        <p type="p">52c:保持部</p>
        <p type="p">54:顯像液供給部</p>
        <p type="p">54a:供給源</p>
        <p type="p">54b:供給管</p>
        <p type="p">54c:顯像液噴嘴</p>
        <p type="p">56:沖洗液供給部(液供給部)</p>
        <p type="p">56a:供給源</p>
        <p type="p">56b:供給管</p>
        <p type="p">56c:沖洗液噴嘴</p>
        <p type="p">60:罩杯</p>
        <p type="p">61:底部</p>
        <p type="p">61a:傾斜面</p>
        <p type="p">62:外壁</p>
        <p type="p">62a:吸氣口</p>
        <p type="p">62b:傾斜壁部</p>
        <p type="p">62c:部分</p>
        <p type="p">63:內壁</p>
        <p type="p">63a:上端</p>
        <p type="p">64:環狀壁</p>
        <p type="p">66:蓋構件</p>
        <p type="p">69:排出口</p>
        <p type="p">72:傘狀部</p>
        <p type="p">73:環狀壁</p>
        <p type="p">78:腳部</p>
        <p type="p">78a:開口</p>
        <p type="p">80:排氣部</p>
        <p type="p">Ax:旋轉軸線</p>
        <p type="p">FP:流路</p>
        <p type="p">U1:液處理單元</p>
        <p type="p">W:晶圓</p>
        <p type="p">Wa:表面</p>
        <p type="p">Wb:背面</p>
        <p type="p">Wc:周緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="965" publication-number="202633030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成型體及成型體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K1/09</main-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="200601120260504B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商藤倉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKURA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野町健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMACHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥井純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORII, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西脇賢治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIWAKI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種成型體，其能容易地與外部連接。解決手段：成型體1為具備支撐體10、具有導電性的配線部30、將配線部30與支撐體10接合的接合層20的成型體。支撐體10包含：成型為立體形狀的成型基材11、以及具有可撓性的補強基材12。配線部30包含：接合至接合層20並同時包含接著劑樹脂及分散於接著劑樹脂的複數導電性粒子的第一導體層31、以及形成於第一導體層31上並同時由第一金屬材料所構成的第二導體層32。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成型體</p>
        <p type="p">1a:本體部</p>
        <p type="p">1c:立體形狀部</p>
        <p type="p">1b:尾部</p>
        <p type="p">10:支撐體</p>
        <p type="p">11:成型基材</p>
        <p type="p">12:補強基材</p>
        <p type="p">20:接合層</p>
        <p type="p">21:黏著材層</p>
        <p type="p">22:阻劑層</p>
        <p type="p">30:配線部</p>
        <p type="p">30a:電極部</p>
        <p type="p">30b:引出部</p>
        <p type="p">31:第一導體層</p>
        <p type="p">32:第二導體層</p>
        <p type="p">33:第三導體層</p>
        <p type="p">40:絕緣層</p>
        <p type="p">41:第一絕緣層</p>
        <p type="p">42:第二絕緣層</p>
        <p type="p">T1,T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="966" publication-number="202633427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微電子裝置之含銥薄膜沉積方法</chinese-title>
        <english-title>METHODS OF DEPOSITING IRIDIUM-CONTAINING FILMS FOR MICROELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W20/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　昌丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, CHANDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　鳳全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FENG Q.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　智遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　杰叢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JIECONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇迪喬諾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDIJONO, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案描述一種製造互連結構的方法，作為微電子裝置製造過程的一部分。也描述了選擇性沉積含銥薄膜的方法。這些方法包括將基板（該基板包含金屬材料和介電材料）暴露於含銥的前驅物及反應物中，以形成含銥薄膜。含銥薄膜相對於介電材料在金屬材料上選擇性生長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of manufacturing interconnect structures as part of a microelectronic device fabrication process are described. Methods of selectively depositing iridium-containing films are also described. The methods include exposing a substrate including a metallic material and a dielectric material to an iridium-containing precursor and a reactant to form the iridium-containing film. The iridium-containing film selectively grows on the metallic material relative to the dielectric material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110:操作</p>
        <p type="p">120:操作</p>
        <p type="p">130:操作</p>
        <p type="p">140:操作</p>
        <p type="p">150:操作</p>
        <p type="p">160:操作</p>
        <p type="p">170:操作</p>
        <p type="p">180:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="967" publication-number="202631838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻燃交聯聚丙烯薄膜及包括其的保護殼</chinese-title>
        <english-title>FLAME-RETARDANT CROSSLINKED POLYPROPYLENE FILM AND PROTECTIVE HOUSING COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08J5/18</main-classification>
        <further-classification edition="201801120260417B">C08K3/016</further-classification>
        <further-classification edition="200601120260417B">C08K5/49</further-classification>
        <further-classification edition="200601120260417B">C08F2/46</further-classification>
        <further-classification edition="200601120260417B">C08L23/16</further-classification>
        <further-classification edition="200601120260417B">B32B27/18</further-classification>
        <further-classification edition="200601120260417B">B32B27/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎玉璽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, YUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, RUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種阻燃交聯聚丙烯薄膜及包括其的保護殼。所述阻燃交聯聚丙烯薄膜的交聯度不小於36%。本案的阻燃交聯PP薄膜保留了PP樹脂的力學性能和絕緣性能，以使得阻燃交聯PP薄膜能夠用於電器設備的保護殼。並且本案的阻燃交聯PP薄膜具有優良的耐熱性能，提高了阻燃交聯PP薄膜的熔化溫度，使得阻燃交聯PP薄膜在受熱時不容易變形，從而使阻燃交聯PP薄膜具有更好的可靠性，用途更加廣泛。此外本案的阻燃交聯PP薄膜選擇輻照交聯的方法，簡化了交聯反應的程序，使得阻燃交聯PP薄膜便於加工成型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a flame-retardant crosslinked polypropylene film and a protective housing comprising the same. The crosslinked PP film has a crosslinking degree of not less than 36%. The flame-retardant crosslinked PP film retains the mechanical and insulating properties of the PP resin, enabling its use as a protective housing for electrical devices. In addition, the flame-retardant crosslinked PP film exhibits excellent heat resistance, with an increased melting temperature, so that it is less prone to deformation under heat, thereby enhancing the reliability and broadening the application scope of the flame-retardant crosslinked PP film. Moreover, the flame-retardant crosslinked PP film of the present application is prepared using irradiation crosslinking, which simplifies the crosslinking process and facilitates easier processing and forming of the film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電器裝置</p>
        <p type="p">201:保護殼</p>
        <p type="p">202:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="968" publication-number="202631671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密連蛋白－１／ＥＧＦＲ雙特異性抗體</chinese-title>
        <english-title>CLAUDIN-1/EGFR BISPECIFIC ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商阿倫蒂斯治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALENTIS THERAPEUTICS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾森　格雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSON, GREG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧梭　弗朗索瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUSSEAU, FRANCOIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托索　阿爾伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSO, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊默曼　蒂娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIMMERMANN, TINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特謝拉　傑弗里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIXEIRA, GEOFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾斯　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊阿科內　羅伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IACONE, ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露有關與密連蛋白1和EGFR結合之雙特異性抗體及其於治療疾病(例如，癌症)之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to bispecific antibodies that bind Claudin 1 and EGFR and their use in treating diseases, for example, cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="969" publication-number="202631158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>siRNA、含有siRNA的綴合物、醫藥組成物及其用途</chinese-title>
        <english-title>SIRNA, CONJUGATE WHICH CONTAIN SIRNA, PHARMACEUTICAL COMPOSITION AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/713</main-classification>
        <further-classification edition="201001120260504B">C12N15/113</further-classification>
        <further-classification edition="201701120260504B">A61K47/54</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
        <further-classification edition="200601120260504B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商翰森生物有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSOH BIO LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管小陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, XIAOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王叢茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CONGMAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙松輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及干擾靶基因表達或抑制其表達的siRNA，例如雙鏈核糖核酸（dsRNA）。本發明還涉及包含siRNA的綴合物或藥物組合物，以及siRNA、其綴合物和藥物組合物在製備用於治療和/或預防疾病或病症的藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to siRNA, e.g., double stranded ribonucleic acid (dsRNA), that interfere with target gene expression or inhibit its expression. The invention also relates to a conjugate or a pharmaceutical composition containing the siRNA. And the use of the siRNA, the conjugate and the pharmaceutical composition thereof in preparing a drug used for treating and/or preventing the disease or disorder.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="970" publication-number="202633406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、實驗方法及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P95/00</main-classification>
        <further-classification edition="200601120260423B">G05B17/02</further-classification>
        <further-classification edition="200601120260423B">G05D23/19</further-classification>
        <further-classification edition="202601120260423B">H10P14/60</further-classification>
        <further-classification edition="202601120260423B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安崎遼路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANZAKI, RYOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠於用以使基板處理裝置模型化之實驗中削減實驗次數的資訊處理方法、實驗方法及電腦程式。  &lt;br/&gt;於本發明之資訊處理方法中，獲取控制對象模型，該控制對象模型包含基板處理裝置中之複數個控制對象，且各個控制對象與其他控制對象中之一部分控制對象相互作用；獲取為了在上述基板處理裝置中進行實驗而應對控制對象進行之複數個控制內容；根據特定條件，將上述控制對象模型所含之複數個控制對象分類為複數個群組；藉由創建複數種對上述複數個群組之每一群組分配彼此不同之控制內容之組合，而創建複數種實驗條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置</p>
        <p type="p">21:基板處理裝置</p>
        <p type="p">22:控制裝置</p>
        <p type="p">100:基板處理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="971" publication-number="202633407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式、資訊處理方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P95/00</main-classification>
        <further-classification edition="200601120260423B">G05B23/02</further-classification>
        <further-classification edition="202301120260423B">G06N5/00</further-classification>
        <further-classification edition="200601120260423B">G06F11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小坂井千紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKAI, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井川仁美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OIGAWA, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲谷地哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGARIYACHI, TETSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡勇樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可期待支援使用基板處理裝置之使用者之電腦程式、資訊處理方法及資訊處理裝置。  &lt;br/&gt;本實施方式之電腦程式使電腦執行如下處理：獲取與基板處理裝置之故障相關之故障資訊、及由已實施基板處理之上述基板處理裝置輸出之日誌資訊，基於所獲取之上述故障資訊及上述日誌資訊，藉由使用記憶有與上述基板處理裝置相關之資訊之知識資料庫的語言模型，產生與針對上述故障之應對措施相關之應對措施資訊，且輸出所產生之上述應對措施資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置(電腦)</p>
        <p type="p">3:基板處理裝置</p>
        <p type="p">5:知識DB</p>
        <p type="p">11:處理部</p>
        <p type="p">11a:資訊收集部</p>
        <p type="p">11b:應對措施產生部</p>
        <p type="p">11c:配方產生部</p>
        <p type="p">11d:模擬處理部</p>
        <p type="p">11e:控制處理部</p>
        <p type="p">11f:顯示處理部</p>
        <p type="p">12:記憶部</p>
        <p type="p">12a:程式(電腦程式)</p>
        <p type="p">12b:學習模型記憶部</p>
        <p type="p">13:通信部</p>
        <p type="p">14:顯示部</p>
        <p type="p">15:操作部</p>
        <p type="p">99:記錄媒體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="972" publication-number="202632410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光導裝置及包括光導裝置之相機模組</chinese-title>
        <english-title>LIGHT GUIDE DEVICE AND CAMERA MODUE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260504B">G03B17/02</main-classification>
        <further-classification edition="202101120260504B">G03B19/02</further-classification>
        <further-classification edition="201201120260504B">B60W40/08</further-classification>
        <further-classification edition="202201120260504B">G06V10/14</further-classification>
        <further-classification edition="202201120260504B">G06V20/59</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金範振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BUM JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，揭露一種相機模組，該相機模組包括一光源部分，其發射光；一光導裝置，其將自該光源部分發射之該光引導至一物體且引導由該物體反射之光；以及一光接收部分，其接收由該物體反射且由該光導裝置引導之該光，其中該光導裝置包括一基體、安置於該基體上之一輸入繞射元件、安置於該基體上之一輸入與輸出繞射元件及安置於該基體上之一輸出繞射元件，且該輸入繞射元件被形成為基於該輸入繞射元件之一光柵向量根據該光之一波長來改變自該光源部分發射之該光之一光軸之一入射角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment, disclosed is a camera module which includes a light source part which emits light, a light guide device which guides the light emitted from the light source part to an object and guides light reflected by the object, and a light receiving part which receives the light reflected by the object and guided by the light guide device, wherein the light guide device includes a substrate, an input diffraction element disposed on the substrate, an input and output diffraction element disposed on the substrate, and an output diffraction element disposed on the substrate, and the input diffraction element is formed to change an incident angle of an optical axis of the light emitted from the light source part based on a grating vector of the input diffraction element according to a wavelength of the light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="973" publication-number="202633247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251008B">H10K59/12</main-classification>
        <further-classification edition="202301120251008B">H10K59/80</further-classification>
        <further-classification edition="202301120251008B">H10K50/816</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳裕雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜育維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勇勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，其包括透明顯示裝置，且包括基板、第一導電層、第一絕緣層、第二導電層以及導電圖案。基板具有多個單元，其中多個單元中的至少一者包括穿透區以及畫素區，其中穿透區的面積大於畫素區的面積。第一導電層設置於基板上，且包括對應設置於畫素區中的第一電極以及第二電極。第一絕緣層設置於第一導電層上。第二導電層設置於第一絕緣層上，且包括對應設置於畫素區中的第三電極以及第四電極，其中在基板的法線方向上，第一電極與第三電極重疊以形成第一電容，且第二電極與第四電極重疊以形成第二電容。導電圖案在法線方向上重疊於第一電容與第二電容之間的空隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a transparent display device and including a substrate, a first conductive layer, a first insulating layer, a second conductive layer and a conductive pattern is provided. The substrate has a plurality of units, wherein at least one of the plurality of units includes a transmission region and a pixel region, wherein an area of ​​the transmission region is greater than an area of ​​the pixel region. The first conductive layer is disposed on the substrate, and includes a first electrode and a second electrode correspondingly located in the pixel region. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer, and includes a third electrode and a fourth electrode correspondingly located in the pixel region, wherein in a normal direction of the substrate, the first electrode and the third electrode overlap to form a first capacitor, and the second electrode and the fourth electrode overlap to form a second capacitor. The conductive pattern overlaps a gap between the first capacitor and the second capacitor in the normal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">CL:訊號線</p>
        <p type="p">PX、PX1、PX2、PX3:子畫素</p>
        <p type="p">SB:基板</p>
        <p type="p">U:單元</p>
        <p type="p">U1:畫素區</p>
        <p type="p">U2:穿透區</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="974" publication-number="202631190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療潰瘍性結腸炎之泛ELR+　CXC趨化介素抗體及IL-23p19抗體</chinese-title>
        <english-title>PAN-ELR+ CXC CHEMOKINE ANTIBODIES AND IL-23P19 ANTIBODIES FOR THE TREATMENT OF ULCERATIVE COLITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/24</further-classification>
        <further-classification edition="200601120260504B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道寧　安凱瑟琳　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWNING, ANNCATHERINE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　詩明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　迪帕克　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, DIPAK R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供結合至ELR+ CXC趨化介素之抗體與結合至人類IL-23p19之抗體組合用於治療潰瘍性結腸炎的方法及用途。本發明亦提供結合至ELR+ CXC趨化介素之抗體與結合至人類IL-23p19之抗體組合用於治療潰瘍性結腸炎之該等方法及用途的劑量及給藥方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods and uses of antibodies that bind to ELR+ CXC chemokines in combination with antibodies that bind to human IL-23p19 for the treatment of ulcerative colitis. Also provided are doses and dosing regimens for the methods and uses of antibodies that bind to ELR+ CXC chemokines in combination with antibodies that bind to human IL-23p19 for the treatment of ulcerative colitis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="975" publication-number="202632859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換電路及其控制方法</chinese-title>
        <english-title>POWER CONVERSION CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260119B">H02M3/04</main-classification>
        <further-classification edition="200601120260119B">H02M3/156</further-classification>
        <further-classification edition="200701120260119B">H02M1/38</further-classification>
        <further-classification edition="200601120260119B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TA-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅立狄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, LI-DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換電路包括變壓器、切換電晶體、輔助電晶體以及控制電路。變壓器包括初級線圈、次級線圈以及輔助線圈，初級線圈接收輸入電壓，次級線圈產生輸出電壓。切換電晶體耦接於初級線圈以及接地端之間。輔助電晶體耦接至輔助線圈之一端以及接地端之間。控制電路基於輸出電壓，而驅動切換電晶體。當變壓器結束退磁且延遲既定延遲時間時，控制電路於零電壓切換時間中導通輔助電晶體，使得切換電晶體再次導通時達到零電壓切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion circuit includes a transformer, a switching transistor, an auxiliary transistor, and a control circuit. The transformer includes a primary coil, a secondary coil, and an auxiliary coil. The primary coil receives an input voltage, and the secondary coil generates an output voltage. The switching transistor is coupled between the primary coil and a ground. The auxiliary coil is coupled between a terminal of the auxiliary coil and the ground. The control circuit drives the switch transistor based on the output voltage. When the transformer ends the demagnetization, the control circuit turns on the auxiliary transistor in a zero-voltage switching period, so that zero-voltage switching is achieved when the switching transistor is turned on once again.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源轉換電路</p>
        <p type="p">110:切換電晶體</p>
        <p type="p">110D:第一寄生二極體</p>
        <p type="p">110C:寄生電容</p>
        <p type="p">120:控制電路</p>
        <p type="p">130:整流電晶體</p>
        <p type="p">130D:第二寄生二極體</p>
        <p type="p">140:次級控制電路</p>
        <p type="p">150:輔助電晶體</p>
        <p type="p">150D:第三寄生二極體</p>
        <p type="p">160:分壓電路</p>
        <p type="p">CIN:輸入電容</p>
        <p type="p">TM:變壓器</p>
        <p type="p">RCS:電流偵測電阻</p>
        <p type="p">CO:輸出電容</p>
        <p type="p">PD:光耦合元件</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">PS:初級線圈</p>
        <p type="p">SS:次級線圈</p>
        <p type="p">AS:輔助線圈</p>
        <p type="p">SW:切換信號</p>
        <p type="p">VDS:汲極電壓</p>
        <p type="p">VO:輸出電壓</p>
        <p type="p">VSR:同步電壓</p>
        <p type="p">SG:閘極信號</p>
        <p type="p">IFB:回授電流</p>
        <p type="p">VFB:回授信號</p>
        <p type="p">CD:輔助電容</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">VDD:供應電壓</p>
        <p type="p">RD1:第一分壓電阻</p>
        <p type="p">RD2:第二分壓電阻</p>
        <p type="p">SA:輔助控制信號</p>
        <p type="p">VA:輔助電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="976" publication-number="202632383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光引導裝置</chinese-title>
        <english-title>LIGHT GUIDE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G02B27/44</main-classification>
        <further-classification edition="200601120260416B">G02B6/00</further-classification>
        <further-classification edition="202101120260416B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銀晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, EUN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李揆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYU TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例之一光引導裝置係一種光引導裝置，其包括：一板部分，其中光在該板部分中經完全反射；一第一繞射部分，其經組態以使在該板部分內部經完全反射之該光繞射至外部；一第二繞射部分，其經組態以使入射至該板部分中之該光朝向該第一繞射部分繞射；以及一相機模組，其安置為鄰近於該第一繞射部分且藉由該第一繞射部分繞射之該光入射於其上，其中該第一繞射部分及該第二繞射部分各自包括在該光入射於其上之一入射表面上具有一傾斜之一光柵圖樣，且該板部分朝向一物體傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light guide device according to an embodiment of the present invention is a light guide device including a plate portion in which light is totally reflected therein, a first diffraction portion configured to diffract the light totally reflected inside the plate portion to the outside, a second diffraction portion configured to diffract the light incident into the plate portion toward the first diffraction portion, and a camera module which is disposed adjacent to the first diffraction portion and on which the light diffracted by the first diffraction portion is incident, wherein the first diffraction portion and the second diffraction portion each include a grating pattern having an inclination on an incident surface on which the light is incident, and the plate portion is inclined toward an object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:板部分</p>
        <p type="p">200:第一繞射部分</p>
        <p type="p">300:第二繞射部分</p>
        <p type="p">400:相機模組</p>
        <p type="p">A1:第一配置角度</p>
        <p type="p">G:顯示器</p>
        <p type="p">L1:第一距離</p>
        <p type="p">L2:第二距離</p>
        <p type="p">V1:向量</p>
        <p type="p">V2:向量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="977" publication-number="202632330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光引導裝置</chinese-title>
        <english-title>LIGHT GUIDE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G02B6/00</main-classification>
        <further-classification edition="202301120260423B">H04N23/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銀晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, EUN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例之一光引導裝置係一種光引導裝置，其包括：一板部分，其中光經完全反射；一第一繞射部分，其安置在該板部分上且該光入射於其上；一第二繞射部分，其安置在該板部分上且該光透過其自該板部分之內部發射至外部；以及至少一個第三繞射部分，其安置在該板部分上且安置在該第一繞射部分與該第二繞射部分之間，其中該第一繞射部分使入射於該板部分中之該光朝向該第二繞射部分繞射，且該第三繞射部分使在該板部分內部完全反射之該光朝向該第二繞射部分繞射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light guide device according to an embodiment of the present invention is a light guide device including a plate portion in which light is totally reflected, a first diffraction portion which is disposed on the plate portion and on which the light is incident, a second diffraction portion which is disposed on the plate portion and through which the light is emitted from inside to outside of the plate portion, and at least one third diffraction portion disposed on the plate portion and disposed between the first diffraction portion and the second diffraction portion, wherein the first diffraction portion diffracts the light incident in the plate portion toward the second diffraction portion, and the third diffraction portion diffracts the light totally reflected inside the plate portion toward the second diffraction portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:板部分</p>
        <p type="p">200:第一繞射部分</p>
        <p type="p">300:第二繞射部分</p>
        <p type="p">400:第三繞射部分</p>
        <p type="p">V1:方向</p>
        <p type="p">V2:方向</p>
        <p type="p">W1:第一長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="978" publication-number="202631799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯共聚物</chinese-title>
        <english-title>POLYESTER COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08G63/183</main-classification>
        <further-classification edition="200601120260416B">C08G63/199</further-classification>
        <further-classification edition="200601120260416B">C08G63/672</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慎鏞埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YONG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO-KYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亥里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAE-RI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種聚酯共聚物，其包含衍生自第一二羧酸組分之重複單元A；衍生自第二二羧酸組分之重複單元B；及衍生自第一二醇組分之重複單元C。該聚酯共聚物可具有增強之生物降解性，同時其具有柔軟度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a polyester copolymer, which comprises a repeat unit A derived from a first dicarboxylic acid component; a repeat unit B derived from a second dicarboxylic acid component; and a repeat unit C derived from a first diol component. The polyester copolymer can have enhanced biodegradability while it has softness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="979" publication-number="202632882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦合器和晶片</chinese-title>
        <english-title>COUPLER AND CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">H03F1/56</main-classification>
        <further-classification edition="200601120260416B">H03F3/21</further-classification>
        <further-classification edition="200601120260416B">H03F3/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴乾淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GEONHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炅煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炳澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, BYEONGTAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYUNCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉相珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許準會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JOONHOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供耦合器和晶片。耦合器包括多個單元電路，連接到多個差動線對和單端線路；以及多個隔離電阻器，連接在多個差動線對之間，其中多個單元電路中的各個單元電路包括：變壓器，包括初級側，連接到多個差動線對中的一個差動線對，以及次級側，連接到單端線路，以及次級側電容器，與次級側並聯連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coupler and a chip are provided. The coupler includes a plurality of unit circuits connected to a plurality of differential line pairs and a single-ended line; and a plurality of isolation resistors connected between the plurality of differential line pairs, wherein each unit circuit of the plurality of unit circuits includes: a transformer including a primary side connected to one differential line pair among the plurality of differential line pairs, and a secondary side connected to the single-ended line, and a secondary-side capacitor connected in parallel to the secondary side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">DL1:差動線對</p>
        <p type="p">DL2:差動線對</p>
        <p type="p">DLN:差動線對</p>
        <p type="p">AMP1:放大器</p>
        <p type="p">AMP2:放大器</p>
        <p type="p">AMPN:放大器</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">SEL:單端線路</p>
        <p type="p">R&lt;sub&gt;ISO11&lt;/sub&gt;/R&lt;sub&gt;ISO12&lt;/sub&gt;:隔離電阻器/第一隔離電阻器</p>
        <p type="p">R&lt;sub&gt;ISO21&lt;/sub&gt;/R&lt;sub&gt;ISO22&lt;/sub&gt;:隔離電阻器/第二隔離電阻器</p>
        <p type="p">R&lt;sub&gt;ISO1N&lt;/sub&gt;:隔離電阻器/第一隔離電阻器</p>
        <p type="p">R&lt;sub&gt;ISO2N&lt;/sub&gt;:隔離電阻器/第二隔離電阻器</p>
        <p type="p">100:晶片</p>
        <p type="p">110:耦合器</p>
        <p type="p">UC1:單元電路</p>
        <p type="p">UC2:單元電路</p>
        <p type="p">UCN:單元電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="980" publication-number="202631907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>著色組成物、膜、濾色器、固體攝像元件及圖像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09B29/20</main-classification>
        <further-classification edition="200601120260504B">C09B57/00</further-classification>
        <further-classification edition="200601120260504B">C09B57/04</further-classification>
        <further-classification edition="200601120260504B">C09B67/22</further-classification>
        <further-classification edition="200601120260504B">C09B67/46</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本啓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種著色組成物，其含有著色劑、樹脂、聚合性化合物及聚合起始劑，上述著色劑包含3種以上的二酮吡咯并吡咯顏料及異吲哚啉顏料。本發明亦提供一種使用了前述著色組成物之膜、濾色器、固體攝像元件及圖像顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="981" publication-number="202631348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人控制裝置、機器人系統及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B25J9/16</main-classification>
        <further-classification edition="200601120260427B">G05B19/425</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡宣章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器人控制裝置包含：位置補正部，在已預先教示之前述機器人的複數個教示點之各者上所檢測出的接收位準，且是外部裝置所具備之第二無線機器與對該第二無線機器相互地進行無線通信之第一無線機器之間的接收位準比預定值更低之情形下，補正前述複數個教示點當中之前述接收位準比前述預定值更低的教示點之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:機器人系統</p>
        <p type="p">10:機器人</p>
        <p type="p">20:機器人控制裝置</p>
        <p type="p">21:顯示部</p>
        <p type="p">22:輸入部</p>
        <p type="p">30:PC(第二裝置、外部裝置)</p>
        <p type="p">31:接收位準監視部</p>
        <p type="p">32:判定部</p>
        <p type="p">33:接收位準通知部</p>
        <p type="p">34:位置補正部</p>
        <p type="p">40:記憶部</p>
        <p type="p">61:第一無線機器</p>
        <p type="p">62:第二無線機器</p>
        <p type="p">C:動作程式</p>
        <p type="p">E1,E2,Em:檢測部</p>
        <p type="p">M1,M2,Mm:驅動部</p>
        <p type="p">R:接收位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="982" publication-number="202632381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學構件之配置結構及顯示體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G02B27/02</main-classification>
        <further-classification edition="200601120260422B">G02F1/13363</further-classification>
        <further-classification edition="200601120260422B">G09F9/00</further-classification>
        <further-classification edition="200601120260422B">H04N5/64</further-classification>
        <further-classification edition="201801120260422B">H04N13/344</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學構件之配置結構，該光學構件可調整從顯示面往斜向射出之光。關於本發明實施形態之光學構件之配置結構，該光學構件係設於對使用者顯示影像之顯示體；且，前述光學構件之配置結構具備第一偏光構件、調整構件及第二偏光構件。第一偏光構件、調整構件及第二偏光構件係朝使用者依序配置。調整構件包含λ/2構件。從使用者側觀看第二偏光構件時，第二偏光構件之透射軸與第一偏光構件之透射軸係大致正交；且第二偏光構件之透射軸與λ/2構件之慢軸係構成40°~50°之角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學構件之配置結構</p>
        <p type="p">3:使用者之眼睛</p>
        <p type="p">12:顯示元件</p>
        <p type="p">12a:顯示面</p>
        <p type="p">30:調整構件</p>
        <p type="p">31:第一偏光構件</p>
        <p type="p">32:第二偏光構件</p>
        <p type="p">100:顯示體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="983" publication-number="202633408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式、資訊處理方法、學習用資料之產生方法、學習模型之產生方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P95/00</main-classification>
        <further-classification edition="202601120260423B">H10P74/00</further-classification>
        <further-classification edition="202301120260423B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川人大希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHITO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大見則文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMI, NORIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相田航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIDA, KOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長池宏史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAIKE, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電腦程式、資訊處理方法、學習用資料之產生方法、學習模型之產生方法及資訊處理裝置，其等有望支援應對基板處理裝置之周用容器內所產生之微粒的措施。  &lt;br/&gt;本實施方式之電腦程式使電腦執行如下處理：獲取微粒資料，該微粒資料包含基板處理裝置之處理容器內所產生之微粒之位置資訊；向第1學習模型輸入所獲取到之微粒資料，該第1學習模型已以將微粒資料作為輸入而受理，輸出與微粒之回收方法相關之資訊之方式進行過機器學習；獲取上述第1學習模型所輸出之與回收方法相關之資訊；輸出所獲取到之上述與回收方法相關之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1,1A,1B:資訊處理裝置(電腦)</p>
        <p type="p">3,3A,3B:基板處理裝置</p>
        <p type="p">4:製程DB</p>
        <p type="p">5:發塵源預測模型(第2學習模型)</p>
        <p type="p">6:回收方法預測模型(第1學習模型)</p>
        <p type="p">7:模型DB</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="984" publication-number="202633378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣動定位裝置控制學習</chinese-title>
        <english-title>LEARNING FOR CONTROLLING PNEUMATIC DRIVEN POSITIONING DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/78</main-classification>
        <further-classification edition="200601120260423B">F15B13/04</further-classification>
        <further-classification edition="200601120260423B">F15B15/28</further-classification>
        <further-classification edition="200601120260423B">F15B19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＶＡＴ控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAT HOLDING AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格瑞索　伊曼紐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRASSO, EMANUELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卜杜拉齊茲　卡里姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABDELAZIZ, KARIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種提供用於控制一真空系統(1)之控制參數的方法，該真空系統(1)包含至少一第一氣動定位裝置(10)，其經配置為在一可由一真空處理腔室提供之製程氣體區域中移動及定位一作用元件，其中該第一氣動定位裝置(10)包含一經配置為保持該作用元件之第一座體，以及一第一氣壓致動器，其連接至該第一座體並以該第一座體可沿一第一運動軸線移動之方式與該第一座體交互作用。該系統(1)亦包含一第一控制閥(21)，其連接至該第一氣壓致動器及一第一流體供應源(35)且經配置為變化該第一氣壓致動器中之壓力以提供該第一座體之移動；以及一第一流體感測器(22)，其經佈置且配置為量測該第一氣壓致動器之壓力。該方法進一步包含：對該第一控制閥(21)施加一第一控制訊號以變化該第一氣壓致動器之壓力，並藉此將該第一座體從一第一起始位置移動至一第一終點位置；藉由該第一流體感測器(22)監測該第一氣壓致動器之變化壓力；確定該第一座體何時到達該第一終點位置；以及基於處理一組觀察參數來導出該等控制參數，其中該組觀察參數至少包含該第一控制訊號、該變化壓力，以及關於該第一座體到達該第一終點位置之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for providing controlling parameters for controlling a vacuum system (1), the vacuum system (1) comprises at least a first pneumatic positioning device (10) configured for moving and positioning an effecting element in a process atmosphere region which is providable by a vacuum process chamber, wherein the first pneumatic positioning device (10) comprises a first mount configured to hold the effecting element and a first pneumatic actuator which is connected to the first mount and which interacts with the first mount in such a way that the first mount is movable along a first movement axis. The system (1) also comprises a first control valve (21) connected to the first pneumatic actuator and to a first fluid supply (35) and configured to vary the pressure in the first pneumatic actuator to provide movement of the first mount, and a first fluid sensor (22) arranged and configured to measure the pressure of the first pneumatic actuator. The method further comprises applying a first controlling signal to the first control valve (21) to vary the pressure of the first pneumatic actuator and, by that, moving the first mount from a first starting position to a first end position, monitoring the varying pressure of the first pneumatic actuator by means of the first fluid sensor (22), determining when the first mount arrives at the first end position, and deriving the controlling parameters based on processing a set of observed parameters, wherein the set of observed parameters comprises at least the first controlling signal, the varying pressure, and an information concerning the arrival of the first mount at the first end position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:真空系統</p>
        <p type="p">10:銷升降裝置</p>
        <p type="p">21:第一控制閥</p>
        <p type="p">22:第一流體感測器</p>
        <p type="p">30:控制單元</p>
        <p type="p">35:流體供應源</p>
        <p type="p">61:壓力感測器</p>
        <p type="p">62:壓力感測器</p>
        <p type="p">63:排放壓力感測器</p>
        <p type="p">64:位置感測器</p>
        <p type="p">65:溫度感測器</p>
        <p type="p">66:環境壓力感測器</p>
        <p type="p">67:感測單元</p>
        <p type="p">68:模型輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="985" publication-number="202632266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用殘餘氣體感測器來偵測真空負載鎖定件中的晶圓釋氣的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DETECTING WAFERS OUTGASSING IN A VACUUM LOAD-LOCK USING A RESIDUAL GAS SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260423B">G01N27/62</main-classification>
        <further-classification edition="200601120260423B">H01J49/40</further-classification>
        <further-classification edition="202601120260423B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞克尼爾　伊利特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUACH NIR, IRIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧勒　斯芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUHLE, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種用於偵測及/或最小化從樣品釋放到工具中的釋氣污染的系統和方法，該系統包括：工具，該工具被配置為表徵被測試樣品，其中該表徵工具的操作條件包括達到10&lt;sup&gt;-6&lt;/sup&gt;托或更高的真空水平；負載鎖定腔室；及飛行時間殘餘氣體分析儀(TOF-RGA)感測器，該飛行時間殘餘氣體分析儀感測器與該負載鎖定腔室流體流動連通，該TOF-RGA被配置為提供從該被測試樣品釋放到該負載鎖定腔室中的氣體的組成的即時量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are a system and a method for detecting and/or minimizing outgassing contamination released from a sample into a tool, the system including: a tool configured to characterize a tested sample, wherein operation conditions of the characterization tool includes reaching a vacuum level of 10-6 Torr or higher, a load lock chamber, and a time-of-flight residual gas analyzer (TOF-RGA) sensor in fluid flow communication with the load-lock chamber, the TOF-RGA is configured to provide a real-time measurement of a composition of gasses released from the tested sample into the load lock chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:曲線圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="986" publication-number="202631725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>補強膜、附補強膜之裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08F2/48</main-classification>
        <further-classification edition="201801120260420B">C09J7/22</further-classification>
        <further-classification edition="200601120260420B">C09J133/10</further-classification>
        <further-classification edition="200601120260420B">C08F220/18</further-classification>
        <further-classification edition="201901120260420B">B32B7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山千絵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴野匡哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBANO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀内佳之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福富秀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUTOMI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井川真宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKAWA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之補強膜(10)具備固著積層於膜基材(1)之一主面上之黏著劑層(2)。黏著劑層由光硬化性組合物形成，上述光硬化性組合物包含具有交聯結構之丙烯酸系基礎聚合物、光硬化劑及光聚合起始劑，作為光硬化劑，包含含有異氰尿酸骨架之多官能(甲基)丙烯酸酯。本發明之補強膜在剛與被黏著體貼合之後容易剝離，於與被黏著體貼合之後藉由將黏著劑光硬化能夠與被黏著體牢固地接著，即使在反覆進行彎曲及伸展時亦不易發生從被黏著體之剝離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜基材</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">10:補強膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="987" publication-number="202633306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P70/00</main-classification>
        <further-classification edition="202601120260423B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅﨑翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEZAKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林田貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHIDA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島幹雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, MIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種能提高處理容器內的氣流均勻性的技術。  &lt;br/&gt;　　本公開的一態樣所致的基板處理裝置，具備處理容器、在上述處理容器內的保持位置以水平姿勢保持基板的保持部、以及從上述處理容器的側方將處理流體供給至上述處理容器內部的流體供給部，且在上述基板被保持於上述保持部的狀態下，包含上述基板的上面之第1虛擬面與上述處理容器的頂面之間的第1距離，和包含上述基板的下面之第2虛擬面與上述處理容器的底面之間的第2距離不同，上述流體供給部具有改變上述處理流體流動的噴嘴，上述噴嘴具有從比上述第1虛擬面更上方的位置以第1吐出量吐出上述處理流體的第1吐出部，以及從比上述第2虛擬面更下方的位置以第2吐出量吐出上述處理流體的第2吐出部，且上述第1吐出量與上述第2吐出量之間的大小關係與上述第1距離和上述第2距離之間的大小關係一致。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:處理容器</p>
        <p type="p">110a:頂面</p>
        <p type="p">110b:底面</p>
        <p type="p">110s:第1面</p>
        <p type="p">131:供給本體</p>
        <p type="p">131a:凹部</p>
        <p type="p">131b:內部流路</p>
        <p type="p">131c:吐出口</p>
        <p type="p">131s:第2面</p>
        <p type="p">161:密封溝</p>
        <p type="p">162:密封構件</p>
        <p type="p">210:噴嘴</p>
        <p type="p">211:第1吐出部</p>
        <p type="p">211h:第1孔</p>
        <p type="p">212:第2吐出部</p>
        <p type="p">212h:第2孔</p>
        <p type="p">G1:間隙</p>
        <p type="p">P1~P6:位置</p>
        <p type="p">S1:處理空間</p>
        <p type="p">S2:供給空間</p>
        <p type="p">W:基板</p>
        <p type="p">Wa:第1虛擬面</p>
        <p type="p">Wb:第2虛擬面</p>
        <p type="p">Z1:第1距離</p>
        <p type="p">Z2:第2距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="988" publication-number="202632238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓阻式力感測結構及系統</chinese-title>
        <english-title>PIEZORESISTIVE FORCE SENSING STRUCTURES AND SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G01L1/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　在　亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JAE HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施卓勒曼　潔西卡　劉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROHMANN, JESSICA LIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宏仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟德全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, DEQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示使用壓阻元件的力感測結構及系統，以及使用此類力感測結構及系統之方法。在一些實施例中，一種設備可包括一橋接電路，其經組態以偵測施加至該設備的一力，該橋接電路包含至少八個節點及複數個壓阻元件，該複數個壓阻元件之各者將該至少八個節點中的一節點耦接至至少一個鄰近節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Force sensing structures and systems using piezoresistive elements, as well as methods of using such force sensing structures and systems are disclosed. In some embodiments, an apparatus may include a bridge circuit configured to detect a force applied to the apparatus, the bridge circuit comprising at least eight nodes and a plurality of piezoresistive elements, each of the plurality of piezoresistive elements coupling a node of the at least eight nodes to at least one neighboring node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:力感測結構</p>
        <p type="p">700a~700d:力偵測輪廓</p>
        <p type="p">701a~701d:位置</p>
        <p type="p">714:位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="989" publication-number="202632766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組及包括電池組的裝置</chinese-title>
        <english-title>BATTERY PACK AND DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">H01M10/052</main-classification>
        <further-classification edition="202101120260504B">H01M50/20</further-classification>
        <further-classification edition="202101120260504B">H01M50/204</further-classification>
        <further-classification edition="202101120260504B">H01M50/209</further-classification>
        <further-classification edition="202101120260504B">H01M50/244</further-classification>
        <further-classification edition="202101120260504B">H01M50/249</further-classification>
        <further-classification edition="202101120260504B">H01M50/289</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金癸成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GAE SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權重根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOWN, JUNG GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵門準</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, MUN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的電池組包含電池組件，其包含多個電池單元、具有一個開放側面並安裝有電池組件的電池組框架、覆蓋電池組框架的一個開放側面的電池組蓋、以及接合以下至少一者：電池組件和電池組框架之間、以及電池組件和電池組蓋之間的黏著劑，其中黏著劑在130°C或更高的高溫下黏著強度減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack according to the present disclosure comprises a battery assembly containing a plurality of battery cells, a pack frame which has one open side and is mounted with the battery assembly, a pack cover that covers the one open side of the pack frame, and an adhesive that bonds at least one of: between the battery assembly and the pack frame, and between the battery assembly and the pack cover, wherein the adhesive decreases in adhesive strength at a high temperature of 130°C or higher.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池組件</p>
        <p type="p">100a:第一電池組件</p>
        <p type="p">100b:第二電池組件</p>
        <p type="p">100c:第三電池組件</p>
        <p type="p">1000:電池組</p>
        <p type="p">1100:電池組框架</p>
        <p type="p">1110:底部</p>
        <p type="p">1120:側樑</p>
        <p type="p">1200:電池組蓋</p>
        <p type="p">1300:黏著劑</p>
        <p type="p">1301:上黏著劑</p>
        <p type="p">1302:下黏著劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="990" publication-number="202633438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低溫接合的積層接合層製程及結構</chinese-title>
        <english-title>BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE BONDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W29/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姆洛奇克　帕爾維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MROZEK, PAWEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈德遜　喬治　卡爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUDSON, GEORGE CARLTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示形成微電子組件之方法。在一些具體實例中，該方法包括：提供基板；在該基板上方形成金屬特徵；在元件上方形成有機介電層，使得該有機介電層覆蓋該金屬特徵之側壁；在該有機介電層上方形成無機介電材料；及平坦化該無機介電材料、該有機介電層及該金屬特徵。經平坦化表面可充當混合接合表面。該金屬特徵在該混合接合表面處暴露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of forming a microelectronic component. In some embodiments, the method includes providing a substrate, forming a metal feature over the substrate, forming an organic dielectric layer over the element such that the organic dielectric layer covers sidewalls of the metal feature, forming an inorganic dielectric material over the organic dielectric layer, and planarizing the inorganic dielectric material, the organic dielectric layer, and the metal feature. The planarized surface can serve as a hybrid bonding surface. The metal feature is exposed at the hybrid bonding surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:程序</p>
        <p type="p">202:區塊</p>
        <p type="p">204:區塊</p>
        <p type="p">206:區塊</p>
        <p type="p">208:區塊</p>
        <p type="p">210:區塊</p>
        <p type="p">212:區塊</p>
        <p type="p">214:區塊</p>
        <p type="p">216:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="991" publication-number="202633171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10W20/20</further-classification>
        <further-classification edition="202601120260424B">H10W10/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊永鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YOUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洪信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁絡渶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, NAKYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括基底絕緣圖案、位於基底絕緣圖案上的分隔壁、第一通道結構和第二通道結構，其中分隔壁位於第一通道結構和第二通道結構之間且第一通道結構和第二通道結構彼此間隔開、圍繞第一通道結構和第二通道結構的閘極結構、連接到第一通道結構相對兩側的第一源極/汲極圖案、連接到第二通道結構相對兩側的第二源極/汲極圖案並與第一源極/汲極圖案間隔開且分隔壁位於第一源極/汲極圖案和第二源極/汲極圖案之間、以及連接到第一源極/汲極圖案和第二源極/汲極圖案的下部的下接觸電極結構。分隔壁沿朝向基底絕緣圖案的下表面的方向延伸並且分隔壁延伸通過下接觸電極結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a base insulating pattern, a partition wall positioned on the base insulating pattern, a first channel structure and a second channel structure positioned apart from each other with the partition wall therebetween, a gate structure surrounding the first channel structure and the second channel structure, first source/drain patterns connected to opposite sides of the first channel structure, second source/drain patterns connected to opposite sides of the second channel structure and spaced apart from the first source/drain patterns with the partition wall between the first source/drain patterns and the second source/drain patterns, and a lower contact electrode structure connected to lower portions of the first source/drain patterns and the second source/drain patterns. The partition wall extends in a direction toward a lower surface of the base insulating pattern and the partition wall extends through the lower contact electrode structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:源極/汲極圖案</p>
        <p type="p">161:分隔件/分隔壁</p>
        <p type="p">192a:連接線/第一連接線/連接電極</p>
        <p type="p">192b:連接線/第二連接線/連接電極</p>
        <p type="p">194:連接圖案</p>
        <p type="p">197:接觸電極結構/下接觸電極結構</p>
        <p type="p">198:閘極接觸電極</p>
        <p type="p">199:節點接觸電極</p>
        <p type="p">210:下接觸通孔</p>
        <p type="p">220:電力軌/第一電力軌/第二電力軌</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GS:閘極結構/第一閘極結構/第二閘極結構</p>
        <p type="p">I1-I1'、I2-I2'、I3-I3'、I4-I4'、I5-I5'、I6-I6':線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="992" publication-number="202632085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135409</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍覆裝置的控制方法及鍍覆裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C25D17/00</main-classification>
        <further-classification edition="200601120260504B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉竜也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, RYUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浜野誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMANO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内滉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, KOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在具備複數個鍍覆模組的鍍覆裝置中，要求藉由使用適當的鍍覆模組進行鍍覆處理來形成高品質的鍍膜。本發明提供一種鍍覆裝置的控制方法，是具備複數個鍍覆模組的鍍覆裝置的控制方法，其中，包括如下步驟：取得針對由上述複數個鍍覆模組鍍覆處理後的複數個基板的鍍膜厚度測定數據；基於上述鍍膜厚度測定數據，判定上述複數個鍍覆模組中的各鍍覆模組的優良度；以及基於上述各鍍覆模組的上述優良度，控制上述鍍覆裝置中的鍍覆程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">480:學習模型</p>
        <p type="p">481:輸入節點</p>
        <p type="p">482:輸入層</p>
        <p type="p">483:節點</p>
        <p type="p">484:中間層</p>
        <p type="p">485:輸出節點</p>
        <p type="p">486:輸出層</p>
        <p type="p">487:神經網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="993" publication-number="202631826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離型塗層</chinese-title>
        <english-title>RELEASE COATINGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G77/14</main-classification>
        <further-classification edition="200601120260420B">C08G77/38</further-classification>
        <further-classification edition="200601120260420B">C09D183/06</further-classification>
        <further-classification edition="200601120260420B">C09D5/20</further-classification>
        <further-classification edition="200601120260420B">C08F290/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿瑪佳　薩迪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAJJAHE, SADIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉布盧　伊雷姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARABULUT, IREM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷德　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAND, MIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩格哈特　伊馮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGELHARDT, YVONNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩森哈根　盧卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASSENHAGEN, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃格爾　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含下列組分的組成物：  &lt;br/&gt;　　(I)   至少一種聚矽氧(甲基)丙烯酸酯(i)，其具有至少一個懸垂(甲基)丙烯酸酯基並且其中(甲基)丙烯酸酯基的數量除以矽原子數量的平均為4.0%至20.0%，  &lt;br/&gt;　　(II)  不含矽原子或氮原子的至少一種(甲基)丙烯酸酯(ii)，  &lt;br/&gt;　　(III) 不含矽原子的至少一種胺(iii)，  &lt;br/&gt;　　以及可選地  &lt;br/&gt;　　(IV) 選自於由光起始劑與光敏劑所組成之群組的至少一種化合物(iv)，  &lt;br/&gt;　　其中組成物含有  &lt;br/&gt;　　-      1重量%至40重量%，較佳5重量%至35重量%，尤其10重量%至30重量%之組分(I)，  &lt;br/&gt;　　-      5重量%至90重量%，較佳10重量%至80重量%，尤其21重量%至75重量%之組分(II)，  &lt;br/&gt;　　-     1重量%至50重量%，較佳2重量%至45重量%，尤其從5重量%至40重量%之組分(III)，  &lt;br/&gt;　　以及可選地  &lt;br/&gt;　　-     0.1重量%至15重量%，較佳1重量%至10重量%，尤其從1.5重量%至9重量%之組分(IV)，  &lt;br/&gt;　　其中以重量%呈現的數字係相對於該組成物整體。  &lt;br/&gt;　　本發明進一步提供該組成物作為輻射固化塗層化合物之用途、使用該組成物製造離型塗層的方法、與藉由該方法可獲得的離型塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a composition comprising the following components: &lt;br/&gt;(I) at least one silicone (meth)acrylate (i) which bears at least one pendant (meth)acrylate group and in which the number of (meth)acrylate groups divided by the number of silicon atoms on average is 4.0% to 20.0%, &lt;br/&gt;(II) at least one (meth)acrylate (ii) containing neither silicon atoms nor nitrogen atoms, &lt;br/&gt;(III) at least one amine (iii) containing no silicon atoms, &lt;br/&gt;and optionally &lt;br/&gt;(IV) at least one compound (iv) selected from the group consisting of photoinitiators and photosensitizers, &lt;br/&gt;where the composition contains &lt;br/&gt;- 1% to 40%, preferably 5% to 35%, in particular 10% to 30%, by weight of component (I), &lt;br/&gt;- 5% to 90%, preferably 10% to 80%, in particular 21% to 75%, by weight of component (II), &lt;br/&gt;- 1% to 50%, preferably 2% to 45%, in particular from 5% to 40%, by weight of component (III), &lt;br/&gt;and optionally &lt;br/&gt;- 0.1% to 15%, preferably 1% to 10%, in particular from 1.5% to 9%, by weight of component (IV), &lt;br/&gt;where the figures in % by weight relate to the overall composition. &lt;br/&gt;The invention further provides for the use of said composition as radiation-curing coating compounds, a method of producing a release coating using said composition, and the release coating obtainable by said method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="994" publication-number="202631508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135439</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用硫酸鈉浸出鋰之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS OF LEACHING LITHIUM USING SODIUM SULFATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C01D15/02</main-classification>
        <further-classification edition="200601120260504B">C01D5/00</further-classification>
        <further-classification edition="200601120260504B">C22B1/02</further-classification>
        <further-classification edition="200601120260504B">C22B26/12</further-classification>
        <further-classification edition="200601120260504B">C22B3/08</further-classification>
        <further-classification edition="200601120260504B">C22B3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞比馬利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBEMARLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾蒙特　史蒂芬Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELMONT, STEPHEN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　永強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, YONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於使用磷酸鈉浸出鋰源之系統及方法。該製程可包括在反應器中混合鋰源、第一硫酸鈉及氫氧化鋰，且在該反應器中浸出該混合物中的該鋰源以形成殘餘固體及硫酸鋰浸出液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to systems and methods of leaching lithium sources using sodium sulfate. The process can include mixing a lithium source, a first sodium sulfate, and lithium hydroxide in a reactor and leaching the lithium source in the mixture in the reactor to form residual solids and a lithium sulfate leachate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="995" publication-number="202631878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板</chinese-title>
        <english-title>RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL CLAD LAMINATE AND WIRING BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08L63/00</main-classification>
        <further-classification edition="201801120260416B">C08K3/013</further-classification>
        <further-classification edition="200601120260416B">C08G59/24</further-classification>
        <further-classification edition="200601120260416B">C08J5/24</further-classification>
        <further-classification edition="200601120260416B">B32B15/08</further-classification>
        <further-classification edition="200601120260416B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三戶隆人士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITO, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本明希人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示課題在於提供一種能兼顧良好之成形性及耐電跡性的樹脂組成物。樹脂組成物含有環氧樹脂(A)、酚樹脂(B)及無機充填材(C)。環氧樹脂(A)包含二環戊二烯型環氧樹脂(A1)與參酚甲烷型環氧樹脂(A2)。無機充填材(C)包含：第1無機充填材(C1)，其在體積基準之粒度分布測定中賦予第1波峰；及第2無機充填材(C2)，其在體積基準之粒度分布測定中賦予展現小於第1波峰之粒徑的第2波峰。第1無機充填材(C1)及第2無機充填材(C2)各自係選自於由氫氧化鋁填料、軟水鋁石填料、氫氧化鎂填料、碳鈉鋁石填料、鋁酸鈣水合物填料、硼酸鈣填料及硼酸鋅填料所構成群組中之至少1種充填材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:預浸體</p>
        <p type="p">11:樹脂層</p>
        <p type="p">12:纖維質基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="996" publication-number="202631807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、乾膜及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G69/32</main-classification>
        <further-classification edition="200601120260504B">C08L77/06</further-classification>
        <further-classification edition="200601120260504B">C08K5/13</further-classification>
        <further-classification edition="200601120260504B">C08K5/3492</further-classification>
        <further-classification edition="200601120260504B">C08K5/45</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎香帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供：可對應PFAS規範，且解像性提升之硬化性樹脂組成物；具有藉由該硬化性樹脂組成物所形成之樹脂層的乾膜；藉由該硬化性樹脂組成物或該乾膜之樹脂層所形成之硬化物。本發明之一形態，係一種聚羥基醯胺化合物，其包含：含有下述式(1)之結構的聚羥基醯胺化合物、交聯劑、光酸產生劑及酚化合物，前述聚羥基醯胺化合物不具有全氟烷基骨架，前述酚化合物之重量平均分子量為5,000以下。  &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="483px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　{式(1)中，R&lt;sup&gt;1&lt;/sup&gt;為2價之有機基，R&lt;sup&gt;2&lt;/sup&gt;為4價之有機基。}</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="997" publication-number="202633475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝、半導體裝置、及半導體封裝之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/65</main-classification>
        <further-classification edition="202601120260427B">H10W70/63</further-classification>
        <further-classification edition="202601120260427B">H10W72/20</further-classification>
        <further-classification edition="202601120260427B">H10W70/05</further-classification>
        <further-classification edition="202501120260427B">H10F39/12</further-classification>
        <further-classification edition="202501120260427B">H10D89/10</further-classification>
        <further-classification edition="202601120260427B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永留大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATOME, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑野啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桝田佳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半場博幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANBA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原洋右</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIHARA, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大岡豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOKA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船越誠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKOSHI, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中憲三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋光司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野章吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本篤志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，在WLCSP(Wafer Level-Chip Size Package，晶圓級晶片尺寸封裝)中，使製造時之測試效率提高，且將WLCSP小型化。  &lt;br/&gt;本發明之半導體封裝具備：半導體基板、像素區域、保護環、及重佈線。於該半導體封裝中，像素區域形成於半導體基板之正面。又，保護環形成於像素區域之周圍。又，重佈線佈線於半導體基板之相對於前述正面之背面。又，重佈線之末端部位於前述保護環之外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:WLCSP</p>
        <p type="p">111:像素區域</p>
        <p type="p">112:背面銲墊</p>
        <p type="p">114:重佈線</p>
        <p type="p">115:Cu-Cu連接部</p>
        <p type="p">116:保護環</p>
        <p type="p">130:半導體基板</p>
        <p type="p">130-1:受光基板</p>
        <p type="p">130-2:電路基板</p>
        <p type="p">131:器件層</p>
        <p type="p">132:絕緣層</p>
        <p type="p">133:RDL層</p>
        <p type="p">134:阻銲罩</p>
        <p type="p">X,Y,Z:軸</p>
        <p type="p">X1,X2,X3,X4,X31,X32:座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="998" publication-number="202633353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將鍵合頭定位至目標位置的鍵合平臺及其方法</chinese-title>
        <english-title>DECOUPLED FLOATING BONDING STAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P72/50</main-classification>
        <further-classification edition="202601120260427B">H10W80/00</further-classification>
        <further-classification edition="200601120260427B">G01D5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進科技新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　國鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAK, KUOK HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關　家勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWAN, KA SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　思銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNG, SEE YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　丞臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAK, SHING CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於將鍵合頭定位至目標位置的鍵合平臺和方法。所述鍵合平臺包括用於安裝所述鍵合頭的平臺主體以及與所述平臺主體物理地解耦的線性滑架。當所述鍵合頭通過所述線性滑架朝向所述目標位置移動時，所述平臺主體可通過所述線性滑架與所述平臺主體之間的電磁相互作用來驅動，以與所述線性滑架一起移動。所述平臺主體還可通過所述電磁相互作用來驅動，以相對於所述線性滑架移動，由此將所述鍵合頭定位至所述目標位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding stage for positioning a bond head at a target position has a stage body on which the bond head is mounted and a linear carriage which is physically decoupled from the stage body. The stage body is drivable to move together with the linear carriage by way of electromagnetic interaction between the linear carriage and the stage body when the bond head is being moved towards the target position by the linear carriage. The stage body is also drivable to move relative to the linear carriage to position the bond head at the target position by way of the electromagnetic interaction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鍵合平臺</p>
        <p type="p">12:基座</p>
        <p type="p">14:線性電機</p>
        <p type="p">16:線性滑架</p>
        <p type="p">18:軸</p>
        <p type="p">20:滑架線性導軌</p>
        <p type="p">21:端部安裝件</p>
        <p type="p">22:平衡品質線性電機</p>
        <p type="p">24:端部安裝線性導軌</p>
        <p type="p">26:浮動平臺主體</p>
        <p type="p">28:鍵合頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="999" publication-number="202631536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃纖維用組成物、玻璃纖維、玻璃布、及玻璃纖維的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C03C13/00</main-classification>
        <further-classification edition="200601120260420B">C03C3/118</further-classification>
        <further-classification edition="200601120260420B">C03C3/091</further-classification>
        <further-classification edition="200601120260420B">C03C4/16</further-classification>
        <further-classification edition="200601120260420B">C03B37/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬川恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGAWA, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斉藤敦己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, ATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種兼顧低介電常數及低介電損耗正切、並且具有低的熱膨脹係數的玻璃纖維用組成物及玻璃纖維的製造方法。本發明的特徵在於：作為玻璃組成，以質量%計含有SiO&lt;sub&gt;2&lt;/sub&gt; 35%～68%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0%～40%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 5%～40%、P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt; 0%～12%、Li&lt;sub&gt;2&lt;/sub&gt;O+Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O+MgO+CaO+SrO+BaO+ZnO 0%～5.5%，更含有選自TiO&lt;sub&gt;2&lt;/sub&gt;、ZrO&lt;sub&gt;2&lt;/sub&gt;、Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、MoO&lt;sub&gt;3&lt;/sub&gt;、Cr&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、SO&lt;sub&gt;3&lt;/sub&gt;、SnO&lt;sub&gt;2&lt;/sub&gt;、Pt、Rh中的至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1000" publication-number="202632667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於快閃記憶體之讀取操作的可配置硬體架構的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CONFIGURABLE HARDWARE ARCHITECTURE FOR READ OPERATIONS OF A FLASH MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">G11C16/26</main-classification>
        <further-classification edition="200601120260417B">G11C16/34</further-classification>
        <further-classification edition="201901120260417B">G06N20/00</further-classification>
        <further-classification edition="200601120260417B">G11C29/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎特　奧菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANTER, OFIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史戴納　阿維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINER, AVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納西　阿米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASSIE, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格勞　吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAU, GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼贊　埃亞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITZAN, EYAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷格曼　尼姆羅德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREGMAN, NIMROD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威恩蓋頓　哈南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEINGARTEN, HANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施例中，快閃記憶體系統可以包括非揮發性記憶體、控制器、第一處理器和第二處理器。該第一處理器可以產生第一配置，該第一配置包括指向多個預定義配置之中的第一組預定義配置的指標。回應於產生該第一配置，該電路可以在記憶體中產生該第一組預定義配置。該控制器可以根據在該記憶體中產生的該第一組預定義配置執行第一操作。該第二處理器可以產生第二配置，該第二配置包括指向該多個預定義配置之中的第二組預定義配置的指標。回應於產生該第二配置，該控制器可以在該記憶體中產生該第二組預定義配置。該控制器可以根據在該記憶體中產生的該第二組預定義配置執行第二操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a flash memory system may include a non-volatile memory, a controller, a first processor, and a second processor. The first processor may generate a first configuration including a pointer to a first set of predefined configurations among a plurality of predefined configurations. In response to generating the first configuration, the circuit may generate, in a memory, the first set of predefined configurations. The controller may execute a first operation according to the first set of predefined configurations generated in the memory. The second processor may generate a second configuration comprising a pointer to a second set of predefined configurations among the plurality of predefined configurations. In response to generating the second configuration, the controller may generate, in the memory, the second set of predefined configurations. The controller may execute a second operation according to the second set of predefined configurations generated in the memory.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1001" publication-number="202633287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、蝕刻裝置及電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P50/20</main-classification>
        <further-classification edition="200601120260427B">C23C16/26</further-classification>
        <further-classification edition="202501120260427B">H10D30/67</further-classification>
        <further-classification edition="202501120260427B">H10D48/30</further-classification>
        <further-classification edition="202301120260427B">H10K30/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李暁竜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對IGZO膜之形狀進行加工之基板處理方法、蝕刻裝置及電子裝置。  &lt;br/&gt;本發明之基板處理方法具有：準備基板之工序，其中上述基板具有基材、形成於上述基材之上且具有沿第1方向延伸之線與間隙形狀之內核、覆蓋上述基材及上述內核之IGZO膜、以及形成於上述IGZO膜之上且具有沿與上述第1方向正交之第2方向延伸之線與間隙形狀之碳膜；以及去除上述IGZO膜之工序，其係使用CH&lt;sub&gt;4&lt;/sub&gt;與H&lt;sub&gt;2&lt;/sub&gt;之混合氣體作為蝕刻氣體而產生上述蝕刻氣體之電漿，藉由反應性離子蝕刻，將從上述碳膜之開口露出之上述IGZO膜去除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S102,S103,S104,S105,S106,S107,S108,S109,S110,S110A,S111,S111A,S112,S113,S114,S115,S116,S117:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1002" publication-number="202631821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性樹脂組合物、密封材料及由該固化性樹脂組合物的固化物密封的電子部件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260422B">C08G75/04</main-classification>
        <further-classification edition="200601120260422B">C08G59/66</further-classification>
        <further-classification edition="202601120260422B">H10W74/40</further-classification>
        <further-classification edition="202601120260422B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松崎聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUZAKI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種固化性樹脂組合物，其含有以下成分：成分(A)，具有3~6個硫醇基的多官能度硫醇化合物；成分(B)，在25℃下為液狀且環氧當量為185以下的具有3~4個環氧基的多官能度環氧化合物；成分(C)，下述式1所表示的單官能度環氧化合物，其中，成分(A)的硫醇基的官能團濃度與所述成分(B)的環氧基的官能團濃度的比例(硫醇基/環氧基)為0.6~1.3。該固化性樹脂組合物能夠形成防濕性、低溫柔軟性及連續折疊彎曲耐性(强韌性)優異的固化物。&lt;br/&gt;&lt;img align="absmiddle" height="123px" width="329px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1003" publication-number="202632058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於批量基板處理腔室的多端口氣體注入和排出</chinese-title>
        <english-title>MULTIPLE PORT GAS INJECTION AND EXHAUST FOR BATCH SUBSTRATE PROCESSING CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C23C16/455</main-classification>
        <further-classification edition="200601120260417B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維卡他吉雅帕　威賈比史卡拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATAGIRIYAPPA, VIJAYABHASKARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游　素碹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOW, SUE-ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　任成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭喬元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIAOYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉曼尼安　迪芬拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, DHIVANRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了具有晶圓盒組件和至少一個升舉銷組件的腔室主體的處理腔室。晶圓盒組件具有至少兩個支撐柱，被配置以固持沿著支撐柱的高度間隔的複數個晶圓支撐件。升舉銷組件具有複數個升舉銷，被佈置以使得複數個晶圓支撐件中的每一者包括至少三個升舉銷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Processing chambers having a chamber body with a wafer cassette assembly and at least one lift pin assembly are described. The wafer cassette assembly has at least two support columns configured to hold a plurality of wafer supports spaced along a height of the support columns. The lift pin assemblies have a plurality of lift pins arranged so that each of the plurality of wafer supports comprises at least three lift pins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓處理腔室</p>
        <p type="p">135:晶圓支撐件</p>
        <p type="p">150:晶圓</p>
        <p type="p">170:升舉銷組件</p>
        <p type="p">180:氣體注入器</p>
        <p type="p">202:多層氣體注入組件</p>
        <p type="p">202a:氣體歧管</p>
        <p type="p">202b:氣體歧管</p>
        <p type="p">202c:氣體歧管</p>
        <p type="p">202d:氣體歧管</p>
        <p type="p">202e:氣體歧管</p>
        <p type="p">202f:氣體歧管</p>
        <p type="p">202g:氣體歧管</p>
        <p type="p">202h:氣體歧管</p>
        <p type="p">202i:氣體歧管</p>
        <p type="p">202j:氣體歧管</p>
        <p type="p">202k:氣體歧管</p>
        <p type="p">202l:氣體歧管</p>
        <p type="p">202m:氣體歧管</p>
        <p type="p">202n:氣體歧管</p>
        <p type="p">202o:氣體歧管</p>
        <p type="p">202p:氣體歧管</p>
        <p type="p">202q:氣體歧管</p>
        <p type="p">202r:氣體歧管</p>
        <p type="p">203:間隔墊</p>
        <p type="p">204:多層氣體注入組件</p>
        <p type="p">204m:氣體歧管</p>
        <p type="p">204n:氣體歧管</p>
        <p type="p">204o:氣體歧管</p>
        <p type="p">204p:氣體歧管</p>
        <p type="p">204q:氣體歧管</p>
        <p type="p">204r:氣體歧管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1004" publication-number="202632893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合基板及其製造方法和彈性表面波元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H03H9/25</main-classification>
        <further-classification edition="202601120260423B">H10P10/00</further-classification>
        <further-classification edition="202301120260423B">H10N30/076</further-classification>
        <further-classification edition="202301120260423B">H10N30/853</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣達朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西谷隆志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHITANI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩下昌正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASHITA, SHOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供具有優異的接合強度且可簡便低價製造的複合基板。根據本發明實施形態的複合基板，依序具有壓電層、第一中間層、第二中間層與支撐基板。第二中間層的第一中間層側的電阻率R2&lt;sub&gt;1&lt;/sub&gt;高於支撐基板的電阻率RS；以及第二中間層的支撐基板側的電阻率R2&lt;sub&gt;S&lt;/sub&gt;低於支撐基板的電阻率RS。根據本發明實施形態的複合基板的製造方法，依序包含：在壓電基板的一側依序形成第一中間層及第二中間層；將第二中間層平滑化處理；將第二中間層與支撐基板接合；以及將壓電基板薄膜化而成為壓電層；第一中間層是藉由氧存在下中的矽的反應性濺鍍而形成；第二中間層是藉由用於第一中間層的形成之氧殘存量以下的環境中的矽的反應性濺鍍而形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:壓電層</p>
        <p type="p">20:第一中間層</p>
        <p type="p">30:第二中間層</p>
        <p type="p">40:支撐基板</p>
        <p type="p">100:複合基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1005" publication-number="202632037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉積具有組成梯度的含金屬膜的方法</chinese-title>
        <english-title>METHODS OF DEPOSITING METAL-CONTAINING FILMS HAVING A COMPOSITION GRADIENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C23C16/02</main-classification>
        <further-classification edition="200601120260421B">C23C16/06</further-classification>
        <further-classification edition="200601120260421B">C23C16/30</further-classification>
        <further-classification edition="200601120260421B">C23C16/34</further-classification>
        <further-classification edition="200601120260421B">C23C16/40</further-classification>
        <further-classification edition="200601120260421B">C23C16/455</further-classification>
        <further-classification edition="200601120260421B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩曼　莉莎Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENMAN, LISA J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡路塔瑞奇　蘭卡摩Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALUTARAGE, LAKMAL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　鳳全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FENG Q.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安瑟斯　傑佛瑞Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTHIS, JEFFREY W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考爾　帕米什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUR, PARMISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇德　安佳利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOOD, ANJALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾契恩　布萊斯珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYCHENNE, BRICE JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　昌丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, CHANDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了沉積具有組成梯度的含金屬膜（即梯度膜）的方法。該梯度膜可以通過原子層沉積（ALD）製程或化學氣相沉積（CVD）製程來沉積。該梯度膜包含選自由鋁（Al）、釕（Ru）、鈷（Co）、鋅（Zn）、鉬（Mo）、鈦（Ti）、鎢（W）、鉭（Ta）、錳（Mn）、銥（Ir）和銅（Cu）組成的群組中的至少一個金屬。在梯度膜上沉積一層金屬膜，該金屬膜包含銅（Cu）、釕（Ru）、鈷（Co）、鎢（W）或鉬（Mo）中的一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing metal-containing films having a composition gradient (i.e., gradient films) are described. The gradient films may be deposited by an atomic layer deposition (ALD) process or a chemical vapor deposition (CVD) process. The gradient film includes at least one metal selected from the group consisting of aluminum (Al), ruthenium (Ru), cobalt (Co), zinc (Zn), molybdenum (Mo), titanium (Ti), tungsten (W), tantalum (Ta), manganese (Mn), iridium (Ir), and copper (Cu). A metallic film is deposited on the gradient film, the metallic film including one or more of copper (Cu), ruthenium (Ru), cobalt (Co), tungsten (W), or molybdenum (Mo).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">105:操作</p>
        <p type="p">110:操作</p>
        <p type="p">120:操作</p>
        <p type="p">130:操作</p>
        <p type="p">140:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1006" publication-number="202631891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理劑組成物蒸發源</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L83/04</main-classification>
        <further-classification edition="200601120260504B">C08L91/06</further-classification>
        <further-classification edition="200601120260504B">C09D5/16</further-classification>
        <further-classification edition="200601120260504B">C09K3/18</further-classification>
        <further-classification edition="200601120260504B">C23C14/12</further-classification>
        <further-classification edition="200601120260504B">C23C14/24</further-classification>
        <further-classification edition="201501120260504B">G02B1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森聖矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒匈隆介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKOH, RYUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由使用如下之表面處理劑組成物蒸發源，可形成撥水性、耐磨耗性、耐藥品性更加提高的硬化被膜：一種表面處理劑組成物蒸發源，其為具備於內部具有複數個空孔或空隙，且於該空孔或空隙內存在有表面處理劑組成物的多孔質體之表面處理劑組成物蒸發源，其中  &lt;br/&gt;　　上述表面處理劑組成物，為含有具有可包含選自氧原子、硫原子、氮原子及矽原子的至少1種的至少1個碳數3~60之直鏈狀、分支鏈狀或環狀之1價烴基，及反應性矽烷基的非氟系有機矽烷化合物(α)及/或其部分反應縮合物，且由不含有氟原子之材料所構成者，  &lt;br/&gt;　　上述多孔質體之空隙率為0.100以上且0.995以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1007" publication-number="202632277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於奈米尺度定位的定位系統</chinese-title>
        <english-title>POSITIONING SYSTEM FOR NANOSCALE POSITIONING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260423B">G01Q10/04</main-classification>
        <further-classification edition="201001120260423B">G01Q30/20</further-classification>
        <further-classification edition="201001120260423B">G01Q70/02</further-classification>
        <further-classification edition="200601120260423B">H01J37/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商納瑟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANOSURF AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利布　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEB, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮耶扎克　比約恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIETZAK, BJORN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於奈米尺度定位的定位系統(10)。其包括支撐結構(12)、第一平移軸(14’)及第二平移軸(16’)。該第一平移軸沿第一方向(x)延伸，以用於沿著該第一方向移動處理物件(20)並在垂直於該第一方向的第二方向(y)具有第一平移軸寬度(w1)。該第二平移軸沿第二方向延伸，以用於沿該第二方向移動用於處理該處理物件的處理工具(30)。該第一及第二平移軸被安排為在垂直於該第一方向及該第二方向的第三方向(z)上彼此間隔一段距離並且連接至該支撐結構或為該支撐結構的部分。該定位系統被配置為用於將該處理工具沿整個該第一平移軸寬度移動而不碰撞該支撐結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a positioning system (10’) for nanoscale positioning. It comprises a support structure (12), a first translation axis (14’) and a second translation axis (16’). The first translation axis extends along a first direction (x), for moving a processing object (20) along the first direction and has a first translation axis width (w1) in a second direction (y) perpendicular to the first direction. The second translation axis extends along the second direction, for moving a processing tool (30) for processing the processing object along the second direction. The first and second translation axes are arranged with a distance to each other in a third direction (z) perpendicular to the first and second directions and are connected to or part of the support structure. The positioning system is configured for moving the processing tool over the whole first translation axis width without colliding with the support structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10’:定位系統</p>
        <p type="p">12:支撐結構</p>
        <p type="p">14’:第一平移軸</p>
        <p type="p">16’:第二平移軸</p>
        <p type="p">20:處理物件</p>
        <p type="p">30:處理工具</p>
        <p type="p">32:尖端</p>
        <p type="p">44:開口</p>
        <p type="p">52:支柱</p>
        <p type="p">54:支柱</p>
        <p type="p">56:支柱</p>
        <p type="p">58:支柱</p>
        <p type="p">62:條塊</p>
        <p type="p">64:條塊</p>
        <p type="p">66:條塊</p>
        <p type="p">68:條塊</p>
        <p type="p">70:導軌</p>
        <p type="p">72:載台</p>
        <p type="p">100’:處理系統</p>
        <p type="p">200:控制單元</p>
        <p type="p">202:處理器</p>
        <p type="p">204:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1008" publication-number="202632781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置</chinese-title>
        <english-title>COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250923B">H01Q1/36</main-classification>
        <further-classification edition="200601120250923B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辜嘉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬琳惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種通訊裝置。此通訊裝置包括一射頻電路板、一第一天線結構、一第二天線結構以及一散熱結構。第一天線結構與第二天線結構皆電性連接該射頻電路板。第一天線結構分隔自第二天線結構。散熱結構與射頻電路板及第一天線結構沿一縱向方向層疊。散熱結構在縱向方向上位於第一天線結構與射頻電路板之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device is provided. The communication device comprises a radio frequency (RF) circuit board, a first antenna structure, a second antenna structure, and a heat dissipation structure. The first antenna structure and the second antenna structure are both electrically connected to the RF circuit board. The first antenna structure is separated from the second antenna structure. The heat dissipation structure is stacked with the RF circuit board and the first antenna structure along a longitudinal direction. The heat dissipation structure is disposed between the first antenna structure and the RF circuit board in the longitudinal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">111:上蓋體</p>
        <p type="p">112:下蓋體</p>
        <p type="p">120:主電路板</p>
        <p type="p">130:第一散熱結構</p>
        <p type="p">140:射頻電路板</p>
        <p type="p">141:接收模組</p>
        <p type="p">142:循環器</p>
        <p type="p">143:濾波器</p>
        <p type="p">144:發射模組</p>
        <p type="p">145:射頻收發器</p>
        <p type="p">150:第二散熱結構</p>
        <p type="p">161:第一天線結構</p>
        <p type="p">162:第二天線結構</p>
        <p type="p">AB:天線座</p>
        <p type="p">MB:鐵件天線本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1009" publication-number="202632733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改善的氣體混合的氣體噴射器組件</chinese-title>
        <english-title>GAS INJECTOR ASSEMBLY WITH IMPROVED GAS MIXING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆斯塔法　姆漢納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSTAFA, MUHANNAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱塔爾　阿迪蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUTTAR, ADITYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里ＭＡ　安舍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALI M.A, AZHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡許葉　迪力提曼蘇哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHYAP, DHRITIMAN SUBHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了被配置以在半導體製造處理腔室中輸送氣體的氣體分配插入件。該氣體分配插入件包括複數個隨機定向的氣體開口，該複數個隨機定向的氣體開口延伸貫穿入口端壁的厚度。內部氣體通道從出口端壁面延伸至插入件的出口端，並且該內部氣體通道由內部氣體通道側壁定界。氣體分配插入件包含至少兩個氣體入口，該至少兩個氣體入口延伸貫穿內部氣體通道側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Gas distribution inserts configured to deliver a gas in semiconductor manufacturing processing chambers are described. The gas distribution insert comprises a plurality of randomly oriented gas openings extending through the thickness of the inlet end wall. An inner gas channel extends from the outlet end wall face to the insert outlet end, and the inner gas channel is bounded by an inner gas channel sidewall. The gas distribution inserts include at least two gas inlets extending through the inner gas channel sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:線</p>
        <p type="p">5':線</p>
        <p type="p">200:氣體分配插入件</p>
        <p type="p">202:上部部分</p>
        <p type="p">203:下部部分</p>
        <p type="p">204:入口端壁面</p>
        <p type="p">205:出口端</p>
        <p type="p">206:入口端壁</p>
        <p type="p">207:外圍表面</p>
        <p type="p">208:氣體開口</p>
        <p type="p">209:出口端面</p>
        <p type="p">212:開口</p>
        <p type="p">218:凸緣</p>
        <p type="p">220:氣體噴射層級</p>
        <p type="p">222:周邊凹槽</p>
        <p type="p">230:氣體噴射層級</p>
        <p type="p">232:周邊凹槽</p>
        <p type="p">250:周邊通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1010" publication-number="202631452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>船陸接頭</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B63B27/24</main-classification>
        <further-classification edition="200601120260422B">F16L9/19</further-classification>
        <further-classification edition="200601120260422B">F16L23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原佑季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合務</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川広志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原由真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立作明拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATESAKU, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朽木憲一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUCHIKI, NORIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之船陸接頭，具備：第1真空二重管，包含第1半部外管與第1半部內管；第1半部外管的末端之第1外側凸緣；第1半部內管的末端之第1內側凸緣；第1閉塞體，閉塞第1半部內管與第1半部外管之徑方向之間；第2真空二重管，包含第2半部外管與第2半部內管；第2半部外管的末端之第2外側凸緣；第2半部內管的末端之第2內側凸緣；第2閉塞體，閉塞第2半部內管與第2半部外管之徑方向之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:船陸接頭</p>
        <p type="p">8:第1真空二重管</p>
        <p type="p">8a:第1半部二重管</p>
        <p type="p">9:第2真空二重管</p>
        <p type="p">9a:第2半部二重管</p>
        <p type="p">10:第1半部</p>
        <p type="p">11:第2半部</p>
        <p type="p">12:第1內管</p>
        <p type="p">12a:第1半部內管</p>
        <p type="p">13:第1外管</p>
        <p type="p">13a:第1半部外管</p>
        <p type="p">14:第1真空空間</p>
        <p type="p">15:第2內管</p>
        <p type="p">15a:第2半部內管</p>
        <p type="p">16:第2外管</p>
        <p type="p">16a:第2半部外管</p>
        <p type="p">17:第2真空空間</p>
        <p type="p">18:第1閉塞體</p>
        <p type="p">19:環狀槽</p>
        <p type="p">20:第1閉塞空間</p>
        <p type="p">21:第2閉塞體</p>
        <p type="p">22:環狀槽</p>
        <p type="p">23:第2閉塞空間</p>
        <p type="p">24a:第1外側凸緣</p>
        <p type="p">24b:第1內側凸緣</p>
        <p type="p">24c、25c、26c:流路</p>
        <p type="p">24d:螺紋孔</p>
        <p type="p">24e:凹部</p>
        <p type="p">25a:第2外側凸緣</p>
        <p type="p">25b:第2內側凸緣</p>
        <p type="p">26a:外側間隔件</p>
        <p type="p">26b:內側間隔件</p>
        <p type="p">26d:孔</p>
        <p type="p">26e:凹部</p>
        <p type="p">27:貫通孔</p>
        <p type="p">28:螺栓</p>
        <p type="p">29:螺母</p>
        <p type="p">30:氣體空間</p>
        <p type="p">31:端口構件</p>
        <p type="p">32:空間</p>
        <p type="p">34:螺絲</p>
        <p type="p">35、36、37、38、39、40、47:密封構件</p>
        <p type="p">41:濾網</p>
        <p type="p">42:凸緣部</p>
        <p type="p">43:網部</p>
        <p type="p">44:貫通孔</p>
        <p type="p">45:回收機構</p>
        <p type="p">46:螺栓</p>
        <p type="p">48:回收部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1011" publication-number="202633288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P50/20</main-classification>
        <further-classification edition="202601120260422B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理裝置具有腔室、遮板、及驅動部。腔室係以於側壁形成有基板可通過之尺寸之開口且在內部可實施基板處理之方式構成。遮板係沿著形成有腔室內之開口的側壁而被配置，並藉由相對於開口而在上側進行升降來開關開口。驅動部係升降驅動遮板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1012" publication-number="202633119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D30/60</main-classification>
        <further-classification edition="202501120260427B">H10D30/01</further-classification>
        <further-classification edition="202601120260427B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿拉文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARAVINDH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宗哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG CHOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩瑞米　邁赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAREMI, MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　瑞貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞霍山　卡林　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHOSAN UL KARIM, MUHAMMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席姆卡　哈索諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMKA, HARSONO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置和製造其的製程。半導體裝置包括：介電壁；第一半導體層，在垂直於介電壁的第一側的第一方向上延伸，第一半導體層具有最靠近介電壁的第一端；以及第一閘極電極層，包括延伸超過第一半導體層的第一端且比第一半導體層的第一端更靠近介電壁的第一側的第一閘極延伸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and processes for fabricating the same are provided. A semiconductor device includes a dielectric wall; a first semiconductor layer extending in a first direction perpendicular from a first side of the dielectric wall, the first semiconductor layer having a first end that is nearest to the dielectric wall; and a first gate electrode layer including a first gate extension that extends beyond the first end of the first semiconductor layer and is nearer to the first side of the dielectric wall than the first end of the first semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:FET</p>
        <p type="p">203:介電壁</p>
        <p type="p">204:半導體層</p>
        <p type="p">205:閘極電極層</p>
        <p type="p">208:介面層</p>
        <p type="p">209:介電層</p>
        <p type="p">211:第一端</p>
        <p type="p">212:介電延伸部</p>
        <p type="p">213:閘極延伸部</p>
        <p type="p">d:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1013" publication-number="202632100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135761</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>釣魚線、釣魚線單絲及其製造方法</chinese-title>
        <english-title>A FISHING LINE, FISHING LINE MONOFILAMENT, AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260228B">D01F8/06</main-classification>
        <further-classification edition="200601120260228B">D01F8/18</further-classification>
        <further-classification edition="200601120260228B">D06M15/00</further-classification>
        <further-classification edition="200601120260228B">D06M13/00</further-classification>
        <further-classification edition="200601120260228B">D06P3/79</further-classification>
        <further-classification edition="200601120260228B">A01K91/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商利波里摩斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>Z-POLYMERS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商吳羽股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUREHA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瑪　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊默爾曼　麥可　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIMMERMAN, MICHAEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯卡瓦索　威廉　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCAVUZZO, WILLIAM S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>目代晴紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOKUDAI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正木崇士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASAKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種單絲釣魚線、一種複絲釣魚線及其製造方法。複絲釣魚線可包含含有複數個編織或撚合之單絲之編織或撚合製品。單絲釣魚線及複絲釣魚線各可包括含有液晶聚合物（LCP）之單絲。LCP可由選自由以下組成之群之反應所形成：（i）芳族羥基羧酸之間之縮聚反應；及（ii）芳族羥基羧酸與至少一種共聚單體之間之縮聚反應，該共聚單體選自由以下組成之群：芳族二羧酸、脂族二羧酸、脂族羧酸、芳族羥基胺、芳族二胺、芳族二醇及脂族二醇。單絲釣魚線及複絲釣魚線分別可具有500 MPa至1500 MPa及500至2,000 MPa範圍內之結節強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A monofilament fishing line, a multifilament fishing line, and method for producing the same are provided. The multifilament fishing line may contain a braided or twisted article containing a plurality of monofilaments that are braided or twisted. The monofilament fishing line and the multifilament fishing line may each include a monofilament containing a liquid crystal polymer (LCP). The LCP may be formed from a reaction selected from the group consisting of (i) a polycondensation reaction between aromatic hydroxycarboxylic acids; and (ii) a polycondensation reaction between an aromatic hydroxy carboxylic acid and at least one comonomer selected from the group consisting of aromatic dicarboxylic acids, aliphatic dicarboxylic acids, aliphatic carboxylic acids, aromatic hydroxyamines, aromatic diamines, aromatic diols, and aliphatic diols. The monofilament fishing line and the multifilament fishing line may each have a knot strength ranging from 500 MPa to 1500 MPa and 500 to 2,000 MPa, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:單絲釣魚線</p>
        <p type="p">d&lt;sub&gt;0&lt;/sub&gt;:直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1014" publication-number="202633325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶粒放置之載物台</chinese-title>
        <english-title>STAGE FOR DIE PLACEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/00</main-classification>
        <further-classification edition="202501120260420B">H10H29/01</further-classification>
        <further-classification edition="202501120260420B">H10H29/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽格　奧拉夫　約翰內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIJGER, OLAV JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於晶粒放置之載物台，其包含：一支撐部件；一可移動部件，其可相對於該支撐部件移動，其中該可移動部件經組態以固持至少一個晶粒；及一致動器，其經組態以在致動時使該可移動部件相對於該支撐部件移動，以便翻轉該晶粒且使該晶粒沿著一晶粒路徑移動以將該晶粒放置於一受體基板上，其中該載物台經配置以使得該晶粒路徑在垂直於該受體基板之一平面的一方向上比在平行於該受體基板之該平面的一方向上延伸得更遠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stage for die placement comprises: a support member; a movable member that is movable relative to the support member, wherein the movable member is configured to hold at least one die; and an actuator configured, on actuation, to move the movable member relative to the support member so as to flip the die and move the die along a die path to place the die on an acceptor substrate, wherein the stage is arranged such that the die path extends further in a direction perpendicular to a plane of the acceptor substrate than in a direction parallel to the plane of the acceptor substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接合工具</p>
        <p type="p">20:可移動部件</p>
        <p type="p">202:載物台</p>
        <p type="p">209:供體基板</p>
        <p type="p">210:供體晶粒</p>
        <p type="p">216:晶粒受體</p>
        <p type="p">220:受體基板</p>
        <p type="p">230:取放自動機械</p>
        <p type="p">240:位置量測元件</p>
        <p type="p">250:支撐結構</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1015" publication-number="202631368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用可濕氣固化樹脂製造低密度產品</chinese-title>
        <english-title>PRODUCTION OF LOW-DENSITY PRODUCTS USING MOISTURE CURABLE RESINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260422B">B29C64/124</main-classification>
        <further-classification edition="201701120260422B">B29C64/129</further-classification>
        <further-classification edition="201701120260422B">B29C64/135</further-classification>
        <further-classification edition="201701120260422B">B29C64/295</further-classification>
        <further-classification edition="201501120260422B">B33Y10/00</further-classification>
        <further-classification edition="202001120260422B">B33Y70/10</further-classification>
        <further-classification edition="201501120260422B">B33Y80/00</further-classification>
        <further-classification edition="202001120260422B">B33Y40/20</further-classification>
        <further-classification edition="202001120260422B">B33Y70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡邦公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBON, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴特　安德魯　戈登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIGHT, ANDREW GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳泓錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供製備三維物件之方法，該等方法包含(a)藉由積層製造來自包含熱可膨脹微球體之可聚合液體製造中間物件；(b)視情況，清潔該中間物件；及(c)濕氣固化該中間物件以形成該三維物件，該濕氣固化係在以足以使該等微球體膨脹之時間及溫度加熱該物件之前或之後實施。亦提供藉由該等方法製造之物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods of making a three-dimensional object that include (a) producing an intermediate object from a polymerizable liquid that includes heat expandable microspheres by additive manufacturing; (b) optionally, cleaning the intermediate object; and (c) moisture curing the intermediate object to form the three-dimensional object, said moisture curing performed before or after heating the object for a time and at a temperature sufficient to expand the microspheres. Objects produced by the methods are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1016" publication-number="202632566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結算系統、顯示控制方法及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260416B">G06Q20/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天信用卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN CARD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡信伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川貴枝子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, KIEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之結算系統(1)之申請畫面資訊取得部(103)於可自複數個申請畫面各者申請卡片之結算服務中，取得與複數個申請畫面中、使用者已進行卡片申請之申請畫面相關之申請畫面資訊。顯示控制部(102)基於申請畫面資訊，控制結算服務中顯示之畫面之跳轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:結算伺服器</p>
        <p type="p">20:卡片伺服器</p>
        <p type="p">30:使用者終端</p>
        <p type="p">100:資料記憶部</p>
        <p type="p">102:顯示控制部</p>
        <p type="p">103:申請畫面資訊取得部</p>
        <p type="p">200:資料記憶部</p>
        <p type="p">201:卡片管理部</p>
        <p type="p">300:資料記憶部</p>
        <p type="p">301:操作受理部</p>
        <p type="p">302:顯示控制部</p>
        <p type="p">DB1:結算資料庫</p>
        <p type="p">DB2:卡片資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1017" publication-number="202631927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑組合物、黏著片材及接合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260416B">C09J7/30</main-classification>
        <further-classification edition="200601120260416B">C09J133/08</further-classification>
        <further-classification edition="200601120260416B">C09J11/06</further-classification>
        <further-classification edition="200601120260416B">C09J9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤峰花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, REIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小坂尚史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, NAOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野瑞穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, MIZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種黏著劑組合物，其能夠實現接著所需之初始接著力，另一方面，由於施加電壓後之接著力極小，因此能夠實現較大之接著力下降率，具有優異之電氣剝離性能。  &lt;br/&gt;本發明之黏著劑組合物係包含聚合物及電解質者，上述電解質係該電解質之陽離子之還原物與上述聚合物之HSP距離為2.5 MPa&lt;sup&gt;0.5&lt;/sup&gt;～5.0 MPa&lt;sup&gt;0.5&lt;/sup&gt;者，由上述黏著劑組合物形成之黏著劑層之離子傳導度為5.0 μS/m以上，且由上述黏著劑組合物形成之黏著劑層之2分鐘後之接著力回復率為60%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1':電氣剝離型黏著劑層</p>
        <p type="p">5':導電性基材</p>
        <p type="p">6:不鏽鋼板</p>
        <p type="p">α:部位</p>
        <p type="p">β:部位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1018" publication-number="202631310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭部掃掠控制</chinese-title>
        <english-title>CONTROL OF HEAD SWEEP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260427B">B24B37/04</main-classification>
        <further-classification edition="201201120260427B">B24B37/10</further-classification>
        <further-classification edition="201201120260427B">B24B37/26</further-classification>
        <further-classification edition="201201120260427B">B24B37/32</further-classification>
        <further-classification edition="202601120260427B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　煥波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢　駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統和方法用於決定複數個控制參數的值，以最小化目標去除剖面與預期去除剖面之間的差異，複數個控制參數至少表示第一持續時間和第二持續時間，並促使承載頭在第一持續時間內，將基板橫向移動過拋光墊，使得基板的中心區域和邊緣區域定位於拋光墊的拋光表面上；並在第二持續時間內，將基板保持在基本上橫向固定的位置，使得基板的中心區域定位於拋光墊的拋光表面上，且基板的邊緣區域的至少一部分定位於拋光墊的拋光控制溝槽上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for determining values for a plurality of control parameters to minimize a difference between a target removal profile and an expected removal profile, the plurality of control parameters representing at least a first duration and a second duration and cause the carrier head to, for the first duration, moving the substrate laterally across the polishing pad such that the central region and the edge region of the substrate are positioned over a polishing surface of the polishing pad, and for the second duration, hold the substrate in a substantially laterally fixed position such that the central region of the substrate is positioned over the polishing surface of the polishing pad and the at least a portion of the edge region of the substrate is positioned over a polishing control groove of the polishing pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">30:拋光墊</p>
        <p type="p">71:軸</p>
        <p type="p">102:溝槽</p>
        <p type="p">200:環形域</p>
        <p type="p">200a:區</p>
        <p type="p">200b:區</p>
        <p type="p">200c:區</p>
        <p type="p">200d:區</p>
        <p type="p">C:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1019" publication-number="202631839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜用樹脂膜及光學膜用樹脂膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08J5/18</main-classification>
        <further-classification edition="201901120260416B">B32B7/023</further-classification>
        <further-classification edition="200601120260416B">C08K5/1575</further-classification>
        <further-classification edition="200601120260416B">B29C55/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新日本理化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森一紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村理穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, RIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口政之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種光學膜用樹脂膜，其含有：具有正雙折射之非晶質樹脂、與式（1）所表示之二縮醛化合物。上述膜中，上述二縮醛化合物以顯示出負雙折射之晶體或締合狀態析出。  &lt;br/&gt;&lt;img align="absmiddle" height="191px" width="417px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;相同或不同，分別表示氫原子、碳數1～4之烷基、碳數1～4之烷氧基、碳數1～4之烷氧基羰基、碳數1～4之鹵化烷基或鹵素原子。R&lt;sup&gt;7&lt;/sup&gt;表示氫原子、碳數1～4之烷基、碳數1～4之烯基、碳數1～4之烷氧基、碳數1～4之烷氧基羰基或碳數1～4之鹵化烷基）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1020" publication-number="202633289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P50/20</main-classification>
        <further-classification edition="202601120260420B">H10P50/28</further-classification>
        <further-classification edition="200601120260420B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久松亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISAMATSU, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木原嘉英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIHARA, YOSHIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一例示性實施方式中，蝕刻方法包括如下步驟：(a)向腔室內之基板支持部上提供基板，基板包含第1區域及第2區域，第1區域包含含有氮及矽之第1材料，第2區域包含與第1材料不同之第2材料；(b)將基板暴露於包含氟化氫氣體之第1處理氣體；及(c)於(b)之後，將基板暴露於由包含非活性氣體之第2處理氣體產生之電漿，電漿包含非活性氣體之離子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MT1:方法</p>
        <p type="p">ST1~ST5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1021" publication-number="202633485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珍銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JINMYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金彩姈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHAELYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李全一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路裝置包括：一下絕緣膜，其在基體上方；第一及第二下金屬佈線層，其在一垂直方向上通過該下絕緣膜且彼此間隔開，而該下絕緣膜之一第一局部區在其間；一絕緣蝕刻停止層，其包括覆蓋該第一局部區之一第一部分；一通孔跨接線接觸單元，其包括接觸該第一下金屬佈線層之一第一表面、接觸該第二下金屬佈線層之一第二表面、以及在該第一接觸表面與該第二接觸表面之間以接觸該絕緣蝕刻停止層之該第一部分的一第三表面；以及一上金屬佈線層，其在該垂直方向上與該第一及第二下金屬佈線層中之至少一者間隔開而讓該通孔跨接線接觸單元在其間，且一體連接於該通孔跨接線接觸單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes a lower insulating film over a substrate, first and second lower metal wiring layers passing through the lower insulating film in a vertical direction and spaced apart from each other with a first local region of the lower insulating film therebetween, an insulating etch stop layer including a first portion covering the first local region, a via jumper contact unit including a first surface contacting the first lower metal wiring layer, a second surface contacting the second lower metal wiring layer, and a third surface between the first and second contact surfaces to contact the first portion of the insulating etch stop layer, and an upper metal wiring layer spaced apart from at least one of the first and second lower metal wiring layers in the vertical direction with the via jumper contact unit therebetween and integrally connected to the via jumper contact unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路裝置</p>
        <p type="p">110:基體</p>
        <p type="p">110M:主要表面</p>
        <p type="p">112:第一下蝕刻停止層</p>
        <p type="p">114:第一層間介電質</p>
        <p type="p">120:傳導結構</p>
        <p type="p">122:第二下蝕刻停止層</p>
        <p type="p">124:第二層間介電質</p>
        <p type="p">126:下絕緣膜</p>
        <p type="p">126T,130T:上表面</p>
        <p type="p">130:下金屬佈線層</p>
        <p type="p">140:上絕緣膜</p>
        <p type="p">150:上金屬佈線層</p>
        <p type="p">ESL1:絕緣蝕刻停止層</p>
        <p type="p">EX1:區</p>
        <p type="p">VJC:通孔跨接線接觸單元</p>
        <p type="p">X:第一水平方向、方向、水平方向</p>
        <p type="p">X1-X1':線</p>
        <p type="p">Y:第二水平方向、方向、水平方向</p>
        <p type="p">Z:垂直方向、方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1022" publication-number="202632184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>戶外燈組合結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">F21V17/16</main-classification>
        <further-classification edition="200601120260504B">F21S9/03</further-classification>
        <further-classification edition="200601320260504B">F21W131/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國大都會有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METROMAX AMERICA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　克莉絲汀娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種戶外燈組合結構，包含一底座、一燈罩，該底座上設置一電路板及一電池倉，其中該電路板中央設有一開口，該電池倉設在該開口內，具有一高於電路板的頂板以及由該頂板向外傾斜延伸的複數彈性壓條，組裝時，該燈罩向下壓迫該電池倉，促使該複數彈性壓條向下壓抵電路板而完成該電路板的定位，據以節省組裝工時及成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底座</p>
        <p type="p">11:固定平台</p>
        <p type="p">12:容置槽</p>
        <p type="p">13:環狀凹溝</p>
        <p type="p">2:燈罩</p>
        <p type="p">21:透光板</p>
        <p type="p">22:環狀邊框</p>
        <p type="p">23:環狀底邊</p>
        <p type="p">3:電路板</p>
        <p type="p">301:頂面</p>
        <p type="p">31:開口</p>
        <p type="p">32:LED</p>
        <p type="p">4:電池倉</p>
        <p type="p">41:外周壁</p>
        <p type="p">42:頂板</p>
        <p type="p">43:彈性壓條</p>
        <p type="p">431:延伸段</p>
        <p type="p">432:彎曲段</p>
        <p type="p">433:壓觸段</p>
        <p type="p">44:肋片</p>
        <p type="p">5:太陽能板</p>
        <p type="p">6:膠圈</p>
        <p type="p">61:第一彈性支撐塊</p>
        <p type="p">62:第二彈性支撐塊</p>
        <p type="p">63:第一止水套</p>
        <p type="p">64:第二止水套</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1023" publication-number="202631124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫藥組成物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/381</main-classification>
        <further-classification edition="200601120260504B">A61K31/343</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/36</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＥＡ製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EA PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野覚士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種醫藥組成物，其係在一定期間保管後仍會維持有效成分之溶出性。醫藥組成物包含：包含下述式(1)所示之化合物或其醫藥上容許之鹽之有效成分，與羧甲基纖維素以外之至少一種崩解劑。  &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="418px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pharmaceutical composition is provided that maintains the dissolution property of the active ingredient even after storage for a certain period. The pharmaceutical composition comprises an active ingredient containing a compound represented by the following formula (1) or a pharmaceutically acceptable salt thereof, and at least one disintegrant other than carmellose. &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="244px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1024" publication-number="202633461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成裝置封裝的方法</chinese-title>
        <english-title>METHOD OF FORMING DEVICE PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10W70/09</main-classification>
        <further-classification edition="202601120260417B">H10W90/10</further-classification>
        <further-classification edition="202601120260417B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基亞尼安索赫拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIANIAN, SOHRAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊健剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIUNG, KUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例包括形成裝置封裝的方法，包括：形成裝置包含層於第一基板的支撐表面上，其中形成裝置包含層包括：形成第一開口於第一介電層中，第一介電層形成於第一導電層上，其中第一導電層形成於第一接合層上，第一接合層位於支撐表面及裝置包含層間，及第一導電層的第一部分暴露於第一各第一開口中；形成第二導電層於第一導電層的第一部分上，以形成柱於各第一開口中；移除第一介電層，其中第一導電層的第二部分在移除第一介電層後暴露，第一導電層的第二部分設置於第一基板的第一部分上；移除第一導電層的第二部分；定位一或多個電子裝置於第一基板的第一部分上且相鄰於柱，其中此一或多個電子裝置具有裝置厚度，小於或等於柱的第二厚度；沉積成型材料於柱及此一或多個電子裝置上；及利用材料移除製程形成平坦表面，包括成型材料的部分、此一或多個電子裝置的部分、及柱的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure include a method of forming a device package, comprising: forming a device containing layer over a supporting surface of a first substrate, wherein forming the device containing layer comprises: forming a plurality of first openings in a first dielectric layer that is formed over a first conductive layer, wherein the first conductive layer has a first thickness, and is formed over a first bonding layer positioned between the supporting surface and the device containing layer, and a first portion of the first conductive layer is exposed within each of a plurality of first openings formed in the first dielectric layer; forming a second conductive layer on the first portions of the first conductive layer to form a pillar in each of the first openings, wherein the pillars have a second thickness; removing the first dielectric layer, wherein a second portion of the first conductive layer is exposed after removing the first dielectric layer, and the second portion of the first conductive layer is disposed over a first portion of the first substrate; removing the second portion of the first conductive layer; positioning one or more electronic devices over the first portion of the first substrate and adjacent to a pillar, wherein the one or more electronic devices have a device thickness that is less than or equal to the second thickness of the pillar; depositing a molding material over the pillars and the one or more electronic devices; and forming, by use of a material removal process, a planar surface that comprises a portion of the molding material, a portion of the one or more electronic devices, and a portion of the pillars.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置封裝</p>
        <p type="p">101:載體基板</p>
        <p type="p">105:第一裝置層結構</p>
        <p type="p">106:第二裝置層結構</p>
        <p type="p">107:第三裝置層結構</p>
        <p type="p">110,141,143:接觸件</p>
        <p type="p">111~117:電子裝置</p>
        <p type="p">120:裝置層堆疊</p>
        <p type="p">121:第一裝置包含層</p>
        <p type="p">122:第一互連層</p>
        <p type="p">122A,126A,128A:第一重分布層</p>
        <p type="p">122B,126B,128B:第二重分布層</p>
        <p type="p">122C,126C:第三重分布層</p>
        <p type="p">125:第二裝置包含層</p>
        <p type="p">126:第二互連層</p>
        <p type="p">127:第三裝置包含層</p>
        <p type="p">128:第三互連層</p>
        <p type="p">140:互連件</p>
        <p type="p">142:焊球</p>
        <p type="p">145:互連區域</p>
        <p type="p">150:電性元件</p>
        <p type="p">231,233,235:柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1025" publication-number="202632033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物理氣相沉積靶材及應用其之物理氣相沉積處理系統</chinese-title>
        <english-title>PHYSICAL VAPOR DEPOSITION TARGET AND PHYSICAL VAPOR DEPOSITION PROCESSING SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C14/34</main-classification>
        <further-classification edition="200601120260422B">C23C14/35</further-classification>
        <further-classification edition="202601120260422B">H10P14/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希莫加邁拉帕　馬丹庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOGA MYLARAPPA, MADAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋佼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩萬代庫　基蘭庫馬爾尼拉昌德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAVANDAIAH, KIRANKUMAR NEELASANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄　正敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLARENCE CHONG, ZHENG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>符　翔理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, XIANGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一實施例中，提出一種物理氣相沉積(physical vapor deposition，PVD)靶材。PVD靶材包括一主體，具有一靶材區域以及一背襯區域。背襯區域包括大於靶材區域的直徑的一直徑。靶材區域及背襯區域具有相同的熱膨脹係數以及相同的材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, a physical vapor deposition (PVD) target is provided. The PVD target includes a body having a target region and a backing region. The backing region includes a diameter greater than the diameter of the target region. The target region and backing region have the same coefficient of thermal expansion and the same material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:靶材</p>
        <p type="p">201:主體</p>
        <p type="p">202:靶材區域</p>
        <p type="p">203:背襯區域</p>
        <p type="p">205:固定面</p>
        <p type="p">207:固定區域</p>
        <p type="p">210:直徑</p>
        <p type="p">215:製程面</p>
        <p type="p">217:側壁</p>
        <p type="p">221:上面</p>
        <p type="p">223:通道</p>
        <p type="p">225:延伸長度</p>
        <p type="p">227:靶材區域直徑</p>
        <p type="p">248:主體厚度</p>
        <p type="p">252:外面</p>
        <p type="p">253:支撐區域</p>
        <p type="p">256:厚度</p>
        <p type="p">257:固定厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1026" publication-number="202631928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面保護膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260420B">C09J7/30</main-classification>
        <further-classification edition="200601120260420B">C09J133/08</further-classification>
        <further-classification edition="200601120260420B">C09J11/06</further-classification>
        <further-classification edition="201501120260420B">G02B1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷陸駆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, RIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦上和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAKAMI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂誠治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSURA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠表現出優異之剝離帶電抑制能力之表面保護膜。本發明提供一種包含此種表面保護膜之光學元件及電子元件。  &lt;br/&gt;本發明之實施方式之表面保護膜係具有基材與黏著劑層者，且該黏著劑層由丙烯酸系黏著劑構成，該丙烯酸系黏著劑由丙烯酸系黏著劑組合物形成，該丙烯酸系黏著劑組合物包含丙烯酸系聚合物與界面活性劑(A)，該界面活性劑(A)係不具有芳香族環之界面活性劑，於該丙烯酸系黏著劑組合物中之該界面活性劑(A)之含量相對於該丙烯酸系聚合物100重量份為X重量份，且該黏著劑層之厚度為Y μm時，滿足X×Y≥0.80。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">3:剝離襯墊</p>
        <p type="p">10:表面保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1027" publication-number="202631651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衣殼多肽及其用途（一）</chinese-title>
        <english-title>CAPSID POLYPEPTIDES AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/005</main-classification>
        <further-classification edition="200601120260504B">C12N15/86</further-classification>
        <further-classification edition="201501120260504B">A61K35/76</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商戴諾治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DYNO THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃洛克　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLOCK, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊默　梅根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAMER, MEGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文部分涉及可用於遞送載荷的依賴性細小病毒衣殼多肽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is directed in part to dependoparvovirus capsid polypeptides that can be used to deliver payloads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1028" publication-number="202631999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重組ＡＡＶ的生產</chinese-title>
        <english-title>PRODUCTION OF RECOMBINANT AAV</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N15/86</main-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健臻公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENZYME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴薩瓦拉吉　梅格哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASAVARAJ, MEGHANA KODALALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狄恩　賈羅德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEAN, JARROD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克薩納庫爾蒂　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KESANAKURTI, PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧里爾丹　凱薩琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'RIORDAN, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供在單一細胞中生產用於表現兩或更多種轉基因的重組腺相關病毒的混合群體之方法、以及生產含有自我互補基因組的重組腺相關病毒之方法。還提供了使用本文中生產的rAAV組成物來治療疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of producing in a single cell a mixed population of recombinant adeno-associated viruses for expressing two or more transgenes and methods of producing recombinant adeno-associated viruses containing self-complementary genomes. Also provided are methods of treating diseases using the rAAV compositions produced herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1029" publication-number="202631672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由細胞表現之調控生物活性的結合分子</chinese-title>
        <english-title>BINDING MOLECULES THAT MODULATE A BIOLOGICAL ACTIVITY EXPRESSED BY A CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K16/28</main-classification>
        <further-classification edition="200601120260429B">C07K16/46</further-classification>
        <further-classification edition="200601120260429B">C12N15/13</further-classification>
        <further-classification edition="200601120260429B">C12N15/63</further-classification>
        <further-classification edition="200601120260429B">C12N5/10</further-classification>
        <further-classification edition="200601120260429B">A61K39/395</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
        <further-classification edition="200601120260429B">A61P31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商米樂斯責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERUS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潔茱貞　塞西莉亞　安娜　威爾漢米娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEUIJEN, CECILIA ANNA WILHELMINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫斯特　瑞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOOSTER, RINSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　克魯夫　康納里斯　艾迪恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE KRUIF, CORNELIS ADRIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰肯　賽拉斯　喬漢尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACKEN, PAULUS JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索羅斯比　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THROSBY, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆特堡　唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOGTENBERG, TON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供抑制細胞的生物活性的手段和方法。在一實施例中，本發明有關於抑制第一或第二細胞中，由彼此為結合配偶體的兩個膜蛋白質的結合所介導的生物活性的方法。藉由對細胞提供可結合至每個所提及的結合配偶體結合的抗體或類抗體分子，來抑制所提及的生物活性，且前述結合阻斷這兩個結合配偶體的結合，從而抑制所提及的生物活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides means and methods for inhibiting a biological activity of cells. In one embodiment the invention is concerned with a method of inhibiting a biological activity in a first or second cell mediated by the binding of two membrane proteins that are binding partners for each other. The mentioned biological activity is inhibited by providing the cells with an antibody or antibody like molecule that can bind to each of the mentioned binding partners and the binding blocks the binding of the two binding partners thereby inhibiting the mentioned biological activity.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1030" publication-number="202632071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無電解鍍釕浴</chinese-title>
        <english-title>ELECTROLESS RUTHENIUM PLATING BATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C18/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商上村工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C. UYEMURA &amp; CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊克久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, KATSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田哲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, TETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊井義人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>II, YOSHIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸尾洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUO, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種無電解鍍釕浴，其使用肼類作為還原劑，能夠提高鍍浴穩定性，並具優異之釕析出性，能夠抑制退火處理時鍍膜的收縮。一種無電解鍍釕浴，其至少含有釕化合物、還原劑以及穩定劑，還原劑為肼類，穩定劑由羥胺化合物與具有羥基的有機化合物構成，羥胺化合物為硫酸羥胺與鹽酸羥胺中的至少一者，具有羥基的有機化合物為從由葡萄糖酸內酯、山梨糖醇、甘露醇以及檸檬酸一水合物組成之群中選出的至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide an electroless ruthenium plating bath that uses a hydrazine as a reducing agent, and that can improve bath stability, has excellent ruthenium deposition properties, and can suppress film shrinkage during annealing treatment. The electroless ruthenium plating bath comprises at least a ruthenium compound, a reducing agent, and a stabilizer, wherein the reducing agent is a hydrazine, the stabilizer comprises a hydroxylamine compound and an organic compound having a hydroxyl group, the hydroxylamine compound is at least one of hydroxylamine sulfate and hydroxylamine chloride, and the organic compound having a hydroxyl group is at least one selected from the group consisting of gluconolactone, sorbitol, mannitol, and citric acid monohydrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1031" publication-number="202631915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光液</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C09G1/02</main-classification>
        <further-classification edition="200601120260420B">C09K3/14</further-classification>
        <further-classification edition="202601120260420B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安可賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, KEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　守田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHOUTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王興平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寅斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, TINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明基於氧化鈰的拋光液，使用通式I類化合物作為多晶矽助劑，在酸性條件下實現了對多晶矽的拋光去除。同時可以調節氧化矽和多晶矽的拋光速率比。通式I化合物，具體結構如下：  &lt;br/&gt;&lt;img align="absmiddle" height="87px" width="115px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中，X1至X3各自獨立選自C或N，且X1至X3中至少一個為N；R1選自H或氨基；R2選自H、甲基、氨基、&lt;img align="absmiddle" height="54px" width="70px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="58px" width="69px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="51px" width="69px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="55px" width="69px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="50px" width="50px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、&lt;img align="absmiddle" height="47px" width="35px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、或&lt;img align="absmiddle" height="48px" width="43px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application is based on a polishing solution of cerium oxide. The general formula I type compounds are used as dopants for polysilicon, and the polishing removal of polysilicon is achieved under acidic conditions. At the same time, the polishing rate ratio of silicon oxide and polysilicon can be adjusted. The specific structure of the general formula I compound is as follows: &lt;br/&gt;&lt;img align="absmiddle" height="95px" width="118px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;Wherein X1 to X3 are each independently selected from C or N, and at least one of X1 to X3 is N; R1 is selected from H or amino; R2 is selected from H, methyl, amino, &lt;img align="absmiddle" height="53px" width="66px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="52px" width="64px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="54px" width="61px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="54px" width="61px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="52px" width="44px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="40px" width="40px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,or &lt;img align="absmiddle" height="50px" width="48px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1032" publication-number="202631514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、水處理系統、控制方法及程式</chinese-title>
        <english-title>CONTROL DEVICE, WATER TREATMENT SYSTEM, CONTROL METHOD, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260422B">C02F1/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田響介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧口佳介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於進行有效率的藥品添加。  &lt;br/&gt;本發明之控制裝置具有：藥品資訊取得部110，係取得顯示添加至被供給至水處理裝置200之被處理水的藥品的添加量的藥品資訊；水質值取得部120，係取得水處理裝置200或水處理裝置300添加藥品後之被處理水的水質值；條件水質值取得部130，係取得水處理裝置300處理後之處理水滿足的水質值；必要添加量算出部140，係基於水質值取得部120所取得的水質值與條件水質值取得部130所取得的水質值，來算出添加至被供給至水處理裝置300之被處理水的藥品的添加量；差距量算出部150，係算出必要添加量算出部140所算出的添加量與藥品資訊取得部110所取得的藥品的添加量的差距量；以及提示部160，係將差距量算出部150所算出的添加量提示於水處理裝置300。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to enable efficient addition of chemicals. &lt;br/&gt;A control device of the invention comprises a chemical information acquisition section 110 which acquires chemical information indicating an addition amount of a chemical added to a water to be treated that is supplied to a water treatment device 200, a water quality value acquisition section 120 which acquires a water quality value of a water to be treated to which a chemical has been added by the water treatment device 200 or a water treatment device 300, a condition water quality value acquisition section 130 which acquires a water quality value satisfied by the treated water that has been treated by the water treatment device 300, a required addition amount calculation section 140 which calculates the amount of chemical to add to the water to be treated supplied to the water treatment device 300 based on the water quality value acquired by the water quality value acquisition section 120 and the water quality value acquired by the condition water quality value acquisition section 130, a difference calculation section 150 which calculates the difference between the addition amount calculated by the required addition amount calculation section 140 and the addition amount for the chemical acquired by the chemical information acquisition section 110, and an output section 160 which outputs the addition amount calculated by the difference calculation section 150 to the water treatment device 300.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">110:藥品資訊取得部</p>
        <p type="p">120:水質值取得部</p>
        <p type="p">130:條件水質值取得部</p>
        <p type="p">140:必要添加量算出部</p>
        <p type="p">150:差距量算出部</p>
        <p type="p">160:提示部</p>
        <p type="p">200,300:水處理裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1033" publication-number="202631904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備由包含電絕緣性樹脂之組成物構成的樹脂構件及金屬構件之樹脂金屬複合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L101/12</main-classification>
        <further-classification edition="200601120260504B">C08L67/04</further-classification>
        <further-classification edition="201801120260504B">C08K3/013</further-classification>
        <further-classification edition="200601120260504B">B29C45/00</further-classification>
        <further-classification edition="200601120260504B">B29C45/14</further-classification>
        <further-classification edition="200601120260504B">H01R13/405</further-classification>
        <further-classification edition="200601120260504B">H01R13/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊純樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西彬人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅津秀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMETSU, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">獲得一種樹脂金屬複合體，其樹脂構件的滯留穩定性優異，從而提升低毛邊性，且生產性與可靠性優異。一種樹脂金屬複合體，其係具備樹脂構件與金屬構件之樹脂金屬複合體，該樹脂構件係由包含電絕緣性樹脂之組成物所構成，組成物中之電絕緣性樹脂的示差掃描熱量測定所得到之熔點(Tm)為300～340℃，Tm波峰的半值寬為5.0～20.0℃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:Tm波峰</p>
        <p type="p">7:波峰6的基線</p>
        <p type="p">8:通過波峰6的峰頂之與基線7垂直的線</p>
        <p type="p">9:Tm波峰的半值寬(℃)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1034" publication-number="202632096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備基於熱塑性共聚酯彈性體之纖維之方法</chinese-title>
        <english-title>METHOD OF MAKING A THERMOPLASTIC COPOLYESTER ELASTOMER-BASED FIBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">D01F6/84</main-classification>
        <further-classification edition="200601120260422B">C08G63/88</further-classification>
        <further-classification edition="200601120260422B">D01D5/08</further-classification>
        <further-classification edition="200601120260422B">D04B1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑟蘭斯聚合物控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELANESE POLYMERS HOLDING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科維利　卡門　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COVELLI, CARMEN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋特　傑米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAITOR, JAMIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　愛德華　馬克斯威爾　德　布朗特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, EDWARD MAXWELL DE BRANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種製備基於熱塑性共聚酯彈性體之纖維之方法。該方法包括：提供數量平均分子量大於35,000 g/mol之熱塑性共聚酯彈性體；及紡絲該熱塑性共聚酯彈性體以提供包括紡絲熱塑性共聚酯彈性體之纖維，其中該紡絲熱塑性共聚酯彈性體之數量平均分子量係該熱塑性共聚酯彈性體之數量平均分子量之98%或更低至50%或更高。本發明亦揭示根據上文所提及方法製備之基於熱塑性共聚酯彈性體之纖維及包括該上文所提及基於熱塑性共聚酯彈性體之纖維之織物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of making a thermoplastic copolyester elastomer-based fiber is disclosed. The method comprises: providing a thermoplastic copolyester elastomer having a number average molecular weight of greater than 35,000 g/mol; and spinning the thermoplastic copolyester elastomer to provide a fiber comprising a spun thermoplastic copolyester elastomer, wherein the spun thermoplastic copolyester elastomer has a number average molecular weight that is 98% or less to 50% or more the number average molecular weight of the thermoplastic copolyester elastomer. A thermoplastic copolyester elastomer-based fiber made according to the aforementioned method and a fabric comprising the aforementioned thermoplastic copolyester elastomer-based fiber are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1035" publication-number="202632970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遙控操作裝置、及具備其的作業用車輛系統、採伐作業車輛系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">H04Q9/00</main-classification>
        <further-classification edition="200601120260129B">E02F9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松本系統工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO SYSTEM ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本良三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, RYOZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種遙控操作裝置、以及具備其的作業用車輛系統與採伐作業車輛系統，該遙控操作裝置可容易地掌握周圍之狀況，且作業員可透過遙控容易地進行作業。本發明為遙控操作裝置(2)，具有：圖像顯示部(6)，穿戴於頭部；車輛操作部(8)，進行用於使作業用車輛(4)作動的操作；圖像資訊接收部(10)，接收主圖像資訊，其係由被安裝於作業用車輛的一對攝像機所拍攝(32a,32b)；動作取得部(12)，取得作業員之動作資訊；立體圖像產生部(14)，基於藉由該動作取得部所取得到的作業員之動作資訊，將藉由圖像資訊接收部所接收到的主圖像資訊進行加工，並產生使圖像顯示部顯示的主立體圖像；以及操作資訊發送部(18)，將作業員對車輛操作部進行操作的資訊，發送至作業用車輛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:作業用車輛系統</p>
        <p type="p">2:遙控操作裝置</p>
        <p type="p">4:採伐作業車輛(作業用車輛)</p>
        <p type="p">6:護目鏡(圖像顯示部)</p>
        <p type="p">6a:第一顯示器</p>
        <p type="p">6b:第二顯示器</p>
        <p type="p">8:車輛操作部</p>
        <p type="p">10:圖像資訊接收部</p>
        <p type="p">12:動作取得部</p>
        <p type="p">14:立體圖像產生部</p>
        <p type="p">16a:操作桿</p>
        <p type="p">16b:操作按鈕</p>
        <p type="p">18:操作資訊發送部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1036" publication-number="202631991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有一個或多個用於增強異種移植物存活和/或耐受性的經修飾基因的細胞、組織、器官和/或動物</chinese-title>
        <english-title>CELLS, TISSUES, ORGANS, AND/OR ANIMALS HAVING ONE OR MORE MODIFIED GENES FOR ENHANCED XENOGRAFT SURVIVAL AND/OR TOLERANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N5/10</main-classification>
        <further-classification edition="202401120260504B">A01K67/0275</further-classification>
        <further-classification edition="200601120260504B">C12N15/85</further-classification>
        <further-classification edition="200601120260504B">C12N9/02</further-classification>
        <further-classification edition="200601120260504B">C12N15/87</further-classification>
        <further-classification edition="200601120260504B">C12N15/90</further-classification>
        <further-classification edition="200601120260504B">C07K14/47</further-classification>
        <further-classification edition="200601120260504B">C07K14/705</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｅ開創生物技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGENESIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　璐菡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LUHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高陽斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YANGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂爾　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUELL, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎　沂南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAN, YINAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦　文寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, WENNING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開文本涉及具有一個或多個用於增強異種移植物存活和/或耐受性的經修飾基因的細胞、組織、器官和/或動物。此外，本公開文本涉及製備和使用具有一個或多個所述經修飾基因的所述細胞、組織、器官和/或動物的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to cells, tissues, organs, and/or animals having one or more modified genes for enhanced xenograft survival and/or tolerance. In addition, the present disclosure relates to methods of making and using the cells, tissues, organs, and/or animals having one or more of the modified genes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1037" publication-number="202631707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴墨用硬化性組合物、電子零件及電子零件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08F2/44</main-classification>
        <further-classification edition="200601120260422B">C09D4/02</further-classification>
        <further-classification edition="201401120260422B">C09D11/102</further-classification>
        <further-classification edition="201401120260422B">C09D11/30</further-classification>
        <further-classification edition="200601120260422B">C09D163/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝間大知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUMA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種噴墨用硬化性組合物，其能夠抑制使用噴墨裝置塗佈之硬化性組合物之滲出，且能夠抑制硬化物產生裂痕。  &lt;br/&gt;本發明之噴墨用硬化性組合物包含光硬化性化合物、光聚合起始劑、熱硬化性化合物、及熱硬化劑，上述光聚合起始劑包含25℃下為液狀之α-胺基酮系光聚合起始劑，或上述光聚合起始劑包含分子量為500以上之α-胺基酮系光聚合起始劑，上述熱硬化性化合物包含25℃下為液狀之熱硬化性化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1038" publication-number="202632263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能快速偵測的電子鼻及其機器人</chinese-title>
        <english-title>ELECTRONIC NOSE FOR RAPID DETECTION AND ROBOT EQUIPPED WITH ELECTRONIC NOSE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G01N27/04</main-classification>
        <further-classification edition="200601120251103B">G01N27/02</further-classification>
        <further-classification edition="201601120251103B">A61B34/35</further-classification>
        <further-classification edition="202001120251103B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾諾斯生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AINOS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡群賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖家男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIA-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能快速偵測的電子鼻，包括一進氣單元、一偵測單元、一淨化單元、一抽氣單元及一控制系統，該進氣單元用於引入一外界氣體，該偵測單元包括一腔室、一循環管路及一偵測模組，該循環管路用於輸送一清潔該腔室的循環氣流，該進氣單元用於輸送待偵測的該外界氣體，該淨化單元與該循環通道連通而讓該循環氣流流經且淨化該循環氣流，該抽氣單元連接該循環管路以在該腔室內產生負壓而形成該循環氣流，該控制系統連接至該偵測模組並接收該偵測模組產生的一偵測訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic nose for rapid detection comprises a gas intake unit, a detection unit, a purification unit, an evacuation unit, and a control system. The gas intake unit is used to introduce an external gas. The detection unit includes a chamber, a circulation pipeline, and a detection module. The circulation pipeline is used to transport a circulating gas flow to clean the chamber. The gas intake unit is used to transport the external gas to be detected. The purification unit is in fluid communication with the circulation channel to allow the circulating airflow to pass therethrough and be purified. The evacuation unit is connected to the circulation pipeline to generate negative pressure in the chamber to form the circulating gas flow. The control system is connected to the detection module and receives a detection signal generated by the detection module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子鼻</p>
        <p type="p">10:進氣單元</p>
        <p type="p">11:氣體入口</p>
        <p type="p">12:進氣通道</p>
        <p type="p">13:第一流體調節裝置</p>
        <p type="p">131:第一開口</p>
        <p type="p">132:第二開口</p>
        <p type="p">133:第三開口</p>
        <p type="p">14:氣體出口</p>
        <p type="p">20:偵測單元</p>
        <p type="p">21:第一腔室</p>
        <p type="p">210:進氣口</p>
        <p type="p">211:排氣口</p>
        <p type="p">22:循環管路</p>
        <p type="p">220:第一段部</p>
        <p type="p">221:第二段部</p>
        <p type="p">23:循環通道</p>
        <p type="p">231:第二流體調節裝置</p>
        <p type="p">232:第一開口</p>
        <p type="p">233:第二開口</p>
        <p type="p">234:第三開口</p>
        <p type="p">24:氣體偵測元件</p>
        <p type="p">25:環境偵測元件</p>
        <p type="p">26:第二腔室</p>
        <p type="p">26a:上游區域</p>
        <p type="p">26b:下游區域</p>
        <p type="p">30:淨化單元</p>
        <p type="p">31:載體</p>
        <p type="p">32:發光元件</p>
        <p type="p">40:抽氣單元</p>
        <p type="p">50:控制系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1039" publication-number="202631708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136247</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓印用硬化性組成物、硬化物、壓印圖案之製造方法及器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/50</further-classification>
        <further-classification edition="200601120260504B">C08F20/00</further-classification>
        <further-classification edition="200601120260504B">C08F4/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/49</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C08L57/00</further-classification>
        <further-classification edition="200601120260504B">B29C59/02</further-classification>
        <further-classification edition="200601120260504B">G03F7/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袴田旺弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKAMATA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>也
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOJU, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種壓印用硬化組成物、上述壓印用硬化性組成物的硬化物、使用了上述壓印用硬化性組成物的壓印圖案之製造方法、以及包括上述壓印圖案之製造方法的器件之製造方法，所述壓印用硬化組成物包含：聚合性化合物；聚合引發劑；以及選自由有機磷酸衍生物、有機膦酸衍生物、及羰基不直接鍵結於磷原子的有機氧化膦衍生物所組成之群組中的一種以上有機磷化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1040" publication-number="202631381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件、樹脂及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B15/08</main-classification>
        <further-classification edition="200601120260504B">C08G77/10</further-classification>
        <further-classification edition="200601120260504B">C08G77/12</further-classification>
        <further-classification edition="200601120260504B">C08K5/29</further-classification>
        <further-classification edition="200601120260504B">C08L79/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野崎敦靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, ATSUYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含樹脂及光聚合起始劑之樹脂組成物、硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型樹脂及化合物，前述樹脂為選自由聚醯亞胺及聚醯胺組成之群組中之至少1種樹脂，並且具有由下述式（A-1）表示之結構。  &lt;br/&gt;&lt;img align="absmiddle" height="146px" width="332px" file="ed10132.JPG" alt="ed10132.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1041" publication-number="202631726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件及聚醯亞胺</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08F2/48</main-classification>
        <further-classification edition="200601120260417B">C08G73/12</further-classification>
        <further-classification edition="200601120260417B">G03F7/038</further-classification>
        <further-classification edition="200601120260417B">C08L79/08</further-classification>
        <further-classification edition="200601120260417B">B32B27/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅川大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田知樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含含有由式（A-1）表示之重複單元且具有自由基聚合性基團之聚醯亞胺之樹脂組成物、硬化上述樹脂組成物而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法之半導體器件之製造方法及包含上述硬化物之半導體器件、以及具有由式（A-2）表示之重複單元及由式（A-3）表示之重複單元之聚醯亞胺。  &lt;br/&gt;&lt;img align="absmiddle" height="249px" width="550px" file="ed10095.JPG" alt="ed10095.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1042" publication-number="202631810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體裝置的製造方法、半導體裝置、及聚醯亞胺</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/037</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/28</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="202601120260504B">H10P14/68</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅川大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田知樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含含有由式（A-1）表示之重複單元並且具有自由基聚合性基團之聚醯亞胺之樹脂組成物、硬化上述樹脂組成物而成之硬化物、包含上述硬化物之積層體、上述硬化物的製造方法、上述積層體的製造方法、包括上述硬化物的製造方法之半導體裝置的製造方法及包含上述硬化物之半導體裝置、以及具有由式（A-2）表示之重複單元及由式（A-3）表示之重複單元之聚醯亞胺。  &lt;br/&gt;&lt;img align="absmiddle" height="242px" width="536px" file="ed10100.JPG" alt="ed10100.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1043" publication-number="202631227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可變換推拉功能的運動裝置</chinese-title>
        <english-title>EXERCISE DEVICE WITH ALTERNATIVE PUSH AND PULL FUNCTIONALITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">A63B22/00</main-classification>
        <further-classification edition="200601120260428B">A63B23/035</further-classification>
        <further-classification edition="200601120260428B">A63B21/22</further-classification>
        <further-classification edition="200601120260428B">A63B21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商第二概念公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONCEPT2, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德瑞西蓋克爾　理查德　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DREISSIGACKER, RICHARD ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德瑞西蓋克爾　彼得　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DREISSIGACKER, PETER DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂文森　凱文　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVENSON, KEVIN DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯皮格爾　科迪　格雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIEGEL, CODY GREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克斯　丹尼爾　卡雷布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS, DANIEL CALEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法拉羅　伊莉莎白　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRARO, ELIZABETH SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒布朗　克里斯多夫　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEBLANC, CHRISTOPHER MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明展示及描述一種具有可變換推拉功能之運動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An exercise device with alternative push and pull functionality is shown and described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:運動裝置</p>
        <p type="p">12:方向(大體朝向座椅)</p>
        <p type="p">14:方向(大體遠離座椅)</p>
        <p type="p">20:框架(總成)</p>
        <p type="p">22:座椅</p>
        <p type="p">24:靠背</p>
        <p type="p">26:阻力外殼(框架外殼第一部分)</p>
        <p type="p">28:後腿外殼(框架外殼第二部分)</p>
        <p type="p">30:軌道</p>
        <p type="p">31:(軌道之)軸線</p>
        <p type="p">32:前腿(第一腿)</p>
        <p type="p">34:後腿(第二腿)</p>
        <p type="p">36:輪子</p>
        <p type="p">38:手柄支架</p>
        <p type="p">50:托架總成</p>
        <p type="p">52:托架外殼</p>
        <p type="p">58:制動機構</p>
        <p type="p">59:制動手柄</p>
        <p type="p">68:腳踏板</p>
        <p type="p">70:腳座</p>
        <p type="p">72:直立部分</p>
        <p type="p">76:手柄外殼</p>
        <p type="p">81:凹口</p>
        <p type="p">82:拉手(第一手柄)</p>
        <p type="p">84:推手(第二手柄)</p>
        <p type="p">88:裝置支架</p>
        <p type="p">100:阻力總成</p>
        <p type="p">102:阻力元件</p>
        <p type="p">112:第一繩索(驅動繩索)</p>
        <p type="p">200:托架之移動軸線</p>
        <p type="p">202:第一手柄(拉手)之移動軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1044" publication-number="202632721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掃描帶電粒子顯微鏡影像品質增強之擴散模型</chinese-title>
        <english-title>DIFFUSION MODEL IN SCANNING CHARGED-PARTICLE MICROSCOPE IMAGE QUALITY ENHANCEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01J37/26</main-classification>
        <further-classification edition="200601120260420B">G06T5/50</further-classification>
        <further-classification edition="202401120260420B">G06T5/60</further-classification>
        <further-classification edition="202401120260420B">G06T5/70</further-classification>
        <further-classification edition="200601120260420B">G06N3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜大權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DAEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於自一經去雜訊影像判定一晶圓上之一特徵之量測的設備，其包括：一記憶體，其儲存一指令集；及至少一個處理器，其經組態以執行該指令集以使得該設備執行：應用一經訓練擴散神經網路模型以將掃描帶電粒子顯微鏡(SCPM)影像去雜訊，其中該經訓練擴散神經網路模型已經訓練以將該晶圓之一所接收SCPM影像去雜訊；將一經平均化影像判定為該等經去雜訊SCPM影像之一平均值；及基於該經平均化影像判定該特徵之量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for determining measurements of a feature on a wafer from a denoised image includes a memory storing a set of instructions and at least one processor configured to execute the set of instructions to cause the apparatus to perform: applying a trained diffusion neural network model to denoise scanning charged-particle microscope (SCPM) images, wherein the trained diffusion neural network model has been trained to denoise a received SCPM image of the wafer; determining an averaged image as an average of the denoised SCPM images; and determining measurements of the feature based on the averaged image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1002:步驟</p>
        <p type="p">1004:步驟</p>
        <p type="p">1006:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1045" publication-number="202633025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層基板、配線基板、積層基板之製造方法、配線基板之製造方法及半導體封裝體</chinese-title>
        <english-title>LAMINATED SUBSTRATE, WIRING SUBSTRATE, METHOD OF MANUFACTURING LAMINATED SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H05K1/03</main-classification>
        <further-classification edition="202601120260422B">H10W70/60</further-classification>
        <further-classification edition="200601120260422B">H05K3/00</further-classification>
        <further-classification edition="200601120260422B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植木真治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北爪貴洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZUME, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中厚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田幸仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, YUKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡瑞樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伴野優梨子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNO, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種可緩和應力、減少包含玻璃之無機基板之裂紋產生之積層基板。本發明之積層基板(100)係具有複數個配線基板(110)者，該配線基板(110)具有：包含玻璃之無機基板(10)；1層或2層以上之絕緣樹脂層(2)，其等以被覆包含玻璃之無機基板(10)之至少一部分之方式配置；及配線部(3)，其配置於包含玻璃之無機基板(10)及絕緣樹脂層(2)之至少一者之表面；且絕緣樹脂層(2)之各層之平均厚度為2 μm以上且未達30 μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:配線部</p>
        <p type="p">4:連接端子</p>
        <p type="p">10:包含玻璃之無機基板</p>
        <p type="p">21,22:絕緣樹脂層</p>
        <p type="p">100:積層基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1046" publication-number="202633026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板、配線基板之製造方法及半導體封裝體</chinese-title>
        <english-title>WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K1/03</main-classification>
        <further-classification edition="200601120260504B">H05K3/00</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
        <further-classification edition="200601120260504B">H05K3/46</further-classification>
        <further-classification edition="202601120260504B">H10W70/692</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植木真治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北爪貴洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZUME, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤陽一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中厚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田幸仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, YUKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡瑞樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伴野優梨子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNO, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種可減少碎屑、減少絕緣樹脂層之裂紋產生之配線基板。本揭示之配線基板(110)具有：包含玻璃之無機基板(10)；1層或2層以上之絕緣樹脂層(21、22)，其等以被覆包含玻璃之無機基板(10)之至少一部分之方式配置；及配線部(3)，其配置於包含玻璃之無機基板(10)及絕緣樹脂層(21、22)之至少一者之表面；且絕緣樹脂層(21、22)之至少1層之端面之算術表面粗糙度Sa為0.05 μm以上且0.20 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:配線部</p>
        <p type="p">4:連接端子</p>
        <p type="p">10:包含玻璃之無機基板</p>
        <p type="p">10e:端面</p>
        <p type="p">21,22:絕緣樹脂層</p>
        <p type="p">21e:端面</p>
        <p type="p">22e:端面</p>
        <p type="p">110:配線基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1047" publication-number="202631757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性著色樹脂組合物、顯示裝置、及有機發光元件與外光反射防止膜之積層體之製造方法</chinese-title>
        <english-title>PHOTOSENSITIVE COLORED RESIN COMPOSITION, DISPLAY DEVICE, AND A METHOD FOR PRODUCING LAMINATE OF ORGANIC LIGHT-EMITTING DEVICE AND EXTERNAL LIGHT ANTIREFLECTION FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08F279/06</main-classification>
        <further-classification edition="200601120260417B">C08F2/50</further-classification>
        <further-classification edition="200601120260417B">C09B67/00</further-classification>
        <further-classification edition="200601120260417B">G03F7/004</further-classification>
        <further-classification edition="200601120260417B">C09B47/04</further-classification>
        <further-classification edition="201501120260417B">G02B1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＮＰ精細化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DNP FINE CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田麻希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原星児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種感光性著色樹脂組合物，其係用於形成於有機發光元件上之硬化膜者，且  &lt;br/&gt;包含有色材料、鹼可溶性樹脂、光起始劑、及溶劑，  &lt;br/&gt;包含選自由側鏈具有含乙烯性不飽和鍵之基之鹼可溶性樹脂、及光聚合性化合物所組成之群中之至少1種，  &lt;br/&gt;上述有色材料包含極大吸收波長為480 nm～520 nm之第1有色材料、及極大吸收波長為560 nm～600 nm之第2有色材料，  &lt;br/&gt;上述光起始劑包含下述通式(A)所表示之化合物之至少1種，  &lt;br/&gt;使用該感光性著色樹脂組合物所形成之厚度3.0 μm之硬化膜之460 nm、530 nm、及620 nm之透過率均為45%～85%，480 nm～520 nm之透過極小波長之透過率為50%以下，560 nm～600 nm之透過極小波長之透過率為25%以下。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="28px" width="55px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;img align="absmiddle" height="212px" width="365px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，各符號如說明書中所記載)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photosensitive colored resin composition for use in a cured film formed on an organic light-emitting device, the photosensitive colored resin composition comprising a color material, an alkali-soluble resin, a photoinitiator and a solvent, &lt;br/&gt;wherein the photosensitive colored resin composition comprises at least one selected from the group consisting of a photopolymerizable compound and an alkali-soluble resin containing an ethylenically unsaturated bond-containing group in a side chain thereof; &lt;br/&gt;wherein the color material contains a first color material having a maximum absorption wavelength of from 480 nm to 520 nm and a second color material having a maximum absorption wavelength of from 560 nm to 600 nm; &lt;br/&gt;wherein the photoinitiator contains at least one selected from compounds represented by the following general formula (A); and &lt;br/&gt;wherein a cured film formed by use of the photosensitive colored resin composition and having a thickness of 3.0 μm, has a transmittance of from 45% to 85% at 460 nm, 530 nm and 620 nm, a transmittance of 50% or less at a minimum transmission wavelength of from 480 nm to 520 nm, and a transmittance of 25% or less at a minimum transmission wavelength of from 560 nm to 600 nm: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="201px" width="367px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(the symbols in the formula are as described in the Description.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:薄膜電晶體(TFT)</p>
        <p type="p">3:密封膜</p>
        <p type="p">4:電極</p>
        <p type="p">5:間隔壁</p>
        <p type="p">6R,6G,6B:有機發光元件</p>
        <p type="p">7:電極</p>
        <p type="p">8:密封膜</p>
        <p type="p">9:著色硬化膜</p>
        <p type="p">10:遮光部</p>
        <p type="p">11:外覆層</p>
        <p type="p">12:透明黏著劑層</p>
        <p type="p">13:透明蓋材</p>
        <p type="p">20:外光反射防止膜</p>
        <p type="p">30:具備有機發光元件之元件基板</p>
        <p type="p">100:顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1048" publication-number="202631615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、發光器件、顯示裝置、電子設備以及照明裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">C09K11/06</further-classification>
        <further-classification edition="202301120260504B">H10K50/85</further-classification>
        <further-classification edition="200601120260504B">H05B33/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫枋竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, FANGZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐芳榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, FANGRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長尾和真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAO, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德田貴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUDA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小谷亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTANI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供通式1的化合物、包含所述化合物的發光器件、顯示裝置、電子設備以及照明裝置。本發明的化合物具有包含丙二烯合茀和啡啉的特定結構。本發明可提供同時實現高發光效率、低驅動電壓、以及長耐久壽命的有機薄膜發光元件。  &lt;br/&gt;&lt;img align="absmiddle" height="149px" width="376px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1049" publication-number="202631177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肝功能之改善、維持、及/或惡化預防用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/07</main-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
        <further-classification edition="201601120260504B">A23L33/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂敦製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛睦健製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MG PHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伏野夏子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUSHINO, NATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚本恒星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, KOSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹川由香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKAWA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石堂圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDO, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種肝功能之改善、維持、及/或惡化預防用組成物，其含有由序列編號1所表示之胺基酸序列所構成之四肽，且用於健康人類。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1050" publication-number="202633326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為晶圓彎曲對策的利用動態背側氣體回饋控制之原位晶圓監測</chinese-title>
        <english-title>IN-SITU WAFER MONITORING WITH DYNAMIC BACKSIDE GAS FEEDBACK CONTROL AS WAFER BOW COUNTERMEASURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10P72/00</main-classification>
        <further-classification edition="202601120260417B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列斐伏爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFEVRE, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜拉吉恩　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILLARGEON, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施態樣提供一種靜電卡盤(ESC)/背側氣體(BSG)系統。舉例而言，該ESC/BSG系統可以包含ESC和與該ESC整合的BSG冷卻裝置。該ESC其配置以根據施加於其上的靜電電壓產生靜電卡緊力，從而卡固背側被放置於ESC之上的半導體結構。該BSG冷卻裝置可以配置用於以一背側氣體壓力將背側氣體引導至該半導體結構的背側。該ESC/BSG系統可以進一步包含監測系統和控制器，該監測系統配置以監測該半導體結構的彎曲，而該控制器耦接於該監測系統和該ESC以及該BSG冷卻裝置之間。該控制器配置以根據該半導體結構的該彎曲來調整該靜電電壓和/或該背側氣體壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the present disclosure provide an electrostatic chuck (ESC)/backside gas (BSG) system. For example, the ESC/BSG system can include an ESC and a BSG cooling device integrated with the ESC. The ESC can be configured to generate an electrostatic chucking force according to an electrostatic voltage applied thereto to clamp a semiconductor structure with a backside placed onto the ESC. The BSG cooling device can be configured to introduce to the backside of the semiconductor structure a backside gas at a backside gas pressure. The ESC/BSG system can further include a monitoring system configured to monitoring bowing of the semiconductor structure, and a controller coupled between the monitoring system and the ESC and the BSG cooling device. The controller can be configured to adjust the electrostatic voltage and/or the backside gas pressure according to the bowing of the semiconductor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">710:ESC</p>
        <p type="p">720:BSG冷卻裝置</p>
        <p type="p">790:半導體結構</p>
        <p type="p">791:基板</p>
        <p type="p">792:不同材料和結構形成件</p>
        <p type="p">793:應力修改膜</p>
        <p type="p">800:ESC/BSG系統</p>
        <p type="p">830:監測系統</p>
        <p type="p">831:冷卻氣體旁漏流量計量器</p>
        <p type="p">840:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1051" publication-number="202631506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化鎢粉末及碳化鎢混合粉末</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260420B">C01B32/949</main-classification>
        <further-classification edition="200601120260420B">C22C29/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商聯合材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>A.L.M.T. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村好博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕索斯　阿儂薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASEUTH, ANONGSACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱木健成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAKI, KENSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板倉剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAKURA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種碳化鎢粉末，其由添加有第一元素之第一碳化鎢粒子構成，且第一元素為選自由鈦、鋯、鈮、鉭、鉬、鈰、及釔所組成之群中之至少一者，使用穿透式電子顯微鏡所附屬之能量分散型X射線光譜裝置，自設置於第一碳化鎢粒子之內部、且與第一碳化鎢粒子之外緣之距離為6 nm以上的位置X1朝向設置於第一碳化鎢粒子之外部、且與第一碳化鎢粒子之外緣之距離為6 nm以上的位置X2，進行線分析，將所獲得之結果示於X軸為與位置X1之距離、且Y軸為淨強度之座標系統，於由此所得之第一曲線圖中，在相較於鎢之淨強度為鎢之最大淨強度之0.5倍之距離P1距原點更遠的距離中存在第一元素之淨強度之合計大於鎢之淨強度的第一範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1052" publication-number="202633201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器裝置的奈米柱結構以及形成方法</chinese-title>
        <english-title>NANOPILLAR STRUCTURE OF IMAGE SENSOR DEVICE AND METHOD OF FORMING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260420B">H10F39/12</main-classification>
        <further-classification edition="202501120260420B">H10F39/18</further-classification>
        <further-classification edition="202501120260420B">H10F77/40</further-classification>
        <further-classification edition="200601120260420B">G02B3/02</further-classification>
        <further-classification edition="200601120260420B">G02B3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　欽濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QINTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　艷琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEOW, YEN LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢柯爾　曼尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMKAR, MANISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原　錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了用於形成影像感測器的奈米柱的方法。一種形成影像感測器的方法可包括在濾色器上形成第一蝕刻終止層，以及在第一間隔墊層中形成的第一複數個溝槽內形成第一溝槽填充材料，其中第一溝槽填充材料延伸至第一蝕刻終止層。該方法可進一步包括在第一溝槽填充材料上形成第二蝕刻終止層，以及在第二間隔墊層的第二複數個溝槽內形成第二溝槽填充材料，其中第二間隔墊層形成在第二蝕刻終止層上。該方法可進一步包括穿過第一和第二間隔墊層形成開口，該開口暴露第一蝕刻終止層，並經由該開口執行濕蝕刻以移除第一和第二間隔墊層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are approaches for forming nanopillars of an image sensor. One method of forming an image sensor may include forming a first etch stop layer over a color filter, and forming a first trench fill material within a first plurality of trenches formed in a first spacer layer, wherein the first trench fill material extends to the first etch stop layer. The method may further include forming a second etch stop layer over the first trench fill material, and forming a second trench fill material within a second plurality of trenches of a second spacer layer, wherein the second spacer layer is formed over the second etch stop layer. The method may further include forming an opening through the first and second spacer layers, the opening exposing the first etch stop layer, and performing a wet etch through the opening to remove the first and second spacer layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測器</p>
        <p type="p">102:濾色器</p>
        <p type="p">104:基底間隔墊層</p>
        <p type="p">106:蝕刻終止層</p>
        <p type="p">114:上表面</p>
        <p type="p">135:奈米柱</p>
        <p type="p">140:溝槽填充材料</p>
        <p type="p">143:第二蝕刻終止層</p>
        <p type="p">145:奈米柱</p>
        <p type="p">153:上表面</p>
        <p type="p">157:溝槽填充材料</p>
        <p type="p">159:覆蓋層</p>
        <p type="p">164:狹縫</p>
        <p type="p">165:狹縫</p>
        <p type="p">172:密封層</p>
        <p type="p">175:氣隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1053" publication-number="202633394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用表面改質技術使半導體材料圖案化</chinese-title>
        <english-title>PATTERNING SEMICONDUCTOR MATERIALS USING SURFACE MODIFICATION TECHNIQUES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P76/00</main-classification>
        <further-classification edition="202601120260420B">H10P50/28</further-classification>
        <further-classification edition="202601120260420B">H10P14/692</further-classification>
        <further-classification edition="202601120260420B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列斐伏爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFEVRE, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜拉吉恩　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILLARGEON, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含在一半導體層上方形成一遮罩。該方法包含第一次圖案化該遮罩，以形成暴露出該半導體層之第一部分的第一開口。該方法包含執行一電漿處理，以在該暴露之第一部分上方形成一表面改質層。該方法包含第二次圖案化該遮罩，以形成暴露出該半導體層之第二部分的第二開口，藉此形成界定該第一及該第二開口的一圖案化遮罩。該方法包含透過該圖案化遮罩對該半導體層執行一蝕刻製程，以形成自該第一開口延伸之第一溝槽以及自該第二開口延伸之第二溝槽。該蝕刻製程係以第一速率移除該第一部分並以大於該第一速率的第二速率移除該第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a mask over a semiconductor layer. The method includes first patterning the mask to form a first opening that exposes a first portion of the semiconductor layer. The method includes performing a plasma treatment to form a surface modification layer over the exposed first portion. The method includes second patterning the mask to form a second opening that exposes a second portion of the semiconductor layer, thereby forming a patterned mask that defines the first and second openings. The method includes performing an etching process to the semiconductor layer through the patterned mask to form a first trench extending from the first opening and a second trench extending from the second opening. The etching process removes the first portion at a first rate and the second portion at a second rate that is greater than the first rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:操作</p>
        <p type="p">104:操作</p>
        <p type="p">106:操作</p>
        <p type="p">108:操作</p>
        <p type="p">110:操作</p>
        <p type="p">112:操作</p>
        <p type="p">114:操作</p>
        <p type="p">116:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1054" publication-number="202633307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title>METHOD FOR PROCESSING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P70/00</main-classification>
        <further-classification edition="200601120260427B">B08B3/00</further-classification>
        <further-classification edition="202601120260427B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莉婭　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ELIA, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯曼　羅那得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASMAN, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理方法，包含：提供該基板進入一處理腔室；將處理流體加入該處理腔室；將一乾流體加入該處理腔室，同時從該處理腔室排放該處理流體；及從該處理腔室釋放一氣相的該乾流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes providing the substrate into a processing chamber, adding a processing fluid into the processing chamber, adding a dry fluid to the processing chamber while draining the processing fluid from the processing chamber, and releasing the dry fluid from the processing chamber in a gaseous phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">100:處理系統</p>
        <p type="p">105:處理腔室</p>
        <p type="p">106:處理空間</p>
        <p type="p">110:底盤</p>
        <p type="p">115:頂盤</p>
        <p type="p">120:下作業表面</p>
        <p type="p">123:針桿</p>
        <p type="p">125:上作業表面</p>
        <p type="p">130:開口</p>
        <p type="p">135:開口</p>
        <p type="p">140:液體</p>
        <p type="p">145:液體供應閥</p>
        <p type="p">150:氣體</p>
        <p type="p">155:氣體供應閥</p>
        <p type="p">160:控制器</p>
        <p type="p">170:升降機構</p>
        <p type="p">175:升降機構</p>
        <p type="p">190:引流系統</p>
        <p type="p">192:第一部分</p>
        <p type="p">195:通道</p>
        <p type="p">200:閥</p>
        <p type="p">202:閥</p>
        <p type="p">204:氣體入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1055" publication-number="202633022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>集合體片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H05K1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤将志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井正尭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之集合體片材1具備配線電路基板2及對準標記4。對準標記4具有：金屬層40；第1標記41，其配置於金屬層40之一側表面S11上，包含與配線電路基板2之基底絕緣層23相同之材料；及第2標記42，其配置於金屬層40之一側表面S11上，包含與配線電路基板2之第1導體圖案24相同之材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:配線電路基板</p>
        <p type="p">4:對準標記</p>
        <p type="p">20:晶種層</p>
        <p type="p">21:金屬支持層</p>
        <p type="p">22:保護金屬層</p>
        <p type="p">23:基底絕緣層</p>
        <p type="p">24:第1導體圖案</p>
        <p type="p">25:第2導體圖案</p>
        <p type="p">26:覆蓋絕緣層(第1覆蓋絕緣層)</p>
        <p type="p">40:金屬層</p>
        <p type="p">41:第1標記</p>
        <p type="p">42:第2標記</p>
        <p type="p">43:第3標記</p>
        <p type="p">44:覆蓋層(第1覆蓋層)</p>
        <p type="p">44A:第4標記</p>
        <p type="p">243A,243B,253A,253B:配線</p>
        <p type="p">401:第1金屬層</p>
        <p type="p">401A:第1金屬層之一側表面</p>
        <p type="p">402:第2金屬層</p>
        <p type="p">403:第3金屬層</p>
        <p type="p">S1:金屬支持層之一側表面</p>
        <p type="p">S2:基底絕緣層之一側表面</p>
        <p type="p">S11:金屬層之一側表面</p>
        <p type="p">T1:第1導體圖案之厚度</p>
        <p type="p">T2:第2導體圖案之厚度</p>
        <p type="p">T11:第2標記之厚度</p>
        <p type="p">T12:第3標記之厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1056" publication-number="202632427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>更換用於半導體技術設備的光學元件的方法</chinese-title>
        <english-title>METHOD FOR EXCHANGING OPTICAL ELEMENTS OF AN APPARATUS FOR SEMICONDUCTOR TECHNOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">G03F7/20</main-classification>
        <further-classification edition="200601120260417B">G02B27/62</further-classification>
        <further-classification edition="200601120260417B">G01M11/02</further-classification>
        <further-classification edition="202101120260417B">G02B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫邁爾　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFMAIER, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案發明說明係有關於一種用於半導體技術設備的光學元件(25)的更換方法，該光學元件設計用於工作波長，且該設備中的工作光束路徑(40)的至少一部分穿過人工大氣(90)區，該方法包括以下步驟：  &lt;br/&gt;a) 更換該半導體技術設備中至少一個待更換的光學元件(25、25’)；  &lt;br/&gt;b) 定位並定向該在前一步驟中更換的至少一個光學元件(25’)；  &lt;br/&gt;c) 沿著包含該至少一個已更換光學元件(25’)的光束路徑(140)，以不同於工作波長之預定波長進行波前測量，在為此提供的區域內沒有人工大氣(90)；  &lt;br/&gt;d) 若波前測量結果顯示產生波前像差：則調整至少該已更換的光學元件(25’)的位置和方向，並重複步驟(c)；以及  &lt;br/&gt;e) 若波前測量顯示未產生像差：則在為此提供的區域內產生人工大氣(90)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for exchanging optical elements (25) of an apparatus for semiconductor technology, the optical elements being designed for a productive wavelength and at least one part of the product beam path (40) in the apparatus passing through a region with an artificially generated atmosphere (90), comprising the following steps: &lt;br/&gt;a) exchanging at least one optical element (25, 25’) to be exchanged of the apparatus for semiconductor technology; &lt;br/&gt;b) positioning and orienting at least the optical element (25’) exchanged in the preceding step; &lt;br/&gt;c) carrying out a wavefront measurement along a beam path (140) comprising at least one exchanged optical element (25’) without an artificially generated atmosphere (90) in the region provided therefor with a predefined wavelength that is different from the productive wavelength; &lt;br/&gt;d) if the wavefront measurement yields a wavefront aberration: adapting the positioning and orientation of at least the exchanged optical element (25’) and repeating step (c); and &lt;br/&gt;e) if the wavefront measurement does not yield an aberration: producing the artificially generated atmosphere (90) in the region provided therefor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:投影曝光設備</p>
        <p type="p">10:照明系統</p>
        <p type="p">11:物場</p>
        <p type="p">12:光罩平面</p>
        <p type="p">13:曝光輻射源</p>
        <p type="p">14:收集器</p>
        <p type="p">15:中間焦點平面</p>
        <p type="p">16:照明光學單元</p>
        <p type="p">17:偏向鏡</p>
        <p type="p">18:面鏡</p>
        <p type="p">18’:微反射鏡</p>
        <p type="p">19:面鏡</p>
        <p type="p">19’:微反射鏡</p>
        <p type="p">20:投影系統</p>
        <p type="p">21:像場</p>
        <p type="p">22:像平面</p>
        <p type="p">25:待更換的光學元件</p>
        <p type="p">25’:已更換的光學元件</p>
        <p type="p">M&lt;sub&gt;1&lt;/sub&gt;、M&lt;sub&gt;2&lt;/sub&gt;、M&lt;sub&gt;3&lt;/sub&gt;、M&lt;sub&gt;4&lt;/sub&gt;、M&lt;sub&gt;5&lt;/sub&gt;、M&lt;sub&gt;6&lt;/sub&gt;:反射鏡</p>
        <p type="p">26:調整單元</p>
        <p type="p">31:倍縮光罩支架</p>
        <p type="p">32:位移驅動器</p>
        <p type="p">36:晶圓支架</p>
        <p type="p">37:位移驅動器</p>
        <p type="p">90:人工大氣</p>
        <p type="p">100:波前測量裝置</p>
        <p type="p">110:控制單元</p>
        <p type="p">120:輻射源</p>
        <p type="p">130:波前感測器</p>
        <p type="p">131:2D影像擷取感測器</p>
        <p type="p">132:透鏡光罩</p>
        <p type="p">140:光束路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1057" publication-number="202632423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用金屬氧化物阻劑圖案化基板的方法</chinese-title>
        <english-title>METHOD FOR PATTERNING SUBSTRATE USING METAL OXIDE RESIST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G03F7/004</main-classification>
        <further-classification edition="200601120260422B">G03F7/09</further-classification>
        <further-classification edition="200601120260422B">G03F7/16</further-classification>
        <further-classification edition="200601120260422B">G03F7/20</further-classification>
        <further-classification edition="200601120260422B">G03F7/26</further-classification>
        <further-classification edition="200601120260422B">G03F7/40</further-classification>
        <further-classification edition="202601120260422B">H10P76/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多夫納　亞力克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORFNER, ALEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括 : 在基板上方形成含金屬層，在含金屬層上方形成金屬氧化物阻劑，對金屬氧化物阻劑圖案化以形成圖案化金屬氧化物阻劑，在圖案化金屬氧化物阻劑上方形成中間遮罩層，以及去除中間遮罩層之一部分以暴露圖案化金屬氧化物阻劑。中間遮罩層之其餘部分形成圖案化中間遮罩層。該方法進一步包括 : 選擇性去除圖案化金屬氧化物阻劑，並將圖案化中間遮罩層之圖案轉移至含金屬層以形成圖案化含金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a metal-containing layer over a substrate, forming a metal oxide resist over the metal-containing layer, patterning the metal oxide resist to form a patterned metal oxide resist, forming an intermediate mask layer over the patterned metal oxide resist, and removing a portion of the intermediate mask layer to expose the patterned metal oxide resist. Remaining portions of the intermediate mask layer form a patterned intermediate mask layer. The method further includes selectively removing the patterned metal oxide resist and transferring a pattern of the patterned intermediate mask layer to the metal-c.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:目標層</p>
        <p type="p">116:圖案化中間遮罩層</p>
        <p type="p">118:圖案化含金屬層</p>
        <p type="p">120:硬遮罩</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1058" publication-number="202631971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、清洗完畢的被處理物之製造方法、電子裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C11D1/66</main-classification>
        <further-classification edition="200601120260504B">C11D3/04</further-classification>
        <further-classification edition="200601120260504B">C11D3/20</further-classification>
        <further-classification edition="200601120260504B">C11D3/30</further-classification>
        <further-classification edition="200601120260504B">C11D3/34</further-classification>
        <further-classification edition="200601120260504B">C11D3/36</further-classification>
        <further-classification edition="200601120260504B">C11D17/08</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
        <further-classification edition="202601120260504B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大內直子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHUCHI, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下祐太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物，其在適用於包含來自於實施了CMP處理之多晶矽或非晶矽等之疏水性表面之被處理物時，粒子去除性及有機物去除性優異。又，提供一種清洗完畢的被處理物之製造方法及電子裝置之製造方法。本發明的組成物為用於對實施了化學機械研磨處理之被處理物進行清洗之組成物，其包含：非離子界面活性劑，具有聚氧亞烷基鏈，親水性親油性平衡值為8.5～14；及特定化合物（其中，不包括兩性離子化合物），選自由無機酸、胺基醇、有機酸、四級銨化合物及脂肪族多胺組成之群組，上述有機酸具有至少1個選自由羧酸基、膦酸基及磺酸基組成之群組中的基，相對於上述特定化合物的合計含量之上述非離子界面活性劑的含量的質量比為0.001～1500。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1059" publication-number="202632218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用光之經編碼角分布之快速橢圓偏振技術</chinese-title>
        <english-title>RAPID ELLIPSOMETRY USING ENCODED ANGULAR DISTRIBUTION OF LIGHT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G01B11/06</main-classification>
        <further-classification edition="200601120260427B">G01N21/01</further-classification>
        <further-classification edition="200601120260427B">G01N21/21</further-classification>
        <further-classification edition="200601120260427B">G02B26/08</further-classification>
        <further-classification edition="200601120260427B">G02B27/28</further-classification>
        <further-classification edition="200601120260427B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂圖創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONTO INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩爾丁　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARTIN, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯德　艾列克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUDER, ALEX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用一高速偏振狀態調變器、一光偵測器、及一數位微鏡裝置或自旋盤來執行可變角度橢圓偏振技術，以在時域或頻域中以一高取樣率對光之入射角進行編碼。一可變角度橢圓偏振計使用一高速、軸向固定偏振狀態調變器（諸如一光彈性調變器）及一高速偵測器（諸如一光二極體）進行高速資料獲取。為了在複數個入射角下獲取資料，使用一透鏡沿著呈一傾斜入射角之一光學軸產生一大入射角分布，並且在時域中依序選擇光之離散入射角或該光之入射角之組合，或者在頻域中在複數個入射角之上調變該光之該等離散入射角或該光之入射角之該等組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Variable-angle ellipsometry is performed using a high speed polarization state modulator, a photodetector, and a digital micromirror device or spinning disk to encode the angle of incidence of light with a high sampling rate in a time domain or frequency domain. A variable-angle ellipsometer uses a high speed, axially stationary polarization state modulator, such as a photoelastic modulator, and a high speed detector, such as a photodiode, for high speed data acquisition. To acquire data at a plurality of incident angles, a lens is used to generate a large incident angle distribution along an optical axis that is at an oblique angle of incidence and discrete or combinations of incident angles of light are selected in a sequence in the time domain or modulated over a plurality of incident angles in the frequency domain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計量裝置</p>
        <p type="p">101:樣本</p>
        <p type="p">108:卡盤</p>
        <p type="p">109:工作台</p>
        <p type="p">110:光源</p>
        <p type="p">112:光/窄頻或單波長光</p>
        <p type="p">114:光學元件</p>
        <p type="p">116:偏振狀態產生器</p>
        <p type="p">117:偏振器</p>
        <p type="p">118:高速偏振狀態調變器/軸向固定偏振狀態調變器/電驅動偏振狀態調變器/偏振狀態調變器</p>
        <p type="p">118’:偏振狀態調變器</p>
        <p type="p">120:光學元件/數位微鏡裝置(DMD)</p>
        <p type="p">120’:光學元件/數位微鏡裝置(DMD)</p>
        <p type="p">122:控制器</p>
        <p type="p">124:旋轉盤</p>
        <p type="p">126:馬達</p>
        <p type="p">130:聚焦光學器件</p>
        <p type="p">132:傾斜入射光學軸/光學軸</p>
        <p type="p">140:光學器件/聚焦光學器件</p>
        <p type="p">141:偏振狀態分析器</p>
        <p type="p">142:偏振器</p>
        <p type="p">143:光學元件</p>
        <p type="p">144:透鏡</p>
        <p type="p">150:偵測器/高速偵測器</p>
        <p type="p">152:鎖相放大器</p>
        <p type="p">160:運算系統</p>
        <p type="p">161:匯流排</p>
        <p type="p">162:處理器</p>
        <p type="p">164:記憶體</p>
        <p type="p">166:電腦可讀取程式碼</p>
        <p type="p">168:使用者介面(UI)</p>
        <p type="p">169:埠</p>
        <p type="p">180:插圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1060" publication-number="202631889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基材接合用樹脂組成物、積層體之製造方法及半導體器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L79/08</main-classification>
        <further-classification edition="200601120260504B">C09J175/04</further-classification>
        <further-classification edition="200601120260504B">B32B27/34</further-classification>
        <further-classification edition="200601120260504B">B32B3/12</further-classification>
        <further-classification edition="200601120260504B">B32B7/12</further-classification>
        <further-classification edition="202501120260504B">H10F39/00</further-classification>
        <further-classification edition="202501120260504B">H10F39/12</further-classification>
        <further-classification edition="202601120260504B">H10P14/60</further-classification>
        <further-classification edition="202601120260504B">H10P14/692</further-classification>
        <further-classification edition="202601120260504B">H10W20/42</further-classification>
        <further-classification edition="202601120260504B">H10W20/43</further-classification>
        <further-classification edition="202601120260504B">H10W20/48</further-classification>
        <further-classification edition="202601120260504B">H10W72/00</further-classification>
        <further-classification edition="202601120260504B">H10W72/30</further-classification>
        <further-classification edition="202601120260504B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北島峻輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAJIMA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基材接合用樹脂組成物、積層體之製造方法及半導體器件之製造方法，前述基材接合用樹脂組成物為包含樹脂之樹脂組成物，前述樹脂包含聚醯亞胺前驅物及聚醯亞胺中之至少一者，其中，相對於上述樹脂組成物的總固體成分，上述樹脂的含量為50質量%以上，在具備距離第1基材的表面的高度為10μm的段差之第1基材的具有上述段差之面上適用上述樹脂組成物，進行成膜而獲得樹脂膜，並且使不具有段差之第2基材與上述樹脂膜接觸並藉由加熱及加壓進行接合之情形下的第1基材與第2基材的剝離強度為10J/m&lt;sup&gt;2&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1061" publication-number="202632034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜裝置及成膜方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C14/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西垣寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIGAKI, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠進行處理室的穩定處理的成膜裝置及成膜方法。成膜裝置包括：腔室；蓋體；靶材；成膜室；搬送體；筒部，使工件保持器從搬送體向與蓋體接觸的位置移動；向內凸緣，形成在筒部的下端，且從下端向內側方向延伸；向外凸緣，設置在筒部的內部，且向所述筒部中的外側方向延伸，並隨著筒部的移動而與向內凸緣接近地重疊，抑制向腔室內的排氣；升降機構，以筒部相對於工件保持器接觸/分離的方式升降；以及排氣部，設置在腔室的底部的開口，並進行真空排氣，升降機構使筒部上升，使工件保持器與蓋體的下緣接觸，並使向外凸緣與向內凸緣接近地重疊，從成膜室經由第一貫通孔，使筒部的內部與排氣部連通而實施成膜室的處理空間的真空排氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:腔室</p>
        <p type="p">3:旋轉台</p>
        <p type="p">3a:密封材料</p>
        <p type="p">4:靶材</p>
        <p type="p">21:底板</p>
        <p type="p">22:蓋板</p>
        <p type="p">31:軸</p>
        <p type="p">300A:成膜部</p>
        <p type="p">310:成膜室</p>
        <p type="p">311、340e、340f、342c、380:開口</p>
        <p type="p">312:處理空間</p>
        <p type="p">313:蓋體</p>
        <p type="p">313a、313b、320a、340a、343a:密封材料</p>
        <p type="p">313c:蓋裡</p>
        <p type="p">313d、313e:下緣</p>
        <p type="p">320:氣缸</p>
        <p type="p">340:筒部</p>
        <p type="p">340b、340c:向內凸緣</p>
        <p type="p">340d:支撐部</p>
        <p type="p">341:流入抑制部</p>
        <p type="p">341a:貫通孔</p>
        <p type="p">342:波紋管機構</p>
        <p type="p">342a:波紋管</p>
        <p type="p">342b:向外凸緣</p>
        <p type="p">343:捕集器結構</p>
        <p type="p">350:製程氣體導入部</p>
        <p type="p">351、361:真空計</p>
        <p type="p">360:排氣部</p>
        <p type="p">400:工件保持器</p>
        <p type="p">400a:貫通孔</p>
        <p type="p">1002、1003、1004:箭頭</p>
        <p type="p">W:工件</p>
        <p type="p">X、Y、Z:軸/方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1062" publication-number="202631113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含選擇性器官標靶脂質的組合物</chinese-title>
        <english-title>COMPOSITION COMPRISING SELECTIVE ORGAN TARGETING LIPID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K9/51</main-classification>
        <further-classification edition="202501120260504B">A61K9/1272</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/14</further-classification>
        <further-classification edition="200601120260504B">A61K47/24</further-classification>
        <further-classification edition="200601120260504B">A61K47/28</further-classification>
        <further-classification edition="201701120260504B">A61K47/34</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商綠十字股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN CROSS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安聖現</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, SEONG HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金岷奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李定恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG-EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於包含添加至脂質奈米粒子(lipid nanoparticle，LNP)的選擇性器官標靶脂質的組合物，其能夠準確地遞送治療分子至特定組織，特別是脾臟或免疫細胞，並且由於其優異的遞送效率和活體內穩定性，可有用地使用在與核酸治療劑相關的技術領域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition comprising a selective organ targeting lipid added to a lipid nanoparticle (LNP) capable of accurately delivering a therapeutic molecule to a specific tissue, particularly the spleen or immune cells, and may be usefully used in the field of technology related to nucleic acid therapeutics due to its excellent delivery efficiency and &lt;i&gt;in vivo&lt;/i&gt; stability.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1063" publication-number="202631553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>從１，２－二氯－１，２－二氟乙烷（ＨＣＦＣ－１３２）產生１，２－二氟乙烯（ＨＦＯ－１１３２）之程序</chinese-title>
        <english-title>PROCESS TO PRODUCE 1,2-DIFLUOROETHYLENE (HFO-1132) FROM 1,2 DICHLORO-1,2-DIFLUOROETHANE (HCFC-132)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C17/25</main-classification>
        <further-classification edition="200601120260504B">C07C21/18</further-classification>
        <further-classification edition="200601120260504B">C09K5/04</further-classification>
        <further-classification edition="200601120260504B">C09K3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　學胡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種程序，該程序包括：使1,2-二氯-1,2-二氟乙烷(HCFC-132)與經活化鋅粉末在催化劑及溶劑之存在下接觸；及產生包含E-1,2-二氟乙烯(HFO-E-1132)及Z-1,2-二氟乙烯(HFO-Z-1132)的產物混合物。在一些實施例中，該催化劑包括四丁基溴化銨。在一些實施例中，該催化劑包括氯化鋅。在一些實施例中，該催化劑包括乙酸鋅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process includes contacting 1,2-dichloro-1,2-difluoroethane (HCFC-132) with an activated zinc powder in the presence of a catalyst and a solvent and producing a product mixture comprising E-1,2-difluoroethylene (HFO-E-1132) and Z-1,2-difluoroethylene (HFO-Z-1132). In some embodiments, the catalyst includes tetrabutylammonium bromide. In some embodiments, the catalyst includes zinc chloride. In some embodiments, the catalyst includes zinc acetate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1064" publication-number="202632185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過熱蒸氣產生方法及過熱蒸氣產生裝置</chinese-title>
        <english-title>SUPERHEATED-STEAM GENERATING METHOD AND SUPERHEATED-STEAM GENERATING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">F22G5/00</main-classification>
        <further-classification edition="201201120260422B">B24B37/005</further-classification>
        <further-classification edition="200601120260422B">F22G1/16</further-classification>
        <further-classification edition="200601120260422B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦駿平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本島靖之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOSHIMA, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, NOZOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康諭基泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, YUKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠迅速地產生過熱蒸氣且能夠防止過熱蒸氣成為過度高溫的過熱蒸氣產生方法及過熱蒸氣產生裝置。過熱蒸氣產生方法，在第一時間區間（T1）中設定的第一加熱器溫度允許範圍（R1）內，確定用於使溫度差成為最小的加熱器溫度指令值，當第一時間區間（T1）內的蒸氣的溫度的測定值比過熱蒸氣的目標溫度小且溫度差比第一閾值大時，使第一加熱器溫度允許範圍（R1）上升規定的上升偏移量而確定第二加熱器溫度允許範圍（R2），在第二時間區間（T2）內設定的第二加熱器溫度允許範圍（R2）內，確定用於使溫度差成為最小的加熱器溫度指令值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">T1~T5:時間區間</p>
        <p type="p">R1~R5:加熱器溫度允許範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1065" publication-number="202631950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136471</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K3/14</main-classification>
        <further-classification edition="200601120260504B">C09G1/02</further-classification>
        <further-classification edition="201201120260504B">B24B37/00</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中貝雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨用組合物，其能夠實現優異之研磨去除速度。本發明所提供之研磨用組合物包含過錳酸鹽及氧鋯鹽。於該研磨用組合物中，關於上述氧鋯鹽，對該氧鋯鹽之水溶液所測定之鋯之莫耳濃度c與酸之莫耳濃度N之比N/c大於1.8。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1066" publication-number="202631916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨用組合物及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09G1/02</main-classification>
        <further-classification edition="200601120260504B">C09K3/14</further-classification>
        <further-classification edition="201201120260504B">B24B37/00</further-classification>
        <further-classification edition="202601120260504B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中貝雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉光祐紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMITSU, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野克秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, KATSUHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種研磨用組合物，其能夠提高研磨去除速度。本發明所提供之研磨用組合物包含過錳酸鹽、稀土類鹽(其中，包含鈰者除外)、及pKa為2以上6以下之金屬陽離子與陰離子之鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1067" publication-number="202633099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙極性接面電晶體</chinese-title>
        <english-title>BIPOLAR JUNCTION TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260420B">H10D10/00</main-classification>
        <further-classification edition="202501120260420B">H10D64/20</further-classification>
        <further-classification edition="202601120260420B">H10W10/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙極性接面電晶體，包含一射極區、一基極區、一集極區以及一隔離結構。基極區相鄰設置於射極區的一第一側邊，集極區相鄰設置於射極區的一第二側邊，隔離結構設置於射極區與基極區之間以及射極區與集極區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bipolar junction transistor includes an emitter region, a base region, a collector region and an isolation structure. The base region is disposed adjacent to a first side of the emitter region. The collector region is disposed adjacent to a second side of the emitter region. The isolation structure is disposed between the emitter region and each of the base region and the collector region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙極性接面電晶體</p>
        <p type="p">12:射極區</p>
        <p type="p">14,16:基極區</p>
        <p type="p">18:集極區</p>
        <p type="p">22:隔離結構</p>
        <p type="p">121,122,123,124:側邊</p>
        <p type="p">141,142,143,144:側邊</p>
        <p type="p">161,162,163,164:側邊</p>
        <p type="p">181,182,183,184:側邊</p>
        <p type="p">A,A',B,B':方向</p>
        <p type="p">D1,D2:水平方向</p>
        <p type="p">D3:垂直方向</p>
        <p type="p">L1,L2,L3,L4,L5,L6,L7,L8:長度</p>
        <p type="p">SD1,SD2,SD3:最短距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1068" publication-number="202631366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造液晶聚合物絲的方法</chinese-title>
        <english-title>METHODS FOR PRODUCING LIQUID CRYSTAL POLYMER FILAMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260422B">B29C48/05</main-classification>
        <further-classification edition="201901120260422B">B29C48/00</further-classification>
        <further-classification edition="201901120260422B">B29C48/40</further-classification>
        <further-classification edition="200601320260422B">B29K67/00</further-classification>
        <further-classification edition="200601320260422B">B29K105/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考菲　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COFFEY, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯隆　福雷斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLOAN, FORREST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞德　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REID, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢形太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGATA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KAZUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示製造再生液晶聚合物絲的方法。該方法包括將一種或以上的用過的液晶聚合物絲，視情況結合原生液晶聚合物材料，且視情況結合解聚觸媒，進料到擠壓器中；及擠壓再生液晶聚合物絲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods for producing recycled liquid crystal polymer filaments. The methods include feeding one or more used liquid crystal polymer filaments, optionally in combination with a virgin liquid crystal polymer material, and optionally in combination with a depolymerization catalyst, into an extruder; and extruding the recycled liquid crystal polymer filament.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1069" publication-number="202633102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有氣隙的金屬閘極結構及其製備方法</chinese-title>
        <english-title>METAL GATE STRUCTURES WITH AIRGAPS AND METHODS FOR PREPARING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D30/00</main-classification>
        <further-classification edition="202501120260427B">H10D30/01</further-classification>
        <further-classification edition="202501120260427B">H10D62/13</further-classification>
        <further-classification edition="202601120260427B">H10D84/01</further-classification>
        <further-classification edition="202501120260427B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEONG, SAI HOOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈澤清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZEQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾　阿希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAL, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉吉　艾爾梅蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAZIZI, EL MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例通常與金屬閘極元件相關。在一或多個實施例中，提供一種製備具有氣隙的元件的方法，且方法包含在形成在設置於基板上的金屬閘極層中的溝槽的內表面上沉積含矽層；在溝槽中的含矽層上沉積含碳層，沉積含碳層以從底部填充溝槽的至少下半部；以及在每個溝槽的頂部留下臨時間隙。該方法還包含在含碳層和含矽層上沉積低介電常數介電層以填充臨時間隙，以及暴露至少含碳層於處理製程中，以移除含碳層並在含矽層與低介電常數介電層之間形成氣隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to metal gate devices. In one or more embodiments, a method for preparing a device with an airgap is provided and includes depositing a silicon-containing layer on inner surfaces of trenches formed in a metal-gate layer disposed on a substrate, depositing a carbon-containing layer on the silicon-containing layer in the trenches, the carbon-containing layer is deposited to fill at least a lower half of the trenches from the bottom, and leaving a temporary gap within each trench at the top. The method also includes depositing a low-k dielectric layer on the carbon-containing layer and the silicon-containing layer to fill the temporary gap, and exposing at least the carbon-containing layer to a treatment process to remove the carbon-containing layer and form the airgap between the silicon-containing layer and the low-k dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:工件</p>
        <p type="p">202:元件</p>
        <p type="p">210:基板</p>
        <p type="p">220:金屬閘極層</p>
        <p type="p">232:底部</p>
        <p type="p">234:頂部</p>
        <p type="p">236:側壁</p>
        <p type="p">240:含矽層</p>
        <p type="p">260:低介電常數介電層</p>
        <p type="p">270:氣隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1070" publication-number="202633436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經配置用於增加功率密度、電效率和熱效能的電源封裝</chinese-title>
        <english-title>POWER PACKAGE CONFIGURED FOR INCREASED POWER DENSITY, ELECTRICAL EFFICIENCY, AND THERMAL PERFORMANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W20/43</main-classification>
        <further-classification edition="202601120260422B">H10W29/00</further-classification>
        <further-classification edition="202301120260422B">H10B20/00</further-classification>
        <further-classification edition="202601120260422B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商沃孚半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFSPEED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　莎史瓦特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SHASHWAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克佛森　布萊斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCPHERSON, BRICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯摩爾　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASSMORE, BRANDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑普爾斯　本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMPLES, BEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席爾　薩彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAL, SAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇貝奇　羅柏托馬塞羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUPBACH, ROBERTO MARCELO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源封裝包括：至少一個具有至少一個功率走線的功率基板；至少一個位於該至少一個功率走線上的電源元件；訊號端子；以及至少一個訊號連接組件。該至少一個訊號連接組件包含下列至少一者：比該至少一個功率走線薄的至少一個訊號走線；在該至少一個功率基板內的至少一個嵌入式佈線層；及/或在該至少一個功率基板上的至少一個佈線層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power package includes at least one power substrate having at least one power trace, at least one power device on the at least one power trace, signal terminals, and at least one signal connection assembly. The at least one signal connection assembly includes at least one of the following: at least one signal trace that is thinner than the at least one power trace; at least one embedded routing layer within the at least one power substrate; and/or at least one routing layer on the at least one power substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源封裝</p>
        <p type="p">102:感測器</p>
        <p type="p">202:功率元件</p>
        <p type="p">300:功率基板</p>
        <p type="p">401:第一功率端子</p>
        <p type="p">402:第二功率端子</p>
        <p type="p">412:功率互連</p>
        <p type="p">502:訊號連接組件</p>
        <p type="p">504:訊號端子</p>
        <p type="p">506:訊號互連</p>
        <p type="p">901:橫向軸線</p>
        <p type="p">902:縱向軸線</p>
        <p type="p">903:垂直軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1071" publication-number="202633109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耐輻射的ＩＩＩ族氮化物異質結構及方法</chinese-title>
        <english-title>RADIATION-TOLERANT GROUP III-NITRIDE HETEROSTRUCTURE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D30/01</main-classification>
        <further-classification edition="202501120260427B">H10D30/47</further-classification>
        <further-classification edition="202501120260427B">H10D62/85</further-classification>
        <further-classification edition="202601120260427B">H10W42/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷神公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTHEON COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮祖托　安琪拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIZZUTO, ANGELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊利　卡羅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REILLY, CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰漢　馬赫　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHHAN, MAHER B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耐輻射的III族氮化物異質結構包括一緩衝層、一非漸變背面障壁、一漸變背面障壁及至少一個上部層。該非漸變背面障壁形成於該緩衝層上方。該漸變背面障壁形成於該非漸變背面障壁上方。該至少一個上部層形成於該漸變背面障壁上方。該漸變背面障壁之一部分經組態以用作一通道，或者該至少一個上部層包括一通道。該通道經組態以包括一誘導的二維電子氣。該非漸變背面障壁及該漸變背面障壁經組態以將該通道外產生之移動電荷引導至遠離該通道並朝向該緩衝層之方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radiation-tolerant Group III-Nitride heterostructure includes a buffer, an ungraded back barrier, a graded back barrier, and at least one upper layer. The ungraded back barrier is formed over the buffer. The graded back barrier is formed over the ungraded back barrier. The at least one upper layer is formed over the graded back barrier. Either a portion of the graded back barrier is configured to function as a channel or the at least one upper layer includes a channel. The channel is configured to include an induced two-dimensional electron gas. The ungraded back barrier and the graded back barrier are configured to direct mobile charges generated outside the channel in a direction away from the channel and toward the buffer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耐輻射的III族氮化物異質結構/異質結構</p>
        <p type="p">102:緩衝層</p>
        <p type="p">104:非漸變/漸變(U/G)背面障壁</p>
        <p type="p">106:上部層</p>
        <p type="p">114:非漸變背面障壁</p>
        <p type="p">116:漸變背面障壁/雙漸變背面障壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1072" publication-number="202632734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理裝置的檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01J37/32</main-classification>
        <further-classification edition="200601120260423B">H05H1/34</further-classification>
        <further-classification edition="200601120260423B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤悦治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, ETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新山浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIYAMA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片寄翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAYOSE, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋嵩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩佐竜二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASA, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理裝置，係具備腔室、複數個單元和上位控制部。腔室係配置於基板處理裝置的高度方向的中央區域。複數個單元係配置於腔室的上下方，並構成為分別具備在組裝至基板處理裝置之前便能夠對各個單元進行自身檢查的控制部。上位控制部係構成為當複數個單元被組裝至基板處理裝置，並組裝成為基板處理裝置之後，可統籌管理複數個單元各自的前述控制部。此外，複數個單元的控制部係在組裝成為基板處理裝置之後，能夠分別對各個單元進行自身檢查。此外，上位控制部係在組裝成為基板處理裝置之後，能夠進行作為基板處理裝置的檢查。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1073" publication-number="202632928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H04L27/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉辰辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請設計了一種新的標誌序列，該標誌序列可以降低標誌欄位的PAPR。該標誌序列中的前N個元素或後N個元素滿足：這N個元素中第j個元素與這N個元素中第N/2+1-j個元素相同，或者第j個元素與第N/2+1-j個元素互為相反數，上述元素為1或-1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of communication technology, particularly to a communication method and apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The application designs a new signature sequence that can reduce the PAPR of the signature field. The first N elements or the last N elements in this signature sequence satisfy the condition that the j&lt;sup&gt;th&lt;/sup&gt; element in these N elements is the same as the (N/2+1-j)&lt;sup&gt;th&lt;/sup&gt; element, or the j&lt;sup&gt;th&lt;/sup&gt; element is the opposite of the (N/2+1-j)&lt;sup&gt;th&lt;/sup&gt; element, where the elements are either 1 or -1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301、302、303:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1074" publication-number="202632056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理腔室的注入氣體活化以及相關腔室套件、裝置和方法</chinese-title>
        <english-title>INJECTION GAS ACTIVATION FOR PROCESSING CHAMBERS, AND RELATED CHAMBER KITS, APPARATUS, AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C23C16/452</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　阿尼克尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKETNITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於諸如用於低溫處理的注入氣體活化，以及相關腔室套件、方法和處理腔室。在一或多個實施例中，處理腔室包括至少部分限定內部空間的腔室主體。腔室主體包括一或多個氣體進口開口。處理腔室包括設置於內部空間中的基板支撐件、一或多個熱源，以及至少部分圍繞內部空間設置的襯墊。處理腔室包括吸收質塊，該吸收質塊至少部分由襯墊支撐於一或多個氣體進口開口與基板支撐件之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to injection gas activation, such as for low-temperature processing, and related chamber kits, methods, and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume. The chamber body includes one or more gas inlet openings. The processing chamber includes a substrate support disposed in the internal volume, one or more heat sources, and a liner disposed at least partially about the internal volume. The processing chamber includes an absorptive mass supported at least partially by the liner between the one or more gas inlet openings and the substrate support.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">106:基板支撐件</p>
        <p type="p">107:銷穿孔</p>
        <p type="p">108:上板</p>
        <p type="p">110:板</p>
        <p type="p">112:流動模組</p>
        <p type="p">114:氣體進口開口</p>
        <p type="p">116:氣體排氣出口</p>
        <p type="p">118:軸</p>
        <p type="p">120:控制器</p>
        <p type="p">121:運動組件</p>
        <p type="p">132:銷</p>
        <p type="p">136:處理空間</p>
        <p type="p">138:淨化空間</p>
        <p type="p">141:熱源</p>
        <p type="p">143:熱源</p>
        <p type="p">143a:區域</p>
        <p type="p">143b:區域</p>
        <p type="p">145:熱源模組</p>
        <p type="p">147:熱源</p>
        <p type="p">148:主體</p>
        <p type="p">151:製程氣體源</p>
        <p type="p">152:底板</p>
        <p type="p">153:清洗氣體源</p>
        <p type="p">154:蓋子</p>
        <p type="p">155:上熱源模組</p>
        <p type="p">156:上部主體</p>
        <p type="p">157:排氣泵</p>
        <p type="p">162:淨化氣體源</p>
        <p type="p">164:淨化氣體進口</p>
        <p type="p">178:排氣系統</p>
        <p type="p">302:預熱環</p>
        <p type="p">304:止動件</p>
        <p type="p">305a:臂</p>
        <p type="p">305b:臂</p>
        <p type="p">601:反射體</p>
        <p type="p">612:凹面</p>
        <p type="p">1000:處理腔室</p>
        <p type="p">1015:吸收質塊</p>
        <p type="p">1020:襯墊</p>
        <p type="p">1030:襯墊</p>
        <p type="p">P1:製程氣體</p>
        <p type="p">P2:淨化氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1075" publication-number="202631745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑材料及圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/14</main-classification>
        <further-classification edition="200601120260504B">C08F212/32</further-classification>
        <further-classification edition="200601120260504B">C08F220/22</further-classification>
        <further-classification edition="200601120260504B">C08F220/24</further-classification>
        <further-classification edition="200601120260504B">C08F220/30</further-classification>
        <further-classification edition="200601120260504B">C08K5/07</further-classification>
        <further-classification edition="200601120260504B">C08K5/098</further-classification>
        <further-classification edition="200601120260504B">C08K5/37</further-classification>
        <further-classification edition="200601120260504B">C08K5/375</further-classification>
        <further-classification edition="200601120260504B">C08K5/57</further-classification>
        <further-classification edition="200601120260504B">C08L101/04</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲荷宇俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INARI, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤彰人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弥
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的為提供新穎的阻劑材料及圖型形成方法，該阻劑材料為含有(A)聚合物與(B)金屬化合物之阻劑材料，其特徵為前述(A)成分包含具有氟原子之結構單位，前述具有氟原子之結構單位具有1價或2價之芳香族烴環式基，該芳香族烴環式基係該芳香族烴環式基上之至少2個以上的氫原子經氟原子取代之基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1076" publication-number="202631028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑材料及圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A41D13/018</main-classification>
        <further-classification edition="200601120260422B">A41D13/05</further-classification>
        <further-classification edition="200601120260422B">A42B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弥
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲荷宇俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INARI, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤彰人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤大雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAIGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種阻劑材料，其為含有(A)經修飾缺損部位之雜多酸鹽或其混合物與(B)酸擴散控制劑之阻劑材料，其中前述(B)酸擴散控制劑，為(B1)具有碘原子之光崩解性鹼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1077" publication-number="202631112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂質奈米顆粒組成物與包含其之醫藥組成物</chinese-title>
        <english-title>LIPID NANOPARTICLE COMPOSITION AND PHARMACEUTICAL COMPOSITION COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">A61K9/127</main-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/24</further-classification>
        <further-classification edition="200601120260504B">A61K47/28</further-classification>
        <further-classification edition="200601120260504B">A61K47/20</further-classification>
        <further-classification edition="200601120260504B">A61K31/713</further-classification>
        <further-classification edition="200601120260504B">A61P43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匈牙利商阿爾德克斯化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALDEXCHEM KFT.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷帕西　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REPASI, JOZSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾瓦吉　加博爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZILVAGYI, GABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於生物醫學與藥物遞送之領域。本發明係有關於允許相對於肝臟優先靶向脾臟的LipexSil&lt;img align="absmiddle" height="15px" width="15px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 含脂質奈米顆粒組成物，優先靶向係定義為，在投予發光物品並考量脾臟與肝臟的重量差異後脾臟與肝臟的發光強度比大於9。在LNP組成物中，含矽可離子化脂質結合特定結構性脂質、輔助性脂質、屏蔽脂質與第五脂質成分。本發明描述脂質奈米顆粒之生產與特性分析、以及證明如WO2024/023174所述之LipexSil&lt;img align="absmiddle" height="15px" width="15px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 脂質的對應配方優於現有方法的活體內實驗，其能夠將它們的物品（例如RNA、DNA、mRNA、microRNA、siRNA、ceDNA、pDNA、環狀DNA、生物活性小分子）優先遞送至脾臟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention belongs to the field of biomedicine and drug delivery. The invention relates to LipexSil&lt;img align="absmiddle" height="15px" width="15px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; lipid-containing nanoparticle (“LNP”) compositions, that permit preferential targeting of spleen versus liver, where preferential targeting is defined as a luminescence intensity ratio of spleen and liver greater than 9 after administration of a luminescent cargo, when the different weights of spleen and liver are taken into account. In the LNP composition, a silicon-containing ionizable lipid is combined with a certain structural lipid, a helper lipid, a shield lipid and a fifth lipid component. The invention describes the production and characterization of the lipid nanoparticles and in vivo experiments demonstrating that the corresponding formulations with LipexSil&lt;img align="absmiddle" height="15px" width="15px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; lipids as described in WO2024/023174 are superior to the current approach, delivering their cargo (e.g. RNA, DNA, mRNA, microRNA, siRNA, ceDNA, pDNA, circular DNA, small biologically active molecules) preferentially to the spleen.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1078" publication-number="202632531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用人工智慧角色的日記內容生成方法、電腦裝置及電腦程式</chinese-title>
        <english-title>METHOD, COMPUTER DEVICE, AND COMPUTER PROGRAM TO CREATE DIARY CONTENT USING AI CHARACTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120251201B">G06F40/56</main-classification>
        <further-classification edition="202001120251201B">G06F40/20</further-classification>
        <further-classification edition="202001120251201B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商連進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINE NEXT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, HAE CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金孝宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYO SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安花苑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HWAWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開利用人工智慧角色的日記內容生成方法、電腦裝置及電腦程式。日記內容生成方法可包括：通過用戶和人工智慧角色參與的聊天室收集所述用戶和所述人工智慧角色的對話消息；以及隨著所述對話消息滿足預設基準，基於所述對話消息生成與人工智慧角色有關的日記內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1079" publication-number="202631515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理系統</chinese-title>
        <english-title>INFORMATION PROCESSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260422B">C02F1/00</main-classification>
        <further-classification edition="202301120260422B">C02F1/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧口佳介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田響介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於存在有多數之水處理系統之情形，在多數之水處理系統各自之中容易地進行適當去除被處理水所含的雜質。水處理系統100-1量測所供給的被處理水之水質，將量測到的量測值通知予水處理系統100-2，根據量測到的量測值對於被處理水進行既定處理，將已處理的處理水供給予供給對象工廠200-1，水處理系統100-2使用由水處理系統100-1通知而來的量測值計算運轉條件，以計算出的運轉條件對於被處理水進行既定處理，將已處理的處理水供給予供給對象工廠200-2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">When a plurality of water treatment systems are present, the present invention easily and appropriately removes impurities contained in the water to be treated in each of the plurality of water treatment systems. &lt;br/&gt;A water treatment system 100-1 measures the water quality of a supplied water to be treated, notifies a water treatment system 100-2 of the measurement value, performs a predetermined treatment of the water to be treated based on the measurement value, and supplies the treated water to a supply destination plant 200-1, and the water treatment system 100-2 uses the measurement value notified by the water treatment system 100-1 to calculate operating conditions, performs a predetermined treatment of the water to be treated in accordance with the calculated operating conditions, and supplies the treated water to a supply destination plant 200-2.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100-1,100-2:水處理系統</p>
        <p type="p">200-1,200-2:供給對象工廠</p>
        <p type="p">300:淨水廠</p>
        <p type="p">310:再生水工廠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1080" publication-number="202632287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試裝置</chinese-title>
        <english-title>TEST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G01R1/04</main-classification>
        <further-classification edition="200601120260424B">G01R1/073</further-classification>
        <further-classification edition="200601120260424B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宰歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種測試裝置，用於測試測試物件的電氣特性。測試裝置包括插座體，插座體包括用於容置接地探針的接地探針容置部、用於容置信號探針的信號探針容置部、以及管狀的接地柱，接地柱從支撐表面在接地探針容置部的延伸方向上突出且環繞接地探針的端部；以及片狀的探針支撐部，探針支撐部設置於支撐表面上，並包括信號探針的端部所通過的信號探針通孔，以及接地柱通過的柱通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a test device for testing electrical characteristics of a test object. The test device includes a socket body including a ground-probe accommodating portion for accommodating a ground probe, a signal-probe accommodating portion for accommodating a signal probe, and a tubular ground post protruding from one support surface in an extending direction of the ground-probe accommodating portion and surrounding an end portion of the ground probe; and a sheet-shaped probe supporting portion disposed on the support surface, and including a signal probe through-hole through which an end portion of the signal probe passes, and a post through-hole through which the ground post passes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:探針、信號探針</p>
        <p type="p">6:探針、接地探針</p>
        <p type="p">10:測試插座</p>
        <p type="p">12A:上部塊</p>
        <p type="p">12B:下部塊</p>
        <p type="p">14A:探針支撐部、上探針支撐部</p>
        <p type="p">14B:探針支撐部、下探針支撐部</p>
        <p type="p">15:探針引導單元</p>
        <p type="p">16A:壓膜、上壓膜</p>
        <p type="p">16B:壓膜、下壓膜</p>
        <p type="p">121A,121B:信號探針容置部</p>
        <p type="p">122A,122B:接地探針容置部</p>
        <p type="p">123A:接地柱</p>
        <p type="p">141B,161B:柱塞通孔</p>
        <p type="p">141A,161A:信號探針通孔</p>
        <p type="p">143A,143B,163A,163B:柱通孔</p>
        <p type="p">151:引導孔</p>
        <p type="p">153:接地連接部通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1081" publication-number="202631844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含聚醯胺及有機矽化合物之廢棄流之再循環</chinese-title>
        <english-title>RECYCLING OF WASTE STREAMS COMPRISING POLYAMIDE AND AN ORGANOSILICON COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08J11/06</main-classification>
        <further-classification edition="200601120260428B">C08J11/14</further-classification>
        <further-classification edition="200601120260428B">B29B17/02</further-classification>
        <further-classification edition="200601120260428B">B29B17/04</further-classification>
        <further-classification edition="200601120260428B">C08G69/16</further-classification>
        <further-classification edition="200601120260428B">C08L77/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐特　約翰斯　克里斯提安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTT, JONAS CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克內曼　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOENEMANN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼戈德　漢娜　史蒂芬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGOLD, HANNAH STEPHANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於處理包含聚醯胺基聚合物及至少一種有機矽化合物（SF1）之聚合物材料（PM）之方法，該方法包含：提供包含聚醯胺基聚合物及至少一種有機矽化合物（SF1）之聚合物材料（PM）及包含水之溶劑組成物（SC）；從聚合物材料（PM）及溶劑組成物（SC）製備混合物（M-0）；使混合物（M-0）經受用於至少部分地解聚聚醯胺基聚合物之條件（D1），該條件（D1）包含解聚溫度T（D1）及解聚時間t（D1），獲得包含溶劑組成物（SC）、聚醯胺基聚合物之可溶性寡聚物及視情況存在之單體、及包含矽之不溶性組分（SF2）之混合物（M-1）；及從混合物（M-1）中分離不溶性組分（SF2），獲得包含不溶性組分（SF2）之混合物（M-2）、及包含溶劑組成物（SC）及聚醯胺基聚合物之可溶性寡聚物及視情況存在之單體之混合物（M-3）。此外，本發明關於藉由根據本發明之方法可獲得或獲得之混合物（M-3）用於製備聚醯胺之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to a process for treating a polymeric material (PM) comprising a polyamide based polymer and at least one organic silicon compound (SF1), the process com-prising providing a polymeric material (PM) comprising a polyamide based polymer and at least one organic silicon compound (SF1) and a solvent composition (SC) comprising water; prepar-ing a mixture (M-0) from the polymeric material (PM) and the solvent composition (SC); subject-ing mixture (M-0) to conditions for at least partially depolymerizing the polyamide based polymer (D1) comprising a depolymerization temperature T(D1) and a depolymerization time t(D1) ob-taining a mixture (M-1) comprising the solvent composition (SC), soluble oligomers and optional-ly monomers of the polyamide based polymer, and an insoluble component (SF2) comprising silicon; and separating the insoluble component (SF2) from mixture (M-1) obtaining mixture (M-2) comprising the insoluble component (SF2), and mixture (M-3) comprising the solvent composi-tion (SC) and soluble oligomers and optionally monomers of the polyamide based polymer. Fur-thermore, the present invention is directed to the use of mixture (M-3), obtainable or obtained by a process according to the present invention for preparing polyamide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1082" publication-number="202631709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性樹脂組成物、光學成形體及光學元件</chinese-title>
        <english-title>PHOTO CURABLE RESIN COMPOSITION, OPTICAL MOLDED BODY, AND OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F222/10</further-classification>
        <further-classification edition="200601120260504B">C08F283/12</further-classification>
        <further-classification edition="200601120260504B">C08F4/00</further-classification>
        <further-classification edition="200601120260504B">C08L51/08</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舘野航太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATENO, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮尾宙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田桂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光硬化性樹脂組成物，能夠用於光學成形體，所述光硬化性樹脂組成物包含(甲基)丙烯酸酯單體以及聚矽氧烷化合物，所述(甲基)丙烯酸酯單體包含二官能以上的(甲基)丙烯酸酯單體，所述聚矽氧烷化合物具有聚氧伸烷基骨架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1083" publication-number="202632335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波導間之底切輔助長程漸逝耦合</chinese-title>
        <english-title>UNDERCUT-ASSISTED LONG RANGE EVANESCENT COUPLING BETWEEN WAVEGUIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G02B6/12</main-classification>
        <further-classification edition="200601120260421B">G02B6/122</further-classification>
        <further-classification edition="200601120260421B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅晉欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, JINXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子蛟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZIJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學元件包括基板、位於基板上的包覆材料、包覆材料內的第一內核，以及在基板中的溝槽，該溝槽輔助光訊號在第一內核與定位成相比第一內核更遠離基板的第二內核之間的漸逝耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical device includes a substrate, cladding material on the substrate, a first inner core within the cladding material, and a trench in the substrate that assists with evanescent coupling of an optical signal between the first inner core and a second inner core that is positioned farther from the substrate than the first inner core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140-1:中介層</p>
        <p type="p">150:光子積體電路(PIC)</p>
        <p type="p">200:裝置</p>
        <p type="p">210-1:基板</p>
        <p type="p">210-2:基板</p>
        <p type="p">215-1:溝槽</p>
        <p type="p">215-2:溝槽</p>
        <p type="p">220-1:包覆材料</p>
        <p type="p">220-2:包覆材料</p>
        <p type="p">230-1:內核</p>
        <p type="p">230-2:內核</p>
        <p type="p">240:導電線</p>
        <p type="p">250:通孔</p>
        <p type="p">A:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1084" publication-number="202631938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可燒結黏結材料及使用該材料之半導體裝置</chinese-title>
        <english-title>SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C09J11/04</main-classification>
        <further-classification edition="200601120260422B">H01B1/22</further-classification>
        <further-classification edition="200601320260422B">B23K101/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商漢高股份有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王靜忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINGZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于媛媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛偉琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, WEICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃晨宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種可燒結黏結材料。特定言之，本發明係關於一種含有至少一種具有4至15個碳原子之有機羧酸化合物作為燒結促進劑之可燒結黏結材料，其能夠以良好黏著及燒結強度穩定地燒結於銅基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a sinterable bonding material. In particular, the present invention relates to a sinterable bonding material containing at least one organic carboxylic acid compound having 4 to 15 carbon atoms, as a sintering promoter, which is capable of being stably sintered on copper substrate with good adhesion and sintering strength.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1085" publication-number="202631673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PH敏感性結合分子</chinese-title>
        <english-title>PH SENSITIVE BINDING MOLECULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商生物極公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOARCTIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　朗尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷斯科加爾德　波　歐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRESKGARD, PER-OLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍內克　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONEK, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉哈馬爾　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARHAMMAR, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞登　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDON, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯特爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISTER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德斯朱　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDERSJOO, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於pH敏感性結合分子，例如抗體或其抗原結合片段，其結合人類運鐵蛋白受體1 (hTfR1)之蛋白酶樣域，且係關於該pH敏感性結合分子之治療及診斷用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a pH sensitive binding molecule, for example an antibody or antigen-binding fragment thereof, which binds to the protease-like domain of human transferrin receptor 1 (hTfR1), and to therapeutic and diagnostic uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1086" publication-number="202631659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嵌合抗原及T細胞受體以及使用方法</chinese-title>
        <english-title>CHIMERIC ANTIGEN AND T CELL RECEPTORS AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K14/725</main-classification>
        <further-classification edition="200601120260429B">C07K16/28</further-classification>
        <further-classification edition="200601120260429B">C12N15/13</further-classification>
        <further-classification edition="200601120260429B">C12N15/63</further-classification>
        <further-classification edition="201001120260429B">C12N5/0783</further-classification>
        <further-classification edition="202501120260429B">A61K40/11</further-classification>
        <further-classification edition="202501120260429B">A61K40/31</further-classification>
        <further-classification edition="202501120260429B">A61K40/42</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITE PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞茲　艾瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREZ, ARIANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席維爾斯　史都華特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEVERS, STUART A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛德里格斯　羅賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, RUBEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾克　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELK, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾席爾斯　傑德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILTZIUS, JED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種嵌合抗原受體(CAR)或T細胞受體(TCR)，其包含本文所揭示之一或多種抗原結合模體。本發明之態樣係關於編碼包含一或多種抗原結合模體之嵌合抗原受體(CAR)或T細胞受體(TCR)之聚核苷酸。本發明提供包含結合CD20之結合模體及視情況選用之結合CD19之結合模體的抗體及抗原結合系統，以及其產生及使用方法。本發明之抗體及抗原結合系統包含CAR，其包含抗CD20結合模體及抗CD19結合模體。本發明提供組合物，諸如為或包含本發明之抗CD20/抗CD19抗原結合系統之抗體及CAR，及包含其之細胞療法，適用於例如治療癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a chimeric antigen receptor (CAR) or a T cell receptor (TCR) comprising one or more of the antigen binding motifs disclosed herein. Aspects of the disclosure relate to a polynucleotide encoding a chimeric antigen receptor (CAR) or a T cell receptor (TCR) comprising one or more of the antigen binding motifs. Provided are antibodies and antigen binding systems that comprise a binding motif that binds CD20 and optionally a binding motif that binds CD19, and methods of producing and using the same. Antibodies and antigen binding systems of the present disclosure comprise CARs that comprise an anti-CD20 binding motif and an anti-CD19 binding motif. Provided are compositions, such as antibodies and CARs that are or comprise an anti-CD20/anti-CD19 antigen binding system of the present disclosure, and cell therapies comprising the same, are useful, &lt;i&gt;e.g.&lt;/i&gt;, in the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1087" publication-number="202632363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於固持光學元件的設備、固持裝置、配置、系統與方法以及微影系統</chinese-title>
        <english-title>APPARATUS, HOLDING DEVICE, ARRANGEMENT, SYSTEM AND METHOD FOR HOLDING AN OPTICAL ELEMENT; LITHOGRAPHY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260430B">G02B7/02</main-classification>
        <further-classification edition="200601120260430B">G03F7/20</further-classification>
        <further-classification edition="201201120260430B">G03F1/64</further-classification>
        <further-classification edition="202601120260430B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋伯　尤瑞奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBER, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種用於固持一光學元件(2)，尤其是一微影系統或一光罩檢查系統的光學元件，的設備(1)，包含用於連接至該光學元件(2)的一固持點(3)，一支架(4)和一支撐腳(5)。固持點(3)連接至支架(4)。支架(4)具有至少一個桿狀腳(6)和腳關節裝置(7)，其中腳關節裝置(7)鉸接地連接桿狀腳(6)的下端(6a)，其朝向遠離固持點(3)的一端，至支撐腳(5)。本發明提供腳關節裝置(7)具有支撐關節(7a)和橫向關節(7b)，其中支撐關節(7a)鉸接地將桿狀腳(6)的下端(6a)直接連接至支撐腳(5)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an apparatus (1) for holding an optical element (2), in particular an optical element of a mask inspection system or of a lithography system, comprising a holding point (3) for connection to the optical element (2), a support (4) and a support foot (5). The holding point (3) is connected to the support (4). The support (4) has at least one rod leg (6) and a foot joint device (7), wherein the foot joint device (7) articulatedly connects a lower end (6a) of the rod leg (6) facing away from the holding point (3) to the support foot (5). The invention provides for the foot joint device (7) to have a supporting joint (7a) and a transverse joint (7b), wherein the supporting joint (7a) articulatedly connects the lower end (6a) of the rod leg (6) directly to the support foot (5).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1、1a、1b:設備</p>
        <p type="p">2:光學元件</p>
        <p type="p">3:固持點</p>
        <p type="p">4:支架</p>
        <p type="p">5:支撐腳</p>
        <p type="p">6:桿狀腳</p>
        <p type="p">6a:下端</p>
        <p type="p">7:腳關節裝置</p>
        <p type="p">7a:支撐關節</p>
        <p type="p">7b:橫向關節</p>
        <p type="p">8:虛擬交點</p>
        <p type="p">9:致動柄</p>
        <p type="p">10:致動器</p>
        <p type="p">11:致動關節</p>
        <p type="p">12:柄關節</p>
        <p type="p">13:關節元件</p>
        <p type="p">14:頭關節裝置</p>
        <p type="p">15:固持裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1088" publication-number="202631308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用聲能測量基板厚度的裝置及相關方法</chinese-title>
        <english-title>APPARATUS FOR MEASURING SUBSTRATE THICKNESS USING ACOUSTIC ENERGY AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260428B">B24B37/013</main-classification>
        <further-classification edition="201201120260428B">B24B37/20</further-classification>
        <further-classification edition="200601120260428B">B24B49/02</further-classification>
        <further-classification edition="201201120260428B">B24B49/00</further-classification>
        <further-classification edition="202601120260428B">H10P50/00</further-classification>
        <further-classification edition="202601120260428B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班維紐　多明尼克Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENVEGNU, DOMINIC J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史威克　柏格斯勞Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWEDEK, BOGUSLAW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特海德　湯瑪士Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSTERHELD, THOMAS H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例通常與化學機械研磨（CMP）系統有關。更特別地，本揭露的實施例涉及一種原位聲學監測系統，可以在基板平坦化過程中測量其厚度，以及相關方法。在一或多個實施例中，確定基板厚度的方法包括向基板發射聲脈衝，並在第一時間接收來自基板的聲脈衝第一反射。該方法進一步包括在第二時間接收聲脈衝的第二反射，並測量第一時間與第二時間之間的差異以確定飛行時間。該方法進一步包括根據飛行時間至少部分地確定基板的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems. More particularly, embodiments of the present disclosure relate to an in situ acoustic monitoring system that can measure the thickness of a substrate as it is being planarized, and related methods. In one or more embodiments, a method of determining a thickness of a substrate includes emitting an acoustic pulse towards a substrate and receiving a first reflection of the acoustic pulse from the substrate at a first time. The method further includes receiving a second reflection of the acoustic pulse at a second time and measuring a difference between the first time and the second time to determine a time of flight. The method further includes determining a thickness of the substrate based at least in part on the time of flight.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">100:拋光裝置</p>
        <p type="p">110:拋光墊</p>
        <p type="p">118:聲學窗</p>
        <p type="p">120:平臺</p>
        <p type="p">121:馬達</p>
        <p type="p">124:驅動軸</p>
        <p type="p">125:軸</p>
        <p type="p">130:端口</p>
        <p type="p">132:分配拋光液</p>
        <p type="p">140:承載頭</p>
        <p type="p">142:扣環</p>
        <p type="p">144:彈性的膜</p>
        <p type="p">146a:腔室</p>
        <p type="p">146b:腔室</p>
        <p type="p">146c:腔室</p>
        <p type="p">150:支撐結構</p>
        <p type="p">152:驅動軸</p>
        <p type="p">154:馬達</p>
        <p type="p">155:軸</p>
        <p type="p">160:聲學監測系統</p>
        <p type="p">162:聲學轉換器</p>
        <p type="p">164:凹槽</p>
        <p type="p">166:脈衝器</p>
        <p type="p">167:示波器</p>
        <p type="p">168:電路</p>
        <p type="p">170:泵</p>
        <p type="p">171:流體進口</p>
        <p type="p">172:流體出口</p>
        <p type="p">190:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1089" publication-number="202632735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減少蝕刻不均勻性和電弧之具有上電極、基板支座及邊緣環系統的電漿處理系統</chinese-title>
        <english-title>PLASMA PROCESSING SYSTEM WITH UPPER ELECTRODE, SUBSTRATE SUPPORT, AND EDGE RING SYSTEM WITH REDUCED ETCH NON-UNIFORMITY AND ARCING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉梅什　赫曼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMESH, HEMANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜弼竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, PHILJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧布拉普拉姆　賽　帕萬　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBULAPURAM, SAI PAVAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電漿處理系統包括配置成支撐基板之基板支座。基板支座包括底板及頂陶瓷板。頂邊緣環圍繞頂陶瓷板佈設且包括環形體，該環形體具有第一水平表面、從第一水平表面向下且徑向朝內延伸之第一傾斜表面以及從第一傾斜表面徑向朝內延伸之第二水平表面。上電極佈設於基板支座上方，且包括內圓形水平表面、環繞內圓形水平表面並向下且徑向朝外延伸之第二傾斜環形表面、以及環繞第二傾斜環形表面之環形水平表面。內圓形水平表面與第二傾斜環形表面之間的過渡部位於頂邊緣環之第一傾斜表面徑向外邊緣之徑向外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma processing system includes a substrate support configured to support a substrate. The substrate support includes a baseplate and a top ceramic plate. A top edge ring is arranged around the top ceramic plate and includes an annular body with a first horizontal surface, a first sloped surface extending downwardly and radially inwardly from the first horizontal surface, and a second horizontal surface extending radially inwardly from the first sloped surface. An upper electrode arranged above the substrate support including an inner circular horizontal surface, a second sloped annular surface surrounding and extending downwardly and radially outwardly from the inner circular horizontal surface, and an annular horizontal surface surrounding the second sloped annular surface. A transition between the inner circular horizontal surface and the second sloped annular surface is located radially outside of a radially outer edge of the first sloped surface of the top edge ring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">208:基板支座</p>
        <p type="p">210:基板</p>
        <p type="p">212:頂板</p>
        <p type="p">213:圓柱形內側部</p>
        <p type="p">214:底板</p>
        <p type="p">215:冷卻劑通道</p>
        <p type="p">216:接合層</p>
        <p type="p">217:環形階部</p>
        <p type="p">218:邊緣環</p>
        <p type="p">220:第一水平表面</p>
        <p type="p">222:環形傾斜表面</p>
        <p type="p">224:第二水平表面</p>
        <p type="p">226:垂直表面</p>
        <p type="p">228:第三水平表面</p>
        <p type="p">230:熱介面材料(TIM)</p>
        <p type="p">232:陶瓷層</p>
        <p type="p">234:電阻加熱器</p>
        <p type="p">237-1:密封件</p>
        <p type="p">270:上電極</p>
        <p type="p">272:面向基板表面</p>
        <p type="p">274:徑向內圓形表面</p>
        <p type="p">276:環形傾斜表面</p>
        <p type="p">278:水平環形表面</p>
        <p type="p">280:內過渡部</p>
        <p type="p">284:外過渡部</p>
        <p type="p">290:電漿</p>
        <p type="p">292:離子</p>
        <p type="p">294:離子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1090" publication-number="202631298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B23Q1/54</main-classification>
        <further-classification edition="200601120260422B">B23Q1/01</further-classification>
        <further-classification edition="200601120260422B">B23Q16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三共製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKYO SEISAKUSHO CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋直幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可高精度地將旋轉構件102定位至目標的角度位置的旋轉裝置100。旋轉裝置100具備：微動機構109，具備基座構件110；及粗動機構101，具備殼體104及至少一部分收容於殼體104內之旋轉構件102，且配置於基座構件110之上，旋轉構件102能以旋轉構件軸線103為中心相對於殼體104旋轉，粗動機構101整體能以旋轉構件軸線103為中心相對於基座構件110旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:旋轉裝置</p>
        <p type="p">101:粗動機構</p>
        <p type="p">102:旋轉構件</p>
        <p type="p">103:旋轉構件軸線</p>
        <p type="p">104:殼體</p>
        <p type="p">105:馬達</p>
        <p type="p">109:微動機構</p>
        <p type="p">110:基座構件</p>
        <p type="p">111:直動機構</p>
        <p type="p">112:第1部分</p>
        <p type="p">113:第2部分</p>
        <p type="p">114:粗動機構之一部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1091" publication-number="202631911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化性組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C09D5/04</main-classification>
        <further-classification edition="200601120260424B">C08F2/06</further-classification>
        <further-classification edition="200601120260424B">C08L83/04</further-classification>
        <further-classification edition="200601120260424B">C08L83/07</further-classification>
        <further-classification edition="200601120260424B">C08G77/48</further-classification>
        <further-classification edition="201801120260424B">C08K3/014</further-classification>
        <further-classification edition="200601120260424B">C08K3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森瑶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森岡孝至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIOKA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合田英生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱固化性組合物，其係含有下述（A）成分及（B）成分之熱固化性組合物，搖變指數（剪切速度為1s&lt;sup&gt;－&lt;/sup&gt;&lt;sup&gt;1&lt;/sup&gt;時的黏度/剪切速度為103s&lt;sup&gt;－&lt;/sup&gt;&lt;sup&gt;1&lt;/sup&gt;時的黏度）為小於1.1。（A）成分：具有下述式（a－1）所表示之重複單元[重複單元（1）]之矽烷化合物聚合物，（B）成分：選自由氧化鋁及氧化鋅所組成之群組的1種或2種以上的填料。  &lt;br/&gt;&lt;img align="absmiddle" height="49px" width="322px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[R&lt;sup&gt;1&lt;/sup&gt;表示未取代或具有取代基之碳數6～20的芳基]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1092" publication-number="202631824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化性組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G77/04</main-classification>
        <further-classification edition="200601120260420B">C08L83/04</further-classification>
        <further-classification edition="200601120260420B">C08K3/22</further-classification>
        <further-classification edition="200601120260420B">C08K3/28</further-classification>
        <further-classification edition="200601120260420B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森瑶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森岡孝至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIOKA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合田英生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱固化性組合物，其為包含下述(A)成分及(B)成分的熱固化性組合物，搖變指數(剪切速度是1 s&lt;sup&gt;-1&lt;/sup&gt;時的黏度/剪切速度是103 s&lt;sup&gt;-1&lt;/sup&gt;時的黏度)是1.1以上。(A)成分：具有由下述式(a-1)表示的重複單元[重複單元(1)]的矽烷化合物聚合物。(B)成分：選自由氧化鋁、氮化鋁及氧化鋅所組成的群組中的一種或兩種以上的填料。  &lt;br/&gt;&lt;img align="absmiddle" height="48px" width="319px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[R&lt;sup&gt;1&lt;/sup&gt;表示未取代或具有取代基的碳原子數6～20的芳香基]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1093" publication-number="202631898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱聚矽氧組成物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE SILICONE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L83/07</main-classification>
        <further-classification edition="200601120260420B">C08L83/05</further-classification>
        <further-classification edition="200601120260420B">C08K7/18</further-classification>
        <further-classification edition="200601120260420B">C08K3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嫣然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種導熱組成物，其包含：(A)由平均式(I)表示且在25℃下具有20至1000 mPa•s之動態黏度的有機聚矽氧烷；(B1)含有烷氧基矽基之有機聚矽氧烷；(C)大於90至96.5 wt%之導熱填料混合物，其包含：(C1) 30至60 wt%之具有50至150 µm之D50的碳化矽粒子；(C2) 19.5至50 wt%之具有1至25 μm之D50的第二導熱填料，且以(C2)之重量計，該第二導熱填料包含(C2a) 25至100 wt%之具有1至25 μm之D50的氧化鋁，及(C2b) 0至75 wt%之具有1至25 μm之D50的碳化矽；及(C3) 10至30 wt%之具有0.1至0.5 µm之D50的氧化鋅；除非另外說明，否則wt%係以組成物之重量計。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thermally conductive composition comprises: (A) an organopolysiloxane represented by an average formula (I) and a dynamic viscosity of 20 to 1000 mPa•s at 25°C; (B1) an organopolysiloxane containing an alkoxysilyl group; (C) greater than 90 to 96.5 wt% of a thermally conductive filler mixture comprising: (C1) 30 to 60 wt% of silicon carbide particles having a D50 of 50 to 150 µm; (C2) 19.5 to 50 wt% of a second thermally conductive filler having a D50 of 1 to 25 µm and comprising, based on the weight of (C2), (C2a) 25 to 100 wt% of aluminum oxide having a D50 of 1 to 25 µm, and (C2b) 0 to 75 wt% of silicon carbide having a D50 of 1 to 25 µm; and (C3) 10 to 30 wt% of zinc oxide having a D50 of 0.1 to 0.5 µm; wt% based on composition weight unless otherwise stated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1094" publication-number="202631797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物及包含源自該聚合物結構之聚胺基甲酸酯</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08G63/16</main-classification>
        <further-classification edition="200601120260422B">C08G18/42</further-classification>
        <further-classification edition="200601120260422B">C08G64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡野茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKANO, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穗坂祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSAKA, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田裕輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚胺基甲酸酯，其包含源自聚合物的結構，該聚合物為二醇成分(A)與成分(B)之反應產物，該二醇成分(A)為包含選自由下述通式(I)所表示之二醇(a1)及下述通式(II)所表示之二醇(a2)組成之群組的至少1種，該成分(B)為選自由二羧酸(b1)及碳酸酯(b2)組成之群組的至少1種：&lt;br/&gt;&lt;img align="absmiddle" height="262px" width="343px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (各通式中，各符號係如說明書中所定義)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1095" publication-number="202631312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光學增強分析的基板研磨頭</chinese-title>
        <english-title>SUBSTRATE POLISHING HEAD FOR OPTICAL ENHANCEMENT ANALYSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260430B">B24B37/26</main-classification>
        <further-classification edition="201201120260430B">B24B37/07</further-classification>
        <further-classification edition="202601120260430B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裘卡林姆　亞敘溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOCKALINGAM, ASHWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍布琳迦　桑德拉堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEMBULINGAM, SOUNDARRAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴迪　尼基爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADDI, NIKHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及用於化學機械研磨工具的研磨頭。在一個實施例中，該研磨頭包括外殼、連接到外殼的穿孔板、位於外殼內的可彎曲膜，以及圍繞膜的保持環。穿孔板包括複數個穿孔，這些穿孔貫穿整個穿孔板。這些複數個穿孔至少穿透穿孔板的20%的穿孔表面。這些複數個穿孔包括第一穿孔和第二穿孔。可彎曲膜和穿孔板定義了腔室。可彎曲膜包括面向穿孔板的第一表面以及與第一表面相對的第二表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a polishing head for a chemical mechanical polishing tool. In one embodiment, a polishing head, includes a housing, a perforated plate coupled to the housing, a flexible membrane disposed in the housing, and a retaining ring disposed around the membrane. The perforated plate includes a plurality of apertures disposed through the perforated plate. The plurality of apertures perforate at least 20% of a perforation surface of the perforated plate. The plurality of apertures comprise a first aperture and a second aperture. The flexible membrane and the perforated plate define a chamber. The flexible membrane includes a first surface facing the perforated plate and a second surface opposite the first surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:墊</p>
        <p type="p">110:研磨頭</p>
        <p type="p">111:外殼</p>
        <p type="p">115:扣環</p>
        <p type="p">117:膜</p>
        <p type="p">119:載體腔室</p>
        <p type="p">122:基板</p>
        <p type="p">124:第一致動器</p>
        <p type="p">200:基板支撐組件</p>
        <p type="p">202:萬向杆</p>
        <p type="p">204:撓性環</p>
        <p type="p">206:穿孔板</p>
        <p type="p">208:孔</p>
        <p type="p">210:真空通道</p>
        <p type="p">212:腔室</p>
        <p type="p">220:第一表面</p>
        <p type="p">222:第二表面</p>
        <p type="p">224:環形的襟翼</p>
        <p type="p">226:第一區域</p>
        <p type="p">228:第二區域</p>
        <p type="p">B:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1096" publication-number="202631161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸附劑</chinese-title>
        <english-title>SORBENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K33/44</main-classification>
        <further-classification edition="200601120260504B">A61K9/16</further-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
        <further-classification edition="200601120260504B">A61P39/06</further-classification>
        <further-classification edition="201701120260504B">C01B32/336</further-classification>
        <further-classification edition="200601120260504B">B01J20/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商維凡斯私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVANCE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南洋理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYANG TECHNOLOGICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫特　斯里尼瓦薩　雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTHE, SRINIVASA REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡馬魯丁　努爾哈妮莎　賓蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMARUDIN, NURHANISAH BINTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　桑傑庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SANJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝魯爾本卡塔拉亞　蘇雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELUR VENKATARAYA, SURESHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡雷爾　沙拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAREL, SHARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍　燕明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, YENG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於口服的活性碳吸附劑，其中所述活性碳吸附劑為透過碳化並活化聚（苯乙烯-共-二烯基苯）顆粒獲得的顆粒形式，其中所述聚（苯乙烯-共-二烯基苯）顆粒為大孔且具有相對於聚（苯乙烯-共-二烯基苯）顆粒總質量約5wt％至約60wt％的含水量。本發明也提供一種用於口服的活性碳吸附劑，該活性碳吸附劑為顆粒狀，包含微孔及中孔，總表面積至少約為1000 m²/g，總孔隙量至少約為1 cm³/g，其中至少約50%的總孔隙量由微孔形成，約20%的總孔隙量由中孔形成。本文也提供包含本發明的活性碳吸附劑的藥用組合物，以及使用本發明的活性碳吸附劑從液體中去除一種或多種尿毒素的體外方法。如本文所公開的，活性碳吸附劑也可用於治療腎臟疾病或肝臟疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an activated carbon adsorbent for oral administration, wherein the activated carbon adsorbent is in the form of particles obtained by carbonization and subsequent activation of poly(styrene-co-divinylbenzene) particles, wherein the poly(styrene-co-divinylbenzene) particles are macroporous and have a moisture content of from about 5 wt% to about 60 wt% relative to the total mass of the poly(styrene-co-divinylbenzene) particles. The present invention also provides an activated carbon adsorbent for oral administration, wherein the activated carbon adsorbent is in the form of particles, comprises micropores and mesopores, and has a total surface area of at least about 1000 m&lt;sup&gt;2&lt;/sup&gt;/g, and a total pore volume of at least about 1 cm&lt;sup&gt;3&lt;/sup&gt;/g, wherein at least about 50% of the total pore volume is formed by the micropores, and at least about 20% of the total pore volume is formed by the mesopores. The present disclosure also provides a pharmaceutical composition comprising an activated carbon adsorbent of the present invention, and an in vitro method of removing one or more uremic toxins from a fluid using an activated carbon adsorbent of the present invention. As disclosed herein, the activated carbon adsorbents also find utility in the treatment of a renal disease or a liver disease.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1097" publication-number="202632103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造紡織產品的電腦實施方法</chinese-title>
        <english-title>COMPUTER-IMPLEMENTED METHOD FOR MANUFACTURING A TEXTILE PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">D04B35/18</main-classification>
        <further-classification edition="200601120260428B">D05B81/00</further-classification>
        <further-classification edition="200601120260428B">D05B85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商葛羅斯貝克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROZ-BECKERT KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾克　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACKER, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古納塞克拉　史丹利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNASEKERA, STANLEY TARIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃德克　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOIDECK, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種使用一組紡織機(3)製造紡織產品的電腦實施方法。為了獲得高品質的紡織產品，用於紡織機(3)中的紡織工具(2)需要定期更換。為了確保在大型紡織機群組(3)中也能定期更換紡織工具(2)，控制單元(6)在將第一紡織工具(102)安裝到紡織機群組(3)中的第一紡織機(103)時，計算出第一紡織工具(102)的更換時間(17)，並根據控制單元(6)在更換時間(17)生成的訊號(7)，用新的紡織工具(202)替換第一紡織工具(102)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a computer-implemented method for manufacturing a textile product using a group (5) of textile machines (3). In order to obtain a textile product of good quality, the textile tools (2), which are used in the textile machines (3), are replaced periodically. In order to ensure the periodic replacement of the textile tools (2) even in the case of large groups of textile machines (3), a control unit (6) calculates a replacement time (17) for a first textile tool (102) upon the installation of the first textile tool (102) into a first textile machine (103) of the group of textile machines (3) and the first textile tool (102) is replaced with a new textile tool (202) based on a signal (7) generated by the control unit (6) at the replacement time (17).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電腦實施方法</p>
        <p type="p">2:紡織工具</p>
        <p type="p">3:紡織機</p>
        <p type="p">4:識別碼</p>
        <p type="p">5:群組</p>
        <p type="p">102:紡織工具</p>
        <p type="p">103:紡織機</p>
        <p type="p">202:紡織工具</p>
        <p type="p">203:紡織機</p>
        <p type="p">303:紡織機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1098" publication-number="202633172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DEOK HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔漢星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HAN BYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含：一場絕緣膜，其包括在一第一方向上彼此相對之一第一表面及一第二表面；一第一突出絕緣圖案，其安置在該場絕緣膜之該第一表面上；一第二突出絕緣圖案，其安置在該場絕緣膜之該第一表面上且在一第二方向上與該第一突出絕緣圖案間隔開，該第二突出絕緣圖案在該第一方向上之一厚度不同於該第一突出絕緣圖案在該第一方向上之一厚度；一通道區，其安置在該第一突出絕緣圖案與該第二突出絕緣圖案之間；以及一閘極電極，其安置在該通道區、該第一突出絕緣圖案及該第二突出絕緣圖案上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device comprises a field insulating film which includes a first surface and a second surface opposite to each other in a first direction, a first protruding insulation pattern disposed on the first surface of the field insulating film, a second protruding insulation pattern disposed on the first surface of the field insulating film, and spaced apart from the first protruding insulation pattern in a second direction, a thickness of the second protruding insulation pattern in the first direction being different from a thickness of the first protruding insulation pattern in the first direction, a channel region disposed between the first protruding insulation pattern and the second protruding insulation pattern and a gate electrode disposed on the channel region, the first protruding insulation pattern, and the second protruding insulation pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一基體</p>
        <p type="p">105:場絕緣膜</p>
        <p type="p">105_BS:第二側</p>
        <p type="p">105_US:第一側</p>
        <p type="p">110:第一突出絕緣圖案</p>
        <p type="p">120:閘極電極</p>
        <p type="p">120BD:本體閘極電極</p>
        <p type="p">120BD_BS:第二側</p>
        <p type="p">120BD_US:第一側，上側</p>
        <p type="p">120BR:連接閘極電極</p>
        <p type="p">120BR_BS:第二側</p>
        <p type="p">120BR_US:第一側，上側</p>
        <p type="p">120BR1:第一連接閘極電極</p>
        <p type="p">120BR2:第二連接閘極電極</p>
        <p type="p">130:閘極絕緣膜</p>
        <p type="p">175:前閘極接點</p>
        <p type="p">195:第二層間絕緣膜</p>
        <p type="p">210:第二突出絕緣圖案</p>
        <p type="p">BP1:第一下圖案</p>
        <p type="p">BP2:第二下圖案</p>
        <p type="p">C-C:線</p>
        <p type="p">CHR1:第一通道區</p>
        <p type="p">CHR2:第二通道區</p>
        <p type="p">CHR_SW1:第一側壁</p>
        <p type="p">CHR_SW2:第二側壁</p>
        <p type="p">CH1:第一通道圖案</p>
        <p type="p">CH2:第二通道圖案</p>
        <p type="p">CT_R.:閘極分開區</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">H4:高度</p>
        <p type="p">H11:高度</p>
        <p type="p">H21:高度</p>
        <p type="p">H31:高度</p>
        <p type="p">H32:高度</p>
        <p type="p">H33:高度</p>
        <p type="p">H34:高度</p>
        <p type="p">t11:厚度</p>
        <p type="p">t12:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1099" publication-number="202632636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>呈現高對比影像的掃描驅動方法及膽固醇液晶顯示裝置</chinese-title>
        <english-title>SCAN DRIVING METHOD FOR RENDERING HIGH-CONTRAST IMAGE AND CHOLESTERIC LIQUID-CRYSTAL DISPLAY DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G09G3/36</main-classification>
        <further-classification edition="200601120260422B">G02F1/00</further-classification>
        <further-classification edition="200601120260422B">G02F1/1343</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種膽固醇液晶顯示裝置，其包括液晶顯示面板。液晶顯示面板包括第一基板，其中沿著一第一方向延伸的複數個掃描電極形成於該第一基板之上；第二基板，其中沿著第二方向延伸的複數個資料電極形成於該第二基板之上；膽固醇液晶層形成於第一基板及第二基板之間；驅動電路部經組態以對在掃描電極與資料電極交錯處的多個像素電路施加交流電壓脈衝。在該驅動電路部所依序啟動的各掃描電極上的像素電路的改良脈衝寬度調變掃描程序包括依序排列的第一至第三階段。第一階段調整在第一掃描電極上的各像素電路在第二階段要寫入的灰階值。當在第一掃描電極上的像素電路處於第一階段時，在剩餘的掃描電極上的像素電路在第三階段中的一第一期間感受到零電壓，其中第一期間對應於第一掃描電極上的像素電路的第一階段中的高電壓期間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cholesteric liquid-crystal display device is provided, which includes a liquid crystal display panel. The liquid crystal display panel includes a first substrate, a second substrate, a cholesteric liquid crystal layer, and a driving circuit. The first substrate includes a plurality of scanning electrodes extending in a first direction. The second substrate includes a plurality of data electrodes extending in a second direction different from the first direction. The cholesteric liquid crystal layer is formed between the first substrate and the second substrate. The driving circuit is configured to apply a plurality of alternative-current (AC) voltage pulses to pixel circuits at intersections between the scanning electrodes and data electrodes. A modified pulse-width modulation (PWM) scanning procedure of the pixel circuits on each scanning electrode sequentially activated by the driving circuit section comprises a first stage, a second stage, and a third stage arranged in sequence. The first stage is configured to manipulate grayscale values of the pixel circuits on a first scanning electrode among the plurality of scanning electrodes to be written in the second stage. When the pixel circuits on the first scanning electrode are within the first stage, the pixel circuits on the remaining scanning electrodes, which are within a first period of the third stage, sense a zero voltage, wherein the first period corresponds to a high-voltage period within the first stage of the pixel circuits on the first scanning electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">10:處理器</p>
        <p type="p">11:匯流排</p>
        <p type="p">20:顯示裝置</p>
        <p type="p">21:驅動電路</p>
        <p type="p">22:顯示面板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1100" publication-number="202631612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環狀胺衍生物</chinese-title>
        <english-title>CYCLIC AMINE DERIVATIVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D417/14</main-classification>
        <further-classification edition="200601120260504B">C07D409/14</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07D495/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/454</further-classification>
        <further-classification edition="200601120260504B">A61K31/498</further-classification>
        <further-classification edition="200601120260504B">A61K31/4709</further-classification>
        <further-classification edition="200601120260504B">A61P11/00</further-classification>
        <further-classification edition="200601120260504B">A61P17/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本臟器製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ZOKI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎有理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村有司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東浦邦彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHIURA, KUNIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩月宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATSUKI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古河和人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, KAZUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供新穎之環狀胺衍生物、或其藥學上可接受之鹽或者水合物、及含有該化合物作為有效成分之醫藥。  &lt;br/&gt;本發明之環狀胺衍生物，或其藥學上可接受之鹽或者水合物兼具對於組織胺之拮抗作用及對於白三烯素之拮抗作用，因此，非常有用於作為對於廣泛之過敏性疾病之預防及/或治療劑等醫藥組成物之有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a novel cyclic amine derivative or a pharmaceutically acceptable salt or hydrate thereof, and a medicine containing said compound as an active ingredient. &lt;br/&gt;The cyclic amine derivative or a pharmaceutically acceptable salt or hydrate thereof of the present invention possesses both antagonistic effects against histamines and leukotrienes, and is therefore very useful as an active ingredient in pharmaceutical compositions such as preventive and/or therapeutic agents for a wide range of allergic diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1101" publication-number="202631127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療激躁之經皮右美托咪啶(DEXMEDETOMIDINE)</chinese-title>
        <english-title>TRANSDERMAL DEXMEDETOMIDINE FOR TREATING AGITATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4174</main-classification>
        <further-classification edition="200601120260504B">A61K9/70</further-classification>
        <further-classification edition="200601120260504B">A61P25/22</further-classification>
        <further-classification edition="200601120260504B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商帝國製藥美國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIKOKU PHARMA USA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　皖寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, WAN-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱　蓋瑞　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAY, GARY G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於使用含有右美托咪啶(dexmedetomidine)之經皮遞送貼劑治療激躁之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to methods of using transdermal delivery patches containing dexmedetomidine to treat agitation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1102" publication-number="202633327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基座加熱器</chinese-title>
        <english-title>SUSCEPTOR HEATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相田弘栄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIDA, KOEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露呈現一種基座加熱器。為了避免使基座之不同材料曝露於電漿環境，本揭露呈現一種基座加熱器，其包含：一基座部分，其包含：一上部部分；一下部部分；以及複數個加熱元件，其安置於此上部部分與此下部部分之間；以及一軸桿部分，其中此上部部分及此下部部分藉由擴散接合而接合。在另一實施例中，本揭露亦呈現一種基座加熱器，其包含：一基座部分，其包含：一上部部分，其為中心呈向上凹陷的；一下部部分，其經塑形以適配於此上部部分之凹陷區域中；以及複數個加熱元件，其在此上部部分與此下部部分之間安置於此下部部分上；以及一軸桿部分，其中此上部部分及此下部部分藉由硬焊而水平地接合且藉由電子束焊接而豎直地接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A susceptor heater is presented. To avoid exposing different materials of the susceptor to the plasma environment, the present disclosure presents a susceptor heater comprises a susceptor part comprising: an upper part; a lower part; and a plurality of heating elements disposed between the upper part and the lower part; and a shaft part, wherein the upper part and the lower part are bonded with diffusion bonding. In another embodiment, the present disclosure also presents a susceptor heater, comprises: a susceptor part comprising: an upper part dented upward in the center; a lower part shaped to be fitted into the dented area of the upper part; and a plurality of heating elements disposed on the lower part between the upper part and the lower part; and a shaft part, wherein the upper part and the lower part are bonded horizontally with brazing and bonded vertically with electrical beam welding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基座加熱器</p>
        <p type="p">210:上部部分</p>
        <p type="p">210A:基座部分</p>
        <p type="p">210B:軸桿部分</p>
        <p type="p">220:下部部分</p>
        <p type="p">230:加熱元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1103" publication-number="202631940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著性膜</chinese-title>
        <english-title>ADHESIVE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C09J11/08</main-classification>
        <further-classification edition="200601120260421B">B32B7/12</further-classification>
        <further-classification edition="201801120260421B">C09J7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏著性膜（10），包括基材層（A）及黏著性樹脂層（C），所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的基於規定的測定方法的黏力為5 gf以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adhesive film (10) includes a base material layer (A) and an adhesive resin layer (C). The adhesive resin layer (C) contains thermally expandable microspheres and exhibits a tack strength of 5 gf or less according to a specified measurement method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">A1:第一面</p>
        <p type="p">A2:第二面</p>
        <p type="p">C:黏著性樹脂層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1104" publication-number="202631941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著性膜</chinese-title>
        <english-title>ADHESIVE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C09J11/08</main-classification>
        <further-classification edition="200601120260421B">B32B7/12</further-classification>
        <further-classification edition="201801120260421B">C09J7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏著性膜（10），包括基材層（A）及黏著性樹脂層（C），所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的、進行了規定的處理後基於規定的方法2的算術平均粗糙度Ra&lt;sub&gt;2&lt;/sub&gt;相對於進行了規定的處理後基於規定的方法1的算術平均粗糙度Ra&lt;sub&gt;1&lt;/sub&gt;之比（Ra&lt;sub&gt;2&lt;/sub&gt;/Ra&lt;sub&gt;1&lt;/sub&gt;）為0.40以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adhesive film (10) includes a substrate layer (A) and an adhesive resin layer (C), in which the adhesive resin layer (C) contains thermally expandable microspheres, and a ratio (Ra&lt;sub&gt;2&lt;/sub&gt;/Ra&lt;sub&gt;1&lt;/sub&gt;) of an arithmetic average roughness Ra&lt;sub&gt;2&lt;/sub&gt;, measured by a predetermined method 2 after a specified treatment, to an arithmetic average roughness Ra&lt;sub&gt;1&lt;/sub&gt;, measured by a predetermined method 1 after a specified treatment, is 0.40 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">A1:第一面</p>
        <p type="p">A2:第二面</p>
        <p type="p">C:黏著性樹脂層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1105" publication-number="202632950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像編碼裝置、影像解碼裝置、影像編碼方法及影像解碼方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260422B">H04N19/132</main-classification>
        <further-classification edition="201401120260422B">H04N19/70</further-classification>
        <further-classification edition="201401120260422B">H04N19/172</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蝶野慶一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONO, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森吉達治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYOSHI, TATSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;即便在利用時間取樣/時間重取樣的情況下，亦能就影像解碼裝置的處理時序，確保與影像編碼裝置的相互連接性。  &lt;br/&gt;[解決手段]  &lt;br/&gt;影像編碼裝置，包括：間減單元，其對影像中的圖片進行間減；編碼單元，其對圖片被間減後之影像訊號進行編碼；以及輔助資訊產生單元，其產生用以導出最大延遲圖片數之輔助資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像編碼裝置</p>
        <p type="p">11:間減單元</p>
        <p type="p">12:編碼單元</p>
        <p type="p">13:輔助資訊產生單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1106" publication-number="202633007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理基板之基座</chinese-title>
        <english-title>SUSCEPTOR FOR PROCESSING SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H05B6/10</main-classification>
        <further-classification edition="202601120260422B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉野淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURANO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾維蒂　戴夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILVETTI, DAVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希納　戈普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNA, GOPU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相田弘栄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIDA, KOEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">呈現一種具有ESC功能性之基座。為了提供具有金屬材料的加熱器用於熱控制及ESC能力，本揭露之基座包含：一支撐部，其配置以支撐一基板；一加熱線圈，其安置於此支撐部中，此加熱線圈配置以升高支撐件之溫度；一熱電偶（TC），其安置於此支撐部中以用於監測此支撐部之溫度；一軸，其安置於此支撐部下方；一絕緣部，其安置於此軸中；複數個冷卻通道，其安置於此絕緣部中；及絕緣層，其安置於此支撐部及此絕緣部之表面上，其中此支撐部由導電金屬製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A susceptor with ESC functionality is presented. To provide a heater with metal material for thermal control and ESC capabilities, the present disclosure's susceptor comprises a supporting part configured to support a substrate, a heating coil disposed in the supporting part, the heating coil configured to heat up the temperature of the support, a thermocouple (TC) disposed in the supporting part for monitoring temperature of the supporting part, a shaft disposed below the supporting part, an insulation part disposed in the shaft, a plurality of cooling channels disposed in the insulation part; and insulation layers disposed on the surface of the supporting part and the insulating part, wherein the supporting part is made of conducting metals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基座</p>
        <p type="p">110:支撐部</p>
        <p type="p">111:絕緣層</p>
        <p type="p">120:加熱線圈</p>
        <p type="p">121:熱管</p>
        <p type="p">122:加熱電源</p>
        <p type="p">123:閘流體</p>
        <p type="p">124:交流變壓器</p>
        <p type="p">130:冷卻劑通道</p>
        <p type="p">131:冷卻管</p>
        <p type="p">140:熱電偶</p>
        <p type="p">140A:感測器</p>
        <p type="p">141:熱電偶管</p>
        <p type="p">150:軸</p>
        <p type="p">160:絕緣部</p>
        <p type="p">170:夾盤管</p>
        <p type="p">171:夾持電源</p>
        <p type="p">172:電阻器電阻</p>
        <p type="p">173:發電機</p>
        <p type="p">175:電容器電容</p>
        <p type="p">176:地</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1107" publication-number="202631755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬來醯亞胺樹脂混合物、硬化性樹脂組成物及其硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C08F222/40</main-classification>
        <further-classification edition="200601120260421B">C08F290/12</further-classification>
        <further-classification edition="200601120260421B">C08F8/30</further-classification>
        <further-classification edition="200601120260421B">C08F8/46</further-classification>
        <further-classification edition="200601120260421B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本多理沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, RISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川篤彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, ATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関允諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種低介電損耗正切優異、清漆狀態下的保管穩定性優異的馬來醯亞胺樹脂混合物、以及硬化性樹脂組成物及其硬化物。一種馬來醯亞胺樹脂混合物，包含具有下述式（a）、下述式（b）的重複單元的馬來醯亞胺樹脂、以及下述式（c）所表示的馬來醯亞胺樹脂，所述馬來醯亞胺樹脂混合物的酸價為25以下。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="430px" width="418px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（於所述式中，Ra表示氫原子或碳數1～5的烴基；m為重複數的平均值，且1≦m＜200；n為重複數的平均值，且1.1≦n＜100；（a）、（b）分別於*處鍵結，重複位置可為無規）  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="488px" width="203px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1108" publication-number="202631535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層配線基板、多層配線基板的製造方法及多層配線母材基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C03C4/16</main-classification>
        <further-classification edition="200601120260427B">H05K3/12</further-classification>
        <further-classification edition="200601120260427B">H05K1/03</further-classification>
        <further-classification edition="202601120260427B">H10W70/692</further-classification>
        <further-classification edition="200601120260427B">C08K3/36</further-classification>
        <further-classification edition="200601320260427B">B29K501/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種即使在高濕度環境下，也能避免核心基板產生損傷，並確保多層配線基板的可靠性之技術。&lt;br/&gt;  本發明的多層配線基板，具備：&lt;br/&gt;  核心基板，其係玻璃基板，該玻璃基板具有第1面、與前述第1面對向的第2面、以及連接前述第1 面的周緣部及前述第2面的周緣部之側面；&lt;br/&gt;  第1配線層，其係形成於前述第1面上的配線層；以及&lt;br/&gt;  第2配線層，其係形成於前述第2面上的配線層；&lt;br/&gt;  前述側面係被吸水率0.05%以上0.6%以下之低吸水率樹脂所覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1109" publication-number="202632054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監測半導體處理用的前驅物之系統及技法</chinese-title>
        <english-title>SYSTEMS AND TECHNIQUES FOR MONITORING PRECURSORS FOR SEMICONDUCTOR PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C23C16/448</main-classification>
        <further-classification edition="200601120260429B">C23C16/455</further-classification>
        <further-classification edition="200601120260429B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加西亞　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼迪亞　大衛　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDIA, DAVID JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謙德拉瑟哈蘭　拉密許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASEKHARAN, RAMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波達哥卡尼　阿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BODAGHKHANI, ARMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特瑟　瑞秋　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATZER, RACHEL E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯圖姆夫　約翰　福爾登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUMPF, JOHN FOLDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體處理的系統及技法。在一實施方式中，一技法可包含：將在一安瓿之中的前驅物加熱至一蒸氣態；在加熱在該安瓿之中的該前驅物的同時，將一載體氣體流動進入該安瓿達一第一時間週期，且從而加壓該安瓿並產生該前驅物與該載體氣體的混合物；在該流動步驟期間，測量 指示在該安瓿之中的壓力的壓力資料；基於該壓力資料，決定在該第一時間週期的開始時在該安瓿之中的一開始壓力、及在該第一時間週期的結束時在該安瓿之中的一結束壓力，其中該開始壓力係低於該結束壓力；及基於該壓力資料、該開始壓力、及該結束壓力，決定在該第一時間週期的結束時在該混合物之中該前驅物的量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques for semiconductor processing are provided. In one implementation, a technique may include heating a precursor in an ampoule to a vapor state, flowing, while heating the precursor in the ampoule, a carrier gas into the ampoule for a first time period and thereby pressurizing the ampoule and creating a mixture of the precursor and the carrier gas, measuring, during the flowing, pressure data indicative of the pressure in the ampoule, determining, based on the pressure data, a starting pressure in the ampoule at the start of the first time period and an ending pressure in the ampoule at the end of the first time period, in which the starting pressure is lower than the ending pressure, and determining, based on the pressure data, the starting pressure, and the ending pressure, an amount of precursor in the mixture at the end of the first time period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體處理系統(系統)</p>
        <p type="p">102:安瓿</p>
        <p type="p">104:前驅物</p>
        <p type="p">106:頂部空間(填料容積)</p>
        <p type="p">108:入口</p>
        <p type="p">110:出口</p>
        <p type="p">112:載體氣體源</p>
        <p type="p">116:閥</p>
        <p type="p">118:閥</p>
        <p type="p">122:流路</p>
        <p type="p">123:控制器</p>
        <p type="p">124:處理腔室</p>
        <p type="p">126:腔室入口</p>
        <p type="p">128:氣體分配裝置</p>
        <p type="p">130:基板</p>
        <p type="p">132:基板支撐件</p>
        <p type="p">134:第三閥</p>
        <p type="p">136:部分</p>
        <p type="p">138:壓力感測器</p>
        <p type="p">140:壓力感測器</p>
        <p type="p">142:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1110" publication-number="202631942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著性膜</chinese-title>
        <english-title>ADHESIVE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C09J11/08</main-classification>
        <further-classification edition="200601120260421B">B32B7/12</further-classification>
        <further-classification edition="201801120260421B">C09J7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏著性膜（10），包括基材層（A）及黏著性樹脂層（C），所述黏著性樹脂層（C）包含含有熱硬化性樹脂的熱膨脹性微小球。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adhesive film (10) comprises a substrate layer (A) and an adhesive resin layer (C), wherein the adhesive resin layer (C) contains thermally expandable microspheres containing a thermosetting resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">A1:第一面</p>
        <p type="p">A2:第二面</p>
        <p type="p">C:黏著性樹脂層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1111" publication-number="202632299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度調整系統及溫度調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">G01R1/44</main-classification>
        <further-classification edition="202001120260417B">G01R31/26</further-classification>
        <further-classification edition="200601120260417B">F25D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠以大溫度範圍調整對象物的溫度之技術。  &lt;br/&gt;溫度調整系統係會調整接觸到構造體的對象物的溫度。溫度調整系統係具備：液體供應部，係向構造體供應液體冷媒；氣體供應部，係向構造體供應氣體冷媒；以及控制部，係控制液體供應部及氣體供應部。控制部係控制下述工序：當對象物的溫度為第1溫度閾值以上時，藉由液體冷媒及氣體冷媒之供應而混合成霧狀後的液體冷媒的汽化潛熱將構造體冷卻；當對象物的溫度為未達第1溫度閾值且在低於第1溫度閾值的第2溫度閾值以上時，藉由從液體供應部供應的液體冷媒將構造體冷卻；以及當對象物的溫度為未達第2溫度閾值時，藉由從氣體供應部供應的氣體冷媒將構造體冷卻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">45:載置台</p>
        <p type="p">45s:載置面</p>
        <p type="p">47:構造體</p>
        <p type="p">47p:冷媒流道群</p>
        <p type="p">471:壁部</p>
        <p type="p">48:加熱器</p>
        <p type="p">50:溫度調整系統</p>
        <p type="p">51:熱交換室</p>
        <p type="p">52:液體冷媒供應道</p>
        <p type="p">53:液體冷媒分歧道</p>
        <p type="p">54:氣體冷媒供應道</p>
        <p type="p">55:冷媒供應共通道</p>
        <p type="p">56:冷媒排出道</p>
        <p type="p">57:冷媒排出共通道</p>
        <p type="p">60:外部冷媒裝置</p>
        <p type="p">61:液體供應部</p>
        <p type="p">62:液體冷媒路徑</p>
        <p type="p">621:流量控制器</p>
        <p type="p">622:開閉閥</p>
        <p type="p">63:氣體供應部</p>
        <p type="p">64:氣體冷媒路徑</p>
        <p type="p">641:流量控制器</p>
        <p type="p">642:開閉閥</p>
        <p type="p">65:氣液分離器</p>
        <p type="p">651:液體冷媒循環路徑</p>
        <p type="p">652:氣體冷媒循環路徑</p>
        <p type="p">66:冷媒回收路徑</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1112" publication-number="202632736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01J37/32</main-classification>
        <further-classification edition="200601120260420B">H05H1/34</further-classification>
        <further-classification edition="200601120260420B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤野拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWANO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藥師寺秀明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAKUSHIJI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明中揭示之電漿處理裝置包含腔室、電漿產生部、基板支持部、上部組件、氣體供給部、及控制電路。上部組件包含上部電極、絕緣環、及導電環。上部電極具有朝腔室內之電漿處理空間開口之複數個第1氣孔，且配置於基板支持部之上方。絕緣環包圍上部電極。導電環具有複數個第2氣孔，包圍絕緣環，且配置於基板支持部與腔室之側壁之間的空間之上方。氣體供給部構成為將氣體供給至複數個第1氣孔及/或複數個第2氣孔。控制電路控制氣體供給部及電漿產生部，使腔室內由預塗佈氣體產生電漿，藉此形成預塗佈膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">10:腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10b:隔板構件</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10g:閘閥</p>
        <p type="p">10p:通路</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">10L:襯墊</p>
        <p type="p">11:基板支持部</p>
        <p type="p">15r:氣孔形成區域</p>
        <p type="p">18:冷卻單元</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">32b:第2電壓產生部</p>
        <p type="p">32f:過濾器</p>
        <p type="p">114:支持構件</p>
        <p type="p">116:絕緣區域</p>
        <p type="p">118:導電區域</p>
        <p type="p">131:第1氣孔</p>
        <p type="p">132:第2氣孔</p>
        <p type="p">201:第1氣體供給部</p>
        <p type="p">201a:添加氣體供給部</p>
        <p type="p">201m:主氣體供給部</p>
        <p type="p">201s:分流器</p>
        <p type="p">202:第2氣體供給部</p>
        <p type="p">311:氣孔</p>
        <p type="p">312:氣孔</p>
        <p type="p">313:氣孔</p>
        <p type="p">322:氣體擴散室</p>
        <p type="p">341f:流路</p>
        <p type="p">342f:流路</p>
        <p type="p">351:傳熱片</p>
        <p type="p">352:傳熱片</p>
        <p type="p">1110:基台</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">3211:氣體擴散室</p>
        <p type="p">3212:氣體擴散室</p>
        <p type="p">3213:氣體擴散室</p>
        <p type="p">AX:軸線</p>
        <p type="p">ER:邊緣環</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1113" publication-number="202631279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合微粒子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260504B">B22F1/00</main-classification>
        <further-classification edition="202201120260504B">B22F1/05</further-classification>
        <further-classification edition="202201120260504B">B22F1/102</further-classification>
        <further-classification edition="200601120260504B">H01B1/00</further-classification>
        <further-classification edition="200601120260504B">H01B1/22</further-classification>
        <further-classification edition="200601120260504B">H01B5/00</further-classification>
        <further-classification edition="200601120260504B">H01G4/30</further-classification>
        <further-classification edition="200601120260504B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木佑京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, UKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江山誉昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYAMA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中係關於一種複合粒子，其係銅微粒子之表面之一部分經乙烯系聚合物P被覆者，且複合微粒子之一次粒徑為50 nm以上300 nm以下，複合微粒子之碳含量(質量%)相對於複合微粒子之BET比表面積(m&lt;sup&gt;2&lt;/sup&gt;/g)之比(碳含量/BET比表面積)為0.020以上0.060以下。本發明於另一態樣中係關於一種複合微粒子分散體，其包含上述複合微粒子。本發明於另一態樣中係關於一種配線圖案或接合層，其係上述複合微粒子分散體之熱處理物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1114" publication-number="202631870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱硬化性材料、成形品之製造方法及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08L33/04</main-classification>
        <further-classification edition="200601120260422B">C08F220/10</further-classification>
        <further-classification edition="200601120260422B">C08F2/44</further-classification>
        <further-classification edition="200601120260422B">C08K3/36</further-classification>
        <further-classification edition="200601120260422B">C08K7/18</further-classification>
        <further-classification edition="200601120260422B">B29C45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村由依</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小幡寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBATA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>御供田大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOKUDEN, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本早紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, SAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種熱硬化性材料，其包含下述成分(A)～(C)及(E)。(A)具有含有經取代或未經取代之成環碳數6以上之脂環式烴基之基作為酯取代基之單官能或多官能(甲基)丙烯酸酯化合物/(B)(甲基)丙烯酸或具有含有極性基之基作為酯取代基之單官能(甲基)丙烯酸酯化合物/(C)具有除上述成分(A)之酯取代基以外之基作為酯取代基之多官能(甲基)丙烯酸酯化合物/(E)奈米粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1115" publication-number="202631929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面保護膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260420B">C09J7/30</main-classification>
        <further-classification edition="200601120260420B">C09J175/04</further-classification>
        <further-classification edition="200601120260420B">C09J11/06</further-classification>
        <further-classification edition="200601120260420B">B32B7/12</further-classification>
        <further-classification edition="200601120260420B">B32B27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舟木千尋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKI, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠表現出優異之紫外線吸收能力，較佳為進而能夠表現出優異之輕剝離性及優異之低污染性的表面保護膜。又，本發明之課題在於提供一種包含此種表面保護膜之光學構件或電子構件。  &lt;br/&gt;本發明之實施方式之表面保護膜係包含基材及黏著劑層者，該黏著劑層包含胺基甲酸酯系黏著劑，該胺基甲酸酯系黏著劑由胺基甲酸酯系黏著劑組合物形成，該胺基甲酸酯系黏著劑組合物包含基礎聚合物(A)、多官能異氰酸酯化合物(B)、輕剝離劑(C)、及紫外線吸收劑(D)，該基礎聚合物(A)包含胺基甲酸酯預聚物，該胺基甲酸酯系黏著劑組合物中之該紫外線吸收劑(D)之含量相對於該基礎聚合物(A)100重量份為0.50重量份以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">3:剝離襯墊</p>
        <p type="p">10:表面保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1116" publication-number="202631930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面保護膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260420B">C09J7/30</main-classification>
        <further-classification edition="200601120260420B">C09J175/04</further-classification>
        <further-classification edition="200601120260420B">C09J11/06</further-classification>
        <further-classification edition="200601120260420B">B32B7/12</further-classification>
        <further-classification edition="200601120260420B">B32B27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舟木千尋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKI, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種於軟性發光器件等之製造步驟中之作為支持體之基板的去除步驟等中，容易去除將表面保護膜貼合於被黏著體時所產生之皺褶(隆起)，較佳為進而能夠表現出優異之輕剝離性或優異之低污染性的表面保護膜。又，本發明之課題在於提供一種包含此種表面保護膜之光學構件或電子構件。  &lt;br/&gt;本發明之實施方式之表面保護膜係包含基材及黏著劑層者，該黏著劑層包含胺基甲酸酯系黏著劑，該胺基甲酸酯系黏著劑由胺基甲酸酯系黏著劑組合物形成，該胺基甲酸酯系黏著劑組合物包含基礎聚合物(A)、多官能異氰酸酯化合物(B)、及輕剝離劑(C)，該基礎聚合物(A)包含胺基甲酸酯預聚物，該表面保護膜於溫度23℃下放置30分鐘後在剝離速度3000 mm/分鐘下之對玻璃板之高速剪切力為1500 gf/100 mm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">15:表面保護膜(無剝離襯墊)</p>
        <p type="p">20:聚醯亞胺膜</p>
        <p type="p">30:階差(PET膜)</p>
        <p type="p">40:手壓輥</p>
        <p type="p">50:皺褶(隆起)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1117" publication-number="202631956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、處理含金屬膜的方法及製造電子裝置的方法</chinese-title>
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING FILM AND METHOD OF MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K13/06</main-classification>
        <further-classification edition="200601120260504B">C23F1/16</further-classification>
        <further-classification edition="202301120260504B">H10B12/00</further-classification>
        <further-classification edition="202501120260504B">H10D64/01</further-classification>
        <further-classification edition="202601120260504B">H10P50/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜炳俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYUNGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金貞兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNGAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴仁仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, INSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵相元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, SANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成旼哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, MINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁師碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SABYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUM HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種組成物、一種使用該組成物處理一含金屬膜的方法及一種藉由使用該組成物製造一電子裝置的方法，該組成物包括氧化劑、磷酸、有機酸及一蝕刻控制劑且具有2.0或更小之pH，其中該氧化劑包括過氧化氫、一含碘化合物、或其任何組合，且該蝕刻控制劑包括一不含羥基且含氮的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composition including an oxidizing agent, a phosphoric acid, an organic acid, and an etching controller and having pH of 2.0 or less, wherein the oxidizing agent includes hydrogen peroxide, an iodine-containing compound, or any combination thereof, and the etching controller includes a hydroxyl-free and nitrogen-containing compound, a method of treating a metal-containing film using the composition, and a method of manufacturing an electronic device by using the composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基體</p>
        <p type="p">20A:含金屬膜</p>
        <p type="p">21:第一區</p>
        <p type="p">22:第二區</p>
        <p type="p">30:組成物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1118" publication-number="202631179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136998</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療人類嗜T細胞淋巴球病毒相關疾病之組合物及方法</chinese-title>
        <english-title>COMPOSITION AND METHOD OF TREATING HUMAN T CELL LYMPHOTROPIC VIRUS ASSOCIATED DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/21</main-classification>
        <further-classification edition="201701120260504B">A61K47/60</further-classification>
        <further-classification edition="200601120260504B">A61P31/14</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藥華醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHARMAESSENTIA CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　國鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種組合物，其中化合物與習知干擾素相比具有優異的藥物動力學及藥效學。此外，亦揭示一種使用此組合物治療人類T細胞白血病病毒1型(HTLV-1)相關疾病的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a composition of a compound that has superior pharmacokinetics and pharmacodynamics as compared to conventional interferon. In addition, a method to use such composition to treat human T-cell leukemia virus type 1 (HTLV-1) associated diseases are also disclosed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1119" publication-number="202632095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查台及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C30B35/00</main-classification>
        <further-classification edition="200601120260416B">C30B29/06</further-classification>
        <further-classification edition="200601120260416B">B08B11/02</further-classification>
        <further-classification edition="200601120260416B">B08B13/00</further-classification>
        <further-classification edition="200601120260416B">B08B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市坪昂樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHITSUBO, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠減少多晶矽污染的檢查台。檢查台係具有車輪的移動式檢查台，其具備：籃接受部，其載置有在收容有多晶矽的狀態下被用於多晶矽之清洗及乾燥的清洗籃；以及支撐部，其可轉動地支撐籃接受部，並使籃接受部傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查台</p>
        <p type="p">2:籃接受部</p>
        <p type="p">3:支撐部</p>
        <p type="p">4:台車</p>
        <p type="p">5:回收托盤</p>
        <p type="p">6:滑槽</p>
        <p type="p">6A:開口部</p>
        <p type="p">22A:滑槽部</p>
        <p type="p">23:加強肋</p>
        <p type="p">24:第一接受部</p>
        <p type="p">25:第二接受部</p>
        <p type="p">33:第三接受部</p>
        <p type="p">34:轉動軸</p>
        <p type="p">35:角度調節銷</p>
        <p type="p">41:底座</p>
        <p type="p">41A:上表面</p>
        <p type="p">41B:下表面</p>
        <p type="p">42:支柱</p>
        <p type="p">43:車輪</p>
        <p type="p">61:傾斜面</p>
        <p type="p">62:上端部</p>
        <p type="p">63:下端部</p>
        <p type="p">100:清洗籃</p>
        <p type="p">102:底板</p>
        <p type="p">103:斜板</p>
        <p type="p">104:左右側板</p>
        <p type="p">105:前後側板</p>
        <p type="p">106:加強肋</p>
        <p type="p">F:地面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1120" publication-number="202631969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於潤滑劑的添加劑組成物及其使用方法</chinese-title>
        <english-title>ADDITIVE COMPOSITION FOR LUBRICANTS AND METHOD OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C10M133/22</main-classification>
        <further-classification edition="200601120260504B">C10M147/04</further-classification>
        <further-classification edition="200601120260504B">C10M169/04</further-classification>
        <further-classification edition="200601120260504B">C09K11/02</further-classification>
        <further-classification edition="200601120260504B">C09K11/06</further-classification>
        <further-classification edition="200601120260504B">G01M3/38</further-classification>
        <further-classification edition="200601120260504B">G01N21/64</further-classification>
        <further-classification edition="200601120260504B">G01N21/84</further-classification>
        <further-classification edition="200601120260504B">G01N21/88</further-classification>
        <further-classification edition="200601120260504B">G01N21/91</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商世索科專業聚合物義大利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYENSQO SPECIALTY POLYMERS ITALY S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碧　米歇拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEA, MICHELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加瓦利亞　西爾維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARAVAGLIA, SILVIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛普雷斯蒂　艾麗亞娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO PRESTI, ELIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種添加劑組成物，該添加劑組成物包含：(A)至少一種(全)氟聚醚聚合物[PFPE聚合物&lt;sub&gt;添加劑&lt;/sub&gt;]，其包含(全)氟聚醚鏈[PFPE鏈&lt;sub&gt;添加劑&lt;/sub&gt;]，該(全)氟聚醚鏈具有鍵合到該PFPE鏈&lt;sub&gt;添加劑&lt;/sub&gt;的相反側的第一鏈端和第二鏈端，其中：該第一鏈端包含具有式-C(O)NR&lt;sub&gt;a&lt;/sub&gt;R&lt;sub&gt;b&lt;/sub&gt;的基團，其中R&lt;sub&gt;a&lt;/sub&gt;和R&lt;sub&gt;b&lt;/sub&gt;各自獨立地選自：氫、直鏈或支鏈C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;烷基；該第二鏈端包含選自以下的基團：C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;(全)氟烷基、-CF&lt;sub&gt;2&lt;/sub&gt;C(O)CF&lt;sub&gt;3&lt;/sub&gt;和-C(OH)&lt;sub&gt;2&lt;/sub&gt;CF&lt;sub&gt;3&lt;/sub&gt;；-C(O)NR&lt;sub&gt;a&lt;/sub&gt;R&lt;sub&gt;b&lt;/sub&gt;，其中R&lt;sub&gt;a&lt;/sub&gt;和R&lt;sub&gt;b&lt;/sub&gt;各自獨立地選自：氫、直鏈或支鏈C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;烷基；-C(O)OR&lt;sub&gt;c&lt;/sub&gt;，其中R&lt;sub&gt;c&lt;/sub&gt;係直鏈或支鏈C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;烷基；(B)基於組分(A)的重量0.01-25.0 wt.%的具有式(I)的螢光染料(例如玫瑰紅染料)。本發明還關於該添加劑組成物與氫化或氟化潤滑劑混合的用途。該添加劑組成物能夠賦予該潤滑劑防鏽特性和螢光特性兩者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an additive composition comprising: (A) at least one (per)fluoropolyether polymer [PFPE polymer&lt;sub&gt;add&lt;/sub&gt;] comprising a (per)fluoropolyether chain [PFPE chain&lt;sub&gt;add&lt;/sub&gt;] having a first chain end and a second chain end bonded to opposite sides of said PFPE chain&lt;sub&gt;add&lt;/sub&gt;, wherein: the first chain end comprises a group of formula –C(O)NR&lt;sub&gt;a&lt;/sub&gt;R&lt;sub&gt;b&lt;/sub&gt;, wherein R&lt;sub&gt;a&lt;/sub&gt; and R&lt;sub&gt;b&lt;/sub&gt;, each independently, are selected from: hydrogen, linear or branched C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; alkyl group; the second chain end comprises a group selected from: C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; (per)fluoroalkyl group, -CF&lt;sub&gt;2&lt;/sub&gt;C(O)CF&lt;sub&gt;3&lt;/sub&gt; and -C(OH)&lt;sub&gt;2&lt;/sub&gt;CF&lt;sub&gt;3&lt;/sub&gt;; -C(O)NR&lt;sub&gt;a&lt;/sub&gt;R&lt;sub&gt;b&lt;/sub&gt;, wherein R&lt;sub&gt;a&lt;/sub&gt; and R&lt;sub&gt;b&lt;/sub&gt;, each independently, are selected from: hydrogen, linear or branched C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; alkyl group; -C(O)OR&lt;sub&gt;c&lt;/sub&gt;, wherein R&lt;sub&gt;c&lt;/sub&gt; is a linear or branched C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; alkyl group; (B) 0.01 – 25.0 wt.%, based on the weight of component (A), of a fluorescent dye of formula (I) (e.g. a rhodamine dye). The present invention also relates to the use of the additive composition in admixture with hydrogenated or fluorinated lubricants. The additive composition is capable of imparting the lubricant with both anti-rust and fluorescence properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1121" publication-number="202631398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含填料膜及其製造方法以及連接構造體及其製造方法</chinese-title>
        <english-title>FILLER CONTAINING FILM, METHOD FOR PRODUCING FILLER CONTAINING FILM, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/20</main-classification>
        <further-classification edition="200601120260504B">B32B3/30</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C09J11/00</further-classification>
        <further-classification edition="200601120260504B">C09J201/00</further-classification>
        <further-classification edition="201801120260504B">C09J7/29</further-classification>
        <further-classification edition="200601120260504B">C09J9/02</further-classification>
        <further-classification edition="200601120260504B">H01B1/22</further-classification>
        <further-classification edition="200601120260504B">H01B5/16</further-classification>
        <further-classification edition="200601120260504B">H01R11/01</further-classification>
        <further-classification edition="200601120260504B">H01R43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部一夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KAZUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白岩俊紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAIWA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾怜司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAO, REIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤勇磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明可提供一種窄幅之含填料膜，使得於將導電膜或各向異性導電膜等含填料膜單片化時，無需進行利用刀刃之沖裁加工、半切加工、或者雷射加工便能夠實現單片化，又，於將含填料膜製成窄幅之捲盤製品時，於膜寬度、膜厚度或膜組成方面，含填料膜之設計自由度不受較大限制。  &lt;br/&gt;[解決手段]具有填料保持用絕緣性樹脂層及填料之含填料膜於填料保持用絕緣性樹脂層之單面具有凹部與凸部。於上述凸部，配置有至少一個由複數個填料構成之填料群，膜短邊方向上之上述凸部之寬度未達填料保持用絕緣性樹脂層寬度，較佳為其寬度之95%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:填料保持用絕緣性樹脂層</p>
        <p type="p">2:填料、導電粒子</p>
        <p type="p">3:凹部</p>
        <p type="p">4:凸部</p>
        <p type="p">10:含填料膜</p>
        <p type="p">20:填料群</p>
        <p type="p">40:連接區域</p>
        <p type="p">t&lt;sub&gt;0&lt;/sub&gt;:凸部之高度</p>
        <p type="p">t&lt;sub&gt;1&lt;/sub&gt;:凹部之深度</p>
        <p type="p">W&lt;sub&gt;3&lt;/sub&gt;:凸部之膜短邊方向之寬度</p>
        <p type="p">W&lt;sub&gt;10&lt;/sub&gt;:凹部之膜短邊方向之寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1122" publication-number="202633019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粒子加速器系統及運作方法</chinese-title>
        <english-title>PARTICLE ACCELERATOR SYSTEM AND METHOD OF OPERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H05H5/00</main-classification>
        <further-classification edition="200601120260309B">H05H5/02</further-classification>
        <further-classification edition="200601120260309B">H05H5/08</further-classification>
        <further-classification edition="200601120260309B">H05H7/00</further-classification>
        <further-classification edition="200601120260309B">H05H7/04</further-classification>
        <further-classification edition="200601120260309B">H05H7/08</further-classification>
        <further-classification edition="200601120260309B">H05H7/10</further-classification>
        <further-classification edition="200601120260309B">H05H13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾格萊特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XLIGHT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古利佛　科爾溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GULLIFORD, COLWYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道格拉斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOUGLAS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種粒子加速器系統，其較佳包含注入束線、返回束線及經合併束線，並可選地包含射束分離器。粒子加速器系統較佳包含複數個電子光學元件，諸如偶極子磁體、四極子磁體、螺線管元件及/或更高階磁性元件，其可以作用來沿著該等束線引導電子（及/或其他帶電粒子）。一種運作方法，其較佳包含注入電子、合併束線、加速所注入電子及/或使用經加速電子，並可選地包含接收返回電子、棄置使用過電子及/或使經加速電子返回。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A particle accelerator system, preferably including an injection beamline, a return beamline, and a merged beamline, and optionally including a beam separator. The particle accelerator system preferably includes a plurality of electron optics elements, such as dipole magnets, quadrupole magnets, solenoid elements, and/or higher-order magnetic elements, which can function to direct electrons (and/or other charged particles) along the beamlines. A method of operation, preferably including injecting electrons, merging beamlines, accelerating the injected electrons, and/or using the accelerated electrons, and optionally including receiving return electrons, dumping used electrons, and/or returning the accelerated electrons.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:粒子加速器系統</p>
        <p type="p">100:注入束線</p>
        <p type="p">111’:雙彎消色差透鏡</p>
        <p type="p">111a:入射偶極子</p>
        <p type="p">111b:出射偶極子</p>
        <p type="p">200:返回束線</p>
        <p type="p">210’:曲折道</p>
        <p type="p">300:經合併束線</p>
        <p type="p">310:合併元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1123" publication-number="202632108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾衣機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">D06F58/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下電器產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商松下家電（中國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC APPLIANCES (CHINA) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州松下家用電器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC APPLIANCES WASHING MACHINE (HANGZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上洋一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, YOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀨川正尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGAWA, MASANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺井謙治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之乾衣機具備：殼體，在前表面形成有開口；蓋，覆蓋殼體的開口；容置槽，在殼體的內部中，設置成可繞著往軸方向延伸的旋轉軸旋轉，且具有與開口相向的底部；乾燥風路，在吸入口與吹出口之間延伸，前述吸入口是從前側與容置槽連通，前述吹出口是從後側與容置槽連通；及風扇，配置於乾燥風路，乾燥風路的一部分是以第1壁部、第2壁部及第3壁部所界定，前述第1壁部界定出吹出口，前述第2壁部位於第1壁部的後側，且在與第1壁部之間形成乾燥風路的一部分，前述第3壁部在第2壁部與風扇的流出口之間延伸，從軸方向觀看時，第2壁部比第3壁部更朝向旋轉軸突出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:乾燥風路</p>
        <p type="p">8:風扇</p>
        <p type="p">21:支撐板</p>
        <p type="p">23,65,66,67:壁部</p>
        <p type="p">24:第1部分</p>
        <p type="p">24A,25A:端部</p>
        <p type="p">25:第2部分</p>
        <p type="p">44:通風孔</p>
        <p type="p">62:吹出口</p>
        <p type="p">63:風扇殼體</p>
        <p type="p">64:風扇容置部</p>
        <p type="p">65A:面</p>
        <p type="p">81:流出口</p>
        <p type="p">K:寬度方向</p>
        <p type="p">K1:其中一側</p>
        <p type="p">K2:另一側</p>
        <p type="p">V0:旋轉軸</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1124" publication-number="202632000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向BCMA之嵌合抗原受體</chinese-title>
        <english-title>CHIMERIC ANTIGEN RECEPTORS TARGETING BCMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N15/88</main-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C07K14/705</further-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61K31/7105</further-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="202501120260504B">A61K9/127</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="202501120260504B">A61K40/11</further-classification>
        <further-classification edition="202501120260504B">A61K40/31</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商歐納醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORNA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷納嘉德醫療管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENAGADE THERAPEUTICS MANAGEMENT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬布里　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MABRY, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達爾基利奇　利德爾　伊辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALKILIC-LIDDLE, ISIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>度塔　西蒙斯　茱尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUTTA-SIMMONS, JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾弗　麗貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILVER, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈亞拉曼　穆圖薩米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAYARAMAN, MUTHUSAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑卡蘭　加納帕迪　薩布拉曼尼亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKARAN, GANAPATHY SUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科薩科夫斯卡　卡羅琳娜　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKOWSKA, KAROLINA ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供編碼包含B細胞成熟抗原(BCMA)結合分子之嵌合抗原受體(CAR)之RNA序列，以及相關組合物及方法。在一些實施例中，本文描述編碼該BCMA結合分子或BCMA CAR之環狀RNA，以及相關組合物、方法及前驅物。在一些實施例中，此等組合物包含轉移媒劑，例如包含本文所描述之可電離脂質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are RNA sequences encoding a chimeric antigen receptor (CAR) comprising a B-cell maturation antigen (BCMA) binding molecule, along with related compositions and methods. In some embodiments, circular RNAs encoding the BCMA binding molecule or BCMA CAR, along with related compositions, methods, and precursors, are described herein. In some embodiments, these compositions comprise a transfer vehicle, e.g., comprising an ionizable lipid described herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1125" publication-number="202631315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工裝置及支撐台</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B24B49/10</main-classification>
        <further-classification edition="200601120260428B">B24B49/16</further-classification>
        <further-classification edition="201201120260428B">B24B41/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片山翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAYAMA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為解決以往加工裝置中測定加工負荷之課題。  &lt;br/&gt;本發明之解決手段為一種加工裝置，係使工具接觸旋轉的工件並加工前述工件，其具備可旋轉地支撐前述工件之支撐台，前述支撐台於支撐面上支撐前述工件，且具備測定施加於前述支撐面的力之至少1個感應器單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制器</p>
        <p type="p">2:搬送部</p>
        <p type="p">3:測定部</p>
        <p type="p">4:測定台</p>
        <p type="p">5:測定器</p>
        <p type="p">6:收納部</p>
        <p type="p">7:加工部</p>
        <p type="p">8:研削台</p>
        <p type="p">9:研削磨石</p>
        <p type="p">10:加工裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1126" publication-number="202633179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓性混合奈米片標準單元架構</chinese-title>
        <english-title>FLEXIBLE HYBRID NANOSHEET STANDARD CELL ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10D84/85</main-classification>
        <further-classification edition="202601120260422B">H10D84/01</further-classification>
        <further-classification edition="202501120260422B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾普特金　埃姆雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPTEKIN, EMRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示與形成在一基材上的奈米片電晶體的使用有關的各種實施方案。一種奈米片電晶體包括具有一寬度的一主動區域，該寬度界定該電晶體的一主動裝置寬度。揭示實施毗連一行可撓性高度單元的一行模板單元的混合單元結構。可將可撓性高度單元放置在一設計邏輯中的指定位置，以在該等指定位置提供效能改善或功率最佳化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various implementations related to the use of nanosheet transistors formed on a substrate are disclosed. A nanosheet transistor includes an active region with a width that defines an active device width for the transistor. Hybrid cell structures are disclosed that implement a column of template cells abutting a column of flexible height cells. Flexible height cells may be placed at specified locations in a design logic to provide improved performance or power optimization at the specified locations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:裝置</p>
        <p type="p">1402A:行</p>
        <p type="p">1402B:行</p>
        <p type="p">1404A:列</p>
        <p type="p">1404B:列</p>
        <p type="p">1410A:模板單元</p>
        <p type="p">1410B:模板單元</p>
        <p type="p">1415A:主動區域</p>
        <p type="p">1415B:主動區域</p>
        <p type="p">1415C:主動區域</p>
        <p type="p">1415D:主動區域</p>
        <p type="p">1420A:可撓性單元</p>
        <p type="p">1420B:可撓性單元</p>
        <p type="p">1425A:主動區域</p>
        <p type="p">1425B:主動區域</p>
        <p type="p">1425C:主動區域</p>
        <p type="p">1425D:主動區域</p>
        <p type="p">1440A:單元高度</p>
        <p type="p">1440B:單元高度</p>
        <p type="p">1440C:單元高度</p>
        <p type="p">1450A:虛置閘極結構</p>
        <p type="p">1450B:虛置閘極結構</p>
        <p type="p">1460A:階差</p>
        <p type="p">1460B:階差</p>
        <p type="p">1460C:階差</p>
        <p type="p">1460D:階差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1127" publication-number="202632567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支付方法、裝置、設備及電腦可讀存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251103B">G06Q20/32</main-classification>
        <further-classification edition="201201120251103B">G06Q20/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何朔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅宜生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郜書鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃夢達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>才華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錦佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種支付方法、裝置、設備及電腦可讀存儲介質。其中，該方法包括：掃描商戶用於接收資源的圖形碼，圖形碼是基於類型-長度-值（Type-Length-Value，TLV）格式對商戶的資源接收資訊進行編碼得到，圖形碼包括基礎字段和擴展字段；基礎字段的字段資料包括商戶的第一資源接收資訊和跨境網路標識，擴展字段的字段資料為資源訪問位址資訊；根據電子錢包的交易模式，確定目標字段，目標字段為基礎字段和擴展字段中的任意一個；基於TLV格式解析圖形碼，得到資源接收資訊，資源接收資訊包括基礎字段的字段資料和擴展字段的字段資料；基於目標字段的字段資料，執行支付操作。根據本發明實施例，能夠既相容境外電子錢包在國內的掃碼支付，又盡可能減少對國內現有掃碼支付方式的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1128" publication-number="202632288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試裝置</chinese-title>
        <english-title>TEST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G01R1/04</main-classification>
        <further-classification edition="200601120260424B">G01R1/073</further-classification>
        <further-classification edition="200601120260424B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宰歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種測試裝置，用於測試測試物件的電氣特性。測試裝置包括：插座體，包括上部塊和下部塊，上部塊和下部塊排列成使得探針容置部可形成為垂直地延伸；探針，包括管狀的筒，容置於探針容置部中且包括沿著外圓周突出的凸緣部，以定位在下部塊的探針容置部內；以及探針引導單元，介於上部塊和下部塊之間以引導探針上下移動，包括引導孔，引導孔具有大於筒的外徑且比小於凸緣部的外徑的內徑，以限制凸緣部在下部塊的探針容置部內的可移動範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a test device for testing electrical characteristics of a test object. The test device includes: a socket body including an upper block and a lower block arranged so that a probe accommodating portion can be formed extending vertically; a probe including a tubular barrel that is accommodated in the probe accommodating portion and includes a flange portion protruding along an outer circumference so as to be positioned within the probe accommodating portion of the lower block; and a probe guide unit interposed between the upper block and the lower block to guide the probe to move up and down, including a guide hole having an inner diameter larger than an outer diameter of the barrel and smaller than an outer diameter of the flange portion to limit a movable range of the flange portion within the probe accommodating portion of the lower block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:探針、信號探針</p>
        <p type="p">6:探針、接地探針</p>
        <p type="p">12:插座體</p>
        <p type="p">12A:上部塊</p>
        <p type="p">12B:下部塊</p>
        <p type="p">14A:探針支撐部、上探針支撐部</p>
        <p type="p">14B:探針支撐部、下探針支撐部</p>
        <p type="p">15:探針引導單元</p>
        <p type="p">16A:壓膜、上壓膜</p>
        <p type="p">16B:壓膜、下壓膜</p>
        <p type="p">51,61:筒</p>
        <p type="p">53:柱塞</p>
        <p type="p">51A,61A:凸緣部</p>
        <p type="p">121A,121B:信號探針容置部</p>
        <p type="p">122A,122B:接地探針容置部</p>
        <p type="p">123A,123B:接地柱</p>
        <p type="p">123C,141B,161B:柱塞通孔</p>
        <p type="p">124:接地連接部</p>
        <p type="p">141A,161A:信號探針通孔</p>
        <p type="p">143A,143B,163A,163B:柱通孔</p>
        <p type="p">151:引導孔</p>
        <p type="p">153:接地連接部通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1129" publication-number="202632919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖電力傳輸</chinese-title>
        <english-title>POWER TRANSMISSION OVER OPTICAL FIBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260422B">H04B10/80</main-classification>
        <further-classification edition="201301120260422B">H04B10/69</further-classification>
        <further-classification edition="201601120260422B">H02J50/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯坎德爾　安東尼奧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISKANDER, ANTONIOUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯坎德爾　安東尼奧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISKANDER, ANTONIOUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用光纖傳輸電力涉及透過光纖纜線發送光子，在接收端激發電子，當電子回到較低能態時便會產生電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Transmission of electricity using fiber optics involves sending photons over the fiber optic cable where they excite electrons at a receiving end, which generate electricity when the electrons move back to a lower state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光子產生器</p>
        <p type="p">1a:傳遞</p>
        <p type="p">2:第一端</p>
        <p type="p">3:光纖纜線</p>
        <p type="p">4:第二端</p>
        <p type="p">4a:傳遞</p>
        <p type="p">5:接收端點</p>
        <p type="p">6:電子源；電力</p>
        <p type="p">7:儲能裝置</p>
        <p type="p">8:傳輸</p>
        <p type="p">10:電氣裝置</p>
        <p type="p">11:數據</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1130" publication-number="202633395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遮罩修改方法</chinese-title>
        <english-title>MASK MODIFICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10P76/00</main-classification>
        <further-classification edition="201201120260429B">G03F1/72</further-classification>
        <further-classification edition="200601120260429B">C23C14/04</further-classification>
        <further-classification edition="200601120260429B">C23C14/54</further-classification>
        <further-classification edition="202601120260429B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴玟俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MINJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理方法，包含接收該基板於基板持具上，該基板包含設置在圖案化下方層上方的圖案化遮罩，該圖案化遮罩包含複數凹口。該方法更包含設定複數極角及複數處理時間，該複數極角的每一者係具有該複數處理時間中的相關一者，並且針對該複數極角的每一者，利用循環處理對該基板進行處理。該循環處理中的各循環係包含從該複數極角中選擇一極角（θ&lt;sub&gt;i&lt;/sub&gt;）。各循環更包含將處理工具傾斜，使得從該處理工具發射的束以所選擇的該極角（θ&lt;sub&gt;i&lt;/sub&gt;）撞擊該基板，並且在所選擇的該極角（θ&lt;sub&gt;i&lt;/sub&gt;）下發射該束，且持續與所選擇之該極角（θ&lt;sub&gt;i&lt;/sub&gt;）對應的第i個時間框架（t&lt;sub&gt;i&lt;/sub&gt;），以在該些凹口上方沉積第i層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes receiving the substrate on a substrate holder, the substrate including a patterned mask disposed over a patterned underlying layer, the patterned mask including notches. The method further includes having a plurality of polar angles and a plurality of processing times, each of the plurality of polar angles having an associated one of the plurality of processing times, and processing the substrate with a cyclic process for each of the plurality of polar angles. Each cycle of the cyclic process includes selecting a polar angle (θ&lt;sub&gt;i&lt;/sub&gt;) from the plurality of polar angles. Each cycle further includes tilting a processing tool such that a beam emitted from the processing tool strikes the substrate at the selected polar angle (θ&lt;sub&gt;i&lt;/sub&gt;), and emitting the beam at the selected polar angle (θ&lt;sub&gt;i&lt;/sub&gt;) for an i&lt;sup&gt;th&lt;/sup&gt; timeframe (t&lt;sub&gt;i&lt;/sub&gt;) corresponding to the selected polar angle (θ&lt;sub&gt;i&lt;/sub&gt;) to deposit an i&lt;sup&gt;th&lt;/sup&gt; layer over the notches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">102:下方層</p>
        <p type="p">104:目標層</p>
        <p type="p">106:遮罩層</p>
        <p type="p">107:先前形狀</p>
        <p type="p">108:具凹口遮罩</p>
        <p type="p">110:開口</p>
        <p type="p">120:具凹口開口</p>
        <p type="p">125:經修改的具凹口開口</p>
        <p type="p">130:第一流</p>
        <p type="p">140:第二流</p>
        <p type="p">150:第三流</p>
        <p type="p">160:第四流</p>
        <p type="p">170:第一修復層</p>
        <p type="p">171:第一沉積層</p>
        <p type="p">172:第二沉積層</p>
        <p type="p">173:第三沉積層</p>
        <p type="p">174:第四沉積層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1131" publication-number="202633409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制晶圓溫度的方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR CONTROLLING THE TEMPERATURE OF A WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P95/00</main-classification>
        <further-classification edition="202601120260424B">H10P74/00</further-classification>
        <further-classification edition="200601120260424B">G01K3/00</further-classification>
        <further-classification edition="200601120260424B">G01K3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利斯　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYLISS, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制晶圓之溫度的方法，包含：在第一時間偵測與該晶圓之該溫度相關的資訊；在較後的第二時間偵測與該晶圓之該溫度相關的資訊；以及基於將在該第一時間所偵測的與該晶圓之該溫度相關的該資訊與在該第二時間所偵測的與該晶圓之該溫度相關的該資訊進行比較，控制該晶圓的冷卻或加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method of controlling the temperature of a wafer, comprising: detecting information relating to the temperature of the wafer at a first time; detecting information relating to the temperature of the wafer at a later second time; and controlling cooling or heating of the wafer based on a comparison of the detected information relating to the temperature of the wafer at the first time and the detected information relating to the temperature of the wafer at the second time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體晶圓質量量測裝置</p>
        <p type="p">3:稱重天平</p>
        <p type="p">5:稱重盤</p>
        <p type="p">7:測量腔室</p>
        <p type="p">9:被動傳熱板</p>
        <p type="p">11:主動傳熱板</p>
        <p type="p">13:IR溫度感測器</p>
        <p type="p">15:控制器</p>
        <p type="p">17:Peltier裝置</p>
        <p type="p">19:散熱件</p>
        <p type="p">21:氣流</p>
        <p type="p">23:區域</p>
        <p type="p">W:半導體晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1132" publication-number="202631626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備稠合五環咪唑和中間體之方法</chinese-title>
        <english-title>PROCESSES FOR THE PREPARATION OF FUSED PENTACYCLIC IMIDAZOLES AND INTERMEDIATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/18</main-classification>
        <further-classification edition="200601120260504B">C07D239/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商賽諾菲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾特蘭　拉斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELTRAN, RAPHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狄拉德巴特　艾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LADEBAT, ERWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋伊　德　聖　米歇爾　麥利亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAY-DE-SAINT-MICHEL, MYRIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利維廉　吉庸姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVILAIN, GUILLAUME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里德　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REED, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了將式(I)的化合物轉化為式(IV)的化合物之方法。還提供了製備該式(I)的化合物之方法、轉化該式(IV)的化合物之方法、以及相關的中間體化合物和結晶形式。  &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="442px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein are provided processes of converting a compound of Formula (I)into a compound of Formula (IV). Also provided are processes of preparing the compound of Formula (I), processes of converting the compound of Formula (IV), together with associated intermediate compounds and crystalline forms. &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="426px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1133" publication-number="202632737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配置以提供相同夾持力的靜電卡盤</chinese-title>
        <english-title>ELECTROSTATIC CHUCK CONFIGURED TO PROVIDE CONSISTENT CLAMPING FORCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H01J37/32</main-classification>
        <further-classification edition="202601120260428B">H10P72/70</further-classification>
        <further-classification edition="202601120260428B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙烏拉布　阿希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAURABH, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示關於靜電卡盤(ESC)的示例，其以在基板表面上提供相同徑向夾持力之方式夾持基板。在一示例中，ESC包括一面向基板表面，其包含複數接觸特徵部。接觸特徵部配置成支撐基板。該接觸特徵部之至少一些接觸特徵部的接觸區域尺寸至少基於接觸特徵部在面向基板表面上的位置而變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples relating to an electrostatic chuck (ESC) for clamping a substrate in a manner that provides consistent radial clamping force across the surface of the substrate are disclosed. In one example, an ESC comprises a substrate-facing surface comprising a plurality of contact features. The contact features are configured to support the substrate. Contact area sizes of at least some contact features of the plurality of contact features vary based at least on locations of the contact features on the substrate-facing surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:靜電卡盤(ESC)</p>
        <p type="p">202:接觸特徵部</p>
        <p type="p">204:面向基板表面</p>
        <p type="p">206:中心區域</p>
        <p type="p">208:中間區域</p>
        <p type="p">210:外部區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1134" publication-number="202631646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於免疫球蛋白或其抗原結合性片段的端帽去除之還原劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K1/02</main-classification>
        <further-classification edition="200601120260504B">C07F9/50</further-classification>
        <further-classification edition="200601120260504B">C07K16/30</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城野柳人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINO, RYUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡野文義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKANO, FUMIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">以複數個水溶性官能基與以下之化學式所表示的三芳膦系化合物結合而成的化合物作為有效成分之還原劑，係可利用來作為用以選擇性地去除免疫球蛋白或其抗原結合性片段之輕鏈可變區中依Kabat編號為第80號胺基酸的半胱胺酸殘基之端帽的還原劑，&lt;br/&gt;&lt;img align="absmiddle" height="127px" width="162px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  (R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;各別獨立地為芳基或雜芳基)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1135" publication-number="202632090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經組態以用於執行電漿增強化學氣相沉積製程之半導體處理系統及將磊晶層沉積於基板上之方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING SYSTEMS CONFIGURED FOR PERFORMING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES AND METHODS FOR DEPOSITING EPITAXIAL LAYER ON SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C30B25/02</main-classification>
        <further-classification edition="200601120260422B">C30B25/14</further-classification>
        <further-classification edition="200601120260422B">C23C16/50</further-classification>
        <further-classification edition="202601120260422B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬哈德文　克里希那斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHADEVAN, KRISHNASWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　基肖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於藉由一電漿增強化學氣相沉積將一磊晶層沉積於一基板上之半導體處理系統。該半導體處理系統包括一腔室本體、配置於腔室內部內之一基板支撐件，及經組態以用於在該腔室內部內產生一反應性物種之一電漿產生構件。亦揭露了用於藉由一電漿增強化學氣相沉積製程將一磊晶層沉積於一基板上之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor processing systems for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition are disclosed. The semiconductor processing system includes a chamber body, a substrate support arranged within the chamber interior, and a plasma generation means configured for generating a reactive species within the chamber interior. Methods for depositing an epitaxial layer on a substrate by a plasma enhanced chemical vapor deposition process are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體處理系統</p>
        <p type="p">102:腔室配置</p>
        <p type="p">104:氣體源總成</p>
        <p type="p">106:氣體分佈總成</p>
        <p type="p">108:排氣總成</p>
        <p type="p">110:控制器</p>
        <p type="p">112:電漿功率/控制系統</p>
        <p type="p">114:電漿產生構件</p>
        <p type="p">116:電漿產生構件</p>
        <p type="p">118:製程氣體供應管線</p>
        <p type="p">120:前驅物源</p>
        <p type="p">122:腔室內部</p>
        <p type="p">124:製程氣體流</p>
        <p type="p">126:注入凸緣</p>
        <p type="p">128:注入埠</p>
        <p type="p">130:摻雜劑源</p>
        <p type="p">132:蝕刻劑源</p>
        <p type="p">134:載體源</p>
        <p type="p">136:腔室本體</p>
        <p type="p">138:基板支撐件</p>
        <p type="p">140:上部加熱器元件陣列</p>
        <p type="p">142:下部加熱器元件陣列</p>
        <p type="p">144:磊晶層</p>
        <p type="p">146:基板</p>
        <p type="p">148:上壁</p>
        <p type="p">150:下壁</p>
        <p type="p">152:注入端</p>
        <p type="p">154:縱向相對之排放端</p>
        <p type="p">156:縱向軸線</p>
        <p type="p">158:外部肋狀物</p>
        <p type="p">160:腔室外部</p>
        <p type="p">162:正面</p>
        <p type="p">164:基板通道</p>
        <p type="p">166:軸桿構件</p>
        <p type="p">168:真空泵</p>
        <p type="p">170:減量系統</p>
        <p type="p">A-A:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1136" publication-number="202633410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置及接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P95/00</main-classification>
        <further-classification edition="202601120260421B">H10P72/70</further-classification>
        <further-classification edition="202601120260421B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田浩範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種接合裝置及接合方法，提供可提高基板的接合精度之技術。本發明的一態樣之接合裝置，具備第1固持部、第2固持部、第1變形部、及第2變形部。第1固持部，將第1基板從上方吸附固持。第2固持部，將第2基板從下方吸附固持。第1變形部，使固持在第1固持部之第1基板的中央部向下方突出。第2變形部，使固持在第2固持部之第2基板變形。此外，第2變形部，具有固定構件、及複數致動器。固定構件，固定第2固持部的中央部之位置。複數致動器，使第2固持部的周緣部往厚度方向變形。&lt;u&gt;  &lt;/u&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">203:第2吸盤部</p>
        <p type="p">210:基台部</p>
        <p type="p">220:第2固持部</p>
        <p type="p">220a:抽吸孔</p>
        <p type="p">221:本體部</p>
        <p type="p">221a:第1部位</p>
        <p type="p">222:托架</p>
        <p type="p">240:第2變形部</p>
        <p type="p">241:固定構件</p>
        <p type="p">242:致動器</p>
        <p type="p">243:測距感測器(第1感測器之一例)</p>
        <p type="p">244:環構件</p>
        <p type="p">W2:第2基板</p>
        <p type="p">L:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1137" publication-number="202631586">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胺基酸衍生物之去保護的方法</chinese-title>
        <english-title>PROCESS FOR DEPROTECTION OF AMINOACID DERIVATIVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D209/20</main-classification>
        <further-classification edition="200601120260504B">C07K5/08</further-classification>
        <further-classification edition="200601120260504B">C07K1/107</further-classification>
        <further-classification edition="200601120260504B">A61K38/12</further-classification>
        <further-classification edition="200601120260504B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬康尼　葛托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCONI, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾米薩諾　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALMISANO, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種製造式 (I) 化合物   &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="244px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其鹽之新穎方法。  &lt;br/&gt;***</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a novel process for manufacturing a compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="268px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  &lt;br/&gt;or a salt thereof. &lt;br/&gt;***</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1138" publication-number="202631962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶介質</chinese-title>
        <english-title>LIQUID-CRYSTALLINE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K19/34</main-classification>
        <further-classification edition="200601120260504B">C09K19/44</further-classification>
        <further-classification edition="200601120260504B">C09K19/12</further-classification>
        <further-classification edition="200601120260504B">C07D333/78</further-classification>
        <further-classification edition="200601120260504B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　史分　克里斯丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUT, SVEN CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李熙規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEE-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於液晶(LC)介質或LC材料及含有該等介質之節能液晶顯示器(LCD)，尤其係關於藉由主動矩陣定址之遊戲顯示器及AR/VR耳機及特定而言係關於TN、PS-TN、STN、TN-TFT、OCB、IPS、PS-IPS、FFS、HB-FFS、XB-FFS、PS-FFS、SA-HB-FFS、SA-XB-FFS、聚合物穩定性SA-HB-FFS、聚合物穩定性SA-XB-FFS、正VA或正PS-VA類型之LC顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to liquid-crystalline (LC) media or LC materials and to energy saving liquid-crystal displays (LCDs) containing these media, especially to gaming displays and AR/VR headsets addressed by an active matrix and in particular to LC displays of the TN, PS-TN, STN, TN-TFT, OCB, IPS, PS-IPS, FFS, HB-FFS, XB-FFS, PS-FFS, SA-HB-FFS, SA-XB-FFS, polymer stabilised SA-HB-FFS, polymer stabilised SA-XB-FFS, positive VA or positive PS-VA type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1139" publication-number="202631674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合物及其用途</chinese-title>
        <english-title>CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07D491/22</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商解方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭努蒂　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNUTTI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特金斯　傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, JEFF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑森　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, KATTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供式(X)之藥物-連接體，  &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="308px" file="ed10895.JPG" alt="ed10895.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥上可接受之鹽，其中式(X)之變量如申請案中所定義。該等化合物可用作抗癌劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a Drug-Linker of Formula (X): &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="351px" file="ed10896.JPG" alt="ed10896.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein the variables of Formula (X) are as defined in the application. Such compounds can be useful as anti-cancer agents.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1140" publication-number="202632846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁通產生構件以及致動器</chinese-title>
        <english-title>MAGNETIC FLUX GENERATING COMPONENT AND ACTUATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260422B">H02K1/27</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原良元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, RYOGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>眞保信之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMBO, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁通產生構件包括配置在同一平面上的第一磁性部以及第二磁性部，前述第一磁性部與前述第二磁性部的磁化方向彼此對向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic flux generating component comprises a first magnetic portion and a second magnetic portion arranged on a same plane, the first magnetic portion and the second magnetic portion have magnetization directions facing each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磁通產生構件</p>
        <p type="p">11:第一磁性部</p>
        <p type="p">12:第二磁性部</p>
        <p type="p">21:第一中間部</p>
        <p type="p">D1:方向/伸長方向/面外方向</p>
        <p type="p">D2:方向/磁化方向</p>
        <p type="p">D3:方向/伸長方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1141" publication-number="202631529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學玻璃及光學元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C03C3/068</main-classification>
        <further-classification edition="200601120260424B">G02B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商豪雅光電科技（威海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA OPTICAL TECHNOLOGY (WEIHAI) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保阳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BAOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供光學玻璃及光學元件。本發明提供在降低成本的同時為高折射率且低比重的光學玻璃，以及包含此光學玻璃的光學元件。此光學玻璃在以質量%表示的此光學玻璃的玻璃組成中，SiO&lt;sub&gt;2&lt;/sub&gt;含量為0~20%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含量為5~30%、BaO含量為0~6.5%、La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含量為29~55%、TiO&lt;sub&gt;2&lt;/sub&gt;含量為5~50%、Nb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;含量為0~5%、WO&lt;sub&gt;3&lt;/sub&gt;含量為0~0.6%、CaO含量為15%以下、ZnO含量為0~20%、ZrO&lt;sub&gt;2&lt;/sub&gt;含量為0~20%、TiO&lt;sub&gt;2&lt;/sub&gt;及ZrO&lt;sub&gt;2&lt;/sub&gt;的合計含量相對於CaO含量的質量比((TiO&lt;sub&gt;2&lt;/sub&gt;＋ZrO&lt;sub&gt;2&lt;/sub&gt;)/CaO)大於3.3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1142" publication-number="202632382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光引導裝置</chinese-title>
        <english-title>LIGHT GUIDE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">G02B27/42</main-classification>
        <further-classification edition="200601120260417B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銀晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, EUN SEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例之一光引導裝置係一種光引導裝置，其包括：一板部分，其中光經完全反射；以及一第一繞射部分及一第二繞射部分，其安置在該板部分上，其中該第一繞射部分使入射至該板部分中之該光朝向該第二繞射部分繞射，該第二繞射部分使在該板部分中經完全反射之該光繞射至外部，該第一繞射部分具有在一第一方向上之一第一長度及在垂直於該第一方向之一第二方向上之一第二長度，該第二繞射部分具有在該第一方向上之一第三長度，且該第一長度不同於該第三長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light guide device according to an embodiment of the present invention is a light guide device including a plate portion in which light is totally reflected, and a first diffraction portion and a second diffraction portion which are disposed on the plate portion, wherein the first diffraction portion diffracts the light incident into the plate portion toward the second diffraction portion, the second diffraction portion diffracts the light totally reflected in the plate portion to the outside, the first diffraction portion has a first length in a first direction and a second length in a second direction perpendicular to the first direction, the second diffraction portion has a third length in the first direction, and the first length is different from the third length.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:板部分</p>
        <p type="p">200:第一繞射部分</p>
        <p type="p">300:第二繞射部分</p>
        <p type="p">A2:第二角度</p>
        <p type="p">L4:第四長度</p>
        <p type="p">V1:方向</p>
        <p type="p">V2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1143" publication-number="202632670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測訊號傳輸路徑中的故障的記憶體系統</chinese-title>
        <english-title>MEMORY SYSTEM FOR DETECTING FAULT IN SIGNAL TRANSMISSION PATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C29/04</main-classification>
        <further-classification edition="200601120260302B">G11C11/26</further-classification>
        <further-classification edition="200601120260302B">G06F13/14</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昶權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG KWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡行善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HAENG SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔洪碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HONG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體系統，包括基礎晶粒，其配置為控制多個核心晶粒的操作。所述基礎晶粒在晶圓測試操作開始後，透過經由第一訊號傳輸路徑接收命令位址，將命令位址施加至命令位址矽穿孔(TSV)；在讀取操作開始後，透過第二訊號傳輸路徑來將基於命令位址TSV的邏輯電位產生的鎖存命令位址作為資料輸出；以及基於資料的邏輯電位來檢測第一訊號傳輸路徑中的故障。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory system includes a base die configured to control operations of a plurality of core dies. The base die applies a command address to a command address through silicon via (TSV) by receiving the command address through a first signal transmission path after the start of a wafer test operation, outputs a latch command address generated based on a logic level of the command address TSV as data through a second signal transmission path after the start of a read operation, and detects a fault in the first signal transmission path based on a logic level of the data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:記憶體系統</p>
        <p type="p">11:印刷電路板</p>
        <p type="p">111:凸塊焊盤</p>
        <p type="p">113:微凸塊焊盤</p>
        <p type="p">120:基礎晶粒</p>
        <p type="p">121-1~121-L:核心晶粒</p>
        <p type="p">13:基板</p>
        <p type="p">15:中介層</p>
        <p type="p">17:記憶體裝置</p>
        <p type="p">19:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1144" publication-number="202633411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、資訊處理裝置及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P95/00</main-classification>
        <further-classification edition="200601120260423B">G05B21/02</further-classification>
        <further-classification edition="202301120260423B">G06N5/04</further-classification>
        <further-classification edition="202501120260423B">G06F16/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川裕亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川人大希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHITO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>的川建史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATOGAWA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種資訊處理方法、資訊處理裝置及電腦程式。  &lt;br/&gt;本發明係由電腦執行如下處理：受理關於基板處理之使用者之查詢；使用參照關於基板處理之製程資料及文獻資料之語言模型，針對所受理之使用者之查詢生成回答文本；以及輸出所生成之回答文本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:LLM伺服器</p>
        <p type="p">MD:語言模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1145" publication-number="202632425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137280</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑下層膜形成用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">G03F7/11</main-classification>
        <further-classification edition="200601120260420B">G03F7/027</further-classification>
        <further-classification edition="200601120260420B">G03F7/20</further-classification>
        <further-classification edition="200601120260420B">C08F12/24</further-classification>
        <further-classification edition="202601120260420B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板岡康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAOKA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方裕斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村護</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, MAMORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供一種阻劑下層膜形成用組成物，其係包含具有鍵結在芳香環之羥基以及溴基及碘基的至少任一者之樹脂(A)、與溶劑(B)的阻劑下層膜形成用組成物，其特徵為  &lt;br/&gt;　　前述樹脂(A)為具有下述式(A-1)表示之構造單位的樹脂。  &lt;br/&gt;&lt;img align="absmiddle" height="152px" width="268px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(A-1)中，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或碳原子數1～3之烷基，R&lt;sup&gt;2&lt;/sup&gt;表示可被取代之碳原子數1～3之烷基、可被取代之碳原子數1～3之烷氧基、氟原子或氯原子，X表示溴原子或碘原子，Ar&lt;sup&gt;1&lt;/sup&gt;表示苯環或萘環。p表示0～4之整數，q表示1～4之整數，r表示0～4之整數)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1146" publication-number="202632982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發送及接收資訊</chinese-title>
        <english-title>SENDING AND RECEIVING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260421B">H04W8/24</main-classification>
        <further-classification edition="200901120260421B">H04W24/02</further-classification>
        <further-classification edition="200901120260421B">H04W64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商ＬＭ艾瑞克生(ＰＵＢＬ)電話公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瑞費斯塔　瑞泰史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHREEVASTAV, RITESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝勒齊　馬柯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLESCHI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏格斯琮　馬堤亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGSTROM, MATTIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江小林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, XIAOLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實例中，提供一種由一使用者設備(UE)執行之用於將資訊發送至一第一網路節點之方法。該UE具有使用一人工智慧或機器學習(AI/ML)模型之一功能性。該方法包括將資訊發送至該第一網路節點。該資訊識別以下之一或多者：該功能性當前是否適用；該功能性之適用性是否為動態的或靜態的；及/或該功能性適用之一或多個條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an example, a method performed by a User Equipment (UE) for sending information to a first network node is provided. The UE has a functionality that uses an artificial intelligence or machine learning (AI/ML) model. The method comprises sending information to the first network node. The information identifies one or more of: whether the functionality is currently applicable or currently not applicable; whether applicability of the functionality is dynamic or static; and/or one or more conditions under which the functionality is applicable.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1147" publication-number="202631691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特異性結合黏膜相關非變異性T細胞（MAIT）的抗體</chinese-title>
        <english-title>ANTIBODIES THAT SPECIFICALLY BIND MUCOSAL ASSOCIATED INVARIANT T (MAIT) CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/32</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商拜奧穆尼克斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOMUNEX PHARMACEUTICALS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗拉杜　瑪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUDEAU, MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普瑞金特　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIGENT, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧丁　馬克西姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDIN, MAXIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷格爾　奧利維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEGER, OLIVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉特　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLYTE, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於免疫學領域，及更特定而言係關於可用於醫學領域具有經改良性質之抗體、其組合物、產生方法及用途。特定而言，本發明提供特異性結合黏膜相關非變異性T細胞(Mucosal Associated Invariant T；MAIT)上TCR之Vα7.2鏈之抗體。本發明亦提供多特異性抗體構築體、產生其之方法及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of immunology, and more specifically to antibodies that are useful in the medical field with improved properties, their composition, production methods and uses. In particular, the present invention provides antibodies that specifically bind to the Vα7.2 chain of the TCR on Mucosal Associated Invariant T (MAIT) cells. It also provides multispecific antibody constructs, methods for producing them, and uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1148" publication-number="202632300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機</chinese-title>
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01R1/44</main-classification>
        <further-classification edition="200601120260422B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt;  本發明的用於測試電子元件的處理機具有調節往測試台的冷卻流路輸入的冷卻流體的溫度的用於調節冷氣的加熱器。&lt;br/&gt;  依據本發明，由於能快速妥當地冷卻被測試的電子元件而得以確保測試的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:測試台</p>
        <p type="p">321:入口</p>
        <p type="p">322:出口</p>
        <p type="p">700:冷卻器</p>
        <p type="p">710:歧管</p>
        <p type="p">711:進入通道</p>
        <p type="p">712:排放通道</p>
        <p type="p">720:製冷機</p>
        <p type="p">730:供應管</p>
        <p type="p">740:回收管</p>
        <p type="p">750:旁通管</p>
        <p type="p">760:旁通閥</p>
        <p type="p">770:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1149" publication-number="202631704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法及共聚物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/38</main-classification>
        <further-classification edition="200601120260504B">C08F212/14</further-classification>
        <further-classification edition="200601120260504B">C08F212/32</further-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F220/30</further-classification>
        <further-classification edition="200601120260504B">C08F220/32</further-classification>
        <further-classification edition="200601120260504B">C08F220/38</further-classification>
        <further-classification edition="200601120260504B">C08F220/40</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安形佳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGATA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於藉由曝光產生酸，且藉由酸的作用而對顯影液的溶解性產生變化之阻劑組成物，其係含有藉由酸的作用而對顯影液的溶解性產生變化之樹脂成分(A1)，該樹脂成分(A1)含有一般式(A1-0)所示共聚物之阻劑組成物(式中，R&lt;sup&gt;c&lt;/sup&gt;為ns價連結基，ns為3以上的整數，L為2價連結基；P為具有：含有藉由酸的作用而增大極性之酸分解性基的構成單位、成為質子來源之構成單位，與藉由曝光而產生酸的構成單位之共聚合部)。  &lt;br/&gt;&lt;img align="absmiddle" height="90px" width="220px" file="ed10162.JPG" alt="ed10162.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1150" publication-number="202631616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＨＰＫ１靶向化合物及其用途</chinese-title>
        <english-title>HPK1 TARGETING COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞文納營運公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARVINAS OPERATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德貝拉迪尼斯　阿爾伯特Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEBERARDINIS, ALBERT M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥地那　耶穌　勞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDINA, JESUS RAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊什琴科　阿列克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHCHENKO, ALEXEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　漢清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科溫　威廉　萊斯利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORWIN, WILLIAM LESLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蒂扎德　阿爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FATHIZADEH, ARMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式(I)化合物：</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="239px" width="353px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">或其醫藥學上可接受之鹽，其可用於HPK1之降解，以及用於治療多種HPK1介導之病狀或疾病，諸如癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are compounds of the Formula (I): </p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="231px" width="332px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">or pharmaceutically acceptable salts thereof, which are useful for the degradation of HPK1 and in the treatment of a variety of HPK1 mediated conditions or diseases, such as cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1151" publication-number="202631636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>四環衍生物、其組成物及方法</chinese-title>
        <english-title>TETRACYCLIC DERIVATIVES, COMPOSITIONS AND METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D519/00</main-classification>
        <further-classification edition="200601120260504B">A61K31/553</further-classification>
        <further-classification edition="200601120260504B">A61K31/55</further-classification>
        <further-classification edition="200601120260504B">A61K31/551</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂勝醫療科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENSEM THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　紅波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, HONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供新穎的四環化合物及其衍生物，以及其醫藥組成物，以及用於治療疾病及病症，諸如各種類型之癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides novel tetracyclic compounds and derivatives thereof, and pharmaceutical compositions thereof and methods for treating diseases and disorders, such as various types of cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1152" publication-number="202631617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種降解劑及其用途</chinese-title>
        <english-title>A DEGRADER AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱國棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, GUODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯惠民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, HUIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種降解劑及其用途。具體而言，揭露了式(I)所示的化合物，含有其的醫藥組成物，以及其用於預防和/或治療自身免疫性疾病、炎性疾病、癌症、腫瘤的用途，其中式(I)中各基團如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="132px" width="416px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a degrader and uses thereof. Specifically, the present disclosure relates to compounds shown in Formula (I), pharmaceutical compositions comprising the compounds, and their use for preventing and/or treating autoimmune diseases, inflammatory diseases, cancers, and tumors, wherein each group in Formula (I) is as defined in the specification.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="123px" width="439px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1153" publication-number="202631199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種含抗體藥物偶聯物的醫藥組成物及其用途</chinese-title>
        <english-title>A PHARMACEUTICAL COMPOSITION CONTAINING AN ANTIBODY-DRUG CONJUGATE AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260504B">A61K47/68</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">C07D491/22</further-classification>
        <further-classification edition="200601120260504B">A61K47/22</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K9/19</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商常州恆邦藥業有限公司 中國江蘇省常州市新北區遼河路1028號　郵編：213001</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGZHOU HANSOH PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WENJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭熠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, YIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種含抗體藥物偶聯物的醫藥組成物及其用途。具體而言，本發明涉及一種醫藥組成物，其包含在緩衝液中的抗體藥物偶聯物。本發明的醫藥組成物具備良好的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a pharmaceutical composition containing an antibody-drug conjugate and its use. Specifically, the invention relates to a pharmaceutical composition comprising an antibody-drug conjugate in a buffer. The pharmaceutical composition of the present invention has good stability.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1154" publication-number="202631369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>框架結構體、飛翔體及框架結構體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B29C65/64</main-classification>
        <further-classification edition="200601120260422B">B32B1/08</further-classification>
        <further-classification edition="200601120260422B">B32B15/08</further-classification>
        <further-classification edition="200601120260422B">B32B15/14</further-classification>
        <further-classification edition="200601120260422B">F16L47/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野寺美穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONODERA, MIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本間雅登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONMA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於以穩定的接合狀態形成熱硬化性樹脂的筒狀體或柱狀體與金屬構件接合而成的框架結構體。本發明為一種框架結構體，包含具有樹脂構件（a）及金屬構件（b）的樹脂-金屬接合體，所述樹脂構件（a）實質上由纖維強化熱硬化性樹脂構成，所述框架結構體中，樹脂構件（a）的筒狀部或柱狀部嵌合於金屬構件（b）的內周，或者金屬構件（b）的筒狀部或柱狀部嵌合於樹脂構件（a）的內周，於嵌合部中，被嵌合的內側構件的外截面與進行嵌合的外側構件的內截面呈相似的形狀，且所述內側構件的外尺寸D與所述外側構件的內尺寸d滿足D＞d。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂構件(a)(第一筒狀體)</p>
        <p type="p">2:金屬構件(b)(接頭、台座或第二筒狀體、筒狀構件)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1155" publication-number="202632698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01G9/10</main-classification>
        <further-classification edition="200601120260422B">H01G9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN ELECTRONIC INDUSTRIES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹澤𨺓志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細木雅和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOGI, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤忠仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TADAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿立貴久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, TAKAHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣澤匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSAWA, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森彩葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, IROHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明之目的，是藉由防止將封口體覆蓋的被覆層的損傷，來抑制電容器的性能下降。  &lt;br/&gt;　　[技術內容]在本體殼(1)的開口端形成朝內方曲折的反折部(9)，反折部(9)與封口體(4)的靠本體殼(1)外側的面隔有規定間隔地相面對。在此反折部(9)的內面側，在前述本體殼(1)的外周部側中，形成有在與前述封口體(4)的外周部之間形成的樹脂袋部(10)。在前述封口體(4)的靠本體殼(1)外側的面中，設有樹脂製的被覆層(11)。此被覆層(11)，從俯視看雖是圓形，但是中心部的壁厚較薄，外周部的壁厚較厚。這種形狀的被覆層(11)的一部分，如圖1所示，流入前述反折部(9)的樹脂袋部(10)，在此反折部(9)的內面、及前述封口體(4)的靠本體殼(1)外面側的面之間，形成有由前述被覆層(11)所構成的支柱部(12)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體殼</p>
        <p type="p">2:開口部</p>
        <p type="p">3:電容器元件</p>
        <p type="p">4:封口體</p>
        <p type="p">5:導線端子</p>
        <p type="p">6:座板</p>
        <p type="p">7:連接電極</p>
        <p type="p">8:縮徑部</p>
        <p type="p">9:反折部</p>
        <p type="p">10:樹脂袋部</p>
        <p type="p">11:被覆層</p>
        <p type="p">12:支柱部</p>
        <p type="p">13:前端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1156" publication-number="202631191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用抗ＴＬ１Ａ抗體治療異位性皮膚炎之方法</chinese-title>
        <english-title>METHODS FOR TREATMENT OF ATOPIC DERMATITIS WITH AN ANTI-TL1A ANTIBODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿方索　羅斯　特雷斯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALFONSO ROSS TERRES, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林森　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINSON, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯比　派斯可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESPIE, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱易夫　皮兒　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUIF, PIERRE-ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用治療劑量之抗類 TNF 配體 1A (TL1A) 抗體治療涉及皮膚之發炎的疾病或病症之方法及組成物，該疾病或病症例如為異位性皮膚炎、異位性皮膚炎以外的濕疹、化膿性汗腺炎、白斑病、斑禿、硬皮病 (包括全身性硬化症)、皮肌炎、水皰性表皮鬆解症、肥胖細胞增多症、瘢痕瘤、痤瘡、酒渣或大皰性類天皰瘡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods and compositions for treating a disease or condition involving inflammation in the skin, e.g., atopic dermatitis, eczema other than atopic dermatitis, hidradenitis suppurativa, vitiligo, alopecia areata, scleroderma (including systemic sclerosis), dermatomyositis, epidermolysis bullosa, mastocytosis, keloids, acne, rosacea, or bullous pemphigoid, with a therapeutic dose of an anti-TNF-like ligand 1A (TL1A) antibody.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1157" publication-number="202631012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有優異物理性質的有害生物控制組成物</chinese-title>
        <english-title>NOXIOUS ORGANISM CONTROL COMPOSITION HAVING EXCELLENT PHYSICAL PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A01N37/22</main-classification>
        <further-classification edition="200601120260504B">A01N51/00</further-classification>
        <further-classification edition="200601120260504B">A01N25/30</further-classification>
        <further-classification edition="200601120260504B">A01N25/04</further-classification>
        <further-classification edition="200601120260504B">A01P7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學植保股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS CROP &amp; LIFE SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口美香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目標在於提供有害生物控制組成物，該有害生物控制組成物在於常溫或低於常溫儲存的情況下對於抑制晶體沉澱有優異效果，及/或在用水稀釋的情況下對於長期乳化穩定性有優異效果，即使在含有高濃度複數有害生物控制成分且這些成分在水中的特性溶解度相異的情況下亦是如此。&lt;br/&gt;  於此提供有害生物控制組成物，其包含：(1) 選自由難溶於水之有害生物控制成分所組成之群組中的至少一者，其中難溶於水之有害生物控制成分於20°C下的水中溶解度為0.00002 g/L或更高以及0.200 g/L或更低；(2) 選自由易溶於水之有害生物控制成分所組成之群組中的至少一者，其中易溶於水之有害生物控制成分於20°C下的水中溶解度為3.8 g/L或更高以及500 g/L或更低；(3) 非質子極性溶劑；及(4) 醚型離子界面活性劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a noxious organism control composition that is excellent in suppressing crystal precipitation in a case of being stored at or below ordinary temperature and/or is excellent in the long-term emulsion stability in a case of dilution with water, even in a case where a plurality of noxious organism control components that differ in characteristic solubility in water are contained at a high concentration.&lt;br/&gt; There is provided a noxious organism control composition, containing (1) at least one selected from the group consisting of poorly water-soluble noxious organism control components in which a solubility in water at 20°C is 0.00002 g/L or more and 0.200 g/L or less, (2) at least one selected from the group consisting of easily water-soluble noxious organism control components in which a solubility in water at 20°C is 3.8 g/L or more and 500 g/L or less, (3) an aprotic polar solvent, and (4) an ether-type ionic surfactant.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1158" publication-number="202633254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電腦程式、資訊處理方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P10/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村隆央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川人大希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHITO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池尻将拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEJIRI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢崎晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAKI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>筒井拓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUTSUI, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電腦程式、資訊處理方法及資訊處理裝置。  &lt;br/&gt;本發明之電腦程式係輸出用以修正基板變形之處理工序中應該應用之處理參數之資訊者，且使電腦執行以下處理：受理處理工序中之限制條件，根據所賦予之處理參數來預測基板之變形量，對變形量之預測結果進行評估，於所受理之限制條件下搜尋處理工序中應該應用之處理參數，並輸出作為搜尋結果而獲得之處理參數之候補資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1159" publication-number="202631130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>托吡司特藥物組成物、製備方法及用途</chinese-title>
        <english-title>TOPIROXOSTAT PHARMACEUTICAL COMPOSITION, PREPARATION METHOD THEREOF AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/444</main-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61K9/22</further-classification>
        <further-classification edition="200601120260504B">A61K47/36</further-classification>
        <further-classification edition="200601120260504B">A61K47/32</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海雲晟研新生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI AURORA BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>應述歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YING, SHU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, WEN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳祖佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZU-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱森發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, SEN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明記載托吡司特藥物組成物、製備方法及用途。本發明提供了一種托吡司特藥物組成物，其溶出釋放曲線具有以下特徵：1）在1小時內溶出不超過30%的藥物活性成分；2）在8小時內溶出20%~70%的藥物活性成分；3）在24小時內溶出不低於70%的藥物活性成分。本發明的托吡司特藥物組成物，具有良好的緩釋性能，24小時累積釋放度可達70％以上，藥物血藥濃度平穩，穩定性好，不良反應小，服藥次數少，患者順應性好。本發明的製備技術簡單、穩定，技術參數可調可控，有利於生產放大，市場化前景好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a topiroxostat pharmaceutical composition, a preparation method thereof and a use thereof. The invention provides a topiroxostat pharmaceutical composition, whose dissolution and release profile is characterized by the following: 1) not more than 30% of the active pharmaceutical ingredient is dissolved within 1 hour; 2) 20%~70% of the active pharmaceutical ingredient is dissolved within 8 hours; 3) not less than 70% of the active pharmaceutical ingredient is dissolved within 24 hours. The topiramate pharmaceutical composition of the present invention has favorable sustained-release performance, with a cumulative release rate of over 70% within 24 hours. It can maintain stable plasma drug concentration, has good stability, low adverse reactions, requires fewer doses, and thus achieves high patient compliance. The preparation process of the present invention is simple and stable, with adjustable and controllable process parameters, which is conducive to production scale-up and has a promising market prospect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1160" publication-number="202631917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>先進節點高頻寛記憶體裝置的化學機械平坦化</chinese-title>
        <english-title>CHEMICAL MECHANICAL PLANARIZATION FOR ADVANCED NODE HIGH BANDWIDTH MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C09G1/02</main-classification>
        <further-classification edition="200601120260424B">C09K3/14</further-classification>
        <further-classification edition="202601120260424B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商慧盛材料美國責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSUM MATERIALS US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　曉波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, XIAOBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕雷拉　克里希納Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURELLA, KRISHNA P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　約瑟Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSE, JOSEPH D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　鴻君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">目前化學機械平坦化(CMP)研磨組合物、方法和系統可用於先進節點高頻寛記憶體(HBM)裝置製程中多種膜的研磨。該CMP研磨組合物包含磨料；胺基酸或其鹽類或衍生物；過氧型氧化劑；可選的唑類化合物；表面活性劑；苯磺酸、其衍生物、其鹽類或其組合；以及多元醇，可在HBM裝置中從圖案化晶圓表面研磨多種類型的膜，例如氧化矽膜、氮化矽膜、銅膜和其他相關膜時，提供高且可調整的去除率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Present Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems are used in multi-types of films polishing in advanced node high bandwidth memory (HBM) device fabrication process. The CMP polishing compositions comprise abrasives; amino acid or its salts or derivatives; peroxy type of oxidizing agents; optionally an azole compound; a surfactant; benzenesulfonic acid, its derivatives, its salts, or combinations thereof; and polyol to provide high and tunable remove rates in polishing multi-types of films, such as silicon oxide film, silicon nitride film, Cu film, and other relevant films from the patterned wafer surfaces in HBM devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1161" publication-number="202632421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G03F7/00</main-classification>
        <further-classification edition="200601120260423B">G03F7/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文多爾發　阿諾　艾倫　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUENDORFFER, ARNAUD ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於藉由氣體或是水霧的顯影流體而獲得良好形狀的光阻圖案。&lt;br/&gt;  本發明之基板處理方法，係將氣體或是水霧的顯影流體供給至基板，而將形成於該基板的含有金屬之光阻膜進行顯影而形成圖案；該基板處理方法包含以下步驟：將沿著該圖案曝光該光阻膜後的該基板進行熱處理的第一熱處理步驟、對進行完該第一熱處理步驟的該基板供給該顯影流體，並將該光阻膜之深度方向上的一部分去除的第一顯影步驟，及為了形成該圖案而對進行完該第一顯影步驟的該基板供給該顯影流體，並將藉由該第一顯影步驟而去除了該光阻膜的區域，在該深度方向上去除至顯影完成位置為止的第二顯影步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1162" publication-number="202631985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>糞雙歧桿菌菌株及其用途</chinese-title>
        <english-title>BIFIDOBACTERIUM STERCORIS STRAIN AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">C12N1/20</main-classification>
        <further-classification edition="201501120260504B">A61K35/745</further-classification>
        <further-classification edition="200601120260504B">A61P1/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/08</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="201601120260504B">A23L33/135</further-classification>
        <further-classification edition="200601320260504B">C12R1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商Ｋｏ生物技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBIOLABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商賽特瑞恩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELLTRION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　相均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SANG KYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋石天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SEOKCHEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傃勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SOYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李塍基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐周錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JU SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於糞雙歧桿菌&lt;i&gt;（&lt;/i&gt;&lt;i&gt;Bifidobacterium stercoris&lt;/i&gt;&lt;i&gt;）&lt;/i&gt;菌株及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a Bifidobacterium stercoris strain and uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1163" publication-number="202633013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制照明裝置的方法、執行該方法之裝置及電腦程式產品</chinese-title>
        <english-title>METHOD OF CONTROLLING A LIGHTING DEVICE, DEVICE FOR PERFORMING THE SAME AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260427B">H05B47/165</main-classification>
        <further-classification edition="202001120260427B">H05B47/135</further-classification>
        <further-classification edition="202001120260427B">H05B47/125</further-classification>
        <further-classification edition="202001120260427B">H05B47/155</further-classification>
        <further-classification edition="202001120260427B">H05B47/19</further-classification>
        <further-classification edition="200601120260427B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商双翼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYVRN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維佐利　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEZZOLI, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種控制照明裝置的方法和設備。為了達到目的，確定與第一環境中顯示裝置上的影像(310)的渲染相關聯的攝影機視角類型。根據攝影機視角類型，使識別一組空間區域中的一空間區域的第一資訊與影像(310)的一組區域中的每個區域相關聯。接收表示照明裝置在第一環境的位置的位置資料。根據第一資訊和位置資料，使照明裝置與區域(312)的部分(31)相關聯。根據從部分(31)獲得的顏色資料控制照明裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided methods and apparatus of controlling a lighting device. To reach that aim, a camera perspective type associated with a rendering of an image (310) on a display device comprised in a first environment is determined. A first information identifying a spatial area of a set of spatial areas is associated with each region of a set of regions of the image (310) according to the camera perspective type. Position data representative of position of the lighting device in the first environment is received. The lighting device is associated with a part (31) of a region (312) according to the first information and the position data. The lighting device is controlled according to color data obtained from the part (31).</p>
      </isu-abst>
      <representative-img>
        <p type="p">31、32、33、34、35、36:部分</p>
        <p type="p">310:影像</p>
        <p type="p">311:第一區域</p>
        <p type="p">312:第二區域</p>
        <p type="p">313:第三區域</p>
        <p type="p">314:第四區域</p>
        <p type="p">315:第五區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1164" publication-number="202633386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體製造的多波長監測的系統、設備和方法</chinese-title>
        <english-title>SYSTEMS, APPARATUS, AND METHODS FOR MULTI-WAVELENGTH MONITORING FOR SEMICONDUCTOR MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260322B">H10P74/00</main-classification>
        <further-classification edition="200601120260322B">G01J3/36</further-classification>
        <further-classification edition="200601120260322B">G01J3/51</further-classification>
        <further-classification edition="202601120260322B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維若雷　金瑞庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VELLORE, KIM RAMKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及用於在半導體製造中進行多波長監測的系統、設備和方法。在一或多個實施例中，用於處理基板的系統包括腔室主體，該主體至少部分定義內部空間；一或多個熱源，配置為加熱內部空間；設置在內部空間中的基板支撐件；以及可操作來量測內部空間中複數個波長能量的感測器組件。感測器組件包括一或多個光學感測器、與馬達耦合的可移動托盤，以及由可移動托盤支撐的複數個濾波器，馬達可操作來移動可移動托盤，進而使複數個濾波器相對於一或多個光學感測器進行移動，以分別將複數個濾波器對準一或多個光學感測器中至少一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to systems, apparatus, and methods for multi-wavelength monitoring for semiconductor manufacturing. In one or more embodiments, a system for processing substrates includes a chamber body at least partially defining an internal volume, one or more heat sources configured to heat the internal volume, a substrate support disposed in the internal volume, and a sensor assembly operable to measure energy of a plurality of wavelengths in the internal volume. The sensor assembly includes one or more optical sensors, a movable tray coupled to a motor, and a plurality of filters supported by the movable tray, the motor operable to move the movable tray to move the plurality of filters relative to the one or more optical sensors to respectively align the plurality of filters with at least one of the one or more optical sensors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">108:上窗</p>
        <p type="p">141:熱源</p>
        <p type="p">171:板材</p>
        <p type="p">196:感測器</p>
        <p type="p">197:感測器</p>
        <p type="p">198:感測器</p>
        <p type="p">400:感測器組件</p>
        <p type="p">410:可移動托盤</p>
        <p type="p">411:馬達</p>
        <p type="p">412a:孔</p>
        <p type="p">412b:孔</p>
        <p type="p">412c:孔</p>
        <p type="p">412d:孔</p>
        <p type="p">412e:孔</p>
        <p type="p">412f:孔</p>
        <p type="p">413:鏡</p>
        <p type="p">414:第二鏡</p>
        <p type="p">415:板材</p>
        <p type="p">416:探頭</p>
        <p type="p">417:視鏡</p>
        <p type="p">418:聚焦透鏡</p>
        <p type="p">421:濾波器</p>
        <p type="p">422:濾波器</p>
        <p type="p">423:濾波器</p>
        <p type="p">424:濾波器</p>
        <p type="p">425:濾波器</p>
        <p type="p">426:濾波器</p>
        <p type="p">440:馬達控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1165" publication-number="202633238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10H29/851</main-classification>
        <further-classification edition="202501120260422B">H10H29/85</further-classification>
        <further-classification edition="202501120260422B">H10H29/853</further-classification>
        <further-classification edition="202501120260422B">H10H29/855</further-classification>
        <further-classification edition="202301120260422B">H10K59/126</further-classification>
        <further-classification edition="202301120260422B">H10K59/38</further-classification>
        <further-classification edition="202301120260422B">H10K59/80</further-classification>
        <further-classification edition="202301120260422B">H10K77/10</further-classification>
        <further-classification edition="202301320260422B">H10K102/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金晟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慶昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李姸周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNJOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含：一基板，該基板包含若干島部分，該些島部分彼此分隔開，該些島部分之間界定一開口，該基板還包含一橋部分，該橋部分連接該些島部分；一發光元件，設置在該些島部分上方；以及一亮度補償層，設置在該橋部分上方，且進一步包含一顏色轉換材料，該顏色轉換材料配置為響應於應力而改變顏色。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a substrate including island portions spaced apart from each other, defining an opening between the island portions, and including a bridge portion connecting the island portions, a light-emitting element above the island portions, and a luminance compensation layer above the bridge portion, and further including a color conversion material configured to change color in response to stress.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100OP1:開口</p>
        <p type="p">11:第一島部分</p>
        <p type="p">111:緩衝層</p>
        <p type="p">12:第一橋部分</p>
        <p type="p">200:電路發光元件層</p>
        <p type="p">400:保護層</p>
        <p type="p">CS1:第一開口</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">IL:絕緣層</p>
        <p type="p">LCL:亮度補償層</p>
        <p type="p">LED:發光元件</p>
        <p type="p">PC:像素驅動電路單元</p>
        <p type="p">WL:布線</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1166" publication-number="202632247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於判定所關注參數之度量衡工具及方法</chinese-title>
        <english-title>A METROLOGY TOOL AND A METHOD FOR DETERMINING PARAMETERS OF INTEREST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N21/31</main-classification>
        <further-classification edition="201201120260504B">G03F1/44</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥提森　賽門　吉司伯　喬瑟佛思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHIJSSEN, SIMON GIJSBERT JOSEPHUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努特　馬克　喬漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOOT, MARC JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克　納馬拉　艾略特　葛雷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MC NAMARA, ELLIOTT GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹　包伊夫　亞歷　傑福瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEN BOEF, ARIE JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種用於判定一物件上之一結構的所關注參數之度量衡工具及方法。此度量衡工具包含：一照明分支，其經組態以用於提供一照明光束；一光譜成形裝置，其用於對該照明光束進行光譜成形，從而提供包含至少兩個分離波長帶之一光譜；一控制器；及一偵測分支，其經組態以用於偵測與一經繞射光束相關之信號，該光束包含經繞射子光束，其中該等信號使得能夠判定所關注參數。該照明分支進一步經組態以用於對該物件上之該結構進行照明，此產生該經繞射光束。該等經繞射子光束中之各者與該至少兩個分離波長帶中之一者相關聯。該控制器經組態以用於選擇該光譜從而允許自各別經繞射子光束可區分地獲取該等信號，且該控制器經組態以用於可控地設定該光譜成形裝置以提供該光譜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application provides a metrology tool, and a method, for determining parameters of interest of a structure on an object. This metrology tool comprises: an illumination branch configured for providing an illumination beam; a spectral shaping device for spectrally shaping the illumination beam providing a spectrum comprising at least two disjunct wavelength bands; a controller and a detection branch configured for detecting signals relating to a diffracted beam, the beam comprising diffracted sub-beams, wherein the signals enable determining parameters of interest. The illumination branch is further configured for illuminating the structure on the object which results in the diffracted beam. Each of the diffracted sub-beams is associated with one of the at least two disjunct wavelength bands. The controller is configured for selecting the spectrum allowing distinguishably acquiring the signals from respective diffracted sub-beams and the controller is configured for controllably setting the spectral shaping device to provide the spectrum.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:度量衡工具</p>
        <p type="p">601:照明光束</p>
        <p type="p">603:經光譜成形之照明光束</p>
        <p type="p">610:光譜成形裝置</p>
        <p type="p">612:控制器</p>
        <p type="p">614:空間濾波器</p>
        <p type="p">620:物件</p>
        <p type="p">621:結構</p>
        <p type="p">630:經繞射光束</p>
        <p type="p">631:經繞射子光束</p>
        <p type="p">632:經繞射子光束</p>
        <p type="p">633:經繞射子光束</p>
        <p type="p">634:經繞射子光束</p>
        <p type="p">635:經繞射子光束</p>
        <p type="p">636:經繞射子光束</p>
        <p type="p">637:經繞射子光束</p>
        <p type="p">640:偵測器</p>
        <p type="p">644:光學元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1167" publication-number="202632065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、基板處理系統、維護方法及清潔方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C16/52</main-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
        <further-classification edition="200601120260427B">B08B3/00</further-classification>
        <further-classification edition="200601120260427B">B08B3/02</further-classification>
        <further-classification edition="200601120260427B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀨口泰生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGUCHI, TAISEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜多川大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤功英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, KOEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村理紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原有生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, YUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個例示性實施方式之基板處理裝置具備：腔室；可更換零件，其可經由開口而在內部空間與腔室之外部之間搬送；基板支持器，其配置於內部空間；可動部，其在內部空間中配置於基板支持器之上方，且可於上下方向上移動；升降機構，其構成為使可動部於上下方向上移動；複數個夾具，其等設置於可動部，且構成為卡合於可更換零件而將可動部與可更換零件連結；及支持機構；且支持機構包含：固定環狀構件，其固定於基板支持器，且沿著基板支持器之外周設置；可動環狀構件，其與基板支持器相隔而配置，且設置於固定環狀構件上；及傾斜度調整裝置，其設置於固定環狀構件與可動環狀構件之間，調整可動環狀構件相對於固定環狀構件之傾斜度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:第1構件</p>
        <p type="p">10as:下表面</p>
        <p type="p">10c:空腔</p>
        <p type="p">10m:可動部</p>
        <p type="p">10t:孔</p>
        <p type="p">20:內部腔室(可更換零件)</p>
        <p type="p">20b:底部</p>
        <p type="p">20c:頂部</p>
        <p type="p">20e:擴展部</p>
        <p type="p">20p:定位孔(第1定位孔)</p>
        <p type="p">20r:凹部</p>
        <p type="p">20s:側部</p>
        <p type="p">20cs:上表面</p>
        <p type="p">31:支持部</p>
        <p type="p">34:下部電極</p>
        <p type="p">36:靜電吸盤</p>
        <p type="p">37:絕緣部</p>
        <p type="p">38:導體部</p>
        <p type="p">39:蓋環</p>
        <p type="p">50:夾具</p>
        <p type="p">52:支持部</p>
        <p type="p">52b:下端</p>
        <p type="p">54:彈簧</p>
        <p type="p">56:平板</p>
        <p type="p">58:蓋體</p>
        <p type="p">60:解除機構</p>
        <p type="p">80:支持機構</p>
        <p type="p">81:固定環狀構件</p>
        <p type="p">81a:本體部</p>
        <p type="p">81b:延出部</p>
        <p type="p">81c:凹部</p>
        <p type="p">81d:定位銷(第2定位銷)</p>
        <p type="p">82:可動環狀構件</p>
        <p type="p">82a:定位孔(第2定位孔)</p>
        <p type="p">82b:定位銷(第1定位銷)</p>
        <p type="p">82c:接點(第1接點)</p>
        <p type="p">83:傾斜度調整裝置</p>
        <p type="p">83a:殼體</p>
        <p type="p">83b:彈簧</p>
        <p type="p">83c:柱塞</p>
        <p type="p">84:接點(第2接點)</p>
        <p type="p">ER:邊緣環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1168" publication-number="202633258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於局部熱調節的板和吸收質量佈置及相關方法和處理腔室</chinese-title>
        <english-title>PLATE AND ABSORPTIVE MASS ARRANGEMENTS FOR LOCALIZED THERMAL ADJUSTABILITY, AND RELATED METHODS AND PROCESSING CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P14/00</main-classification>
        <further-classification edition="200601120260311B">H05B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　者澎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, ZHEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬普拉　索拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOPRA, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜貝　阿彼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及用於局部熱調節的板和吸收質量佈置，以及相關的方法和處理腔室。在一或多個實施例中，處理腔室包括一個腔室主體，該腔室主體至少部分定義一個內部空間；一個基板支撐，該基板支撐在該內部空間中設置；一個板裝置，該板裝置設置於該內部空間中，並至少部分定義一個位於該板裝置和該基板支撐之間的處理空間。該板裝置包括一或多個流動開口，這些開口形成在一或多個板壁上。該處理腔室包含一或多個吸收質量，這些吸收質量設置在該一或多個流動開口中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to plate and absorptive mass arrangements for localized thermal adjustability, and related methods and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume, a substrate support disposed in the internal volume, a plate apparatus disposed in the internal volume and at least partially defining a processing volume between the plate apparatus and the substrate support. The plate apparatus includes one or more flow openings formed in one or more plate walls. The processing chamber includes one or more absorptive masses disposed in the one or more flow openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">102:基板</p>
        <p type="p">106:基板支撐</p>
        <p type="p">107:銷穿孔</p>
        <p type="p">108:上板</p>
        <p type="p">110:板</p>
        <p type="p">112:流動模組</p>
        <p type="p">116:氣體排氣出口</p>
        <p type="p">118:軸</p>
        <p type="p">120:控制器</p>
        <p type="p">121:運動組件</p>
        <p type="p">125:定向熱源</p>
        <p type="p">132:銷</p>
        <p type="p">136a:處理空間</p>
        <p type="p">136b:上部</p>
        <p type="p">138:淨化空間</p>
        <p type="p">141:熱源</p>
        <p type="p">143:熱源</p>
        <p type="p">145:熱源模組</p>
        <p type="p">148:主體</p>
        <p type="p">151:製程氣體源</p>
        <p type="p">152:地板</p>
        <p type="p">153:清洗氣體源</p>
        <p type="p">154:蓋子/熱傳遞源</p>
        <p type="p">155:上熱源模組</p>
        <p type="p">156:上主體</p>
        <p type="p">157:排氣泵</p>
        <p type="p">162:淨化氣體源</p>
        <p type="p">164:淨化氣體進氣口</p>
        <p type="p">178:排氣系統</p>
        <p type="p">210:板裝置</p>
        <p type="p">211:板</p>
        <p type="p">213:板</p>
        <p type="p">219:流動開口</p>
        <p type="p">230:吸收質量</p>
        <p type="p">240:導管</p>
        <p type="p">302:預熱環</p>
        <p type="p">304:停止裝置</p>
        <p type="p">305a:臂</p>
        <p type="p">305b:臂</p>
        <p type="p">311:第二襯墊</p>
        <p type="p">1010:腔室套件/板裝置</p>
        <p type="p">1012:第一外表面</p>
        <p type="p">1013:第二外表面</p>
        <p type="p">1014:第一氣體進氣口</p>
        <p type="p">1015:第二進氣開口</p>
        <p type="p">1020:第一襯墊</p>
        <p type="p">1022:邊緣</p>
        <p type="p">1023:進氣開口</p>
        <p type="p">1024:內表面</p>
        <p type="p">1026:注入塊</p>
        <p type="p">1031:部分</p>
        <p type="p">P1:製程氣體</p>
        <p type="p">P2:淨化氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1169" publication-number="202633255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物品之製造方法、同一性判定方法、以及製造系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P10/00</main-classification>
        <further-classification edition="200601120260422B">B41J2/01</further-classification>
        <further-classification edition="200601120260422B">B41M3/14</further-classification>
        <further-classification edition="202601120260422B">H10W29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松野紗也佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNO, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種物品之製造方法，係具備：墨水標記工序，係利用墨水於標記面上賦予用於判定物品之同一性的同一性判定用標記；判定物品之同一性係包含：將自真品之前述同一性判定用標記的圖像所得到之資訊、與自判定對象品之同一性判定用標記的圖像所得到之資訊進行比對；同一性判定用標記的圖像具有：因墨水之液滴潤溼擴散所致之個體性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:同一性判定用標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1170" publication-number="202633264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化矽的選擇性沉積</chinese-title>
        <english-title>SELECTIVE DEPOSITION OF SILICON NITRIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P14/24</main-classification>
        <further-classification edition="200601120260428B">C23C16/02</further-classification>
        <further-classification edition="200601120260428B">C23C16/04</further-classification>
        <further-classification edition="200601120260428B">C23C16/34</further-classification>
        <further-classification edition="200601120260428B">C23C16/42</further-classification>
        <further-classification edition="200601120260428B">H05H1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝卡瓦特　安妮魯杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEKHAWAT, ANIRUDDH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高立剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林吉瓦迪　卡爾提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLINJIVADI, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈德西卡爾巴斯德西　瓦希迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHODSI KARBASDEHI, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成裝置的方法是藉由在相同基板上的氮化鈦（TiN）層上選擇性沉積氮化矽（SiN）層，而不在高介電常數介電層上沉積。該方法包括在選擇性沉積氮化矽層之前的預處理製程。預處理製程依序包括第一預處理製程，用以去除氮化鈦上的原生氧化物並對高介電常數介電層的懸空鍵進行鈍化，以及第二預處理製程用以對高介電常數介電層進行氟化。沉積後，可以去除高介電常數介電層上的氟。該選擇性沉積方法在高介電常數介電層上不會形成抑制層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of forming devices by selective deposition of silicon nitride (SiN) layer on a titanium nitride (TiN) layer and not on a high‑κ dielectric layer on the same substrate. The method including a pre-treatment process before selective deposition of the silicon nitride layer. The pre-treatment process comprising, in order, a first pre-treatment process to remove native oxides from the titanium nitride and passivate dangling bonds on the high‑κ dielectric layer, and a second pre-treatment process to fluorinate the high‑κ dielectric layer. After deposition, the fluorine can be removed from the high‑κ dielectric layer. The selective deposition method occurring without formation of an inhibitor layer on the high‑κ dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:操作</p>
        <p type="p">212:製程</p>
        <p type="p">214:製程</p>
        <p type="p">220:操作</p>
        <p type="p">230:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1171" publication-number="202632929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H04L27/26</main-classification>
        <further-classification edition="200601120260422B">H04L5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉辰辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請設計了一種新的LTF序列，該LTF序列可以降低LTF欄位的PAPR。該LTF序列包括非零LTF序列值，該非零LTF序列值與子載波對應。該LTF序列可以滿足：第一子載波組對應的LTF序列值與第二子載波組對應的LTF序列值相反，第三子載波組對應的LTF序列值與第四子載波組對應的LTF序列值相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of communication technology, particularly to a communication method and apparatus. The application can be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other IEEE 802.11 series standards, such as the 802.15 standard, 802.11bf standard, IMMW standard, or Starlink standard. The application designs a new LTF sequence, which can reduce the PAPR of the LTF field. This LTF sequence includes non-zero LTF sequence values, which correspond to subcarriers. The LTF sequence can satisfy that: the LTF sequence value corresponding to the first subcarrier group is opposite to that of the second subcarrier group, and the LTF sequence value corresponding to the third subcarrier group is the same as that of the fourth subcarrier group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">601、602、603:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1172" publication-number="202632991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法和通信裝置</chinese-title>
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260423B">H04W36/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭龍華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, LONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種通信方法和通信裝置。該方法中明確了LTM切換的安全演算法選擇流程。目標接入網設備在基於路徑切換響應消息獲取接入和移動性管理功能保存的與終端設備關聯的安全能力後，可以將該獲取的安全能力告知目標接入網設備後續進行切換對應的候選接入網設備，從而避免在後續切換過程中，由於候選接入網設備保存的與終端設備關聯的安全能力與接入和移動性管理功能保存的與終端設備關聯的安全能力不一致導致的LTM切換時延增加的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a communication method and a communication device. The method clearly defines the security algorithm selection process for LTM (Local Traffic Management) handover. After the target access network device obtains the security capabilities associated with the terminal device from the access and mobility management function based on the path switching response message, it can inform the candidate access network device for subsequent handover of the obtained security capabilities. This approach avoids the issue of increased LTM handover delay caused by inconsistencies between the security capabilities associated with the terminal device stored by the candidate access network device and those stored by the access and mobility management function during subsequent handover processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501、S502、S503、S504、S505、S506、S507、S508、S509、S510、S511、S512、S513、S514:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1173" publication-number="202631200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＨＥＲ２抗體藥物偶聯物和免疫檢查點抑制劑的藥物組合及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260504B">A61K47/68</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃琼華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QIONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊安琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ANQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王訓強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XUNQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於生物醫藥領域，涉及抗HER2抗體藥物偶聯物和免疫檢查點抑制劑的藥物組合。還涉及抗HER2抗體藥物偶聯物和免疫檢查點抑制劑在製備用於治療受試者的腫瘤的藥物中的用途。還涉及治療受試者的腫瘤的方法，所述方法包括向受試者施用抗HER2抗體藥物偶聯物和免疫檢查點抑制劑。所述方法對腫瘤受試者產生獲益，且具有良好的安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1174" publication-number="202633202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置、攝像裝置、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10F39/12</main-classification>
        <further-classification edition="202501120260422B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小室雄太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMURO, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口颯斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古谷登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, NOBORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田依里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示關於一種可抑制混色且提高感度、取得適當之相位差資訊之光檢測裝置、攝像裝置、及電子機器。  &lt;br/&gt;本揭示於包含具有檢測相位差之遮光膜之相位差像素、與通常像素之每個像素之彩色濾光片之間，具備折射率低於規定折射率之反射壁，且於入射光朝像素之入射方向為自上部至下部時，遮光膜之端部以潛入反射壁之下部之方式形成。本揭示可適用於光檢測裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測裝置</p>
        <p type="p">2:半導體基板</p>
        <p type="p">3:像素區域</p>
        <p type="p">4:垂直驅動電路</p>
        <p type="p">5:行信號處理電路</p>
        <p type="p">6:水平驅動電路</p>
        <p type="p">7:輸出電路</p>
        <p type="p">8:控制電路</p>
        <p type="p">9:垂直信號線(VSL)</p>
        <p type="p">10:水平信號線</p>
        <p type="p">11:輸入輸出端子</p>
        <p type="p">12:像素驅動配線</p>
        <p type="p">13:像素(通常像素)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1175" publication-number="202632688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造電子元件的可表面安裝的部件的方法以及可表面安裝的部件</chinese-title>
        <english-title>A METHOD FOR MANUFACTURING A SURFACE-MOUNTABLE COMPONENT FOR AN ELECTRONIC DEVICE AND SURFACE-MOUNTABLE COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01C1/028</main-classification>
        <further-classification edition="200601120260423B">H01C1/148</further-classification>
        <further-classification edition="200601120260423B">H01C7/06</further-classification>
        <further-classification edition="200601120260423B">H01C17/02</further-classification>
        <further-classification edition="200601120260423B">H01C17/28</further-classification>
        <further-classification edition="200601120260423B">G01K7/18</further-classification>
        <further-classification edition="200601120260423B">H01C1/142</further-classification>
        <further-classification edition="200601120260423B">H01C17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商國巨先進傳感器技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGEO NEXENSOS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼克　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICK, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾莫里奇　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMMERICH, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製造電子元件的可表面安裝的部件(10)的方法(100)，該方法包含以下步驟：&lt;br/&gt;  a)  提供(110)基板薄片(12)，其中該基板薄片(12)具有第一側(14)，該第一側帶有第一電極部分及第二電極部分（16、18）；&lt;br/&gt;  b) 將第三電極部分與至少一個第四電極部分(26)施加(120)到該基板薄片(12)的第二側(30)；&lt;br/&gt;  c)  將鈍化層(32)施加(130)到該元件部分(20)；&lt;br/&gt;  d) 將保護層(34)施加(140)到該鈍化層(32)；&lt;br/&gt;  e)  將該基板薄片(12)分離(150)成若干第一基板面板(36)；&lt;br/&gt;  f)  將金屬化層(48)施加(160)到該第一基板面板(36)的至少一個表面(42)；&lt;br/&gt;  g) 將該若干第一基板面板(36)分離(170)成若干單獨基板(46)；&lt;br/&gt;  h) 將至少一个邊緣金屬化層(48)施加(180)到該第一基板面板(36)的夾套表面(50)的該至少一個表面(42)的該金屬化層(40)，且施加到該電極部分（16、18）的最上層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method (100) for manufacturing a surface-mountable component (10) for an electronic device, which comprises the following steps: a) Providing (110) a substrate sheet (12), wherein the substrate sheet (12) has a first side (14) with a first and a second electrode section (16, 18), b) Applying (120) a third electrode section and at least one fourth electrode section (26) to a second side (30) of the substrate sheet (12), c) Applying (130) a passivation layer (32) to the element section (20), d) Applying (140) a protective layer (34) to the passivation layer (32), e) Separating (150) the substrate sheet (12) into several first substrate panels (36), f) Applying (160) a metallization layer (48) to at least one surface (42) of the first substrate panel (36), g) Separating (170) the several first substrate panels (36) into several individual substrates (46), h) Applying (180) at least one edge metallization layer (48) and/or to the metallization layer (40) of the at least one surface (42) of the jacket surface (50) of the first substrate panel (36) and to the uppermost layer of the electrode section (16, 18).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:可表面安裝的部件</p>
        <p type="p">12:基板薄片</p>
        <p type="p">14:第一側</p>
        <p type="p">16:第一電極部分</p>
        <p type="p">18:第二電極部分</p>
        <p type="p">20:元件部分</p>
        <p type="p">22:電阻元件</p>
        <p type="p">24:金屬化</p>
        <p type="p">30:第二側</p>
        <p type="p">46:基板</p>
        <p type="p">50:夾套表面</p>
        <p type="p">110:提供基板薄片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1176" publication-number="202632274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析異二聚蛋白質的方法</chinese-title>
        <english-title>METHODS OF ANALYZING HETERODIMERIC PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N33/68</main-classification>
        <further-classification edition="200601120260504B">C07K1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉薩德　帕拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRASAD, PALLAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　建凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIANN-KAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒斯勒　斯韋特蘭娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUSSLER, SVETLANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬澤奧　蜜雪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAZZEO, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沛隆　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERRONE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供使用親和層析分析蛋白質混合物之方法。在一些實施例中，該等蛋白質為異二聚雙特異性抗體或其抗原結合片段。在一些實施例中，鈲鹽係用於該親和層析之流動相中。本揭示提供蛋白質分析方法，其相較於其他方法提供優異的解析度及更低的機器維護成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for analyzing a mixture of proteins using affinity chromatography. In some embodiments, the proteins are heterodimeric bispecific antibodies or antigen-binding fragments thereof. In some embodiments, guanidinium salts are used in the mobile phase of the affinity chromatography. This disclosure provides protein analysis methods that provide superior resolution and lower machine maintenance than other methods.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1177" publication-number="202631656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＰＴＨ複合物及其應用</chinese-title>
        <english-title>PTH COMPLEX AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/635</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61K38/29</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="201701120260504B">A61K47/62</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P19/10</further-classification>
        <further-classification edition="200601120260504B">A61P5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖雪梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, XUEMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康立山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, LISHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金后聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, HOUCONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭永春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YONGCHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>褚敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝學琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, XUEQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張靜麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JINGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐天殊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TIANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及生物醫藥領域，更具體地，本發明涉及PTH蛋白或其活性片段和特異性結合PTH的抗體或其片段的複合物，以及其用於疾病治療的相關用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of biological medicines. More specifically, the present invention relates to a complex comprising a PTH protein or an active fragment thereof and an antibody or a fragment thereof that specifically binds to PTH, as well as uses thereof in treatment of diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1178" publication-number="202631630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橋聯雙環化合物</chinese-title>
        <english-title>BRIDGED BICYCLIC COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D495/04</main-classification>
        <further-classification edition="200601120260504B">C07D417/04</further-classification>
        <further-classification edition="200601120260504B">C07D261/14</further-classification>
        <further-classification edition="200601120260504B">C07D493/08</further-classification>
        <further-classification edition="200601120260504B">C07C255/60</further-classification>
        <further-classification edition="200601120260504B">C07C233/58</further-classification>
        <further-classification edition="200601120260504B">C07D261/02</further-classification>
        <further-classification edition="200601120260504B">C07D241/12</further-classification>
        <further-classification edition="200601120260504B">A61K31/415</further-classification>
        <further-classification edition="200601120260504B">A61K31/4365</further-classification>
        <further-classification edition="200601120260504B">A61K31/34</further-classification>
        <further-classification edition="200601120260504B">A61K31/167</further-classification>
        <further-classification edition="200601120260504B">A61K31/42</further-classification>
        <further-classification edition="200601120260504B">A61K31/4965</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商小野藥品工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東野勝人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHINO, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口亞由太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, AYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中啓貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米瑟納　漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISSNER, HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫倫　愛德溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROON, EDWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布法爾　伊莉絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUFFARD, ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴蒙　艾迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAMEN, EDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史姆蘭　舒恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMULLEN, SHAUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克瑞福　羅素</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAFT, RUSSELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[目標]提供一種藥物，其含有作為活性成分之化合物，該化合物在預防及/或治療與TMEM175相關聯之疾病中具有TMEM175活化活性。  &lt;br/&gt;[解決手段]一種由式(I)表示之化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="439px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥上可接受之鹽，其可用作在預防及/或治療與TMEM175相關聯之疾病中具有TMEM175活化活性的醫藥組成物，其中全部符號表示與說明書中描述之符號相同之意義。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Object] A drug is provided, which containing, as an active ingredient, a compound having TMEM175 activation activity in prevention and/or treatment of a disease associated with TMEM175. &lt;br/&gt;[Solution] A compound represented by formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="417px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; or a pharmaceutically acceptable salt thereof is useful as a pharmaceutical composition having TMEM175 activation activity in the prevention and/or treatment of a disease associated with TMEM175, wherein all symbols represent the same meaning as the symbols described in the specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1179" publication-number="202631587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＲＡＳ抑制劑之合成</chinese-title>
        <english-title>SYNTHESIS OF RAS INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D211/72</main-classification>
        <further-classification edition="200601120260504B">C07D207/16</further-classification>
        <further-classification edition="200601120260504B">C07D237/04</further-classification>
        <further-classification edition="200601120260504B">C07D401/14</further-classification>
        <further-classification edition="200601120260504B">C07D498/18</further-classification>
        <further-classification edition="200601120260504B">C07D498/22</further-classification>
        <further-classification edition="200601120260504B">A61K31/504</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商銳新醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REVOLUTION MEDICINES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉提莫　柏娜黛特　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LATIMER, BERNADETTE K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼薩提　蘇雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANTHATI, SURESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博莫　史蒂芬　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALLMER, STEVEN G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　小軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於Ras抑制劑、其合成中之中間物以及用於製備Ras抑制劑及中間物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to Ras inhibitors, intermediates in the synthesis thereto, and methods for preparing the Ras inhibitors and the intermediates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1180" publication-number="202632221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板的形狀評價方法以及推定模型的製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G01B11/16</main-classification>
        <further-classification edition="200601120260423B">G01B11/30</further-classification>
        <further-classification edition="202601120260423B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人關西學院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANSEI GAKUIN EDUCATIONAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豊田通商股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA TSUSHO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商庫瑞達研究股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUREDA RESEARCH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子忠昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, TADAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堂島大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOJIMA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸田晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能評價半導體基板的形狀之新穎的技術。該新穎的技術係包含：量化步驟，係根據主表面散射光強度測定值及背面散射光強度測定值量化半導體基板的形狀特徵，前述主表面散射光強度測定值係測定從前述半導體基板的主表面入射的雷射光散射而成的散射光的強度而得到，前述背面散射光強度測定值係測定從前述半導體基板的背面入射的雷射光散射而成的散射光的強度而得到。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1181" publication-number="202632275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>神經細胞的分析方法、試劑盒及神經退化性疾病的預防及／或治療藥的篩選方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N33/68</main-classification>
        <further-classification edition="200601120260504B">G01N33/53</further-classification>
        <further-classification edition="200601120260504B">G01N33/58</further-classification>
        <further-classification edition="200601120260504B">G01N21/64</further-classification>
        <further-classification edition="201001120260504B">C12N5/0793</further-classification>
        <further-classification edition="200601120260504B">C07K16/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林速人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤摂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDOH, SETSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口悠佳(宗實　悠佳)</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HARUKA(MUNEZANE,HARUKA)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種無需對TDP-43用螢光標籤等進行標記，亦無需進行基因導入，即可分析神經細胞中的TDP-43的定位量之神經細胞的分析方法；用於進行神經細胞的分析方法之試劑盒；以及神經退化性疾病的預防及/或治療藥的篩選方法。依據本發明，提供一種神經細胞的分析方法，其包括：染色步驟，使用抗TDP-43抗體及識別應激顆粒標誌之抗體對神經細胞進行免疫螢光染色；細胞區域識別步驟，識別神經細胞的細胞質及核；及分析步驟，分析細胞質中的源自TDP-43的螢光訊號及源自應激顆粒標誌的螢光訊號，並依據細胞質中的顆粒狀的TDP-43的訊號及顆粒狀的應激顆粒標誌的訊號的共定位的有無來分析神經細胞中的TDP-43的定位量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1182" publication-number="202631811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺前驅體組合物、聚醯亞胺膜、聚醯亞胺膜/基材積層體、可撓性電子裝置、及可撓性電子裝置基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G73/10</main-classification>
        <further-classification edition="200601120260420B">C08L79/08</further-classification>
        <further-classification edition="200601120260420B">C08K5/3445</further-classification>
        <further-classification edition="200601120260420B">C08K5/5419</further-classification>
        <further-classification edition="200601120260420B">C08J5/18</further-classification>
        <further-classification edition="200601120260420B">B32B27/34</further-classification>
        <further-classification edition="200601120260420B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＵＢＥ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UBE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本雄基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤座博人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAZA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小濱幸徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHAMA, YUKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOU, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之聚醯亞胺前驅體組合物含有聚醯亞胺前驅體、烷氧基矽烷、及咪唑化合物，該聚醯亞胺前驅體含有下述式(1)所表示之重複單元，且滿足特定之條件(聚醯亞胺前驅體中存在之X&lt;sub&gt;1&lt;/sub&gt;之總量之50莫耳%以上為特定之四價芳香族基的條件等)。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="219px" width="442px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(1)中，X&lt;sub&gt;1&lt;/sub&gt;為四價芳香族基等，Y&lt;sub&gt;1&lt;/sub&gt;為二價芳香族基等，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;分別獨立為氫原子等]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1183" publication-number="202631828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚有機矽氧烷</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G77/398</main-classification>
        <further-classification edition="200601120260424B">C08G77/22</further-classification>
        <further-classification edition="200601120260424B">C08L83/08</further-classification>
        <further-classification edition="201801120260424B">C08K3/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門脇和生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOWAKI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種聚有機矽氧烷，其具有下述式（1）所表示之結構。  &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="424px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，R分別獨立地為鍵結鍵X-Y所表示之基、或碳數1～4之一價烴基，  &lt;br/&gt;上述R中之至少1個R為上述鍵結鍵X-Y所表示之基，  &lt;br/&gt;上述X為包含至少1個B-O鍵之二價有機基，  &lt;br/&gt;上述Y具有共軛之3個以上6個以下之芳香族六員環，  &lt;br/&gt;n為1以上之整數）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1184" publication-number="202631118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>精氨酸布洛芬口服溶液</chinese-title>
        <english-title>IBUPROFEN ARGINATE ORAL SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/192</main-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/36</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商法瑪爾德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARMALIDER, S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑斯　梅嫩德斯　努莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANZ MENENDEZ, NURIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波爾托萊斯　佩雷斯　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORTOLES PEREZ, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾加斯　卡斯特里翁　埃米利奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGAS CASTRILLON, EMILIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑特　塞爾納　路易斯　納西索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTE SERNA, LUIS NARCISO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種精氨酸布洛芬口服溶液，其包含黃原膠作為唯一增稠劑、麥芽糖醇液和純淨水作為唯一溶劑。所述口服溶液具有物理化學穩定性，並且具有最佳黏度和感官特性。本發明還涉及用於治療之用途的所述組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an ibuprofen arginate oral solution comprising xanthan gum as sole viscosizing agent, liquid maltitol and purified water as sole solvent. The oral solution is physicochemically stable and has optimal viscosity and organoleptic properties. The invention also relates to said composition for use in therapy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1185" publication-number="202631675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與ＣＤ３結合之抗體及其用途</chinese-title>
        <english-title>ANTIBODIES THAT BIND TO CD3 AND USES THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪荷　羅倫佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEHO, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋裡佩爾　澤維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERIPEL, XAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏林　尼可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORIN, NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉　薩拉　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LA SALA, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅涅蒂　埃琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENIETTI, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬戈內　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGONE, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼拉坎丹　阿帕爾納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEELAKANDHAN, APARNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛斯納　克里斯俊　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GASSNER, CHRISTIAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤瑪那　費爾南德斯　帕洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMANA FERNANDEZ, PABLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>品洽　慕帝塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINCHA, MUDITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯納　艾克哈得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOESSNER, EKKEHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡根麥特　亞德藍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGENMATTER, ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊　克里斯俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了與 CD3 結合之抗體、特定而言 pH 反應性抗 CD3 抗體及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides antibodies that bind to CD3, particularly pH responsive anti-CD3 antibodies and methods of using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1186" publication-number="202633440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱傳導片和熱傳導片的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W40/10</main-classification>
        <further-classification edition="202201120260422B">B22F1/00</further-classification>
        <further-classification edition="200601120260422B">B22F7/08</further-classification>
        <further-classification edition="201101120260422B">B82Y30/00</further-classification>
        <further-classification edition="201101120260422B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋谷弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波木秀次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIKI, HIDETSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙奕靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YIJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶋田和人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADA, KAZUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱傳導片，其具有金屬層和在前述金屬層的至少第一面上的複數個凸部，前述凸部含有燒結性金屬粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熱傳導片</p>
        <p type="p">11:金屬層</p>
        <p type="p">12:凸部</p>
        <p type="p">A-A&lt;i&gt;'&lt;/i&gt;:剖面線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1187" publication-number="202632930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法、資訊處理裝置、及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H04L27/26</main-classification>
        <further-classification edition="201701120260423B">H04B7/024</further-classification>
        <further-classification edition="200901120260423B">H04W24/10</further-classification>
        <further-classification edition="202301120260423B">H04W72/0453</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提高接收側裝置對與接收信號的傳播特性相關之資訊的報告效率。  &lt;br/&gt;　　由電腦執行以下：取得在接收側裝置接收到的第一信號的同調頻寬；以及基於第一信號的同調頻寬，取得接收側裝置在取得第一信號的複數個子頻帶各自與傳播特性相關之資訊時的子頻帶數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1188" publication-number="202631573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、藉由使用其處理含金屬層的方法及藉由使用其製造半導體裝置的方法</chinese-title>
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C233/47</main-classification>
        <further-classification edition="200601120260504B">C09K13/00</further-classification>
        <further-classification edition="200601120260504B">C23F1/10</further-classification>
        <further-classification edition="200601120260504B">C23F1/34</further-classification>
        <further-classification edition="200601120260504B">C23F1/36</further-classification>
        <further-classification edition="200601120260504B">C23F1/38</further-classification>
        <further-classification edition="200601120260504B">C23F1/40</further-classification>
        <further-classification edition="200601120260504B">C23G1/18</further-classification>
        <further-classification edition="200601120260504B">C23G1/20</further-classification>
        <further-classification edition="200601120260504B">C11D7/04</further-classification>
        <further-classification edition="200601120260504B">C11D7/32</further-classification>
        <further-classification edition="200601120260504B">C11D7/34</further-classification>
        <further-classification edition="200601120260504B">C11D7/36</further-classification>
        <further-classification edition="202601120260504B">H10P50/26</further-classification>
        <further-classification edition="202601120260504B">H10P50/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹園植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, WONSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高基淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, GIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵珍惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JINHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙旻炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MINHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物、一種藉由使用其處理含金屬層的方法及一種藉由使用其製造半導體裝置的方法，該組成物包括氧化劑、以銨為主之緩衝劑及蝕刻控制劑，其中該蝕刻控制劑包括由式1表示之化合物。式1之描述提供於本說明書中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composition, a method of treating a metal-containing layer by using the same, and a method of manufacturing a semiconductor device by using the same, the composition including an oxidizing agent, an ammonium-based buffer, and an etching controller, wherein the etching controller includes a compound represented by Formula 1. A description of Formula 1 is provided in the specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:含金屬層</p>
        <p type="p">2a:強鍵</p>
        <p type="p">2b:疏水性基團</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1189" publication-number="202631221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生腫瘤治療場的換能器陣列及生產的方法及其用途</chinese-title>
        <english-title>TRANSDUCER ARRAY GENERATING TUMOR TREATING FIELD AND METHODS OF PRODUCTION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61N1/36</main-classification>
        <further-classification edition="200601120260504B">A61N1/04</further-classification>
        <further-classification edition="200601120260504B">A61N1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯勞里斯　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESLAURIERS, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種換能器陣列，其包含：一電極總成，其可操作以供應具有一頻率在50 kHz至1 MHz之一範圍內的一交流電波形之一電信號；及一導電皮膚鄰近層，其附接至一導電層。該電極總成包含：一基板；一導電層；及一可移動連接器，其在該基板與該導電層之間延伸。該可移動連接器係由一導電材料建構，且可移動以便使得該導電層能夠相對於該基板移動，以便允許該導電層回應於患者皮膚之移動而移動。該導電皮膚鄰近層提供該導電層與該患者皮膚之間的一電介面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer array, comprising an electrode assembly, operable to supply an electrical signal having an alternating current waveform at a frequency in a range from 50 kHz to 1 MHz, and a conductive skin adjacent layer attached to an electrically conductive layer. The electrode assembly comprises a substrate; an electrically conductive layer; and a movable connector extending between a substrate and the electrically conductive layer. The movable connector is constructed of an electrically conductive material and movable so as to enable movement of the electrically conductive layer relative to the substrate so as to permit movement of the electrically conductive layer responsive to movement of the patient's skin. The conductive skin adjacent layer provides an electrical interface between the electrically conductive layer and the patient's skin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">58:導電引線</p>
        <p type="p">70:換能器陣列</p>
        <p type="p">104:電極總成</p>
        <p type="p">108:撓曲電線</p>
        <p type="p">132:外邊緣</p>
        <p type="p">140:基板</p>
        <p type="p">154:可移動連接器</p>
        <p type="p">162:導電層</p>
        <p type="p">172a:前部</p>
        <p type="p">172b:背部</p>
        <p type="p">174a:第一側</p>
        <p type="p">174b:第二側</p>
        <p type="p">x:x軸</p>
        <p type="p">y:y軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1190" publication-number="202631637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螺雜環類化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>A SPIRO HEREROCYCLIC COMPOUND, A PREPARATION METHOD THEREOF AND A MEDICAL USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D519/00</main-classification>
        <further-classification edition="200601120260504B">A61K31/437</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董懷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HUAIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏珩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬俊力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, JUNLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳一千</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及螺雜環類化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的螺雜環類化合物、其製備方法及含有該類化合物的醫藥組成物以及其作為治療劑的用途，特別是作為PRMT5抑制劑的用途和用於治療和/或預防癌症的用途。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="188px" width="300px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a spiro heterocyclic compound, a preparation method thereof and a medical use thereof. In particular, the present disclosure relates to a spiro heterocyclic compound shown in general formula (I), its preparation method, a pharmaceutical composition containing such compound and its use as a therapeutic agent, especially as a PRMT5 inhibitor, and its use in the preparation of a medicament for the treatment and/or prevention a cancer.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="194px" width="315px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1191" publication-number="202632995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻識別（ＲＦＩＤ）及無線廣域網路（ＷＷＡＮ）通訊的實體層並行管理</chinese-title>
        <english-title>PHYSICAL LAYER CONCURRENCY MANAGEMENT FOR RADIO FREQUENCY IDENTIFICATION (RFID) AND WIRELESS WIDE AREA NETWORK (WWAN) COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04W72/0453</main-classification>
        <further-classification edition="202301120260504B">H04W72/12</further-classification>
        <further-classification edition="202301120260504B">H04W72/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈戈帕蘭　文卡特拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJAGOPALAN, VENKATRAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂　昇元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷傑　里夏夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REJ, RISHAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡佛　斯科特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOVER, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕提爾　基蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, KIRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　阿魯納瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUDHURI, ARUNAVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　清新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QINGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍馬特　布佩希　馬諾哈爾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMATT, BHUPESH MANOHARLAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯克　約瑟夫　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKE, JOSEPH PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕塔納亞克　烏塔姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATTANAYAK, UTTAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示用於無線通訊的系統、設備、程序、及電腦可讀取媒體。例如，運算裝置可基於對該運算裝置的資源的限制來判定該運算裝置上的射頻識別(RFID)操作及無線廣域網路(WWAN)操作的一排程。該等資源可包括運算資源及/或射頻(RF)組件資源。運算裝置可基於該排程在該運算裝置上執行該等RFID操作及該等WWAN操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are systems, apparatuses, processes, and computer-readable media for wireless communications. For example, a computing device can determine, based on constraints on resources of the computing device, a schedule for radio frequency identification (RFID) operations and wireless wide area network (WWAN) operations on the computing device. The resources can include compute resources and/or radio frequency (RF) component resources. The computing device can perform, based on the schedule, the RFID operations and the WWAN operations on the computing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1115:RFID堆疊</p>
        <p type="p">1125:WWAN堆疊</p>
        <p type="p">1140:第一時間段</p>
        <p type="p">1142:第二時間段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1192" publication-number="202631222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有經電連接之子組件的換能器陣列</chinese-title>
        <english-title>TRANSDUCER ARRAY WITH ELECTRICALLY CONNECTED SUBASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A61N1/36</main-classification>
        <further-classification edition="200601120260422B">A61N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVOCURE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉維伊　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALAVEE, NOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各比　艾利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI, ELIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果龍　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLOM, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於將腫瘤治療場遞送至一個體之身體的換能器設備，該換能器設備包括：第一及第二電極子組件，各子組件經組態以定位在該個體之身體上方，其中該子組件之一正面面向該個體之身體，各子組件具有與該正面相對之一背面，各子組件包含：至少一個電極元件；一各向異性材料層，其電耦接至該至少一個電極元件，該各向異性材料層包含面向該個體之身體的一正面及與該正面相對之一背面，該背面面向至少一個第一電極元件；及一可撓性電連接器，其電連接該等第一及第二電極子組件，其中該等第一及第二電極子組件藉由該可撓性電連接器分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transducer apparatus for delivering tumor treating fields to a subject's body, the transducer apparatus including: first and second electrode subassemblies, each subassembly configured to be positioned over the subject's body with a front face of the subassembly facing the subject's body, each subassembly having a back face opposite the front face, each subassembly comprising: at least one electrode element; an anisotropic material layer electrically coupled to the at least one electrode element, the anisotropic material layer comprising a front face facing the subject's body and a back face opposite the front face, the back face facing the at least one first electrode element; and a flexible electrical connector electrically connecting the first and second electrode subassemblies, wherein the first and second electrode subassemblies are separated by the flexible electrical connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:換能器設備</p>
        <p type="p">101:第一電極子組件</p>
        <p type="p">102A:電極元件</p>
        <p type="p">102B:電極元件</p>
        <p type="p">102C:電極元件</p>
        <p type="p">102D:電極元件</p>
        <p type="p">103:第二電極子組件</p>
        <p type="p">104:基板</p>
        <p type="p">104(1):虛線</p>
        <p type="p">104(2):虛線</p>
        <p type="p">106:可撓性印刷電路板(PCB)</p>
        <p type="p">108:可撓性電連接器</p>
        <p type="p">110:各向異性材料層</p>
        <p type="p">114:背面</p>
        <p type="p">124:發泡材料層</p>
        <p type="p">126:空白空間</p>
        <p type="p">129:背面</p>
        <p type="p">134:發泡材料層</p>
        <p type="p">1C-1C':截面</p>
        <p type="p">1D-1D':截面</p>
        <p type="p">S:可調整距離</p>
        <p type="p">X:矢狀平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1193" publication-number="202632012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟磁複合材料及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251016B">C22C1/04</main-classification>
        <further-classification edition="200601120251016B">C22C33/02</further-classification>
        <further-classification edition="202201120251016B">B22F1/10</further-classification>
        <further-classification edition="200601120251016B">H01F1/14</further-classification>
        <further-classification edition="200601120251016B">H01F41/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州新川新材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU XINCHUAN NEW MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝上川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, SHANGCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種軟磁複合材料及其製備方法，屬於軟磁材料技術領域。軟磁複合材料的製備方法，包括將鐵、鎳、錳、鋁、矽、鉻製備D50粒徑為100-3000nm的超細合金粉末，再將超細合金粉末先與3-氨丙基三乙氧基矽烷和正矽酸乙酯反應，再與環丁烷四甲酸二酐和3-氨基二苯甲酮反應，製備得到軟磁複合材料。本發明公開了一種直流偏置性能優異、品質因數優異的軟磁複合材料及其製備方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1194" publication-number="202632013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟磁合金粉末及其製備方法與應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251016B">C22C1/04</main-classification>
        <further-classification edition="200601120251016B">C22C33/02</further-classification>
        <further-classification edition="200601120251016B">B22F9/12</further-classification>
        <further-classification edition="200601120251016B">H01F41/02</further-classification>
        <further-classification edition="200601120251016B">H01F1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州新川新材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU XINCHUAN NEW MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝上川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, SHANGCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種軟磁合金粉末及其製備方法與應用，涉及磁性材料技術領域。具體製備方法包括：首先在惰性氣氛下，將各種原料混合加熱熔煉成合金，繼續加熱得到混合蒸汽，將混合蒸汽冷凝後收集得到合金粉末；然後以有機矽樹脂作為絕緣材料，將絕緣材料加入溶劑中，接著再加入合金粉末混勻，最後經過乾燥得到軟磁合金粉末。本發明方法製程簡單，生產週期短，且本發明製備得到的軟磁合金粉末製成的軟磁芯，具有起始磁導率高，磁芯損耗低的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1195" publication-number="202631128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含芳環類生物拮抗劑在製備治療或預防腎臟疾病藥物中的應用</chinese-title>
        <english-title>APPLICATION OF AROMATIC RING-CONTAINING BIOLOGICAL ANTAGONISTS IN THE PREPARATION OF DRUGS FOR THE TREATMENT OR PREVENTION OF KIDNEY DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/422</main-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余　祥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, XIANGQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶玉瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, YUYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱明杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MINGJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周遠鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及含芳環類生物拮抗劑在製備治療或預防腎臟疾病藥物中的應用，具體而言，提供了4’-((2-丁基-4-側氧-1,3-二氮螺環[4.4]壬-1-烯-3-基)甲基-d2)-N-(4-氯-5-甲基異噁唑-3-基)-2’-(乙氧基甲基)-[1,1’-聯苯]-2-磺醯胺化合物或其可藥用鹽在製備治療或預防腎臟疾病藥物，特別是在製備治療或預防局灶節段性腎小球硬化和免疫球蛋白A腎病藥物中的用途。該化合物或其可藥用鹽顯示出對局灶節段性腎小球硬化和免疫球蛋白A腎病具有優異的療效，具有顯著臨床應用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the application of aromatic ring-containing biological antagonists in the preparation of drugs for the treatment or prevention of kidney diseases. Specifically, it provides the use of 4'-((2-butyl-4-oxo-1,3-diazaspiro[4.4]non-1-en-3-yl)methyl-d2)-N-(4-chloro-5-methylisoxazol-3-yl)-2'-(ethoxymethyl)-[1,1'-biphenyl]-2-sulfonamide compounds or their pharmaceutically acceptable salts in the preparation of drugs for the treatment or prevention of kidney diseases, particularly in the preparation of drugs for the treatment or prevention of focal segmental glomerulosclerosis and immunoglobulin A nephropathy. The compound or its pharmaceutically acceptable salt has shown excellent therapeutic effects on focal segmental glomerulosclerosis and immunoglobulin A nephropathy, and has significant clinical application value.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1196" publication-number="202631625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酮醯胺化合物及其醫藥用途</chinese-title>
        <english-title>KETOAMIDE COMPOUND AND PHARMACEUTICAL USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/10</main-classification>
        <further-classification edition="200601120260504B">C07D471/10</further-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/5383</further-classification>
        <further-classification edition="200601120260504B">A61K31/4439</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/454</further-classification>
        <further-classification edition="200601120260504B">A61K31/4155</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本煙草產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN TOBACCO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足達馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水上旬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUKAMI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉谷義憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMATANI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上岡史人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEOKA, FUMITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大倉隆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKURA, RYUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山貴博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係關於具有LMP7抑制活性之酮醯胺化合物或其製藥上所容許之鹽、包含其之醫藥組成物及其等的醫藥用途等。本發明之解決手段係提供一種式[Ia]所表示之化合物或其製藥上所容許之鹽，  &lt;br/&gt;&lt;img align="absmiddle" height="303px" width="320px" file="ed10160.JPG" alt="ed10160.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，各記號係如同本說明書所記載]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to ketoamide compounds, or pharmaceutically acceptable salts thereof, having LMP7 inhibitory activity, pharmaceutical compositions comprising the same, and pharmaceutical use thereof. Provided is a compound of formula [Ia]: &lt;br/&gt;&lt;img align="absmiddle" height="316px" width="307px" file="ed10161.JPG" alt="ed10161.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt thereof, &lt;br/&gt;wherein each symbol is as described herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1197" publication-number="202631661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種製備異源多聚體的方法及應用</chinese-title>
        <english-title>A METHOD FOR PREPARING HETEROMULTIMERS AND THEIR APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/00</main-classification>
        <further-classification edition="200601120260504B">C07K16/46</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞國勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIAN, GUOYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, ZHENDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種製備異源多聚體的方法及應用，還涉及改變CH3結構域的胺基酸以促進形成異源多聚體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a method for preparing heteromultimers and their applications, and also relates to altering amino acids in the CH3 domain to promote heteromultimer formation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1198" publication-number="202631114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＲＥＭ的脂質奈米顆粒配製物</chinese-title>
        <english-title>LIPID NANOPARTICLE FORMULATIONS OF TREMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K9/51</main-classification>
        <further-classification edition="202501120260504B">A61K9/127</further-classification>
        <further-classification edition="200601120260504B">A61K31/7115</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/24</further-classification>
        <further-classification edition="200601120260504B">A61K47/28</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="201001120260504B">C12N15/113</further-classification>
        <further-classification edition="200601120260504B">C12N15/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VI, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　保羅　家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PAULO JIA CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　英　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAM, YING K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾克霍恩　史蒂芬　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EICHHORN, STEPHEN WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基斯曼　威廉　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIESMAN, WILLIAM F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科勒　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHRER, CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬漢　哈什　瓦爾丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUHAN, HARSH VARDHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普雷齊奧索　薩曼莎　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREZIOSO, SAMANTHA MICHELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑薩爾　伊莎貝爾　米里亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANSAL, ISABELLE MYRIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　偉東　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEIDONG GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露總體上關於配製在脂質奈米顆粒中的具有非天然存在的修飾的基於tRNA的效應分子（TREM）及其相關組成物及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates generally to tRNA-based effector molecules (TREMs) formulated in lipid nanoparticles having a non-naturally occurring modification and compositions and methods relating thereto.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1199" publication-number="202631111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微針結構體及其製造方法、以及微針貼片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K9/00</main-classification>
        <further-classification edition="200601120260504B">A61K9/70</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/32</further-classification>
        <further-classification edition="201701120260504B">A61K47/34</further-classification>
        <further-classification edition="200601120260504B">A61M37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍間祐子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUMA, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高麗洋佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種微針結構體，係具備於內部具有流路之針狀部，流路開口於前述針狀部的表面，而於流路的內部表面形成有含親水性物質之塗膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:微針結構體</p>
        <p type="p">2:針狀部</p>
        <p type="p">3:基部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1200" publication-number="202633517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將半導體元件接合至基板的方法</chinese-title>
        <english-title>METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W80/00</main-classification>
        <further-classification edition="202601120260424B">H10W72/90</further-classification>
        <further-classification edition="202601120260424B">H10W29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫利克和索夫工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅西摩二世　湯瑪士　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOSIMO, JR., THOMAS J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種將半導體元件接合至基板的方法。該方法包含以下步驟：（a）使用一接合工具攜載該半導體元件，該半導體元件包含第一複數個導電結構；（b）使用一支撐結構支撐該基板，該基板包含第二複數個導電結構；（c）加熱該第一複數個導電結構和該第二複數個導電結構的至少其中之一，使得（i）該第一複數個導電結構和（ii）該第二複數個導電結構的該至少其中之一膨脹；（d）將該第一複數個導電結構接合至該第二複數個導電結構中的對應的複數個；以及（e）在步驟（d）之後，將該半導體元件的一介電質表面接合至該基板的一介電質表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of bonding a semiconductor element to a substrate is provided. The method includes the steps of: (a) carrying the semiconductor element with a bonding tool, the semiconductor element including a first plurality of conductive structures; (b) supporting the substrate with a support structure, the substrate including a second plurality of conductive structures; (c) heating at least one of the first plurality of conductive structures and the second plurality of conductive structures such that at least one of (i) the first plurality of conductive structures and (ii) the second plurality of conductive structures expands; (d) bonding the first plurality of conductive structures to corresponding ones of the second plurality of conductive structures; and (e) bonding a dielectric surface of the semiconductor element to a dielectric surface of the substrate after step (d).</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:步驟</p>
        <p type="p">202:步驟</p>
        <p type="p">204:步驟</p>
        <p type="p">206:步驟</p>
        <p type="p">208:步驟</p>
        <p type="p">210:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1201" publication-number="202632837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於能量儲存系統之自主供應應用之發電廠控制</chinese-title>
        <english-title>PLANT CONTROLS FOR SELF-SUPPLY APPLICATIONS OF ENERGY STORAGE SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H02J9/06</main-classification>
        <further-classification edition="200601120260422B">H01M10/42</further-classification>
        <further-classification edition="200601120260422B">H01M10/48</further-classification>
        <further-classification edition="202101120260422B">H01M50/204</further-classification>
        <further-classification edition="202101120260422B">H01M50/258</further-classification>
        <further-classification edition="202101120260422B">H01M50/507</further-classification>
        <further-classification edition="202601120260422B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富安能源有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUENCE ENERGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布勞恩　班傑明　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAUN, BENJAMIN JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　玉寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, NGOC BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊森尼斯　托爾本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIESENISS, THORBEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿瓦尼蒂斯　揚尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARVANITIS, IOANNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有一自主供應模式的能量儲存系統包括複數個電池組能量儲存系統(BESS)模組、一發電廠控制器、及一輔助系統。當該能量儲存系統係與一電網斷連時，該發電廠控制器以一自主供應模式操作該能量儲存系統，以供應電力至該輔助系統。該自主供應模式包括監測可充電BESS外殼之各者的充電狀態(SoC)參數，依序啟動該等可充電BESS外殼之一者以供應電力至該輔助系統，且在判定該等可充電BESS外殼之該者之SoC小於一臨限後，即停用該一個可充電BESS外殼並啟動該複數個可充電BESS外殼中之另一者以供應電力至該輔助系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy storage system having a self-supply mode includes a plurality of battery energy storage system (BESS) modules, a plant controller, and an auxiliary system. The plant controller operates the energy storge system in a self-supply mode to supply electric power to the auxiliary system when the energy storage system is disconnected from an electric grid. The self-supply mode includes monitoring, for each of the rechargeable BESS enclosures, a state of charge parameter (SoC), sequentially activating one of the rechargeable BESS enclosures to supply electric power to the auxiliary system, and upon determining that the SoC of the one of the rechargeable BESS enclosures is less than a threshold, deactivating the one rechargeable BESS enclosure and activating another of the plurality of rechargeable BESS enclosures to supply electric power to the auxiliary system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1202" publication-number="202631869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有含氟聚合物之組成物及成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08L27/12</main-classification>
        <further-classification edition="200601120260422B">C08K3/34</further-classification>
        <further-classification edition="200601120260422B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上谷文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, FUMIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田大助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物，其含有含氟聚合物、及複合粒子，且上述複合粒子係載體載持有氨產生化合物之複合粒子，上述載體係選自由碳化矽、氧化鋁、氧化鈦、二氧化矽、氧化鋯、氧化鈰、矽鋁（silica alumina）、氧化鈣（calcia）、氧化鎂及碳黑所組成之群中之至少一種，上述氨產生化合物係藉由加熱而產生氨之化合物，對於全氟己烷具有不溶性，且比重較全氟己烷於20℃之比重小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1203" publication-number="202633143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10D80/20</main-classification>
        <further-classification edition="202501120260424B">H10D62/10</further-classification>
        <further-classification edition="202601120260424B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錫源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEOKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宣姃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括設置在基板上並在第一方向上延伸的通道；在第二方向上延伸的閘極結構，其中閘極結構環繞通道在第一方向上的第一端部的至少一部分；電性連接至通道並沿著通道的第一端部在第一方向上的側壁在垂直方向上延伸的位元線；以及設置於通道的第二端部在第一方向上的側壁處的電容器，通道的第二端部為通道在第一方向上面向通道的第一端部的端部，其中通道的第二端部在第一方向上的側壁包括上側壁和下側壁，並且上側壁和下側壁匯聚以形成V形構型，其頂點由上側壁和下側壁形成並朝向通道的內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The semiconductor device include a channel disposed on a substrate and extending in a first direction; a gate structure extending in a second direction, wherein the gate structure surrounds at least a portion of a first end portion in the first direction of the channel; a bit line electrically connected to the channel and extending in a vertical direction along a sidewall in the first direction of the first end portion of the channel; and a capacitor disposed at a sidewall in the first direction of a second end portion of the channel, the second end portion of the channel being an end portion in the first direction of the channel facing the first end portion of the channel, wherein the sidewall in the first direction of the second end portion of the channel includes an upper and a lower sidewalls, and the upper sidewall and the lower sidewall converge to form a V-shaped configuration, with a vertex formed by the upper and the lower sidewalls being oriented toward an interior of the channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">125:通道</p>
        <p type="p">352:第一埋置圖案</p>
        <p type="p">354:第二埋置圖案</p>
        <p type="p">356:第三埋置圖案</p>
        <p type="p">358:埋置結構</p>
        <p type="p">360:閘極絕緣圖案</p>
        <p type="p">370:閘極電極</p>
        <p type="p">380:閘極遮罩</p>
        <p type="p">440:位元線</p>
        <p type="p">515:歐姆接觸</p>
        <p type="p">520:第一電容器電極</p>
        <p type="p">530:介電圖案</p>
        <p type="p">540:第二電容器電極</p>
        <p type="p">550:電容器</p>
        <p type="p">560:板狀電極</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">S1:第一側壁</p>
        <p type="p">S2:第二側壁</p>
        <p type="p">SDR1:第一源極/汲極區</p>
        <p type="p">SDR2:第二源極/汲極區</p>
        <p type="p">X:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1204" publication-number="202632894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合基板及彈性表面波元件</chinese-title>
        <english-title>COMPOSITE SUBSTRATE AND SURFACE ACOUSTIC WAVE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H03H9/25</main-classification>
        <further-classification edition="202301120260423B">H10N30/853</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種包含具有高體積電阻率之非晶質矽層，且顯著抑制電氣損失的複合基板。依本發明之實施態樣的複合基板，係依序包含支持基板、非晶質矽層及壓電層。在一實施態樣中，非晶質矽層之拉曼光譜中的TO峰值之半高寬係在95（cm&lt;sup&gt;-1&lt;/sup&gt;）以下。在另一實施態樣中，非晶質矽層之拉曼光譜中的TA/TO峰值強度比係在0.485以下</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide a composite substrate which contains an amorphous silicon layer having a high volume resistivity and in which electrical loss is significantly suppressed. A composite substrate according to an embodiment of the invention comprises a support substrate, an amorphous silicon layer, and a piezoelectric layer in that order. In one embodiment, the full width at half maximum of the TO peak in the Raman spectrum of the amorphous silicon layer is 95 (cm&lt;sup&gt;-1&lt;/sup&gt;) or less. In another embodiment, the TA/TO peak intensity ratio in the Raman spectrum of the amorphous silicon layer is 0.485 or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支持基板</p>
        <p type="p">20:非晶質矽層</p>
        <p type="p">30:介電層</p>
        <p type="p">40:壓電層</p>
        <p type="p">100:複合基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1205" publication-number="202632738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生電感耦合電漿之系統與改良電漿之點燃的方法</chinese-title>
        <english-title>SYSTEM FOR GENERATING INDUCTIVELY-COUPLED PLASMA AND METHOD OF IMPROVING IGNITION OF PLASMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德克爾　羅納德　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECKER, RONALD ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布塔　伊姆蘭　艾哈邁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUTTA, IMRAN AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，本揭露係關於一種用於產生電感耦合電漿之系統。該系統包括一介電管及一電感線圈電路。該電感線圈電路包括包圍該介電管且彼此串聯連接之電感線圈。介入電容器可切換地耦接在該等電感線圈之間。一控制電路經組態以在判定一電漿將點燃時，使得該等介入電容器中之至少一者在該電漿之點燃期間自該電感線圈電路切換出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, the present disclosure is directed to a system for generating inductively-coupled plasma. The system includes a dielectric tube and an inductive coil circuit. The inductive coil circuit includes inductive coils surrounding the dielectric tube and connected in series to each other. Intervening capacitors are switchably coupled between the inductive coils. A control circuit is configured to, upon determining a plasma will be ignited, cause at least one of the intervening capacitors to be switched out of the inductive coil circuit during ignition of the plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:ICP源</p>
        <p type="p">202:製程氣體源</p>
        <p type="p">203:製程氣體</p>
        <p type="p">204:RF功率源</p>
        <p type="p">206:介電管</p>
        <p type="p">207:電感耦合電漿</p>
        <p type="p">209:電漿</p>
        <p type="p">210:第一電感線圈電路</p>
        <p type="p">211:電感線圈</p>
        <p type="p">212:電感線圈</p>
        <p type="p">213:電感線圈</p>
        <p type="p">214:電感線圈</p>
        <p type="p">221:介入電容器</p>
        <p type="p">222:介入電容器</p>
        <p type="p">223:介入電容器</p>
        <p type="p">231:開關</p>
        <p type="p">232:開關</p>
        <p type="p">233:開關</p>
        <p type="p">241:電容器</p>
        <p type="p">242:電容器</p>
        <p type="p">250:控制電路</p>
        <p type="p">ICP:電感耦合電漿</p>
        <p type="p">-V:第一輸出端子</p>
        <p type="p">+V:第二輸出端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1206" publication-number="202633180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137797</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/86</main-classification>
        <further-classification edition="202501120260424B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳相赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SANGHYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宣姃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭丞眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SEUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳成男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, SUNGNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置可包括：在第一方向上延伸的位元線；位元線上的通道，通道在垂直於位元線的上表面的垂直方向上延伸，且通道包含氧化物半導體材料；在第一方向上從通道依序堆疊的閘極絕緣圖案和閘極電極；以及接觸結構。接觸結構可包括：通道上的第一接觸圖案，第一接觸圖案包含還原材料；第一接觸圖案上的第二接觸圖案，第二接觸圖案包含相對於通道具有等於或小於約0.2電子伏特的蕭特基障壁高度（Schottky Barrier Height，SBH）的材料；以及第二接觸圖案上的第三接觸圖案，第三接觸圖案包含導電材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may include a bit line extending in a first direction, a channel on the bit line, the channel extending in a vertical direction perpendicular to an upper surface of the bit line, and the channel including an oxide semiconductor material, a gate insulating pattern and a gate electrode sequentially stacked in the first direction from the channel, and a contact structure. The contact structure may include a first contact pattern on the channel, the first contact pattern including a reducing material, a second contact pattern on the first contact pattern, the second contact pattern including a material with a Schottky Barrier Height (SBH) with respect to the channel that is equal to or less than about 0.2eV and a third contact pattern on the second contact pattern, the third contact pattern including an electrically conductive material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">110:第一絕緣層</p>
        <p type="p">120:第二絕緣圖案</p>
        <p type="p">130:位元線</p>
        <p type="p">140:第三絕緣圖案</p>
        <p type="p">160:第二絕緣夾層圖案</p>
        <p type="p">170:第三絕緣夾層圖案</p>
        <p type="p">195:通道</p>
        <p type="p">235:閘極絕緣圖案</p>
        <p type="p">245:閘極電極</p>
        <p type="p">250:第四絕緣圖案</p>
        <p type="p">255:第四絕緣夾層圖案</p>
        <p type="p">265:第一接觸圖案</p>
        <p type="p">275:第二接觸圖案</p>
        <p type="p">285:第三接觸圖案</p>
        <p type="p">287:障壁圖案</p>
        <p type="p">290:接觸結構</p>
        <p type="p">300:第五絕緣夾層圖案</p>
        <p type="p">310:第一電容器電極</p>
        <p type="p">320:介電層</p>
        <p type="p">330:第二電容器電極</p>
        <p type="p">340:電容器</p>
        <p type="p">350:板電極</p>
        <p type="p">B-B':線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1207" publication-number="202632839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137799</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於零電流切換之設備及系統</chinese-title>
        <english-title>APPARATUS AND SYSTEM FOR ZERO CURRENT SWITCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">H02J50/10</main-classification>
        <further-classification edition="200601120260504B">H01F38/28</further-classification>
        <further-classification edition="200601120260504B">H02M3/04</further-classification>
        <further-classification edition="201901120260504B">B60L53/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商銳萊控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RELECTRIFY HOLDINGS PTY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅科　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCCO, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托馬斯　威廉　皮爾遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEARSON,THOMAS WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種具有複數個初級電池模組之模組化電力管理系統。在每一初級模組中，存在一橋式電路，其在一初級控制器之控制下且經組態以將一或多個電池電芯操作性地耦合至與一初級磁通引導件相關聯之一初級繞組。每一初級磁通引導件藉由磁通與來自一次級磁通引導件群組之一次級磁通引導件耦合，以藉此形成一組互補磁通引導件。該次級磁通引導件群組與一共用次級繞組相關聯，且其中該次級繞組與一電容器連接以藉此促進一振盪電流。每一初級模組之每一初級繞組與該次級繞組共用該振盪電流。每一初級控制器經組態以判定電壓及電流量值及相位，且控制初級橋接器之導電以管理該一或多個電池電芯之電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular power management system with a plurality of primary battery modules. In each primary module there a bridge circuit under the control of a primary controller and configured to operatively couple one or more battery cells to a primary winding associated with a primary flux guide. Each primary flux guide is coupled by magnetic flux with a secondary flux guide from a group of secondary flux guides to thereby form a set of complementary flux guides. The group of secondary flux guides is associated with a shared secondary winding, and where the secondary winding connected with a capacitor to thereby facilitate an oscillatory current. Each primary winding of each primary module shares the oscillatory current with the secondary winding. Each primary controller is configured to determine the voltage and current magnitude and phase, and control conduction of the primary bridge to manage the current of the one or more battery cells.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:磁耦合設備</p>
        <p type="p">510:次級磁通引導件</p>
        <p type="p">51a:第二初級繞組段</p>
        <p type="p">522:端子連接器</p>
        <p type="p">524:次級繞組</p>
        <p type="p">530:絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1208" publication-number="202632508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過嵌入式邏輯橋實現高頻寬記憶體小晶片、輸入／輸出小晶片和運算小晶片之非相鄰連接</chinese-title>
        <english-title>NON-ADJACENT CONNECTION OF HIGH-BANDWIDTH MEMORY CHIPLETS, I/O CHIPLETS, AND COMPUTE CHIPLETS THROUGH EMBEDDED LOGIC BRIDGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260423B">G06F12/0893</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商開放人工智慧有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPENAI OPCO, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　凱夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CLIVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIAN-MIN RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利裡　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEARY, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉亞納斯瓦米　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAYANASWAMI, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波薩德　戴文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERSAUD, DEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦伊迪亞納坦　考希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAIDYANATHAN, KAUSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高頻寬記憶體(HBM)小晶片和運算小晶片之系統包含嵌入式邏輯橋，該等嵌入式邏輯橋將自該等HBM小晶片至其他小晶片之通訊距離延伸成超出由JEDEC標準施加之約6 mm限制。該等嵌入式邏輯橋包含高速度(例如，大於1 Gbps)通訊電路，該等高速度通訊電路在不會衰減至接收器之偵測臨限值以下的情況下驅動通訊信號更長距離。該等更長高速度通訊距離使得更多HBM小晶片能夠連接至一運算小晶片(及其他小晶片，諸如I/O或其他運算小晶片)，以支援高效能運算及機器學習/人工智慧中之運算工作負載，該等運算工作負載依賴於對大量記憶體之存取來進行高效操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system of high bandwidth memory (HBM) chiplets and compute chiplets includes embedded logic bridges that extend communication distances from the HBM chiplets to other chiplets beyond the ~6 mm limit imposed by the JEDEC standard. The embedded logic bridges include high-speed (e.g., greater than 1 Gbps) communication circuits that drive communication signals longer distances without fading below the detection threshold of the receiver. The longer high-speed communication distances enable more HBM chiplets to connect to a compute chiplet (and other chiplets, such as I/O or other compute chiplets) to support computational workloads in high-performance computing and machine learning/artificial intelligence, which depend on access to large amounts of memory for efficient operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:運算小晶片</p>
        <p type="p">200:系統</p>
        <p type="p">204:遠高頻寬記憶體堆疊</p>
        <p type="p">206:嵌入式邏輯橋</p>
        <p type="p">208:近高頻寬記憶體堆疊</p>
        <p type="p">210:晶片上網路</p>
        <p type="p">212:連接凸塊</p>
        <p type="p">214:高頻寬記憶體實體層及控制器/晶粒對晶粒實體層及控制器</p>
        <p type="p">216:晶粒對晶粒實體層及控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1209" publication-number="202631271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管內移動機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B08B9/049</main-classification>
        <further-classification edition="200601120251124B">B61B13/10</further-classification>
        <further-classification edition="200601120251124B">B25J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＯＬＡＲＩＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLARIS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田上賢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGAMI, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部格生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ITARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種管內移動機器人（1），包括機器人本體（10），所述機器人本體（10）包括至少三個伸縮單元（11），所述管內移動機器人（1）的特徵在於具有：先端姿勢維持部（20），具有先端本體部（21）以及一對彈性體（22、23），所述先端本體部（21）構成管內移動機器人（1）的先端，各所述一對彈性體（22、23）從先端本體部（21）的外周面朝向徑向外側突出，且彼此在軸向上隔開間隔配置；彈性連接部（40），設置在先端姿勢維持部（20）與機器人本體（10）之間且能夠彈性變形；以及角度限制關節部（30），設置在彈性連接部（40）與機器人本體（10）之間，使先端姿勢維持部（20）能夠相對於機器人本體（10）以小於90度的角度彎折。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管內移動機器人</p>
        <p type="p">10:機器人本體</p>
        <p type="p">11:伸縮單元</p>
        <p type="p">11a:筒狀部</p>
        <p type="p">12:連結部</p>
        <p type="p">15:刷子</p>
        <p type="p">20:先端姿勢維持部</p>
        <p type="p">21:先端本體部</p>
        <p type="p">21a:軀幹部</p>
        <p type="p">21b:突出部分</p>
        <p type="p">22:彈性體</p>
        <p type="p">23:彈性體</p>
        <p type="p">22a,23a:外周端</p>
        <p type="p">24:虛擬球面</p>
        <p type="p">24a:點</p>
        <p type="p">25:相機</p>
        <p type="p">26:照明裝置</p>
        <p type="p">30:角度限制關節部</p>
        <p type="p">31:萬向接頭部</p>
        <p type="p">32:止擋部</p>
        <p type="p">33:前方固定部</p>
        <p type="p">34:後方固定部</p>
        <p type="p">35:前方轉動軸</p>
        <p type="p">36:後方轉動軸</p>
        <p type="p">40:彈性連接部</p>
        <p type="p">O:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1210" publication-number="202632899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用電流與電壓控制之具可調脈衝寬度之脈衝產生</chinese-title>
        <english-title>PULSE GENERATION WITH ADJUSTABLE PULSE WIDTH USING CURRENT AND VOLTAGE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03K5/08</main-classification>
        <further-classification edition="200601120260504B">H03K5/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞泰姆公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETYM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆德　蘇密</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONDHE, SUMEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞哈　伊登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAHAV, IDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪　奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIV, OR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文什圖　梅爾尼　納坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINSHTOK-MELNIK, NATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑荷德拉伊　佑希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANHEDRAI, YOSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈朗　亞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAN, AVIAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊坦　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EITAN, ROEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於回應於一週期性輸入信號而產生一週期性方波信號之脈衝產生器(100)包含一第一反相器(106)、一負回饋電路(108)、一可調電流源(110)以及一第二反相器(112)。該第一反相器被組態成將該週期性輸入信號反相，藉此產生一週期性波。該負回饋電路被組態成將該第一反相器之一輸出耦合至該第一反相器之一輸入，藉此將該第一反相器設定成一線性模式。該可調電流源耦合至該負回饋電路且被組態成加載該第一反相器，藉此修改由該第一反相器生成之該週期性波之一工作循環。該第二反相器被組態成將該第一反相器之該輸出反相，藉此產生週期性方波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pulse generator (100), for generating a periodic square wave signal in response to a periodic input signal, includes a first inverter (106), a negative-feedback circuit (108), an adjustable current source (110), and a second inverter (112). The first inverter is configured to invert the periodic input signal, thereby generating a periodic wave. The negative-feedback circuit is configured to couple an output of the first inverter to an input of the first inverter, thereby setting the first inverter in a linear mode. The adjustable current source is coupled to the negative-feedback circuit and is configured to load the first inverter, thereby modifying a duty cycle of the periodic wave produced by the first inverter. The second inverter is configured to invert the output of the first inverter, thereby generating the periodic square wave.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可調寬度脈衝產生器(AWPG)/脈衝產生器</p>
        <p type="p">102:週期性輸入信號/輸入信號</p>
        <p type="p">104:耦合電容器</p>
        <p type="p">106:第一反相器/反相器</p>
        <p type="p">108:負回饋電路/回饋電路</p>
        <p type="p">110:可調電流源/電流源</p>
        <p type="p">112:第二反相器</p>
        <p type="p">114:可變供電軌反相器</p>
        <p type="p">Vdd1:供電電壓/電源供電</p>
        <p type="p">Vdd2:供電電壓/電源供電</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1211" publication-number="202633016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>凸起的開口環諧振器等離子體源</chinese-title>
        <english-title>RAISED SPLIT-RING RESONATOR PLASMA SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H05H1/30</main-classification>
        <further-classification edition="200601120260423B">H05H1/46</further-classification>
        <further-classification edition="200601120260423B">C23C14/34</further-classification>
        <further-classification edition="200601120260423B">H05H1/24</further-classification>
        <further-classification edition="200601120260423B">H05H1/48</further-classification>
        <further-classification edition="200601120260423B">H05H7/18</further-classification>
        <further-classification edition="200601120260423B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英福康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFICON, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威力　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILEY, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里格林　肖恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGLIN, SHAWN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈格馬克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGGMARK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在腔室內生成等離子體的等離子體生成設備，包括沿著接地平面延伸的基座。設備還包括限定間隙並連接到能量源的導電諧振器，其中間隙包括寬度。設備包括至少一個支撐件，所述支撐件包括構造成接合基座的第一端和構造成離開基座一段距離來支撐導電諧振器的相對的第二端。導電諧振器被構造成在間隙處或附近以及基座上方生成等離子體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma generating device for generating a plasma inside of a chamber includes a base extending along a ground plane. The device further includes a conductive resonator defining a gap and connected to an energy supply, where the gap comprises a width. The device includes at least one support that includes a first end structured to engage the base and an opposing second end structured to support the conductive resonator a distance away from the base. The conductive resonator is structured to generate the plasma at or near the gap and above the base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:等離子體生成設備</p>
        <p type="p">101:第一側</p>
        <p type="p">102:基座</p>
        <p type="p">104:凹槽</p>
        <p type="p">107:間隙</p>
        <p type="p">110:開口環諧振器</p>
        <p type="p">120:諧振器支撐件</p>
        <p type="p">150:饋電引腳</p>
        <p type="p">152:導電元件</p>
        <p type="p">160:調諧器</p>
        <p type="p">162:調諧構件</p>
        <p type="p">164:開口</p>
        <p type="p">166:調諧調節器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1212" publication-number="202633466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附有導電柱之基板之製造方法及導電柱形成用金屬糊劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W70/60</main-classification>
        <further-classification edition="200601120260423B">H05K1/09</further-classification>
        <further-classification edition="200601120260423B">H05K3/10</further-classification>
        <further-classification edition="200601120260423B">H05K3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本真澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, MASUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江尻芳則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJIRI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水千晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, CHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成田真生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARITA, MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種附有導電柱之基板之製造方法，其包括：步驟a，準備附有抗蝕劑層之基板，該附有抗蝕劑層之基板具備基板及設置有通向該基板之孔之抗蝕劑層，以填埋孔的內部且被覆抗蝕劑層的至少孔的周邊的表面之方式設置包含金屬粒子及揮發性溶劑之金屬糊劑部；步驟b，對金屬糊劑部進行加熱，去除揮發性溶劑的一部分；步驟c，去除加熱後的金屬糊劑部的一部分，以使上述表面露出，從而在孔的內部形成具有平坦化之露出面且包含金屬粒子及揮發性溶劑的殘餘部分之導電柱前驅物；步驟d，在還原氛圍氣中在200℃以下煅燒導電柱前驅物；及步驟e，去除歷經了步驟d之抗蝕劑層，金屬粒子包含體積平均粒徑為0.8μm以上的第1銅粒子及體積平均粒徑為0.5μm以下的第2銅粒子，在上述步驟a中設置之金屬糊劑部的金屬粒子的濃度為95.0質量%以上，以金屬粒子總量為基準，在步驟a中設置之金屬糊劑部中之第2銅粒子的含量為50質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1213" publication-number="202632739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿能量控制之利用直流電壓的電漿處理系統</chinese-title>
        <english-title>PLASMA PROCESSING SYSTEMS WITH DIRECT CURRENT VOLTAGE FOR PLASMA ENERGY CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01J37/32</main-classification>
        <further-classification edition="200601120260312B">H05H1/46</further-classification>
        <further-classification edition="200601120260312B">H05H1/36</further-classification>
        <further-classification edition="202601120260312B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SHINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聞成語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉瑟帕蘭比爾　奇索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALATHIPARAMBIL, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科特努爾　普拉尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTHNUR, PRASHANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用電漿處理系統對基板進行處理的方法及設備。一個示例的電漿處理系統通常包括第一電極、第二電極，以及一個系統控制器，該系統控制器包含一或多個處理器和包括電腦可執行指令的記憶體。這一或多個處理器通常被配置為執行電腦可執行的指令，並使該電漿處理系統：透過第一無線電頻率（RF）發生器，在第一RF頻率向該第一電極傳送第一RF波形，並在該傳送該第一RF波形的同時，使用直流（DC）供應調整施加於該第二電極的電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for processing a substrate using a plasma processing system. One example plasma processing system generally includes a first electrode, a second electrode, and a system controller comprising one or more processors and memory that includes computer-executable instructions. The one or more processors are generally configured to execute the computer-executable instructions and cause the plasma processing system to: deliver, using a first radio frequency (RF) generator, a first RF waveform to the first electrode at a first RF frequency, and adjust, using a direct current (DC) supply, a voltage applied to the second electrode during the delivery of the first RF waveform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:操作</p>
        <p type="p">210:區塊</p>
        <p type="p">220:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1214" publication-number="202631108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>皮膚化妝品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K8/67</main-classification>
        <further-classification edition="200601120260504B">A61K8/60</further-classification>
        <further-classification edition="200601120260504B">A61K8/39</further-classification>
        <further-classification edition="200601120260504B">A61K8/34</further-classification>
        <further-classification edition="200601120260504B">A61K8/73</further-classification>
        <further-classification edition="200601120260504B">A61K8/86</further-classification>
        <further-classification edition="200601120260504B">A61K8/55</further-classification>
        <further-classification edition="200601120260504B">A61Q19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綿榎清司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATAE, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小森咲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMORI, SAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種皮膚化妝品，含有下述成分（A）～成分（D）。  &lt;br/&gt;（A）菸鹼醯胺 1質量%～10質量%  &lt;br/&gt;（B）維生素C衍生物 0.01質量%～5質量%  &lt;br/&gt;（C）選自由碳數6～10的醇與甘油的單醚及碳數6～10的脂肪酸與甘油的單酯所組成的群組中的一種以上 0.01質量%～0.5質量%  &lt;br/&gt;（D）碳數3～6的二元醇 2質量%～30質量%</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1215" publication-number="202633486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝裝置及安裝裝置的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W72/00</main-classification>
        <further-classification edition="202601120260423B">H10P72/50</further-classification>
        <further-classification edition="200601120260423B">H05K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱平大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAHIRA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小熊行祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGUMA, IKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩川幸喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAKAWA, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田隼大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, HAYATA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>末藤伸幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEFUJI, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之安裝裝置具備：載台，支撐基板；安裝頭，具有可保持零件的管嘴；第1移動裝置，使安裝頭相對於載台在升降方向上相對地移動；第2移動裝置，使安裝頭相對於載台在與升降方向交叉的方向上相對地移動；拍攝裝置，拍攝零件的零件圖像與基板的基板圖像；及控制部，控制第2移動裝置，安裝頭具有：第1特徵部；及第2特徵部，設置於比第1特徵部更下方，第1移動裝置是在第1高度與第2高度之間，使安裝頭相對於載台相對地移動，前述第1高度是拍攝裝置拍攝第1特徵部的第1圖像的高度，前述第2高度是拍攝裝置拍攝第2特徵部的第2圖像的高度，控制部依據第1圖像、第2圖像、零件圖像及基板圖像，來控制第2移動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:安裝裝置</p>
        <p type="p">5:安裝頭</p>
        <p type="p">6:拍攝裝置</p>
        <p type="p">8:載台</p>
        <p type="p">9:特徵構件</p>
        <p type="p">11:零件</p>
        <p type="p">12:基板</p>
        <p type="p">51:吸附管嘴</p>
        <p type="p">52:保持部</p>
        <p type="p">55:Y方向移動構件</p>
        <p type="p">56:Y方向驅動裝置</p>
        <p type="p">57:Y軸樑</p>
        <p type="p">58:第1移動裝置</p>
        <p type="p">59:第2移動裝置</p>
        <p type="p">61:第1相機</p>
        <p type="p">62:第2相機</p>
        <p type="p">63:筒構件</p>
        <p type="p">64:反射光學系統</p>
        <p type="p">69:第3移動裝置</p>
        <p type="p">71A,71B,72A,72B:辨識標記</p>
        <p type="p">91:第1特徵部</p>
        <p type="p">92:第2特徵部</p>
        <p type="p">93:第1構件</p>
        <p type="p">93B,94B:前端</p>
        <p type="p">94:第2構件</p>
        <p type="p">F1:升降方向</p>
        <p type="p">F2:前後方向</p>
        <p type="p">H1:第1高度</p>
        <p type="p">H2:第2高度</p>
        <p type="p">H3:第3高度</p>
        <p type="p">H4:第4高度</p>
        <p type="p">H5:拍攝高度</p>
        <p type="p">P10:第1拍攝位置</p>
        <p type="p">P11:拍攝位置</p>
        <p type="p">P12:第2拍攝位置</p>
        <p type="p">P13:退避位置</p>
        <p type="p">S:點</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1216" publication-number="202631119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固體組成物、布洛芬之緩釋性改善劑及緩釋性改善方法</chinese-title>
        <english-title>SOLID COMPOSITION, SUSTAINED-RELEASE PROPERTY IMPROVER FOR IBUPROFEN, AND METHOD FOR IMPROVING SUSTAINED-RELEASE PROPERTY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/192</main-classification>
        <further-classification edition="200601120260504B">A61K31/485</further-classification>
        <further-classification edition="200601120260504B">A61K31/195</further-classification>
        <further-classification edition="200601120260504B">A61K9/22</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共健康事業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野宏大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]組成物提供溶出持續性受到改善的包含布洛芬及傳明酸的固體組成物。  &lt;br/&gt;　　[解決手段]一種固體組成物，其包含(A)布洛芬、(B)選自由右美沙芬及其鹽所成群組的至少一種，與(C)傳明酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem to be Solved] &lt;br/&gt;To provide a solid composition containing ibuprofen and tranexamic acid, in which the sustained-release property of ibuprofen is improved. &lt;br/&gt;&lt;br/&gt;[Solution to the Problem] &lt;br/&gt;A solid composition comprising: &lt;br/&gt;(A) ibuprofen; &lt;br/&gt;(B) at least one compound selected from the group consisting of dextromethorphan and salts thereof; and &lt;br/&gt;(C) tranexamic acid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1217" publication-number="202632740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於極端邊緣控制的半導體晶圓處理，其具溫度控制及偏壓供電的處理環</chinese-title>
        <english-title>SEMICONDUCTOR WAFER PROCESSING WITH TEMPERATURE CONTROL AND BIAS POWERED PROCESS RING FOR EXTREME EDGE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260323B">H01J37/32</main-classification>
        <further-classification edition="200601120260323B">H05H1/46</further-classification>
        <further-classification edition="202601120260323B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩羅德比許瓦那　尤甘南達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARODE VISHWANATH, YOGANANDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　亞南德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處描述的實施例通常與半導體處理腔室的處理套組有關。在一個實施例中，該處理套組包括一個邊緣環，具有內徑、底表面和頂表面。該邊緣環被配置為環繞半導體處理腔室中的基板。該處理套組還包括一個位於該邊緣環下方的插入環。該插入環具有一個上表面，配置為與該邊緣環的該底表面接觸。該插入環具有一個主體，該主體具有一個底面、一個設置於該主體內的電極，以及一個穿過該底面伸入該主體並與該電極相連的銷。該銷的導電銷從該底面突出，並配置為與該電極的電源相連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples described herein generally related to a process kit for a semiconductor processing chamber. In one example, the process kit includes an edge ring having an inner diameter, a bottom surface and a top surface. The edge ring is configured to circumscribe a substrate in a semiconductor processing chamber. The process kit includes a insert ring positioned beneath the edge ring. The insert ring has an upper surface configured to contact the bottom surface of the edge ring. The insert ring has a body having a lower surface, an electrode disposed in the body, and a pin extending into the body through the lower surface coupled to the electrode. A conductive pin of the pin protrudes from the lower surface and is configured to couple to a power supply for the electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:偏壓電極</p>
        <p type="p">115:邊緣電極</p>
        <p type="p">150:供電插入環</p>
        <p type="p">200:處理套組</p>
        <p type="p">202:基板支撐</p>
        <p type="p">204:冷卻底座</p>
        <p type="p">206:基底板</p>
        <p type="p">210:邊緣環</p>
        <p type="p">214:支撐環</p>
        <p type="p">218:頂表面</p>
        <p type="p">220:底表面</p>
        <p type="p">221:第一階梯</p>
        <p type="p">222:內邊緣</p>
        <p type="p">223:第二階梯</p>
        <p type="p">224:外邊緣</p>
        <p type="p">226:階梯面</p>
        <p type="p">227:內部階梯面</p>
        <p type="p">228:頂表面</p>
        <p type="p">230:底表面</p>
        <p type="p">232:內邊緣</p>
        <p type="p">234:外邊緣</p>
        <p type="p">253:熱傳導墊片</p>
        <p type="p">261:底表面</p>
        <p type="p">262:外突出部分</p>
        <p type="p">264:內突出部分</p>
        <p type="p">265:內徑</p>
        <p type="p">266:階梯</p>
        <p type="p">267:頂表面</p>
        <p type="p">268:外徑</p>
        <p type="p">269:面</p>
        <p type="p">270:陶瓷管</p>
        <p type="p">271:頂表面</p>
        <p type="p">273:內延伸部分</p>
        <p type="p">274:外環</p>
        <p type="p">275:底部</p>
        <p type="p">276:底部</p>
        <p type="p">277:外延伸部分</p>
        <p type="p">283:槽</p>
        <p type="p">284:接觸端子</p>
        <p type="p">286:銷</p>
        <p type="p">292:電漿屏</p>
        <p type="p">294:襯墊</p>
        <p type="p">500:電力耦合機構</p>
        <p type="p">566:導線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1218" publication-number="202631139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療癌症及其他適應症之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR USE IN THE TREATMENT OF CANCER AND OTHER INDICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4985</main-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商德洛斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THERAS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝川　佩德羅　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELTRAN, PEDRO J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮絲雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘瑟特　珍妮佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANSERT, JENNIFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔薩弗斯　福斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONSALVES, FOSTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛科維休斯　克斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINKEVICIUS, KERSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史蒂斯　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STICE, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦拉斯　艾麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALLACE, ELI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供治療包括癌症在內之疾病、病症或疾患的方法，其中該等方法包含投與如本文所述之化合物1或其醫藥學上可接受之鹽。此類方法可包含治療肺癌、乳癌或結腸直腸癌。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating diseases, disorders, or conditions including cancers, where the methods comprise administration of Compound 1, or a pharmaceutically acceptable salt thereof, as described herein. Such methods may comprise the treatment of lung cancer, breast cancer, or colorectal cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1219" publication-number="202632792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓緊接觸接口組件及連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260504B">H01R12/72</main-classification>
        <further-classification edition="200601120260504B">H01R13/652</further-classification>
        <further-classification edition="200601120260504B">H01R13/639</further-classification>
        <further-classification edition="201101120260504B">H01R13/6586</further-classification>
        <further-classification edition="200601120260504B">H01R13/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿米塔吉　傑克　肯揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARMITAGE, JACK KENYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布林ＩＶ　丹尼斯　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREEN IV, DENNIS M</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法亞　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAIA, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費倫　傑森　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERENS, JASON W</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕內拉　奧古斯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANELLA, AUGUSTO P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易穎芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, YING FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾遜ＩＶ　威廉　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON IV, WILLIAM HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">說明用於高速度數據通信的壓緊接觸接口組件。一種示例組件包括：一居間組件；一環體，用於將所述居間組件固定於一印刷電路板；一插頭連接器，其與所述居間組件對接；以及一扣持夾具，其在所述插頭連接器上延伸，卡扣到所述環體中，並將所述插頭連接器固定於所述居間組件。所述居間組件包括一居間殼體和位於所述居間殼體的一板對接接口區域上的一居間導電墊片。所述插頭連接器包括一插頭殼體和位於所述插頭殼體的一對接接口上的一插頭導電墊片。所述環體橫跨在所述印刷電路板上並將所述居間組件向下壓緊在所述印刷電路板的頂面上。所述導電墊片提供另外的屏蔽，以及所述居間殼體和所述居間導電墊片形成用於經由所述接口組件數據通信的一接地返回路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:計算系統</p>
        <p type="p">20:印刷電路板</p>
        <p type="p">22:集成半導體元器件</p>
        <p type="p">30:基板</p>
        <p type="p">40:加強板</p>
        <p type="p">100A:接觸接口組件</p>
        <p type="p">100B:接觸接口組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1220" publication-number="202631543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立方晶氮化硼燒結體及切削工具</chinese-title>
        <english-title>CUBIC BORON NITRIDE SINTERED MATERIAL AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C04B35/5831</main-classification>
        <further-classification edition="200601120260416B">B23B27/14</further-classification>
        <further-classification edition="200601120260416B">B23B51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村克己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井顕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種立方晶氮化硼燒結體，其係具備75體積%以上99.5體積%以下之立方晶氮化硼粒子、及結合材料者，且上述結合材料包含選自由鎢、鋁及鈷所組成之群中之至少一種，上述立方晶氮化硼燒結體之拉曼光譜具有存在於1044 cm&lt;sup&gt;-1&lt;/sup&gt;以上1058 cm&lt;sup&gt;-1&lt;/sup&gt;以下之拉曼位移處之第一峰、及存在於1074 cm&lt;sup&gt;-1&lt;/sup&gt;以上1088 cm&lt;sup&gt;-1&lt;/sup&gt;以下之拉曼位移處之第二峰中之一者或兩者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cubic boron nitride sintered material includes: 75 vol% or more and 99.5 vol% or less of cubic boron nitride grains; and a binder, wherein the binder includes at least one selected from the group consisting of tungsten, aluminum, and cobalt, and a Raman spectrum of the cubic boron nitride sintered material has one or both of a first peak present at a Raman shift of 1044 cm&lt;sup&gt;-1&lt;/sup&gt; or more and 1058 cm&lt;sup&gt;-1&lt;/sup&gt; or less, and a second peak present at a Raman shift of 1074 cm&lt;sup&gt;-1&lt;/sup&gt; or more and 1088 cm&lt;sup&gt;-1&lt;/sup&gt; or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1221" publication-number="202632974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>MEMS麥克風</chinese-title>
        <english-title>MEMS MICROPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H04R19/04</main-classification>
        <further-classification edition="200601120260423B">H05K1/16</further-classification>
        <further-classification edition="200601120260423B">H04B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪哲喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, CHOUL HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露內容之一實施例，一種MEMS麥克風包括：一基板；一MEMS結構，其安置於該基板上；一信號處理元件，其安置於該基板上且處理來自該MEMS結構之一信號；以及一第一被動元件部分，其圖案化於該基板上且電連接至該信號處理元件之一電力輸入端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present disclosure, a MEMS microphone includes a substrate; a MEMS structure disposed on the substrate; a signal processing element disposed on the substrate and processing a signal from the MEMS structure; and a first passive element part patterned on the substrate and electrically connected to a power input terminal of the signal processing element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:MEMS麥克風</p>
        <p type="p">110:基板</p>
        <p type="p">111:第一被動元件部分</p>
        <p type="p">120:信號處理元件</p>
        <p type="p">130:MEMS結構</p>
        <p type="p">200:外部電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1222" publication-number="202632975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>MEMS麥克風</chinese-title>
        <english-title>MEMS MICROPHONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H04R19/04</main-classification>
        <further-classification edition="200601120260504B">H04R1/02</further-classification>
        <further-classification edition="200601120260504B">B81B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜秉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYEONG KIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露內容之一實施例，一種MEMS麥克風包含：一第一基板；一MEMS結構，其安置於該第一基板上；一信號處理元件，其安置於該第一基板上且處理該MEMS結構之一信號；以及一第一被動元件部分，其安置於作為該信號處理元件之基板之一第二基板內且電連接至該信號處理元件之一MEMS連接端子，其中該信號處理元件之該MEMS連接端子連接至該MEMS結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present disclosure, a MEMS microphone comprises a first substrate; a MEMS structure disposed on the first substrate; a signal processing element disposed on the first substrate and processing a signal of the MEMS structure; and a first passive element part disposed within a second substrate, which is the substrate of the signal processing element, and electrically connected to a MEMS connection terminal of the signal processing element, in which the MEMS connection terminal of the signal processing element is connected to the MEMS structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:MEMS麥克風</p>
        <p type="p">110:基板/第一基板</p>
        <p type="p">120:信號處理元件/信號處理裝置</p>
        <p type="p">121:第一被動元件部分</p>
        <p type="p">122:MEMS連接端子</p>
        <p type="p">123:電力輸入端子</p>
        <p type="p">130:MEMS結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1223" publication-number="202631544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立方晶氮化硼燒結體及切削工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C04B35/5831</main-classification>
        <further-classification edition="200601120260416B">B23B27/14</further-classification>
        <further-classification edition="200601120260416B">B23B51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋香南子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村侑生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井顕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道内真人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHIUCHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村克己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種立方晶氮化硼燒結體，其包含75體積%以上95體積%以下之立方晶氮化硼粒子、及5體積%以上25體積%以下之結合材料，上述立方晶氮化硼燒結體之矽之含有率為0.10原子%以上7原子%以下，且上述立方晶氮化硼燒結體之鈷之含有率為0.5原子%以上13原子%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:切削面</p>
        <p type="p">2:退刀面</p>
        <p type="p">3:刀尖稜線部</p>
        <p type="p">10:切削工具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1224" publication-number="202632896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有利用供應及幅度變化之可調整脈衝寬度之脈衝產生</chinese-title>
        <english-title>PULSE GENERATION WITH ADJUSTABLE PULSE WIDTH USING SUPPLY AND AMPLITUDE VARIATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H03K3/017</main-classification>
        <further-classification edition="200601120260427B">H03K5/01</further-classification>
        <further-classification edition="200601120260427B">H03K5/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞泰姆公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETYM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆德　蘇密</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONDHE, SUMEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞哈　伊登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAHAV, IDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪　奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIV, OR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文什圖　梅爾尼　納坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINSHTOK-MELNIK, NATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑荷德拉伊　佑希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANHEDRAI, YOSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈朗　亞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAN, AVIAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊坦　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EITAN, ROEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於回應於一週期性輸入信號而產生一週期性方波信號之脈衝產生器(100)，其包含一前端反相閘(106)、一負回饋電路(108)、一可變供應軌反相閘(110)以及一工作循環控制電路(114)。該前端反相閘被組態成將該週期性輸入信號反相，藉此產生一週期性波。該負回饋電路被組態成將該前端反相閘之一輸出耦合至該前端反相閘之一輸入，藉此將該前端反相閘設定成一線性模式。該可變供應軌反相閘與該前端反相閘串聯連接且被組態成產生該週期性方波信號。該工作循環控制電路被組態成將一可調整供應電壓供應至該可變供應軌反相閘，藉此控制該週期性方波信號之一工作循環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pulse generator (100), for generating a periodic square wave signal in response to a periodic input signal, includes a front-end inverting gate (106), a negative-feedback circuit (108), a variable supply rail inverting gate (110), and a duty cycle control circuit (114). The front-end inverting gate is configured to invert the periodic input signal, thereby generating a periodic wave. The negative-feedback circuit is configured to couple an output of the front-end inverting gate to an input of the front-end inverting gate, thereby setting the front-end inverting gate in a linear mode. The variable supply rail inverting gate is connected in series with the front-end inverting gate and is configured to generate the periodic square wave signal. The duty cycle control circuit is configured to supply an adjustable supply voltage to the variable supply rail inverting gate, thereby controlling a duty cycle of the periodic square wave signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可調整工作循環脈衝產生器(ADCPG)</p>
        <p type="p">102:幅度受控正弦波產生器/正弦波產生器</p>
        <p type="p">104:耦合電容器</p>
        <p type="p">106:第一反相閘/反相閘</p>
        <p type="p">108:回饋電阻器</p>
        <p type="p">110:第二反相閘/反相閘</p>
        <p type="p">112:可變電壓電源供應器</p>
        <p type="p">114:工作循環控制電路</p>
        <p type="p">Vdd1:電源供應</p>
        <p type="p">Vdd2:電源供應</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1225" publication-number="202631905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C08L101/12</main-classification>
        <further-classification edition="200601120260427B">C08K7/22</further-classification>
        <further-classification edition="200601120260427B">C08K3/36</further-classification>
        <further-classification edition="200601120260427B">C08L63/00</further-classification>
        <further-classification edition="200601120260427B">C08L83/04</further-classification>
        <further-classification edition="200601120260427B">C08L79/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂博道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, HIROMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種絕緣性組成物，其包含中空氧化矽粒子，且可形成機械特性、電特性(低相對介電常數、低介電正切等)、絕緣性等優異之被膜；及，提供一種具備該被膜之基材。&lt;br/&gt;  一種絕緣性組成物，含有5~70體積%之中空氧化矽粒子及樹脂，前述中空氧化矽粒子之二次粒子之中值粒徑(D50)為0.2~10µm，前述中空氧化矽粒子之比重為0.3g/cm&lt;sup&gt;3&lt;/sup&gt;以上且小於1.00g/cm&lt;sup&gt;3&lt;/sup&gt;並且小於前述樹脂之比重。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1226" publication-number="202631666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與　VEGF-A　及　ANG2　結合之抗體及其使用方法</chinese-title>
        <english-title>ANTIBODY THAT BINDS TO VEGF-A AND ANG2 AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/22</main-classification>
        <further-classification edition="200601120260504B">C07K16/46</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">C12P21/08</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　克里斯蒂安　賀伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENSEN, KRISTIAN HOBOLT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>因霍夫　俊　沙賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMHOF-JUNG, SABINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏莫　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULLMER, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史伯克　珍妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPECK, JANINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫嫩肯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOELLEKEN, JOERG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克曼　羅倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKMANN, ROLAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬　舍貝斯俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENN, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫賀傑　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLHOJ, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉瑟　芭芭拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISER, BARBARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特曼　古多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTMANN, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭茲　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHANTZ, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及抗 VEGF-A/抗 ANG2 抗體，例如以雙特異性 Fab 片段之形式，及使用該等抗體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to anti-VEGF-A/anti-ANG2 antibodies, e.g. in the form of a bispecific Fab fragment, and methods of using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1227" publication-number="202631270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管內移動機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B08B9/043</main-classification>
        <further-classification edition="200601120251124B">B61B13/10</further-classification>
        <further-classification edition="200601120251124B">B25J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＯＬＡＲＩＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLARIS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田健吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部格生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ITARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管內移動機器人（1），其構成為包括機器人本體（10），所述機器人本體（10）構成為包括分別在流體供給時沿徑向膨脹並沿軸向收縮的至少三個伸縮單元，所述伸縮單元以預定模式進行蠕動運動而在管道內部移動，所述管內移動機器人（1）包括：相機（40），安裝於機器人本體（10）的先端部（20）；透明覆蓋體（50），安裝於先端部（20）並覆蓋相機（40）；噴嘴（60），具有朝向覆蓋體（50）中覆蓋相機（40）的拍攝方向側的先端的部分的外側面開口的吐出口（61）；以及流體供給源（14），經由噴嘴用配管（62）連接於噴嘴（60）並向噴嘴（60）供給流體，並藉由從吐出口（61）吐出的流體去除附著於覆蓋體（50）外側面的污垢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管內移動機器人</p>
        <p type="p">10:機器人本體</p>
        <p type="p">14:流體供給源</p>
        <p type="p">20:先端部</p>
        <p type="p">21:刷子</p>
        <p type="p">30:彈性連接部</p>
        <p type="p">40:相機</p>
        <p type="p">41:配線</p>
        <p type="p">42:顯示裝置</p>
        <p type="p">50:覆蓋體</p>
        <p type="p">51:平面部</p>
        <p type="p">52:彎曲部</p>
        <p type="p">53:內側面</p>
        <p type="p">60:噴嘴</p>
        <p type="p">61:吐出口</p>
        <p type="p">62:噴嘴用配管</p>
        <p type="p">O:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1228" publication-number="202632428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掩模版轉移裝置及掩模版轉移方法</chinese-title>
        <english-title>MASK TRANSFER DEVICE AND MASK TRANSFER METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">G03F7/20</main-classification>
        <further-classification edition="201201120260420B">G03F1/66</further-classification>
        <further-classification edition="202601120260420B">H10P72/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海御微半導體技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI YUWEI SEMICONDUCTOR TECHNOLOGY CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭教增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIAOZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種掩模版轉移裝置及掩模版轉移方法，該裝置包括：底座；開蓋機構，設於底座且用於將掩模版存儲盒的蓋體打開；轉移機構，設於底座且其輸出端具有用於抓取掩模版的抓取組件，抓取組件中，兩個夾持件均沿寬度方向能移動地約束於抓取座，且能相互靠近或遠離；兩個轉動件沿寬度方向間隔設置；夾持傳動件呈帶狀，且繞設於兩個轉動件之間，並於兩個轉動件之間形成兩個均沿寬度方向延伸且相互平行的傳動部，兩個傳動部分別與對應的夾持件傳動連接；夾持驅動器設於抓取座，且輸出端與夾持件或其中一個轉動件驅動連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mask transfer device and a mask transfer method, the device comprising: a base; a cover opening mechanism, provided on the base and used for opening a cover of a mask storage box; a transfer mechanism, provided on the base and having a grabbing assembly at its output end for grabbing a mask; in the grabbing assembly, two clamping members are both movably constrained to a grabbing seat along a width direction, and can move closer to or farther away from each other; the two rotating members are spaced apart in the width direction and can both rotate about their own axes; the clamping transmission member is in the form of a belt and is wound between the two rotating members, and two transmission parts extending in the width direction and parallel to each other are formed between the two rotating members, and the two transmission parts are respectively connected to the corresponding clamping members; the clamping driver is provided on the grabbing seat, and the output end is connected to the clamping member or one of the rotating members.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:掩模版存儲盒</p>
        <p type="p">2000:掩模版</p>
        <p type="p">100:底座</p>
        <p type="p">200:開蓋機構</p>
        <p type="p">300:轉移機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1229" publication-number="202631660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對STEAP1的嵌合受體及其使用方法</chinese-title>
        <english-title>CHIMERIC RECEPTORS TO STEAP1 AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K14/725</main-classification>
        <further-classification edition="200601120260429B">C07K14/705</further-classification>
        <further-classification edition="201001120260429B">C12N5/0783</further-classification>
        <further-classification edition="200601120260429B">C12N15/13</further-classification>
        <further-classification edition="200601120260429B">C12N15/63</further-classification>
        <further-classification edition="202501120260429B">A61K40/11</further-classification>
        <further-classification edition="202501120260429B">A61K40/31</further-classification>
        <further-classification edition="202501120260429B">A61K40/42</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾蘭　史提沃斯　奧利維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOLAN-STEVAUX, OLIVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭露了針對STEAP1的抗原結合分子、嵌合受體和工程化的免疫細胞。本發明進一步係關於使用該等STEAP1抗原結合分子和工程化的免疫細胞的載體、組成物和治療和/或檢測方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Antigen binding molecules, chimeric receptors, and engineered immune cells to STEAP1 are disclosed in accordance with the invention. The invention further relates to vectors, compositions, and methods of treatment and/or detection using the STEAP1 antigen binding molecules and engineered immune cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1230" publication-number="202631201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與腎病治療相關之方法</chinese-title>
        <english-title>METHODS RELATED TO THE TREATMENT OF KIDNEY DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260504B">A61K47/68</main-classification>
        <further-classification edition="200601120260504B">A61K38/17</further-classification>
        <further-classification edition="200601120260504B">C07K14/705</further-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
        <further-classification edition="200601120260504B">G01N33/68</further-classification>
        <further-classification edition="200601120260504B">G01N33/564</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維拉醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊納　羅伯特　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRENNER, ROBERT M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於與治療B細胞反應性自體免疫性腎小球病變相關之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to methods related to the treatment of B-cell responsive autoimmune glomerulopathies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">圖6</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1231" publication-number="202631288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137991</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焊接裝置及焊接對象物的製造方法</chinese-title>
        <english-title>SOLDERING DEVICE AND METHOD FOR MANUFACTURING SOLDERED OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">B23K3/04</main-classification>
        <further-classification edition="200601120260419B">B23K1/005</further-classification>
        <further-classification edition="200601120260419B">B23K1/008</further-classification>
        <further-classification edition="202601120260419B">H05K3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商歐利生股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIGIN COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤間広志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種焊接裝置，包括加熱冷卻裝置及第一距離調節裝置。加熱冷卻裝置，將被焊接之對象物，透過熱傳達或熱輻射其中至少之一方式進行加熱及冷卻。第一距離調節裝置，調節對象物及加熱冷卻裝置之間的距離。焊接對象物的製造方法，使用焊接裝置，將對象物自加熱冷卻裝置僅以第一指定距離下遠離，加熱加熱冷卻裝置，並相對於被加熱後之加熱冷卻裝置，讓對象物更靠近，並加熱對象物。在將對象物加熱，而焊料溶化後，將對象物自加熱冷卻裝置僅以第二指定距離下遠離，冷卻加熱冷卻裝置，並相對於冷卻後之加熱冷卻裝置，讓對象物更靠近，並冷卻包含於對象物內的焊料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A soldering device includes a heating and cooling unit configured to heat and cool an object to be soldered by at least one of thermal conduction or thermal radiation, and a first distance adjusting mechanism configured to adjust a distance between the object and the heating and cooling unit. A method for manufacturing a soldered object includes, by using the soldering device, placing the object at a first predetermined distance away from the heating and cooling unit, heating the heating and cooling unit, after the heating, moving the object closer to the heating and cooling unit to heat the object, after the solder has melted, placing the object at a second predetermined distance away from the heating and cooling unit, cooling the heating and cooling unit, and after the cooling, moving the object closer to the cooled heating and cooling unit to cool the solder contained in the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:焊接裝置</p>
        <p type="p">10:加熱冷卻裝置</p>
        <p type="p">11:板體</p>
        <p type="p">12:加熱管</p>
        <p type="p">13:冷卻塊</p>
        <p type="p">13N:切口</p>
        <p type="p">15:板體升降裝置</p>
        <p type="p">16:板體支撐銷</p>
        <p type="p">17:連結臂</p>
        <p type="p">18:軸</p>
        <p type="p">19:驅動源</p>
        <p type="p">25:基板升降裝置</p>
        <p type="p">26:基板支撐銷</p>
        <p type="p">27:連結臂</p>
        <p type="p">28:軸</p>
        <p type="p">29:驅動源</p>
        <p type="p">30:腔室</p>
        <p type="p">31:底部</p>
        <p type="p">32:壁部</p>
        <p type="p">33:蓋部</p>
        <p type="p">35:處理空間</p>
        <p type="p">50:控制裝置</p>
        <p type="p">51:處理器</p>
        <p type="p">52:記憶體</p>
        <p type="p">53:存儲器</p>
        <p type="p">DA:排列方向</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1232" publication-number="202631017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油脂組成物之製造方法、酯交換油脂組成物之製造方法、抑制油脂組成物之結晶析出的方法及抑制酯交換油脂組成物之結晶析出的方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF OIL OR FAT COMPOSITION, MANUFACTURING METHOD OF TRANSESTERIFIED OIL OR FAT COMPOSITION, CRYSTAL PRECIPITATION INHIBITING METHOD OF OIL OR FAT COMPOSITION AND CRYSTAL PRECIPITATION INHIBITING METHOD OF TRANSESTERIFIED OIL OR FAT COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A23D9/02</main-classification>
        <further-classification edition="200601120260504B">A23D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｊ　制油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>J-OIL MILLS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎將士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷津穗高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YATSU, HOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木亮輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種油脂組成物(排除硬奶油及酥皮人造奶油用油脂)之製造方法，係包含：將含有由碳數13以上且15以下之飽和脂肪酸所構成之三酸甘油脂與上述三酸甘油脂以外之非動物性油脂的原料油脂進行酯交換，而得到酯交換油脂組成物的步驟；  &lt;br/&gt;油脂組成物之總脂肪酸中，含有碳數13以上且15以下之飽和脂肪酸2質量%以上且20質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing an oil or fat composition (excluding oils or fats for hard butter and puff pastry margarine), comprising a step of transesterifying a raw material oil or fat that contains triglycerides composed of saturated fatty acids having 13 or more and 15 or less carbon atoms, together with non-animal oils or fats other than said triglycerides, thereby obtaining a transesterified oil or fat composition; wherein the oil or fat composition comprises 2% by mass or more and 20% by mass or less of saturated fatty acids having 13 or more and 15 or less carbon atoms, relative to the total fatty acid of the oil or fat composition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1233" publication-number="202633328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物品直立裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/00</main-classification>
        <further-classification edition="202601120260420B">H10P72/70</further-classification>
        <further-classification edition="202601120260420B">H10W90/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商海上股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAIJO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤澤辰一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJISAWA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種物品直立裝置，能更有效率地使圓柱物品直立。物品直立裝置16具備：轉盤24，具有：平面部28載置圓柱形的導電性銷P；及傾斜部30，設於平面部28的外周；以及轉盤旋轉用馬達26，使轉盤24旋轉。在傾斜部30形成有溝30A，在溝30A的下端配置有複數個孔30B，隨著轉盤24的旋轉，沿著溝30A移動的導電性銷P裝填至孔30B而直立。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12A:底面</p>
        <p type="p">16:物品直立裝置</p>
        <p type="p">18:彈出軸</p>
        <p type="p">22:彈出噴嘴</p>
        <p type="p">24:轉盤</p>
        <p type="p">28:平面部</p>
        <p type="p">28A:旋轉軸</p>
        <p type="p">28B:孔部</p>
        <p type="p">30:傾斜部</p>
        <p type="p">30A:溝</p>
        <p type="p">30B:孔</p>
        <p type="p">31:軸承</p>
        <p type="p">32:軸保持部</p>
        <p type="p">34:推桿</p>
        <p type="p">34A:推頭</p>
        <p type="p">36、40:線圈彈簧</p>
        <p type="p">38:孔</p>
        <p type="p">44:導電性銷供給通路</p>
        <p type="p">P:導電性銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1234" publication-number="202632711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子光學設備</chinese-title>
        <english-title>CHARGED PARTICLE-OPTICAL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01J37/02</main-classification>
        <further-classification edition="200601120260420B">H01J37/153</further-classification>
        <further-classification edition="200601120260420B">H01J37/22</further-classification>
        <further-classification edition="200601120260420B">H01J37/244</further-classification>
        <further-classification edition="200601120260420B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙欣　埃茲吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHIN, EZGI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　萊昂　阿里斯佩　伊斯瑞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LEON ARIZPE, ISRAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　特　衛斯登得　瑪尹克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN T WESTEINDE, MAAIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒夫　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOW, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬格努斯　艾爾伯圖斯　維克　傑拉杜斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGNUS, ALBERTUS VICTOR GERARDUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威蘭德　瑪寇　傑　加寇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND, MARCO JAN-JACO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於朝向一樣本投射至少一個帶電粒子射束之電子光學投射裝置，該裝置包含：一射束引導元件，其經組態以朝向該樣本上之一樣本位置投射該至少一個帶電粒子射束，其中該電子光學投射裝置進一步包含一光學部件，其經組態以朝向該樣本引導刺激光，使得該刺激光與該至少一個帶電粒子射束至少部分地重合，其中該光學部件包含面向順流方向之一第一表面，該第一表面之至少部分包含一塗層，該塗層對於該刺激光至少部分地透明且係導電的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electron-optical projection device for projecting at least one charged particle beam towards a sample, the device comprising: a beam directing element configured to project the at least one charged particle beam towards a sample location on the sample, wherein the electron-optical projection device further comprises an optical member configured to direct stimulation light towards the sample so that the stimulation light is at least partially coincident with the at least one charged particle beam, wherein the optical member comprises a first surface facing down-beam, at least part of the first surface comprising a coating layer being at least partially transparent for the stimulation light and being electrically conductive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">405:偵測器元件</p>
        <p type="p">501:光學部件</p>
        <p type="p">502:射束引導元件</p>
        <p type="p">505:另一層</p>
        <p type="p">601:塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1235" publication-number="202632725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於材料去層的自動化化學切換</chinese-title>
        <english-title>AUTOMATED CHEMICAL SWITCHING FOR MATERIAL DELAYERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/28</main-classification>
        <further-classification edition="200601120260421B">H01J37/30</further-classification>
        <further-classification edition="200601120260421B">H01J37/305</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克米耶克　傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KMIEC, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德拉姆　辛加拉韋盧　阿倫　桑德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM SINGARAVELU, ARUN SUNDAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種用於對異質材料進行去層的方法。本文亦提供一種方法，其包含：在一第一時間處對一多層材料進行去層，直到滿足一第一終點條件；基於該第一終點條件已滿足，判定對該去層設定的一改變；及在該第一時間之後的一第二時間處對該多層材料進行去層，直到滿足一第二終點條件。本文亦提供一種非暫時性電腦可讀取媒體，其體現包含指令的程式碼，當由一處理器執行時，該等指令使該處理器執行包含下列的操作：在一第一時間處對一多層材料進行去層，直到滿足一第一終點條件；基於該第一終點條件已滿足，判定對該去層設定的一改變；及在該第一時間之後的一第二時間處對該多層材料進行去層，直到滿足一第二終點條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a method for delayering heterogeneous materials. Also provided herein is a method comprising delayering, at a first time, a multilayered material until a first endpoint condition is satisfied, determining a change to the delayering setting based on the first endpoint condition being satisfied, and delayering, at a second time subsequent to the first time, the multilayered material until a second endpoint condition is satisfied. Further provided herein is a non-transitory computer-readable medium embodying program code comprising instructions which, when executed by a processor, cause the processor to perform operations comprising delayering, at a first time, a multilayered material until a first endpoint condition is satisfied, determining a change to the delayering setting based on the first endpoint condition being satisfied, and delayering, at a second time subsequent to the first time, the multilayered material until a second endpoint condition is satisfied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:操作</p>
        <p type="p">304:操作</p>
        <p type="p">306:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1236" publication-number="202632728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>末端執行器、半導體處理系統及更換位於半導體處理系統中的末端執行器上的墊的方法</chinese-title>
        <english-title>END EFFECTOR, SEMICONDUCTOR PROCESSING SYSTEM, AND METHOD FOR REPLACING PADS LOCATED ON AN END EFFECTOR DISPOSED IN A SEMICONDUCTOR PROCESSING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/317</main-classification>
        <further-classification edition="200601120260313B">H01J37/02</further-classification>
        <further-classification edition="202601120260313B">H10P72/70</further-classification>
        <further-classification edition="202601120260313B">H10P72/30</further-classification>
        <further-classification edition="202601120260313B">H10P72/00</further-classification>
        <further-classification edition="202601120260313B">H10P34/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅吉立克帝　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGILLICUDDY, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種包括可更換墊的末端執行器。墊可以由與末端執行器不同的介電材料製成。介電材料的差異可有助於減少顆粒的產生和工件的損壞。此外，墊透過閂鎖和彈簧連接到末端執行器，這使得組件能夠在很寬的溫度範圍內保持運行，即使末端執行器和墊的熱膨脹係數相差一個數量級或更多。此組件可在-150°C至500°C的溫度下運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An end effector that includes replaceable pads is disclosed. The pads may be constructed from a different dielectric material than the end effector. This difference in dielectric material may help reduce particle generation and workpiece damage. Additionally, the pad is attached to the end effector using a latch and a spring, which allows the assembly to remain operational over a wide range of temperatures, even if the end effector and pad have coefficients of thermal expansion that differ by an order of magnitude or more. This assembly may operate to temperatures from -150°C up to 500°C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:末端執行器</p>
        <p type="p">155:臂</p>
        <p type="p">160:叉</p>
        <p type="p">200:墊</p>
        <p type="p">210:閂鎖</p>
        <p type="p">220:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1237" publication-number="202632356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電連接部件及資訊機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G02B6/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木昌輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野泰徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能使傳輸容量增加並且使資訊機器小型化或薄型化之連接部件。  &lt;br/&gt;本發明之光連接部件具備：第1終端構件；第2終端構件；至少一根光纖，其具有第1端及位於第1端之相反側之第2端，第1端連接於第1終端構件，且第2端連接於第2終端構件；以及至少一根金屬線，其具有第1端及位於第1端之相反側之第2端，第1端連接於第1終端構件，且第2端連接於第2終端構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光電連接部件</p>
        <p type="p">20:第1終端構件</p>
        <p type="p">21:第1基板</p>
        <p type="p">22:第1光部件</p>
        <p type="p">23:第1連接端子</p>
        <p type="p">24:控制IC</p>
        <p type="p">25:連接器</p>
        <p type="p">26:光學元件</p>
        <p type="p">30:第2終端構件</p>
        <p type="p">31:第2基板</p>
        <p type="p">32:第2光部件</p>
        <p type="p">33:第2連接端子</p>
        <p type="p">34:控制IC</p>
        <p type="p">35:連接器</p>
        <p type="p">36:光學元件</p>
        <p type="p">40:配線部</p>
        <p type="p">41:光纖</p>
        <p type="p">41a:第1端</p>
        <p type="p">41b:第2端</p>
        <p type="p">42:金屬線</p>
        <p type="p">42a:第1端</p>
        <p type="p">42b:第2端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1238" publication-number="202633467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含整合裝置及金屬化部分的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING INTEGRATED DEVICES AND METALLIZATION PORTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/60</main-classification>
        <further-classification edition="202601120260427B">H10W70/63</further-classification>
        <further-classification edition="202601120260427B">H10W74/10</further-classification>
        <further-classification edition="202601120260427B">H10W90/00</further-classification>
        <further-classification edition="202601120260427B">H10W90/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　善雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, SUN WOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　立生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, LI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含：一第一金屬化部分；一第一整合裝置，其耦接至該第一金屬化部分；一第二整合裝置，其耦接至該第一金屬化部分；一第一囊封層，其耦接至該第一金屬化部分；一第一被動裝置，其位於該第一囊封層中；一第一橋接器，其位於該第一囊封層中；一第二金屬化部分；一第二整合裝置，其耦接至該第二金屬化部分；一第二整合裝置，其耦接至該第二金屬化部分；一第二囊封層，其耦接至該第二金屬化部分；一第二被動裝置，其位於該第二囊封層中；及一第二橋接器，其位於該第二囊封層中。該封裝進一步包含一第三金屬化部分及一第三囊封層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a first metallization portion; a first integrated device coupled to the first metallization portion; a second integrated device coupled to the first metallization portion; a first encapsulation layer coupled to the first metallization portion; a first passive device located in the first encapsulation layer; a first bridge located in the first encapsulation layer; a second metallization portion; a second integrated device coupled to the second metallization portion; a second integrated device coupled to the second metallization portion; a second encapsulation layer coupled to the second metallization portion; a second passive device located in the second encapsulation layer; and a second bridge located in the second encapsulation layer. The package further comprises a third metallization portion and a third encapsulation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝</p>
        <p type="p">101a,101b,103a,103b:整合裝置</p>
        <p type="p">102a,102b,104a,104b,108:金屬化部分</p>
        <p type="p">105a,105b,109a,109b:被動裝置</p>
        <p type="p">106a,106b,110,111a,111b:囊封層</p>
        <p type="p">107a,107b:橋接器</p>
        <p type="p">112:分離</p>
        <p type="p">190:板</p>
        <p type="p">192:板介電層</p>
        <p type="p">194:板互連件</p>
        <p type="p">196:焊料互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1239" publication-number="202632520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對人臉識別攻擊的攔截方法、裝置、設備及存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260107B">G06F21/32</main-classification>
        <further-classification edition="201301120260107B">G06F21/55</further-classification>
        <further-classification edition="202201120260107B">G06V40/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康家梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種對人臉識別攻擊的攔截方法、裝置、設備及存儲介質，涉及資訊安全技術領域。該方法包括獲取第一時間窗內N個用戶的交易資料和活檢人臉圖像，交易資料包括以下至少一項：交易時間、交易地點；基於交易資料，劃分N個用戶的活檢人臉圖像，得到至少一個圖像簇，圖像簇包括具有相似背景區域的至少兩個用戶的活檢人臉圖像，背景區域為活檢人臉圖像中的非人臉區域；確定與圖像簇中活檢人臉圖像對應的風險用戶的攔截資料，攔截資料用於指示攔截第二時間窗內與風險用戶相關的人臉識別攻擊。這樣，避免了潛在或遺漏的人臉識別攻擊，提高攔截人臉識別攻擊的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110,120,130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1240" publication-number="202632414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型空白光罩及反射型空白光罩的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260428B">G03F1/24</main-classification>
        <further-classification edition="200601120260428B">C23C14/14</further-classification>
        <further-classification edition="200601120260428B">C23C14/58</further-classification>
        <further-classification edition="201201120260428B">G03F1/58</further-classification>
        <further-classification edition="201201120260428B">G03F1/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙坂卓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲月判臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAZUKI, YUKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生越大河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGOSE, TAIGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之反射型空白光罩係用於以EUV光作為曝光光的EUV微影技術中，其至少具備：基板(10)；形成在基板(10)上之反射曝光光的多層反射膜(50)；以及含有鉭的多層膜(200)。前述多層膜(200)具有TaN部(210)、TaO部(230)、以及設置在TaN部(210)與TaO部(230)之間的Ta部(220)，前述Ta部(220)的密度大於TaN部(210)及TaO部(230)的密度。前述Ta部(220)的密度為13g/cm³以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:高折射率層</p>
        <p type="p">30:低折射率層</p>
        <p type="p">50:多層反射膜</p>
        <p type="p">51:周期積層結構部</p>
        <p type="p">110:保護膜</p>
        <p type="p">120:吸收體膜</p>
        <p type="p">130:硬光罩膜</p>
        <p type="p">150:背面導電膜</p>
        <p type="p">200:多層膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1241" publication-number="202633297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理中的SiOCH選擇性蝕刻</chinese-title>
        <english-title>SIOCH-SELECTIVE ETCHING IN SUBSTRATE PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P50/28</main-classification>
        <further-classification edition="202601120260423B">H10P72/00</further-classification>
        <further-classification edition="200601120260423B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WENBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉姆拿尼　潘卡吉　甘夏姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMNANI, PANKAJ GHANSHYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹拉　阿西木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAWLA, ASEEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴朗　阿里努瑪　德亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALAN, ARUNIMA DEYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BAICHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　暹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SAMANTHA SIAMHWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安薩里　納維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANSARI, NAVEED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱唯曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, WEIYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡馬爾西　古利　昌拿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMARTHY, GOWRI CHANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾致衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦海地　瓦西德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAHEDI, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加尼　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANI, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">範例提供的方法包括：基於第二圖案化硬遮罩層，在基板的未圖案化矽氧化物基遮罩層中形成穿孔開口，從而形成部分圖案化矽氧化物基遮罩層。方法還包括去除第二圖案化硬遮罩層。方法還包括去除第二圖案化硬遮罩層後，基於第一圖案化硬遮罩層，使用選擇性蝕刻SiOCH層的蝕刻製程將穿孔部分地蝕刻到SiOCH層中。方法還包括在部分圖案化矽氧化物基遮罩層中形成凹槽開口，從而形成圖案化矽氧化物基遮罩層。方法還包括形成凹槽開口後，將凹槽部分地蝕刻到SiOCH層中，以及使用選擇性蝕刻SiOCH層的蝕刻製程進一步蝕刻穿孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One example provides a method comprising forming via openings in an unpatterned silicon oxide-based mask layer of a substrate based upon a second patterned hardmask layer, thereby forming a partially patterned silicon oxide-based mask layer. The method further comprises removing the second patterned hardmask layer. The method further comprises, after removing the second patterned hardmask layer, etching the vias partially into the SiOCH layer based upon a first patterned hardmask layer using an etching process that selectively etches the SiOCH layer. The method further comprises forming trench openings in the partially patterned silicon oxide-based mask layer to form a patterned silicon oxide-based mask layer. The method further comprises, after forming the trench openings, etching the trenches partially into the SiOCH layer and further etching the vias using the etching process that selectively etches the SiOCH layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502-508:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1242" publication-number="202633308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及鎖定鑰匙的洗淨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P70/00</main-classification>
        <further-classification edition="202601120260427B">H10P95/00</further-classification>
        <further-classification edition="200601120260427B">F26B5/14</further-classification>
        <further-classification edition="202601120260427B">F26B21/35</further-classification>
        <further-classification edition="200601120260427B">A46B15/00</further-classification>
        <further-classification edition="202401120260427B">B08B1/12</further-classification>
        <further-classification edition="202401120260427B">B08B1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅﨑翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEZAKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 防止基板受到來自鎖定鑰匙及與其接觸的構件產生的微粒污染。  &lt;br/&gt;　　[解決手段] 一種基板處理裝置，將形成於基板的上表面上的液膜置換為超臨界流體，並使前述基板的乾燥，前述基板處理裝置係具備：壓力容器，內部具有進行前述基板乾燥的乾燥室；蓋體，封閉前述乾燥室的開口；鎖定鑰匙，限制前述蓋體從封閉前述開口的封閉位置向前述蓋體開啟前述開口的開啟位置移動；以及洗淨部，洗淨前述鎖定鑰匙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51:壓力容器</p>
        <p type="p">51a:下壁</p>
        <p type="p">51b:上壁</p>
        <p type="p">51i:嵌合孔</p>
        <p type="p">52:蓋體</p>
        <p type="p">52a:後表面</p>
        <p type="p">54:支撐框架</p>
        <p type="p">57:鎖定鑰匙</p>
        <p type="p">57a:下表面</p>
        <p type="p">57b:後表面</p>
        <p type="p">57d:傾斜面</p>
        <p type="p">57e:垂直面</p>
        <p type="p">59:升降機構</p>
        <p type="p">59a:升降台</p>
        <p type="p">59a1:水平面</p>
        <p type="p">60:滾動體</p>
        <p type="p">500:鎖定鑰匙洗淨部</p>
        <p type="p">501:刷子</p>
        <p type="p">502:刷軸</p>
        <p type="p">503:刷子導引件</p>
        <p type="p">504:螺旋彈簧</p>
        <p type="p">X:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1243" publication-number="202632773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組冷卻管的配置方法及電池組冷卻管</chinese-title>
        <english-title>METHOD FOR CONFIGURING COOLING TUBE OF BATTERY PACK AND COOLING TUBE OF BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260421B">H01M10/6557</main-classification>
        <further-classification edition="201401120260421B">H01M10/613</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, IN-HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳侊根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, KWANG-KEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鎭浯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN-OH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種用於配置具有改善冷卻效率的電池組的冷卻管的方法以及電池組的冷卻管。電池組的冷卻管以及用於配置電池組的冷卻管的方法的特徵在於冷卻效率與最小化壓力損失以及最小化變形相關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method for configuring a cooling tube of a battery pack with improved cooling efficiency and a cooling tube of a battery pack. The cooling tube of a battery pack and the method for configuring a cooling tube of a battery pack are characterized in that the cooling efficiency is related to minimizing pressure loss and minimizing deformation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池單元陣列</p>
        <p type="p">100:圓柱形二次電池/電池單元</p>
        <p type="p">200:冷卻管</p>
        <p type="p">300:側結構單元</p>
        <p type="p">X,Y:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1244" publication-number="202633290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板的矽基半導體層中之直立特徵部的電漿蝕刻方法</chinese-title>
        <english-title>METHOD FOR PLASMA ETCHING VERTICAL FEATURES IN A SILICON-BASED SEMICONDUCTOR LAYER OF A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P50/20</main-classification>
        <further-classification edition="202601120260423B">H10P50/24</further-classification>
        <further-classification edition="200601120260423B">C09K13/04</further-classification>
        <further-classification edition="200601120260423B">C09K13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張度</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　宇浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山峻史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久松亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISAMATSU, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西塚哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZUKA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在電漿處理室中進行的電漿蝕刻方法，該方法包含提供一基板，該基板具有設置在蝕刻停止層上方的矽基半導體層以及設置在該矽基半導體層上方的圖案化遮罩層，該圖案化遮罩層係暴露出該矽基半導體層的一表面；將該圖案化遮罩層用作為蝕刻遮罩，使用第一電漿蝕刻製程垂直蝕刻該矽基半導體層，以形成線圖案並暴露出下方該蝕刻停止層的多個部分，該線圖案之一或多條線具有沿著其底部的底腳(foot)，該第一電漿蝕刻製程包含產生第一電漿；以及使用第二電漿蝕刻製程垂直原位蝕刻該線圖案，該第二電漿蝕刻製程包含自第一氣體及第二氣體產生第二電漿，該第一氣體包含氯且該第二氣體包含氫與Si、Br、I、P或S的化合物，該第二電漿與該第一電漿不同，以及將該線圖案暴露至該第二電漿，以自該線圖案移除該底腳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for plasma etching in a plasma processing chamber, where the method includes providing a substrate having a silicon-based semiconductor layer disposed over an etch stop layer and a patterned masking layer disposed over the silicon-based semiconductor layer, the patterned masking layer exposing a surface of the silicon-based semiconductor layer; using the patterned masking layer as an etch mask, vertically etching the silicon-based semiconductor layer using a first plasma etch process to form a pattern of lines and expose portI&lt;sub&gt;ON&lt;/sub&gt;s of the underlying etch stop layer, one or more lines of the pattern of lines having a foot along its base, the first plasma etch process including generating a first plasma; and vertically etching in situ the pattern of lines using a second plasma etch process, the second plasma etch process including generating a second plasma from a first gas including chlorine and a second gas including a compound of hydrogen with Si, Br, I, P, or S, the second plasma being different from the first plasma, and exposing the pattern of lines to the second plasma to remove the foot from the pattern of lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">110:塊體矽基板</p>
        <p type="p">112:鰭片</p>
        <p type="p">114:淺溝槽隔離(STI)層</p>
        <p type="p">120:犧牲閘極層</p>
        <p type="p">122:底層</p>
        <p type="p">130:圖案化遮罩層</p>
        <p type="p">132:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1245" publication-number="202632741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用非正弦偏壓產生器控制參數的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR CONTROLLING PARAMETERS WITH A NONSINUSOIDAL BIAS GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔明烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYEONG YEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔琳鍈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, LINYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俸奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BONGSEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派特森　亞歷山大　米勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATERSON, ALEXANDER MILLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王牧之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MUZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧莉維帝　安東尼　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLIVETI, ANTHONY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種非正弦偏壓電壓產生器。非正弦偏壓電壓產生器包含恆定電流源電路、正相位控制電路以及耦接至正相位控制電路的負相位控制電路。恆定電流源電路包含產生直流(DC)電壓波形的DC電壓源。正相位控制電路包含耦接至DC電壓源的第一開關。第一開關耦接至接地連接。負相位控制電路包含耦接至DC電壓源的第二開關。第二開關耦接至電漿腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nonsinusoidal bias voltage generator is described. The nonsinusoidal bias voltage generator includes a constant current source circuit, a positive phase control circuit and a negative phase control circuit coupled to the positive phase control circuit. The constant current source circuit includes a direct current (DC) voltage source that generates a DC voltage waveform. The positive phase control circuit includes a first switch coupled to the DC voltage source. The first switch is coupled to a ground connection. The negative phase control circuit includes a second switch coupled to the DC voltage source. The second switch is coupled to a plasma chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C_tune:電容器</p>
        <p type="p">D_pos、D_neg:二極體</p>
        <p type="p">L_dc:電感器</p>
        <p type="p">L_rise:電感器</p>
        <p type="p">P1:點</p>
        <p type="p">S1:開關</p>
        <p type="p">S2:第二開關、開關</p>
        <p type="p">V1、V2:電壓源、隔離式閘極驅動器電路</p>
        <p type="p">VDC:DC電壓源</p>
        <p type="p">Vout:輸出</p>
        <p type="p">108:射頻(RF)傳輸線</p>
        <p type="p">112:處理器</p>
        <p type="p">124:NSB電壓波形、NSB電壓信號</p>
        <p type="p">200:系統</p>
        <p type="p">201:正相位控制電路</p>
        <p type="p">202:NSB電壓產生器</p>
        <p type="p">203:負相位控制電路</p>
        <p type="p">205:DC電壓波形</p>
        <p type="p">207:接地連接</p>
        <p type="p">209:接地連接</p>
        <p type="p">211:接地連接</p>
        <p type="p">213:恆定電流源電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1246" publication-number="202631647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用單程切向流過濾進行生產池線上濃縮與體積減少之生產治療性蛋白質的系統和方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR PRODUCING THERAPEUTIC PROTEINS USING SINGLE PASS TANGENTIAL FLOW FILTRATION FOR IN-LINE CONCENTRATION AND VOLUME REDUCTION OF PRODUCTION POOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K1/34</main-classification>
        <further-classification edition="200601120260504B">C07K1/18</further-classification>
        <further-classification edition="200601120260504B">B01D61/14</further-classification>
        <further-classification edition="200601120260504B">B01D15/36</further-classification>
        <further-classification edition="200601120260504B">C07K16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦迪洛　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANTILLO, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕林　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALIN, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯諾　克里絲蒂娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASSNO, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯文　克里斯托弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COWAN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於線上濃縮及減少中間過程池之改良系統及方法，以緩解與高效價蛋白質純化過程相關的設備適配挑戰。本發明亦提供藉由在蛋白質純化過程中將單程切向流過濾(SPTFF)系統之管柱與病毒滅活池過濾(VIPF)整合來濃縮及減少VI池體積的方法。亦提供藉由該等方法純化之治療性蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The inventions provide improved systems and methods for inline concentrating and reducing intermediate process pools to mitigate plant fit challenges associated with high-titer protein purification process. The inventions also provide methods for concentrating and reducing VI pool volumes by integrating columns of single pass tangential flow filtration (SPTFF) system with viral inactivation pool filtration (VIPF) in protein purification process. Therapeutic proteins purified by the methods also are provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1247" publication-number="202633309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title>METHOD FOR PROCESSING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P70/00</main-classification>
        <further-classification edition="202601120260428B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莉婭　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ELIA, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯曼　羅那得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASMAN, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理方法包括將異丙醇(IPA)分配至基板上，將基板提供至處理腔室中，將處理腔室加壓至高於5 MPa的壓力，藉由使用液態二氧化碳(CO&lt;sub&gt;2&lt;/sub&gt;)置換IPA而移除基板上的IPA，以及藉由將處理腔室排氣而移除成為氣態CO&lt;sub&gt;2&lt;/sub&gt;的液態CO&lt;sub&gt;2&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes dispensing isopropyl alcohol (IPA) onto the substrate, providing the substrate into a processing chamber, pressurizing the processing chamber to a pressure above 5 MPa, removing the IPA on the substrate by displacing the IPA with liquid carbon dioxide (CO&lt;sub&gt;2&lt;/sub&gt;), and removing the liquid CO&lt;sub&gt;2&lt;/sub&gt; as gaseous CO&lt;sub&gt;2&lt;/sub&gt; by venting the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">100:處理系統</p>
        <p type="p">105:處理腔室</p>
        <p type="p">106:處理空間</p>
        <p type="p">110:底板</p>
        <p type="p">115:頂板</p>
        <p type="p">120:下工作表面</p>
        <p type="p">123:銷</p>
        <p type="p">125:上工作表面</p>
        <p type="p">130,135:開口</p>
        <p type="p">140:液體</p>
        <p type="p">145:液體供應閥</p>
        <p type="p">150:氣體</p>
        <p type="p">155:氣體供應閥</p>
        <p type="p">160:控制器</p>
        <p type="p">170,175:升降機構</p>
        <p type="p">190:引流系統</p>
        <p type="p">192:導管的第一部分</p>
        <p type="p">195:導管</p>
        <p type="p">200:第一組閥</p>
        <p type="p">202:第二組閥</p>
        <p type="p">204:氣體入口</p>
        <p type="p">
        &lt;i&gt;g&lt;/i&gt;:間隙</p>
        <p type="p">
        &lt;i&gt;g&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;U&lt;/i&gt;
        &lt;/sub&gt;:上間隙</p>
        <p type="p">
        &lt;i&gt;g&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;L&lt;/i&gt;
        &lt;/sub&gt;:下間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1248" publication-number="202631140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含橋聯三環胺甲醯基吡啶酮化合物及Ｐ－醣蛋白抑制劑之組合療法</chinese-title>
        <english-title>COMBINATION THERAPY COMPRISING BRIDGED TRICYCLIC CARBAMOYLPYRIDONE COMPOUNDS AND P-GLYCOPROTEIN INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/499</main-classification>
        <further-classification edition="200601120260504B">A61K31/4725</further-classification>
        <further-classification edition="200601120260504B">A61P31/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘瑞樂茲　布恩羅斯卓　安娜　Ｚ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ BUENROSTRO, ANA Z.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茨瓦爾德　格雷格　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZWALDER, GREGG M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紹德殷德　艾莉雅　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHODEINDE, AALIYAH B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇布拉曼尼亞　穆拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, MURALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於式I或式II之化合物與P-醣蛋白抑制劑之組合。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="414px" width="289px" file="ed10418.JPG" alt="ed10418.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;亦揭示包含該等組合之醫藥組成物。本揭露之組合可用於治療或預防人類免疫缺乏病毒(HIV)感染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to combinations of compounds of Formula I or Formula II with a P-glycoprotein inhibitor. &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="413px" width="306px" file="ed10419.JPG" alt="ed10419.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;Also disclosed are pharmaceutical compositions comprising said combinations. The combinations of the disclosure are useful in treating or preventing human immunodeficiency virus (HIV) infection.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1249" publication-number="202631694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉麩醯胺酸酶融合體、包含該融合體之抗體修飾劑及使用該融合體之抗體藥物複合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K19/00</main-classification>
        <further-classification edition="200601120260504B">C12N9/10</further-classification>
        <further-classification edition="200601120260504B">C12P21/00</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人九州大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上雅晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木晃生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津村享佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUMURA, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷典穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, NORIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種轉麩醯胺酸酶融合體、包含該融合體之抗體修飾劑及使用該融合體之抗體藥物複合物之製造方法，該轉麩醯胺酸酶融合體係源自活性型微生物之轉麩醯胺酸酶前驅物與抗體結合性肽化合物連結而成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:源自活性型微生物之轉麩醯胺酸酶前驅物(活性型ProMTG)</p>
        <p type="p">2:抗體結合性肽化合物</p>
        <p type="p">3:連接子</p>
        <p type="p">10:轉麩醯胺酸酶融合體(MTG融合體)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1250" publication-number="202631909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封材及半導體裝置</chinese-title>
        <english-title>SEALING MATERIAL AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09C1/48</main-classification>
        <further-classification edition="200601120260504B">C09K3/10</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島和史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山浦格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAURA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">密封材含有：環氧樹脂、無機填充材、以及密度為1.82 g/cm&lt;sup&gt;3&lt;/sup&gt;以上的碳黑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The sealing material contains an epoxy resin, an inorganic filler, and carbon black having a density of 1.82 g/cm³ or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">20:半導體晶片(元件)</p>
        <p type="p">30:引線框架</p>
        <p type="p">31:晶粒焊墊</p>
        <p type="p">32:分割片</p>
        <p type="p">33:引線</p>
        <p type="p">40:密封構件/密封部</p>
        <p type="p">55:連接端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1251" publication-number="202632262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面電位分布計測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G01N25/00</main-classification>
        <further-classification edition="200601120260427B">G01R29/12</further-classification>
        <further-classification edition="200601120260427B">G01R29/14</further-classification>
        <further-classification edition="200601120260427B">G01R29/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊永和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUNAGA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的表面電位分布計測裝置係具備：感測器基板，係具備複數個感測器；振動部，係使感測器基板振動；電性特性計測部，係使用各前述感測器來對計測對象的電位進行計測；加熱部，係加熱計測對象；溫度計測部，係對前述感測器基板以及前述計測對象的溫度進行計測；以及控制部，係控制前述感測器基板的前述溫度；前述控制部係將前述感測器基板的前述溫度控制成前述感測器基板的前述溫度在臨限值以上的時間呈預定的時間以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感測器基板</p>
        <p type="p">11a:第一面</p>
        <p type="p">11b:第二面</p>
        <p type="p">15:連接部</p>
        <p type="p">20:保持部</p>
        <p type="p">21:保持板</p>
        <p type="p">21a:面</p>
        <p type="p">22:固定部</p>
        <p type="p">30:軸</p>
        <p type="p">40:振動部</p>
        <p type="p">45:振動控制部</p>
        <p type="p">50:電性特性計測部</p>
        <p type="p">51:溫度計測部</p>
        <p type="p">60:試樣台</p>
        <p type="p">61:軸</p>
        <p type="p">62:點接觸構造</p>
        <p type="p">63:支撐部</p>
        <p type="p">65:移動部</p>
        <p type="p">70:加熱部</p>
        <p type="p">80:冷卻部</p>
        <p type="p">100:表面電位分布計測裝置</p>
        <p type="p">110:振動計測部</p>
        <p type="p">120:距離計測部</p>
        <p type="p">130:控制部</p>
        <p type="p">D:距離</p>
        <p type="p">O:計測對象</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1252" publication-number="202632605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造腔室的重建</chinese-title>
        <english-title>RECONSTRUCTIONS OF SEMICONDUCTOR FABRICATION CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260427B">G06T19/00</main-classification>
        <further-classification edition="201701120260427B">G06T7/50</further-classification>
        <further-classification edition="201101120260427B">G06T15/10</further-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦拉尼　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWLANI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭森　保羅　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANZEN, PAUL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉比　拉福商</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABBI, RAFSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於此敘述產生處理腔室重建的技術。在一些實施例中，該技術可以涉及為一組感測器中的每一感測器獲得一組資料禎。該技術可以進一步涉及對於給定的禎，為該組感測器中的每一感測器進行三維重建，以獲得與該禎關聯的深度資訊。該技術可以進一步涉及使用與來自該組感測器中的該些感測器的該禎關聯的深度資訊以重建一三維禎。該技術可以進一步涉及響應於判定該組禎的全部的禎已經過處理，產生一三維景象，其包含該些重建的三維禎，其中該三維景象表示該處理腔室中的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for generating process chamber reconstructions are described herein. In some embodiments, the techniques may involve obtaining, for each sensor in a set of sensors, a set of frames of data. The techniques may further involve for a given frame, for each sensor in the set of sensors, performing three-dimensional reconstruction to obtain depth information associated with the frame. The techniques may further involve using the depth information associated with the frame from the sensors in the set of sensors to reconstruct a three-dimensional frame. The techniques may further involve responsive to determining that all frames of the set of frames have been processed, generating a three-dimensional scene comprising the reconstructed three-dimensional frames, wherein the three-dimensional scene represents portions within the process chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302~310:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1253" publication-number="202631761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F290/14</main-classification>
        <further-classification edition="200601120260504B">C08F299/02</further-classification>
        <further-classification edition="200601120260504B">C08K5/07</further-classification>
        <further-classification edition="200601120260504B">C08K5/3435</further-classification>
        <further-classification edition="200601120260504B">C08L63/10</further-classification>
        <further-classification edition="200601120260504B">C08L67/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/09</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪岡諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKIOKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一種永久抗蝕劑用之感光性樹脂組成物，其含有酸改質含乙烯基樹脂、光聚合起始劑、聚酯系彈性體及選自由聚合抑制劑及紫外線吸收劑組成的組中的至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1254" publication-number="202633273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造方法</chinese-title>
        <english-title>METHOD FOR SEMICONDUCTOR MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10P14/44</main-classification>
        <further-classification edition="200601120260429B">C23C14/16</further-classification>
        <further-classification edition="200601120260429B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　德寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TEK PO RINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今北健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAKITA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體製造方法包含將基板提供至電漿處理室中，使用包含氪氣或氙氣的濺鍍氣體以物理氣相沉積法在該基板上方形成釕層，以及以減法製程自該釕層形成釕特徵部。該物理氣相沉積法係在基板溫度低於100℃時執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for semiconductor manufacturing includes providing a substrate into a plasma processing chamber, forming a ruthenium layer over the substrate with a physical vapor deposition using a sputtering gas including krypton or xenon, and forming a ruthenium feature from the ruthenium layer with a subtractive process. The physical vapor deposition is performed at a substrate temperature of less than 100 ˚C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理室</p>
        <p type="p">15:卡盤</p>
        <p type="p">20:真空泵</p>
        <p type="p">22:出口</p>
        <p type="p">30:氣體源</p>
        <p type="p">32:入口</p>
        <p type="p">40:離子</p>
        <p type="p">50:基板</p>
        <p type="p">70:靶材</p>
        <p type="p">72:釕金屬原子</p>
        <p type="p">74:頂部陰極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1255" publication-number="202633476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具冗餘資料線的多晶片組半導體裝置</chinese-title>
        <english-title>MULTI-CHIPLET SEMICONDUCTOR DEVICE WITH REDUNDANT DATA LINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/65</main-classification>
        <further-classification edition="202601120260427B">H10W20/43</further-classification>
        <further-classification edition="202001120260427B">G01R31/52</further-classification>
        <further-classification edition="202001120260427B">G01R31/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程　德康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DERKANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張庭豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達利達　羅倫佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEDARIDA, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴托里　賽門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTOLI, SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戚史駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, SHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉劍靈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉櫂宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括介於第一及第二晶片組之間而包含有資料線及冗餘資料線的介面。第一及第二晶片組包括各自電耦合至其中一條資料線的輸入/輸出模組。第一晶片組的每個輸入/輸出模組被建構成通過其對應的資料線以將資料傳送至第二晶片組的對應輸入/輸出模組。在資料線故障的情況下，相應的一個輸入/輸出模組可將其資料重新導向至第二輸入/輸出模組以通過其資料線進行傳輸，並且，第二輸入/輸出模組可將其資料重新導向至第三輸入/輸出模組以通過其資料線進行傳輸，依此類推，直至最後一個輸入/輸出模組可將其資料重新導向至冗餘資料線以通過冗餘資料線進行傳輸為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an interface between first and second chiplets that comprises data lines and a redundant data line. The first and second chiplets include input/output modules each electrically coupled to one of the data lines. Each input/output module of the first chiplet is configured to send data over its corresponding data line to the corresponding input/output module of the second chiplet. In the case of a faulty data line, the corresponding one input/output module can reroute its data to a second input/output module for transmission over its data line, and the second input/output module can reroute its data to a third input/output module for transmission over its data line, and so on, until the last input/output module can reroute its data to the redundant data line for transmission over the redundant data line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">12:(第一)晶片組</p>
        <p type="p">14:(第二)晶片組</p>
        <p type="p">20:接觸墊</p>
        <p type="p">42:介面</p>
        <p type="p">DL1:資料線</p>
        <p type="p">DL2:資料線</p>
        <p type="p">DL3:資料線</p>
        <p type="p">DL4:資料線</p>
        <p type="p">G1:群組</p>
        <p type="p">IO1:輸入/輸出模組</p>
        <p type="p">IO2:輸入/輸出模組</p>
        <p type="p">IO3:輸入/輸出模組</p>
        <p type="p">IO4:輸入/輸出模組</p>
        <p type="p">IO5:輸入/輸出模組</p>
        <p type="p">IO6:輸入/輸出模組</p>
        <p type="p">IO7:輸入/輸出模組</p>
        <p type="p">IO8:輸入/輸出模組</p>
        <p type="p">RDL:冗餘資料線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1256" publication-number="202633354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體量測設備之軟片框預對準的方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS OF FILM FRAME PRE-ALIGNMENT FOR SEMICONDUCTOR MEASUREMENT EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P72/50</main-classification>
        <further-classification edition="202601120260428B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎弗蘭妮　阿布納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAFRANI, AVNER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞可雷柏　安卓伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAKOVLEV, ANDREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾隆　蓋爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALON, GAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧瑟倫可　伊萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAULENKO, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中闡述用於對安裝至一軟片框(FF)之裝置進行高精確度、高處理量量測之方法及系統。一種預對準系統精確地量測一軟片框及由軟片框支撐之一晶圓兩者相對於被固定至一量測系統之一座標系統之位置及定向，該量測系統用於表徵被量測之裝置。以此方式，將軟片框及由軟片框支撐之晶圓以相對於量測系統之一已知定向及位置裝載至一量測系統卡盤上。精確地知曉軟片框及晶圓之位置及定向會使得量測系統能夠以最小的處理量損失導航通過晶圓位點，此乃因通常不需要額外搜尋及對準序列。在較佳實施例中，一預對準系統與一量測系統整合在一起以在一共用設備涵蓋區內執行預對準功能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for high precision, high throughput measurement of devices mounted to a Film Frame (FF) are described herein. A pre-alignment system precisely measures the position and orientation of both a film frame and a wafer supported by the film frame with respect to a coordinate system fixed to a measurement system employed to characterize devices under measurement. In this manner, the film frame and the wafer supported by the film frame are loaded onto a measurement system chuck with a known orientation and position with respect to the measurement system. Precise knowledge of position and orientation of the film frame and wafer enables measurement system navigation through wafer sites with minimal throughput loss as additional search and alignment sequences are generally not required. In preferred embodiments, a pre-alignment system is integrated with a measurement system to perform pre-alignment functionality within a shared equipment footprint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:預對準系統/軟片框預對準系統</p>
        <p type="p">121:周界框</p>
        <p type="p">122:軟片</p>
        <p type="p">123:晶圓</p>
        <p type="p">124:預對準框</p>
        <p type="p">125:照明子系統/子系統</p>
        <p type="p">126:成像子系統/相機/偵測器</p>
        <p type="p">127:軟片框卡盤/預對準卡盤</p>
        <p type="p">128:旋轉致動器</p>
        <p type="p">129:墊</p>
        <p type="p">130:運算系統</p>
        <p type="p">131:處理器</p>
        <p type="p">132:電腦可讀記憶體/記憶體</p>
        <p type="p">133:匯流排</p>
        <p type="p">134:記憶體</p>
        <p type="p">135:命令信號</p>
        <p type="p">136:命令信號</p>
        <p type="p">137:影像信號/輸出影像</p>
        <p type="p">138:旋轉位置信號</p>
        <p type="p">139:輸出信號</p>
        <p type="p">151:漫射體/照明源</p>
        <p type="p">152:照明輸出/照明光/漫射照明光</p>
        <p type="p">153:所收集的光</p>
        <p type="p">154:透鏡/集光子系統/集光光學器件</p>
        <p type="p">155:升降銷</p>
        <p type="p">156:旋轉量測子系統/旋轉編碼器</p>
        <p type="p">158:軟片框</p>
        <p type="p">A:旋轉軸線/軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1257" publication-number="202631521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用旋轉填充床裝置自陰離子界面活性劑移除微量成份之方法</chinese-title>
        <english-title>METHOD FOR REMOVING TRACE COMPONENTS FROM AN ANIONIC SURFACTANT USING A ROTATING PACKED BED DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260424B">C02F1/58</main-classification>
        <further-classification edition="202301120260424B">C02F1/12</further-classification>
        <further-classification edition="200601120260424B">B01D15/40</further-classification>
        <further-classification edition="200601120260424B">B01D53/62</further-classification>
        <further-classification edition="200601120260424B">B01D53/78</further-classification>
        <further-classification edition="200601120260424B">B01J8/02</further-classification>
        <further-classification edition="200601120260424B">B01J8/20</further-classification>
        <further-classification edition="200601120260424B">B01J8/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查莎妮絲　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHASANIS, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼克　埃克　歐夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHNKE, EIKE ULF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷斯馬赫　倫伯格　克里斯堤安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLASMACHER-REMBERG, CHRISTIANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞茲　阿努爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REITZE, ARNULF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施米茨　尼克拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMITZ, NIKLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史切貝克　格哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEMBECKER, GERHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫普　約爾格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOOP, JOERG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種使用旋轉填充床裝置(1)自陰離子界面活性劑(2)移除微量成份(3)、尤其自陰離子界面活性劑移除二㗁烷之方法，該方法(1000)包含以下步驟：在處理腔室(11)中設定(1010)低壓；將待處理之陰離子界面活性劑(2)透過液體入口管道(14)饋送(1020)至轉子單元(20)；將用於處理提供至該轉子單元(20)之陰離子界面活性劑(2)之汽提介質(4)透過汽提介質入口開口(12)饋送(1030)至該轉子單元，該轉子單元配置於設定為低壓的該處理腔室(11)內部，使得該汽提介質在該轉子單元(20)內沿著與該陰離子界面活性劑相反的方向流動；在旋轉(1040)該轉子單元(20)的同時將該陰離子界面活性劑(2)及該汽提介質(4)饋送至旋轉的轉子單元(20)，使得該陰離子界面活性劑(2)由於離心力而沿該旋轉的轉子單元(20)之徑向向外輸送，而該汽提介質朝向該轉子單元(20)之旋轉軸(A)沿徑向向內流動通過該轉子單元(20)，其中藉由沿該陰離子界面活性劑以逆流方向流動且與該陰離子界面活性劑接觸之汽提介質自該陰離子界面活性劑移除微量成份；透過液體出口開口(15)排出(1050)經處理之陰離子界面活性劑(2a)；以及將輸送通過該轉子單元(20)的汽提介質(4)及自該陰離子界面活性劑(2)移除之微量成份(3)透過汽提介質出口開口(13)排出(1060)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for removing trace components (3) from an anionic surfactant (2), in particular for removing dioxane from the anionic surfactant, using a rotating packed bed device (1), the method (1000) comprising following steps: setting (1010) a low-pressure in the processing chamber (11), feeding (1020) the anionic surfac-tant (2) to be treated to the rotor unit (20) through the liquid inlet conduit (14), feeding (1030) the stripping medium (4) for treating the anionic surfactant (2) provided to the rotor unit (20) through the stripping medium inlet opening (12) into the rotor unit that is arranged inside of the processing chamber (11) that is set to low-pressure, such that the stripping medium flows in the opposite direction to the anionic surfactant within the rotor unit (20), rotating (1040) the rotor unit (20) while feeding the anionic surfactant (2) and the stripping medium (4) to the rotating rotor unit (20) such that the anionic surfactant (2) is conveyed outward in the radial direction of the rotating rotor unit (20) due to the centrifu-gal force while the stripping medium flows inward through the rotor unit (20) in the radial direction towards the rotational axis (A) of the rotor unit (20), wherein the trace compo-nents are removed from the anionic surfactant by the stripping medium flowing in a counter current direction along and contacting the anionic surfactant, discharging (1050) the treated anionic surfactant (2a) through the liquid outlet opening (15), and discharging (1060) the stripping medium (4) conveyed through the rotor unit (20) and trace compo-nents (3) removed from the anionic surfactant (2) through the stripping medium outlet opening (13).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉填充床裝置</p>
        <p type="p">2:陰離子界面活性劑</p>
        <p type="p">2a:經處理之陰離子界面活性劑</p>
        <p type="p">3:微量成份</p>
        <p type="p">4:汽提介質</p>
        <p type="p">10:外殼單元</p>
        <p type="p">11:處理腔室</p>
        <p type="p">12:汽提介質入口開口</p>
        <p type="p">13:汽提介質出口開口</p>
        <p type="p">14:液體入口管道</p>
        <p type="p">15:液體出口開口</p>
        <p type="p">16:動態密封件</p>
        <p type="p">17:密封件</p>
        <p type="p">20:轉子單元</p>
        <p type="p">21:轉子軸</p>
        <p type="p">22:驅動單元</p>
        <p type="p">A:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1258" publication-number="202632429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低氣體流量之加濕</chinese-title>
        <english-title>HUMIDIFICATION OF LOW GAS FLOWS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G03F7/20</main-classification>
        <further-classification edition="202601120260421B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰森　艾德溫　佩楚斯　艾羅斯　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIJSSEN, EDWIN PETRUS ALOIS MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　杜倫　約里斯　埃吉迪厄斯　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DUUREN, JORIS EGIDIUS PIETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡森　法蘭西瑟斯　喬漢那斯　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN, FRANCISCUS JOHANNES JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於產生用於一微影設備之一沖洗氣體之加濕器裝置，該裝置包含：一第一氣體入口，其經組態以接收一第一氣體之一第一流；一第二氣體入口，其經組態以接收該第一氣體之一第二流；一富集器(enricher)，其經組態以產生包含該第一氣體之該第二流及水或過氧化氫之一富集氣流；及一混合器，其經組態以將該第一氣體之該第一流與來源於該富集氣流之一富集氣體混合以產生該沖洗氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A humidifier device for generating a purge gas for a lithographic apparatus, the device comprising: a first gas inlet configured to receive a first flow of a first gas; a second gas inlet configured to receive a second flow of the first gas; an enricher configured to generate an enriched gas flow comprising the second flow of the first gas and water or hydrogen peroxide; and a mixer configured to mix the first flow of the first gas with an enriched gas derived from the enriched gas flow to generate the purge gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:加濕器裝置</p>
        <p type="p">110:氣體源</p>
        <p type="p">120:第一流</p>
        <p type="p">130:第二流</p>
        <p type="p">160:富集器</p>
        <p type="p">170:富集氣流</p>
        <p type="p">180:混合器</p>
        <p type="p">190:沖洗氣體</p>
        <p type="p">300:流量控制器</p>
        <p type="p">310:另一流量控制器</p>
        <p type="p">315:流量控制器</p>
        <p type="p">320:壓力感測器及/或壓力控制器</p>
        <p type="p">330:分支</p>
        <p type="p">330.1:分支</p>
        <p type="p">330.2:分支</p>
        <p type="p">340:分支</p>
        <p type="p">350:閥</p>
        <p type="p">360:流量收縮器</p>
        <p type="p">370:濕度感測器</p>
        <p type="p">380:內部</p>
        <p type="p">390:頃卸槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1259" publication-number="202632092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於層插入之電漿產生器及注射器組件、以及相關之方法、處理腔室及系統</chinese-title>
        <english-title>PLASMA GENERATOR AND INJECTOR ASSEMBLY FOR LAYER INSERTION, AND RELATED METHODS, PROCESSING CHAMBERS, AND SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C30B25/14</main-classification>
        <further-classification edition="200601120260421B">C30B25/16</further-classification>
        <further-classification edition="200601120260421B">C30B25/18</further-classification>
        <further-classification edition="200601120260421B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索旺　穆赫勒斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOWWAN, MUKHLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬普拉　索拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOPRA, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例通常關於用於處理腔室的注射器組件，以及相關的部件和方法。在一或多個實施例中，基板處理的方法包括執行點火製程，包括將電漿氣體流入電漿空間並點燃該電漿氣體以形成電漿。該方法進一步包括執行沉積製程，包括將處理氣體流入製程腔室的內部空間並流過該內部空間中的基板，並在基板上方沉積沉積結構。該方法進一步包括執行插入製程，包括將插入氣體以少於5秒的時間流入電漿空間中的電漿，以形成來自插入氣體的流出物，並將流出物流入內部空間並流過該內部空間中的基板，並將流出物插入沉積結構中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to an injector assembly for use in a processing chamber, and related components and methods. In one or more embodiments, a method of substrate processing includes performing an ignition process including flowing a plasma gas into a plasma volume and igniting the plasma gas into a plasma. The method further includes performing a deposition process including flowing a processing gas into an internal volume of a process chamber and across a substrate in the internal volume and depositing a deposition structure over the substrate. The method further includes performing an insertion process including flowing an insertion gas for a time of less than 5 seconds into the plasma within the plasma volume to form effluents from the insertion gas, flowing the effluents into the internal volume and across the substrate in the internal volume, and inserting the effluents into the deposition structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">170:電漿產生器</p>
        <p type="p">180:注射器</p>
        <p type="p">212:通道</p>
        <p type="p">214:通道</p>
        <p type="p">215:前表面</p>
        <p type="p">216:通道</p>
        <p type="p">220:注射器主體</p>
        <p type="p">245:電漿腔室外殼</p>
        <p type="p">255:產生器外殼</p>
        <p type="p">265:電漿管</p>
        <p type="p">280:擋板</p>
        <p type="p">300:注射器組件</p>
        <p type="p">310:電力適配器部分</p>
        <p type="p">312:電力適配器區塊</p>
        <p type="p">315:電纜進口</p>
        <p type="p">317:冷卻液進口</p>
        <p type="p">318:冷卻液出口</p>
        <p type="p">320:電漿氣體進口部分</p>
        <p type="p">322:氣體適配器區塊</p>
        <p type="p">325:氣體進口適配器</p>
        <p type="p">330:注射器氣體進口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1260" publication-number="202633023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟性電路板、ＣＯＦ模組及包括其等之電子裝置</chinese-title>
        <english-title>FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H05K1/02</main-classification>
        <further-classification edition="200601120260428B">H05K1/11</further-classification>
        <further-classification edition="200601120260428B">H05K1/14</further-classification>
        <further-classification edition="202601120260428B">H05K1/18</further-classification>
        <further-classification edition="202601120260428B">H05K1/185</further-classification>
        <further-classification edition="202601120260428B">H05K1/189</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡星玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, SUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴起台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜採元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹亨珪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴知曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI HYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫萬基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, MANK KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種軟性電路板，包含：一基板；一上佈線圖案部，設置於該基板上；以及一上保護層，設置於該上佈線圖案部上且包含複數個開口區域，其中該上佈線圖案部包含：一上佈線層，設置於該基板上；一第一上電鍍層，設置於該上佈線層之上；以及一第二上電鍍層，設置於該第一上電鍍層之上，其中，該上保護層設置於該上佈線圖案部的該第一上電鍍層之上且不接觸該上佈線層，以及該第二上電鍍層設置於該上保護層的該複數個開口區域內的該第一上電鍍層之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flexible circuit board according to an embodiment includes a substrate; an upper wiring pattern part disposed on the substrate; and an upper protective layer disposed on the upper wiring pattern part and including a plurality of open regions, wherein the upper wiring pattern part includes: an upper wiring layer disposed on the substrate; a first upper plating layer disposed on the upper wiring layer; and a second upper plating layer disposed on the first upper plating layer, wherein the upper protective layer is disposed on the first upper plating layer of the upper wiring pattern part and does not contact the upper wiring layer, and wherein the second upper plating layer is disposed on the first upper plating layer in the plurality of open regions of the upper protective layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100E1:第一側端</p>
        <p type="p">100E2:第二側端</p>
        <p type="p">200:第一佈線圖案部</p>
        <p type="p">210:第一-第一佈線圖案部</p>
        <p type="p">220:第一-第二佈線圖案部</p>
        <p type="p">300:第二佈線圖案部</p>
        <p type="p">310:第二-第一佈線圖案部</p>
        <p type="p">320:第二-第二佈線圖案部</p>
        <p type="p">400:第三佈線圖案部</p>
        <p type="p">500:第一虛擬圖案部</p>
        <p type="p">510:第一-第一虛擬圖案部</p>
        <p type="p">520:第一-第二虛擬圖案部</p>
        <p type="p">530:第一-第三虛擬圖案部</p>
        <p type="p">600:第二虛擬圖案部</p>
        <p type="p">700:第三虛擬圖案部</p>
        <p type="p">1000:軟性電路板</p>
        <p type="p">AA:有效區域</p>
        <p type="p">BA:彎曲區域</p>
        <p type="p">CHA:晶片安裝區域</p>
        <p type="p">DP、WP:佈線圖案部</p>
        <p type="p">SH:鏈輪孔</p>
        <p type="p">UA:非有效區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1261" publication-number="202633131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　智馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JI-HYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊海峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連延杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAN, YANJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅達平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, DAPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體基板具有源極區、汲極區、位於源極區和汲極區之間的本體區以及位於本體區和汲極區之間的漂移區。閘極結構位於體區上方。第一介電層位於半導體基板的漂移區上方並且圍繞閘極結構。第二介電層位於半導體基板的漂移區上方並且與第一介電層的頂面接觸。第二介電層包括與第一介電層的材料不同的材料。接觸場板位於半導體基板的漂移區和第一介電層上方。接觸場板延伸穿過第二介電層並且與第一介電層的頂面接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The semiconductor substrate has a source region, a drain region, a body region between the source region and the drain region, and a drift region between the body region and the drain region. The gate structure is over the body region. The first dielectric layer is over the drift region of the semiconductor substrate and surrounding the gate structure. The second dielectric layer is over the drift region of the semiconductor substrate and in contact with a top surface of the first dielectric layer. The second dielectric layer includes a material different from a material of the first dielectric layer. The contact field plate is over the drift region of the semiconductor substrate and the first dielectric layer. The contact field plate extends through the second dielectric layer and in contact with the top surface of the first dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:半導體基板</p>
        <p type="p">112:主體區</p>
        <p type="p">114:漂移區</p>
        <p type="p">116:源極區</p>
        <p type="p">118:汲極區</p>
        <p type="p">119:接觸區</p>
        <p type="p">120:閘極結構</p>
        <p type="p">122:閘極介電質</p>
        <p type="p">124:閘極電極</p>
        <p type="p">142:金屬矽化物層</p>
        <p type="p">144:金屬矽化物層</p>
        <p type="p">150:多膜介電層</p>
        <p type="p">152:矽化物阻擋層</p>
        <p type="p">153:接觸蝕刻停止層</p>
        <p type="p">154:介電層</p>
        <p type="p">160’:接觸抗蝕刻層</p>
        <p type="p">170:層間介電層</p>
        <p type="p">200:金屬化層</p>
        <p type="p">212,214,216:金屬特徵</p>
        <p type="p">220:介電層</p>
        <p type="p">T1:高壓電晶體裝置</p>
        <p type="p">CT1,CT2,CT3:接觸件</p>
        <p type="p">CT3B:底面</p>
        <p type="p">CT3S:側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1262" publication-number="202633375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電卡盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/72</main-classification>
        <further-classification edition="202601120260420B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富岡武敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIOKA, TAKETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之靜電卡盤具備：介電構件，其以支持基板之方式構成，且包含第1上表面及環狀密封帶，密封帶具有較第1上表面高之第2上表面；第1靜電電極，其配置於介電構件內之第1上表面之下方；及第2靜電電極，其配置於介電構件內之第2上表面之下方且與第1靜電電極電性連接，且構成為第2上表面與第2靜電電極之間的上下方向之第1距離小於包含第1靜電電極之第1水平面與第2上表面之間的上下方向之第2距離，並且大於包含第1上表面之第2水平面與第2上表面之間的上下方向之第3距離，且第2靜電電極之內側端位於較密封帶之內側端更靠外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:第1上表面</p>
        <p type="p">201:密封帶</p>
        <p type="p">250:內周壁</p>
        <p type="p">251:外周壁</p>
        <p type="p">252:第2上表面</p>
        <p type="p">254:角部</p>
        <p type="p">300:第1靜電電極</p>
        <p type="p">301:第2靜電電極</p>
        <p type="p">310:第1電極上表面</p>
        <p type="p">311:第1電極下表面</p>
        <p type="p">320:第2電極上表面</p>
        <p type="p">321:第2電極下表面</p>
        <p type="p">322:第內側面</p>
        <p type="p">323:外側面</p>
        <p type="p">1111:靜電卡盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電卡盤電極</p>
        <p type="p">1111c:外周壁</p>
        <p type="p">a1:第1距離</p>
        <p type="p">a2:第2距離</p>
        <p type="p">a3:第3距離</p>
        <p type="p">a4:第4距離</p>
        <p type="p">a5:第5距離</p>
        <p type="p">a6:第6距離</p>
        <p type="p">D1:寬度</p>
        <p type="p">E1:空間</p>
        <p type="p">H1:高度</p>
        <p type="p">P1:第1水平面</p>
        <p type="p">P2:第2水平面</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">W:基板</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1263" publication-number="202632336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G02B6/12</main-classification>
        <further-classification edition="200601120260427B">G02B6/255</further-classification>
        <further-classification edition="200601120260427B">G02B6/34</further-classification>
        <further-classification edition="201301120260427B">H04B10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, TZU JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾銘洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, MING YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及半導體元件及其製造方法。本公開描述了一種具有微波折射率可調諧的傳輸線結構的半導體耦合元件。該半導體耦合元件包括：在基底上的光波導和在基底上並且與光波導相鄰的傳輸線結構。該傳輸線結構包括第一柵狀結構和第二柵狀結構。該半導體耦合元件還包括連接到傳輸線結構的互連結構。互連結構將傳輸線結構耦合到光波導，並且包括被配置為將第一柵狀結構電連接到第二柵狀結構的電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a semiconductor coupling device having a transmission line structure with a tunable microwave index. The semiconductor coupling device includes an optical waveguide on a substrate and a transmission line structure on the substrate and adjacent to the optical waveguide. The transmission line structure includes a first grille structure and a second grille structure. The semiconductor coupling device further includes an interconnect structure connected to the transmission line structure. The interconnect structure couples the transmission line structure to the optical waveguide and includes a transistor configured to electrically connect the first grille structure to the second grille structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體耦合元件</p>
        <p type="p">110:電氣部分</p>
        <p type="p">112:輸入光信號</p>
        <p type="p">114:輸出光信號</p>
        <p type="p">120:光學部分</p>
        <p type="p">122:光調製器</p>
        <p type="p">G:接地線結構</p>
        <p type="p">S:信號線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1264" publication-number="202633396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由嵌段共聚物(BCPs)的定向自組裝(DSA)的圖案轉移</chinese-title>
        <english-title>PATTERN TRANSFER BY DIRECTED SELF-ASSEMBLY (DSA) OF BLOCK COPOLYMERS ‎‎(BCPS)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P76/00</main-classification>
        <further-classification edition="201101120260311B">B82Y40/00</further-classification>
        <further-classification edition="200601120260311B">G03F7/09</further-classification>
        <further-classification edition="200601120260311B">G03F7/085</further-classification>
        <further-classification edition="200601120260311B">C08L53/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡贊姆　納斯琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZEM, NASRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡納卡沙巴帕斯　西法納迪哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKASABAPATHY, SIVANANDHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特基　魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOJTECKI, RUDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處所述的實施例涉及一種對阻劑層進行圖案化的方法，該阻劑層包括曝光區域和未曝光區域。在一個實施例中，該方法包括在阻劑層上施加嵌段共聚物，該嵌段共聚物包括一個極性區域和一個非極性區域，且曝光區域與未曝光區域之間的化學差異使得嵌段共聚物能在阻劑層上進行定向自組裝。在一個實施例中，該方法進一步包括選擇性去除極性區域或非極性區域，以在阻劑層上形成圖案化的遮罩，並利用該圖案化的遮罩通過蝕刻製程對阻劑層進行圖案化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to a method of patterning a resist layer with an exposed region and an unexposed region. In an embodiment, the method includes applying a block copolymer over the resist layer, where the block copolymer includes a polar region and a non-polar region, and where a chemical difference between the exposed region and the unexposed region allows for directed self-assembly of the block copolymer over the resist layer. In an embodiment, the method further includes selectively removing either the polar region or the non-polar region to form a patterned mask over the resist layer, and patterning the resist layer with an etching process using the patterned mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">370:製程</p>
        <p type="p">371:操作</p>
        <p type="p">372:操作</p>
        <p type="p">373:操作</p>
        <p type="p">374:操作</p>
        <p type="p">375:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1265" publication-number="202632742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有非圓柱形腔體天線的微波電漿源</chinese-title>
        <english-title>MICROWAVE PLASMA SOURCE WITH NON-CYLINDRICAL CAVITY ANTENNAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘塔　賽耀史威普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANTA, SATHYA SWAROOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝拉　卡羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERA, KALLOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿布考恩　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUBUCHON, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處所述的實施例涉及一種裝置，包括一個板材，該板材包括第一介電材料，並且有一個與板材耦合的共振器。在一個實施例中，該共振器包括第二介電材料，且該共振器具有一個剖面形狀，其一端具有第一寬度，另一端具有小於第一寬度的第二寬度。在一個實施例中，第一端面對該板材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes a plate, where the plate includes a first dielectric material, and a resonator coupled to the plate. In an embodiment, the resonator includes a second dielectric material, and the resonator has a cross-sectional shape with a first end with a first width and a second end with a second width that is smaller than the first width. In an embodiment, the first end faces the plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微波電漿源</p>
        <p type="p">105:介電圓盤</p>
        <p type="p">106:孔</p>
        <p type="p">108:銷</p>
        <p type="p">110:介電共振器</p>
        <p type="p">115:微波功率放大器</p>
        <p type="p">120:介電板材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1266" publication-number="202631621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＲＥＭ２促效劑</chinese-title>
        <english-title>TREM2 AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/04</main-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61P19/02</further-classification>
        <further-classification edition="200601120260504B">A61P25/16</further-classification>
        <further-classification edition="200601120260504B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏彭蒂耶　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARPENTIER, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　弗朗切斯科　瑪麗亞　艾蜜莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DI FRANCESCO, MARIA EMILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞登　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEIDAN, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐哈拉　費歐恩　蘇姍娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'HARA, FIONN SUSANNAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加利　圭多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLEY, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧比　路卡　克勞迪歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOBBI, LUCA CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古巴　沃爾夫崗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUBA, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波屈透得　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERCHTOLD, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾曼蒂　寶拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARAMENTI, PAOLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依姆赫夫　瑪麗　波爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMHOFF, MARIE-PAULE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有通式 (I) 的化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="246px" file="ed10176.JPG" alt="ed10176.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 A&lt;sup&gt;1&lt;/sup&gt;、A&lt;sup&gt;2&lt;/sup&gt;、X&lt;sup&gt;1&lt;/sup&gt;、X&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;3’&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;4’&lt;/sup&gt; 及 R&lt;sup&gt;7&lt;/sup&gt; 係如本文所述；包括該等化合物之組成物；製造該等化合物之方法；以及在與 TREM2 相關聯的疾病之治療或預防中使用該等化合物之方法。  &lt;br/&gt;***</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides compounds having the general formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="240px" file="ed10177.JPG" alt="ed10177.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein A&lt;sup&gt;1&lt;/sup&gt;, A&lt;sup&gt;2&lt;/sup&gt;, X&lt;sup&gt;1&lt;/sup&gt;, X&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;3’&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;4’&lt;/sup&gt;, and R&lt;sup&gt;7&lt;/sup&gt; are as described herein, compositions including the compounds, processes of manufacturing the compounds and methods of using the compounds in the treatment or prevention of diseases that are associated with TREM2. &lt;br/&gt;***</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1267" publication-number="202631141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療MDS相關聯之貧血及其他病況之化合物</chinese-title>
        <english-title>COMPOUNDS FOR TREATING MDS-ASSOCIATED ANEMIAS AND OTHER CONDITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/5025</main-classification>
        <further-classification edition="200601120260504B">A61P7/06</further-classification>
        <further-classification edition="200601120260504B">A61P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿吉歐斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGIOS PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　曉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, XIAOSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪巴可　莫莉莎　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIBACCO, MELISSA L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇奈德　班傑明　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, BENJAMIN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩恩　妮可　瑞奇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANE, NICOLE RACHELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中提供特定劑量或量之某些丙酮酸鹽激酶活化劑或其醫藥上可接受之鹽或組合物之用途，其用於治療低風險MDS、較低風險MDS及/或中等風險MDS (統稱為LR-MDS)相關聯之貧血及其他病況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is the use of particular dose levels or amounts of certain pyruvate kinase activators or pharmaceutically acceptable salts or compositions thereof, for treating anemia associated with low risk MDS, lower risk MDS and/or intermediate risk MDS (collectively, LR-MDS) and other conditions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1268" publication-number="202631109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K8/73</main-classification>
        <further-classification edition="200601120260504B">A61K8/25</further-classification>
        <further-classification edition="200601120260504B">A61K8/891</further-classification>
        <further-classification edition="200601120260504B">A61Q1/02</further-classification>
        <further-classification edition="200601120260504B">A61Q1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高絲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白岩由梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAIWA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種油性組成物，其係延展性之輕盈度、塗佈後之輪廓清晰度、化妝膜光澤之維持及無二次附著效果優異者。  &lt;br/&gt;　　解決本發明課題之油性組成物，其特徵為含有(A)乙基纖維素、(B)有機改質黏土礦物，及(C)苯基改質聚矽氧1~40質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1269" publication-number="202631383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃積層體及玻璃積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B32B17/06</main-classification>
        <further-classification edition="200601120260422B">B32B9/00</further-classification>
        <further-classification edition="200601120260422B">C03C17/34</further-classification>
        <further-classification edition="200601120260422B">C03C17/42</further-classification>
        <further-classification edition="200601120260422B">C03C23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示之製造方法包含以下步驟：步驟(i)，對包含玻璃薄膜、緩衝層及無機氧化物層之積層體，從無機氧化物層側照射第1雷射光，藉此去除無機氧化物層之一部分及緩衝層之一部分；及，步驟(ii)，係藉由照射第2雷射光來切斷積層體。第1雷射光之波長在9.2µm~10.8µm之範圍內。無機氧化物層對波長為10µm之光的消光係數為0.01以上。在步驟(i)中，係於緩衝層形成溝。在步驟(i)中，係以使緩衝層具有預定部分之方式來照射第1雷射光。在步驟(i)中，係以使緩衝層在溝之部分具有厚度為0.1µm以上且30µm以下之部分之方式，照射第1雷射光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積層體</p>
        <p type="p">100x:切斷部</p>
        <p type="p">111:玻璃薄膜</p>
        <p type="p">112:緩衝層</p>
        <p type="p">112g:溝</p>
        <p type="p">112t:一部分</p>
        <p type="p">113:無機氧化物層</p>
        <p type="p">L1:雷射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1270" publication-number="202633265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於氣體注入的方法與系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR GAS INJECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260425B">H10P14/24</main-classification>
        <further-classification edition="200601120260425B">C23C16/455</further-classification>
        <further-classification edition="200601120260425B">C23C16/18</further-classification>
        <further-classification edition="200601120260425B">F16K11/00</further-classification>
        <further-classification edition="200601120260425B">F16L55/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇堤宅　尤迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAGI, UDIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　宗斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZONGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古卡霖　梅尤古芬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULKARNI, MAYUR GOVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫馬德里　桑德什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMADRI, SANDESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納基拉曼　阿尼胥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANAKIRAMAN, ANISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿勒伍爾　阿尼魯德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEWOOR, ANIRUDH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮歐斯　柏納克莉絲堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIUS, BERNARD CHRISTY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班索　洛西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANSAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高爾　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLE, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於氣體注入的系統，包括：一第一三通閥，具有第一端口可連接至基板處理腔室，第二端口連接至第一氣體的供應，及第三端口；及一第二三通閥，具有第一端口連接至第二氣體的供應，第二端口連接至第一三通閥的第三端口，及第三端口可連接至一偏移路徑，其中在第一配置中，第一三通閥與第二三通閥被配置為將第一氣體與第二氣體引導以從第一三通閥的第一端口排出；其中在第二配置中，第一三通閥與第二三通閥被配置為將第一氣體與第二氣體引導以從第二三通閥的第三端口排出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for gas injection includes: a first three-port valve having a first port connectable to a substrate processing chamber, a second port connected to a supply of a first gas, and a third port; and a second three-port valve having a first port connected to a supply of a second gas, a second port connected to the third port of the first three-port valve, and a third port connectable to a divert path, wherein in a first configuration, the first three-port valve and the second three-port valve are configured to route the first gas and the second gas to exit the first port of the first three-port valve, wherein in a second configuration, the first three-port valve and the second three-port valve are configured to route the first gas and the second gas to exit the third port of the second three-port valve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板處理系統</p>
        <p type="p">201:氣體注入系統</p>
        <p type="p">202:第一三通閥</p>
        <p type="p">202a:第一端口</p>
        <p type="p">202b:第二端口</p>
        <p type="p">202c:第三端口</p>
        <p type="p">204:基板處理腔室</p>
        <p type="p">206:第一氣體</p>
        <p type="p">210:第二三通閥</p>
        <p type="p">210a:第一端口</p>
        <p type="p">210b:第二端口</p>
        <p type="p">210c:第三端口</p>
        <p type="p">212:第二氣體</p>
        <p type="p">214:偏移路徑</p>
        <p type="p">216:基板支撐件</p>
        <p type="p">218:控制器</p>
        <p type="p">220:第三氣體</p>
        <p type="p">222:隔離閥</p>
        <p type="p">224:無流量空間</p>
        <p type="p">226:蒸發器</p>
        <p type="p">228:入口</p>
        <p type="p">230:出口</p>
        <p type="p">232:管道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1271" publication-number="202632777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>匯流排模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260428B">H01M50/514</main-classification>
        <further-classification edition="202101120260428B">H01M50/209</further-classification>
        <further-classification edition="202101120260428B">H01M50/298</further-classification>
        <further-classification edition="202101120260428B">H01M50/503</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商矢崎總業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAKI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大平雄貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHIRA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂上僚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGAMI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原茂之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, SHIGEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠適當地進行內部水處理的匯流排模組。匯流排模組1係具備：匯流排2，其連接於電池單元11；端子3，其連接於匯流排2；以及，殼體4，其具有收容匯流排2及端子3之匯流排收容部41，以及連通設置於匯流排收容部41的下方並收容端子3與電線5的連接部之連接收容部42；連接收容部42係在組裝於電池單元11的狀態下朝向鉛垂方向Z的下方側開放而形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:匯流排模組</p>
        <p type="p">2:匯流排</p>
        <p type="p">3:端子</p>
        <p type="p">4:殼體</p>
        <p type="p">5:電線</p>
        <p type="p">21:連接孔</p>
        <p type="p">31:導體連接部</p>
        <p type="p">32:電線連接部</p>
        <p type="p">41:匯流排收容部</p>
        <p type="p">42:連接收容部</p>
        <p type="p">43:電線收容部</p>
        <p type="p">311:貫通孔</p>
        <p type="p">431:電線鎖定部</p>
        <p type="p">431A:保持片</p>
        <p type="p">X:深度方向</p>
        <p type="p">Y:寬度方向</p>
        <p type="p">Z:鉛垂方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1272" publication-number="202631984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將鐵－硫簇遞送至天然及非天然酶之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS TO DELIVER IRON-SULFUR CLUSTER TO NATIVE AND NON-NATIVE ENZYMES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">C12N1/18</main-classification>
        <further-classification edition="202601120260504B">C12N1/20</further-classification>
        <further-classification edition="200601120260504B">C12N15/52</further-classification>
        <further-classification edition="200601120260504B">C12P5/02</further-classification>
        <further-classification edition="200601120260504B">C12P7/58</further-classification>
        <further-classification edition="200601320260504B">C12R1/19</further-classification>
        <further-classification edition="200601320260504B">C12R1/865</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泉源Ｆ７公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOURCE F7 INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安杰姆　阿迪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJEM, ADIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耨　雪霏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOU, XUEFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托斯　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTH, TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供經工程改造之生物體，其可向相同生物體中表現之酶遞送鐵-硫簇。該等酶對於該生物體可為天然或非天然的。該等經工程改造之生物體包含一或多個非天然鐵-硫簇生產系統。本文亦提供可表現各種異源多肽或向該等異源多肽遞送鐵-硫簇的經工程改造之生物體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides engineered organisms that can deliver iron-sulfur clusters to enzymes expressed in the same organism. The enzymes can be native or non-native to the organism. The engineered organisms comprises one or more non-native iron-sulfur cluster producing systems. Also provided herein are engineered organisms that can express various heterologous polypeptides or deliver iron-sulfur clusters to the heterologous polypeptides.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1273" publication-number="202631958">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K13/08</main-classification>
        <further-classification edition="200601120260504B">C23F1/24</further-classification>
        <further-classification edition="202601120260504B">H10P50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原久武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, HISAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤寛司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KANJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中提供一種可抑制氧化矽(SiO&lt;sub&gt;2&lt;/sub&gt;)及多晶矽(Poly-Si)之蝕刻，且選擇性地蝕刻氮化矽(SiN)或碳氮化矽(SiCN)之蝕刻液。  本發明於一態樣中係關於如下蝕刻液，其係調配磷酸(成分A)、二氧化矽(成分B)、下述式(I)所表示之矽烷化合物(成分C)、氟化合物(成分D)及水(成分E)而成，且成分C相對於成分B之質量比C/B為300以下。  &lt;img align="absmiddle" height="123px" width="276px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1274" publication-number="202632180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於監視槽之一致性的方法</chinese-title>
        <english-title>METHOD FOR MONITORING THE CONFORMITY OF A TANK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">F17C13/02</main-classification>
        <further-classification edition="200601120260422B">G01M3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商蓋茲運輸科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAZTRANSPORT ET TECHNIGAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯塞爾　提歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUSSEL, TEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯傑裡　弗朗柯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUGGIERI, FRANCOIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史畢堤爾　勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPITTAEL, LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫莫　史帝芬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMMER, STEPHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種監視一槽之方法，該槽(1)包含位於一初級密封膜與一次級密封膜之間的一初級空間(8)以及位於該次級密封膜與一內部殼體之間的一次級空間(6)，當該槽至少部分地填充有一液化氣體(30)時，執行該方法，該方法包含以下步驟：  &lt;br/&gt;將該次級空間置於低於一臨限壓力P1之一壓力下，該臨限壓力P1低於該初級空間中之壓力，  &lt;br/&gt;藉助於一壓力感測器來量測在一時間週期期間該次級空間中之一壓力上升速率(步驟101)，以便獲得該壓力上升速率之一量測值M1，依據該量測值M1來判定該次級空間之一致性狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns a method of monitoring a tank, the tank (1) including a primary space (8) between a primary sealing membrane and a secondary sealing membrane and a secondary space (6) between the secondary sealing membrane and an internal shell, the method being carried out when the tank is at least partly filled with a liquefied gas (30), the method including the following steps: &lt;br/&gt;placing the secondary space at a pressure lower than a threshold pressure P1, the threshold pressure P1 being lower than the pressure in the primary space, &lt;br/&gt;measuring a rate of rise of pressure in the secondary space during a time period (101) by means of a pressure sensor in order to obtain a measurement M1 of the rate of rise of pressure determining a state of conformity of the secondary space as a function of the measurement M1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:槽</p>
        <p type="p">2:內部殼體</p>
        <p type="p">3:外部殼體</p>
        <p type="p">4:侷限空間</p>
        <p type="p">6:次級空間/空間</p>
        <p type="p">7:次級密封膜</p>
        <p type="p">8:初級空間/空間</p>
        <p type="p">9:初級密封膜/初級隔熱膜</p>
        <p type="p">30:液化氣體</p>
        <p type="p">31:前支撐壁及後支撐壁/後支撐壁/前壁及後壁</p>
        <p type="p">32:上部支撐壁</p>
        <p type="p">33:下部支撐壁</p>
        <p type="p">34:橫向支撐壁</p>
        <p type="p">35:橫向支撐壁</p>
        <p type="p">36:橫向支撐壁</p>
        <p type="p">37:橫向支撐壁</p>
        <p type="p">38:橫向支撐壁</p>
        <p type="p">39:橫向支撐壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1275" publication-number="202631184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基於載體的療法之方案</chinese-title>
        <english-title>REGIMEN FOR VECTOR-BASED THERAPIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/48</main-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
        <further-classification edition="200601120260504B">A61P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商漢莎生物製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSA BIOPHARMA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾曼　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KJELLMAN, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫斯泰特　莉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINSTEDT, LENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅努姆　索菲亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JARNUM, SOFIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博克曼　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOCKERMANN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舍霍爾姆　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SJOHOLM, KRISTOFFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含向個體投予IgG半胱胺酸蛋白酶以增加後續基於載體的療法之益處的方法或方案，其中該基於載體的療法治療該個體中之疾病或病狀。因此，本發明亦關於使用基於載體的療法治療疾病或病狀。該方法包含向個體投予至少二劑IgG半胱胺酸蛋白酶，且接著投予該基於載體的療法。本發明之方法尤其適用於具有已存在的針對該基於載體的療法之免疫性或已存在的針對該基於載體的療法之中和抗體的個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method or regimen comprising the administration of IgG cysteine protease to a subject in order to improve the benefit of a subsequent vector-based therapy, where the vector-based therapy treats a disease or condition in said subject. Accordingly, the invention also relates to the treatment of diseases or conditions with a vector-based therapy. The method comprises administering to the subject at least two doses of an IgG cysteine protease; and subsequently administering said vector-based therapy. Methods of the invention are particularly useful for subjects who have pre-existing immunity or pre-existing neutralizing antibodies against the vector-based therapy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1276" publication-number="202631710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物、硬化膜及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F220/40</further-classification>
        <further-classification edition="200601120260504B">C08F222/10</further-classification>
        <further-classification edition="200601120260504B">C08F222/20</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">C08K3/30</further-classification>
        <further-classification edition="200601120260504B">C08K3/32</further-classification>
        <further-classification edition="200601120260504B">C08L35/02</further-classification>
        <further-classification edition="200601120260504B">C08L71/02</further-classification>
        <further-classification edition="200601120260504B">C09K11/02</further-classification>
        <further-classification edition="200601120260504B">C09K11/08</further-classification>
        <further-classification edition="200601120260504B">C09K11/70</further-classification>
        <further-classification edition="200601120260504B">C09K11/88</further-classification>
        <further-classification edition="201401120260504B">C09D11/037</further-classification>
        <further-classification edition="201401120260504B">C09D11/101</further-classification>
        <further-classification edition="201401120260504B">C09D11/30</further-classification>
        <further-classification edition="201401120260504B">C09D11/322</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
        <further-classification edition="200601120260504B">G09F9/00</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川直優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, NAOMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩脇寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAWAKI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種成膜性得到提高的硬化性組成物、由該硬化性組成物形成的硬化膜及包括該硬化膜的顯示裝置。一種硬化性組成物，包含半導體粒子（A）及聚合性化合物（B），且所述硬化性組成物中，所述聚合性化合物（B）包含拓撲極性表面積為55 Å&lt;sup&gt;2&lt;/sup&gt;以上的二官能丙烯酸酯化合物（B-2A）及拓撲極性表面積小於55 Å&lt;sup&gt;2&lt;/sup&gt;的二官能丙烯酸酯化合物（B-2B），於二官能丙烯酸酯化合物（B-2A）與二官能丙烯酸酯化合物（B-2B）的合計100質量%中，所述二官能丙烯酸酯化合物（B-2A）的含有率為30質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1277" publication-number="202631622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＲＥＭ２　促效劑</chinese-title>
        <english-title>TREM2 AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/04</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61P25/16</further-classification>
        <further-classification edition="200601120260504B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞格傑尼　芙蘿爾　瑪麗　奧德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGGIANI, FLORE MARIE AUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉姆　薇吉妮　沙查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROM, VIRGINIE SACHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏彭蒂耶　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARPENTIER, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　弗朗切斯科　瑪麗亞　艾蜜莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DI FRANCESCO, MARIA EMILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞登　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEIDAN, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依姆赫夫　瑪麗　波爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMHOFF, MARIE-PAULE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐哈拉　費歐恩　蘇姍娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'HARA, FIONN SUSANNAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波屈透得　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERCHTOLD, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加利　圭多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLEY, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧比　路卡　克勞迪歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOBBI, LUCA CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古巴　沃爾夫崗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUBA, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆　樂藍　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMM, ROLAND JOHANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩特尼　亞當　安吉利奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATINY-ADAM, ANGELIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供：具有通式 (I) 的化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="167px" width="256px" file="ed10590.JPG" alt="ed10590.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 A&lt;sup&gt;1&lt;/sup&gt;、A&lt;sup&gt;2&lt;/sup&gt;、X&lt;sup&gt;1&lt;/sup&gt;、X&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;3'&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;4'&lt;/sup&gt; 及 R&lt;sup&gt;7&lt;/sup&gt; 係如本文所述；包括該等化合物的組成物；製造該等化合物之方法；及在與 TREM2 相關聯之疾病的治療或預防中使用該等化合物之方法。  &lt;br/&gt;***</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides compounds having the general formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="253px" file="ed10591.JPG" alt="ed10591.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein A&lt;sup&gt;1&lt;/sup&gt;, A&lt;sup&gt;2&lt;/sup&gt;, X&lt;sup&gt;1&lt;/sup&gt;, X&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;3’&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;4’&lt;/sup&gt;, and R&lt;sup&gt;7&lt;/sup&gt; are as described herein, compositions including the compounds, processes of manufacturing the compounds and methods of using the compounds in the treatment or prevention of diseases that are associated with TREM2. &lt;br/&gt;***</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1278" publication-number="202632169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉接頭及接頭系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F16L27/08</main-classification>
        <further-classification edition="200601120260421B">F16L39/06</further-classification>
        <further-classification edition="200601120260421B">F16L23/02</further-classification>
        <further-classification edition="200601120260421B">F16L17/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹿野峻弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神田宗一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANDA, SOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原佑季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMBARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合務</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川広志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原由真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立作明拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATESAKU, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朽木憲一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUCHIKI, NORIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施形態之旋轉接頭（1）包含第1半管（2）及第2半管（3）。第1半管（2）包含第1內管（21）、第1外管（22）、第1閉塞體（24）及保持具（25），第2半管（3）包含第2內管（31）、第2外管（32）及第2閉塞體（34）。設於第2外管（32）之外側凸緣（35）固接於保持具（25）。於第1內側凸緣（23）與第2內側凸緣（33）之間配置有第1密封構件（71）及第2密封構件（72），以介於從保壓室（4B）至外側密封構件（74）之路徑上之方式配置有沿徑向朝內開口之剖面為U字狀之第3密封構件（73），該保壓室（4B）形成於第1內側凸緣（23）及第2內側凸緣（33）之周圍且第1閉塞體（24）與第2閉塞體（34）之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉接頭</p>
        <p type="p">10:接頭系統</p>
        <p type="p">11:環</p>
        <p type="p">12:螺栓</p>
        <p type="p">2:第一半管</p>
        <p type="p">21:第一內管</p>
        <p type="p">22:第一外管</p>
        <p type="p">23:第一內側凸緣</p>
        <p type="p">24:第一閉塞體</p>
        <p type="p">25:保持具</p>
        <p type="p">26:第二氣體供給路</p>
        <p type="p">27:排出路</p>
        <p type="p">3:第二半管</p>
        <p type="p">31:第二內管</p>
        <p type="p">32:第二外管</p>
        <p type="p">33:第二內側凸緣</p>
        <p type="p">34:第二閉塞體</p>
        <p type="p">35:外側凸緣</p>
        <p type="p">4B:保壓室</p>
        <p type="p">51:回收路</p>
        <p type="p">52:回收管</p>
        <p type="p">54:第一氣體供給路</p>
        <p type="p">61、62:軸承</p>
        <p type="p">63、65:滾珠插入孔</p>
        <p type="p">64、66:栓塞</p>
        <p type="p">82:第一氣體供給管</p>
        <p type="p">83:第一壓力調整閥</p>
        <p type="p">84:第二氣體供給管</p>
        <p type="p">85:第二壓力調整閥</p>
        <p type="p">86:排出管</p>
        <p type="p">91、92:壓力計</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1279" publication-number="202631143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>糖尿病性眼病之治療</chinese-title>
        <english-title>TREATMENT OF DIABETIC EYE DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/506</main-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商明塞特製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINGSIGHT PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈斯曼　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIESMAN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於治療糖尿病性眼病之組合物及方法。該組合物包含同功型選擇性的吡咯并吡唑PKC抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compositions and methods for the treatment of diabetic eye disease. The compositions comprise isoform selective pyrrolo-pyrazole PKC inhibitors.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1280" publication-number="202632204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有微通道的散熱器胞元</chinese-title>
        <english-title>HEATSINK CELL WITH MICROCHANNELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F28F3/12</main-classification>
        <further-classification edition="202601120260421B">H10W40/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商惠普發展公司有限責任合夥企業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道威爾　丹尼爾　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWELL, DANIEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫維　理查　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAVER, RICHARD W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫米比　麥可　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUMBIE, MICHAEL W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥那雷斯　克特　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALES, CURT GENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱器系統包括一入口、一出口及散熱器胞元。該等散熱器胞元中之各者包括微通道、一入口槽及一出口槽。該入口槽包括：一第一流體通道，其沿著該等微通道之一第一集合的一第一外側延伸；一第二流體通道，其沿著該等微通道之一第二集合的一第二外側延伸；以及一入口部分，其用以接收來自該入口之流體且引導至該第一流體通道及該第二流體通道中。沿著該等微通道之一第一內側及該等微通道之一第二內側延伸的該出口槽接收流過該等微通道之該第一集合及該等微通道之該第二集合之該流體，且引導至該出口中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heatsink system includes an inlet, an outlet, and heatsink cells. Each of the heatsink cells includes microchannels, an inlet slot, and an outlet slot. The inlet slot includes a first fluidic channel extending along a first outer side of a first set of the microchannels, a second fluidic channel extending along a second outer side of a second set of the microchannels, and an inlet portion to receive fluid from the inlet and direct into the first fluidic channel and the second fluidic channel. The outlet slot, extending along a first inner side of the microchannels and a second inner side of the microchannels, receives the fluid flowing through the first set of the microchannels and the second set of the microchannels, and directs into the outlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱器系統</p>
        <p type="p">105:入口</p>
        <p type="p">110:出口</p>
        <p type="p">130:散熱器胞元</p>
        <p type="p">135:微通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1281" publication-number="202632701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138390</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤及操作裝置</chinese-title>
        <english-title>KEYBOARD AND CONSOLE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01H13/14</main-classification>
        <further-classification edition="200601120260422B">H01H13/702</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富常隆電子零件有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FCL COMPONENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蟻川晃彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIKAWA, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西野武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種可向使用者提供良好之觸感且可準確地檢測複數個按鍵同時按壓之鍵盤及操作裝置。  &lt;br/&gt;本發明之鍵盤200與一般之薄膜開關不同，由具有二極體85之印刷基板8構成薄膜開關之下部膜，因此可避免由複數個按鍵同時按壓引起之電流潛行，可準確地檢測複數個按鍵之同時按壓。再者，由於在圓頂橡膠3挫曲變形時產生之操作力F減少之期間由彈簧4將電性接點71(導電構件74、第1接點83及第2接點84)開閉，故於操作感與接點接通動作之間不會產生差距，可向使用者提供良好之觸感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyboard includes a sliding member, a first elastic member that elastically buckles and deforms, a second elastic member that opens and closes an electrical contact, a support member that guides the sliding member, a membrane sheet having a first surface pressed by the second elastic member and a second surface including a conductive member, a printed circuit board that faces the second surface, and includes a controller having an output port and a reception port, a first contact connected to the output port, a second contact connected to the reception port, and a diode connected between the reception port and the second contact, and a spacer that forms a space between the membrane sheet and the printed circuit board, wherein the conductive member is in contact with the first contact and the second contact in accordance with sliding of the sliding member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鍵頂</p>
        <p type="p">2:滑動器</p>
        <p type="p">3:圓頂橡膠</p>
        <p type="p">4:彈簧</p>
        <p type="p">5:殼體</p>
        <p type="p">6:開關面板</p>
        <p type="p">7:膜片</p>
        <p type="p">8:印刷基板</p>
        <p type="p">11:凹穴</p>
        <p type="p">24:突起</p>
        <p type="p">25:扣止爪</p>
        <p type="p">26:突起</p>
        <p type="p">51:板部</p>
        <p type="p">52:引導件</p>
        <p type="p">57:爪部</p>
        <p type="p">61:開口</p>
        <p type="p">62:間隔件</p>
        <p type="p">71:電性接點</p>
        <p type="p">85:二極體</p>
        <p type="p">90:空間</p>
        <p type="p">100:按鍵開關裝置</p>
        <p type="p">101:開關單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1282" publication-number="202631631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138418</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為ＴＹＫ２及／或ＪＡＫ１之抑制劑之三環雜芳基化合物</chinese-title>
        <english-title>TRICYCLIC HETEROARYL COMPOUNDS AS INHIBITORS OF TYK2 AND/OR JAK1</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D495/14</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/437</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/497</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英塞特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INCYTE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪柏德　史黛西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPARD, STACEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿塔索魯　歐諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATASOYLU, ONUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅　松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供調節JAK1及/或TYK2之活性的三環雜芳基化合物，該等化合物可用於治療各種病症及疾病，包括皮膚、呼吸道、眼科及直腸疾病及病症、癌症以及神經發炎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides tricyclic heteroaryl compounds that modulate the activity of the JAK1 and/or TYK2, which are useful in the treatment of various disorders and diseases, including skin, respiratory, ophthalmic, and rectal diseases and disorders, cancer, and neuroinflammation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1283" publication-number="202631266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電—流體動力空氣推進器裝置之電極清潔設備</chinese-title>
        <english-title>ELECTRODE CLEANING APPARATUS FOR ELECTRO-HYDRODYNAMIC AIR MOVER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260504B">B08B1/30</main-classification>
        <further-classification edition="200601120260504B">F03H1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商風帝瓦公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTIVA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈斯普　傑佛瑞　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NESPOR, JEFFREY S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒特　羅伯特　哈登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRETT, ROBERT HADEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧利佛瑞歐　蓋瑞　亞弗列德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLIVERIO, GARY ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博哈納　希曼蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POKHARNA, HIMANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐康尼爾　丹尼斯　芬巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'CONNELL,DENIS FINBARR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海澤爾　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIZER, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘尼桑　斯里坎斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANESAN, SRIKANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康納斯　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONNORS, COLLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川恩　達里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUONG, DARRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於電-流體動力(EHD)空氣推進器裝置之電極清潔設備，其包含由一或多種非導電材料形成之清潔刮板。該清潔刮板定位於細長發射極上且具有經設定大小及塑形以接收該發射極之開口，使得該清潔刮板可沿該電極縱向滑動。在一個實施例中，該細長發射極實施為安裝隔離器上之導電邊緣，且該清潔刮板經組態以在操作期間接合該導電邊緣且移除累積在其上之沉積物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode cleaning apparatus for an electro‑hydrodynamic (EHD) air mover device includes a cleaning scraper formed of one or more non‑conductive materials. The cleaning scraper is positioned on an elongate emitter electrode and has an opening sized and shaped to receive the emitter electrode such that the cleaning scraper is slidable longitudinally along the electrode. In one embodiment, the elongate emitter electrode is implemented as a conductive edge on a mounting isolator, and the cleaning scraper is configured to engage the conductive edge and remove deposits accumulated thereon during operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電-流體動力(EHD)空氣推進器裝置</p>
        <p type="p">205a:板</p>
        <p type="p">205b:板</p>
        <p type="p">210:發射極</p>
        <p type="p">215a:隔離器</p>
        <p type="p">215b:隔離器</p>
        <p type="p">305:發射極導線清潔器</p>
        <p type="p">310:孔</p>
        <p type="p">315:污垢碎屑</p>
        <p type="p">320a:空腔</p>
        <p type="p">320b:空腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1284" publication-number="202631376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、使用有積層體之器件、以及積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260422B">B32B7/022</main-classification>
        <further-classification edition="200601120260422B">B32B3/14</further-classification>
        <further-classification edition="200601120260422B">B32B25/08</further-classification>
        <further-classification edition="200601120260422B">B32B27/06</further-classification>
        <further-classification edition="200601120260422B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥山哲雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUYAMA, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徳田桂也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUDA, KAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森尾恵梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIO, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種容易沿三維曲面無皺褶地配置的積層體。此發明之一態樣的積層體係包含：由包含熱塑性彈性體之材料所構成的基材層；以及離散地設置於前述基材層的樹脂層；前述樹脂層之彈性模數為前述基材層之彈性模數的50倍以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1285" publication-number="202633303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工方法、半導體元件的製造方法、及雷射加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260318B">H10P54/20</main-classification>
        <further-classification edition="202601120260318B">H10P54/30</further-classification>
        <further-classification edition="202601120260318B">H10P58/00</further-classification>
        <further-classification edition="201401120260318B">B23K26/08</further-classification>
        <further-classification edition="201401120260318B">B23K26/062</further-classification>
        <further-classification edition="201401120260318B">B23K26/351</further-classification>
        <further-classification edition="201401120260318B">B23K26/064</further-classification>
        <further-classification edition="200601120260318B">B23K26/067</further-classification>
        <further-classification edition="200601120260318B">B23K26/073</further-classification>
        <further-classification edition="201401120260318B">B23K26/0622</further-classification>
        <further-classification edition="201401120260318B">B23K26/50</further-classification>
        <further-classification edition="201401120260318B">B23K26/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>是松克洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREMATSU, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三山恭弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUYAMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">雷射加工方法，具備有：沿著第1形成預定面進行雷射加工的第1加工工程、及沿著第2形成預定面進行雷射加工的第2加工工程。在第1及第2加工工程，以從Z方向來看，雷射光的聚光區域具有長度方向，並且，該長度方向與加工行進方向交叉的方式成形雷射光。在第1加工工程，以用於使龜裂從改質區域沿著第1形成預定面伸展的第1加工條件來進行雷射加工，在第2加工工程，以用於使龜裂從改質區域沿著第2形成預定面伸展的第2加工條件來進行雷射加工。第2形成預定面的傾斜角度比第1形成預定面的傾斜角度大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:對象物</p>
        <p type="p">11a:第1面(雷射光射入面)</p>
        <p type="p">11b:第2面(相反面)</p>
        <p type="p">12,12A,12B,12C:改質區域</p>
        <p type="p">13:龜裂</p>
        <p type="p">13A:斜向龜裂(龜裂)</p>
        <p type="p">13B:斜向龜裂(龜裂)</p>
        <p type="p">13C:龜裂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1286" publication-number="202632985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>報告具有SDT組態之使用者設備</chinese-title>
        <english-title>REPORTING USER EQUIPMENTS WITH SDT CONFIGURATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W24/08</main-classification>
        <further-classification edition="202301120260504B">H04W72/231</further-classification>
        <further-classification edition="200901120260504B">H04W88/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商ＬＭ艾瑞克生(ＰＵＢＬ)電話公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥伯　奧斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYRBERG, OSKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏格斯琮　馬堤亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGSTROM, MATTIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　朱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIANG, ZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實例中，提供一種由一第一網路節點執行之用於將資訊發送至一第二網路節點之方法。該方法包括將第一資訊發送至該第二網路節點，該第一資訊識別以下之一或多者：該第一網路節點引導至一無線電資源控制RRC非作用狀態之經組態有小型資料傳輸SDT之第一使用者設備UE之一第一數目；及/或該第一網路節點針對其儲存一UE上下文之經組態有SDT之第二UE之一第二數目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an example, a method performed by a first network node for sending information to a second network node is provided. The method comprises sending, to the second network node, first information identifying one or more of: a first number of first User Equipments, UEs, configured with Small Data Transmission, SDT, that the first network node directed to a Radio Resource Control, RRC, inactive state; and/or a second number of second UEs configured with SDT for which the first network node is storing a UE context.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1287" publication-number="202632415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型空白光罩及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260420B">G03F1/24</main-classification>
        <further-classification edition="201201120260420B">G03F1/44</further-classification>
        <further-classification edition="201201120260420B">G03F1/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田惇弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>棟安陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUNEYASU, RIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供在基準標記中，具有可藉由單純的機構且較少的發塵風險形成的輔助標記之反射型空白光罩。  &lt;br/&gt;　　[解決手段] 一種反射型空白光罩，其至少具備：基板，設置於該基板上並反射曝光光的多層反射膜，及設置於該多層反射膜上並吸收前述曝光光的吸收體膜；具備形成於前述反射型空白光罩之與前述多層反射膜相同側的面上之基準標記；該基準標記由作為缺陷位置的基準位置的主標記，與配置於該主標記的周邊的輔助標記群構成；前述輔助標記群由複數輔助標記構成，該輔助標記以將前述主標記作為起點至少在一方向上延伸之方式相互間隔開而形成；該複數輔助標記為全部以相同形狀且相同朝向形成者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41:主標記</p>
        <p type="p">42,42a,42b,42c,42d:輔助標記群</p>
        <p type="p">43:輔助標記</p>
        <p type="p">L3:輔助標記群的大小</p>
        <p type="p">P1:相鄰的輔助標記彼此的間隔</p>
        <p type="p">P2:主標記與鄰接於主標記的輔助標記的間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1288" publication-number="202632815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260424B">H01R13/6581</main-classification>
        <further-classification edition="200601120260424B">H01R13/46</further-classification>
        <further-classification edition="200601120260424B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊藤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, TENGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁雙峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, SHUANGFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組件包括電連接器以及對接模組。電連接器包括殼體、第一導電端子以及第二導電端子。第一導電端子包括第一接觸部。第二導電端子包括第二接觸部。對接模組設有舌板，舌板設有基部、過渡部以及收縮部。收縮部配置為插入在第一接觸部和第二接觸部之間；第一接觸部和第二接觸部配置為分別沿著過渡部被對接模組擠壓而向外側發生彈性變形；第一接觸部和第二接觸部配置為分別越過過渡部以與對接模組相接觸且實現電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly includes an electrical connector and a mating module. The electrical connector includes a housing, a first conductive terminal and second a conductive terminal. The first conductive terminal includes a first contact portion. The second conductive terminal includes a second contact portion. The mating module is provided with a tongue plate. The tongue plate includes a base portion, a transition portion and a constriction portion. The constriction portion is configured to be inserted between the first contact portion and the second contact portion. The first contact portion and the second contact portion are configured to be extruded by the mating module along the transition portion to elastically deform outward. The first contact portion and the second contact portion are configured to cross the transition portion to be in contact with the mating module for achieving electrical connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:第一絕緣塊</p>
        <p type="p">22:第二絕緣塊</p>
        <p type="p">3011a:第三平坦面</p>
        <p type="p">3011b:第四平坦面</p>
        <p type="p">3012:過渡部</p>
        <p type="p">3012a:第一導引面</p>
        <p type="p">3012b:第二導引面</p>
        <p type="p">3013:收縮部</p>
        <p type="p">3013a:第一平坦面</p>
        <p type="p">3013b:第二平坦面</p>
        <p type="p">3013c:第一導引斜面</p>
        <p type="p">3013d:第二導引斜面</p>
        <p type="p">304:第一接觸片</p>
        <p type="p">305:第二接觸片</p>
        <p type="p">310:第一彈性接觸臂</p>
        <p type="p">3101:第一接觸部</p>
        <p type="p">3102:第一末端部</p>
        <p type="p">320:第二彈性接觸臂</p>
        <p type="p">3201:第二接觸部</p>
        <p type="p">3202:第二末端部</p>
        <p type="p">41:第一接地片</p>
        <p type="p">42:第二接地片</p>
        <p type="p">A1-A1:第一方向</p>
        <p type="p">A2-A2:第二方向</p>
        <p type="p">B:圖12中畫框部分</p>
        <p type="p">T1,T3:厚度</p>
        <p type="p">T2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1289" publication-number="202633278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基板中進行應力管理的方法</chinese-title>
        <english-title>METHODS FOR STRESS MANAGEMENT IN A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P30/20</main-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫徹　奧爾加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUCHER, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧森基　阿達澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSONKIE, ADAEZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　元宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WONJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托多羅夫　斯坦尼斯拉夫Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODOROV, STANISLAV S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾文　斯摩根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, MORGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡魯尚穆甘　拉姆庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARURSHANMUGAM, RAMKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇布拉馬尼揚　普拉迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAHMANYAN, PRADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在基板中進行應力管理的方法。所述方法可包括：在基板的主表面上提供應力補償層；以及在離子植入機中實行高溫植入程序，以將一劑量的離子植入至應力補償層中。高溫植入程序可包括：將基板加熱至植入溫度，植入溫度處於300℃與750℃之間；以及在使基板保持處於植入溫度的同時將基板暴露於離子束，其中高溫植入程序更改基板的面外畸變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for stress management in a substrate. The method may include providing a stress compensation layer on a main surface of the substrate, and performing a high-temperature implant procedure in an ion implanter to implant a dose of ions into the stress compensation layer. The high temperature implant procedure may include heating the substrate to an implant temperature, the implant temperature being between 300 ºC and 750 ºC, and exposing the substrate to an ion beam while the substrate is held at the implant temperature, wherein the implant procedure alters an out-of-plane distortion of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">150:處理系統</p>
        <p type="p">152:離子源</p>
        <p type="p">154:離子束</p>
        <p type="p">156:處理腔室</p>
        <p type="p">158:基板台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1290" publication-number="202631607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＵＬＫ抑制劑之固態形式</chinese-title>
        <english-title>SOLID STATE FORMS OF ULK INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D413/14</main-classification>
        <further-classification edition="200601120260504B">A61K31/553</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商迪賽孚爾製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECIPHERA PHARMACEUTICALS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考夫曼　麥克　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUFMAN, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯奇　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROESCH, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文部分地提供由式(I)表示之化合物之固態形式：  &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="267px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;或其溶劑合物、包含該等固態形式之醫藥組合物、製造該等固態形式之方法及使用該等固態形式之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein, in part, are solid-state forms of the compound represented by Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="198px" width="263px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a solvate thereof, pharmaceutical compositions comprising the solid-state forms, processes of making the solid-state forms, and methods of using the solid-state forms.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1291" publication-number="202632714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理系統及操作其的方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING SYSTEM AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01J37/063</main-classification>
        <further-classification edition="200601120260504B">H01J37/147</further-classification>
        <further-classification edition="202601120260504B">H10P34/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>培爾　艾力克斯恩德　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREL, ALEXANDER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利坎斯奇　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIKHANSKII, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種用於改善離子源的操作範圍以提取具有高傾斜角度離子束的系統和方法。所述系統包括半導體處理系統，半導體處理系統包括具有提取孔的提取板，提取孔不平行於工件表面。提取電極設置於離子源外部靠近提取孔處，以吸引離子朝向工件。施加到該提取電極的電壓可以改變，以影響提取的離子束。提取孔可包括細長狹縫，且提取電極可以分離成兩片段，細長狹縫的各側有一個片段。如此一來，提取電極的兩片段可獨立地被偏置。該特徵也可以允許傾斜角度的變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for improving the operating range of an ion source for the extraction of an ion beam with a high tilt angle are disclosed. The system includes a semiconductor processing system that includes an extraction plate having an extraction aperture that is not parallel to the surface of the workpiece. An extraction electrode is disposed outside the ion source near the extraction aperture to attract ions toward the workpiece. The voltage applied to this extraction electrode may be varied to affect the extracted ion beam. The extraction aperture may comprise an elongated slot and the extraction electrode may be separated into two pieces, one on each side of the elongated slot. In this way, the two pieces of the extraction electrode may be independently biased. This feature may also allow variation of the tilt angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工件</p>
        <p type="p">100:離子源腔室</p>
        <p type="p">101:腔室壁</p>
        <p type="p">105:提取電壓電源</p>
        <p type="p">106:離子束</p>
        <p type="p">110:射頻天線</p>
        <p type="p">115:射頻電源</p>
        <p type="p">120:提取板</p>
        <p type="p">125:傾斜部</p>
        <p type="p">127:提取孔</p>
        <p type="p">130:提取電極</p>
        <p type="p">131:第一提取電極部</p>
        <p type="p">135:第一電極電源</p>
        <p type="p">141:第二提取電極部</p>
        <p type="p">145:第二電極電源</p>
        <p type="p">150:工件保持器</p>
        <p type="p">155:工件偏壓電源</p>
        <p type="p">157:掃描方向</p>
        <p type="p">160:掃描馬達</p>
        <p type="p">θ:高傾斜角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1292" publication-number="202631162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療用組成物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260504B">A61K35/28</main-classification>
        <further-classification edition="201501120260504B">A61K35/76</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="201001120260504B">C12N5/0775</further-classification>
        <further-classification edition="200601120260504B">C12N15/864</further-classification>
        <further-classification edition="200601120260504B">C12N15/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂敦製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中孝一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中秀紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀內陽子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須田一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDA, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田尚巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松坂恭成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAKA, YASUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅生健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGO, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒川雄二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNEKAWA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河岡義裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAOKA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山吉誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAYOSHI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小檜山康司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBIYAMA, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種治療用組成物，其包含（A）含有編碼目標蛋白質之導入基因之病毒載體、及（B）來自間葉系幹細胞之細胞外囊泡（extracellular vesicle）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1293" publication-number="202633029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合式電路板</chinese-title>
        <english-title>HYBRID CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H05K1/05</main-classification>
        <further-classification edition="200601120251103B">H05K1/11</further-classification>
        <further-classification edition="200601120251103B">H01B3/02</further-classification>
        <further-classification edition="200601120251103B">H01B3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉得丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳思翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, JIAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種複合式電路板，包含一陶瓷核心層、及分別形成於所述陶瓷核心層相反兩側的兩個疊構層。所述陶瓷核心層包含一陶瓷基板及形成於所述陶瓷基板的一串接線路。所述陶瓷基板形成有一貫穿孔，所述串接線路具有填滿所述貫穿孔的一埋置段、及分別相連於所述埋置段兩端的兩個連接段。每個所述疊構層包含形成於所述陶瓷基板的一介電層及埋置於所述介電層一線路，並且每個所述疊構層的所述線路的一端連接於所述串接線路的一個所述連接段、另一端裸露於所述介電層之外。兩個所述疊構層的所述線路通過所述串接線路而彼此電性耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a hybrid circuit board, which includes a ceramic core layer and two stacked layers that are respectively formed on two opposite sides of the ceramic core layer. The ceramic core layer includes a ceramic substrate and a connection circuit formed on the ceramic substrate. The ceramic substrate has a thru-hole, and the connection circuit has an embedded segment fully embedded in the thru-hole and two connection segments that are respectively connected to two opposite ends of the embedded segment. Each of the stacked layers includes a dielectric layer formed on the ceramic substrate and a circuit that is embedded in the dielectric layer. In each of the two stacked layers, one end of the circuit is connected to one of the two connection segments of the connection circuit, and another end of the circuit is exposed from the dielectric layer. The circuits of the two stacked layers are electrically coupled to each other through the connection circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:複合式電路板</p>
        <p type="p">1:第一疊構層</p>
        <p type="p">11:第一介電層</p>
        <p type="p">12:第一線路</p>
        <p type="p">2:第二疊構層</p>
        <p type="p">21:第二介電層</p>
        <p type="p">22:第二線路</p>
        <p type="p">3:陶瓷核心層</p>
        <p type="p">31:陶瓷基板</p>
        <p type="p">311:第一板面</p>
        <p type="p">3111:第一改質區域</p>
        <p type="p">312:第二板面</p>
        <p type="p">3121:第二改質區域</p>
        <p type="p">313:貫穿孔</p>
        <p type="p">32:串接線路</p>
        <p type="p">32a:種子層</p>
        <p type="p">32a1:銅合金層</p>
        <p type="p">32a2:銅層</p>
        <p type="p">32b:線路層</p>
        <p type="p">321:第一連接段</p>
        <p type="p">322:第二連接段</p>
        <p type="p">323:埋置段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1294" publication-number="202632249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於判定隔膜之折射率之方法</chinese-title>
        <english-title>METHOD FOR DETERMINING A REFRACTIVE INDEX OF A MEMBRANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N21/41</main-classification>
        <further-classification edition="200601120260504B">G01N21/84</further-classification>
        <further-classification edition="200601120260504B">G03F7/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="202601120260504B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆罕默德　馬希爾　阿西夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHAMMED, MAHIR ASIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史古登　伯特　德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOLTEN, BERT DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種判定與一影像感測器相關聯的一隔膜之一折射率的方法，該方法包含以下步驟：獲得一第一經圖案化隔膜區段之一第一繞射圖案，該第一經圖案化隔膜區段具有一第一隔膜-開口比率，且獲得一第二經圖案化隔膜區段之一第二繞射圖案，該第二經圖案化隔膜區段具有一第二隔膜-開口比率，該第二隔膜-開口比率不同於該第一隔膜-開口比率；以及基於該第一繞射圖案及該第二繞射圖案判定該隔膜之一折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method of determining a refractive index of a membrane associated with an image sensor, the method comprising the steps of obtaining a first diffraction pattern of a first patterned membrane section, the first patterned membrane section having a first membrane-to-open ratio, and obtaining a second diffraction pattern of a second patterned membrane section, the second patterned membrane section having a second membrane-to-open ratio, the second membrane-to-open ratio being different from the first membrane-to-open ratio, and determining a refractive index of the membrane based on the first diffraction pattern and the second diffraction pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:隔膜/薄膜隔膜</p>
        <p type="p">23:第一經圖案化隔膜區段</p>
        <p type="p">26:第二經圖案化隔膜區段</p>
        <p type="p">29A:第一輻射光束</p>
        <p type="p">29B:第二輻射光束</p>
        <p type="p">40:隔膜開口</p>
        <p type="p">41:第一膜表面區域/經曝光第一膜表面區域</p>
        <p type="p">42:第一隔膜開口區域</p>
        <p type="p">43:第二膜表面區域</p>
        <p type="p">44:第二隔膜開口區域</p>
        <p type="p">46:隔離層</p>
        <p type="p">48:第一隔離開口</p>
        <p type="p">49:第一鄰近隔離開口</p>
        <p type="p">52:鄰近第二隔離開口</p>
        <p type="p">54:第一線</p>
        <p type="p">55:第二線</p>
        <p type="p">57:矩形柵格</p>
        <p type="p">65:方向/箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1295" publication-number="202632807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>引導件、板卡組件和連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01R13/629</main-classification>
        <further-classification edition="201101120260422B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商泰科電子(上海)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶宗杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, ZONGJIE (JASON)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱敬濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JINGTAO (MURPHY)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張新杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XINJIE (DAVID)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, XIN (SUNNY)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開引導件、板卡組件和連接器組件。所述引導件用於引導板卡插入連接器中。所述引導件適於套裝到所述板卡上且所述引導件的前側部的橫截面呈前窄後寬的三角形或梯形，以引導所述板卡的前側部插入所述連接器的兩排端子的彈性接觸部之間。在本發明中，套裝在板卡上的引導件能夠保證板卡順利地插入連接器的兩排端子的彈性接觸部之間，能夠有效地避免端子被插入的板卡頂壞的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:板卡</p>
        <p type="p">11:引導肋</p>
        <p type="p">12:引導條</p>
        <p type="p">13:外套體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1296" publication-number="202633100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維雙極型電晶體</chinese-title>
        <english-title>THREE DIMENSIONAL BIPOLAR TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10D10/00</main-classification>
        <further-classification edition="202501120260428B">H10D10/01</further-classification>
        <further-classification edition="202501120260428B">H10D62/13</further-classification>
        <further-classification edition="202501120260428B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商德州儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭恩　喬許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANE, JOSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔布菲爾德　陶德　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUBBLEFIELD, TODD D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種半導體裝置，其包括：一基極區，其具有一第一導電型，該基極區延伸至一半導體層之一頂部表面中；一集極區，其具有一相反的第二導電型，該集極區自該頂部表面延伸至該半導體層中且與該基極區間隔開；及一射極區，其具有該第二導電型，該射極區自該頂部表面延伸至該基極區中，且具有沿著該射極區與該基極區之間的一接面的第一面及第二面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a base region having a first conductivity type, the base region extending into a top surface of a semiconductor layer, a collector region having an opposite second conductivity type, the collector region extending from the top surface into the semiconductor layer and spaced apart from the base region, and an emitter region having the second conductivity type, the emitter region extending from the top surface into the base region and having first and second faces along a junction between the emitter region and the base region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A-1A:線</p>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:半導體晶粒</p>
        <p type="p">102:半導體基板/基板</p>
        <p type="p">104:半導體層/第二半導體層/磊晶層/磊晶半導體層/p型磊晶層/p型磊晶半導體層</p>
        <p type="p">105:埋入層/n型埋入層</p>
        <p type="p">106:半導體層/磊晶層/n型磊晶層/磊晶半導體層/n型磊晶半導體層/n型摻雜磊晶矽層/經沉積n型磊晶半導體層</p>
        <p type="p">110:n型集極區/集極區/深植入集極區</p>
        <p type="p">111:集極鰭片/預期第一及第二集極鰭片/深植入集極鰭片/經植入集極鰭片</p>
        <p type="p">116:射極區/n型射極區/大致V形射極區/經植入射極區</p>
        <p type="p">117:基極側壁保護區/p型基極側壁保護區/經植入基極側壁保護區</p>
        <p type="p">118:基極區/經植入基極區/經植入區/大致V形經植入區</p>
        <p type="p">120:溝槽/射極指形件溝槽/預期溝槽/經蝕刻溝槽/成角度溝槽結構</p>
        <p type="p">121:成角度側壁/側壁</p>
        <p type="p">122:溝槽底部/底部</p>
        <p type="p">123:成角度側壁/側壁</p>
        <p type="p">124:非零間隔距離/溝槽間隔</p>
        <p type="p">126:基極尺寸</p>
        <p type="p">130:金屬化結構/多層級金屬化結構</p>
        <p type="p">131:第一豎直金屬互連件/互連件/鎢接點</p>
        <p type="p">132:第二豎直金屬互連件/互連件/鎢接點</p>
        <p type="p">133:金屬前介電質(PMD)層</p>
        <p type="p">134:金屬跡線特徵/導電金屬特徵</p>
        <p type="p">135:第一層級間或層間介電質(ILD)層</p>
        <p type="p">136:導電金屬端子/端子</p>
        <p type="p">B:電晶體基極/經植入基極/基極</p>
        <p type="p">C:集極</p>
        <p type="p">E:射極</p>
        <p type="p">F:射極指形件/指形件</p>
        <p type="p">Q:電晶體/雙極型接面電晶體/NPN雙極型電晶體</p>
        <p type="p">S1:電流發射表面/第一電流發射表面/底側/側壁</p>
        <p type="p">S2:實質上豎直側壁/側壁</p>
        <p type="p">S3:電流發射表面/第二電流發射表面/實質上豎直側壁/側壁</p>
        <p type="p">W:寬度</p>
        <p type="p">X:第一方向</p>
        <p type="p">Z:第三方向</p>
        <p type="p">θ:非零的第一及第二角度/角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1297" publication-number="202632659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運算設備</chinese-title>
        <english-title>COMPUTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G11C11/54</main-classification>
        <further-classification edition="200601120260504B">G06N3/06</further-classification>
        <further-classification edition="200601120260504B">G06F17/16</further-classification>
        <further-classification edition="200601120260504B">G06F7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高麗大學校產學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李京鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONGSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金絃埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運算設備包括運算位元單元，以及控制運算位元單元的控制電路。運算位元單元包括儲存係數位元的記憶體單元以及第一電晶體到第三電晶體。第一電晶體連接在第一節點和接地節點之間並具有連接到第一線路的閘極，第一線路在第一方向延伸並接收基於第一輸入位元的電壓。第二電晶體連接在第二節點和在與第一方向交叉的第二方向延伸的第二線路之間，第二電晶體具有接收預充電啟用信號的閘極，第二線路接收基於第二輸入位元的電壓。第三電晶體連接在第一節點和第二節點之間並具有連接到記憶體單元的閘極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing device includes a computing bit cell, and a control circuit that controls the computing bit cell. The computing bit cell includes a memory cell that stores a coefficient bit and first to third transistors. The first transistor is connected between a first node and a ground node and has a gate that is connected to a first line which extends in a first direction and which receives a voltage based on a first input bit. The second transistor is connected between a second node and a second line that extends in a second direction that crosses the first direction, the second transistor having a gate that receives a pre-charge enable signal, the second line receiving a voltage based on a second input bit. The third transistor is connected between the first node and the second node and has a gate connected to the memory cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:運算位元單元</p>
        <p type="p">31:記憶體單元</p>
        <p type="p">CBL:運算位元線</p>
        <p type="p">CWL:運算字線</p>
        <p type="p">N1、N2、N3:節點</p>
        <p type="p">PRE:預充電啟用信號</p>
        <p type="p">T31、T32、T33:電晶體</p>
        <p type="p">VSS:負電源電壓</p>
        <p type="p">xb:反相位元</p>
        <p type="p">y:第二輸入位元</p>
        <p type="p">z:輸出位元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1298" publication-number="202632072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於氧化鉬還原的無損壞氫處理</chinese-title>
        <english-title>DAMAGE-LESS HYDROGEN TREATMENT FOR MOLYBDENUM OXIDE REDUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C28/02</main-classification>
        <further-classification edition="202601120260504B">H10P14/43</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周瑞楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, RUINAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岑嘉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEN, JIAJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　弦龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HSIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛瑪　雪恩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　安伽那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARCHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在某些實施例中，一種方法包括將半導體結構放置在處理腔室內。該半導體結構包括位於基板表面上的第一層。該半導體結構進一步包括位於第一層上的第二層。第二層具有硬遮罩層。該半導體結構進一步包括一或多個位於第二層上的第二介電層。一或多個第二介電層在第二層的一部分上形成間隙。該半導體結構進一步包括位於形成在第二層上方的間隙內的金屬材料。該金屬材料具有氧化鉬（MoO&lt;sub&gt;x&lt;/sub&gt;）層。該方法進一步包括將製程氣體流入處理腔室，並對半導體結構的一部分執行氧化還原操作以將MoO&lt;sub&gt;x&lt;/sub&gt;還原為鉬（Mo）。該氧化還原操作包括對製程氣體施加微波能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a method includes positioning a semiconductor structure within a processing chamber. The semiconductor structure includes a first layer disposed over a substrate surface. The semiconductor structure further includes a second layer disposed over the first layer. The second layer has a hardmask layer. The semiconductor structure further includes one or more second dielectric layers disposed over the second layer. The one or more second dielectric layers have a gap formed over a portion of the second layer. The semiconductor structure further includes a metal material disposed within the gap formed over the second layer. The metal material has a molybdenum oxide (MoO&lt;sub&gt;x&lt;/sub&gt;) layer. The method further includes flowing a process gas into the processing chamber, and performing a redox operation on a portion of the semiconductor structure to reduce the MoO&lt;sub&gt;x&lt;/sub&gt; to molybdenum (Mo). The redox operation includes applying a microwave energy to the process gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400b:半導體結構</p>
        <p type="p">402:基板表面</p>
        <p type="p">404:SiO&lt;sub&gt;2&lt;/sub&gt;層</p>
        <p type="p">406:硬遮罩層</p>
        <p type="p">408:層</p>
        <p type="p">409:間隙</p>
        <p type="p">409a:間隙寬度</p>
        <p type="p">409b:間隙高度</p>
        <p type="p">410:金屬材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1299" publication-number="202632715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片晶取出之精確自動化控制</chinese-title>
        <english-title>PRECISE AUTOMATED CONTROL OF LAMELLA LIFT-OUT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01J37/20</main-classification>
        <further-classification edition="200601120260427B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>什塔斯納　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STASTNA, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托拉卡　布拉尼司拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRAKA, BRANISLAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基科　艾莉絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KICO, IRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯莫爾卡　拉德克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMOLKA, RADEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製備電子顯微術成像的一樣本的方法包括在一電子顯微術系統中提供一基材，該電子顯微術系統包含用於操控該基材之一經釋放樣本的一探針；在該系統的一載物台與該探針之間施加一電流；於用該探針接觸該樣本時偵測一第一電流變化；在偵測到該第一電流變化後，用該探針從該基材提取該樣本；於從該基材提取該樣本時偵測一第二電流變化；及至少部分地基於該第二電流變化來確認已從該基材提取該樣本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of preparing a sample for electron microscopy imaging includes providing a substrate in an electron microscopy system comprising a probe for manipulating a freed sample of the substrate, applying a current flow between a stage of the system and the probe, detecting a first change in current flow in connection with contacting the sample with the probe, after detecting the first change in current flow, extracting the sample from the substrate with the probe, detecting a second change in current flow in connection with extracting the sample from the substrate, and confirming the sample is extracted from the substrate based at least in part on the second change in current flow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙束系統</p>
        <p type="p">111:FIB系統</p>
        <p type="p">112:離子柱</p>
        <p type="p">114:離子源</p>
        <p type="p">115:提取電極</p>
        <p type="p">116:聚焦柱</p>
        <p type="p">117:聚焦元件</p>
        <p type="p">118:聚焦柱</p>
        <p type="p">119:系統控制器</p>
        <p type="p">120:偏轉元件</p>
        <p type="p">121:記憶體</p>
        <p type="p">122:基材</p>
        <p type="p">123:樣本</p>
        <p type="p">124:片晶載體</p>
        <p type="p">125:載物台</p>
        <p type="p">126:下腔室</p>
        <p type="p">130:渦輪分子及機械泵送系統</p>
        <p type="p">132:真空控制器</p>
        <p type="p">134:高壓電力供應器</p>
        <p type="p">136:偏轉控制器及放大器</p>
        <p type="p">138:圖案產生器</p>
        <p type="p">140:二次電子偵測器/帶電粒子偵測器</p>
        <p type="p">141:SEM</p>
        <p type="p">142:視訊電路</p>
        <p type="p">143:電子束</p>
        <p type="p">144:視訊監視器</p>
        <p type="p">145:電力供應器及控制單元</p>
        <p type="p">146:氣體遞送系統</p>
        <p type="p">147:微操控器</p>
        <p type="p">148:精密電動馬達</p>
        <p type="p">149:一部分</p>
        <p type="p">150:薄探針</p>
        <p type="p">152:陰極</p>
        <p type="p">154:陽極</p>
        <p type="p">156:凝聚透鏡</p>
        <p type="p">158:物鏡</p>
        <p type="p">160:偏轉器</p>
        <p type="p">162:STEM偵測器</p>
        <p type="p">168:離子泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1300" publication-number="202631513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>六方晶磁鐵鉛礦型鐵氧體粉末、鐵氧體樹脂複合材料、鐵氧體樹脂複合體及電磁波吸收體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">C01G49/00</main-classification>
        <further-classification edition="200601120260423B">H01F1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商保德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWDERTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野沢蒼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAWA, SOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵氧體粉末，其為包含鐵(Fe) 50.0質量%以上、65.0質量%以下，鍶(Sr) 6.0質量%以上、9.0質量%以下，及鋯(Zr) 0.3質量%以上、14.0質量%以下的六方晶磁鐵鉛礦型鐵氧體粉末，二價鐵離子(Fe&lt;sup&gt;2+&lt;/sup&gt;)的含量是0.5質量%以上、5.5質量%以下，磁鐵礦(Fe&lt;sub&gt;3&lt;/sub&gt;O&lt;sub&gt;4&lt;/sub&gt;)相的含量是5.0質量%以上、20.0質量%以下，飽和磁化是50 emu/g以上、75 emu/g以下，體積電阻率是1.0×10&lt;sup&gt;9&lt;/sup&gt; Ω·cm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1301" publication-number="202631133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>TPPU的應用及其製品，TPPU及其製品的使用</chinese-title>
        <english-title>APPLICATION OF TPPU AND PRODUCT THEREOF, AND USE OF TPPU AND PRODUCTS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4468</main-classification>
        <further-classification edition="200601120260504B">A61P17/00</further-classification>
        <further-classification edition="200601120260504B">A61K8/49</further-classification>
        <further-classification edition="200601120260504B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商再少年（上海）細胞技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI ZSN CELL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及改善敏感性皮膚的技術領域，尤其涉及利用TPPU在製備改善皮膚敏感製品中的應用、製品及施用TPPU或其製品改善皮膚敏感的方法。具體提供TPPU在製備改善皮膚敏感和/或促進皮膚舒緩製品中的應用，或施用TPPU改善皮膚敏感和/或皮膚抗衰老的方法。TPPU本身可以改善皮膚敏感性和/或促進皮膚舒緩，尤其對皮膚敏感者有良好效用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the technical field of improving sensitive skin, and particularly to the application of TPPU in the preparation of product for alleviating skin sensitivity, the product themselves, and methods of using TPPU or the product to improve skin sensitivity. Specifically, the invention provides the application of TPPU in the preparation of product for improving skin sensitivity and/or promoting skin soothing, or methods of using TPPU to improve skin sensitivity and/or to provide anti-aging effects. TPPU itself is capable of improving skin sensitivity and/or promoting skin soothing, and is especially effective for individuals with sensitive skin.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1302" publication-number="202631178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可注射肽組成物及其用途</chinese-title>
        <english-title>INJECTABLE PEPTIDE COMPOSITIONS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/09</main-classification>
        <further-classification edition="200601120260504B">A61K38/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/24</further-classification>
        <further-classification edition="201701120260504B">A61K47/44</further-classification>
        <further-classification edition="200601120260504B">A61K9/00</further-classification>
        <further-classification edition="200601120260504B">A61P15/08</further-classification>
        <further-classification edition="200601120260504B">A61P3/10</further-classification>
        <further-classification edition="200601120260504B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商菲林公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于葦淩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WEILING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了可注射肽磷脂基相分離凝膠（PPSG）藥物組成物、其製備方法、以及使用其的治療方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are injectable peptide phospholipid-based phase separation gel (PPSG) pharmaceutical compositions, methods for preparing them, and therapeutic methods using them.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1303" publication-number="202631156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備化合物之方法</chinese-title>
        <english-title>METHOD FOR MAKING COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/704</main-classification>
        <further-classification edition="200601120260504B">C07J41/00</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商輝凌國際中心公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRING INTERNATIONAL CENTER SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芮柏格　皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYBERG, PER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗拉契克　亞歷山德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRACZEK, ALEKSANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉森　烏爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARSSON, ULF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞格爾梅柏　費爾南多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEHGELMEBLE, FERNANDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種分子的新穎合成路線。具體地，本揭露在Syn3或其類似物或衍生物的新穎合成中利用特定的一類中間體化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a novel synthetic route to a molecule. In particular, the present disclosure utilises a particular class of intermediate compounds in a novel synthesis of Syn3, or analogues or derivatives thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1304" publication-number="202633014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自雷射產生電漿產生EUV輻射之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR GENERATING EUV RADIATION FROM LASER-PRODUCED PLASMAS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H05G2/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　海寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAINING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈恩　艾瑞克　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAHN, ERIC NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉默　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMME, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普維斯　麥可　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PURVIS, MICHAEL ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明論述用於使用一雷射產生電漿極紫外線(EUV)輻射源來產生EUV輻射之系統及方法。該EUV輻射源可包括：一小滴產生器，其經組態以產生一目標材料之複數個小滴；以及一雷射源，其經組態以產生複數個光脈衝，該複數個光脈衝與該複數個小滴中之一小滴相互作用以形成包含極紫外線(EUV)輻射之一電漿。該複數個光脈衝包含：一第一脈衝，其經組態以引發該小滴之一形狀的一修改，藉此形成一經修改小滴；一第二脈衝，其經組態以減小該經修改小滴之一密度，藉此形成一稀薄小滴；以及一第三脈衝，其經組態以使該稀薄小滴實質上離子化，其中該第二脈衝包含具有在1.1 µm至2.5 µm之一範圍內的一波長之一光脈衝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for generating extreme ultraviolet (EUV) radiation using a laser-produced plasma EUV radiation source are discussed. The EUV radiation source may include a droplet generator configured to generate a plurality of droplets of a target material, and a laser source configured to generate a plurality of pulses of light interacting with a droplet of the plurality of droplets to form a plasma comprising extreme ultraviolet (EUV) radiation. The plurality of pulses of light comprise a first pulse configured to initiate a modification of a shape of the droplet, thereby forming a modified droplet, a second pulse configured to reduce a density of the modified droplet, thereby forming a rarefied droplet, and a third pulse configured to substantially ionize the rarefied droplet, wherein the second pulse comprises a light pulse having a wavelength in a range of 1.1 µm to 2.5 µm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800A:LPP EUV輻射雷射系統</p>
        <p type="p">820:預脈衝雷射源</p>
        <p type="p">830A:稀薄化脈衝雷射源</p>
        <p type="p">840:主脈衝雷射源</p>
        <p type="p">850:雷射光束遞送系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1305" publication-number="202631096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">A61F9/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町屋綾佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIYA, AYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種眼罩，其具有功能體，能夠抑制其與佩戴者之鼻根附近、鼻背上端部附近之間形成間隙。  &lt;br/&gt;本發明之眼罩具備：本體部，其具有在佩戴時覆蓋佩戴者之至少眼睛周邊之形狀；功能體，其設置於本體部；及一對耳掛部，其等設置於本體部之左右方向兩端部；本體部具有上側貫通部，該上側貫通部於本體部之左右方向之中央部，從本體部之上緣部向下緣部延伸且於本體部之前後方向貫通，上側貫通部由一對上側內緣部形成，該一對上側內緣部構成為於下端部相互連接，且上端部能夠相互接近或分離，於一對上側內緣部分別形成有向左右方向凹陷之凹部，功能體以至少一部分位於上側貫通部與至少一個耳掛部之間之方式設置於本體部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼罩</p>
        <p type="p">10:本體部</p>
        <p type="p">10A:第1本體部</p>
        <p type="p">10B:第2本體部</p>
        <p type="p">11:上緣部</p>
        <p type="p">12:下緣部</p>
        <p type="p">13:側緣部</p>
        <p type="p">14:上側貫通部</p>
        <p type="p">15:下側貫通部</p>
        <p type="p">16:上側內緣部</p>
        <p type="p">17:下側內緣部</p>
        <p type="p">20:功能體</p>
        <p type="p">30:耳掛部</p>
        <p type="p">31:耳掛部本體</p>
        <p type="p">31a:上邊</p>
        <p type="p">31b:下邊</p>
        <p type="p">31c:第1側邊</p>
        <p type="p">31d:第2側邊</p>
        <p type="p">32:插入部</p>
        <p type="p">50:外表面片材</p>
        <p type="p">A1:接合區域</p>
        <p type="p">A2:非接合區域</p>
        <p type="p">D1:間隔距離</p>
        <p type="p">D2:間隔距離</p>
        <p type="p">L2:長度</p>
        <p type="p">VL1:第1假想線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1306" publication-number="202631783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導形成用陽離子聚合性樹脂組成物、光波導形成用乾膜、硬化物、光波導及電子零件</chinese-title>
        <english-title>CATIONIC POLYMERIZABLE RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, DRY FILM FOR FORMING OPTICAL WAVEGUIDE, CURED PRODUCT, OPTICAL WAVEGUIDE AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G59/20</main-classification>
        <further-classification edition="200601120260504B">C08G59/42</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四釜拓生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKAMA, TAKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西浦克典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIURA, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田佳広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦川一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAKAWA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村佳保里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, KAHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内海樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUMI, TATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井祐理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, YURIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米原丈博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEHARA, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的光波導形成用陽離子聚合性樹脂組成物包含：脂環式環氧樹脂（A1），具有降冰片烷結構且不具有脂肪族亞甲基鏈及芳香族環；以及環氧樹脂（B1），具有二環戊二烯結構及芳香族環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1307" publication-number="202631982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138558</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>試驗方法、凝膠狀組成物、及試驗裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12M3/00</main-classification>
        <further-classification edition="201001120260504B">C12N5/071</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>月本護也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKIMOTO, MORIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊澤直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋伸岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種試驗方法，該試驗方法使用試驗裝置，該試驗裝置具備：筒狀杯(2)，其在上下方向開口；多孔質膜(3)，其設置在前述杯內部或下端部，且分隔前述杯之上端側與下端側之空間；皮膚細胞片(4)，其載置在前述多孔質膜之上表面；及培養液(M)，其與前述多孔質膜之下表面相接設置；且該試驗方法係在前述皮膚細胞片之上表面載置包含被試驗物質及凝膠化劑之凝膠狀組成物(5)，使前述被試驗物質從前述凝膠狀組成物滲透至前述皮膚細胞片，藉由前述凝膠狀組成物之凝膠特性而防止前述被試驗物質從前述凝膠狀組成物向前述杯之內壁側流出，以使前述被試驗物質不接觸到前述杯之內壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容器</p>
        <p type="p">2:杯</p>
        <p type="p">3:多孔質膜</p>
        <p type="p">4:皮膚細胞片</p>
        <p type="p">5:凝膠狀組成物</p>
        <p type="p">10:試驗裝置</p>
        <p type="p">s1:上端側空間</p>
        <p type="p">s2:下端側空間</p>
        <p type="p">M:培養液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1308" publication-number="202632986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於下層觸發行動性測量之通道狀態資訊參考信號組態的技術</chinese-title>
        <english-title>TECHNIQUES FOR CHANNEL STATE INFORMATION-REFERENCE SIGNAL CONFIGURATION FOR LOWER-LAYER TRIGGERED MOBILITY MEASUREMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W24/08</main-classification>
        <further-classification edition="200901120260504B">H04W36/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南宇碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, WOOSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　嚴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成鬥鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, DOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。一種使用者設備(UE)可接收一控制訊息，該控制訊息指示用於層1 (L1)/層2 (L2)觸發行動性(L1/L2 triggered mobility, LTM)之通道狀態資訊(channel state information, CSI)報告的一測量組態。該測量組態可指示用於LTM的複數個CSI參考信號(CSI-reference signal, CSI-RS)資源，其中該複數個CSI-RS資源對應於與該UE之LTM相關聯的複數個候選小區。該UE可根據該測量組態經由該複數個CSI-RS資源執行用於LTM的一或多個CSI測量。該UE可傳輸一CSI報告，該CSI報告指示用於LTM的該一或多個CSI測量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive a control message indicating a measurement configuration for channel state information (CSI) reporting for layer 1 (L1) / layer 2 (L2) triggered mobility (LTM). The measurement configuration may indicate a plurality of CSI-reference signal (CSI-RS) resources for LTM, where the plurality of CSI-RS resources corresponds to a plurality of candidate cells associated with LTM for the UE. The UE may perform one or more CSI measurements for LTM via the plurality of CSI-RS resources in accordance with the measurement configuration. The UE may transmit a CSI report indicating the one or more CSI measurements for LTM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-a:網路實體</p>
        <p type="p">105-b:網路實體</p>
        <p type="p">105-c:網路實體</p>
        <p type="p">115-A:UE</p>
        <p type="p">125-A:通訊鏈路</p>
        <p type="p">125-B:通訊鏈路</p>
        <p type="p">125-C:通訊鏈路</p>
        <p type="p">200:無線通訊系統</p>
        <p type="p">205-a:小區；服務小區</p>
        <p type="p">205-b:小區；候選小區</p>
        <p type="p">205-c:小區；候選小區</p>
        <p type="p">210:控制信號</p>
        <p type="p">215:測量資源</p>
        <p type="p">220:參考信號</p>
        <p type="p">225:通道狀態資訊(CSI)報告</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1309" publication-number="202631545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>立方晶氮化硼多晶體及切削工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C04B35/5831</main-classification>
        <further-classification edition="200601120260416B">C01B21/064</further-classification>
        <further-classification edition="200601120260416B">C30B29/38</further-classification>
        <further-classification edition="200601120260416B">B23P15/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工硬質合金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC HARDMETAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人物質　材料研究機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE FOR MATERIALS SCIENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井顕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村克己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出口裕佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGUCHI, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田高志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端計博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKAWA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種立方晶氮化硼多晶體，其包含95.0體積%以上之立方晶氮化硼，且於上述立方晶氮化硼多晶體之任意10個部位所獲取之10個拉曼光譜之中，1個以上之上述拉曼光譜具有存在於拉曼位移1047 cm&lt;sup&gt;-1&lt;/sup&gt;以上1053 cm&lt;sup&gt;-1&lt;/sup&gt;以下之第一峰、及存在於拉曼位移1069 cm&lt;sup&gt;-1&lt;/sup&gt;以上1078 cm&lt;sup&gt;-1&lt;/sup&gt;以下之第二峰中之一者或兩者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1310" publication-number="202632268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>襯料製品的非破壞檢查方法及混合檢查方法</chinese-title>
        <english-title>NON-DESTRUCTIVE INSPECTION METHOD AND HYBRID INSPECTION METHOD FOR LINING PRODUCTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N29/12</main-classification>
        <further-classification edition="201401120260504B">G01N21/3563</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商華爾卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALQUA, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤裕孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTOH, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉山友章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIYAMA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神山悠美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYAMA, YUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中道祥二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMICHI, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMEDA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸田清華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺崎正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASAKI, NAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田義太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, YOSHITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山浦大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAURA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿野昭文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANO, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒谷弘幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARATANI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平川璃織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKAWA, RIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供能夠從外部檢查襯料製品的內部狀態，以檢測樹脂內襯的隆起或剝離、接著劑的劣化等異常、或檢測樹脂內襯的熔接線或排氣管線之襯料製品的非破壞檢查方法。  &lt;br/&gt;本發明的襯料製品的非破壞檢查方法係從外部檢查襯料製品的內部狀態的非破壞檢查方法；對作為量測對象的襯料製品發送輸入信號；並且接收來自量測對象的響應信號；根據該響應信號，檢測量測對象的異常部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The objective of this invention is to provide a non-destructive inspection method for lining products that allows the internal state of a lining product to be examined from the outside and enables the detection of abnormalities such as bulging or delamination of a resin liner, deterioration of an adhesive, as well as weld lines or vent lines in the resin liner. &lt;br/&gt;　　The non-destructive inspection method for lining products of this invention is a method for inspecting the internal state of a lining product from the outside. In this method, an input signal is transmitted to the lining product serving as a measurement object, a response signal from the measurement object is received, and an abnormal part of the measurement object is detected based on the response signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:非破壞檢查裝置</p>
        <p type="p">12:發送手段</p>
        <p type="p">14:發送端子</p>
        <p type="p">16:信號產生手段</p>
        <p type="p">18:接收手段</p>
        <p type="p">20:接收端子</p>
        <p type="p">22:檢測手段</p>
        <p type="p">30:量測對象</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1311" publication-number="202633397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>瓶體收容裝置及瓶體收容方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P76/00</main-classification>
        <further-classification edition="200601120260422B">B05C11/08</further-classification>
        <further-classification edition="200601120260422B">B05C11/10</further-classification>
        <further-classification edition="202601120260422B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小金澤尚良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGANEZAWA, TAKARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大薗啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOZONO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土山正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYAMA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙木慎介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西山雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIYAMA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永本龍人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMOTO, RYUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部凌大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]在對載置儲存處理液的瓶體的瓶體用載置部進行瓶體的收授時，減輕作業者的負擔。  &lt;br/&gt;　　[解決手段]具備瓶體用載置部，用以載置儲存有製造半導體裝置用處理液的瓶體；以及切換機構，用以在瓶體用載置部的周圍空間被封閉的第1狀態，與為了對瓶體用載置部收授上述瓶體，上述空間被開放的第2狀態之間進行切換。由於上述第1狀態與第2狀態藉由切換機構被切換，在第2狀態下對瓶體載置部進行瓶體的收授時，可以減輕作業者的負擔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:瓶體</p>
        <p type="p">5:瓶體用載置部</p>
        <p type="p">6:移動機構</p>
        <p type="p">40:槽體</p>
        <p type="p">50:瓶體載置單元</p>
        <p type="p">55:支持體</p>
        <p type="p">57:板狀體</p>
        <p type="p">58:板狀體</p>
        <p type="p">61:馬達</p>
        <p type="p">62:小齒輪</p>
        <p type="p">63:直線構件</p>
        <p type="p">70:空間</p>
        <p type="p">71:底壁</p>
        <p type="p">72:上壁</p>
        <p type="p">101:操作面板</p>
        <p type="p">120:開口部</p>
        <p type="p">121:壁部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1312" publication-number="202631748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氟聚合物之製造方法、固體組成物及水性分散液</chinese-title>
        <english-title>METHOD FOR PRODUCING FLUORINE-CONTAINING POLYMER, SOLID COMPOSITION, AND AQUEOUS DISPERSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08F214/26</main-classification>
        <further-classification edition="200601120260424B">C08F2/16</further-classification>
        <further-classification edition="200601120260424B">C08F2/24</further-classification>
        <further-classification edition="202501120260424B">C08L23/28</further-classification>
        <further-classification edition="200601120260424B">C08J3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明含氟聚合物之製造方法係在包含玻璃轉移溫度為10℃以下之第1含氟聚合物及水性介質的水性分散液中，使包含四氟乙烯之單體進行聚合，製造與第1含氟聚合物不同之第2含氟聚合物；在單體開始聚合之前，第1含氟聚合物之含量相對於水性分散液之總質量大於4質量%且在50質量%以下；並且，在單體開始聚合之前，相對於水性分散液中之前述第1含氟聚合物之總質量，具有氟原子之乳化劑及烴系乳化劑的濃度分別為100質量ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1313" publication-number="202631478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張收納庫及紙張處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B65H29/38</main-classification>
        <further-classification edition="201901120260430B">G07D11/00</further-classification>
        <further-classification edition="201901120260430B">G07D11/13</further-classification>
        <further-classification edition="201901120260430B">G07D11/40</further-classification>
        <further-classification edition="200601120260430B">G07D13/00</further-classification>
        <further-classification edition="200601120260430B">B65H31/04</further-classification>
        <further-classification edition="200601120260430B">B65H31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栂野景一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGANO, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了提供一種紙張收納庫及紙張處理裝置，可提升將積聚在裝載台(400)上之多張紙張藉由手動分幾次取出之作業性。  &lt;br/&gt;　　紙張收納庫具備：支承紙張之紙張支承構件(170, 180)、將從該紙張支承構件移載的紙張進行積聚之紙張裝載台(400)、使該紙張裝載台沿著既定路徑進退之裝載台進退機構(410)、裝載台控制機構(600)。該裝載台控制機構，在紙張的積聚動作中，容許紙張裝載台往朝向紙張支承構件的加壓方向移動，當將積聚在紙張裝載台上的紙張取出時，禁止紙張裝載台往加壓方向移動，但容許紙張裝載台往與加壓方向相反的退避方向移動並在任意的位置停止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:紙幣收納庫</p>
        <p type="p">400:裝載台</p>
        <p type="p">400a:裝載面</p>
        <p type="p">400b:被導引部</p>
        <p type="p">600:裝載台控制機構(裝載台卡脫機構)</p>
        <p type="p">610:進退限制構件</p>
        <p type="p">613:限制部</p>
        <p type="p">615:基座構件</p>
        <p type="p">615a:鉸鏈部</p>
        <p type="p">616:彈性構件</p>
        <p type="p">622:被推壓片(被操作片)</p>
        <p type="p">660:推壓片(操作片)</p>
        <p type="p">700:外殼主體</p>
        <p type="p">700a:開口部</p>
        <p type="p">702:鉸鏈部</p>
        <p type="p">720:導引部</p>
        <p type="p">750:門部</p>
        <p type="p">760:鎖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1314" publication-number="202632616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙張收納庫及紙張處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G07F9/00</main-classification>
        <further-classification edition="200601120260312B">B65H29/38</further-classification>
        <further-classification edition="200601120260312B">B65H31/04</further-classification>
        <further-classification edition="200601120260312B">B65H31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栂野景一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGANO, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生山浩通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OIYAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了在具備有與藉由紙張支承構件支承的紙張接觸並將其推出的推壓構件、及可往朝向紙張支承構件的外周面之加壓方向和從紙張支承構件離開的退避方向進退自如的裝載台之紙張收納庫中，使紙張支承構件驅動機構、推壓構件驅動機構等小型化、單元化。  &lt;br/&gt;　　紙張收納庫具備：支承紙張放置部(150)的紙張之紙張支承構件(170，180)、將紙張推出而從紙張支承構件脫離之推壓構件(300)、支承構件驅動機構(200)、推壓構件驅動機構(350)、紙張裝載台(400)，支承構件驅動機構位於比紙張放置部更靠搬運方向上游側，推壓構件驅動機構由來自支承構件驅動機構的驅動力驅動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">150:紙幣放置部</p>
        <p type="p">170,180:旋轉體(紙幣積聚用旋轉體、紙幣支承構件)</p>
        <p type="p">170a,180a:凹陷部</p>
        <p type="p">170b,180b:前表面側端緣</p>
        <p type="p">170c,180c:後表面側端緣</p>
        <p type="p">172,182:芯部</p>
        <p type="p">174,184:接觸片(肋部)</p>
        <p type="p">174a,184a:外周緣</p>
        <p type="p">190:凸輪構件</p>
        <p type="p">190a:傾斜部</p>
        <p type="p">190b:非傾斜部</p>
        <p type="p">190E:終端部</p>
        <p type="p">190L:始端部</p>
        <p type="p">300:推壓構件</p>
        <p type="p">302:導引狹縫</p>
        <p type="p">304:軸部</p>
        <p type="p">350:推壓構件驅動機構</p>
        <p type="p">400:裝載台</p>
        <p type="p">400a:裝載面</p>
        <p type="p">500:縮放器(推壓構件出沒手段)</p>
        <p type="p">510:連結片</p>
        <p type="p">510a:一端部</p>
        <p type="p">510b:另一端部</p>
        <p type="p">512:固定軸</p>
        <p type="p">514:銷</p>
        <p type="p">520:連結片</p>
        <p type="p">520a:一端部</p>
        <p type="p">520b:另一端部</p>
        <p type="p">530:軸部</p>
        <p type="p">532:扭力彈簧</p>
        <p type="p">550:縮放器出沒機構</p>
        <p type="p">560:從動件支承構件</p>
        <p type="p">565:從動件</p>
        <p type="p">a:旋轉方向</p>
        <p type="p">B:紙幣</p>
        <p type="p">c:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1315" publication-number="202633336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>門體</chinese-title>
        <english-title>DOOR BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P72/10</main-classification>
        <further-classification edition="200601120260424B">E05B65/00</further-classification>
        <further-classification edition="200601120260424B">G08B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾承梧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHENG-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粟勁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOU, JING-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祐憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, TZU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種門體，適用於半導體容器，門體配置用以結合半導體容器。門體包含栓鎖裝置及操作指示件。栓鎖裝置設置於門體，栓鎖裝置用以將門體上鎖或解鎖於半導體容器。操作指示件設置於栓鎖裝置上，操作指示件用以辨識操作狀態。藉此能夠在門體上鎖或解鎖的過程中保護門體，避免門體或其上的栓鎖裝置之損壞，更優化地，門體的兩側配置有拿取部，能夠栓鎖與拿取部搭配使用，更能提升門體及應用其之半導體容器的保護力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:門體</p>
        <p type="p">12:門主體</p>
        <p type="p">14:封板</p>
        <p type="p">142:鑰匙孔</p>
        <p type="p">144:破口</p>
        <p type="p">30:栓鎖裝置</p>
        <p type="p">31:操作件</p>
        <p type="p">32:栓鎖件</p>
        <p type="p">33:解鎖部</p>
        <p type="p">34:上鎖部</p>
        <p type="p">35:解鎖限位件</p>
        <p type="p">36:上鎖限位件</p>
        <p type="p">40:操作指示件</p>
        <p type="p">S:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1316" publication-number="202631394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擠壓型材及建材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/18</main-classification>
        <further-classification edition="200601120260504B">B32B27/20</further-classification>
        <further-classification edition="200601120260504B">B32B27/32</further-classification>
        <further-classification edition="200601120260504B">C08L1/02</further-classification>
        <further-classification edition="200601120260504B">C08L23/12</further-classification>
        <further-classification edition="202501120260504B">C08L23/26</further-classification>
        <further-classification edition="200601120260504B">C08K9/04</further-classification>
        <further-classification edition="201901120260504B">B29C48/00</further-classification>
        <further-classification edition="201901120260504B">B29C48/21</further-classification>
        <further-classification edition="200601120260504B">E04B1/00</further-classification>
        <further-classification edition="200601320260504B">B29K23/00</further-classification>
        <further-classification edition="200601320260504B">B29L9/00</further-classification>
        <further-classification edition="200601320260504B">B29L31/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ建築製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK AP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若林雅樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKABAYASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明能夠在抑制含有經過化學處理的纖維素粉體及樹脂的擠壓型材的表面變色的同時，增加擠壓型材中含有的纖維素粉體的量。&lt;br/&gt;  擠壓型材20具備：基部21，其含有經過化學處理的纖維素粉體及樹脂；以及表層部22，其含有經過化學處理的纖維素粉體及樹脂，並覆蓋基部21。表層部22中的纖維素粉體的含有率低於基部21中的纖維素粉體的含有率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:擠壓型材</p>
        <p type="p">21:基部</p>
        <p type="p">22:表層部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1317" publication-number="202631986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新的副乾酪乳桿菌或其變異體和其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">C12N1/20</main-classification>
        <further-classification edition="201501120260504B">A61K35/747</further-classification>
        <further-classification edition="200601120260504B">A61P1/02</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="201601120260504B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日集團食品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI GROUP FOODS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山保典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙𣘺秀典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川﨑直子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種副乾酪乳桿菌(Lacticaseibacillus paracasei)或其變異體，其具有包含與序列編號1所示的鹼基序列具有90%以上的同源性的鹼基序列的16S rRNA。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1318" publication-number="202632077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造電化學電池元件的方法、電化學電池元件、電化學電池裝置</chinese-title>
        <english-title>METHOD FOR PRODUCING AN ELECTROCHEMICAL CELL ELEMENT, ELECTROCHEMICAL CELL ELEMENT, ELECTROCHEMICAL CELL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260504B">C25B1/042</main-classification>
        <further-classification edition="202101120260504B">C25B9/75</further-classification>
        <further-classification edition="201601120260504B">H01M8/0206</further-classification>
        <further-classification edition="201601120260504B">H01M8/0245</further-classification>
        <further-classification edition="201601120260504B">H01M8/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊恩　史蒂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維萊克　漢尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLECK, HANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製造一電化學電池元件（10）之方法（100），該電化學電池元件包含一電化學電池（14）、尤其是一電解電池（14）、及一互連器（24），其中該電解電池（14）具有至少三個功能層（26）及一金屬電池基板（22），其中該互連器（24）具有隆起部（16）。提出互連器（24）藉由複數個微焊連接件（34）連接至該電池基板（22），各微焊連接件（34）配置於一隆起部（16）上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method (100) for producing an electrochemical cell element (10) comprising an electrochemical cell (14), in particular an electrolysis cell (14), and an interconnector (24), wherein the electrolysis cell (14) has at least three functional layers (26) and a metallic cell substrate (22), wherein the interconnector (24) has elevations (16). It is proposed for the interconnector (24) to be connected to the cell substrate (22) by a plurality of microweld connections (34), each microweld connection (34) being arranged on an elevation (16).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一電化學電池元件</p>
        <p type="p">16:隆起部</p>
        <p type="p">20a:第一中間空間</p>
        <p type="p">20b:第二中間空間</p>
        <p type="p">22:金屬電池基板</p>
        <p type="p">24:互連器</p>
        <p type="p">26:功能層</p>
        <p type="p">28:穿孔</p>
        <p type="p">32:第一塗層</p>
        <p type="p">34:微焊連接件</p>
        <p type="p">36:第一電極層</p>
        <p type="p">38:電解質層</p>
        <p type="p">40:第二電極層</p>
        <p type="p">42:第二塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1319" publication-number="202631492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纖維狀結構體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260421B">C01B32/159</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本郷孝剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGO, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村昌生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗原竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIHARA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提升纖維狀結構體的操作性並確保充分之分散性。本發明之纖維狀結構體的製造方法具備：準備工序，準備以於多個纖維狀材料間形成有空隙之狀態凝集的纖維狀結構體A；以及空隙去除工序，將在前述纖維狀結構體A中之前述空隙之一部分去除以形成纖維狀結構體B；在將前述纖維狀結構體A的容積密度定為ρA（g／mL）、將前述纖維狀結構體B的容積密度定為ρB（g／mL）時，滿足1.3≦ρB／ρA≦200。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1320" publication-number="202633291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構之製造方法及表面處理方法</chinese-title>
        <english-title>METHODS OF MANUFACTURE AND SURFACE TREATMENT OF SEMICONDUCTOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P50/20</main-classification>
        <further-classification edition="202601120260423B">H10P50/24</further-classification>
        <further-classification edition="200601120260423B">H05H1/46</further-classification>
        <further-classification edition="200601120260423B">C09K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商牛津儀器奈米科技工具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛頓　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWTON, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹孫進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SUN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構之表面處理方法。該方法包括：提供包括氮化鎵基材料之基板，該氮化鎵基材料係為氮化鎵或其合金，該基板係設於電漿處理室中之支撐臺上，其中，遠離該支撐臺之該基板之表面經成形以定義複數特徵，各特徵具有非平行於該基板之平面取向的側壁；建立一種或多種蝕刻氣體向該電漿處理室中之流動；自該一種或多種蝕刻氣體於該電漿處理室內產生電漿，藉此，該電漿蝕刻該氮化鎵基材料，且於該蝕刻期間，建立一組同步製程參數，其包括控制該支撐臺之溫度為至少120℃並控制該基板支撐臺之電性狀態，從而不向該基板臺施加任何射頻、RF、偏壓或者施加具有不超過200W之功率的RF偏壓，藉此，自該些特徵之該些側壁之至少其中部分移除外層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of surface treatment of a semiconductor structure. The method comprises: providing a substrate comprising a gallium nitride-based material, the gallium nitride-based material being gallium nitride or an alloy thereof, the substrate being disposed on a support table in a plasma processing chamber, wherein a surface of the substrate distal to the support table is shaped so as to define a plurality of features each having side walls oriented non-parallel to the plane of the substrate; establishing a flow of one or more etch gases into the plasma processing chamber; generating a plasma within the plasma processing chamber from the one or more etch gases whereby the plasma etches the gallium nitride-based material and, during the etching, establishing a set of simultaneous process parameters which include controlling the temperature of the support table to be at least 120℃ and controlling the electrical state of the substrate support table such that either no radio frequency, RF, bias or an RF bias with a power of no more than 200 W is applied to the substrate table, whereby an outer layer is removed from at least part of the side walls of the features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401:提供基板</p>
        <p type="p">S402:建立蝕刻氣體之流動</p>
        <p type="p">S403:蝕刻基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1321" publication-number="202631551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱穩定組成物及其作為抗積垢劑的用途</chinese-title>
        <english-title>THERMALLY STABLE COMPOSITIONS AND USE THEREOF AS ANTIFOULANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C5/333</main-classification>
        <further-classification edition="200601120260504B">C07C7/20</further-classification>
        <further-classification edition="200601120260504B">C07C11/04</further-classification>
        <further-classification edition="200601120260504B">C07C11/06</further-classification>
        <further-classification edition="200601120260504B">C07D211/94</further-classification>
        <further-classification edition="200601120260504B">C10G9/16</further-classification>
        <further-classification edition="200601120260504B">C10G75/04</further-classification>
        <further-classification edition="200601120260504B">C10L3/00</further-classification>
        <further-classification edition="200601120260504B">C10L3/10</further-classification>
        <further-classification edition="200601120260504B">B01J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藝康美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECOLAB USA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪西爾　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASERE, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎波斯　佩卓　喬治　卡瓦略</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPOS, PEDRO JORGE CARVALHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑班達姆　薩第什　庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMBANDAM, SATHEESH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　麥可　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, MICHAEL DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於抗積垢劑組成物、以及防止或抑制積垢的方法。本揭露係關於抗積垢劑組成物，該等抗積垢劑組成物包含一或多種溶劑、一或多種抗聚合劑、及一或多種分散劑。該等組成物可包括其他可選組分，諸如抗氧化劑、醇、及/或水。亦揭示在天然氣去氫程序中使用該等組成物以防止或最小化積垢之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to antifoulant compositions and methods of preventing or inhibiting fouling. The disclosure relates to antifoulant compositions comprising one or more solvents, one or more antipolymerants, and one or more dispersants. The compositions may include other optional components, such as an antioxidant, an alcohol, and/or water. Methods of using the compositions in natural gas dehydrogenation processes to prevent or minimize fouling are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1322" publication-number="202631329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138637</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開口棘輪扳手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25B13/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽田工具企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種開口棘輪扳手，其顎座以具開口的主孔，用以樞設外周具外齒之棘輪，棘輪設有具通道之扳孔。主孔壁面凹設第一、二室，用以安裝受彈簧作用而嚙合外齒之第一、二掣子。特徵一：顎座設有連通第一、二室之第一、二孔，用以供第一、二軸件樞接，第一、二軸件底部安裝有該彈簧、頂端設有偏心部，而顎座頂面設有能促動兩偏心部之撥盤，令撥盤能在第1檔至第2檔間切換，用以調節棘輪換向施力。特徵二：棘輪外周頂緣安裝有可拆卸的旋鈕、底緣安裝有另一可拆卸的旋鈕，令兩旋鈕限制棘輪脫出主孔，且能連動棘輪空回自轉。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(1):扳體</p>
        <p type="p">(11):顎座</p>
        <p type="p">(13):開口</p>
        <p type="p">(2):棘輪</p>
        <p type="p">(21):扳孔</p>
        <p type="p">(23):通道</p>
        <p type="p">(31)(32):旋鈕</p>
        <p type="p">(55):偏心部</p>
        <p type="p">(6):撥盤</p>
        <p type="p">(61):第一軌</p>
        <p type="p">(62):第二軌</p>
        <p type="p">(63):記號</p>
        <p type="p">(64):托部</p>
        <p type="p">(65):標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1323" publication-number="202631995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＲＥＭ偶聯物的組成物及其用途</chinese-title>
        <english-title>COMPOSITIONS OF TREM CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">C12N15/113</main-classification>
        <further-classification edition="201701120260504B">A61K47/54</further-classification>
        <further-classification edition="202501120260504B">A61K9/127</further-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VI, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿納史戴西艾狄斯　席奧尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANASTASSIADIS, THEONIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基斯曼　威廉　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIESMAN, WILLIAM F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于洪川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONGCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛雷茲爾　丹尼爾　亞伯拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAZIER, DANIEL ABRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明總體上關於偶聯物，該等偶聯物包含與部分（例如，碳水化合物、脂質、肽、小分子、寡核苷酸）結合的基於tRNA的效應分子以及與其相關的方法、組成物和用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates generally to conjugates comprising tRNA-based effector molecules bound to moieties (e.g., carbohydrates, lipids, peptides, small molecules, oligonucleotides) and methods, compositions, and uses relating thereto.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1324" publication-number="202632891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>計時裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H03H9/19</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊奈弘善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INA, HIROYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井克宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅田颯志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEDA, SOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑島知也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAJIMA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部良祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">計時裝置1具備：壓電層11，由壓電材料構成；支持基板13，在壓電層11下，沿著壓電層的外緣而配置；以及電極15，配置在壓電層11。在此，例如，電極15，在沿著壓電層11的主面之方向上，配置在成為支持基板13之間的位置。藉此，提供一種計時裝置，即使於使壓電材料薄膜化之情形下，膜厚更均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:壓電層</p>
        <p type="p">13:支持基板</p>
        <p type="p">13h:開口部</p>
        <p type="p">15:電極</p>
        <p type="p">L1,L2,L3:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1325" publication-number="202632743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合的熱和電漿輔助原子層沉積</chinese-title>
        <english-title>COMBINED THERMAL AND PLASMA ASSISTED ATOMIC LAYER DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯瓦米納森　相卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWAMINATHAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛吉斯　莫西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERGHESE, MOHITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特納卡　古諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATNAGAR, KUNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游　素碹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOW, SUE-ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　周Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, CHAU T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘塔　賽耀史威普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANTA, SATHYA SWAROOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電漿線圈組件，其包括環形主體、位於環形主體內的RF電極，以及位於環形主體內的介電頂板。半導體製造處理腔室，包括處理腔室主體、氣體分配組件、基板支撐件以及電漿線圈組件。一種選擇性蝕刻基板表面的方法，其包括形成處理氣體、將基板表面暴露於處理氣體下以形成活化的含氟物質，以及使活化的含氟物質升華。一種蝕刻基板表面的方法，其包括將基板表面暴露於含氟電漿中並對基板表面施加偏壓，含氟電漿由電漿線圈組件生成。一種蝕刻基板表面的方法，包括將基板表面暴露於電感耦合電漿下並對基板表面施加偏壓，電感耦合電漿由電漿線圈組件生成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma coil assembly including a ring-shaped body, an RF electrode positioned within the ring-shaped body, and a dielectric top plate positioned within the ring-shaped body. A semiconductor manufacturing processing chamber including a processing chamber body, a gas distribution assembly, a substrate support, and the plasma coil assembly. A method of selectively etching a substrate surface including forming a process gas, exposing the substrate surface to the process gas to form activated fluorine-containing species, and sublimating the activated fluorine-containing species. A method of etching a substrate surface including exposing the substrate surface to a fluorine-containing plasma and applying a bias voltage to the substrate surface, the fluorine-containing plasma generated by the plasma coil assembly. A method of etching a substrate surface including exposing the substrate surface to an inductively coupled plasma and applying a bias voltage to the substrate surface, the inductively coupled plasma generated by the plasma coil assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">101:腔室主體</p>
        <p type="p">102:側壁</p>
        <p type="p">104:腔室蓋</p>
        <p type="p">105:內部空間</p>
        <p type="p">106:排氣裝置</p>
        <p type="p">108:晶圓</p>
        <p type="p">109:間隙</p>
        <p type="p">110:氣體分配組件</p>
        <p type="p">115:晶圓升舉銷</p>
        <p type="p">116:晶圓升舉環</p>
        <p type="p">117:晶圓升舉波紋管</p>
        <p type="p">118:定位器</p>
        <p type="p">119:波紋管</p>
        <p type="p">120:面板</p>
        <p type="p">130:背板</p>
        <p type="p">137:氣室</p>
        <p type="p">145:入口開口</p>
        <p type="p">160:蓋件外殼</p>
        <p type="p">162:開口</p>
        <p type="p">170:基板支撐件</p>
        <p type="p">172:支撐軸</p>
        <p type="p">173:支撐表面</p>
        <p type="p">175:旋轉軸</p>
        <p type="p">180:第二RF線圈</p>
        <p type="p">181:源RF</p>
        <p type="p">182:偏壓RF</p>
        <p type="p">190:靜電吸盤(ESC)</p>
        <p type="p">200:電漿線圈組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1326" publication-number="202631267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清除系統以及清除方法</chinese-title>
        <english-title>CLEARING SYSTEM AND CLEARING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">B08B3/12</main-classification>
        <further-classification edition="200601120260419B">B08B3/04</further-classification>
        <further-classification edition="200601120260419B">B08B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商艾科迴思塔超音波表面清潔有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECHOVISTA ULTRASOUND SURFACE CLEANING LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申敏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, MINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩吉　哈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAGE, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧德林　托馬斯　約書亞　基頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODLING-THOMAS, JOSHUA KEATON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾特　斯特芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTER, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於對一表面進行超音波清洗之一種系統、一相對應方法，及使用此系統於清洗一表面。用以自一表面清除一污染之方法包括：產生第一超音波；將第一超音波耦合至表面；接收至少部分第一超音波；偵測至少部分第一超音波之複數特性中之一或多個特性之變化；基於所偵測之一或多個特性之變化，自一預定清洗動作集合中決定一清洗動作；產生第二超音波；以及依據決定之清洗動作將第二超音波耦合至表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a system for ultrasonic cleaning of a surface, a corresponding method, and a use of the system for cleaning a surface. The method for clearing a contamination from a surface is comprising: generating first ultrasonic waves; coupling the first ultrasonic waves to the surface; receiving at least some of the first ultrasonic waves; detecting a change in one or more characteristics of a plurality of characteristics of the at least some of the first ultrasonic waves in the; determining a cleaning action for the surface from a set of predefined cleaning actions based on the detected change in the one or more characteristics; generating second ultrasonic waves; and coupling the second ultrasonic waves to the surface in accordance with the determined cleaning action.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:表面</p>
        <p type="p">141:液體/類型</p>
        <p type="p">142:泥巴/生物性物質/類型</p>
        <p type="p">143:冰/類型</p>
        <p type="p">144:塵埃/類型</p>
        <p type="p">145:霧/凝結水/類型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1327" publication-number="202631148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用ＫＲＡＳ　Ｇ１２Ｄ抑制劑之方法</chinese-title>
        <english-title>METHODS OF USING A KRAS G12D INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/553</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　茱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　允荷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOONHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德希穆克　高瑞　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHMUKH, GAURI DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達里亞　尼基什　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHARIA, NEEKESH VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多爾頓　麥可　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLTON, MICHAEL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛嘉琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JIALIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬慊　馬克　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCHANT, MARK ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉查馬魯　拉瑪克里斯納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RACHUMALLU, RAMAKRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇林　羅伯特　查理斯　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHILLING, ROBERT CHARLES, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史羅德　艾咪　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, AMY CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIU, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤　傑斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JESSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用小分子 KRAS G12D 抑制劑 GDC-7035 治療癌症之方法。此類方法包括單獨投予 GDC-7035 以及與其他療法聯合投予。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating cancer with GDC-7035, a small molecule KRAS G12D inhibitor. Such methods include the administration of GDC-7035 alone and in combination with other therapies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1328" publication-number="202633445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體裝置之冷卻結構、以及半導體裝置</chinese-title>
        <english-title>COOLING STRUCTURE FOR A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W40/25</main-classification>
        <further-classification edition="202601120260422B">H10W40/22</further-classification>
        <further-classification edition="201401120260422B">B23K26/146</further-classification>
        <further-classification edition="202601120260422B">H10P54/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商科林堤斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORINTIS SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　俄普　雷姆科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ERP, REMCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得羅夫　多伊奇諾夫　約丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETROV DOYTCHINOV, IORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於冷卻半導體裝置之冷卻結構（10、10’、10’’、10’’’），所述冷卻結構（10、10’、10’’、10’’’）包含選自銅、矽、不鏽鋼、以及鑽石之中的一材料，其中所述冷卻結構（10、10’、10’’、10’’’）包括至少一第一通道（14、14’、14’’、14’’’、14&lt;sup&gt;iv&lt;/sup&gt;、14&lt;sup&gt;v&lt;/sup&gt;、14&lt;sup&gt;vi&lt;/sup&gt;），第一通道自材料之一外表面（26、26’）在一深度方向延伸並沿外表面在一長度方向延伸，其中第一通道被配置以導引冷卻流體，並具有第一側壁與第二側壁；且其中第一側壁相對於外表面以第一角度延伸，而第二側壁相對於外表面以一第二角度延伸，且第一角度與第二角度彼此偏差不超過2∘。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a cooling structure (10, 10’, 10’’, 10’’’) for cooling a semiconductor device, the cooling structure (10, 10’, 10’’, 10’’’) including a material selected from copper, silicon, stainless steel, and diamond, wherein the cooling structure (10, 10’, 10’’, 10’’’) comprises at least a first channel (14, 14’, 14’’, 14’’’, 14iv, 14v, 14vi) that extends from an outer surface (26, 26’) of the material in a depth direction and extends along the outer surface in a length direction, wherein the first channel is configured to guide a cooling fluid and has a first sidewall and a second sidewall; and wherein the first sidewall extends at a first angle relative to the outer surface and the second sidewall extends at a second angle relative to the outer surface and wherein the first and second angle deviate from one another by not more than 2°.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:冷卻結構</p>
        <p type="p">12:通道/表面</p>
        <p type="p">14:第一通道/第一冷卻通道/通道</p>
        <p type="p">16:第二通道/第二冷卻通道/通道</p>
        <p type="p">18:鰭片</p>
        <p type="p">20:第一側壁/側壁</p>
        <p type="p">22:第二側壁/側壁</p>
        <p type="p">24:基底區段</p>
        <p type="p">26:外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1329" publication-number="202631618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138776</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>５，６－雙環５－ＨＴ２ＡＲ促效劑及其用途</chinese-title>
        <english-title>5,6-BICYCLIC 5-HT2AR AGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">C07D231/56</further-classification>
        <further-classification edition="200601120260504B">A61K31/437</further-classification>
        <further-classification edition="200601120260504B">A61K31/416</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
        <further-classification edition="200601120260504B">A61P25/22</further-classification>
        <further-classification edition="200601120260504B">A61P25/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商布蘭達里斯治療私人有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRANDARIS THERAPEUTICS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛洛斯普　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOSSOP, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟特拿　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTANA, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEAL, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪瑞丹　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERIDAN, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克理得藍　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRIDLAND, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷頓　麗貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAYTON, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於適用於活化5-羥基色胺2A受體(5-hydroxytryptamine 2A receptor；5-HT2AR)之化合物、其醫藥學上可接受之組合物及使用該等化合物及組合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compounds useful for activating the 5-hydroxytryptamine 2A receptor (5-HT2AR), pharmaceutically acceptable compositions thereof, and methods of using said compounds and compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1330" publication-number="202631255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合體、產氫觸媒、觸媒油墨、電極及複合體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B01J27/051</main-classification>
        <further-classification edition="200601120260504B">B01J27/22</further-classification>
        <further-classification edition="202401120260504B">B01J35/30</further-classification>
        <further-classification edition="202401120260504B">B01J35/40</further-classification>
        <further-classification edition="202401120260504B">B01J35/61</further-classification>
        <further-classification edition="202401120260504B">B01J35/70</further-classification>
        <further-classification edition="200601120260504B">B01J37/02</further-classification>
        <further-classification edition="200601120260504B">B01J37/03</further-classification>
        <further-classification edition="200601120260504B">B01J37/04</further-classification>
        <further-classification edition="200601120260504B">B01J37/08</further-classification>
        <further-classification edition="200601120260504B">B01J37/16</further-classification>
        <further-classification edition="200601120260504B">B01J37/34</further-classification>
        <further-classification edition="201701120260504B">C01B32/949</further-classification>
        <further-classification edition="200601120260504B">C01G39/06</further-classification>
        <further-classification edition="202101120260504B">C25B1/04</further-classification>
        <further-classification edition="202101120260504B">C25B11/052</further-classification>
        <further-classification edition="202101120260504B">C25B11/091</further-classification>
        <further-classification edition="202101120260504B">C25B11/097</further-classification>
        <further-classification edition="202101120260504B">C25B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大坪尚人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUBO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原国豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, GUOHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮圓権</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, YUANQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之複合體包含鉬化合物、第1金屬（PM）及第2金屬（M）。上述第1金屬（PM）為鉑、或鉑與鈀之組合，上述第2金屬（M）為選自由金屬所組成之群中之1種或2種以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1331" publication-number="202632149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>泵</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">F04D29/44</main-classification>
        <further-classification edition="200601120260430B">F04D29/24</further-classification>
        <further-classification edition="200601120260430B">F04D29/30</further-classification>
        <further-classification edition="200601120260430B">F04D29/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本俊治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TOSHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村正邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MASAKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩井優介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的泵具備有罩殼及葉輪，葉輪具備有覆蓋葉片部(710)之第1護罩(shroud)(720)。在罩殼形成有溝部(312)與內側壁部(313)，前述溝部(312)供第1護罩(720)的吸入口吸嘴部(722)的前端(722a)插入，前述內側壁部(313)位於比溝部(312)更靠近內周側。在罩殼與第1護罩(720)之間，形成有在內周側具有迷宮構造(361)的返回路徑(360)，前述迷宮構造(361)是以吸入口吸嘴部(722)與溝部(312)形成。在第1護罩(720)形成有延伸部(726)，前述延伸部(726)具有與內側壁部(313)的軸方向上的葉片部(710)側的端面(313a)相向之相向面(726a)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">312:溝部</p>
        <p type="p">313:內側壁部</p>
        <p type="p">313a:端面</p>
        <p type="p">314:突部</p>
        <p type="p">314a:外側面</p>
        <p type="p">314b:內側面</p>
        <p type="p">350:渦捲部</p>
        <p type="p">360:返回路徑</p>
        <p type="p">360a:導入口</p>
        <p type="p">360b:吐出口</p>
        <p type="p">361,362:迷宮構造</p>
        <p type="p">710:葉片部</p>
        <p type="p">720:前表面護罩(第1護罩)</p>
        <p type="p">722:圓筒部(吸入口吸嘴部)</p>
        <p type="p">722a:前端(先端)</p>
        <p type="p">725:後表面</p>
        <p type="p">726:延伸部</p>
        <p type="p">726a:相向面</p>
        <p type="p">726b:內表面</p>
        <p type="p">727:缺口</p>
        <p type="p">727a:面</p>
        <p type="p">730:後表面護罩(第2護罩)</p>
        <p type="p">730a:貫通孔</p>
        <p type="p">731:內周側端部</p>
        <p type="p">732:外周側端部</p>
        <p type="p">733:前表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1332" publication-number="202631906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性粒子、導電材料及連接構造體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08L101/12</main-classification>
        <further-classification edition="200601120260424B">C09J9/02</further-classification>
        <further-classification edition="200601120260424B">H01B5/16</further-classification>
        <further-classification edition="200601120260424B">H01B1/20</further-classification>
        <further-classification edition="200601120260424B">H01B1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保厚喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, ATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林拓矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久永聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISANAGA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI,MINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高耐酸性之導電性粒子。  &lt;br/&gt;本發明之導電性粒子具備基材粒子、及配置於上述基材粒子之表面上之導電層，上述導電層包含鎳及鈷，自上述導電層之外表面朝向內側為厚度1/2之外表面側之區域100重量%中之鈷之平均含量多於自上述導電層之內表面朝向外側為厚度1/2之內表面側之區域100重量%中之鈷之平均含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1333" publication-number="202631966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>源自植物之異烷烴組合物之製造方法、異烷烴組合物、化妝品之製造方法及化妝品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C10G3/00</main-classification>
        <further-classification edition="200601120260504B">A61K8/31</further-classification>
        <further-classification edition="200601120260504B">A61Q1/00</further-classification>
        <further-classification edition="200601120260504B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤佳織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>社本潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAMOTO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮫島佳奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMEJIMA, KANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島智哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種源自植物之異烷烴組合物之製造方法，其包括對由源自植物之醇製造之含異烷烴液體進行蒸餾之蒸餾步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1334" publication-number="202633456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有貫通電極之基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10W70/02</main-classification>
        <further-classification edition="202601120260421B">H10W70/63</further-classification>
        <further-classification edition="200601120260421B">C23C16/00</further-classification>
        <further-classification edition="202601120260421B">H10P72/70</further-classification>
        <further-classification edition="200601120260421B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種具有貫通電極之基板的製造方法，其包含：  &lt;br/&gt;　　自基板之一面側，將具有第1支持基材與第1金屬層之第1積層體，以前述第1金屬層位於前述基板側的方式，貼合至前述基板後，將前述第1支持基材自前述第1金屬層剝離的第1步驟、  &lt;br/&gt;　　於貼合有前述第1金屬層之前述基板形成貫通前述第1金屬層及前述基板之貫通孔的第2步驟、  &lt;br/&gt;　　自形成有前述貫通孔之前述基板之另一面側，將具有第2支持基材與第2金屬層之第2積層體，以前述第2金屬層位於前述基板側的方式，貼合至前述基板的第3步驟、與  &lt;br/&gt;　　將前述第2金屬層作為陰極進行電解電鍍，將金屬填充於前述貫通孔的第4步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:第1接著樹脂層</p>
        <p type="p">3:第2接著樹脂層</p>
        <p type="p">12:第1金屬層</p>
        <p type="p">23:鍍層</p>
        <p type="p">31:貫通通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1335" publication-number="202633439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於黏合膜表面活化的紫外線固化技術</chinese-title>
        <english-title>UV CURE TECHNOLOGY FOR BONDING FILM SURFACE ACTIVATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W29/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧欣儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑米森　莫妮卡哈利姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAMIESON, MONIKA HALIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎　紀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, CHI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LI-QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處描述的實施例一般與後端連線先進封裝組裝的製程有關。更具體地說，此處描述的實施例與活化矽表面以用於親水性矽直接接合應用的製程有關。在至少一個實施例中，提供了一種活化基板的方法。該方法包括以下步驟：將基板放入處理腔室，該基板包括複數個圖案結構、至少一層金屬層及矽表面，並固化基板的矽表面。固化製程包括將一或多種氣體流入處理腔室，一或多種氣體包括臭氧，並在約25°C至約300°C的溫度下提供UV光並操作處理腔室。從臭氧中形成複數個氧自由基，並與基板的矽表面反應，以形成活化表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein generally relate to processes for back end of line advanced packaging assembly. More particularly, embodiments described herein relate to processes for activating silicon surfaces for hydrophilic silicon direct bonding applications. In at least one embodiment, a method for activating a substrate is provided. The method includes providing a substrate into a process chamber, the substrate including a plurality of patterned structures, at least one metal layer and a silicon surface, and curing the silicon surface of the substrate. The curing process includes flowing one or more gases into the process chamber, the one or more gases including ozone, and providing UV light while operating the process chamber at a temperature of about 25 °C to about 300 °C. A plurality of oxygen radicals are formed from the ozone and reacted with the silicon surface of the substrate to form an activated surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:操作</p>
        <p type="p">304:操作</p>
        <p type="p">306:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1336" publication-number="202633341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送機器人</chinese-title>
        <english-title>SUBSTRATE TRANSFER ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P72/30</main-classification>
        <further-classification edition="200601120260427B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹治彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, HARUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丸亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMARU, RYOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板搬送機器人具備：手部、固定支持部、可動支持部、驅動部、力覺感測器、及控制部。固定支持部係抵接於手部所保持的工件。可動支持部係在手部中與固定支持部一起夾持並保持工件。驅動部係使可動支持部移動。力覺感測器係偵測施加於可動支持部的力。控制部係根據力覺感測器之偵測結果，控制驅動部所致之可動支持部的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The substrate transfer robot of this invention includes a hand, a fixed support unit, a movable support unit, a drive unit, a force sensor, and a control unit. The fixed support unit abuts against a workpiece held by the hand. The movable support unit, together with the fixed support unit, clamps and holds the workpiece in the hand. The drive unit moves the movable support unit. The force sensor detects the force applied to the movable support unit. The control unit controls the movement of the movable support unit by the drive unit based on the detection results of the force sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:手部</p>
        <p type="p">31:葉片構件</p>
        <p type="p">31a:載置面</p>
        <p type="p">32:手部基座部</p>
        <p type="p">33,34:固定支持部</p>
        <p type="p">35:可動支持部</p>
        <p type="p">36:驅動部</p>
        <p type="p">36a:馬達</p>
        <p type="p">36b:驅動裝置</p>
        <p type="p">36c:直線移動機構</p>
        <p type="p">50:力覺感測器</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1337" publication-number="202632744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及溫度控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01J37/32</main-classification>
        <further-classification edition="200601120260427B">H05H1/46</further-classification>
        <further-classification edition="202601120260427B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商理化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RKC INSTRUMENT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐卓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村啓佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木原健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIHARA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成田貴光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARITA, TAKAMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川智彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示之基板處理裝置包含溫度控制對象之構件、該構件用之加熱機構、該構件用之冷卻機構、溫度感測器、及溫度控制部。溫度控制部包含PID運算部、前饋控制部及合成部。PID運算部構成為根據由溫度感測器獲取之構件之溫度測定值與構件之溫度設定值之間的誤差，藉由PID運算而獲取第1操作量。前饋控制部構成為特定出第2操作量，該第2操作量與向構件之干擾熱輸入量相對應。合成部構成為向加熱機構及/或冷卻機構輸出合成操作量，該合成操作量係藉由將第1操作量與第2操作量合成而獲得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:控制部</p>
        <p type="p">50c:加熱器控制器</p>
        <p type="p">51c:流量控制器</p>
        <p type="p">52:溫度感測器</p>
        <p type="p">54:壓力感測器</p>
        <p type="p">60:溫度控制部</p>
        <p type="p">61:減法運算部</p>
        <p type="p">62:PID運算部</p>
        <p type="p">63:前饋控制部</p>
        <p type="p">64:記憶部</p>
        <p type="p">65:合成部</p>
        <p type="p">65a:加法運算部</p>
        <p type="p">65b:分配部</p>
        <p type="p">66:乘法運算部</p>
        <p type="p">67:乘法運算部</p>
        <p type="p">C&lt;sub&gt;A&lt;/sub&gt;:第2控制量</p>
        <p type="p">C&lt;sub&gt;H&lt;/sub&gt;:第1控制量</p>
        <p type="p">e&lt;sub&gt;r&lt;/sub&gt;:誤差</p>
        <p type="p">P&lt;sub&gt;M&lt;/sub&gt;:測定值</p>
        <p type="p">T&lt;sub&gt;M&lt;/sub&gt;:溫度測定值</p>
        <p type="p">T&lt;sub&gt;S&lt;/sub&gt;:溫度設定值</p>
        <p type="p">u&lt;sub&gt;C&lt;/sub&gt;:合成操作量</p>
        <p type="p">u&lt;sub&gt;MV&lt;/sub&gt;:第1操作量</p>
        <p type="p">△&lt;sub&gt;MV&lt;/sub&gt;:第2操作量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1338" publication-number="202632768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二次電池電極用分散液組、碳奈米管分散液、纖維體分散液、二次電池電極用分散液、二次電池電極用漿料組成物、二次電池用電極及二次電池，以及二次電池電極用分散液的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">H01M10/0566</main-classification>
        <further-classification edition="200601120260504B">H01M4/02</further-classification>
        <further-classification edition="200601120260504B">H01M4/04</further-classification>
        <further-classification edition="201001120260504B">H01M4/13</further-classification>
        <further-classification edition="201001120260504B">H01M4/134</further-classification>
        <further-classification edition="201001120260504B">H01M4/139</further-classification>
        <further-classification edition="201001120260504B">H01M4/1395</further-classification>
        <further-classification edition="200601120260504B">H01M4/38</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古宮良一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMIYA, RYOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧洪太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於：提供能夠形成得使二次電池發揮優異之循環特性之二次電池用電極的二次電池電極用分散液組。本發明之二次電池電極用分散液組包含：含有碳奈米管1、分散劑1及溶媒1的碳奈米管分散液，以及含有纖維體及溶媒2的纖維體分散液。前述碳奈米管1的平均長度為1 μm以下，前述纖維體的平均長度為前述碳奈米管1的平均長度之1.5倍以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1339" publication-number="202631490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二次電池電極用組成物組、第１組成物、第２組成物、二次電池電極用組成物１、二次電池電極用組成物２、二次電池電極用組成物３、二次電池用電極及二次電池，以及二次電池電極用組成物的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260504B">C01B32/158</main-classification>
        <further-classification edition="200601120260504B">H01M4/02</further-classification>
        <further-classification edition="201001120260504B">H01M4/13</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古宮良一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMIYA, RYOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧洪太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供能夠形成得使二次電池發揮優異之循環特性之二次電池用電極的二次電池電極用組成物組。本發明之二次電池電極用組成物組包含：含有碳奈米管1的第1組成物與含有碳奈米管2的第2組成物。前述碳奈米管1的G／D比為4以下，前述碳奈米管2的G／D比較前述碳奈米管1的G／D比還大3以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1340" publication-number="202632110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>皮革紋路片、其製造方法及皮革紋路顯示構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">D06N3/00</main-classification>
        <further-classification edition="200601120260428B">D06N3/14</further-classification>
        <further-classification edition="201701120260428B">B60Q3/00</further-classification>
        <further-classification edition="201901120260428B">B29C48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帝人可多麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIJIN CORDLEY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田貢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, MITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種皮革紋路片，係主要由熱塑性聚胺基甲酸酯所構成，且含有熱分解溫度為220℃以上之透明粒子，可使用於具有複雜形狀之各種家電製品或汽車之指示燈等之顯示面板之皮革紋路片。進一步，熱塑性聚胺基甲酸酯之可成形溫度為170℃至230℃，及透明粒子之熱分解溫度為熱塑性聚胺基甲酸酯之可成形溫度以上為較佳。又，於表面具有高度5μm至100μm之壓花紋理，單面或雙面經凹版塗佈為較佳。又，此皮革紋路片之製造方法之特徵在於塗佈熱塑性聚胺基甲酸酯而形成片狀，藉由冷卻輥進行表面加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1341" publication-number="202631974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板之處理方法、半導體裝置之製造方法及半導體裝置用處理液</chinese-title>
        <english-title>METHOD FOR PROCESSING SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C11D7/32</main-classification>
        <further-classification edition="200601120260427B">C23F1/38</further-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供包含藉由半導體裝置用處理液處理具備包含金屬氮化物之層之半導體基板的處理步驟；半導體裝置用處理液含有NH&lt;sub&gt;3&lt;/sub&gt;、防腐劑及水，防腐劑係選自由5-甲基-1H-苯並三唑、咪唑、及5-胺基-1H-四唑所構成群組中之至少1種，NH&lt;sub&gt;3&lt;/sub&gt;之含量對防腐劑之含量之質量比(NH&lt;sub&gt;3&lt;/sub&gt;/防腐劑)為5~60之半導體基板之處理方法、半導體裝置之製造方法、及可用於此等之半導體裝置用處理液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:金屬配線層</p>
        <p type="p">30:蝕刻停止層</p>
        <p type="p">50:氮化鉭膜(TaN膜)</p>
        <p type="p">60:硬遮罩層(HM層)</p>
        <p type="p">70:殘渣</p>
        <p type="p">100:半導體元件(半導體基板)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1342" publication-number="202631730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經鐵催化之表面聚合物之形成</chinese-title>
        <english-title>IRON-CATALYZED SURFACE POLYMER FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F4/40</main-classification>
        <further-classification edition="200601120260504B">C08F120/14</further-classification>
        <further-classification edition="200601120260504B">C08F120/20</further-classification>
        <further-classification edition="200601120260504B">C08F120/28</further-classification>
        <further-classification edition="200601120260504B">C09D4/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼古拉森　雅各　帕格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKOLAJSEN, JAKOB PAGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格加德　阿斯格　霍爾姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGERGAARD, ASGER HOLM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達爾　喬伊德布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDAL, JOYDEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利勒索魯普　米　布洛姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LILLETHORUP, MIE BLOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於鐵（Fe）催化劑及其在表面聚合物之形成中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to iron (Fe) catalysts and their use in surface polymer formations.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1343" publication-number="202632406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括一或多個連續間隔壁之光調變器</chinese-title>
        <english-title>LIGHT MODULATOR COMPRISING ONE OR MORE CONTINUOUS SPACER WALLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260417B">G02F1/167</main-classification>
        <further-classification edition="200601120260417B">G02F1/1339</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商艾爾星動力學專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSTAR DYNAMICS PATENTS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬薩德　羅馬利克　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASSARD, ROMARIC MATHIEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米蒂奧盧　阿納托利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITIOGLU, ANATOLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例係關於一種光調變器。該光調變器包括跨第一基板及第二基板延伸之一或多個連續間隔壁。該一或多個連續間隔壁界定該第一基板與該第二基板之間的光學層之一間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments are directed to a light modulator. The light modulator comprises one or more continuous spacer walls extending across the first substrate and the second substrate. The one or more continuous spacer walls define a gap of the optical layer between the first substrate and the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光調變器</p>
        <p type="p">11:第一基板/基板</p>
        <p type="p">12:第二基板/底部基板</p>
        <p type="p">17:光學層</p>
        <p type="p">18.1:間隔壁/半體/第一半體/第一間隔壁</p>
        <p type="p">18.2:間隔壁/半體/第一半體/第二間隔壁</p>
        <p type="p">71:間隔壁之寬度</p>
        <p type="p">72:間隔壁之高度/總高度</p>
        <p type="p">72’:光學層之間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1344" publication-number="202631996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可抑制或阻礙ＰＤ－１蛋白質或ＣＴＬＡ－４蛋白質之表現的反義寡核苷酸</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">C12N15/113</main-classification>
        <further-classification edition="201001120260504B">C12N5/078</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="202501120260504B">A61K35/17</further-classification>
        <further-classification edition="201501120260504B">A61K35/28</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P31/00</further-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人　川崎學園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI GAKUEN EDUCATIONAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商庫洛巴拿股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOVERNA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤達男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>子
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEI, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野修也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, SHUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水由梨香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YURIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHI, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供可暫時阻礙PD-1或CTLA-4蛋白質之表現的手段等。本發明係有關於可與PD-1(Programmed Cell Death 1)蛋白質或CTLA-4(Cytotoxic T-lymphocyte Antigen-4)蛋白質之mRNA前驅物及/或成熟mRNA之核酸序列進行雜交，而抑制或阻礙PD-1蛋白質或CTLA-4蛋白質之表現的反義寡核苷酸等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1345" publication-number="202633173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202601120260424B">H10D88/00</further-classification>
        <further-classification edition="202601120260424B">H10B80/00</further-classification>
        <further-classification edition="200601120260424B">G11C8/08</further-classification>
        <further-classification edition="200601120260424B">G11C8/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔珍銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIN MYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, DONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹敏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, MINSEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀井秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORII, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露半導體裝置，包括基底、在基底上沿第一方向延伸的位元線、在位元線上並沿與第一方向相交的第二方向延伸的模製結構、在位元線的頂表面和模製結構的側表面上的垂直半導體圖案、與模製結構間隔開並面向垂直半導體圖案且沿與位元線相交的第二方向延伸的閘極電極、以及在垂直半導體圖案上的節點接觸件。垂直半導體圖案包括依序在位元線上的第一部分、第二部分、以及第三部分。第二部分從模製結構的側表面突出的距離比第一部分和第三部分從側表面突出的距離更多。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a semiconductor device comprising a substrate, a bit line that extends in a first direction on the substrate, a mold structure on the bit line and extending in a second direction that intersects the first direction, a vertical semiconductor pattern on a top surface of the bit line and a lateral surface of the mold structure, a gate electrode spaced apart from the mold structure and facing the vertical semiconductor pattern and extending in the second direction that intersects the bit line, and a node contact on the vertical semiconductor pattern. The vertical semiconductor pattern comprises a first part, a second part, and a third part that are sequentially on the bit line. A distance that the second part protrudes from the lateral surface of the mold structure is more than a distance that the first part and the third part protrude from the lateral surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一下部介電圖案</p>
        <p type="p">141:第一氧化物半導體圖案</p>
        <p type="p">142:第二氧化物半導體圖案</p>
        <p type="p">A-A’、B-B’:線</p>
        <p type="p">BL:位元線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">GI:閘極介電圖案</p>
        <p type="p">LP:著陸墊</p>
        <p type="p">MS:模製結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1346" publication-number="202633362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合片、接合片之使用方法、以及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/70</main-classification>
        <further-classification edition="201801120260423B">C09J7/38</further-classification>
        <further-classification edition="201801120260423B">C09J7/25</further-classification>
        <further-classification edition="200601120260423B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岸正憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGISHI, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐畑朋佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIHATA, TOMOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種接合片，係具備：基材、以及設置於前述基材之一面上的黏著劑層；前述接合片之波長1600nm之紅外線的穿透率為80%以上；使用作為矽晶片、前述黏著劑層之能量線照射物、以及前述基材之積層物的試驗片而測定之前述黏著劑層之能量線照射物與前述矽晶片之間的剝離力為5N以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基材</p>
        <p type="p">11a:一面</p>
        <p type="p">11b:第二面</p>
        <p type="p">12:黏著劑層</p>
        <p type="p">12a:第一面</p>
        <p type="p">15:剝離膜</p>
        <p type="p">101:接合片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1347" publication-number="202631373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層成形系統</chinese-title>
        <english-title>LAMINATE MANUFACTURING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">B30B15/34</main-classification>
        <further-classification edition="200601120260416B">B29C43/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本隆幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井岳志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">以往的積層成形系統存在有需要較多設置空間之問題。  &lt;br/&gt;本發明之積層成形系統具備有：一對載體薄膜，其將被積層體從一側搬送至另一側；薄膜放捲裝置，其將載體薄膜放捲；積層成形裝置，其被配置於薄膜放捲裝置之另一側，且於內部被減壓之腔室中藉由加壓機構而對被積層體加壓；以及薄膜收捲裝置，其被配置於積層成形裝置之另一側，且將載體薄膜收捲；用以將腔室的上述內部減壓之真空泵被配置於薄膜放捲裝置之下側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層成形系統</p>
        <p type="p">10:薄膜放捲裝置</p>
        <p type="p">11:真空積層裝置</p>
        <p type="p">12、13:平坦化壓機裝置</p>
        <p type="p">14:薄膜收捲裝置</p>
        <p type="p">15:真空泵</p>
        <p type="p">15B:排氣管</p>
        <p type="p">16:收納箱</p>
        <p type="p">16A:排氣管</p>
        <p type="p">F:載體薄膜</p>
        <p type="p">L:機架</p>
        <p type="p">S:被積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1348" publication-number="202633219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138948</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢光體基板、發光裝置及照明裝置</chinese-title>
        <english-title>PHOSPHOR SUBSTRATE, LIGHT-EMITTING DEVICE AND LIGHTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10H20/851</main-classification>
        <further-classification edition="202501120260421B">H10H20/857</further-classification>
        <further-classification edition="200601120260421B">F21V19/00</further-classification>
        <further-classification edition="201801120260421B">F21V9/32</further-classification>
        <further-classification edition="200601120260421B">H05K1/03</further-classification>
        <further-classification edition="201601320260421B">F21Y105/16</further-classification>
        <further-classification edition="201601320260421B">F21Y107/70</further-classification>
        <further-classification edition="201601320260421B">F21Y115/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種螢光體基板(30)，其係搭載有發光元件(20)，該螢光體基板(30)具有：具有可撓性之基板(基板(40))；及設置於前述基板(基板(40))的搭載有前述發光元件(20)之面之螢光體層(36)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phosphor substrate (30) on which a light emitting element (20) is mounted, wherein the phosphor substrate (30) has a flexible substrate (a substrate (40)) and a phosphor layer (36) provided on the surface of the substrate (the substrate (40)) on which the light emitting element (20) is mounted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:照明裝置</p>
        <p type="p">2:殼體</p>
        <p type="p">3:蓋殼</p>
        <p type="p">10:發光裝置</p>
        <p type="p">20:發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1349" publication-number="202633220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢光體基板及發光裝置</chinese-title>
        <english-title>PHOSPHOR SUBSTRATE AND LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10H20/851</main-classification>
        <further-classification edition="201601120260421B">F21S2/00</further-classification>
        <further-classification edition="201801120260421B">F21V9/32</further-classification>
        <further-classification edition="200601120260421B">H05K3/28</further-classification>
        <further-classification edition="201601320260421B">F21Y115/10</further-classification>
        <further-classification edition="201601320260421B">F21Y115/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種螢光體基板(30)，其係搭載有複數個發光元件(20)，前述螢光體基板(30)具有：絕緣基板(40)；電路圖案層(34)(第1電路圖案層(42))，係設置於前述絕緣基板(40)並且與前述發光元件(20)連接；螢光體層(36)，係設置於前述絕緣基板(40)並且覆蓋前述電路圖案層(34)(第1電路圖案層(42))中的至少一部分；及溝槽(38)(凹部或狹縫)，係設置於前述螢光體層(36)並且在安裝有相鄰之前述發光元件(20)之區域之間延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phosphor substrate (30), on which a plurality of light emitting elements (20) are mounted, wherein the phosphor substrate (30) has an insulating substrate (40), a circuit pattern layer (34) (a first circuit pattern layer (42)) which is provided on the insulating substrate (40) and to which the light emitting elements (20) are connected, a phosphor layer (36) which is provided on the insulating substrate (40) and at least partially covers the circuit pattern layer (34) (the first circuit pattern layer (42)), and grooves (38) (recesses or slits) which are provided in the phosphor layer (36) and extend between the regions where adjacent light emitting elements (20) are mounted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光裝置</p>
        <p type="p">20:發光元件</p>
        <p type="p">22:LED</p>
        <p type="p">24:密封層</p>
        <p type="p">30:螢光體基板</p>
        <p type="p">32:表面</p>
        <p type="p">33:背面</p>
        <p type="p">34:電路圖案層</p>
        <p type="p">34A:電極對</p>
        <p type="p">34B:配線部分</p>
        <p type="p">36:螢光體層</p>
        <p type="p">38:溝槽(凹部，狹縫)</p>
        <p type="p">40:絕緣基板</p>
        <p type="p">40a:表面</p>
        <p type="p">40b:背面</p>
        <p type="p">42:第1電路圖案層</p>
        <p type="p">42a:表面</p>
        <p type="p">43:第2電路圖案層</p>
        <p type="p">SP:銲錫膏</p>
        <p type="p">T1~T4:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1350" publication-number="202633127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有含氮氧化物的源極/汲極通道界面</chinese-title>
        <english-title>SOURCE/DRAIN CHANNEL INTERFACE WITH NITROGEN-CONTAINING OXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260422B">H10D30/67</main-classification>
        <further-classification edition="202501120260422B">H10D62/85</further-classification>
        <further-classification edition="202501120260422B">H10D64/60</further-classification>
        <further-classification edition="202501120260422B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商齊耐特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINITE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴萊吉　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARLAGE, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曉泰　傑姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOUTE, GEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示例薄膜電晶體包括包括源極材料主體的源極、包括汲極材料主體的汲極、閘極，及位於該源極與該汲極之間的半導體通道材料主體。該半導體通道材料主體包括金屬氧化物。該薄膜電晶體進一步包括位於該源極材料主體與該半導體通道材料主體之間的源極-通道界面。該源極-通道界面包括含氮金屬氧化物。可提供類似或相同的汲極-通道界面。該含氮金屬氧化物可利用電漿形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example thin-film transistor includes a source including a body of source material, a drain including a body of drain material, a gate, and a body of semiconductor channel material between the source and the drain. The body of semiconductor channel material includes a metal oxide. The thin-film transistor further includes a source-channel interface between the body of source material and the body of semiconductor channel material. The source-channel interface includes a nitrogen-containing metal oxide. A similar or identical drain-channel interface may be provided. The nitrogen-containing metal oxide may be formed using plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:TFT</p>
        <p type="p">12:源極</p>
        <p type="p">14:汲極</p>
        <p type="p">16:閘極</p>
        <p type="p">20:基板</p>
        <p type="p">22:黏附層</p>
        <p type="p">30:源極材料</p>
        <p type="p">32:汲極材料</p>
        <p type="p">40:源極-通道界面</p>
        <p type="p">42:汲極-通道界面</p>
        <p type="p">50:通道材料</p>
        <p type="p">52:閘極介電材料</p>
        <p type="p">54:閘極材料</p>
        <p type="p">60:源極電極</p>
        <p type="p">62:汲極電極</p>
        <p type="p">66:閘極介電材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1351" publication-number="202631192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿茲海默症之治療及預防方法</chinese-title>
        <english-title>METHODS OF TREATMENT AND PREVENTION OF ALZHEIMER'S DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K39/395</main-classification>
        <further-classification edition="200601120260429B">C07K16/18</further-classification>
        <further-classification edition="200601120260429B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商衛材Ｒ＆Ｄ企管股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EISAI R&amp;D MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路思曼　喬翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTHMAN, JOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史旺森　查德　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, CHAD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達哈達　薩布哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHADDA, SHOBHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　金平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡莫　琳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAMER, LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供減少患有早期阿茲海默症之個體之臨床衰退的方法；將患有早期阿茲海默症之澱粉狀蛋白陽性個體轉變成澱粉狀蛋白陰性之方法；降低個體之腦澱粉狀蛋白量之方法；及預防阿茲海默症之方法，該等方法包含投與包含治療有效量之至少一種抗Aβ基原纖維(protofibril)抗體的組合物。在一些實施例中，該個體呈ApoE4陽性。在一些實施例中，該至少一種抗Aβ基原纖維抗體為BAN2401。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of reducing clinical decline in a subject having early Alzheimer's disease, methods of converting an amyloid positive subject having early Alzheimer's disease to amyloid negative, methods of reducing brain amyloid level in a subject, and methods of preventing Alzheimer's disease, the methods comprising administering a composition comprising a therapeutically effective amount of at least one anti-Aβ protofibril antibody. In some embodiments, the subject is ApoE4-positive. In some embodiments, the at least one anti-Aβ protofibril antibody is BAN2401.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1352" publication-number="202631594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>甲狀腺刺激激素受體（ＴＳＨＲ）拮抗劑及其用途</chinese-title>
        <english-title>THYROID STIMULATING HORMONE RECEPTOR (TSHR) ANTAGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D401/04</main-classification>
        <further-classification edition="200601120260504B">C07D401/14</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">C07D413/04</further-classification>
        <further-classification edition="200601120260504B">C07D417/04</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07D471/04</further-classification>
        <further-classification edition="200601120260504B">C07D405/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/4709</further-classification>
        <further-classification edition="200601120260504B">A61K31/497</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/4745</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61K31/4439</further-classification>
        <further-classification edition="200601120260504B">A61P5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商克林提克斯醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRINETICS PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷根　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGAN, COLLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史戚克雷恩茲　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHKERYANTZ, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了為甲狀腺刺激激素受體(TSHR)拮抗劑的化合物、製備此類化合物的方法、包含此類化合物的藥物組合物和藥物、以及使用此類化合物治療將受益於TSHR活性調節的病症、疾病或障礙的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1353" publication-number="202631833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G79/04</main-classification>
        <further-classification edition="200601120260424B">C08L85/02</further-classification>
        <further-classification edition="200601120260424B">C08K5/14</further-classification>
        <further-classification edition="200601120260424B">C08K3/36</further-classification>
        <further-classification edition="200601120260424B">H05K1/03</further-classification>
        <further-classification edition="200601120260424B">C08J5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田原正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAWARA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀将太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤尚人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種成為硬化物時，會達成阻燃性，同時為低介電，且為低翹曲之樹脂組成物、以及硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及、半導體裝置。  &lt;br/&gt;本發明之解決手段係為：本揭示之樹脂組成物，包含式(I)表示之化合物(A)及熱固性化合物(B)，熱固性化合物(B)包含式(M1)表示之化合物，相對於樹脂組成物中之樹脂固體成分100質量份，化合物(A)之含量為2~20質量份。  &lt;br/&gt;&lt;img align="absmiddle" height="283px" width="462px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1354" publication-number="202631353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B25J13/06</main-classification>
        <further-classification edition="200601120260422B">B25J13/08</further-classification>
        <further-classification edition="200601120260422B">B25J9/16</further-classification>
        <further-classification edition="200601120260422B">B23K37/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商達誼恆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIHEN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤澤祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJISAWA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川慎一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供機器人控制系統，能夠減輕作業者的負擔。控制裝置（20）具備：接受部（21），接受與作為臨時示教點的粗略示教點相關的粗略示教指示；蓄積部（22），根據粗略示教指示的接受而蓄積粗略示教點的示教資料；以及控制部（24），使用使機器人（10）的感測器執行以粗略示教點為基準的感測的感測結果，來確定與粗略示教點對應的感測示教點。蓄積部（22）蓄積感測示教點的示教資料。控制部（24）使用感測示教點來控制機器人（10）。這樣，能夠減輕作業者的示教時的負擔，並且能夠使用感測示教點使機器人（10）更高精度地動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工件</p>
        <p type="p">10:機器人</p>
        <p type="p">11:機器人主體</p>
        <p type="p">12:末端執行器</p>
        <p type="p">12a:按鈕</p>
        <p type="p">20:控制裝置</p>
        <p type="p">21:接受部</p>
        <p type="p">22:蓄積部</p>
        <p type="p">23:存儲部</p>
        <p type="p">24:控制部</p>
        <p type="p">30:示教器</p>
        <p type="p">100:機器人控制系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1355" publication-number="202633139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在半導體裝置中降低接觸電阻率用的半導體裝置及方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS TO REDUCE CONTACT RESISTIVITY IN SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D64/01</main-classification>
        <further-classification edition="202501120260424B">H10D64/60</further-classification>
        <further-classification edition="202501120260424B">H10D64/64</further-classification>
        <further-classification edition="202501120260424B">H10D64/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻沙羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐久間隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUMA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置及方法實施例，用於降低半導體裝置中使用的接觸結構的電阻率。在所揭露的實施例中，使用改善的矽化製程來降低上方金屬塞部和下方含矽層之間的接觸電阻率。改善的矽化製程藉由在阻障金屬矽化物上沉積較厚金屬層之前在下方含矽層上形成薄的阻障金屬矽化物，以及加熱從而在阻障金屬矽化物上形成第二金屬矽化物來降低接觸電阻率。阻障金屬矽化物和第二金屬矽化物的組合在上方金屬塞部和下方含矽層之間提供金屬矽化物-半導體接觸部，具有降低的接觸電阻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of semiconductor devices and methods are provided for reducing the resistivity of contact structures used in semiconductor devices. In the disclosed embodiments, an improved silicidation process is used to reduce the contact resistivity between an overlying metal plug and an underlying silicon-containing layer. The improved silicidation process reduces contact resistivity by forming a thin barrier metal silicide on an underlying silicon-containing layer before a thicker metal layer is deposited onto the barrier metal silicide and heated to form a second metal silicide above the barrier metal silicide. The combination of the barrier metal silicide and the second metal silicide provides a metal silicide-to-semiconductor contact between the overlying metal plug and the underlying silicon-containing layer with reduced contact resistivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:矽化製程</p>
        <p type="p">305:半導體材料</p>
        <p type="p">310:氧化物</p>
        <p type="p">315:金屬層</p>
        <p type="p">320:金屬矽化物</p>
        <p type="p">330:金屬層</p>
        <p type="p">335:金屬矽化物</p>
        <p type="p">337:金屬氮化物層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1356" publication-number="202631223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於包括化學、生物、放射學及核子（CBRN）污染物之氣溶膠與蒸氣之無面罩呼吸及眼睛防護裝置</chinese-title>
        <english-title>MASKLESS RESPIRATORY AND EYE PROTECTION DEVICE FOR AEROSOLS AND VAPORS INCLUDING CHEMICAL, BIOLOGICAL, RADIOLOGICAL, AND NUCLEAR (CBRN) CONTAMINANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">A62B7/10</main-classification>
        <further-classification edition="200601120260421B">A62B18/02</further-classification>
        <further-classification edition="200601120260421B">A62B23/02</further-classification>
        <further-classification edition="200601120260421B">A62B9/00</further-classification>
        <further-classification edition="200601120260421B">A62B31/00</further-classification>
        <further-classification edition="200601120260421B">A41D13/11</further-classification>
        <further-classification edition="202101120260421B">A42B1/018</further-classification>
        <further-classification edition="200601120260421B">A61L9/16</further-classification>
        <further-classification edition="202201120260421B">B01D46/56</further-classification>
        <further-classification edition="200601120260421B">B01D46/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商病患知能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIENT KNOWHOW, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里克里希納　德瓦巴克圖尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIKRISHNA, DEVABHAKTUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種呼吸及眼睛防護裝置，其具有至少一個過濾器及至少一個軸流風扇。該最少一個過濾器係裝配成對具有約0.3微米之尺寸的粒子達到50%或更高之氣溶膠狀粒子污染物過濾效率，及係裝配成對下列之一或多種達到50%或更高的蒸氣污染物過濾效率：諾維喬克(Novichok)神經毒劑(A232)、增稠毒性神經性毒劑(TVX)、硫芥子劑(HD)、增稠硫芥子劑(THD)、索曼神經毒劑(GD)及沙林神經毒劑(GB)。在該呼吸及眼睛防護裝置之操作及監測期間，當偵測到選擇的氣溶膠化學、生物、放射學及核子(CBRN)作用劑之濃度時，啟動該至少一個風扇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A respiratory and eye protection device having at least one filter and at least one axial fan. The least one filter is configured to achieve an aerosolized particle contamination filtration efficiency of 50% or greater for particles having a size of about 0.3 µm and configured to achieve a vapor contamination filtration efficiency of 50% or greater for one or more of Novichok nerve agent (A232), thickened venomous nerve agent (TVX), sulfur mustard agent (HD), thickened sulfur mustard agent (THD), soman nerve agent (GD), and sarin nerve agent (GB). During the operation and monitoring of the respiratory and eye protection device, at least one fan is activated when concentrations of select aerosolized chemical, biological, radiological, and nuclear (CBRN) agents are detected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1357" publication-number="202631450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝組</chinese-title>
        <english-title>Mounting Set</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260421B">B62M9/125</main-classification>
        <further-classification edition="200601120260421B">B62K25/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商矢倫德國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM DEUTSCHLAND GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊特　亨利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAEDT, HENRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海納　塞巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEYNA, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出了將自行車變速器連接到自行車車架的車架眼或後叉端的各種解決方案。根據本發明的第一方面，使用了一種帶有固持螺栓的安裝元件。該安裝元件配置有插入鞘。根據本發明，插入鞘和固持螺栓的至少一個元件配置有至少一個適於此目的的卡合結構，連同與插入鞘和固持螺栓分開的至少一個反卡合元件或與插入鞘和固持螺栓的各自其他元件分開的反卡合結構，以產生彈性卡入式固持連接或卡口式固持鎖定，實現插入鞘和固持螺栓之間的形狀配合式固持卡合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various solutions are proposed for connecting a bicycle derailleur to the frame eye or dropout of a bicycle frame. According to a first aspect of the invention, a mounting element with a retaining bolt is used. The mounting element is configured with an insertion sheath. According to the invention, at least one element of the insertion sheath (20) and the retaining bolt (22) is configured with at least one engagement formation (34) adapted for this purpose, together with at least one counter-engaging element (32), which is separate from the insertion sheath and the retaining bolt, or a counter-engaging formation (52) of the respective other element from the insertion sheath and the retaining bolt, to produce an elastic snap-in retaining connection or a bayonet-type retaining lock, which realizes a positive retaining engagement between the insertion sheath (20) and the retaining bolt (22).</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:UDH安裝元件；變速器吊架</p>
        <p type="p">18:UDH底板；底板；變速器吊架底板</p>
        <p type="p">20:UDH套筒；B轉向節(基礎元件)</p>
        <p type="p">22:UDH螺栓；軸螺栓</p>
        <p type="p">32:O形環</p>
        <p type="p">34:凹槽；定位凹槽；凹入部</p>
        <p type="p">38,40:六邊形輪廓</p>
        <p type="p">44:止動面由</p>
        <p type="p">46:安裝口；螺紋孔</p>
        <p type="p">48:螺紋插件</p>
        <p type="p">50:定位螺紋</p>
        <p type="p">52:定位凹槽；凹入部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1358" publication-number="202631739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非水系二次電池電極形成用材料、非水系二次電池電極用黏合劑組成物、非水系二次電池電極形成用材料之製造方法、非水系二次電池電極用組成物、導電性基材被覆用組成物、集電體、非水系二次電池電極及非水系二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/08</main-classification>
        <further-classification edition="200601120260504B">C08F220/06</further-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F257/02</further-classification>
        <further-classification edition="200601120260504B">C08F265/02</further-classification>
        <further-classification edition="200601120260504B">C08F265/06</further-classification>
        <further-classification edition="200601120260504B">C08L51/00</further-classification>
        <further-classification edition="200601120260504B">B01J13/14</further-classification>
        <further-classification edition="201001120260504B">H01M4/13</further-classification>
        <further-classification edition="200601120260504B">H01M4/36</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="200601120260504B">H01M4/66</further-classification>
        <further-classification edition="201001120260504B">H01M10/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大村亮祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMURA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種非水系二次電池電極形成用材料，其對電解液之耐久性（耐電解液性）及造膜性優異，且能夠形成充放電效率及容量維持率等電池特性優異之二次電池。本發明係一種非水系二次電池電極形成用材料，其含有具有由聚合物（a1）所構成之殼部及由聚合物（a2）所構成之核部之核殼型粒子（A）、及水性介質（B），且聚合物（a1）含有源自反應性乳化劑之結構單元、源自具有酸性基之乙烯基單體之結構單元、及源自(甲基)丙烯酸酯單體之結構單元，聚合物（a2）含有源自具有交聯性反應基之乙烯基單體之結構單元、及源自芳香族乙烯基單體之結構單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1359" publication-number="202632376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成光組合器之方法</chinese-title>
        <english-title>METHODS OF FORMING OPTICAL COMBINERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B27/00</main-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
        <further-classification edition="200601120260504B">G02B27/10</further-classification>
        <further-classification edition="200601120260504B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴尼斯二世　保羅克維思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAINESE JR., PAULO CLOVIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉娜杜斯巴茲　瑪瑞莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANADOS BAEZ, MARISSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾遜　卡梅倫羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NELSON, CAMERON ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼夏恩　安柏希南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHANT, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成一光組合器之方法，該光組合器中安置有一光導及一輸入耦合器，該方法包括：選擇一光組合器參數集，該光組合器參數集包括該輸入耦合器之一光柵週期、該光組合器之一厚寬比、該光導之一折射率以及該光組合器之一視場；計算該光組合器之一總輸入耦合效率，該總輸入耦合效率隨包含該光組合器之該視場內的一波長之一入射光的一入射角而變；以及對該光組合器參數集進行組態以最大化該光組合器之一相對輸入耦合效率，該相對輸入耦合效率經定義為藉由該光組合器之一理論效率最大值歸一化的一最小場效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an optical combiner having a light guide and an in-coupler disposed therein includes: selecting an optical combiner parameter set including a grating period of the in-coupler, a thickness-to-width ratio of the optical combiner, a refractive index of the light guide, and a field of view of the optical combiner; calculating a total in-coupling efficiency of the optical combiner as a function of an angle of incidence of an incident light comprising a wavelength within the field of view of the optical combiner; and configuring the optical combiner parameter set to maximize a relative in-coupling efficiency of the optical combiner, defined as a minimum field efficiency normalized by a theoretical efficiency maximum of the optical combiner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光組合器</p>
        <p type="p">110:輸入耦合器</p>
        <p type="p">112:週期性輸入耦合光柵結構</p>
        <p type="p">114:週期性輸入耦合凹槽</p>
        <p type="p">120:光導</p>
        <p type="p">122:後表面</p>
        <p type="p">124a:前表面</p>
        <p type="p">124b:介面</p>
        <p type="p">130:輸出耦合器</p>
        <p type="p">132:週期性輸出耦合光柵結構</p>
        <p type="p">134:週期性輸出耦合凹槽</p>
        <p type="p">150:準直光學件</p>
        <p type="p">160:源</p>
        <p type="p">200,210,220:光</p>
        <p type="p">t:厚度</p>
        <p type="p">w:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1360" publication-number="202633412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝裝置及安裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P95/00</main-classification>
        <further-classification edition="202601120260427B">H10P72/50</further-classification>
        <further-classification edition="202601120260427B">H10P72/70</further-classification>
        <further-classification edition="202601120260427B">H10W70/01</further-classification>
        <further-classification edition="202601120260427B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三原健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIHARA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晴孝志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木進平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藉由將基於圖像之定位精度高精度化且抑制因空洞所致之基板與半導體晶片之接合不良，來提高前述基板與前述半導體晶片之連接品質的安裝裝置及安裝方法。具體而言，包含：第1附件12，其載置基板α；第2附件23，其保持半導體晶片β；及相機24，其拍攝用於計測載置於第1附件12之基板α之位置、及保持於第2附件23之半導體晶片β之位置之圖像。第2附件23具有使相機24之光軸L通過之複數個相機用貫通孔23c，保持半導體晶片β之保持面23a之至少一部分向第1附件12突出。相機24構成為經由相機用貫通孔23c拍攝半導體晶片β及基板α。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:安裝裝置</p>
        <p type="p">10:載台單元</p>
        <p type="p">10a,20a,21a:固定面</p>
        <p type="p">11:加熱器</p>
        <p type="p">11a:加熱面</p>
        <p type="p">12:第1附件</p>
        <p type="p">12a,23a:保持面</p>
        <p type="p">20:拾取單元</p>
        <p type="p">21:按壓單元</p>
        <p type="p">22:相機支持部</p>
        <p type="p">23:第2附件</p>
        <p type="p">24:相機</p>
        <p type="p">25:位置計測部</p>
        <p type="p">26:吸引泵</p>
        <p type="p">Y,Z:方向</p>
        <p type="p">α:基板</p>
        <p type="p">β:半導體晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1361" publication-number="202631132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種預防或治療神經系統變性疾病的方法和藥物組合</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4458</main-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
        <further-classification edition="200601120260504B">A61P25/18</further-classification>
        <further-classification edition="200601120260504B">A61P25/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鹽野義有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIONOGI CHINA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川英訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, HIDEKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷莉妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, LINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種預防或治療神經系統變性疾病的方法和藥物組合，包括藥物組合物和組合藥物產品。本發明的方法、藥物組合、藥物組合物和組合藥物產品可用於治療和/或預防患者的神經系統變性疾病，該神經系統變性疾病優選為伴隨α-突觸核蛋白聚集的神經變性疾病，更優選為帕金森病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1362" publication-number="202632455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在質量流控制器上診斷的方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR DIAGNOSIS ON MASS FLOW CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G05D7/06</main-classification>
        <further-classification edition="202201120260504B">G01F25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＭＫＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁　軍華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JUNHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麗巴西　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>L'BASSI, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供質量流控制器及關聯方法。質量流控制器包含配置以控制流動路徑中流體的流動的控制閥以及第一及第二流量感測器。第二流量感測器包含設置在流動路徑中鄰近流量限制器的壓力感測器。控制器配置以控制控制閥的致動。控制器配置以基於藉由第一流量感測器所偵測一個或多個第一流體流量參數而判定第一質量流率，基於藉由第二流量感測器所偵測一個或多個第二流體流量參數而判定第二質量流率，基於所判定的第一質量流率而計算流量限制器的孔面積，以及比較流量限制器的標稱孔面積與所計算的孔面積，以評估第二流量感測器的狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Mass flow controllers and associated methods are provided. A mass flow controller includes a control valve configured to control flow of a fluid in a flow path and first and second flow sensors. The second flow sensor includes a pressure sensor adjacent a flow restrictor disposed in the flow path. A controller is configured to control actuation of the control valve. The controller is configured to determine a first mass flow rate based on one or more first fluid flow parameters detected by the first flow sensor, determine a second mass flow rate based on one or more second fluid flow parameters detected by the second flow sensor, calculate an orifice area of the flow restrictor based on the determined first mass flow rate, and compare a nominal orifice area of the flow restrictor with the calculated orifice area to assess a condition of the second flow sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:MFC</p>
        <p type="p">102:閥</p>
        <p type="p">104:閥</p>
        <p type="p">106:感測器</p>
        <p type="p">108:感測器</p>
        <p type="p">110:腔室</p>
        <p type="p">112:感測器</p>
        <p type="p">114:感測器</p>
        <p type="p">116:流量限制器</p>
        <p type="p">120:控制器</p>
        <p type="p">122:入口</p>
        <p type="p">124:出口</p>
        <p type="p">126:本體</p>
        <p type="p">130:流動路徑</p>
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:壓力測量值</p>
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:壓力</p>
        <p type="p">P&lt;sub&gt;d&lt;/sub&gt;:壓力測量值</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:溫度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:溫度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1363" publication-number="202631120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紫杉烷组合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/337</main-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="201701120260504B">A61K47/42</further-classification>
        <further-classification edition="200601120260504B">A61K9/08</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商珠海貝海生物技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUHAI BEIHAI BIOTECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露屬於抗腫瘤技術領域，具體地，涉及一種紫杉烷組合物及其用途。該紫杉烷組合物為包括紫杉烷的紫杉烷水性組合物，該紫杉烷水性組合物透過膀胱灌注用於治療膀胱癌個體，其具有以下至少一種特徵：（1）其中至少約5%的紫杉烷為游離的紫杉烷；（2）其中游離的紫杉烷的濃度為約0.01mg/mL至約0.8mg/mL。或，該紫杉烷水性組合物透過膀胱灌注用於治療膀胱癌患者，該紫杉烷水性組合物在施用給膀胱癌患者後，膀胱癌患者血漿中紫杉烷具有以下至少一種特徵：（1）膀胱癌患者血漿中紫杉烷的濃度至少為約0.02ng/mL；（2）膀胱癌患者血漿中紫杉烷的AUC至少為約0.02h*ng/mL。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1364" publication-number="202631781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性環脂族環氧化物</chinese-title>
        <english-title>POLYMERIC CYCLOALIPHATIC EPOXIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08G59/02</main-classification>
        <further-classification edition="200601120260428B">C08G59/34</further-classification>
        <further-classification edition="200601120260428B">C08G63/553</further-classification>
        <further-classification edition="200601120260428B">C08G63/91</further-classification>
        <further-classification edition="200601120260428B">C09D163/00</further-classification>
        <further-classification edition="200601120260428B">C09D167/06</further-classification>
        <further-classification edition="200601120260428B">B65D23/08</further-classification>
        <further-classification edition="200601120260428B">B65D65/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商阿科瑪法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARKEMA FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯奎爾斯　凱利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SQUIRES, KELLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普倫德里斯　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLENDERLEITH, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特利泰爾　蘇菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELITEL, SOFIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅萊克　皮埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELEC, PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUNG, HANNAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種聚合性環脂族環氧化物、此聚合性環脂族環氧化物之前驅物、包括此聚合性環脂族環氧化物的組成物、用於固化此組成物之方法、如此獲得之固化產物及此產物的用途，尤其是用於食物包裝的油墨及塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to polymeric cycloaliphatic epoxides, precursors of such polymeric cycloaliphatic epoxides, compositions containing such polymeric cycloaliphatic epoxides, processes for curing such compositions, cured products thus obtained and uses of such products, notably as inks and coatings for food packaging.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1365" publication-number="202631258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離心分離機的監視控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B04B13/00</main-classification>
        <further-classification edition="200601120260504B">B04B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱化工機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI KAKOKI KAISHA, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩蔵浩太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONZO, KOUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係以藉由檢測急遽增加的固體成分，能夠迅速檢測分離性能降低，並防止機器故障的離心分離機的監視控制系統的提供為課題，透過以下方式來解決，也就是使處理對象液從導入部(20)流入，並導入至內部，具備有：藉由電動機(21)使分離板旋轉，將導入的處理對象液分離為淤渣與分離液，分離液從分離液排出部(22)排出至外部的離心分離機(2)，從分離液排出部(22)排出的分離液，被導入至至少具備有背壓閥(31)及壓力計(PG)的分離液線路(3)，並具有藉由調整背壓閥(31)，使被引導至分離液線路(3)的分離液的一部分導入至至少具備檢測過濾單元(40)、定流量閥(41)、及流量計(42)的檢測線路(4)，在判斷對由設置於檢測過濾單元(40)的下游側的定流量閥(41)所調整的流量進行量測的流量計(42)所產生的量測值，為指定的流量下限閾值以下的情況時，使電動機(21)停止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:三通自動閥</p>
        <p type="p">2:離心分離機</p>
        <p type="p">3:分離液線路</p>
        <p type="p">4:檢測線路</p>
        <p type="p">5:控制部</p>
        <p type="p">20:導入部</p>
        <p type="p">21:電動機</p>
        <p type="p">22:分離液排出部</p>
        <p type="p">23:淤渣排出部</p>
        <p type="p">30:分離液</p>
        <p type="p">30a:分離液的一部分</p>
        <p type="p">31:背壓閥</p>
        <p type="p">40:檢測過濾單元</p>
        <p type="p">40A:殼體</p>
        <p type="p">40B:檢測用過濾部</p>
        <p type="p">41:定流量閥</p>
        <p type="p">42:流量計</p>
        <p type="p">43:遮斷閥</p>
        <p type="p">44:逆止閥</p>
        <p type="p">PG:壓力計</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1366" publication-number="202632892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝體及壓電振動器件、以及壓電振動器件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H03H9/19</main-classification>
        <further-classification edition="202301120260309B">H10N30/00</further-classification>
        <further-classification edition="202301120260309B">H10N30/06</further-classification>
        <further-classification edition="202301120260309B">H10N30/073</further-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="202601120260309B">H10P74/20</further-classification>
        <further-classification edition="202201120260309B">G06V10/70</further-classification>
        <further-classification edition="201701120260309B">G06T7/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商精工電子水晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SII CRYSTAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝延大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZONOBE, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川田保雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWADA, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 以高實裝精度實裝壓電振動片。  &lt;br/&gt;　　[解決手段] 提供封裝體，具備：封裝體本體(10)；經由導電性黏著劑(42)支持壓電振動片的實裝部(33)；在實裝部的表面藉由金屬材料圖案形成，相對於壓電振動片電連接的實裝電極(40)；實裝電極，以在封裝體本體的平面視中具有與實裝部的全體的外形形狀不同的外形圖案的方式形成；實裝電極的至少一部分，作為以預先決定的特定圖案形成的對準圖案(90)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:振盪器(壓電振動器件)</p>
        <p type="p">3:壓電振動片</p>
        <p type="p">12:蓋體(封口板)</p>
        <p type="p">20a:第1實裝面</p>
        <p type="p">21:第1框架</p>
        <p type="p">23:切缺部</p>
        <p type="p">32:貫通孔</p>
        <p type="p">33:實裝部</p>
        <p type="p">33a:直線壁</p>
        <p type="p">33b:曲面壁</p>
        <p type="p">33c:彎曲壁</p>
        <p type="p">40:實裝電極</p>
        <p type="p">41:外部連接電極</p>
        <p type="p">42:導電性黏著劑</p>
        <p type="p">50:壓電板</p>
        <p type="p">51:振動腕部</p>
        <p type="p">51a:末端部</p>
        <p type="p">51b:溝部</p>
        <p type="p">52:基部</p>
        <p type="p">53:支持腕部</p>
        <p type="p">90:對準圖案</p>
        <p type="p">91:第1直線邊緣</p>
        <p type="p">92:第2直線邊緣</p>
        <p type="p">C:空腔</p>
        <p type="p">L1:第1方向</p>
        <p type="p">L2:第2方向</p>
        <p type="p">R1:第1實裝區域</p>
        <p type="p">T:厚度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1367" publication-number="202631993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>截短的染色質開放元件序列及其組合與應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N15/11</main-classification>
        <further-classification edition="200601120260504B">C12N15/10</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N15/67</further-classification>
        <further-classification edition="200601120260504B">C12N15/85</further-classification>
        <further-classification edition="200601120260504B">C12P21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靳叢叢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, CONGCONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史臘妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, LANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開關於一種截短的染色質開放元件及其組合以及包含該染色質開放元件或其組合的、應用於真核細胞的表達系統及其應用。該染色質開放元件分別為不同來源的兩個染色質開放元件的截短序列，可單獨或組合應用，該染色質開放元件顯著縮短了有效序列從而更利於包含該元件或其組合的載體與其他元件的整合，如與ITR整合，在PiggyBac轉座酶存在情況下實現半定點整合，進而採用 bulkpool快速篩選流程，從而將蛋白生產和細胞株構建週期縮短約4-5周，且產量相當。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1368" publication-number="202631129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制Ｂｃｒ－Ａｂｌ酪胺酸激酶之５－及６－氮雜吲哚化合物</chinese-title>
        <english-title>5- AND 6-AZAINDOLE COMPOUNDS FOR INHIBITION OF BCR-ABL TYROSINE KINASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/437</main-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安立文股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENLIVEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛洛斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROSS, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林斯　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINS, HELEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於用於抑制Bcr-Abl酪胺酸激酶之化合物及組合物，製備該等化合物及組合物之方法，以及該等化合物及組合物在治療各種癌症，諸如慢性骨髓性白血病(CML)中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compounds and compositions for inhibition of Bcr-Abl tyrosine kinases, methods of preparing said compounds and compositions, and their use in the treatment of various cancers, such as chronic myeloid leukemia (CML).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1369" publication-number="202631451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可展開桁架系統</chinese-title>
        <english-title>DEPLOYABLE TRUSS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260421B">B63B7/06</main-classification>
        <further-classification edition="200601120260421B">B63B3/00</further-classification>
        <further-classification edition="200601120260421B">B63B1/04</further-classification>
        <further-classification edition="200601120260421B">B63B22/24</further-classification>
        <further-classification edition="200601120260421B">E04B1/344</further-classification>
        <further-classification edition="200601120260421B">H01Q1/04</further-classification>
        <further-classification edition="200601120260421B">H01Q1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超電子海事系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRA ELECTRONICS MARITIME SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯德爾　賈斯汀　羅倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENDALL, JUSTIN LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布瑞克　克里斯托福　芙蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAKE, CHRISTOPHER FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　蓋瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　安德魯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, ANDREW GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞　亞當　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAY, ADAM CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可展開桁架，其可包括多個縱樑，所述縱樑藉由撐條及斜桿連接在一起，當該桁架回縮時，所述縱樑可彈性變形以形成盤卷；及前端，其經組態以移動以展開該桁架，其中，在自回縮組態展開期間，該盤卷移動以展開該桁架。展開系統可對該盤卷施加扭轉負載以致使由該盤卷形成剛性或硬性桁架區段。定向控制系統可控制該桁架在水柱內之位置，諸如調整該桁架在水柱內之定向或傾斜度。當該桁架回縮時，儲存套筒可接納該盤卷。多個感測器可以一感測器間隔耦接至該桁架，從而允許形成該盤卷，而無所述感測器之幾何干擾（geometric interference）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A deployable truss may include multiple longerons connected together by battens and diagonals, the longerons resiliently deformable to form a coil when the truss is collapsed; and a leading end configured to move to deploy the truss, wherein, during deployment from a collapsed configuration, the coil moves to deploy the truss. A deployment system may apply a torsional load to the coil to cause formation of a stiff or rigid truss section from the coil. An orientation control system may control a position of the truss, such as adjusting the truss's orientation or tilt, within a water column. A storage sleeve may receive the coil when the truss is collapsed. Multiple sensors may be coupled to the truss in a sensor spacing allowing formation of the coil without geometric interference of the sensors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可展開桁架/桁架</p>
        <p type="p">102:第一端</p>
        <p type="p">104:第二端</p>
        <p type="p">108:第一結構</p>
        <p type="p">110:展開方向</p>
        <p type="p">112:第二結構</p>
        <p type="p">114:縱樑</p>
        <p type="p">116:撐條</p>
        <p type="p">118:斜桿</p>
        <p type="p">124:盤卷</p>
        <p type="p">130:桁架區段</p>
        <p type="p">132:外部展開/回收線</p>
        <p type="p">136:中心展開/收縮線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1370" publication-number="202633063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於材料之熱處理的方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR THERMAL PROCESSING OF MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H05K13/08</main-classification>
        <further-classification edition="200601120260423B">H05K3/12</further-classification>
        <further-classification edition="200601120260423B">B05D3/06</further-classification>
        <further-classification edition="200601120260423B">H05B41/34</further-classification>
        <further-classification edition="200601120260423B">H05B41/39</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商脈衝鍛造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULSEFORGE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇許　魯德雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, RUDRESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿塔爾　瓦希德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATTAR, VAHID AKHAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕賽基安　阿拉　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARSEKIAN, ARA W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於熱處理材料之設備及相關聯方法。一照明器照明材料以熱處理該材料。為了准許該照明器照明該材料之完整範圍，該照明器相對於該材料移動及/或該材料相對於該照明器移動。將來自材料之一經照明第一子集的熱轉移至該材料之尚未照明的一第二子集。為了考慮該材料之該第二子集之預加熱，第二材料集合之照明相對於第一材料集合之照明進行調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and associated methods for thermally processing materials are disclosed. An illuminator illuminates material to thermally process the material. To permit the illuminator to illuminate the full scope of the material, the illuminator is moved relative to the material and/or the material is moved relative to the illuminator. Heat from an illuminated first subset of material is transferred to a second subset of the material not yet illuminated. To account for the preheating of the second subset of the material, illumination of the second set of material is adjusted relative to illumination of the first set of material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光子處理設備，設備，系統</p>
        <p type="p">102:傳送機</p>
        <p type="p">110:電容器組充電電力供應器</p>
        <p type="p">115:閃光燈驅動器</p>
        <p type="p">120:電容器組</p>
        <p type="p">130:電流開關</p>
        <p type="p">150:閃光燈頭</p>
        <p type="p">160:控制系統</p>
        <p type="p">170:速度編碼器</p>
        <p type="p">190:運算系統</p>
        <p type="p">200:光子處理控制器，處理器</p>
        <p type="p">210:儲存裝置</p>
        <p type="p">220:使用者介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1371" publication-number="202631216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體導管中的液體檢測</chinese-title>
        <english-title>LIQUID DETECTION IN GASES CONDUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A61M16/00</main-classification>
        <further-classification edition="200601120260422B">A61M16/04</further-classification>
        <further-classification edition="200601120260422B">A61M16/06</further-classification>
        <further-classification edition="200601120260422B">A61M16/08</further-classification>
        <further-classification edition="200601120260422B">A61M16/10</further-classification>
        <further-classification edition="200601120260422B">A61M16/16</further-classification>
        <further-classification edition="200601120260422B">G01N27/04</further-classification>
        <further-classification edition="200601120260422B">G01N27/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪派克保健有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫卡普　彼得　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEEKUP, PETER ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡錫　奧爾丹　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCARTHY, AULDAN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼納斯　馬休　Ｈ　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANNERS, MATTHEW HARRY RON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬凡　克里申　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOVHAN, KRISHEN PARAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎普　強納森　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEMP, JONATHAN GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍奇森　瑞秋　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODGSON, RACHEL LEIGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托克斯　埃爾莫　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOKS, ELMO BENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣體導管，其包括：內腔；及導管壁構件，其形成該氣體導管的壁的至少一部分。該導管壁構件包括：第一導電元件及第二導電元件；及凹槽，其通向該內腔且至少部分地位於該第一導電元件與該第二導電元件之間。該凹槽包括在該內腔近側的第一寬度及在該內腔遠側的第二寬度，其中該第一寬度大於或小於該第二寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gases conduit comprising: a lumen, and a conduit wall member forming at least part of a wall of the gases conduit. The conduit wall member comprising a first electrically conductive element and a second electrically conductive element; and a recess open to the lumen and at least partially between the first electrically conductive element and the second electrically conductive element. The recess comprises a first width proximal the lumen, and a second width distal the lumen, wherein the first width is greater than or less than the second width.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1500:氣體導管</p>
        <p type="p">1504:凹槽</p>
        <p type="p">1506:第一導電元件</p>
        <p type="p">1508:第二導電元件</p>
        <p type="p">1520:導管壁構件</p>
        <p type="p">1524:內腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1372" publication-number="202631840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔性膜、液狀組成物、光學元件及多孔性膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C08J5/18</main-classification>
        <further-classification edition="200601120260427B">C08L101/10</further-classification>
        <further-classification edition="200601120260427B">C08J9/00</further-classification>
        <further-classification edition="201501120260427B">G02B1/11</further-classification>
        <further-classification edition="201901120260427B">B32B7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本板硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHEET GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島村夕希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小用瑞穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYO, MIZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大家和晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井寿雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, HISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多孔性膜1a設置於基體2表面上。多孔性膜1a具備：粒子11、黏結粒子11之黏合劑12、及存在於粒子11外側之空隙15。多孔性膜1a於波長550 nm具有1.05～1.150之折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:多孔性膜</p>
        <p type="p">2:基體</p>
        <p type="p">5:光學元件</p>
        <p type="p">11:粒子</p>
        <p type="p">11h:中空部</p>
        <p type="p">12:黏合劑</p>
        <p type="p">15:空隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1373" publication-number="202631126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療轉移性去勢抵抗性前列腺癌之他拉唑帕尼(Talazoparib)及恩雜魯胺(enzalutamide)之組合</chinese-title>
        <english-title>COMBINATION OF TALAZOPARIB AND ENZALUTAMIDE IN THE TREATMENT OF METASTATIC CASTRATION-RESISTANT PROSTATE CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4166</main-classification>
        <further-classification edition="200601120260504B">A61K31/5025</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商安斯泰來製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTELLAS PHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲貝爾　亞可斯　加伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CZIBERE, AKOS GABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯尼迪　達娜　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEDY, DANA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克勒　瑪麗亞　德芮莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOEHLER, MARIA TERESA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米區　珊卓　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEECH, SANDRA JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　放</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於他拉唑帕尼(talazoparib)或其醫藥學上可接受之鹽與恩雜魯胺(enzalutamide)或其醫藥學上可接受之鹽的組合，其係用於治療轉移性去勢抵抗性前列腺癌；及延長轉移性去勢抵抗性前列腺癌之總存活期之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to talazoparib, or a pharmaceutically acceptable salt thereof, in combination with enzalutamide, or a pharmaceutically acceptable salt thereof, for the treatment of metastatic castration-resistant prostate cancer and methods of increasing overall survival thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1374" publication-number="202631620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>KIF調節劑化合物及其使用方法</chinese-title>
        <english-title>KIF MODULATOR COMPOUNDS AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/18</main-classification>
        <further-classification edition="200601120260504B">C07D498/18</further-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/439</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商依安彼克醫療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IAMBIC THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴特　肖恩　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIGHT, SHAWN ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博特羅斯　伊里尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTROUS, IRINY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼斯　喬瑟夫　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENNIS, JOSEPH MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈麥斯　勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOMEZ, LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫利克　斯維特拉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULYK, SVITLANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克利斯騰森　安德斯　斯蒂恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRISTENSEN, ANDERS STEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆諾茲　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUNOZ, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤斯特　尚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOST, SHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　忠東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHONGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珊塔尼拉　亞歷山德　布查鈎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANTANILLA, ALEXANDER BUITRAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供KIF調節劑化合物、其醫藥組合物及使用該等化合物及組合物治療疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are KIF modulator compounds, pharmaceutical compositions thereof, and methods of using said compounds and compositions in the treatment of disease.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1375" publication-number="202633061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒸發器</chinese-title>
        <english-title>AN EVAPORATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H05K7/20</main-classification>
        <further-classification edition="200601120260422B">F25B39/02</further-classification>
        <further-classification edition="200601120260422B">F28D21/00</further-classification>
        <further-classification edition="202601120260422B">H10W40/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商祖塔核心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUTA-CORE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾德爾森　納尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EADELSON, NAHSHON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種蒸發器，包括至少一個底板單元，其被組構成具有一散熱器區，其具有被組構成直接接觸一熱源之一近端面及相對之一遠端面，其中具有可變截面高度的複數個薄鰭片從該遠端面延伸出來，其中由多孔材料構成的複數個毛細結構層設置在該複數個薄鰭片之間。該蒸發器亦包括一蓋體單元，其設有至少一個液態冷媒入口及至少一個氣態冷媒出口。該蓋體單元與該至少一個底板單元圍成一空間，液態冷媒經由該至少一個液態冷媒入口流入該空間內，而與該複數個毛細結構層接觸，並經毛細作用被引導至該複數個毛細結構層中較乾燥的部分，而在該處汽化，且最後經由該至少一個氣態冷媒出口排出，從而使熱從該熱源散逸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is an evaporator, comprising at least one base plate unit configured with a heatsink region having a proximal face configured to directly contact a heat source and an opposed distal face, wherein a plurality of thin fins having variable cross-section height extends from said distal face, where a plurality of wick layers composed of porous material is installed between said plurality of thin fins. The evaporator may also comprise a cover unit adapted with at least one liquid refrigerant inlet and at least one vapor refrigerant outlet. Said cover unit and said at least one base plate unit confine a volume, into which liquid refrigerant inflows via said at least one liquid refrigerant inlet, engages said plurality of wick layers, being wicked towards drier portions thereof therein, where it vaporizes, and finally evacuates via said at least one vapor refrigerant outlet, thereby dissipating heat from said heat source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蒸發器</p>
        <p type="p">110:底板單元</p>
        <p type="p">120:蓋體單元</p>
        <p type="p">121a:液體入口</p>
        <p type="p">121b:第一蒸氣出口</p>
        <p type="p">122a:蒸氣入口</p>
        <p type="p">122b:第二蒸氣出口</p>
        <p type="p">130:連接件</p>
        <p type="p">140:夾合裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1376" publication-number="202631193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類抗RANKL抗體之調配物及其使用方法</chinese-title>
        <english-title>FORMULATIONS OF HUMAN ANTI-RANKL ANTIBODIES, AND METHODS OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K39/395</main-classification>
        <further-classification edition="200601120260429B">A61K47/18</further-classification>
        <further-classification edition="200601120260429B">C07K16/28</further-classification>
        <further-classification edition="200601120260429B">A61K47/22</further-classification>
        <further-classification edition="200601120260429B">A61K47/26</further-classification>
        <further-classification edition="200601120260429B">A61K47/12</further-classification>
        <further-classification edition="200601120260429B">A61K9/08</further-classification>
        <further-classification edition="200601120260429B">A61P19/00</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊奇　史提芬　羅柏特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRYCH, STEPHEN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　連恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, LYANNE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費洛　傑米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALLON, JAYMILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高思　莫妮卡　蜜雪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSS, MONICA MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, JIAN HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉哈特凡凱特克里西那　派瓦恩　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHATTYVENKATAKRISHNA, PAVAN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示了包含地諾單抗(denosumab)或另一人類抗RANKL單株抗體或其部分及pH值特徵、緩衝系統及胺基酸聚集抑制劑之水性醫藥調配物。亦揭示了該調配物在使用時之呈現形式，例如於單次使用小瓶、單次使用注射器或玻璃容器中；使用該等調配物及製品來預防或治療疾病之方法；及相關套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are aqueous pharmaceutical formulations comprising denosumab or another human anti-RANKL monoclonal antibody or portion thereof, and characteristics of pH, buffer systems, and amino acid aggregation inhibitors. Also disclosed are presentation of the formulation for use, e.g. in a single-use vial, single-use syringe, or glass container, methods of using the formulations and articles for preventing or treating diseases, and related kits.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1377" publication-number="202632117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單把水龍頭，帶側面控制及通用內部水路平臺系統</chinese-title>
        <english-title>SINGLE HANDLE WATER FAUCET WITH SIDE CONTROL AND UNIVERSAL INTERNAL WATERWAY PLATFORM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">E03C1/02</main-classification>
        <further-classification edition="200601120260422B">F16K11/14</further-classification>
        <further-classification edition="200601120260422B">F16K27/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商路達（廈門）工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN LOTA INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝傳寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHUANBAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何永強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉賢清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, XIANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江遂春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, SUICHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種通用型內部水路平台水龍頭系統，其適用於上方安裝、側面控制的單把手水龍頭。通用型內部水路平台水龍頭系統是經設計與配置，以利於在具有各種佈局及連接配置的多種側面控制單把手水龍頭中，進行快速、容易且精準的安裝。通用型內部水路平台水龍頭系統主要隱藏於水龍頭外殼內，且於某些情況下，其一部分是隱藏於與水龍頭外殼相連接的安裝柄內。流體，例如水，於流經通用型內部水路平台水龍頭系統時，是與水龍頭外殼相隔離，直至流體自與水龍頭的出水口相連接的排水管排出為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to universal internal waterway platform faucet systems for use in top-mounted, side controlled, single handle faucets. The universal internal waterway platform faucet systems are designed and configured to facilitate fast, easy, and accurate installation within numerous types of side controlled, single handle faucets having a variety of layouts and connection configurations. The universal internal waterway platform faucet systems are primarily concealed within a faucet housing, and in some instances an extent is concealed within a mounting shank coupled to the faucet housing. Fluid, such as water, that flows through the universal internal waterway platform faucet systems is isolated from the faucet housing until the water is dispensed from a water discharge tube coupled to a spout of the faucet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水龍頭系統</p>
        <p type="p">22:水龍頭本體</p>
        <p type="p">70:手柄</p>
        <p type="p">74:出水口</p>
        <p type="p">85:支撐表面</p>
        <p type="p">310:第一進水管線/管線/入口管線</p>
        <p type="p">320:第二進水管線/管線/入口管線</p>
        <p type="p">800:安裝柄</p>
        <p type="p">S&lt;sub&gt;I&lt;/sub&gt;:安裝狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1378" publication-number="202632118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單把水龍頭，帶側面控制及通用內部水路平臺系統</chinese-title>
        <english-title>SINGLE HANDLE WATER FAUCET WITH SIDE CONTROL AND UNIVERSAL INTERNAL WATERWAY PLATFORM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">E03C1/04</main-classification>
        <further-classification edition="200601120260422B">F16K11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商路達（廈門）工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN LOTA INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝傳寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHUANBAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉立明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王燕燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳本泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN,BENTAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種通用型內部水路平台水龍頭系統，其適用於上方安裝、側面控制的單把手水龍頭。通用型內部水路平台水龍頭系統是經設計與配置，以利於在具有各種佈局及連接配置的多種側面控制單把手水龍頭中，進行快速、容易且精準的安裝。通用型內部水路平台水龍頭系統主要隱藏於水龍頭外殼內，且於某些情況下，其一部分是隱藏於與水龍頭外殼相連接的安裝柄內。流體，例如水，於流經通用型內部水路平台水龍頭系統時，是與水龍頭外殼相隔離，直至流體自與水龍頭的出水口相連接的排水管排出為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to universal internal waterway platform faucet systems for use in top-mounted, side controlled, single handle faucets. The universal internal waterway platform faucet systems are designed and configured to facilitate fast, easy, and accurate installation within numerous types of side controlled, single handle faucets having a variety of layouts and connection configurations. The universal internal waterway platform faucet systems are primarily concealed within a faucet housing, and in some instances an extent is concealed within a mounting shank coupled to the faucet housing. Fluid, such as water, that flows through the universal internal waterway platform faucet systems is isolated from the faucet housing until the water is dispensed from a water discharge tube coupled to a spout of the faucet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水龍頭系統</p>
        <p type="p">22:水龍頭本體</p>
        <p type="p">70:手柄</p>
        <p type="p">74:出水口</p>
        <p type="p">85:支撐表面</p>
        <p type="p">310:第一進水管線/管線/入口管線</p>
        <p type="p">320:第二進水管線/管線/入口管線</p>
        <p type="p">800:安裝柄</p>
        <p type="p">S&lt;sub&gt;I&lt;/sub&gt;:安裝狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1379" publication-number="202632136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將壓縮空氣能量儲存器轉換為水力發電儲存系統的方法與裝置</chinese-title>
        <english-title>METHODS AND DEVICES FOR CONVERTING A COMPRESSED AIR ENERGY STORAGE (CAES) INTO A HYDROELECTRIC POWER STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F01K25/02</main-classification>
        <further-classification edition="200601120260421B">F01K27/00</further-classification>
        <further-classification edition="200601120260421B">F28D15/02</further-classification>
        <further-classification edition="200601120260421B">F28D20/02</further-classification>
        <further-classification edition="200601120260421B">B29C63/10</further-classification>
        <further-classification edition="200601120260421B">F03B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商能源8科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER8 TECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁廉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, LIEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁啟達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供了使用水力發電機的能量儲存系統。該等系統可藉由改造一種壓縮空氣能量儲存（CAES）器系統而成。將壓縮空氣能量儲存系統轉換為水力發電儲存系統的方法，可藉由以下達成：將一泵連接一或多個容器，該等容器的製作係用於儲存一壓縮空氣能量儲存器的壓縮空氣，且將一水力發電機連接該一或多個容器。該方法進一步包含：組建一流體管道，其連接該泵與該一或多個容器。此外，該方法還組建一流體管道，其連接該水力發電機與該一或多個容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides energy storage systems using hydroelectric power generator. The systems are able to be modified from a compressed air energy storage (CAES)system. The method of converting a compressed air energy storage system into a hydroelectric power storage system can be achieved by coupling a pump to one or more containers constructed for storing compressed air of a compressed air energy storage and coupling a hydroelectric power generator to the one or more containers. The method further comprises constructing a fluid pipe connecting the pump and the one or more container. Further, the method constructs a fluid pipe connecting the hydroelectric power generator and the one or more container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:能量儲存器</p>
        <p type="p">12:第一容器</p>
        <p type="p">14:第二容器</p>
        <p type="p">IG:初始第一氣體</p>
        <p type="p">IL:初始流體</p>
        <p type="p">SP1:第一容置空間</p>
        <p type="p">SP2:第二容置空間</p>
        <p type="p">FPE:第一壓力能</p>
        <p type="p">SPE:第二壓力能</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1380" publication-number="202631068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔系統及清潔方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">A47L11/24</main-classification>
        <further-classification edition="200601120260417B">A47L11/282</further-classification>
        <further-classification edition="200601120260417B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>單建強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAN, JIANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種清潔系統及清潔方法，本發明的主要技術方案為：一種清潔系統，包括：清潔機器人，清潔機器人包括第一主控制件和至少一個功能件，功能件包括感測件；基礎設備包括清潔件和特徵件，感測件用於感測特徵件；第一主控制件至少用於判斷是否有功能件滿足清潔條件，在目標功能件滿足清潔條件時，根據感測件對特徵件的感測結果確定基礎設備位置，根據目標功能件在清潔機器人上的位置以及基礎設備位置，控制清潔機器人移動至目標功能件與清潔件作用，而進行目標功能件的清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔機器人</p>
        <p type="p">110:感測件</p>
        <p type="p">120:外殼</p>
        <p type="p">130:運動機構</p>
        <p type="p">131:移動輪</p>
        <p type="p">132:輔助轉向輪</p>
        <p type="p">140:充電件</p>
        <p type="p">150:通訊感測器</p>
        <p type="p">160:沿牆感測器</p>
        <p type="p">170:避障感測器</p>
        <p type="p">180:懸崖感測器</p>
        <p type="p">200:基礎設備</p>
        <p type="p">210:清潔件</p>
        <p type="p">211:側清潔件</p>
        <p type="p">212:底部清潔件</p>
        <p type="p">220:特徵件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1381" publication-number="202632141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單軸偏心螺桿泵</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">F04C2/107</main-classification>
        <further-classification edition="200601120260423B">F04C14/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商兵神裝備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEISHIN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須原伸久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUHARA, NOBUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榊原教晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAKIHARA, NORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可簡便地進行轉子與定子的緊度或間隙之調整，並且亦可實現自動化之單軸偏心螺桿泵。&lt;br/&gt;  單軸偏心螺桿泵（1）具備：輸入軸（3），係可旋轉地支撐於軸承（32）並利用驅動器的動力進行旋轉；轉子（5），係與輸入軸（3）以能夠偏心旋轉之方式連接；定子（12），係轉子（5）能夠插通於該定子（12）；以及軸承座（30），係用以收納軸承（32），且輸入軸（3）能夠插通於該軸承座（30）；該單軸偏心螺桿泵（1）能夠採用將轉子（5）的外徑和定子（12）的內孔（12a）的內徑中任一者或兩者形成為隨著從一端部朝向另一端部而變小、或者使所述轉子的偏心量變化的任一方式或該兩種方式，並具備使軸承（32）與輸入軸（3）呈一體地沿所述輸入軸的軸線方向而相對於定子（12）靠近或遠離之移動機構（50）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單軸偏心螺桿泵</p>
        <p type="p">3:輸入軸</p>
        <p type="p">3a:中心軸</p>
        <p type="p">5:轉子(外螺紋型轉子)</p>
        <p type="p">7:連結軸</p>
        <p type="p">9:連結部</p>
        <p type="p">10:定子殼</p>
        <p type="p">11:端部螺柱</p>
        <p type="p">12:定子(內螺紋型定子)</p>
        <p type="p">12a:內孔</p>
        <p type="p">14:空間</p>
        <p type="p">16:噴出口</p>
        <p type="p">20:泵殼</p>
        <p type="p">22:吸入口(供給口)</p>
        <p type="p">22a:凸緣</p>
        <p type="p">24:凸緣</p>
        <p type="p">30:軸承座</p>
        <p type="p">32:軸承</p>
        <p type="p">33:軸承架</p>
        <p type="p">34:筒狀部</p>
        <p type="p">34a:支撐腳</p>
        <p type="p">36:支撐部</p>
        <p type="p">36a:長孔</p>
        <p type="p">40:軸封殼</p>
        <p type="p">42:軸封密封件</p>
        <p type="p">44:密封件</p>
        <p type="p">50:移動機構</p>
        <p type="p">52:調整螺栓(雙頭螺栓)</p>
        <p type="p">54:外側螺栓部</p>
        <p type="p">54a:第一螺紋部</p>
        <p type="p">54b:中空孔</p>
        <p type="p">54c:凸緣</p>
        <p type="p">54d:圓筒部</p>
        <p type="p">56:內側螺栓部</p>
        <p type="p">56a:第二螺紋部</p>
        <p type="p">56b:螺母</p>
        <p type="p">60:連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1382" publication-number="202632142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單軸偏心螺桿泵</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">F04C2/107</main-classification>
        <further-classification edition="200601120260423B">F04C14/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商兵神裝備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEISHIN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須原伸久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUHARA, NOBUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香水憲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可簡便地進行轉子與定子的緊度或間隙之調整，並且亦可實現自動化之單軸偏心螺桿泵。&lt;br/&gt;  單軸偏心螺桿泵（1）具備：輸入軸（60），係利用驅動器的動力進行旋轉；轉子（5），係與輸入軸（60）以能夠偏心旋轉之方式連接；接頭部（9），係將輸入軸（60）與轉子（5）直接連接、或者經由接頭軸（7）間接連接；以及定子（12），係能夠插通有轉子（5），單軸偏心螺桿泵（1）能夠採用將轉子（5）的外徑和定子（12）的內孔（12a）的內徑中任一者或兩者形成為隨著從一端部朝向另一端部而變小、或者使所述轉子的偏心量變化的任一方式或該兩種方式，單軸偏心螺桿泵（1）具備伸縮機構（50），所述伸縮機構（50）藉由使輸入軸（60）、接頭軸（7）以及接頭部（9）的任一者或兩者在軸線方向上伸縮而使轉子（5）相對於定子（12）靠近或遠離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單軸偏心螺桿泵</p>
        <p type="p">3a:中心軸</p>
        <p type="p">5:轉子(外螺紋型轉子)</p>
        <p type="p">7:接頭軸(連結軸)</p>
        <p type="p">9:接頭部(連結部)</p>
        <p type="p">10:定子殼</p>
        <p type="p">12:定子(內螺紋型定子)</p>
        <p type="p">12a:內孔</p>
        <p type="p">14:空間</p>
        <p type="p">16:噴出口</p>
        <p type="p">20:泵殼</p>
        <p type="p">22:供給口(吸入口)</p>
        <p type="p">22a:凸緣</p>
        <p type="p">30:軸承座</p>
        <p type="p">32:軸承</p>
        <p type="p">36:支撐部</p>
        <p type="p">40:軸封殼</p>
        <p type="p">42:軸封密封件</p>
        <p type="p">44:密封部件</p>
        <p type="p">50:伸縮機構</p>
        <p type="p">51:調整部件</p>
        <p type="p">52:緊固部件</p>
        <p type="p">60:輸入軸</p>
        <p type="p">61:外側軸</p>
        <p type="p">62:中空孔</p>
        <p type="p">65:內側軸</p>
        <p type="p">66:止動件(卡合部)</p>
        <p type="p">70:鎖定部</p>
        <p type="p">71:螺母部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1383" publication-number="202632143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單軸偏心螺桿泵</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">F04C2/107</main-classification>
        <further-classification edition="200601120260423B">F04C14/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商兵神裝備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEISHIN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須原伸久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUHARA, NOBUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可簡便地進行轉子與定子的緊度或間隙之調整，並且亦可實現自動化之單軸偏心螺桿泵。&lt;br/&gt;  單軸偏心螺桿泵（1）具備：輸入軸（3），係利用驅動器的動力進行旋轉；轉子（5），係與輸入軸（3）以能夠偏心旋轉之方式連接；以及定子（12），係能夠插通有轉子（5），單軸偏心螺桿泵（1）能夠採用將轉子（5）的外徑和定子（12）的內孔（12a）的內徑中任一者或兩者形成為隨著從一端部朝向另一端部而變小、或者使轉子（5）的偏心量變化的任一方式或所述兩種方式，單軸偏心螺桿泵（1）具備使定子（12）沿軸線方向相對於轉子（5）靠近或遠離之移動機構（50）。定子殼（10）具備支撐定子（12）的第一定子殼（14）、和以能夠在軸線方向上相對移動之方式保持第一定子殼（14）的第二定子殼（16）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無。</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單軸偏心螺桿泵</p>
        <p type="p">3:輸入軸</p>
        <p type="p">3a:中心軸</p>
        <p type="p">5:轉子(外螺紋型轉子)</p>
        <p type="p">7:連結軸</p>
        <p type="p">9:連結部</p>
        <p type="p">10:定子殼</p>
        <p type="p">12:定子(內螺紋型定子)</p>
        <p type="p">12a:內孔</p>
        <p type="p">12b:定子外筒</p>
        <p type="p">13:空間</p>
        <p type="p">14:第一定子殼</p>
        <p type="p">16:第二定子殼</p>
        <p type="p">18:噴出噴嘴</p>
        <p type="p">18b:噴出口</p>
        <p type="p">20:泵殼</p>
        <p type="p">22:供給口(吸入口)</p>
        <p type="p">22a:凸緣</p>
        <p type="p">24:凸緣</p>
        <p type="p">30:軸承座</p>
        <p type="p">32:軸承</p>
        <p type="p">36:支撐部</p>
        <p type="p">40:軸封殼</p>
        <p type="p">42:軸封密封件</p>
        <p type="p">50:移動機構</p>
        <p type="p">52:操作部</p>
        <p type="p">54:移動槽</p>
        <p type="p">54a:卡合孔</p>
        <p type="p">60:連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1384" publication-number="202632026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁力驅動源濺鍍系統</chinese-title>
        <english-title>SPUTTER SYSTEM WITH MAGNET MOTION SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C14/06</main-classification>
        <further-classification edition="200601120260427B">C23C14/35</further-classification>
        <further-classification edition="200601120260427B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊達帕　納加胡沙納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJUNDAPPA, NAGABHUSHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙芬戴亞　基倫古莫妮拉珊卓拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAVANDAIAH, KIRANKUMAR NEELASANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普羅薩德　巴斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRASAD, BHASKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普奇　布萊恩傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUCH, BRYAN JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊克　馬丁李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIKER, MARTIN LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　凱斯Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, KEITH A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種用於濺鍍系統的濺射源組件。該濺射源組件包括可在貯槽內移動的磁控濺射器。該濺射源組件還包括磁控濺射器致動器，該磁控濺射器致動器具有沿軸線延伸並從貯槽的內部通往外部的第一和第二軸。進一步地，該磁控濺射器致動器包括設置在貯槽外的第一和第二馬達，且每個馬達都與軸線同軸對準，第一和第二馬達被配置成分別驅動第一和第二軸旋轉，以使磁控濺射器移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sputter source assembly for a sputter system is disclosed. The sputter source assembly includes a magnetron movable within a reservoir. The sputter source assembly also includes a magnetron actuator having first and second shafts extending along an axis and passing from an interior of the reservoir to an exterior thereof. Further, the magnetron actuator includes first and second motors disposed external to the reservoir and each aligned coaxially with the axis, the first and second motors being arranged to rotatably drive the first and second shafts, respectively, so as to cause movement of the magnetron.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:濺鍍系統</p>
        <p type="p">102:主腔室</p>
        <p type="p">104:中央軸</p>
        <p type="p">106:靶材</p>
        <p type="p">108:配接器</p>
        <p type="p">110:絕緣體</p>
        <p type="p">112:濺射源組件</p>
        <p type="p">114:磁控濺射器致動器</p>
        <p type="p">116:內部旋轉軸/旋轉驅動軸</p>
        <p type="p">118:管狀外部旋轉軸/旋轉驅動軸</p>
        <p type="p">120:第一馬達</p>
        <p type="p">122:第二馬達</p>
        <p type="p">124:外圍齒輪系統</p>
        <p type="p">126:磁控濺射器</p>
        <p type="p">128:支架</p>
        <p type="p">130:磁性轆轤</p>
        <p type="p">132:內極</p>
        <p type="p">134:外極</p>
        <p type="p">136:真空泵</p>
        <p type="p">138:泵送埠</p>
        <p type="p">140:氣體源</p>
        <p type="p">142:質量流量控制器</p>
        <p type="p">144:晶圓</p>
        <p type="p">146:基座/電極</p>
        <p type="p">148:夾緊環</p>
        <p type="p">150:電氣接地屏蔽層</p>
        <p type="p">152:間隙</p>
        <p type="p">154:DC電源</p>
        <p type="p">156:高密度電漿區域</p>
        <p type="p">158:RF電源</p>
        <p type="p">160:電容耦合電路</p>
        <p type="p">162:主控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1385" publication-number="202633431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於重疊對準的高密度晶粒間互連移位校正</chinese-title>
        <english-title>HIGH DENSITY DIE TO DIE INTERCONNECT SHIFT CORRECTION FOR OVERLAY ALIGNMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260402B">H10W20/20</main-classification>
        <further-classification edition="202601120260402B">H10W46/00</further-classification>
        <further-classification edition="202601120260402B">H10W72/20</further-classification>
        <further-classification edition="202601120260402B">H10P95/90</further-classification>
        <further-classification edition="202601120260402B">H10P95/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘　欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊迪格　湯瑪斯Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAIDIG, THOMAS L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宗勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHUNG-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　正方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JANG FUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成DTD互連的方法包括：測量部分DTD互連的多晶粒互連橋的位移。在累積層中形成複數個通孔通道和橋接通孔通道。在通孔通道和橋接通孔通道中形成複數個通孔和複數個橋接通孔。互連層被設置在複數個通孔之上，並且延伸的橋接互連被設置在複數個橋接通孔通道之上。複數個封裝微凸點襯墊和複數個橋接微凸點襯墊被分別設置在複數個通孔和橋接通孔之上。複數個通孔與封裝微凸點襯墊對準，且複數個橋接通孔與複數個橋接微凸點襯墊對準。一或多個晶粒與DTD互連進行鍵合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a DTD interconnect includes measuring a shift in a multi-die interconnect bridge of a partial DTD interconnect. A plurality of via channels and bridge via channels are formed in the build-up layers. A plurality of vias and a plurality of bridge vias are formed in the via channels and the bridge via channels. Interconnect layers are disposed over the plurality of vias and an elongated bridge interconnect is disposed over the plurality of bridge via channels. A plurality of package micro-bump pads and a plurality of bridge micro-bump pads are disposed over the plurality of vias and the bridge vias, respectively. The plurality of vias are aligned with the package micro-bump pads and the plurality of bridge vias are aligned with the plurality of bridge micro-bump pads. One or more dies are bonded to the DTD interconnect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">104:互連層</p>
        <p type="p">104A:第一互連層</p>
        <p type="p">104B:第二互連層</p>
        <p type="p">104C:第三互連層</p>
        <p type="p">104D:第四互連層</p>
        <p type="p">104E:第五互連層</p>
        <p type="p">106:累積層</p>
        <p type="p">106A:第一累積層</p>
        <p type="p">106B:第二累積層</p>
        <p type="p">106C:第三累積層</p>
        <p type="p">106D:第四累積層</p>
        <p type="p">106E:第五累積層</p>
        <p type="p">110A:第一晶粒</p>
        <p type="p">110B:第二晶粒</p>
        <p type="p">112:橋接互連</p>
        <p type="p">112A:第一橋接互連</p>
        <p type="p">112B:第二橋接互連</p>
        <p type="p">114:通孔</p>
        <p type="p">114A:第一通孔</p>
        <p type="p">114B:第二通孔</p>
        <p type="p">114C:第三通孔</p>
        <p type="p">114D:第四通孔</p>
        <p type="p">114E:第五通孔</p>
        <p type="p">115:通道</p>
        <p type="p">116:封裝微凸點襯墊</p>
        <p type="p">118:橋接微凸點襯墊</p>
        <p type="p">120:微凸點</p>
        <p type="p">318:橋接襯墊</p>
        <p type="p">700:延伸的DTD互連</p>
        <p type="p">708:多晶粒互連橋</p>
        <p type="p">715:通道</p>
        <p type="p">721:延伸的橋接互連層</p>
        <p type="p">721A:第一延伸橋接互連層</p>
        <p type="p">721B:第二延伸晶粒互連層</p>
        <p type="p">722A:第一橋接通孔</p>
        <p type="p">722B:第二橋接通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1386" publication-number="202633203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測封裝及其製造方法</chinese-title>
        <english-title>SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10F39/12</main-classification>
        <further-classification edition="202601120260421B">H10W40/20</further-classification>
        <further-classification edition="202601120260421B">H10W40/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖健良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIEN LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金斯曼　拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINSMAN, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感測封裝包括感測晶粒、覆蓋感測晶粒的第二側的絕緣層、蓋體層、在蓋體層和感測晶粒之間的介電擋壩、耦合到感測晶粒的電路基板以及側向地覆蓋蓋體層、介電擋壩和絕緣層的包封體。感測晶粒包括相對的第一和第二側、在第一側的感測區域、在第二側並將感測晶粒耦合到電路基板的導電端子。絕緣層暴露出感測晶粒的第一側。蓋體層設置在感測晶粒的第一側上方並覆蓋感測區域，介電擋壩設置在感測區域之外，並且包封體延伸到在電路基板和絕緣層之間的空隙中以圍繞導電端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensor package includes a sensor die, an insulating layer covering the second side of the sensor die, a cover layer, a dielectric dam between the cover layer and the sensor die, a circuit substrate coupled to the sensor die, and an encapsulant laterally covering the cover layer, the dielectric dam, and the insulating layer. The sensor die includes opposing first and second sides, a sensing area at the first side, conductive terminals at the second side and coupling the sensor die to the circuit substrate. The insulating layer exposes the first side of the sensor die. The cover layer is disposed above the first side of the sensor die and covers the sensing area, the dielectric dam is disposed outside the sensing area, and the encapsulant extends into a gap between the circuit substrate and the insulating layer to surround the conductive terminals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:感測封裝</p>
        <p type="p">110:感測晶粒</p>
        <p type="p">110S:感測區域</p>
        <p type="p">111:半導體基板</p>
        <p type="p">111a、124a、210a:第一側</p>
        <p type="p">111b、124b、210b:第二側</p>
        <p type="p">111c:外側壁</p>
        <p type="p">111H、124H:最大厚度</p>
        <p type="p">111T:穿孔</p>
        <p type="p">112:畫素</p>
        <p type="p">113:接觸墊</p>
        <p type="p">114、211:介電層</p>
        <p type="p">115:重佈線路層(RDL)</p>
        <p type="p">117:絕緣層</p>
        <p type="p">117s:非平面的表面</p>
        <p type="p">117s1:第一區段</p>
        <p type="p">117s2:第二區段</p>
        <p type="p">118:導電端子</p>
        <p type="p">122:介電擋壩</p>
        <p type="p">122H:高度</p>
        <p type="p">124:蓋體層</p>
        <p type="p">124c、210c:側壁</p>
        <p type="p">126:遮光層</p>
        <p type="p">210:電路基板</p>
        <p type="p">212:導電圖案</p>
        <p type="p">214:外部端子</p>
        <p type="p">310:包封體</p>
        <p type="p">1161:氧化物層</p>
        <p type="p">1162:緩衝層</p>
        <p type="p">1171:空白區域</p>
        <p type="p">1181:第一部分</p>
        <p type="p">1182:第二部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1387" publication-number="202632255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體樣本的影像的邊緣偵測</chinese-title>
        <english-title>EDGE DETECTION IN AN IMAGE OF A SEMICONDUCTOR SPECIMEN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01N21/95</main-classification>
        <further-classification edition="200601120260422B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭德　歐姆里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAND, OMRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑞德　沙哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAD, SHAHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班哈萊希　依蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEN-HARUSH, ILAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭克　塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANK, TAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比斯翠札　拉法爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BISTRITZER, RAFAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了系統和方法，包括獲得提供半導體樣本的至少一個結構元件的至少部分的資訊的影像，使用該影像產生一或多個濾波器，在影像的複數個區域中的每個給定區域與一或多個濾波器之間執行比較，並且基於比較來決定該影像的點集合，該集合提供該影像中的至少一個結構元件的至少一個邊緣的估計位置的資訊，該點集合對於該影像的複數個行中的每個給定行或對於該影像的複數個列中的每個給定列，包含該影像的該給定行或該給定列的至少一個給定點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided systems and methods comprising obtaining an image informative of at least part of at least one structural element of a semiconductor specimen, using the image to generate one or more filters, performing a comparison between each given area of a plurality of areas of the image, and the one or more filters, and determining, based on the comparison, a set of points of the image, informative of an estimated position of at least one edge of the at least one structural element in the image, the set of points comprising, for each given row of a plurality of rows of the image, or for each given column of a plurality of columns of the image, at least one given point of the given row or of the given column of the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:操作</p>
        <p type="p">310:操作</p>
        <p type="p">320:操作</p>
        <p type="p">330:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1388" publication-number="202632038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由使用沉積梯度控制之超保形鉬通孔填充</chinese-title>
        <english-title>SUPERCONFORMAL MOLYBDENUM VIA FILL BY USE OF DEPOSITION GRADIENT CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C23C16/02</main-classification>
        <further-classification edition="200601120260424B">C23C16/06</further-classification>
        <further-classification edition="202601120260424B">H10P14/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岑嘉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEN, JIAJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯　文婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, WENTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳詩雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, SHIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡時宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周瑞楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, RUINAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪榮軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　先敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, XIANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供在半導體基板上的金屬間隙填充沉積方法。方法包括藉由將第一劑量和第二劑量的第一含金屬前驅物提供至處理腔室，在特徵的表面上形成襯墊層。特徵包括形成在半導體基板的表面中的特徵。特徵包括由蓋層和側壁界定的開口。側壁包含介電材料。襯墊層形成於側壁和蓋層上方。金屬間隙填充材料沉積在襯墊層上方，以藉由將第二含金屬前驅物和含氫前驅物提供至處理腔室來填充形成在半導體基板的表面中的特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides metal gap fill deposition methods on a semiconductor substrate. The methods include forming a liner layer on a surface of a feature by providing a first dosage and a second dosage of a first metal-containing precursor to a processing chamber. The feature includes a feature formed in a surface of the semiconductor substrate. The feature includes an opening that is defined by a capping layer and side walls. The side walls include a dielectric material. The liner layer is formed over the side walls and the capping layer. A metal gap fill material is deposited over the liner layer to fill the feature formed in the surface of the semiconductor substrate by providing a second metal-containing precursor and a hydrogen-containing precursor to the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程</p>
        <p type="p">102:操作</p>
        <p type="p">104:操作</p>
        <p type="p">106:操作</p>
        <p type="p">106a:操作</p>
        <p type="p">106b:操作</p>
        <p type="p">106c:操作</p>
        <p type="p">106d:操作</p>
        <p type="p">108:操作</p>
        <p type="p">108a:操作</p>
        <p type="p">108b:操作</p>
        <p type="p">108c:操作</p>
        <p type="p">108d:操作</p>
        <p type="p">110:操作</p>
        <p type="p">112:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1389" publication-number="202632745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自適應密封組件</chinese-title>
        <english-title>SELF-COMPLIANT SEAL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　段安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, TUAN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝沙維亞加雅索莫西卡　維西瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASAVARAJAIAH SOMASHEKAR, VISHWAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈菲許　薩米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYFEH, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一個製程站。該製程站包括定義腔室空間的腔室主體。該製程站還包括位於腔室主體內的泵送板。此外，該製程站還包括位於腔室主體內的基板支撐件。該基板支撐件包括密封板和自適應密封組件。該自適應密封組件包含具有內圍和外圍的適應性隔膜，內圍與密封板相連接，外圍形成腔體；位於腔體內的彈簧元件；以及位於密封板與內圍之間，以及外圍與泵送板之間的適應性薄片。該彈簧元件被配置以偏置適應性薄片，使該適應性薄片朝向泵送板，形成適應性密封，該適應性密封將腔室空間的第一區域與第二區域隔離開來。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process station is provided. The process station includes a chamber body defining a chamber volume. The process station also includes a pumping plate disposed in the chamber body. Further, the process station includes a substrate support disposed in the chamber body. The substrate support includes a seal plate and a self-compliant seal assembly. The self-compliant seal assembly includes a compliant diaphragm having an inner rim and an outer rim, the inner rim being coupled with the seal plate and the outer rim forming a cavity; a spring element disposed in the cavity; and a compliant sheet disposed between the seal plate and the inner rim and between the outer rim and the pumping plate. The spring element is arranged to bias the compliant sheet toward the pumping plate to form a compliant seal that isolates a first region from a second region of the chamber volume.</p>
      </isu-abst>
      <representative-img>
        <p type="p">107:第一區域</p>
        <p type="p">108:第二區域</p>
        <p type="p">110:基板支撐件</p>
        <p type="p">112:支撐板</p>
        <p type="p">113:密封板</p>
        <p type="p">115:上方法蘭</p>
        <p type="p">184:泵送板</p>
        <p type="p">200:自適應密封組件</p>
        <p type="p">210:適應性隔膜</p>
        <p type="p">220:圓周間隔的緊固件</p>
        <p type="p">222:腔體</p>
        <p type="p">230:彈簧元件</p>
        <p type="p">232:適應性薄片</p>
        <p type="p">234:臂</p>
        <p type="p">236:偏壓元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1390" publication-number="202633450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可撓的散熱片介面</chinese-title>
        <english-title>FLEXIBLE HEATSINK INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260319B">H10W40/77</main-classification>
        <further-classification edition="202601120260319B">H10W40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊許尼亞克　伊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESHNIAK, ITAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯格埃里　蘇布拉瑪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENGERI, SUBRAMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多晶粒封裝可包括放置在垂直堆疊矽晶粒上的覆蓋或蓋子。蓋子連接到冷卻系統或散熱片，以將熱量從晶粒中散發出去。然而，隨著熱膨脹/收縮的發生，晶粒會與覆蓋失去接觸，而熱量會在覆蓋中圍繞晶粒聚集。為了解決這個問題，覆蓋可包括在覆蓋的底表面上的可撓膜。可撓膜可形成充滿加壓的導熱液體的內部空腔。液體可導致可撓膜膨脹，並符合晶粒由於溫度變化而移動晶粒的輪廓。可撓膜確保在覆蓋與晶粒之間保持熱導通道，以有效將熱量從晶粒散發出去。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Multi-die packages may include a cover or lid that is placed over vertical stacks of silicon dies. This lid connects to a cooling system or heatsink to dissipate heat away from the dies. However, as thermal expansion/contraction occurs, the dies may lose contact with the cover and heat may build up within the cover around the dies. To solve this problem, a cover may include a flexible membrane on the bottom surface of the cover. The flexible membrane may create an internal cavity filled with a pressurized thermally conductive liquid. The liquid may cause the flexible membrane to expand and conform to a profile of the dies as they move due to temperature changes. The flexible membrane ensures that a thermally conductive pathway is maintained between the cover and the dies to effectively dissipate heat away from the dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:多晶粒封裝</p>
        <p type="p">406:基板</p>
        <p type="p">408:晶粒</p>
        <p type="p">410:TIM</p>
        <p type="p">412:蓋子</p>
        <p type="p">418:散熱片</p>
        <p type="p">430:內部空腔</p>
        <p type="p">432:液體</p>
        <p type="p">433:可撓膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1391" publication-number="202632710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子撞擊X射線源中二次輻射抑制</chinese-title>
        <english-title>SECONDARY RADIATION MITIGATION IN ELECTRON-IMPACT X-RAY SOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">H01J35/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商艾希凜有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EXCILLUM AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢森　布瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSSON, BJORN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSEN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種透射型X射線源，其包括：一電子源，其用於提供一電子射束；一靶，其被組態成藉由與該電子射束相互作用而產生X射線輻射；一X射線可穿透出射窗口；複數個電子射束限制孔徑，其各自被組態成限制該電子射束之一角度分佈；一個二次輻射限制孔徑；一第一偏轉器，其被配置成使該電子射束自該二次輻射限制孔徑偏轉朝向該靶；一第二選用偏轉器，其被配置成使該電子射束自該等電子射束限制孔徑中選定之一電子射束限制孔徑偏轉朝向該二次輻射限制孔徑；以及一孔徑選擇器，其被組態成使該等電子射束限制孔徑中該選定之一電子射束限制孔徑與電子射束路徑重合；其中該等電子射束限制孔徑中之每一者及該二次輻射限制孔徑被配置成使得對於二次X射線輻射，不存在自該等電子射束限制孔徑至該出射窗口之直接視線。該孔徑選擇器可包括：一第三偏轉器，其被配置成使該電子射束偏轉朝向該等電子射束限制孔徑中之該選定之一電子射束限制孔徑；或者一致動器，其被配置成將該等電子射束限制孔徑中之該選定之一電子射束限制孔徑帶進該電子射束路徑中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmission-type X-ray source is disclosed, comprising an electron source for providing an electron beam; a target configured to generate X-ray radiation by interaction with the electron beam; an X-ray transparent exit window; a plurality of electron beam limiting apertures, each configured to limit an angular distribution of the electron beam; a secondary radiation limiting aperture; a first deflector arranged to deflect the electron beam from the secondary radiation limiting aperture towards the target; a second optional deflector arranged to deflect the electron beam from a selected one of the electron beam limiting apertures towards the secondary radiation limiting aperture; and an aperture selector configured to make the selected one of the electron beam limiting apertures and the electron beam path coincide; wherein each of the electron beam limiting apertures and the secondary radiation limiting aperture are arranged so that there is no direct line of sight for secondary X-ray radiation from the electron beam limiting apertures to the exit window. The aperture selector may comprise a third deflector arranged to deflect the electron beam towards the selected one of the electron beam limiting apertures, or an actuator arranged to bring the selected one of the electron beam limiting apertures into the electron beam path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:X射線源</p>
        <p type="p">102:電子射束產生器</p>
        <p type="p">104:電子射束</p>
        <p type="p">104a:第一路徑</p>
        <p type="p">104b:第二路徑</p>
        <p type="p">106:射束偏轉器</p>
        <p type="p">108:孔徑板</p>
        <p type="p">108a:第一孔徑開口/孔徑開口</p>
        <p type="p">108b:第二孔徑開口/孔徑開口</p>
        <p type="p">110:孔徑偏轉器</p>
        <p type="p">112:第二孔徑</p>
        <p type="p">114:靶偏轉器</p>
        <p type="p">116:聚焦透鏡</p>
        <p type="p">118:靶</p>
        <p type="p">120:X射線輻射</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1392" publication-number="202632259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用灰階測量和Ｘ射線表徵的材料表徵</chinese-title>
        <english-title>MATERIAL CHARACTERIZATION USING GREY LEVEL MEASUREMENT AND X-RAY CHARACTERIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260424B">G01N23/2251</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽門西　迪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEMESH, DROR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉爾　艾朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAL, ERAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜德瓦尼嘉貝　泰爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUVDEVANI-GABBAY, TAIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾隆　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EILON, MICHAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿蘇林　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSULIN, ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種用於使用高取樣速率掃瞄電子顯微鏡（SEM）和低取樣EDX來表徵樣品的非破壞性且局部化的方法，該方法是藉由構建相關曲線圖來進行的，由此允許對典型地要求EDX分析的特徵的迅速表徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a non-destructive and localized method for characterization of samples using high sampling rate scanning electron microscope (SEM) and low sampling EDX, by building a correlation plot, thereby allowing a fast characterization of features that typically require EDX analysis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:流程圖</p>
        <p type="p">202:步驟</p>
        <p type="p">204:步驟</p>
        <p type="p">206:步驟</p>
        <p type="p">208:步驟</p>
        <p type="p">210:步驟</p>
        <p type="p">212:步驟</p>
        <p type="p">214:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1393" publication-number="202631632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＫＲＡＳ調節化合物</chinese-title>
        <english-title>KRAS MODULATING COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D498/22</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/5365</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡納利斯　艾達　Ｙ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANALES, EDA Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　志敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, ZHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾巴特拉維　亞辛　Ｍ　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELBATRAWI, YASSIN M.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷文　奎因　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREVEN, QUINN B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘尼　泰茲坎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNEY, TEZCAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加登　達里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, DARRYL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金弗　赫諾克　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINFE, HENOK H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ER</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉澤威斯　史考特　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAZERWITH, SCOTT E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史旺克　克里斯多夫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANK, CHRISTOPHER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯姆士　崔　萊茵農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS-TRAN, RHIANNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佟廣虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, GUANGHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦特金恩斯　威廉　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, WILLIAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供可用作為KRAS抑制劑及/或降解劑之化合物及其醫藥上可接受之鹽、製造及使用其等（單獨或與額外藥劑組合）之方法、及其醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds, and pharmaceutically acceptable salts thereof, useful as KRAS inhibitors and/or degraders, methods of making and using the same (singly or in combination with additional agents), and pharmaceutical compositions thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1394" publication-number="202631030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自適應通風口</chinese-title>
        <english-title>ADAPTIVE VENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">A41D27/28</main-classification>
        <further-classification edition="200601120260421B">A41D27/08</further-classification>
        <further-classification edition="200601120260421B">D04H1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商耐克創新有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKE INNOVATE C.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩根　丹尼爾　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGAN, DANIEL P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文各方面提供了一種具有一個或多個通風系統的服裝製品，當服裝製品暴露於外部刺激時，該一個或多個通風系統動態地轉變到打開狀態。該通風系統包括自適應結構，該自適應結構附連到織物的靠近織物中的狹縫的表面。當暴露於外部刺激時，自適應結構和周圍織物的形狀和/或尺寸發生變化，導致狹縫動態地轉變到打開狀態並產生通風開口。一旦外部刺激被去除，自適應結構和底層織物恢復到它們暴露前的尺寸，從而導致通風開口轉變到閉合狀態。自適應結構可以相對於狹縫配置和定位，使得該自適應結構對狹縫任一側上的織物的形狀和尺寸的影響是不同的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects herein provide for an article of apparel having one or more vent systems that dynamically transition to an open state when the article of apparel is exposed to an external stimulus. The vent system includes an adaptive structure affixed to the surface of a textile proximate to a slit in the textile. The adaptive structure, and the surrounding textile, changes in shape and/or dimension when exposed to the external stimulus causing the slit to dynamically transition to an open state and creating a vent opening. Once the external stimulus is removed, the adaptive structures and the underlying textile return to their pre-exposure dimensions causing the vent opening to transition to a closed state. The adaptive structure can be configured and positioned relative to the slit so that its effect on the shape and dimensions of the textile on either side of the slit are different.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:織物</p>
        <p type="p">112:第一表面</p>
        <p type="p">114:第二表面</p>
        <p type="p">120:自適應結構</p>
        <p type="p">122:基部</p>
        <p type="p">124:第一臂</p>
        <p type="p">126:第二臂</p>
        <p type="p">128:頂點</p>
        <p type="p">130:基部邊緣</p>
        <p type="p">132:第一外邊緣</p>
        <p type="p">134:第二外邊緣</p>
        <p type="p">136:第一臂內邊緣</p>
        <p type="p">138:第二臂內邊緣</p>
        <p type="p">144:張力區</p>
        <p type="p">150:狹縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1395" publication-number="202631663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＳＴＡＴ３特異性結合之單域抗體、包括其之融合蛋白及其用途</chinese-title>
        <english-title>SINGLE DOMAIN ANTIBODY SPECIFICALLY BINDING TO STAT3, FUSION PROTEIN COMPRISING THE SAME, AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/18</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">C12P21/08</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P17/04</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商格納西尼有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENEXINE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔宰鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍𣫙朎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, YERYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮熏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全宥柰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀玹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUHYOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孶㡕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JAYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及STAT3特異性結合之單域抗體或者其抗原結合片段、包括所述單域抗體或者其抗原結合片段之融合蛋白質、以及所述融合蛋白質之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to single-domain antibodies specifically binding to STAT3 or antigen-binding fragments thereof, fusion proteins comprising the single-domain antibodies or the antigen-binding fragments, and uses of the fusion proteins.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1396" publication-number="202631610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>葡萄糖依賴性促胰島素多肽受體拮抗劑及其用途</chinese-title>
        <english-title>GLUCOSE-DEPENDENT INSULINOTROPIC POLYPEPTIDE RECEPTOR ANTAGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D417/12</main-classification>
        <further-classification edition="200601120260504B">C07D401/12</further-classification>
        <further-classification edition="200601120260504B">C07D403/12</further-classification>
        <further-classification edition="200601120260504B">A61K31/427</further-classification>
        <further-classification edition="200601120260504B">A61K31/4725</further-classification>
        <further-classification edition="200601120260504B">A61K31/4035</further-classification>
        <further-classification edition="200601120260504B">A61K31/428</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61K9/00</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲里斯基　凱文　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILIPSKI, KEVIN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里維　山繆　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVI, SAMUEL MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘查努拉　阿瓦塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANCHAGNULA, ADVAITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斯　馬修　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REESE, MATTHEW RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述式I化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="319px" width="320px" file="ed10129.JPG" alt="ed10129.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、A&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;、L&lt;sup&gt;Q1&lt;/sup&gt;、L&lt;sup&gt;Q2&lt;/sup&gt;、T&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;3&lt;/sup&gt;、T&lt;sup&gt;4&lt;/sup&gt;、n1、t1及t2係本文中所定義；其等作為GIPR拮抗劑之用途；包含此等化合物及鹽之醫藥組合物；及此等化合物及鹽於治療或預防(例如)肥胖、體重增加及/或T2DM之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compounds of Formula I: &lt;br/&gt;&lt;img align="absmiddle" height="330px" width="327px" file="ed10130.JPG" alt="ed10130.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, A&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;2&lt;/sup&gt;, L&lt;sup&gt;Q1&lt;/sup&gt;, L&lt;sup&gt;Q2&lt;/sup&gt;, T&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;3&lt;/sup&gt;, T&lt;sup&gt;4&lt;/sup&gt;, n1, t1,and t2 are defined herein; their use as GIPR antagonists; pharmaceutical compositions containing such compounds and salts; and the use of such compounds and salts to treat or prevent, for example, obesity, weight gain, and/or T2DM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1397" publication-number="202631583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>葡萄糖依賴性促胰島素多肽受體拮抗劑及其用途</chinese-title>
        <english-title>GLUCOSE-DEPENDENT INSULINOTROPIC POLYPEPTIDE RECEPTOR ANTAGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D207/16</main-classification>
        <further-classification edition="200601120260504B">C07D401/12</further-classification>
        <further-classification edition="200601120260504B">C07D265/30</further-classification>
        <further-classification edition="200601120260504B">C07D211/60</further-classification>
        <further-classification edition="200601120260504B">C07D401/06</further-classification>
        <further-classification edition="200601120260504B">A61K31/40</further-classification>
        <further-classification edition="200601120260504B">A61K31/4439</further-classification>
        <further-classification edition="200601120260504B">A61K31/5365</further-classification>
        <further-classification edition="200601120260504B">A61K31/4709</further-classification>
        <further-classification edition="200601120260504B">A61K31/445</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲里斯基　凱文　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILIPSKI, KEVIN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里維　山繆　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVI, SAMUEL MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬堤奈茲　艾爾席那　路易斯　安琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ ALSINA, LUIS ANGEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘查努拉　阿瓦塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANCHAGNULA, ADVAITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普萊奧　湯瑪斯　瑞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULEO, THOMAS RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斯　馬修　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REESE, MATTHEW RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩蒙斯　馬修　佛瑞斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMMONS, MATTHEW FORREST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述式I或YI化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="340px" width="580px" file="ed10205.JPG" alt="ed10205.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥學上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、A&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;3&lt;/sup&gt;、T&lt;sup&gt;4&lt;/sup&gt;、n1、t1、t2、R&lt;sup&gt;Y1&lt;/sup&gt;、R&lt;sup&gt;Y2&lt;/sup&gt;、R&lt;sup&gt;Y3&lt;/sup&gt;、R&lt;sup&gt;Y4&lt;/sup&gt;、T&lt;sup&gt;Y1&lt;/sup&gt;及yt1如本文中所定義；其作為GIPR拮抗劑之用途；含有此類化合物及鹽之醫藥組合物；及此類化合物及鹽用於治療或預防例如肥胖、體重增加及/或T2DM的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compounds of Formula I or YI: &lt;br/&gt;&lt;img align="absmiddle" height="374px" width="562px" file="ed10206.JPG" alt="ed10206.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, A&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;3&lt;/sup&gt;, T&lt;sup&gt;4&lt;/sup&gt; , n1, t1, t2, R&lt;sup&gt;Y1&lt;/sup&gt;, R&lt;sup&gt;Y2&lt;/sup&gt;, R&lt;sup&gt;Y3&lt;/sup&gt;, R&lt;sup&gt;Y4&lt;/sup&gt;, T&lt;sup&gt;Y1&lt;/sup&gt;, and yt1 are defined herein; their use as GIPR antagonists; pharmaceutical compositions containing such compounds and salts; and the use of such compounds and salts to treat or prevent, for example, obesity, weight gain, and/or T2DM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1398" publication-number="202631676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗人ＦＧＦＲ２ｂ抗體及其用途</chinese-title>
        <english-title>ANTI-HUMAN FGFR2B ANTIBODY AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海艾樂晞生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI AILUX BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安昭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, ZHAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭則羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, ZEYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李璐璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LULU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛駕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柳靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIUJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓笑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐江帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JIANGFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易思敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, SIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, QUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於生物醫藥領域，涉及抗人FGFR2b抗體及其應用。本發明還涉及編碼該抗體的核酸分子、載體、宿主細胞、組合物，及它們用於治療疾病的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention belongs to the field of biomedicine, and relates to an anti-human FGFR2b antibody and uses thereof. The present invention further relates to a nucleic acid molecule encoding the antibody, a vector, a host cell, a composition, and uses thereof in the treatment of diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1399" publication-number="202631091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胃滯留裝置</chinese-title>
        <english-title>GASTRIC RESIDENCE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61D7/00</main-classification>
        <further-classification edition="200601120260504B">A01K11/00</further-classification>
        <further-classification edition="200601120260504B">A61J3/07</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61M31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商路米南生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMINANT BIOTECH CORP LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞迪卡利　畢修　萊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADHIKARI, BISHAL RAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫傑　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEGEL, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇賽爾　大衛　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLSELL, DAVID CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　查爾斯　理查　修林斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, CHARLES RICHARD HUGHLINGS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴因布利吉　克里斯多弗　威廉　安德森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAINBRIDGE, CHRISTOPHER WILLIAM ANDERSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用以將一丸劑留置於一動物中，特別是一反芻動物之瘤胃中的裝置及系統。又提供使用本發明之一留置裝置之方法及製造本發明之一留置裝置之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a device and system to retain a bolus in an animal, particularly in the rumen of a ruminant animal. Also provided are methods of using a retention device of the disclosure and methods of manufacturing a retention device of the disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:胃滯留裝置</p>
        <p type="p">102a:留置部件</p>
        <p type="p">102b:留置部件</p>
        <p type="p">104:連接部件</p>
        <p type="p">106:丸劑</p>
        <p type="p">107:罩殼</p>
        <p type="p">108a:主體部分</p>
        <p type="p">108b:主體部分</p>
        <p type="p">110a:耦合部分</p>
        <p type="p">110b:耦合部分</p>
        <p type="p">112a:尖端部分</p>
        <p type="p">112b:尖端部分</p>
        <p type="p">122a:線</p>
        <p type="p">122b:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1400" publication-number="202632712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體供應裝置以及用於粒子束誘導處理樣本的設備和方法</chinese-title>
        <english-title>GAS SUPPLY DEVICE AND APPARATUS AND METHOD FOR PARTICLE BEAM-INDUCED PROCESSING OF A SAMPLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H01J37/02</main-classification>
        <further-classification edition="200601120260417B">H01J37/305</further-classification>
        <further-classification edition="201201120260417B">G03F1/74</further-classification>
        <further-classification edition="201201120260417B">G03F1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里諾夫　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHINOW, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於對樣本(202)進行粒子束誘導處理的設備(200)的氣體供應裝置(100)，其包含：液體容器(102)，其內容納有飽和鹽溶液(104)，用於在該鹽溶液(104)的表面(108)處產生製程氣體(106)；以及氣體饋送管線(120)，其連接至該液體容器(102)以傳輸氣體，並用以將所產生的製程氣體(106)饋送至該裝置(200)的工作位置(206)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas supply device (100) for an apparatus (200) for particle beam-induced processing of a sample (202), comprising a liquid container (102) with a saturated salt solution (104) received therein for producing a process gas (106) at a surface (108) of the salt solution (104); and a gas feed line (120) connected to the liquid container (102) for gas transfer and serving to feed the produced process gas (106) to a work location (206) of the apparatus (200).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體供應裝置</p>
        <p type="p">102:液體容器</p>
        <p type="p">104:飽和鹽溶液</p>
        <p type="p">106:製程氣體</p>
        <p type="p">108:表面</p>
        <p type="p">110:液體儲存器</p>
        <p type="p">112:溶劑</p>
        <p type="p">114:鹽</p>
        <p type="p">116:水</p>
        <p type="p">118:固體</p>
        <p type="p">120:氣體饋送管線</p>
        <p type="p">122:超音波和/或兆音波單元</p>
        <p type="p">124:溫度控制單元</p>
        <p type="p">126:珀爾帖元件</p>
        <p type="p">128:孔板</p>
        <p type="p">130:閥門</p>
        <p type="p">EP1:平衡蒸汽壓</p>
        <p type="p">RH1:相對濕度</p>
        <p type="p">T1:溫度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1401" publication-number="202631349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>側壁安裝式輸送裝置</chinese-title>
        <english-title>SIDEWALL MOUNTED TRANSPORT APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B25J9/16</main-classification>
        <further-classification edition="200601120260504B">B25J5/00</further-classification>
        <further-classification edition="202601120260504B">H10P72/30</further-classification>
        <further-classification edition="200601120260504B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫魯比雪　亞力山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUPYSHEV, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾略特　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIOTT, MARTIN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈利西　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALLISEY, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法拉古薩　弗朗西斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALAGUSSA, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基士德　阿里色吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILCHRIST, ULYSSES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板輸送裝置包括密封腔室和安裝在密封腔室中的機器人。機器人具有多連桿臂，多連桿臂具有末端旋轉關節，固定於密封腔室中並且多連桿臂繞著它成單元地旋轉。末端旋轉關節是基於滾輪車，坐落在密封腔室中的預定位置並且以運動耦合件而固定在密封腔室的預定位置，使得末端旋轉關節固定於密封腔室中。釋放了運動耦合件，則滾輪車和與滾輪車成單元的機器人經由在密封腔室外對拖車的耦合件、穿過配置成供插入和移除成單元之滾輪車和機器人的機器人移除埠而在密封腔室裡自由地滾動以來往於預定位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate transport apparatus includes a sealed chamber and a robot installed in the sealed chamber. The robot has a multi-link arm having an end rotary joint, that is fixed in the sealed chamber and about which the multi-link arm rotates as a unit. The end rotary joint is based on a roller cart seated in a predetermined position in the sealed chamber and fixed in the predetermined position to the sealed chamber with a kinematic coupling so that the end rotary joint is fixed in the sealed chamber. With the kinematic coupling released, the roller cart, and the robot as a unit with the roller cart, rolls freely inside the sealed chamber to and from the predetermined position through a robot removal port disposed for insertion and removal of the roller cart and robot as a unit, via a coupling to a tug outside the sealed chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理裝置</p>
        <p type="p">106:迷你環境</p>
        <p type="p">125:輸送腔室</p>
        <p type="p">125B:底部</p>
        <p type="p">125F:外部本體或框架</p>
        <p type="p">125S:側壁或側面</p>
        <p type="p">125PRT:可密封埠</p>
        <p type="p">125SL:側面、縱向端</p>
        <p type="p">125SP:臂存取埠</p>
        <p type="p">150:裝載鎖定器</p>
        <p type="p">188:輸送裝置</p>
        <p type="p">188R:替換輸送裝置</p>
        <p type="p">188FL:凸緣</p>
        <p type="p">188TA:轉移臂</p>
        <p type="p">199:控制器</p>
        <p type="p">260:分散式控制網路</p>
        <p type="p">MV:機器視覺</p>
        <p type="p">SV:槽縫閥</p>
        <p type="p">TA:輸送裝置</p>
        <p type="p">TP:基板轉移平面</p>
        <p type="p">PP:預定位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1402" publication-number="202631032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>免手模壓鞋</chinese-title>
        <english-title>HANDS-FREE MOLDED SHOE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">A43B11/02</main-classification>
        <further-classification edition="200601120260421B">A43B1/14</further-classification>
        <further-classification edition="200601120260421B">A43B13/14</further-classification>
        <further-classification edition="200601120260421B">A43B21/20</further-classification>
        <further-classification edition="200601120260421B">A43B21/24</further-classification>
        <further-classification edition="200601120260421B">A43B23/17</further-classification>
        <further-classification edition="201001120260421B">B29D35/12</further-classification>
        <further-classification edition="201001120260421B">B29D35/06</further-classification>
        <further-classification edition="200601120260421B">B29C65/00</further-classification>
        <further-classification edition="200601120260421B">A43B13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商史柯契爾　ＩＩ　美國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKECHERS U.S.A., INC. II</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林伯格　查斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENBERG, CHASE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡薩斯　亞伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASAS, ABEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種免手模壓鞋，其可包括一均勻模壓之套穿鞋，該均勻模壓之套穿鞋具有便於免手穿著之特徵。此等特徵可包括在該鞋之一鞋後踵片部分中使用硬度較高之一塑膠，而在該鞋之一鞋面及/或鞋底部分中使用硬度較低之塑膠。該鞋後踵片部分可經組態以在一使用者之腳伸入一鞋口時在該腳之負荷下變形為一新組態，且一旦該腳在該鞋內即恢復至其原始組態。該鞋後踵片部分在一最靠後位置處可進一步具有一S波形豎直截面。HFMS之製造方法可包括使用一鞋面嵌件及一鞋底嵌件以及一鞋跟嵌件，該鞋跟嵌件具有用於將該鞋跟嵌件固定至一鞋模之一芯部部分之一固定機構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A HANDS-FREE MOLDED SHOE may include a uniformly molded slip-on shoe having features to facilitate hands-free wearing. Such features may include use of a greater hardness plastic in a heel counter portion of the shoe and lesser hardness plastic in an upper and/or sole portion of the shoe. The heel counter portion may be configured to deform into a new configuration under the load of a user's foot as it enters a shoe opening, and return to its original configuration once the foot is inside the show. The heel counter portion may further have an S-wave shaped vertical cross section at a rearmost position. Methods of manufacture of a HFMS may include the use of an upper insert and a sole insert as well as a heel insert having a securing mechanism to secure the heel insert to a core portion of a shoe mold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鞋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1403" publication-number="202631902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含類玻璃體之可發泡調配物</chinese-title>
        <english-title>FOAMABLE FORMULATIONS CONTAINING VITRIMERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08L101/02</main-classification>
        <further-classification edition="202501120260428B">C08L23/0853</further-classification>
        <further-classification edition="200601120260428B">C08K3/22</further-classification>
        <further-classification edition="200601120260428B">C08K5/053</further-classification>
        <further-classification edition="200601120260428B">C08K5/09</further-classification>
        <further-classification edition="200601120260428B">C08K5/098</further-classification>
        <further-classification edition="200601120260428B">C08K5/14</further-classification>
        <further-classification edition="200601120260428B">C08K5/23</further-classification>
        <further-classification edition="200601120260428B">C08J9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布拉斯科美國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRASKEM AMERICA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SING, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達席爾瓦　朱莉安娜　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DA SILVA, JULIANA CAPRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘迺迪　傑米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEDY, JAYME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞希　安德烈　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RECH, ANDRE RECOARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克勞林　金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLOUGHLIN, KIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可發泡調配物，其包括(A1)一聚合物組成物，其由一轉酯化聚合物所製成，所述轉酯化聚合物係以下之一反應產物：一交聯發泡體原料、一轉酯化催化劑及一原料醇；(B1)一發泡劑；以及(C1)一非交聯聚合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A foamable formulation includes (A1) a polymer composition, made of: a transesterified polymer being a reaction product of: a crosslinked foam feedstock, a transesterification catalyst, and a feedstock alcohol, (B1) a foaming agent, and (C1) a non-crosslinked polymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:緻密化發泡體</p>
        <p type="p">2:轉酯化反應，階段</p>
        <p type="p">3:類玻璃體</p>
        <p type="p">4:結合，階段</p>
        <p type="p">5:可發泡調配物</p>
        <p type="p">6:發泡步驟，階段</p>
        <p type="p">7:發泡體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1404" publication-number="202631604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎嗒</chinese-title>
        <english-title>NOVEL PYRIDAZINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07D405/14</main-classification>
        <further-classification edition="200601120260429B">C07D401/14</further-classification>
        <further-classification edition="200601120260429B">C07D471/10</further-classification>
        <further-classification edition="200601120260429B">C07D487/10</further-classification>
        <further-classification edition="200601120260429B">C07D487/08</further-classification>
        <further-classification edition="200601120260429B">A61K31/501</further-classification>
        <further-classification edition="200601120260429B">C07D487/04</further-classification>
        <further-classification edition="200601120260429B">A61P11/00</further-classification>
        <further-classification edition="200601120260429B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫拉夫　克莉絲汀　安德里亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUTTRUFF, CHRISTIAN ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷特斯奈德　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRETSCHNEIDER, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格波特　西德克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODBOUT, CEDRICKX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫爾曼　漢尼斯　菲普科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOOLMAN, HANNES FIEPKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬堤爾斯　唐尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTYRES, DOMNIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　傑羅德　裘根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTH, GERALD JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於新穎嗒𠯤、其製備方法、含有其之醫藥組合物及其在療法，尤其在治療及/或預防由自分泌運動因子介導之疾病及病症中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel pyridazines, processes for their preparation, pharmaceutical compositions containing them and their use in therapy, particularly in the treatment and/or prevention of diseases and disorders mediated by Autotaxin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1405" publication-number="202631590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有雜芳環結構的可電離脂質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D249/04</main-classification>
        <further-classification edition="200601120260504B">A61K9/14</further-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京劑泰生命科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING JITAI LIFE SCIENCES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商劑泰科技（北京）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METIS TECHBIO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘少利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHAOLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘安东</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冯瑞璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, RUILU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卢昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋晓朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, XIAOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種含有雜芳環結構的可電離脂質，具體涉及式(I)化合物，或其同位素變體、互變異構物或立體異構物，或其藥學上可接受的鹽。本發明還提供了包含前述化合物的奈米顆粒藥物組合物，以及前述化合物及其組合物在肌肉特異性遞送荷載中的應用。  &lt;br/&gt;&lt;img align="absmiddle" height="127px" width="269px" file="ed10383.JPG" alt="ed10383.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1406" publication-number="202631135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿托品藥物組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/46</main-classification>
        <further-classification edition="200601120260504B">A61K9/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州歐康維視生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡兆鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王孔忱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>繆熙熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪遠林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍英楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世有</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雪琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊露萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張黎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱長龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫玉俠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於藥物製劑領域，具體涉及一種阿托品藥物組合物，其含有阿托品藥學上可接受的鹽、磺酸基陽離子交換樹脂和助懸劑，其中，所述助懸劑選自卡波姆、聚維酮、羥乙纖維素中的一種或幾種。本發明的阿托品藥物組合物配方能夠明顯降低藥液中的游離阿托品含量，因而能將有關物質的含量控制在較低的範圍內，使藥物在室溫條件下具有較優的穩定性，且具有更優的藥物釋放效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1407" publication-number="202633363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降及旋轉總成、包括升降及旋轉總成之腔室配置及半導體處理系統，以及製造升降及旋轉總成且使用升降及旋轉總成沉積材料層之方法</chinese-title>
        <english-title>LIFT AND ROTATE ASSEMBLES, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING LIFT AND ROTATE ASSEMBLIES, AND METHODS OF MAKING LIFT AND ROTATE ASSEMBLIES AND DEPOSITING MATERIAL LAYERS USING LIFT AND ROTATE ASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/70</main-classification>
        <further-classification edition="200601120260504B">C23C16/54</further-classification>
        <further-classification edition="200601120260504B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾文斯　布萊德利　韋恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, BRADLEY WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄舒瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周靖誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JINGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫達拉　帕塔　薩拉西　雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDALA, PARTHA SARATHY REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種升降及旋轉總成包括一軸架、一陶瓷軸、一分段套管及一凸緣式套管。該軸架界定穿過其中之一孔，該陶瓷軸收納於該軸架之該孔內，該分段套管安放於該軸架中且圍繞該陶瓷軸延伸，且該凸緣式套管界定一旋轉軸線且將該軸架以螺紋方式收納於其中。該分段套管圍繞該軸架之該孔內的該陶瓷軸壓縮固定及徑向摺疊，以限制由該陶瓷軸承載之一基板支撐件在圍繞該旋轉軸線旋轉期間的傾斜及擺動。亦描述包括升降及旋轉總成之腔室配置及半導體處理系統、製造升降及旋轉總成之方法以及使用升降及旋轉總成沉積材料層之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lift and rotate assembly includes a shaft carrier, a ceramic shaft, a segmented sleeve, and a flanged sleeve. The shaft carrier defines a bore therethrough, the ceramic shaft is received within the bore of the shaft carrier, the segmented sleeve is seated in the shaft carrier and extends about the ceramic shaft, and the flanged sleeve defines a rotation axis and threadedly receives therein the shaft carrier. The segmented sleeve is compressively fixed and radially collapsed about the ceramic shaft within bore of the shaft carrier to limit tilt and wobble of a substrate support carried by the ceramic shaft during rotation about the rotation axis. Chamber arrangements and semiconductor processing systems including lift and rotate assemblies, methods of making lift and rotate assemblies, and methods of depositing material layers using lift and rotate assemblies are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">114:基板支撐件</p>
        <p type="p">116:旋轉軸線</p>
        <p type="p">200:陶瓷軸</p>
        <p type="p">202:第一端</p>
        <p type="p">204:第二端</p>
        <p type="p">206:桿</p>
        <p type="p">216:寬度</p>
        <p type="p">300:軸架</p>
        <p type="p">340:內部彈性部件</p>
        <p type="p">400:分段套管</p>
        <p type="p">500:凸緣式套管</p>
        <p type="p">518:中間彈性部件</p>
        <p type="p">528:緊固件圖案</p>
        <p type="p">532:穿孔圖案</p>
        <p type="p">600:圓柱形套管</p>
        <p type="p">606:中間彈性部件</p>
        <p type="p">608:圓柱形主體</p>
        <p type="p">610:面向腔室表面</p>
        <p type="p">616:端面</p>
        <p type="p">618:槽齒</p>
        <p type="p">700:軸承配置</p>
        <p type="p">800:驅動齒輪</p>
        <p type="p">802:環形腹板部分</p>
        <p type="p">804:齒形周邊</p>
        <p type="p">806:驅動齒輪孔徑</p>
        <p type="p">900:旗標結構</p>
        <p type="p">902:環形部分</p>
        <p type="p">904:柄部分</p>
        <p type="p">1000:升降及旋轉總成</p>
        <p type="p">1300:傾斜及擺動套組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1408" publication-number="202631918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨方法、漿料及磨粒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09G1/02</main-classification>
        <further-classification edition="200601120260504B">C09K3/14</further-classification>
        <further-classification edition="201201120260504B">B24B37/00</further-classification>
        <further-classification edition="200601120260504B">C01B33/12</further-classification>
        <further-classification edition="202601120260504B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原真衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIWARA, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野雅博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種研磨方法，其包括使用漿料對具有含有樹脂材料之樹脂部之被研磨構件的前述樹脂部進行研磨之研磨步驟，前述漿料含有具有氧化矽粒子及存在於前述氧化矽粒子的表面之鋁成分之磨粒，前述鋁成分包含選自由乙酸鋁、氯化鋁及該等衍生物組成的組中之至少一種。一種漿料，其用於對具有含有樹脂材料之樹脂部之被研磨構件的前述樹脂部進行研磨，其中，前述漿料含有具有氧化矽粒子及存在於前述氧化矽粒子的表面之鋁成分之磨粒，前述鋁成分包含選自由乙酸鋁、氯化鋁及該等衍生物組成的組中之至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1409" publication-number="202633110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造高電子遷移率電晶體的基板</chinese-title>
        <english-title>SUBSTRATE FOR THE MANUFACTURE OF A HIGH ELECTRON MOBILITY TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D30/01</main-classification>
        <further-classification edition="202501120260427B">H10D30/47</further-classification>
        <further-classification edition="202501120260427B">H10D62/85</further-classification>
        <further-classification edition="202501120260427B">H10D84/08</further-classification>
        <further-classification edition="202501120260427B">H10D84/80</further-classification>
        <further-classification edition="202601120260427B">H10P90/00</further-classification>
        <further-classification edition="202601120260427B">H10W10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商梭意泰科公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布代　蒂埃里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUDET, THIERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製造高電子遷移率電晶體(HEMT)的基板，其依次包含：  &lt;br/&gt;● 單晶矽載體基板(10)，  &lt;br/&gt;● 中間氮化矽(Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;)層(20)，其展現0.5 µm與3 µm之間的厚度，及  &lt;br/&gt;● 單晶GaN晶種層(30)，  &lt;br/&gt;該中間層(20)在該載體基板(10)與該晶種層(30)之間形成接合界面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a substrate for the manufacture of a high electron mobility transistor (HEMT), successively comprising: &lt;br/&gt;● a single-crystal silicon carrier substrate (10), &lt;br/&gt;● an intermediate silicon nitride (Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;) layer (20) exhibiting a thickness of between 0.5 and 3 µm, and &lt;br/&gt;● a single-crystal GaN seed layer (30), &lt;br/&gt;the intermediate layer (20) forming a bonding interface between the carrier substrate (10) and the seed layer (30).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:單晶矽載體基板/載體基板</p>
        <p type="p">20a:中間氮化矽層/中間層</p>
        <p type="p">20b:中間氮化矽層/中間層</p>
        <p type="p">35a:單晶GaN緩衝層/緩衝層</p>
        <p type="p">35b:單晶GaN緩衝層/緩衝層</p>
        <p type="p">61:源電極</p>
        <p type="p">62:汲電極</p>
        <p type="p">63:閘電極</p>
        <p type="p">81:電子組件</p>
        <p type="p">82:電子組件</p>
        <p type="p">83:電子組件</p>
        <p type="p">90:電絕緣壁/絕緣壁/壁</p>
        <p type="p">100A:HEMT</p>
        <p type="p">100B:HEMT</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1410" publication-number="202631571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速代謝的可電離脂質化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C229/12</main-classification>
        <further-classification edition="200601120260504B">C07C237/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京劑泰生命科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING JITAI LIFE SCIENCES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商劑泰科技（北京）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METIS TECHBIO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘安东</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘少利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHAOLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一類可電離脂質化合物，具體涉及式(I)化合物，或其藥學上可接受的鹽、同位素變體、互變異構物或立體異構物。本發明還提供了包含前述化合物的奈米顆粒藥物組合物，以及前述化合物及其組合物在遞送核酸中的應用。  &lt;br/&gt;&lt;img align="absmiddle" height="128px" width="213px" file="ed10242.JPG" alt="ed10242.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1411" publication-number="202631913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗料組成物及模具內被覆方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C09D175/04</main-classification>
        <further-classification edition="202001120260304B">C08J7/04</further-classification>
        <further-classification edition="200601120260304B">C08G18/66</further-classification>
        <further-classification edition="200601120260304B">C08G18/38</further-classification>
        <further-classification edition="201801120260304B">C09D7/63</further-classification>
        <further-classification edition="200601120260304B">B29C39/10</further-classification>
        <further-classification edition="200601120260304B">B29C39/24</further-classification>
        <further-classification edition="200601320260304B">B29K105/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商關西塗料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANSAI PAINT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志村邦夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMURA, KUNIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小村克斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMURA, KATSUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下麟太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村貴志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種塗料組成物，該組成物可形成耐傷痕性、對聚碳酸酯樹脂基材之密著性(高溫耐水密著性)、耐熱黃變性及與模具之脫模性優異的塗膜，且組成物之VOC含量低。&lt;br/&gt;  [解決手段]一種塗料組成物，包含：含異氰酸酯反應性基之化合物(A)及多異氰酸酯化合物(B)，前述多異氰酸酯化合物(B)包含一分子中含有2個以上異氰酸酯基與1個以上烷氧基矽基之多異氰酸酯化合物(B1)，且該塗料組成物之固體成分濃度為90質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1412" publication-number="202631436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調整裝置及載具</chinese-title>
        <english-title>ADJUSTING DEVICE AND CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B62B9/10</main-classification>
        <further-classification edition="200601120260421B">B62B9/00</further-classification>
        <further-classification edition="200601120260421B">A47D13/02</further-classification>
        <further-classification edition="201801120260421B">B60N2/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陰洪濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, HONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林炳森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BINGSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種調整裝置包括：鎖定件，具有鎖定位置與解鎖位置；調整件，具有固定端、操作端以及位於固定端和操作端之間的至少兩個滑接部和至少一個卡接部，且滑接部和卡接部交替設置；其中，滑接部與鎖定件滑動配合，使得鎖定件可在滑接部相對於調整件滑動，當鎖定件在鎖定位置時，卡接部阻擋鎖定件從卡接部遠離操作端的一側朝操作端相對於調整件滑動；當鎖定件在解鎖位置時，鎖定件可從卡接部遠離操作端的一側朝操作端相對於調整件滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adjusting device includes: a locking member having a locking position and an unlocking position; and an adjusting member including a fixed end, an operation end, at least two sliding connection parts and at least one engaging part that are alternately disposed between the fixed end and the operation end. Each sliding connection part is in sliding fit with the locking member, allowing the locking member to slide relative to the adjusting member on the sliding connection part. In the locking position of the locking member, the engaging part blocks the locking member from sliding relative to the adjusting member from a side of the engaging part away from the operation end towards the operation end. In the unlocking position of the locking member, the locking member is slidable relative to the adjusting member from the side of the engaging part away from the operation end towards the operation end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:載具</p>
        <p type="p">1100:坐部</p>
        <p type="p">1200:靠背</p>
        <p type="p">1300:框架</p>
        <p type="p">2000:調整裝置</p>
        <p type="p">2500:調整件</p>
        <p type="p">2530:操作端</p>
        <p type="p">2540:固定端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1413" publication-number="202632426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平坦化方法、平坦化系統及物品製造方法</chinese-title>
        <english-title>PLANARIZATION METHOD, PLANARIZATION SYSTEM, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/16</main-classification>
        <further-classification edition="200601120260504B">B05C11/08</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田慎一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在使用包括多個處理設備的平坦化系統的平坦化方法中，平坦化系統係配置為能夠使用多個處理設備執行至少兩個步驟：藉由將覆板與放置在第一基板上的可固化組成物接觸，形成第一平坦化膜，以及使用旋塗方法，在第二基板上旋塗可固化組成物的液膜。平坦化方法包括執行至少兩個步驟中的任何一者，以執行第一基板或第二基板的平坦化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a planarization method using a planarization system including a plurality of processing apparatuses, the planarization system is configured to be able to perform, using the plurality of processing apparatuses, at least two steps of forming a first planarizing film by bringing a superstrate into contact with a curable composition placed on a first substrate, and spin coating a liquid film of a curable composition on a second substrate using a spin coat method. The planarization method includes performing any one of the at least two steps to perform planarization of the first substrate or the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:平坦化系統</p>
        <p type="p">15:輸送路徑</p>
        <p type="p">101:搬入區</p>
        <p type="p">102:第一輸送機器人</p>
        <p type="p">103:第一輸送路徑</p>
        <p type="p">104:第二輸送機器人</p>
        <p type="p">105:第二輸送路徑</p>
        <p type="p">106:第三輸送機器人</p>
        <p type="p">107:第四輸送機器人</p>
        <p type="p">108:放置區</p>
        <p type="p">109:液滴放置設備、供給區</p>
        <p type="p">110:第一平坦化設備</p>
        <p type="p">111:第二平坦化設備</p>
        <p type="p">112:第四平坦化設備</p>
        <p type="p">113:第三平坦化設備</p>
        <p type="p">114:熱處置設備</p>
        <p type="p">115:緊密黏附層形成設備</p>
        <p type="p">116:旋塗機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1414" publication-number="202631677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合物及其用途</chinese-title>
        <english-title>CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07D491/22</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商解方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭努蒂　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNUTTI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特金斯　傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, JEFF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑森　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, KATTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種式(X)之藥物-連接子：  &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="181px" file="ed10336.JPG" alt="ed10336.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;或其醫藥學上可接受之鹽，其中式(X)之變數如本申請案中所定義。此等化合物可用作抗癌劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a Drug-Linker of Formula (X): &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="228px" file="ed10337.JPG" alt="ed10337.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt thereof，wherein the variables of Formula (X) are as defined in the application. Such compounds can be useful as anti-cancer agents.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1415" publication-number="202632039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於由下而上金屬生長的低Ｋ介電膜修復</chinese-title>
        <english-title>LOW-K DIELECTRIC FILM REPAIR FOR BOTTOM-UP METAL GROWTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C16/02</main-classification>
        <further-classification edition="200601120260427B">C23C16/04</further-classification>
        <further-classification edition="200601120260427B">C23C16/06</further-classification>
        <further-classification edition="200601120260427B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧欣儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　求景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, KENT QIUJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎　紀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, CHI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LI-QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面回復製程，其恢復介電表面的疏水性並促進如鉬等金屬填充物的選擇性沉積到含金屬表面上，同時減少或防止在介電表面上生長。此外，該表面回復製程減少在隨後的濕蝕刻製程（例如DHF）之膜損失。可視情況伴隨UV（同時或依序）進行回復前驅物的浸泡，以與損壞的介電表面上的矽醇反應，以補充-CH3並恢復介電表面的疏水性。回復前驅物是含碳回復前驅物，例如有機鹵代矽烷、酯、矽烷基醚、有機胺基矽烷、矽烷基酯、烴或前述者之組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surface recovery process that restores the hydrophobicity of dielectric surfaces and promotes selective deposition of metal-fill such as molybdenum onto metal-containing surfaces while reducing or preventing growth on the dielectric surfaces. Additionally, the surface recovery process reduces film loss against subsequent wet etching processes such as DHF. The recovery precursor soak is performed with optional UV (concurrent or sequential) to react with silanols on damaged dielectric surface to replenish -CH3 and recover hydrophobicity of the dielectric surface. The recovery precursor is a carbon-containing recovery precursor, for example, organohalosilanes, esters, silyl ethers, organoaminosilanes, silyl esters, hydrocarbons, or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">230:操作</p>
        <p type="p">300:半導體元件結構</p>
        <p type="p">301:介電層</p>
        <p type="p">302:元件基板</p>
        <p type="p">302b:背側</p>
        <p type="p">302f:前側</p>
        <p type="p">303:金屬層</p>
        <p type="p">304:介電層</p>
        <p type="p">304u:上表面</p>
        <p type="p">305:層</p>
        <p type="p">306:特徵</p>
        <p type="p">306s:側壁表面</p>
        <p type="p">307:電氣連接</p>
        <p type="p">D1:深度</p>
        <p type="p">W1:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1416" publication-number="202631634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氮大環化合物、其藥物組合物及用途</chinese-title>
        <english-title>NITROGEN-CONTAINING MACROCYCLIC COMPOUNDS, PHARMACEUTICAL COMPOSITION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D513/22</main-classification>
        <further-classification edition="200601120260504B">C07D498/22</further-classification>
        <further-classification edition="200601120260504B">C07D487/22</further-classification>
        <further-classification edition="200601120260504B">A61K31/504</further-classification>
        <further-classification edition="200601120260504B">A61K31/5386</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商煙臺榮昌製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RONGCHANG PHARMACEUTICALS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑　劍明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, JIANMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王遴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉小紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAOHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了含氮大環化合物、其藥物組合物及用途。本發明提供了如式0所示的化合物、其溶劑化物、其藥學上可接受的鹽或其藥學上可接受的鹽的溶劑化物。本發明的化合物是具有口服生物利用度的泛RAS抑制劑，與傳統突變選擇性RAS抑制劑相比能靶向更廣泛的RAS突變，具有高暴露量、長半衰期和良好的藥代動力學特性，可用於治療RAS驅動的癌症，並對其他療法無效的患者具有療效。   &lt;br/&gt;&lt;img align="absmiddle" height="335px" width="365px" file="ed10778.JPG" alt="ed10778.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses nitrogen-containing macrocyclic compounds, pharmaceutical composition and use thereof. The present invention provides a compound represented by formula 0, a solvate, a pharmaceutically acceptable salt thereof or a solvate of the pharmaceutically acceptable salt thereof. The compounds of the present disclosure are orally bioavailable pan-RAS inhibitors which can target a wider range of RAS mutations than traditional mutant-selective RAS inhibitors, and have high exposure, long half-life and good pharmacokinetic properties, may be useful for the treatment of RAS-driven cancers and effective in patients who have not responded to other therapies. &lt;br/&gt;&lt;img align="absmiddle" height="338px" width="407px" file="ed10779.JPG" alt="ed10779.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1417" publication-number="202632186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃燒器</chinese-title>
        <english-title>BURNER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">F23C99/00</main-classification>
        <further-classification edition="200601120260428B">F23D14/14</further-classification>
        <further-classification edition="200601120260428B">F23G7/06</further-classification>
        <further-classification edition="200601120260428B">F23D14/70</further-classification>
        <further-classification edition="200601120260428B">F23D14/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商愛德華有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯圖爾特　奧利佛　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEWART, OLIVER JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希利　安德魯　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEELEY, ANDREW JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博恩　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWEN, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班薩瓦　伊恩　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENZEVAL, IAN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於處理來自一製程工具之一廢氣流之燃燒器。該燃燒器包括一燃燒器襯墊，該燃燒器襯墊包括至少部分地界定一處理室之一多孔套筒。該多孔套筒經構形以允許一第一氣態組合物流向該處理室。該燃燒器進一步包括一入口陣列，該入口陣列配置於該多孔套筒周圍且經構形以透過該多孔套筒朝向該處理室輸送一第二氣態組合物。該多孔套筒包括複數個互連之實質上同心層，各層包括一透孔網格。緊鄰於該陣列之至少一個入口之複數個層經配置以界定用於使該第二氣態組合物流向該處理室之一實質上無礙流動路徑。該實質上無礙流動路徑與離開該入口之第二氣態組合物之主流動方向對準。該實質上無礙流動路徑與該處理室之間的至少一個層經配置以提供至少部分地阻礙該第二氣態組合物之該流動路徑之一擋板。本發明亦提供一種減量設備及一種用於處理一廢氣流之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a burner for treating an effluent gas stream from a process tool. The burner comprises a burner liner comprising a porous sleeve at least partially defining a treatment chamber. The porous sleeve is configured to allow a first gaseous composition to flow through towards the treatment chamber. The burner further comprises an array of inlets arranged about the porous sleeve and configured to convey a second gaseous composition through the porous sleeve towards the treatment chamber. The porous sleeve comprises a plurality of interconnected substantially concentric layers, each layer comprising an openwork mesh. A plurality of layers immediately adjacent to at least one inlet of the array are arranged to define a substantially unobstructed flow path for the second gaseous composition to flow through towards the treatment chamber. The substantially unobstructed flow path is aligned with the main direction of flow of second gaseous composition exiting the inlet. At least one layer between the substantially unobstructed flow path and the treatment chamber is arranged to provide a baffle at least partially obstructing the flow path of the second gaseous composition. The present invention also provides an abatement apparatus, and a method for treating an effluent gas stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:多孔套筒</p>
        <p type="p">6:處理室</p>
        <p type="p">7:入口</p>
        <p type="p">8:層</p>
        <p type="p">9:層</p>
        <p type="p">10:燃燒鋒面</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;:第一氣態組合物</p>
        <p type="p">G&lt;sub&gt;2&lt;/sub&gt;:第二氣態組合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1418" publication-number="202632337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光電裝置之具有凹槽的波導及經耦合之波導與其製造方法</chinese-title>
        <english-title>WAVEGUIDE WITH RECESS FOR OPTO-ELECTRONIC DEVICES AND COUPLED WAVEGUIDES AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">G02B6/12</main-classification>
        <further-classification edition="200601120260430B">G02B6/24</further-classification>
        <further-classification edition="200601120260430B">G02B6/26</further-classification>
        <further-classification edition="200601120260430B">G02B6/28</further-classification>
        <further-classification edition="200601120260430B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布萊克半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLACK SEMICONDUCTOR GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>修格伯特　西德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUYGHEBAERT, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿博萊達　波拉尼奧斯　聖地牙哥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARBOLEDA BOLANOS, SANTIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種配置，其包含：  &lt;br/&gt;a. 第一波導，其適於且配置成用於傳播電磁波；  &lt;br/&gt;b. 至少一個元件，其中，在該配置之橫截面視圖中，該第一波導及該至少一個元件配置為重疊；  &lt;br/&gt;其中  &lt;br/&gt;該第一波導包含至少部分地面向該至少一個元件的凹槽，  &lt;br/&gt;該凹槽之深度小於該第一波導之高度，  &lt;br/&gt;該凹槽之該深度及該第一波導之該高度係平行於另一方向量測的，且  &lt;br/&gt;該另一方向垂直於第一方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An arrangement comprising &lt;br/&gt;a. a first waveguide adapted and arranged for the propagation of electromagnetic waves; &lt;br/&gt;b. at least one element, wherein, in a cross-sectional cut of the arrangement, the first waveguide and the at least one element are arranged to overlap; &lt;br/&gt;wherein &lt;br/&gt;the first waveguide comprises a recess that at least partially faces the at least one element, &lt;br/&gt;a depth of the recess is less than a height of the first waveguide, &lt;br/&gt;the depth of the recess and the height of the first waveguide are measured parallel to a further direction, and &lt;br/&gt;the further direction is perpendicular to a first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:配置</p>
        <p type="p">101:第一波導</p>
        <p type="p">102:凹槽</p>
        <p type="p">103:元件</p>
        <p type="p">104:第一介電層</p>
        <p type="p">105:第二介電層</p>
        <p type="p">106:第三介電層</p>
        <p type="p">107:第一方向</p>
        <p type="p">108:另一方向</p>
        <p type="p">111A:電極</p>
        <p type="p">111B:電極</p>
        <p type="p">125:凹槽中的介電材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1419" publication-number="202633276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、氣體供給系統、基板處理方法、半導體裝置之製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260318B">H10P14/60</main-classification>
        <further-classification edition="200601120260318B">C23C16/455</further-classification>
        <further-classification edition="200601120260318B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中彰己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SHOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種將大流量的處理氣體供給至處理室內變得更容易的技術。  &lt;br/&gt;　　[解決手段]提供一種技術，其具有：在內部對基板進行處理的處理室；一端被連接至供給處理氣體的第1供給源，另一端被連接至處理室的第1流路；被設置在第1流路中的第1開閉部；被設置在第1流路中且在第1開閉部與處理室之間的第2開閉部；以及一端被連接至第1流路中且在第1開閉部和第2開閉部之間的區間，另一端被連接至排氣裝置的第2流路；被設置在第2流路中的貯留部；以及被設置在第2流路中且在貯留部與排氣裝置之間的第3開閉部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">115:晶舟升降器</p>
        <p type="p">115s:擋板開關機構</p>
        <p type="p">121:控制器</p>
        <p type="p">200:基板</p>
        <p type="p">201:處理室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:反應管</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:分歧管</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:隔熱板</p>
        <p type="p">219:密封蓋</p>
        <p type="p">219s:擋板</p>
        <p type="p">220a:O型環</p>
        <p type="p">220b:O型環</p>
        <p type="p">220c:O型環</p>
        <p type="p">231:排氣口</p>
        <p type="p">231a:排氣口</p>
        <p type="p">232a:第1流路</p>
        <p type="p">232b:氣體供給管</p>
        <p type="p">232c:氣體供給管</p>
        <p type="p">232d:氣體供給管</p>
        <p type="p">232e:氣體供給管</p>
        <p type="p">232f:氣體供給管</p>
        <p type="p">232n:第2流路</p>
        <p type="p">232v:第1供給源</p>
        <p type="p">232w:第2供給源</p>
        <p type="p">240a:貯留部</p>
        <p type="p">241a~241f:MFC</p>
        <p type="p">242a:閥門(第2開閉部)</p>
        <p type="p">243a:閥門(第1開閉部)</p>
        <p type="p">243b:閥門</p>
        <p type="p">243c:閥門</p>
        <p type="p">243d:閥門</p>
        <p type="p">243e:閥門</p>
        <p type="p">243f:閥門</p>
        <p type="p">244:APC閥</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">245a:逆止閥</p>
        <p type="p">246:排氣裝置</p>
        <p type="p">247a:第3開閉部</p>
        <p type="p">248:氣體供給系統</p>
        <p type="p">249a~249c:噴嘴</p>
        <p type="p">250a~250c:氣體供給孔</p>
        <p type="p">263:溫度感測器</p>
        <p type="p">267:旋轉機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1420" publication-number="202633455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附有焊料凸塊的電路構件之製造方法及附有焊料凸塊的電路構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/01</main-classification>
        <further-classification edition="202601120260427B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮地勝將</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAJI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江尻芳則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJIRI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤井邦彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAI, KUNIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欠畑純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKEHATA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葭葉步未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIBA, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">該附有焊料凸塊的電路構件之製造方法包括：沉積步驟（S02），在設置有導電性的柱（3）之基板（2）的一面中，在包含柱（3）的頂面（3a）之區域沉積焊料層（11）；還原步驟（S03），在還原氣體的環境下對焊料層（11）進行還原，在柱（3）的頂面（3a）形成焊料凸塊（4）；去除步驟（S04），去除在還原步驟之後殘留於基板（2）的一面上的多餘焊料層（12）；及再還原步驟（S05），在還原氣體的環境下對柱（3）的頂面（3a）的焊料凸塊（4）進行再還原，在柱（3）與焊料凸塊（4）的界面形成基於柱（3）的構成材料和焊料凸塊（4）的構成材料之合金層（6）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S01:前處理步驟</p>
        <p type="p">S02:沉積步驟</p>
        <p type="p">S03:還原步驟</p>
        <p type="p">S04:去除步驟</p>
        <p type="p">S05:再還原步驟</p>
        <p type="p">S06:洗淨步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1421" publication-number="202631678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造武裝免疫細胞之雙特異性抗體</chinese-title>
        <english-title>BI-SPECIFIC ANTIBODIES FOR USE IN PRODUCING ARMED IMMUNE CELLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07K16/30</further-classification>
        <further-classification edition="200601120260504B">C07K16/46</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="201001120260504B">C12N5/0783</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="202501120260504B">A61K40/11</further-classification>
        <further-classification edition="202501120260504B">A61K40/42</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽昂生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYTOARM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊國祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, KUO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳易柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳挺宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">能夠結合CD3及腫瘤相關抗原的雙特異性抗體、具有這種雙特異性抗體的免疫細胞、以及其在癌症治療中的治療用途。本文還提供製造具有雙特異性抗體的免疫細胞的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Bispecific antibodies capable of binding to CD3 and a tumor associated antigen, immune cells armed with such bispecific antibodies, and therapeutic uses thereof in cancer treatment. Also provided herein are methods for producing immune cells armed with the bispecific antibodies.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1422" publication-number="202632536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在類神經網路上的最佳化之旋轉位置嵌入</chinese-title>
        <english-title>OPTIMIZED ROTARY POSITIONAL EMBEDDING ON NEURAL NETWORK ACCELERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">G06N3/04</main-classification>
        <further-classification edition="200601120260202B">G06N3/06</further-classification>
        <further-classification edition="200601120260202B">G06F17/16</further-classification>
        <further-classification edition="201801120260202B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佩晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, PEIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅培茲　雷根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, REAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些DNN加速器上之旋轉位置嵌入(RoPE)執行可能成為一效能瓶頸。為解決此問題，RoPE中之低效運算由一編譯器識別，且被替換為卷積運算子。執行RoPE可涉及實行一重構運算、一串接運算及一卷積運算。可在針對卷積的實行經最佳化的DNN加速器上高效地執行此等運算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Rotary positional embedding (RoPE) execution on some DNN accelerators can be a bottleneck of performance. To address this issue, inefficient operations in RoPE are identified by a compiler and replaced by convolution operators. Executing RoPE can involve performing a reshaping operation, a concatenating operation, and a convolution operation. These operations can be executed efficiently on DNN accelerators optimized to perform convolutions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1202,1204,1206:張量</p>
        <p type="p">1208:旋轉張量</p>
        <p type="p">1220:經重構張量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1423" publication-number="202631679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＣＤ４０抗體及其組合物</chinese-title>
        <english-title>ANTIBODIES TO CD40 AND COMPOSITIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商施維雅藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LES LABORATOIRES SERVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾加德　塔妮亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOELLGAARD,TANIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷克澤　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RECKZEH, KRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休伯特　桑德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBERT, SANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加洛　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLOU, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供與CD40結合之抗體以及使用該等抗體調節有需要患者之免疫力及治療自體免疫病症或免疫發炎性病症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides antibodies that bind to CD40, and methods of using them to modulate immunity in a patient in need thereof and to treat autoimmune disorders or immunoinflammatory disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1424" publication-number="202631600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酞嗪酮衍生物的鹽及其晶型、其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D403/04</main-classification>
        <further-classification edition="200601120260504B">A61K31/502</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西藏海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱鳳飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙譽良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YULIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種式(I)化合物的可藥用鹽型、晶型及其製備方法，以及它們在製備相關藥物中的應用。  &lt;br/&gt; &lt;img align="absmiddle" height="150px" width="218px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1425" publication-number="202631740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非水系二次電池負極用黏合劑組成物、非水系二次電池負極用黏合劑組成物之製造方法、非水系二次電池負極用組成物、非水系二次電池負極及非水系二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/08</main-classification>
        <further-classification edition="200601120260504B">C08F220/06</further-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F257/02</further-classification>
        <further-classification edition="200601120260504B">C08F265/06</further-classification>
        <further-classification edition="200601120260504B">C08F265/02</further-classification>
        <further-classification edition="200601120260504B">C08L51/00</further-classification>
        <further-classification edition="200601120260504B">B01J13/14</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本辰弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大村亮祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMURA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供非水系二次電池負極用黏合劑組成物，該非水系二次電池負極用黏合劑組成物能夠追隨活性物質的體積變化的彈性變形特性和造膜性優異，且對電解液的耐久性(耐電解液性)也優異，能夠形成充放電效率和容量維持率等電池特性優異的二次電池。  &lt;br/&gt;該非水系二次電池負極用黏合劑組成物含有具有由聚合物(a1)構成的殼部和由聚合物(a2)構成的核部的核殼型粒子(A)、和水性介質(B)，聚合物(a1)含有來自反應性乳化劑的結構單元、來自具有酸性基團的乙烯基單體的結構單元和來自(甲基)丙烯酸酯單體的結構單元，聚合物(a2)含有來自共軛二烯單體的結構單元和來自芳香族乙烯基單體的結構單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1426" publication-number="202631987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>益生菌、包含該益生菌之組成物及該益生菌之菌粉、食物纖維的代謝改善方法、分解具有高階結構的醣質之方法、含葡萄糖醛酸的寡糖之製造方法、蛋白質及其用途、去氧核糖核酸、以及判定幼兒的腸內細菌叢的成熟度之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">C12N1/20</main-classification>
        <further-classification edition="200601120260504B">C12N9/24</further-classification>
        <further-classification edition="200601120260504B">C12N15/56</further-classification>
        <further-classification edition="200601120260504B">C12P19/00</further-classification>
        <further-classification edition="200601120260504B">C07H3/06</further-classification>
        <further-classification edition="201501120260504B">A61K35/745</further-classification>
        <further-classification edition="200601120260504B">A61K38/16</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="201601120260504B">A23L33/135</further-classification>
        <further-classification edition="201801120260504B">C12Q1/689</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商森永乳業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORINAGA MILK INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田巻俊孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAMAKI, TOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木優紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片山高嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAYAMA, TAKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種輔助離乳期的幼兒之食物纖維的代謝之技術。&lt;br/&gt;  本發明藉由一種保有以下的(A)、(B)或(C)的蛋白質之短雙歧桿菌(Bifidobacterium breve)來解決前述課題。&lt;br/&gt;  (A)包含序列編號2之胺基酸序列的蛋白質。&lt;br/&gt;  (B)包含在序列編號2之胺基酸序列中的1個或數個之胺基酸經缺失、取代、及/或附加之胺基酸序列，且具有醣苷水解酶59(Glycoside Hydrolase59；又稱GH59)活性的蛋白質。&lt;br/&gt;  (C)包含與序列編號2之胺基酸序列具有90%以上的同一性之胺基酸序列，且具有GH59活性的蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1427" publication-number="202632676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫療影像分析系統</chinese-title>
        <english-title>MEDICAL IMAGE ANALYSIS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260416B">G16H30/00</main-classification>
        <further-classification edition="202301120260416B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智捷醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGEN TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫継信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種醫療影像分析系統包括影像處理模組、三維建模模組、前置訓練模組及比較統計分析模組。上述影像處理模組2D黑白醫療影像資訊的影像格式轉換為NIfTI格式，並根據2D黑白醫療影像資訊的類型進行對應的標準化處理後，對2D黑白醫療影像資訊進行資料增強及重取樣，產生一標準建模影像資訊。上述三維建模模組使用一深度學習模型根據功能性解剖學之定義對上述標準建模影像資訊進行器官結構之分區處理，並依據所分區之上述器官結構進行標記並上色，生成一彩色三維立體模型檔案。上述前置訓練模組基於nnUnet、nnTrans或SwinUNETR分類任務進行資料增強及重取樣以建立個別上述器官結構的一病灶辨識深度學習模型。上述比較統計分析模組將彩色三維立體模型檔案匯入病灶辨識深度學習模型，根據擷取相關器官結構與統計分析計算，在彩色三維立體模型檔案標記出位置資訊，並生成一分析報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A medical image analysis system includes an image processing module, a three-dimensional modeling module, a pre-training module, and a comparative statistical analysis module. The image processing module is configured to convert two-dimensional (2D) grayscale medical image information into NIfTI format and, based on the type of the 2D grayscale medical image information, perform corresponding normalization, data augmentation, and resampling to generate standardized modeling image information. The three-dimensional modeling module is configured to use a deep learning model to perform segmentation of organ structures in the standardized modeling image information according to definitions of functional anatomy, and to label and color the segmented organ structures, thereby generating a color three-dimensional model file. The pre-training module is configured to perform data augmentation and resampling for classification tasks based on nnU-Net, nnTrans, or SwinUNETR, and to build a lesion recognition deep learning model for each individual organ structure. The comparative statistical analysis module is configured to import the color three-dimensional model file into the lesion recognition deep learning model, mark positional information in the color three-dimensional model file according to extracted relevant organ structures and statistical analysis calculations, and generate an analysis report.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:醫療影像分析系統</p>
        <p type="p">110:影像處理模組</p>
        <p type="p">120:三維建模模組</p>
        <p type="p">130:前置訓練模組</p>
        <p type="p">140:比較統計分析模組</p>
        <p type="p">150:深度學習訓練資料庫</p>
        <p type="p">160:醫院主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1428" publication-number="202631262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B05C11/00</main-classification>
        <further-classification edition="200601120260427B">B05C5/02</further-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
        <further-classification edition="202601120260427B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鰍場真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村圭伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板處理方法，其能高效地於基板之上表面生成包含成分液及成分氣體之處理液。  &lt;br/&gt;本發明之基板處理方法包含：密閉步驟，其係將遮擋構件41與基板固持器14之間之間隙密閉，藉此於成分液位於基板W之上表面之狀態下，於遮擋構件41與基板固持器14之間形成收容有保持於基板固持器14之基板W之密閉空間SP；及加壓步驟，其係將與成分液共同生成處理液之成分氣體供給至密閉空間SP，藉此於成分液位於基板W之上表面之狀態下，使密閉空間SP內之氣壓上升至較密閉空間SP之外之氣壓高之值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing method includes forming a sealed space housing a substrate held by a substrate holder between a shielding member and the substrate holder by sealing a gap between the shielding member and the substrate holder in a state in which a component liquid is present on an upper surface of the substrate, and increasing gas pressure in the sealed space to a value higher than gas pressure outside the sealed space by supplying a component gas that generates a processing liquid together with the component liquid to the sealed space in a state in which the component liquid is present on the upper surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">2:處理單元</p>
        <p type="p">10:旋轉夾盤</p>
        <p type="p">11:夾盤銷</p>
        <p type="p">12:旋轉基座</p>
        <p type="p">12u:上表面</p>
        <p type="p">14:加熱板</p>
        <p type="p">14h:發熱體</p>
        <p type="p">14i:內側部</p>
        <p type="p">14o:外側部</p>
        <p type="p">41:遮擋構件</p>
        <p type="p">41a:升降致動器</p>
        <p type="p">41g:氣體通路</p>
        <p type="p">41p:板狀部(遮擋板)</p>
        <p type="p">41r:整流板</p>
        <p type="p">41t:筒狀部</p>
        <p type="p">42:氣體供給口</p>
        <p type="p">43:氣體排出口</p>
        <p type="p">44g:臭氧產生器</p>
        <p type="p">44p:成分氣體配管</p>
        <p type="p">44v:成分氣體閥</p>
        <p type="p">45p:非活性氣體配管</p>
        <p type="p">45v:非活性氣體閥</p>
        <p type="p">46p:排氣管</p>
        <p type="p">46s:負壓產生源</p>
        <p type="p">46v:排氣閥</p>
        <p type="p">A1:旋轉軸線</p>
        <p type="p">MC:濃度計</p>
        <p type="p">MP:壓力計</p>
        <p type="p">SP:密閉空間</p>
        <p type="p">SP1:上空間</p>
        <p type="p">SP2:下空間</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1429" publication-number="202631284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顆粒組合物及製備和使用顆粒組合物之方法</chinese-title>
        <english-title>PARTICLE COMPOSITIONS AND METHODS OF PREPARING AND USING PARTICLE COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B22F7/00</main-classification>
        <further-classification edition="200601120260428B">B22F9/04</further-classification>
        <further-classification edition="202201120260428B">B22F1/05</further-classification>
        <further-classification edition="202101120260428B">B22F10/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡科技研究局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪昂　得文　尼科爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DION, DEVON NICHOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　維倫德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARKE, VIRENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王城城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里菲　蒙特雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEAVY, MONTRAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古達蒂　蘇巴斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDDATI, SUBHASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦桑塔古瑪　亞拉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASANTHAKUMAR, ARAVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　蘇霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SU XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許征凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHENGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述：顆粒組合物，其等含有金屬顆粒、成孔顆粒及由該等金屬顆粒及該等成孔顆粒形成之不規則形狀之團聚物顆粒；顆粒組合物，其等可用作一積層製造程序中之一原料組合物；以及使用如描述之一顆粒組合物作為一原料以用於藉由一積層製造程序形成一多孔成形金屬主體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are particle compositions that contain metal particles, pore-forming particles, and irregularly-shaped agglomerate particles formed from the metal particles and the pore-forming particles; particle composition that are are useful as a feedstock composition in an additive manufacturing process; and methods of using a particle composition as described as a feedstock for forming a porous shaped metal body by an additive manufacturing process.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1430" publication-number="202633041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H05K3/46</main-classification>
        <further-classification edition="201901120260428B">B32B7/06</further-classification>
        <further-classification edition="200601120260428B">B32B38/18</further-classification>
        <further-classification edition="202601120260428B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村利美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基板的製造方法，其能簡便地分離載體與器件層。該基板的製造方法包含：準備在載體上依序具備剝離層及器件層之積層體的步驟；將積層體固定在剝離裝置的步驟，其中，剝離裝置具備：具有載置積層體用之載置面的第一隔膜，及，能從第一隔膜之與載置面為相反側之面來加壓第一隔膜的第一加壓手段，且積層體對於剝離裝置之固定係以載體與第一隔膜之載置面接觸之方式來進行者；使用第一加壓手段，從第一隔膜之與載置面為相反側之面來加壓第一隔膜使其膨脹，藉此而使載體或積層體之形狀產生變化的步驟；及，活用載體之形狀變化，在載體與器件層之間產生剪切應力，藉此在剝離層之位置將器件層從積層體剝離的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積層體</p>
        <p type="p">12:載體</p>
        <p type="p">20:器件層</p>
        <p type="p">24:剝離裝置</p>
        <p type="p">26:第一隔膜</p>
        <p type="p">28:第一加壓手段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1431" publication-number="202633140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在二維材料層結構上提供金屬接觸之方法</chinese-title>
        <english-title>METHODS FOR THE PROVISION OF METAL CONTACTS ON A TWO-DIMENSIONAL MATERIAL LAYER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D64/01</main-classification>
        <further-classification edition="202501120260427B">H10D64/62</further-classification>
        <further-classification edition="202501120260427B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商佩拉葛拉夫有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARAGRAF LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥金尼斯　安德魯Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACINNES, ANDREW N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾莎　阿迪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEERSHA, ADIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱因特　潔思普莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAINTH, JASPREET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃利斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALLIS, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班伯　利奧史考特法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMBER, LEO SCOTT FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於在諸如石墨烯的二維材料層結構上提供金屬觸點的方法，一種此類方法包含：(i)提供層板結構，此層板結構包含其上具有二維材料層結構(910)的基板(900)，以及在此二維材料層結構(910)上並跨此二維材料層結構的無機介電層(920)，其中此介電層(920)具有小於80 nm的厚度；(ii)在此層板結構的複數個區域中的每一者內濕式蝕刻此介電層(920)的一組部分，以暴露此二維材料層結構(910)的一對應組的表面部分並在此介電層(920)中形成一對應組的井(915)，其中每個井具有小於900 µm&lt;sup&gt;2&lt;/sup&gt;的與此基板共面的橫截面積且具有小於30 µm的最大寬度；(iii)藉由沉積一或多種金屬(925')並形成複數個接觸墊(925)來進行一或多個金屬化步驟，其中每個接觸墊(925)透過填充此對應組的井(915)中的一者的一組金屬通孔（925a，第10圖）與此二維材料層結構(910)電氣連通。本文提供可藉由此類方法獲得的電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for the provision of metal contacts on a two-dimensional material layer structure such as graphene, one such method comprising: (i) providing a laminate structure comprising a substrate (900) having a two-dimensional material layer structure (910) thereon, and an inorganic dielectric layer (920) on and across the two-dimensional material layer structure (910), wherein the dielectric layer (920) has a thickness of less than 80 nm; (ii) wet-etching, within each of a plurality of regions of the laminate structure, a group of portions of the dielectric layer (920) to expose a corresponding group of surface portions of the two-dimensional material layer structure (910) and form a corresponding group of wells (915) in the dielectric layer (920), wherein each well has a cross-sectional area co-planar with the substrate of less than 900 µm&lt;sup&gt;2&lt;/sup&gt; and has a maximum width of less than 30 µm; (iii) performing one or more metallisation steps by depositing one or more metals (925’) and forming a plurality of contact pads (925), wherein each contact pad (925) is in electrical communication with the two-dimensional material layer structure (910) through a group of metal vias (925a, Fig 10) filling one of the corresponding group of wells (915). Electronic devices which may be obtained by such methods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:基板</p>
        <p type="p">905:共圖案化堆疊</p>
        <p type="p">910:二維材料層結構</p>
        <p type="p">915:井</p>
        <p type="p">920:無機介電層</p>
        <p type="p">925:接觸墊</p>
        <p type="p">925':金屬層</p>
        <p type="p">935:鈍化層</p>
        <p type="p">940:圖案化抗蝕劑</p>
        <p type="p">950a:臂</p>
        <p type="p">950b:臂</p>
        <p type="p">1000:第一步驟</p>
        <p type="p">1005:第二步驟</p>
        <p type="p">1010:第三步驟</p>
        <p type="p">1015:第四步驟</p>
        <p type="p">1020:第五步驟</p>
        <p type="p">1025:第六步驟</p>
        <p type="p">B-B:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1432" publication-number="202632823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電訊號輸出裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01S5/14</main-classification>
        <further-classification edition="202101120260504B">H01S5/022</further-classification>
        <further-classification edition="200601120260504B">H01S5/06</further-classification>
        <further-classification edition="200601120260504B">H01S5/50</further-classification>
        <further-classification edition="200601120260504B">G02B6/12</further-classification>
        <further-classification edition="201301120260504B">H04B10/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛德萬測試股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTEST CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部峻佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原英生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">將2種波長的雷射光的頻率間隔縮小。&lt;br/&gt;  電訊號輸出裝置1具備：第1雷射光輸出部10，接收預定波長λ1的第1穩定化雷射光SL1，並且輸出具有預定波長λ1+m×(第1共振波長間隔λ&lt;sub&gt;FSR1&lt;/sub&gt;)的波長的成分之第1雷射光L1；第2雷射光輸出部20，接收預定波長λ1的第2穩定化雷射光SL2，並且輸出具有前述預定波長λ1+n×(第2共振波長間隔λ&lt;sub&gt;FSR2&lt;/sub&gt;)的波長的成分之第2雷射光L2；及UTC-PD8，接收第1雷射光L1及第2雷射光L2，並且輸出第1雷射光L1的光頻率與第2雷射光L2的光頻率之差分的頻率的電訊號ES。其中，m及n為正整數。第1共振波長間隔λ&lt;sub&gt;FSR1&lt;/sub&gt;與第2共振波長間隔λ&lt;sub&gt;FSR2&lt;/sub&gt;為不同的值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電訊號輸出裝置</p>
        <p type="p">2:穩定化雷射光源</p>
        <p type="p">3a,3b:耦合器</p>
        <p type="p">4a,4b:循環器</p>
        <p type="p">6:陷波濾波器(減少部)</p>
        <p type="p">8:UTC-PD(UTC-PD:Uni-Traveling Carrier Photodiode，電訊號輸出部)</p>
        <p type="p">10:第1雷射光輸出部</p>
        <p type="p">20:第2雷射光輸出部</p>
        <p type="p">ES:電訊號</p>
        <p type="p">L1:第1雷射光</p>
        <p type="p">L2:第2雷射光</p>
        <p type="p">SL:穩定化雷射光</p>
        <p type="p">SL1:第1穩定化雷射光</p>
        <p type="p">SL2:第2穩定化雷射光</p>
        <p type="p">λ1:預定波長(共振波長，波長)</p>
        <p type="p">λ&lt;sub&gt;FSR1&lt;/sub&gt;:第1共振波長間隔</p>
        <p type="p">λ&lt;sub&gt;FSR2&lt;/sub&gt;:第2共振波長間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1433" publication-number="202632883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於電容性負載之自適應性電流限制器之訊號發射系統、訊號調節模組及其訊號調節方法</chinese-title>
        <english-title>SIGNAL EMITTING SYSTEM, SIGNAL CONDITIONING MODULE AND SIGNAL CONDITIONING METHOD WITH ADAPTIVE CURRENT LIMITER FOR CAPACITIVE LOADS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">H03G11/08</main-classification>
        <further-classification edition="200601120260424B">H03H21/00</further-classification>
        <further-classification edition="200601120260424B">H03F1/52</further-classification>
        <further-classification edition="200601120260424B">H02H7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路　波溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RU, POWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示了用於電容性負載之自適應性電流限制器(及相關系統、裝置及方法)。在一個實施例中，一種訊號發射系統包括一訊號處理單元、一放大器及一發射器。該訊號處理單元可基於(i)系統參數及(ii)對應於一源訊號之一樣本、一調節後訊號之一個或多個樣本或其組合的一代表性量值判定一差量限制。該訊號處理單元可進一步判定(i)該差量限制與(ii)該源訊號之一樣本與該源訊號之一先前樣本之間的一差之一比率，以及將一低通濾波器應用於該源訊號以獲得一濾波後訊號，其中濾波器係數基於該比率而產生。該放大器可基於該濾波後訊號產生一放大訊號，且該發射器可基於該放大訊號發射一輸出訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Adaptive current limiters for capacitive loads (and associated systems, devices, and methods) are disclosed herein. In one embodiment, a signal emitting system includes a signal processing unit, an amplifier, and an emitter. The signal processing unit can determine a delta limit based on (i) system parameters and (ii) a representative magnitude corresponding to a sample of a source signal, one or more samples of a conditioned signal, or a combination thereof. The signal processing unit can further determine a ratio of (i) the delta limit to (ii) a difference between a sample of the source signal and a previous sample of the source signal, and apply a lowpass filter to the source signal to obtain a filtered signal, with filter coefficients based on the ratio. The amplifier can generate an amplified signal based on the filtered signal, and the emitter can emit an output signal based on the amplified signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:訊號發射系統</p>
        <p type="p">210:訊號驅動器</p>
        <p type="p">220:數位訊號處理單元</p>
        <p type="p">230:預處理模組</p>
        <p type="p">240:訊號調節模組</p>
        <p type="p">250:放大器</p>
        <p type="p">260:電磁干擾濾波器</p>
        <p type="p">270:發射器</p>
        <p type="p">275:電容性負載</p>
        <p type="p">295:訊號內容</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1434" publication-number="202632401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於控制光之傳遞率之裝置</chinese-title>
        <english-title>DEVICE FOR CONTROLLING TRANSMITTANCE OF LIGHT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02F1/1335</main-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
        <further-classification edition="200601120260504B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商弗萊克英納寶技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉摩斯寇格　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIMMERSKOG, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種裝置，其包含：一第一液晶LC層；一第一電極層，該第一電極層包含：第一複數個實質上細長、實質上平行的電極，各電極之間的間隔為不均勻的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a device comprising: a first liquid crystal, LC, layer; a first electrode layer, the electrode layer comprising: a first plurality of substantially elongated, substantially parallel electrodes, the spacing between each electrode being non-uniform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">306:第一電極層，電極層</p>
        <p type="p">316:第二電極層，電極層</p>
        <p type="p">318,320,322,324,326,328:線性條帶</p>
        <p type="p">332:元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1435" publication-number="202631546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>六方晶氮化硼凝聚粒子、六方晶氮化硼粉末、樹脂組成物及六方晶氮化硼凝聚粒子的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C04B35/5833</main-classification>
        <further-classification edition="200601120260421B">C01B21/064</further-classification>
        <further-classification edition="201801120260421B">C08K3/014</further-classification>
        <further-classification edition="200601120260421B">C08K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柿木智行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKIGI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台木祥太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一態樣之目的在於提供一種用於獲得兼具優異之導熱率及絕緣耐力之樹脂組成物的六方晶氮化硼凝聚粒子等。關於本發明之一態樣之六方晶氮化硼凝聚粒子(10)，於具有與凝聚粒子之面中具有最大投影面積之一面平行之至少一個面、且外接於凝聚粒子且具有最小體積之長方體中，將彼此正交之3個邊之長度分別設為La、Lb、Lc(其中，La≧Lb≧Lc)時，La為70 μm～250 μm，比率La/Lc及Lb/Lc分別為2.8以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:六方晶氮化硼凝聚粒子</p>
        <p type="p">Ex,Ey,Ez:邊</p>
        <p type="p">La,Lb,Lc:邊之長度</p>
        <p type="p">Sxy:面</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1436" publication-number="202631658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二價嵌合受體或嵌合受體系統及其使用方法</chinese-title>
        <english-title>BIVALENT CHIMERIC RECEPTORS OR CHIMERIC RECEPTOR SYSTEMS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/705</main-classification>
        <further-classification edition="200601120260504B">C07K16/30</further-classification>
        <further-classification edition="200601120260504B">C12N15/62</further-classification>
        <further-classification edition="201001120260504B">C12N5/0783</further-classification>
        <further-classification edition="202501120260504B">A61K40/11</further-classification>
        <further-classification edition="202501120260504B">A61K40/31</further-classification>
        <further-classification edition="202501120260504B">A61K40/42</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商聖堤生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENTI BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋里森　布萊恩　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRISON, BRIAN SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭克爾　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANKEL, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫凡　米利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORVAN, MAELIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡薩雷斯　容卡　艾巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ-JUNCA, ALBA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供嵌合受體及抑制性嵌合受體之實體腫瘤抗原目標。本文所描述之嵌合抗原受體(CAR)包括結合第一抗原之第一抗原結合域；第二細胞外抗原結合域；跨膜域；及一或多個細胞內信號傳導域。本發明亦提供其使用方法，諸如用於治療癌症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are solid tumor antigen targets for chimeric receptors and chimeric inhibitory receptors. The chimeric antigen receptors (CARs) described herein include a first antigen-binding domain that binds a first antigen; a second extracellular antigen-binding domain; a transmembrane domain; and one or more intracellular signaling domains. The disclosure also provides methods of using the same, such as for the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1437" publication-number="202632215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139760</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學干涉測量系統及其測量方法及非暫時性電腦可讀媒體</chinese-title>
        <english-title>OPTICAL INTERFEROMETRY SYSTEM FOR MEASURING AND THE METHOD THEREOF AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260424B">G01B9/02</main-classification>
        <further-classification edition="200601120260424B">G01B11/02</further-classification>
        <further-classification edition="200601120260424B">G01N21/45</further-classification>
        <further-classification edition="200601120260424B">G01N21/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商諾威股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVA LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉克　吉列德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARAK, GILAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧倫　由納坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OREN, YONATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科恩　艾爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHEN, EYAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種光學干涉測量系統和相關聯的方法，其用於對具有第一方向的樣品區域的形貌進行干涉測量，在該第一方向上，與較高變化的正交方向相比，形貌度量相對均勻。具有二維畫素陣列的感測器接收輻射，該輻射包括來自樣品的反射與來自傾斜的參考反射鏡的反射之間的干涉。傾斜在感測器處引入了光程差（OPD）的梯度方向，使得沿著梯度方向的畫素行對應於在相對恆定的方向上對齊的樣品區域的位置。根據單個捕獲影像，針對每個這樣的畫素行生成OPD相對強度的干涉圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical interferometry system and associated methods are provided for interferometric measurement of topography of a sample region having a first direction in which a topographic metric is relatively uniform compared with an orthogonal direction of higher variation. A sensor having a two-dimensional array of pixels receives radiation including interference between reflections from the sample and from a tilted reference mirror. The tilt introduces, at the sensor, a gradient direction of the optical path difference (OPD), such that lines of pixels along the gradient direction correspond to positions of the sample region aligned in the direction of relative constancy. From a single captured image, an interferogram of OPD versus intensity is generated for each such line of pixels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:干涉測量系統</p>
        <p type="p">20:樣品</p>
        <p type="p">22:樣品台</p>
        <p type="p">30:光源</p>
        <p type="p">32a、32b:光學器件</p>
        <p type="p">34:分束器</p>
        <p type="p">36:參考反射鏡</p>
        <p type="p">40:感測器</p>
        <p type="p">50:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1438" publication-number="202631711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、乾膜，及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/50</further-classification>
        <further-classification edition="200601120260504B">C08G69/40</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/037</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森大河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAIGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供維持優良的解析性，同時能夠形成柔軟性優良的硬化膜的硬化性樹脂組成物，以及使用該硬化性樹脂組成物而得到的乾膜及硬化物。本發明之某個形態為硬化性樹脂組成物。前述硬化性樹脂組成物，含有：具有選擇自羥基及羧基之中1種以上的樹脂、具有2個以上(甲基)丙烯醯基的化合物、交聯劑，及光酸產生劑。相對於前述交聯劑100質量份，前述具有2個以上(甲基)丙烯醯基的化合物之含量為30質量份以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無   </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1439" publication-number="202631645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無封端且無硫醇化劑之再循環的硫醇化寡核苷酸之合成</chinese-title>
        <english-title>SYNTHESIS OF THIOLATED OLIGONUCLEOTIDES WITHOUT CAPPING AND WITHOUT RECIRCULATION OF THE THIOLATING AGENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07H1/00</main-classification>
        <further-classification edition="200601120260504B">C07H21/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　帕斯卡爾　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, PASCAL DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐布里奇　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLBRICH, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛德　喬漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEENDER, JOHANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係涉及一種生產線性 P-連接寡核苷酸之新穎方法，其特徵在於硫化步驟，該硫化步驟不需要硫化劑之再循環且在將核苷殘基逐步添加至增長鏈之 5’ 端中不涉及單獨封端步驟。該新穎方法使得縮短寡核苷酸組裝中之每個反應循環的時間，這相當於為較長寡核苷酸的製造節省了大量時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a novel process for the production of a linear P-linked oligonucleotide which is characterized by a sulfurization step which requires no recirculation of the sulfurizing agent and which does not involve a separate capping step in the stepwise addition of nucleoside residues to the 5'-terminus of the growing chain. The novel process allows for shorter times for each reaction cycle in the oligonucleotide assembly which amounts in a substantial time saving for the manufacture of longer oligonucleotides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1440" publication-number="202631680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07K14/71</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61K38/17</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任(ＶＩＩ)公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VII, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷迪　約瑟夫　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRADY, JOSEPH RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　蜜雪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　曉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了基於疾病特徵配體的存在有條件地誘導細胞效應子功能（例如，生物或治療活性）的大分子、包含其的組成物及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are macromolecules that conditionally induce a cellular effector function (e.g., a biological or therapeutic activity) based on the presence of a disease signature ligand, compositions comprising the same, and methods of using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1441" publication-number="202632225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於交叉口的路徑導航裝置、方法及電腦程式產品</chinese-title>
        <english-title>APPARATUS, METHOD AND PROGRAM FOR PATH NAVIGATION BASED ON INTERSECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G01C21/34</main-classification>
        <further-classification edition="202401120260427B">G06Q50/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商艾納威系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAVI SYSTEMS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李光珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GWANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於交叉口的路徑導航裝置，其包括：資料輸入部，其接收地圖上由不同之道路網構成之至少兩個道路網資料；交叉口設定部，其將上述道路網間可互通之地點設定為交叉口；及路徑導航部，其基於設定之上述交叉口來導航使用者指定之出發地至到達地之路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intersection-based route navigation device is provided, which includes a data input unit for receiving at least two road network data in which different road networks are configured on a map, an intersection setting unit for setting a point where the road networks are able to commute with each other as an intersection, and a route search unit for searching a route from a starting point to a destination specified by a user based on the set intersection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於交叉口的路徑導航裝置</p>
        <p type="p">110:資料輸入部</p>
        <p type="p">120:交叉口設定部</p>
        <p type="p">130:路徑導航部</p>
        <p type="p">140:最終路徑確定部</p>
        <p type="p">BUS:匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1442" publication-number="202633342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板把持裝置、具備該基板把持裝置的基板搬運機器人、反轉裝置及基板把持方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P72/30</main-classification>
        <further-classification edition="200601120260428B">B25J9/02</further-classification>
        <further-classification edition="200601120260428B">B25J15/08</further-classification>
        <further-classification edition="200601120260428B">B25J17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RORZE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾坂浩太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA, KOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基板把持裝置及基板搬運方法，用於把持具有翹曲的基板(例如半導體基板、液晶基板或其他薄板基板)，以及使用這些裝置方法的基板搬運機器人及反轉裝置。  &lt;br/&gt;　　基板把持裝置，其具備：複數個桿(30)，這些桿具有分離配置的複數個吸著部(33)，用於吸引並保持半導體晶圓或其他基板(60)；基部(12)，其以可改變複數個桿(30a、30b)中至少1個桿之相對於水平面的長度方向的角度的方式進行支承；以角度變更部(15、20~25)，其用於改變桿(30a、30b)的前述角度。藉由角度變更部(15、20~25)用以改變桿(30a、30b)在長度方向上的傾斜角度，藉此探求基板的吸著點，從而確實地吸著基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1443" publication-number="202631480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲繞體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B65H75/10</main-classification>
        <further-classification edition="200601120260423B">B65H75/28</further-classification>
        <further-classification edition="200601120260423B">B41J32/00</further-classification>
        <further-classification edition="200601120260423B">G11B23/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高園股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAZONO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山林尚史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMABAYASHI, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係防止捲繞體於支撐軸的錯誤裝設。捲繞體具備芯體(100)和捲繞於芯體(100)的長條的捲繞物。芯體(100)具有具備一端(101)與另一端(111)的中空管體的形狀。芯體(100)於一端(101)側與另一端(111)側分別具有多個突起，該突起從中空管體的內周面(120)突出。一端(101)側的突起的個數與另一端(111)側的突起的個數不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:芯體</p>
        <p type="p">101:一端</p>
        <p type="p">102,112:錐面</p>
        <p type="p">103,113:周方向凹部</p>
        <p type="p">104,114:凸部</p>
        <p type="p">111:另一端</p>
        <p type="p">120:內周面</p>
        <p type="p">130:第1凸條部</p>
        <p type="p">131,141,151,161:一側凸條端</p>
        <p type="p">132,142,152,162:另一側凸條端</p>
        <p type="p">133,143:突起部</p>
        <p type="p">140:第2凸條部</p>
        <p type="p">150:第3凸條部</p>
        <p type="p">160:第4凸條部</p>
        <p type="p">170:收容部</p>
        <p type="p">171:蓋子</p>
        <p type="p">172:紀錄介質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1444" publication-number="202632315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平面光學超穎透鏡及包含平面光學超穎透鏡之光連接器</chinese-title>
        <english-title>PLANAR OPTICAL METALENSES AND OPTICAL CONNECTORS COMPRISING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">G02B1/00</main-classification>
        <further-classification edition="200601120260428B">G02B6/26</further-classification>
        <further-classification edition="202101120260428B">G02B7/02</further-classification>
        <further-classification edition="201101120260428B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞韋琴科　瓦倫汀亞歷山德羅維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVERCHENKO, VALENTIN ALEXANDROVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴尼斯二世　保羅克維思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAINESE JR., PAULO CLOVIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種光學超穎透鏡，其包括：一平面基板；複數個奈米結構，其自該平面基板之一表面延伸；及一包層，其自該平面基板之該表面延伸且包圍該複數個奈米結構。一包層厚度大於該複數個奈米結構中之各奈米結構的奈米結構高度並且一平面包層表面與該平面基板相對。該包層厚度以及該複數個奈米結構中之各奈米結構的一奈米結構尺寸及一奈米結構高度中之至少一者經組態以使得該光學超穎透鏡將一目標相位賦予穿過該光學超穎透鏡的光，並且該光學超穎透鏡在大於或等於800 nm且小於或等於1600 nm之該光之一波長下包括大於或等於80%的一透射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical metalens includes a planar substrate, a plurality of nanostructures extending from a surface of the planar substrate, and a cladding extending from the surface of the planar substrate and encompassing the plurality of nanostructures. A cladding thickness is greater than the nanostructure height of each nanostructure of the plurality of nanostructures and a planar cladding surface opposite the planar substrate. The cladding thickness and at least one of a nanostructure dimension and a nanostructure height of each nanostructure of the plurality of nanostructures are configured such that the optical metalens imparts a target phase to light passing through the optical metalens and the optical metalens includes a transmittance greater than or equal to 80% at a wavelength of the light greater than or equal to 800 nm and less than or equal to 1600 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學超穎透鏡</p>
        <p type="p">102:平面基板</p>
        <p type="p">102a:表面</p>
        <p type="p">104:奈米結構</p>
        <p type="p">106:包層</p>
        <p type="p">106a:平面包層表面</p>
        <p type="p">108:超穎表面</p>
        <p type="p">110:塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1445" publication-number="202631967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139948</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與天然冷媒合用之高效率礦物油</chinese-title>
        <english-title>HIGH-EFFICIENCY MINERAL OIL FOR USE WITH NATURAL REFRIGERANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C10M101/02</main-classification>
        <further-classification edition="200601120260504B">C10M125/00</further-classification>
        <further-classification edition="200601120260504B">C10M127/00</further-classification>
        <further-classification edition="200601120260504B">C10M137/04</further-classification>
        <further-classification edition="200601320260504B">C10N20/02</further-classification>
        <further-classification edition="200601320260504B">C10N30/02</further-classification>
        <further-classification edition="200601320260504B">C10N30/06</further-classification>
        <further-classification edition="200601320260504B">C10N30/10</further-classification>
        <further-classification edition="200601320260504B">C10N30/12</further-classification>
        <further-classification edition="200601320260504B">C10N40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商盧伯利索公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE LUBRIZOL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳兆飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷克斯特羅　布莉姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKESTRAW, BRIDGETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於與天然冷媒合用之潤滑劑組成物，其中該潤滑劑包含至少50 wt%的礦物油及0.5至6 wt%的至少一種磷酸芳基酯。該潤滑劑可用作壓縮機潤滑劑，例如製冷壓縮機，且由於該潤滑劑在40℃下範圍為自約1.5至約4 cSt之相對較低的運動黏度而可改善壓縮機效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Lubricant compositions for use with natural refrigerants, wherein the lubricant comprises at least 50 wt% of a mineral oil and 0.5 to 6 wt% of at least one aryl phosphate. The lubricants are useful as compressor lubricants, for example refrigeration compressors and may improve compressor efficiency because of the lubricants’ relatively low kinematic viscosity at 40 ℃ ranging from about 1.5 to about 4 cSt.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1446" publication-number="202633271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成低電阻率觸點的方法</chinese-title>
        <english-title>METHODS FOR FORMING LOW RESISTIVITY CONTACTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P14/42</main-classification>
        <further-classification edition="202601120260423B">H10P14/43</further-classification>
        <further-classification edition="202601120260423B">H10W20/00</further-classification>
        <further-classification edition="202601120260423B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹　珠榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JUNYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夫　敬皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BU, KYOUNG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔昌鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳周玹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JU HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露一般提供了在半導體基板上形成接觸結構的方法。透過維持基板的第一溫度，並提供第一載送氣體、第一含金屬前驅物及第一含氫前驅物至第一沉積腔室，在接觸結構的表面上形成金屬層。接觸結構包括特徵。該特徵包括具有底面和側壁的開口，側壁包括介電材料。金屬層形成在側壁和底面上，且金屬層包含金屬和含矽材料。金屬層暴露於含金屬氯化物的前驅物，以從側壁去除金屬層的頂部部分。金屬間隙填充材料沉積在金屬層上方，以填充在半導體基板的表面中形成的特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally provides methods of forming contact structures on semiconductor substrates. A metal layer is formed on a surface of a contact structure by maintaining a first temperature of a substrate and providing a first carrier gas, a first metal-containing precursor, and a first hydrogen-containing precursor to a first deposition chamber. The contact structure includes a feature. The feature includes an opening with a bottom surface and sidewalls, which comprise a dielectric material. The metal layer is formed over the sidewalls and the bottom surface and the metal layer comprises a metal and a silicon containing material. The metal layer is exposed to a metal chloride containing precursor to remove a top portion of the metal layer from the sidewalls. A metal gap fill material is deposited over the metal layer to fill the feature formed in the surface of the semiconductor substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202:操作</p>
        <p type="p">204:操作</p>
        <p type="p">206:操作</p>
        <p type="p">208:操作</p>
        <p type="p">210:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1447" publication-number="202631693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療代謝紊亂的化合物</chinese-title>
        <english-title>COMPOUNDS FOR TREATING METABOLIC DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/40</main-classification>
        <further-classification edition="200601120260504B">C07K14/605</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61P3/10</further-classification>
        <further-classification edition="200601120260504B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商信達生物製藥（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOVENT BIOLOGICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎一鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱琛琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHENCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃經緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JINGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任德成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, DECHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付鳳根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, FENGGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了對GIP受體、GLP-1受體、胰高血糖素受體和pcsk9各自具有活性的化合物。還提供了用於治療例如如下疾病的方法：糖尿病、2型糖尿病、肥胖症、非酒精性脂肪性肝病（NAFLD）、非酒精性脂肪性肝炎（NASH）、血脂異常、心血管疾病和代謝綜合症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds are provided that have activity at each of the GIP receptor, GLP-1 receptor, glucagon receptor and pcsk9. Methods also are provided for treating diseases such as diabetes mellitus, type 2 diabetes, obesity, non-alcoholic fatty liver disease (NAFLD), non-alcoholic steatohepatitis (NASH), dyslipidemia, cardiovascular disease, and metabolic syndrome.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1448" publication-number="202631464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粒料之保管方法及粒料之保管設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B65D81/26</main-classification>
        <further-classification edition="200601120260422B">B65D90/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細谷郁雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOYA, IKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種粒料之保管方法，具有以下步驟：堆積物形成步驟，係堆疊源自生質之粒料(10)而形成粒料堆積物(100e)；及，抑制機構配置步驟，係在前述堆積物形成步驟當中，於堆疊當中之堆積物(100a)、(100c)之至少一部分配置抑制水蒸氣移動之機構(例如片材構件(20))；前述抑制機構配置步驟之後，於已配置之前述抑制水蒸氣移動之機構上進一步堆疊粒料(10)，而形成前述粒料堆積物(100e)；且，前述抑制水蒸氣移動之機構係一抑制水蒸氣從前述粒料堆積物(100e)之內部側往表層部側移動之機構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保管設備</p>
        <p type="p">10:粒料</p>
        <p type="p">20:片材構件</p>
        <p type="p">60A:堆料機</p>
        <p type="p">61A:第1本體部</p>
        <p type="p">62A:供給部</p>
        <p type="p">70:起重機</p>
        <p type="p">71:第2本體部</p>
        <p type="p">72:配置部</p>
        <p type="p">100:粒料堆積物</p>
        <p type="p">100a:第1堆積物</p>
        <p type="p">100b:第2堆積物</p>
        <p type="p">100c:第3堆積物</p>
        <p type="p">100d:第4堆積物</p>
        <p type="p">100e:第5堆積物</p>
        <p type="p">721:保持部</p>
        <p type="p">722:鋼索</p>
        <p type="p">DR2:粒料乾燥區域</p>
        <p type="p">WR2:粒料濕潤區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1449" publication-number="202632016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及切削工具</chinese-title>
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C22C29/08</main-classification>
        <further-classification edition="200601120260420B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村好博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕索斯　阿儂薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASEUTH, ANONGSACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種超硬合金，其具備第1硬質相、第2硬質相、及結合相，且上述第1硬質相由複數個碳化鎢粒子所構成，上述第2硬質相由選自由TiNbC、TiNbN、TiNbCN、TiTaC、TiTaN、TiTaCN、TiTaNbC、TiTaNbN、及TiTaNbCN所組成之群中之至少1種第1化合物所構成，上述結合相包含50質量%以上之鈷，上述超硬合金之上述第1硬質相、上述第2硬質相、及上述結合相之合計含有率為94體積%以上，上述超硬合金之上述第1硬質相之含有率為65.0體積%以上95.0體積%以下，上述超硬合金之上述第2硬質相之含有率為0.1體積%以上5.0體積%以下，上述超硬合金之上述結合相之含有率為4.0體積%以上25.0體積%以下，上述碳化鎢粒子之Heywood徑之以體積基準計之粒度分佈中之標準偏差sd為0.25 μm以上0.50 μm以下，直徑為0.2 μm以下之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為1%以上10%以下，直徑為0.8 μm以上之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為1%以上10%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cemented carbide including: a first hard phase at a content of 65.0 vol% or more and 95.0 vol% or less composed of a plurality of tungsten carbide particles; a second hard phase at a content of 0.1 vol% or more and 5.0 vol% or less composed of at least one first compound selected from the group consisting of TiNbC, TiNbN, TiNbCN, TiTaC, TiTaN, TiTaCN, TiTaNbC, TiTaNbN, and TiTaNbCN; and a binder phase at a content of 4.0 vol% or more and 25.0 vol% or less containing cobalt at 50 mass% or more, wherein a total content of the first hard phase, the second hard phase, and the binder phase in the cemented carbide is 94 vol% or more, a standard deviation sd of Heywood diameters of the tungsten carbide particles in the particle size distribution on a volume basis is 0.25 μm or more and 0.50 μm or less, a percentage of the number of the second hard phases having a diameter of 0.2 μm or less relative to the number of all of the second hard phases is 1% or more and 10% or less, and a percentage of the number of the second hard phases having a diameter of 0.8 μm or more relative to the number of all of the second hard phases is 1% or more and 10% or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:切削工具</p>
        <p type="p">11:刀尖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1450" publication-number="202632017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及切削工具</chinese-title>
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C22C29/08</main-classification>
        <further-classification edition="200601120260420B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村好博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕索斯　阿儂薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASEUTH, ANONGSACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種超硬合金，其具備第1硬質相、第2硬質相、及結合相，且上述第1硬質相由複數個碳化鎢粒子所構成，上述第2硬質相由選自由TiNbC、TiNbN、TiNbCN、TiTaC、TiTaN、TiTaCN、TiTaNbC、TiTaNbN、及TiTaNbCN所組成之群中之至少1種第1化合物所構成，上述結合相包含50質量%以上之鈷，上述超硬合金之上述第1硬質相、上述第2硬質相、及上述結合相之合計含有率為94體積%以上，上述超硬合金之上述第1硬質相之含有率為75.0體積%以上97.0體積%以下，上述超硬合金之上述第2硬質相之含有率為0.1體積%以上5.0體積%以下，上述超硬合金之上述結合相之含有率為4.0體積%以上15.0體積%以下，上述碳化鎢粒子之Heywood徑之以體積基準計之粒度分佈中之標準偏差sd為0.1 μm以上0.25 μm以下，直徑為0.2 μm以下之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為1%以上10%以下，直徑為0.8 μm以上之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為1%以上10%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cemented carbide includes a first hard phase at a content of 75.0 vol% or more and 97.0 vol% or less, composed of a plurality of tungsten carbide particles, a second hard phase at a content of 0.1 vol% or more and 5.0 vol% or less, composed of at least one first compound selected from the group consisting of TiNbC, TiNbN, TiNbCN, TiTaC, TiTaN, TiTaCN, TiTaNbC, TiTaNbN, and TiTaNbCN, and a binder phase at a content of 4.0 vol% or more and 15.0 vol% or less, containing cobalt at 50 mass% or more, a total content of the first hard phase, the second hard phase, and the binder phase in the cemented carbide is 94 vol% or more, a standard deviation sd of Heywood diameters of the tungsten carbide particles in the particle size distribution on a volume basis is 0.1 μm or more and 0.25 μm or less, a percentage of the number of the second hard phases having a diameter of 0.2 μm or less relative to the number of all of the second hard phases is 1% or more and 10% or less, and a percentage of the number of the second hard phases having a diameter of 0.8 μm or more relative to the number of all of the second hard phases is 1% or more and 10% or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:切削工具</p>
        <p type="p">11:刀尖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1451" publication-number="202632796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及電連接器之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260428B">H01R12/77</main-classification>
        <further-classification edition="200601120260428B">H01R43/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木昌輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種可降低電線之特性阻抗之劣化或紊亂之程度之電連接器。  &lt;br/&gt;電連接器具備第1電線及殼體。第1電線沿著第1方向延伸，具有導體及覆蓋導體之絕緣性之被覆。殼體具有第1槽，該第1槽係以與第1方向交叉之第2方向為深度方向，沿著第1方向延伸且收容並支持第1電線。位於第1槽上之第1電線之導體之側面中，收置置於第1槽之內部之第1部分係自被覆露出，位於第1槽之外部之第2部分之至少一部分係由被覆覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電連接器</p>
        <p type="p">11:電線</p>
        <p type="p">11a:導體</p>
        <p type="p">11b:被覆</p>
        <p type="p">11ba:部分</p>
        <p type="p">11bb:部分</p>
        <p type="p">21:殼體前端部</p>
        <p type="p">21a:前表面</p>
        <p type="p">21b:後表面</p>
        <p type="p">22a:保持孔(第1保持孔)</p>
        <p type="p">22b:保持孔(第2保持孔)</p>
        <p type="p">22c:保持孔</p>
        <p type="p">22d:保持孔</p>
        <p type="p">30:階梯支持部</p>
        <p type="p">31a:槽(第1槽)</p>
        <p type="p">32a:槽(第2槽)</p>
        <p type="p">32b:壁</p>
        <p type="p">33a:槽</p>
        <p type="p">34a:槽</p>
        <p type="p">X,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1452" publication-number="202632316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學薄膜及包含其之顯示裝置</chinese-title>
        <english-title>OPTICAL FILM AND DISPLAY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B1/08</main-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B5/30</further-classification>
        <further-classification edition="200601120260504B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東麗先端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵重碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JOONG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金潢龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HWANGYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種光學薄膜，更詳細而言，依據本發明之一實施例之光學薄膜， 能改善顯示裝置之左右視角，即使於大面積製造之情況下，亦可均勻地展現視角改善之效果。此外，於改善視角之同時不降低正面亮度特性，並能在提升對比度之同時，將色彩變動最小化。進而可防止分散體被觀察，且可一併防止亮線可見現象或漏光等副作用。此外，由於適合以低成本進行大面積大量生產，因此可廣泛用作各種顯示裝置之光學組件 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:各向異性擴散層</p>
        <p type="p">110:表層</p>
        <p type="p">200:光學薄膜</p>
        <p type="p">X-X':界線</p>
        <p type="p">Y-Y':界線</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1453" publication-number="202631654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多肽、ＲＮＡ分子及其醫藥用途</chinese-title>
        <english-title>POLYPEPTIDES, RNA MOLECULES AND THEIR MEDICAL USES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/515</main-classification>
        <further-classification edition="201001120260504B">C12N15/113</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K38/17</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海瑞宏迪醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI REGENELEAD THERAPIES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嬌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張行潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XINGRUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寧威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NING, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鵲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及多肽、RNA分子及其醫藥用途，具體涉及ANGPTL多肽、RNA分子、多核苷酸、載體、脂質奈米顆粒、醫藥組成物及醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to polypeptides, RNA molecules and their medical uses, and in particular to ANGPTL polypeptides, RNA molecules, polynucleotides, vectors, lipid nanoparticles, pharmaceutical compositions and their medical uses.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1454" publication-number="202631595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＮＬＲＰ３調節劑之晶型</chinese-title>
        <english-title>CRYSTALLINE FORMS OF AN NLRP3 MODULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D401/06</main-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">C07D237/08</further-classification>
        <further-classification edition="200601120260504B">C07D413/06</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商佐馬根生物有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOMAGEN BIOSCIENCES LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾肯豪爾　史考特　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLCKENHAUER, SCOTT ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘努萊爾　理查德　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENULIAR, RICHARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧柯尼亞　約翰　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKONYA, JOHN F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　曉虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, XIAOHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述2-(6-((R)-羥基((R)-1-甲基哌啶-3-基)甲基)-4-甲基嗒嗪-3-基)-5-(三氟甲基)苯酚之晶型或其醫藥上可接受之鹽或溶劑合物。本文亦描述2-(6-((R)-羥基((R)-1-甲基哌啶-3-基)甲基)-4-甲基嗒嗪-3-基)-5-(三氟甲基)苯酚或其醫藥上可接受之鹽或溶劑合物，包括晶型，及合成方法中使用之化學中間物之製備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are crystalline forms of 2-(6-((R)-hydroxy((R)-1-methylpiperidin-3-yl)methyl)-4-methylpyridazin-3-yl)-5-(trifluoromethyl)phenol, or a pharmaceutically acceptable salt or solvate thereof. Also described herein is the preparation of 2-(6-((R)-hydroxy((R)-1-methylpiperidin-3-yl)methyl)-4-methylpyridazin-3-yl)-5-(trifluoromethyl)phenol, or a pharmaceutically acceptable salt or solvate thereof, including crystalline forms, and chemical intermediates used in the synthetic processes.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1455" publication-number="202632318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學片材、片材物品、偏光板、觸控面板構件、顯示裝置、透鏡構件及感測器裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260427B">G02B1/111</main-classification>
        <further-classification edition="201501120260427B">G02B1/14</further-classification>
        <further-classification edition="200601120260427B">G01N23/223</further-classification>
        <further-classification edition="200601120260427B">G06F3/041</further-classification>
        <further-classification edition="200601120260427B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤咲乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, SAKINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉中健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAKA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常田洋貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNEDA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤恵実子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, EMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚田賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKADA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光學片材包含在第1方向上對向之第1面與第2面。本發明之光學片材自第1面朝向第2面依序包含功能層及基材。功能層包含黏合劑成分及中空二氧化矽粒子。第2比率小於第1比率。第1比率係功能層內之第1位置處的Si元素之螢光X射線強度相對於C元素之螢光X射線強度之比率。第2比率係功能層內之第2位置處的Si元素之螢光X射線強度相對於C元素之螢光X射線強度之比率。第1位置係沿著第1方向自第1面向第2面接近50 nm之位置。第2位置係沿著第1方向自第1面向第2面接近140 nm之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學片材</p>
        <p type="p">11:第1面</p>
        <p type="p">12:第2面</p>
        <p type="p">15:相鄰區域</p>
        <p type="p">20:功能層</p>
        <p type="p">21:第1面</p>
        <p type="p">22:第2面</p>
        <p type="p">31:第1功能層</p>
        <p type="p">31a:第1面</p>
        <p type="p">31b:第2面</p>
        <p type="p">32:黏合劑成分</p>
        <p type="p">33:中空二氧化矽粒子</p>
        <p type="p">36:第2功能層</p>
        <p type="p">36a:第1面</p>
        <p type="p">36b:第2面</p>
        <p type="p">37:黏合劑成分</p>
        <p type="p">38:中空二氧化矽粒子</p>
        <p type="p">40:樹脂層</p>
        <p type="p">50:基材</p>
        <p type="p">BS1:第1界面</p>
        <p type="p">BS2:第2界面</p>
        <p type="p">BS3:第3界面</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1456" publication-number="202631159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微管相關蛋白TAU（MAPT）iRNA製劑及其使用方法</chinese-title>
        <english-title>MICROTUBULE ASSOCIATED PROTEIN TAU (MAPT) IRNA FORMULATIONS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/713</main-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K9/19</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾拉倫製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮　安迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHUNG, ANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUEH, HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克瑞史莫　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRETSCHMER, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席曼尼　卡莫然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMANI, KAMRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜劉巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LIUWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐　勃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼契夫　魯波米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NECHEV, LUBOMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　立剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　宓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNG, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於靶向MAPT基因之雙股核糖核酸(dsRNAi)藥劑之製劑、以及抑制MAPT基因之表現之方法及使用此類dsRNAi藥劑製劑治療患有MAPT相關神經退化性疾病或病症(例如阿滋海默氏症(Alzheimer’s disease)、FTD、PSP或其他tau蛋白病)之個體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to formulations of double stranded ribonucleic acid (dsRNAi) agents targeting a MAPT gene, as well as methods of inhibiting expression of a MAPT gene and methods of treating subjects having a MAPT-associated neurodegenerative disease or disorder, &lt;i&gt;e.g.&lt;/i&gt;, Alzheimer’s disease, FTD, PSP, or other tauopathy, using such dsRNAi agent formulations.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1457" publication-number="202632030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明導電膜、透明導電膜結構體、透明導電膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C23C14/08</main-classification>
        <further-classification edition="200601120260424B">C23C14/18</further-classification>
        <further-classification edition="202601120260424B">H10P14/20</further-classification>
        <further-classification edition="200601120260424B">H01B5/14</further-classification>
        <further-classification edition="200601120260424B">H01B1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬礦山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大上秀晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMI, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足立健治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明導電膜，其具有第一層和第二層，前述第二層直接積層在前述第一層上，前述第二層包括HTB薄膜，該HTB薄膜是六方晶鎢青銅的薄膜，前述第一層的至少一部分與前述第二層的前述HTB薄膜外延接合（epitaxial junction）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:透明導電膜</p>
        <p type="p">11:第一層</p>
        <p type="p">12:第二層</p>
        <p type="p">T11:膜厚</p>
        <p type="p">T12:膜厚</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1458" publication-number="202631516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾燥劑塗層系統</chinese-title>
        <english-title>DESICCANT COATING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260429B">C02F1/28</main-classification>
        <further-classification edition="200601120260429B">F25B15/16</further-classification>
        <further-classification edition="202201120260429B">C09K23/00</further-classification>
        <further-classification edition="200601120260429B">B01J20/18</further-classification>
        <further-classification edition="200601120260429B">B32B7/12</further-classification>
        <further-classification edition="200601120260429B">B01D53/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商水收集公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATER HARVESTING INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉夫琴科　柏夫洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAVCHENKO, PAVLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡普斯汀　艾維根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPUSTIN, IEVGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及可用於從大氣中吸附水的吸附劑組合物。在具體的實施例中，所述吸附劑組合物可以作為吸附劑層單獨安置，或者可以作為吸附劑層安置在基底材料上，所述吸附劑層可以被重新配置為多個結構組件，所述多個結構組件可用於組裝安置在集水器的吸附/解吸結構內的水捕獲模塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to sorbent compositions that are useful in the adsorption of water from the atmosphere. In particular embodiments, the sorbent compositions can be disposed alone as a sorbent layer or can be disposed as a sorbent layer on a substrate material, which can be reconfigured as a plurality of structural components that are useful in the assembly water capture modules disposed within an adsorption/desorption structure of a water harvester.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸附劑組合物</p>
        <p type="p">3:吸附劑組合物層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1459" publication-number="202631311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於維持透射率之拋光墊及其製備方法</chinese-title>
        <english-title>POLISHING PAD FOR MAINTAINING TRANSMITTANCE AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260423B">B24B37/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商恩普士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENPULSE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李都炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOEHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐章源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹鍾旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, JONGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金潁煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金京煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例之拋光墊包含：一頂部墊，其具有三個或更多個穿透孔及複數個溝槽；以及一窗塊，其插入至該等穿透孔中之各者之下部部分中，其中各穿透孔之未被該窗塊填充之上部部分形成一凹坑，該凹坑之深度與該頂部墊之厚度的比率為0.1至0.4，且各凹坑連接至該等溝槽中之任一者。根據該實施例之該拋光墊最少化一CMP程序期間窗口表面上之刮痕且促進拋光殘留物透過該等溝槽排出，藉此防止由刮痕及殘留物引起之一透射率降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The polishing pad according to an embodiment comprises a top pad having three or more penetrating holes and a plurality of grooves; and a window block inserted into the lower part of each of the penetrating holes, wherein the upper part of each penetrating hole that is not filled with the window block forms a pit, the ratio of the depth of the pit to the thickness of the top pad is 0.1 to 0.4, and each pit is connected to any of the grooves. The polishing pad according to the embodiment minimizes scratches on the window surface during a CMP process and facilitates the discharge of polishing residues through the grooves, thereby preventing a decrease in transmittance caused by scratches and residues.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頂部墊</p>
        <p type="p">200:窗塊</p>
        <p type="p">300:黏著層</p>
        <p type="p">400:底部墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1460" publication-number="202631243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高效能除濕裝置</chinese-title>
        <english-title>HIGH PERFORMANCE DEHUMIDIFIER APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B01D53/06</main-classification>
        <further-classification edition="200601120260428B">B01D53/26</further-classification>
        <further-classification edition="200601120260428B">E03B3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商百瑞亞（亞洲）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRY-AIR (ASIA) PVT. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩奇戴夫　拉然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHDEV, RAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘特　卡姆雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANT, KAMLESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利克　庫爾迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALIK, KULDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於提供一種具有除濕轉輪的除濕裝置，該除濕轉輪結合特殊的吸附劑材料，該材料是高度多孔的且有介於500 m²/g至10000 m²/g範圍內的表面積。具有結合了特殊除濕材料的除濕轉輪的這些除濕裝置已證明不僅能夠在低於100°C至120°C的溫度下良好再生，且在相似操作條件下還顯示出大於15～25%的更高吸附性能（水分去除）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to providing a dehumidifier apparatus with a desiccant wheel incorporating special adsorbent materials, which are highly porous, with surface area in a range of 500 m2/g to 10000 m2/g. These dehumidifier apparatuses having desiccant wheels incorporating special desiccant materials have demonstrated the ability to not only be regenerated well at temperatures of less than 100°C to 120°C, but have also shown greater than 15-25% higher adsorption performance (water removal), under similar operating conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕轉輪</p>
        <p type="p">2:處理區段</p>
        <p type="p">3:再活化區段</p>
        <p type="p">4:轉輪驅動裝置</p>
        <p type="p">5:風機、第二風機、第三風機</p>
        <p type="p">6:處理入口空氣路徑、空氣路徑</p>
        <p type="p">7:處理出口空氣路徑、空氣路徑</p>
        <p type="p">8:再活化入口空氣路徑、空氣路徑</p>
        <p type="p">9:再活化出口空氣路徑、空氣路徑</p>
        <p type="p">10:加熱單元、第一風機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1461" publication-number="202631244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用熱泵之高效能除濕裝置</chinese-title>
        <english-title>HIGH PERFORMANCE DEHUMIDIFIER APPARATUS USING HEAT PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B01D53/06</main-classification>
        <further-classification edition="200601120260428B">B01D53/26</further-classification>
        <further-classification edition="200601120260428B">E03B3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商百瑞亞（亞洲）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRY-AIR (ASIA) PVT. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩奇戴夫　拉然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHDEV, RAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘特　卡姆雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANT, KAMLESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利克　庫爾迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALIK, KULDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明將現在可獲得的，在低於100°C，較佳低於80°C，較佳在60°C至80°C之間的溫度下為再生提供熱量的熱泵，與包含採用特殊吸附劑材料的除濕轉輪的除濕裝置相結合，該特殊吸附劑材料能夠在60°C至80°C之間的溫度下被很好地再生。該特殊吸附劑材料是多孔和結晶材料，具有在500 m²/g至10,000 m²/g範圍內的表面積，以及在60°C至80°C之間的再生溫度。因此，與配置承載基準材料（矽膠和分子篩）的除濕轉輪的除濕裝置相比，本除濕裝置在相似的操作條件下已顯示出大於15～25%的更高吸附性能（水分去除）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention combines the now available heat pumps delivering heat at temperatures of less than 100 DegC, preferably less than 80 DegC, preferably between 60 DegC to 80 DegC for regeneration, with a dehumidifier apparatus incorporating desiccant wheel using special adsorbent materials that can be very well regenerated at temperatures between 60 DegC to 80 DegC. The special adsorbent materials are porous and crystalline materials, with surface area in a range of 500 m&lt;sup&gt;2&lt;/sup&gt;/g to 10,000 m&lt;sup&gt;2&lt;/sup&gt;/g, and a regeneration temperature between 60 DegC to 80 DegC. Thus, the present dehumidification apparatus has shown greater than 15-25% higher adsorption performance (water removal), under similar operating conditions when compared with dehumidifier apparatuses deploying desiccant wheel carrying benchmark materials (silica gels and molecular sieves).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕轉輪</p>
        <p type="p">2:處理區段</p>
        <p type="p">3:再活化區段</p>
        <p type="p">4:轉輪驅動裝置</p>
        <p type="p">5:蒸發器、冷水盤管、冷水盤管單元</p>
        <p type="p">6:處理入口空氣路徑、空氣路徑</p>
        <p type="p">7:處理出口空氣路徑、空氣路徑</p>
        <p type="p">8:再活化入口空氣路徑、空氣路徑</p>
        <p type="p">9:壓縮機</p>
        <p type="p">10:冷凝器、熱水盤管、熱水盤管單元</p>
        <p type="p">11:第二風機</p>
        <p type="p">12:再活化出口空氣路徑、再活化空氣出口空氣路徑、空氣路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1462" publication-number="202631242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於低露點應用的高性能除濕裝置</chinese-title>
        <english-title>HIGH PERFORMANCE DEHUMIDIFIER APPARATUS FOR LOW DEW POINT APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B01D53/04</main-classification>
        <further-classification edition="200601120260504B">B01D53/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商百瑞亞（亞洲）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRY-AIR (ASIA) PVT. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩奇戴夫　拉然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHDEV, RAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘特　卡姆雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANT, KAMLESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬利克　庫爾迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALIK, KULDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於低露點應用的除濕裝置，其設置有結合特殊吸附材料的除濕轉輪；這些材料具有高孔隙率，為結晶態或非晶態或兩者兼具或多元態，其表面積在500 m&lt;sup&gt;2&lt;/sup&gt;/g至10000 m&lt;sup&gt;2&lt;/sup&gt;/g範圍內，並且在0.1-5%相對濕度(Rh)下具有X至Y範圍內的高吸收量，通常被稱為具有I型等溫線的吸附材料。這些具有結合了特殊材料的除濕轉輪的除濕裝置，不僅已證明能夠在低於100°C的溫度下良好再生，而且還已顯示出提高15-25%的吸附性能（除水），係用於在相似操作條件下實現所期望的低露點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dehumidifier apparatus for low dew point application is disclosed, which deploys a desiccant wheel incorporating special adsorbent materials, which are highly porous, which are either crystalline or amorphous or both or multivariate, with surface area in a range of 500 m&lt;sup&gt;2&lt;/sup&gt;/g to 10000 m&lt;sup&gt;2&lt;/sup&gt;/g, and have an high uptake in a range of X to Y at 0.1-5% relative humidity (Rh), typically referred to as adsorbent materials with Type-1 isotherm. These dehumidifier apparatuses having desiccant wheels incorporating special materials have demonstrated the ability to not only be regenerated well at temperatures of less than 100 degC, but have also shown 15-25% higher adsorption performance (water removal), for achieving desired low dew point under similar operating conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕轉輪</p>
        <p type="p">10:第一風機</p>
        <p type="p">11:處理輸入空氣路徑</p>
        <p type="p">12:處理輸出空氣路徑</p>
        <p type="p">13:吹掃輸入空氣路徑</p>
        <p type="p">14:第二風機</p>
        <p type="p">15:吹掃輸出空氣路徑</p>
        <p type="p">16:加熱單元</p>
        <p type="p">17:再生輸入空氣路徑</p>
        <p type="p">18:第三風機</p>
        <p type="p">19:再生輸出空氣路徑</p>
        <p type="p">2:處理區段</p>
        <p type="p">3:再生區段</p>
        <p type="p">4:吹掃區段</p>
        <p type="p">5:轉輪驅動裝置</p>
        <p type="p">7:冷卻單元</p>
        <p type="p">7a:冷卻單元</p>
        <p type="p">9:處理回風路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1463" publication-number="202631245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有特殊材料的除濕轉輪</chinese-title>
        <english-title>DESICCANT WHEEL DEPLOYING SPECIAL MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B01D53/06</main-classification>
        <further-classification edition="200601120260427B">B01D53/26</further-classification>
        <further-classification edition="200601120260427B">B01D53/28</further-classification>
        <further-classification edition="200601120260427B">B01J20/22</further-classification>
        <further-classification edition="200601120260427B">B01J20/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商國際除濕轉子私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESICCANT ROTORS INTERNATIONAL PVT. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, DEEPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瓦　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAHWA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬達里　阿尼爾　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUDHARY, ANIL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索　尼婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種除濕轉輪，包括配製有特殊除濕材料的蜂巢基體結構，藉此，所述除濕轉輪能夠表現出相較於傳統矽膠和分子篩除濕轉輪更改進的性能特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a desiccant wheel comprising a honeycomb matrix structure formulated with special desiccant materials, whereby the desiccant wheel is capable of exhibiting improved performance characteristics compared to conventional silica gel and molecular sieve desiccant wheel.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1464" publication-number="202632099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近紅外線吸收纖維、纖維製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">D01F6/90</main-classification>
        <further-classification edition="200601120260428B">D06M11/48</further-classification>
        <further-classification edition="200601120260428B">C01G41/02</further-classification>
        <further-classification edition="200601120260428B">B32B27/00</further-classification>
        <further-classification edition="200601320260428B">D06M101/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬礦山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長南武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONAN, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤孝郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種近紅外線吸收纖維，其包含：  &lt;br/&gt;非離子性高分子分散劑、  &lt;br/&gt;複合鎢氧化物顆粒、以及  &lt;br/&gt;聚醯胺樹脂，  &lt;br/&gt;該複合鎢氧化物顆粒含有：具有六方晶體的晶體結構的，由通式M&lt;sub&gt;x&lt;/sub&gt;WO&lt;sub&gt;y&lt;/sub&gt;(其中，M元素包含選自Cs、Rb中的1種以上的元素，該x、該y滿足0.1≤x≤1.0、2.0≤y＜4.0)表示的複合鎢氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:近紅外線吸收纖維</p>
        <p type="p">11:纖維</p>
        <p type="p">11A:表面</p>
        <p type="p">11B:內部</p>
        <p type="p">12:複合鎢氧化物顆粒</p>
        <p type="p">CA:中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1465" publication-number="202632088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶成長裝置以及單晶成長方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C30B13/24</main-classification>
        <further-classification edition="200601120260422B">C30B15/16</further-classification>
        <further-classification edition="200601120260422B">C30B29/16</further-classification>
        <further-classification edition="200601120260422B">H05B6/00</further-classification>
        <further-classification edition="200601120260422B">H05H1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｃ&amp;Ａ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C&amp;A CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田健稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIDA, TAKETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡秋里欣　弗拉基米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCHURIKHIN, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單晶成長裝置，係使用於依據感應加熱從而進行之單晶成長方法中，並且具備：高頻振盪器，係具備真空管；感應加熱線圈，係依據從前述高頻振盪器施加的高頻電流將對象物體予以感應加熱；測量部，係測量與前述高頻振盪器的輸出有關的訊號；控制部，係基於與輸出有關的前述訊號而輸出與前述高頻振盪器所具備的逆變器電路內的柵極線圈或陽極線圈的電感之調整有關的控制訊號；以及調整部，係按照從前述控制部輸出的前述控制訊號調整前述電感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:單晶成長裝置</p>
        <p type="p">10:高頻振盪器</p>
        <p type="p">20:電阻電感電容電路</p>
        <p type="p">30:測量部</p>
        <p type="p">40:控制部</p>
        <p type="p">50:調整部</p>
        <p type="p">51:調整機構</p>
        <p type="p">60:驅動部</p>
        <p type="p">L&lt;sub&gt;coil&lt;/sub&gt;:感應加熱線圈</p>
        <p type="p">O:對象物體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1466" publication-number="202631160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物及其用途</chinese-title>
        <english-title>COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260504B">A61K33/244</main-classification>
        <further-classification edition="200601120260504B">A61K33/26</further-classification>
        <further-classification edition="200601120260504B">A61K31/194</further-classification>
        <further-classification edition="200601120260504B">A61K31/198</further-classification>
        <further-classification edition="200601120260504B">C07F7/00</further-classification>
        <further-classification edition="200601120260504B">C07F15/02</further-classification>
        <further-classification edition="200601120260504B">C07C229/42</further-classification>
        <further-classification edition="200601120260504B">C07C229/08</further-classification>
        <further-classification edition="200601120260504B">A61P3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商維凡斯私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVANCE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加迪　維諾德　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADI, VINOD KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫特　斯里尼瓦薩　雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTHE, SRINIVASA REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　桑傑庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SANJAY KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝魯爾本卡塔拉亞　蘇雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELUR VENKATARAYA, SURESHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此發明提供一種金屬有機骨架 (MOF)，可用於治療或預防高磷血症， 其中該 MOF 包含多個金屬離子，每一個金屬離子皆配位至多個有機配體，且 當中眾多的金屬離子包含 Zr&lt;sup&gt;4+&lt;/sup&gt;、Fe&lt;sup&gt;3+&lt;/sup&gt;，或 Zr&lt;sup&gt;4+&lt;/sup&gt; 與 Fe&lt;sup&gt;3+&lt;/sup&gt; 的組合，以及眾多有機配體選自以下基團一員或多員，該基團是根據通式 (I) 之化合物組成；由兩個羧酸根取代之 C&lt;sub&gt;2&lt;/sub&gt;-&lt;sub&gt;6  &lt;/sub&gt; 烷基，並可選擇性由一或兩個羥基取代；由兩個羧酸根取代之 C&lt;sub&gt;4&lt;/sub&gt;-&lt;sub&gt;6&lt;/sub&gt; 烯烴；可選擇由一或兩個胺基取代之苯二甲酸根；苯三甲酸根；一個5 至 6 員的雜芳環，包括選自含氮、硫或氧之基團的 1 或 2 個原子，且該雜芳環是由兩個羧酸根基團取代；由兩個羧酸根基團取代之環己烷；以及胱胺酸根；或其中有藥學上可接受之鹽或溶劑化物。此發明亦提供一種藥物組合物，包含了此發明的 MOF。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a metal-organic framework (MOF) that finds utility in the treatment or prevention of hyperphosphatemia, wherein the MOF comprises a plurality of metal ions, each coordinated to a plurality of organic ligands, and wherein the plurality of metal ions comprises Zr&lt;sup&gt;4+&lt;/sup&gt; ions, Fe&lt;sup&gt;3+&lt;/sup&gt;ions, or a combination of Zr&lt;sup&gt;4+&lt;/sup&gt; and Fe&lt;sup&gt;3+&lt;/sup&gt; ions, and the plurality of organic ligands are selected from one or more members of the group consisting of a compound according to formula (I) as defined herein; a C&lt;sub&gt;2-6  &lt;/sub&gt;alkane substituted by two carboxylate groups and optionally substituted by one or two OH groups; a C&lt;sub&gt;4-6&lt;/sub&gt; alkene substituted by two carboxylate groups; a benzenedicarboxylate optionally substituted by one or two NH&lt;sub&gt;2&lt;/sub&gt; groups; a benzenetricarboxylate; a 5-6 membered heteroaromatic ring comprising 1 or 2 atoms selected from the group consisting of N, S and O, wherein said heteroaromatic ring is substituted by two carboxylate groups; cyclohexane substituted by two carboxylate groups; and cystinate; or a pharmaceutically acceptable salt or solvate thereof. The present invention also provides a pharmaceutical composition comprising a MOF of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:合成金屬有機骨架(MOF)</p>
        <p type="p">1b:吸附機制</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1467" publication-number="202631681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與人類TPOR結合之抗體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P7/00</further-classification>
        <further-classification edition="200601120260504B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商協和麒麟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOWA KIRIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤優子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町野悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHINO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小芦泰治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OASHI, TAIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤誠嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種與人類TPOR結合之抗體或該抗體片段、具有編碼該抗體或該抗體片段之鹼基序列之核酸、含有該核酸之載體、包含該載體之轉形細胞、該抗體或該抗體片段之製造方法、含有該抗體或該抗體片段之治療劑及含有該抗體或該抗體片段之檢測用試劑或者測定用試劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1468" publication-number="202632501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>驅動控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F11/28</main-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
        <further-classification edition="200601120260102B">G11C29/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昕芙旎雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>七夕晃斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABATA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾臺泰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAI, TAIHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 能夠實現一種構成，其係於具有控制驅動對象之驅動之驅動控制部之驅動控制裝置中，能夠偵測出異常，並且能夠僅將所偵測出之異常當中之預定之異常之資訊，不記憶於記憶部地進行保持。  &lt;br/&gt;　　[解決手段] 驅動控制裝置(1)，係具有：異常偵測訊號取得部(25)，係取得對應於驅動控制裝置(1)及驅動對象(P)之至少其中一方之異常所生成之異常偵測訊號；錯誤訊號生成部(31)，係自前述所取得之異常偵測訊號當中判別出預定條件之異常偵測訊號，根據前述預定條件之異常偵測訊號，生成並輸出錯誤訊號；以及錯誤訊號保持部(40)，係保持前述錯誤訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:驅動控制裝置</p>
        <p type="p">10:驅動控制部</p>
        <p type="p">20:異常偵測部</p>
        <p type="p">25:異常偵測訊號取得部</p>
        <p type="p">30:錯誤控制部</p>
        <p type="p">31:錯誤訊號生成部</p>
        <p type="p">32:重置控制部</p>
        <p type="p">33:記憶部</p>
        <p type="p">34:保持訊號檢測部</p>
        <p type="p">35:閂鎖重置控制部</p>
        <p type="p">40:錯誤訊號保持部</p>
        <p type="p">50:錯誤訊號輸出部</p>
        <p type="p">60:輸出監測部</p>
        <p type="p">P:驅動對象</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1469" publication-number="202633256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽系基板用保護膜形成劑、矽系基板之處理方法，及半導體裝置之製造方法</chinese-title>
        <english-title>PROTECTIVE FILM FORMING AGENT FOR SILICON-BASED SUBSTRATE, METHOD FOR PROCESSING SILICON-BASED SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P10/00</main-classification>
        <further-classification edition="202601120260423B">H10P52/00</further-classification>
        <further-classification edition="200601120260423B">C09K13/00</further-classification>
        <further-classification edition="200601120260423B">C23C18/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芹澤航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERIZAWA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種矽系基板用保護膜形成劑，以及使用其之矽系基板的處理方法，及使用其之半導體裝置之製造方法，該矽系基板用保護膜形成劑含有矽烷基化劑、與Hildebrand之SP值為17.5以下之溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1470" publication-number="202633503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝、及半導體封裝之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W74/01</main-classification>
        <further-classification edition="202601120260427B">H10W74/10</further-classification>
        <further-classification edition="202601120260427B">H10P52/40</further-classification>
        <further-classification edition="202601120260427B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戎由貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBISU, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑江博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAE, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於在WLCSP中防止由裂痕所致之不良。  &lt;br/&gt;本發明之半導體封裝具備：半導體基板、絕緣膜與背面配線、保護環、及保護膜。於該半導體封裝中，絕緣膜與背面配線形成於半導體基板之背面中之配線區域。又，於半導體封裝中，保護環形成於背面配線之周圍。又，於半導體封裝中，保護膜被覆保護環及絕緣膜與背面配線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">110:光透過基板</p>
        <p type="p">120:接合樹脂</p>
        <p type="p">130:感測器基板</p>
        <p type="p">131:像素區域</p>
        <p type="p">132:晶載透鏡</p>
        <p type="p">141:絕緣膜</p>
        <p type="p">142:背面配線</p>
        <p type="p">143:保護膜</p>
        <p type="p">151:貫通電極</p>
        <p type="p">152:保護環</p>
        <p type="p">200:半導體封裝</p>
        <p type="p">X,Y,Z:軸</p>
        <p type="p">X1~X6:座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1471" publication-number="202633444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W40/22</main-classification>
        <further-classification edition="202601120260428B">H10W40/25</further-classification>
        <further-classification edition="202601120260428B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹佩華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, PEI-HAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱立寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, LI-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳有志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁得期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, TE-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種半導體封裝。該半導體封裝包括基板、晶粒和模塑化合物。該晶粒安裝於基板上。該模塑化合物設置於基板上並圍繞該晶粒。該模塑化合物包括頂表面及低於該頂表面的第一上表面。該晶粒從該模塑化合物中暴露。該模塑化合物的第一上表面與該晶粒的頂表面齊平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package is provided. The semiconductor package includes a substrate, a die, and a molding compound. The die is mounted on the substrate. The molding compound is disposed on the substrate and surrounds the die. The molding compound includes a top surface and a first upper surface lower than the top surface. The die is exposed from the molding compound. The first upper surface of the molding compound is flush with a top surface of the die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500A:半導體封裝</p>
        <p type="p">10,12:方向</p>
        <p type="p">200:基板</p>
        <p type="p">200E,240E:邊緣</p>
        <p type="p">200B,220B:底表面</p>
        <p type="p">200T,220T,240T:頂表面</p>
        <p type="p">210,230:導電結構</p>
        <p type="p">220:晶粒</p>
        <p type="p">220S:側表面</p>
        <p type="p">240:模塑化合物</p>
        <p type="p">240S2:第二側表面</p>
        <p type="p">240S1:第一側表面</p>
        <p type="p">240U1:第一上表面</p>
        <p type="p">242:腔體</p>
        <p type="p">A1:角度</p>
        <p type="p">X1,Y1:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1472" publication-number="202632945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>色域超出顯示方法、色域超出顯示系統、及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04N9/64</main-classification>
        <further-classification edition="200601120260504B">G09G3/20</further-classification>
        <further-classification edition="200601120260504B">G09G5/04</further-classification>
        <further-classification edition="200601120260504B">G06F3/147</further-classification>
        <further-classification edition="200601120260504B">G06F3/153</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商利達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEADER ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原正幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種使用者便利性佳的色域超出顯示方法。  &lt;br/&gt;　　為此，一種色域超出顯示方法係被提供，係為藉由電腦系統而被執行的色域超出顯示方法，其中，從身為被測訊號的映像訊號的像素之色度值而計算出xy色度座標；使用前記像素的色度圖上的座標亦即xy色度座標、前記色度圖上的白色點的前記xy色度座標、前記映像訊號之色域亦即容器色域的色度圖上的前記xy色度座標、較前記容器色域還窄色域之目標色域的色度圖上的前記xy色度座標，而將表示前記像素從目標色域之超出程度的GER值，予以算出；使用前記映像訊號之至少一部分的每一像素的前記GER值、表示色相的H值、表示明度的V值，而將複數個V值之每一範圍的前記映像訊號之至少一部分的像素的前記H值和前記GER值所被配置的複數個色度平面圖，配置成一個合成平面圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51a,52a,53a:圓環</p>
        <p type="p">61a,62a,63a:虛線</p>
        <p type="p">65:中心</p>
        <p type="p">70:包含圓環51a、52a、53a的二維平面圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1473" publication-number="202631742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>甲基苯乙烯同分異構混合物之高軟化點共聚物</chinese-title>
        <english-title>HIGH SOFTENING POINT COPOLYMERS OF METHYLSTYRENE ISOMERIC MIXTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/12</main-classification>
        <further-classification edition="200601120260504B">C08F2/06</further-classification>
        <further-classification edition="200601120260504B">C08F4/14</further-classification>
        <further-classification edition="200601120260504B">C08L25/02</further-classification>
        <further-classification edition="200601120260504B">C09J125/02</further-classification>
        <further-classification edition="200601120260504B">A61F13/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商雨碳德國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAIN CARBON GERMANY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞塞爾　馬琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUSER, MARIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查尼　馬爾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CZARNY, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種包含α-甲基苯乙烯重複單元和乙烯基甲苯重複單元的烴樹脂，其包含至少40wt.%的間乙烯基甲苯重複單元，以及用於生產該樹脂的方法。本文亦描述一種包含α-甲基苯乙烯重複單元和乙烯基甲苯重複單元的烴樹脂，其包含至少85wt.%的對乙烯基甲苯重複單元，及進一步亦描述一種包含α-甲基苯乙烯重複單元和乙烯基甲苯重複單元的烴樹脂，其包含至少30wt.%的間乙烯基甲苯重複單元和至少5wt.%的鄰乙烯基甲苯重複單元，以及用於生產該等樹脂的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein described is a hydrocarbon resin comprising alpha-methylstyrene repeating units and vinyltoluene repeating units, the latter comprising at least 40 wt.% meta-vinyltoluene repeating units, as well as a method for the production of said resin. Also described is a hydrocarbon resin comprising alpha-methylstyrene repeating units and vinyltoluene repeating units, the latter comprising at least 85 wt.% para-vinyltoluene repeating units, and further also a hydrocarbon resin comprising alpha-methylstyrene repeating units and vinyltoluene repeating units, the latter comprising at least 30 wt.% meta- and at least 5 wt.% ortho-vinyltoluene repeating units, as well as to a method for the production of said resins.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1474" publication-number="202632657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援頻率設定的記憶體及記憶體的操作方法</chinese-title>
        <english-title>MEMORY SUPPORTING FREQUENCY SETTING AND OPERATION METHOD OF MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C11/4074</main-classification>
        <further-classification edition="200601120260102B">G11C11/4063</further-classification>
        <further-classification edition="200601120260102B">G11C11/401</further-classification>
        <further-classification edition="200601120260102B">G06F12/02</further-classification>
        <further-classification edition="201901120260102B">G06F1/3203</further-classification>
        <further-classification edition="201801120260102B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金民吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN O</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正宅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, JUNG TAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權瀚表</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HAN BYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYU YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體，包括：設定資訊儲存電路，其配置為儲存多種設定資訊；頻率設定變化檢測電路，其配置為檢測儲存在設定資訊儲存電路中的頻率設定的變化；以及內部命令產生電路，其配置為在檢測到頻率設定的變化時啟動低功率模式訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory includes a setting information storage circuit configured to store various setting information, a frequency setting change detection circuit configured to detect a change in a frequency setting stored in the setting information storage circuit, and an internal command generation circuit configured to activate a low power mode signal when the change in the frequency setting is detected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體</p>
        <p type="p">101:命令位址接收電路</p>
        <p type="p">103:晶片選擇訊號接收電路</p>
        <p type="p">105:時脈訊號接收電路</p>
        <p type="p">110:命令解碼器</p>
        <p type="p">120:設定資訊儲存電路</p>
        <p type="p">130:頻率設定變化檢測電路</p>
        <p type="p">140:內部命令產生電路</p>
        <p type="p">151:或閘</p>
        <p type="p">153:或閘</p>
        <p type="p">155:或閘</p>
        <p type="p">ACT:啟動訊號</p>
        <p type="p">APDE:斷電模式訊號</p>
        <p type="p">ASRE:自刷新模式訊號</p>
        <p type="p">ASREFPD:自刷新斷電模式訊號</p>
        <p type="p">AUTO_CMD&amp;lt;1：0&amp;gt;:自動命令設定位元</p>
        <p type="p">CAs:命令位址訊號</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">CS:晶片選擇訊號</p>
        <p type="p">FSP_DET:頻率設定變化訊號</p>
        <p type="p">MA&amp;lt;7：0&amp;gt;:設定類型訊號</p>
        <p type="p">MRW:設定訊號</p>
        <p type="p">OP&amp;lt;7：0&amp;gt;:設定值訊號</p>
        <p type="p">PCG:預充電訊號</p>
        <p type="p">PDE:斷電模式訊號</p>
        <p type="p">PDE_i:輸出訊號</p>
        <p type="p">RD:讀取訊號</p>
        <p type="p">REF:刷新訊號</p>
        <p type="p">SRE:自刷新模式訊號</p>
        <p type="p">SREF_i:輸出訊號</p>
        <p type="p">SREFPD:自刷新斷電模式訊號</p>
        <p type="p">SREFPD_i:輸出訊號</p>
        <p type="p">WR:寫入訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1475" publication-number="202631215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於霧化藥物投與之咬嘴、介面及藥物總成</chinese-title>
        <english-title>MOUTHPIECE, INTERFACE, AND DRUG ASSEMBLY FOR AEROSOLIZED DRUG ADMINISTRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61M11/04</main-classification>
        <further-classification edition="200601120260504B">A61M15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商ＧＨ研究愛爾蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GH RESEARCH IRELAND LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費茲派翠克　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITZPATRICK, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐布里恩　夏恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'BRIEN, SHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史潘斯　洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPENCE, ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強森　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉納爾塔　喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANALLETTA, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑪洛　伊恩斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMARO, INES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏克　康納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKE, CONOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡麥隆　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMERON, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於投與霧化藥物之設備、系統及方法。該等系統可包括保持腔室、藥物總成、汽化器及咬嘴。該保持腔室、該藥物總成、該汽化器及該咬嘴均可包括用於彼此介接之配合機構，由此在該保持腔室、該藥物總成、該汽化器及該咬嘴之間提供安全、高效且氣密的連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are apparatuses, systems, and methods for administration of an aerosolized drug. The systems can include a holding chamber, a drug assembly, a vaporizer, and a mouthpiece. The holding chamber, drug assembly, vaporizer, and mouthpiece can all include mating mechanisms for interfacing with one another, thereby providing safe, efficient, and airtight connections between the holding chamber, drug assembly, vaporizer, and mouthpiece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:咬嘴</p>
        <p type="p">102(a):第一接合特徵部</p>
        <p type="p">102(b):第二接合特徵部</p>
        <p type="p">104(a),104(b):鎖定部分</p>
        <p type="p">106(a),106(b):間隙/接收部分</p>
        <p type="p">108:內腔</p>
        <p type="p">110(a),110(b),110(c),110(d):大氣通道</p>
        <p type="p">112:唇緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1476" publication-number="202633515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>底部填充層</chinese-title>
        <english-title>UNDERFILL LAYERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W76/42</main-classification>
        <further-classification edition="202601120260427B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉帕蒂　拉瑪坎特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAPATI, RAMAKANTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查達　薩凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHADDA, SAKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹蒂　尼爾瑪利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAITY, NIRMALYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里姆　Ｍ　齊亞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIM, M ZIAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴賈傑　拉吉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJAJ, RAJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包含：一第一基板；一第二基板；互連件，其等將該第一基板接合至該第二基板；及一基於聚合物刷之底部填充層，其在該第一基板與該第二基板之間的一間隙中。一種方法包含：將引發劑分子附著至一經接合結構之一第一基板與一第二基板之間的一間隙中之一或多個表面，其中該第一基板及該第二基板藉由互連件接合；使聚合物鏈自該等引發劑分子生長；及對該經接合結構進行退火以自該間隙中之該等聚合物鏈形成一底部填充層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes: a first substrate; a second substrate; interconnects bonding the first substrate to the second substrate; and a polymer brush-based underfill layer in a gap between the first substrate and the second substrate. A method includes: attaching initiator molecules to one or more surfaces in a gap between a first substrate and a second substrate of a bonded structure, where the first substrate and the second substrate are bonded by interconnects; growing polymer chains from the initiator molecules; and annealing the bonded structure to form an underfill layer from the polymer chains in the gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:經接合結構</p>
        <p type="p">1102a:裝置</p>
        <p type="p">1102b:裝置</p>
        <p type="p">1104a:基板</p>
        <p type="p">1104b:基板</p>
        <p type="p">1106a:導電柱</p>
        <p type="p">1106b:導電柱</p>
        <p type="p">1108a:介電層</p>
        <p type="p">1108b:介電層</p>
        <p type="p">1110:焊料</p>
        <p type="p">1112:引發劑分子</p>
        <p type="p">1114:聚合物鏈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1477" publication-number="202631776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由穩定劑及界面活性劑之組合來增強穩定性</chinese-title>
        <english-title>ENHANCED STABILIZATION BY COMBINATION OF A STABILIZER AND SURFACTANT(S)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/32</main-classification>
        <further-classification edition="200601120260504B">C08G18/42</further-classification>
        <further-classification edition="200601120260504B">C08G18/66</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C08L71/02</further-classification>
        <further-classification edition="200601120260504B">C08L75/06</further-classification>
        <further-classification edition="200601120260504B">C08K5/05</further-classification>
        <further-classification edition="200601120260504B">C08K5/29</further-classification>
        <further-classification edition="200601120260504B">C08J3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田恵介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種組成物（C），其包含熱塑性彈性體（TPE-1）作為組分（C1）；第一添加劑（A1），其量為以組成物（C）之組分總和計0.1至10重量%；添加劑組成物（AC），其量為以組成物（C）之組分總和計0.1至5重量%，其包含至少一種添加劑（A2），其中添加劑組成物（AC）具有根據有機概念圖法測定之大於4.0之HLB值。此外，本發明關於一種根據本發明之組成物用於製備製品之用途，及包含第一添加劑（A1）及包含至少一種添加劑（A2）之添加劑組成物（AC）之混合物（M1）用於包含熱塑性彈性體之組成物之用途，其中添加劑組成物（AC）具有根據有機概念圖法測定之大於4.0之HLB值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition (C) comprising a thermoplastic elastomer (TPE-1) as component (C1); a first additive (A1) in an amount of from 0.1 to 10% by weight based on the sum of components of composition (C); an additive composition (AC) in an amount of from 0.1 to 5% by weight based on the sum of components of composition (C), comprising at least one additive (A2); wherein the additive composition (AC) has an HLB value of greater than 4.0, determined according to the organic conception diagram method. Furthermore, the present invention relates to the use of the composition according to the present invention for the preparation of an article and the use of a mixture (M1) comprising a first additive (A1) and an additive composition (AC) comprising at least one additive (A2) for a composition comprising a thermoplastic elastomer, wherein the additive composition (AC) has an HLB value of greater than 4.0, determined according to the organic conception diagram method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1478" publication-number="202631973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乙烯系共聚物、其製造方法以及半導體零件用洗淨劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C11D7/26</main-classification>
        <further-classification edition="200601120260427B">C08F210/04</further-classification>
        <further-classification edition="200601120260427B">C08F220/06</further-classification>
        <further-classification edition="202601120260427B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東亞合成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOAGOSEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本悠椰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神戶慎哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANBE, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯貴雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISO, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐內康之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANAI, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">乙烯系共聚物使用於半導體零件之洗淨劑。乙烯系共聚物包含構造單位(A)，該構造單位(A)源自具有酸性官能基且不具有酯鍵之乙烯系單體(A)。藉由威廉米法所測量之溫度23℃、濃度0.1質量%之前述乙烯系共聚物之水溶液之表面張力為30mN/m以上70mN/m以下。乙烯系共聚物係例如藉由活性自由基聚合法，使包含乙烯系單體(A)之複數種類之乙烯系單體進行聚合來獲得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1479" publication-number="202633066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含背面圖案的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE COMPRISING BACK PATTERN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260427B">H10B10/00</main-classification>
        <further-classification edition="202501120260427B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐昊瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, HOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金兌衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE-HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都昶勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, CHANGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李於晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括一基體之一前表面上之記憶體胞元、該基體之一背表面上之一第一背面圖案及該基體之該背表面上之一第二背面圖案。該第一背面圖案包括在一第一方向上配置並在與該第一方向相交之一第二方向上延伸之第一接地線以及在該第二方向上延伸之電力線，其中該等第一接地線及該等電力線在該第一方向上交替配置，並且該第二背面圖案包括在該第二方向上配置並在該第一方向上延伸之背面字線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes memory cells on a front surface of a substrate, a first back pattern on a back surface of the substrate, and a second back pattern on the back surface of the substrate. The first back pattern includes first ground lines arranged in a first direction and extending in a second direction intersecting the first direction, and power lines extending in the second direction, where the first ground lines and the power lines are arranged alternately in the first direction, and the second back pattern includes back word lines arranged in the second direction and extending in the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BL1:第一位元線</p>
        <p type="p">BL2:第二位元線</p>
        <p type="p">BP1:第一背面圖案</p>
        <p type="p">BP2:第二背面圖案</p>
        <p type="p">BWL:背面字線</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">FP2:第二正面圖案</p>
        <p type="p">FWL2:第二正面字線</p>
        <p type="p">I-I'；II-II':線</p>
        <p type="p">VDD:電力線</p>
        <p type="p">VSS1:第一接地線</p>
        <p type="p">VSS2:第二接地線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1480" publication-number="202632319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗反射構件以及使用上述抗反射構件之偏光板、圖像顯示面板、圖像顯示裝置及抗反射性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260422B">G02B1/111</main-classification>
        <further-classification edition="201501120260422B">G02B1/14</further-classification>
        <further-classification edition="200601120260422B">G02B5/30</further-classification>
        <further-classification edition="200601120260422B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩見亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOMI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三保木隆志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIHOGI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重吉康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEYOSHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都出卓人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOIDE, TAKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高地清弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKACHI, KIYOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北山寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAYAMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高坂洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耐擦傷性良好之抗反射構件。本發明之抗反射構件100係於基材10上依序具有硬塗層20及低折射率層30，上述低折射率層30包含黏合劑成分31及無機粒子，作為上述無機粒子，包含中空二氧化矽粒子32及第1實心粒子33，於上述低折射率層30之厚度方向上，上述中空二氧化矽粒子32偏集存在於上述硬塗層20，於將上述中空二氧化矽粒子32之平均粒徑定義為r，將上述第1實心粒子33之平均粒徑定義為R1時，r＜R1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基材</p>
        <p type="p">20:硬塗層</p>
        <p type="p">30:低折射率層</p>
        <p type="p">31:黏合劑成分</p>
        <p type="p">32:中空二氧化矽粒子</p>
        <p type="p">33:第1實心粒子</p>
        <p type="p">34:第2實心粒子</p>
        <p type="p">100:抗反射構件</p>
        <p type="p">S:中空二氧化矽粒子偏集存在之區域</p>
        <p type="p">X1:低折射率層之硬塗層側之面</p>
        <p type="p">X2:低折射率層之與硬塗層為相反側之面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1481" publication-number="202632182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學構件、面光源裝置及液晶顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260427B">F21S2/00</main-classification>
        <further-classification edition="200601120260427B">G02B5/02</further-classification>
        <further-classification edition="200601120260427B">G02B5/04</further-classification>
        <further-classification edition="200601120260427B">G02B5/08</further-classification>
        <further-classification edition="200601120260427B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上達明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大隅祥伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHSUMI, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學構件係包含導光板，以及導光板與第1方向重疊的光學薄片。導光板係包含出光面、與前述出光面對向的背面、以及位於前述出光面及前述背面之間的入光面及相反面，入光面及相反面係於第1方向與非平行的第2方向對向。光學薄片係包含第1面、以及與第1面對向的第2面。光學薄片係包含基材薄膜、以及複數單位稜鏡(複數)其係配列於第2方向而構成第2面。背面、出光面、第2面、以及第1面係以該順序位於第1方向。基材薄膜的遲滯量係800nm以上。於對第1方向垂直的面的投影中，基材薄膜的遲相軸與第2方向之間的角度大小係5°以上85°以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液晶顯示裝置</p>
        <p type="p">11:顯示面</p>
        <p type="p">15:液晶顯示面板</p>
        <p type="p">20:面光源裝置</p>
        <p type="p">21:發光面</p>
        <p type="p">24:光源</p>
        <p type="p">25:發光體</p>
        <p type="p">28:光學構件</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1482" publication-number="202631174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>促進產蛋及蛋品質的植物添加物及其應用</chinese-title>
        <english-title>PHYTOGENIC ADDITIVE AND APPLICATION THEREOF IN PROMOTING EGG PRODUCTION AND EGG QUALITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K36/41</main-classification>
        <further-classification edition="200601120260504B">A61K36/48</further-classification>
        <further-classification edition="200601120260504B">A61P5/30</further-classification>
        <further-classification edition="201601120260504B">A23K10/30</further-classification>
        <further-classification edition="201601120260504B">A23K20/10</further-classification>
        <further-classification edition="201601120260504B">A23K50/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐麗芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHYUR, LIE-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳洵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUEN-EI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孟亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於促進產蛋及蛋品質的昭和草(&lt;i&gt;Crassocephalum rabens&lt;/i&gt;，CR)、其萃取物或其中所含之活性成分及/或紅菽草(&lt;i&gt;T. pratense&lt;/i&gt;，TP)及其萃取物或其中所含之活性成分及其應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to &lt;i&gt;Crassocephalum rabens &lt;/i&gt;(CR), an extract thereof or an active ingredient(s) contained therein and/or &lt;i&gt;T. pratense&lt;/i&gt; (TP) and an extract thereof or an active ingredient(s) contained therein, and their applications in promoting egg production and quality.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1483" publication-number="202631638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含吡啶類衍生物抑制劑、其製備方法和應用</chinese-title>
        <english-title>PYRIDINE-CONTAINING DERIVATIVE INHIBITORS, AND PREPARATION METHODS AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D519/00</main-classification>
        <further-classification edition="200601120260504B">C07D401/14</further-classification>
        <further-classification edition="200601120260504B">C07D471/04</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">C07D498/04</further-classification>
        <further-classification edition="200601120260504B">C07D491/048</further-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">C07D491/056</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61K31/4985</further-classification>
        <further-classification edition="200601120260504B">A61K31/513</further-classification>
        <further-classification edition="200601120260504B">A61K31/5383</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/5025</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董加強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, JIAQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧欣賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, XINXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金芳芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FANGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHIZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及含吡啶類衍生物抑制劑、其製備方法和應用。特別地，本發明涉及通式所示的化合物、其製備方法及含有該化合物的藥物組合物，及其作為抑制劑在治療心血管疾病和腦血管等疾病中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to pyridine-containing Derivative inhibitors, and preparation methods and applications thereof. Specifically, the present invention relates to compounds represented by the general formula, preparation methods thereof, pharmaceutical compositions containing the compounds, uses thereof and inhibitor thereof in the treatment of cardiovascular and cerebrovascular diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1484" publication-number="202631635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種大環化合物、其中間體、其製備方法及其應用</chinese-title>
        <english-title>MACROCYCLIC COMPOUND, INTERMEDIATE, PREPARATION METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D517/22</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">C07D513/22</further-classification>
        <further-classification edition="200601120260504B">A61K31/504</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/5365</further-classification>
        <further-classification edition="200601120260504B">A61K31/5383</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商合肥盛浦醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEFEI SHENGPU PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫啟明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, QIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊康敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>底曉煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DI, XIAOYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種大環化合物、其中間體、其製備方法及其應用。具體提供了一種式（I）所示化合物或其藥學上可接受的鹽。本發明的化合物具有如下效果優勢中的一個或多個：（1）對KRAS G12C突變具有良好的抑制活性；（2）對KRAS G12V突變具有良好的抑制活性；（3）對KRAS G12D突變具有良好的抑制活性；（4）半衰期長；（5）口服生物利用度高；（6）肝微粒體穩定性良好；（7）標靶組織分佈高；（8）具有良好的藥代動力學特徵和成藥性。  &lt;br/&gt;&lt;img align="absmiddle" height="229px" width="264px" file="ed10375.JPG" alt="ed10375.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a macrocyclic compound, intermediate, preparation method, and application thereof. Specifically, the invention provides a compound of formula (I) or a pharmaceutically acceptable salt thereof. The compound of the invention has one or more of the following advantages: (1) good inhibitory activity against KRAS G12C mutation；(2) good inhibitory activity against KRAS G12V mutation；(3) good inhibitory activity against KRAS G12D mutation；(4) long half-life；(5) high oral bioavailability；(6) good liver microsomal stability；(7) high distribution to target tissues；and (8) good pharmacokinetic characteristics and drugability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1485" publication-number="202631021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>米飯處理裝置以及米飯管理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260422B">A23L7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鈴茂器工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木美奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATOU, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺川祥織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERAKAWA, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種米飯處理裝置，係具備：貯藏部，係供貯藏米飯；分割形成部，係將米飯分割並形成米飯糰塊；搬送部，係將貯藏部的米飯搬送至分割形成部；接收部，係供配置藉由分割形成部所形成的米飯糰塊；偵測部，係偵測已配置在接收部的米飯糰塊；顯示部；以及控制部；控制部係在偵測部偵測到米飯糰塊的時候使分割形成部停止米飯糰塊的形成；控制部係在自米飯糰塊的形成停止起經過了預定的停止時間的時候將停止圖像顯示於顯示部，停止圖像係顯示分割形成部所進行之米飯糰塊的形成已停止之事項；控制部係在自停止圖像的顯示開始起經過了預定的顯示時間的時候將顯示於顯示部的圖像切換成長時間停止圖像，長時間停止圖像係顯示分割形成部所進行之米飯糰塊的形成已長時間停止之事項。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:收容部(貯藏部)</p>
        <p type="p">2:米飯鬆動部</p>
        <p type="p">3:蓋構件</p>
        <p type="p">5:分割形成部</p>
        <p type="p">6:轉盤</p>
        <p type="p">7:觸控面板</p>
        <p type="p">8:控制部</p>
        <p type="p">10:殼體</p>
        <p type="p">10a:架台</p>
        <p type="p">10b:剩餘量計測部</p>
        <p type="p">11:投入部</p>
        <p type="p">21:米飯供給筒</p>
        <p type="p">22:鬆動構件</p>
        <p type="p">22a:旋轉軸</p>
        <p type="p">22b:鬆動翼</p>
        <p type="p">31:滾筒罩</p>
        <p type="p">51:擋門</p>
        <p type="p">51a,51b:可動齒</p>
        <p type="p">52:形成部</p>
        <p type="p">52a:形成下模</p>
        <p type="p">52b:形成上模</p>
        <p type="p">52c:支撐構件</p>
        <p type="p">52d:支柱</p>
        <p type="p">61:形成孔</p>
        <p type="p">62:外周部</p>
        <p type="p">71:顯示部</p>
        <p type="p">72:操作部(輸入部)</p>
        <p type="p">100:米飯處理裝置</p>
        <p type="p">X:左右方向</p>
        <p type="p">X1:右方</p>
        <p type="p">X2:左方</p>
        <p type="p">Y:前後方向</p>
        <p type="p">Y1:前方</p>
        <p type="p">Y2:後方</p>
        <p type="p">Z:上下方向</p>
        <p type="p">Z1:上方</p>
        <p type="p">Z2:下方</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1486" publication-number="202631019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙軸擠製機以及植物性組織化蛋白質的製造方法</chinese-title>
        <english-title>TWIN SCREW EXTRUDER AND METHOD FOR PRODUCING TEXTURED VEGETABLE PROTEIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A23J3/14</main-classification>
        <further-classification edition="200601120260504B">A23J3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅田光秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEDA, MITSUHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福澤洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUZAWA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田瑞香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, MIZUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川真理奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGAWA, MARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内貴季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, TAKAHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施形態為一種雙軸擠製機，係具備：缸(100)，係沿著軸向設置，且具備原料的原料供給口(120)及液體的液體供給口(130)；原料供給機構，係將植物性組織化蛋白質的原料從原料供給口(120)供給至缸(100)；液體供給機構，係將與原料混合的液體從液體供給口(130)供給至缸(100)；兩個螺桿(151、152)，係能夠旋轉地設於缸(100)內，且混合原料與液體；加熱器(180)，係於軸向中分為複數個區並加熱缸(100)；以及控制器(400)，係針對每個區控制加熱器(180)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙軸擠製機</p>
        <p type="p">100:缸</p>
        <p type="p">101至109:容器</p>
        <p type="p">120:原料供給口</p>
        <p type="p">130:液體供給口</p>
        <p type="p">141:前端凸緣</p>
        <p type="p">142:多孔板</p>
        <p type="p">143:模</p>
        <p type="p">161:螺桿馬達</p>
        <p type="p">180:加熱器</p>
        <p type="p">190:壓力計</p>
        <p type="p">200:進料器</p>
        <p type="p">300:液體供給機構</p>
        <p type="p">400:控制器</p>
        <p type="p">A1至A4:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1487" publication-number="202633027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂被覆基板、樹脂被覆基板的製造方法、印刷線路板、及電子零件裝置</chinese-title>
        <english-title>RESIN-COATED SUBSTRATE, METHOD OF PRODUCING RESIN-COATED SUBSTRATE, PRINTED WIRING BOARD AND ELECTRONIC COMPONENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K1/03</main-classification>
        <further-classification edition="200601120260504B">H05K3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林讓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高安慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYASU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮坂昌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYASAKA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂被覆基板100，其具備：基板20，其具有開口10；及樹脂被覆30，其被覆前述基板20；&lt;br/&gt;  前述樹脂被覆30具有被覆前述開口10的周圍區域之部分30A、及朝向前述開口10的內側下垂之下垂部30B。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin-coated substrate 100, including a substrate 20 having an opening 10 and a resin coating 30 that coats the substrate 20, the resin coating 30 having a portion 30A that covers a region around the opening 10 and a sagging portion 30B that sags toward an inner side of the opening 10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:開口</p>
        <p type="p">10A:側壁</p>
        <p type="p">20:基板</p>
        <p type="p">20A:開口10的周圍區域</p>
        <p type="p">30:樹脂被覆</p>
        <p type="p">30A:被覆開口10的周圍區域之部分</p>
        <p type="p">30B:下垂部</p>
        <p type="p">100:樹脂被覆基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1488" publication-number="202631753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著劑套組以及接著體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F220/18</main-classification>
        <further-classification edition="200601120260504B">C08F220/30</further-classification>
        <further-classification edition="200601120260504B">C08F220/54</further-classification>
        <further-classification edition="200601120260504B">C09J4/02</further-classification>
        <further-classification edition="200601120260504B">C09J11/04</further-classification>
        <further-classification edition="200601120260504B">C09J11/06</further-classification>
        <further-classification edition="200601120260504B">C09J11/08</further-classification>
        <further-classification edition="200601120260504B">B32B7/12</further-classification>
        <further-classification edition="200601120260504B">B32B37/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田薰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永昌大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川守崇司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMORI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種接著劑套組，其具備含有解絡劑之主劑及含有選自由有機硼烷錯合物、以及式（1）所表示之化合物及式（2）所表示之化合物組成之組中之至少1種之起始劑。主劑及起始劑中的至少一者進一步含有具有自由基聚合性基之化合物。主劑及起始劑中的至少一者進一步含有選自由鹵化金屬鹽及具有硫代羰基硫結構之化合物組成之組中之至少1種。&lt;br/&gt;&lt;img align="absmiddle" height="111px" width="195px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  [式（1）中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示烷基。]&lt;br/&gt;&lt;img align="absmiddle" height="155px" width="157px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  [式（2）中，&lt;br/&gt;  n表示2～5的整數。&lt;br/&gt;  R&lt;sup&gt;4&lt;/sup&gt;表示烷基。&lt;br/&gt;  R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;分別獨立地表示氫原子或烷基。&lt;br/&gt;  在R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;存在複數個之情況下，存在複數個之R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;分別可以相同，亦可以不同。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1489" publication-number="202632190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除濕裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">F24F3/147</main-classification>
        <further-classification edition="200601120260423B">B01D53/26</further-classification>
        <further-classification edition="202601120260423B">F26B21/33</further-classification>
        <further-classification edition="200601120260423B">F28D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸本如水</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIMOTO, JOSUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下岡佑輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOOKA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田充彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, MITSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LING, GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在流路20中，供液體吸濕放濕材料循環，前述液體吸濕放濕材料可對流通於殼體10內的空氣吸收或釋出水分。放濕部22配置於流路20上，且使水分從液體吸濕放濕材料對從吸入口12導入的空氣釋出。冷凝水回收部40將流通於放濕部22的空氣中所含之水分的至少一部分作為冷凝水來回收。吸濕部28配置於流路20上，且將流通於冷凝水回收部40的空氣中所殘留之水分吸收。熱交換部24配置於流路20上，且在流通於吸濕部28的液體吸濕放濕材料與流通於放濕部22的液體吸濕放濕材料之間執行熱交換。液體吸濕放濕材料是藉由循環流通於已配置於流路20上的放濕部22及吸濕部28，而使水分從吸濕部28朝放濕部22移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體</p>
        <p type="p">12:吸入口</p>
        <p type="p">14:吹出口</p>
        <p type="p">20:流路</p>
        <p type="p">22:放濕部</p>
        <p type="p">24:熱交換部</p>
        <p type="p">26:冷卻部</p>
        <p type="p">28:吸濕部</p>
        <p type="p">30:驅動部</p>
        <p type="p">32:加熱部</p>
        <p type="p">40:冷凝水回收部</p>
        <p type="p">42:送風部</p>
        <p type="p">50:主風路</p>
        <p type="p">100:除濕裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1490" publication-number="202632107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾筒式洗衣機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">D06F39/08</main-classification>
        <further-classification edition="200601120260430B">D06F39/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>又吉均哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATAYOSHI, KINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山城始之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHIRO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可以抑制殼體振動的滾筒式洗衣機。滾筒式洗衣機具備：殼體100；收納部，配置於殼體100的內部，且可收納衣物；及導水單元40，導水單元40具備：導水部，供從收納部排出的洗淨水流動；及循環泵80，安裝於導水部，且將流動於導水部的洗淨水送出至收納部，導水單元40是藉由固定構件固定於殼體100的底部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:洗衣機</p>
        <p type="p">10:水槽</p>
        <p type="p">11:水槽開口</p>
        <p type="p">14:第2連接配管</p>
        <p type="p">16:流入連接部</p>
        <p type="p">18:開口周緣構件</p>
        <p type="p">19:噴射噴嘴</p>
        <p type="p">20:旋轉滾筒</p>
        <p type="p">21:滾筒開口</p>
        <p type="p">30:門支撐構件</p>
        <p type="p">31:連通開口</p>
        <p type="p">32:軸承部</p>
        <p type="p">34:鎖定機構</p>
        <p type="p">36:保持部</p>
        <p type="p">40:導水單元</p>
        <p type="p">42:分隔件</p>
        <p type="p">46:開口凸緣</p>
        <p type="p">54:循環配管</p>
        <p type="p">58:循環管部</p>
        <p type="p">72:嵌合部</p>
        <p type="p">74:把持部</p>
        <p type="p">76:緩衝材</p>
        <p type="p">80:循環泵</p>
        <p type="p">100:殼體</p>
        <p type="p">106,108:側面板</p>
        <p type="p">110:背面板</p>
        <p type="p">114:台座板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1491" publication-number="202631954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機化合物、發光器件、受光器件、發光裝置、發光模組、電子裝置及照明設備</chinese-title>
        <english-title>ORGANIC COMPOUND, LIGHT-EMITTING DEVICE, LIGHT-RECEIVING DEVICE, LIGHT-EMITTING APPARATUS, LIGHT-EMITTING MODULE, ELECTRONIC DEVICE, AND LIGHTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C09K11/06</main-classification>
        <further-classification edition="200601120260421B">C07D209/86</further-classification>
        <further-classification edition="202301120260421B">H10K85/00</further-classification>
        <further-classification edition="202301120260421B">H10K50/80</further-classification>
        <further-classification edition="200601120260421B">H05B33/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田杏奈
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上祥子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, SACHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥山拓夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUYAMA, TAKUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木恒徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TSUNENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種耐熱性高的有機化合物。提供一種發光效率及可靠性高的發光器件。提供一種由通式(G0)表示的有機化合物。在通式(G0)的R&lt;sup&gt;1&lt;/sup&gt;至R&lt;sup&gt;13&lt;/sup&gt;、R&lt;sup&gt;21&lt;/sup&gt;至R&lt;sup&gt;29&lt;/sup&gt;、R&lt;sup&gt;31&lt;/sup&gt;至R&lt;sup&gt;39&lt;/sup&gt;及R&lt;sup&gt;41&lt;/sup&gt;至R&lt;sup&gt;48&lt;/sup&gt;中，R&lt;sup&gt;1&lt;/sup&gt;至R&lt;sup&gt;5&lt;/sup&gt;中的任一個表示通式(A)，其餘的分別獨立地表示氫、碳原子數為1以上且6以下的烷基、碳原子數為3以上且6以下的環烷基或者取代或未取代的碳原子數為6以上且13以下的芳基，R&lt;sup&gt;21&lt;/sup&gt;和R&lt;sup&gt;22&lt;/sup&gt;可以彼此鍵合而形成螺環。  &lt;br/&gt;&lt;img align="absmiddle" height="303px" width="514px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        &lt;b&gt;An organic compound with high heat resistance is provided. A light-emitting device with high emission efficiency and high reliability is provided. An organic compound represented by General Formula (G0) is provided. In General &lt;/b&gt;
        &lt;b&gt;Formula (G0), any one of R&lt;sup&gt;1&lt;/sup&gt; to R&lt;sup&gt;5&lt;/sup&gt; represents General Formula (A), and each of the others of R&lt;sup&gt;1&lt;/sup&gt; to R&lt;sup&gt;5&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt; to R&lt;sup&gt;13&lt;/sup&gt;, R&lt;sup&gt;21&lt;/sup&gt; to R&lt;sup&gt;29&lt;/sup&gt;, R&lt;sup&gt;31&lt;/sup&gt; to R&lt;sup&gt;39&lt;/sup&gt;, and R&lt;sup&gt;41&lt;/sup&gt; to R&lt;sup&gt;48&lt;/sup&gt; independently represents hydrogen, an alkyl group having 1 to 6 carbon atoms, a cycloalkyl group &lt;/b&gt;
        &lt;b&gt;having 3 to 6 carbon atoms, or a substituted or unsubstituted aryl group having 6 to 13 carbon atoms. R&lt;sup&gt;21&lt;/sup&gt; and R&lt;sup&gt;22&lt;/sup&gt; may be bonded to each other to form a spiro ring.&lt;/b&gt;
        &lt;br/&gt;
        &lt;img align="absmiddle" height="297px" width="514px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"&gt;
        &lt;/img&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1492" publication-number="202631534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有鹼金屬之玻璃板及含有鹼金屬之玻璃板的製造方法</chinese-title>
        <english-title>ALKALI METAL-CONTAINING GLASS PLATE AND METHOD FOR PRODUCING ALKALI METAL-CONTAINING GLASS PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03C3/087</main-classification>
        <further-classification edition="200601120260504B">C03C15/00</further-classification>
        <further-classification edition="200601120260504B">C03C21/00</further-classification>
        <further-classification edition="200601120260504B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本板硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHEET GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有尋求對玻璃板賦予高透明性(光透過性)的情況。  &lt;br/&gt;　　本發明具備：準備玻璃板之準備步驟♯1、與在玻璃板的厚度方向，做出不同第1鹼金屬的含量之含量調整步驟♯2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第1層</p>
        <p type="p">12a:第1區域</p>
        <p type="p">12b:第2區域</p>
        <p type="p">12c:不連續區域</p>
        <p type="p">13:第3層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1493" publication-number="202631493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳奈米管及其製造方法</chinese-title>
        <english-title>CARBON NANOTUBES AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260427B">C01B32/162</main-classification>
        <further-classification edition="201101120260427B">B82Y40/00</further-classification>
        <further-classification edition="200601120260427B">B01J21/18</further-classification>
        <further-classification edition="201001120260427B">H01M4/583</further-classification>
        <further-classification edition="201001120260427B">H01M10/0562</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金世賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金緣伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YEONYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜賢俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HYUN JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金韓娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG MYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銖賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SUHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於展現優異的導電率及優秀的儲存及輸送效率之新穎碳奈米管、該碳奈米管之製造方法、碳奈米管分散液、包含該碳奈米管之電極結構、及包含該碳奈米管之二次電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel carbon nanotubes exhibiting excellent electrical conductivity and superior storage and transport efficiency, a method for manufacturing the carbon nanotubes, a carbon nanotube dispersion, an electrode structure including the carbon nanotubes, and a secondary battery including the carbon nanotubes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1494" publication-number="202632260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用人工智慧識別有機缺陷源</chinese-title>
        <english-title>ORGANIC DEFECT SOURCE IDENTIFICATION USING ARTIFICIAL INTELLIGENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260402B">G01N23/2251</main-classification>
        <further-classification edition="202301120260402B">G06N3/08</further-classification>
        <further-classification edition="200601120260402B">G06F17/10</further-classification>
        <further-classification edition="201801120260402B">G06F9/44</further-classification>
        <further-classification edition="201301120260402B">G06F3/048</further-classification>
        <further-classification edition="200601120260402B">G06F7/06</further-classification>
        <further-classification edition="202201120260402B">G06V10/764</further-classification>
        <further-classification edition="202201120260402B">G06V10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　淵泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳天元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TIANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱文軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, WENXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切里克卡利爾　羅希斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIKKALLIL, ROHITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇瑪提瑞迪　拉胡爾瑞迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATIREDDI, RAHUL REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹賈雅各　薩欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANGAYACH, SACHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫韻婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了使用人工智慧（AI）進行有機缺陷源識別的方法和系統。將描繪使用一或多個製造設備處理的基板表面的一或多個圖像作為輸入提供給人工智慧（AI）模型。獲得AI模型的輸出，其中輸出表示與在這一或多個圖像中描繪的基板表面上偵測到的缺陷相關的缺陷特徵資料。根據缺陷特徵資料確定至少一個缺陷類型及相關缺陷源的置信度水平是否滿足一或多個置信度標準。在確定至少一個缺陷類型和相關缺陷源滿足一或多個置信度標準後，將該至少一個缺陷類型和相關缺陷源提供給客戶設備，以便呈現給一或多個使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for organic defect source identification using artificial intelligence (AI) are provided. One or more images depicting a surface of a substrate processed using one or more manufacturing equipment is provided as input to an artificial intelligence (AI) model. Output(s) of the AI model is obtained, where the output(s) indicate defect characterization data associated with a defect detected on the surface of the substrate depicted by the one or more images. A determination is made of whether a level of confidence of at least one defect type and associated defect source from the defect characterization data satisfies one or more confidence criteria. Upon a determination that at least one defect type and associated defect source satisfy the one or more confidence criteria, the at least one defect type and associated defect source are provided to a client device for presentation to one or more users.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:架構/系統</p>
        <p type="p">110:預測系統</p>
        <p type="p">112:預測伺服器</p>
        <p type="p">114:預測元件</p>
        <p type="p">120:客戶設備</p>
        <p type="p">124:製造設備</p>
        <p type="p">126:成像元件</p>
        <p type="p">128:計量設備</p>
        <p type="p">130:網路</p>
        <p type="p">140:資料儲存庫</p>
        <p type="p">150:計算系統</p>
        <p type="p">152:缺陷識別(ID)引擎</p>
        <p type="p">170:伺服器機器</p>
        <p type="p">172:訓練集生成器</p>
        <p type="p">180:伺服器機器</p>
        <p type="p">182:訓練引擎</p>
        <p type="p">184:驗證引擎</p>
        <p type="p">186:引擎</p>
        <p type="p">188:測試引擎</p>
        <p type="p">190:模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1495" publication-number="202633112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10D30/47</main-classification>
        <further-classification edition="202501120260504B">H10D62/17</further-classification>
        <further-classification edition="202501120260504B">H10D62/852</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電工器件創新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木敦也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, ATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之半導體裝置具有：第1氮化物半導體層，其具備通道層及障壁層，且形成有第1凹部及第2凹部；以及第2氮化物半導體層及第3氮化物半導體層，上述通道層具有第1面，上述障壁層具有與上述第1面對向之第2面、及與上述第2面相反之第3面，上述第1凹部於上述第3面具有第1開口，上述第2凹部於上述第3面具有第2開口，上述第2氮化物半導體層設置於上述第1凹部，上述第3氮化物半導體層設置於上述第2凹部，上述第1凹部具有與上述第1面分開之第1底面，且上述第1底面與上述第1面之間之第1距離為1 nm以上20 nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">11:成核層</p>
        <p type="p">12:通道層</p>
        <p type="p">13:障壁層</p>
        <p type="p">13a:間隔層</p>
        <p type="p">13D:第1部分</p>
        <p type="p">13S:第2部分</p>
        <p type="p">14:上覆層</p>
        <p type="p">15:二維電子氣</p>
        <p type="p">21:第1氮化物半導體層</p>
        <p type="p">22D:第2氮化物半導體層</p>
        <p type="p">22S:第3氮化物半導體層</p>
        <p type="p">31,32:絕緣膜</p>
        <p type="p">31D,31G,31S,32G:孔</p>
        <p type="p">41D:第1凹部</p>
        <p type="p">41S:第2凹部</p>
        <p type="p">42D:第1開口</p>
        <p type="p">42S:第2開口</p>
        <p type="p">43D:第1底面</p>
        <p type="p">43S:第2底面</p>
        <p type="p">60D:汲極電極</p>
        <p type="p">60G:閘極電極</p>
        <p type="p">60S:源極電極</p>
        <p type="p">71:第1面</p>
        <p type="p">72:第2面</p>
        <p type="p">73:第3面</p>
        <p type="p">100:半導體裝置</p>
        <p type="p">L1:第1距離</p>
        <p type="p">L2:第2距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1496" publication-number="202631852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黑矩陣用顏料分散組成物、及黑矩陣用顏料分散光阻組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08K3/04</main-classification>
        <further-classification edition="200601120260504B">C08K3/36</further-classification>
        <further-classification edition="200601120260504B">C08K9/06</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C09D17/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阪田油墨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA INX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田光信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, MITSUNOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上奈月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>灰藤哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAITO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻康人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, YASUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平井淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAI, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黑矩陣用顏料分散組成物，其包含碳黑、二氧化矽粒子、含鹼性基的顏料分散劑、含酸性基的顏料分散助劑、鹼可溶性樹脂、及溶劑，且上述二氧化矽粒子為含苯基的二氧化矽粒子及/或含(甲基)丙烯基的二氧化矽粒子，上述二氧化矽粒子相對於上述碳黑100質量份為2質量份以上20質量份以下。該黑矩陣用顏料分散組成物能夠形成具有高遮光性但來自玻璃面的反射率較低的黑矩陣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1497" publication-number="202632046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產石墨氟化物顆粒的方法</chinese-title>
        <english-title>A METHOD FOR PRODUCING GRAPHITE FLUORIDE GRANULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C16/30</main-classification>
        <further-classification edition="200601120260504B">C23C16/44</further-classification>
        <further-classification edition="200601120260504B">C23C16/515</further-classification>
        <further-classification edition="200601120260504B">B01J20/20</further-classification>
        <further-classification edition="200601120260504B">B01J20/28</further-classification>
        <further-classification edition="200601120260504B">B01J20/32</further-classification>
        <further-classification edition="200601120260504B">B01D53/047</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔帕西　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIPATHI, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納丁帕利　納迦拉維庫馬爾瓦爾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NADIMPALLI, NAGA RAVIKUMAR VARMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　維賈伊班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VIJAY BHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥堤　帕他</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAITY, PRATAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珊迪　杰許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDE, JAYESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿科特　馬赫什切爾瓦拉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCOT, MAHESH CHELVARAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　古托拉莫漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, GUTTULA MOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種製造顆粒的方法。該方法包含以第一比率將惰性氣體和含氟氣體流入電漿源；藉由電漿源從惰性氣體和含氟氣體產生含氟電漿；並將含氟電漿施加至處理腔室中的多孔碳顆粒。含氟電漿與碳顆粒的表面反應，在碳顆粒的表面上形成碳氟化物層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing granules is provided. The method includes flowing an inert gas and a fluorine-containing gas into a plasma source at a first ratio; generating a fluorine-containing plasma from the inert gas and the fluorine-containing gas by the plasma source; and applying the fluorine containing plasma to porous carbon granules in process chamber. The fluorine-containing plasma reacts with a surface of the carbon granules to form a carbon fluoride layer on the surface of the carbon granules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:區塊</p>
        <p type="p">220:區塊</p>
        <p type="p">230:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1498" publication-number="202631194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療狼瘡性腎炎之組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS OF TREATING LUPUS NEPHRITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61K31/573</further-classification>
        <further-classification edition="200601120260504B">A61K31/138</further-classification>
        <further-classification edition="200601120260504B">A61K31/167</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡西諾　馬修　多米尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASCINO, MATTHEW DOMINIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於治療患有狼瘡的個體的狼瘡性腎炎之方法。在一些實施例中，該等方法包含將有效量之第 II 型抗 CD20 抗體施予該個體。在其他方面，本揭露提供用於治療膜性腎絲球病變之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for treating lupus nephritis in an individual that has lupus. In some embodiments, the methods comprise administering to the individual an effective amount of a type II anti-CD20 antibody. In other aspects, the present disclosure provides methods for treating membranous nephropathy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1499" publication-number="202631342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具組固持器</chinese-title>
        <english-title>TOOL SET HOLDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B25H3/04</main-classification>
        <further-classification edition="200601120260423B">B23Q3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商史奈普昂公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNAP-ON INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫裡　大衛　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURRY, DAVID D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬庫斯　丹尼爾　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCUS, DANIEL F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種工具組固持器，其包含用於接納含有來自一工具組之一或多個工具之一工具組插入件的一底座。該工具組固持器包含自該底座之一底部邊緣向前延伸之一底部凸緣。該底部凸緣用於支撐該工具組插入件。該工具組固持器包含自該底座之一第一側邊緣向前延伸之一第一側凸緣及自該底座之一第二側邊緣向前延伸之一第二側凸緣。該工具組固持器在該第一側凸緣與該第二側凸緣之間接納該工具組插入件。該工具組固持器包含自該底座向後延伸之一後部凸緣。該後部凸緣經構形以將該工具組固持器附接至一工作中心之一垂直表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tool set holder including a base to receive a tool set insert containing one or more tools from a tool set. The tool set holder includes a bottom flange extending forward from a bottom edge of the base. The bottom flange is to support the tool set insert. The tool set holder includes a first side flange extending forward from a first side edge of the base and a second side flange extending forward from a second side edge of the base. The tool set holder receives the tool set insert between the first side flange and the second side flange. The tool set holder includes a posterior flange extending rearward from the base. The posterior flange is configured to attach the tool set holder to a vertical surface of a work center.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工具組固持器</p>
        <p type="p">102:底座</p>
        <p type="p">104:第一孔口</p>
        <p type="p">106:第二孔口</p>
        <p type="p">108:底部凸緣</p>
        <p type="p">110:下部唇緣表面</p>
        <p type="p">112:第一側凸緣</p>
        <p type="p">114:第一側邊沿表面</p>
        <p type="p">116:第二側凸緣</p>
        <p type="p">118:第二側邊沿表面</p>
        <p type="p">120:後部凸緣</p>
        <p type="p">122:第一後部凸緣</p>
        <p type="p">124:第一組鉤</p>
        <p type="p">126:第二後部凸緣</p>
        <p type="p">128:第二組鉤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1500" publication-number="202631180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於重量減輕及維持之組合療法</chinese-title>
        <english-title>COMBINATION THERAPIES FOR WEIGHT LOSS AND MAINTENANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/22</main-classification>
        <further-classification edition="200601120260504B">A61K38/26</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商茲希普有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIHIPP LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米尼翁　詹姆斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINNION, JAMES S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛斯　夏洛特　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINDS, CHARLOTTE E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋曲　葛瑞格　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAICH, GREGORY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈伯德　布萊恩　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBBARD, BRIAN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯內特　麗莎　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURNETT, LISA C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於減輕個體(例如肥胖個體)之重量及/或預防其重量增加之組合，其包含澱粉素類似物及GLP-1受體促效劑。如本文所述，該GLP-1受體促效劑及該澱粉素類似物可在同一醫藥組合物中或在分開的醫藥組合物中(例如經由同時或相繼投藥)投與個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides combinations for reducing weight and/or preventing weight gain in a subject (e.g., an obese subject) comprising an amylin analog and a GLP-1 receptor agonist. As described herein, the GLP-1 receptor agonist and amylin analog can be administered to a subject in the same pharmaceutical composition or in separate pharmaceutical compositions (e.g., via simultaneous or subsequent administration).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1501" publication-number="202632351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140492</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光學電路交換之方法及技術</chinese-title>
        <english-title>METHODS AND TECHNIQUES FOR OPTICAL CIRCUIT SWITCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G02B6/26</main-classification>
        <further-classification edition="200601120260427B">G02B6/28</further-classification>
        <further-classification edition="200601120260427B">G02B6/36</further-classification>
        <further-classification edition="200601120260427B">G02B6/38</further-classification>
        <further-classification edition="200601120260427B">G02B6/42</further-classification>
        <further-classification edition="200601120260427B">G02B6/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾哈德　奧姆卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARHADE, OMKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅夫斯　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROVES, TAYLOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾頓　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOULTON, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩內　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANE, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>透納　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURNER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布南達　達里司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUNANDAR, DARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾卡特　布拉德福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURCOTT, BRADFORD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文卡特桑　斯里拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATESAN, SRIRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德威爾　多明尼克　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODWILL, DOMINIC JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於利用光學電路交換(OCS)以在一光電系統中動態地路由連接之系統及方法。該OCS可用來動態地路由連接遠離故障硬體且最大化剩餘運作硬體之使用。該OCS可用來在採用分解記憶體之一分佈式網路及/或系統中動態地分配頻寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are systems and methods for leveraging Optical Circuit Switching (OCS) to dynamically route connections in an optoelectronic system. The OCS may be used to dynamically route connections away from faulty hardware and to maximize usage of the remaining functioning hardware. The OCS may be used to dynamically distribute bandwidth in a distributed network and/or systems employing disaggregated memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:程序</p>
        <p type="p">202:動作</p>
        <p type="p">204:動作</p>
        <p type="p">206:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1502" publication-number="202631601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咪唑調節劑在疼痛和高血壓治療中的應用</chinese-title>
        <english-title>IMIDAZOLE MODULATORS FOR THE TREATMENT OF PAIN AND HYPERTENSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D403/06</main-classification>
        <further-classification edition="200601120260504B">C07D233/56</further-classification>
        <further-classification edition="200601120260504B">C07D405/06</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/4178</further-classification>
        <further-classification edition="200601120260504B">A61K31/4164</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾賽普特治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCEPTOR THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東尼歐　約翰　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELLO, JOHN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法瑞拉　唐納德　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAIL, DONALD E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾　丹尼爾　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIL, DANIEL W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　布魯斯　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTH, BRUCE D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福爾克曼　羅伯特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLKMANN, ROBERT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及下式所示化合物及其藥學上可接受的鹽，還涉及該類化合物的製備方法、製備過程中使用的中間體、含有該類化合物的組合物，以及該類化合物在治療疼痛或高血壓中的用途：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="135px" width="246px" file="ed10101.JPG" alt="ed10101.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compounds of the formula:&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="268px" file="ed10102.JPG" alt="ed10102.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt; and pharmaceutically acceptable salts thereof, to processes for the preparation of, intermediates used in the preparation of, and compositions containing such compounds and the uses of such compounds for the treatment of pain or hypertension.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1503" publication-number="202632312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>運動資料測定裝置、運動控制裝置、運動資料測定方法及運動控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01S17/08</main-classification>
        <further-classification edition="200601120260504B">B60R21/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCIVAX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村智宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野晶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金城隆也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINJO, TAKAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中覚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可對對象物的運動資料進行測定的運動資料測定裝置或運動資料測定方法。另外，本發明提供一種可基於對象物的運動資料來控制對象物的運動的運動控制裝置或運動控制方法。運動資料測定裝置100及運動資料測定方法中，藉由距離測定單元1來測定距對象物7的距離，並根據距離測定單元1所測定的距離的時間變化來計算對象物7的運動資料。另外，運動控制裝置及運動控制方法中，基於該運動資料，並使用配置於移動體的運動控制單元來控制對象物7的運動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:距離測定單元</p>
        <p type="p">2:運算單元</p>
        <p type="p">3:攝像單元</p>
        <p type="p">7:對象物</p>
        <p type="p">11:光照射單元</p>
        <p type="p">12:光學元件</p>
        <p type="p">13:照相機部</p>
        <p type="p">14:運算部</p>
        <p type="p">31:照明單元</p>
        <p type="p">100:運動資料測定裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1504" publication-number="202631578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140558</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C309/42</main-classification>
        <further-classification edition="200601120260504B">C07C309/43</further-classification>
        <further-classification edition="200601120260504B">C07C309/58</further-classification>
        <further-classification edition="200601120260504B">C07C309/71</further-classification>
        <further-classification edition="200601120260504B">C07C309/73</further-classification>
        <further-classification edition="200601120260504B">C07C381/00</further-classification>
        <further-classification edition="200601120260504B">C07D307/77</further-classification>
        <further-classification edition="200601120260504B">C07D327/08</further-classification>
        <further-classification edition="200601120260504B">C07D333/76</further-classification>
        <further-classification edition="200601120260504B">C09K3/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性優異、高感度、高對比度且LWR、CDU、MEF、EL、DOF等微影性能優異之化學增幅阻劑組成物中使用之鎓鹽、含有該鎓鹽作為光酸產生劑之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。本發明之解決手段係一種鋶鹽，係由下式(1A)表示之芳香族磺酸陰離子及下式(1B)表示之鋶陽離子構成。  &lt;br/&gt;&lt;img align="absmiddle" height="376px" width="585px" file="ed10592.JPG" alt="ed10592.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1505" publication-number="202633446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與散熱層連接之CMOS結構的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W40/25</main-classification>
        <further-classification edition="202601120260427B">H10P14/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商愛思強歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIXTRON SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈恩　烏茲赫爾維格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAHN, UTZ HERWIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛德　克里斯多夫馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAUDER, CHRISTOF MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種製造與散熱層連接之CMOS結構的方法，該方法至少包括以下步驟：提供自視情況可能存在的第一基板移除的經處理CMOS層結構；在第二基板上沉積該散熱層；將該CMOS層結構與該散熱層連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:CMOS層結構</p>
        <p type="p">2:散熱層</p>
        <p type="p">3:第一基板</p>
        <p type="p">4:第二基板</p>
        <p type="p">5:第一層</p>
        <p type="p">6:第二層</p>
        <p type="p">7:第三層</p>
        <p type="p">9:背側</p>
        <p type="p">10:第三基板</p>
        <p type="p">11:上側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1506" publication-number="202631801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物、顆粒及成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G63/60</main-classification>
        <further-classification edition="200601120260504B">C08L67/00</further-classification>
        <further-classification edition="200601120260504B">C08L67/03</further-classification>
        <further-classification edition="200601120260504B">C08J3/12</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土佐桃波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSA, MONAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大場矢登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBA, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成皺褶較少之成形品的樹脂組合物。  &lt;br/&gt;該樹脂組合物包含液晶聚酯及非晶性聚芳酯，上述液晶聚酯包含具有縮合芳香環之第一單體單元，上述第一單體單元之含量相對於構成上述液晶聚酯之全部單體單元之總量，為20莫耳%以上，上述非晶性聚芳酯之玻璃轉移溫度(Tg)為200℃以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1507" publication-number="202633147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體器件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260427B">H10D84/40</main-classification>
        <further-classification edition="202501120260427B">H10D84/03</further-classification>
        <further-classification edition="202601120260427B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商芯邁半導體技術（杭州）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON-MAGIC SEMICONDUCTOR TECHNOLOGY (HANGZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王加坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種半導體器件及其製作方法，該半導體器件包括：半導體層，所述半導體層包括第一區域和第二區域；第一器件結構，位於所述第一區域內和所述第一區域的表面；第二器件結構，位於所述第二區域內和所述第二區域的表面；其中，所述第一器件結構為BCD製程技術所製造器件的結構，所述第二器件結構為具有T型閘的溝槽功率器件的結構。本申請能夠通過較為簡單的製程流程和較低的成本製作兼具低比導通電阻和BCD製程技術所製造器件的各種優點的半導體器件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a semiconductor layer including a first region and a second region; a first device structure located within the first region and on a surface of the first region; and a second device structure located within the second region and on a surface of the second region. The first device structure is the structure of a device manufactured using BCD process technology, and the second device structure is the structure of a trench power device with a T-shaped gate. This application enables the manufacture, through a relatively simple process flow and at lower cost, of a semiconductor device that combines low specific on-resistance with the advantages of devices manufactured by BCD process technology.</p>
      </isu-abst>
      <representative-img>
        <p type="p">I:第一區域</p>
        <p type="p">II:第二區域</p>
        <p type="p">200:半導體器件</p>
        <p type="p">210:半導體層</p>
        <p type="p">211:襯底</p>
        <p type="p">212:外延層</p>
        <p type="p">221:第二溝槽</p>
        <p type="p">222:閘介質層</p>
        <p type="p">222a:第二介質層</p>
        <p type="p">222b:第三介質層</p>
        <p type="p">223:閘電極</p>
        <p type="p">224:保護層</p>
        <p type="p">225:導電插塞</p>
        <p type="p">226:佈線層</p>
        <p type="p">241:漂移區</p>
        <p type="p">242:體區</p>
        <p type="p">243:源區</p>
        <p type="p">244:體接觸區</p>
        <p type="p">245:汲區</p>
        <p type="p">246:閘極結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1508" publication-number="202631183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療糖尿病之方法</chinese-title>
        <english-title>METHODS OF TREATING DIABETES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/28</main-classification>
        <further-classification edition="200601120260504B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇蓋薩　伊曼紐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIGUTSA, EMMANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡悅玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, YUEH-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥普特　阿謝爾　理查　凱爾　奧古斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAUPT, AXEL RICHARD KARL-AUGUST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲達　克里斯多夫　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZDA, CHRISTOF MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施內克　凱倫　布蘭達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNECK, KAREN BRENDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　承財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHENG CAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布　凡里基　裘利那　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUE-VALLESKEY, JULIANA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾　莫莉　柯貝特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARR, MOLLY CORBETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　安妮特　梅歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, ANNETTE MEEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加安　帕勞格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARHYAN, PARAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾樂格　莉莎　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILAG, LIZA L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲　蜜雪兒　琳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATZ, MICHELLE LYNNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述劑量及給藥方案，其包含確定及投與適合於每週一次給藥之長效胰島素受體促效劑，諸如每週之基礎胰島素-Fc (BIF)之劑量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are doses and dosing regimens comprising determining and administering doses of long-acting insulin receptor agonists suitable for once-weekly dosing, such as Weekly Basal Insulin-Fc (BIF).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1509" publication-number="202632459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多向輸入裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G05G9/047</main-classification>
        <further-classification edition="201301120260423B">G06F3/0338</further-classification>
        <further-classification edition="200601120260423B">H01H25/04</further-classification>
        <further-classification edition="200601120260423B">G05G5/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商星電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSIDEN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商任天堂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINTENDO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上将徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村考師</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神宮寺雅楽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINGUJI, GAGAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武井誠也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEI, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皆川新太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAGAWA, SHINTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施形態之多向輸入裝置，係具備：框體；操作構件，其從前述框體突出且可進行傾倒操作；第1連動構件，其向第2方向可轉動地保持前述操作構件，並且因應前述操作構件的傾倒操作，可向與前述第2方向正交的第1方向轉動地被保持在前述框體；第2連動構件，其因應前述操作構件的傾倒操作，向前述第2方向可轉動地被保持在前述框體；第1轉動檢測部，其檢測前述第1連動構件的轉動；第2轉動檢測部，其檢測前述第2連動構件的轉動；彈推構件，其對前述操作構件賦予使前述操作構件復原至中立位置的復原力；及彈性部，其與前述框體一體地形成，對前述第1連動構件施加推力方向彈推。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:復原機構</p>
        <p type="p">3:第1轉動檢測部</p>
        <p type="p">5:第3檢測部</p>
        <p type="p">10:框體</p>
        <p type="p">11:上蓋部</p>
        <p type="p">12:開口部</p>
        <p type="p">13:軸承部</p>
        <p type="p">14:軸承部</p>
        <p type="p">17:彈性部</p>
        <p type="p">17a:固定部</p>
        <p type="p">20:第1連動構件</p>
        <p type="p">22:軸部(旋轉軸)</p>
        <p type="p">23:軸部</p>
        <p type="p">24:驅動部</p>
        <p type="p">30:第2連動構件</p>
        <p type="p">31:挾持部</p>
        <p type="p">40:操作構件</p>
        <p type="p">41:軸部</p>
        <p type="p">42:基部</p>
        <p type="p">45:上部彈簧座</p>
        <p type="p">46:母花鍵</p>
        <p type="p">50:壓縮線圈彈簧(彈推構件)</p>
        <p type="p">61:軸部</p>
        <p type="p">62:底部</p>
        <p type="p">70:基板</p>
        <p type="p">81:底面部</p>
        <p type="p">90:第1滑動構件</p>
        <p type="p">91:凸部</p>
        <p type="p">100:第1可動接點片</p>
        <p type="p">130:按壓構件</p>
        <p type="p">131:支承部</p>
        <p type="p">132:按壓部</p>
        <p type="p">140:第3可動接點片</p>
        <p type="p">150:接點片固定構件</p>
        <p type="p">611:公花鍵</p>
        <p type="p">612:下部彈簧座</p>
        <p type="p">X1,X2,Z1,Z2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1510" publication-number="202631269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔以及測試管路系統的方法</chinese-title>
        <english-title>METHOD FOR CLEANING AND TESTING PIPE SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B08B9/027</main-classification>
        <further-classification edition="200601120260427B">G01N1/22</further-classification>
        <further-classification edition="200601120260427B">G01N30/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商拉默斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMERS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚森　艾蒂安赫拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSEN, ETIEENNE GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿穆　那伽賽高麗尚卡拉夏爾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMMU, NAGA SAI GOWRI SHANKARA SHARMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種清潔及/或測試管路系統（10）的方法，尤其是清潔及/或測試具有死體積（11）的分支管路系統（10）的方法，死體積（11）由分支、閥、調節器或感測器導致。方法包含以下步驟的一個、複數或全部：  &lt;br/&gt;1)   管路系統（10）內的汙染物的可動化；  &lt;br/&gt;2)   清潔管路系統（10）以移除汙染物；  &lt;br/&gt;3)   測試管路系統（10）的潔淨度，  &lt;br/&gt;其中可動化以排空、施加熱、施加電磁輻射、感應、施加振動或前述措施的組合的手段進行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for cleaning and/or testing pipe systems (10), in particular branched pipe systems (10), which have dead volumes (11) due to branches, valves, regula-tors or sensors, comprising one, a plurality of or all of the following steps: &lt;br/&gt;1) mobilization of contaminants within the pipe system (10); &lt;br/&gt;2) cleaning the pipe system (10) to remove the contaminants; &lt;br/&gt;3) testing the cleanliness of the pipe system (10), &lt;br/&gt;wherein the mobilization is carried out by means of evacuation, application of heat, application of electromagnetic radiation, induction, application of vibration or combinations of the aforementioned measures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">7:氣體入口</p>
        <p type="p">8:閥</p>
        <p type="p">9:測試管</p>
        <p type="p">10:系統</p>
        <p type="p">11:死體積</p>
        <p type="p">12:真空泵</p>
        <p type="p">13:三向閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1511" publication-number="202631564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法</chinese-title>
        <english-title>PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C39/08</main-classification>
        <further-classification edition="200601120260102B">C07C59/11</further-classification>
        <further-classification edition="200601120260102B">C07C69/732</further-classification>
        <further-classification edition="200601120260102B">C07D211/94</further-classification>
        <further-classification edition="200601120260102B">C08F2/38</further-classification>
        <further-classification edition="200601120260102B">C08F2/44</further-classification>
        <further-classification edition="200601120260102B">C08F2/50</further-classification>
        <further-classification edition="200601120260102B">C08F257/02</further-classification>
        <further-classification edition="200601120260102B">C08F265/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/028</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H05K3/06</further-classification>
        <further-classification edition="200601120260102B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎梨世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, RISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸田夏木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉原謙介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIHARA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀口陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGUCHI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的感光性元件包括支撐體以及在所述支撐體上形成的感光層，所述感光層含有黏合劑聚合物、光聚合性化合物、光聚合引發劑以及光聚合抑制劑，所述光聚合抑制劑包含5%質量減少溫度為250℃以上的由下述式（1）表示的兒茶酚化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="146px" width="336px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式（1）中，R&lt;sup&gt;0&lt;/sup&gt;表示一價有機基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photosensitive element according to the present disclosure includes a support body and a photosensitive layer formed on the support body. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a photopolymerization inhibitor. The photopolymerization inhibitor contains a catechol compound represented by Formula (1) below having a 5% mass loss temperature of 250°C or higher. &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="337px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;In Formula (1), R&lt;sup&gt;0&lt;/sup&gt; represents a monovalent organic group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感光性元件</p>
        <p type="p">2:支撐體</p>
        <p type="p">3:感光層</p>
        <p type="p">4:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1512" publication-number="202632615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙幣處理裝置</chinese-title>
        <english-title>PAPER MONEY HANDLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">G07D9/00</main-classification>
        <further-classification edition="201601120260127B">G07D7/00</further-classification>
        <further-classification edition="201901120260127B">G07D11/20</further-classification>
        <further-classification edition="200601120260127B">G07D13/00</further-classification>
        <further-classification edition="200601120260127B">B65H29/00</further-classification>
        <further-classification edition="200601120260127B">B65H29/20</further-classification>
        <further-classification edition="200601120260127B">B65H33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, TOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TAKEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, THU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可降低已清點的紙幣回流之可能性的紙幣處理裝置。本發明提供一種紙幣處理裝置100，其為具備：具有紙幣的投入部與排出部之箱體101、識別紙幣用之識別部110、以及搬運紙幣之搬運輥104、104。箱體包括：可自由裝卸地安裝在排出部之單元150、以及至少1個構件112L、112R，其為可自由裝卸地安裝於排出部之單元的對面位置並具有將紙幣推向單元用之形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a paper money handling device which reduces the possibility of paper moneys counted by a handling unit flowing back. The paper money handling device 100 comprises a case 101 with a paper money input unit and an output unit, a recognition unit 110 for identifying paper moneys, and transport rollers 104, 104 for transporting paper moneys. The case includes a unit 150 that is detachably attached to the output unit, and at least one part 112L, 112R that is detachably attached to the output unit at a position opposite the unit and has a shape for pushing paper moneys toward the unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:紙幣處理裝置</p>
        <p type="p">101:箱體</p>
        <p type="p">102:本體</p>
        <p type="p">102L:凸部</p>
        <p type="p">102R:凸部</p>
        <p type="p">107:偵測部</p>
        <p type="p">107X:燈(感測器之發光側)</p>
        <p type="p">107Y:感測器(感測器之受光側)</p>
        <p type="p">112L:凸元件</p>
        <p type="p">112R:凸元件</p>
        <p type="p">113:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1513" publication-number="202631825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反轉圖案形成方法</chinese-title>
        <english-title>REVERSE PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G77/04</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/26</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="202601120260504B">H10P14/60</further-classification>
        <further-classification edition="202601120260504B">H10P14/692</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
        <further-classification edition="202601120260504B">H10P76/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可適用於使用高能射線之光微影尤其可適用於電子束(EB)微影及EUV微影之圖案形成方法，該圖案形成方法係使用感度及極限解析度優良的非化學增幅阻劑組成物來形成阻劑圖案，並以蝕刻耐性高的反轉圖案形成材料將圖案反轉。該課題之解決手段為一種圖案形成方法，包含：步驟(i)，於支持體上使用得自含有超原子價碘化合物、含羧基之化合物及溶劑的阻劑組成物之阻劑膜來形成阻劑圖案，步驟(ii)，於形成有前述阻劑圖案之支持體上塗佈反轉圖案形成材料來形成圖案反轉用被膜，及步驟(iii)，利用蝕刻去除前述阻劑圖案並形成反轉圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a patterning process for forming a pattern, including the steps of: (i) forming a resist pattern on a support using a resist film obtained from a resist composition containing a hypervalent iodine compound, a carboxy group-containing compound, and a solvent; (ii) applying a material for forming a reversed pattern onto the support having the resist pattern formed to form a coating film for pattern-reversing; and (iii) removing the resist pattern by etching to form a reversed pattern. This can provide a patterning process that can be applied to photolithography using a high-energy beam, particularly to electron beam (EB) lithography and an extreme ultraviolet ray (EUV), and in which a resist pattern is formed by using a non-chemically amplified resist composition having excellent sensitivity and an excellent resolution limit and the pattern is reversed by using a material for forming a reversed pattern that has high etching resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1514" publication-number="202631052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為傢俱配件或作為建築配件設計而成的配件</chinese-title>
        <english-title>FITTING CONFIGURED AS A FURNITURE FITTING OR AS A CONSTRUCTION FITTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A47B88/956</main-classification>
        <further-classification edition="201701120260429B">A47B88/40</further-classification>
        <further-classification edition="201701120260429B">A47B88/00</further-classification>
        <further-classification edition="200601120260429B">A47B96/00</further-classification>
        <further-classification edition="200601120260429B">F16B12/00</further-classification>
        <further-classification edition="200601120260429B">F16B12/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊哲樂　馬可斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEZLER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種作為傢俱配件或作為建築配件設計而成的配件（12），包括：&lt;br/&gt;  -   至少一個緊固窄片（13），該至少一個緊固窄片用於將至少是局部平板狀的結構元件（7）固定於配件（12）之上，該結構元件（7）較佳為抽屜底板（7a）或抽屜後壁（6），其中緊固窄片（13）包含接觸面（26）以及緊固面（27），該接觸面（26）用於抵靠在結構元件（7）上，該緊固面（27）和接觸面（26）被緊固窄片（13）的材料厚度間隔開來，&lt;br/&gt;  -   至少一個佈置在緊固窄片（13）中的開口（18），該至少一個開口用於供螺釘（14）穿過而將結構元件（7）固定在該至少一個緊固窄片之（13）上，&lt;br/&gt;  其中該至少一個開口（18）在緊固窄片（13）的緊固面（27）上至少局部地被較佳漏斗狀的間隔裝置（22）所包圍，該間隔裝置用於供螺釘（14）穿過，其中該間隔裝置（22）被設計成為緊固窄片（13）的一體成形部件，並且從緊固窄片（13）的緊固面（27）橫截伸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fitting (12), configured as a furniture fitting or as a construction fitting, the fitting (12) comprising: &lt;br/&gt; - at least one fastening limb (13) for fixing a construction element (7) that is at least partially plate-shaped, preferably a drawer bottom (7a) or a drawer rear wall (6), to the fitting (12), the fastening limb (13) having a bearing side (26) configured to bear against the construction element (7) and a fixing side (27) spaced apart from the bearing side (26) by a material thickness of the fastening limb (13), &lt;br/&gt; - at least one opening (18) arranged in the fastening limb (13) for the passage of a screw (14) for fixing the construction element (7) to the at least one fastening limb (13), &lt;br/&gt; wherein the at least one opening (18), on the fixing side (27) of the fastening limb (13), is at least partially surrounded by a, preferably funnel-shaped, distance device (22) for the passage of the screw (14), wherein the distance device (22) is an integral component of the fastening limb (13) and projects transversely from the fixing side (27) of the fastening limb (13).</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:抽屜側壁</p>
        <p type="p">7:結構元件</p>
        <p type="p">7a:抽屜底板</p>
        <p type="p">12:配件</p>
        <p type="p">13:緊固窄片</p>
        <p type="p">14:螺釘</p>
        <p type="p">18:開口</p>
        <p type="p">19:支撐窄片</p>
        <p type="p">20:垂直窄片</p>
        <p type="p">22:間隔裝置</p>
        <p type="p">26:接觸面</p>
        <p type="p">27:緊固面</p>
        <p type="p">28:止動條</p>
        <p type="p">29:收納槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1515" publication-number="202631841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜形成方法及物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">C08J5/18</main-classification>
        <further-classification edition="200601120260423B">G03F7/16</further-classification>
        <further-classification edition="200601120260423B">G03F7/004</further-classification>
        <further-classification edition="202601120260423B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城野潤平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRONO, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤俊樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清原直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOHARA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種膜形成方法，其係具有下述步驟之膜形成方法，於具有凹凸之基板上，離散性配置將至少包含聚合性化合物(a)作為不揮發性成分，至少包含溶劑(d)作為揮發性成分之液狀的硬化性組成物之複數個液滴的配置步驟、與離散性配置在前述基板上之前述複數個液滴的個別相鄰之液滴結合，於前述基板上形成連續的液膜，且前述液膜所包含之溶劑(d)揮發，前述溶劑(d)的含量待機至相對於前述液膜的全體，成為10體積%以下為止的待機步驟、與使前述液狀的硬化性組成物硬化的硬化步驟，其特徵為前述基板包含平均標高不同之複數個區域，在前述配置步驟，以配置在某區域之前述硬化性組成物的平均液膜厚相較配置在基板的最凸部區域之前述硬化性組成物的平均液膜厚，僅提高偏移量的方式來配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">501:基板</p>
        <p type="p">502:液膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1516" publication-number="202632342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導用連接器及光配線零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G02B6/122</main-classification>
        <further-classification edition="200601120260416B">G02B6/138</further-classification>
        <further-classification edition="201101120260416B">H01R24/40</further-classification>
        <further-classification edition="200601120260416B">H01R13/629</further-classification>
        <further-classification edition="200601120260416B">G06F3/042</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三重野寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIENO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種光波導用連接器，其包含：槽部，其供設置片狀之光波導，該光波導在寬度方向兩端具有階部；及一對銷孔，其等配置於槽部之寬度方向兩外側，供導銷插入；且槽部具有供配置下包層之第1部分、形成於第1部分之上下方向一者而供配置上包層之第2部分、及沿著階部形成於第1部分及第2部分之邊界之邊界部；且以將一對銷孔之中心連成之導銷基準線相對於邊界部朝前述第2部分側偏移與芯部之芯部高度相應之規定距離之方式配置一對銷孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:聚合物光波導</p>
        <p type="p">11:芯部</p>
        <p type="p">12:下包層</p>
        <p type="p">13:上包層</p>
        <p type="p">15:階部</p>
        <p type="p">21:壁部</p>
        <p type="p">23:蓋部</p>
        <p type="p">25:銷孔</p>
        <p type="p">30:槽部</p>
        <p type="p">31:第1部分</p>
        <p type="p">32:第2部分</p>
        <p type="p">32a:緣部</p>
        <p type="p">35:邊界部</p>
        <p type="p">D2:第2槽深度</p>
        <p type="p">g:偏移距離</p>
        <p type="p">h:芯部高度</p>
        <p type="p">h2:上包層高度</p>
        <p type="p">L:導銷基準線</p>
        <p type="p">w1:下包層寬度</p>
        <p type="p">W1:第1槽寬度</p>
        <p type="p">w2:上包層寬度</p>
        <p type="p">W2:第2槽寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1517" publication-number="202633459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維積體電路、行動通訊裝置及製造三維積體電路之方法</chinese-title>
        <english-title>THREE-DIMENSIONAL INTEGRATED CIRCUIT, MOBILE COMMUNICATION DEVICE AND METHOD OF MAKING THREE-DIMENSIONAL INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W70/06</main-classification>
        <further-classification edition="202601120260504B">H10W90/22</further-classification>
        <further-classification edition="202601120260504B">H10W76/153</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科沃美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切奇　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHETRY, KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱羅　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARROLL, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露經改良晶粒至晶圓堆疊技術。特別地，在一三維積體電路(3DIC)之組裝期間，一晶圓可包括由一紡絲聚合物提供之多個晶粒之間的絕緣。此紡絲聚合物代替由沉積技術產生之一更傳統的氧化矽絕緣體。該氧化矽絕緣體之代替使得該晶圓之大量生產在經濟上係可行的，此又允許在商業上實際體積下產生3DIC。一3DIC之使用最小化一電路封裝之側向表面積，從而允許更多實際面積被一行動計算裝置內之一電池使用。此外，一3DIC之該使用可允許電路元件之間的較短互連件，此又可允許該等電路元件之間的較快通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Improved die-to-wafer stacking techniques are disclosed. In particular, during assembly of a three-dimensional integrated circuit (3DIC), a wafer may include insulation between multiple dice provided by a spun polymer. This spun polymer replaces a more traditional silicon oxide insulator created by deposition techniques. Replacement of the silicon oxide insulator makes mass production of the wafer economically feasible, which in turn allows creation of 3DIC at commercially practical volumes. The use of a 3DIC minimizes lateral surface area of a circuit package, allowing for more real estate to be used by a battery within a mobile computing device. Further, the use of a 3DIC may allow for shorter interconnects between circuit elements, which may, in turn, allow for faster communication between the circuit elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:3DIC</p>
        <p type="p">102:第一層</p>
        <p type="p">104:第二層</p>
        <p type="p">106:基板</p>
        <p type="p">108:內部金屬化層</p>
        <p type="p">110:電路系統</p>
        <p type="p">112:通孔</p>
        <p type="p">114:額外通孔</p>
        <p type="p">116:外部接點</p>
        <p type="p">120:晶粒</p>
        <p type="p">122:電路系統</p>
        <p type="p">124:聚合物</p>
        <p type="p">126:通孔</p>
        <p type="p">128:互連金屬化層</p>
        <p type="p">130:額外金屬化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1518" publication-number="202632023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉動構件以及滾動軸承</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C8/26</main-classification>
        <further-classification edition="200601120260422B">C22C38/00</further-classification>
        <further-classification edition="200601120260422B">F16C19/00</further-classification>
        <further-classification edition="200601120260422B">F16C33/06</further-classification>
        <further-classification edition="200601120260422B">F16C33/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＮ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水田浩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">轉動構件具有表面且為進行了淬火及回火的鋼製品，表面為與其他轉動構件的接觸面。轉動構件在表面處包括滲氮層。表面的平均氮濃度為0.10質量%以上。表面的平均碳濃度為0.60質量%以上、1.5質量%以下。表面的硬度為800Hv以上、1000Hv以下。表面的殘留沃斯田鐵量為20體積%以下。在滲氮層中，在垂直於表面的剖面視角中，粒徑5.0μm以下的未溶解碳化物面積率為17%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內輪</p>
        <p type="p">10d:外周面</p>
        <p type="p">10da:軌道面</p>
        <p type="p">50:滲氮層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1519" publication-number="202632052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通風狹縫閥</chinese-title>
        <english-title>VENTING SLIT VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C16/44</main-classification>
        <further-classification edition="200601120260427B">C23C16/455</further-classification>
        <further-classification edition="200601120260427B">C23C16/54</further-classification>
        <further-classification edition="200601120260427B">F16K3/02</further-classification>
        <further-classification edition="200601120260427B">F16K3/314</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾莫　歐佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIR, OFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾德　普拉多什庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALDER, PRODOSH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬穆爾蒂　巴德里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAMURTHI, BADRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">狹縫閥組件包括具有開口的外殼，該開口設置在外殼的牆壁中且通過該開口可以轉移基板。該開口包括一第一側用於附接到狹縫隧道。第一通道形成於開口的頂表面相鄰處。第一複數個氣孔從第一通道延伸並定向以第一角度朝向處理腔室從加壓氣體產生第一氣簾。第二通道形成於開口的底表面相鄰處。第二複數個氣孔從第二通道延伸並定向以第二角度朝向腔室從加壓氣體產生第二氣簾，該第二氣簾與第一氣簾相交或從第一氣簾偏移，以保護狹縫隧道免受處理化學品的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A slit valve assembly includes a housing having an opening in a wall of the housing and through which a substate is to be transferred. The opening includes a first side to attach to a slit tunnel. A first channel is formed adjacent to a top surface of the opening. First plurality of gas holes extend from the first channel and is oriented so as to create a first gas curtain from a pressurized gas at a first angle towards a process chamber. A second channel is formed adjacent to a bottom surface of the opening. A second plurality of gas holes extend from the second channel and is oriented so as to create a second gas curtain from the pressurized gas at a second angle towards the chamber that is to intersect with, or be offset from, the first gas curtain to protect the slit tunnel from process chemistries.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:處理腔室</p>
        <p type="p">106:開口</p>
        <p type="p">107:狹縫隧道</p>
        <p type="p">200:狹縫閥設備</p>
        <p type="p">212:致動器</p>
        <p type="p">214:連桿</p>
        <p type="p">300:基板處理系統</p>
        <p type="p">305:外殼</p>
        <p type="p">306:第二開口</p>
        <p type="p">306A:第一側</p>
        <p type="p">306B:第二側</p>
        <p type="p">306C:頂表面</p>
        <p type="p">306D:底表面</p>
        <p type="p">308:歧管</p>
        <p type="p">310:閘門</p>
        <p type="p">320A:第一通道</p>
        <p type="p">320B:第二通道</p>
        <p type="p">322A:第一複數個氣孔</p>
        <p type="p">322B:第二複數個氣孔</p>
        <p type="p">326:第一O型環</p>
        <p type="p">328:第二O型環</p>
        <p type="p">330:第三O型環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1520" publication-number="202633364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>護膜框架及護膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/70</main-classification>
        <further-classification edition="202601120260423B">H10P72/00</further-classification>
        <further-classification edition="200601120260423B">B29C63/02</further-classification>
        <further-classification edition="200601120260423B">B65H35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簗瀬優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANASE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種護膜框架，即使厚度不足2.5mm，仍可在不會在護膜的剝離作業中產生護膜的損傷的情況下，良好且確實地進行護膜的更換。  &lt;br/&gt;　　[解決手段] 提供一種護膜框架，為長方形的框狀框架(1)，具有從外表面朝向內面而設的剝離孔，該剝離孔(3)，於4處的角部附近，在從各角部距離各邊的外形尺寸長度(L1、L3)的10%以內的區域(L2、L4)存在至少1個以上，且在4個邊的前述角部附近以外至少存在1個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:護膜框架</p>
        <p type="p">2:治具孔</p>
        <p type="p">3:剝離孔</p>
        <p type="p">L1,L3:各邊的外形尺寸長度</p>
        <p type="p">L2,L4:在從角部距離邊的外形尺寸長度的10%以內的區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1521" publication-number="202631812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低折射率材料用聚醯亞胺樹脂、組成物、聚醯亞胺膜、光學材料、包層材及光波導、以及低折射率材料用聚醯胺酸及組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">C08L79/08</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B6/02</further-classification>
        <further-classification edition="200601120260504B">G02B6/12</further-classification>
        <further-classification edition="200601120260504B">G02B6/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉崎達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAKI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷晟吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, SEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関豊光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, TOYOMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東昌弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸川洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIKAWA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂本勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMOTO, ISAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匂坂重仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAGISAKA, SHIGEHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩見淳一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOMI, JUNICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNISHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種低折射率材料用聚醯亞胺樹脂，其由酸酐和二胺構成，上述酸酐為選自由下述通式(A-1a)所示的化合物和下述通式(A-1b)所示的化合物所組成的組中的1種以上，上述二胺為選自由下述通式(B-1)所示的化合物和下述通式(B-2)所示的化合物所組成的組中的1種以上。  &lt;br/&gt;&lt;img align="absmiddle" height="409px" width="274px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="343px" width="340px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1522" publication-number="202631276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽電池模組之再利用裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260504B">B09B3/35</main-classification>
        <further-classification edition="202201320260504B">B09B101/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＰＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NPC INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種於使用過之太陽電池模組之再利用步驟中，確實且容易地剝離玻璃基板與其他材料之裝置。&lt;br/&gt;  一種將玻璃基板與其他材料剝離的太陽電池模組之再利用裝置，其特徵在於具備：上游搬送部30，搬送太陽電池模組10；滾筒刷20，相對於所搬送之太陽電池模組，抵接於其他材料來旋轉，並將其他材料剝離；太陽電池模組支持部40，從玻璃基板側支持滾筒刷所抵接於太陽電池模組之區域；升降機構，能夠調整滾筒刷與背板之間隙；下游搬送部80，搬送其他材料被剝離後之玻璃基板；中央處理控制裝置，控制各自之動作；及回收元件60，回收被剝離之其他材料，且滾筒刷係具有鋼線等金屬線或尼龍等樹脂線，且其線徑係根據其他材料之去除率來最佳化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:太陽電池模組</p>
        <p type="p">20:滾筒刷</p>
        <p type="p">30:上游搬送部</p>
        <p type="p">80:下游搬送部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1523" publication-number="202632924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據流中的補充信息的認證</chinese-title>
        <english-title>AUTHENTICATION OF SUPPLEMENTAL INFORMATION IN DATA STREAMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H04L9/18</main-classification>
        <further-classification edition="201301120260504B">G06F21/64</further-classification>
        <further-classification edition="201301120260504B">G10L19/008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕雅夫　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFF, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛茲　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINZ, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇荷寧　卡斯登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEHRING, KARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於檢查數據流的可信度的裝置和方法。根據一方面，數據流包含指示，該指示指示是否應將一個或多個補充信息消息包含在數據流的部分中，該部分將被用於執行數據流的可信度檢查。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatuses and methods for checking a data stream on trustworthiness are described. According to an aspect, the data stream comprises an indication which indicates whether one or more supplemental information messages are to be included into a portion of the data stream, which portion is to be used for performing a trustworthiness check of the data stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:預定部分</p>
        <p type="p">14:數據流</p>
        <p type="p">16:有效載荷分組</p>
        <p type="p">18:補充信息分組</p>
        <p type="p">19:補充信息消息</p>
        <p type="p">20:解碼的裝置</p>
        <p type="p">20:解碼器</p>
        <p type="p">21:提取器</p>
        <p type="p">30:部分確定器</p>
        <p type="p">41:驗證模組</p>
        <p type="p">43:數位簽名</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1524" publication-number="202632564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>診斷的方法、系統及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260430B">G06Q10/20</main-classification>
        <further-classification edition="200601120260430B">G01B11/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商華爾卡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALQUA, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本隆啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元野雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTONO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此診斷方法中，包含以下工序：藉由凸緣面的三維點群資料來測定與墊片的面壓範圍；比較劣化前後的面壓範圍，並計算面壓減少量、面壓減少寬度、面壓減少率或面壓減少速度的任一者或二者以上；&lt;br/&gt;  從保存有已和面壓減少量、面壓減少寬度、面壓減少率或面壓減少速度的任一者或二者以上建立關係之凸緣的修繕內容、修繕時期或修繕費用的任一者或二者以上之資料庫，選擇以面壓減少量、面壓減少寬度、面壓減少率或面壓減少速度的任一者或二者以上所特定出之修繕內容、修繕時期或修繕費用的任一者或二者以上；及提示包含修繕內容、修繕時期或修繕費用的任一者或二者以上之診斷結果。藉此，根據劣化前後的各面壓範圍的數值化，來提示包含修繕內容、修繕時期或修繕費用的任一者或二者以上之維護檢修資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4-1,4-2:管路</p>
        <p type="p">6-1,6-2:凸緣</p>
        <p type="p">16:凸緣面</p>
        <p type="p">18:診斷系統</p>
        <p type="p">20:螺栓貫通孔</p>
        <p type="p">22:3D掃描器</p>
        <p type="p">24:診斷裝置</p>
        <p type="p">26:作業人員</p>
        <p type="p">28:診斷處理部</p>
        <p type="p">30:資訊提示部</p>
        <p type="p">32:處理器</p>
        <p type="p">34:記憶體</p>
        <p type="p">36:輸入輸出部(I/O)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1525" publication-number="202631784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、塗布層、及膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G59/20</main-classification>
        <further-classification edition="200601120260504B">C08G59/68</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/49</further-classification>
        <further-classification edition="200601120260504B">C08K5/5419</further-classification>
        <further-classification edition="200601120260504B">C08K5/55</further-classification>
        <further-classification edition="200601120260504B">C08K5/56</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C09D163/00</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="202501120260504B">H10H20/854</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內野慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHINO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野真輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種硬化性樹脂組成物，其可獲得即便在暴露於高溫高濕環境中之情形時硬度、接著性、及防變色性亦優異之硬化物。又，本發明之目的在於提供一種使用該硬化性樹脂組成物所形成之塗布層及膜。  &lt;br/&gt;本發明係一種硬化性樹脂組成物，其含有硬化性樹脂、偶合劑、及聚合起始劑，上述硬化性樹脂包含於1分子中具有2個以上環氧基且不具有芳香環之硬化性樹脂，上述偶合劑包含於1分子中具有1個環氧丙基之偶合劑，上述於1分子中具有1個環氧丙基之偶合劑之含量相對於上述硬化性樹脂整體與上述偶合劑整體之合計100質量份為10質量份以上50質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1526" publication-number="202631263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗布裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">B05C11/10</main-classification>
        <further-classification edition="200601120260311B">B05C5/02</further-classification>
        <further-classification edition="200601120260311B">B05D1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木田威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種可抑制於塗膜終端部形成塗布液之拖痕之塗布裝置。具體而言，本發明之塗布裝置構成為具備：模具，其具有向被搬送之基材之指定面噴出塗布液之噴出口；及供給閥，其可切換為對上述模具供給塗布液之打開狀態、與停止對上述模具供給塗布液之關閉狀態；藉由上述供給閥之開閉狀態之切換，使塗布液對上述模具間歇性供給並噴出，於基材之上述指定面間歇性形成塗膜；且該塗布裝置進而具備調節自上述噴出口之塗布液噴出量之噴出量調節機構，上述噴出量調節機構於將上述供給閥自上述打開狀態切換為上述關閉狀態之前，以塗布液自上述噴出口之噴出量變少之方式進行調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">12:塗膜</p>
        <p type="p">13:塗膜起始部</p>
        <p type="p">14:塗膜終端部</p>
        <p type="p">43:供給閥</p>
        <p type="p">45:回收閥</p>
        <p type="p">52:吸回部</p>
        <p type="p">a~i:狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1527" publication-number="202631682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CD19結合分子及其用途</chinese-title>
        <english-title>CD19 BINDING MOLECULES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K16/28</main-classification>
        <further-classification edition="200601120260429B">C12N15/13</further-classification>
        <further-classification edition="200601120260429B">C12N15/63</further-classification>
        <further-classification edition="200601120260429B">A61K39/395</further-classification>
        <further-classification edition="201701120260429B">A61K47/68</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭達　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANDA, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞歐　艾米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYO, AMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　康妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, CONNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴勒　戴特南達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHELUR, DATTANANDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　海慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HAIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜碧　里吉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEBE, REGIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張先英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了特異性結合至CD19的CD19結合分子，包括單特異性、雙特異性和三特異性結合分子；包含該CD19結合分子的軛合物；以及包含該CD19結合分子和軛合物的藥物組成物。本揭露進一步提供了使用該C19結合分子治療與CD19表現相關的疾病和障礙之方法。本揭露還進一步提供了被工程化以表現該CD19結合分子的重組宿主細胞，以及藉由在表現該CD19結合分子的條件下培養該宿主細胞來產生該CD19結合分子之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides CD19 binding molecules that specifically bind to CD19, including monospecific, bispecific and trispecific binding molecules, conjugates comprising the CD19 binding molecules, and pharmaceutical compositions comprising the CD19 binding molecules and the conjugates. The disclosure further provides methods of using the C19 binding molecules to treat diseases and disorders associated with expression of CD19. The disclosure yet further provides recombinant host cells engineered to express the CD19 binding molecules and methods of producing the CD19 binding molecules by culturing the host cells under conditions in which the CD19 binding molecules are expressed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1528" publication-number="202631771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性聚胺甲酸酯組成物</chinese-title>
        <english-title>THERMOPLASTIC POLYURETHANE COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/08</main-classification>
        <further-classification edition="200601120260504B">C08G18/32</further-classification>
        <further-classification edition="200601120260504B">C08G18/42</further-classification>
        <further-classification edition="200601120260504B">C08G18/48</further-classification>
        <further-classification edition="200601120260504B">C08G18/66</further-classification>
        <further-classification edition="200601120260504B">C08G18/73</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C08L75/04</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="202601120260504B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商盧伯利索先進材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBRIZOL ADVANCED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆雪松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, XUESONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘元佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUANJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉聖亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於熱塑性聚胺甲酸酯(TPU)組成物，其包含下列之反應產物：多異氰酸酯；鏈延長劑，其包含至少i)C2-C6二醇及至少ii)聚醚二醇；以及分子量為自500至1400 g/mol之聚酯多元醇，其包含至少i)具有自4至8個碳原子之二羧酸及至少ii)C2-C6支鏈二醇。該等組成物特別適合製造膜，更特定言之半導體晶圓保護膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to thermoplastic polyurethane (TPU) compositions comprising the reaction product of a polyisocyanate; a chain extender comprising at least i) a C2-C6 diol and at least ii) a polyether glycol; and, polyester polyol having a molecular weight of from 500 to 1400 g/mol comprising at least i) a dicarboxylic acid having from 4 to 8 carbon atoms and at least ii) a C2-C6 branched diol. The compositions are particularly suitable for the manufacturing of films, more particularly semiconductor wafer protective films.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1529" publication-number="202633227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及包含顯示面板之電子裝置</chinese-title>
        <english-title>DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260423B">H10H29/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慧蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYELAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANGYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示面板，其包含一基板，該基板包含複數個島部分及複數個橋部分，該複數個橋部分用於將該複數個島部分中相鄰的島部分彼此連接；一顯示層，設置於該基板上，且該顯示層包含複數個像素及複數個布線。該複數個像素設置於該複數個島部分中，該複數個布線設置於該複數個橋部分中。該顯示面板包含一第一保護層，該第一保護層覆蓋該基板的一側表面及該顯示層的一側表面。在平面圖中，該第一保護層的設置方式使得該第一保護層與該複數個像素間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a display panel including a substrate including a plurality of island portions and a plurality of bridge portions connecting adjacent island portions among the plurality of island portions to each other, a display layer arranged on the substrate and including a plurality of pixels and a plurality of wirings. The plurality of pixels are arranged in the plurality of island portions, and the plurality of wirings are arranged in the plurality of bridge portions. The display panel includes a first protective layer covering a side surface of the substrate and a side surface of the display layer. The first protective layer is arranged such that the first protective layer is spaced apart from the plurality of pixels in a plan view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100a:島區域</p>
        <p type="p">100b:橋區域</p>
        <p type="p">100OP1,200OP1,300OP1,CS:開口</p>
        <p type="p">11:第一島部分</p>
        <p type="p">12:第一橋部分</p>
        <p type="p">15:第一保護層</p>
        <p type="p">200:顯示層</p>
        <p type="p">300:封裝層</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">ED:發光二極體</p>
        <p type="p">IL:絕緣層</p>
        <p type="p">PC:像素電路</p>
        <p type="p">WL:布線</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1530" publication-number="202631219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於跨各種材料特性之受控注射的裝置</chinese-title>
        <english-title>DEVICE FOR CONTROLLED INJECTION ACROSS A VARIETY OF MATERIAL PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260427B">A61M60/50</main-classification>
        <further-classification edition="200601120260427B">A61M5/168</further-classification>
        <further-classification edition="200601120260427B">A61F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞斯庫拉科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AESCULATECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴亞特　尼奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYAT, NIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里斯　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIESE, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼奈飛　羅比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENEFEE, ROBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈納達南　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANARDHANAN, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉米瑞茲　荷西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMIREZ, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述了一種用於將具有各種機械特性之調配物遞送至精確位置之一般化注射裝置。尤其受關注的係意欲出於閉塞的目的將一熱反應性水凝膠應用於淚管的表現，作為對與乾眼症相關聯之症狀之一治療。此外，提供跨越多種應用、機制及實體考慮因素對一注射裝置之需求之一模組化解決方案。本揭露內容提供用於低體積之精確注射、預填充注射裝置中之水分保持及自動或手動注射之致動(僅舉幾例)之方法之實例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein is a generalized injection device for delivering formulations of various mechanical properties to precise locations. Of particular interest is the manifestation intended for the application of a thermally responsive hydrogel to the tear duct for the purpose of occlusion, as a treatment for symptoms associated with dry eye syndrome. Further, a modular solution to the need for an injection device across a variety of applications, mechanism, and physical considerations is provided. This disclosure provides examples of methods for precise injection of low volumes, moisture retention in pre-filled injection devices, and actuation for automatic or manual injection, to name a few.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">2:注射口管/分配孔口</p>
        <p type="p">3:儲集器</p>
        <p type="p">4A:止擋件</p>
        <p type="p">4B:柱塞</p>
        <p type="p">5A:可按下按鈕/按鈕</p>
        <p type="p">5B:圓錐形彈簧</p>
        <p type="p">6:彈簧/壓縮彈簧/致動機構</p>
        <p type="p">7:帽/附接</p>
        <p type="p">8:螺釘</p>
        <p type="p">9:接合組件/輪轂</p>
        <p type="p">10:軟塑膠罩蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1531" publication-number="202631282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片狀銅粒子及包含其之導電性樹脂組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260423B">B22F1/065</main-classification>
        <further-classification edition="202201120260423B">B22F1/07</further-classification>
        <further-classification edition="200601120260423B">C22C9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椛島貴将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABASHIMA, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井手仁彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, HITOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之片狀銅粒子中，對該片狀銅粒子之截面藉由電子束背向散射繞射法觀察並測得之晶粒數量以平均值計為150個以上2000個以下。於俯視下，將橫穿粒子之最長線段作為長軸，將相對於該長軸之垂直二等分線作為短軸時，俯視下晶粒之數量相對於長軸長與短軸長之乘積值(μm&lt;sup&gt;2&lt;/sup&gt;)，為4.5個/μm&lt;sup&gt;2&lt;/sup&gt;以上40.0個/μm&lt;sup&gt;2&lt;/sup&gt;以下。晶粒尺寸較佳為0.2 μm以上1.3 μm以下。於俯視下，較佳為相較於位於粒子中央區域之晶粒之平均尺寸，位於周緣區域之晶粒之平均尺寸較小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1532" publication-number="202632074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔離件、電解單元、及氫製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260428B">C25B1/04</main-classification>
        <further-classification edition="202101120260428B">C25B9/15</further-classification>
        <further-classification edition="200601120260428B">C25C7/04</further-classification>
        <further-classification edition="201601120260428B">H01M8/0232</further-classification>
        <further-classification edition="201601120260428B">H01M8/0241</further-classification>
        <further-classification edition="202101120260428B">C25B13/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池上雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEGAMI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福壽陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUJU, RIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥谷和正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯屋谷和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IYATANI, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島隆芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮脇秀旗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAWAKI, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係用於利用導電性流體中所含之水來製造氫之電解單元中之隔離件，其具備板狀之本體。上述本體具備：電解區域，其配置於上述本體之第一面之中央部；歧管，其形成於上述第一面之包圍上述中央部之外周部，且貫通上述本體；及流路，其將上述電解區域與上述歧管相連。上述流路具備隧道部，該隧道部於上述本體之內部與上述歧管之內周面相連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:隔離件</p>
        <p type="p">5α:中央部</p>
        <p type="p">5β:外周部</p>
        <p type="p">5P:本體</p>
        <p type="p">5a:第一面</p>
        <p type="p">50:電解區域</p>
        <p type="p">50c:凹部</p>
        <p type="p">51:供給歧管</p>
        <p type="p">52:流路(供給路徑)</p>
        <p type="p">52r:整流部</p>
        <p type="p">52t:隧道部</p>
        <p type="p">52tg:旁通槽</p>
        <p type="p">52th:旁通孔</p>
        <p type="p">53:排出歧管</p>
        <p type="p">54:流路(排出路徑)</p>
        <p type="p">54r:整流部</p>
        <p type="p">54t:隧道部</p>
        <p type="p">54tg:旁通槽</p>
        <p type="p">54th:旁通孔</p>
        <p type="p">55:排氣歧管</p>
        <p type="p">A1,A2,A3,A4:開口部</p>
        <p type="p">B1:供給緣</p>
        <p type="p">B2:排出緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1533" publication-number="202632024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工裝置及加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C14/02</main-classification>
        <further-classification edition="200601120260504B">C23C14/34</further-classification>
        <further-classification edition="200601120260504B">C23C14/54</further-classification>
        <further-classification edition="200601120260504B">C23C14/56</further-classification>
        <further-classification edition="200601120260504B">C23C14/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若山峻哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKAYAMA, SHUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾直之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小坂明世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKA, TOSHITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林裕野</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堂免聖史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMEN, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之加工裝置(1A)包含：真空腔室(200)、加熱部(Pm)、濺射部(Ps)及搬送部(70)。加熱部(Pm)及濺射部(Ps)位於真空腔室(200)內。加熱部(Pm)藉由在減壓氣氛下照射微波而加熱對象物(10)。濺射部(Ps)進行在減壓氣氛下對於對象物(10)之濺射成膜。搬送部(70)向加熱部(Pm)及濺射部(Ps)依序搬送對象物(10)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:加工裝置</p>
        <p type="p">50:搬送路徑</p>
        <p type="p">70:搬送部</p>
        <p type="p">75,100,400:輥</p>
        <p type="p">200:真空腔室</p>
        <p type="p">300:微波加熱器</p>
        <p type="p">310:波導管</p>
        <p type="p">320:圓柱形空腔諧振器</p>
        <p type="p">500:反應性濺射裝置</p>
        <p type="p">510:陰極</p>
        <p type="p">520:滾筒</p>
        <p type="p">Pm:加熱部</p>
        <p type="p">Ps:濺射部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1534" publication-number="202631712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物、膜、濾光器、影像顯示裝置及光學感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/50</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/033</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田哲志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, TETSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野雅臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村季彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, TOKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八木一成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGI, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬化性組成物，其含有：包含顏料之色材；光聚合起始劑；聚合性化合物；選自化合物A1、化合物A2及化合物A3中之至少1個；及溶劑，上述光聚合起始劑包含乙醛酸酯化合物，上述化合物A1為選自具有鹼基及接枝鏈且重量平均分子量為2000以上且30000以下之化合物A1-1及具有鹼基的重量平均分子量為2000以上且30000以下之嵌段共聚物A1-2中之至少1種，上述化合物A2為具有色素結構等及鹼基且分子量為100以上且未達2000之化合物，上述化合物A3為聚伸烷基亞胺。本發明亦提供一種使用了前述硬化性組成物之膜、濾光器、影像顯示裝置及光學感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1535" publication-number="202631585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>石墨烯鏈接子化合物及場效電晶體生化感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D207/452</main-classification>
        <further-classification edition="201701120260504B">C01B32/182</further-classification>
        <further-classification edition="201701120260504B">C01B32/194</further-classification>
        <further-classification edition="200601120260504B">G01N27/414</further-classification>
        <further-classification edition="200601120260504B">G01N33/53</further-classification>
        <further-classification edition="200601120260504B">G01N33/68</further-classification>
        <further-classification edition="201101120260504B">B82Y15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>結城達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田和朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於下述式(I)所示之化合物、包含該鏈接子化合物與特定之溶劑的鏈接子劑組成物、該鏈接子化合物與石墨烯奈米片之複合物，及具備該複合物的GFET生化感測器。  &lt;br/&gt;&lt;img align="absmiddle" height="208px" width="290px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　[式中，A、B、Z、R&lt;sup&gt;1&lt;/sup&gt;~R&lt;sup&gt;6&lt;/sup&gt;係與說明書及申請專利範圍中記載者相同]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1536" publication-number="202631260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體噴出器及噴霧容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B05B1/34</main-classification>
        <further-classification edition="200601120260423B">B05B1/04</further-classification>
        <further-classification edition="200601120260423B">B05B1/02</further-classification>
        <further-classification edition="202301120260423B">B05B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三原康太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIHARA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種液體噴出器及噴霧容器，能夠將霧化後之液體大範圍地均勻噴出。  &lt;br/&gt;本發明之液體噴出器具備：本體部，其能夠壓送容器本體內之液體；及液體噴出噴嘴，其使由該本體部壓送之液體噴出；液體噴出噴嘴具有：前壁部，其設置於液體噴出噴嘴之噴出方向側；及噴出口，其形成於前壁部，且能夠噴出液體；前壁部具有朝向噴出方向側之前面、及朝向與噴出方向為相反側之方向之後表面，噴出口形成為具有長軸及短軸之長條狀，且設置為從前壁部之前表面貫通至後表面，噴出口之內周壁之至少長軸之兩端部形成為與該噴出口之貫通方向平行，前壁部之後表面之至少一部分構成朝向噴出口傾斜之傾斜面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:噴霧容器</p>
        <p type="p">100:容器本體</p>
        <p type="p">110:口筒部</p>
        <p type="p">200:液體噴出器</p>
        <p type="p">210:本體部</p>
        <p type="p">211:安裝蓋</p>
        <p type="p">212:縱筒部</p>
        <p type="p">212a:頸部</p>
        <p type="p">212b:進料口</p>
        <p type="p">212c:連通孔</p>
        <p type="p">212d:吸入閥</p>
        <p type="p">212e:噴出閥</p>
        <p type="p">213:橫筒部</p>
        <p type="p">214:保持部</p>
        <p type="p">215:頭罩</p>
        <p type="p">216:管</p>
        <p type="p">220:泵</p>
        <p type="p">221:氣缸</p>
        <p type="p">222:活塞</p>
        <p type="p">224:泵室</p>
        <p type="p">225:盤簧</p>
        <p type="p">230:操作桿</p>
        <p type="p">240:液體噴出噴嘴</p>
        <p type="p">500:噴嘴蓋</p>
        <p type="p">600:發泡構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1537" publication-number="202632760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電池的生產鋰鈷氧化物材料的材料和方法</chinese-title>
        <english-title>MATERIALS AND METHODS OF PRODUCING LITHIUM COBALT OXIDE MATERIALS OF A BATTERY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260427B">H01M4/525</main-classification>
        <further-classification edition="202501120260427B">C01G51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壹久公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJOULE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　海霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, HAIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　勝峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENGFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　敏端</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MIN-DUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉夢琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MENGCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　良毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了摻雜有化學式為Lix Coy Oz（doped Me1&lt;sub&gt;a&lt;/sub&gt; Me2&lt;sub&gt;b &lt;/sub&gt;Me3&lt;sub&gt;c &lt;/sub&gt;…. MeN&lt;sub&gt;n&lt;/sub&gt;）的一種或多種金屬摻雜劑的各種鋰鈷氧化物材料，以及生產各種鋰鈷氧化物材料的方法和設備。 該方法包括將含鋰鹽、含鈷鹽和一種或多種含金屬摻雜劑的鹽在液體混合物中的摩爾比 M&lt;sub&gt;LiSalt&lt;/sub&gt;: M&lt;sub&gt;CoSalt&lt;/sub&gt;: M&lt;sub&gt;Me1Salt&lt;/sub&gt;: M&lt;sub&gt;Me2Salt&lt;/sub&gt;: M&lt;sub&gt;Me3Salt&lt;/sub&gt;: ... M&lt;sub&gt;MeNSalt&lt;/sub&gt; 調整為等於 x : y : a : b: c : …n 的比例，在氣體存在下乾燥液體混合物的霧形成氣-固混合物，將氣-固混合物分離成一個或多個氧化物材料的固體顆粒，並在另一氣體流存在下對氧化物材料的固體顆粒進行退火，以獲得鋰鈷氧化物材料的結晶顆粒。 該工藝系統具有霧產生器、乾燥室、一個或多個氣固分離器和一個或多個反應器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various lithium cobalt oxides materials doped with one or more metal dopants having a chemical formula of Li&lt;sub&gt;x &lt;/sub&gt;Co&lt;sub&gt;y&lt;/sub&gt; O&lt;sub&gt;z&lt;/sub&gt; (doped Me1&lt;sub&gt;a&lt;/sub&gt; Me2&lt;sub&gt;b &lt;/sub&gt;Me3&lt;sub&gt;c &lt;/sub&gt;…. MeN&lt;sub&gt;n&lt;/sub&gt;), and method and apparatus of producing the various lithium cobalt oxides materials are provided. The method includes adjusting a molar ratio M&lt;sub&gt;LiSalt&lt;/sub&gt;:&lt;sub/&gt;M&lt;sub&gt;CoSalt&lt;/sub&gt;: M&lt;sub&gt;Me1Salt&lt;/sub&gt;:&lt;sub/&gt;M&lt;sub&gt;Me2Salt &lt;/sub&gt;: M&lt;sub&gt;Me3Salt&lt;/sub&gt; : … M&lt;sub&gt;MeNSalt&lt;/sub&gt; of a lithium-containing salt, a cobalt-containing salt and one or more metal-dopant-containing salts within a liquid mixture to be equivalent to a ratio of x : y : a : b: c : …n , drying a mist of the liquid mixture in the presence of a gas to form a gas-solid mixture, separating the gas-solid mixture into one or more solid particles of an oxide material, and annealing the solid particles of the oxide material in the presence of another gas flow to obtain crystalized particles of the lithium cobalt oxide material. The process system has a mist generator, a drying chamber, one or more gas-solid separator, and one or more reactors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110:步驟</p>
        <p type="p">120:步驟</p>
        <p type="p">130:步驟</p>
        <p type="p">140:步驟</p>
        <p type="p">150:步驟</p>
        <p type="p">160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1538" publication-number="202633365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板支撐件</chinese-title>
        <english-title>SUBSTRATE SUPPORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P72/70</main-classification>
        <further-classification edition="200601120260424B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維喬彭　馬雷克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VYCHOPEN, MAREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶賈特　艾瑞克　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOGAART, ERIK WILLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種經組態以支撐一基板之基板支撐件。該基板支撐件包含一主體。該主體具有經組態以支撐該基板之一第一側及與該第一側相對之一第二側。複數個凹槽形成於該主體中。該複數個凹槽包含一第一凹槽及比該第一凹槽長之一第二凹槽。該第一凹槽經組態以阻礙在一第一方向上通過該第一凹槽之一流體流動且允許在與該第一方向相對之一第二方向上通過該第一凹槽之該流體流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate support configured to support a substrate. The substrate support, comprises a main body. The main body has a first side configured to support the substrate, and a second side opposite to the first side. A plurality of grooves is formed in the main body. The plurality of grooves comprises a first groove and a second groove longer than the first groove. The first groove is configured to impede a flow of fluid through the first groove in a first direction and to allow the flow of fluid through the first groove in a second direction, opposing the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板支撐件</p>
        <p type="p">12:通孔</p>
        <p type="p">70:入口</p>
        <p type="p">80:流動阻斷器</p>
        <p type="p">511:第一通道</p>
        <p type="p">512:第二通道</p>
        <p type="p">601:凹槽</p>
        <p type="p">602:凹槽</p>
        <p type="p">611:第一導管</p>
        <p type="p">612:第二導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1539" publication-number="202631105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃組合物</chinese-title>
        <english-title>GLASS COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K8/19</main-classification>
        <further-classification edition="200601120260504B">C03C3/14</further-classification>
        <further-classification edition="200601120260504B">A61K8/20</further-classification>
        <further-classification edition="200601120260504B">A61Q11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商艾爾科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IR SCIENTIFIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波伊　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克唐納　帕爾森思　凱瑟琳　娜歐米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACDONALD-PARSONS, KATHLEEN NAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布椎奧　吉瑞達　艾菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUDREAU, GERALDA EFFIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供玻璃組合物，其包括約20莫耳%至45莫耳%之B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；及約10莫耳%至約80莫耳%之一或多種選自由CaO及MgO組成之群的玻璃組分。該等玻璃組合物亦包括小於0.1莫耳% CdO。該等玻璃組合物可包括Na&lt;sub&gt;2&lt;/sub&gt;O、K&lt;sub&gt;2&lt;/sub&gt;O及磷酸鹽源中之一或多者，其中B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及磷酸鹽源總計為約60莫耳%或更少。該等玻璃組合物可包括氟化物源。該玻璃組合物可用於使牙本質脫敏。本發明亦提供牙本質脫敏組合物，以及所揭示玻璃組合物之方法及用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides glass compositions that include from about 20 mol% to 45 mol% of B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; and from about 10 mol% to about 80 mol% of one or more glass components selected from the group consisting of CaO and MgO. The glass compositions also include less than 0.1 mol% CdO. The glass compositions may include one or more of Na&lt;sub&gt;2&lt;/sub&gt;O, K&lt;sub&gt;2&lt;/sub&gt;O, and a phosphate source, where the B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; and the phosphate source total about 60 mol% or less. The glass compositions may include a source of fluoride. The glass composition may be used to desensitize dentin. The present disclosure also provides dentin-desensitizing compositions, as well as methods and uses of the disclosed glass compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1540" publication-number="202631211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂肪處理裝置</chinese-title>
        <english-title>FAT PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61L27/54</main-classification>
        <further-classification edition="200601120260429B">A61M5/32</further-classification>
        <further-classification edition="202201120260429B">B01F25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴西商西莉美德植入工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILIMED - INDUSTRIA DE IMPLANTES LTDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法里亞斯　多斯　桑托斯　珍妮弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARIAS DOS SANTOS, JENIFFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩德羅　米蘭　愛德華多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEDRO MILAN, EDUARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞爾奎拉　蒙塔格尼尼　蒂亞戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERQUEIRA MONTAGNINI, THIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　奧利維拉　貝爾納多　雨果</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE OLIVEIRA BERNARDO, HUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是關於一種脂肪處理裝置，具體而言，是關於一種用於美學及重建醫學中之自體回注的脂肪處理裝置。所述脂肪處理裝置包括一容器、一蓋體、一過濾元件以及一葉輪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a fat processing device, specifically a fat processing device for autologous reinjection in aesthetic and reconstructive medicine. The fat processing device comprising a container, a lid, a filter element and an impeller.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:脂肪處理裝置</p>
        <p type="p">15:容器</p>
        <p type="p">20:蓋體</p>
        <p type="p">25:過濾元件</p>
        <p type="p">30:葉輪</p>
        <p type="p">35:把手</p>
        <p type="p">40A:軟管型連接部/連接部</p>
        <p type="p">40B:軟管型連接部/連接部</p>
        <p type="p">40C:魯爾鎖型連接部/連接部</p>
        <p type="p">40D:導管端型連接部/連接部</p>
        <p type="p">60A:污染物出口</p>
        <p type="p">60B:脂肪出口</p>
        <p type="p">70:軟管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1541" publication-number="202631786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於彎曲配施工具之銀可燒結黏著材料以及使用該材料之半導體裝置</chinese-title>
        <english-title>SILVER SINTERABLE BONDING MATERIAL FOR BENDED DISPENSING TOOL AND SEMICONDUCTOR DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C08G59/22</main-classification>
        <further-classification edition="200601120260427B">H01B1/22</further-classification>
        <further-classification edition="200601120260427B">C22C5/06</further-classification>
        <further-classification edition="200601120260427B">C09J9/02</further-classification>
        <further-classification edition="200601120260427B">C08K3/08</further-classification>
        <further-classification edition="202201120260427B">B22F1/065</further-classification>
        <further-classification edition="202201120260427B">B22F1/068</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商漢高股份有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于媛媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YUANYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮瓊若</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUAN, QIONGRUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王靜忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINGZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃晨宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於彎曲配施工具之銀可燒結黏著材料、其燒結產物、總成及用途。特定而言，本發明係關於一種銀可燒結黏著材料，其能夠在例如銅、金或銀之各種基板上穩定燒結，且具有優異空轉配施性能、良好燒結強度及電性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a silver sinterable bonding material for bended dispensing tool, the sintered product, the assembly and the use thereof. In particular, the present invention relates to a silver sinterable bonding material which is capable of being stably sintered on various substrates such as copper, gold or silver with excellent idling disperse performance, good sintering strength and electricity properties.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1542" publication-number="202631901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焊料助焊劑、焊料糊、及電子零件安裝基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08L93/04</main-classification>
        <further-classification edition="200601120260428B">C08J7/02</further-classification>
        <further-classification edition="202001120260428B">C08J7/04</further-classification>
        <further-classification edition="200601120260428B">B23K35/362</further-classification>
        <further-classification edition="202601120260428B">H05K3/34</further-classification>
        <further-classification edition="202601120260428B">H05K3/3489</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>境忠彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示實施形態之焊料助焊劑係一種包含以下物質之助焊劑：松香系樹脂；揮發性溶劑，其係使松香系樹脂溶解；及難揮發性液體，其在令乙酸正丁酯之蒸發速度為1時之蒸發速度為0.001以下；並且，難揮發性液體之含量相對於焊料助焊劑100質量份為5質量份以上且40質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1543" publication-number="202633212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>LED裝置及製造方法</chinese-title>
        <english-title>LED DEVICE AND METHOD OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10H20/00</main-classification>
        <further-classification edition="202501120260428B">H10H20/817</further-classification>
        <further-classification edition="202501120260428B">H10H20/825</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商普羅科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORO TECHNOLOGIES LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱彤彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, TONGTONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉穎俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YINGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALI, MUHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造LED裝置之方法包含以下步驟：提供一模板，該模板包含一III族-氮化物材料之第一多孔區域；在該模板上且在該第一多孔區域上方形成一第一LED結構；及在該模板上形成一第二LED結構，其中該第二LED結構不位在該第一多孔區域上方。一種LED裝置包含：一第LED結構，其在一III族-氮化物材料之第一多孔區域上面；及一第二LED結構，其不位在該第一多孔區域上面。在此亦提供一種三色LED裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing an LED device comprises the steps of: providing a template comprising a first porous region of III-nitride material; forming a first LED structure on the template above the first porous region; and forming a second LED structure on the template, in which the second LED structure is not positioned above the first porous region. An LED device comprises a first LED structure, over a first porous region of III-nitride material; and a second LED structure which is not positioned over the first porous region. A three colour LED device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接層</p>
        <p type="p">2:n摻雜層；n型層</p>
        <p type="p">3:發光區域</p>
        <p type="p">4:(未摻雜)覆蓋層</p>
        <p type="p">5:電子阻擋層(EBL)</p>
        <p type="p">6:第一p摻雜層</p>
        <p type="p">8:第二遮罩層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1544" publication-number="202632500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括記憶體晶粒的半導體封裝</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F11/08</main-classification>
        <further-classification edition="200601120260302B">G11C29/42</further-classification>
        <further-classification edition="200601120260302B">G06F13/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JOON YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">關於一種半導體封裝包括：第一資料記憶體晶粒，配置成共用第一控制匯流排和第一資料匯流排，第一資料記憶體晶粒屬於不同的秩；第一錯誤校正記憶體晶粒，配置成與第一資料記憶體晶粒共用第一控制匯流排並連接到第一錯誤校正匯流排；第二資料記憶體晶粒，配置成共用第二控制匯流排和第二資料匯流排，第二資料記憶體晶粒屬於不同的秩；以及第二錯誤校正記憶體晶粒，配置成與第二資料記憶體晶粒共用第二控制匯流排並連接到第二錯誤校正匯流排。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes first data memory dies configured to share a first control bus and a first data bus, the first data memory dies belonging to different ranks, a first error correction memory die configured to share the first control bus with the first data memory dies and connected to a first error correction bus, second data memory dies configured to share a second control bus and a second data bus, second data memory dies belonging to different ranks, and a second error correction memory die configured to share the second control bus with the second data memory dies and connected to the second error correction bus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">111-114:第一資料記憶體晶粒</p>
        <p type="p">116:第一錯誤校正記憶體晶粒</p>
        <p type="p">121-124:第二資料記憶體晶粒</p>
        <p type="p">126:第二錯誤校正記憶體晶粒</p>
        <p type="p">CONTROL_A:第一控制匯流排</p>
        <p type="p">CONTROL_B:第二控制匯流排</p>
        <p type="p">CS_A0-CS_A3:晶片選擇訊號</p>
        <p type="p">CS_B0-CS_B3:晶片選擇訊號</p>
        <p type="p">DATA_A:第一資料匯流排</p>
        <p type="p">DATA_B:第二資料匯流排</p>
        <p type="p">ECC_A:第一錯誤校正匯流排</p>
        <p type="p">ECC_B:第二錯誤校正匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1545" publication-number="202631552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141397</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機晶體、導光板及接目鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C15/00</main-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B6/00</further-classification>
        <further-classification edition="200601120260504B">G02B6/12</further-classification>
        <further-classification edition="200601120260504B">G02B25/00</further-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦啓吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種有機晶體，其係1種以上之芳香族化合物(A)與1種以上之芳香族化合物(B)之共晶(AB)、2種以上之上述芳香族化合物(B)之共晶(BB)、或1種上述芳香族化合物(B)之單晶(B)，且上述芳香族化合物(A)具有2個以上之芳香環，上述芳香環上未鍵結有拉電子基，上述芳香族化合物(B)具有1個以上之芳香環，上述芳香環上鍵結有拉電子基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1546" publication-number="202631750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有改質聚丙烯酸之陽極組成物</chinese-title>
        <english-title>ANODE COMPOSITIONS CONTAINING MODIFIED POLYACRYLIC ACIDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F220/06</main-classification>
        <further-classification edition="200601120260504B">C08F220/60</further-classification>
        <further-classification edition="200601120260504B">C08F8/32</further-classification>
        <further-classification edition="201001120260504B">H01M4/131</further-classification>
        <further-classification edition="201001120260504B">H01M4/133</further-classification>
        <further-classification edition="201001120260504B">H01M4/1391</further-classification>
        <further-classification edition="201001120260504B">H01M4/1393</further-classification>
        <further-classification edition="200601120260504B">H01M4/36</further-classification>
        <further-classification edition="201001120260504B">H01M4/48</further-classification>
        <further-classification edition="201001120260504B">H01M4/583</further-classification>
        <further-classification edition="200601120260504B">H01M4/62</further-classification>
        <further-classification edition="201001120260504B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉果</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, GUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱夢瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, MENGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接枝聚合物，其由至少以下組份a及組份b形成：  &lt;br/&gt;a)     至少一種聚丙烯酸(PAA)，且其中部分酸基可經至少一種金屬陽離子中和；及  &lt;br/&gt;b)    至少一種如本文所述之結構I之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A grafted polymer formed from at least the following components a and b: &lt;br/&gt;a) at least one polyacrylic acid (PAA), and where some of its acid groups may be neutralized with at least one metal cation; and &lt;br/&gt;b) at least one compound of Structure I as described herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1547" publication-number="202633036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H05K3/12</main-classification>
        <further-classification edition="200601120260423B">H05K3/10</further-classification>
        <further-classification edition="200601120260423B">C08L101/10</further-classification>
        <further-classification edition="200601120260423B">B05D1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江戶幸則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDO, YUKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供具備微細且薄型的絕緣層的電路基板之製造方法。  &lt;br/&gt;　　[解決手段]一種電路基板之製造方法，該電路基板之製造方法依序包含：通過使用噴射式點膠機將樹脂組成物排出至基材上而形成樹脂圖型之步驟、通過將所述樹脂圖型固化而形成絕緣圖型之步驟、利用電解鍍覆法在所述基材及所述絕緣圖型上形成導體層之步驟、以及通過除去所述導體層的一部分而形成導體圖型之步驟；所述樹脂組成物是包含熱固性樹脂、有機溶劑、無機填充材料及熱塑性樹脂的樹脂組成物；在將所述樹脂組成物中的全部成分設為100質量%的情況下，將有機溶劑的質量比例設為X(質量%)、將無機填充材料的質量比例設為Y(質量%)、並將熱塑性樹脂的質量比例設為Z(質量%)時，滿足X≥30且X/Y+X/Z＜10的關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1548" publication-number="202633081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141492</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種記憶元件及記憶元件的製造方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF MANUFACTURING A MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B41/20</main-classification>
        <further-classification edition="202301120260302B">H10B41/30</further-classification>
        <further-classification edition="202301120260302B">H10B41/40</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="200601120260302B">G11C7/18</further-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商武漢新芯集成電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹開瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, KAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種記憶元件及記憶元件的製造方法，包括：記憶陣列，記憶陣列包括複數個記憶單元，該複數個記憶單元被配置為具有複數行和複數列的陣列，每個記憶單元包括有襯底、設置在襯底的閘極結構、以及閘極結構在第一方向上兩側的源極和汲極；記憶陣列劃分的源引出區域設置有源接觸線，源接觸線連接在第一方向上分佈的複數個公共源極，每個公共源極連接第二方向上同一行的複數個源極；源極線設置在源接觸線上，源極線沿第二方向延伸並連接源接觸線，第一方向和第二方向彼此垂直。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device including a memory array and a method of manufacturing a memory device are provided. The memory array includes memory cells disposed in an array having multiple rows and multiple columns and a source line. Each memory cell includes a substrate, a gate structure in the substrate, a source, and a drain. The source and the drain are disposed on two sides of the gate structure along a first direction. The memory array defines a source lead-out region that includes a source contact line extending along the first direction. The source contact line is connected to common sources distributed along the first direction. Each common source is connected to the sources in a same row along a second direction perpendicular to the first direction. The source line is disposed on the source contact line, extends along the second direction, and is connected to the source contact line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:襯底</p>
        <p type="p">311:第一閘接觸結構</p>
        <p type="p">312:第二閘接觸結構</p>
        <p type="p">313:第三閘接觸結構</p>
        <p type="p">321:第一源接觸結構</p>
        <p type="p">322:源接觸線</p>
        <p type="p">330:汲接觸結構</p>
        <p type="p">400:公共源極</p>
        <p type="p">500:引出線</p>
        <p type="p">BL:位線</p>
        <p type="p">SL:源極線</p>
        <p type="p">WL:字線</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1549" publication-number="202631062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多種模式的烹飪器具</chinese-title>
        <english-title>COOKING APPLIANCE WITH MULTIPLE MODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260501B">A47J27/00</main-classification>
        <further-classification edition="200601120260501B">A47J27/082</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商鋼岩集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE STEELSTONE GROUP LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比蓋萊森　拿弗他利Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIEGELEISEN, NAPHTALI H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊茨科維茨　賓尤門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITZKOWITZ, BINYUMEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里德曼　梅萊奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRIEDMAN, MEILECH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃茨貝格爾　卡爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WERTZBERGER, KALMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德盧卡　羅賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LUCA, ROBYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德施　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEUTSCH, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種烹飪器具包括殼體，殼體內設有內烹飪腔；前殼體開口，用於進入內烹飪腔；頂部殼體開口。烹飪器具包括氣流通道，用於將空氣從內烹飪腔的第一位置引導至內烹飪腔內或相鄰的第二個位置；以及氣流產生器，用於在氣流通道內產生氣流。烹飪器具還包括殼體加熱元件，元件至少部分位於氣流通道內，使得從第一位置排出的空氣只有在經過殼體加熱元件後才能返回第二位置。在第一烹飪模式下，殼體透過前殼體開口打開，氣流產生器在氣流通道內產生氣流；在第二烹飪模式下，殼體透過頂部殼體開口打開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooking appliance has a housing enclosing an inner cooking chamber, a front housing opening providing access to the inner cooking chamber, and a top housing opening. The cooking appliance includes an airflow conduit for directing air from a first location within to a second location within or adjacent the inner cooking chamber and an airflow generator for generating airflow within the airflow conduit. The cooking appliance further includes a housing heating element at least partially within the airflow conduit such that air removed from the first location is returned to the second location only after passing the housing heating element. In a first cooking mode, the housing is opened by way of the front housing opening and the airflow generator generates airflow within the airflow conduit, and in a second cooking mode, the housing is opened by way of the top housing opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:烹飪器具</p>
        <p type="p">110:前殼體開口</p>
        <p type="p">120:頂部殼體開口</p>
        <p type="p">130:殼體</p>
        <p type="p">150:烹飪內膽</p>
        <p type="p">230:前壁</p>
        <p type="p">240:殼體蓋板</p>
        <p type="p">243:鉸鏈連接</p>
        <p type="p">247:手柄</p>
        <p type="p">255:樞轉連接</p>
        <p type="p">310:上層烤盤</p>
        <p type="p">400:烹飪內膽(下層烤盤)</p>
        <p type="p">420:插頭</p>
        <p type="p">430:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1550" publication-number="202632452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置及資訊處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260325B">G05B23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤方淳平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKATA, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細川大志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河島圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種僅藉由依時間序列記錄了機器之狀態量的運轉資料，即可適切分類機器之運轉模式的資訊處理裝置。本發明之資訊處理裝置2具備：診斷資料生成部203，是藉由對於依時間序列記錄了藉由設於診斷對象之機器（真空泵浦11）的檢測器量測依機器之運轉而變動之狀態量而得的量測結果之運轉資料，依據該運轉資料具有之特徵量在機器之運轉狀態轉變的轉變時刻進行分割，而生成診斷資料之診斷資料生成部203；及分類處理部204，是每個運轉模式計算成為藉由運轉模式群中包含之複數個運轉模式分類運轉狀態時的基準的複數個分類資料、與診斷資料間之相似度，並依據每個運轉模式之相似度對運轉模式群分類診斷資料的分類處理部204。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:資訊處理裝置</p>
        <p type="p">3:保全終端裝置</p>
        <p type="p">4:網路</p>
        <p type="p">11:真空泵浦</p>
        <p type="p">20:管理端控制部</p>
        <p type="p">21:管理端記憶部</p>
        <p type="p">22:管理端通信部</p>
        <p type="p">200:資料管理部</p>
        <p type="p">201:基準資料生成部</p>
        <p type="p">202:分類生成處理部</p>
        <p type="p">203:診斷資料生成部</p>
        <p type="p">204:分類處理部</p>
        <p type="p">205:診斷處理部</p>
        <p type="p">206:分類追加處理部</p>
        <p type="p">210:機器資料庫</p>
        <p type="p">211:資訊處理程式</p>
        <p type="p">D4:分類資料</p>
        <p type="p">D5:轉變概率行列資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1551" publication-number="202632697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高溫耐久性與低溫穩定性兼顧的電解電容器及其製造方法</chinese-title>
        <english-title>ELECTROLYTIC CAPACITOR HAVING BOTH HIGH-TEMPERATURE DURABILITY AND LOW-TEMPERATURE STABILITY, AND MANUFACTURING METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01G9/045</main-classification>
        <further-classification edition="200601120251201B">H01G9/055</further-classification>
        <further-classification edition="200601120251201B">H01G9/052</further-classification>
        <further-classification edition="200601120251201B">H01G9/042</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南通江海電容器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANTONG JIANGHAI CAPACITOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢友兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, YOUBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙雪飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHA, XUEFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景俊峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, JUNFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及電解電容器技術領域，具體涉及高溫耐久性與低溫穩定性兼顧的電解電容器及其製造方法，電容器包括芯子，所述芯子包括正極箔、負極箔以及設置在兩者之間的隔離件製成；以及包括含浸滲透所述芯子的電解液；所述電解液滿足如下指數關係曲線：η=A×e&lt;sup&gt;x&lt;/sup&gt;；A取值在1.378×10&lt;sup&gt;-5&lt;/sup&gt;~3.461×10&lt;sup&gt;-5&lt;/sup&gt;範圍內；x=B÷T，B取值在4298~5052的範圍內；其中η為電解液的粘度，單位為mPa·s；T為開爾文溫度，T的取值為248.15K~363.15K；e是自然對數的底數；本發明通過將滿足特定粘度與溫度關係的電解液與燒結箔或常規蝕刻箔結合，可得到兼顧高溫耐久性與低溫穩定性均較佳的電解電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an electrolytic capacitor having both high-temperature durability and low-temperature stability, and to a manufacturing method therefor.&lt;br/&gt; The capacitor comprises an element body including an anode foil, a cathode foil, and a separator disposed between the foils, and further comprises an electrolyte impregnating and permeating the element body.&lt;br/&gt; The electrolyte satisfies the following exponential relationship:&lt;br/&gt; η = A × eˣ,&lt;br/&gt; where A is in the range of 1.378×10⁻⁵ to 3.461×10⁻⁵, x = B ÷ T, and B is in the range of 4298 to 5052.&lt;br/&gt; η represents the viscosity of the electrolyte, expressed in mPa·s, and T represents the temperature in Kelvin, ranging from 248.15 K to 363.15 K. e denotes the base of the natural logarithm.&lt;br/&gt; By combining an electrolyte having the specified viscosity–temperature relationship with a sintered foil or a conventional etched foil, an electrolytic capacitor exhibiting excellent high-temperature endurance and low-temperature stability can be obtained.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1552" publication-number="202633310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗裝置和清洗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P70/00</main-classification>
        <further-classification edition="200601120260427B">B08B3/08</further-classification>
        <further-classification edition="200601120260427B">B08B3/02</further-classification>
        <further-classification edition="200601120260427B">B08B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧新平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, XINPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峰榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENGRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及半導體元件製造領域，具體為一種清洗裝置和清洗方法。清洗裝置用於清洗噴嘴和設於噴嘴外周的罩體，包括：清洗槽，用於貯存清洗液；第一進液管路，設置在所述清洗槽上，用於向所述清洗槽通入清洗液；至少一個連通管路，用於連通罩體內位於所述清洗液的液位上方的空間與所述清洗槽的外部，以將罩體內位於液位上方的空氣排至所述清洗槽的外部。本申請在罩體從開始接觸清洗液到下降至預設位置的過程中，通過連通管路將罩體內位於清洗液的液位上方的空氣排至清洗槽的外部，使得罩體能夠下降至預設位置，罩體位於預設位置時，罩體盡可能多的浸泡在清洗液中，從而實現清洗罩體與噴嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:清洗槽</p>
        <p type="p">102:第一進液管路</p>
        <p type="p">103:連通管路</p>
        <p type="p">104:控制器</p>
        <p type="p">105:溢流槽</p>
        <p type="p">108:第一吹氣管路</p>
        <p type="p">112:罩體</p>
        <p type="p">113:噴嘴</p>
        <p type="p">115:排液口</p>
        <p type="p">DIW:去離子水</p>
        <p type="p">DRAIN:排出</p>
        <p type="p">N&lt;sub&gt;2&lt;/sub&gt;:氮氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1553" publication-number="202633470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括凸塊的半導體封裝件</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE INCLUDING BUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W70/62</main-classification>
        <further-classification edition="202601120260424B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴完春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WAN CHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李效先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYO SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝件包括佈線結構、第一凸塊和半導體晶片。佈線結構包括第一電極並且具有第一表面和背對第一表面的第二表面。佈線結構的第二表面包括與第一電極重疊的凹陷區域。第一凸塊包括佈線結構的第一表面上的第一導電柱和第一導電柱上的第一焊料層。第一凸塊接觸第一電極。第一電極包括第一區段和第二區段。第一電極的第一區段設置在佈線結構的第一表面和佈線結構的第二表面之間。第一電極的第二區段具有包括在佈線結構的第一表面中的下表面。第一導電柱的水平寬度小於第一電極的水平寬度。半導體晶片設置在佈線結構的第二表面上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes a wiring structure, a first bump, and a semiconductor chip. The wiring structure includes a first electrode and has a first surface and a second surface that faces away from the first surface. The second surface of the wiring structure includes a recessed area that overlaps the first electrode. The first bump includes a first conductive pillar on the first surface of the wiring structure and a first solder layer on the first conductive pillar. The first bump contacts the first electrode. The first electrode includes a first section and a second section. The first section of the first electrode is disposed between the first surface of the wiring structure and the second surface of the wiring structure. The second section of the first electrode has a lower surface that is included in the first surface of the wiring structure. The horizontal width of the first conductive pillar is less than the horizontal width of the first electrode. A semiconductor chip is disposed above the second surface of the wiring structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:部分</p>
        <p type="p">21:佈線結構</p>
        <p type="p">21S1:第一表面</p>
        <p type="p">21S2:第二表面</p>
        <p type="p">21S2N:平坦區域</p>
        <p type="p">21S2R:凹陷區域</p>
        <p type="p">23:第一絕緣層</p>
        <p type="p">23H:第一開口</p>
        <p type="p">25:第二絕緣層</p>
        <p type="p">27:第三絕緣層</p>
        <p type="p">31:第一電極</p>
        <p type="p">31B:第一屏障層</p>
        <p type="p">31C:第一導電層</p>
        <p type="p">31R1:第一區段</p>
        <p type="p">31R2:第二區段</p>
        <p type="p">31S:第一晶種層</p>
        <p type="p">38:第一佈線</p>
        <p type="p">45:第二佈線</p>
        <p type="p">51:第二電極</p>
        <p type="p">53:第三電極</p>
        <p type="p">63:第一凸塊</p>
        <p type="p">64:第一焊料層</p>
        <p type="p">65:第一導電柱</p>
        <p type="p">65B:第二屏障層</p>
        <p type="p">65C:第二導電層</p>
        <p type="p">65S:第二晶種層</p>
        <p type="p">73:第二凸塊</p>
        <p type="p">74:第二焊料層</p>
        <p type="p">75:第二導電柱</p>
        <p type="p">83:第三凸塊</p>
        <p type="p">84:第三焊料層</p>
        <p type="p">85:第三導電柱</p>
        <p type="p">91:第一半導體晶圓</p>
        <p type="p">93:晶圓墊</p>
        <p type="p">95:底部填充膠</p>
        <p type="p">96:第一囊封劑</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
        <p type="p">W3:第三寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1554" publication-number="202632089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增強單晶碳化矽之製造</chinese-title>
        <english-title>ENHANCED MONOCRYSTALLINE SIC PRODUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C30B23/00</main-classification>
        <further-classification edition="200601120260504B">C30B23/02</further-classification>
        <further-classification edition="200601120260504B">C30B25/02</further-classification>
        <further-classification edition="200601120260504B">C30B25/20</further-classification>
        <further-classification edition="200601120260504B">C30B29/36</further-classification>
        <further-classification edition="200601120260504B">C03B35/00</further-classification>
        <further-classification edition="200601120260504B">C23C14/06</further-classification>
        <further-classification edition="200601120260504B">C23C14/24</further-classification>
        <further-classification edition="200601120260504B">C23C16/32</further-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="202601120260504B">H10P14/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商扎迪恩特科技簡易股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZADIENT TECHNOLOGIES SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽蘭　卡根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERAN, KAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞屈特　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTER, JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用於至少或精確地一個單晶SiC固體(20)，特別是晶圓之製造的方法。根據本發明的方法包含至少下列步驟：&lt;br/&gt;  提供一PVT反應器(100)，&lt;br/&gt;  其中該PVT反應器(100)包含一來源材料接收區段(118)；及&lt;br/&gt;  一SiC固體晶種，特別是SiC晶圓晶種抓持裝置(122)；&lt;br/&gt;  將SiC固體晶種(18)耦合至該SiC固體晶種抓持裝置(122)，其中該SiC固體晶種(18)具有至少10公分的直徑；&lt;br/&gt;  將該環形SiC來源材料複合體(120)放置在該來源材料接收區段(118)中；&lt;br/&gt;  其中該環形SiC來源材料複合體(120)係由一或多塊(140、142)的SiC來源材料形成；&lt;br/&gt;  藉由昇華該SiC來源材料複合體(120)來產生SiC氣體；&lt;br/&gt;  藉由讓該SiC氣體沉積到該SiC固體晶種(18)上來生長單晶SiC(20)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention refers to a method for the production of at least or exactly one monocrystalline SiC solid (20), in particular wafer. The method according to the present invention comprises at least the steps: &lt;br/&gt; Providing a PVT reactor (100), &lt;br/&gt; wherein the PVT reactor (100) comprises a source material receiving section (118) and &lt;br/&gt; a SiC seed solid, in particular SiC seed wafer, holding device (122),&lt;br/&gt; Coupling a SiC seed solid (18) to the SiC seed solid holding device (122), wherein the SiC seed solid (18) has a diameter of at least 10cm, &lt;br/&gt; Positioning of a ring-shaped SiC source material complex (120) in the source material receiving section (118),&lt;br/&gt; wherein the ring-shaped SiC source material complex (120) is formed by one or multiple pieces (140, 142) of SiC source material,&lt;br/&gt; Generating gaseous SiC by subliming the SiC source material complex (120), &lt;br/&gt; Growing monocrystalline SiC (20) by depositing the gaseous SiC onto the SiC seed solid (18).</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:晶圓晶種/固體晶種</p>
        <p type="p">20:生長晶體</p>
        <p type="p">120:環形來源材料複合體</p>
        <p type="p">124:底部加熱單元</p>
        <p type="p">125:側加熱單元</p>
        <p type="p">127:氣體導引板</p>
        <p type="p">150:均化裝置，特別是均化板</p>
        <p type="p">152:均化裝置的通孔</p>
        <p type="p">D1:SiC固體晶種的直徑</p>
        <p type="p">D2:重疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1555" publication-number="202632224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板彎曲測量與控制</chinese-title>
        <english-title>SUBSTRATE BOW MEASUREMENT AND CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G01B21/00</main-classification>
        <further-classification edition="202201120260424B">G01J5/02</further-classification>
        <further-classification edition="202601120260424B">H10P72/00</further-classification>
        <further-classification edition="200601120260424B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑切斯　艾莉卡德里昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ, ERICA DE LEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克薛恩海特　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRSCHENHEITER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪登納朵賈奇亞　馬里貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALDONADO-GARCIA, MARIBEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　作明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>督比　阿布希雪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例關於基板彎曲的測量與控制。例如，系統可能包括記憶體；及至少一個處理裝置，與記憶體操作性耦接，以啟動與基板有關的處理，獲取對應於基板上一或多個位置的熱輻射資料，基於熱輻射資料確定基板的彎曲量，並基於基板的彎曲量造成至少一個校正動作的執行。至少一個動作包括以下至少一個：使警報生成或使處理的至少一個處理參數改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to substrate bow measurement and control. For example, a system may include a memory, and at least one processing device, operatively coupled with the memory, to initiate a process with respect to a substrate, obtain thermal radiation data corresponding to one or more locations on the substrate, determine an amount of bow of the substrate based on the thermal radiation data, and cause at least one corrective action to be performed based on the amount of bow of the substrate. The least one action includes at least one of cause an alert to be generated, or cause at least one process parameter of the process to be changed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:設備/基板支撐組件</p>
        <p type="p">220:基板</p>
        <p type="p">400:系統</p>
        <p type="p">410:處理腔室</p>
        <p type="p">420-1:熱輻射檢測器</p>
        <p type="p">420-2:熱輻射檢測器</p>
        <p type="p">430:裝配板</p>
        <p type="p">440:旋轉馬達</p>
        <p type="p">460:彎曲監測系統</p>
        <p type="p">470-1:訊號</p>
        <p type="p">470-2:訊號</p>
        <p type="p">470-3:訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1556" publication-number="202632506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼ＵＴＰ傳送請求描述符中的雜湊指標的新穎方法</chinese-title>
        <english-title>NOVEL APPROACH TO ENCODE HASH POINTER IN UTP TRANSFER REQUEST DESCRIPTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">G06F12/0864</main-classification>
        <further-classification edition="200601120260504B">G06F13/42</further-classification>
        <further-classification edition="200601120260504B">G06F13/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈達爾　基沙萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALDAR, KISHALAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUONG, HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種通用快閃儲存(universal flash storage, UFS)主機控制器可存取UFS傳輸協定(UFS transport protocol, UTP)傳送請求，該UTP傳送請求包括雜湊指標(hash pointer, HP)指示符，該HP指示符指示與UTP傳送請求相關聯的HP在資料結構處編碼，其中HP指示與UTP傳送請求相關聯的一或多個雜湊值儲存的記憶體位置。UFS主機控制器可從資料結構讀取HP。UFS主機控制器可存取由HP指示的記憶體位置中的一或多個雜湊值。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a universal flash storage (UFS) host controller may access a UFS transport protocol (UTP) transfer request that includes a hash pointer (HP) indicator indicating that an HP associated with the UTP transfer request is encoded at a data structure, wherein the HP indicates a memory location where one or more hash values associated with the UTP transfer request are stored. The UFS host controller may read the HP from the data structure. The UFS host controller may access the one or more hash values in the memory location indicated by the HP. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:實例；UFS主機控制器介面</p>
        <p type="p">302:輸入/輸出(IO)記憶體暫存器空間</p>
        <p type="p">304:主機記憶體空間</p>
        <p type="p">306:記憶體映射暫存器</p>
        <p type="p">308,308-1~308-&lt;i&gt;N&lt;/i&gt;:UTRD</p>
        <p type="p">310,310-1~310-&lt;i&gt;N&lt;/i&gt;:UCD</p>
        <p type="p">312,312-1,312-&lt;i&gt;N&lt;/i&gt;:資料緩衝器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1557" publication-number="202632059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種半導體製程設備</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/455</main-classification>
        <further-classification edition="200601120260302B">C23C16/46</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
        <further-classification edition="200601120260302B">G02B5/04</further-classification>
        <further-classification edition="200601120260302B">G05B19/404</further-classification>
        <further-classification edition="200601120260302B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝雲鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, YUN PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEN TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛夢凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, MENG FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周子光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZI GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種半導體製程設備，包括反應腔體；用於支撐晶圓的晶圓承載裝置，其設置在反應腔體內；加熱組件，包括至少兩個下加熱元件組，下加熱元件組設置在晶圓承載裝置下方並沿晶圓承載裝置的徑向分佈，每個下加熱元件組均包括沿晶圓承載裝置周向均勻分佈的多個下加熱元件，不同的下加熱元件組對晶圓承載裝置的不同目標加熱區進行加熱；測溫裝置，包括至少兩個下分區測溫組，一一對應於至少兩個下加熱元件組，用於測量其所對應的下加熱元件組的目標加熱區的溫度。本申請藉由至少兩個下分區測溫組，能提高腔內溫度控制穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a semiconductor processing apparatus, including: a reaction chamber; a wafer support device for supporting a wafer, which is disposed within the reaction chamber; a heating assembly, including at least two lower heating element groups, wherein the lower heating element groups are arranged below the wafer support device and distributed radially along the wafer support device, each lower heating element group including a plurality of lower heating elements that are evenly distributed circumferentially along the wafer support device, and different lower heating element groups heat different target heating zones of the wafer support device; and a temperature measurement device, including at least two lower partitioned temperature measurement groups, each corresponding one-to-one to at least two lower heating element groups, for measuring the temperature of the target heating zone corresponding to its respective lower heating element group. Through the use of at least two lower partitioned temperature measurement groups, the apparatus is able to improve the stability of temperature control within the chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:上反光元件槽</p>
        <p type="p">102:上加熱燈</p>
        <p type="p">103:上區測溫件</p>
        <p type="p">104:下測溫元件</p>
        <p type="p">105:下反光元件槽</p>
        <p type="p">106:下加熱燈</p>
        <p type="p">107:晶圓升降軸</p>
        <p type="p">108:旋轉軸</p>
        <p type="p">109:晶圓升降支撐銷</p>
        <p type="p">110:上法蘭</p>
        <p type="p">111:反應腔體本體</p>
        <p type="p">112:下法蘭</p>
        <p type="p">113:排氣通路</p>
        <p type="p">114:反應下腔體</p>
        <p type="p">115:進氣通路</p>
        <p type="p">116:腔室隔離環</p>
        <p type="p">117:反應上腔體</p>
        <p type="p">118:晶圓承載裝置</p>
        <p type="p">119:預熱環</p>
        <p type="p">120:雙重密封圈</p>
        <p type="p">121:氣體注入口</p>
        <p type="p">122:光學折射元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1558" publication-number="202631296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141684</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焊接連接部，及具備該焊接連接部的氨槽</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260323B">B23K31/00</main-classification>
        <further-classification edition="200601120260323B">B23K35/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼杵博一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUKI, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萱森陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAYAMORI, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大川鉄平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAWA, TEPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開之焊接連接部(1)具備：由鋼所構成之母材部(10)，及由鋼所構成之焊接金屬(20)。於母材部(10)之焊接熱影響部(11)之表層中，於-33℃下之夏比衝擊試驗所得到之吸收能量為50J以上。於焊接熱影響部(11)之止端部附近區域中，自表面朝焊接熱影響部(11)之厚度方向0.5mm深度位置處之最大維氏硬度H&lt;sub&gt;Hmax&lt;/sub&gt;為300HV1以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:焊接連接部</p>
        <p type="p">10:母材部</p>
        <p type="p">20:焊接金屬</p>
        <p type="p">II-II:剖面線段</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1559" publication-number="202631735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改質氫化苯乙烯系彈性體之製造方法、改質氫化苯乙烯系彈性體及樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F8/30</main-classification>
        <further-classification edition="200601120260504B">C08L53/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/3415</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森和彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本高士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗本茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIMOTO, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示有關一種改質氫化苯乙烯系彈性體之製造方法，其具備如下步驟：使（a1）氫化苯乙烯系彈性體、（a2）具有自由基反應性的碳-碳雙鍵之化合物及自由基產生劑在50℃以上且小於90℃的溫度下發生反應，以獲得具有碳-碳雙鍵之化合物被接枝到氫化苯乙烯系彈性體上的改質氫化苯乙烯系彈性體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1560" publication-number="202631946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C09J163/02</main-classification>
        <further-classification edition="200601120260420B">C09J163/04</further-classification>
        <further-classification edition="200601120260420B">C08G59/00</further-classification>
        <further-classification edition="200601120260420B">C09J11/04</further-classification>
        <further-classification edition="201801120260420B">C09J7/22</further-classification>
        <further-classification edition="202601120260420B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大沼悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONUMA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAE, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口紘平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種含有導熱性粒子、環氧樹脂及酚醛樹脂之膜狀接著劑。在一實施形態中，酚醛樹脂包含羥基當量為185g/eq以上之酚醛樹脂。在一實施形態中，酚醛樹脂包含具有聯苯骨架之酚醛樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:膜狀接著劑</p>
        <p type="p">20:支撐膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1561" publication-number="202631511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物薄膜的形成方法</chinese-title>
        <english-title>METHOD FOR FORMING METAL OXIDE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C01G9/02</main-classification>
        <further-classification edition="202301120260504B">C02F1/28</further-classification>
        <further-classification edition="200601320260504B">C02F101/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商上村工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C. UYEMURA &amp; CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本久光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, HISAMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山智晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMEDA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田伸一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本莞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KANJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種金屬氧化物薄膜的形成方法，其能夠延長用於形成金屬氧化物薄膜的鍍覆液的壽命，進而能夠高效地使用鍍覆液。金屬氧化物薄膜的形成方法包括：藉由包含形成薄膜的金屬化合物及作為還原劑的硼化合物的鍍覆液，於鍍覆對象的表面形成金屬氧化物薄膜的製程；以及藉由吸附硼酸的吸附過濾器對鍍覆液進行再生的製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide a method for forming a metal oxide film, which is capable of extending the life span of a plating solution used in formation of metal oxide film, and thereby the plating solution can be used efficiently. The method for forming a metal oxide film comprises: a process for forming a metal oxide film on the surface of a substrate by using a plating solution comprising a compound of the metal for forming coating film and a compound of boron serving as a reducant; and a process for regenerating the plating solution by using an adsorption filter that adsorbs boric acid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鍍覆裝置</p>
        <p type="p">101:鍍覆槽</p>
        <p type="p">102:循環回路</p>
        <p type="p">104:鍍覆液</p>
        <p type="p">106:鍍覆對象</p>
        <p type="p">121:循環泵</p>
        <p type="p">122:第一過濾器</p>
        <p type="p">123:第二過濾器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1562" publication-number="202631837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附著有上漿劑之碳纖維束及其製造方法、碳纖維強化複合材料暨壓力容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08J5/06</main-classification>
        <further-classification edition="200601120260428B">C08J5/24</further-classification>
        <further-classification edition="200601120260428B">D06M15/273</further-classification>
        <further-classification edition="200601120260428B">D06M15/55</further-classification>
        <further-classification edition="200601120260428B">D06M13/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四方孝幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOMO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, FUMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永松大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMATSU, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的附著有上漿劑之碳纖維束，係為使碳纖維束的形態穩定性、耐摩擦性及樹脂對碳纖維束的含浸性良好，而為經賦予上漿劑、絲支數係6,000支以上且50,000支以下的碳纖維束，厚度係0.10mm以上且0.20mm以下，且厚度的變動係數在6.5%以下，垂墜值係6cm以上且9cm以下，使用以下樹脂處方A，根據JIS R7608(2007)評價的股條拉伸強度(股條拉伸強度A')係4.9GPa以上且6.7GPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:碳纖維束</p>
        <p type="p">4:水平平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1563" publication-number="202632078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浴室淨化方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C25B1/16</main-classification>
        <further-classification edition="202601120260430B">A61L2/18</further-classification>
        <further-classification edition="200601120260430B">A47K17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林智裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田真司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">浴室淨化方法係一種使用次氯酸氣體供給裝置(30)之方法。前述浴室淨化方法具備以下工序：水附著工序(步驟S11)，其係使水附著於浴室(1)之至少壁面(2)；次氯酸氣體生成工序(步驟S12)，其係在次氯酸氣體供給裝置(30)內生成次氯酸氣體；次氯酸氣體供給工序(步驟S13)，其係將包含次氯酸氣體之空氣供給至浴室(1)內；以及，淨化工序(步驟S14)，其係在浴室(1)內已供給有包含次氯酸氣體之空氣之狀態下維持預定時間，使次氯酸氣體溶入附著於壁面(2)之水，藉此進行浴室之淨化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11,S12,S13,S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1564" publication-number="202633366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板保持裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260401B">H10P72/70</main-classification>
        <further-classification edition="202601120260401B">H10P72/76</further-classification>
        <further-classification edition="202601120260401B">H10P72/78</further-classification>
        <further-classification edition="202601120260401B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東實先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASMIT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種於無法由吸附部吸附基板之外周部之下表面之情形時，可不接觸基板之中央部而保持基板之基板保持裝置。  &lt;br/&gt;本揭示之基板保持裝置1具備：吸附部10，其吸附基板W之外周部We之下表面Wb；側夾具20，其以於複數個部位自外周側向內周側按壓基板W之外周緣We1之方式進行固持；及控制器90，其控制側夾具20。控制器90執行：第1保持模式M1，其使吸附部10產生負壓P，而藉由吸附部10吸附基板W之外周部We之下表面Wb；及第2保持模式M2，其於吸附部10產生之負壓P小於規定值Ps時，藉由側夾具20，以於複數個部位自外周側向內周側按壓基板W之外周緣We1之方式進行固持。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板保持裝置</p>
        <p type="p">2:台</p>
        <p type="p">2a:載置面</p>
        <p type="p">2b:孔</p>
        <p type="p">10:吸附槽(吸附部)</p>
        <p type="p">20:側夾具</p>
        <p type="p">21:第1夾具</p>
        <p type="p">22:第2夾具</p>
        <p type="p">23:固定具</p>
        <p type="p">24:旋轉體</p>
        <p type="p">31:第1致動器</p>
        <p type="p">36:第2致動器</p>
        <p type="p">60:輔助吸附台(輔助吸附部)</p>
        <p type="p">61:輔助載置面</p>
        <p type="p">70:提升銷</p>
        <p type="p">A:空氣(氣體)</p>
        <p type="p">Q:壓力</p>
        <p type="p">W:基板</p>
        <p type="p">Wa:上表面</p>
        <p type="p">Wb:下表面</p>
        <p type="p">Wc:中央部</p>
        <p type="p">Wd:筆直部</p>
        <p type="p">We:外周部</p>
        <p type="p">We1:外周緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1565" publication-number="202632707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>繼電器及繼電器之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01H50/04</main-classification>
        <further-classification edition="200601120260423B">H01H50/30</further-classification>
        <further-classification edition="200601120260423B">H01H50/64</further-classification>
        <further-classification edition="200601120260423B">H01H50/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富常隆電子零件有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FCL COMPONENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原詩織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, SHIORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村越拓治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKOSHI, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅谷雄士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAYA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春原崇喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNOHARA, TAKAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種容易組裝且可進行穩定之動作之繼電器及其製造方法。本發明之繼電器包含：基塊，其具有固定接點；卡，其具有與固定接點對向之可動接點，能夠相對於基塊沿x方向變位地安裝；電磁鐵，其固定於基塊，包含具有與z方向平行之軸向之鐵芯；及致動器，其可旋轉地受基塊支持，藉由電磁鐵之作用而驅動卡。卡具有第1壁部，該第1壁部可沿y方向彈性變形，且包含鉤，鉤卡合於基塊中形成之第1突部，使卡不相對於基塊沿z方向變位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:繼電器</p>
        <p type="p">12:基座配件</p>
        <p type="p">14:卡配件</p>
        <p type="p">16:電磁鐵</p>
        <p type="p">18:致動器</p>
        <p type="p">20:外殼</p>
        <p type="p">22:基塊</p>
        <p type="p">26a,26b:固定端子</p>
        <p type="p">28a,28b:固定接點</p>
        <p type="p">30:卡</p>
        <p type="p">32a:可動接點</p>
        <p type="p">40:線圈</p>
        <p type="p">50,52:軛</p>
        <p type="p">54:線圈端子</p>
        <p type="p">56:致動器基座</p>
        <p type="p">58:軸承孔</p>
        <p type="p">60:旋轉軸部/軸部</p>
        <p type="p">68:第1壁部</p>
        <p type="p">70:鉤</p>
        <p type="p">74:第1突部/肋</p>
        <p type="p">76:臂</p>
        <p type="p">78:凹部</p>
        <p type="p">80:第2突部/肋/肋狀突部</p>
        <p type="p">82:第2壁部/壁部</p>
        <p type="p">84:狹槽</p>
        <p type="p">88:卡合部</p>
        <p type="p">x,y,z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1566" publication-number="202631777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高回彈發泡體之熱塑性聚胺甲酸酯組成物</chinese-title>
        <english-title>THERMOPLASTIC POLYURETHANE COMPOSITION FOR HIGH REBOUND FOAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/32</main-classification>
        <further-classification edition="200601120260504B">C08G18/48</further-classification>
        <further-classification edition="200601120260504B">C08G18/62</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C08L75/04</further-classification>
        <further-classification edition="200601120260504B">C08J9/12</further-classification>
        <further-classification edition="200601320260504B">C08G101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商盧伯利索先進材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBRIZOL ADVANCED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索路奇　瓦哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLOUKI, VAHAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛靜恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, RUBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　安吉莉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, ANGELINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種組成物，其包括微孔發泡體，該微孔發泡體包括熱塑性聚胺甲酸酯共聚物，該熱塑性聚胺甲酸酯共聚物包括以下反應物之反應產物：(a)至少一種二異氰酸酯；(b)至少一種鏈延長劑；以及(c)包含至少一種聚醚多元醇及至少一種聚烯烴多元醇之多元醇摻合物；其中以該多元醇摻合物之總重量計，該至少一種聚烯烴多元醇佔該多元醇摻合物之自10至40重量百分比；其中以該熱塑性聚胺甲酸酯共聚物之總重量計，該至少一種聚烯烴多元醇以自5至25重量百分比的量存在於該熱塑性聚胺甲酸酯共聚物中；且其中以該熱塑性聚胺甲酸酯共聚物之總重量計，該熱塑性聚胺甲酸酯共聚物具有自25至45重量百分比的硬區段含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a composition including a microcellular foam including a thermoplastic polyurethane copolymer including a reaction product of the following reactants: (a) at least one diisocyanate; (b) at least one chain extender; and (c) a polyol blend comprising at least one polyether polyol and at least one polyolefin polyol; wherein the at least one polyolefin polyol makes up from 10 to 40 weight percent of the polyol blend, based on the total weight of the polyol blend; wherein the at least one polyolefin polyol is present in the thermoplastic polyurethane copolymer in an amount of from 5 to 25 weight percent, based on the total weight of the thermoplastic polyurethane copolymer; and wherein the thermoplastic polyurethane copolymer has a hard segment content of from 25 to 45 weight percent, based on the total weight of the thermoplastic polyurethane copolymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1567" publication-number="202632495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用量子啟發壓縮模型在硬體系統中做出決策的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DECISION-MAKING IN HARDWARE SYSTEMS USING QUANTUM-INSPIRED COMPRESSED MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G06F9/22</main-classification>
        <further-classification edition="202301120260504B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧魯斯　羅馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈羅米　賽伊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHROMI, SAEED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　蘇赫賓德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SUKHBINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於判定用於一離線硬體系統之一決策的各種方法及系統，該離線硬體系統包括至少一個系統處理器、感測器及至少一個專用硬體處理器。該方法涉及：在該至少一個系統處理器處自這些感測器接收感測器資料；在該至少一個系統處理器處對該感測器資料進行預處理以獲得經預處理之感測器資料；在該至少一個專用硬體處理器處，使用一或多個經訓練之決策做出模型，基於該經預處理之感測器資料而判定用於該離線硬體系統之該決策；及基於該決策而產生用於該硬體系統之一命令。該一或多個決策做出模型中之各者係使用張量網路壓縮之一大型語言模型（LLM）。該離線硬體系統可為系統或裝置之一組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various methods and systems for determining a decision for an offline hardware system that includes at least one system processor, sensors and at least one specialized hardware processor are described herein. The method involves receiving, at the at least one system processor, sensor data from the sensors, preprocessing, at the at least one system processor, the sensor data to obtain preprocessed sensor data; determining, at the at least one specialized hardware processor, using one or more trained decision-making models the decision for the offline hardware system based on the preprocessed sensor data and generating a command for the hardware system based on the decision. Each of the one or more decision-making models is a large language model (LLM) compressed using tensor networks. The offline hardware system can be a component of systems or devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方塊圖</p>
        <p type="p">110:硬體系統</p>
        <p type="p">112:硬體裝載組件</p>
        <p type="p">114:專用硬體處理器</p>
        <p type="p">116:系統處理器</p>
        <p type="p">118:感測器</p>
        <p type="p">120:方塊圖</p>
        <p type="p">122:資料預處理模組</p>
        <p type="p">124:工業應用模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1568" publication-number="202632746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及蝕刻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H01J37/32</main-classification>
        <further-classification edition="200601120260428B">H05H1/46</further-classification>
        <further-classification edition="200601120260428B">H05H1/36</further-classification>
        <further-classification edition="200601120260428B">H05H1/24</further-classification>
        <further-classification edition="202601120260428B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤悠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>直井護</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAOI, MAMORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千葉祐毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIBA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永岩利文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAIWA, TOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種促進自由基輸送以形成較佳之蝕刻形狀之電漿處理裝置及蝕刻方法。  &lt;br/&gt;本發明之電漿處理裝置具備：電漿處理腔室；基板支持部，其設置於上述電漿處理腔室內，且支持基板；氣體供給部，其向上述電漿處理腔室供給蝕刻氣體；下部電極，其設置於上述基板支持部；上部電極，其與上述下部電極對向；源電源，其向上述上部電極或上述下部電極供給用以產生電漿之源RF信號；第1偏壓電源，其向上述下部電極供給第1偏壓信號；第2偏壓電源，其向上述下部電極供給第2偏壓信號；及控制部；上述控制部對以下工序進行控制：(a)控制上述源電源以向上述上部電極或上述下部電極供給第1功率位準之上述源RF信號；(b)以重複工序(b1)與工序(b2)之方式進行控制，(b1)控制上述源電源以向上述上部電極或上述下部電極供給第2功率位準之上述源RF信號，(b2)控制上述源電源以向上述上部電極或上述下部電極供給第3功率位準之上述源RF信號並且控制上述第1偏壓電源以向上述下部電極供給上述第1偏壓信號；(c)控制上述第2偏壓電源以向上述下部電極供給上述第2偏壓信號；以及將上述工序(a)、上述工序(b)、上述工序(c)作為1個週期，以重複上述週期之方式進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">L1:第1功率位準</p>
        <p type="p">L2:第2功率位準</p>
        <p type="p">L3:第3功率位準</p>
        <p type="p">L4:第4功率位準</p>
        <p type="p">P1:第1製程</p>
        <p type="p">P2:第2製程</p>
        <p type="p">P3:第3製程</p>
        <p type="p">P21,P22:製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1569" publication-number="202632157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種將鉸接門及窗固定在牆壁開口的方法、一種用於該方法的鉸鏈和螺釘的組合以及一種用於該組合的螺釘</chinese-title>
        <english-title>A METHOD OF FASTENING HINGED DOORS AND WINDOWS IN WALL OPENINGS, A COMBINATION OF A HINGE AND SCREW FOR SUCH METHOD, AND A SCREW FOR SUCH COMBINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">F16B25/00</main-classification>
        <further-classification edition="200601120260427B">E05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商迪星公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DISSING A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪星　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DISSING, CLAUS HORNSTRUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鉸鏈(1)及螺釘(14)之組合係用於將門或窗安裝在牆壁開口中。該鉸鏈(1)之第一葉板(1A)被固定至該門或窗之邊框(23)且僅包括相同圓錐螺釘孔(3A)，分佈在該第一葉板(1A)上的不同位置處。除了用於將該鉸鏈(1)固定至該邊框(23)的較小螺釘外，提供具有頭部(15)之較大螺釘(14)，該頭部(15)具有匹配該螺釘孔(3A)之圓錐底側(32)。該螺釘(15)具有從該鉸鏈(1)延伸穿過該邊框(23)且進入至該牆壁(20)中之夠長的長度(L)及環繞且沿著該螺釘(14)之螺桿(19)具有4至6 mm之螺距(P)的螺紋(16)，且各螺釘孔(3A)在該螺釘孔(3A)之外緣處具有不超過該螺距(P)之50%的材料厚度(T)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A combination of a hinge (1) and a screw (14) is used for mounting a door or window in a wall opening. A first leaf (1A) of the hinge (1) is fastened to the frame (23) of the door or window and comprises only identical conical screw holes (3A), distributed at different positions over the first leaf (1A). In addition to smaller screws that are used to fix the hinge (1) to the frame (23), a larger screw (14) is provided having a head (15) with a conical underside (32) matching the screw holes (3A). The screw (15) has a length L long enough to extend from the hinge (1) through the frame (23) and into the wall (20) and a thread (16) around and along a stem (19) of the screw (14) with a pitch P of 4-6 mm, and each screw hole (3A) has a thickness T of the material at a rim of the screw hole (3A) of no more than 50% of the pitch P.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:螺釘</p>
        <p type="p">15:頭部</p>
        <p type="p">16:螺紋</p>
        <p type="p">17:尖梢</p>
        <p type="p">18:空間</p>
        <p type="p">19:螺桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1570" publication-number="202631387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層片、肌膚圖樣片及肌膚圖樣片之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B32B27/00</main-classification>
        <further-classification edition="200601120260428B">B32B27/08</further-classification>
        <further-classification edition="200601120260428B">B32B5/00</further-classification>
        <further-classification edition="201901120260428B">B32B7/04</further-classification>
        <further-classification edition="201901120260428B">B32B7/08</further-classification>
        <further-classification edition="200601120260428B">B32B33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今倉柚子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAKURA, YUZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木明日香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, ASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小市千紗代</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOICHI, CHISAYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大泉知久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OIZUMI, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種積層片，其貼附於肌膚後之外觀看起來自然，並且可作為肌膚圖樣片來使用。一種積層片，具備黏著層與至少包含基材層之樹脂層；於前述樹脂層之一表面將可見光線相對於該樹脂層之法線方向以-45°入射，使用測角光度計從前述表面側測出之受光角度0°下之反射強度I&lt;sub&gt;0&lt;/sub&gt;°與受光角度45°下之反射強度I&lt;sub&gt;45&lt;/sub&gt;°之比值(I&lt;sub&gt;0&lt;/sub&gt;°/I&lt;sub&gt;45&lt;/sub&gt;°)為0.6以上且1.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:積層片</p>
        <p type="p">10:剝離片</p>
        <p type="p">20:黏著層</p>
        <p type="p">30:樹脂層</p>
        <p type="p">31:基材層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1571" publication-number="202631123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>西松烷二萜類化合物用於製備預防或治療發炎小體介導發炎性疾病之藥物的用途</chinese-title>
        <english-title>USE OF CEMBRANE-TYPE DITERPENE COMPOUNDS IN THE PREPARATION OF MEDICAMENT FOR PREVENTING OR TREATING INFLAMMASOME MEDIATED INFLAMMATORY DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/366</main-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚學校財團法人長庚科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聰龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, TSONG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>許志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, JYH-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祐嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宜盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, I-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種西松烷二萜類化合物用於製備預防或治療發炎小體介導發炎性疾病之藥物的用途，其中該西松烷二萜類化合物係分離自&lt;i&gt;Sinularia flexibilis&lt;/i&gt;軟珊瑚或&lt;i&gt;Sinularia manaarensis&lt;/i&gt;軟珊瑚，且其中該西松烷二萜類化合物為西松烷二萜內酯(cembranolide)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A use of cembrane-type diterpene compound for manufacture of drug for preventing or treating inflammasome-mediated inflammatory disorders, the cembrane-type diterpene is isolated from soft coral &lt;i&gt;Sinularia flexibilis&lt;/i&gt; or &lt;i&gt;Sinularia manaarensis&lt;/i&gt;, and the cembrane-type diterpene is cembranolide.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1572" publication-number="202632644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
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        <document-id>
          <doc-number>202632644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預測多通道訊號之設備、方法、電腦程式、編碼表示型態及資料串流</chinese-title>
        <english-title>APPARATUSES, METHODS, COMPUTER PROGRAMS, ENCODED REPRESENTATIONS AND DATA STREAMS FOR PREDICTING A MULTI-CHANNEL SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260504B">G10L19/008</main-classification>
        <further-classification edition="201301120260504B">G10L19/04</further-classification>
        <further-classification edition="201401120260504B">H04N19/51</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克曲后弗　辛納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRCHHOFFER, HEINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮恩特卡　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIENTKA, SOPHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫姆瑞區　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELMRICH, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路達特　克里斯汀</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>RUDAT, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾曼　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERRMANN, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔柏納克　班儂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STABERNACK, BENNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          <inventor app-type="applicant" sequence="7">
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              <chinese-name name-type="organization">
                <last-name>帕雅夫　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFF, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
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          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施例包含一種用於基於一編碼表示型態而獲得一經解碼多通道訊號之設備，其中該設備經組配以取決於一第一其他通道之複數個先前經解碼值而獲得一當前通道訊號的複數個預測值。  &lt;br/&gt;此外，實施例包含用於獲得一編碼表示型態之各別設備、方法、電腦程式、編碼表示型態以及資料串流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments comprise an apparatus for obtaining a decoded multi-channel signal on the basis of an encoded representation, wherein the apparatus is configured to obtain a plurality of prediction values for a current channel signal in dependence on a plurality of previously decoded values of a first other channel. &lt;br/&gt;Furthermore, embodiments comprise respective apparatuses for obtaining an encoded representation, methods, computer programs, encoded representations and data streams.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備，解碼器</p>
        <p type="p">101:編碼表示型態</p>
        <p type="p">102:經解碼訊號</p>
        <p type="p">110:解碼單元</p>
        <p type="p">111:資訊，關於先前經解碼樣本值之資訊</p>
        <p type="p">120:預測值判定單元</p>
        <p type="p">121:預測資訊，資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1573" publication-number="202631633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜芳基大環化合物及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D498/22</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/439</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/4985</further-classification>
        <further-classification edition="200601120260504B">A61K31/5386</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P9/10</further-classification>
        <further-classification edition="200601120260504B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京鞍石生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING AVISTONE BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石和鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, HEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張培龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PEILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祥秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIANGQIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭文麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, WENLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種雜芳基大環化合物、其製備方法、含有該類化合物的藥物組合物以及做為治療劑的用途，其中，雜芳基大環化合物的結構如式I所示：&lt;br/&gt;&lt;img align="absmiddle" height="180px" width="190px" file="ed11678.JPG" alt="ed11678.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;  其中A、E、M、L&lt;sub&gt;1&lt;/sub&gt;、L&lt;sub&gt;2&lt;/sub&gt;、X&lt;sub&gt;1&lt;/sub&gt;、X&lt;sub&gt;2&lt;/sub&gt;和X&lt;sub&gt;3&lt;/sub&gt;的定義如說明書所述。該雜芳基大環化合物對表皮生長因子受體（EGFR）具有良好的抑制作用，可以用於EGFR異常誘導的相關疾病治療，尤其是癌症疾病方面的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1574" publication-number="202632637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示驅動裝置及影像補償方法</chinese-title>
        <english-title>DISPLAY DRIVING DEVICE AND IMAGE COMPENSATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G09G3/36</main-classification>
        <further-classification edition="200601120260129B">G09G5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳福星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示驅動裝置及影像補償方法。顯示驅動裝置包括累加模組、計算模組以及補償模組。累加模組累加多個正極性像素的第一灰階累加值以及多個負極性像素的第二灰階累加值。計算模組計算第一灰階累加值以及第二灰階累加值的歸一化差值，並根據與歸一化差值對應的權重值調整第一偏移值以及第二偏移值，以產生調整後的第一偏移值以及第二偏移值。補償模組根據調整後的第一個偏移值以及調整後的第二個偏移值對多個目標補償像素進行補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driving device and an image compensation method are provided. The display driving device includes an accumulation module, a calculation module, and a compensation module. The accumulation module accumulates a first gray level accumulation value of a plurality of positive polarity pixels and a second gray level accumulation value of a plurality of negative polarity pixels. The calculation module calculates a normalized difference value of the first gray level accumulation value and the second gray level accumulation value, and adjusts a first offset value and a second offset value according to a weight value corresponding to the normalized difference value to generate an adjusted first offset value and an adjusted second offset value. The compensation module compensates a plurality of target compensation pixels according to the adjusted first offset value and the adjusted second offset value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S340:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1575" publication-number="202631746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸放溼性構件及使用該吸放溼性構件之製品</chinese-title>
        <english-title>MOISTURE ABSORPTIVE-AND-DESORPTIVE MEMBER AND PRODUCT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/14</main-classification>
        <further-classification edition="200601120260504B">C08F212/36</further-classification>
        <further-classification edition="200601120260504B">C08F220/06</further-classification>
        <further-classification edition="200601120260504B">C08F220/14</further-classification>
        <further-classification edition="200601120260504B">C08F220/44</further-classification>
        <further-classification edition="200601120260504B">C08F8/12</further-classification>
        <further-classification edition="200601120260504B">C09D133/20</further-classification>
        <further-classification edition="201801120260504B">C09D7/65</further-classification>
        <further-classification edition="200601120260504B">B01J20/26</further-classification>
        <further-classification edition="200601120260504B">B01J20/28</further-classification>
        <further-classification edition="200601120260504B">B01J20/32</further-classification>
        <further-classification edition="200601120260504B">D21H19/20</further-classification>
        <further-classification edition="200601120260504B">D21H19/24</further-classification>
        <further-classification edition="200601120260504B">D21H21/22</further-classification>
        <further-classification edition="200601120260504B">D21H23/52</further-classification>
        <further-classification edition="200601120260504B">B01D53/04</further-classification>
        <further-classification edition="200601120260504B">B01D53/26</further-classification>
        <further-classification edition="200601120260504B">B01D53/28</further-classification>
        <further-classification edition="200601120260504B">F24F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本ＥＸＬＡＮ工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN EXLAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種吸放溼性構件，其為在基材上載持吸放溼性聚合物而形成且可利用來做為除去空氣中之水分的有效手段。該吸放溼性構件雖然有時會為了增大表面積並提高吸放溼性而實施褶襉加工(pleating processing)的情況，然而，在吸放溼性構件之透氣度高的情況下，卻時常會有褶襉形狀產生扭曲變形的情況。為解決上述之課題，本發明提供一種吸放溼性構件，特徵在於：其為在ISO透氣度200～1000 μm／（Pa・sec)的基材紙上塗敷30～70g／m&lt;sup&gt;2&lt;/sup&gt;的塗敷液而形成，其中該塗敷液為由含有上吸放溼性聚合物及結合劑(binder)所構成；塗敷後之ISO透氣度為小於200 μm／（Pa・sec)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to a moisture absorptive-and-desorptive member capable of effectively removing moisture from air, comprising a substrate having a moisture absorptive-and-desorptive polymer disposed thereon. The moisture absorptive-and-desorptive member may sometimes be subjected to a pleating processing in order to increase surface area and improve moisture absorptive-and-desorptive properties. However, when the member has high air permeability, the pleats are often deformed or distorted. As a solution to the problems, the present invention provides a moisture absorptive-and-desorptive member comprising a base paper having an ISO air permeability of 200 to 1,000 μm/(Pa·sec), coated with a coating liquid comprising a moisture absorptive-and-desorptive polymer and a binder at a coating amount of 30 to 70 g/m², wherein the ISO air permeability of the member after coating is less than 200 μm/(Pa·sec).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸放溼性構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1576" publication-number="202631337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訂書機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">B25C5/10</main-classification>
        <further-classification edition="200601120260331B">B25C5/15</further-classification>
        <further-classification edition="200601120260331B">B25C7/00</further-classification>
        <further-classification edition="200601120260331B">B27F7/36</further-classification>
        <further-classification edition="200601120260331B">B27F7/38</further-classification>
        <further-classification edition="200601120260331B">B27F7/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美克司股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村越将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKOSHI, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千明義雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIGIRA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">訂書機（1A）包括：將訂書針擊出的出針部（2）、將透過出針部（2）擊出的訂書針的一對針腳部彎曲的裝訂部（3）、執行訂書針所進行的裝訂對象物之裝訂動作的裝訂驅動部（7）、偵測裝訂對象物的偵測部（5）以及當偵測部（5）偵測到裝訂對象物時驅動裝訂驅動部（7）的控制部（8）。控制部（8）切換自偵測部（5）偵測到裝訂對象物至驅動裝訂驅動部（7）為止的回應時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:訂書機</p>
        <p type="p">2:出針部</p>
        <p type="p">3:裝訂部</p>
        <p type="p">4:載置部</p>
        <p type="p">5:偵測部</p>
        <p type="p">7:裝訂驅動部</p>
        <p type="p">8:控制部</p>
        <p type="p">20:插入部</p>
        <p type="p">80:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1577" publication-number="202631339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訂書機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25C7/00</main-classification>
        <further-classification edition="200601120260430B">B25C5/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美克司股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本一弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>見城達弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENJO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供即使在透過訂書針裝訂裝訂對象物周緣部的複數個部位時也可對應於裝訂位置而執行裝訂動作的訂書機。訂書機包括：將訂書針擊出的出針部、將透過出針部擊出的訂書針的一對針腳部彎曲的裝訂部、執行訂書針所進行的裝訂對象物之裝訂動作的裝訂驅動部、藉由裝訂對象物的偵測而作動裝訂驅動部的偵測部以及將藉由偵測部偵測裝訂對象物的位置以預先設定的順序切換的控制部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:訂書機</p>
        <p type="p">2:出針部</p>
        <p type="p">3:裝訂部</p>
        <p type="p">4:載置部</p>
        <p type="p">5A:偵測部</p>
        <p type="p">6A:偵測部移動部</p>
        <p type="p">7:裝訂驅動部</p>
        <p type="p">8:控制部</p>
        <p type="p">20:插入部</p>
        <p type="p">80:記憶部</p>
        <p type="p">A:距離</p>
        <p type="p">F:箭頭</p>
        <p type="p">P1:第一位置(位置)</p>
        <p type="p">Pp:裝訂位置</p>
        <p type="p">R:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1578" publication-number="202631338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訂書機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">B25C5/10</main-classification>
        <further-classification edition="200601120260331B">B25C5/15</further-classification>
        <further-classification edition="200601120260331B">B25C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美克司股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本一弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>見城達弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENJO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種訂書機，包括：訂書針打出部，打出訂書針；裝訂部，彎曲由訂書針打出部打出的訂書針的一對針腳；載置部，載置裝訂對象物；複數個引導部，能夠將載置在載置部的裝訂對象物的寬度方向的位置在橫方向引導在不同的位置，橫方向與前後方向相交，前後方向為裝訂對象物在訂書針打出部與裝訂部之間插拔的方向；以及檢測部，藉由檢測載置在載置部的裝訂對象物而使訂書針打出部以及裝訂部作動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:訂書機</p>
        <p type="p">2:訂書針打出部</p>
        <p type="p">3:裝訂部</p>
        <p type="p">4:載置部</p>
        <p type="p">5:第一引導部/引導部</p>
        <p type="p">6:第二引導部/引導部</p>
        <p type="p">7:支持部</p>
        <p type="p">8:檢測部</p>
        <p type="p">40:凹部</p>
        <p type="p">41:第一安裝部</p>
        <p type="p">50:第一引導面/引導面</p>
        <p type="p">51:第一被安裝部</p>
        <p type="p">51a:螺絲</p>
        <p type="p">51b:螺帽</p>
        <p type="p">52:第二安裝部</p>
        <p type="p">52a:孔部</p>
        <p type="p">52b:螺絲</p>
        <p type="p">52c:螺絲孔</p>
        <p type="p">52d:偏壓支持部</p>
        <p type="p">60:第二引導面/引導面</p>
        <p type="p">61:被作用面</p>
        <p type="p">62:底面</p>
        <p type="p">70:軸部</p>
        <p type="p">71:偏壓部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1579" publication-number="202632326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近眼裝置用光學積層體及顯示系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260328B">G02B5/22</main-classification>
        <further-classification edition="200601120260328B">G02B27/01</further-classification>
        <further-classification edition="200601120260328B">G02F1/1335</further-classification>
        <further-classification edition="202301120260328B">H10K59/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學積層體，其係應用於近眼裝置者，且可截止不需要之光。&lt;br/&gt;  本發明實施形態之近眼裝置用光學積層體，具備IR吸收層與功能構件；且該IR吸收層在940nm下之光透射率為60%以下。上述光學積層體亦可具備有偏光構件、第一相位差構件及保護構件作為上述機能構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:偏光構件</p>
        <p type="p">20:第一相位差構件</p>
        <p type="p">20a:第一λ/4構件</p>
        <p type="p">30:保護構件</p>
        <p type="p">40:IR吸收層</p>
        <p type="p">100a:光學積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1580" publication-number="202632104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖芯線捆紮用帶及光纖單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260421B">D04H1/541</main-classification>
        <further-classification edition="200601120260421B">G02B6/44</further-classification>
        <further-classification edition="200601120260421B">B65H75/08</further-classification>
        <further-classification edition="200601120260421B">B32B5/28</further-classification>
        <further-classification edition="200601120260421B">B32B27/30</further-classification>
        <further-classification edition="200601120260421B">B32B27/34</further-classification>
        <further-classification edition="200601120260421B">B65H75/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商宇部愛科喜模股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UBE EXSYMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中晴士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤英範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAZAWA, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種適用於以單條呈螺旋狀纏繞於光纖芯線束之單束束線方式捆紮之光纖芯線捆紮用帶及使用此捆紮用帶所形成之光纖單元。&lt;br/&gt;  本發明之光纖芯線捆紮用帶1，係與長邊方向垂直的剖面為海島結構，該海島結構係於由第一熱可塑性樹脂而成之海成分11中，散布有由熔點較該第一熱可塑性樹脂高20°C以上之第二熱可塑性樹脂而成之複數個島成分12；且寬度w為3.2~5.0mm；厚度t為0.12mm以下；拉伸伸長率為20~50%；於100°C加熱3小時後之熱收縮率為1.1~1.5%。本發明之光纖單元，係將該光纖芯線捆紮用帶1以單條呈螺旋狀纏繞於光纖芯線束之外周而構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:捆紮用帶</p>
        <p type="p">11:海成分(第一熱可塑性樹脂)</p>
        <p type="p">12:島成分(第二熱可塑性樹脂)</p>
        <p type="p">w:寬度</p>
        <p type="p">t:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1581" publication-number="202631307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板之研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260424B">B24B37/005</main-classification>
        <further-classification edition="201201120260424B">B24B37/04</further-classification>
        <further-classification edition="202601120260424B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商環球晶圓日本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS JAPAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹羽直哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIWA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於抑制將半導體基板自研磨機台移動至下一個研磨機台時所發生的DIC以及LPD。&lt;br/&gt;  本發明之解決手段為一種半導體基板之研磨方法，係使得半導體基板一邊移動一邊以複數的研磨機台進行下述工序：對於被貼附在研磨平台的研磨布來抵接由研磨頭所保持著的半導體基板，將研磨劑滴下至該研磨布，使得前述半導體基板滑動以進行研磨；於前述研磨機台中之半導體基板之研磨中途，從第1研磨劑變更為研磨速率比前述第1研磨劑來得低的第2研磨劑；相較於使用前述第1研磨劑之研磨，在使用前述第2研磨劑之研磨中，降低平台壓力、研磨頭旋轉數、以及研磨平台旋轉數中之至少一者以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1582" publication-number="202632430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142558</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有方向隔離成像之疊對計量系統</chinese-title>
        <english-title>OVERLAY METROLOGY SYSTEM WITH DIRECTION-ISOLATED IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斐勒　尤爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELER, YOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朗維司基　維拉得摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVINSKI, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　尼瑞卡珊納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, NIREEKSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃夫曼　亞隆　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLFMAN, ALON ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙菲羅夫　黛安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAPHIROV, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種疊對計量系統可包含一照明子系統，其具有可在實施一計量配方時將照明引導至一樣本上之一疊對目標之一或多個透鏡。該照明可包含一第一照明偶極及一第二照明偶極。該疊對目標可包含兩個或更多個單元，其中各單元可包含具有沿一第一方向之週期性之第一方向特徵及具有沿一第二方向之週期性之第二方向特徵。該系統亦可包含一成像子系統，其具有可收集由該疊對目標產生之該照明之繞射級之一物鏡及一或多個偵測器。該照明子系統及該成像子系統可經組態以產生該疊對目標之一第一影像及一第二影像。具有一或多個處理器之一控制器可基於該第一及第二影像來產生疊對量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An overlay metrology system may include an illumination sub-system with one or more lenses that can direct illumination to an overlay target on a sample when implementing a metrology recipe. The illumination may include a first illumination dipole and a second illumination dipole. The overlay target may include two or more cells, where each cell may include first-direction features having periodicity along a first direction and second-direction features having periodicity along a second direction. The system may also include an imaging sub-system with an objective lens that can collect diffraction orders of the illumination generated by the overlay target and one or more detectors. The illumination sub-system and the imaging sub-system may be configured to generate a first image and a second image of the overlay target. A controller with one or more processors may generate overlay measurements based on the first and second images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:疊對計量系統</p>
        <p type="p">102:照明子系統</p>
        <p type="p">104:照明偶極</p>
        <p type="p">106:疊對目標</p>
        <p type="p">108:樣本</p>
        <p type="p">110:成像子系統</p>
        <p type="p">112:繞射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1583" publication-number="202631989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與免疫療法功效相關之生物標記</chinese-title>
        <english-title>BIOMARKERS RELATED TO IMMUNOTHERAPY EFFICACY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">C12N5/0783</main-classification>
        <further-classification edition="200601120260504B">C12N15/85</further-classification>
        <further-classification edition="200601120260504B">C07K14/725</further-classification>
        <further-classification edition="202501120260504B">A61K40/11</further-classification>
        <further-classification edition="202501120260504B">A61K40/31</further-classification>
        <further-classification edition="202501120260504B">A61K40/42</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="202601120260504B">G01N33/575</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITE PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波達　蘇米亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PODDAR, SOUMYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾德拉瑪　古鐵雷斯　加布里埃拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALDERRAMA-GUTIERREZ, GABRIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝多涅蒂　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEDOGNETTI, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥提　麥可　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTIE, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於用於預測患者在用免疫療法產品治療後該患者之癌症復發之可能性的方法、及用於改善免疫療法產品對在用免疫療法產品治療後具有癌症復發之可能性之患者的功效之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to methods for predicting a likelihood of a relapse to a cancer in a patient following treatment of the patient with an immunotherapy product, and methods for improving efficacy of an immunotherapy product for a patient with a likelihood of a relapse to a cancer following treatment with an immunotherapy product.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1584" publication-number="202631602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有降低Ｌｐ（ａ）水平之經取代２－（吡咯啶－３－基）乙酸之衍生物的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D403/14</main-classification>
        <further-classification edition="200601120260504B">C07D409/14</further-classification>
        <further-classification edition="200601120260504B">A61K31/4025</further-classification>
        <further-classification edition="200601120260504B">A61P3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翊石醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOVSTONE THERAPEUTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YUNLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WENQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷響</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇紅豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOU, HONGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUNNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新型的降低血漿Lp(a)水平之化合物的製備方法及其中間物化合物。該新型化合物係生物化學上有效且具有生理活性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1585" publication-number="202631050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將抽屜元件固定在抽屜側邊框上的固定裝置</chinese-title>
        <english-title>FASTENING DEVICE FOR FASTENING A DRAWER ELEMENT ON A SIDE FRAME OF A DRAWER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A47B88/90</main-classification>
        <further-classification edition="200601120260429B">F16B12/26</further-classification>
        <further-classification edition="200601120260429B">F16B12/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈澤　艾曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETZER, EMANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉布赫爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABHERR, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特羅爾茲　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROLZ, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將至少一個平板狀抽屜元件（1、2）——較佳為抽屜後壁（1）和/或抽屜底板（2）——固定於抽屜側邊框（3）的固定裝置，該抽屜側邊框有至少一個——較佳為凹槽狀的——固定區域（4），其用於至少部分地固定抽屜元件（1、2）的邊緣（5），其中該固定裝置帶有至少一個鎖緊裝置（6、7、8、9、10、62、68），該至少一個鎖緊裝置用於沿著橫截於抽屜側邊框（3）的接合方向（11）將抽屜元件（1、2）的邊緣（5）接入該至少一個固定區域（4），以及在接合之後逆接合方向（11）鎖緊抽屜元件（1、2）的該邊緣，其中該固定裝置帶有至少一個安裝座（12、13、14、15），該至少一個鎖緊裝置（6、7、8、9、10、62、68）可在接合過程中至少部分地容納於該至少一個安裝座之中，其中&lt;br/&gt;  - 安裝座（12、13、14、15）有至少一個橫截於接合方向（11）的活動空間，從而抽屜元件（1、2）的邊緣（5）可在接合之後沿著橫截於接合方向（11）的調整方向（16）可至少有限度地移動，及/或&lt;br/&gt;  - 該至少一個鎖緊裝置（6、7、8、9、10、62、68）具有至少一個可被容納於安裝座（12、13、14、15）的緊固部分（69）、基體（46）以及處於該兩者之間的部分（70），該部分至少在某些區域是可撓性設計，從而緊固部分（69）可沿著橫截於接入方向（11）的調整方向（16）相對於基體（46）有限移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:抽屜底板</p>
        <p type="p">12:安裝座</p>
        <p type="p">16:調整方向</p>
        <p type="p">24:鎖止元件</p>
        <p type="p">34:水平腹板</p>
        <p type="p">35:容器導軌</p>
        <p type="p">64:寬度</p>
        <p type="p">65:寬度</p>
        <p type="p">66:邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1586" publication-number="202632327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性著色組成物，及彩色濾光片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G02B5/23</main-classification>
        <further-classification edition="200601120260424B">G03F7/028</further-classification>
        <further-classification edition="200601120260424B">C09B67/26</further-classification>
        <further-classification edition="200601120260424B">C08F2/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周正偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHENGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田一貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳正義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGI, MASAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉林一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAHAYASHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性樹脂組成物，其含有：鹼可溶性樹脂(A)、反應性稀釋劑(B)、光聚合起始劑(C)，及溶劑(D)，鹼可溶性樹脂(A)之酸價係10~300mgKOH/g，鹼可溶性樹脂(A)係具有源自含有芳香環之乙烯性不飽和化合物(ma-1)之結構單元(a-1)的樹脂，含有芳香環之乙烯性不飽和化合物(ma-1)具有1~3個芳香環，含有芳香環之乙烯性不飽和化合物(ma-1)之均聚物之折射率大於1.6，含有芳香環之乙烯性不飽和化合物(ma-1)之最長吸收波長係未達350nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1587" publication-number="202631864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚乙烯系樹脂擠出發泡片及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260401B">C08L23/08</main-classification>
        <further-classification edition="200601120260401B">B29C44/20</further-classification>
        <further-classification edition="200601120260401B">C08J9/12</further-classification>
        <further-classification edition="200601120260401B">C08J9/14</further-classification>
        <further-classification edition="201901120260401B">B29C48/00</further-classification>
        <further-classification edition="200601120260401B">B29C44/00</further-classification>
        <further-classification edition="200601120260401B">B32B5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俊
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKUTA, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田幹大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MIKIDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓通賢𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTSU, KENRYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUYAMA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;本發明課題係提供一種在含有直鏈狀低密度聚乙烯時表觀密度亦低，可容易獲得良好的擠出發泡片的聚乙烯系樹脂擠出發泡片之製造方法及藉由此製造方法而得之聚乙烯系樹脂擠出發泡片。  &lt;br/&gt;　　解決手段為，聚乙烯系樹脂擠出發泡片1之製造方法係包含擠出發泡步驟，該步驟係將作為基材樹脂之聚乙烯系樹脂與物理發泡劑經熔融混煉而成的發泡性樹脂熔融物進行擠出發泡。聚乙烯系樹脂係含有直鏈狀低密度聚乙烯。直鏈狀低密度聚乙烯的結晶化起始溫度Tcs(單位：℃)與結晶化溫度Tc(單位：℃)之差Tcs-Tc為8℃以下。以測定溫度150℃、剪切速度375s&lt;sup&gt;-1&lt;/sup&gt;的條件所測得根據Cogswell法之直鏈狀低密度聚乙烯的拉伸黏度λ為50,000Pa・s以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:聚乙烯系樹脂擠出發泡片</p>
        <p type="p">2:評定裝置</p>
        <p type="p">10:試驗片</p>
        <p type="p">11:突出的部分</p>
        <p type="p">12:基端部</p>
        <p type="p">21:試料台</p>
        <p type="p">22:固定治具</p>
        <p type="p">111:前端</p>
        <p type="p">211:水平面</p>
        <p type="p">H:下垂量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1588" publication-number="202631751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組成物、硬化物、積層膜及物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260407B">C08F220/06</main-classification>
        <further-classification edition="200601120260407B">C08G59/17</further-classification>
        <further-classification edition="200601120260407B">C08F2/50</further-classification>
        <further-classification edition="200601120260407B">C08K3/36</further-classification>
        <further-classification edition="200601120260407B">G03F7/004</further-classification>
        <further-classification edition="200601120260407B">C09D4/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>犬伏良祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INUBUSHI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>之
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口拓馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植竹和基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UETAKE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種感光性組成物，其能夠提供外觀、硬度、耐磨性及耐撓性均優異之硬化物。本發明係關於一種感光性組成物，其特徵在於：含有由下述通式（1）表示之多官能化合物（A）、平均一次粒徑為1～100 nm之無機粒子（B）及光聚合起始劑（C）。（式（1）中，X表示具有環狀結構之2價有機基或3價以上之有機基。N為2以上之整數。）  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="137px" width="287px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1589" publication-number="202631014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有害生物防除組成物、及植物病害或植物病害蟲之防除方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A01N43/56</main-classification>
        <further-classification edition="200601120260504B">A01N43/80</further-classification>
        <further-classification edition="200601120260504B">A01N37/22</further-classification>
        <further-classification edition="200601120260504B">A01N37/44</further-classification>
        <further-classification edition="200601120260504B">A01N43/40</further-classification>
        <further-classification edition="200601120260504B">A01N43/90</further-classification>
        <further-classification edition="200601120260504B">A01N43/32</further-classification>
        <further-classification edition="200601120260504B">A01P9/00</further-classification>
        <further-classification edition="200601120260504B">A01P7/04</further-classification>
        <further-classification edition="200601120260504B">A01P5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學植保股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS CROP &amp; LIFE SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島内円夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAUCHI, MADOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河原信行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大倉広成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKURA, HIRONARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀬麻衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, MAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田英一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, EIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種有害生物防除組成物，含有：成分(1)及成分(2)，成分(1)為異㗁唑啉系、間二醯胺系化合物，成分(2)為苯基吡唑系化合物、作為粒線體電子傳遞系複合體III抑制劑而發揮作用的化合物、作為麩胺酸作動性氯離子通道變構調節劑而發揮作用的化合物、作為尼古丁性乙醯膽鹼受體競爭性調節劑而發揮作用的化合物、作為弦音器TRPV通道調節劑而發揮作用的化合物、作為乙醯輔酶A羧化酶抑制劑而發揮作用的化合物、除蟲菊酯(pyrethroid)系化合物、苯嘧蟲㗁烷(benzpyrimoxan)、氟赫吩(fluhexafon)、氯吡唑蟲胺(tyclopyrazoflor)、吲唑蟲醯胺(indazapyroxamet)、噻蟲氯(tiapyrachlor)、氟吡啶蟲酯(flupyroxystrobin)、2-[5-環丙基-3-(乙基磺醯基)-2-吡啶基]-5-[(三氟甲基)亞磺醯基]-1,3-苯并㗁唑(cybenzoxasulfyl)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1590" publication-number="202632257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放射線檢測器、及放射線檢查裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260302B">G01N23/10</main-classification>
        <further-classification edition="202301120260302B">H04N25/30</further-classification>
        <further-classification edition="202301120260302B">H04N25/53</further-classification>
        <further-classification edition="202301120260302B">H04N25/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木春樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須山敏康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之放射線檢測器具備：遮蔽構件，其形成有供放射線通過之開口；光轉換部，其具有包含於Z軸方向上與開口相向之側面、及沿Z軸方向及與Z軸方向交叉之X軸方向之表面之閃爍器；光檢測部，其具有沿與上述表面相向之平面二維配置之複數個像素；及處理部，其電性連接於複數個像素，處理來自複數個像素之輸出信號；複數個像素配置成各自沿Z軸方向之複數個行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:放射線檢測器</p>
        <p type="p">10:遮蔽構件</p>
        <p type="p">11:本體部</p>
        <p type="p">12:開口</p>
        <p type="p">20:基板</p>
        <p type="p">30:光轉換部</p>
        <p type="p">31:閃爍器(第1轉換構件)</p>
        <p type="p">31a:側面</p>
        <p type="p">31b:側面</p>
        <p type="p">40:光檢測部</p>
        <p type="p">41:像素</p>
        <p type="p">50:處理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1591" publication-number="202633516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶反應器之氣體入口總成</chinese-title>
        <english-title>GAS INLET ASSEMBLY FOR EPITAXIAL REACTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W76/63</main-classification>
        <further-classification edition="200601120260428B">C30B25/14</further-classification>
        <further-classification edition="200601120260428B">C30B25/00</further-classification>
        <further-classification edition="200601120260428B">C30B25/08</further-classification>
        <further-classification edition="202601120260428B">H10P14/24</further-classification>
        <further-classification edition="202601120260428B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維克儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEECO INSTRUMENTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　羅傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NILSSON, ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施彭格勒　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPENGLER, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯伯格　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSBERG, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於一反應器(10)之氣體入口總成，該反應器(10)用於半導體晶圓之磊晶生長，該氣體入口總成包括：一入口(12)，其用於將製程氣體引入至該反應器(10)中；一氣體導管(25)，其具有一第一端(26)及一第二端(27)，該第一端(26)經配置以連接至該反應器(10)之一生長腔室，該第二端(27)毗鄰於該入口(12)配置以提供該入口(12)與該生長腔室(16)之間的流體連通；以及一密封裝置(30)，其附接至該入口(12)及該氣體導管(25)之該第二端(27)，以在該入口(12)與該氣體導管(25)之該第二端(27)之間提供一氣密屏障，該密封裝置(30)經構形以允許該氣體導管(25)之該第二端(27)相對於該入口(12)移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas inlet assembly for a reactor (10) for epitaxial growth of semiconductor wafers, the gas inlet assembly comprising: an inlet (12) for introduction of process gases into the reactor (10); a gas conduit (25) having a first end (26) arranged to be connected to a growth chamber of the reactor (10) and a second end (27) arranged adjacent to the inlet (12) to provide fluid communication between the inlet (12) and the growth chamber (16); and a sealing device (30) attached to the inlet (12) and to the second end (27) of the gas conduit (25) to provide a gastight barrier therebetween, the sealing device (30) being configured to allow movement of the second end (27) of the gas conduit (25) in relation to the inlet (12).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:磊晶反應器/反應器</p>
        <p type="p">11:外罩殼/罩殼</p>
        <p type="p">12:入口</p>
        <p type="p">14:出口</p>
        <p type="p">16:生長腔室</p>
        <p type="p">17:腔室壁/頂壁/壁</p>
        <p type="p">18:腔室壁/底壁/壁</p>
        <p type="p">20:晶圓載體/基座</p>
        <p type="p">21:上加熱器/加熱元件</p>
        <p type="p">22:下加熱器/加熱元件</p>
        <p type="p">24:隔熱體</p>
        <p type="p">25:襯裡漏斗/氣體導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1592" publication-number="202632041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉬沉積方法</chinese-title>
        <english-title>MOLYBDENUM DEPOSITION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C16/04</main-classification>
        <further-classification edition="200601120260427B">C23C16/08</further-classification>
        <further-classification edition="200601120260427B">C23C16/455</further-classification>
        <further-classification edition="200601120260427B">C23C16/52</further-classification>
        <further-classification edition="202601120260427B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅正錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, JEONG-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝曜聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　照健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIUKIN STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　克林帕　派崔克　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN CLEEMPUT, PATRICK A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供以鉬（Mo）來填充圖案化特徵部的方法。該方法涉及在包含介電側壁之特徵部的底部含金屬表面上選擇性沉積鉬（Mo）薄膜。於該底部表面上選擇性生長Mo允許從下到上的生長以及高品質無孔洞的填充。此處亦提供相關的設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods of filling patterned features with molybdenum (Mo). The methods involve selective deposition of Mo films on bottom metal-containing surfaces of a feature including dielectric sidewalls. The selective growth of Mo on the bottom surface allows bottom-up growth and high quality, void-free fill. Also provided are related apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:底表面</p>
        <p type="p">404:側壁表面</p>
        <p type="p">408:Mo薄膜</p>
        <p type="p">410:特徵部</p>
        <p type="p">416:金屬氧化物</p>
        <p type="p">420:特徵部</p>
        <p type="p">430:特徵部</p>
        <p type="p">440:特徵部</p>
        <p type="p">450:特徵部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1593" publication-number="202631039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142784</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擴散器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">A45D20/34</main-classification>
        <further-classification edition="200601120260424B">A45D20/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近澤祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIKAZAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神原匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBARA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>押本大誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIMOTO, TAISEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">擴散器(20)具備有噴嘴(30)，前述噴嘴(30)具有連接部(31)與噴嘴本體(32)，前述連接部(31)具有與已形成在流體吐出裝置的本體部的吐出口連通的連接口，前述噴嘴本體(32)連接設置於連接部(31)的下游側，且往下游側擴徑。又，擴散器(20)具備有梳件(40)，前述梳件(40)連接設置於噴嘴(30)的下游側，且形成有吐出孔(422)及附吐出孔之梳齒狀部(421)。並且，擴散器(20)具備有整流壁(51)，前述整流壁(51)呈環狀，配置於噴嘴(30)與梳件(40)之間，且在內側具有貫通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">18:誘導構件</p>
        <p type="p">20:擴散器</p>
        <p type="p">30:噴嘴</p>
        <p type="p">31:連接部</p>
        <p type="p">32:噴嘴本體</p>
        <p type="p">32a:內壁面</p>
        <p type="p">33:固定部</p>
        <p type="p">40:梳件</p>
        <p type="p">41:底壁</p>
        <p type="p">41a,42a:下表面</p>
        <p type="p">42:周壁</p>
        <p type="p">43:被固定部</p>
        <p type="p">50:整流部</p>
        <p type="p">51:整流壁</p>
        <p type="p">52:支柱</p>
        <p type="p">421:附吐出孔之梳齒狀部</p>
        <p type="p">421a,422:吐出孔</p>
        <p type="p">511:外緣</p>
        <p type="p">512:內緣</p>
        <p type="p">D1:開口徑</p>
        <p type="p">D2:外徑</p>
        <p type="p">D3:內徑</p>
        <p type="p">P2:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1594" publication-number="202632940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藍牙通訊系統以及藍牙裝置</chinese-title>
        <english-title>BLUETOOTH COMMUNICATION SYSTEM AND BLUETOOTH DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251201B">H04L51/066</main-classification>
        <further-classification edition="202201120251201B">H04L65/611</further-classification>
        <further-classification edition="202401120251201B">H04B5/00</further-classification>
        <further-classification edition="201801120251201B">H04W4/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張運璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUN-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藍牙通訊系統，包含一第一藍牙裝置以及一第二藍牙裝置。該第一藍牙裝置產生並傳送一第一封包區段。該第二藍牙裝置產生並傳送一第二封包區段。該第一封包區段以及該第二封包區段隸屬於一單一藍牙封包。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Bluetooth (BT) communication system includes a first BT device and a second BT device. The first BT device generates and transmits a first packet segment. The second BT device generates and transmits a second packet segment. The first packet segment and the second packet segment belong to a single BT packet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102,104_1,104_2,104_3,104_4:藍牙裝置</p>
        <p type="p">PKT1,PKT2:藍牙封包</p>
        <p type="p">PS1,PS2,PS3,PS4:封包區段</p>
        <p type="p">GI:保護間隔</p>
        <p type="p">TIFS:訊框間隔時間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1595" publication-number="202632931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在積體電路（ＩＣ）上用於網狀網路中的節點間傳遞的局部介面錯誤恢復以及相關方法</chinese-title>
        <english-title>LOCAL INTERFACE ERROR RECOVERY FOR NODE-TO-NODE TRANSFERS IN MESH NETWORK ON AN INTEGRATED CIRCUIT (IC) AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260504B">H04L41/0659</main-classification>
        <further-classification edition="202201120260504B">H04L43/0823</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐瓦堤　薩拉傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWATIA, SALAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯奈　湯瑪仕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASNIGHT, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維　文可塔拉維詹得蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVI, VENKATA RAVICHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路（IC）中的網狀網路可以將資料封包經由許多節點間介面從來源節點傳遞至目的節點。當錯誤發生時，重置該IC可能顯著影響效能。包括在網狀網路中互連的節點的IC可以採用耦接至傳輸節點的傳輸控制電路及耦接至接收節點的接收控制電路，以回應於在傳輸節點或接收節點偵測到的錯誤而重新初始化在節點間介面兩端的介面電路。這允許了該IC修正錯誤並在重新初始化節點介面時持續運行該IC的剩餘部份，而非重置整個IC。舉例而言，能觸發節點重新初始化的錯誤可以在介面電路、流量控制電路或資料封包中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mesh network in an integrated circuit (IC) may transfer a data packet from a source node to a destination node through many node-to-node interfaces. When an error occurs, resetting the IC can have a significant performance impact. An IC including nodes interconnected in a mesh network may employ a transmit control circuit coupled to a transmit node and a receive control circuit coupled to a receive node to reinitialize interface circuits on both ends of a node-to-node interface in response to a detected error in either a transmit node or a receive node. This allows the IC to correct the error and continue to operate the rest of the IC while the node interface is reinitialized rather than resetting the entire IC. For example, errors that can trigger a node to be reinitialized may be in interface circuits, flow control circuits, or data packets.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:IC</p>
        <p type="p">102:節點</p>
        <p type="p">104:網狀網路</p>
        <p type="p">106:節點間(NTN)介面</p>
        <p type="p">110(1):傳輸控制電路</p>
        <p type="p">110(2):接收控制電路</p>
        <p type="p">112:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1596" publication-number="202631623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＮＫ３Ｒ拮抗劑中間產物的製備方法</chinese-title>
        <english-title>METHOD FOR PREPARING NK3R ANTAGONIST INTERMEDIATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/04</main-classification>
        <further-classification edition="200601120260504B">A61K31/4985</further-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAO-BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛廣存</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, GUANG-CUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫牧言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, MU-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及NK3R拮抗劑中間產物的製備方法，包括方法1和方法2。本案的方法1是將化合物I-11進行掌性配體誘導的不對稱氫化反應，建構掌性中心，得到目標掌性式I所示化合物，其掌性純度為95%以上，並且產物的收率為55%以上。本案的方法2是將化合物9直接進行掌性配體誘導的不對稱氫化反應，建構掌性中心，得到目標掌性式I所示化合物，其掌性純度為90%以上，收率為90%以上。較之原合成工藝（PCT/WO2022/2222963中揭露的方法），收率提升約7倍，且在式I所示化合物的全流程反應中，還減少了一個反應步驟。本案的2種方法避免了原拆分技術需多次打漿純化操作的缺陷，製備成本極大降低，有望實現式I化合物的降低成本和大規模生產。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a process for the preparation of an intermediate of an NK3R antagonist, comprising Process 1 and Process 2. Process 1 of the present disclosure comprises subjecting Compound I-11 to an asymmetric hydrogenation reaction induced by a chiral ligand to establish a chiral center, thereby obtaining the target compound represented by chiral Formula I, which has a chiral purity of 95% or more and a product yield of 55% or more. Process 2 of the present disclosure comprises directly subjecting Compound 9 to an asymmetric hydrogenation reaction induced by a chiral ligand to establish a chiral center, thereby obtaining the target compound represented by chiral Formula I, which has a chiral purity of 90% or more and a yield of 90% or more. Compared with the original synthetic process (the method disclosed in PCT/WO2022/2222963), the yield is increased by about 7 times, and one reaction step is reduced in the overall reaction process for the compound represented by Formula I. The two processes of the present disclosure avoid the drawbacks of the original resolution process which requires multiple pulping and purification operations, greatly reduce the preparation cost, and are expected to realize cost reduction and large-scale production of the compound of Formula I.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1597" publication-number="202632654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多通道記憶體裝置</chinese-title>
        <english-title>MULTI-CHANNEL MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C8/12</main-classification>
        <further-classification edition="200601120260302B">G11C8/10</further-classification>
        <further-classification edition="200601120260302B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文弘基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, HONG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴珉秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MIN SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於多通道記憶體裝置。一種記憶體裝置包括：第一命令位址解碼器，其被配置為解碼第一晶片選擇訊號和第一命令位址訊號並產生第一控制訊號；第二命令位址解碼器，其被配置為在多通道模式期間解碼第二晶片選擇訊號和第二命令位址訊號並產生第二控制訊號，以及被配置為在多列組模式期間解碼第二晶片選擇訊號和第一命令位址訊號並產生第二控制訊號；第一記憶體核心，包括第一記憶體單元並透過第一控制訊號來控制；以及第二記憶體核心，包括第二記憶體單元並透過第二控制訊號來控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is about multi-channel memory device. A memory device includes a first command address decoder configured to decode a first chip selection signal and first command address signals and generate first control signals, a second command address decoder configured to decode a second chip selection signal and second command address signals and generate second control signals during a multi-channel mode and configured to decode the second chip selection signal and the first command address signals and generate second control signals during a multi-rank mode, a first memory core including first memory cells and being controlled by the first control signals, and a second memory core including second memory cells and being controlled by the second control signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體</p>
        <p type="p">101_A:第一時脈接收電路</p>
        <p type="p">101_B:第二時脈接收電路</p>
        <p type="p">102_A:第一晶片選擇訊號接收電路</p>
        <p type="p">102_B:第二晶片選擇訊號接收電路</p>
        <p type="p">103_A:第一命令位址訊號接收電路</p>
        <p type="p">103_B:第二命令位址訊號接收電路</p>
        <p type="p">110_A:第一命令位址解碼器</p>
        <p type="p">110_B:第二命令位址解碼器</p>
        <p type="p">120_A:第一記憶體核心</p>
        <p type="p">120_B:第二記憶體核心</p>
        <p type="p">130_A:第一資料發送/接收電路</p>
        <p type="p">130_B:第二資料發送/接收電路</p>
        <p type="p">140:配置模式設置電路</p>
        <p type="p">141:配置訊號接收器</p>
        <p type="p">142:配置訊號接收器</p>
        <p type="p">151:選擇電路</p>
        <p type="p">152:選擇電路</p>
        <p type="p">153:選擇電路</p>
        <p type="p">154:選擇電路</p>
        <p type="p">CLK_A:第一時脈端子</p>
        <p type="p">CLK_B:第二時脈端子</p>
        <p type="p">CS_A:第一晶片選擇訊號端子</p>
        <p type="p">CS_B:第二晶片選擇訊號端子</p>
        <p type="p">CAs_A:第一命令位址端子</p>
        <p type="p">CAs_B:第二命令位址端子</p>
        <p type="p">CON_A:第一控制訊號</p>
        <p type="p">CON_B:第二控制訊號</p>
        <p type="p">CS_A_SIG:晶片選擇訊號</p>
        <p type="p">CS_B_SIG:晶片選擇訊號</p>
        <p type="p">DQS_A:第一資料選通端子</p>
        <p type="p">DQs_A:第一資料端子</p>
        <p type="p">DQS_B:第二資料選通端子</p>
        <p type="p">DQs_B:第二資料端子</p>
        <p type="p">E1:訊號</p>
        <p type="p">E2:訊號</p>
        <p type="p">E3:訊號</p>
        <p type="p">E4:訊號</p>
        <p type="p">E5:訊號</p>
        <p type="p">ORG1:配置訊號端子</p>
        <p type="p">ORG2:配置訊號端子</p>
        <p type="p">S1:訊號</p>
        <p type="p">S2:訊號</p>
        <p type="p">S3:訊號</p>
        <p type="p">S4:訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1598" publication-number="202632276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改進抗藥物抗體測定之方法</chinese-title>
        <english-title>METHODS FOR IMPROVING ANTI-DRUG ANTIBODY ASSAYS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N33/68</main-classification>
        <further-classification edition="200601120260504B">G01N33/564</further-classification>
        <further-classification edition="200601120260504B">G01N33/543</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商傑諾維斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENOVIS AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波勒　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POEHLER, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史都本拉奇　凱　甘諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUBENRAUCH, KAY-GUNNAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維索斯　屋維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESSELS, UWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞德　阿拉揚　羅爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOOD-ALAYON, ROLF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了進行具有改進的例如檢測 IgM 類 ADA 抗體的分辨率的基於抗體的測定/免疫學測定之方法。亦揭示了進行具有改進的檢測 IgG 類 ADA 抗體的分辨率/靈敏度的基於抗體的測定/免疫學測定之方法。特定而言，可對含有、可能含有及/或預期含有類風濕因子 (RF) 的生物學樣品進行受益於根據本揭露之方法的測定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are methods of performing antibody-based / immunological assays having improved resolution; for example, to detect ADA antibodies of the IgM class. Also disclosed are methods for performing antibody-based / immunological assays having improved resolution / sensitivity to detect ADA antibodies of the IgG class. In particular, assays benefiting from the methods according to this disclosure may be performed on biological samples that contain, may contain, and/or are expected to contain rheumatoid factor (RF).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1599" publication-number="202631598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異喹啉ＤＭＰＫ結合劑</chinese-title>
        <english-title>ISOQUINOLINE DMPK BINDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D401/14</main-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D471/10</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">C07D487/08</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/551</further-classification>
        <further-classification edition="200601120260504B">A61K31/4995</further-classification>
        <further-classification edition="200601120260504B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿拉基斯醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARRAKIS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽格　艾蜜莉　葛西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGA, EMILY GARCIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊耶　卡席克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IYER, KATHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史齊瓦茲　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARTZ, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱必藍特　桑達　桑葛潘迪安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUBILANT, SUNDAR THANGAPANDIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭克　艾榮　特蘭斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANK, AARON TERRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沛特　珍妮佛　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETTER, JENNIFER C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波斯威爾　薩奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSWELL, ZACH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇洛德　葛里芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, GRIFFIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼尼卻里　伊雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENICHELLI, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅佛林　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOVERING, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴瑞　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERRY, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩達魯　伊里亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NDARU, ELIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆可傑　荷斯卻爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHERJEE, HERSCHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯茲　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐恩史汀　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORNSTEIN, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪荷　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHER, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式I化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="211px" width="269px" file="ed14424.JPG" alt="ed14424.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;及其醫藥學上可接受之鹽；其組合物；以及在治療諸如肌強直性營養不良第1型(DM1)之疾病、病症及病狀的方法中使用該等化合物及組合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides compounds of Formula I: &lt;br/&gt;&lt;img align="absmiddle" height="214px" width="270px" file="ed14425.JPG" alt="ed14425.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;and pharmaceutically acceptable salts thereof, compositions thereof, and methods of using the same in methods of treating diseases, disorders, and conditions such as myotonic dystrophy type 1 (DM1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1600" publication-number="202631507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142901</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少磷酸鹽之矽酸鈣粒子</chinese-title>
        <english-title>CALCIUM SILICATE PARTICLES FOR PHOSPHATE REDUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C01B33/32</main-classification>
        <further-classification edition="200601120260504B">A61K33/06</further-classification>
        <further-classification edition="200601120260504B">A01P7/00</further-classification>
        <further-classification edition="202301120260504B">C02F1/28</further-classification>
        <further-classification edition="201601120260504B">A23L33/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫奎斯特　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNDQUIST, ERIC G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧菲達尼　喬安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OFFIDANI, JOANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華　敦武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, DUENWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯維拉　泰瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASSIVERA, TERRY W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含雪矽鈣石(Tobermorite)且特徵係Ca/Si莫耳比為低於0.7、表面積大於50 m&lt;sup&gt;2&lt;/sup&gt;/g、以及CaO含量介於10與50 wt%之矽酸鈣粒子。本發明進一步關於其製造，以及矽酸鈣粒子用於移除磷酸鹽之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to calcium silicate particles comprising Tobermorite and characterized with a Ca/Si molar ratio of less than 0.7, Surface area greater than 50 m2/g, and CaO content of between 10 and 50 wt%. The invention further relates production thereof, and the use of calcium silicate particles for the removal of phosphate.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1601" publication-number="202632860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用斜率補償實現不對稱半橋電路的穩定操作的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR STABLE OPERATION OF ASYMETRIC HALF-BRIDGE CIRCUITS USING SLOPE COMPENSATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H02M3/04</main-classification>
        <further-classification edition="200601120260504B">H02M3/156</further-classification>
        <further-classification edition="200601120260504B">H02M1/08</further-classification>
        <further-classification edition="200601120260504B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商納維達斯半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAVITAS SEMICONDUCTOR LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查振旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHA, ZHENXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>於昌虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHANGHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余寅實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YINSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹海嘯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, HAIXIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路。該電路包含：第一開關，其具有第一閘極端子、第一源極端子及第一汲極端子，該第一汲極端子耦接到電感器的第一端子；第二開關，其具有第二閘極端子、第二源極端子及第二汲極端子，該第二汲極端子耦接到該電感器的第二端子；以及控制電路。在一個態樣中，該控制電路布置成：偵測表示流過該第二開關的電流的第一電壓訊號；使用斜率補償電路產生補償的參考訊號；基於該補償的參考訊號而產生閘極控制訊號；以及藉由將該閘極控制訊號施加到該第二閘極端子而控制該第二開關的傳導狀態，由此在廣泛範圍的工作週期內維持穩定的電路操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit. The circuit includes a first switch having a first gate terminal, a first source terminal and a first drain terminal, the first drain terminal coupled to a first terminal of an inductor, a second switch having a second gate terminal, a second source terminal and a second drain terminal, the second drain terminal coupled to a second terminal of the inductor, and a control circuit. In one aspect the control circuit is arranged to detect a first voltage signal representative of a current flowing through the second switch, generate a compensated reference signal using a slope compensation circuit, generate a gate control signal based on the compensated reference signal and control a conductivity state of the second switch by applying the gate control signal to the second gate terminal, thereby maintaining stable circuit operation over a broad range of duty cycles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路</p>
        <p type="p">102:高側開關Q1</p>
        <p type="p">104:低側開關Q2；第二開關</p>
        <p type="p">106:輸入端子</p>
        <p type="p">110:輸出端子；端子</p>
        <p type="p">112:感測電阻器；電流感測電阻器Rs；感測電阻器Rs</p>
        <p type="p">114:比較器</p>
        <p type="p">116:斜率補償電路</p>
        <p type="p">118:峰值電流參考電路；電路</p>
        <p type="p">120:求和電路</p>
        <p type="p">122:回授訊號FB</p>
        <p type="p">124:非反相輸入端子</p>
        <p type="p">126:反相輸入端子</p>
        <p type="p">128:輸出端子</p>
        <p type="p">130:閘極端子；端子</p>
        <p type="p">132:閘極端子</p>
        <p type="p">148:補償的參考訊號；補償的參考電壓訊號</p>
        <p type="p">150:電感器電流</p>
        <p type="p">Cout:輸出電容器</p>
        <p type="p">Cr:共振電容器</p>
        <p type="p">Dout:整流二極體</p>
        <p type="p">ICr:電容器電流；共振電容器電流</p>
        <p type="p">ILm:磁化電流</p>
        <p type="p">Lm:磁化電感；電感</p>
        <p type="p">Lr:共振電感器；電感；洩漏電感</p>
        <p type="p">Np:初級繞組</p>
        <p type="p">Ns:次級繞組</p>
        <p type="p">Vcs:電壓訊號</p>
        <p type="p">Vin:輸入電壓；輸入電壓源</p>
        <p type="p">Vo:輸出電壓</p>
        <p type="p">Vsw:開關節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1602" publication-number="202631146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療非何杰金氏淋巴瘤之療法</chinese-title>
        <english-title>THERAPY FOR THE TREATMENT OF NON-HODGKIN LYMPHOMA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/5377</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西建公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELGENE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡力爾　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLILE, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫德伯格　琳達　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNDBERG, LINDA MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　康妮艷慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CONNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞福　詹姆士　克里斯托弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RELF, JAMES CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇丁卓　阿克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDHINDRA, AKSHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余　唐納　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEE, DONALD LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了治療及/或管控非何杰金氏淋巴瘤之方法，該等方法包含向患者投予 2-(2,6-二側氧哌啶-3-基)-4-((2-氟-4-((3-N-嗎啉基四氫吖唉-1-基)甲基)苄基)胺基)異吲哚啉-1,3-二酮（「化合物 A、A-S 或 A-R」），或其鏡像異構物或鏡像異構物之混合物、互變異構物、同位素體、醫藥上可接受之鹽、溶劑合物、水合物、共晶體、晶籠化合物或多形體與格菲妥單抗或莫蘇妥珠單抗之組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating and/or managing non-Hodgkin lymphoma, which comprise administering to a patient 2-(2,6-dioxopiperidin-3-yl)-4-((2-fluoro-4-((3-morpholinoazetidin-1-yl)methyl)benzyl)amino)isoindoline-1,3-dione (“Compound A, A-S, or A-R”), or an enantiomer or mixture of enantiomers, a tautomer, an isotopolog, a pharmaceutically acceptable salt, solvate, hydrate, co-crystal, clathrate, or polymorph thereof, in combination with glofitamab or mosunetuzumab.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1603" publication-number="202631574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142915</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新穎含羥基環烷基之脂質化合物及其使用方法</chinese-title>
        <english-title>NOVEL HYDROXY CYCLOALKYL CONTAINING LIPID COMPOUNDS AND METHODS OF THEIR USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C237/06</main-classification>
        <further-classification edition="200601120260504B">C07C219/04</further-classification>
        <further-classification edition="202501120260504B">A61K9/127</further-classification>
        <further-classification edition="200601120260504B">A61K9/51</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/28</further-classification>
        <further-classification edition="200601120260504B">A61K47/14</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商阿奎特斯醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACUITAS THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　傑森　山繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, JASON SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶爾米　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEREMY, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞爾恩斯　史蒂芬　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARNS, STEPHEN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有下式(I)之化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="130px" width="267px" file="ed10217.JPG" alt="ed10217.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥上可接受之鹽、互變異構體或立體異構體，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;、L&lt;sup&gt;2a&lt;/sup&gt;、L&lt;sup&gt;2b&lt;/sup&gt;及環A係如本文所定義。亦提供該等化合物作為脂質奈米顆粒調配物之組分用於遞送治療劑之用途、包括該等化合物之組合物以及其使用及製備方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds are provided having the following Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="257px" file="ed10218.JPG" alt="ed10218.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt, tautomer, or stereoisomer thereof, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;2&lt;/sup&gt;, L&lt;sup&gt;2a&lt;/sup&gt;, L&lt;sup&gt;2b&lt;/sup&gt;, and ring A are as defined herein. Use of the compounds as a component of lipid nanoparticle formulations for delivery of a therapeutic agent, compositions comprising the compounds and methods for their use and preparation are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1604" publication-number="202633473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有貫孔的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE HAVING THROUGH VIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W70/63</main-classification>
        <further-classification edition="202601120260428B">H10W72/90</further-classification>
        <further-classification edition="202601120260428B">H10W90/20</further-classification>
        <further-classification edition="202601120260428B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李讚美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴在花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE-WHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文光辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, KWANGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金恩美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, EUNMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜泌圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, PIL-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供者為一種具有一貫孔之半導體裝置以及一種用於製造該半導體裝置之方法。該半導體裝置包含：一半導體晶片，其包括內含一記憶體胞元之一胞元區域；一周邊電路區域，其在一第一方向上堆疊在該胞元區域上且包括電氣連接至該記憶體胞元之一周邊電路元件；一貫孔，其在該第一方向上穿透該胞元區域及該周邊電路區域；一背側墊，其安置於該胞元區域下面且電氣連接至該貫孔；以及一前側墊，其安置於該周邊電路區域上面且電氣連接至該貫孔。該胞元區域包含環繞該記憶體胞元之一胞元絕緣層以及安置於該胞元絕緣層下面之一胞元基體。該周邊電路區域包含環繞該周邊電路元件之一周邊電路絕緣層以及安置於該周邊電路絕緣層下面之一周邊電路基體。該貫孔沿著該第一方向穿透該胞元基體、該胞元絕緣層、該周邊電路基體及該周邊電路絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device having a through via and a method for manufacturing of the semiconductor device are provided. The semiconductor device comprises a semiconductor chip including a cell area including a memory cell, a peripheral circuit area stacked on the cell area in a first direction and including a peripheral circuit element electrically connected to the memory cell, a through via penetrating the cell area and the peripheral circuit area in the first direction, a backside pad disposed below the cell area and electrically connected to the through via, and a frontside pad disposed above the peripheral circuit area and electrically connected to the through via. The cell area comprises a cell insulation layer surrounding the memory cell and a cell substrate disposed below the cell insulation layer. The peripheral circuit area comprises a peripheral circuit insulation layer surrounding the peripheral circuit element and a peripheral circuit substrate disposed below the peripheral circuit insulation layer. The through via penetrates the cell substrate, the cell insulation layer, the peripheral circuit substrate, and the peripheral circuit insulation layer along the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:胞元區域</p>
        <p type="p">110:胞元基體</p>
        <p type="p">120:胞元絕緣層</p>
        <p type="p">130:垂直通道電晶體</p>
        <p type="p">131:通道層</p>
        <p type="p">132:閘極電極</p>
        <p type="p">133:閘極絕緣層</p>
        <p type="p">134:位元線</p>
        <p type="p">135:連接墊</p>
        <p type="p">140:電容器</p>
        <p type="p">141:第一電極</p>
        <p type="p">142:介電層</p>
        <p type="p">143:第二電極</p>
        <p type="p">144:支撐結構</p>
        <p type="p">150:胞元佈線</p>
        <p type="p">200:周邊電路區域</p>
        <p type="p">210:周邊電路基體</p>
        <p type="p">220:周邊電路絕緣層</p>
        <p type="p">230:周邊電路元件</p>
        <p type="p">240:連接通孔</p>
        <p type="p">250:周邊電路佈線</p>
        <p type="p">300:貫孔</p>
        <p type="p">350:通孔絕緣層</p>
        <p type="p">410:層間絕緣層</p>
        <p type="p">420:晶片佈線結構</p>
        <p type="p">430:背側墊</p>
        <p type="p">431:背側鈍化層</p>
        <p type="p">435:背側接合層</p>
        <p type="p">440:前側墊</p>
        <p type="p">441:前側鈍化層</p>
        <p type="p">445:前側接合層</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">Q:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1605" publication-number="202631149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雄性激素合成抑制劑與PARP抑制劑聯合用於治療前列腺癌</chinese-title>
        <english-title>COMBINED USE OF ANDROGEN SYNTHESIS INHIBITORS AND PARP INHIBITORS FOR THE TREATMENT OF PROSTATE CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/553</main-classification>
        <further-classification edition="200601120260504B">A61K31/58</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P5/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海盛迪醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI SHENGDI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王泉人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QUANREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及雄性激素合成抑制劑與PARP抑制劑聯合用於治療前列腺癌。具體而言，本揭露涉及式1所示化合物或其可藥用鹽與雄性激素合成抑制劑在製備治療前列腺癌的藥物中的用途。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="147px" width="344px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the combined use of androgen synthesis inhibitors and PARP inhibitors for the treatment of prostate cancer. Specifically, the present disclosure relates to the use of a compound of formula 1 or its pharmaceutically acceptable salt in combination with an androgen synthesis inhibitor for the preparation of a medicament for treating prostate cancer.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="162px" width="374px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1606" publication-number="202633511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片封裝體及晶片封裝體的製造方法</chinese-title>
        <english-title>CHIP PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W76/10</main-classification>
        <further-classification edition="202601120260424B">H10W74/10</further-classification>
        <further-classification edition="202601120260424B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精材科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XINTEC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫唯倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEN, WEI-LUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片封裝體包括半導體基板、接合膠、支撐件、第一保護層與第二保護層。半導體基板的頂面具有導電墊與感測區，且半導體基板的頂面的角落具有溝槽。接合膠位於溝槽中。支撐件覆蓋接合膠與導電墊，且圍繞感測區。第一保護層位於半導體基板的底面。第二保護層覆蓋第一保護層、半導體基板的側壁與接合膠的側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip package includes a semiconductor substrate, a bonding adhesive, a support element, a first protection layer, and a second protection layer. The top surface of the semiconductor substrate has a conductive pad and a sensing area, and the corner of the top surface of the semiconductor substrate has a groove. The bonding adhesive is located in the groove. The support element covers the bonding adhesive and the conductive pad, and surrounds the sensing area. The first protection layer is located on the bottom surface of the semiconductor substrate. The second protection layer covers the first protection layer, the sidewall of the semiconductor substrate, and the lateral surface of the bonding adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶片封裝體</p>
        <p type="p">110:半導體基板</p>
        <p type="p">111:溝槽</p>
        <p type="p">112:導電墊</p>
        <p type="p">113:穿孔</p>
        <p type="p">114:感測區</p>
        <p type="p">120:接合膠</p>
        <p type="p">130:支撐件</p>
        <p type="p">132:缺口</p>
        <p type="p">140:第一保護層</p>
        <p type="p">150:第二保護層</p>
        <p type="p">160:透光片</p>
        <p type="p">170,170a:絕緣層</p>
        <p type="p">182:重佈線層</p>
        <p type="p">184:凸塊下金屬</p>
        <p type="p">186:導電結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1607" publication-number="202631683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種雙特異性抗體偶聯物及其製備方法和應用</chinese-title>
        <english-title>BISPECIFIC ANTIBODY-DRUG CONJUGATES, PREPARATION METHODS AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07D491/22</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覃肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>應　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YING, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種雙特異性抗體偶聯物及其製備方法和應用，生物製藥領域，具體涉及結合EGFR和/或c-Met的雙特異性抗體分子及其式I所示的偶聯物以及製備和使用這些偶聯物的方法，本發明還涉及包含所述雙特異性抗體的藥物偶聯物及其在治療癌症方面的相關應用。  &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="258px" file="ed10222.JPG" alt="ed10222.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to bispecific antibody-drug conjugates, preparation methods, and applications thereof in the field of biopharmaceuticals. Specifically, the invention relates to bispecific antibody molecules that bind to EGFR and/or c-Met, the conjugates thereof as shown in Formula I, and methods for preparing and using these conjugates. The invention also relates to drug conjugates containing the bispecific antibody and related applications in cancer treatment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1608" publication-number="202631022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒟蒻加工食品製造方法、蒟蒻加工食品製造裝置以及裝有內容物的膜包裝袋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260429B">A23L19/10</main-classification>
        <further-classification edition="201601120260429B">A23L5/00</further-classification>
        <further-classification edition="201601120260429B">A23P10/00</further-classification>
        <further-classification edition="201601120260429B">A23P30/36</further-classification>
        <further-classification edition="200601120260429B">B65B55/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商歐力希樂普蘭杜股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIHIRO PLANTDEW CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴田織寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUTA, ORIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種處理容易且易於食用之蒟蒻加工食品製造方法、蒟蒻加工食品製造裝置以及裝有內容物的膜包裝袋。蒟蒻加工食品製造方法係具有：條狀蒟蒻形成工序S1，係形成由複數條所構成的條狀蒟蒻2；脫水工序S2，係將條狀蒟蒻2脫水；糊賦予工序，係將蒟蒻糊3賦予至條狀蒟蒻2；切斷工序，係將條狀蒟蒻2切斷從而形成白瀧蒟蒻4；以及填充包裝工序，係將白瀧蒟蒻4填充於膜包裝袋7。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:條狀蒟蒻形成工序</p>
        <p type="p">S1a:煮熟工序</p>
        <p type="p">S1b:冷卻工序</p>
        <p type="p">S2:脫水工序</p>
        <p type="p">S3:糊賦予工序</p>
        <p type="p">S4:切斷工序</p>
        <p type="p">S5:填充包裝工序</p>
        <p type="p">S6:加熱殺菌煮沸工序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1609" publication-number="202631382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝飾膜、電子構件及觸控墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B32B15/08</main-classification>
        <further-classification edition="200601120260421B">B32B27/16</further-classification>
        <further-classification edition="200601120260421B">B32B27/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸田寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIDA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣克敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, KATSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種消光效果優異、賦予金屬質感、且白色感得到抑制的裝飾膜。一種裝飾膜，具有基材與反射層，所述裝飾膜滿足以下的要件（1）及要件（2）。（1）將自基材的與反射層為相反側入射、且相對於所述基材的不具有反射層的表面以90°的角度入射的波長380 nm～750 nm的光以80°的角度射出的反射率設為R&lt;sub&gt;80&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;，將以50°的角度射出的反射率設為R&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;時，R&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;/R&lt;sub&gt;80&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;為0.06～0.7。（2）將自基材的與反射層為相反側入射、且相對於所述基材的不具有反射層的表面以50°入射的波長380 nm～750 nm的光以130°的角度射出的反射率設為R&lt;sub&gt;130&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;，將以90°的角度射出的反射率設為R&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;時，R&lt;sub&gt;90&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;/R&lt;sub&gt;130&lt;/sub&gt;&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;50&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;為0.03～0.85。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝飾膜</p>
        <p type="p">21:表面</p>
        <p type="p">22:背面</p>
        <p type="p">31:反射層</p>
        <p type="p">41:基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1610" publication-number="202633206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142991</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像元件、製造方法、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F39/18</main-classification>
        <further-classification edition="202601120260504B">H10F39/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田代睦聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASHIRO, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於謀求進一步提高可靠性。  &lt;br/&gt;本發明之攝像元件包含：半導體基板，其就每一像素設置光電二極體；配線層，其對半導體基板積層，設置1層以上之金屬配線層；及吸收層，其以將金屬配線層遮光之方式設置於配線層，吸收雷射光。攝像元件係背面照射型，在較設置於配線層之自半導體基板側起第1層之金屬配線層靠半導體基板側配置吸收層。本技術例如可應用於CMOS影像感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:攝像元件</p>
        <p type="p">12B,12G,12R:像素</p>
        <p type="p">21:半導體基板</p>
        <p type="p">22:平坦化層</p>
        <p type="p">23:彩色濾光器層</p>
        <p type="p">24:晶載透鏡層</p>
        <p type="p">25:配線層</p>
        <p type="p">31:遮光膜</p>
        <p type="p">32:絕緣膜</p>
        <p type="p">33B,33G,33R:濾光器</p>
        <p type="p">34B,34G,34R:透鏡</p>
        <p type="p">41:絕緣膜</p>
        <p type="p">42-1~42-3:多晶矽電極</p>
        <p type="p">43-1,43-2:金屬配線層</p>
        <p type="p">44a-1~44a-3,44b-1~44b-3,44c-1~44c-3:貫通電極</p>
        <p type="p">45:鍺層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1611" publication-number="202631175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預防或減少因壓力而掉髮的組成物</chinese-title>
        <english-title>COMPOSITION FOR PREVENTING OR REDUCING HAIR LOSS DUE TO STRESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K36/41</main-classification>
        <further-classification edition="200601120260504B">A61K31/405</further-classification>
        <further-classification edition="200601120260504B">A61K31/122</further-classification>
        <further-classification edition="200601120260504B">A61P17/14</further-classification>
        <further-classification edition="201701120260504B">A61K8/9789</further-classification>
        <further-classification edition="200601120260504B">A61K8/64</further-classification>
        <further-classification edition="200601120260504B">A61K8/49</further-classification>
        <further-classification edition="200601120260504B">A61Q7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商朱利亞尼股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIULIANI S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱利亞尼　詹馬里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIULIANI, GIAMMARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平多　丹妮拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINTO, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬薩尼　芭芭拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARZANI, BARBARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕西尼　弗朗西斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASINI, FRANCESCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種化妝品及/或醫藥組成物，其用於預防或減少哺乳動物因壓力而掉髮及用於治療因壓力而加劇之毛髮生長疾病或毛髮生長病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a cosmetic and/or pharmaceutical composition for preventing or reducing hair loss of a mammal due to stress and for use in the treatment of a hair growth disease or hair growth disorder exacerbated by stress.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1612" publication-number="202631264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電防止層之製造方法及光學積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B05D5/12</main-classification>
        <further-classification edition="200601120260423B">B05D3/02</further-classification>
        <further-classification edition="200601120260423B">B05D7/24</further-classification>
        <further-classification edition="200601120260423B">B32B27/18</further-classification>
        <further-classification edition="201801120260423B">C09D7/61</further-classification>
        <further-classification edition="200601120260423B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本悟士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鶴留雅之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUDOME, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供之製造方法，係製造用於光學積層體之靜電防止層，該製造方法包含以下步驟：將包含導電材料、黏結劑樹脂及溶劑之塗敷液塗敷於基材之表面而形成塗佈膜；及，以滿足以下條件(1)及(2)之方式使塗佈膜乾燥，藉此去除溶劑而形成靜電防止層。導電材料為長度3µm以上且小於300µm之單層奈米碳管。&lt;br/&gt;  條件(1)：塗佈膜之乾燥溫度T為50℃以上。&lt;br/&gt;  條件(2)：從對基材之表面開始塗敷塗敷液至塗佈膜開始乾燥為止的時間Z為0.01秒以上且50秒以下。&lt;br/&gt;  該製造方法適合製造適於應用於車載等在嚴酷環境下使用之影像顯示裝置的靜電防止層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:靜電防止層</p>
        <p type="p">3,3A:光學積層體</p>
        <p type="p">4:光學薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1613" publication-number="202633355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏晶裝置、黏晶方法及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/50</main-classification>
        <further-classification edition="202601120260504B">H10P72/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷進科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能夠使晶粒與基板的面對準的精度提升之技術。  &lt;br/&gt;　　其解決手段，黏晶裝置具備接合頭、載置基板的接合台及控制部。  &lt;br/&gt;　　前述接合頭具備固定構件及可動構件，且被構成為前述可動構件的旋轉中心位於晶粒的下面，前述可動構件是具有將前述晶粒吸附於下端的夾頭，且相對於前述固定構件可擺動地配置。  &lt;br/&gt;　　控制部是被構成為可控制前述接合頭，在每次將前述晶粒載置於前述基板時，使前述晶粒的下面對齊被保持在前述接合台的前述基板的上面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41:接合頭</p>
        <p type="p">42:夾頭</p>
        <p type="p">42a:夾頭面</p>
        <p type="p">46:接合台</p>
        <p type="p">47:空氣配管</p>
        <p type="p">48:空氣配管</p>
        <p type="p">411:第一構件(固定構件)</p>
        <p type="p">411a:底面</p>
        <p type="p">412:第二構件(可動構件、第二可動構件)</p>
        <p type="p">412a:上面</p>
        <p type="p">413:第三構件</p>
        <p type="p">413a:銷</p>
        <p type="p">413b:長孔</p>
        <p type="p">C:旋轉中心</p>
        <p type="p">C1:旋轉中心</p>
        <p type="p">Cs:中心</p>
        <p type="p">D:晶粒</p>
        <p type="p">S:基板</p>
        <p type="p">Sa:安裝面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1614" publication-number="202632552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於排程工作行程的系統、方法及非揮發性電腦可讀儲存媒體</chinese-title>
        <english-title>SYSTEM AND METHOD FOR SCHEDULING WORK SCHEDULE AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">G06Q10/0631</main-classification>
        <further-classification edition="200601120251201B">G01C21/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃華威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一方面為一種用於排程工作行程的系統。系統包括載入資料模組，載入有關於工作行程的工作資料。系統同樣包括計算模組，通訊連接載入資料模組，以根據工作資料產生工單排序。系統同樣包括路徑規劃模組，通訊連接計算模組，以根據工單排序生成路徑資料。系統同樣包括位置判斷模組，通訊連接路徑規劃模組，以根據車輛的移動資訊及路徑資料判斷是否完成工作行程。若判斷工作行程已完成，記錄車輛的終點時間與終點位置。若判斷工作行程未完成，繼續根據車輛的移動資訊及路徑資料判斷是否完成工作行程。電腦程式產品同樣包括輸出模組，用於輸出車輛的移動資訊、終點時間與終點位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of the present disclosure features a system for scheduling a work schedule. The system includes a data loading module for loading work data related to the work schedule. The system also includes a calculation module communicatively connected to the data loading module for generating a work order sequence based on the work data. The system also includes a route planning module communicatively connected to the calculation module for generating route data based on the work order sequence. The system also includes a location determination module communicatively connected to the route planning module for determining whether the work schedule is completed based on a movement information of a vehicle and the route data. If it is determined that the work schedule has been completed, an end time and an end position of the vehicle are recorded. If it is determined that the working schedule is not completed, continues to determine whether the work schedule is completed based on a movement information of a vehicle and the route data. The computer program product also includes an output module for outputting the movement information, the end time and the end position of the vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:用於排程工作行程的系統</p>
        <p type="p">11:載入資料模組</p>
        <p type="p">12:計算模組</p>
        <p type="p">13:路徑規劃模組</p>
        <p type="p">14:資訊預處理模組</p>
        <p type="p">15:位置判斷模組</p>
        <p type="p">16:輸出模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1615" publication-number="202633311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於清潔半導體裝置及半導體裝置之載體的方法以及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR CLEANING SEMICONDUCTOR DEVICES AND CARRIERS FOR SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P70/00</main-classification>
        <further-classification edition="202601120260427B">H10P72/00</further-classification>
        <further-classification edition="200601120260427B">B08B9/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑邁斯特　科妮莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUMEISTER, CORNELIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加西米安薩法伊　曼達納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHASEMIANSAFAEI, MANDANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舍勒　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHERER, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECK, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭卡　布朗尼斯拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VRANKA, BRANISLAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普菲斯特　賽門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFISTER, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱智侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳立偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於清潔半導體製造領域中使用之物件的方法，該物件特別是半導體裝置，諸如晶圓及標線片、容器，特別是載體及/或存放盒，諸如FOUP、FOSB、EUV雙艙盒及表面，該方法包含一主要清潔程序，其中在該主要清潔程序之前進行一預處理程序及/或在該主要清潔程序之後進行一後處理程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method for cleaning items used in the field of semiconductor manufacturing, especially semiconductor devices such as wafers and reticles, containers, especially carrier and/or storage pods such as FOUPs, FOSBs, EUV double pods, and surfaces, comprising a main cleaning process, wherein the main cleaning process is preceded by a pre-treatment process and/or followed by a post-treatment process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:FOUP</p>
        <p type="p">110:預處理程序，步驟，污染量測</p>
        <p type="p">110a:步驟，預處理步驟</p>
        <p type="p">120:濕式清潔及乾燥步驟，子步驟，步驟，預處理步驟，主要清潔程序</p>
        <p type="p">130:真空步驟，子步驟，步驟，預處理步驟，主要清潔程序</p>
        <p type="p">140:吹掃步驟，子步驟，步驟，預處理步驟，主要清潔程序</p>
        <p type="p">140a:箭頭</p>
        <p type="p">150:後處理程序，污染量測，步驟</p>
        <p type="p">150a,160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1616" publication-number="202632002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>合成加帽mRNA之一鍋試管內轉錄</chinese-title>
        <english-title>SINGLE-POT IN VITRO TRANSCRIPTION OF SYNTHETIC CAPPED MRNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12P19/34</main-classification>
        <further-classification edition="200601120260504B">C12N15/11</further-classification>
        <further-classification edition="200601120260504B">C12N9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商阿內莫賽特有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANEMOCYTE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普波　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUPO, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於最佳化mRNA合成及穩定性之領域。  &lt;br/&gt;特定言之，本發明係關於用於合成加帽mRNA之一鍋（single-pot）試管內轉錄的方法及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention concerns the field of optimized mRNA synthesis and stability. &lt;br/&gt;Specifically, the invention relates to a method and kit for a single-pot &lt;i&gt;in vitro&lt;/i&gt; transcription of synthetic capped mRNA.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1617" publication-number="202631185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預防、減少及治療海蝨侵擾及感染的組合物</chinese-title>
        <english-title>COMPOSITION FOR PREVENTION, REDUCTION, AND/OR TREATMENT OF SEA LICE INFESTATION AND INFECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/00</main-classification>
        <further-classification edition="200601120260504B">A61K38/14</further-classification>
        <further-classification edition="200601120260504B">A61P33/14</further-classification>
        <further-classification edition="200601120260504B">A61P37/04</further-classification>
        <further-classification edition="201601120260504B">A23K20/147</further-classification>
        <further-classification edition="201601120260504B">A23K50/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福又達生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWEITZER BIOTECH COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燦堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭村勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TSUN-YUMG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大體上關於一種用於預防、減少及/或治療宿主之海蝨侵擾及感染，或用於調節宿主對抗海蝨之免疫反應的組合物。本發明亦關於該組合物用於預防、減少及/或治療宿主之海蝨侵擾及感染，或用於調節宿主對抗海蝨之免疫反應的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates generally to a composition for prevention, reduction, and/or treatment of sea lice infestation and infection of a host, or for modulation of immune response of a host against sea lice. The present invention also relates to the composition for use in prevention, reduction, and/or treatment of sea lice infestation and infection of a host, or for use in modulation of immune response of a host against sea lice.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1618" publication-number="202631983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細胞培養套組、細胞培養體的製造方法及收容於容器的細胞培養體</chinese-title>
        <english-title>CELL CULTURE KIT, METHOD FOR PRODUCING CELL CULTURE PRODUCT AND CELL CULTURE CONTAINED IN A CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12M3/00</main-classification>
        <further-classification edition="200601120260504B">C12N5/04</further-classification>
        <further-classification edition="201001120260504B">C12N5/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人山口大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱野公一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMANO, KIMIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野耕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">細胞培養套組（100）具備培養容器（110）、蓋體（130）與環狀部件（170）。培養容器（110）於內部形成有用以培養細胞之培養空間（111）且包含與該培養空間（111）連通的開口（114a）。蓋體（130）係用以堵塞開口（114a）而能夠裝卸於培養容器（110）者。環狀部件（170）係上下開放之環狀且以能夠拆卸之方式收容於培養空間（111）。環狀部件（170）的高度為培養空間（111）的高度以下。環狀部件（170）包含為了取出環狀部件（170）而形成可支承之凸起的被支承部（172）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The cell culture kit (100) comprises a culture vessel (110), a lid (130), and a ring-shaped member (170). The culture vessel (110) has a culture space (111) formed inside for culturing cells and includes an aperture (114a) connected to the culture space (111). The lid (130) is detachably attached to the culture vessel (110) in order to cover the aperture (114a). The ring-shaped member (170) is ring-shaped with open top and bottom, and is removably contained in the culture space (111). The height of the ring-shaped member (170) is equal to or lower than the height of the culture space (111). The ring-shaped member (170) includes a holding portion (172) forming a protrusion which is held to remove the ring-shaped member (170).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:細胞培養套組</p>
        <p type="p">110:培養容器</p>
        <p type="p">111:培養空間</p>
        <p type="p">112:底部</p>
        <p type="p">113:側壁部</p>
        <p type="p">113a:第1聯固部</p>
        <p type="p">114:開口部</p>
        <p type="p">114a:開口</p>
        <p type="p">130:蓋體</p>
        <p type="p">131:蓋部</p>
        <p type="p">132:垂下部</p>
        <p type="p">132a:第2聯固部</p>
        <p type="p">150:培養薄片</p>
        <p type="p">170:環狀部件</p>
        <p type="p">171:本體部</p>
        <p type="p">172:被支承部</p>
        <p type="p">172a,172b,172c,172d:相對面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1619" publication-number="202631579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含有機聚合物及官能化萜烯之組成物以及濕式蝕刻之方法</chinese-title>
        <english-title>COMPOSITION COMPRISING ORGANIC POLYMER AND FUNCTIONALIZED TERPENES AND METHODS OF WET ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C323/25</main-classification>
        <further-classification edition="200601120260504B">C08K5/372</further-classification>
        <further-classification edition="200601120260504B">C08L45/00</further-classification>
        <further-classification edition="200601120260504B">C08L79/08</further-classification>
        <further-classification edition="200601120260504B">C09J11/06</further-classification>
        <further-classification edition="200601120260504B">C09J145/00</further-classification>
        <further-classification edition="200601120260504B">C09J179/08</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">B32B15/20</further-classification>
        <further-classification edition="200601120260504B">B32B7/12</further-classification>
        <further-classification edition="200601120260504B">H05K3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特曼　湯普森　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTMANN-THOMPSON, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種組成物，其包含有機聚合物；及至少0.25wt.%之包含萜烯部份的化合物，該萜烯部份包含至少8個碳原子及選自胺、酸酐、醯亞胺或羧酸之官能基。亦描述了物品、方法、及官能化萜烯化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition is described comprising an organic polymer; and at least 0.25 wt.% of a compound comprising a terpene moiety comprising at least 8 carbon atoms and a functional group selected from amine, anhydride, imide or carboxylic acid. Also described are articles, methods, and functionalized terpene compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:三層物品</p>
        <p type="p">221:第一基材</p>
        <p type="p">222:第二基材或層</p>
        <p type="p">230:黏著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1620" publication-number="202633257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過晶圓鍵合與基板移除使化合物半導體薄膜結構整合於大尺寸基板上</chinese-title>
        <english-title>INTEGRATION OF COMPOUND SEMICONDUCTOR THIN FILM STRUCTURES ON LARGE-DIAMETER SUBSTRATES WITH WAFER BONDING AND SUBSTRATE REMOVAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P10/00</main-classification>
        <further-classification edition="202601120260423B">H10P52/40</further-classification>
        <further-classification edition="202601120260423B">H10P50/64</further-classification>
        <further-classification edition="202601120260423B">H10P14/20</further-classification>
        <further-classification edition="200601120260423B">G02B6/12</further-classification>
        <further-classification edition="200601120260423B">H01S5/343</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾盧瑪公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AELUMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯內利　席夢　蘇蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUNELLI, SIMONE SURAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉姆金　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLAMKIN, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, BEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達默　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMMER, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭廷頓　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNTINGTON, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供將化合物半導體(CS)材料及裝置添加至大尺寸基板平台之可擴展製造方法。此方法包括形成覆於大尺寸基板晶圓上之CS緩衝層，接著終止蝕刻層，最後裝置層結構，以實現高載子遷移率、光學增益或吸收或光學非線性。此裝置晶圓接著頂側朝下鍵合至光子基板平台。透過研磨、拋光或蝕刻製程移除下方基板。一些CS層(包括緩衝層及終止蝕刻層)可被移除而僅留下最終裝置層。此最終層可經圖案化以形成波導或裝置結構；可經離子佈植步驟形成p-n接面；且可經其他常見製造步驟以形成裝置。此等裝置結構亦可被封裝並透過頂層金屬接點及通孔進行處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides scalable manufacturing approaches to add compound semiconductor (CS) materials and devices to large-diameter substrate platforms. The method includes forming a CS buffer layer overlying the large-diameter substrate wafer, then a stop etch layer, and finally a device layer structure for high carrier mobility, optical gain or absorption, or optical nonlinearity. This device wafer is then bonded, topside down, to a photonics substrate platform. The underlying substrate is removed with grinding, polishing, or etching processes. Some of the CS layers, including the buffer and the stop etch layer, may be removed thereby leaving only the final device layer. This final layer may be patterned to form waveguides or device structures; may be exposed to ion implantation steps to form p-n junctions; and may be subjected to other common fabrication steps to form devices. These device structures may also be encapsulated and addressed through top-level metal contacts and vias.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:系統</p>
        <p type="p">610:矽基板</p>
        <p type="p">620:熱氧化物層</p>
        <p type="p">630:低損耗移相器裝置</p>
        <p type="p">632:加熱器元件</p>
        <p type="p">634:SiN層</p>
        <p type="p">636:絕緣體上矽(SOI)層</p>
        <p type="p">640:量子點(QD)發射器裝置</p>
        <p type="p">642:整合式增益裝置</p>
        <p type="p">644:量子點</p>
        <p type="p">650:裝置</p>
        <p type="p">652:整合式源層</p>
        <p type="p">660:光電二極體裝置</p>
        <p type="p">662:光電二極體裝置層</p>
        <p type="p">664:SOI層</p>
        <p type="p">670:光柵耦合器</p>
        <p type="p">680:低損耗SOI層</p>
        <p type="p">690:邊緣耦合器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1621" publication-number="202632834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池充電系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H02J7/04</main-classification>
        <further-classification edition="202601120260422B">H02J7/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛麗思歐雅瑪股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OHYAMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電池充電系統（A1）具有自主行走的機器人（B1）和充電器（C1）。機器人（B1）具有用於驅動機器人（B1）的電池部（1B）、用於控制機器人（B1）的機器人控制部（2B）、用於進行PLC通訊的第1PLC通訊部（4B）、以及用於連接充電器（C1）的第1連接器（5B）。充電器（C1）具有用於對電池部（1B）充電的充電控制部（1C）、用於控制充電器（C1）的充電器控制部（2C）、用於進行PLC通訊的第2PLC通訊部（4C）、以及用於連接機器人（B1）的第2連接器（5C）。第1PLC通訊部（4B）和第2PLC通訊部（4C），透過連接電池部（1B）和充電控制部（1C）的電源線（9B）和（9C），傳送和接收用於充電的控制資訊。藉由此種配置，可以減少連接器中的連接端子數量，從而更容易地連接連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:電池充電系統</p>
        <p type="p">B1:機器人</p>
        <p type="p">C1:充電器</p>
        <p type="p">1B:電池部</p>
        <p type="p">1C:充電控制部</p>
        <p type="p">2B:機器人控制部</p>
        <p type="p">2C:充電器控制部</p>
        <p type="p">3B,3C:電源部</p>
        <p type="p">4B:第1PLC通訊部</p>
        <p type="p">4C:第2PLC通訊部</p>
        <p type="p">5B:第1連接器</p>
        <p type="p">5C:第2連接器</p>
        <p type="p">6B:機器人負載開關</p>
        <p type="p">6C:充電器負載開關</p>
        <p type="p">8C:連接感測器</p>
        <p type="p">9B,9C:電源線</p>
        <p type="p">11B:電池單元</p>
        <p type="p">11C:電流/電壓偵測部</p>
        <p type="p">12B:通訊控制部</p>
        <p type="p">52B:電極板</p>
        <p type="p">52C:接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1622" publication-number="202631152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粒線體標靶藥物ＤＲ２０及其運用於治療肺動脈高壓、肺纖維化與肺癌的功效</chinese-title>
        <english-title>THE EFFECTIVENESS OF THE MITOCHONDRIAL-TARGETED DRUG DR20 FOR TREATMENT OF PULMONARY HYPERTENSION, PULMONARY FIBROSIS, AND LUNG CANCER.</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/661</main-classification>
        <further-classification edition="200601120260504B">C07F9/54</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P11/00</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉博侖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PO-LEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫孚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HSUAN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭孟軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MENG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及藥物領域，具體涉及化合物、組合物以及它們用途，透過提供的化合物其能有效地抑制與粒線體功能障礙相關疾病其病理進展，促進細胞功能的恢復，現今常見的粒線體功能障礙疾病包含：肺動脈高壓、肺纖維化及非小型細胞肺癌。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the field of pharmaceuticals, specifically to compounds, compositions, and their applications. The provided compounds effectively inhibit the pathological progression of diseases associated with mitochondrial dysfunction and promote the restoration of cellular function. Common mitochondrial dysfunction-related diseases include pulmonary arterial hypertension, pulmonary fibrosis, and non-small cell lung cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1623" publication-number="202631100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">A61F13/84</main-classification>
        <further-classification edition="200601120260423B">A61L15/34</further-classification>
        <further-classification edition="200601120260423B">A61F13/535</further-classification>
        <further-classification edition="200601120260423B">A61F13/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優你　嬌美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICHARM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡亮輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大窪哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白石大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAISHI, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種吸收性物品，是既能夠抑制因汗液引起的肌膚問題的同時，也能夠抑制因水分的喪失引起的肌膚問題。吸收性物品(1)具備覆蓋穿著者的腹部的腹側部(3)、覆蓋背部的背側部(2)、以及覆蓋胯間部且包含吸收體的吸收性本體(4)。吸收性本體(4)是長方向上的前側及後側的端部，分別延伸至腹側部(3)及背側部(2)上的寬方向的中央的部分。吸收性物品(1)進一步具備：配置於腹側部(3)或背側部(2)的肌膚抵接面(3S或2S)上的吸汗薄片(46)、以及配置於腹側部(3)或背側部(2)的肌膚抵接面(3S或2S)上的保濕劑(SC)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:背側部</p>
        <p type="p">2a:背側接合部</p>
        <p type="p">2S:肌膚抵接面</p>
        <p type="p">2EA:存在區域</p>
        <p type="p">3:腹側部</p>
        <p type="p">3a:腹側接合部</p>
        <p type="p">3S:肌膚抵接面</p>
        <p type="p">3EA:存在區域</p>
        <p type="p">SC:保濕劑</p>
        <p type="p">4:吸收性本體</p>
        <p type="p">CL:長方向中心線</p>
        <p type="p">46:吸汗薄片構件</p>
        <p type="p">46S:肌膚抵接面</p>
        <p type="p">46EA:存在區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1624" publication-number="202631482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於家禽的性能監測和數據收集系統</chinese-title>
        <english-title>PERFORMANCE MONITORING AND DATA COLLECTION SYSTEM FOR POULTRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">B66C1/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國商百應股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALYX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　秉軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, BENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許祐誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種用於家禽的性能監測和數據收集系統，其包括平台、包括至少一個相機的電子設備、重量測量組件、可旋轉懸掛組件、具有多方向旋轉功能的連接機構以及懸吊組件，其中電子設備設置在平台中，重量測量組件設置在平台上。此外，可旋轉懸掛組件連接到重量測量組件，懸吊組件附接到家禽舍的天花板或橫樑，並且重量測量組件和平台通過懸吊組件經由連接機構懸掛在天花板或橫樑下方。因此，平台的擺動可以通過可旋轉懸掛組件和連接機構來平衡，使得可以精確地執行家禽的重量測量和身體生長監測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A performance monitoring and data collection system for poultry is disclosed, which comprises a platform, an electronic device including at least one camera, a weight measuring assembly, a rotatable hanging assembly, a connection mechanism with a function of multi-direction rotatable, and a suspended assembly, of which the electronic device is disposed in the platform, and the weight measuring assembly is disposed on the platform. Moreover, the rotatable hanging assembly is connected to the weight measuring assembly, the suspended assembly is attached to a ceiling or a crossbeam of a poultry house, and the weight measuring assembly and the platform is suspended, by the suspended assembly, under the ceiling or the crossbeam via the connection mechanism. As such, the wobbling of the platform can be balanced by the rotatable hanging assembly and the connection mechanism, such that weight measurement and body growth monitoring of the poultry can be carried out precisely.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:性能監測和數據收集系統</p>
        <p type="p">11:平台</p>
        <p type="p">12:第一電子設備</p>
        <p type="p">12C:相機</p>
        <p type="p">13:重量測量組件</p>
        <p type="p">14:可旋轉懸掛組件</p>
        <p type="p">15:鉤環螺栓單元</p>
        <p type="p">16:連接機構</p>
        <p type="p">17:懸吊組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1625" publication-number="202633457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含電感器的整合裝置</chinese-title>
        <english-title>INTEGRATED DEVICE COMPRISING AN INDUCTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W70/02</main-classification>
        <further-classification edition="202601120260504B">H10W70/20</further-classification>
        <further-classification edition="202501120260504B">H10D1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏曉宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, HSIAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　陽陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUJEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含一整合裝置及透過複數個焊料互連件耦接至該整合裝置的一基材。該整合裝置包含一晶粒基材；一晶粒互連部分，其耦接至該晶粒基材；複數個墊互連件，其耦接至該晶粒互連部分；複數個柱互連件，其耦接至該複數個墊互連件；及複數個互連件，其耦接至該複數個柱互連件，其中來自該複數個墊互連件之至少一個墊互連件、來自該複數個柱互連件之至少一個柱互連件、及來自該複數個互連件之至少一個互連件經組態為一電感器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising an integrated device and a substrate coupled to the integrated device through a plurality of solder interconnects. The integrated device comprises a die substrate; a die interconnection portion coupled to the die substrate; a plurality of pad interconnects coupled to the die interconnection portion; a plurality of pillar interconnects coupled to the plurality of pad interconnects; and a plurality of interconnects coupled to the plurality of pillar interconnects, wherein at least one pad interconnect from the plurality of pad interconnects, at least one pillar interconnects from the plurality of pillar interconnects and at least one interconnect from the plurality of interconnects are configured as an inductor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:整合裝置</p>
        <p type="p">201:電感器</p>
        <p type="p">202:晶粒基材部分</p>
        <p type="p">203:墊互連件</p>
        <p type="p">203a:墊互連件</p>
        <p type="p">203b:墊互連件</p>
        <p type="p">203c:墊互連件</p>
        <p type="p">203d:墊互連件</p>
        <p type="p">204:晶粒互連部分</p>
        <p type="p">205:磁性層</p>
        <p type="p">206:鈍化層</p>
        <p type="p">207:柱互連件</p>
        <p type="p">207a:柱互連件</p>
        <p type="p">207b:柱互連件</p>
        <p type="p">207c:柱互連件</p>
        <p type="p">207d:柱互連件</p>
        <p type="p">208:囊封層</p>
        <p type="p">209:互連件</p>
        <p type="p">209a:互連件</p>
        <p type="p">209b:互連件</p>
        <p type="p">209c:互連件</p>
        <p type="p">220:晶粒基材</p>
        <p type="p">222:主動區</p>
        <p type="p">240:介電層</p>
        <p type="p">242:晶粒互連件</p>
        <p type="p">242a:晶粒互連件</p>
        <p type="p">270:晶種層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1626" publication-number="202632020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有抗裂性的鋼材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C22C38/42</main-classification>
        <further-classification edition="200601120260504B">C22C38/44</further-classification>
        <further-classification edition="200601120260504B">C22C38/48</further-classification>
        <further-classification edition="200601120260504B">C21D8/06</further-classification>
        <further-classification edition="200601120260504B">B21B1/16</further-classification>
        <further-classification edition="200601120260504B">B21B3/02</further-classification>
        <further-classification edition="200601120260504B">B21B37/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山陽特殊製鋼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYO SPECIAL STEEL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美谷章生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITANI, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的在於提供一種可進一步減低在冷加工中賦予壓縮應力時之變形阻力及破裂發生機率的鋼材，及/或提供一種由於可抑制破裂發生，變形阻力低且具有優良的加工性，而能夠省略冷鍛造前之球化退火處理的低成本鋼材；為達成所述目的，而提供一種鋼材，其係用於由機械構造用鋼所構成的冷鍛造加工，其中將鋼材由壓縮率X%進行冷壓縮加工至壓縮率Y%時之壓縮應力之變化量ΔP(MPa)相對於壓縮變形量ΔL(mm)的比ΔP/ΔL為30MPa/mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:與鋼棒的軋製方向垂直之剖面</p>
        <p type="p">2:與鋼棒的軋製方向垂直之剖面的中心</p>
        <p type="p">3:與鋼棒的軋製方向平行之剖面</p>
        <p type="p">4:鋼棒的中心位置</p>
        <p type="p">5:距表面D/2之深度的位置</p>
        <p type="p">6:距表面D/4之深度的位置</p>
        <p type="p">D:鋼材的直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1627" publication-number="202631762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主鏈可切斷的嵌段共聚物、包含其的光阻劑組成物以及圖案形成方法</chinese-title>
        <english-title>MAIN CHAIN SCISSIONABLE BLOCK COPOLYMERS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F293/00</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬蘭戈尼　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARANGONI, TOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱茨　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAITZ, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡德　埃馬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AQAD, EMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MINGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種嵌段共聚物，其包含中心嵌段，該中心嵌段在嵌段共聚物的主鏈中包含酸不穩定基團；和共價附接到中心嵌段的至少兩個共聚物臂，其中每個共聚物臂包含第一重複單元和不同於第一重複單元的第二重複單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A block copolymer, comprising a center block comprising an acid-labile group in a backbone of the block copolymer; and at least two copolymer arms covalently attached to the center block, wherein each copolymer arm comprises a first repeating unit, and a second repeating unit that is different from the first repeating unit.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1628" publication-number="202632069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143312</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無電解Ni鍍液、無電解Ni鍍覆方法、Ni鍍覆皮膜及產品</chinese-title>
        <english-title>ELECTROLESS Ni PLATING SOLUTION, ELECTROLESS Ni PLATING METHOD, Ni PLATING FILM, AND PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C18/36</main-classification>
        <further-classification edition="200601120260504B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧野製藥工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUNO CHEMICAL INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田竜士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤竜司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長尾敏光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAO, TOSHIMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種浴槽穩定性、圖案析出性及微小墊部之鍍覆析出性良好，且具備優異之焊接連接可靠性及表面平滑性之Ni鍍覆皮膜，以及一種適用於形成前述鍍覆皮膜之無電解Ni鍍液。  &lt;br/&gt;[解決手段] 使用至少包含S&lt;sup&gt;2+&lt;/sup&gt;與Co金屬之無電解Ni鍍液，且前述Co金屬以Co&lt;sup&gt;2+&lt;/sup&gt;及Co&lt;sup&gt;3+&lt;/sup&gt;之形態包含在內之無電解Ni鍍液，對被鍍覆物進行表面處理，於被鍍覆物上形成Ni鍍覆皮膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem] To provide a Ni plating film with excellent bath stability, pattern precipitation properties, and plating deposition properties in minute pad areas, as well as superior solder joint reliability and surface smoothness, and an electroless Ni plating solution useful for forming the plating film. &lt;br/&gt;[Solution] A Ni plating film is formed on an object to be plated by performing surface treatment on the object to be plated using an electroless Ni plating solution containing at least S&lt;sup&gt;2+&lt;/sup&gt; and a Co metal, wherein the Co metal is contained in the form of Co&lt;sup&gt;2+&lt;/sup&gt; and Co&lt;sup&gt;3+&lt;/sup&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1629" publication-number="202631611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜芳族吲哚磺醯胺</chinese-title>
        <english-title>HETEROAROMATIC INDOLESULFONAMIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D417/12</main-classification>
        <further-classification edition="200601120260504B">A61K31/427</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商種子醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEED THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托納　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONRA, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於可用作剪接因子RBM39之調節劑之化合物。本發明亦揭示可包含式(I)化合物之醫藥組合物、其用途及製備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosures relate to compounds that can be useful as modulators of splicing factor RBM39. Also disclosed herein are pharmaceutical compositions that can include a compound of Formula (I), the use and preparation thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1630" publication-number="202631922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面聚合物對環氧材料之化學結合</chinese-title>
        <english-title>CHEMICAL BINDING OF SURFACE POLYMER TO EPOXY MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260416B">C09J7/10</main-classification>
        <further-classification edition="200601120260416B">C08G59/18</further-classification>
        <further-classification edition="200601120260416B">C08F2/36</further-classification>
        <further-classification edition="200601120260416B">B32B37/14</further-classification>
        <further-classification edition="200601120260416B">B32B27/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈森　尼古拉　伊南瓦克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, NICOLAJ INUNNGUAQ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里斯騰森　麥克爾　艾拉旺　佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISTENSEN, MICHAEL ELLEVANG PAGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利勒索魯普　麥　布盧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LILLETHORUP, MIE BLOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔斯菲爾特　米凱爾　史考克耶爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONGSFELT, MIKKEL SKORKJAER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉亞南　普爾尼瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAYANAN, PURNIMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里姆　Ｍ　齊亞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIM, M ZIAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於表面聚合物對環氧材料之化學結合。更具體而言，本發明係關於環氧材料藉由基板上形成之表面聚合物中存在之官能基對該環氧材料中存在之官能基之鍵結而黏著至該基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the chemical binding of surface polymers to epoxy materials. More specifically, the present disclosure relates to the adhesion of an epoxy material to a substrate by bonding of functional groups present in a surface polymer formed on a substrate to functional groups present in the epoxy material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:裝置堆疊</p>
        <p type="p">201:環氧材料</p>
        <p type="p">202:表面聚合物</p>
        <p type="p">203:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1631" publication-number="202633005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>終端、方法、基地台及通訊系統</chinese-title>
        <english-title>TERMINAL, METHOD, BASE STATION AND COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W88/06</main-classification>
        <further-classification edition="202401120260504B">H04W74/08</further-classification>
        <further-classification edition="200901120260504B">H04W36/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇內爾　凱埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNELL, KAI-ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水崇之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿澤利爾　克勞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARZELIER, CLAUDE J.F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一態樣的終端包含：接收器，被配置以接收從第一模式切換至第二模式之切換時間的指示以及起始於該切換時間之傳輸時窗的長度；處理器，被配置以決定在該傳輸時窗內之傳輸時間；以及傳送器，被配置以在所決定之該傳輸時間發起傳輸。根據本發明之一態樣，可適當地達成防止訊務激增、降低信令開銷、及/或提升整體系統效率/吞吐量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal according to one aspect of the present disclosure comprising: a receiver configured to receive an indication of a switching time from a first mode to a second mode and a length of a transmission window that starts at the switching time; a processor configured to determine a transmission time within the transmission window; and a transmitter configured to initiate a transmission at the determined transmission time. According to one aspect of the present disclosure, preventing traffic surges, reduced signaling overhead, and/or improving overall system efficiency/throughput can be achieved appropriately.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1632" publication-number="202631554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>１，１，１，２－四氟乙烷的精製方法</chinese-title>
        <english-title>REFINING METHOD OF 1,1,1,2-TETRAFLUOROETHANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C17/38</main-classification>
        <further-classification edition="200601120260504B">C07C19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江藤友亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村新吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木克親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, YOSHICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山明平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, AKINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋詰都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZUME, MIYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種精製方法，其係從包含1,1,1,2-四氟乙烷及具有1個以上雙鍵之氟碳系化合物之混合氣體精製1,1,1,2-四氟乙烷之方法，該精製方法包含加熱處理前述混合氣體之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for refining 1,1,1,2-tetrafluoroethane from a mixed gas containing 1,1,1,2-tetrafluoroethane and a fluorocarbon compound having one or more double bonds, the method comprising a step of heat-treating the above mixed gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1633" publication-number="202632431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於ＥＵＶ投影微影的照明光學單元的場琢面鏡</chinese-title>
        <english-title>FIELD FACET MIRROR FOR AN ILLUMINATION OPTICS UNIT FOR EUV PROJECTION LITHOGRAPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/20</main-classification>
        <further-classification edition="201201120260504B">G03F1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾德　休伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLDERER, HUBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙珀　麗貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMPER, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞茨　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEITZ, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費肯　海瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINKEN, REIMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉莫拉　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMOLLA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種用於EUV投影微影的照明光學單元的場琢面鏡，該場琢面鏡體現於在照明光學單元的一場平面的區域內的配置。該場琢面鏡具有多個場琢面（25&lt;sub&gt;T&lt;/sub&gt;），場琢面（25&lt;sub&gt;T&lt;/sub&gt;）用於將來自一光源的照明光（16）朝一物場反射傳輸，並且照明光強度在該物場的場高上伴隨有預定的分布。至少一些的場琢面以局部場照明琢面（25&lt;sub&gt;T&lt;/sub&gt;）的形式體現。這些場照明琢面具有一局部場照明琢面反射部分（31），用於將來自該光源的作為使用照明光的照明光（16&lt;sub&gt;TF&lt;/sub&gt;）朝該物場中比該物場小的一局部物場部分反射傳輸。此外，各別的局部場照明琢面（25&lt;sub&gt;T&lt;/sub&gt;）具有一輸出耦合琢面反射部分（32），用於將來自該光源的作為輸出耦合照明光的照明光（16&lt;sub&gt;AK&lt;/sub&gt;）朝至少一個輸出耦合組件反射傳輸。首先局部場照明琢面反射部分（31）以及其次輸出耦合琢面反射部分（32）代表各別局部場照明琢面（25&lt;sub&gt;T&lt;/sub&gt;）的組成零件，它們相對彼此固定。由此形成一場琢面鏡，利用該場琢面鏡，可以在至少一個物場座標上實現具有挑戰性規格的照明強度分布，而不會產生不期望的副作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A field facet mirror for an illumination optics unit for EUV projection lithography is embodied for arrangement in the region of a field plane of the illumination optics unit. The field facet mirror has a plurality of field facets (25&lt;sub&gt;T&lt;/sub&gt;) for the reflective transfer of illumination light (16) from a light source towards an object field with a predetermined distribution of an illumination light intensity over a field height of the object field. At least some of the field facets are embodied as partial field illumination facets (25&lt;sub&gt;T&lt;/sub&gt;). These have a partial field illumination facet reflection portion (31) for the reflective transfer of the illumination light (16&lt;sub&gt;TF&lt;/sub&gt;) as used illumination light from the light source towards a partial object field portion of the object field that is smaller than the object field. Furthermore, the respective partial field illumination facet (25&lt;sub&gt;T&lt;/sub&gt;) has an output-coupling facet reflection portion (32) for the reflective transfer of the illumination light (16&lt;sub&gt;AK&lt;/sub&gt;) as output-coupled illumination light from the light source towards at least one output-coupling component. Firstly the partial field illumination facet reflection portion (31) and secondly the output-coupling facet reflection portion (32) represent component parts of the respective partial field illumination facet (25&lt;sub&gt;T&lt;/sub&gt;) that are fixed with respect to each other. This yields a field facet mirror, by means of which a challenging specification of an illumination intensity distribution over at least one object field coordinate is achieved without unwanted consequential effects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16&lt;sub&gt;AK&lt;/sub&gt;:光線；輸出耦合光路；輸出耦合照明光</p>
        <p type="p">16&lt;sub&gt;TF&lt;/sub&gt;:光線；局部場照明光線；照明光</p>
        <p type="p">25&lt;sub&gt;T&lt;/sub&gt;:場琢面；局部場照明琢面</p>
        <p type="p">31:局部場照明琢面反射部分；反射部分；反射表面部分</p>
        <p type="p">32:輸出耦合琢面反射部分；輸出耦合琢面反射表面部分</p>
        <p type="p">33:配置平面</p>
        <p type="p">34:主體</p>
        <p type="p">35:邊緣區域</p>
        <p type="p">α:傾斜角；角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1634" publication-number="202631362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B29C43/12</main-classification>
        <further-classification edition="200601120260504B">B29C43/32</further-classification>
        <further-classification edition="200601120260504B">B29C43/36</further-classification>
        <further-classification edition="200601120260504B">B29C43/56</further-classification>
        <further-classification edition="200601120260504B">B29C33/40</further-classification>
        <further-classification edition="200601320260504B">B29K101/10</further-classification>
        <further-classification edition="200601320260504B">B29K105/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石內由圭里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIUCHI, YUKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水沙也加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大園達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZONO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種成形體之製造方法，其可減少固體廢棄物。一種成形體之製造方法，其依序包含：將成形材料收納在具有水溶性之封袋薄膜的真空袋之步驟；使前述成形材料硬化之步驟；與利用水來溶解前述封袋薄膜之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封袋薄膜</p>
        <p type="p">2:真空袋</p>
        <p type="p">3:成形材料</p>
        <p type="p">4:模具</p>
        <p type="p">5:密封構件</p>
        <p type="p">6:真空閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1635" publication-number="202631584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143359</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含羧基雜環類衍生物調節劑、其製備方法和應用</chinese-title>
        <english-title>CARBOXYL-CONTAINING HETEROCYCLIC DERIVATIVE MODULATOR, PREPARATION METHOD THEREFOR, AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D207/16</main-classification>
        <further-classification edition="200601120260504B">C07D405/12</further-classification>
        <further-classification edition="200601120260504B">C07D403/12</further-classification>
        <further-classification edition="200601120260504B">C07D417/12</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D498/04</further-classification>
        <further-classification edition="200601120260504B">C07F5/02</further-classification>
        <further-classification edition="200601120260504B">C07F5/04</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/40</further-classification>
        <further-classification edition="200601120260504B">A61K31/416</further-classification>
        <further-classification edition="200601120260504B">A61K31/415</further-classification>
        <further-classification edition="200601120260504B">A61K31/438</further-classification>
        <further-classification edition="200601120260504B">A61K31/4025</further-classification>
        <further-classification edition="200601120260504B">A61K31/4439</further-classification>
        <further-classification edition="200601120260504B">A61K31/428</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K33/22</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方李超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LICHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金芳芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FANGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧嘉晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, JIACHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛梟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, XIAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及含羧基雜環類衍生物調節劑、其製備方法和應用。特別地，本發明涉及通式(I)所示的化合物、其製備方法及含有該化合物的醫藥組成物，及其作為調節劑在製備治療糖尿病、肥胖症、NASH、腎臟疾病及其相關的病症藥物中的用途，其中通式(I)中的各取代基與說明書中的定義相同。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="135px" width="347px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a carboxyl-containing heterocyclic derivative regulators, a preparation method therefor and a use thereof. Particularly, the present invention relates to a compound represented by general formula (I), a preparation method therefor, and a pharmaceutical composition containing the compound, as well as a use of the compound as a regulator in the preparation of drugs for treating diabetes, obesity, NASH, kidney diseases and related disorders, wherein each substituent in the general formula (I) is the same as defined in the specification.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="146px" width="324px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1636" publication-number="202631434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>推車照明裝置</chinese-title>
        <english-title>STROLLERS LIGHTING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62B9/00</main-classification>
        <further-classification edition="200601120260430B">B62B7/00</further-classification>
        <further-classification edition="200601120260430B">F21V33/00</further-classification>
        <further-classification edition="200601120260430B">F21V23/04</further-classification>
        <further-classification edition="201601320260430B">F21Y115/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷米　舒伊特馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REMY, SCHUITEMAKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托馬斯　斯托克霍夫　德榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, STOKHOF DE JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬基恩　漢斯　范格德輪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIJN, HANS VAN GELDEREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於推車的照明系統，以增強弱光環境中的可見性。所述設備包括不同燈組件，所述燈組件被配置為安裝到或集成於推車的結構部件。磁扣式燈組件通過磁體或金屬板附接到頂篷或織物部分。夾式燈組件使用夾子固定到頂篷或框架部件。另外的元件包括集成管狀燈和框架燈帶，每個都包含容納光源的殼體、控制器、以及設置在框架構件內或沿著框架構件設置的電源。把手安裝式燈組件包括定位在把手內的電源和控制部件、以及設置在相對側以在多個方向上投射照明的光源。嵌邊中的軟質物品安裝式燈組件形成長形的照亮區域，用於弱光條件下的可見性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lighting system for a stroller is provided to enhance visibility in low-light environments. The apparatus includes various light assemblies configured to be mounted to or integrated with structural members of the stroller. A magnetic snap-on light assembly attaches to a canopy or fabric portion via magnets or metal plates. A clip-on light assembly is secured to a canopy or frame component using clips. Additional assemblies include an integrated tube light and a frame light strip, each incorporating a housing containing light sources, a controller, and a power supply disposed within or along a frame member. A handlebar-mounted light assembly includes power and control components positioned within the handlebar and light sources disposed at opposing sides to project illumination in multiple directions. A softgoods-mounted light assembly in piping provides an elongated illuminated region for visibility in low-light conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:推車</p>
        <p type="p">150:頂篷/頂篷框架</p>
        <p type="p">170:儲物籃</p>
        <p type="p">200:燈組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1637" publication-number="202633002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>COMMUNICATIONS METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260417B">H04W72/512</main-classification>
        <further-classification edition="202301120260417B">H04W72/1268</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張夢晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MENGCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張彥清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐海博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HAIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　曉翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SEAU SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸玉嬌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通信方法及裝置，有利於提高資源調度的準確性，降低緩存資料的資料傳輸時延。該方法包括：終端在觸發DSR的情況下，將緩存的資料中會對緊急資料的傳輸造成干擾的資料的資料量，統計到DSR對應的上報門限所對應的資料量中，並通過第一信息為網路設備指示DSR對應的上報門限所對應的資料量，使得網路設備在根據第一信息為終端調度資源的過程中，能夠為終端額外調度傳輸緊急資料外的其他資料的資源，從而有利於降低緊急資料受到的傳輸干擾，提高緊急資料的資料傳輸效率，降低資料傳輸時延。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication method and apparatus are provided to help improve the accuracy of resource scheduling and reduce the data transmission delay of buffered data. The method includes: when a DSR is triggered, a terminal counts, into a data volume corresponding to a reporting threshold corresponding to the DSR, a data volume of data in the buffered data that would cause interference to the transmission of urgent data; and indicates, to a network device by using first information, the data volume corresponding to the reporting threshold corresponding to the DSR, so that the network device can additionally schedule, for the terminal during the process of scheduling resources for the terminal based on the first information, resources for transmitting data besides urgent data. This helps reduce the transmission interference on the urgent data, improves the data transmission efficiency of the urgent data, and reduces the data transmission delay.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301、S302:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1638" publication-number="202631992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＰＡＳ化尿酸酶變體及其使用方法</chinese-title>
        <english-title>PASYLATED URICASE VARIANTS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N9/06</main-classification>
        <further-classification edition="200601120260504B">C07K19/00</further-classification>
        <further-classification edition="200601120260504B">A61K38/44</further-classification>
        <further-classification edition="200601120260504B">A61P19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商因賜美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSMED INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＸＬ　蛋白有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XL-PROTEIN GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利　凱洛格　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILEY-KELLOGG, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里斯沃德　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRISWOLD, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維恩切克　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIENCEK, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德伯森　帕爾默　克萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODBERSEN-PALMER, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋洪基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HONGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普勞恩特　阿丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAUNT, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森塔爾　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENTHAL, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯　沙夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSE, SASHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賓德　尤里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BINDER, ULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於PAS化尿酸酶變體融合蛋白及其多聚體。提供使用PAS化尿酸酶變體融合蛋白及其多聚體治療痛風、腫瘤溶解症候群、及與體液（包括血液）中之升高尿酸水平相關之其他疾病的方法。亦提供重組產生本文所揭示之PAS化尿酸酶變體融合蛋白的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to PASylated uricase variant fusion proteins and their multimers. Methods of using the PASylated uricase variant fusion proteins and their multimers to treat gout, tumor lysis syndrome, and other diseases associated with elevated uric acid levels in body fluids, including blood, are provided. Methods of recombinantly producing the PASylated uricase variant fusion proteins disclosed herein are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1639" publication-number="202631071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備</chinese-title>
        <english-title>CLEANING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">A47L11/40</main-classification>
        <further-classification edition="200601120260423B">A47L11/24</further-classification>
        <further-classification edition="200601120260423B">A47L9/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開實施例公開了一種清潔設備，清潔設備包括：機身；清潔組件，設置於所述機身的底部；驅動輪組件，設置於所述機身；所述驅動輪組件包括位於所述機身的底部的驅動輪；從動輪組件，設置於所述機身；所述從動輪組件包括位於所述機身的底部的從動輪；第一升降裝置，設置於所述機身和所述驅動輪組件之間，所述第一升降裝置用於調整所述驅動輪和所述機身的相對位置，以調整所述從動輪、所述驅動輪和所述清潔組件相對於承載面的作用力分佈；所述機身相對所述承載面的高度可調整，範圍為0.5cm-5cm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure discloses a cleaning device, including a machine body; a cleaning assembly arranged at a bottom of the machine body; a driving wheel assembly arranged on the machine body and including a driving wheel located at the bottom of the machine body; a driven wheel assembly arranged on the machine body and including a driven wheel located at the bottom of the machine body; and a first lifting device arranged between the machine body and the driving wheel assembly and configured for adjusting a relative position of the driving wheel and the machine body, so as to adjust force distribution of the driven wheel, the driving wheel and the cleaning assembly relative to a bearing surface; and a height of the machine body relative to the bearing surface is adjustable, ranging from 0.5cm to 5cm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:機身</p>
        <p type="p">200:驅動輪組件</p>
        <p type="p">220:驅動輪</p>
        <p type="p">300:從動輪組件</p>
        <p type="p">323:從動輪</p>
        <p type="p">400:清潔組件</p>
        <p type="p">750:承載面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1640" publication-number="202631207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放射性標記PSMA結合配位體的方法及其套組</chinese-title>
        <english-title>METHODS FOR RADIOLABELING PSMA BINDING LIGANDS AND THEIR KITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K51/04</main-classification>
        <further-classification edition="200601120260504B">A61K51/12</further-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601320260504B">A61K103/30</further-classification>
        <further-classification edition="200601320260504B">A61K103/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紗雀堤　羅倫左</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACCHETTI, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾蒂嫩戈　艾瑞卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINENGO, ERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴巴托　多納托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBATO, DONATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔帝斯科　馬狄雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEDESCO, MATTIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用放射性同位素，較佳&lt;sup&gt;68&lt;/sup&gt;Ga、&lt;sup&gt;67&lt;/sup&gt;Ga或&lt;sup&gt;64&lt;/sup&gt;Cu標記PSMA結合配位體之方法，該方法包含以下步驟：  &lt;br/&gt;i. 提供單一小瓶，其包含呈乾燥形式之下式(I)之該PSMA結合配位體：  &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="523px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;至少一種緩衝劑、氯化鈉及抗放射分解降解之穩定劑，  &lt;br/&gt;ii. 將該放射性同位素之溶液添加至該單一小瓶中，藉此獲得具有該放射性同位素之式(I)之該PSMA結合配位體之溶液，  &lt;br/&gt;iii. 混合ii.中所獲得之溶液且將其培育足夠時段以獲得經該放射性同位素標記之該PSMA結合配位體，及  &lt;br/&gt;iv. 視情況調節該溶液之pH值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to methods for labeling a PSMA binding ligand with a radioactive isotope, preferably &lt;sup&gt;68&lt;/sup&gt;Ga, &lt;sup&gt;67&lt;/sup&gt;Ga or &lt;sup&gt;64&lt;/sup&gt;Cu, said method comprising the steps of: &lt;br/&gt;i. providing a single vial comprising, in dried form, said PSMA binding ligand of the following formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="209px" width="542px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;at least one buffering agent, sodium chloride and a stabilizer against radiolytic degradation, &lt;br/&gt;ii. adding a solution of said radioactive isotope into said single vial, thereby obtaining a solution of said PSMA binding ligand of formula (I) with said radioactive isotope, &lt;br/&gt;iii. mixing the solution obtained in ii., and incubating it for a sufficient period of time for obtaining said PSMA binding ligand labelled with said radioactive isotope, and, &lt;br/&gt;iv. optionally, adjusting the pH of the solution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1641" publication-number="202631934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143471</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學積層體、附偏光薄膜之光學積層體及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">C09J7/38</main-classification>
        <further-classification edition="200601120260504B">C09J133/08</further-classification>
        <further-classification edition="200601120260504B">C09J9/00</further-classification>
        <further-classification edition="201901120260504B">B32B7/023</further-classification>
        <further-classification edition="200601120260504B">G02B5/30</further-classification>
        <further-classification edition="200601120260504B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田潤枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, MIZUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松多楓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUTA, KAEDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供之光學積層體，依序包含第1液晶定向固化層、黏著片及第2液晶定向固化層；黏著片之厚度小於20µm；令黏著片之平均折射率為n、令第1液晶定向固化層之平均折射率為n1、且令第2液晶定向固化層之平均折射率為n2時，藉由式：{(n1+n2)/2-n}算出之值的絕對值小於0.11；黏著片包含選自於由單體及寡聚物所構成群組中之至少1種；且，黏著片中之單體及寡聚物之含量為400~130000ppm(質量基準)。該光學積層體適合提升影像顯示裝置之顯示特性與提升該光學積層體之生產性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第1液晶定向固化層</p>
        <p type="p">12:第2液晶定向固化層</p>
        <p type="p">20:黏著片</p>
        <p type="p">100:光學積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1642" publication-number="202631684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合體及其用途</chinese-title>
        <english-title>CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07D491/22</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商基石藥業（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSTONE PHARMACEUTICALS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商申石生物醫藥（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN SHI PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商拓石藥業（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSTONE PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亚民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张信玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XINLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张凝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孙靖谕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘雪莲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XUELIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨永立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YONGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴雪琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, XUEQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱梦瑶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, MENGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>钱雨欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, YUXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陈蕥欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨　建新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開關於式(I)的複合體，或其醫藥上可接受的鹽、鏡像異構物或非鏡像異構物或其混合物，並且該複合體可用於治療和/或預防多種疾病。  &lt;br/&gt;T-(L-D)&lt;sub&gt;k&lt;/sub&gt; (I)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a conjugate of the formula (I), or a pharmaceutically acceptable salt, enantiomer, diastereomer thereof, or a mixture thereof, and the conjugate is useful in treatment and/or prevention of various diseases. &lt;br/&gt;T-(L-D)&lt;sub&gt;k&lt;/sub&gt; (I)</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1643" publication-number="202632993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線訊號強度的動態控制</chinese-title>
        <english-title>DYNAMIC CONTROL OF WIRELESS SIGNAL STRENGTH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W52/06</main-classification>
        <further-classification edition="200901120260504B">H04W52/04</further-classification>
        <further-classification edition="200901120260504B">H04W88/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬　薩提許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SATISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米希拉　安舒曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHRA, ANSHUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮納尤昌德拉瑟卡蘭　薩拉蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINAYOUR CHANDRASEKARAN, SARATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示用於動態控制相關於無線裝置之傳輸功率的方法及設備。技術可包括：以分配給一第一無線裝置的一第一傳輸功率將一射頻(RF)信號傳輸至該第一無線裝置，並以分配給一第二無線裝置的一第二傳輸功率將一第二RF信號傳輸至該第二無線裝置；回應於傳輸至該第一無線裝置的該RF信號，而接收來自該第一無線裝置的具有一第一信號強度的一第一經背向散射RF信號、及來自該第二無線裝置的具有一第二信號強度的一第二經背向散射RF信號；及基於該第一信號強度及該第二信號強度，而調整分配給該第一無線裝置的該第一傳輸功率、分配給該第二無線裝置的該第二傳輸功率、或其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for dynamically controlling transmit power with respect to wireless devices are disclosed. Techniques may include transmitting a radio frequency (RF) signal to a first wireless device at a first transmit power allocated to the first wireless device, and a second RF signal to a second wireless device at a second transmit power allocated to the second wireless device; responsive to the RF signal transmitted to the first wireless device, receiving a first backscattered RF signal having a first signal strength from the first wireless device, and a second backscattered RF signal having a second signal strength from the second wireless device; and based on the first signal strength and the second signal strength, adjusting the first transmit power allocated to the first wireless device, the second transmit power allocated to the second wireless device, or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1300:方法</p>
        <p type="p">1310,1320,1330:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1644" publication-number="202632027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由干涉效應著色之鐘錶組件</chinese-title>
        <english-title>HOROLOGY COMPONENT COLOURED BY INTERFERENCE EFFECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C14/06</main-classification>
        <further-classification edition="200601120260504B">C23C14/10</further-classification>
        <further-classification edition="200601120260504B">C23C14/14</further-classification>
        <further-classification edition="200601120260504B">C23C16/06</further-classification>
        <further-classification edition="200601120260504B">C23C16/24</further-classification>
        <further-classification edition="200601120260504B">C23C16/34</further-classification>
        <further-classification edition="200601120260504B">C23C16/40</further-classification>
        <further-classification edition="200601120260504B">C23C28/00</further-classification>
        <further-classification edition="201501120260504B">G02B1/10</further-classification>
        <further-classification edition="200601120260504B">G02B5/28</further-classification>
        <further-classification edition="200601120260504B">G04B19/00</further-classification>
        <further-classification edition="200601120260504B">G04B33/06</further-classification>
        <further-classification edition="200601120260504B">G04B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商尼瓦克斯　法爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIVAROX-FAR S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜拉特　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILAT, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡森　皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUSIN, PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種鐘錶組件，其包含基板(2)、直接或間接接觸基板(2)之第一干涉層(4)以及覆蓋第一干涉層(4)之第二干涉層(3)，第一干涉層(4)的特徵在於其具有3 nm與250 nm之間的厚度以及其係由在380 nm與780 nm之間的可見光範圍內的發光光譜呈透明的第一材料所製成，第一材料在整個可見光範圍內具有小於或等於2之折射率n，第二干涉層(3)的特徵在於其具有3 nm與80 nm之間的厚度以及其係由在至少一部份的可見光範圍內具有分別達到大於或等於3與大於或等於0.5之值的折射率n與吸收係數k的第二材料所製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a horology component comprising a substrate (2), a first interference layer (4) in direct or indirect contact with the substrate (2) and a second interference layer (3) covering the first interference layer (4), said first interference layer (4) being characterised in that it has a thickness comprised between 3 nm and 250 nm and in that it is made of a first material that is transparent to the luminous spectrum in the visible range between 380 nm and 780 nm, with said first material having a refractive index n less than or equal to 2 over the entire said visible range, said second interference layer (3) being characterised in that it has a thickness comprised between 3 nm and 80 nm and in that it is made of a second material having a refractive index n and an absorption coefficient k respectively reaching a value greater than or equal to 3 and greater than or equal to 0.5, over at least part of said visible range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">3:第二干涉層</p>
        <p type="p">4:第一干涉層</p>
        <p type="p">5:第二中間層</p>
        <p type="p">6:第一中間層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1645" publication-number="202631698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經改質共軛二烯系聚合物、其製備方法及包含彼之橡膠組成物</chinese-title>
        <english-title>MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME AND RUBBER COMPOSITION COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08C19/22</main-classification>
        <further-classification edition="200601120260504B">C08C19/25</further-classification>
        <further-classification edition="200601120260504B">C08C19/44</further-classification>
        <further-classification edition="200601120260504B">C08F236/10</further-classification>
        <further-classification edition="200601120260504B">C08F8/42</further-classification>
        <further-classification edition="200601120260504B">C08L15/00</further-classification>
        <further-classification edition="201801120260504B">C08K3/013</further-classification>
        <further-classification edition="200601120260504B">C08K3/36</further-classification>
        <further-classification edition="200601120260504B">B60C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐裕錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOU SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪錫俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SUK JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳慶煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, KYOUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴度映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善槿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUN KEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種高度支化和高分子量的經改質共軛二烯系聚合物、其製備方法以及包含其之橡膠組成物，以及提供一種經改質共軛二烯系聚合物，其包含：共軛二烯系單體的衍生單元；由式1表示的支化劑的衍生單元；以及由式2表示的化合物衍生的改質部分，以及其製備方法，以及一種包含其之橡膠組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a highly branched and high molecular weight modified conjugated diene-based polymer, a method for preparing the same, and a rubber composition comprising the same, and provides a modified conjugated diene-based polymer comprising: a derived unit from a conjugated diene-based monomer; a derived unit from a branching agent represented by Formula 1; and a modification part derived from a compound represented by Formula 2, a method for preparing the same, and a rubber composition comprising the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1646" publication-number="202632987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線通訊系統中量測評估之終端裝置及方法</chinese-title>
        <english-title>TERMINAL DEVICE AND METHOD FOR MEASUREMENT EVALUATION IN WIRELESS COMMUNICATION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260423B">H04W24/10</main-classification>
        <further-classification edition="200901120260423B">H04W36/32</further-classification>
        <further-classification edition="201801120260423B">H04W76/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬納拉斯塔斯　馬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANALASTAS, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯賈德　拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALSGAARD, LARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱努萊寧　賈尼佩卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAINULAINEN, JANI-PEKKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　吉秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GILSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里米德科迪　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMIDEHKORDI, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了一種終端裝置，該終端裝置在處於一無線電資源控制(RRC)閒置狀態或RRC非活動狀態時，執行與一第一基地台相關之一量測。該終端裝置至少在未經組配以判定該量測是否滿足一時序條件時，執行一評估程序。該評估程序判定在一給定時間點或在一給定時段期間是否滿足一第一條件、一第二條件中之至少一者。該第一條件與終端裝置行動性相關，並且該第二條件與相對於由該第一基地台提供之一小區的終端裝置位置相關。該終端裝置向一第二基地台發送對量測結果之一指示及對評估程序結果之一指示。一網路裝置自該終端裝置接收並處理此等指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal device performs a measurement related to a first base station while in a radio resource control (RRC) idle state or RRC inactive state. The terminal device performs an evaluation process, at least when not configured to determine whether the measurement satisfies a timing condition. The evaluation process determines whether at least one of a first condition a second condition met at a given point in time or during a given time period. The first condition relates to terminal device mobility, and the second condition relates to terminal device location with respect to a cell provided by the first base station. The terminal device sends, to a second base station, an indication of the measurement result and an indication of the evaluation process result. A network device receives and processes these indications from the terminal device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:終端裝置</p>
        <p type="p">202,204,206:步驟</p>
        <p type="p">208:第二基地台</p>
        <p type="p">210:第一基地台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1647" publication-number="202632988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線通訊系統中量測評估之終端裝置及方法</chinese-title>
        <english-title>TERMINAL DEVICE AND METHOD FOR MEASUREMENT EVALUATION IN WIRELESS COMMUNICATION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260423B">H04W24/10</main-classification>
        <further-classification edition="200901120260423B">H04W36/30</further-classification>
        <further-classification edition="200901120260423B">H04W36/32</further-classification>
        <further-classification edition="201801120260423B">H04W76/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬納拉斯塔斯　馬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANALASTAS, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯賈德　拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALSGAARD, LARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱努萊寧　賈尼佩卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAINULAINEN, JANI-PEKKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　吉秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GILSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里米德科迪　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMIDEHKORDI, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了一種終端裝置，該終端裝置在處於一無線電資源控制(RRC)閒置狀態或RRC非活動狀態時，執行與一第一基地台相關之量測。該終端裝置至少在未經組配以判定該量測是否滿足一時序條件時，執行一評估程序。該評估程序判定在一給定時間點或在一給定時段期間是否均滿足至少二個條件。該等條件包括與終端裝置行動性相關之一第一條件及與相對於由該第一基地台提供之一小區之終端裝置位置相關的一第二條件。該終端裝置向一第二基地台發送對量測結果之一指示及對是否均滿足該等條件之一指示。一網路裝置自該終端裝置接收並處理此等指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal device performs measurements related to a first base station while in a radio resource control (RRC) idle state or RRC inactive state. The terminal device performs an evaluation process, at least when not configured to determine whether the measurement satisfies a timing condition. The evaluation process determines whether at least two conditions are both met at a given point in time or during a given time period. The conditions include a first condition relating to terminal device mobility and a second condition relating to terminal device location with respect to a cell provided by the first base station. The terminal device sends, to a second base station, an indication of the measurement result and an indication of whether the conditions are both met. A network device receives and processes these indications from the terminal device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:終端裝置</p>
        <p type="p">202,204,206:步驟</p>
        <p type="p">208:第二基地台</p>
        <p type="p">210:第一基地台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1648" publication-number="202633356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自動面板定心的設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR AUTOMATIC PANEL CENTERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10P72/50</main-classification>
        <further-classification edition="202601120260429B">H10P72/30</further-classification>
        <further-classification edition="200601120260429B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫魯比雪　亞力山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUPYSHEV, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡維尼　羅勃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAVENEY, ROBERT T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈利西　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALLISEY, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基士德　阿里色吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILCHRIST, ULYSSES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧德布蘭　艾蜜莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDEBRAND, EMILIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供的是用於半導體處理設備的直角四邊形面板之自動定心的直角四邊形面板自動定心系統，且其包括：面板運輸設備，具有末端執行器，末端執行器帶有具預定中心的固持站，末端執行器建構成在固持站固持直角四邊形面板；感測器，建構成與運動中的面板運輸設備實質同時而執行固持在末端執行器上之直角四邊形面板的邊緣的感測；以及控制器，以面板運輸設備來移動直角四邊形面板而讓感測器感測邊緣。控制器從感測器資料定出相交邊緣中的每一者之個別線的特徵，以致相對於預定參考坐標系而解析具有預定中心之直角四邊形面板的偏心率和直角四邊形面板的旋轉角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A right quadrilateral panel automatic centering system for automatic centering of a right quadrilateral panel for a semiconductor processing apparatus is provided and includes: a panel transport apparatus having an end effector with a holding station having a predetermined center, the end effector being configured to hold the right quadrilateral panel at the holding station; a sensor being configured to effect, substantially coincident, with the panel transport apparatus in motion, sensing of an edge of the right quadrilateral panel held on the end effector; and a controller that moves, with the panel transport apparatus, the right quadrilateral panel so the sensor senses the edge. The controller, from sensor data, characterizes respective lines of each of the intersecting edges so as to resolve an eccentricity of the right quadrilateral panel with the predetermined center and a rotation angle of the right quadrilateral panel relative to the predetermined reference frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板、面板</p>
        <p type="p">200C:面板中心</p>
        <p type="p">200E:邊緣</p>
        <p type="p">300:面板運輸設備、運輸機器人</p>
        <p type="p">310:運輸或機器手臂</p>
        <p type="p">310E:末端執行器</p>
        <p type="p">310EC:預定中心</p>
        <p type="p">333:基板處理系統、半導體處理設備</p>
        <p type="p">333F:框架</p>
        <p type="p">342:終端固持站</p>
        <p type="p">342C:放置中心</p>
        <p type="p">370:自動面板定心感測器系統</p>
        <p type="p">371:直角四邊形面板自動定心系統</p>
        <p type="p">399:控制器</p>
        <p type="p">400:感測器</p>
        <p type="p">600:感測器</p>
        <p type="p">EC:偏心率</p>
        <p type="p">REF:參考坐標系</p>
        <p type="p">SHS:面板固持站、基板固持站</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1649" publication-number="202631765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>丙烯系嵌段共聚物之製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING PROPYLENE-BASED BLOCK COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F297/08</main-classification>
        <further-classification edition="200601120260504B">C08F4/654</further-classification>
        <further-classification edition="200601120260504B">C08F4/656</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本聚丙烯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN POLYPROPYLENE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島寛正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, HIROMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩井伸浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAI, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種丙烯系嵌段共聚物之製造方法，其包括：第1聚合步驟，其使用1個以上之反應器，於包含烯烴聚合觸媒成分(A)及有機鋁化合物(B)之觸媒之存在下，製造丙烯含量超過95質量%之第1丙烯系聚合物；及  &lt;br/&gt;第2聚合步驟，其包括使用包含橫置式反應器之1個以上之反應器，於上述第1丙烯系聚合物之存在下，使丙烯含量95質量%以下與選自由除丙烯以外之α-烯烴所組成之群中之至少1種單體之共聚物聚合之步驟，以製造第2丙烯系聚合物；  &lt;br/&gt;上述第2聚合步驟中包括於自最終橫置式反應器之長度方向之最下游末端至朝向上游方向為66%之間之任一處，向最終橫置式反應器供給標準狀態且為液體之供電子性化合物，  &lt;br/&gt;於上述第2聚合步驟中，反應器內之氧氣濃度未達0.60 molppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing propylene-based block copolymer, the method comprising: &lt;br/&gt;a first polymerization step of producing a first propylene-based polymer having a propylene content more than 95% by mass by use of one or more reactors in the presence of a catalyst containing an olefin polymerization catalyst component (A) and an organoaluminum compound (B), and &lt;br/&gt;a second polymerization step of producing a second propylene-based polymer by use of one or more reactors including a horizontal reactor in the presence of the first propylene-based polymer, the second polymerization step including a step of polymerizing a copolymer of propylene and at least one monomer selected from the group consisting of α-olefins other than propylene and the copolymer having a propylene content of 95% by mass or less, &lt;br/&gt;wherein an electron donating compound which is liquid in a standard state, is supplied to a final horizontal reactor in the second polymerization step, at any point between a longitudinal-directional, most downstream end of the final horizontal reactor and a point 66% upstream from the end, and &lt;br/&gt;wherein an oxygen concentration in the one or more reactors is less than 0.60 mol ppm in the second polymerization step.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:橫置式反應器(第1反應器)</p>
        <p type="p">100a,100b:間隔壁</p>
        <p type="p">101:觸媒成分供給配管</p>
        <p type="p">102:觸媒成分供給配管</p>
        <p type="p">103:原料單體供給配管</p>
        <p type="p">104-1,104-2:原料氫氣供給配管</p>
        <p type="p">105:冷凝器</p>
        <p type="p">106-1,106-2:配管</p>
        <p type="p">107-1,107-2,107-3,107-4,107-5:含液化單體之液體供給配管</p>
        <p type="p">108,108-1,108-2,108-3,108-4,108-5:再利用氣體供給配管</p>
        <p type="p">109:攪拌機</p>
        <p type="p">109a:水平軸</p>
        <p type="p">109b:攪拌翼</p>
        <p type="p">110:未反應氣體抽出配管</p>
        <p type="p">111:再利用滾筒</p>
        <p type="p">112:壓縮機</p>
        <p type="p">113:聚合物抽出配管</p>
        <p type="p">114:斗箱</p>
        <p type="p">200:橫置式反應器(第2反應器)</p>
        <p type="p">201:移送配管</p>
        <p type="p">202:觸媒成分供給配管</p>
        <p type="p">203:原料單體供給配管</p>
        <p type="p">204-1:原料氫氣供給配管</p>
        <p type="p">204-2:原料乙烯供給配管</p>
        <p type="p">205:冷凝器</p>
        <p type="p">206-1,206-2:配管</p>
        <p type="p">207-1,207-2,207-3,207-4,207-5:含液化單體之液體供給配管</p>
        <p type="p">208,208-1,208-2,208-3,208-4,208-5:再利用氣體供給配管</p>
        <p type="p">209:攪拌機</p>
        <p type="p">209a:水平軸</p>
        <p type="p">209b:攪拌翼</p>
        <p type="p">210:未反應氣體抽出配管</p>
        <p type="p">210a,210b:間隔壁</p>
        <p type="p">211:再利用滾筒</p>
        <p type="p">212:壓縮機</p>
        <p type="p">213:聚合物抽出配管</p>
        <p type="p">214:氧氣供給配管</p>
        <p type="p">215-1:液體之電子供體供給配管(自最下游末端朝向上游方向超過66%之位置)</p>
        <p type="p">215-2,215-3,215-4:液體之電子供體供給配管(自最下游末端至朝向上游方向為66%之間之位置)</p>
        <p type="p">D:反應器之直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1650" publication-number="202632994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143576</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻裝置功率模式的動態控制</chinese-title>
        <english-title>DYNAMIC CONTROL OF RADIO FREQUENCY DEVICE POWER MODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W52/30</main-classification>
        <further-classification edition="200901120260504B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　薩蒂許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SATISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米什拉　安殊曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHRA, ANSHUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮納尤爾　昌德拉塞卡蘭　薩拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINAYOUR CHANDRASEKARAN, SARATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示用於動態控制一無線裝置之一功率模式的方法及設備。技術可包括：在該無線裝置處從一基地台接收一射頻(radio frequency, RF)信號；回應於來自該基地台的該RF信號而將一RF信號傳輸至該基地台；從該基地台接收信號功率資訊，該信號功率資訊指示該基地台的信號功率能力；及基於從該基地台接收到的該RF信號之一信號強度、發送至該基地台的該經傳輸RF信號之一信號強度、及該信號功率資訊，而將該無線裝置之一功率模式調整為一被動模式或一半被動模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for dynamically controlling a power mode of a wireless device are disclosed. Techniques may include receiving, at the wireless device, a radio frequency (RF) signal from a base station; transmitting an RF signal to the base station responsive to the RF signal from the base station; receiving signal power information from the base station, the signal power information being indicative of signal power capabilities of the base station; and adjusting a power mode of the wireless device to a passive mode or a semi-passive mode based on a signal strength of the RF signal received from the base station, a signal strength of the transmitted RF signal sent to the base station, and the signal power information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:方法</p>
        <p type="p">1410,1420,1430,1440:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1651" publication-number="202631685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143628</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗ＧＰＲＣ５Ａ抗體及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商立貝羅賽拉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIBEROTHERA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木原慶彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIHARA, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村亜紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, AKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅家徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANKE, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供結合於細胞表面的GPRC5A之抗GPRC5A抗體，及提供包含該抗體之抗體藥物複合體或包含該抗體藥物複合體之醫藥組成物。  &lt;br/&gt;　　其解決方法為，將表現人類GPRC5A之細胞株或人類GPRC5A蛋白質對小鼠進行免疫，取得新穎的小鼠抗GPRC5A抗體(實施例1)。進而，基於該小鼠抗體的序列資訊，由抗GPRC5A抗體取得9種類的人類嵌合化抗GPRC5A抗體以及人源化抗GPRC5A抗體(實施例4、6)。進而，使用該抗GPRC5A抗體製作抗體藥物複合體(ADC)，發現該ADC結合於表現GPRC5A之癌細胞，具有毒傷該細胞之作用(實施例8、9)。除此之外，人類嵌合化抗GPRC5A抗體藥物複合體顯示小鼠皮下異種移植模式中的抗腫瘤效果(實施例10)。由上述結果，確認到所取得的新穎人類嵌合抗GPRC5A抗體於用於將藥理活性物質送達至表現GPRC5A之細胞之靶向(Targeting)為有用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1652" publication-number="202633280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P34/42</main-classification>
        <further-classification edition="202601120260421B">H10W80/00</further-classification>
        <further-classification edition="201401120260421B">B23K26/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒川亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKAWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川晋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理重合基板之基板處理方法，該重合基板係以表面形成有積層膜的第1基板與第2基板接合而成，該方法包含：將填充材充填於前述第1基板的外周部與前述第2基板的外周部之間隙；及對前述第1基板的外周部照射雷射以形成改質區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">53:注入器</p>
        <p type="p">103:刀刃</p>
        <p type="p">A:未接合區域</p>
        <p type="p">A1:外側未接合區域</p>
        <p type="p">A2:內側未接合區域</p>
        <p type="p">C1:第1龜裂</p>
        <p type="p">C2:第2龜裂</p>
        <p type="p">Ds:第2元件層</p>
        <p type="p">Dw:第1元件層</p>
        <p type="p">Fs:第2接合膜</p>
        <p type="p">Fw:第1接合膜</p>
        <p type="p">G:填充材</p>
        <p type="p">H:拉伸應力</p>
        <p type="p">L:雷射光</p>
        <p type="p">M1:第1改質部</p>
        <p type="p">M2:第2改質部</p>
        <p type="p">N1:第1改質區域</p>
        <p type="p">N2:第2改質區域</p>
        <p type="p">N21:底面改質區域</p>
        <p type="p">N22:側面改質區域</p>
        <p type="p">P:研磨目標面</p>
        <p type="p">R:接合力降低區域</p>
        <p type="p">S:第2晶圓(第2基板)</p>
        <p type="p">W:第1晶圓(第1基板)</p>
        <p type="p">Wb:背面</p>
        <p type="p">Wc:中央部</p>
        <p type="p">We:周緣部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1653" publication-number="202631686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
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        <document-id>
          <doc-number>202631686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗CCR8抗體及其藥物複合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C07K5/02</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人醫藥基盤・健康・營養研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTES OF BIOMEDICAL INNOVATION, HEALTH AND NUTRITION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上町昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMACHI, HIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋詰美紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZUME, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂仁志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAN, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村恵弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MEGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田諭志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊勢知子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISE, TOMOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗體藥物複合體或其製藥學上容許之鹽，上述抗體藥物複合體係以式(1)表示。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="160px" width="295px" file="ed10216.JPG" alt="ed10216.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，  &lt;br/&gt;mAb表示與CCR8結合之抗體、或其抗體片段，  &lt;br/&gt;n表示1～8之整數，  &lt;br/&gt;L表示式(L-1)、(L-2)、(L-3)或(L-4)所表示之基，  &lt;br/&gt;Z表示式(Z-1)、式(Z-2)或式(Z-3)所表示之基]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1654" publication-number="202632187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置及控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F23G5/50</main-classification>
        <further-classification edition="200601120260310B">F23G5/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工環境　化學工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES ENVIRONMENTAL &amp; CHEMICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横井智記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOI, SATOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新保裕哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMBO, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐瀬遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASE, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西宮立享</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMIYA, TATSUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬戸口稔彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETOGUCHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百瀬大峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMOSE, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤芳久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺沢良則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASAWA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供能夠區別並檢測垃圾枯竭所造成的燃燒惡化及劣質垃圾所造成的燃燒惡化的控制裝置。  &lt;br/&gt;　　[解決手段] 控制裝置，係垃圾燃燒設備的控制裝置，具備有：高度取得手段，取得爐內的垃圾層高度；LHV取得手段，在上述垃圾的投入前取得投入於爐內的垃圾的LHV；O2濃度取得手段，取得爐內的氧濃度；判定手段，利用上述垃圾層高度、上述LHV、及上述氧濃度，區別垃圾枯竭所造成的燃燒惡化、及不易燃垃圾的投入所造成的燃燒惡化，以進行燃燒惡化的判定；及控制手段，在判定上述垃圾枯竭所造成的燃燒惡化的情況時，進行使垃圾供應量增加的控制，在判定上述不易燃垃圾的投入所造成的燃燒惡化的情況時，進行促進垃圾燃燒的控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:燃燒設備</p>
        <p type="p">2:控制裝置</p>
        <p type="p">3:燃燒爐</p>
        <p type="p">4:排熱回收鍋爐</p>
        <p type="p">5:減溫塔</p>
        <p type="p">6:集塵裝置</p>
        <p type="p">7:煙道</p>
        <p type="p">8:煙囪</p>
        <p type="p">20:供應機構</p>
        <p type="p">21:料斗</p>
        <p type="p">22:給料器</p>
        <p type="p">23:LHV測量器</p>
        <p type="p">24:灑水裝置</p>
        <p type="p">30:爐本體</p>
        <p type="p">30a:乾燥段</p>
        <p type="p">30b:燃燒段</p>
        <p type="p">30c:後燃燒段</p>
        <p type="p">31:爐內溫度感測器</p>
        <p type="p">32:可見光攝影機</p>
        <p type="p">33:紅外線攝影機</p>
        <p type="p">35:爐內壓力感測器</p>
        <p type="p">36:爐出口側溫度感測器</p>
        <p type="p">37,38:流量感測器</p>
        <p type="p">40:爐床</p>
        <p type="p">40a:爐床面</p>
        <p type="p">41:火格子</p>
        <p type="p">43:排出滑槽</p>
        <p type="p">50a,50b,50c,50d,50e:風箱</p>
        <p type="p">51a,51b,51c,51d,51e:風箱壓力感測器</p>
        <p type="p">55:前天井部</p>
        <p type="p">57:後天井部</p>
        <p type="p">59:後壁</p>
        <p type="p">60:火爐</p>
        <p type="p">60a:前壁</p>
        <p type="p">60b:後壁</p>
        <p type="p">70:送風機構</p>
        <p type="p">71:送風機</p>
        <p type="p">71A:第1送風機</p>
        <p type="p">71B:第2送風機</p>
        <p type="p">72:一次空氣管線</p>
        <p type="p">73:空氣預熱器</p>
        <p type="p">73a:預熱溫度感測器</p>
        <p type="p">74:二次空氣管線</p>
        <p type="p">74a:第1供應口</p>
        <p type="p">74b:第2供應口</p>
        <p type="p">75:風門</p>
        <p type="p">75a,75b,75c,75d,75e:一次空氣風門</p>
        <p type="p">75B:二次空氣風門</p>
        <p type="p">76:空氣流量感測器</p>
        <p type="p">76A:第1空氣流量感測器</p>
        <p type="p">76B:第2空氣流量感測器</p>
        <p type="p">77:第1空氣壓力感測器</p>
        <p type="p">81:氣體感測器</p>
        <p type="p">91:第1EGR噴嘴</p>
        <p type="p">93:第2EGR噴嘴</p>
        <p type="p">97:角度調整機構</p>
        <p type="p">F:火焰</p>
        <p type="p">S:被燃燒物</p>
        <p type="p">V:處理空間</p>
        <p type="p">V’:處理空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1655" publication-number="202633292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可調制膜應力的硬遮罩之形成方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR FORMING A HARD MASK FILM WITH A TUNABLE FILM STRESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P50/20</main-classification>
        <further-classification edition="200601120260422B">C23C14/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　德寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TEK PO RINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今北健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAKITA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木歩太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, AYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種在半導體裝置上方形成硬遮罩膜的方法。該方法包含根據該半導體裝置之內部應力來決定該硬遮罩膜的膜應力，於低溫下在該半導體裝置上方執行矽化鎢(WSi)沉積，以形成該硬遮罩膜，根據所決定之該WSi硬遮罩膜的該膜應力，決定欲執行之退火製程的持續時間，以及根據所決定之該持續時間對該WSi硬遮罩膜執行該退火製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a method of forming a hard mask film over a semiconductor device. The method includes determining a film stress of the hard mask film based on an internal stress of the semiconductor device, performing a tungsten silicide (WSi) deposition at a cryogenic temperature over the semiconductor device to form the hard mask film, determining a time period of an annealing process to be performed based on the determined film stress of the WSi hard mask film, and performing the annealing process to the WSi hard mask film based on the determined time period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:蝕刻停止層</p>
        <p type="p">130:膜堆疊</p>
        <p type="p">131:交替層</p>
        <p type="p">132:交替層</p>
        <p type="p">140:硬遮罩膜</p>
        <p type="p">150:深溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1656" publication-number="202632978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、感測控制方法、及終端</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260423B">H04W4/38</main-classification>
        <further-classification edition="202201120260423B">H04L41/0681</further-classification>
        <further-classification edition="200601120260423B">G01S13/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬婧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可向相應於事件的感測參加者，發送感測指示。作為構成移動通訊網之核心網的第1網路實體而動作的資訊處理裝置，係執行：將從與構成核心網的第1網路實體不同之第2網路實體所被發送過來的表示移動通訊網所涉及之事件之發生的通知，予以接收；和基於事件而決定感測參加者；和對已被決定之感測參加者，發送感測指示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:核心網</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1657" publication-number="202633489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片堆疊封裝件</chinese-title>
        <english-title>CHIP STACK PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W72/20</main-classification>
        <further-classification edition="202601120260424B">H10W70/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慜珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, MIN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴完春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WAN CHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林貞和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JUNG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請關於一種晶片堆疊封裝件。晶片堆疊封裝件包括第一半導體晶片和第二半導體晶片，所述第一半導體晶片在第一表面上具有第一測試凸塊，所述第二半導體晶片堆疊在第一半導體晶片的與所述第一表面相對的第二表面上。所述晶片堆疊封裝件還包括接合到第一測試凸塊的第二測試凸塊。所述晶片堆疊封裝件還包括圍繞所述第一半導體晶片、所述第二半導體晶片和所述第二測試凸塊的模製構件。所述晶片堆疊封裝件還包括設置在所述模製構件上並且連接到所述第二測試凸塊的測試墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a chip stack package. The chip stack package includes a first semiconductor chip having a first test bump on a first surface and a second semiconductor chip stacked on a second surface of the first semiconductor chip opposite the first surface. The chip stack package also includes a second test bump bonded to the first test bump. The chip stack package further includes a mold member surrounding the first semiconductor chip, the second semiconductor chip, and the second test bump. The chip stack package additionally includes a test pad disposed on the mold member and connected to the second test bump.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一半導體晶片</p>
        <p type="p">11:第一基板</p>
        <p type="p">12:第一佈線結構</p>
        <p type="p">13A:第一前凸塊</p>
        <p type="p">13Aa:導電柱</p>
        <p type="p">13Ab:焊料層</p>
        <p type="p">13B:第一虛設凸塊</p>
        <p type="p">13Ba:導電柱</p>
        <p type="p">13Bb:焊料層</p>
        <p type="p">13C:第一測試凸塊</p>
        <p type="p">13Ca:導電柱</p>
        <p type="p">13Cb:焊料層</p>
        <p type="p">14:第一後凸塊</p>
        <p type="p">15:第一通孔</p>
        <p type="p">16:第一絕緣層</p>
        <p type="p">20:第二半導體晶片</p>
        <p type="p">21:第二基板</p>
        <p type="p">22:第二佈線結構</p>
        <p type="p">23:第二前凸塊</p>
        <p type="p">23a:導電柱</p>
        <p type="p">23b:焊料層</p>
        <p type="p">24:第二後凸塊</p>
        <p type="p">25:第二通孔</p>
        <p type="p">26:第二絕緣層</p>
        <p type="p">30:第三半導體晶片</p>
        <p type="p">31:第三基板</p>
        <p type="p">32:第三佈線結構</p>
        <p type="p">33:第三前凸塊</p>
        <p type="p">33a:導電柱</p>
        <p type="p">33b:焊料層</p>
        <p type="p">40:模製構件</p>
        <p type="p">51:載體凸塊</p>
        <p type="p">52:第二虛設凸塊</p>
        <p type="p">53:第二測試凸塊</p>
        <p type="p">61:外部連接凸塊</p>
        <p type="p">61a:第一銅層</p>
        <p type="p">61b:第一鎳層</p>
        <p type="p">61c:第二銅層</p>
        <p type="p">61d:焊料層</p>
        <p type="p">62:測試墊</p>
        <p type="p">71a:第一UBM圖案</p>
        <p type="p">71b:第二UBM圖案</p>
        <p type="p">80:鈍化層</p>
        <p type="p">100:晶片堆疊封裝件</p>
        <p type="p">A:部分</p>
        <p type="p">AK1:第一對準鍵</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">OP2:第二開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1658" publication-number="202632992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線本端區域網路及無線個人區域網路通訊之處置</chinese-title>
        <english-title>HANDLING OF WIRELESS LOCAL AREA NETWORK AND WIRELESS PERSONAL AREA NETWORK COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260504B">H04W48/08</main-classification>
        <further-classification edition="202301120260504B">H04W72/12</further-classification>
        <further-classification edition="201801120260504B">H04W76/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張中超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHONGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙柳柳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIULIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳再永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZAIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊照明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施凱迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, KAIDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張子嚴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些態樣中，一種無線通訊裝置可獲得無線本端區域網路(wireless local area network, WLAN)通道資訊。該無線通訊裝置可使用該WLAN通道資訊來識別一無線個人區域網路(wireless personal area network, WPAN)跳頻通道映射。該無線通訊裝置可根據該WPAN跳頻通道映射來傳達一或多個WPAN通訊。在一些態樣中，該無線通訊裝置可識別與一或多個WPAN通訊相關聯的一或多個作用中無線站台群組時間窗。該無線通訊裝置可在該一或多個作用中無線站台群組時間窗期間限制一或多個WLAN通訊。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some aspects, a wireless communication device may obtain wireless local area network (WLAN) channel information. The wireless communication device may identify, using the WLAN channel information, a wireless personal area network (WPAN) frequency hopping channel map. The wireless communication device may communicate one or more WPAN communications in accordance with the WPAN frequency hopping channel map. In some aspects, the wireless communication device may identify one or more active wireless station group time windows associated with one or more WPAN communications. The wireless communication device may restrict one or more WLAN communications during the one or more active wireless station group time windows. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:無線站台</p>
        <p type="p">120:無線通訊裝置</p>
        <p type="p">300:實例</p>
        <p type="p">310,320,330:元件符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1659" publication-number="202632258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>試料保持具</chinese-title>
        <english-title>SAMPLE HOLDING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260310B">G01N23/20025</main-classification>
        <further-classification edition="201801120260310B">G01N23/16</further-classification>
        <further-classification edition="201801120260310B">G01N23/083</further-classification>
        <further-classification edition="200601120260310B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商理學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGAKU CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小城彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGI, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依據本發明之一實施例，提供一種用於放射線測定之試料保持具，其具備載置部以及限制部；該載置部具備能夠載置試料之載置面；該限制部相對於該載置面自由拆裝，並且具備藉由安裝於該載置面而從該載置面沿著垂直於該載置面之法線方向延伸之限制面，該限制面藉由沿著被載置於該載置面之該試料的外緣之至少一部分連續地延伸而形成凹部，該凹部被界定為以該載置面為底面、並以該限制面為連接於該底面之側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one aspect of the present invention, there is provided a sample holding device for radiation measurement, including a placing portion and a regulating portion. The placing portion includes a placing surface on which a sample can be placed. The regulating portion is attachable to and detachable from the placing surface and, when attached to the placing surface, includes a regulating surface that extends along a direction normal to the placing surface. The regulating surface extends continuously along at least part of an outer edge of a sample placed on the placing surface so as to form a recess, the recess being defined such that the placing surface serves as a bottom surface and the regulating surface serves as a side surface connected to the bottom surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:試料保持具</p>
        <p type="p">2:載置部</p>
        <p type="p">21:下面</p>
        <p type="p">22、32:外周面</p>
        <p type="p">23:載置面</p>
        <p type="p">23a:連接區域</p>
        <p type="p">23b:載置區域</p>
        <p type="p">24:取出通道</p>
        <p type="p">241:取出底面</p>
        <p type="p">242、243:取出側面</p>
        <p type="p">244:端面</p>
        <p type="p">3:限制部</p>
        <p type="p">31:連接面</p>
        <p type="p">33:限制面</p>
        <p type="p">34:頂面</p>
        <p type="p">OP1:開口部</p>
        <p type="p">Rc1:第一區域</p>
        <p type="p">D1:上下方向</p>
        <p type="p">D2:前後方向</p>
        <p type="p">D3:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1660" publication-number="202632895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具切換功能的彈性波元件</chinese-title>
        <english-title>ELASTIC WAVE DEVICE WITH SWITCHING CAPABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H9/64</main-classification>
        <further-classification edition="200601120260504B">H03H9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴朗德拉　西爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALLANDRAS, SYLVAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉羅什　蒂埃里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAROCHE, THIERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊瑞特　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAIRET, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克迪西　東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKDISSY, TONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種濾波器，包括：一可變阻抗裝置；一第一機電元件，特別是一第一換能器，以及一第二機電元件，特別是一第二換能器或一電極陣列，其被配置成反射由該第一機電元件所發射的至少部分彈性波，由至少一個電極所形成的一電極陣列，其在彈性波的傳播方向上，位於該第一機電元件與該第二機電元件之間，其中該電極陣列中的至少一個電極係經由該可變阻抗裝置而連接至一電位，該至少一個電極分別代表對應於該至少一個電極的一通道；一切換裝置，其被組構成透過該可變阻抗裝置對該濾波器施加特定邊界條件，以選取一特定通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A filter device comprising: a variable impedance means; a first electromechanical device, in particular, a first transducer, and a second electromechanical device, in particular, a second transducer or an electrode array configured to reflect at least partially elastic waves emitted by the first electromechanical device, an array of at least one electrode located between the first electromechanical device and the second electromechanical device in the direction of propagation of the elastic waves, wherein at least one electrode of the array of at least one electrode is connected to an electrical potential via the variable impedance means, the at least one electrode representing a channel corresponding to the at least one electrode, respectively; a switching means configured to select a specific channel by applying specific boundary conditions to the filter device via the variable impedance means.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10501:射頻輸入</p>
        <p type="p">10503:射頻輸出</p>
        <p type="p">10505:資料輸入</p>
        <p type="p">10507:時脈輸入</p>
        <p type="p">10509:晶片選取元件</p>
        <p type="p">10511:接地元件</p>
        <p type="p">10513:電壓元件</p>
        <p type="p">10515:串列周邊介面元件</p>
        <p type="p">10517:切換裝置</p>
        <p type="p">11500:濾波器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1661" publication-number="202632889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具頻率自我調整功能的彈性波元件</chinese-title>
        <english-title>ELASTIC WAVE DEVICE WITH FREQUENCY SELF-ADJUSTMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H9/08</main-classification>
        <further-classification edition="200601120260504B">H03H9/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴朗德拉　西爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALLANDRAS, SYLVAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉羅什　蒂埃里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAROCHE, THIERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊瑞特　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAIRET, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克迪西　東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKDISSY, TONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種彈性波元件(10000)，其包括一或多個可變阻抗裝置(1003，2003， 3003, 10400)，其中每個可變阻抗裝置(1003，2003， 3003，10400)包括一電容器，其被組構成依據溫度變化而改變電容量，以補償因溫度變化造成的該彈性波元件之工作頻率偏移；一第一機電元件(3，11130)，詳言之一第一換能器(3，11130)，以及一第二機電元件(5，11140)，詳言之一第二換能器(5， 11140)或一電極陣列，其被組構成用於反射由該第一機電元件(3，11130)所發射的至少部分彈性波；及由至少一個電極(1000，2000，3000)所形成的一電極陣列(4000，11150)，其在彈性波的傳播方向上，位於該第一機電元件(3，11130)與該第二機電元件(5，11140)之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an elastic wave device 10000 that comprises one or more variable impedance means 1003, 2003, 3003, 10400, wherein each variable impedance means 1003, 2003, 3003, 10400 comprises a capacitor configured to change capacity depending on temperature variation to compensate for a frequency shift of an operating frequency of the elastic wave device caused by the temperature variation; a first electromechanical device 3, 11130, in particular, a first transducer 3, 11130, and a second electromechanical device 5, 11140, in particular, a second transducer 5, 11140 or an electrode array configured to reflect at least partially elastic waves emitted by the first electromechanical device 3, 11130; and an array 4000, 11150 of at least one electrode 1000, 2000, 3000 located between the first electromechanical device 3, 11130 and the second electromechanical device 5, 11140 in the direction of propagation of the elastic waves.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11000:彈性波元件</p>
        <p type="p">11100:主動部分</p>
        <p type="p">11110,11120:反射結構/反射鏡</p>
        <p type="p">11130:換能器</p>
        <p type="p">11140:第二機電元件/第二換能器</p>
        <p type="p">11150:電極陣列</p>
        <p type="p">11300:溫度依賴性電容器/可變電容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1662" publication-number="202632888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具共振頻率調整功能的彈性波元件</chinese-title>
        <english-title>ELASTIC WAVE DEVICE WITH RESONANT FREQUENCY ADJUSTMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H9/02</main-classification>
        <further-classification edition="200601120260504B">H03H9/64</further-classification>
        <further-classification edition="200601120260504B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴朗德拉　西爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALLANDRAS, SYLVAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉羅什　蒂埃里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAROCHE, THIERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊瑞特　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAIRET, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克迪西　東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKDISSY, TONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彈性波元件，包括：一可變阻抗裝置；一第一機電元件，詳言之一第一換能器，以及一第二機電元件，詳言之一第二換能器或一電極陣列，其被組構成用於反射由該第一機電元件所發射的至少部分彈性波；由至少一個電極所形成的一電極陣列，其在彈性波的傳播方向上，位於該第一機電元件與該第二機電元件之間，其中該電極陣列中的至少一個電極係經由該可變阻抗裝置而連接至一電位；該電極陣列形成一腔體；一頻率調整裝置，其被組構成用以調整該腔體的共振頻率；控制裝置，其被組構成用於控制該可變阻抗裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An elastic wave device comprising: a variable impedance means; a first electromechanical device, in particular, a first transducer, and a second electromechanical device, in particular, a second transducer or an electrode array configured to reflect at least partially elastic waves emitted by the first electromechanical device, an array of at least one electrode located between the first electromechanical device and the second electromechanical device in the direction of propagation of the elastic waves, wherein at least one electrode of the array of at least one electrode is connected to an electrical potential via the variable impedance means; the array forming a cavity; a frequency-adjustment means configured to adjust the resonant frequency of the cavity; control means configured to control the variable impedance means.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11100:頻率調整裝置</p>
        <p type="p">11110:第一反射結構</p>
        <p type="p">11120:第二反射結構</p>
        <p type="p">11130:第一機電元件</p>
        <p type="p">11140:第二機電元件</p>
        <p type="p">11150:電極陣列</p>
        <p type="p">11160:第三埠</p>
        <p type="p">11300:彈性波元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1663" publication-number="202631593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、疊層體及圖案形成方法</chinese-title>
        <english-title>RESIST COMPOSITION, LAMINATE AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D347/00</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/09</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="202601120260504B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及解析度優良的非化學增幅阻劑組成物、以及使用該阻劑組成物之圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種阻劑組成物，其特徵為含有：下式(1)表示之超原子價碘化合物、含羧基之化合物及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="222px" width="192px" file="ed10130.JPG" alt="ed10130.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，a1、b1為整數，a1為0時b1係0~4，a1為1時b1係0~6，a1為2時b1係0~8。R&lt;sup&gt;11&lt;/sup&gt;為鹵素原子、或也可含有雜原子之碳數1~10之烴基。R&lt;sup&gt;21&lt;/sup&gt;為鹵素原子、或也可含有雜原子之碳數1~40之烴基。X為NR&lt;sup&gt;31&lt;/sup&gt;或S。R&lt;sup&gt;31&lt;/sup&gt;為氫原子、鹵素原子、或也可含有雜原子之碳數1~20之烴基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a resist composition containing a hypervalent iodine compound represented by the following formula (1), a carboxy group-containing compound, and a solvent: &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="154px" file="ed10131.JPG" alt="ed10131.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein a1 and b1 are each an integer, when a1 is 0, b1 is 0 to 4, when a1 is 1, b1 is 0 to 6, and when a1 is 2, b1 is 0 to 8; R&lt;sup&gt;11&lt;/sup&gt; is a halogen atom, or a hydrocarbyl group having 1 to 10 carbon atoms and optionally containing a heteroatom; R&lt;sup&gt;21&lt;/sup&gt; is a halogen atom, or a hydrocarbyl group having 1 to 40 carbon atoms and optionally containing a heteroatom; X is NR&lt;sup&gt;31&lt;/sup&gt; or S; and R&lt;sup&gt;31&lt;/sup&gt; is a hydrogen atom, a halogen atom, or a hydrocarbyl group having 1 to 20 carbon atoms and optionally containing a heteroatom. This can provide a non-chemically amplified resist composition excellent in sensitivity and resolvability in photolithography with a high energy line, and a patterning process in which the resist composition is used.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1664" publication-number="202631294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143846</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置、顯微鏡裝置及雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260428B">B23K26/362</main-classification>
        <further-classification edition="200601120260428B">B23K26/16</further-classification>
        <further-classification edition="200601120260428B">B23K26/067</further-classification>
        <further-classification edition="200601120260428B">H01S3/02</further-classification>
        <further-classification edition="201801120260428B">G01N23/2251</further-classification>
        <further-classification edition="200601120260428B">G02B26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原佳祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦隆二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福神純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUJIN, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之雷射加工裝置包含：配置部，其供配置對象物；雷射照射部，其用於照射第1雷射光及第2雷射光；及透過構件，其在配置於前述配置部之前述對象物、與前述雷射照射部之間，配置於前述第1雷射光及前述第2雷射光之光軸上，供前述第1雷射光及前述第2雷射光透過；且以自前述第1雷射光之光軸方向觀察，前述第2照射區域中之強度成為峰值之區域之至少一部分位於前述第1照射區域中之強度成為峰值之區域之外側之方式，將前述第1雷射光及前述第2雷射光集光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:試料保持具</p>
        <p type="p">2s:配置面</p>
        <p type="p">6:試料室(收容部)</p>
        <p type="p">7:蓋(透過構件)</p>
        <p type="p">7s:表面</p>
        <p type="p">48:透鏡(集光部)</p>
        <p type="p">A:試料(對象物)</p>
        <p type="p">Ai:入射面</p>
        <p type="p">Ds:掃描方向</p>
        <p type="p">L1:第1雷射光</p>
        <p type="p">L2:第2雷射光</p>
        <p type="p">P1:第1集光點</p>
        <p type="p">P2:第2集光點</p>
        <p type="p">R1:第1照射區域</p>
        <p type="p">R2:第2照射區域</p>
        <p type="p">S301,S302:步驟</p>
        <p type="p">X,Y,Z:軸</p>
        <p type="p">Z1:第1位置</p>
        <p type="p">Z2:第2位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1665" publication-number="202633018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及上部電極組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05H1/46</main-classification>
        <further-classification edition="200601120260504B">H05H1/02</further-classification>
        <further-classification edition="200601120260504B">H01J37/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦天馳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, TIANCHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示之基板處理裝置包含腔室、基板支持部、及上部電極組件。基板支持部配置於腔室內。上部電極組件配置於基板支持部之上方。上部電極組件包含頂板、支持體、及桿組件。支持體配置於頂板之上方。桿組件包含由支持體支持之上部零件、及從上部零件向下方延伸之桿。桿將頂板以使之能夠沿著與鉛直方向相交之橫向變形的方式予以支持。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">50:上部電極組件</p>
        <p type="p">51:頂板</p>
        <p type="p">51c:上表面中央區域</p>
        <p type="p">51e:上表面周緣區域</p>
        <p type="p">51m:上表面中間區域</p>
        <p type="p">51u:上表面</p>
        <p type="p">52:支持體</p>
        <p type="p">52b:下表面</p>
        <p type="p">52c:下表面中央區域</p>
        <p type="p">52e:下表面周緣區域</p>
        <p type="p">52f:冷媒流路</p>
        <p type="p">52m:下表面中間區域</p>
        <p type="p">54:冷卻器單元</p>
        <p type="p">60:夾具</p>
        <p type="p">71:第1傳熱片</p>
        <p type="p">72:第2傳熱片</p>
        <p type="p">AX:軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1666" publication-number="202631290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置、顯微鏡裝置及雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260504B">B23K26/0622</main-classification>
        <further-classification edition="201401120260504B">B23K26/046</further-classification>
        <further-classification edition="201401120260504B">B23K26/044</further-classification>
        <further-classification edition="200601120260504B">G02F1/1335</further-classification>
        <further-classification edition="200601120260504B">B23K26/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原佳祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福神純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUJIN, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之雷射加工裝置具備：雷射輸出部，其用於輸出具有1 ps以下之脈衝寬度之雷射光；偏光調整部，其接收自上述雷射輸出部輸出之上述雷射光之入射，以上述雷射光包含第1偏光方向之第1成分與正交於上述第1偏光方向之第2偏光方向之第2成分之方式，調整上述雷射光之偏光方向，並出射調整後之上述雷射光；空間光調變器，其接收自上述偏光調整部出射之上述雷射光之入射，對上述雷射光中之上述第1成分進行調變而作為調變光出射，且將上述雷射光中之上述第2成分作為非調變光出射；聚光部，其藉由將自上述空間光調變器出射之上述調變光及上述非調變光朝向上述對象物聚光，而於上述對象物形成包含上述調變光與上述非調變光之1個連續之照射區域；及掃描部，其用於對上述對象物掃描上述照射區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:腔室</p>
        <p type="p">11:入射部</p>
        <p type="p">20:雷射加工裝置</p>
        <p type="p">30:雷射輸出部</p>
        <p type="p">40:雷射光學系統</p>
        <p type="p">41:準直用透鏡</p>
        <p type="p">42:輸出控制部</p>
        <p type="p">43:束徑控制部</p>
        <p type="p">44:分支部</p>
        <p type="p">45:偏光調整部</p>
        <p type="p">46:空間光調變器</p>
        <p type="p">47:中繼光學系統</p>
        <p type="p">47a,47b:透鏡</p>
        <p type="p">48:檢流鏡(掃描部)</p>
        <p type="p">48a,48b:反射鏡</p>
        <p type="p">49:透鏡(聚光部)</p>
        <p type="p">51:束阻尼器</p>
        <p type="p">56,57:反射鏡</p>
        <p type="p">60:控制部</p>
        <p type="p">A:試料(對象物)</p>
        <p type="p">L1,L2,L3,L4:雷射光</p>
        <p type="p">Lm:調變光</p>
        <p type="p">Ln:非調變光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1667" publication-number="202631172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>病毒之細胞侵入阻礙劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K36/185</main-classification>
        <further-classification edition="200601120260504B">A61K36/48</further-classification>
        <further-classification edition="200601120260504B">A61K36/70</further-classification>
        <further-classification edition="200601120260504B">A61K36/54</further-classification>
        <further-classification edition="200601120260504B">A61K36/906</further-classification>
        <further-classification edition="200601120260504B">A61P31/16</further-classification>
        <further-classification edition="201601120260504B">A23L33/105</further-classification>
        <further-classification edition="201601120260504B">A23K10/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>悠子
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, MAYUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田島沙耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJIMA, SAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原鈴花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, SUZUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種病毒之細胞侵入阻礙劑，其會阻礙病毒侵入細胞，能夠預防病毒感染症。  &lt;br/&gt;　　解決本發明之課題的病毒之細胞侵入阻礙劑之特徵係含有選擇自小米草(Eyebright)萃取物、葫蘆巴(Kasuri Methi)萃取物、韃靼蕎麥萃取物、秋葵萃取物、桂皮萃取物、小檗萃取物及月桃萃取物之中至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1668" publication-number="202632219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用同調斷層掃描儀測量透明多層物體之方法及裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01B11/06</main-classification>
        <further-classification edition="202201120260504B">G01B9/02091</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商普雷茨特光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRECITEC OPTRONIK GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比亞洛翁斯　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIALOWONS, LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>密斯　賽門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIETH, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一種利用同調斷層掃描儀(11)測量多層物體(30)之方法中，將測量光在物體臂(18)中由光學系統(25)對準該物體(30)之表面。偵測器(36)對在該物體(30)之光學界面(40，42，44)處反射的測量光(OL)與在該參考臂(16)中導引之測量光(RL)的干涉進行檢測，並且轉換為電訊號。透過傅里葉變換由該等電訊號生成一頻譜，其中每個干涉皆由該頻譜中之一距離峰值(D1，D2，D3)代表。在由控制裝置(39)自動控制之製程中，多次重複該測量，其中在每次重複中改變該物體(30)與參考平面(52)之間的距離，該參考平面之軸向位置相當於該參考臂(18)之光程長度。透過分析該等距離峰值(D1，D2，D3)以及較佳地代表界面之間的距離的厚度峰值，確定該等距離峰值與該等界面(40，42，44)之間的明確對應關係，如此便能為該等界面分配距離值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測量裝置</p>
        <p type="p">11:同調斷層掃描儀</p>
        <p type="p">12:光源</p>
        <p type="p">14:第一分束器</p>
        <p type="p">16:參考臂</p>
        <p type="p">18:物體臂</p>
        <p type="p">20:面鏡</p>
        <p type="p">22:透鏡</p>
        <p type="p">23:透鏡</p>
        <p type="p">24:調光裝置</p>
        <p type="p">25:光學系統</p>
        <p type="p">26:透鏡</p>
        <p type="p">28:透鏡</p>
        <p type="p">30:物體</p>
        <p type="p">31:分束器</p>
        <p type="p">32:玻璃板</p>
        <p type="p">33:升降台</p>
        <p type="p">34:玻璃板</p>
        <p type="p">35:載物架</p>
        <p type="p">36:光譜儀</p>
        <p type="p">37:執行器</p>
        <p type="p">38:評價單元</p>
        <p type="p">39:控制裝置</p>
        <p type="p">RL:參考光</p>
        <p type="p">OL:物體光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1669" publication-number="202631759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接枝改質苯乙烯系彈性體及硬化性組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F287/00</main-classification>
        <further-classification edition="200601120260504B">C08L51/00</further-classification>
        <further-classification edition="200601120260504B">C08L71/12</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鐘化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊澤明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之接枝改質苯乙烯系彈性體係經不具有極性基之芳香族乙烯系單體接枝改質而成。於接枝改質苯乙烯系彈性體中，芳香族乙烯系單體之接枝率為0.5質量%以上。芳香族乙烯系單體之接枝率較佳為10.0質量%以下。硬化性組合物包含基礎材料、及接枝改質苯乙烯系彈性體。基礎材料較佳為包含聚苯醚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1670" publication-number="202631845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>再循環原料及製造其之方法</chinese-title>
        <english-title>RECYCLED RAW MATERIAL AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08J11/24</main-classification>
        <further-classification edition="200601120260504B">C07C67/02</further-classification>
        <further-classification edition="200601120260504B">C07C67/03</further-classification>
        <further-classification edition="200601120260504B">C07C67/48</further-classification>
        <further-classification edition="200601120260504B">C07C69/82</further-classification>
        <further-classification edition="200601120260504B">C08L67/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金芝勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI-HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳佳姈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, GAYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOONG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製備一再循環原料之方法，其包含使包含一主原料及一輔助原料之一反應原料解聚合，其中該主原料包含廢聚酯，且該輔助原料包含至少一種選自由以下組成之群的化合物：對苯二甲酸單羥乙酯(MHET)、間苯二甲酸雙(2-羥乙基)酯(BHEI)、對苯二甲酸2-羥乙基[2-(2-羥基乙氧基)乙基]酯(DEG-酯-1)、雙[2-(2-羥基乙氧基)乙基]苯-1,4-二甲酸酯(DEG-酯-2)、對苯二甲酸2-羥乙基(2-乙醯氧基乙基)酯(HA-酯)及對苯二甲酸2-羥乙基甲酯(ME-酯)，且係關於一種藉此製備之再循環原料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for preparing a recycled raw material, which comprises depolymerizing a reaction raw material comprising a main raw material and an auxiliary raw material, wherein the main raw material comprises waste polyester, and the auxiliary raw material comprises at least one compound selected from the group consisting of monohydroxyethyl terephthalate (MHET), bis(2-hydroxyethyl) isophthalate (BHEI), 2-hydroxyethyl[2-(2-hydroxyethoxy)ethyl] terephthalate (DEG-ester-1), bis[2-(2-hydroxyethoxy)ethyl]benzene-1,4-dicarboxylate (DEG-ester-2), 2-hydroxyethyl(2-acetoxyethyl) terephthalate (HA-ester), and 2-hydroxyethylmethyl terephthalate (ME-ester), and to a recycled raw material prepared thereby.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1671" publication-number="202631846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143930</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預處理摻合纖維的方法、包含該預處理的解聚合及包含該預處理之對苯二甲酸的製備</chinese-title>
        <english-title>METHOD FOR PRETREATING BLENDED FIBERS, DEPOLYMERIZATION COMPRISING THE PRETREATMENT AND PREPARATION OF TEREPHTHALIC ACID COMPRISING THE PRETREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08J11/24</main-classification>
        <further-classification edition="200601120260504B">C07C51/09</further-classification>
        <further-classification edition="200601120260504B">C07C63/26</further-classification>
        <further-classification edition="200601120260504B">C07C67/03</further-classification>
        <further-classification edition="200601120260504B">C07C69/82</further-classification>
        <further-classification edition="200601120260504B">C08G63/183</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜淍植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴真姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIN-HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安秀彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, SUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張有美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HEE-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於預處理摻合織物的方法及一種包含該預處理之用於解聚合的方法及包含該預處理之用於製備對苯二甲酸的方法。具體而言，根據本發明之一實施例，使包含聚酯纖維及聚氨酯纖維之摻合織物與有機溶劑接觸，其中根據方程式1，在與有機溶劑接觸之前及之後摻合織物中所含之聚氨酯纖維之含量的變化為0.7或更大。因此，可自摻合織物有效地移除聚氨酯纖維，藉此提高摻合織物內聚酯纖維之純度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for pretreating a blended textile and to a process for depolymerization and process for preparing terephthalic acid comprising the same. Specifically, according to an embodiment of the present invention, a blended textile comprising polyester fibers and polyurethane fibers is brought into contact with an organic solvent, whereby the change in content of the polyurethane fibers contained in the blended textile according to Equation 1 before and after contact with the organic solvent is 0.7 or more. As a result, the polyurethane fibers can be effectively removed from the blended textile, thereby enhancing the purity of the polyester fibers within the blended textile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1672" publication-number="202632166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電閥</chinese-title>
        <english-title>PIEZOELECTRIC VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">F16K31/02</main-classification>
        <further-classification edition="202301120260425B">H10N30/20</further-classification>
        <further-classification edition="202301120260425B">H10N30/87</further-classification>
        <further-classification edition="200601120260425B">G05D16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田佳生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本英也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, HIDEYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安部瑠之輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, RYUNOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓電閥(1)，由DC成分進行驅動，且具備：複數個壓電元件(12A、12B)，經由金屬鍍膜所構成的電極(14)，被電性並聯地連接；導電性的振動板(13)，經由電極(14)，被接合至複數個壓電元件(12A、12B)；以及電阻器(22)，被電性連接至複數個壓電元件(12A、12B)；其中，電阻器(22)的電性阻抗值(R1)為未達壓電元件(12A、12B)的絕緣阻抗值(R2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A piezoelectric valve (1) is a piezoelectric valve driven by a DC component, and includes a plurality of piezoelectric elements (12A, 12B) electrically connected in parallel via electrodes (14) made of a metal-plated film; a conductive diaphragm (13) joined to the plurality of piezoelectric elements via the electrodes; and a resistor (22) electrically connected to the plurality of piezoelectric elements, and an electric resistance value (R1) of the resistor is less than an insulation resistance value (R2) of each of the piezoelectric elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:壓電部</p>
        <p type="p">12,12A,12B:壓電元件</p>
        <p type="p">13:振動板</p>
        <p type="p">21:電源部</p>
        <p type="p">22:電阻器</p>
        <p type="p">R1:電性阻抗值</p>
        <p type="p">R2:絕緣阻抗值</p>
        <p type="p">R3:接觸阻抗值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1673" publication-number="202631523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蕃薯的加工裝置及蕃薯的加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260429B">C02F1/78</main-classification>
        <further-classification edition="200601120260429B">A23N12/00</further-classification>
        <further-classification edition="201601120260429B">A23L19/10</further-classification>
        <further-classification edition="202501120260429B">A23B2/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商喜諾得陽股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINODEYA, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種對蕃薯進行殺菌而能夠長期保存之加工裝置。  &lt;br/&gt;本發明之蕃薯之加工裝置100包含：殺菌洗淨裝置30，其對蕃薯(200)進行殺菌及洗淨；導入搬送裝置20，其將蕃薯(200)導入殺菌洗淨裝置30；及蕃薯排出裝置40，其使經殺菌洗淨裝置30處理之蕃薯(200)朝下游移動。在殺菌洗淨裝置30中，設置有使蕃薯(200)一面旋轉一面朝下游移動之複數個刷輥60、及向複數個刷輥60噴射含有臭氧水之洗淨水之噴射裝置65。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蕃薯投入部</p>
        <p type="p">20:蕃薯導入搬送裝置</p>
        <p type="p">30:殺菌洗淨裝置</p>
        <p type="p">31:殼體部</p>
        <p type="p">32:頂蓋部</p>
        <p type="p">33:銜接零件(滑槽)</p>
        <p type="p">40:蕃薯排出裝置(排出搬送裝置)/蕃薯排出搬送裝置</p>
        <p type="p">50:收集容器(蕃薯收集容器)</p>
        <p type="p">53:零件(滑槽)</p>
        <p type="p">55:收容筐搬送裝置(帶式輸送機)</p>
        <p type="p">100:蕃薯之加工裝置/加工裝置(蕃薯加工裝置)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1674" publication-number="202631560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144040</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>2-烷基烷醇之生產方法</chinese-title>
        <english-title>PROCESS FOR THE PRODUCTION OF 2-ALKYLALKANOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C29/141</main-classification>
        <further-classification edition="200601120260504B">C07C29/17</further-classification>
        <further-classification edition="200601120260504B">C07C29/80</further-classification>
        <further-classification edition="200601120260504B">C07C31/125</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商強生瑪西大維科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON MATTHEY DAVY TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉姆斯　邁克爾　加文　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIAMS, MICHAEL GAVIN JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴科司　雅德恩　法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACKES, ADRIAN FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種產物2-烷基烷醇流之生產方法。該方法包含將精製2-烷基烷醇流饋送至輕餾分去除蒸餾塔。自該輕餾分去除蒸餾塔之頂部處或頂部附近抽出輕餾分流，且自該輕餾分去除蒸餾塔之底部處或底部附近之第一位置抽出含重餾分之流。自該第一位置上方之第二位置抽出作為液體側線餾出物之該產物2-烷基烷醇流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for the production of a product 2-alkylalkanol stream is disclosed. The process comprises feeding a polished 2-alkylalkanol stream to a lights removal distillation column. A lights stream is withdrawn from at or near the top of the lights removal distillation column and a heavies containing stream is withdrawn from a first position at or near the bottom of the lights removal distillation column. The product 2-alkylalkanol stream is withdrawn as a liquid side draw from a second position above the first position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:精製2-烷基烷醇流</p>
        <p type="p">11:輕餾分去除蒸餾塔</p>
        <p type="p">12:輕餾分流</p>
        <p type="p">15:產物2-烷基烷醇流</p>
        <p type="p">17:含重餾分之流</p>
        <p type="p">19:塔底流</p>
        <p type="p">20:再沸器</p>
        <p type="p">21:再沸器流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1675" publication-number="202633393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以不同標稱方位角對半導體結構之同時多通道測量</chinese-title>
        <english-title>SIMULTANEOUS, MULTIPLE CHANNEL MEASUREMENTS OF SEMCIONDUCTOR STRUCTURES AT DIFFERENT NOMINAL AZIMUTH ANGLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260413B">H10P74/20</main-classification>
        <further-classification edition="200601120260413B">G01N21/25</further-classification>
        <further-classification edition="200601120260413B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞伯瑞穆　艾維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABRAMOV, AVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫茲尼斯夫　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUZNETSOV, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中呈現用各以不同標稱方位角之多個測量通道同時執行一半導體結構之基於光學之測量之方法及系統。在另一態樣中，測量通道以各標稱方位角同時收集按波長、收集角、偏振或其等之任何組合解析之測量資料。在一些實施例中，由一共用照明源產生之光學輻射細分成各路由至一不同測量通道之多個分段。依此方式，將照明源之更多光學輸出同時導引至半導體晶圓之測量點。在一些實施例中，多個照明光瞳孔徑經配置以在對應於各測量通道之方位方向、入射角方向或兩者上選擇不同數值孔徑。在另一態樣中，一多角度測量系統之不同測量通道在一不同光譜範圍內執行測量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for simultaneously performing optical based measurements of a semiconductor structure with multiple measurement channels each at different nominal azimuth angles are presented herein. In a further aspect, the measurement channels simultaneously collect measurement data resolved in wavelength, collection angle, polarization, or any combination thereof, at each nominal azimuth angle. In some embodiments, optical radiation generated by a shared illumination source is subdivided into multiple segments, each routed to a different measurement channel. In this manner, more of the optical output of the illumination source is simultaneously directed to the measurement spot of the semiconductor wafer. In some embodiments, multiple illumination pupil apertures are arranged to select different numerical apertures in the azimuth direction, the angle of incidence direction, or both, corresponding to each measurement channel. In another aspect, different measurement channels of a multi-angle measurement system perform measurements over a different spectral range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:照明光學器件</p>
        <p type="p">1B:收集光學器件</p>
        <p type="p">1C:偵測器</p>
        <p type="p">2A:照明光學器件</p>
        <p type="p">2B:收集光學器件</p>
        <p type="p">2C:偵測器</p>
        <p type="p">3A:照明光學器件</p>
        <p type="p">3B:收集光學器件</p>
        <p type="p">3C:偵測器</p>
        <p type="p">4A:照明光學器件</p>
        <p type="p">4B:收集光學器件</p>
        <p type="p">4C:偵測器</p>
        <p type="p">100:多角度測量系統/度量系統</p>
        <p type="p">116:測量點</p>
        <p type="p">120:晶圓</p>
        <p type="p">130:運算系統</p>
        <p type="p">131:處理器</p>
        <p type="p">132:記憶體</p>
        <p type="p">133:匯流排</p>
        <p type="p">134:程式指令</p>
        <p type="p">140:照明源</p>
        <p type="p">141:照明光</p>
        <p type="p">142:光束整形光學元件</p>
        <p type="p">143:照明光瞳孔徑</p>
        <p type="p">144:偏振元件/線性偏振器</p>
        <p type="p">145:偏振元件/四分之一波板</p>
        <p type="p">146:光學元件/選截鏡</p>
        <p type="p">147:反射鏡元件</p>
        <p type="p">148:反射鏡元件</p>
        <p type="p">149:光學元件/分束器</p>
        <p type="p">150:反射鏡</p>
        <p type="p">151:光學元件/選截鏡</p>
        <p type="p">152:反射鏡元件</p>
        <p type="p">153:反射鏡元件</p>
        <p type="p">161至164:照明光束</p>
        <p type="p">171至174:輸出信號/測量信號</p>
        <p type="p">175:控制信號</p>
        <p type="p">180:關注參數</p>
        <p type="p">AZ&lt;sub&gt;W&lt;/sub&gt;:晶圓處之方位角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1676" publication-number="202631968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>潤滑脂組成物、封入其的滾動軸承及馬達</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C10M107/02</main-classification>
        <further-classification edition="200601120260504B">C10M115/08</further-classification>
        <further-classification edition="200601120260504B">C10M137/04</further-classification>
        <further-classification edition="200601120260504B">C10M137/10</further-classification>
        <further-classification edition="200601120260504B">C10M169/02</further-classification>
        <further-classification edition="200601120260504B">C10M169/04</further-classification>
        <further-classification edition="200601120260504B">F16C33/66</further-classification>
        <further-classification edition="200601120260504B">H02K5/173</further-classification>
        <further-classification edition="200601320260504B">C10N30/06</further-classification>
        <further-classification edition="200601320260504B">C10N40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤正毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示出優異的耐摩擦-磨損特性，並且即使在高溫-高速旋轉環境下亦實現長壽命的潤滑脂組成物。一種潤滑脂組成物，含有合成烴油、脲系增稠劑、以及極壓添加劑，所述潤滑脂組成物中，所述極壓添加劑為選自由酸式磷酸烯基酯及三硫代亞磷酸三烷基酯所組成的群組中的至少一種，所述潤滑脂組成物不包含硬脂酸金屬鹽及醯胺化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滾動軸承</p>
        <p type="p">11:內圈</p>
        <p type="p">12:外圈</p>
        <p type="p">13:滾動體</p>
        <p type="p">14:保持器</p>
        <p type="p">15:密封構件</p>
        <p type="p">16:軸承空間</p>
        <p type="p">G:潤滑脂組成物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1677" publication-number="202631628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於合成及純化均苯四甲酸二酐之方法與相關組成物</chinese-title>
        <english-title>METHODS FOR THE SYNTHESIS AND PURIFICATION OF PYROMELLITIC DIANHYDRIDE AND RELATED COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C07D493/04</main-classification>
        <further-classification edition="200601120260430B">C07D307/89</further-classification>
        <further-classification edition="200601120260430B">C07C63/313</further-classification>
        <further-classification edition="200601120260430B">B01J19/00</further-classification>
        <further-classification edition="202601120260430B">H10P14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾曼特　大衛　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERMERT, DAVID M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於合成及純化均苯四甲酸二酐之方法及相關組成物。該方法包含獲得固體組成物。該固體組成物包含均苯四甲酸酐、均苯四甲酸或其任何組合中之至少一者。該方法包含在足以將該均苯四甲酸酐、該均苯四甲酸或其組合中之至少一者轉化為反應產物之溫度及壓力下加熱該固體組成物。該反應產物包含藉由&lt;sup&gt;1&lt;/sup&gt;H NMR所量測之純度為至少99.9%的均苯四甲酸二酐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and related compositions for the synthesis and purification of pyromellitic dianhydride are provided. The method comprises obtaining a solid composition. The solid composition comprises at least one of a pyromellitic anhydride, a pyromellitic acid, or any combination thereof. The method comprises heating the solid composition at a temperature and a pressure sufficient to convert at least one of the pyromellitic anhydride, the pyromellitic acid, or a combination thereof to a reaction product. The reaction product comprises a pyromellitic dianhydride having a purity of at least 99.9% as measured by &lt;sup&gt;1&lt;/sup&gt;H NMR.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1678" publication-number="202631372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓級組件的眼用鏡片陣列</chinese-title>
        <english-title>OPHTHALMIC LENS ARRAYS FOR WAFER-LEVEL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B29D11/00</main-classification>
        <further-classification edition="200601120260421B">B29C33/38</further-classification>
        <further-classification edition="200601120260421B">G02B6/00</further-classification>
        <further-classification edition="200601120260421B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪馬　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEMA, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾普比　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLEBY, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂芬　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIFFIN, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體而言係關於擴增實境系統。更具體地說，本文所描述的實施例提供了具有至少一個眼用鏡片的波導、擴增實境系統、製造具有眼用鏡片的波導的方法，以及用於製造具有眼用鏡片的波導的組件，這些均在本文展示和描述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to augmented reality systems. More specifically, embodiments described herein provide for a waveguide with at least one ophthalmic lens, an augmented reality system, a method of fabricating waveguides with ophthalmic lenses, and an assembly for fabricating waveguides with ophthalmic lenses are shown and described herein</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡片基板</p>
        <p type="p">101:陣列</p>
        <p type="p">120:波導基板</p>
        <p type="p">125:波導</p>
        <p type="p">126:輸入耦合器</p>
        <p type="p">129:中介光柵</p>
        <p type="p">130:黏著材料</p>
        <p type="p">133:氣隙</p>
        <p type="p">140:黏接層</p>
        <p type="p">180:鏡片</p>
        <p type="p">180':鏡片</p>
        <p type="p">182:陣列</p>
        <p type="p">185:底表面</p>
        <p type="p">185':底表面</p>
        <p type="p">187:波導組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1679" publication-number="202631883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱硬化性樹脂組成物、乾膜、硬化物及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L63/10</main-classification>
        <further-classification edition="200601120260420B">C08G59/00</further-classification>
        <further-classification edition="200601120260420B">C08L33/10</further-classification>
        <further-classification edition="201801120260420B">C08K3/014</further-classification>
        <further-classification edition="200601120260420B">C08K3/14</further-classification>
        <further-classification edition="200601120260420B">C08L101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田悠佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲田和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種可形成具有高熱傳導性之硬化物，且具有對基材的高貼合性之熱硬化性樹脂組成物。&lt;br/&gt;  於本發明之解決問題的技術手段係為：於熱硬化性樹脂組成物摻合環氧樹脂、熱傳導性填料、及聚伸烷基二醇衍生物，將前述熱傳導性填料設為實質上不含磁性粒子者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1680" publication-number="202631768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱傳導聚合物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G12/08</main-classification>
        <further-classification edition="200601120260504B">C08G59/22</further-classification>
        <further-classification edition="200601120260504B">C08G59/40</further-classification>
        <further-classification edition="200601120260504B">C08G59/50</further-classification>
        <further-classification edition="200601120260504B">C08L61/22</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="200601120260504B">C08L71/02</further-classification>
        <further-classification edition="200601120260504B">C08L79/02</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">F28F21/06</further-classification>
        <further-classification edition="200601120260504B">H05K7/20</further-classification>
        <further-classification edition="202601120260504B">H10W40/22</further-classification>
        <further-classification edition="202601120260504B">H10W40/25</further-classification>
        <further-classification edition="202601120260504B">H10W70/40</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑟　佛洛倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURCET, FLORENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈桑尼　法桑奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASSANI, FARZANEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦逸群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛來契　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLETCHER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納蘭霍　胡安曼　莫雷諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARANJO, JUANMA MORENO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含：包含式(I)之重複單元的聚合物；以及包含複數個可交聯基團的可固化材料及能夠與可交聯材料反應以形成交聯網路的固化劑中之至少一者：  &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="262px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;係各自獨立地選自式(II)及(III)：  &lt;br/&gt;-(Ar&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;m&lt;/sub&gt;-                  式(II)  &lt;br/&gt;-(Ar&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;p&lt;/sub&gt;-L-(Ar&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;q&lt;/sub&gt;-      式(III)  &lt;br/&gt;其中Ar&lt;sup&gt;1&lt;/sup&gt;、Ar&lt;sup&gt;2&lt;/sup&gt;及Ar&lt;sup&gt;3&lt;/sup&gt;在每次出現時為伸芳基或伸雜芳基基團；m為至少1；p為0、1、2或3；q為0、1、2或3，且L係選自O、S、C=O、COO、CONR&lt;sup&gt;5&lt;/sup&gt;、NR&lt;sup&gt;5&lt;/sup&gt;、Si(R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt; C(R&lt;sup&gt;7&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;及視情況經取代之亞甲基(-CH&lt;sub&gt;2&lt;/sub&gt;-)基團之鏈，其中一個或多個非相鄰亞甲基基團可經O、S、C=O、COO、CONR&lt;sup&gt;5&lt;/sup&gt;、NR&lt;sup&gt;5&lt;/sup&gt;或Si(R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;替換，其中R&lt;sup&gt;5&lt;/sup&gt;為H或取代基；各R&lt;sup&gt;6&lt;/sup&gt;獨立地為取代基；且各R&lt;sup&gt;7&lt;/sup&gt;獨立地為取代基；  &lt;br/&gt;Y&lt;sup&gt;1&lt;/sup&gt;及Y&lt;sup&gt;2&lt;/sup&gt;中之一者為CR&lt;sup&gt;1&lt;/sup&gt;，其中R&lt;sup&gt;1&lt;/sup&gt;為H或取代基；且Y&lt;sup&gt;1&lt;/sup&gt;及Y&lt;sup&gt;2&lt;/sup&gt;中之另一者為N；及  &lt;br/&gt;Y&lt;sup&gt;3&lt;/sup&gt;及Y&lt;sup&gt;4&lt;/sup&gt;中之一者為CR&lt;sup&gt;1&lt;/sup&gt;；且Y&lt;sup&gt;3&lt;/sup&gt;及Y&lt;sup&gt;4&lt;/sup&gt;中之另一者為N。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising a polymer comprising a repeat unit of formula (I) and at least one of a curable material comprising a plurality of crosslinkable groups and a curing agent capable of reacting with a crosslinkable material to form a crosslinked network: &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="245px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt; and X&lt;sup&gt;2&lt;/sup&gt; are each independently selected from formulae (II) and (III): &lt;br/&gt;-(Ar&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;m&lt;/sub&gt;- Formula (II) &lt;br/&gt;-(Ar&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;p&lt;/sub&gt;-L-(Ar&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;q&lt;/sub&gt;- Formula (III) &lt;br/&gt;wherein Ar&lt;sup&gt;1&lt;/sup&gt;, Ar&lt;sup&gt;2&lt;/sup&gt; and Ar&lt;sup&gt;3&lt;/sup&gt; in each occurrence is an arylene or heteroarylene group; m is at least 1; p is 0, 1, 2 or 3; q is 0, 1, 2 or 3, and L is selected from O, S, C=O, COO, CONR&lt;sup&gt;5&lt;/sup&gt;, NR&lt;sup&gt;5&lt;/sup&gt;, Si(R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt; C(R&lt;sup&gt;7&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt; and an optionally substituted chain of methylene (-CH&lt;sub&gt;2&lt;/sub&gt;-) groups wherein one or more non-adjacent methylene groups may be replaced with O, S, C=O, COO, CONR&lt;sup&gt;5&lt;/sup&gt;, NR&lt;sup&gt;5&lt;/sup&gt; or Si(R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt; wherein R&lt;sup&gt;5&lt;/sup&gt; is H or a substituent; each R&lt;sup&gt;6&lt;/sup&gt; is independently a substituent; and each R&lt;sup&gt;7&lt;/sup&gt; is independently a substituent; &lt;br/&gt;one of Y&lt;sup&gt;1&lt;/sup&gt; and Y&lt;sup&gt;2&lt;/sup&gt; is CR&lt;sup&gt;1&lt;/sup&gt; wherein R&lt;sup&gt;1&lt;/sup&gt; is H or a substituent; and the other of Y&lt;sup&gt;1&lt;/sup&gt; and Y&lt;sup&gt;2&lt;/sup&gt; is N; and &lt;br/&gt;one of Y&lt;sup&gt;3&lt;/sup&gt; and Y&lt;sup&gt;4&lt;/sup&gt; is CR&lt;sup&gt;1&lt;/sup&gt;; and the other of Y&lt;sup&gt;3&lt;/sup&gt; and Y&lt;sup&gt;4&lt;/sup&gt; is N.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1681" publication-number="202631769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物</chinese-title>
        <english-title>COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G12/08</main-classification>
        <further-classification edition="200601120260504B">C08G59/40</further-classification>
        <further-classification edition="200601120260504B">C08L61/22</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">F28F21/06</further-classification>
        <further-classification edition="200601120260504B">H05K7/20</further-classification>
        <further-classification edition="202601120260504B">H10W40/22</further-classification>
        <further-classification edition="202601120260504B">H10W40/25</further-classification>
        <further-classification edition="202601120260504B">H10W70/40</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑟　佛洛倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURCET, FLORENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納蘭霍　胡安曼　莫雷諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARANJO, JUANMA MORENO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班傑明　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENJAMIN, HELEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含：可固化材料，其包含一種或多種視情況經取代之環氧化物單元；及聚合物，其包含式(I)之重複單元：  &lt;br/&gt;&lt;img align="absmiddle" height="148px" width="258px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;各自獨立地選自式(II)及式(III)，其限制條件為，X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;中之至少一者為式(II)之基團：  &lt;br/&gt;-(Ar&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;m&lt;/sub&gt;-                           式(II)  &lt;br/&gt;-(Ar&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;p&lt;/sub&gt;-L-(Ar&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;q&lt;/sub&gt;-                    式(III)  &lt;br/&gt;其中Ar&lt;sup&gt;1&lt;/sup&gt;、Ar&lt;sup&gt;2&lt;/sup&gt;及Ar&lt;sup&gt;3&lt;/sup&gt;在每次出現時獨立地為伸芳基或伸雜芳基基團；m為至少1；p為至少1；q為至少一；且L為脂族連接基團；  &lt;br/&gt;式(II)之基團係經至少一個選自C&lt;sub&gt;1-40&lt;/sub&gt;烷基的取代基R&lt;sup&gt;2&lt;/sup&gt;取代，其中該C&lt;sub&gt;1-40&lt;/sub&gt;烷基之至少兩個非相鄰、非端C原子係經O替換；   &lt;br/&gt;Y&lt;sup&gt;1&lt;/sup&gt;及Y&lt;sup&gt;2&lt;/sup&gt;中之一者為CR&lt;sup&gt;1&lt;/sup&gt;，其中R&lt;sup&gt;1&lt;/sup&gt;為H或取代基；且Y&lt;sup&gt;1&lt;/sup&gt;及Y&lt;sup&gt;2&lt;/sup&gt;中之另一者為N；並且  &lt;br/&gt;Y&lt;sup&gt;3&lt;/sup&gt;及Y&lt;sup&gt;4&lt;/sup&gt;中之一者為CR&lt;sup&gt;1&lt;/sup&gt;；且Y&lt;sup&gt;3&lt;/sup&gt;及Y&lt;sup&gt;4&lt;/sup&gt;中之另一者為N。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising a curable material comprising one or more optionally substituted epoxide units and a polymer comprising a repeat unit of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="156px" width="264px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt; and X&lt;sup&gt;2&lt;/sup&gt; are each independently selected from formulae (II) and (III) with the proviso that at least one of X&lt;sup&gt;1&lt;/sup&gt; and X&lt;sup&gt;2&lt;/sup&gt; is a group of formula (II): &lt;br/&gt;-(Ar&lt;sup&gt;1&lt;/sup&gt;)&lt;sub&gt;m&lt;/sub&gt;- Formula (II) &lt;br/&gt;-(Ar&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;p&lt;/sub&gt;-L-(Ar&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;q&lt;/sub&gt;- Formula (III) &lt;br/&gt;wherein Ar&lt;sup&gt;1&lt;/sup&gt;, Ar&lt;sup&gt;2&lt;/sup&gt; and Ar&lt;sup&gt;3&lt;/sup&gt; independently in each occurrence is an arylene or heteroarylene group; m is at least 1; p is at least 1; q is at least one; and L is an aliphatic linking group; &lt;br/&gt;the group of Formula (II) is substituted with at least one substituent R&lt;sup&gt;2&lt;/sup&gt; selected from C&lt;sub&gt;1-40 &lt;/sub&gt;alkyl in which at least two non-adjacent, non-terminal C-atoms of the C&lt;sub&gt;1-40 &lt;/sub&gt;alkyl are replaced with O; &lt;br/&gt;one of Y&lt;sup&gt;1&lt;/sup&gt; and Y&lt;sup&gt;2&lt;/sup&gt; is CR&lt;sup&gt;1&lt;/sup&gt; wherein R&lt;sup&gt;1&lt;/sup&gt; is H or a substituent; and the other of Y&lt;sup&gt;1&lt;/sup&gt; and Y&lt;sup&gt;2&lt;/sup&gt; is N; and &lt;br/&gt;one of Y&lt;sup&gt;3&lt;/sup&gt; and Y&lt;sup&gt;4&lt;/sup&gt; is CR&lt;sup&gt;1&lt;/sup&gt;; and the other of Y&lt;sup&gt;3&lt;/sup&gt; and Y&lt;sup&gt;4&lt;/sup&gt; is N.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1682" publication-number="202632086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鍍裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C25D17/00</main-classification>
        <further-classification edition="200601120260504B">C25D17/02</further-classification>
        <further-classification edition="200601120260504B">C25D17/06</further-classification>
        <further-classification edition="200601120260504B">C25D17/10</further-classification>
        <further-classification edition="200601120260504B">C25D21/12</further-classification>
        <further-classification edition="200601120260504B">C25D3/12</further-classification>
        <further-classification edition="202601120260504B">H10P14/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, ZHENGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金一諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YINUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石軼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左經之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUO, JINGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種電鍍裝置，包括電鍍腔和金屬單元，金屬單元置於電鍍腔的陽極腔內，電鍍腔內容納有包含金屬單元對應金屬的離子的電鍍液；電鍍腔內設置有惰性電極，惰性電極被配置成與金屬單元在基板非鍍敷期間電連接以形成迴路，在迴路中，惰性電極充當陽極，金屬單元充當陰極，惰性電極和金屬單元之間被施加一預設電壓，預設電壓低於金屬單元在基板非鍍敷期間發生電化學反應的閾值電壓。本申請中的電鍍裝置在非鍍敷期間，惰性電極充當陽極，金屬單元充當陰極，惰性電極和金屬單元之間所施加的電壓低於金屬單元在基板非鍍敷期間發生電化學反應的閾值電壓，使得金屬單元處於較弱的陰極極化狀態，抑制金屬單元在電鍍液中的自溶解。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電鍍腔</p>
        <p type="p">5:鈦板</p>
        <p type="p">6:擋牆</p>
        <p type="p">7:離子交換膜</p>
        <p type="p">8:基板</p>
        <p type="p">11:陽極腔</p>
        <p type="p">12:陰極腔</p>
        <p type="p">21:第一金屬單元</p>
        <p type="p">22:第二金屬單元</p>
        <p type="p">31:第一惰性電極</p>
        <p type="p">32:第二惰性電極</p>
        <p type="p">41:第一電源</p>
        <p type="p">42:第二電源</p>
        <p type="p">111:第一安裝孔</p>
        <p type="p">112:第二安裝孔</p>
        <p type="p">113:陽極腔殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1683" publication-number="202631619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＤＫ２抑制劑化合物</chinese-title>
        <english-title>CDK2 INHIBITOR COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D471/04</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">C07D239/94</further-classification>
        <further-classification edition="200601120260504B">C07D401/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/4375</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/517</further-classification>
        <further-classification edition="200601120260504B">A61K31/4725</further-classification>
        <further-classification edition="200601120260504B">A61K31/472</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/519</further-classification>
        <further-classification edition="200601120260504B">A61K31/541</further-classification>
        <further-classification edition="200601120260504B">A61K31/497</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿列克希雅醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEKSIA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　艾咪　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HART, AMY C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利浦　安德魯　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, ANDREW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉薩斯基　基爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAZARSKI, KIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魁奇　瑞雪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUACH, RACHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆斯尼爾　克勞迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUESNELLE, CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供CDK2抑制劑化合物，該等化合物可具有稠合的6-6雙環核心，諸如&lt;img align="absmiddle" height="19px" width="19px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;啶、喹唑啉、吡啶并嘧啶或進一步經取代的相關等排核心結構。本文亦提供包括本發明之CDK2抑制劑化合物的醫藥組合物，及使用本揭露內容之組合物作為抗癌治療劑的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides CDK2 inhibitor compounds that can have a fused 6-6 bicyclic core, such as a naphthyridine, quinazoline, pyridopyrimidine or related isosteric core structure that is further substituted. Also provided herein are pharmaceutical compositions including the subject CDK2 inhibitor compounds, and methods for using compositions of the disclosure as anticancer therapeutics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1684" publication-number="202631813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造聚(醚醯亞胺)聚合物之方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING A POLY(ETHERIMIDE) POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">H01B3/30</further-classification>
        <further-classification edition="200601120260504B">H01B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商艾倫塔斯歐洲有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELANTAS EUROPE S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>必昂迪　潔維娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIONDI, GIOVANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛基　潔維尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOGGI, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史賓奈利　羅倫佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPINELLI, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造聚(醚醯亞胺)聚合物之方法，其包括加熱含有芳香族雙(醚酐)及/或其羧酸前體、二異氰酸酯及第一溶劑之溶液。在第一加熱步驟中，以5℃/h至30℃/h之第一加熱速率將該溶液加熱至50℃至120℃之第一溫度範圍內之溫度且隨後在該第一溫度範圍內保持1 h至8 h。在第二加熱步驟中，以10℃/h至30℃/h之第二加熱速率將該溶液加熱至145℃至165℃之第二溫度範圍內之溫度且隨後在該第二溫度範圍內保持3 h至6 h。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a poly(etherimide) polymer comprises heating a solution comprising an aromatic bis(ether anhydride) and/or its carboxylic acid precursor, a diisocyanate and a first solvent. In a first heating step the solution is heated to a temperature in a first temperature range of 50 °C to 120 °C with a first heating rate of 5 °C/h to 30 °C/h and subsequently held within the first temperature range for 1 h to 8 h. In a second heating step the solution is heated to a temperature in a second temperature range of 145 °C to 165 °C with a second heating rate of 10° C/h to 30 °C/h and subsequently held within the second temperature range for 3 h to 6 h.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1685" publication-number="202633343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260430B">H10P72/30</main-classification>
        <further-classification edition="200601120260430B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤直紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTEGI, SUGURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高世真美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASE, MAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田凜太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之基板處理系統包含真空搬送腔室、複數個處理模組、複數個搬送器件、及控制部。複數個處理模組連接於真空搬送腔室，構成為於其內部處理基板。複數個搬送器件配置於真空搬送腔室之真空搬送空間內。控制部構成為控制複數個搬送器件中之至少兩個搬送器件，而於真空搬送腔室與複數個處理模組中之至少兩個處理模組各者之間並行地進行基板之搬送。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理系統</p>
        <p type="p">10:真空搬送腔室</p>
        <p type="p">11:處理模組</p>
        <p type="p">12:氣體供給部</p>
        <p type="p">13:裝載埠</p>
        <p type="p">14:裝載模組</p>
        <p type="p">16:基板載具</p>
        <p type="p">111:處理模組</p>
        <p type="p">112:處理模組</p>
        <p type="p">113:處理模組</p>
        <p type="p">114:處理模組</p>
        <p type="p">115:處理模組</p>
        <p type="p">116:處理模組</p>
        <p type="p">121:氣體供給部</p>
        <p type="p">122:氣體供給部</p>
        <p type="p">123:氣體供給部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1686" publication-number="202632105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>縫紉機</chinese-title>
        <english-title>SEWING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">D05B65/00</main-classification>
        <further-classification edition="200601120260430B">D05B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大和縫紉機製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMATO MISHIN SEIZO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡部正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKABE, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種縫紉機，具備：針；及針板，將布料從下方支撐，具有讓上下動的前述針貫通的落針孔；及彎針，從前述針板的下方將彎針線保持，且以使得前述彎針線絞織在針線的方式往復動；及切刀部，在前述針板及前述彎針之間移動，將與縫製後的前述布料連接的前述針線及前述彎針線切斷；前述切刀部，其切斷前述針線及前述彎針線的切斷位置是對於前述針板可位置變更，對於前述位置變更之後的狀態且實施切斷前的姿勢的前述切刀部，在前述針板及前述彎針之間可確保配置該切刀部空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention includes: a needle; a stitch plate configured to support a fabric from below and having a needle hole through which the needle moves up and down; a looper configured to hold a looper thread below the stitch plate and reciprocally move to entangle the looper thread with a needle thread; and a knife configured to move between the stitch plate and the looper to cut the needle thread and the looper thread connected to the fabric after being sewn, the knife can be positionally changed relative to the stitch plate to change a cutting position at which the needle thread and the looper thread are cut, and a space is secured between the stitch plate and the looper for allowing the positionally changed knife in a posture before the cutting to be disposed therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:縫紉機</p>
        <p type="p">2:針</p>
        <p type="p">3:針板</p>
        <p type="p">4:彎針</p>
        <p type="p">5:切刀機構</p>
        <p type="p">31:落針孔</p>
        <p type="p">41:彎針軸</p>
        <p type="p">51:基座部</p>
        <p type="p">52:合閉起動部</p>
        <p type="p">53:第1傳達部</p>
        <p type="p">54:第2傳達部</p>
        <p type="p">55:切刀部</p>
        <p type="p">56:可動切刀操作部</p>
        <p type="p">57:開度調整部</p>
        <p type="p">58:切刀轉動支點部</p>
        <p type="p">59:副固定螺栓</p>
        <p type="p">511:支撐板</p>
        <p type="p">512:長孔(支撐板)</p>
        <p type="p">531:轉動支點部</p>
        <p type="p">541:凹部</p>
        <p type="p">542:基端側長孔</p>
        <p type="p">543:前端側長孔</p>
        <p type="p">544:復歸彈簧</p>
        <p type="p">551:固定切刀</p>
        <p type="p">552:可動切刀</p>
        <p type="p">561:中間部</p>
        <p type="p">571:操作桿</p>
        <p type="p">A:切刀用致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1687" publication-number="202631872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>犧牲組成物、製造裝置之方法及聲波裝置</chinese-title>
        <english-title>SACRIFICIAL COMPOSITION, METHOD FOR PRODUCING DEVICE, AND ACOUSTIC WAVE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L53/00</main-classification>
        <further-classification edition="200601120260504B">C08L69/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/09</further-classification>
        <further-classification edition="200601120260504B">C08K5/13</further-classification>
        <further-classification edition="200601120260504B">C08K5/17</further-classification>
        <further-classification edition="200601120260504B">C08K5/42</further-classification>
        <further-classification edition="200601120260504B">H03H9/05</further-classification>
        <further-classification edition="200601120260504B">H03H9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原章滋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野友嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, TOMOTSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島由雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁川裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITOKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供一種犧牲組合物。&lt;br/&gt;  [解決方案]&lt;br/&gt;  該犧牲組成物包含：經酸催化分解之聚合物(A)；透過加熱產生酸之化合物(B)；及溶劑(C)，其中該透過加熱產生酸之化合物(B)由羧酸與鹼組成，且基於100質量份之該聚合物(A)，該化合物(B)的含量為1至60質量份。&lt;br/&gt;  該犧牲組合物可展現作爲先進材料或作為高性能材料的至少一種性能。該犧牲組合物可用於奈米科技程序中，以製做半導體裝置/顯示裝置應用，例如半導體晶片，或在由半導體控制的基板上製備的液晶、量子點、OLED顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem]&lt;br/&gt; Provided is a sacrificial composition.&lt;br/&gt; [Solution]&lt;br/&gt; The sacrificial composition comprises a polymer (A) that undergoes acid-catalyzed decomposition, a compound (B) that generates an acid by heat, and a solvent (C), wherein the compound (B) that generates the acid by heat consists of a carboxylic acid and a base, and a content of the compound (B) is 1 to 60 parts by mass based on 100 parts by mass of the polymer (A).&lt;br/&gt; The sacrificial composition may exhibit at least one of properties as an advanced material or as a high performance material. The sacrificial composition may be used in the nanotechnology process to make semiconductor device/display device application, for example semiconductor chip, or a liquid crystal, quantum dot, OLED display fabricated on a substrate controlled by semiconductors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:支撐基板</p>
        <p type="p">102:壓電基板</p>
        <p type="p">103:光阻層</p>
        <p type="p">104:鋁合金膜</p>
        <p type="p">105:氧化矽膜</p>
        <p type="p">106:保護層</p>
        <p type="p">107:犧牲層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1688" publication-number="202631453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飛行器致動系統</chinese-title>
        <english-title>AN AIRCRAFT ACTUATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B64C27/59</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＢＡＥ系統公營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE SYSTEMS PLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍蘭德斯　羅伯大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLANDS, ROBERT DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第　賈斯丁馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEE, JUSTIN MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種用於飛行器致動系統的安全元件，其中該飛行器致動系統包括一致動器、一操縱器及使該致動器連接至該操縱器的一剪力銷。該安全元件包括一緩衝區，其配置成在該飛行器致動系統中響應一超出力事件而變形，並且該安全元件可位於該剪力銷與該致動器之間。該安全元件可減少在超出力事件期間施加至一元件(例如，該剪力銷)的力。特別是在該超出力事件是由該致動器引起的情況下，可阻止該剪力銷斷裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A safety element for an aircraft actuation system comprising an actuator, an inceptor, and a shear pin connecting the motor to the inceptor is described. The safety element comprises an absorber zone which is configured to deform in response to an excess force event in the aircraft actuation system, and is locatable between the shear pin and the actuator. The safety element reduces a force applied to an element such as the shear pin during the excess force event. Especially, where the excess force event is caused by the actuator, the shear pin is preventable from breaking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:機械聯動裝置</p>
        <p type="p">400:飛行器致動系統</p>
        <p type="p">402:雙臂曲柄</p>
        <p type="p">404:剪力銷</p>
        <p type="p">406:致動器</p>
        <p type="p">408:曲柄</p>
        <p type="p">410:安全元件</p>
        <p type="p">412:機械聯動裝置</p>
        <p type="p">414A:操縱桿</p>
        <p type="p">414B:操縱桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1689" publication-number="202632220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測量擴散板開口的光學系統和方法</chinese-title>
        <english-title>OPTICAL SYSTEM AND METHOD FOR MEASURING DIFFUSER PLATE OPENINGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G01B11/08</main-classification>
        <further-classification edition="202601120260423B">H10P74/20</further-classification>
        <further-classification edition="200601120260423B">G02B27/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方仁宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, JEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宥霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱永欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文方法係關於用於量測擴散板開口的光學系統以及方法。在一種方法中，用於分析擴散器的光學系統可以包括與支撐結構耦合的光學感測器，其中光學感測器包含透鏡組件，透鏡組件可操作以提供擴散器的複數個開口中一或多個開口的影像。光學系統還可以包括可定位在擴散器上方的複數個對準板，其中複數個對準板中每個對準板包含排列於第一端與第二端之間的複數個主開口，其中複數個主開口中每個主開口定位於擴散器的複數個開口中的一組開口上，且其中支撐結構的基底可直接放置在複數個對準板頂部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Approaches herein relate to an optical system and methodology for measuring diffuser plate openings. In one approach, an optical system for analyzing a diffuser may include an optical sensor coupled to a support structure, wherein the optical sensor comprises a lens assembly operable to provide an image of one or more openings of a plurality of openings of the diffuser. The optical system may further include a plurality of alignment plates positionable over the diffuser, wherein each of the plurality of alignment plates comprises a plurality of main openings arranged between a first end and a second end, wherein each of the plurality of main openings is positioned over a set of openings of the plurality of openings of the diffuser, and wherein a base of the support structure is positionable directly atop the plurality of alignment plates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:開口</p>
        <p type="p">104:擴散器</p>
        <p type="p">105:照相機以及透鏡組件</p>
        <p type="p">106:支撐結構</p>
        <p type="p">108:基底</p>
        <p type="p">109:台</p>
        <p type="p">110:調整臂</p>
        <p type="p">111:照明源</p>
        <p type="p">112:光學感測器</p>
        <p type="p">113:框架</p>
        <p type="p">114:透鏡組件</p>
        <p type="p">115:第一主側面</p>
        <p type="p">116:第二主側面</p>
        <p type="p">118:銷</p>
        <p type="p">119:影像感測器</p>
        <p type="p">120:對準板/光學板</p>
        <p type="p">121:記憶體</p>
        <p type="p">122:外殼</p>
        <p type="p">123:控制器</p>
        <p type="p">124:電源</p>
        <p type="p">125:圖形使用者介面(GUI)</p>
        <p type="p">126:照相機軸</p>
        <p type="p">127:中央開口</p>
        <p type="p">128:第一主側面</p>
        <p type="p">129:第二主側面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1690" publication-number="202633035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板之製造方法、配線電路基板之製造系統、及電解鍍敷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H05K3/10</main-classification>
        <further-classification edition="200601120260417B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒川誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNEKAWA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOTTA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1之製造方法包括晶種層形成步驟、及導體層形成步驟。於晶種層形成步驟中，於具有凹部R1之基材S上形成覆蓋凹部R1之內表面之晶種層31。於導體層形成步驟中，於晶種層31上形成導體層32。導體層形成步驟包括第1鍍敷步驟、表面處理步驟、及第2鍍敷步驟。於第1鍍敷步驟中，藉由電解鍍敷而形成導體層32之一部分(導體層32A)。於表面處理步驟中，利用含有酸之處理液對導體層32A之表面進行處理。於第2鍍敷步驟中，於經表面處理之導體層32A之上進而藉由電解鍍敷而形成導體層32之一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電解鍍敷裝置</p>
        <p type="p">11:第1鍍敷槽</p>
        <p type="p">12:供電輥(供電裝置之一例)</p>
        <p type="p">13:表面處理裝置</p>
        <p type="p">14:第2鍍敷槽</p>
        <p type="p">S:基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1691" publication-number="202633042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板之製造方法、配線電路基板之製造系統、及電解鍍敷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H05K3/46</main-classification>
        <further-classification edition="200601120260420B">H05K3/06</further-classification>
        <further-classification edition="200601120260420B">H05K3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒川誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNEKAWA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOTTA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1之製造方法包括導體層形成步驟。於導體層形成步驟中，於具有凹部R1之基材S之凹部R1形成導體層32。導體層形成步驟包括第1鍍敷步驟、表面處理步驟、及第2鍍敷步驟。於第1鍍敷步驟中，藉由電解鍍敷而形成導體層32之一部分(導體層32A)。於表面處理步驟中，利用處理液對導體層32A之表面進行處理。於第2鍍敷步驟中，於經表面處理之導體層32A之上進而藉由電解鍍敷而形成導體層32之一部分。處理液含有鍍敷促進成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電解鍍敷裝置</p>
        <p type="p">11:第1鍍敷槽</p>
        <p type="p">12:供電輥</p>
        <p type="p">13:表面處理裝置</p>
        <p type="p">14:第2鍍敷槽</p>
        <p type="p">S:基材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1692" publication-number="202632490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理裝置、基板處理裝置、顯示方法、半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260504B">G06F3/04845</main-classification>
        <further-classification edition="200601120260504B">G05B19/409</further-classification>
        <further-classification edition="200601120260504B">G05B19/4097</further-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻村新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJIMURA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具備：顯示部，能夠顯示編輯畫面，該編輯畫面以將處理基板的條件係針對複數個步驟各自進行定義之配方，藉由前述步驟的軸與構成前述條件之複數個項目的軸來定義之表格形式，構成為可編輯設定於前述複數個項目與前述複數個步驟的交點之複數個設定值；選擇部，基於設定有針對前述複數個設定值的每個範圍來顯示設定值時的顯示態樣之顯示設定資訊，分別選擇與前述複數個設定值相對應的顯示態樣；以及控制部，能夠控制前述顯示部，以根據藉由前述選擇部所選擇的各個顯示態樣，在前述編輯畫面中顯示前述複數個設定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">100a:CPU(控制部)</p>
        <p type="p">100b:RAM</p>
        <p type="p">100c:記憶部</p>
        <p type="p">100d:選擇部</p>
        <p type="p">100e:I/O埠</p>
        <p type="p">301:外部通信部</p>
        <p type="p">302:外部記憶部</p>
        <p type="p">303:操作部</p>
        <p type="p">304:顯示部</p>
        <p type="p">305:程序控制部</p>
        <p type="p">306:驅動控制部</p>
        <p type="p">307:溫度控制部</p>
        <p type="p">308:氣體流量控制部</p>
        <p type="p">309:壓力控制部</p>
        <p type="p">311:搬送控制部</p>
        <p type="p">312:旋轉控制部</p>
        <p type="p">313:升降控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1693" publication-number="202633413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理裝置、基板處理裝置、基板處理方法、半導體裝置的製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P95/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関貴敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡雄治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具備：設定值顯示區域，以將處理基板的條件係針對複數個步驟各自進行定義之配方，藉由前述步驟的軸與構成前述條件之複數個項目的軸來定義之表格形式，顯示設定於前述複數個項目與前述複數個步驟的交點之複數個設定值；設定值選擇指示區域，構成為能夠接收至少包含對前述複數個設定值之選擇操作的操作指示；顯示部，能夠顯示編輯畫面，該編輯畫面構成為可編輯前述複數個設定值；以及控制部，能夠接收對前述設定值選擇指示區域之設定值的操作指示，並控制以對顯示於前述設定值顯示區域的前述複數個設定值執行前述操作指示，並編輯前述編輯畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">100a:CPU</p>
        <p type="p">100b:RAM</p>
        <p type="p">100c:記憶部</p>
        <p type="p">100d:I/O埠</p>
        <p type="p">301:外部通信部</p>
        <p type="p">302:外部記憶部</p>
        <p type="p">303:操作部</p>
        <p type="p">304:顯示部</p>
        <p type="p">305:程序控制部</p>
        <p type="p">306:驅動控制部</p>
        <p type="p">307:溫度控制部</p>
        <p type="p">308:氣體流量控制部</p>
        <p type="p">309:壓力控制部</p>
        <p type="p">311:搬送控制部</p>
        <p type="p">312:旋轉控制部</p>
        <p type="p">313:升降控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1694" publication-number="202631390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脫模膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/08</main-classification>
        <further-classification edition="200601120260504B">B32B27/18</further-classification>
        <further-classification edition="200601120260504B">B32B27/30</further-classification>
        <further-classification edition="201901120260504B">B32B7/02</further-classification>
        <further-classification edition="200601120260504B">B29C33/68</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小寺省吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTERA, SEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀口雄矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIGUCHI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八百板隆俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAOITA, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種脫模膜，該脫模膜依序具有基材、抗靜電層及脫模層；且前述脫模層包含選自導電性聚合物、離子液體、界面活性劑、導電性金屬氧化物、金屬離子傳導型鹽及導電性碳材料中之至少1種導電性材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">1A:基材第1面</p>
        <p type="p">1B:基材第2面</p>
        <p type="p">2:抗靜電層</p>
        <p type="p">3:脫模層</p>
        <p type="p">10:脫模膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1695" publication-number="202632656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/401</main-classification>
        <further-classification edition="200601120260302B">G11C11/4091</further-classification>
        <further-classification edition="200601120260302B">G11C11/4094</further-classification>
        <further-classification edition="200601120260302B">G11C11/4097</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭強燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KANGSUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜奎彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KYU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種記憶體裝置及一種操作該記憶體裝置之方法。該記憶體裝置包括：一第一子記憶體陣列、一第二子記憶體陣列及一第三子記憶體陣列，其沿著一第一方向依序配置；一第一位元線選擇電路，其連接至該第一子記憶體陣列中之一第一位元線及該第二子記憶體陣列中之一第二位元線，其中該第一位元線及該第二位元線沿著該第一方向延伸；以及一第一位元線感測放大器，其連接至該第一位元線選擇電路之一輸出端子及該第三子記憶體陣列中之一第三位元線，且沿著該第一方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a memory device and a method of operating the same. The memory device includes: a first sub-memory array, a second sub-memory array and a third sub-memory array arranged sequentially along a first direction; a first bit line selection circuit connected to a first bit line in the first sub-memory array and a second bit line in the second sub-memory array, wherein the first bit line and the second bit line extend along the first direction; and a first bit line sense amplifier connected to an output terminal of the first bit line selection circuit and a third bit line in the third sub-memory array and extending along the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">161a:第a位元線感測放大器，位元線感測放大器</p>
        <p type="p">161b:第b位元線感測放大器，位元線感測放大器</p>
        <p type="p">161c:第c位元線感測放大器，位元線感測放大器</p>
        <p type="p">161d:第d位元線感測放大器，位元線感測放大器</p>
        <p type="p">162a:第a位元線選擇電路，位元線選擇電路</p>
        <p type="p">162b:第b位元線選擇電路，位元線選擇電路</p>
        <p type="p">162c:第c位元線選擇電路，位元線選擇電路</p>
        <p type="p">162d:第d位元線選擇電路，位元線選擇電路</p>
        <p type="p">163_1:第一區域感測放大器電路</p>
        <p type="p">163_2:第二區域感測放大器電路</p>
        <p type="p">BL1a:1-a位元線</p>
        <p type="p">BL1b:1-b位元線</p>
        <p type="p">BL1c:1-c位元線</p>
        <p type="p">BL1d:1-d位元線</p>
        <p type="p">BL2a:2-a位元線</p>
        <p type="p">BL2b:2-b位元線</p>
        <p type="p">BL2c:2-c位元線</p>
        <p type="p">BL2d:2-d位元線</p>
        <p type="p">BL3a:3-a位元線</p>
        <p type="p">BL3b:3-b位元線</p>
        <p type="p">BL3c:3-c位元線</p>
        <p type="p">BL3d:3-d位元線</p>
        <p type="p">BLs1:第一位元線選擇信號，位元線選擇信號</p>
        <p type="p">BLs2:第二位元線選擇信號，位元線選擇信號</p>
        <p type="p">CSL1:第一行選擇信號</p>
        <p type="p">CSL2:第二行選擇信號</p>
        <p type="p">GIOp1:第一全域輸入/輸出線對</p>
        <p type="p">LIOp1:第一區域資料輸入/輸出線對</p>
        <p type="p">LIOp2:第二區域資料輸入/輸出線對</p>
        <p type="p">LSAB11:1-1區域感測放大器區</p>
        <p type="p">LSAB21:2-1區域感測放大器區</p>
        <p type="p">MC:記憶體胞元</p>
        <p type="p">SMA11,SMA21,SMA31:子記憶體陣列</p>
        <p type="p">WL1:第一字線</p>
        <p type="p">WL2:第二字線</p>
        <p type="p">WL3:第三字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1696" publication-number="202631803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造電子裝置的底層組成物</chinese-title>
        <english-title>UNDERLAYER COMPOSITION FOR USE IN MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G63/685</main-classification>
        <further-classification edition="200601120260504B">C08L67/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/103</further-classification>
        <further-classification edition="200601120260504B">C08K5/11</further-classification>
        <further-classification edition="200601120260504B">C09D167/00</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="200601120260504B">G03F7/11</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="202601120260504B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　秀姃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEEM, SOOJUNG CLARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種用於與上層塗覆的光阻劑組成物一起使用的塗層組成物，該塗層組成物包含：可熱交聯的樹脂；具有以下通式(1)的化合物：</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="175px" width="209px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">其中：W&lt;sub&gt;1&lt;/sub&gt;、W&lt;sub&gt;2&lt;/sub&gt;、W&lt;sub&gt;3&lt;/sub&gt;和W&lt;sub&gt;4&lt;/sub&gt;獨立地是單鍵或取代或未取代的C&lt;sub&gt;1-5&lt;/sub&gt;伸烷基；L&lt;sub&gt;1&lt;/sub&gt;和L&lt;sub&gt;2&lt;/sub&gt;各自係酯基團；L&lt;sub&gt;3&lt;/sub&gt;和L&lt;sub&gt;4&lt;/sub&gt;獨立地是單鍵或選自羰基或酯基團的基團；R&lt;sub&gt;1&lt;/sub&gt;和R&lt;sub&gt;2&lt;/sub&gt;獨立地是氫、鹵素、取代或未取代的C&lt;sub&gt;1-10&lt;/sub&gt;烷基、或取代或未取代的C&lt;sub&gt;3-10&lt;/sub&gt;環烷基；R&lt;sub&gt;3&lt;/sub&gt;和R&lt;sub&gt;4&lt;/sub&gt;獨立地是氫、鹵素、羥基、取代或未取代的C&lt;sub&gt;1-10&lt;/sub&gt;烷基、或取代或未取代的C&lt;sub&gt;3-10&lt;/sub&gt;環烷基；以及溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a coating composition for use with an overcoated photoresist composition, comprising: a thermally crosslinkable resin; a compound of the following general formula (1): </p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="180px" width="235px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">wherein: W&lt;sub&gt;1&lt;/sub&gt;, W&lt;sub&gt;2&lt;/sub&gt;, W&lt;sub&gt;3&lt;/sub&gt;, and W&lt;sub&gt;4&lt;/sub&gt; are independently a single bond or substituted or unsubstituted C&lt;sub&gt;1-5&lt;/sub&gt; alkylene; L&lt;sub&gt;1&lt;/sub&gt; and L&lt;sub&gt;2&lt;/sub&gt; are each an ester group; L&lt;sub&gt;3&lt;/sub&gt; and L&lt;sub&gt;4&lt;/sub&gt; are independently a single bond or a group chosen from carbonyl, or an ester group; R&lt;sub&gt;1&lt;/sub&gt; and R&lt;sub&gt;2&lt;/sub&gt; are independently hydrogen, halogen, substituted or unsubstituted C&lt;sub&gt;1-10&lt;/sub&gt; alkyl, or substituted or unsubstituted C&lt;sub&gt;3-10&lt;/sub&gt; cycloalkyl; R&lt;sub&gt;3&lt;/sub&gt; and R&lt;sub&gt;4&lt;/sub&gt; are independently hydrogen, halogen, hydroxyl, substituted or unsubstituted C&lt;sub&gt;1-10&lt;/sub&gt; alkyl, or substituted or unsubstituted C&lt;sub&gt;3-10&lt;/sub&gt; cycloalkyl; and a solvent.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1697" publication-number="202631427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送裝置</chinese-title>
        <english-title>CONVEYING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">B62B3/00</main-classification>
        <further-classification edition="200601120260417B">B62B3/02</further-classification>
        <further-classification edition="200601120260417B">B62B3/14</further-classification>
        <further-classification edition="200601120260417B">B62B5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日建租賃工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKKEN LEASE KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関山正勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIYAMA, TADAKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋場健二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIBA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的為在保護使用搬送裝置的人的同時，解決手推構件之處理困難的障礙。本發明提供一種搬送裝置，係設置有往上下方向延伸的手推構件，該搬送裝置係構成為：將手推構件的下端插入於在設有腳輪之底板的至少一個角落所設之孔中，並以可拆卸之方式固定；該手推構件係具有彎曲部；在該孔之中，具有可將彎曲部固定於複數個方向的旋轉防止構造，無論固定於哪個方向時，都可把持該手推構件而搬送裝載物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to protect user of a conveying device while eliminating the hindrance that handling the hand push member is difficult.Provided is a conveying device configured by inserting the lower end of a push member into a hole disposed in at least one corner of a base plate provided with casters and removably fixed, wherein the push member has a curved portion, and a rotation-prevention structure capable of fixing the curved portion in a plurality of orientations that is provided in the hole, and the conveying device is configured such that, regardless of the orientation in which the push member is fixed, a load can be conveyed by gripping the push member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底板</p>
        <p type="p">2:手推構件</p>
        <p type="p">2a:直線部</p>
        <p type="p">4:腳輪</p>
        <p type="p">5:凹部</p>
        <p type="p">10:彎曲部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1698" publication-number="202632689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分流電阻器及其製造方法</chinese-title>
        <english-title>SHUNT RESISTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01C1/14</main-classification>
        <further-classification edition="200601120260421B">H01C17/28</further-classification>
        <further-classification edition="200601120260421B">H01C7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商斯瑪特電子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMART ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡鴻一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG GYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李侊勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KWANG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金元席</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WON SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫領民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YOUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玄昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HYEON CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權赫帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HYUK JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭露了一種分流電阻器，其包含：一電阻元件；一第一導電板及一第二導電板，分別在縱向方向連接至該電阻元件的兩端；以及一第一電壓檢測端子及一第二電壓檢測端子，分別連接至該第一導電板及該第二導電板。該第一導電板包含兩個第一鎖孔及兩個第一切口，該兩個第一鎖孔為一第一-第一鎖孔及一第一-第二鎖孔，及該兩個第一切口為一第一縱向切口及一第一橫向切口。該第二導電板包含兩個第二鎖孔及兩個第二切口，該兩個第二鎖孔為一第二-第一鎖孔及一第二-第二鎖孔，及該兩個第二切口為一第二縱向切口及一第二橫向切口。因此，可以輕易地調節該分流電阻器的電阻溫度係數(TCR)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses a shunt resistor including: a resistive element; a first conductive plate and a second conductive plate respectively connected to both ends of the resistive element in a longitudinal direction; and a first voltage detection terminal and a second voltage detection terminal respectively connected to the first conductive plate and the second conductive plate. The first conductive plate includes two first fastening holes and two first cutouts, the two first fastening holes being a first-first fastening hole and a first-second fastening hole, and the two first cutouts being a first longitudinal cutout and a first lateral cutout. The second conductive plate includes two second fastening holes and two second cutouts, the two second fastening holes being a second-first fastening hole and a second-second fastening hole, and the two second cutouts being a second longitudinal cutout and a second lateral cutout. Accordingly, the temperature coefficient of resistivity (TCR) of the shunt resistor may be readily adjustable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:分流電阻器</p>
        <p type="p">110:導電板</p>
        <p type="p">111:第一導電板</p>
        <p type="p">112:第二導電板</p>
        <p type="p">120:鎖孔</p>
        <p type="p">121-1:第一-第一鎖孔</p>
        <p type="p">121-2:第一-第二鎖孔</p>
        <p type="p">122-1:第二-第一鎖孔</p>
        <p type="p">122-2:第二-第二鎖孔</p>
        <p type="p">130:電阻元件</p>
        <p type="p">140:切口</p>
        <p type="p">141a:第一縱向切口</p>
        <p type="p">141b:第一橫向切口</p>
        <p type="p">142a:第二縱向切口</p>
        <p type="p">142b:第二橫向切口</p>
        <p type="p">150:電壓檢測端子</p>
        <p type="p">151:第一電壓檢測端子</p>
        <p type="p">152:第二電壓檢測端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1699" publication-number="202631847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含分離其他聚合物步驟之通過糖解以回收聚對苯二甲酸乙二酯的方法</chinese-title>
        <english-title>PROCESS FOR THE RECYCLING OF POLYETHYLENE TEREPHTHALATE BY GLYCOLYSIS COMPRISING A STAGE OF SEPARATION OF OTHER POLYMERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08J11/24</main-classification>
        <further-classification edition="200601120260424B">C07C67/03</further-classification>
        <further-classification edition="200601120260424B">C07C67/48</further-classification>
        <further-classification edition="200601120260424B">C07C67/58</further-classification>
        <further-classification edition="200601120260424B">C07C69/82</further-classification>
        <further-classification edition="200601120260424B">C08L67/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商ＩＦＰ新能源公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IFP ENERGIES NOUVELLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商環境設計股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEPLAN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列寧庫格　勒　庫格　戴米恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEINEKUGEL-LE-COCQ, DAMIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈倫　亞辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAROUN, YACINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法維爾　佛瑞迪瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAVRE, FREDERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇奇　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICHE, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉　西潘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARRA, CYPRIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波寧　查理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONNIN, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種通過解聚合包含PET及除PET之外的聚合物之塑膠原料以製備BHET的方法，其包括：  &lt;br/&gt;a)在二醇存在下解聚合該PET，其中二醇之量與該原料中所包含的PET之量之重量比在0.3與8.0之間，  &lt;br/&gt;該步驟a)包括在介於150℃與300℃之間之溫度下進行且在液體反應介質中進行之反應相，  &lt;br/&gt;b)溶解該除PET之外的聚合物，包括與和步驟a)之該液體反應介質不混溶之溶劑混合，使得可溶解該除PET之外的聚合物，  &lt;br/&gt;b’)自該液體反應介質分離由步驟b)產生之該不混溶溶劑，  &lt;br/&gt;該等步驟b)及b’)係獨立地在該解聚合步驟a)期間或之後進行，  &lt;br/&gt;該方法產生經純化之包含BHET之流出物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a process for the preparation of BHET by depolymerization of a plastic feedstock comprising PET and polymers other than PET, comprising: &lt;br/&gt;a) a depolymerization of the PET, in the presence of a diol, with a ratio by weight of the amount of diol to the amount of PET contained in the feedstock between 0.3 and 8.0, &lt;br/&gt;said stage a) comprising a reaction phase carried out at a temperature between 150°C and 300°C and being carried out in a liquid reaction medium, &lt;br/&gt;b) a dissolution of the polymer other than PET comprising a mixing with a solvent immiscible with the liquid reaction medium of stage a) making it possible to dissolve the polymer other than PET, &lt;br/&gt;b’) a separation, from the liquid reaction medium, of the immiscible solvent resulting from stage b), &lt;br/&gt;said stages b) and b’) being carried out independently during or after the depolymerization stage a), &lt;br/&gt;said process producing a purified BHET-comprising effluent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:原料</p>
        <p type="p">2:二醇</p>
        <p type="p">3:流出物/液體反應介質</p>
        <p type="p">4:不混溶溶劑</p>
        <p type="p">5:含有除PET之外的溶解聚合物之至少一部分之不混溶溶劑</p>
        <p type="p">6:除PET之外的聚合物</p>
        <p type="p">7:不混溶溶劑之至少一部分</p>
        <p type="p">8:包含BHET之流出物</p>
        <p type="p">9:不溶解於不混溶溶劑中之除PET之外的可能聚合物</p>
        <p type="p">10:流出物</p>
        <p type="p">11:二醇/二醇流出物</p>
        <p type="p">12:富BHET流出物</p>
        <p type="p">13:經預純化之BHET流出物</p>
        <p type="p">14:重質雜質流出物</p>
        <p type="p">15:第一流份</p>
        <p type="p">16:第二流份</p>
        <p type="p">17:經脫色之經純化之BHET流出物</p>
        <p type="p">(a):解聚合步驟</p>
        <p type="p">(b):溶解步驟</p>
        <p type="p">(b’):分離步驟</p>
        <p type="p">(c):過濾步驟</p>
        <p type="p">(d):分離步驟</p>
        <p type="p">(e):分離步驟</p>
        <p type="p">(f):分離步驟</p>
        <p type="p">(g):脫色步驟</p>
        <p type="p">(h):結晶步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1700" publication-number="202633344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在CVD反應器中處理基板之裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260430B">H10P72/30</main-classification>
        <further-classification edition="202601120260430B">H10P72/10</further-classification>
        <further-classification edition="200601120260430B">B25J9/16</further-classification>
        <further-classification edition="200601120260430B">C23C16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商愛思強歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIXTRON SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涅施勒　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIESCHLER, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於處理基板之裝置及一種處理基板之方法，該裝置具有製程室(1)，在該製程室中設有第一數量(N1)之分別用於一個基板(22)的載位(3)。第一晶盒(K1)裝配有第二數量(N2)之待處理的基板。將該等待處理的基板存放在第二晶盒(K2)中，該第二晶盒亦具有第二數量(N2)之載位(31)。由於第一數量(N1)與第二數量(N2)互質，在該裝置內將該等未處理之基板(22)及該等經處理之基板(32)分別暫存在第一及第二儲存元件(S1、S2)中，其中，暫存方式為始終將完全滿載的第一晶盒(K1)饋送至該裝置，並且始終自該裝置取出完全裝滿的晶盒(K2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:製程室</p>
        <p type="p">2:基板座</p>
        <p type="p">3:載位</p>
        <p type="p">4:支承環</p>
        <p type="p">10:傳送室</p>
        <p type="p">11:機器人</p>
        <p type="p">12:抓持器</p>
        <p type="p">13:門</p>
        <p type="p">14:門</p>
        <p type="p">15:門</p>
        <p type="p">16:門</p>
        <p type="p">20:承載容積</p>
        <p type="p">21:載位</p>
        <p type="p">22:未處理之基板/基板</p>
        <p type="p">25:儲存容積</p>
        <p type="p">26:第一儲存位置/儲存位置</p>
        <p type="p">30:承載容積</p>
        <p type="p">31:載位</p>
        <p type="p">32:經處理之基板/基板</p>
        <p type="p">35:儲存容積</p>
        <p type="p">36:第二儲存位置/儲存位置</p>
        <p type="p">40:暫存器</p>
        <p type="p">41:暫存位置/載位</p>
        <p type="p">50:控制裝置</p>
        <p type="p">K1:第一晶盒/晶盒</p>
        <p type="p">K2:第二晶盒/晶盒</p>
        <p type="p">S1:第一儲存元件/儲存元件</p>
        <p type="p">S2:第二儲存元件/儲存元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1701" publication-number="202632167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電閥</chinese-title>
        <english-title>PIEZOELECTRIC VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">F16K31/02</main-classification>
        <further-classification edition="202301120260429B">H10N30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＭＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田佳生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本英也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, HIDEYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安部瑠之輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, RYUNOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">壓電閥(1)係具備設有空氣的流入孔(P1)及流出孔(P2)的框體(2)、以及配置於框體(2)內且開閉流入孔(P1)的閥體(3)。閥體(3)係藉由包含板狀的壓電元件(12)以及層積壓電元件(12)的振動板(13)的壓電部(11)所構成。流入孔(P1)從壓電部(11)中壓電元件(12)的層積方向觀之，並無與壓電元件(12)重疊，而僅與振動板(13)重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A piezoelectric valve (1) includes a housing (2) provided with an inflow hole (P1) and an outflow hole (P2) for air, and a valve element (3) disposed in the housing and configured to open and close the inflow hole. The valve element is configured by a piezoelectric unit (11) including a plate-shaped piezoelectric element (12) and a diaphragm (13) on which the piezoelectric element is stacked. The inflow hole does not overlap the piezoelectric element but overlaps only the diaphragm when viewed from a stacking direction of the piezoelectric element in the piezoelectric unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓電閥</p>
        <p type="p">2:框體</p>
        <p type="p">3:閥體</p>
        <p type="p">4:本體部</p>
        <p type="p">4a:底部</p>
        <p type="p">6:噴嘴</p>
        <p type="p">6a:前端面</p>
        <p type="p">11:壓電部</p>
        <p type="p">12(12A,12B):壓電元件</p>
        <p type="p">13:振動板</p>
        <p type="p">13a:突出部分</p>
        <p type="p">14:電極</p>
        <p type="p">15:黏著部</p>
        <p type="p">15A,15B:黏著部</p>
        <p type="p">16:配線部</p>
        <p type="p">17:接合部</p>
        <p type="p">31:階差部</p>
        <p type="p">31a:頂面</p>
        <p type="p">P1:流入孔</p>
        <p type="p">P2:流出孔</p>
        <p type="p">S:內部空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1702" publication-number="202632793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器設備及方法</chinese-title>
        <english-title>ELECTRICAL CONNECTOR APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260504B">H01R12/72</main-classification>
        <further-classification edition="201101120260504B">H01R12/87</further-classification>
        <further-classification edition="200601120260504B">H01R13/652</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商山鐵克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMTEC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯奇　丹尼爾　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIRCH, DANIEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中闡述並主張一種電連接器設備、系統及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector apparatus, system, and method are described and claimed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統/電連接器系統</p>
        <p type="p">20:連接器/電連接器/經裝配連接器/經固定連接器</p>
        <p type="p">20b:第二端</p>
        <p type="p">21:接地構件/突出接地構件</p>
        <p type="p">21a:接地翼/接地構件/突出的接地翼/平面接地構件</p>
        <p type="p">22:接腳</p>
        <p type="p">24:鄰接面/鄰接表面</p>
        <p type="p">25:外周邊/外直徑/外圓柱形周邊</p>
        <p type="p">30:面板/外殼</p>
        <p type="p">31:通孔/開口/膛孔/內直徑</p>
        <p type="p">31b:出口</p>
        <p type="p">40:印刷電路板/膨脹的印刷電路板/收縮的印刷電路板</p>
        <p type="p">41:頂部表面</p>
        <p type="p">42:側表面/端表面</p>
        <p type="p">D:距離</p>
        <p type="p">D1:方向/第一方向</p>
        <p type="p">D2:方向/第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1703" publication-number="202633246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及顯示裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H10K59/10</main-classification>
        <further-classification edition="201601120260504B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商邁格諾皓特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGNOLIA WHITE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小亀平章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKAME, HIRAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷哲仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">大體而言，根據實施形態，顯示裝置具備：基板，其具有顯示圖像之顯示區域及上述顯示區域之外側之周邊區域；第1下電極，其於上述顯示區域中配置於上述基板之上方；肋層，其具有位於上述基板之相反側之第1面及與上述第1下電極重疊之像素開口，且由無機材料形成；隔離壁，其包含配置於上述第1面且具有導電性之第1下部及配置於上述第1下部之上且自上述第1下部之側面突出之第1上部；有機層，其通過上述像素開口與上述第1下電極相接；上電極，其覆蓋上述有機層，與上述第1下部相接；蓋層，其覆蓋上述上電極；及第1密封層，其具有位於上述基板之相反側且表面粗糙度較上述第1面大之第2面，覆蓋上述蓋層且由無機材料形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:肋層</p>
        <p type="p">CP1:蓋層</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DSP:顯示裝置</p>
        <p type="p">OR1:有機層</p>
        <p type="p">RS1:樹脂層</p>
        <p type="p">S1:第1面</p>
        <p type="p">S2:第2面</p>
        <p type="p">SE11:密封層</p>
        <p type="p">UE1:上電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1704" publication-number="202631080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用戶的失智症程度確定方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DETERMINING A DEGREE OF DEMENTIA OF A USER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">A61B5/00</main-classification>
        <further-classification edition="202101120260421B">A61B5/0537</further-classification>
        <further-classification edition="201801120260421B">G16H50/30</further-classification>
        <further-classification edition="201801120260421B">G16H50/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商智聰醫治股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIBLE THERAPEUTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亨俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁東院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈瑢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIM, YONGSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹寶拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, BORA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪允貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YUN JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具慧珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, HYEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由電子裝置執行的確定用戶失智症程度的方法，包括以下步驟：通過用戶終端輸出第一內容；通過用戶終端獲得用戶對第一內容的第一反應資訊，其中，第一反應資訊包括用戶的第一語音資訊；通過用戶終端輸出第二內容；通過用戶終端獲得用戶對第二內容的第二反應資訊，其中，第二反應資訊包括用戶的第一視線資訊；通過用戶終端輸出第三內容；通過用戶終端獲得用戶對第三內容的第三反應資訊，其中，第三反應資訊包括用戶的第二語音資訊和用戶的第二視線資訊；通過用戶終端輸出第四內容；通過用戶終端獲得用戶對第四內容的第四反應資訊，其中，第四反應資訊包括用戶的第一觸控動作資訊；以及通過將第一反應資訊、第二反應資訊、第三反應資訊和第四反應資訊輸入到基於人工神經網路的失智症程度分類模型來確定用戶的失智症程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">410:步驟</p>
        <p type="p">420:步驟</p>
        <p type="p">430:步驟</p>
        <p type="p">440:步驟</p>
        <p type="p">450:步驟</p>
        <p type="p">460:步驟</p>
        <p type="p">470:步驟</p>
        <p type="p">480:步驟</p>
        <p type="p">490:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1705" publication-number="202631147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>RAS抑制劑組合療法</chinese-title>
        <english-title>RAS INHIBITORS COMBINATION THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/551</main-classification>
        <further-classification edition="200601120260504B">A61K31/504</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾瑞斯卡公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERASCA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休梅克　羅伯特　菲爾德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEMAKER, ROBERT FIELD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　艾琳　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEW, ERIN DENISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　喬安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JOANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙利文　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SULLIVAN, TAYLOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵　宰賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　炳珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BINGZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明概言之係關於泛RAS及KRAS抑制劑之組合的用途，其用於治療癌症，尤其實體腫瘤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to the use of a combination of a Pan-RAS and a KRAS inhibitor for treating cancer, specifically solid tumors.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1706" publication-number="202631454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人航空機的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260430B">B64U50/11</main-classification>
        <further-classification edition="202301120260430B">B64U30/29</further-classification>
        <further-classification edition="202301120260430B">B64U10/14</further-classification>
        <further-classification edition="200601120260430B">F02D43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荒瀬會澤航天有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASE AIZAWA AEROSPATIALE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒瀬国男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASE, KUNIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種無人航空機的控制方法，該無人航空機的控制方法能夠使搭載重的貨物的機體迅速上升，並且能夠進行穩定的姿勢控制。本發明的無人航空機的控制方法是垂直起降型的無人航空機的控制方法，所述無人航空機具備由發動機驅動的多個螺旋槳，能夠單獨設定各螺旋槳的槳距角（θ），所述無人航空機的控制方法在機體的節氣門控制時，通過使所述發動機的節氣門的開度增加或減少而使所述發動機的轉速增大或減少，使各螺旋槳的轉速增大或減少，在機體的姿勢控制時，用於得到升力的各螺旋槳的槳距角（θ）在發動機的轉速低時設定得大，在發動機的轉速高時設定得小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S11~S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1707" publication-number="202632611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可連接到電腦應用裝置的邊緣計算眼睛描述器單元</chinese-title>
        <english-title>EDGE-COMPUTED EYE DESCRIPTOR UNIT CONNECTABLE TO COMPUTER APPLICATION DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260426B">G06V40/18</main-classification>
        <further-classification edition="202301120260426B">G06N3/063</further-classification>
        <further-classification edition="201901120260426B">G06F1/3203</further-classification>
        <further-classification edition="200601120260426B">G06F3/01</further-classification>
        <further-classification edition="200601120260426B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商視力系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIEWPOINTSYSTEM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾茨　哈維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORTS, JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林森梅　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINSENMAIER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏格　尼爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGER, NILS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種眼睛描述器單元，也稱為眼睛/視線追蹤單元，一般來說，其可連接到通用電腦應用裝置，例如AR/VR/XR或智慧型眼鏡。本發明描述一種具有極低能耗的高效計算之邊緣計算硬體架構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an eye descriptor unit, also called eye/gaze-tracking unit, connectable to a general computer application device like AR/VR/XR or smartglasses in general. The invention describes a computationally efficient edge computing hardware architecture with extremely low energy consumption.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼睛描述器單元</p>
        <p type="p">2:電腦應用裝置</p>
        <p type="p">10:邊緣計算單元</p>
        <p type="p">12:眼睛感測器</p>
        <p type="p">20:輸出</p>
        <p type="p">120:輸入</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1708" publication-number="202631923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著性膜及捲繞體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260417B">C09J7/20</main-classification>
        <further-classification edition="200601120260417B">C08F2/50</further-classification>
        <further-classification edition="200601120260417B">C08G73/12</further-classification>
        <further-classification edition="200601120260417B">C09J133/24</further-classification>
        <further-classification edition="201801120260417B">C09J7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本雄治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋駿夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聡史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡山久敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAYAMA, HISATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野文香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, FUMIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野萌生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, MOEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種即便於以捲狀保管之情形時亦能夠抑制糊劑溢出之接著性膜、及該接著性膜之捲繞體。  &lt;br/&gt;本發明係一種接著性膜，其具有接著層，上述接著層滿足下述第1構成或下述第2構成中之至少任一者。  &lt;br/&gt;第1構成：  &lt;br/&gt;於將藉由動態黏彈性測定所測得之於T℃之剪切儲存彈性模數設為G'（T）時，同時滿足下述數式（A）、（B）。  &lt;br/&gt;10≦G'（0）/G'（200）≦20000・・・（A）  &lt;br/&gt;10&lt;sup&gt;5&lt;/sup&gt; Pa≦G'（0）≦10&lt;sup&gt;10&lt;/sup&gt; Pa・・・（B）  &lt;br/&gt;第2構成：  &lt;br/&gt;於將利用黏性測試儀（tack tester）測定荷重F（gf）時自探針接觸開始t秒後之荷重設為F（t）時，滿足下述數式（C）。  &lt;br/&gt;0.60≦F（30）/F（1）≦0.96・・・（C）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1709" publication-number="202631687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含CD3抗原結合域之蛋白質及其用途</chinese-title>
        <english-title>PROTEINS COMPRISING CD3 ANTIGEN BINDING DOMAINS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　金泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JINQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里汀漢　雷蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRITTINGHAM, RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅德　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRODEUR, SCOTT R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘尼桑　拉杰庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANESAN, RAJKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡佛　賈克林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOVER, JACLYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各布斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBS, STEVEN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱恩　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANE, COLLEEN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　珊杰雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SANJAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲沃拉克　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZWOLAK, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特　崔威尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATT, TRIVENI K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾德坎普　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELDKAMP, MICHAEL DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉波特　雪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LA PORTE, SHERRY LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供結合分化簇3 (CD3)蛋白之抗原結合域（其包含結合CD3ε之抗原結合域）、編碼彼等之多核苷酸、載體、宿主細胞、製造及使用彼等之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides antigen binding domains that bind cluster of differentiation 3 (CD3) protein, comprising the antigen binding domains that bind CD3ε, polynucleotides encoding them, vectors, host cells, methods of making and using them.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1710" publication-number="202631391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱性片保持體、其製造方法及導熱性片之貼附方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/08</main-classification>
        <further-classification edition="200601120260504B">B32B27/10</further-classification>
        <further-classification edition="200601120260504B">B32B27/20</further-classification>
        <further-classification edition="200601120260504B">B32B27/28</further-classification>
        <further-classification edition="201901120260504B">B32B7/06</further-classification>
        <further-classification edition="200601120260504B">B32B7/12</further-classification>
        <further-classification edition="200601120260504B">B32B37/10</further-classification>
        <further-classification edition="200601120260504B">B32B37/26</further-classification>
        <further-classification edition="200601120260504B">B23P15/26</further-classification>
        <further-classification edition="200601120260504B">B65H18/28</further-classification>
        <further-classification edition="200601120260504B">H05K7/20</further-classification>
        <further-classification edition="202601120260504B">H10W40/00</further-classification>
        <further-classification edition="202601120260504B">H10W40/22</further-classification>
        <further-classification edition="202601120260504B">H10W40/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足羽剛児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIBA, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦山貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAYAMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">導熱性片保持體10具備：導熱性片15，其具備第1表面15A及與第1表面15A為相反側之第2表面15B；第1表面15A側之載膜11；及第2表面15B側之覆蓋膜20。於第1及第2表面15A、15B之至少一者具有黏著成分，覆蓋膜20與第2表面15B之剝離力為0～55 mN/25 mm，第2表面15B之黏性值為4.0～9.0 N。導熱性片保持體10係捲繞體25，於自其最外周之載膜11之末端11E至捲繞體之2.0周以上之長度L之區域R未配置導熱性片15。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:導熱性片保持體</p>
        <p type="p">10E:導熱性片保持體之末端部</p>
        <p type="p">11:載膜</p>
        <p type="p">11E:載膜之末端</p>
        <p type="p">15:導熱性片</p>
        <p type="p">15A:第1表面</p>
        <p type="p">15B:第2表面</p>
        <p type="p">20:覆蓋膜</p>
        <p type="p">25:捲繞體</p>
        <p type="p">26:芯</p>
        <p type="p">L:長度</p>
        <p type="p">R:區域</p>
        <p type="p">Y:長度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1711" publication-number="202632754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電半透明日盲型光陰極底層</chinese-title>
        <english-title>A CONDUCTIVE SEMI-TRANSPARENT SOLAR BLIND PHOTOCATHODE UNDERLAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H01J40/06</main-classification>
        <further-classification edition="200601120260417B">H01J1/34</further-classification>
        <further-classification edition="200601120260417B">H01J1/70</further-classification>
        <further-classification edition="200601120260417B">C23C14/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商福頓尼斯荷蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTONIS NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯阿爾迪　特尼斯　格里特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUARDIJ, TEUNIS GERRIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種日盲型光陰極裝置，其包含：一基板；一光陰極層，其安置於該基板上，該日盲型光陰極裝置之特徵在於安置於該基板與該光陰極層之間的一導電底層，其中該導電底層包含直接沉積於該基板上之一第一鎳層(130)，及沉積至該第一鎳層上之一第二氧化鋁層(140)，其中該第二層係透過鋁之自然氧化或氧化鋁之直接蒸鍍而獲得。氧化鋁經組態以與該光陰極層形成一氧化鋁界面。該導電底層經配置以為光陰極提供導電性，同時維持在深紫外線光譜中之高量子效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:日盲型光陰極裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:環形電極</p>
        <p type="p">130:第一鎳層</p>
        <p type="p">140:第二鋁層</p>
        <p type="p">150:光陰極層</p>
        <p type="p">160:導電底層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1712" publication-number="202631558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二官能性化合物、化合物、化合物之製造方法及二官能性化合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C29/14</main-classification>
        <further-classification edition="200601120260504B">C07C29/34</further-classification>
        <further-classification edition="200601120260504B">C07C35/29</further-classification>
        <further-classification edition="200601120260504B">C07C45/50</further-classification>
        <further-classification edition="200601120260504B">C07C47/36</further-classification>
        <further-classification edition="200601120260504B">B01J25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西勇太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐誠之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤優輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供分子內具有降莰烷骨架，且於C2非對稱位置具有體積龐大的取代基之新穎的二官能性化合物。  &lt;br/&gt;本發明之課題利用以下二官能性化合物而解決。亦即，為下式(1)表示之二官能性化合物，且為式(1)中，Ph表示苯基，n表示0或1之二官能性化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="159px" width="361px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1713" publication-number="202631832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>
        <english-title>RESIST COMPOSITION AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G79/00</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影，尤其在EB微影及EUV微影中，感度優良、安定且操作也容易的阻劑組成物、以及使用該阻劑組成物之圖案形成方法。&lt;br/&gt;  該課題之解決手段為一種阻劑組成物，其特徵為含有：&lt;br/&gt;  下述通式(1)表示之化合物，及&lt;br/&gt;  溶劑。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="397px" width="325px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is the resist composition includes a compound represented by the following general formula (1) and a solvent. This can provide a resist composition that exhibits excellent sensitivity, stability, and ease of handling for photolithography using a high-energy beam, particularly EB lithography and EUV lithography, as well as a patterning process that uses the resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="215px" width="216px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1714" publication-number="202633345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260425B">H10P72/30</main-classification>
        <further-classification edition="202101120260425B">F24F3/163</further-classification>
        <further-classification edition="200601120260425B">B01D46/42</further-classification>
        <further-classification edition="200601120260425B">B25J11/00</further-classification>
        <further-classification edition="200601120260425B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三木隆寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊巻俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOMAKI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安達敏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  本揭示提供一種對處理基板之處理裝置搬入搬出基板等的搬運裝置。&lt;br/&gt;  [解決手段]&lt;br/&gt;  一種搬運裝置，係對處理基板之處理裝置搬入搬出基板的搬運裝置，具備：裝載埠，其載置收容基板之容器；本體部，具有：第1開口，設置於作為前述裝載埠側之側壁的前壁中對應於前述容器的位置；第2開口，設置於作為前述處理裝置側之側壁的後壁；搬運機器人，在前述第1開口與前述第2開口之間搬運前述基板；以及風扇過濾單元，從收容前述搬運機器人之搬運空間的上方朝向下方，供給過濾了微粒的氣體；以及下方收容部，設置於前述裝載埠的下方；前述搬運機器人具有水平臂，其構成為能夠在水平方向搬運前述基板，前述搬運機器人之由前述水平臂的上端位置所構成的待機位置，係較前述第1開口及第2開口之下端位置更下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓處理系統</p>
        <p type="p">10:處理裝置</p>
        <p type="p">20:搬運裝置</p>
        <p type="p">30:處理模組</p>
        <p type="p">31:真空處理室</p>
        <p type="p">40:真空搬運模組</p>
        <p type="p">41:真空搬運室</p>
        <p type="p">42:搬運機構</p>
        <p type="p">50:裝載鎖定模組</p>
        <p type="p">51:裝載鎖定室</p>
        <p type="p">101:裝載埠</p>
        <p type="p">102:本體部</p>
        <p type="p">900:FOUP</p>
        <p type="p">C:控制裝置</p>
        <p type="p">G1:閘閥</p>
        <p type="p">M:媒體</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1715" publication-number="202633174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260424B">H10D84/83</main-classification>
        <further-classification edition="202501120260424B">H10D30/62</further-classification>
        <further-classification edition="202601120260424B">H10W20/42</further-classification>
        <further-classification edition="202601120260424B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許資瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, JA YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴水賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARK, SU HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白宗玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, JONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐訓碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, HOON SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任強燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIM, KANG SUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括設置在下層間絕緣膜內的下配線結構。下配線結構包括下阻障膜、設置在下阻障膜上的下填充膜，以及沿著下層間絕緣膜的上表面延伸並與下層間絕緣膜接觸的配線隔離圖案。配線隔離圖案包括矽酸鋁、設置在下配線結構和配線隔離圖案上的上層間絕緣膜，以及設置在上層間絕緣膜內並連接至下配線結構的上配線結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a lower wiring structure disposed within a lower interlayer insulating film, and the lower wiring structure including a lower barrier film and a lower filling film disposed on the lower barrier film, a wiring isolation pattern extending along an upper surface of the lower interlayer insulating film, in contact with the lower interlayer insulating film, and the wiring isolation pattern including aluminum silicate, an upper interlayer insulating film disposed on the lower wiring structure and the wiring isolation pattern, and an upper wiring structure disposed within the upper interlayer insulating film and connected to the lower wiring structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一下配線結構</p>
        <p type="p">110a:下阻障膜</p>
        <p type="p">110b:下填充膜</p>
        <p type="p">110SDR:矽摻雜區</p>
        <p type="p">110t:下配線溝槽</p>
        <p type="p">110US、120US、150US:上表面</p>
        <p type="p">120:第二下配線結構</p>
        <p type="p">150:第一層間絕緣膜</p>
        <p type="p">155:第一蝕刻停止膜</p>
        <p type="p">156:下蝕刻停止膜</p>
        <p type="p">157:上蝕刻停止膜</p>
        <p type="p">160:第二層間絕緣膜</p>
        <p type="p">180:配線隔離圖案</p>
        <p type="p">210:第一上配線結構</p>
        <p type="p">210a:第一上阻障膜</p>
        <p type="p">210b:第一上填充膜</p>
        <p type="p">210L:第一上配線</p>
        <p type="p">210L_t:第一上配線條溝槽</p>
        <p type="p">210t:第一上配線溝槽</p>
        <p type="p">210V:第一上通孔</p>
        <p type="p">210V_t:第一上通孔溝槽</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1716" publication-number="202631820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含羧基之改質醯亞胺樹脂、樹脂組成物、積層體及可撓性印刷佈線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G73/12</main-classification>
        <further-classification edition="200601120260420B">C08L79/08</further-classification>
        <further-classification edition="200601120260420B">C08G69/26</further-classification>
        <further-classification edition="200601120260420B">C08G69/36</further-classification>
        <further-classification edition="200601120260420B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日精化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAINICHISEIKA COLOR &amp; CHEMICALS MFG. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三輪祐也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIWA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢口和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGUCHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種含羧基之改質醯亞胺樹脂，其可被使用作為電子構件用之接著劑、或表面保護層及絕緣保護膜等之塗膜形成用之材料，溶液穩定性、彈性係數、耐熱性及低翹曲性優越。本發明為一種含羧基之改質醯亞胺樹脂，係含有：具有由多元醇(a)衍生之構成單位、由多胺(b)衍生之構成單位、及由四羧酸二酐(c)衍生之構成單位，並由下述一般式(X) (一般式(X)中，n表示0~20之數，R&lt;sub&gt;1&lt;/sub&gt;表示由四羧酸二酐去除了酸酐基的有機基，R&lt;sub&gt;2&lt;/sub&gt;表示由多胺(b)去除了胺基的有機基，R&lt;sub&gt;3&lt;/sub&gt;表示由多元醇(a)去除了羥基的有機基)所示的構造；多胺(b)含有芳香族二胺(b1)及二聚二胺(b2)，醯亞胺鍵結濃度為0.5~2.0 mmol/g。  &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="519px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1717" publication-number="202631814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含羧基之改質醯亞胺樹脂、樹脂組成物、積層體及可撓性印刷佈線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G73/10</main-classification>
        <further-classification edition="200601120260424B">C08L79/08</further-classification>
        <further-classification edition="200601120260424B">C08G8/28</further-classification>
        <further-classification edition="200601120260424B">B32B27/34</further-classification>
        <further-classification edition="200601120260424B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日精化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAINICHISEIKA COLOR &amp; CHEMICALS MFG. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三輪祐也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIWA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢口和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGUCHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種含羧基之改質醯亞胺樹脂，其可被使用作為電子構件用之接著劑、或表面保護層及絕緣保護膜等之塗膜形成用之材料，溶液穩定性、彈性係數、及耐熱性優越。本發明為一種含羧基之改質醯亞胺樹脂，係含有：具有由多元醇(a)衍生之構成單位、由多胺(b)衍生之構成單位、及由四羧酸二酐(c)衍生之構成單位，並由下述一般式(X) (一般式(X)中，n表示0~20之數，R&lt;sub&gt;1&lt;/sub&gt;表示由四羧酸二酐去除了酸酐基的有機基，R&lt;sub&gt;2&lt;/sub&gt;表示由多胺(b)去除了胺基的有機基，R&lt;sub&gt;3&lt;/sub&gt;表示由多元醇(a)去除了羥基的有機基)所示的構造；多胺(b)含有芳香族二胺(b1)，醯亞胺鍵結濃度為0.5~2.0 mmol/g。  &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="521px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1718" publication-number="202632432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>操作微影投影曝光裝置的方法，以及投影曝光裝置</chinese-title>
        <english-title>METHOD FOR OPERATING A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS, AND PROJECTION EXPOSURE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G03F7/20</main-classification>
        <further-classification edition="202101120260422B">G02B7/182</further-classification>
        <further-classification edition="200601120260422B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫曼　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFFMANN, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米提夫　瓦拉帝米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITEV, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒納德　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁克　惠締杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACK, RUEDIGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒賀-寇奇　喬哈尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHURER-KOCH, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞倫茲　邁克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LORENZ, MAIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路爾曼　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUERMANN, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷榭爾　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LETSCHER, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案關於一種用於操作微影投影曝光裝置(1)的方法。在根據本案的方法中，在第一曝光階段期間，在照明光學單元(4)的協助下，形成根據第一照明設置的照明輻射(16)，並在投影光學單元(10)的協助下將照明輻射(16)饋送到投影光學單元(10)的像場(11)。在第二曝光階段期間，在照明光學單元(4)的協助下，形成根據不同於第一照明設定的第二照明設定的照明輻射(16)，且照明輻射(16)在投影光學單元(10)的協助下被饋送到投影光學單元(10)的像場(11)。在第一曝光階段和第二曝光階段之間的曝光暫停期間，在照明光學單元(4)的協助下，形成根據第二照明設定的照明輻射(16)。此照明輻射(16)入射到投影光學單元(10)的光學元件(M2)上，但不被饋送到投影光學單元(10)的像場(11)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for operating a microlithographic projection exposure apparatus (1). In the method according to the invention, during a first exposure phase with the aid of an illumination optical unit (4) illumination radiation (16) according to a first illumination setting is formed and the illumination radiation (16) is fed to an image field (11) of a projection optical unit (10) with the aid of the projection optical unit (10). During a second exposure phase, with the aid of the illumination optical unit (4) illumination radiation (16) according to a second illumination setting, which differs from the first illumination setting, is formed and the illumination radiation (16) is fed to the image field (11) of the projection optical unit (10) with the aid of the projection optical unit (10). During an exposure pause between the first exposure phase and the second exposure phase, with the aid of the illumination optical unit (4) illumination radiation (16) according to the second illumination setting is formed. This illumination radiation (16) is incident on an optical element (M2) of the projection optical unit (10), but is not fed to the image field (11) of the projection optical unit (10).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:投影光學單元</p>
        <p type="p">11:像場</p>
        <p type="p">13:晶圓</p>
        <p type="p">16:照明輻射</p>
        <p type="p">26:吸收元件</p>
        <p type="p">M5:反射鏡</p>
        <p type="p">M6:反射鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1719" publication-number="202632497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>巢套式循環之指令緩衝器及處理器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G06F9/46</main-classification>
        <further-classification edition="201801120260504B">G06F9/30</further-classification>
        <further-classification edition="201801120260504B">G06F9/44</further-classification>
        <further-classification edition="200601120260504B">G06N3/06</further-classification>
        <further-classification edition="200601120260504B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商墨子國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔旭洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XUYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昶旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHANGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於一種巢套式循環之指令緩衝器及處理器，其中，處理器包括指令分發單元、控制狀態暫存器以及處理引擎，巢套式循環之指令緩衝器經組態以：自指令分發單元獲取指令，藉由對指令進行解碼來獲取分別與指令中之一個或多個巢套式循環相關聯之一個或多個循環總數索引，自控制狀態暫存器獲取分別與一個或多個循環總數索引相關聯之一個或多個循環總數，並且基於分別與一個或多個循環總數索引相關聯之一個或多個循環總數向處理引擎發送一個或多個巢套式循環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">106:指令緩衝器</p>
        <p type="p">1062:緩衝器</p>
        <p type="p">1064:預解碼單元</p>
        <p type="p">1066:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1720" publication-number="202633387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測定器、測定系統及測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P74/00</main-classification>
        <further-classification edition="202601120260423B">H10P74/20</further-classification>
        <further-classification edition="202601120260423B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤俊人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, SHUNTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山公宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, KIMIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之例示性實施方式之測定器具備第1感測器、第2感測器及電路基板。第1感測器包含用於在同一視野內拍攝載置台與環構件兩者之攝像裝置。第2感測器包含第1靜電電容感測器或第2靜電電容感測器。第1靜電電容感測器在基底基板載置於載置台上之狀態下，測定其與基底基板之側方所配置之環構件之間的靜電電容。第2靜電電容感測器在基底基板載置於載置台上之狀態下，測定其與基底基板之下方所配置之載置台之間的靜電電容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理系統</p>
        <p type="p">102:基底基板</p>
        <p type="p">102N:缺口</p>
        <p type="p">104:第1靜電電容感測器(第2感測器)</p>
        <p type="p">104A~104D:第1靜電電容感測器</p>
        <p type="p">105:第2靜電電容感測器(第2感測器、第3感測器)</p>
        <p type="p">105A~105D:第2靜電電容感測器</p>
        <p type="p">106:第1感測器</p>
        <p type="p">106A~106D:第1感測器</p>
        <p type="p">110:電路基板</p>
        <p type="p">177:電源</p>
        <p type="p">AX100:中心軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1721" publication-number="202631559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二官能性化合物及二官能性化合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C29/14</main-classification>
        <further-classification edition="200601120260504B">C07C35/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西勇太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐誠之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤優輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎的二官能性化合物，其在分子內具有降莰烷骨架，且在C2非對稱之位置具有體積大的取代基。  &lt;br/&gt;上述課題是藉由以下二官能性化合物來解決。亦即，係為下式(1)表示之二官能性化合物，式(1)中，Cy表示環己基，n表示0或1。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="156px" width="367px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1722" publication-number="202632424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、乾膜、硬化物和電子部件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/004</main-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/028</further-classification>
        <further-classification edition="200601120260504B">G03F7/032</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商太陽油墨（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO INK (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉洪兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HONGBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦國斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, GUOBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聶家恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIE, JIAHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤賢治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠獲得兼具優異的耐熱性、良好的耐冷熱衝擊性(柔韌性)和耐外力衝擊性、高反射率以及優異的耐變色性的硬化物、且具有優異的指觸乾燥性、乾燥管理幅度的感光性樹脂組成物以及由其所得的乾膜、硬化物和電子部件。該感光性樹脂組成物由至少雙組分體系的樹脂組成物構成，含有(A)含羧基樹脂、(B)二官能聚醚型聚氨酯丙烯酸酯、(C)感光性單體、(D)光聚合引發劑和(E)抗氧化劑以及(F)環氧樹脂，相對於以固體成分計的該(A)含羧基樹脂100質量份，該(B)二官能聚醚型聚氨酯丙烯酸酯大於1.2質量份且小於11質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1723" publication-number="202631549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含元素矽奈米顆粒之微生物肥料組成物及其製造方法</chinese-title>
        <english-title>COMPOSITIONS OF MICROBIAL FERTILIZERS CONTAINING ELEMENTAL SILICON NANOPARTICLES AND METHODS FOR THEIR MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C05F11/08</main-classification>
        <further-classification edition="202001120260504B">C05G3/80</further-classification>
        <further-classification edition="202601120260504B">C12N1/20</further-classification>
        <further-classification edition="200601120260504B">C01B33/02</further-classification>
        <further-classification edition="200601120260504B">C01B33/021</further-classification>
        <further-classification edition="202201120260504B">B09B3/00</further-classification>
        <further-classification edition="201101120260504B">B82Y30/00</further-classification>
        <further-classification edition="201101120260504B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新圓奈米科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXT X VISION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段復元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUAN, FU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江閔超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, MIN-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUI-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種微生物肥料組成物及其製造方法。該組成物包含存在於水性載體中的具存活性微生物菌群與元素矽奈米顆粒，其中元素矽奈米顆粒之D50不大於0.8微米，濃度為10–100 ppm，且全程未使用強鹼或溶解態金屬之萃取試劑以溶解矽。所述方法係以濕式研磨製得元素矽奈米顆粒，將其加入含水、蛋白胨與糖之發酵培養基並接種微生物，於25–30 °C、100–200 rpm條件下培養，必要時施以光週期，初始pH為6.5–7.5且於培養中上升。元素矽可源自回收之光伏或晶圓製程廢矽。成品為可直接施用於土壤或葉面的液態培養液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a microbial fertilizer composition and methods for its manufacture. The composition comprises a viable microbial consortium in an aqueous carrier and elemental silicon nanoparticles having a D50 not greater than 0.8 μm at a concentration of 10–100 ppm, obtained without using strong alkali or dissolved–metal extraction reagents to solubilize silicon. The method includes wet-milling elemental silicon to produce nanoparticles, adding the nanoparticles to a fermentation medium containing water, peptone and a sugar source, inoculating microorganisms, and incubating at 25–30 °C under 100–200 rpm agitation, optionally with a photoperiod. The medium has an initial pH of 6.5–7.5 that increases during incubation. The elemental silicon can be sourced from recycled photovoltaic or wafer-processing waste. The product is a liquid broth suitable for direct soil or foliar application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S280:流程圖之步驟符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1724" publication-number="202631561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機溶劑之精製方法及有機溶劑之精製裝置</chinese-title>
        <english-title>METHOD FOR PURIFYING ORGANIC SOLVENT AND APPARATUS FOR PURIFYING ORGANIC SOLVENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C29/76</main-classification>
        <further-classification edition="200601120260504B">C07C31/10</further-classification>
        <further-classification edition="200601120260504B">C07C67/56</further-classification>
        <further-classification edition="200601120260504B">C07C69/14</further-classification>
        <further-classification edition="200601120260504B">C07B63/00</further-classification>
        <further-classification edition="200601120260504B">B01D15/36</further-classification>
        <further-classification edition="201701120260504B">B01J41/05</further-classification>
        <further-classification edition="200601120260504B">B01J41/14</further-classification>
        <further-classification edition="200601120260504B">B01J45/00</further-classification>
        <further-classification edition="202301120260504B">C02F1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田智子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, NORIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種有機溶劑之精製方法及有機溶劑之精製裝置，其可由有機溶劑儘量減少多種的金屬雜質等雜質的量。一種有機溶劑之精製方法，其包含使精製對象即有機溶劑接觸陰離子交換體A及陰離子交換體B之陰離子交換體接觸步驟，陰離子交換體A為具有選自於由OH型、游離鹼型、碳酸型及碳酸氫型構成的群組中的至少1種離子類型的陰離子交換體，陰離子交換體B為含有還原葡糖胺型離子交換基的螯合樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a method for purifying an organic solvent and an apparatus for purifying an organic solvent, which are capable of reducing, as much as possible, the amounts of various types of impurities such as metal impurities contained in an organic solvent. The method for purifying an organic solvent includes an anion exchanger contact step in which an organic solvent to be purified is brought into contact with an anion exchanger A and an anion exchanger B, wherein the anion exchanger A is an anion exchanger having at least one ionic form selected from the group consisting of OH form, free base form, carbonate form, and bicarbonate form, and the anion exchanger B is a chelate resin containing a glucamine-type ion exchange group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1725" publication-number="202633120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260430B">H10D30/60</main-classification>
        <further-classification edition="202501120260430B">H10D62/824</further-classification>
        <further-classification edition="202501120260430B">H10D64/01</further-classification>
        <further-classification edition="202501120260430B">H10D64/64</further-classification>
        <further-classification edition="202601120260430B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新唐科技日本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀篤寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置(1)，具備有：半導體積層體(20)，具有第1氮化物半導體層即電子行走層(22)及位於電子行走層(22)的上方之第2氮化物半導體層即電子供給層(23)；閘極層(40)，為位於半導體積層體(20)中的第1區域(20a)的上方之p型的第3氮化物半導體層；源極電極(70S)及汲極電極(70D)，位於半導體積層體(20)中的第2區域(20b)的上方；及閘極電極(70G)，位於第3氮化物半導體層即閘極層(40)的上方，且為肖特基電極，源極電極(70S)、汲極電極(70D)及閘極電極(70G)包含有TiAl合金層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:基板</p>
        <p type="p">20:半導體積層體</p>
        <p type="p">20C:二維電子氣體通道</p>
        <p type="p">20R:凹處</p>
        <p type="p">20a:第1區域</p>
        <p type="p">20b:第2區域</p>
        <p type="p">21:緩衝層</p>
        <p type="p">22:電子行走層</p>
        <p type="p">23:電子供給層</p>
        <p type="p">30:再成長層</p>
        <p type="p">40:閘極層</p>
        <p type="p">50:閘極接觸層</p>
        <p type="p">60:絕緣層</p>
        <p type="p">60a:第1開口部</p>
        <p type="p">60b:第2開口部</p>
        <p type="p">70G:閘極電極</p>
        <p type="p">70S:源極電極</p>
        <p type="p">70D:汲極電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1726" publication-number="202632433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微影設備之致動器</chinese-title>
        <english-title>ACTUATOR FOR A LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G03F7/20</main-classification>
        <further-classification edition="200601120260423B">G03F7/22</further-classification>
        <further-classification edition="202601120260423B">H10P72/30</further-classification>
        <further-classification edition="202601120260423B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　德仁特　威廉　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DRENT, WILLIAM PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種致動器，其包含：一第一磁性總成，其附接至一長衝程模組且包含至少兩個第一永久磁鐵；一第二磁性總成，其附接至一短衝程模組且包含至少一個第二永久磁鐵。該等第一及第二磁性總成經組態以在一第一方向上相對於該長衝程模組支撐該短衝程模組。該第二磁性總成位於該等第一永久磁鐵之間。該致動器包括可連接至一電源供應器之一導電元件。該第一磁性總成在一第二方向上之長度大於該第二磁性總成，以實現該短衝程模組及該長衝程模組之相對位移，且該第一磁性總成經幾何組態使得能提供一實質上均勻平行磁場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An actuator comprising a first magnetic assembly attached to a long stroke module and comprising at least two first permanent magnets, a second magnetic assembly attached to a short stroke module and comprising at least one second permanent magnet. The first and second magnetic assemblies are configured to support the short stroke module with respect to the long stroke module in a first direction. The second magnetic assembly is located between the first permanent magnets. The actuator includes an electrically conductive element connectable to a power supply. The first magnetic assembly is longer than the second magnetic assembly in a second direction to enable relative displacement of the short stroke module and the long stroke module and the first magnetic assembly is geometrically configured such that a substantially homogeneous parallel magnetic field is provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:長衝程模組</p>
        <p type="p">26:致動器</p>
        <p type="p">36:第一永久磁鐵</p>
        <p type="p">37:xz平面</p>
        <p type="p">38:第二永久磁鐵</p>
        <p type="p">40:電磁線圈</p>
        <p type="p">44:磁性外殼</p>
        <p type="p">48:衝程銷</p>
        <p type="p">x:第二方向</p>
        <p type="p">y:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1727" publication-number="202633121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>場效電晶體</chinese-title>
        <english-title>FIELD-EFFECT TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10D30/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有馬潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係具有鰭片型構造且電流在基板的厚度方向流動之場效電晶體，其可抑制在斷開時因電場集中所造成之絶緣破壞。  &lt;br/&gt;本發明的場效電晶體100係具備有：飄移層20，其被設置於半導體基板10的上面11上，且具有溝槽區域21及複數個鰭片構造部23；閘極電極62，其介由電絶緣膜61而至少覆蓋複數個鰭片構造部的側面23S；源極電極30，其連接於複數個鰭片構造部的上面23T；汲極電極40，其連接於半導體基板10的背面12；反導電型半導體層50，其被設置於飄移層20的表面。反導電型半導體層50係在閘極電極62露出之端子部63的邊緣部分63A附近，覆蓋位於溝槽區域的底部22、與溝槽區域的外周壁25之邊界且位於較邊緣部分63A更靠外側的角落部26。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a field-effect transistor having a fin-type structure, in which current flows in the thickness direction of the substrate and insulation breakdown due to electric field concentration can be suppressed when the transistor is off. &lt;br/&gt;The field-effect transistor 100 of the present invention comprises: a drift layer 20 provided on an upper surface 11 of a semiconductor substrate 10 and having a trench region 21 and a plurality of fin structures 23, a gate electrode 62 covering at least side surfaces 23S of the plurality of fin structures via an insulating film 61, a source electrode 30 connected to upper surfaces 23T of the plurality of fin structures, a drain electrode 40 connected to a rear surface 12 of the semiconductor substrate 10, and a reverse conductivity type semiconductor layer 50 provided on the surface of the drift layer 20. The reverse conductivity type semiconductor layer 50 is located near an edge portion 63A of a terminal portion 63 at which the gate electrode 62 is exposed, and covers a corner portion 26 located at the boundary between a bottom 22 of the trench region and an outer peripheral wall 25 of the trench region and outside the edge portion 63A.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基板</p>
        <p type="p">11:半導體基板的上面</p>
        <p type="p">12:半導體基板的背面</p>
        <p type="p">20:飄移層</p>
        <p type="p">21:溝槽區域</p>
        <p type="p">22:飄移層的底部</p>
        <p type="p">23:鰭片構造部</p>
        <p type="p">23S:鰭片構造部的側面</p>
        <p type="p">23T:鰭片構造部的上面</p>
        <p type="p">24:n&lt;sup&gt;+&lt;/sup&gt;層</p>
        <p type="p">25:外周壁</p>
        <p type="p">26:角落部</p>
        <p type="p">30:源極電極</p>
        <p type="p">40:汲極電極</p>
        <p type="p">50:反導電型半導體層</p>
        <p type="p">60:本體部</p>
        <p type="p">61:絕緣膜</p>
        <p type="p">62:閘極電極</p>
        <p type="p">63:端子部</p>
        <p type="p">63A:邊緣部分</p>
        <p type="p">64:貫穿孔</p>
        <p type="p">71:絕緣膜</p>
        <p type="p">100:場效電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1728" publication-number="202632903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於晶粒間接收器取樣的自動最佳化延遲控制</chinese-title>
        <english-title>AUTO-OPTIMIZED DELAY CONTROL FOR DIE-TO-DIE RECEIVER SAMPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H03L7/00</main-classification>
        <further-classification edition="200601120260423B">H03L7/081</further-classification>
        <further-classification edition="201401120260423B">H03K5/133</further-classification>
        <further-classification edition="200601120260423B">G06F13/16</further-classification>
        <further-classification edition="200601120260423B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸　平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛龍　艾瑞克道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROEN, ERIC DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種延遲最佳化器，該延遲最佳化器包括用於偵測接收資料與接收時脈之間的延遲的電路，如在具有單獨晶粒(die)的積體電路中，該等單獨晶粒藉由包括時脈通道及資料通道的互連耦合以通訊。該時脈通道及該資料通道(包括晶片上緩衝器)的電氣特性可能在該接收時脈及該接收資料中引入顯著的延遲差異，同時時脈抖動、符號間干擾及佔空比失真可能在該取樣資料中引入顯著的取樣誤差。該延遲最佳化器運作以偵測該延遲，並連續地使用該接收資料的資料邊沿及該接收時脈邊沿來實時地最佳化取樣時脈，以決定最佳化延遲值，從而對該接收資料進行取樣，以在期望的非常低位元錯誤率(BER)下產生該取樣資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A delay optimizer includes circuits for detecting delay between the received data and the received clock, such as in an integrated circuit having separate dies coupled to communication via an interconnect that includes a clock channel and a data channel. The electrical characteristics of the clock channel and the data channel (including on-chip buffers) may introduce significant differences in the delay between the received clock and the received data coupled with the effects of clock jitter, inter-symbol interference, and duty-cycle distortion that may introduce significant sampling errors in the sampled data. The delay optimizer operates to detect the delay and optimize a sampling clock in real-time and on a continuous basis using the difference between the data edge of the received data and the received clock edge to determine an optimal delay value to sample the received data to produce the sampled data with the desired very-low bit-error-rate (BER).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:延遲最佳化器</p>
        <p type="p">102:延遲偵測器</p>
        <p type="p">104:接收資料</p>
        <p type="p">106:接收時脈</p>
        <p type="p">108:取樣時脈</p>
        <p type="p">110:充電訊號</p>
        <p type="p">112:放電訊號</p>
        <p type="p">114:電流源</p>
        <p type="p">116:電流槽</p>
        <p type="p">118:充電電流</p>
        <p type="p">120:放電電流</p>
        <p type="p">122:積分器電容器</p>
        <p type="p">124:輸出電壓</p>
        <p type="p">126:可變延遲器</p>
        <p type="p">128:控制輸入端</p>
        <p type="p">130:緩衝器</p>
        <p type="p">132:緩衝器</p>
        <p type="p">134:變容二極體</p>
        <p type="p">450:參考電流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1729" publication-number="202633329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理裝置及修正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P72/00</main-classification>
        <further-classification edition="200601120260422B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兒玉俊昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野拓己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種處理裝置，其具有處理基板之處理腔室，並具有包含載置基板之圓形載置部的台，而對載置於該載置部之該基板施行處理，該台支持形成為可包圍載置於該載置部之該基板的圓環狀之環狀構件，將該基板搬運至該載置部之搬運機器人具有終端效應器，而以該終端效應器固持搬運該基板，該處理裝置可執行下列工序：(A)使該終端效應器與數位感測器一起從第1位置通過該台上，往第2位置直線移動；(B)依據該(A)工序中之該數位感測器的數位測定結果，檢測位於該載置部之周端部的外側之基準點；(C)依據該基準點，實施修正該搬運機器人相對於該處理腔室之位置的第1修正控制；(D)使該終端效應器與該數位感測器一起從該第1位置通過該台上，往修正後之第2位置直線移動；(E)依據該(D)工序中之該數位感測器的數位測定結果，檢測該環狀構件之內周端部，並且以該內周端部為基準，檢測該載置部之周端部；(F)依據該載置部之周端部的檢測結果，實施修正該搬運機器人相對於該處理腔室之位置的第2修正控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">104b:密封環帶</p>
        <p type="p">104c:凸部</p>
        <p type="p">107:聚焦環</p>
        <p type="p">107a:邊緣部</p>
        <p type="p">107b:傾斜面</p>
        <p type="p">D1:資料</p>
        <p type="p">D2:資料</p>
        <p type="p">P1:部分</p>
        <p type="p">P2:部分</p>
        <p type="p">R1:範圍</p>
        <p type="p">R2:範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1730" publication-number="202632028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜方法、成膜裝置及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C14/06</main-classification>
        <further-classification edition="200601120260504B">C23C14/08</further-classification>
        <further-classification edition="200601120260504B">C23C14/34</further-classification>
        <further-classification edition="200601120260504B">C23C14/58</further-classification>
        <further-classification edition="202501120260504B">H10D1/00</further-classification>
        <further-classification edition="202501120260504B">H10D1/60</further-classification>
        <further-classification edition="202501120260504B">H10D64/01</further-classification>
        <further-classification edition="202601120260504B">H10P95/90</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘆澤宏明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIZAWA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山浩二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上毅哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKEYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抑制在依序層積有氮化鈦釕膜、介電質膜、含金屬膜的基板上產生瑕疵。  &lt;br/&gt;本揭露之成膜方法係具備以下工序：在基板上成膜出所含有的釕的濃度低於73原子%的氮化鈦釕膜；成膜出會層積在該氮化鈦釕膜上的介電質膜；以及成膜出會層積在該介電質膜上的含金屬膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">W:晶圓</p>
        <p type="p">11:TiN膜</p>
        <p type="p">12:TiRuN膜</p>
        <p type="p">13:介電質膜</p>
        <p type="p">14:TiN膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1731" publication-number="202631951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由表面改質多孔聚乙烯膜純化光阻聚合物</chinese-title>
        <english-title>PURIFICATION OF PHOTORESIST POLYMER BY SURFACE-MODIFIED POROUS POLYETHYLENE MEMBRANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C09K3/32</main-classification>
        <further-classification edition="202301120260416B">C02F1/44</further-classification>
        <further-classification edition="200601120260416B">C08J5/22</further-classification>
        <further-classification edition="200601120260416B">G03F7/40</further-classification>
        <further-classification edition="200601120260416B">B01D71/26</further-classification>
        <further-classification edition="200601120260416B">B01D67/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾　阿碧德　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIR, AABID ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑柏　杰德　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JABER, JAD ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆茲克　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMZIK, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述配位體改質多孔膜，其包括具有配位體改質表面之多孔聚合物膜，該配位體改質表面具有含氫鍵受體基團之配位體、含氫鍵供體基團之配位體或此等二者；製備該配位體改質多孔膜之方法；及使用該配位體改質多孔膜來過濾光阻溶液及自該光阻溶液移除非所需聚合物分子之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are ligand-modified porous membranes that include a porous polymeric membrane having a ligand-modified surface, the ligand-modified surface having a hydrogen bond-acceptor group-containing ligand, a hydrogen bond-donor group-containing ligand, or both of these; methods of making the ligand-modified porous membrane; and method of using the ligand-modified porous membrane to filter a photoresist solution and remove unwanted polymer molecules from the photoresist solution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:過濾器</p>
        <p type="p">102:膜</p>
        <p type="p">104:外殼</p>
        <p type="p">106:入口埠</p>
        <p type="p">108:出口埠</p>
        <p type="p">110:框架部分</p>
        <p type="p">112:框架部分</p>
        <p type="p">114:頂部空間</p>
        <p type="p">116:箭頭</p>
        <p type="p">118:箭頭</p>
        <p type="p">120:底部空間</p>
        <p type="p">122:側面</p>
        <p type="p">124:面向輸入表面</p>
        <p type="p">126:面向輸出表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1732" publication-number="202632102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網狀織物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260430B">D03D15/00</main-classification>
        <further-classification edition="200601120260430B">H04R9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＢＣ紗網技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NBC MESHTEC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本島信一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOJIMA, NOBUKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明抑制網狀織物之通氣阻力之不均。&lt;br/&gt;  本發明之網狀織物之開口面積為3%以上，且經紗及緯紗中之另一方紗之網眼數相對於一方紗之網眼數之比率為0.4以上且0.9以下。織組織可設為斜紋織。可由聚酯形成經紗及緯紗中之至少一方紗。另一方紗之網眼數可設為70網眼/英吋以上且700網眼/英吋以下。經紗及緯紗之紗直徑可設為15 μm以上且130 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1733" publication-number="202632444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用鹵化物化學品的光阻顯影</chinese-title>
        <english-title>PHOTORESIST DEVELOPMENT WITH HALIDE CHEMISTRIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G03F7/36</main-classification>
        <further-classification edition="200601120260421B">G03F7/16</further-classification>
        <further-classification edition="200601120260421B">G03F7/20</further-classification>
        <further-classification edition="200601120260421B">G03F7/40</further-classification>
        <further-classification edition="200601120260421B">H01J37/32</further-classification>
        <further-classification edition="202601120260421B">H10P76/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　暹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SAMANTHA SIAMHWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游　正義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JENGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范譯文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克思　傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARKS, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古思喬　理查　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTTSCHO, RICHARD A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼特　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏德曼　蒂莫西　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEIDMAN, TIMOTHY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛洛斯基　博里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLOSSKIY, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WENBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光阻的顯影對於例如用以在高解析度圖案化的背景下形成圖案化遮罩可為實用的。顯影可使用例如鹵化氫的含鹵化物化學品而完成。使用乾式或濕式沉積技術可在半導體基板上沉積含金屬光阻膜。該光阻膜可為EUV敏感的含有機金屬氧化物、或含有機金屬薄膜光阻。在曝光後，係使用濕式或乾式顯影將經光圖案化的含金屬光阻進行顯影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Development of resists are useful, for example, to form a patterning mask in the context of high-resolution patterning. Development can be accomplished using a halide-containing chemistry such as a hydrogen halide. A metal-containing resist film may be deposited on a semiconductor substrate using a dry or wet deposition technique. The resist film may be an EUV-sensitive organo-metal oxide or organo-metal-containing thin film resist. After exposure, the photopatterned metal-containing resist is developed using wet or dry development.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1734" publication-number="202631524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在非氧化物玻璃熔化期間移除氧之方法</chinese-title>
        <english-title>METHODS FOR REMOVING OXYGEN DURING NON-OXIDE GLASS MELTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03B3/02</main-classification>
        <further-classification edition="200601120260504B">C03B5/16</further-classification>
        <further-classification edition="200601120260504B">C03C3/32</further-classification>
        <further-classification edition="200601120260504B">C03C4/10</further-classification>
        <further-classification edition="200601120260504B">G02B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔永奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YONG GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛哈根　凱文湯姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAHAGAN, KEVIN THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泳錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德堡　喬治保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDBERG, GEORGE PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐基澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, KI CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種用於在熔化之前不需要純化原材料之情況下合成具有經改良IR透射率之硫族化物玻璃的方法。該方法包含在一氛圍中將原材料及一添加劑熔化，該氛圍經控制以減少該等原材料與該氛圍中之氧的反應。該等原材料包含選自由硫、硒及碲組成之群組的至少一種硫族元素。該添加劑經組態以在該熔化期間與氧化學結合。該添加劑以小於150 ppm之一量提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for synthesizing chalcogenide glass having improved IR transmittance without the need for purification of raw materials before melting is disclosed. The method comprises melting raw materials and an additive in an atmosphere controlled to mitigate reaction of the raw materials with oxygen in the atmosphere. The raw materials comprises at least one chalcogen element selected from the group consisting of sulfur, selenium, and tellurium. The additive is configured to chemically bind to oxygen during the melting. The additive is provided in an amount of less than 150 ppm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102,104,106,108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1735" publication-number="202631252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用吸附改良劑再生混合介質填料</chinese-title>
        <english-title>REGENERATING MIXED MEDIA FILLER WITH ADSORPTION AMENDMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B01J20/34</main-classification>
        <further-classification edition="200601120260428B">B01J20/20</further-classification>
        <further-classification edition="200601120260428B">B01J20/282</further-classification>
        <further-classification edition="200601120260428B">B01J8/02</further-classification>
        <further-classification edition="200601120260428B">B01D15/02</further-classification>
        <further-classification edition="200601120260428B">B01D15/42</further-classification>
        <further-classification edition="200601120260428B">B01D15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞比馬利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBEMARLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　喬恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆丹　阿克夏伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNDAN, AKSHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方特諾　卡勒布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FONTENOT, CALEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種用於再生混合介質床之製程。該製程包括向一混合介質床裝填改良劑，及使該混合介質床中之該改良劑與一液體流中之污染物接觸，直至該改良劑耗盡為止。該製程包括對該混合介質床施加反沖洗液體流及將耗盡的改良劑捕獲於該反沖洗液體流中。向該混合介質床再裝填新鮮改良劑以自液體流去除額外污染物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process is described to regenerate mixed media beds. The process includes charging a mixed media bed with amendment and contacting the amendment in the mixed media bed with contaminants in a liquid stream until the amendment is spent. The process includes applying backwash liquid flow to the mixed media bed and capturing spent amendment in the backwash liquid flow. The mixed media bed with is recharged with fresh amendment to remove additional contaminants from a liquid stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1736" publication-number="202631653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療代謝紊亂的工程化外泌體</chinese-title>
        <english-title>ENGINEERED EXOSOMES FOR TREATMENT OF METABOLIC DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/50</main-classification>
        <further-classification edition="200601120260504B">C07K14/54</further-classification>
        <further-classification edition="200601120260504B">C07K14/705</further-classification>
        <further-classification edition="200601120260504B">C07K19/00</further-classification>
        <further-classification edition="200601120260504B">C12N15/85</further-classification>
        <further-classification edition="201501120260504B">A61K35/12</further-classification>
        <further-classification edition="200601120260504B">A61P3/04</further-classification>
        <further-classification edition="200601120260504B">A61P3/06</further-classification>
        <further-classification edition="200601120260504B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商亦及之洲生物科技（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EONVELAB CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉永紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YONGHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賁銀銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEN, YINYIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴潤彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, RUNBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　國瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, GRACE GUOYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種工程化外泌體，其包含：(a)與第一錨定多肽融合的FGF21多肽，(b)與第二錨定多肽融合的IL-27多肽，以及(c)與第三錨定多肽融合的激活素受體II型多肽；其中(a)、(b)和(c)分別藉由該第一、第二和第三錨定多肽錨定在該外泌體的膜上，並且其中該FGF21多肽、該IL-27多肽和該激活素受體II型多肽暴露於該外泌體的膜的外表面。本文還揭露了組成物、核酸構建體以及該外泌體在治療代謝紊亂中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an engineered exosome, comprising (a) an FGF21 polypeptide, fused to a first anchoring polypeptide, (b) an IL-27 polypeptide, fused to a second anchoring polypeptide, and (c) an activin receptor type II polypeptide, fused to a third anchoring polypeptide, wherein (a), (b) and (c) are anchored on a membrane of the exosome via the first, second and third anchoring polypeptide, respectively, and wherein the FGF21 polypeptide, the IL-27 polypeptide and the activin receptor type II polypeptide are exposed on an outer surface of the membrane of the exosome. Also disclosed are compositions, nucleic acid constructs, and uses of the exosome in treating metabolic disorders.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1737" publication-number="202632576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>推薦商品決定裝置、推薦商品決定方法、及推薦商品決定程式</chinese-title>
        <english-title>RECOMMENDED ITEM DETERMINATION DEVICE, RECOMMENDED ITEM DETERMINATION METHOD , AND RECOMMENDED ITEM DETERMINATION PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">G06Q30/0214</main-classification>
        <further-classification edition="202301120260202B">G06Q30/02</further-classification>
        <further-classification edition="200601120260202B">G06F17/40</further-classification>
        <further-classification edition="202301120260202B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩拉　阿吉萊斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALAH, AGHILES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米歇爾　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHEL, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茨　揚尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARTZ, YANNICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦斯塔瓦　薩爾塔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHRIVASTAVA, SARTHAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAY, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]考慮使用者所致之商品的購入時期，而將符合於該使用者之嗜好的商品，進行推薦。  &lt;br/&gt;　　[解決手段]推薦商品決定裝置，係將表示使用者所致之商品之購入履歷的購入履歷資訊，加以取得。推薦商品決定裝置，係將與藉由購入履歷資訊而被表示之已被購入之商品具有所定之關係的關係商品，加以特定。推薦商品決定裝置，係計算已被購入之商品的商品關係資訊與關係商品的商品關係資訊之間的類似度。推薦商品決定裝置，係基於已被購入之商品的購入時期之久遠程度及已被計算出來之類似度，而在關係商品之中，將達成要推薦給使用者之商品之條件的推薦商品，加以決定。推薦商品的條件係包含：針對類似度及購入時期之久遠程度之其中任一方的條件。推薦商品決定裝置，係將針對類似度及購入時期之久遠程度之其中任一方的條件的達成容易程度，隨著他方而加以改變。推薦商品決定裝置，係將表示推薦商品的推薦商品資訊，發送至終端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:線上購物伺服器</p>
        <p type="p">2:使用者終端</p>
        <p type="p">NW:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1738" publication-number="202631522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理藉由碳捕捉系統產生之流出物流之方法</chinese-title>
        <english-title>METHOD FOR TREATING AN EFFLUENT STREAM GENERATED BY A CARBON CAPTURE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">C02F1/72</main-classification>
        <further-classification edition="202301120260504B">C02F1/78</further-classification>
        <further-classification edition="200601120260504B">B01D53/14</further-classification>
        <further-classification edition="200601120260504B">B01D53/18</further-classification>
        <further-classification edition="200601120260504B">B01D53/62</further-classification>
        <further-classification edition="200601120260504B">B01D53/72</further-classification>
        <further-classification edition="200601120260504B">B01D53/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡司延　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARSLYAN, EDUARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫德　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEDER, GEORG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪莉恩費爾特　珍斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARIENFELDT, JENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃羅比約夫　謝爾蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOROBYEV, SERGEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧斯特　尼可拉　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUST, NICOLA CHRISTIANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於處理藉由碳捕捉系統產生之流出物流之方法包含：在碳捕捉系統中使含環胺溶液與氣流接觸，以從氣流中去除二氧化碳，碳捕捉系統產生流出物流並且將其從碳捕捉系統排出；及使流出物流經受高級氧化。該方法能夠處理包含環胺之流出物流，從而有效分解環胺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for treating an effluent stream generated by a carbon capture system comprises contacting a cyclic amine-containing solution and a gas stream in the carbon capture system to remove carbon dioxide from the gas stream, the carbon capture system generating an effluent stream discharged from the carbon capture system; and subjecting the effluent stream to advanced oxidation. The method allows for treating effluent streams comprising cyclic amines so as to efficiently decompose the cyclic amines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1739" publication-number="202633432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144965</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體測試裝置及半導體測試系統</chinese-title>
        <english-title>SEMICONDUCTOR TEST DEVICE AND SEMICONDUCTOR TEST SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260401B">H10W20/20</main-classification>
        <further-classification edition="202601120260401B">H10W72/20</further-classification>
        <further-classification edition="202601120260401B">H10P74/20</further-classification>
        <further-classification edition="202001120260401B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商悟勞茂材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLUM MATERIAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張澤龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, TAEK YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李在燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE SEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔友碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WOO SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金武謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MU GYEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及半導體測試裝置及半導體測試系統。根據本發明一實施例的半導體測試裝置，用於測試半導體的電連接，該裝置包括膜部，所述膜部包括朝向第一面及所述第一面的相反面即第二面方向的多個開口圖案，所述膜部包括：金屬薄膜部，其具有多個開口圖案；以及絕緣層部，其通過在所述第一金屬薄膜部的表面塗布絕緣材料而形成，相鄰的開口圖案相互絕緣，每個所述開口圖案的側面至少形成有導電性薄膜層，以使每個所述開口圖案從上端到下端形成電連接路徑，所述膜部的上部進一步包括凸塊導向部，其具有與所述開口圖案對應的多個開口部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13':插入件</p>
        <p type="p">15:第二半導體封裝件、堆疊式半導體記憶體</p>
        <p type="p">100:半導體測試裝置</p>
        <p type="p">110:膜部</p>
        <p type="p">150:夾持部</p>
        <p type="p">160:凸塊導向部</p>
        <p type="p">170:導向夾持部</p>
        <p type="p">175:固定裝置</p>
        <p type="p">310:外殼</p>
        <p type="p">320:蓋子(lid)</p>
        <p type="p">325:固定裝置</p>
        <p type="p">330:介面印刷電路基板</p>
        <p type="p">1000：1000-1:半導體測試系統</p>
        <p type="p">CT:懸臂部</p>
        <p type="p">FP:平墊(flat pad)</p>
        <p type="p">GP:凸塊導向部的開口部</p>
        <p type="p">MB:微凸塊(micro bump)</p>
        <p type="p">P:開口圖案</p>
        <p type="p">RS:橡膠插座</p>
        <p type="p">SB:插座板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1740" publication-number="202632808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定結構、基板單元、以及柔性基板單元</chinese-title>
        <english-title>FIXING STRUCTURE, SUBSTRATE UNIT, AND FLEXIBLE SUBSTRATE UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">H01R13/639</main-classification>
        <further-classification edition="200601120251128B">H01R13/46</further-classification>
        <further-classification edition="201101120251128B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中幸貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種固定結構，能以簡單的構造在柔性基板插入籠體內的插入方向固定前述柔性基板相對於連接基板的位置。本發明一態樣的固定結構包括：殼體，固定至柔性基板；鎖固爪，固定至前述殼體；籠體，固定至連接基板，前述殼體能夠在平行於前述連接基板的設置接觸點的表面的方向插入前述籠體內或從前述籠體拔除；鎖固孔，形成於前述籠體，並且與前述鎖固爪卡合；以及推動部，固定至前述殼體或前述籠體，並且朝向前述連接基板推動前述殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fixing structure capable of fixing a position of a flexible substrate relative to a connection substrate with a simple configuration in an insertion direction of the flexible substrate into a cage is provided. A fixing structure according to one aspect of the present disclosure includes: a housing fixed to a flexible substrate; a lock claw fixed to the housing; a cage fixed to a connection substrate, the housing being capable of being inserted and removed into and from the cage in a direction parallel to a surface on which contact points of the connection substrate are disposed; a lock hole which is formed in the cage and with which the lock claw is engaged; and a pushing part that is fixed to the housing or the cage and pushes the housing toward the connection substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板單元</p>
        <p type="p">2:連接基板</p>
        <p type="p">3:柔性基板</p>
        <p type="p">4:固定結構</p>
        <p type="p">5:籠體</p>
        <p type="p">5a:本體</p>
        <p type="p">5b:推動部</p>
        <p type="p">5c:鎖固孔</p>
        <p type="p">5d:插入部</p>
        <p type="p">6:殼體單元</p>
        <p type="p">7:柔性基板單元</p>
        <p type="p">11:彈性變形部</p>
        <p type="p">11e:鎖固爪</p>
        <p type="p">12:第一殼體</p>
        <p type="p">13:第二殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1741" publication-number="202631164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>艾克曼嗜黏蛋白菌BAA-835的萃取物及其用途</chinese-title>
        <english-title>EXTRACT OF AKKERMANSIA MUCINIPHILA BAA-835 AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260504B">A61K35/741</main-classification>
        <further-classification edition="200601120260504B">A61P3/04</further-classification>
        <further-classification edition="200601120260504B">A61P3/06</further-classification>
        <further-classification edition="201601120260504B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷文虎克生物技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEEUWENHOEK LABORATORIES CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林巧威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅翊菱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒欣蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, HSIN-BAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐丞志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種艾克曼嗜黏蛋白菌BAA-835的萃取物，包含：提供含菌培養液包含艾克曼嗜黏蛋白菌BAA-835；將含菌培養液離心獲得上清液與沉澱物；將上清液的一部分以乙酸乙酯萃取，獲得乙酸乙酯水層；乾燥乙酸乙酯水層，獲得乙酸乙酯水層萃取物；將上清液的剩餘部分以正己烷萃取，獲得正己烷水層與正己烷有機層；以及分別乾燥正己烷水層與正己烷有機層，獲得正己烷水層萃取物與正己烷有機層萃取物。另提供一種如前所述之萃取物用於治療過重或肥胖症、提升類升糖素胜肽-1、降低三酸甘油脂或其組合的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An extract of &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; BAA-835 is provided, comprising: providing a bacterial culture medium containing &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; BAA-835; centrifuging the bacterial culture medium to obtain a supernatant and a precipitate; extracting a portion of the supernatant with ethyl acetate to obtain an aqueous ethyl acetate layer; drying the aqueous ethyl acetate layer to obtain an aqueous ethyl acetate extract; extracting the remaining portion of the supernatant with n-hexane to obtain an aqueous n-hexane layer and an organic n-hexane layer; and drying the aqueous n-hexane layer and the organic n-hexane layer respectively to obtain the aqueous n-hexane extract and the organic n-hexane extract. Also provided is a use of the extract as described above for treating overweight or obesity, increasing GLP-1, lowering triglycerides, or combinations thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">F3:圖面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1742" publication-number="202631281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性膏、燒結體及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260504B">B22F1/052</main-classification>
        <further-classification edition="202201120260504B">B22F1/054</further-classification>
        <further-classification edition="202201120260504B">B22F1/0545</further-classification>
        <further-classification edition="202201120260504B">B22F1/107</further-classification>
        <further-classification edition="200601120260504B">B22F7/08</further-classification>
        <further-classification edition="200601120260504B">H01B1/00</further-classification>
        <further-classification edition="200601120260504B">H01B1/22</further-classification>
        <further-classification edition="200601120260504B">B23K35/02</further-classification>
        <further-classification edition="200601120260504B">B23K35/26</further-classification>
        <further-classification edition="202601120260504B">H10W72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤野拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJINO, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不易產生空隙或裂紋的導電性膏。一種導電性膏，包含金屬粒子與溶劑，所述金屬粒子包含平均粒子徑為80 nm～500 nm的第一奈米粒子，於在氮氣環境中自25℃以下起以升溫速度10℃/分鐘進行熱重量分析時，滿足以下的[1]、[2]。  &lt;br/&gt;[1]120℃下的重量殘存率為98%以上  &lt;br/&gt;[2]自120℃至160℃的重量減少率Δ120℃-160℃為2.0%～5.0%</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1743" publication-number="202631209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流水殺菌裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">A61L2/10</main-classification>
        <further-classification edition="202301120260417B">C02F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日機裝股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKKISO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提高流水殺菌裝置的可靠性。本發明的用以解決課題之手段為流水殺菌裝置10係具備：殼體12，係具有：底部20；側壁部22，係從底部20的外周於預定的軸向延伸；以及第一流通口24，係供被處理水流動；光源單元14，係配置於底部20，且於軸向照射紫外光18；以及反應器16，係具有：處理室66，係容納被處理水；外周面74，係與側壁部22的內周面38螺合；對向部70，係與光源單元14於軸向對向；主開口76，係設於對向部70；以及第二流通口84，係供被處理水流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:流水殺菌裝置</p>
        <p type="p">12:殼體</p>
        <p type="p">14:光源單元</p>
        <p type="p">16:反應器</p>
        <p type="p">18:紫外光</p>
        <p type="p">20:底部</p>
        <p type="p">22:側壁部</p>
        <p type="p">24:第一流通口</p>
        <p type="p">26:支撐部</p>
        <p type="p">28:台座</p>
        <p type="p">30:配線口</p>
        <p type="p">32:配線</p>
        <p type="p">34:第一密封構件</p>
        <p type="p">36:開口端</p>
        <p type="p">38,62:內周面</p>
        <p type="p">40:第一螺合部</p>
        <p type="p">42:平坦部</p>
        <p type="p">44:貫通孔</p>
        <p type="p">46:固定銷</p>
        <p type="p">48:插入孔</p>
        <p type="p">50:發光元件</p>
        <p type="p">52:光源殼體</p>
        <p type="p">54:窗構件</p>
        <p type="p">56:基板</p>
        <p type="p">58:照射口</p>
        <p type="p">60:電纜導管</p>
        <p type="p">64:上表面</p>
        <p type="p">66:處理室</p>
        <p type="p">68:內表面</p>
        <p type="p">70:對向部</p>
        <p type="p">72:上端部</p>
        <p type="p">74:外周面</p>
        <p type="p">76:主開口</p>
        <p type="p">78:卡合部</p>
        <p type="p">80:接觸面</p>
        <p type="p">82:對向凹部</p>
        <p type="p">84:第二流通口</p>
        <p type="p">86:第二螺合部</p>
        <p type="p">88:外周凹部</p>
        <p type="p">90:第二密封構件</p>
        <p type="p">C:中心軸</p>
        <p type="p">O:中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1744" publication-number="202632884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層型濾波裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03H7/075</main-classification>
        <further-classification edition="200601120260504B">H03H7/09</further-classification>
        <further-classification edition="200601120260504B">H03H9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澁谷敬悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘆田裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照井智理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤孝昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, TAKAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中尾駿太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAO, SHUNTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立松雅大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATEMATSU, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤口修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAGUCHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之濾波裝置具備有：第1共振器及第2共振器、以及包含有複數個介電層的積層體。第1共振器包含有未電性連接至地面的第1電感器。第2共振器包含有未電性連接至地面的第2電感器。第1電感器包含有：朝向與複數個介電層之積層方向正交的第1面延伸的第1導體層、以及一對第1柱狀導體。第2電感器包含有：朝向與積層方向正交的第2面延伸的第2導體層、以及一對第2柱狀導體。第1導體層之至少一部分與第2導體層之至少一部分係從積層方向觀察時呈相互重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:積層體</p>
        <p type="p">50C~50F:側面</p>
        <p type="p">661,662,731,732:導體層</p>
        <p type="p">L1~L4:電感器</p>
        <p type="p">T1a~T4a,T1b~T4b:柱狀導體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1745" publication-number="202632116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>套管裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">E02D13/06</main-classification>
        <further-classification edition="200601120260423B">E02D7/22</further-classification>
        <further-classification edition="200601120260423B">F15B11/22</further-classification>
        <further-classification edition="200601120260423B">E21B7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本車輛製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHARYO, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂野史彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKANO, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具備控制手段的套管裝置，其可有效地抑制在壓入動作中所產生之升降框架的傾斜。  &lt;br/&gt;一種套管裝置，其具備將升降框架控制成水平狀之控制手段19，4支升降油缸13A~13D係於俯視下被配置在沿著升降框架14外緣之虛擬四角形的四個角落，且其可進行對套管給予壓入力的收縮動作、及給予拔出力的伸長動作之油壓油缸；控制手段係具有：傾斜感測器23，其檢測出相對於升降框架之水平狀態的傾斜之變化角度；4個可變節流閥24，其係與4支升降油缸各者成對，而被設置在各升降油缸於收縮動作狀態下從該升降油缸流出之液壓油的流路21；以及控制部25，其根據由傾斜感測器所檢測出之變化角度，而個別地調整各個可變節流閥之節流程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基座框架</p>
        <p type="p">13、13A~13D:升降油缸</p>
        <p type="p">13a:活塞桿側油室</p>
        <p type="p">13b:缸頭側油室</p>
        <p type="p">14:升降框架</p>
        <p type="p">19:控制手段</p>
        <p type="p">21:缸頭側流路</p>
        <p type="p">22:活塞桿側流路</p>
        <p type="p">23:傾斜感測器</p>
        <p type="p">24:可變節流閥</p>
        <p type="p">25:控制部</p>
        <p type="p">26:記憶部</p>
        <p type="p">27:控制器</p>
        <p type="p">A1:一次側受壓面積</p>
        <p type="p">A2:二次側受壓面積</p>
        <p type="p">F&lt;sub&gt;A&lt;/sub&gt;、F&lt;sub&gt;B&lt;/sub&gt;、F&lt;sub&gt;C&lt;/sub&gt;、F&lt;sub&gt;D&lt;/sub&gt;:油缸壓入力</p>
        <p type="p">P1:油壓(一次側壓力)</p>
        <p type="p">P2:背壓(二次側壓力)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1746" publication-number="202631863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發泡成形用組合物、發泡成形體、及構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L21/00</main-classification>
        <further-classification edition="200601120260504B">C08K3/04</further-classification>
        <further-classification edition="200601120260504B">C08K3/06</further-classification>
        <further-classification edition="200601120260504B">C08K3/26</further-classification>
        <further-classification edition="200601120260504B">C08K3/32</further-classification>
        <further-classification edition="200601120260504B">C08K5/23</further-classification>
        <further-classification edition="200601120260504B">C08J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高津知道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATSU, TOMOMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發泡成形用組合物，其發泡性優異，且發泡後之成形體(發泡成形體)之強度、燃燒時之熱膨脹性、燃燒後之形狀穩定性優異。  &lt;br/&gt;根據本發明，提供一種發泡成形用組合物，其包含能夠交聯之橡膠成分、磷酸系無機化合物、交聯劑、及發泡劑，相對於上述能夠交聯之橡膠成分100質量份，上述磷酸系無機化合物之含量為10～2000質量份，上述交聯劑之含量為0.1～30質量份，上述發泡劑之含量為1～30質量份，熱膨脹性層狀無機化合物之含量未達5質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:構件</p>
        <p type="p">3:電池單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1747" publication-number="202631998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經修飾之內部核糖體進入位點（ＩＲＥＳ）元件及使用方法</chinese-title>
        <english-title>MODIFIED INTERNAL RIBOSOME ENTRY SITE (IRES) ELEMENTS AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N15/85</main-classification>
        <further-classification edition="200601120260504B">C12N15/67</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">C07K16/00</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供改善所關注蛋白質在哺乳動物宿主細胞中之表現的經改善IRES變體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are improved IRES variants for improved expression of a protein of interest in a mammalian host cell.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1748" publication-number="202632716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測器模組</chinese-title>
        <english-title>DETECTOR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01J37/244</main-classification>
        <further-classification edition="200601120260504B">H01J37/26</further-classification>
        <further-classification edition="202601120260504B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　曼薩諾　安德魯　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUES MANSANO, ANDRE LUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維瑟爾　歐文　羅伯特　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISSER, ERWIN ROBERT ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種經組態以偵測由一樣本發射之帶電粒子的偵測器模組，該偵測器模組包含電耦接至一轉換單元之一偵測器單元；該偵測器單元包含一偵測器基板，包含一偵測器元件及電連接至該偵測器元件之一前置放大器電路，該偵測器基板包含用於在該偵測器基板中傳導信號之一第一金屬材料；該轉換單元包含一轉換電路及/或一資料選路電路，該轉換電路及/或該資料選路電路整合至一轉換基板中，該轉換基板包含用於在該轉換基板中傳導信號之一第二金屬材料；  &lt;br/&gt;其中第一導電金屬材料不同於第二導電金屬材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detector module configured to detect charged particles emitted by a sample, the detector module comprising a detector unit electrically coupled to a conversion unit; the detector unit comprising a detector substrate, comprising a detector element and a pre-amplifier circuit electrically connected to the detector element, the detector substrate comprising a first metal material for conducting signals in the detector substrate; the conversion unit comprising a conversion circuit and/or a data routing circuit, the conversion circuit and/or the data routing circuit integrated into a conversion substrate, the conversion substrate comprising a second metal material for conducting signals in the conversion substrate; &lt;br/&gt;wherein the first conducting metal material is different from the second conducting metal material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">208:樣本</p>
        <p type="p">210:初級射束</p>
        <p type="p">220:接合襯墊</p>
        <p type="p">264:偵測器基板</p>
        <p type="p">265:偵測器元件</p>
        <p type="p">266:射束孔徑</p>
        <p type="p">267a:前置放大器電路</p>
        <p type="p">269a:基板導通體</p>
        <p type="p">269b:基板導通體</p>
        <p type="p">270:偵測器單元</p>
        <p type="p">290:轉換單元</p>
        <p type="p">291:轉換基板</p>
        <p type="p">292:轉換電路/資料選路電路</p>
        <p type="p">A:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1749" publication-number="202633312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置及基板處理液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260323B">H10P70/00</main-classification>
        <further-classification edition="202601120260323B">H10P95/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大草葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUSA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠進一步防止形成於基板表面之圖案崩塌地進行昇華乾燥之基板處理方法、基板處理裝置及基板處理液。本發明之基板處理方法係對基板W之圖案形成面進行處理者，且包括：供給工序，其將包含昇華性物質及溶劑之基板處理液供給至圖案形成面；固化工序，其使供給工序中供給至上述圖案形成面之基板處理液之液膜中之溶劑蒸發而使昇華性物質析出，從而形成包含昇華性物質之固化膜；及昇華工序，其使固化膜昇華而去除固化膜；昇華性物質包含2-(1-金剛烷基)-4-甲基苯酚、3,5-二甲基-1-金剛烷醇及六氫鄰苯二甲醯亞胺中之至少任一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理單元</p>
        <p type="p">11:腔室</p>
        <p type="p">12:防飛散杯</p>
        <p type="p">13:控制單元</p>
        <p type="p">14:回轉驅動部</p>
        <p type="p">16:升降驅動部</p>
        <p type="p">21:處理液供給部</p>
        <p type="p">22,32,42:噴嘴</p>
        <p type="p">23,33,43:臂</p>
        <p type="p">24,34:回轉軸</p>
        <p type="p">25,35,45:配管</p>
        <p type="p">26,36,46:閥</p>
        <p type="p">27:基板處理液貯存部</p>
        <p type="p">31:IPA供給部</p>
        <p type="p">37:IPA槽</p>
        <p type="p">41:氣體供給部</p>
        <p type="p">44:支持軸</p>
        <p type="p">47:氣體貯存部</p>
        <p type="p">48:阻斷板</p>
        <p type="p">49:升降機構</p>
        <p type="p">51:基板保持部</p>
        <p type="p">52:旋轉驅動部</p>
        <p type="p">53:旋轉基座</p>
        <p type="p">54:夾盤銷</p>
        <p type="p">61:加熱部</p>
        <p type="p">64:加熱器通電部</p>
        <p type="p">65:旋轉機構</p>
        <p type="p">A1,J1,J2:軸</p>
        <p type="p">C1:旋轉軸線</p>
        <p type="p">W:基板</p>
        <p type="p">Wf:(基板之)正面</p>
        <p type="p">Wb:(基板之)背面</p>
        <p type="p">XYZ:正交座標軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1750" publication-number="202632518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遠端簽名系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260504B">G06F21/30</main-classification>
        <further-classification edition="202201120260504B">G06F3/04883</further-classification>
        <further-classification edition="200601120260504B">G06F3/13</further-classification>
        <further-classification edition="200601120260504B">G06F3/16</further-classification>
        <further-classification edition="202201120260504B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商思數網路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYBERAGENT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中康二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KOJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, YAMATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供遠端簽名系統，係具備第一系統和第二系統，第一系統係具有：輸入裝置，係供書寫者輸入簽名；第一控制裝置，係將顯示簽名的簽名資訊傳送至第二系統；及攝影裝置，係可拍攝映照出書寫者的影像；第二系統係具有：第二控制裝置，係從第一控制裝置取得簽名資訊；繪圖裝置，係根據簽名資訊而將簽名輸出至被描繪構件；接收者側通知裝置，係可根據顯示繪圖裝置進行之標示之輸出已完成的簽名完成資訊而向接收者通知繪圖裝置進行之簽名的輸出已完成；及影像輸出部；第一控制裝置係生成根據攝影裝置所拍攝之書寫者影像資訊而來之包含書寫者動作資訊的處理影像；第二控制裝置係使從第一控制裝置所取得的處理影像顯示於影像輸出部；處理影像係包含與書寫者之姿態不同的角色重現書寫者之動作的影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一系統</p>
        <p type="p">110:輸入裝置</p>
        <p type="p">120:收音裝置</p>
        <p type="p">130:攝影裝置</p>
        <p type="p">140:第一控制裝置</p>
        <p type="p">141:取得部</p>
        <p type="p">142:傳送接收部</p>
        <p type="p">143:生成部</p>
        <p type="p">200:第二系統</p>
        <p type="p">210:繪圖裝置</p>
        <p type="p">211:控制部</p>
        <p type="p">213:驅動部</p>
        <p type="p">215:檢測部</p>
        <p type="p">220:第二控制裝置</p>
        <p type="p">221:傳送接收部</p>
        <p type="p">222:輸出控制部</p>
        <p type="p">230:輸出裝置</p>
        <p type="p">231:影像輸出部</p>
        <p type="p">232:聲音輸出部</p>
        <p type="p">240:接收者側通知裝置</p>
        <p type="p">1000:遠端簽名系統</p>
        <p type="p">P1:書寫者</p>
        <p type="p">P2:接收者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1751" publication-number="202631384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可摺疊設備</chinese-title>
        <english-title>FOLDABLE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B17/06</main-classification>
        <further-classification edition="200601120260504B">B32B9/04</further-classification>
        <further-classification edition="201901120260504B">B32B7/02</further-classification>
        <further-classification edition="200601120260504B">C03C3/087</further-classification>
        <further-classification edition="200601120260504B">C03C17/22</further-classification>
        <further-classification edition="200601120260504B">C03C17/34</further-classification>
        <further-classification edition="201501120260504B">G02B1/14</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商康寧精密素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING PRECISION MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯柏　克萊兒瑞娜塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COBLE, CLAIRE RENATA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅歐雷特　亞歷山卓米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYOLET, ALEXANDRE MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敏納卡辛桑德倫　巴拉牡恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEENAKSHI SUNDARAM, BALAMURUGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文東建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, DONG-GUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩利森二世　詹姆士愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORRISON JR., JAMES EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊斯　詹姆士喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRICE, JAMES JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施耐德　維特馬利諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, VITOR MARINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏拉馬尼　安阿南莎納拉耶南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, ANANTHANARAYANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述可摺疊設備，其包括安置於包含一基於玻璃之材料之一可摺疊基板之一第一主表面上的硬塗層。該可摺疊基板之一基板厚度為大於或等於20微米至小於或等於300微米。該硬塗層包括展現藉由一Berkovich壓頭硬度試驗量測之大於或等於8吉帕斯卡之一硬度的一無機材料。該可摺疊設備可達成以毫米為單位之一平行板距離，該平行板距離等於0.1乘以以微米為單位之該基板厚度。在範疇中，該硬塗層可包括一光學堆疊，該光學堆疊包括具有大於或等於10奈米至小於或等於10微米之一厚度的一抗反射塗層。在範疇中，該可摺疊設備可進一步包含安置於該硬塗層上之一防指紋塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Foldable apparatus are described herein that include hard coating disposed on a first major surface of a foldable substrate comprising a glass-based material. A substrate thickness of the foldable substrate is from greater than or equal to 20 micrometers to less than or equal to 300 micrometers. The hard coating includes an inorganic material exhibiting a hardness greater than or equal to 8 GigaPascals as measured by a Berkovich Indenter Hardness Test. The foldable apparatus can achieve a parallel plate distance in millimeters equal to 0.1 times the substrate thickness in micrometers. In aspects, the hard coating can include an optical stack that includes an anti-reflective coating with a thickness from greater than or equal to 10 nanometers to less than or equal to 10 micrometers. In aspects, the foldable apparatus can further comprise an anti-fingerprint coating disposed on the hard coating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2-2:線</p>
        <p type="p">101,301,401,501,601:可摺疊設備</p>
        <p type="p">102:摺疊軸</p>
        <p type="p">103:可摺疊設備之寬度</p>
        <p type="p">104:摺疊軸102之方向，寬度103之方向</p>
        <p type="p">105:可摺疊設備之長度</p>
        <p type="p">106:長度105之方向</p>
        <p type="p">107:可摺疊設備之中心軸</p>
        <p type="p">109:摺疊平面</p>
        <p type="p">111:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1752" publication-number="202631959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脫氧劑組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C09K15/06</main-classification>
        <further-classification edition="200601120260429B">B01D53/04</further-classification>
        <further-classification edition="200601120260429B">B01D53/14</further-classification>
        <further-classification edition="200601120260429B">B01J20/02</further-classification>
        <further-classification edition="202501120260429B">A23B2/712</further-classification>
        <further-classification edition="202501120260429B">A23B2/717</further-classification>
        <further-classification edition="200601120260429B">C01G49/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>染谷昌男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMEYA, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田貴司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種脫氧劑組成物，其初期的氧吸收被抑制，於大氣中操作一定時間後亦可發揮充分的氧吸收性能。一種脫氧劑組成物，含有將於鐵表面具有鐵氧化物的還原鐵粉以金屬鹵化物被覆而成的金屬鹵化物被覆鐵粉(A)，及水分供給劑(B)，其中，將金屬鹵化物及水分從金屬鹵化物被覆鐵粉(A)除去後的鐵粉中的鐵元素之比例為97.0~99.3質量%，相對於將金屬鹵化物及水分從金屬鹵化物被覆鐵粉(A)除去後的鐵粉100質量份，金屬鹵化物之含量為0.01~1.0質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1753" publication-number="202631639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不使用發火性化合物合成鋁前驅物及相關組合物與相關方法</chinese-title>
        <english-title>SYNTHESIS OF ALUMINUM PRECURSORS WITHOUT USE OF PYROPHORIC COMPOUNDS AND RELATED COMPOSITIONS AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07F5/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡德　德魯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOD, DREW MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於形成氣相沉積前驅物之方法。該方法包含使鹵化鋁化合物、烷氧基鋁化合物及格任亞試劑(Grignard reagent)接觸以形成該氣相沉積前驅物。該氣相沉積前驅物包含烷氧化二烷基鋁化合物。該氣相沉積前驅物之形成不使用發火性化合物。亦提供相關組合物、相關前驅物及相關方法等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for forming a vapor deposition precursor are provided. The method comprises contacting an aluminum halide compound, an alkoxy aluminum compound, and a Grignard reagent to form the vapor deposition precursor. The vapor deposition precursor comprises an dialkyl aluminum alkoxide compound. The vapor deposition precursor is formed without use of a pyrophoric compound. Related compositions, related precursors, and related methods are also provided, among other things.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟/溶解</p>
        <p type="p">104:步驟/接觸</p>
        <p type="p">106:步驟/接觸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1754" publication-number="202633460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將重佈線層自載體基板轉移至玻璃基板之空腔以改良重佈線層之均勻性的方法</chinese-title>
        <english-title>METHOD OF TRANSFERRING REDISTRIBUTION LAYERS FROM CARRIER SUBSTRATE TO CAVITY OF GLASS SUBSTRATE TO IMPROVE UNIFORMITY OF REDISTRIBUTION LAYERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/08</main-classification>
        <further-classification edition="202601120260427B">H10P54/92</further-classification>
        <further-classification edition="202601120260427B">H10W70/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯斯伯格　拉爾斯馬丁奧弗里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUSBERG, LARS MARTIN OTFRIED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔普敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, BOKYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石成浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOK, SEONG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種製備一電光晶片封裝之方法的實施例。在該方法中，將複數個重佈線層（RDL）設置至一載體基板之一第一主表面上。該複數個RDL定位於一玻璃基板上方，其中該玻璃基板包括一第三主表面、一第四主表面及一邊界表面。該玻璃基板具有在該第四主表面與該第三主表面之間的一第一厚度及在該第四主表面與該邊界表面之間的一第二厚度。該第一厚度小於該第二厚度以使得該第三主表面至少部分地界定該玻璃基板中之一空腔。該複數個RDL自該載體基板轉移至該玻璃基板之該空腔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of a method of preparing an electro-optical chip package are provided. In the method, a plurality of redistribution layers (RDL) is provided onto a first major surface of a carrier substrate. The plurality of RDL is positioned over a glass substrate in which the glass substrate includes a third major surface, a fourth major surface, and a border surface. The glass substrate has a first thickness between the fourth major surface and the third major surface and a second thickness between the fourth major surface and the border surface. The first thickness is less than the second thickness such that the third major surface defines at least in part a cavity in the glass substrate. The plurality of RDL is transferred from the carrier substrate to the cavity of the glass substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電光晶片封裝</p>
        <p type="p">12:PCB</p>
        <p type="p">14:BGA</p>
        <p type="p">15:玻璃基板</p>
        <p type="p">16:PIC</p>
        <p type="p">18:電子組件</p>
        <p type="p">20:PIC波導</p>
        <p type="p">21:玻璃波導</p>
        <p type="p">22:光學介面</p>
        <p type="p">23:光連接器</p>
        <p type="p">24:光纖</p>
        <p type="p">26,28:RDL</p>
        <p type="p">30:TGV</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1755" publication-number="202632946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置及電腦程式</chinese-title>
        <english-title>INFORMATION PROCESSING APPARATUS, AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">H04N13/221</main-classification>
        <further-classification edition="200601120251201B">G06T17/00</further-classification>
        <further-classification edition="202201120251201B">G06V20/60</further-classification>
        <further-classification edition="202001120251201B">G02B30/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清宮僚太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOMIYA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲吉太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAYOSHI, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，在拍攝對象物並使用所拍攝之對象物之三維模型資料產生將三維模型配置於虛擬空間上之影像時，能夠根據對象物之類型進行不同之呈現。  &lt;br/&gt;本發明係一種資訊處理裝置，其具備：掃描控制器件，其控制掃描器之位置及角度，掃描所設置之被攝體，產生掃描圖像；資料產生器件，其根據掃描圖像產生三維模型資料；判定器件，其根據基於三維模型資料而產生之被攝體之渲染圖像，判定被攝體之類型；資料產生器件，其產生輸出資料，該輸出資料包含將基於三維模型資料之三維模型配置於虛擬空間內之影像；及輸出器件，其將輸出資料輸出至外部之輸出裝置；資料產生器件以如下方式產生輸出資料，即，包含與判定器件判定出之被攝體之類型對應之各被攝體之呈現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">When capturing an object and generating video that places a 3D model of the captured object in a virtual space using its 3D model data, different effects can be applied depending on the object type. An information processing device comprising: scanning control means for controlling the position and angle of a scanner to scan a placed subject and generate a scan image; data generation means for generating 3D model data from the scan image; determination means for determining the subject type based on a rendered image of the subject generated from the three-dimensional model data; data generation means for generating output data including an image with a three-dimensional model placed within a virtual space based on the three-dimensional model data; and output means for outputting the output data to an external output device. The data generation means generates the output data to include effects specific to each subject corresponding to the subject type determined by the determination means.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圖像處理系統</p>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">110:掃描器</p>
        <p type="p">120:支持臂</p>
        <p type="p">130:模型支持裝置</p>
        <p type="p">140:顯示裝置</p>
        <p type="p">140A:操作部</p>
        <p type="p">150:頭戴式設備</p>
        <p type="p">160:操作裝置</p>
        <p type="p">160A:輸出部</p>
        <p type="p">160B:操作部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1756" publication-number="202633379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有蒸氣腔室之晶圓卡盤</chinese-title>
        <english-title>WAFER CHUCK HAVING VAPOR CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/78</main-classification>
        <further-classification edition="200601120260423B">F28D15/02</further-classification>
        <further-classification edition="200601120260423B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商塞米克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昌桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, CHANG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵勝勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, SEUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露具有蒸氣腔室之晶圓卡盤。根據本發明的一個方面的一種具有蒸氣腔室之晶圓卡盤可以包括：吸附卡盤，一面吸附晶圓；蒸氣腔室，設置於所述吸附卡盤之他面，並用以擴散由所述晶圓之熱量導入所述吸附卡盤之熱；冷卻層，設置於所述蒸氣腔室之他側，並包括保持於低於所述吸附卡盤溫度之製冷媒，以散熱自所述蒸氣腔室擴散之熱；加熱器，用以加熱使所述吸附卡盤保持於一定溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓</p>
        <p type="p">100:晶圓卡盤</p>
        <p type="p">110:吸附卡盤</p>
        <p type="p">118:溫度感測器</p>
        <p type="p">119:感測區域</p>
        <p type="p">112:第一槽</p>
        <p type="p">114:第二槽</p>
        <p type="p">113:熱界面材料</p>
        <p type="p">115:真空吸附孔</p>
        <p type="p">124:腔室</p>
        <p type="p">120:蒸氣腔室</p>
        <p type="p">121:第一板</p>
        <p type="p">123:第二板</p>
        <p type="p">125:剛性柱</p>
        <p type="p">127:芯吸部</p>
        <p type="p">129:作動柱</p>
        <p type="p">130:冷卻層</p>
        <p type="p">132:冷卻流路</p>
        <p type="p">140:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1757" publication-number="202631051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接裝置</chinese-title>
        <english-title>CONNECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260424B">A47B88/90</main-classification>
        <further-classification edition="200601120260424B">F16B12/20</further-classification>
        <further-classification edition="200601120260424B">F16B25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉布赫爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABHERR, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊哲樂　馬可斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEZLER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫恩　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUENG, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班瑟　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENZER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將抽屜邊框（101）與平板狀抽屜元件（100a）——較佳是抽屜底板（102）和/或抽屜後壁（103）——藉助於至少一個螺釘（11）連接起來的連接裝置（1），其中該連接裝置（1）包括至少一個連接元件（2），當中該至少一個連接元件（2）具有&lt;br/&gt;  -  用於供平板狀抽屜元件（100a）貼靠的至少一個接觸面（3），以及&lt;br/&gt;  -  朝向至少一個接觸面（3）打開的至少一個螺釘孔（10），該至少一個螺釘孔（10）用於容納該至少一個螺釘（11），&lt;br/&gt;  其中該連接裝置（1）包括設置有螺紋（11a）的至少一個螺釘（11），其中該至少一個螺釘（11）可擰入該至少一個螺釘孔（10），其中該至少一個連接元件（2）在螺釘孔（10）的區域中沿螺釘孔（10）的縱向具有最小厚度（D），該最小厚度（D）的大小使得在該至少一個螺釘（11）已擰入的狀態下，至少三分之一的螺紋（11a）與螺釘孔（10）嚙合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接裝置</p>
        <p type="p">2:連接元件</p>
        <p type="p">100a:平板狀抽屜元件</p>
        <p type="p">101:抽屜邊框</p>
        <p type="p">102:抽屜底板</p>
        <p type="p">103:抽屜後壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1758" publication-number="202631053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接裝置</chinese-title>
        <english-title>CONNECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A47B88/956</main-classification>
        <further-classification edition="201701120260429B">A47B88/40</further-classification>
        <further-classification edition="201701120260429B">A47B88/00</further-classification>
        <further-classification edition="200601120260429B">A47B96/00</further-classification>
        <further-classification edition="200601120260429B">F16B12/00</further-classification>
        <further-classification edition="200601120260429B">F16B12/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊哲樂　馬可斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEZLER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將抽屜邊框（101）與平板狀抽屜元件（100a）——較佳為抽屜底板（102）和/或抽屜後壁（103）——藉助於至少一個釘子（4）連接起來的連接裝置（1），其中該連接裝置（1）包括至少一個連接元件（2），其中該至少一個連接元件包含：&lt;br/&gt;  -  用於供平板狀抽屜元件（100a）貼靠的至少一個接觸面（3），以及&lt;br/&gt;  -  向著至少一個接觸面（3）打開的至少一個釘孔（5），用於容納至少一個釘子（4），&lt;br/&gt;  其中連接裝置（1）包含至少一個固定裝置（6）和至少一個釘子（4），其中該至少一個釘子（4）至少在連接裝置（1）的交付狀態下由固定裝置（6）保持在該至少一個釘孔（5）內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接裝置</p>
        <p type="p">2:連接元件</p>
        <p type="p">100a:平板狀抽屜元件</p>
        <p type="p">101:抽屜邊框</p>
        <p type="p">102:抽屜底板</p>
        <p type="p">103:抽屜後壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1759" publication-number="202632354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連接器、光模組、插頭、插座、插頭的製造方法及光連接器的連接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">G02B6/36</main-classification>
        <further-classification edition="200601120260430B">G02B6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商白山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKUSAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＴ創新器件有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTT INNOVATIVE DEVICES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹崎元人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAKI, MOTOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹿間光太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKAMA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的係提供一種小型、低損失、連接損失的變異少且連接時套管損傷少的光連接器、以及可連接光連接器的光模組、光連接器的插頭以及光連接器的連接方法。  &lt;br/&gt;　　其解決手段為一種光連接器(10)，係可連接插座(100)與插頭(200)，其中，插座(100)為磁性體，並具備可將第1套管(110)固定在連接面的凹部，插頭(200)具備：薄板(220)；磁鐵(230)，可經由薄板(220)吸附插座(100)；導引元件(250)，可滑動地內裝第2套管(210)；以及彈簧(265)，將第2套管(210)朝向插座(100)推壓；在插座(100)與插頭(200)連接時，插座(100)與插頭(200)之間的吸引力大於彈簧(265)的推壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光連接器</p>
        <p type="p">100:插座</p>
        <p type="p">110:套管</p>
        <p type="p">111:接著劑填充部</p>
        <p type="p">130:銷鍵座</p>
        <p type="p">200:插頭</p>
        <p type="p">210:套管</p>
        <p type="p">221:第1薄板</p>
        <p type="p">222:第2薄板</p>
        <p type="p">231:第1磁鐵</p>
        <p type="p">241:第1磁軛</p>
        <p type="p">250:導引元件</p>
        <p type="p">251:第1凸部</p>
        <p type="p">252:第2凸部</p>
        <p type="p">260:插頭銷鍵座</p>
        <p type="p">265:彈簧</p>
        <p type="p">270:護套</p>
        <p type="p">271:孔部</p>
        <p type="p">272:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1760" publication-number="202631047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拉出導引裝置、傢俱元件和傢俱</chinese-title>
        <english-title>PULL-OUT GUIDE, FURNITURE ELEMENT AND FURNITURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260420B">A47B88/427</main-classification>
        <further-classification edition="201701120260420B">A47B88/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊沙　帕斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSER, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得梅爾　曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERMAIR, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕斯克　艾維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSIC, ELVIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉布赫爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABHERR, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將傢俱元件（2）可移動地安裝在傢俱主體（3）上的拉出導引裝置（1），包括要與傢俱元件（2）連接的至少一個滑軌（4）以及要與傢俱主體（3）連接的至少一個主體軌道（5），其中該滑軌（4）可移動地安裝在主體軌道（5）上，並且其中該主體軌道（5）包含至少兩個固定元件（6、7），藉由該等至少兩個固定元件（6、7），主體軌道（5）可固定在傢俱主體（3）上，其中該等固定元件中的第一固定元件（6）以一件式的結構與主體軌道（5）連接以及該等固定元件中的第二固定元件（7）被設計成獨立部件且與主體軌道（5）連接或可連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:拉出導引裝置</p>
        <p type="p">4:滑軌</p>
        <p type="p">5:主體軌道</p>
        <p type="p">6:第一固定元件</p>
        <p type="p">7:第二固定元件</p>
        <p type="p">8:前部區域</p>
        <p type="p">9:拉出使用位置</p>
        <p type="p">10:後部區域</p>
        <p type="p">11:縱向</p>
        <p type="p">12:連接板</p>
        <p type="p">13:連接段</p>
        <p type="p">14:接觸處</p>
        <p type="p">15:內側</p>
        <p type="p">16:止動區域</p>
        <p type="p">17:階梯狀區域</p>
        <p type="p">18:開口</p>
        <p type="p">19:加強筋</p>
        <p type="p">22:耦合裝置</p>
        <p type="p">23:鎖緊裝置</p>
        <p type="p">25:插入使用位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1761" publication-number="202632805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01R13/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吹田涼輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKITA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本芳伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器，係具備：端子，其具有供對象側端子插入連接的箱狀部，並安裝於電線的終端；殼體，其具有收容箱狀部的收容孔；及保持架，其以向與箱狀部插入到收容孔的插入方向交叉之交叉方向可位移地安裝於殼體。殼體的收容孔之上表面形成有按壓片，下表面形成有突起。保持架具備突部，當保持架位於第1位置時，箱狀部能夠插入至收容孔，插入收容孔的箱狀部藉由被按壓片按壓並向交叉方向位移，使得在階差部的插入方向側以向與插入方向相反方向突出的方式設置之突出部勾掛於突起，且與形成在突起上的凹部嵌合而防脫落，並且箱狀部的後端也藉由勾掛於突部而防脫落，形成為1次卡止狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector includes a terminal that includes a box-shaped portion to which a mating terminal is inserted and connected and that is attached to an end of an electric wire, a housing that includes an accommodating hole for accommodating the box-shaped portion, and a retainer that is attached to the housing in a manner capable of being displaced in an intersecting direction intersecting with an insertion direction of the box-shaped portion into the accommodating hole. A pressing piece is formed on an upper surface of the accommodating hole of the housing, and a protrusion is formed on a lower surface. The retainer includes a protruding portion, and when the retainer is at a first position, the box-shaped portion is allowed to be inserted into the accommodating hole, and the box-shaped portion inserted in the accommodating hole is pushed by the pressing piece and displaced in the intersecting direction so that a primary locking state is reached due to a projecting portion that is provided on the insertion direction side of the step portion in a manner protruding in an opposite direction from the insertion direction being caught by the protrusion and engaged and retained by a recessed portion formed on the protrusion and a rear end of the box-shaped portion being caught and retained by the protruding portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41b:下表面</p>
        <p type="p">44:突起</p>
        <p type="p">44a:凹部</p>
        <p type="p">48:限制部</p>
        <p type="p">51a:上板部</p>
        <p type="p">560:突出部</p>
        <p type="p">561:第1突出部</p>
        <p type="p">561a:第1延伸部</p>
        <p type="p">561b:第2延伸部</p>
        <p type="p">562:第2突出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1762" publication-number="202631652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>HIV疫苗及使用方法</chinese-title>
        <english-title>HIV VACCINES AND METHODS OF USING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K14/005</main-classification>
        <further-classification edition="200601120260504B">C07K19/00</further-classification>
        <further-classification edition="200601120260504B">C12N15/62</further-classification>
        <further-classification edition="200601120260504B">A61K39/12</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="201901120260504B">G16B20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　佳妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉心岸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XINAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬卡內吉　亞盧瑞　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKADZANGE, AZURE T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　史蒂芬　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, STEPHEN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, SARAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝哈塔　希沙姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEHATA, HESHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特梅瑟德　菲利斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMESEDER, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦羅斯卡雅　葉夫根尼婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SVAROVSKAIA, EVGUENIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布佩希　亞雀納　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOOPATHY, ARCHANA V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">9  &lt;br/&gt;本發明提供用於誘發針對HIV-1之免疫反應的HIV-1融合多肽、編碼此類融合多肽之多核苷酸、表現此類融合多肽之載體；包含此類融合多肽、多核苷酸、或載體之醫藥及免疫原性組成物及套組，及用於治療及/或預防HIV-1之方法。本發明進一步提供用於設計抗病毒疫苗之方法，該抗病毒疫苗包括誘發針對HIV-1之免疫反應的疫苗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are HIV-1 fusion polypeptides, polynucleotides encoding such fusion polypeptides, vectors expressing such fusion polypeptides for use in eliciting an immune response against HIV-1; pharmaceutical and immunogenic compositions and kits comprising such fusion polypeptides, polynucleotides or vectors, and methods of use in treating and/or preventing HIV-1. Further provided are methods for design of antiviral vaccines, including vaccines to elicit an immune response against HIV-1.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1763" publication-number="202631804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚碳酸酯寡聚物及樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G64/12</main-classification>
        <further-classification edition="200601120260504B">C08G64/14</further-classification>
        <further-classification edition="200601120260504B">C08L69/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片尾水羽子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAO, MIUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小黒大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURO, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細岡周平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOOKA, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案發明提供聚碳酸酯寡聚物及包含前述聚碳酸酯寡聚物之樹脂組成物。本案發明相關之聚碳酸酯寡聚物為包含來自雙酚之構成單位(A)與來自3官能以上之多元醇化合物之構成單位(B)之聚碳酸酯寡聚物，聚碳酸酯寡聚物在末端包含來自式(2)表示之化合物之構造，將構成單位(A)之莫耳數設為a，將構成單位(B)之莫耳數設為b及將式(2)表示之化合物之莫耳數設為z時，滿足式(I)。  &lt;br/&gt;2＜2×(a+b)/z＜30  (I)式(2)中，Ar為苯、萘或聯苯，i為1~5之整數。  &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="203px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1764" publication-number="202632441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性曝光裝置及方法</chinese-title>
        <english-title>LINEAR EXPOSURE DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G03F7/22</main-classification>
        <further-classification edition="200601120260425B">B41J2/47</further-classification>
        <further-classification edition="200601120260425B">G02B26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商寶麗來ＩＰ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLAROID IP B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施泰特納　盧卡斯　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEITNER, LUCAS MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　德　海地　馬騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER HEIDE, MAARTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU,CHUNG HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珈法里　艾娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHAFARI, AVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞森</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秀鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線性曝光裝置包括：一殼體，其經組態以接收一感光介質；一光源，其耦接至該殼體且經組態以沿著一光路徑朝向一曝光區域發射光；一致動器，其耦接至該殼體且經組態以相對於該曝光區域重新定位該感光介質；及一控制器，其可操作地耦接至該光源及該致動器。該控制器經組態以：接收對應於一所要影像之影像資料；控制該光源以發射對應於該所要影像之一第一部分的光；控制該致動器以相對於該曝光區域重新定位該感光介質；及控制該光源以發射對應於該所要影像之一第二部分的光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A linear exposure device includes a housing configured to receive a photosensitive medium, a light source coupled to the housing and configured to emit light along a light path toward an exposure area, an actuator coupled to the housing and configured to reposition the photosensitive medium relative to the exposure area, and a controller operatively coupled to the light source and the actuator. The controller is configured to receive image data corresponding to a desired image, control the light source to emit light corresponding to a first portion of the desired image, control the actuator to reposition the photosensitive medium relative to the exposure area, and control the light source to emit light corresponding to a second portion of the desired image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">12:列印機</p>
        <p type="p">14:影像資料源</p>
        <p type="p">16:感光介質</p>
        <p type="p">20:外殼</p>
        <p type="p">22:封閉容積</p>
        <p type="p">24:介質出口</p>
        <p type="p">26:介質容器</p>
        <p type="p">30:輸送機系統</p>
        <p type="p">32:輸送機馬達</p>
        <p type="p">34:滾輪</p>
        <p type="p">36:輸送方向</p>
        <p type="p">40:輸送機位置感測器</p>
        <p type="p">42:介質位置感測器</p>
        <p type="p">50:光源</p>
        <p type="p">52:反射鏡</p>
        <p type="p">54:反射鏡致動器</p>
        <p type="p">60:控制器</p>
        <p type="p">62:處理器</p>
        <p type="p">64:記憶體</p>
        <p type="p">66:通信介面</p>
        <p type="p">70:電能源</p>
        <p type="p">80:攝影機</p>
        <p type="p">82:影像資料儲存器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1765" publication-number="202631195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用ＦＣＲＮ拮抗劑治療肌炎之方法</chinese-title>
        <english-title>METHODS FOR TREATING MYOSITIS USING FCRN ANTAGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商阿根思公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARGENX BV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　巴倫本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN BAELEN, BEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧科姆　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNCOMBE, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕多普洛　德斯波納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPADOPOULOU, DESPOINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德倫　塞巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER WONING, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德謝寧克　倫杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE CEUNINCK, LEENTJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　塞巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內托　阿格娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETO, AGNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特佩羅夫　伊麗莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEPEROV, ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘哈拉　斯特凡尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANJAAR, STEPHANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德博什　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANDEBOSCH, AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯格　特雷西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUGER, TRACY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供使用有效量之人類新生兒Fc受體(FcRn)拮抗劑治療肌炎的方法。本文亦提供用於治療肌炎及用於製造供治療肌炎用之藥物的FcRn拮抗劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating myositis using an effective amount of a human neonatal Fc receptor (FcRn) antagonist. FcRn antagonists for use in the treatment of myositis and for use in the manufacture of a medicament for the treatment of myositis are also provided herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1766" publication-number="202631978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>培養輔助裝置、培養系統、培養輔助方法以及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C12M1/00</main-classification>
        <further-classification edition="200601120260416B">C12M3/00</further-classification>
        <further-classification edition="200601120260416B">C12M1/34</further-classification>
        <further-classification edition="200601120260416B">G01N33/483</further-classification>
        <further-classification edition="200601120260416B">G01N21/00</further-classification>
        <further-classification edition="200601120260416B">G05B19/00</further-classification>
        <further-classification edition="202301120260416B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東海國立大學機構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商賽諾世股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZACROS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤竜司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KENJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内宏彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田博行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田和佳奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, WAKANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種培養輔助裝置，係具備：圖像取得部，係在複數個時機，取得含有支架材及細胞之培養液的圖像；過去細胞密度推定部，係基於前述培養液的圖像，來推定前述支架材上之前述細胞的密度；未來細胞密度推定部，係基於前述複數個時機及藉由前述過去細胞密度推定部所推定之培養液中之支架材上之細胞的密度，來推定未來的支架材上之細胞的密度；以及操作時期判定部，係基於所推定之未來的支架材上之細胞的密度，來判定對前述培養液進行操作之時機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">14:培養輔助裝置</p>
        <p type="p">140:圖像取得部</p>
        <p type="p">142:過去細胞密度推定部</p>
        <p type="p">144:未來細胞密度推定部</p>
        <p type="p">146:操作時期判定部</p>
        <p type="p">148:輸出部</p>
        <p type="p">190:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1767" publication-number="202631788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低折射率光波導</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C08G59/40</main-classification>
        <further-classification edition="200601120260421B">C09D183/04</further-classification>
        <further-classification edition="200601120260421B">G02B6/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤偉大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUBARA, REMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田所佐代子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADOKORO, SAYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菓子野翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHINO, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種不含氟化烷基化合物而能形成低折射率之芯及包覆層、對光電混載基板具有適合性之光波導。  &lt;br/&gt;　　[解決手段]一種光波導，具有芯及覆蓋該芯之周圍之包覆層，前述芯係由不含氟化烷基化合物之聚合性組成物(a)之硬化物所構成，該硬化物於波長1.31μm之折射率n&lt;sub&gt;1&lt;/sub&gt;顯示為1.48以下，前述包覆層係由含有粒子徑5nm至150nm之中空微粒子且不含氟化烷基化合物之聚合性組成物(b)之硬化物所構成，該硬化物於波長1.31μm之折射率n&lt;sub&gt;2&lt;/sub&gt;顯示為1.45以下，n&lt;sub&gt;1&lt;/sub&gt;-n&lt;sub&gt;2&lt;/sub&gt;為0.002至0.15。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1768" publication-number="202632809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器殼體</chinese-title>
        <english-title>CONNECTOR HOUSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01R13/641</main-classification>
        <further-classification edition="200601120260102B">H01R13/629</further-classification>
        <further-classification edition="200601120260102B">H01R13/639</further-classification>
        <further-classification edition="200601120260102B">H01R13/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＭＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田利光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, TOSHIMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧村隆信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKIMURA, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻角弥恵子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJIKADO, MIEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口正幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠滿足連接器的小型化的要求並且發出充分的碰撞聲（卡合完成聲）的連接器殼體。該連接器殼體是能夠與對方殼體卡合和解除卡合的連接器的殼體，殼體具有：主體；殼體桿，其支撐於主體；以及滑動桿，殼體桿具有：支撐部，其支撐於主體；以及臂，其從支撐部向卡合方向延伸，且能夠撓曲位移，操作部和臂由支撐部支撐而能夠呈蹺蹺板狀地擺動，在臂的前端具有卡合部，在滑動桿安裝於卡合位置的狀態下，伴隨著卡合部與對方殼體的被干涉部的接觸，進行臂向分離的方向撓曲的彈性變形，在與對方殼體卡合時，臂敲打對方殼體而發出卡合完成聲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide a connector housing that can generate a sufficient impact sound (engagement completion sound) while also meeting the compactness requirements of the connector. &lt;br/&gt;A connector housing which is capable of engaging and disengaging with a counterpart housing, having a main body, a housing lever supported on the main body, and a slide lever, wherein the housing lever has a support section supported on the main body and an arm which extends from the support section in the radial direction and is capable of bending displacement, an operation section and the arm are supported on the support section and are capable of rocking in a seesaw manner, the tip of the arm has an engagement section, and when the slide lever is mounted at the engagement position, contact between the engagement section and the contact-receiving section of the counterpart housing causes flexural elastic deformation of the arm in the separating direction, and upon engaging with the counterpart housing, the arm strikes the counterpart housing and produces an engagement completion sound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">32:電線插入口</p>
        <p type="p">34:支撐部</p>
        <p type="p">332:面</p>
        <p type="p">41:支撐部</p>
        <p type="p">42:操作部</p>
        <p type="p">43:臂</p>
        <p type="p">411:被限制部</p>
        <p type="p">421:滑動凹部</p>
        <p type="p">423:肋</p>
        <p type="p">431:開口</p>
        <p type="p">432:卡合部</p>
        <p type="p">433:干涉部</p>
        <p type="p">52:滑動桿操作部</p>
        <p type="p">53:撓曲限制部</p>
        <p type="p">54:滑動凸部</p>
        <p type="p">55:滑動臂</p>
        <p type="p">541:平坦面</p>
        <p type="p">557:限制部</p>
        <p type="p">558:主體抵接部</p>
        <p type="p">91:對方殼體</p>
        <p type="p">92:罩部</p>
        <p type="p">921:被卡合部</p>
        <p type="p">922:被干涉部</p>
        <p type="p">332:面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1769" publication-number="202631413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定位組件</chinese-title>
        <english-title>POSITIONING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B60N2/02</main-classification>
        <further-classification edition="200601120260430B">B60N2/28</further-classification>
        <further-classification edition="200601120260430B">B60N2/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寧歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NING, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張錕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種定位組件，該定位組件適於將載具本體安裝至汽車座椅上，該定位組件包括第一定位組件和第二定位組件。第一定位組件用於連接載具本體並設有第一滑動件和第二滑動件。第二定位組件用於連接汽車座椅並設有第一軌道和第二軌道。第一滑動件沿第一軌道滑移，第二滑動件沿第二軌道滑移，以使第一定位組件相對於第二定位組件旋轉並移動。其中，第一軌道沿第一方向或第三方向延伸，第二軌道沿第二方向或第四方向延伸。第一定位組件在旋轉及移動的過程中，第一定位組件還可相對於第二定位組件沿第五方向移動。第五方向分別與第一方向、第二方向、第三方向以及第四方向相交錯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a positioning assembly, the positioning assembly is adapted to mount the carrier body to a vehicle seat, and the positioning assembly includes a first positioning assembly and a second positioning assembly. The first positioning assembly is configured to be connected with the carrier body and is provided with a first sliding member and a second sliding member. The second positioning assembly is configured to be connected with the vehicle seat and is provided with a first rail and a second rail. The first sliding member slides along the first rail, and the second sliding member slides along the second rail to enable the first positioning assembly to rotate and move relative to the second positioning assembly. The first rail extends in the first direction or the third direction, and the second rail extends in the second direction or the fourth direction. During a process of rotation and movement of the first positioning assembly, the first positioning assembly is also capable of moving relative to the second positioning assembly in the fifth direction. The fifth direction intersects with the first direction, second direction, third direction and fourth direction respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A100:定位組件</p>
        <p type="p">A110:第一定位組件</p>
        <p type="p">A111:旋轉座</p>
        <p type="p">A113:避讓槽</p>
        <p type="p">A1131:第一位置</p>
        <p type="p">A1132:第二位置</p>
        <p type="p">A120:第二定位組件</p>
        <p type="p">A121:頂蓋</p>
        <p type="p">A122:底蓋</p>
        <p type="p">A131:第一滑動件</p>
        <p type="p">A1311:第一滑動桿</p>
        <p type="p">A132:第二滑動件</p>
        <p type="p">A1321:第二滑動桿</p>
        <p type="p">A141:第一軌道</p>
        <p type="p">A1411:第一軌段</p>
        <p type="p">A1412:第三軌段</p>
        <p type="p">A142:第二軌道</p>
        <p type="p">A1421:第二軌段</p>
        <p type="p">A1422:第四軌段</p>
        <p type="p">A143:交叉中心</p>
        <p type="p">F1:第一方向</p>
        <p type="p">F2:第二方向</p>
        <p type="p">F3:第三方向</p>
        <p type="p">F4:第四方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1770" publication-number="202631936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著片、單元面板及拼接顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09J9/00</main-classification>
        <further-classification edition="201801120260504B">C09J7/20</further-classification>
        <further-classification edition="200601120260504B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦川広太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAKAWA, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内藤真人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITOU, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的技術問題在於提供一種雷射切割加工性良好的黏著片、單元面板及拼接顯示器。此黏著片(1A)為用於製造構成拼接顯示器的單元面板(2A)的黏著片(1A)，其具備第一黏著劑層(12)、第二黏著劑層(13)、及設置於第一黏著劑層(12)與第二黏著劑層(13)之間的芯材(14)，對由第一黏著劑層(12)、芯材(14)及第二黏著劑層(13)構成的黏著積層體(11)進行以200mm/分鐘的拉伸速度使其伸長的拉伸試驗所測得的斷裂伸長率為1000%以下，或者進行此拉伸試驗所測得的斷裂應力為10MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:黏著片</p>
        <p type="p">11:黏著積層體</p>
        <p type="p">12:第一黏著劑層</p>
        <p type="p">12S:第一黏著劑層的黏著面</p>
        <p type="p">13:第二黏著劑層</p>
        <p type="p">13S:第二黏著劑層的黏著面</p>
        <p type="p">14:芯材</p>
        <p type="p">16a,16b:剝離片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1771" publication-number="202633242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260428B">H10K50/80</main-classification>
        <further-classification edition="200601120260428B">C09K11/06</further-classification>
        <further-classification edition="201401120260428B">C09D11/38</further-classification>
        <further-classification edition="202301120260428B">H10K50/15</further-classification>
        <further-classification edition="202301120260428B">H10K50/165</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越山良樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIYAMA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田徹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可有助於發光性能提升的技術。顯示裝置1係依序具備：基板11、陽極12、電洞輸送層15、發光層16、電子輸送層17、及陰極18，前述發光層16係由量子點16A所構成，前述電子輸送層17係由金屬氧化物奈米粒子17A所構成，前述量子點16A的平均粒子徑R1係小於前述金屬氧化物奈米粒子17A的平均粒子徑R2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">11:基板</p>
        <p type="p">12:陽極</p>
        <p type="p">13:間隔壁層</p>
        <p type="p">14:電洞注入層</p>
        <p type="p">15:電洞輸送層</p>
        <p type="p">16:發光層</p>
        <p type="p">17:電子輸送層</p>
        <p type="p">18:陰極</p>
        <p type="p">PXB:第3子像素</p>
        <p type="p">PXG:第2子像素</p>
        <p type="p">PXR:第1子像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1772" publication-number="202633293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含矽材料與具有不同鍺濃度之含矽與鍺材料之間的選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING BETWEEN SILICON-CONTAINING MATERIALS AND SILICON-AND-GERMANIUM-CONTAINING MATERIALS WITH VARYING GERMANIUM CONCENTRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P50/20</main-classification>
        <further-classification edition="202601120260504B">H10P14/43</further-classification>
        <further-classification edition="200601120260504B">C23C16/22</further-classification>
        <further-classification edition="200601120260504B">C23C14/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子匯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格爾　尼汀Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGLE, NITIN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯羅立克　米克海爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOROLIK, MIKHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車適</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱拉拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, LALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">例示性半導體處理方法可包括將含氟前驅物和含氮前驅物提供到半導體處理腔室的處理區域。基板可容納於處理區域內。含矽材料和含矽與鍺材料可設置於基板上。該等方法可包括使基板與含氟前驅物和含氮前驅物接觸。該接觸可以大於或約15:1的選擇性相對於含矽與鍺材料蝕刻含矽材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a fluorine-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. A silicon-containing material and a silicon-and-germanium-containing material may be disposed on the substrate. The methods may include contacting the substrate with the fluorine-containing precursor and the nitrogen-containing precursor. The contacting may etch the silicon-containing material relative to the silicon-and-germanium-containing material at a selectivity of greater than or about 15:1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:可選操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1773" publication-number="202631955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子點的合成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K11/56</main-classification>
        <further-classification edition="200601120260504B">C09K11/62</further-classification>
        <further-classification edition="200601120260504B">C09K11/88</further-classification>
        <further-classification edition="201101120260504B">B82Y20/00</further-classification>
        <further-classification edition="201101120260504B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島義弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木伸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳶島一也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBISHIMA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種量子點的合成方法，其係合成黃銅礦系量子點的量子點的合成方法，其特徵為包含：使I族元素與VI族元素進行反應而生成奈米粒子的奈米粒子生成步驟，與，藉由熱處理而使III族元素進行陽離子擴散至前述奈米粒子的陽離子擴散步驟。藉此，提供一種合成無組成不均，且粒徑一致之具有良好發光特性的量子點的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1774" publication-number="202631581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C07C381/12</main-classification>
        <further-classification edition="200601120260430B">C07C311/21</further-classification>
        <further-classification edition="200601120260430B">C07C25/18</further-classification>
        <further-classification edition="200601120260430B">C08F12/08</further-classification>
        <further-classification edition="200601120260430B">C08F12/14</further-classification>
        <further-classification edition="200601120260430B">C08F12/24</further-classification>
        <further-classification edition="200601120260430B">C08F12/30</further-classification>
        <further-classification edition="200601120260430B">C08F16/26</further-classification>
        <further-classification edition="200601120260430B">C08F20/10</further-classification>
        <further-classification edition="200601120260430B">G03F7/004</further-classification>
        <further-classification edition="200601120260430B">G03F7/039</further-classification>
        <further-classification edition="200601120260430B">G03F7/20</further-classification>
        <further-classification edition="200601120260430B">G03F7/32</further-classification>
        <further-classification edition="202601120260430B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能產生具有適度酸強度且擴散小之酸之鎓鹽、含有此鎓鹽之化學增幅正型阻劑組成物、及使用該阻劑組成物之阻劑圖案形成方法。  &lt;br/&gt;一種下式(A)表示之鎓鹽，  &lt;br/&gt;&lt;img align="absmiddle" height="129px" width="427px" file="ed10310.JPG" alt="ed10310.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt in which an aromatic ring having a sulfo group bonded thereto and another aromatic ring structure containing a bulky substituent group are linked via a sulfonamide bond generates an aromatic sulfonic acid with adequate acidity and controlled diffusion. A chemically amplified positive resist composition comprising the onium salt has a high resolution and forms a pattern of rectangular profile with reduced LER.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1775" publication-number="202632467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145325</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其工作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G06F1/16</main-classification>
        <further-classification edition="200601120260427B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠本直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUMOTO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉住健輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZUMI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個實施方式提供一種可攜性高的折疊式顯示裝置。該顯示裝置包括具有撓性的顯示面板且能夠被折疊成較小。該顯示裝置具有三折機構，可以形成顯示裝置的第一面以彼此相對的方式被折疊的區域以及與第一面相反的第二面以彼此相對的方式被折疊的區域。因此，即使是縱橫比較大的顯示面板，也可以藉由在短軸方向上設置折線來將其折疊成較小，由此可以提高可攜性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101a:區域</p>
        <p type="p">101b:區域</p>
        <p type="p">101c:區域</p>
        <p type="p">102a:外殼</p>
        <p type="p">102b:外殼</p>
        <p type="p">102c:外殼</p>
        <p type="p">103a:鉸鏈</p>
        <p type="p">103b:鉸鏈</p>
        <p type="p">104a:曲面</p>
        <p type="p">104b:曲面</p>
        <p type="p">R1:半徑</p>
        <p type="p">R2:半徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1776" publication-number="202632375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微機電反射鏡陣列模組</chinese-title>
        <english-title>MEMS MIRROR ARRAY MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">G02B26/08</main-classification>
        <further-classification edition="200601120260429B">G03F7/20</further-classification>
        <further-classification edition="202101120260429B">G02B7/182</further-classification>
        <further-classification edition="200601120260429B">B81B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿速姆　瑪西爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSUM, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胥斯　麥紐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REUS, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托貝爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROBEL, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　安德烈亞斯-約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIMM, ANDREAS-JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於半導體技術設備的微機電反射鏡陣列模組（100）。&lt;br/&gt;  微機電反射鏡陣列模組（100）包括至少一個微機電微鏡單元（200），微機電微鏡單元（200）具有一微機電反射鏡陣列結構（210）和一細長介面元件（250），微機電反射鏡陣列結構（210）具有兩個或更多的微鏡（211），該微機電反射鏡陣列結構（210）從介面元件（250）外側橫向地突出，且該微機電反射鏡陣列結構（210）也包括一上位組合件（300），該上位組合件（300）具有至少一個用於微機電微鏡單元（200）的介面元件（250）的至少一個插槽（350），其中微機電微鏡單元（200）固定在上位組合件（300）的一插槽（350）中，使得微機電微鏡單元（200）的微機電反射鏡陣列結構（210）抵靠在上位組合件（300）上。在介面元件（250）和插槽（350）之間存在的一間隙（400）中引入一熱導率大於&lt;img align="absmiddle" height="32px" width="134px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;的一氣體環境，其中該微機電反射鏡陣列結構（210）相對該上位組合件（300）密封，使得引入該間隙（400）中的該氣體環境不會到達該些微鏡（211）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a MEMS mirror array module (100) for use in apparatuses for semiconductor technology.&lt;br/&gt; The MEMS mirror array module (100) comprises at least one MEMS micromirror unit (200) having a MEMS mirror array structure (210) having two or more micromirrors (211) and an elongated interface element (250), beyond which the MEMS mirror array structure (210) protrudes laterally, and also comprising a superordinate assembly (300) having at least one receptacle (350) for the interface element (250) of the MEMS micromirror unit (200), wherein the MEMS micromirror unit (200) is secured in a receptacle (350) of the superordinate assembly (300) in such a way that the MEMS mirror array structure (210) of the MEMS micromirror unit (200) bears against the superordinate assembly (300). A gas atmosphere having a thermal conductivity of more than &lt;img align="absmiddle" height="26px" width="136px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; is introduced in a gap (400) existing between interface element (250) and receptacle (350), wherein the MEMS mirror array structure (210) is sealed vis-à-vis the superordinate assembly (300) in such a way that gas atmosphere introduced into the gap (400) does not reach the micromirrors (211).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微機電反射鏡陣列模組</p>
        <p type="p">200:微機電微鏡單元</p>
        <p type="p">210:微機電反射鏡陣列結構</p>
        <p type="p">211:微鏡</p>
        <p type="p">250:介面元件</p>
        <p type="p">300:上位組合件</p>
        <p type="p">350:插槽</p>
        <p type="p">400:間隙</p>
        <p type="p">410:密封件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1777" publication-number="202632696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器陣列結構</chinese-title>
        <english-title>CAPACITOR ARRAY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01G4/30</main-classification>
        <further-classification edition="200601120260504B">H01G4/38</further-classification>
        <further-classification edition="202501120260504B">H10D1/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＡＥＳ　全球公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AES GLOBAL HOLDINGS PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特爾　威廉　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTEL, WILLIAM JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭森　威廉斯　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUNSON-WILLIAMS, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅恩　瑪麗　莫莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHN, MARIE MORLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電容器陣列結構，其包括兩個或更多個電容器，該兩個或更多個電容器中之各者包括藉由介電質分離的第一電極及第二電極，其中這些第一電極中之各者及這些第二電極中之各者具有第一端部及第二端部。第一導體電耦接至該兩個或更多個電容器之這些第一電極，其中該第一導體為平面的。第二導體電耦接至該兩個或更多個電容器之這些第二電極，其中該第二導體為平面的，且其中該第一導體及該第二導體為平行的。軸線在該第一導體與該第二導體之間延伸，其中這些第一電極之這些第一端部及這些第二電極之這些第一端部與該軸線等距。揭示了其他結構及方法。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor array structure includes two or more capacitors, each of the two or more capacitors including a first electrode and a second electrode separated by a dielectric, wherein each of the first electrodes and each of the second electrodes have a first end and a second end. A first conductor is electrically coupled to the first electrodes of the two or more capacitors, wherein the first conductor is planar. A second conductor is electrically coupled to the second electrodes of the two or more capacitors, wherein the second conductor is planar, and wherein the first conductor and the second conductor are parallel. An axis extends between the first conductor and the second conductor, wherein the first ends of the first electrodes and the first ends of the second electrodes are equidistant from the axis. Other structures and methods are disclosed.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容器陣列結構</p>
        <p type="p">102:第一導體</p>
        <p type="p">104:第二導體</p>
        <p type="p">110:第一指狀件</p>
        <p type="p">110A:第一指狀件</p>
        <p type="p">110B:第三指狀件</p>
        <p type="p">112:軸線</p>
        <p type="p">114:第二指狀件</p>
        <p type="p">114A:第二指狀件</p>
        <p type="p">114B:第四指狀件</p>
        <p type="p">118:電容器</p>
        <p type="p">118A:第一電容器</p>
        <p type="p">118B:第二電容器</p>
        <p type="p">140:電路系統</p>
        <p type="p">142:電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1778" publication-number="202632717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子顯微法之半導體帶電粒子偵測器</chinese-title>
        <english-title>SEMICONDUCTOR CHARGED PARTICLE DETECTOR FOR MICROSCOPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/244</main-classification>
        <further-classification edition="202501120260422B">H10D8/50</further-classification>
        <further-classification edition="200601120260422B">G01T1/24</further-classification>
        <further-classification edition="201801120260422B">G01N23/2206</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　勇新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YONGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　仲華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, ZHONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴瑞霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, RUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金井建一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種偵測器，其可具備一感測元件陣列。該偵測器可包括：包括該陣列之一半導體基板，及經組態以計數入射於該偵測器上之帶電粒子的一數目之一電路。該偵測器之該電路可經組態以處理來自該複數個感測元件之輸出，並回應於該陣列中之一感測元件上的一帶電粒子到達事件而遞增一計數器。可使用各種計數模式。計數可係基於能量範圍。可計數處於某一能量範圍之帶電粒子的數目，且當在一感測元件中遇到溢流時可設定一溢流旗標。該電路可經組態以判定每一感測元件處發生之各別帶電粒子到達事件的一時戳。可基於用於實現帶電粒子計數之準則來判定該感測元件之大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detector may be provided with an array of sensing elements. The detector may include a semiconductor substrate including the array, and a circuit configured to count a number of charged particles incident on the detector. The circuit of the detector may be configured to process outputs from the plurality of sensing elements and increment a counter in response to a charged particle arrival event on a sensing element of the array. Various counting modes may be used. Counting may be based on energy ranges. Numbers of charged particles may be counted at a certain energy range and an overflow flag may be set when overflow is encountered in a sensing element. The circuit may be configured to determine a time stamp of respective charged particle arrival events occurring at each sensing element. Size of the sensing element may be determined based on criteria for enabling charged particle counting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:偵測器</p>
        <p type="p">350:邊界線</p>
        <p type="p">360:第二邊界線</p>
        <p type="p">500:帶電粒子束光點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1779" publication-number="202632537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>稀疏記憶體內計算張量核心</chinese-title>
        <english-title>SPARSE COMPUTE-IN-MEMORY TENSOR CORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">G06N3/0495</main-classification>
        <further-classification edition="202301120260504B">G06N3/04</further-classification>
        <further-classification edition="200601120260504B">G06F17/16</further-classification>
        <further-classification edition="201801120260504B">G06F9/44</further-classification>
        <further-classification edition="200601120260504B">G11C11/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商墨子國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昶旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHANGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體內計算(CIM)張量核心包含一記憶體、一控制電路，及組織成一2維(2D)網狀網路之複數個處理單元(PU)。各PU包含經組態用於低精度(LP)記憶體內計算(CIM)操作之一第一電路。另外，除該LP電路以外，該2D網狀網路之一中心區內之一PU子集進一步包含經組態用於高精度(HP) CIM操作之一第二電路。此架構實現相同硬體單元內之整合式儲存及計算，從而減少資料移動並改良處理效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compute-in-memory (CIM) tensor core includes a memory, a control circuit, and a plurality of processing units (PUs) organized in a 2-dimensional (2D) mesh network. Each PU includes a first circuit configured for low-precision (LP) compute-in-memory (CIM) operations. Additionally, a subset of PUs within a central region of the 2D mesh network further includes a second circuit configured for high-precision (HP) CIM operations, in addition to the LP circuit. This architecture enables integrated storage and computation within the same hardware units, reducing data movement and improving processing efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:蝶形網路</p>
        <p type="p">310:輸入張量</p>
        <p type="p">325:中心區</p>
        <p type="p">330:第一電路</p>
        <p type="p">340:第二電路</p>
        <p type="p">355:中心加法器電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1780" publication-number="202633111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有複合半導體襯裡之奈米片結構</chinese-title>
        <english-title>NANOSHEET STRUCTURE WITH COMPOSITE SEMICONDUCTOR LINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260420B">H10D30/40</main-classification>
        <further-classification edition="202501120260420B">H10D62/10</further-classification>
        <further-classification edition="202501120260420B">H10D64/20</further-classification>
        <further-classification edition="202601120260420B">H10W10/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧貝特　尼可拉斯　簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOUBET, NICOLAS JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達菲　柯提斯　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DURFEE, CURTIS SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月省吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種微電子結構，其包括一奈米片電晶體，該奈米片電晶體包括複數個通道層、一閘極及源極/汲極。一內部間隔件襯裡鄰近於該閘極而定位，其中該內部間隔件襯裡具有如垂直於一閘極方向所觀察的一C形輪廓。一內部間隔件鄰近於該內部間隔件襯裡而定位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microelectronic structure that includes a nanosheet transistor that includes a plurality of channel layers, a gate, and source/drain. An inner spacer liner is located adjacent to the gate, where the inner spacer liner has a C-shape profile as viewed perpendicular to a gate direction. An inner spacer is located adjacent to the inner spacer liner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:基板</p>
        <p type="p">115:通道層</p>
        <p type="p">130:閘極間隔件</p>
        <p type="p">140:內部間隔件襯裡</p>
        <p type="p">145:內部間隔件</p>
        <p type="p">150:源極/汲極</p>
        <p type="p">155:層間介電層</p>
        <p type="p">160:閘極</p>
        <p type="p">165:閘極罩蓋</p>
        <p type="p">170:源極/汲極接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1781" publication-number="202632097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含聚羥基烷酸酯纖維之布帛、及其製法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">D01F6/84</main-classification>
        <further-classification edition="202101120260504B">D03D15/283</further-classification>
        <further-classification edition="200601120260504B">D06P5/20</further-classification>
        <further-classification edition="200601120260504B">D06B3/10</further-classification>
        <further-classification edition="200601120260504B">D06C7/00</further-classification>
        <further-classification edition="202201120260504B">C12P7/625</further-classification>
        <further-classification edition="200601320260504B">C12R1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口彩英子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原雄一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原納弘大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARANO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種布帛，其包含具有海洋生物降解性之聚羥基烷酸酯(PHA)纖維，並且於作為衣服、產業材料之實用上具有充分之強度，進而染色性及染色時之尺寸穩定性優異，適於染色。本發明係關於一種布帛、以及該布帛之染色方法、及製造方法，該布帛係含有包含3-羥基丁酸酯作為單體單元之聚羥基烷酸酯纖維者，該聚羥基烷酸酯之β結構與α結構之X射線繞射強度比Iβ/Iα為0以上0.6以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1782" publication-number="202632098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含聚羥基烷酸酯纖維之染色布帛、及該布帛之染色方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">D01F6/84</main-classification>
        <further-classification edition="202101120260504B">D03D15/283</further-classification>
        <further-classification edition="200601120260504B">D06B3/10</further-classification>
        <further-classification edition="200601120260504B">D06C7/00</further-classification>
        <further-classification edition="200601120260504B">D06P5/02</further-classification>
        <further-classification edition="200601120260504B">D06P5/20</further-classification>
        <further-classification edition="202201120260504B">C12P7/625</further-classification>
        <further-classification edition="200601320260504B">C12R1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口彩英子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原雄一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原納弘大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARANO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種布帛、及用於獲得該布帛之染色方法，該布帛包含具有海洋生物降解性之PHA纖維，並且於作為衣服、產業材料之實用上具有充分之強度，進而染色堅牢度優異。本發明係關於一種染色布帛、以及染色方法，該染色布帛含有包含3-羥基丁酸酯作為單體單元之結晶度為50%以上之聚羥基烷酸酯纖維，且K/S值為2以上，該染色方法係含有包含3-羥基丁酸酯作為單體單元之結晶度為50%以上之聚羥基烷酸酯纖維的布帛之染色方法，且染色時之染色液之溫度為86℃以上120℃以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1783" publication-number="202633346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造系統、基板待機模組及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原正道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, MASAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種抑制佔地面積擴大且可在基板的搬送路徑執行處理的半導體製造系統。  &lt;br/&gt;半導體製造系統，係包含：搬送模組，係搬送基板；以及基板待機模組，係與搬送模組連接且使由該搬送模組搬送來的基板暫時待機。基板待機模組係具備：容器本體，係具有收容基板的內部空間；氣體排氣部，係能夠吸引內部空間的氣體以形成真空環境氣氛；可動分隔構件，係在內部空間可沿鉛直方向升降地設置，透過與容器本體的壁接觸能夠將該內部空間上下隔開；以及基板處理部，係對被收容在由可動分隔構件隔開的二個空間中的一個空間的基板施予基板處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:搬送容器</p>
        <p type="p">40:搬送容器</p>
        <p type="p">50:容器本體</p>
        <p type="p">50o1,50o2:開口</p>
        <p type="p">50s:內部空間</p>
        <p type="p">501:上部側壁</p>
        <p type="p">502:下部側壁</p>
        <p type="p">52:閘閥</p>
        <p type="p">521:閥體</p>
        <p type="p">522:驅動機構</p>
        <p type="p">523:密封構件</p>
        <p type="p">53:閘閥</p>
        <p type="p">531:閥體</p>
        <p type="p">532:驅動機構</p>
        <p type="p">533:密封構件</p>
        <p type="p">60:暫時待機部</p>
        <p type="p">61:可動分隔構件</p>
        <p type="p">61a:流道</p>
        <p type="p">62:升降機構</p>
        <p type="p">621:可動桿</p>
        <p type="p">622:波紋管</p>
        <p type="p">63:密封構件</p>
        <p type="p">64:上部升降機構</p>
        <p type="p">641:可動桿</p>
        <p type="p">642:支撐桿</p>
        <p type="p">65:上部氣體排氣部</p>
        <p type="p">66:上部氣體供應部</p>
        <p type="p">67:冷卻模組</p>
        <p type="p">671:冷卻器</p>
        <p type="p">672:循環路徑</p>
        <p type="p">70:基板處理部</p>
        <p type="p">71:台座</p>
        <p type="p">711:加熱器</p>
        <p type="p">72:下部升降機構</p>
        <p type="p">721:頂銷</p>
        <p type="p">722:波紋管</p>
        <p type="p">73:加熱控制模組</p>
        <p type="p">75:下部氣體排氣部</p>
        <p type="p">76:下部氣體供應部</p>
        <p type="p">LM:大氣搬送模組</p>
        <p type="p">LLM:負載鎖定模組</p>
        <p type="p">TM:真空搬送模組</p>
        <p type="p">TM1:第1真空搬送模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1784" publication-number="202631802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、成形體、及改質劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08G63/668</main-classification>
        <further-classification edition="200601120260420B">C08G63/16</further-classification>
        <further-classification edition="200601120260420B">C08L67/02</further-classification>
        <further-classification edition="200601120260420B">C08K5/053</further-classification>
        <further-classification edition="200601120260420B">C08F220/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保明香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉士大宗紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIO, MUNEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有在低溫的良好耐衝擊性、耐滲出性及生物分解性之樹脂組成物、成形體、以及聚丁二酸丁二酯系聚合物用的改質劑。前述樹脂組成物係含有聚酯系聚合物(A)與聚丁二酸丁二酯系聚合物(B)之樹脂組成物，前述聚酯系聚合物(A)包含多元醇(a1)單元與多元羧酸(a2)單元，前述多元醇(a1)包含選自由碳數3～12的直鏈狀脂肪族二醇及碳數3～12的分支狀脂肪族二醇組成之群組的至少1種，前述多元羧酸(a2)包含碳數4～16的直鏈狀脂肪族二羧酸及碳數4～16的分支狀脂肪族二羧酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1785" publication-number="202632972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145492</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有雙層保護殼之MEMS麥克風</chinese-title>
        <english-title>MEMS MICROPHONE MODULE WITH A DOUBLE CASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H04R1/02</main-classification>
        <further-classification edition="200601120260504B">H04R5/027</further-classification>
        <further-classification edition="200601120260504B">B81B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜秉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYEONG KIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池七永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, CHIL YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭斗燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DOO CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種具有雙外殼的MEMS麥克風模組，更特別地，涉及一種具備雙重保護結構的MEMS麥克風模組，其中增設一第二外殼以保護一第一外殼，該第一外殼形成一內部空間，該空間包含設置於一基底基板上的一換能器與一半導體部，藉此防止一裝置組件內部噪音侵入及外部壓力造成的變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a MEMS microphone module with a double case, and more particularly, to a MEMS microphone module having a double protective structure in which an additional second case is provided to protect a first case forming an inner space that includes a transducer and a semiconductor part disposed on a base substrate, thereby preventing noise intrusion from inside a device set and deformation caused by external pressure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底基板</p>
        <p type="p">101:第一基板</p>
        <p type="p">102:第二基板</p>
        <p type="p">112:聲學入口</p>
        <p type="p">120:換能器</p>
        <p type="p">121:振膜</p>
        <p type="p">122:背板</p>
        <p type="p">130:半導體部</p>
        <p type="p">141:第一連接線</p>
        <p type="p">143:第二連接線</p>
        <p type="p">150:第一外殼</p>
        <p type="p">151:第一上表面部</p>
        <p type="p">152:第一側表面部</p>
        <p type="p">160:第二外殼</p>
        <p type="p">161:第二上表面部</p>
        <p type="p">162:第二側表面部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1786" publication-number="202631727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性元件、阻劑圖案的形成方法及印刷線路板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F2/50</main-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/027</further-classification>
        <further-classification edition="200601120260102B">G03F7/031</further-classification>
        <further-classification edition="200601120260102B">G03F7/033</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/09</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">H05K3/06</further-classification>
        <further-classification edition="200601120260102B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸田夏木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎梨世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, RISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月彩音</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, AYANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性元件，其具備支撐膜及感光性樹脂組成物層，前述感光性樹脂組成物層的厚度為10 μm以下，前述感光性樹脂組成物層包含感光性樹脂組成物，該感光性樹脂組成物包含黏合劑聚合物(A)、光聚合性化合物(B)及光聚合起始劑(C)，前述光聚合起始劑(C)包含六芳基聯咪唑化合物(C1)，該六芳基聯咪唑化合物(C1)在分子結構中具有碳數3以上的烷氧基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1787" publication-number="202631456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>瓶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B65D1/02</main-classification>
        <further-classification edition="200601120260430B">B65D1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥工場股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由川博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之瓶包含：本體部，其具有有底筒形狀；及口部，其與本體部之上端相連；且，本體部具有：肩部，其位於口部之下方；胴部，其位於肩部之下方；收腰部，其位於胴部之下方；腳部，其位於收腰部之下方；及底面部，其與腳部相連；且，腳部之外側面具有4個第1主平面部、及4個第1曲面部；於腳部之外側面，於本體部之周向上交替配置第1曲面部與第1主平面部；於4個第1主平面部之各者設置沿著瓶軸向自底面部朝向口部延伸之凹部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:瓶</p>
        <p type="p">2:本體部</p>
        <p type="p">2a:上端</p>
        <p type="p">3:口部</p>
        <p type="p">3a:螺紋部</p>
        <p type="p">11:肩部</p>
        <p type="p">12:胴部</p>
        <p type="p">13:收腰部</p>
        <p type="p">14:腳部</p>
        <p type="p">14a:下端部</p>
        <p type="p">21:外側面</p>
        <p type="p">22:主平面部(第2主平面部)</p>
        <p type="p">22a:上側區域</p>
        <p type="p">22b:中央區域</p>
        <p type="p">22c:下側區域</p>
        <p type="p">23:曲面部(第2曲面部)</p>
        <p type="p">23a:上側區域</p>
        <p type="p">23b:中央區域</p>
        <p type="p">23c:下側區域</p>
        <p type="p">31:外側面</p>
        <p type="p">32:主平面部(第3主平面部)</p>
        <p type="p">33:曲面部(第3曲面部)</p>
        <p type="p">41:外側面</p>
        <p type="p">42:主平面部(第1主平面部)</p>
        <p type="p">42a:上側區域</p>
        <p type="p">42b:中央區域</p>
        <p type="p">42c:下側區域</p>
        <p type="p">43:曲面部(第1曲面部)</p>
        <p type="p">43a:上側區域</p>
        <p type="p">43b:中央區域</p>
        <p type="p">43c:下側區域</p>
        <p type="p">44:凹部</p>
        <p type="p">44a:第1斜面部</p>
        <p type="p">44b:第2斜面部</p>
        <p type="p">44c:底部</p>
        <p type="p">G1:槽</p>
        <p type="p">G2:槽</p>
        <p type="p">G3:槽</p>
        <p type="p">G4:槽</p>
        <p type="p">G5:槽</p>
        <p type="p">G5a:深槽</p>
        <p type="p">G5b:淺槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1788" publication-number="202632416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型光罩基底、反射型光罩基底之製造方法、反射型光罩、反射型光罩之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260427B">G03F1/24</main-classification>
        <further-classification edition="200601120260427B">C23C14/34</further-classification>
        <further-classification edition="200601120260427B">C23C14/14</further-classification>
        <further-classification edition="202601120260427B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西英太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, EITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤木大二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAGI, DAIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種吸收體膜之蝕刻速率相對於保護膜之蝕刻速率之比較大的反射型光罩基底。  &lt;br/&gt;本發明之反射型光罩基底依序具有基板、反射EUV光之多層反射膜、保護膜、及吸收體膜，上述吸收體膜包含鉑，上述吸收體膜之氧原子之含量相對於上述吸收體膜之全部原子未達20原子%，上述保護膜之上述吸收體膜側之最表層中之銠之含量相對於上述最表層之全部原子為50原子%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:反射型光罩基底</p>
        <p type="p">12:基板</p>
        <p type="p">14:多層反射膜</p>
        <p type="p">16:保護膜</p>
        <p type="p">18:吸收體膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1789" publication-number="202631737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻下層膜形成用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F120/32</main-classification>
        <further-classification edition="200601120260504B">C08F220/32</further-classification>
        <further-classification edition="200601120260504B">C08F8/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/11</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="202601120260504B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤祐希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方裕斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種改善敏感度的同時並可形成良好的光阻圖案之光阻下層膜形成用組成物等。  &lt;br/&gt;本發明之光阻下層膜形成用組成物，係含有：聚合物（A）及溶劑；  &lt;br/&gt;該聚合物（A）係一價有機基（B1）經由胺基甲酸酯鍵與聚合物（C）鍵結；該胺基甲酸酯鍵，係於側鏈具有選自碳-碳雙鍵、碳-碳三鍵、碳-氮雙鍵、及碳-氮三鍵所成群中一種或兩種以上之聚合性多重鍵且具有羥基之前述聚合物（C）中之羥基、與具有異氰酸酯基及前述一價有機基（B1）之化合物（B）中之異氰酸酯基進行反應而獲得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1790" publication-number="202632980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145549</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於車載網路無線組態的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR WIRELESS CONFIGURATION OF IN-VEHICLE NETWORKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">H04W4/44</main-classification>
        <further-classification edition="201801120260504B">H04W4/40</further-classification>
        <further-classification edition="202301120260504B">H04W72/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦西拉夫斯基　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASSILOVSKI, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古帕　尼沙安特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, NISHANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於支援增強型車載網路(IVN)組態操作的無線通訊的系統及方法。在一第一態樣中，一種車輛包括：具有複數個感測器及複數個電子控制單元(ECU)的一IVN系統的複數個IVN；至少一處理器；及一記憶體，其耦接至該至少一處理器。該至少一個處理器經組態以使該車輛：獲得對應於一特定IVN系統組態的IVN組態資訊；基於該IVN組態資訊來組態該複數個感測器中之一或多個感測器、該複數個ECU中之一或多個ECU、或二者以用於單播及群播無線通訊；及使用該特定IVN系統組態而經由該一或多個感測器或該一或多個ECU來無線傳輸。亦主張及描述其他態樣及特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides systems and methods for wireless communication that support enhanced in-vehicle network (IVN) configuration operations. In a first aspect, a vehicle includes a plurality of IVNs of an IVN system with a plurality of sensors and a plurality of electronic control units (ECUs), at least one processor, and a memory coupled to the at least one processor. The at least one processor is configured to cause the vehicle to: obtain IVN configuration information corresponding to a particular IVN system configuration; configure one or more sensors of the plurality of sensors, one or more ECUs of the plurality of ECUs, or both, for unicast and groupcast wireless communications based on the IVN configuration information; and wirelessly transmit via the one or more sensors or the one or more ECUs using the particular IVN system configuration. Other aspects and features are also claimed and described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">308,312,316,320:IVN</p>
        <p type="p">322:埠</p>
        <p type="p">326:連接</p>
        <p type="p">332:主ECU</p>
        <p type="p">400:圖</p>
        <p type="p">402,404,406,408,410,412,414,416,418,420,422:無線IVN</p>
        <p type="p">432:主ECU</p>
        <p type="p">S1:第一感測器</p>
        <p type="p">S2:第二感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1791" publication-number="202633437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145551</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於互連之阻障及襯墊</chinese-title>
        <english-title>BARRIER AND LINER FOR INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260425B">H10W20/44</main-classification>
        <further-classification edition="200601120260425B">C23C16/06</further-classification>
        <further-classification edition="200601120260425B">C25D7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瞿舸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QU, GE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琚　正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金龍珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡雪菲　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHEFI, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文實施例提供一種形成互連結構的方法，包括：在基板表面中形成的特徵的一或多個表面上方沉積阻障層，其中阻障層包括錳，且特徵的一或多個表面包括一或多個側壁表面和底表面；在阻障層上方沉積襯墊層，其中襯墊層包括釕；以及用互連材料填充特徵，其中填充特徵包括在沉積的襯墊層上沉積互連材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments herein provide a method for forming an interconnect structure, comprising: depositing a barrier layer over one or more surfaces of a feature formed in a surface of a substrate, wherein the barrier layer comprises manganese, and the one or more surfaces of the feature comprise one or more sidewall surfaces and a bottom surface; depositing a liner layer over the barrier layer, wherein the liner layer comprises ruthenium; and filling the feature with an interconnect material, wherein filling the feature comprises depositing the interconnect material on the deposited liner layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:互連結構</p>
        <p type="p">102:第一部分</p>
        <p type="p">104:第二部分</p>
        <p type="p">106:介電層</p>
        <p type="p">108:阻障層</p>
        <p type="p">110:襯墊層</p>
        <p type="p">114:互連層</p>
        <p type="p">116:介電層</p>
        <p type="p">118:阻障層</p>
        <p type="p">120:襯墊層</p>
        <p type="p">124:互連層</p>
        <p type="p">128:層</p>
        <p type="p">138:層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1792" publication-number="202631527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃股線及玻璃紗的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03B37/02</main-classification>
        <further-classification edition="200601120260504B">C03B37/07</further-classification>
        <further-classification edition="200601120260504B">C03B37/12</further-classification>
        <further-classification edition="200601120260504B">C03B5/16</further-classification>
        <further-classification edition="200601120260504B">C03B5/235</further-classification>
        <further-classification edition="200601120260504B">C03C3/06</further-classification>
        <further-classification edition="200601120260504B">D02G3/18</further-classification>
        <further-classification edition="200601120260504B">B65H54/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦中宗聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URANAKA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋勇太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口雄亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村龍之介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, RYUNOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種在延伸為玻璃纖維時較少產生斷紗之玻璃股線的製造方法，以及在撚紗時較少產生斷紗、起毛，且長條玻璃紗在捲繞開始部與捲繞結束部品質偏差較小之玻璃紗的製造方法。  &lt;br/&gt;[解決手段]一種玻璃股線的製造方法，其特徵在於包含：  &lt;br/&gt;(1) 延伸步驟，將包含玻璃組成物之原紗在熔融溫度1,500～3,500℃，且張力為0.1～1.0 cN/根之條件下延伸為玻璃纖維，該玻璃組成物含90質量%以上之SiO&lt;sub&gt;2&lt;/sub&gt;組成量；及  &lt;br/&gt;(2) 束扎步驟，將前述延伸步驟中所得之玻璃纖維以30～400根扎成束而製造玻璃股線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1793" publication-number="202632513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢索增強生成的文件解析的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR DOCUMENT PARSING FOR RETRIEVAL-AUGMENTED GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">G06F16/332</main-classification>
        <further-classification edition="201901120260102B">G06F16/2455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩茲　雷根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, REAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於檢索增強生成的文件解析的系統、裝置、製品和方法。範例非暫時性機器可讀取儲存媒體包括指令，以使可編程電路至少執行：擷取待解析文件的特徵；基於該特徵產生用於自然語言處理機器學習模型引擎的提示，該提示用以提供指示給該自然語言處理機器學習模型引擎，以基於文件上下文將該文件解析為多個片段；基於該提示確定該自然語言處理機器學習模型引擎的輸出，該輸出指示將該文件分割為該多個片段；以及使該多個片段的多個嵌入向量儲存在向量資料庫中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, apparatus, articles of manufacture, and methods are disclosed for document parsing for retrieval-augmented generation. An example non-transitory machine readable storage medium comprises instructions to cause programmable circuitry to at least: extract a characteristic of a document to be parsed; generate a prompt for a natural language processing machine learning model engine based on the characteristic, the prompt to provide an instruction for the natural language processing machine learning model engine to parse the document into a plurality of segments based on document context; determine an output of the natural language processing machine learning model engine based on the prompt, the output indicating a segmentation of the document into the plurality of segments; and cause a plurality of embedding vectors for the plurality of segments to be stored in a vector database.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">102:文件來源</p>
        <p type="p">104:網路</p>
        <p type="p">106:文件解析器電路</p>
        <p type="p">108:增強資料儲存庫</p>
        <p type="p">110:查詢回應電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1794" publication-number="202632510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢索增強生成參數之自動調優的系統、方法及設備</chinese-title>
        <english-title>SYSTEMS, METHODS, AND APPARATUS FOR AUTOTUNING OF RETRIEVAL AUGMENTED GENERATION PARAMETERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260102B">G06F16/245</main-classification>
        <further-classification edition="201901120260102B">G06F16/29</further-classification>
        <further-classification edition="201901120260102B">G06N20/00</further-classification>
        <further-classification edition="202001120260102B">G06F40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯思凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩茲　雷根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, REAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德亞麥德維爾　艾蒙斯特阿法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OULD-AHMED-VALL, ELMOUSTAPHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於檢索增強生成參數之自動調優的系統、設備以及方法。執行該方法的多個例示的指令，包含多個指令以：使用多個檢索增強生成(RAG)參數來向量化資料集，該多個RAG參數係基於該資料集的領域而識別的，其中，該多個RAG參數控制資料的攝取或資料的檢索中的至少一者；使用該多個RAG參數，執行機器學習模型；評估該機器學習模型之輸出的品質；在確定該品質未達到品質閾值後，更新該多個RAG參數，並使用更新後之該多個RAG參數進行該機器學習模型的重新執行；以及確定該品質達到該品質閾值後，與該資料集的該領域相關聯地儲存該多個RAG參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, apparatus, and methods for autotuning of retrieval augmented generation parameters are disclosed. Example instructions to perform the same include instructions to vectorize a dataset using retrieval augmented generation (RAG) parameters, the RAG parameters identified based on a domain of the dataset, wherein the RAG parameters control at least one of ingestion of data or retrieval of data, execute a machine learning model using the RAG parameters, evaluate a quality of an output of the machine learning model, after determination that the quality does not meet a quality threshold, update the RAG parameters and cause re-execution of the machine learning model using the updated RAG parameters, and after determination that the quality meets the quality threshold, store the RAG parameters in association with the domain of the dataset.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">105:領域特定資料集</p>
        <p type="p">110:RAG向量資料庫</p>
        <p type="p">115:RAG管線</p>
        <p type="p">120:大型語言模型電路</p>
        <p type="p">125:RAG配置參數資料儲存器</p>
        <p type="p">130:RAG自動調優器電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1795" publication-number="202632543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145564</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於端到端的基於企業的生成式人工智慧（ＧｅｎＡＩ）的方法和設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR END-TO-END ENTERPRISE-BASED GENERATIVE ARTIFICIAL INTELLIGENCE (GENAI)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06N3/08</main-classification>
        <further-classification edition="202301120260102B">G06N3/098</further-classification>
        <further-classification edition="200601120260102B">G06F9/50</further-classification>
        <further-classification edition="201901120260102B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩茲　雷根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, REAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德亞麥德維爾　艾蒙斯特阿法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OULD-AHMED-VALL, ELMOUSTAPHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種示例設備包括介面電路；機器可讀指令；和由機器可讀指令編程的至少一個處理器電路，用以存取在使用者裝置處接收的提示，該提示與文件相關，判定與提示相關的運算需求，當運算需求超過臨界值時，將文件傳輸到伺服器，以及從伺服器接收輸出，該輸出對應於位於該伺服器上的檢索增強生成(RAG)管道輸出的大語言模型(LLM)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example apparatus includes interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to access a prompt received at a user device, the prompt associated with a document, determine a compute requirement associated with the prompt, transmit the document to a server when the compute requirement exceeds a threshold, and receive an output from the server, the output corresponding to a large language model (LLM) output from a retrieval augmented generation (RAG) pipeline located on the server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方塊圖</p>
        <p type="p">205:使用者裝置</p>
        <p type="p">210:伺服器</p>
        <p type="p">215:伺服器通訊器電路</p>
        <p type="p">220:本地RAG啟動器電路</p>
        <p type="p">225:LLM/LMM查詢</p>
        <p type="p">230:使用者修正的Q/A對上傳</p>
        <p type="p">235:微調模型下載</p>
        <p type="p">240:剖析文件檢索</p>
        <p type="p">245:嵌入文件檢索</p>
        <p type="p">250:微調模型</p>
        <p type="p">255:複雜剖析</p>
        <p type="p">260:嵌入模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1796" publication-number="202632512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於個人化生成式人工智慧（ＧｅｎＡＩ）助理的方法與設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR A PERSONALIZED GENERATIVE ARTIFICIAL INTELLIGENCE (GENAI) ASSISTANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">G06F16/33</main-classification>
        <further-classification edition="201901120260102B">G06F16/245</further-classification>
        <further-classification edition="202001120260102B">G06F40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩茲　雷根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ, REAGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德亞麥德維爾　艾蒙斯特阿法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OULD-AHMED-VALL, ELMOUSTAPHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">例示的設備包含：介面電路；多個機器可讀取指令；以及至少一處理器電路，被該多個機器可讀取指令程式化以：從自然語言處理機器學習模型引擎獲得第一輸出，該第一輸出係使用檢索增強生成(RAG)所生成，以響應使用者查詢；獲得與該使用者查詢相關聯之第一反饋答案輸入；生成該第一反饋答案輸入與該使用者查詢之嵌入；使該嵌入儲存在向量資料庫中，以提供反饋給該RAG；以及從該自然語言處理機器學習模型引擎獲得第二輸出，該第二輸出響應於該使用者查詢所生成，該第二輸出包含該第一反饋答案輸入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example apparatus includes interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to obtain a first output from a natural language processing machine learning model engine, the first output generated with retrieval augmented generation (RAG) to respond to a user query, obtain a first feedback answer input associated with the user query, generate an embedding of the first feedback answer input and the user query, cause the embedding to be stored in a vector database to provide feedback for the RAG, and obtain a second output from the natural language processing machine learning model engine, the second output generated in response to the user query, the second output to include the first feedback answer input.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方塊圖</p>
        <p type="p">102:檢索增強生成(RAG)電路</p>
        <p type="p">105:使用者反饋評估器電路</p>
        <p type="p">108:輸入類型1</p>
        <p type="p">110:輸入類型2</p>
        <p type="p">115:輸入類型N</p>
        <p type="p">125:嵌入生成器電路</p>
        <p type="p">128:文件資料儲存器</p>
        <p type="p">130:檢索器電路</p>
        <p type="p">140:排序器電路</p>
        <p type="p">145:大型語言模型(LLM)</p>
        <p type="p">150:使用者查詢</p>
        <p type="p">155:候選上下文</p>
        <p type="p">160:答案</p>
        <p type="p">165:使用者反饋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1797" publication-number="202632909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以對多通道波形信號進行寫碼之解碼器、編碼器、方法、資料串流</chinese-title>
        <english-title>DECODER, ENCODER, METHOD, DATA STREAM FOR CODING A MULTI-CHANNEL WAVEFORM SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H03M7/30</main-classification>
        <further-classification edition="201301120260417B">G10L19/008</further-classification>
        <further-classification edition="200601120260417B">G06F17/14</further-classification>
        <further-classification edition="201301120260417B">G10L19/022</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫姆瑞區　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELMRICH, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮恩特卡　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIENTKA, SOPHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克曲后弗　辛納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRCHHOFFER, HEINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈塞　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAASE, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫格　加布里埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEGE, GABRIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕雅夫　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFF, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案呈現一種用於使用基於區塊之預測自一資料串流寫碼一多通道波形信號或將該多通道波形信號寫碼至該資料串流中的設備及方法。該設備經組配以：自該資料串流解碼一共同性語法元素，該共同性語法元素指示對於該多通道波形信號之複數個通道，在由該設備支援之一預測模式集合當中，一個預測模式是否共同歸屬於該等複數個通道，若該共同性語法元素指示一個預測模式共同歸屬於該等複數個通道，則自該資料串流解碼一或多個預測模式語法元素之一集合，該一或多個預測模式語法元素指示該預測模式集合中之一選定預測模式，其中該選定預測模式為該一個預測模式，或將由針對該等複數個通道當中的一第一通道而解碼之一或多個預測模式語法元素之一集合所指示的一選定預測模式指定為該一個預測模式，或使用該預測模式集合當中的一預設預測模式作為該一個預測模式，以及使用該一個預測模式對該等複數個通道中之各者進行解碼，以及若該共同性語法元素未指示一個預測模式共同歸屬於該等複數個通道，則針對該等複數個通道中之各者，自該資料串流解碼一或多個預測模式語法元素之該集合，該一或多個預測模式語法元素指示該預測模式集合中用於該各別通道之一選定預測模式，以及使用用於該各別通道之該選定預測模式對該等複數個通道中之各者進行解碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus and method for coding a multi-channel waveform signal from or into a data stream using block-based prediction is presented. The apparatus is configured to decode from the data stream a commonality syntax element indicating for a plurality of channels of the multi-channel waveform signal, whether, among a set of prediction modes supported by the apparatus, one prediction mode is commonly attributed to the plurality of channels, if the commonality syntax element indicates that one prediction mode is commonly attributed to the plurality of channels, decode a set of one or more prediction mode syntax elements from the data stream which indicate a selected prediction mode out of the set of prediction modes, wherein the selected prediction mode is the one prediction mode, or appoint a selected prediction mode indicated by a set of one or more prediction mode syntax elements decoded for a first channel among the plurality of channels the one prediction mode, or use a default prediction mode among the set of prediction modes as the one prediction mode, and decode each of the plurality of channels using the one prediction mode, and, if the commonality syntax element does not indicate that one prediction mode is commonly attributed to the plurality of channels, decode, from the data stream, for each of the plurality of channels, the set of one or more prediction mode syntax elements, which indicate a selected prediction mode out of the set of prediction modes for the respective channel, and decode each of the plurality of channels using the selected prediction mode for the respective channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:設備，解碼器</p>
        <p type="p">13:共同性語法元素</p>
        <p type="p">14:多通道波形信號，數位波形資料，波形信號，多通道信號，信號，數位信號</p>
        <p type="p">16:資料串流，位元串流，串流</p>
        <p type="p">21a:第一通道，通道，參考符號，各別通道</p>
        <p type="p">21b,21c,21d,21e,21f:通道，參考符號</p>
        <p type="p">21g:通道</p>
        <p type="p">25:預測模式，共同預測模式</p>
        <p type="p">29:預測模式集合</p>
        <p type="p">31:一或多個預測模式語法元素之集合，一或多個預測模式語法元素之第一集合，預測模式語法元素</p>
        <p type="p">33:選定預測模式</p>
        <p type="p">35:預設預測模式</p>
        <p type="p">39a,39b,39c:預測模式</p>
        <p type="p">240a:通道群組，第一通道群組</p>
        <p type="p">240b:第二通道群組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1798" publication-number="202633313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片製造中的以製程感知、缺陷率為基礎的污染控制方策發展</chinese-title>
        <english-title>PROCESS AWARE, DEFECTIVITY BASED CONTAMINATION CONTROL RECIPE DEVELOPMENT IN CHIP MANUFACTURING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10P70/00</main-classification>
        <further-classification edition="200601120260417B">B08B9/08</further-classification>
        <further-classification edition="200601120260417B">B08B9/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化（德國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩拉斯瓦圖拉　賈格迪什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARASWATULA, JAGDISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CATHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於清潔物件，特別是用於在一半導體製造廠環境中傳送及/或儲存晶圓或倍縮光罩之容器，例如FOUP或倍縮光罩盒的方法，該方法包含下列步驟：特別是在如一容器內部的一封閉(微型)環境中，識別總污染中之複數關鍵污染物；在識別該等關鍵污染物後，以抑制該等複數關鍵污染物中之至少一者的觀點來選擇及/或最佳化一清潔製程，特別是直到該等關鍵污染物之該至少一者的一預定第一臨界值已到達為止；及在抑制該等複數關鍵污染物之該至少一者後，減少特別是包含AMC、VoC等之該總污染，特別是直到該總污染之一預定第二臨界值已到達為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for cleaning items, especially containers for transporting and/or storing wafers or reticles such as FOUPs or reticle pods, in a fab environment, comprising the steps of identification of a plurality of critical contaminants amongst the total contamination, especially in a closed (mini) environment such as the interior of a container, after identifying the critical contaminants, choosing and/or optimizing a cleaning process with a view to suppressing at least one of the plurality of critical contaminants, especially until a predetermined first threshold level of the at least one of the critical contaminants has been reached, and after supressing the at least one of the plurality of the critical contaminants, reducing the overall contamination, especially comprising AMCs, VoCs etc, especially until a predetermined second threshold level of the overall contamination has been reached.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200,210,220,230,240,250,260:步驟</p>
        <p type="p">OCP:總污染分布曲線</p>
        <p type="p">T1,T2:臨界值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1799" publication-number="202632915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻積體電路及包括射頻積體電路之電子裝置</chinese-title>
        <english-title>RFIC AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260504B">H04B1/40</main-classification>
        <further-classification edition="200601120260504B">H04B1/04</further-classification>
        <further-classification edition="200601120260504B">H04B1/16</further-classification>
        <further-classification edition="201801120260504B">H04B7/02</further-classification>
        <further-classification edition="200601120260504B">H03F3/195</further-classification>
        <further-classification edition="200601120260504B">H03F3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳炅佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, KYUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNSEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳泰宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許準會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JOONHOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任炯先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HYUNG SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔斗碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, DOOSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容描述一種射頻積體電路(RFIC)，其包括獲得複數個發射信號之一發射電路。該RFIC亦包括複數個低雜訊放大器，該等複數個低雜訊放大器放大與由一目標反射之該等複數個發射信號相對應的複數個接收信號。該RFIC進一步包括一接收切換電路，該接收切換電路包括耦接至該等複數個低雜訊放大器之複數個第一埠且包括一第一單一埠，且基於切換而將該等複數個第一埠當中的一個第一埠耦接至該第一單一埠。另外，該RFIC包括一接收鏈電路，該接收鏈電路耦接至該第一單一埠，且在一基頻中處理該等複數個接收信號當中的與該一個第一埠相對應之一個接收信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radio frequency integrated circuit (RFIC) includes a transmission circuit that obtains a plurality of transmission signals. The RFIC also includes a plurality of low noise amplifiers that amplify a plurality of reception signals corresponding to the plurality of transmission signals reflected by a target. The RFIC further includes a reception switching circuit that includes a plurality of first ports coupled to the plurality of low noise amplifiers and a first single port and couples one first port among the plurality of first ports to the first single port based on switching. In addition, the RFIC includes a reception chain circuit that is coupled to the first single port and processes one reception signal corresponding to the one first port from among the plurality of reception signals in a baseband.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:RFIC</p>
        <p type="p">110:發射電路</p>
        <p type="p">120:接收鏈電路</p>
        <p type="p">LNA1,LNA2,LNAn:低雜訊放大器</p>
        <p type="p">Ps1:第一埠</p>
        <p type="p">RA1:接收天線，第一接收天線</p>
        <p type="p">RA2:接收天線，第二接收天線</p>
        <p type="p">RAn:接收天線，第n接收天線</p>
        <p type="p">RSW:接收切換電路</p>
        <p type="p">SP1:第一單一埠</p>
        <p type="p">TA1:發射天線，第一發射天線</p>
        <p type="p">TA2:發射天線，第二發射天線</p>
        <p type="p">TAm:發射天線，第m發射天線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1800" publication-number="202632434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、光學系統、微影設備及方法</chinese-title>
        <english-title>CONTROL DEVICE, OPTICAL SYSTEM, LITHOGRAPHY APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">G03F7/20</main-classification>
        <further-classification edition="200601120260417B">G05F1/10</further-classification>
        <further-classification edition="200601120260417B">G02B26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞奇　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHT, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙太　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTAGNE, ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉布　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAAB, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特澤維克　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRZEWIK, LUKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆澤　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNZE, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於控制致動器(200)的控制裝置(100)，該致動器(200)用於致動光學系統(300)的光學元件(310)，該控制裝置(100)包括：電壓測量單元(110)，其耦合到致動器(200)，並配置為提供指示存在於該致動器(200)處的控制電壓(V2)之測量電壓(V1)；並且包括電荷源 (120)，其配置為提供控制電流(I1)，以根據用於設定光學元件(310)位置的設定點位置訊號(P)和所提供的測量電壓(V1)來控制致動器(200)的電荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device (100) for controlling an actuator (200) for actuating an optical element (310) of an optical system (300), comprising a voltage measuring unit (110) coupled to the actuator (200) and configured to provide a measured voltage (V1) indicative of a control voltage (V2) present at the actuator (200), and comprising a charge source (120) configured to provide a control current (I1) for controlling the charge of the actuator (200) as a function of a setpoint position signal (P) for setting a position of the optical element (310) and of the provided measured voltage (V1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">110:電壓測量單元</p>
        <p type="p">120:電荷源</p>
        <p type="p">200:致動器</p>
        <p type="p">I1:控制電流</p>
        <p type="p">P:設定點位置訊號</p>
        <p type="p">R:控制迴路</p>
        <p type="p">V1:測量電壓</p>
        <p type="p">V2:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1801" publication-number="202632596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>飲料提供系統、客製化飲料產生方法及程式</chinese-title>
        <english-title>BEVERAGE DISPENSING SYSTEM, CUSTOM BEVERAGE GENERATION METHOD AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260430B">G06Q50/12</main-classification>
        <further-classification edition="200601120260430B">G07F13/00</further-classification>
        <further-classification edition="201901120260430B">G06F16/9535</further-classification>
        <further-classification edition="200601120260430B">A47J31/00</further-classification>
        <further-classification edition="200601120260430B">B67C3/00</further-classification>
        <further-classification edition="200601120260430B">B67D1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日集團控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上智統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚康伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YASUNOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽鳥通生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATORI, MICHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠慧三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUNOKI, KEIZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於與指示產生客製化飲料之分配器以外之裝置共有客製化飲料之飲料資訊。  &lt;br/&gt;本發明之解決手段為具備構成為可通訊之第1終端10及分配器20之飲料提供系統1。第1終端10具有：飲料資訊產生部，其基於來自使用者之操作輸入而產生與客製化飲料相關之飲料資訊；及第1通訊部，其發送包含飲料資訊之資訊。分配器20包含：存放部，其存放包含含有酒精之第1飲料液及不含有酒精之第2飲料液之複數種飲料液；第2通訊部，其接收包含飲料資訊之資訊；及提供部，其基於第2通訊部接收到之飲料資訊，將存放於存放部之複數種飲料液混合而產生客製化飲料並提供。且，第1終端10之第1通訊部進一步將飲料資訊發送至與分配器20不同之第2終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第1終端</p>
        <p type="p">20:分配器</p>
        <p type="p">40:外部伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1802" publication-number="202631354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有視覺系統的卸垛機及其方法</chinese-title>
        <english-title>DEPALLETIZER WITH VISION SYSTEM AND METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J13/08</main-classification>
        <further-classification edition="200601120260430B">B25J9/16</further-classification>
        <further-classification edition="200601120260430B">B25J19/02</further-classification>
        <further-classification edition="200601120260430B">B65G1/04</further-classification>
        <further-classification edition="200601120260430B">B65G13/08</further-classification>
        <further-classification edition="200601120260430B">B65G59/02</further-classification>
        <further-classification edition="200601120260430B">B65G61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽門　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜查姆　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUCHARME, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　維尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, VINEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混裝箱棧板卸垛機包括：基部，具有用於供混裝箱棧板座落於其上的棧板座；機械手臂，配置為捕獲並拾取至少一個箱盒，以對混裝箱棧板進行卸垛；視覺系統，具有至少一個二維相機，其相對於棧板座被定向，使得二維相機為頂點相機，其拍攝混裝箱棧板的棧板頂點及每一個箱盒的每一個箱盒頂點，且三維相機被設置為產生具有每一個箱盒的箱盒側部之深度資訊的點雲；以及控制器，程式化為從每一個箱盒頂點的影像數據及每一個箱盒的箱盒側部的深度資訊來界定每一個箱盒的脈絡關係，並基於脈絡關係判斷箱盒拾取順序，其定出拾取至少一個箱盒的順序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mixed case pallet depalletizer includes: a base with a pallet seat for seating a mixed case pallet thereon; a robot arm configured to capture and pick at least one case to depalletize the mixed case pallet; a vision system having at least a two-dimensional camera orientated relative to the pallet seat so that the two-dimensional camera is a vertex camera that images a pallet vertex of the mixed case pallet and each case vertex of each case, and a three-dimensional camera is disposed to generate a point cloud with depth information of case sides of each case; and a controller programmed to define, from image data of each case vertex and the depth information of case sides of each case, a contextual relation of each case, and determine a case pick sequence that sequences picking of the at least one case based on the contextual relationship.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:卸垛系統/(混裝箱棧板)卸垛機</p>
        <p type="p">10A:堆垛機/卸垛機單元</p>
        <p type="p">10C:控制器</p>
        <p type="p">10VC:視覺控制器</p>
        <p type="p">14:機械箱盒操縱器</p>
        <p type="p">14A:機械箱盒操縱器</p>
        <p type="p">14B:機械箱盒操縱器</p>
        <p type="p">150A:進/出箱盒輸送帶</p>
        <p type="p">175C:(進出負載棧板)輸送帶</p>
        <p type="p">401:(棧板)拆解站</p>
        <p type="p">444:機器學習模型</p>
        <p type="p">447:影像數據</p>
        <p type="p">448:深度資訊</p>
        <p type="p">450:機械基部</p>
        <p type="p">451:機械手臂</p>
        <p type="p">451A:機械手臂</p>
        <p type="p">451B:機械手臂</p>
        <p type="p">452:臂工具端</p>
        <p type="p">452G:臂工具端夾具</p>
        <p type="p">470:視覺系統</p>
        <p type="p">471:二維相機</p>
        <p type="p">472:二維相機</p>
        <p type="p">473:二維相機</p>
        <p type="p">474:二維相機</p>
        <p type="p">480:三維相機</p>
        <p type="p">490:基部</p>
        <p type="p">491:棧板座</p>
        <p type="p">499:有線或無線連接</p>
        <p type="p">500:表面</p>
        <p type="p">CPS:箱盒拾取順序</p>
        <p type="p">CU:箱盒/棧板負載物品單元</p>
        <p type="p">PAL:混裝箱棧板</p>
        <p type="p">PV1:棧板頂點</p>
        <p type="p">PV2:棧板頂點</p>
        <p type="p">PV3:棧板頂點</p>
        <p type="p">PV4:棧板頂點</p>
        <p type="p">VC1:頂點相機</p>
        <p type="p">VC2:頂點相機</p>
        <p type="p">VC3:頂點相機</p>
        <p type="p">VC4:頂點相機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1803" publication-number="202631355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有視覺系統的卸垛機及其方法</chinese-title>
        <english-title>DEPALLETIZER WITH VISION SYSTEM AND METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J13/08</main-classification>
        <further-classification edition="200601120260430B">B25J9/16</further-classification>
        <further-classification edition="200601120260430B">B25J19/02</further-classification>
        <further-classification edition="200601120260430B">B65G1/04</further-classification>
        <further-classification edition="200601120260430B">B65G13/08</further-classification>
        <further-classification edition="200601120260430B">B65G59/02</further-classification>
        <further-classification edition="200601120260430B">B65G61/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商辛波提克有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMBOTIC LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽門　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜查姆　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUCHARME, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　維尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, VINEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;一種混裝箱棧板卸垛機包括：基部，具有棧板座；機械手臂，具有臂工具端，用於從堆疊的混裝箱盒中捕獲並拾取至少一個箱盒，以對棧板座上的混裝箱棧板進行卸垛；視覺系統，具有相機，其被定向來拍攝棧板座上的混裝箱棧板的棧板頂點及拍攝堆疊的混裝箱盒中之沿著界定出棧板頂點的每一個可見平面排列的每一個箱盒的每一個箱盒頂點；以及控制器，其從每一個箱盒頂點的影像數據判斷出每一個箱盒之描述箱盒頂點的對應的邊緣，其辨別出至少一個箱盒，且控制器可操作地連接到機械手臂，以命令機械手臂拾取及移除至少一個箱盒，並對混裝箱棧板進行卸垛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mixed case pallet depalletizer including: a base with a pallet seat; a robot arm having an end of arm tool for capturing and picking, at least one case from stacked mixed cases to depalletize a mixed case pallet on the pallet seat; a vision system with a camera orientated to image a pallet vertex of the mixed case pallet on the pallet seat and image each case vertex of each case, of the stacked mixed cases arrayed along each visible plane defining the pallet vertex; and a controller that determines, from the image data of each case vertex, corresponding edges of each case describing the case vertex that discriminate the at least one case, and the controller is operably connected to the robot arm to command the robot arm to pick and remove the at least one case and depalletize the mixed case pallet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CU:箱盒/棧板負載物品單元</p>
        <p type="p">CU1:箱盒(單元)</p>
        <p type="p">CU2:箱盒(單元)</p>
        <p type="p">CU3:箱盒(單元)</p>
        <p type="p">CU4:箱盒(單元)</p>
        <p type="p">CU5:箱盒(單元)</p>
        <p type="p">CU6:箱盒(單元)</p>
        <p type="p">CU7:箱盒(單元)</p>
        <p type="p">CV:箱盒頂點</p>
        <p type="p">KP1:關鍵點</p>
        <p type="p">KP2:關鍵點</p>
        <p type="p">KP3:關鍵點</p>
        <p type="p">KP4:關鍵點</p>
        <p type="p">KP5:關鍵點</p>
        <p type="p">KP6:關鍵點</p>
        <p type="p">KP7:關鍵點</p>
        <p type="p">KP8:關鍵點</p>
        <p type="p">PAL:混裝箱棧板</p>
        <p type="p">PL1:可見平面或側部</p>
        <p type="p">PL2:可見平面或側部</p>
        <p type="p">PL3:可見平面或側部</p>
        <p type="p">PV:棧板頂點</p>
        <p type="p">PV1:棧板頂點</p>
        <p type="p">PV2:棧板頂點</p>
        <p type="p">PV3:棧板頂點</p>
        <p type="p">PV4:棧板頂點</p>
        <p type="p">TS:頂部側部</p>
        <p type="p">VS:垂直側部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1804" publication-number="202632008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋼板之製造方法及鋼板之製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">C21D8/02</main-classification>
        <further-classification edition="202601120260428B">C21D8/0221</further-classification>
        <further-classification edition="200601120260428B">C21D1/19</further-classification>
        <further-classification edition="200601120260428B">C21D10/00</further-classification>
        <further-classification edition="200601120260428B">C22C38/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田啓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上岡悟史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEOKA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供可抑制因合金氧化物所造成之溫度不均發生的鋼板之製造方法、及鋼板之製造裝置。使用以質量%計含有：Si：0.2~3.0%、Mn：1.0~4.0%之鋼胚進行的鋼板之製造方法。鋼板之製造方法係包括有：脫氧化皮膜步驟，係對由上述鋼胚經熱軋而成的板胚，噴射能量密度合計0.20~1.50J/mm&lt;sup&gt;2&lt;/sup&gt;的水，而除去上述板胚表面上所形成的氧化皮膜；軋延步驟，係對經上述脫氧化皮膜步驟的上述板胚施行軋延；冷卻步驟，係利用冷卻水施行冷卻至上述鋼板之表面溫度成為500℃以下；以及鐵氧化物形成步驟，係在從上述脫氧化皮膜步驟結束起至上述冷卻步驟開始的期間內，在對上述板胚施行軋延而成的鋼板表面上，形成鐵氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:加熱爐</p>
        <p type="p">20:脫氧化皮膜部</p>
        <p type="p">21:粗脫氧化皮膜部</p>
        <p type="p">22:精整脫氧化皮膜部</p>
        <p type="p">30:寬度軋縮部</p>
        <p type="p">40:軋延部</p>
        <p type="p">41:粗軋部</p>
        <p type="p">42:精軋部</p>
        <p type="p">50:鐵氧化物形成部</p>
        <p type="p">60:冷卻部</p>
        <p type="p">61:第1冷卻部</p>
        <p type="p">62:第2冷卻部</p>
        <p type="p">70:捲取機</p>
        <p type="p">71:溫度測定部</p>
        <p type="p">80:控制部</p>
        <p type="p">100:鋼板之製造裝置</p>
        <p type="p">D1:搬送方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1805" publication-number="202631470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移動體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B65G1/04</main-classification>
        <further-classification edition="200601120260430B">B66F9/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北尾太市</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAO, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之移動體裝置係具備有：於規定方向延伸之導引部、沿著該導引部而於規定方向移動之移動體、於規定方向驅動該移動體之驅動部、及控制該驅動部對移動體之驅動的控制部。控制部於移動體之移動開始後至停止為止當移動距離在既定之距離範圍內時，其執行用以抑制該移動時之移動體之規定方向的振動的特定控制，當移動距離偏離既定之距離範圍時，則不執行特定控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1806" publication-number="202633067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直堆疊八電晶體互補場效電晶體靜態隨機存取記憶體</chinese-title>
        <english-title>VERTICALLY STACKED 8T COMPLEMENTARY FET SRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260420B">H10B10/00</main-classification>
        <further-classification edition="200601120260420B">G11C11/412</further-classification>
        <further-classification edition="202501120260420B">H10D30/63</further-classification>
        <further-classification edition="200601120260420B">G11C11/419</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裘許　瑞基夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSHI, RAJIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　瑞龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, RUILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷登　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADENS, CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊丹巴勞　杜瑞塞提</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARRAO, DURESETI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種靜態隨機存取記憶體(SRAM)積體電路，其包含連接至一第一儲存節點及一第二儲存節點之複數個PMOS電晶體及複數個NMOS電晶體。該等PMOS電晶體製造於該積體電路之一上部層中，且該等NMOS電晶體製造於該積體電路之一下部層中。一電壓供應軌、一寫入字線、一讀取位元線及一讀取字線形成於該上部層中。一接地軌、一寫入位元線及一互補寫入位元線形成於該下部層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A static random access memory (SRAM) integrated circuit comprises a plurality of PMOS and NMOS transistors connected to a first storage node and a second storage node. The PMOS transistors are fabricated in an upper layer of the integrated circuit and the NMOS transistors are fabricated in a lower layer of the integrated circuit. A voltage supply rail, a write word line, a read bit line and a read word line are formed in the upper layer. A ground rail, a write bit line and a complementary write bit line are formed in the lower layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">306:通路</p>
        <p type="p">308:通路</p>
        <p type="p">310:磊晶區</p>
        <p type="p">312:磊晶區</p>
        <p type="p">314:金屬閘極/閘極</p>
        <p type="p">315:間隔物</p>
        <p type="p">316:層間電介質/ILD</p>
        <p type="p">320:通路</p>
        <p type="p">322:通路</p>
        <p type="p">324:磊晶區</p>
        <p type="p">326:磊晶區</p>
        <p type="p">328:單擴散區塊</p>
        <p type="p">330:接合氧化物</p>
        <p type="p">332:上部層</p>
        <p type="p">340:通路</p>
        <p type="p">342:通路</p>
        <p type="p">344:磊晶區</p>
        <p type="p">346:磊晶區</p>
        <p type="p">348:金屬閘極</p>
        <p type="p">350:通路</p>
        <p type="p">352:通路</p>
        <p type="p">354:磊晶區</p>
        <p type="p">356:磊晶區</p>
        <p type="p">358:金屬閘極</p>
        <p type="p">402:接觸溝槽</p>
        <p type="p">502:金屬</p>
        <p type="p">602:接點</p>
        <p type="p">610:背側交叉連接件/寫入字線/WWL</p>
        <p type="p">701:BEOL</p>
        <p type="p">702:電力供應軌/VDD</p>
        <p type="p">704:輸出節點/VO</p>
        <p type="p">706:寫入字線/WWL</p>
        <p type="p">708:讀取位元線/RBLB</p>
        <p type="p">710:介電層</p>
        <p type="p">712:載體晶圓</p>
        <p type="p">900A:橫截面視圖</p>
        <p type="p">904:ILD</p>
        <p type="p">906:VSS</p>
        <p type="p">908:BSCA</p>
        <p type="p">910:BSCB</p>
        <p type="p">912:BSLI</p>
        <p type="p">914:BLB</p>
        <p type="p">916:背側電源切斷節點/BSPDN</p>
        <p type="p">N1:NMOS電晶體/電晶體</p>
        <p type="p">N2:NMOS電晶體/電晶體</p>
        <p type="p">P1:PMOS電晶體/電晶體</p>
        <p type="p">P2:PMOS電晶體/電晶體</p>
        <p type="p">X1:割線/切割線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1807" publication-number="202631086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放射線圖像獲取裝置及放射線圖像獲取方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">A61B6/03</main-classification>
        <further-classification edition="201801120260430B">G16H20/40</further-classification>
        <further-classification edition="201801120260430B">G16H30/00</further-classification>
        <further-classification edition="200601120260430B">H05G1/00</further-classification>
        <further-classification edition="200601120260430B">H01J35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上西秀典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONISHI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田晴義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, HARUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横山拓弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深水聖司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAMIZU, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木春樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須山敏康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之X射線圖像獲取裝置1包含：X射線源2，其具有電子槍21及靶材22；控制部3，其將電子束EB之入射位置控制在第1入射位置與第2入射位置之間；X射線檢測部4，其獲取對象物OJ之X射線圖像；及處理部5，其對在入射位置為第1入射位置之第1狀態下作為X射線圖像而獲取之第1圖像、及在入射位置為第2入射位置之第2狀態下作為X射線圖像而獲取之第2圖像進行處理；且控制部3基於自對象物OJ至X射線檢測部4之X射線之放大率將入射位置控制在第1入射位置與第2入射位置之間，而在第1狀態與第2狀態之間使對象物OJ之像之至少一部分以跨越相鄰之像素41間之邊界之方式移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:X射線圖像獲取裝置(放射線圖像獲取裝置)</p>
        <p type="p">2:X射線源(放射線源)</p>
        <p type="p">3:控制部</p>
        <p type="p">4:X射線檢測部(放射線檢測部)</p>
        <p type="p">5:處理部</p>
        <p type="p">6:X射線源固定治具</p>
        <p type="p">7:檢測部固定治具</p>
        <p type="p">21:電子槍(束出射部)</p>
        <p type="p">D1:方向</p>
        <p type="p">D2:方向(規定方向)</p>
        <p type="p">EB:電子束</p>
        <p type="p">OJ:對象物</p>
        <p type="p">Y1:第1入射位置/入射位置</p>
        <p type="p">Y2:第2入射位置/入射位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1808" publication-number="202631642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145705</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度前驅物組合物及相關方法</chinese-title>
        <english-title>HIGH PURITY PRECURSOR COMPOSITIONS AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07F11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUIPER, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供高純度前驅物組合物及相關方法。該方法包括獲得金屬錯合物及試劑。該方法包括使該金屬錯合物與該試劑接觸以形成反應產物。該反應產物具有至少85%之純度，如藉由在300℃下熱重分析(TGA)殘餘物所測定。該反應產物可用作沉積前驅物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">High purity precursor compositions and related methods are provided herein. The method includes obtaining a metal complex and a reagent. The method includes contacting the metal complex and the reagent to form a reaction product. The reaction product has a purity of at least 85% as determined by a thermogravimetric analysis (TGA) residue at 300 °C. The reaction product can be used as a deposition precursor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1809" publication-number="202632599">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於生成式人工智慧（ＡＩ）的影像框序列擴增</chinese-title>
        <english-title>GENERATIVE ARTIFICIAL INTELLIGENCE (AI) BASED IMAGE FRAME SEQUENCE AUGMENTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G06T1/00</main-classification>
        <further-classification edition="202401120260504B">G06T5/60</further-classification>
        <further-classification edition="202601120260504B">G06T11/00</further-classification>
        <further-classification edition="202201120260504B">G06V20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔凡羅　麥克法蘭柯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVEIRA, MICHAEL FRANCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐古茲　塞佛拉哈利特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGUZ, SEYFULLAH HALIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括一記憶體，其經組態以儲存一場景的一擷取影像框序列。該裝置亦包括一或多個處理器，該一或多個處理器耦接至該記憶體。該一或多個處理器經組態以使用一生成式人工智慧(AI)模型以基於該擷取影像框序列中之一擷取影像框來產生一第一額外影像框。該一或多個處理器亦經組態以提供包括該場景的一擴增影像框序列的一輸出。該擴增影像框序列包括複數個該等擷取影像框及該第一額外影像框。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a memory configured to store a sequence of captured image frames of a scene. The device also includes one or more processors coupled to the memory. The one or more processors are configured to use a generative artificial intelligence (AI) model to generate a first additional image frame based on a captured image frame of the sequence of captured image frames. The one or more processors are also configured to provide an output that includes an augmented sequence of image frames of the scene. The augmented sequence of image frames includes a plurality of the captured image frames and the first additional image frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:裝置</p>
        <p type="p">110:影像擷取裝置</p>
        <p type="p">112,112A,112N:影像框</p>
        <p type="p">120:生成式人工智慧(AI)模型</p>
        <p type="p">122,122A:額外影像框</p>
        <p type="p">124:組合器</p>
        <p type="p">132:記憶體</p>
        <p type="p">140:影像序列擴增器</p>
        <p type="p">142:擴增影像框序列</p>
        <p type="p">144:介面產生器</p>
        <p type="p">152:參考影像框</p>
        <p type="p">160:顯示裝置</p>
        <p type="p">162:輸出</p>
        <p type="p">180:人</p>
        <p type="p">182:使用者</p>
        <p type="p">184:場景</p>
        <p type="p">186:使用者介面</p>
        <p type="p">188:使用者輸入</p>
        <p type="p">190:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1810" publication-number="202632042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C16/04</main-classification>
        <further-classification edition="200601120260504B">C23C16/14</further-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="200601120260504B">C23C16/56</further-classification>
        <further-classification edition="202601120260504B">H10P14/43</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平澤達郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRASAWA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那須勝行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASU, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在使露出於基板表面的含Si層上成膜出的由Ru以外的金屬構成的第1金屬膜矽化物化時，抑制含Si層矽化物化。  &lt;br/&gt;本揭露的基板處理方法係包含以下工序：在露出於基板的表面的含Si層上形成由Ru以外的金屬構成的第1金屬膜；以及對該基板供給Si元素以從該Si元素及該第1金屬膜形成金屬矽化物膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1811" publication-number="202632111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工皮革及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">D06N3/00</main-classification>
        <further-classification edition="200601120260424B">D06C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶原健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIWARA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下山悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOYAMA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田悠哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供可以高水準兼具柔軟性與耐磨耗性的人工皮革。&lt;br/&gt;  本發明係關於一種人工皮革，其具有包含極細纖維的纖維結構物與高分子彈性體，而且該纖維結構物及/或該高分子彈性體含有脂肪酸系化合物，其中就該極細纖維而言，該極細纖維的平均單纖維直徑為0.1μm以上10.0μm以下；該高分子彈性體係與兩條以上之該極細纖維接觸；該人工皮革中的該脂肪酸系化合物的總含有率為0.1質量%以上5.0質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:纖維</p>
        <p type="p">12:纖維之彎曲部中的頂點</p>
        <p type="p">13:與2個彎曲部相接之基線</p>
        <p type="p">14:平行於基線且長度100μm的弦</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1812" publication-number="202631286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑽頭以及加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">B23B51/00</main-classification>
        <further-classification edition="200601120260331B">B23B51/02</further-classification>
        <further-classification edition="200601120260331B">B23B51/08</further-classification>
        <further-classification edition="200601120260331B">B23B27/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＯＳＧ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田風翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, KAZATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的鑽頭可使設有鑽邊面的鑽尖最外周部分處不易發生缺損。鑽頭(1)包括：圓柱狀工具本體(2)、2或3片鑽尖(3)、鑽槽(4)、平面狀鑽邊面(20)、平面狀肩面部(22)、及直線狀殘線部(24)。2或3片鑽尖(3)形成於工具本體的前端部。鑽槽(4)凹設於工具本體的外周面，形成鑽尖的鑽唇(11)。平面狀鑽邊面(20)將鑽尖的鑽唇、與鑽尖的刀鋒背(12、13)間之稜線部分倒角而形成。平面狀肩面部(22)將由鑽邊面、工具本體外周面及刀鋒背所構成的刃緣倒角而形成。直線狀殘線部(24)由鑽邊面、與工具本體外周面的稜線所形成。其中，鑽尖的刃徑係3mm以下，肩面部寬係鑽邊寬的15%~75%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鑽頭</p>
        <p type="p">2:工具本體</p>
        <p type="p">3:鑽尖</p>
        <p type="p">4:鑽槽</p>
        <p type="p">6:第二修磨面</p>
        <p type="p">7:刃帶面</p>
        <p type="p">8:導引刃</p>
        <p type="p">11:鑽唇</p>
        <p type="p">12:第二刀鋒背</p>
        <p type="p">13:第三刀鋒背</p>
        <p type="p">14:鑽鑿</p>
        <p type="p">14a:鑽鑿刃</p>
        <p type="p">20:鑽邊面</p>
        <p type="p">21:鑽鑿側鑽邊面</p>
        <p type="p">22:肩面部</p>
        <p type="p">24:殘線部</p>
        <p type="p">A:鑽邊寬</p>
        <p type="p">B:肩面部寬</p>
        <p type="p">C:軸線</p>
        <p type="p">D:刃徑</p>
        <p type="p">E:箭頭</p>
        <p type="p">F:箭頭</p>
        <p type="p">β:前端角</p>
        <p type="p">γ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1813" publication-number="202631876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C08L61/28</main-classification>
        <further-classification edition="200601120260429B">C08G59/22</further-classification>
        <further-classification edition="200601120260429B">C08G59/32</further-classification>
        <further-classification edition="200601120260429B">C08L63/02</further-classification>
        <further-classification edition="200601120260429B">C08L63/04</further-classification>
        <further-classification edition="200601120260429B">C08G59/42</further-classification>
        <further-classification edition="200601120260429B">C08K3/36</further-classification>
        <further-classification edition="200601120260429B">C08K7/16</further-classification>
        <further-classification edition="200601120260429B">C08K9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友野里穗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMONO, RIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川合賢司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是提供能夠形成介電特性、伸長率和HAST試驗前後的密合性優異的固化物的樹脂組成物等。上述課題的解決方法是樹脂組成物，其包含：(A)包含二聚二胺骨架和三聚三胺骨架中的任一骨架、以及芴骨架的聚醯亞胺樹脂、和(B)熱固性樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1814" publication-number="202632713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多帶電粒子束的照射裝置及多帶電粒子束照射方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01J37/04</main-classification>
        <further-classification edition="200601120260427B">H01J37/02</further-classification>
        <further-classification edition="200601120260427B">H01J37/09</further-classification>
        <further-classification edition="200601120260427B">H01J37/10</further-classification>
        <further-classification edition="200601120260427B">H01J37/147</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東矢高尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOUYA, TAKANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種抑制從止擋孔徑基板放出的二次電子對於射束的影響，而能夠使射束照射位置精度提升之多帶電粒子束照射裝置及多帶電粒子束照射方法。  &lt;br/&gt;　　按照本發明的一態樣之多帶電粒子束照射裝置，具備：遮沒孔徑陣列基板，將多射束的各射束做遮沒偏向；照明透鏡，使通過前述遮沒孔徑陣列基板的前述多射束匯聚而形成交叉點；止擋孔徑基板，配置於前述交叉點的位置，將被偏向成為射束關閉的狀態的射束予以遮蔽；平台，載置供通過前述止擋孔徑基板的射束照射之基板；靜電偏向器，在前述遮沒孔徑陣列基板與前述止擋孔徑基板之間，貼近前述止擋孔徑基板而配置；電壓控制電路，對前述靜電偏向器施加規定的電壓，形成和前述多射束的軌道中心軸正交的方向的電場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:靜電偏向器</p>
        <p type="p">30:鏡</p>
        <p type="p">102:電子光學鏡筒</p>
        <p type="p">103:描繪室</p>
        <p type="p">105:XY平台</p>
        <p type="p">110:控制計算機</p>
        <p type="p">120:控制電路</p>
        <p type="p">122:電壓控制電路</p>
        <p type="p">124:平台位置檢測器</p>
        <p type="p">200:電子束</p>
        <p type="p">201:電子源</p>
        <p type="p">202:照明透鏡</p>
        <p type="p">203:成形孔徑陣列基板</p>
        <p type="p">204:遮沒孔徑陣列基板</p>
        <p type="p">206:止擋孔徑基板</p>
        <p type="p">206a:開口部</p>
        <p type="p">208:定位偏向器</p>
        <p type="p">210:對物透鏡</p>
        <p type="p">C:控制部</p>
        <p type="p">MB:多射束</p>
        <p type="p">W:描繪部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1815" publication-number="202631231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有填充凹槽及氣體嵌件腔室之高爾夫球桿頭</chinese-title>
        <english-title>GOLF CLUB HEAD WITH FILLED CAVITY AND CHAMBER WITH PNEUMATIC INSERT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260422B">A63B53/04</main-classification>
        <further-classification edition="201501120260422B">A63B53/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡斯登製造公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARSTEN MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德格內斯　裘夏Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGERNESS, JOSHUA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布貝克　柯爾Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUBAKER, COLE D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾　艾文Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREER, EVAN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特　蘭斯Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHITE, LANCE R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧斯　羅伯特Ｃ　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOUTH, ROBERT C. T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種後收式鐵桿型高爾夫球桿頭，其具有設於凹槽中的封塊及設於腔室中的氣體嵌件。該凹槽及腔室共同構成球桿的後側空腔。設於凹槽中的封塊接觸擊球面後表面，並與圍設出後方開口的承座相互作用，藉以實質上封閉後方開口。氣體嵌件抑制振動並強化擊球面。此組合改善聲響及手感，保有可自由配置質量，並維持桿面撓曲度及球速。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastback iron-type golf club head includes a badge disposed in a cavity and a pneumatic insert disposed in a chamber. The cavity and chamber cooperate to define a rear void of the club. The badge disposed in a cavity contacts the strike face rear surface, and interacts with a seat that circumscribes a rear opening to substantially seal the rear opening. The pneumatic insert damps vibrations and reinforces the strike face. This combination improves sound and feel, preserves discretionary mass, and maintains face deflection and ball speed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:桿頭</p>
        <p type="p">104:踵部</p>
        <p type="p">106:趾部</p>
        <p type="p">110:頂軌</p>
        <p type="p">111:後端</p>
        <p type="p">112:底部</p>
        <p type="p">116:後壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1816" publication-number="202632763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電化學裝置、包括電化學裝置之電解系統或燃料電池系統，以及操作此電化學裝置之方法</chinese-title>
        <english-title>ELECTROCHEMICAL DEVICE, ELECTROLYSIS SYSTEM OR FUEL CELL SYSTEM INCLUDING THE ELECTROCHEMICAL DEVICE AND METHOD OF OPERATING THE ELECTROCHEMICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260429B">H01M8/04007</main-classification>
        <further-classification edition="201601120260429B">H01M8/12</further-classification>
        <further-classification edition="201401120260429B">H01M10/615</further-classification>
        <further-classification edition="202101120260429B">C25B9/00</further-classification>
        <further-classification edition="202101120260429B">C25B1/042</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑卡　阿魯穆加拉詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKAR, ARUMUGARAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩姆桑托什　杜雷拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSANTHOSH, DURAIRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯帕希克　艾維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPAHIC, ELVIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森加門杜　普拉聖娜　文卡特桑　古魯拉詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENGAMEDU PRASANNA VENKATESAN, GURURAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里德爾　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEDEL, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯貝格　馬呂斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMBERG, MARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫普薩米　莫罕　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUPPUSAMY, MOHAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉詹德蘭　穆圖庫瑪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, MUTHUKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電化學裝置（48a至48b），其具有：至少一個電化學電池模組（10a至10b），其具有用於將至少一種反應物氣體（14a至14b）及/或空氣（16a至16b）進料至該電化學電池模組（10a至10b）之一氣體進料單元（12a至12b）；一氣體排放單元（18a至18b），其用於自該電化學電池模組（10a至10b）排放至少一種排氣（66b）、至少一種產物氣體（20a）、一廢氣（22a至22b）及/或一富集空氣；及一加熱單元（24a至24b），其至少用於加熱自該氣體進料單元（12a至12b）進料之該至少一種反應物氣體（14a至14b）及/或自該氣體進料單元（12a至12b）進料之該空氣（16a至16b）。  &lt;br/&gt;提議該加熱單元（24a至24b）包含至少一個傳熱器（26a至26b），該至少一個傳熱器自所排放之排氣（66b）、所排放之產物氣體（20a）、所排放之廢氣（22a至22b）及/或所排放之富集空氣獲取熱量，且將其供應至所進料之該至少一種反應物氣體（14a至14b）及/或所進料之該空氣（16a至16b），使得所進料之該至少一種反應物氣體（14a至14b）及/或所進料之該空氣（16a至16b）的一溫度保持在高於500℃、尤其在500℃與1000℃之間的一溫度範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention proceeds from an electrochemical device (48a-b), having at least one electrochemical cell module (10a-b), having a gas feed unit (12a-b) to a feed of at least one reactant gas (14a-b) and/or air (16a-b) to the electrochemical cell module (10a-b), having a gas discharge unit (18a-b) to a discharge of at least one offgas (66b), at least one product gas (20a), a waste air (22a-b) and/or an enriched air from the electrochemical cell module (10a-b), and having a heating unit (24a-b) at least for heating of the at least one reactant gas (14a-b) fed in from the gas feed unit (12a-b) and/or of the air (16a-b) fed in from the gas feed unit (12a-b). &lt;br/&gt;It is proposed that the heating unit (24a-b) comprise at least one heat transferrer (26a-b) that takes heat from the discharged offgas (66b), the discharged product gas (20a), the discharged waste air (22a-b) and/or the discharged enriched air and supplies it to the at least one reactant gas (14a-b) fed in and/or the air (16a- b) fed in such that a temperature of the at least one reactant gas (14a-b) fed in and/or the air (16a-b) fed in is kept within a temperature range above 500℃, especially between 500℃ and 1000℃.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:電化學電池模組</p>
        <p type="p">12a:氣體進料單元</p>
        <p type="p">14a:反應物氣體</p>
        <p type="p">16a:空氣</p>
        <p type="p">18a:氣體排放單元</p>
        <p type="p">20a:產物氣體</p>
        <p type="p">22a:廢氣</p>
        <p type="p">24a:加熱單元</p>
        <p type="p">26a:傳熱器</p>
        <p type="p">28a:傳熱器</p>
        <p type="p">30a:反應物導管區段/導管區段</p>
        <p type="p">32a:產物氣體導管區段/導管區段</p>
        <p type="p">34a:空氣導管區段/導管區段</p>
        <p type="p">36a:廢氣導管區段/導管區段</p>
        <p type="p">38a:加熱器</p>
        <p type="p">40a:加熱器</p>
        <p type="p">42a:陽極側</p>
        <p type="p">44a:陰極側</p>
        <p type="p">46a:電解系統</p>
        <p type="p">48a:電化學裝置</p>
        <p type="p">52a:冷匣</p>
        <p type="p">54a:熱匣</p>
        <p type="p">56a:電化學電池堆</p>
        <p type="p">56a':電化學電池堆</p>
        <p type="p">58a:閥</p>
        <p type="p">60a:溫度感測器</p>
        <p type="p">62a:溫度感測器</p>
        <p type="p">64a:開環及/或閉環控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1817" publication-number="202632164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有使用ＣＤＡ之速度控制器的閘閥</chinese-title>
        <english-title>GATE VALVE WITH SPEED CONTROLLER USING CDA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">F16K3/02</main-classification>
        <further-classification edition="200601120260428B">F16K3/30</further-classification>
        <further-classification edition="202601120260428B">H10P95/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相田弘栄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIDA, KOEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露呈現具有開啟/關閉速度控制能力之閘閥。為了控制開啟/關閉速度，本揭露呈現一外殼；一氣缸，其配置以將一第一軸豎直地向上移動至一第一位置，此第一軸連接至此氣缸；一凸輪單元，其包括在一個末端處附接至此第一軸之一凸輪；一第二軸，其連接在此凸輪之相對末端處且配置以連同此凸輪一起移動至某一高度；一第一波紋管，其安置於此第二軸周圍；一密封板，其安置於此第二軸之一末端處且配置以關閉至/自一腔室之一通道；一密封環，其安置於此密封板周圍且配置以在此密封板關閉此通道時密封此通道；以及一CDA單元，其配置以控制此閘閥之一開啟/關閉速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Gate valve with open/close speed control capability is presented. To control open/close speed, the present disclosure presents a housing; an air cylinder configured to move a first shaft vertically up to a first position, the first shaft being connected to the air cylinder; a cam unit including a cam attached to the first shaft at one end; a second shaft connected at opposite end of the cam and configured to move along with the cam to a certain height; a first bellows disposed around the second shaft; a seal plate disposed at an end of the second shaft and configured to close a passage to/from a chamber; a seal ring disposed around the seal plate and configured to seal up the passage when the seal plate closes the passage; and a CDA unit configured to control an open/close speed of the gate valve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:外殼</p>
        <p type="p">111:上部外殼</p>
        <p type="p">120:氣缸</p>
        <p type="p">121:第一軸</p>
        <p type="p">130:凸輪單元</p>
        <p type="p">131:凸輪</p>
        <p type="p">132:第二波紋管</p>
        <p type="p">135:滑件</p>
        <p type="p">137:導軌</p>
        <p type="p">140:波紋管</p>
        <p type="p">150:第二軸</p>
        <p type="p">160:密封板</p>
        <p type="p">161:密封環</p>
        <p type="p">170:腔室</p>
        <p type="p">171:密封板</p>
        <p type="p">172:通道</p>
        <p type="p">A:水平移動，移動</p>
        <p type="p">B:水平移動，移動</p>
        <p type="p">C:豎直移動</p>
        <p type="p">P:最頂部位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1818" publication-number="202631880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145906</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C08L63/02</main-classification>
        <further-classification edition="200601120260416B">C08G59/26</further-classification>
        <further-classification edition="200601120260416B">C08G59/40</further-classification>
        <further-classification edition="200601120260416B">C08K5/18</further-classification>
        <further-classification edition="200601120260416B">C08K3/36</further-classification>
        <further-classification edition="200601120260416B">C08K7/16</further-classification>
        <further-classification edition="200601120260416B">C08K7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊遙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂博道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, HIROMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森野正行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORINO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種流動性優異之硬化性組成物，其可形成電特性(低相對介電常數、低介電正切等)與耐裂性優異且亦具備機械特性、絕緣性等之硬化物，而有用於半導體裝置之密封材、增層膜或底部填充材等電子零件裝置用途。&lt;br/&gt;  其解決手段為：一種硬化性組成物，包含環氧樹脂、硬化劑、平均粒徑(D50)為0.1µm以上且小於4µm之實心氧化矽粒子、及平均粒徑(D50)為0.1µm以上且4µm以下之中空氧化矽粒子；前述實心氧化矽粒子與前述中空氧化矽粒子之平均粒徑(D50)之差的絕對值大於0.1µm，並且，前述實心氧化矽粒子與前述中空氧化矽粒子之總含量為25體積%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1819" publication-number="202632223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145909</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用半導體製程技術製造之大尺寸結構之測量之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR MEASUREMENT OF LARGE DIMENSION STRUCTURES FABRICATED USING SEMICONDUCTOR PROCESSING TECHNIQUES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260502B">G01B11/24</main-classification>
        <further-classification edition="200601120260502B">G01N21/47</further-classification>
        <further-classification edition="200601120260502B">G06F17/15</further-classification>
        <further-classification edition="201901120260502B">G06N20/00</further-classification>
        <further-classification edition="202601120260502B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舟艾柏　浩山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUAIB, HOUSSAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里許南　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中呈現用於執行使用半導體製程製造之相對大尺寸結構之準確且穩健的基於散射測量之測量之方法及系統。在一些實例中，相對大尺寸結構包含非週期性之螺旋形特徵。在一個態樣中，一或多個相對大尺寸裝置結構與一或多個代理計量目標一起製造於一樣品上。該一或多個代理計量目標之各者具空間週期性，且包含藉由一曲率半徑特性化之標稱上相同之彎曲片段之一陣列。與該複數個代理計量目標之各者相關聯之該曲率半徑對應於一螺旋形裝置結構之複數個圈之各者之曲率半徑。在較佳實施例中，與該等代理計量目標之各者相關聯之膜堆疊及線/間距比與該等裝置結構相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for performing accurate and robust scatterometry based measurements of relatively large dimension structures fabricated using semiconductor fabrication processes are presented herein. In some examples, relatively large dimension structures include spiral-shaped features that are not periodic. In one aspect, one or more relatively large dimension device structures are fabricated on a specimen along with one or more proxy metrology targets. Each of the one or more proxy metrology targets are spatially periodic and include an array of nominally identical curved segments characterized by a radius of curvature. The radius of curvature associated with each of the plurality of proxy metrology targets corresponds to the radius of curvature of each of the plurality of turnings of a spiral-shaped device structure. In preferred embodiments, the film stack and line/space ratio associated with each of the proxy metrology targets is the same as the device structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20A至20R:矽基機械游絲結構</p>
        <p type="p">120:晶圓/基板</p>
        <p type="p">120A至120E:劃線道</p>
        <p type="p">170A至170D:代理計量目標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1820" publication-number="202631250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣液反應裝置</chinese-title>
        <english-title>GAS-LIQUID REACTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B01J19/24</main-classification>
        <further-classification edition="202201120260504B">B01F23/20</further-classification>
        <further-classification edition="202201120260504B">B01F25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張涵寓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳庭宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芳承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周呈齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖啟雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣液反應裝置，包含一第一腔體、設置於第一腔體內的第二腔體、設置於第二腔體內的第三腔體及環繞連接於第一腔體的複數進氣管。第一腔體之第一空間與外部空間相連通，第一空間與第二腔體之第二空間相連通，第二空間與第三腔體之第三空間相連通。液體由第一腔體之第一開放端進入第一腔體且氣體由進氣管進入第一腔體後於第一腔體進行第一階段混合，再由第二腔體之透空槽流入第二腔體進行第二階段混合，而後由第三腔體之第三入口端流入第三腔體進行第三階段混合，並由第三腔體之第三出口端流出第三腔體外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas-liquid reaction device is disclosed, which includes a first cavity, a second cavity disposed within the first cavity, a third cavity disposed within the second cavity, and a plurality of air inlet pipes which are surrounded and connected to the first cavity. A first space of the first cavity respectively communicates with a second space of the second cavity and an external space, and the second space communicates with a third space of the third cavity. Liquid enters the first cavity through a first open end, and gas enters the first cavity through the air inlet pipes, where they undergo a first-stage mixing. and then flow into the second cavity through the hollow groove for a second-stage mixing, and then flow into the third cavity through a third inlet end for a third-stage mixing, and then flow out of the third cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一腔體</p>
        <p type="p">11:第一開放端</p>
        <p type="p">12:第一封閉端</p>
        <p type="p">13:進液管</p>
        <p type="p">14:氣液出口管</p>
        <p type="p">20:第二腔體</p>
        <p type="p">21:第二封閉端</p>
        <p type="p">22:第二開放端</p>
        <p type="p">25:透空槽</p>
        <p type="p">26:外側壁</p>
        <p type="p">30:第三腔體</p>
        <p type="p">31:第三入口端</p>
        <p type="p">32:第三出口端</p>
        <p type="p">40:進氣管</p>
        <p type="p">41:第一管部</p>
        <p type="p">411:進氣端</p>
        <p type="p">42:第二管部</p>
        <p type="p">421:出氣端</p>
        <p type="p">43:連接管部</p>
        <p type="p">44:連接件</p>
        <p type="p">C:中心軸</p>
        <p type="p">C41,C42:軸心</p>
        <p type="p">S10:第一空間</p>
        <p type="p">S20:第二空間</p>
        <p type="p">θ1:第一夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1821" publication-number="202633314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145937</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P70/00</main-classification>
        <further-classification edition="202601120260428B">H10P76/00</further-classification>
        <further-classification edition="202601120260428B">H10P74/00</further-classification>
        <further-classification edition="202601120260428B">H10P50/00</further-classification>
        <further-classification edition="200601120260428B">H05H1/24</further-classification>
        <further-classification edition="200601120260428B">C23C16/455</further-classification>
        <further-classification edition="200601120260428B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個例示性實施方式中，基板處理方法包含如下步驟：(a)向腔室內之基板支持部上提供基板，基板具備膜、及膜上之含金屬遮罩，含金屬遮罩包含至少1個開口，基板包含鹵素；及(b)將基板暴露於淨化氣體或自淨化氣體產生之電漿中，去除鹵素；且於(b)中，基板支持部之溫度未達160℃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MT1:基板處理方法(方法)</p>
        <p type="p">ST1~ST4,ST11~ST14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1822" publication-number="202631031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全罩式安全帽</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A42B3/18</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新井安全帽股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI HELMET, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井理夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, MICHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為，提供一種不易因衝擊而解除防護罩的保持之全罩式安全帽。  &lt;br/&gt;一種全罩式安全帽（1），其具備：全罩式之帽體（2）；防護罩（3），其對前述帽體（2）的前面開口（21）進行開啟閉合；及保持裝置（4），其保持前述防護罩（3）的閉合狀態，其中，前述防護罩（3）相對於前述帽體（2）藉由左右單獨或複合之軸可迴轉地被支撐，前述保持裝置（4）具有：掛止片（41），其設置於前述帽體（2）的下顎護罩部（22）的上部；被掛止片（42），其設置於前述防護罩（3）的下部，可掛止於前述掛止片（41）；及鎖定片（43），其防止被掛止於前述掛止片（41）之前述被掛止片（42）從前述掛止片（41）脫離，前述鎖定片（43）在鎖定位置與非鎖定位置之間可移動地安裝於前述掛止片（41）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:全罩式安全帽</p>
        <p type="p">2:帽體</p>
        <p type="p">21:前面開口</p>
        <p type="p">21a:內周緣</p>
        <p type="p">22:下顎護罩部</p>
        <p type="p">23:防護罩支撐構件</p>
        <p type="p">3:防護罩</p>
        <p type="p">4:保持裝置</p>
        <p type="p">41:掛止片</p>
        <p type="p">42:被掛止片</p>
        <p type="p">43:鎖定片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1823" publication-number="202631403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體排出頭、液體供應設備及物品製造方法</chinese-title>
        <english-title>LIQUID DISCHARGE HEAD, LIQUID SUPPLY APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B41J2/14</main-classification>
        <further-classification edition="200601120260430B">B41J2/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>猪股裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOMATA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種包括排出表面的液體排出頭，其中m個排出出口陣列設置在排出表面上，每個排出出口陣列通過在一個方向上以間距A排列多個排出出口而形成，每個排出出口被構造成排出液滴，並且m個排出出口陣列被佈置成在所述一個方向上偏移第一距離d&lt;sub&gt;1&lt;/sub&gt;並且在與所述一個方向垂直的方向上偏移第二距離d&lt;sub&gt;2&lt;/sub&gt;，並且在其中所述一個方向平行於預定方向的第一姿勢和其中所述一個方向相對於所述預定方向以角度θ傾斜的第二姿勢中的每個姿勢中，所有m個排出出口陣列上的排出出口在所述預定方向上以相等的間隔佈置。本公開還提供了液體供應設備和物品製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a liquid discharge head including a discharge surface, wherein m discharge outlet arrays are provided on the discharge surface, each discharge outlet array is formed by arraying, at a pitch A in one direction, a plurality of discharge outlets each configured to discharge a droplet, and the m discharge outlet arrays are arranged while being shifted in the one direction by a first distance d&lt;sub&gt;1&lt;/sub&gt; and in a direction perpendicular to the one direction by a second distance d&lt;sub&gt;2&lt;/sub&gt;, and in each of a first posture in which the one direction is parallel to a predetermined direction and a second posture in which the one direction is inclined at an angle θ with respect to the predetermined direction, the discharge outlets across all the m discharge outlet arrays are arranged at equal intervals in the predetermined direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5a:排出表面</p>
        <p type="p">51:噴嘴</p>
        <p type="p">52a:噴嘴陣列</p>
        <p type="p">52b:噴嘴陣列</p>
        <p type="p">52c:噴嘴陣列</p>
        <p type="p">52d:噴嘴陣列</p>
        <p type="p">A:距離</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:方向</p>
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:方向</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:第一距離</p>
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:第二距離</p>
        <p type="p">p&lt;sub&gt;1&lt;/sub&gt;:間距</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1824" publication-number="202632968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影元件及攝影裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260424B">H04N25/771</main-classification>
        <further-classification edition="202301120260424B">H04N25/772</further-classification>
        <further-classification edition="202301120260424B">H04N25/704</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田友希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種攝影元件，其具備：第1光電轉換部，其將光轉換為電荷；第2光電轉換部，其將光轉換為電荷；第1轉換部，其將基於以第1光電轉換部所轉換之電荷的訊號轉換為第1數位訊號；第2轉換部，其將基於以第2光電轉換部所轉換之電荷的訊號轉換為第2數位訊號；第1保持部，其保持以第1轉換部所轉換的第1數位訊號；第2保持部，其保持以第2轉換部所轉換的第2數位訊號；及連接部，其電性連接第1保持部與第2保持部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S101、S103、S105、S107、S109:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1825" publication-number="202631778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低自成核TPU</chinese-title>
        <english-title>TPU WITH LOW SELF-NUCLEATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/32</main-classification>
        <further-classification edition="200601120260504B">C08G18/42</further-classification>
        <further-classification edition="200601120260504B">C08G18/48</further-classification>
        <further-classification edition="200601120260504B">C08G18/66</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="201901120260504B">B29C48/00</further-classification>
        <further-classification edition="201901120260504B">B29C48/08</further-classification>
        <further-classification edition="200601320260504B">B29K75/00</further-classification>
        <further-classification edition="200601320260504B">B29L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波伊索特　艾爾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POESELT, ELMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>先達爾　艾德格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHANDER, EDGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪佛　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬特菲爾德　薩沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTFELD, SASCHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏爾霍恩　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHLHORN, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種熱塑性聚氨酯（TPU-1），其由多元醇組成物（PC）及異氰酸酯組成物（IC）獲得可或獲得，其中TPU-1之特徵在於根據DIN EN ISO 11357-3:2013使用動態掃描量熱法（DSC）測量之特定結晶行為。此外，本發明關於一種用於從該熱塑性聚氨酯製備製品之方法，以及一種根據本發明之熱塑性聚氨酯用於製備成型製品，較佳膜之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relate to a thermoplastic polyurethane (TPU-1) obtained or obtainable from a polyol compo-sition (PC) and an isocyanate composition (IC), wherein TPU-1 is characterized by a specific crystallization behav-ior measured using dynamic scanning calorimetry (DSC) according to DIN EN ISO 11357-3:2013. The present invention furthermore is directed to a process for preparing an article from said thermoplastic polyurethane as well as the use of a thermoplastic polyurethane according to the present invention for the preparation of a shaped article, preferably a film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1826" publication-number="202632323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G02B5/02</main-classification>
        <further-classification edition="200601120260425B">B32B3/30</further-classification>
        <further-classification edition="201501120260425B">G02B1/11</further-classification>
        <further-classification edition="200601120260425B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀬健策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, KENSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原慶峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有良好之防眩性及受到抑制之眩光的光學膜。  &lt;br/&gt;本發明設為一種光學膜，其於一表面具有凹凸形狀，上述光學膜具有凹凸形狀之一側之表面的依據JIS B0671-2：2002且將截止值λc設為0.08 mm時之核心部之負載長度率Mr1為20%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:光學膜</p>
        <p type="p">2a:光學膜之表面</p>
        <p type="p">3:透光性基材</p>
        <p type="p">4:防眩層</p>
        <p type="p">4a:防眩層之表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1827" publication-number="202631760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性樹脂皮膜、感光性乾薄膜及圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F290/06</main-classification>
        <further-classification edition="200601120260504B">C08F299/08</further-classification>
        <further-classification edition="200601120260504B">C08G77/50</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂組成物，其係包含：(A)含有下述式(A1)表示之重複單元及下述式(A2)表示之重複單元，於兩末端具有下述式(A3)表示之基，且重量平均分子量為3000~100000的聚合物；以及(B)光自由基產生劑；  &lt;br/&gt;&lt;img align="absmiddle" height="129px" width="514px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，X為下述式表示之二價基團；  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="218px" width="409px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1828" publication-number="202631831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物及圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G77/52</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/075</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口悠伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, YUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大森裕土</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMORI, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供包含(A)於主鏈具有矽伸苯基骨架、聚矽氧烷骨架及芴骨架，且於側鏈包含胺基甲酸酯鍵、羧基及丙烯醯基或甲基丙烯醯基之聚矽氧樹脂，以及(B)光自由基產生劑的感光性樹脂組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1829" publication-number="202631597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>４－吡啶酚衍生物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D401/12</main-classification>
        <further-classification edition="200601120260504B">C07D401/14</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/497</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＥＡ製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EA PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田剛士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, GOUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平濱俊哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAHAMA, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安達謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於4-吡啶酚衍生物。本發明的課題是提供具有17β-羥基類固醇脫氫酶13(HSD17B13)抑制活性的新型化合物。本發明的解決手段為下述通式(1)表示的化合物或其醫藥上容許的鹽。  &lt;br/&gt;　　  &lt;br/&gt;&lt;img align="absmiddle" height="244px" width="363px" file="ed10236.JPG" alt="ed10236.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1830" publication-number="202631512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結晶的製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING CRYSTAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C01G17/02</main-classification>
        <further-classification edition="200601120260429B">C30B25/02</further-classification>
        <further-classification edition="200601120260429B">C30B25/18</further-classification>
        <further-classification edition="200601120260429B">C23C18/12</further-classification>
        <further-classification edition="202601120260429B">H10P14/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帕天媞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATENTIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水悠吏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野愛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONO, AI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於產業上有利地製造適用於半導體之結晶。  &lt;br/&gt;本發明之解決手段為一種結晶之製造方法，其係藉由將原料進行反應以進行結晶成長而製造結晶，其中，前述原料係含有使二氧化鍺粉末溶解或分散於水者，藉由該製造方法來製造例如於半導體裝置(例如化合物半導體電子元件等)、電子零件與電機設備零件、光學與電子照相相關裝置、工業構件等中所使用之結晶等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is an object of the present invention to provide a method capable of industrially advantageous production of crystals useful for semiconductors. &lt;br/&gt;As a solution, the present invention provides a method for producing a crystal by reacting a raw material to cause crystal growth, wherein the raw material includes germanium dioxide powder dissolved or dispersed in water. By this production method, crystals used in, for example, semiconductor devices (such as compound semiconductor electronic devices), electronic components, electrical equipment parts, optical and electrophotographic apparatuses, and industrial members can be produced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">19:製膜裝置</p>
        <p type="p">20:被製膜試樣</p>
        <p type="p">21:試樣台座</p>
        <p type="p">22a:載體氣體源</p>
        <p type="p">22b:稀釋氣體源</p>
        <p type="p">23a:流量調節閥</p>
        <p type="p">23b:流量調節閥</p>
        <p type="p">24:原料區隔壁</p>
        <p type="p">24a:霧化用原料溶液</p>
        <p type="p">24b:超音波穿透基材</p>
        <p type="p">24c:台座</p>
        <p type="p">26:超音波振動件</p>
        <p type="p">27:製膜室</p>
        <p type="p">28:加熱器</p>
        <p type="p">30:霧化裝置</p>
        <p type="p">31:導引區隔壁</p>
        <p type="p">35:超音波傳遞液槽</p>
        <p type="p">36:超音波傳遞液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1831" publication-number="202632419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在不降低訊號雜訊比的情況下，降低微影光罩空中影像解析度的方法及其對應的光學系統</chinese-title>
        <english-title>METHOD FOR REDUCING THE RESOLUTION OF AN AERIAL IMAGE OF A PHOTOLITHOGRAPHY MASK WITHOUT REDUCING A SIGNAL-TO-NOISE RATIO AND CORRESPONDING OPTICAL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260423B">G03F1/84</main-classification>
        <further-classification edition="202401120260423B">G06T3/4092</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　卓爾　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DRIEL, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTT, JULIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是關於降低微影光罩(14)的空中影像解析度、而不降低訊號雜訊比的光學系統與方法，所述方法包含：利用一光學系統(10、10’)取得該微影光罩(14)的一空中影像，其中該微影光罩(14)的結構由一光源(12)照射並且藉由投影光學元件(17)投影至一相機的一影像感測器(20)，從而生成一空中影像，其中該相機的該影像感測器(20)的像素尺寸小於該光學系統(10、10’)的解析度極限所定義之尼奎斯特極限；對所取得的空中影像應用一抗混疊濾波器；以及對濾波後的空中影像降取樣，以得到具降低解析度的空中影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical system and a method for reducing the resolution of an aerial image of a photolithography mask (14) without reducing a signal-to-noise ratio, the method comprising: acquiring an aerial image of the photolithography mask (14) using an optical system (10’), in which structures of the photolithography mask (14) are illuminated by a light source (12) and projected onto an image sensor (20) of a camera by means of projection optics (17), thereby generating an aerial image, wherein a pixel size of the image sensor (20) of the camera is below a Nyquist limit defined by the resolution limit of the optical system (10’); applying an anti-aliasing filter to the acquired aerial image; and downsampling the filtered aerial image to obtain an aerial image of reduced resolution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10’:光學系統</p>
        <p type="p">12:光源</p>
        <p type="p">13:IR雷射</p>
        <p type="p">14:微影光罩</p>
        <p type="p">16:照明光學元件</p>
        <p type="p">17:投影光學元件</p>
        <p type="p">18:晶圓平面</p>
        <p type="p">19:投影部分</p>
        <p type="p">20:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1832" publication-number="202631165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預防或治療慢性疼痛的用途</chinese-title>
        <english-title>USE FOR PREVENTING OR TREATING CHRONIC PAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260504B">A61K35/744</main-classification>
        <further-classification edition="200601120260504B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益福生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENED BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳健誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧福勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種在有其需要的受試者中用於預防或治療慢性疼痛的方法，其包含對該受試者施用有效量的&lt;i&gt;Lactococcus lactis&lt;/i&gt; DSM 27109組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods for preventing or treating a chronic pain in a subject that includes administering an effective amount of a composition of &lt;i&gt;Lactococcus lactis&lt;/i&gt; DSM 27109 to the subject.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1833" publication-number="202631729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於烯烴聚合之齊格勒-納塔催化劑、聚烯烴製備方法及聚烯烴樹脂</chinese-title>
        <english-title>ZIEGLER-NATTA CATALYST FOR OLEFIN POLYMERIZATION, POLYOLEFIN PREPARATION METHOD, AND POLYOLEFIN RESIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C08F4/02</main-classification>
        <further-classification edition="200601120260429B">C08F4/654</further-classification>
        <further-classification edition="200601120260429B">C08F4/655</further-classification>
        <further-classification edition="200601120260429B">C08F4/649</further-classification>
        <further-classification edition="200601120260429B">C07C43/30</further-classification>
        <further-classification edition="200601120260429B">C07C69/40</further-classification>
        <further-classification edition="200601120260429B">C07F7/18</further-classification>
        <further-classification edition="200601120260429B">C08F10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權藝朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, YEA RANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭義甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOUNG, UI GAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹賢濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, HYUN JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露用於烯烴聚合之齊格勒-納塔催化劑包括：(i)用於烯烴聚合之齊格勒-納塔主催化劑，包括式1所示的鈦化合物、式2所示的鎂化合物、式3所示的第一內部電子予體、與至少一擇自式4及5所示的化合物所組成的群組的第二內部電子予體；(ii)式6所示的有機鋁化合物；以及(iii)式7所示的外部電子予體。亦揭露聚烯烴的製備方法與聚烯烴樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a Ziegler-Natta catalyst for olefin polymerization comprising: (i) a Ziegler-Natta pro-catalyst for olefin polymerization comprising a titanium compound represented by Formula 1, a magnesium compound represented by Formula 2, a first internal electron donor represented by Formula 3, and at least one second internal electron donor selected from the group consisting of compounds represented by Formulas 4 and 5; (ii) an organoaluminum compound represented by Formula 6; and (iii) an external electron donor represented by Formula 7, a polyolefin preparation method, and a polyolefin resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1834" publication-number="202632794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器端子、連接器和連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260424B">H01R12/72</main-classification>
        <further-classification edition="200601120260424B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商泰科電子（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙玉強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YUQIANG (THOMAS)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李前進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIANJIN (ORANDO)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開連接器端子、連接器和連接器組件。所述連接器端子包括第一端子和第二端子。第一端子包括：第一本體，呈片狀，具有在豎直方向上相對的上側和下側以及在縱向上相對的前側和後側；和第一插腳，與所述第一本體的下側相連。第二端子包括：第二本體，呈片狀，具有在豎直方向上相對的上側和下側以及在縱向上相對的前側和後側；和第二插腳，與所述第二本體的下側相連。所述第一本體和所述第二本體被層疊和固定在一起，所述第一插腳與對應的第二插腳組合在一起，以適於被同時插接到電路板上的同一個插孔中。本發明能夠提高電路板的通流密度，適用於空間受限的情況，擴大了連接器的應用範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器端子</p>
        <p type="p">10d:鉚接孔</p>
        <p type="p">10e:鉚接凸起</p>
        <p type="p">11a:第一弧形部</p>
        <p type="p">12:第二端子</p>
        <p type="p">12a:第二弧形部</p>
        <p type="p">110:第一本體</p>
        <p type="p">111:第一插腳</p>
        <p type="p">112:第一接觸彈臂</p>
        <p type="p">120:第二本體</p>
        <p type="p">121:第二插腳</p>
        <p type="p">122:第二接觸彈臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1835" publication-number="202632827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146111</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>斷路器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251215B">H02H3/087</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士電機機器制御股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI ELECTRIC FA COMPONENTS &amp; SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明能夠使控制電路加速開始動作。一種斷路器，包括：主電路；機械式開關，其對上述主電路的導通和切斷進行切換；半導體元件，其串聯連接在上述機械式開關的下游，對上述主電路的導通和切斷進行切換；感測器，其輸出與上述主電路中流動的電流相對應的信號；控制電路，其基於上述感測器的輸出信號，來檢測上述主電路中流動的電流；以及電源電路，其經由第一開關連接到上述機械式開關的上游，藉由上述第一開關的接通來向上述控制電路供電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主電路</p>
        <p type="p">1a:第一導電路徑</p>
        <p type="p">1b:第二導電路徑</p>
        <p type="p">11:端子</p>
        <p type="p">12:端子</p>
        <p type="p">13:端子</p>
        <p type="p">14:端子</p>
        <p type="p">21:感測器</p>
        <p type="p">30:機械式開關</p>
        <p type="p">31:機械觸點</p>
        <p type="p">32:機械觸點</p>
        <p type="p">41:半導體元件</p>
        <p type="p">41a:變阻器</p>
        <p type="p">60:控制電路</p>
        <p type="p">70:待機開關</p>
        <p type="p">80:電源電路</p>
        <p type="p">101:斷路器</p>
        <p type="p">D1:信號</p>
        <p type="p">I:電流</p>
        <p type="p">P:電力</p>
        <p type="p">S1:第一切換信號</p>
        <p type="p">S2:第二切換信號</p>
        <p type="p">Sw:預定的信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1836" publication-number="202633266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配置用於執行材料層之同時磊晶沉積之製程模組及此等製程模組的半導體處理系統</chinese-title>
        <english-title>PROCESS MODULES CONFIGURED FOR PERFORMING CONCURRENT EPITAXIAL DEPOSITION OF MATERIAL LAYERS AND SEMICONDUCTOR PROCESSING SYSTEMS SUCH PROCESS MODULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P14/24</main-classification>
        <further-classification edition="200601120260428B">C30B25/08</further-classification>
        <further-classification edition="200601120260428B">C30B25/00</further-classification>
        <further-classification edition="202601120260428B">H10P72/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彦夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YANFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇塔萊　安妮凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHITALE, ANIKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃勒奇　奧馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLEUCH, OMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪摩斯　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMOS, ALEXANDROS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿齊米　阿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZIMI, AMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫達拉　帕塔　薩拉西　雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDALA, PARTHA SARATHY REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　基肖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古　泰森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, TAISON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科塔　羅漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, ROHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種配置用於執行材料層之同時磊晶沉積的製程模組。此模組包含一共同腔室殼體，此共同腔室殼體具有安置於其內之兩個腔室主體。各腔室主體包括具有上部壁及下部壁之一陶瓷焊件、注入腔室凸緣及排出腔室凸緣以及具有內密封表面及外密封表面之排出凸緣。蓋板與此等排出凸緣之此等外密封表面形成密封。此模組的特徵亦在於具有活塞之壓力缸，此等活塞在此等排出腔室凸緣與此等注入腔室凸緣之間施加壓縮力。亦揭露一種包括此等製程模組之半導體處理系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process module configured for performing concurrent epitaxial deposition of material layers is disclosed. The module comprises a common chamber housing with two chamber bodies disposed within it. Each chamber body includes a ceramic weldment with upper and lower walls, injection and exhaust chamber flanges, and exhaust flanges with inner and outer sealing surfaces. Cover plates form seals with the outer sealing surfaces of the exhaust flanges. The module also features pressure cylinders with pistons that apply compressive forces between the exhaust and injection chamber flanges. A semiconductor processing system including such process modules are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:製程模組</p>
        <p type="p">118:第一基板</p>
        <p type="p">120:第一基板支撐件</p>
        <p type="p">122:第二基板</p>
        <p type="p">124:第二基板支撐件</p>
        <p type="p">308:第一腔室主體</p>
        <p type="p">310:第二腔室主體</p>
        <p type="p">314:中心平面</p>
        <p type="p">320:殼體側壁</p>
        <p type="p">322:冷卻劑通道，縱向冷卻劑通道</p>
        <p type="p">324:第一腔室外部</p>
        <p type="p">326:第一縱向隔板構件</p>
        <p type="p">328:第二縱向隔板構件</p>
        <p type="p">332:第二腔室外部</p>
        <p type="p">344:冷卻系統</p>
        <p type="p">402:第一製程容積</p>
        <p type="p">404:第二製程容積</p>
        <p type="p">406:第一上部加熱器陣列</p>
        <p type="p">408:第一燈殼體</p>
        <p type="p">410:第二上部加熱器陣列</p>
        <p type="p">412:第二燈殼體</p>
        <p type="p">414:第一複數個燈</p>
        <p type="p">416:第二複數個燈</p>
        <p type="p">418:第一下部加熱器陣列</p>
        <p type="p">420:第三燈殼體</p>
        <p type="p">422:第二下部加熱器陣列</p>
        <p type="p">424:第四燈殼體</p>
        <p type="p">426:第三燈</p>
        <p type="p">428:第四燈</p>
        <p type="p">430:第一上部壁</p>
        <p type="p">432:第二上部壁</p>
        <p type="p">434:第一下部壁</p>
        <p type="p">436:第二下部壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1837" publication-number="202631772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性樹脂組成物及包含其的成形體、以及電氣零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08G18/08</main-classification>
        <further-classification edition="200601120260422B">C08F2/50</further-classification>
        <further-classification edition="200601120260422B">C08F120/18</further-classification>
        <further-classification edition="200601120260422B">C08F290/00</further-classification>
        <further-classification edition="200601120260422B">C08K3/36</further-classification>
        <further-classification edition="201701120260422B">B29C64/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商恩普樂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENPLAS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高岩玲生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAIWA, REO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弦牧洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUMAKI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小橋一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBASHI, ITSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井奈奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, NANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種用於獲得兼具高強度與低熱膨脹率的成形體的光硬化性樹脂組成物。解決所述課題的光硬化性樹脂組成物包含多官能丙烯酸樹脂、二氧化矽粒子及光聚合起始劑。所述多官能丙烯酸樹脂包含20質量%以上且80質量%以下的多環式脂肪族型丙烯酸樹脂，且包含20質量%以上且80質量%以下的異氰脲酸型丙烯酸樹脂，所述二氧化矽粒子的50%平均粒子徑為30 nm以上且未滿1.0 μm，所述二氧化矽粒子的量相對於所述光硬化性樹脂組成物的總質量而為60質量%以上且未滿80質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1838" publication-number="202631881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C08L63/02</main-classification>
        <further-classification edition="200601120260429B">C08G59/22</further-classification>
        <further-classification edition="200601120260429B">C08G59/32</further-classification>
        <further-classification edition="200601120260429B">C08G59/42</further-classification>
        <further-classification edition="200601120260429B">C08K3/36</further-classification>
        <further-classification edition="200601120260429B">C08K7/22</further-classification>
        <further-classification edition="200601120260429B">C08K9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊遙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加茂博道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMO, HIROMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森野正行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORINO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種處置性及對窄縫隙之滲透性優異的硬化性組成物，其可形成電特性(低相對介電常數、低介電正切等)與耐濕性優異且亦具備有機械特性、絕緣性等的硬化物，而有用於半導體裝置之密封材、增層膜或底部填充材等電子零件裝置用途。&lt;br/&gt;    其解決手段為：一種硬化性組成物，包含環氧樹脂、具有胺基之硬化劑及經矽烷耦合劑進行表面處理之中空氧化矽粒子，前述矽烷耦合劑具有胺基或可與胺基進行加成反應之基；且，前述中空氧化矽粒子之平均粒徑(D50)為0.5µm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1839" publication-number="202633347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送裝置、基板搬送方法及電腦記憶媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P72/30</main-classification>
        <further-classification edition="202601120260421B">H10P72/50</further-classification>
        <further-classification edition="202601120260421B">H10W40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉井晟多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAI, SEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田朋宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 以高精度將基板搬送至目標位置。  &lt;br/&gt;　　[解決手段] 一種搬送基板的基板搬送裝置，其係被設置於與對前記基板進行熱處理的熱處理部共通的筐體內，對保持前記基板並使其旋轉以進行處理的旋轉處理部，搬送前記基板，該裝置具備支持前記基板並使其移動的搬送臂，以及控制前記搬送臂動作的控制部，前記控制部在前記熱處理部的處理溫度設定被變更時，取得前記旋轉處理部對前記基板進行收授之時，作為前記搬送臂位置的收授位置的補正量，根據自前記設定變更起的經過時間決定前記收授位置的補正方向，並基於前記取得的補正量與前記決定的補正方向，調整前記收授位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1840" publication-number="202632898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於雙電力軌記憶體之輸入保持</chinese-title>
        <english-title>INPUT HOLD FOR DUAL POWER RAIL MEMORIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03K3/3562</main-classification>
        <further-classification edition="200601120260504B">H03K19/0185</further-classification>
        <further-classification edition="200601120260504B">G11C11/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高斯　索尼亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, SONIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料擷取電路具有在一第一電壓域中提供之一第一鎖存器及亦在該第一電壓域中提供之一閘控電路。該閘控電路可經組態以在一第一時脈信號處於一第一傳訊狀態且一第二時脈信號處於一第二傳訊狀態時，將一輸入信號耦接至該第一鎖存器的一輸入。當該第一時脈信號處於一第三傳訊狀態或該第二時脈信號處於一第四傳訊狀態時，可停用該閘控電路。該第一時脈信號可經組態以控制該第一電壓域中之電路的時序，且該第二時脈信號可經組態以控制一第二電壓域中之電路的時序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data capture circuit has a first latch provided in a first voltage domain and a gating circuit also provided in the first voltage domain. The gating circuit may be configured to couple an input signal to an input of the first latch when a first clock signal is in a first signaling state and a second clock signal is in a second signaling state. The gating circuit may be disabled when the first clock signal is in a third signaling state or the second clock signal is in a fourth signaling state. The first clock signal may be configured to control timing of circuits in the first voltage domain and the second clock signal may be configured to control timing of circuits in a second voltage domain.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:介面</p>
        <p type="p">402:CX域</p>
        <p type="p">404:MX域</p>
        <p type="p">406:位準偏移電路</p>
        <p type="p">408:周邊電路</p>
        <p type="p">410:閘控反相器電路</p>
        <p type="p">412:主鎖存電路</p>
        <p type="p">414:第一反相器電路</p>
        <p type="p">416:第一回饋反相器電路</p>
        <p type="p">418:第二反相器電路</p>
        <p type="p">420:通道閘電路</p>
        <p type="p">422:從屬鎖存電路</p>
        <p type="p">424:第三反相器電路；第二反相器電路</p>
        <p type="p">426:第二回饋反相器電路</p>
        <p type="p">430:信號</p>
        <p type="p">432:輸入信號</p>
        <p type="p">434:輸入</p>
        <p type="p">436:輸出</p>
        <p type="p">442:輸出</p>
        <p type="p">444:輸入</p>
        <p type="p">446:輸出</p>
        <p type="p">450:clk&lt;sub&gt;MX&lt;/sub&gt;</p>
        <p type="p">452:clk&lt;sub&gt;CX&lt;/sub&gt;</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1841" publication-number="202631859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146187</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08K7/02</main-classification>
        <further-classification edition="200601120260504B">C08K9/04</further-classification>
        <further-classification edition="200601120260504B">C08L1/02</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C08J3/20</further-classification>
        <further-classification edition="200601120260504B">C08J5/06</further-classification>
        <further-classification edition="200601120260504B">D06M13/148</further-classification>
        <further-classification edition="200601320260504B">D06M101/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商寶理塑料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLYPLASTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板倉雅彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAKURA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今西慎一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMANISHI, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可獲得抑制經加熱成形所造成的再生纖維素纖維的著色、機械物性優良的成形物的樹脂組合物及其製造方法。  &lt;br/&gt;一種樹脂組合物，包含含有含多元醇的纖維安定劑（S）的再生纖維素纖維（A）、與熱塑性樹脂（B）。前述纖維安定劑（S）較佳附著於前述再生纖維素纖維（A）之表面的至少一部分、及／或浸透前述再生纖維素纖維（A）內部的至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1842" publication-number="202632389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏合劑及其製造和使用方法</chinese-title>
        <english-title>ADHESIVES AND METHODS OF MAKING AND USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">G02F1/061</main-classification>
        <further-classification edition="200601120260430B">C08F2/50</further-classification>
        <further-classification edition="200601120260430B">C09J9/02</further-classification>
        <further-classification edition="200601120260430B">C09J133/10</further-classification>
        <further-classification edition="200601120260430B">C09J4/02</further-classification>
        <further-classification edition="201801120260430B">C09J7/24</further-classification>
        <further-classification edition="200601120260430B">C09J11/06</further-classification>
        <further-classification edition="200601120260430B">C09D5/24</further-classification>
        <further-classification edition="202201120260430B">C09K23/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞格爾　艾莉兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEGEL, ARIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示描述出一種可使用來製造電光裝置的導電黏合劑組成物。該組成物包括丙烯酸或甲基丙烯酸寡聚物、丙烯酸酯單體、二醇醚共溶劑及用於UV固化的光起始劑。這些黏合劑能夠有較薄的黏合層，同時穿越寬的溫度範圍維持優良的導電性。亦描述出使用這些黏合劑組成物之製造的物件及電泳顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure describes conductive adhesive compositions that can be used to fabricate electro-optic devices. The compositions include acrylic or methacrylic oligomers, acrylate monomers, glycol ether co-solvents, and photoinitiators for UV curing. These adhesives enable thinner adhesive layers while maintaining excellent electrical conductivity across a wide temperature range. Articles of manufacture and electrophoretic displays using these adhesive compositions are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1843" publication-number="202631037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾輪袋及其滾輪支撐組合件</chinese-title>
        <english-title>ROLLING BAG AND ROLLING SUPPORT ASSEMBLY THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A45C3/00</main-classification>
        <further-classification edition="200601120260429B">A47C9/10</further-classification>
        <further-classification edition="200601120260429B">B65D30/16</further-classification>
        <further-classification edition="200601120260429B">B65D30/20</further-classification>
        <further-classification edition="200601120260429B">B60B33/02</further-classification>
        <further-classification edition="200601120260429B">B60B33/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商寇德芬恩國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CODEFINE INTERNATIONAL SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛那希　皮耶羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHINASI, PIERO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種滾輪袋(B)，其包括一可折疊容器主體(10)，該主體由織物面板的組合件製成，該等織物面板連接在一起來形成至少一個底面(15)及一側壁(11-14)包含四個側面(11、12、13、14)，當該可折疊容器主體(10)處於一展開狀態時，其共同界定出一內部儲存容積。該滾輪袋(B)進一步包括一可拆卸滾輪支撐組合件(S)，用於在該展開狀態下為該可折疊容器主體(10)提供滾輪支撐，該滾輪支撐組合件(S)包括一支撐板(P)及設置在該支撐板(P)的底面上之複數個腳輪(W)。每個腳輪(W)包括一卡入式腳輪組合件(100)，該腳輪組合件包括至少部分地延伸穿過該支撐板(P)的厚度之一旋轉軸(100A)，以及該支撐板(P)包括複數個支撐嵌件(200)，每個支撐嵌件(200)配置成與相應的一卡入式腳輪組合件(100)的該旋轉軸(100A)配合，並使該旋轉軸在組裝期間自動鎖定至該支撐板(P)上。每個支撐嵌件(200)包括一安裝孔(200A)，該安裝孔的形狀及尺寸設計成容納該旋轉軸(100A)，並使該旋轉軸(100A)鎖定在該安裝孔(200A)內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is described a rolling bag (B) comprising a collapsible container body (10) made of an assembly of fabric panels that are joined together to form at least a bottom side (15) and a sidewall (11-14) including four lateral sides (11, 12, 13, 14) that jointly define an inner storage volume when the collapsible container body (10) takes an expanded state. The rolling bag (B) further comprises a removable rolling support assembly (S) to provide rolling support for the collapsible container body (10) in the expanded state, the rolling support assembly (S) including a support plate (P) and a plurality of caster wheels (W) provided on an underside of the support plate (P). Each caster wheel (W) includes a click-in caster wheel assembly (100) comprising a swivel axis (100A) extending at least partly through a thickness of the support plate (P), and the support plate (P) includes a plurality of supporting inserts (200) that are each configured to cooperate with the swivel axis (100A) of a corresponding one of the click-in caster wheel assemblies (100) and cause it to automatically latch onto the support plate (P) during assembly. Each supporting insert (200) comprises a mounting aperture (200A) shaped and dimensioned to receive the swivel axis (100A) and cause latching of the swivel axis (100A) inside the mounting aperture (200A).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滾輪袋B或B’的可折疊容器主體</p>
        <p type="p">11:可折疊容器主體10的(第一)短側面(側壁11-14的一部分)</p>
        <p type="p">12:可折疊容器主體10的(第一)長側面(亦稱為「正面」)(側壁11-14的一部分)</p>
        <p type="p">13:可折疊容器主體10的(第二)短側面(側壁11-14的一部分)</p>
        <p type="p">14:可折疊容器主體10的(第二)長側面(亦稱為「背面」)(側壁11-14的一部分)</p>
        <p type="p">15:可折疊容器主體10的底面</p>
        <p type="p">16:可折疊容器主體10的頂面</p>
        <p type="p">17:構成可折疊容器主體10的頂面16之一個整體部分的可卸除蓋板(永久附接至例如長側面14)</p>
        <p type="p">B:滾輪袋(第一實施例)</p>
        <p type="p">F:在每個短側面11,13上形成角板折痕</p>
        <p type="p">H:側把手</p>
        <p type="p">H2:把手</p>
        <p type="p">P:支撐板</p>
        <p type="p">S:可拆卸地附接至可折疊容器主體10的底面15之滾輪支撐組合件</p>
        <p type="p">W:設置在支撐板P的底面上之腳輪</p>
        <p type="p">ZP:用於將蓋板17可卸除地附接至其餘側面11,12,13的拉鍊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1844" publication-number="202631541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熔射皮膜、其形成方法，及熔射構件</chinese-title>
        <english-title>SPRAYED FILM, METHOD FOR FORMING SAME, AND SPRAYED MEMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C04B35/50</main-classification>
        <further-classification edition="200601120260428B">C23C14/34</further-classification>
        <further-classification edition="200601120260428B">C23C4/04</further-classification>
        <further-classification edition="201601120260428B">C23C4/11</further-classification>
        <further-classification edition="201601120260428B">C23C4/134</further-classification>
        <further-classification edition="202001120260428B">C01F17/20</further-classification>
        <further-classification edition="202601120260428B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村龍星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, RYUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, NOBORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口友悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, YUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本侑季美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, YUKIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚谷敏彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKATANI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村裕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村成亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHIGEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸小滉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUKO, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[解決手段]一種熔射皮膜，其特徵為具有膜表面，該膜表面在由利用雷射之非接觸式所成之膜表面之形狀量測中，將上述膜表面之量測表面(S-L表面)之一個評估區域內之表面積S(μm&lt;sup&gt;2&lt;/sup&gt;)除以基準表面之上述一個評估區域內之面積A(μm&lt;sup&gt;2&lt;/sup&gt;)而得之面積比S/A之值為1.75以上3以下，且上述量測表面(S-L表面)之上述一個評估區域內之表面粗糙度Sa為0.4μm以上8μm以下，其中該基準表面為位於上述量測表面(S-L表面)之算術平均之高度之平面。  &lt;br/&gt;　　[效果]根據本發明之熔射皮膜及熔射構件，使用熔射皮膜作為耐腐蝕性皮膜，在進行以半導體製造裝置等使用氣體電漿之乾式蝕刻時，能減少熔射皮膜之裂紋所導致之顆粒產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sprayed film including a film surface in which a value of an area ratio S/A obtained by dividing a surface area S (µm&lt;sup&gt;2&lt;/sup&gt;) of a portion of the measurement surface (S-L surface) of the film surface within one evaluation region by an area A (µm&lt;sup&gt;2&lt;/sup&gt;) of a portion of a reference surface forming a plane located at an arithmetic average height of the measurement surface (S-L surface), which is within the evaluation region is 1.75 or more and 3 or less, and a surface roughness Sa of a portion of the measurement surface (S-L surface) within the evaluation region is 0.4 µm or more and 8 µm or less. &lt;br/&gt; Generation of particles which is caused by cracks of the sprayed film can be reduced when dry etching using gas plasma is performed with a semiconductor manufacturing apparatus or the like using the sprayed film as a corrosion-resistant film.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1845" publication-number="202632253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多面拍攝系統及運用其之多面外觀檢查系統及外觀檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G01N21/88</main-classification>
        <further-classification edition="200601120260423B">G01N21/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商輝視科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤秋久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, AKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田涼司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, RYOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由1個圖像處理實現必須有複數個拍攝手段的全周檢查或多面檢查，而將檢查系統輕便化，減低設備成本。  &lt;br/&gt;　　一種多面拍攝系統，具備：拍攝部(1)，具備照明拍攝對象物(W)的照明手段(15)及在前述拍攝對象物的周圍相隔距離配置的複數個拍攝單元(10)；拍攝控制部(2)，具備控制拍攝單元的拍攝單元控制部(22)、及將複數個拍攝單元取得的來自前述拍攝對象物的複數個圖像訊號予以合成而作成單一的合成圖像的圖像合成部(21)；通訊手段(3)，連接拍攝部與拍攝控制部。拍攝單元，具備拍攝手段、配置於拍攝手段的光軸上而相對於該光軸旋轉可動的平面鏡、以及保持前述拍攝手段及前述平面鏡的拍攝手段保持部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多面拍攝系統</p>
        <p type="p">W:拍攝對象物，檢查對象物</p>
        <p type="p">1:拍攝部</p>
        <p type="p">2:拍攝控制部</p>
        <p type="p">3:通訊手段</p>
        <p type="p">10(10a~10f):拍攝單元</p>
        <p type="p">11(11a~11f):拍攝手段</p>
        <p type="p">12(12a~12f):拍攝單元保持部</p>
        <p type="p">15:照明手段</p>
        <p type="p">21:圖像合成部</p>
        <p type="p">22:拍攝單元控制部</p>
        <p type="p">23:資訊記憶部</p>
        <p type="p">24:顯示裝置</p>
        <p type="p">25:輸入裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1846" publication-number="202631792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高導電性物品成形用組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G61/12</main-classification>
        <further-classification edition="200601120260504B">C08L65/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/05</further-classification>
        <further-classification edition="200601120260504B">C08K5/06</further-classification>
        <further-classification edition="200601120260504B">H01B1/12</further-classification>
        <further-classification edition="200601120260504B">H01B1/20</further-classification>
        <further-classification edition="200601120260504B">H01B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大八化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIHACHI CHEMICAL INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑井智裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATAI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐山佳保里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIYAMA, KAHORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長崎海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAKI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其用於成形具有高導電性之導電性物品。本發明提供一種組合物，其包含下述通式(A)之聚噻吩化合物及低級醇系化合物，且用於成形導電性物品。本發明亦提供一種使用該組合物而成形導電性物品之方法。於通式(A)中，L為伸烷基等。M&lt;sup&gt;1&lt;/sup&gt;及M&lt;sup&gt;2&lt;/sup&gt;分別獨立地為烷基、或氫原子。R&lt;sup&gt;1A&lt;/sup&gt;為氫原子、烷基、烷氧基、醯基或式(15)所表示之基。L&lt;sup&gt;1&lt;/sup&gt;、M&lt;sup&gt;1c&lt;/sup&gt;、M&lt;sup&gt;2c&lt;/sup&gt;分別與L、M&lt;sup&gt;1&lt;/sup&gt;、M&lt;sup&gt;2&lt;/sup&gt;相同。  &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="427px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1847" publication-number="202632708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路遮斷器</chinese-title>
        <english-title>CIRCUIT BREAKER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01H73/20</main-classification>
        <further-classification edition="200601120260312B">H01H73/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士電機機器制御股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI ELECTRIC FA COMPONENTS &amp; SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀨高峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, TAKAMINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長嶺一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMINE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種電路遮斷器，其能謀求組裝成本的削減及小型化，且能透過防止滑動觸壓彈簧之一部分脫落至滑動接觸件的軸孔與轉動軸之間的間隙，從而謀求通電安定性。  &lt;br/&gt;　　[解決手段]支架單元(12)為在支架殼(40)中被收納有：一對滑動接觸件(31、31)，被配置為夾入可動接觸件(11)的基端部(11b)之兩側面；轉動軸(23)，貫通形成在可動接觸件的基端部的第一軸孔(11c)及設置於一對滑動接觸件的第二軸孔(33、33)；以及一對滑動觸壓彈簧(25、25)，由螺旋彈簧構成；滑動觸壓彈簧是具備：縮徑螺旋部(25c)，卷繞在轉動軸的外周；以及擴徑螺旋部(25a)，接觸比第二軸孔還在外徑側的滑動接觸件之外表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit breaker includes a holder unit having a holder case. The holder case accommodates a pair of sliding contactors, a rotating shaft, and a pair of sliding contact pressure springs therein. The pair of sliding contactors are arranged to sandwich opposite lateral surfaces of a base end portion of a movable contactor. The rotating shaft extends through a first shaft hole formed in the base end portion of the movable contactor and second shaft holes formed in the pair of sliding contactors. Each of the pair of sliding contact pressure springs is constituted by a coil spring. The each of the pair of sliding contact pressure springs includes a reduced-diameter coiled portion wound around the outer periphery of the rotating shaft, and an increased-diameter coiled portion in contact with a portion of an outer surface of a corresponding sliding contactor which portion is radially outward of the second shaft hole thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11b:基端部</p>
        <p type="p">11c:軸孔</p>
        <p type="p">12:支架單元</p>
        <p type="p">23:轉動軸</p>
        <p type="p">24:可動件觸壓彈簧</p>
        <p type="p">24a:觸壓螺旋部</p>
        <p type="p">25:滑動觸壓彈簧</p>
        <p type="p">25a,25b:擴徑螺旋部</p>
        <p type="p">25c:縮徑螺旋部</p>
        <p type="p">31:滑動接觸件</p>
        <p type="p">32a,32b:軸支承孔</p>
        <p type="p">33:軸孔</p>
        <p type="p">40:支架殼</p>
        <p type="p">41:支架殼的內壁</p>
        <p type="p">42:環狀槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1848" publication-number="202631822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物及其硬化物、成形物、顯示裝置以及固體攝像元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G75/08</main-classification>
        <further-classification edition="200601120260504B">C08L81/02</further-classification>
        <further-classification edition="200601120260504B">C08K5/50</further-classification>
        <further-classification edition="200601120260504B">C08K5/55</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺津悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATSU, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出崎光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZAKI, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其能夠形成顯示出較高之折射率且耐黃變性優異之硬化物，進而具有良好之保存穩定性。  &lt;br/&gt;本發明提供一種組合物，其含有：化合物(A)，其具有環硫乙烷基或環硫丙烷基；酸產生劑(B)；及三芳基膦化合物(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1849" publication-number="202632014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合微粒子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C22C9/00</main-classification>
        <further-classification edition="200601120260429B">C09D5/24</further-classification>
        <further-classification edition="200601120260429B">C08F212/02</further-classification>
        <further-classification edition="200601120260429B">C08F120/18</further-classification>
        <further-classification edition="200601120260429B">C08K5/053</further-classification>
        <further-classification edition="202201120260429B">B22F1/0545</further-classification>
        <further-classification edition="202201120260429B">B22F1/065</further-classification>
        <further-classification edition="200601120260429B">H01B1/22</further-classification>
        <further-classification edition="200601120260429B">D06M13/338</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木佑京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, UKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江山誉昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYAMA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中係關於一種複合微粒子，其係銅微粒子之表面之至少一部分經分散劑被覆者，上述複合微粒子之平均粒徑D50為50 nm以上350 nm以下，於上述複合微粒子之個數基準之粒徑柱狀圖中，累計頻度為10%時之粒徑D10與累計頻度為90%時之粒徑D90滿足D90/D10≦4.0之關係，上述分散劑係具有羧基且包含下述式(1)所表示之結構之乙烯系聚合物。下述式(1)中，R&lt;sup&gt;1&lt;/sup&gt;係氫原子或甲基，R&lt;sup&gt;2&lt;/sup&gt;係包含環式結構之有機基或包含具有碳數為3以上之直鏈之鏈式結構之有機基。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="145px" width="213px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1850" publication-number="202631557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法、及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C25/18</main-classification>
        <further-classification edition="200601120260504B">C07C309/39</further-classification>
        <further-classification edition="200601120260504B">C07C309/42</further-classification>
        <further-classification edition="200601120260504B">C07C317/28</further-classification>
        <further-classification edition="200601120260504B">C07C381/00</further-classification>
        <further-classification edition="200601120260504B">C07C381/12</further-classification>
        <further-classification edition="200601120260504B">C07D211/22</further-classification>
        <further-classification edition="200601120260504B">C07D211/46</further-classification>
        <further-classification edition="200601120260504B">C07D211/54</further-classification>
        <further-classification edition="200601120260504B">C07D213/80</further-classification>
        <further-classification edition="200601120260504B">C07D265/30</further-classification>
        <further-classification edition="200601120260504B">C07D327/06</further-classification>
        <further-classification edition="200601120260504B">C07D405/04</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/32</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤亮祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子明弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋智美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SATOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤研由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物形成的光阻膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法、及電子器件之製造方法、以及化合物（A），上述感光化射線性或感放射線性樹脂組成物含有由特定式表示的化合物（A）、與化合物（A）不同的光酸產生劑（B）、及樹脂（C）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1851" publication-number="202632756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合材料、正極及電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01M4/38</main-classification>
        <further-classification edition="201701120260421B">C01B32/20</further-classification>
        <further-classification edition="201001120260421B">H01M10/0525</further-classification>
        <further-classification edition="201001120260421B">H01M10/0562</further-classification>
        <further-classification edition="200601120260421B">C01G1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宜教之
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之複合材料具備碳-硫複合體與形成於碳-硫複合體之表面的保護層。碳-硫複合體包含多孔質碳材料與擔載於多孔質碳材料上的硫材料。保護層係以非石墨質碳及碳前驅物的至少一者作為主成分，膜厚為0.5nm以上，微晶尺寸Lc為4.1～8.0nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1852" publication-number="202632761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合材料、正極及電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260424B">H01M4/583</main-classification>
        <further-classification edition="200601120260424B">H01M4/36</further-classification>
        <further-classification edition="201001120260424B">H01M4/136</further-classification>
        <further-classification edition="201001120260424B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宜教之
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之複合材料具備碳-硫複合體與形成於碳-硫複合體之表面的保護層。碳-硫複合體包含多孔質碳材料與擔載於多孔質碳材料上的硫材料。保護層係以非石墨質碳及碳前驅物的至少一者作為主成分，膜厚為1.0nm以上，微晶尺寸Lc為1.0～4.0nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1853" publication-number="202631078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧型手機用光學附件、及該光學附件與智慧型手機的組合構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61B3/135</main-classification>
        <further-classification edition="200601120260504B">A61B3/14</further-classification>
        <further-classification edition="200601120260504B">G02B27/02</further-classification>
        <further-classification edition="202101120260504B">G03B17/00</further-classification>
        <further-classification edition="202101120260504B">G03B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＯＵＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水映輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, EISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横岩良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOIWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種智慧型手機用光學附件，即使在智慧型手機的光源與攝影用相機鏡頭之位置遠離之情況下，亦能對受驗者的眼部照射狹縫光。  &lt;br/&gt;　　一種可拆卸地裝設於智慧型手機(50)的光學附件(10)，其具備：框體(1)，其與設有光源(52)及前述攝影用相機鏡頭(53)之一側的邊卡合而被保持於智慧型手機(50)；凸透鏡(2)，其在框體(1)的外表面中，設置在光源及攝影用相機鏡頭側的前面(1a)，且當智慧型手機(50)被保持於框體(1)時，位於攝影用相機鏡頭(53)的前方而對受驗者的眼部進行對焦；狹縫光形成部(4)，其設置在與前面(1a)相同之面，且當智慧型手機(50)被保持於框體(1)時，位於凸透鏡(2)的斜前方，將從光源(52)發出之光作為狹縫光(8)而照射至受驗者的眼部；及光波導路(3)，其將從光源(52)發出之光傳播至狹縫光形成部(4)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:框體(附件框體)</p>
        <p type="p">1a:前面(前面板)</p>
        <p type="p">1b:上面(上面板)</p>
        <p type="p">1c:側面(側面板)</p>
        <p type="p">2:凸透鏡</p>
        <p type="p">3c:蓋體</p>
        <p type="p">4:狹縫光形成部</p>
        <p type="p">7:圓柱透鏡(第2圓柱透鏡)</p>
        <p type="p">10:光學附件(智慧型手機用光學附件)</p>
        <p type="p">11:支持構件(支撐滾輪)</p>
        <p type="p">50:智慧型手機(智慧型手機)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1854" publication-number="202632172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管塞及耦合組件</chinese-title>
        <english-title>PLUG AND COUPLING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F16L37/04</main-classification>
        <further-classification edition="200601120260129B">F16L37/086</further-classification>
        <further-classification edition="200601120260129B">F16L37/098</further-classification>
        <further-classification edition="200601120260129B">F16L37/12</further-classification>
        <further-classification edition="200601120260129B">F16L37/248</further-classification>
        <further-classification edition="200601120260129B">F16L47/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健策精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭善雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHAN YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虞晉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴于淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡逸辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐妤婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管塞具有空腔以及位於空腔之相反兩端之前開口以及後開口。管塞包含管塞主體、管塞後端子以及活塞。管塞主體包含自管塞主體之外表面凸起之環狀卡鈎。前開口定義管塞主體之前端面。管塞後端子連接管塞主體。後開口位於管塞後端子之遠離管塞主體之一端。活塞設置於空腔中。活塞包含活塞主體、塞頭以及至少三延伸部。活塞主體具有錐面。塞頭設置於活塞主體上。至少三延伸部連接活塞主體之錐面上。至少三延伸部自活塞主體之錐面遠離塞頭延伸。至少三延伸部之間定義缺口位於活塞主體之遠離塞頭之一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plug has a cavity and a front opening and a rear opening located at two opposite ends of the cavity. The plug includes a plug main body, a plug rear terminal, and a piston. The plug main body includes a circumferential hook raised from an outer surface of the plug main body. The front opening defines a front end surface of the plug main body. The plug rear terminal is connected to the plug main body. The rear opening is located at an end of the plug rear terminal away from the plug main body. The piston is disposed in the cavity. The piston includes a piston main body, a piston head, and at least three extending portions. The piston main body has a cone surface. The piston head is disposed on the piston main body. The at least three extending portions are connected to the cone surface of the piston main body. The at least three extending portions extend away from the piston head from the cone surface of the piston main body. A notch is defined among the at least three extending portions and is located at a side of the piston main body away from the piston head.</p>
      </isu-abst>
      <representative-img>
        <p type="p">340:活塞</p>
        <p type="p">342:活塞主體</p>
        <p type="p">343:塞頭</p>
        <p type="p">344:活塞凹槽</p>
        <p type="p">345:錐面</p>
        <p type="p">346:延伸部</p>
        <p type="p">346a:抵靠面</p>
        <p type="p">346r:穹面</p>
        <p type="p">347:缺口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1855" publication-number="202632173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管座及耦合組件</chinese-title>
        <english-title>SOCKET AND COUPLING ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">F16L37/04</main-classification>
        <further-classification edition="200601120260129B">F16L37/086</further-classification>
        <further-classification edition="200601120260129B">F16L37/098</further-classification>
        <further-classification edition="200601120260129B">F16L37/12</further-classification>
        <further-classification edition="200601120260129B">F16L37/248</further-classification>
        <further-classification edition="200601120260129B">F16L47/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健策精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭善雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHAN YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虞晉瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIN JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴于淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡逸辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐妤婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管座包含管座主體以及桿件。管座主體具有空腔以及位於空腔之相反兩端之前開口以及後開口。管座主體進一步具有貫穿管座主體之穿槽。桿件設置於空腔中。桿件包含桿體、桿頭、數個弧狀支撐骨承靠底部以及錐體。桿頭設置於桿體之一端。數個弧狀支撐骨自桿體之另一端延伸。數個弧狀支撐骨中之每一者於管座主體之軸向以及徑向上遠離桿體延伸。承靠底部連接數個弧狀支撐骨。錐體設置於桿體的連接數個弧狀支撐骨的一端上並遠離桿體延伸。數個弧狀支撐骨中之每兩者與承靠底部共同定義流道開口。錐體的頂點位於錐體之遠離桿體之一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A socket includes a socket main body and a stem. The socket main body has a cavity and a front opening and a rear opening located on two opposite ends of the cavity. The socket main body further has a through slot running through the socket main body. The stem includes a stem body, a stem head, a plurality of arc-shaped supporting bones, an abutting bottom portion, and a cone body. The stem head is disposed at an end of the stem body. The arc-shaped supporting bones extend from the other end of the stem body. Each of the arc-shaped supporting bones extends away from the stem body in an axial direction and a radial direction of the socket main body. The abutting bottom portion is connected to the arc-shaped supporting bones. The cone body is disposed at an end of the stem body connected to the arc-shaped supporting bones and extends away from the stem body. Every two of the arc-shaped supporting bones and the abutting bottom portion jointly define a fluid passageway opening. An apex of the cone body is located at an end of the cone body away from the stem body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">370:桿件</p>
        <p type="p">372:桿體</p>
        <p type="p">373:桿頭</p>
        <p type="p">373a,376a:前表面</p>
        <p type="p">374:桿頭凹槽</p>
        <p type="p">375:弧狀支撐骨</p>
        <p type="p">376:承靠底部</p>
        <p type="p">376b:後表面</p>
        <p type="p">377:錐體</p>
        <p type="p">OP:流道開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1856" publication-number="202631853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電磁波遮罩用組合物及適用其之電磁波遮罩型電路基板</chinese-title>
        <english-title>ELECTROMAGNETIC WAVE SHIELDING COMPOSITION AND ELECTROMAGNETIC WAVE SHIELDING CIRCUIT BOARD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08K3/08</main-classification>
        <further-classification edition="200601120260504B">C08K9/02</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C08L1/28</further-classification>
        <further-classification edition="200601120260504B">H05K9/00</further-classification>
        <further-classification edition="200601120260504B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商斯天克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEMCO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林在俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JAE JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雲培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOON BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種電磁波遮罩用組合物。由此，適合於遮罩自電子元件所產生之電磁波，並可以以薄厚度實現，即使其被適用之表面為可彎折之柔性材質，亦能防止因形狀變形而產生之裂紋、翹起或剝離，因而具有優異之密著性及耐久性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基底膜</p>
        <p type="p">20:配線圖樣</p>
        <p type="p">21:接地配線</p>
        <p type="p">22:訊號配線</p>
        <p type="p">30:電磁波遮罩層</p>
        <p type="p">31:第一粒子</p>
        <p type="p">32:第二粒子</p>
        <p type="p">33:電磁波遮罩成分</p>
        <p type="p">34:黏著劑成分</p>
        <p type="p">40:保護層</p>
        <p type="p">100:電磁波遮罩型柔性電路基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1857" publication-number="202631259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146296</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於噴淋裝置的流量控制方法、設備及介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B05B1/30</main-classification>
        <further-classification edition="200601120260430B">G05D7/00</further-classification>
        <further-classification edition="200601120260430B">B08B3/04</further-classification>
        <further-classification edition="202601120260430B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昊坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAOKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳福平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FUPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於噴淋裝置的流量控制方法、設備及介質，該流量控制方法包括設定噴淋裝置的出液口的目標出液流量；確定噴淋裝置內的預定液位高度；向噴淋裝置的進液口通入至少兩種藥液，以使至少兩種藥液在噴淋裝置內混合形成混合液，進液口進液的同時，出液口排出混合液；以及控制進液口的進液流量，使得當進液口的進液時長為第一預定時長時，噴淋裝置內的液位高度增長至預定液位高度，且進液流量等於目標出液流量，出液口的出液流量接近或等於目標出液流量，以使噴淋裝置內混合液的混合時長為第二預定時長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A1~A4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1858" publication-number="202633428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有導接疊孔的基板及其製造方法</chinese-title>
        <english-title>SUBSTRATE HAVING STACK VIA AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頎邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPBOND TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, LUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUNG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俊廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有導接疊孔的基板，其包含一第一介電層、一第一導接層、一第一導電材、一第二介電層、一第二導接層及一第二導電材，藉由形成於該第一介電層中的該第一導接層、該第一導電材及形成於該第二介電層中的該第二導接層及該第二導電材構成一導接疊孔，其可在製造過程中避免形成該第一介電層及該第二介電層的介電材料殘留在該導接疊孔中，以避免該第二導接層無法電性連接該第一導電材，且使該第一導電材與該第一導接層的接觸面積、該第二導接層及該第二導電材的接觸面積可符合電性傳輸的規格要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate having stack via includes a first dielectric layer, a first conductive layer, a first conductive material, a second dielectric layer, a second conductive layer and a second conductive material. The first conductive layer and the first conductive material formed in the first dielectric layer, and the second conductive layer and the second conductive material formed in the second dielectric layer are formed of a stack via. Dielectric material used to form the first and second dielectric layers will not remain in the stack via during manufacturing. Thus, the second conductive layer can be electrically connected to the first conductive material, the contact area between the first conductive layer and the first conductive material and the contact area between the second conductive layer and the second conductive material can satisfy specification requirements for electrical transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">110:導接層</p>
        <p type="p">120:線路層</p>
        <p type="p">130:第一介電層</p>
        <p type="p">140:第一導接層</p>
        <p type="p">150:第一導電材</p>
        <p type="p">160:第二介電層</p>
        <p type="p">170:第二導接層</p>
        <p type="p">180:第二導電材</p>
        <p type="p">SV:導接疊孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1859" publication-number="202632055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜用分散液之製造系統、霧成膜裝置、及成膜方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C23C16/448</main-classification>
        <further-classification edition="200601120260430B">B05B17/06</further-classification>
        <further-classification edition="202601120260430B">H10P14/42</further-classification>
        <further-classification edition="202301120260430B">H10K71/10</further-classification>
        <further-classification edition="202201120260430B">B01F23/213</further-classification>
        <further-classification edition="201101120260430B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼頭義昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西康孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥井公太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種成膜用分散液之製造系統，其具有收容槽，上述收容槽具有供給口，上述供給口向上述收容槽內供給第1霧，該第1霧係使包含第1粒子之第1分散液霧化而得者，上述收容槽收容上述第1霧液化而成之液體作為第2分散液，上述供給口配置於上述第2分散液之液中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:霧產生部</p>
        <p type="p">12:外部容器</p>
        <p type="p">14:內部容器</p>
        <p type="p">16,72:蓋材</p>
        <p type="p">18:霧排出口</p>
        <p type="p">20:超音波振子</p>
        <p type="p">22:氣體流入管</p>
        <p type="p">24:氣體流入口</p>
        <p type="p">38:傳輸液體</p>
        <p type="p">40,80:粒子</p>
        <p type="p">42:分散介質</p>
        <p type="p">45,82:分散液</p>
        <p type="p">50:霧</p>
        <p type="p">55:載氣</p>
        <p type="p">60:收容部</p>
        <p type="p">62:供給口</p>
        <p type="p">70:收容槽</p>
        <p type="p">76:排出口</p>
        <p type="p">78:排出管</p>
        <p type="p">90:連結管</p>
        <p type="p">100:成膜用分散液之製造系統</p>
        <p type="p">XYZ:正交座標系</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1860" publication-number="202632273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>免疫層析試驗片</chinese-title>
        <english-title>IMMUNOCHROMATOGRAPHIC TEST STRIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G01N33/531</main-classification>
        <further-classification edition="200601120260425B">G01N33/543</further-classification>
        <further-classification edition="200601120260425B">G01N33/548</further-classification>
        <further-classification edition="200601120260425B">G01N33/558</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原友樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤亜衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, AI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">免疫層析試驗片（100）具有：樣品墊（101），導入試樣；及檢測部（103），檢測試樣中的被檢測物質，在檢測部（103）中，在免疫層析試驗片（100）擔載有：與被檢測物質特異性結合之蛋白質性或肽性捕獲物質；及選自由三糖類以上的糖類及多糖類組成之群中之至少一種糖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The immunochromatographic test strip (100) comprises a sample pad (101) into which a sample is introduced, and a detection section (103) for detecting a substance to be detected in the sample, wherein in the detection section (103), the immunochromatographic test strip (100) carries a proteinaceous or peptidic capture substance that specifically binds to the substance to be detected, and at least one sugar selected from a group consisting of sugars of three or more saccharide units and polysaccharides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:免疫層析試驗片</p>
        <p type="p">101:樣品墊</p>
        <p type="p">103:檢測部</p>
        <p type="p">105:支持體</p>
        <p type="p">107:結合墊</p>
        <p type="p">109:吸收部</p>
        <p type="p">111:基板</p>
        <p type="p">CL:控制線</p>
        <p type="p">TL:測試線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1861" publication-number="202632539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於神經網路處理單元之排程控制器及方法</chinese-title>
        <english-title>SCHEDULING CONTROLLER AND METHOD FOR NEURAL NETWORK PROCESSING UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260420B">G06N3/063</main-classification>
        <further-classification edition="200601120260420B">G06F9/48</further-classification>
        <further-classification edition="200601120260420B">G06F15/80</further-classification>
        <further-classification edition="200601120260420B">G06F9/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商墨子國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昶旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHANGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅江華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIANGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王育博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯覺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, JUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於神經網路處理單元之排程控制器及方法。該神經網路處理單元用於運行一神經網路模型且包括多個核心，且各核心包括多個處理元件(PE)。該排程控制器包括：一頂層模組，其包含一頂級向量擴充型RISC-V CPU (RVV)及一晶片級排程器(ChLS)；一核心級模組，其包含一核心RVV及一核心級排程器(CoLS)；及一PE級模組，其包含一PE RVV及一PE級排程器(PELS)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scheduling controller and method for neural network processing unit are disclosed. The neural network processing unit is used for running a neural network model and comprises multiple cores and each core comprises multiple processing elements (PEs). The scheduling controller comprises a top level module including a top RISC-V CPU with Vector extension (RVV) and a chip level scheduler (ChLS), a core level module including a core RVV and a core level scheduler (CoLS), and a PE level module including a PE RVV and a PE level scheduler (PELS).</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:排程控制器</p>
        <p type="p">310:頂層模組</p>
        <p type="p">312:頂級向量擴充型RISC-V CPU(RVV)</p>
        <p type="p">314:晶片級排程器(ChLS)</p>
        <p type="p">320:核心級模組</p>
        <p type="p">322:核心RVV</p>
        <p type="p">324:核心級排程器(CoLS)</p>
        <p type="p">330:PE級模組</p>
        <p type="p">332:PE RVV</p>
        <p type="p">334:PE級排程器(PELS)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1862" publication-number="202632355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學裝置</chinese-title>
        <english-title>OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260408B">G02B6/36</main-classification>
        <further-classification edition="200601120260408B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉脫維亞商樂導光學國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIA LIGHT GUIDE OPTICS INTERNATIONAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法福羅澤　道曼茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFRODS, DAUMANTS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種光學裝置（1），尤其用於傳輸較佳具有高功率密度的紫外光，該光學裝置包含：  &lt;br/&gt;含有複數個光纖（3）的光纖束（2），及  &lt;br/&gt;連接末端（4），其用於將該裝置（1）耦合至光源（5），尤其是雷射源，其中該連接末端（4）包含接收構件（6），用於將該光纖束（2）包圍、固定及/或固持在該連接末端（4）之區中，  &lt;br/&gt;其中在該接收構件（6）的第一末端區域（11）中，該接收構件（6）在第一黏接區（10）中黏接至該光纖束（2），該光纖束（2）延伸越過該第一末端區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical device （1）, in particular for transmission of ultraviolet light, preferably with high power densities, comprising: &lt;br/&gt;a fiber bundle （2） containing a plurality of fibers （3） and &lt;br/&gt;a connection end （4） for coupling the device （1） to a light source （5）, in particular a laser source, wherein the connection end （4） comprises a receiving means （6） for enclosing, fixing and/or holding the fiber bundle （2） in the region of the connection end （4）, &lt;br/&gt;wherein the receiving means （6） is adhered in a first adhering region （10） to the fiber bundle （2） in a first end area （11） of the receiving means （6） over which the fiber bundle （2） extends.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學裝置</p>
        <p type="p">4:連接末端</p>
        <p type="p">23:2之長度</p>
        <p type="p">24:4之外插頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1863" publication-number="202632331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學裝置</chinese-title>
        <english-title>OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G02B6/036</main-classification>
        <further-classification edition="200601120260424B">G02B6/04</further-classification>
        <further-classification edition="200601120260424B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉脫維亞商樂導光學國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIA LIGHT GUIDE OPTICS INTERNATIONAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法福羅澤　道曼茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFRODS, DAUMANTS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LV</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種光學裝置（1），尤其用於傳輸較佳具有高功率密度的紫外光，該光學裝置包含：  &lt;br/&gt;光纖束（2），其含有複數個光纖（3），以及  &lt;br/&gt;連接末端（4），其用於將該裝置（1）耦合至光源（5），尤其是雷射源，其中該連接末端（4）包含接收構件（6），用於將該光纖束（2）包圍、固定及/或固持在該連接末端（4）之區中，  &lt;br/&gt;其中該光纖（3）包含氫及/或氘充填之光纖纖心（7）及較佳地間接包圍該光纖纖心（7）的氫不滲透、及/或氘不滲透、及/或氫擴散抑制、及/或氘擴散抑制之塗布（8）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical device （1）, in particular for transmission of ultraviolet light, preferably with high power densities, comprising: &lt;br/&gt;a fiber bundle （2） containing a plurality of fibers （3） and &lt;br/&gt;a connection end （4） for coupling the device （1） to a light source （5）, in particular a laser source, wherein the connection end （4） comprises a receiving means （6） for enclosing, fixing and/or holding the fiber bundle （2） in the region of the connection end （4）, &lt;br/&gt;wherein the fiber （3） comprises a hydrogen and/or deuterium loaded fiber core （7） and a hydrogen-impermeable and/or deuterium-impermeable and/or hydrogen- diffusion-inhibiting and/or deuterium-diffusion-inhibiting coating （8） enclosing, preferably indirectly, the fiber core （7）.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學裝置</p>
        <p type="p">4:連接末端</p>
        <p type="p">22:長度</p>
        <p type="p">23:外插頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1864" publication-number="202631401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於控制層壓結構之彎曲的夾具及方法</chinese-title>
        <english-title>FIXTURES AND METHOD FOR CONTROLLING BOW IN LAMINATE STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B32B37/10</main-classification>
        <further-classification edition="200601120260430B">B32B37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古拉德　詹姆士葛瑞格利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUILLARD, JAMES GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普希　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POISSY, STEPHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞卡爾　保羅喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICKERL, PAUL GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種用於形成一層壓結構之方法。該方法包含將一預層壓件定位於一夾具上。該預層壓件包含分別具有第一熱膨脹係數（CTE）及第二CTE之第一層及第二層，其中該第二CTE大於該第一CTE。該預層壓件包含安置於該第一層與該第二層之間的一聚合物夾層。該方法進一步包含經由該夾具在該預層壓件之一主表面中誘導一目標反向彎曲。該夾具經組態以相對於重力橫向地定向該預層壓件之一參考平面以誘導該目標反向彎曲。該方法進一步包含在誘導該目標反向彎曲的同時將該預層壓件層壓於該夾具上以形成該層壓結構。該目標反向彎曲經組態以減小該主表面之將在無該目標反向彎曲之情況下層壓該預層壓件時產生的一參考彎曲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a laminate structure is disclosed. The method comprises positioning a prelamination on a fixture. The prelamination comprises first and second layers having first and second coefficients of thermal expansion (CTE), respectively, with the second CTE being greater than the first CTE. The prelamination comprises a polymer interlayer disposed between the first and second layers. The method further comprises inducing a target counter bow in a major surface of the prelamination via the fixture. The fixture is configured to orient a reference plane of the prelamination transversely with respect to gravity to induce the target counter bow. The method further comprises laminating the prelamination on the fixture while inducing the target counter bow to form the laminate structure. The target counter bow is configured to reduce a reference bow in the major surface that would result if the prelamination was laminated without the target counter bow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:層壓結構</p>
        <p type="p">2:第一層</p>
        <p type="p">3:第二層</p>
        <p type="p">4:夾層</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">T3:第三厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1865" publication-number="202632393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電泳顯示膜組裝件及電泳顯示膜</chinese-title>
        <english-title>ELECTROPHORETIC DISPLAY FILM ASSEMBLIES AND ELECTROPHORETIC DISPLAY FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G02F1/1333</main-classification>
        <further-classification edition="201901120260421B">G02F1/167</further-classification>
        <further-classification edition="201901120260421B">G02F1/1675</further-classification>
        <further-classification edition="201901120260421B">G02F1/1676</further-classification>
        <further-classification edition="201901120260421B">G02F1/1685</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古　海燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, HAIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬特斯　尤里波利索維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATUS, YURIY BORISOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　天佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, BRYAN HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧　宏玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, HONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裘茲　唐納德Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULTZ, DONALD A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　怡璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克佛森　查爾斯道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACPHERSON, CHARLES DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐瑞　巴德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMRANE, BADR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪奇諾斯基　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DICINOSKI, GREG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕克　薩尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKE, SANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路西尼　凡妮莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUSSINI, VANESSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於電泳顯示膜及電泳顯示膜組裝件。此膜可作為安全標記、認證膜、或感應器。該膜通常為撓性。一些膜的厚度小於100微米。由該膜形成的顯示器不需要外部電源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Low-profile electrophoretic display films and electrophoretic display film assemblies. Such films are useful as security markers, authentication films, or sensors. The films are generally flexible. Some films are less than 100 µm in thickness. Displays formed from the films do not require an external power source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓電電泳顯示器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1866" publication-number="202631173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>植物性添加劑及其在促進生長與防治球蟲病及／或壞死性腸炎中的應用</chinese-title>
        <english-title>PHYTOGENIC ADDITIVE AND APPLICATION THEREOF IN PROMOTING GROWTH AND COMBATING COCCIDIOSIS AND/OR NECROTIC ENTERITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K36/28</main-classification>
        <further-classification edition="200601120260504B">A61K36/9062</further-classification>
        <further-classification edition="200601120260504B">A61P33/02</further-classification>
        <further-classification edition="201601120260504B">A23K10/30</further-classification>
        <further-classification edition="201601120260504B">A23K50/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中央研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACADEMIA SINICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐麗芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHYUR, LIE-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連一洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, YI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳洵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUEN-EI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王升陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孟亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種減少、預防或治療個體之腸道感染；預防或治療個體與艾美球蟲屬(&lt;i&gt;Eimeria&lt;/i&gt;)原蟲寄生蟲相關之疾病；抑制個體中原蟲寄生蟲之卵囊芽胞化或預防胞子蟲侵入或繁殖；預防或治療個體之球蟲病；促進個體之生長性能；控制、治療及/或預防個體之壞死性腸炎的方法，其包含向該個體投與有效量之組合物，該組合物包含昭和草(&lt;i&gt;Crassocephalum rabens&lt;/i&gt;，CR)；其生物活性提取物(CRE)；CR中包含之活性成分(CR_API)或CRE中包含之活性成分(CRE_API)；CR、CRE、CR_API及CRE_API中兩者或更多者之組合；或α-次亞麻油酸、檸檬酸、乳酸、甘露糖醇、棕櫚酸、天冬胺酸及1-肉豆蔻酸單甘油酯中之一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of reducing, preventing or treating an intestinal infection, preventing or treating a disease associated with protozoan parasite of the genus&lt;i&gt; Eimeria&lt;/i&gt;, inhibiting an oocyst sporulation of a protozoan parasite or preventing a sporozoite invasion or reproduction, preventing or treating coccidiosis, promoting growth performance, controlling, treating and/or preventing necrotic enteritis in a subject, comprising administering to the subject an effective amount of a composition comprising a &lt;i&gt;Crassocephalum rabens&lt;/i&gt; (CR), a bioactive extract thereof (CRE), an active ingredient(s) contained in a CR (CR_API) or CRE (CRE_API), a combination of two or more of a CR, a CRE, a CR_API and a CRE_API, or one or more of α-linolenic acid, citric acid, lactic acid, mannitol, palmitic acid, aspartic acid and 1-monomyristin.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1867" publication-number="202631643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有金屬鉬膜之基板及該基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C07F11/00</main-classification>
        <further-classification edition="200601120260427B">C23C16/14</further-classification>
        <further-classification edition="200601120260427B">C23C14/16</further-classification>
        <further-classification edition="202601120260427B">H10P14/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土手佑真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOTE, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池亜紀応</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AKIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制對基底之損傷，並且具有金屬鉬膜之基板之製造方法。  &lt;br/&gt;本發明係關於一種具有金屬鉬膜之基板之製造方法，其包括向基板供給含有氣態MoOF&lt;sub&gt;4&lt;/sub&gt;之氣體、及含有氣態還原劑之氣體，於上述基板上成膜金屬鉬膜之成膜工序，關於上述含有氣態MoOF&lt;sub&gt;4&lt;/sub&gt;之氣體，於氣態鉬前驅物之合計分壓中，氣態MoF&lt;sub&gt;6&lt;/sub&gt;之分壓之比(氣態MoF&lt;sub&gt;6&lt;/sub&gt;之分壓/氣態鉬前驅物之合計分壓)為0.008以下，氣態MoO&lt;sub&gt;2&lt;/sub&gt;F&lt;sub&gt;2&lt;/sub&gt;之分壓之比(氣態MoO&lt;sub&gt;2&lt;/sub&gt;F&lt;sub&gt;2&lt;/sub&gt;之分壓/氣態鉬前驅物之合計分壓)為0.008以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1868" publication-number="202631741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、樹脂硬化膜，及圖像顯示元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/08</main-classification>
        <further-classification edition="200601120260504B">C08F220/06</further-classification>
        <further-classification edition="200601120260504B">C08F220/14</further-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F220/28</further-classification>
        <further-classification edition="200601120260504B">C08F220/32</further-classification>
        <further-classification edition="200601120260504B">C08F220/36</further-classification>
        <further-classification edition="200601120260504B">C08F222/40</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">C09D17/00</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
        <further-classification edition="200601120260504B">G02B5/22</further-classification>
        <further-classification edition="200601120260504B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉林一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAHAYASHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木優介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性樹脂組成物，其含有：共聚物(A-1)、共聚物(A-2)、光聚合起始劑(C)及溶劑(D)，共聚物(A-1)含有：羥基、具有封閉異氰酸基之構成單位(a)、具有下述式(1)之部分構造之構成單位(b)及具有酸基之構成單位(c)，共聚物(A-2)之不飽和基當量為30~3000g/mol。  &lt;br/&gt;　　&lt;img align="absmiddle" height="38px" width="258px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;為2價烴基，n1表示2~20之整數。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1869" publication-number="202632775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池模組及其製造方法</chinese-title>
        <english-title>BATTERY MODULE AND A MANUFACTURING METHOD OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260504B">H01M50/20</main-classification>
        <further-classification edition="202101120260504B">H01M50/204</further-classification>
        <further-classification edition="202101120260504B">H01M50/227</further-classification>
        <further-classification edition="202101120260504B">H01M50/244</further-classification>
        <further-classification edition="202101120260504B">H01M50/258</further-classification>
        <further-classification edition="202101120260504B">H01M50/262</further-classification>
        <further-classification edition="202101120260504B">H01M50/289</further-classification>
        <further-classification edition="202101120260504B">H01M50/291</further-classification>
        <further-classification edition="202101120260504B">H01M50/531</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田秉峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, BYEONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, JI MYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禁宗潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEUM, JONG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於電池模組和電池模組製造方法，更具體地，關於具有緊湊性和高安全性的電池模組，以及其製造方法。根據本發明的一個實例，可提供電池組，其包含：多個電池單元；至少一個緊固構件；以及泡棉外殼，在電池單元和緊固構件被插入之後，通過泡棉材料的泡棉形成來容納多個電池單元以形成電池組外形，其中緊固構件包含暴露到泡棉外殼外部的金屬緊固部件，以及圍繞緊固部件的塑膠緊固部件外殼，並嵌入和固定在泡棉外殼內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a battery module and a battery module manufacturing method, and more specifically, relates to a battery module with compactness and high safety, and a manufacturing method thereof. According to one example of the present invention, a battery pack may be provided, which comprises: a plurality of battery cells; at least one fastening member; and a foam housing accommodating, after the battery cells and the fastening member are inserted, the plurality of battery cells by foam formation of a foam material to form a battery pack outer shape, wherein the fastening member comprises a metallic fastening part exposed to the outside of the foam housing, and a plastic fastening part housing surrounding the fastening part, and embedded and fixed within the foam housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:泡棉外殼</p>
        <p type="p">40:互鎖構件、緊固構件、嵌入螺帽</p>
        <p type="p">100:夾具</p>
        <p type="p">101至104:側壁夾具</p>
        <p type="p">101a:矽膠墊</p>
        <p type="p">101b:突出柱</p>
        <p type="p">105:上壁夾具</p>
        <p type="p">106:下壁夾具</p>
        <p type="p">106a:電池座構件</p>
        <p type="p">106b:插入槽</p>
        <p type="p">107:間隔件</p>
        <p type="p">107a:通孔縫隙、通孔槽</p>
        <p type="p">107b:溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1870" publication-number="202631345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人</chinese-title>
        <english-title>ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J9/06</main-classification>
        <further-classification edition="202601120260430B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, RYOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細川翼平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOKAWA, YOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之機器人包含：機器人臂部、驅動帶輪、從動帶輪、驅動部、傳動帶構件及中間帶輪。驅動部係作為使驅動帶輪旋轉的驅動源。傳動帶構件係分別固定於驅動帶輪及從動帶輪，並將來自驅動帶輪的動力傳遞至從動帶輪。中間帶輪係配置於驅動帶輪與從動帶輪之間，並將傳動帶構件往分別繞設於驅動帶輪及從動帶輪的方向推壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This robot includes a robot arm, a drive pulley, a driven pulley, a drive unit, a belt member, and an intermediate pulley. &lt;br/&gt;The drive unit serves as a drive source for rotating the drive pulley. &lt;br/&gt;The belt member is fixed to each of the drive pulley and the driven pulley, and transmits power from the drive pulley to the driven pulley. &lt;br/&gt;The intermediate pulley is disposed between the drive pulley and the driven pulley, and presses the belt member in a direction in which the belt member is wound around each of the drive pulley and the driven pulley.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,20:機器人臂部</p>
        <p type="p">11,21:基端連桿</p>
        <p type="p">12,22:前端連桿</p>
        <p type="p">30,40:機器手</p>
        <p type="p">71,72,73:驅動部</p>
        <p type="p">80:控制部</p>
        <p type="p">90:基座部</p>
        <p type="p">100:機器人</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1871" publication-number="202632821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直腔面發射激光器陣列及集成系統</chinese-title>
        <english-title>VERTICAL CAVITY SURFACE-EMITTING LASER ARRAY AND INTEGRATED SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">H01S5/024</main-classification>
        <further-classification edition="200601120260114B">H01S5/183</further-classification>
        <further-classification edition="200601120260114B">H01S5/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商常州縱慧芯光半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERTILITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁維遵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, WEI-ZUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁瑋呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種垂直腔面發射激光器陣列及集成系統，所述陣列包括：至少一個激光器，所述激光器包括襯底以及至少一個位于所述襯底上的第一單元，所述第一單元包括激光發射結構以及位于所述激光發射結構上方的連接結構，所述激光發射結構中設有至少一個發光孔，所述連接結構至少包括依次層疊的第一電極及導電散熱層，所述第一電極與所述發光孔相對設置，所述導電散熱層覆蓋所述第一電極且所述發光孔在所述襯底上的正投影位于所述導電散熱層在所述襯底上的正投影內部。本申請的垂直腔面發射激光器陣列及集成系統能夠實現更緊湊、帶寬密度更小的光通信模塊和消費電子產品設計。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a vertical cavity surface-emitting laser array and an integrated system. The array comprises: at least one laser, the laser including a substrate and at least one first unit located on the substrate. The first unit comprises a laser emission structure and a connecting structure above the laser emission structure. The laser emission structure has at least one light-emitting hole. The connecting structure at least comprises a first electrode and a conductive heat dissipation layer stacked in sequence. The first electrode is opposite to the light-emitting hole. The conductive heat dissipation layer covers the first electrode and the positive projection of the light-emitting hole on the substrate is located inside the positive projection of the conductive heat dissipation layer on the substrate. The vertical cavity surface-emitting laser array and integrated system of the present application can achieve more compact and lower bandwidth density optical communication module and consumer electronic product designs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:垂直腔面發射激光器陣列</p>
        <p type="p">1:激光器</p>
        <p type="p">11:襯底</p>
        <p type="p">12:第一單元</p>
        <p type="p">121:激光發射結構</p>
        <p type="p">121a:發光孔</p>
        <p type="p">121b:第一反射層</p>
        <p type="p">121c:有源層</p>
        <p type="p">121d:第二反射層</p>
        <p type="p">121e:限制層</p>
        <p type="p">121f:限制溝槽</p>
        <p type="p">121g:絕緣層</p>
        <p type="p">121h:離子注入區</p>
        <p type="p">122:連接結構</p>
        <p type="p">122a:第一電極</p>
        <p type="p">122b:導電散熱層</p>
        <p type="p">122c:第一導電柱</p>
        <p type="p">122d:第一焊接層</p>
        <p type="p">13:第二單元</p>
        <p type="p">131:第二電極</p>
        <p type="p">132:第二導電柱</p>
        <p type="p">133:導電襯墊</p>
        <p type="p">133a:第一襯墊部</p>
        <p type="p">133b:第二襯墊部</p>
        <p type="p">14:隔離層</p>
        <p type="p">15:接觸層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1872" publication-number="202633367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>翻轉裝置及基板處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P72/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商盛美半導體設備韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH KOREA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商清芯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEANCHIP TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李德鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DEXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈旻燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, MIN SEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦欣欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAO, XINXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張少帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHAOSHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種翻轉裝置和基板處理設備，翻轉裝置包括翻轉單元，包括翻轉驅動源和翻轉軸，翻轉軸設置在翻轉驅動源的輸出端；夾持單元，用於夾持基板，與翻轉軸連接，夾持單元包括兩個第一夾持機構和兩個第二夾持機構，兩個第一夾持機構和兩個第二夾持機構圍成用於容納基板的容置空間，基板被配置為從外部進入容置空間；兩個第二夾持機構比兩個第一夾持機構更靠近外部而設置；兩個第一夾持機構用於當夾持單元被翻轉單元驅動繞翻轉軸的軸線翻轉的過程中承托基板，還用於被驅繞自身轉軸轉動以夾持或釋放基板；兩個第二夾持機構固定設置，用於夾持基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:夾持單元</p>
        <p type="p">11:第一驅動機構</p>
        <p type="p">12:第一夾持機構</p>
        <p type="p">121:第一夾持部</p>
        <p type="p">122:第一承載體</p>
        <p type="p">13:第二夾持機構</p>
        <p type="p">131:第二夾持部</p>
        <p type="p">132:第二承載體</p>
        <p type="p">16:連接板</p>
        <p type="p">161:第一轉動件</p>
        <p type="p">2:翻轉單元</p>
        <p type="p">241:第一固定件</p>
        <p type="p">242:第二固定件</p>
        <p type="p">3:基座</p>
        <p type="p">4:基板</p>
        <p type="p">a:處</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1873" publication-number="202631882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性樹脂組合物、固化物及犧牲膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L63/02</main-classification>
        <further-classification edition="200601120260420B">C08F220/18</further-classification>
        <further-classification edition="200601120260420B">G03F7/028</further-classification>
        <further-classification edition="200601120260420B">G03F7/038</further-classification>
        <further-classification edition="200601120260420B">C08G59/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪有機化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹內祐太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固化性樹脂組合物，包含鹼溶性樹脂（P）、具有環狀骨架的單官能單體（MA）和任選的除上述單官能單體（MA）以外的其他單體（MX），所述鹼溶性樹脂（P）滿足條件（a）雙鍵當量為600以上且條件（b）酸值為50～150mgKOH／g，上述鹼溶性樹脂（P）、上述單官能單體（MA）和上述其他單體（MX）的質量比為100：30～90：0～13。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:抗蝕劑圖案</p>
        <p type="p">30:光罩</p>
        <p type="p">X、Y、Z:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1874" publication-number="202632079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二次電池、連接型電池、及電池組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C25B5/00</main-classification>
        <further-classification edition="201001120260422B">H01M4/485</further-classification>
        <further-classification edition="200601120260422B">H01M4/64</further-classification>
        <further-classification edition="200601120260422B">H01M4/38</further-classification>
        <further-classification edition="201001120260422B">H01M10/0583</further-classification>
        <further-classification edition="201001120260422B">H01M10/0525</further-classification>
        <further-classification edition="202101120260422B">H01M50/466</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京瓷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅里計匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMESATO, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下良博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島孝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋一博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村本和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAMOTO, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石橋郁弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIBASHI, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦格納　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, ROMAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在增大二次電池之容量。  &lt;br/&gt;二次電池具備：正極片，其具有正極集電體及正極活性物質層；負極片，其具有負極集電體；及隔離件，其於厚度方向上位於正極片與負極片之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二次電池</p>
        <p type="p">2:平面部</p>
        <p type="p">2L1:平面部</p>
        <p type="p">2U1:平面部</p>
        <p type="p">3:彎折部</p>
        <p type="p">10:正極片</p>
        <p type="p">11:正極集電體</p>
        <p type="p">12:正極活性物質層</p>
        <p type="p">13:第1樹脂層</p>
        <p type="p">20:負極片</p>
        <p type="p">21:負極集電體</p>
        <p type="p">22:負極活性物質層</p>
        <p type="p">23:第2樹脂層</p>
        <p type="p">30:隔離件</p>
        <p type="p">35:第3樹脂層</p>
        <p type="p">201:外部電極</p>
        <p type="p">202:外部電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1875" publication-number="202633368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱處理之半導體晶圓的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF HEAT-TREATED SEMICONDUCTOR WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P72/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川端友朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南出由生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMIDE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村郁浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, IKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是逐片式熱處理爐中品質規格與產能可以都考慮而適切控制升降速度來進行半導體晶圓的熱處理。其解決手段為一種熱處理之半導體晶圓的製造方法，包括：製作從平坦度、LPD、升降銷痕面積及升降銷痕高度所組成之群組選擇的一個以上的品質的統計學參數與升降動作參數之間的關係的資料庫；基於從平坦度、LPD、升降銷痕面積及升降銷痕高度所組成之群組選擇的一個以上的品質的規格資訊及上述資料庫，針對複數個升降動作參數組合實施演算升降動作參數組合的製程能力參數；基於上述演算的結果，進行上述複數個升降動作參數組合的合格與否判定；上述合格與否判定中判定為合格的升降動作參數組合中，選擇升降動作的合計動作時間為閾值以下的升降動作參數組合，將所選擇的升降動作參數組合設定於可將升降速度設為可變的逐片式熱處理爐；以及在上述逐片式熱處理爐對半導體晶圓熱處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is an object to enable to take both the quality specifications and the productivity in a single wafer processing heat treatment furnace into consideration to properly control the lifting speed to perform the heat treatment of semiconductor wafers. The solution is a manufacturing method of heat-treated semiconductor wafers including creating a database of relationships between at leat one statistical parameter of quality, seltected from a group consisting of flatness, LPD, liftpin mark area and liftpin mark height, and lift operation parameters; practicing calculations to determine process capability parameters for lift operation parameter combinations based on at least one specification information of quality, seltected from a group consisting of flatness, LPD, liftpin mark area and liftpin mark height, and the database for a plurality of lift operation parameter combinations; performing judgement of acceptance on the plurality of lift operation parameter combinations based on the results of the calculations; &lt;br/&gt;selecting lift operation parameter combinations whose toal operation period of the lift operations is equal to or less than a threshold value from the lift operation parameter combinations judged as acceptance in the judgement of acceptance, and setting the selected lift operation parameter combinations in a single wafer processing heat treatment furnace whose lift speed can be set variable; and heat-treating semiconductor wafers on the single wafer processing heat treatment furnace.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1876" publication-number="202631596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>VAV1靶向降解劑及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D401/10</main-classification>
        <further-classification edition="200601120260504B">C07D401/12</further-classification>
        <further-classification edition="200601120260504B">C07D401/14</further-classification>
        <further-classification edition="200601120260504B">C07D405/14</further-classification>
        <further-classification edition="200601120260504B">C07F9/6558</further-classification>
        <further-classification edition="200601120260504B">C07D405/10</further-classification>
        <further-classification edition="200601120260504B">C07D211/40</further-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D409/14</further-classification>
        <further-classification edition="200601120260504B">C07D421/14</further-classification>
        <further-classification edition="200601120260504B">C07D487/04</further-classification>
        <further-classification edition="200601120260504B">C07D471/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/4545</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/675</further-classification>
        <further-classification edition="200601120260504B">A61K31/454</further-classification>
        <further-classification edition="200601120260504B">A61K31/453</further-classification>
        <further-classification edition="200601120260504B">A61K31/497</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西藏海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張浩亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴龐科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, PANGKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種VAV1靶向降解劑及其用途。特別地，本發明涉及通式(I)所示的化合物，或其立體異構體、藥學上可以接受的鹽和它們的藥物組合物，及其在製備治療/預防VAV1介導的疾病的藥物中的應用，其中通式(I)中的各取代基與說明書中的定義相同。  &lt;br/&gt;&lt;img align="absmiddle" height="101px" width="192px" file="ed12036.JPG" alt="ed12036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1877" publication-number="202631763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146606</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F297/04</main-classification>
        <further-classification edition="200601120260504B">C08F8/04</further-classification>
        <further-classification edition="200601120260504B">C09J153/02</further-classification>
        <further-classification edition="200601120260504B">C09J11/06</further-classification>
        <further-classification edition="200601120260504B">C09J11/08</further-classification>
        <further-classification edition="201801120260504B">C09J7/22</further-classification>
        <further-classification edition="200601120260504B">B32B25/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/18</further-classification>
        <further-classification edition="200601120260504B">B32B27/30</further-classification>
        <further-classification edition="200601120260504B">C09K3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠部瑞樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANBU, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一糸亮諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YORITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木啟光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, HIROMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層體，其係具有基材(X)、與和該基材(X)相鄰之黏著層(Y)的積層體，前述基材(X)含有橡膠，前述黏著層(Y)含有將嵌段共聚物(P)氫化而成之氫化嵌段共聚物(A)，該嵌段共聚物(P)包含：包含源自芳香族乙烯基化合物的結構單元之聚合物嵌段(a)、與包含源自共軛二烯化合物的結構單元之聚合物嵌段(b)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1878" publication-number="202631582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、阻劑圖型形成方法、化合物，及酸產生劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C07C381/12</main-classification>
        <further-classification edition="200601120260428B">C07D207/06</further-classification>
        <further-classification edition="200601120260428B">C07D207/48</further-classification>
        <further-classification edition="200601120260428B">C07D211/06</further-classification>
        <further-classification edition="200601120260428B">C07D491/14</further-classification>
        <further-classification edition="200601120260428B">C09K3/00</further-classification>
        <further-classification edition="200601120260428B">G03F7/004</further-classification>
        <further-classification edition="200601120260428B">G03F7/038</further-classification>
        <further-classification edition="200601120260428B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田真稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部一貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森貴敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[解決手段]一種阻劑組成物，其含有鹼可溶性樹脂(A)、酸產生劑(B)，及交聯劑(C)，前述酸產生劑(B)包含下述通式(b0)所示之化合物(B0)。式中，X&lt;sup&gt;0&lt;/sup&gt;表示氮原子或CR&lt;sup&gt;X0&lt;/sup&gt;。Y&lt;sup&gt;0&lt;/sup&gt;表示氮原子或CR&lt;sup&gt;Y0&lt;/sup&gt;。Z&lt;sup&gt;0&lt;/sup&gt;表示氮原子或CR&lt;sup&gt;Z0&lt;/sup&gt;。C表示碳原子。R&lt;sup&gt;X0&lt;/sup&gt;、R&lt;sup&gt;Y0&lt;/sup&gt;、R&lt;sup&gt;Z0&lt;/sup&gt;及R&lt;sup&gt;0&lt;/sup&gt;分別獨立表示氫原子或取代基。R&lt;sup&gt;X0&lt;/sup&gt;、R&lt;sup&gt;Y0&lt;/sup&gt;、R&lt;sup&gt;Z0&lt;/sup&gt;及R&lt;sup&gt;0&lt;/sup&gt;之2以上亦可相互鍵結而形成環構造。m為1以上之整數，M&lt;sup&gt;m+&lt;/sup&gt;表示m價之陽離子。  &lt;br/&gt;&lt;img align="absmiddle" height="180px" width="358px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1879" publication-number="202632747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置、電源系統及頻率控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01J37/32</main-classification>
        <further-classification edition="200601120260423B">H01J37/24</further-classification>
        <further-classification edition="200601120260423B">H05H1/46</further-classification>
        <further-classification edition="200601120260423B">H05H1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輿水地塩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMIZU, CHISHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上坂友佑人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤武尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TAKEHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大沼勇二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONUMA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置包含腔室、基板支持部、第1及第2電源、以及控制電路。控制電路控制第1電源及第2電源，以於複數個重複週期之各者內向腔室內之基板支持部供給第1偏壓信號及第2偏壓信號。控制電路針對複數個重複週期之各者中複數個子期間之各者內的第2偏壓信號之第2頻率，根據前一個重複週期中同一子期間內之第2電源之負載之阻抗的匹配度來進行調整，以提昇該匹配度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">10:腔室</p>
        <p type="p">11:基板支持部</p>
        <p type="p">18:上部導體</p>
        <p type="p">50:電源系統</p>
        <p type="p">50c:控制電路</p>
        <p type="p">51:電源</p>
        <p type="p">51m:匹配器</p>
        <p type="p">51s:感測器</p>
        <p type="p">52:電源</p>
        <p type="p">52m:匹配器</p>
        <p type="p">52s:感測器</p>
        <p type="p">53:電源</p>
        <p type="p">53m:匹配器</p>
        <p type="p">53s:感測器</p>
        <p type="p">BS1:偏壓信號</p>
        <p type="p">BS2:偏壓信號</p>
        <p type="p">HF:源RF信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1880" publication-number="202632692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性元件</chinese-title>
        <english-title>MAGNETIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">H01F27/26</main-classification>
        <further-classification edition="200601120260416B">H01F27/28</further-classification>
        <further-classification edition="200601120260416B">H01F27/30</further-classification>
        <further-classification edition="200601120260416B">H01F17/04</further-classification>
        <further-classification edition="200601120260416B">H01F41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳森輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SEN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝其軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIE, CHI-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂墨揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MO-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性元件，包含一磁性體、一第一繞組、一第二繞組以及一磁性填料。該第一繞組設置於該磁性體中。該第一繞組之一第一端以及一第二端分別朝該磁性體之一第一側以及一第二側延伸。該第二繞組設置於該磁性體中。該第二繞組之一第三端以及一第四端朝該磁性體之該第一側延伸。該第一繞組部分包覆該第二繞組。該磁性填料填充於該第一繞組與該第二繞組之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic component includes a magnetic body, a first winding, a second winding and a magnetic filler. The first winding is disposed in the magnetic body. A first end and a second end of the first winding respectively extend towards a first side and a second side of the magnetic body. The second winding is disposed in the magnetic body. A third end and a fourth end of the second winding extend towards the first side of the magnetic body. The first winding partially covers the second winding. The magnetic filler is filled between the first winding and the second winding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磁性元件</p>
        <p type="p">10:磁性體</p>
        <p type="p">12:第一繞組</p>
        <p type="p">14:第二繞組</p>
        <p type="p">16:磁性填料</p>
        <p type="p">20a,20b,20c,20d:電極</p>
        <p type="p">22:隔離溝</p>
        <p type="p">100:第一側</p>
        <p type="p">102:第二側</p>
        <p type="p">104:第三側</p>
        <p type="p">120:第一端</p>
        <p type="p">122:第二端</p>
        <p type="p">140:第三端</p>
        <p type="p">142:第四端</p>
        <p type="p">220:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1881" publication-number="202633133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直氮化鎵電晶體</chinese-title>
        <english-title>VERTICAL GALLIUM NITRIDE TRANSISTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10D62/824</main-classification>
        <further-classification edition="202501120260504B">H10D30/47</further-classification>
        <further-classification edition="202501120260504B">H10D30/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電源整合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER INTEGRATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治斯庫　索林Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGESCU, SORIN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　國彰　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUO-CHANG ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提出了垂直氮化鎵（GaN）場效應電晶體（FETs）。垂直GaN FET包括佈置成六邊形陣列以形成垂直FET通道的圓柱形溝槽閘極。在所述垂直GaN FET的表面處是形成在GaN外延層中並且形成在GaN基底上方的源極層。可以在所述圓柱形閘極之間以「GaN柱」的形式形成通道；並且可以至少部分地根據溝槽最近鄰距離確定FET特性，包括臨界電壓。因此，可以選擇所述溝槽最近鄰距離，使得所述垂直GaN FET作為增強型電晶體或作為空乏型電晶體運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Vertical gallium nitride (GaN) field effect transistors (FETs) are presented herein. A vertical GaN FET includes cylindrical trench gates arranged in a hexagonal array to form vertical FET channels. At the surface of the vertical GaN FET is a source layer formed in a GaN epitaxial layer and over a GaN substrate. A channel may be formed between the cylindrical gates in the form of a “GaN pillar”; and FET characteristics, including threshold voltage, may be determined, at least in part by a trench nearest neighbor distance. Accordingly, the trench nearest neighbor distance may be selected so that the vertical GaN FET operates as either an enhancement mode or a depletion mode transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:垂直GaN電晶體</p>
        <p type="p">105a、105b、105c:圓柱形溝槽閘極</p>
        <p type="p">106a、106b、106c:圓柱形溝槽閘極</p>
        <p type="p">111:閘極電極</p>
        <p type="p">112:閘極電介質</p>
        <p type="p">113:漂移外延層</p>
        <p type="p">117:三角形晶胞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1882" publication-number="202632048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含多層結構的晶圓及生產包含多層結構的晶圓的方法</chinese-title>
        <english-title>WAFER COMPRISING A MULTILAYERED STRUCTURE AND METHOD OF PRODUCING A WAFER COMPRISING A MULTILAYERED STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C23C16/34</main-classification>
        <further-classification edition="200601120260428B">C30B25/00</further-classification>
        <further-classification edition="200601120260428B">C30B29/06</further-classification>
        <further-classification edition="200601120260428B">C30B29/68</further-classification>
        <further-classification edition="202601120260428B">H10P14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米希勒　桑德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICHLER, SONDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩帕　沙拉　巴哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAPA, SARAD BAHADUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含多層結構的晶圓，其中該多層結構依序包含&lt;br/&gt;  矽基材；&lt;br/&gt;  緩衝結構；以及&lt;br/&gt;  一或多個單晶元件層，其總厚度不低於80奈米且不超過1000奈米，且包含至少一個GaN層；&lt;br/&gt;  該緩衝結構依序包含&lt;br/&gt;  至少一個AlN成核層；&lt;br/&gt;  Al&lt;sub&gt;z&lt;/sub&gt;Ga&lt;sub&gt;1-z&lt;/sub&gt;N層；&lt;br/&gt;  至少一個超晶格結構，其包含20至120個週期，每個週期由Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N層和Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1-y&lt;/sub&gt;N層組成；以及&lt;br/&gt;  單晶GaN緩衝層，其碳濃度不低於1×10&lt;sup&gt;18&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;且不超過1×10&lt;sup&gt;20&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;，厚度不低於0.5微米且不超過4微米；&lt;br/&gt;  其中0.3≤z≤0.7；0.6≤x≤1.0；且0≤y≤0.4；以及其中&lt;br/&gt;  至少一個超晶格結構中的至少一者包含濃度不低於1×10&lt;sup&gt;17&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;且不超過1×10&lt;sup&gt;20&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;的碳，並且&lt;br/&gt;  緩衝結構包含具有層狀結構且由Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N和Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1-y&lt;/sub&gt;N之交替層所組成的島狀物，島狀物位於Al&lt;sub&gt;z&lt;/sub&gt;Ga&lt;sub&gt;1-z&lt;/sub&gt;N層與由Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N和Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1-y&lt;/sub&gt;N之交替層所組成的至少一個超晶格結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer comprising a multilayered structure, wherein the multilayered structure comprises in this order&lt;br/&gt; a silicon substrate;&lt;br/&gt; a buffer structure; and &lt;br/&gt; one or more monocrystalline device layers having a total thickness of not less than 80 nm and not more than 1000 nm and comprising at least one GaN layer;&lt;br/&gt; the buffer structure comprising in this order&lt;br/&gt; at least one AlN nucleation layer;&lt;br/&gt; an Al&lt;sub&gt;z&lt;/sub&gt;Ga&lt;sub&gt;1-z&lt;/sub&gt;N layer;&lt;br/&gt; at least one superlattice structure comprising 20 to 120 periods, each period consisting of a layer of Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N and a layer of Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1‑y&lt;/sub&gt;N; and&lt;br/&gt; a monocrystalline GaN buffer layer having a carbon concentration of not less than 1 x 10&lt;sup&gt;18&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt; and not more than 1 x 10&lt;sup&gt;20&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;and a thickness of not less than 0.5 µm and not more than 4 µm;&lt;br/&gt; wherein 0.3≤z≤0.7; 0.6≤x≤1.0; and 0≤y≤0.4; and&lt;br/&gt; characterized in that&lt;br/&gt; at least one of the at least one superlattice structure comprises carbon in a concentration of not less than 1 x 10&lt;sup&gt;17&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt; and not more than 1 x 10&lt;sup&gt;20&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;, and&lt;br/&gt; the buffer structure comprises islands having a layered structure and consisting of alternating layers of Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N and Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1‑y&lt;/sub&gt;N, the islands being located in-between the Al&lt;sub&gt;z&lt;/sub&gt;Ga&lt;sub&gt;1-z&lt;/sub&gt;N layer and the at least one superlattice structure consisting of alternating layers of Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;N and Al&lt;sub&gt;y&lt;/sub&gt;Ga&lt;sub&gt;1‑y&lt;/sub&gt;N.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1883" publication-number="202632321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學裝置</chinese-title>
        <english-title>OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G02B1/12</main-classification>
        <further-classification edition="201501120260423B">G02B1/10</further-classification>
        <further-classification edition="201501120260423B">G02B1/11</further-classification>
        <further-classification edition="200601120260423B">G02B1/08</further-classification>
        <further-classification edition="201501120260423B">G02B1/14</further-classification>
        <further-classification edition="200601120260423B">G02B27/02</further-classification>
        <further-classification edition="202001120260423B">G02B30/00</further-classification>
        <further-classification edition="201901120260423B">B32B7/023</further-classification>
        <further-classification edition="200601120260423B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商弗萊克英納寶技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休金斯　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGGINS, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於在一剛性基體上處理一裝置層之堆疊，其包括一第一堆疊，該第一堆疊包含：一裝置基體層，其鄰近於該裝置層；一雙側UV黏著劑層，其鄰近於該裝置基體層；一雷射光去接合層，其鄰近於該雙側UV黏著劑層；以及一剛性基體，其鄰近於該雷射/光去接合層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a stack for processing a device layer on a rigid substrate, including a first stack comprising: a device substrate layer adjacent the device layer; a double-sided UV adhesive layer adjacent the device substrate layer; a laser-light debond layer adjacent the double-sided UV adhesive layer; and a rigid substrate adjacent the laser/light debond layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:底板堆疊，下部玻璃基體堆疊，下部玻璃基體支撐件</p>
        <p type="p">104:第一玻璃基體層，玻璃基體層，玻璃基體</p>
        <p type="p">106:雷射/光去接合層，層，雷射去接合層</p>
        <p type="p">108:雙側紫外線黏著劑層，層，雙側UV黏著劑層</p>
        <p type="p">110:第一LC基體層，LC胞元基體層，LC基體，LC基體層，層</p>
        <p type="p">114:第二玻璃基體層，玻璃基體層，玻璃基體</p>
        <p type="p">118:雙側UV黏著劑層</p>
        <p type="p">120:第二LC基體層，LC胞元基體層，LC基體</p>
        <p type="p">122:頂板，上部玻璃基體堆疊，上部堆疊</p>
        <p type="p">130:總體堆疊</p>
        <p type="p">132:LC層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1884" publication-number="202632199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測、追蹤和傳輸的可配置系統</chinese-title>
        <english-title>CONFIGURABLE SYSTEM FOR DETECTING, TRACKING, AND TRANSMITTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F28D15/02</main-classification>
        <further-classification edition="200601120260421B">H05K7/20</further-classification>
        <further-classification edition="200601120260421B">F04D25/08</further-classification>
        <further-classification edition="200601120260421B">H04B7/00</further-classification>
        <further-classification edition="200601120260421B">H01Q1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安杜里爾工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDURIL INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爾森　布萊登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEARSON, BRYDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾阿卡德　奧薩瑪　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL-AKKAD, OSAMA E</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托尼歐羅　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STORNIOLO, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　陶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, THAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有一整合式熱系統之模組，該模組包括一模組封裝，該模組封裝具有經組態以容納一電子組件之一中心部分。該中心部分可調適以支援該電子組件之不同變化。該模組包括至少兩個通道，該至少兩個通道在該中心部分附近延伸穿過該模組封裝之側向部分。該至少兩個通道進一步具有經安置於該至少兩個通道之一長度內的一摺疊鰭片散熱器。一或多個熱管至少部分地嵌入於該模組封裝中且經組態以將熱從該模組封裝之該中心部分中之該電子組件傳遞至延伸穿過該等側向部分之該至少兩個通道。該電子組件與該至少兩個通道熱連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A module having an integrated thermal system includes a module package having a central portion configured to house an electronic component. The central portion is adaptable to support different variations of the electronic component. The module includes at least two channels extending through lateral portions of the module package in proximity to the central portion. The at least two channels further have a folded fin heatsink disposed within a length of the at least two channels. One or more heat pipes are at least partially embedded in the module package and configured to transfer heat from the electronic component in the central portion of the module package to the at least two channels extending through the lateral portions. The electronic component is in thermal communication with the at least two channels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402:RF系統</p>
        <p type="p">403:安裝表面</p>
        <p type="p">404:天線</p>
        <p type="p">404a:低頻帶天線/定向天線</p>
        <p type="p">404b:中頻帶天線</p>
        <p type="p">404c:全球導航衛星系統/替代導航(GNSS/Alt-Nav)天線</p>
        <p type="p">404d:高頻帶頻率擴展器(HBFE)</p>
        <p type="p">404e:探向器(DF)天線</p>
        <p type="p">405:把手</p>
        <p type="p">406:電池</p>
        <p type="p">408:物件</p>
        <p type="p">410:模組殼體/模組化外殼</p>
        <p type="p">419:通氣口</p>
        <p type="p">450:風扇</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1885" publication-number="202631408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活塞組件和負板組件</chinese-title>
        <english-title>PISTON ASSEMBLY AND NEGATIVE PLATE ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">B60G17/052</main-classification>
        <further-classification edition="200601120260423B">B60G11/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福克斯制造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗四世　威廉姆·Ｏ·</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN IV, WILLIAM O.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿林格　韋斯利　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLINGER, WESLEY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝弗　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAFFER, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種空氣彈簧組件。該空氣彈簧組件包括活塞組件，該活塞組件包括活塞、至少一個順應性構件、構造成在活塞與空氣室的壁之間提供氣密密封的密封件以及構造成將活塞與軸聯接的緊固件。&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自行車</p>
        <p type="p">100:空氣彈簧組件</p>
        <p type="p">12:樞轉點</p>
        <p type="p">15:後輪軸</p>
        <p type="p">24:主框架</p>
        <p type="p">26:擺臂</p>
        <p type="p">28:前輪</p>
        <p type="p">30:後輪</p>
        <p type="p">32:車座</p>
        <p type="p">33:座桿</p>
        <p type="p">36:車把</p>
        <p type="p">38:阻尼器</p>
        <p type="p">52:前叉組件</p>
        <p type="p">69:縱向方向</p>
        <p type="p">85:輪軸</p>
        <p type="p">D:虛曲線</p>
        <p type="p">N-N:軸線</p>
        <p type="p">T-T:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1886" publication-number="202631895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>除臭劑、樹脂組合物、分散液、除臭纖維、無機粒子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C08L83/06</main-classification>
        <further-classification edition="200601120260428B">C01B33/159</further-classification>
        <further-classification edition="201801120260428B">C08K3/11</further-classification>
        <further-classification edition="200601120260428B">B01D53/54</further-classification>
        <further-classification edition="200601120260428B">B01J20/16</further-classification>
        <further-classification edition="200601120260428B">A61L9/014</further-classification>
        <further-classification edition="200601120260428B">A61L2/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東亞合成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOAGOSEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋田隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKITA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田喜直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有馬弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMA, HIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種除臭劑，其包含具有經疏水化之表面之無機粒子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1887" publication-number="202631023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>食用黏彈性物、麻糬、經被覆之冷凍點心、及食用黏彈性物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260430B">A23L29/00</main-classification>
        <further-classification edition="200601120260430B">A23G9/04</further-classification>
        <further-classification edition="200601120260430B">A23G9/48</further-classification>
        <further-classification edition="201601120260430B">A23L7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOTTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高松寛之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMATSU, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一政洋子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMASA, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂口正和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGUCHI, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田燎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野真美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO,MAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小関彬弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZEKI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種食用黏彈性物，其係包含澱粉、糖類、米水解物及水之混合加熱物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1888" publication-number="202631380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B32B7/12</main-classification>
        <further-classification edition="200601120260422B">B32B17/10</further-classification>
        <further-classification edition="201801120260422B">C09J7/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河原崎勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWARAZAKI, ISAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立川悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIKAWA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木帆乃花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, HONOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻田拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGITA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>形見普史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAMI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種加飾層對於化學強化玻璃或無鹼玻璃之密接性較高從而加飾層不易脫落之積層體。  &lt;br/&gt;積層體1具備基材2、積層於基材2之至少一部分之接著劑層3、及以與接著劑層3接觸之方式形成之加飾層4。基材2為化學強化玻璃或無鹼玻璃。接著劑層3包含熱轉印性樹脂。加飾層4包含熱轉印性樹脂。接著劑層3之厚度與加飾層4之厚度的比，較佳為1：0.01～1：100。較佳為以與接著劑層3及加飾層4之至少一者相接之方式，於基材2之至少一部分具備黏著劑層5。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層體</p>
        <p type="p">2:化學強化玻璃或無鹼玻璃</p>
        <p type="p">3:接著劑層</p>
        <p type="p">4:加飾層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1889" publication-number="202631448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車用後變速器</chinese-title>
        <english-title>BICYCLE REAR DERAILLEUR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260421B">B62M9/122</main-classification>
        <further-classification edition="201001120260421B">B62M9/125</further-classification>
        <further-classification edition="200601120260421B">B62M25/08</further-classification>
        <further-classification edition="201001120260421B">B62M9/126</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松厚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井土垣慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDOGAKI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車用後變速器，其包含一基座構件，該基座構件包含經構形以待附接至一自行車車架之一安裝部分，該安裝部分具有一輪轂軸之一中心軸線於該自行車用後變速器之一安裝狀態中穿過之一安裝開口。該安裝部分包含一單一接頭或無任何接頭。亦包含相對於該基座構件經可移動地耦合之一可移動構件，及將該可移動構件操作性連接至該基座構件之一連桿結構。亦包含一馬達、一第一無線通信單元及一電連接器中之至少一者。該馬達、該第一無線通信單元及該電連接器中之該至少一者係安置於該基座構件、該可移動構件及該連桿結構中之至少一者上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle rear derailleur includes a base member including a mounting portion configured to be attached to a bicycle frame, the mounting portion having a mounting opening through which a central axis of a hub axle passes in a mounting state of the bicycle rear derailleur. The mounting portion includes a single joint or is free of any joint. Also included is a movable member movably coupled relative to the base member and a linkage structure operatively connecting the movable member to the base member. Also included is at least one of a motor, a first wireless communication unit, and an electrical connector. The at least one of the motor, the first wireless communication unit, and the electrical connector are disposed on at least one of the base member, the movable member, and the linkage structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自行車用後變速器</p>
        <p type="p">12:基座構件</p>
        <p type="p">14:安裝部分</p>
        <p type="p">16:安裝開口</p>
        <p type="p">18:輪轂軸</p>
        <p type="p">22:可移動構件</p>
        <p type="p">24:連桿結構</p>
        <p type="p">36:導鏈器</p>
        <p type="p">CA:中心軸線</p>
        <p type="p">F:自行車車架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1890" publication-number="202631059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣囊墊及氣囊裝置</chinese-title>
        <english-title>AIRBAG CUSHION AND AIRBAG APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A47C27/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市佳栓實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN JIASHUAN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佩霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種氣囊墊和氣囊裝置，該氣囊裝置包括第一氣囊、與該第一氣囊隔開的連接氣囊以及與該第一氣囊、連接氣囊隔開的多個第二氣囊;該第一氣囊包括出風口，並連接在氣閥上，允許空氣通過該出風口流入和流出該氣囊裝置的內部，該第一氣囊通過第一氣道與該連接氣囊連通，多個第二氣道連接該連接氣囊和多個該第二氣囊，多個第二氣道還互連該第二氣囊，每一個該第二氣道中的橫截面尺寸大於該第一氣道的橫截面尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an airbag cushion and air apparatus, the airbag apparatus includes a first airbag unit, a connecting airbag unit spaced from the first airbag unit and air communicating with the first airbag unit, a plurality of second airbag units spaced from the first airbag unit and the connecting airbag unit; the first airbag unit includes an air vent and attaches to a first valve, allowing air flow into and out of an interior of the airbag apparatus through the air vent, the first airbag unit communicates with the connecting airbag unit through a first air channel, and a plurality of second air channels connecting the connecting airbag unit and at least one of the plurality of the second airbag units and interconnecting each second airbag unit, a cross-sectional size of at least one of the second air channels is larger than that of the first air channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:氣囊裝置</p>
        <p type="p">110:氣囊</p>
        <p type="p">120:氣道</p>
        <p type="p">114:洗滌槽</p>
        <p type="p">121:第一氣道</p>
        <p type="p">111:第一氣囊</p>
        <p type="p">112:第二氣囊</p>
        <p type="p">122:第二氣道</p>
        <p type="p">300:氣閥</p>
        <p type="p">500:第一閥門</p>
        <p type="p">800:充放氣部件</p>
        <p type="p">113:第三氣囊</p>
        <p type="p">115:第五氣囊</p>
        <p type="p">112a:第二氣囊組</p>
        <p type="p">A:第一緩衝區</p>
        <p type="p">B:第二緩衝區</p>
        <p type="p">C:第三緩衝區</p>
        <p type="p">W1:第一氣道的寬度</p>
        <p type="p">W2:第二氣道的寬度</p>
        <p type="p">I-I:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1891" publication-number="202631829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機矽化合物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G77/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷恩智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤森颯雅香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMORI, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田敬幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野匡一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMATSU, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可獲得經時黏度變化率小、操作性優異的溶液的有機矽化合物及其製造方法。一種有機矽化合物，具有式（A）及式（B）所表示的結構，所述有機矽化合物中，至少包含式（B）所表示的結構，由式（B）表示且m=2的結構的比例比由式（B）表示且m=1的結構的比例多。在式（A）中，R&lt;sup&gt;1&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；R&lt;sup&gt;2&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；在式（B）中，R&lt;sup&gt;3&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；在式（B）中，m為1～30的整數。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="268px" width="355px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1892" publication-number="202631830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物及其製造方法、硬化物、以及元件及電子設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G77/44</main-classification>
        <further-classification edition="200601120260504B">C08L83/10</further-classification>
        <further-classification edition="200601120260504B">C09D183/10</further-classification>
        <further-classification edition="200601120260504B">C09J183/10</further-classification>
        <further-classification edition="202601120260504B">H10P14/60</further-classification>
        <further-classification edition="202601120260504B">H10P14/68</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B3/00</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
        <further-classification edition="202601120260504B">H10W20/48</further-classification>
        <further-classification edition="202601120260504B">H10W72/00</further-classification>
        <further-classification edition="202601120260504B">H10W72/90</further-classification>
        <further-classification edition="202601120260504B">H10W74/01</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
        <further-classification edition="202601120260504B">H10W80/00</further-classification>
        <further-classification edition="202601120260504B">H10W95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷恩智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤森颯雅香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMORI, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田敬幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野匡一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMATSU, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含有機矽化合物、經時黏度變化率小、操作性優異的樹脂組成物。一種樹脂組成物，包含具有式（A）及式（B）所表示的結構的有機矽化合物，所述樹脂組成物中，該有機矽化合物的由式（B）表示且m=2的結構的比例比由式（B）表示且m=1的結構的比例多。在式（A）中，R&lt;sup&gt;1&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；R&lt;sup&gt;2&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；在式（B）中，R&lt;sup&gt;3&lt;/sup&gt;獨立地為碳數1～40的烷基、碳數5或6的環烷基、或碳數6～20的芳基；在式（B）中，m為1～30的整數。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="253px" width="330px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1893" publication-number="202631563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>2,2-雙(4-羥基苯基)十三烷之結晶及其製造方法</chinese-title>
        <english-title>CRYSTALS OF 2,2-BIS(4-HYDROXYPHENYL)TRIDECANE AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C07C37/84</main-classification>
        <further-classification edition="200601120260424B">C07C39/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本州化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONSHU CHEMICAL INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芳井建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHII, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供具有適於工業生產之較高的熱安定性及充分的流動性之2,2-雙(4-羥基苯基)十三烷之結晶。該課題之解決手段為提供一種2,2-雙(4-羥基苯基)十三烷之結晶，其利用差示掃描熱量測定分析所得的吸熱峰之峰頂溫度落在84~96℃之範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective is to provide crystals of 2,2-bis(4-hydroxyphenyl)tridecane having high thermal stability and sufficient fluidity suitable for industrial production. As a solution, provided are crystals of 2,2-bis(4-hydroxyphenyl)tridecane in which the peak-top temperature of an endothermic peak measured by differential scanning calorimetry analysis is in the range of 84-96 °C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1894" publication-number="202631931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著劑膜、帶金屬層的接著劑膜、配線形成用構件、配線層的形成方法及配線形成構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260430B">C09J7/30</main-classification>
        <further-classification edition="200601120260430B">C09J9/02</further-classification>
        <further-classification edition="200601120260430B">C09J163/00</further-classification>
        <further-classification edition="200601120260430B">H05K3/16</further-classification>
        <further-classification edition="202601120260430B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大越将司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKOSHI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山浦格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAURA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接著劑膜，含有環氧樹脂及酚樹脂，環氧樹脂的環氧當量為150 g/eq以下。一種帶金屬層的接著劑膜，包括金屬層、以及配置於金屬層上的接著劑層，接著劑層含有環氧樹脂及酚樹脂，環氧樹脂的環氧當量為150 g/eq以下。一種配線形成用構件，其中，接著劑層與金屬層分體地設置，使用時接著劑層能夠接著於金屬層，所述配線形成用構件中，接著劑層含有環氧樹脂及酚樹脂，環氧樹脂的環氧當量為150 g/eq以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線形成用構件</p>
        <p type="p">10:接著劑層</p>
        <p type="p">10a、20a:第一面</p>
        <p type="p">10b、20b:第二面</p>
        <p type="p">12:導電性粒子</p>
        <p type="p">14:接著劑成分</p>
        <p type="p">20:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1895" publication-number="202631815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>正型光敏樹脂組合物及顯示裝置</chinese-title>
        <english-title>POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/023</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="202301120260504B">H10K50/00</further-classification>
        <further-classification edition="202301120260504B">H10K59/12</further-classification>
        <further-classification edition="202301120260504B">H10K85/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東進世美肯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGJIN SEMICHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李太遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仙熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG MYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOK HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, TAI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹赫敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, HYOC-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成鎔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏娜拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WI, NA RA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種顯示裝置，其具有有機物，包含可以實現具有改善的靈敏度和殘留物性能的有機薄膜的正型光敏樹脂組合物和其固化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1896" publication-number="202631849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">C08K3/013</main-classification>
        <further-classification edition="200601120260504B">C08K7/00</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">C08J5/24</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">B32B27/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/20</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松晃樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村翔真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, SHOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供樹脂組成物、以及硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置。本揭示之樹脂組成物，包含熱固性樹脂、無機填料、及核殼型有機填料，相對於無機填料和核殼型有機填料之合計100體積%，核殼型有機填料之含有比例為10~25體積%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1897" publication-number="202631816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>正型光敏樹脂組合物及顯示裝置</chinese-title>
        <english-title>POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/022</further-classification>
        <further-classification edition="200601120260504B">G03F7/039</further-classification>
        <further-classification edition="200601120260504B">G09F9/33</further-classification>
        <further-classification edition="202301120260504B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東進世美肯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGJIN SEMICHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOK HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成鎔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏娜拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WI, NA RA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李太遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仙熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG MYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, TAI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹赫敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, HYOC-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種顯示裝置，其具有有機物，包含可以實現具有改善的耐化學性和耐熱性的有機薄膜的正型光敏樹脂組合物和其固化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:源極/漏極</p>
        <p type="p">20:有機薄膜</p>
        <p type="p">30:陽極</p>
        <p type="p">40:像素定義層(PDL)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1898" publication-number="202633369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製造裝置用構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P72/70</main-classification>
        <further-classification edition="200601120260424B">C04B35/111</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久野達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之晶圓載置台10具備陶瓷板20、栓塞配置孔24，以及栓塞50。栓塞50配置於栓塞配置孔24，並且具有氣體流道52。觀察栓塞50的縱剖面之時，在將氣體流道52的上下方向長度設為d1［mm］、將氣體流道52彼此之間的栓塞本體51的上下方向長度設為d2［mm］、將栓塞本體51的相對介電常數設為εr、並且將在栓塞50的縱剖面上下方向地排列之氣體流道52的個數設為x［個］之時，會滿足F＝εr＊d1／｛x＊（εr＊d1＋d2）｝≦0.25。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓載置台</p>
        <p type="p">20:陶瓷板</p>
        <p type="p">21:晶圓載置面</p>
        <p type="p">21a:密封環帶</p>
        <p type="p">21b:圓形小突起</p>
        <p type="p">21c:基準面</p>
        <p type="p">22:電極</p>
        <p type="p">24:栓塞配置孔</p>
        <p type="p">26:聚焦環載置面(FR載置面)</p>
        <p type="p">26a:FR支撐面</p>
        <p type="p">26b:凹部</p>
        <p type="p">28:栓塞配置孔</p>
        <p type="p">30:底板</p>
        <p type="p">32:冷媒流道</p>
        <p type="p">34:氣孔</p>
        <p type="p">34a:大直徑部</p>
        <p type="p">40:金屬接合層</p>
        <p type="p">42:貫通孔</p>
        <p type="p">50:栓塞</p>
        <p type="p">51:栓塞本體</p>
        <p type="p">52:氣體流道</p>
        <p type="p">55:栓塞</p>
        <p type="p">56:栓塞本體</p>
        <p type="p">57:氣體流道</p>
        <p type="p">60:聚焦環</p>
        <p type="p">62:圓周溝槽</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1899" publication-number="202632070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146881</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅被覆樹脂粒子及含填料的糊料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C23C18/38</main-classification>
        <further-classification edition="202401120260420B">B01J35/53</further-classification>
        <further-classification edition="202201120260420B">B22F1/065</further-classification>
        <further-classification edition="200601120260420B">H01B1/16</further-classification>
        <further-classification edition="200601120260420B">C09D5/24</further-classification>
        <further-classification edition="200601120260420B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱綜合材料電子化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>影山謙介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYAMA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口莉帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, RIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種銅被覆樹脂粒子以及包含該銅被覆樹脂粒子作為填料之含填料的糊料；前述銅被覆樹脂粒子係具備由樹脂組成物構成的樹脂粒子(11)與形成在該樹脂粒子(11)之表面的銅被覆層(12)的銅被覆樹脂粒子(10)，其特徵為：在0.05質量%以上5.0質量%以下的範圍內包含氧化矽，並且包含Sn及Pd。5%壓縮彈性模數(5%K值)較佳在0.2GPa以上3.5GPa以下的範圍內。前述樹脂組成物較佳為選自丙烯酸樹脂、苯乙烯樹脂、聚矽氧樹脂、酚樹脂、胺基甲酸酯樹脂、聚醯亞胺樹脂的一種或二種以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:銅被覆樹脂粒子</p>
        <p type="p">11:樹脂粒子</p>
        <p type="p">12:銅被覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1900" publication-number="202633279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146888</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光加熱裝置</chinese-title>
        <english-title>OPTICAL HEATING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10P34/00</main-classification>
        <further-classification edition="202501120260429B">H10H20/00</further-classification>
        <further-classification edition="202601120260429B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商牛尾電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIO DENKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池喜匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKE, YOSHIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光加熱裝置，即使在與處理對象基板的中央部對置的區域中對LED元件的配置產生制約之情況下，也能夠提高對該中央部的加熱光的照度。  &lt;br/&gt;　　光加熱裝置是對處理對象基板照射光而對前述處理對象基板進行加熱的光加熱裝置，具備：支持單元，其支持前述處理對象基板；光源單元，其具有與前述處理對象基板的主面之一部分對置配置的LED基板、及載置於前述LED基板的複數個LED元件，至少通過前述處理對象基板的主面的中心之法線的附近與前述處理對象基板連通；及光學系統，其配置於前述處理對象基板與前述LED基板之間，將前述LED元件發出的光的至少一部分朝向前述處理對象基板的中央部折射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Providing an optical heating apparatus capable of increasing the illuminance of heating light to be applied to a central portion of a substrate to be treated, even in a case where there is a restriction on the disposition of an LED element in a region that faces the central portion. The optical heating apparatus includes: a support unit that supports the substrate to be treated; a light source unit that includes an LED substrate that is disposed to face the substrate to be treated, and a plurality of LED elements; and an optical system that refracts at least a portion of light emitted by the plurality of LED elements, toward a central portion of the substrate to be treated, wherein the light source unit is configured to include a space facing the substrate to be treated at least in a vicinity of a normal of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光加熱裝置</p>
        <p type="p">2:支持單元</p>
        <p type="p">3:LED元件</p>
        <p type="p">3a:LED元件</p>
        <p type="p">3b:LED元件</p>
        <p type="p">4:LED基板</p>
        <p type="p">5:光源單元</p>
        <p type="p">6:散熱器</p>
        <p type="p">7:透鏡基板</p>
        <p type="p">8:透鏡元件</p>
        <p type="p">9:光學系統</p>
        <p type="p">20:腔室</p>
        <p type="p">25:光透過窗</p>
        <p type="p">30:噴嘴</p>
        <p type="p">32:清洗裝置</p>
        <p type="p">A1:法線</p>
        <p type="p">L1:加熱光</p>
        <p type="p">P1:連通區域</p>
        <p type="p">S1:處理液</p>
        <p type="p">S2:清洗液</p>
        <p type="p">W1:處理對象基板</p>
        <p type="p">W1a:(處理對象基板的-Z側的)主面</p>
        <p type="p">W1b:(處理對象基板的+Z側的)主面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1901" publication-number="202632908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146893</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於資料轉換器之自適性電荷量測電路</chinese-title>
        <english-title>ADAPTIVE CHARGE MEASUREMENT CIRCUIT FOR DATA CONVERTERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03M1/46</main-classification>
        <further-classification edition="200601120260504B">H03M1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商歐柏西迪恩感應器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBSIDIAN SENSORS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文　兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　傑廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示資料轉換器電路及操作該等資料轉換器電路之方法。在一些實施例中，一資料轉換器電路包含一電荷量測電路。在一些實施例中，該電荷量測電路係一電容轉阻放大器(CTIA)。在一些實施例中，該資料轉換器電路包含該CTIA、一量化器、一數位轉類比轉換器、一加法器及一數位濾波器。在一些實施例中，該資料轉換器電路包含電耦合至該CTIA及該數位濾波器之一類比轉數位轉換器。在一些實施例中，一方法包含用一CTIA對一輸入信號進行積分，判定一CTIA輸出信號是否大於一臨限值，及基於該CTIA輸出信號是否大於該臨限值之該判定減小該CTIA輸出信號或放棄該減小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Data converter circuits and methods of operating the data converter circuits are disclosed. In some embodiments, a data converter circuit includes a charge measurement circuit. In some embodiments, the charge measurement circuit is a capacitive transimpedance amplifier (CTIA). In some embodiments, the data converter circuit includes the CTIA, a quantizer, a digital-to-analog converter, a summer, and a digital filter. In some embodiments, the data converter circuit includes an analog-to-digital converter electrically coupled to the CTIA and the digital filter. In some embodiment, a method includes integrating an input signal with a CTIA, determining whether a CTIA output signal is greater than a threshold, and reducing the CTIA output signal or forgoing the reducing based on the determination of whether the CTIA output signal is greater than the threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路</p>
        <p type="p">102:電容(電荷)轉阻放大器(CTIA)</p>
        <p type="p">104:量化器/量化器輸出</p>
        <p type="p">106:數位轉類比轉換器(DAC)</p>
        <p type="p">108:加法器</p>
        <p type="p">110:輸入信號</p>
        <p type="p">112:數位輸出信號</p>
        <p type="p">114:輸入</p>
        <p type="p">116:回饋電容器</p>
        <p type="p">118:類比轉數位轉換器(ADC)</p>
        <p type="p">120:偏移移除電路</p>
        <p type="p">122:有限脈衝回應(FIR)整數倍降低取樣器</p>
        <p type="p">124:時序及控制電路</p>
        <p type="p">126:重設開關</p>
        <p type="p">128:數位輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1902" publication-number="202631539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146908</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有鋁酸鈹的陶瓷部件</chinese-title>
        <english-title>CERAMIC COMPONENTS CONTAINING BERYLLIUM ALUMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C04B35/44</main-classification>
        <further-classification edition="200601120260504B">C04B35/626</further-classification>
        <further-classification edition="200601120260504B">C04B35/645</further-classification>
        <further-classification edition="200601120260504B">G01T1/20</further-classification>
        <further-classification edition="202601120260504B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬騰榮公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATERION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格倫辛　弗里茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRENSING, FRITZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　世京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SEKYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫勒　勞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOELLER, LAUREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋁酸鈹部件可以包括包含90重量%或更多鋁酸鈹的鋁酸鈹陶瓷。該陶瓷可以由下列中的一項或多項表徵：在室溫下17-175W/m．K的導熱率；在室溫下大於1×10&lt;sup&gt;15&lt;/sup&gt;ohm-cm和/或在700℃下大於1×10&lt;sup&gt;9&lt;/sup&gt;ohm-cm和/或在600℃下大於1×10&lt;sup&gt;10&lt;/sup&gt;ohm-cm的體電阻率；在室溫下7.4-9.0μm/(m．K)的熱膨脹係數；7.2-11.3的近乎人體組織生物等效(Z&lt;sub&gt;eff&lt;/sub&gt;)和3.4-3.9g/cc的密度。鋁酸鈹部件可以用於基座組件、晶圓基座、晶圓卡盤、整合式電阻加熱器和/或其部件中以及用於光受激發光、熱致發光、輻射發光或其劑量測定系統。還揭露了製備鋁酸鈹陶瓷部件的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A beryllium aluminate component may include a beryllium aluminate ceramic comprising 90 wt% or more beryllium aluminate. The ceramic may be characterized by one or more of: a thermal conductivity from 17 W/m．K to 175 W/m．K at room temperature; a bulk resistivity greater than 1 x 10&lt;sup&gt;15&lt;/sup&gt; ohm-cm at room temperature and/or greater than 1 x 10&lt;sup&gt;9&lt;/sup&gt; ohm-cm at 700 ℃ and/or greater than 1 x 10&lt;sup&gt;10&lt;/sup&gt; ohm-cm at 600 ℃; a coefficient of thermal expansion from 7.4 to 9.0 μm/(m．K) at room temperature; a near bioequivalence to human body tissue (Z&lt;sub&gt;eff&lt;/sub&gt;) from 7.2 to 11.3; and a density of from 3.4 to 3.9 g/cc. The beryllium aluminate components may be used in pedestal assemblies, wafer pedestals, wafer chucks, integral resistance heaters, and/or components thereof, as well as for optically stimulated luminescence, thermoluminescence, radioluminescence, or dosimetry systems thereof. Processes for preparing the beryllium aluminate ceramic components are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基座組件、組件</p>
        <p type="p">101:晶圓支撐子組件</p>
        <p type="p">105:連接器</p>
        <p type="p">110:基板</p>
        <p type="p">115:基材</p>
        <p type="p">120:加熱元件金屬層</p>
        <p type="p">125:RF電極</p>
        <p type="p">140:晶圓接觸支撐件</p>
        <p type="p">145:孔</p>
        <p type="p">150:導體</p>
        <p type="p">155:孔</p>
        <p type="p">156:貫通件</p>
        <p type="p">165:孔</p>
        <p type="p">175:對準孔</p>
        <p type="p">190:基座軸桿、軸桿</p>
        <p type="p">t&lt;sub&gt;110&lt;/sub&gt;:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1903" publication-number="202632044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過原子層沉積(ALD)製造含釕薄膜的方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING A RUTHENIUM-CONTAINING THIN FILM BY ATOMIC LAYER DEPOSITION (ALD)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C16/18</main-classification>
        <further-classification edition="200601120260422B">C23C16/455</further-classification>
        <further-classification edition="200601120260422B">C23C16/458</further-classification>
        <further-classification edition="200601120260422B">C23C16/50</further-classification>
        <further-classification edition="200601120260422B">C23C16/56</further-classification>
        <further-classification edition="200601120260422B">C07F15/00</further-classification>
        <further-classification edition="202601120260422B">H10P14/43</further-classification>
        <further-classification edition="202601120260422B">H10P14/24</further-classification>
        <further-classification edition="202601120260422B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＤＮＦ　有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DNF CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG ICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供含釕薄膜之製造方法及以此方法製造之含釕薄膜，且本發明之含釕薄膜的製造方法使用基於釕(0) 的烴化合物及特定的反應氣體，從而可藉由簡單的製程容易地製造高純度薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a method of manufacturing a ruthenium-containing thin film and a ruthenium-containing thin film manufactured therefrom, and the method of manufacturing a ruthenium-containing thin film of the present invention uses a ruthenium(0)-based hydrocarbon compound and specific reaction gas, whereby a high-purity thin film may be easily manufactured by a simple process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1904" publication-number="202631774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕氣硬化型聚胺酯熱熔樹脂組成物、接著劑及積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/12</main-classification>
        <further-classification edition="200601120260504B">C08G18/42</further-classification>
        <further-classification edition="200601120260504B">C08G18/44</further-classification>
        <further-classification edition="200601120260504B">C08G18/48</further-classification>
        <further-classification edition="200601120260504B">C08G18/62</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C09J175/04</further-classification>
        <further-classification edition="201801120260504B">C09J7/38</further-classification>
        <further-classification edition="200601120260504B">B32B27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西海健悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIUMI, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供耐落下衝擊性及耐熱潛變性優異的濕氣硬化型聚胺酯熱熔樹脂組成物、接著劑及積層體。一種濕氣硬化型聚胺酯熱熔樹脂組成物，其含有具有異氰酸酯基的胺基甲酸酯預聚物(i)，上述胺基甲酸酯預聚物(i)以多元醇(A)及聚異氰酸酯(B)作為原料，上述濕氣硬化型聚胺酯熱熔樹脂組成物的硬化物的、在25℃時的儲能模數E’(25)相對於在60℃時的儲能模數E’(60)的比率[E’(25)/E’(60)]為1.0～10.0的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1905" publication-number="202631775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕氣硬化型聚氨酯熱熔樹脂組合物、接著劑、層疊體及被著體的接著方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G18/12</main-classification>
        <further-classification edition="200601120260504B">C08G18/32</further-classification>
        <further-classification edition="200601120260504B">C08G18/42</further-classification>
        <further-classification edition="200601120260504B">C08G18/44</further-classification>
        <further-classification edition="200601120260504B">C08G18/48</further-classification>
        <further-classification edition="200601120260504B">C08G18/62</further-classification>
        <further-classification edition="200601120260504B">C08G18/76</further-classification>
        <further-classification edition="200601120260504B">C08L75/04</further-classification>
        <further-classification edition="200601120260504B">C09J175/04</further-classification>
        <further-classification edition="201801120260504B">C09J7/30</further-classification>
        <further-classification edition="201801120260504B">C09J7/35</further-classification>
        <further-classification edition="200601120260504B">C09J5/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西海健悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIUMI, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠實現細線狀的塗佈、並能夠形成黏接力及耐落下衝擊性優異的固化皮膜的濕氣硬化型聚氨酯熱熔樹脂組合物、接著劑、層疊體及被著體的接著方法。一種濕氣硬化型聚氨酯熱熔樹脂組合物，其含有具有異氰酸酯基的氨基甲酸酯預聚物(i)，上述氨基甲酸酯預聚物(i)至少以多元醇(A)、多異氰酸酯(B)及多胺(C)作為原料，上述多元醇(A)至少包含聚醚多元醇(a1)及聚丙烯酸類多元醇(a2)，上述多胺(C)的含量在上述氨基甲酸酯預聚物(i) 100質量份中為0.1質量份～1.0質量份的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1906" publication-number="202632638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其操作方法</chinese-title>
        <english-title>DISPLAY DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G09G5/02</main-classification>
        <further-classification edition="200601120260129B">G02F1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李叡珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭成俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SEONGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露一種顯示裝置。顯示裝置包括包含複數個顯示區塊的顯示面板、包含處理電路的至少一處理器、以及儲存指令的記憶體，其中指令在由至少一處理器單獨或共同執行時，導致顯示裝置在複數個顯示區塊中顯示至少一原色中的第一原色，以及基於識別對應於在複數個顯示區塊中顯示的第一原色的第一亮度值，識別對應於複數個顯示區塊中的每一個的第一亮度值中的第一最小亮度值，以及基於對應於複數個顯示區塊中的每一個的第一亮度值和第一最小亮度值，識別對應於複數個顯示區塊中的每一個的第一原色的第一抖動比例，基於為複數個顯示區塊中的每一個識別的第一抖動比例校正對應於複數個顯示區塊中的每一個的影像，以及在複數個顯示區塊中的每一個中顯示已校正影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is disclosed. The display device includes a display panel including a plurality of display blocks, at least one processor including processing circuitry, and memory storing instructions, wherein the instructions, when executed by the at least one processor individually or collectively, cause the display device to display a first primary color among at least one primary color in the plurality of display blocks, and based on identifying a first lightness value corresponding to the first primary color displayed in the plurality of display blocks, identify a first minimum lightness value among first lightness values corresponding to each of the plurality of display blocks, and based on the first lightness values corresponding to each of the plurality of display blocks and the first minimum lightness value, identify first dithering ratios corresponding to the first primary color for each of the plurality of display blocks, correct images corresponding to each of the plurality of display blocks based on the first dithering ratios identified for each of the plurality of display blocks, and display the corrected images in each of the plurality of display blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320、S330、S340、S350:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1907" publication-number="202632283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>撥盤式手柄以及加壓裝置</chinese-title>
        <english-title>DIAL-TYPE HANDLE AND PRESSURE DEVICE INCLUDING DIAL-TYPE HANDLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G01R1/02</main-classification>
        <further-classification edition="200601120260313B">G01R1/04</further-classification>
        <further-classification edition="202001120260313B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, HEE IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可以輕易地對可旋轉容許角度進行設定的撥盤式手柄以及加壓裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1908" publication-number="202632289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試插座</chinese-title>
        <english-title>TEST SOCKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01R1/04</main-classification>
        <further-classification edition="200601120260102B">G01R1/44</further-classification>
        <further-classification edition="202001120260102B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴商德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANG DUCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於有效地對在導電銷中產生的熱量進行散熱的測試插座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1909" publication-number="202633348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理裝置之控制方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND METHOD OF CONTROLLING SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/30</main-classification>
        <further-classification edition="200601120260504B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒枝篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROEDA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西出信彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDE, NOBUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西出基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDE, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野智宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種可以簡單之構造，由第1手部及第2手部之各者將基板相對於處理腔室搬入搬出之技術。  &lt;br/&gt;本發明之基板處理裝置具備處理單元(乾燥處理單元30)、與搬送部(局部搬送部22)。搬送部包含：末端執行器230，其包含第1手部231及第2手部232；及手部移動驅動部24，其使末端執行器230於水平方向上移動。第1升降驅動部(銷升降驅動部341)使第1支持構件(複數個升降銷34)移動至第1支持構件中與基板W之下表面相接之第1抵接部較第1手部231靠上方之第1高度位置H31、第1抵接部位於第1手部231與第2手部232之間之第2高度位置H32、及第1抵接部較第2手部232靠下方之3高度位置H33之各者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:乾燥處理模組</p>
        <p type="p">10:裝載鎖定單元</p>
        <p type="p">11:裝載鎖定腔室</p>
        <p type="p">13:第2支持構件(升降銷)</p>
        <p type="p">14:第2升降驅動部(銷升降驅動部)</p>
        <p type="p">15:第1壓力調整部</p>
        <p type="p">16:第1氣體抽吸部</p>
        <p type="p">17:第1氣體供給部</p>
        <p type="p">18:支持板</p>
        <p type="p">19:波紋管</p>
        <p type="p">20:局部搬送單元</p>
        <p type="p">21:局部搬送腔室</p>
        <p type="p">22:搬送部(局部搬送部)</p>
        <p type="p">23:手部</p>
        <p type="p">24:手部移動驅動部</p>
        <p type="p">25:第2壓力調整部</p>
        <p type="p">26:第2氣體抽吸部</p>
        <p type="p">27:第2氣體供給部</p>
        <p type="p">30:處理單元(乾燥處理單元)</p>
        <p type="p">31:處理腔室(乾燥處理腔室)</p>
        <p type="p">32:基板被配置部</p>
        <p type="p">33:載物台</p>
        <p type="p">34:第1支持構件(升降銷)</p>
        <p type="p">35:第3壓力調整部</p>
        <p type="p">36:第3氣體抽吸部</p>
        <p type="p">37:第3氣體供給部</p>
        <p type="p">38:處理氣體供給部</p>
        <p type="p">161:第1抽吸管</p>
        <p type="p">162:第1壓力調整閥</p>
        <p type="p">171:第1供給管</p>
        <p type="p">172:第1供給閥</p>
        <p type="p">230:末端執行器</p>
        <p type="p">231:第1手部</p>
        <p type="p">232:第2手部</p>
        <p type="p">233:連結構件</p>
        <p type="p">241:進退驅動部</p>
        <p type="p">242:旋轉驅動部</p>
        <p type="p">261:第2抽吸管</p>
        <p type="p">262:第2壓力調整閥</p>
        <p type="p">271:第2供給管</p>
        <p type="p">272:第2供給閥</p>
        <p type="p">341:第1升降驅動部(銷升降驅動部)</p>
        <p type="p">342:支持板</p>
        <p type="p">343:波紋管</p>
        <p type="p">361:第3抽吸管</p>
        <p type="p">362:第3壓力調整閥</p>
        <p type="p">371:第3供給管</p>
        <p type="p">372:第3供給閥</p>
        <p type="p">381:供給管</p>
        <p type="p">382:供給閥</p>
        <p type="p">383:流量調整閥</p>
        <p type="p">Dx:移動方向</p>
        <p type="p">GLT:裝載搬送閘</p>
        <p type="p">GTP:搬送處理閘</p>
        <p type="p">H11:第1裝載高度位置(第1高度位置)</p>
        <p type="p">H12:第2裝載高度位置(第2高度位置)</p>
        <p type="p">H13:第3裝載高度位置(第3高度位置)</p>
        <p type="p">H31:第1處理高度位置(第1高度位置)</p>
        <p type="p">H32:第2處理高度位置(第2高度位置)</p>
        <p type="p">H33:第3處理高度位置(第3高度位置)</p>
        <p type="p">VP:抽吸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1910" publication-number="202633357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P72/50</main-classification>
        <further-classification edition="202301120260423B">H04N23/698</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵜飼智文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UKAI, TOMOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之基板處理系統具備腔室、模組及控制電路。模組具有至少一個相機。控制電路構成為產生處理空間內之檢查對象物之全景圖像。控制電路構成為控制模組，使至少一個相機移動至處理空間。控制電路構成為控制模組，從至少一個相機獲取第1範圍之第1圖像及第2範圍之第2圖像。控制電路構成為以第1圖像及第2圖像共通之特徵圖案為基準，由第1圖像及第2圖像產生全景圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:特徵圖案</p>
        <p type="p">11:基板支持部</p>
        <p type="p">70:標記</p>
        <p type="p">70a:標記</p>
        <p type="p">70b:標記</p>
        <p type="p">71:第1標記</p>
        <p type="p">71a:第1標記</p>
        <p type="p">72:第2標記</p>
        <p type="p">72a:第2標記</p>
        <p type="p">73:第3標記</p>
        <p type="p">73a:第3標記</p>
        <p type="p">74:第4標記</p>
        <p type="p">74a:第4標記</p>
        <p type="p">111c:基板支持面</p>
        <p type="p">A1:第1範圍</p>
        <p type="p">A2:第2範圍</p>
        <p type="p">A3:第3範圍</p>
        <p type="p">A4:第4範圍</p>
        <p type="p">A5:第5範圍</p>
        <p type="p">A6:第6範圍</p>
        <p type="p">A21,A41,A61:重疊範圍</p>
        <p type="p">AX:中心軸線</p>
        <p type="p">BP2:基準物體</p>
        <p type="p">ER:邊緣環</p>
        <p type="p">F1:第1圖像</p>
        <p type="p">F2:第2圖像</p>
        <p type="p">F3:第3圖像</p>
        <p type="p">F4:第4圖像</p>
        <p type="p">F5:第5圖像</p>
        <p type="p">F6:第6圖像</p>
        <p type="p">P1:全景圖像(第1全景圖像)</p>
        <p type="p">P2:全景圖像(第2全景圖像)</p>
        <p type="p">P3:全景圖像(第3全景圖像)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1911" publication-number="202632628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置、識別方法及程式</chinese-title>
        <english-title>DISPLAY DEVICE, AUTHENTICATION METHOD, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">G09G3/32</main-classification>
        <further-classification edition="200601120260504B">G02F1/133</further-classification>
        <further-classification edition="200601120260504B">G06F3/042</further-classification>
        <further-classification edition="202201120260504B">G06V40/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初見亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATSUMI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎌田太介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMADA, TAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠紘慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUNOKI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉一徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉住健輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZUMI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有觸摸檢測功能和指紋的攝像功能的顯示裝置。顯示裝置包括發光元件及受光元件。發光元件包括第一像素電極、發光層及共用電極，受光元件包括第二像素電極、活性層及共用電極。第一像素電極和第二像素電極設置在同一面上。共用電極隔著發光層與第一像素電極重疊，並隔著活性層與第二像素電極重疊。第一導電層、第二導電層及絕緣層設置在共用電極的上方，絕緣層設置在第一導電層的上方，第二導電層設置在絕緣層的上方。受光元件具有接收發光元件所發射的光的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device featuring a touch detection and a fingerprint imaging functions is provided. A display device includes a light-emitting element and a light-receiving element. The light-emitting element includes a first pixel electrode, a light-emitting layer, and a common electrode, and the light-receiving element includes a second pixel electrode, an active layer, and the common electrode. The first pixel electrode and the second pixel electrode are provided on the same plane. The common electrode overlaps with the first pixel electrode with the light-emitting layer therebetween, and overlaps with the second pixel electrode with the active layer therebetween. A first conductive layer, a second conductive layer, and an insulating layer are provided above the common electrode. The insulating layer is provided above the first conductive layer, and the second conductive layer is provided above the insulating layer. The light-receiving element has a function of receiving light emitted from the light-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">11:基板</p>
        <p type="p">12:基板</p>
        <p type="p">15:功能層</p>
        <p type="p">21R,G,B:發光元件</p>
        <p type="p">22:受光元件</p>
        <p type="p">31,32:導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1912" publication-number="202631766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻下層膜形成用組成物、光阻下層膜、光阻圖案之形成方法、及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G8/04</main-classification>
        <further-classification edition="200601120260504B">G03F7/11</further-classification>
        <further-classification edition="202601120260504B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兩角拓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROZUMI, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光武祐希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUTAKE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光阻下層膜形成用組成物，係含有具有複合單元結構之樹脂（G）及溶劑；  &lt;br/&gt;前述複合單元結構係具有：  &lt;br/&gt;具有具一個羥基之苯環之單元結構（A）、及  &lt;br/&gt;具有一個以上的碳原子之單元結構（B）；  &lt;br/&gt;前述單元結構（A）係具有前述苯環與其他苯環以單鍵鍵結之聯苯骨架、或前述苯環與其他苯環經由二價基團鍵結之聯苯類似物結構；  &lt;br/&gt;前述樹脂（G）係藉由在構成前述單元結構（A）之苯環之碳原子與前述單元結構（B）中之碳原子之間生成共價鍵之反應而獲得之樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1913" publication-number="202631700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>（甲基）丙烯酸系聚合物及其製造方法、熱可塑性樹脂組成物以及可塑劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/06</main-classification>
        <further-classification edition="200601120260504B">C08F4/34</further-classification>
        <further-classification edition="200601120260504B">C08F20/18</further-classification>
        <further-classification edition="200601120260504B">C08L27/06</further-classification>
        <further-classification edition="200601120260504B">C08L33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東亞合成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOAGOSEI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田廣之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神戶慎哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANBE, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川速人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種(甲基)丙烯酸系聚合物，其係於聚合物之末端具有環元數5~7之內酯環上鍵結有取代基之環結構，並滿足要件(I)、要件(II)或要件(III)。要件(I)：環結構以通式(1A)表示，且相對於聚合物之所有重複單元，前述環結構之含有率為32莫耳%以上。式(1A)中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1~3之烷基；R&lt;sup&gt;2&lt;/sup&gt;為氫原子、甲基或乙基；R&lt;sup&gt;3&lt;/sup&gt;為單鍵或亞甲基。惟當R&lt;sup&gt;3&lt;/sup&gt;為單鍵時，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;不同時為甲基。要件(II)：環結構以通式(1B)表示。要件(III)：環結構以通式(1C)表示，且相對於聚合物之所有重複單元，環結構之含有率為60莫耳%以上；且與丙烯酸2-乙基己酯及丙烯酸2-羥乙酯所成之共聚物相異。  &lt;br/&gt;&lt;img align="absmiddle" height="284px" width="269px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1914" publication-number="202632819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子零件之電性連接構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H01R31/06</main-classification>
        <further-classification edition="201101120260423B">H01R24/38</further-classification>
        <further-classification edition="200601120260423B">H01R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商廣瀨電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>會澤宏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIZAWA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIDA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]能夠提供一種電子零件之電性連接構造，其即便基板連結體與電子零件之距離增大，亦能夠抑制因訊號傳送所發生之損失增大。  &lt;br/&gt;　　[解決手段]將裝設於第一電路基板(P1)之第一光模組(1)與裝設於第二電路基板(P2)之ASIC3電性連接，並且將裝設於第二電路基板(P2)之第二光模組(2)與ASIC3電性連接之連接構造；該連接構造，係：第一電路基板(P1)與第二電路基板(P2)係藉由基板連結體(4、5、6)連結，於基板連結體(4、5)，纜線用第一中繼基板係直接連接至第一連接器，並且透過扁平型導體(F)連接至位於遠離第二連接器處之對象連接器(7、8)，纜線用第二中繼基板，係直接連接至第二連接器，且透過扁平型導體(F)連接至對象連接器(7、8)，連接器用中繼基板，係直接連接至第一連接器及第二連接器之雙方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一光模組(第一電子零件)</p>
        <p type="p">2:第二光模組(第三電子零件)</p>
        <p type="p">3:ASIC(第二電子零件)</p>
        <p type="p">4:基板連結體</p>
        <p type="p">5:基板連結體</p>
        <p type="p">6:基板連結體</p>
        <p type="p">7:對象連接器(對象連接部)</p>
        <p type="p">8:對象連接器(對象連接部)</p>
        <p type="p">F:扁平型纜線</p>
        <p type="p">P1:第一電路基板</p>
        <p type="p">P2:第二電路基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1915" publication-number="202632254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>瑕疵分析方法與檢測系統</chinese-title>
        <english-title>METHOD FOR DEFECT ANALYSIS AND INSPECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N21/88</main-classification>
        <further-classification edition="200601120260504B">G01N21/95</further-classification>
        <further-classification edition="200601120260504B">G01B11/00</further-classification>
        <further-classification edition="202301120260504B">H04N25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷克商威特靈公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WITRINS S.R.O.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哈特　帕瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINHART, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威瑟　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIESER, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於使用檢測系統(26)來分析產品、具體而言印刷電路板產品、半導體晶圓、賈法尼電池(galvanic cell)或諸如此類之瑕疵之方法，且係關於檢測系統，該檢測系統包括投影裝置(32)、光學偵測裝置(28)及處理裝置，該投影裝置之光譜儀構件將白色光分為其頻譜成分並將由此自單色光束形成之多色光束(37)以入射角β投影於產品上，該光學偵測裝置具有包括照相機(27)及物鏡(28)之偵測單元(29)，多色光束(37)在該偵測單元之偵測平面(46)中於該產品上反射，該偵測平面與該產品之產品表面(38)垂直，較佳地正交，該多色光束藉由該照相機來偵測，經反射多色光束投影於該照相機之影像感測器之影像平面(49)上，該處理裝置自該影像平面中之該經反射多色光束之空間分佈及該光學偵測單元相對於該產品之位置導出該產品表面之高度資訊，其中該處理裝置鑑別該影像平面中之該經反射多色光束之強度值之空間分佈的區間內之每一像素的強度值，該區間延伸跨越該影像感測器之至少兩個像素，該處理裝置基於各別強度值來確定該影像平面中之該空間分佈之中值及/或眾數之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for analyzing defects in a product, in particular a printed circuit board product, a semiconductor wafer, a galvanic cell or the like, using an inspection system (26), and to an inspection system, the inspection system comprising a projection device (32), an optical detection device (28), and a processing device, a spectrometer member of the projection device splitting white light into its spectral components and projecting a multichromatic light beam (37) thus formed from monochromatic light beams onto a product at an angle of incidence β, the optical detection device having a detection unit (29) comprising a camera (27) and an objective (28), a multichromatic light beam (37) being reflected on the product in a detection plane (46) of the detection unit, the detection plane being perpendicular, preferably orthogonal, to a product surface (38) of the product, the multichromatic light beam being detected by the camera, the reflected multichromatic light beam being projected onto an image plane (49) of an image sensor of the camera, the processing device deriving a height information of the product surface from a spatial distribution of the reflected multichromatic light beam in the image plane and a position of the optical detection unit relative to the product, wherein the processing device identifies an intensity value for each pixel within an interval of the spatial distribution of intensity values of the reflected multichromatic light beam in the image plane, said interval extending across at least two pixels of the image sensor, the processing device determining a location of a median and/or mode of the spatial distribution in the image plane based on the respective intensity values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">26:檢測系統</p>
        <p type="p">27:照相機</p>
        <p type="p">28:偵測裝置</p>
        <p type="p">29:偵測單元</p>
        <p type="p">30:物鏡</p>
        <p type="p">31:色散元件</p>
        <p type="p">32:投影裝置</p>
        <p type="p">33:光源</p>
        <p type="p">34:孔口</p>
        <p type="p">35:色散元件</p>
        <p type="p">36:稜鏡</p>
        <p type="p">37:多色光束</p>
        <p type="p">38:表面</p>
        <p type="p">39:箭頭/移動方向</p>
        <p type="p">40:透鏡總成</p>
        <p type="p">41:前透鏡</p>
        <p type="p">42:孔口</p>
        <p type="p">43:狹縫孔口</p>
        <p type="p">44:光學軸</p>
        <p type="p">45:平行邊界表面</p>
        <p type="p">46:偵測平面</p>
        <p type="p">47:物件平面</p>
        <p type="p">48:稜鏡</p>
        <p type="p">49:影像平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1916" publication-number="202631483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經構形以抬升一貨櫃之吊具之升降舵的控制</chinese-title>
        <english-title>CONTROL OF FLIPPERS OF A SPREADER CONFIGURED TO LIFT A CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B66C13/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＡＢＢ瑞士公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABB SCHWEIZ AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈克瑪　瑪里歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARKMAA, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐賀　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHR, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾德斯衝衝　歐洛夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDSTROM, OLOF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大體上係關於一種用於控制經構形以抬升一貨櫃(106)之一吊具(100)之至少一個升降舵(102)之電腦實施方法，該方法包括：控制(S102)該至少一個升降舵臂自一向下位置朝向一向上位置移動，等待(S104)一預定持續時間，及在該預定持續時間已過去之後，控制(S106)該至少一個升降舵臂移動至該向下位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention generally relates to a computer implemented method for controlling at least one flipper (102) of a spreader (100) configured to lift a container (106), the method comprising: controlling (S102) the at least one flipper arm to move from a down position towards an up position, waiting (S104) for a predetermined time duration, and after the predetermined time duration has lapsed, controlling (S106) the at least one flipper arm to move to the down position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S102:步驟</p>
        <p type="p">S104:步驟</p>
        <p type="p">S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1917" publication-number="202632966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供高EVS解析度之混合型CIS/EVS影像感測器</chinese-title>
        <english-title>HYBRID CIS/EVS IMAGE SENSOR PROVIDING HIGH EVS RESOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04N25/47</main-classification>
        <further-classification edition="202301120260504B">H04N25/11</further-classification>
        <further-classification edition="202301120260504B">H04N25/76</further-classification>
        <further-classification edition="202601120260504B">H10F39/95</further-classification>
        <further-classification edition="202501120260504B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇斯　安卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUESS, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示混合型CIS/EVS影像感測器。在一項實施例中，一像素配置包含複數個像素及一濾色器陣列。該複數個像素之各者可包含一光感測器、一浮動擴散、一轉移電晶體及一EVS電晶體，該EVS電晶體經組態以選擇性地將該光感測器耦合至對應於該像素之一事件驅動電路。該濾色器陣列可包含以一鑲嵌圖案配置在該複數個像素之光感測器上方之複數個濾色器，使得該複數個像素之一第一像素之該光感測器對應於一第一顏色且該複數個像素之一第二像素之該光感測器對應於不同於該第一顏色之一第二顏色。對應於該複數個像素之該事件驅動電路可(a)彼此不同且(b)經由一共同節點選擇性地彼此耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Hybrid CIS/EVS image sensors are disclosed herein. In one embodiment, a pixel arrangement includes a plurality of pixels and a color filter array. Each of the plurality of pixels can include a photosensor, a floating diffusion, a transfer transistor, and an EVS transistor configured to selectively couple the photosensor to an event driven circuit corresponding to the pixel. The color filter array can include a plurality of color filters arranged in a mosaic pattern over photosensors of the plurality of pixels such that the photosensor of a first pixel of the plurality of pixels corresponds to a first color and the photosensor of a second pixel of the plurality of pixels corresponds to a second color different from the first color. The event driven circuits corresponding to the plurality of pixels can be (a) different from one another and (b) selectively coupled to one another via a common node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:成像系統</p>
        <p type="p">320:像素</p>
        <p type="p">321-1:第一混合型單元</p>
        <p type="p">321-2:第二混合型單元</p>
        <p type="p">321-3:第三混合型單元</p>
        <p type="p">321-4:第四混合型單元</p>
        <p type="p">324a:第一光感測器</p>
        <p type="p">324b:第二光感測器</p>
        <p type="p">324c:第三光感測器</p>
        <p type="p">324d:第四光感測器</p>
        <p type="p">326a:轉移電晶體</p>
        <p type="p">326b:轉移電晶體</p>
        <p type="p">326c:轉移電晶體</p>
        <p type="p">326d:轉移電晶體</p>
        <p type="p">328:EVS電晶體</p>
        <p type="p">330:浮動擴散</p>
        <p type="p">332:重設電晶體</p>
        <p type="p">334:源極隨耦器電晶體</p>
        <p type="p">336:列選擇電晶體</p>
        <p type="p">341:堆疊式像素級連接(SPLC)</p>
        <p type="p">360:事件驅動電路</p>
        <p type="p">362:光電流轉電壓轉換器</p>
        <p type="p">364:緩衝器</p>
        <p type="p">366:差分電路</p>
        <p type="p">368:開關</p>
        <p type="p">370:共用節點</p>
        <p type="p">380:臨限值比較級</p>
        <p type="p">390:邏輯及交握電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1918" publication-number="202631488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磷酸鋰鐵前驅物、具高壓實密度之磷酸鋰鐵電池正極材料及其製作方法</chinese-title>
        <english-title>LITHIUM IRON PHOSPHATE PRECURSORS, LITHIUM IRON PHOSPHATE FOR CATHODE MATERIAL WITH HIGH COMPACTION DENSITY, AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C01B25/30</main-classification>
        <further-classification edition="200601120260416B">H01M4/36</further-classification>
        <further-classification edition="200601120260416B">H01M4/40</further-classification>
        <further-classification edition="200601120260416B">C04B35/04</further-classification>
        <further-classification edition="200601120260416B">C04B35/46</further-classification>
        <further-classification edition="200601120260416B">C08K7/00</further-classification>
        <further-classification edition="200601120260416B">C07H3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣立凱電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED LITHIUM ELECTROCHEMISTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林書妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磷酸鋰鐵前驅物，其製作步驟包含：將金屬氧化物、分散劑、碳源、鋰源以及第一磷酸鐵加入水溶液均勻混合後進行一次研磨，得到中值粒徑(D50)介於0.35至0.39um之間的第一前驅物；接著將第二磷酸鐵加入該第一前驅物均勻混合後進行二次研磨，得到中值粒徑(D50)介於0.35至0.39um之間的磷酸鋰鐵前驅物。本發明所提供之整體製程簡單，無須反覆更換材料或是反應環境或設備，體現連續式製程之優勢。除此之外，經由該磷酸鋰鐵前驅物所製成之磷酸鋰鐵電池正極材料具備有高壓實密度之特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lithium iron phosphate precursor, wherein its manufacturing process comprises uniformly mixing metal oxides, a dispersant, a carbon source, a lithium source, and a first iron phosphate in an aqueous solution followed by a first milling step, thereby obtaining a first precursor having a median particle size (D50) ranging from 0.35 to 0.39 μm; subsequently adding a second iron phosphate to the first precursor, uniformly mixing, and performing a second milling step to obtain a lithium iron phosphate precursor having a median particle size (D50) ranging from 0.35 to 0.39 μm, wherein the overall process is simple and requires no repeated replacement of materials, reaction environments, or equipment, thereby demonstrating the advantages of a continuous manufacturing process, and wherein the lithium iron phosphate cathode material produced from the precursor exhibits a high compaction density.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1919" publication-number="202631640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機金屬化合物、合成有機金屬化合物之方法，以及沉積金屬氧化物膜及金屬氮化物膜之方法</chinese-title>
        <english-title>ORGANOMETALLIC COMPOUNDS, METHODS OF SYNTHESIZING ORGANOMETALLIC COMPOUNDS, AND METHODS OF DEPOSITING METAL OXIDE FILMS AND METAL NITRIDE FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07F7/10</main-classification>
        <further-classification edition="200601120260504B">C07F7/18</further-classification>
        <further-classification edition="200601120260504B">C23C16/34</further-classification>
        <further-classification edition="200601120260504B">C23C16/40</further-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="202601120260504B">H10P14/692</further-classification>
        <further-classification edition="202601120260504B">H10P14/694</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商海星化工無限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEASTAR CHEMICALS ULC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森貝拉　紹恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEMBELLA, SHAUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法布耶克　戴安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FABULYAK, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯諾佛　卡西迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONOVER, CASSIDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎貝爾　柯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPBELL, COLLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞福　衛斯理　Ｐ．</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAFF, WESLEY PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於本文中揭示一種有機金屬化合物，其包括單體的烷氧基胺基矽烷錯合物及二聚體的烷氧基胺基矽烷錯合物，其有益於作為用於金屬氧化物及金屬氮化物氣相沉積的前驅物。再者，於本文中揭示一種用於合成此等有機金屬化合物的方法，及藉由使用此等有機金屬化合物之氣相沉積來形成金屬氧化物膜及金屬氮化物膜的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are organometallic compounds including monomeric alkoxyaminosilane complexes and dimeric alkoxyaminosilane complexes useful as precursors for metal oxide and metal nitride vapor phase deposition. Additionally, disclosed herein are methods for synthesizing these organometallic compounds and methods for forming metal oxide films and metal nitride films by vapor phase deposition using these organometallic compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1920" publication-number="202632969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有數位事件偵測之事件視覺感測器</chinese-title>
        <english-title>EVENT VISION SENSORS WITH DIGITAL EVENT DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04N25/772</main-classification>
        <further-classification edition="202301120260504B">H04N25/707</further-classification>
        <further-classification edition="202301120260504B">H04N23/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇斯　安卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUESS, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛樂　波伊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOWLER, BOYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭示具有數位事件偵測之事件視覺感測器(及相關聯系統、裝置及方法)。在一個實施例中，一種影像感測器包含一EVS像素、一類比轉數位轉換器(ADC)及事件偵測電路系統。該EVS像素可包含一光感測器、一積分型光偵測級及像素中取樣電路系統，該像素中取樣電路系統包括各經組態以執行相關雙取樣(CDS)操作以對積分輻照度級進行取樣之複數個電路分支。該ADC可耦合至該像素中取樣電路系統且經組態以將該等積分輻照度級轉換為對應數位信號。該事件偵測電路系統可耦合至該ADC且經組態以至少部分基於以下來產生事件信號：由該ADC輸出之該等對應數位信號之間的時間對比度差；及一對比度臨限值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Event vision sensors with digital event detection (and associated systems, devices, and methods) are disclosed herein. In one embodiment, an image sensor includes an EVS pixel, an analog-to-digital converter (ADC), and event detection circuitry. The EVS pixel can include a photosensor, an integrating-type photo-detecting stage, and in-pixel sampling circuitry comprising a plurality of circuit branches that are each configured to perform correlated double sampling (CDS) operations to sample integrated irradiance levels. The ADC can be coupled to the in-pixel sampling circuitry and configured to convert the integrated irradiance levels into corresponding digital signals. The event detection circuitry can be coupled to the ADC and configured to generate event signals based at least in part on temporal contrast differences between the corresponding digital signals output by the ADC and a contrast threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:堆疊式系統</p>
        <p type="p">102:第一晶粒</p>
        <p type="p">104:第二晶粒</p>
        <p type="p">106:第三晶粒</p>
        <p type="p">108:像素陣列</p>
        <p type="p">110:用於正常影像讀出之行級連接</p>
        <p type="p">112:事件驅動感測陣列</p>
        <p type="p">114:事件驅動周邊電路系統</p>
        <p type="p">116:影像讀出電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1921" publication-number="202632772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池組及包括其的載具</chinese-title>
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260504B">H01M10/613</main-classification>
        <further-classification edition="201401120260504B">H01M10/625</further-classification>
        <further-classification edition="201401120260504B">H01M10/643</further-classification>
        <further-classification edition="201401120260504B">H01M10/6556</further-classification>
        <further-classification edition="202101120260504B">H01M50/20</further-classification>
        <further-classification edition="202101120260504B">H01M50/204</further-classification>
        <further-classification edition="202101120260504B">H01M50/244</further-classification>
        <further-classification edition="202101120260504B">H01M50/249</further-classification>
        <further-classification edition="202101120260504B">H01M50/291</further-classification>
        <further-classification edition="201901120260504B">B60K1/04</further-classification>
        <further-classification edition="201901120260504B">B60L50/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE-GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, MYUNG-GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鍾仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JONG-IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種電池組，包括：電池陣列結構，包括多個電池單體；以及組殼體，具有用於容納電池陣列結構的容納空間，並包括設置於電池陣列結構下方的底板，其中電池陣列結構包括基座構件，基座構件覆蓋且支撐電池陣列結構的下部、包含發泡材料、並具有預定體積，以及其中基座構件在至少部分區域中與底板間隔開以形成排氣空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a battery pack, which includes a cell array structure including a plurality of battery cells; and a pack case having an accommodation space for accommodating the cell array structure and including a bottom plate disposed below the cell array structure, wherein the cell array structure includes a base member that covers and supports a lower portion of the cell array structure, contains a foaming material, and has a predetermined volume, and wherein the base member is spaced apart from the bottom plate in at least a partial region to form a venting space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池陣列結構</p>
        <p type="p">110:電池單體</p>
        <p type="p">120:冷卻單元</p>
        <p type="p">130:側框、側邊結構</p>
        <p type="p">210:底板</p>
        <p type="p">211:凸起</p>
        <p type="p">230:組蓋</p>
        <p type="p">300:基座構件</p>
        <p type="p">VS:排氣空間</p>
        <p type="p">Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1922" publication-number="202633452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線效應靜電放電檢測電路和測量天線效應靜電放電量的方法</chinese-title>
        <english-title>ANTENNA-EFFECT ELECTROSTATIC DISCHARGE DETECTION CIRCUIT AND METHOD FOR MEASURING ANTENNA-EFFECT ELECTROSTATIC DISCHARGING QUANTITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W42/60</main-classification>
        <further-classification edition="202501120260504B">H10D89/60</further-classification>
        <further-classification edition="202601120260504B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐俊成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, YAN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種天線效應靜電放電(ESD)檢測電路和一種測量天線效應靜電放電量的方法。該天線效應靜電放電檢測電路包括一第一天線效應靜電放電檢測裝置和一第一靜電放電保護裝置。該第一天線效應靜電放電檢測裝置耦合於一第一焊盤與一第二焊盤之間。該第一靜電放電保護裝置耦合於一輸入/輸出焊盤與該第一焊盤之間。所述的內部電路耦合至該輸入/輸出焊盤、該第一外部靜電放電保護裝置和該第一天線效應靜電放電檢測裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna-effect electrostatic discharge (ESD) detection circuit and a method for measuring the antenna-effect ESD quantity are provided. The antenna-effect ESD detection circuit includes a first antenna-effect ESD detection device and a first ESD protection device. The first antenna-effect ESD detection device is coupled between a first pad and a second pad. The first ESD protection device is coupled between an I/O pad and the first pad. The internal circuit is coupled to the I/O pad, the first external ESD protection device, and the first antenna-effect ESD detection device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">202:主動區域</p>
        <p type="p">204:隔離特徵</p>
        <p type="p">206:阱區域</p>
        <p type="p">212:閘極絕緣層</p>
        <p type="p">214:浮動閘極</p>
        <p type="p">216:閘極絕緣層</p>
        <p type="p">218:閘極電極</p>
        <p type="p">208D:源/漏摻雜區域</p>
        <p type="p">208DS:源/漏摻雜區域</p>
        <p type="p">208S:源/漏摻雜區域</p>
        <p type="p">210-1:閘極結構</p>
        <p type="p">210-2:閘極結構</p>
        <p type="p">260D:導電路徑</p>
        <p type="p">260G:導電路徑</p>
        <p type="p">260S:導電路徑</p>
        <p type="p">460A:天線效應靜電放電檢測裝置</p>
        <p type="p">D100:方向</p>
        <p type="p">D110:方向</p>
        <p type="p">TA1:浮動閘極電晶體</p>
        <p type="p">TA2:選擇電晶體</p>
        <p type="p">VD:電壓</p>
        <p type="p">VG:電壓</p>
        <p type="p">VS:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1923" publication-number="202632967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有數位事件偵測之事件視覺感測器</chinese-title>
        <english-title>EVENT VISION SENSORS WITH DIGITAL EVENT DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H04N25/47</main-classification>
        <further-classification edition="202301120260309B">H04N25/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇斯　安卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUESS, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛樂　波伊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOWLER, BOYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金恩　肯尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENG, KENNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示具有數位事件偵測之事件視覺感測器。在一個實施例中，一種影像感測器包含具有一光電感測器之一EVS像素、一積分型光偵測級及包含多個電路分支之像素內取樣電路系統。一類比轉數位轉換器(ADC)耦合至該像素內取樣電路系統且將類比輻照度位準轉換為數位信號。耦合至該ADC之事件偵測電路系統基於(i)由該ADC輸出之對應數位信號之間的時間對比度差及(ii)一對比度臨限值來運算事件信號。該像素內取樣電路系統可包含用於對暫態積分信號輻照度位準及積分參考輻照度位準進行取樣之分支。當時間對比度差超過該臨限值時，該事件偵測電路系統可確立事件信號，從而指示一曝光週期期間之事件偵測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Event vision sensors with digital event detection are disclosed herein. In one embodiment, an image sensor includes an EVS pixel with a photosensor, an integrating-type photo-detecting stage, and in-pixel sampling circuitry including multiple circuit branches. An analog-to-digital converter (ADC) is coupled to the in-pixel sampling circuitry and converts analog irradiance levels into digital signals. Event detection circuitry coupled to the ADC computes event signals based on (i) temporal contrast differences between corresponding digital signals output by the ADC and (ii) a contrast threshold. The in-pixel sampling circuitry can include branches for sampling momentary integrated signal irradiance levels and integrated reference irradiance levels. The event detection circuitry can assert event signals when temporal contrast differences exceed the threshold, indicating event detection during an exposure period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於事件之視覺感測器(EVS)系統</p>
        <p type="p">102:第一晶粒</p>
        <p type="p">104:第二晶粒</p>
        <p type="p">106:第三晶粒</p>
        <p type="p">108:像素陣列</p>
        <p type="p">110:行級連接</p>
        <p type="p">112:事件驅動感測陣列</p>
        <p type="p">114:事件驅動周邊電路系統</p>
        <p type="p">116:影像讀出電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1924" publication-number="202633260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板電鍍裝置、電鍍設備及基板電鍍方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P14/20</main-classification>
        <further-classification edition="200601120260422B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱志君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板電鍍裝置、電鍍設備及基板電鍍方法，基板電鍍裝置包括：槽體，具有進液部、出液部和鍍覆腔，鍍覆腔用於容納電鍍液且在電鍍期間被配置為密閉腔室；基板保持元件，用於保持基板，並且使得基板在電鍍期間以豎直姿態保持於鍍覆腔內部，其中，基板具有鍍覆面；陽極，位於鍍覆腔內部，且面向鍍覆面；電鍍液被配置為從鍍覆腔的一側自進液部沿第一方向流動至鍍覆腔的另一側後，自出液部排出鍍覆腔，以在鍍覆面上形成平行於鍍覆面的流場，其中，第一方向為平行於鍍覆面的方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:槽體</p>
        <p type="p">101:第一槽壁</p>
        <p type="p">102:第二槽壁</p>
        <p type="p">2:基板保持元件</p>
        <p type="p">3:陽極</p>
        <p type="p">31:第一陽極</p>
        <p type="p">32:第二陽極</p>
        <p type="p">4:基板</p>
        <p type="p">10:鍍覆腔</p>
        <p type="p">110:擋牆</p>
        <p type="p">111:空腔</p>
        <p type="p">11:進液部</p>
        <p type="p">11a:第一開口</p>
        <p type="p">11b:勻流板</p>
        <p type="p">12:出液部</p>
        <p type="p">13:第一鍍腔</p>
        <p type="p">131:第一陽極室</p>
        <p type="p">132:第一液流通道</p>
        <p type="p">133:第一離子膜</p>
        <p type="p">14:第二鍍腔</p>
        <p type="p">141:第二陽極室</p>
        <p type="p">142:第二液流通道</p>
        <p type="p">143:第二離子膜</p>
        <p type="p">40:鍍覆面</p>
        <p type="p">401:第一鍍覆面</p>
        <p type="p">402:第二鍍覆面</p>
        <p type="p">51:進液元件</p>
        <p type="p">511:第一進液管路</p>
        <p type="p">512:第二進液管路</p>
        <p type="p">52:出液元件</p>
        <p type="p">521:第一出液管路</p>
        <p type="p">522:第二出液管路</p>
        <p type="p">61:第一擴散板</p>
        <p type="p">62:第二擴散板</p>
        <p type="p">71:檢測裝置</p>
        <p type="p">72:姿態調節裝置</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1925" publication-number="202631509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無色、無顆粒之含胺基矽烷的濕式蝕刻調配物</chinese-title>
        <english-title>COLORLESS, PARTICLE-FREE, AMINOSILANE-CONTAINING WET ETCH FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260428B">C01F17/224</main-classification>
        <further-classification edition="200601120260428B">C09K13/04</further-classification>
        <further-classification edition="200601120260428B">C23F1/24</further-classification>
        <further-classification edition="200601120260428B">C07C211/00</further-classification>
        <further-classification edition="201801120260428B">C08K3/014</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶維尼斯　克勞蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEVENES, CLAUDIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特　丹尼拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHITE, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘娜曼　瑞貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANNAMAN, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供無色蝕刻劑組合物及獲得無色蝕刻劑組合物之方法。蝕刻劑組合物可包括磷酸、含胺化合物及光吸收化合物。該光吸收化合物係該磷酸及脫色劑之反應產物。該脫色劑可包括呈其最高氧化態之鑭系元素化合物，且對在熱或光化學誘導胺氧化期間形成之反應性氧物質或有機自由基具有強清除性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Colorless etchant compositions and method of obtaining colorless etchant compositions are provided. Etchant compositions may comprise a phosphoric acid, an amine-containing compound, and a light absorbing compound. The light absorbing compound is a reaction product of the phosphoric acid and a decolorizing agent. The decolorizing agent may comprise a lanthanide compound in its highest oxidation state and have strong scavenging properties of reactive oxygen species or organic radicals formed during thermally or photochemically induced amine oxidation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1926" publication-number="202632801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器裝置以及連接器裝置之散熱結構</chinese-title>
        <english-title>CONNECTOR DEVICE AND HEAT DISSIPATION STRUCTURE FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260402B">H01R13/46</main-classification>
        <further-classification edition="200601120260402B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商任天堂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINTENDO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤僚太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古池裕智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUIKE, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生田紘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKUTA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供用以抑制收容於卡連接器的卡的溫度上升的新的散熱結構、以及適於此散熱結構的連接器裝置。  &lt;br/&gt;[解決方案] 散熱結構10包括基板12、連接器裝置14、以及散熱構件16。在基板12形成有通孔22。連接器裝置14包括卡連接器30以及金屬製的支架60。卡連接器30收容卡80，並且在上下方向(Z方向)搭載於基板12。卡連接器30包括外殼38。外殼38具有上板部41。支架60具有端子64以及蓋部61。端子64軟焊於基板12的通孔22。支架60的蓋部61與外殼38的上板部41連接。散熱構件16連接於蓋部61。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation structure is configured to reduce temperature rise of a card. The heat dissipation structure has a board, a connector device and a heat dissipation member. The board is formed with a through hole. The connector device has a card connector and a bracket made of metal. The card connector is configured to accommodate the card and is mounted on the board in an up-down direction. The card connector has a shell. The shell has an upper plate. The bracket has a terminal and a cover. The terminal is soldered in the through hole of the board. The cover of the bracket is connected to the upper plate of the shell. The heat dissipation member is connected to the cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱結構</p>
        <p type="p">12:基板</p>
        <p type="p">14:連接器裝置</p>
        <p type="p">16:散熱構件</p>
        <p type="p">22:通孔</p>
        <p type="p">24:側部通孔/通孔</p>
        <p type="p">30:卡連接器</p>
        <p type="p">38:外殼</p>
        <p type="p">41:上板部</p>
        <p type="p">60:支架</p>
        <p type="p">61:蓋部</p>
        <p type="p">62:側板部</p>
        <p type="p">64:端子</p>
        <p type="p">80:卡</p>
        <p type="p">88:焊料</p>
        <p type="p">TP1:第一熱傳導路徑</p>
        <p type="p">TP2:第二熱傳導路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1927" publication-number="202631575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乙酸１，１－二氰基乙酯組成物、１，１－二氰基乙烯之製造方法、及１，１－二氰基乙烯組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C255/14</main-classification>
        <further-classification edition="200601120260504B">C07C253/30</further-classification>
        <further-classification edition="200601120260504B">C07C255/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹本憲太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEMOTO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻富敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INATOMI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIROTA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤花香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, HANAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可一邊抑制1,1-二氰基乙烯之製造時的聚合物之發生，一邊以高產率生成抑制著色的1,1-二氰基乙烯之乙酸1,1-二氰基乙酯組成物及1,1-二氰基乙烯之製造方法，本發明關於一種乙酸1,1-二氰基乙酯組成物，其包含作為主成分的乙酸1,1-二氰基乙酯(A)與作為副成分的選自由乙酸(B1)、乙醯氰(B2)及α-氰基乙酸乙烯酯(B3)所組成之群組中的至少1個之化合物，相對於上述成分(A)之質量，上述成分(B1)～(B3)之合計濃度為0.1質量ppm以上30,000質量ppm以下，而且相對於上述成分(A)之質量，乙酸(B1)之濃度、乙醯氰(B2)之濃度及α-氰基乙酸乙烯酯(B3)之濃度分別為10,000質量ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1928" publication-number="202631026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於煙草製品的可生物降解的過濾器濾棒</chinese-title>
        <english-title>A BIODEGRADABLE FILTER PLUG FOR A TOBACCO ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">A24D3/04</main-classification>
        <further-classification edition="200601120260430B">A24D3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＪＴ國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JT INTERNATIONAL SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴納　強漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAENNER, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種用於煙草製品的可生物降解的過濾器濾棒(50)，該過濾器濾棒包括第一過濾材料，該第一過濾材料包括：第一層纖維素基材料和第二層纖維素基材料(11，12)；以及風味元件(14)，該風味元件定位在該第一層與該第二層之間，其中，該第一層和該第二層在該風味元件周圍壓縮在一起以將該風味元件固定在適當位置。視需要，該過濾器濾棒包括第一過濾材料(10)和第二過濾材料(20)，其中，該第一過濾材料包括該第一層纖維素基材料和該第二層纖維素基材料，並且該風味元件和該第二過濾材料包括纖維素基材料，並且其中，該第一過濾材料和該第二過濾材料在該過濾器濾棒中捲起和/或折疊在一起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a biodegradable filter plug (50) for a tobacco article, comprising a first filter material comprising: first and second layers (11, 12) of cellulose-based material; and a flavour element (14) positioned between the first and second layers, wherein the first and second layers are compressed together around the flavour element to secure the flavour element in position. Optionally, the filter plug comprises a first filter material (10) and a second filter material (20), wherein the first filter material comprises the first and second layers of cellulose-based material and the flavour element and the second filter material comprises a cellulose-based material, and wherein the first and second filter materials are rolled and/or folded together in the filter plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一過濾材料</p>
        <p type="p">11:第一層纖維素基材料</p>
        <p type="p">12:第二層纖維素基材料</p>
        <p type="p">13a:第一壓合部分</p>
        <p type="p">13b:第二壓合部分</p>
        <p type="p">14:風味元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1929" publication-number="202631701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147243</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂、樹脂的製造方法、硬化性樹脂材料、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/06</main-classification>
        <further-classification edition="200601120260504B">C08F2/38</further-classification>
        <further-classification edition="200601120260504B">C08F4/52</further-classification>
        <further-classification edition="200601120260504B">C08F212/14</further-classification>
        <further-classification edition="200601120260504B">C08F232/08</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C08J5/24</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂，其在反應原料中包含：茚化合物(A)、具有X－CH&lt;sub&gt;2&lt;/sub&gt;－基(X為脫離基)的苯乙烯化合物(B)、及具有X－CH&lt;sub&gt;2&lt;/sub&gt;－基(X為脫離基)的芳香族化合物(C)，惟該芳香族化合物(C)排除前述苯乙烯化合物(B)，並且，樹脂的GPC圖表中的分子量為1,000以上的成分的面積比例為1.5％以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1930" publication-number="202633175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10D84/83</main-classification>
        <further-classification edition="202601120260421B">H10D84/01</further-classification>
        <further-classification edition="201101120260421B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋恒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是構成一種具備基板及形成於基板上的奈米薄片電晶體之半導體裝置。  &lt;br/&gt;　　奈米薄片電晶體具備：藉由奈米薄片所形成的成為通道區域的半導體層；閘極電極；源極/汲極區域；及內部間隔物。  &lt;br/&gt;　　又，半導體層是在半導體層與閘極電極的層疊方向的平面視中，在與閘極電極重疊的區域中，具有通道寬度方向的長度比和源極/汲極區域連接的部分更大的擴寬部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:閘極電極</p>
        <p type="p">102:半導體層(第二半導體層)</p>
        <p type="p">112:閘極下區域</p>
        <p type="p">115:連接部分</p>
        <p type="p">117:內部間隔物</p>
        <p type="p">121:閘極區域</p>
        <p type="p">122:擴寬部分</p>
        <p type="p">125:窄寬部分</p>
        <p type="p">127:間隔物區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1931" publication-number="202631692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含額外結構域之重組蛋白質</chinese-title>
        <english-title>RECOMBINANT PROTEIN COMPRISING ADDITIONAL DOMAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/32</main-classification>
        <further-classification edition="200601120260504B">C07K19/00</further-classification>
        <further-classification edition="200601120260504B">C12N15/62</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法信諾生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VACINO BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種包含額外結構域之重組蛋白質；例如，包含用於穿透血腦障壁之轉運體結構域的重組抗體。亦提供一種編碼該重組蛋白質之核酸。本發明亦揭示一種藉由使用本發明重組蛋白質治療或偵測疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a recombinant protein comprising an additional domain; for example, a recombinant antibody comprising a transporter domain for penetrating the blood-brain barrier. A nucleic acid encoding the recombinant protein is also provided. Also disclosed herein is a method for treating or detecting a disease by use of the present recombinant protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1932" publication-number="202632233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於奈米結構表徵的拉曼光譜系統、方法及非暫時性電腦可讀媒體</chinese-title>
        <english-title>RAMAN SPECTROSCOPY SYSTEM FOR NANOSTRUCTURE CHARACTERIZATION, METHOD AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">G01J3/44</main-classification>
        <further-classification edition="200601120260430B">G01N21/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商諾威股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVA LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉克　吉列德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARAK, GILAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧倫　由納坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OREN, YONATAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及使用功率依賴性拉曼光譜進行奈米片表徵。本發明提供用於表徵奈米結構的方法，包括：使用拉曼光譜雷射以足以生成顯著自由電荷載流子的第一功率水平照射奈米結構，獲取第一拉曼光譜；以低於第一功率水平的第二功率水平照射奈米結構，第二功率水平生成可忽略的自由電荷載流子，獲取第二拉曼光譜；及基於第一拉曼光譜和第二拉曼光譜之間的差異確定至少一個材料性質。奈米結構可包括奈米片場效應電晶體，其具有交替的矽層和矽鍺層的超晶格，每層具有小於10奈米的厚度。材料性質可包括應變、鍺成分、自由電荷載流子壽命或擴散性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for characterizing a nanostructure comprising illuminating the nanostructure with a Raman spectroscopy laser at a first power level sufficient to generate significant free charge carriers, acquiring a first Raman spectrum, illuminating the nanostructure at a second power level lower than the first power level wherein the second power level generates negligible free charge carriers, acquiring a second Raman spectrum, and determining at least one material property based on a difference between the first and second Raman spectra. The nanostructure may comprise a nanosheet field effect transistor having a superlattice of alternating Silicon and Silicon-Germanium layers with each layer having thickness less than 10 nanometers. The material property may comprise strain, Germanium composition, free charge carrier lifetime, or diffusion properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拉曼光譜系統</p>
        <p type="p">110:照射模組</p>
        <p type="p">120:感測單元</p>
        <p type="p">130:處理電路</p>
        <p type="p">140:控制單元</p>
        <p type="p">150:記憶體單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1933" publication-number="202632540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於異質核心上之機器學習模型的權重共享</chinese-title>
        <english-title>WEIGHT SHARING FOR MACHINE LEARNING MODELS ON HETEROGENEOUS CORES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260401B">G06N3/063</main-classification>
        <further-classification edition="202301120260401B">G06N3/0495</further-classification>
        <further-classification edition="202301120260401B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑曉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辜曉琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, XIAOLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸九淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JIUYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>將翠紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CUIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種用於運行一機器學習(ML)模型之系統及技術。例如，一種方法可包括：將一資料結構從一長期記憶體載入至一短期記憶體中，該資料結構包括包括嵌入資訊，以用於將識別符映射至對應的向量；轉置該嵌入資訊，以產生一經轉置資料結構；及將該經轉置資料結構提供至一語言模型(LM)頭，以用於將特徵向量轉譯成該等識別符。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described herein for running a machine learning (ML) model. For instance, a process can include loading a data structure from a long-term memory into a short-term memory, the data structure including embedding information for mapping identifiers to corresponding vectors; transposing the embedding information to generate a transposed data structure; and providing the transposed data structure to a language model (LM) head for translating feature vectors to the identifiers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:異質運算</p>
        <p type="p">602:嵌入</p>
        <p type="p">604:資料結構</p>
        <p type="p">606:符記識別符</p>
        <p type="p">608:向量</p>
        <p type="p">610:詞彙表的大小</p>
        <p type="p">612:嵌入資訊的大小</p>
        <p type="p">614:第一處理器</p>
        <p type="p">616:載入</p>
        <p type="p">618:轉置操作</p>
        <p type="p">620:額外處理器</p>
        <p type="p">622:重新配置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1934" publication-number="202632762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備</chinese-title>
        <english-title>APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">H01M8/04</main-classification>
        <further-classification edition="201601120260504B">H01M8/0662</further-classification>
        <further-classification edition="200601120260504B">B01D53/04</further-classification>
        <further-classification edition="200601120260504B">B01J20/06</further-classification>
        <further-classification edition="200601120260504B">B01J20/28</further-classification>
        <further-classification edition="200601120260504B">B01J20/30</further-classification>
        <further-classification edition="200601120260504B">C04B38/00</further-classification>
        <further-classification edition="200601120260504B">C04B41/53</further-classification>
        <further-classification edition="200601120260504B">C04B41/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莉亞　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEAH, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉赫曼　馬哈富朱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAHMAN, MAHFUJUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆克吉　蘇巴斯什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKERJEE, SUBHASISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANKIN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾馬森　佩爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HJALMARSSON, PER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍賈蒂普格　烏詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODJATI-PUGH, OUJEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種設備，其包含一固態氧化物電化學電池，具有一氧氣供應入口及一電池排氣出口。該設備具有一含有鐠之吸氣劑材料，該吸氣劑材料位於該氧氣供應入口與該電池排氣出口之間。該設備可具有一吸氣劑單元，該吸氣劑單元含有一包含鐠之吸氣劑材料。亦揭露多孔單石，其包含可用作吸氣劑材料或載體之一陶瓷材料，且亦揭露形成此類多孔單石及用一吸氣劑材料塗覆多孔陶瓷單石之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus is disclosed comprising a solid oxide electrochemical cell having an oxygen supply inlet and a cell exhaust outlet. The apparatus has a getter material containing praseodymium, the getter material being situated between the oxygen supply inlet and cell exhaust outlet. The apparatus may have a getter unit containing a getter material comprising praseodymium. Also disclosed are porous monoliths comprising a ceramic material that may be used as getter materials or supports, and methods of forming such porous monoliths and coating porous ceramic monoliths with a getter material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:燃料電池單元</p>
        <p type="p">304:載體</p>
        <p type="p">306:載體之無孔區</p>
        <p type="p">308:載體之多孔區</p>
        <p type="p">310:燃料電極</p>
        <p type="p">312:電解質</p>
        <p type="p">314:間層</p>
        <p type="p">316:氧電極</p>
        <p type="p">318:氧氣流體體積</p>
        <p type="p">320:燃料側燃料流體體積</p>
        <p type="p">324:互連件</p>
        <p type="p">326:(互連件之)帶凸緣周邊</p>
        <p type="p">328:接觸形貌體(凹坑)</p>
        <p type="p">330:吸氣劑塗層</p>
        <p type="p">332:氧氣流體流動路徑</p>
        <p type="p">334:電池之前邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1935" publication-number="202633015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生ＥＵＶ光束的方法、產生ＥＵＶ光束的ＥＵＶ驅動雷射器及應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">H05G2/00</main-classification>
        <further-classification edition="200601120260424B">H05H1/24</further-classification>
        <further-classification edition="200601120260424B">G21K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮勒　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIEHLER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通過借助使用多個雷射射束(30)將靶材(36)轉變為電漿狀態來產生EUV光束(12)的方法，其中該方法包含：借助該等多個雷射射束源(20)來產生該等多個雷射射束(30)；並且通過該等多個雷射射束(30)照射該靶材(36)來將該靶材(36)轉變為電漿狀態。在用該等多個雷射射束(30)照射該靶材(36)期間，每個雷射射束(30)以時間段(46)照射該靶材(36)。該時間段(46)在時間間隔(48)內相互重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:EUV驅動雷射器</p>
        <p type="p">12:EUV光束</p>
        <p type="p">14:晶圓</p>
        <p type="p">16:塗層</p>
        <p type="p">18:掩模</p>
        <p type="p">20:雷射射束源</p>
        <p type="p">22:光纖導線</p>
        <p type="p">24:第一光纖插頭</p>
        <p type="p">26:波導</p>
        <p type="p">28:第二光纖插頭</p>
        <p type="p">30:雷射射束</p>
        <p type="p">32:準直透鏡</p>
        <p type="p">34:聚焦透鏡</p>
        <p type="p">36:靶材</p>
        <p type="p">38:靶室</p>
        <p type="p">40:收集器裝置</p>
        <p type="p">42:孔隙</p>
        <p type="p">44:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1936" publication-number="202633229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及車輛</chinese-title>
        <english-title>DISPLAY PANEL AND VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260401B">H10H29/10</main-classification>
        <further-classification edition="200601120260401B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳釉鏞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YOU YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李垈興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DAE HEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SE WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示的一種顯示裝置包括像素透鏡。該些像素透鏡設置在裝置基板的像素區域上。上部屏障圖案設置在該裝置基板與該些像素透鏡之間。該上部屏障圖案包含與該些像素區域重疊的上部開口。該些像素區域中的每一者包含並排設置的第一發光區域及第二發光區域。每一像素透鏡的該像素透鏡包含設在對應像素區域的第一發光區域與第二發光區域之間的透鏡中心點。第一發光區域及第二發光區域中的每一者包含與對應上部開口重疊的第一區及設置在上部開口外部的第二區。因此，由該顯示裝置產生且與位於不同方向上的使用者共享的影像的品質得以改善。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus presented herein includes pixel lenses. The pixel lenses are disposed on pixel areas of a device substrate. An upper barrier pattern is disposed between the device substrate and the pixel lenses. The upper barrier pattern includes upper openings overlapping with the pixel lenses. Each of the pixel areas includes a first emission area and a second emission area, which are disposed side by side. The pixel lens of each pixel lens includes a lens central point disposed between the first emission area and the second emission area of the corresponding pixel area. Each of the first emission area and the second emission area includes a first region overlapping with the corresponding upper opening and a second region disposed outside the upper openings. Thus, the quality of an image generated by the display apparatus and shared with users located in different directions is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">510h:下部開口</p>
        <p type="p">520h:上部開口</p>
        <p type="p">700:像素透鏡</p>
        <p type="p">700c:透鏡中心點</p>
        <p type="p">B-PA:藍色像素區域</p>
        <p type="p">E1:第一區</p>
        <p type="p">E2:第二區</p>
        <p type="p">EA1:第一發光區域</p>
        <p type="p">EA2:第二發光區域</p>
        <p type="p">G-PA:綠色像素區域</p>
        <p type="p">K1:區</p>
        <p type="p">PA:像素區域</p>
        <p type="p">R-PA:紅色像素區域</p>
        <p type="p">S1:第一側表面</p>
        <p type="p">S2:第二側表面</p>
        <p type="p">SP1:第一子像素、子像素</p>
        <p type="p">SP2:第二子像素、子像素</p>
        <p type="p">VC:虛擬中心線</p>
        <p type="p">dd,d&lt;sub&gt;x&lt;/sub&gt;,d&lt;sub&gt;y&lt;/sub&gt;:距離</p>
        <p type="p">d&lt;sub&gt;i&lt;/sub&gt;,d&lt;sub&gt;o&lt;/sub&gt;:長度</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1937" publication-number="202631357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147396</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機器人控制裝置及機器人系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J19/02</main-classification>
        <further-classification edition="202201120260430B">G06V10/764</further-classification>
        <further-classification edition="202201120260430B">G06V10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤俊之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種機器人控制裝置，其根據藉由3D視覺感測器所生成、由複數個3維點表示可能存在工件之被攝體區域的表面形狀之3維點群資料，來控制取出上述工件之機器人，並具備：分組部，其將上述複數個3維點，分類為彼此靠近並存在於同一虛擬平面上之複數個組別；障礙物模型生成部，其生成由6面體所構成之障礙物模型，該6面體以包絡屬於同一上述組別之上述3維點的上述虛擬平面上的方形作為上表面，且以將上述上表面垂直投影於載置上述工件之面而成的方形作為底面；以及動作設定部，其以不干涉上述障礙物模型之方式設定用以取出上述工件之上述機器人的動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器人系統</p>
        <p type="p">10:3D視覺感測器</p>
        <p type="p">20:機器人</p>
        <p type="p">21:手部</p>
        <p type="p">30:機器人控制裝置</p>
        <p type="p">31:資料取得部</p>
        <p type="p">32:工件辨識部</p>
        <p type="p">33:對象決定部</p>
        <p type="p">34:工件模型配置部</p>
        <p type="p">35:分組部</p>
        <p type="p">36:障礙物模型生成部</p>
        <p type="p">37:動作設定部</p>
        <p type="p">38:動作執行部</p>
        <p type="p">C:容器</p>
        <p type="p">W:工件</p>
        <p type="p">Wo:對象工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1938" publication-number="202631743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳烷基改質樹脂、硬化性樹脂材料、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/12</main-classification>
        <further-classification edition="200601120260504B">C08F212/14</further-classification>
        <further-classification edition="200601120260504B">C08F232/08</further-classification>
        <further-classification edition="200601120260504B">C08F8/02</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C08J5/24</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, YOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田牧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種芳烷基改質樹脂，其包含乙烯基苯甲基及甲苯基甲基，且在&lt;sup&gt;1&lt;/sup&gt;H-NMR圖表中，歸屬於甲苯基甲基中的甲基包含的氫原子的峰值的積分值相對於歸屬於乙烯基苯甲基的乙烯基包含的氫原子之中的位於苯環的反式位的β氫的峰值的積分值的比例為1.5以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1939" publication-number="202633207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指叉式背接觸太陽能電池及其製造</chinese-title>
        <english-title>INTERDIGITATED BACK CONTACT SOLAR CELL AND MANUFACTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F71/00</main-classification>
        <further-classification edition="202501120260504B">H10F10/16</further-classification>
        <further-classification edition="202501120260504B">H10F77/20</further-classification>
        <further-classification edition="202501120260504B">H10F77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＲＥＣ太陽能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REC SOLAR PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　源鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNG, GUAN KIAN ERNEST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造指叉式背接觸太陽能電池的方法。該方法包括提供具有背面的基板的步驟。該方法包括在基板的背面佈置第一電荷載子收集器的步驟，該第一電荷載子收集器包括具有第一導電型的第一摻雜層及第一透明導電氧化物層，該第一電荷載子收集器包括複數個間隔開的第一電荷載子收集元件，每個第一電荷載子收集元件包括第一透明摻雜導電層的部分及第一透明電氧化物層的部分。此方法包括以下步驟：在佈置第一電荷載子收集器之後，在基板的背面佈置第二電荷載子收集器，該第二電荷載子收集器包括具有第二導電型的第二摻雜層及第二透明導電氧化物層，該第二電荷載子收集器包括複數個間隔開的第二電荷載子收集元件，這些第二電荷載子收集元件與第一電荷載子收集元件交錯排列，每個第二電荷載子收集元件包括第二摻雜層的部分及第二透明導電氧化物層的部分。其他一些實施例提供了一種指叉式背接觸太陽能電池及太陽能模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments provide a method of manufacturing an interdigitated back contact solar cell. The method comprises the step of providing a substrate having a back surface. The method comprises the step of arranging a first charge-carrier collector on the back surface of the substrate, the first-charge carrier collector comprising a first doped layer having a first conductivity type and a first transparent conductive oxide layer, the first charge-carrier collector comprising a plurality of spaced-apart first charge-carrier collection elements, each first charge-carrier collection element comprising a portion of the first doped layer and a portion of the first transparent conductive oxide layer. The method comprises the step of, subsequent to arranging the first charge-carrier collector, arranging a second charge-carrier collector on the back surface of the substrate, the second charge carrier collector comprising a second doped layer having a second conductivity type and a second transparent conductive oxide layer, the second charge-carrier collector comprising a plurality of spaced-apart second charge-carrier collection elements interdigitated with the first charge-carrier collection elements, each second charge-carrier collection element comprising a portion of the second doped layer and a portion of the second transparent conductive oxide layer. Some other embodiments provide an interdigitated back contact solar cell and solar module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">1a:正面</p>
        <p type="p">1b:背面</p>
        <p type="p">2a:第一鈍化層</p>
        <p type="p">2b:第二鈍化層</p>
        <p type="p">3a:第一電荷載子收集元件</p>
        <p type="p">3b:第二電荷載子收集元件</p>
        <p type="p">4a:第一摻雜層</p>
        <p type="p">4b:第二摻雜層</p>
        <p type="p">5a:第一TCO層</p>
        <p type="p">5b:第二TCO層</p>
        <p type="p">7a:第一電極</p>
        <p type="p">7b:第二電極</p>
        <p type="p">10:太陽能電池</p>
        <p type="p">11:第三鈍化層</p>
        <p type="p">12:抗反射塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1940" publication-number="202633193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池及模組</chinese-title>
        <english-title>SOLAR CELL AND MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F19/80</main-classification>
        <further-classification edition="202501120260504B">H10F10/164</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＲＥＣ太陽能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REC SOLAR PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOK, CHEE HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　裕發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JOO HUAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了一種太陽能電池。該太陽能電池包含：具有背面的基板；設置在基板背面的第一電荷載子收集器，該第一電荷載子收集器包含背面；以及設置在第一電荷載子收集器背面的第一透明導電氧化物結構。該第一透明導電氧化物結構包含：第一透明導電氧化物層；位於第一透明導電氧化物層和第一電荷載子收集器之間的第二透明導電氧化物層；以及位於第二透明導電氧化物層和第一電荷載子收集器之間的第三透明導電氧化物層。第二透明導電氧化物層實質上不含銦。本文還描述了一種這種太陽能電池的製造方法以及一種包含這種太陽能電池的太陽能模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solar cell is described. The solar cell comprises a substrate having a back surface; a first charge-carrier collector arranged on the back surface of the substrate, the first charge carrier collector comprising a back surface; and a first transparent-conductive-oxide structure arranged on the back surface of the first charge-carrier collector. The first transparent-conductive-oxide structure comprises: a first transparent-conductive-oxide layer; a second transparent-conductive-oxide layer interposed between the first transparent-conductive-oxide layer and the first charge-carrier collector; and a third transparent-conductive-oxide layer interposed between the second transparent-conductive-oxide layer and the first charge-carrier collector. The second transparent-conductive-oxide layer is substantially free of indium. A method of manufacturing such a solar cell, and a solar module comprising such a solar cell, are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體基板</p>
        <p type="p">12,35a:背面</p>
        <p type="p">20a:第一電荷載子收集器</p>
        <p type="p">30a:第一TCO結構</p>
        <p type="p">31a:第三TCO層</p>
        <p type="p">32a:第二TCO層</p>
        <p type="p">33a:第一TCO層</p>
        <p type="p">40a:第一鈍化層</p>
        <p type="p">50a:第一電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1941" publication-number="202632976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生音訊信號之設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR GENERATING AN AUDIO SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">H04S3/00</main-classification>
        <further-classification edition="200601120260423B">H04N5/222</further-classification>
        <further-classification edition="200601120260423B">H04S7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾甘　克莉斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAREKAMP, CHRISTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫倫　巴特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROON, BART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏曼　阿諾德斯　渥納　喬翰尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOMEN, ARNOLDUS WERNER JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含：一第一接收器(103)，其接收包含由一或多個音訊擷取裝置擷取之一場景之音訊之複數個音訊擷取信號。一第二接收器(101)接收一影像擷取信號，該影像擷取信號包含表示該場景之一擷取錐體之至少一個影像。一第三接收器(105)接收包含該等音訊擷取信號中之至少一些者之擷取區域指示之後設資料，其中一音訊擷取信號之一擷取區域指示係指示該音訊擷取信號之該場景中之一音訊擷取區域。一影像產生器(107)自該影像擷取信號針對一視錐體而產生該場景之一視圖影像，且一音訊產生器(109)藉由取決於該視錐體及該等擷取區域指示混合該複數個音訊擷取信號來產生表示該場景之一輸出音訊信號。  &lt;br/&gt;圖1</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises a first receiver (103) receiving a plurality of audio capture signals comprising audio of a scene captured by one or more audio capture devices. A second receiver (101) receives an image capture signal comprising at least one image representing a capture frustum of the scene. A third receiver (105) receives metadata comprising capture region indications for at least some of the audio capture signals where a capture region indication for an audio capture signal is indicative of a region of audio capture of the scene for the audio capture signal. An image generator (107) generates a view image of the scene for a view frustum from the image capture signal, and an audio generator (109) generates an output audio signal representing the scene by mixing the plurality of audio capture signals in dependence on the view frustum and the capture region indications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:視訊信號接收器；第二接收器</p>
        <p type="p">103:音訊信號接收器；第一接收器</p>
        <p type="p">105:後設資料接收器；第三接收器</p>
        <p type="p">107:影像產生電路；影像產生器</p>
        <p type="p">109:音訊產生器；音訊產生電路</p>
        <p type="p">111:視圖處理器；視圖電路</p>
        <p type="p">113:觀看者注意電路；第一電路</p>
        <p type="p">115:凝視偵測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1942" publication-number="202633315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147439</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓清洗方法</chinese-title>
        <english-title>WAFER CLEANING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P70/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤隆範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北文雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, FUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示及主張之標的物係關於減少基於金屬之材料處理期間之金屬污染的晶圓清洗方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed and claimed subject matter relates to a wafer cleaning method for reducing metal contamination during metal-based material processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1943" publication-number="202633504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>核心基板的製作方法及包括在封裝基板中的核心基板</chinese-title>
        <english-title>METHOD FOR MANUFACTURING CORE SUBSTRATE AND CORE SUBSTRATE COMPRISING IN PACKAGING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W74/01</main-classification>
        <further-classification edition="202601120260424B">H10W70/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例公開核心基板的製作方法，作為包括在封裝基板中的核心基板的製作方法等，核心基板的製作方法包括：步驟A，準備配置有貫通孔及空腔的玻璃芯；步驟B，在所述玻璃芯的下部面配置黏結層，以準備所述玻璃芯和所述黏結層得到上下配置的黏結層疊體；步驟C，在所述黏結層疊體的空腔內配置空腔元件；步驟D，在所述空腔元件和所述空腔的壁面之間的空間配置分配材料，以準備埋入層疊體；步驟E，對所述埋入層疊體的表面進行黏結力強化處理，以準備黏結力強化處理層；步驟F，在所述埋入層疊體的所述玻璃芯的上部面形成第一面絕緣層，以準備絕緣層疊體；以及步驟G，在所述絕緣層疊體中去除所述黏結層，並在所述玻璃芯的下部面形成第二面絕緣層，以準備所述核心基板，在所述玻璃芯的表面的至少一部分配置作為導電性層的芯傳導性層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment relates to a method for manufacturing a core substrate included in a packaging substrate, comprises: operation A, preparing a glass core in which through-holes and a cavity are disposed; operation B, preparing an adhesive laminate in which an adhesive layer is disposed on a lower surface of the glass core such that the glass core and the adhesive layer are vertically arranged; operation C, disposing a cavity element in the cavity of the adhesive laminate; operation D, preparing a fill-in laminate by disposing a dispensing material in a space between the cavity element and a wall surface of the cavity; operation E, preparing an adhesion-strengthening treatment layer by performing an adhesion-strengthening treatment on a surface of the fill-in laminate; operation F, preparing an insulating laminate by forming a first surface insulating layer on an upper surface of the glass core of the fill-in laminate; and operation G, preparing the core substrate by removing the adhesive layer from the insulating laminate and forming a second surface insulating layer on a lower surface of the glass core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">71:芯傳導性層</p>
        <p type="p">71a:黏結力強化處理層</p>
        <p type="p">100:分配材料</p>
        <p type="p">200:玻璃芯</p>
        <p type="p">400:空腔元件</p>
        <p type="p">4000:核心基板</p>
        <p type="p">600:上部層</p>
        <p type="p">800:下部層</p>
        <p type="p">900:電子元件</p>
        <p type="p">650:導電性層</p>
        <p type="p">1:封裝基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1944" publication-number="202631533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體封裝的玻璃基板及其製造方法</chinese-title>
        <english-title>GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGING, AND METHOD FOR PREPARING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03C3/085</main-classification>
        <further-classification edition="200601120260504B">C03C3/093</further-classification>
        <further-classification edition="200601120260504B">C03C15/00</further-classification>
        <further-classification edition="200601120260504B">C03C21/00</further-classification>
        <further-classification edition="200601120260504B">C03C23/00</further-classification>
        <further-classification edition="200601120260504B">C23C18/18</further-classification>
        <further-classification edition="200601120260504B">C23C18/38</further-classification>
        <further-classification edition="201401120260504B">B23K26/53</further-classification>
        <further-classification edition="202601120260504B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭大哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DAE CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權五倬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, OH TAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳相旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, SANGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪尙汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SANGMOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔雅湳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, A NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於半導體封裝的玻璃基板，包括玻璃基板，包括彼此面對的第一表面和第二表面、以及連接第一表面和第二表面並定義通孔的內表面；以及金屬層，設置在玻璃基板的通孔中，其中玻璃基板包括從內表面延伸並具有壓縮應力的第一區域，通孔在第一表面處具有第一直徑，在對應於玻璃基板的厚度的1/2的點處具有第二直徑，並在第二表面處具有第三直徑，其中第一直徑大於第二直徑，第三直徑大於第二直徑，並且金屬層填充通孔的90 vol%或更多。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a glass substrate for semiconductor packaging, including a glass substrate including a first surface and a second surface facing each other, and an inner surface connecting the first surface and the second surface and defining a through-hole; and a metal layer disposed in the through-hole of the glass substrate, wherein the glass substrate includes a first region extending from the inner surface and having compressive stress, the through-hole has a first diameter at the first surface, has a second diameter at a point corresponding to 1/2 of the thickness of the glass substrate, and has a third diameter at the second surface, wherein the first diameter is larger than the second diameter, the third diameter is larger than the second diameter, and the metal layer fills 90 vol% or more of the through-hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:玻璃基板</p>
        <p type="p">110:第一區域</p>
        <p type="p">120:第二區域</p>
        <p type="p">200:金屬層</p>
        <p type="p">A1、A2:區域</p>
        <p type="p">DR3:第三方向/厚度方向</p>
        <p type="p">R:直徑</p>
        <p type="p">S1:內表面</p>
        <p type="p">S2:第一表面/上表面</p>
        <p type="p">S3:第二表面/下表面</p>
        <p type="p">T1:厚度</p>
        <p type="p">I、I’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1945" publication-number="202633113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在原子層蝕刻反應器中製造ＨＥＭＴ器件的方法以及該方法在基於氮化鎵的ＨＥＭＴ的製造中的使用</chinese-title>
        <english-title>METHOD FOR FABRICATING A HEMT DEVICE IN AN ATOMIC LAYER ETCHING REACTOR AND USE OF THE METHOD IN FABRICATION OF A GALLIUM-NITRIDE-BASED HEMT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260430B">H10D30/47</main-classification>
        <further-classification edition="202501120260430B">H10D62/824</further-classification>
        <further-classification edition="202601120260430B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿力克斯實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALIXLABS AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里米　阿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMI, AMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈法里賈姆　雷札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAFARI JAM, REZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇亞亭　德米特里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYATIN, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑魁維斯　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDQVIST, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於在原子層蝕刻反應器中製造高電子遷移率電晶體器件的方法。所述方法包括：提供包括選擇性掩蔽的氮化鎵層的晶圓；以及使所述選擇性掩蔽的氮化鎵層進行蝕刻製程，所述蝕刻製程包括交替的表面改性步驟和去除步驟。在反應氣體流動的條件下執行所述表面改性步驟。使用主要由稀有氣體種類組成的低能粒子束執行所述去除步驟。在整個蝕刻製程中持續維持電漿。重複或合併所述表面改性步驟和所述去除步驟，以實現循環或準連續的原子層蝕刻製程，所述循環或準連續的原子層蝕刻製程過渡到連續乾式蝕刻模式，在所述連續乾式蝕刻模式中，在達到穩態自限條件後，在維持自限表面動力學的同時持續供應反應氣體和電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for fabricating a high electron mobility transistor device in an atomic layer etching reactor. The method comprises: providing a wafer comprising a selectively masked gallium nitride layer; and subjecting the selectively masked gallium nitride layer for an etching process comprising alternating surface modification and removal steps. The surface modification steps are performed under reactive gas flow. The removal steps are performed using a low-energy particle beam primarily comprised of noble gas species. A plasma is maintained continuously throughout the etching process. The surface modification and removal steps are repeated or merged to achieve a cyclic or quasi-continuous atomic-layer etching process transitioning to a continuous dry etch mode in which reactive gases and plasma are continuously supplied while maintaining self-limiting surface kinetics once steady-state self-limiting conditions are reached.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1946" publication-number="202631144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有嘧啶衍生物的藥物組合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/506</main-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61P31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣東眾生睿創生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGDONG RAYNOVENT BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳小新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉卓偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHUOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬春喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHUNXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐坤勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, KUNYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍超峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, CHAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種含有嘧啶衍生物的藥物組合物及其應用，所述藥物組合物含有化合物1作為活性成分，還包括鹼性試劑和助溶劑，其中活性成分與鹼性試劑和助溶劑總量的莫耳比為1：0.80~3.50。本揭露的藥物組合可以有效提升化合物1的溶解度，保證化合物1在體內、體外穩定釋放，顯著提升了藥物製劑的生物利用度，為實現化合物1的臨床使用提供可行性的方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1947" publication-number="202631145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口服固體藥物組合物及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/506</main-classification>
        <further-classification edition="200601120260504B">A61K47/02</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61P31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣東眾生睿創生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGDONG RAYNOVENT BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳小新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉卓偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHUOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬春喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHUNXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐坤勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, KUNYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍超峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, CHAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種口服固體藥物組合物，含有活性成分昂拉地韋、鹼性試劑、助溶劑、還包括填充劑。本揭露的口服固體藥物組合物，有效提升昂拉地韋溶解性能，提高昂拉地韋在人體內生物利用度，並能夠解決採用常規處方和工藝無法有效使之崩解等製劑問題，有利於實現昂拉地韋臨床應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1948" publication-number="202631713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應性多羧酸化合物、使用其的活性能量線硬化型樹脂組成物、其硬化物、物品及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F283/10</further-classification>
        <further-classification edition="200601120260504B">C08G59/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
        <further-classification edition="200601120260504B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPONKAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下実紗季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, MISAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本和義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田究</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, KIWAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種於兼備耐熱性與基板密接性的同時具有良好的顯影特性的反應性多羧酸樹脂及含有其的活性能量線硬化型樹脂組成物。本發明者等人進行了努力研究，結果發現反應性多羧酸化合物（A）解決了所述課題，從而達到了本發明，所述反應性多羧酸化合物（A）是使一分子中兼具能夠聚合的乙烯性不飽和基與羧基的羧酸化合物（b）與下述式（1）所表示的環氧樹脂（a）反應而獲得反應性環氧羧酸酯化合物（c），並使所述反應性環氧羧酸酯化合物（c）與多元酸酐（d）反應而成。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="247px" width="307px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，n表示平均值且表示1～15的數）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1949" publication-number="202632435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147649</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>EUV光源中之污染控制</chinese-title>
        <english-title>CONTAMINATION CONTROL IN AN EUV LIGHT SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/20</main-classification>
        <further-classification edition="201201120260504B">G03F1/22</further-classification>
        <further-classification edition="200601120260504B">G01N21/94</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈茲拉　阿揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAZRA, AYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉漢　馬修　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAHAM, MATTHEW RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於執行一種用於控制一光源中之污染的方法。該方法包括：獲得該光源中之一光學元件的一參考影像；獲得該光學元件之一即時影像；比較該即時影像與該參考影像，以判定與該光學元件相關聯之一污染度量；及基於經判定污染度量而觸發該光源中之一操作，以藉此減輕該光學元件處之污染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is performed for controlling contamination in a light source. The method includes: obtaining a reference image of an optical element in the light source; obtaining a real-time image of the optical element; comparing the real-time image with the reference image to determine a contamination metric associated with the optical element; and triggering an operation in the light source based on the determined contamination metric to thereby mitigate contamination at the optical element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:設備</p>
        <p type="p">205:影像偵測器</p>
        <p type="p">206c:當前影像</p>
        <p type="p">206r:參考影像</p>
        <p type="p">215:致動系統</p>
        <p type="p">225:影像處理系統</p>
        <p type="p">250:極紫外線光源</p>
        <p type="p">251:輸出設備</p>
        <p type="p">255:收集器鏡面</p>
        <p type="p">255s:反射表面</p>
        <p type="p">256:目標遞送系統</p>
        <p type="p">258:內部</p>
        <p type="p">259:源容器</p>
        <p type="p">262:中心孔徑</p>
        <p type="p">265:倍縮光罩/遮罩</p>
        <p type="p">266:支撐結構</p>
        <p type="p">669:光學元件/實施</p>
        <p type="p">670:第一琢面鏡面</p>
        <p type="p">671:第二琢面鏡面</p>
        <p type="p">673:光學元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1950" publication-number="202631137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錠劑配方</chinese-title>
        <english-title>TABLET FORMULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/4725</main-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61K47/36</further-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61P9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商阿斯特捷利康愛爾蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA IRELAND LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維尼卡　卡林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIINIKKA, KARIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達爾伯格　艾納爾奧斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAHLBERG, ENAR OSCAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧普斯特　查理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMPSTER, CHARLIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀德胡安　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN DE JUAN, LUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書係關於一種包含&lt;i&gt;N&lt;/i&gt;-[(8&lt;i&gt;R&lt;/i&gt;)-4-(1-甲基-2-側氧基-1,2,3,4-四氫-6-喹啉基)-5,6,7,8-四氫-8-異喹啉基]丙醯胺（巴德羅司他(baxdrostat)）之醫藥配方、其錠劑、及其於療法中之用途。本說明書亦關於一種用於製造錠劑之程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The specification relates to a pharmaceutical formulation comprising &lt;i&gt;N&lt;/i&gt;-[(8&lt;i&gt;R&lt;/i&gt;)-4-(1-methyl-2-oxo-1,2,3,4-tetrahydro-6-quinolinyl)-5,6,7,8-tetrahydro-8-isoquinolinyl]propanamide (baxdrostat), tablets thereof, and their use in therapy. The specification also relates to a process for manufacturing the tablets.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1951" publication-number="202632769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制閥式鉛蓄電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01M10/06</main-classification>
        <further-classification edition="200601120260504B">H01M10/12</further-classification>
        <further-classification edition="202101120260504B">H01M50/411</further-classification>
        <further-classification edition="202101120260504B">H01M50/437</further-classification>
        <further-classification edition="202101120260504B">H01M50/44</further-classification>
        <further-classification edition="202101120260504B">H01M50/446</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商傑士湯淺國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GS YUASA INTERNATIONAL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郡健一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORI, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制閥式鉛蓄電池，包括：正極板、負極板、電解液、及介隔存在於正極板與負極板之間的隔膜，隔膜是包含玻璃纖維及含氧有機化合物的不織布，含浸於正極板的電解液的體積（Vp）相對於電解液的總體積（Vt）之比（Vp/Vt）為0.20以上且0.30以下，以氯仿為溶媒測定的含氧有機化合物的LC/MS光譜在m/z值為400以上且2000以下的區域中具有多個波峰，多個波峰隔開m/z值為20以上且25以下或40以上且50以下的間隔存在，含氧有機化合物中所含的所有氧原子包含於醚鍵及羥基中的至少一者，含氧有機化合物中所含的氧原子的總質量相對於含氧有機化合物的質量之比小於0.320。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鉛蓄電池</p>
        <p type="p">2:負極板</p>
        <p type="p">3:正極板</p>
        <p type="p">4:隔膜</p>
        <p type="p">10:電解槽</p>
        <p type="p">10R:單元室</p>
        <p type="p">11:極板組</p>
        <p type="p">12A:蓋</p>
        <p type="p">13:排氣閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1952" publication-number="202632112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯系纖維染色用分散均染劑及使用其之聚酯系纖維染色製品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">D06P1/00</main-classification>
        <further-classification edition="200601120260504B">D06P1/16</further-classification>
        <further-classification edition="200601120260504B">D06P1/613</further-classification>
        <further-classification edition="200601120260504B">D06P1/651</further-classification>
        <further-classification edition="200601120260504B">D06P3/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日華化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICCA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑野和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWANO, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺西陽子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERANISHI, YOUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂下真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKASHITA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種分散均染劑及使用其之聚酯系纖維染色製品之製造方法；該分散均染劑係於使用分散染料之聚酯系纖維之高溫高壓染色中，即使在對精練不充分而殘留有油劑之布料進行染色時，自布料之油劑除去性仍為良好，並且未發生染料之凝集，能夠無斑且均勻地進行染色。於一態樣中，本發明提供一種聚酯系纖維染色用分散均染劑，其係含有：甘油單脂肪酸酯之（A）成分、具有聚氧伸烷基部位及／或甘油基部位之特定結構之酯化合物之（B-1）成分、及具有聚氧伸烷基部位及／或甘油基部位之特定結構之羥基化合物之（B-2）成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1953" publication-number="202631817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺、聚醯亞胺粉體、聚醯亞胺塗料及聚醯亞胺膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">C08J3/12</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C09D179/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商河村產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA SANGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保慎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供聚醯亞胺及其粉體以及使用該聚醯亞胺之塗料，其可形成耐熱性、透明性、機械特性優異的聚醯亞胺膜，且可溶於有機溶劑並與具有反應性官能基之化合物的相溶性優異。  &lt;br/&gt;　　本發明之解決手段為一種聚醯亞胺，其係由二胺化合物及四羧酸二酐所合成之聚醯亞胺，其特徵在於前述聚醯亞胺具有：源自(a)式1所示之二胺化合物、(b)式2所示之含羧基二胺化合物及(c)3,3’,4,4’-二苯基醚四羧酸二酐的構成單元(此處式1、式2如本說明書中的定義)，相對於源自二胺化合物的構成單元之總莫耳量，源自(a)的構成單元之量為60~95mol%，且源自(b)的構成單元之量為5~30mol%，相對於源自四羧酸二酐的構成單元之總量，源自(c)的構成單元之量為mol%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1954" publication-number="202631442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62K15/00</main-classification>
        <further-classification edition="200601120260430B">B62H1/02</further-classification>
        <further-classification edition="200601120260430B">B62H1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高樂飛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAFIT INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳴海禎造</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARUMI, TEIZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤雅樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATOH,MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具有高收納性之車輛。一種車輛，係具有：前端單元，其具有前輪；後端單元，其具有後輪；馬達，其用以驅動前述前輪及前述後輪中至少一者；電磁煞車機構，其利用前述馬達對前述前輪或前述後輪進行電磁性煞車；及連接部，其設置於前述前端單元與前述後端單元之間，用以可分離地連接前述前端單元與前述後端單元。此車輛，係當前述前端單元與前述後端單元經由前述連接部而處於連接狀態時，該車輛可行駛，且前述連接部係包含用以將前述前端單元與前述後端單元機械性連接之連結部分，以及用以將前述前端單元與前述後端單元電性連接之連接器，並且前述連結部分及前述連接器係聯動以將前述前端單元與後端單元連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:車輛</p>
        <p type="p">10:前端單元</p>
        <p type="p">11:前輪</p>
        <p type="p">12:前車架</p>
        <p type="p">13:轉向裝置</p>
        <p type="p">131:把手</p>
        <p type="p">132:把手立桿</p>
        <p type="p">13C:安裝部</p>
        <p type="p">14:前照燈</p>
        <p type="p">14C:安裝部</p>
        <p type="p">20:後端單元</p>
        <p type="p">21:後輪</p>
        <p type="p">22:後車架</p>
        <p type="p">23:乘坐支撐部</p>
        <p type="p">231:座墊</p>
        <p type="p">232:座桿</p>
        <p type="p">24:後方反射器</p>
        <p type="p">25:車牌</p>
        <p type="p">26:尾燈</p>
        <p type="p">30:連接部</p>
        <p type="p">40:電池</p>
        <p type="p">50:馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1955" publication-number="202631090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口腔內光治療裝置</chinese-title>
        <english-title>INTRAORAL PHOTOTHERAPY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61C19/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商光愈（日本）科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN PBM HEALING KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐王欣　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWONG HING, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種不僅能確實地對橫跨使用者整體齒列的牙齦緣及游離牙齦照射光線，且當使用者將牙套佩戴至口腔內深處時具有優異佩戴感的口腔內光治療裝置，其具有牙套（1）與配置於其上且設有複數個光發射器（20）的光源（2），其中牙套具有咬合托盤（3）以及分別與佩戴者之上下牙齦（9）的外面及內面相對的前緣（4）和後緣（5），前緣（4）的上下緣部設有凹陷部（4c、4c’），佩戴者之上唇繫帶（91）及下唇繫帶（92）分別位於其上，後緣（5）的上下緣部設有凹陷部（5c、5c’），佩戴者之腭縫（93）及舌繫帶（94）分別位於其上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intraoral phototherapy device is provided that not only reliably illuminates the gingival margin and free gingiva across the entire dental arch of the user, but also provides excellent wearing comfort when the user wears the braces deep inside the oral cavity. The device has a brace (1), and a light source (2) disposed thereon and equipped with a plurality of light emitters (20). The brace has an occlusal tray (3), and an anterior flange (4) and a posterior flange (5) respectively facing the outer and inner surfaces of the upper and lower gingiva (9) of the wearer. The anterior flange (4) has recesses (4c, 4c’) on the upper and lower edges, on which the wearer’s upper lip frenulum (91) and lower lip frenulum (92) are respectively located. The posterior flange (5) has recesses (5c, 5c’) on the upper and lower edges, on which the wearer’s palatal suture (93) and lingual frenulum (94) are respectively located.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:牙套</p>
        <p type="p">10:導出部</p>
        <p type="p">2:光源</p>
        <p type="p">20:光發射器</p>
        <p type="p">21:基板</p>
        <p type="p">21a:連接端子部</p>
        <p type="p">3:咬合托盤</p>
        <p type="p">30:後端部</p>
        <p type="p">4:前緣</p>
        <p type="p">4a:內周面</p>
        <p type="p">4b:後端部</p>
        <p type="p">4c:前凹陷部</p>
        <p type="p">5:後緣</p>
        <p type="p">5a:外周面</p>
        <p type="p">5b:後端部</p>
        <p type="p">5c:後凹陷部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1956" publication-number="202631884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於感測器的導電層的製造方法以及透過該方法獲得的用於感測器的導電層</chinese-title>
        <english-title>METHOD OF PRODUCTION OF A CONDUCTIVE LAYER FOR SENSORS AND CONDUCTIVE LAYER FOR SENSORS OBTAINED BY SAID METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L75/04</main-classification>
        <further-classification edition="200601120260504B">C08K3/04</further-classification>
        <further-classification edition="200601120260504B">C08J3/20</further-classification>
        <further-classification edition="200601120260504B">C09D175/04</further-classification>
        <further-classification edition="201801120260504B">C09D7/61</further-classification>
        <further-classification edition="200601120260504B">C09D5/24</further-classification>
        <further-classification edition="200601120260504B">H01B1/04</further-classification>
        <further-classification edition="200601120260504B">H01B1/24</further-classification>
        <further-classification edition="200601120260504B">H01B5/14</further-classification>
        <further-classification edition="200601120260504B">H01B13/00</further-classification>
        <further-classification edition="200601120260504B">G01D5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商ＭＦＩ義大利工程有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MFI ITALY ENGINEERING S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土耳其商馮帕克聚氨酯包裝產業與貿易股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOMPAK AMBALAJ VE POLIURETAN SANAYI VE TICARET A.S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波里　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORRI, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅米希　穆斯塔法　埃爾登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEMIS, MUSTAFA ERDEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉漢　托普拉克西　哈蒂傑　艾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARAHAN TOPRAKCI, HATICE AYLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖藍　塞爾坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURAN, SERTAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於感測器(1)的導電層(3)的製造方法，其包含以下步驟：a)將熱塑性聚胺甲酸酯溶解在溶劑中，b)添加石墨，c)在混合器中，較佳在高剪切混合器中，甚至更佳在行星式高剪切混合器中處理從而獲得的混合物，d)將所述勻相混合物澆鑄至一或多個支撐物上從而製造一或多個樣本及e)乾燥所述一或多個樣本以移除該溶劑。所述從而獲得的樣本中之每一者皆構成導電層。因此，根據本發明的製造方法相較於目前已知及使用的方法包含有限數目的步驟。此外，此等步驟易於實施且不需要複雜及／或昂貴的程序。得益於此製造方法，因此有可能以有成本效益的方式獲得導電層(3)及（相應地）獲得感測器(1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of production of a conductive layer (3) for sensors (1), comprising the steps of: a) dissolving thermoplastic polyurethane in a solvent, b) adding graphite, c) processing the thus obtained mixture in a mixer, preferably in high shear mixer, even more preferably in a planetary high shear mixer, d) casting said homogeneous mixture onto one or more supports thereby making one or more samples and e) drying said one or more samples to remove the solvent. Each of said samples thus obtained constitutes a conductive layer. Therefore, the method of production according to the invention comprises a limited number of steps compared to currently known and used methods. Furthermore, these steps are easy to implement and do not require complex and/or expensive processes. Thanks to this method of production, it is therefore possible to obtain a conductive layer (3) and, correspondingly, a sensor (1) in a cost-effective manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感測器</p>
        <p type="p">3:導電層</p>
        <p type="p">5:控制層</p>
        <p type="p">5a:電子部件</p>
        <p type="p">7:保護層</p>
        <p type="p">9:固定層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1957" publication-number="202632802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147799</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線纜盒組件及對接保證模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01R13/50</main-classification>
        <further-classification edition="200601120260504B">H01R13/64</further-classification>
        <further-classification edition="200601120260504B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪爾曼　羅伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DILLMAN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡薩雷茲ＪＲ．　荷西Ｊ．</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONZALEZ JR., JOSE J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞克斯　約翰Ｃ．</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAURX, JOHN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅倫斯　湯米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAWRENCE, TOMMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">說明包含浮動緊固件的多軸浮動線纜盒組件及線纜盒組件。一種示例線纜盒組件包括：一框組件；一對接保證模組，包括一對接模組和位於所述對接模組中的多個連接器殼體；以及一浮動緊固件，其將所述對接保證模組與所述框組件固定。所述對接保證模組在與一線卡組件的多個線卡對接操作期間能在多個方向上浮動或移動，以保證所述線纜盒組件的所述多個殼體和所述多個線卡中的導電端子之間的一完全對接配置。所述浮動緊固件包括一偏壓彈簧、一浮動支承環、以及具有一頭部和一桿部的一支座螺釘。所述桿部延伸穿過所述偏壓彈簧的一中央並穿過所述浮動支承環。所述偏壓彈簧施加力在所述浮動支承環和所述支座螺釘的頭部上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:線纜背板組件</p>
        <p type="p">10:線纜盒組件</p>
        <p type="p">12:第一側支架</p>
        <p type="p">14:第二側支架</p>
        <p type="p">16:頂支架</p>
        <p type="p">18:底支架</p>
        <p type="p">20:對接線卡組件</p>
        <p type="p">22:線卡</p>
        <p type="p">23:對接模組</p>
        <p type="p">24:線卡</p>
        <p type="p">25:對接模組</p>
        <p type="p">30:螺釘</p>
        <p type="p">31:螺釘</p>
        <p type="p">32:螺釘</p>
        <p type="p">110:對接模組</p>
        <p type="p">120-123:連接器殼體</p>
        <p type="p">150:蓋板</p>
        <p type="p">D:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1958" publication-number="202631153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫藥組合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/661</main-classification>
        <further-classification edition="200601120260504B">A61K47/38</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/04</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷傑製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGEL PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧扎　南登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZA, NANDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種醫藥組合物，其包含磷酸1-(4-(4-((3-(3,6-二氟吡啶-2-基)-1-((1r,4r)-4-乙氧基環己基)-1H-吡唑-4-基)胺甲醯基)噻唑-2-基)-1H-吡唑-1-基)乙酯或其醫藥學上可接受之鹽作為活性劑、一或多種顆粒內賦形劑及一或多種顆粒外賦形劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a pharmaceutical composition comprising 1-(4-(4-((3-(3,6-difluoropyridin-2-yl)-1-((1r,4r)-4-ethoxycyclohexyl)-1H-pyrazol-4-yl)carbamoyl)thiazol-2-yl)-1H-pyrazol-1-yl)ethyl phosphate or a pharmaceutically acceptable salt thereof as an active agent, one or more intragranular excipients and one or more extragranular excipients.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1959" publication-number="202632272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗佈試劑的蓋玻片的使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G01N33/50</main-classification>
        <further-classification edition="200601120260504B">G01N1/30</further-classification>
        <further-classification edition="200601120260504B">G01N21/64</further-classification>
        <further-classification edition="201801120260504B">C12Q1/6806</further-classification>
        <further-classification edition="201001120260504B">C12N5/076</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦睿生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐振騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慧貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於塗佈試劑的蓋玻片及使用所述塗佈試劑的蓋玻片進行一種或多種反應的方法。本發明提供一種於一載玻片上使用塗佈試劑的蓋玻片執行一試驗的方法。本發明提供一種於一載玻片上固定樣品細胞以及於該載玻片上執行一試驗的方法。本發明的方法藉由以一塗佈試劑之蓋玻片接觸已固定於載玻片上之樣品細胞，於載玻片上已包埋之樣品細胞中進行一個或多個化學反應，以在載玻片上產生一反應產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1960" publication-number="202631818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺薄膜、其製造方法、覆金屬積層板、電路基板、多層電路基板、電子元件及電子設備</chinese-title>
        <english-title>POLYIMIDE FILM AND METHOD FOR PRODUCING SAME, METAL-CLAD LAMINATE, CIRCUIT BOARD, MULTILAYER CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G73/10</main-classification>
        <further-classification edition="200601120260424B">C08L79/08</further-classification>
        <further-classification edition="200601120260424B">C08J5/18</further-classification>
        <further-classification edition="202601120260424B">H10W20/45</further-classification>
        <further-classification edition="202601120260424B">H10P50/20</further-classification>
        <further-classification edition="200601120260424B">B32B27/06</further-classification>
        <further-classification edition="200601120260424B">B32B27/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山達哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重松桜子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMATSU, SAKURAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢熊建太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGUMA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種單面電路基板，藉由改變絕緣樹脂層的表面狀態來抑制絕緣樹脂層的黏連。聚醯亞胺薄膜10具有聚醯亞胺層11、與聚醯亞胺層11相鄰地積層的聚醯亞胺層12、以及與聚醯亞胺層12相鄰地積層的聚醯亞胺層13這3層積層結構。聚醯亞胺層11具有改性層，具有向外部露出的改性表面MS。聚醯亞胺薄膜10藉由X射線光電子能譜法對改性表面MS進行測定時的氟原子的濃度在25~50atm%的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:聚醯亞胺薄膜</p>
        <p type="p">11、12、13:聚醯亞胺層</p>
        <p type="p">14:二氧化矽顆粒</p>
        <p type="p">MS:改性表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1961" publication-number="202631446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力交通工具組件、電子裝置及程式</chinese-title>
        <english-title>HUMAN-POWERED VEHICLE COMPONENT, ELECTRONIC DEVICE, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260121B">B62M6/45</main-classification>
        <further-classification edition="202001120260121B">B62J45/00</further-classification>
        <further-classification edition="202001120260121B">B62J50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野﨑晃央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人力交通工具組件包括第一通信器電路系統及第一電子控制器電路系統。該第一通信器電路系統經組態以接收來自至少一個額外人力交通工具組件之與該至少一個額外人力交通工具組件有關之額外組件資訊。該第一電子控制器電路系統經組態以控制該第一通信器電路系統向一電子裝置傳輸該額外組件資訊。該第一電子控制器電路系統經組態以基於關於該電子裝置之一控制指令而控制該第一通信器電路系統在該人力交通工具組件與該至少一個額外人力交通工具組件之至少一者之間建立無線連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A human-powered vehicle component comprises first communicator circuitry and first electronic controller circuitry. The first communicator circuitry is configured to receive additional component information relating to at least one additional human-powered vehicle component from the at least one additional human-powered vehicle component. The first electronic controller circuitry is configured to control the first communicator circuitry to transmit the additional component information to an electronic device. The first electronic controller circuitry is configured to control the first communicator circuitry to establish wireless connection between the human-powered vehicle component and at least one of the at least one additional human-powered vehicle component based on a control instruction with respect to the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">24:第一操作裝置</p>
        <p type="p">24B:額外使用者介面</p>
        <p type="p">26:第二操作裝置</p>
        <p type="p">26B:額外使用者介面</p>
        <p type="p">BC:人力交通工具組件</p>
        <p type="p">BC1:人力交通工具組件</p>
        <p type="p">BC2:額外人力交通工具組件</p>
        <p type="p">BC3:第一額外人力交通工具組件</p>
        <p type="p">BC4:第二額外人力交通工具組件</p>
        <p type="p">EC1:第一電子控制器電路系統</p>
        <p type="p">EC11:第一處理器</p>
        <p type="p">EC12:第一記憶體</p>
        <p type="p">EC2:第二電子控制器電路系統</p>
        <p type="p">EC3:第一額外電子控制器電路系統</p>
        <p type="p">EC31:處理器</p>
        <p type="p">EC32:記憶體</p>
        <p type="p">EC4:第二額外電子控制器電路系統</p>
        <p type="p">EC41:處理器</p>
        <p type="p">EC42:記憶體</p>
        <p type="p">ED:電子裝置</p>
        <p type="p">ED1:顯示器</p>
        <p type="p">ED2:使用者介面</p>
        <p type="p">ID1:第一組件資訊</p>
        <p type="p">ID3:第一額外組件資訊</p>
        <p type="p">ID4:第二額外組件資訊</p>
        <p type="p">INF1:觸發資訊</p>
        <p type="p">INF23:信號強度資訊</p>
        <p type="p">INF24:信號強度資訊</p>
        <p type="p">INF33:介面操作資訊</p>
        <p type="p">INF34:介面操作資訊</p>
        <p type="p">N1:控制指令</p>
        <p type="p">N2:觸發指令</p>
        <p type="p">RG0:配對裝置區域</p>
        <p type="p">RG1:觸發圖示按鈕</p>
        <p type="p">SGC3:連接請求信號</p>
        <p type="p">SGC4:連接請求信號</p>
        <p type="p">SGF3:資訊信號</p>
        <p type="p">SGF4:資訊信號</p>
        <p type="p">ST12:連接狀態</p>
        <p type="p">U2:使用者控制輸入</p>
        <p type="p">U31:額外使用者輸入</p>
        <p type="p">U32:額外使用者輸入</p>
        <p type="p">U33:額外使用者輸入</p>
        <p type="p">U41:額外使用者輸入</p>
        <p type="p">U42:額外使用者輸入</p>
        <p type="p">U43:額外使用者輸入</p>
        <p type="p">WC1:第一通信器電路系統</p>
        <p type="p">WC2:第二通信器電路系統</p>
        <p type="p">WC3:第一額外無線通信器電路系統</p>
        <p type="p">WC4:第二額外無線通信器電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1962" publication-number="202632031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性記錄媒體用濺鍍靶材</chinese-title>
        <english-title>SPUTTERING TARGET FOR MAGNETIC RECORDING MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C23C14/14</main-classification>
        <further-classification edition="200601120260421B">C23C14/34</further-classification>
        <further-classification edition="200601120260421B">C22C38/00</further-classification>
        <further-classification edition="200601120260421B">C22C5/04</further-classification>
        <further-classification edition="200601120260421B">H01F1/03</further-classification>
        <further-classification edition="200601120260421B">H01F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田中貴金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　金光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAM, KIM KONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫛引了輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSHIBIKI, RYOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於在基底膜上形成磁性薄膜時，於基底膜與磁性薄膜之間，用以形成緩衝層之磁性記錄媒體用之濺鍍靶材。有關本發明之緩衝層形成用靶材係由磁性相、與非磁性相所構成，該磁性相係由Fe及Pt與元素M所構成之FePt系合金所成，該非磁性相係由C、碳化物、氮化物的至少任一者所成。構成前述磁性相之FePt系合金的元素M為Cu、Si、Ti、Cr、B、V、Nb、Ta、Ru、Mn、Zn、Mo、W、Au、Ag、Ge的至少任一者。此時之磁性相較佳為由20mol%以上95mol%以下之元素M、與殘餘為由Fe及Pt所構成之FePt系合金所成者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sputtering target is provided for forming a buffer layer that suppresses the in-plane orientation of magnetic particles in magnetic thin films of FePt alloys and the like in magnetic recording media, while also making the magnetic particles fine. When forming a magnetic thin film on an underlying film, a buffer layer is formed between the underlying film and the magnetic thin film. The target includes a magnetic phase composed of an FePt-based alloy containing Fe, Pt, and element M, and a non-magnetic phase composed of at least one of C, carbides, and nitrides. The element M in the FePt-based alloy constituting the magnetic phase is at least one of Cu, Si, Ti, Cr, B, V, Nb, Ta, Ru, Mn, Zn, Mo, W, Au, Ag, and Ge. Such a magnetic phase is preferably composed of an FePt-based alloy containing 20 mol% to 95 mol% of element M, with the balance being Fe and Pt.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1963" publication-number="202631414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147924</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童安全系統</chinese-title>
        <english-title>CHILD SAFETY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B60N2/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾Ｓ　梅森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYLE S, MASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納撒尼爾Ｗ　基伯勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATHANIEL W, KEEBLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯Ｊ　泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREW J, TAYLOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一兒童座椅系統之支撐基部包括一本體，該兒童座椅系統可定位於一車輛座椅上且包括可定位於該支撐基部上之一兒童座椅，該本體具有經設定大小以將該兒童座椅接收於其上之一基部底部。該基部底部界定該支撐基部之一前端。一基部背部自該基部底部延伸，且界定該支撐基部之一後端。一繫帶總成自該基部背部處之至少一個繫帶位置延伸。該支撐基部之該前端與該支撐基部之該後端隔開。一中心平面平行於在該後端與該前端之間延伸的一向前方向延伸穿過該支撐基部之一中心。該基部背部處之該至少一個繫帶位置自該中心平面偏移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A support base of a child seat system positionable on a vehicle seat and including a child seat positionable on the support base includes a body having a base bottom sized to receive the child seat thereon. The base bottom defines a front end of the support base. A base back extends from the base bottom and defines a rear end of the support base. A tether assembly extends from at least one tether location at the base back. The front end of the support base is spaced from the rear end of the support base. A central plane extends through a center of the support base parallel to a front direction extending between the rear end and the front end. The at least one tether location at the base back is offset from the central plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:支撐基部</p>
        <p type="p">34:基部背部部分或基部背部</p>
        <p type="p">36:背表面</p>
        <p type="p">38:上部邊緣</p>
        <p type="p">40:第一側面</p>
        <p type="p">42:第二側面</p>
        <p type="p">50a:第一槽</p>
        <p type="p">50b:第二槽</p>
        <p type="p">52:外殼體或外殼</p>
        <p type="p">60:繫帶總成</p>
        <p type="p">62a:第一繫帶位置</p>
        <p type="p">62b:第二繫帶位置</p>
        <p type="p">64:主要或第一繫帶綁帶</p>
        <p type="p">66:輔助或第二繫帶綁帶</p>
        <p type="p">68:第一末端</p>
        <p type="p">70:第二末端</p>
        <p type="p">72:環圈</p>
        <p type="p">74:末端</p>
        <p type="p">P1:中心縱向平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1964" publication-number="202633414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147927</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P95/00</main-classification>
        <further-classification edition="202601120260424B">H10P72/30</further-classification>
        <further-classification edition="200601120260424B">H05H1/46</further-classification>
        <further-classification edition="200601120260424B">B01J19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩瀬正廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASE, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTEGI, SUGURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之基板處理系統包含真空搬送模組、複數個製程模組、及共通傳輸路徑。真空搬送模組具有真空搬送腔室。複數個製程模組之各者包含沿著真空搬送腔室之一側面配置之第1側部、於第1側部處與真空搬送腔室連接之處理腔室、及於第1側部之相反側延伸之第2側部。共通傳輸路徑係用於對複數個製程模組饋電之傳輸路徑，安裝於複數個製程模組之各者之第2側部，且沿著複數個製程模組之各者之第2側部延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理系統</p>
        <p type="p">11c:處理腔室</p>
        <p type="p">11L:空間</p>
        <p type="p">40:傳輸路徑(共通傳輸路徑)</p>
        <p type="p">40i:電線</p>
        <p type="p">41:部分傳輸路徑</p>
        <p type="p">42:導管</p>
        <p type="p">44:連接器</p>
        <p type="p">50:電力箱</p>
        <p type="p">50m:主斷路器</p>
        <p type="p">52:饋電線</p>
        <p type="p">60:斷路器</p>
        <p type="p">62:插座</p>
        <p type="p">63:獨立饋電線</p>
        <p type="p">63c:連接器</p>
        <p type="p">70:下部單元</p>
        <p type="p">70v:推車</p>
        <p type="p">71:RF電源</p>
        <p type="p">72:DC電源</p>
        <p type="p">400:傳輸路徑組件</p>
        <p type="p">FS:地面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1965" publication-number="202631202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體－藥物結合物之用途</chinese-title>
        <english-title>USE OF ANTIBODY DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A61K47/68</main-classification>
        <further-classification edition="200601120260429B">C07K16/30</further-classification>
        <further-classification edition="200601120260429B">C07D491/22</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北海道公立大學法人札幌醫科大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPPORO MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>我妻利紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGATSUMA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡嶌大祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田洋文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗腫瘤效果及安全性面優異、具有優異治療效果的抗腫瘤藥之提供。&lt;br/&gt;  提供一種抗TROP2抗體，其包含：於其重鏈可變區之序列識別號23之胺基酸序列所構成的CDRH1、序列識別號24之胺基酸序列所構成的CDRH2及序列識別號25之胺基酸序列所構成的CDRH3；及於其輕鏈可變區之序列識別號26之胺基酸序列所構成的CDRL1、序列識別號27之胺基酸序列所構成的CDRL2及序列識別號28之胺基酸序列所構成的CDRL3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1966" publication-number="202631203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體－藥物結合物之用途</chinese-title>
        <english-title>USE OF ANTIBODY DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A61K47/68</main-classification>
        <further-classification edition="200601120260429B">C07K16/30</further-classification>
        <further-classification edition="200601120260429B">C07D491/22</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北海道公立大學法人札幌醫科大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPPORO MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>我妻利紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGATSUMA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡嶌大祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田洋文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗腫瘤效果及安全性面優異、具有優異治療效果的抗腫瘤藥之提供。&lt;br/&gt;  提供一種抗TROP2抗體，其包含：於其重鏈可變區之序列識別號23之胺基酸序列所構成的CDRH1、序列識別號24之胺基酸序列所構成的CDRH2及序列識別號25之胺基酸序列所構成的CDRH3；及於其輕鏈可變區之序列識別號26之胺基酸序列所構成的CDRL1、序列識別號27之胺基酸序列所構成的CDRL2及序列識別號28之胺基酸序列所構成的CDRL3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1967" publication-number="202631204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體－藥物結合物之用途</chinese-title>
        <english-title>USE OF ANTIBODY DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A61K47/68</main-classification>
        <further-classification edition="200601120260429B">C07K16/30</further-classification>
        <further-classification edition="200601120260429B">C07D491/22</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北海道公立大學法人札幌醫科大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPPORO MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>我妻利紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGATSUMA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡嶌大祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田洋文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗腫瘤效果及安全性面優異、具有優異治療效果的抗腫瘤藥之提供。&lt;br/&gt;  提供一種抗TROP2抗體，其包含：於其重鏈可變區之序列識別號23之胺基酸序列所構成的CDRH1、序列識別號24之胺基酸序列所構成的CDRH2及序列識別號25之胺基酸序列所構成的CDRH3；及於其輕鏈可變區之序列識別號26之胺基酸序列所構成的CDRL1、序列識別號27之胺基酸序列所構成的CDRL2及序列識別號28之胺基酸序列所構成的CDRL3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1968" publication-number="202631205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體－藥物結合物之用途</chinese-title>
        <english-title>USE OF ANTIBODY DRUG CONJUGATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">A61K47/68</main-classification>
        <further-classification edition="200601120260429B">C07K16/30</further-classification>
        <further-classification edition="200601120260429B">C07D491/22</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北海道公立大學法人札幌醫科大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPPORO MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>我妻利紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGATSUMA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡嶌大祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田洋文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗腫瘤效果及安全性面優異、具有優異治療效果的抗腫瘤藥之提供。&lt;br/&gt;  提供一種抗TROP2抗體，其包含：於其重鏈可變區之序列識別號23之胺基酸序列所構成的CDRH1、序列識別號24之胺基酸序列所構成的CDRH2及序列識別號25之胺基酸序列所構成的CDRH3；及於其輕鏈可變區之序列識別號26之胺基酸序列所構成的CDRL1、序列識別號27之胺基酸序列所構成的CDRL2及序列識別號28之胺基酸序列所構成的CDRL3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1969" publication-number="202631364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造發泡聚合物產品之方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING A FOAMED POLYMER PROD-UCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B29C44/02</main-classification>
        <further-classification edition="200601120260504B">B29C44/34</further-classification>
        <further-classification edition="200601120260504B">B29C44/36</further-classification>
        <further-classification edition="200601120260504B">B29C33/12</further-classification>
        <further-classification edition="200601120260504B">B29C35/02</further-classification>
        <further-classification edition="200601120260504B">A43B13/04</further-classification>
        <further-classification edition="200601120260504B">A43B13/18</further-classification>
        <further-classification edition="200601320260504B">B29L31/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商雲上公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ON CLOUDS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜昂　平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUONG, BINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐提茲　伊利亞斯　米格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORTIZ, ELIAS MIGUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅曼　簡　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMAIN, JEAN-PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>壽　士　龔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAU, SY CONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩吉歐　鶯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGO, OANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種用於製造具有一系列開口(2)之一發泡聚合物產品(1)之方法及供在該方法中使用的包括一系列銷(5)之壓縮模具(4)。該方法包括以下步驟：提供一發泡聚合物預成型件(3)，該發泡聚合物預成型件(3)具有一特定高度、寬度及長度且包括延伸進入或穿過該預成型件(3)之一系列開口(2)；藉由利用該系列開口(2)將該預成型件(3)滑動至該壓縮模具(4)之對應的該系列銷(5)上，將該預成型件(3)插入至該壓縮模具(4)中；以及藉由在該壓縮模具(4)內部壓縮該預成型件(3)，特定而言藉由將頂部(6)及基底(7)朝向彼此擠壓並藉由在該壓縮模具(4)內部加熱該預成型件(3)，在該壓縮模具(4)中使該預成型件(3)成形，以形成具有一經壓縮高度、寬度及/或長度之該產品(1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a method for manufacturing a foamed polymer product 1 having a series of openings 2 and compression mold 4 comprising a series of pins 5 for use in said method. The method comprising the steps of providing a foamed polymer preform 3 having a certain height, width and length and comprising a series of openings 2 extending into or through the preform 3; inserting the preform 3 into the compression mold 4 by sliding the preform 3 with the series of openings 2 onto the corresponding series of pins 5 of the compression mold 4; and shaping of the preform 3 in the compression mold 4 to form the product 1 having a compressed height, width and/or length by compressing the preform 3 inside the compression mold 4, in particular by pressing the top 6 and the base 7 towards each other and by heating of the preform 3 inside the compression mold 4.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:壓縮模具/模具</p>
        <p type="p">5:第一系列銷/第二系列銷/銷/一系列銷</p>
        <p type="p">6:頂部</p>
        <p type="p">7:基底</p>
        <p type="p">8:腔</p>
        <p type="p">14:銷區段</p>
        <p type="p">15:接納區段</p>
        <p type="p">x:縱向方向</p>
        <p type="p">y:橫向方向/方向</p>
        <p type="p">z:高度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1970" publication-number="202633506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W74/10</main-classification>
        <further-classification edition="202601120260504B">H10W76/10</further-classification>
        <further-classification edition="202601120260504B">H10W70/60</further-classification>
        <further-classification edition="202601120260504B">H10W74/01</further-classification>
        <further-classification edition="202601120260504B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱利　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLY, MIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪亞拉　錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENDYALA, CHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權　洋道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWEON, YOUNG DO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個示例中，一種電子裝置包含重新分佈結構、設置在所述重新分佈結構上方的第一電子組件以及鄰近所述第一電子組件設置在所述重新分佈結構上方的第二電子組件。囊封物可以圍繞所述第一電子組件和所述第二電子組件的側面設置。金屬結構設置在所述囊封物和所述第一電子組件上方，並且所述電子裝置的梁中性軸上方的第一CTE與所述電子裝置的所述梁中性軸下方的第二CTE平衡。本文還公開了其它示例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, an electronic device includes a redistribution structure, a first electronic component disposed over the redistribution structure, and a second electronic component disposed adjacent the first electronic component and over the redistribution structure. An encapsulant can be disposed around lateral sides of the first electronic component and the second electronic component. A metallic structure is disposed over the encapsulant and the first electronic component, and a first CTE above a beam-neutral axis of the electronic device is balanced with a second CTE below the beam-neutral axis of the electronic device. Other examples and related methods are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:電子組件</p>
        <p type="p">112:電子組件</p>
        <p type="p">114:重新分佈結構</p>
        <p type="p">116:介電結構</p>
        <p type="p">118:導電結構</p>
        <p type="p">120:內側</p>
        <p type="p">122:外側</p>
        <p type="p">124:底部填料</p>
        <p type="p">126:囊封物</p>
        <p type="p">A:軸線/梁中性軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1971" publication-number="202631379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>面發光裝置、顯示裝置、面發光裝置用密封構件片及面發光裝置之製造方法</chinese-title>
        <english-title>SURFACE-EMITTING DEVICE, DISPLAY, SEALING MEMBER SHEET FOR SURFACE-EMITTING DEVICE, AND METHOD FOR PRODUCING SURFACE-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260421B">B32B7/023</main-classification>
        <further-classification edition="200601120260421B">B32B27/18</further-classification>
        <further-classification edition="200601120260421B">B32B27/32</further-classification>
        <further-classification edition="200601120260421B">B32B27/36</further-classification>
        <further-classification edition="200601120260421B">G02B6/00</further-classification>
        <further-classification edition="202501120260421B">H10H20/854</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>在原慶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIHARA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川麻理衣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, MARII</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>續木淳朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUZUKI, ATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金井喜洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種面發光裝置，具有：具支撐基板、及被配置於前述支撐基板的一方面側的發光二極體元件之發光二極體基板，被配置於前述發光二極體基板的前述發光二極體元件側之面側，密封前述發光二極體元件之密封構件，以及被配置在前述密封構件之與前述發光二極體基板側相反的面側之擴散構件；前述密封構件，霧度值為4%以上，厚度比前述發光二極體元件的厚度還厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a surface-emitting device comprising: a light-emitting diode substrate including a supporting substrate, and a light-emitting diode element placed on one surface side of the supporting substrate, a sealing member placed on the light-emitting diode element side surface of the light-emitting diode substrate, and configured to seal the light-emitting diode element, and a diffusing member placed on the sealing member, on a surface side opposite to the light-emitting diode substrate side, wherein a haze value of the sealing member is 4% or more, and a thickness thereof is thicker than a thickness of the light-emitting diode element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:面發光裝置</p>
        <p type="p">2:支撐基板</p>
        <p type="p">3:發光二極體元件</p>
        <p type="p">4:發光二極體基板</p>
        <p type="p">5:密封構件</p>
        <p type="p">6:擴散構件</p>
        <p type="p">7:反射層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1972" publication-number="202633370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體零件的製造方法、拾取用的帶材及半導體零件的製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P72/70</main-classification>
        <further-classification edition="200601120260427B">H05K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林下英司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHISHITA, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體零件的製造方法包括拾取步驟R3，半導體零件包括厚度為50 μm以下的半導體晶片10，拾取步驟R3是如下步驟：將保持於帶材20的多個半導體晶片10中的一部分作為拾取對象10A，使帶材20對拾取對象10A的保持力喪失，在不對帶材20施加基於上推銷的位移的情況下使拾取對象10A自帶材20分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體晶片</p>
        <p type="p">10A:拾取對象</p>
        <p type="p">11:貫通電極</p>
        <p type="p">20:帶材</p>
        <p type="p">21:基材</p>
        <p type="p">22:黏著層</p>
        <p type="p">23:保持力喪失部</p>
        <p type="p">31:吸附載台</p>
        <p type="p">32:保持力喪失機構</p>
        <p type="p">33:筒夾</p>
        <p type="p">R32:保持力喪失步驟</p>
        <p type="p">R33:回收步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1973" publication-number="202631867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片材、半導體晶片固持構件及半導體晶片固持構件之製造方法</chinese-title>
        <english-title>SHEET MATERIAL, SEMICONDUCTOR CHIP HOLDING MEMBER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP HOLDING MEMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C08L23/12</main-classification>
        <further-classification edition="202501120260427B">C08L23/0853</further-classification>
        <further-classification edition="202501120260427B">C08L23/0869</further-classification>
        <further-classification edition="200601120260427B">C08L23/04</further-classification>
        <further-classification edition="200601120260427B">C08J5/12</further-classification>
        <further-classification edition="202601120260427B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下功一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種兼顧半導體晶片的拾取性和半導體晶片的固持力的確保之片材、兼顧半導體晶片的拾取性和半導體晶片的固持力的確保之半導體晶片固持構件、以及兼顧半導體晶片的拾取性和半導體晶片的固持力的確保之半導體晶片固持構件之製造方法。本發明的片材係用於固持半導體晶片之片材，其特徵為，由含有熱塑性彈性體之材料構成，將構成固持前述半導體晶片之部位之材料的厚度設為150μm時的初黏力為10kPa以上。構成固持前述半導體晶片之部位之材料由含有前述熱塑性彈性體及聚烯烴之材料構成為較佳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sheet material, a semiconductor chip holding member, and a method for manufacturing a semiconductor chip holding member, each capable of achieving both pickup properties of a semiconductor chip and ensured holding force of the semiconductor chip. The sheet material of the present invention is a sheet material used to hold a semiconductor chip. The sheet material is composed of a material containing a thermoplastic elastomer. Further, the sheet material is characterized in that a material constituting a semiconductor chip holding portion has a tack strength of 10 kPa or more when the material constituting the semiconductor chip holding portion has a thickness of 150 μm. The material constituting the semiconductor chip holding portion is preferably composed of a material containing the thermoplastic elastomer and a polyolefin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1974" publication-number="202633415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、基板處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P95/00</main-classification>
        <further-classification edition="202601120260428B">H10P72/00</further-classification>
        <further-classification edition="202601120260428B">H10P95/60</further-classification>
        <further-classification edition="200601120260428B">B05D1/00</further-classification>
        <further-classification edition="200601120260428B">B05D1/18</further-classification>
        <further-classification edition="200601120260428B">G05B19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田野佑磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種提高基板處理之產量的技術。  &lt;br/&gt;本發明之基板處理系統具備：將複數片基板統一處理之批次處理部；將該基板逐片處理之單片處理部；在該批次處理部與該單片處理部之間中繼該基板之聯結部；及控制電路。該聯結部具有貯存浸漬複數片該基板之第1處理液的浸漬槽。該控制電路進行下列控制：監視在該聯結部之該基板的移動停止時間；將浸漬在該第1處理液前或浸漬後，該移動停止時間超過閾值之該基板設定為補救處理之對象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1975" publication-number="202631431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>折疊式推拉車</chinese-title>
        <english-title>COLLAPSIBLE WAGON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62B7/06</main-classification>
        <further-classification edition="200601120260430B">B62B9/12</further-classification>
        <further-classification edition="200601120260430B">B62B9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭斯Ｊ　克萊默</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANCE J, CLEMMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱莉婭　庫塔賈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, CUTAJAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強納森Ｋ　蒙茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN K, MOUNTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露與一種折疊式推拉車有關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed towards a collapsible wagon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:推拉車</p>
        <p type="p">12:框體組件</p>
        <p type="p">14:座部</p>
        <p type="p">16A~16D:輪組件</p>
        <p type="p">18A~18D:輪件</p>
        <p type="p">20:把手</p>
        <p type="p">22:頂軌</p>
        <p type="p">32:側壁</p>
        <p type="p">34:側壁</p>
        <p type="p">62:前支撐桿</p>
        <p type="p">64:後支撐桿</p>
        <p type="p">A:縱向方向</p>
        <p type="p">B:橫向方向</p>
        <p type="p">C:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1976" publication-number="202631429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具旋轉輪之可折疊手推車</chinese-title>
        <english-title>COLLAPSIBLE WAGON WITH SWIVEL WHEELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62B3/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭斯Ｊ　克萊默</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANCE J, CLEMMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾琳　麥克弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRELYN, MCIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱莉亞　庫塔賈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, CUTAJAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強納森Ｋ　蒙茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONATHAN K, MOUNTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種可折疊手推車，其具有可旋轉及固定以控制手推車的操作與移動之輪件配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed towards a collapsible wagon with wheel configurations that can swivel and be fixed to control operation and movement of the wagon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:手推車</p>
        <p type="p">14:座部</p>
        <p type="p">16A,16C,16D:輪組件</p>
        <p type="p">18A,18C,18D:輪件</p>
        <p type="p">20:把手</p>
        <p type="p">22:頂軌</p>
        <p type="p">32:側壁</p>
        <p type="p">62:前支撐桿</p>
        <p type="p">64:後支撐桿</p>
        <p type="p">A:縱向方向</p>
        <p type="p">B:橫向方向</p>
        <p type="p">C:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1977" publication-number="202631744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、覆金屬積層板用硬化性組成物、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F212/12</main-classification>
        <further-classification edition="200601120260504B">C08F212/14</further-classification>
        <further-classification edition="200601120260504B">C08F232/08</further-classification>
        <further-classification edition="200601120260504B">C08F8/02</further-classification>
        <further-classification edition="200601120260504B">C08L25/00</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">C08J5/24</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春日圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>登內駿介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONOUCHI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹口彩香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEGUCHI, AYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻澤裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAZAWA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀨良祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬化性樹脂組成物，其含聚合性基的化合物(A)相對於樹脂成分的合計質量的比例為90質量％以上，前述含聚合性基的化合物(A)包含樹脂(A1)，該樹脂(A1)包含茚環、乙烯基苯甲基及乙烯基苯甲基以外的芳基烷基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1978" publication-number="202632475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制方法、穿戴式裝置以及非暫態電腦可讀取儲存媒體</chinese-title>
        <english-title>CONTROL METHOD, WEARABLE DEVICE AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251212B">G06F3/01</main-classification>
        <further-classification edition="202201120251212B">G06V40/20</further-classification>
        <further-classification edition="200601120251212B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳映文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種控制方法、穿戴式裝置以及非暫態電腦可讀取儲存媒體。此穿戴式裝置由使用者操作，包含輔助照明系統、相機和處理器。此控制方法包含：透過相機捕捉與使用者手部相關的影像幀；透過處理器根據影像幀來產生至少一個指標；以及透過處理器來基於至少一個指標而選擇性地維持補充照明系統的啟用，其中至少一個指標係指示影像幀中的手部影像與影像幀的背景影像是否為可分辨。此非暫態電腦可讀取儲存媒體有電腦程式，以進行上述之控制方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control method, a wearable device and a non-transitory computer readable storage medium background. The wearable device is operable by a user, and includes a supplemental lighting system, a camera and a processor. The control method includes: by the camera, capturing an image frame related to a hand of the user; by the processor, generating at least one indicator according to the image frame; and by the processor, selectively maintaining an enablement of the supplemental lighting system based on the at least one indicator indicating whether a hand image in the image frame is distinguishable against a background image of the image frame. The non-transitory computer readable storage medium has a computer program to execute the control method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:控制方法</p>
        <p type="p">S201~S205:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1979" publication-number="202632457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸出電流保護控制器以及輸出電流保護方法</chinese-title>
        <english-title>OUTPUT CURRENT PROTECTION CONTROLLER AND OUTPUT CURRENT PROTECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05F1/573</main-classification>
        <further-classification edition="200601120260302B">H02M1/14</further-classification>
        <further-classification edition="200601120260302B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　能貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEUNG, NANG CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種輸出電流保護控制器，包含一比較器電路以及一閾值電壓產生器電路。該比較器電路用以比較一電流感測訊號以及一偵測閾值電壓，來產生一控制訊號以控制一切換式穩壓器電路的輸出電流保護，其中該電流感測訊號是指示該切換式穩壓器電路的一輸出電流。該閾值電壓產生器電路用以依據溫度變化來適應性地調整該偵測閾值電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An output current protection controller includes a comparator circuit and a threshold voltage generator circuit. The comparator circuit compares a current sensing signal with a detection threshold voltage to generate a control signal that controls output current protection of a switching regulator circuit. The current sensing signal is indicative of an output current of the switching regulator circuit. The threshold voltage generator circuit adaptively adjusts the detection threshold voltage according to temperature variation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:切換式穩壓器電路</p>
        <p type="p">102,104:體二極體</p>
        <p type="p">105:電流感測電路</p>
        <p type="p">106:輸出電流保護控制器</p>
        <p type="p">108:比較器電路</p>
        <p type="p">109:閾值電壓產生器電路</p>
        <p type="p">110:電壓產生器電路</p>
        <p type="p">112:開關電路</p>
        <p type="p">114:順向電壓偵測電路</p>
        <p type="p">L:電感</p>
        <p type="p">C&lt;sub&gt;O&lt;/sub&gt;:輸出電容</p>
        <p type="p">M1:上橋電源開關</p>
        <p type="p">M2:下橋電源開關</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">SW:開關節點</p>
        <p type="p">TEMP:溫度</p>
        <p type="p">I1,I2:電流</p>
        <p type="p">IL:電感電流</p>
        <p type="p">VREF:偵測閾值電壓</p>
        <p type="p">LOC:控制訊號</p>
        <p type="p">IBAS:偏壓電流</p>
        <p type="p">IBAS':輸出電流</p>
        <p type="p">V&lt;sub&gt;sen&lt;/sub&gt;:電流感測訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1980" publication-number="202632343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光子扇出中介層</chinese-title>
        <english-title>PHOTONIC FANOUT INTERPOSER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B6/122</main-classification>
        <further-classification edition="200601120260504B">G02B6/36</further-classification>
        <further-classification edition="200601120260504B">G02B6/42</further-classification>
        <further-classification edition="200601120260504B">G02B6/13</further-classification>
        <further-classification edition="202601120260504B">H10W70/655</further-classification>
        <further-classification edition="202601120260504B">H10W40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾哈德　奧姆卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARHADE, OMKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　尼可拉斯　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, NICHOLAS C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　沙珊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於提供具有用於一光學互連系統中之玻璃基板之光子裝置之系統及技術。該等光子裝置包括一玻璃基板及透過該玻璃基板之開口耦合之一或多個光電總成。該等光電總成之波導可與該玻璃基板之波導光學耦合以形成穿過該玻璃基板之一光學網路。該等總成波導可透過可插拔光學耦合器、消散耦合及/或邊緣耦合光學耦合至該等玻璃波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are systems and techniques for providing photonic devices having glass substrates for use in an optical interconnect system. The photonic devices comprise a glass substrate and one or more optoelectronic assemblies coupled through openings of the glass substrate. Waveguides of the optoelectronic assemblies may be optically coupled with waveguides of the glass substrate forming an optical network through the glass substrate. The assembly waveguides may be optically coupled to the glass waveguides through pluggable optical couplers, evanescent coupling, and/or edge coupling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光子裝置</p>
        <p type="p">102:玻璃基板</p>
        <p type="p">103:玻璃波導</p>
        <p type="p">110:光電總成</p>
        <p type="p">111:光子積體電路(PIC)</p>
        <p type="p">112:專用積體電路(ASIC)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1981" publication-number="202633195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雪崩光電二極體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260417B">H10F30/225</main-classification>
        <further-classification edition="202501120260417B">H10F77/1223</further-classification>
        <further-classification edition="202501120260417B">H10F77/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏目和俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATSUME, KAZUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種減少暗電流且可高速響應之雪崩光電二極體。  &lt;br/&gt;雪崩光電二極體具備：第1半導體層，其具有p型導電型；障壁層，其積層於上述第1半導體層之1個面，具有p型導電型；光吸收層，其積層於上述障壁層之與上述第1半導體層相反之面，具有p型導電型；第2半導體層，其積層於上述光吸收層之與上述障壁層相反之面；倍增層，其積層於上述第2半導體層之與上述光吸收層相反側；及第3半導體層，其積層於上述倍增層之與上述第2半導體層相反側，具有n型導電型；且，上述第1半導體層、上述障壁層、上述光吸收層、上述第2半導體層及上述倍增層形成第1台面；上述第3半導體層形成第2台面；上述第2台面於俯視時較上述第1台面位於更內側，且於厚度方向上較上述第1台面突出；上述障壁層之摻雜濃度為上述光吸收層之摻雜濃度以上；上述第2半導體層之摻雜濃度為上述光吸收層之摻雜濃度以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:台面(第1台面)</p>
        <p type="p">11:受光區域</p>
        <p type="p">12:電極</p>
        <p type="p">13:台面(第2台面)</p>
        <p type="p">14:電極</p>
        <p type="p">20:基板</p>
        <p type="p">22:接觸層(第1半導體層)</p>
        <p type="p">24:電子障壁層</p>
        <p type="p">26:光吸收層</p>
        <p type="p">28:光吸收層</p>
        <p type="p">30:光吸收層</p>
        <p type="p">32:傾斜層(第2半導體層)</p>
        <p type="p">34:漂移層(第2半導體層)</p>
        <p type="p">36:電場控制層(第1電場控制層)</p>
        <p type="p">38:倍增層</p>
        <p type="p">40:電場控制層(第2電場控制層)</p>
        <p type="p">42:電子傳輸層</p>
        <p type="p">44:緩衝層</p>
        <p type="p">46:緩衝層</p>
        <p type="p">48:緩衝層</p>
        <p type="p">50:緩衝層</p>
        <p type="p">52:接觸層(第3半導體層)</p>
        <p type="p">54:絕緣膜</p>
        <p type="p">100:雪崩光電二極體</p>
        <p type="p">X,Y,Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1982" publication-number="202633090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層結構體、磁性記憶體元件及磁化控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260424B">H10B61/00</main-classification>
        <further-classification edition="202301120260424B">H10N50/10</further-classification>
        <further-classification edition="200601120260424B">H01F10/32</further-classification>
        <further-classification edition="202301120260424B">H10N50/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角嶋邦之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKUSHIMA, KUNIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呉研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼村和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONIMURA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎之積層結構體，其具備基板、鐵磁層及鐵電層，且可藉由鐵電層之極化之大小將鐵磁層之磁化之朝向控制為任意方向。又，本發明提供一種具備上述積層結構體之磁性記憶體元件、及上述積層結構體中之磁化控制方法。該積層結構體包含基板、配置於上述基板之上之鐵磁層及與上述鐵磁層積層且於積層方向上具有極化方向分量之鐵電層。又，可藉由上述鐵電層之極化之大小改變上述鐵磁層之磁化之朝向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1983" publication-number="202631699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148206</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法及用途</chinese-title>
        <english-title>METHOD AND USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/00</main-classification>
        <further-classification edition="200601120260504B">C08F4/642</further-classification>
        <further-classification edition="200601120260504B">C08F4/649</further-classification>
        <further-classification edition="200601120260504B">C08F4/651</further-classification>
        <further-classification edition="200601120260504B">C08F10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商伊諾史匹克有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOSPEC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華特森　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATERSON, CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製造聚烯材料的方法，該方法包含至少一個於至少一種聚合催化劑及至少一種胺基醇化合物存在下聚合至少一種烯單體的步驟；其中該或各聚合催化劑包含齊格勒-納他催化劑且其中該或各胺基醇化合物具有式NR&lt;sup&gt;1&lt;/sup&gt;R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;，其中R&lt;sup&gt;1&lt;/sup&gt;係視需要經取代的C&lt;sub&gt;6-20&lt;/sub&gt;烴基，且R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;中之每一者獨立地係具有至少三個碳原子的烴基且其中各烴基R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;經以至少一個羥基及視需要一或多個進一步取代基取代。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of making a polyolefin material, the method comprising at least one step of polymerising at least one olefinic monomer in the presence of at least one polymerisation catalyst and at least one amino alcohol compound; wherein the or each polymerisation catalyst comprises a Ziegler-Natta catalyst and wherein the or each amino alcohol compound is of the formula NR&lt;sup&gt;1&lt;/sup&gt;R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;, wherein R&lt;sup&gt;1&lt;/sup&gt; is an optionally substituted C&lt;sub&gt;6-20&lt;/sub&gt; hydrocarbyl group, and each of R&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;3&lt;/sup&gt; is independently a hydrocarbyl group having at least three carbon atoms and wherein each hydrocarbyl group R&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;3&lt;/sup&gt; is substituted by at least one hydroxy group and optionally one or more further substituents.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1984" publication-number="202631873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池裝置及其製造方法</chinese-title>
        <english-title>BATTERY DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L53/00</main-classification>
        <further-classification edition="200601120260504B">C08L91/06</further-classification>
        <further-classification edition="200601120260504B">C08K5/523</further-classification>
        <further-classification edition="200601120260504B">C09K5/06</further-classification>
        <further-classification edition="201401120260504B">H01M10/613</further-classification>
        <further-classification edition="201401120260504B">H01M10/659</further-classification>
        <further-classification edition="202101120260504B">H01M50/204</further-classification>
        <further-classification edition="202101120260504B">H01M50/242</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安泰善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, TAESUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炯哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYOUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據示例實施例，電池裝置包括複數個電池單元、設置有容納空間的殼體，複數個電池單元容納在容納空間中、耦合至殼體的下部並配置為關閉容納空間的下側的底板、以及填充在容納空間內使得冷卻件與複數個電池單元中的至少一個接觸的冷卻件。冷卻件包括相變材料、增稠劑、以及阻燃劑。底板經由黏著件耦合至殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to example embodiments, a battery device includes a plurality of battery cells, a housing provided with an accommodation space in which the plurality of battery cells are accommodated, a bottom plate coupled to a lower portion of the housing and configured to close a lower side of the accommodation space, and a cooling member filled within the accommodation space such that the cooling member is in contact with at least one of the plurality of battery cells. The cooling member includes a phase change material, a thickener, and a flame retardant. The bottom plate is coupled to the housing via an adhesive member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池裝置</p>
        <p type="p">100:電池單元</p>
        <p type="p">200:殼體</p>
        <p type="p">211:座部</p>
        <p type="p">300:底板</p>
        <p type="p">410:黏著件/第一黏著件</p>
        <p type="p">420:黏著件/第二黏著件</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1985" publication-number="202631020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液狀食品及其製造方法、以及液狀食品之油臭味抑制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A23L2/84</main-classification>
        <further-classification edition="202101120260504B">A23L2/38</further-classification>
        <further-classification edition="201601120260504B">A23L33/135</further-classification>
        <further-classification edition="202501120260504B">A23L11/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商麒麟控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木深保子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MIHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川温子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種含有有用細菌之死菌及植物油脂之液狀食品。該液狀食品中，有用細菌之死菌濃度為0.5(億個/100 mL)以上，植物油脂之濃度為0.1質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1986" publication-number="202631562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、以及具有保護基的三羥基苯及三羥基苯的製造方法</chinese-title>
        <english-title>COMPOSITION, AND METHOD FOR PRODUCING TRIHYDROXY BENZENE HAVING PROTECTING GROUP AND TRIHYDROXY BENZENE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C37/56</main-classification>
        <further-classification edition="200601120260504B">C07C39/10</further-classification>
        <further-classification edition="200601120260504B">C07C67/08</further-classification>
        <further-classification edition="200601120260504B">C07C69/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二宮良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NINOMIYA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永隆行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，含有下述式（II）所表示的可具有保護基的三羥基苯，所述組成物滿足選自由下述（a-1）及下述（a-2）所組成的群組中的至少一種條件。  &lt;br/&gt;（a-1）金屬元素的總含量未滿500 ppm。  &lt;br/&gt;（a-2）各金屬元素的含量未滿20 ppm。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="297px" width="257px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;〔式（II）中，X&lt;sub&gt;1&lt;/sub&gt;～X&lt;sub&gt;3&lt;/sub&gt;分別獨立地為氫原子、碳原子數1～20的烴基、碳原子數2～20的醯基、碳原子數3～30的矽烷基、或碳原子數1～20的磺醯基〕</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1987" publication-number="202632029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬質被膜及硬質被膜被覆工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C14/06</main-classification>
        <further-classification edition="200601120260504B">B32B9/00</further-classification>
        <further-classification edition="201901120260504B">B32B7/02</further-classification>
        <further-classification edition="200601120260504B">B23B27/14</further-classification>
        <further-classification edition="200601120260504B">B23B51/00</further-classification>
        <further-classification edition="200601120260504B">B23C5/16</further-classification>
        <further-classification edition="201101120260504B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＯＳＧ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>槫林裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUREBAYASHI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王媺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>儀間弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIMA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對廣泛之被切削材料具有優異之耐磨性、耐熔接性之新穎構成之硬質被膜及硬質被膜被覆工具。&lt;br/&gt;  積層第一層組34與作為第二層組之奈米層交替層36，於奈米層交替層36中，交替地沉積奈米層A層36a、奈米層B層36b、奈米層C層36c或奈米層D層36d中之至少三個層。藉由選擇各層之組成比或添加元素，各層中之粒子生長發生變化，因此，若控制結晶尺寸及結晶配向(200)與配向(111)之關係，則能夠優化被膜之硬度與韌性之關係，從而提高耐久性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:工具母材</p>
        <p type="p">30:硬質被膜</p>
        <p type="p">34:第一層組</p>
        <p type="p">34a:由A組成所構成之第一層</p>
        <p type="p">36:第二層組</p>
        <p type="p">36a:由A組成所構成之第二層</p>
        <p type="p">36b:由B組成所構成之第二層</p>
        <p type="p">36c:由C組成所構成之第二層</p>
        <p type="p">36d:由C組成所構成之第二層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1988" publication-number="202633196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>於倍增區界面包含超晶格之單光子雪崩二極體（ＳＰＡＤ）元件及其相關方法</chinese-title>
        <english-title>SINGLE-PHOTON AVALANCHE DIODE (SPAD) DEVICES INCLUDING A SUPERLATTICE AT MULTIPLICATION REGION INTERFACE AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F30/225</main-classification>
        <further-classification edition="202501120260504B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安托梅拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATOMERA INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯緬采夫　伊利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMYANTSEV, ILYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾斯　羅勃Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEARS, ROBERT J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單光子雪崩二極體(SPAD)元件，可包括：一半導體基板，其具有一第一導電類型；該半導體基板中之一深井區，該深井區具有不同於該第一導電類型之一第二導電類型；具該第二導電類型之該深井區中之一倍增區。該SPAD元件可更包括位於該倍增區上且具有該第一導電類型之一中央主動區；環繞該中央主動區及該倍增區且具有該第一導電類型之一防護環；以及與該倍增區與該中央主動區間一界面相鄰之一超晶格層。該超晶格層可包括複數個堆疊之層群組，各層群組包含複數個堆疊的基底半導體單層共同界定出一基底半導體部分，以及包含被侷限在相鄰基底半導體部分之一晶格中之至少一個非半導體單層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single-photon avalanche diode (SPAD) device may include a semiconductor substrate having a first conductivity type, a deep well region in the semiconductor substrate having a second conductivity type different than the first conductivity type, and a multiplication region in the deep well region having the second conductivity type. The SPAD device may further include a central active region on the multiplication region and having the first conductivity type, a guard ring surrounding the central region and the multiplication region and having the first conductivity type, and a superlattice layer adjacent an interface between the multiplication region and the central active region. The superlattice layer may include stacked groups of layers, with each group of layers including stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:SPAD元件</p>
        <p type="p">101:p型基板</p>
        <p type="p">102:n型深井</p>
        <p type="p">103:p+型中央主動區</p>
        <p type="p">104:p型井防護環</p>
        <p type="p">105,106:接點</p>
        <p type="p">107:倍增區</p>
        <p type="p">125:MST層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1989" publication-number="202633197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含鄰接防護環之超晶格的單光子雪崩二極體（ＳＰＡＤ）元件及其相關方法</chinese-title>
        <english-title>SINGLE-PHOTON AVALANCHE DIODE (SPAD) DEVICES INCLUDING A SUPERLATTICE ADJACENT GUARD RING AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F30/225</main-classification>
        <further-classification edition="202501120260504B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安托梅拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATOMERA INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯緬采夫　伊利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMYANTSEV, ILYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾斯　羅勃Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEARS, ROBERT J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單光子雪崩二極體(SPAD)元件，可包括：一半導體基板，其具有一第一導電類型；該半導體基板中之一深井區，該深井區具有不同於該第一導電類型之一第二導電類型；具該第二導電類型之該深井區中之一倍增區。該SPAD元件可更包括位於該倍增區上且具有該第一導電類型之一中央主動區；環繞該中央主動區及該倍增區且具有該第一導電類型之一防護環；以及與該倍增區及該防護環間一界面相鄰之一超晶格層。該超晶格層可包括複數個堆疊之層群組，各層群組包含複數個堆疊的基底半導體單層共同界定出一基底半導體部分，以及包含被侷限在相鄰基底半導體部分之一晶格中之至少一個非半導體單層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single-photon avalanche diode (SPAD) device may include a semiconductor substrate having a first conductivity type, a deep well region in the semiconductor substrate having a second conductivity type different than the first conductivity type, and a multiplication region in the deep well region having the second conductivity type. The SPAD device may further include a central active region on the multiplication region and having the first conductivity type, a guard ring surrounding the central region and the multiplication region and having the first conductivity type, and a superlattice layer adjacent an interface between the multiplication region and the guard ring. The superlattice layer may include stacked groups of layers, with each group of layers comprising stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:SPAD元件</p>
        <p type="p">201:p型基板</p>
        <p type="p">202:n型深井</p>
        <p type="p">203:p+型中央主動區</p>
        <p type="p">204:p型井防護環</p>
        <p type="p">205,206:接點</p>
        <p type="p">225:MST層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1990" publication-number="202631432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手推車</chinese-title>
        <english-title>TROLLEY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62B7/06</main-classification>
        <further-classification edition="200601120260430B">B62B9/10</further-classification>
        <further-classification edition="200601120260430B">B62B9/12</further-classification>
        <further-classification edition="200601120260430B">B62B9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商居佳國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱萬權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, WANQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範　格德輪　馬基恩　漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN GELDEREN, MARTIJN HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種手推車，其具有可升降的車架，車架包括上框架、下框架、支架機構、升降調節件和升降調節釋鎖件。支架機構包括相互樞接的第一支架和第二支架，第一支架和第二支架相對彼此的樞轉能夠使上框架上升或下降。升降調節件可滑動地設置於上框架，並且在鎖定狀態和釋鎖狀態之間可切換。升降調節釋鎖件構造為可操作以將升降調節件從鎖定狀態切換至釋鎖狀態。第一支架和第二支架中的一者可樞轉地連接至升降調節件，第一支架和第二支架中的另一者可樞轉地連接至上框架。當升降調節件處於鎖定狀態時，限制升降調節件相對於上框架的滑動，而當升降調節件處於釋鎖狀態時，允許升降調節件相對於上框架的滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a trolley having a liftable frame. The frame includes an upper frame, a lower frame, a support mechanism, a lift adjustment member and a lift adjustment unlocking member. The support mechanism includes a first support and a second support pivotally connected to each other. The lift adjustment member is slidably arranged on the upper frame and switchable between a locked state and an unlocked state. The lift adjustment unlocking member is configured to be operable to switch the lift adjustment member from the locked state to the unlocked state. One of the first support and the second support is pivotally connected to the lift adjustment member, and the other of the first support and the second support is pivotally connected to the upper frame. When the lift adjustment member is in the locked state, sliding of the lift adjustment member relative to the upper frame is restricted, and when the lift adjustment member is in the unlocked state, the sliding of the lift adjustment member relative to the upper frame is allowed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手推車</p>
        <p type="p">1000:車架</p>
        <p type="p">1600:承載平台</p>
        <p type="p">2000:卡合裝置</p>
        <p type="p">3000:車手</p>
        <p type="p">B:後方向</p>
        <p type="p">F:前方向</p>
        <p type="p">L:左方向</p>
        <p type="p">R:右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1991" publication-number="202631874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>苯乙烯基共聚物、樹脂組合物、預浸料、樹脂塗覆銅箔、金屬箔層壓板及其製造方法</chinese-title>
        <english-title>STYRENE-BASED COPOLYMER, RESIN COMPOSITION, PREPREG, RESIN-COATED COPPER FOIL, METAL FOIL LAMINATED BOARD, AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08L53/02</main-classification>
        <further-classification edition="200601120260422B">C08L25/10</further-classification>
        <further-classification edition="200601120260422B">C08J5/24</further-classification>
        <further-classification edition="200601120260422B">B32B15/082</further-classification>
        <further-classification edition="200601120260422B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LCY CHEMICAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯宜璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱茲絜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, TZ-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺儐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉其益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王靖銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GING-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瓊琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林筱筑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃明富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MING-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種苯乙烯基共聚物，包含苯乙烯類單元和共軛二烯單元。苯乙烯類單元的含量為苯乙烯基共聚物總重量的20 wt%至60 wt%。此苯乙烯基共聚物的嵌段指數大於55%。包含此苯乙烯基共聚物的一種樹脂組合物。由此樹脂組合物製備的一種預浸料和一種樹脂塗覆銅箔。包含此預浸料的一種金屬箔層壓板。包含此樹脂塗覆銅箔的一種金屬箔層壓板。一種製造此金屬箔層壓板的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A styrene-based copolymer includes styrenic units and conjugated diene units. The styrenic units are present in the amount of 20 wt% to 60 wt% based on the total weight of the styrene-based copolymer. The styrene-based copolymer has a blockiness index greater than 55 %. A resin composition includes the styrene-based copolymer. A prepreg and a resin-coated copper foil are manufactured from the resin composition. A metal foil laminated board includes the prepreg. A metal foil laminated board includes the resin-coated copper foil. A method for manufacturing the metal foil laminated board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1992" publication-number="202632647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G11B5/00</main-classification>
        <further-classification edition="202601120260423B">H10D88/00</further-classification>
        <further-classification edition="202601120260423B">H10D80/30</further-classification>
        <further-classification edition="202601120260423B">H10P72/50</further-classification>
        <further-classification edition="202601120260423B">H10W90/26</further-classification>
        <further-classification edition="202001320260423B">G06F115/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>先端系統技術研究組合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESEARCH ASSOCIATION FOR ADVANCED SYSTEMS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川野連也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑田忠廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係包含「具有具第1徑之通孔且堆疊有多個記憶體晶片」的記憶體塊之半導體模組，其中多個記憶體晶片分別包含含第2徑之開孔的內部佈線，多個記憶體晶片分別在剖視中自成為基準之位置起偏移彼此相異之位移量而堆疊，通孔在剖視中與多個記憶體晶片的各自之前述開孔的一部分接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體模組</p>
        <p type="p">100:記憶體塊</p>
        <p type="p">102A:第1面</p>
        <p type="p">102B:第1面</p>
        <p type="p">102C:第1面</p>
        <p type="p">102S:第1面</p>
        <p type="p">104A:第2面</p>
        <p type="p">104B:第2面</p>
        <p type="p">104C:第2面</p>
        <p type="p">104S:第2面</p>
        <p type="p">110A:IC晶片</p>
        <p type="p">110B:IC晶片</p>
        <p type="p">110C:IC晶片</p>
        <p type="p">110S:IC晶片</p>
        <p type="p">130A:電晶體層</p>
        <p type="p">130B:電晶體層</p>
        <p type="p">130C:電晶體層</p>
        <p type="p">130S:電晶體層</p>
        <p type="p">150A:佈線層</p>
        <p type="p">150B:佈線層</p>
        <p type="p">150C:佈線層</p>
        <p type="p">150S:佈線層</p>
        <p type="p">151A:內部佈線</p>
        <p type="p">151B:內部佈線</p>
        <p type="p">151C:內部佈線</p>
        <p type="p">151S:內部佈線</p>
        <p type="p">161:開孔</p>
        <p type="p">162:通孔</p>
        <p type="p">163:中心線</p>
        <p type="p">170A:半導體基板</p>
        <p type="p">170C:半導體基板</p>
        <p type="p">170S:半導體基板</p>
        <p type="p">170B:半導體基板</p>
        <p type="p">200:半導體晶片</p>
        <p type="p">300:再佈線層</p>
        <p type="p">301:佈線</p>
        <p type="p">302:第1面</p>
        <p type="p">303:絕緣層</p>
        <p type="p">304:第2面</p>
        <p type="p">305:佈線</p>
        <p type="p">307:絕緣層</p>
        <p type="p">308:開孔</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1993" publication-number="202633222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260319B">H10H20/852</main-classification>
        <further-classification edition="202501120260319B">H10H20/855</further-classification>
        <further-classification edition="202501120260319B">H10F77/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西尾文孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIO, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之光半導體裝置具備引線、光半導體元件及密封構件。密封構件包含：厚壁部；第1薄壁部，其相對於厚壁部配置於第2方向上之一側；及第2薄壁部，其相對於厚壁部配置於第2方向上之另一側。引線包含從第1方向上之一側觀察時自厚壁部突出之第1部分。第1部分與第1薄壁部接觸，沿著第1薄壁部向第2方向上之一側延伸。第1部分具有於第1方向上之一側露出之正面、及於第1方向上之另一側露出之背面。第2方向上之第1薄壁部之寬度大於第3方向上之第1部分之寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光半導體裝置</p>
        <p type="p">2:引線</p>
        <p type="p">5:光學元件</p>
        <p type="p">7:密封構件</p>
        <p type="p">31:第1部分</p>
        <p type="p">31a:正面(第1正面)</p>
        <p type="p">32:第2部分</p>
        <p type="p">32a:正面(第2正面)</p>
        <p type="p">33:第3部分</p>
        <p type="p">33a:正面(第3正面)</p>
        <p type="p">34:第4部分</p>
        <p type="p">34a:正面(第4正面)</p>
        <p type="p">40:厚壁部</p>
        <p type="p">41:第1薄壁部</p>
        <p type="p">42:第2薄壁部</p>
        <p type="p">51:底部分</p>
        <p type="p">52:突出部分</p>
        <p type="p">52a:上表面</p>
        <p type="p">52b:側面</p>
        <p type="p">52c:側面</p>
        <p type="p">52d:開口部</p>
        <p type="p">61:第1部分</p>
        <p type="p">62:第2部分</p>
        <p type="p">63:第3部分</p>
        <p type="p">71:第1部分</p>
        <p type="p">72:第2部分</p>
        <p type="p">73:第3部分</p>
        <p type="p">L1:寬度</p>
        <p type="p">L2:寬度</p>
        <p type="p">L10:寬度</p>
        <p type="p">L20:寬度</p>
        <p type="p">R1:區域</p>
        <p type="p">R2:區域</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">T3:厚度</p>
        <p type="p">T10:厚度</p>
        <p type="p">T20:厚度</p>
        <p type="p">X:軸方向(第2方向)</p>
        <p type="p">Y:軸方向(第3方向)</p>
        <p type="p">Z:軸方向(第1方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1994" publication-number="202632998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>競爭式上行鏈路傳輸</chinese-title>
        <english-title>CONTENTION-BASED UPLINK TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04W72/21</main-classification>
        <further-classification edition="202301120260504B">H04W72/04</further-classification>
        <further-classification edition="202401120260504B">H04W74/0816</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅莎　克勞迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSA, CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　澤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利　卡里　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOLI, KARI JUHANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝羅拉　伊薩　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIIROLA, ESA TAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之示例性實施例係關於競爭式上行鏈路傳輸。一種方法包含：接收在二個或更多個排程請求(SR)資源和與一組態授權(CG)上行鏈路資料通道資源上之一傳輸相關聯的至少一個特性資訊之間的映射資訊，該CG上行鏈路資料通道資源與該等二個或更多個SR資源相關聯；基於該映射資訊及該至少一個特性資訊，自該等二個或更多個SR資源中選擇要被使用的至少一個SR資源；以及在所選擇的該至少一個SR資源上傳輸至少一個SR。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example embodiments of the present disclosure are directed to contention-based uplink transmission. A method comprises receiving mapping information between two or more SR resources and at least one characteristic information associated with a transmission on a Configured Grant (CG) uplink data channel resource, the CG uplink data channel resource being associated with the two or more Scheduling Request (SR) resources; selecting, from the two or more SR resources, at least one SR resource to be used based on the mapping information and the at least one characteristic information; and transmitting at least one SR on the selected at least one SR resource.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:使用者裝置，終端裝置，UE</p>
        <p type="p">120:網路節點，網路裝置</p>
        <p type="p">600:信令圖</p>
        <p type="p">605,610,615,620,625,630,635,640:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1995" publication-number="202632999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>競爭式上行鏈路傳輸</chinese-title>
        <english-title>CONTENTION-BASED UPLINK TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04W72/21</main-classification>
        <further-classification edition="202301120260504B">H04W72/04</further-classification>
        <further-classification edition="202401120260504B">H04W74/0816</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅莎　克勞迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSA, CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　澤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利　卡里　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOLI, KARI JUHANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝羅拉　伊薩　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIIROLA, ESA TAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之示範實施例關於競爭式上行鏈路傳輸。一方法包含：接收指出針對設備所分配之組態授權(CG)上行鏈路資料通道資源及與CG上行鏈路資料通道資源相關聯之二或更多個排程請求(SR)資源的組態；獲得在二或更多個SR資源和與調變及編碼方案(MCS)、輸送區塊大小(TBS)或傳輸組態指示符(TCI)狀態其中至少一者相關的傳輸參數間之映射資訊，其中該等傳輸參數與CG上行鏈路資料通道資源上之傳輸相關聯；基於映射資訊及傳輸參數而自二或更多個SR資源中選擇要被使用的至少一SR資源；在所選至少一SR資源上傳輸至少一SR；以及使用傳輸參數在CG上行鏈路資料通道資源上進行傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example embodiments of the present disclosure are directed to contention-based uplink transmission. A method comprises receiving a configuration indicating Configured Grant (CG) uplink data channel resources allocated for the apparatus and two or more Scheduling Request (SR) resources associated with the CG uplink data channel resources; obtaining mapping information between the two or more SR resources and transmission parameters related to at least one of Modulation and Coding Schemes (MCSs), Transport Block Sizes (TBSs) or Transmission Configuration Indicator (TCI) states, the transmission parameters being associated with a transmission on the CG uplink data channel resources; selecting, from the two or more SR resources, at least one SR resource to be used based on the mapping information and the transmission parameters; transmitting at least one SR on the selected at least one SR resource; and performing the transmission on the CG uplink data channel resources using the transmission parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:使用者裝置，終端裝置，UE</p>
        <p type="p">120:網路節點，網路裝置</p>
        <p type="p">300:信令圖</p>
        <p type="p">305,310,315,320A,320B,325,330:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1996" publication-number="202633000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148439</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>競爭式上行鏈路傳輸</chinese-title>
        <english-title>CONTENTION-BASED UPLINK TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04W72/21</main-classification>
        <further-classification edition="202301120260504B">H04W72/04</further-classification>
        <further-classification edition="202401120260504B">H04W74/0816</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅莎　克勞迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSA, CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　澤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利　卡里　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOLI, KARI JUHANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝羅拉　伊薩　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIIROLA, ESA TAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之示範實施例關於競爭式上行鏈路傳輸。一方法包含：接收指出針對設備分配之組態授權(CG)上行鏈路資料通道資源及與CG上行鏈路資料通道資源相關聯之二或更多排程請求(SR)資源的組態；獲得在二或更多個SR資源與設備之緩衝狀態資訊或延遲狀態資訊其中至少一者間之映射資訊，其中緩衝狀態資訊或延遲狀態資訊其中至少一者要在CG上行鏈路資料通道資源上傳輸；基於映射資訊及設備之緩衝狀態資訊或延遲狀態資訊其中至少一者而自二或更多個SR資源選擇要被使用的至少一SR資源；在所選至少一SR資源上傳輸至少一SR；以及在CG上行鏈路資料通道資源上進行包括緩衝狀態資訊或延遲狀態資訊其中至少一者的傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example embodiments of the present disclosure are directed to contention-based uplink transmission. A method comprises receiving a configuration indicating Configured Grant (CG) uplink data channel resources allocated for the apparatus and two or more Scheduling Request (SR) resources associated with the CG uplink data channel resources; obtaining mapping information between the two or more SR resources and at least one of buffer status information or delay status information of the apparatus, at least one of the buffer status information or the delay status information being to be transmitted on the CG uplink data channel resources; selecting, from the two or more SR resources, at least one SR resource to be used based on the mapping information and at least one of the buffer status information or the delay status information of the apparatus; transmitting at least one SR on the selected at least one SR resource; and performing a transmission including at least one of the buffer status information or the delay status information on the CG uplink data channel resources.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:使用者裝置，終端裝置，UE</p>
        <p type="p">120:網路節點，網路裝置</p>
        <p type="p">400:信令圖</p>
        <p type="p">405,410,415,420A,420B,425,430:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1997" publication-number="202631359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乙醯化木材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B27K3/34</main-classification>
        <further-classification edition="200601120260102B">B27K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ建築製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK AP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若林雅樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKABAYASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乙醯化木材，其能夠確保耐久性且能夠削減製造成本。本發明之乙醯化木材30具備：表面側部32，其包含木材表面31，且被乙醯化；及內側部33，其位於表面側部32之內側。表面側部32之紅外線吸收光譜中之1740cm&lt;sup&gt;-1&lt;/sup&gt;之峰高A與1510cm&lt;sup&gt;-1&lt;/sup&gt;之峰高B之峰高比A/B為2以上。內側部33之紅外線吸收光譜中之1740cm&lt;sup&gt;-1&lt;/sup&gt;之峰高C與1510cm&lt;sup&gt;-1&lt;/sup&gt;之峰高D之峰高比C/D為0.5以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:木材</p>
        <p type="p">30:乙醯化木材</p>
        <p type="p">31:木材表面</p>
        <p type="p">32:表面側部</p>
        <p type="p">33:內側部</p>
        <p type="p">34:中間部</p>
        <p type="p">35:內包部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1998" publication-number="202632614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於工業車輛的影片管理裝置及記憶有影片管理程式的記憶媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G07C5/08</main-classification>
        <further-classification edition="200601120260424B">H04N7/18</further-classification>
        <further-classification edition="202201120260424B">H04L67/025</further-classification>
        <further-classification edition="202201120260424B">H04L65/1108</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日友物流系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHIYU LOGISYS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名取雅量</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATORI, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栫卓朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKOI, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於工業車輛的影片管理裝置具備控制部及實時通訊控制部。控制部執行用於複數個工業車輛的統一管理的網頁應用程式來啟動影片管理系統。實時通訊控制部藉由通訊處理部接收從工業車輛發送的相機圖像，並藉由通訊處理部來將接收到的相機圖像中繼至使用者終端，而將相機圖像作為動態圖像顯示在使用者終端的網頁瀏覽器上所顯示的影片管理系統的畫面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:管理伺服器</p>
        <p type="p">3001:通訊處理部</p>
        <p type="p">3002:資訊取得部</p>
        <p type="p">3003:記錄部</p>
        <p type="p">3004:顯示部</p>
        <p type="p">3005:實時通訊控制部</p>
        <p type="p">3006:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1999" publication-number="202633001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>競爭式上行鏈路傳輸</chinese-title>
        <english-title>CONTENTION-BASED UPLINK TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04W72/21</main-classification>
        <further-classification edition="202301120260504B">H04W72/04</further-classification>
        <further-classification edition="202401120260504B">H04W74/0816</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅莎　克勞迪奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSA, CLAUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　澤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡利　卡里　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOLI, KARI JUHANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝羅拉　伊薩　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIIROLA, ESA TAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容之示例性實施例係關於競爭式上行鏈路傳輸。一種方法包含：接收一組態，該組態指出針對該設備所分配之組態授權(CG)上行鏈路資料通道資源及與該等CG上行鏈路資料通道資源相關聯之二個或更多個排程請求(SR)資源；基於該等CG上行鏈路資料通道資源上之一傳輸是否存在而自該等二個或更多個SR資源中選擇要被使用的至少一個SR資源；以及在所選擇的該至少一個SR資源上傳輸至少一個SR。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example embodiments of the present disclosure are directed to contention-based uplink transmission. A method comprises receiving a configuration indicating Configured Grant (CG) uplink data channel resources allocated for the apparatus and two or more Scheduling Request (SR) resources associated with the CG uplink data channel resources; selecting, from the two or more SR resources, at least one SR resource to be used based on whether a transmission on the CG uplink data channel resources is present; and transmitting at least one SR on the selected at least one SR resource.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:使用者裝置，終端裝置，UE</p>
        <p type="p">120:網路節點，網路裝置</p>
        <p type="p">500:信令圖</p>
        <p type="p">505,510,515,520A,520B,525,530:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2000" publication-number="202632405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶晶胞</chinese-title>
        <english-title>LIQUID CRYSTAL CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G02F1/1347</main-classification>
        <further-classification edition="200601120260416B">G02F1/133</further-classification>
        <further-classification edition="200601120260416B">G02F1/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商弗萊克英納寶技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖　派崔克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOO, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞維斯　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REEVES, WILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休金斯　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGGINS, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種折射率改變晶胞，其包含：一第一基體；一第二基體；一折射率改變材料，其在該第一基體與該第二基體之間，該折射率改變材料在由該第一基體與該第二基體之間的間隙界定之空間中產生一負壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a refractive index changing cell, comprising: a first substrate; a second substrate; a refractive index changing material between the first and second substrates, the refractive index changing material creating a negative pressure in the space defined by the gap between the first and second substrates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:可撓性塑膠基體，層，塑膠基體，第一可撓性塑膠基體，基體</p>
        <p type="p">24:可撓性塑膠基體，第二基體，塑膠基體，基體</p>
        <p type="p">34,36:表面</p>
        <p type="p">38:適應性透鏡驅動器晶片，LC材料</p>
        <p type="p">39:可撓性塑膠基體晶胞，成形晶胞，晶胞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2001" publication-number="202632799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148508</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高壓電源連接器系統</chinese-title>
        <english-title>HIGH VOLTAGE POWER CONNECTOR SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01R13/213</main-classification>
        <further-classification edition="200601120260422B">H01R13/04</further-classification>
        <further-classification edition="201101120260422B">H01R24/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＣＩ美國有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FCI USA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保羅　米吞　霍爾梅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL, MITHUN HORMESE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈皮　維平　馬南加特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOPI, VIPIN MANANGATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托馬斯　喬茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基斯基　克裏斯托弗　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIESKI, CHRISTOPHER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種插頭連接器包括具有布置成排的凹槽的外殼，在凹槽內的插頭觸點，以及配置為將插頭連接器附接到插座連接器的固定結構。插座連接器包括具有管狀突起的外殼，該管狀突起在管狀突起的內側具有插座觸點，管狀突起沿插座連接器的插拔方向延伸，其中管狀突起布置成排；以及配置為將插頭連接器附接到插座連接器的固定結構。固定結構可以是旋轉閂鎖，該旋轉閂鎖藉由朝向或遠離外殼或包覆成型件旋轉來操作。包覆成型件可以充當抓握表面。電纜組件包括插頭連接器或插座連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plug connector includes a housing having recesses arranged in rows, plug contacts within the recesses, and securing structures configured to attach the plug connector to a receptacle connector. A receptacle connector includes a housing having tubular protrusions, the tubular protrusions having receptacle contacts at inner sides of the tubular protrusions, the tubular protrusions extending along a plugging and unplugging direction of the receptacle connector, wherein the tubular protrusions are arranged in rows; and securing structures configured to attach the receptacle connector to a plug connector. The securing structures maybe rotating latches operated by rotation towards or away from a housing or over mold. The over mold may act as a gripping surface. Cable assemblies include the plug connector or the receptacle connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:插頭連接器</p>
        <p type="p">102:外殼</p>
        <p type="p">102a:配接面</p>
        <p type="p">102b:側面</p>
        <p type="p">103:凹槽</p>
        <p type="p">104:插頭觸點</p>
        <p type="p">106:絕緣帽</p>
        <p type="p">108:極化槽</p>
        <p type="p">110:電纜</p>
        <p type="p">112:固定結構</p>
        <p type="p">D:遠端方向</p>
        <p type="p">P:近端方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2002" publication-number="202632767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池單元陣列、包含該陣列的電池組，以及包含該電池組的車輛</chinese-title>
        <english-title>BATTERY CELL ARRAY, BATTERY PACK INCLUDING BATTERY CELL ARRAY, AND VEHICLE INCLUDING BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260420B">H01M10/0525</main-classification>
        <further-classification edition="201401120260420B">H01M10/655</further-classification>
        <further-classification edition="201401120260420B">H01M10/6555</further-classification>
        <further-classification edition="202101120260420B">H01M50/20</further-classification>
        <further-classification edition="202101120260420B">H01M50/392</further-classification>
        <further-classification edition="201601120260420B">H01M8/0276</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昭貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SO-JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文東才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, DONG-JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳寅石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, IN-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露電池單元陣列，包括多個電池單元；側框架，配置為支撐多個電池單元並形成電池單元陣列的邊緣；至少一個冷卻單元，設置在多個電池單元之間並與側框架組裝以至少部分地突出於側框架之外；填充件，填充在多個電池單元之間；以及防漏單元，配置為密封當側框架和至少一個冷卻單元組裝時產生的間隙空間，以在填充件被填充時防止填充件的洩漏。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a battery cell array, which includes a plurality of battery cells; a side frame configured to support the plurality of battery cells and form an edge of the battery cell array; at least one cooling unit disposed between the plurality of battery cells and assembled with the side frame to be at least partially protruding out of the side frame; a filling member filled between the plurality of battery cells; and a leak prevention unit configured to seal a gap space created when the side frame and the at least one cooling unit are assembled to prevent leakage of the filling member while the filling member is filled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池單元陣列</p>
        <p type="p">100:電池單元</p>
        <p type="p">200:側框架</p>
        <p type="p">300:冷卻單元</p>
        <p type="p">400:填充件</p>
        <p type="p">500:防漏單元</p>
        <p type="p">X,Y,Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2003" publication-number="202631770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚胺基甲酸酯水系分散體及水性塗料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G18/02</main-classification>
        <further-classification edition="200601120260102B">C08G18/28</further-classification>
        <further-classification edition="200601120260102B">C08G18/32</further-classification>
        <further-classification edition="200601120260102B">C08G18/42</further-classification>
        <further-classification edition="200601120260102B">C08G18/48</further-classification>
        <further-classification edition="200601120260102B">C08G18/83</further-classification>
        <further-classification edition="200601120260102B">C08L75/04</further-classification>
        <further-classification edition="200601120260102B">C08J3/05</further-classification>
        <further-classification edition="200601120260102B">C09D175/04</further-classification>
        <further-classification edition="200601120260102B">C09D5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子文弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提高塗膜對於樹脂的密接性及耐UV密接性。實施形態的聚胺基甲酸酯水系分散體是包含芳香族聚酯多元醇作為構成成分的聚胺基甲酸酯樹脂（A）分散於水系分散介質中而成，且包含含碳二亞胺基的化合物（B）與於一分子中具有兩個下述通式（1）所表示的基的化合物（C）。聚胺基甲酸酯樹脂（A）具有羧基。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子或碳數1～3的烴基，*表示鍵結鍵。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="165px" width="194px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2004" publication-number="202631565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀之組成物之製造方法、及9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀之結晶</chinese-title>
        <english-title>METHOD FOR PRODUCING A COMPOSITION CONTAINING 9,9-BIS[9-(2-HYDROXYETHOXY)-3-PHENANTHRYL]FLUORENE, AND CRYSTALS OF 9,9-BIS[9-(2-HYDROXYETHOXY)-3-PHENANTHRYL]FLUORINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C41/40</main-classification>
        <further-classification edition="200601120260504B">C07C43/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本州化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONSHU CHEMICAL INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓井邦昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUI, KUNIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供能作為工業上之製造方法實施，且包含有效率地精製9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀之步驟的製造方法。就解決手段而言，提供了一種含有9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀之組成物之製造方法，包含：由包含9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀、及碳原子數3~6之脂肪族酮溶劑之晶析溶液使9,9-雙[9-(2-羥基乙氧基)-3-菲基]茀之結晶析出之晶析步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective is to provide a production method that can be implemented as an industrial manufacturing method and which includes a step for efficiently purifying 9,9-bis[9-(2-hydroxyethoxy)-3-phenanthryl]fluorene. As a solution, provided is a method for producing a composition containing 9,9-bis[9-(2-hydroxyethoxy)-3-phenanthryl]fluorene, the method including a crystallization step in which crystals of 9,9-bis[9-(2-hydroxyethoxy)-3-phenanthryl]fluorene are precipitated from a crystallization solution containing 9,9-bis[9-(2-hydroxyethoxy)-3-phenanthryl]fluorene and an aliphatic ketone solvent having 3 to 6 carbon atoms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2005" publication-number="202631714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高分子化合物、光敏樹脂組合物、絕緣膜及包括其的電子器件</chinese-title>
        <english-title>POLYMER COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F290/00</further-classification>
        <further-classification edition="200601120260504B">C08F299/02</further-classification>
        <further-classification edition="200601120260504B">C08G73/10</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/037</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">H01B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東進世美肯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGJIN SEMICHEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金弘錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG MYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, TAI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹赫敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, HYOC MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張根石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, GEUN SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許綺秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, GI SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種具有優異的靈敏度、電子器件可靠性和黏結性的高分子化合物。根據一個方面，提供一種包含通式1和2所示的重複單元中的至少一個的高分子化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:通孔</p>
        <p type="p">2:陽極</p>
        <p type="p">3:像素定義層</p>
        <p type="p">4:有機發光層</p>
        <p type="p">5:陰極</p>
        <p type="p">6:覆蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2006" publication-number="202631703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板改質以供定向自組裝應用之具多個含矽官能端基的新聚合物刷</chinese-title>
        <english-title>NEW POLYMER BRUSHES WITH MULTIPLE SILICON CONTAINING FUNCTIONAL END-GROUPS FOR SUBSTRATE MODIFICATION FOR DIRECTED SELF-ASSEMBLY APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08F2/26</main-classification>
        <further-classification edition="200601120260420B">C08F212/08</further-classification>
        <further-classification edition="200601120260420B">C08G77/12</further-classification>
        <further-classification edition="200601120260420B">C08G77/22</further-classification>
        <further-classification edition="201101120260420B">B82Y30/00</further-classification>
        <further-classification edition="200601120260420B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴卡朗　杜拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKARAN, DURAIRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達曼加覃　迪佩克　凡須奴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHARMANGADAN, DEEPAK VISHNU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　巴拉特庫馬爾　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, BHARATKUMAR K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種結構(I)之聚合物，其藉由陰離子聚合製備，具有1.00至1.05之多分散性，其中A為選自結構(A-1)或結構(A-2)之苯乙烯聚合物鏈段，其中m為苯乙烯重複單元之數目，且n為由部分X官能化之苯乙烯重複單元之數目，其中m為5至200範圍內之整數，且n為2至4範圍內之整數，且其中該部分X具有結構(X-1)或(X-2)。  &lt;br/&gt;&lt;img align="absmiddle" height="254px" width="488px" file="ed10171.JPG" alt="ed10171.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described is a polymer of structure (I), prepared by anionic polymerization which has a polydispersity of 1.00 to 1.05, wherein A is styrenic polymeric segment selected from structure (A-1) or structure (A-2), where m is the number of styrene repeat units and n is the number of styrene repeat unit functionalized by the moiety X, where m is an integer ranging from 5 to 200, and n is an integer ranging from 2 to 4 and where the moiety X either has structure (X-1) or (X-2). &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="473px" file="ed10172.JPG" alt="ed10172.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2007" publication-number="202631732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於烯烴聚合的齊格勒－納他催化劑、聚烯烴的製造方法及聚烯烴樹脂</chinese-title>
        <english-title>ZIEGLER-NATTA CATALYST FOR OLEFIN POLYMERIZATION, METHOD OF MANUFACTURING POLYOLEFIN AND POLYOLEFIN RESIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F4/654</main-classification>
        <further-classification edition="200601120260504B">C08F4/656</further-classification>
        <further-classification edition="200601120260504B">C08F10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹賢濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, HYUN JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭義甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOUNG, UI GAB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權藝朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, YEA RANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於烯烴聚合的齊格勒-納他催化劑、聚烯烴的製造方法及聚烯烴樹脂，其中用於烯烴聚合的齊格勒-納他催化劑包括(i)用於烯烴聚合的齊格勒-納他前催化劑，其包括由化學式1表示的鈦化合物、由化學式2表示的鎂化合物、及由化學式3表示的內部電子供體；(ii)由化學式4表示的有機鋁化合物；以及(iii)由化學式5表示的外部電子供體，其中內部電子供體與外部電子供體的莫耳比為1:0.07至1:0.09。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a Ziegler-Natta catalyst for olefin polymerization, a method of manufacturing a polyolefin, and a polyolefin resin, wherein the Ziegler-Natta catalyst for olefin polymerization includes (i) a Ziegler-Natta pro-catalyst for olefin polymerization including a titanium compound represented by Chemical Formula 1, a magnesium compound represented by Chemical Formula 2, and an internal electron donor represented by Chemical Formula 3; (ii) an organoaluminum compound represented by Chemical Formula 4; and (iii) an external electron donor represented by Chemical Formula 5, wherein the internal electron donor and the external electron donor are included in a molar ratio of 1:0.07 to 1:0.09.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2008" publication-number="202633497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有不同尺寸低側場效應電晶體芯片的半導體封裝及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE HAVING LOW SIDE FIELD-EFFECT TRANSISTOR CHIPS OF DIFFERENT SIZES AND METHOD OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W72/50</main-classification>
        <further-classification edition="202601120260428B">H10W70/40</further-classification>
        <further-classification edition="202601120260428B">H10W74/00</further-classification>
        <further-classification edition="202501120260428B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　彥迅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, YANXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲爾布裡克　裡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILBRICK, RHYS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　隆慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘繼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛　志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝，包括一個引線框架、一個高側芯片、一個第一低側芯片、一個第二低側芯片、一個第一金屬夾、一個第二金屬夾、一個積體電路（IC）以及一個模塑封裝。一種製造方法包括以下步驟：提供一個引線框架；安裝一個高側芯片、一個第一低側芯片和一個第二低側芯片；安裝一個第一金屬夾和一個第二金屬夾；安裝一個積體電路；形成一個模塑封裝；以及執行切割工藝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package comprises a lead frame, a high side chip, a first low side chip, a second low side chip, a first metal clip, a second metal clip, an integrated circuit (IC), and a molding encapsulation. A method comprises the steps of providing a lead frame; mounting a high side chip, a first low side chip, and a second low side chip; mounting a first metal clip and a second metal clip; mounting an IC; forming a molding encapsulation; and applying a singulation process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:半導體封裝</p>
        <p type="p">160:第一組一個或多個VSWH引腳</p>
        <p type="p">170:第二組一個或多個VSWH引腳</p>
        <p type="p">180:強制連續導通模式(FCCM)</p>
        <p type="p">190:電流監測輸出訊號(IMON)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2009" publication-number="202632049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結晶性氮化硼膜的沉積</chinese-title>
        <english-title>DEPOSITION OF CRYSTALLINE BORON NITRIDE FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C16/34</main-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="200601120260504B">C23C16/52</further-classification>
        <further-classification edition="200601120260504B">C23C16/56</further-classification>
        <further-classification edition="200601120260504B">C30B25/02</further-classification>
        <further-classification edition="200601120260504B">C30B25/16</further-classification>
        <further-classification edition="200601120260504B">C30B29/40</further-classification>
        <further-classification edition="202601120260504B">H10P14/694</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＭＤ特用材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMD PERFORMANCE MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加州大學董事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE REGENTS OF THE UNIVERSITY OF CALIFORNIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎喬利亞　拉文德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANJOLIA, RAVINDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫因普爾　曼蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOINPOUR, MANSOUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　計良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHILIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　平哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PING-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉　迪亞哥康特雷拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORA, DIEGO CONTRERAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫梅爾　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMMEL, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　新建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, XINJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢德拉　哈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRA, HARIPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露並請求保護的標的關於結晶性含硼膜的組合物與方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed and claimed subject matter relate to compositions and methods for forming a crystalline boron-containing film.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2010" publication-number="202632983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>與短程無線通道探測相關聯的傳輸測量</chinese-title>
        <english-title>TRANSMITTING MEASUREMENTS ASSOCIATED WITH SHORT-RANGE WIRELESS CHANNEL SOUNDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260401B">H04W24/00</main-classification>
        <further-classification edition="202301120260401B">H04W72/20</further-classification>
        <further-classification edition="201501120260401B">H04B17/30</further-classification>
        <further-classification edition="201501120260401B">H04B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉古納特　巴加夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHUNATH, BHARGAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特拉　瑪楊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATRA, MAYANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康內里薩蒂斯庫瑪爾　蘇米亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONERY SATHEESHKUMAR, SOUMYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科魯孔達　拉姆莫漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORUKONDA, RAM MOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在某些態樣中，一第一使用者設備(UE)可傳輸一第一信號至一第二UE並且將其作為與一短程無線通道探測程序相關聯之一子事件之一第一步驟的一部分。該UE可接收來自該第二UE的一第二信號並且將其作為該子事件之該第一步驟的一部分，其中該第二信號至少部分地基於該第一信號。該UE可接收來自該第二UE的一第三信號並且將其作為該子事件之一第二步驟的一部分，該第三信號指示與該第一信號相關聯的一第一測量。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may transmit, to a second UE and as part of a first step of a subevent associated with a short-range wireless channel sounding procedure, a first signal. The UE may receive, from the second UE and as part of the first step of the subevent, a second signal, wherein the second signal is based at least in part on the first signal. The UE may receive, from the second UE and as part of a second step of the subevent, a third signal that indicates a first measurement associated with the first signal. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:實例</p>
        <p type="p">502,504,506,508:元件符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2011" publication-number="202632914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接收器</chinese-title>
        <english-title>RECEIVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">H04B1/10</main-classification>
        <further-classification edition="200601120260424B">H03D7/14</further-classification>
        <further-classification edition="200601120260424B">H03F3/193</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGBEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金信永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石鉉己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOK, HYUNGI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容描述一種接收器，其包括：一低雜訊放大器；一增益級電路；一第一混頻器，其透過一第一節點耦接至該增益級電路且基於一第一本地振盪器(LO)信號以及自該第一LO信號反相之一第二LO信號而執行降頻轉換；一第二混頻器，其透過一第二節點耦接至該增益級電路且基於正交於該第一LO信號之一第三LO信號以及自該第三LO信號反相之一第四LO信號而執行降頻轉換；一第一接收點開關，其耦接至該第一節點且基於經界定為該第三LO信號與該第四LO信號之一總和的一第一控制信號而接通；以及一第二接收點開關，其耦接至該第二節點且基於經界定為該第一LO信號與該第二LO信號之一總和的一第二控制信號而接通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A receiver includes a low noise amplifier, a gain stage circuit, a first mixer coupled to the gain stage circuit through a first node and that performs frequency down conversion, based on a first local oscillator (LO) signal and a second LO signal inverted from the first LO signal, a second mixer coupled to the gain stage circuit through a second node and that performs frequency down conversion, based on a third LO signal orthogonal to the first LO signal and a fourth LO signal inverted from the third LO signal, a first sink switch coupled to the first node and turned on based on a first control signal defined as a sum of the third and fourth LO signals, and a second sink switch coupled to the second node and turned on based on a second control signal defined as a sum of the first and second LO signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:接收器</p>
        <p type="p">110:增益級電路</p>
        <p type="p">120:類比基頻電路</p>
        <p type="p">131:第一類比至數位轉換器，第一ADC</p>
        <p type="p">132:第二ADC</p>
        <p type="p">CON1:第一控制信號</p>
        <p type="p">CON2:第二控制信號</p>
        <p type="p">LNA:低雜訊放大器</p>
        <p type="p">LO1:第一LO信號</p>
        <p type="p">LO2:第二LO信號</p>
        <p type="p">LO3:第三LO信號</p>
        <p type="p">LO4:第四LO信號</p>
        <p type="p">MX1:第一混頻器，混頻器</p>
        <p type="p">MX2:第二混頻器，混頻器</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">RA:接收天線，天線</p>
        <p type="p">SS1:第一接收點開關</p>
        <p type="p">SS2:第二接收點開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2012" publication-number="202632642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對應多語言之機器人或產業機械之控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G10L15/10</main-classification>
        <further-classification edition="201301120260424B">G10L15/06</further-classification>
        <further-classification edition="201301120260424B">G10L15/28</further-classification>
        <further-classification edition="200601120260424B">G03G21/00</further-classification>
        <further-classification edition="200601120260424B">G06F3/12</further-classification>
        <further-classification edition="200601120260424B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝久洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUHISA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之控制裝置具備：非揮發性記憶體，其儲存第1語言資料；揮發性記憶體；資料取得部，其自外部記憶裝置取得與第1語言資料不同之第2語言資料，且儲存於揮發性記憶體；顯示部，其顯示機械之操作畫面；及顯示控制部，其於揮發性記憶體中未儲存第2語言資料之情形時，使顯示部顯示基於第1語言資料之操作畫面，於揮發性記憶體中儲存有第2語言資料之情形時，使顯示部顯示基於第2語言資料之操作畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:控制裝置</p>
        <p type="p">2:機器人或產業機械</p>
        <p type="p">3:外部記憶裝置</p>
        <p type="p">10:運算處理裝置</p>
        <p type="p">11:非揮發性記憶體</p>
        <p type="p">12:揮發性記憶體</p>
        <p type="p">13:資料取得部</p>
        <p type="p">14:顯示部</p>
        <p type="p">15:顯示控制部</p>
        <p type="p">16:通信部</p>
        <p type="p">21:操作畫面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2013" publication-number="202633464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抑制電耦合的半導體封裝</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE SUPPRESSING ELECTRICAL COUPLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/40</main-classification>
        <further-classification edition="202601120260427B">H10W72/90</further-classification>
        <further-classification edition="202601120260427B">H10W90/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　彥迅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, YANXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　隆慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛　志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝，包括一個引線框架、一個第一高壓側場效應電晶體（FET）、一個第二高壓側 FET、一個第一金屬夾、一個第二金屬夾、一個第一低壓側 FET、一個第二低壓側 FET、一個第三金屬夾、一個金屬塊、一個積體電路（IC）、多根接合引線以及一個模塑封裝。一種製造方法，包括以下步驟：提供一個引線框架；安裝一個第一高壓側 FET 和一個第二高壓側 FET；連接一個第一金屬夾和一個第二金屬夾；安裝一個第一低壓側 FET 和一個第二低壓側 FET；連接一個第三金屬夾；連接一個 IC；形成一個模塑封裝；以及執行一次單體化工藝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package comprises a lead frame, a first high side field-effect transistor (FET), a second high side FET, a first metal clip, a second metal clip, a first low side FET, a second low side FET, a third metal clip, a metal slug, an integrated circuit (IC), a plurality of bond wires, and a molding encapsulation. A method comprises the steps of providing a lead frame; mounting a first high side FET and a second high side FET; attaching a first metal clip and a second metal clip; mounting a first low side FET and a second low side FET; attaching a third metal clip; attaching an IC; forming a molding encapsulation; and applying a singulation process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">187:金屬塊</p>
        <p type="p">310:引線框架</p>
        <p type="p">331:第一垂直引腳</p>
        <p type="p">333:第二垂直引腳</p>
        <p type="p">335:距離</p>
        <p type="p">337:距離</p>
        <p type="p">380:第三金屬夾</p>
        <p type="p">390:IC</p>
        <p type="p">392:接合引線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2014" publication-number="202631879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱硬化性樹脂組成物、預浸體、樹脂薄膜、積層板、印刷線路板、天線裝置、天線模組及通訊裝置、以及熱硬化性樹脂組成物的製造方法及預浸體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">C08L63/00</main-classification>
        <further-classification edition="200601120260425B">C08K3/24</further-classification>
        <further-classification edition="200601120260425B">C08J5/24</further-classification>
        <further-classification edition="200601120260425B">H05K1/03</further-classification>
        <further-classification edition="200601120260425B">H01Q1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大治雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山雄祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高圭芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種熱硬化性樹脂組成物，其含有鈦酸鹽，並且過篩性優異。此外，提供一種預浸體、樹脂薄膜、積層板、印刷線路板、天線裝置、天線模組及通訊裝置，該等是使用該熱硬化性樹脂組成物來獲得。並且，提供前述熱硬化性樹脂組成物的製造方法及前述預浸體的製造方法。前述熱硬化性樹脂組成物具體而言為一種熱硬化性樹脂組成物，其含有：(A)熱硬化性樹脂；及(B)在1,150℃以上煅燒而得的非晶質狀的鈦酸鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2015" publication-number="202633371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含用於脫附水分之微波加熱器的負載鎖定配置以及基板處理設備</chinese-title>
        <english-title>LOAD LOCK ARRANGEMENT COMPRISING A MICROWAVE HEATER FOR DESORBING MOISTURE AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/70</main-classification>
        <further-classification edition="202601120260420B">H10W40/10</further-classification>
        <further-classification edition="200601120260420B">H05B6/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈布　薩拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARB, SALAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班納　薩梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNA, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種負載鎖定配置以及一種包含該負載鎖定配置之基板處理設備。該負載鎖定配置包含：一負載鎖定腔室本體，其界定一負載鎖定腔室；一基板固持器，其用於將一或多個基板固持在該負載鎖定腔室中；以及一微波加熱器，其用於自該一或多個基板脫附所吸附之水分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a load lock arrangement and a substrate processing apparatus comprising the load lock arrangement. The load lock arrangement comprises a load lock chamber body that defines a load lock chamber, a substrate holder for holding one or more substrates in the load lock chamber, and a microwave heater for desorbing adsorbed moisture from the one or more substrates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:負載鎖定配置</p>
        <p type="p">2:負載鎖定腔室本體</p>
        <p type="p">3:負載鎖定腔室</p>
        <p type="p">4:第一面</p>
        <p type="p">5:第二面</p>
        <p type="p">6:視埠</p>
        <p type="p">7:液密窗口</p>
        <p type="p">8:基板固持器</p>
        <p type="p">9:基板</p>
        <p type="p">10:微波加熱器</p>
        <p type="p">12:磁控管微波源</p>
        <p type="p">13:微波模式攪拌器</p>
        <p type="p">14:微波波導</p>
        <p type="p">16:排空埠</p>
        <p type="p">19:第二負載鎖定腔室</p>
        <p type="p">20:基板處理設備</p>
        <p type="p">21:真空泵</p>
        <p type="p">22:轉移模組</p>
        <p type="p">23:真空腔室</p>
        <p type="p">24:沉積腔室</p>
        <p type="p">26:負載埠</p>
        <p type="p">27:基板載具</p>
        <p type="p">28:前端基板轉移機器人</p>
        <p type="p">29:基板冷卻台</p>
        <p type="p">30:閘閥</p>
        <p type="p">31:後端基板轉移機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2016" publication-number="202632631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G09G3/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元太科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, WEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙玟雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, WEN YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁廣恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, KUANG-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種顯示裝置。顯示裝置包括畫素陣列以及驅動電路。畫素陣列包括多個畫素單元。驅動電路通過多個掃描信號線以及多個數據信號線耦接多個畫素單元。多個畫素單元的每一個包括第一電晶體、第二電晶體、第三電晶體、等效自舉電容以及等效畫素電容。第一電晶體耦接第一節點。第二電晶體耦接第二節點。第三電晶體耦接第二節點。等效自舉電容耦接在第一節點以及第二節點之間。等效畫素電容耦接在第一節點以及參考電壓之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided. The display device includes a pixel array and a driving circuit. The pixel array includes a plurality of pixel units. The driving circuit is coupled to the plurality of pixel units through a plurality of scan signal lines and a plurality of data signal lines. Each of the plurality of pixel units includes a first transistor, a second transistor, a third transistor, an equivalent bootstrap capacitor, and an equivalent pixel capacitor. The first transistor is coupled to a first node. The second transistor is coupled to a second node. The third transistor is coupled to the second node. The equivalent bootstrap capacitor is coupled between the first node and the second node. The equivalent pixel capacitor is coupled between the first node and a reference voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:畫素陣列</p>
        <p type="p">120:驅動電路</p>
        <p type="p">SL_1~SL_M:掃描信號線</p>
        <p type="p">DL_1~DL_N:數據信號線</p>
        <p type="p">P(1,1)~P(X,Y):畫素單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2017" publication-number="202632196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F25D17/06</main-classification>
        <further-classification edition="200601120260421B">F25D16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商善集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XEN GROUP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名越和法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGOSHI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高畑洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHATA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種將含水物作為對象物的冷卻方法。此冷卻方法包含以下步驟：在攝氏-5.0℃以上且攝氏-1.0℃以下之溫度範圍的至少一部分中，使對象物之中心部的溫度比對象物之表層部的溫度先行降低的保管準備冷卻步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2018" publication-number="202631375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>層狀結構體及其製造方法、器件、以及粒子分散液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B5/16</main-classification>
        <further-classification edition="200601120260504B">B32B9/00</further-classification>
        <further-classification edition="200601120260504B">C09K11/02</further-classification>
        <further-classification edition="200601120260504B">C09K11/56</further-classification>
        <further-classification edition="200601120260504B">C09K11/74</further-classification>
        <further-classification edition="200601120260504B">B05D1/38</further-classification>
        <further-classification edition="200601120260504B">B05D3/00</further-classification>
        <further-classification edition="200601120260504B">B05D7/24</further-classification>
        <further-classification edition="201101120260504B">B82Y20/00</further-classification>
        <further-classification edition="201101120260504B">B82Y30/00</further-classification>
        <further-classification edition="201101120260504B">B82Y40/00</further-classification>
        <further-classification edition="200601120260504B">H05B33/14</further-classification>
        <further-classification edition="202501120260504B">H10D62/10</further-classification>
        <further-classification edition="202301120260504B">H10K50/11</further-classification>
        <further-classification edition="202601120260504B">H10P14/20</further-classification>
        <further-classification edition="202601120260504B">H10P14/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山菅雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASUGE, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野幹久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, MIKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耐久性、導電性、及量子效率高度並存的結構體。層狀結構體的特徵在於：包括基板、以及所述基板上的高密度粒子層，所述高密度粒子層含有於表面形成有無機膜的奈米粒子，所述奈米粒子的粒徑為1 nm以上且50 nm以下，所述高密度粒子層的每單位體積的所述奈米粒子的填充率為30 vol%以上且80 vol%以下，所述無機膜的厚度為0.1 nm以上且5 nm以下，所述無機膜的價帶上端的能階與所述奈米粒子的價帶上端的能階相同或比其低，且所述無機膜的傳導帶下端的能階與所述奈米粒子的傳導帶下端的能階相同或比其高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:結構體(層狀結構體)</p>
        <p type="p">10:基板</p>
        <p type="p">20:高密度粒子層</p>
        <p type="p">21:奈米粒子</p>
        <p type="p">22:無機膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2019" publication-number="202632293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260319B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若澤勝博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKAZAWA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸康貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">探針，具備突出部、連接至突出部之母材、及被內包於母材中之內包線。母材，包含：前端部，以突出部的前端朝向檢查對象而突出的方式，突出部被埋入該前端部；複數根臂，其各自的一方的端部相互地隔離並連接至前端部；及，基端部，複數根臂的各自的另一方的端部相互地隔離並連接至該基端部。內包線，包含：前端區域，被內包於前端部中；複數個臂區域，被內包於複數根臂中，其各自的一方的端部連接至前端區域；及，基端區域，被內包於基端部中，複數個臂區域的各自的另一方的端部，與該基端區域連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針</p>
        <p type="p">10:前端部</p>
        <p type="p">11:突出部</p>
        <p type="p">20:臂</p>
        <p type="p">30:基端部</p>
        <p type="p">40:固定部</p>
        <p type="p">110:母材</p>
        <p type="p">120:內包線</p>
        <p type="p">121:第1內包線</p>
        <p type="p">122:第2內包線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2020" publication-number="202631067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備及其控制方法、程式產品及計算機可讀儲存介質</chinese-title>
        <english-title>CLEANING DEVICE AND CONTROL METHOD, PROGRAM PRODUCT, AND COMPUTER-READABLE STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L11/03</main-classification>
        <further-classification edition="200601120260102B">A47L11/24</further-classification>
        <further-classification edition="202401120260102B">B08B1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商深圳洛克創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陈瑞云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RUIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韩婷玮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, TINGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭露了一種清潔設備及其控制方法、程式產品及介質，所述清潔設備包括：清潔劑管路，所述清潔劑管路配置為：在所述清潔設備內部輸送清潔劑；控制器，所述控制器配置為：在所述清潔設備的工作過程中，獲取清潔劑流量與清水流量的比例參數值；根據所述比例參數值控制所述清潔設備向所述清潔劑管路中投放清潔劑。通過本申請提供的技術方案能夠提高清潔設備投放清潔劑的合理性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure discloses a cleaning device and a control method, program product, and medium thereof. The cleaning device comprises: a cleaning agent pipeline, configured to convey a cleaning agent inside the cleaning device; and a controller, configured to: during operation of the cleaning device, acquire a proportional parameter value between cleaning agent flow and clean water flow; and control the cleaning device to dispense the cleaning agent into the cleaning agent pipeline according to the proportional parameter value. The technical solution provided in this disclosure can improve the rationality of cleaning agent dispensing by the cleaning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:清水箱</p>
        <p type="p">102:清水泵</p>
        <p type="p">103:清水檢測模組</p>
        <p type="p">104:清潔劑箱</p>
        <p type="p">105:清潔劑泵</p>
        <p type="p">106:三通閥</p>
        <p type="p">107:加熱器</p>
        <p type="p">108:二通閥</p>
        <p type="p">109:清潔件</p>
        <p type="p">111:吸汙管道</p>
        <p type="p">112:汙水箱</p>
        <p type="p">200:清潔設備</p>
        <p type="p">201:清潔劑管路</p>
        <p type="p">202:控制器</p>
        <p type="p">203:清水管路</p>
        <p type="p">204:髒汙檢測模組</p>
        <p type="p">205:交互模組</p>
        <p type="p">206:遠端指令接收模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2021" publication-number="202632957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148851</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼裝置、編碼方法、解碼裝置、解碼方法、程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260311B">H04N19/593</main-classification>
        <further-classification edition="201401120260311B">H04N19/157</further-classification>
        <further-classification edition="201401120260311B">H04N19/70</further-classification>
        <further-classification edition="201401120260311B">H04N19/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川爽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井優人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>悟
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川孝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種編碼裝置，其特徵為，具有：預測手段，係用以針對對象區塊，執行使用濾波器的所定之畫面內預測處理，並藉由令前記濾波器邊做移動邊做適用，來生成預測影像；和編碼手段，係用以將用來在複數個濾波器之中，特定出針對前記對象區塊的前記所定之畫面內預測處理中所使用之濾波器所需之語法要素，予以編碼；前記編碼手段未將前記語法要素予以編碼的情況下，前記語法要素之值係被限制成，前記複數個濾波器之其中1個濾波器所對應的所定之值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:編碼裝置</p>
        <p type="p">101:控制部</p>
        <p type="p">102:區塊分割部</p>
        <p type="p">103:預測部</p>
        <p type="p">104:轉換/量化部</p>
        <p type="p">105:逆量化/逆轉換部</p>
        <p type="p">106:影像重建部</p>
        <p type="p">107:畫格記憶體</p>
        <p type="p">108:迴圈內濾波器部</p>
        <p type="p">109:編碼部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2022" publication-number="202632687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高壓電纜的製造方法及由此製得的高壓電纜</chinese-title>
        <english-title>METHOD OF MANUFACTURING HIGH-VOLTAGE CABLE AND HIGH-VOLTAGE CABLE MANUFACTURED THEREBY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">H01B13/016</main-classification>
        <further-classification edition="200601120260430B">H01B13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓華思路信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴奎學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYU HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金燦旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHAN WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金官映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWAN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種高壓電纜的製造方法。該高壓電纜的製造方法包括：將覆蓋添加有交聯劑之擠出式絕緣層的電纜引入固化管的操作(a)；提高引入電纜之固化管的前段區域中的溫度，以在絕緣層中執行交聯製程並控制電纜通過固化管的線速度的操作(b)；以及在固化管的後段區域，對於交聯製程期間產生的交聯副產物進行除氣的操作(c)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of manufacturing a high-voltage cable. The method of manufacturing a high-voltage cable includes operation (a) of introducing a cable covered with an extruded insulating layer to which a cross-linking agent is added into a cure tube, operation (b) of increasing a temperature in a front zone of the cure tube into which the cable is introduced to perform a cross-linking process in the insulating layer and controlling a line speed of the cable through the cure tube, and operation (c) of degassing cross-linking byproducts generated during the cross-linking process at a back zone of the cure tube.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S200,S300:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2023" publication-number="202632338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波導光電二極體以及包括波導光電二極體及跨阻放大器的單片電光積體電路</chinese-title>
        <english-title>WAVEGUIDE PHOTODIODE AND MONOLITHIC ELECTRO-PHOTONIC INTEGRATED CIRCUIT COMPRISING A WAVEGUIDE PHOTODIODE AND TRANSIMPEDANCE AMPLIFIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B6/12</main-classification>
        <further-classification edition="202501120260504B">H10F55/20</further-classification>
        <further-classification edition="202501120260504B">H10H20/824</further-classification>
        <further-classification edition="202501120260504B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商電光　ＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELECTROPHOTONIC-IC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔洛夫　勞倫斯　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAROF, LAWRENCE E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克拉杜尼　維根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PACRADOUNI, VIGHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮緬諾夫　基里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIMENOV, KIRILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛格文　尤里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOGVIN, YURY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　迪拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, DHIRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科雄　埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAUCHON, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊頓　理查德　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAYTON, RICHARD D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特朗布萊　弗朗索瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREMBLAY, FRANCOIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯森德　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWNSEND, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種波導（WG）器件，該WG器件包括一p型材料、一i型材料及一n型材料（一PIN波導），該波導器件包括：一半絕緣（SI）磷化銦（InP）基板；形成在該SI:InP基板上之一磊晶層堆疊，該磊晶層堆疊經結構化以形成該PIN波導，該磊晶層堆疊包括：一n層結構及一p層結構；位於該n層結構與該p層結構之間的一i區，該i區包括具有一操作波長範圍的光學材料；該n層結構及該p層結構提供一模態成形功能性，該模態成形功能性經組態以對一光學信號的一或多個模態進行光學限制，該光學信號經組態以傳播通過該i區；其中該模態成形功能性包含在該n層結構及該p層結構中之至少一者中提供一模態延伸功能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">600:摻Fe的SI InP</p>
        <p type="p">602:脊波導結構</p>
        <p type="p">604:磊晶層堆疊</p>
        <p type="p">606:i區</p>
        <p type="p">608:吸收材料或區</p>
        <p type="p">610:p接觸層</p>
        <p type="p">612:n接觸層</p>
        <p type="p">614:n-InP間隔件層</p>
        <p type="p">616:下部(第二)模態成形區段</p>
        <p type="p">618:第一單獨限制異質結構(下SCH)</p>
        <p type="p">620:第二單獨限制異質結構(上SCH)</p>
        <p type="p">622:上部(第一)模態成形區段</p>
        <p type="p">624a:p型模態延伸層</p>
        <p type="p">626:p-InP間隔件層</p>
        <p type="p">628:P金屬接觸件</p>
        <p type="p">630:N金屬接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2024" publication-number="202631122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ugonin化合物於治療骨癌的用途</chinese-title>
        <english-title>USE OF UGONIN COMPOUNDS IN THE TREATMENT OF BONE CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/353</main-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAW, CHIH-CHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種ugonin化合物的用途，其係用以製備用於治療個體之骨癌的藥物，其中，該骨癌包括軟骨肉瘤，該ugonin化合物的效用包括預防或抑制該軟骨肉瘤移轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a use of an ugonin compound in the manufacture of a medicament for treating bone cancer in a subject, wherein the bone cancer includes chondrosarcoma, and the ugonin compound is effective in preventing or inhibiting the metastasis of the chondrosarcoma.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2025" publication-number="202632853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及包括積體電路的多相切換式轉換器</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND MULTI-PHASE SWITCHING CONVERTER INCLUDING THE INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H02M1/08</main-classification>
        <further-classification edition="200601120260309B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　景海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JINGHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　加欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIAHSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種積體電路及包括多個積體電路的多相切換式轉換器。積體電路包括接收輸入電壓的輸入端、斷路器、以及功率管芯。功率管芯包括高側開關、低側開關、斷路控制器和功率級控制器。高側開關的第一端耦接至斷路器的第二端，高側開關的第二端耦接至低側開關的第一端。斷路控制器耦接至斷路器的控制端，當斷路控制器判定積體電路發生故障時，斷路控制器控制斷路器斷開功率管芯與輸入端的電連接。功率級控制器耦接至高側開關的控制端和低側開關的控制端，以提供第一驅動訊號至高側開關，提供第二驅動訊號至低側開關。本公開的積體電路可以實現快速故障隔離，使本公開的積體電路和多相切換式轉換器提高了可靠性和穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit and a multi-phase switch converter comprising multiple integrated circuits are disclosed. The integrated circuit has an input terminal for receiving an input voltage, a circuit breaker, and a power die. The power die comprises a high-side switch, a low-side switch, a circuit breaker controller, and a power stage controller. A first terminal of the high-side switch is coupled to a second terminal of the circuit breaker, and a second terminal of the high-side switch is coupled to a first terminal of the low-side switch. The breaker controller is coupled to a control terminal of the circuit breaker. When the breaker controller determines that the integrated circuit has failed, it controls the circuit breaker to disconnect the electrical connection between the power die and the input terminal. The power stage controller is coupled to the control terminals of both the high-side switch and the low-side switch to provide a first drive signal to the high-side switch and a second drive signal to the low-side switch. The integrated circuit of the present disclosure enables rapid fault isolation, enhancing the reliability and stability of both the integrated circuit and the multiphase switch converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:斷路器</p>
        <p type="p">12:功率管芯</p>
        <p type="p">100:積體電路</p>
        <p type="p">101:輸入端</p>
        <p type="p">102:第二端</p>
        <p type="p">121:高側開關</p>
        <p type="p">122:低側開關</p>
        <p type="p">123:斷路控制器</p>
        <p type="p">124:功率級控制器</p>
        <p type="p">131:電源電路</p>
        <p type="p">132:驅動器</p>
        <p type="p">133:控制電路</p>
        <p type="p">HSG,LSG:驅動訊號</p>
        <p type="p">PGood:指示訊號</p>
        <p type="p">PWM:開關控制訊號</p>
        <p type="p">PGND:功率地</p>
        <p type="p">SW:開關節點</p>
        <p type="p">VDD:電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VIN_B:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2026" publication-number="202632597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自律機器人、自律機器人之控制方法、自律機器人之控制程式、及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260430B">G06Q50/22</main-classification>
        <further-classification edition="200601120260430B">A61G12/00</further-classification>
        <further-classification edition="201801120260430B">G16H10/00</further-classification>
        <further-classification edition="200601120260430B">B25J15/04</further-classification>
        <further-classification edition="200601120260430B">B25J9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池淳義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, ATSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本揭露係有關於，具備用來實現與人類之共生所需之半導體裝置的自律機器人。  &lt;br/&gt;　　[解決手段] 係為一種具有動作部及處理部的自律機器人(10)。  &lt;br/&gt;　　動作部，係將來自處理部的訊號，轉換成自律機器人(10)的行動性動作。處理部係具有第1處理部及第2處理部；訊號係具有第1訊號及第2訊號。  &lt;br/&gt;　　第1處理部，係將用來進行包含動作部之作動及停止在內之控制的第1訊號，予以生成；第2處理部，係將第1訊號輸入至判定模型，並執行第1訊號所涉及之自律機器人(10)的從行動規範之脫序判定處理。  &lt;br/&gt;　　處理部，係在脫序判定結果為肯定判定的情況下，生成用來抑制行動性動作的第2訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自律機器人</p>
        <p type="p">10a:自律機器人</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2027" publication-number="202631606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預防或治療特發性肺纖維化（ＩＰＦ）之組合物</chinese-title>
        <english-title>COMPOSITIONS FOR PREVENTING OR TREATING IDIOPATHIC PULMONARY FIBROSIS (IPF)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D413/12</main-classification>
        <further-classification edition="200601120260504B">C07D413/14</further-classification>
        <further-classification edition="200601120260504B">C07D271/10</further-classification>
        <further-classification edition="200601120260504B">C07D417/12</further-classification>
        <further-classification edition="200601120260504B">C07D471/10</further-classification>
        <further-classification edition="200601120260504B">C07D491/044</further-classification>
        <further-classification edition="200601120260504B">A61K31/5377</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/4245</further-classification>
        <further-classification edition="200601120260504B">A61K31/541</further-classification>
        <further-classification edition="200601120260504B">A61K31/551</further-classification>
        <further-classification edition="200601120260504B">A61K31/438</further-classification>
        <further-classification edition="200601120260504B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商鐘根堂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG KUN DANG PHARMACEUTICAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河妮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, NINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玟澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUK JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, JIYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐東賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, DONG-HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於預防或治療特發性肺纖維化之醫藥組合物，其包含由式I表示之化合物、其光學異構物或其醫藥學上可接受之鹽作為有效成分；一種使用該化合物預防或治療特發性肺纖維化之方法；一種以該化合物於預防或治療特發性肺纖維化上之用途；及一種以該化合物於製備供預防或治療特發性肺纖維化之藥劑上的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a pharmaceutical composition for preventing or treating idiopathic pulmonary fibrosis, comprising a compound represented by formula I, optical isomers thereof or pharmaceutically acceptable salts thereof as an effective ingredient, a method for preventing or treating idiopathic pulmonary fibrosis using the compound, a use of the compound for preventing or treating idiopathic pulmonary fibrosis, and a use of the compound in preparing a medicament for preventing or treating idiopathic pulmonary fibrosis.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2028" publication-number="202632476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可實現用少量字元符號來關聯豐富學習內容的交互回應方法和用於該方法的專注凝視高效快速的學習方法</chinese-title>
        <english-title>AN INTERACTIVE RESPONSE METHOD FOR ASSOCIATING RICH LEARNING CONTENT WITH A SMALL NUMBER OF CHARACTER SYMBOLS AND A FOCUSED GAZE EFFICIENT AND RAPID LEARNING METHOD FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G06F3/023</main-classification>
        <further-classification edition="202201120260425B">G06F3/04886</further-classification>
        <further-classification edition="200601120260425B">G09B5/06</further-classification>
        <further-classification edition="201401120260425B">A63F13/5375</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛苜灃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, MU FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛苜灃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, MU FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭朋深</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種可實現用少量字元符號來關聯豐富學習內容的交互回應方法和用於該方法的專注凝視高效快速的學習方法，本發明的目的是為人們提供一種新的學習方式，該學習方式不僅可通過電子拳靶來邊健身邊學習文化知識，還可以通過遊戲手柄或鍵盤或虛擬按鍵以打遊戲的方式來學習文化知識。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses an interactive response method that can associate rich learning content with a small number of character symbols and a focused, efficient, and fast learning method. The purpose of this invention is to provide people with a new way of learning, which can not only learn cultural knowledge while exercising through electronic punching bags, but also learn cultural knowledge by playing games through game controllers, keyboards, or virtual buttons.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:字元符號區域</p>
        <p type="p">130:字元符號</p>
        <p type="p">900:輸入端</p>
        <p type="p">910:左上方輸入端</p>
        <p type="p">920:正上方輸入端</p>
        <p type="p">930:右上方輸入端</p>
        <p type="p">940:正左方輸入端</p>
        <p type="p">950:正中方輸入端</p>
        <p type="p">960:正右方輸入端</p>
        <p type="p">970:左下方輸入端</p>
        <p type="p">980:正下方輸入端</p>
        <p type="p">990:右下方輸入端</p>
        <p type="p">9000:輸入環境</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2029" publication-number="202631862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橡膠成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C08L11/00</main-classification>
        <further-classification edition="200601120260429B">C08L9/00</further-classification>
        <further-classification edition="202001120260429B">C08J7/048</further-classification>
        <further-classification edition="200601120260429B">B32B25/18</further-classification>
        <further-classification edition="200601120260429B">B32B27/32</further-classification>
        <further-classification edition="200601120260429B">B32B27/36</further-classification>
        <further-classification edition="201901120260429B">B32B7/035</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大協精工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKYO SEIKO, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長博敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芦田能基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIDA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内藤友也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITOU, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田沢佑介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAZAWA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之主要目的在於提供一種橡膠成形品，係表面具有非氟系樹脂膜層，且該橡膠成形品係阻氣性及電子束耐性為良好，製造時之成形性亦良好。本發明提供一種橡膠成形品，係包含非氟系樹脂膜層；於層疊前之非氟系樹脂膜中，TD方向之伸長率相對於MD方向之伸長率的比(TD/MD)為0.80以上至1.20以下。又，可於層疊前之非氟系樹脂膜中，MD方向之伸長率為150%以上至450%以下，及TD方向之伸長率為150%以上至450%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橡膠基材</p>
        <p type="p">2:膜層</p>
        <p type="p">10:腳部</p>
        <p type="p">20:笠下部</p>
        <p type="p">30:頂面部</p>
        <p type="p">31:上表面</p>
        <p type="p">32:側表面</p>
        <p type="p">100:橡膠成形品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2030" publication-number="202633372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基座整平總成、半導體設備、及反應器系統</chinese-title>
        <english-title>SUSCEPTOR LEVELING ASSEMBLY, SEMICONDUCTOR APPARATUS, AND REACTOR SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10P72/70</main-classification>
        <further-classification edition="202601120260429B">H10P72/50</further-classification>
        <further-classification edition="200601120260429B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　李奧納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露適合於整平一基座的設備及系統。一種例示性基座整平總成包含一基座整平板及一第一定位總成，其中該第一定位總成包含一第一定位裝置及一第一整平機構。一種例示性設備包括一底座及一基座整平總成。一種例示性反應器系統包括一基座、一底座及一基座整平總成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and systems suitable for leveling a susceptor are disclosed. An exemplary susceptor leveling assembly comprises a susceptor leveler plate and a first positioning assembly, wherein the first positioning assembly comprises a first positioning device and a first leveling mechanism. An exemplary apparatus includes a pedestal and a susceptor leveling assembly. An exemplary reactor system includes a susceptor, a pedestal, and a susceptor leveling assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:總成</p>
        <p type="p">102:基座整平總成</p>
        <p type="p">103(a):定位區域</p>
        <p type="p">103(b):定位區域</p>
        <p type="p">103(c):定位區域</p>
        <p type="p">104(a):第一整平機構</p>
        <p type="p">104(b):第一整平機構</p>
        <p type="p">104(c):第一整平機構</p>
        <p type="p">106(a):第一定位裝置</p>
        <p type="p">106(b):第一定位裝置</p>
        <p type="p">106(c):第一定位裝置</p>
        <p type="p">107:調整機構框架</p>
        <p type="p">108(a):第二定位裝置</p>
        <p type="p">108(b):第二定位裝置</p>
        <p type="p">108(c):第二定位裝置</p>
        <p type="p">109(a):第一定位總成，定位總成</p>
        <p type="p">109(b):第二定位總成，定位總成</p>
        <p type="p">109(c):第三定位總成，定位總成</p>
        <p type="p">110:基座整平板</p>
        <p type="p">120:底座</p>
        <p type="p">130:基座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2031" publication-number="202631715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合組成物、使用該混合組成物的膜、光學零件及圖像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/50</further-classification>
        <further-classification edition="200601120260504B">C08F222/10</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">C08F265/00</further-classification>
        <further-classification edition="200601120260504B">C08F271/02</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/033</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B5/18</further-classification>
        <further-classification edition="200601120260504B">G02B5/32</further-classification>
        <further-classification edition="200601120260504B">G02F1/1335</further-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
        <further-classification edition="200601120260504B">G03H1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種當形成在面內具有折射率不同的區域的膜時可使折射率不同的區域間的折射率差增大的混合組成物、使用該混合組成物的膜、光學零件及圖像顯示裝置。一種混合組成物，包含：光聚合性脂肪族單體，25℃下的鈉D線的波長下的折射率小於1.50；以及聚合物，25℃下的鈉D線的波長下的折射率為1.60以上。可相對於聚合物100質量份，以40質量份以上且300質量份以下的比例調配光聚合性脂肪族單體。光聚合性脂肪族單體的每一分子的光聚合性基數可為4以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜</p>
        <p type="p">2:折射率高的區域/區域</p>
        <p type="p">3:折射率低的區域/區域</p>
        <p type="p">d1:區域2的寬度/寬度</p>
        <p type="p">d2:區域3的寬度/寬度</p>
        <p type="p">X:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2032" publication-number="202631716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化膜之製造方法、印刷配線基板及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F220/18</further-classification>
        <further-classification edition="200601120260504B">C08F220/36</further-classification>
        <further-classification edition="200601120260504B">C08F220/58</further-classification>
        <further-classification edition="200601120260504B">C08F222/20</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">C08G59/20</further-classification>
        <further-classification edition="200601120260504B">C08G59/42</further-classification>
        <further-classification edition="200601120260504B">C08G59/50</further-classification>
        <further-classification edition="200601120260504B">C08J3/28</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商柯尼卡美能達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONICA MINOLTA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛久正幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USHIKU, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲島厚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹村千代子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEMURA, CHIYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山夏帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, NATSUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原一成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬化膜之製造方法，其係藉由光照射及加熱硬化，製造膜厚較厚且Tg亦較高之硬化膜，且同時抑制對表面之斷裂產生。本發明係製造玻璃轉移溫度(Tg)為120℃以上且膜厚為50μm以上之硬化膜之方法，並進行以下步驟：  &lt;br/&gt;　　進行複數次包含具有(甲基)丙烯醯基之化合物及具有環氧基之化合物之硬化性組成物之賦予及對前述經賦予之硬化性組成物之光照射，形成斷裂伸度為7%以上且200%以下之預硬化膜之步驟，與  &lt;br/&gt;　　將前述預硬化膜進行熱硬化之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:列印機平台</p>
        <p type="p">110:支架</p>
        <p type="p">112,114:噴墨頭</p>
        <p type="p">122,124:光源</p>
        <p type="p">200:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2033" publication-number="202631550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含含磷之甲基丙烯酸酯及２，４－二（三級丁基）－酚之組成物</chinese-title>
        <english-title>COMPOSITION COMPRISING A PHOSPHOROUS-CONTAINING METHACRYLATE AND 2,4-DI(TERT-BUTYL)-PHENOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07B63/04</main-classification>
        <further-classification edition="200601120260504B">C07C67/62</further-classification>
        <further-classification edition="200601120260504B">C07C69/54</further-classification>
        <further-classification edition="200601120260504B">C07F9/113</further-classification>
        <further-classification edition="200601120260504B">C08F230/02</further-classification>
        <further-classification edition="200601120260504B">C08F220/14</further-classification>
        <further-classification edition="200601120260504B">C08L33/12</further-classification>
        <further-classification edition="200601120260504B">C08L43/02</further-classification>
        <further-classification edition="200601120260504B">C08K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTER, KRISTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布列斯　汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLEITH, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾　朵瑞絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAAL, DORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉瑪　伊莉莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAMER, ELISABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩格　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAG, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含含磷之甲基丙烯酸酯及2,4-二(三級丁基)-酚之安定單體組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a stable monomer composition comprising a phosphorous-containing methacrylate and 2,4-di(tert-butyl)-phenol.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2034" publication-number="202631717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性樹脂薄膜、印刷線路板及其製造方法、以及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/48</further-classification>
        <further-classification edition="200601120260504B">C08F226/06</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/032</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
        <further-classification edition="200601120260504B">H05K3/18</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野憂子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野尻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIRI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田薰平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性樹脂組成物、使用該感光性樹脂組成物的感光性樹脂薄膜、印刷線路板及其製造方法、以及半導體封裝體，該一種感光性樹脂組成物，其含有：(A)具有乙烯性不飽和基及酸性取代基的光聚合性化合物；(B)具有異氰脲酸酯環或甘脲環及乙烯性不飽和基的化合物；及(C)具有包含芳香族環與脂肪族環的縮合環的基及2個以上的N-取代馬來醯亞胺基的馬來醯亞胺樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2035" publication-number="202631531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良之機械及化學效能的含氫的基於玻璃之製品</chinese-title>
        <english-title>HYDROGEN-CONTAINING GLASS-BASED ARTICLES HAVING IMPROVED MECHANICAL AND CHEMICAL PERFORMANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C03C3/076</main-classification>
        <further-classification edition="200601120260421B">C03C3/091</further-classification>
        <further-classification edition="200601120260421B">C03C3/097</further-classification>
        <further-classification edition="200601120260421B">C03C21/00</further-classification>
        <further-classification edition="200601120260421B">C03C4/10</further-classification>
        <further-classification edition="200601120260421B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾登伯格　艾蜜莉瑪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AALDENBERG, EMILY MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛羅斯　提摩西麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROSS, TIMOTHY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汀格利　詹姆士愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TINGLEY, JAMES EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　景實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JINGSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種基於玻璃之製品，其包括：小於或等於2 mm之厚度；玻璃組合物；自該基於玻璃之製品的表面延伸至某一層深度的含氫層；及如使用透射傅立葉轉換紅外光譜術(FTIR)所量測在5400 cm&lt;sup&gt;-1&lt;/sup&gt;至4810 cm&lt;sup&gt;-1&lt;/sup&gt;之波數下大於0之未反應水峰高度。該玻璃組合物包括大於或等於50 mol%且小於或等於70mol% SiO&lt;sub&gt;2&lt;/sub&gt;、大於或等於5 mol%且小於或等於20 mol% Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、大於或等於1 mol%且小於或等於9 mol% P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、大於或等於1 mol%且小於或等於20 mol% Na&lt;sub&gt;2&lt;/sub&gt;O，及大於或等於1 mol%且小於或等於10 mol% K&lt;sub&gt;2&lt;/sub&gt;O。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass-based article includes a thickness less than or equal to 2 mm, a glass composition, a hydrogen-containing layer extending from a surface of the glass-based article to a depth of layer; and an unreacted water peak height greater than 0, as measured using transmission Fourier Transform Infrared Spectroscopy (FTIR) at a wavenumber from 5400 cm&lt;sup&gt;-1&lt;/sup&gt; to 4810 cm&lt;sup&gt;-1&lt;/sup&gt;. The glass composition includes greater than or equal to 50 mol% and less than or equal to 70 mol% SiO&lt;sub&gt;2&lt;/sub&gt;, greater than or equal to 5 mol% and less than or equal to 20 mol% Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, greater than or equal to 1 mol% and less than or equal to 9 mol% P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;, greater than or equal to 1 mol% and less than or equal to 20 mol% Na&lt;sub&gt;2&lt;/sub&gt;O, and greater than or equal to 1 mol% and less than or equal to 10 mol% K&lt;sub&gt;2&lt;/sub&gt;O.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於玻璃之製品</p>
        <p type="p">110:第一表面/暴露表面/表面</p>
        <p type="p">112:第二表面/暴露表面/表面</p>
        <p type="p">120:第一含氫層/含氫層</p>
        <p type="p">122:第二含氫層/含氫層</p>
        <p type="p">130:不含所添加氫物種之區域</p>
        <p type="p">t:厚度</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:深度</p>
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2036" publication-number="202631537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含凹陷特徵之玻璃製品及其製造方法</chinese-title>
        <english-title>GLASS ARTICLES COMPRISING DEBOSSED FEATURES AND METHODS OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03C15/00</main-classification>
        <further-classification edition="200601120260504B">C03C17/32</further-classification>
        <further-classification edition="200601120260504B">B44C1/20</further-classification>
        <further-classification edition="200601120260504B">B44C1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾格奈羅　賈伯瑞皮爾思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGNELLO, GABRIEL PIERCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡頓　馬修瓦德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENTON, MATTHEW WADE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇贊斯基　提摩西詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KICZENSKI, TIMOTHY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡西　凱文羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCARTHY, KEVIN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃製品包括：一玻璃基板，其中該玻璃基板包含一第一表面及與該第一表面相對之一第二表面；以及一填充材料，其定位於該第二表面上之一凹陷區中。一種製造一玻璃製品之方法包括：蝕刻一玻璃基板，其中該玻璃基板包含一第一表面及與該第一表面相對之一第二表面，且其中該蝕刻去除該第二表面之一部分，藉此在該第二表面上形成一凹陷區；以及將一填充材料塗覆至該凹陷區，其中該玻璃基板之一折射率與該填充材料之一折射率的一差之一絕對值大於或等於0.05。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass article includes: a glass substrate, wherein the glass substrate comprises a first surface and a second surface opposite the first surface; and a fill material positioned in a debossed region on the second surface. A method of making a glass article includes: etching a glass substrate, wherein the glass substrate comprises a first surface and a second surface opposite the first surface, and wherein the etching removes a portion of the second surface, thereby forming a debossed region on the second surface; and applying a fill material to the debossed region, wherein an absolute value of a difference in a refractive index of the glass substrate and a refractive index of the fill material is greater than or equal to 0.05.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2037" publication-number="202632306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機</chinese-title>
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G01R31/28</main-classification>
        <further-classification edition="202601120260422B">H10P74/20</further-classification>
        <further-classification edition="202601120260422B">H10P72/30</further-classification>
        <further-classification edition="202601120260422B">H10P72/76</further-classification>
        <further-classification edition="200601120260422B">B65G49/07</further-classification>
        <further-classification edition="200601120260422B">B25J9/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt;  本發明的用於測試電子元件的處理機把用於修理測試板的測試銷的修理用元件裝載到測試台後修理測試銷。&lt;br/&gt;  適用本發明時，能確保測試的可靠性並且能大幅減少用於修理測試銷的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:測試台</p>
        <p type="p">a:列</p>
        <p type="p">b:列</p>
        <p type="p">c:列</p>
        <p type="p">d:列</p>
        <p type="p">e:列</p>
        <p type="p">f:列</p>
        <p type="p">ED:電子元件</p>
        <p type="p">G:配置間距</p>
        <p type="p">RE:修理用元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2038" publication-number="202632776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池包</chinese-title>
        <english-title>BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260504B">H01M50/204</main-classification>
        <further-classification edition="200601120260504B">H01M10/48</further-classification>
        <further-classification edition="201401120260504B">H01M10/613</further-classification>
        <further-classification edition="201401120260504B">H01M10/615</further-classification>
        <further-classification edition="201401120260504B">H01M10/63</further-classification>
        <further-classification edition="201401120260504B">H01M10/643</further-classification>
        <further-classification edition="201401120260504B">H01M10/6556</further-classification>
        <further-classification edition="201401120260504B">H01M10/6567</further-classification>
        <further-classification edition="201401120260504B">H01M10/6568</further-classification>
        <further-classification edition="201401120260504B">H01M10/6571</further-classification>
        <further-classification edition="202101120260504B">H01M50/213</further-classification>
        <further-classification edition="202101120260504B">H01M50/262</further-classification>
        <further-classification edition="202101120260504B">H01M50/264</further-classification>
        <further-classification edition="202101120260504B">H01M50/271</further-classification>
        <further-classification edition="202101120260504B">H01M50/291</further-classification>
        <further-classification edition="202101120260504B">H01M50/505</further-classification>
        <further-classification edition="202101120260504B">H01M50/627</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>行競科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING MOBILITY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汲毓舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YU-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖資文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王騰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴尚智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊錦堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池包包含電池模組(3010)及二蓋模組。電池模組(3010)包含複數個電池單元(0020)、電池座(0050)及限液殼體(0080)。限液殼體(0080)為管狀結構且包含橫向地圍繞電池包空間(3032)之周邊壁(0090)以及第一互鎖結構。第一互鎖結構設置於限液殼體(0080)之垂直端部。蓋模組包含第二互鎖結構以與第一互鎖結構機械性連接。周邊壁(0090)另包含密封件容置結構(0220)。電池包另包含密封件(0200)容納於密封件容置結構(0220)中。蓋模組包含蓋體密封表面壓縮密封件(0200)。第一與第二互鎖結構之間的機械性連接限制蓋模組與限液殼體(0080)之間的相對橫向位移，以維持密封件(0200)之壓縮狀態對抗橫向剪切力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack includes two lid modules and at least one battery module (3010) including battery cells (0020), a cell holder (0050), and a liquid-limiting casing (0080). The liquid-limiting casing (0080) is a tubing structure having a peripheral wall (0090) laterally surrounding a BP-space (3032) and having a first interlocking structure disposed on a vertical end of the liquid-limiting casing (0080). The lid module includes a second interlocking structure mechanically engaged with the first interlocking structure. The peripheral wall (0090) includes a sealing-member-accommodating structure (0220). The battery pack further includes a sealing member (0200) accommodated in the sealing-member-accommodating structure (0220). The lid module has a lid-sealing surface compressing the sealing member (0200). The mechanical engagement between the first and second interlocking structures restricts a relative lateral displacement between the lid module and the liquid-limiting casing (0080), thereby maintaining a compression status of the sealing member (0200) against lateral shear forces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">0080:限液殼體</p>
        <p type="p">0160:頂壁面</p>
        <p type="p">0170:底壁面</p>
        <p type="p">0200:密封件</p>
        <p type="p">0210:密封件定位結構</p>
        <p type="p">0220:密封件容置結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2039" publication-number="202631526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C03B33/02</main-classification>
        <further-classification edition="201401120260430B">B23K26/00</further-classification>
        <further-classification edition="201401120260430B">B23K26/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維亞機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA MECHANICS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使在以狹小間距進行多個孔的鑽孔加工的情況下，也能夠維持或提高加工品質的技術。雷射加工方法具有：在基板的正面形成保護片的步驟（S1）；在基板的正面上的多個鑽孔位置之間的第一間距為小於保護片的加工孔徑的間距的情況下，設定第一鑽孔位置組及第二鑽孔位置組，以成為保護片的加工孔徑以上的間距即第二間距的步驟（S0）；透過對第一鑽孔位置組的雷射照射而執行第一鑽孔加工並形成第一孔的步驟（S2）；形成新的保護片的步驟（S3）；透過對第二鑽孔位置組的雷射照射而執行第二鑽孔加工並形成第二孔的步驟（S4）；以及去除保護片的步驟（S5）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:工件基板</p>
        <p type="p">22:雷射振盪器(二氧化碳雷射振盪器)</p>
        <p type="p">23:聲光調變器(AOM)</p>
        <p type="p">24:振鏡掃描器</p>
        <p type="p">25:阻尼器</p>
        <p type="p">26:整體控制部</p>
        <p type="p">27:雷射振盪控制部</p>
        <p type="p">28:AOM控制部</p>
        <p type="p">29:振鏡控制部</p>
        <p type="p">D:AOM驅動信號</p>
        <p type="p">G:振鏡動作控制信號</p>
        <p type="p">S:雷射振盪指令信號</p>
        <p type="p">L1,L2,L3:雷射脈衝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2040" publication-number="202632496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>標記活指令</chinese-title>
        <english-title>MARK-LIVE INSTRUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260504B">G06F9/30</main-classification>
        <further-classification edition="201601120260504B">G06F12/0802</further-classification>
        <further-classification edition="200601120260504B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍斯奈爾　馬修詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORSNELL, MATTHEW JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯派爾　湯馬斯菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEIER, THOMAS PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克卡爾　薩利爾拉姆錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKERKAR, SALIL RAMCHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里森斯韋特　理查羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRISENTHWAITE, RICHARD ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含：指令解碼電路系統，其經組態以解碼指令；及處理電路系統，其經組態以回應於由該指令解碼電路系統解碼的該等指令而執行資料處理。快取記憶體控制電路系統經組態以回應於該指令解碼電路系統對指定標記活目標位址資訊之一標記活指令進行解碼而設定與基於該標記活目標位址資訊選擇之一或多個目標快取線相關聯之丟棄資格後設資料，以識別該一或多個目標快取線有資格被視為即使一可丟棄快取線係髒的仍允許在不進行資料寫回之情況下丟棄之該可丟棄快取線。回應於與一給定快取線相關聯之一標記死事件，該快取記憶體控制電路系統取決於該給定快取線之該丟棄資格後設資料而判定該給定快取線是否有資格成為一可丟棄快取線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises instruction decoding circuitry configured to decode instructions; and processing circuitry configured to perform data processing in response to the instructions decoded by the instruction decoding circuitry. Cache control circuitry is configured to set, in response to the instruction decoding circuitry decoding a mark-live instruction specifying mark-live target address information, discard-eligibility metadata associated with one or more target cache lines selected based on the mark-live target address information, to identify the one or more target cache lines as being eligible for being treated as a discardable cache line which is allowed to be discarded without data writeback even if the discardable cache line is dirty. In response to a mark-dead event associated with a given cache line, the cache control circuitry determines depending on the discard-eligibility metadata for the given cache line whether the given cache line is eligible for becoming a discardable cache line.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2041" publication-number="202631823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物及其硬化物、成形物、片狀成形物以及光波導</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G75/08</main-classification>
        <further-classification edition="200601120260504B">C08L81/02</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">G02B1/04</further-classification>
        <further-classification edition="200601120260504B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出崎光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZAKI, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺津悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATSU, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，其能夠形成呈現高折射率且耐黃變性優異之硬化物。  &lt;br/&gt;本發明提供一種組合物，其含有式(II)所示之化合物(A)及式(B)所示之化合物(B)。  &lt;br/&gt;&lt;img align="absmiddle" height="106px" width="305px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(II)中，  &lt;br/&gt;L&lt;sup&gt;1x&lt;/sup&gt;表示單鍵或2價基。  &lt;br/&gt;A&lt;sup&gt;1x&lt;/sup&gt;表示氧原子或硫原子。其中，兩個A&lt;sup&gt;1x&lt;/sup&gt;中之至少一個為硫原子。  &lt;br/&gt;mx表示0或1。  &lt;br/&gt;nx表示0～6中之任一整數。  &lt;br/&gt;R&lt;sup&gt;1x&lt;/sup&gt;表示1價取代基。  &lt;br/&gt;R&lt;sup&gt;2x&lt;/sup&gt;表示氫原子或1價取代基。]  &lt;br/&gt;&lt;img align="absmiddle" height="85px" width="208px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(B)中，  &lt;br/&gt;R&lt;sup&gt;b1&lt;/sup&gt;、R&lt;sup&gt;b2&lt;/sup&gt;、R&lt;sup&gt;b3&lt;/sup&gt;及R&lt;sup&gt;b4&lt;/sup&gt;分別獨立地表示1價烴基。  &lt;br/&gt;X&lt;sup&gt;-&lt;/sup&gt;表示鹵化物離子。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2042" publication-number="202633316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機</chinese-title>
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P70/00</main-classification>
        <further-classification edition="202601120260424B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt;  本發明的用於測試電子元件的處理機具有供應或回收遮蔽蓋的供應回收機構或清掃機構，該遮蔽蓋用於讓電子元件隔絕於運轉程序中產生的異物，該清掃機構則在測試台裝載電子元件之前清掃測試台的上表面。&lt;br/&gt;  適用本發明的話，異物所導致的測試錯誤減少而能夠確保測試的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:遮蔽蓋</p>
        <p type="p">11:修理墊</p>
        <p type="p">12:遮蔽支撐座</p>
        <p type="p">12a:上表面部</p>
        <p type="p">12b:側面部</p>
        <p type="p">300:測試台</p>
        <p type="p">aj:貼合檻</p>
        <p type="p">IS:遮蔽空間</p>
        <p type="p">sj:定位檻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2043" publication-number="202632770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池包</chinese-title>
        <english-title>BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01M10/48</main-classification>
        <further-classification edition="201401120260504B">H01M10/613</further-classification>
        <further-classification edition="201401120260504B">H01M10/615</further-classification>
        <further-classification edition="201401120260504B">H01M10/63</further-classification>
        <further-classification edition="201401120260504B">H01M10/643</further-classification>
        <further-classification edition="201401120260504B">H01M10/6556</further-classification>
        <further-classification edition="201401120260504B">H01M10/6567</further-classification>
        <further-classification edition="201401120260504B">H01M10/6568</further-classification>
        <further-classification edition="201401120260504B">H01M10/6571</further-classification>
        <further-classification edition="202101120260504B">H01M50/213</further-classification>
        <further-classification edition="202101120260504B">H01M50/262</further-classification>
        <further-classification edition="202101120260504B">H01M50/264</further-classification>
        <further-classification edition="202101120260504B">H01M50/271</further-classification>
        <further-classification edition="202101120260504B">H01M50/291</further-classification>
        <further-classification edition="202101120260504B">H01M50/505</further-classification>
        <further-classification edition="202101120260504B">H01M50/627</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>行競科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING MOBILITY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汲毓舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YU-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖資文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王騰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴尚智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHANG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊錦堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池包包含電池模組(3010)，電池模組(3010)包含形成為管狀結構之限液殼體(0080)及至少一電池座(0050)。限液殼體(0080)具有從內壁面(0101)突出之電池座止擋結構(0140)，以限制電池座(0050)之垂直移動。限液殼體(0080)另包含電池座固定結構(0150)以透過緊固件(0152)結構性限制在每一方向之位移，藉以確保電池座(0050)及電池單元(0020)可全方位穩固地保持在浸沒環境內。內壁面(0101)可形成為順應電池單元(0020)之曲面，以縮減模組體積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack includes a battery module (3010) comprising a liquid-limiting casing (0080) configured as a tubing structure and at least one cell holder (0050). The liquid-limiting casing (0080) features a cell-holder stopping structure (0140) protruding from an inner wall surface (0101) to restrict vertical movement of the cell holder (0050). The liquid-limiting casing (0080) further comprises a cell-holder fixing structure (0150) that is configured to mechanically limit displacement in every direction via a fixing fastener (0152). This combination ensures robust, omni-directional retention of the cell holder (0050) and the plurality of battery cells (0020) within the immersion environment. Inner wall surfaces (0101) may be formed as curved surfaces conforming to the battery cells (0020) to reduce module volume.</p>
      </isu-abst>
      <representative-img>
        <p type="p">0080:限液殼體</p>
        <p type="p">0090:周邊壁</p>
        <p type="p">0101:內壁面</p>
        <p type="p">0150:電池座固定結構</p>
        <p type="p">0151:緊固件孔</p>
        <p type="p">W&lt;sub&gt;2&lt;/sub&gt;:常數距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2044" publication-number="202633490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子器件及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND A METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/20</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林㲽燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, INSEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹主欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JUHEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種電子器件和其形成方法。所述電子器件包括：第一襯底；安裝在所述第一襯底上的多個電子元件；多組導電結構，其中，每一組導電結構形成於所述多個電子元件中的一個電子元件上並與所述一個電子元件電連接，使得所述多組導電結構的相應多個頂部表面彼此齊平；以及第二襯底，其具有形成於其上的多組導電墊，其中每一組導電墊經由一組焊料凸塊安裝在所述多組導電結構中的一組導電結構上，使得所述第二襯底安裝在所述第一襯底上並經由所述多個電子元件、所述多組導電結構和所述多組導電墊與所述第一襯底電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一襯底</p>
        <p type="p">102:第一襯底101上的導電墊</p>
        <p type="p">110:電子元件</p>
        <p type="p">111:端子</p>
        <p type="p">120:導電結構</p>
        <p type="p">140:包封材料</p>
        <p type="p">141:額外包封材料</p>
        <p type="p">142:包封層</p>
        <p type="p">150:第二襯底</p>
        <p type="p">151:第二襯底150上的導電墊</p>
        <p type="p">152:焊料凸塊</p>
        <p type="p">153:額外焊料凸塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2045" publication-number="202632394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02F1/1333</main-classification>
        <further-classification edition="202301120260504B">H10K59/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴政圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴慶在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNGJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴根昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GEUNCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板可包括非彎曲區域及彎曲區域。該彎曲區域包含：第一彎曲區域，對應至非彎曲區域的一側部；第二彎曲區域，對應至非彎曲區域的轉角；以及金屬板，設置在顯示面板下方。該金屬板包含：第一部分，對應至非彎曲區域；以及第二部分，對應至彎曲區域。該金屬板的第二部分包含：第一子區域，對應至第一彎曲區域；以及第二子區域，對應至第二彎曲區域，且該金屬板的第二部分包含邊緣部。該邊緣部包含：第一邊緣部，設在第一子區域中；以及複數個第二邊緣部，設在第二子區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel can include a non-bending area and a bending area. The bending area includes a first bending area corresponding to a lateral portion of the non-bending area and a second bending area corresponding to a corner portion of the non-bending area, and a metal plate disposed below the display panel. The metal plate includes a first part corresponding to the non-bending area and a second part corresponding to the bending area. The second part of the metal plate includes a first sub-area corresponding to the first bending area and a second sub-area corresponding to the second bending area, and the second part of the metal plate includes a rim portion. The rim portion includes a first rim portion disposed in the first sub-area and a plurality of second rim portions disposed in the second sub-area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:金屬板</p>
        <p type="p">151:第一部分</p>
        <p type="p">152:第二部分</p>
        <p type="p">152a:第一子區域</p>
        <p type="p">152b:第二子區域</p>
        <p type="p">153:第一開口部</p>
        <p type="p">154:第二開口部</p>
        <p type="p">155:連接部</p>
        <p type="p">155a:第一子連接部</p>
        <p type="p">155b:第二子連接部</p>
        <p type="p">156:第一邊緣部</p>
        <p type="p">157:第二邊緣部</p>
        <p type="p">158:邊緣部</p>
        <p type="p">BA1:第一彎曲區域</p>
        <p type="p">BA2:第二彎曲區域</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">NBA:非彎曲區域</p>
        <p type="p">Y:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2046" publication-number="202631107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油性化妝料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K8/39</main-classification>
        <further-classification edition="200601120260504B">A61K8/894</further-classification>
        <further-classification edition="200601120260504B">A61K8/31</further-classification>
        <further-classification edition="200601120260504B">A61K8/92</further-classification>
        <further-classification edition="200601120260504B">A61K8/34</further-classification>
        <further-classification edition="200601120260504B">A61K8/63</further-classification>
        <further-classification edition="200601120260504B">A61K8/19</further-classification>
        <further-classification edition="200601120260504B">A61K8/29</further-classification>
        <further-classification edition="200601120260504B">A61Q1/00</further-classification>
        <further-classification edition="200601120260504B">A61Q1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高絲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大森宮田千秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMORI MIYATA, CHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種抗暈染性、緊實感（彈性）、耐摩擦性（持妝性）、保濕感持續性優異之油性化妝料。本發明係一種油性化妝料，其係含有下述成分（A）～（D）：（A）25℃下為液狀的非揮發性油劑、（B）25℃下為半固體狀的油劑、（C）油性凝膠化劑、（D）具有特定嵌段結構之聚有機矽氧烷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2047" publication-number="202633330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金英洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁青煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, CHEONG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基板處理裝置，更詳細地說，涉及針對於基板執行預清潔的基板處理裝置。本發明公開了一種基板處理裝置，包括：製程腔室(100)，包括腔室主體(110)與上部蓋部(120)，所述腔室主體(110)為形成內部空間(S1)並且在上側形成開口部(111)，所述上部蓋部(120)為設置在所述腔室主體(110)上以覆蓋所述開口部(111)並且從外部導入製程氣體；支撐框架(200)，中心被上下方向貫通，並且設置在所述開口部(111)；內襯部(300)，設置在所述支撐框架(200)的內面(201)以在內側定義處理空間(S2)，並且向所述處理空間(S2)噴射透過所述上部蓋部(120)導入的製程氣體；基板支撐部(400)，在上面支撐處理的基板(1)，並且設置成可進行上下移動，以在處理基板時使所述基板(1)位於所述處理空間(S2)內；遠程電漿發生部(700)，配置在所述上部蓋部(120)上，將所述製程氣體電漿化來供應至所述處理空間(S2)；其中，所述內襯部(300)為，用非金屬形成，以防止透過所述遠程電漿發生部(700)自由基化的所述製程氣體被消散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">100:製程腔室</p>
        <p type="p">110:腔室主體</p>
        <p type="p">111:開口部</p>
        <p type="p">112:階梯部</p>
        <p type="p">112a:第一臺階部</p>
        <p type="p">112b:第二臺階部</p>
        <p type="p">119:閘門</p>
        <p type="p">120:上部蓋部</p>
        <p type="p">121:上部蓋</p>
        <p type="p">122:氣體導入部</p>
        <p type="p">130:排氣部</p>
        <p type="p">131:排氣槽</p>
        <p type="p">132:排氣口</p>
        <p type="p">200:支撐框架</p>
        <p type="p">201:內面</p>
        <p type="p">202:內襯支撐部</p>
        <p type="p">210:凸緣部</p>
        <p type="p">220:延伸部</p>
        <p type="p">300:內襯部</p>
        <p type="p">310:內襯</p>
        <p type="p">320:噴射板</p>
        <p type="p">321:噴射口</p>
        <p type="p">330:上部內襯</p>
        <p type="p">400:基板支撐部</p>
        <p type="p">410:支撐板</p>
        <p type="p">420:支撐軸</p>
        <p type="p">500:外部排氣裝置</p>
        <p type="p">600:上下驅動部</p>
        <p type="p">700:遠程電漿產生單元</p>
        <p type="p">S1:內部空間</p>
        <p type="p">S2:處理空間</p>
        <p type="p">S3:排氣流路</p>
        <p type="p">S4:擴散空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2048" publication-number="202632066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/54</main-classification>
        <further-classification edition="200601120260302B">C23C14/56</further-classification>
        <further-classification edition="202601120260302B">H10P14/22</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
        <further-classification edition="200601120260302B">B08B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋旻哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, MIN CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李致榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河致旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, CHI WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金太植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基板處理裝置及基板處理方法，更詳細地說，涉及針對於基板執行沉積的基板處理裝置及基板處理方法。本發明公開了一種基板處理裝置，包括：製程腔室(100)，形成內部空間，在側面形成第一排氣孔(101)與排放部(102)，所述第一排氣孔(101)與真空泵連接，所述排放部(102)連接於形成在所述內部空間內側面的貫通孔(103)以連通所述內部空間與所述第一排氣孔(101)；腔室內襯部(200)，設置在所述製程腔室(100)內面，在內部形成處理基板的處理空間(S)，並且形成有排放流路，所述排放流路與所述排放部(102)連通，以向外部排放向所述處理空間(S)內部噴射的製程氣體；排氣內襯部(300)，可拆卸地設置在所述排放部(102)內面，並且形成排氣流路(S3)，所述排氣流路(S3)用於通過所述第一排氣孔(101)排放通過所述排放流路傳遞的排放氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程腔室</p>
        <p type="p">101:第一排氣孔</p>
        <p type="p">102:排放部</p>
        <p type="p">103:貫通孔</p>
        <p type="p">109:閘門</p>
        <p type="p">110:腔室主體</p>
        <p type="p">120:上部蓋</p>
        <p type="p">130:蓋部</p>
        <p type="p">200:腔室內襯部</p>
        <p type="p">210:上端內襯部</p>
        <p type="p">220:下端內襯部</p>
        <p type="p">222:連通孔</p>
        <p type="p">223:貫通口</p>
        <p type="p">300:排氣內襯部</p>
        <p type="p">301:第一排氣內襯貫通孔</p>
        <p type="p">400:氣體噴射部</p>
        <p type="p">500:基板支撐部</p>
        <p type="p">600:連接內襯部</p>
        <p type="p">700:下部內襯</p>
        <p type="p">S:處理空間</p>
        <p type="p">S3:排氣流路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2049" publication-number="202632594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發電廠、通訊網路以及在發電廠中通訊的方法</chinese-title>
        <english-title>POWER PLANT, COMMUNICATION NETWORK, AND METHOD FOR COMMUNICATING IN POWER PLANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260423B">G06Q50/06</main-classification>
        <further-classification edition="201801120260423B">H04W4/021</further-classification>
        <further-classification edition="202201120260423B">H04L69/40</further-classification>
        <further-classification edition="202601120260423B">H02J3/36</further-classification>
        <further-classification edition="200601120260423B">H02J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富安能源有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUENCE ENERGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫塔波圖拉　巴拉克里沙姆拉朱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTAPOTHULA, BALAKRISHANMRAJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種發電廠，其具有複數個DC電池組能量儲存系統（battery energy storage system，BESS）模組，其中各BESS模組具有一雙重附接節點（dually attached node，DAN）；一發電廠控制器；以及一通訊網路。該通訊網路連結於該複數個BESS模組與該發電廠控制器之間。該通訊網路包括一冗餘區域網路（local area network，LAN），其配置有一第一LAN及一第二LAN。該複數個BESS模組中的各者的該DAN經由第一LAN及經由該第二LAN與該發電廠控制器通訊。該通訊網路執行一並行冗餘協定（parallel redundancy protocol，PRP），以經由該第一及第二LAN以及該DAN來實現該發電廠控制器與該複數個BESS模組之間的通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power plant having a plurality of DC battery energy storage system (BESS) modules is disclosed, with each BESS module having a dually attached node (DAN) ; a plant controller; and a communication network. The communication network is linked between the plurality of BESS modules and the plant controller. The communication network includes a redundant local area network (LAN) arranged with a first LAN and a second LAN. The DAN of each of the plurality of BESS modules is in communication with the plant controller via the first LAN and via the second LAN. The communication network executes a parallel redundancy protocol (PRP) to effect communication between the plant controller and the plurality of BESS modules via the first and second LANs and the DAN.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發電廠</p>
        <p type="p">110:BESS模組</p>
        <p type="p">120:BESS外殼</p>
        <p type="p">122:電池組架</p>
        <p type="p">124:電池組包裝</p>
        <p type="p">126:電池組模組</p>
        <p type="p">128:電池組</p>
        <p type="p">130:電力轉換系統</p>
        <p type="p">140:熱管理系統</p>
        <p type="p">150:發電廠控制器</p>
        <p type="p">160:外部電源</p>
        <p type="p">170:電網</p>
        <p type="p">180:輔助電力系統</p>
        <p type="p">190:變電所控制器</p>
        <p type="p">200:外部監督及資料獲取(SCADA)系統</p>
        <p type="p">300:通訊網路</p>
        <p type="p">AC:交流電</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2050" publication-number="202631965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具垂直配向之鐵電性聚合物網狀液晶</chinese-title>
        <english-title>FERROELECTRIC POLYMER NETWORK LIQUID CRYSTAL WITH VERTICAL ALIGNMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K19/54</main-classification>
        <further-classification edition="200601120260504B">G02F1/137</further-classification>
        <further-classification edition="200601120260504B">G02F1/141</further-classification>
        <further-classification edition="200601120260504B">G02F1/361</further-classification>
        <further-classification edition="202301120260504B">H10N30/857</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛特　羅可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTTE, ROCCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科狄　索斯頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODEK, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜賓　瑞秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUFFIN, RACHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦寇力　雷明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVAKOLI, RAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明呈現具有鐵電性液晶相之聚合物網路穩定性液晶材料(PN-LC)。主張使展現鐵電性向列或鐵電性層列A液晶相之液晶混合物以極性垂直狀態相對於邊界表面進行配向之方法。該液晶混合物由相對於包封該等混合物之基板平面呈垂直配向之聚合物網路穩定。另外，本發明係關於含有本發明之經極化及配向鐵電性液晶材料之電氣及電子元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymer network stabilised liquid crystal material (PN-LCs) having a ferroelectric liquid crystal phase is presented. Claimed is a process of aligning liquid crystal mixtures exhibiting a ferroelectric nematic or ferroelectric smectic A liquid-crystalline phase in a polar vertical state in relation to a boundary surface. The liquid crystal mixture is stabilized by a polymer network in a vertical alignment relative to the substrate planes enclosing the mixtures. In addition, the present invention relates to electric and electronic elements which contain the poled and aligned ferroelectric liquid crystal material according to the invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2051" publication-number="202631885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有非平面幾何及低滯後性之熱塑性聚胺甲酸酯</chinese-title>
        <english-title>THERMOPLASTIC POLYURETHANE HAVING A NON-FLAT GEOMETRY AND LOW HYSTERESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260502B">C08L75/04</main-classification>
        <further-classification edition="200601120260502B">C08G18/06</further-classification>
        <further-classification edition="200601120260502B">C08G18/48</further-classification>
        <further-classification edition="200601120260502B">C08G18/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商盧伯利索先進材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBRIZOL ADVANCED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉甘尼維努　雷利斯巴爾加瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURAGANI VENU, LALITH BHARGAVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡托席克　小約瑟夫Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VONTORCIK, JOSEPH J., JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有非平面幾何之物品，其中該非平面幾何可係由具有低tan δ、高回彈之熱塑性聚胺甲酸酯形成的球體或半球體，且其中該物品展示出低滯後性。物品可用於諸如網球之應用中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an article having a non-flat geometry, wherein the non-flat geometry can be a sphere or hemisphere formed from a thermoplastic polyurethane having a low tan delta a high rebound and wherein the article demonstrates low hysteresis. The article may be useful in applications such as tennis balls.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2052" publication-number="202631718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物、膜形成方法、平坦化膜形成方法及物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08F2/44</main-classification>
        <further-classification edition="200601120260422B">C08F2/50</further-classification>
        <further-classification edition="200601120260422B">C08F20/10</further-classification>
        <further-classification edition="200601120260422B">C08L33/04</further-classification>
        <further-classification edition="200601120260422B">C08K5/5397</further-classification>
        <further-classification edition="200601120260422B">C08J5/18</further-classification>
        <further-classification edition="201401120260422B">C09D11/101</further-classification>
        <further-classification edition="201401120260422B">C09D11/30</further-classification>
        <further-classification edition="200601120260422B">B29C59/02</further-classification>
        <further-classification edition="200601120260422B">G03F7/00</further-classification>
        <further-classification edition="200601120260422B">G03F7/004</further-classification>
        <further-classification edition="200601120260422B">G03F7/027</further-classification>
        <further-classification edition="200601120260422B">G03F7/16</further-classification>
        <further-classification edition="200601120260422B">B41M1/06</further-classification>
        <further-classification edition="200601120260422B">B41M5/00</further-classification>
        <further-classification edition="202601120260422B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤俊樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城野潤平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRONO, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清原直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOHARA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種硬化性組成物，其特徵為包含：聚合性化合物、光聚合起始劑、及溶劑，其中前述聚合性化合物至少包含具有芳香族構造、芳香族雜環構造或脂環式構造之化合物，前述硬化性組成物在23℃中具有2mPa･s以上60mPa･s以下之黏度，前述硬化性組成物在去除前述溶劑之狀態下，在23℃中具有30mPa･s以上10,000mPa･s以下之黏度，相對於前述硬化性組成物全體，前述溶劑之含量為70體積%以上95體積%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">104:液膜</p>
        <p type="p">105:溶劑(d)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2053" publication-number="202631196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149471</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調節宿主細胞表面與　ＳＡＲＳ－ＣＯＶ－２　交互作用之方法</chinese-title>
        <english-title>METHODS FOR MODULATING HOST CELL SURFACE INTERACTIONS WITH SARS-COV-2</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">A61K31/713</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P31/14</further-classification>
        <further-classification edition="200601120260504B">G01N33/68</further-classification>
        <further-classification edition="200601120260504B">G01N33/569</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁尼茲　馬丁　納迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ-MARTIN, NADIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中所提供者為治療或預防 SARS-CoV-2 感染之方法，其包含調節 SARS-CoV-2 棘蛋白與細胞質膜表現的宿主細胞蛋白之間的交互作用，以及鑑定此等交互作用的調節劑之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of treating or preventing SARS-CoV-2 infection comprising modulating interactions between the SARS-CoV-2 spike protein and plasma membrane-expressed host cell proteins, as well as methods of identifying modulators of such interactions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2054" publication-number="202633349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板移送裝置及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P72/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彩黙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHAEMOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳守冠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SUKWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴炳柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BYUNGJOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池珉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, MINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炫植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYUNSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及基板移送裝置及方法，本發明一方面的基板移送裝置包括：下部載物台，支撐基板的下部面，以向上方移動；以及上部載物台，對藉由下部載物台來向上方移動的基板的上部面進行吸附，並進行翻轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a substrate transfer apparatus and method, and the substrate transfer apparatus according to one aspect of the present invention includes a lower stage that supports a lower surface of a substrate and moves the substrate upward, and an upper stage that suctions an upper surface of the substrate moved upward by the lower stage and inverts the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">1000:基板移送裝置</p>
        <p type="p">100:主框架</p>
        <p type="p">200:下部載物台</p>
        <p type="p">300:上部載物台</p>
        <p type="p">310:支撐框架</p>
        <p type="p">320:旋轉框架</p>
        <p type="p">330:驅動機構</p>
        <p type="p">340:吸附墊</p>
        <p type="p">400:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2055" publication-number="202632050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化矽塗佈膜、成形品、填充有含乳化劑的油脂組成物的填充品及填充品的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C23C16/40</main-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="200601120260504B">C23C16/50</further-classification>
        <further-classification edition="200601120260504B">B32B9/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/36</further-classification>
        <further-classification edition="200601120260504B">B65D23/02</further-classification>
        <further-classification edition="200601120260504B">B65D65/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日清奧利友集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE NISSHIN OILLIO GROUP, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>目時潤也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METOKI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村野賢博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURANO, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即使對於含乳化劑的油脂組成物而言疏油性亦良好及/或除油性亦良好的氧化矽塗佈膜、成形品。具體而言，本發明提供一種氧化矽塗佈膜，供於與含乳化劑的油脂組成物接觸的用途，所述氧化矽塗佈膜中，所述氧化矽塗佈膜的表面的20℃下的表面自由能（γ）為27 mJ/m&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2056" publication-number="202633449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高電流密度積體電路之先進封裝及熱解決方案設計</chinese-title>
        <english-title>ADVANCED PACKAGING AND THERMAL SOLUTION DESIGNS FOR HIGH CURRENT DENSITY INTEGRATED CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10W40/47</main-classification>
        <further-classification edition="202601120260429B">H10W40/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　羅恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡雷米　蘿拉　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRKARIMI, LAURA WILLS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房　炅模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, KYONG-MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含整合式冷卻組裝件之裝置封裝件。該裝置封裝件可包含多個半導體裝置及附接至這些半導體裝置中之一或多者的一或多個冷板。舉例而言，該裝置封裝件可包含第一半導體裝置、第二半導體裝置及第三半導體裝置，其中該第二半導體裝置安置成在第一方向上鄰近於該第一半導體裝置，且該第三半導體裝置安置成在該第一方向上鄰近於該第二半導體裝置。該裝置封裝件亦可包含附接至該第二半導體裝置之冷板，其中該冷板包含沿著垂直於該第一方向之第二方向延伸的複數個冷卻劑通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device package comprising an integrated cooling assembly. The device package may comprise multiple semiconductor devices and one or more cold plates attached to one or more of the semiconductor devices. For example, the device package may comprise a first semiconductor device, a second semiconductor device, and a third semiconductor device, wherein the second semiconductor device is disposed adjacent to the first semiconductor device in a first direction and the third semiconductor device is disposed adjacent to the second semiconductor device in the first direction. The device package may also comprise a cold plate attached to the second semiconductor device, wherein the cold plate comprises a plurality of coolant channels that extend along a second direction perpendicular to the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">701:裝置封裝件</p>
        <p type="p">702:第一半導體裝置，半導體裝置</p>
        <p type="p">704a:額外半導體裝置</p>
        <p type="p">704b:額外半導體裝置，第一額外半導體裝置</p>
        <p type="p">704c:額外半導體裝置</p>
        <p type="p">704d:額外半導體裝置</p>
        <p type="p">704e:額外半導體裝置，第二額外半導體裝置</p>
        <p type="p">704f:額外半導體裝置</p>
        <p type="p">706:第一出口</p>
        <p type="p">708:第二出口</p>
        <p type="p">710a:冷卻劑通道</p>
        <p type="p">710b:冷卻劑通道</p>
        <p type="p">710c:冷卻劑通道</p>
        <p type="p">710d:冷卻劑通道</p>
        <p type="p">710e:冷卻劑通道</p>
        <p type="p">710f:冷卻劑通道</p>
        <p type="p">710g:冷卻劑通道</p>
        <p type="p">712:第一入口</p>
        <p type="p">714a:冷卻劑通道</p>
        <p type="p">714b:冷卻劑通道</p>
        <p type="p">714c:冷卻劑通道</p>
        <p type="p">714d:冷卻劑通道</p>
        <p type="p">714e:冷卻劑通道</p>
        <p type="p">714f:冷卻劑通道</p>
        <p type="p">714g:冷卻劑通道</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2057" publication-number="202633373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經組態以用於接收物件以進行高溫處理之製品以及製造該製品之方法</chinese-title>
        <english-title>AN ARTICLE CONFIGURED FOR RECEIVING AN OBJECT FOR HIGH TEMPERATURE PROCESSING AND A METHOD OF MANUFACTURING SAID ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P72/70</main-classification>
        <further-classification edition="201701120260428B">C01B32/956</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商昱博精密陶瓷有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUNK XYCARB TECHNOLOGY B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆伍德　貝尼托　凱莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMWOOD BENITO, KELLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　史崔恩　布萊斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN STRIEN, BRYCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　約翰娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, JOHANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博倫斯　史雅克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEULENS, SJAAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　明斯特　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN MUNSTER, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容係關於一種製品以及製造該製品之方法。該製品經組態以用於接收一物件以進行熱處理，較佳地該物件為一半導體晶圓，其中該製品包含一多孔結構，該多孔結構具有對應於一纖維材料之一內部配置，該製品材料為碳化矽(SiC)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure pertains to article and a method of manufacturing said article. The article is configured for receiving an object for thermal processing, preferably said object being a semiconductor wafer, wherein the article comprises a porous structure having an internal arrangement corresponding to a fibrous material, said article material being silicon carbide (SiC).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2058" publication-number="202632505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體模組及運算快速連結（ＣＸＬ）裝置</chinese-title>
        <english-title>MEMORY MODULE AND COMPUTE EXPRESS LINK (CXL) DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260423B">G06F12/0831</main-classification>
        <further-classification edition="200601120260423B">G06F13/18</further-classification>
        <further-classification edition="200601120260423B">G11C29/04</further-classification>
        <further-classification edition="202201120260423B">H04L49/113</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金慶山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋致勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CHIHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴星柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGJOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇鎭麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SO, JININ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋在仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JAE-IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋澤相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAEKSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙正顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JEONGHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體模組包括：一記憶體裝置，其包括一記憶體胞元陣列，該記憶體胞元陣列包括其中包括一故障胞元之一故障區塊及用於替換該故障區塊之一重映射區塊；以及一控制器，其通過一運算快速連結(CXL)介面與一主機裝置通訊且控制該記憶體裝置。該控制器可將包括一故障旗標及對應於該重映射區塊之一重映射位址的恢復資訊冗餘地儲存於該記憶體裝置中，可基於接收到一第一請求而自該記憶體裝置讀取對應於一目標位址之資料，可基於對應於該目標位址之該資料而識別該目標位址是否為故障位址，且可在判定該目標位址為該故障位址時基於對應於該目標位址之該資料而生成包括該重映射位址之一第二請求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory module includes a memory device that includes a memory cell array including a fault block in which a fault cell is included and a remap block for replacing the fault block, and a controller that communicates with a host device through a compute express link (CXL) interface and to control the memory device. The controller may redundantly store recovery information including a fault flag and a remap address corresponding to the remap block in the memory device, may read data corresponding to a target address from the memory device, based on receiving a first request, may identify whether the target address is the fault address, based on the data corresponding to the target address, and may generate a second request including the remap address based on the data corresponding to the target address, when it is determined that the target address is the fault address.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:記憶體模組</p>
        <p type="p">100:控制器</p>
        <p type="p">110:修復引擎</p>
        <p type="p">120:非依電性記憶體</p>
        <p type="p">200:記憶體裝置</p>
        <p type="p">210:記憶體胞元陣列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2059" publication-number="202632115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於錨固海底電纜及／或電纜穩定及／或保護系統的螺旋樁</chinese-title>
        <english-title>A SCREW-PILE FOR ANCHORING SUBSEA CABLES AND/OR CABLE STABILIZING AND/OR PROTECTION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">E02D5/56</main-classification>
        <further-classification edition="200601120260504B">H02G9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦　安德烈亞森　亨里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG-ANDREASEN, HENRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦　安德烈亞森　亨里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG-ANDREASEN, HENRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文獻係關於一種用於錨固一海底電纜(400)之一系統(200)之螺旋樁(100)。該螺旋樁(100)包括用於鑽鑿穿過海床及/或沖刷保護裝置(500)之一鑽頭端(110)、一間隔件(120)及一螺紋鑽孔桿區段(130)。該螺旋樁(100)進一步包括一短裸鑽孔桿(140)及經調適以與該系統(200)之一螺紋通孔(211)互鎖之一上螺紋端(150)。本文獻進一步係關於一種用於將該螺旋樁(100)打入至沖刷保護裝置及/或海床(500)中之方法及此螺旋樁(100)之使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This document relates to a screw-pile (100) for a system (200) of anchoring of a subsea cable (400). The screw-pile (100) comprises a drill-bit end (110) for drilling thru a seabed and/or scour protection (500), a spacer (120), and a threaded bore rod section (130). The screw pile (100) further comprises a short bare bore rod (140), and an upper threaded end (150) adapted to interlock with a threaded thorough hole (211) of the system (200). The document further relates to a method for driving the screw-pile (100) into the scour protection and/or seabed (500) and the use of such screw-pile (100).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:螺旋樁/樁元件</p>
        <p type="p">110:鑽頭端</p>
        <p type="p">120:間隔件</p>
        <p type="p">130:螺紋部分或螺紋鑽孔桿區段</p>
        <p type="p">131:螺紋圓錐區段</p>
        <p type="p">132:螺紋圓柱區段</p>
        <p type="p">140:短裸鑽孔桿</p>
        <p type="p">150:上螺紋端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2060" publication-number="202631447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車後鏈輪總成</chinese-title>
        <english-title>BICYCLE REAR SPROCKET ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B62M9/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福森毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMORI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, TOMONARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種自行車後鏈輪總成，其包括一第一鏈輪及一第二鏈輪。該第一鏈輪包含圍繞一第一鏈輪開口安置之一第一扭矩傳輸輪廓。該第二鏈輪包含圍繞一第二鏈輪開口安置之一第二扭矩傳輸輪廓。該第一扭矩傳輸輪廓經構形以在安裝狀態中與該第二扭矩傳輸輪廓嚙合。該第一鏈輪包含一軸向鄰接表面，其經構形以在該安裝狀態中軸向抵靠該第二鏈輪以用於使該第一鏈輪及該第二鏈輪相對於彼此軸向定位。該軸向鄰接表面經安置而在該安裝狀態中比該第一扭矩傳輸輪廓更遠離自行車後輪轂總成之一軸向中心平面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle rear sprocket assembly comprises a first sprocket and a second sprocket. The first sprocket includes a first torque-transmitting profile disposed around a first sprocket opening. The second sprocket includes a second torque-transmitting profile disposed around a second sprocket opening. The first torque-transmitting profile is configured to engage with the second torque-transmitting profile in the mounted state. The first sprocket includes an axial abutment surface configured to axially abut against the second sprocket for axially positioning the first sprocket and the second sprocket relative to each other in the mounted state. The axial abutment surface is disposed farther from an axial center plane of the bicycle rear hub assembly than the first torque-transmitting profile in the mounted state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鏈輪支撐主體</p>
        <p type="p">6:輪轂扭矩傳輸輪廓</p>
        <p type="p">6A:輪轂扭矩傳輸花鍵齒</p>
        <p type="p">6B:軸向齒端</p>
        <p type="p">7:第一外部花鍵齒</p>
        <p type="p">7A:第一齒部分</p>
        <p type="p">7B:第二齒部分</p>
        <p type="p">10:自行車後鏈輪總成</p>
        <p type="p">13:鎖定環</p>
        <p type="p">24:第一面向輪轂中心側</p>
        <p type="p">26:第一遠離輪轂中心側</p>
        <p type="p">34:第二面向輪轂中心側</p>
        <p type="p">36:第二遠離輪轂中心側</p>
        <p type="p">40:第一扭矩傳輸輪廓</p>
        <p type="p">40A:第一軸向端</p>
        <p type="p">40B:第一額外軸向端</p>
        <p type="p">42:第一扭矩傳輸花鍵齒</p>
        <p type="p">50:第二扭矩傳輸輪廓</p>
        <p type="p">50A:第二軸向端</p>
        <p type="p">52:第二扭矩傳輸花鍵齒</p>
        <p type="p">62:額外軸向鄰接表面</p>
        <p type="p">64:凹部</p>
        <p type="p">A1:旋轉中心軸</p>
        <p type="p">CP:軸向中心平面</p>
        <p type="p">D3:軸向方向</p>
        <p type="p">DM11:第一內部花鍵小徑</p>
        <p type="p">DM12:第一內部花鍵大徑</p>
        <p type="p">DM22:第二內部花鍵大徑</p>
        <p type="p">DM51:外部花鍵小徑</p>
        <p type="p">DM52:外部花鍵大徑</p>
        <p type="p">DM53:額外外部花鍵大徑</p>
        <p type="p">L1:第一軸向花鍵長度</p>
        <p type="p">L2:軸向花鍵長度</p>
        <p type="p">SP1:第一鏈輪</p>
        <p type="p">SP1A:第一鏈輪主體</p>
        <p type="p">SP1B:第一鏈輪齒</p>
        <p type="p">SP1C:第一鏈輪開口</p>
        <p type="p">SP2:第二鏈輪</p>
        <p type="p">SP2A:第二鏈輪主體</p>
        <p type="p">SP2B:第二鏈輪齒</p>
        <p type="p">SP2C:第二鏈輪開口</p>
        <p type="p">SP2P:鏈輪軸向中心平面</p>
        <p type="p">SP3:第三鏈輪</p>
        <p type="p">SP4:第四鏈輪</p>
        <p type="p">W2:最大軸向寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2061" publication-number="202631060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層布料及被覆用品</chinese-title>
        <english-title>MULTILAYER FABRIC AND COVERING ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">A47G9/02</main-classification>
        <further-classification edition="200601120260425B">B32B5/26</further-classification>
        <further-classification edition="200601120260425B">B01J20/10</further-classification>
        <further-classification edition="201901120260425B">A41D31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＥＮＴＩＡＬ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENTIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川僚介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能解決夏季睡眠問題的多層布料及被覆用品。被褥1係以人體的例如頸部以下的至少一部分作為對象部，並使用覆蓋該對象部的多層布料，其具備：接觸前述對象部的內側針織布料層11；以及相對於該內側針織布料層11配置於與前述對象部相反側，用以吸收來自該對象部之濕氣的調溫棉絮層12。調溫棉絮層12具有棉絮本體121，以及設於該棉絮本體121至少一面上之濕氣吸收部122。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a multilayer fabric and a covering article capable of solving summer sleep problems. A quilt 1 aims to at least a part of a human body, for example a portion under the neck, as a target object, and uses a multilayer fabric covering the target object. An inner knit fabric layer 11 contacting the aforementioned target object, and a temperature-regulating batting layer 12 disposed on an opposite side of the target object relative to the inner knit fabric layer 11 for absorbing moisture from the target object are included. The temperature-regulating battinglayer12 has a batting body 121, and a moisture-absorbing portion 122 provided on at least one surface of the batting body 121.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:棉絮被</p>
        <p type="p">11:內側針織布層</p>
        <p type="p">12:調溫棉絮層</p>
        <p type="p">13:柔軟棉絮層</p>
        <p type="p">14:外側針織布料層</p>
        <p type="p">121:棉絮本體</p>
        <p type="p">122:濕氣吸收部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2062" publication-number="202631945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體用膜狀接著劑及其製造方法、接著劑帶及其製造方法、半導體裝置及其製造方法、以及塗液的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09J163/00</main-classification>
        <further-classification edition="200601120260504B">C09J171/12</further-classification>
        <further-classification edition="200601120260504B">C09J11/04</further-classification>
        <further-classification edition="200601120260504B">C09J11/06</further-classification>
        <further-classification edition="200601120260504B">C09J11/08</further-classification>
        <further-classification edition="201801120260504B">C09J7/10</further-classification>
        <further-classification edition="201801120260504B">C09J7/20</further-classification>
        <further-classification edition="202601120260504B">H10W72/00</further-classification>
        <further-classification edition="202601120260504B">H10W72/30</further-classification>
        <further-classification edition="202601120260504B">H10W74/10</further-classification>
        <further-classification edition="202601120260504B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤滉大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藪下諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUSHITA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大畠真輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHATA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種半導體用膜狀接著劑。所述半導體用膜狀接著劑含有：熱硬化性樹脂、熱塑性樹脂、導熱性填料、以及聚合物，所述聚合物具有主鏈以及與所述主鏈鍵結的側鏈且於主鏈及側鏈中的至少一者包含極性基。以半導體用膜狀接著劑的總量為基準，導熱性填料的含量為50質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜狀接著劑(半導體用膜狀接著劑)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2063" publication-number="202631935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放射線硬化性剝離劑組成物、硬化物及剝離襯墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260424B">C09J7/40</main-classification>
        <further-classification edition="200601120260424B">C08F2/50</further-classification>
        <further-classification edition="200601120260424B">C08G77/26</further-classification>
        <further-classification edition="200601120260424B">C08L83/08</further-classification>
        <further-classification edition="200601120260424B">C09D183/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川内宏紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明鑒於所述情況，目的在於提供一種放射線硬化性的剝離劑組成物，其與現有的具有含有含(甲基)丙烯醯基的自由基聚合性有機聚矽氧烷作為主成分的組成物的硬化物的剝離襯墊相比，在確保輕剝離性的同時具有對玻璃紙或感熱紙等基材的更高的基材密接性。一種剝離劑組成物，含有下述（A）成分、（B）成分及（C）成分，  &lt;br/&gt;（A）25℃下的黏度為50 mPa·s～2000 mPa·s、在一分子中具有一個以上的丙烯醯基的可具有雜原子的烴化合物的一種或兩種以上：50質量份～99.99質量份  &lt;br/&gt;（B）下述式（1）所表示的含(甲基)丙烯醯基的有機聚矽氧烷：0.01質量份～50質量份（其中，所述（A）成分與該（B）成分的合計為100質量份）  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="568px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;相互獨立地為經取代或未經取代的碳數1～11的一價烴基、碳數1～5的烷氧基、羥基、含羥基的有機基、含鹵素原子的有機基、或含(甲基)丙烯醯基的有機基，R&lt;sup&gt;1&lt;/sup&gt;中的至少一個為含(甲基)丙烯醯基的有機基，a為2以上的數，b為0以上的數，c為0以上的數，d為0以上的數，2≦a+b+c+d≦1,000，所述括號內所示的矽氧烷單元可無規地排列，亦可形成嵌段結構）、及  &lt;br/&gt;（C）自由基聚合起始劑：相對於所述（A）成分及（B）成分的合計100質量份而為0.1質量份～15質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2064" publication-number="202631860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂複合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">C08L1/02</main-classification>
        <further-classification edition="200601120260121B">C08J5/06</further-classification>
        <further-classification edition="200601120260121B">D01F6/16</further-classification>
        <further-classification edition="200601120260121B">C08F8/46</further-classification>
        <further-classification edition="200601120260121B">B32B27/32</further-classification>
        <further-classification edition="200601120260121B">B32B27/04</further-classification>
        <further-classification edition="200601120260121B">D21J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON PAPER INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角田惟緒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKUTA, IO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上里朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGARI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田雄二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, YUJIROH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂複合體，包含纖維素纖維與熱塑性樹脂，且滿足以下條件。條件：在200℃、剪切應變1%、角頻率628 rad/s～0.05 rad/s的範圍內測定出的損耗正切tanδ的角頻率628 rad/s～1 rad/s下的最大值為0.50～2.0</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2065" publication-number="202632292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改進熱控制的電子器件測試裝置用探針卡</chinese-title>
        <english-title>PROBE CARD FOR AN APPARATUS FOR TESTING ELECTRONIC DEVICES WITH IMPROVED THERMAL CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R1/06</main-classification>
        <further-classification edition="200601120260302B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商探針科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNOPROBE S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬吉歐尼　弗拉維歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGGIONI, FLAVIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種適於插入用於測試電子器件的裝置中的探針卡（20），所述探針卡（20）包括：容納多個接觸探針（13）的至少一個探針頭（11），每個接觸探針（13）具有適於抵靠在待測器件（15）的接觸墊（15A）上的至少一個第一端部（13A），以及適於抵靠在空間變換器（14）的面向待測器件（15）的第一面（FA）上形成的對應接觸墊上的第二端部（13B）；以及主機板（17），通過互連層（18）連接到空間變換器（14），互連層設有位於空間變換器（14）和主機板（17）之間的多個機械和電連接元件（18A）。適當地，探針卡（20）還包括微流體冷卻系統（30、40），其包括一個或多個微流體通道（34A、34B、44），設有相應的微流體通路（33A、33B、43），冷卻流體在其中迴圈，所述微流體通道（34A、34B、44）與空間變換器（14）熱接觸，以收集並耗散來自其的熱量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) by means of an interconnection layer (18) provided with a plurality of mechanical and electrical connection elements (18A) between the space transformer (14) and the main board (17). Suitably, the probe card (20) further comprises a microfluidic cooling system (30, 40) including one or more microfluidic channels (34A, 34B, 44) provided with respective microfluidic passages (33A, 33B, 43) in which a cooling fluid circulates, said microfluidic channels (34A, 34B, 44) being in thermal contact with the space transformer (14) to collect and dissipate heat therefrom.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:探針頭</p>
        <p type="p">12:容置元件</p>
        <p type="p">13:接觸探針</p>
        <p type="p">13A:接觸尖端</p>
        <p type="p">13B:接觸頭</p>
        <p type="p">14:空間變換器</p>
        <p type="p">15:待測器件</p>
        <p type="p">15A:接觸墊</p>
        <p type="p">16:半導體晶圓</p>
        <p type="p">17:主機板</p>
        <p type="p">18:介面層</p>
        <p type="p">18A:連接元件</p>
        <p type="p">19:有源器件</p>
        <p type="p">20:探針卡</p>
        <p type="p">30:微流體冷卻系統</p>
        <p type="p">33A、33B:微流體通路</p>
        <p type="p">34A、34B:微流體通道</p>
        <p type="p">FA:第一面</p>
        <p type="p">FB:第二面</p>
        <p type="p">PT1:無源熱功率</p>
        <p type="p">PT2:有源熱功率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2066" publication-number="202631819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物、樹脂組成物、樹脂薄膜、覆金屬積層板、電路基板、電子器件和電子設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G73/10</main-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="200601120260504B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤芳樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUTO, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供耐熱性優異、高頻傳輸特性優異的共聚物。實施方式的共聚物為包含含有2個以上的芳香環的第一結構和餘量結構的共聚物，所述第一結構為所述芳香環彼此通過單鍵或連接基團鍵合的結構，在所述餘量結構中，碳原子與氫原子之和相對於所述餘量結構的總質量的質量比例為77wt%以上，餘量結構中的所述碳原子相對於所述氫原子的質量比為6.5以上且12.5以下，第一結構相對於所述共聚物的總質量的質量比例為15wt%以上且85wt%以下，在連接基團中，直接介於所述芳香環彼此的鍵合的原子數為2以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2067" publication-number="202632422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓印設備、壓印方法、物品製造方法及程式</chinese-title>
        <english-title>IMPRINT APPARATUS, IMPRINT METHOD, ARTICLE MANUFACTURING METHOD, AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G03F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤有弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">壓印設備藉由使在基板的部分場域上的壓印材料與模具的圖案區域相互接觸並固化壓印材料來形成圖案。壓印設備包括配置為調整基板與模具之間的相對位置的調整器，以及配置為控制該調整器以便在該部分場域相對於該圖案區域在基板的內側方向上具有偏移的狀態下，使該壓印材料與該圖案區域相互接觸，且接著進行該圖案區域與該部分場域之間的對準的控制器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imprint apparatus forms a pattern by bringing an imprint material on a partial field of a substrate and a pattern region of a mold into contact with each other and curing the imprint material. The imprint apparatus includes an adjuster configured to adjust a relative position between the substrate and the mold, and a controller configured to control the adjuster so as to bring the imprint material and the pattern region into contact with each other in a state in which the partial field has an offset in an inside direction of the substrate with respect to the pattern region, and then perform alignment between the pattern region and the partial field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8a:圖案區域</p>
        <p type="p">10:基板</p>
        <p type="p">14:壓印材料</p>
        <p type="p">101:部分場域</p>
        <p type="p">110:邊緣</p>
        <p type="p">150:邊緣</p>
        <p type="p">A-B:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2068" publication-number="202631919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光液</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09G1/02</main-classification>
        <further-classification edition="200601120260504B">C09K3/14</further-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱一明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荊建芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, JIANFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ROBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪國豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUOHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余華海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUAHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡鑫元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, XINYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉天奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TIANQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種用於阻擋層平坦化的化學機械拋光液。該拋光液包含：研磨顆粒、唑類化合物，有機羧酸，雙氧水和水，其還包括一種苯磺酸類和/或苯磺酸鹽類表面活性劑。該拋光液解決了在拋光過程中低介電常數材料（BD）和超低介電常數材料（ULK）去除速率不易控制的問題，滿足阻擋層拋光製程中對各種材料的去除速率及去除速率選擇比的要求，實現了製程的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a chemical mechanical polishing slurry for Barrier CMP. The slurry comprises abrasive particles, azole compounds, organic carboxylic acids, hydrogen peroxide, and water, and further comprising benzenesulfonic acid and/or benzenesulfonate surfactants. This polishing slurry provides the capability to control removal rates of low-k (BD) and ultra-low (ULK) film, achieving the desired removal rates and removal rate selectivity of various films, and thereby, meeting Barrier CMP process requirements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2069" publication-number="202632956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149836</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動畫像編碼裝置、動畫像解碼裝置、動畫像編碼方法、動畫像解碼方法、及畫像傳送系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260504B">H04N19/59</main-classification>
        <further-classification edition="201401120260504B">H04N19/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤坂信太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKASAKA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>峯澤彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴇矢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKIYA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可將特徵圖予以有效率地進行編碼的動畫像編碼裝置。動畫像編碼裝置（11）係具備：特徵圖轉換部（112），係使用從畫像（T）提取的複數個特徵量，而選擇將其打包為一張特徵圖或複數張特徵圖；及編碼部（113），係針對所生成之特徵圖之中的一個特徵量，將特徵量縮小，且將顯示已縮小的元資訊進行編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:動畫像編碼裝置</p>
        <p type="p">111:特徵量提取部</p>
        <p type="p">112:特徵圖轉換部</p>
        <p type="p">113:編碼部</p>
        <p type="p">114:編碼部</p>
        <p type="p">115:記憶體</p>
        <p type="p">T:畫像</p>
        <p type="p">Te:編碼串流</p>
        <p type="p">Fe:編碼串流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2070" publication-number="202632504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149850</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快取記憶體層級選擇</chinese-title>
        <english-title>CACHE LEVEL SELECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">G06F12/0802</main-classification>
        <further-classification edition="200601120260504B">G06F9/22</further-classification>
        <further-classification edition="201801120260504B">G06F9/44</further-classification>
        <further-classification edition="200601120260504B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍斯奈爾　馬修詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORSNELL, MATTHEW JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯派爾　湯馬斯菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEIER, THOMAS PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克卡爾　薩利爾拉姆錢德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKERKAR, SALIL RAMCHANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含：快取記憶體控制電路系統，其用以將對應於由軟體提供資訊指示之一位址空間區域之一或多個經實體化快取線分配至包含複數個層級之快取記憶體之一快取記憶體階層，各經實體化快取線指定一預定值來作為經快取資料；及快取記憶體層級選擇電路系統，其用以基於由該軟體提供資訊指示之該位址空間區域之一大小而選擇該複數個層級之快取記憶體中該一或多個經實體化快取線待被分配至之至少一個目標層級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises cache control circuitry to allocate, to a cache hierarchy comprising a plurality of levels of cache, one or more materialised cache lines corresponding to a region of address space indicated by software-provided information, each materialised cache line specifying a predetermined value as cached data; and cache level selection circuitry to select, based on a size of the region of address space indicated by the software-provided information, at least one target level of the plurality of levels of cache to which the one or more materialised cache lines are to be allocated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:設備；CPU；快取代理</p>
        <p type="p">40:互連件</p>
        <p type="p">42:共用記憶體儲存器；記憶體儲存單元；主記憶體；記憶體</p>
        <p type="p">74:系統快取記憶體；監聽過濾器；系統級快取記憶體(SLC)；共用快取記憶體；監聽過濾器結構；快取記憶體；組合資料結構</p>
        <p type="p">160:處理器核心</p>
        <p type="p">162:層級1(L1)資料快取記憶體</p>
        <p type="p">164:層級2(L2)快取記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2071" publication-number="202633491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W72/20</main-classification>
        <further-classification edition="202201120260422B">B22F1/054</further-classification>
        <further-classification edition="200601120260422B">B22F7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今東孝之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAHIGASHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺川剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之電子機器(1)具備半導體基板(2)、晶片(3)、及凸塊(4)。晶片(3)之熱膨脹係數與半導體基板(2)不同。凸塊(4)將設置於半導體基板(2)及晶片(3)之對向之主面的連接焊墊(21、31)彼此連接。凸塊(4)具有多孔質金屬層(41)、及金屬膜(42、43)。金屬膜(42、43)設置於：設置於半導體基板(2)之連接焊墊(21)與多孔質金屬層(41)之間、及設置於晶片(3)之連接焊墊(31)與多孔質金屬層(41)之間中之至少任一者，且設置於多孔質金屬層(41)之側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子機器</p>
        <p type="p">2:半導體基板</p>
        <p type="p">3:晶片</p>
        <p type="p">4:凸塊</p>
        <p type="p">21:連接焊墊</p>
        <p type="p">22:驅動電路</p>
        <p type="p">31:連接焊墊</p>
        <p type="p">32:發光部</p>
        <p type="p">41:多孔質金屬層</p>
        <p type="p">42:金屬膜</p>
        <p type="p">321:發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2072" publication-number="202631098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸收性物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">A61F13/49</main-classification>
        <further-classification edition="200601120260424B">A61F13/511</further-classification>
        <further-classification edition="200601120260424B">A61F13/15</further-classification>
        <further-classification edition="200601120260424B">B32B5/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優你　嬌美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICHARM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田未来</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下英之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田賢一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥田風花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUDA, FUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在反覆吸收體液時亦抑制具有纖維素系纖維的頂片之黏膩感。吸收性物品(1)具有：相互正交的前後方向(L)、寬度方向(W)及厚度方向(T)；具有吸收材料的吸收體(30)；及配置於較吸收體更靠肌膚側(T1)且與穿用者的肌膚相接的頂片(10)。頂片具有纖維素系纖維。纖維素系纖維內配置有包含亞麻油酸、棕櫚酸及油酸中的至少任一者之源自天然油分之油分。源自天然油分是發揮撥水性的油分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸收性物品</p>
        <p type="p">10:頂片</p>
        <p type="p">15:側片</p>
        <p type="p">20:底片</p>
        <p type="p">30:吸收體</p>
        <p type="p">31:吸收芯</p>
        <p type="p">32:芯包層薄片</p>
        <p type="p">61:本體黏著部</p>
        <p type="p">62:側翼黏著部</p>
        <p type="p">80:壓紋部</p>
        <p type="p">90:凹部</p>
        <p type="p">AR1:條紋狀圖案</p>
        <p type="p">AR2:Ω形狀圖案</p>
        <p type="p">C:部分</p>
        <p type="p">T:厚度方向</p>
        <p type="p">T1:肌膚側</p>
        <p type="p">T2:非肌膚側</p>
        <p type="p">W:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2073" publication-number="202633272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造晶圓結構的製造方法</chinese-title>
        <english-title>MANUFACTURE METHOD FOR MANUFACTURING A WAFER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10P14/43</main-classification>
        <further-classification edition="202601120260504B">H10P14/692</further-classification>
        <further-classification edition="202601120260504B">H10P14/694</further-classification>
        <further-classification edition="202601120260504B">H10P34/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商奧克美蒂公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKMETIC OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕基寧　卡蒂亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKKINEN, KATJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及製造晶圓結構(232, 234)的製造方法(100)。製造方法包含以下步驟：建立(102)頂部晶圓(204)。製造方法進一步包含以下步驟：在頂部晶圓上沉積(112)富陷阱的層(214)。製造方法進一步包含以下步驟：將承載晶圓(224)結合(122)於頂部晶圓(204)上，使富陷阱層位於頂部晶圓與承載晶圓(204, 224)之間，從而形成晶圓結構。晶圓結構包含與承載晶圓抵靠結合的富陷阱層，使得富陷阱層中的晶粒結構在承載晶圓鄰接處更粗，且晶粒結構的晶粒尺寸隨遠離承載晶圓而減小，以改善晶圓結構在富陷阱層中面向頂部晶圓之界面(IF)的捕獲效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to a manufacture method (100) for manufacturing a wafer structure (232, 234). The manufac-ture method comprises a following step of establishing (102) a top wafer (204). The manufacture method further comprises a following step of depositing (112) a trap-rich layer (214) on the top wafer. The manufacture method fur-ther comprises a following step of bonding (122) a handle wafer (224) on the top wafer so that the trap-rich layer is between the top and handle wafers (204, 224) to produce the wafer structure. The wafer structure comprises the trap-rich layer bonded against the handle wafer so that a grain structure in the trap-rich layer is coarser adjacent to the handle wafer and a grain size in the grain structure decreases away from the handle wafer to improve a trap-ping efficiency of the wafer structure in the trap-rich layer in an interface (IF) towards the top wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製造方法</p>
        <p type="p">102,106,112,120,122,130,144:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2074" publication-number="202631924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260420B">C09J7/22</main-classification>
        <further-classification edition="200601120260420B">C09J163/02</further-classification>
        <further-classification edition="200601120260420B">C09J163/04</further-classification>
        <further-classification edition="200601120260420B">C08G59/00</further-classification>
        <further-classification edition="200601120260420B">C08F2/08</further-classification>
        <further-classification edition="200601120260420B">C08K3/22</further-classification>
        <further-classification edition="202601120260420B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桒原惇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚麗奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, REINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種膜狀接著劑，其含有：環氧樹脂；酚醛樹脂；選自由彈性體及熱塑性樹脂組成的組中之至少1種樹脂成分；無機填料；及化合物，具有主鏈及與主鏈鍵結之側鏈，且在主鏈及側鏈中的至少一者上包含極性基。無機填料係由在20℃下的導熱率為10～2000W/（m·K）之物質構成之填料。以膜狀接著劑的總量為基準，無機填料的含量為50～90質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:膜狀接著劑</p>
        <p type="p">20:支撐膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2075" publication-number="202632160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對系統參數進行原位監測的裝置以及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">F16F15/027</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商整合動力技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEGRATED DYNAMICS ENGINEERING GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞德勒　格羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIDLER, GERO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑟　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOSER, LUKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於，在機械干擾(如振動以及衝擊)之影響方面進一步改善包含數個單獨安裝之部件的設備的運行。為此提出一種包含至少兩個相互分隔開設置的設備部件(2，4)的設備(1)，其中第一設備部件(2)透過至少一個可主動調節之隔振器(6)與承載結構(7)連接，且其中設有與隔振器(6)連接的控制裝置(8)，其係備設成控制隔振器(6)，從而實現第一設備部件(2)之位置穩定化，其中控制裝置(8)係備設成藉由感測器(9，10)檢測第一設備部件(2)相對於承載結構(7)的位置及/或位置變化，以及檢測相對於第二設備部件(4)的相對位置或其變化，其中控制裝置(8)係備設成至少在預設的時間間隔期間，監測第一設備部件(2)與第二設備部件(4)之間的相對位置或其變化是否處於預定的標稱範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">2,4:設備部件</p>
        <p type="p">5:基座</p>
        <p type="p">6:隔振器</p>
        <p type="p">7:承載結構</p>
        <p type="p">8:控制裝置</p>
        <p type="p">9,10:感測器</p>
        <p type="p">15:通訊連接</p>
        <p type="p">70:底部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2076" publication-number="202632159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於抑制隔振式系統中的振動的致動器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">F16F15/02</main-classification>
        <further-classification edition="200601120260422B">F16F7/09</further-classification>
        <further-classification edition="200601120260422B">B60G17/015</further-classification>
        <further-classification edition="200601120260422B">B60G17/005</further-classification>
        <further-classification edition="200601120260422B">B60G13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商整合動力技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEGRATED DYNAMICS ENGINEERING GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊沃斯　亞恩迪特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERS, ARNDT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾夫　提爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHARF, TILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於，在隔振系統(3)上藉由緊密並且低成本的設備高效地抑制運動、特別是自激的運動力。為此，本發明提出一種用於對隔振系統(3)之隔振式懸掛於基礎部件(4)上的部件(5)進行振動抑制的致動器設備(1)，其中致動器設備(1)包括夾緊元件(7)以及兩個相對設置的具有保持件(13)的夾顎(9，11)，其中夾緊元件(7)設於該二夾顎(9，11)之間，且其中設有至少一個致動器裝置(15)，其用於透過操縱將夾緊元件(7)夾緊在夾顎(9，11)之間。保持件(13)係如此浮動式支承在懸掛裝置(16)中，使得保持件(13)能夠沿致動器裝置(15)之運動方向(17)運動並且被剛性保持在垂直於此方向(17)的平面(19)中，致使在夾緊元件(7)被夾緊於夾顎(9，11)之間的鎖定位置中，夾緊元件(7)相對於保持件(13)之懸掛裝置(16)固設在此平面(19)中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:致動器設備</p>
        <p type="p">3:隔振系統</p>
        <p type="p">4:基礎部件</p>
        <p type="p">5:3之隔振式懸掛的部件</p>
        <p type="p">7:夾緊元件</p>
        <p type="p">9,11:夾顎</p>
        <p type="p">13:保持件</p>
        <p type="p">16:懸掛裝置</p>
        <p type="p">17:致動器裝置15之運動方向，自一夾顎9朝向相對之夾顎11的方向</p>
        <p type="p">22:彈簧元件</p>
        <p type="p">23,24:固定裝置</p>
        <p type="p">25:孔眼</p>
        <p type="p">30:隔振器</p>
        <p type="p">50:5之安裝面</p>
        <p type="p">71:7之桿部</p>
        <p type="p">220:膜片彈簧</p>
        <p type="p">C&lt;sub&gt;1H&lt;/sub&gt;:水平剛度，剛度</p>
        <p type="p">C&lt;sub&gt;1V&lt;/sub&gt;:垂直剛度</p>
        <p type="p">C&lt;sub&gt;2V&lt;/sub&gt;:剛度，橫向剛度</p>
        <p type="p">F&lt;sub&gt;1&lt;/sub&gt;,F&lt;sub&gt;2&lt;/sub&gt;:力</p>
        <p type="p">△x:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2077" publication-number="202631688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種抗EGFR的抗體或其抗原結合片段及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C07K14/705</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商映恩生物科技（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUALITY BIOLOGICS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENGGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花海清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, HAIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱忠遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHONGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種抗EGFR的抗體或其抗原結合片段及其用途。所述抗體或其抗原結合片段包括重鏈可變區和輕鏈可變區，所述重鏈可變區包含重鏈互補決定區HCDR1、HCDR2和HCDR3，所述輕鏈可變區包含輕鏈互補決定區LCDR1、LCDR2和LCDR3；所述LCDR1包含如SEQ ID NO: 1所示的胺基酸序列，所述LCDR2包含如SEQ ID NO: 2所示的胺基酸序列，且所述LCDR3包含如SEQ ID NO: 3所示的胺基酸序列。還提供了編碼所述抗體或其抗原結合片段的核酸分子，用於表達所述抗體或其抗原結合片段的載體和轉化體，以及所述抗體或其抗原結合片段的治療和診斷/檢測方法和用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2078" publication-number="202633142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/27</main-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新電元工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤瑛基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, EIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧田敏弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUDA, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠提高耐壓的半導體裝置。&lt;br/&gt;  本發明的半導體裝置包括：具有漂移層、基極區域及源極區域的半導體基體；源電極；內部形成有遮罩閘極結構、在平面上觀察呈多個並列配置的第一溝槽；內部形成有遮罩閘極結構、配置於相鄰的第一溝槽之間的第二溝槽；以及檯面區域。其中，第一溝槽在端部處，從平面上看，相對於第一溝槽在單元區域中延伸的方向呈傾斜彎曲狀，且相鄰的第一溝槽的端部彼此連接，由兩個相鄰的第一溝槽構成多邊形形狀，第二溝槽與相連接的第一溝槽相隔一定距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">130:第一溝槽</p>
        <p type="p">136:直線部</p>
        <p type="p">137:斜邊部</p>
        <p type="p">138:外周部</p>
        <p type="p">139、149:第二絕緣區域</p>
        <p type="p">140:第二溝槽</p>
        <p type="p">150:檯面區域</p>
        <p type="p">151:端部以外區域</p>
        <p type="p">152:端部</p>
        <p type="p">160:閘極佈線部</p>
        <p type="p">170:遮罩佈線部</p>
        <p type="p">180:周邊溝槽</p>
        <p type="p">SC1、SC2:源極接觸部</p>
        <p type="p">GC:閘極接觸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2079" publication-number="202632453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備的避障控制方法、裝置、電子設備及儲存媒體</chinese-title>
        <english-title>METHOD AND APPARATUS FOR OBSTACLE AVOIDANCE CONTROL OF CLEANING DEVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260106B">G05D1/43</main-classification>
        <further-classification edition="202401120260106B">G05D1/242</further-classification>
        <further-classification edition="202401120260106B">G05D1/243</further-classification>
        <further-classification edition="202401120260106B">G05D1/246</further-classification>
        <further-classification edition="202401120260106B">G05D1/633</further-classification>
        <further-classification edition="202401320260106B">G05D105/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種清潔設備的避障控制方法、裝置、電子設備及儲存媒體。清潔設備包括：設備本體、在前進方向上位於設備本體中後部的測距感測器。該方法包括：清潔設備向目標點行進時，若測距感測器遇到障礙，則清潔設備後退第一預設距離；清潔設備旋轉；清潔設備向前行進第二預設距離；清潔設備向目標點繼續行進。針對後置測距感測器提供避障控制方式，從而避免測距感測器卡頓，提升清潔路徑的覆蓋率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method and an apparatus for obstacle avoidance control of a cleaning device, an electronic device and a storage medium. The cleaning device includes: a device body, a ranging sensor located at a rear of the device body in a heading direction. The method includes: when the cleaning device is moving towards a target point, moving the cleaning device by a first preset distance if the ranging sensor encounters an obstacle; rotating the cleaning device; moving the cleaning device forward a second preset distance; continuing to move the cleaning device towards the target point. The obstacle avoidance control for rear ranging sensors is provided to avoid sensor jamming and improve the coverage of cleaning paths.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230、S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2080" publication-number="202632297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改進熱控制的電子器件測試裝置用探針卡</chinese-title>
        <english-title>PROBE CARD FOR AN APPARATUS FOR TESTING ELECTRONIC DEVICES WITH IMPROVED THERMAL CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R1/073</main-classification>
        <further-classification edition="202601120260302B">H10W40/47</further-classification>
        <further-classification edition="200601120260302B">G01R31/28</further-classification>
        <further-classification edition="200601120260302B">H05K7/20</further-classification>
        <further-classification edition="200601120260302B">F28F3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商探針科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNOPROBE S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬吉歐尼　弗拉維歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGGIONI, FLAVIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種適於插入用於測試電子器件的裝置中的探針卡（20），所述探針卡（20）包括：容納多個接觸探針（13）的至少一個探針頭（11），每個接觸探針（13）具有適於抵靠在待測器件（15）的接觸墊（15A）上的至少一個第一端部（13A）、以及適於抵靠在空間變換器（14）的面向待測器件（15）的第一面（FA）上形成的對應接觸墊上的第二端部（13B）；以及連接到空間變換器（14）的主機板（17）和容納在空間變換器（14）的第一面（FA）上並與所述空間變換器（14）熱接觸的一個或多個有源器件（19；19A、19B）。適當地，探針卡（20）還包括微流體冷卻系統（30），其包括至少一個歧管（31），該歧管設有一個或多個微流體通道（32、33），冷卻流體在微流體通道中迴圈，所述微流體通道（32、33）與有源器件（19；19A、19B）直接或間接熱接觸，以收集並耗散由所述有源器件（19；19A、19B）作為有源熱功率（PT2）產生的熱量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) and one or more active devices (19; 19A, 19B) housed on the first face (FA) of the space transformer (14) and in thermal contact with said space transformer (14). Suitably, the probe card (20) further comprises a microfluidic cooling system (30) including at least one manifold (31) provided with one or more microfluidic channels (32, 33) in which a cooling fluid circulates, said microfluidic channels (32, 33) being in direct or indirect thermal contact with the active devices (19; 19A, 19B) to collect and dissipate heat produced by said active devices (19; 19A, 19B) as active thermal power (PT2).</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:探針頭</p>
        <p type="p">12:容置元件</p>
        <p type="p">13:接觸探針</p>
        <p type="p">13A:接觸尖端</p>
        <p type="p">13B:接觸頭</p>
        <p type="p">14:空間變換器</p>
        <p type="p">15:待測器件</p>
        <p type="p">15A:接觸墊</p>
        <p type="p">16:半導體晶圓</p>
        <p type="p">17:主機板</p>
        <p type="p">17A:開口</p>
        <p type="p">18:介面層</p>
        <p type="p">18A:連接元件</p>
        <p type="p">19A、19B:有源器件</p>
        <p type="p">20:探針卡</p>
        <p type="p">21:安裝環</p>
        <p type="p">30:微流體冷卻系統</p>
        <p type="p">31:歧管</p>
        <p type="p">31A:第一端</p>
        <p type="p">31B:第二端</p>
        <p type="p">32:入口流體通路</p>
        <p type="p">33:流體出口通路</p>
        <p type="p">FA:第一面</p>
        <p type="p">FB:第二面</p>
        <p type="p">FC:第一面</p>
        <p type="p">FD:第二面</p>
        <p type="p">PT1:無源熱功率</p>
        <p type="p">PT2:有源熱功率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2081" publication-number="202633398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150084</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10P76/00</main-classification>
        <further-classification edition="202601120260423B">H10P95/70</further-classification>
        <further-classification edition="200601220260423B">B05C11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理裝置具備：噴嘴裝置，其具有液體噴出部；流體供給系統，其向噴嘴裝置供給具有低於殘留液之表面張力之處理液；水平方向驅動裝置，其將噴嘴裝置維持於旋轉之基板之上方之位置，且使其移動至基板之徑向上不同之複數個部分；及控制部，其依照液體處理條件，控制流體供給系統及水平方向驅動裝置。液體處理條件包含：液體流量條件，其規定於基板之複數個部分之各者中應供給至噴嘴裝置之處理液之流量；及液體移動條件，其規定為了向基板之複數個部分之各者供給處理液，而於基板之複數個部分之各者移動時之噴嘴裝置之移動速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing apparatus includes a nozzle device having a liquid discharger, a fluid supply system that supplies a processing liquid having a surface tension lower than that of a residual liquid to the nozzle device, a horizontal-direction driving device that moves the nozzle device to a plurality of different portions in a radial direction of a substrate in plan view while keeping the nozzle device at a position above the rotating substrate, and a controller that controls the fluid supply system and the horizontal-direction driving device according to a liquid processing condition. A liquid processing condition includes a liquid flow-rate condition that defines a flow rate of a processing liquid to be supplied to the nozzle device in each of the plurality of portions of the substrate, and a liquid movement condition that defines a movement speed of the nozzle device when the nozzle device moves to each of the plurality of portions of the substrate in order to supply the processing liquid to each of the plurality of portions of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:FFU</p>
        <p type="p">20:基板保持裝置</p>
        <p type="p">21:基板保持部</p>
        <p type="p">21a:旋轉基座</p>
        <p type="p">21b:保持銷</p>
        <p type="p">22:旋轉驅動部</p>
        <p type="p">30:杯裝置</p>
        <p type="p">30A:杯(外杯)</p>
        <p type="p">30B:杯(內杯)</p>
        <p type="p">31:杯驅動部</p>
        <p type="p">39:排液裝置</p>
        <p type="p">39A:外容器</p>
        <p type="p">39B:內容器</p>
        <p type="p">40:藥液供給裝置</p>
        <p type="p">41:藥液噴嘴</p>
        <p type="p">50:清洗液供給系統</p>
        <p type="p">51:清洗液噴嘴</p>
        <p type="p">60:置換液供給系統</p>
        <p type="p">70:第1氣體供給系統</p>
        <p type="p">80:第2氣體供給系統</p>
        <p type="p">90:第3氣體供給系統</p>
        <p type="p">100:噴嘴裝置</p>
        <p type="p">150:噴嘴移動裝置</p>
        <p type="p">151:水平方向驅動裝置</p>
        <p type="p">152:上下方向驅動裝置</p>
        <p type="p">200:控制部</p>
        <p type="p">CH:腔室</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2082" publication-number="202631964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多扭曲波片</chinese-title>
        <english-title>MULTI-TWIST WAVEPLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09K19/36</main-classification>
        <further-classification edition="200601120260504B">G02F1/1335</further-classification>
        <further-classification edition="200601120260504B">G02B5/18</further-classification>
        <further-classification edition="200601120260504B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾卡希　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULCAHY, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷亞特　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYATT, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴力　歐文　萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARRI, OWAIN LLYR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種在含有表面光柵之基板上包括至少兩層聚合對掌性液晶(LC)材料之多扭曲波片、其製備方法及其在尤其用於數位光學或擴增實境或虛擬實境(AR/VR)應用之光學或電光組件或裝置中之用途，該等光學或電光組件或裝置係如非機械光束引導元件、光學波導、光學耦合器、光學組合器、偏光分光器、部分反射鏡或透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a multi-twist waveplate comprising at least two layers of a polymerized chiral liquid crystal (LC) material on a substrate containing a surface grating, a method for its preparation, and its use in optical or electrooptical components or devices, especially for digital optics or augmented reality or virtual reality (AR/VR) applications like non-mechanical beam steering elements, optical waveguides, optical couplers, optical combiners, polarization beam splitters, partial mirrors or lenses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2083" publication-number="202632390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>繞射光學元件</chinese-title>
        <english-title>DIFFRACTIVE OPTICAL ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02F1/13</main-classification>
        <further-classification edition="200601120260504B">G02F1/01</further-classification>
        <further-classification edition="200601120260504B">G02B5/18</further-classification>
        <further-classification edition="200601120260504B">G02B27/42</further-classification>
        <further-classification edition="200601120260504B">C09K19/18</further-classification>
        <further-classification edition="200601120260504B">C09K19/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾卡希　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULCAHY, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷亞特　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYATT, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴力　歐文　萊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARRI, OWAIN LLYR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種繞射光學元件，其包含至少一個消色差(achromatic)半波板及至少一個色差(chromatic)半波板，每個半波板均包含於基板上之至少兩層聚合對掌性液晶(LC)材料，其中該等基板中之至少一者具有週期性表面光柵；其製備方法；及其在光學或電光組件或裝置中之用途，尤其是用於數位光學或擴增實境或虛擬實境(AR/VR)應用如非機械式光束操縱元件、光學波導、光學耦合器、光組合器、光學偏轉器、偏振分光器、部分反射鏡(partial mirror)或透鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a diffractive optical element comprising at least one achromatic half-wave plate and at least one chromatic half-wave plate, each half-wave plate comprising at least two layers of a polymerized chiral liquid crystal (LC) material on a substrate, wherein at least one of the substrates has a periodic surface grating, a method for its preparation, and its use in optical or electrooptical components or devices, especially for digital optics or augmented reality or virtual reality (AR/VR) applications like non-mechanical beam steering elements, optical waveguides, optical couplers, optical combiners, optical deflectors, polarization beam splitters, partial mirrors or lenses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:寬頻PB-HWP</p>
        <p type="p">202:藍色HWP</p>
        <p type="p">203:紅&amp;amp;藍HWP</p>
        <p type="p">204:紅色HWP</p>
        <p type="p">R:紅</p>
        <p type="p">G:綠</p>
        <p type="p">B:藍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2084" publication-number="202632113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>白液的回收方法及白液分離促進劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">D21C11/04</main-classification>
        <further-classification edition="201901120260504B">C02F11/12</further-classification>
        <further-classification edition="201901120260504B">C02F11/14</further-classification>
        <further-classification edition="200601320260504B">C02F103/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本英男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村野正幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURANO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種白液的回收方法及白液分離促進劑，其能夠減少自乳液中回收白液後的石灰泥中所含的白液的量，藉此能夠將更多的白液與石灰泥分離並回收。白液的回收方法包括白液處理步驟，所述白液處理步驟中藉由過濾使石灰泥自在製造牛皮紙漿時產生的作為白液與石灰泥的混合液的乳液中分離並回收白液，所述方法更包括分離促進步驟，所述分離促進步驟中將至少含有非離子系界面活性劑、促進乳液中的石灰泥與白液的分離的白液分離促進劑添加至白液處理步驟前或白液處理步驟時的乳液中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:黑液回收爐</p>
        <p type="p">12:溶解槽</p>
        <p type="p">13:綠液澄清器</p>
        <p type="p">14:綠液罐</p>
        <p type="p">15:消化器</p>
        <p type="p">16:苛性化槽</p>
        <p type="p">17:苛性化罐</p>
        <p type="p">18:過濾型白液處理設備</p>
        <p type="p">19:蒸解步驟</p>
        <p type="p">21:石灰泥漿洗滌器</p>
        <p type="p">22:石灰泥漿過濾器</p>
        <p type="p">23:窯</p>
        <p type="p">L1:綠液</p>
        <p type="p">L2:乳液</p>
        <p type="p">L3:過濾型白液處理設備內的針對乳液的噴灑水</p>
        <p type="p">L4:白液</p>
        <p type="p">S1:石灰泥</p>
        <p type="p">S2:生石灰</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2085" publication-number="202633208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池</chinese-title>
        <english-title>SOLAR CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F71/00</main-classification>
        <further-classification edition="202501120260504B">H10F10/16</further-classification>
        <further-classification edition="202501120260504B">H10F77/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＲＥＣ太陽能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REC SOLAR PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達爾　索拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDAL, SOURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　舒韻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, SHU YUNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　源鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNG, GUAN KIAN ERNEST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種交錯排列的背接觸太陽能電池。太陽能電池包含：具有前表面及背表面的基板，前表面與背表面在太陽能電池之深度方向中間隔開；複數個第一載流子收集元件沿著基板之背表面間隔開並且配置在基板之背表面上；複數個第二載流子收集元件沿著基板之背表面間隔開並且配置在基板之背表面上，第一載流子收集元件與第二載流子收集元件交錯排列；第一鈍化層包含複數個A部分，每一A部分介於各自的第一載流子收集元件與基板之背表面之間；以及第二鈍化層包含複數個B部分，每一B部分介於各自的第二載流子收集元件與基板之背表面之間。第二鈍化層之每一B部分在該深度方向中的厚度係大於或等於1 nm並小於或等於3 nm。本發明亦提供製造交錯排列的背接觸太陽能電池的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interdigitated back contact solar cell is provided. The solar cell comprises: a substrate having a front surface and a back surface, the front surface spaced from the back surface in a depth direction of the solar cell; a plurality of first charge­-carrier collection elements spaced apart along, and arranged on, the back surface of the substrate; a plurality of second charge-carrier collection elements spaced apart along, and arranged on, the back surface of the substrate, the first charge-carrier collection elements being interdigitated with the second charge-carrier collection elements; a first passivation layer comprising a plurality of A-portions, each A-portion interposed between a respective first charge-carrier collection element and the back surface of the substrate; and a second passivation layer comprising a plurality of B-portions, each B-portion interposed between a respective second charge-carrier collection element and the back surface of the substrate. The thickness of each B-portion of the second passivation layer in the depth direction is greater than or equal to 1 nm and less than or equal to 3 nm. Methods of manufacturing the interdigitated back contact solar cell are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">1a:前表面</p>
        <p type="p">1b:背表面</p>
        <p type="p">2:第一鈍化層</p>
        <p type="p">2a:A部分</p>
        <p type="p">2b:C部分</p>
        <p type="p">3a:第一載流子收集元件</p>
        <p type="p">3b:第二載流子收集元件</p>
        <p type="p">4:第二鈍化層</p>
        <p type="p">4a:B部分</p>
        <p type="p">4b:D部分</p>
        <p type="p">5:第三鈍化層</p>
        <p type="p">6:抗反射塗層</p>
        <p type="p">10:太陽能電池</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2086" publication-number="202633416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>貼合裝置</chinese-title>
        <english-title>BONDING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P95/60</main-classification>
        <further-classification edition="202601120260421B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三石創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUISHI, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅谷功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAYA, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角田真生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNODA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木一弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩見隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOMI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">有的情形下，貼合之二片基板間產生的位置偏差量會依貼合之一方基板的彎曲狀態而大為不同。本發明之基板貼合裝置具備：保持第一基板之第一保持部；及保持第二基板之第二保持部；在第一基板之一部分與第二基板的一部分之間形成初期貼合區域，藉由從第二保持部釋放形成了初期貼合區域之第二基板而貼合第一基板及第二基板，且初期貼合區域係依據關於第二基板之應變的資訊來設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S115:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2087" publication-number="202631525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成具有改良之壓縮應力及減小之翹曲之無鋰玻璃製品的方法</chinese-title>
        <english-title>METHOD OF FORMING LITHIUM-FREE GLASS ARTICLES HAVING IMPROVED COMPRESSIVE STRESS AND REDUCED WARP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C03B27/012</main-classification>
        <further-classification edition="200601120260422B">C03C3/076</further-classification>
        <further-classification edition="200601120260422B">C03C3/078</further-classification>
        <further-classification edition="200601120260422B">C03C3/089</further-classification>
        <further-classification edition="200601120260422B">C03C3/091</further-classification>
        <further-classification edition="200601120260422B">C03C21/00</further-classification>
        <further-classification edition="202601120260422B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古比譚　歐茲格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GULBITEN, OZGUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　亞圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　哲明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZHEMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成一無鋰玻璃製品之方法包括熱處理該玻璃製品以賦予一假想溫度，及對熱處理之玻璃製品進行離子交換。該熱處理包括：將該玻璃製品加熱至比該玻璃製品之一退火點低130℃至高20℃的一保持溫度；將該玻璃製品保持在該保持溫度下持續一保持時段；將該玻璃製品以一第一冷卻速率自該保持溫度冷卻至一中間溫度；及將該玻璃製品以一第二冷卻速率自該中間溫度冷卻至室溫。離子交換之玻璃製品包括：大於或等於900 MPa之一壓縮應力，如針對具有1.1 mm之一厚度的一製品所量測；及小於或等於0.3 mm之一翹曲，如針對具有小於200 mm之一長度的一製品所量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a lithium-free glass article includes thermally treating the glass article to impart a fictive temperature and ion exchanging the thermally treated glass article. The thermal treatment includes heating the glass article to a hold temperature from 130 ℃ below to 20 ℃ above an annealing point of the glass article; holding the glass article at the hold temperature for a hold period; cooling the glass article at a first cooling rate from the hold temperature to an intermediate temperature; and cooling the glass article at a second cooling rate from the intermediate temperature to room temperature. The ion exchanged glass article includes a compressive stress greater than or equal to 900 MPa, as measured for an article having a thickness of 1.1 mm; and a warp less than or equal to 0.3 mm, as measured for an article having a length less than 200 mm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102,102a,102b,102c,102d,104:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2088" publication-number="202631027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>身體冷卻器具及身體冷卻器具用容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A41D13/005</main-classification>
        <further-classification edition="200601120260429B">A61F7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田潮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, USHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中雅仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阪本一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高野将行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真谷俊朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTANI, TOSHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種身體冷卻器具，其係內封有包含冷媒及二氧化碳釋放源之收容物，且接觸肌膚使用以使所釋放之二氧化碳滲透至身體者，且於包含應用時接觸肌膚之面之區域即肌膚接觸面區域具備控制構件，上述控制構件係由熱塑性聚胺基甲酸酯彈性體或矽酮橡膠構成，並且包含：二氧化碳釋放量控制構件，其控制來自內部之二氧化碳釋放量；及溫度控制構件，其控制接觸肌膚之面之表面溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:注入口部</p>
        <p type="p">31:本體部</p>
        <p type="p">100:身體冷卻器具</p>
        <p type="p">101:身體冷卻器具用容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2089" publication-number="202632838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>判定電力網的特性值</chinese-title>
        <english-title>DETERMINING A VALUE OF A CHARACTERISTIC OF AN ELECTRIC POWER GRID</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H02J13/12</main-classification>
        <further-classification edition="200601120260504B">G01R21/06</further-classification>
        <further-classification edition="202401120260504B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商迅應科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REACTIVE TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科伊萊拉　亞潘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIRALA, ARPAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格奧爾基　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHEORGHE, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳成弼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OE, SUNG PIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於判定在電力網之第一位置處觀察到之該電力網之特性之第一值之方法。該方法包括獲得複數個第二值。各第二值指示各自功率變化之前及之後的該第一位置處之該電力網之量測電壓差與該各自功率變化之前及之後的該第一位置處之該電力網之量測電流差之間的關係。各功率變化依無功與有功功率之各自不同比率引起該第一位置處之該電力網中之電功率流。該方法包括基於該複數個第二值來判定指示該關係之極值之第三值及基於該第三值來判定該第一值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for determining a first value of a characteristic of an electric power grid as observed at a first location of the electric power grid is disclosed. The method comprises obtaining a plurality of second values. Each second value is indicative of a relationship between a difference in measured voltage of the electric power grid at the first location before and after a respective power change and a difference in measured current of the electric power grid at the first location before and after the respective power change. Each power change causes an electric power flow in the electric power grid at the first location with a respective different ratio of reactive to active power. The method comprises determining, based on the plurality of second values, a third value indicative of an extremum of the relationship, and determining the first value based on the third value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2090" publication-number="202632370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G02B13/00</main-classification>
        <further-classification edition="200601120260416B">G02B13/18</further-classification>
        <further-classification edition="200601120260416B">G02B9/64</further-classification>
        <further-classification edition="200601120260416B">G02B27/00</further-classification>
        <further-classification edition="200601120260416B">G02B11/34</further-classification>
        <further-classification edition="202101120260416B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林茂宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MAOZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳白娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BAINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭，包含第一透鏡到第九透鏡，第一透鏡的像側面的一光軸區域為凹面，第五透鏡具有正屈光率，第七透鏡的像側面的一光軸區域為凸面，其中，光學成像鏡頭的透鏡只有上述九片，且光學成像鏡頭更滿足以下條件:第二透鏡的一阿貝數 小於第六透鏡的一阿貝數，第二透鏡的阿貝數小於第七透鏡的一阿貝數，第六透鏡的阿貝數小於或等於第九透鏡的一阿貝數，第一透鏡在光軸上的一厚度大於第六透鏡與第七透鏡在光軸上的一空氣間隙，第一透鏡在光軸上的厚度大於第七透鏡與第八透鏡在光軸上的一空氣間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens includes a first lens element to a ninth lens element. An optical axis region of an image-side surface of the first lens element is concave, the fifth lens element has positive refracting power, and an optical axis region of an image-side surface of the seventh lens element is convex. The optical imaging lens includes only the above nine lens elements and further satisfies the following conditions: an Abbe number of the second lens element is smaller than an Abbe number of the sixth lens element, an Abbe number of the second lens element is smaller than an Abbe number of the seventh lens element, an Abbe number of the sixth lens element is smaller than or equal to an Abbe number of the ninth lens element, a thickness of the first lens element along the optical axis is greater than an air gap between the sixth lens element and the seventh lens element along the optical axis, and a thickness of the first lens element along the optical axis is greater than an air gap between the seventh lens element and the eighth lens element along the optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">2:光圈</p>
        <p type="p">3:濾光片</p>
        <p type="p">4:成像面</p>
        <p type="p">11、21、31、41、51、61、71、81、91:物側面</p>
        <p type="p">12、22、32、42、52、62、72、82、92:像側面</p>
        <p type="p">13、16、23、26、33、36、43、46、53、56、63、66、73、76、83、86、93、96:光軸區域</p>
        <p type="p">14、17、24、27、34、37、44、47、54、57、64、67、74、77、84、87、94、97:圓周區域</p>
        <p type="p">10:第一透鏡</p>
        <p type="p">20:第二透鏡</p>
        <p type="p">30:第三透鏡</p>
        <p type="p">40:第四透鏡</p>
        <p type="p">50:第五透鏡</p>
        <p type="p">60:第六透鏡</p>
        <p type="p">70:第七透鏡</p>
        <p type="p">80:第八透鏡</p>
        <p type="p">90:第九透鏡</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
        <p type="p">T1、T2、T3、T4、T5、T6、T7、T8、T9:各透鏡在光軸上的厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2091" publication-number="202631591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備聚合單體的方法和聚合單體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D319/12</main-classification>
        <further-classification edition="200601120260302B">B01J29/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY DEVELOPMENT COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周向坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙成浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬會霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花瑞銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及聚合單體製備技術領域，公開了一種製備聚合單體的方法和聚合單體，該方法包括以下步驟：在製備聚合單體的條件下，在催化劑存在下，在基底溶劑存在下，將原料進行反應，製備聚合單體的溫度和壓力使得所述基底溶劑在反應中不沸騰，在100℃溫度下，所述基底溶劑對原料的溶解度不小於10g原料/100g溶劑；所述基底溶劑的沸點不低於110℃。本發明提供的方法選擇出了適用於此反應的溶劑，取得了較好連續性的反應效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2092" publication-number="202631018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>點心</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">A23G1/20</main-classification>
        <further-classification edition="200601120260326B">A23G1/50</further-classification>
        <further-classification edition="200601120260326B">A23G1/54</further-classification>
        <further-classification edition="200601120260326B">A23G3/34</further-classification>
        <further-classification edition="200601120260326B">A23G3/50</further-classification>
        <further-classification edition="200601120260326B">A23G3/54</further-classification>
        <further-classification edition="200601120260326B">A63H33/06</further-classification>
        <further-classification edition="200601120260326B">A63H33/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹財菜摘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAI, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提高趣味性之點心。  &lt;br/&gt;本發明之點心1具備：本體部10；角色部20，其形成於本體部10；及背景部，其形成於角色部20之周圍且本體部10上；於角色部20形成有第1種孔20a，於第1種孔20a形成有凸部29。要將孔剝開時，可使第1種孔20a極為不易剝開。又，由於在第1種孔20a形成有凸部29，故當要剝開孔時對孔施加局部外力之情形時，藉由按壓凸部29等而限制外力於孔內傳遞，能有助於將孔剝開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:點心</p>
        <p type="p">10:本體部</p>
        <p type="p">20:角色部</p>
        <p type="p">20a:第1種孔</p>
        <p type="p">20ad:底部</p>
        <p type="p">20b:第2種孔</p>
        <p type="p">20bd:底部</p>
        <p type="p">21:第1組成部(組成部)</p>
        <p type="p">22:第2組成部(組成部)</p>
        <p type="p">23:第3組成部(組成部)</p>
        <p type="p">24:第4組成部(組成部)</p>
        <p type="p">25:第5組成部(組成部)</p>
        <p type="p">26:第6組成部(組成部)</p>
        <p type="p">27:第7組成部(組成部)</p>
        <p type="p">28:第8組成部(組成部)</p>
        <p type="p">29:第9組成部(凸部)</p>
        <p type="p">29u:凸部之上端面</p>
        <p type="p">31:第1背景部(背景部)</p>
        <p type="p">31a:平坦部分</p>
        <p type="p">31b:圖案部分</p>
        <p type="p">32:第2背景部(背景部)</p>
        <p type="p">32a:文字資訊</p>
        <p type="p">41:第1種槽(槽)</p>
        <p type="p">43:淺槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2093" publication-number="202632347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150246</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有溝槽式波導之光耦合器</chinese-title>
        <english-title>OPTICAL COUPLERS WITH TRENCHED WAVEGUIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B6/255</main-classification>
        <further-classification edition="200601120260504B">G02B6/34</further-classification>
        <further-classification edition="200601120260504B">G02B6/13</further-classification>
        <further-classification edition="202601120260504B">H10W70/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾哈德　奧姆卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARHADE, OMKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　沙珊克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, SHASHANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈邁德　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMED, SUFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中闡述用於提供在波導之間具有高效光耦合之光子裝置之系統及技術。該等光子裝置包括：一玻璃基板，其具有玻璃波導；及一光子積體電路(PIC)，其具有與該等玻璃波導漸逝耦合之PIC波導。該等波導可具有安置在毗鄰波導之間的凹部，以允許擠出過量的黏合劑。該PIC可具有暴露該PIC之波導層之一溝槽，藉此減小在被耦合時該等PIC波導與該等玻璃波導之間的間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are systems and techniques for providing photonic devices having efficient optical coupling between waveguides. The photonic devices comprise a glass substrate having glass waveguides and a photonic integrated circuit (PIC) having PIC waveguides evanescently coupled with the glass waveguides. The waveguides may have recesses disposed between adjacent waveguides to allow for excess adhesive to be squeezed out. The PIC may have a trench exposing the waveguide layer of the PIC, thus reducing the gap between the PIC waveguides and the glass waveguides when coupled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">311:光子積體電路</p>
        <p type="p">312:光子積體電路波導</p>
        <p type="p">313:波導層</p>
        <p type="p">314A:凹部</p>
        <p type="p">318:溝槽</p>
        <p type="p">320:玻璃基板</p>
        <p type="p">322:玻璃波導</p>
        <p type="p">324A:凹部</p>
        <p type="p">330:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2094" publication-number="202633093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有電容器結構的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10B80/00</main-classification>
        <further-classification edition="202501120260310B">H10D1/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪錫源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河智恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, JIEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任峻成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JOONSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李強仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANGIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜敏圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種半導體裝置，其包括：一基體，其包括一作用區；電晶體，其包括一閘極結構；一基體絕緣層；複數個罩蓋絕緣層，其覆蓋該基體絕緣層且具有一扁平上表面；以及一電容器，其安置於一電容器區內且穿過該等複數個罩蓋絕緣層，且該電容器包括：一電容器基底，其在一第一方向與一第二方向上延伸，且具有與該閘極結構相同的複數個堆疊層；第一電容器電極，其具有在該第二方向與一第三方向上延伸的一板形狀；以及第二電容器電極，其具有該板形狀且在該第一方向上與該等第一電容器電極交替地安置，且該等第二電容器電極之下部末端穿過該電容器基底之至少一些層，且該等第一電容器電極之下部末端穿過一最下部罩蓋絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a substrate including an active region; transistors including a gate structure;; a substrate insulating layer; a plurality of capping insulating layers covering the substrate insulating layer and having a flat upper surface; and a capacitor disposed within a capacitor region and penetrating through the plurality of capping insulating layers, and the capacitor includes: a capacitor base extending in a first direction and a second direction,, and having the same plurality of stacked layers as the gate structure; first capacitor electrodes having a plate shape extending in the second direction and a third direction;and second capacitor electrodes having the plate shape, and disposed alternately with the first capacitor electrodes in the first direction, and lower ends of the second capacitor electrodes penetrate through at least some layers of the capacitor base, and lower ends of the first capacitor electrodes penetrate through a lowermost capping insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">170:接觸插塞</p>
        <p type="p">201:基體</p>
        <p type="p">202:電阻緩解層</p>
        <p type="p">203:第一基體絕緣層</p>
        <p type="p">204:第二基體絕緣層</p>
        <p type="p">205:雜質區</p>
        <p type="p">209:元件隔離區</p>
        <p type="p">210:電極結構，第一電極結構</p>
        <p type="p">210C:第一接觸電極結構</p>
        <p type="p">211:傳導材料層</p>
        <p type="p">213:擴散障壁</p>
        <p type="p">220:電極結構，第二電極結構</p>
        <p type="p">220C:第二接觸電極結構</p>
        <p type="p">230:電路元件，周邊電路元件，元件</p>
        <p type="p">231:周邊閘極介電層，閘極介電層</p>
        <p type="p">231c:介電層</p>
        <p type="p">232:第一周邊閘極電極，第一閘極電極</p>
        <p type="p">232c:第一基底傳導層</p>
        <p type="p">233:周邊閘極間隔體，閘極間隔體</p>
        <p type="p">233c:基底間隔體</p>
        <p type="p">234:第二周邊閘極電極，第二閘極電極</p>
        <p type="p">234c:第二基底傳導層</p>
        <p type="p">235:周邊閘極罩蓋層，閘極罩蓋層</p>
        <p type="p">235c:基底罩蓋層</p>
        <p type="p">290:周邊罩蓋絕緣層</p>
        <p type="p">291:絕緣層，第一罩蓋絕緣層，第一周邊罩蓋絕緣層</p>
        <p type="p">293:絕緣層，第二周邊罩蓋絕緣層</p>
        <p type="p">294:絕緣層，第三周邊罩蓋絕緣層</p>
        <p type="p">297:絕緣層，第四周邊罩蓋絕緣層</p>
        <p type="p">A:部分</p>
        <p type="p">CL1_1:輔助電容器電極，第一輔助電容器電極，第一下部輔助電容器電極</p>
        <p type="p">CL1_2:輔助電容器電極，第一輔助電容器電極，第二下部輔助電容器電極</p>
        <p type="p">CL2_1:輔助電容器電極，中間輔助電容器電極，第一中間輔助電容器電極</p>
        <p type="p">CL2_2:輔助電容器電極，第二中間輔助電容器電極</p>
        <p type="p">CL3_1:輔助電容器電極，上部輔助電容器電極，第一上部輔助電容器電極</p>
        <p type="p">CL3_2:輔助電容器電極，第二上部輔助電容器電極</p>
        <p type="p">CS:電容器結構</p>
        <p type="p">CSB:電容器基底結構</p>
        <p type="p">d1:第一分離距離</p>
        <p type="p">d2:第二分離距離</p>
        <p type="p">h1:長度，第一長度</p>
        <p type="p">h2:第二長度</p>
        <p type="p">h3:第三長度</p>
        <p type="p">h4:第四長度</p>
        <p type="p">hc:基底高度</p>
        <p type="p">hs:元件高度</p>
        <p type="p">MC1:接觸插塞，第一接觸插塞</p>
        <p type="p">MC2:接觸插塞，第二接觸插塞，第二互連線</p>
        <p type="p">MC3:接觸插塞，第三接觸插塞，第三互連線</p>
        <p type="p">ML1:互連線，第一互連線，最上部互連線，下部互連線</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2095" publication-number="202631151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種阿比特龍衍生物、藥物組合物及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/58</main-classification>
        <further-classification edition="200601120260504B">C07J43/00</further-classification>
        <further-classification edition="200601120260504B">A61K47/22</further-classification>
        <further-classification edition="201701120260504B">A61K47/44</further-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/14</further-classification>
        <further-classification edition="200601120260504B">A61K9/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P5/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉明瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MINGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛廣存</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, GUANGCUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關華偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, HUAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒愛峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, AIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANGLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種阿比特龍衍生物、藥物組合物及其製備方法和應用。本發明提供了一種如式（1）或式（2）所示的阿比特龍衍生物、或其藥學上可接受的鹽，區別於現有的阿比特龍衍生物結構每分子含有一個阿比特龍分子；本發明化合物每分子含有兩個阿比特龍分子。本發明化合物具有長效緩釋特徵，可以經皮下注射或肌內注射，維持血藥濃度12周（3個月）或更長時間，用於前列腺癌的治療。&lt;br/&gt;&lt;img align="absmiddle" height="163px" width="582px" file="ed10063.JPG" alt="ed10063.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2096" publication-number="202633507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於先進封裝架構之頂側光耦合器</chinese-title>
        <english-title>TOP-SIDE OPTICAL COUPLERS FOR ADVANCED PACKAGE ARCHITECTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10W74/10</main-classification>
        <further-classification edition="200601120260429B">G02B6/42</further-classification>
        <further-classification edition="200601120260429B">G02B6/124</further-classification>
        <further-classification edition="202601120260429B">H10W70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特美特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTMATTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾哈德　奧姆卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARHADE, OMKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普夫努爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFNUER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩內　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANE, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈邁德　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMED, SUFI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫迪　米圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODI, MITUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森伯格　傑西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENBERG, JESSIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎　比諾以</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, BINOY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塔拉伊　什雷亞什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATTARAI, SHREYASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置可包含一電子-光子總成，該電子-光子總成包括：一光子積體電路(PIC)，其包括界定一波導平面之一波導；一電子積體電路(EIC)，其附接至該PIC；及一囊封物，其至少部分囊封該EIC。一種裝置可包含附接至該PIC之一光耦合器，其中該光耦合器經組態以在由該PIC發射之光由該波導導引時在相對於該波導平面成角度之一第一方向上準直該光。一種裝置可包含一光總成，該光總成包括一可拆卸插頭及附接至該可拆卸插頭之一光纖，其中該光總成經定位以接收來自該光耦合器之該經準直光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide defining a waveguide plane, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical coupler attached to the PIC, wherein the optical coupler is configured to collimate, in a first direction that is angled relative to the waveguide plane, light emitted by the PIC upon being guided by the waveguide. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug, wherein the optical assembly is positioned to receive the collimated light from the optical coupler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">201:中介層</p>
        <p type="p">202:電子-光子總成</p>
        <p type="p">203:中介層互連件</p>
        <p type="p">220:光子積體電路(PIC)</p>
        <p type="p">224:囊封物</p>
        <p type="p">225:囊封物</p>
        <p type="p">230:控制器</p>
        <p type="p">231:處理晶片</p>
        <p type="p">232:高頻寬記憶體(HBM)</p>
        <p type="p">240:光纖</p>
        <p type="p">242:可拆卸插頭</p>
        <p type="p">243:支架</p>
        <p type="p">250:光耦合器</p>
        <p type="p">H2:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2097" publication-number="202631920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光液</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09G1/02</main-classification>
        <further-classification edition="200601120260504B">C09K3/14</further-classification>
        <further-classification edition="202601120260504B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余華海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUAHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荊建芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, JIANFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周文婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, WENTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱一明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴少英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHAOYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, QINZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪國豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUOHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ROBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊征</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種化學機械拋光液，包含研磨顆粒、絡合劑、氧化劑，水和至少一種腐蝕抑制劑。本發明提供的拋光液，具有較高的鈦和氧化矽絕緣層的去除速率以及較高的氧化矽對鈷的去除速率選擇比，和較高的鈷腐蝕控制能力和晶圓表面形貌修復能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a chemical mechanical polishing slurry comprising abrasive particles, complexing agent, oxidizing agent, water, and at least one corrosion inhibitor. The polishing slurry provides high removal rates of titanium and silicon dioxide, high removal rate selectivity of silicon dioxide to cobalt, as well as strong cobalt corrosion control and dishing reduction capabilities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2098" publication-number="202631206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以結合１９１Ｐ４Ｄ１２蛋白之抗體藥物結合物（ＡＤＣ）治療癌症之方法</chinese-title>
        <english-title>METHODS FOR TREATING CANCERS WITH ANTIBODY DRUG CONJUGATES (ADC) THAT BIND TO 191P4D12 PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260504B">A61K47/68</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">C07K5/02</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾澤西公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGENSYS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西健公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEAGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛特娜　伊蓮納　瑪麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARTNER, ELAINA MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供以結合191P4D12蛋白之抗體藥物結合物(ADC)治療癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods for the treatment of cancers with antibody drug conjugates (ADC) that bind to 191P4D12 proteins.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2099" publication-number="202631116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療癌症的選擇性組蛋白去乙醯酶３　（ＨＤＡＣ３）抑制劑及免疫治療劑之組合</chinese-title>
        <english-title>COMBINATION OF A SELECTIVE HISTONE DEACETYLASE 3 (HDAC3) INHIBITOR AND AN IMMUNOTHERAPY AGENT FOR THE TREATMENT OF CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K31/167</main-classification>
        <further-classification edition="200601120260429B">A61K39/395</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商可達醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KDAC THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍森　艾德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLSON, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納查特　馬里亞納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NACHT, MARIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之態樣係關於使用選擇性組蛋白去乙醯酶3 (HDAC3)抑制劑治療癌症的組合物、套組及方法。在一些態樣中，該等組合物、套組及方法係關於選擇性HDAC3抑制劑與免疫治療劑(例如免疫檢查點抑制劑)之組合使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure relate to compositions, kits, and methods for the treatment of cancer that utilize a selective histone deacetylase 3 (HDAC3) inhibitor. In some aspects, the compositions, kits, and methods relate to use of a selective HDAC3 inhibitor in combination with an immunotherapy agent (&lt;i&gt;e.g.&lt;/i&gt;, an immune checkpoint inhibitor).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2100" publication-number="202632514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>元器件參數提取方法、系統和儲存媒體</chinese-title>
        <english-title>METHOD, SYSTEM AND STORAGE MEDIUM FOR EXTRACTION OF PARAMETERS OF COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260128B">G06F16/3329</main-classification>
        <further-classification edition="201901120260128B">G06F16/335</further-classification>
        <further-classification edition="202201120260128B">G06V30/19</further-classification>
        <further-classification edition="201901120260128B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環旭電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚思豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種元器件參數提取方法、系統和儲存媒體，其中方法包括：載入目標元器件的數據表；基於預設或自定義的處理需求對所述數據表進行自動檢索，生成對應所述目標元器件的類型屬性的參數索引列表；所述參數索引列表包括目標參數、對應所述目標參數的數據正文，和所述數據正文在所述數據表中的位置標籤；跳轉至正文位置並使用框選工具，從所述數據正文中框選有效參數內容並進行確認，確認後自動將目標參數名稱和所述有效參數內容存入資料庫。本發明透過預設元器件類型屬性和處理需求，參數相關正文輔助檢索，以及有效內容二次框選確認，不僅可以提高參數查找的效率，而且提高了參數錄入過程的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method, system and storage medium for extraction of parameters of a component. The method includes: loading the datasheet of the target component; automatically searching the datasheet based on the preset or custom processing requirements to generate a parameter index list corresponding to the type attribute of the target component, in which the parameter index list includes the target parameter, the textual data corresponding to the target parameter, and the position label of the textual data in the datasheet; redirecting to the position of the textual data, using a selection tool to select a valid parameter content from the textual data and confirm it, and automatically storing the target parameter name and the valid parameter content in the database after confirming the valid parameter content. The present invention can not only improve efficiency of the parameter search but also improve accuracy of the parameter entry process through the preset component type attributes and processing requirements, the auxiliary search of the textual data associated with the parameter, and the secondary selection and confirmation of the valid content.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:載入目標元器件的數據表</p>
        <p type="p">S2:基於預設或自定義的處理需求對所述數據表進行自動檢索，生成對應所述目標元器件的型式屬性的參數索引列表；所述參數索引列表包括目標參數、對應所述目標參數的數據正文，和所述數據正文在所述數據表中的位置標籤</p>
        <p type="p">S3:跳轉至正文位置並使用框選工具，從所述數據正文中框選有效參數內容並進行確認，確認後自動將目標參數名稱和所述有效參數內容存入資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2101" publication-number="202631360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸附裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B28D7/00</main-classification>
        <further-classification edition="200601120260128B">B28D5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商不二越股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NACHI-FUJIKOSHI CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中勇氣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭秀霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">(課題)&lt;br/&gt;  本發明提供一種吸附裝置，在從矽錠的端面切出晶圓時，能夠防止在端面的離開側產生毛刺、缺口。&lt;br/&gt;&lt;br/&gt;  (解決方法)&lt;br/&gt;  本發明的吸附裝置（100）是吸附於柱狀的矽錠（104）的端面（106）的吸附裝置，具備在使用帶鋸（108）從矽錠的端面切出晶圓時吸附於端面的多個吸附墊（114a～114i），吸附墊相對於帶鋸的切斷方向（A）的進入側（E）而較多地配置於離開側（F）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸附裝置</p>
        <p type="p">108:帶鋸</p>
        <p type="p">114、114a~114i:吸附墊</p>
        <p type="p">122:頭部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2102" publication-number="202631410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車之控制裝置</chinese-title>
        <english-title>CONTROL DEVICE FOR A BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">B60L3/02</main-classification>
        <further-classification edition="200601120260424B">B60T11/236</further-classification>
        <further-classification edition="202001120260424B">B62J43/20</further-classification>
        <further-classification edition="202001120260424B">B62J43/30</further-classification>
        <further-classification edition="200601120260424B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格魯斯　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUSE, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛里提斯　瑞貝卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREETIS, REBECCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧曼　內森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMAN, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬洪尼　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHONEY, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅伊　華特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAY, WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史旺森　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包括一殼體的控制裝置，該殼體具有一基座部分及一延伸部分。該殼體之該基座部分具有一面內側及一面外側。該控制裝置包括：一扳桿，其耦接至該殼體且可相對於該殼體樞轉；以及一總泵部分，其由該殼體支撐。該總泵部分具有一中空的流體缸筒。該控制裝置亦包括一活塞總成，其由該殼體支撐。該活塞總成係為可相對於該總泵部分移動的。該活塞總成之至少部分係安置在該總泵部分內。該總泵部分係相對於該殼體之該基座部分的該面外側成角度，以使得比起該流體缸筒之該第二端相對於該面外側，該流體缸筒之該第一端更靠近該面外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device includes a housing having a base portion and an extension portion. The base portion of the housing has an inward facing side and an outward facing side. The control device includes a lever coupled to and pivotable relative to the housing, and a master cylinder portion supported by the housing. The master cylinder portion has a hollow fluid cylinder. The control device also includes a piston assembly supported by the housing. The piston assembly is movable relative to the master cylinder portion. At least part of the piston assembly is disposed within the master cylinder portion. The master cylinder portion is angled relative to the outward facing side of the base portion of the housing, such that the first end of the fluid cylinder is closer to the outward facing side than the second end of the fluid cylinder is relative to the outward facing side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自行車控制裝置，控制裝置</p>
        <p type="p">102:煞車扳桿</p>
        <p type="p">104:殼體</p>
        <p type="p">120:夾具</p>
        <p type="p">124:樞轉孔洞，樞轉內孔</p>
        <p type="p">126:兩件式軸，軸</p>
        <p type="p">200:基座部分</p>
        <p type="p">202:延伸部分</p>
        <p type="p">210:後端</p>
        <p type="p">222:腔室</p>
        <p type="p">300:殼體內孔</p>
        <p type="p">302:總泵套筒</p>
        <p type="p">304:活塞</p>
        <p type="p">306,312,324,346:第一端</p>
        <p type="p">308:第二端，第二側</p>
        <p type="p">310:推桿</p>
        <p type="p">314,328,348:第二端</p>
        <p type="p">316:本體</p>
        <p type="p">318,416:調整機構</p>
        <p type="p">320:推桿支撐件</p>
        <p type="p">322:容座</p>
        <p type="p">326:內表面</p>
        <p type="p">330:凸輪</p>
        <p type="p">332:第一彈簧，回位彈簧</p>
        <p type="p">334:延伸部</p>
        <p type="p">344,358:密封件</p>
        <p type="p">350:圓柱形蓋體，扣持板</p>
        <p type="p">362:洩流埠，開口</p>
        <p type="p">364:前端</p>
        <p type="p">368:洩流插塞總成</p>
        <p type="p">370:洩流插塞</p>
        <p type="p">372:螺紋襯套</p>
        <p type="p">388:流體埠</p>
        <p type="p">391:Stealthamajig閥總成，軟管連接器</p>
        <p type="p">414:直桿十字栓銷，十字栓銷</p>
        <p type="p">P:樞轉軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2103" publication-number="202631460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>料盤料架</chinese-title>
        <english-title>REEL RACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260226B">B65D25/02</main-classification>
        <further-classification edition="200601120260226B">B65D25/10</further-classification>
        <further-classification edition="200601120260226B">B65D25/24</further-classification>
        <further-classification edition="200601120260226B">B65D25/52</further-classification>
        <further-classification edition="200601120260226B">B65D81/05</further-classification>
        <further-classification edition="200601120260226B">B65D90/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環旭電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭麗珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, LI-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷遠洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, YUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾耀興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YAO-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭開偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種料盤料架，包括料架底座和若干料盤儲存架，料架底座設有滑塊和滑軌中的一種，料盤儲存架底部設有滑塊和滑軌中的另一種，滑塊滑設於滑軌，以使若干料盤儲存架能分別獨立滑設於料架底座。其中，料盤儲存架沿垂直於滑軌延伸方向的兩側分別具有前擋板和後擋板，前擋板和後擋板分別用以限制料盤軸向上的兩端面，且後擋板的高度高於前擋板的高度。本申請中，通過滑塊、滑軌間的滑動配合，實現各料盤儲存架的單獨滑出，方便機械手臂取放料；同時，後擋板和前擋板採用長短邊設計，放料時料盤靠長邊（後擋板）放料，有效吸收料盤的外張變形，以便在有限空間內存放更多的料盤，並保證料帶垂直輸送，防止料帶刮傷拉拽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reel rack includes a rack base and a plurality of reel storage frames. The rack base is provided with either a slider or a slide rail, and the bottom of each reel storage frame is provided with the other of the slider and the slide rail. The slider is slidably disposed on the slide rail so that the plurality of reel storage frames can independently slide on the rack base. Each reel storage frame has a front stopper and a rear stopper respectively disposed on two sides perpendicular to the extending direction of the slide rail. The front and rear stoppers limit two axial end faces of a reel, and the height of the rear stopper is greater than that of the front stopper. By means of the sliding cooperation between the slider and the slide rail, each reel storage frame can be independently drawn out to facilitate robotic pick-and-place operations. The rear and front stoppers adopt a long-short side design, allowing the reel to rest against the longer rear stopper during loading, effectively absorbing outward deformation of the reel. This enables storage of more reels within limited space, ensures vertical tape feeding, and prevents the tape from being scratched or pulled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:料盤料架</p>
        <p type="p">110:料架底座</p>
        <p type="p">112:側出口</p>
        <p type="p">120:料盤儲存架</p>
        <p type="p">200:料盤</p>
        <p type="p">201:7寸料盤</p>
        <p type="p">202:13寸料盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2104" publication-number="202633500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括基板間梯度互連結構的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING INTER-SUBSTRATE GRADIENT INTERCONNECT STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10W74/00</main-classification>
        <further-classification edition="202601120260417B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩托　安尼奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比奧　瓊雷伊維拉爾巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUOT, JOAN REY VILLARBA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏　弘博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WE, HONG BOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種元件，包括第一封裝以及耦合到該第一封裝的第二封裝。第一封裝包括第一基板、耦合到該第一基板的至少一個梯度互連結構，以及耦合到該第一基板的第一整合元件。第二封裝包括第二基板以及耦合到該第二基板的第二整合元件。第二基板耦合到該至少一個梯度互連結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprising a first package and a second package coupled to the first package. The first package includes a first substrate, at least one gradient interconnect structure coupled to the first substrate, and a first integrated device coupled to the first substrate. The second package includes a second substrate and a second integrated device coupled to the second substrate. The second substrate is coupled to the at least one gradient interconnect structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:元件</p>
        <p type="p">201:整合元件</p>
        <p type="p">202:第一基板</p>
        <p type="p">203:整合元件</p>
        <p type="p">204:第二基板</p>
        <p type="p">205:整合元件</p>
        <p type="p">206:梯度互連結構</p>
        <p type="p">207:元件</p>
        <p type="p">208:包封層</p>
        <p type="p">209:板</p>
        <p type="p">212:焊柱互連</p>
        <p type="p">220:介電層</p>
        <p type="p">222:互連</p>
        <p type="p">226:焊料互連</p>
        <p type="p">234:焊料互連</p>
        <p type="p">240:介電層</p>
        <p type="p">242:互連</p>
        <p type="p">244:焊料互連</p>
        <p type="p">250:腔</p>
        <p type="p">254:焊料互連</p>
        <p type="p">260:包封層</p>
        <p type="p">262:互連</p>
        <p type="p">264:焊料互連</p>
        <p type="p">274:焊料互連</p>
        <p type="p">290:第一封裝</p>
        <p type="p">292:第二封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2105" publication-number="202633474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝用有孔玻璃基板、半導體封裝用玻璃基板、及半導體封裝用有孔玻璃基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W70/63</main-classification>
        <further-classification edition="202601120260504B">H10W70/692</further-classification>
        <further-classification edition="201401120260504B">B23K26/364</further-classification>
        <further-classification edition="201401120260504B">B23K26/386</further-classification>
        <further-classification edition="202601120260504B">H10W70/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧田雅貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種即便為包含大量鹼金屬成分的玻璃，亦可形成錐角小、且接近直孔形狀的貫通孔的半導體封裝用有孔玻璃基板。本發明的半導體封裝用有孔玻璃基板G1包括：第一主表面G1a、作為第一主表面G1a的相反面的第二主表面G1b、以及將第一主表面G1a與第二主表面G1b之間貫通的貫通孔1，所述半導體封裝用有孔玻璃基板G1中，作為玻璃組成，以莫耳%計含有SiO&lt;sub&gt;2&lt;/sub&gt; 55%～75%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0%～20%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0%～15%、Li&lt;sub&gt;2&lt;/sub&gt;O 0%～10%、Na&lt;sub&gt;2&lt;/sub&gt;O 5%～20%、K&lt;sub&gt;2&lt;/sub&gt;O 0%～10%、MgO 0%～10%、CaO 0%～10%、SrO 0%～10%、BaO 0%～10%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">G1:有孔玻璃基板/玻璃基板</p>
        <p type="p">G1a:第一主表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2106" publication-number="202632673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150485</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生表位之胺基酸序列候選者的方法</chinese-title>
        <english-title>METHOD FOR GENERATING CANDIDATES OF AMINO ACID SEQUENCES OF EPITOPES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260504B">G16B30/10</main-classification>
        <further-classification edition="201901120260504B">G16B40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗萊查斯　曼里克　娜塔莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLECHAS MANRIQUE, NATALIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁內斯　迪耶斯　阿爾貝托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ DIEZ, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃斯皮諾薩　波塔萊斯　略倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESPINOSA PORTALES, LLORENC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德烈亞　呂克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREA, LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆格爾　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUGEL, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧魯斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩斯　科塔哈雷納　艾茲貝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ CORTAJARENA, AITZIBER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛佩斯　馬丁內斯　艾蕾娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ MARTINEZ, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼特卡　艾托爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANTECA, AITOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於產生表位之胺基酸序列候選者的方法，該方法包含在一個或多個處理裝置中執行一神經網路以產生表位序列之候選者，其中該神經網路係由一經訓練用於產生胺基酸序列之神經網路進行微調而得；其中，該訓練係使用包含非表位之胺基酸序列的資料來執行，而該微調係使用表位之胺基酸序列的資料來執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for generating candidates of amino acid sequences of epitopes, the method comprising executing, in one or more processing devices, a neural network for generating candidates of sequences of epitopes, the neural network being a result of fine-tuning a neural network trained for generating amino acid sequences, wherein the training has been performed with data of amino acid sequences comprising amino acid sequences of non-epitopes, and the fine-tuning has been performed with data of amino acid sequences of epitopes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:處理裝置</p>
        <p type="p">102:神經網路</p>
        <p type="p">103:訓練資料</p>
        <p type="p">104:神經網路</p>
        <p type="p">105:微調資料</p>
        <p type="p">106:神經網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2107" publication-number="202631875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物及聚合物</chinese-title>
        <english-title>COMPOSITION AND POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C08L53/02</main-classification>
        <further-classification edition="200601120260420B">C08L25/08</further-classification>
        <further-classification edition="200601120260420B">C08L25/16</further-classification>
        <further-classification edition="200601120260420B">C08F220/68</further-classification>
        <further-classification edition="200601120260420B">C08G2/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小北悠暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKITA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原𨺓太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供顯示良好的基材選擇性，且可形成刷密度及耐熱性良好的聚合物刷之組成物及聚合物。  &lt;br/&gt;　　本發明之解決手段為一種組成物，其使用於選擇性修飾具有包含材質彼此相異之2個以上區域的表面之基材，其含有聚合物(A)與溶劑(S)，聚合物(A)具有源自苯乙烯之構成單元及/或源自苯乙烯衍生物之構成單元，且聚合物(A)於主鏈末端具有下述式(1)表示之基。  &lt;br/&gt;&lt;img align="absmiddle" height="35px" width="318px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2108" publication-number="202632989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150605</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於行動通訊中高效率延遲狀態回報之方法及裝置</chinese-title>
        <english-title>METHODS AND APPARATUSES FOR EFFICIENT DELAY STATUS REPORTING IN MOBILE COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260302B">H04W24/10</main-classification>
        <further-classification edition="202301120260302B">H04W72/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李衍毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出用於行動通訊中高效率延遲狀態回報（Delay Status Reporting，DSR）的方案。適用之裝置可從一網路節點接收包含於一無線資源控制（Radio Resource Control，RRC）訊令之一MAC-CellGroupConfig資訊元素（Information Element，IE）中之一設定，該設定可包含用於針對一邏輯通道群組（Logical Channel Group，LCG）內之一或多個邏輯通道觸發一延遲狀態回報（Delay Status Reporting，DSR）程序之一剩餘時間門檻、以及用於針對回報該LCG之一延遲狀態資訊之剩餘時間之複數回報門檻。所述裝置根據該剩餘時間門檻，針對該一或多個邏輯通道觸發該DSR程序。接著，所述裝置於觸發該DSR程序時，向該網路節點傳送一DSR媒體存取控制（Medium Access Control，MAC）控制元素（Control Element，CE），其中該DSR MAC CE包含該LCG之該延遲狀態資訊之複數項目（entry），每一項目皆關聯至該複數回報門檻之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various solutions for efficient delay status reporting (DSR) in mobile communications are described. An apparatus may receive a configuration included in a MAC-CellGroupConfig information element (IE) of a radio resource control (RRC) signaling from a network node. The configuration may include a remaining time threshold for triggering a DSR procedure for one or more logical channels within a logical channel group (LCG), and a plurality of reporting thresholds on remaining time for reporting delay status information of the LCG. Then, the apparatus may trigger the DSR procedure for the one or more logical channels based on the remaining time threshold. Responsive to triggering the DSR procedure, the apparatus may transmit a DSR medium access control (MAC) control element (CE) to the network node, which includes a plurality of entries of delay status information of the LCG, each entry is associated with one of the plurality of reporting thresholds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:程序</p>
        <p type="p">710~730:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2109" publication-number="202631576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗蝕劑組成物、抗蝕圖案的製造方法及鹽和樹脂</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C07C309/12</main-classification>
        <further-classification edition="200601120260401B">C07C309/17</further-classification>
        <further-classification edition="200601120260401B">C07C309/42</further-classification>
        <further-classification edition="200601120260401B">C07C309/58</further-classification>
        <further-classification edition="200601120260401B">C07C381/12</further-classification>
        <further-classification edition="200601120260401B">C07D333/76</further-classification>
        <further-classification edition="200601120260401B">C08F212/14</further-classification>
        <further-classification edition="200601120260401B">C08F220/38</further-classification>
        <further-classification edition="200601120260401B">G03F7/004</further-classification>
        <further-classification edition="200601120260401B">G03F7/039</further-classification>
        <further-classification edition="200601120260401B">G03F7/20</further-classification>
        <further-classification edition="200601120260401B">G03F7/38</further-classification>
        <further-classification edition="202601120260401B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺東祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERAHIGASHI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能條航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川幸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種可製造具有良好的CD均勻性的抗蝕劑圖案的鹽、樹脂及抗蝕劑組成物等。一種抗蝕劑組成物，含有式（I）所表示的鹽或包含式（IP）所表示的結構單元的樹脂。  &lt;br/&gt;&lt;img align="absmiddle" height="234px" width="485px" file="ed10218.JPG" alt="ed10218.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別表示氫原子、氟原子、碳數1～6的全氟烷基等；z表示0～6的任一整數；X&lt;sup&gt;0&lt;/sup&gt;表示-O-、-CO-、-S-等；mm1表示0或1；L&lt;sup&gt;1&lt;/sup&gt;及L&lt;sup&gt;2&lt;/sup&gt;分別表示單鍵或被取代/未被取代的烴基；W&lt;sup&gt;1&lt;/sup&gt;表示被取代/未被取代的脂環式烴基；A&lt;sup&gt;1&lt;/sup&gt;表示被取代/未被取代的烴基；Ar&lt;sup&gt;1&lt;/sup&gt;表示具有碘原子的芳香族烴基，該基可具有碘原子以外的取代基；X&lt;sup&gt;1&lt;/sup&gt;表示單鍵、-O-、-CO-等；R&lt;sup&gt;0&lt;/sup&gt;表示氫原子、鹵素原子或可具有鹵素原子的烷基；mm2表示1～5的整數；ZI&lt;sup&gt;+&lt;/sup&gt;表示有機陽離子]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2110" publication-number="202633300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>海綿滾輪及其滾輪支撐軸</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260430B">H10P52/00</main-classification>
        <further-classification edition="200601120260430B">A46B7/10</further-classification>
        <further-classification edition="200601120260430B">A46B11/02</further-classification>
        <further-classification edition="200601120260430B">A46B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中垣知幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAKI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口覚嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚田豪彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKADA, HIDEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">滾輪支撐軸10包括：滾輪支撐部14，具有覆蓋有滾輪主體2的外周面15；內部流路16，在滾輪支撐部14的內部沿軸向延伸且一端側被封閉；多個流出孔24，自內部流路16與外周面15連通；以及軸端開口18，為了使清洗液流入內部流路16而使內部流路16的另一端側向軸向外側開口。滾輪支撐部14至少在較軸向的中心25更靠另一端側具有內部流路16的剖面積S3大於軸端開口18的開口面積S1的流路擴大區域28。在流路擴大區域28中，相對於外周面15而言的多個流出孔24的面積佔有率為2%以上且小於6%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:海綿滾輪</p>
        <p type="p">2:海綿體(滾輪主體)</p>
        <p type="p">3:突起</p>
        <p type="p">4:旋轉軸</p>
        <p type="p">10:芯(滾輪支撐軸)</p>
        <p type="p">11:芯主體</p>
        <p type="p">12:驅動側軸端部</p>
        <p type="p">13:從動側軸端部</p>
        <p type="p">14:滾輪支撐部</p>
        <p type="p">15:滾輪支撐部的外周面</p>
        <p type="p">16:內部流路</p>
        <p type="p">17:貫通孔</p>
        <p type="p">18:軸端開口</p>
        <p type="p">24:流出孔</p>
        <p type="p">25:滾輪支撐部的軸向的中心</p>
        <p type="p">26:下游側區域</p>
        <p type="p">27:上游側區域</p>
        <p type="p">28:流路擴大區域</p>
        <p type="p">29:凸緣部</p>
        <p type="p">S1:軸端開口的開口面積</p>
        <p type="p">S3:內部流路的剖面積(與軸心正交的剖面積)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2111" publication-number="202633479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝用有孔玻璃基板及半導體封裝用玻璃基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/692</main-classification>
        <further-classification edition="202601120260427B">H10W70/68</further-classification>
        <further-classification edition="202601120260427B">H10W70/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧田雅貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市丸智憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIMARU, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田悠佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村優希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種玻璃基板，其於用作封裝基板的核心基板或中介層的情況下，難以破損。本發明的有孔玻璃基板G1、有孔玻璃基板G2為包括第一主表面G1a、第一主表面G2a、作為第一主表面G1a、第一主表面G2a的相反面的第二主表面G1b、第二主表面G2b、以及形成於第一主表面G1a、第一主表面G2a及第二主表面G1b、第二主表面G2b中的至少一主表面的孔的玻璃基板G1、玻璃基板G2，其特徵在於：孔包括形成於第一主表面G2a與第二主表面G2b中的至少一主表面的非貫通孔2、及/或將第一主表面G1a與第二主表面G1b之間貫通的貫通孔1，破裂韌性值為0.8 MPa·m&lt;sup&gt;0.5&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">G1:有孔玻璃基板/玻璃基板</p>
        <p type="p">G1a:第一主表面</p>
        <p type="p">1:貫通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2112" publication-number="202631789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體用接著劑、半導體用接著劑片及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C08G59/50</main-classification>
        <further-classification edition="200601120260430B">C09J163/00</further-classification>
        <further-classification edition="201801120260430B">C09J7/20</further-classification>
        <further-classification edition="200601120260430B">C09J11/06</further-classification>
        <further-classification edition="200601120260430B">C08K3/22</further-classification>
        <further-classification edition="200601120260430B">C08K3/36</further-classification>
        <further-classification edition="200601120260430B">C08K5/09</further-classification>
        <further-classification edition="202601120260430B">H10W74/40</further-classification>
        <further-classification edition="202601120260430B">H10W74/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川俣龍太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMATA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋吉利泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYOSHI, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茶花幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHABANA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮原正信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAHARA, MASANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示有一種含有熱固性樹脂、硬化劑及具有酸基之助熔劑化合物之半導體用接著劑。藉由以10℃/分鐘的升溫速度加熱半導體用接著劑之示差掃描熱量測量得到之DSC曲線中的60～155℃的發熱量為20J/g以下。在DSC曲線中，由硬化反應引起之發熱峰的起始溫度為150℃以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護膜</p>
        <p type="p">2:接著劑層</p>
        <p type="p">3:支撐基材</p>
        <p type="p">10:接著劑片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2113" publication-number="202632624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示驅動裝置以及亮度補償方法</chinese-title>
        <english-title>DISPLAY DRIVING DEVICE AND BRIGHTNESS COMPENSATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G09G3/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種顯示驅動裝置以及亮度補償方法。顯示驅動裝置包括亮度計算模組以及亮度增強模組。亮度計算模組用以計算第一區塊與鄰近第一區塊的多個第二區塊之間的多個亮度差異值，並計算多個亮度差異值的平均差異值。亮度增強模組耦接亮度計算模組，並用以根據平均差異值以及第一區塊的原始亮度值來取得亮度增強值。亮度增強模組用以根據亮度增強值提高第一區塊的亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driving device and a brightness compensation method are provided. The display driving device includes a brightness calculation module and a brightness enhancement module. The brightness calculation module calculates a plurality of brightness difference values between a first block and a plurality of second blocks adjacent to the first block, and calculates an average difference value of the plurality of brightness difference values. The brightness enhancement module is coupled to the brightness calculation module and is configured to obtain a brightness enhancement value based on the average difference value and the original brightness value of the first block. The brightness enhancement module is configured to increase the brightness of the first block based on the brightness enhancement value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示驅動裝置</p>
        <p type="p">110:處理器</p>
        <p type="p">120:記憶體</p>
        <p type="p">210:顯示面板</p>
        <p type="p">220:背光模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2114" publication-number="202631577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗蝕劑組成物及抗蝕劑圖案的製造方法以及鹽及樹脂</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C07C309/12</main-classification>
        <further-classification edition="200601120260401B">C07C309/15</further-classification>
        <further-classification edition="200601120260401B">C07C309/17</further-classification>
        <further-classification edition="200601120260401B">C07C309/42</further-classification>
        <further-classification edition="200601120260401B">C07C309/58</further-classification>
        <further-classification edition="200601120260401B">C07C381/12</further-classification>
        <further-classification edition="200601120260401B">C07D333/76</further-classification>
        <further-classification edition="200601120260401B">C08F220/38</further-classification>
        <further-classification edition="200601120260401B">G03F7/004</further-classification>
        <further-classification edition="200601120260401B">G03F7/038</further-classification>
        <further-classification edition="200601120260401B">G03F7/20</further-classification>
        <further-classification edition="200601120260401B">G03F7/38</further-classification>
        <further-classification edition="202601120260401B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺東祥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERAHIGASHI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能條航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川幸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種可製造具有良好的CD均勻性的抗蝕劑圖案的鹽、樹脂及抗蝕劑組成物等。一種抗蝕劑組成物，包含式（I）所表示的鹽或含有式（IP）所表示的結構單元的樹脂。  &lt;br/&gt;&lt;img align="absmiddle" height="397px" width="499px" file="ed10236.JPG" alt="ed10236.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;12&lt;/sup&gt;分別表示H原子、F原子等；X&lt;sup&gt;1&lt;/sup&gt;表示單鍵、-O-、-CO-等；W&lt;sup&gt;1&lt;/sup&gt;表示單鍵或被取代/未被取代的環狀烴基；L&lt;sup&gt;1&lt;/sup&gt;、A&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;10&lt;/sup&gt;及L&lt;sup&gt;20&lt;/sup&gt;分別表示單鍵或被取代/未被取代的烴基；W&lt;sup&gt;2&lt;/sup&gt;表示具有I原子的環狀烴基，該基亦可具有I原子以外的取代基；R&lt;sup&gt;2&lt;/sup&gt;表示被取代/未被取代的烴基；z表示0～6的整數，mm2表示1～5的整數，m3表示0～4的整數，mm1表示0或1，m2表示1或2，於m2=1時X表示I原子，於m2=2時X表示S原子，兩個R&lt;sup&gt;2&lt;/sup&gt;可一起形成環；R&lt;sup&gt;3&lt;/sup&gt;表示鹵素原子或被取代/未被取代的烴基；R&lt;sup&gt;20&lt;/sup&gt;表示H原子等；X&lt;sup&gt;20&lt;/sup&gt;表示單鍵、-O-等]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2115" publication-number="202631848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有三嗪環之聚合物及圖案形成用組合物</chinese-title>
        <english-title>TRIAZINE RING-CONTAINING POLYMER AND PATTERN-FORMING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260420B">C08K3/011</main-classification>
        <further-classification edition="200601120260420B">C08K5/06</further-classification>
        <further-classification edition="200601120260420B">C08G73/06</further-classification>
        <further-classification edition="200601120260420B">G03F7/028</further-classification>
        <further-classification edition="200601120260420B">C08L79/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中智恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中家直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAIE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種圖案形成用組合物，使用其所獲得之膜具有較高之折射率及優異之耐候性，並且圖案形成性變得良好。本發明係關於一種含有三嗪環之聚合物，其包含下述式(1)所表示之重複單元結構，具有至少1個三嗪環末端，且於該三嗪環末端之至少一部分鍵結有具有芳基胺基之基。  &lt;br/&gt;&lt;img align="absmiddle" height="241px" width="356px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2116" publication-number="202633433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括雙面高密度基板的半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE INCLUDING DUAL-SIDE HIGH-DENSITY SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡迪群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, DYI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括基板，所述基板包括核心層、貫穿核心層的核心穿孔、設置在核心層的一側上的第一重佈線路結構以及設置在核心層的相對側上且藉由核心穿孔電性耦合到第一重佈線路結構的第二重佈線路結構。第一重佈線路結構包括最外層介電層、設置在最外層介電層中和上並電性耦合到核心穿孔的最外層導電圖案、設置在最外層介電層和核心層之間的內部介電層。最外層介電層的最外表面包括比面向最外層介電層的內部介電層的表面更粗糙的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate which includes a core layer, a through core via penetrating through the core layer, a first redistribution structure disposed on a side of the core layer, and a second redistribution structure disposed on an opposing side of the core layer and electrically coupled to the first redistribution structure through the through core via. The first redistribution structure includes an outermost dielectric layer, an outermost conductive pattern disposed in and on the outermost dielectric layer and electrically coupled to the through core via, an inner dielectric layer between the outermost dielectric layer and the core layer. An outermost surface of the outermost dielectric layer includes a portion rougher than a surface of the inner dielectric layer facing the outermost dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基板</p>
        <p type="p">100a、101a:第一側</p>
        <p type="p">100b、101b:第二側</p>
        <p type="p">101:核心層</p>
        <p type="p">103:核心穿孔</p>
        <p type="p">110:第一重佈線路結構</p>
        <p type="p">110t、118t、119Pt、1191t:最外表面</p>
        <p type="p">111:第一導電接墊</p>
        <p type="p">112、122:第一介電層</p>
        <p type="p">113、123:第一導電圖案</p>
        <p type="p">114、124:第二介電層</p>
        <p type="p">115、125:第二導電圖案</p>
        <p type="p">116、126:第三介電層</p>
        <p type="p">116t:表面</p>
        <p type="p">117、127:第三導電圖案</p>
        <p type="p">118、128:最外層介電層</p>
        <p type="p">119、129:最外層導電圖案</p>
        <p type="p">119P、129P:接墊部分</p>
        <p type="p">120:第二重佈線路結構</p>
        <p type="p">121:第二導電接墊</p>
        <p type="p">210、210_1、210_2:晶片</p>
        <p type="p">210a:主動側</p>
        <p type="p">210b:背側</p>
        <p type="p">212:晶片接點</p>
        <p type="p">215:絕緣層</p>
        <p type="p">521:殘留物</p>
        <p type="p">1191、1291:表面處理層</p>
        <p type="p">A、B、C:虛線框</p>
        <p type="p">M1:細縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2117" publication-number="202632632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分級閘極電壓控制</chinese-title>
        <english-title>STAGED GATE VOLTAGE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G09G3/34</main-classification>
        <further-classification edition="201901120260423B">G02F1/167</further-classification>
        <further-classification edition="201901120260423B">G02F1/16766</further-classification>
        <further-classification edition="201901120260423B">G02F1/1685</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾孟森　卡爾瑞蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMUNDSON, KARL RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班度夫　余弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEN-DOV, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種光電顯示器及驅動方法。該光電顯示器包含設置於一共用電極與一背板之間的一層電泳材料。該背板包含數個像素電極之一陣列，每一者連結至一像素電晶體。一控制器提供時間相依電壓至每一像素電晶體之閘極線、源極線、及該共用電極。該驅動方法包含施加一第一級電壓至閘極線。該第一級電壓具有一第一量值，大致為置該像素電晶體於一不導電狀態下之一低閘極電壓之一半。在閘極線上保持該第一級電壓持續一第一時期。接著，一第二級電壓施加至閘極線，其中該第二級電壓具有一第二量值，大致為置該像素電晶體於該不導電狀態下之該低閘極電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electro-optic display and driving method are disclosed. The electro-optic display includes a layer of electrophoretic material disposed between a common electrode and a backplane. The backplane includes an array of pixel electrodes, each coupled to a pixel transistor. A controller provides time-dependent voltages to the gate line, the source line, and the common electrode of each pixel transistor. The driving method includes applying a first stage voltage to the gate line. The first stage voltage has a first magnitude that is substantially half of a gate low voltage for placing the pixel transistor in a non-conducting state. The first stage voltage is maintained on the gate line for a first period of time. Then, a second stage voltage is applied to the gate line, where the second stage voltage has a second magnitude that is substantially the gate low voltage for placing the pixel transistor in the non-conducting state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2118" publication-number="202631042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於施加美容產品的塗抹器系統</chinese-title>
        <english-title>APPLICATOR SYSTEM FOR APPLYING A COSMETIC PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A45D44/00</main-classification>
        <further-classification edition="200601120260429B">A45D34/04</further-classification>
        <further-classification edition="200601120260429B">A61M35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉列維奇　羅曼朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUILLEVIC, ROMAIN JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊查諾伊　馬克埃米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LECHANOINE, MARC EMILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加爾勒　阿米特拉克什曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARLE, AMIT LAXMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗克　馬蒂厄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOULANGER, MATHIEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於施配及施加一美容物質之產品施加裝置包括：一塗抹器本體，其具有一第一端、一第二端、及界定延伸於其間之一縱軸的一細長本體；一塗抹頭，其與該塗抹器本體的該第一端可操作地耦接；及至少一個細長刷毛，其具有與該塗抹頭的該外表面可操作地耦接的一第一端，及從該第一端遠端地延伸的一第二端。該塗抹頭包括經調適以收集並施加該美容物質的一外表面，及與其可操作地耦接以將該塗抹頭與該塗抹器本體的該第一端耦接的一頸部分。該至少一個細長刷毛的該第二端在朝向該第二端的該方向上於截面外尺寸上具有一非線性改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A product application device for dispensing and applying a cosmetic substance includes an applicator body having a first end, a second end, and an elongated body defining a longitudinal axis extending therebetween, an applicator head operably coupled with the first end of the applicator body, and at least one elongated bristle having a first end operably coupled with the outer surface of the applicator head and a second end extending distally from the first end. The applicator head includes an outer surface adapted to collect and apply the cosmetic substance and a neck portion operably coupled therewith to couple the applicator head with the first end of the applicator body. The second end of the at least one elongated bristle has a non-linear change in cross-sectional outer dimension in the direction towards the second end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">101:美容物質</p>
        <p type="p">102:容器</p>
        <p type="p">102a:第一端</p>
        <p type="p">102b:第二端</p>
        <p type="p">103:空腔</p>
        <p type="p">110:塗抹器</p>
        <p type="p">112:塗抹器本體</p>
        <p type="p">112a:第一端</p>
        <p type="p">112b:第二端</p>
        <p type="p">112c:細長本體</p>
        <p type="p">116:握柄</p>
        <p type="p">120:塗抹頭</p>
        <p type="p">120a:外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2119" publication-number="202631463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於保護封閉體之篡改易顯帶之卡盤</chinese-title>
        <english-title>CHUCKS FOR PROTECTING TAMPER-EVIDENCE BAND OF CLOSURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B65D41/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商原始材料營運公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIGIN MATERIALS OPERATING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈南　傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAN, JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克莉曼　萊利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEEMAN, RILEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了用於將一封閉體安裝至一容器之一修整體上之卡盤。進一步提供了用於將一封閉體安裝至一容器之一修整體上之系統。進一步提供了將一封閉體接合至一容器之一修整體上之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Chucks for a closure for mounting onto a finish of a container are provided herein. Systems for mounting a closure onto a finish of a container are further provided. Methods of engaging a closure onto a finish of a container are further provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2120" publication-number="202631892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性聚矽氧組成物及其固化物</chinese-title>
        <english-title>CURABLE SILICONE COMPOSITION AND CURED BODY THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">C08L83/04</main-classification>
        <further-classification edition="200601120260423B">C08L83/07</further-classification>
        <further-classification edition="200601120260423B">C08L83/14</further-classification>
        <further-classification edition="200601120260423B">C08G77/12</further-classification>
        <further-classification edition="200601120260423B">C08K5/14</further-classification>
        <further-classification edition="201801120260423B">C08K3/013</further-classification>
        <further-classification edition="201801120260423B">C08K3/014</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本發明之目的在於提供一種固化性聚矽氧組成物及其用途，其獲得之固化物在室溫附近顯示出高硬度及機械強度（包括拉伸強度及伸長率），永久伸長特性優異，並且顯示出優異之應力衰減性、振動吸收性、衝擊吸收性等黏彈特性，各特性得到良好平衡。  &lt;br/&gt;[解決手段] 一種固化性聚矽氧組成物、其固化物及其於半導體等中之用途，該固化性聚矽氧組成物在特定之質量%範圍內包含(A1)具有含碳-碳雙鍵之固化反應性官能基之有機聚矽氧烷樹脂、(A2)不具有該固化反應性官能基之有機聚矽氧烷樹脂以及(B)具有該固化反應性官能基之特定鏈長之直鏈狀有機聚矽氧烷，且含有(C)固化劑，並且(A1)成分與(A2)成分之合計量為55質量%以下，(A1)成分與(A2)成分之合計量/(B)成分之質量比為2.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2121" publication-number="202631758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性聚矽氧組成物、其固化物及其製造方法</chinese-title>
        <english-title>CURABLE SILICONE COMPOSITION, CURED BODY THEREFROM AND MANUFACTURING PROCESS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08F283/12</main-classification>
        <further-classification edition="200601120260422B">C08L83/05</further-classification>
        <further-classification edition="200601120260422B">C08G77/08</further-classification>
        <further-classification edition="200601120260422B">C08K3/36</further-classification>
        <further-classification edition="200601120260422B">C08K9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題  &lt;br/&gt;本發明提供一種組成物，其可大量含有功能性無機填充料，未固化狀態之組成物於室溫下足夠硬，即便當壓縮成型時亦具有充分之硬度，以高溫下之高流動性為特徵，可形成熱熔性等優異之固化物。  &lt;br/&gt;解決手段  &lt;br/&gt;一種固化性聚矽氧組成物、其成型物及其用途，該固化性聚矽氧組成物之特徵在於，含有：(A)軟化點為30℃以上，具有固化反應性官能基，且含有20莫耳%以上之T單元的有機聚矽氧烷樹脂；(B)有機氫聚矽氧烷；(C)含矽氫化反應用催化劑之熱塑性樹脂微粒子；(D)功能性無機填充料；(E)分子內不具有矽氫基反應性官能基，矽烷醇基之含量為5.0莫耳%以下，且含有20莫耳%以上之T單元的有機聚矽氧烷樹脂；且作為組成物整體展現熱熔性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2122" publication-number="202631899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性聚矽氧組成物、其固化物及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08L83/14</main-classification>
        <further-classification edition="200601120260422B">C08G77/52</further-classification>
        <further-classification edition="201801120260422B">C08K3/013</further-classification>
        <further-classification edition="200601120260422B">C08K9/06</further-classification>
        <further-classification edition="200601120260422B">C08K3/22</further-classification>
        <further-classification edition="200601120260422B">C08K3/36</further-classification>
        <further-classification edition="200601120260422B">C09K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題  &lt;br/&gt;本發明提供一種組成物，其可大量含有功能性無機填充料，未固化狀態之組成物於室溫下足夠硬，即便當壓縮成型為丸狀或錠狀時亦具有充分之硬度，高溫下之熔融黏度低，以高溫下之高流動性為特徵，可形成熱熔性、間隙填充性及均一性優異之固化物。  &lt;br/&gt;解決手段  &lt;br/&gt;一種熱熔性固化性聚矽氧組成物、其成型物及其用途，該熱熔性固化性聚矽氧組成物以特定質量%含有(A)熱固性聚矽氧、(B)平均粒徑為0.01至1.0μm、1.0至10.0μm及超過10.0μm之3種功能性無機填充料，且含有藉由選自特定之含長鏈烷基之水解性矽烷及特定之直鏈狀有機聚矽氧烷中的1種以上之表面處理劑進行處理的功能性填充料混合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2123" publication-number="202633210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池和太陽能模組，以及製造太陽能電池和太陽能模組的方法</chinese-title>
        <english-title>A SOLAR CELL AND A SOLAR MODULE, AND METHODS OF MANUFACTURING A SOLAR CELL AND A SOLAR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F77/20</main-classification>
        <further-classification edition="202501120260504B">H10F10/16</further-classification>
        <further-classification edition="200601120260504B">C23C16/52</further-classification>
        <further-classification edition="202501120260504B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＲＥＣ太陽能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REC SOLAR PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達爾　索拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDAL, SOURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　銘嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, MIN SUNG DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　源鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNG, GUAN KIAN ERNEST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種太陽能電池，包括具有背表面的基板以及配置於該基板的該背表面上的交叉指背接點結構。該交叉指背接點結構包括第一電荷載子收集器和與該第一電荷載子收集器交叉指狀排列的第二電荷載子收集器。該第一電荷載子收集器包括配置於該基板的該背表面上的複數個A元件、以及包括複數個B元件，該A元件包括具有第一摻雜類型的半導體材料，每個B元件配置於各自A元件上，該B元件包括具有第二摻雜類型的半導體材料。該第二電荷載子收集器包括配置於該基板的該背表面上的複數個C元件，該C元件與該A元件交叉指狀排列，並包括具有該第二摻雜類型的半導體材料。該交叉指背接點結構更包括複數個絕緣障壁元件，每個障壁元件插入於相鄰的A與C元件的各自成對之間。亦提供一種包括所述太陽能電池的太陽能模組，以及製造所述太陽能電池和太陽能模組的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a solar cell comprising a substrate having a back surface and an interdigitated back contact structure arranged on the back surface of the substrate. The interdigitated back contact structure comprises a first charge-carrier collector and a second charge-carrier collector interdigitated with the first charge-carrier collector. The first charge-carrier collector comprising a plurality of A-elements arranged on the back surface of the substrate, the A-elements comprising semiconductor material having a first doping type, and a plurality of B-elements, each B-element arranged on a respective A-element, the B-elements comprising semiconductor material having a second doping type. The second charge-carrier collector comprises a plurality of C-elements arranged on the back surface of the substrate, the C-elements interdigitated with the A-elements and comprising semiconductor material having the second doping type. The interdigitated back contact structure further comprises a plurality of insulating barrier elements, each barrier element interposed between a respective pair of adjacent A- and C-elements. A solar module comprising said solar cell, and methods of manufacturing said solar cell and solar module are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:前表面</p>
        <p type="p">1b:背表面</p>
        <p type="p">2:背鈍化層</p>
        <p type="p">2b:背表面</p>
        <p type="p">3:障壁元件</p>
        <p type="p">4:A元件</p>
        <p type="p">5:連續a-Si(p)層</p>
        <p type="p">5a:第一非晶半導體元件</p>
        <p type="p">5b:C元件</p>
        <p type="p">5c:第三非晶半導體元件</p>
        <p type="p">6:p型奈米晶矽(nc-Si(p))的連續層</p>
        <p type="p">6a:B元件</p>
        <p type="p">6b:各自C元件</p>
        <p type="p">7a:第一TCO元件</p>
        <p type="p">7b:第二TCO元件</p>
        <p type="p">8a:第一電極</p>
        <p type="p">8b:第二電極</p>
        <p type="p">9:前鈍化層</p>
        <p type="p">10:第一太陽能電池</p>
        <p type="p">11:抗反射塗層</p>
        <p type="p">14:本質非晶矽元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2124" publication-number="202633192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池和太陽能模組、以及製造該太陽能電池和太陽能模組的方法</chinese-title>
        <english-title>A SOLAR CELL AND A SOLAR MODULE, AND METHODS OF MANUFACTURING A SOLAR CELL AND A SOLAR MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10F10/164</main-classification>
        <further-classification edition="202501120260504B">H10F77/14</further-classification>
        <further-classification edition="202501120260504B">H10F77/1223</further-classification>
        <further-classification edition="200601120260504B">C23C16/02</further-classification>
        <further-classification edition="200601120260504B">C23C16/52</further-classification>
        <further-classification edition="202501120260504B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＲＥＣ太陽能公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REC SOLAR PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼達爾　索拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDAL, SOURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　源鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SNG, GUAN KIAN ERNEST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　銘嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, MIN SUNG DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">各種實施例提供一種太陽能電池，其包括具有背表面的基板以及配置於該基板的該背表面上的交叉指背接點結構。該交叉指背接點結構包括第一電荷載子收集器，該第一電荷載子收集器包括配置於該基板的該背表面上的複數個A元件、以及包括複數個B元件，該A元件包括具有第一摻雜類型的半導體材料，每個B元件配置於各自A元件上，該B元件包括具有第二摻雜類型的半導體材料。該交叉指背接點結構也包括與該第一電荷載子收集器交叉指狀排列的第二電荷載子收集器。該第二電荷載子收集器包括配置於該基板的該背表面上的複數個C元件，該C元件與該A元件交叉指狀排列，並包括具有該第二摻雜類型的半導體材料。該交叉指背接點結構更包括複數個隔離元件，每個隔離元件插入於相鄰的A與C元件的各自成對之間。每個隔離元件包括絕緣障壁元件、以及包括具有該第一摻雜類型的半導體材料的A*元件。該A*元件配置於該障壁元件上，且具有比相鄰的A元件更小的厚度。亦提供了製造所述太陽能電池的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments provide a solar cell comprising a substrate having a back surface and an interdigitated back contact structure arranged on the back surface of the substrate. The interdigitated back contact structure comprises a first charge-carrier collector comprising a plurality of A-elements arranged on the back surface of the substrate, the A-elements comprising semiconductor material having a first doping type, and a plurality of B-elements, each B-element arranged on a respective A-element, the B-elements comprising semiconductor material having a second doping type. The interdigitated back contact structure also comprises a second charge-carrier collector interdigitated with the first charge-carrier collector. The second charge-carrier collector comprises a plurality of C-elements arranged on the back surface of the substrate, the C-elements interdigitated with the A-elements and comprising semiconductor material having the second doping type. The interdigitated back contact structure further comprises a plurality of isolation elements, each isolation element interposed between a respective pair of adjacent A- and C-elements. Each isolation element comprises an insulating barrier element, and an A*-element comprising semiconductor material having the first doping type. The A*-element is arranged on the barrier element and has a thickness less than an adjacent A-element. Methods of manufacturing said solar cell are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">1a:前表面</p>
        <p type="p">1b:背表面</p>
        <p type="p">2:背鈍化層</p>
        <p type="p">2b:背表面</p>
        <p type="p">3:障壁元件</p>
        <p type="p">4*:A*元件</p>
        <p type="p">4:A元件</p>
        <p type="p">5:連續a-Si(p)層</p>
        <p type="p">5a:第一非晶半導體元件</p>
        <p type="p">5b:C元件</p>
        <p type="p">5c:第三非晶半導體元件</p>
        <p type="p">6:p型奈米晶矽(nc-Si(p))</p>
        <p type="p">6a:B元件</p>
        <p type="p">6a*:B*元件</p>
        <p type="p">6b:各自C元件</p>
        <p type="p">7a:第一TCO元件</p>
        <p type="p">7b:第二TCO元件</p>
        <p type="p">8a:第一電極</p>
        <p type="p">8b:第二電極</p>
        <p type="p">9:前鈍化層</p>
        <p type="p">10:第一太陽能電池</p>
        <p type="p">11:抗反射塗層</p>
        <p type="p">D:深度方向</p>
        <p type="p">L:縱向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2125" publication-number="202632959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於串流化之裝置、伺服器、非暫態數位儲存媒體、信號及方法、與解碼器</chinese-title>
        <english-title>DEVICE, SERVER, NON-TRANSITORY DIGITAL STORAGE MEDIUM, SIGNAL AND METHOD FOR STREAMING, AND DECODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260421B">H04N21/238</main-classification>
        <further-classification edition="201101120260421B">H04N21/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德柏斯奇　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PODBORSKI, DIMITRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述針對媒體內容串流化之各種概念。一些概念允許以一空間不均等方式串流化空間場景內容，以使得使用者之可見品質增加，或串流化擷取位點處之處理複雜度或必需頻寬減小。其他概念允許以增大對其他應用情境之適用性之方式串流化空間場景內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various concepts for media content streaming are described. Some allow for streaming spatial scene content in a spatially unequal manner so that the visible quality for the user is increased, or the processing complexity or necessary bandwidth at the streaming retrieval site is decreased. Other allow for streaming spatial scene content in a manner enlarging the applicability to further application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用戶端</p>
        <p type="p">20:伺服器</p>
        <p type="p">22:通訊</p>
        <p type="p">24:抬頭顯示器</p>
        <p type="p">26:內部顯示器</p>
        <p type="p">28:檢視區段</p>
        <p type="p">30:時間變化之空間場景</p>
        <p type="p">32:內部定向感測器</p>
        <p type="p">34:儲存器</p>
        <p type="p">36:控制器</p>
        <p type="p">38:串流修改器</p>
        <p type="p">40:用戶端裝置或控制器</p>
        <p type="p">42:解碼器</p>
        <p type="p">44:再投影器</p>
        <p type="p">46:媒體片段</p>
        <p type="p">48:空間區段</p>
        <p type="p">50:圖塊</p>
        <p type="p">52:視訊</p>
        <p type="p">54:時間片段</p>
        <p type="p">Q1,Q2:品質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2126" publication-number="202632952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於串流化之裝置、伺服器、非暫態數位儲存媒體、信號及方法、與解碼器</chinese-title>
        <english-title>DEVICE, SERVER, NON-TRANSITORY DIGITAL STORAGE MEDIUM, SIGNAL AND METHOD FOR STREAMING, AND DECODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260422B">H04N19/167</main-classification>
        <further-classification edition="201401120260422B">H04N19/70</further-classification>
        <further-classification edition="201101120260422B">H04N21/4728</further-classification>
        <further-classification edition="201101120260422B">H04N21/2662</further-classification>
        <further-classification edition="201801120260422B">H04N13/332</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德柏斯奇　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PODBORSKI, DIMITRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述針對媒體內容串流化之各種概念。一些概念允許以一空間不均等方式串流化空間場景內容，以使得使用者之可見品質增加，或串流化擷取位點處之處理複雜度或必需頻寬減小。其他概念允許以增大對其他應用情境之適用性之方式串流化空間場景內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various concepts for media content streaming are described. Some allow for streaming spatial scene content in a spatially unequal manner so that the visible quality for the user is increased, or the processing complexity or necessary bandwidth at the streaming retrieval site is decreased. Other allow for streaming spatial scene content in a manner enlarging the applicability to further application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用戶端</p>
        <p type="p">20:伺服器</p>
        <p type="p">22:通訊</p>
        <p type="p">24:抬頭顯示器</p>
        <p type="p">26:內部顯示器</p>
        <p type="p">28:檢視區段</p>
        <p type="p">30:時間變化之空間場景</p>
        <p type="p">32:內部定向感測器</p>
        <p type="p">34:儲存器</p>
        <p type="p">36:控制器</p>
        <p type="p">38:串流修改器</p>
        <p type="p">40:用戶端裝置或控制器</p>
        <p type="p">42:解碼器</p>
        <p type="p">44:再投影器</p>
        <p type="p">46:媒體片段</p>
        <p type="p">48:空間區段</p>
        <p type="p">50:圖塊</p>
        <p type="p">52:視訊</p>
        <p type="p">54:時間片段</p>
        <p type="p">Q1,Q2:品質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2127" publication-number="202632953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於串流化之裝置、伺服器、非暫態數位儲存媒體、信號及方法、與解碼器</chinese-title>
        <english-title>DEVICE, SERVER, NON-TRANSITORY DIGITAL STORAGE MEDIUM, SIGNAL AND METHOD FOR STREAMING, AND DECODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260422B">H04N19/167</main-classification>
        <further-classification edition="201101120260422B">H04N21/6587</further-classification>
        <further-classification edition="201101120260422B">H04N21/2343</further-classification>
        <further-classification edition="201101120260422B">H04N21/2662</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德柏斯奇　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PODBORSKI, DIMITRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述針對媒體內容串流化之各種概念。一些概念允許以一空間不均等方式串流化空間場景內容，以使得使用者之可見品質增加，或串流化擷取位點處之處理複雜度或必需頻寬減小。其他概念允許以增大對其他應用情境之適用性之方式串流化空間場景內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various concepts for media content streaming are described. Some allow for streaming spatial scene content in a spatially unequal manner so that the visible quality for the user is increased, or the processing complexity or necessary bandwidth at the streaming retrieval site is decreased. Other allow for streaming spatial scene content in a manner enlarging the applicability to further application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用戶端</p>
        <p type="p">20:伺服器</p>
        <p type="p">22:通訊</p>
        <p type="p">24:抬頭顯示器</p>
        <p type="p">26:內部顯示器</p>
        <p type="p">28:檢視區段</p>
        <p type="p">30:時間變化之空間場景</p>
        <p type="p">32:內部定向感測器</p>
        <p type="p">34:儲存器</p>
        <p type="p">36:控制器</p>
        <p type="p">38:串流修改器</p>
        <p type="p">40:用戶端裝置或控制器</p>
        <p type="p">42:解碼器</p>
        <p type="p">44:再投影器</p>
        <p type="p">46:媒體片段</p>
        <p type="p">48:空間區段</p>
        <p type="p">50:圖塊</p>
        <p type="p">52:視訊</p>
        <p type="p">54:時間片段</p>
        <p type="p">Q1,Q2:品質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2128" publication-number="202632960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於串流化之裝置、伺服器、非暫態數位儲存媒體、信號及方法、與解碼器</chinese-title>
        <english-title>DEVICE, SERVER, NON-TRANSITORY DIGITAL STORAGE MEDIUM, SIGNAL AND METHOD FOR STREAMING, AND DECODER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260422B">H04N21/2662</main-classification>
        <further-classification edition="201101120260422B">H04N21/2343</further-classification>
        <further-classification edition="201401120260422B">H04N19/167</further-classification>
        <further-classification edition="201101120260422B">H04N21/4728</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德柏斯奇　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PODBORSKI, DIMITRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述針對媒體內容串流化之各種概念。一些概念允許以一空間不均等方式串流化空間場景內容，以使得使用者之可見品質增加，或串流化擷取位點處之處理複雜度或必需頻寬減小。其他概念允許以增大對其他應用情境之適用性之方式串流化空間場景內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various concepts for media content streaming are described. Some allow for streaming spatial scene content in a spatially unequal manner so that the visible quality for the user is increased, or the processing complexity or necessary bandwidth at the streaming retrieval site is decreased. Other allow for streaming spatial scene content in a manner enlarging the applicability to further application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用戶端</p>
        <p type="p">20:伺服器</p>
        <p type="p">22:通訊</p>
        <p type="p">24:抬頭顯示器</p>
        <p type="p">26:內部顯示器</p>
        <p type="p">28:檢視區段</p>
        <p type="p">30:時間變化之空間場景</p>
        <p type="p">32:內部定向感測器</p>
        <p type="p">34:儲存器</p>
        <p type="p">36:控制器</p>
        <p type="p">38:串流修改器</p>
        <p type="p">40:用戶端裝置或控制器</p>
        <p type="p">42:解碼器</p>
        <p type="p">44:再投影器</p>
        <p type="p">46:媒體片段</p>
        <p type="p">48:空間區段</p>
        <p type="p">50:圖塊</p>
        <p type="p">52:視訊</p>
        <p type="p">54:時間片段</p>
        <p type="p">Q1,Q2:品質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2129" publication-number="202631588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板的製造方法、含硼膜的製造方法、含硼膜形成材料及含硼化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C07D215/58</main-classification>
        <further-classification edition="200601120260428B">C23C16/34</further-classification>
        <further-classification edition="200601120260428B">C23C16/38</further-classification>
        <further-classification edition="200601120260428B">C07F5/05</further-classification>
        <further-classification edition="202601120260428B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤一馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田英司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成低介電常數的含硼膜的半導體基板的製造方法、含硼膜的製造方法、含硼膜形成材料及含硼化合物。一種半導體基板的製造方法，包括使基板與含硼化合物接觸的步驟，所述含硼化合物包含選自由下述式（1）所表示的化合物及下述式（2）所表示的化合物所組成的群組中的至少一種。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="351px" width="492px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式（1）～式（2）中，X為具有碳數1～20的含氮雜環的一價基或下述式（a）所表示的一價基；R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;3&lt;/sup&gt;為碳數1～40的一價有機基或氫原子；n為1～4的整數）  &lt;br/&gt;&lt;img align="absmiddle" height="43px" width="86px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="271px" width="245px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式（a）中，R&lt;sup&gt;4&lt;/sup&gt;～R&lt;sup&gt;5&lt;/sup&gt;為碳數1～40的一價有機基，或者R&lt;sup&gt;4&lt;/sup&gt;～R&lt;sup&gt;5&lt;/sup&gt;相互結合並與該些所鍵結的氮原子一起構成環員數3～10的含氮雜環；R&lt;sup&gt;6&lt;/sup&gt;為氫原子或碳數1～3的烷基）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2130" publication-number="202631793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電荷傳輸性材料、油墨組成物、有機電子元件、有機電致發光元件及光電轉換元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G61/12</main-classification>
        <further-classification edition="200601120260504B">C08L65/00</further-classification>
        <further-classification edition="200601120260504B">C08K5/55</further-classification>
        <further-classification edition="201401120260504B">C09D11/03</further-classification>
        <further-classification edition="201401120260504B">C09D11/102</further-classification>
        <further-classification edition="201401120260504B">C09D11/52</further-classification>
        <further-classification edition="200601120260504B">H01B1/12</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
        <further-classification edition="200601120260504B">H05B33/10</further-classification>
        <further-classification edition="202301120260504B">H10K30/00</further-classification>
        <further-classification edition="202301120260504B">H10K50/16</further-classification>
        <further-classification edition="202301120260504B">H10K59/00</further-classification>
        <further-classification edition="202301120260504B">H10K85/10</further-classification>
        <further-classification edition="202301120260504B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮貴紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYA, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島伊織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, IORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施方式是有關於一種電荷傳輸性材料，其含有：離子相互作用能量為120 kcal/mol以下的離子性化合物、以及具有聚合性官能基的電荷傳輸性聚合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2131" publication-number="202631857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電荷傳輸性材料、油墨組成物、有機電子元件、有機電致發光元件及光電轉換元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08K5/19</main-classification>
        <further-classification edition="200601120260504B">C08K5/3432</further-classification>
        <further-classification edition="200601120260504B">C08K5/3437</further-classification>
        <further-classification edition="200601120260504B">C08K5/55</further-classification>
        <further-classification edition="200601120260504B">C08L65/00</further-classification>
        <further-classification edition="200601120260504B">C09D165/00</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="200601120260504B">C09D5/24</further-classification>
        <further-classification edition="201401120260504B">C09D11/52</further-classification>
        <further-classification edition="200601120260504B">H05B33/12</further-classification>
        <further-classification edition="202501120260504B">H10F30/20</further-classification>
        <further-classification edition="202301120260504B">H10K30/85</further-classification>
        <further-classification edition="202601120260504B">H10K39/00</further-classification>
        <further-classification edition="202301120260504B">H10K50/16</further-classification>
        <further-classification edition="202301120260504B">H10K59/00</further-classification>
        <further-classification edition="202301120260504B">H10K71/13</further-classification>
        <further-classification edition="202301120260504B">H10K85/10</further-classification>
        <further-classification edition="202301120260504B">H10K85/60</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮貴紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYA, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島伊織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, IORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施方式是有關於一種電荷傳輸性材料，其含有：包含陽離子的離子性化合物、以及具有聚合性官能基的電荷傳輸性聚合物，所述陽離子包含選自由吡啶環、喹啉環、異喹啉環、及吖啶環所組成的群組中的至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2132" publication-number="202631664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造類Ｉｇ分子之方法及手段</chinese-title>
        <english-title>METHODS AND MEANS FOR THE PRODUCTION OF IG-LIKE MOLECULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/18</main-classification>
        <further-classification edition="200601120260504B">C07K16/46</further-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商美勒斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERUS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　克呂夫　科內利斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE KRUIF, CORNELIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德里克斯　林達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDRIKS, LINDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於適用於治療人類疾病之異二聚體蛋白質及其製造及收集之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to heterodimeric proteins, and their methods of production and collection, that are useful to treat human disease.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2133" publication-number="202631970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體清洗用組成物及清洗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C11D1/18</main-classification>
        <further-classification edition="200601120260401B">C11D1/29</further-classification>
        <further-classification edition="200601120260401B">C11D1/72</further-classification>
        <further-classification edition="200601120260401B">C11D3/30</further-classification>
        <further-classification edition="200601120260401B">C11D3/34</further-classification>
        <further-classification edition="200601120260401B">C11D3/36</further-classification>
        <further-classification edition="200601120260401B">C11D3/37</further-classification>
        <further-classification edition="200601120260401B">C11D3/43</further-classification>
        <further-classification edition="200601120260401B">C11D7/26</further-classification>
        <further-classification edition="200601120260401B">C11D7/32</further-classification>
        <further-classification edition="200601120260401B">C11D7/34</further-classification>
        <further-classification edition="200601120260401B">C11D7/36</further-classification>
        <further-classification edition="200601120260401B">C11D7/50</further-classification>
        <further-classification edition="200601120260401B">B08B3/08</further-classification>
        <further-classification edition="202601120260401B">H10P52/40</further-classification>
        <further-classification edition="202601120260401B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可減少被處理體的表面的腐蝕等損傷、且可自被處理體的表面有效率地去除污染的半導體清洗用組成物及使用其的清洗方法。本發明的半導體清洗用組成物含有：化合物（A），具有選自由胺基及其鹽所組成的群組中的至少一種基、選自由磺基及其鹽所組成的群組中的至少一種基、以及具有碳數4～12的環狀結構的基；膦酸（B）；以及液狀介質，pH為3.0以上且9.0以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2134" publication-number="202633487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用互補式晶粒至晶粒介面傳輸及接收資料之系統、方法及設備</chinese-title>
        <english-title>SYSTEM, METHOD, AND APPARATUS FOR TRANSMITTING AND RECEIVING DATA USING A COMPLEMENTARY DIE-TO-DIE INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10W72/00</main-classification>
        <further-classification edition="200601120260429B">G06F13/38</further-classification>
        <further-classification edition="200601120260429B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡羅　索吉歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLOR, SERGIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達維多芙　丹尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIDOV, DANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利浦　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PILIP, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷斯姆　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESHEM, NIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席密特　里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIMET, LIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包括一積體電路的一第一實例及一第二實例。該等積體電路包括具有一實體引腳布局的各別外部介面，該實體引腳布局具有位於相對於一對稱軸的互補位置上之用於一特定匯流排的傳輸及接收引腳。該積體電路之該第一實例及該第二實例的該等外部介面經定位使得該第一實例上之用於該給定I/O信號的該等傳輸及接收引腳分別與該第二實例上之用於該給定I/O信號的該等接收及傳輸引腳對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101a:積體電路</p>
        <p type="p">101b:積體電路</p>
        <p type="p">110a:外部介面；介面</p>
        <p type="p">110b:外部介面；介面</p>
        <p type="p">115a:I/O信號</p>
        <p type="p">115b:I/O信號</p>
        <p type="p">120a:傳輸引腳</p>
        <p type="p">120b:傳輸引腳</p>
        <p type="p">125a:接收引腳</p>
        <p type="p">125b:接收引腳</p>
        <p type="p">130:互補位置</p>
        <p type="p">135:實體距離</p>
        <p type="p">140:對稱軸</p>
        <p type="p">145:配線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2135" publication-number="202631350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教示裝置及機器人系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">B25J9/22</main-classification>
        <further-classification edition="200601120260331B">G05B19/42</further-classification>
        <further-classification edition="200601120260331B">B25J9/16</further-classification>
        <further-classification edition="200601120260331B">B25J19/02</further-classification>
        <further-classification edition="200601120260331B">B25J13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>流石凪彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASUGA, NAGISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">教示裝置是機器人的教示用的教示裝置，具備：座標系統關係算出部，根據關於座標系統的設定資訊、與關於視覺感測器的位置及姿勢的資訊，來算出視覺感測器的朝向與座標系統之關係；及座標系統顯示部，根據就機器人的操作用的第1座標系統而藉由座標系統關係算出部所算出的關係，在顯示藉由視覺感測器來拍攝之圖像的顯示畫面上，顯示表示第1座標系統之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:教示操作盤</p>
        <p type="p">13:顯示部</p>
        <p type="p">14:操作部</p>
        <p type="p">20:圖像處理裝置</p>
        <p type="p">30:機器人</p>
        <p type="p">33:手部</p>
        <p type="p">50:機器人控制裝置</p>
        <p type="p">51:處理器</p>
        <p type="p">52:記憶部</p>
        <p type="p">70:視覺感測器</p>
        <p type="p">100:機器人系統</p>
        <p type="p">151:動作控制部</p>
        <p type="p">152:座標系統資訊設定部</p>
        <p type="p">153:視覺感測器資訊設定部</p>
        <p type="p">154:座標系統關係算出部</p>
        <p type="p">155:顯示設定部</p>
        <p type="p">156:座標系統顯示部</p>
        <p type="p">157:圖像旋轉部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2136" publication-number="202632063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿除害方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260210B">C23C16/50</main-classification>
        <further-classification edition="200601120260210B">C23C16/455</further-classification>
        <further-classification edition="200601120260210B">B08B3/04</further-classification>
        <further-classification edition="200601120260210B">B08B3/10</further-classification>
        <further-classification edition="200601120260210B">H05H1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商康肯環保設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANKEN TECHNO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤道彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, MICHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮前智信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMAE, TOMONOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部泰成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TAISEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿除害方法，對由電漿噴燈(14)噴射至反應室(18a)內的電漿噴流(P)供給待處理的廢氣(E)，以將該廢氣(E)中的有害成分熱分解，該電漿除害方法構成如下。亦即，其特徵在於：在對由前述電漿噴燈(14)噴射至反應室(18a)內的電漿噴流(P)供給冷卻氣體(CG)以將電漿噴流(P)冷卻之後，對該電漿噴流(P)供給前述廢氣(E)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2137" publication-number="202632963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像擷取系統和影像生成方法</chinese-title>
        <english-title>IMAGE CAPTURE SYSTEM AND IMAGE GENERATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260504B">H04N23/10</main-classification>
        <further-classification edition="202301120260504B">H04N23/45</further-classification>
        <further-classification edition="202301120260504B">H04N23/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住尚樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像擷取系統，包括影像感測器、透鏡元件、第一光投影單元、第二光投影單元以及控制單元。透鏡元件設置在影像感測器的前方。控制單元耦合到影像感測器、第一光投影單元和第二光投影單元。影像感測器的第一記錄時序與第一光投影單元的開啟時序同步以獲得第一影像，且影像感測器的第二記錄時序與第二光投影單元的開啟時序同步以獲得第二影像。還提供了一種影像生成方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image capture system including an image sensor, a lens element, a first light projection unit, a second light projection unit and a control unit is provided. The lens element is disposed in front of the image sensor. The control unit is coupled to the image sensor, the first light projection unit and the second light projection unit. A first recording timing of the image sensor is synchronized with a turn-on timing of the first light projection unit to obtain a first image, and a second recording timing of the image sensor is synchronized with a turn-on timing of the second light projection unit to obtain a second image. An image generation method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S12、S14、S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2138" publication-number="202631131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療老年性黃斑部病變及地圖狀萎縮症的組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR TREATMENT OF MACULAR DEGENERATION AND GEOGRAPHIC ATROPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/445</main-classification>
        <further-classification edition="201701120260504B">A61K47/34</further-classification>
        <further-classification edition="200601120260504B">A61K9/00</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信力生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAGONE BIOTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　鄭文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李台威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LY, TAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡仲昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢薇安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, WEI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUAN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婉菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚雅鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YA-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭又瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供用於治療老年性黃斑部病變或地圖狀萎縮症之醫藥組成物。該醫藥組成物包含阿伐可泮（avacopan）或其藥學上可接受的鹽，該阿伐可泮或其藥學上可接受的鹽分散於一生物可分解的聚合物中，該生物可分解的聚合物使該阿伐可泮或其藥學上可接受的鹽可在人體玻璃體中持續釋放至少40天，其中該醫藥組成物被配製成用於玻璃體內注射。本揭示內容另提供治療老年性黃斑部病變或地圖狀萎縮症之方法，該方法包含向有需要之個體經由玻璃體內注射一治療有效量之本揭示內容醫藥組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are pharmaceutical compositions for the treatment of age-related macular degeneration or geographic atrophy. The pharmaceutical composition includes avacopan or a pharmaceutically acceptable salt thereof dispersed in a biodegradable polymer that provides for a sustained release of the avacopan or pharmaceutically acceptable salt thereof for at least 40 days in human vitreous, wherein the pharmaceutical composition is formulated for intravitreal injection. Also provided herein are methods of treating age-related macular degeneration or geographic atrophy. The method includes administering to a subject in need thereof a therapeutically effective amount of the present pharmaceutical composition via intravitreal injection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2139" publication-number="202633358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合設備、接合方法及物品製造方法</chinese-title>
        <english-title>BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260413B">H10P72/50</main-classification>
        <further-classification edition="202601120260413B">H10P10/00</further-classification>
        <further-classification edition="200601120260413B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中込誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGOMI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三島和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIMA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以將第二構件接合至第一構件的接合設備，包含：第一固持件，被組態以固持住該第一構件；第二固持件，被組態以固持住該第二構件；定位機制，被組態以調整該第一固持件與該第二固持件間之相對位置；第一攝影機，被組態以擷取該第一構件；第二攝影機，為該第一固持件所固持並被組態以擷取該第二構件；及控制器，被組態以根據該第一攝影機的輸出、該第二攝影機的輸出、及該接合設備的操作歷史，來控制該定位機制，以將該第二構件定位至該第一構件的接合目標位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding apparatus for bonding a second member to a first member, includes a first holder configured to hold the first member, a second holder configured to hold the second member, a positioning mechanism configured to adjust a relative position between the first holder and the second holder, a first camera configured to capture the first member, a second camera held by the first holder and configured to capture the second member, and a controller configured to control, based on an output of the first camera, an output of the second camera, and an operation history of the bonding apparatus, the positioning mechanism so as to position the second member to a bonding target location of the first member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">2:支座</p>
        <p type="p">3:拾取單元</p>
        <p type="p">4:接合單元</p>
        <p type="p">5:晶粒框</p>
        <p type="p">6:基板</p>
        <p type="p">31:拾取頭</p>
        <p type="p">32:釋放頭</p>
        <p type="p">41:座台基座</p>
        <p type="p">42:上基座</p>
        <p type="p">43:基板座台</p>
        <p type="p">51:晶粒</p>
        <p type="p">421:基板觀察攝影機</p>
        <p type="p">422:干涉儀</p>
        <p type="p">423:接合頭</p>
        <p type="p">424:吸取單元</p>
        <p type="p">431:晶粒觀察攝影機</p>
        <p type="p">432:長條鏡</p>
        <p type="p">433:基板夾頭</p>
        <p type="p">435:驅動機制</p>
        <p type="p">441:控制器</p>
        <p type="p">450:驅動機制</p>
        <p type="p">BD:接合設備</p>
        <p type="p">PS:定位機制</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2140" publication-number="202631406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151051</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輪轂耦接結構</chinese-title>
        <english-title>HUB COUPLING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260227B">B60B27/00</main-classification>
        <further-classification edition="200601120260227B">B60B27/02</further-classification>
        <further-classification edition="201001120260227B">B62M6/45</further-classification>
        <further-classification edition="200601120260227B">B62K23/02</further-classification>
        <further-classification edition="200601120260227B">F16D65/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上賢吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, KENKICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉咲人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, SAKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輪轂耦接結構(15)包含第一耦接構件(76)及第二耦接構件(78)。第一耦接構件(76)包含第一接合部分(80)及車輛耦接部分(82)。第二耦接構件(78)包含第二接合部分(84)及輪轂軸耦接部分(86)。第二接合部分(84)被建構成與第一接合部分(80)接合。第一接合部分(80)及第二接合部分(84)被建構成在第一接合部分(80)與第二接合部分(84)接合的狀態中，將第一耦接構件(76)相對於第二耦接構件(78)選擇性地定位於繞參考軸線(A2)被界定的至少兩個第一圓周位置中之一者。輪轂軸耦接部分(86)被建構成在輪轂軸耦接部分(86)被耦接於輪轂軸(12)的狀態中，將第二耦接構件(78)相對於輪轂軸(12)選擇性地定位於繞參考軸線(A2)被界定的至少兩個第二圓周位置中之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hub coupling structure 15 comprises a first coupling member 76 and a second coupling member 78. The first coupling member 76 comprises a first engagement portion 80 and a vehicle coupling portion 82. The second coupling member 78 comprises a second engagement portion 84 and a hub-axle coupling portion 86. The second engagement portion 84 is configured to be engaged with the first engagement portion 80. The first engagement portion 80 and the second engagement portion 84 are configured to position the first coupling member 76 relative to the second coupling member 78 selectively in one of at least two first circumferential positions defined about a reference axis A2 in a state where the first engagement portion 80 is engaged with the second engagement portion 84. The hub-axle coupling portion 86 is configured to position the second coupling member 78 relative to a hub axle 12 selectively in one of at least two second circumferential positions defined about the reference axis A2 in a state where the hub-axle coupling portion 86 is coupled to the hub axle 12.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2C:卡鉗安裝構件</p>
        <p type="p">2D:安裝部分</p>
        <p type="p">2E:定位部分</p>
        <p type="p">2P:突出部</p>
        <p type="p">2V:車體</p>
        <p type="p">12:輪轂軸</p>
        <p type="p">12A:第一軸端部分</p>
        <p type="p">12E:接合部分</p>
        <p type="p">15:輪轂耦接結構</p>
        <p type="p">76:第一耦接構件</p>
        <p type="p">78:第二耦接構件</p>
        <p type="p">80:第一接合部分</p>
        <p type="p">80H:第一孔</p>
        <p type="p">82:車輛耦接部分</p>
        <p type="p">82A:第一耦接部件</p>
        <p type="p">82B:第二耦接部件</p>
        <p type="p">82C:開口</p>
        <p type="p">84:第二接合部分</p>
        <p type="p">86:輪轂軸耦接部分</p>
        <p type="p">88:第一部分</p>
        <p type="p">89:第二部分</p>
        <p type="p">A1:旋轉軸線</p>
        <p type="p">A2:參考軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2141" publication-number="202631736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成用組成物、保護膜、基板之製造方法及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F20/30</main-classification>
        <further-classification edition="200601120260504B">G03F7/11</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="202601120260504B">H10P50/60</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>窪寺俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBODERA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之保護膜形成用組成物，係含有具有由下述式（1）表示之重複單元之聚合物及溶劑；  &lt;br/&gt;相對於前述保護膜形成用組成物之不揮發成分，前述聚合物之含量係80質量%以上。  &lt;br/&gt;&lt;img align="absmiddle" height="375px" width="229px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中、R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、或碳原子數1～4的烷基。  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;表示單鍵、或-CH&lt;sub&gt;2&lt;/sub&gt;-。  &lt;br/&gt;R&lt;sup&gt;3&lt;/sup&gt;表示單鍵、或碳原子數1～20的二價鏈狀烴基。  &lt;br/&gt;X&lt;sup&gt;1&lt;/sup&gt;表示-O-、或-NH-。  &lt;br/&gt;Y&lt;sup&gt;1&lt;/sup&gt;表示-NH-、-S-、-C(=O)-O-或-O-C(=O)-。  &lt;br/&gt;n表示2～5的整數。）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2142" publication-number="202633209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>太陽能電池及其製造方法</chinese-title>
        <english-title>SOLAR CELL AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260423B">H10F71/00</main-classification>
        <further-classification edition="202501120260423B">H10F10/163</further-classification>
        <further-classification edition="202501120260423B">H10F77/124</further-classification>
        <further-classification edition="202501120260423B">H10F77/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雄敎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, WOONG KYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪龍圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YONG-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修鎔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SU YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳法鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, BEOP-JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金顯昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEON CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭露一種製造太陽能電池之方法，包括：在配設有多個通孔之基板上，形成於對應於該些通孔之部分具有第一開口之緩衝層之步驟；在緩衝層上，形成於對應於該些通孔之部分具有第二開口之未摻雜第III-V族化合物層之步驟；將第一電極填入該些通孔、第一開口及第二開口之步驟；以及在第一電極及未摻雜第III-V族化合物層上形成第一摻雜第III-V族化合物層之步驟，以及一種由前述方法製造之太陽能電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of manufacturing a solar cell comprising a step of forming a buffer layer having a first opening in a portion corresponding to the plurality of through holes on a substrate provided with a plurality of through holes; a step of forming an undoped Group III-V compound layer having a second opening in a portion corresponding to the plurality of through holes on the buffer layer; a step of filling a first electrode in the plurality of through holes, the first opening, and the second opening; and a step of forming a first doped Group III-V compound layer on the first electrode and the undoped Group III-V compound layer, and a solar cell manufactured by the above method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:腔體</p>
        <p type="p">2a:上圓蓋</p>
        <p type="p">2b:下圓蓋</p>
        <p type="p">2c:腔體</p>
        <p type="p">3:基板支撐器</p>
        <p type="p">23:加熱器</p>
        <p type="p">30a:驅動器</p>
        <p type="p">40:天線</p>
        <p type="p">41:第一氣體噴射器</p>
        <p type="p">42:第二氣體噴射器</p>
        <p type="p">51:第一供應器</p>
        <p type="p">52:第一累積槽</p>
        <p type="p">53:第二供應器</p>
        <p type="p">54:第二累積槽</p>
        <p type="p">221:排出口</p>
        <p type="p">222:渦輪分子泵</p>
        <p type="p">400:電源供應器</p>
        <p type="p">PS:處理空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2143" publication-number="202631994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含編碼ATP7B蛋白的多核苷酸的mRNA及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C12N15/11</main-classification>
        <further-classification edition="200601120260504B">C12N15/12</further-classification>
        <further-classification edition="200601120260504B">C12N15/85</further-classification>
        <further-classification edition="200601120260504B">A61K31/7088</further-classification>
        <further-classification edition="200601120260504B">A61K48/00</further-classification>
        <further-classification edition="200601120260504B">A61P3/00</further-classification>
        <further-classification edition="200601120260504B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳深信生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN SHENXIN BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　林鮮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LINXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐司林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, SILIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種包含編碼ATP7B蛋白的多核苷酸的mRNA及其應用。一種mRNA，該mRNA為非天然mRNA，其包含編碼ATP7B蛋白的多核苷酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2144" publication-number="202631197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗hIL-4Rα抗體之穩定液態組合物</chinese-title>
        <english-title>STABILIZED LIQUID COMPOSITION FOR ANTI-HIL-4RΑ ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K39/395</main-classification>
        <further-classification edition="200601120260504B">C07K16/28</further-classification>
        <further-classification edition="200601120260504B">A61K9/08</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61K47/10</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61P37/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商鐘根堂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG KUN DANG PHARMACEUTICAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權相五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, SANGOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金美京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIGYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹熙憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HEEHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金素賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOONKYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔恩英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, EUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑟琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SEULGI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴進永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於抗hIL-4Rα抗體之穩定液態組合物，且更具體而言，係關於包括抗hIL-4Rα抗體、其抗原結合片段或其變體及胺基酸或其醫藥上可接受之鹽之液態組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a stabilized liquid composition for an anti-hIL-4Rα antibody, and more specifically, to a liquid composition comprising an anti-hIL-4Rα antibody, an antigen-binding fragment thereof or a variant thereof and an amino acid or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2145" publication-number="202632694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＥＭＩ抑制電感器和構造ＥＭＩ抑制電感器的方法</chinese-title>
        <english-title>EMI SUPPRESSION INDUCTORS AND METHODS OF CONTRUCTING EMI SUPRESSION INDUCTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01F27/34</main-classification>
        <further-classification edition="200601120260504B">H01F27/42</further-classification>
        <further-classification edition="200601120260504B">H01F41/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商斯特華（佛山）磁材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEWARD (FOSHAN) MAGNETICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HONGNIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何永學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YONGXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐文善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, WENSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧增卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, ZENGZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張日勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEAT SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡明彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, MINGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李友宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YOUHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種用於EMI抑制電感器的新穎的陣列構造。還公開了EMI抑制電感器的示例性實施方式。在示例性實施方式中，電感器包括磁芯，該磁芯包括相對的第一側和第二側。開口從第一側延伸穿過磁芯到第二側。訊號線延伸穿過磁芯的開口。訊號線包括部分嵌入介電構件內的引腳，介電構件沿引腳彼此間隔開，使得引腳的第一端部和第二端部經曝露並且不嵌入介電構件內。介電構件經配置為將引腳保持就位，從而有助於保持引腳間距而不變形和/或在引腳之間保持足夠距離，使得引腳之間的絕緣藉由引腳之間的空氣並藉由介電構件來提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A novel array construction for an EMI suppression inductor is disclosed. Also disclosed are exemplary embodiments of EMI suppression inductors. In an exemplary embodiment, an inductor comprises a magnetic 5 core including opposite first and second sides. An opening extends through the magnetic core from the first side to the second side. Signal lines extend through the opening of the magnetic core. The signal lines comprise pins partially embedded within dielectric members spaced apart from each other along the pins such that first and second end portions of the pins are exposed and not embedded within the dielectric members. The 10 dielectric members are configured to retain the pins in place to thereby help maintain pin pitch without distortion and/or maintain a sufficient distance between the pins such that insulation between the pins is provided by air between the pins and by the dielectric members.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:EMI抑制電感器/電感器</p>
        <p type="p">104:磁芯</p>
        <p type="p">108:引腳</p>
        <p type="p">112:框架</p>
        <p type="p">116:介電頭</p>
        <p type="p">120:第一介電體</p>
        <p type="p">124:第二介電體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2146" publication-number="202632926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共生支援系統、共生支援方法、共生支援程式、及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H04L9/32</main-classification>
        <further-classification edition="201301120260504B">G06F21/44</further-classification>
        <further-classification edition="201301120260504B">G06F21/73</further-classification>
        <further-classification edition="201301120260504B">G06F21/62</further-classification>
        <further-classification edition="200601120260504B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池淳義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, ATSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本修一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, SHUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於在自律機器人及人類等各種實體彼此的共生中，利用了半導體裝置之固有特性的共生支援系統。  &lt;br/&gt;　　保有半導體裝置之實體的共生支援系統1中，認證側實體及被認證側實體之半導體裝置具有認證部。  &lt;br/&gt;　　認證側實體之認證部生成挑戰並發送至被認證側實體之半導體裝置，且利用發送之挑戰及從被認證側實體之半導體裝置接收之回應來執行認證。  &lt;br/&gt;　　被認證側實體之認證部基於半導體裝置固有之被認證側PUF及從認證側實體之認證部接收之挑戰，生成回應並發送至認證側實體之認證部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:共生支援系統</p>
        <p type="p">10:自律機器人</p>
        <p type="p">20:人類</p>
        <p type="p">22:使用者裝置</p>
        <p type="p">30:資訊處理裝置</p>
        <p type="p">40:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2147" publication-number="202632854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生LLC變換器的驅動信號的控制裝置與方法</chinese-title>
        <english-title>A CONTROL APPARATUS AND A METHOD FOR GENERATING A DRIVE SIGNAL FOR AN LLC CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">H02M1/08</main-classification>
        <further-classification edition="200601120260223B">H02M3/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凹凸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O2MICRO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉　凱平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAN, KAIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝振中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於產生LLC變換器的驅動信號的控制裝置與方法。該控制裝置包括：驅動信號產生器，用於基於PWM信號產生驅動信號；第一電容器，連接在地與驅動信號產生器的第一引腳之間；以及第二電容器，連接在地與驅動信號產生器的第二引腳之間。驅動信號產生器被配置成：基於PWM信號、第一引腳上的電壓及第二引腳的電壓選擇第一引腳上的電壓和第二引腳的電壓中的一個作為電壓參數，根據電壓參數確定指示LLC變換器的開關電晶體的工作頻率的驅動頻率，並且產生具有驅動頻率的驅動信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a control apparatus and a method for generating a drive signal for an LLC converter. The control apparatus includes: a drive signal generator configured to generate the drive signal based on a PWM signal; a first capacitor coupled between a reference ground and a first pin of the drive signal generator; and a second capacitor coupled between the reference ground and a second pin of the drive signal generator. The drive signal generator is configured to: select a voltage from a voltage at the first pin and a voltage at the second pin as a voltage parameter based on the PWM signal, the voltage at the first pin, and the voltage at the second pin; determine a drive frequency indicating an operating frequency of switching transistors of the LLC converter according to the voltage parameter; and control the drive signal to have the drive frequency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:本發明一實施例的用於產生LLC變換器的驅動信號的方法的示例性流程圖</p>
        <p type="p">501、502、503:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2148" publication-number="202631764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性彈性體組合物及複層成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F297/04</main-classification>
        <further-classification edition="200601120260302B">C08F8/04</further-classification>
        <further-classification edition="200601120260302B">C08L23/12</further-classification>
        <further-classification edition="200601120260302B">C08L53/02</further-classification>
        <further-classification edition="200601120260302B">C08L91/06</further-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照井柊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUI, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福圓真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUEN, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於獲得一種與各種基材樹脂之熱熔合特性良好、且作為決定成形外觀的指標之流動性及透明性優異之熱塑性彈性體組合物。  &lt;br/&gt;本發明之熱塑性彈性體組合物含有滿足規定條件之高分子氫化嵌段共聚物(I)、非芳香族軟化劑(II)及烯烴系樹脂(III)，相對於高分子氫化嵌段共聚物(I) 100質量份，含有非芳香族軟化劑(II) 20～400質量份、烯烴系樹脂(III) 10～200質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2149" publication-number="202631217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>施用器及微針陣列貼片傳送系統</chinese-title>
        <english-title>AN APPLICATOR AND MICRONEEDLE ARRAY PATCH DELIVERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61M37/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維界生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERRESTRIAL BIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖西　琳達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUSSEY, LYNDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科蘇達　凱瑟琳　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSUDA, KATHRYN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪克斯　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIRCKX, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯皮里迪利奧齊　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIRIDIGLIOZZI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝利　希瑪賓杜　安地沃達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILEY, HIMABINDU NANDIVADA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秀鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種MAP及施用器系統可包含MAP及施用器。該MAP可包含背襯及自該背襯延伸之複數個微針。該等微針可包含具有GLP-1激動劑之尖端；及水溶性基座，其經構形以在與個體之體液接觸時至少部分地溶解，從而致使該尖端在皮膚下方釋放。該施用器經構形以維持該MAP；因應於啟動機構被啟動，將活塞向下釋放至該MAP中；且經由該活塞將該MAP向下推動至該個體之皮膚表面上，從而該複數個微針刺入該皮膚表面且傳送。在至少約600 µm之深度處將該等微針之頂端傳送至該個體，且在釋放該等微針之尖端之後傳送至少約70%之該GLP-1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A MAP and applicator system can include a MAP and an applicator. The MAP can include a backing and a plurality of microneedles extending from the backing. The microneedles can include tips with a GLP-1 agonist; and a water-soluble base configured to at least partially dissolve upon contact with a bodily fluid of a subject causing the tip to be released below the skin. The applicator is configured to maintain the MAP; in response to an activation mechanism being activated, release a piston downward into the MAP; and push, via the piston, the MAP downward onto the skin surface of the subject such that the plurality of microneedles penetrate the skin surface and are delivered. Apexes of the microneedles are delivered to the subject at a depth of at least about 600 µm and at least about 70% of the GLP-1 is delivered after release of tips of the microneedles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:藥劑貼片/微陣列貼片</p>
        <p type="p">101:背襯</p>
        <p type="p">102:基座</p>
        <p type="p">103:尖端</p>
        <p type="p">200:施用器</p>
        <p type="p">1000:施用器及微針陣列貼片傳送系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2150" publication-number="202631218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微針陣列貼片傳送系統之施用器</chinese-title>
        <english-title>AN APPLICATOR FOR A MICRONEEDLE ARRAY PATCH DELIVERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61M37/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維界生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERRESTRIAL BIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦加斯　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGAS, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯皮里迪利奧齊　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIRIDIGLIOZZI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯坦　哈里森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOSTEIN, HARRISON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊希多羅　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISIDORO, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥可爾希尼　羅根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCELHINNEY, LOGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秀鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將藥劑貼片施用至個體之施用器可包含經構形以向下按壓來啟動啟動機構之頂部部分；經構形以固持該藥劑貼片之底部部分；連接至該頂部部分及該底部部分之中間部分，該中間部分包括複數個彎曲臂，其經構形以向該啟動機構之啟動力貢獻約6-15 lb；連接至該中間部分之活塞部分；及定位於該中間部分與該活塞部分之間之可壓縮構件。在該啟動機構被啟動時，將該活塞部分自該頂部部分及該中間部分釋放，且經由由該可壓縮構件施用之力向下移動。在該活塞部分向下移動時，將該藥劑貼片自該底部部分釋放並藉由該活塞部分向下推動至該個體之皮膚表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An applicator for applying a medicament patch to a subject can include a top portion configured to be pressed downwards to activate an activation mechanism; a bottom portion configured to hold the medicament patch; a middle portion connected to the top portion and the bottom portion, the middle portion comprising a plurality of flex arms configured to contribute about 6-15 lbs to an activation force of the activation mechanism; a piston portion connected to the middle portion; and a compressible member positioned between the middle portion and the piston portion. When the activation mechanism is activated, the piston portion is released from the top portion and the middle portion and moves downwards via force applied by the compressible member. When the piston portion moves downwards, the medicament patch is released from the bottom portion and pushed downward by the piston portion onto a skin surface of the subject.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微陣列貼片</p>
        <p type="p">101:背襯</p>
        <p type="p">102:基座</p>
        <p type="p">103:尖端</p>
        <p type="p">200:施用器</p>
        <p type="p">1000:施用器及微針陣列貼片傳送系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2151" publication-number="202633218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光器件、發光裝置、電子裝置及照明設備</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE, LIGHT-EMITTING APPARATUS, ELECTRONIC DEVICE, AND LIGHTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260428B">H10H20/822</main-classification>
        <further-classification edition="200601120260428B">C09K11/06</further-classification>
        <further-classification edition="202301120260428B">H10K50/11</further-classification>
        <further-classification edition="200601120260428B">C07D491/048</further-classification>
        <further-classification edition="200601120260428B">C07D209/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個實施方式提供一種在發光層中將能量從主體材料高效地轉移到客體材料且具有高可靠性的發光器件。本發明的一個實施方式是一種發光器件，其中，藉由使發光層中的主體材料及客體材料的T1能階及S1能階在一定範圍內，能夠將能量從主體材料高效地轉移到客體材料，並且可以提高可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a light-emitting device not only including a light-emitting layer in which energy is efficiently transferred from a host material to a guest material but also having high reliability. The light-emitting device not only includes a light-emitting layer in which the T1 levels and the S1 levels of a host material and a guest material fall within certain ranges so that energy can be efficiently transferred from the host material to the guest material and but also has improved reliability.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2152" publication-number="202631939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學構件用接著劑、光學元件及光學機器</chinese-title>
        <english-title>ADHESIVE FOR OPTICAL MEMBER, OPTICAL ELEMENT, AND OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C09J11/06</main-classification>
        <further-classification edition="200601120260504B">C09J163/00</further-classification>
        <further-classification edition="200601120260504B">B32B7/12</further-classification>
        <further-classification edition="200601120260504B">G02B3/00</further-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松家実咲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYA, MISAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚健祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮尾宙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學構件用接著劑、光學元件及光學機器，所述光學構件用接著劑包含脂環式環氧化合物、含氧雜環丁基的化合物、受阻胺系光穩定劑及抗氧化劑，關於藉由對光學構件用接著劑以能量密度3000 mJ/cm&lt;sup&gt;2&lt;/sup&gt;照射波長365 nm的光而製作的厚度100 μm的光學構件用接著劑的硬化物，於將硬化物於溫度65℃及濕度90%RH的環境下暴露24小時的高溫高濕試驗的前後，折射率的差的絕對值小於0.002。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2153" publication-number="202631392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151378</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬塗覆膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B32B27/08</main-classification>
        <further-classification edition="200601120260504B">B32B27/36</further-classification>
        <further-classification edition="202001120260504B">C08J7/046</further-classification>
        <further-classification edition="201501120260504B">G02B1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤槙吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種顯示優異的耐擦傷性，同時抑制施工時的裂紋等發生的硬塗覆膜。  &lt;br/&gt;[解決手段] 該硬塗覆膜，其為具備：基材；以及配置於基材的一側主面上的硬塗覆層之硬塗覆膜，在基於JIS K 5600-5-1，並使用圓筒型心軸彎曲試驗機，將硬塗覆膜中基材側的面與心軸接觸而進行的心軸彎曲試驗中，硬塗覆層發生裂紋的心軸直徑設為Dμm，硬塗覆膜的總厚度設為αμm時，D/α為130以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:硬塗覆膜</p>
        <p type="p">10:基材</p>
        <p type="p">10a:主面</p>
        <p type="p">20:硬塗覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2154" publication-number="202631861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151388</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高黏著性組合物、多層複合材料、其製品、及其製造方法</chinese-title>
        <english-title>HIGH-ADHESION COMPOSITION, MULTILAYER COMPOSITE, ARTICLE THEREOF, AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08L9/00</main-classification>
        <further-classification edition="200601120260504B">C08L53/00</further-classification>
        <further-classification edition="200601120260504B">C08L67/00</further-classification>
        <further-classification edition="200601120260504B">C08L101/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/00</further-classification>
        <further-classification edition="200601120260504B">B32B27/08</further-classification>
        <further-classification edition="200601120260504B">B29C69/00</further-classification>
        <further-classification edition="200601120260504B">B25G1/00</further-classification>
        <further-classification edition="200601120260504B">A43B13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LCY CHEMICAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易函柳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, HAN-LIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, REN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林筱筑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王郁琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范綱晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KANG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺儐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種高黏著性組合物，包括：一熱塑性材料；以及一交聯橡膠，其中該高黏著性組合物的甲苯不溶物含量等於或大於10%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-adhesion composition comprises: a thermoplastic material; and a cross-linked rubber; wherein the high-adhesion composition has a toluene insoluble content equal to or higher than 10%.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2155" publication-number="202631752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151405</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面保護用組成物、表面保護膜及電子裝置的製造方法</chinese-title>
        <english-title>SURFACE PROTECTIVE COMPOSITION, SURFACE PROTECTIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F220/06</main-classification>
        <further-classification edition="200601120260504B">C08F220/28</further-classification>
        <further-classification edition="200601120260504B">C08F220/32</further-classification>
        <further-classification edition="200601120260504B">C09D133/14</further-classification>
        <further-classification edition="201801120260504B">C09D7/63</further-classification>
        <further-classification edition="202601120260504B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中愛美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAKA, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒添弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAZOE, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>室伏貴信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUROFUSHI, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面保護用組成物，能形成在選自光照射及加熱中的至少一種處理後能夠水清洗的保護膜，所述表面保護用組成物包含：聚合物（A），具有交聯性基；酸產生劑（B），包含選自光酸產生劑及熱酸產生劑中的至少一種；以及酸分解性交聯劑（C），能與所述聚合物（A）的所述交聯性基發生反應，並且形成酸分解性交聯結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surface protective composition is provided, capable of forming a water-washable protective film after at least one treatment selected from light irradiation and heating. The surface protective composition comprises: a polymer (A) having a crosslinking group; an acid generator (B) comprising at least one selected from a photoacid generator and a thermal acid generator; and an acid-decomposable crosslinking agent (C) capable of reacting with the crosslinking groups of the polymer (A) to form an acid-degrading crosslinked structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:表面保護膜P</p>
        <p type="p">20:電子零件</p>
        <p type="p">21:單片化後電子零件</p>
        <p type="p">22:貫通電極</p>
        <p type="p">30:臨時固定材</p>
        <p type="p">40:基板Q</p>
        <p type="p">50:切割帶</p>
        <p type="p">70:基板U</p>
        <p type="p">80:另一電子零件</p>
        <p type="p">100:結構體S</p>
        <p type="p">200:結構體R</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2156" publication-number="202631785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物</chinese-title>
        <english-title>RESIST COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G59/20</main-classification>
        <further-classification edition="200601120260504B">C08G59/40</further-classification>
        <further-classification edition="200601120260504B">C08G65/26</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/16</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">G03F7/38</further-classification>
        <further-classification edition="200601120260504B">G03F7/40</further-classification>
        <further-classification edition="202601120260504B">H10P30/22</further-classification>
        <further-classification edition="202601120260504B">H10P50/00</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木理人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小崎力生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKI, RIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村聰也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司　堃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SI, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　恒鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HENGPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬晨陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CHENYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費克勒　菲利浦漢斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FACKLER, PHILIPP HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪圖里　馬克馬塞羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATURI, MARK MARCELLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於一種新穎組成物、製造阻劑膜之方法、製造阻劑圖案之方法、製造經處理的基材之方法、製造裝置之方法及該組成物之用途。&lt;br/&gt;  該調配物可展現出至少一種作為先進材料或作為高性能材料的性質。該調配物可使用在奈米科技製程中來製得半導體裝置/顯示裝置應用，例如，在基材上製造藉由半導體控制的半導體晶片、或液晶、量子點、OLED顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to novel compositions, methods for producing a resist film, methods for producing a resist pattern, methods for producing a processed substrate, methods for producing a device, and uses of the composition thereof. &lt;br/&gt; The formulation may exhibit at least one of properties as an advanced material or as a high performance material. The formulation may be used in the nanotechnology process to make semiconductor device/display device application, for example semiconductor chip, or a liquid crystal, quantum dot, OLED display fabricated on a substrate controlled by semiconductors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2157" publication-number="202631517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溶氧濃度的上升方法及溶氧濃度上升裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260417B">C02F1/28</main-classification>
        <further-classification edition="200601120260417B">C01B13/08</further-classification>
        <further-classification edition="200601120260417B">B01D53/047</further-classification>
        <further-classification edition="200601120260417B">C01B39/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中島物產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA &amp; CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島康宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種利用與現有PSA裝置不同的機制使液體中的溶氧濃度上升的溶氧濃度上升方法以及以較現有PSA裝置更簡單的構成使溶氧濃度上升的溶氧濃度上升裝置。  &lt;br/&gt;　　[解決手段]其特徵在於，藉由使空氣在收容有多孔質載體的本體內部移動，使前述多孔質載體吸附空氣中所含的水分，並且藉由將該空氣自前述本體噴出至前述液體中，而提升該液體中的溶氧濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:水</p>
        <p type="p">D:溶氧濃度上升裝置(第一實施方式)</p>
        <p type="p">FM:流量計</p>
        <p type="p">H:空氣流通管</p>
        <p type="p">N:噴嘴</p>
        <p type="p">P:泵</p>
        <p type="p">S:氣缸</p>
        <p type="p">S1:空氣進入口</p>
        <p type="p">W:儲存水</p>
        <p type="p">WT:水槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2158" publication-number="202631921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膠體二氧化矽及包含其之化學機械研磨組合物</chinese-title>
        <english-title>COLLOIDAL SILICA AND CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C09G1/02</main-classification>
        <further-classification edition="200601120260420B">C09G1/18</further-classification>
        <further-classification edition="200601120260420B">C01B33/14</further-classification>
        <further-classification edition="200601120260420B">C09K3/14</further-classification>
        <further-classification edition="200601120260420B">C08K5/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商易安愛富科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENF TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商優備材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UBMATERIALS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李頭虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷熙天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUN, HEE CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔㘽銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JUN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於可用作研磨顆粒的膠體二氧化矽，更具體地，膠體二氧化矽在X射線光電子能譜(XPS)的光譜中，於533 ± 0.5 eV處具有第一峰，於534 ± 0.5 eV處具有第二峰，且第一峰的強度大於第二峰的強度，於根據下列條件所得的隨剪切應變(%)變化的儲存模數(G', Pa)和損耗模數(G”, Pa)中，儲存模數(G')與損耗模數(G”)的交叉點發生於剪切應變為2.00%至5.00%處，且於剪切應變為0.10%至0.20%區域內的最大儲存模數(G')為0.80 Pa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a silica colloid useful as abrasive particles, and more particularly, the colloidal silica has a first peak at 533 ± 0.5 eV and a second peak at 534 ± 0.5 eV in an X-ray photoelectron spectroscopy (XPS) spectrum, an intensity of the first peak is greater than an intensity of the second peak, in a storage modulus (G', Pa) and a loss modulus (G”, Pa) according to shear strain (%) obtained under conditions as below, a crossover between the storage modulus (G') and the loss modulus (G”) occurs at a shear strain of 2.00% to 5.00%, and a maximum storage modulus (G') in a shear strain of 0.10% to 0.20% region is 0.80 Pa or less.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2159" publication-number="202632083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鍍裝置及電鍍設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260330B">C25D5/02</main-classification>
        <further-classification edition="200601120260330B">C25D5/08</further-classification>
        <further-classification edition="200601120260330B">C25D17/00</further-classification>
        <further-classification edition="200601120260330B">C25D17/02</further-classification>
        <further-classification edition="200601120260330B">C25D17/06</further-classification>
        <further-classification edition="200601120260330B">C25D21/12</further-classification>
        <further-classification edition="200601120260330B">H05K3/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈照偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, ZHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HONGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱志軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪若飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代蘭奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, LANKUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王尊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZUNYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王其強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於電鍍基板的電鍍裝置及電鍍設備。所述電鍍裝置用於在所述多個通孔內鍍金屬，所述電鍍裝置包括：槽體，圍成腔室；基板保持件，用於使所述基板在電鍍期間以豎直姿勢保持於所述腔室內並將所述腔室分隔成第一鍍覆腔與第二鍍覆腔，所述第一鍍覆腔與所述第二鍍覆腔用於容納 電鍍液；在所述多個通孔內電鍍形成金屬橋的過程中，所述第一鍍覆腔與所述第二鍍覆腔配置為容納不同液面高度的電鍍液以使電鍍液從液面高的鍍覆腔穿過所述通孔流向液面低的鍍覆腔，本申請中所提供的電鍍裝置電鍍液從液面高的鍍覆腔經過通孔流向液面低的鍍覆腔，讓更多的金屬離子經過通孔，以更快地在通孔內形成金屬橋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:槽體</p>
        <p type="p">10:第一鍍覆腔</p>
        <p type="p">11:第一進液口</p>
        <p type="p">12:第二進液口</p>
        <p type="p">2:基板保持件</p>
        <p type="p">20:第二鍍覆腔</p>
        <p type="p">21:第一出液口</p>
        <p type="p">22:第二出液口</p>
        <p type="p">41:第一陽極</p>
        <p type="p">42:第二陽極</p>
        <p type="p">51:第一陽極室</p>
        <p type="p">52:第二陽極室</p>
        <p type="p">61:第一離子膜</p>
        <p type="p">62:第二離子膜</p>
        <p type="p">71:第一電場控制元件</p>
        <p type="p">72:第二電場控制元件</p>
        <p type="p">81:第一液流空間</p>
        <p type="p">82:第二液流空間</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2160" publication-number="202631805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚苯醚、聚苯醚之製造方法、多孔膜、醫藥用製程過濾器及水處理膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G65/44</main-classification>
        <further-classification edition="200601120260424B">B32B3/24</further-classification>
        <further-classification edition="200601120260424B">B01D69/00</further-classification>
        <further-classification edition="200601120260424B">B01D71/52</further-classification>
        <further-classification edition="200601120260424B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡瑠以</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種低分子量之成分比率較小，於水溶性有機溶劑中之溶解性優異之聚苯醚及其製造方法。  &lt;br/&gt;為解決上述課題，本發明之特徵在於：相對於下述式(1)及下述式(2)之重複單元之合計100 mol%，由下述式(1)之酚所衍生之重複單元之含量為70 mol%以上99.5 mol%以下，由下述式(2)之酚所衍生之重複單元之含量為0.5 mol%以上30 mol%以下，藉由凝膠滲透層析法(GPC)所求出之分子量1.0×10&lt;sup&gt;4&lt;/sup&gt;以下之聚苯醚成分為15重量%以下。  &lt;br/&gt;&lt;img align="absmiddle" height="89px" width="346px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2161" publication-number="202632748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>約束環組件、電漿處理裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260203B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種約束環組件、電漿處理裝置及方法，所述約束環組件設置在電漿處理裝置的真空反應腔內，用於約束電漿區域，包括： 第一子環和第二子環；第二子環相對於第一子環更靠近排氣系統；第一子環設置在電漿區域內；第一子環將電漿壓力由第一壓力降低至第二壓力，以使電漿在第二子環處被熄滅。本發明的優點在於：本發明的約束環組件具有較大的流導，有效約束電漿的同時還能避免對晶圓造成顆粒污染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電漿處理裝置</p>
        <p type="p">20:反應腔</p>
        <p type="p">202:基座</p>
        <p type="p">203:氣體噴淋頭</p>
        <p type="p">206:約束環組件</p>
        <p type="p">2061:第一子環</p>
        <p type="p">20611:第一環板</p>
        <p type="p">2062:第二子環</p>
        <p type="p">20621:第二環板</p>
        <p type="p">20a:電漿區域</p>
        <p type="p">20b:排氣區域</p>
        <p type="p">220:控制單元</p>
        <p type="p">240:源射頻電源</p>
        <p type="p">241:非恒壓電源</p>
        <p type="p">280:排氣系統</p>
        <p type="p">P:電漿</p>
        <p type="p">td1:第一氣流通道</p>
        <p type="p">td2:第二氣流通道</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2162" publication-number="202633269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎢的填充方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10P14/40</main-classification>
        <further-classification edition="202601120260313B">H10P14/43</further-classification>
        <further-classification edition="202301120260313B">H10B41/20</further-classification>
        <further-classification edition="202301120260313B">H10B41/41</further-classification>
        <further-classification edition="202301120260313B">H10B43/20</further-classification>
        <further-classification edition="202301120260313B">H10B43/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝忠帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂術亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種鎢的填充方法。包括：提供一基片置於反應腔中，基片包含介質層，介質層中具有若干沿水平方向延伸的凹陷結構；向反應腔中通入第一反應氣體，第一反應氣體包括含氫氣體，其吸附於凹陷結構的內壁表面；向反應腔中通入第二反應氣體和輔助氣體，第二反應氣體包括含鎢前驅體，輔助氣體至少包括氮氣，含鎢前驅體與吸附在凹陷結構內壁表面的含氫氣體反應，生長鎢；其中，第一反應氣體、第二反應氣體和輔助氣體以憋壓方式泵入反應腔。本發明在輔助氣體中引入氮氣後，能顯著降低沉積的鎢層的氟含量和電阻率，提高器件性能和可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2163" publication-number="202633294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理設備及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P50/20</main-classification>
        <further-classification edition="202601120260310B">H10P95/00</further-classification>
        <further-classification edition="200601120260310B">F04B37/10</further-classification>
        <further-classification edition="200601120260310B">F04D19/04</further-classification>
        <further-classification edition="200601120260310B">F04D29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體處理設備，包括：腔體，腔體被間隔壁隔斷為兩個反應腔，反應腔內設有用於承載襯底的基座，腔體的底部正中設有公共的抽氣通道；鐘擺閥，其連通抽真空裝置，包括閥口和鐘擺閥板，閥口位於抽氣通道的正下，鐘擺閥板能夠繞其一側的旋轉軸水平轉動，以實現調節閥口開度；轉接法蘭，其具有筒狀結構，抽氣通道經由轉接法蘭連通閥口；分流板，其至少部分設於轉接法蘭的內部並垂直於鐘擺閥板，分流板被配置為適配鐘擺閥板的運動路徑，在不同的閥口開度下，實現各反應腔流入閥口的氣流量相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:半導體處理設備</p>
        <p type="p">20:反應腔</p>
        <p type="p">202:間隔壁</p>
        <p type="p">20a、20b:反應腔</p>
        <p type="p">21:腔體</p>
        <p type="p">210:氣體噴淋頭</p>
        <p type="p">22:控制器</p>
        <p type="p">220:基座</p>
        <p type="p">221:冷卻流體通道</p>
        <p type="p">222:加熱元件</p>
        <p type="p">230:抽氣通道</p>
        <p type="p">250:鐘擺閥</p>
        <p type="p">251:閥口</p>
        <p type="p">252:鐘擺閥板</p>
        <p type="p">253:旋轉軸</p>
        <p type="p">260:分流板</p>
        <p type="p">261:伺服電機</p>
        <p type="p">270:轉接法蘭</p>
        <p type="p">271:第二加熱器</p>
        <p type="p">280:擋板</p>
        <p type="p">281a、281b:通孔</p>
        <p type="p">291:主壓力計</p>
        <p type="p">292a、292b:副壓力計</p>
        <p type="p">Da、Db:子空間</p>
        <p type="p">Qa、Qb:可調區域</p>
        <p type="p">W:襯底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2164" publication-number="202632749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下電極組件、電漿處理設備及其電壓控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260204B">H01J37/32</main-classification>
        <further-classification edition="200601120260204B">H05H1/36</further-classification>
        <further-classification edition="200601120260204B">H05H1/34</further-classification>
        <further-classification edition="200601120260204B">H05H1/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種下電極組件、電漿處理設備及其電壓控制方法，在通過第一偏壓電源將第一直流脈衝電壓耦合到聚焦環的第一電路中，串聯第一電容，通過第一電容的容值來調整聚焦環電壓變化時對應的第一斜率，從而減少基片與聚焦環之間的電壓差，有效降低基片與聚焦環之間發生電弧放電的風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:反應腔</p>
        <p type="p">20:基座</p>
        <p type="p">21:介電層</p>
        <p type="p">22:第一偏置電極</p>
        <p type="p">23:第二偏置電極</p>
        <p type="p">24:同步控制單元</p>
        <p type="p">30:聚焦環</p>
        <p type="p">41:氣體供應裝置</p>
        <p type="p">42:氣體噴淋頭</p>
        <p type="p">50:空間</p>
        <p type="p">60:抽氣泵</p>
        <p type="p">70:約束環</p>
        <p type="p">C1:第一電容</p>
        <p type="p">PDC1:第一偏壓電源</p>
        <p type="p">PDC2:第二偏壓電源</p>
        <p type="p">RF:射頻源</p>
        <p type="p">w:基片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2165" publication-number="202632722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>補償電壓的設定方法和裝置、帶電粒子束裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/26</main-classification>
        <further-classification edition="200601120260225B">H01J37/244</further-classification>
        <further-classification edition="200601120260225B">H01J37/153</further-classification>
        <further-classification edition="200601120260225B">H01J37/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商超微半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGSTROM PRECISION INSTRUMENTS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁國沖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣友飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靳　巨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種補償電壓的設定方法和裝置、帶電粒子束裝置。補償電壓用於對樣品台上的晶圓邊緣進行電壓補償，樣品台上設有用於承載晶圓的晶圓承載盤以及環繞晶圓承載盤設置的環形電極，補償電壓的設定方法包括：在樣品台移動至晶圓觀測位置之前，獲取晶圓和環形電極的邊緣輪廓數據；根據邊緣輪廓數據獲取晶圓邊緣和環形電極內側邊緣之間的間隙數據；根據間隙數據設定施加在環形電極上的補償電壓。上述方法，可以在樣品台沿移動軌跡移動的過程中完成補償電壓的獲取，充分利用樣品台的移動時間，縮短整體工藝的耗時，提高機台吞吐量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20、S30:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2166" publication-number="202632267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波檢查裝置及超音波檢查裝置之運用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260209B">G01N29/02</main-classification>
        <further-classification edition="200601120260209B">G01N29/26</further-classification>
        <further-classification edition="200601120260209B">G01N29/36</further-classification>
        <further-classification edition="200601120260209B">G01N29/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立電力解決方案股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI POWER SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNO, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北見薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMI, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小村昭義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMURA, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野牧寛人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMAKI, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之超音波檢查裝置(10)構成為使用包含進行超音波之收發之收發部(121)之測定裝置(12)，切換在收發部(121)與被檢測體之間之空間配置有氣體之第1超音波檢查、與在前述空間配置有液體之第2超音波檢查，而對前述被檢測體進行超音波檢查。第1超音波檢查所使用之測定裝置(12)、與第2超音波檢查所使用之測定裝置(12)安裝於同一掃描裝置(11)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:掃描裝置</p>
        <p type="p">12:測定裝置(第1測定裝置、第2測定裝置)</p>
        <p type="p">17:識別裝置</p>
        <p type="p">50:控制裝置</p>
        <p type="p">51:信號處理部</p>
        <p type="p">51a:發送電路</p>
        <p type="p">51b:發送電路(接收電路)</p>
        <p type="p">52:信號處理部</p>
        <p type="p">52a:接收電路(發送電路)</p>
        <p type="p">52b:接收電路</p>
        <p type="p">53:資料處理部</p>
        <p type="p">60:顯示裝置</p>
        <p type="p">111:掃描控制器</p>
        <p type="p">112:位置計測部</p>
        <p type="p">113:驅動部</p>
        <p type="p">121:收發部</p>
        <p type="p">121a:發送探針</p>
        <p type="p">121a1:發送探針(第1發送探針)</p>
        <p type="p">121b:接收探針</p>
        <p type="p">121b1:接收探針(第1接收探針)</p>
        <p type="p">511:波形產生器</p>
        <p type="p">512:放大器</p>
        <p type="p">513:濾波器</p>
        <p type="p">514:放大器</p>
        <p type="p">521:波形產生器</p>
        <p type="p">522:放大器</p>
        <p type="p">523:濾波器</p>
        <p type="p">524:放大器</p>
        <p type="p">541:開關</p>
        <p type="p">542:開關</p>
        <p type="p">543:開關</p>
        <p type="p">544:開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2167" publication-number="202631975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體基板用藥液、半導體基板的清洗方法、電子元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C11D7/32</main-classification>
        <further-classification edition="202601120260420B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滋野井悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGENOI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體基板用藥液、以及使用了上述藥液之半導體基板的清洗方法及電子元件之製造方法，該半導體基板用藥液在適用於實施了化學機械研磨處理且包含埋入銅區域之半導體基板時抑制銅的凹陷的產生並且殘存在銅區域上之苯并三唑的去除性優異。本發明的半導體基板用藥液含有：選自嘌呤及嘌呤衍生物中之嘌呤化合物；不具有羥基及一級胺基之三級烷基胺化合物；四級銨化合物；及水，相對於上述嘌呤化合物的含量之上述三級烷基胺化合物的含量的質量比為0.010～3，pH超過7.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2168" publication-number="202632646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊訊號處理方法和裝置</chinese-title>
        <english-title>AUDIO SIGNAL PROCESSING METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260504B">G10L19/032</main-classification>
        <further-classification edition="201301120260504B">G10L19/02</further-classification>
        <further-classification edition="201301120260504B">G10L19/008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇若夫　伊利亞　伊戈雷維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIZHOV, ILYA IGOREVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈洛什恰波娃　維拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLOSHCHAPOVA, VERA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種音訊信號處理方法及其裝置。所述方法包括：獲取音訊訊號的M個子帶；基於與所述M個子帶對應的M個縮放因數，確定與N組子帶對應的N個組縮放因數，其中，所述N組子帶是通過對所述M個子帶進行分組得到的；通過使用所述N個組縮放因數對所述M個縮放因數進行歸一化獲取M個歸一化後的縮放因數；生成所述音訊訊號的碼流。本發明的設計目的是改進音訊訊號壓縮、降低傳輸開銷並提高傳輸準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an audio signal processing method and an apparatus thereof. The method includes: obtaining M subbands of an audio signal; determining N group scale factors corresponding to N groups of subbands based on M scale factors corresponding to the M subbands, the N groups of subbands being obtained by grouping the M subbands; obtaining M normalized scale factors by a normalization of the M scale factors using the N group scale factors; and generating a bitstream of the audio signal. The disclosure is designed to improve audio signal compression, reduce transmission overheads and improve transmission accuracy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:音訊訊號處理方法</p>
        <p type="p">701、702、703、704:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2169" publication-number="202633350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接元件和半導體製程設備</chinese-title>
        <english-title>CONNECTING COMPONENT AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
        <further-classification edition="200601120260302B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種連接元件和半導體製程設備，屬半導體加工技術領域，連接元件連接於製程腔室和傳輸腔室之間，連接元件包括連接板、第一密封圈和第二密封圈，連接板設有傳輸口，傳輸口沿連接板的厚度方向貫穿連接板設置，且連接板朝向製程腔室的第一表面設有第一密封槽和第二密封槽，第二密封槽環繞設於第一密封槽之外，第一密封圈設於第一密封槽，第二密封圈設於第二密封槽，且第一密封圈和第二密封圈均用以密封連接連接板的第一表面與製程腔室。上述連接元件可解決目前半導體製程設備中，設於製程腔室和連接板之間的密封圈容易失效的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a connecting component and semiconductor process equipment, belonging to the technical field of semiconductor processing. The connecting component is connected between a process chamber and a transfer chamber. The connecting component includes a connecting plate, a first sealing ring, and a second sealing ring. The connecting plate is provided with a transfer port, which penetrates through the connecting plate along its thickness direction. The first surface of the connecting plate facing the process chamber is provided with a first sealing groove and a second sealing groove, with the second sealing groove arranged around and outside the first sealing groove. The first sealing ring is disposed in the first sealing groove, and the second sealing ring is disposed in the second sealing groove. Both the first and second sealing rings are used to seal the first surface of the connecting plate to the process chamber. The above-mentioned connecting component can solve the problem in current semiconductor process equipment where the sealing ring arranged between the process chamber and the connecting plate is prone to failure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:板體</p>
        <p type="p">112:傳輸口</p>
        <p type="p">113c:連通通道</p>
        <p type="p">119:第一抽吸通道</p>
        <p type="p">120:散熱鰭片</p>
        <p type="p">210:第一密封圈</p>
        <p type="p">220:第二密封圈</p>
        <p type="p">230:第三密封圈</p>
        <p type="p">240:第四密封圈</p>
        <p type="p">300:隔熱件</p>
        <p type="p">400:製程腔室</p>
        <p type="p">410:第一避讓沉台</p>
        <p type="p">510:腔體</p>
        <p type="p">513:第二抽吸通道</p>
        <p type="p">515:第二避讓沉台</p>
        <p type="p">520:傳輸閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2170" publication-number="202633331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體製程設備及其控制方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING EQUIPMENT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">G05B19/418</further-classification>
        <further-classification edition="200601120260302B">G05B19/048</further-classification>
        <further-classification edition="200601120260302B">G05B15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕曉航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MU, XIAO HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HAO HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了半導體製程設備及其控制方法；其中，在半導體製程設備執行製程配方的每個製程步驟過程中，若當前製程步驟產生報警，確定報警類型；其中，製程配方中配置有多個報警類型以及每個報警類型對應的容錯控制操作，容錯控制操作用於表徵發生報警時，保證半導體製程設備處於安全狀態的補救措施；根據報警類型確定對應的目標容錯控制操作，並控制半導體製程設備按照目標容錯控制操作運行，以對報警出現時的產品進行補救，從而藉由報警類型靈活進行容錯控制，保證了半導體製程設備的產品品質和產能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a semiconductor processing equipment and a control method thereof; wherein, during each process step of executing a process recipe by the semiconductor processing equipment, if an alarm is generated in the current process step, the type of alarm is determined. The process recipe is configured with multiple alarm types and corresponding fault-tolerant control operations for each alarm type. The fault-tolerant control operation is used to represent remedial measures that ensure the semiconductor processing equipment remains in a safe state when an alarm occurs. The corresponding target fault-tolerant control operation is determined according to the alarm type, and the semiconductor processing equipment is controlled to operate according to the target fault-tolerant control operation, so as to remedy the product at the time the alarm occurs. In this way, fault-tolerant control can be flexibly performed based on the alarm type, thereby ensuring the product quality and production capacity of the semiconductor processing equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S202:步驟</p>
        <p type="p">S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2171" publication-number="202632686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶有拼接連接器的電纜組件</chinese-title>
        <english-title>CABLE ASSEMBLY WITH SPLICE CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">H01B11/18</main-classification>
        <further-classification edition="200601120260417B">H01B17/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯曼　賈里德　艾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSSMAN, JARED EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯特洛　布萊恩　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTELLO, BRIAN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾里森　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLISON, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一電纜組件（10），且電纜組件（10）包含一主雙軸電纜（200），主雙軸電纜（200）包含一第一導體（202）及一第二導體（204）。主雙軸電纜包含一主絕緣體（210），主絕緣體（210）支承主雙軸電纜的第一和第二導體。主雙軸電纜的第一和第二導體的裸露部分（206、208）從主絕緣體突伸出來。主雙軸電纜包含圍繞主絕緣體的一主電纜屏蔽層，用於屏蔽主雙軸電纜的第一和第二導體。電纜組件包含一次雙軸電纜（300），次雙軸電纜（300）包含一第一導體（302）及一第二導體（304）。在主雙軸電纜和次雙軸電纜之間提供一拼接連接器（100），以電性連接主雙軸電纜的第一和第二導體與次雙軸電纜的第一和第二導體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable assembly (10) is provided and includes a primary twinaxial cable (200) that includes a first conductor (202) and a second conductor (204). The primary twinaxial cable includes a primary insulator (210) holding the first and second conductors of the primary twinaxial cable. Exposed portions (206, 208) of the first and second conductors of the primary twinaxial cable protrude from the primary insulator. The primary twinaxial cable includes a primary cable shield surrounding the primary insulator to provide shielding for the first and second conductors of the primary twinaxial cable. The cable assembly includes a secondary twinaxial cable (300) that includes a first conductor (302) and a second conductor (304). A splice connector (100) provided between the primary twinaxial cable and the secondary twinaxial cable to electrically connect the first and second conductors of the primary twinaxial cable with the first and second conductors of the secondary twinaxial cable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電纜組件</p>
        <p type="p">100:拼接連接器</p>
        <p type="p">110:外殼</p>
        <p type="p">120:主護罩</p>
        <p type="p">122:主腔</p>
        <p type="p">124:內表面</p>
        <p type="p">130:拼接護罩</p>
        <p type="p">132:拼接腔</p>
        <p type="p">134:內表面</p>
        <p type="p">140:次護罩</p>
        <p type="p">142:次腔</p>
        <p type="p">144:內表面</p>
        <p type="p">150:拼接支架</p>
        <p type="p">152:介電體</p>
        <p type="p">154:第一通道</p>
        <p type="p">156:第二通道</p>
        <p type="p">158:分隔壁</p>
        <p type="p">200:主雙軸電纜</p>
        <p type="p">202:第一導體</p>
        <p type="p">204:第二導體</p>
        <p type="p">206:裸露部分</p>
        <p type="p">208:裸露部分</p>
        <p type="p">210:主絕緣體</p>
        <p type="p">240:主電纜屏蔽層</p>
        <p type="p">244:主導電介面元件</p>
        <p type="p">302:第一導體</p>
        <p type="p">304:第二導體</p>
        <p type="p">306:裸露部分</p>
        <p type="p">308:裸露部分</p>
        <p type="p">310:次絕緣體</p>
        <p type="p">340:次電纜屏蔽層</p>
        <p type="p">344:次導電介面元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2172" publication-number="202631843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>疏水化離子交換樹脂及其製造方法</chinese-title>
        <english-title>HYDROPHOBIZED ION EXCHANGE RESINS AND METHODS OF MAKING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08J7/12</main-classification>
        <further-classification edition="201701120260504B">B01J41/07</further-classification>
        <further-classification edition="200601120260504B">B01J41/14</further-classification>
        <further-classification edition="200601120260504B">C08F14/18</further-classification>
        <further-classification edition="200601120260504B">C08F6/16</further-classification>
        <further-classification edition="200601120260504B">C08J3/03</further-classification>
        <further-classification edition="202301120260504B">C02F1/42</further-classification>
        <further-classification edition="200601320260504B">C02F101/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉斯　凱利　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUSH, KELLY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾曼　羅伯特　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILLMAN, ROBERT ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利伯曼　馬克　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIBERMAN, MARK JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫肯　彼得　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORKEN, PETER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯沃倫　約翰　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWOREN, JOHN CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離子交換樹脂，其係式1：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="181px" width="352px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;            &lt;br/&gt;&lt;br/&gt;其中Y係聚苯乙烯系骨架或聚丙烯酸系骨架；Y&lt;sup&gt;1&lt;/sup&gt;係-H或與Y相同或不同的聚苯乙烯系骨架或聚丙烯酸系骨架；R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;獨立地係具有烷基、伸烷基、炔、烯基、炔基、芳基、烷基芳基、芳基伸烷基、芳基炔、芳基烯基、芳基炔基、環狀、環脂族或多環部份之官能基的經取代或未經取代之化合物，其可可選地獨立地含有至少一個雜原子、至少一個含活性氫組分、至少一個四級氮部份、至少一個氟部份、或至少一個含羰基組分，或者R&lt;sup&gt;4&lt;/sup&gt;係-H；X係氯離子、溴離子、碘離子、氟離子、硫酸根、硝酸根、乙酸根、氫氧根、或甲酸根之相對離子；且n係正整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion exchange resin is of Formula 1: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="189px" width="353px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;where Y is a polystyrenic scaffold or polyacrylic scaffold; Y&lt;sup&gt;1&lt;/sup&gt; is -H or the same or a different polystyrenic scaffold or polyacrylic scaffold as Y; R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; are independently a substituted or unsubstituted compound having a functionality of alkyl, alkylene, alkyne, alkenyl, alkynyl, aryl, alkylaryl, arylalkylene, arylalkyne, arylalkenyl, arylalkynyl, cyclic, cycloaliphatic, or polycyclic moieties, which may optionally independently contain at least one heteroatom, at least one active hydrogen containing component, at least one quaternized nitrogen moiety, at least one fluorine moiety, or at least one carbonyl-containing component or where R&lt;sup&gt;4&lt;/sup&gt; is -H; X is a chloride, bromide, iodide, fluoride, sulfate, nitrate, acetate, hydroxide, or formate counterion; and n is a positive integer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2173" publication-number="202632699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>斷路器</chinese-title>
        <english-title>CIRCUIT BREAKER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260325B">H01H3/46</main-classification>
        <further-classification edition="200601120260325B">H01H13/703</further-classification>
        <further-classification edition="200601120260325B">H01H33/08</further-classification>
        <further-classification edition="200601120260325B">H01H71/64</further-classification>
        <further-classification edition="200601120260325B">H01H73/06</further-classification>
        <further-classification edition="200601120260325B">H01H73/18</further-classification>
        <further-classification edition="200601120260325B">H01H83/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士電機機器制御股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI ELECTRIC FA COMPONENTS &amp; SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長嶺一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMINE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]在斷路器中，抑制在跳脫動作時電弧氣體從構成肘節連桿的第二連桿的通孔逃脫的情況，謀求斷路性能的提升。  &lt;br/&gt;　　[解決手段]第二連桿(32)，構成開閉機構(19)之肘節連桿(26)的另一方，一端可轉動地連結於肘節銷(33)，另一端可轉動地連結於可動固定器(18)，使可動固定器(18)旋轉藉此進行接點的開閉。分隔壁(41)，設置成將開閉機構(19)側與可動固定器(18)側予以隔開，並形成有第二連桿(32)的通孔(42)。第二連桿(32)，在從寬度方向來看時，在其從一端至另一端之路徑中央，被形成為電源側之輪廓及負載側之輪廓雙方皆接近電源側之外形。通孔(42)，被設定為在不干涉第二連桿(32)之動作之範圍內使間隙成為最小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A second link constitutes another part of a toggle &lt;br/&gt;link in an open-close mechanism , has one end rotatably &lt;br/&gt;connected to a toggle pin and another end rotatably &lt;br/&gt;connected to a movable holder, and opens and closes a &lt;br/&gt;contact by causing the movable holder to rotate. A &lt;br/&gt;partition wall separates the open-close mechanism side &lt;br/&gt;and the movable holder side and has a slot for the second &lt;br/&gt; link. The second link is formed in an outer shape in &lt;br/&gt;which at a central portion of a path extending from one &lt;br/&gt;end to another end when viewed from a width direction, &lt;br/&gt;both an outline on a power supply side and an outline on &lt;br/&gt;a load side are drawn closer to a power supply side. The &lt;br/&gt;slot is set so that a gap is minimized within a range not &lt;br/&gt;causing interference with movement of the second link.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:斷路器</p>
        <p type="p">12:殼體</p>
        <p type="p">13:中蓋</p>
        <p type="p">14:頂蓋</p>
        <p type="p">16:固定接觸件</p>
        <p type="p">17:可動接觸件</p>
        <p type="p">18:可動固定器</p>
        <p type="p">19:開閉機構</p>
        <p type="p">21:固定接點</p>
        <p type="p">22:可動接點</p>
        <p type="p">26:肘節連桿</p>
        <p type="p">27:閂鎖</p>
        <p type="p">31:第一連桿</p>
        <p type="p">32:第二連桿</p>
        <p type="p">33:肘節銷</p>
        <p type="p">34:連結銷</p>
        <p type="p">36:閂鎖銷</p>
        <p type="p">37:拉柄</p>
        <p type="p">38:拉伸線圈彈簧</p>
        <p type="p">41:分隔壁</p>
        <p type="p">42:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2174" publication-number="202632700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>斷路器</chinese-title>
        <english-title>CIRCUIT BREAKER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260325B">H01H9/30</main-classification>
        <further-classification edition="200601120260325B">H01H9/34</further-classification>
        <further-classification edition="200601120260325B">H01H9/38</further-classification>
        <further-classification edition="200601120260325B">H01H71/52</further-classification>
        <further-classification edition="200601120260325B">H01H73/18</further-classification>
        <further-classification edition="200601120260325B">H01H83/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士電機機器制御股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI ELECTRIC FA COMPONENTS &amp; SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山村龍一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, RYUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長嶺一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMINE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種斷路器，抑制可動接觸件之限流開極動作所產生之電弧氣體往收納開閉機構的空間大量流出的情況，而防止對開閉機構造成影響。  &lt;br/&gt;　　[解決手段] 收容開閉接點(3)、固定器單元(18)及消弧裝置(7)的第1空間(S1)，與收容開閉機構(4)的第2空間(S2)，係由殼體內壁(2b)所分隔，在殼體內壁，形成有連通第1空間及第2空間，且沿著連結至固定器單元之肘節連桿機構(12)之下肘節(14)之動作範圍的下肘節通過孔(40)，且具備有，追隨可動接觸件(11)之限流開極動作時之下肘節之動作，而從第1空間側遮蔽下肘節通過孔之一部分的遮板部(32)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit breaker prevents adverse effects on an &lt;br/&gt;opening/closing mechanism by suppressing the large-scale &lt;br/&gt;outflow of arc gases, generated during a current-limiting &lt;br/&gt;opening operation of a movable contact piece, into a space &lt;br/&gt;in which the opening/closing mechanism is housed. In the &lt;br/&gt;circuit breaker, a first space in which a switching &lt;br/&gt;contact, a holder unit, and an arc-extinguishing device are &lt;br/&gt;housed is separated by a case inner wall from a second &lt;br/&gt;space in which an opening/closing mechanism are housed. The &lt;br/&gt;case inner wall has a lower toggle passage hole connecting &lt;br/&gt;the first space to the second space and extending along an &lt;br/&gt;operating range of a lower toggle of a toggle link &lt;br/&gt;mechanism coupled to the holder unit. A shutter section &lt;br/&gt;configured to block part of the lower toggle passage hole &lt;br/&gt;from the first space side in synchronization with the &lt;br/&gt;operation of the lower toggle during a current-limiting &lt;br/&gt;opening operation of a movable contact piece is provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:本體殼體</p>
        <p type="p">2a:下部殼體</p>
        <p type="p">2b:電源側中間殼體</p>
        <p type="p">4:開閉機構</p>
        <p type="p">5:開閉把手</p>
        <p type="p">7:消弧裝置</p>
        <p type="p">12:肘節連桿機構</p>
        <p type="p">13:三重橫桿</p>
        <p type="p">14:下肘節</p>
        <p type="p">15:上肘節</p>
        <p type="p">16:開閉彈簧</p>
        <p type="p">18:固定器單元</p>
        <p type="p">19:固定器殼體</p>
        <p type="p">31:肘節遮板</p>
        <p type="p">32:遮板部</p>
        <p type="p">35:卡合部</p>
        <p type="p">40:下肘節通過孔</p>
        <p type="p">S1:第1空間</p>
        <p type="p">S2:第2空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2175" publication-number="202631627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＳＩＫ２調節劑及其用途</chinese-title>
        <english-title>SIK2 MODULATORS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D491/22</main-classification>
        <further-classification edition="200601120260504B">C07D519/00</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/437</further-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61K31/501</further-classification>
        <further-classification edition="200601120260504B">A61K31/5025</further-classification>
        <further-classification edition="200601120260504B">A61K31/5383</further-classification>
        <further-classification edition="200601120260504B">A61K31/513</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商林伯士薩拉西亞公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIMBUS SALACIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　德潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DERUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都達　里拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODDA, LEELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾德蒙森　史考特　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDMONDSON, SCOTT D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉能　納森　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENUNG, NATHAN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛萊維斯　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAVES, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱拉　尼路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAILA, NEELU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普萊斯　丹尼爾　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRICE, DANIEL JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟吉葉　伊凡　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERGEYEV, IVAN V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙伊　姆迪　穆南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAIK, MD MUNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇來帕聶尼　瑟卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURAPANENI, SEKHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎波斯　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPOS, SEBASTIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德欣　羅素　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUSHIN, RUSSELL GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂夫克　布魯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFKER, BRUCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蕾絲　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRESSIES, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫尼柯　尼柯萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SITNIKOV, NIKOLAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式&lt;b&gt;I&lt;/b&gt;化合物、其組合物及使用該等化合物及組合物抑制SIK2及治療SIK2介導之病症的方法。  &lt;br/&gt;&lt;img align="absmiddle" height="208px" width="318px" file="ed11108.JPG" alt="ed11108.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides compounds of formula &lt;b&gt;I&lt;/b&gt;, compositions thereof, and methods of using the same for the inhibition of SIK2 and the treatment of SIK2-mediated disorders. &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="305px" file="ed11109.JPG" alt="ed11109.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2176" publication-number="202633317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151904</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓緩衝層邊緣的清洗方法和設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="200601120260302B">B08B3/02</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴奔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, BEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仰庶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種晶圓緩衝層邊緣的清洗方法和設備。清洗方法包括：旋轉晶圓，向晶圓表面噴灑第一清洗液，以去除所述晶圓邊緣的緩衝層，所述晶圓表面形成副產物印記；獲取所述副產物印記的位置，記為標記位置；保持晶圓旋轉，向所述標記位置噴灑第二清洗液，以去除所述晶圓表面的副產物印記；向所述晶圓表面噴灑沖洗液，以對所述晶圓進行沖洗。本申請的晶圓緩衝層邊緣的清洗方法對晶圓表面的副產物印記進行了針對清洗，提升了晶圓的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:卡盤</p>
        <p type="p">102:噴嘴</p>
        <p type="p">103:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2177" publication-number="202632407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於二次諧波與三次諧波產生的光學組件</chinese-title>
        <english-title>OPTICAL ASSEMBLY FOR SECOND AND THIRD HARMONIC GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02F1/377</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷克科學院物理研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FYZIKALNI USTAV AV CR, V.V.I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾瓦克　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVAK, ONDREJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈卡　澤別尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBKA, ZBYNEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學組件，用於利用兩個配置於溫度控制環境中的光學非線性晶體（C1、C2）產生雷射光束的二次諧波與三次諧波頻率。第一光學非線性晶體（C1）用於將基頻轉換為二次諧波，而第二光學非線性晶體（C2）則用於將基頻與二次諧波轉換為三次諧波頻率。該系統包含光束強度衰減機構，其利用第一半波片（HWP1）以及第一與第二偏振器（P1、P2），依據使用者需求導引光束。電動化線性平移台（T1、T2）用以確保不同諧波產生模式之間的切換。此外，光學非線性晶體（C1、C2）採用不同的晶體切割方式，使得相位匹配條件與轉換效率得以最佳化。該光學組件係設計用於高精度且具高度彈性的諧波雷射光束產生，並具有廣泛的產業應用性，特別適用於雷射微加工領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical assembly for generating the second and third harmonic frequencies of a laser beam using two optically nonlinear crystals (C1 and C2) arranged in a temperature-controlled environment. The first optically nonlinear crystal (C1) converts the fundamental frequency into the second harmonic, while the second optically nonlinear crystal (C2) converts the fundamental and second harmonic into the third harmonic frequency. The system includes beam-intensity attenuation mechanisms using a first half-wave plate (HWP1) and first and second polarizers (P1, P2), which direct the beam according to the user’s requirements. Motorized linear translation stages (T1, T2) ensure switching between harmonic-generation modes. Different crystal cuts of the optically nonlinear crystals (C1 and C2) enable optimization of phase matching and conversion efficiency. This assembly is designed for highly precise and flexible generation of harmonic laser beams with broad industrial applicability, particularly in laser micromachining.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BD1:第一吸收器</p>
        <p type="p">BD2:第二吸收器</p>
        <p type="p">BD3:第三吸收器</p>
        <p type="p">C1:第一非線性晶體</p>
        <p type="p">C2:第二非線性晶體</p>
        <p type="p">E1:第一偵測器</p>
        <p type="p">E2:第二偵測器</p>
        <p type="p">E3:第三偵測器</p>
        <p type="p">HWP1:第一半波片</p>
        <p type="p">HWP2:第二半波片</p>
        <p type="p">HWP3:第三半波片</p>
        <p type="p">L1:第一系統</p>
        <p type="p">L2:第二系統</p>
        <p type="p">L3:第三系統</p>
        <p type="p">M1:第一反射鏡</p>
        <p type="p">M2:第二反射鏡</p>
        <p type="p">M3:第三反射鏡</p>
        <p type="p">M4:第四反射鏡</p>
        <p type="p">P1:第一偏振器</p>
        <p type="p">P2:第二偏振器</p>
        <p type="p">P3:第三偏振器</p>
        <p type="p">P4:第四偏振器</p>
        <p type="p">P5:第五偏振器</p>
        <p type="p">P6:第六偏振器</p>
        <p type="p">R1:第一旋轉機械化安裝座</p>
        <p type="p">R2:第二電動化旋轉安裝座</p>
        <p type="p">R3:第三電動化旋轉安裝座</p>
        <p type="p">S1:第一分光器</p>
        <p type="p">S2:第二分光器</p>
        <p type="p">S3:第三分光器</p>
        <p type="p">S4:第四分光器</p>
        <p type="p">S5:第五分光器</p>
        <p type="p">S6:第六分光器</p>
        <p type="p">S7:第七分光器</p>
        <p type="p">T1:第一電動化線性平移台</p>
        <p type="p">T2:第二電動化線性平移台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2178" publication-number="202631827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚矽氧烷組合物、方法和其用途以及使用所述方法可獲得的產品</chinese-title>
        <english-title>POLYSILOXANE COMPOSITIONS, METHODS AND USES THEREOF, AND PRODUCTS OBTAINABLE USING SAID METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08G77/38</main-classification>
        <further-classification edition="200601120260424B">C08J9/08</further-classification>
        <further-classification edition="201501120260424B">G02B1/11</further-classification>
        <further-classification edition="201501120260424B">G02B1/111</further-classification>
        <further-classification edition="200601120260424B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商ＰＩＢＯＮＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIBOND OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶拉沙里　朱里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAULASAARI, JYRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連達拉　朱哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANTALA, JUHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡瑞斯德　基摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARASTE, KIMMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">發明涉及包含聚矽氧烷和式（II）的化合物的組合物、該組合物的製備方法、多孔聚矽氧烷膜的製備方法、通過該方法獲得的多孔聚矽氧烷膜、該組合物和多孔聚矽氧烷膜的用途、包含多孔聚矽氧烷膜的半導體裝置、以及製備半導體裝置的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">his invention relates to compositions comprising a polysiloxane and a compound of formula (II), a method for the preparation of the composition, a method for preparing a porous polysiloxane film, a porous polysiloxane film obtainable by said method, uses of the composition and the porous polysiloxane film, a semiconductor device comprising the porous polysiloxane film, and a method for preparing a semiconductor device.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2179" publication-number="202631648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環肽類化合物、藥物組合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K7/06</main-classification>
        <further-classification edition="201901120260504B">A61K38/08</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61K49/14</further-classification>
        <further-classification edition="200601120260504B">A61K51/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳忠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅紅江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, HONGJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁曉曦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, XIAOXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋宏梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HONGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞　文勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WENSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛均友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUNYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於藥物技術領域。本文提供了環肽類化合物，藥物組合物及其應用。本申請還涉及其化合物或其藥學上可接受的鹽、酯、立體異構體、互變異構體、同位素標記的化合物、多晶型物、溶劑化物、N-氧化物、代謝物或前藥或者本發明的藥物組合物或者本發明的藥物製劑在製備藥物，特別是用於診斷、預防或治療與GPC3活性相關的疾病或病況藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2180" publication-number="202631072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備的清潔策略確定方法及裝置、電子設備以及電腦可讀儲存媒體</chinese-title>
        <english-title>CLEANING STRATEGY DETERMINATION METHOD AND APPARATUS FOR CLEANING DEVICE, ELECTRONIC EQUIPMENT, AND COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">A47L11/40</main-classification>
        <further-classification edition="200601120260112B">A47L11/00</further-classification>
        <further-classification edition="202401120260112B">G05D1/633</further-classification>
        <further-classification edition="202401120260112B">G05D1/246</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯崢韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, ZHENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於清潔設備技術領域，提出一種清潔設備的清潔策略確定方法及裝置。清潔設備包括：設備本體、設置於設備本體上的第一測距感測器、設置在設備本體上的可升降的第二測距感測器；該方法包括：獲取第一測距感測器的工作狀態；回應於第一測距感測器為正常工作狀態，基於第一測距感測器的測高結果確定清潔設備的清潔策略；回應於第一測距感測器為失效工作狀態，基於地圖確定清潔設備的清潔策略；其中，所述清潔策略包括所述第二測距感測器的升降策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the technical field of cleaning devices, and proposes a cleaning strategy determination method and apparatus for a cleaning device. The cleaning device includes: a device body, a first distance sensor disposed on the device body, and a liftable second distance sensor disposed on the device body. The method includes: obtaining an operating status of the first distance sensor; in response to the first distance sensor being in a normal operating status, determining a cleaning strategy of the cleaning device based on a height measurement result of the first distance sensor; in response to the first distance sensor being in a failed operating status, determining the cleaning strategy of the cleaning device based on a map; wherein the cleaning strategy includes a lifting strategy of the second distance sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2181" publication-number="202633028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">H05K1/03</main-classification>
        <further-classification edition="200601120260401B">H05K3/46</further-classification>
        <further-classification edition="200601120260401B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王凱韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電路板結構及其製造方法。電路板結構包括基板、第一電路圖案、第二電路圖案及介電層。第一電路圖案設置於基板上，其中第一電路圖案具有第一電路密度。第二電路圖案設置於基板上，其中第二電路圖案具有第二電路密度，且第二電路密度小於第一電路密度。介電層包括第一部分及第二部分。第一部分覆蓋第一電路圖案，其中第一部分與第一電路圖案共同具有第一厚度t1。第二部分覆蓋第二電路圖案，其中第二部分與第二電路圖案共同具有第二厚度t2，且│(t1-t2)│/(t1+t2)≦20%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a first circuit pattern, a second circuit pattern, and a dielectric layer. The first circuit pattern is disposed on the substrate, wherein the first circuit pattern has a first circuit density. The second circuit pattern is disposed on the substrate, wherein the second circuit pattern has a second circuit density, and the second circuit density is smaller than the first circuit density. The dielectric layer includes a first portion and a second portion. The first portion covers the first circuit pattern, wherein the first portion and the first circuit pattern together have a first thickness t1. The second portion covers the second circuit pattern, wherein the second portion and the second circuit pattern together have a second thickness t2, and │(t1−t2)│/(t1+t2)≦20%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板結構</p>
        <p type="p">100:基板</p>
        <p type="p">103:第一電路圖案</p>
        <p type="p">104:第二電路圖案</p>
        <p type="p">105:第三電路圖案</p>
        <p type="p">106:第四電路圖案</p>
        <p type="p">107:第一定位部</p>
        <p type="p">203:第二定位部</p>
        <p type="p">213:第三定位部</p>
        <p type="p">300:介電層</p>
        <p type="p">300A:第一部分</p>
        <p type="p">300B:第二部分</p>
        <p type="p">300C:第三部分</p>
        <p type="p">310:介電層</p>
        <p type="p">310A:第四部分</p>
        <p type="p">310B:第五部分</p>
        <p type="p">310C:第六部分</p>
        <p type="p">t1:第一厚度</p>
        <p type="p">t2:第二厚度</p>
        <p type="p">t3:第三厚度</p>
        <p type="p">t4:第四厚度</p>
        <p type="p">t5:第五厚度</p>
        <p type="p">t6:第六厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2182" publication-number="202631073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>升降控制方法、升降控制系統、電子設備及電腦可讀儲存媒體</chinese-title>
        <english-title>LIFTING CONTROL METHOD, LIFTING CONTROL SYSTEM, ELECTRONIC DEVICE, AND COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">A47L11/40</main-classification>
        <further-classification edition="200601120260129B">F16M11/04</further-classification>
        <further-classification edition="200601120260129B">G01S17/08</further-classification>
        <further-classification edition="202001120260129B">G01S17/93</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯崢韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, ZHENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及清潔設備技術領域，提出一種升降控制方法、系統、電子設備及儲存媒體。設備本體上設置有第一測距感測器、可升降的第二測距感測器；在設備本體的前進方向上，第一測距感測器位於第二測距感測器的前方；該方法包括：獲取第二測距感測器的狀態，該狀態包括升起狀態、下降狀態；當第二測距感測器處於升起狀態時，根據第一測距感測器的測高結果確定第二測距感測器的下降策略；當第二測距感測器處於下降狀態時，根據第一測距感測器的測高結果確定第二測距感測器的升起策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the technical field of cleaning devices, and proposes a lifting control method, system, electronic device, and storage medium. A first distance sensor and a liftable second distance sensor are arranged on the device body. In the advancing direction of the device body, the first distance sensor is located in front of the second distance sensor. The method includes: acquiring a state of the second distance sensor, the state including a raised state and a lowered state; when the second distance sensor is in the raised state, determining a lowering strategy for the second distance sensor based on a height measurement result of the first distance sensor; and when the second distance sensor is in the lowered state, determining a raising strategy for the second distance sensor based on the height measurement result of the first distance sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2183" publication-number="202632313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測物件之方法及偵測系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DETERMINING OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01S17/08</main-classification>
        <further-classification edition="200601120260302B">G08G1/04</further-classification>
        <further-classification edition="200601120260302B">G08G1/017</further-classification>
        <further-classification edition="200601120260302B">G08G1/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳則朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSE-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">偵測物件之方法及系統包含雷達在參考時段對偵測區域執行雷達偵測；根據該雷達偵測之結果，計算雷達和偵測區域之參考物件之間的參考距離；雷達依序在複數個偵測的時間點分別發射無線訊號至偵測區域，以對應取得複數個雷達回波訊號；計算複數個雷達回波訊號在對應參考距離之處的能量；當對應第M1時間點之第M1雷達回波訊號在對應參考距離之處的能量低於第一預定值時，判定偵測到第一物體；當對應第M2時間點之第M2雷達回波訊號在對應參考距離之處的能量並未低於第一預定值時，判定第一物體係為行經偵測區域之移動物體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for determining object includes a radar performing radar detection on a detection area in a reference time period; calculating a reference distance between the radar and a reference object in the detection area according to a result of radar detection; the radar sequentially transmits wireless signals to the detection area at a plurality of detecting time to obtain a plurality of radar echo signals; calculating the energy of the plurality of radar echo signals at the corresponding reference distances; when the energy of the M1th radar echo signal at the corresponding reference distance at the M1th time is lower than a first predetermined value, a first object is detected; when the energy of the M2th radar echo signal at the corresponding reference distance at the M2th time is not lower than the first predetermined value, the first object is determined as a moving object passing through the detection area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">70:方法</p>
        <p type="p">S702-S710:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2184" publication-number="202632091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>原位膜生長感測器組件、設備及方法</chinese-title>
        <english-title>IN SITU FILM GROWTH SENSOR ASSEMBLY, APPARATUS, AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C30B25/02</main-classification>
        <further-classification edition="200601120260421B">C30B25/16</further-classification>
        <further-classification edition="200601120260421B">C30B35/00</further-classification>
        <further-classification edition="200601120260421B">G01B11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　者澎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, ZHEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欒欣寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUAN, XINNING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　恩樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOO, ENLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所揭示的實施例大體上係關於處理腔室中膜生長的原位監測。在一些實例中，用於處理腔室的感測器組件包括感測器管及感測器視窗，此感測器管包括碳化矽且在其中具有光路，且此感測器視窗包括結晶碳化矽且具有耦接到此感測器管之遠端的近側。此感測器視窗覆蓋此光路，且此感測器視窗遠離此近側的遠側垂直於此光路的中心軸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein generally relate to in situ monitoring of film growth in processing chambers. In some examples, a sensor assembly for a processing chamber includes a sensor tube including silicon carbide and having an optical path therein and a sensor window including crystalline silicon carbide and having a proximal side coupled to a distal end of the sensor tube. The sensor window covers the optical path, and a distal side of the sensor window facing away from the proximal side is perpendicular to a center axis of the optical path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:下視窗</p>
        <p type="p">112:基座</p>
        <p type="p">130:下襯墊</p>
        <p type="p">132:預熱環</p>
        <p type="p">133:安裝孔</p>
        <p type="p">160:感測器組件</p>
        <p type="p">161:感測器管</p>
        <p type="p">161a:近端</p>
        <p type="p">161b:遠端</p>
        <p type="p">161o:外表面</p>
        <p type="p">162:感測器視窗</p>
        <p type="p">162a:近側</p>
        <p type="p">162b:遠側</p>
        <p type="p">163:套管</p>
        <p type="p">163a:近端</p>
        <p type="p">163i:內表面</p>
        <p type="p">164:光路</p>
        <p type="p">164c:中心軸</p>
        <p type="p">165a:源電纜</p>
        <p type="p">165b:返回電纜</p>
        <p type="p">166:管道</p>
        <p type="p">171:填充材料</p>
        <p type="p">173:通氣孔</p>
        <p type="p">175:徑向間隙</p>
        <p type="p">176:膜</p>
        <p type="p">177:入射光</p>
        <p type="p">178:源光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2185" publication-number="202631644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳化釔（YC）膜的沈積</chinese-title>
        <english-title>DEPOSITION OF YTTRIUM CARBIDE (YC) FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07F15/00</main-classification>
        <further-classification edition="200601120260504B">C23C16/32</further-classification>
        <further-classification edition="200601120260504B">C23C16/455</further-classification>
        <further-classification edition="200601120260504B">C23C16/52</further-classification>
        <further-classification edition="202501120260504B">H10D64/01</further-classification>
        <further-classification edition="202501120260504B">H10D64/66</further-classification>
        <further-classification edition="202601120260504B">H10P14/24</further-classification>
        <further-classification edition="202601120260504B">H10P14/43</further-classification>
        <further-classification edition="202601120260504B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商液態空氣喬治斯克勞帝方法研究開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SU-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOO-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧沅泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, WONTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於形成稀土碳化物膜之方法，該方法包括以下步驟：a) 使襯底暴露於含稀土成膜組成物的蒸氣；b) 使該襯底暴露於共反應物；以及c) 重複該步驟a) 和b) 直至使用氣相沈積製程在該襯底上沈積所期望厚度的該稀土碳化物膜，其中該含稀土成膜組成物包含具有下式的含Cp稀土前驅物：Ln(R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;m&lt;/sub&gt;Cp)(R&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;n&lt;/sub&gt;Cp)(R-amd)，其中R-amd係RNC(CH&lt;sub&gt;3&lt;/sub&gt;)═NR；Cp係環戊二烯基；Ln選自Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb或Lu；R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;和R各自獨立地選自氫原子、C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;5&lt;/sub&gt;直鏈或支鏈烷基、C&lt;sub&gt;3&lt;/sub&gt;至C&lt;sub&gt;5&lt;/sub&gt;環狀烷基；m和n係整數。該前驅物可以是Y(EtCp)&lt;sub&gt;2&lt;/sub&gt;(iPr-amd)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming rare earth carbide films comprises the steps of: a) exposing a substrate to a vapor of a rare earth-containing film-forming composition; b) exposing the substrate to a co-reactant; and c) repeating the steps of a) and b) until a desired thickness of the rare earth carbide films is deposited on the substrate using a vapor deposition process, wherein the rare earth-containing film-forming composition comprises a Cp rare earth-containing precursor having the formula: Ln(R&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;m&lt;/sub&gt;Cp)(R&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;n&lt;/sub&gt;Cp)(R-amd), wherein R-amd is RNC(CH&lt;sub&gt;3&lt;/sub&gt;)═NR; Cp is cyclopentadienyl; Ln is selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb or Lu; R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt; and R each are independently selected from a hydrogen atom, a C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;5 &lt;/sub&gt;linear or branched alkyl-group, a C&lt;sub&gt;3&lt;/sub&gt; to C&lt;sub&gt;5&lt;/sub&gt; cyclic alkyl- group; m and n are integers. The precursor may be Y(EtCp)&lt;sub&gt;2&lt;/sub&gt;(iPr-amd).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2186" publication-number="202631356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測工件之位置之裝置、控制裝置、機器人系統、檢測工件之位置之方法及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J13/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">先前謀求提高工件之位置之檢測精度。  &lt;br/&gt;本發明之裝置100包含：圖像取得部106，其取得：為了執行對於作業區域內之工件之第1作業而拍攝到之拍攝有該作業區域的第1圖像資料、及為了於繼該第1作業之後執行對於下一作業區域內之工件之第2作業而拍攝到之拍攝有該下一作業區域的第2圖像資料；合成圖像產生部108，其產生將第1圖像資料與第2圖像資料合成之合成圖像資料；及位置檢測部104，其基於合成圖像資料，檢測成為第2作業之對象之工件之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人系統</p>
        <p type="p">12:機器人</p>
        <p type="p">14:視覺感測器</p>
        <p type="p">16:控制裝置</p>
        <p type="p">30:伺服馬達</p>
        <p type="p">32:處理器</p>
        <p type="p">34:記憶體</p>
        <p type="p">36:I/O介面</p>
        <p type="p">38:匯流排</p>
        <p type="p">100:裝置</p>
        <p type="p">102:區域設定部</p>
        <p type="p">104:位置檢測部</p>
        <p type="p">106:圖像取得部</p>
        <p type="p">108:合成圖像產生部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2187" publication-number="202633332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152182</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快速氣體交換設備、系統及方法</chinese-title>
        <english-title>FAST GAS EXCHANGE APPARATUS, SYSTEM, AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260420B">H10P72/00</main-classification>
        <further-classification edition="200601120260420B">G05D7/06</further-classification>
        <further-classification edition="200601120260420B">G05D16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田　艾許利睦郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, ASHLEY MUTSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾維斯　麥克Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLWERTH, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯庫斯　杜克丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCKIUS, DUC DANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路德維格　杰弗里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUDWIG, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>密森　艾德泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITHUN, ADITI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茲　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種氣體分配設備，具有一第一容器及一第二容器，該第一容器具有一第一上游端及一第一下游端，該第二容器具有一第二上游端及一第二下游端。容器切換閥與該第一容器的該第一下游端及該第二容器的該第二下游端流體連通。可操作該容器切換閥以選擇性地在處於一第一狀態時耦合該第一容器至該容器切換閥的一出口，且在處於一第二狀態時耦合該第二容器至該容器切換閥的該出口。提供複數個比例流量控制閥，具有並聯耦合至該容器切換閥的該出口的入口。該複數個比例流量控制閥具有出口，該等出口經配置以提供氣體至一處理腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas distribution apparatus is provided having a first reservoir with a first upstream end and a first downstream end and a second reservoir with a second upstream end and a second downstream end. A reservoir switch valve is in fluid communication with the first downstream end of the first reservoir and the second downstream end of the second reservoir. The reservoir switch valve operable to selectively couple the first reservoir to an outlet of the reservoir switch valve when in a first state, and couple the second reservoir to the outlet of the reservoir switch valve when in a second state. A plurality of proportional flow control valves are provided having inlets coupled in parallel to the outlet of the reservoir switch valve The plurality of proportional flow control valves have outlets configured to provide gas to a processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體分配系統</p>
        <p type="p">101:處理區域</p>
        <p type="p">108:共同封閉體</p>
        <p type="p">109a:第一氣體源</p>
        <p type="p">109b:第二氣體源</p>
        <p type="p">110:第一調節器</p>
        <p type="p">112:第一再填充閥</p>
        <p type="p">113:第一上游端</p>
        <p type="p">114:第一氣體容器</p>
        <p type="p">115:第一下游端</p>
        <p type="p">116:第一壓力計</p>
        <p type="p">120:第二調節器</p>
        <p type="p">122:第二再填充閥</p>
        <p type="p">123:第二上游端</p>
        <p type="p">124:第二氣體容器</p>
        <p type="p">125:第二下游端</p>
        <p type="p">126:第二壓力計</p>
        <p type="p">134:容器切換閥</p>
        <p type="p">135:出口</p>
        <p type="p">136:轉移器閥</p>
        <p type="p">138:前級管線</p>
        <p type="p">140a~140c:比例流量控制閥</p>
        <p type="p">142a~142c:氣動致動閥</p>
        <p type="p">144a~144c:壓力計</p>
        <p type="p">190:控制器</p>
        <p type="p">192:CPU</p>
        <p type="p">194:記憶體</p>
        <p type="p">196:支援電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2188" publication-number="202632804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器密封殼體構件</chinese-title>
        <english-title>SEALING HOUSING COMPONENT CONFIGURED FOR CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01R13/52</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚瑞科電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICOLINK ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器密封殼體構件，包含：密封內套筒、鎖固套環、前外覆套筒、後外覆套筒、前密封端蓋以及後密封端蓋。密封內套筒經配置而密封地容置電連接器的第一接頭與第二接頭。鎖固套環以將密封內套筒區分為前段套筒部及後段套筒部的方式可拆裝地箍套在密封內套筒外。前外覆套筒及後外覆套筒分別以內端與鎖固套環密封地相互接合的方式而箍套且包覆密封內套筒的前段套筒部及後段套筒部。前密封端蓋及後密封端蓋分別可拆裝地填塞設置於前外覆套筒及後外覆套筒的外端，且前密封端蓋及後密封端蓋分別供第一接頭及第二接頭的電線密封地穿設通過。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sealing housing component configured for a connector includes a sealing inner sleeve, a locking collar, a front outer covering sleeve, a rear outer covering sleeve, a front sealing end cap, and a rear sealing end cap. The sealing inner sleeve is configured to sealingly accommodate a first connector and a second connector of an electrical connector. The locking collar is detachably disposed around the sealing inner sleeve to define a front sleeve section and a rear sleeve section. The front outer covering sleeve and the rear outer covering sleeve respectively cover the front sleeve section and the rear sleeve section of the sealing inner sleeve and are sealingly coupled to the locking collar. The front sealing end cap and the rear sealing end cap are detachably arranged at outer ends of the front outer covering sleeve and the rear outer covering sleeve, respectively, and allow wires of the first connector and the second connector to sealingly pass therethrough.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器密封殼體構件</p>
        <p type="p">2:鎖固套環</p>
        <p type="p">3:前外覆套筒</p>
        <p type="p">31:前擴管段</p>
        <p type="p">4:後外覆套筒</p>
        <p type="p">41:後擴管段</p>
        <p type="p">5:前密封端蓋</p>
        <p type="p">51:半部前端蓋</p>
        <p type="p">510:前讓線槽</p>
        <p type="p">5:前密封端蓋</p>
        <p type="p">51:半部前端蓋</p>
        <p type="p">510:前讓線槽</p>
        <p type="p">6:後密封端蓋</p>
        <p type="p">61:半部後端蓋</p>
        <p type="p">610:後讓線槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2189" publication-number="202632561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理系統及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">G06Q10/101</main-classification>
        <further-classification edition="202001120260202B">G06F40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金澤崇大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAZAWA, SOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">共享在使用者之間及服務人員之間實施的警報應對程序。  &lt;br/&gt;　　本發明的資訊處理系統，具備：第一裝置，設置於第一設施；終端，具備從前述第一設施的使用者，接收針對在前述第一裝置中發生之警報的第一應對方法的輸入的輸入部；記憶部，將用於對應前述警報的程序與前述第一應對方法相關連而記憶；轉換部，將前述第一應對方法轉換成對該第一應對方法實施了加工的第二應對方法；以及顯示部，在前述第一裝置中發生了前述警報時，將前述程序與前述第二應對方法相關連而顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊處理系統</p>
        <p type="p">101:設施</p>
        <p type="p">102:裝置</p>
        <p type="p">103:第一記憶裝置</p>
        <p type="p">104:通信裝置</p>
        <p type="p">105:雲端伺服器(資訊處理裝置)</p>
        <p type="p">106:數據庫伺服器(記憶部)</p>
        <p type="p">107:AP伺服器</p>
        <p type="p">108:Web伺服器(顯示生成部)</p>
        <p type="p">109:使用者終端(終端)</p>
        <p type="p">110:服務人員終端(終端)</p>
        <p type="p">111:第二記憶裝置(記憶部)</p>
        <p type="p">112:第三記憶裝置(記憶部)</p>
        <p type="p">113:第四記憶裝置(記憶部)</p>
        <p type="p">114:文本登錄部</p>
        <p type="p">115:應對程序評價部</p>
        <p type="p">116:文本轉換部(轉換部)</p>
        <p type="p">117:控制部</p>
        <p type="p">1091:顯示器(顯示部)</p>
        <p type="p">1101:顯示器(顯示部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2190" publication-number="202631351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152327</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具及機器人系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J13/00</main-classification>
        <further-classification edition="200601120260430B">B07C5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松原瑶太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUBARA, YOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木忠則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TADANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口隼司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人系統，包括搬運裝置、機器人、控制裝置、位置檢測感測器及工具。搬運裝置將工件搬運至指定的作業領域。機器人對被配置於作業領域內的工件執行作業。控制裝置控制機器人。位置檢測感測器於較作業領域更於搬運方向的上游側中，檢測工件的抵達。工具包括工具基座部及壁部。工具基座部被固定於機器人。壁部被固定於工具基座部，透過接觸搬運中之工件的搬運方向下游側之一部分阻擋工件。工具與搬運裝置分別獨立地設置，並被配置於較工件更往作業領域內的一待機位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器人系統</p>
        <p type="p">2:輸送機</p>
        <p type="p">3:機器人</p>
        <p type="p">3a:法蘭部</p>
        <p type="p">4:控制裝置</p>
        <p type="p">5:攝影機</p>
        <p type="p">10:工具</p>
        <p type="p">C:標籤</p>
        <p type="p">L:距離</p>
        <p type="p">X:作業領域</p>
        <p type="p">Y:拍攝領域</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2191" publication-number="202631731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性組成物、樹脂及光學構件</chinese-title>
        <english-title>POLYMERIZABLE COMPOSITION, RESIN, AND OPTICAL COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260211B">C08F4/44</main-classification>
        <further-classification edition="201601120260211B">C08G75/0227</further-classification>
        <further-classification edition="200601120260211B">C08G18/79</further-classification>
        <further-classification edition="200601120260211B">C08K5/37</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮永朋治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYANAGA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合性組成物，含有選自由二官能以上的異氰酸酯的改質體及二官能以上的異氰酸酯所組成的群組中的至少一種聚異氰酸酯成分（A）、與選自由萘硫醇及萘二硫醇所組成的群組中的至少一種硫醇成分（B）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2192" publication-number="202631519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水處理裝置及水處理裝置的運轉方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260209B">C02F1/44</main-classification>
        <further-classification edition="202301120260209B">C02F9/00</further-classification>
        <further-classification edition="201901120260209B">C02F11/12</further-classification>
        <further-classification edition="200601120260209B">B01D61/26</further-classification>
        <further-classification edition="200601120260209B">C01B35/02</further-classification>
        <further-classification edition="200601320260209B">C02F101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栩内優仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCHINAI, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">水處理裝置1具有：儲存被處理水W的被處理水槽2、輸送該預處理水W的高壓泵3、第一逆滲透膜4、儲存該第一逆滲透膜4的濃縮水W1的濃縮水槽5、高壓泵6、以及用於處理第一逆滲透膜4的濃縮水W1的第二逆滲透膜7，且構成為將第二逆滲透膜7的透過水W2返送至被處理水槽2，並排出第二逆滲透膜7的濃縮水。第一逆滲透膜4及第二逆滲透膜7在有效膜面壓力2MPa（水溫25°C、純水）時，透過流速為0.5m/日以上、1.0m/日以下，或者有效膜面壓力1.5MPa（水溫25°C、純水）時，透過流速為0.5m/日以上、1.0m/日以下。透過此水處理裝置，能夠高效濃縮難去除物質並排出至系統外，而不使第一逆滲透膜的透過水的水質惡化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2193" publication-number="202633518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不規則直接覆金屬(DBM)及連接基材</chinese-title>
        <english-title>IRREGULAR DIRECT BONDED METAL (DBM) AND CONNECTION SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W80/00</main-classification>
        <further-classification edition="202601120260428B">H10W90/20</further-classification>
        <further-classification edition="202601120260428B">H10W70/40</further-classification>
        <further-classification edition="202601120260428B">H10W72/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁曉穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, XIAOYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳鼎皞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DINGHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢安安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, ANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李根赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KEUNHYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述之實施方案提供一種設備，其包括：一封裝的一導電部分，其包括一晶粒附接墊(die attach pad, DAP)；一半導體晶粒，其係耦接至該DAP；及一直接覆金屬(direct bonded metal, DBM)基材，其包括耦接至一介電層的至少一金屬層，該半導體晶粒及該DAP係包括在一第一垂直堆疊中，該第一垂直堆疊係與包括該DBM基材的一第二垂直堆疊分開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described implementations provide an apparatus that includes a conductive portion of a package, including a die attach pad (DAP), a semiconductor die coupled to the DAP, and a direct bonded metal (DBM) substrate including at least a metal layer coupled to a dielectric layer, the semiconductor die and the DAP being included in a first vertical stack separated from a second vertical stack including the DBM substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置封裝</p>
        <p type="p">108:DBM基材</p>
        <p type="p">110:圖案化金屬層</p>
        <p type="p">112:介電層</p>
        <p type="p">114:下金屬層</p>
        <p type="p">120:第二垂直堆疊</p>
        <p type="p">130:半導體晶粒</p>
        <p type="p">132:焊料層</p>
        <p type="p">134:晶粒附接墊</p>
        <p type="p">136:DBM凹槽</p>
        <p type="p">140:第一垂直堆疊</p>
        <p type="p">144:邊緣</p>
        <p type="p">146:邊緣</p>
        <p type="p">A:直線</p>
        <p type="p">B:直線</p>
        <p type="p">C:直線</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2194" publication-number="202631092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著性組織覆蓋物</chinese-title>
        <english-title>ADHESIVE TISSUE COVERING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61F2/02</main-classification>
        <further-classification edition="200601120260429B">A61B17/00</further-classification>
        <further-classification edition="200601120260429B">A61L31/16</further-classification>
        <further-classification edition="200601120260429B">A61L15/22</further-classification>
        <further-classification edition="200601120260429B">A61L15/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿克松根股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXOGEN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾斯馬迪　內斯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALSMADI, NESREEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜爾林　賈斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEUERLING, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪斯特　卡特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEISTER, CURT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格拉瓦爾　尼昆庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGRAWAL, NIKUNJ KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯皮爾曼　班傑明史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEARMAN, BENJAMIN SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種黏著性組織覆蓋物可包含基底膜以及構成為與組織結合之可生物降解且生物相容的黏著劑。黏著劑可被定位成沿著基底膜的一個或多個邊緣。於某些方面，一種黏著性組織條帶可包含由以組織為基礎之材料或可吸收聚合物之至少一者形成的基底膜、以及構成為與組織結合之可生物降解且生物相容的黏著劑。黏著劑可位於黏著性組織條帶之基底膜的一側上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基底膜</p>
        <p type="p">120:黏著劑</p>
        <p type="p">130:神經</p>
        <p type="p">140:黏著性覆蓋物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2195" publication-number="202633056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有獨特的電池模組支架的電池機櫃</chinese-title>
        <english-title>BATTERY CABINET WITH UNIQUE BATTERY MODULE BRACKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H05K7/14</main-classification>
        <further-classification edition="202501120260504B">H05K5/00</further-classification>
        <further-classification edition="200601120260504B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維諦公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERTIV CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯道夫　托馬斯Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUDOLPH, THOMAS M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁耶　亞當Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, ADAM W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種機櫃、用於將電池模組固定至機櫃的擱板以及用於將電池模組固定至擱板的方法。擱板可以包括頂表面。該擱板可以包括一組保持凸耳，該組保持凸耳被配置成耦接一組電池模組。該擱板可以包括一組對準凸耳，該組對準凸耳被配置成在將該組電池模組中的一個或更多個電池模組從非固定位置平移至固定位置時，將該一個或更多個電池模組對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:擱板</p>
        <p type="p">102a:側肋</p>
        <p type="p">102b:側肋</p>
        <p type="p">103a:相對側</p>
        <p type="p">103b:相對側</p>
        <p type="p">104:頂表面</p>
        <p type="p">106:前肋</p>
        <p type="p">107:前側</p>
        <p type="p">108:後肋</p>
        <p type="p">109:後側</p>
        <p type="p">110:支承肋</p>
        <p type="p">111:底表面</p>
        <p type="p">112:保持凸耳</p>
        <p type="p">114:對準凸耳</p>
        <p type="p">116:衝壓孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2196" publication-number="202631773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性組成物、樹脂、光學構件及組成物套組</chinese-title>
        <english-title>POLYMERIZABLE COMPOSITION, RESIN, OPTICAL COMPONENT, AND COMPOSITION KIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G18/10</main-classification>
        <further-classification edition="200601120260302B">C08G18/18</further-classification>
        <further-classification edition="200601120260302B">C08G18/32</further-classification>
        <further-classification edition="200601120260302B">C08G18/38</further-classification>
        <further-classification edition="200601120260302B">C08G18/76</further-classification>
        <further-classification edition="200601120260302B">C08G18/79</further-classification>
        <further-classification edition="200601120260302B">C08L75/04</further-classification>
        <further-classification edition="200601120260302B">G02B1/04</further-classification>
        <further-classification edition="200601120260302B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮永朋治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYANAGA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合性組成物，含有異氰脲酸酯（A）、作為一官能～四官能的硫醇化合物的硫醇（B）、作為pKa 1以下的酸的酸（C）及胺觸媒（D）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2197" publication-number="202632866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100116</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相切換式轉換器及其控制器和控制方法</chinese-title>
        <english-title>MULTIPHASE SWITCHING CONVERTER AND ITS CONTROLLER AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H02M3/156</main-classification>
        <further-classification edition="200601120260504B">H02M1/08</further-classification>
        <further-classification edition="200601120260504B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡望淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WANGMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張方禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種多相切換式轉換器及其控制器和控制方法。控制器包括開通時刻控制電路和開關控制電路。開通時刻控制電路根據多相切換式轉換器的輸出電壓和電壓參考訊號提供開通控制訊號，用於控制多相切換式轉換器中的多個切換式電路的導通時刻。開關控制電路根據分組開通模式致能訊號以及開通控制訊號提供多個開關控制訊號以控制多個切換式電路。當分組開通模式致能訊號致能分組開通模式時，開關控制電路根據開通控制訊號控制多個切換式電路分為多組依次導通，每組包括多個同時導通的切換式電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiphase switching converter, a controller and a control method thereof are disclosed. The controller comprises a turn-on control circuit and a switch control circuit. The turn-on control circuit provides a turn-on control signal according to an output voltage of the multiphase switching converter and a voltage reference signal, for turning on a plurality of switching circuits in the multiphase switching converter. The switch control circuit provides a plurality of switch control signals to control the plurality of switching circuits according to a mode enable signal and the turn-on control signal. When the mode enable signal enables a group turn-on mode, the switch control circuit divides the plurality of switching circuits as a plurality of groups, and each group is turned on successively according to the turn-on control signal, where each group comprises more than one switching circuit that is turned on simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:開通時刻控制電路</p>
        <p type="p">22:開關控制電路</p>
        <p type="p">100:多相切換式轉換器</p>
        <p type="p">112:輸入端</p>
        <p type="p">113:輸出端</p>
        <p type="p">1100-1~1100-6:切換式電路</p>
        <p type="p">1101:驅動器</p>
        <p type="p">1200:控制器</p>
        <p type="p">1300:系統控制器</p>
        <p type="p">1301:通訊匯流排</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2198" publication-number="202632782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線裝置</chinese-title>
        <english-title>ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">H01Q1/36</main-classification>
        <further-classification edition="200601120260401B">H01Q21/00</further-classification>
        <further-classification edition="201801120260401B">H04B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡立陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BING SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時光輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, KUANG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖貞慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, JANE-HWAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線裝置，包括巴特勒矩陣、開關以及天線模組。巴特勒矩陣包括輸入端和輸出端。開關連接於輸入端。天線模組包括天線單元、第一引導器以及第二引導器。天線單元連接於巴特勒矩陣之輸出端。第一引導器位於天線單元的一側。第二引導器位於天線單元的另一側。天線單元、第一引導器與第二引導器形成於基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna device includes a Butler matrix, a switch, and an antenna module. The Butler matrix includes an input and an output. The switch is connected to the input. The antenna module includes an antenna unit, a first guide, and a second guide. The antenna unit is connected to the output of the Butler matrix. The first guide is located on one side of the antenna unit. The second guide is located on the other side of the antenna unit. The antenna unit, the first guide, and the second guide are formed on a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140C:天線模組</p>
        <p type="p">141:第一引導器</p>
        <p type="p">142:第二引導器</p>
        <p type="p">143C:天線單元</p>
        <p type="p">144:串接網路</p>
        <p type="p">D1:第一開關部</p>
        <p type="p">D2:第二開關部</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
        <p type="p">S3:第三側</p>
        <p type="p">S4:第四側</p>
        <p type="p">X、Y:軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2199" publication-number="202633333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置用洗滌器</chinese-title>
        <english-title>SCRUBBER FOR SEMICONDUCTOR APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10P72/00</main-classification>
        <further-classification edition="200601120260427B">B08B3/04</further-classification>
        <further-classification edition="200601120260427B">B08B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吴承桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吴承桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及可以有效地洗滌在執行半導體程序之後產生的氣體的半導體裝置用洗滌器。上述半導體裝置用洗滌器包括：吸收塔，將上述氣體混合物分離成第一氣體和第二氣體；外罩，在上述吸收塔內，形成執行第一洗滌程序的第一洗滌空間；第一托盤，與上述外罩的第一內側壁相連接，沿與上述第一內側壁交叉的第一方向延伸；第一托盤孔，沿與上述第一方向交叉的第二方向貫通上述第一托盤，使得上述氣體混合物通過；以及溶液供給噴嘴，向上述第一托盤的上表面供給執行上述第一洗滌程序的第一洗滌溶液，上述氣體混合物通過上述第一托盤孔沿上述第二方向上升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scrubber for semiconductor apparatus comprises an absorption tower for separating a gas mixture into a first gas and a second gas, a housing defining a first scrubbing space in which a first scrubbing process is performed, wherein the housing is disposed in the absorption tower, a first tray connected to a first inner wall of the housing and extending in a first direction intersecting the first inner wall, a first tray hole penetrating the first tray in a second direction intersecting the first direction and through which the gas mixture passes, and a solution supply nozzle for providing a first scrubbing solution for performing the first scrubbing process to an upper surface of the first tray, wherein the gas mixture passes through the first tray hole and rises in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一配管</p>
        <p type="p">20:半導體裝置用洗滌器</p>
        <p type="p">25:氣體注入口</p>
        <p type="p">26:氣體排出口</p>
        <p type="p">210:吸收塔</p>
        <p type="p">210ISW1:第一內側壁</p>
        <p type="p">215a:第二洗滌空間</p>
        <p type="p">217a:第一清洗頭部</p>
        <p type="p">220:外罩</p>
        <p type="p">220ISW1:第一內側壁</p>
        <p type="p">220ISW4:第四內側壁</p>
        <p type="p">220OSW1:第一外側壁</p>
        <p type="p">225:第一洗滌空間</p>
        <p type="p">227:溶液供給噴嘴</p>
        <p type="p">230:第一托盤</p>
        <p type="p">230H:第一托盤孔</p>
        <p type="p">235:第一托盤壁</p>
        <p type="p">240:第二托盤</p>
        <p type="p">240H:第二托盤孔</p>
        <p type="p">245:第二托盤壁</p>
        <p type="p">250:第三托盤</p>
        <p type="p">250H:第三托盤孔</p>
        <p type="p">255:第三托盤壁</p>
        <p type="p">260:除霧器</p>
        <p type="p">270:洗滌溶液儲存部</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">P:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2200" publication-number="202632448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>參數調優方法與噴膠設備</chinese-title>
        <english-title>PARAMETER TUNING METHOD AND GLUE SPRAYING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G05B19/408</main-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="200601120260309B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中達電子（江蘇）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (JIANGSU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOR-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾奎富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUEI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昱瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種參數調優方法與噴膠設備。所述參數調優方法可應用於一設備，所述設備的參數包括輸入參數、輸出值及目標值。所述參數調優方法包括：獲取所述設備的所述輸入參數及所述輸出值的數學模型；獲取所述目標值；獲取所述輸出值；若所述輸出值與所述目標值之差的絕對值大於第一閾值，則根據所述數學模型調節所述輸入參數，使得調節後的輸出值與所述目標值之差的絕對值減小。本發明可根據設備的輸入參數及輸出值的數學模型，自動調整輸入參數，不僅提升了設備的智慧化水準，而且降低了人力操作的頻率，節省了成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a parameter tuning method and glue spraying equipment. The parameter tuning method can be applied to a device, and the parameters of the device include input parameters, output values, and target values. The parameter tuning method includes: obtaining a mathematical model of the input parameters and the output value of the device; obtaining the target value; obtaining the output value; if the absolute value of the difference between the output value and the target value is greater than a first threshold, adjusting the input parameter according to the mathematical model so that the absolute value of the difference between the adjusted output value and the target value is reduced. The present invention can automatically adjust the input parameters according to the mathematical model of the input parameters and output values of the equipment, which not only improves the intelligence level of the equipment, but also reduces the frequency of manual operation and saves costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:參數調優方法</p>
        <p type="p">S101、S102、S102、S104、S105、S106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2201" publication-number="202631963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶組成物、液晶顯示元件及液晶組成物在液晶顯示元件中的用途</chinese-title>
        <english-title>LIQUID CRYSTAL COMPOSITION, LIQUID CRYSTAL DISPLAY ELEMENT AND USE OF LIQUID CRYSTAL COMPOSITION IN LIQUID CRYSTAL DISPLAY ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K19/34</main-classification>
        <further-classification edition="200601120260202B">C09K19/42</further-classification>
        <further-classification edition="200601120260202B">C09K19/44</further-classification>
        <further-classification edition="200601120260202B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇和成顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HECHENG DISPLAY TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉澤美保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGISAWA, MIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮川永久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGAWA, NAGAHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶畑仁志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBATA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種液晶組成物及包含該組成物的AM元件，所述液晶組成物充分滿足上限溫度高、下限溫度低、黏度小、光學各向異性適當、介電各向異性大、短軸方向上的介電常數大、短軸方向上的介電常數相對於介電各向異性的比大、比電阻大、對光及熱的穩定性高、彈性常數大之類的特性的至少一種，或關於至少兩種特性而具有適當平衡。一種液晶組成物，含有具有大的光學各向異性的特定化合物作為成分A，亦可含有作為成分B的具有大的介電各向異性的特定化合物、作為成分C的具有小的黏度或高的上限溫度的特定化合物、或者作為成分D的具有大的短軸方向上的介電常數的特定化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a liquid crystal composition that satisfies at least one property such as high upper temperature limit, low lower temperature limit, low viscosity, appropriate optical anisotropy, large dielectric anisotropy, large dielectric constant in the short-axis direction, a large ratio of dielectric constant in the short-axis direction to dielectric anisotropy, high specific resistance, high stability against light and heat, and large elastic constant, or that possesses a suitable balance for at least two of these properties, and to provide an AM device including this composition. &lt;br/&gt;It is a liquid crystal composition that may contain, as component A, a specific compound having a large optical anisotropy; as component B, a specific compound having a large dielectric anisotropy; as component C, a specific compound having low viscosity or a high upper temperature limit; or as component D, a specific compound having a large dielectric constant in the short-axis direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2202" publication-number="202632239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉矩感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">G01L3/02</main-classification>
        <further-classification edition="200601120260326B">G01L3/04</further-classification>
        <further-classification edition="200601120260326B">G01L3/14</further-classification>
        <further-classification edition="202001120260326B">G01L5/1627</further-classification>
        <further-classification edition="200601120260326B">G01L19/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上裕昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本良寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">例如，本發明提供一種轉矩感測器，其能夠以簡易的結構固定，進而容易提高轉矩的檢測精度。例如，一種轉矩感測器（1、2），包括：轉軸（S）；應變體（101、201），與轉軸（S）連結；及殼體（40、40a），對應變體（101、201）進行支撐，應變體（101、201）包括在軸向上固定於殼體（40、40a）的部分（120、220），應變體（101、201）的部分（120、220）具有與殼體（40、40a）的沿軸向延伸的面（34、44）相向的第一面（121o、221o）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:框架</p>
        <p type="p">22:內壁</p>
        <p type="p">23:外壁</p>
        <p type="p">30:外殼</p>
        <p type="p">32、121:突出部</p>
        <p type="p">34、35:面</p>
        <p type="p">34p:凸部</p>
        <p type="p">40:殼體</p>
        <p type="p">101:應變體</p>
        <p type="p">102:軸承</p>
        <p type="p">102i:內圈</p>
        <p type="p">102o:外圈</p>
        <p type="p">110:內周部</p>
        <p type="p">111:第一部分</p>
        <p type="p">112:第二部分</p>
        <p type="p">120:外周部</p>
        <p type="p">121i:內周面</p>
        <p type="p">121o:第一面</p>
        <p type="p">122:凸緣</p>
        <p type="p">122a:第二面</p>
        <p type="p">123:第一凸部</p>
        <p type="p">124:第二凸部</p>
        <p type="p">130:連結部</p>
        <p type="p">a、b、c、d:箭頭</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:規定的距離</p>
        <p type="p">S:轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2203" publication-number="202631592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗蝕劑底層膜形成用組成物及半導體基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D341/00</main-classification>
        <further-classification edition="200601120260302B">C07D409/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ　股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平澤賢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRASAWA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永縄温子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANAWA, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡勇気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成埋入性及耐彎曲性優異的膜的抗蝕劑底層膜形成用組成物及半導體基板的製造方法。一種抗蝕劑底層膜形成用組成物，含有含硫化合物及溶媒，所述含硫化合物為下述式（1）所表示的化合物。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="188px" width="358px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;式（1）中，Ar為經取代或未經取代的碳數3～20的芳香環；X為硫原子、-S(=O)-或-S(=O)&lt;sub&gt;2&lt;/sub&gt;-；n為4～8的整數；多個Ar及X分別相互相同或不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:抗蝕劑底層膜圖案</p>
        <p type="p">3a:抗蝕劑底層膜圖案的橫側面</p>
        <p type="p">X1、X2、X3、X4、X5、X6、X7、X8、X9、X10、Xa:位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2204" publication-number="202632890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">H03H9/15</main-classification>
        <further-classification edition="202301120260401B">H10N30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電波工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHON DEMPA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大桃亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMOMO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在應對小型化、可靠性提高的要求的同時也能夠應對各種用途且穩定性優異的壓電元件。本發明具有：封裝體，包括在俯視下為矩形形狀的底板、沿著所述底板的邊緣設置且高度朝所述底板的外緣呈階梯狀變高的壁部、配置在所述底板的上表面的第一安裝端子、配置在所述壁部的上表面且配置在相互不同的高度的第二安裝端子與第三安裝端子；熱敏電阻，安裝在所述第一安裝端子；第一壓電振動片，安裝在所述第二安裝端子且在俯視下為矩形形狀；以及第二壓電振動片，安裝在所述第三安裝端子，在俯視下為矩形形狀且具備比所述第一壓電振動片更大的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶體振動子(壓電元件)</p>
        <p type="p">2:晶體振動子用封裝體(封裝體)</p>
        <p type="p">2a:安裝空間</p>
        <p type="p">3:第一晶體振動片(第一壓電振動片)</p>
        <p type="p">4:第二晶體振動片(第二壓電振動片)</p>
        <p type="p">5:熱敏電阻</p>
        <p type="p">6:罩體(蓋子)</p>
        <p type="p">11:第一壁</p>
        <p type="p">12:第二壁</p>
        <p type="p">13:第三壁</p>
        <p type="p">14:底板</p>
        <p type="p">15:導體圖案</p>
        <p type="p">17:第二安裝端子</p>
        <p type="p">18:第三安裝端子</p>
        <p type="p">21、24、43、44:導電性黏接劑</p>
        <p type="p">27a、28a、29a、30a、31、32:外部連接端子</p>
        <p type="p">27b:連接配線(城堡形結構)</p>
        <p type="p">30b、45:連接配線</p>
        <p type="p">41、42:第一安裝端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2205" publication-number="202631314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光設備、其方法、及非暫時性電腦可讀取媒體</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING APPARATUS, METHODS THEREOF, AND NON-TRANSITORY COMPUTER READABLE MEDIUMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260421B">B24B49/00</main-classification>
        <further-classification edition="200601120260421B">B24B47/12</further-classification>
        <further-classification edition="200601120260421B">B24B57/02</further-classification>
        <further-classification edition="202601120260421B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特海德　湯瑪士Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSTERHELD, THOMAS H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢　隽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏斯威爾　尼可拉斯Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISWELL, NICHOLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化學機械拋光設備包括：平台；在平台上支撐的拋光墊；載具頭，用於抵靠拋光墊固持基板表面；馬達，用於在平台與載具頭之間產生相對運動，以便拋光基板上的上層；原位聲波監測系統，包含從基板表面接收聲波信號的聲波感測器；以及控制器，經配置為基於來自原位聲波監測系統的信號來檢測基板上的拓撲的平坦化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">110:拋光墊</p>
        <p type="p">502:晶圓</p>
        <p type="p">504:圖案化層</p>
        <p type="p">508:填料層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2206" publication-number="202633493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置及接合頭</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/30</main-classification>
        <further-classification edition="200601120260302B">B08B5/00</further-classification>
        <further-classification edition="202601120260302B">H10W40/43</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬山耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEYAMA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於藉由簡單的結構抑制樹脂的揮發成分對接合裝置的附著。本發明包括：接合工具，具有保持面、及與所述保持面相反的背面，在所述保持面吸附半導體晶粒；加熱器，與所述背面相接，以能夠對所述接合工具進行熱傳導；主體，在端部組裝所述加熱器，且形成有向所述加熱器供給冷卻空氣的冷卻氣體流路；以及氣體排出構件，組裝於所述主體，自所述冷卻氣體流路的排出口流入所述冷卻空氣，並且設置有在所述接合工具的外緣開口的開口部。本發明也包括一種接合頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接合裝置</p>
        <p type="p">100:接合頭</p>
        <p type="p">110:接合工具</p>
        <p type="p">111:背面</p>
        <p type="p">112:保持面</p>
        <p type="p">120:加熱器</p>
        <p type="p">121:上表面</p>
        <p type="p">122、134:下表面</p>
        <p type="p">123:外緣</p>
        <p type="p">124:抽吸孔</p>
        <p type="p">130:主體</p>
        <p type="p">131:抽吸路徑</p>
        <p type="p">132:冷卻氣體流路</p>
        <p type="p">132a:接觸區域</p>
        <p type="p">132b:導通路</p>
        <p type="p">133:空氣排出口</p>
        <p type="p">135:側面</p>
        <p type="p">140:氣體排出構件</p>
        <p type="p">141:上表面構件</p>
        <p type="p">142:下表面構件</p>
        <p type="p">143:氣體抽吸開口部</p>
        <p type="p">144:氣體導通路</p>
        <p type="p">145:凸緣</p>
        <p type="p">1000:半導體晶粒</p>
        <p type="p">1100:基板</p>
        <p type="p">1200:基板工作台</p>
        <p type="p">P:抽吸泵</p>
        <p type="p">Tb:抽吸管</p>
        <p type="p">X、Y、Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2207" publication-number="202633337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶舟及半導體製程設備</chinese-title>
        <english-title>BOAT AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嶸彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, RONG BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慧萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUI PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關嘯塵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, XIAO CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高爽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種晶舟及半導體製程設備，屬於半導體技術領域。晶舟包括支撐架，支撐架的內部設有晶圓承載空間，且支撐架具有中心軸線，支撐架沿環繞中心軸線的方向間隔設置至少三個支撐柱，其中包括第一支撐柱、第二支撐柱和第三支撐柱，第一支撐柱和第二支撐柱之間形成用於供晶圓傳輸裝置通過的開口，開口與晶圓承載空間連通，且開口與第三支撐柱相對，各支撐柱均設有晶圓承載面，各支撐柱的晶圓承載面可支撐晶圓承載空間內的同一晶圓，且第一支撐柱的晶圓承載面和第二支撐柱的晶圓承載面分別沿環繞中心軸線的方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a boat and semiconductor process equipment, belonging to the field of semiconductor technology. The boat includes a support frame, and the interior of which is provided with a wafer carrying space. The support frame has a central axis, and at least three support pillars are spaced apart along the direction surrounding the central axis, including a first support pillar, a second support pillar, and a third support pillar. An opening for a wafer transport device to pass through is formed between the first support pillar and the second support pillar. The opening communicates with the wafer carrying space and is opposite to the third support pillar. Each support pillar has a wafer carrying surface, and the wafer carrying surfaces of each of the support pillars can support the same wafer within the wafer carrying space. The wafer carrying surfaces of the first support pillar and the second support pillar respectively extend along the direction surrounding the central axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶舟</p>
        <p type="p">110:支撐主體</p>
        <p type="p">111:導流孔</p>
        <p type="p">120:頂板</p>
        <p type="p">130:底板</p>
        <p type="p">200:支撐柱</p>
        <p type="p">201:第一支撐柱</p>
        <p type="p">202:第二支撐柱</p>
        <p type="p">203:第三支撐柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2208" publication-number="202632729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少粒子的紋理化植入機組件以及離子植入機</chinese-title>
        <english-title>TEXTURED IMPLANTER COMPONENTS FOR PARTICLE REDUCTION AND ION IMPLANTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H01J37/317</main-classification>
        <further-classification edition="200601120260420B">H01J37/30</further-classification>
        <further-classification edition="200601120260420B">H01J37/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具　本雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, BON-WOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利坎斯奇　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIKHANSKII, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙哥馬利　喬安娜　吳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTGOMERY, JOANNA WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉梅爾　蒂莫西　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMMEL, TIMOTHY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特拉托蒂　葛雷哥里　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRATOTI, GREGORY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　澤仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TSEH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>墨菲　保羅　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, PAUL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>因諾森蒂　格雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOCENTI, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於離子植入機中具有鄰近離子束通過離子植入機的路徑的表面的組件。此類表面將容易沉積，並且本發明解決與沉積材料剝離相關的問題。提供離子植入機組件，其具有至少部分地界定通過離子植入機的離子束路徑的表面，其中表面的至少部分被紋理化，紋理包括鋸齒或金字塔結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to components in ion implanters having surfaces adjacent to the path of the ion beam through the ion implanter. Such surfaces will be prone to deposition and the present invention addresses problems associated with delamination of deposited material. An ion implanter component is provided that has a surface defining at least in part an ion beam path through the ion implanter, wherein at least a portion of the surface is textured, the texture including serrations or pyramidal structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離子植入機</p>
        <p type="p">102:基板</p>
        <p type="p">119:平臺</p>
        <p type="p">200:受影響的表面</p>
        <p type="p">210:實例製程腔室</p>
        <p type="p">220:膜</p>
        <p type="p">230:劑量杯孔徑</p>
        <p type="p">240:晶圓支撐組件</p>
        <p type="p">245:劑量杯組件</p>
        <p type="p">IB:離子束/入射離子束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2209" publication-number="202633049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>操作裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">H05K5/02</main-classification>
        <further-classification edition="200601120260430B">H05K9/00</further-classification>
        <further-classification edition="200601120260430B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高沖英里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKI, HIDESATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津田丈嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUDA, TAKETSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作裝置，是一種產業機械的操作裝置，包括透過相互組合而在內部界定出收納空間的第一殼體及第二殼體、配置於收納空間會發熱的電子元件、貼附於對應第一殼體的內側面及第二殼體的內側面中電子元件的位置的各領域且分別連接特定電位的一對金屬板、設於金屬板的電子元件側的表面的吸熱層，金屬板為了將接收到的熱進行擴散而具有比第一殼體及第二殼體還要高的熱傳導率、吸熱層具有比金屬板還要高的輻射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:控制基板</p>
        <p type="p">21:基板</p>
        <p type="p">22、23:安裝面</p>
        <p type="p">25:電子元件</p>
        <p type="p">25a:CPU</p>
        <p type="p">25b:散熱鰭片</p>
        <p type="p">26:導電性墊片</p>
        <p type="p">30:機殼</p>
        <p type="p">31:收納空間</p>
        <p type="p">40:表殼體</p>
        <p type="p">41:開口面</p>
        <p type="p">42:內周面</p>
        <p type="p">43:金屬板</p>
        <p type="p">44:樹脂板</p>
        <p type="p">44c:貫穿孔</p>
        <p type="p">50:裏殼體</p>
        <p type="p">50s:安裝部</p>
        <p type="p">51:開口面</p>
        <p type="p">52:內周面</p>
        <p type="p">53:金屬板</p>
        <p type="p">54:樹脂板</p>
        <p type="p">60:螢幕裝置</p>
        <p type="p">70:薄膜鍵盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2210" publication-number="202631352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制裝置、機器人系統、控制方法以及控制程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B25J13/00</main-classification>
        <further-classification edition="200601120260430B">G05B19/18</further-classification>
        <further-classification edition="200601120260430B">G05B13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松原瑶太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSUBARA, YOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木忠則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TADANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口隼司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機器人系統的控制裝置，機器人系統包括輸送工件的輸送裝置，以及對由輸送裝置移動的工件執行指定作業的機器人，控制裝置包括至少一個記憶體；以及至少一個處理器；記憶體儲存表現輸送裝置之動態特性的動態特性模型；處理器取得驅動輸送裝置的動作指令，並根據動作指令以及動態特性模型，算出輸送裝置之位移量的推定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器人系統</p>
        <p type="p">10:控制裝置</p>
        <p type="p">20:輸送帶</p>
        <p type="p">21:皮帶</p>
        <p type="p">22:驅動部</p>
        <p type="p">22a:馬達</p>
        <p type="p">22b:驅動電路</p>
        <p type="p">23:輸送帶控制裝置</p>
        <p type="p">24:感測器</p>
        <p type="p">24a:發光部</p>
        <p type="p">24b:受光部</p>
        <p type="p">30:機器人</p>
        <p type="p">31:手腕部</p>
        <p type="p">32:手掌部</p>
        <p type="p">A:雷射</p>
        <p type="p">W:工件</p>
        <p type="p">X:作業區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2211" publication-number="202631566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗蝕劑底層膜形成用組成物及半導體基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C49/423</main-classification>
        <further-classification edition="200601120260302B">C08G8/00</further-classification>
        <further-classification edition="200601120260302B">C08G61/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ　股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平澤賢悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRASAWA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永縄温子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANAWA, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡勇気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成埋入性及平坦性優異的膜的抗蝕劑底層膜形成用組成物及半導體基板的製造方法。一種抗蝕劑底層膜形成用組成物，含有含羰基的化合物及溶媒，所述含羰基的化合物具有選自由下述式（A1）所表示的部分結構及下述式（A2）所表示的部分結構所組成的群組中的至少一個部分結構。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="342px" width="346px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式中，Ar&lt;sup&gt;1&lt;/sup&gt;及Ar&lt;sup&gt;2&lt;/sup&gt;為碳數3～20的芳香環；R&lt;sup&gt;1&lt;/sup&gt;為羥基、硝基、鹵素原子或碳數1～20的一價有機基；所述式（A1）中，Y&lt;sup&gt;1&lt;/sup&gt;或Y&lt;sup&gt;2&lt;/sup&gt;的其中一者為羰基，另一者為單鍵、氧原子、硫原子或亞甲基；n為1或2；p為0～4的整數；*為與所述含羰基的化合物中的其他部分結構的鍵結部位。）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:矽基板</p>
        <p type="p">2:抗蝕劑底層膜</p>
        <p type="p">a:距溝槽圖案的端部為5μm的位置的非溝槽圖案的部分</p>
        <p type="p">b:溝槽圖案的中央部分</p>
        <p type="p">△FT:差</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2212" publication-number="202632240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100407</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車的踏力計</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">G01L3/02</main-classification>
        <further-classification edition="200601120260326B">G01L3/04</further-classification>
        <further-classification edition="200601120260326B">G01L3/14</further-classification>
        <further-classification edition="202001120260326B">G01L5/1627</further-classification>
        <further-classification edition="200601120260326B">G01L19/14</further-classification>
        <further-classification edition="202001120260326B">B62J45/411</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上裕昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文字山竜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONJIYAMA, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">例如，提供一種檢測精度及機械強度優異、且具有容易小型化的構造的自行車的踏力計。例如一種自行車的踏力計（1），其包括：軸承（102）；軸（S）；保持器（101），具有保持軸承（102）的保持部（110）及在徑向上延伸的能夠變形的面（101a）；以及多個應變感測器（103s），多個應變感測器（103s）包括：第一應變感測器（103s1），安裝於能夠變形的面（101a）的第一部分（101a1）；第二應變感測器（103s2），安裝於第二部分（101a2）；以及第三應變感測器（103s3），安裝於第三部分（101a3），多個應變感測器（103s）在周向上排列，第二部分（101a2）及第三部分（101a3）較第一部分（101a1）更大程度地變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:踏力計</p>
        <p type="p">10:感測器裝置</p>
        <p type="p">20:框架</p>
        <p type="p">101:保持器/應變體</p>
        <p type="p">101a:能夠變形的面</p>
        <p type="p">101a1:第一部分</p>
        <p type="p">101a2:第二部分</p>
        <p type="p">101a3:第三部分</p>
        <p type="p">103s:多個應變感測器</p>
        <p type="p">103s1:第一應變感測器</p>
        <p type="p">103s2:第二應變感測器</p>
        <p type="p">103s3:第三應變感測器</p>
        <p type="p">D、R、T、U:箭頭</p>
        <p type="p">h1、h2、h3:部分/與外部的裝置連結的部分</p>
        <p type="p">S:軸</p>
        <p type="p">X:旋轉軸</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;、θ&lt;sub&gt;2&lt;/sub&gt;、θ&lt;sub&gt;3&lt;/sub&gt;:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2213" publication-number="202632093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耐等離子體玻璃、用於半導體製造工藝的腔室內部部件及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C30B29/16</main-classification>
        <further-classification edition="200601120260306B">C04B35/14</further-classification>
        <further-classification edition="200601120260306B">C03C21/00</further-classification>
        <further-classification edition="200601120260306B">C03C3/087</further-classification>
        <further-classification edition="200601120260306B">C03C3/083</further-classification>
        <further-classification edition="200601120260306B">C03C3/076</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓松ＩＯＮＥＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSOL IONES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全㥠軟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SEO YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAE GEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種耐等離子體玻璃、用於半導體製造工藝的腔室內部部件及其製造方法，上述耐等離子體玻璃即使包含高含量Si基氧化物也可容易熔融，能夠最小化刻蝕過程中的雜質產生，並提高耐刻蝕性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11:組合物熔融步驟</p>
        <p type="p">S13:冷卻步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2214" publication-number="202633388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製程腔室及半導體製程設備</chinese-title>
        <english-title>PROCESS CHAMBER AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="200601120260302B">G01B11/27</further-classification>
        <further-classification edition="200601120260302B">G01S17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦瑞玥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, RUI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓佳璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JIA XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開製程腔室及半導體製程設備，製程腔室包括：腔室本體，包括環形側壁，及封蓋在環形側壁的頂面的封蓋件，環形側壁的內壁凸設有第一環形基座，第一環形基座設有從底面貫穿至頂面的第一測量通道；支撐組件設置於第一環形基座內；第一測量裝置設置於第一測量通道中；第一反射件，設置於封蓋件與第一環形基座之間，用於將第一目標區域的光線反射至第一測量裝置，其中第一目標區域至少包括晶圓的邊緣至支撐組件的邊緣的第一環形區域的一部分，第一環形區域以支撐組件的中心為圓心；本申請可即時監測晶圓是否發生偏移，降低成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a process chamber and semiconductor processing equipment. The process chamber comprises: a chamber body, including an annular sidewall, and a cover member sealing the top surface of the annular sidewall. A first annular base is protrudingly provided on the inner wall of the annular sidewall, wherein the first annular base is provided with a first measurement channel penetrating from the bottom surface to the top surface; a support component is disposed within the first annular base; a first measurement device is disposed within the first measurement channel; a first reflecting member is disposed between the cover member and the first annular base, for reflecting light from a first target region to the first measurement device, wherein the first target region at least includes a portion of a first annular region from the edge of the wafer to the edge of the support component, the first annular region being centered on the center of the support component. This application enables real-time monitoring of whether the wafer has shifted so as to reduce cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:腔室本體</p>
        <p type="p">11:環形側壁</p>
        <p type="p">12:封蓋件</p>
        <p type="p">13:第一環形基座</p>
        <p type="p">20:支撐組件</p>
        <p type="p">21:支撐柱</p>
        <p type="p">22:支撐環</p>
        <p type="p">30:第一測量裝置</p>
        <p type="p">40:第一反射件</p>
        <p type="p">100:晶圓</p>
        <p type="p">101:第一測量通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2215" publication-number="202632817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260421B">H01R13/6585</main-classification>
        <further-classification edition="200601120260421B">H01R13/514</further-classification>
        <further-classification edition="201101120260421B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太谷康奈特提威提日本合同公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TE CONNECTIVITY JAPAN G.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古平善彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAIRA, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩﨑正章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片野哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATANO, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻淳也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種在包含壓接式端子的電連接器中能夠防止訊號線因靜態負載而變形的電連接器。本發明提供的一種電連接器(1)包含複數個晶片(10A)，以及一殼體(40) ，其固定該等複數個晶片(10A)，且係連接至一電路板。該晶片(10A)包含一佈線板(11)，其包含複數條訊號線(12)和固定所述複數條訊號線(12)的一支架(13)，一對屏蔽板(15)帶有該佈線板(11)夾置於其間，且各包含壓接至該電路板中的複數個接地端子(152)，以及一對間隔件(17)帶有該對屏蔽板(15)夾置於其間。該等複數個間隔件(17)係各包含一間隔件負載接收部(171)，其自該殼體(40)接收一靜態負載(SL)，以及一間隔件負載傳遞部(172)，其將該靜態負載(SL)傳遞至該屏蔽板(15)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide, in an electrical connector including a press-fitting type terminal, an electrical connector capable of preventing a signal wiring from being deformed due to a sitting load. An electrical connector (1) includes a plurality of wafers (10A), and a housing (40) that retains the plurality of wafers (10A), and is connected to a circuit board. The wafer (10A) includes a wiring board (11) including a plurality of signal wirings (12) and a support (13) that retains the plurality of signal wirings (12), a pair of shield plates (15) with the wiring board (11) sandwiched therebetween and each including a plurality of ground terminals (152) press-fitted into the circuit board, and &lt;br/&gt;a pair of spacers (17) with the pair of shield plates (15) sandwiched therebetween. Each of the plurality of spacers (17) includes a spacer load reception part (171) that receives a sitting load (SL) from the housing (40), and a spacer load transmission part (172) that transmits the sitting load (SL) to the shield plate (15).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:晶片</p>
        <p type="p">11:佈線板</p>
        <p type="p">15:屏蔽板</p>
        <p type="p">152:接地端子</p>
        <p type="p">153:屏蔽負載接收部</p>
        <p type="p">17:間隔件</p>
        <p type="p">171:間隔件負載接收部</p>
        <p type="p">172:間隔件負載傳遞部</p>
        <p type="p">40:殼體</p>
        <p type="p">41:壓緊壁</p>
        <p type="p">45:壓緊突出部</p>
        <p type="p">46:擋槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2216" publication-number="202631083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生物特徵測量之感測系統</chinese-title>
        <english-title>SENSING SYSTEM FOR BIOMETRIC MEASUREMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61B5/0205</main-classification>
        <further-classification edition="200601120260504B">A61B5/0245</further-classification>
        <further-classification edition="200601120260504B">A61B5/11</further-classification>
        <further-classification edition="200601120260504B">A61B8/00</further-classification>
        <further-classification edition="201301120260504B">G06F21/32</further-classification>
        <further-classification edition="200601120260504B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商忒克塔系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACTA SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾傑　納西德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARJEE, NAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢伯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIBL, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱日嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一系統可包括待由一使用者穿戴之一穿戴式物品。例如，該穿戴式物品可包括指部具有指節之一手套，或穿戴於一手臂或腿上之一護套。一感測器陣列可耦接至該穿戴式物品。該感測器陣列可包括在至少一個面內尺寸上係次毫米級，且分布於該穿戴式物品之一感測區域之多個部位處之感測器。該系統亦可包括一處理器，該處理器經組態以：自該感測器陣列獲得一生物特徵測量，該生物特徵測量包括來自在該多個部位處之該等感測器之感測狀況之一空間圖；及基於比較該空間圖與對應於該多個部位之參考值之一基線圖而產生一輸出。亦描述並主張其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system may include a wearable article to be worn by a user. For example, the wearable article may include a glove with digits having digit sections, or a sleeve to be worn on an arm or leg. A sensor array may be coupled to the wearable article. The sensor array may include sensors that are submillimeter in at least one in-plane dimension and are distributed at multiple locations of a sensing area of the wearable article. The system may also include a processor configured to: obtain a biometric measurement from the sensor array, the biometric measurement including a spatial map of sensed conditions from the sensors at the multiple locations; and generate an output based on comparing the spatial map to a baseline map of reference values corresponding to the multiple locations. Other aspects are also described and claimed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測裝置</p>
        <p type="p">101:穿戴式物品</p>
        <p type="p">102A~102E:指部</p>
        <p type="p">106:手部部分</p>
        <p type="p">108:手腕部分</p>
        <p type="p">110:指節</p>
        <p type="p">110A,110B,110C:指節</p>
        <p type="p">112A,112B:指節</p>
        <p type="p">114:感測器陣列</p>
        <p type="p">114P:感測器陣列</p>
        <p type="p">115:感測器</p>
        <p type="p">134:電極</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2217" publication-number="202631234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>球擊出解析裝置及球擊出解析方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">A63B69/36</main-classification>
        <further-classification edition="200601120260416B">A63B24/00</further-classification>
        <further-classification edition="200601120260416B">G01P13/00</further-classification>
        <further-classification edition="200601120260416B">G01P3/68</further-classification>
        <further-classification edition="202201120260416B">G06V10/14</further-classification>
        <further-classification edition="202201120260416B">G06V20/00</further-classification>
        <further-classification edition="201501120260416B">A63B57/00</further-classification>
        <further-classification edition="201501320260416B">A63B102/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＧＰＲＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GPRO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川本秀昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　越曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, VIET MANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　宏權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUONG, HONG QUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的球擊出解析裝置及球擊出解析方法中，設置判斷控制部103係使用左右的攝影機，判斷球是否被設置於左檢測區域內預先設定的左觸發區域，或左檢測區域內預先設定的右觸發區域中的其中之一。出現判斷控制部104係使用對應於球被設置的設置觸發區域的攝影機的紅外線感測器，判斷是否有物體出現於包含該設置觸發區域的設置檢測區域。消失判斷控制部105係使用對應於該設置檢測區域的紅外線感測器，判斷球是否自該設置檢測區域中消失。次出現判斷控制部106係使用對應於與該設置檢測區域相鄰的擊出檢測區域的紅外線感測器，判斷球是否出現於該擊出檢測區域。訊號發送控制部107係發送觸發訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:球擊出解析裝置</p>
        <p type="p">B:球</p>
        <p type="p">C:球桿</p>
        <p type="p">D:顯示器</p>
        <p type="p">S:打席</p>
        <p type="p">Z:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2218" publication-number="202633043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">H05K3/46</main-classification>
        <further-classification edition="200601120260401B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王凱韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電路板結構及其製造方法。電路板結構包括基板、第一電路圖案、第二電路圖案、第一覆蓋層及介電層。第一電路圖案設置於基板上，其中第一電路圖案具有第一電路密度。第二電路圖案設置於基板上，其中第二電路圖案具有第二電路密度，且第二電路密度大於第一電路密度。第一覆蓋層設置於基板上並包覆第一電路圖案。介電層包括第一部分及第二部分。第一部分覆蓋並接觸第一覆蓋層的上表面。第二部分覆蓋第二電路圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a first circuit pattern, a second circuit pattern, a first cover layer, and a dielectric layer. The first circuit pattern is disposed on the substrate and has a first circuit density. The second circuit pattern is disposed on the substrate and has a second circuit density, wherein the second circuit density is greater than the first circuit density. The first cover layer is disposed on the substrate and covers the first circuit pattern. The dielectric layer includes a first portion and a second portion. The first portion covers and is in contact with an upper surface of the first cover layer, and the second portion is in contact with the second circuit pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板結構</p>
        <p type="p">100:基板</p>
        <p type="p">100A:上表面</p>
        <p type="p">100B:下表面</p>
        <p type="p">103:第一電路圖案</p>
        <p type="p">104:第二電路圖案</p>
        <p type="p">105:第三電路圖案</p>
        <p type="p">106:第四電路圖案</p>
        <p type="p">300:第一覆蓋層</p>
        <p type="p">300U:上表面</p>
        <p type="p">310:第一覆蓋層</p>
        <p type="p">400:介電層</p>
        <p type="p">400A:第一部分</p>
        <p type="p">400B:第二部分</p>
        <p type="p">400C:第三部分</p>
        <p type="p">400D:第四部分</p>
        <p type="p">410:介電層</p>
        <p type="p">500P:電路圖案</p>
        <p type="p">510P:電路圖案</p>
        <p type="p">t1:第一厚度</p>
        <p type="p">t2:第二厚度</p>
        <p type="p">t3:第三厚度</p>
        <p type="p">t4:第四厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2219" publication-number="202631957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻液組合物及蝕刻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">C09K13/06</main-classification>
        <further-classification edition="200601120260425B">C23F1/26</further-classification>
        <further-classification edition="200601120260425B">C23F1/44</further-classification>
        <further-classification edition="202601120260425B">H10P50/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中提供一種蝕刻液組合物，其能夠減少蝕刻不均。  &lt;br/&gt;本發明於一態樣中係關於一種蝕刻液組合物，其用以對含有至少1種金屬之被蝕刻層進行蝕刻，且上述蝕刻液組合物含有蝕刻抑制劑、至少包含硝酸之酸、及水，pH值為1以下；上述蝕刻抑制劑係選自聚伸烷基亞胺及含有來自二烯丙胺之結構單元之聚合物的至少1種含氮化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2220" publication-number="202632820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生及放大雷射脈衝的方法、用於產生發射二次輻射的電漿的方法、用於製造微晶片或半導體中間產品的方法以及光學裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H01S3/23</main-classification>
        <further-classification edition="200601120260504B">H01S3/17</further-classification>
        <further-classification edition="200601120260504B">H01S3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗斯　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRONS, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼斯　托斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANS, TORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多克梅爾　詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLKEMEYER, JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布尼奇　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUDNICKI, ALEKSANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉舒　維倫廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORASCH, VALENTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種藉由光學放大器(32)產生並放大雷射脈衝(12，14)的方法，其中該光學放大器(32)具有用於放大該等雷射脈衝(12，14)的雷射活性固體(34)。該方法包括：產生第一類型的雷射脈衝(12)；產生第二類型的雷射脈衝(14)；在該雷射活性固體(34)中產生居量反轉；以及藉由該光學放大器(32)放大該第一類型的雷射脈衝(12)及該第二類型的雷射脈衝(14)，其方式為該第一類型的雷射脈衝(12)及該第二類型的雷射脈衝(14)在該雷射活性固體(34)具有該居量反轉期間穿過該雷射活性固體(34)。該第一類型的雷射脈衝(12)及該第二類型的雷射脈衝(14)在其波長上彼此不同。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:光學裝置</p>
        <p type="p">12:第一類型的雷射脈衝</p>
        <p type="p">14:第二類型的雷射脈衝</p>
        <p type="p">16:第一雷射光束源</p>
        <p type="p">18:第二雷射光束源</p>
        <p type="p">20:第一傳播方向</p>
        <p type="p">22:第二傳播方向</p>
        <p type="p">24:鏡</p>
        <p type="p">26:傳播方向</p>
        <p type="p">28:前置放大器</p>
        <p type="p">30:光譜濾波器</p>
        <p type="p">32:光學放大器</p>
        <p type="p">34:雷射活性固體</p>
        <p type="p">36:泵浦輻射源</p>
        <p type="p">38:第一珀爾帖元件</p>
        <p type="p">40:第二珀爾帖元件</p>
        <p type="p">42:控制裝置</p>
        <p type="p">44:犧牲脈衝</p>
        <p type="p">46:調變器</p>
        <p type="p">48:輸出端</p>
        <p type="p">50:時間間隔</p>
        <p type="p">52:觸發訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2221" publication-number="202632236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100641</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度感測裝置、溫度感測裝置的溫度感測方法與系統單晶片</chinese-title>
        <english-title>TEMPERATURE SENSING DEVICE, TEMPERATURE SENSING METHOD OF TEMPERATURE SENSING DEVICE AND SYSTEM ON CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260402B">G01K7/16</main-classification>
        <further-classification edition="200601120260402B">H03M1/66</further-classification>
        <further-classification edition="202601120260402B">H10D80/20</further-classification>
        <further-classification edition="200601120260402B">G06F1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹叡臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, YELIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">溫度感測裝置包括：第一感測電路，具有選擇性地連接到第一電阻器的第一電容器電路；第二感測電路，具有選擇性地連接到第二電阻器的第二電容器電路；比較器電路，經配置以基於第一節點的第一電壓和第二節點的第二電壓的比較輸出比較信號；以及逐次逼近暫存器（successive approximation register，SAR）邏輯電路，經配置以以逐次逼近暫存器方式輸出基於比較信號的比較獲得的數位資料。第一感測電路經配置以基於第一控制信號以電源電壓對多個第一電容器中的至少一個充電，並且基於第二控制信號通過第一電阻器和第一節點放電至接地電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temperature sensing device includes: a first sensing circuit with a first capacitor circuit selectively connected to a first resistor; a second sensing circuit with a second capacitor circuit selectively connected to a second resistor; a comparator circuit configured to output a comparison signal based on a comparison of a first voltage of a first node and a second voltage of a second node; and a successive approximation register (SAR) logic circuit configured to output digital data obtained based on a comparison of the comparison signal in a successive approximation register manner. The first sensing circuit is configured to charge at least one of a plurality of first capacitors with a power supply voltage based on a first control signal, and discharged to a ground voltage through the first resistor and the first node based on a second control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:溫度感測裝置</p>
        <p type="p">300:比較器</p>
        <p type="p">400:SAR邏輯電路</p>
        <p type="p">100:第一感測電路</p>
        <p type="p">200:第二感測電路</p>
        <p type="p">CK:時鐘信號</p>
        <p type="p">CS_C:第三控制信號</p>
        <p type="p">DM、DP、CMPS:比較信號</p>
        <p type="p">TCODE:溫度碼資料</p>
        <p type="p">VIM:第二電壓</p>
        <p type="p">VIP:第一電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2222" publication-number="202633389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、用於監測傳播長度之方法及用於製造半導體裝置之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD FOR MONITORING PROPAGATION LENGTH, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10P74/00</main-classification>
        <further-classification edition="202601120260417B">H10P30/22</further-classification>
        <further-classification edition="200601120260417B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彦哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可估計一傳播長度之技術。一評估元件包含形成於一半導體基板中之一擴散層及電連接至該擴散層之複數對接觸件。該複數對接觸件在X方向上分開一距離。第三接觸件在該X方向上之一寬度小於第二接觸件在該X方向上之一寬度。該等第二接觸件之該寬度小於第一接觸件在該X方向上之一寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provide a technology that can estimate a propagation length. An evaluation element includes a diffusion layer formed in a semiconductor substrate and a plurality of a pair of contacts electrically connected to the diffusion layer. The plurality of the pair of contacts are separated by a distance in the X direction. A width of the third contacts in the X direction is smaller than a width of a second contacts in the X direction. The width of the second contacts is smaller than a width of the first contacts in the X direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1Q:評估元件</p>
        <p type="p">CT1:接觸件</p>
        <p type="p">CT2:接觸件</p>
        <p type="p">CT3:接觸件</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">D3:距離</p>
        <p type="p">DL:擴散層</p>
        <p type="p">L1:寬度</p>
        <p type="p">L2:寬度</p>
        <p type="p">L3:寬度</p>
        <p type="p">TEG1:評估圖案</p>
        <p type="p">TEG2:評估圖案</p>
        <p type="p">TEG3:評估圖案</p>
        <p type="p">W:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2223" publication-number="202633098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100678</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260429B">H10D8/25</main-classification>
        <further-classification edition="202501120260429B">H10D30/60</further-classification>
        <further-classification edition="202501120260429B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種包含一齊納二極體之半導體裝置，其包含一n型半導體基板、一p型井區、一n型擴散區及一p型雜質區。該p型雜質區之一雜質濃度高於該p型井區之一雜質濃度。在平面圖中，該p型雜質區包圍該n型擴散區之至少一部分。在平面圖中，該p型井區形成四邊形形狀。在平面圖中，該p型井區之各角自該p型雜質區暴露。該齊納二極體之一陰極包含該n型擴散區。該齊納二極體之一陽極包含該p型井區及該p型雜質區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a Zener diode, includes: an n-type semiconductor substrate; a p-type well region; an n-type diffusion region; and a p-type impurity region. An impurity concentration of the p-type impurity region is higher than an impurity concentration of the p-type well region. The p-type impurity region surrounds at least a part of the n-type diffusion region in plan view. The p-type well region forms a quadrangular shape in plan view. Each corner of the p-type well region is exposed from the p-type impurity region in plan view. A cathode of the Zener diode includes the n-type diffusion region. An anode of the Zener diode includes the p-type well region and the p-type impurity region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:角</p>
        <p type="p">HPW:井區</p>
        <p type="p">NM:擴散區</p>
        <p type="p">PM:擴散區</p>
        <p type="p">PW:井區</p>
        <p type="p">PZ:雜質區</p>
        <p type="p">PZ1:第一部分</p>
        <p type="p">PZ2:第二部分</p>
        <p type="p">PZ3:第三部分</p>
        <p type="p">PZ4:第四部分</p>
        <p type="p">ZD:齊納二極體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2224" publication-number="202631530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學玻璃及光學元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C03C3/068</main-classification>
        <further-classification edition="200601120260421B">C03C3/078</further-classification>
        <further-classification edition="200601120260421B">C03C3/087</further-classification>
        <further-classification edition="200601120260421B">C03C3/095</further-classification>
        <further-classification edition="200601120260421B">C03C3/097</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商豪雅光電科技（威海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA OPTICAL TECHNOLOGY (WEIHAI) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新龙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保阳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BAOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸智明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在降低成本的同時獲得穩定玻璃、且維持玻璃的熔解性之達到目標參數的光學玻璃。提供一種光學玻璃，在前述光學玻璃的玻璃組成中，SiO&lt;sub&gt;2&lt;/sub&gt;含量為10~50%，ZrO&lt;sub&gt;2&lt;/sub&gt;含量為3~30%，Nb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;含量為0~7.5%，TiO&lt;sub&gt;2&lt;/sub&gt;含量為5~50%，CaO含量為大於0%且50%以下，B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含量為大於0%且為50%以下，La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含量為0~25%，Li&lt;sub&gt;2&lt;/sub&gt;O含量為0~6%，Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;含量為0~30%， (ZrO&lt;sub&gt;2&lt;/sub&gt;+TiO&lt;sub&gt;2&lt;/sub&gt;)/(SiO&lt;sub&gt;2&lt;/sub&gt;+B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)=0.40~1.12，(Li&lt;sub&gt;2&lt;/sub&gt;O+Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O)/CaO=0~0.38，(La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;+Gd&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;+Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)/(ZrO&lt;sub&gt;2&lt;/sub&gt;+TiO&lt;sub&gt;2&lt;/sub&gt;)=0~0.97，SiO&lt;sub&gt;2&lt;/sub&gt;/(SiO&lt;sub&gt;2&lt;/sub&gt;+B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)為0.41~1.00。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2225" publication-number="202632357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G02B6/42</main-classification>
        <further-classification edition="200601120260425B">G02B6/12</further-classification>
        <further-classification edition="202501120260425B">H10F55/255</further-classification>
        <further-classification edition="202601120260425B">H10W90/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方略電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANELSEMI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李晉棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種半導體裝置包括基板結構、第一半導體晶片、光電轉換元件陣列、光電轉換驅動電路、波導陣列及光傳輸路徑。第一半導體晶片佈設於並且電連接至基板結構，且半導體晶片具有至少一功能電路。光電轉換元件陣列連接至基板結構，光電轉換驅動電路電連接光電轉換元件陣列與第一半導體晶片的功能電路，光電轉換驅動電路與第一半導體晶片的功能電路進行電訊號收發。波導陣列定義光耦合區，光耦合區具有多個波導埠。光傳輸路徑定義於波導陣列與光電轉換元件陣列之間，波導陣列經由光傳輸路徑對應並光耦合光電轉換元件陣列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate structure, a first semiconductor chip, an optoelectronic conversion element array, an optoelectronic driving circuit, a waveguide array, and an optical transmission path. The first semiconductor chip is arranged at and electrically connected to the substrate structure, and has a functional circuit. The optoelectronic conversion element array is connected to the substrate structure, and the optoelectronic driving circuit is electrically connected to the optoelectronic conversion element array and the functional circuit of the first semiconductor chip. The optoelectronic driving circuit performs electrical signal transmission and reception with the functional circuit of the first semiconductor chip. The waveguide array defines an optical coupling region, which includes multiple waveguide ports. The optical transmission path is defined between the waveguide array and the optoelectronic conversion element array, and the waveguide array corresponds to and optically couples to the optoelectronic conversion element array by the optical transmission path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">10:基板結構</p>
        <p type="p">11:線路基板</p>
        <p type="p">111~112:線路層</p>
        <p type="p">12:波導基板</p>
        <p type="p">13:導電孔</p>
        <p type="p">14:填充材</p>
        <p type="p">20:光電轉換元件陣列</p>
        <p type="p">21:發光元件陣列</p>
        <p type="p">22:感光元件陣列</p>
        <p type="p">30:光電轉換驅動電路</p>
        <p type="p">40:波導陣列</p>
        <p type="p">43:光傳輸區域</p>
        <p type="p">50:第一半導體晶片</p>
        <p type="p">51:功能電路</p>
        <p type="p">60:光傳輸路徑</p>
        <p type="p">S1~S6:表面</p>
        <p type="p">W:窗口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2226" publication-number="202633044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260328B">H05K3/46</main-classification>
        <further-classification edition="200601120260328B">H05K1/02</further-classification>
        <further-classification edition="200601120260328B">H05K3/28</further-classification>
        <further-classification edition="200601120260328B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王凱韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電路板結構及其製造方法。電路板結構包括基板、電路圖案、緩衝結構及介電層。電路圖案設置於基板上。緩衝結構設置於基板上，並與電路圖案電性絕緣。介電層包括第一部分及第二部分。第一部分覆蓋並接觸電路圖案的上表面。第二部分覆蓋並接觸緩衝結構的上表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a circuit pattern, a buffer structure, and a dielectric layer. The circuit pattern is disposed on the substrate. The buffer structure is disposed on the substrate and is electrically insulated from the circuit pattern. The dielectric layer includes a first portion and a second portion. The first portion covers and is in contact with an upper surface of the circuit pattern. The second portion covers and is in contact with an upper surface of the buffer structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板結構</p>
        <p type="p">100:基板</p>
        <p type="p">101P:電路圖案</p>
        <p type="p">102P:電路圖案</p>
        <p type="p">103:第一電路圖案</p>
        <p type="p">103U:上表面</p>
        <p type="p">104:第二電路圖案</p>
        <p type="p">105:第三電路圖案</p>
        <p type="p">106:第四電路圖案</p>
        <p type="p">220:緩衝結構</p>
        <p type="p">220U:上表面</p>
        <p type="p">230:緩衝結構</p>
        <p type="p">300:介電層</p>
        <p type="p">300A:第一部分</p>
        <p type="p">300B:第二部分</p>
        <p type="p">310:介電層</p>
        <p type="p">310A:第四部分</p>
        <p type="p">310B:第五部分</p>
        <p type="p">400P:電路圖案</p>
        <p type="p">410P:電路圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2227" publication-number="202632193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>送風裝置用附件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260326B">F24F13/02</main-classification>
        <further-classification edition="200601120260326B">F24F3/14</further-classification>
        <further-classification edition="201901120260326B">F24F1/0358</further-classification>
        <further-classification edition="200601120260326B">A47L23/20</further-classification>
        <further-classification edition="200601120260326B">D06F58/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商夏普股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARP KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦田龍彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URATA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂成龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, CHENG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠防止裝置主體的製造工時的增加，並且不會損害裝置主體的外觀設計性的送風裝置用附件。送風裝置用附件（4）為可拆卸地安裝於從吹出口（14）吹出氣流的送風裝置（除濕裝置（1））的裝置主體（10）上，用於將氣流引導至與吹出口（14）不同且位於與裝置主體（10）不同的位置的外置吹出口的送風裝置用附件。送風裝置用附件（4）包括：安裝部（41），其安裝於裝置主體（10）的與吹出口（14）對應的位置；以及集風部（42），其在安裝部（41）安裝於吹出口的狀態下，將從吹出口吹出的氣流匯集並使其流向外置吹出口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕裝置(送風裝置)</p>
        <p type="p">10:裝置主體</p>
        <p type="p">11:殼體</p>
        <p type="p">112:頂面面板</p>
        <p type="p">114:後面面板</p>
        <p type="p">115:左側面面板</p>
        <p type="p">12:操作部</p>
        <p type="p">14:吹出口</p>
        <p type="p">14a:間隙</p>
        <p type="p">18:腳輪</p>
        <p type="p">19:框體</p>
        <p type="p">3:導風板</p>
        <p type="p">30:導風板體</p>
        <p type="p">30a:第一導風板體</p>
        <p type="p">30b:第二導風板體</p>
        <p type="p">4:送風裝置用附件</p>
        <p type="p">41:安裝部</p>
        <p type="p">42:集風部</p>
        <p type="p">5:軟管</p>
        <p type="p">6:噴嘴</p>
        <p type="p">61:第一噴嘴</p>
        <p type="p">62:第二噴嘴</p>
        <p type="p">D1:上下方向</p>
        <p type="p">D2:左右方向</p>
        <p type="p">D3:前後方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2228" publication-number="202633334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體熱處理設備</chinese-title>
        <english-title>SEMICONDUCTOR HEAT TREATMENT EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">F27B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, ZHI QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫學偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, XUE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種半導體熱處理設備，包括製程內管、製程外管、安裝座、進氣結構和排氣結構；製程內管的第一端和製程內管的第二端均為開口結構，製程內管限定的區域形成有反應空間；製程外管的第一端為開口結構，製程外管的第二端為封閉結構，製程外管套設於製程內管之外，且製程內管與製程外管之間形成環形進氣腔；安裝座為環形結構，製程內管的第一端和製程外管的第一端均與安裝座密封連接，製程內管的第二端與製程外管的第二端的內壁之間具有間隙，進氣結構通過進氣口與環形進氣腔連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a semiconductor heat treatment equipment, including an inner process tube, an outer process tube, a mounting base, an air inlet structure, and an exhaust structure. Both the first end and the second end of the inner process tube are configured as open structures. Space within the area defined by the inner process tube forms a reaction space. The first end of the outer process tube is configured as an open structure, and the second end of the outer process tube is configured as a close structure. The outer process tube is sleeved outside the inner process tube, and an annular air inlet cavity is formed between the inner process tube and the outer process tube. The mounting base is annular, with both the first end of the inner process tube and the first end of the outer process tube sealed to it. A gap exists between the second end of the inner process tube and the inner wall of the second end of the outer process tube. The air inlet structure communicates with the annular air inlet cavity through an air inlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程內管</p>
        <p type="p">101:反應空間</p>
        <p type="p">102:環形進氣腔</p>
        <p type="p">200:製程外管</p>
        <p type="p">300:安裝座</p>
        <p type="p">310:第一座體</p>
        <p type="p">320:第二座體</p>
        <p type="p">330:第三座體</p>
        <p type="p">401:第二冷卻通道</p>
        <p type="p">410:下爐體</p>
        <p type="p">411:排氣通道</p>
        <p type="p">420:爐蓋</p>
        <p type="p">430:托柱</p>
        <p type="p">440:托盤</p>
        <p type="p">450:隔熱件</p>
        <p type="p">610:保溫件</p>
        <p type="p">611:環形保溫子件</p>
        <p type="p">612:頂部保溫子件</p>
        <p type="p">620:加熱件</p>
        <p type="p">630:上爐體</p>
        <p type="p">700:冷卻件</p>
        <p type="p">A:承載舟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2229" publication-number="202631344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>框架結構及工業用機器人</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B25J5/02</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科儀器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種框架結構（5），將機器人主體以能夠移動的方式予以保持，包括：導軌（6～8），用於沿Y方向引導機器人主體；軌道固定板（25），供導軌（6）固定；框架（9），供軌道固定板（25）及導軌（7、8）固定；調整構件，用於在X方向上調整軌道固定板（25）相對於框架（9）的位置；以及固定構件，用於將軌道固定板（25）固定在框架（9）。軌道固定板（25）固定在Z方向上的框架（9）的一端部，導軌（7、8）固定在Z方向上的框架（9）的另一端部。調整構件及固定構件以在Y方向上隔開間隔的狀態配置有多個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:框架結構</p>
        <p type="p">6:導軌(第一導軌)</p>
        <p type="p">7、8:導軌(第二導軌)</p>
        <p type="p">9:框架</p>
        <p type="p">10:驅動機構</p>
        <p type="p">12、13:滑塊(引導塊)</p>
        <p type="p">23:滑塊</p>
        <p type="p">25:軌道固定板</p>
        <p type="p">26:右框架構件(第一框架構件)</p>
        <p type="p">26b、27b:上框部</p>
        <p type="p">26c、27c:下框部</p>
        <p type="p">26d、27d:右框部</p>
        <p type="p">26e、27e:左框部</p>
        <p type="p">27:左框架構件(第二框架構件)</p>
        <p type="p">28:右板構件(第一板構件)</p>
        <p type="p">29:左板構件(第二板構件)</p>
        <p type="p">30:連結構件</p>
        <p type="p">42:第一定位機構</p>
        <p type="p">43:第二定位機構</p>
        <p type="p">E、F、G、H:部</p>
        <p type="p">X:第二方向(方向)</p>
        <p type="p">X1、Y1、Y2、Z1、Z2:方向</p>
        <p type="p">Y:第一方向(方向)</p>
        <p type="p">Z:第三方向(方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2230" publication-number="202632932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>區段管理系統、區段管理裝置、區段管理終端、區段管理記憶媒體及區段管理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260302B">H04L41/0803</main-classification>
        <further-classification edition="200601120260302B">G05B19/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林英松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, HIDEMATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村敏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">區段管理系統（1）係具備區段設定部（31、41），係根據控制設備（5）與屬於被控制設備的OT機器（6-1至6-5）之連接關係，來設定成為以屬於被控制設備的OT機器（6-1至6-5）所連接之網路為對象而實施安全管理之單位的區段，其中連接關係根據生產管理系統中的控制指示，生產管理系統包含：控制設備（5）及藉由來自控制設備（5）之控制指示而被控制之屬於被控制設備的OT機器（6-1至6-5）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:區段管理系統統括伺服器</p>
        <p type="p">3:區段管理裝置</p>
        <p type="p">4:區段管理終端4</p>
        <p type="p">5:控制設備</p>
        <p type="p">6:OT機器</p>
        <p type="p">30,40:區段分析部</p>
        <p type="p">31,41:區段設定部</p>
        <p type="p">33,43:區域設定部</p>
        <p type="p">42:區段資訊儲存部</p>
        <p type="p">44:區域資訊儲存部</p>
        <p type="p">46:管理實施部</p>
        <p type="p">47:顯示部</p>
        <p type="p">48,58:通訊部</p>
        <p type="p">52:控制設備I/O設定資訊儲存部</p>
        <p type="p">54:控制程式儲存部</p>
        <p type="p">56:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2231" publication-number="202632290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查插座</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G01R1/04</main-classification>
        <further-classification edition="200601120260311B">G01R1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商歐姆龍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井貴浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹野直哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASANO, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種接觸可靠性高的檢查插座。檢查插座包括：殼體、以及支撐於殼體的多個銷。各銷具有：設置於第一方向的一端部的第一端部、以及設置於第一方向的另一端部的第二端部。多個銷具有：第一銷～第六銷。第一銷與第二銷以及第三銷與第四銷，分別在第二方向上空開間隔地配置。第五銷在第二方向上位於第一銷與第二銷之間，第六銷在第二方向上位於第三銷與第四銷之間。在第三方向上，第一銷與第三銷、第二銷與第四銷、以及第五銷與第六銷分別排列配置。第一銷及第三銷的第二端部在第二方向上位於不同的位置，第二銷及第四銷的第二端部在第二方向上位於不同的位置，第五銷及第六銷的第二端部在第二方向上位於不同的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:探針</p>
        <p type="p">11:第一連接部</p>
        <p type="p">11A:端部</p>
        <p type="p">12:第二連接部</p>
        <p type="p">12A:端部</p>
        <p type="p">12B:邊緣部</p>
        <p type="p">12C、121C:切口</p>
        <p type="p">13、14:彈性部</p>
        <p type="p">13A、111:第一端部</p>
        <p type="p">13B、121、122:第二端部</p>
        <p type="p">71:探針/第一銷/第一探針</p>
        <p type="p">72:探針/第二銷/第二探針</p>
        <p type="p">73:探針/第三銷/第三探針</p>
        <p type="p">74:探針/第四銷/第四探針</p>
        <p type="p">77:探針/第一中間探針</p>
        <p type="p">78:探針/中間探針/第二中間探針</p>
        <p type="p">111A:傾斜面/第一傾斜面</p>
        <p type="p">111B:突起</p>
        <p type="p">113:凹部</p>
        <p type="p">131:第一部分</p>
        <p type="p">132:第二部分</p>
        <p type="p">133:彎曲部</p>
        <p type="p">134、134A、134B、134C、144、144A、144B:長板部</p>
        <p type="p">141:第一部分/第一延伸部</p>
        <p type="p">143:彎曲部/第二延伸部</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">X、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2232" publication-number="202632601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輪廓提取系統、及輪廓提取方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260202B">G06T7/00</main-classification>
        <further-classification edition="201701120260202B">G06T7/13</further-classification>
        <further-classification edition="201701120260202B">G06T7/194</further-classification>
        <further-classification edition="202301120260202B">H04N23/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雨宮茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMEMIYA, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可更準確地檢測對象物的輪廓的輪廓提取系統。自對象物100的攝像圖像中提取所述對象物100的輪廓的輪廓提取系統10的特徵在於包括：攝像裝置14，對所述對象物100進行攝像；照射單元16，對所述對象物100進行照射、且能夠將照射光切換為具有第一顏色的第一光、或與所述第一光不同的第二顏色的第二光；以及控制器20，根據所述攝像圖像算出對象物100的輪廓，所述控制器20構成為基於在所述第一光下進行攝像而獲得的第一圖像30R的亮度值Lr、與在所述第二光下進行攝像而獲得的第二圖像30B的亮度值Lb的比較結果，提取圖像內的對象物100的輪廓。本發明也提供一種輪廓提取方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C:類似度</p>
        <p type="p">Lb1、Lb2、Lb3、Lb4、Lr1:亮度值</p>
        <p type="p">M1、M2、M3:點</p>
        <p type="p">RBref:參照值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2233" publication-number="202632242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定雷射光束之光束焦散的光學裝置、使用光學裝置確定雷射光束之光束焦散的方法、ＥＵＶ驅動雷射器、ＥＵＶ光產生設備以及製造半導體中間產品或微晶片的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">G01M11/02</main-classification>
        <further-classification edition="200601120260425B">G02B26/00</further-classification>
        <further-classification edition="201701120260425B">G06T7/571</further-classification>
        <further-classification edition="200601120260425B">H05G2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雄哈爾斯　亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOENHALS, ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克勞特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAUTER, JOHANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷德柏根　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEDERBOGEN, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於確定雷射光束(12)之光束焦散的光學裝置(10)，該光學裝置具有耦合裝置(14)，該耦合裝置被設置為將自待測量的雷射光束(12)分離的測量光束耦合到測量光束路徑中。具有成像平面(20)的檢測裝置(18)被設置為在該成像平面(20)中擷取該測量光束(22)的多個影像。藉由評估裝置(24)，可根據該測量光束(22)的多個影像確定該測量光束的光束焦散。設有偏轉裝置(26)，其具有偏轉面(28)且被如此定位，以藉由該偏轉面(28)將來自該耦合裝置(14)方向的該測量光束偏轉朝向該檢測裝置(18)的該成像平面(20)的方向。根據本發明，該檢測裝置(18)在位置上不可移動地固定，且該檢測裝置(18)的該成像平面(20)是固定的。該偏轉面(28)設計為可至少局部可逆地變形，使得該偏轉裝置(26)的焦距可藉由該偏轉面(28)的至少局部的變形進行調節，從而可在不同焦距下在該檢測裝置(18)的該成像平面(20)中產生該測量光束的多個影像。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">8:EUV驅動雷射器</p>
        <p type="p">10:光學裝置</p>
        <p type="p">12:雷射光束</p>
        <p type="p">14:耦合裝置</p>
        <p type="p">16:測量光束</p>
        <p type="p">18:檢測裝置</p>
        <p type="p">20:成像平面</p>
        <p type="p">22:測量光束</p>
        <p type="p">24:評估裝置</p>
        <p type="p">26:偏轉裝置</p>
        <p type="p">28:偏轉面</p>
        <p type="p">30:壓電調節元件</p>
        <p type="p">32:聚焦元件</p>
        <p type="p">34:測量光束</p>
        <p type="p">36:虛擬成像平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2234" publication-number="202633442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷凝器板片</chinese-title>
        <english-title>CONDENSER PLATE TILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10W40/20</main-classification>
        <further-classification edition="202601120260424B">H10W40/73</further-classification>
        <further-classification edition="202601120260424B">H10W40/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特伊夫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATEEVA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路易斯　格雷葛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEWIS, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述了熱處理板片及板。本文中所描述之該等熱處理板片包括：一控制表面；一作用表面，其與該控制表面相對；複數個封閉通道，其形成於該控制表面內，各通道具有與該控制表面相連的壁，且各通道具有用於使一熱控制流體在該通道內流動並與該通道之該等壁直接接觸的一入口端及一出口端；及沿著該熱處理板片之邊緣的互補邊緣接頭。本文中所描述之該等熱處理板係使用該等熱處理板片藉由將複數個該等熱處理板片在其該等邊緣接頭處附接來組裝的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Thermal treatment tiles and plates are described herein. The thermal treatment tiles described herein include a control surface; an active surface opposite the control surface; a plurality of enclosed channels formed within the control surface, each channel having walls contiguous with the control surface, and each channel having an inlet terminus and an outlet terminus for flowing a thermal control fluid within the channel in direct contact with the walls of the channel; and complimentary edge joints along the edges of the thermal treatment tile. The thermal treatment plates described herein are assembled using the thermal treatment tiles by attaching a plurality of the thermal treatment tiles at the edge joints thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:板片</p>
        <p type="p">101:控制側，控制表面</p>
        <p type="p">102:通道</p>
        <p type="p">106:端部</p>
        <p type="p">110:通道入口，入口</p>
        <p type="p">111:邊緣</p>
        <p type="p">112:通道出口，出口</p>
        <p type="p">114:搭接接頭，第一搭接接頭</p>
        <p type="p">116:延伸部</p>
        <p type="p">117:孔</p>
        <p type="p">120:第一位置</p>
        <p type="p">122:第二位置</p>
        <p type="p">124:第一拐角</p>
        <p type="p">126:第二拐角，第二搭接接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2235" publication-number="202631486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成三五族層的方法</chinese-title>
        <english-title>METHOD OF FORMING III-V GROUP LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">C01B21/06</main-classification>
        <further-classification edition="200601120260420B">C23C16/34</further-classification>
        <further-classification edition="200601120260420B">C23C16/455</further-classification>
        <further-classification edition="202601120260420B">H10P14/24</further-classification>
        <further-classification edition="202601120260420B">H10P14/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安民宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, MIN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金娜瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JUN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳亨錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, HYUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元京勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WON, GYEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉眞赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JIN-HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉光洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, KWANG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳鐘元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JONG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐峻源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JUN WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙才嬉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, JAE HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓丞鎔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴光洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KWANG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種於腔體中的基板上形成三五族層的方法，包含藉由一原子層沉積(ALD)於基板上形成一第一層的一步驟；及於第一層上形成三五族的一第二層的一步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of forming III-V Group layer on a substrate in a chamber comprising a step of forming a first layer on the substrate by atomic layer deposition (ALD); and a step of forming a III-V Group second layer on the first layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S110,S120,S200,S210,S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2236" publication-number="202632228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流量檢測方法、流體泵及槽式半導體清洗設備</chinese-title>
        <english-title>FLOW DETECTION METHOD, FLUID PUMP, AND A TANK-TYPE SEMICONDUCTOR CLEANING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01F3/20</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">F04B9/131</further-classification>
        <further-classification edition="200601120260302B">F04B51/00</further-classification>
        <further-classification edition="200601120260302B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫雙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種流量檢測方法、流體泵及槽式半導體清洗設備，其中，流量檢測方法應用於流體泵，流體泵包括泵殼以及設於泵殼內的兩個可變容積腔室和閥門裝置；泵殼具有出口和進口；兩個可變容積腔室通過閥門裝置均與出口和進口連通；兩個可變容積腔室交替變換容積，其中一者容積變大以使得流體通過進口進入的同時，另一者容積變小以通過出口排出其容納的流體；流量檢測方法包括：檢測兩個可變容積腔室經歷一次容積變化的時長；根據可變容積腔室充滿流體時的容積以及經歷一次容積變化的時長計算流體的流量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a flow detection method, a fluid pump, and a tank-type semiconductor cleaning apparatus, wherein the flow detection method is applied to the fluid pump. The fluid pump comprises a pump housing and two variable-volume chambers and a valve device disposed within the pump housing. The pump housing is provided with an outlet and an inlet. The two variable-volume chambers are each in communication with both the outlet and the inlet via the valve device. The two variable-volume chambers alternately change their volumes, wherein the volume of one chamber increases to allow fluid to enter through the inlet while the volume of the other chamber decreases to discharge the fluid contained therein through the outlet. The flow detection method comprises: detecting the duration during which each of the two variable-volume chambers undergoes a volume change; and calculating the flow rate of the fluid based on the volume of the variable-volume chamber when filled with fluid and the duration of one volume change.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流體泵</p>
        <p type="p">110:泵殼</p>
        <p type="p">111:出口</p>
        <p type="p">112:進口</p>
        <p type="p">113:第一內腔</p>
        <p type="p">114:第二內腔</p>
        <p type="p">115:第一氣路介面</p>
        <p type="p">116:第二氣路介面</p>
        <p type="p">120:可變容積腔室</p>
        <p type="p">130:閥門裝置</p>
        <p type="p">131:第一單向閥</p>
        <p type="p">132:第二單向閥</p>
        <p type="p">133:第三單向閥</p>
        <p type="p">134:第四單向閥</p>
        <p type="p">140:到位感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2237" publication-number="202632810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260305B">H01R13/646</main-classification>
        <further-classification edition="200601120260305B">H01R13/648</further-classification>
        <further-classification edition="201101120260305B">H01R13/6581</further-classification>
        <further-classification edition="201101120260305B">H01R13/6593</further-classification>
        <further-classification edition="201101120260305B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　珍琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, JHEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU,MING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器，包含一端子模組、一接地導體，以及一屏蔽組件。該端子模組包括一絕緣端子座，以及設於該絕緣端子座的多個訊號端子對。該接地導體設於該端子模組的該絕緣端子座的前部，該接地導體具有前後貫穿地形成且分別對應該多個訊號端子對的多個通道。該屏蔽組件設於該接地導體，該屏蔽組件包括對應該多個訊號端子對的多個屏蔽結構，每一該屏蔽結構包括設於該接地導體前部的一基板及兩個側板，以及由該基板與該兩個側板共同界定的一對接槽，該對接槽位於對應的該通道前方且連通該通道，每一該訊號端子對朝前不接觸該接地導體地穿過對應的該通道，以伸入該對接槽，每一該側板具有朝該對接槽凸出的一接地彈片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">2:端子模組</p>
        <p type="p">22:訊號端子對</p>
        <p type="p">23:訊號端子</p>
        <p type="p">232:對接段</p>
        <p type="p">232a:穿伸部</p>
        <p type="p">232b:接觸部</p>
        <p type="p">232c:加寬部</p>
        <p type="p">3:接地導體</p>
        <p type="p">31:通道</p>
        <p type="p">4:屏蔽組件</p>
        <p type="p">41:屏蔽結構排</p>
        <p type="p">410:屏蔽結構</p>
        <p type="p">411:接地屏蔽板</p>
        <p type="p">411a:屏蔽板體</p>
        <p type="p">411b:側板體</p>
        <p type="p">411c:接觸板體</p>
        <p type="p">411d:接地彈片</p>
        <p type="p">411e:接觸彈片</p>
        <p type="p">412:隔板構件</p>
        <p type="p">412a:隔板</p>
        <p type="p">412b:第一板部</p>
        <p type="p">412c:第二板部</p>
        <p type="p">412d:開口</p>
        <p type="p">412e:接地彈片</p>
        <p type="p">413:對接槽</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2238" publication-number="202632040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法、基板處理系統及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C23C16/02</main-classification>
        <further-classification edition="200601120260422B">C23C16/04</further-classification>
        <further-classification edition="200601120260422B">C23C16/30</further-classification>
        <further-classification edition="200601120260422B">H01J37/32</further-classification>
        <further-classification edition="202601120260422B">H10P14/60</further-classification>
        <further-classification edition="202601120260422B">H10P14/61</further-classification>
        <further-classification edition="202601120260422B">H10P14/692</further-classification>
        <further-classification edition="202601120260422B">H10P50/28</further-classification>
        <further-classification edition="202601120260422B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出貝求</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEGAI, MOTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中谷公彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATANI, KIMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山角宥貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKADO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村正次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供在所需的表面上以高精度選擇性地形成膜之技術。本發明包括：(a)(a1)將氧化劑和還原劑激發成電漿狀態並向具有第1表面和第2表面的基板供給的步驟、(a2)將還原劑激發成電漿狀態並向上述基板供給的步驟；以及(b)對進行(a)之後的上述基板進行熱處理的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:步驟A</p>
        <p type="p">A1:步驟A1</p>
        <p type="p">A2:步驟A2</p>
        <p type="p">B:步驟B</p>
        <p type="p">C:步驟C</p>
        <p type="p">D:步驟D</p>
        <p type="p">E:步驟E</p>
        <p type="p">F:步驟F</p>
        <p type="p">P:迫淨</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2239" publication-number="202632702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彈性圓突</chinese-title>
        <english-title>ELASTIC DOME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">H01H13/14</main-classification>
        <further-classification edition="200601120260311B">H01H13/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彈性圓突，用於一按鍵結構中並包含一底環部、一頂環部、一外斜環壁、一觸發柱及一內斜環壁。該頂環部於一垂直方向上位於該底環部上方。該外斜環壁於該頂環部與該底環部之間斜向連接該頂環部及該底環部。該觸發柱位於該外斜環壁內側。該內斜環壁自該頂環部內側向下斜向延伸並連接該觸發柱。於一例中，該底環部具有縮小的上部及與該上部相連的下部。另一例中，當該彈性圓突被擠壓至一壓下狀態時，該上部與該下部的連接處於該垂直方向上高於該頂環部與該內斜環壁的頂錐面的連接處。另一例中，該內斜環壁的厚度從該頂環部向該觸發柱變薄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An elastic dome is used in a keyswitch structure and includes a bottom ring portion, a top ring portion, an outer oblique annular wall, a trigger post, and an inner oblique annular wall. The top ring portion is located above the bottom ring portion in a vertical direction. The outer oblique annular wall obliquely connects the top ring portion and the bottom ring portion between the top ring portion and the bottom ring portion. The trigger post is located inside the outer oblique annular wall. The inner oblique annular wall extends obliquely downward from the inside of the top ring portion and is connected to the trigger post. In an embodiment, the bottom ring portion has a narrowed upper portion and a lower portion connected to the upper portion. In another embodiment, when the elastic protrusion is compressed to a depressed state, the connection between the upper portion and the lower portion is higher than the connection between of the top ring portion and a top conical surface of the inner oblique annular wall. In another embodiment, the inner oblique annular wall is thinner in thickness from the top ring portion to the trigger post.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:彈性圓突</p>
        <p type="p">182:底環部</p>
        <p type="p">182a:上部</p>
        <p type="p">182c:外側表面</p>
        <p type="p">182b:下部</p>
        <p type="p">182d:外側表面</p>
        <p type="p">184:頂環部</p>
        <p type="p">1842:內側壁面</p>
        <p type="p">186:外斜環壁</p>
        <p type="p">188:觸發柱</p>
        <p type="p">188a:末端部</p>
        <p type="p">190:內斜環壁</p>
        <p type="p">1902:頂錐面</p>
        <p type="p">1904:底錐面</p>
        <p type="p">190a:最小厚度</p>
        <p type="p">190b:最大厚度</p>
        <p type="p">A1:傾角</p>
        <p type="p">A2:夾角</p>
        <p type="p">d1,d2:外徑</p>
        <p type="p">d3:內徑</p>
        <p type="p">Dv:垂直方向</p>
        <p type="p">H1:總厚度</p>
        <p type="p">H2:頂環厚度</p>
        <p type="p">H3:底環厚度</p>
        <p type="p">H4:柱厚度</p>
        <p type="p">H5,H6:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2240" publication-number="202631103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101046</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>健康養生房</chinese-title>
        <english-title>WELLNESS ROOM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260227B">A61H33/06</main-classification>
        <further-classification edition="200601120260227B">A61H39/06</further-classification>
        <further-classification edition="200601120260227B">A61N1/44</further-classification>
        <further-classification edition="200601120260227B">A61N5/06</further-classification>
        <further-classification edition="200601120260227B">E04H1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, CHEE YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, CHEE YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例總體上屬於健康養生、健康治療和環境控制系統的領域。具體地，本發明涉及一種設計為用於安裝在住宅空間或商業空間中的健康養生房（1），其不僅可以增強身體健康，還可以提升用戶的氣場和整體幸福感。它尤其適用於熱療、排毒、放鬆、氣場提升和整體健康改善的領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present invention generally pertain to the field of wellness, health therapy, and environmental control systems. Specifically, it pertains to a wellness room (1) designed for installation in residential or commercial spaces, that enhances not only physical wellness but also the user's aura and overall sense of well-being. It is particularly applicable in the areas of heat therapy, detoxification, relaxation, aura enhancement, and overall wellness improvement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:健康養生房</p>
        <p type="p">3:室</p>
        <p type="p">5a:前壁</p>
        <p type="p">5b:後壁</p>
        <p type="p">5c:左壁</p>
        <p type="p">5d:右壁</p>
        <p type="p">5e:底部</p>
        <p type="p">5f:頂部</p>
        <p type="p">7:門</p>
        <p type="p">9:窗戶</p>
        <p type="p">11:聲音治療系統</p>
        <p type="p">11a:揚聲器</p>
        <p type="p">13:光治療系統</p>
        <p type="p">15:霧化機構</p>
        <p type="p">15a:貯存器</p>
        <p type="p">17:加熱系統</p>
        <p type="p">18:圍欄</p>
        <p type="p">19:控制台</p>
        <p type="p">21:儲物隔室</p>
        <p type="p">23:椅子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2241" publication-number="202632861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電荷泵電路及電荷泵裝置</chinese-title>
        <english-title>CHARGE PUMP CIRCUIT AND CHARGE PUMP DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H02M3/04</main-classification>
        <further-classification edition="200601120260504B">G11C16/30</further-classification>
        <further-classification edition="200601120260504B">G11C11/4193</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力旺電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電荷泵電路包括第一泵單元與第二泵單元。第一泵單元根據輸入電壓、第一時脈信號與第二時脈信號產生泵電壓。第一時脈信號與第二時脈信號同相，而且第二時脈信號具有比第一時脈信號更高的擺幅。第二泵單元具有與第一泵單元類似的結構，而且第一與第二泵單元根據輸入電壓交替地輸出泵電壓。第一泵單元和第二泵單元中的電晶體在其安全操作區域（SOA）中操作，且是設置在獨立偏壓的兩個井中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charge pump circuit includes a first pump unit and a second pump unit. The first pump unit generates a pumped voltage according to an input voltage, a first clock signal, and a second clock signal. The first clock signal and the second clock signal are in phase, and the second clock signal has a higher swing than that of the first clock signal. The second pump unit has a structure similar to that of the first pump unit, and the first and the second pump units alternatively output a pumped voltage according to the input voltage. Transistors in the first pump unit and the second pump unit are operating within their safe operating area (SOA) and are disposed in two wells that are biased independently.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電荷泵電路</p>
        <p type="p">110,120:泵單元</p>
        <p type="p">112,122:輔助控制單元</p>
        <p type="p">C1,C2,C3,C4:電容</p>
        <p type="p">IN1:輸入端</p>
        <p type="p">M1,M2,M3,M4,M5,M6,M7,M8:電晶體</p>
        <p type="p">MO1,MO2:輸出電晶體</p>
        <p type="p">MW5,MW6:井選擇電晶體</p>
        <p type="p">OUT1:輸出端</p>
        <p type="p">SIG&lt;sub&gt;CLK0&lt;/sub&gt;,SIG&lt;sub&gt;ACLK0&lt;/sub&gt;,SIG&lt;sub&gt;CLK1&lt;/sub&gt;,SIG&lt;sub&gt;ACLK1&lt;/sub&gt;:時脈信號</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VPX,VAPX,VPY,VAPY:電壓</p>
        <p type="p">W1,W2,W3:井</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2242" publication-number="202633480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃通孔填充</chinese-title>
        <english-title>GLASS VIA FILLING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">H10W70/692</main-classification>
        <further-classification edition="202601120260504B">H10W70/66</further-classification>
        <further-classification edition="200601120260504B">H01B1/22</further-classification>
        <further-classification edition="202601120260504B">H10W70/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫普利昂公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUPRION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛恩　阿爾佛雷德Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINN, ALFRED A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, KHANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛恩　漢娜坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINN, HANNAH THANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東諾普洛斯　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTONOPOULOS, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃基材，該玻璃基材中包含一或多個開口。該玻璃基材可係可用於2.5D及3D封裝解決方案中之玻璃中介層基材。該一或多個開口包括一或多個穿玻璃通孔，且該一或多個開口用金屬奈米粒子之熔合形成之主體銅基質或由金屬奈米粒子形成之反應產物金屬化以提供電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass substrate comprising one or more openings therein. The glass substrate may be a glass interposer substrate usable in 2.5D and 3D packaging solutions. The one or more openings include one or more through-glass vias and the one or more openings are metallized with a bulk copper matrix formed from fusion of metal nanoparticles or a reaction product formed from metal nanoparticles to provide an electrical connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:金屬奈米粒子</p>
        <p type="p">12:金屬核</p>
        <p type="p">14:界面活性劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2243" publication-number="202633122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101131</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260327B">H10D30/60</main-classification>
        <further-classification edition="202501120260327B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田卿彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN, KYUNGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錫勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEOKHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴判貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, PANKWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, RYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置可包括：在基板的頂表面上在第一水平方向上延伸的主動圖案、在主動圖案上且在第二水平方向上延伸的閘極電極、包括下部磊晶區和上部磊晶區的第一源極/汲極圖案、以及連接到第一源極/汲極圖案的第一源極/汲極接觸件。主動圖案可包括鰭型主動圖案。第一源極/汲極圖案可連接到鰭型主動圖案。上部磊晶區可包括可從鰭型主動圖案的表面向內凹陷的磊晶凹槽。下部磊晶區可沿磊晶凹槽的內壁配置。第一源極/汲極接觸件可配置在磊晶凹槽中以及在穿過基板和鰭型主動圖案的電力接觸件孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may include an active pattern extending in a first horizontal direction on the top surface of a substrate, a gate electrode on the active pattern and extending in a second horizontal direction, a first source/drain pattern including a lower epitaxial region and an upper epitaxial region, and a first source/drain contact connected to the first source/drain pattern. The active pattern may include a fin-type active pattern. The first source/drain pattern may be connected to the fin-type active pattern. The upper epitaxial region may include an epitaxial recess that may be inwardly recessed from a surface of the fin-type active pattern. The lower epitaxial region may be arranged along an inner wall of the epitaxial recess. The first source/drain contact may be arranged in the epitaxial recess and in a power contact hole passing through the substrate and the fin-type active pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:第一電力線</p>
        <p type="p">100:基板</p>
        <p type="p">100BS,170BS:底表面</p>
        <p type="p">100US,120US,145US,175US,AP1_US,BP1_US:頂表面</p>
        <p type="p">120:閘極電極</p>
        <p type="p">130:閘極絕緣膜</p>
        <p type="p">140:閘極間隔件</p>
        <p type="p">145:閘極頂蓋圖案</p>
        <p type="p">150LR:下部源極/汲極區</p>
        <p type="p">150R_EP:磊晶凹槽</p>
        <p type="p">150UR:上部源極/汲極區</p>
        <p type="p">150:第一源極/汲極圖案</p>
        <p type="p">151:第一圓柱形磊晶區</p>
        <p type="p">152:第一上部磊晶區</p>
        <p type="p">153:下部磊晶區</p>
        <p type="p">155:第一接觸件矽化物膜</p>
        <p type="p">160:第二源極/汲極圖案</p>
        <p type="p">161:第二圓柱形磊晶區</p>
        <p type="p">162:第二上部磊晶區</p>
        <p type="p">165:第二接觸件矽化物膜</p>
        <p type="p">170:第一源極/汲極接觸件</p>
        <p type="p">170SW:側壁</p>
        <p type="p">170t:電力接觸件孔</p>
        <p type="p">175:第二源極/汲極接觸件</p>
        <p type="p">185:源極/汲極蝕刻停止層</p>
        <p type="p">190:第一層間絕緣膜</p>
        <p type="p">191:第二層間絕緣膜</p>
        <p type="p">195:配線結構</p>
        <p type="p">196:通孔插塞</p>
        <p type="p">197:配線線路</p>
        <p type="p">A-A:線</p>
        <p type="p">AP1:第一主動圖案</p>
        <p type="p">BP1:第一鰭型主動圖案</p>
        <p type="p">EX1:半導體裝置</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">H1,H2:距離</p>
        <p type="p">I_GS:內部閘極結構</p>
        <p type="p">NS1:第一片狀主動圖案</p>
        <p type="p">P:區</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2244" publication-number="202631347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校準方法、校準裝置、校準系統、電子設備、電腦可讀存儲介質及電腦程式產品</chinese-title>
        <english-title>CALIBRATION METHOD AND APPARATUS, SYSTEM, DEVICE, MEDIUM AND PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B25J9/10</main-classification>
        <further-classification edition="200601120260128B">B25J19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE HONG KONG POLYTECHNIC UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, PENG-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種校準方法包括在第一機器人安裝圖像採集設備，在第二機器人安裝校準設備；獲得第一和第二機器人的運動軌跡，運動軌跡包括N個預定檢測點位；移動第一和第二機器人到第一預定位姿，使用圖像採集設備採集校準設備的校準圖像；根據校準圖像，獲得校準設備與圖像採集設備之間的相對位姿；根據相對位姿，控制第一和/或第二機器人調整，直至校準設備與圖像採集設備之間的相對位姿符合對齊條件；記錄第一和第二機器人之間的修正位姿；控制第一和第二機器人移動到第二預定位姿，直至獲得運動軌跡的N個預定檢測點位的N個修正位姿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a calibration method and system, belonging to the fields of optics and robotics. The calibration method includes: installing an image acquisition device at an end of a first robot and a calibration device at an end of a second robot; obtaining motion trajectories of the first robot and the second robot, wherein the motion trajectories include N predetermined detection points; controlling the first robot and the second robot to move to first predetermined poses relative to a first predetermined detection point, and using the image acquisition device to acquire a first calibration image of the calibration device; obtaining, according to the first calibration image, a first relative pose between the calibration device and the image acquisition device at the first predetermined detection point; controlling, according to the first relative pose, the first robot and/or the second robot to adjust until the first relative pose between the calibration device and the image acquisition device meets an alignment condition at the first predetermined detection point; recording a corrected pose between the first robot and the second robot relative to the first predetermined detection point; and controlling the first robot and the second robot to move to second predetermined poses relative to the second predetermined detection point until N corrected poses of the N predetermined detection points are obtained.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160,S170:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2245" publication-number="202632811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260416B">H01R13/646</main-classification>
        <further-classification edition="200601120260416B">H01R13/655</further-classification>
        <further-classification edition="200601120260416B">H01R13/514</further-classification>
        <further-classification edition="200601120260416B">H01R13/40</further-classification>
        <further-classification edition="201101120260416B">H01R12/71</further-classification>
        <further-classification edition="200601120260416B">H01R4/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮明議</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, MING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印小虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, XIAO-HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，包括：絕緣殼體，包括兩個側壁及對接槽；兩排電性端子，分別設置在對應側壁，每一電性端子包括固定在絕緣本體的固定部、自固定部延伸的彈性臂，彈性臂包括突伸入對接槽的接觸部；每一排電性端子包括多個差分端子對與多個接地端子；兩個導電件，分別固定在對應側壁；導電件包括固定座及連接於固定座的多個懸臂，固定座固定於側壁，懸臂穿過側壁並被配置為與接地端子的彈性臂相抵接，使多個接地端子彼此聯通。與習知技術相比，兩個導電件固定在側壁，懸臂穿過側壁進入絕緣殼體內，導電件不會對電連接器內的其它元件造成破壞，而電連接器內的其它元件也不會影響導電件的安裝與拆卸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating housing, two rows of terminals, and two conductive members. The insulating housing includes two sidewalls and a mating slot between the two sidewalls. The two rows of terminals are disposed on the sidewalls respectively. Each terminal includes a fixing portion secured to the insulating housing, and an elastic arm extending from the fixing portion and having a contacting portion protruding into the mating slot. Each row of electrical terminals includes plural differential terminals and plural ground terminals. The two conductive members are respectively fixed to corresponding sidewalls. Each conductive member includes a fixing base and plural cantilevers. The fixing base is secured to the sidewall, and the cantilevers pass through the sidewall and are configured to abut against the elastic arms of grounding terminals respectively. Therefore, the conductive members do not damage components inside the electrical connector and improve the high speed performance of the electrical connector.&lt;br/&gt; .</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:底壁</p>
        <p type="p">14:對接槽</p>
        <p type="p">22D:差分對端子</p>
        <p type="p">22G:接地端子</p>
        <p type="p">221:固定部</p>
        <p type="p">222:彈性臂</p>
        <p type="p">2221:接觸部</p>
        <p type="p">2223:根部</p>
        <p type="p">223:焊接部</p>
        <p type="p">31:固定座</p>
        <p type="p">310:底面</p>
        <p type="p">32:懸臂</p>
        <p type="p">3221:弧形抵接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2246" publication-number="202632608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虛擬化身表示格式資料類型</chinese-title>
        <english-title>AVATAR REPRESENTATION FORMAT DATA TYPES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260402B">G06V20/20</main-classification>
        <further-classification edition="200601120260402B">G06T1/00</further-classification>
        <further-classification edition="201101120260402B">G06T15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商內數位ＣＥ專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾薇兒　昆汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVRIL, QUENTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瓦　雷加泰羅　若奧　佩德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COVA REGATEIRO, JOAO PEDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈瑟蘭　菲利普　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSSELIN, PHILIPPE HENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒　克萊爾　法蘭克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE CLERC, FRANCOIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於將新資料類型添加至虛擬化身表示格式資料性質之方法及設備。類型性質係提供該資料之mime類型的一字串。至少一個實施例指涉使用一或多個資料類型之幾何物件之不同傳訊方式。實施例定義網格物件之一種單一傳訊方式且添加幾何性質作為一資料性質。接著，實施例藉由改變網格資料中之類型之值而在幾何物件之該等不同傳訊方式之間切換。在此情況下，幾何容器之定義在ARF描述之外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus are provided for adding new data types to the Avatar Representation Format data property. The type property is a string providing the mime types of the data. At least one embodiment refers to different signaling ways for the geometry objects using one or more data types. The embodiments define one single signaling way of the Mesh object and add the geometry properties as a Data property. The embodiments then switch between the different signaling ways of the geometry objects by changing the value of type in mesh data. In this case the definition of the Geometry containers is external to the ARF description.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">105:輸入區塊</p>
        <p type="p">110:處理器</p>
        <p type="p">115:連接配置</p>
        <p type="p">120:記憶體</p>
        <p type="p">130:編碼器/解碼器模組</p>
        <p type="p">140:儲存裝置</p>
        <p type="p">150:通訊介面</p>
        <p type="p">160:顯示介面</p>
        <p type="p">165:顯示裝置</p>
        <p type="p">170:音訊介面</p>
        <p type="p">175:音訊裝置</p>
        <p type="p">180:周邊介面</p>
        <p type="p">185:周邊裝置</p>
        <p type="p">190:通訊通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2247" publication-number="202632813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01R13/648</main-classification>
        <further-classification edition="201101120260427B">H01R13/6581</further-classification>
        <further-classification edition="200601120260427B">H01R13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭世偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹欽欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, QIN-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳祖陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，包括絕緣本體、端子以及第一接地件；絕緣本體包括插槽及側壁；端子包括第一、第二端子，端子包括固持部、彈性部、接觸部及接腳部，第一端子包括第一訊號端子對及第一接地端子，第一接地件設置於第一端子之遠離第二端子的外側，且第一接地件包括沿上下方向延伸並遮蔽於第一訊號端子對外側的第一遮蔽部及位於第一接地端子外側且能夠與對應第一接地端子接觸的接地部；第一遮蔽部向上超過對應的第一訊號端子對，於靠近接觸部處向外凸出形成外凸部。如此，第一遮蔽部很好地對訊號端子對進行遮蔽，使電連接器具有更好的高頻性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating housing, plural terminals and a first grounding member. The insulating housing includes a mating slot and two side walls. The plural terminals include a row of first terminals and a row of second terminals. Each terminal has a fixed portion, an elastic portion, a contacting portion and a tail portion. The first terminals include plural pairs of first signal terminals and first grounding terminals. The first grounding member is arranged at an outer side of the first terminals away from the second terminals. The first grounding member includes plural first shielding portions extending vertically and shielding at an outer side of corresponding pairs of first signal terminals, and grounding portions located at an outer side of the first grounding terminals and contacting with corresponding first grounding terminals. The first shielding portions extend upwards and exceed upper ends of the first signal terminals, and bulge outwards near the contacting portions of the first signal terminals to form a bulging portion. With a better shielding of first signal terminals by the first shielding portions, the electrical connector has an improved high frequency performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:固持部</p>
        <p type="p">121:彈性部</p>
        <p type="p">122:接觸部</p>
        <p type="p">123:接腳部</p>
        <p type="p">1310:外凸部</p>
        <p type="p">1311:翻腳部</p>
        <p type="p">1314:固接部</p>
        <p type="p">1315:傾斜部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2248" publication-number="202632984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊模組、操作所述通訊模組的方法以及電子裝置</chinese-title>
        <english-title>COMMUNICATION MODULE, METHOD OF OPERATING THE SAME, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W24/02</main-classification>
        <further-classification edition="200901120260305B">H04W24/10</further-classification>
        <further-classification edition="201501120260305B">H04B17/309</further-classification>
        <further-classification edition="202301120260305B">H04W72/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玄晟煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYUN, SEONGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭多海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, DAHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金起日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KIIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YEONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金釩坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BEOMKON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都周鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, JOOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊模組包括：無線電資源管理（RRM）量測器，被配置成：量測第一時段的第一RRM值，以及產生包括第一時段的第一RRM值的多個RRM量測值；RRM預測器，被配置成：基於所述多個RRM量測值，預測第二時段的第二RRM值，以及產生包括第二時段的第二RRM值的多個RRM預測值；一或多個通訊處理器，包括處理電路系統；以及記憶體，儲存指令。所述指令在由所述一或多個通訊處理器各別或共同執行時使得通訊模組進行以下操作：自所述多個RRM量測值之中選擇至少一個目標RRM量測值；以及基於所述至少一個目標RRM量測值來對RRM預測器進行更新。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication module includes a radio resource management (RRM) measurer configured to measure a first RRM value of a first period, and to generate a plurality of RRM measurement values including the first RRM value of the first period, an RRM predictor configured to predict a second RRM value of a second period, based on the plurality of RRM measurement values, and to generate a plurality of RRM prediction values including the second RRM value of the second period, one or more communication processors including processing circuitry, and memory storing instructions. The instructions, when executed by the one or more communication processors individually or collectively, cause the communication module to select at least one target RRM measurement value from among the plurality of RRM measurement values, and update the RRM predictor based on the at least one target RRM measurement value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:通訊模組</p>
        <p type="p">131:通訊處理器</p>
        <p type="p">132:RRM預測模組</p>
        <p type="p">133:RRM量測模組</p>
        <p type="p">134:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2249" publication-number="202633101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣閘雙極型超接面電晶體</chinese-title>
        <english-title>INSULATED GATE BIPOLAR SUPERJUNCTION TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260401B">H10D12/01</main-classification>
        <further-classification edition="202501120260401B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聞笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑卡拉納拉亞南　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKARANARAYANAN, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德馬納班　卡西克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADMANABHAN, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝諾伊　普拉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENOY, PRAVEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種絕緣閘雙極型超接面電晶體（IGBST）。在一實施例，提供了一種具有預設絕緣閘雙極型電晶體（IGBT）區域和金屬-氧化物-半導體場效應電晶體（MOSFET）區域的基板。例如，確定要在基板上注入的若干摻雜劑層，以在IGBT區域和MOSFET區域上形成超接面結構，摻雜劑層的數量可在1-15層的範圍內。在部分實施例，對於超接面結構的每一層，通過遮罩p+注入形成一層超接面P立柱，並通過遮罩n+注入形成對應的一層超接面N立柱。例如，超接面P立柱和超接面N立柱在基板上均勻分佈。各實施例可有利地實現IGBST在低電流輸入到高電流輸入間輸出功率的平穩過渡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and associated methods relate to an insulated gate bipolar superjunction transistor (IGBST). In an illustrative example, a substrate having a predefined insulated gate bipolar transistor (IGBT) section and a metal-oxide-semiconductor field-effect transistor (MOSFET) section is provided. A number of layers of dopant to be implanted on the substrate, for example, is determined to form a superjunction structure across the IGBT section and the MOSFET section. For example, the number of layers may range from 1-15. In some implementations, for each layer of the superjunction structure, a layer of superjunction P columns through masked p+ implant and a corresponding layer of superjunction N columns through masked n+ implant are formed. For example, the superjunction P columns and the superjunction N columns are uniformly distributed across the substrate. Various embodiments may advantageously provide a smooth transition of output power from the IGBST between a low current to a high current input.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率轉換系統</p>
        <p type="p">105:功率輸入</p>
        <p type="p">110:功率輸出</p>
        <p type="p">115:大功率應用</p>
        <p type="p">120:IGBST矽器件</p>
        <p type="p">125:SJ-MOSFET區域</p>
        <p type="p">130:IGBT區域</p>
        <p type="p">135:超接面結構</p>
        <p type="p">140:DBCS</p>
        <p type="p">145A:第一接觸區域</p>
        <p type="p">145B:第二接觸區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2250" publication-number="202632818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電性切換結構</chinese-title>
        <english-title>ELECTRIC SWITCHING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01R13/703</main-classification>
        <further-classification edition="201101120260202B">H01R24/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環榮電子（惠州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (HUIZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彰城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電性切換結構，包含外殼、第一連接器、電性切換器、閂鎖機構以及第二連接器。外殼包含插孔，第一連接器對應插孔。閂鎖機構包含卡勾及觸發部。第二連接器插入插孔以電性連接第一連接器，且第二連接器包含連接部、身部及凹槽。連接部與第一連接器對接，身部連接於連接部，凹槽位於身部。觸發部位於第一位置時未觸發電性切換器，當第二連接器插入插孔時，身部推頂卡勾，連動觸發部由第一位置切換至第二位置，觸發電性切換器進行電性切換，當第二連接器與第一連接器完成連接，卡勾卡入凹槽。藉此增加額外電性切換功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electric switching structure including a case, a first connecting device, an electric switching device, a latch mechanism and a second connecting device. The case includes an inserting hole, and the first connecting device corresponds to the inserting hole. The latch mechanism includes a hook and a triggering portion. The second connecting device inserts the inserting hole to electrically connect to the first connecting device, and the second connecting device includes a connecting portion, a body portion, and a groove. The connecting portion is connected to the first connecting device. The body portion is connected to the connecting portion. The groove is located at the body portion. As the triggering portion is located at a first position, the electric switching device is not triggered. As the second connecting device is inserted into the inserting hole, the body portion pushes the hook such that the triggering portion moves from the first position to a second position to trigger the electric switching device for an electrical switching. As the second connecting device is completely connected to the first connecting device, the hook enters the groove. Therefore, an extra electrical switching function is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電性切換結構</p>
        <p type="p">110:外殼</p>
        <p type="p">111:插孔</p>
        <p type="p">1111:插孔開口</p>
        <p type="p">1112:插孔側壁</p>
        <p type="p">112:端壁</p>
        <p type="p">113:方框</p>
        <p type="p">114:限位溝</p>
        <p type="p">1151,1152:定位件</p>
        <p type="p">116:凸柱</p>
        <p type="p">117:第一設置板</p>
        <p type="p">118:導銷</p>
        <p type="p">119:推頂凸部</p>
        <p type="p">120:第一連接器</p>
        <p type="p">130:電性切換器</p>
        <p type="p">131:彈片</p>
        <p type="p">140:閂鎖機構</p>
        <p type="p">141:卡勾</p>
        <p type="p">142:觸發部</p>
        <p type="p">143:移動件</p>
        <p type="p">1431:第一板體</p>
        <p type="p">1432:第二板體</p>
        <p type="p">1433:下伸板體</p>
        <p type="p">144:限位銷</p>
        <p type="p">145:容槽</p>
        <p type="p">146:導引溝</p>
        <p type="p">147:彈性件</p>
        <p type="p">149:定位銷</p>
        <p type="p">150:第二連接器</p>
        <p type="p">151:連接部</p>
        <p type="p">152:身部</p>
        <p type="p">1521:身部主體</p>
        <p type="p">1522:外罩</p>
        <p type="p">153:凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2251" publication-number="202631719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性組成物、膜、濾光器、固體攝像元件及圖像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F220/36</further-classification>
        <further-classification edition="200601120260504B">C08F222/22</further-classification>
        <further-classification edition="200601120260504B">C08F290/06</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/033</further-classification>
        <further-classification edition="200601120260504B">G02B5/20</further-classification>
        <further-classification edition="200601120260504B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳俊佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤憲晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, NORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光硬化性組成物，其包含聚合性單體及光聚合起始劑，其中上述聚合性單體包含具有胺基、環結構及1～4個含乙烯性不飽和鍵之基之聚合性單體a。本發明提供一種使用了前述光硬化性組成物之膜、濾光器、固體攝像元件及圖像顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2252" publication-number="202631790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成膜以及具有具保護膜的工件單片化物的裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C08G59/50</main-classification>
        <further-classification edition="200601120260401B">C08G59/68</further-classification>
        <further-classification edition="200601120260401B">C08L33/08</further-classification>
        <further-classification edition="200601120260401B">C08L63/00</further-classification>
        <further-classification edition="200601120260401B">C08L83/06</further-classification>
        <further-classification edition="200601120260401B">C08K3/36</further-classification>
        <further-classification edition="200601120260401B">C08K5/41</further-classification>
        <further-classification edition="200601120260401B">C08K9/04</further-classification>
        <further-classification edition="200601120260401B">C08J5/18</further-classification>
        <further-classification edition="200601120260401B">C09K9/02</further-classification>
        <further-classification edition="202601120260401B">H10P54/92</further-classification>
        <further-classification edition="202601120260401B">H10P58/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島一馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠簡便地判斷保護膜是否受到了加熱的保護膜形成膜，及使用該保護膜形成膜來製造具有具保護膜的半導體晶片等具保護膜的工件單片化物的裝置的方法。本發明針對前述課題之解決手段為一種保護膜形成膜，係用於貼附在工件上並形成保護膜，其中，在將對保護膜形成膜進行保護膜化而得到的保護膜的表面上的波長555nm的光在23℃下的反射率設為R1(%)，將以220℃對該保護膜加熱5分鐘之後的該保護膜的表面上的波長555nm的光在23℃下的反射率設為R2(%)，並將R1與R2的差的絕對值設為RA時，RA為1.0%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護膜形成膜</p>
        <p type="p">1a,1b:主面</p>
        <p type="p">10:保護膜形成用片</p>
        <p type="p">21:第一剝離膜</p>
        <p type="p">22:第二剝離膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2253" publication-number="202631866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101341</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>延伸膜及其製造方法</chinese-title>
        <english-title>EXTENDED FILM AND METHOD FOR MANUFACTURING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260402B">C08L23/0861</main-classification>
        <further-classification edition="200601120260402B">C08J5/18</further-classification>
        <further-classification edition="201901120260402B">B32B7/06</further-classification>
        <further-classification edition="200601120260402B">B32B7/12</further-classification>
        <further-classification edition="200601120260402B">B32B27/08</further-classification>
        <further-classification edition="200601120260402B">B32B27/32</further-classification>
        <further-classification edition="200601120260402B">B32B27/30</further-classification>
        <further-classification edition="200601120260402B">B29C55/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.I.TAKIRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原一芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, KAZUFUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森惠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大島滉主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種延伸膜及其製造方法，延伸膜（10），其至少包括基材層（3）及阻隔層（5），基材層（3）以密度為0.950g／cm&lt;sup&gt;3&lt;/sup&gt;以上的高密度聚乙烯為主要成分，阻隔層（5）以丁烯二醇－乙烯醇共聚物為主要成分，在膜的延伸方向上，在120℃下加熱10分鐘的情況下的熱收縮率為5％以下，藉由在25℃的水中攪拌一小時，基材層（3）與阻隔層（5）分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide an extended film and a method for manufacturing the same. According to the present invention, the extended film (10) comprises at least a base layer (3) and a barrier layer (5), wherein the base layer (3) is primarily composed of a main component comprising a high-density polyethylene having a density of 0.950 g/cm³ or more, and the barrier layer (5) is primarily composed of a main component comprising a butenediol-vinyl alcohol copolymer. The extended film has a heat shrinkage rate of 5% or less when heated in a stretching direction of the film at 120 °C for 10 minutes, and the base layer (3) and the barrier layer (5) are separated from each other by stirring the extended film in water at 25 °C for 1 hour.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層體</p>
        <p type="p">2:密封膜</p>
        <p type="p">3:基材層(第一基材層)</p>
        <p type="p">4:接著劑層(第一接著劑層)</p>
        <p type="p">5:阻隔層</p>
        <p type="p">10:延伸膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2254" publication-number="202633281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置、其動作方法及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P34/42</main-classification>
        <further-classification edition="202601120260310B">H10P72/00</further-classification>
        <further-classification edition="202601120260310B">H10P95/90</further-classification>
        <further-classification edition="200601120260310B">H01S5/42</further-classification>
        <further-classification edition="201401120260310B">B23K26/00</further-classification>
        <further-classification edition="200601120260310B">H05B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛捧浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUL, BONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全轃標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JIN PYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹星進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅俊永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, JUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOCK HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基板處理裝置及其動作方法，根據本發明的實施例的基板處理裝置，其對半導體基板執行加熱製程，所述基板處理裝置可以包括：支撐卡盤，支撐所述半導體基板；多個吸光部，配置在所述支撐卡盤的一面；以及多個雷射器，向所述多個吸光部照射雷射。所述多個吸光部的配置和數量可以被確定為使得所述支撐卡盤的各區域的溫度分佈保持均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板處理裝置</p>
        <p type="p">210:支撐卡盤</p>
        <p type="p">SUB:基板</p>
        <p type="p">220_1、220_2、220_3、220_4、220_5:吸光部</p>
        <p type="p">230_1、230_2、230_3、230_4、230_5:雷射器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2255" publication-number="202631791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成膜以及具保護膜的工件單片化物的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08G59/50</main-classification>
        <further-classification edition="200601120260504B">C08G59/68</further-classification>
        <further-classification edition="200601120260504B">C08L33/08</further-classification>
        <further-classification edition="200601120260504B">C08L63/00</further-classification>
        <further-classification edition="200601120260504B">C08L83/06</further-classification>
        <further-classification edition="200601120260504B">C08K3/36</further-classification>
        <further-classification edition="200601120260504B">C08K5/00</further-classification>
        <further-classification edition="200601120260504B">C08K9/04</further-classification>
        <further-classification edition="200601120260504B">C09K9/02</further-classification>
        <further-classification edition="200601120260504B">C08J5/18</further-classification>
        <further-classification edition="202601120260504B">H10P54/92</further-classification>
        <further-classification edition="202601120260504B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島一馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的技術問題在於提供一種能夠簡單判斷熱硬化性的保護膜形成膜是否已被加熱的保護膜形成膜、及使用該保護膜形成膜來製造具保護膜的半導體晶片等具保護膜的工件單片化物的方法。&lt;br/&gt;  本發明的解決手段為一種保護膜形成膜，其為用於貼附於工件並形成保護膜的熱硬化性的保護膜形成膜，其中將保護膜形成膜的表面的由Yxy表色系所規定的23℃下的色度Y的值設為Y1，將以140℃加熱前述保護膜形成膜2小時後的該保護膜形成膜的表面的由Yxy表色系所規定的23℃下的色度Y的值設為Y2，並將Y1與Y2之差的絕對值設為YA時，YA為2.00以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護膜形成膜</p>
        <p type="p">1a:主面</p>
        <p type="p">1b:主面</p>
        <p type="p">10:保護膜形成用片</p>
        <p type="p">21:第一剝離膜</p>
        <p type="p">22:第二剝離膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2256" publication-number="202631374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透氣物品</chinese-title>
        <english-title>BREATHABLE ARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260225B">B32B3/24</main-classification>
        <further-classification edition="200601120260225B">B32B27/20</further-classification>
        <further-classification edition="200601120260225B">B32B27/32</further-classification>
        <further-classification edition="200601120260225B">C08K3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡博內爾布蘭奇　亞伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBONELL BLANCH, ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比蒂尼斯　喬治亞娜塔莎埃夫塔利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BITINIS, GEORGIA NATACHA EFTALIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　拉傑Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, RAJEN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之實施例係關於透氣物品，其包括：包括碳酸鈣與透氣層材料之多孔層，其中該透氣層材料具有大於0.915 g/cm³之密度及0.5至5 dg/min之熔融指數(I&lt;sub&gt;2&lt;/sub&gt;)；及包括無孔層材料之無孔層，其中該無孔層材料具有小於0.910 g/cm³之密度及0.5至5 dg/min之熔融指數(I&lt;sub&gt;2&lt;/sub&gt;)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure are directed towards breathable articles including a porous layer including calcium carbonate and a breathable layer material, wherein the breathable layer material has a density greater than 0.915 g/cm³ and melt index (I&lt;sub&gt;2&lt;/sub&gt;) from 0.5 to 5 dg/min; and a non-porous layer including a non-porous layer material, wherein the non-porous layer material has a density less than 0.910 g/cm³ and melt index (I&lt;sub&gt;2&lt;/sub&gt;) from 0.5 to 5 dg/min.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2257" publication-number="202632402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板以及車輛</chinese-title>
        <english-title>DISPLAY PANEL AND VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">G02F1/1335</main-classification>
        <further-classification edition="200601120260130B">G02B5/22</further-classification>
        <further-classification edition="200601120260130B">G02B3/00</further-classification>
        <further-classification edition="202201120260130B">B60R1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愼珉規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, MIN GUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧承光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROH, SEUNG-KWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔友哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WOO-CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文相經</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, SANG KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔東一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, DONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙廷模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JUNG MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李治學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寶芽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, BO A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種顯示面板。該顯示面板包括：第一子像素，具有配置成發出第一顏色光的第一發光元件；第二子像素，具有配置成發出第二顏色光的第二發光元件；設置在第一子像素上並與第一子像素重疊的第一透鏡；以及設置在第二子像素上並與第二子像素重疊的第二透鏡，且第一透鏡和第二透鏡包括配置成降低第二顏色光亮度的第二減色濾色顏料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a display panel. The display panel includes a first subpixel having a first light-emitting element configured to emit a first color light, a second subpixel having a second light-emitting element configured to emit a second color light, a first lens disposed on the first subpixel to overlap the first subpixel, and a second lens disposed on the second subpixel to overlap the second subpixel, and the first and second lenses include a second color reduction color filter pigment configured to reduce a luminance of the second color light</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">11:時序控制器</p>
        <p type="p">12:資料驅動器</p>
        <p type="p">13:閘極驅動器</p>
        <p type="p">20:電源</p>
        <p type="p">AA:主動區域</p>
        <p type="p">NA:非主動區域</p>
        <p type="p">GL:閘極線</p>
        <p type="p">GL1~GLn:閘極線</p>
        <p type="p">DL:資料線</p>
        <p type="p">DL1~DLm:資料線</p>
        <p type="p">SPG:第三子像素</p>
        <p type="p">SPR:第二子像素</p>
        <p type="p">SPB:第一子像素</p>
        <p type="p">UP:單元像素</p>
        <p type="p">SP:子像素</p>
        <p type="p">EVDD:高電位驅動電壓</p>
        <p type="p">PDC:電源時序控制訊號</p>
        <p type="p">GDC:閘極時序控制訊號</p>
        <p type="p">DDC:資料時序控制訊號</p>
        <p type="p">D-DATA:數位影像資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2258" publication-number="202633477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/655</main-classification>
        <further-classification edition="202601120260302B">H10W70/652</further-classification>
        <further-classification edition="202501120260302B">H10D86/85</further-classification>
        <further-classification edition="202601120260302B">H10W42/60</further-classification>
        <further-classification edition="202601120260302B">H10W90/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南升基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, SEUNGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴智英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JIYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昭譚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SODAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文盛煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, SUNGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置。半導體裝置包括：封裝基板；設置在封裝基板上的中介層；設置在中介層上的複數個小晶片晶粒；以及設置在中介層上的複數個電容器晶粒，複數個電容器晶粒包含第一電容器晶粒和第二電容器晶粒。複數個電容器晶粒設置在複數個小晶片晶粒之中，並且第一電容器晶粒的尺寸與第二電容器晶粒的尺寸不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes: a package substrate; an interposer provided on the package substrate; a plurality of chiplet dies provided on the interposer; and a plurality of capacitor dies provided on the interposer, the plurality of capacitor dies including a first capacitor die and a second capacitor die. The plurality of capacitor dies are provided among the plurality of chiplet dies, and a size of the first capacitor die is different from a size of the second capacitor die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">2:封裝基板</p>
        <p type="p">3:中介層</p>
        <p type="p">4:第一晶粒</p>
        <p type="p">5:第二晶粒</p>
        <p type="p">6:電容器晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2259" publication-number="202632007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於還原含鐵粒子之方法、用於清潔引入氣流之設備、包含該設備之系統、及該設備或系統之用途</chinese-title>
        <english-title>METHOD FOR REDUCING IRON CONTAINING PARTICLES, APPARATUS FOR CLEANING AN INTRODUCTION GAS STREAM, SYSTEM COMPRISING SUCH AN APPARATUS AND USE OF SUCH AN APPARATUS OR A SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C21B13/00</main-classification>
        <further-classification edition="200601120260401B">C21B13/02</further-classification>
        <further-classification edition="202201120260401B">B01D46/00</further-classification>
        <further-classification edition="200601120260401B">B01J8/00</further-classification>
        <further-classification edition="200601120260401B">B01J8/24</further-classification>
        <further-classification edition="200601120260401B">F27D7/06</further-classification>
        <further-classification edition="202501120260401B">F27D17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森堡商保爾伍斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渥芬格爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFINGER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾梅斯　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERMES, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德特　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEDERT, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於還原引入氣流(101)中所包含之含鐵粒子(105)之方法，其中該方法包含下列步驟：  &lt;br/&gt;-       將該引入氣流(101)引入一還原體積(20)中；  &lt;br/&gt;-       至少暫時地將該等含鐵粒子(105)之至少一部分滯留在該還原體積(20)中；及  &lt;br/&gt;-       將滯留的該等含鐵粒子(105)之至少一部分還原，提高其還原度。  &lt;br/&gt;本發明進一步關於一種用於清潔含有含鐵粒子(105)之一引入氣流(101)之設備(10)以及一種包含此一設備(10)及一直接還原反應器(30)之系統(100)。  &lt;br/&gt;（圖1）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for reducing iron containing particles (105) comprised in an introduction gas stream (101), &lt;b&gt;wherein&lt;/b&gt; the method comprises the following steps: &lt;br/&gt;- introducing the introduction gas stream (101) to a reducing volume (20); &lt;br/&gt;- at least temporarily retaining at least a part of the iron containing particles (105) in the reducing volume (20); and &lt;br/&gt;- reducing at least part of the retained iron containing particles (105) increasing their degree of reduction. &lt;br/&gt;The invention further relates to an apparatus (10) for cleaning an introduction gas stream (101) containing iron containing particles (105) and a system (100) comprising such an apparatus (10) and a direct reduction reactor (30).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:設備</p>
        <p type="p">11:殼體</p>
        <p type="p">12:入口開口</p>
        <p type="p">13:出口開口</p>
        <p type="p">14:粒子出口開口</p>
        <p type="p">15:過濾裝置</p>
        <p type="p">16:反沖洗入口開口</p>
        <p type="p">17:流體化入口開口</p>
        <p type="p">18:(過濾裝置的)過濾表面</p>
        <p type="p">19:(過濾裝置的)反沖洗表面</p>
        <p type="p">20:清潔(及還原)體積</p>
        <p type="p">21:入口清潔體積</p>
        <p type="p">22:出口清潔體積</p>
        <p type="p">101:引入氣流</p>
        <p type="p">102:排出氣流</p>
        <p type="p">103:反沖洗氣體</p>
        <p type="p">104:流體化氣體</p>
        <p type="p">105:含鐵粒子</p>
        <p type="p">106:反應器入口氣流</p>
        <p type="p">161:反沖洗出口開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2260" publication-number="202632284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片測試用空冷式冷卻裝置</chinese-title>
        <english-title>AIR-COOLING DEVICE FOR SEMICONDUCTOR CHIP TESTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">G01R1/02</main-classification>
        <further-classification edition="200601120260126B">H05K7/20</further-classification>
        <further-classification edition="200601120260126B">F28F3/02</further-classification>
        <further-classification edition="200601120260126B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商惠康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴炯碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYUNG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEE, SEUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種優化熱傳遞效率的半導體晶片測試用空冷式冷卻裝置，包括：下部框架；測試模組，容納半導體晶片；上部蓋，配置在所述下部框架的上部；冷卻模組，結合於所述上部蓋，用於對於從所述半導體晶片產生的熱進行散熱；及推壓模組，用於所述測試模組與所述冷卻模組的接觸；其中，所述冷卻模組可由複數個熱管、複數個散熱鰭片及散熱風扇構成，所述複數個散熱鰭片分別被所述熱管貫通，所述散熱風扇用於以與所述散熱鰭片的層疊方向垂直的方向吹氣；所述複數個熱管可以是壓入於所述推壓模組的上部面來進行固定結合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:下部框架</p>
        <p type="p">200:上部蓋</p>
        <p type="p">300:冷卻模組</p>
        <p type="p">310:熱管</p>
        <p type="p">320:散熱鰭片</p>
        <p type="p">330:散熱風扇</p>
        <p type="p">500:壓縮桿/升降桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2261" publication-number="202632198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提高冷卻效率的水冷式冷卻劑分配裝置</chinese-title>
        <english-title>WATER-COOLED COOLANT DISTRIBUTION DEVICE WITH ENHANCED COOLING EFFICIENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260126B">F28D3/04</main-classification>
        <further-classification edition="200601120260126B">F28F9/26</further-classification>
        <further-classification edition="200601120260126B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商惠康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HICON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONG WEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　裁白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, JAE BAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　路建載</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LOGAN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴炯碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HYUNG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEE, SEUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提高冷卻效率的水冷式冷卻劑分配裝置，包括：下部板；上部外殼，結合於所述下部板的上部；進水部，結合於所述上部外殼，並且從冷卻劑供應部流入冷卻劑；出水部，結合於所述上部外殼，並且向冷卻劑回收部流出冷卻劑；冷卻劑儲存部，配置在所述上部外殼的內部，以與所述進水部連通，並且儲存透過所述進水部流入的冷卻劑；以及冷卻劑分配部，配置在所述下部板的上部面，用於以相互不同的方向分配從所述冷卻劑儲存部接收的冷卻劑；其中，依次經過所述進水部與所述冷卻劑儲存部流入的冷卻劑通過所述冷卻劑分配部以相互不同的方向分流，可引導向所述下部板與所述冷卻劑分配部之間的空間流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:下部板</p>
        <p type="p">200:上部外殼</p>
        <p type="p">300:進水部</p>
        <p type="p">400:出水部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2262" publication-number="202631747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、硬化膜、顯示元件及硬化膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C08F212/14</main-classification>
        <further-classification edition="200601120260401B">C08F216/12</further-classification>
        <further-classification edition="200601120260401B">C08F220/06</further-classification>
        <further-classification edition="200601120260401B">C08F220/18</further-classification>
        <further-classification edition="200601120260401B">C08F220/32</further-classification>
        <further-classification edition="200601120260401B">C08F222/40</further-classification>
        <further-classification edition="200601120260401B">G03F7/004</further-classification>
        <further-classification edition="200601120260401B">G03F7/039</further-classification>
        <further-classification edition="200601120260401B">G03F7/022</further-classification>
        <further-classification edition="200601120260401B">G03F7/20</further-classification>
        <further-classification edition="200601120260401B">G03F7/40</further-classification>
        <further-classification edition="200601120260401B">H05B33/22</further-classification>
        <further-classification edition="202301120260401B">H10K50/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田晃久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, AKIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>間嶋寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASHIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角田裕志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNODA, YUUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新木利治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, TOSHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的主要目的在於提供一種可形成相對介電常數低、在耐彎曲性優異的同時耐熔融性優異且顯影殘渣少的硬化膜的感放射線性組成物。本發明為一種感放射線性組成物，其含有：聚合體成分（A）、醌二疊氮化合物（B）、以及溶劑（C），所述感放射線性組成物中，所述聚合體成分（A）在同一聚合體或不同的聚合體中包含：選自由具有酸基的結構單元及源自馬來醯亞胺的結構單元所組成的群組中的至少一種結構單元（I）、含有脂環式環氧基的結構單元（II）、源自具有脂環結構的(甲基)丙烯酸酯的結構單元（III）（其中，結構單元（II）除外）、以及在主鏈具有環狀醚結構及與構成所述環狀醚結構的碳原子鍵結的亞甲基的結構單元（IV）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2263" publication-number="202632442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案描繪裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀正和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圖案描繪裝置，包括鏡罩。所述鏡罩包括：一個以上的側壁，配置於多面鏡的側面的周圍，且沿著多面鏡的周向延伸。側壁具有：流體的流入口、流體的流出口、供來自光源的光束通過的入射窗、以及供被多個反射面反射的光束通過的出射窗。出射窗的至少一部分，被光束能夠透過的透過性零件密封。流出口與出射窗位於一個以上的側壁的在周向上隔開的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:射束掃描單元</p>
        <p type="p">52:驅動單元</p>
        <p type="p">53:旋轉馬達</p>
        <p type="p">60:鏡罩</p>
        <p type="p">61:第一罩構件/罩構件</p>
        <p type="p">62:上壁/壁</p>
        <p type="p">63:側壁/壁</p>
        <p type="p">63a:彎曲部分</p>
        <p type="p">63b:第一延長部分/延長部分</p>
        <p type="p">63c:第二延長部分/延長部分</p>
        <p type="p">64:入射窗</p>
        <p type="p">64a、65a:透過性零件</p>
        <p type="p">64b、65b:凹部</p>
        <p type="p">65:出射窗</p>
        <p type="p">67:防振彈性體</p>
        <p type="p">68:第二罩構件</p>
        <p type="p">69:下壁/壁</p>
        <p type="p">B:固定件</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2264" publication-number="202632795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260415B">H01R12/72</main-classification>
        <further-classification edition="200601120260415B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本多通信工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA TSUSHIN KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志賀諒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤毅志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">連接器1具有：具絕緣性且呈筒狀的殼體2；具導電性且配置於殼體2內側之筒狀的端子3；以及具導電性且配置於殼體2外側之筒狀的外殼4。此外，殼體2具有基座26，該基座包括向內側突出的內側突出部261。此外，端子3具有筒狀的端子本體31以及從端子本體31的基端面310延伸的引線39，該端子本體31包括基部32以及位於基部32的前端側且供作為插頭之中心接觸插頭942從前端側插入的插頭插入部33。且，內側突出部261被夾持於基端面310與引線39之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector 1 contains an insulating cylindrical housing 2, a conductive cylindrical terminal 3 arranged inside the housing 2, and a conductive cylindrical shell 4 arranged outside the housing 2. Further, the housing 2 has a base 26 including an inner protruding portion 261 protruding toward an inner side. Further, the terminal 3 has a cylindrical terminal body 31 including a base portion 32 and a plug insertion portion 33 that is located on a tip side of the base portion 32 and into which a center contact plug 942 serving as a plug should be inserted from a tip side, and a lead 39 extending from a base end surface 310 of the terminal body 31. Further, the inner protruding portion 261 is sandwiched between the base end surface 310 and the lead 39.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:殼體</p>
        <p type="p">25:狹縫</p>
        <p type="p">26、26A、26B、26C:基座</p>
        <p type="p">27:保持部</p>
        <p type="p">28:貫通孔</p>
        <p type="p">31:端子本體</p>
        <p type="p">39A、39B、39C:引線</p>
        <p type="p">261:內側突出部</p>
        <p type="p">261b:第一前端部</p>
        <p type="p">261c:第二前端部</p>
        <p type="p">263:溝槽</p>
        <p type="p">310:基端面</p>
        <p type="p">392:前端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2265" publication-number="202631567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、疊層體及圖案形成方法</chinese-title>
        <english-title>RESIST COMPOSITION, LAMINATE, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C07C55/02</main-classification>
        <further-classification edition="200601120260401B">C07C55/32</further-classification>
        <further-classification edition="200601120260401B">C07C57/145</further-classification>
        <further-classification edition="200601120260401B">C07C57/30</further-classification>
        <further-classification edition="200601120260401B">C07C57/34</further-classification>
        <further-classification edition="200601120260401B">C07C63/30</further-classification>
        <further-classification edition="200601120260401B">C07D517/04</further-classification>
        <further-classification edition="200601120260401B">C08F212/14</further-classification>
        <further-classification edition="200601120260401B">C08F220/06</further-classification>
        <further-classification edition="200601120260401B">C08F220/30</further-classification>
        <further-classification edition="200601120260401B">G03F7/004</further-classification>
        <further-classification edition="200601120260401B">G03F7/038</further-classification>
        <further-classification edition="200601120260401B">G03F7/039</further-classification>
        <further-classification edition="200601120260401B">G03F7/09</further-classification>
        <further-classification edition="200601120260401B">G03F7/20</further-classification>
        <further-classification edition="200601120260401B">G03F7/32</further-classification>
        <further-classification edition="202601120260401B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影，尤其在電子束(EB)微影及EUV微影中，感度及極限解析度優良的非化學增幅阻劑組成物。  &lt;br/&gt;該課題之解決手段為一種阻劑組成物，其特徵為含有：  &lt;br/&gt;選自於下式(1)、(2)、及(3)中之至少1種超原子價碘化合物，  &lt;br/&gt;含羧基之化合物，及  &lt;br/&gt;溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="256px" width="651px" file="ed10318.JPG" alt="ed10318.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，n1為0~2，n2為0~1，n3為0~3。R&lt;sup&gt;11&lt;/sup&gt;~R&lt;sup&gt;13&lt;/sup&gt;為鹵素原子、或碳數1~10之烴基。X&lt;sup&gt;1&lt;/sup&gt;~X&lt;sup&gt;3&lt;/sup&gt;為*-O-X&lt;sup&gt;A1&lt;/sup&gt;-、或*-X&lt;sup&gt;A2&lt;/sup&gt;(-R&lt;sup&gt;14&lt;/sup&gt;)-C(=O)-。X&lt;sup&gt;A1&lt;/sup&gt;為羰基、或碳數1~10之伸烴基。X&lt;sup&gt;A2&lt;/sup&gt;為氮或硫。R&lt;sup&gt;14&lt;/sup&gt;為氫原子、鹵素原子、或碳數1~20之烴基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a resist composition including at least one kind of hypervalent iodine compounds selected from the following formulae (1), (2), and (3), a carboxy group-containing compound, and a solvent. In the formula, n1 represents 0 to 2; n2 represents 0 to 2; n3 represents 0 to 3; R&lt;sup&gt;11&lt;/sup&gt; to R&lt;sup&gt;13&lt;/sup&gt; represent a halogen atom or a hydrocarbyl group having 1 to 10 carbon atoms; X&lt;sup&gt;1&lt;/sup&gt; to X&lt;sup&gt;3&lt;/sup&gt; represent *-O-X&lt;sup&gt;A1&lt;/sup&gt;- or *-X&lt;sup&gt;A2&lt;/sup&gt;(-R&lt;sup&gt;14&lt;/sup&gt;)-C(=O)-; X&lt;sup&gt;A1&lt;/sup&gt; represents a carbonyl group or a hydrocarbylene group having 1 to 10 carbon atoms; X&lt;sup&gt;A2&lt;/sup&gt; represents nitrogen or sulfur; and R&lt;sup&gt;14&lt;/sup&gt; represents a hydrogen atom, a halogen atom, or a hydrocarbyl group having 1 to 20 carbon atoms. This can provide a non-chemically amplified resist composition that is excellent in sensitivity and a resolution limit in photolithography with a high-energy beam, in particular in electron beam (EB) lithography and EUV lithography. &lt;br/&gt;&lt;img align="absmiddle" height="145px" width="419px" file="ed10319.JPG" alt="ed10319.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2266" publication-number="202633224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型發光二極體的微透鏡及微型發光二極體晶片</chinese-title>
        <english-title>MICROLENS FOR MICRO-LED AND MICRO-LED CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10H20/855</main-classification>
        <further-classification edition="202501120260225B">H10H20/856</further-classification>
        <further-classification edition="202501120260225B">H10H20/831</further-classification>
        <further-classification edition="202501120260225B">H10H20/825</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於微型發光二極體的微透鏡，包括：間隔部，其佈置在微型發光二極體的發光檯面與透鏡部之間以調節透鏡部的焦點相對於發光檯面的位置；以及透鏡部，其佈置在間隔部上以對來自發光檯面的光進行整形，其中發光檯面朝向微透鏡的上表面的直徑為n，透鏡部的球高為an，曲率半徑為m，間隔部的高度為bn，間隔部的寬度為cn，並且透鏡部的曲率半徑為m，其中a、b、c、m、n均為正數，其中：1.2≤a≤1.6；0.2≤b≤0.3；0.9≤c≤1.3；以及1.3 μm≤m≤1.8 μm。此外，本發明還提供了一種具有這樣的微透鏡的微型發光二極體晶片。通過本發明，可以改善微透鏡的形貌，從而提高光提取效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a microlens for a micro-LED, including: a spacer portion arranged between a light-emitting mesa of the micro-LED and a lens portion to adjust the position of the focal point of the lens portion relative to the light-emitting mesa; and a lens portion arranged on the spacer portion to shape light from the light-emitting mesa, where the diameter of the upper surface of the light-emitting mesa facing the microlens is n, the spherical height of the lens portion is an, the radius of curvature is m, the height of the spacer portion is bn, the width of the spacer portion is cn, and the curvature of the lens portion is m, wherein a, b, c, m, and n are all positive numbers, wherein: 1.2 ≤ a ≤ 1.6; 0.2 ≤ b ≤ 0.3; 0.9 ≤ c ≤ 1.3; and 1.3 μm ≤ m ≤ 1.8 μm. Furthermore, the present invention provides a micro-LED chip having such a microlens. Through the present invention, the morphology of the microlenses can be improved, so that light extraction efficiency is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:微透鏡</p>
        <p type="p">101A:透鏡部</p>
        <p type="p">101B:間隔部</p>
        <p type="p">101C:連接部</p>
        <p type="p">102:發光檯面</p>
        <p type="p">102A:底部透鏡導電層</p>
        <p type="p">102B:第一磊晶層102B</p>
        <p type="p">102C:發光層</p>
        <p type="p">102D:第二磊晶層</p>
        <p type="p">102D-1:階梯部</p>
        <p type="p">102D-2:延伸部</p>
        <p type="p">103:鈍化層</p>
        <p type="p">104:反射鏡層</p>
        <p type="p">105:通孔接觸部</p>
        <p type="p">106:絕緣層</p>
        <p type="p">107:反射電極</p>
        <p type="p">o:中心</p>
        <p type="p">a,b:半軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2267" publication-number="202631779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚胺基甲酸酯水系分散體及水性塗料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08G18/32</main-classification>
        <further-classification edition="200601120260202B">C08G18/40</further-classification>
        <further-classification edition="200601120260202B">C08G18/42</further-classification>
        <further-classification edition="200601120260202B">C08G18/66</further-classification>
        <further-classification edition="200601120260202B">C08L75/00</further-classification>
        <further-classification edition="200601120260202B">C08L75/06</further-classification>
        <further-classification edition="200601120260202B">C08K5/29</further-classification>
        <further-classification edition="200601120260202B">C08J3/02</further-classification>
        <further-classification edition="200601120260202B">C09D175/06</further-classification>
        <further-classification edition="201801120260202B">C09D7/63</further-classification>
        <further-classification edition="200601120260202B">C09D5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子文弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提高塗膜對於樹脂的密接性及耐UV密接性。實施形態的聚胺基甲酸酯水系分散體是包含聚酯多元醇作為構成成分的聚胺基甲酸酯樹脂（A）分散於水系分散介質中而成，且包含含碳二亞胺基的化合物（B）與於一分子中具有兩個下述通式（1）所表示的基的化合物（C）。聚胺基甲酸酯樹脂（A）具有羧基。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或碳數1～3的烴基，R&lt;sup&gt;2&lt;/sup&gt;表示碳數1～3的烴基，*表示鍵結鍵。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="160px" width="198px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2268" publication-number="202632503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種由計算裝置執行的方法及相關的計算裝置、計算機可讀介質</chinese-title>
        <english-title>A METHOD EXECUTED BY A COMPUTING DEVICE AND RELATED COMPUTING DEVICES AND COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260202B">G06F12/08</main-classification>
        <further-classification edition="200601120260202B">G06F9/50</further-classification>
        <further-classification edition="202301120260202B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏嘉辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, SHENG-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈政昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本公開的一個方面，提供了一種方法、一種計算機可讀介質和一種裝置。該方法可以由計算裝置執行。該計算裝置接收待處理的任務。該計算裝置從該任務中提取參數和位址。該計算裝置在執行該任務的運行時階段，根據該參數從快取中檢索與該參數相對應的描述符。該計算裝置根據該描述符和該位址執行該任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The method may be executed by a computing device. The computing device receives a task to be processed. The computing device extracts an argument and an address from the task. The computing device retrieves a descriptor corresponding to the argument from a cache, based on the argument, at a runtime stage of an execution of the task. The computing device performs the task, based on the descriptor and the address.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:運行時描述符管理過程的流程示意圖</p>
        <p type="p">802,804,806,808:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2269" publication-number="202633132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10D62/13</main-classification>
        <further-classification edition="202601120260504B">H10W20/42</further-classification>
        <further-classification edition="202501120260504B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴載鏞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在俸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAEBONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢鈺博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, YUBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一積體電路裝置包括一上片分開壁；一對奈米片堆疊結構，該對奈米片堆疊結構具有在其間之該上片分開壁、安置成彼此間隔開，且各包含多個奈米片；一對閘極電極，該對閘極電極在該對奈米片堆疊結構上；源極/汲極區，該等源極/汲極區連接於該對奈米片堆疊結構中所包括之該等多個奈米片之端；一對背側通孔接點，且連接於該對源極/汲極區；一對背側佈線線路，該對背側佈線線路連接於該對背側通孔接點之端；以及一下片分開壁，該下片分開壁在該對背側通孔接點與該對背側佈線線路之間且接觸該上片分開壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device includes an upper sheet separation wall, a pair of nanosheet stack structures having the upper sheet separation wall therebetween, disposed spaced apart from each other, and each comprising a plurality of nanosheets, a pair of gate electrodes on the pair of nanosheet stack structures, source/drain regions connected to ends of the plurality of nanosheets included in the pair of nanosheet stack structures, a pair of backside via contacts and connected to the pair of source/drain regions, a pair of backside wiring lines connected to ends of the pair of backside via contacts, and a lower sheet separation wall between the pair of backside via contacts and the pair of backside wiring lines, and contacting the upper sheet separation wall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積體電路裝置</p>
        <p type="p">BCA:背側通孔接點</p>
        <p type="p">BDI:背側絕緣層</p>
        <p type="p">BDIA:第一背側絕緣層</p>
        <p type="p">BDIB:第二背側絕緣層</p>
        <p type="p">BLR:背側線凹部</p>
        <p type="p">BPL:背側佈線線路</p>
        <p type="p">BVR:背側通孔凹部</p>
        <p type="p">CA:第一接點</p>
        <p type="p">CDL3:第三絕緣層</p>
        <p type="p">D-D':線</p>
        <p type="p">FCI:前絕緣層</p>
        <p type="p">GCL:閘極罩蓋層</p>
        <p type="p">ILD:層間絕緣層</p>
        <p type="p">LSW:下片分開壁</p>
        <p type="p">SD:源極/汲極區</p>
        <p type="p">STI:裝置分開層</p>
        <p type="p">SW:片分開壁</p>
        <p type="p">TRE:溝槽</p>
        <p type="p">USW:上片分開壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2270" publication-number="202632904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有分段式變容器組和多電壓線性化的數位控制振盪器及相關設備</chinese-title>
        <english-title>DIGITALLY CONTROLLED OSCILLATOR WITH SEGMENTED VARACTOR BANK AND MULTIPLE-VOLTAGE LINEARIZATION, AND ASSOCIATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H03L7/08</main-classification>
        <further-classification edition="200601120260504B">H03B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊松諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SONG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡桓睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HUAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱威豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昂生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了數位控制振盪器(DCO)，具有分段式變容器組和多電壓線性化及相關設備。 DCO 可以包括變容器陣列，變容器陣列包含複數個變容器，定位於分段式變容器組中，並包括複數個橋接偏壓電阻，定位於分段式變容器組中，複數個電容器耦合在分段式變容器組內的多個變容器組與 DCO 的一組差分振盪節點之間，以及一個負跨導(g&lt;sub&gt;m&lt;/sub&gt;)網絡(-g&lt;sub&gt;m&lt;/sub&gt;  網絡)，耦合到該一組差分振盪節點。此外，一組變容器單元和多個剩餘變容器單元分別屬於至少一個變容器組和剩餘變容器組，配置為主動單元和凍結單元，以接收一組調整電壓和一組預定電壓，分別提供該多電壓線性化於該主動單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digitally controlled oscillator (DCO) with segmented varactor bank and multiple-voltage linearization and associated apparatus are provided. The DCO may include a varactor array, with the varactor array including a plurality of varactors positioned in the segmented varactor bank, and include a plurality of bridge biasing resistors positioned in the segmented varactor bank, a plurality of capacitors coupled between multiple varactor sets within the segmented varactor bank and a set of differential oscillation nodes of the DCO, and a negative transconductance (g&lt;sub&gt;m&lt;/sub&gt;) network (-g&lt;sub&gt;m&lt;/sub&gt; network) coupled to the set of differential oscillation nodes. Additionally, one set of varactor units and multiple remaining sets of varactor units respectively belonging to at least one varactor set and remaining varactor sets may be configured as active units and frozen units to receive a set of tune voltages and a set of predetermined voltages, respectively, for providing the multiple-voltage linearization at the active units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:數位控制振盪器(DCO)</p>
        <p type="p">100C:核心電路</p>
        <p type="p">101:分段式變容器組</p>
        <p type="p">102:變容器陣列</p>
        <p type="p">104,104A,104B:橋接偏壓電阻</p>
        <p type="p">106:電容器</p>
        <p type="p">106A,106B:交流耦合電容器</p>
        <p type="p">108:電感器</p>
        <p type="p">109:負跨導(g&lt;sub&gt;m&lt;/sub&gt;)網絡</p>
        <p type="p">110:變容器組</p>
        <p type="p">112:變容器單元</p>
        <p type="p">OSC_P:差分振盪節點(正端)</p>
        <p type="p">OSC_N:差分振盪節點(負端)</p>
        <p type="p">VB:偏壓電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2271" publication-number="202632261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101669</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測量系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260211B">G01N23/2251</main-classification>
        <further-classification edition="201801120260211B">G01N23/04</further-classification>
        <further-classification edition="202201120260211B">G06V10/58</further-classification>
        <further-classification edition="202201120260211B">G06V10/60</further-classification>
        <further-classification edition="200601120260211B">G01B15/00</further-classification>
        <further-classification edition="200601120260211B">G01B21/04</further-classification>
        <further-classification edition="201801120260211B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川元𤥨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係在提供一種技術為目的，其即使是在例如半導體剖面那樣，因材質種類而形狀不同，並且存在複數個亮度值不同的區域的構造的情況，也能夠實施適合於測量的亮度/對比調整。本發明之測量系統，作成樣品的邊界區域中的圖像的輝度直方圖，藉由對上述直方圖進行積算以作成積算直方圖，藉由以使上述積算直方圖平坦化的方式，調整上述圖像的亮度或對比中的至少一者，來對上述邊界區域進行銳化(參照圖5)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">501:觀察圖像</p>
        <p type="p">502:邊界區域</p>
        <p type="p">503:直方圖</p>
        <p type="p">504:邊界區域積算直方圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2272" publication-number="202631303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筒式刀庫系統</chinese-title>
        <english-title>CARTRIDGE TYPE TOOL MAGAZINE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">B23Q3/155</main-classification>
        <further-classification edition="200601120260401B">B23Q3/157</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡和勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種筒式刀庫系統，設置於工具機上，其包括：儲刀裝置和交換裝置。儲刀裝置包括：第一及第二儲刀區，其內部空間分別供多個刀架以序列排列的方式容置，且其第二端分別為第一及第二交換位；第一移載裝置，用以受控地引導刀架於第一及第二儲刀區的第一端處位移；以及第二移載裝置，用以受控地引導刀架自第一交換位輸送至第一儲刀區內，或自第二儲刀區內輸送至第二交換位；以及一交換裝置用以於所述第一或第二交換位對所述刀架執行取還動作，並協同所述第一、第二移載裝置，使所述刀架於所述儲刀裝置內循環位移；所述交換裝置與主軸協作以完成刀柄交換，從而構建所述筒式刀庫系統的雙循環作業系統。並通過雙儲刀區的刀架堆疊及交換裝置的滑移同步交換邏輯，實現刀架的高密度儲存與快速交換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cartridge type tool magazine system, installed on a machine tool, comprising: a tool storage device and an exchange device. The tool storage device includes: first and second tool storage areas, each with internal spaces for accommodating multiple tool holders arranged in sequence, and its second ends being first and second exchange positions, respectively; a first transfer device for controlled displacement of the tool holders at the first ends of the first and second tool storage areas; a second transfer device for controlled transport of the tool holders from the first exchange position to the first tool storage area, or from the second tool storage area to the second exchange position; and an exchange device for performing a retrieval and return action on the tool holders at the first or second exchange position, and cooperating with the first and second transfer devices to cyclically displace the tool holders within the tool storage device; the exchange device cooperates with the spindle to complete tool holder exchange, thereby constructing a dual-cycle operation system for the cartridge type tool magazine system. High-density storage and rapid exchange of tool holders are achieved through the stacking of tool holders in the dual tool storage areas and the sliding synchronous exchange logic of the exchange device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具機</p>
        <p type="p">11:機座</p>
        <p type="p">12:立柱</p>
        <p type="p">13:主軸</p>
        <p type="p">14:工作區域</p>
        <p type="p">15:工作台</p>
        <p type="p">20:儲刀裝置</p>
        <p type="p">23:第一移載裝置</p>
        <p type="p">40:第二移載裝置</p>
        <p type="p">50:交換裝置</p>
        <p type="p">70:第一端</p>
        <p type="p">80:第二端</p>
        <p type="p">100:筒式刀庫系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2273" publication-number="202633359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學標定成像系統和光學標定方法</chinese-title>
        <english-title>OPTICAL CALIBRATION IMAGING SYSTEM AND OPTICAL CALIBRATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P72/50</main-classification>
        <further-classification edition="202601120260309B">H10P74/20</further-classification>
        <further-classification edition="201701120260309B">G06T7/70</further-classification>
        <further-classification edition="200601120260309B">G02B3/00</further-classification>
        <further-classification edition="200601120260309B">G02B5/08</further-classification>
        <further-classification edition="200601120260309B">G02B27/10</further-classification>
        <further-classification edition="200601120260309B">G02B27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商天津中科晶禾電子科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SABERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麼之光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZHIGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>母鳳文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MU, FENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚向虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, XIANGHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉福超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FUCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學標定成像系統和光學標定方法。光學標定成像系統包括：第一成像單元（1）、第二成像單元（2）、誤差檢測單元（3）和控制單元（4）；誤差檢測單元（3）包括檢測光源（31）和第一光學組件（32）；檢測光源（31）設置為出射檢測光線至第一光學組件（32），第一光學組件（32）設置為將檢測光線輸送至第一成像單元（1），輸送至第二成像單元（2）中；第一成像單元（1）設置為生成第一檢測影像，第二成像單元（2）設置為生成第二檢測影像；控制單元（4）根據第一檢測影像、第二檢測影像、第一成像影像和第二成像影像確定第二樣品（52）的實際待移動量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical calibration imaging system and an optical calibration method are disclosed. The optical calibration imaging system includes: a first imaging unit (1), a second imaging unit (2), an error detection unit (3), and a control unit (4); the error detection unit (3) includes a detection light source (31) and a first optical component (32); the detection light source (31) is configured to emit detection light to the first optical component (32), and the first optical component (32) is configured to transport the detection light to the first imaging unit (1) and to the second imaging unit (2); the first imaging unit (1) is configured to generate a first detection image, and the second imaging unit (2) is configured to generate a second detection image; the control unit (4) determines the actual amount of movement of the second sample (52) based on the first detection image, the second detection image, the first imaging image, and the second imaging image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一成像單元</p>
        <p type="p">2:第二成像單元</p>
        <p type="p">3:誤差檢測單元</p>
        <p type="p">31:檢測光源</p>
        <p type="p">311:點光源</p>
        <p type="p">312:整形單元</p>
        <p type="p">32:第一光學組件</p>
        <p type="p">321:第一透鏡</p>
        <p type="p">322:第一分光鏡</p>
        <p type="p">323:第一反射鏡</p>
        <p type="p">33:第二分光鏡</p>
        <p type="p">34:第一筒鏡</p>
        <p type="p">6:第一光源</p>
        <p type="p">61:第四透鏡</p>
        <p type="p">7:第二光學組件</p>
        <p type="p">71:第二透鏡</p>
        <p type="p">72:第三分光鏡</p>
        <p type="p">73:第四分光鏡</p>
        <p type="p">8:第二光源</p>
        <p type="p">81:第五透鏡</p>
        <p type="p">82:第二筒鏡</p>
        <p type="p">9:第三光學組件</p>
        <p type="p">91:第三透鏡</p>
        <p type="p">92:第五分光鏡</p>
        <p type="p">93:第二反射鏡</p>
        <p type="p">a:檢測光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2274" publication-number="202631415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嬰幼兒載具</chinese-title>
        <english-title>CHILD CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260130B">B60N2/26</main-classification>
        <further-classification edition="200601120260130B">B60N2/28</further-classification>
        <further-classification edition="200601120260130B">B60N2/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙廣輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, GUANGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種嬰幼兒載具，包括載具本體和連接裝置。載具本體包括第一拆卸機構。連接裝置包括第二拆卸機構和連接機構。第二拆卸機構與第一拆卸機構可選擇地鎖定配合。連接機構與第二拆卸機構連接，連接機構在連接狀態和分離狀態之間可切換。其中，連接機構處於連接狀態時，連接機構適於與汽車座椅連接；連接機構處於分離狀態時，連接機構適於與汽車座椅解除連接。該嬰幼兒載具能直接與汽車座椅連接，又不會增加嬰幼兒載具被提拿時的重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a child carrier, including a carrier body and a connecting device. The carrier body includes a first detachable mechanism. The connecting device includes a second detachable mechanism and a connecting mechanism. The second detachable mechanism is selectively engaged and locked with the first detachable mechanism. The connecting mechanism is connected to the second detachable mechanism, and the connecting mechanism is switchable between a connected state and a disconnected state. When the connecting mechanism is in the connected state, the connecting mechanism is adapted to be connected to a vehicle seat; when the connecting mechanism is in the disconnected state, the connecting mechanism is adapted to be disconnected from the vehicle seat. This child carrier can be directly connected to the vehicle seat without increasing the weight of the child carrier when carried.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:載具本體</p>
        <p type="p">110:載具殼體</p>
        <p type="p">111:背靠部</p>
        <p type="p">112:腿靠部</p>
        <p type="p">113:承載空間</p>
        <p type="p">115:容納槽</p>
        <p type="p">120:提把</p>
        <p type="p">130:樞轉關節</p>
        <p type="p">140:頂篷</p>
        <p type="p">150:第一拆卸機構</p>
        <p type="p">152:固定座</p>
        <p type="p">1523:插設孔</p>
        <p type="p">153:第一操作件</p>
        <p type="p">200:連接裝置</p>
        <p type="p">210:第二拆卸機構</p>
        <p type="p">214:副安裝環</p>
        <p type="p">220:杆件</p>
        <p type="p">230:連接機構</p>
        <p type="p">236:第二操作件</p>
        <p type="p">2362:遮擋部</p>
        <p type="p">2363:操作部</p>
        <p type="p">239:第二殼體</p>
        <p type="p">2393:卡合槽</p>
        <p type="p">B:後</p>
        <p type="p">D:下</p>
        <p type="p">F:前</p>
        <p type="p">L:左</p>
        <p type="p">R:右</p>
        <p type="p">U:上</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2275" publication-number="202632329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生偏振光的光學裝置</chinese-title>
        <english-title>OPTICAL DEVICE FOR PRODUCING POLARIZED LIGHT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G02B5/30</main-classification>
        <further-classification edition="200601120260504B">G02B27/01</further-classification>
        <further-classification edition="200601120260504B">G02B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾林　埃拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARLIN, ELAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切里基　羅寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRIKI, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅寧　埃坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RONEN, EITAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多坦　利奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOTAN, LIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種近眼顯示系統，包括：光源，其被配置成發射構成準直圖像的非偏振光；光導光學元件，其被配置成擴展被注入其中的準直圖像的光學孔徑；以及光學裝置，其用於在準直圖像被光導光學元件擴展之前接收準直圖像，並且提高準直圖像的偏振度。光學裝置包括基本上透明的基板和多個光學偏振元件，其限定在基板的輸入介面與輸出介面之間通過基板的偏振相關光學多路徑。多路徑包括旋轉光路和非旋轉光路，旋轉光路被配置成傳輸輸入光的第一偏振分量並引起第一偏振分量的偏振的淨旋轉，非旋轉光路被配置成傳輸輸入光的偏振與第一偏振分量的偏振相反的第二偏振分量，而不引起第二偏振分量的偏振的淨旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A near-eye display system is provided, comprising a light source configured to emit unpolarized light constituting a collimated image; a lightguide optical element configured to expand the optical aperture of a collimated image injected therein; and an optical device for receiving the collimated image prior to expansion by the lightguide optical element, and for increasing its polarity. The optical device comprises a substantially transparent substrate and a plurality of optical polarization elements, defining a polarization dependent optical multipath through the substrate between input and output interfaces thereof. The multipath comprises a rotating optical path configured to transmit and to cause a net rotation of the polarization of a first polarized component of input light, and a non-rotating optical path configured to transmit a second polarized component of the input light, having a polarization opposite that of the first polarized component, without causing a net rotation of its polarization.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學裝置</p>
        <p type="p">12:基板</p>
        <p type="p">14:輸入介面</p>
        <p type="p">16:輸出介面</p>
        <p type="p">18a:上外表面</p>
        <p type="p">18b:下外表面</p>
        <p type="p">20:偏振分束器</p>
        <p type="p">20&lt;sub&gt;out&lt;/sub&gt;:出射表面</p>
        <p type="p">22:半波片</p>
        <p type="p">24:鏡</p>
        <p type="p">26:低折射率黏合劑(低RI黏合劑)</p>
        <p type="p">28:偏振旋轉單元</p>
        <p type="p">30a、30b:內表面</p>
        <p type="p">C&lt;sub&gt;&lt;i&gt;in&lt;/i&gt;&lt;/sub&gt;:輸入光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2276" publication-number="202632862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相變換器</chinese-title>
        <english-title>MULTI-PHASE CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">H02M3/04</main-classification>
        <further-classification edition="200601120260504B">H01F27/28</further-classification>
        <further-classification edition="200601120260504B">H02M3/335</further-classification>
        <further-classification edition="200601120260504B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰商泰達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索蘭基　吉滕德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLANKI, JITENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案關於一種多相變換器，包括：變壓器裝置，其包括初級側和次級側，初級側具有初級繞組，次級側具有次級繞組；初級側電路，與初級繞組連接，且包含多個初級開關支路；以及次級側電路，與次級繞組連接；次級側電路包括多個整流支路和輸出電容支路，每一整流支路具有多個整流元件，輸出電容支路具有多個輸出電容，次級繞組以星形接法連接，且次級繞組的星點與多個輸出電容的中點連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application discloses a multi-phase converter, comprising: a transformer device with a primary side with a primary winding and a secondary side with a secondary winding; a primary side circuit connected to the primary winding; and a secondary side circuit connected to the secondary winding; wherein the secondary side circuit comprises a plurality of rectification legs with rectification elements and an output capacitor leg with a plurality of output capacitors, the secondary winding is connected in star configuration, and a star-point of the secondary winding is connected to a middle-point of the plurality of output capacitors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多相變換器</p>
        <p type="p">2:變壓器裝置</p>
        <p type="p">6:次級繞組</p>
        <p type="p">7:初級側電路</p>
        <p type="p">8:次級側電路</p>
        <p type="p">11:輸出電容支路</p>
        <p type="p">12:輸出電容</p>
        <p type="p">13:星點</p>
        <p type="p">14:中點</p>
        <p type="p">30:開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2277" publication-number="202632101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>餵絲裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260227B">D02G1/02</main-classification>
        <further-classification edition="200601120260227B">D02G1/04</further-classification>
        <further-classification edition="200601120260227B">D01H1/40</further-classification>
        <further-classification edition="200601120260227B">D01H13/00</further-classification>
        <further-classification edition="200601120260227B">B65H51/00</further-classification>
        <further-classification edition="200601120260227B">B65H57/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤將</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川重樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近田秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIKADA, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種餵絲裝置，不損害將從動輥以適當的接觸壓力按壓於驅動輥之功能、以及在掛絲時或維護時切換臂的姿勢之功能，而抑制絲線行進時從動輥的振動。支撐從動輥(12)之從動輥支撐機構部(20)具有：臂(30)；支撐體(50)，其將臂(30)支撐為可轉動；桿(70)，其切換臂(30)的姿勢；施力構件(80)，其對臂(30)施力，並且伴隨著將臂(30)的姿勢從分離姿勢(PB3)切換為接觸姿勢(PA1)而將姿勢從解除姿勢(PY3)切換為按壓姿勢(PX1)；以及防振構件(90)，其具有接觸部(95)。在將臂(30)切換為接觸姿勢(PA1)之狀態下，被切換為按壓姿勢(PX1)之施力構件(80)將防振構件(90)的接觸部(95)按壓於臂(30)的被接觸部(35)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:驅動輥</p>
        <p type="p">12:從動輥</p>
        <p type="p">17:從動軸</p>
        <p type="p">20:從動輥支撐機構部</p>
        <p type="p">30:臂</p>
        <p type="p">31:從動軸插入部</p>
        <p type="p">32:臂軸</p>
        <p type="p">34:收納部</p>
        <p type="p">35:前表面(被接觸部)</p>
        <p type="p">36:後表面</p>
        <p type="p">37:上表面</p>
        <p type="p">38:側表面</p>
        <p type="p">40:貫穿部</p>
        <p type="p">50:支撐體</p>
        <p type="p">51:支撐主體</p>
        <p type="p">52:第一支撐側部</p>
        <p type="p">56:第一前端支撐部</p>
        <p type="p">57:第二前端支撐部</p>
        <p type="p">58:固定螺栓</p>
        <p type="p">59:貫穿孔</p>
        <p type="p">70:桿</p>
        <p type="p">71:操作部</p>
        <p type="p">74:桿軸</p>
        <p type="p">75:卡止軸</p>
        <p type="p">80:施力構件</p>
        <p type="p">81:鉤部</p>
        <p type="p">83:轉動軸</p>
        <p type="p">90:防振構件</p>
        <p type="p">91:防振主體</p>
        <p type="p">92:轉動支撐部</p>
        <p type="p">93:引導部</p>
        <p type="p">95:接觸部</p>
        <p type="p">96:被按壓部</p>
        <p type="p">97:限制部</p>
        <p type="p">701:左桿構件</p>
        <p type="p">703:連結部</p>
        <p type="p">921:狹縫部</p>
        <p type="p">B、D、F、L、R、U:箭頭</p>
        <p type="p">PA1:接觸姿勢</p>
        <p type="p">PC1:第一操作姿勢</p>
        <p type="p">PX1:按壓姿勢</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2278" publication-number="202633420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101776</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用體積膨脹的大面積間隙填充</chinese-title>
        <english-title>LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260425B">H10W10/17</main-classification>
        <further-classification edition="202601120260425B">H10P95/90</further-classification>
        <further-classification edition="202601120260425B">H10P14/24</further-classification>
        <further-classification edition="202601120260425B">H10P14/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈許　蘇里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHOSH, SUPRIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈羅伊　蘇密特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGHA ROY, SUSMIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLICK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體處理的示例性方法可包括向半導體處理腔室的處理區域提供含矽前驅物。基板可設置在半導體處理腔室的處理區域內。基板可沿基板界定一或多個特徵。方法可包括在基板上沉積含矽材料。含矽材料可在沿著基板的一或多個特徵內延伸。方法可包括提供含氧前驅物。方法可包括以含氧前驅物對含矽材料退火。退火可導致含矽材料在一或多個特徵內膨脹。方法可包括重複一或多個操作以迭代地填充基板上的一或多個特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary methods of semiconductor processing may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The substrate may define one or more features along the substrate. The methods may include depositing a silicon-containing material on the substrate. The silicon-containing material may extend within the one or more features along the substrate. The methods may include providing an oxygen-containing precursor. The methods may include annealing the silicon-containing material with the oxygen-containing precursor. The annealing may cause the silicon-containing material to expand within the one or more features. The methods may include repeating one or more of the operations to iteratively fill the one or more features on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:處理方法</p>
        <p type="p">205:操作</p>
        <p type="p">210:操作</p>
        <p type="p">215:操作</p>
        <p type="p">220:操作</p>
        <p type="p">225:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2279" publication-number="202633123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101784</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括電晶體結構及分離結構之半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING TRANSISTOR STRUCTURE AND SEPARATION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260331B">H10D30/60</main-classification>
        <further-classification edition="202501120260331B">H10D62/10</further-classification>
        <further-classification edition="202501120260331B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴雨錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WOOSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔宇現</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, WOOHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍煕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋慧原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HYEWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴奎南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具齊亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, JEHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括一分離結構及在該分離結構之一側表面上之一電晶體結構。該電晶體結構包括：一第一源極/汲極區；一第二源極/汲極區，其與該第一源極/汲極區間隔開；通道層，其連接於該第一源極/汲極區及該第二源極/汲極區，該等通道層在一第一方向上間隔開；一閘極電極，其覆蓋該等通道層中之每一者；一閘極介電結構，其在該第一源極/汲極區及該第二源極/汲極區與該閘極電極之間、在該等通道層與該閘極電極之間以及在該分離結構與該閘極電極之間；以及一第一絕緣間隔體及一第二絕緣間隔體，其彼此間隔開、鄰近於該分離結構且在該第一源極/汲極區與該第二源極/汲極區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a separation structure and a transistor structure on a side surface of the separation structure. The transistor structure includes a first source/drain region, a second source/drain region spaced apart from the first source/drain region, channel layers connected to the first source/drain region and the second source/drain region, the channel layers being spaced apart in a first direction, a gate electrode covering each of the channel layers, a gate dielectric structure between the first source/drain region and the second source/drain region and the gate electrode, between the channel layers and the gate electrode, and between the separation structure and the gate electrode, and a first insulating spacer and a second insulating spacer spaced apart from each other, adjacent to the separation structure, and between the first source/drain region and the second source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">39:第一間隔體材料層、間隔體材料層</p>
        <p type="p">42a:閘極間隔體</p>
        <p type="p">45:絕緣間隔體</p>
        <p type="p">45a:第一絕緣間隔體</p>
        <p type="p">45b:第二絕緣間隔體</p>
        <p type="p">51:分離結構</p>
        <p type="p">51a:第一分離區</p>
        <p type="p">51b:第二分離區</p>
        <p type="p">54:源極/汲極區</p>
        <p type="p">54a:第一源極/汲極區</p>
        <p type="p">54b:第二源極/汲極區</p>
        <p type="p">60:蝕刻停止層</p>
        <p type="p">72:絕緣圖案</p>
        <p type="p">72b:第二部分</p>
        <p type="p">75:第一閘極介電層</p>
        <p type="p">75b:第二介電部分</p>
        <p type="p">77:第二閘極介電層</p>
        <p type="p">81:閘極電極</p>
        <p type="p">81M1:中間電極部分、第一中間電極部分</p>
        <p type="p">A1:區</p>
        <p type="p">T1:電晶體結構、第一電晶體結構</p>
        <p type="p">T2:電晶體結構、第二電晶體結構</p>
        <p type="p">X:第一水平方向、方向</p>
        <p type="p">Y:第二水平方向、方向</p>
        <p type="p">Z:垂直方向、方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2280" publication-number="202631990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種通用型ＤＣ及其製備方法與應用</chinese-title>
        <english-title>UNIVERSAL DENDRITIC CELL AND PREPARATION METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260305B">C12N5/0784</main-classification>
        <further-classification edition="201001120260305B">C12N5/0783</further-classification>
        <further-classification edition="200601120260305B">C12N5/10</further-classification>
        <further-classification edition="200601120260305B">C12N15/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京惠大細胞科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING DCT CELL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　光啟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN,GUANGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　漢江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU,HANJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　小珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI,XIAOZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　莎莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI,SHASHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種通用型DC及其製備方法與應用，屬於免疫細胞技術領域。該通用型DC是通過敲除原始DC中&lt;i&gt;HLA-I&lt;/i&gt;類基因獲得的不表達HLA-I類分子的通用型DC。在其應用時，可以根據擬獲得的目標抗原特異性T細胞的HLA-I類分子分型，通過基因編輯、病毒或mRNA技術在通用型DC中重新表達與目標抗原特異性T細胞匹配的HLA-I類分子，從而克服異體來源DC在應用時存在的HLA-I類分子細胞特異性匹配的限制，解決單一DC HLA-I類分子分型覆蓋不足的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a universal dendritic cell (DC) and a preparation method and application thereof, belonging to the technical field of immune cells. The universal DC is a universal DC that does not express HLA-I class molecules, obtained by knocking out HLA-I class genes in a starting DC. In its application, according to an HLA-I class molecule subtype of a target antigen-specific T cell to be obtained, HLA-I class molecules that match the target antigen-specific T cells can be re-expressed in the universal DC through gene editing, viral, or mRNA techniques, thereby overcoming the HLA-I class molecule-specific matching restriction that exists when using allogeneic DCs, and solving the problem of insufficient HLA-I class molecule subtype coverage of a single DC.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2281" publication-number="202631070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備及其控制方法、介質及系統</chinese-title>
        <english-title>CLEANING DEVICE AND CONTROL METHOD, MEDIUM, AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L11/34</main-classification>
        <further-classification edition="200601120260123B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊嘉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIAPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王礪鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔設備及其控制方法、介質及系統。所述清潔設備包括控制器，控制器配置為：在蒸汽模式下，如果加熱器溫度落入第一溫度區間，則控制加熱器液體泵按照第一流量向加熱器供應液體；如果加熱器溫度落入第二溫度區間，則控制加熱器液體泵按照大於第一流量的第二流量向加熱器供應液體，第二溫度區間的最小溫度大於第一溫度區間的最大溫度；和/或如果加熱器溫度落入第三溫度區間，則控制加熱器按照第一功率運行；如果加熱器溫度落入第四溫度區間，則控制加熱器按照小於第一功率的第二功率運行，第四溫度區間的最小溫度大於第三溫度區間的最大溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning device and a control method, medium, and system thereof. The cleaning device includes a controller configured to: in a steam mode, if a heater temperature falls within a first temperature range, control a heater liquid pump to supply liquid to the heater at a first flow rate; if the heater temperature falls within a second temperature range, control the heater liquid pump to supply liquid to the heater at a second flow rate greater than the first flow rate, wherein a minimum temperature of the second temperature range is greater than a maximum temperature of the first temperature range; and/or if the heater temperature falls within a third temperature range, control the heater to operate at a first power; if the heater temperature falls within a fourth temperature range, control the heater to operate at a second power less than the first power, wherein a minimum temperature of the fourth temperature range is greater than a maximum temperature of the third temperature range. The technical solution provided in this application can ensure the reliability of the cleaning device in executing cleaning tasks in the steam mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">300:控制器</p>
        <p type="p">102:液體檢測裝置</p>
        <p type="p">107:加熱器液體泵</p>
        <p type="p">109:加熱器</p>
        <p type="p">113:液體泵</p>
        <p type="p">116:清潔件</p>
        <p type="p">117:溫度檢測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2282" publication-number="202631283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於為積層製造腔室供應惰性氣體的方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR SUPPLYING INERT GAS FOR AN ADDITIVE MANUFACTURING CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">B22F3/105</main-classification>
        <further-classification edition="201501120260401B">B33Y10/00</further-classification>
        <further-classification edition="201501120260401B">B33Y30/00</further-classification>
        <further-classification edition="201501120260401B">B33Y50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商氣體產品及化學品股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIR PRODUCTS AND CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞古　馬克摩斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKUH, MAXIMUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫斯　寶蓮娜威洛妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUS, PAULINA WERONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普萊夏　蓋多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLICHT, GUIDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於感測一積層製造系統的一腔室中的氧濃度並提供額外惰性氣體的補充系統。補充系統可獨立於一OEM/主系統控制，且較佳地能夠準確地感測低至100 ppm的氧濃度。補充系統可使用一取樣電路、一取樣泵、及腔室外部的一氧感測器以量測氧濃度。用於補充系統中的取樣電路及惰性氣體的管道可使用腔室中的現有開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A supplemental system for sensing oxygen concentration in a chamber of an additive manufacturing system and providing additional inerting gas. The supplemental system may be independently controlled from an OEM/primary system and is preferably capable of accurately sensing oxygen concentrations as low as 100ppm. The supplemental system may use a sampling circuit, a sampling pump, and an oxygen sensor external to the chamber to measure oxygen concentration. Conduits for the sampling circuit and inerting gas in the supplemental system may use existing openings in the chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:改進的積層製造系統</p>
        <p type="p">210:腔室</p>
        <p type="p">212:粉末熔融系統</p>
        <p type="p">214:粉末熔融床</p>
        <p type="p">216:構建平台</p>
        <p type="p">218:雷射器</p>
        <p type="p">220:製造物體</p>
        <p type="p">222:粉末原料床</p>
        <p type="p">224:粉末輥</p>
        <p type="p">226:粉末遞送活塞</p>
        <p type="p">228:控制器</p>
        <p type="p">232:氧感測器</p>
        <p type="p">236:惰性氣體源</p>
        <p type="p">238:管道</p>
        <p type="p">240:出口管道</p>
        <p type="p">242:槽</p>
        <p type="p">244:惰性氣體淨化子系統</p>
        <p type="p">248:補充惰性氣體凈化子系統</p>
        <p type="p">250:補充控制器</p>
        <p type="p">252:惰性氣體源</p>
        <p type="p">254:流量控制器</p>
        <p type="p">256:管道</p>
        <p type="p">260:氧感測器</p>
        <p type="p">264:取樣管道</p>
        <p type="p">266:取樣泵</p>
        <p type="p">268:取樣電路</p>
        <p type="p">272:取樣出口</p>
        <p type="p">274:取樣入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2283" publication-number="202631033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鞋底及鞋履</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A43B13/14</main-classification>
        <further-classification edition="202201120260429B">A43B7/1455</further-classification>
        <further-classification edition="202201120260429B">A43B7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOH, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOH, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種鞋底及鞋履，其具有使以腳底之腳趾附近的區域為中心將腳尖下壓的動作易於進行的結構。一種鞋底，其係鞋子會具備的鞋底，所述鞋底於朝地面之觸地面上且對應穿戴鞋子的腳之腳趾之根部附近的區域具備凹部，其中凹部使彎曲易於往接觸地面之方向進行。藉由鞋底所具有之良佳為切口之凹部，可以腳尖抓持鞋底。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鞋底(鞋履)</p>
        <p type="p">2:凹部(切口)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2284" publication-number="202632954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視頻編解碼方法與相關裝置</chinese-title>
        <english-title>METHODS AND APPARATUS OF VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260310B">H04N19/50</main-classification>
        <further-classification edition="201401120260310B">H04N19/513</further-classification>
        <further-classification edition="201401120260310B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃毓文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種使用細化邊界預測的視頻編解碼方法和裝置，適用於幀內/幀間編解碼塊。根據該方法，接收包含當前塊和相鄰塊的輸入資料。在應用預測融合或預測混合到當前塊之前，導出或繼承重疊塊邊界處理的參數。使用導出或繼承的參數，將重疊塊邊界處理應用到一個或多個重疊區域，其中所述應用重疊塊邊界處理是在應用預測融合或預測混合到當前塊和/或相鄰塊之前或之後執行的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus of video coding using refined boundary prediction for intra/inter coded blocks are disclosed. According to this method, input data comprising a current block and a neighbouring block is received. Parameters for overlapped block boundary process are derived or inherited prior to prediction fusion or prediction blending is applied to the current block. The overlapped block boundary process is applied to one or more overlapped areas using the parameters derived or inherited, wherein said applying the overlapped block boundary process is performed before or after applying the prediction fusion or the prediction blending to the current block and/or the neighbouring block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1710-1730:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2285" publication-number="202632922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260401B">H04L1/1607</main-classification>
        <further-classification edition="201801120260401B">H04W76/10</further-classification>
        <further-classification edition="200901120260401B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宇宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淦明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通信方法及裝置，涉及通信技術領域，能夠實現不同通信場景下的統一的ICF的設計。該方法包括：第一設備生成緩衝區狀態報告輪詢BSRP觸發幀，向第二設備發送BSRP觸發幀。其中，BSRP觸發幀包括第一欄位，第一欄位用於指示BSRP觸發幀的功能，或者，第一欄位用於指示BSRP觸發幀的應答幀的類型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication method and apparatus are disclosed, relating to the field of communications technologies, and capable of implementing a unified ICF design for different communication scenarios. The method includes: a first device generating a buffer status report polling BSRP trigger frame and sending the BSRP trigger frame to a second device. The BSRP trigger frame includes a first field, where the first field is used to indicate a function of the BSRP trigger frame, or the first field is used to indicate a type of an acknowledgment frame of the BSRP trigger frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301、302、303:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2286" publication-number="202631043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種桌架和可調節的折疊式露營桌</chinese-title>
        <english-title>A TABLE STAND AND ADJUSTABLE FOLDING CAMPING TABLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">A47B3/02</main-classification>
        <further-classification edition="200601120260331B">A47B3/10</further-classification>
        <further-classification edition="200601120260331B">A47B3/12</further-classification>
        <further-classification edition="200601120260331B">A47B13/08</further-classification>
        <further-classification edition="200601120260331B">A47B91/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商塔納庫洛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAQRO. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長妻正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATSUMA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種可調節的折疊式露營桌，屬於戶外用品領域。一種可調節的折疊式露營桌，包括兩個桌板架、四個桌腳架和兩個轉接頭；桌板架均包括沿橫向延伸的直桿、從該直桿的橫向兩端分別彎折延伸的兩個彎桿；轉接頭位於兩個桌板架之間，每個轉接頭的一端各可拆連接有兩個桌腳架，而每個轉接頭另一端均同時可拆連接兩個桌板架同側的彎桿；彎桿均插入在轉接頭內，並與轉接頭自轉連接；與同一轉接頭相連的兩個彎桿；它可以實現折疊收納且桌板高度、面積可調的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">M1:第一距離</p>
        <p type="p">100:裝式露營桌</p>
        <p type="p">1:桌架</p>
        <p type="p">2:桌板</p>
        <p type="p">4:板架</p>
        <p type="p">431:桌板定位銷丙</p>
        <p type="p">432:桌板定位銷乙</p>
        <p type="p">433:桌板定位銷甲</p>
        <p type="p">5:腳架</p>
        <p type="p">55:掛鈎</p>
        <p type="p">6:轉接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2287" publication-number="202631121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>UGONIN化合物於製備治療關節相關疾病之組成物的用途</chinese-title>
        <english-title>USE OF UGONIN COMPOUND IN MANUFACTURING COMPOSITION FOR TREATING JOINT-RELATED DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/352</main-classification>
        <further-classification edition="200601120260504B">A61P19/00</further-classification>
        <further-classification edition="200601120260504B">A61P19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAW, CHIH-CHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯智昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種Ugonin化合物用於治療關節相關疾病的用途，其係透過促進軟骨再生；更具體者，該軟骨再生是由於該Ugonin化合物可以促進聚集蛋白聚糖及第二型膠原蛋白之增加，並且是透過抑制miR-3074-5p及活化MAPK訊息傳遞路徑來達成者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a use of a Ugonin compound for treating joint-related diseases through chondrogenesis; specifically, the Ugonin compound induces a suppression of miR-3074-5P and an activation of MAPK signal pathway, thereby promotes the chondrogenesis by increasing the production of an aggrecan and a type II collagen.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2288" publication-number="202631728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>著色硬化性樹脂組成物、彩色濾光片、及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">C08F2/50</main-classification>
        <further-classification edition="200601120260424B">G02B5/23</further-classification>
        <further-classification edition="200601120260424B">G03F7/028</further-classification>
        <further-classification edition="200601120260424B">C09B67/22</further-classification>
        <further-classification edition="200601120260424B">C08K3/36</further-classification>
        <further-classification edition="200601120260424B">C08K7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹花祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEHANA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻田和寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGITA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種於含有二氧化矽粒子的著色硬化性樹脂組成物中能夠形成具有充分高的霧度的硬化物，並且難以產生二氧化矽粒子的沈降的著色硬化性樹脂組成物。本發明提供一種含有著色劑、樹脂、聚合性化合物、聚合起始劑及二氧化矽粒子的著色硬化性樹脂組成物。於將二氧化矽粒子的平均粒徑設為X（nm）、將以著色硬化性樹脂組成物的固體成分的總量為基準時的二氧化矽粒子的含量設為Y（質量%）時，X及Y滿足式（1）及式（2）的條件。  &lt;br/&gt;&lt;br/&gt;25≦X≦600 （1）  &lt;br/&gt;-0.019X+12.9≦Y≦-0.075X+58.8 （2）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2289" publication-number="202633009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路器件及背板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260313B">H05B45/30</main-classification>
        <further-classification edition="201601120260313B">G09G3/32</further-classification>
        <further-classification edition="202001120260313B">H05B45/325</further-classification>
        <further-classification edition="202001120260313B">H05B45/33</further-classification>
        <further-classification edition="202001120260313B">H05B45/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商京東方科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张定昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DINGCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冯煊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓承佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘立伟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玄明花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUAN, MINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘冬妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONGNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齐琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電路器件及背板。電路器件（31）用於向N個元件提供驅動信號，包括：絕緣基底（100）、設置在絕緣基底（100）上的電路層和連接墊層。電路層包括：N個驅動子電路（11）以及M個級聯的第一控制電路（12）；所述N個驅動子電路與所述M個級聯的第一控制電路連接；所述N個驅動子電路在絕緣基底上的正投影位於所述M個級聯的第一控制電路在絕緣基底上的正投影的至少一側。連接墊層位於電路層遠離絕緣基底的一側，且連接墊層的遠離絕緣基底的表面至少部分裸露。連接墊層包括：P個連接墊，所述P個連接墊與所述N個驅動子電路和所述M個級聯的第一控制電路分別連接；其中，P＞N+N/M+2，M＜N，P、N和M均為大於1的正整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:絕緣基底</p>
        <p type="p">11:驅動子電路</p>
        <p type="p">12:第一控制電路</p>
        <p type="p">13:第二控制電路</p>
        <p type="p">31:電路器件</p>
        <p type="p">AN1,AN2,AN3,AN4,AN5,AN6,AN7,AN8,AN9,AN10,AN11,AN12:陽極連接端</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">DL1:第一數據信號端</p>
        <p type="p">DL2:第二數據信號端</p>
        <p type="p">ECK:第三時鐘信號端</p>
        <p type="p">EIN:第二輸入端</p>
        <p type="p">EOUT:第二輸出端</p>
        <p type="p">GCB:第二時鐘信號端</p>
        <p type="p">GCK:第一時鐘信號端</p>
        <p type="p">GIN:第一輸入端</p>
        <p type="p">GOUT:第一輸出端</p>
        <p type="p">INIT:初始信號端</p>
        <p type="p">VDD:第一電源端</p>
        <p type="p">VGL:第四電源端</p>
        <p type="p">VGH:第三電源端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2290" publication-number="202633235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一電路器件、第二電路器件及裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260311B">H10H29/39</main-classification>
        <further-classification edition="202501120260311B">H10H29/30</further-classification>
        <further-classification edition="201601120260311B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商京東方科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张定昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DINGCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玄明花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUAN, MINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冯煊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓承佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘立伟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種第一電路器件、第二電路器件及裝置。第一電路器件（31）用於向N個元件提供驅動信號。第一電路器件（31）包括：第一絕緣基底、設置在第一絕緣基底上的第一電路層和第一連接墊層。第一電路層包括：以B×A陣列方式排布的N個驅動子電路（11），N=A×B，A和B均為大於0的正整數。第一連接墊層位於第一電路層遠離第一絕緣基底的一側，且第一連接墊層的遠離第一絕緣基底的表面至少部分裸露，第一連接墊層包括：P個連接墊，所述P個連接墊與所述N個驅動子電路（11）連接，N和P均為大於0的正整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:驅動子電路</p>
        <p type="p">31:第一電路器件</p>
        <p type="p">AN:陽極連接端</p>
        <p type="p">DL:數據端</p>
        <p type="p">EM:發光控制端</p>
        <p type="p">GL:掃描端</p>
        <p type="p">INIT:初始信號端</p>
        <p type="p">RST:複位控制端</p>
        <p type="p">VDD:第一電源端</p>
        <p type="p">X1:行方向</p>
        <p type="p">Y1:列方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2291" publication-number="202633225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提高光提取效率的微型發光二極體結構</chinese-title>
        <english-title>MICRO-LED STRUCTURE FOR IMPROVING LIGHT EXTRACTION EFFICIENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">H10H20/856</main-classification>
        <further-classification edition="202501120260312B">H10H20/855</further-classification>
        <further-classification edition="202501120260312B">H10H20/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方安樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, ANLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　偉新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, WEISIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪成根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENGGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種微型發光二極體結構，包括：下電極層；ODR全反射結構，位於下電極層上；半導體發光台面，位於所述ODR全反射結構上，發出光線；上電極層，與半導體發光台面頂部接觸。該微型發光二極體通過增加微型發光二極體結構的側壁出光面積來提高光線離開發光台面的機率，進而提高LED晶片的出光效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a micro-LED structure, including: a lower electrode layer; an ODR total reflection structure located on the lower electrode layer; a semiconductor light-emitting mesa located on the ODR total reflection structure, emitting light; and an upper electrode layer in contact with the top of the semiconductor light-emitting mesa. The micro-LED increases the probability of light leaving the light-emitting mesa by increasing the sidewall light emission area of the micro-LED structure, thereby improving the light emission efficiency of the LED chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:像素驅動背板</p>
        <p type="p">111:接觸墊</p>
        <p type="p">120:下電極層</p>
        <p type="p">130:導電層</p>
        <p type="p">140:發光台面</p>
        <p type="p">141:第一類型磊晶層</p>
        <p type="p">142:發光層</p>
        <p type="p">143:第二類型磊晶層</p>
        <p type="p">150:上電極層</p>
        <p type="p">160:鈍化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2292" publication-number="202633003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101998</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傳輸具有高優先級流量的物理層協議數據單元的方法及相關無線通信裝置</chinese-title>
        <english-title>METHOD FOR TRANSMITTING PHYSICAL LAYER PROTOCOL DATA UNIT WITH HIGH-PRIORITY TRAFFIC AND ASSOCIATED WIRELESS COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260311B">H04W72/56</main-classification>
        <further-classification edition="202401120260311B">H04W74/08</further-classification>
        <further-classification edition="202401120260311B">H04W74/0816</further-classification>
        <further-classification edition="200901120260311B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬家順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHIA-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方　永剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YONGGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　立翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易　志熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEE, JAMES CHIH-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由無線通信裝置通過信道進行通信的方法包括：響應於預期要傳輸具有高優先級流量的物理層協議資料單元（PPDU），執行第一類型退避程序，以檢測該信道是否處於空閒狀態並確定是否達到第一連續信道空閒時間；以及，響應於檢測到該信道處於空閒狀態且確定出達到該第一連續信道空閒時間，啟動幀交換序列的傳輸；其中，該第一連續信道空閒時間是點協調功能幀間間隔（PIFS）和第一隨機數與時隙時間的乘積的總和，且該第一隨機數被設置為從零到專用於該高優先級流量的第一爭用窗口的範圍中選擇的整數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for performing communications via a channel by a wireless communication device includes: in response to a physical layer protocol data unit (PPDU) with high-priority traffic being expected to be transmitted, performing a first type of backoff procedure to detect whether the channel is in an idle state and determine whether a first continuous channel idle time is reached; and in response to detecting the channel is in that idle state and determining the first continuous channel idle time is reached, initiating a transmission of a frame exchange sequence; wherein the first continuous channel idle time is a sum of a Point Coordination Function Interframe Space (PIFS) and a product of a first random number and a slot time, and the first random number is set to an integer value chosen from a range of zero to a first contention window dedicated to the high-priority traffic.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S400,S402:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2293" publication-number="202632278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型顯微鏡的透鏡總成</chinese-title>
        <english-title>A LENS ASSEMBLY FOR A MINIATURE MICROSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260504B">G01Q20/02</main-classification>
        <further-classification edition="201001120260504B">G01Q10/00</further-classification>
        <further-classification edition="201001120260504B">G01Q60/00</further-classification>
        <further-classification edition="200601120260504B">G02B21/02</further-classification>
        <further-classification edition="200601120260504B">G02B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商近場儀器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEARFIELD INSTRUMENTS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮斯庫諾夫　塔拉斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PISKUNOV, TARAS SERGEIEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一微型顯微鏡的一透鏡總成，其包含：一第一透鏡群組，其用於擷取自位於一物件平面處之一物件發射或反射的光；以及一第二透鏡群組，其用於聚焦透過該第一透鏡群組接收之光且用於在影像平面上形成該物件之一影像。該第一透鏡群組及該第二透鏡群組分別包含至少三個非球面透鏡之一第一序列及一第二序列。該影像平面位於距該物件平面等於或小於50 mm之一距離&lt;i&gt;d&lt;/i&gt;&lt;i&gt;&lt;sub&gt;總&lt;/sub&gt;&lt;/i&gt;處，且該第一群組及該第二群組之該等非球面透鏡經組配以用於在該影像平面上形成該物件之一放大影像，且其中4≤M≤10，其中M為該透鏡總成之一放大因數M。本發明進一步關於一種微型顯微鏡及一種包含此類微型顯微鏡之掃描探針顯微術系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a lens assembly for a miniature microscope, comprising a first group of lenses for capturing light emitted or reflected from an object located at an object plane and a second group of lenses for focusing light received through the first group of lenses and for forming an image of the object on the image plane. The first and second group of lenses comprise respectively a first and a second sequence of at least three aspheric lenses. The image plane is located at a distance &lt;i&gt;d&lt;sub&gt;total&lt;/sub&gt;&lt;/i&gt; equal or smaller than 50 mm from the object plane and the aspheric lenses of the first and second group are configured for forming a magnified image of the object on the image plane, and wherein 4 ≤ M ≤ 10, with M being a magnification factor M of the lens assembly. The invention further relates to a miniature microscope and a scanning probe microscopy system comprising such a miniature microscope.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:透鏡總成</p>
        <p type="p">52:物件平面</p>
        <p type="p">53:影像平面</p>
        <p type="p">54a,58a:透鏡，非球面透鏡，第一透鏡</p>
        <p type="p">54b,58b:透鏡，非球面透鏡，第二透鏡</p>
        <p type="p">54c,58c:透鏡，非球面透鏡，第三透鏡</p>
        <p type="p">60:光束分光器</p>
        <p type="p">d&lt;sub&gt;總&lt;/sub&gt;:總距離，距離</p>
        <p type="p">F1,F2,F3,F4,F5,F6,F7:影像點場</p>
        <p type="p">FOV:視場，視場對角線</p>
        <p type="p">M:放大因數，放大率</p>
        <p type="p">R:射線路徑，半徑，距離</p>
        <p type="p">sd:感測器對角線長度，對角線長度</p>
        <p type="p">t_BS:厚度</p>
        <p type="p">t_L1,t_L2,t_L3,t_L4,t_L5,t_L6:中心透鏡厚度</p>
        <p type="p">t0,t1,t2,t4,t5,t6:間距</p>
        <p type="p">t3,t3_0,t3_1:間距，距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2294" publication-number="202632456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>制熱組件、機頭組件及吹風設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260131B">G05D23/24</main-classification>
        <further-classification edition="200601120260131B">G05D23/19</further-classification>
        <further-classification edition="200601120260131B">F04D29/56</further-classification>
        <further-classification edition="200601120260131B">F04D29/38</further-classification>
        <further-classification edition="200601120260131B">A45D20/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商續新技術（深圳）集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUXIN TECHNOLOGY (SHENZHEN) GROUP CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡善顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫興林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周慧珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫葉琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱蘭英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種制熱組件、機頭組件及吹風設備，涉及吹風設備技術領域，本發明提出的制熱組件包括發熱件和導熱翅片結構，導熱翅片結構沿發熱件的周向延伸設置，並與發熱件導熱連接。導熱翅片結構和發熱件可設於機頭組件的出風通道內，並設於出風通道的出風路徑上。本發明的制熱組件通過採用發熱件與導熱翅片結構導熱連接，利用導熱翅片提高發熱件上熱量的傳導速度和增加了進風與制熱組件的熱交換面積，實現了提高發熱件與進風的熱交換效率的有益效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:制熱組件</p>
        <p type="p">21:發熱件</p>
        <p type="p">22:導熱翅片結構</p>
        <p type="p">23:導熱固定件</p>
        <p type="p">24:溫控開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2295" publication-number="202633318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於硫族化物材料之封裝層</chinese-title>
        <english-title>ENCAPSULATION LAYER FOR CHALCOGENIDE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260424B">H10P70/00</main-classification>
        <further-classification edition="202601120260424B">H10P95/90</further-classification>
        <further-classification edition="202601120260424B">H10W74/01</further-classification>
        <further-classification edition="202301120260424B">H10N70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商尤金納斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUGENUS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相姈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭昇勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SUNG-HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克　傑瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACK, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕克爾吉　尼羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHERJEE, NILOY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大體上係關於半導體裝置，且更特定言之係關於用於具有硫族化物材料之半導體裝置之封裝層，及形成該封裝層之方法。在一項態樣中，製造半導體裝置之方法包括提供具有包括硫族化物材料之經暴露表面之基板。此外，該方法包括藉由將該基板循環暴露至低負電性(低χ)金屬前驅體及包括O&lt;sub&gt;2&lt;/sub&gt;之氧前驅體而在該硫族化物材料上形成低χ金屬氧化物層，其中該金屬前驅體之該低χ金屬具有1.6或更低之負電性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed technology generally relates to semiconductor devices, and more particularly to an encapsulation layer for a semiconductor device having a chalcogenide material, and methods of forming the same. In one aspect, a method of fabricating a semiconductor device comprises providing a substrate having an exposed surface comprising a chalcogenide material. The method additionally comprises forming a low-electronegativity (low-χ) metal oxide layer on the chalcogenide material by cyclically exposing the substrate to a low-χ metal precursor and an oxygen precursor comprising O&lt;sub&gt;2&lt;/sub&gt;, wherein the low-χ metal of the metal precursor has an electronegativity of 1.6 or lower.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:半導體基板/基板</p>
        <p type="p">20:頂部金屬化線/第一導電線/上部導電線</p>
        <p type="p">22:底部金屬化線/第二導電線/下部導電線/下部電極線</p>
        <p type="p">30:記憶體胞元/胞元堆疊</p>
        <p type="p">32:頂部電極/上部電極</p>
        <p type="p">34:相變儲存元件/儲存元件</p>
        <p type="p">36:中間電極</p>
        <p type="p">38:選擇器元件/選擇器裝置/第一作用元件</p>
        <p type="p">40:底部電極/下部電極</p>
        <p type="p">46:封裝層/第一封裝層</p>
        <p type="p">46A:低負電性(低χ)金屬氧化物層/第一低負電性(低χ)金屬氧化物層</p>
        <p type="p">46B:罩蓋層/罩蓋氧化物層</p>
        <p type="p">50:第一隔離材料/空間/隔離材料</p>
        <p type="p">52A:低負電性(低χ)金屬氧化物層/第二低負電性(低χ)金屬氧化物層</p>
        <p type="p">52B:罩蓋層</p>
        <p type="p">300:交叉點記憶體陣列/交叉點陣列/陣列/中間結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2296" publication-number="202631240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102038</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理富含二氧化碳的氣體的處理系統</chinese-title>
        <english-title>TREATMENT SYSTEM FOR TREATING GASES LADEN WITH CARBON DIOXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">B01D53/00</main-classification>
        <further-classification edition="200601120260401B">B01D53/047</further-classification>
        <further-classification edition="200601120260401B">B01D53/26</further-classification>
        <further-classification edition="200601120260401B">F25J3/06</further-classification>
        <further-classification edition="201701120260401B">C01B32/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商天然氣運輸和技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAZTRANSPORT ET TECHNIGAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙澤爾　達揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONZER, DAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博里塞維奇　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORISEVICH, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧恩　伯納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOUN, BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於用於處理富含二氧化碳的氣體的系統（1），包括被供給天然氣並排放富含二氧化碳的氣體的重組單元（2），處理系統（1）包括乾燥單元（22）、二氫分離單元（24）以及包括至少一個冷凝裝置（46）的二氧化碳捕獲單元（26），處理系統（1）配置為使冷凝裝置（46）利用液化天然氣進行冷卻，處理系統（1）包括配置為將液化天然氣從二氧化碳捕獲單元（26）引導至重組單元（2）的管道（66）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a system (1) for treating gases laden with carbon dioxide, comprising a reforming unit (2) supplied with natural gas and emitting the gases charged with carbon dioxide, the treatment system (1) comprising a drying unit (22), a dihydrogen separation unit (24) and a carbon dioxide capture unit (26) comprising at least one condensation device (46), the treatment system (1) being configured so that the condensation device (46) is cooled using liquefied natural gas, the treatment system (1) comprising a duct (66) configured to lead the liquefied natural gas from the carbon dioxide capture unit (26) to the reforming unit (2).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理系統</p>
        <p type="p">2:重組單元</p>
        <p type="p">4:燃燒裝置</p>
        <p type="p">6:重組裝置</p>
        <p type="p">8:供水管線</p>
        <p type="p">9:供氣管線</p>
        <p type="p">10:儲存罐</p>
        <p type="p">11:連接端子</p>
        <p type="p">12:供應管線</p>
        <p type="p">13:分配管線</p>
        <p type="p">14:泵浦</p>
        <p type="p">16:汽化裝置</p>
        <p type="p">18:第一分支</p>
        <p type="p">20:第二分支</p>
        <p type="p">22:乾燥單元</p>
        <p type="p">24:二氫分離單元</p>
        <p type="p">26:二氧化碳捕獲單元</p>
        <p type="p">28:乾燥裝置</p>
        <p type="p">30:排水管線</p>
        <p type="p">32:壓力反轉吸附模組</p>
        <p type="p">34:回流管線</p>
        <p type="p">36:分叉管線</p>
        <p type="p">38:壓縮裝置</p>
        <p type="p">40:預冷裝置</p>
        <p type="p">46:冷凝裝置</p>
        <p type="p">54:分離裝置</p>
        <p type="p">54A:第一分離裝置</p>
        <p type="p">54B:第二純化裝置/第二分離裝置</p>
        <p type="p">56:儲存槽</p>
        <p type="p">57:再沸器</p>
        <p type="p">58:輸送管線</p>
        <p type="p">59:旁通管線</p>
        <p type="p">60:分流管線</p>
        <p type="p">62:旁通分支</p>
        <p type="p">64:管路</p>
        <p type="p">66:管道</p>
        <p type="p">76:冷卻裝置</p>
        <p type="p">78:冷卻迴路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2297" publication-number="202631720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>著色硬化性樹脂組成物、彩色濾光片、及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C08F2/44</main-classification>
        <further-classification edition="200601120260401B">C08K5/00</further-classification>
        <further-classification edition="200601120260401B">C08K7/16</further-classification>
        <further-classification edition="200601120260401B">C08L101/00</further-classification>
        <further-classification edition="200601120260401B">G03F7/004</further-classification>
        <further-classification edition="200601120260401B">G03F7/027</further-classification>
        <further-classification edition="200601120260401B">G02B5/20</further-classification>
        <further-classification edition="200601120260401B">G02B5/22</further-classification>
        <further-classification edition="200601120260401B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹花祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEHANA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻田和寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGITA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能夠形成具有充分高的霧度的硬化物，並且難以產生粒子成分的沈降的著色硬化性樹脂組成物。本發明提供一種含有著色劑、樹脂、聚合性化合物、聚合起始劑及丙烯酸系粒子的著色硬化性樹脂組成物。著色劑為彩色色素。丙烯酸系粒子的含量以著色硬化性樹脂組成物的固體成分的總量為基準，為1質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2298" publication-number="202632307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穿梭機送料器以及包括其的測試處理機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G01R31/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商泰克元有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種測試處理機。所述測試處理機包括：穿梭機，被設置成能夠安放電子元件；移送輸送機，其引導所述穿梭機的移送；以及插入手部，其在從所述測試儀拉出的室櫃的電子元件安裝部和所述穿梭機之間裝載或卸載所述電子元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">320:穿梭機送料器</p>
        <p type="p">321:送料器導軌</p>
        <p type="p">322:送料器夾具</p>
        <p type="p">322-1:夾具主體</p>
        <p type="p">322-2:夾具導軌</p>
        <p type="p">322-3:夾具支架</p>
        <p type="p">322-4:支架導軌</p>
        <p type="p">322-5:第一送料器夾持器</p>
        <p type="p">322-51:第一送料器引導銷</p>
        <p type="p">322-6:第二送料器夾持器</p>
        <p type="p">322-61:第二送料器引導銷</p>
        <p type="p">322-7:送料器移動片</p>
        <p type="p">322-71:第一送料器引導狹縫</p>
        <p type="p">322-72:第二送料器引導狹縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2299" publication-number="202632303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試處理機</chinese-title>
        <english-title>TEST HANDLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260504B">G01R31/01</main-classification>
        <further-classification edition="200601120260504B">G01R1/02</further-classification>
        <further-classification edition="200601120260504B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商泰克元有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種測試處理機。所述測試處理機包括：穿梭機；裝載部，其接收安放有電子元件的客戶托盤，並將被安放在所述客戶托盤上的電子元件裝載在所述穿梭機中；穿梭機移送部，其將裝載有所述電子元件的所述穿梭機移送至測試儀側；卸載部，其從所述穿梭機移送部接收完成測試的電子元件，並卸載至所述客戶托盤上；控制器，其對所述裝載部、所述穿梭機移送部及所述卸載部進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:穿梭機</p>
        <p type="p">200:裝載部</p>
        <p type="p">300:穿梭機移送部</p>
        <p type="p">400:卸載部</p>
        <p type="p">500:控制器</p>
        <p type="p">T:測試儀</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2300" publication-number="202631850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含磷化合物、耐燃耐熱組合物、半固化片及金屬箔積層板</chinese-title>
        <english-title>PHOSPHORUS-CONTAINING COMPOUND, FLAME-RETARDANT AND HEAT-RESISTANT COMPOSITION, PRE-PREG, AND METAL-CLAD LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260128B">C08K3/016</main-classification>
        <further-classification edition="200601120260128B">C08K5/526</further-classification>
        <further-classification edition="200601120260128B">C07F9/145</further-classification>
        <further-classification edition="200601120260128B">C09K21/04</further-classification>
        <further-classification edition="200601120260128B">C08L63/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長春人造樹脂廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊士德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王炳傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃琮益</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種含磷化合物，其係具有下式（I）之結構：&lt;br/&gt;&lt;img align="absmiddle" height="432px" width="533px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;   &lt;br/&gt;  其中，R1、R2、R3、R4、R17、R18、R19、及R20係如說明書所定義。所述含磷化合物可增進施用對象之耐熱性及耐燃性，因此特別適合於印刷電路板之技術領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phosphorus-containing compound is provided. The phosphorus-containing compound has a structure represented by Formula (I):&lt;br/&gt;&lt;img align="absmiddle" height="437px" width="565px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; wherein R1, R2, R3, R4, R17, R18, R19, and R20 are as defined in the specification. The phosphorus-containing compound can enhance the heat resistance and flame retardancy of an article to which it is applied, and is therefore particularly suitable for use in the technical field of printed circuit boards.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2301" publication-number="202632087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由區域精煉法生產單晶的裝置及其使用方法</chinese-title>
        <english-title>DEVICE FOR PRODUCING A SINGLE CRYSTAL BY A ZONE REFINING METHOD AND METHOD FOR USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">C30B13/20</main-classification>
        <further-classification edition="200601120260331B">H05B6/10</further-classification>
        <further-classification edition="200601120260331B">H05B6/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克內爾　迪特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNERER, DIETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐茨爾　巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOETZL, BASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於藉由區域精煉法生產單晶的感應線圈，其包含：環形線圈主體，該環形線圈主體在其中心具有開口，並且具有第一端部和第二端部，該第一端部和該第二端部係由從該開口基本上沿徑向方向延伸的狹槽分開，其中該感應線圈係由選自鉬、鎢及鉭的材料製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Induction coil for producing a single crystal by a zone refining method, comprising: an annular coil body having an opening in its center and possessing a first and a second end separated by a slot extending substantially in the radial direction from the opening, wherein the induction coil is fabricated from a material from a group consisting of molybdenum, tungsten, and tantalum.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:進料棒</p>
        <p type="p">102:熔體</p>
        <p type="p">103:單晶錠</p>
        <p type="p">107:上感應線圈</p>
        <p type="p">108:下感應線圈</p>
        <p type="p">109:封裝</p>
        <p type="p">110:入口</p>
        <p type="p">111:出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2302" publication-number="202633380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種工件台組件、半導體生產設備及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260401B">H10P72/78</main-classification>
        <further-classification edition="202601120260401B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海芯上微裝科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BOGUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鑫鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冒鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, PENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種工件台組件、半導體生產設備及方法，工件台組件包括工件台本體和壓邊機構；工件台本體包括吸盤座和吸盤，吸盤設在吸盤座上；多個壓邊機構環繞佈置在吸盤外周；壓邊機構包括水平驅動件、垂向驅動件、壓板部，水平驅動件與吸盤座連接，垂向驅動件與水平驅動件連接，壓板部與垂向驅動件連接；水平驅動件和垂向驅動件狀態保持時，壓板部與吸盤相對靜止。工件台組件用於半導體生產設備，半導體生產設備工作時執行：使吸盤吸附基板；檢測基板的狀態是否符合預設應用條件，若是，則執行預設操作，若否，則利用壓邊機構在線壓邊，再執行預設操作，確保預設操作順利進行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工件台本體</p>
        <p type="p">110:吸盤</p>
        <p type="p">120:位姿調整機構</p>
        <p type="p">121:長行程運動模組</p>
        <p type="p">122:微動模組</p>
        <p type="p">200:壓邊機構</p>
        <p type="p">210:水平驅動件</p>
        <p type="p">220:垂向驅動件</p>
        <p type="p">230:壓板部</p>
        <p type="p">231:第二轉接板</p>
        <p type="p">232:壓條</p>
        <p type="p">240:力檢測元件</p>
        <p type="p">250:第一轉接板</p>
        <p type="p">01:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2303" publication-number="202631555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純化氟化二氫烯烴之方法</chinese-title>
        <english-title>PROCESS TO PURIFY FLUORINATED DIHYDROOLEFINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C17/42</main-classification>
        <further-classification edition="200601120260504B">C07C21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛森伯格　羅伯特　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOUSENBERG, ROBERT DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　學胡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩洛弗　威徹斯拉夫　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETROV, VIACHESLAV A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可拉斯　丘巴蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUBATYI, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用以自包含氟化二氫烯烴及至少一種雜質之產物混合物中降低該雜質之濃度的方法，其中該氟化二氫烯烴具有式R&lt;sup&gt;F1&lt;/sup&gt;CH=CHR&lt;sup&gt;F2&lt;/sup&gt;，其中R&lt;sup&gt;F1&lt;/sup&gt;及R&lt;sup&gt;F2&lt;/sup&gt;係C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;6&lt;/sub&gt;氟烷基，且該雜質係氟化烯烴、氟化二烯、氟化炔烴、或其二或更多者之混合物。在一個實施例中，該至少一種雜質包含具有式R&lt;sup&gt;F1&lt;/sup&gt;CH=CFR&lt;sup&gt;F2&lt;/sup&gt;之氟化烯烴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process to reduce the concentration of at leat one impurity in a product mixture comprising a fluorinated dihydroolefin and the impurity is provided wherein the fluorinated dihydroolefin has the formula R&lt;sup&gt;F1&lt;/sup&gt;CH=CHR&lt;sup&gt;F2&lt;/sup&gt;, wherein R&lt;sup&gt;F1&lt;/sup&gt; and R&lt;sup&gt;F2&lt;/sup&gt; are C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;6&lt;/sub&gt; fluoroalkyl groups, and the impurity is a fluorinated olefin, a fluorinated diene, a fluorinated alkyne or a mixture of two or more thereof. In one embodiment, the at least one impurity comprises a fluorinated olefin having the formula R&lt;sup&gt;F1&lt;/sup&gt;CH=CFR&lt;sup&gt;F2&lt;/sup&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2304" publication-number="202632872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橋式逆變電路及其驅動電路</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260328B">H02M7/5387</main-classification>
        <further-classification edition="200701120260328B">H02M1/38</further-classification>
        <further-classification edition="200601120260328B">H03K17/28</further-classification>
        <further-classification edition="200601120260328B">H03K5/145</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桂浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝幸光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂衛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種橋式逆變電路及其驅動電路，驅動電路包括信號輸入模組和延遲控制模組，所述延遲控制模組包括第一延遲支路與第二延遲支路，第一延遲支路和第二延遲支路的輸出分別連接橋式逆變電路的橋臂的高端開關和低端開關，當驅動電路的輸入信號轉換時，信號需要分別經過第一延遲支路和第二延遲支路的延遲時間到達輸出端，延遲時間作為高端開關和低端開關的轉態包容時間，有效避免了高端開關和低端開關的同時導通，避免橋臂直通，從而保護電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        &lt;img align="absmiddle" height="23px" width="23px" file="d10003.TIF" alt="其他非圖式ed10003.png" img-content="character" orientation="portrait" inline="no" giffile="ed10003.png"&gt;
        &lt;/img&gt;:第一延遲模組</p>
        <p type="p">
        &lt;img align="absmiddle" height="24px" width="23px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:第二延遲模組</p>
        <p type="p">
        &lt;img align="absmiddle" height="23px" width="27px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"&gt;
        &lt;/img&gt;:信號輸入模組</p>
        <p type="p">U1:第一及閘</p>
        <p type="p">U2:第二及閘</p>
        <p type="p">U4:第一反相器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2305" publication-number="202631074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔基站及清洗系統</chinese-title>
        <english-title>CLEANING BASE STATION AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260327B">A47L11/40</main-classification>
        <further-classification edition="200601120260327B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝旭昶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, XUCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡彩雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CAIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙立棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開實施例公開了一種清潔基站及清洗系統，清潔基站包括：本體組件；清洗組件，設置於所述本體組件、且限定出清洗空間；驅動組件，設置於所述本體組件；所述驅動組件的第一輸出部位於所述清洗空間內；所述驅動組件的第一輸出部用於與清潔設備的清潔模組可分離地連接，以驅動所述清潔模組在所述清洗空間處轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure disclose a cleaning base station and a cleaning system. The cleaning base station includes: a body assembly; a cleaning assembly arranged on the body assembly and defining a cleaning space; and a driving assembly arranged on the body assembly. A first output portion of the driving assembly is located in the cleaning space, and is configured to detachably connect to a cleaning module of a cleaning device, so as to drive the cleaning module to rotate at the cleaning space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:清潔基站</p>
        <p type="p">100:本體組件</p>
        <p type="p">200:清洗組件</p>
        <p type="p">210:清洗盤</p>
        <p type="p">213:清洗空間</p>
        <p type="p">220:清理件</p>
        <p type="p">222:清理部</p>
        <p type="p">230:清理支架</p>
        <p type="p">250:遮擋件</p>
        <p type="p">251:第一通孔</p>
        <p type="p">300:驅動組件</p>
        <p type="p">310:第一輸出部</p>
        <p type="p">320:第一限定結構</p>
        <p type="p">351:第一連接件</p>
        <p type="p">370:第一電機</p>
        <p type="p">500:清潔模組</p>
        <p type="p">510:清潔支架</p>
        <p type="p">520:第一配合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2306" publication-number="202631856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱填料、樹脂組成物以及樹脂成形體</chinese-title>
        <english-title>HEAT DISSIPATING FILLER, RESIN COMPOSITION AND RESIN MOLDED BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260331B">C08K3/28</main-classification>
        <further-classification edition="200601120260331B">C08K3/22</further-classification>
        <further-classification edition="200601120260331B">C08K3/36</further-classification>
        <further-classification edition="200601120260331B">C08K7/04</further-classification>
        <further-classification edition="200601120260331B">C09K5/14</further-classification>
        <further-classification edition="200601120260331B">C08L83/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優邁普股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>U-MAP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉将太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的散熱填料係用於製造樹脂成形體的散熱填料，包括粒徑為50μm以上300μm以下的第一熱傳導粒子、粒徑為5μm以上未滿50μm的第二熱傳導粒子、粒徑為0.1μm以上未滿5μm的第三熱傳導粒子以及纖維狀氮化鋁。當將該第一熱傳導粒子、該第二熱傳導粒子、該第三熱傳導粒子與該纖維狀氮化鋁的合計量設為100.0體積份時，該散熱填料包括比例為40.0～70.0體積份的該第一熱傳導粒子，包括比例為7.0～30.0體積份的該第二熱傳導粒子，包括比例為22.0～45.0體積份的該第三熱傳導粒子，包括比例為0.5～13.5體積份的該纖維狀氮化鋁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The heat dissipating filler of the present invention is a heat dissipating filler used for manufacturing a resin molded body, the heat dissipating filler comprising: first heat conductive particles each having a particle size of 50 μm or more and 300 μm or less; second heat conductive particles each having a particle size of 5 μm or more and less than 50 μm; third heat conductive particles each having a particle size of 0.1 μm or more and less than 5 μm; and aluminum nitrides formed into a fibrous shape, wherein, when a total amount of the first heat conductive particles, the second heat conductive particles, the third heat conductive particles and the aluminum nitrides formed into the fibrous shape is 100 parts by volume, the heat dissipating filler contains the first heat conductive particles in a ratio of 40.0 parts by volume or more and 70.0 parts by volume or less, the second heat conductive particles in a ratio of 7.0 parts by volume or more and 30.0 parts by volume or less, the third heat conductive particles in a ratio of 22.0 parts by volume or more and 45.0 parts by volume or less and the aluminum nitrides formed into the fibrous shape in a ratio of 0.5 part by volume or more and 13.5 parts by volume or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂成形體</p>
        <p type="p">10:散熱填料</p>
        <p type="p">11:纖維狀氮化鋁</p>
        <p type="p">12:第一熱傳導粒子</p>
        <p type="p">13:第二熱傳導粒子</p>
        <p type="p">14:第三熱傳導粒子</p>
        <p type="p">20:樹脂材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2307" publication-number="202632723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/26</main-classification>
        <further-classification edition="200601120260302B">H01J37/244</further-classification>
        <further-classification edition="202601120260302B">H10P74/20</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青柳美紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAGI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土肥歩未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOI, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中麻紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在CFET等半導體裝置中，能夠對形成於各積層結構體之間的半導體層進行線上檢查的技術。電腦系統在複數個半導體層被照射電子束時，量測複數個半導體層各自的亮度，取得包含複數個半導體層的第1圖像資料，並運算複數個半導體層各自的亮度而取得統計資料，並基於來自統計資料的複數個半導體層各自的亮度的偏離，對複數個半導體層進行有無缺陷的判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2308" publication-number="202632851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖騰柱ＰＦＣ電路及其控制電路</chinese-title>
        <english-title>TOTEM POLE PFC CIRCUIT AND CONTROL CIRCUIT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260202B">H02M1/00</main-classification>
        <further-classification edition="200601120260202B">H02M1/08</further-classification>
        <further-classification edition="200701120260202B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廣卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUANGZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林友土</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOUTU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王繼承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種圖騰柱PFC電路的控制電路。該圖騰柱PFC電路包括耦接在輸出端和參考接地之間的第一半橋和第二半橋，該第一半橋耦接至電感且包括第一開關和第二開關。該圖騰柱PFC電路用於接收交流輸入電壓並提供輸出電壓。本揭示內容的控制電路可在交流輸入電壓過零期間，將圖騰柱PFC電路的第一開關或第二開關多次導通以給第二半橋的開關節點逐漸地充電或放電，減小了第二半橋的開關節點的電壓轉換速率，從而提高電路的電磁干擾效能並避免了音訊雜訊的產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit for a totem pole PFC circuit is disclosed. The totem pole PFC circuit includes a first half bridge and a second half bridge both coupled between an output terminal and a reference ground, the first half bridge is coupled to an inductor and includes a first switch and a second switch. The totem pole PFC circuit is used to receive an AC input voltage and provide an output voltage. The control circuit in the embodiments of the present invention can conduct the first switch or the second switch of the totem pole PFC circuit multiple times during the zero crossing period of the AC input voltage to gradually charge or discharge a switch node of the second half bridge, reducing the voltage slew rate of the switching node of the second half bridge, thereby improving the electromagnetic interference performance of the circuit and avoiding audio noise.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:區域</p>
        <p type="p">C1:第一週期</p>
        <p type="p">C2:第二週期</p>
        <p type="p">G1:第一控制訊號</p>
        <p type="p">G2:第二控制訊號</p>
        <p type="p">NM:正常工作模式</p>
        <p type="p">t0,t1,t2,t3,t4,t5,t6,t41,t42,t43:時刻</p>
        <p type="p">toff:關斷時長</p>
        <p type="p">ton1:第一導通時長</p>
        <p type="p">ton2:第二導通時長</p>
        <p type="p">Vac:交流輸入電壓</p>
        <p type="p">ZM:預導通模式</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2309" publication-number="202633125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260401B">H10D30/62</main-classification>
        <further-classification edition="202501120260401B">H10D62/13</further-classification>
        <further-classification edition="202501120260401B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張尚文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHANG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱熙甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, SHI-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例係有關於一種半導體裝置，包括設置於半導體基板上方的第一通道區域以及第二通道區域；具有沿著第一方向之縱軸且延伸跨越第一通道區域及第二通道區域的閘極結構，其中閘極結構包括界面層、閘極介電層以及閘極電極；在垂直於第一方向的第二方向上將第一通道區域及閘極結構夾設於其間的第一磊晶特徵以及第二磊晶特徵；以及在第一通道區域與第二通道區域之間延伸的隔離結構。隔離結構具有面朝第一通道區域的第一側壁，並且第一側壁之介於第一通道區域的頂部與第一通道區域的底部之間的一部分，被閘極介電層及界面層所覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure is a semiconductor device that, includes a first channel region and a second channel region disposed over a semiconductor substrate; a gate structure having a longitudinal axis in a first direction and extending across the first channel and second channel regions, and the gate structure includes an interfacial layer, a gate dielectric layer, and a gate electrode; a first epitaxial feature and a second epitaxial feature interposing the first channel region and the gate structure in a second direction perpendicular to the first direction; and an isolation structure extending between the first and second channel regions. The isolation structure has a first sidewall facing the first channel region, and a portion of the first sidewall between a top of the first channel region and a bottom of the first channel region is covered by the gate dielectric layer and the interfacial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一奈米結構</p>
        <p type="p">114:鰭片</p>
        <p type="p">120:STI區域</p>
        <p type="p">165:隔離牆</p>
        <p type="p">165A:襯墊</p>
        <p type="p">165B:隔離填充物</p>
        <p type="p">168:閘極介電層</p>
        <p type="p">170:閘極電極</p>
        <p type="p">176:導電特徵</p>
        <p type="p">180:隔離覆帽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2310" publication-number="202632470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102235</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦</chinese-title>
        <english-title>LAPTOP COMPUTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260415B">G06F1/3234</main-classification>
        <further-classification edition="201901120260415B">G06F1/32</further-classification>
        <further-classification edition="200601120260415B">H04R5/02</further-classification>
        <further-classification edition="200601120260415B">H05K7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴筱儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, HSIAO-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方良榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, LIANG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉王鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, WANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型電腦，包括第一機體、第二機體、鉸鏈模組、至少一揚聲器以及至少一傳動模組。第二機體具有至少一收容槽。鉸鏈模組連接該第一機體與該第二機體，第一機體與第二機體通過鉸鏈模組而彼此相對樞轉開闔。揚聲器樞設於第一機體。傳動模組連接於鉸鏈模組與揚聲器之間，且使鉸鏈模組、傳動模組與揚聲器彼此機構連動。當該第一機體閉闔於第二機體時，揚聲器被收納於該收容槽。當第一機體從閉闔而相對於第二機體展開時，揚聲器移離收容槽且相對於第一機體展開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laptop computer including a first body, a second body having at least one receiving slot, a hinge module connected between the first and the second bodies, at least one speaker pivoted to the first body, and at least one transmission module connected between the hinge module and the speaker is provided. The first and the second bodies are pivoted to be folded or unfolded through the hinge module. The hinge module, the transmission module, and the speaker are mechanically linked to each other. When the first body is folded onto the second body, the speaker is accommodated in the receiving slot. When the first body is unfolded relative to the second body, the speaker moves away from the receiving slot and is opened relative to the first body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:筆記型電腦</p>
        <p type="p">110:第一機體</p>
        <p type="p">111:顯示面</p>
        <p type="p">120:第二機體</p>
        <p type="p">121:收容槽</p>
        <p type="p">122:槽蓋</p>
        <p type="p">130:鉸鏈模組</p>
        <p type="p">140:揚聲器</p>
        <p type="p">142:揚聲面</p>
        <p type="p">150:傳動模組</p>
        <p type="p">θ1:第二角度</p>
        <p type="p">θ3:第三角度</p>
        <p type="p">X-Y-Z:直角座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2311" publication-number="202632645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼方法、解碼方法及相關設備</chinese-title>
        <english-title>ENCODING METHOD, DECODING METHOD AND RELATED DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260328B">G10L19/02</main-classification>
        <further-classification edition="201301120260328B">G10L19/032</further-classification>
        <further-classification edition="201301120260328B">G10L25/30</further-classification>
        <further-classification edition="200601120260328B">H03M7/40</further-classification>
        <further-classification edition="200601120260328B">H03M7/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇若夫　伊利亞　伊戈雷維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIZHOV, ILYA IGOREVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈洛什恰波娃　維拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLOSHCHAPOVA, VERA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供了一種編碼方法、解碼方法及相關設備。所述方法包括以下步驟：通過修正離散餘弦變換（modified discrete cosine transform，MDCT）確定與音訊信號相對應的頻譜；將所述頻譜劃分為N個子帶；確定所述N個子帶中的第i個子帶中的至少一個第一MDCT係數，其中，所述第一MDCT係數的能量大於或等於目標能量，所述目標能量根據閾值和所述第i個子帶的總能量來確定，i=1, …, N；對所述至少一個第一MDCT係數進行量化；對所述至少一個量化後的第一MDCT係數進行熵編碼。本申請提供的實施例能夠提高音訊信號的客觀品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present application provide an encoding method, a decoding method and related device. The method includes the following steps: determining a spectrum corresponding to an audio signal by using a modified discrete cosine transform (MDCT); dividing the spectrum into N subband(s); determining at least one first MDCT coefficient in an ith subband among the N subband(s), where an energy of the first MDCT coefficient is greater than or equal to a target energy, the target energy is determined according to a threshold and a full energy of the i&lt;sup&gt;th&lt;/sup&gt; subband, i = 1, …, N; quantizing the at least one first MDCT coefficient; performing entropy encoding on the at least one quantized first MDCT coefficient. The embodiments provided by the present application can provide a improve the objective quality of an audio signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301、302、303、304、305、306、307:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2312" publication-number="202633234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微顯示晶片及其製造方法、顯示面板</chinese-title>
        <english-title>MICRO-DISPLAY CHIP, MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260202B">H10H29/30</main-classification>
        <further-classification edition="202501120260202B">H10H29/85</further-classification>
        <further-classification edition="202501120260202B">H10H29/855</further-classification>
        <further-classification edition="200601120260202B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋皇劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HUANGJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種微顯示晶片，其包括發光區域以及非發光區域，其中非發光區域設置于發光區域的周圍，且包括封裝層，其中封裝層的表面包括若干粗糙結構。在封裝層表面進行刻蝕粗化處理，可以降低其反射率，使得發光區域發出的光線經過外界反射達到封裝區表面後產生漫反射，以有效地降低全波段光線的再次反射，提升畫面顯示品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro-display chip is disclosed, comprising a light-emitting region and a non-light-emitting region. The non-light-emitting region is disposed at a periphery of the light-emitting region and comprises an encapsulation layer, wherein a surface of the encapsulation layer comprises a plurality of roughened structures. By performing an etching roughening treatment on the surface of the encapsulation layer, a reflectivity thereof is reduced, such that light emitted from the light-emitting region undergoes diffuse reflection upon reaching the surface of the non-light-emitting region after being reflected by an external environment. Thus, secondary reflection of full-band light is effectively reduced, and display quality of images is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401:驅動背板</p>
        <p type="p">402:發光區域</p>
        <p type="p">403:非發光區域</p>
        <p type="p">421:微發光二極體</p>
        <p type="p">422:微透鏡</p>
        <p type="p">431:金屬層</p>
        <p type="p">432:遮擋層</p>
        <p type="p">4321:粗糙結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2313" publication-number="202632119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>砌體結構的製造方法以及砌體結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260325B">E04B2/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿斯特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木正臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈塞卡蘭　香塔努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJASEKHARAN, SHANTHANU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本憲二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KENJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種砌體結構的製造方法，包括：準備砌體牆10的步驟，準備堆疊有多個砌體材料11的砌體牆10；以及形成補強塗層20的步驟，在所述砌體牆10的牆面形成補強塗層20。所述形成補強塗層20的步驟包含：對於包含所述多個砌體材料11中彼此相鄰的第一砌體材料11-1與第二砌體材料11-2的邊界部的至少一部分、所述第一砌體材料11-1的一部分11a、及所述第二砌體材料11-2的一部分11b的塗佈區域，在使與所述塗佈區域相鄰的第一砌體材料11-1的牆面以及所述第二砌體材料11-2的牆面的至少任一區域露出的狀態下，塗佈用於形成所述補強塗層20的塗料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11-1:第一砌體材料</p>
        <p type="p">11-2:第二砌體材料</p>
        <p type="p">11-3:其他砌體材料</p>
        <p type="p">11a、11b、11c、11d:部分</p>
        <p type="p">12:邊界線</p>
        <p type="p">12-1:第一邊界線</p>
        <p type="p">12-2:第二邊界線</p>
        <p type="p">13:邊界線</p>
        <p type="p">20:補強塗層</p>
        <p type="p">21:縱向連接部</p>
        <p type="p">22:橫向連接部</p>
        <p type="p">L1:長度</p>
        <p type="p">S100:砌體結構</p>
        <p type="p">Sa:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2314" publication-number="202631075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔模組、清潔設備及清潔系統</chinese-title>
        <english-title>CLEANING MODULE, CLEANING DEVICE, AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260127B">A47L11/40</main-classification>
        <further-classification edition="200601120260127B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡彩云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CAIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝旭昶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, XUCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙立棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, LIDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例揭露了一種清潔模組、清潔設備及清潔系統，清潔模組包括：清潔支架，在軸向具有背對設置的第一配合部和第二配合部；清潔件，設置於所述清潔支架的第一端；所述清潔件開設有與所述第一配合部位置對應的避讓通孔；所述第一配合部用於藉由所述避讓通孔與清潔基站的驅動元件的第一輸出部可分離地連接；所述第二配合部用於與清潔設備的機身可分離地連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure disclose a cleaning module, a cleaning device, and a cleaning system. The cleaning module includes: a cleaning bracket, having a first mating portion and a second mating portion arranged opposite to each other in an axial direction; and a cleaning member arranged at a first end of the cleaning bracket. The cleaning member has an avoidance through hole corresponding in position to the first mating portion; the first mating portion is configured to detachably connect to a first output portion of a driving assembly of a cleaning base station through the avoidance through hole; and the second mating portion is configured to detachably connect to a body of the cleaning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:清潔模組</p>
        <p type="p">510:清潔支架</p>
        <p type="p">520:第一配合部</p>
        <p type="p">530:第二配合部</p>
        <p type="p">540:清潔件</p>
        <p type="p">541:避讓通孔</p>
        <p type="p">550:第一連接結構</p>
        <p type="p">570:第二安裝槽</p>
        <p type="p">581:第二連接件</p>
        <p type="p">582:第三連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2315" publication-number="202632977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空間音訊播放裝置及方法</chinese-title>
        <english-title>SPATIAL AUDIO PLAYBACK DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H04S5/02</main-classification>
        <further-classification edition="200601120260202B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李虹慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HUNG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種空間音訊播放裝置，與頭戴式裝置通訊連接，包括：一收發單元，通過無線通訊與該頭戴式裝置通訊，配置為接收該頭戴式裝置在運動感測訊號上的運動資訊，並從該頭戴式裝置接收該無線通訊的資訊或傳輸標準；以及一處理單元，耦接該收發單元，配置為根據該運動資訊預測預定時間後的頭部資訊，根據預測的該頭部資訊在該預定時間後調整空間音訊以生成調整後空間音訊，並通過該收發單元將該調整後空間音訊傳輸到該頭戴式裝置；以及其中該預定時間根據該資訊或該無線通訊的傳輸標準而改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A spatial audio playback device, comprises: a transceiver unit, which communicates with the head-mounted device through wireless communication, is configured to receive information of a motion of the head-mounted device on a motion sensing signal and information or a transmission standard of the wireless communication from the head-mounted device; and a processing unit, which is coupled to the transceiver unit, is configured to predict head information after a predetermined time based on the information of the motion, adjust spatial audio based on the head information after the predetermined time to generate adjusted spatial audio and transmit the adjusted spatial audio to the transceiver unit, and transmit the adjusted spatial audio to the head-mounted device through the transceiver unit; the adjusted spatial audio is transmitted to the head-mounted device by the transceiver unit; and the predetermined time changes according to the information or the transmission standard of the wireless communication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:空間音訊撥放裝置</p>
        <p type="p">111:收發單元</p>
        <p type="p">112:處理單元</p>
        <p type="p">120:頭戴式裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2316" publication-number="202632724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體檢查裝置、電特性檢查裝置及電特性檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">H01J37/26</main-classification>
        <further-classification edition="200601120260311B">H01J37/24</further-classification>
        <further-classification edition="201701120260311B">G06T7/00</further-classification>
        <further-classification edition="202001120260311B">G01R31/26</further-classification>
        <further-classification edition="202601120260311B">H10W46/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津野夏規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNO, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田洋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTA, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹氣裕子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDOH, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田正二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川高穗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAWA, TAKAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提高判定具有作為檢查對象的主元件和電性連接到主元件的副元件之評估元件的正常/缺陷的靈敏度。若根據本揭示，解析在試料上以特定的照射條件和特定的間歇條件掃描脈衝帶電粒子束所獲取的試料圖像中評估元件影像的亮度，該亮度會依賴脈衝帶電粒子束的照射條件或間歇條件而變化的變化特性，並從該變化特性中提取第1特徵量及第2特徵量。設定第1特徵量及第2特徵量中何者是與主元件的電特性相關的特徵量，並根據被設定為與主元件的電特性相關的第1特徵量及上述第2特徵量之一方，判定評估元件的正常/缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體檢查裝置</p>
        <p type="p">101:框體</p>
        <p type="p">102:電子源</p>
        <p type="p">103:間歇照射器</p>
        <p type="p">103a:間歇條件</p>
        <p type="p">104:偏轉器</p>
        <p type="p">105:接物透鏡</p>
        <p type="p">106:檢測器</p>
        <p type="p">107:載台</p>
        <p type="p">108:試料</p>
        <p type="p">110:電子束控制部</p>
        <p type="p">111:圖像形成部</p>
        <p type="p">120:控制裝置</p>
        <p type="p">121:裝置控制部</p>
        <p type="p">122:TEG資訊設定部</p>
        <p type="p">123:特徵量設定部</p>
        <p type="p">124:檢查對象特徵量設定部</p>
        <p type="p">125:缺陷判定條件設定部</p>
        <p type="p">126:缺陷判定部</p>
        <p type="p">127:亮度解析處理部</p>
        <p type="p">128:特徵量解析部</p>
        <p type="p">129:資料保存部</p>
        <p type="p">131:輸入部</p>
        <p type="p">132:輸出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2317" publication-number="202632750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理的設備</chinese-title>
        <english-title>APPARATUS FOR SUBSTRATE PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/32</main-classification>
        <further-classification edition="202601120260421B">H10P72/70</further-classification>
        <further-classification edition="200601120260421B">B08B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　菅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華瑞恰克　拉拉Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWRYLCHAK, LARA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段　仁官</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, REN-GUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　明綠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, BERNARD L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢凡　麥爾肯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEVAN, MALCOLM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了一種用於使用氫電漿處理的方法及設備。處理腔室包括複數個腔室部件。複數個腔室部件可用如Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-ZrO&lt;sub&gt;2&lt;/sub&gt;固溶體的氧化釔鋯組成物塗佈。複數個腔室部件中的一些腔室部件替換為塊體氧化釔鋯陶瓷。又一些腔室部件替換為不同材料的類似部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for the use of hydrogen plasma treatments is described herein. The process chamber includes a plurality of chamber components. The plurality of chamber components may be coated with a yttrium zirconium oxide composition, such as a Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-ZrO&lt;sub&gt;2&lt;/sub&gt; solid solution. Some of the plurality of chamber components are replaced with a bulk yttrium zirconium oxide ceramic. Yet other chamber components are replaced with similar components of different materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室組件</p>
        <p type="p">101:電漿處理腔室</p>
        <p type="p">105:靜電夾盤</p>
        <p type="p">106:腔室主體</p>
        <p type="p">107:下部襯墊</p>
        <p type="p">108:腔室蓋</p>
        <p type="p">109:上部襯墊</p>
        <p type="p">110:線圈元件</p>
        <p type="p">111:上部腔室主體</p>
        <p type="p">112:第一阻抗匹配網路</p>
        <p type="p">113:下部腔室主體</p>
        <p type="p">114:RF電源</p>
        <p type="p">116:電氣接地</p>
        <p type="p">117:電氣接地</p>
        <p type="p">118:屏蔽電極</p>
        <p type="p">119:電氣接地</p>
        <p type="p">120:開關</p>
        <p type="p">122:偵測器</p>
        <p type="p">124:第二阻抗匹配網路</p>
        <p type="p">126:偏壓電源</p>
        <p type="p">128:基板</p>
        <p type="p">129:電漿屏蔽環</p>
        <p type="p">130:氣體控制板</p>
        <p type="p">131:氣體噴嘴</p>
        <p type="p">132:入口埠</p>
        <p type="p">134:氣態混合物</p>
        <p type="p">136:電漿</p>
        <p type="p">138:節流閥</p>
        <p type="p">140:真空幫浦</p>
        <p type="p">142:氣源</p>
        <p type="p">144:氣體導管</p>
        <p type="p">146:控制器</p>
        <p type="p">148:中央處理單元(CPU)</p>
        <p type="p">150:記憶體</p>
        <p type="p">152:支援電路</p>
        <p type="p">154:開口</p>
        <p type="p">156:襯墊門</p>
        <p type="p">160:電漿源</p>
        <p type="p">161:偏壓電力系統</p>
        <p type="p">162:緊固件蓋</p>
        <p type="p">164:緊固件</p>
        <p type="p">166:墊圈</p>
        <p type="p">168:墊圈</p>
        <p type="p">170:墊圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2318" publication-number="202631416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102395</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嬰兒載具及其製造方法</chinese-title>
        <english-title>BABY CARRIER AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B60N2/26</main-classification>
        <further-classification edition="200601120260421B">B60N2/28</further-classification>
        <further-classification edition="200601120260421B">A47D13/00</further-classification>
        <further-classification edition="200601120260421B">B29C44/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINGZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種嬰兒載具及其製造方法，嬰兒載具包括本體，本體圍合形成用於承載嬰兒的承載槽，本體由發泡材料製成。嬰兒載具整體重量較輕，易於移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A baby carrier and a manufacturing method thereof are disclosed. The baby carrier includes a main body formed with a carrying receptacle configured to carry a baby. The main body is made of a foam material. An overall weight of the baby carrier is light and the baby carrier is easy to be moved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:嬰兒睡箱</p>
        <p type="p">100:本體</p>
        <p type="p">110:承載槽</p>
        <p type="p">111:槽壁</p>
        <p type="p">112:側壁</p>
        <p type="p">113:槽底</p>
        <p type="p">113a:頭部支撐部</p>
        <p type="p">113b:背部支撐部</p>
        <p type="p">113c:臀部支撐部</p>
        <p type="p">113d:腿部支撐部</p>
        <p type="p">220:適配件</p>
        <p type="p">400:提手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2319" publication-number="202631649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種環肽化合物及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C07K7/54</main-classification>
        <further-classification edition="200601120260401B">A61K51/08</further-classification>
        <further-classification edition="200601120260401B">A61K51/04</further-classification>
        <further-classification edition="200601120260401B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商域鈦醫療科技（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI YUTAI MEDICAL TECHNOLOGY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種環肽化合物及其應用。本發明提供了一種環肽化合物或其藥學上可接受的鹽。本發明的環肽化合物具有製備簡單、穩定性好、腫瘤攝取高、滯留久或CXCR4競爭結合能力強，適於在臨床上開發和應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2320" publication-number="202632216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形狀測量裝置、表面層測量／分析系統及測定對象的資料的獲取方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260407B">G01B11/00</main-classification>
        <further-classification edition="200601120260407B">G01B11/24</further-classification>
        <further-classification edition="200601120260407B">G01B11/30</further-classification>
        <further-classification edition="202201120260407B">G01B9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人埼玉大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩田達俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIODA, TATSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠高速地對廣面積的測定對象的表面形狀或距離進行測量的測量裝置。本發明提供一種形狀測量裝置，其具有：檢測器，對使自光源部發出並被測定對象反射的第一光與第二光發生干涉而得的干涉光進行檢測；以及圖像生成部，生成以光檢測器的輸出為畫素值的圖像。光檢測器具有：受光區域，接收干涉光而產生電荷；多個流入區域，用於供在受光區域產生的電荷流入；以及開關，以規定的時間間隔依次切換在受光區域產生的電荷並使其流入至多個流入區域。圖像生成部以與由光檢測器的開關切換的在規定的時間內流入至流入區域的電荷的量對應的畫素值生成圖像。藉此，以規定的時間間隔依次生成圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:表面形狀測量裝置</p>
        <p type="p">10:干涉系統</p>
        <p type="p">11:光源</p>
        <p type="p">24:射束分離器(光學系統)</p>
        <p type="p">26:聚光透鏡(光學系統)</p>
        <p type="p">31:圖像生成部</p>
        <p type="p">32:表面形狀檢測部</p>
        <p type="p">34:顯示部</p>
        <p type="p">35:控制部</p>
        <p type="p">70:光路長度調製器</p>
        <p type="p">80:光檢測器</p>
        <p type="p">100:測定對象</p>
        <p type="p">x、y、z:軸(方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2321" publication-number="202633017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻控制電路、射頻電源及其控制方法、半導體工藝設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H05H1/36</main-classification>
        <further-classification edition="200601120260202B">H05H1/46</further-classification>
        <further-classification edition="200601120260202B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京華丞電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈文華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李加波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種射頻控制電路、方法、射頻電源及半導體工藝設備，應用於半導體技術領域，該電路包括第一控制電路、第二控制電路、信號轉換電路和直流電源，第一控制電路根據前向功率設定值與前向功率回饋值輸出第一目標控制量和第二目標控制量，信號轉換電路根據第一目標控制量生成脈衝驅動信號並輸出至功率放大電路，第二控制電路基於第一目標控制量與控制量閾值的控制量偏差輸出第三目標控制量，直流電源根據第三目標控制量調節輸出至功率放大電路的直流電壓信號，本申請提供兩種射頻功率調節方式，調節方式更多，調節脈衝驅動信號占空比的回應時間要遠小於調節直流電壓的回應時間，兩種調節方式配合可以有效提高射頻電源的調節效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一控制電路</p>
        <p type="p">20:第二控制電路</p>
        <p type="p">30:信號轉換電路</p>
        <p type="p">40:直流電源</p>
        <p type="p">50:功率放大電路</p>
        <p type="p">60:採樣電路</p>
        <p type="p">200:射頻控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2322" publication-number="202631418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童安全座椅</chinese-title>
        <english-title>CHILD SAFETY SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260321B">B60N2/433</main-classification>
        <further-classification edition="200601120260321B">B60N2/64</further-classification>
        <further-classification edition="200601120260321B">B60N2/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉祖建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZUJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種兒童安全座椅，其包括：座位部，背靠部，樞接於所述座位部，並相對於所述座位部在展開位置與折疊位置之間樞轉；鎖定機構，能夠被操作而鎖定或釋鎖所述背靠部與所述座位部之間的樞轉，其中，所述背靠部的下端設有安裝塊，所述座位部的後端設有用於容納所述安裝塊的安裝槽；其中，所述鎖定機構包括活動的鎖定部以及與所述鎖定部配合的配鎖部，所述鎖定部設置於所述安裝塊和所述安裝槽中的一者，所述配鎖部設置於所述安裝塊和所述安裝槽中的另一者，在所述背靠部朝向所述展開位置樞轉的過程中，所述安裝塊插嵌至所述安裝槽內，以允許所述鎖定部卡合於所述配鎖部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a child safety seat, comprising: a seat portion; a backrest portion pivotally connected to the seat portion and pivotable relative to the seat portion between a deployed position and a folded position; and a locking mechanism operable to lock or unlock the pivoting between the backrest portion and the seat portion. The lower end of the backrest portion is provided with a mounting block, and the rear end of the seat portion is provided with a mounting groove for accommodating the mounting block. The locking mechanism comprises a movable locking part and a matching locking part cooperating with the locking part. The locking part is arranged on one of the mounting block and the mounting groove, and the matching locking part is arranged on the other of the mounting block and the mounting groove. During the pivoting of the backrest portion toward the deployed position, the mounting block is inserted into the mounting groove, allowing the locking part to engage with the matching locking part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:兒童安全座椅</p>
        <p type="p">100:背靠部</p>
        <p type="p">100A:第一背靠部</p>
        <p type="p">100B:第二背靠部</p>
        <p type="p">110:背靠本體，第一背靠組件</p>
        <p type="p">120:側翼部</p>
        <p type="p">122:定位部，容納凹部</p>
        <p type="p">130:樞接機構</p>
        <p type="p">131:樞接孔</p>
        <p type="p">132:樞接件</p>
        <p type="p">140:鎖定機構</p>
        <p type="p">150:扶手部</p>
        <p type="p">200:座位部</p>
        <p type="p">210:座位本體</p>
        <p type="p">211:安裝槽</p>
        <p type="p">220:樞接部</p>
        <p type="p">221:凹部</p>
        <p type="p">300:頭靠部</p>
        <p type="p">X:軸方向</p>
        <p type="p">Y:軸方向</p>
        <p type="p">Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2323" publication-number="202632630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻率可變顯示設備</chinese-title>
        <english-title>FREQUENCY VARIABLE DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260313B">G09G3/3233</main-classification>
        <further-classification edition="201601120260313B">G09G3/3208</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔錫民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SEOK MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, MOO-KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頻率可變顯示設備包含：子像素，包含：具有連接至第一節點之閘極電極及連接至第二節點之源極電極的驅動電晶體；具有連接至第二節點之陽極電極的發光元件；及具有連接至第一節點之電極及連接至第二節點之另一電極的儲存電容器；資料線，用以在閘極-源極設定週期使資料電壓被傳送至第一節點；以及參考電壓線，用以在閘極-源極設定週期使初始化電壓被傳送至第二節點，其中初始化電壓之電壓位準隨著發光元件劣化而增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a subpixel including a driving transistor having a gate electrode connected to a first node and a source electrode connected to a second node, a light emitting element having an anode electrode connected to the second node, and a storage capacitor having one electrode connected to the first node and another electrode connected to the second node, a data line configured to transfer a data voltage to the first node in a gate-source setting period, and a reference voltage line configured to transfer an initialization voltage to the second node in the gate-source setting period. A voltage level of the initialization voltage increases as the light emitting element is degraded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CT1:第一充電時間</p>
        <p type="p">CT2:第二充電時間</p>
        <p type="p">SCAN:掃描訊號</p>
        <p type="p">Vdata:資料電壓</p>
        <p type="p">VpreR:初始化電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2324" publication-number="202631721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C08F2/44</main-classification>
        <further-classification edition="200601120260504B">C08F2/50</further-classification>
        <further-classification edition="200601120260504B">C08G73/10</further-classification>
        <further-classification edition="200601120260504B">C08L79/08</further-classification>
        <further-classification edition="200601120260504B">C08K5/10</further-classification>
        <further-classification edition="200601120260504B">C08K5/1535</further-classification>
        <further-classification edition="200601120260504B">C08K5/32</further-classification>
        <further-classification edition="200601120260504B">C08K5/3417</further-classification>
        <further-classification edition="200601120260504B">C08K5/375</further-classification>
        <further-classification edition="200601120260504B">C08K5/45</further-classification>
        <further-classification edition="200601120260504B">G03F7/004</further-classification>
        <further-classification edition="200601120260504B">G03F7/027</further-classification>
        <further-classification edition="200601120260504B">G03F7/031</further-classification>
        <further-classification edition="200601120260504B">G03F7/038</further-classification>
        <further-classification edition="200601120260504B">G03F7/20</further-classification>
        <further-classification edition="200601120260504B">B32B15/08</further-classification>
        <further-classification edition="202601120260504B">H10P14/68</further-classification>
        <further-classification edition="202601120260504B">H10P76/20</further-classification>
        <further-classification edition="202601120260504B">H10W20/48</further-classification>
        <further-classification edition="202601120260504B">H10W70/60</further-classification>
        <further-classification edition="202601120260504B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野雅臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光硬化性樹脂組成物、將上述光硬化性樹脂組成物硬化而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法的半導體元件之製造方法及包含上述硬化物之半導體元件，該光硬化性樹脂組成物包含：光自由基聚合起始劑，包含由下述式（A-0）表示之結構；及樹脂，為具有聚合性基之聚醯亞胺及具有聚合性基之聚醯亞胺前驅物中的至少一者。  &lt;br/&gt;&lt;img align="absmiddle" height="123px" width="178px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2325" publication-number="202632018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含鉻與鈮的粉末冶金鋼及其製造方法</chinese-title>
        <english-title>POWDER-METALLURGICAL CHROMIUM- AND NIOBIUM-CONTAINING STEEL AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C22C33/02</main-classification>
        <further-classification edition="200601120260428B">C22C38/10</further-classification>
        <further-classification edition="200601120260428B">C22C38/12</further-classification>
        <further-classification edition="200601120260428B">C22C38/18</further-classification>
        <further-classification edition="200601120260428B">C22C27/00</further-classification>
        <further-classification edition="200601120260428B">C21D1/25</further-classification>
        <further-classification edition="200601120260428B">B22F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商奧鋼聯博樂特殊鋼有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOESTALPINE BOEHLER EDELSTAHL GMBH &amp; CO KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尊科　霍斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUNKO, HORST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗盧赫　賴納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUCH, RAINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾德　齊格弗里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELDER, SIEGFRIED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種粉末冶金鋼由以下組成物組成，以重量百分比(wt%)計：碳(C)：0.35%至0.6%，氮(N)：0.01%至0.3%，鉻(Cr)：12%至15%，鉬(Mo)：3%至5.5%，鈷(Co)：1.6%至5%，鈮(Nb)：1.2%至1.75%，以及可選的下列一或多種成分：矽(Si)：小於1.5%，錳(Mn)：小於1.5%，鎢(W)：小於0.5%，鎳(Ni)：小於0.5%，鋁(Al)：小於0.3%，釩(V)：小於1.0%，鈦(Ti)：小於1.0%，鉭(Ta)：小於0.5%，其餘為鐵(Fe)和偶發雜質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A powder-metallurgical steel consists of, in % in weight: C: 0.35% to 0.6%, N: 0.01% to 0.3%, Cr: 12% to 15%, Mo: 3% to 5.5%, Co: 1.6% to 5%, Nb: 1.2% to 1.75%, and optionally one or more of Si: less than 1.5%, Mn: less than 1.5%, W: less than 0.5%, Ni: less than 0.5%, Al: less than 0.3%, V: less than 1.0%, Ti: less than 1.0%, Ta: less than 0.5%, the balance being Fe and incidental impurities.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2326" publication-number="202632822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調變器集成型半導體雷射元件以及調變器集成型半導體雷射元件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01S5/026</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綿谷力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATATANI, CHIKARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻敏弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外間洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKAMA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的調變器集成型半導體雷射元件（100）的特徵在於：至少具有主動層（116）的半導體雷射部（110）、至少具有半絕緣層（128）和光波導層（126）的分離部（120）、以及至少具有光絕緣層（135）的調變器部（130）被集成在同一半絕緣基板上，且主動層（116）和光波導層（126）之間的界面在光波導方向上與面向半導體雷射部（110）的半絕緣層（128）的側面彼此分隔開，光波導層（126）和光吸收層（136）之間的界面在光波導方向上與面向調變器部(130)的半絕緣層(128)的側面彼此分隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:調變器集成型半導體雷射元件</p>
        <p type="p">102:絕緣膜</p>
        <p type="p">110:半導體雷射部</p>
        <p type="p">111:陽極電極</p>
        <p type="p">112:陰極電極</p>
        <p type="p">120:分離部</p>
        <p type="p">130:調變器部</p>
        <p type="p">131:陽極電極</p>
        <p type="p">132:陰極電極</p>
        <p type="p">140:光點尺寸轉換部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2327" publication-number="202633213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型發光二極體晶片、用於微型發光二極體的反射鏡層及其形成方法及光阻環</chinese-title>
        <english-title>MICRO-LED CHIP, REFLECTIVE MIRROR LAYER FOR MICRO-LED AND METHOD FOR FORMING THE SAME, AND PHOTORESIST RING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260311B">H10H20/01</main-classification>
        <further-classification edition="202501120260311B">H10H20/856</further-classification>
        <further-classification edition="202601120260311B">H10H29/24</further-classification>
        <further-classification edition="202501120260311B">H10H29/856</further-classification>
        <further-classification edition="200601120260311B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於微型發光二極體的反射鏡層，所述反射鏡層被配置為將來自發光台面的光向出光側反射並且所述發光台面朝向出光側的上表面的面積大於背向出光側的下表面的面積，其中所述反射鏡層包括：主體部，其被佈置為覆蓋發光台面的下表面並圍繞發光台面的側面；以及邊緣部，其與主體部的邊緣連接且與所述主體部之間成大於0°的夾角，其中相鄰微型發光二極體的反射鏡層的邊緣部彼此斷開。本發明還涉及一種製造反射鏡層的方法。可以減少反射鏡層的缺陷，進而提高微型發光二極體的發光效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a reflective mirror layer for a micro-LED, and the reflective mirror layer is configured to reflect light from the light-emitting mesa toward the light extraction side, and the area of the upper surface of the light-emitting mesa facing the light extraction side is greater than the area of the lower surface facing away from the light extraction side, wherein the reflective mirror layer includes: a main body portion arranged to cover the lower surface of the light-emitting mesa and surround the side surface of the light-emitting mesa; and an edge portion connected with the edge of the main body portion and forming an angle greater than 0° with the main body portion, wherein the edge portions of the reflective mirror layers of adjacent micro-LEDs are disconnected from each other. The present invention also relates to a method for manufacturing the reflective mirror layer. Defects in the reflective mirror layer can be reduced, and thus the luminous efficiency of the micro-LED is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:發光台面</p>
        <p type="p">101A:第二外延層</p>
        <p type="p">101B:發光層</p>
        <p type="p">101C:第一外延層</p>
        <p type="p">102:反射鏡層</p>
        <p type="p">102A:主體部</p>
        <p type="p">102B:邊緣部</p>
        <p type="p">103:鈍化層</p>
        <p type="p">104:臨時基底</p>
        <p type="p">105:透明導電層</p>
        <p type="p">A:上表面</p>
        <p type="p">B:下表面</p>
        <p type="p">α:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2328" publication-number="202632022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅銀合金線材及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C22F1/08</main-classification>
        <further-classification edition="200601120260310B">C22C9/00</further-classification>
        <further-classification edition="200601120260310B">H01B5/02</further-classification>
        <further-classification edition="200601120260310B">H01B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＷＣＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWCC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大達剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODACHI, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, KIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明獲得至少具有優異之拉伸強度的銅銀合金製極細線材。&lt;br/&gt;  一種銅銀合金線材之製造方法，其特徵在於，至少包含下述步驟：(a)藉由銅銀合金的連續鑄造獲得原材料的步驟，銅銀合金係銀的含量為10wt%以上且25wt%以下，剩餘部分由銅及不可避免之雜質所構成；及(b)對原材料實施至少1次以上的拉線處理及熱處理，獲得線材的步驟，作為(b)中的熱處理，包含僅在加工度為1.5以上且3.5以下時執行之中間熱處理，關於經過(b)之該線材，線徑為0.050mm以下，加工度為10以上，拉伸強度為1500MPa以上及導電率為40%IACS以上。又，較佳可獲得線徑為0.020mm以下，加工度為13以上及拉伸強度為1700MPa以上，更佳為線徑為0.010mm以下，加工度為14以上及拉伸強度為2000MPa以上的線材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2329" publication-number="202631925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相分離結構形成用樹脂組成物、含有相分離結構的結構體之製造方法，及嵌段共聚物</chinese-title>
        <english-title>RESIN COMPOSITION FOR FORMING PHASE-SEPARATED STRUCTURE, METHOD FOR PRODUCING STRUCTURE HAVING PHASE-SEPARATED STRUCTURE, AND A BLOCK COPOLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260428B">C09J7/29</main-classification>
        <further-classification edition="200601120260428B">C08L53/02</further-classification>
        <further-classification edition="200601120260428B">C08F297/00</further-classification>
        <further-classification edition="200601120260428B">C08F293/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬下武広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHIMO, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太宰尚宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAZAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川晃鏡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, TERUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前川伸祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEKAWA, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供能夠形成垂直配向性及蝕刻耐性優良的相分離結構的相分離結構形成用樹脂組成物等。  &lt;br/&gt;　　[解決手段]一種相分離結構形成用樹脂組成物，其含有嵌段共聚物(A)，嵌段共聚物(A)依以下順序具有嵌段(A1)、嵌段(A2)，及嵌段(A3)，嵌段(A1)係由式(a1)表示之結構單元之重複結構構成之聚合物所構成，嵌段(A2)係由具有式(a2-1)表示之結構單元的聚合物所構成，嵌段(A3)係由式(a3-1)表示之結構單元，及式(a3-2)表示之結構單元無規地排列的結構構成之無規共聚物所構成。式(a2-1)中，R&lt;sup&gt;a21&lt;/sup&gt;係具有矽原子的取代基。  &lt;br/&gt;&lt;img align="absmiddle" height="249px" width="469px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2330" publication-number="202633190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102603</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護電路和具備該保護電路的半導體裝置</chinese-title>
        <english-title>PROTECTION CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE PROTECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260323B">H10D89/60</main-classification>
        <further-classification edition="202601120260323B">H10W42/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾普凌科有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冨岡勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIOKA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠對保護物件進行保護而免受施加相反極性的電源電壓的影響的保護電路等。本發明是形成於包括襯底區域（510）、形成於襯底區域（510）的第1導電型的區域以及形成於襯底區域（510）的第2導電型的區域的半導體襯底（50A）並保護被保護電路而免受施加與穩定狀態相反的極性的電源電壓的影響的保護電路（20A），前述被保護電路包括雜訊發生源，在VDD端子（1）與GND端子（2）之間經由保護電路（20A）而與GND端子（2）連接。保護電路（20A）具有：第1保護電晶體（以下，Tr），其包括與和第1電路的節點連接的源極及背柵；第2保護Tr，其包括保持不與前述第1電路連接狀態地與和第2電路連接的節點連接的源極及背柵；以及分隔壁（531），其設置於第1保護Tr和第2保護Tr的電極並排的方向上的第1保護Tr和第2保護Tr之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:GND端子</p>
        <p type="p">10A:半導體裝置</p>
        <p type="p">20A:保護電路</p>
        <p type="p">21:NMOS電晶體(第1保護電晶體)</p>
        <p type="p">22:NMOS電晶體(第2保護電晶體)</p>
        <p type="p">50:半導體襯底</p>
        <p type="p">510:襯底區域</p>
        <p type="p">531:分隔壁</p>
        <p type="p">551:絕緣層</p>
        <p type="p">552:絕緣層</p>
        <p type="p">D:漏極</p>
        <p type="p">G:柵極</p>
        <p type="p">S:源極</p>
        <p type="p">B:背柵</p>
        <p type="p">N2,N3,N4,N5:節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2331" publication-number="202633239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102607</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種微顯示面板及其製造方法、像素化投影燈</chinese-title>
        <english-title>MICRO-DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME AND PIXELATED PROJECTION LAMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260423B">H10H29/851</main-classification>
        <further-classification edition="202501120260423B">H10H29/85</further-classification>
        <further-classification edition="202501120260423B">H10H29/30</further-classification>
        <further-classification edition="202501120260423B">H10H29/01</further-classification>
        <further-classification edition="202501120260423B">H10H20/851</further-classification>
        <further-classification edition="200601120260423B">C09K11/02</further-classification>
        <further-classification edition="200601120260423B">C09K11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王筱臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周章英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZHANGYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐晨超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHENCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種微顯示面板，其包括基板、微發光二極體顯示晶片、螢光層以及封裝層。其中微發光二極體顯示晶片位於基板上，微發光二極體顯示晶片邊緣具有金屬墊，金屬墊與基板的未被微發光二極體顯示晶片覆蓋的區域電連接，螢光層位於微發光二極體顯示晶片的表面，封裝層包覆基板的暴露的區域、以及微發光二極體顯示晶片與基板之間電連接的區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a micro-display panel, which includes a substrate, a micro-LED display chip, a fluorescent layer, and a package layer. The micro-LED display chip is located on the substrate, and the edge of the micro-LED display chip has metal pads, and the metal pads are electrically connected with the area of the substrate that is not covered by the micro-LED display chip, and the fluorescent layer is located on the surface of the micro-LED display chip, and the package layer covers the exposed area of the substrate and the area where the micro-LED display chip is electrically connected with the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:基板</p>
        <p type="p">102:微發光二極體顯示晶片</p>
        <p type="p">103:螢光層</p>
        <p type="p">104:圍壩</p>
        <p type="p">105:封裝層</p>
        <p type="p">106:金屬鍵合線</p>
        <p type="p">107:黏接層</p>
        <p type="p">111:外接焊墊</p>
        <p type="p">112:上金屬墊</p>
        <p type="p">121:發光區域</p>
        <p type="p">122:驅動背板</p>
        <p type="p">123:金屬墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2332" publication-number="202633216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有啞元發光檯面的微型發光二極體及其晶片</chinese-title>
        <english-title>MICRO-LED AND CHIP WITH DUMMY LIGHT-EMITTING MESA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">H10H20/819</main-classification>
        <further-classification edition="202501120260312B">H10H20/811</further-classification>
        <further-classification edition="202501120260312B">H10H20/85</further-classification>
        <further-classification edition="202501120260312B">H10H20/853</further-classification>
        <further-classification edition="202501120260312B">H10H20/854</further-classification>
        <further-classification edition="202501120260312B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有啞元發光檯面的微型發光二極體，包括多個發光檯面以及鈍化層。每個發光檯面包括底部透明導電層、第一外延層、發光層以及第二外延層。第一外延層佈置在底部透明導電層與發光層之間。發光層佈置在第一外延層與第二外延層之間且被配置為發光。第二外延層佈置在發光層上，其中所述發光檯面在靠近第二外延層的上表面的面積大於靠近第一外延層的下表面的面積。鈍化層覆蓋所述發光檯面的下表面和側面，其中所述發光檯面包括第一發光檯面和啞元發光檯面，其中第一發光檯面上的鈍化層具有缺口以露出底部透明導電層，並且啞元發光檯面上的鈍化層不具有缺口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro-LED having a dummy light-emitting mesa comprises a plurality of light-emitting mesas and a passivation layer is provided. Each of the light-emitting mesas comprises a bottom transparent conductive layer, a first epitaxial layer, a light-emitting layer, and a second epitaxial layer. The first epitaxial layer is disposed between the bottom transparent conductive layer and the light-emitting layer. The light-emitting layer is disposed between the first epitaxial layer and the second epitaxial layer and is configured to emit light. The second epitaxial layer is disposed on the light-emitting layer, wherein an area of the light-emitting mesa near an upper surface of the second epitaxial layer is greater than an area of the light-emitting mesa near a lower surface of the first epitaxial layer. The passivation layer covers the lower surface and a side surface of the light-emitting mesa, wherein the light-emitting mesas include a first light-emitting mesa and a dummy light-emitting mesa, wherein the passivation layer on the first light-emitting mesa has a notch to expose the bottom transparent conductive layer, and the passivation layer on the dummy light-emitting mesa does not have a notch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外延片</p>
        <p type="p">101:第一發光檯面</p>
        <p type="p">101A:底部透明導電層</p>
        <p type="p">101B:第一外延層</p>
        <p type="p">101C:發光層</p>
        <p type="p">101D:第二外延層</p>
        <p type="p">1011:階梯部</p>
        <p type="p">1012:基底部</p>
        <p type="p">102:啞元發光檯面</p>
        <p type="p">103:臨時襯底</p>
        <p type="p">104:緩衝層</p>
        <p type="p">105:鈍化層</p>
        <p type="p">106:缺口</p>
        <p type="p">107:切割道</p>
        <p type="p">AA:發光區</p>
        <p type="p">NA:非發光區</p>
        <p type="p">A:出光側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2333" publication-number="202631722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多官能乙烯基化合物及其組成物、以及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260401B">C08F2/44</main-classification>
        <further-classification edition="200601120260401B">C08F290/00</further-classification>
        <further-classification edition="200601120260401B">C08F299/02</further-classification>
        <further-classification edition="200601120260401B">C08G65/48</further-classification>
        <further-classification edition="200601120260401B">H01B3/30</further-classification>
        <further-classification edition="202601120260401B">H10W70/695</further-classification>
        <further-classification edition="202601120260401B">H10W74/10</further-classification>
        <further-classification edition="202601120260401B">H10W74/47</further-classification>
        <further-classification edition="200601120260401B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大村昌己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大神浩一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAMI, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瑞斯塔　尼藍詹　庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHRESTHA, NIRANJAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種溶劑溶解性優異，且耐熱性、熱分解穩定性、熱傳導性、低介電常數、低介質損失角正切、難燃性優異的化合物，以及含有該化合物的硬化性樹脂組成物。得到以下述通式（1）表示的多官能乙烯基化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="226px" width="470px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;   &lt;br/&gt;式（1）中，X獨立地表示式（2）所示的結構、苯甲腈結構、二苯基磺醯基結構、亞二甲苯基結構、或-（CH&lt;sub&gt;2&lt;/sub&gt;）&lt;sub&gt;m&lt;/sub&gt;-，m表示3～10的數，n表示0～15的數。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="108px" width="360px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2334" publication-number="202633277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成塗膜的方法、塗膜形成系統以及中介基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260430B">H10P14/68</main-classification>
        <further-classification edition="200601120260430B">B05D7/22</further-classification>
        <further-classification edition="200601120260430B">B05C11/10</further-classification>
        <further-classification edition="202601120260430B">H10W70/05</further-classification>
        <further-classification edition="202601120260430B">H10W70/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅井一夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤俊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>筏敏晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKADA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木克己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種防止因形成於無機材料之薄板之貫通孔內部所配置之金屬熱膨脹引起之薄板破損的方法。具體而言，其係在形成於包含無機材料之薄板之中介基板之貫通孔之內壁形成塗膜的方法，且上述中介基板係介置於半導體晶片與配線基板之間，或半導體晶片與其他半導體晶片之間，進行兩者之電性導通之中介層之前驅物，且該形成塗膜的方法包含：塗敷步驟，其於上述中介基板之一面，塗敷包含有機物之溶液；及抽吸步驟，其自上述中介基板之另一面對上述貫通孔內進行抽吸，於上述貫通孔之內壁塗佈上述溶液，且於上述貫通孔中使上述一面側與上述另一面側連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:含有機物之溶液(包含有機物之溶液)</p>
        <p type="p">12:正面硬化塗膜(正面側塗膜)</p>
        <p type="p">15:通孔內壁硬化塗膜(貫通孔內壁之塗膜)</p>
        <p type="p">17:背面側硬化塗膜(背面側塗膜)</p>
        <p type="p">31:通孔(貫通孔)</p>
        <p type="p">35:通孔(貫通孔)</p>
        <p type="p">70:抽吸口</p>
        <p type="p">75:間隔件</p>
        <p type="p">80:塗佈機(塗敷構件)</p>
        <p type="p">92:抽吸裝置(抽吸構件)</p>
        <p type="p">100:中介基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2335" publication-number="202633217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型發光二極體的發光台面及其形成方法、以及微型發光二極體晶片</chinese-title>
        <english-title>LIGHT-EMITTING MESA FOR MICRO-LED AND METHOD FOR FORMING THE SAME, AND MICRO-LED CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">H10H20/819</main-classification>
        <further-classification edition="202501120260312B">H10H20/812</further-classification>
        <further-classification edition="202501120260312B">H10H29/30</further-classification>
        <further-classification edition="202501120260312B">H10H20/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於微型發光二極體的發光台面及其形成方法、以及微型發光二極體晶片。所述發光台面包括：從發光台面的背向出光側的一側往發光台面的朝向出光側的一側而設置的透明導電層、第一外延層、發光層以及第二外延層，其中，透明導電層設置在發光台面的背向出光側的一側；第一外延層設置在透明導電層與發光層之間；發光層設置在第一外延層與第二外延層之間，且發光層構成為用以發光；第二外延層設置在發光台面的朝向出光側的一側，其中，第二外延層的面積大於第一外延層的面積，發光台面的側面具有傾斜面，所述傾斜面的傾斜角度為55°至75°。本發明可以顯著提高微型發光二極體的開口率，從而提高微型發光二極體的發光量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a light-emitting mesa for a micro-LED, a method for forming the same, and a micro-LED chip. The light-emitting mesa includes: a transparent conductive layer, a first epitaxial layer, a light-emitting layer and a second epitaxial layer arranged from a side of the light-emitting mesa facing away from a light extraction side toward a side of the light-emitting mesa facing the light extraction side. The transparent conductive layer is arranged on the side of the light-emitting mesa facing away from the light extraction side. The first epitaxial layer is arranged between the transparent conductive layer and the light-emitting layer. The light-emitting layer is arranged between the first epitaxial layer and the second epitaxial layer, and the light-emitting layer is configured to emit light. The second epitaxial layer is arranged on the side of the light-emitting mesa facing the light extraction side. An area of the second epitaxial layer is greater than an area of the first epitaxial layer, and a side surface of the light-emitting mesa has an inclined surface, and an inclination angle of the inclined surface is 55° to 75°. An aperture ratio of the micro-LED can be significantly improved, so that its light output is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光台面</p>
        <p type="p">100A:第一傾斜邊緣</p>
        <p type="p">100B:第二傾斜邊緣</p>
        <p type="p">101:透明導電層</p>
        <p type="p">102:第一外延層</p>
        <p type="p">103:發光層</p>
        <p type="p">104:第二外延層</p>
        <p type="p">105:標記層</p>
        <p type="p">106:臨時襯底</p>
        <p type="p">α:側面傾斜角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2336" publication-number="202631069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102710</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備及其控制方法、介質及系統</chinese-title>
        <english-title>CLEANING DEVICE AND CONTROL METHOD, MEDIUM AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260327B">A47L11/30</main-classification>
        <further-classification edition="200601120260327B">A47L11/40</further-classification>
        <further-classification edition="200601120260327B">A47L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊嘉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIAPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王礪鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種清潔設備及其控制方法、介質及系統，所述清潔設備包括：加熱器，所述加熱器配置為：加熱液體；液體泵，與所述加熱器連接，所述液體泵配置為：向所述液體泵供應液體；溫度檢測裝置，設於所述加熱器，所述溫度檢測裝置配置為：採集加熱器溫度；控制器，所述控制器配置為：在熱液體模式下，獲取所述溫度檢測裝置採集的加熱器溫度；如果所述加熱器溫度小於第一溫度的持續時長大於第一時長，則控制所述液體泵降低向所述加熱器供應液體的流量；和/或如果所述加熱器溫度小於第二溫度，則控制所述加熱器啟動運行。通過本申請提供的技術方案能夠保證清潔設備在熱液體模式下執行清潔任務的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a cleaning device and a control method, medium and system thereof. The cleaning device includes: a heater configured to heat a liquid; a liquid pump connected to the heater, configured to supply liquid to the liquid pump; a temperature detection apparatus disposed on the heater, configured to collect temperature of the heater; a controller configured to: in a hot liquid mode, acquire temperature of the heater collected by the temperature detection apparatus; if the duration during which temperature of the heater is below a first temperature exceeds a first time period, control the liquid pump to reduce the flow rate of liquid supplied to the heater; and/or if temperature of the heater is below a second temperature, control the heater to start operation. The technical solution provided by this application ensures the reliability of the cleaning device when performing cleaning tasks in the hot liquid mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:清潔設備</p>
        <p type="p">102:液體檢測裝置</p>
        <p type="p">109:加熱器</p>
        <p type="p">113:液體泵</p>
        <p type="p">116:清潔件</p>
        <p type="p">117:溫度檢測裝置</p>
        <p type="p">300:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2337" publication-number="202633240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微發光二極體顯示晶片</chinese-title>
        <english-title>MICRO-LED DISPLAY CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">H10H29/855</main-classification>
        <further-classification edition="202501120260312B">H10H29/85</further-classification>
        <further-classification edition="202501120260312B">H10H29/45</further-classification>
        <further-classification edition="202501120260312B">H10H29/30</further-classification>
        <further-classification edition="200601120260312B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋皇劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, HUANGJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種微發光二極體顯示晶片，其包括發光區域、金屬層以及遮擋層，其中發光區域包括微發光二極體陣列，其中微發光二極體陣列包括若干微發光二極體，金屬層位於微發光二極體陣列的外圍，金屬層至少一部分與微發光二極體陣列電連接，遮擋層至少位於部分金屬層的表面或上方。通過設置遮擋層，可使得發光區域發出的光線經過外界反射達到遮擋區表面後產生反射，以有效地提升畫面顯示品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses a micro-LED display chip including a light-emitting area, a metal layer, and a shielding layer, wherein the light-emitting area includes a micro-LED array, wherein the micro-LED array includes a plurality of micro-LEDs, and the metal layer is located at the periphery of the micro-LED array, and at least a part of the metal layer is electrically connected with the micro-LED array, and the shielding layer is located on the surface of or above at least a part of the metal layer. By arranging the shielding layer, light emitted from the light-emitting area can be reflected after being reflected by the outside and reaching the surface of the shielding area, so as to effectively improve the display quality of the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:發光區域</p>
        <p type="p">302:非發光區域</p>
        <p type="p">A-A:線</p>
        <p type="p">4311:連續金屬區</p>
        <p type="p">4312:金屬墊</p>
        <p type="p">4313:第一區</p>
        <p type="p">4314:第二區</p>
        <p type="p">4315:標記區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2338" publication-number="202632900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多脈衝信號柔性驅動調節裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260328B">H03K5/156</main-classification>
        <further-classification edition="200601120260328B">H03K17/08</further-classification>
        <further-classification edition="200601120260328B">H03F3/24</further-classification>
        <further-classification edition="200601120260328B">H03F3/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐亞海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂衛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹宏金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱盛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈聖鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林芳成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于傳浪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多脈衝信號柔性驅動調節裝置及方法，屬於射頻電源技術領域，解決了兩級相異的脈衝信號在切換過程中容易產生衝突、導致功率放大器中全開關電晶體導通的問題。在該裝置中，多脈衝產生器生成多級脈衝信號；切換器對多脈衝產生器輸出的脈衝信號進行切換；在多級脈衝信號切換過渡期間：切換使能控制器，根據切換前後脈衝信號的級別，逐階段生成脈衝切換調節信號，以控制功率、頻率中的至少一項輸出斜坡式逐步拉升或逐步下降；並根據逐階段生成的脈衝切換調節信號，逐階段生成功率放大器的控制信號；射頻電源的功率放大器，基於功率放大器的控制信號對射頻電源進行驅動，逐階段對應調節多級脈衝信號切換過渡期間射頻電源的輸出功率及頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2339" publication-number="202632751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電弧抑制優化方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260328B">H01J37/32</main-classification>
        <further-classification edition="200601120260328B">H03K7/08</further-classification>
        <further-classification edition="200601120260328B">H02H1/04</further-classification>
        <further-classification edition="200601120260328B">H01J37/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市恒運昌真空技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN CSL VACUUM SCIENCE AND TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐亞海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂衛平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹宏金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱盛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈聖鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林芳成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于傳浪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電弧抑制優化方法，屬於電弧抑制技術領域，解決了現有等離子體腔電弧抑制效果不高的問題。該方法包括：當有電弧產生時，啟動電弧抑制操作：將射頻電源的輸出自恆定信號輸出轉換成脈衝輸出；經過預設時長後，將射頻電源的輸出轉換回恆定信號輸出。該方法能夠實現電弧抑制的平穩過渡，避免電力輸出的突然下降，能夠有效提升電弧抑制的穩定性和精度，提升設備的適用壽命。同時，在經過預設時長後，將射頻電源的輸出轉換回恆定信號輸出，有效解決了長時間電弧抑制對設備正常運行造成的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2340" publication-number="202632436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載台設備、微影設備、物品製造方法及載台設備的驅動方法</chinese-title>
        <english-title>STAGE APPARATUS, LITHOGRAPHY APPARATUS, ARTICLE MANUFACTURING METHOD, AND DRIVING METHOD FOR STAGE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">G03F7/20</main-classification>
        <further-classification edition="202601120260504B">H10P72/30</further-classification>
        <further-classification edition="200601120260504B">H02K41/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桜川寛大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAKAWA, NORIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">載台設備、微影設備、物品製造方法及載台設備的驅動方法  &lt;br/&gt;　　提供了一種載台設備。該載台設備包括：第一載台；第一致動器，該第一致動器設置成驅動第一載台；第二載台，該第二載台由第一載台支撑；第二致動器，該第二致動器設置成將由第一致動器施加到第一載台的推力無接觸地傳遞到第二載台；驅動器，該驅動器設置成驅動第二致動器；以及控制器，該控制器設置成控制第一致動器和驅動器。在藉由使用第一致動器向第一載台施加電制動的情況下，控制器設置成在從停止從驅動器輸出用於控制第二致動器的控制訊號起經過預定時間之後施加電制動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stage apparatus is provided. The stage apparatus includes: a first stage; a first actuator configured to drive the first stage; a second stage supported by the first stage; a second actuator configured to contactlessly transmit a thrust applied to the first stage by the first actuator to the second stage; a driver configured to drive the second actuator; and a controller configured to control the first actuator and the driver. In a case of applying an electric brake to the first stage by using the first actuator, the controller is configured to apply the electric brake after a lapse of a predetermined time since output of control signal for controlling the second actuator from the driver is stopped.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:載台設備</p>
        <p type="p">101:粗動載台</p>
        <p type="p">102:微動載台</p>
        <p type="p">103a:致動器</p>
        <p type="p">103b:致動器</p>
        <p type="p">104:磁體</p>
        <p type="p">105:線圈</p>
        <p type="p">106a:致動器</p>
        <p type="p">106b:致動器</p>
        <p type="p">107:衝擊吸收單元</p>
        <p type="p">108:控制器</p>
        <p type="p">109a:線圈選擇器</p>
        <p type="p">109b:線圈選擇器</p>
        <p type="p">110a:切換單元</p>
        <p type="p">110b:切換單元</p>
        <p type="p">111:位置測量單元</p>
        <p type="p">112:制動訊號</p>
        <p type="p">113:致動器</p>
        <p type="p">114:驅動器</p>
        <p type="p">115a:線圈陣列</p>
        <p type="p">115b:線圈陣列</p>
        <p type="p">116a:電磁體</p>
        <p type="p">116b:電磁體</p>
        <p type="p">126a:磁體</p>
        <p type="p">126b:磁體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2341" publication-number="202633351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>裝載端口、收納容器和側方基板支撐部</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260401B">H10P72/30</main-classification>
        <further-classification edition="202601120260401B">H10P72/10</further-classification>
        <further-classification edition="202601120260401B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商未來兒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRAIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田玲介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供裝載端口、收納容器和側方基板支撐部。裝載端口（L1）能相對於可收納被收納物（W）的收納容器（1）將被收納物（W）從收納容器（1）搬出和向收納容器搬入，被收納物是基板（W）或支撐基板的基板支撐器具，具備檢測收納容器（1）中有無被收納物（W）的映射臂（L30），映射臂（L30）具備可檢測收納容器（1）的內部形狀的形狀檢測部（L322）。形狀檢測部具有檢測側方基板支撐部（5）的形狀或容器主體（1）的內壁的形狀的感測器（L322），檢測在基板收納空間（27）內成對的側方基板支撐部（5）的一方或雙方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:容器主體</p>
        <p type="p">22:內壁</p>
        <p type="p">25:第一側壁</p>
        <p type="p">26:第二側壁</p>
        <p type="p">244:底板</p>
        <p type="p">5:基板支撐板狀部</p>
        <p type="p">51:板部</p>
        <p type="p">501:前端部</p>
        <p type="p">6:內側基板支撐部</p>
        <p type="p">60:內側端緣支撐部</p>
        <p type="p">L1:裝載端口</p>
        <p type="p">L10:裝置主體</p>
        <p type="p">L11:貫通孔</p>
        <p type="p">L22:承載部</p>
        <p type="p">L30:映射臂</p>
        <p type="p">L31:臂基部</p>
        <p type="p">L32:映射器</p>
        <p type="p">L3201:對置面</p>
        <p type="p">L3202:斜面</p>
        <p type="p">L321:映射感測器</p>
        <p type="p">L322:感測器</p>
        <p type="p">D11,D12,D1,D31,D32,D3:方向</p>
        <p type="p">W:基板(被收納物)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2342" publication-number="202633352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流量測量裝置及流量測量系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10P72/30</main-classification>
        <further-classification edition="202201120260422B">G01F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椿達雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKI, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">流量測量裝置，與淨化裝置的至少一個供氣噴嘴連接，並測量從淨化裝置供應的淨化氣體的供應流量。流量測量裝置，具備有：至少一個導入部，與供氣噴嘴連接，以導入淨化氣體；一次配管，與導入部連接；流量測量器，設置於一次配管，並測量流動於一次配管的淨化氣體的流量；複數個二次配管，透過分歧部與一次配管的下游側連接；及流路切換部，將淨化氣體的流路切換至複數個二次配管中至少任一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">SB:流量測量系統</p>
        <p type="p">7:載置部</p>
        <p type="p">20:淨化裝置</p>
        <p type="p">22:供氣配管</p>
        <p type="p">23:MFC(控制器)</p>
        <p type="p">24A,24B:供氣管</p>
        <p type="p">25A,25B:供氣噴嘴</p>
        <p type="p">26:壓力計</p>
        <p type="p">30:流量測量裝置</p>
        <p type="p">34:底板部</p>
        <p type="p">40A,40B:流路阻力單元</p>
        <p type="p">41A,41B:導入部</p>
        <p type="p">42A,42B:一次配管</p>
        <p type="p">43:流量測量器</p>
        <p type="p">45:分歧部</p>
        <p type="p">46,47:二次配管</p>
        <p type="p">48:小流量用阻力元件</p>
        <p type="p">49:大流量用阻力元件</p>
        <p type="p">50:三通閥(流路切換部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2343" publication-number="202631248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成分系統</chinese-title>
        <english-title>COMPONENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260428B">B01F33/00</main-classification>
        <further-classification edition="200601120260428B">C09K21/02</further-classification>
        <further-classification edition="202201120260428B">C09K23/00</further-classification>
        <further-classification edition="200601120260428B">C09J5/00</further-classification>
        <further-classification edition="200601120260428B">C04B35/185</further-classification>
        <further-classification edition="200601120260428B">C21B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＥＫＷ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EKW GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦策克　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONZECK, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克勒　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COELLE, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威倫韋伯　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLENWEBER, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用作在冶金爐（2）中生產熱保護層（34）的可水混合乾混料的成分系統，其中所述冶金爐（2）的牆體（12）將腔室（10）與外部空間（14）分隔開，所述熱保護層（34）被設計為能夠實現面向所述腔室（10）的化學保護層（38）與機械穩定外殼（30）之間可控的溫度下降，所述成分系統包括：耐火骨料，包含隔熱材料，其中所述隔熱材料選自氧化鋁、矽酸鋁、二氧化矽、氧化鎂或氧化鋯，或選自氧化鋁、矽酸鋁、二氧化矽、氧化鎂或氧化鋯的組合；包含水泥的黏合劑，用於通過與水反應進行化學硬化；以及含有化學兩親性材料的發泡劑，其中，當將所述乾混料與水混合時，所述兩親性材料的親水部分留在水中，所述兩親性材料的疏水部分朝向空氣或其他疏水物質，以降低水的表面張力並穩定氣泡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:腔室</p>
        <p type="p">12:牆體</p>
        <p type="p">14:外部空間</p>
        <p type="p">16:加熱系統</p>
        <p type="p">18:塊體</p>
        <p type="p">2:通道感應爐</p>
        <p type="p">20:通道</p>
        <p type="p">22:感應線圈</p>
        <p type="p">24:隔熱體</p>
        <p type="p">26:軸線</p>
        <p type="p">28:出口</p>
        <p type="p">3:發泡劑</p>
        <p type="p">30:外殼</p>
        <p type="p">32:凸緣</p>
        <p type="p">34:熱保護層</p>
        <p type="p">36:板</p>
        <p type="p">38:塗層</p>
        <p type="p">4:縱向方向</p>
        <p type="p">40:永久襯裡</p>
        <p type="p">42:耐磨襯裡</p>
        <p type="p">6:橫向方向</p>
        <p type="p">8:垂直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2344" publication-number="202632633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光資料映射電路、顯示控制裝置及背光控制資料映射方法</chinese-title>
        <english-title>BACKLIGHT DATA MAPPING CIRCUIT, DISPLAY CONTROL DEVICE AND BACKLIGHT CONTROL DATA MAPPING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260225B">G09G3/34</main-classification>
        <further-classification edition="200601120260225B">G06F12/02</further-classification>
        <further-classification edition="200601120260225B">G11C8/18</further-classification>
        <further-classification edition="202001120260225B">H05B45/32</further-classification>
        <further-classification edition="200601120260225B">G02F1/13357</further-classification>
        <further-classification edition="202001120260225B">H05B45/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張書瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIEN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種背光資料映射電路，其包括記憶體控制電路、映射控制電路及排列電路。記憶體控制電路用來將對應於背光面板的複數個背光區域的原始工作週期資訊依序寫入第一記憶體單元。映射控制電路用來根據重映射表將原始工作週期資訊轉換成映射後的工作週期資訊，並將映射後的工作週期資訊儲存至第二記憶體單元。重映射表包括複數個位置索引號，用來指示第一記憶體單元或第二記憶體單元的相應位置。排列電路用來根據背光區域至驅動器輸出映射資訊將映射後的工作週期資訊轉換成符合背光驅動器輸出格式的重排後的工作週期資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight data mapping circuit is provided. The backlight data mapping circuit includes a memory control circuit, a mapping control circuit and an arrangement circuit. The memory control circuit is configured to sequentially write original duty cycle information corresponding to a plurality of backlight zones of a backlight panel into a first memory unit. The mapping control circuit is configured to convert the original duty cycle information into mapped duty cycle information according to a remapping table and store the mapped duty cycle information into a second memory unit. The remapping table comprises a plurality of location index numbers that indicate respective locations of the first memory unit or the second memory unit. The arrangement circuit is configured to convert the mapped duty cycle information into rearranged duty cycle information matching a backlight driver output format according to backlight-zone-to-driver-output mapping information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:顯示控制裝置</p>
        <p type="p">400:背光資料映射電路</p>
        <p type="p">402:記憶體控制電路</p>
        <p type="p">404:映射控制電路</p>
        <p type="p">406:排列電路</p>
        <p type="p">410:局部調光控制電路</p>
        <p type="p">420,430,440,450,460:記憶體單元</p>
        <p type="p">470:微控制器單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2345" publication-number="202632629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻率可變顯示設備</chinese-title>
        <english-title>FREQUENCY VARIABLE DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260204B">G09G3/3225</main-classification>
        <further-classification edition="201601120260204B">G09G3/3258</further-classification>
        <further-classification edition="201601120260204B">G09G3/3208</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔錫民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SEOK MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, MOO-KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種頻率可變顯示設備。頻率可變顯示設備中，一個幀週期包含垂直主動週期，在垂直主動週期期間資料電壓被輸入至子像素；及垂直空白週期，垂直空白週期跟隨垂直主動週期且在垂直空白週期期間資料電壓未被輸入至子像素。此外，在顯示面板以低於可變幀頻率範圍內之預定最大幀頻率之幀頻率驅動的這一個幀週期中，施加至子像素之掃描訊號具有一個閘極導通週期以使連接於資料線與驅動電晶體之間的第一開關電晶體導通，且施加至子像素之感測訊號具有兩個或更多個閘極導通週期以使連接於驅動電晶體與參考電壓線之間的第二開關電晶體導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A frequency variable display apparatus is provided. In the frequency variable display apparatus, one frame period comprises a vertical active period during which a data voltage is input to a subpixel and a vertical blank period which follows the vertical active period and during which the data voltage is not input to the subpixel. Also, in the one frame period with a frame frequency lower than a predetermined maximum frame frequency in a variable frame frequency range, a scan signal applied to the subpixel has one gate on period to turn on a first switch transistor connected between a data line and a driving transistor, and the sense signal applied to the subpixel has two or more gate on periods to turn on a second switch transistor connected between the driving transistor and a reference voltage line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">SCAN:掃描訊號</p>
        <p type="p">SEN:感測訊號</p>
        <p type="p">TA:程式化週期</p>
        <p type="p">TB1,TB2:升壓週期</p>
        <p type="p">TE1,TE2:發光週期</p>
        <p type="p">TC:複製程式化週期</p>
        <p type="p">E-VgsW-Vgs,B-Vgs:閘極-源極電壓差</p>
        <p type="p">Vdata:資料電壓</p>
        <p type="p">Vg:閘極電壓</p>
        <p type="p">Vs:源極電壓</p>
        <p type="p">VON:閘極導通電壓</p>
        <p type="p">VOFF:閘極關斷電壓</p>
        <p type="p">VpreR:初始化電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2346" publication-number="202631608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磺醯胺類衍生物及其醫藥用途</chinese-title>
        <english-title>SULFONAMIDE DERIVATIVES AND PHARMACEUTICAL USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D413/14</main-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D498/04</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61K31/423</further-classification>
        <further-classification edition="200601120260302B">A61K31/427</further-classification>
        <further-classification edition="200601120260302B">A61K31/444</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州百誠醫藥科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU BIO-SINCERITY PHARMA-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苗雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIAO, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄亦心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, YIXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王國建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUOJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁藝馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YIXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷少偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, SHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊曉紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, XIAOHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及醫藥技術領域，具體涉及KAT抑制劑、其製備方法及其在醫藥上的應用。本發明提供了一種式（&lt;b&gt;I&lt;/b&gt;）所述磺醯胺類衍生物及其組合物和用途，所述化合物可以用於治療和/或預防KAT介導的疾病或病症及相關疾病或病症。&lt;br/&gt;&lt;img align="absmiddle" height="119px" width="254px" file="ed10120.JPG" alt="ed10120.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the technical field of pharmaceuticals, and more particularly to KAT inhibitors, their preparation methods, and pharmaceutical uses thereof. The invention provides sulfonamide derivatives of Formula (I), as well as their pharmaceutical compositions and uses thereof. The disclosed compounds can be used to treat and/or prevent KAT-mediated diseases or disorders, as well as diseases or disorders related thereto.&lt;br/&gt;&lt;img align="absmiddle" height="121px" width="251px" file="ed10121.JPG" alt="ed10121.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2347" publication-number="202631421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>繫帶組件及安全座椅</chinese-title>
        <english-title>TETHER ASSEMBLY AND SAFETY SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260215B">B60R22/18</main-classification>
        <further-classification edition="200601120260215B">B60R22/10</further-classification>
        <further-classification edition="200601120260215B">B60N2/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖小红</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, XIAOHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種繫帶組件用於將安全座椅的底座連接至車輛，該繫帶組件包括第一連接桿、第二連接桿和繫帶，其中，第一連接桿至少部分設置於底座的頂部上方，第二連接桿設置於底座的內部；繫帶連接至第二連接桿和位於底座的頂部上方的部分的第一連接桿，且能拆卸地連接至車輛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tether assembly for connecting a base of a safety seat to a vehicle includes a first connecting rod, a second connecting rod, and a tether. The first connecting rod is at least partially disposed above a top of the base, and the second connecting rod is disposed inside the base. The tether is connected to the second connecting rod and a part of the first connecting rod located above the top of the base, and is detachably connected to the vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:安全座椅</p>
        <p type="p">20:底座</p>
        <p type="p">30:座椅本體</p>
        <p type="p">110:繫帶</p>
        <p type="p">111:連接帶</p>
        <p type="p">112:調節帶</p>
        <p type="p">113:調整器</p>
        <p type="p">120:第一連接桿</p>
        <p type="p">210:底座本體</p>
        <p type="p">220:後蓋</p>
        <p type="p">221:穿出孔</p>
        <p type="p">240:豎向部</p>
        <p type="p">250:橫向部</p>
        <p type="p">S:繞設空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2348" publication-number="202631433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車架及嬰幼兒推車</chinese-title>
        <english-title>FRAME AND STROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B62B7/06</main-classification>
        <further-classification edition="200601120260430B">B62B9/12</further-classification>
        <further-classification edition="200601120260430B">B62B9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡守鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHOUFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雷雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, LEILEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種車架及嬰幼兒推車，該車架包括車手連接座、前連接座、後連接座和收合聯動機構，車手連接座、前連接座和後連接座相互樞接，收合聯動機構設置於車手連接座、前連接座和後連接座之間；車架從展開狀態切換至收合狀態時，車手連接座、前連接座和後連接座中的一者運動，並通過收合聯動機構驅動車手連接座、前連接座和後連接座中的另外二者一同轉動收合。該車架結構簡單，且收合後的車架較薄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a frame and a stroller. The frame includes a handlebar base, a front base, a rear base, and a folding linkage mechanism. The handlebar base, the front base, and the rear base are pivotally connected to each other, and the folding linkage mechanism is provided among the handlebar base, the front base, and the rear base. When the frame switches from an unfolded state to a folded state, one of the handlebar base, the front base, and the rear base moves, and drives the other two of the handlebar base, the front base, and the rear base to rotate and fold together via the folding linkage mechanism. The frame has a simple structure and is relatively thin when folded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車架</p>
        <p type="p">110:車手架</p>
        <p type="p">111:推把部</p>
        <p type="p">112:車手桿</p>
        <p type="p">120:前輪架</p>
        <p type="p">121:前橫桿</p>
        <p type="p">122:前側桿</p>
        <p type="p">130:後輪架</p>
        <p type="p">131:後橫桿</p>
        <p type="p">132:後側桿</p>
        <p type="p">140:座椅架</p>
        <p type="p">141:座椅安裝座</p>
        <p type="p">1411:第一卡合部</p>
        <p type="p">1412:配合凹</p>
        <p type="p">300:車手連接座</p>
        <p type="p">700:鎖定機構</p>
        <p type="p">720:第一操作件、操作旋鈕</p>
        <p type="p">800:橫管</p>
        <p type="p">101:飾蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2349" publication-number="202633519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於混合鍵合的微型發光二極體晶片及其製造方法</chinese-title>
        <english-title>HYBRID BONDING-BASED MICRO-LED CHIP AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W80/00</main-classification>
        <further-classification edition="202601120260302B">H10W46/00</further-classification>
        <further-classification edition="202501120260302B">H10H29/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
        <further-classification edition="202501120260302B">H10H29/856</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種基於混合鍵合的微型發光二極體晶片，包括：上疊層，其包括：第一絕緣層，被配置為容納發光檯面和第一通孔接觸部；發光檯面，其被配置為發射光，其中發光檯面的頂面面積大於發光檯面的底面面積；以及第一通孔接觸部，其與發光檯面的底部電連接並穿過第一絕緣層；以及下疊層，其包括：第二絕緣層，其被配置為容納第二通孔接觸部；第二通孔接觸部，其穿過第二絕緣層；以及驅動背板，其與第二通孔接觸部電連接，其中下疊層通過混合鍵合與上疊層接合，使得第一通孔接觸部與第二通孔接觸部鍵合，並且第一絕緣層與第二絕緣層鍵合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a hybrid bonding-based micro-LED chip, including: an upper stacked layer, which includes: a first insulating layer configured to accommodate a light-emitting mesa and a first through-hole contact portion; a light-emitting mesa configured to emit light, wherein the top surface area of the light-emitting mesa is greater than the bottom surface area of the light-emitting mesa; and a first through-hole contact portion electrically connected with the bottom of the light-emitting mesa and passing through the first insulating layer; and a lower stacked layer, which includes: a second insulating layer configured to accommodate a second through-hole contact portion; a second through-hole contact portion passing through the second insulating layer; and a drive backplane electrically connected with the second through-hole contact portion, wherein the lower stacked layer is bonded with the upper stacked layer through hybrid bonding, such that the first through-hole contact portion is bonded with the second through-hole contact portion and the first insulating layer is bonded with the second insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微型發光二極體晶片</p>
        <p type="p">100A:上疊層</p>
        <p type="p">100B:下疊層</p>
        <p type="p">101:發光檯面</p>
        <p type="p">101A:第一磊晶層</p>
        <p type="p">101B:發光層</p>
        <p type="p">101C:第二磊晶層</p>
        <p type="p">102:第一通孔接觸部</p>
        <p type="p">103:第二通孔接觸部</p>
        <p type="p">104:第一電極/陰極</p>
        <p type="p">104A:邊緣陰極</p>
        <p type="p">104B:中部陰極</p>
        <p type="p">105:微透鏡</p>
        <p type="p">105A:透鏡部</p>
        <p type="p">105B:間隔部</p>
        <p type="p">106:驅動背板</p>
        <p type="p">107:凹陷</p>
        <p type="p">108:透明導電層</p>
        <p type="p">109A:第一鍵合標記</p>
        <p type="p">109B:第二鍵合標記</p>
        <p type="p">110:第二電極/陽極</p>
        <p type="p">111A:第一絕緣層</p>
        <p type="p">111B:第二絕緣層</p>
        <p type="p">112,113:鈍化層</p>
        <p type="p">114:第三通孔接觸部</p>
        <p type="p">115:反射鏡層</p>
        <p type="p">A:介面</p>
        <p type="p">MQW:多量子阱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2350" publication-number="202632222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶片的變形水平測定方法、晶片的變形水平測定裝置、電腦可讀記錄介質及半導體晶片層疊方法</chinese-title>
        <english-title>METHOD FOR MEASURING DEFORMATION LEVEL OF CHIP, DEVICE FOR MEASURING DEFORMATION LEVEL OF CHIP, COMPUTER-READABLE RECORDING MEDIUM AND METHOD FOR STACKING SEMICONDUCTOR CHIPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260320B">G01B11/16</main-classification>
        <further-classification edition="202601120260320B">H10P74/20</further-classification>
        <further-classification edition="202601120260320B">G06T11/00</further-classification>
        <further-classification edition="200601120260320B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商納科新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTIN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭俊喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及由晶片的二維影像測定晶片的z軸變形水平的方法，在一個實施例中，可以包括：掃描晶片的表面而獲得上述晶片的二維影像的步驟；從上述二維影像提取上述晶片的表面的特徵的步驟；以及基於提取出的特徵而測定上述晶片的z軸變形水平的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for measuring a z-axis deformation level of a chip from a two-dimensional image of the chip, the method including: acquiring the two-dimensional image of the chip by scanning a surface of the chip; extracting a feature of the surface of the chip from the two-dimensional image; and measuring the z-axis deformation level of the chip based on the extracted feature.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2351" publication-number="202632047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成過渡金屬硫族化合物膜的前驅體組合物、過渡金屬硫族化合物膜的製造方法、由此製造的過渡金屬硫族化合物膜及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260205B">C23C16/30</main-classification>
        <further-classification edition="200601120260205B">C23C16/448</further-classification>
        <further-classification edition="200601120260205B">C07F11/00</further-classification>
        <further-classification edition="200601120260205B">B01J21/06</further-classification>
        <further-classification edition="200601120260205B">B01J23/20</further-classification>
        <further-classification edition="200601120260205B">B01J23/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商提迪艾思股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDS INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜奇範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KI BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一實施例旨在降低過渡金屬硫族化合物膜中的碳副產物，提供一種用於形成過渡金屬硫族化合物膜的前驅體組合物，其特徵在於，碳與分別與該碳相鄰的兩個硫族元素以雙鍵結合；並提供利用該前驅體組合物的過渡金屬硫族化合物膜的製造方法，以及由此製造的過渡金屬硫族化合物膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2352" publication-number="202633214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型發光二極體及微型發光二極體晶片</chinese-title>
        <english-title>MICRO-LED AND MICRO-LED CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260204B">H10H20/80</main-classification>
        <further-classification edition="202501120260204B">H10H20/814</further-classification>
        <further-classification edition="202501120260204B">H10H20/84</further-classification>
        <further-classification edition="202501120260204B">H10H20/841</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種微型發光二極體，包括：發光台面，其被配置為發射光；以及反射鏡層，其被配置為反射來自發光台面的光，其中所述反射鏡層在朝向發光台面的一側具有原子層沉積層，所述原子層沉積層被配置為阻擋反射鏡層中的金屬擴散。透過本發明，可以有效地抑制反射鏡層中的金屬擴散和氧化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a micro-LED, including: a light-emitting mesa configured to emit light; and a reflective mirror layer configured to reflect light from the light-emitting mesa, wherein a side of the reflective mirror layer facing the light-emitting mesa has an atomic layer deposition layer, and the atomic layer deposition layer is configured to block metal diffusion in the reflective mirror layer. Through the present disclosure, metal diffusion and oxidation in the reflective mirror layer can be effectively suppressed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:反射鏡層</p>
        <p type="p">201:原子層沉積層</p>
        <p type="p">202:反射金屬層</p>
        <p type="p">203:第一阻擋層</p>
        <p type="p">203A:第一阻擋分層</p>
        <p type="p">203B:第二阻擋分層</p>
        <p type="p">204:第二阻擋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2353" publication-number="202633226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102968</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微型發光二極體的通孔接觸部及其形成方法</chinese-title>
        <english-title>THROUGH-HOLE CONTACT FOR MICRO LIGHT-EMITTING DIODE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260317B">H10H20/857</main-classification>
        <further-classification edition="202501120260317B">H10H20/01</further-classification>
        <further-classification edition="202501120260317B">H10H29/80</further-classification>
        <further-classification edition="202501120260317B">H10H29/41</further-classification>
        <further-classification edition="202501120260317B">H10H29/39</further-classification>
        <further-classification edition="202501120260317B">H10H29/14</further-classification>
        <further-classification edition="202501120260317B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於微型發光二極體的通孔接觸部。所述通孔接觸部被配置為將第一導電結構與第二導電結構電連接。第一導電結構位於通孔接觸部之下，並且第二導電結構位於通孔接觸部之上。所述通孔接觸部包括：通孔，其形成在絕緣層中具有空腔；填充金屬，其佈置在通孔的空腔中以用於導電；以及第一金屬阻擋層，其佈置在通孔的底部與第一導電結構之間和/或通孔的頂部與第二導電結構以阻擋所述填充金屬擴散。此外，本發明還提供了一種形成所述通孔接觸部的方法。通過本發明，可以較好地抑制通孔接觸部的金屬擴散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A through-hole contact for a micro light-emitting diode is provided. The through-hole contact is configured to electrically connect a first conductive structure and a second conductive structure. The first conductive structure is located below the through-hole contact, and the second conductive structure is located above the through-hole contact. The through-hole contact includes a through-hole formed in an insulating layer and having a cavity, a filler metal disposed in the cavity of the through-hole for conducting electricity and a first metal barrier layer disposed between a bottom of the through-hole and the first conductive structure and/or a top of the through-hole and the second conductive structure to block diffusion of the filler metal. Furthermore, the present invention also provides a method for forming the through-hole contact. Through the present invention, metal diffusion in the through-hole contact can be effectively suppressed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通孔接觸部</p>
        <p type="p">101:第一導電結構</p>
        <p type="p">102:第二導電結構</p>
        <p type="p">103:絕緣層</p>
        <p type="p">104:第二金屬阻擋層</p>
        <p type="p">105:填充金屬</p>
        <p type="p">106:第一金屬阻擋層</p>
        <p type="p">107:鈍化層</p>
        <p type="p">108:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2354" publication-number="202631304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具交換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B23Q3/155</main-classification>
        <further-classification edition="200601120260422B">B23Q5/22</further-classification>
        <further-classification edition="200601120260422B">B23Q5/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十部學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工具交換裝置具備工具庫、裝卸裝置、及控制裝置，控制裝置具有在預定的時間點取得驅動機構的負載之負載取得部、及基於負載取得部取得的負載來推定第1工具及第2工具的任一者的質量之質量推定部，預定的時間點是以下至少任一時間點：保持構件的其中一者從工具庫接收第2工具後，且保持構件的另一者從主軸接收第1工具前的時間點；保持構件的其中一者往主軸交付第2工具後，且保持構件的另一者往工具庫交付第1工具前的時間點；保持構件的其中一者從主軸接收第1工具後，且保持構件的另一者從工具庫接收第2工具前的時間點；及保持構件的其中一者往工具庫交付第1工具後，且保持構件的另一者往主軸交付第2工具前的時間點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具庫</p>
        <p type="p">11:保持器</p>
        <p type="p">20:裝卸裝置</p>
        <p type="p">21:保持構件</p>
        <p type="p">22:驅動機構</p>
        <p type="p">23:滾珠螺桿</p>
        <p type="p">24:伺服馬達</p>
        <p type="p">25:致動器</p>
        <p type="p">30:控制裝置</p>
        <p type="p">31:記憶部</p>
        <p type="p">32:交換控制部</p>
        <p type="p">33:負載取得部</p>
        <p type="p">34:質量推定部</p>
        <p type="p">35:記憶更新部</p>
        <p type="p">36:通知部</p>
        <p type="p">37:補正部</p>
        <p type="p">100:工具交換裝置</p>
        <p type="p">200:工具機</p>
        <p type="p">201:主軸</p>
        <p type="p">E:工具</p>
        <p type="p">E1:第1工具</p>
        <p type="p">E2:第2工具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2355" publication-number="202631305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具交換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B23Q3/155</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十部學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工具交換裝置(20、30)具備：至少一個工具交換臂200；第1作動構件230，設置於工具交換臂200；第1凸輪50，與工具旋轉中心方向上的主軸13的移動連動而在工具旋轉中心方向上移動，並推壓第1作動構件230來使工具交換臂200進行旋動動作；第2作動構件240，設置於工具交換臂200；及第2凸輪60，在至少第1作動構件230與第1凸輪50的抵接已解除的狀態下與第2作動構件240抵接，並限制在與第1凸輪50使工具交換臂200進行旋動動作的方向為相反的方向上之工具交換臂200的旋動動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具機單元</p>
        <p type="p">10:工具機</p>
        <p type="p">11:基座部</p>
        <p type="p">12:主軸頭</p>
        <p type="p">13:主軸</p>
        <p type="p">20:工具交換臂單元、工具交換裝置</p>
        <p type="p">21:直線運動單元</p>
        <p type="p">22:升降軸</p>
        <p type="p">23:旋繞基座</p>
        <p type="p">24:旋繞軸</p>
        <p type="p">25:安裝板部</p>
        <p type="p">27:支撐台部</p>
        <p type="p">30:工具庫、工具交換裝置</p>
        <p type="p">31:庫基座</p>
        <p type="p">32:庫本體</p>
        <p type="p">33:旋轉盤</p>
        <p type="p">34:存放臂</p>
        <p type="p">35:工具存放部</p>
        <p type="p">50:第1凸輪</p>
        <p type="p">51,61:凸輪面</p>
        <p type="p">60:第2凸輪</p>
        <p type="p">200:工具交換臂</p>
        <p type="p">220:旋動軸</p>
        <p type="p">230:第1作動構件</p>
        <p type="p">240:第2作動構件、第2作動部</p>
        <p type="p">500:工具</p>
        <p type="p">J1:工具旋轉中心</p>
        <p type="p">J2:旋繞中心軸</p>
        <p type="p">J3:工具把持軸</p>
        <p type="p">J4:工具中心軸</p>
        <p type="p">J5,J7:旋動中心軸</p>
        <p type="p">J8:存放中心軸</p>
        <p type="p">+X,-X,-Z:側、朝向</p>
        <p type="p">+Z:側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2356" publication-number="202633304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剝離方法、剝離裝置、加工設備及儲存介質</chinese-title>
        <english-title>PEELING METHOD, PEELING APPARATUS, PROCESSING EQUIPMENT AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P54/94</main-classification>
        <further-classification edition="202601120260302B">H10P95/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市大族半導體裝備科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN HAN'S SEMICONDUCTOR EQUIPMENT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫禮傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁銘傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MINGJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱秀源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, XIUYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李遷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹建剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, JIANGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請適用於材料加工技術領域，提供一種剝離方法、剝離裝置、加工設備及儲存介質，所述剝離方法包括：固定具有加工痕跡的工件；沿所述加工痕跡從所述工件的邊沿撕開所述工件，使得所述工件的表面至所述加工痕跡的部分發生彈性形變，以沿所述加工痕跡從所述工件剝離出片狀的子部件。本申請的實施例提供的剝離方法能降低實施難度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application is applicable to the technical field of material processing and provides a peeling method, a peeling apparatus, processing equipment, and a storage medium. The peeling method includes: securing a workpiece that has processing marks; and tearing the workpiece along the processing marks from the edge of the workpiece, such that a portion of the workpiece from the surface to the processing marks undergoes elastic deformation, thereby peeling a flake-shaped sub-component from the workpiece along the processing marks. The peeling method provided by embodiments of the application can reduce implementation difficulty.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:碳化矽晶錠</p>
        <p type="p">11:子部件</p>
        <p type="p">12:待加工部分</p>
        <p type="p">2:載台</p>
        <p type="p">3:玻璃板</p>
        <p type="p">4:鍵合材料</p>
        <p type="p">5:頂升元件</p>
        <p type="p">6:支撐部件</p>
        <p type="p">H:厚度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2357" publication-number="202632529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生校正動作的評估圖的系統、方法，及電腦可讀儲存媒體</chinese-title>
        <english-title>SYSTEM, METHOD, AND COMPUTER-READABLE STORAGE MEDIUM FOR GENERATING ASSESSMENT MAPS FOR CORRECTIVE ACTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260423B">G06F30/398</main-classification>
        <further-classification edition="202301120260423B">H10B41/20</further-classification>
        <further-classification edition="202301120260423B">H10B41/35</further-classification>
        <further-classification edition="202001320260423B">G06F119/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文佼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪爾　約書華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHER, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　新海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XINHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕奇　迪尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADHI, DEENESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔　則敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNG, TZA-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案描述了用於產生校正動作的評估圖的方法、系統及非暫時性電腦可讀媒體。一種方法包括接收包含第一組向量的第一向量圖，每一向量指示在基板上的複數個位置的特定位置的變形。該方法進一步包括藉由旋轉第一組向量中的每一向量的位置來產生包含第二組向量的第二向量圖。該方法進一步包括基於第二組向量中的向量及第一組向量中的對應向量來產生包括第三組向量的第三向量圖。該方法進一步包括從第一組向量中的對應向量減去第三組向量的每一向量來產生第四向量圖。第四向量圖指示第一向量圖的平面分量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and non-transitory computer readable medium are described for generating assessment maps for corrective action. A method includes receiving a first vector map including a first set of vectors each indicating a distortion of a particular location of a plurality of locations on a substrate. The method further includes generating a second vector map including a second set of vectors by rotating a position of each vector in the first set of vectors. The method further includes generating a third vector map including a third set of vectors based on vectors in the second set of vectors and corresponding vectors in the first set of vectors. The method further includes generating a fourth vector map by subtracting each vector of the third set of vectors from a corresponding vector in the first set of vectors. The fourth vector map indicates a planar component of the first vector map.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統架構</p>
        <p type="p">106:用戶端裝置</p>
        <p type="p">108:分析元件</p>
        <p type="p">110:評估圖產生系統</p>
        <p type="p">112:平面圖產生器</p>
        <p type="p">114:徑向圖產生器</p>
        <p type="p">116:平面圖產生器</p>
        <p type="p">120:感測器系統</p>
        <p type="p">122:感測器伺服器</p>
        <p type="p">124:製造設備</p>
        <p type="p">126:感測器</p>
        <p type="p">128:感測器識別符讀取器</p>
        <p type="p">130:計量系統</p>
        <p type="p">132:計量伺服器</p>
        <p type="p">134:計量設備</p>
        <p type="p">136:計量識別符讀取器</p>
        <p type="p">138:平面內變形圖產生器</p>
        <p type="p">140:資料儲存</p>
        <p type="p">142:感測器資料</p>
        <p type="p">144:感測器值</p>
        <p type="p">146:感測器資料識別符</p>
        <p type="p">148:產品識別符</p>
        <p type="p">150:計量資料</p>
        <p type="p">152:計量值</p>
        <p type="p">154:計量資料識別符</p>
        <p type="p">156:產品識別符</p>
        <p type="p">158:IPD圖</p>
        <p type="p">160:評估圖</p>
        <p type="p">162:平面圖</p>
        <p type="p">164:徑向圖</p>
        <p type="p">166:殘留圖</p>
        <p type="p">168:相關性資料庫</p>
        <p type="p">170:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2358" publication-number="202631441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>把手開關裝置及其對把手之組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260224B">B62K11/14</main-classification>
        <further-classification edition="202001120260224B">B62J6/16</further-classification>
        <further-classification edition="200601120260224B">B62K23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日電裝股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI DENSO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤木祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可確實地防止與把手之間產生之鬆動之把手開關裝置及其對把手之組裝方法。  &lt;br/&gt;本發明之把手開關裝置1包含：開關外殼2；開關本體3，其安裝於開關外殼2；及固定構件4，其具有嵌入於把手H之開口部Ha之突起4a，將開關外殼2及開關本體3固定於把手H；並且開關本體3具有形成有供緊固螺桿N螺合之螺桿孔3d之安裝部3c，且固定構件4將突起4a嵌入於開口部Ha且對於安裝部3c卡合，藉由緊固螺桿N對安裝部3c之緊固力而對於把手H之開口部Ha之周緣被按壓，將開關外殼2及開關本體3固定於把手H。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:第1開關外殼</p>
        <p type="p">2ac:螺桿用開口部</p>
        <p type="p">2b:第2開關外殼</p>
        <p type="p">3a:操作開關</p>
        <p type="p">3b:插通孔</p>
        <p type="p">3c:安裝部</p>
        <p type="p">4:固定構件</p>
        <p type="p">4a:突起</p>
        <p type="p">4b:安裝面</p>
        <p type="p">C:連接器</p>
        <p type="p">H:把手</p>
        <p type="p">Ha:開口部</p>
        <p type="p">n:組裝螺桿</p>
        <p type="p">N:緊固螺桿</p>
        <p type="p">Na:頭部</p>
        <p type="p">Nb:軸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2359" publication-number="202632294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若澤勝博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKAZAWA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸康貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">探針，具備：前端部，包含突出部；第1臂和第2臂，其一方的端部連接至前端部；及，基端部，連接第1臂和第2臂的另一方的端部。第1臂，以不具有極值的方式彎曲，其一方的端部與突出部11的突出方向的夾角呈銳角並連接至前端部。第2臂，從第1臂來觀察，被配置在突出方向的反方向，並包含往突出方向的反方向彎曲之部分，與第1臂隔離，並連接至前端部和基端部。第1臂的與基端部連接之部分的與突出方向的夾角，比第1臂的與前端部連接之部分的與突出方向的夾角更大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針</p>
        <p type="p">2:檢查對象</p>
        <p type="p">10:前端部</p>
        <p type="p">11:突出部</p>
        <p type="p">20:臂</p>
        <p type="p">21:第1臂</p>
        <p type="p">22:第2臂</p>
        <p type="p">22A,22B:臂</p>
        <p type="p">30:基端部</p>
        <p type="p">40:構裝部</p>
        <p type="p">211:第1連接部分</p>
        <p type="p">212:第2連接部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2360" publication-number="202631528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>石英玻璃及其製造方法、石英玻璃構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C03C3/06</main-classification>
        <further-classification edition="200601120260504B">C03C11/00</further-classification>
        <further-classification edition="200601120260504B">C03B19/06</further-classification>
        <further-classification edition="200601120260504B">C03B20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹ＳＧＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH SGM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹石英有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH QUARTZ CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井健史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漆谷想太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URUSHIDANI, SOHTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田美徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島崎佑太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMASAKI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>国吉実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNIYOSHI, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤悠軌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOH, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>番場績</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMBA, MORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹野弘也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANNO, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井口采音</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGUCHI, AYANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地義一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種石英玻璃、其製造方法、及包含其的半導體熱處理裝置構件用的石英玻璃構件中的至少任一者，所述石英玻璃顯示出遮熱性，且不需要用於賦予耐蝕性的多階段步驟，且與先前顯示出遮熱性的石英玻璃相比，藉由表面處理可獲得高的耐蝕性賦予效果。一種石英玻璃，其氣孔面積率超過0%且為5%以下，且氣孔徑為5 μm以下的氣孔面積比例為30%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外殼層(不透明部)</p>
        <p type="p">11:本體部</p>
        <p type="p">100:石英玻璃構件(外殼石英玻璃)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2361" publication-number="202631361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造微結構及／或奈米結構之裝置</chinese-title>
        <english-title>DEVICE FOR PRODUCING MICRO- AND/OR NANOSTRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">B29C35/08</main-classification>
        <further-classification edition="200601120260420B">B29C59/02</further-classification>
        <further-classification edition="200601120260420B">G03F7/00</further-classification>
        <further-classification edition="200601120260420B">B81C1/00</further-classification>
        <further-classification edition="201101120260420B">B82Y30/00</further-classification>
        <further-classification edition="201101120260420B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EV GROUP E. THALLNER GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達杜斯　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUDUS, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傳柏梅爾　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREIBLMAYR, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於製造微結構及/或奈米結構之方法及裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a device for producing micro- and/or nanostructures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1':基板/產品基板</p>
        <p type="p">2:結構化印模(印模結構)</p>
        <p type="p">3:壓印結構</p>
        <p type="p">4:用於穩定之印模載體基板或背板</p>
        <p type="p">5:印模容納裝置</p>
        <p type="p">6:基板容納裝置</p>
        <p type="p">7:壓印材料</p>
        <p type="p">8:印模容納裝置中之真空軌道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2362" publication-number="202632305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260330B">G01R31/265</main-classification>
        <further-classification edition="202601120260330B">H10W46/00</further-classification>
        <further-classification edition="200601120260330B">H01J37/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津野夏規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNO, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田洋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTA, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹氣裕子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDOH, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田正二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川高穗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAWA, TAKAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種安裝有藉由檢查裝置檢查主元件的電特性的TEG(Test Element Group)的半導體裝置。TEG具有評估元件，評估元件包含主元件與副元件。主元件的第1端子呈開放以可供脈衝帶電粒子束進行照射，主元件的第2端子連接至副元件的第1端子，副元件的第2端子被接地，副元件的電特性設計為使合成主元件的電特性與副元件的電特性而成的合成電特性，成為可供檢查裝置檢查的電特性的區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:評估元件</p>
        <p type="p">201:主元件</p>
        <p type="p">202:第1端子</p>
        <p type="p">203:第2端子</p>
        <p type="p">211:副元件</p>
        <p type="p">212:第1端子</p>
        <p type="p">213:第2端子</p>
        <p type="p">220:試樣表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2363" publication-number="202632752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104120</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及源高頻電力之源頻率之控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/32</main-classification>
        <further-classification edition="200601120260422B">H05H1/46</further-classification>
        <further-classification edition="200601120260422B">H03H7/40</further-classification>
        <further-classification edition="200601120260422B">H01J37/304</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輿水地塩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMIZU, CHISHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示之電漿處理裝置具備腔室、基板支持部、高頻電源、及偏壓電源。高頻電源產生源高頻電力，以於腔室內生成電漿。偏壓電源於複數個脈衝期間之各期間對偏壓電極賦予偏壓能量之脈衝。高頻電源根據源高頻電力之反射程度之變化來設定複數個重疊期間各自中之複數個相位期間之各期間的源高頻電力之源頻率，上述複數個重疊期間與複數個脈衝期間分別重疊。反射程度係藉由在兩個以上之先行重疊期間內之相同相位期間使用互不相同之源頻率而特定出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通訊介面</p>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30c:控制部</p>
        <p type="p">31:高頻電源</p>
        <p type="p">31a:放大器</p>
        <p type="p">31g:高頻信號產生器</p>
        <p type="p">31m:匹配器</p>
        <p type="p">31s:感測器</p>
        <p type="p">32:偏壓電源</p>
        <p type="p">32a:放大器</p>
        <p type="p">32g:高頻信號產生器</p>
        <p type="p">32m:匹配器</p>
        <p type="p">34:脈衝控制器</p>
        <p type="p">40:排氣系統</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">111c:靜電吸盤</p>
        <p type="p">111e:基台</p>
        <p type="p">112:環組件</p>
        <p type="p">BE:偏壓能量</p>
        <p type="p">RF:生源高頻電力</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2364" publication-number="202632060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶沉積腔室</chinese-title>
        <english-title>EPITAXIAL DEPOSITION CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">C23C16/455</main-classification>
        <further-classification edition="200601120260423B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯洛斯　布萊恩海斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURROWS, BRIAN HAYES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　祉淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林斯　理查Ｏ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINS, RICHARD O.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　恩樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOO, ENLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　丹尼Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DANNY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內利卡　沙尼什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NELLIKKA, SHAINISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川敏行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>督比　阿布希雪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　卡堤布潘德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, KARTIK BHUPENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了一種製程腔室，其包括一腔室主體，此腔室主體具有設置在底板上之頂板，其中底盤及注入器環設置在該頂板與該底板之間。上下夾環分別將上部及底板固定到位。上加熱模組耦接至頂板上之上夾環。下加熱模組耦接至底板下方之下夾環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程腔室</p>
        <p type="p">110:基板</p>
        <p type="p">120:頂板</p>
        <p type="p">125:頂板底座</p>
        <p type="p">130:底板</p>
        <p type="p">132:底板之頸部</p>
        <p type="p">135:底板底座</p>
        <p type="p">140:處理體積</p>
        <p type="p">150:基座</p>
        <p type="p">152:基座支撐件</p>
        <p type="p">154:基座支撐件之軸</p>
        <p type="p">160:裝載埠</p>
        <p type="p">200:上加熱模組</p>
        <p type="p">300:腔室主體</p>
        <p type="p">400:下加熱模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2365" publication-number="202632923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊指示方法及通信裝置</chinese-title>
        <english-title>INFORMATION INDICATION METHOD AND A COMMUNICATION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H04L5/00</main-classification>
        <further-classification edition="202201120260421B">H04L67/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宇宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淦明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資訊指示方法及通信裝置。non-AP MLD或non-AP MLD中的第一STA生成第一幀，該第一幀包括指示資訊，用於指示滿足通道切換時延所需的初始控制幀中的填充位所占的時長，該填充位所占的時長是根據控制回應幀的時長確定的；non-AP MLD、non-AP MLD中的第一STA或其它STA發送該第一幀。AP MLD或AP MLD中的第一AP或其它AP接收該第一幀，並且AP MLD或第一AP根據該指示資訊，確定初始控制幀中的填充位所占的時長。基於上述方案，可以準確地確定初始控制幀中的填充位所占的時長，使得第一STA能夠在後續的資料幀到來之前完成相應數量的傳輸通道的切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An information indication method and a communication apparatus is provided. A non-AP MLD or a first STA of non-AP MLD generates a first frame, which comprises indication information to indicate the padding duration in the initial control frame required for chain switching delay. The padding duration is determined according to the duration of control response frame. The non-AP MLD, the first STA of non-AP MLD, or another STA sends the first frame. An AP MLD, a first AP of AP MLD or another AP receives the first frame. And based on this indication, the AP MLD or the first AP determines the padding duration in the initial control frame. According to this method, the padding duration in the initial control frame can be accurately determined, so that the first STA can complete the switch of corresponding number of transmission chains before the arrival of subsequent data frames.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2366" publication-number="202633191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>緊湊型ＥＳＤ結構</chinese-title>
        <english-title>COMPACT ESD STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260504B">H10D89/60</main-classification>
        <further-classification edition="202501120260504B">H10D89/10</further-classification>
        <further-classification edition="202601120260504B">H10W42/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>贊帕迪　彼得　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAMPARDI, PETER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆霍恩　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUHONEN, KATHLEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種緊湊型靜電放電（ESD）結構，其包括：一基板；一子集極區，該子集極區在該基板上；一集極區，該集極區在該基板之一第一部分上；以及一基極區，該基極區在該集極區上；一發射極區，該發射極區在該基極區上，其中該發射極區、該基極區及該集極區形成一雙極電晶體。一陰極區提供在該基板之一第二部分上。一陽極觸點提供在該陰極區上，其中該陰極區及該陽極觸點形成一肖特基二極體。一發射極/陽極橋將該發射極區電耦合至該陽極觸點，其中該集極區及該陰極區經由該子集極區電耦合，使得該雙極電晶體及該肖特基二極體以一反並聯方式連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compact electrostatic discharge (ESD) structure comprises a substrate; a sub-collector region over the substrate; a collector region over a first portion of the substrate; and a base region over the collector region; an emitter region over the base region, wherein the emitter region, the base region, and the collector region form a bipolar transistor. A cathode region is provided over a second portion of the substrate. An anode contact is provided over the cathode region, wherein the cathode region and the anode contact form a Schottky diode. An emitter/anode bridge electrically couples the emitter region to the anode contact, wherein the collector region and the cathode region are electrically coupled via the sub-collector region such that the bipolar transistor and the Schottky diode are connected in an anti-parallel.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2367" publication-number="202631150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於穩定包括藥物的水性組成物之ｐＨ值的方法</chinese-title>
        <english-title>METHOD FOR STABILIZING THE PH OF AN AQUEOUS COMPOSITION COMPRISING A DRUG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K31/573</main-classification>
        <further-classification edition="200601120260429B">A61K47/02</further-classification>
        <further-classification edition="200601120260429B">A61K47/10</further-classification>
        <further-classification edition="200601120260429B">A61K47/18</further-classification>
        <further-classification edition="200601120260429B">A61K47/20</further-classification>
        <further-classification edition="200601120260429B">A61K47/40</further-classification>
        <further-classification edition="200601120260429B">A61K9/00</further-classification>
        <further-classification edition="200601120260429B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商歐庫利斯營運股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCULIS OPERATIONS SARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅夫特森　索爾斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOFTSSON, THORSTEINN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IS</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富羅佩　魯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULOP, ZOLTAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IS</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於穩定包含易氧化藥物的水性組成物的pH值的方法，方法包含加入防止易氧化藥物氧化的添加劑。特別地，本發明係關於用於穩定包含皮質類固醇的水性組成物的pH值的方法，方法包含加入防止皮質類固醇氧化的添加劑。本發明亦關於包含皮質類固醇和防止皮質類固醇氧化的添加劑的組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for stabilizing the pH of an aqueous composition comprising a drug which is prone to oxidation, said method comprising the addition of an additive to prevent oxidation of the drug which is prone to oxidation. In particular, the present disclosure relates to a method for stabilizing the pH of an aqueous composition comprising a corticosteroid, said method comprising the addition of an additive to prevent oxidation of the corticosteroid. The present disclosure also relates to a composition comprising a corticosteroid and an additive to prevent oxidation of the corticosteroid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2368" publication-number="202632339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜電光波導調變器裝置以及形成其之方法</chinese-title>
        <english-title>THIN-FILM ELECTRO-OPTICAL WAVEGUIDE MODULATOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G02B6/12</main-classification>
        <further-classification edition="200601120260421B">G02B6/122</further-classification>
        <further-classification edition="200601120260421B">G02B6/13</further-classification>
        <further-classification edition="200601120260421B">G02B6/132</further-classification>
        <further-classification edition="200601120260421B">G02F1/225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　振毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEO, RUSSELL CHIN YEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高德　路迪維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODET, LUDOVIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅哈福　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAHAV, NIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維瑟　羅伯特簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISSER, ROBERT JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種電光波導調變器裝置，其包括：基板上之晶種層，晶種層具有與晶種層表面對準的第一結晶學平面；電光通道，在晶種層上沿第一方向延伸並具有與晶種層之表面對準的第二結晶學平面；絕緣體層，在垂直於第一方向之第二方向上位於基板上之電光通道兩側；在電光通道及絕緣體層上之電極阻障層；以及在第二方向上延伸之一或多個電極。晶種層及絕緣體層各自包括折射率低於電光通道的材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electro-optical waveguide modulator device includes a seed layer on a substrate, the seed layer having a first crystallographic plane aligned with a surface of the seed layer, an electro-optical channel extending in a first direction on the seed layer and having a second crystallographic plane aligned with the surface of the seed layer, an insulator layer on both sides of the electro-optical channel on the substrate in a second direction perpendicular to the first direction, an electrode barrier layer on the electro-optical channel and the insulator layer, and one or more of electrodes extending in the second direction. The seed layer and the insulator layer each comprise material having a refractive index that is lower than the electro-optical channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:EO波導調變器</p>
        <p type="p">102:基板</p>
        <p type="p">104:晶種層</p>
        <p type="p">106:EO通道</p>
        <p type="p">108:絕緣體層</p>
        <p type="p">110:電極阻障層</p>
        <p type="p">112:電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2369" publication-number="202631449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於人力驅動車之變速器</chinese-title>
        <english-title>DERAILLEUR FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260429B">B62M9/1248</main-classification>
        <further-classification edition="201001120260429B">B62M9/125</further-classification>
        <further-classification edition="201001120260429B">B62M9/126</further-classification>
        <further-classification edition="200601120260429B">B62M9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商禧瑪諾（新）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO (SINGAPORE) PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田剛史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　躬迅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOK, KHEONG SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陈　军翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, DONAVAN JUN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種人力驅動車用變速器，該變速器包含一基座構件、一可動構件、一連桿、一電致動器、一第一偏轉構件以及一第二偏轉構件。該基座構件構造成附接到人力車輛的車體。該可動構件構造成可相對於該基座構件沿著一第一方向以及與該第一方向不同的一第二方向移動。該連桿構造成移動式將該可動構件連接到該基座構件。該電致動器構造成操作上相對於該基座構件移動該可動構件。該第一偏轉構件構造成如果沿著該第一方向施加第一外力移動該可動構件時，則變形。該第二偏轉構件構造成如果沿著該第二方向施加第二外力移動該可動構件時，則變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10,RD:變速器</p>
        <p type="p">12:基座構件</p>
        <p type="p">14:可動構件</p>
        <p type="p">16:連桿</p>
        <p type="p">18:第一連桿</p>
        <p type="p">20:第二連桿</p>
        <p type="p">32:電致動器</p>
        <p type="p">34:致動器殼體</p>
        <p type="p">36:輸出部件</p>
        <p type="p">40:第二拉桿</p>
        <p type="p">42:中間部分</p>
        <p type="p">44:拉桿本體</p>
        <p type="p">46:附加拉桿本體</p>
        <p type="p">48:緊固件</p>
        <p type="p">60:第一偏轉構件</p>
        <p type="p">62:第二偏轉構件</p>
        <p type="p">68:保護構件</p>
        <p type="p">86:第三偏轉構件</p>
        <p type="p">CN1:電纜連接器</p>
        <p type="p">EC1:電纜</p>
        <p type="p">PA12:第一附加樞轉軸</p>
        <p type="p">PA21:第二樞轉軸</p>
        <p type="p">PA22:第二附加樞轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2370" publication-number="202632997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於受控環境中的所配置授權傳輸的無線傳輸／接收單元（ＷＴＲＵ）及其方法</chinese-title>
        <english-title>WIRELESS TRANSMIT/RECEIVE UNIT (WTRU) FOR CONFIGURED GRANT TRANSMISSIONS IN CONTROLLED ENVIRONMENTS AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260422B">H04W72/11</main-classification>
        <further-classification edition="202301120260422B">H04W72/115</further-classification>
        <further-classification edition="202301120260422B">H04L1/1822</further-classification>
        <further-classification edition="202301120260422B">H04W72/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾法漢　法里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALFARHAN, FARIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾　Ｊ派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOOHER, J. PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾漢斯　阿塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL HAMSS, AATA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華茲　迪倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATTS, DYLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">裝置(例如，無線傳輸/接收單元(WTRU))可以確定(例如，在多個傳輸塊(TB)之中)哪些資訊將在所配置授權(CG)的實體上鏈通道(PUCCH)傳輸時機的資源上被發送。在範例中，該裝置可以接收配置資訊。該配置資訊可以表明與該CG相關聯的資源。該裝置可以基於下列中一者或多者來確定是(例如，在與CG相關聯的該資源上)傳送第一TB的第一資訊還是第二TB的第二資訊：下鏈回饋資訊(DFI)接收、TB(例如，該第一TB或該第二TB)的資訊在先前傳輸中尚未被發送的原因、以及該TB中的內容的性質(例如，控制資訊相對於資料)。該第一TB可以包括該第一資訊，並且該第二TB可以包括該第二資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device (e.g., a wireless transmit/receive unit (WTRU)) may determine which information (e.g., among multiple transport blocks (TBs)) to be sent on resource(s) of a physical uplink channel (PUCCH) transmission occasion of a configured grant (CG). In an example, the device may receive configuration information. The configuration information may indicate a resource associated with the CG. The device may determine whether to transmit (e.g., on the resource associated with CG) first information of a first TB or second information of a second TB based on one or more of downlink feedback information (DFI) reception, a reason why information of a TB (e.g., the first TB or the second TB) has not been sent in a prior transmission, and a nature of the content (e.g., control information vs. data) in the TB. The first TB may comprise the first information and the second TB may comprise the second information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500、505、510、511、514、515、516、518、519、520、525、530、534:步驟</p>
        <p type="p">502、504、506、508、512:時機</p>
        <p type="p">513:LBT失敗</p>
        <p type="p">517:動態授權(DG)</p>
        <p type="p">CG:配置授權</p>
        <p type="p">CGRT:CG重傳計時器</p>
        <p type="p">DCI:下鏈控制資訊</p>
        <p type="p">LBT:先聽候送</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2371" publication-number="202631157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於預防病毒及微生物感染及其等之後遺症之藥物、治療組合、及方法</chinese-title>
        <english-title>DRUGS, THERAPEUTIC COMBINATIONS AND METHODS FOR PREVENTING VIRAL AND MICROBIAL INFECTIONS AND THEIR SEQUELAE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/7048</main-classification>
        <further-classification edition="200601120260504B">A61K31/65</further-classification>
        <further-classification edition="200601120260504B">A61K33/30</further-classification>
        <further-classification edition="200601120260504B">A61K31/216</further-classification>
        <further-classification edition="200601120260504B">A61K31/59</further-classification>
        <further-classification edition="200601120260504B">A61K31/403</further-classification>
        <further-classification edition="200601120260504B">A61K31/427</further-classification>
        <further-classification edition="200601120260504B">A61K31/4706</further-classification>
        <further-classification edition="200601120260504B">A61K31/7056</further-classification>
        <further-classification edition="200601120260504B">A61K31/14</further-classification>
        <further-classification edition="200601120260504B">A61K31/122</further-classification>
        <further-classification edition="200601120260504B">A61K31/13</further-classification>
        <further-classification edition="200601120260504B">A61K31/145</further-classification>
        <further-classification edition="200601120260504B">A61K31/277</further-classification>
        <further-classification edition="200601120260504B">A61K31/352</further-classification>
        <further-classification edition="200601120260504B">A61K31/35</further-classification>
        <further-classification edition="200601120260504B">A61K31/4025</further-classification>
        <further-classification edition="200601120260504B">A61P31/14</further-classification>
        <further-classification edition="200601120260504B">A61P33/00</further-classification>
        <further-classification edition="200601120260504B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商拓比利亞澳洲有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPELIA AUSTRALIA PTY LTD (ACN 652 771 670)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波羅帝　湯瑪士　朱利葉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORODY, THOMAS JULIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在替代實施方式中，本發明提供用於預防或改善以下者、或降低具有以下者引起之任何不良效應之機率、降低以下者引起之不良效應之嚴重程度的藥物、治療組合及方法：病毒感染，諸如冠狀病毒感染；或微生物感染，包括原蟲、蠕蟲病、昆蟲及/或寄生蟲感染，諸如：可由瘧原蟲屬之寄生蟲引起之瘧疾；可由絲蟲總科之寄生蟲引起之絲蟲病、麻瘋或鏈尾線蟲病；可由分枝桿菌屬之寄生蟲引起之麻瘋；可由諸如蟠尾絲蟲屬之寄生蟲的寄生蠕蟲引起之河盲症或蟠尾絲蟲病；可由鉤蟲屬或板口線蟲屬之寄生蟲引起之鉤蟲或蛔蟲感染；可由鞭蟲屬之寄生蟲引起之鞭蟲病或鞭蟲感染；蛔蟲或蛔蟲屬感染；蟎攜感染，諸如疥瘡；諸如由毛蝨目之蝨或寄生蟲引起之斑疹傷寒的感染；可由蟯蟲屬之蟯蟲或寄生蟲引起之蟯蟲病；由隱翅目或蚤屬之跳蚤或昆蟲引起之蚤病或感染；以及其他感染及侵染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In alternative embodiments, provided are drugs, therapeutic combinations and methods for preventing or ameliorating, or decreasing the chances of having any adverse effects from, decreasing the severity of adverse effects from, a viral infection such as a coronavirus infection or a microbial infection including a protozoan, helminthiasis, insect and/or parasitic infection such as: malaria that can be caused by a parasite of the genus &lt;i&gt;Plasmodium&lt;/i&gt;; filariasis, leprosy or streptocerciasis that can be caused by a parasite of the superfamily &lt;i&gt;Filarioidea&lt;/i&gt;; leprosy that can be caused by a parasite of the genus &lt;i&gt;Mycobacterium&lt;/i&gt;; river blindness or onchocerciasis that can be caused by parasitic worms such as parasites of the genus &lt;i&gt;Onchocerca&lt;/i&gt;; hookworm or roundworm infections that can be caused by parasites of the genus &lt;i&gt;Ancylostoma&lt;/i&gt; or&lt;i&gt; Necator;&lt;/i&gt; trichuriasis or whipworm infection that can be caused by a parasite of the genus &lt;i&gt;Trichuris&lt;/i&gt;; roundworm or an &lt;i&gt;Ascaris&lt;/i&gt; infections; mite-carried infections such as scabies; infections such as typhus caused by lice or parasites of the order &lt;i&gt;Phthiraptera&lt;/i&gt;; enterobiasis that can be caused by pinworm or parasites of the genus &lt;i&gt;Enterobius&lt;/i&gt;; pulicosis or infections cause by fleas or insects of the order &lt;i&gt;Siphonaptera&lt;/i&gt; or of the genus &lt;i&gt;Pulex&lt;/i&gt;, and other infections and infestations.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2372" publication-number="202631272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於清潔罐狀中空體、特別是用於半導體晶圓或用於ＥＵＶ光刻掩模的運輸容器的設備和方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR CLEANING POT-SHAPED HOLLOW BODIES, IN PARTICULAR TRANSPORT CONTAINERS FOR SEMICONDUCTOR WAFERS OR FOR EUV LITHOGRAPHY MASKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">B08B9/08</main-classification>
        <further-classification edition="201201120260420B">G03F1/82</further-classification>
        <further-classification edition="201201120260420B">G03F1/66</further-classification>
        <further-classification edition="202601120260420B">H10P72/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＧＳＥＣ德國半導體設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GSEC GERMAN SEMICONDUCTOR EQUIPMENT COMPANY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席恩勒　弗蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIENLE, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷布斯托克　盧茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REBSTOCK, LUTZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種用於清潔罐狀中空體、特別是用於半導體晶圓或用於EUV光刻掩模的運輸容器的裝置，該裝置包含：裝置壁，所述裝置壁圍封內部空間；夾持和移動裝置，所述夾持和移動裝置佈置在所述內部空間中，以使所述中空體在所述內部空間內移動；清潔單元，所述清潔單元佈置在所述內部空間中，所述中空體可以用所述清潔單元清潔；以及檢驗裝置，所述檢驗裝置佈置在所述內部空間中，所述檢驗裝置具有用於檢查所述中空體的功能和/或對準的觸覺或無接觸檢驗構件。此外，本發明是一種用於操作此類裝置的方法和一種用於執行此類方法的電腦程式產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device for cleaning pot-shaped hollow bodies , in particular transport containers for semiconductor wafers or for EUV lithography masks, comprising a device wall which encloses an interior space , a gripping and moving device arranged in the interior space for moving the hollow body within the interior space , a cleaning unit arranged in the interior space , with which the hollow body can be cleaned, and an inspection device arranged in the interior space with tactile or contactless inspection means for checking the functionality and/or alignment of the hollow body. Furthermore, the present invention relates to a method for operating such a device and a computer program product for carrying out such a method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:裝置</p>
        <p type="p">16:內部空間</p>
        <p type="p">17:夾持和移動裝置</p>
        <p type="p">18:清潔單元</p>
        <p type="p">20:清潔裝置</p>
        <p type="p">22:抽空裝置</p>
        <p type="p">26:壁開口</p>
        <p type="p">50:檢驗裝置</p>
        <p type="p">52:檢驗構件</p>
        <p type="p">54:蓋子搬運單元</p>
        <p type="p">56:第一組</p>
        <p type="p">58:第二組</p>
        <p type="p">74:第三組</p>
        <p type="p">84:加工室開口</p>
        <p type="p">94:控制單元</p>
        <p type="p">A、B、D:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2373" publication-number="202631295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於雷射圖案化半導體元件基板之系統</chinese-title>
        <english-title>SYSTEMS FOR LASER PATTERNING SEMICONDUCTOR DEVICE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260421B">B23K26/38</main-classification>
        <further-classification edition="201401120260421B">B23K26/064</further-classification>
        <further-classification edition="202601120260421B">H10P54/20</further-classification>
        <further-classification edition="200601120260421B">H01S5/06</further-classification>
        <further-classification edition="200601120260421B">G02B13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒施基斯　寇迪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESCHKIES, KURTIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭克林　傑佛瑞Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANKLIN, JEFFREY L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>類　維生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維哈佛貝可　史帝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERHAVERBEKE, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德爾馬斯　琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELMAS, JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　翰文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴起伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GIBACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於用於製造半導體封裝的系統及方法，並且更具體地，用於藉由雷射切除在半導體封裝中形成特徵的系統及方法。在一個實施例中，本文描述的雷射系統及方法可用於圖案化基板，該基板將用作半導體封裝的封裝框架，該半導體封裝具有穿過其形成的一或更多個互連且/或安置在其中的一或更多個半導體晶粒。本文描述的雷射系統可產生用於在基板或其他封裝結構中形成特徵的可調諧雷射束。具體地，雷射束的頻率、脈衝寬度、脈衝形狀、及脈衝能可基於圖案化特徵的期望大小及其中形成圖案化特徵的材料來調節。雷射束的可調性賦能在具有受控深度及形貌的半導體基板及封裝中快速且準確地形成特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation. In one embodiment, the laser systems and methods described herein can be utilized to pattern a substrate to be utilized as a package frame for a semiconductor package having one or more interconnections formed therethrough and/or one or more semiconductor dies disposed therein. The laser systems described herein can produce tunable laser beams for forming features in a substrate or other package structure. Specifically, frequency, pulse width, pulse shape, and pulse energy of laser beams are tunable based on desired sizes of patterned features and on the material in which the patterned features are formed. The adjustability of the laser beams enables rapid and accurate formation of features in semiconductor substrates and packages with controlled depth and topography.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:雷射系統</p>
        <p type="p">202:雷射源</p>
        <p type="p">208:照相機</p>
        <p type="p">212:平台</p>
        <p type="p">230:雷射束</p>
        <p type="p">232:掃描器</p>
        <p type="p">234:遠心透鏡</p>
        <p type="p">600:校準板</p>
        <p type="p">602:標記</p>
        <p type="p">604:位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2374" publication-number="202632726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用具有不同傾斜角的光柵的光學設備</chinese-title>
        <english-title>OPTICAL DEVICE UTILIZING GRATINGS WITH DIFFERENT SLANT ANGLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01J37/302</main-classification>
        <further-classification edition="202601120260421B">H10P50/20</further-classification>
        <further-classification edition="200601120260421B">G02B27/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾森　約瑟夫Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSON, JOSEPH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊恩　摩根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, MORGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅耶帝莫曼泰森　拉特格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER TIMMERMAN THIJSSEN, RUTGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中所述的實施例與方法及裝置相關，該等方法及裝置用於使用成角度蝕刻系統及/或光學設備來在基板上形成具有帶有不同傾斜角的複數個鰭片的光柵及在相繼的基板上形成具有不同傾斜角的鰭片。該等方法包括以下步驟：將固位在平台板上的基板的部分定位在離子束的路徑中。該等基板具有設置在該等基板上的光柵材料。該離子束被配置為相對於該等基板的表面法線用離子束角ϑ接觸該光柵材料及在該光柵材料中形成光柵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to methods and apparatus for forming gratings having a plurality of fins with different slant angles on a substrate and forming fins with different slant angles on successive substrates using angled etch systems and/or an optical device. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ϑ relative to a surface normal of the substrates and form gratings in the grating material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">203:控制器</p>
        <p type="p">302:入口電極</p>
        <p type="p">304:抑制電極</p>
        <p type="p">306:出口電極</p>
        <p type="p">312:離子束</p>
        <p type="p">400:電極組件</p>
        <p type="p">402:第一致動器</p>
        <p type="p">405:第二致動器</p>
        <p type="p">410:第三致動器</p>
        <p type="p">415:第一距離</p>
        <p type="p">417:第二距離</p>
        <p type="p">420:中線</p>
        <p type="p">425:第三距離</p>
        <p type="p">α:射束角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2375" publication-number="202632227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波傳感器、背襯結構、及相關的方法</chinese-title>
        <english-title>ULTRASONIC TRANSDUCERS, BACKING STRUCTURES AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G01D5/48</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商共振聲學國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONANT ACOUSTICS INTERNATIONAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查加雷斯　尼可拉斯克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAGGARES, NICHOLAS CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利安　法拉克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALIAN, VARAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里德　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIEDER, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了一種超音波傳感器，超音波傳感器具有試樣接觸部分及背部，背部與試樣接觸部分相對。傳感器包括：壓電材料，被配置為與試樣聲連通；及背襯結構，與壓電材料聲連通。背襯結構被配置為朝向超音波傳感器的試樣接觸部分及背向背部反射聲能。背襯結構包括低聲阻抗層及高聲阻抗層。傳感器也可以包括第二雙層去匹配背襯。第二雙層去匹配背襯包括第二低聲阻抗層及第二高聲阻抗層。也提供了超音波傳感器，此些超音波傳感器包括一維壓電陣列或二維壓電矩陣且包括配置為反射聲能的背襯結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided an ultrasonic transducer having a sample-contacting portion and a back portion, the back portion being opposed to the sample contacting portion. The transducer includes a piezoelectric material configured to be in acoustic communication with a sample and a backing structure in acoustic communication with the piezoelectric material. The backing structure is configured to reflect acoustic energy towards the sample-contacting portion and away from the back portion of the ultrasonic transducer. The backing structure includes a low acoustic impedance layer and a high acoustic impedance layer. The transducer may also include a second dual layer de-matching backing. The second dual layer de-matching backing includes a second low acoustic impedance layer and a second high acoustic impedance layer. There are also provided ultrasonic transducers including a one-dimensional piezoelectric array or a two-dimensional piezoelectric matrix and including backing structure configured to reflect acoustic energy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:壓電材料</p>
        <p type="p">104:前表面</p>
        <p type="p">106:背表面</p>
        <p type="p">108:背襯結構</p>
        <p type="p">110:第一雙層去匹配背襯</p>
        <p type="p">112:第一石墨層</p>
        <p type="p">114:由鎢製成的層</p>
        <p type="p">116:第二雙層去匹配背襯</p>
        <p type="p">118:第二石墨層</p>
        <p type="p">120:銅層</p>
        <p type="p">128:單個去匹配層</p>
        <p type="p">132:耐磨層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2376" publication-number="202632683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108886</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於雲端系統之白內障治療的裝置、方法和系統</chinese-title>
        <english-title>DEVICE, METHOD AND SYSTEM FOR CLOUD BASED SYSTEM CATARACT TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260428B">G16H50/20</main-classification>
        <further-classification edition="201801120260428B">G16H50/70</further-classification>
        <further-classification edition="200601120260428B">A61F9/008</further-classification>
        <further-classification edition="200601120260428B">A61F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藍薩爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENSAR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴頓　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATTON, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可協助選擇適當的干預以治療眼睛疾病及傷害的系統、裝置及方法。本發明構思之系統提供基於臨床及病患特定數據的雲端處理和存儲，其可使用本機裝置向從業醫師提供治療建議及預計結果。系統、裝置及方法可生成一特定個體之眼睛的互動式物理力學模型，導出對該個體眼睛結構之機械特性的測量。物理力學模型為互動式的，且可用於模擬一或多種醫療干預在眼睛中的效果，以便為個體實施更理想的治療計畫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, devices and methods are provided that provide assistance in selecting appropriate interventions for treatment of disease and injury to the eye. Systems of the inventive concept provide cloud-based processing and storage of clinical and patient-specific data, which can provide treatment recommendations and projected outcomes to a practitioner using a local device. Systems, devices, and methods can generate interactive physiomechanical models of the eye of a specified individual, which are derived measurements of mechanical properties of structures of the eye. The physiomechanical model is interactive, and can be used to emulate the effects of one or more medical interventions in the eye in order to implement an optimized treatment plan for the individual.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:本機介面</p>
        <p type="p">120:網際網路介面</p>
        <p type="p">130:輸入/輸出介面</p>
        <p type="p">140:處理</p>
        <p type="p">150:數據儲存</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2377" publication-number="202632067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115109380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於含鈦混合金屬氧化物膜之沉積的ＵＶ固化前驅體溶液以及由金屬氧化物膜的液相沉積形成的光學元件</chinese-title>
        <english-title>UV-CURABLE PRECURSOR SOLUTIONS FOR DEPOSITION OF MIXED METAL OXIDE FILMS CONTAINING TITANIUM, AND OPTICAL ELEMENTS FORMED BY LIQUID PHASE DEPOSITION OF METAL OXIDE FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C23C18/12</main-classification>
        <further-classification edition="200601120260421B">C23C22/06</further-classification>
        <further-classification edition="200601120260421B">C23C22/54</further-classification>
        <further-classification edition="200601120260421B">C09D5/33</further-classification>
        <further-classification edition="200601120260421B">C01G23/053</further-classification>
        <further-classification edition="200601120260421B">C23C22/82</further-classification>
        <further-classification edition="202301120260421B">H10K71/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商弗視優公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOSIO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙德基　奧米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADEGHI, OMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱士樂　道格拉斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KESZLER, DOUGLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露之示例涉及使用酸穩定前驅體溶液以藉由液相沉積來形成低裂紋以及無裂紋的含鈦氧化物膜。示例提供了一種藉由液相沉積形成含鈦氧化物膜的方法。本方法包括用酸穩定水性前驅體溶液塗佈基板以形成薄膜。酸穩定水性前驅體溶液包括鈦離子、一或多種其它金屬離子、可光解及/或可熱解配位體以及酸。本方法進一步包括將薄膜曝露於熱或光中的一或多種。所揭露之示例亦涉及使用金屬氧化物膜的液相沉積形成光學元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to the use of acid-stabilized precursor solutions for forming low-cracking and crack-free titanium-containing oxide films by liquid phase deposition. One example provides a method for forming a titanium-containing oxide film by liquid-phase deposition. The method comprises film a substrate with an acid-stabilized aqueous precursor solution to form a film. The acid-stabilized aqueous precursor solution comprises titanium ions, one or more other metal ions, a photolyzable and/or pyrolyzable ligand, and an acid. The method further comprises exposing the film to one or more of heat or light. Examples are also disclosed that relate to forming optical devices using liquid phase deposition of metal oxide films.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
        <p type="p">110:步驟</p>
        <p type="p">120:步驟</p>
        <p type="p">122:步驟</p>
        <p type="p">123:步驟</p>
        <p type="p">124:步驟</p>
        <p type="p">126:步驟</p>
        <p type="p">128:步驟</p>
        <p type="p">130:步驟</p>
        <p type="p">132:步驟</p>
        <p type="p">134:步驟</p>
        <p type="p">136:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2378" publication-number="202633259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115109415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>間隙填充的非晶碳</chinese-title>
        <english-title>AMORPHOUS CARBON FOR GAP FILL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P14/00</main-classification>
        <further-classification edition="202601120260421B">H10P14/69</further-classification>
        <further-classification edition="200601120260421B">C23C16/26</further-classification>
        <further-classification edition="200601120260421B">C23C16/455</further-classification>
        <further-classification edition="200601120260421B">C23C16/04</further-classification>
        <further-classification edition="200601120260421B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔笑全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, XIAOQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李光德Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KWANGDUK D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了用於在基板上沉積非晶碳層及用於用非晶碳間隙填充法填充基板特徵的方法。此方法包括執行沉積循環，該沉積循環包括以下步驟：將烴源引入處理腔室；將電漿引發氣體引入處理腔室；在處理腔室內在大於600℃的溫度下產生電漿；以大於200 nm/hr的沉積速率在基板上形成非晶碳層；以及淨化處理腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for depositing an amorphous carbon layer on a substrate and for filling a&lt;br/&gt; substrate feature with an amorphous carbon gap fill are described. The method&lt;br/&gt; comprises performing a deposition cycle comprising: introducing a hydrocarbon source into a processing chamber; introducing a plasma initiating gas into the processing chamber; generating a plasma in the processing chamber at a temperature of greater than 600 °C; forming an amorphous carbon layer on a substrate with a deposition rate of greater than 200 nm/hr; and purging the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">506:預處理操作</p>
        <p type="p">510:沉積</p>
        <p type="p">512:操作</p>
        <p type="p">514:操作</p>
        <p type="p">516:操作</p>
        <p type="p">518:操作</p>
        <p type="p">520:操作</p>
        <p type="p">522:判定點</p>
        <p type="p">524:後處理操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2379" publication-number="202633319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115109673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在製造系統控制器的更新過程期間的輸入／輸出（ＩＯ）處理之方法、系統及非暫時性電腦可讀取儲存媒體</chinese-title>
        <english-title>METHOD, SYSTEM, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM OF INPUT/OUTPUT (IO) HANDLING DURING UPDATE PROCESS FOR MANUFACTURING SYSTEM CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P70/00</main-classification>
        <further-classification edition="202601120260421B">H10P74/00</further-classification>
        <further-classification edition="200601120260421B">G05B23/00</further-classification>
        <further-classification edition="200601120260421B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅波夫斯基　尤金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOBOVSKI, EUGENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕納席尤克　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASYUK, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡卡特桑　吉森卓安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATESAN, JITHENDRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了用於在製造系統控制器的更新過程期間進行輸入/輸出(IO)處理的多種方法及系統。系統控制器的IO驅動器在製程腔室的部件以及系統控制器的基板製程IO處理器之間傳送第一通知。基板製程IO處理器執行與製程配方對應的基板製程控制指令。第一通知對應於與基板製程控制指令相關聯的運作。判定基板製程控制指令應更新。偵測到基板製程已終止。在製程腔室的部件以及系統IO處理器之間傳送第二通知。系統更新IO處理器執行系統更新控制指令，所述系統更新控制指令包含多個命令，該些命令經配置以使製程腔室的部件在基板製程控制指令被更新的同時將製程腔室的環境維持在目標條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for input/output (IO) handling during an update process for a manufacturing system controller are provided. First notifications are transmitted by an IO driver of a system controller between components of a process chamber and a substrate process IO handler of the system controller. The substrate process IO handler executes substrate process control instructions corresponding to a process recipe. The first notifications correspond to operations associated with substrate process control instructions. A determination is made that substrate process control instructions are to be updated. A detection is made that the substrate process is terminated. Second notifications are transmitted between the components of the process chamber and a system IO handler. The system update IO handler executes system update control instructions including commands configured to cause the components of the process chamber to maintain an environment of the process chamber at a target condition while the substrate process control instructions are updated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">410,412,414,416,418,420:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2380" publication-number="202633501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115109912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於包含光子積體電路的封裝的電互連</chinese-title>
        <english-title>ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260423B">H10W74/00</main-classification>
        <further-classification edition="202601120260423B">H10W74/01</further-classification>
        <further-classification edition="200601120260423B">G02B6/12</further-classification>
        <further-classification edition="200601120260423B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天空人工智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELESTIAL AI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔法羅尼　馬特歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAFFARONI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法斯　索拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VATS, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩尼　蘇巴爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHNI, SUBAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧茲古克　伊斯梅爾哈奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZGUC, ISMAIL HAKKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統級封裝，包括：光子積體電路（PIC），包括主動光子部件；以及堆疊在PIC上的電子積體電路（EIC），EIC包括：電連接至接合墊的電部件，以及嵌入接合墊中並從接合墊突出的銅柱，銅柱係與主動光子部件連接，而使得電部件電連接至主動光子部件。接合墊具有比銅柱的橫截面區域更大的表面區域，且其中當從EIC朝向PIC觀看時，PIC上的主動光子部件係與EIC的接合墊偏移，其中該偏移足以將該接合墊與該主動光子部件之間的寄生電容保持在預定的容限閾值等級內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system-in-package includes: a photonic integrated circuit (PIC) including an active photonic component; and an electronic integrated circuit (EIC) stacked on the PIC, the EIC including: an electrical component electrically connected to a landing pad, and a copper pillar embedded in the landing pad and protruding from the landing pad that connects with the active photonic component such that the electrical component is electrically connected to the active photonic component. The landing pad has a larger surface area than a cross sectional area of the copper pillar, and wherein, when viewed from the EIC towards the PIC, the active photonic component on the PIC is offset from the landing pad of the EIC, wherein the offset is sufficient to keep a parasitic capacitance between the landing pad and the active photonic component within a pre-determined threshold level of tolerance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路封裝</p>
        <p type="p">101:電子積體電路(EIC)</p>
        <p type="p">102:光子積體電路(PIC)</p>
        <p type="p">1104:計算節點</p>
        <p type="p">1106:點積引擎(或DNN)</p>
        <p type="p">1108:張量引擎</p>
        <p type="p">1110:訊息路由器</p>
        <p type="p">1112:一級靜態隨機存取記憶體(L1SRAM)</p>
        <p type="p">1114:二級靜態隨機存取記憶體(L2SRAM)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2381" publication-number="202631377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學用塑膠膜、偏光板及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260421B">B32B7/022</main-classification>
        <further-classification edition="200601120260421B">C08J5/18</further-classification>
        <further-classification edition="200601120260421B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯嶋征一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOJIMA, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種相對於硬物及柔軟物之兩者可使耐擦傷性良好之光學用塑膠膜。  &lt;br/&gt;本發明之光學用塑膠膜係具有第1表面、及位於與上述第1表面相反側之第2表面之塑膠膜，於上述塑膠膜之行進方向及寬度方向上，上述第1表面側之剖面之壓痕硬度、上述第2表面側之剖面之壓痕硬度、及厚度方向之正中之剖面之壓痕硬度滿足規定之關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2382" publication-number="202632947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有輔助修補之容積視訊</chinese-title>
        <english-title>VOLUMETRIC VIDEO WITH AUXILIARY PATCHES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260424B">H04N13/366</main-classification>
        <further-classification edition="201801120260424B">H04N13/282</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商內數位ＣＥ專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多里　雷納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORE, RENAUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬波　柏蘭德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUPEAU, BERTRAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟朵　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THUDOR, FRANCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法雷兀　胡里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEUREAU, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種用以將代表3D場景之資料進行編碼及解碼之方法及裝置。根據從3D場景之第一區域獲得之第一MVD內容以產生一組第一修補。在該MVD內容之視圖中，一修補係其中一個視圖之一部分。根據從3D場景之第二區域獲得之第二MVD內容以產生一組第二修補。產生一緊縮第一修補及第二修補之圖集，及該圖集係與元資料相關聯，用於該圖集中每一修補，元資料指示是否該修補係第一修補或第二修補。在解碼端，使用第一修補以彩現視埠影像，及使用第二修補以進行視埠影像之預處理或後處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and devices for encoding and decoding data representative of a 3D scene are disclosed. A set of first patches is generated from a first MVD content acquired from a first region of the 3D scene. A patch is a part of one of the views of the MVD content. A set of second patches is generated from a second MVD content acquired from a second region of the 3D scene. An atlas packing first and second patches is generated and associated with metadata indicating, for a patch of the atlas, whether the patch is a first or a second patch At the decoding side, first patches are used for rendering the viewport image and second patches are used for pre-processing or post-processing the viewport image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">70:場景</p>
        <p type="p">71,72:攝影裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2383" publication-number="202632996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分散式資源元素信號傳遞</chinese-title>
        <english-title>DISTRIBUTED RESOURCE UNIT SIGNALING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260423B">H04W72/0453</main-classification>
        <further-classification edition="202301120260423B">H04W72/232</further-classification>
        <further-classification edition="200601120260423B">H04L27/26</further-classification>
        <further-classification edition="200901120260423B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容提供了用於增加在功率譜密度（PSD）受限的無線通道上操作的無線通訊設備的傳輸功率的方法、設備和系統。更具體地，一些實現係關於支援分散式傳輸的觸發訊框和實體層彙聚協定（PLCP）協定資料單元（PPDU）設計。在一些實現中，存取點（AP）可以傳輸從無線站（STA）請求基於觸發（TB）的PPDU的觸發訊框，其中觸發訊框攜帶指示被分配用於STA的音調數量（N）的RU分配資訊並且攜帶指示N個音調被分配用於連續傳輸還是分散式傳輸的音調分佈資訊。在一些其他實現中，AP或STA可以傳輸攜帶分散式信號傳遞資訊的PPDU，分散式信號傳遞資訊指示PPDU是作為連續傳輸還是分散式傳輸來傳輸的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides methods, devices and systems for increasing the transmit power of wireless communication devices operating on power spectral density (PSD)-limited wireless channels. Some implementations more specifically relate to trigger frame and physical layer convergence protocol (PLCP) protocol data unit (PPDU) designs that support distributed transmission. In some implementations, an access point (AP) may transmit a trigger frame soliciting a trigger-based (TB) PPDU from a wireless station (STA), where the trigger frame carries RU allocation information indicating a number (N) of tones allocated for the STA and carries tone distribution information indicating whether the N tones are allocated for a contiguous transmission or a distributed transmission. In some other implementations, an AP or a STA may transmit a PPDU carrying distributed signaling information indicating whether the PPDU is transmitted as a contiguous transmission or a distributed transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2100:程序</p>
        <p type="p">2102:方塊</p>
        <p type="p">2104:方塊</p>
        <p type="p">2106:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2384" publication-number="202631613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取代哌啶化合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D451/02</main-classification>
        <further-classification edition="200601120260504B">A61K31/506</further-classification>
        <further-classification edition="200601120260504B">A61P25/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商衛材Ｒ＆Ｄ企管股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EISAI R&amp;D MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>反町啓一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SORIMACHI, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大房俊行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHFUSA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元木貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOKI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅羽太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASABA, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有食慾激素2型受體激動活性的下述式（I）、（II）、（III）及（IV）所表示的化合物或其藥劑學上允許的鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="379px" width="673px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2385" publication-number="202632135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改善熱能回收或提升地熱發電之系統</chinese-title>
        <english-title>SYSTEM FOR IMPROVED RECOVERY OF THERMAL ENERGY OR IMPROVED GENERATION OF GEOTHERMAL ELECTRICAL ENERGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">E21B33/138</main-classification>
        <further-classification edition="200601120260422B">E21B43/30</further-classification>
        <further-classification edition="200601120260422B">F03G7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＸＧＳ能量股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XGS ENERGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布瓦　阿克塞爾　皮埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOIS, AXEL-PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班若特　丹尼斯　尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENOIT, DENISE NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了各種系統和方法，用於將多段式熱到達增強護套放置於地熱井的環形空間中，以提升電能或熱能的產生效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various systems and methods are presented for placing a multi-segmented TRE sheath into an annular space of a geothermal well for purpose of improved electrical or thermal energy generation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2386" publication-number="202632062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理的加熱系統及處理腔室</chinese-title>
        <english-title>HEATING SYSTEM FOR SUBSTRATE PROCESSING AND PROCESSING CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C23C16/458</main-classification>
        <further-classification edition="202601120260421B">H10P70/00</further-classification>
        <further-classification edition="202601120260421B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯洛斯　布萊恩海斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURROWS, BRIAN HAYES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　作明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦嘉政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, CHIA CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種用於提供在處理腔室內設置的基板的均勻加熱的方法及設備。設備包括在處理腔室中設置的一或更多個加熱線圈。一或更多個加熱線圈使用加熱器桿電氣耦接到電源。加熱器桿耦接到與到加熱線圈的連接相對的遠端上的插座。插座包括饋通及經配置為從圍繞加熱器桿的區域移除污染物（如甲烷）的冷卻板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for providing uniform heating of substrates disposed within a processing chamber is provided. The apparatus includes one or more heating coils disposed in the processing chamber. The one or more heating coils are electrically coupled to a power source using heater rods. The heater rods are coupled to a socket on a distal end opposite the connection to the heating coils. The socket includes a feedthrough and a cooling plate configured to remove contaminants, such as methane, from the area surrounding the heater rod.</p>
      </isu-abst>
      <representative-img>
        <p type="p">236:外部襯墊</p>
        <p type="p">242:側壁</p>
        <p type="p">248:支架</p>
        <p type="p">280:注入蓋</p>
        <p type="p">302A:第一加熱組件</p>
        <p type="p">302B:第二加熱組件</p>
        <p type="p">303:插座</p>
        <p type="p">304:加熱器桿</p>
        <p type="p">305:插座</p>
        <p type="p">308:開口</p>
        <p type="p">313:插座</p>
        <p type="p">315:插座</p>
        <p type="p">318:開口</p>
        <p type="p">320:第一加熱器到加熱器桿連接點</p>
        <p type="p">322:第二加熱器到加熱器桿連接點</p>
        <p type="p">340:第三加熱器到加熱器桿連接點</p>
        <p type="p">342:第四加熱器到加熱器桿連接點</p>
        <p type="p">350:溫度感測器</p>
        <p type="p">352:SCR控制器</p>
        <p type="p">400A:加熱器</p>
        <p type="p">400B:加熱器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2387" publication-number="202633301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光裝置及化學機械拋光方法</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD OF CHEMICAL MECHANICAL POLISHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P52/00</main-classification>
        <further-classification edition="201201120260421B">B24B37/34</further-classification>
        <further-classification edition="201201120260421B">B24B37/015</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張壽松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHOU-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達拉拉珍　海力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUNDARARAJAN, HARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昊晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAOSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　建設</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JIANSHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化學機械拋光裝置，包括平台，用以保持拋光墊；載具，用以在拋光處理期間保持基板抵靠拋光墊的拋光表面；及溫度控制系統，包括流體媒介的源及一或更多開口，一或更多開口定位在平台上且與拋光墊分開，且配置用於將流體媒介流至拋光墊上，以加熱或冷卻拋光墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:拋光站台</p>
        <p type="p">22:馬達</p>
        <p type="p">24:平台</p>
        <p type="p">25:軸</p>
        <p type="p">28:驅動桿</p>
        <p type="p">30:拋光墊</p>
        <p type="p">32:背襯層</p>
        <p type="p">34:拋光層</p>
        <p type="p">36:拋光表面</p>
        <p type="p">38:漿料</p>
        <p type="p">39:手臂</p>
        <p type="p">40:框架</p>
        <p type="p">64:溫度感測器</p>
        <p type="p">70:載具頭</p>
        <p type="p">71:軸</p>
        <p type="p">72:支撐結構</p>
        <p type="p">74:驅動桿</p>
        <p type="p">76:馬達</p>
        <p type="p">80:彈性膜</p>
        <p type="p">82:腔室</p>
        <p type="p">84:保持環</p>
        <p type="p">86:下部塑膠部分</p>
        <p type="p">88:上部部分</p>
        <p type="p">90:控制器</p>
        <p type="p">100:溫度控制系統</p>
        <p type="p">102:冷卻系統</p>
        <p type="p">110:手臂</p>
        <p type="p">112:底座</p>
        <p type="p">120:噴嘴</p>
        <p type="p">122:噴灑</p>
        <p type="p">124:徑向區</p>
        <p type="p">126:間隙</p>
        <p type="p">134:混合腔室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2388" publication-number="202633390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115110925</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可用於模型訓練的掃描自由基感測器</chinese-title>
        <english-title>SCANNING RADICAL SENSOR USABLE FOR MODEL TRAINING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P74/00</main-classification>
        <further-classification edition="200601120260421B">H05H1/02</further-classification>
        <further-classification edition="200601120260421B">G01R1/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫非特　史帝夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFATT, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾肯　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILKENE, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實施例中，描述了一種具有可延伸探針的電漿處理工具。在一實施例中，該電漿處理工具包括腔室和用於支撐基板的基座。在一實施例中，邊緣環包圍基座的周邊。另外，提供了位於探針末端處的感測器。在一實施例中，探針被配置為在基座上方延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a plasma processing tool with an extendable probe is described. In an embodiment, the plasma processing tool comprises a chamber, and a pedestal for supporting a substrate. In an embodiment, an edge ring is around a perimeter of the pedestal. Additionally, a sensor at an end of a probe is provided. In an embodiment, the probe is configured to extend over the pedestal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">590:過程</p>
        <p type="p">591:操作</p>
        <p type="p">592:操作</p>
        <p type="p">593:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2389" publication-number="202632855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔離變換器的晶片架構及隔離變換器</chinese-title>
        <english-title>CHIP ARCHITECTURE OF ISOLATION CONVERTER AND ISOLATION CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">H02M1/08</main-classification>
        <further-classification edition="200601120260420B">H02M3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杰華特微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔昌為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, CHANG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何穎彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YING YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及晶片設計技術領域，公開了一種隔離變換器的晶片架構及隔離變換器，其中，包括一次側控制部、隔離通信部和二次側控制部，一次側控制部配置有一次側控制晶片、一次側驅動晶片和一次側電晶體，一次側控制晶片、一次側驅動晶片和一次側電晶體中的至少部分可獨立設計；隔離通信部配置有一次側解調晶片和二次側調製晶片，一次側解調晶片和二次側調製晶片合封；二次側控制部至少配置有二次側主控晶片和二次側整流電晶體，二次側主控晶片被配置為控制二次側整流電晶體，並通過二次側調製晶片和一次側解調晶片與一次側控制晶片進行通信。本發明提出的晶片架構可以形成多種合封組合，降低了晶片開發成本，提高了合封靈活性，大大提高了對不同應用場景的適用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a field of chip design technology and discloses a chip architecture of an isolation converter and the isolation converter. The isolation converter comprises a primary control unit, an isolation communication unit, and a secondary control unit. The primary control unit is configured with a primary control chip, a primary drive chip, and a primary transistor. At least some of the primary control chip, the primary drive chip, and the primary transistor can be independently designed. The isolated communication department is configured with a primary demodulation chip and a secondary modulation chip, which are co-packaged. The secondary side control unit is configured with at least a secondary side main control chip and a secondary side rectifier transistor. The secondary side main control chip is configured to control the secondary side rectifier transistor and communicate with the primary side control chip through the secondary side modulation chip and the primary side demodulation chip. The chip architecture proposed in the present disclosure can form multiple co-packaging combinations, reducing chip development costs, improving co-packaging flexibility, and greatly enhancing applicability to different application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:一次側控制部</p>
        <p type="p">110:一次側控制晶片</p>
        <p type="p">120:一次側驅動晶片</p>
        <p type="p">130:一次側電晶體</p>
        <p type="p">200:隔離通信部</p>
        <p type="p">210:一次側解調晶片</p>
        <p type="p">220:二次側調製晶片</p>
        <p type="p">300:二次側控制部</p>
        <p type="p">310:二次側主控晶片</p>
        <p type="p">320:二次側整流電晶體</p>
        <p type="p">N&lt;sub&gt;P&lt;/sub&gt;:一次繞組</p>
        <p type="p">N&lt;sub&gt;S&lt;/sub&gt;:二次繞組</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓</p>
        <p type="p">V&lt;sub&gt;O&lt;/sub&gt;:輸出電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2390" publication-number="202632852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隔離變換器的低功耗自適應控制方法、裝置及隔離變換器</chinese-title>
        <english-title>LOW-POWER ADAPTIVE CONTROL METHOD AND DEVICE FOR ISOLATED CONVERTER, AND ISOLATED CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260417B">H02M1/00</main-classification>
        <further-classification edition="200601120260417B">H02M3/335</further-classification>
        <further-classification edition="202601120260417B">H02J7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杰華特微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　必亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, PIT LEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及隔離變換器技術領域，公開了一種隔離變換器的低功耗自適應控制方法、裝置及隔離變換器，隔離變換器包括一次側控制晶片、隔離通信部和二次側主控晶片，其中，低功耗自適應控制方法包括：回應於低功耗控制指令，二次側主控晶片將低功耗信號通過隔離通信部發送給一次側控制晶片，以使一次側控制晶片基於定期巡檢的方式控制一次側解調晶片進行打嗝供電，並且二次側主控晶片基於隔離變換器的輸出電壓控制二次側調製晶片進行打嗝供電。本發明對一次側解調晶片和二次側調製晶片的供電狀態進行自適應控制，在顯著降低隔離變換器的整體功耗的同時，還能夠滿足隔離變換器的正常通信需求，提升系統對不同應用場景的適應性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a field of isolation converter technology and discloses a low-power adaptive control method and device for isolation converter and an isolation converter. The isolation converter comprises a primary control chip, an isolation communication unit, and a secondary main control chip. The low-power adaptive control method comprises: response to a low-power control instruction, the secondary control chip sending a low-power signal to the primary control chip through the isolation communication unit, so that the primary control chip controls a primary demodulation chip to perform hiccup power supply based on a manner of regular inspection, and the secondary control main chip controls a secondary modulation chip to perform hiccup power supply based on an output voltage of the isolation converter. The present disclosure adaptively controls a power supply status of the primary demodulation chip and the secondary modulation chip, significantly reducing an overall power consumption of the isolation converter while also meeting normal communication requirements of the isolation converter, and improving adaptability of system to different application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2391" publication-number="202631063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111125</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容納液體的容器的或用於該容器的部件以及包括此種部件的容器</chinese-title>
        <english-title>INSERT OF OR FOR A CONTAINER FOR RECEIVING A LIQUID AND CONTAIN-ER COMPRISING SUCH AN INSERT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A47J27/21</main-classification>
        <further-classification edition="200601120260422B">A47J36/06</further-classification>
        <further-classification edition="200601120260422B">A47J31/44</further-classification>
        <further-classification edition="200601120260422B">B65D47/20</further-classification>
        <further-classification edition="200601120260422B">B65D85/72</further-classification>
        <further-classification edition="200601120260422B">B65D5/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＰＩ設計公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI-DESIGN AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約爾延　博杜姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JORGEN, BODUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明牽涉一種容納液體的容器的或用於該容器的部件，其中，該部件包括：承載體，該承載體形成有第一開口以及第二開口；閉合構件，該閉合構件連接到或能夠連接到該承載體；以及啟動單元，其中，該閉合構件包括：第一閉合部分，當該閉合構件連接到該承載體時，通過該第一閉合部分閉合該第一開口；以及第二閉合部分，該第二閉合部分能夠移動地支撐在該閉合構件中並與該啟動單元相互作用，並且當該閉合構件連接到該承載體時，在啟動該啟動單元時，能夠通過該第二閉合部分打開和閉合該第二開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is drawn to an insert for a container for receiving a liquid, wherein the insert comprises a carrier body which forms a first opening , and a second opening , a closure member which is connected or connectable to the carrier body , and an activation unit , wherein the closure member comprises a first closing section by which the first opening is closed when the closure member is connected to the carrier body , and a second closing section that is movably supported in the closure member and interacting with the activation unit and by which the second opening can be opened and closed upon activating the activation unit when the closure member is connected to the carrier body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:部件</p>
        <p type="p">14:承載體</p>
        <p type="p">16:第一開口</p>
        <p type="p">18:第二開口</p>
        <p type="p">22:閉合構件</p>
        <p type="p">24:啟動單元</p>
        <p type="p">28:第二閉合部分</p>
        <p type="p">30:鎖定裝置</p>
        <p type="p">32:杠杆</p>
        <p type="p">34:支撐板</p>
        <p type="p">36:凸起</p>
        <p type="p">38:導向元件</p>
        <p type="p">40:間隙</p>
        <p type="p">42:固定板</p>
        <p type="p">44:固定彈簧</p>
        <p type="p">48:杠杆彈簧</p>
        <p type="p">49:鎖定彈簧</p>
        <p type="p">50:平整表面</p>
        <p type="p">54:突出部</p>
        <p type="p">56:第一墊圈</p>
        <p type="p">58:第二墊圈</p>
        <p type="p">62:排氣閥</p>
        <p type="p">A1:部件軸線</p>
        <p type="p">A2:杠杆軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2392" publication-number="202633004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多鏈路操作中的直接鏈路通訊</chinese-title>
        <english-title>DIRECT LINK COMMUNICATIONS IN MULTI-LINK OPERATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260422B">H04W76/15</main-classification>
        <further-classification edition="201801120260422B">H04W76/14</further-classification>
        <further-classification edition="202401120260422B">H04W74/08</further-classification>
        <further-classification edition="200901120260422B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伽里恩　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　世耀當肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SAI YIU DUNCAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTERJADHI, ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　言軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛加特　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOGAT, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塔洽亞　圖許寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATTACHARYYA, TUSHNIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬韓　拉傑許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUHAN, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案的某些態樣提供用於處理多鏈路系統中的直接鏈路通訊的技術。實例方法通常包括經由第一無線站與隸屬於多鏈路設備（MLD）的一或多個第二無線站之間的直接鏈路向第一無線站傳輸資料訊框，該資料訊框包括設置為MLD的位址，它是與MLD相關聯的複數個位址中的一個位址，並且第二無線站隸屬於MLD用於多鏈路操作。該方法亦包括經由直接鏈路與第一無線站通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques for handling direct link communications in multi-link systems. An example method generally includes transmitting, to a first wireless station via a direct link between the first wireless station and one or more second wireless stations affiliated with a multi-link device (MLD), a data frame comprising a transmitter address field set to an address of the MLD, which is one of a plurality of addresses associated with the MLD and the second wireless stations being affiliated with the MLD for multi-link operations. The method also includes communicating with the first wireless station via the direct link.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000B:操作</p>
        <p type="p">1008:方塊</p>
        <p type="p">1010:方塊</p>
        <p type="p">1012:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2393" publication-number="202631665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗Ｃ１ｓ抗體</chinese-title>
        <english-title>ANTI-C1S ANTIBODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/18</main-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="200601120260504B">A61P37/00</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
        <further-classification edition="200601120260504B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供包含抗原結合區及抗體恆定區的pH依賴性結合C1s的抗體。本發明更提供含有該抗體任一種的醫藥組合物，以及提供包含投予個體該抗體任一種之治療具有補體媒介性的疾病或障礙的個體之方法或預防具有補體媒介性的疾病或障礙的可能性的個體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2394" publication-number="202632209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣槍底座裝置結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260417B">F41B11/68</main-classification>
        <further-classification edition="201301120260417B">F41B11/641</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種氣槍底座裝置結構，所述該氣槍底座裝置其包括：一氣槍、一氣接件以及一底座，所述該氣槍內形成一容置部且其底部上有一結合部，一導氣件設置於該容置部中且於末端處具有一導氣組部，所述該氣接件中設置有一刺破件且其中一端具有一定位孔，所述該氣接件利用一限位件設置於所述該底座中並所述該底座上一接合部與該結合部組接設置，所述該氣接件組接該導氣組部，一底板之一導引槽與該定位孔中穿設有一定位件，按壓該底板透過該定位件移動於該導引槽中增加該刺破件往上推動之順暢度，當該接合部無法組接該結合部時下拉所述該底座利用該限位件控制一環槽轉動且一制動部限制其轉動位置。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:氣槍底座裝置</p>
        <p type="p">2:氣槍</p>
        <p type="p">21:容置部</p>
        <p type="p">211:結合部</p>
        <p type="p">22:導氣件</p>
        <p type="p">221:導氣組部</p>
        <p type="p">3:氣接件</p>
        <p type="p">31:抵部</p>
        <p type="p">32:接部</p>
        <p type="p">321:接部O環</p>
        <p type="p">34:氣槽</p>
        <p type="p">35:刺破件</p>
        <p type="p">351:定位孔</p>
        <p type="p">4:底座</p>
        <p type="p">41:接合部</p>
        <p type="p">42:槽部</p>
        <p type="p">421:擋部</p>
        <p type="p">43:限位孔</p>
        <p type="p">431:限位件</p>
        <p type="p">441:穿接孔</p>
        <p type="p">45:底板</p>
        <p type="p">451:穿設孔</p>
        <p type="p">452:彈性件</p>
        <p type="p">453:接設件</p>
        <p type="p">454:導引槽</p>
        <p type="p">455:定位件</p>
        <p type="p">456:底孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2395" publication-number="202632395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115111534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">G02F1/1333</main-classification>
        <further-classification edition="200601120260421B">G02F1/1335</further-classification>
        <further-classification edition="202301120260421B">H10K77/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳釉鏞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YOU-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玄周奉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYUN, JOO BONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昭娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SO YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置可以包括用以暴露出第一子像素的第一開口部分及第二子像素的第一開口部分的堤部、設置對應於第一子像素的第一開口部分及第二子像素的第一開口部分的多個第一透鏡、設置在堤部與多個第一透鏡之間且包括第一開槽的光學層以及設置在光學層的第一開槽中的填充物，所述第一開槽位於對應於第一子像素的第一開口部分的多個第一透鏡中的一個與對應於第二子像素的第一開口部分的多個第一透鏡中的另一個之間，且所述第一開槽具有第一厚度。另外，所述填充物與沿第一方向排列的兩個第一透鏡對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device can include a bank exposing a first open portion of a first sub-pixel and a first open portion of a second sub-pixel, a plurality of first lenses disposed to correspond to the first open portion of the first sub-pixel and the first open portion of the second sub-pixel, an optical layer disposed between the bank and the plurality of first lenses, the optical layer including a first groove between one of the plurality of first lenses corresponding to the first open portion of the first sub-pixel and another one of the plurality of first lenses corresponding to the first open portion of the second sub-pixel, the first groove having a first thickness, and a filler disposed in the first groove of the optical layer. Also, the filler is aligned with two of the plurality of first lenses in a first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置陣列</p>
        <p type="p">180:封裝膜</p>
        <p type="p">210:黑矩陣</p>
        <p type="p">220:光學層</p>
        <p type="p">220a:開槽</p>
        <p type="p">230:感測器電極</p>
        <p type="p">240:損失防止透鏡結構</p>
        <p type="p">241:第一透鏡</p>
        <p type="p">243:填充透鏡</p>
        <p type="p">245:連接部分</p>
        <p type="p">260:第二平坦化膜</p>
        <p type="p">d:階差</p>
        <p type="p">OA1,OA2:開口部分</p>
        <p type="p">SP2,SP3:子像素</p>
        <p type="p">t1,t2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2396" publication-number="202632602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多束光柵掃描顯微鏡的圖框聚合</chinese-title>
        <english-title>FRAME AGGREGATION FOR MULTI-BEAM RASTER SCANNING MICROSCOPES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260429B">G06T7/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼凱爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICKELL, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加保斯基　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARBOWSKI, TOMASZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘特雷特　費德荷姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANTELEIT, FRIEDHELM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露各種有關多個影像(1051、1052、1053、154)多束光柵掃描顯微鏡的圖框聚合之實例。如果需要，多個影像校準參數可經評估及調整。這產生更佳的影像校準，結果造成更佳的整體複合影像品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various examples pertain to frame-aggregation for multiple images (1051, 1052, 1053, 154) multi-beam raster scanning microscopes. Image registration parameters can be assessed and adjusted, if required. This yields better image registration, resulting in a better quality of the overall composite image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1010:視場(FOV)</p>
        <p type="p">1050:序列</p>
        <p type="p">1051:影像</p>
        <p type="p">1052:影像</p>
        <p type="p">1053:影像</p>
        <p type="p">1054:影像</p>
        <p type="p">1059:聚合影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2397" publication-number="202633243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260429B">H10K50/805</main-classification>
        <further-classification edition="202301120260429B">H10K50/844</further-classification>
        <further-classification edition="202301120260429B">H10K59/80</further-classification>
        <further-classification edition="202301120260429B">H10K59/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MOON-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文英均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, YOUNG KYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一種顯示設備包含：基板，包含第一至第三子像素；堤部層，位於基板上以劃分多個子像素；電晶體，位於每個第一至第三子像素中；發光裝置，位於第一至第三子像素中的每一者中，發光裝置包含第一電極、發光層以及第二電極；輔助電極，位於堤部層上；第一圖案以及第二圖案，具有位於堤部層上的突出結構；以及多個第一封裝層，形成於第一至第三子像素中的每一者中，第一封裝層由第二圖案劃分，其中第二電極電性連接至堤部層上的輔助電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus according to present disclosure comprises a substrate including a plurality of first to third sub-pixels; a bank layer over the substrate to partition the plurality of sub-pixels; a transistor in each of the first to third sub-pixels; a light emitting device in each of the first to third sub-pixels, the light emitting device including a first electrode, a light emitting layer, and a second electrode; an auxiliary electrode over the bank layer; a first pattern and a second pattern having an overhang structure over the bank layer; and a plurality of first encapsulation layer formed in each of the plurality of first to third sub-pixels, the first encapsulation layer being partition by the second pattern, wherein the second electrode is electrically connected to the auxiliary electrode over the bank layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示設備</p>
        <p type="p">112:半導體圖案</p>
        <p type="p">112a:通道區域</p>
        <p type="p">112b:源極區域</p>
        <p type="p">112c:汲極區域</p>
        <p type="p">114:閘極電極</p>
        <p type="p">115:源極電極</p>
        <p type="p">116:汲極電極</p>
        <p type="p">132:第一電極</p>
        <p type="p">134:發光層、有機層</p>
        <p type="p">140:基板</p>
        <p type="p">142:緩衝層</p>
        <p type="p">144:閘極絕緣層</p>
        <p type="p">146:層間絕緣層</p>
        <p type="p">148:平坦化層</p>
        <p type="p">152:輔助電極</p>
        <p type="p">154:第一圖案</p>
        <p type="p">156:第二圖案</p>
        <p type="p">180:封裝層</p>
        <p type="p">182a:第一封裝層</p>
        <p type="p">182b:第一封裝層</p>
        <p type="p">182c:第一封裝層</p>
        <p type="p">183:無機層</p>
        <p type="p">184:第二封裝層</p>
        <p type="p">186:第三封裝層</p>
        <p type="p">BNK:堤部層</p>
        <p type="p">D:發光裝置</p>
        <p type="p">SP1:第一子像素</p>
        <p type="p">SP2:第二子像素</p>
        <p type="p">SP3:第三子像素</p>
        <p type="p">T:薄膜電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2398" publication-number="202633453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及用於部分電磁干擾屏蔽的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR PARTIAL EMI SHIELDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10W42/60</main-classification>
        <further-classification edition="202601120260428B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珍熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JINHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括基板。電組件安置於該基板上方。囊封劑沈積於該電組件上方。垂直互連結構安置於該囊封劑中。屏蔽層在該囊封劑及該垂直互連結構上方形成。凹槽圍繞該垂直互連結構形成於該屏蔽層中。該屏蔽層之一部分作為接觸襯墊保留在該垂直互連結構上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate. An electrical component is disposed over the substrate. An encapsulant is deposited over the electrical component. A vertical interconnect structure is disposed in the encapsulant. A shielding layer is formed over the encapsulant and vertical interconnect structure. A groove is formed in the shielding layer around the vertical interconnect structure. A portion of the shielding layer remains over the vertical interconnect structure as a contact pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104a:半導體晶粒</p>
        <p type="p">104b:半導體晶粒</p>
        <p type="p">104c:裸半導體晶粒</p>
        <p type="p">112:導電層</p>
        <p type="p">114:焊料凸塊/球</p>
        <p type="p">150:經屏蔽半導體封裝/底部封裝</p>
        <p type="p">152:基板</p>
        <p type="p">154:絕緣層</p>
        <p type="p">156:導電層</p>
        <p type="p">160:離散組件</p>
        <p type="p">170:囊封劑或模製化合物</p>
        <p type="p">178:垂直互連結構或導電通孔</p>
        <p type="p">180:屏蔽層</p>
        <p type="p">184:凹槽</p>
        <p type="p">186:接觸襯墊</p>
        <p type="p">220:PoP</p>
        <p type="p">222:頂部封裝</p>
        <p type="p">224:彈簧銷</p>
        <p type="p">226:黏接支座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2399" publication-number="202632197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱導管一體式液冷散熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">F28D1/04</main-classification>
        <further-classification edition="200601120260420B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡建全</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種熱導管一體式液冷散熱器，其包括液冷排、液泵、液冷頭及多數熱導管。液冷排具有上下兩液盒及散熱排管組。液泵設置在液冷排中，驅使液冷排中的冷卻液循環流動及散熱。液冷頭位於液冷排其中一液盒的下方，其底面設有多道熱導管嵌槽。熱導管的兩端形成封閉的散熱段，並分別延伸進入第二液盒內，熱導管中間的吸熱段分別嵌設在液冷頭的熱導管嵌槽中，並加工出一熱源接觸面。本發明使用時，能使熱導管中的工作液體在吸熱段與處理器熱交換升溫，升溫的工作液體流向兩端的散熱段，透過液冷排的冷卻液與散熱段熱交換降溫，藉此實現高效的熱能轉移與散熱效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液冷排</p>
        <p type="p">11:第一液盒</p>
        <p type="p">111:盒體</p>
        <p type="p">112:盒蓋</p>
        <p type="p">12:第二液盒</p>
        <p type="p">121:盒體</p>
        <p type="p">122:盒蓋</p>
        <p type="p">123:下盒壁</p>
        <p type="p">124:穿孔</p>
        <p type="p">13:散熱排管組</p>
        <p type="p">131:第一散熱排管組</p>
        <p type="p">132:第二散熱排管組</p>
        <p type="p">133:散熱管</p>
        <p type="p">134:散熱鰭片</p>
        <p type="p">20:液泵</p>
        <p type="p">22:扇葉</p>
        <p type="p">30:液冷頭</p>
        <p type="p">31:熱導管嵌槽</p>
        <p type="p">32:散熱片</p>
        <p type="p">40:熱導管</p>
        <p type="p">41:散熱段</p>
        <p type="p">42:吸熱段</p>
        <p type="p">43:熱源接觸面</p>
        <p type="p">45:擋止凸環</p>
        <p type="p">F1:平面</p>
        <p type="p">A1:微突弧面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2400" publication-number="202632786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H01R9/16</main-classification>
        <further-classification edition="201101120260428B">H01R12/71</further-classification>
        <further-classification edition="200601120260428B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李星佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組件包含第一連接器以及與第一連接器耦合之第二連接器。第一連接器包含第一底板、數個第一側板以及第一導電端子。第一側板與第一底板共同定義容置空間。第一導電端子穿過第一底板並於容置空間中延伸。第二連接器包含第二底板、數個第二側板以及第二導電端子。第二側板與第二底板形成至少一腔體。第二導電端子位於至少一腔體中。第二導電端子包含接觸部以及連接接觸部之連接部。接觸部具有鏤空部。第一導電端子穿過鏤空部並與第二導電端子電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly includes a first connector and a second connector coupled to the first connector. The first connector includes a first bottom plate, a plurality of first side plates, and a first conductive terminal. The first side plates and the first bottom plate jointly define an accommodating space. The conductive terminal passes through the first bottom plate and extends in the accommodating space. The second connector includes a second bottom plate, a plurality of second side plates, and a second conductive terminal. The second plates and the second bottom plate form at least one cavity. The second conductive terminal is located in the at least one cavity. The second conductive terminal includes a contacting portion and a connecting portion connected to the contacting portion. The contacting portion has a hollowed portion. The conductive terminal passes through the hollowed portion and is electrically connected to the second conductive terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器組件</p>
        <p type="p">110:第一連接器</p>
        <p type="p">111:第一底板</p>
        <p type="p">121:第二底板</p>
        <p type="p">112B,112D:第一側板</p>
        <p type="p">122B,122D:第二側板</p>
        <p type="p">114:第一導電端子</p>
        <p type="p">1142:端子本體</p>
        <p type="p">1144:止擋部</p>
        <p type="p">115:凸台</p>
        <p type="p">120:第二連接器</p>
        <p type="p">130:插塞</p>
        <p type="p">B:第二導電端子</p>
        <p type="p">C1:第一腔體</p>
        <p type="p">C2:第二腔體</p>
        <p type="p">CN:連接部</p>
        <p type="p">CT:接觸部</p>
        <p type="p">DS:散熱通道</p>
        <p type="p">H:開孔</p>
        <p type="p">HP:鏤空部</p>
        <p type="p">LD:段差</p>
        <p type="p">P1,P2:分隔部</p>
        <p type="p">W&lt;sub&gt;1142&lt;/sub&gt;,W&lt;sub&gt;1144&lt;/sub&gt;:寬度</p>
        <p type="p">W&lt;sub&gt;H&lt;/sub&gt;:最小寬度</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2401" publication-number="202633447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱元件及散熱片</chinese-title>
        <english-title>HEAT CONDUCTING ELEMENT AND HEAT SPREADER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260429B">H10W40/25</main-classification>
        <further-classification edition="200601120260429B">C23C16/27</further-classification>
        <further-classification edition="200601120260429B">C04B35/52</further-classification>
        <further-classification edition="200601120260429B">C04B35/645</further-classification>
        <further-classification edition="200601120260429B">B32B9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多晶鑽石複合材料，用於導熱元件、散熱片、晶片封裝的蓋體及晶片封裝結構，該晶片封裝結構包括一或多個晶片、一或多個熱介面材料以及一散熱蓋體，該熱介面材料接觸於該晶片，該散熱蓋體包括一本體以及一多晶鑽石體，該本體包括一水平壁部分及一垂直壁部分，該垂直壁部分連接該水平壁部分的一周圍，該水平壁部分及該垂直壁部分共同地限定出一凹槽，該水平壁部分具有一貫孔，該多晶鑽石體設置於該貫孔之中，該多晶鑽石體與該晶片進行熱接觸且用於移除該晶片的一或多個熱點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polycrystalline diamond composite material comprises a heat conducting element, a heat spreader, a lid and a chip package structure. The chip package structure includes one or more chips, one or more thermal interface materials, and a heat dissipation lip. The one or more thermal interface materials is in contact with the chip. The heat dissipation lip includes a main body and a polycrystalline diamond. The main body includes a horizontal wall section and a vertical wall section. The vertical wall section is connected with a periphery of the horizontal wall section. The horizontal wall section and the vertical wall section jointly defines a recess. The horizontal wall section has a via. The polycrystalline diamond is disposed in the via. The polycrystalline diamond is in thermal contact with the chip, and is configured to remove one or more hot spots of the chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:晶片封裝結構</p>
        <p type="p">51:鑽石中介層</p>
        <p type="p">52:處理器晶片</p>
        <p type="p">53:記憶體晶片</p>
        <p type="p">53a、53b、53c:高頻寬記憶體</p>
        <p type="p">54:第一熱介面材料</p>
        <p type="p">55:第二熱介面材料</p>
        <p type="p">56:蓋板</p>
        <p type="p">57:第三熱介面材料</p>
        <p type="p">60:印刷電路板</p>
        <p type="p">61:焊球陣列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2402" publication-number="202632535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智能家禽輔助飼養方法與系統</chinese-title>
        <english-title>INTELLIGENT POULTRY FARMING AUXILIARY SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G06N3/02</main-classification>
        <further-classification edition="200601120260422B">A01K29/00</further-classification>
        <further-classification edition="200601120260422B">A01K45/00</further-classification>
        <further-classification edition="202401120260422B">G06Q50/02</further-classification>
        <further-classification edition="202201120260422B">G06V10/82</further-classification>
        <further-classification edition="202201120260422B">G06V10/26</further-classification>
        <further-classification edition="202201120260422B">G06V10/24</further-classification>
        <further-classification edition="202201120260422B">G06V10/764</further-classification>
        <further-classification edition="202201120260422B">G06V40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智逐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHASE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃醴萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡大爲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張光甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUANG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種智能家禽輔助飼養系統與方法，此系統包括一伺服器以及一家禽診斷裝置。伺服器包括一家禽影像辨識診斷人工智能模型。家禽診斷裝置用以網路連接伺服器，其中，家禽診斷裝置包括一影像擷取裝置以及一壓力感測裝置。影像擷取裝置用以進行一影像攝影。當壓力感測裝置測出有壓力時，觸發影像擷取裝置進行影像攝影，且家禽診斷裝置將所擷取的影像傳送給伺服器。伺服器透過人工智能影像判斷模型，辨識所擷取的該第一影像中的家禽之一特定部位，藉以判斷一家禽的性別。&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an intelligent poultry farming auxiliary system and method. The system includes a server and a poultry diagnostic device. The server contains a poultry image recognition diagnostic artificial intelligence model. The poultry diagnostic device is network-connected to the server and includes an image capture device and a pressure sensor device. The image capture device is used to capture images. When the pressure sensor device detects pressure, the image capture device is triggered to capture image, and the poultry diagnostic device transmits the captured image to the server. The server is configured to identify a specific part of the poultry in the captured image through an artificial intelligence (AI) image determination model, thereby determining a sex of the poultry.&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:伺服器</p>
        <p type="p">102:家禽診斷裝置</p>
        <p type="p">103:影像擷取裝置</p>
        <p type="p">104:壓力感測裝置</p>
        <p type="p">105:雷射引導裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2403" publication-number="202631932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑片材之製造方法及黏著劑片材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260422B">C09J7/30</main-classification>
        <further-classification edition="200601120260422B">C09J11/06</further-classification>
        <further-classification edition="200601120260422B">C09J9/00</further-classification>
        <further-classification edition="200601120260422B">C09J133/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小原裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHARA, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>形見普史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAMI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中崇弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種即使於光硬化型黏著劑片材中調配紫外線吸收劑之情形時，亦不會產生因硬化性惡化所導致之生產性之下降、正反之物性差或剝離片材之剝離力之變化等物性變化，且容易設計的黏著劑片材之製造方法及藉由該製造方法而獲得之黏著劑片材。  &lt;br/&gt;本發明之黏著劑片材之製造方法之特徵在於包含如下步驟：於支持體S1上形成藉由透明之光硬化型黏著劑基底材料而形成之黏著劑層10；對上述黏著劑層10照射紫外線U而使該黏著劑層硬化；準備紫外線吸收劑11之溶液12；於上述硬化之黏著劑層10a之一面塗佈上述溶液12，使該溶液12中所含之上述紫外線吸收劑11自上述黏著劑層10a之上述一面向厚度方向滲透；使上述黏著劑層10a乾燥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏著劑片材</p>
        <p type="p">10:黏著劑層(藉由紫外線進行硬化前)</p>
        <p type="p">10a:黏著劑層(藉由紫外線進行硬化後)</p>
        <p type="p">11:紫外線吸收劑</p>
        <p type="p">12:紫外線吸收劑之溶液</p>
        <p type="p">13:溶劑</p>
        <p type="p">S1,S2:支持體(剝離片材)</p>
        <p type="p">U:紫外線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2404" publication-number="202631937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學用黏著膠帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C09J9/00</main-classification>
        <further-classification edition="201801120260430B">C09J7/29</further-classification>
        <further-classification edition="200601120260430B">C09J133/08</further-classification>
        <further-classification edition="200601120260430B">C08F2/50</further-classification>
        <further-classification edition="200601120260430B">B32B27/20</further-classification>
        <further-classification edition="200601120260430B">B32B7/12</further-classification>
        <further-classification edition="200601120260430B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖田奈津子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKITA, NATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智元氣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本尚樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池嶋裕美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKESHIMA, HIROMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野呂弘司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的在於提供一種光學用黏著膠帶，其係針對將複數個影像顯示裝置排列成拼接狀之拼接顯示器，使其即便在使用環境下，複數個影像顯示裝置間之間隙仍不明顯，且可維持透明性而可維持良好之外觀。&lt;br/&gt;  本發明光學用黏著膠帶10A具有積層有基材1與黏著劑層2之積層結構，基材1具有第1面1a及第2面1b，且黏著劑層2係位於基材1之第1面1a。將光學用黏著膠帶10A在60℃且相對濕度90%之環境下加熱500小時後，其寬度方向及機械方向之平均尺寸變化率在±0.15%以內。黏著劑層2之300%拉伸殘存應力值為10N/cm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:光學用黏著膠帶</p>
        <p type="p">1:基材</p>
        <p type="p">1a:基材之第1面</p>
        <p type="p">1b:基材之第2面</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">MD:機械方向</p>
        <p type="p">TD:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2405" publication-number="202631064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112653</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廚房器具、傢俱製品、飲料容器或飲用器皿的部件以及包括此種部件的廚房器具、傢俱製品、飲料容器或飲用器皿</chinese-title>
        <english-title>PART OF A KITCHEN APPLIANCE, ITEM OF FURNITURE, OF A BEVERAGE CONTAINER OR OF A DRINKING VESSEL AS WELL AS KITCHEN APPLIANCE, ITEM OF FURNITURE, OF A BEVERAGE CONTAINER OR OF A DRINKING VES-SEL COMPRISING SUCH A PART</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A47J31/20</main-classification>
        <further-classification edition="200601120260422B">A47J31/44</further-classification>
        <further-classification edition="200601120260422B">B65D23/00</further-classification>
        <further-classification edition="200601120260422B">B65D23/08</further-classification>
        <further-classification edition="200601120260422B">B65D85/72</further-classification>
        <further-classification edition="200601120260422B">B65D13/00</further-classification>
        <further-classification edition="200601120260422B">B65D5/40</further-classification>
        <further-classification edition="200601120260422B">B65D5/475</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＰＩ設計公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI-DESIGN AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約爾延　博杜姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JORGEN, BODUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明牽涉一種廚房器具（12）、傢俱、飲料容器或飲用器皿的部件（10），該部件（10）由透明塑膠、特別是萃特共聚酯製成，該透明塑膠包含1%至4%、特別是3%（w/w）的著色劑，該著色劑包含：58%至62%（w/w）的白色化合物，18%至22%（w/w）的黃色化合物，13%至17%（w/w）的紅色化合物，以及3%至7%（w/w）的青色化合物。除此之外，本發明還涉及一種包括此種部件（10）的廚房器具（12）、傢俱、飲料容器或飲用器皿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is drawn to a part (10) of a kitchen appliance (12), of furniture, of a beverage container or of a drinking vessel, the part (10) being made of a transparent plastic, in particular of Tritan, the transparent plastic comprising between 1 to 4%, in particular 3% (w/w) of a color creating agent, the color creating agent comprising：58 to 62% (w/w) of a white-colored compound, 18 to 22% (w/w) of a yellow-colored compound, 13 to 17% (w/w) of a red-colored compound, and 3 to 7% (w/w) of a cyan-colored compound.Beyond that, the present invention further relates to a kitchen appliance (12), furniture, beverage container or drinking vessel comprising such a part (10).</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:中心軸</p>
        <p type="p">10:部件</p>
        <p type="p">12:廚房器具</p>
        <p type="p">13:單元</p>
        <p type="p">14:飲料製作機</p>
        <p type="p">16:容器</p>
        <p type="p">18:內壁</p>
        <p type="p">20:外壁</p>
        <p type="p">22:空腔</p>
        <p type="p">24:手柄</p>
        <p type="p">26:開口</p>
        <p type="p">28:蓋子</p>
        <p type="p">30:活塞過濾元件</p>
        <p type="p">32:出液口</p>
        <p type="p">34:狹縫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2406" publication-number="202631280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112784</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀粉的製造方法以及銀粉製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260422B">B22F1/00</main-classification>
        <further-classification edition="202201120260422B">B22F1/05</further-classification>
        <further-classification edition="202201120260422B">B22F1/07</further-classification>
        <further-classification edition="202201120260422B">B22F1/102</further-classification>
        <further-classification edition="200601120260422B">B22F9/00</further-classification>
        <further-classification edition="200601120260422B">B22F9/24</further-classification>
        <further-classification edition="200601120260422B">H01B1/00</further-classification>
        <further-classification edition="200601120260422B">H01B1/22</further-classification>
        <further-classification edition="200601120260422B">H01B13/00</further-classification>
        <further-classification edition="200601120260422B">H01B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商同和電子科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大迫将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安部史也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤宏敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種銀粉的製造方法，使含有銀的溶液在流路中流動，在所述流路的中途的pH調整劑添加位置將pH調整劑添加至所述流路中，在較所述pH調整劑添加位置更靠下游處的錯合劑添加位置將錯合劑添加至所述流路中，在較錯合劑添加位置更靠下游處的還原劑添加位置將肼系還原劑添加至所述流路中，在所述流路內使銀粉還原析出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:銀粉製造裝置</p>
        <p type="p">2:管</p>
        <p type="p">4a:還原劑供給管</p>
        <p type="p">4b:還原劑供給管</p>
        <p type="p">5:表面處理劑供給管</p>
        <p type="p">6:錯合劑供給管</p>
        <p type="p">7:pH調整劑供給管</p>
        <p type="p">10:還原劑添加構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2407" publication-number="202631417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於將兒童推車轉變為摺疊配置之連桿組之兒童推車</chinese-title>
        <english-title>CHILD CARRIAGE WITH LINKAGE FOR TRANSITIONING THE CHILD CARRIAGE TO A FOLDED CONFIGURATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">B60N2/28</main-classification>
        <further-classification edition="200601120260419B">B62B7/06</further-classification>
        <further-classification edition="200601120260419B">B62B7/08</further-classification>
        <further-classification edition="200601120260419B">B62B7/14</further-classification>
        <further-classification edition="200601120260419B">B62B9/00</further-classification>
        <further-classification edition="200601120260419B">B62B9/20</further-classification>
        <further-classification edition="200601120260419B">B62B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩克　丹尼爾Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACK, DANIEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包爾斯　派翠克ＪＧ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWERS, PATRICK J.G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾斯汀　柯堤斯Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTENSTINE, CURTIS M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫斯特　安德魯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORST, ANDREW J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾格爾特　克洛伊　柯林Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGGERT-CROWE, COLIN F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊瑪　蘭斯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEMMER, LANCE J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種用於推動一兒童載具之推車具有在展開配置與摺疊配置之間轉變之一帶輪框架。該框架具有第一支腿組件及第二支腿組件及第一連桿組及第二連桿組。該第一支腿組件具有彼此可樞轉地耦接之一第一前支腿及一第一後支腿。該第二支腿組件具有彼此可樞轉地耦接之一第二前支腿及一第二後支腿。該第一連桿組附接至該第一前支腿及該第一後支腿，且該第二連桿組附接至該第二前支腿及該第二後支腿，以便隨著該框架在該展開配置與該摺疊配置之間轉變而導引該前支腿及該後支腿之移動。該第一連桿組及該第二連桿組各自界定一支撐表面，該支撐表面支撐該兒童載具之一下側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a carriage for pushing a child carrier has a wheeled frame that transitions between expanded and folded configurations. The frame has first and second leg assemblies and first and second linkages. The first leg assembly has a first front leg and a first rear leg that are pivotably coupled to one another. The second leg assembly has a second front leg and a second rear leg that are pivotably coupled to one another. The first linkage is attached to the first front leg and the first rear leg, and the second linkage is attached to the second front leg and the second rear leg so as to guide movement of the front and rear legs as the frame is transitioned between the expanded and folded configurations. The first and second linkages each define a support surface that supports an underside of the child carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:旅行系統</p>
        <p type="p">100:兒童推車；推車</p>
        <p type="p">104:輪子</p>
        <p type="p">200:嬰兒汽車座椅；兒童載具</p>
        <p type="p">206:座椅表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2408" publication-number="202632727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115112996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用粒子束處理及／或檢驗樣本的方法及裝置、及執行所述方法的電腦程式</chinese-title>
        <english-title>METHOD AND DEVICE FOR PROCESSING AND/OR EXAMINING A SAMPLE USING A PARTICLE BEAM, AND COMPUTER PROGRAM FOR EXECUTING THE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/304</main-classification>
        <further-classification edition="200601120260422B">H01J37/26</further-classification>
        <further-classification edition="201201120260422B">G03F1/78</further-classification>
        <further-classification edition="201201120260422B">G03F1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里諾夫　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHINOW, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊修森　索倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYHUSEN, SOEREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案係有關於一種使用粒子束(E)以處理及/或檢驗樣本(100)的方法，所述方法包括以下步驟：確定該樣本(100)的靜電荷狀態；至少部分基於該所確定的靜電荷狀態向該樣本周圍的一元件(H)施加電壓；其中該元件(H)包含兩或多個分段；及/或其中該元件(H)可相對於該樣本(100)移動。  &lt;br/&gt;本發明也有關於一對應的電腦程式及裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for processing and/or examining a sample (100) using a particle beam (E), including the following steps: determining an electrostatic charge state of the sample (100); applying a voltage to an element (H) in surroundings of the sample, based at least in part on the determined electrostatic charge state; wherein the element (H) comprises two or more segments; and/or wherein the element (H) is movable relative to the sample (100). &lt;br/&gt;The disclosure also relates to a corresponding computer program and a device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微影光罩</p>
        <p type="p">B:多層堆疊</p>
        <p type="p">C:塗層</p>
        <p type="p">D:披覆層</p>
        <p type="p">E:電子束</p>
        <p type="p">ES:電子束源</p>
        <p type="p">H:支承體</p>
        <p type="p">P:圖案元件</p>
        <p type="p">S:基板</p>
        <p type="p">U:電壓源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2409" publication-number="202633471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括貫穿電極的半導體晶片和包括其之半導體封裝件</chinese-title>
        <english-title>SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10W70/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫晧榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, HO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊周憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JU HEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體晶片包括：主體部分，其具有前表面和後表面；貫穿電極，其貫穿主體部分；佈線部分，其設置在主體部分的前表面上方；後連接電極，其設置在主體部分的後表面上方；以及前連接電極，其設置在佈線部分上方，其中，後連接電極包括同時連接至兩個或更多個電源貫穿電極的電源後連接電極，並且其中，電源後連接電極的寬度大於前連接電極的寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor chip includes a body portion with a front surface and a rear surface; a through electrode penetrating the body portion; a wiring portion that is disposed over the front surface of the body portion; a rear connection electrode that is disposed over the rear surface of the body portion; and a front connection electrode that is disposed over the wiring portion, wherein the rear connection electrode includes a power rear connection electrode that is simultaneously connected to two or more power through electrodes, and wherein a width of the power rear connection electrode is greater than a width of the front connection electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶片</p>
        <p type="p">110:主體部分</p>
        <p type="p">110A:前表面</p>
        <p type="p">110B:後表面</p>
        <p type="p">120:佈線部分</p>
        <p type="p">130:貫穿電極</p>
        <p type="p">130P:電源貫穿電極</p>
        <p type="p">130S:信號貫穿電極</p>
        <p type="p">140:後連接電極</p>
        <p type="p">140D:虛設後連接電極</p>
        <p type="p">140P:電源後連接電極</p>
        <p type="p">140S:信號後連接電極</p>
        <p type="p">150:前連接電極</p>
        <p type="p">160:接合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2410" publication-number="202631655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種多受體激動劑及其醫藥組成物和用途</chinese-title>
        <english-title>MULTIPLE AGONIST AND PHARMACEUTICAL COMPOSITION AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K14/605</main-classification>
        <further-classification edition="200601120260429B">A61K38/26</further-classification>
        <further-classification edition="200601120260429B">A61P3/10</further-classification>
        <further-classification edition="200601120260429B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京拓界生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING TUOJIE BIOPHARMACEUTICAL CO. LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳方舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FANGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瀟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花海清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, HAIQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包如迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, RUDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王小雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種GLP-1和GIP受體雙重激動劑化合物及其應用，本發明提供了一系列多肽雙重激動劑化合物及其可藥用鹽的醫藥組成物，其對人類的類胰高血糖素肽-1(Glucagon-like peptide-1，GLP-1)受體和人類血糖依賴性促胰島素多肽(Glucose-dependent insulinotropic poly peptide，GIP)受體具有雙重激動劑作用，並可以用於非胰島素依賴性糖尿病、胰島素依賴性糖尿病和肥胖症等相關疾病的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to GLP-1 and GIP co-agonist compounds and application thereof. The invention provides a series of dual peptides agonists compounds, pharmaceutically salts and pharmaceutical compositions thereof, which have dual agonist effect on glucagon-like peptide-1 (GLP-1) receptor and glucose-dependent insulinotropic polypeptide (GIP) receptor and can be used in the treatment of non-insulin-dependent diabetes mellitus, insulin-dependent diabetes mellitus and other related diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2411" publication-number="202633468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合封裝及其製造方法</chinese-title>
        <english-title>INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10W70/60</main-classification>
        <further-classification edition="202601120260421B">H10W72/00</further-classification>
        <further-classification edition="200601120260421B">H01Q1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　佩燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUA, PEI EE LINDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　英華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOH, HIN HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　耀劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAO JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種整合封裝及其製造方法。該整合封裝包括：具有頂部基板表面和底部基板表面的模製基板；嵌入模製基板中的半導體晶片；底部天線結構，底部天線結構設置於底部基板表面上並電連接至半導體晶片；以及天線封裝，天線封裝嵌入模製基板中，並且包括：天線封裝基板；和頂部天線結構，頂部天線結構設置在天線封裝基板上，且配置成用於將電磁能量與底部天線結構耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:整合封裝</p>
        <p type="p">120:模製基板</p>
        <p type="p">120a:頂面</p>
        <p type="p">120b:底表面</p>
        <p type="p">130:半導體晶片</p>
        <p type="p">130a:活性表面</p>
        <p type="p">130b:非活性表面</p>
        <p type="p">140:再分佈結構(RDS)</p>
        <p type="p">142:第一介電層</p>
        <p type="p">144:第一再分佈層(RDL)</p>
        <p type="p">144a:第一部分</p>
        <p type="p">144b:第二部分/底部天線結構</p>
        <p type="p">146:第二介電層</p>
        <p type="p">148:第二再分佈層</p>
        <p type="p">150:天線封裝</p>
        <p type="p">152:天線封裝基板</p>
        <p type="p">154:頂部天線結構</p>
        <p type="p">156:底部鈍化層</p>
        <p type="p">158:頂部鈍化層</p>
        <p type="p">170:焊球</p>
        <p type="p">180:主板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2412" publication-number="202631198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療自體抗體介導的自體免疫疾病的抗－ＣＤ３８抗體及其醫藥組成物</chinese-title>
        <english-title>ANTI-CD38 ANTIBODIES AND PHARMACEUTICAL COMPOSITIONS THEREOF FOR THE TREATMENT OF AUTOANTIBODY-MEDIATED AUTOIMMUNE DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K39/395</main-classification>
        <further-classification edition="200601120260429B">C07K16/28</further-classification>
        <further-classification edition="200601120260429B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商莫菲西斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORPHOSYS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克隆克　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLUNKER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博克斯哈默　雷納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOXHAMMER, RAINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特勒　斯特凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTLE, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯泰德爾　斯特凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEIDL, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈魯塔　天統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JARUTAT, TIANTOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及對CD38具有特異性的抗體或抗體片段在預防和/或治療自體抗體介導的自體免疫疾病中的用途。根據本發明，抗-CD38抗體可有效治療抗-PLA2R陽性的膜性腎小球腎病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the use of an antibody or antibody fragment specific for CD38 in the prophylaxis and/or treatment of autoantibody-mediated autoimmune disease. In accordance with the present invention, an anti-CD38 antibody is effective in the treatment of anti-PLA2R positive membranous glomerulonephropathy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2413" publication-number="202632783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板及配線基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H01Q1/38</main-classification>
        <further-classification edition="200601120260421B">H01Q1/22</further-classification>
        <further-classification edition="200601120260421B">H05K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田昌太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯岡秀俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIOKA, HIDETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯村慶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIMURA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口修司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榊真史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKE, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線基板具備：基板，其具有透明性；底塗層，其設置於基板上；及網格配線層，其配置於底塗層上，包含複數條第1方向配線、及連結複數條第1方向配線之複數條第2方向配線。底塗層包含高分子材料。第1方向配線與第2方向配線之交點中，形成於第1方向配線與第2方向配線間之4個角部中之至少1個角部於俯視時帶圓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:配線基板</p>
        <p type="p">11:基板</p>
        <p type="p">15:底塗層</p>
        <p type="p">20:網格配線層</p>
        <p type="p">21:第1方向配線</p>
        <p type="p">21a:側面</p>
        <p type="p">22:第2方向配線</p>
        <p type="p">22a:側面</p>
        <p type="p">23:開口部</p>
        <p type="p">25:角部</p>
        <p type="p">25a:角部</p>
        <p type="p">25b:角部</p>
        <p type="p">26:交點部</p>
        <p type="p">30:虛設配線層</p>
        <p type="p">30a:虛設配線</p>
        <p type="p">31:第1虛設配線部分</p>
        <p type="p">31a:側面</p>
        <p type="p">32:第2虛設配線部分</p>
        <p type="p">32a:側面</p>
        <p type="p">35:角部</p>
        <p type="p">36:交點部</p>
        <p type="p">CL&lt;sub&gt;1&lt;/sub&gt;~CL&lt;sub&gt;4&lt;/sub&gt;:中心線</p>
        <p type="p">IL&lt;sub&gt;1&lt;/sub&gt;:第1暫稱直線</p>
        <p type="p">IL&lt;sub&gt;2&lt;/sub&gt;:第2暫稱直線</p>
        <p type="p">IL&lt;sub&gt;3&lt;/sub&gt;:第3暫稱直線</p>
        <p type="p">IL&lt;sub&gt;4&lt;/sub&gt;:第4暫稱直線</p>
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;:曲率半徑</p>
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;:曲率半徑</p>
        <p type="p">R&lt;sub&gt;3&lt;/sub&gt;:曲率半徑</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;:角</p>
        <p type="p">θ&lt;sub&gt;2&lt;/sub&gt;:角</p>
        <p type="p">θ&lt;sub&gt;3&lt;/sub&gt;:角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2414" publication-number="202632006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於鑑定病毒污染物之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR IDENTIFYING VIRAL CONTAMINANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C12Q1/70</main-classification>
        <further-classification edition="201801120260429B">C12Q1/6806</further-classification>
        <further-classification edition="201801120260429B">C12Q1/6869</further-classification>
        <further-classification edition="200601120260429B">C12N15/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡浩特　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANHOUTE, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於一種簡化之樣品製備過程，VERA (藉由減少偽影之病毒富集)，以傾斜總基因組材料而有利於DNA/RNA病毒基因組。此宿主基因組偽影之減少可以在樣品採集後之＜8小時內完成。使用快速文庫製備方案(約15分鐘)及即時奈米孔定序，自樣品採集開始不到一個工作日即可鑑定出潛在之病毒污染，例如RNA病毒污染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to a streamlined sample preparation process, VERA (Viral Enrichment by Reducing Artifacts), to tilt total genomic material in favor of DNA/RNA viral genomes. This reduction of host genomic artifacts can be completed in ＜8 hours from sample acquisition. Using a rapid library preparation protocol (~15 minutes) and real-time nanopore sequencing, potential viral contamination, for example RNA viral contamination, can be identified in less than one workday from sample acquisition.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2415" publication-number="202632507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體控制器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260504B">G06F12/0866</main-classification>
        <further-classification edition="200601120260504B">G06F13/14</further-classification>
        <further-classification edition="200601120260504B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口優樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島慶久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天木健彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAKI, TAKEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井川原俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGAHARA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>檜田敏克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDA, TOSHIKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明謀求提高記憶體系統之性能。  實施方式之記憶體系統具備非揮發性記憶體及記憶體控制器。非揮發性記憶體包含複數個物理完整區塊，於複數個物理完整區塊之各者中，複數個物理子區塊分別包含記憶胞，記憶胞串聯或並聯地連接於同一位元線。記憶體控制器於複數個物理完整區塊之各者中，對複數個物理子區塊之各者獨立地執行資料之抹除動作，於複數個物理完整區塊之各者中，將複數個物理子區塊全部設定為相同之記憶模式。記憶模式係表示複數個物理子區塊各者所包含之記憶胞中記憶之資料之位元數的設定狀態，於設定為相同記憶模式之物理子區塊所包含之記憶胞中記憶相同位元數之資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">FB(FBa~FBf):物理完整區塊</p>
        <p type="p">LSB(LSB1~LSB6):邏輯子區塊</p>
        <p type="p">SB(SBa,SBb):物理子區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2416" publication-number="202633062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有部分屏蔽層的半導體器件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH A PARTIAL SHIELDING LAYER AND A METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">H05K9/00</main-classification>
        <further-classification edition="202601120260421B">H10W42/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴星煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SEONGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐仁鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, INHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種用於製作半導體器件的方法。該方法包括：提供封裝基底條帶，所述封裝基底條帶上安裝有多組第一電子元件和多組第二電子元件；在所述封裝基底條帶上形成覆蓋所述多組第一電子元件的密封劑層；透過噴塗形成第一屏蔽材料，使得所述第一屏蔽材料從所述密封劑層的頂部表面連續地延伸到所述封裝基底條帶的頂部表面，以至少覆蓋所述密封劑層的面朝所述多組第二電子元件的側表面；將所述封裝基底條帶單分成具有相應封裝基底的單獨半導體封裝；以及透過濺射在所述密封劑層上形成第二屏蔽材料，其中所述第二屏蔽材料至少部分地與所述第一屏蔽材料重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">202:密封劑層</p>
        <p type="p">205:第二電子元件</p>
        <p type="p">206:第一屏蔽材料</p>
        <p type="p">207:第二屏蔽材料</p>
        <p type="p">210:半導體器件、半導體封裝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2417" publication-number="202633204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝像器件及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260421B">H10F39/12</main-classification>
        <further-classification edition="202501120260421B">H10F30/20</further-classification>
        <further-classification edition="202301120260421B">H04N25/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內田哲彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮澤信二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAWA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石崎健士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新宅浩聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTAKU, HIROSATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀越浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKOSHI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術係關於一種可不降低光電二極體之飽和電荷量而擴大動態範圍之攝像元件及電子機器。  &lt;br/&gt;本技術具備將光轉換為電荷之光電轉換部、暫時累積電荷之複數個累積部、將電荷傳送至累積部之複數個傳送部、及將像素間分離之貫通溝槽；且複數個累積部中之至少1個累積部為電容元件，複數個累積部中之至少1個累積部累積自光電轉換部溢流之電荷。本技術例如可應用於拍攝圖像之攝像元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:像素</p>
        <p type="p">51:光電轉換部</p>
        <p type="p">52:第1傳送電晶體</p>
        <p type="p">53:第1FD部</p>
        <p type="p">54:第2傳送電晶體</p>
        <p type="p">58:MIM電容元件</p>
        <p type="p">60:放大電晶體</p>
        <p type="p">71:STI</p>
        <p type="p">100:半導體基板</p>
        <p type="p">101:微透鏡</p>
        <p type="p">102:CF</p>
        <p type="p">103:平坦化膜</p>
        <p type="p">104:遮光膜</p>
        <p type="p">105:N型半導體區域</p>
        <p type="p">106:P型半導體區域</p>
        <p type="p">107:P型半導體區域</p>
        <p type="p">108:固定電荷膜</p>
        <p type="p">109:像素分離部</p>
        <p type="p">120:配線層</p>
        <p type="p">121:局部配線</p>
        <p type="p">122:配線</p>
        <p type="p">123:絕緣層</p>
        <p type="p">124:導通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2418" publication-number="202632075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氫氣產生裝置</chinese-title>
        <english-title>HYDROGEN GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260414B">C25B1/04</main-classification>
        <further-classification edition="202101120260414B">C25B9/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具備隔音罩的氫氣產生裝置包含水箱、電解槽、濕化器、細化裝置及隔音罩。水箱用以容置電解水。電解槽設置於水箱中並用以電解水以產生含氫氣體。濕化器具有濕化室用以容置補充水。細化裝置設置於濕化器中並用以細化含氫氣體。隔音罩設置於濕化器中並具有隔音腔體、連通水箱及細化裝置的連通管以及出氣孔洞。含氫氣體通過連通管及細化裝置並流至隔音腔體的補充水中，接著含氫氣體透過出氣孔洞流至濕化室中。本發明的具備隔音罩的氫氣產生裝置可透過隔音罩阻隔含氫氣體在裝置中流動時所產生的聲音，以提升體驗效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydrogen generator with sound-proof shield includes a water tank configured to contain the water, an electrolysis module disposed in the water tank and configured to electrolyze water to generate gas comprising hydrogen, a humidifying module having a humidifying chamber for containing the supplement water, a diffusing device disposed in the humidifying module to diffuse the gas comprising hydrogen, and a sound-proof shield disposed in the humidifying module. The sound-proof shield includes a sound-proof cavity, a connecting tube connected to the water tank and the diffusing device and a gas outlet. The gas comprising hydrogen flows through the connecting tube and the diffusing device to the supplement water of the sound-proof cavity, and then passes through the gas outlet to the humidifying chamber. The present invention can improve the using experience by blocking the sound generated by the gas comprising hydrogen flowing in the device through the sound-proof shield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">E:氫氣產生裝置</p>
        <p type="p">1:水箱</p>
        <p type="p">3:整合式流道裝置</p>
        <p type="p">4:濕化器</p>
        <p type="p">5:過濾流道裝置</p>
        <p type="p">6:冷凝器</p>
        <p type="p">8:霧化器</p>
        <p type="p">9:電源模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2419" publication-number="202632367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">G02B11/20</main-classification>
        <further-classification edition="202101120260430B">G02B7/02</further-classification>
        <further-classification edition="200601120260430B">G02B13/00</further-classification>
        <further-classification edition="200601120260430B">G02B13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董傳博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, CHUANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱清智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, QINGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭，從物側至像側在光軸上依序包含有第一透鏡、第二透鏡、第三透鏡以及第四透鏡。第三透鏡的物側面的光軸區域為凸面以及第四透鏡的物側面的圓周區域為凹面。光學成像鏡頭的透鏡只有上述四片透鏡，且滿足以下條件式：υ3+υ4≦55.000、υ1/（υ2-2*υ3）≧8.500。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens includes a first lens element, a second lens, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis. An optical axis region of the object-side surface of the third lens element is convex and a periphery region of the object-side surface of the fourth lens element is concave. The lens elements included by the optical imaging lens are only the four lens elements described above to satisfy: υ3+υ4≤55.000, υ1/(υ2-2*υ3)≥8.500.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學成像鏡頭</p>
        <p type="p">2:光圈</p>
        <p type="p">3:濾光片</p>
        <p type="p">4:成像面</p>
        <p type="p">5:光學轉折元件</p>
        <p type="p">11、21、31、41:物側面</p>
        <p type="p">12、22、32、42:像側面</p>
        <p type="p">13、16、23、26、33、36、43、46:光軸區域</p>
        <p type="p">14、17、24、27、34、37、44、47:圓周區域</p>
        <p type="p">10:第一透鏡</p>
        <p type="p">20:第二透鏡</p>
        <p type="p">30:第三透鏡</p>
        <p type="p">40:第四透鏡</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2420" publication-number="202631268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113440</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板容器</chinese-title>
        <english-title>SUBSTRATE CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">B08B5/00</main-classification>
        <further-classification edition="200601120260417B">B08B11/00</further-classification>
        <further-classification edition="202601120260417B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　馬克　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, MARK V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾基　湯姆斯　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILKIE, THOMAS H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾　寇頓　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARR, COLTON J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富勒　馬修　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULLER, MATTHEW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾格恩　尚恩　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGGUM, SHAWN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞卡　麥克　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZABKA, MICHAEL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板容器包含界定一內部空間之一殼體及一清洗流體分配系統。該殼體包含一前開口、一底壁及一後壁。該清洗流體分配系統接收一清洗氣體流且包含一入口及分開之氣體分配裝置之一網路，該等分開之氣體分配裝置經組態以將該清洗氣體流分配至該內部空間中。亦包含一供應管線，該供應管線連接至該入口並經組態以將清洗氣體之供應劃分給分開之氣體分配裝置之該網路。一種清洗一打開之基板容器之方法包含將一清洗氣體流供應至一清洗流體分配系統之一入口且將該清洗氣體劃分以供應分開之氣體分配裝置之一網路以將該清洗氣體流分配至該內部空間中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">305:入口埠</p>
        <p type="p">340:清洗流體分配系統</p>
        <p type="p">350A:第一氣體分配裝置</p>
        <p type="p">350B:第二氣體分配裝置</p>
        <p type="p">351A:氣體分配表面</p>
        <p type="p">351B:氣體分配表面</p>
        <p type="p">351C:氣體分配表面</p>
        <p type="p">360:供應管線</p>
        <p type="p">360A:第一流動路徑</p>
        <p type="p">360B:第二流動路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2421" publication-number="202633488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燒結就緒銀膜</chinese-title>
        <english-title>SINTER-READY SILVER FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W72/00</main-classification>
        <further-classification edition="202601120260422B">H10W72/30</further-classification>
        <further-classification edition="202601120260422B">H10W90/00</further-classification>
        <further-classification edition="200601120260422B">B22C9/22</further-classification>
        <further-classification edition="200601120260422B">B22D21/06</further-classification>
        <further-classification edition="200601120260422B">B22D25/04</further-classification>
        <further-classification edition="200601120260422B">B23K1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾發金屬化工公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA ASSEMBLY SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈夏列夫　奧斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHASELEV, OSCAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班赫納　馬修　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEBENHUHNER, MATTHEW JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷格達　莫尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUREGHDA, MONNIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾齊　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCZI, MIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾葛林　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BILGRIEN, CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造一經組合之燒結就緒銀膜與載體(1)的方法，其包含以下步驟：  &lt;br/&gt;          a) 產生包含經設計開口(5)的載體(2)；  &lt;br/&gt;          b) 將一銀膜層(7)澆鑄至該設計的開口(5)中；及  &lt;br/&gt;          c) 乾燥該載體(2)及銀膜層(7)以形成該經組合之燒結就緒銀膜與載體(1)。  &lt;br/&gt;亦揭示一種使用該經組合之燒結就緒銀膜與載體(1)組裝一組件至一基材(10)的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of making a combined sinter-ready silver film and carrier (1), comprising the steps of: &lt;br/&gt; a) creating a carrier (2) comprising designed openings (5); &lt;br/&gt; b) casting a silver film layer (7) into the designed openings (5); and &lt;br/&gt; c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). &lt;br/&gt;A method of assembling a component to a substrate (10) using the combined sinter-ready silver film and carrier (1) is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:經組合之燒結就緒銀膜與載體</p>
        <p type="p">3:塑膠膜；模版層</p>
        <p type="p">4:塑膠膜；背襯層</p>
        <p type="p">6:本體</p>
        <p type="p">7:燒結就緒銀膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2422" publication-number="202631689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113579</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>喜樹鹼類藥物耦合物及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C07K16/28</main-classification>
        <further-classification edition="200601120260428B">C07D491/22</further-classification>
        <further-classification edition="201701120260428B">A61K47/68</further-classification>
        <further-classification edition="200601120260428B">A61K39/395</further-classification>
        <further-classification edition="200601120260428B">A61K31/4745</further-classification>
        <further-classification edition="200601120260428B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白遠超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, YUANCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國印</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAN, GUOYIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾現偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AI, XIANWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於藥物化學技術領域，具體涉及喜樹鹼類耦合化合物及其製備方法。該類喜樹鹼化合物具有優良的藥物活性和動力學特性，適合製備用於治療腫瘤相關疾病的藥物。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2423" publication-number="202631110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化妝料組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K8/891</main-classification>
        <further-classification edition="200601120260504B">A61K8/895</further-classification>
        <further-classification edition="200601120260504B">A61K8/31</further-classification>
        <further-classification edition="200601120260504B">A61Q5/06</further-classification>
        <further-classification edition="200601120260504B">A61Q5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前川智夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEKAWA, TOMOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種化妝料組合物，其含有(A)聚矽氧皮膜形成劑、及(B)聚合度為2,600以上4,500以下之高分子量有機聚矽氧烷，且成分(A)之含有質量相對於成分(A)及成分(B)之合計含有質量的比率[(A)/((A)+(B))]為50%以上98%以下，水之含量為10質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2424" publication-number="202631412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池交換系統及其電池提供方法</chinese-title>
        <english-title>BATTERY EXCHANGE SYSTEM AND BATTERIES PROVIDING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260417B">B60L53/80</main-classification>
        <further-classification edition="201901120260417B">B60L53/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錦豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉祐豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李育安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池交換系統及其電池提供方法。該電池交換系統被配置為執行該方法，該方法包括：接收更換一目標數量的電池的一請求；基於該目標數量將該電池交換系統中的複數個電池分為複數個電池組；基於複數個權重及複數個特徵參數計算該複數個電池組的複數個評分；及基於該複數個評分，選出該複數個電池組中具有最佳評分的一最佳電池組以提供該目標數量的電池。藉此，可有效改善因電池選用不當衍生的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery exchange system and a batteries providing method thereof are disclosed. The battery exchange system is configured to perform the method that includes: receiving a request to exchange a target number of batteries; grouping a plurality of batteries in the battery exchange system based on the target number of batteries into a plurality of battery groups; calculating a plurality of scores for the plurality of battery groups based on a plurality of weights and a plurality of characteristic parameters; and selecting an optimal battery group with the best score among the plurality of battery groups to provide the target number of batteries based on the plurality of scores. This way, issues caused by improper battery selection can be effectively improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">80:電池提供方法</p>
        <p type="p">S0、S1、S3、S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2425" publication-number="202632371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G02B13/00</main-classification>
        <further-classification edition="200601120260416B">G02B13/18</further-classification>
        <further-classification edition="200601120260416B">G02B13/06</further-classification>
        <further-classification edition="200601120260416B">G02B11/34</further-classification>
        <further-classification edition="200601120260416B">G02B9/64</further-classification>
        <further-classification edition="202101120260416B">G02B7/02</further-classification>
        <further-classification edition="200601120260416B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭有鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括第一透鏡至第九透鏡，其中第一透鏡具有正的折射力，第二透鏡具有負的折射力，第四透鏡具有正的折射力，第二透鏡的折射率大於第一透鏡的折射率及第三透鏡的折射率，包括第二透鏡的至少兩個透鏡中的每一者具有等於或大於1.67的折射率，且滿足TTL/(2×IMG HT) ＜ 0.69及25 ＜ v1-v2 ＜ 45，其中TTL是在光軸上自第一透鏡的物體側表面至成像表面的距離，IMG HT是成像表面的對角線長度的一半，v1是第一透鏡的阿貝數，且v2是第二透鏡的阿貝數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes first to ninth lenses, wherein the first lens has a positive refractive power, the second lens has a negative refractive power, the fourth lens has a positive refractive power, a refractive index of the second lens is greater than a refractive index of the first lens and a refractive index of the third lens, each of at least two lenses including the second lens has a refractive index equal to or greater than 1.67, and TTL/(2×IMG HT) ＜ 0.69 and 25 ＜ v1-v2 ＜ 45 are satisfied, where TTL is a distance on an optical axis from an object-side surface of the first lens to an imaging surface, IMG HT is one half of a diagonal length of the imaging surface, v1 is an Abbe number of the first lens, and v2 is an Abbe number of the second lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">101:第一透鏡</p>
        <p type="p">102:第二透鏡</p>
        <p type="p">103:第三透鏡</p>
        <p type="p">104:第四透鏡</p>
        <p type="p">105:第五透鏡</p>
        <p type="p">106:第六透鏡</p>
        <p type="p">107:第七透鏡</p>
        <p type="p">108:第八透鏡</p>
        <p type="p">109:第九透鏡</p>
        <p type="p">110:濾光器</p>
        <p type="p">111:成像表面</p>
        <p type="p">IS:影像感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2426" publication-number="202631609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為造血前驅細胞激酶１（ＨＰＫ１）抑制劑的吲唑及其用途</chinese-title>
        <english-title>INDAZOLES AS HEMATOPOIETIC PROGENITOR KINASE 1 (HPK1) INHIBITORS AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D417/04</main-classification>
        <further-classification edition="200601120260504B">C07D417/14</further-classification>
        <further-classification edition="200601120260504B">C07D513/04</further-classification>
        <further-classification edition="200601120260504B">C07D471/04</further-classification>
        <further-classification edition="200601120260504B">A61K31/428</further-classification>
        <further-classification edition="200601120260504B">A61K31/4439</further-classification>
        <further-classification edition="200601120260504B">A61K31/496</further-classification>
        <further-classification edition="200601120260504B">A61K31/437</further-classification>
        <further-classification edition="200601120260504B">A61K31/444</further-classification>
        <further-classification edition="200601120260504B">A61K31/541</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商福斯特生物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>1ST BIOTHERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JINHWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙修演</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SUYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KEONSEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴芽瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, A YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈雷什納特　加第昌得夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORAKSHNATH, GADHE CHANGDEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南灮廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, HWAJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全映昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YEONGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃預真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宰恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金美順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MISOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昇嘿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SEUNG MOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式(I)所示化合物或其藥學上可接受的鹽、包含該化合物的組成物、使用該化合物治療與HPK1相關的各種疾病之方法及製備此等化合物之方法。  &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="324px" file="ed10708.JPG" alt="ed10708.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a compound of Formula (I) or pharmaceutically acceptable salts thereof, a composition comprising the compound, methods of using the compound for the treatment of various disorders associated with HPK1, and methods of preparing these compounds. &lt;br/&gt;&lt;img align="absmiddle" height="140px" width="392px" file="ed10709.JPG" alt="ed10709.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2427" publication-number="202632068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬化合物薄膜、其製造方法及用於水電解反應的薄膜催化劑</chinese-title>
        <english-title>METAL COMPOUND THIN FILM, METHOD OF FORMING THE SAME AND THIN FLIM CATALYST FOR WATER ELECTROLYSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">C23C18/16</main-classification>
        <further-classification edition="200601120260416B">B01J23/882</further-classification>
        <further-classification edition="200601120260416B">B01J37/02</further-classification>
        <further-classification edition="202101120260416B">C25B1/04</further-classification>
        <further-classification edition="202101120260416B">C25B11/052</further-classification>
        <further-classification edition="202101120260416B">C25B11/091</further-classification>
        <further-classification edition="200601120260416B">C01B13/32</further-classification>
        <further-classification edition="202501120260416B">C01G45/1207</further-classification>
        <further-classification edition="202501120260416B">C01G51/00</further-classification>
        <further-classification edition="201401120260416B">C09D11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳軍互</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種金屬化合物薄膜、其製造方法及用於水電解反應的薄膜催化劑。方法包含提供基板；以及對基板進行至少一次噴墨印刷操作，以在基板上形成金屬化合物薄膜。金屬化合物薄膜包含多個薄膜，且該些薄膜彼此不接觸。噴墨印刷操作之每一者包含利用噴墨系統的第一噴頭沉積第一前驅物在基板上；以及利用噴墨系統的第二噴頭沉積第二前驅物在基板上。第一前驅物與第二前驅物進行化學反應，而形成金屬化合物，且金屬化合物薄膜包含至少一層金屬化合物。藉此，可輕易地完成圖案化薄膜，並可有效地節省化學溶液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metal compound thin film, a method of forming the same and a thin film catalyst for water electrolysis are provided. The method includes providing a substrate; and performing at least one ink-jet printing operation on the substrate to form the metal compound thin film on the substrate. The metal compound thin film includes plural thin films, and the thin films are not contacted with each other. Each of the ink-jet printing operations includes depositing a first precursor on the substrate by using a first nozzle of a ink-jet system; and depositing a second precursor on the substrate by using a second nozzle of the ink-jet system. The first precursor and the second precursor perform a chemical reaction to form the metal compound, and the metal compound thin film includes at least one layer of the metal compound. Therefore, patterning the thin film can be easily achieved, and chemical solution can be effectively saved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A,B,C,D:樣品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2428" publication-number="202632384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可切換透鏡陣列及２Ｄ／多視像可切換透鏡顯示器</chinese-title>
        <english-title>SWITCHABLE LENTICULAR LENS ARRAY AND 2D/MULTIVIEW SWITCHABLE LENTICULAR DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260421B">G02B30/27</main-classification>
        <further-classification edition="200601120260421B">G02F1/01</further-classification>
        <further-classification edition="201801120260421B">H04N13/305</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷亞有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商鐳亞電子（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEIA ELECTRONICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, ARIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種可切換透鏡陣列，該可切換透鏡陣列包括：第一材料層，該第一材料層具有固定折射率；第二材料層，該第二材料層具有電控折射率；以及電極，被配置爲遞送電壓或電流以切換該可切換透鏡陣列的可切換透鏡的狀態，其中該電極包括上部電極和下部電極；其中，在該電極之間施加第一電勢時，該第二材料層被佈置在第一方向的電場中，使得該第二材料層的該電控折射率切換到與該固定折射率匹配的折射率。本發明還提出了2D/多視像可切換透鏡顯示器。本發明還提出了2D/多視像可切換透鏡顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a switchable lenticular lens array comprising: a first material layer having a fixed refractive index; a second material layer having an electrically controlled refractive index; and electrodes configured to deliver a voltage or a current to switch the state of switchable lenticular lenses of the switchable lenticular lens array, wherein the electrodes include an upper electrode and a lower electrode; wherein the second material layer is disposed in an electric field in a first direction when a first electrical potential is applied between the electrodes such that the electrically controlled refractive index of the second material layer is switched to a refractive index that matches the fixed refractive index. The present disclosure also provides a 2D/multiview switchable lenticular display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:可切換透鏡陣列</p>
        <p type="p">610:可切換透鏡</p>
        <p type="p">612:第一材料層</p>
        <p type="p">614:第二材料層</p>
        <p type="p">622:上部電極</p>
        <p type="p">624:下部電極、第一層電極</p>
        <p type="p">626:下部電極、第二層電極</p>
        <p type="p">628:絕緣層</p>
        <p type="p">630:第一電源</p>
        <p type="p">632:第一開關</p>
        <p type="p">634:第二電源</p>
        <p type="p">636:第二開關</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2429" publication-number="202631605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>４Ｈ－哌喃－４－酮結構的ＣＹＰ１１Ａ１抑制劑之新穎鹽形式</chinese-title>
        <english-title>NOVEL SALT FORMS OF A 4H-PYRAN-4-ONE STRUCTURED CYP11A1 INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D405/14</main-classification>
        <further-classification edition="200601120260504B">A61K31/454</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商奧利安公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾亞萊寧　奧斯卡里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARJALAINEN, OSKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅凱拉　米可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEKELAE, MIKKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波普　米哈埃拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POP, MIHAELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路馬克　佩特里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMMAKKO, PETTERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舍甫琴柯　安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEVCHENKO, ANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西納沃　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINERVO, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堤亞南　艾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAINEN, EIJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於2-(異吲哚啉-2-基甲基)-5-((1-(甲基磺醯基)哌啶-4-基)甲氧基)-4H-哌喃-4-酮（I）之新穎鹽，特別係結晶鹽，其特別適用於製造醫藥組成物。此外，本發明係關於包含此類新穎鹽之醫藥組成物。化合物（I）係CYP11A1酶之選擇性抑制劑，且可用於治療激素調節之癌症，諸如前列腺癌及乳癌。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel salts, particularly crystalline salts, of 2-(isoindolin-2-ylmethyl)-5-((1-(methylsulfonyl)piperidin-4-yl)methoxy)-4H-pyran-4-one (I) which are particularly suitable for use in the manufacture of pharmaceutical compositions. Furthermore, the invention relates to pharmaceutical compositions comprising such novel salts. Compound (I) is a selective inhibitor of CYP11A1 enzyme and is useful in the treatment of hormonally regulated cancers, such as prostate cancer and breast cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2430" publication-number="202633509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板及封裝基板的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10W74/40</main-classification>
        <further-classification edition="202601120260421B">H10W74/10</further-classification>
        <further-classification edition="202601120260421B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彩黙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHAEMOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書涉及一種封裝基板的製造方法及使用其的封裝基板。根據本說明書的封裝基板包括：芯層；以及位於所述芯層上的上部層，所述芯層包括玻璃芯，所述玻璃芯包括彼此相反的第一表面和第二表面，所述上部層包括：第一分配層，形成於所述芯層上；以及虛擬層，形成於所述第一分配層上，所述虛擬層包括熱膨脹係數低於所述第一分配層的絕緣材料的熱膨脹係數的材料。由此，在分配層之間設置無固化收縮的虛擬層，從而能夠獲得可以緩解位於所述虛擬層和所述芯層之間的分配層的固化收縮並且分散集中在芯層上的應力的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for manufacturing a packaging substrate and a packaging substrate using the method. A packaging substrate according to the present disclosure includes a core layer and an upper layer disposed on the core layer, the core layer including a glass core having a first face and a second face facing each other, the upper layer including: a first distribution layer formed on the core layer; and a dummy layer formed on the first distribution layer, wherein the dummy layer may include a material having a lower coefficient of thermal expansion (CTE) than the insulating material of the first distribution layer. By placing a non-shrinking dummy layer between the distribution layers, the curing shrinkage of the distribution layers located between the dummy layer and the core layer can be alleviated, and the effect of lowering the stress concentrated in the core layer can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:芯層</p>
        <p type="p">61:第一分配層</p>
        <p type="p">62:第二分配層</p>
        <p type="p">70:虛擬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2431" publication-number="202633419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260416B">H10W10/00</main-classification>
        <further-classification edition="202601120260416B">H10W10/10</further-classification>
        <further-classification edition="202601120260416B">H10P72/70</further-classification>
        <further-classification edition="202601120260416B">H10P34/42</further-classification>
        <further-classification edition="202601120260416B">H10P95/00</further-classification>
        <further-classification edition="200601120260416B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井清隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, KIYOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤基之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MOTOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣田良浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置之製造方法，該半導體裝置具有第一半導體元件及第二半導體元件；該製造方法包含：(a)步驟，在具有比第二彈性係數更高之第一彈性係數的第一基板上，形成絕緣層；(b)步驟，在該絕緣層上，形成具有第一接合表面之該第一半導體元件；(c)步驟，在具有該第二彈性係數的第二基板上，形成具有第二接合表面之該第二半導體元件；(d)步驟，使該第一接合表面與該第二接合表面貼合，而形成堆疊該第一半導體元件與該第二半導體元件而成之疊層體；及(e)步驟，從該疊層體去除該第一基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一基板</p>
        <p type="p">2:第二基板</p>
        <p type="p">3:絕緣層</p>
        <p type="p">4:第一分離層</p>
        <p type="p">5:第二分離層</p>
        <p type="p">6:第一半導體元件</p>
        <p type="p">6a:第一接合表面</p>
        <p type="p">7:第二半導體元件</p>
        <p type="p">7a:第二接合表面</p>
        <p type="p">D:分離層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2432" publication-number="202631580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115113986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜形成用組成物、有機膜形成方法、圖案形成方法、單體、及聚合物</chinese-title>
        <english-title>COMPOSITION FOR FORMING FILM, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, MONOMER, AND POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C07C381/00</main-classification>
        <further-classification edition="200601120260421B">C08F12/30</further-classification>
        <further-classification edition="200601120260421B">C08F20/38</further-classification>
        <further-classification edition="200601120260421B">C08F20/54</further-classification>
        <further-classification edition="200601120260421B">C08F20/58</further-classification>
        <further-classification edition="200601120260421B">C08G8/04</further-classification>
        <further-classification edition="200601120260421B">C08G8/08</further-classification>
        <further-classification edition="200601120260421B">C08G8/28</further-classification>
        <further-classification edition="200601120260421B">C08G65/22</further-classification>
        <further-classification edition="200601120260421B">G03F7/004</further-classification>
        <further-classification edition="200601120260421B">G03F7/038</further-classification>
        <further-classification edition="200601120260421B">G03F7/039</further-classification>
        <further-classification edition="200601120260421B">G03F7/11</further-classification>
        <further-classification edition="200601120260421B">G03F7/16</further-classification>
        <further-classification edition="200601120260421B">G03F7/20</further-classification>
        <further-classification edition="200601120260421B">G03F7/32</further-classification>
        <further-classification edition="200601120260421B">G03F7/40</further-classification>
        <further-classification edition="202601120260421B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郡大佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本靖之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠山潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATAKEYAMA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題：本發明以提供環境負荷少、且對於基板之塗佈性為優良的膜形成用組成物為目的。  &lt;br/&gt;本發明之解決手段：一種膜形成用組成物，其特徵在於，該膜形成用組成物含有具有具五氟硫基作為取代基之芳香族基的聚合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a composition for forming a film including a polymer having an aromatic group having a pentafluorosulfanyl group as a substituent. An object of the present invention is to provide a composition for forming a film that has a less environmental load and excellent coatability on a substrate.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2433" publication-number="202631624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於誘發Ｇ１２Ｄ突變ＫＲＡＳ蛋白之分解之喹唑啉化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07D487/08</main-classification>
        <further-classification edition="200601120260504B">A61K31/517</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商安斯泰來製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTELLAS PHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉成友博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINARI, TOMOHIRO</last-name>
                <middle-name></middle-name>
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                <last-name>WATANABE, HIDEYUKI</last-name>
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                <last-name>MORIKAWA, TAKAHIRO</last-name>
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        <p type="p">本發明提供一種可用作胰臟癌之治療用醫藥組合物之有效成分的化合物。  &lt;br/&gt;本發明者等人針對可用作胰臟癌治療用醫藥組合物之有效成分的化合物展開研究，發現喹唑啉化合物具有優異之誘發G12D突變KRAS蛋白之分解之作用、及G12D突變KRAS抑制活性，能夠用作胰臟癌之治療劑，從而完成本發明。本發明之喹唑啉化合物或其鹽能夠用作胰臟癌之治療劑。</p>
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        <document-id>
          <doc-number>115114027</doc-number>
        </document-id>
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      <invention-title>
        <chinese-title>錫化合物、錫組合物、彼等之製造方法、阻劑溶液、圖案形成方法、薄膜、經圖案化之薄膜及基板之製造方法</chinese-title>
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        <main-classification edition="200601120260422B">C07F7/22</main-classification>
        <further-classification edition="200601120260422B">G03F7/004</further-classification>
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        <further-classification edition="200601120260422B">G03F7/32</further-classification>
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                <last-name>日商三菱化學股份有限公司</last-name>
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                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>
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                <last-name>美商蓋列斯特股份有限公司</last-name>
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                <last-name>GELEST, INC.</last-name>
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                <last-name>日置優太</last-name>
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                <last-name>八幡澄子</last-name>
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                <last-name>YAHATA, SUMIKO</last-name>
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                <last-name>岡部　漆原紅</last-name>
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        <p type="p">本發明提供下述之錫化合物，其藉由平衡性良好地具有溶解性、疏水性、阻劑感度等特性而成為高性能之阻劑材料。  &lt;br/&gt;本發明之錫化合物係具有錫原子、有機基R、氧配位基及/或羥配位基者，且於上述錫化合物1分子中包含2種以上之上述有機基R，且包含Sn-O-Sn結構，上述有機基R具有1～30個碳原子。</p>
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          <doc-number>115114114</doc-number>
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        <chinese-title>ＣＥＲＥＢＬＯＮ結合化合物、其組合物及使用該等物質之治療方法</chinese-title>
        <english-title>CEREBLON BINDING COMPOUNDS, COMPOSITIONS THEREOF, AND METHODS OF TREATMENT THEREWITH</english-title>
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        <main-classification edition="200601120260504B">C07D401/14</main-classification>
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                <last-name>CELGENE CORPORATION</last-name>
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                <last-name>亞歷山德　馬修　Ｄ</last-name>
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                <last-name>WHITEFIELD, BRANDON W.</last-name>
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                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供六氫吡啶二酮化合物，其具有以下結構：  &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="320px" file="ed10078.JPG" alt="ed10078.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中R&lt;sup&gt;N&lt;/sup&gt;、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;N&lt;/sup&gt;、L、V、X、a、m及n係如本文所定義；包含有效量之六氫吡啶二酮化合物之組合物；及用於治療或預防雄激素受體介導之疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are piperidine dione compounds having the following structure: &lt;br/&gt;&lt;img align="absmiddle" height="131px" width="300px" file="ed10079.JPG" alt="ed10079.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;wherein R&lt;sup&gt;N&lt;/sup&gt;, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;N&lt;/sup&gt;, L,V, X, a, m, and n are as defined herein, compositions comprising an effective amount of a piperidine dione compound, and methods for treating or preventing an androgen receptor mediated disease.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2436" publication-number="202631297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焊接方法</chinese-title>
        <english-title>SOLDERING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">B23K35/362</main-classification>
        <further-classification edition="200601120260417B">B23K35/26</further-classification>
        <further-classification edition="200601120260417B">C22C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾發金屬化工公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA ASSEMBLY SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯利瓦斯塔瓦　索拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHRIVASTAVA, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　安蘇曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, ANSUMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特拉　瑪瑪塔　拉米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATRA, MAMATA RAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕伊　拉克斯米納拉亞納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, LAXMINARAYANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭特　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLANT, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡爾　西利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKAR, SIULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　普瑞莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUDHURY, PRITHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里巴斯　莫加納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBAS, MORGANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬　阿尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ANIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭加拉杰　拉古　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANGARAJU, RAGHU R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種焊接方法，其包含：在待接合的二或更多個工件之間提供一焊料膏，該焊料膏包含分散於一膏熔劑中的焊料粒子；且使焊料膏經歷一溫度曲線以使該等焊料粒子再流動且在二或更多個工件之間形成一焊料接點，其中，當使該膏熔劑經歷根據ASTM E1131-20之熱重分析時，在該焊料之固相線溫度至該溫度曲線之最高溫度的範圍內發生的重量損失不多於25%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A soldering method comprising: providing a solder paste between two or more work pieces to be joined, the solder paste comprising solder particles dispersed in a paste flux; and subjecting the solder paste to a temperature profile to reflow the solder particles and form a solder joint between the two or more work pieces, wherein, when the paste flux is subjected to thermogravimetric analysis according to ASTM E1131-20, weight loss occurring in the range of from the solidus temperature of the solder to the highest temperature in the temperature profile is no more than 25%.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2437" publication-number="202633320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將氣體分配至容器之方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE TO DISTRIBUTE GAS INTO A CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P70/00</main-classification>
        <further-classification edition="200601120260421B">B08B5/00</further-classification>
        <further-classification edition="200601120260421B">B65G49/07</further-classification>
        <further-classification edition="202601120260421B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　馬克　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, MARK V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富勒　馬修　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULLER, MATTHEW A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾格恩　尚恩　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGGUM, SHAWN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於將沖洗氣體之流供應或分配至一基板容器中之方法及沖洗氣體總成。該沖洗氣體總成包含：一氣體分配器，其包括至少一個出口；及一沖洗模組，其包括用於接收沖洗氣體之一流之一入口、一止回閥及一出口。該氣體分配器及沖洗模組之一組合形成一腔室。該腔室經構形以將該沖洗氣體供應至該氣體分配器之該至少一個出口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and purge gas assembly for supplying or distributing flow of purge gas into a substrate container is provided. The purge gas assembly includes a gas distributor comprising at least one outlet and a purge module comprising an inlet for receiving a flow of purge gas, a check valve, and an outlet. A combination of the gas distributor and purge module form a chamber. The chamber is configured to supply the purge gas to the at least one outlet of the gas distributor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板容器</p>
        <p type="p">102:容器本體</p>
        <p type="p">103:前門</p>
        <p type="p">104:內部空間</p>
        <p type="p">105:第一側壁</p>
        <p type="p">106:第二側壁</p>
        <p type="p">107:後壁</p>
        <p type="p">108:頂壁</p>
        <p type="p">109:底壁</p>
        <p type="p">110:入口沖洗埠/出口沖洗埠</p>
        <p type="p">112:設備連接件</p>
        <p type="p">115:載體板</p>
        <p type="p">120:沖洗氣體總成</p>
        <p type="p">130:氣體分配器/沖洗模組</p>
        <p type="p">140:第一氣體分配裝置</p>
        <p type="p">170:管路</p>
        <p type="p">180:前氣體分配裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2438" publication-number="202633085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260417B">H10B43/27</main-classification>
        <further-classification edition="202301120260417B">H10B43/35</further-classification>
        <further-classification edition="202601120260417B">H10P34/42</further-classification>
        <further-classification edition="202501120260417B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山阪司祐人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKA, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施方式，半導體裝置具備：基板；及積層膜，其包含交替設置於上述基板上方之複數層電極層及複數層絕緣層。上述裝置進而具備：第1半導體層，其設置於上述積層膜內；及第2半導體層，其於上述積層膜內設置於上述第1半導體層上，且包含單晶半導體層。上述裝置進而具備配線層，上述配線層設置於上述積層膜及上述第2半導體層上，與上述第2半導體層電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路區域</p>
        <p type="p">2:陣列區域</p>
        <p type="p">11:基板</p>
        <p type="p">12:電晶體</p>
        <p type="p">12a:閘極絕緣膜</p>
        <p type="p">12b:閘極電極</p>
        <p type="p">12c:絕緣膜</p>
        <p type="p">13:層間絕緣層</p>
        <p type="p">21:層間絕緣膜</p>
        <p type="p">22:積層膜</p>
        <p type="p">22a:電極層</p>
        <p type="p">22b:絕緣層</p>
        <p type="p">23:層間絕緣膜</p>
        <p type="p">24:柱狀部</p>
        <p type="p">24a:記憶體絕緣膜</p>
        <p type="p">24b:半導體層</p>
        <p type="p">24c:通道半導體層</p>
        <p type="p">24d:核心絕緣膜</p>
        <p type="p">31:接觸插塞</p>
        <p type="p">32:配線層</p>
        <p type="p">33:塞孔</p>
        <p type="p">34:配線層</p>
        <p type="p">35:塞孔</p>
        <p type="p">36:配線層</p>
        <p type="p">37:塞孔</p>
        <p type="p">38:金屬墊</p>
        <p type="p">41:金屬墊</p>
        <p type="p">42:塞孔</p>
        <p type="p">43:配線層</p>
        <p type="p">51:配線層</p>
        <p type="p">51a:半導體層</p>
        <p type="p">51b:金屬層</p>
        <p type="p">52:鈍化膜</p>
        <p type="p">P1:側面部分</p>
        <p type="p">P2:底面部分</p>
        <p type="p">S:貼合面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2439" publication-number="202632812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於設定連接器之金屬接點之阻抗的參考金屬層之電路板</chinese-title>
        <english-title>CIRCUIT BOARD HAVING REFERENCE METAL LAYER FOR SETTING THE IMPEDANCE OF METAL CONTACTS OF A CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260425B">H01R13/6473</main-classification>
        <further-classification edition="201101120260425B">H01R13/6474</further-classification>
        <further-classification edition="201101120260425B">H01R13/6471</further-classification>
        <further-classification edition="201101120260425B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美超微電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPER MICRO COMPUTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　孟進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAN, MANHTIEN V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　茂林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MAU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李智豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板具有一電路及附接至該電路板之一連接器。該連接器具有金屬接點。該連接器之一外殼具有安置在一單端金屬接點或差分金屬接點下方之一嵌入之參考金屬層。該參考金屬層設定該單端金屬接點或該等差分金屬接點之該阻抗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board has an electrical circuit and a connector that is attached to the circuit board. The connector has metal contacts. A housing of the connector has an embedded reference metal layer that is disposed under a single-ended metal contact or differential metal contacts. The reference metal layer sets the impedance of the single-ended metal contact or the differential metal contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:連接器</p>
        <p type="p">203:信號跡線</p>
        <p type="p">204:參考跡線</p>
        <p type="p">205:貫通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2440" publication-number="202631668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＩＬ－１１抗體</chinese-title>
        <english-title>IL-11 ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K16/24</main-classification>
        <further-classification edition="200601120260429B">C07K14/725</further-classification>
        <further-classification edition="200601120260429B">A61K39/00</further-classification>
        <further-classification edition="200601120260429B">A61P35/00</further-classification>
        <further-classification edition="200601120260429B">A61P29/00</further-classification>
        <further-classification edition="200601120260429B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商新加坡保健服務私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGAPORE HEALTH SERVICES PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡國立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY OF SINGAPORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫克　史圖華　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOK, STUART ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏佛　塞巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEFER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供能夠結合至IL-11之抗原結合分子，及使用其進行醫學治療及預防之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are antigen-binding molecules capable of binding to IL-11, and methods of medical treatment and prophylaxis using the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2441" publication-number="202633335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合基板之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR BONDING OF SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10P72/00</main-classification>
        <further-classification edition="202601120260417B">H10P72/70</further-classification>
        <further-classification edition="202601120260417B">H10P74/00</further-classification>
        <further-classification edition="202601120260417B">H10W76/01</further-classification>
        <further-classification edition="202601120260417B">H05K3/34</further-classification>
        <further-classification edition="202601120260417B">H05K3/3447</further-classification>
        <further-classification edition="200601120260417B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EV GROUP E. THALLNER GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏跟特　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGENLEITNER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克茲　伏洛里恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURZ, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉格　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLACH, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟斯　卓傑恩　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUSS, JURGEN MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種運用以下步驟、特定言之以下順序使一第一基板(2)與一第二基板(2’)接合於該等基板(2、2’)之接觸面(2o、2o’)處之方法：  &lt;br/&gt;- 運用一固持力F&lt;sub&gt;H1&lt;/sub&gt;將該第一基板(2)固持至一第一樣本固持器(1)之一第一樣本固持器表面(1o)且運用一固持力F&lt;sub&gt;H2&lt;/sub&gt;將該第二基板(2’)固持至一第二樣本固持器(1’)之一第二樣本固持器表面(1o’)，  &lt;br/&gt;- 使該等接觸面(2o、2o’)在一接合起始點(20)處接觸且將至少該第二樣本固持器表面(1o’)加熱至一加熱溫度T&lt;sub&gt;H&lt;/sub&gt;，  &lt;br/&gt;- 沿自該接合起始點(20)延伸至該等基板(2、2’)之側邊緣(2s、2s’)之一接合波接合該第一基板(2)與該第二基板(2’)，  &lt;br/&gt;其特徵為  &lt;br/&gt;在該接合期間加熱溫度T&lt;sub&gt;H&lt;/sub&gt;在該第二樣本固持器表面(1o’)處降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for bonding a first substrate (2) with a second substrate (2’) at contact faces (2o, 2o’) of the substrates (2, 2’) with the following steps, in particular the following sequence: &lt;br/&gt;- holding of the first substrate (2) to a first sample holder surface (1o) of a first sample holder (1) with a holding force F&lt;sub&gt;H1&lt;/sub&gt; and holding of the second substrate (2’) to a second sample holder surface (1o’) of a second sample holder (1’) with a holding force F&lt;sub&gt;H2&lt;/sub&gt;, &lt;br/&gt;- contacting of the contact faces (2o, 2o’) at a bond initiation point (20) and heating of at least the second sample holder surface (1o’) to a heating temperature T&lt;sub&gt;H&lt;/sub&gt;, &lt;br/&gt;- bonding of the first substrate (2) with the second substrate (2’) along a bonding wave running from the bond initiation point (20) to the side edges (2s, 2s’) of the substrates (2, 2’), &lt;br/&gt;characterised in that &lt;br/&gt;heating temperature T&lt;sub&gt;H&lt;/sub&gt; is reduced at the second sample holder surface (1o’) during the bonding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:第一基板</p>
        <p type="p">2’:第二基板</p>
        <p type="p">2o:基板表面</p>
        <p type="p">2o’:基板表面</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:基板厚度</p>
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:基板厚度</p>
        <p type="p">D:基板邊緣間隔</p>
        <p type="p">E1:基板彈性模數</p>
        <p type="p">E2:基板彈性模數</p>
        <p type="p">F&lt;sub&gt;1&lt;/sub&gt;,F&lt;sub&gt;2&lt;/sub&gt;:力</p>
        <p type="p">F&lt;sub&gt;H1&lt;/sub&gt;:固持力</p>
        <p type="p">F&lt;sub&gt;H2&lt;/sub&gt;:固持力</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;:基板重力</p>
        <p type="p">G&lt;sub&gt;2&lt;/sub&gt;:基板重力</p>
        <p type="p">m&lt;sub&gt;1&lt;/sub&gt;:基板質量</p>
        <p type="p">m&lt;sub&gt;2&lt;/sub&gt;:基板質量</p>
        <p type="p">p:氣體(混合物)壓力</p>
        <p type="p">p&lt;sub&gt;1&lt;/sub&gt;:基板密度</p>
        <p type="p">p&lt;sub&gt;2&lt;/sub&gt;:基板密度</p>
        <p type="p">r&lt;sub&gt;1&lt;/sub&gt;:基板曲率半徑</p>
        <p type="p">r&lt;sub&gt;10&lt;/sub&gt;:初始基板曲率半徑</p>
        <p type="p">r&lt;sub&gt;2&lt;/sub&gt;:基板曲率半徑</p>
        <p type="p">r&lt;sub&gt;20&lt;/sub&gt;:初始基板曲率半徑</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:基板溫度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:基板溫度</p>
        <p type="p">v:接合波速度</p>
        <p type="p">V&lt;sub&gt;1&lt;/sub&gt;:基板體積</p>
        <p type="p">V&lt;sub&gt;2&lt;/sub&gt;:基板體積</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2442" publication-number="202632649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114322</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">G11C7/08</main-classification>
        <further-classification edition="200601120260416B">G11C7/12</further-classification>
        <further-classification edition="200601120260416B">G11C8/10</further-classification>
        <further-classification edition="200601120260416B">G11C8/14</further-classification>
        <further-classification edition="200601120260416B">G11C5/02</further-classification>
        <further-classification edition="200601120260416B">G11C16/02</further-classification>
        <further-classification edition="202301120260416B">H10B41/30</further-classification>
        <further-classification edition="200601120260416B">H05K13/06</further-classification>
        <further-classification edition="202601120260416B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤光司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能縮短處理時間之半導體記憶裝置。實施方式之半導體記憶裝置具備：第1佈線層、第2佈線層及複數個第3佈線層，其等在第1方向上相互分離地依序排列而設置；記憶柱，其於第1方向上延伸，且其與第1佈線層相交之部分作為第1記憶單元發揮功能；以及控制電路，其控制第1記憶單元所記憶之資料之讀出動作；且控制電路於讀出動作時，執行：第1動作，其使複數個第3佈線層之電壓以第1梯度自第1電壓向較第1電壓高之第2電壓變化；第2動作，其使第2佈線層之電壓以較第1梯度大之第2梯度自第1電壓向較第2電壓高之第3電壓變化；以及第3動作，其使第1佈線層之電壓向與第1記憶單元之讀出位準相應之第4電壓變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">AR:讀出電壓</p>
        <p type="p">ER:讀出電壓</p>
        <p type="p">Far:字元線之遠端</p>
        <p type="p">Near:字元線之近端</p>
        <p type="p">t10:時刻</p>
        <p type="p">t11:時刻</p>
        <p type="p">t12:時刻</p>
        <p type="p">t13:時刻</p>
        <p type="p">t14:時刻</p>
        <p type="p">t15:時刻</p>
        <p type="p">t16:時刻</p>
        <p type="p">VREAD:電壓</p>
        <p type="p">VREADK:電壓</p>
        <p type="p">VSS:電壓</p>
        <p type="p">WLk:字元線</p>
        <p type="p">WL(k±1):字元線</p>
        <p type="p">WL(k±2):字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2443" publication-number="202632210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114328</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>傳導式電子武器的電極</chinese-title>
        <english-title>ELECTRODE FOR A CONDUCTED ELECTRICAL WEAPON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260416B">F41B15/00</main-classification>
        <further-classification edition="200601120260416B">F41H13/00</further-classification>
        <further-classification edition="200601120260416B">H05C1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛克勝企業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXON ENTERPRISE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯科爾　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRISCOLL, SAMUEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果福　強恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROFF, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考特　崔佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTT, TREVOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅姆尼　倫敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMNEY, LANDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於傳導式電子武器的電極可包含電極本體和耦接到該電極本體的第一端的電極頭。該電極頭可包含一或多個周向凹槽。細絲可儲存在電極本體中並且可周向纏繞到該一或多個周向凹槽中以將該細絲耦接到該電極頭。該電極可包含耦接到該電極頭的吸收器。該吸收器可包含用以提供剛性和結構到該吸收器的芯。衝擊分散器可定位在該吸收器前方。回應於衝擊，該衝擊分散器可提供力到該吸收器以致使該吸收器徑向向外膨脹。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode for a conducted electrical weapon may comprise an electrode body and an electrode head coupled to a first end of the electrode body. The electrode head may comprise one or more circumferential grooves. A filament may be stored in the electrode body and may be circumferentially wound into the one or more circumferential grooves to couple the filament to the electrode head. The electrode may comprise an absorber coupled to the electrode head. The absorber may comprise a core to provide rigidity and structure to the absorber. An impact spreader may be positioned forward the absorber. In response to an impact, the impact spreader may provide a force to the absorber to cause the absorber to expand radially outward.</p>
      </isu-abst>
      <representative-img>
        <p type="p">361:本體</p>
        <p type="p">362:第一頭端</p>
        <p type="p">363:第二頭端</p>
        <p type="p">365:中間段</p>
        <p type="p">387:細絲</p>
        <p type="p">388:第一細絲端</p>
        <p type="p">460:頭部</p>
        <p type="p">467-1:第一通道</p>
        <p type="p">467-2:第二通道</p>
        <p type="p">467-3:第三通道</p>
        <p type="p">469-1:第一互連凹槽</p>
        <p type="p">469-2:第二互連凹槽</p>
        <p type="p">469-3:第三互連凹槽</p>
        <p type="p">469-4:第四互連凹槽</p>
        <p type="p">586-1:本體纏繞</p>
        <p type="p">586-2:第一頭部纏繞</p>
        <p type="p">586-3:第二頭部纏繞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2444" publication-number="202632753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置、基板支持部及饋電結構</chinese-title>
        <english-title>PLASMA PROCESSING APPARATUS, SUBSTRATE SUPPORT AND POWER FEED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">H01J37/32</main-classification>
        <further-classification edition="200601120260422B">H05H1/46</further-classification>
        <further-classification edition="202601120260422B">H10P72/70</further-classification>
        <further-classification edition="202601120260422B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早坂友輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASAKA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋慎伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永海幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電漿處理裝置具備腔室、靜電吸盤、第1饋電線、及第2饋電線。靜電吸盤包含：第1區域，其上載置基板；及第2區域，其上載置邊緣環。第1區域包含第1電極。第2區域包含第2電極。第1饋電線將產生施加至第1電極之電壓之脈衝之偏壓電源與第1電極相互連接。第2饋電線將產生施加至第2電極之電壓之脈衝之偏壓電源與第2電極相互連接。第2饋電線包含一個以上之插口及一個以上之饋電接腳。一個以上之饋電接腳於徑向上具有可撓性，且嵌入至一個以上之插口內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disclosed plasma processing apparatus is provided with a chamber, an electrostatic chuck, a first feed line, and a second feed line. The electrostatic chuck includes a first region on which a substrate is placed and a second region on which an edge ring is placed. The first region includes a first electrode provided therein. The second region including a second electrode provided therein. The first feed line connects the first electrode and a bias power supply generating a pulse of a voltage applied to the first electrode to each other. The second feed line connects the second electrode and the bias power supply or another bias power supply generating a pulse of the voltage applied to the second electrode to each other. The second feed line includes one or more sockets and one or more feed pins. The one or more feed pins have flexibility in a radial direction thereof and are fitted into the one or more sockets.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16:基板支持部</p>
        <p type="p">18:支持體</p>
        <p type="p">20:基台</p>
        <p type="p">20f:流路</p>
        <p type="p">22a:第1區域</p>
        <p type="p">22b:第2區域</p>
        <p type="p">22e:端子</p>
        <p type="p">22f:端子</p>
        <p type="p">22m:介電部</p>
        <p type="p">24:構件</p>
        <p type="p">25:構件</p>
        <p type="p">57:饋電管</p>
        <p type="p">81:第1饋電線</p>
        <p type="p">81p:饋電接腳</p>
        <p type="p">81s:插口</p>
        <p type="p">81w:配線</p>
        <p type="p">82:第2饋電線</p>
        <p type="p">82b:分支線</p>
        <p type="p">82c:共通線</p>
        <p type="p">82j:接頭</p>
        <p type="p">82p:饋電接腳</p>
        <p type="p">82r:環狀構件</p>
        <p type="p">82s:插口</p>
        <p type="p">82t:配線</p>
        <p type="p">82w:配線</p>
        <p type="p">83:絕緣子</p>
        <p type="p">84:絕緣子</p>
        <p type="p">86:套筒</p>
        <p type="p">88:保持器</p>
        <p type="p">221:第1電極</p>
        <p type="p">222:第2電極</p>
        <p type="p">224:吸盤電極</p>
        <p type="p">225:吸盤電極</p>
        <p type="p">AX:軸線</p>
        <p type="p">ER:邊緣環</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2445" publication-number="202633078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260417B">H10B12/00</main-classification>
        <further-classification edition="202601120260417B">H10W90/20</further-classification>
        <further-classification edition="200601120260417B">G11C11/4091</further-classification>
        <further-classification edition="200601120260417B">G11C11/4096</further-classification>
        <further-classification edition="200601120260417B">G11C11/4097</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田信彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海野正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNNO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中博幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAKA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋好明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前嶋洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEJIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之實施方式提供一種能達成高積體化之半導體記憶裝置。  實施方式之半導體記憶裝置具備經由複數個貼合電極而貼合之第1晶片及第2晶片。第1晶片具備半導體基板。第2晶片具備複數個第1導電層、與複數個第1導電層對向之複數個半導體層、包含複數個位元線之第1配線層、包含複數根配線之第2配線層、及包含複數個第1貼合電極之第3配線層。第2配線層中之複數根配線分別具備：第1部分，其設置於自第1方向觀察與複數個位元線中之一者重疊之區域，且電性連接於複數個位元線中之一者；及第2部分，其設置於自第1方向觀察與複數個第1貼合電極中之一者重疊之區域，且連接於複數個第1貼合電極中之一者。該等配線之至少一部分具備連接於第1部分之第2方向之一端部、及第2部分之第2方向之一端部之第3部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">151,152,153:部分</p>
        <p type="p">Gm1:配線群</p>
        <p type="p">m1a:配線</p>
        <p type="p">P&lt;sub&gt;I1&lt;/sub&gt;:貼合電極</p>
        <p type="p">P&lt;sub&gt;151&lt;/sub&gt;,P&lt;sub&gt;152&lt;/sub&gt;,P&lt;sub&gt;PI1&lt;/sub&gt;:間距</p>
        <p type="p">X&lt;sub&gt;153&lt;/sub&gt;:長度</p>
        <p type="p">Y&lt;sub&gt;151&lt;/sub&gt;,Y&lt;sub&gt;152&lt;/sub&gt;,Y&lt;sub&gt;Gm1&lt;/sub&gt;:寬度</p>
        <p type="p">Y&lt;sub&gt;LS&lt;/sub&gt;:合計寬度</p>
        <p type="p">Y&lt;sub&gt;S&lt;/sub&gt;:最小距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2446" publication-number="202631443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力驅動車用之組件及齒輪</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">B62K19/18</main-classification>
        <further-classification edition="200601120260419B">B62K19/30</further-classification>
        <further-classification edition="200601120260419B">B62K19/24</further-classification>
        <further-classification edition="200601120260419B">B62M11/00</further-classification>
        <further-classification edition="200601120260419B">B62M11/14</further-classification>
        <further-classification edition="200601120260419B">B62M7/02</further-classification>
        <further-classification edition="201001120260419B">B62M6/55</further-classification>
        <further-classification edition="200601120260419B">F16H55/06</further-classification>
        <further-classification edition="200601120260419B">F16H55/17</further-classification>
        <further-classification edition="200601120260419B">H02K5/16</further-classification>
        <further-classification edition="200601120260419B">H02K7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀田剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEDA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石﨑博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田慎一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可抑制壽命降低之人力驅動車用之組件及齒輪。  &lt;br/&gt;本發明之人力驅動車用之組件包含：外殼；及安裝部，其設置於外殼，且構成為藉由緊固件而安裝於人力驅動車之支持部；且安裝部包含：金屬製之基座部；金屬製之連結部，其設置於基座部，且構成為連結於緊固件；及中間部，其設置於連結部與基座部之間；且基座部包含具有第1標準電極電位之第1材料；連結部包含具有第2標準電極電位之第2材料；中間部係由第3材料或第4材料形成，該第3材料具有第3標準電極電位，第3標準電極電位與第1標準電極電位之差、及第3標準電極電位與第2標準電極電位之差分別小於第1標準電極電位與第2標準電極電位之差，該第4材料具有電絕緣性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">36:緊固件</p>
        <p type="p">36A:公螺紋部</p>
        <p type="p">38:支持部</p>
        <p type="p">38A:貫通孔</p>
        <p type="p">42:外殼</p>
        <p type="p">44:安裝部</p>
        <p type="p">44A:第1安裝部</p>
        <p type="p">62:基座部</p>
        <p type="p">62A:孔</p>
        <p type="p">62B:第1母螺紋部</p>
        <p type="p">64:連結部</p>
        <p type="p">64A:第2母螺紋部</p>
        <p type="p">64B:凸緣部</p>
        <p type="p">64C:工具卡合部</p>
        <p type="p">64D:側面</p>
        <p type="p">64E:孔</p>
        <p type="p">64X:第1端部</p>
        <p type="p">64Y:第2端部</p>
        <p type="p">66:中間部</p>
        <p type="p">66A:公螺紋部</p>
        <p type="p">C1:中心軸心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2447" publication-number="202631435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>間歇運動裝置、車輪鎖定結構和兒童車</chinese-title>
        <english-title>INTERMITTENT MOVEMENT DEVICE, WHEEL LOCKING STRUCTURE AND CHILD STROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">B62B9/08</main-classification>
        <further-classification edition="200601120260419B">B62B5/04</further-classification>
        <further-classification edition="200601120260419B">B60N2/26</further-classification>
        <further-classification edition="200601120260419B">B62B9/12</further-classification>
        <further-classification edition="200601120260419B">B62B9/26</further-classification>
        <further-classification edition="200601120260419B">B62B7/00</further-classification>
        <further-classification edition="200601120260419B">F16D41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁家良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種間歇運動裝置，包含：殼體；驅動件，設置在該殼體內，能圍繞第一軸線旋轉；多個卡齒，基於該第一軸線周向分布在該驅動件上；操作件，能相對於該驅動件圍繞該第一軸線在初始位置與作用位置之間進行往復運動；其中，當該操作件從該作用位置運動到該初始位置時，該操作件越過該卡齒的其中之一從該作用位置返回到該初始位置，並且該驅動件不隨著該操作件旋轉。本申請還公開了一種車輪鎖定結構和一種兒童車。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intermittent movement device according to the application includes: a housing; a driving member, disposed in the housing, and capable of rotating around a first axis; a plurality of engagement teeth, circumferentially distributed on the driving member based on the first axis; an operating member, capable of performing reciprocating movement between an initial position and an acting position with respect to the driving member around the first axis; wherein when the operating member moves from the acting position to the initial position, the operating member passes over one of the engagement teeth to return from the acting position to the initial position, and the driving member does not rotate with the operating member. The application further discloses a wheel locking structure and a stroller.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1110:殼體</p>
        <p type="p">1111:指示窗</p>
        <p type="p">1113:銷孔</p>
        <p type="p">1114:輪軸孔</p>
        <p type="p">1120:車輪</p>
        <p type="p">1121:駐車孔</p>
        <p type="p">1122:輪軸</p>
        <p type="p">1130:銷</p>
        <p type="p">1140:驅動件</p>
        <p type="p">1150:卡齒</p>
        <p type="p">1160:操作件</p>
        <p type="p">1170:連動滑塊</p>
        <p type="p">1171:纜線第一端連接部</p>
        <p type="p">1172:滑塊斜面</p>
        <p type="p">1180:連動座</p>
        <p type="p">1181:連動座抵靠部</p>
        <p type="p">1182:柱形部</p>
        <p type="p">1183:斜面部</p>
        <p type="p">1193:卡齒彈性件</p>
        <p type="p">1194:銷彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2448" publication-number="202633492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260416B">H10W72/20</main-classification>
        <further-classification edition="202601120260416B">H10W72/50</further-classification>
        <further-classification edition="202601120260416B">H10W70/60</further-classification>
        <further-classification edition="202601120260416B">H10W70/692</further-classification>
        <further-classification edition="202601120260416B">H10W76/134</further-classification>
        <further-classification edition="202601120260416B">H10D62/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日月光半導體製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾吉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴律名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, LU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敬涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴虢樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, KUO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳輝忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種半導體封裝結構。該半導體封裝結構包括一基板、一第一電子組件及一支撐組件。該第一電子組件安置於該基板上。該第一電子組件具有面朝該基板之一第一表面的一背面表面。該支撐組件安置在該第一電子組件之該背面表面與該基板之該第一表面之間。該第一電子組件之該背面表面具有連接至該支撐組件之一第一部分及自該支撐組件曝露之一第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2A:半導體封裝結構</p>
        <p type="p">10:基板</p>
        <p type="p">10c:腔</p>
        <p type="p">101:頂表面</p>
        <p type="p">102:頂表面</p>
        <p type="p">103:表面</p>
        <p type="p">11a:黏著層</p>
        <p type="p">12:電子組件</p>
        <p type="p">12a:黏著層</p>
        <p type="p">12h:熱源區</p>
        <p type="p">12w:導電線</p>
        <p type="p">13:電子組件</p>
        <p type="p">13a:接合層</p>
        <p type="p">13w:導電線</p>
        <p type="p">14:蓋</p>
        <p type="p">21:絕緣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2449" publication-number="202631997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冠狀病毒ｉＲＮＡ組成物及其使用方法</chinese-title>
        <english-title>CORONAVIRUS IRNA COMPOSITIONS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260420B">C12N15/113</main-classification>
        <further-classification edition="200601120260420B">A61K31/713</further-classification>
        <further-classification edition="200601120260420B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿尼拉製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＶＩＲ生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIR BIOTECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿奇尼　阿奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKINC, AKIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克尼奇　詹姆斯Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCININCH, JAMES D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安格魯羅德里格斯　葉西妮婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGLERO-RODRIGUEZ, YESSEINIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒黎格爾　馬克Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLEGEL, MARK K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希班納　克里斯蒂Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEBNER, CHRISTY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫普　弗洛里安Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMPP, FLORIAN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於靶向冠狀病毒基因組之RNAi劑，例如，dsRNA劑。本發明亦關於使用此類RNAi劑抑制冠狀病毒基因組之表現的方法以及治療或預防受試者之冠狀病毒相關疾病的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to RNAi agents,&lt;i&gt;e.g.,&lt;/i&gt;dsRNA agents, targeting the coronavirus genome. The invention also relates to methods of using such RNAi agents to inhibit expression of a coronavirus genome and to methods of treating or preventing a coronavirus-associated disease in a subject.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2450" publication-number="202633295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114406</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>
        <english-title>ETCHING METHOD AND PLASMA PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260417B">H10P50/20</main-classification>
        <further-classification edition="200601120260417B">H05H1/46</further-classification>
        <further-classification edition="200601120260417B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田郁弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村正太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森北信也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIKITA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可提高蝕刻選擇比之蝕刻方法及電漿處理裝置。  &lt;br/&gt;蝕刻方法包括如下步驟：準備基板，其中基板包含含矽及氮之第1區域、及含矽及氧之第2區域；以及藉由將第1區域及第2區域暴露於由含碳、氟及鎢之處理氣體生成之電漿中，而於第1區域上形成含鎢保護層，並對第2區域進行蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An etching method includes: preparing a substrate including a first region containing silicon and nitrogen, and a second region containing silicon and oxygen; and etching the second region while forming a tungsten-containing protective layer on the first region, by exposing the first and second regions to plasma generated from a processing gas containing carbon, fluorine, and tungsten.</p>
      </isu-abst>
      <representative-img>
        <p type="p">MT:方法</p>
        <p type="p">ST1:步驟</p>
        <p type="p">ST2:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2451" publication-number="202631006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載具</chinese-title>
        <english-title>CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">A01K1/02</main-classification>
        <further-classification edition="200601120260422B">A01K1/06</further-classification>
        <further-classification edition="200601120260422B">B60N2/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商居佳國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭征文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINGZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李晏菱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YENLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉光浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KWANGHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立纮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種載具。所述載具包括：箱體，包括底部和連接於所述底部的周壁，所述底部與所述周壁限定用以容置寵物的容置空間；以及第一固定裝置，包括：主體框架，連接至所述箱體的底部；連接框架，包括第一連接支架，所述第一連接支架與所述主體框架連接並能相對於所述主體框架移動；連接器，連接於所述第一連接支架的一端，並隨著所述連接框架相對於所述主體框架的移動而自所述箱體的第一側伸出，其中，所述載具通過所述連接器連接至車輛座椅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a carrier. The carrier includes a box including a bottom part and a peripheral wall connected to the bottom part, wherein the bottom part and the peripheral wall define an accommodating space for accommodating a pet; and a first fixing device including a primary frame connected to the bottom part of the box; a connecting frame including a first connecting bracket connected with the primary frame and may move with respect to the primary frame; a connector connected to one end of the first connecting bracket and protruding from a first side of the box with movement of the connecting frame relative to the primary frame, wherein the carrier is connected to a vehicle seat through the connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:載具</p>
        <p type="p">1110:箱體</p>
        <p type="p">1110A、1110B:長側</p>
        <p type="p">1120:把手</p>
        <p type="p">1121、1122:樞軸</p>
        <p type="p">1130:固定裝置</p>
        <p type="p">S1:乘載空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2452" publication-number="202632460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電計算系統及光電計算方法</chinese-title>
        <english-title>OPTOELECTRONIC COMPUTING SYSTEMS AND OPTOELECTRONIC COMPUTING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260420B">G06E3/00</main-classification>
        <further-classification edition="200601120260420B">G06N3/067</further-classification>
        <further-classification edition="200601120260420B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光子智能私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTELLIGENCE, PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟懷宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, HUAIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐葉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YELONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德瑞　吉伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDRY, GILBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐龍武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, LONGWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　京東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, JINGDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋格能　羅納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAGNON, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧正觀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史丹曼　莫瑞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINMAN, MAURICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊凡斯　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, MIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈亦晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電計算系統，包括：具有光子積體電路（PIC）的第一半導體晶粒和具有電子積體電路（EIC）的第二半導體晶粒。 PIC包括光波導，其中在由該光波導所承載的相應複數光訊號上編碼一組多個輸入值。 PIC包括具有光離器的光複製分配網路。 PIC包括光電子電路區段之陣列，每個光電子電路區段從光複製分配網路的輸出端口中的一個接收光波，並且每個光電子電路區段包括：至少一個光偵測器，偵測來自光電操作的至少一個光波。 EIC包括電輸入端口，其接收相應的電值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:人工神經網路計算系統</p>
        <p type="p">102:電腦</p>
        <p type="p">110:控制器</p>
        <p type="p">120:記憶體單元</p>
        <p type="p">130:數位類比轉換器單元</p>
        <p type="p">132:第一數位類比轉換器子單元</p>
        <p type="p">134:第二數位類比轉換器子單元</p>
        <p type="p">140:光處理器</p>
        <p type="p">142:雷射單元</p>
        <p type="p">144:調變器陣列</p>
        <p type="p">146:偵測單元</p>
        <p type="p">150:光矩陣乘法單元</p>
        <p type="p">160:類比數位轉換器單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2453" publication-number="202633228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移載方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260417B">H10H29/03</main-classification>
        <further-classification edition="202501120260417B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲田悟基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, SATOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植森信隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMORI, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小沢周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAWA, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TAKETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田昌実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤正彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出下述方法及裝置，即：針對排列於第一基板上的元件，一邊修正其位置偏移一邊使用雷射光向第二基板移載。獲取第一基板上的元件的實際位置信息，按照基於可容許的位置偏移量所決定的基準進行分組，以各組為單位，以元件的位置限制於可容許的位置偏移量的範圍內的方式修正第一基板的位置，從第一基板的背面照射雷射光而向第二基板移載元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2454" publication-number="202631800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱塑性樹脂及包含該樹脂之光學鏡片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">C08G63/189</main-classification>
        <further-classification edition="200601120260422B">C08G63/193</further-classification>
        <further-classification edition="200601120260422B">C08G63/64</further-classification>
        <further-classification edition="200601120260422B">C08G63/66</further-classification>
        <further-classification edition="200601120260422B">C08G63/672</further-classification>
        <further-classification edition="200601120260422B">C08G64/02</further-classification>
        <further-classification edition="200601120260422B">C08G64/06</further-classification>
        <further-classification edition="200601120260422B">C08G64/16</further-classification>
        <further-classification edition="200601120260422B">C08G64/30</further-classification>
        <further-classification edition="200601120260422B">C08K5/06</further-classification>
        <further-classification edition="200601120260422B">C08L101/00</further-classification>
        <further-classification edition="200601120260422B">C08L67/02</further-classification>
        <further-classification edition="200601120260422B">C08L69/00</further-classification>
        <further-classification edition="200601120260422B">G02B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤宣之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西森克吏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMORI, KATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木篤志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTEGI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原健太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田鈴木章子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA SUZUKI, SHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方龍展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, TATSUNOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，可提供一種包含源自下述一般式(1)表示之單體的構成單位(A)之熱塑性樹脂。  &lt;br/&gt;&lt;img align="absmiddle" height="273px" width="397px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(一般式(1)中，  &lt;br/&gt;　　R&lt;sub&gt;1&lt;/sub&gt;～R&lt;sub&gt;12&lt;/sub&gt;、Rk及Rp分別獨立表示氫原子、氟原子、氯原子、溴原子、碘原子、碳數5～20之環烷基、碳數5～20之環烷氧基、碳數6～20之芳基、碳數1～10之直鏈狀或是分枝狀的烷基、碳數2～10之烯基、碳數1～10之烷氧基、包含選自O、N及S中之一個以上之雜環原子的碳數6～20之雜芳基或碳數7～20之芳烷基，  &lt;br/&gt;　　X及Y表示單鍵或碳數1～5之伸烷基，i及ii分別獨立表示0～4之整數，K&lt;sub&gt;1&lt;/sub&gt;及K&lt;sub&gt;2&lt;/sub&gt;分別獨立表示-OH、-COOH或  &lt;br/&gt;-COORq，Rq表示碳數1～5之烷基)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2455" publication-number="202631842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜及光學膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260417B">C08J5/18</main-classification>
        <further-classification edition="200601120260417B">C08J3/12</further-classification>
        <further-classification edition="200601120260417B">C08J3/24</further-classification>
        <further-classification edition="200601120260417B">C08F265/06</further-classification>
        <further-classification edition="200601120260417B">B29B9/10</further-classification>
        <further-classification edition="200601120260417B">C08L33/10</further-classification>
        <further-classification edition="201501120260417B">G02B1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村倫明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寳來健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKARAGI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之顆粒含有（甲基）丙烯酸樹脂與（甲基）丙烯酸交聯粒子，該（甲基）丙烯酸樹脂含有在主鏈具有環結構之環結構單元，其特徵在於：不存在（甲基）丙烯酸交聯粒子之部分的平均彈性模數E1與存在（甲基）丙烯酸交聯粒子之部分的平均彈性模數E2滿足下述式（1）。  &lt;br/&gt;式（1）　0.90≦E2／E1</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2456" publication-number="202631287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合方法及釺料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B23K1/19</main-classification>
        <further-classification edition="200601120260422B">B23K35/28</further-classification>
        <further-classification edition="200601120260422B">C22C21/00</further-classification>
        <further-classification edition="200601120260422B">C22C21/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本發條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NHK SPRING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山内雄一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関優佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川原魁人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWAHARA, KAITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之接合體具備：作為接合對象之第一構件及第二構件，其等中之至少一方由7000系鋁合金製成；以及接合層，其由鋁(Al)、鎂(Mg)及不可避免之雜質構成，用於將第一構件及第二構件接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2457" publication-number="202631385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光板、圖像顯示裝置及偏光板的製造方法</chinese-title>
        <english-title>POLARIZING PLATE AND IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING POLARIZING PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">B32B23/08</main-classification>
        <further-classification edition="200601120260422B">B32B27/30</further-classification>
        <further-classification edition="200601120260422B">B32B7/12</further-classification>
        <further-classification edition="200601120260422B">C09J11/06</further-classification>
        <further-classification edition="200601120260422B">C09J129/04</further-classification>
        <further-classification edition="200601120260422B">G02B5/30</further-classification>
        <further-classification edition="200601120260422B">G02F1/1335</further-classification>
        <further-classification edition="200601120260422B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制了在高溫環境下穿透率降低的偏光板。本發明之偏光板具有使聚乙烯醇系樹脂層吸附配向有二色性色素而成的偏光元件、及積層於前述偏光元件之至少一面的透明保護膜，其中前述偏光元件與前述透明保護膜係藉由含有第1化合物及第2化合物的接著劑所形成之接著劑層所貼合，前述第1化合物係選自脲、脲衍生物、硫脲及硫脲衍生物所成群組中的至少1種，前述第2化合物為具有氮氧自由基或氮氧基的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a polarizing plate which could suppress the reduction of the transmission in a high temperature environment. The polarizing plate of the present invention has a polarizing element with a dichroic pigment adsorbed and oriented on a polyvinyl alcohol resin layer, and a transparent protecting film laminated on at least one side of the aforementioned polarizing element, wherein the aforementioned polarizing element and the transparent protecting film are adhered by an adhesive layer formed by adhesive having a first compound and a second compound, and the first compound is at least one selected from the group of urea, urea derivatives, thiourea, and thiourea derivatives, and the aforementioned second compound is a compound having a nitroxide free radical or a nitroxide group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。  &lt;br/&gt;本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2458" publication-number="202631088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>牙冠模型生成方法以及牙冠模型生成系統</chinese-title>
        <english-title>DENTAL CROWN MODEL GENERATION METHOD AND DENTAL CROWN MODEL GENERATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260419B">A61C5/77</main-classification>
        <further-classification edition="200601120260419B">A61C13/00</further-classification>
        <further-classification edition="200601120260419B">G06T17/00</further-classification>
        <further-classification edition="201101120260419B">G06T19/20</further-classification>
        <further-classification edition="201701120260419B">G06T7/00</further-classification>
        <further-classification edition="202201120260419B">G06V10/20</further-classification>
        <further-classification edition="202201120260419B">G06V20/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德睿生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENTSCAPE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周正剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHENG-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉曉暘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIAO-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉達融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DA-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種牙冠模型生成方法以及牙冠模型生成系統。此牙冠模型生成方法包括：在一牙齒三維影像模型中的複數個位置，設置為複數個幾何特徵；步驟A：利用複數個牙模參數，產生一測試牙齒模型，據以獲得複數個預設幾何特徵；步驟B：將該複數個幾何特徵進行至少一分析運算，以產生至少一方程式；步驟C：將該複數個預設幾何特徵與該至少一方程式的一特徵匹配程度，進行複數個評分；步驟D：將上述複數個評分，進行運算，獲得一假牙分數；若該假牙分數小於一門檻分數，將該假牙分數輸入進入一人工智慧單元，更新該複數個牙模參數，繼續進行步驟A到步驟D，直到該假牙分數大於該門檻分數；以及用最終的該複數個牙模參數對應的該測試牙齒模型，作為一最終牙冠模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a dental crown model generation method and a dental crown model generation system. The method includes: retrieving preset dental shape data including multiple geometric features based on the target position of the treated tooth; adjusting the preset dental shape using rotation, stretching, and translation parameters to obtain the adjusted geometric features; scoring the matching degree between the adjusted geometric feature and multiple conditional operations; performing weighted calculations on the scores to obtain a dental score; if the dental score is below a threshold score, inputting the dental score into a parameter correction artificial intelligence unit to obtain new rotation, stretching, and translation parameters, and continuing the adjustment until the dental score exceeds the threshold score; and using the dental shape corresponding to the final parameters as the final dental crown model for the patient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S2101~S2112:本發明一較佳實施例的牙冠模型生成方法之流程步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2459" publication-number="202632106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗衣機的自動液劑投入裝置以及洗衣機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260419B">D06F39/02</main-classification>
        <further-classification edition="200601120260419B">D06F39/08</further-classification>
        <further-classification edition="202001120260419B">D06F33/37</further-classification>
        <further-classification edition="200601120260419B">F04B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外薗洸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKAZONO, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手島賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESHIMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻啓吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之洗衣機具備：外槽，彈性支撐於殼體內；至少2個槽體，容置被供給至外槽的液劑，並且沿著第1方向來配置；及至少2個自動投入裝置，連接於已形成在各個槽體的連接部，並且沿著第1方向來配置，各個自動液劑投入裝置具有：動力部；減速機構，與動力部卡合；及泵機構，連接於減速機構的輸出軸，減速機構的徑向與第1方向大致正交。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">62:槽體</p>
        <p type="p">63:液劑投入裝置</p>
        <p type="p">71:動力部</p>
        <p type="p">72:減速機構</p>
        <p type="p">73:泵機構</p>
        <p type="p">76:連接部</p>
        <p type="p">84:汽缸</p>
        <p type="p">85:入口流路</p>
        <p type="p">86:出口流路</p>
        <p type="p">90:背面</p>
        <p type="p">91:液劑流入口</p>
        <p type="p">D1,D2:尺寸</p>
        <p type="p">K:寬度方向</p>
        <p type="p">K1:外側</p>
        <p type="p">K2:中心側</p>
        <p type="p">M:前後方向</p>
        <p type="p">M1:前側</p>
        <p type="p">M2:後側</p>
        <p type="p">R1:徑向</p>
        <p type="p">T1:厚度</p>
        <p type="p">V1:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2460" publication-number="202631437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乘用裝置</chinese-title>
        <english-title>PASSENGER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">B62B9/12</main-classification>
        <further-classification edition="200601120260421B">B62B7/06</further-classification>
        <further-classification edition="200601120260421B">B62B7/10</further-classification>
        <further-classification edition="200601120260421B">B62B9/20</further-classification>
        <further-classification edition="200601120260421B">B62B5/00</further-classification>
        <further-classification edition="200601120260421B">A47D13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁家良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐頌雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乘用裝置，包括：車架；車手，所述車手樞接於所述車架；和車輪件，所述車輪件樞接於所述車架，其中，所述車架能夠在收合狀態和展開狀態之間切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A passenger device includes: a frame; a handlebar, the handlebar being pivotally connected to the frame; and a wheel member, the wheel member being pivotally connected to the frame, and the frame is capable of switching between a folded state and an unfolded state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:乘用裝置</p>
        <p type="p">10:車架</p>
        <p type="p">14:車手</p>
        <p type="p">18:固定座</p>
        <p type="p">22:連動件</p>
        <p type="p">32:牽拉件</p>
        <p type="p">38:操作件</p>
        <p type="p">40:座椅</p>
        <p type="p">100:第一支撐件</p>
        <p type="p">102:第二支撐件</p>
        <p type="p">140:車手連接座</p>
        <p type="p">1000:第一連接座</p>
        <p type="p">1020:第二連接座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2461" publication-number="202631976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清洗劑組成物</chinese-title>
        <english-title>CLEANING AGENT COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C11D7/32</main-classification>
        <further-classification edition="200601120260421B">C11D7/36</further-classification>
        <further-classification edition="200601120260421B">C11D11/00</further-classification>
        <further-classification edition="200601120260421B">C11D1/00</further-classification>
        <further-classification edition="200601120260421B">C09G1/18</further-classification>
        <further-classification edition="202601120260421B">H10P72/00</further-classification>
        <further-classification edition="202601120260421B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成田萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARITA, MOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋智威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷篤史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種有機物殘渣的去除性能的經時穩定性優異且對金屬層之耐腐蝕性亦優異之半導體器件用清洗劑組成物。本發明的清洗劑組成物係半導體器件用清洗劑組成物，其包含：選自包括羥胺及羥胺鹽之群組中之一種以上的羥胺化合物；選自包括除聚胺基羧酸以外之羧酸系螯合劑及膦酸系螯合劑之群組中之一種以上的螯合劑；及苯并三唑化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:金屬層</p>
        <p type="p">3:蝕刻停止層</p>
        <p type="p">4:層間絕緣層</p>
        <p type="p">5:金屬硬遮罩</p>
        <p type="p">6:孔</p>
        <p type="p">10:積層物</p>
        <p type="p">11:內壁</p>
        <p type="p">11a:剖面壁</p>
        <p type="p">11b:底壁</p>
        <p type="p">12:殘渣物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2462" publication-number="202631395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114939</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置用積層體及顯示裝置</chinese-title>
        <english-title>STACKED BODY FOR DISPLAY DEVICE AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260425B">B32B27/18</main-classification>
        <further-classification edition="200601120260425B">G02B5/22</further-classification>
        <further-classification edition="201901120260425B">B32B7/023</further-classification>
        <further-classification edition="201801120260425B">C08K3/014</further-classification>
        <further-classification edition="200601120260425B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口紗緒里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田慶祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置用積層體，該顯示裝置用積層體具有基材層與功能層，且上述功能層含有樹脂、有機系紫外線吸收劑及無機系紫外線吸收劑，以藉由未使用積分球之測色方法所測定的透射黃度作為第1透射黃度，以藉由使用積分球之測色方法所測定的透射黃度作為第2透射黃度時，從上述顯示裝置用積層體的第1透射黃度減去上述顯示裝置用積層體的第2透射黃度所得之值為0.4以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a stacked body for a display device comprising a substrate layer; and a functional layer, wherein the functional layer includes a resin, an organic based ultraviolet absorber, and an inorganic based ultraviolet absorber, and when a transmitted yellowness measured by a colorimetry method not using an integrating sphere is regarded as a first transmitted yellowness, and a transmitted yellowness measured by a colorimetry method using an integrating sphere is regarded as a second transmitted yellowness, a value obtained by subtracting the second transmitted yellowness of the stacked body for a display device from the first transmitted yellowness of the stacked body for a display device is 0.4 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置用積層體</p>
        <p type="p">2:基材層</p>
        <p type="p">3:功能層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2463" publication-number="202631117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114948</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗微生物組合物、醫藥組合物及其用途</chinese-title>
        <english-title>ANTIMICROBIAL COMPOSITIONS, PHARMACEUTICAL COMPOSITIONS AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/167</main-classification>
        <further-classification edition="200601120260504B">A61K31/201</further-classification>
        <further-classification edition="200601120260504B">A61K31/202</further-classification>
        <further-classification edition="200601120260504B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱浩傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HAO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭崇瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, CHUNG-WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所請係一種抗微生物組合物以及相關方法。藉由其組合物中醯胺化合物及脂肪酸的協同作用，不但能以更少用量的醯胺化合物達到針對抗藥性細菌的抗菌效果，更能夠有效並快速地根除微生物的持久性細胞及生物膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are an antimicrobial composition and related methods. With the synergistic effect of amide compounds and fatty acids in the composition, not only the antibacterial effect against drug-resistant bacteria can be achieved with a smaller amount of amide compounds, but the persister cells and biofilms of microorganisms can be effectively and quickly eradicated.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2464" publication-number="202633520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及相關方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260422B">H10W90/24</main-classification>
        <further-classification edition="202601120260422B">H10W76/136</further-classification>
        <further-classification edition="202601120260422B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰古文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, GYU WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班文貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, WON BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祖亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JU HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張民華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MIN HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴東久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金進勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHIM, JIN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金傑雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余祥傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SEUNG JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾　舒恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWERS, SHAUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林基泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, GI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓炳武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, BYOUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYUNG JEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUL BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種半導體裝置可以包括基板、裝置堆疊、第一內部互連和第二內部互連以及囊封物。所述基板可以包括：彼此相對的第一基板側和第二基板側；基板外側壁，所述基板外側壁位於所述第一基板側與所述第二基板側之間；以及基板內側壁，所述基板內側壁在所述第一基板側與所述第二基板側之間限定空腔。所述裝置堆疊可以位於所述空腔中並且可以包括第一電子裝置和堆疊在所述第一電子裝置上的第二電子裝置。所述第一內部互連可以耦接到所述基板和所述裝置堆疊。所述第二內部互連可以耦接到所述第二電子裝置和所述第一電子裝置。所述囊封物可以覆蓋所述基板內側壁和所述裝置堆疊並且可以填充所述空腔。本文公開了其它實例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The second internal interconnect can be coupled to the second electronic device and the first electronic device. The encapsulant can cover the substrate inner sidewall and the device stack, and can fill the cavity. Other examples and related methods are disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:模塊</p>
        <p type="p">110:基板</p>
        <p type="p">110i:內側壁</p>
        <p type="p">110s:外側壁</p>
        <p type="p">111:空腔</p>
        <p type="p">112:內部端子</p>
        <p type="p">113:外部端子</p>
        <p type="p">120:裝置堆疊</p>
        <p type="p">121:電子裝置/第一電子裝置</p>
        <p type="p">121a:裝置端子</p>
        <p type="p">122:電子裝置/第二電子裝置</p>
        <p type="p">122a:裝置端子</p>
        <p type="p">123:電子裝置/第三電子裝置</p>
        <p type="p">123a:裝置端子</p>
        <p type="p">124:電子裝置/第四電子裝置</p>
        <p type="p">130:內部互連</p>
        <p type="p">140:囊封物</p>
        <p type="p">150:外部互連</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2465" publication-number="202632856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開關電源以及用於開關電源的功率電晶體驅動電路</chinese-title>
        <english-title>SWITCHING POWER SUPPLY AND POWER TRANSISTOR DRIVE CIRCUIT FOR SWITCHING POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">H02M1/08</main-classification>
        <further-classification edition="200701120260428B">H02M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杰華特微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　韌剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, REN GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐愛民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, AI MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思蘊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種開關電源以及用於開關電源的功率電晶體驅動電路，包括：邏輯控制模組，用於根據接收的開關控制信號生成導通控制信號和關斷控制信號；驅動模組，用於根據導通控制信號和關斷控制信號生成功率電晶體的柵驅動信號，其中柵驅動信號在功率電晶體導通過程具有與時間相關的第一斜率和第二斜率，且第一斜率大於第二斜率；電壓檢測模組，用於在功率電晶體導通時對開關節點電壓進行檢測，以得到電壓檢測信號；變斜率控制模組，用於將電壓檢測信號與參考電壓進行比較，並根據得到的比較結果調整柵驅動信號在下一開關週期的第一斜率的時間長度，從而可以在減小功率電晶體導通過程中的諧振電壓的同時不會增大功率電晶體的導通損耗，同時兼顧了高效率驅動和電路可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a switching power supply and a power transistor driving circuit for the switching power supply, comprising: a logic control module for generating a turn-on control signal and a turn-off control signal based on a received switching control signal; a driving module for generating a gate driving signal for a power transistor based on the turn-on control signal and the turn-off control signal, wherein the gate driving signal has a first slope and a second slope that are time-dependent during a conduction process of the power transistor, and the first slope is greater than the second slope; a voltage detection module for detecting a switch node voltage when the power transistor is turned on to obtain a voltage detection signal; a variable slope control module for comparing the voltage detection signal with a reference voltage, and adjusting a time length of the first slope of the gate drive signal in a next switching cycle based on a comparison result, so as to reduce a resonant voltage during the conduction process of the power transistor without increasing a conduction loss of the power transistor, while balancing high-efficiency driving and circuit reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200-1:功率電晶體驅動電路</p>
        <p type="p">210-1:位準轉換單元</p>
        <p type="p">220-1:邏輯控制模組</p>
        <p type="p">230-1:驅動模組</p>
        <p type="p">240-1:電壓檢測模組</p>
        <p type="p">250-1:變斜率控制模組</p>
        <p type="p">Cout:輸出電容</p>
        <p type="p">Fast_ctrl-1:快速導通控制信號</p>
        <p type="p">H1:開關控制信號</p>
        <p type="p">HDRV:柵驅動信號</p>
        <p type="p">HSON:開關控制信號</p>
        <p type="p">Lo:電感器</p>
        <p type="p">Q1:功率電晶體(又稱為高側電晶體)</p>
        <p type="p">Q2:功率電晶體(又稱為低側電晶體)</p>
        <p type="p">RL:負載電阻</p>
        <p type="p">RST:關斷控制信號</p>
        <p type="p">SET:導通控制信號</p>
        <p type="p">SW:開關節點</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">Vs:電壓檢測信號</p>
        <p type="p">Vsw:開關節點電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2466" publication-number="202632053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高速循環沉積之前驅物遞送系統及方法</chinese-title>
        <english-title>PRECURSOR DELIVERY SYSTEM AND METHOD FOR HIGH SPEED CYCLIC DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">C23C16/44</main-classification>
        <further-classification edition="200601120260421B">C23C16/455</further-classification>
        <further-classification edition="200601120260421B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商尤金納斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUGENUS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙林那斯　馬汀　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALINAS, MARTIN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾達那　米格雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALDANA, MIGUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡德隆　維特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALDERON, VICTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪錢德拉　庫瑪　桑托斯　納拉揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMACHANDRA KUMAR, SANTOSH NARAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示技術大體上係關於半導體製造，且更特别是關於循環沉積中之前驅物遞送。在一項態樣中，薄膜沉積系統包含薄膜沉積室，其經組態以藉由將基板交替曝露於複數種前驅物而沉積薄膜。該薄膜系統另外包含前驅物源，其藉由前驅物遞送管線連接至該薄膜沉積室，其中該前驅物遞送管線包含在該前驅物源與該薄膜沉積室外之最終閥之間的高傳導管線部分。該高傳導管線部分在流動方向上係細長的且具有於該高傳導管線部分之相對端連接之緊鄰低傳導管線部分中之任一者之至少四倍大之傳導。該薄膜系統進一步包含在該高傳導管線部分與該薄膜沉積室之間的單個最終閥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed technology relates generally to semiconductor manufacturing, and more particularly to precursor delivery in cyclic deposition. In one aspect, a thin film deposition system comprises a thin film deposition chamber configured to deposit a thin film by alternatingly exposing a substrate to a plurality of precursors. The thin film system additionally comprises a precursor source connected to the thin film deposition chamber by a precursor delivery line, wherein the precursor delivery line comprises a high conductance line portion between the precursor source and a final valve outside of the thin film deposition chamber. The high conductance line portion is elongated in a flow direction and has a conductance that is at least four times greater than either of immediately adjacent low conductance line portions connected at opposing ends of the high conductance line portion. The thin film system further comprises a single final valve between the high conductance line portion and the thin film deposition chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:薄膜沉積系統</p>
        <p type="p">102:薄膜沉積室/沉積室</p>
        <p type="p">106:前驅物遞送系統</p>
        <p type="p">108:噴嘴</p>
        <p type="p">110:第一前驅物遞送管線</p>
        <p type="p">112:氣體分配板</p>
        <p type="p">114:第二前驅物遞送管線</p>
        <p type="p">114-1:CP氣體遞送管線</p>
        <p type="p">114-2:CP氣體遞送管線</p>
        <p type="p">116:支撐件</p>
        <p type="p">118-1:RP氣體遞送管線</p>
        <p type="p">118-2:RP氣體遞送管線</p>
        <p type="p">120:第一前驅物源/前驅物源</p>
        <p type="p">122:基板</p>
        <p type="p">124:第二前驅物源/前驅物源</p>
        <p type="p">128-1:RP吹掃氣體源/吹掃氣體源</p>
        <p type="p">128-2:RP吹掃氣體源/吹掃氣體源</p>
        <p type="p">130:高傳導管線部分</p>
        <p type="p">132:質量流量控制器(MFC)</p>
        <p type="p">134:高傳導管線部分</p>
        <p type="p">134-1:CP氣體源/吹掃氣體源</p>
        <p type="p">134-2:CP氣體源/吹掃氣體源</p>
        <p type="p">136:歧管</p>
        <p type="p">138-1:高傳導管線部分</p>
        <p type="p">138-2:高傳導管線部分</p>
        <p type="p">140:第一前驅物原子層沉積(ALD)閥/ALD閥</p>
        <p type="p">144:第二前驅物原子層沉積(ALD)閥/ALD閥</p>
        <p type="p">148-1:吹掃氣體原子層沉積(ALD)閥/ALD閥/第一吹掃氣體ALD閥/第一吹掃ALD閥</p>
        <p type="p">148-2:吹掃氣體原子層沉積(ALD)閥/ALD閥/第二吹掃氣體ALD閥</p>
        <p type="p">150:多閥區塊總成</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2467" publication-number="202632437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用預離子化之光源及產生極紫外光之方法</chinese-title>
        <english-title>LIGHT SOURCE USING PRE-IONIZATION AND METHOD OF GENERATING EXTREME ULTRA-VIOLET LIGHT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260422B">G03F7/20</main-classification>
        <further-classification edition="200601120260422B">H05H1/46</further-classification>
        <further-classification edition="200601120260422B">H05H1/02</further-classification>
        <further-classification edition="200601120260422B">H01J37/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛能級科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENERGETIQ TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾　佛德瑞克　馬文　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIELL, FREDERICK MARVIN, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯曼　大衛　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REISMAN, DAVID B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡羅　丹尼爾　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCARO, DANIEL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　唐納　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, DONALD K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德列克　麥可　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODERICK, MICHAEL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種EUV光源包含界定一電漿約束區之一腔室。一磁芯係圍繞該腔室定位，且經組態以在電漿產生區中產生一電漿，使得該電漿會聚在該電漿約束區中。一電力輸送區段係圍繞該磁芯定位。一電源供應器包含一充電電路、一預離子化電路及一固態切換電路，該固態切換電路具有耦合至該磁芯之一輸出。該電源供應器經組態以將該充電電路與該電力輸送區段隔離，且透過電感耦合產生一預離子化脈衝，該預離子化脈衝引起該電漿產生區中之氣體之離子化。該固態切換電路經組態以透過電感耦合使一電容放電，以在該電漿產生區中形成一電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An EUV light source includes a chamber that defines a plasma confinement region. A magnetic core is positioned around the chamber and is configured to generate a plasma in the plasma generation region so that the plasma converges in the plasma confinement region. A power delivery section is positioned around the magnetic core. A power supply includes a charging circuit, a pre-ionization circuit, and a solid state switching circuit having an output coupled to the magnetic core. The power supply is configured to isolate the charging circuit from the power delivery section and to generate a pre-ionization pulse through inductive coupling that causes ionization of gas in the plasma generation region. The solid state switching circuit is configured to discharge a capacitance through inductive coupling to form a plasma in the plasma generation region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:紫外線光源</p>
        <p type="p">502:固態脈衝式電源供應器</p>
        <p type="p">504:電漿負載/電阻</p>
        <p type="p">506:磁芯/磁耦合芯</p>
        <p type="p">510:諧振充電電路/諧振電路</p>
        <p type="p">512:電壓供應</p>
        <p type="p">513:控制器</p>
        <p type="p">514:能量儲存電容器</p>
        <p type="p">520:電晶體開關</p>
        <p type="p">530:預離子化電路</p>
        <p type="p">532:可變負電壓電源供應器/預離子化電壓電源供應器</p>
        <p type="p">534:諧振充電開關</p>
        <p type="p">536:電感器</p>
        <p type="p">538:二極體</p>
        <p type="p">540:預離子化電容器</p>
        <p type="p">542:預離子化電感器</p>
        <p type="p">544:預離子化開關</p>
        <p type="p">545:二極體</p>
        <p type="p">550:固態切換電路</p>
        <p type="p">570:能量回收器電路</p>
        <p type="p">572:固態回收器開關</p>
        <p type="p">574:回收器電感器/回收器電感</p>
        <p type="p">575:二極體</p>
        <p type="p">576:回收器電容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2468" publication-number="202633079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260423B">H10B12/00</main-classification>
        <further-classification edition="202501120260423B">H10D30/63</further-classification>
        <further-classification edition="202501120260423B">H10D1/60</further-classification>
        <further-classification edition="202601120260423B">H10W10/17</further-classification>
        <further-classification edition="202601120260423B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉子琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體裝置及其製作方法、儲存系統；該半導體裝置包括電晶體陣列，電晶體陣列包括多個沿第一方向延伸且沿第二方向交替間隔排列的第一閘極結構和第二閘極結構，第二方向交叉於第一方向；第一閘極結構包括第一閘極線和第二閘極線，以及位於第一閘極線和第二閘極線之間的第一隔離結構；第二閘極結構包括第三閘極線和第四閘極線，以及位於第三閘極線和第四閘極線之間的第二隔離結構；其中，沿第二方向上兩相鄰第一隔離結構和第二隔離結構相對設置，且第一隔離結構與第二隔離結構均位於第一方向上的一端。本發明提高半導體裝置的良率和可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a semiconductor device and manufacturing method thereof, and a storage system. The semiconductor device includes a transistor array, and the transistor array includes a plurality of first gate structures and second gate structures that extend in a first direction and that are alternately spaced in a second direction, the second direction intersecting the first direction. The first gate structure includes a first gate line and a second gate line, as well as a first isolation structure located between the first gate line and the second gate line. The second gate structure includes a third gate line and a fourth gate line, as well as a second isolation structure located between the third gate line and the fourth gate line. Two adjacent, in the second direction, first isolation structures and second isolation structures are arranged opposite to each other, and both the first isolation structure and the second isolation structure are located at an end of the first direction. The yield and reliability of semiconductor devices are improved in this application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100，S200，S300，S400:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2469" publication-number="202632958">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援區塊合併及跳越模式之圖像編碼技術及相關裝置及方法</chinese-title>
        <english-title>PICTURE CODING SUPPORTING BLOCK MERGING AND SKIP MODE, AND RELATED APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260422B">H04N19/70</main-classification>
        <further-classification edition="201401120260422B">H04N19/103</further-classification>
        <further-classification edition="201401120260422B">H04N19/119</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜比影像壓縮有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY VIDEO COMPRESSION, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克曲后弗　辛納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRCHHOFFER, HEINER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希利　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLE, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧汀　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUDIN, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史提克曼　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEGEMANN, JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布洛斯　班加明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROSS, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種編碼效率提昇藉由使用位元流內關於合併致動以及跳越模式致動之通用信號化而被達成。亦即，在位元流內之一個或多個語法元素的可能狀態之一者可對於一圖像之目前樣本集合傳信關於各別樣本集合是將被合併並且不具有預測殘餘被編碼以及被插入該位元流。另外地，一通用旗標可通用地傳信關聯於一目前樣本集合之編碼參數是否將依據一合併候選者被設定或自該位元流被取得，並且該圖像之目前樣本集合是否僅以依照關聯於該目前樣本集合之編碼參數之一預測信號為基礎，不必任何殘餘資料，而被重建、或將利用在該位元流內之殘餘資料而藉由精練依照關聯於該目前樣本集合之該等編碼參數的預測信號而被重建。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coding efficiency increase is achieved by using a common signalization within the bitstream with regard to both activation of merging and activation of the skip mode. That is, one of the possible states of one or more syntax elements within the bitstream may signalize for a current sample set of a picture that the respective sample set is to be merged and has no prediction residual encoded and inserted into the bitstream. Alternatively speaking, a common flag may commonly signalize whether the coding parameters associated with a current sample set are to be set according to a merge candidate or to be retrieved from the bitstream, and whether the current sample set of the picture is to be reconstructed merely based on a prediction signal depending on the coding parameters associated with the current sample set, without any residual data, or to be reconstructed by refining the prediction signal depending on the coding parameters associated with the current sample set by means of residual data within the bitstream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:編碼器</p>
        <p type="p">20:圖像</p>
        <p type="p">30:位元流</p>
        <p type="p">40:區塊</p>
        <p type="p">50,60:子區塊</p>
        <p type="p">70:編碼順序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2470" publication-number="202632557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115114995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>海外直購訂單的配送管理方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR MANAGING DELIVERY OF OVERSEAS DIRECT PURCHASE ORDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260423B">G06Q10/0837</main-classification>
        <further-classification edition="202301120260423B">G06Q10/0831</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林英洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, YOUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康恩信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, YOUNG SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金承秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓加胤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, GA YOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙妍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YEON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴丹希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOM, DAN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, JUN HYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏昌訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, CHANG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種配送管理方法和系統。該方法包括如下步驟：接收使用者訂單；判斷該訂單是否是海外直購(overseas direct purchase)訂單；若該訂單是海外直購訂單，則基於針對海外直郵訂單預設的標誌（flag）來管理該訂單的配送，管理該配送的步驟包括如下步驟:管理該訂單對應的配送資訊；和若接收到該訂單的退回，則管理該訂單對應的退回資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method and system for managing a delivery. The method includes: receiving an order of a user; determining whether the order is an overseas direct purchase order; and managing a delivery for the order based on a preset flag in response to the overseas direct purchase order, when the order is the overseas direct purchase order, wherein the managing of the delivery includes: managing delivery information corresponding to the order; and managing return information corresponding to the order, when a return for the order is received.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S310、S320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2471" publication-number="202633270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在基材上形成包含金屬氮化物的層或形成臨限電壓調整層之方法、及填充在基材上的間隙之方法</chinese-title>
        <english-title>METHODS FOR FORMING A LAYER COMPRISING A METAL NITRIDE OR FORMING A THRESHOLD VOLTAGE TUNING LAYER ON A SUBSTRATE AND METHODS FOR FILLING A GAP ON A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260421B">H10P14/40</main-classification>
        <further-classification edition="202301120260421B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞雷西歐　維爾尼　吉賽佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALESSIO VERNI, GIUSEPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, REN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗卡特　堤摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANQUART, TIMOTHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希羅　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERO, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示者係用於沉積包含一金屬及氮之層的方法及系統。該等層係形成至一基材之一表面上。沉積製程可係一循環沉積製程。可在其中併入該等層之例示性結構包括場效電晶體、VNAND單元、金屬-絕緣體-金屬(MIM)結構、及DRAM電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are methods and systems for depositing layers comprising a metal and nitrogen. The layers are formed onto a surface of a substrate. The deposition process may be a cyclical deposition process. Exemplary structures in which the layers may be incorporated include field effect transistors, VNAND cells, metal-insulator-metal (MIM) structures, and DRAM capacitors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:基材定位於基材支撐件上之步驟</p>
        <p type="p">112:基材上沉積金屬氧化物</p>
        <p type="p">115:沖洗</p>
        <p type="p">116:基材暴露至含氮反應物</p>
        <p type="p">117:沖洗</p>
        <p type="p">118:終止</p>
        <p type="p">119:重複</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2472" publication-number="202631667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>末稍神經障礙或伴隨著觀察到末稍神經障礙或星狀細胞障礙之疾病的疼痛之預防或治療方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">C07K16/22</main-classification>
        <further-classification edition="200601120260429B">A61K39/395</further-classification>
        <further-classification edition="200601120260429B">A61P25/02</further-classification>
        <further-classification edition="200601120260429B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田邊製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE PHARMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田勇人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田裕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, HIROKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕倫堡　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALUMBO, JOSEPH M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">以提供新穎的末梢神經障礙之預防或治療方法及觀察到末梢神經障礙或星狀細胞障礙之疾病所導致的疼痛症狀之預防或治療方法為課題。本發明提供含有RGM阻礙物質的末梢神經障礙或觀察到末梢神經障礙或星狀細胞障礙之疾病所導致的疼痛症狀之預防或治療劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2473" publication-number="202632651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260424B">G11C7/10</main-classification>
        <further-classification edition="200601120260424B">G11C8/18</further-classification>
        <further-classification edition="200601120260424B">G11C11/34</further-classification>
        <further-classification edition="200601120260424B">G11C5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧野晋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUNO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長坂繁輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAKA, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小內俊之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUCHI, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據實施形態，本發明之半導體裝置具備記憶電路、第1 FIFO、第2 FIFO、及輸入輸出電路。上述記憶電路輸出資料。上述第1 FIFO自上述記憶電路接收資料，與第1時脈信號同步地輸出資料。上述第2 FIFO接收自上述第1 FIFO輸出之資料，與上述第1時脈信號同步地輸出資料。上述輸入輸出電路輸出自上述第2 FIFO輸出之資料。上述第2 FIFO較第1 FIFO更接近上述輸入輸出電路而配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:核心電路</p>
        <p type="p">11:記憶電路</p>
        <p type="p">12:緩衝電路</p>
        <p type="p">20:第1 FIFO</p>
        <p type="p">30-0~30-7:第2 FIFO</p>
        <p type="p">40-0~40-7:輸入輸出焊墊</p>
        <p type="p">40-8~40-n:焊墊</p>
        <p type="p">100:半導體裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2474" publication-number="202631572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>３－棕櫚醯基－醯胺基－１，２－丙二醇與３－棕櫚醯基－醯胺基－２－羥基－１－二甲氧基三苯基甲基醚－丙烷的結晶固體及其製造與使用之方法</chinese-title>
        <english-title>CRYSTALLINE SOLIDS OF 3-PALMITOYL-AMIDO-1,2-PROPANEDIOL AND 3-PALMITOYL-AMIDO-2-HYDROXY-1-DIMETHOXYTRIPHENYLMETHYLETHER-PROPANE AND METHODS OF MAKING AND USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07C233/18</main-classification>
        <further-classification edition="200601120260504B">B01D9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商傑龍公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾巴尼澤　沃克　珍妮佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBANEZE-WALKER, JENNIFER ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露方面包括3-棕櫚醯基-醯胺基-1,2-丙二醇與3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷的結晶固體。亦提供製備3-棕櫚醯基-醯胺基-1,2-丙二醇的結晶固體與3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷的單晶之方法。亦描述由3-棕櫚醯基-醯胺基-1,2-丙二醇的結晶固體製備3-棕櫚醯基-醯胺基-2-羥基-1-二甲氧基三苯基甲基醚-丙烷之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure include crystalline solids of 3-palmitoyl-amido-1,2- propanediol and 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane. Methods for preparing the crystalline solids of 3-palmitoyl-amido-1,2- propanediol and single crystals of 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane are also provided. Methods for preparing a 3-palmitoyl-amido-2-hydroxy-1-dimethoxytriphenylmethylether-propane from a crystalline solid of 3-palmitoyl-amido-1,2- propanediol are also described.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2475" publication-number="202632064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成碳化矽薄膜的方法</chinese-title>
        <english-title>METHOD FOR FORMING SIC THIN FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">C23C16/513</main-classification>
        <further-classification edition="200601120260427B">C23C16/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商周星工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃喆周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, CHUL-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所提供的是碳化矽(SiC)基板製造方法。碳化矽基板製造方法包含準備基底、在基底上形成N型碳化矽薄膜或P型碳化矽薄膜中任一碳化矽薄膜以及將碳化矽薄膜自基底分離。碳化矽薄膜的形成包含將含矽的來源氣體噴射至基底上、在來源氣體的噴射停止後進行噴射吹除氣體的主吹除，在主吹除的停止後噴射含碳的反應氣體以及在反應氣體的噴射停止後進行噴射吹除氣體的次吹除。因此，根據示例性實施例，可在低溫沉積碳化矽薄膜以準備碳化矽基板。因此，可減少用於提升形成碳化矽薄膜的基底之溫度所需的時間或電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method for manufacturing an SiC substrate. The method for manufacturing the SiC substrate includes preparing a base, forming any one SiC thin film of an n-type SiC thin film or a p-type SiC thin film on the base, and separating the SiC thin film from the base. The forming of the SiC thin film includes injecting a source gas containing silicon (Si) onto the base, performing primary purge of injecting a purge gas after the injection of the source gas is stopped, injecting a reactant gas containing carbon (C) after the stop of the primary purge, and performing secondary purge of injecting the purge gas after the injection of the reactant gas is stopped. Therefore, in accordance with an exemplary embodiment, the SiC thin film may be deposited at a low temperature to prepare the SiC substrate. Accordingly, power or time required for rising the temperature of the base to form the SiC thin film may be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">B:基底</p>
        <p type="p">10:碳化矽薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2476" publication-number="202632388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G02F1/015</main-classification>
        <further-classification edition="200601120260423B">G02F1/061</further-classification>
        <further-classification edition="200601120260423B">G09G3/12</further-classification>
        <further-classification edition="202501120260423B">H10F55/155</further-classification>
        <further-classification edition="202301120260423B">H10K10/84</further-classification>
        <further-classification edition="202601120260423B">H10K19/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫英訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YOUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金美笑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MI-SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明提供一種顯示設備包含包含多個像素區域的基板，每個像素區域具有多個子像素區域；設置於每個子像素區域中以形成多個子像素的第一發光裝置；用以運作第一發光裝置的第一電晶體；設置於這些子像素區域的子像素區域之間的第二發光裝置；以及設置於這些子像素區域的子像素區域之間並且用以運作第二發光裝置的第二電晶體。設置於多個子像素區域之間的堤部層以及設置於堤部層之上的第二發光裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus according to the present disclosure comprises a substrate including a plurality of pixel regions, each pixel region having a plurality of sub-pixel regions; a first light emitting device disposed in each sub-pixel region to form a plurality of sub-pixels; a first transistor configured to operate the first light emitting device; a second light emitting device disposed between sub-pixel regions of the plurality of sub-pixel regions; and a second transistor disposed between sub-pixel regions of the plurality of sub-pixel regions and configured to operate the second light emitting device. A bank layer is disposed between the plurality of sub-pixel regions and the second light emitting device is disposed over the bank layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示設備</p>
        <p type="p">112:半導體層</p>
        <p type="p">112a:通道區域</p>
        <p type="p">112b:源極區域</p>
        <p type="p">112c:汲極區域</p>
        <p type="p">113:閘極電極</p>
        <p type="p">115:源極電極</p>
        <p type="p">116:汲極電極</p>
        <p type="p">132:第一電極</p>
        <p type="p">134:第一發光層</p>
        <p type="p">136:第二電極</p>
        <p type="p">137:第三電極</p>
        <p type="p">138:第二發光層</p>
        <p type="p">139:第四電極</p>
        <p type="p">140:基板</p>
        <p type="p">142:緩衝層</p>
        <p type="p">144:閘極絕緣層</p>
        <p type="p">146:層間絕緣層</p>
        <p type="p">148:平坦化層</p>
        <p type="p">162:半導體層</p>
        <p type="p">162a:通道區域</p>
        <p type="p">162b:源極區域</p>
        <p type="p">162c:汲極區域</p>
        <p type="p">163:閘極電極</p>
        <p type="p">165:源極電極</p>
        <p type="p">166:汲極電極</p>
        <p type="p">172:第一圖案</p>
        <p type="p">174:第二圖案</p>
        <p type="p">180:封裝層</p>
        <p type="p">182:第一封裝層</p>
        <p type="p">184:第二封裝層</p>
        <p type="p">186:第三封裝層</p>
        <p type="p">BANK:堤部層</p>
        <p type="p">D1:發光裝置</p>
        <p type="p">D2:發光裝置</p>
        <p type="p">H1:第一接觸孔</p>
        <p type="p">H2:第二接觸孔</p>
        <p type="p">SP:子像素</p>
        <p type="p">SPa:輔助子像素</p>
        <p type="p">T1:薄膜電晶體</p>
        <p type="p">T2:薄膜電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2477" publication-number="202632314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115159</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於飛行時間的三維感測系統及用於對物件執行三維量測的方法</chinese-title>
        <english-title>TIME OF FLIGHT-BASED THREE-DIMENSIONAL SENSING SYSTEM AND METHOD FOR PERFORMING THREE-DIMENSIONAL MEASUREMENT OF OBJECT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G01S17/42</main-classification>
        <further-classification edition="200601120260423B">G01S7/481</further-classification>
        <further-classification edition="202001120260423B">G01S17/894</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商菲爾薇解析公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIAVI SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅蘭德斯　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROWLANDS, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾格　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BILGER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浩克　威廉　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOUCK, WILLIAM D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種光塑形光學元件，其可包括基板。該光塑形光學元件可包括安置在該基板上的結構，其中該結構經建構以接收具有均勻強度場且小於一臨限總強度的一或多個輸入光束，且其中該結構經建構以對該一或多個輸入光束進行塑形以形成具有不均勻強度場且小於該臨限總強度的一或多個輸出光束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light shaping optic may include a substrate. The light shaping optic may include a structure disposed on the substrate, wherein the structure is configured to receive one or more input beams of light with a uniform intensity field and less than a threshold total intensity, and wherein the structure is configured to shape the one or more input beams of light to form one or more output beams of light with a non-uniform intensity field and less than the threshold total intensity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:實施方案</p>
        <p type="p">105:感測器系統</p>
        <p type="p">110:傳輸器系統</p>
        <p type="p">115:光學傳輸器</p>
        <p type="p">120:光塑形光學元件</p>
        <p type="p">125:接收器系統</p>
        <p type="p">130:光學接收器</p>
        <p type="p">135:濾光器</p>
        <p type="p">140:透鏡</p>
        <p type="p">145:元件符號</p>
        <p type="p">150:物件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2478" publication-number="202632144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沉水泵</chinese-title>
        <english-title>SUBMERGED PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260421B">F04D13/08</main-classification>
        <further-classification edition="200601120260421B">F17C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日機裝股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKKISO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>釘﨑直道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUGIZAKI, NAOMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可去除殘留於馬達室之液化氣體的沉水泵。  &lt;br/&gt;本發明之沉水泵1具有框體2，該框體2容納旋轉軸4及葉輪6。框體具備：馬達室21；泵室20；凹部24，其配置於馬達室；第1流路23、52、7，其配置於比馬達3更靠下方向的位置，與馬達室及泵室連通；第2流路25，其配置於比馬達更靠上方向的位置，與馬達室及框體的外部空間S連通；及第3流路26，其與凹部及外部空間連通。第3流路在凹部的內表面之中配置於最靠下方向的部分24a開口。第3流路的流量小於第2流路的流量。在沉水泵吐出處理液時，從葉輪所吐出之處理液的一部分通過第1流路，從泵室被導入馬達室。被導入至馬達室之處理液通過馬達及第2流路、以及第3流路，從馬達室被導出至外部空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a submerged pump capable of removing liquefied gas remaining in a motor chamber. &lt;br/&gt; The submerged pump 1 according to the present invention includes a housing 2 that accommodates a rotary shaft 4 and an impeller 6. The housing includes a motor chamber 21, a pump chamber 20, a recess 24 disposed in the motor chamber, a first flow passage 23, 52, 7 disposed below a motor 3 and communicating with the motor chamber and the pump chamber, a second flow passage 25 disposed above the motor and communicating with the motor chamber and the external space S of the housing, and a third flow passage 26 communicating between the recess and the external space. A third flow passage opens to a portion 24a of an inner surface of the recess that is located at the lowest position. When the submerged pump is discharging pumped liquid, a portion of the pumped liquid discharged from the impeller passes through the first flow passage from the motor chamber and is introduced into the pump chamber. The pumped liquid introduced into the motor chamber passes through the motor, the second flow passage, and the third flow passage, and is discharged from the motor chamber to the external space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:沉水泵</p>
        <p type="p">2a:周壁部</p>
        <p type="p">2d:分隔壁部(分隔壁)</p>
        <p type="p">2e:上表面</p>
        <p type="p">2f:保持孔</p>
        <p type="p">2g:外周面</p>
        <p type="p">20:泵室</p>
        <p type="p">21:馬達室</p>
        <p type="p">23:軸承座(第1流路)</p>
        <p type="p">23a:上部</p>
        <p type="p">23b:下部</p>
        <p type="p">24:凹部</p>
        <p type="p">24a:底面(部分)</p>
        <p type="p">26:排水孔(第3流路)</p>
        <p type="p">26a:第1排水孔</p>
        <p type="p">26b:第2排水孔</p>
        <p type="p">26c:開口</p>
        <p type="p">26d:開口</p>
        <p type="p">27:孔口構件</p>
        <p type="p">27a:節流孔(連通路徑)</p>
        <p type="p">52:軸承(第1流路)</p>
        <p type="p">7:推力平衡機構(第1流路)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2479" publication-number="202632842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線電能傳輸線圈、線圈組件和電子設備</chinese-title>
        <english-title>WIRELESS POWER TRANSMISSION COIL, COIL ASSEMBLY AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260421B">H02J50/20</main-classification>
        <further-classification edition="200601120260421B">H01F27/32</further-classification>
        <further-classification edition="200601120260421B">H01F38/14</further-classification>
        <further-classification edition="200601120260421B">H01Q1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昆山聯滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANTO ELECTRONIC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁榜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, BANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金列峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LIEFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例揭示一種無線電能傳輸線圈、線圈組件和電子設備，透過將連續繞製的無線電能傳輸線圈劃分出沿周向設置的第一區段和第二區段，在第一區段和第二區段透過不同的繞製方式，使得第一區段具有第一最大厚度，第二區段具有第二最大厚度，第一區段從外緣到內緣具有第一寬度，第二區段從外緣到內緣具有第二寬度，第二最大厚度大於第一最大厚度且第二寬度小於第一寬度，由此可以對無線電能傳輸線圈的尺寸進行調整以適應電子設備中的空間形狀，並且可以保證不會過多地縮小無線電能傳輸線圈的面積，從而保證無線充電的充電效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a wireless power transmission coil, a coil assembly and an electronic device. By dividing the continuously wound wireless power transmission coil into a first section and a second section that are arranged along a circumferential direction. Different winding method are used in the first section and the second section. So the first section has a first maximum thickness. The second section has a second maximum thickness. The first section has a first width from the outer edge to the inner edge. The second section has a second width from the outer edge to the inner edge. The second maximum thickness is greater than the first maximum thickness and the second width is less than the first width. In this way, the size of the wireless power transmission coil is adjusted to fit the shape of the space in the electronic device, and the area of the wireless power transmission coil is not reduced too much, so the charging efficiency of wireless charging is ensured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無線電能傳輸線圈</p>
        <p type="p">11:第一區段</p>
        <p type="p">12:第二區段</p>
        <p type="p">13:第一過渡區</p>
        <p type="p">14:第二過渡區</p>
        <p type="p">w1:第一寬度</p>
        <p type="p">w2:第二寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2480" publication-number="202631136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>１，３－取代的環丁基衍生物及其用途</chinese-title>
        <english-title>1,3-SUBSTITUTED CYCLOBUTYL DERIVATIVES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K31/472</main-classification>
        <further-classification edition="200601120260504B">A61K47/04</further-classification>
        <further-classification edition="200601120260504B">A61K47/40</further-classification>
        <further-classification edition="200601120260504B">A61K47/26</further-classification>
        <further-classification edition="200601120260504B">A61K47/12</further-classification>
        <further-classification edition="200601120260504B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商博士倫愛爾蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUSCH + LOMB IRELAND LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　東雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONGLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶沃斯　詹姆斯　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERS, JAMES J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕皮倫　朱利恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPILLON, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普柯特　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEUKERT, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了可用於治療由TRPV1受體介導的疾病或障礙的化合物和藥物組成物。本發明還提供了藉由向有需要的受試者投與治療有效量的本文所述之式 (I) 之化合物或藥物組成物來治療眼部疾病或障礙之方法。  &lt;br/&gt;&lt;img align="absmiddle" height="282px" width="342px" file="ed10687.JPG" alt="ed10687.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds and pharmaceutical compositions useful for treating diseases or disorders mediated by the TRPV1 receptor. The present invention also provides methods for treating ocular diseases or disorders by administering to a subject in need thereof a therapeutically effective amount of a compound of Formula (I) or a pharmaceutical composition described herein. &lt;br/&gt;&lt;img align="absmiddle" height="308px" width="368px" file="ed10688.JPG" alt="ed10688.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2481" publication-number="202632352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統</chinese-title>
        <english-title>OPTICAL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260423B">G02B6/27</main-classification>
        <further-classification edition="200601120260423B">G02B6/34</further-classification>
        <further-classification edition="200601120260423B">G02B27/14</further-classification>
        <further-classification edition="200601120260423B">G02B27/18</further-classification>
        <further-classification edition="200601120260423B">G02B6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切里基　羅寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRIKI, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾森菲爾德　齊翁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EISENFELD, TSION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙爾林　埃拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARLIN, ELAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學系統，包括：光導光學元件（light-guide optical element，LOE），其由透明材料形成，並且具有相互平行的第一主外表面和第二主外表面，以用於通過內反射引導光；投影儀，其被配置成從孔徑投射與準直圖像對應的光，光以限定投影儀的光軸的主光線並且以圍繞主光線的角場離開孔徑；耦入裝置，其與投影儀並且與LOE相關聯，以用於將來自投影儀的光在耦入區域處耦合至LOE中，使得光在主外表面處發生內反射，耦入裝置包括反射偏振分束器和相位板，其被部署成使得：對於角場的至少一部分，在LOE內傳播的光具有偏振的空間不均勻性；耦出裝置，其與LOE相關聯，以用於朝向觀察者重定向在LOE內傳播的光，耦出裝置對偏振敏感；以及輸出均勻化元件，其與LOE相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical system includes: a light-guide optical element (LOE) formed from transparent material and having mutually-parallel first and second major external surfaces for guiding light by internal reflection; a projector configured to project light corresponding to a collimated image from an aperture, the light exiting said aperture with a chief ray defining an optical axis of said projector and with an angular field about the chief ray; a coupling-in arrangement associated with said projector and with said LOE for coupling said light from said projector into said LOE at a coupling-in region so that the light undergoes internal reflection at said major external surfaces, said coupling-in arrangement including a reflective polarizing beam splitter and a phase plate deployed such that, for at least one part of said angular field, the light propagating within said LOE has spatial non-uniformity of polarization; a coupling-out arrangement associated with said LOE for redirecting the light propagating within said LOE towards a viewer, said coupling-out arrangement being polarization-sensitive; and an output-homogenizing element associated with said LOE.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光導光學元件(LOE)</p>
        <p type="p">11:第一主外表面</p>
        <p type="p">12:第二主外表面</p>
        <p type="p">13:表面</p>
        <p type="p">20:反射鏡</p>
        <p type="p">30:耦合稜鏡</p>
        <p type="p">40:眼睛</p>
        <p type="p">100:投影儀</p>
        <p type="p">101:孔徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2482" publication-number="202631213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115386</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>中空柱塞桿之製造製程</chinese-title>
        <english-title>MANUFACTURING PROCESS FOR HOLLOW PLUNGER ROD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">A61M5/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬克爾斯坦　艾米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINKELSTEIN, EMIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENSEN, JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造藥物遞送裝置的柱塞之方法，包括形成柱塞本體。該方法包括將該柱塞本體裝載到模製系統的第一模製工具的空腔中。該空腔至少部分地由第一模製部分和第二模製部分限定。該方法包括：將第二模製工具聯接至該第一模製工具以形成由該第一和第二模製工具中的凹槽限定的多個通道；以及向該多個通道中注入熔融塑膠以形成經包覆模製的柱塞本體。該經包覆模製的柱塞本體包括聯接至該柱塞本體的第一端的頭和聯接至該柱塞本體的第二端的腳。該腳至少部分地聯接至該內壁，並且該頭聯接至該柱塞本體的外壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a plunger of a drug delivery device includes forming a plunger body. The method includes loading the plunger body into a cavity of a first molding tool of a molding system. The cavity is at least partially defined by a first molding portion and a second molding portion. The method includes coupling a second molding tool to the first molding tool to form a plurality of channels defined by grooves in the first and second molding tools, and injecting molten plastic into the plurality of channels to form an overmolded plunger body. The overmolded plunger body includes a head coupled to the first end of the plunger body and a foot coupled to the second end of the plunger body. The foot is at least partially coupled to the inner wall and the head is coupled to the outer wall of the plunger body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">26:柱塞</p>
        <p type="p">39:環形壁/軸向壁</p>
        <p type="p">41:外表面</p>
        <p type="p">45:頂部環/頭部分/頭/頭部件</p>
        <p type="p">46:柱塞本體/中空桿</p>
        <p type="p">47:基部/腳部分/腳/腳部件</p>
        <p type="p">48:凸起</p>
        <p type="p">49:凸輪表面</p>
        <p type="p">63:近端</p>
        <p type="p">45A:套環</p>
        <p type="p">47A:遠側倒角部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2483" publication-number="202632364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115393</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統與相機模組</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM AND CAMERA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260423B">G02B7/04</main-classification>
        <further-classification edition="200601120260423B">G02B3/14</further-classification>
        <further-classification edition="202101120260423B">G03B13/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭有鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括固定焦距透鏡組及可變焦距透鏡組，所述固定焦距透鏡組及所述可變焦距透鏡組自物體側以此次序設置，其中固定焦距透鏡組包括第一透鏡、第二透鏡及第三透鏡，第一透鏡、第二透鏡及第三透鏡自物體側以此次序設置，其中第一透鏡具有正的折射力，且其中第二透鏡具有負的折射力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a fixed-focus lens group and a variable-focus lens group disposed in this order from an object side, wherein the fixed-focus lens group includes a first lens, a second lens, and a third lens disposed in this order from an object side, wherein the first lens has positive refractive power, and wherein the second lens has negative refractive power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">FLG:固定焦距透鏡組</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">P:稜鏡</p>
        <p type="p">VL:液體透鏡</p>
        <p type="p">VLG:可變焦距透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2484" publication-number="202631422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童約束系統及衝擊護體</chinese-title>
        <english-title>CHILD RESTRAINT SYSTEM AND IMPACT SHIELD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B60R22/26</main-classification>
        <further-classification edition="200601120260427B">B60N2/28</further-classification>
        <further-classification edition="200601120260427B">B60R22/10</further-classification>
        <further-classification edition="200601120260427B">B60N2/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種兒童約束系統，該兒童約束系統包括：座椅本體，其包括分別位於兩側的兩個側翼，每側的側翼設置有至少兩個第一定位部件；和衝擊護體，其包括護體本體和連接至護體本體的至少一個帶，其中至少一個帶選擇性地與至少兩個第一定位部件中的一者聯接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a child restraint system. The child restraint system includes: a seat body including two side wings on two sides respectively, wherein the side wing on each side is provided with at least two first positioning parts; and an impact shield including a shield body and at least one belt connected to the shield body, wherein the at least one belt is selectively coupled to one of the at least two first positioning parts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">1000:兒童約束系統</p>
        <p type="p">11:座位部</p>
        <p type="p">12:背靠部</p>
        <p type="p">13:側翼</p>
        <p type="p">131:第一部分</p>
        <p type="p">132:第二部分</p>
        <p type="p">13A:左側側翼</p>
        <p type="p">13B:右側側翼</p>
        <p type="p">14:第一定位部件</p>
        <p type="p">140:凹部</p>
        <p type="p">141:連接銷</p>
        <p type="p">15:頭枕</p>
        <p type="p">2:衝擊護體</p>
        <p type="p">21:護體本體</p>
        <p type="p">22:帶</p>
        <p type="p">221:第一端</p>
        <p type="p">222:第二端</p>
        <p type="p">22A:左側帶</p>
        <p type="p">23:第二定位部件</p>
        <p type="p">3:底座</p>
        <p type="p">30:基座部</p>
        <p type="p">31:閂鎖或錨固機構、ISOFIX插接件</p>
        <p type="p">32:支撐腿</p>
        <p type="p">51:車輛座椅底座</p>
        <p type="p">52:靠背</p>
        <p type="p">53:插接口</p>
        <p type="p">F、B、R、L:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2485" publication-number="202632200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒸氣腔用之本體片材、蒸氣腔及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">F28D15/02</main-classification>
        <further-classification edition="202601120260427B">H10W40/40</further-classification>
        <further-classification edition="202601120260427B">H10W40/73</further-classification>
        <further-classification edition="200601120260427B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田利彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田和範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山木誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木浦伸哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIURA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之蒸氣腔用之本體片材包含沿著第1方向延伸之第1岸台部、沿著與第1方向不同之第2方向延伸之第2岸台部、及第1岸台部與第2岸台部相交之處之岸台交點部。位於第1岸台部之第1主流槽與位於第2岸台部之第2主流槽於岸台交點部相互連通。第1空間分割部相對於第2方向位於第2岸台部之兩側。於第2岸台部之第2本體面，存在有將位於兩側之第1空間分割部連接之第2岸台凹部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">33X:第1岸台部</p>
        <p type="p">33Y:第2岸台部</p>
        <p type="p">37:岸台交點部</p>
        <p type="p">38X:第1岸台凹部</p>
        <p type="p">38Y:第2岸台凹部</p>
        <p type="p">52:第2蒸氣通路</p>
        <p type="p">55:通路分割部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2486" publication-number="202631690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>特定性增強雙專一性抗體（ＳＥＢＡ）、其生產方法及用途</chinese-title>
        <english-title>SPECIFICITY ENCHANCED BISPECIFIC ANTIBODY (SEBA) , METHOD OF PRODUCING THE SAME, AND USE OF THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">C07K16/28</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N15/63</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">C12P21/08</further-classification>
        <further-classification edition="200601120260504B">A61K39/395</further-classification>
        <further-classification edition="201701120260504B">A61K47/68</further-classification>
        <further-classification edition="200601120260504B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西雅圖免疫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSTIMMUNE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商成都百利多特生物藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILI-BIO (CHENGDU) PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧雷特　丹尼斯Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOULET, DENNIS R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈利利　賈汗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHALILI, JAHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　雅絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAK, NGA SZE AMANDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種對一人上皮生長因子受體(EGFR)具有一結合專一性之雙專一性四價抗體，自N端至C端包含對人EGFR具有一第一結合專一性之一Fab區，其中該Fab區包含一可變區，該可變區具有與本文揭示之序列具有至少90%序列一致性之一胺基酸序列；一Fc域，及對HER3具有一第二結合專一性之一scFv域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bispecific tetravalent antibody having a binding specificity to a human epithelium growth factor receptor (EGFR), comprising, from N terminus to C terminus, a Fab region having a first binding specificity to human EGFR, wherein the Fab region comprises a variable region having an amino acid sequence having at least 90% of sequence identity to the sequences as disclosed herein; a Fc domain, and a scFv domain having a second binding specificity to HER3.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2487" publication-number="202632188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燃燒器用耐火物、無機纖維壓縮成型體、蓄熱式燃燒器、及工業爐</chinese-title>
        <english-title>REFRACTORY FOR BURNERS, INORGANIC-FIBER COMPRESSION-MOLDED BODIES, REGENERATIVE BURNER, AND INDUSTRIAL OVEN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">F23M5/02</main-classification>
        <further-classification edition="200601120260427B">F27D1/00</further-classification>
        <further-classification edition="200601120260427B">F27D1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商馬福特克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAFTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外爐工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI RO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦雄作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATA, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木光雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MITSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林友幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河本祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種安裝於大型殼體之具備複數個孔之燃燒器用耐火物。  &lt;br/&gt;燃燒器用耐火物之特徵在於具備複數個貫通孔，且各個貫通孔係由複數個無機纖維壓縮成型體形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a refractory for burners which is provided with plural holes and is to be attached to a large-sized casing. The refractory for burners is provided with plural through holes each formed of plural inorganic-fiber compression-molded bodies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:無機纖維壓縮成型體</p>
        <p type="p">12:固定桿(附固定部之桿)</p>
        <p type="p">16:塊體固定金屬件</p>
        <p type="p">20a,20b,20c:貫通孔</p>
        <p type="p">22:缺口構造</p>
        <p type="p">100:燃燒器用耐火物</p>
        <p type="p">Y1:方向</p>
        <p type="p">Z3:部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2488" publication-number="202632201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">F28D15/02</main-classification>
        <further-classification edition="200601120260504B">F28D3/02</further-classification>
        <further-classification edition="200601120260504B">H05K7/20</further-classification>
        <further-classification edition="202601120260504B">H10W40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內村泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIMURA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣義勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGAGAKI, YOSHIKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種散熱裝置（heat sink），其底座部之均熱化優異，又，導熱構件之配置自由度優異，且可將散熱鰭片設計為最佳厚度。  &lt;br/&gt;散熱裝置具備：底座部，其具有第1面及與上述第1面相向之第2面，且發熱體熱連接於上述第2面；以及散熱鰭片，其豎立設置於上述底座部之上述第1面，上述散熱裝置係上述底座部與上述散熱鰭片為獨立體之散熱裝置，於上述散熱裝置中埋設有導熱構件之至少一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱裝置</p>
        <p type="p">10:散熱鰭片</p>
        <p type="p">11:散熱鰭片群</p>
        <p type="p">12:主表面</p>
        <p type="p">13:側面</p>
        <p type="p">14:邊界部</p>
        <p type="p">20:底座部</p>
        <p type="p">21:第1面</p>
        <p type="p">22:第2面</p>
        <p type="p">100:發熱體</p>
        <p type="p">L1:第1方向</p>
        <p type="p">L2:第2方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2489" publication-number="202632396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可折疊顯示裝置之可撓性多層覆蓋透鏡堆疊</chinese-title>
        <english-title>FLEXIBLE MULTI-LAYERED COVER LENS STACKS FOR FOLDABLE DISPLAYS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G02F1/1333</main-classification>
        <further-classification edition="201501120260427B">G02B1/11</further-classification>
        <further-classification edition="201501120260427B">G02B1/14</further-classification>
        <further-classification edition="201501120260427B">G02B1/18</further-classification>
        <further-classification edition="200601120260427B">G02B13/00</further-classification>
        <further-classification edition="202301120260427B">H10K50/858</further-classification>
        <further-classification edition="202301120260427B">H10K59/00</further-classification>
        <further-classification edition="202301120260427B">H10K77/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索哈吉　馬尼萬南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOTHADRI, MANIVANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友　哈維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, HARVEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾密達　海琳達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMINANDA, HELINDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙利遜　奈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORRISON, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛斯特　丹尼爾保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORSTER, DANIEL PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查達　阿文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHADHA, ARVINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例涉及可撓性或可折疊的顯示設備，且更特別地關於可撓性覆蓋透鏡組件。在一個或多個實施例中，可撓性覆蓋透鏡組件包括：玻璃層、配置在玻璃層上的衝擊吸收層、配置在衝擊吸收層上的防潮層、配置在防潮層上的基板、具有介於約0.4 GPa至約1.5 GPa之奈米壓痕硬度且配置在基板上的濕硬塗層、配置在濕硬塗層上的黏性促進層、配置在黏性促進層上的抗反射層、具有介於約1GPa至約5GPa之奈米壓痕硬度且配置在抗反射層上的乾硬塗層，以及配置在乾硬塗層上的抗指紋塗層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described and discussed herein generally relate to flexible or foldable display devices, and more specifically to flexible cover lens assemblies. In one or more embodiments, a flexible cover lens assembly contains a glass layer, an impact absorption layer disposed on the glass layer, a moisture barrier layer disposed on the impact absorption layer, a substrate disposed on the moisture barrier layer, a wet hardcoat layer having a nano-indentation hardness in a range from about 0.4 GPa to about 1.5 GPa and disposed on the substrate, an adhesion promotion layer disposed on the wet hardcoat layer, an anti-reflectance layer disposed on the adhesion promotion layer, a dry hardcoat layer having a nano-indentation hardness in a range from about 1 GPa to about 5 GPa and disposed on the anti-reflectance layer, and an anti-fingerprint coating layer disposed on the dry hardcoat layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">102:可撓性覆蓋透鏡組件</p>
        <p type="p">104:可撓性顯示堆疊</p>
        <p type="p">110:玻璃層</p>
        <p type="p">120:衝擊吸收層</p>
        <p type="p">130:防潮層</p>
        <p type="p">140:基板</p>
        <p type="p">150:濕硬塗層</p>
        <p type="p">160:黏性促進層</p>
        <p type="p">170:抗反射層</p>
        <p type="p">180:乾硬塗層</p>
        <p type="p">190:抗指紋塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2490" publication-number="202631363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂成形裝置及樹脂成形品的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B29C43/32</main-classification>
        <further-classification edition="200601120260427B">B29C43/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井隼人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, HAYATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田直毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKADA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中尾聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明獲得一種樹脂成形裝置，其能夠以簡單的結構實現可動台板的升降。樹脂成形裝置包括：主體框（20），具有支架（25）；可動台板（31），被主體框（20）支撐；第一滾珠螺桿（11），具有第一齒輪（G1）；第二滾珠螺桿（12），具有第二齒輪（G2）；伺服馬達單元（15），具有驅動構件（18），驅動構件（18）與第一齒輪（G1）及第二齒輪（G2）連結，藉由驅動第一滾珠螺桿（11）及第二滾珠螺桿（12）使可動台板（31）升降；保持構件（40），被支架（25）支撐，並對伺服馬達單元（15）進行保持，藉由相對於支架（25）相對移動，使驅動構件（18）相對於第一齒輪（G1）及第二齒輪（G2）的位置關係發生變化；以及位置調節機構（45A），對保持構件（40）相對於支架（25）的相對位置進行調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:合模機構</p>
        <p type="p">11:滾珠螺桿(第一滾珠螺桿)</p>
        <p type="p">12:滾珠螺桿(第二滾珠螺桿)</p>
        <p type="p">15:伺服馬達單元</p>
        <p type="p">16:馬達主體</p>
        <p type="p">17:驅動齒輪</p>
        <p type="p">18:驅動構件</p>
        <p type="p">20:主體框</p>
        <p type="p">21、22:側壁構件</p>
        <p type="p">23:基座</p>
        <p type="p">23S:安裝面</p>
        <p type="p">24:基底部</p>
        <p type="p">25:支架</p>
        <p type="p">40:保持構件</p>
        <p type="p">45A、45B:位置調節機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2491" publication-number="202632655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G11C11/40</main-classification>
        <further-classification edition="200601120260427B">G11C7/22</further-classification>
        <further-classification edition="200601120260427B">G11C7/12</further-classification>
        <further-classification edition="200601120260427B">G11C8/08</further-classification>
        <further-classification edition="202301120260427B">H10B43/35</further-classification>
        <further-classification edition="202501120260427B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前嶋洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEJIMA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本寿文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, TOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木良尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YOSHINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯部克明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可高速動作之記憶裝置。  &lt;br/&gt;一實施形態之記憶裝置包含位元線、源極線、位元線與源極線之間之第1胞電晶體、第1胞電晶體與位元線之間之第2胞電晶體、第1胞電晶體與源極線之間之第3胞電晶體、與第1胞電晶體之閘極連接之第1字元線、與第2胞電晶體之閘極連接之第2字元線、及與第3胞電晶體之閘極連接之第3字元線。遍歷第1期間對源極線施加第1電壓。於第1期間內之第1時刻，對第2字元線及第3字元線之至少一者施加第1、第2、及第3胞電晶體之閾值電壓以上之第2電壓。於第1期間內較第1時刻晚之第2時刻，對第1字元線施加第1、第2、及第3胞電晶體之閾值電壓以上之第3電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BL:位元線</p>
        <p type="p">H:位準</p>
        <p type="p">L:位準</p>
        <p type="p">Nvread1,Nvread2:配線</p>
        <p type="p">SGDL:選擇閘極線</p>
        <p type="p">SGSL:選擇閘極線</p>
        <p type="p">SL:源極線</p>
        <p type="p">t1~t5:時刻</p>
        <p type="p">t7~t10:時刻</p>
        <p type="p">V1,V5:讀出電壓</p>
        <p type="p">VBL:電位</p>
        <p type="p">VGEN1,VGEN2:啟動信號</p>
        <p type="p">VREAD:電壓</p>
        <p type="p">VSG:電壓</p>
        <p type="p">VSS:接地電壓</p>
        <p type="p">WLa,WLb,WLc:字元線</p>
        <p type="p">WLsel:選擇字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2492" publication-number="202632787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">H01R11/11</main-classification>
        <further-classification edition="200601120260427B">H01R13/40</further-classification>
        <further-classification edition="200601120260427B">H01R13/648</further-classification>
        <further-classification edition="201101120260427B">H01R12/70</further-classification>
        <further-classification edition="201101120260427B">H01R24/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹佳棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, JIAQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程恒山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HENGSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括本體以及第一端子模組。前述本體包括主體部以及延伸板，前述主體部設有第一安裝槽。前述第一端子模組包括第一端子組件。前述第一端子組件包括第一絕緣塊以及設於前述第一絕緣塊的複數第一導電端子。前述第一導電端子包括對接部以及連接部。前述第一導電端子的對接部暴露於前述延伸板。前述本體還包括沿著前述對接方向進一步凸出前述延伸板的定位板。前述舌板配置為插入對接連接器的對接插槽中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a body and a first terminal module. The body includes a main body portion and an extension plate, with the main body portion provided with a first mounting slot. The first terminal module includes a first terminal assembly. The first terminal assembly comprises a first insulating block and a plurality of first conductive terminals disposed on the first insulating block. The first conductive terminals include a mating portion and a connection portion. The mating portions of the first conductive terminals are exposed on the extension plate. The body further includes a positioning plate that protrudes further along the mating direction beyond the extension plate. The tongue plate is configured to be inserted into a mating slot of a mating connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1711:第一端部</p>
        <p type="p">1711a:上表面</p>
        <p type="p">1712:第一插入部</p>
        <p type="p">181:第一導電安裝塊</p>
        <p type="p">1810:第一基部</p>
        <p type="p">1810a:第一凹限槽</p>
        <p type="p">1810d:第一外表面</p>
        <p type="p">1810e:第二外表面</p>
        <p type="p">1810g:第三外表面</p>
        <p type="p">1811:第一凸出部</p>
        <p type="p">1817:第一延伸部</p>
        <p type="p">51:第一線纜</p>
        <p type="p">515:第一屏蔽層</p>
        <p type="p">61:第一接地片</p>
        <p type="p">610:第一隆起部</p>
        <p type="p">6101:第二抵接凸肋</p>
        <p type="p">611:第一抵接部</p>
        <p type="p">612:第二抵接部</p>
        <p type="p">D:圖16中畫框部分</p>
        <p type="p">S1:第一訊號端子</p>
        <p type="p">S2:第二訊號端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2493" publication-number="202633374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高溫爐管</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260428B">H10P72/70</main-classification>
        <further-classification edition="200601120260428B">F27D1/18</further-classification>
        <further-classification edition="202601120260428B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商盛美半導體設備韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH KOREA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商清芯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEANCHIP TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂策</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, CE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周冬成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, DONGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宗煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴載成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈社娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, SHENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泳律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種高溫爐管，包括：工藝管，工藝管的頂端設置有頂蓋，頂蓋上設置有通孔；供氣管，與工藝管頂蓋上的通孔連通，工藝氣體通過供氣管和工藝管頂蓋上的通孔通入工藝管內部；晶舟，設置於工藝管內部，包括支撐架和支撐平板，支撐平板沿支撐架的長度方向分佈有多層，用於支撐多片基板，每片基板放置於每層支撐平板上，每層支撐平板托住每片基板的整個底部。本發明通過設置多層支撐平板，且每層支撐平板托住每片基板的整個底部，避免了基板在1200℃以上的高溫工藝下發生向下變形而導致基板內晶格缺陷的產生，提升了晶片的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工藝管</p>
        <p type="p">101:頂蓋</p>
        <p type="p">2:供氣管</p>
        <p type="p">3:晶舟</p>
        <p type="p">4:外界氣管</p>
        <p type="p">5:襯管</p>
        <p type="p">6:加熱組件</p>
        <p type="p">
        &lt;i&gt;W&lt;/i&gt;:矽基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2494" publication-number="202632621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115630</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肌肉塊及包含肌肉塊之注射訓練器</chinese-title>
        <english-title>MUSCLE BLOCKS AND INJECTION TRAINERS INCLUDING A MUSCLE BLOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">G09B23/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商里珍納龍藥品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷佛拉堤　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAFOLLETTE, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種注射訓練器，可包括肌肉塊、表面層以及肌肉塊與表面層之間的中間層。肌肉塊可包括一個或多個區域，所述區域包括由重複的單位單元所限定的填充材料之排列。肌肉塊可提供足夠的反壓以致動注射器。表面層及／或中間層可提供使用者在注射過程中可捏合的逼真感之組織。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:注射訓練器</p>
        <p type="p">120:中間層</p>
        <p type="p">130:表面層</p>
        <p type="p">150:槽</p>
        <p type="p">200:肌肉塊</p>
        <p type="p">225:填充材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2495" publication-number="202633502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置、基板單元及基板單元之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W74/00</main-classification>
        <further-classification edition="202601120260427B">H10W72/20</further-classification>
        <further-classification edition="202601120260427B">H10W74/01</further-classification>
        <further-classification edition="202601120260427B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本篤志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野島誠樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOJIMA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山雄二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河原清治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤雅宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施型態係提供可以謀求抑制發生故障的半導體裝置、基板單元及半導體裝置之製造方法。  &lt;br/&gt;　　一實施型態之半導體裝置具備基板、電子零件、複數接合部和第1金屬部。上述基板具有第1面、位於與上述第1面相反側的第2面，和跨越上述第1面之第1邊緣和上述第2面之第2邊緣的第1側面。上述電子零件被安裝於上述第2面。上述複數接合部係被設置在上述第1面，包含第1接合部。上述第1金屬部包含沿著上述第1面而延伸的第1部分，和沿著上述第1側面而延伸的第2部分。上述第1金屬部係從作為上述基板之厚度方向的第1方向觀看之情況的面積大於上述第1接合部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板單元</p>
        <p type="p">10:基板</p>
        <p type="p">10a:第1面</p>
        <p type="p">10b:第2面</p>
        <p type="p">11:絕緣基材</p>
        <p type="p">12:導電圖案</p>
        <p type="p">21:焊墊</p>
        <p type="p">22:焊墊</p>
        <p type="p">23:導電線</p>
        <p type="p">24:導電層</p>
        <p type="p">22a:第1部分</p>
        <p type="p">22b:第2部分</p>
        <p type="p">30:半導體裝置</p>
        <p type="p">31:封裝基板</p>
        <p type="p">31a:第1面</p>
        <p type="p">31b:第2面</p>
        <p type="p">31ca:第1側面</p>
        <p type="p">31cb:第2側面</p>
        <p type="p">34:密封構件</p>
        <p type="p">35:焊球</p>
        <p type="p">36:金屬部</p>
        <p type="p">36A:第1金屬部</p>
        <p type="p">36B:第2金屬部</p>
        <p type="p">61:第1水平部</p>
        <p type="p">62:豎起部</p>
        <p type="p">70:焊料填角</p>
        <p type="p">71:第1部分</p>
        <p type="p">72:第2部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2496" publication-number="202631181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用ＧＩＰ／ＧＬＰ１共促效劑之療法</chinese-title>
        <english-title>METHODS OF USING A GIP/GLP1 CO-AGONIST FOR THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">A61K38/26</main-classification>
        <further-classification edition="200601120260429B">A61P9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥普特　阿謝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAUPT, AXEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　梅莉莎　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, MELISSA KAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班森　查爾斯　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENSON, CHARLES T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏瓦　史維塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URVA, SHWETA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藉由投與泰帕肽(tirzepatide)或其醫藥學上可接受之鹽來增強有需要患者之血糖控制的方法。本發明提供一種藉由投與泰帕肽或其醫藥學上可接受之鹽來改善有需要患者之體重管理的方法。另外提供一種用於治療選自動脈粥樣硬化、慢性腎病、NAFLD及NASH之病狀的方法。另外提供一種預防糖尿病或誘導糖尿病緩解的方法，包含投與泰帕肽或其醫藥學上可接受之鹽。另外提供一種用於增強血糖控制、改善體重管理和/或治療血脂異常的給藥方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for increasing glycemic control in a patient in need thereof, by administering tirzepatide, or a pharmaceutically acceptable salt thereof. The present invention provides a method for improving weight management in a patient in need thereof, by administering tirzepatide, or a pharmaceutically acceptable salt thereof. Further providing a method for treating a condition selected from atherosclerosis, chronic kidney disease, NAFLD, and NASH. Further provided is a method to prevent or induce remission of diabetes comprising administration of tirzepatide, or a pharmaceutically acceptable salt thereof. Further provided is a dosing regimen for increasing glycemic control, improving weight management, and/or treating dyslipidemia.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2497" publication-number="202631388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層薄膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260427B">B32B27/00</main-classification>
        <further-classification edition="201801120260427B">C09J7/38</further-classification>
        <further-classification edition="200601120260427B">C09J133/14</further-classification>
        <further-classification edition="200601120260427B">C09J183/07</further-classification>
        <further-classification edition="202601120260427B">H10P54/00</further-classification>
        <further-classification edition="202601120260427B">H10W72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智元氣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖田奈津子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKITA, NATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野呂弘司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可在半導體裝置之製造過程中提升作業效率之積層薄膜。&lt;br/&gt;  本發明積層薄膜1之特徵在於：其係依序積層有第1分離件、第1黏著劑層、基材、第2黏著劑層及第2分離件者；前述第1黏著劑層係由低黏著性黏著劑層構成，且前述第2黏著劑層係由剝離性黏著劑層構成；前述第1分離件對前述第1黏著劑層之180°剝開剝離力F(1)、前述第2分離件對前述第2黏著劑層之180°剝開剝離力F(2)、前述第2黏著劑層對玻璃板之180°剝開黏著力P(2)、及前述第2黏著劑層在160℃下經過5分鐘後對玻璃板之180°剝開黏著力P’(2)(N/50mm)滿足下述式之關係。&lt;br/&gt;  F(2)≦F(1)&lt;br/&gt;  P(2)≧F(1)&lt;br/&gt;  P’(2)/P(2)＜1.20&lt;br/&gt;  P’(2)＜1.00</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:積層薄膜</p>
        <p type="p">10:基材</p>
        <p type="p">11:第1黏著劑層</p>
        <p type="p">12:第2黏著劑層</p>
        <p type="p">110:第1分離件</p>
        <p type="p">120:第2分離件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2498" publication-number="202633478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115794</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成微電子結構的方法</chinese-title>
        <english-title>METHOD OF FORMING A MICROELECTRONIC STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260427B">H10W70/655</main-classification>
        <further-classification edition="202601120260427B">H10W70/08</further-classification>
        <further-classification edition="202601120260427B">H10W70/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示扇出封裝之各種具體實例。揭示一種形成一微電子組件之方法。該方法可包括在無介入黏著劑之情況下使用一直接接合技術將至少一個微電子基板之一第一表面接合至一載體的一表面，該微電子基板在該微電子基板之至少一個表面上具有複數個導電互連件。該方法可包括將一模製材料塗覆至該微電子基板周圍之該載體之該表面的一區域，以形成一重組基板。該方法可包括處理該微電子基板。該方法可包括使該載體之該表面之該區域處及該模製材料處的該重組基板單一化，以形成該微電子組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of fanout packages are disclosed. A method of forming a microelectronic assembly is disclosed. The method can include bonding a first surface of at least one microelectronic substrate to a surface of a carrier using a direct bonding technique without an intervening adhesive, the microelectronic substrate having a plurality of conductive interconnections on at least one surface of the microelectronic substrate. The method can include applying a molding material to an area of the surface of the carrier surrounding the microelectronic substrate to form a reconstituted substrate. The method can include processing the microelectronic substrate. The method can include singulating the reconstituted substrate at the area of the surface of the carrier and at the molding material to form the microelectronic assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:微電子組件</p>
        <p type="p">2:載體</p>
        <p type="p">3:元件</p>
        <p type="p">4:前表面</p>
        <p type="p">5:背表面</p>
        <p type="p">6:模製化合物</p>
        <p type="p">7:側表面</p>
        <p type="p">10:重新分佈層</p>
        <p type="p">17:單一化側表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2499" publication-number="202631182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含ＧＬＰ－１、ＧＩＰ及澱粉素受體之三重促效劑的醫藥組成物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS COMPRISING TRI-AGONISTS OF THE GLP-1, GIP, AND AMYLIN RECEPTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">A61K38/26</main-classification>
        <further-classification edition="200601120260504B">A61K9/08</further-classification>
        <further-classification edition="200601120260504B">A61K9/20</further-classification>
        <further-classification edition="200601120260504B">A61K47/18</further-classification>
        <further-classification edition="200601120260504B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVO NORDISK A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯斯　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUSE, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞　賈斯佩　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, JESPER F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芙烈奇　卡米拉　卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRICH, CAMILLA KAAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥德森　夏洛特　斯塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, CHARLOTTE STAHL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈克維格　克里斯緹娜　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAXVIG, CHRISTINA SOPHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班倫斯　卡爾森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEHRENS, CARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種GLP-1-/GIP-/澱粉素受體三重促效劑。此GLP-1-/GIP-/澱粉素受體三重促效劑可具有改善的藥物動力學性質，且可適合每週投予一次。本發明亦有關包含此種GLP-1-/GIP-/澱粉素受體三重促效劑之醫藥組成物。該三重促效劑及包含其之醫藥組成物可用作藥劑，以治療患有超重、肥胖及相關合併症之個體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a GLP-1-/GIP-/amylin-receptor tri-agonist. This GLP-1-/GIP-/amylin-receptor tri-agonist may have improved pharmacokinetic properties and may be suitable for once weekly administration. The invention also relates to pharmaceutical compositions comprising such a GLP-1-/GIP-/amylin-receptor tri-agonist. The tri-agonist and pharmaceutical compositions comprising it may be used as a medicament for the treatment of subjects with overweight, obesity and associated co-morbidity.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2500" publication-number="202632320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯薄膜及使用其之影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260430B">G02B1/111</main-classification>
        <further-classification edition="200601120260430B">G02B5/30</further-classification>
        <further-classification edition="201901120260430B">B32B7/035</further-classification>
        <further-classification edition="200601120260430B">B32B27/36</further-classification>
        <further-classification edition="200601120260430B">G02F1/1335</further-classification>
        <further-classification edition="200601120260430B">G09F9/30</further-classification>
        <further-classification edition="200601120260430B">G06F3/041</further-classification>
        <further-classification edition="201301120260430B">G11B7/2535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴野博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBANO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻垣潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西尾正太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIO, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合究</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, KIWAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種聚酯薄膜，其具有高的面內遲滯，並且厚度均勻性優異，生產性、作業性及平面性良好。&lt;br/&gt;  揭示一種聚酯薄膜，其面內遲滯為3000nm以上30000nm以下、面配向度為0.128以上0.155以下，製膜流動方向之厚度不均為8%以下(此外，厚度不均為以(最大厚度-最小厚度)/平均厚度×100(%)所求出的值)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2501" publication-number="202631371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯薄膜及使用其之影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">B29D7/01</main-classification>
        <further-classification edition="200601120260430B">B29C55/02</further-classification>
        <further-classification edition="200601120260430B">C08J5/18</further-classification>
        <further-classification edition="200601120260430B">B32B27/36</further-classification>
        <further-classification edition="200601120260430B">G02B5/30</further-classification>
        <further-classification edition="200601120260430B">G02F1/1335</further-classification>
        <further-classification edition="200601120260430B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴野博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBANO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻垣潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西尾正太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIO, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合究</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, KIWAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種聚酯薄膜，其具有高的面內遲滯，並且厚度均勻性優異，生產性、作業性及平面性良好。&lt;br/&gt;  揭示一種聚酯薄膜，其面內遲滯為3000nm以上30000nm以下、面配向度為0.128以上0.155以下，製膜流動方向之厚度不均為8%以下(此外，厚度不均為以(最大厚度-最小厚度)/平均厚度×100(%)所求出的值)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2502" publication-number="202632951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>編碼裝置、解碼裝置及非暫時性電腦可讀取之媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260429B">H04N19/137</main-classification>
        <further-classification edition="201401120260429B">H04N19/513</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　宗順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHONG SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏西達　史寇敘　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHASHIDHAR, SUGHOSH PAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖如伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, RU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　海威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　漢文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEO, HAN BOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">編碼裝置具備：電路；及連接於電路的記憶體，電路在動作中，從複數個表格來選擇第1表格，其中前述複數個表格是為了以藉由索引指定的補正值將成為基準的移動向量補正至預定的方向而使用，且前述索引之間各自具有間隔不同的補正值，前述第1表格使用在前述動態圖像中的圖像之編碼對象的分區，又，寫入表示在第1表格所具有的索引之中選擇的第1索引之參數，並且使用已利用藉由第1索引所指定的補正值進行補正的成為基準的移動向量，將分區編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S311,S312,S313:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2503" publication-number="202633082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202633082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115859</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置、記憶體系統及形成記憶體裝置的方法</chinese-title>
        <english-title>MEMORY DEVICE, MEMORY SYSTEM AND METHOD FOR FORMING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260429B">H10B43/00</main-classification>
        <further-classification edition="202301120260429B">H10B99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, ZHI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　文犀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, WEN-XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍宗亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUO, ZONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括在基板之上的堆疊結構、在堆疊結構中延伸的通道結構、以及在通道結構之上的介電質層。介電質層包括第一材料。記憶體裝置還可以包括延伸穿過介電質層的汲極選擇閘（DSG）切口結構。DSG切口結構的材料包括不同於第一材料的第二材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a stack structure over a substrate, a channel structure extending in the stack structure, and a dielectric layer over the channel structure. The dielectric layer includes a first material. The memory device may also include a drain selection gate (DSG) cut structure extending through the dielectric layer. A material of the DSG cut structure includes a second material different from the first material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">102:縫隙結構</p>
        <p type="p">106:DSG切口結構</p>
        <p type="p">108:通道結構</p>
        <p type="p">110:基板</p>
        <p type="p">112:觸點</p>
        <p type="p">114:介電質層</p>
        <p type="p">116:DSG線</p>
        <p type="p">118:堆疊介電質層</p>
        <p type="p">120:控制閘極線</p>
        <p type="p">130:堆疊結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2504" publication-number="202632045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115115884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於奈米結晶鑽石膜沉積之原位成核</chinese-title>
        <english-title>IN SITU NUCLEATION FOR NANOCRYSTALLINE DIAMOND FILM DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">C23C16/27</main-classification>
        <further-classification edition="200601120260428B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　思潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SZE CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙慕葛南森　維寧許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHMUGANATHAN, VICKNESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡卡塔蘇巴拉馬尼恩　艾斯華倫納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATASUBRAMANIAN, ESWARANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALLIK, ABHIJIT BASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇迪喬諾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDIJONO, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述沉積奈米結晶鑽石膜的方法。該方法可用於積體電路的製造。多種方法包括：用溫和電漿處理基板以形成經處理的基板表面；用富含碳的弱電漿培養該經處理的基板，以在該經處理的基板表面上使鑽石顆粒成核；然後，用強電漿處理該基板以形成奈米結晶鑽石膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of depositing a nanocrystalline diamond film are described. The method may be used in the manufacture of integrated circuits. Methods include treating a substrate with a mild plasma to form a treated substrate surface, incubating the treated substrate with a carbon-rich weak plasma to nucleate diamond particles on the treated substrate surface, followed by treating the substrate with a strong plasma to form a nanocrystalline diamond film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">12~16:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2505" publication-number="202631457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙層容器及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B65D1/02</main-classification>
        <further-classification edition="200601120260504B">B65D51/24</further-classification>
        <further-classification edition="200601120260504B">B29C45/14</further-classification>
        <further-classification edition="200601120260504B">B29C45/26</further-classification>
        <further-classification edition="200601120260504B">B29C49/06</further-classification>
        <further-classification edition="200601120260504B">B29C49/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商京洛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYORAKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉橋雄飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAHASHI, YUHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樽野真輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARUNO, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種外觀優異的收容容器。&lt;br/&gt;  根據本發明提供一種收容容器，其具備以覆蓋內容器外周面的方式與外套一體成形的容器主體，所述外套是注塑成形，所述內容器具備最外層、與所述最外層鄰接的鄰接層，構成所述最外層的最外層樹脂的融點比構成所述鄰接層的鄰接層樹脂的融點低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">104:內容器</p>
        <p type="p">104c1:最外層</p>
        <p type="p">104c2:鄰接層</p>
        <p type="p">104c3:其他層</p>
        <p type="p">105:外套</p>
        <p type="p">105a:筒部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2506" publication-number="202632522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安全外隔離區</chinese-title>
        <english-title>SECURE EXCLAVES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260429B">G06F21/53</main-classification>
        <further-classification edition="201301120260429B">G06F21/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利舍尼斯　彼得　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISHERNESS, PETER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅納赫姆　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENACHEM, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅圖基　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METUKI, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜榮　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIRON, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡佩里斯　Ｄ　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAPELIS, D J</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡什本　胡薩姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHASHIBOUN, HUSAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福爾捷　雅克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTIER, JACQUES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦特斯　肯尼斯　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATERS, KENNETH W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示關於使由一計算裝置所使用的硬體加速器安全的技術。在一些實施例中，計算裝置包括一或多個處理器，其經組態以以一隔離方式共同執行可信任程序及不可信任程序，該隔離方式包括實施一安全環境，在該安全環境中針對該等可信任程序的資料強制一組安全標準。該計算裝置進一步包括多個異質硬體加速器，其經組態以實施該安全環境的外隔離區，該外隔離區延伸該等硬體加速器內的該組安全標準中的一或多者的強制用於分布至用於執行與該等可信任程序相關聯的任務的該等硬體加速器之資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques are disclosed relating to securing hardware accelerators used by a computing device. In some embodiments, a computing device includes one or more processors configured to co-execute trusted processes and untrusted processes in an isolated manner that includes implementing a secure environment in which a set of security criteria is enforced for data of the trusted processes. The computing device further includes multiple heterogenous hardware accelerators configured to implement exclaves of the secure environment that extend enforcement of one or more of the set of security criteria within the hardware accelerators for data distributed to the hardware accelerators for performance of tasks associated with the trusted processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:計算裝置</p>
        <p type="p">102:架構</p>
        <p type="p">110:處理器</p>
        <p type="p">112A:可信任程序</p>
        <p type="p">112B:不可信任程序</p>
        <p type="p">120:記憶體</p>
        <p type="p">122A:可信任程序資料</p>
        <p type="p">122B:不可信任程序資料</p>
        <p type="p">130:異質硬體加速器</p>
        <p type="p">132,132A,132B,132C,132D,132E:外隔離區</p>
        <p type="p">140:顯示單元</p>
        <p type="p">150:影像信號處理器(ISP)</p>
        <p type="p">160:音訊單元</p>
        <p type="p">170:神經引擎</p>
        <p type="p">180:圖形單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2507" publication-number="202632971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於路由光訊號之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR ROUTING OPTICAL SIGNALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260429B">H04Q11/00</main-classification>
        <further-classification edition="201301120260429B">H04B10/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＯＡＭ光電有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OAM PHOTONICS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　錦為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KAM WAI CLIFFORD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　頌琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, CHUNG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種光路由電路(ORC)，其可用於將一輸入光訊號路由至該ORC之一或多個光輸出通道。該ORC包括用於執行光訊號路由之任務之一節點網路。該等節點可由一節點控制系統透過電節點控制通道控制。該ORC可藉由在該ORC之節點之一子集之間共用一電節點控制通道來簡化該等節點與該節點控制系統之間的電介面。該ORC之節點可在該等節點之間傳輸電訊號。本發明亦描述一種可用於構造該ORC之節點及一種路由一光訊號之方法。本發明能夠實際地實施具有諸多節點之一大ORC。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes an optical routing circuit (ORC) which may be used to route an input optical signal to one or more optical output channels of the ORC. The ORC comprises a network of nodes for carrying out the task of optical signal routing. The nodes may be controlled by a node control system through electrical node control channels. The ORC may simplify the electrical interface between the nodes and the node control system by sharing an electrical node control channel among a subset of nodes of the ORC. Nodes of the ORC may transmit electrical signals between the nodes. The present disclosure also describes a node which may be used to construct the ORC and a method of routing an optical signal. The present disclosure may enable a large ORC with many nodes to be practically implemented.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:光子網路電路</p>
        <p type="p">201:節點</p>
        <p type="p">202:節點</p>
        <p type="p">203:節點</p>
        <p type="p">204:節點</p>
        <p type="p">205:節點</p>
        <p type="p">206:節點</p>
        <p type="p">207:節點</p>
        <p type="p">208:節點</p>
        <p type="p">209:節點</p>
        <p type="p">210:節點</p>
        <p type="p">211:節點</p>
        <p type="p">212:節點</p>
        <p type="p">213:節點</p>
        <p type="p">214:節點</p>
        <p type="p">215:節點</p>
        <p type="p">221:光訊號</p>
        <p type="p">222:光訊號</p>
        <p type="p">223:光訊號</p>
        <p type="p">224:光訊號</p>
        <p type="p">225:光訊號</p>
        <p type="p">231:光訊號通道</p>
        <p type="p">232:光訊號通道</p>
        <p type="p">233:光訊號通道</p>
        <p type="p">234:光訊號通道</p>
        <p type="p">235:光訊號通道</p>
        <p type="p">236:光訊號通道</p>
        <p type="p">237:光訊號通道</p>
        <p type="p">238:光訊號通道</p>
        <p type="p">239:光訊號通道</p>
        <p type="p">240:光訊號通道</p>
        <p type="p">241:光訊號通道</p>
        <p type="p">242:光訊號通道</p>
        <p type="p">243:光訊號通道</p>
        <p type="p">244:光訊號通道</p>
        <p type="p">245:光訊號通道</p>
        <p type="p">246:光訊號通道</p>
        <p type="p">271:電節點控制通道</p>
        <p type="p">272:電節點控制通道</p>
        <p type="p">273:電節點控制通道</p>
        <p type="p">274:電節點控制通道</p>
        <p type="p">275:電節點控制通道</p>
        <p type="p">276:電節點控制通道</p>
        <p type="p">277:電節點控制通道</p>
        <p type="p">280:節點控制系統</p>
        <p type="p">281:節點控制</p>
        <p type="p">282:節點控制</p>
        <p type="p">283:節點控制</p>
        <p type="p">284:節點控制</p>
        <p type="p">290:光路由電路(ORC)控制器</p>
        <p type="p">291:電ORC控制通道</p>
        <p type="p">299:ORC</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2508" publication-number="202631402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體噴出裝置、液體噴出裝置的控制方法、基板處理裝置及物品製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">B41J2/045</main-classification>
        <further-classification edition="200601120260428B">B41J2/055</further-classification>
        <further-classification edition="200601120260428B">B41J2/175</further-classification>
        <further-classification edition="200601120260428B">B41J2/165</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種有利於減少噴出不良噴嘴的恢復處理所需的時間和液體使用量的技術。液體噴出裝置具備：噴出元件，噴出液體；驅動器，驅動前述噴出元件；以及控制部，控制前述驅動器。前述驅動器構成為，準備多種具有按預定長度的時間區段頻率階段性地變低的脈衝型態的資料組。在此，在前述多種資料組之間，脈衝型態的頻率相互不同。前述控制部控制前述驅動器，以將前述多種資料組中的每一個從脈衝型態的最高頻率高的資料組起依次向前述噴出元件供給而進行預備噴出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2509" publication-number="202632955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解碼裝置及編碼裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260429B">H04N19/587</main-classification>
        <further-classification edition="201401120260429B">H04N19/159</further-classification>
        <further-classification edition="201401120260429B">H04N19/109</further-classification>
        <further-classification edition="201401120260429B">H04N19/186</further-classification>
        <further-classification edition="201401120260429B">H04N19/513</further-classification>
        <further-classification edition="201401120260429B">H04N19/537</further-classification>
        <further-classification edition="201401120260429B">H04N19/583</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANOH, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">解碼裝置具備記憶體及可存取記憶體的電路，電路構成為：對於目前區塊，決定是否適用第1處理及是否適用第2處理，以決定對目前區塊不適用第1處理及第2處理之至少一者，第1處理為參考亮度之空間梯度的雙向光流處理，在第1狀態下，決定適用第1處理且不適用第2處理，基於複數張參考圖片來生成目前區塊的複數張預測圖像，並且基於複數張預測圖像與亮度之空間梯度來生成最終預測圖像，在第2狀態下，決定不適用第1處理且適用第2處理，基於複數張參考圖片來生成目前區塊的複數張預測圖像，並且藉由對複數張預測圖像進行加權，來生成最終預測圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S501,S502:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2510" publication-number="202632438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位置檢測方法、位置檢測系統、及曝光裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260428B">G03F7/20</main-classification>
        <further-classification edition="200601120260428B">G03F9/00</further-classification>
        <further-classification edition="202301120260428B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢島海都</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAJIMA, KAITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">位置檢測方法，包含：藉由照明光學系統朝向形成於物體上且在與前述物體之表面正交之方向具有高度之位置檢測用標記照明檢測光；藉由成像光學系統將來自形成有前述位置檢測用標記之區域之光聚光並形成與前述位置檢測用標記對應之像；藉由攝影部拍攝與前述位置檢測用標記對應之像；以及根據來自前述攝影部之拍攝訊號而檢測前述物體之位置；且包含：在將由前述照明光學系統之數值孔徑與前述成像光學系統之數值孔徑之比決定之照明σ值設為0.7以下之狀態下，將保持前述物體並進行移動之保持裝置於與前述物體之表面交叉之方向驅動，而在與前述位置檢測用標記對應之像在離焦（defocus）之狀態下被拍攝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2511" publication-number="202631007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>載具及旅行裝置</chinese-title>
        <english-title>CARRIER AND TRAVEL APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">A01K1/02</main-classification>
        <further-classification edition="200601120260430B">B60N2/28</further-classification>
        <further-classification edition="200601120260430B">B62B3/02</further-classification>
        <further-classification edition="200601120260430B">A47D13/02</further-classification>
        <further-classification edition="200601120260430B">B62B9/10</further-classification>
        <further-classification edition="200601120260430B">B62B9/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商居佳國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUILU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種載具及旅行裝置。載具包括：箱體部分；頂棚部分，所述頂棚部分通過多個連接增強件與所述箱體部分可拆卸地連接，用於將所述頂棚部分固定至所述箱體部分；其中，所述連接增強件的第一端部與所述頂棚部分連接或所述連接增強件與所述頂棚部分形成一體式結構，所述連接增強件具有從所述頂棚部分伸出的第二端部，所述連接增強件的第二端部可拆卸地連接至所述箱體部分；或者，所述連接增強件包括第一連接件和第二連接件，所述第一連接件與所述頂棚部分連接，所述第二連接件與所述箱體部分連接，所述第一連接件和所述第二連接件可拆卸地連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:載具</p>
        <p type="p">110:箱體部</p>
        <p type="p">110A:上周邊</p>
        <p type="p">115:座套</p>
        <p type="p">120:頂棚部分</p>
        <p type="p">120A:下周邊</p>
        <p type="p">121:第一蓋</p>
        <p type="p">122:第二蓋</p>
        <p type="p">123:第一連接部件</p>
        <p type="p">124:第二連接部件</p>
        <p type="p">125:連接增強件</p>
        <p type="p">125A:端部</p>
        <p type="p">130:提手</p>
        <p type="p">140:支架組件</p>
        <p type="p">A:箭頭，縱向</p>
        <p type="p">B:箭頭，方向，橫向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2512" publication-number="202632076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分隔件及電解裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260430B">C25B1/04</main-classification>
        <further-classification edition="200601120260430B">C25B13/02</further-classification>
        <further-classification edition="202101120260430B">C25B9/17</further-classification>
        <further-classification edition="202101120260430B">C25B9/19</further-classification>
        <further-classification edition="202601120260430B">C01B3/02</further-classification>
        <further-classification edition="202101120260430B">H01M50/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦下靖崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URASHITA, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸髙心平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODAKA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堂本和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMOTO, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弦卷茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUMAKI, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向井大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祐延貴洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUKENOBU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的分隔件，是用於電解裝置的分隔件，係具備:分隔件本體，是具有第一面與第二面；第一供給孔與第一排出孔，是形成於第一面中分隔件本體的一條對角線上，並貫通分隔件本體；多個第一溝部，是形成在第一供給孔與第一排出孔之間的區域；梯形的第一擴散流路，是分佈在第一供給孔至第一溝部之間，並且寬度方向之尺寸隨著從第一供給孔往第一溝部而逐漸擴大；梯形的第一收斂流路，是分佈在第一溝部至第一排出孔之間，並且寬度方向之尺寸隨著從第一溝部往第一排出孔而逐漸縮小；第一擴散導引部，是設置在第一擴散流路內，將流體從第一供給孔導引至第一溝部；以及第一收斂導引部，是設置在第一收斂流路內，將流體從第一溝部導引至第一排出孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:分隔件</p>
        <p type="p">201:分隔件本體</p>
        <p type="p">201a:第一面</p>
        <p type="p">201b:第二面</p>
        <p type="p">202:第一排出孔</p>
        <p type="p">203:第一供給孔</p>
        <p type="p">204:第一溝部</p>
        <p type="p">205:第一收斂流路</p>
        <p type="p">205a:第一邊部</p>
        <p type="p">205b:第二邊部</p>
        <p type="p">205c:斜邊</p>
        <p type="p">206:第一擴散流路</p>
        <p type="p">206a:第一邊部</p>
        <p type="p">206b:第二邊部</p>
        <p type="p">206c:斜邊</p>
        <p type="p">207:第一收斂導引部</p>
        <p type="p">208:第一擴散導引部</p>
        <p type="p">209:直線區間</p>
        <p type="p">210:第二排出孔</p>
        <p type="p">211:第二供給孔</p>
        <p type="p">V:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2513" publication-number="202631247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>層狀微孔膜產品及相關方法</chinese-title>
        <english-title>LAYERED MICROPOROUS MEMBRANE PRODUCTS AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260504B">B01D69/12</main-classification>
        <further-classification edition="200601120260504B">B01D71/26</further-classification>
        <further-classification edition="200601120260504B">B01D63/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾赫德　馬赫什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARKHEDE, MAHESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡揚尼　維奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALYANI, VINAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述了含有在膜之區域之一部分處結合在一起之兩個或更多個膜層的多孔膜產品、用於製備該等多孔膜產品之方法及系統，以及使用該等多孔膜產品之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are porous membrane products that contain two or more membrane layers bonded together at a portion of the area of the membranes, methods and system for preparing the porous membrane products, and methods of using the porous membrane products.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:超音波焊接設備</p>
        <p type="p">110:滾砧</p>
        <p type="p">112:滾動圓柱形表面</p>
        <p type="p">114:增高延伸部</p>
        <p type="p">116:間隙</p>
        <p type="p">118:焊接表面</p>
        <p type="p">120:角狀物</p>
        <p type="p">122:結合區域</p>
        <p type="p">124:層狀膜</p>
        <p type="p">130:微孔膜</p>
        <p type="p">140:微孔膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2514" publication-number="202632685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線纜及其製造方法</chinese-title>
        <english-title>CABLE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">H01B11/06</main-classification>
        <further-classification edition="200601120260430B">H01B7/02</further-classification>
        <further-classification edition="200601120260430B">H01B11/00</further-classification>
        <further-classification edition="200601120260430B">H01B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格蘭特　查爾斯勞埃德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANT, CHARLES LLOYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴進昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, JINCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡本濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, BENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晏歡忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, HUANZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾瓦克　安德魯約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOWAK, ANDREW JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　毅森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSEN, HENNING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線纜包括第一芯體、第二芯體、第一絕緣層、第二絕緣層、屏蔽層以及第一接地層。前述第一絕緣層沿周向至少部分包裹在前述第一芯體上。前述第二絕緣層沿周向至少部分包裹在前述第二芯體上。前述屏蔽層位於前述第一絕緣層和前述第二絕緣層的外層。前述第一接地層呈扁平狀，前述第一接地層位於前述屏蔽層的外層。前述第一接地層與前述屏蔽層分體設置且相互接觸。本發明改善了前述線纜的接地屏蔽性能。本發明還揭示了一種前述線纜的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable includes a first core, a second core, a first insulating layer, a second insulating layer, a shielding layer and a first grounding layer. The first insulating layer at least partially wraps around the first core in a circumferential direction. The second insulating layer at least partially wraps around the second core in the circumferential direction. The shielding layer is located on an outer side of the first insulating layer and the second insulating layer. The first grounding layer is flat. The first grounding layer is located on an outer side of the shielding layer. The first grounding layer and the shielding layer are separately arranged and in contact with each other. The present invention improves the ground shielding performance of the cable. The present invention also discloses a method of manufacturing the cable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:第一線纜</p>
        <p type="p">211:第一芯體</p>
        <p type="p">212:第二芯體</p>
        <p type="p">213:第一絕緣層</p>
        <p type="p">214:第二絕緣層</p>
        <p type="p">215:第一接地層</p>
        <p type="p">217:第三絕緣層</p>
        <p type="p">218:中間層</p>
        <p type="p">219:屏蔽層</p>
        <p type="p">25:重疊區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2515" publication-number="202632833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202632833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒸發器裝置及其操作方法</chinese-title>
        <english-title>VAPORIZER DEVICE AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260430B">H02J7/00</main-classification>
        <further-classification edition="200601120260430B">H05B1/02</further-classification>
        <further-classification edition="202001120260430B">A24F47/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商尤爾實驗室有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUUL LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　休</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, HUGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費雪　喬瑟夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER, JOSEPH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫非　安德魯　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, ANDREW LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈頓　尼可拉斯　傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTON, NICHOLAS JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法藍汀　法爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALENTINE, VAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種系統，其包括一電流源電路、一系統電力輸入及負載開關電路，該負載開關電路將該電流源電路及該系統電力輸入耦接至一輸出，該輸出經組態以耦接至一蒸發器加熱元件。該電流源電路、該系統電力輸入及該負載開關電路形成一積體電路之部分。亦描述相關設備、系統、技術及物品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a current source circuit; a system power input; and load switching circuitry coupling the current source circuit and the system power input to an output configured to couple to a vaporizer heating element. The current source circuit, the system power input, and the load switching circuitry form part of an integrated circuit. Related apparatus, systems, techniques, and articles are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:蒸發器裝置</p>
        <p type="p">101:蒸發器裝置主體</p>
        <p type="p">103:電源</p>
        <p type="p">105:控制器</p>
        <p type="p">107:無線電路</p>
        <p type="p">109:蒸發器裝置主體電觸點</p>
        <p type="p">111:蒸發器裝置主體電觸點</p>
        <p type="p">113:蒸發器裝置主體電觸點</p>
        <p type="p">114:濾芯</p>
        <p type="p">115:輸出</p>
        <p type="p">117:輸入</p>
        <p type="p">118:加熱器</p>
        <p type="p">119:互補濾芯觸點</p>
        <p type="p">120:儲集器</p>
        <p type="p">121:互補濾芯觸點</p>
        <p type="p">123:互補濾芯觸點</p>
        <p type="p">125:記憶體</p>
        <p type="p">133:充電器</p>
        <p type="p">137:感測器</p>
        <p type="p">138:識別器</p>
        <p type="p">144:承嘴件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2516" publication-number="202631532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116392</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無鹼玻璃</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260430B">C03C3/076</main-classification>
        <further-classification edition="200601120260430B">C03C3/087</further-classification>
        <further-classification edition="200601120260430B">C03C3/089</further-classification>
        <further-classification edition="200601120260430B">C03C4/20</further-classification>
        <further-classification edition="200601120260430B">C03B18/02</further-classification>
        <further-classification edition="200601120260430B">G02F1/1333</further-classification>
        <further-classification edition="202601120260430B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徳永博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUNAGA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野和孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種無鹼玻璃，其以氧化物基準之莫耳%表示包含SiO&lt;sub&gt;2&lt;/sub&gt; 63～75%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 10～16%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 超過0.5%且5%以下、MgO 0.1～15%、CaO 0.1～12%、SrO 0～8%、BaO 0～6%，且[MgO]/[CaO]超過1.5，式(A)之值為82.5以上，式(B)之值為690以上800以下，式(C)之值為100以下，式(D)之值為20以下，楊氏模數為83 GPa以上，表面失透黏度η&lt;sub&gt;c&lt;/sub&gt;為10&lt;sup&gt;4.2&lt;/sup&gt; dPa・s以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2517" publication-number="202631662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116444</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗人類免疫缺陷病毒－１抗體、包含其的細胞、核酸、組合物及套組</chinese-title>
        <english-title>ANTI-HUMAN IMMUNODEFICIENCY VIRUS-1 ANTIBODIES, CELLS, NUCLEIC ACIDS, COMPOSITIONS AND KITS COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260504B">C07K16/10</main-classification>
        <further-classification edition="200601120260504B">C12N15/13</further-classification>
        <further-classification edition="200601120260504B">C12N5/10</further-classification>
        <further-classification edition="200601120260504B">G01N33/569</further-classification>
        <further-classification edition="200601120260504B">G01N33/543</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格里佛診斷方法股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFOLS DIAGNOSTIC SOLUTIONS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納西蒙托　伊利莎貝特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASCIMENTO, ELISABETE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾登威特　喬迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELTON WITT, JODY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含輕鏈之抗HIV-1抗體，前述輕鏈包含互補決定區L-CDR1、L-CDR2及L-CDR3，其中L-CDR1之胺基酸序列選自由以下組成之群：SEQ ID NO: 15、SEQ ID NO: 18、SEQ ID NO: 21以及與以下序列中之任一者相差一或兩個取代、缺失或添加的序列：SEQ ID NOs: 15、18或21，L-CDR2之胺基酸序列選自由以下組成之群：SEQ ID NO: 16、SEQ ID NO: 19、SEQ ID NO: 22以及與以下序列中之任一者相差一或兩個取代、缺失或添加的序列：SEQ ID NOs: 16、19或22，且L-CDR3之胺基酸序列選自由以下組成之群：SEQ ID NO: 17、SEQ ID NO: 20、SEQ ID NO: 23以及與以下序列中之任一者相差一或兩個取代、缺失或添加的序列：SEQ ID NOs: 17、20或23。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-HIV-1 antibody comprising a light chain comprising complementary determining regions L-CDR1, L-CDR2 and L-CDR3, wherein the amino acid sequence of L-CDR1 is selected from the group consisting of SEQ ID NO: 15, SEQ ID NO: 18, SEQ ID NO: 21, and a sequence that differs from anyone of SEQ ID NOs: 15, 18, or 21 by one or two substitutions, deletions, or additions, the amino acid sequence of L-CDR2 is selected from the group consisting of SEQ ID NO: 16, SEQ ID NO: 19, SEQ ID NO: 22, and a sequence that differs from anyone of SEQ ID NOs: 16, 19, or 22 by one or two substitutions, deletions, or additions, and the amino acid sequence of L-CDR3 is selected from the group consisting of SEQ ID NO: 17, SEQ ID NO: 20, SEQ ID NO: 23, and a sequence that differs from anyone of SEQ ID NOs: 17, 20, or 23 by one or two substitutions, deletions, or additions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2518" publication-number="202631491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>15</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202631491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115116465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曝光用保護薄膜、保護薄膜組件、曝光原版、曝光裝置及曝光用保護薄膜的製造方法</chinese-title>
        <english-title>PELLICLE FILM FOR EXPOSURE, PELLICLE, EXPOSURE ORIGINAL PLATE, EXPOSURE DEVICE, AND METHOD OF MANUFACTURING PELLICLE FILM FOR EXPOSURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260430B">C01B32/158</main-classification>
        <further-classification edition="201201120260430B">G03F1/62</further-classification>
        <further-classification edition="200601120260430B">G01N21/47</further-classification>
        <further-classification edition="200601120260430B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川比佐子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, HISAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUBO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高村一夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHMURA, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口貴子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤雄一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田健郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種曝光用保護薄膜，包括碳奈米管膜，碳奈米管膜含有碳奈米管，碳奈米管膜於波長13.5 nm下的EUV光的透過率為80%以上，碳奈米管膜的厚度為1 nm以上且50 nm以下，將碳奈米管膜配置於矽基板上，並對所配置的碳奈米管膜使用反射分光膜厚計於下述條件下測定反射率時，反射率的3σ為15%以下。＜條件＞測定點的直徑：20 μm，基準測定波長：波長285 nm，測定點數：121點，鄰接的測定點的中心點間距離：40 μm</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pellicle film for exposure includes a carbon nanotube film, the carbon nanotube film includes carbon nanotubes, the carbon nanotube film has a transmittance of EUV light at a wavelength of 13.5 nm of 80% or higher, the thickness of the carbon nanotube film is from 1 nm to 50 nm, and when the carbon nanotube film is disposed on a silicon substrate and the reflectivity of the disposed carbon nanotube film is measured in accordance with the following conditions using a reflection spectroscopy film thickness gauge, 3σ of the reflectivity is 15% or lower. ＜Conditions＞ Diameter of measurement point: 20 μm; reference measurement wavelength: 285 nm; number of measurement points: 121; distance between center points of adjacent measurement points: 40 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:CNT(碳奈米管)膜</p>
        <p type="p">202:保護薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
</tw-patent-applications>